WO2023097736A1 - 拼接显示屏的制备方法和拼接显示屏 - Google Patents

拼接显示屏的制备方法和拼接显示屏 Download PDF

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Publication number
WO2023097736A1
WO2023097736A1 PCT/CN2021/136736 CN2021136736W WO2023097736A1 WO 2023097736 A1 WO2023097736 A1 WO 2023097736A1 CN 2021136736 W CN2021136736 W CN 2021136736W WO 2023097736 A1 WO2023097736 A1 WO 2023097736A1
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WO
WIPO (PCT)
Prior art keywords
protective film
away
spliced
preparation
display screen
Prior art date
Application number
PCT/CN2021/136736
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English (en)
French (fr)
Inventor
胡小波
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/620,730 priority Critical patent/US20240032367A1/en
Publication of WO2023097736A1 publication Critical patent/WO2023097736A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/1423—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
    • G06F3/1446—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display display composed of modules, e.g. video walls
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/03—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays
    • G09G3/035—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays for flexible display surfaces
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present application relates to the field of display technology, in particular to a method for preparing a spliced display screen and a display screen.
  • LED Light Emitting Diodes
  • Mini LED is also known as sub-millimeter light-emitting diode, its size is usually 80 microns to 200 microns, it is a new generation of LED technology, which has the characteristics of high efficiency, high reliability, high brightness and fast response time of small-pitch LEDs, and consumes Lower power and cost.
  • the embodiment of the present application provides a method for preparing a spliced display screen, the preparation method comprising:
  • a glass substrate and a display panel are provided, the display panel includes a flexible substrate and a display unit sequentially prepared on one side of the glass substrate, the display panel includes a bonding area and a non-bonding area;
  • a second protective film is provided, and a plurality of the first components are spliced on the surface of one side of the second protective film, wherein the second protective film is arranged on the flexible substrate away from the first protective film side.
  • the embodiment of the present application also provides a spliced display screen, the spliced display screen includes:
  • the first protective film is attached on the side of the display panel away from the glass substrate, and after the support glass is provided on the side of the first protective film far away from the flexible substrate, the glass substrate and the flexible The substrate is separated, and the first protective film and the display panel located in the non-bonding area are cut, and the cut first protective film and flexible substrate are defined as the first component, and multiple first components are spliced on the second protective film film, so as to realize the splicing of flexible devices, thereby solving the problem of difficulty in splicing existing flexible devices.
  • FIG. 1 is a schematic flowchart of a method for preparing a spliced display screen provided in an embodiment of the present application
  • Fig. 2 is a schematic structural diagram corresponding to the preparation method shown in Fig. 1;
  • Fig. 3 is a schematic structural diagram of a first component of the spliced display screen provided by the embodiment of the present application;
  • FIG. 4 is a schematic structural diagram of a spliced display screen provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the arrangement of multiple second components on the second protective film.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of said features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • a flexible substrate is often formed on a hard glass substrate first, and then related electronic devices are fabricated on the flexible substrate, and the glass substrate is placed after the related electronic devices are manufactured. Separated from the flexible substrate to form a flexible device based on the flexible substrate.
  • multiple flexible devices need to be spliced together. The splicing of flexible devices is difficult, and the edges are prone to curling, and the seams are also difficult to control.
  • Others first form a flexible substrate on a hard glass substrate, and then manufacture related electronic devices on the flexible substrate. After the related electronic devices are manufactured, a display panel is formed. After splicing multiple display panels, the Remove the glass substrate, however, there are technical problems in using laser lift-off technology to separate the glass substrate and the flexible substrate after splicing.
  • the present application proposes a method for preparing a spliced display screen and a display screen.
  • the present application will be further described below in conjunction with the accompanying drawings and embodiments.
  • FIG. 1 is a schematic flowchart of a method for preparing a spliced display screen provided in an embodiment of the present application
  • FIG. 2 is a schematic structural diagram corresponding to the preparation method shown in FIG. 1 .
  • the embodiment of the present application provides a method for preparing a spliced display screen, and the specific process of the method for preparing a display module is as follows:
  • the display panel includes a flexible substrate and a display unit sequentially prepared on one side of the glass substrate, and the display panel includes a bonding area and a non-bonding area.
  • a glass substrate 20 is provided, and a display panel is prepared on the glass substrate 20 .
  • the display panel includes a flexible substrate 10 and a display unit sequentially prepared on one side of the glass substrate 20 .
  • the material of the flexible substrate 10 is preferably high temperature resistant polyimide (English full name: Polyimide, PI for short) material.
  • the material of the flexible substrate 10 may also include materials such as silicon dioxide, polyester resin, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, or polyurethane.
  • the display unit is mini-LED. In other embodiments, the display unit may further include: one of LED, micro-LED and OLED.
  • the preparation of the display panel also includes: electrically connecting a chip on film 30 (English full name: Chip On Film, COF for short) at one end of each flexible substrate 10; A printed circuit board 40 (English full name: Printed Circuit Board, referred to as PCB).
  • a chip on film 30 English full name: Chip On Film, COF for short
  • a printed circuit board 40 English full name: Printed Circuit Board, referred to as PCB.
  • a first protection film 50 is pasted on the side of the display unit away from the glass substrate 20 , wherein the material of the first protection film 50 is PET. Utilizing PET's good mechanical properties, resistance to oil, fat, dilute acid, dilute alkali, and most solvents, it can better protect the display panel under it. At the same time, the high transparency of PET is used to prevent the light transmission performance of the display panel from being affected.
  • a cutting mark is disposed on the first protective film 50 , and it can be understood that the cutting mark is disposed in the non-bonding area.
  • the support glass 70 is connected to the first protection film 50 through a low adhesive 60 .
  • the supporting glass 70 is mainly used to support the flexible substrate 10 and the display unit after the glass substrate 20 and the flexible substrate 10 are separated, so as to avoid warping of the flexible substrate 10 .
  • the glass substrate 20 is separated from the flexible substrate 10 by means of laser peeling.
  • a laser beam is used to irradiate the display screen to be peeled off, and the laser beam moves relatively to the display screen to be peeled off, thereby separating the glass on the display screen to be peeled off.
  • the substrate 20 and the flexible substrate 10 are separated from each other.
  • FIG. 3 is a schematic structural diagram of a first component 100 of the spliced display screen provided by the embodiment of the present application.
  • the end of the first protective film 50 away from the bonding area, the end of the flexible substrate 10 away from the bonding area, and the end of the supporting glass 70 away from the bonding area are flush with each other.
  • a second protective film is provided, wherein the material of the second protective film is PET.
  • PET Utilizing PET's good mechanical properties, resistance to oil, fat, dilute acid, dilute alkali, and most solvents, it can better protect the display panel under it. At the same time, the high transparency of PET is used to prevent the light transmission performance of the display panel from being affected.
  • a plurality of first components 100 are spliced on the surface of one side of the second protective film 80, for example, one end of the first component 100 away from the chip-on-film 30 in the bonding area is away from the other first component 100.
  • One end of the COF 30 in the bonding area is adjacent to each other. It should be noted that there is a seam between adjacent first components 100, but since the size of the seam and the distance between the pixels are not much different, visually seamless stitching can be achieved, Thereby, the quality of the flexible splicing product is improved.
  • the chip-on-film 30 of the display panels of the two first components 100 in each row is located far away from the display unit that is electrically connected. One end of the seam.
  • the support glass 70 is separated from the first protective film 50 to obtain a spliced flexible mini-LED screen, Visually, there is no seam.
  • the supporting glass 70 on the first protective film 50, before splicing a plurality of flexible substrates 10 on the second protective film 80, the flexible substrate 10 and the glass
  • the substrate 20 is separated, and the presence of the supporting glass 70 can support the flexible substrate 10 and the display unit, thereby avoiding warping after the flexible substrate 10 and the glass substrate 20 are separated.
  • the support substrate and the flexible substrate 10 can be separated, thereby realizing the seamless splicing of multiple flexible substrates 10, and solving the problem of difficulty in splicing existing flexible devices.
  • FIG. 4 is a schematic structural diagram of a spliced display screen provided by an embodiment of the present application.
  • the embodiment of the present application also provides a spliced display screen 1.
  • the spliced display screen 1 includes a second protective film 80 and a plurality of adjacent first components 100 arranged on the second protective film 80, wherein the multiple The first assembly 100 is arranged on the same side of the second protective film 80 to form the second assembly 200.
  • the first assembly 100 includes a stacked display panel and the first protective film 50.
  • the display panel is arranged on the first protective film 50 and the second protective film. Between the protective films 80 , the display panel includes a stacked flexible substrate 10 and a display unit.
  • An end of the first protective film 50 away from the bonding area is flush with an end of the flexible substrate 10 away from the bonding area.
  • Both the first protective film 50 and the second protective film 80 are PET films, which can better protect the display panel under them.
  • each flexible substrate 10 away from the non-bonding area is provided with a chip-on-chip film 30 ; and an end of each chip-on-film 30 away from the flexible substrate 10 is provided with a printed circuit board 40 .
  • the chip-on-chip film 30 of the display panels of the two first components 100 in each row is located at the end of the display unit that is electrically connected to it away from the splicing seam .
  • the chip-on-film 30 of the first component 100 on the left is located at the left end of the display unit to which it is electrically connected
  • the chip-on-film 30 of the first component 100 on the right is located at the right end of the display unit to which it is electrically connected. This ensures that there is no COF 30 at the seam.
  • the printed circuit board 40 of the first assembly 100 on the left is located at the left end of the display unit to which it is electrically connected
  • the printed circuit board 40 of the first assembly 100 on the right is located at the right end of the display unit to which it is electrically connected, thereby ensuring that there is no printed circuit board 40 .
  • the display unit is mini-LED. In other embodiments, the display unit may further include: one of LED, micro-LED and OLED.
  • FIG. 5 is a schematic diagram of the arrangement of multiple second components on the second protective film.
  • a flexible electronic product with a large-size screen can be realized through a plurality of small flexible display panels, which can not only retain the advantages of the flexible display screen, but also realize a large-size screen, and
  • multiple second components are seamlessly spliced on the second protective film, which can improve display quality and bring better experience to customers.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种拼接显示屏的制备方法和拼接显示屏，其中制备方法包括：提供玻璃基板(20)和显示面板，显示面板包括柔性基板(10)和显示单元以及非邦定区；在显示单元远离玻璃基板(20)的一侧依次贴附第一保护膜(50)和支撑玻璃(70)；去除玻璃基板(20)；切割非邦定区的第一保护膜(50)、显示面板和支撑玻璃(70)得到第一组件(100)；将多个第一组件(100)拼接于第二保护膜(80)。

Description

拼接显示屏的制备方法和拼接显示屏 技术领域
本申请涉及显示技术领域，尤其涉及一种拼接显示屏的制备方法和显示屏。
 背景技术
发光二极管(Light Emitting Diodes，LED)是一种能将电能转化为光能的半导体电子元件，因其具有体积小、使用寿命长、颜色丰富多彩、能耗低等特点，被广泛应用于照明、显示屏、信号灯、背光源、玩具等领域。Mini LED又称为次毫米发光二极管，其尺寸通常为80微米～200微米，是新一代的LED技术，承接了小间距LED高效率、高可靠性、高亮度和反应时间快的特性，且耗电量和成本更低。
 技术问题
近年来，柔性电子产品引起全世界的广泛关注并得到了迅速发展。柔性电子产品中在制作大尺寸屏幕时，需要将多个柔性器件拼接起来，但是，现有的柔性器件存在拼接难度大的问题。
 技术解决方案
本申请实施例提供一种拼接显示屏的制备方法，所述制备方法包括:
提供玻璃基板和显示面板，所述显示面板包括依次制备于所述玻璃基板的一侧的表面上的柔性基板以及显示单元，所述显示面板包括邦定区和非邦定区；
在所述显示单元远离所述玻璃基板的一侧贴附第一保护膜；
在所述第一保护膜远离所述柔性基板的一侧设置支撑玻璃；
将所述玻璃基板与所述柔性基板分离；
对位于非邦定区的所述第一保护膜、所述显示面板和所述支撑玻璃进行切割，以得到第一组件；
提供第二保护膜，将多个所述第一组件拼接于所述第二保护膜的一侧的表面上，其中，所述第二保护膜设置于所述柔性基板远离所述第一保护膜的一侧。
本申请实施例还提供一种拼接显示屏，所述拼接显示屏包括：
第二保护膜；
相邻设置的多个第一组件，多个所述第一组件设置在所述第二保护膜的同侧以形成第二组件，所述第一组件包括层叠设置的显示面板和第一保护膜，所述显示面板设置在所述第一保护膜和所述第二保护膜之间，其中，所述显示面板包括层叠设置的柔性基板以及显示单元，所述显示面板包括邦定区和非邦定区。
 有益效果
本申请实施例提供的拼接显示屏的制备方法中在显示面板远离玻璃基板的一侧贴附第一保护膜，在第一保护膜远离柔性基板的一侧设置支撑玻璃后，将玻璃基板和柔性基板分离，并对位于非邦定区的第一保护膜和显示面板进行切割，并将切割后的第一保护膜和柔性基板定义为第一组件，将多个第一组件拼接于第二保护膜上，以此实现柔性器件的拼接，进而解决了现有的柔性器件存在拼接难度大的问题。
 附图说明
图1为本申请实施例提供的拼接显示屏的制备方法的流程示意图；
图2为图1所示的制备方法对应的结构示意图；
图3是本申请实施例提供的拼接显示屏的一个第一组件的结构示意图；
图4为本申请实施例提供的拼接显示屏的结构示意图；
图5为多个第二组件在第二保护膜上的排布示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
柔性电子产品中的至少部分柔性器件在制作过程中，往往在硬质的玻璃基板上先形成柔性基板，然后在柔性基板上制作相关的电子器件，并在相关的电子器件制作完成后将玻璃基板与柔性基板分离，以形成以柔性基板作为基底的柔性器件。但要做成大尺寸屏幕，需要将多个柔性器件拼接起来，柔性器件拼接难度大，边缘易发生卷边现象，且拼缝也难控制。还有的在硬质的玻璃基板上先形成柔性基板，然后在柔性基板上制作相关的电子器件，在相关的电子器件制作完成后形成显示面板，先并将多个显示面板进行拼接后，在去除玻璃基板，但是，在拼接后再利用激光剥离技术分离玻璃基板和柔性基板，存在技术上的问题。
因此，为了解决上述问题，本申请提出了一种拼接显示屏的制备方法和显示屏。下面结合附图和实施方式对本申请作进一步说明。
请参阅图1和图2，图1为本申请实施例提供的拼接显示屏的制备方法的流程示意图，图2为图1所示的制备方法对应的结构示意图。本申请实施例提供一种拼接显示屏的制备方法，显示模组的制备方法的具体流程如下：
101、提供玻璃基板和显示面板，显示面板包括依次制备于玻璃基板的一侧的表面上的柔性基板以及显示单元，显示面板包括邦定区和非邦定区。
提供玻璃基板20，在玻璃基板20上制备显示面板。显示面板包括依次制备于玻璃基板20的一侧的表面上的柔性基板10以及显示单元。
本实施例中，柔性基板10的材质优选为耐高温的聚酰亚胺(英文全称：Polyimide，简称PI)材料。在其他实施例中，柔性基板10的材质还可以包括二氧化硅、涤纶树脂、聚乙烯、聚丙烯、聚苯乙烯、聚乳酸、聚对苯二甲酸乙二醇酯或聚氨酯等材质。
本实施例中，显示单元为mini-LED。在其他实施例中，显示单元还可以包括：LED、micro-LED、OLED中的一种。
制备显示面板还包括：在每一柔性基板10的一端均电连接一覆晶薄膜30(英文全称：Chip On Film，简称COF)；以及在每一覆晶薄膜30远离显示单元的一端均电连接一印刷电路板40(英文全称：Printed CircuitBoard，简称PCB)。
102、在显示单元远离玻璃基板的一侧贴附第一保护膜。
在显示单元远离玻璃基板20的一侧贴合第一保护膜50，其中，第一保护膜50材质为PET。利用PET良好的力学性能、耐油、耐脂肪、耐稀酸、稀碱，耐大多数溶剂的性能，由此可以较好的保护其下的显示面板。同时利用PET的高透明度，由此防止影响显示面板的透光性能。
其中，第一保护膜50上设置有切割Mark，可以理解的是，切割Mark设置在非邦定区。
103、在第一保护膜远离柔性基板的一侧设置支撑玻璃。
在第一保护膜50远离柔性基板10的一侧，通过低黏胶60将支撑玻璃70和第一保护膜50连接。支撑玻璃70主要用于在玻璃基板20和柔性基板10分离后，用于支撑柔性基板10和显示单元，避免柔性基板10出现翘边的现象。
104、将玻璃基板与柔性基板分离。
通过激光剥离的方式将玻璃基板20与柔性基板10分离，示例性的，运用激光束辐照待剥离显示屏，并且该激光束与待剥离显示屏相对移动，从而将待剥离显示屏上的玻璃基板20和柔性基板10相互分离。
105、对位于非邦定区的第一保护膜、显示面板和支撑玻璃进行切割，以得到第一组件。
采用激光切割的方式，根据预留在第一保护膜50上的切割Mark，对位于非邦定区的第一保护膜50、显示面板和支撑玻璃70进行切割，将切割后的第一保护膜50、显示面板和支撑玻璃70定义为第一组件100。第一组件100的具体结构可参阅图3，图3是本申请实施例提供的拼接显示屏的一个第一组件100的结构示意图。
其中，切割后的第一保护膜50远离邦定区的一端、柔性基板10远离邦定区的一端和支撑玻璃70远离邦定区的一端齐平。
106、提供第二保护膜，将多个第一组件100拼接于第二保护膜的一侧的表面上，其中，第二保护膜设置于柔性基板远离第一保护膜的一侧。
提供第二保护膜，其中，第二保护膜材质为PET。利用PET良好的力学性能、耐油、耐脂肪、耐稀酸、稀碱，耐大多数溶剂的性能，由此可以较好的保护其下的显示面板。同时利用PET的高透明度，由此防止影响显示面板的透光性能。
将多个第一组件100拼接于第二保护膜80的一侧的表面上，示例性的，将一个第一组件100远离邦定区的覆晶薄膜30的一端与另一个第一组件100远离邦定区的覆晶薄膜30的一端相邻设置。需要说明的是，相邻的第一组件100之间具有拼接缝，但是由于其拼接缝的大小和像素点之间的距离相差不大，因此，可以做到视觉上的无缝拼接，进而提高了柔性拼接产品的质量。
可以理解的是，为实现拼接缝没有覆晶薄膜30及印刷电路板40，因此，每一行的两个第一组件100的显示面板的覆晶薄膜30均位于其电连接的显示单元的远离拼接缝的一端。
在一些实施例中，在将多个第一组件100拼接于第二保护膜80的一侧的表面上之后，将支撑玻璃70和第一保护膜50分离，得到拼接的柔性mini-LED屏幕，视觉上可做到无拼缝。
本申请实施例提供的拼接显示屏的制备方法，通过在第一保护膜50上设置支撑玻璃70，进而可以在将多个柔性基板10拼接在第二保护膜80之前，将柔性基板10和玻璃基板20分离，并且支撑玻璃70的存在可以支撑柔性基板10和显示单元，进而避免柔性基板10与玻璃基板20分离后出现翘边的现象，当多个柔性基板10拼接在第二保护膜80之后，可以将支撑基板与柔性基板10分离，进而实现了多个柔性基板10的无缝拼接，解决了现有的柔性器件存在拼接难度大的问题。
请继续参阅图4，图4为本申请实施例提供的拼接显示屏的结构示意图。本申请实施例还提供一种拼接显示屏1，拼接显示屏1包括第二保护膜80和设置在第二保护膜80上的多个相邻设置的多个第一组件100，其中，多个第一组件100设置在第二保护膜80的同侧以形成第二组件200，第一组件100包括层叠设置的显示面板和第一保护膜50，显示面板设置在第一保护膜50和第二保护膜80之间，其中，显示面板包括层叠设置的柔性基板10以及显示单元。
第一保护膜50远离邦定区的一端和柔性基板10远离邦定区的一端齐平。通过设置第一保护膜50和柔性基板10的边缘齐整可以使得相邻的第一组件100之间的拼接的缝隙更小，进而使得视觉上可做到无拼缝。
第一保护膜50和第二保护膜80均为PET膜，可以较好的保护其下的显示面板。
每一柔性基板10远离非邦定区的一端均设置一覆晶薄膜30；以及每一覆晶薄膜30远离柔性基板10的一端均设置一印刷电路板40。为实现拼接缝没有覆晶薄膜30及印刷电路板40，因此，每一行的两个第一组件100的显示面板的覆晶薄膜30均位于其电连接的显示单元的远离拼接缝的一端。例如，本实施例中，左边的第一组件100的覆晶薄膜30位于其电连接的显示单元的左端，右边的第一组件100的覆晶薄膜30位于其电连接的显示单元的右端，由此保证拼接缝处没有覆晶薄膜30。左边的第一组件100的印刷电路板40位于其电连接的显示单元的左端，右边的第一组件100的印刷电路板40位于其电连接的显示单元的右端，由此保证拼接缝处没有印刷电路板40。
显示单元为mini-LED。在其他实施例中，显示单元还可以包括：LED、micro-LED、OLED中的一种。
请继续参阅图5，图5为多个第二组件在第二保护膜上的排布示意图。在第二保护膜80上拼接的多个第二组件200的行数为n，列数为2，n≥1。本实施例中n＝6。在其他实施例中，也可以是行数为2，列数为n，n≥1。通过将多个第二组件在第二保护膜上拼接，可以通过多个小的柔性显示面板实现大尺寸屏幕的柔性电子产品，既可以保留柔性显示屏的优点，又可以实现大尺寸屏幕，且本申请实施例是将多个第二组件在第二保护膜上进行无缝拼接，可以提高显示质量，给客户带来更好的体验。
以上对本申请实施例提供的一种拼接显示屏的制备方法和显示屏进行了详细介绍。本文中应用了具体条例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种拼接显示屏的制备方法，其中，所述制备方法包括:
    提供玻璃基板和显示面板，所述显示面板包括依次制备于所述玻璃基板的一侧的表面上的柔性基板以及显示单元，所述显示面板包括邦定区和非邦定区；
    在所述显示单元远离所述玻璃基板的一侧贴附第一保护膜；
    在所述第一保护膜远离所述柔性基板的一侧设置支撑玻璃；
    将所述玻璃基板与所述柔性基板分离；
    对位于非邦定区的所述第一保护膜、所述显示面板和所述支撑玻璃进行切割，以得到第一组件；
    提供第二保护膜，将多个所述第一组件拼接于所述第二保护膜的一侧的表面上，其中，所述第二保护膜设置于所述柔性基板远离所述第一保护膜的一侧。
  2. 根据权利要求1所述的制备方法，其中，所述将多个所述第一组件拼接于所述第二保护膜的一侧的表面上，包括：
    将一个所述第一组件远离所述邦定区的一端与另一个所述第一组件远离所述邦定区的一端相邻设置。
  3. 根据权利要求1所述的制备方法，其中，所述将多个所述第一组件拼接于所述第二保护膜的一侧的表面上之后，所述制备方法还包括：
    将所述支撑玻璃和所述第一保护膜分离。
  4. 根据权利要求1所述的制备方法，其中，所述制备方法还包括：
    在每一所述柔性基板位于邦定区的一端均电连接一覆晶薄膜；以及
    在每一所述覆晶薄膜远离所述柔性基板的一端均电连接一印刷电路板。
  5. 根据权利要求4所述的制备方法，其中，相邻的所述第一组件之间具有拼接缝。
  6. 根据权利要求5所述的制备方法，其中，每一行的两个所述第一组件的覆晶薄膜均位于与其电连接的显示单元远离所述拼接缝的一端。
  7. 根据权利要求1所述的制备方法，其中，切割后的所述第一保护膜远离所述邦定区的一端、所述柔性基板远离所述邦定区的一端和所述支撑玻璃远离所述邦定区的一端齐平。
  8. 根据权利要求1所述的制备方法，其中，在所述第二保护膜上拼接的多个所述第二组件的行数为n，列数为1，所述n≥1。
  9. 根据权利要求1所述的制备方法，其中，在所述第二保护膜上拼接的多个所述第二组件的行数为2，列数为n，所述n≥1。
  10. 根据权利要求1所述的制备方法，其中，所述第一保护膜和所述第二保护膜均为PET膜。
  11. 根据权利要求1所述的制备方法，其中，所述显示单元包括LED、mini-LED、micro-LED和OLED中的一种。
  12. 根据权利要求1所述的制备方法，其中，所述支撑玻璃和所述第一保护膜通过低黏胶连接。
  13. 一种拼接显示屏，其中，所述拼接显示屏包括：
    第二保护膜；
    相邻设置的多个第一组件，多个所述第一组件设置在所述第二保护膜的同侧以形成第二组件，所述第一组件包括层叠设置的显示面板和第一保护膜，所述显示面板设置在所述第一保护膜和所述第二保护膜之间，其中，所述显示面板包括层叠设置的柔性基板以及显示单元，所述显示面板包括邦定区和非邦定区。
  14. 根据权利要求13所述的拼接显示屏，其中，所述第一保护膜远离所述邦定区的一端和所述柔性基板远离所述邦定区的一端齐平。
  15. 根据权利要求13所述的拼接显示屏，其中，在所述第二保护膜上拼接的多个所述第二组件的行数为n，列数为1，所述n≥1。
  16. 根据权利要求13所述的拼接显示屏，其中，在所述第二保护膜上拼接的多个所述第二组件的行数为2，列数为n，所述n≥1。
  17. 根据权利要求13所述的拼接显示屏，其中，所述第一保护膜和所述第二保护膜均为PET膜。
  18. 根据权利要求13所述的拼接显示屏，其中，所述显示单元包括LED、mini-LED、micro-LED和OLED中的一种。
  19. 根据权利要求13所述的拼接显示屏，其中，
    每一所述柔性基板远离非邦定区的一端均设置一覆晶薄膜；以及
    每一所述覆晶薄膜远离所述柔性基板的一端均设置一印刷电路板。
  20. 根据权利要求19所述的拼接显示屏，其中，相邻的所述第一组件之间具有拼接缝，每一行的两个所述第一组件的覆晶薄膜均位于与其电连接的显示单元远离所述拼接缝的一端。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120190220A1 (en) * 2011-01-21 2012-07-26 Samsung Electronics Co., Ltd. Display apparatus
CN105322104A (zh) * 2015-12-08 2016-02-10 昆山工研院新型平板显示技术中心有限公司 Oled显示面板的封装方法
CN106654063A (zh) * 2016-12-28 2017-05-10 武汉华星光电技术有限公司 柔性oled显示面板的制作方法
CN106773207A (zh) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 显示面板的制造方法
CN110164874A (zh) * 2019-06-04 2019-08-23 上海天马微电子有限公司 柔性显示模组、显示装置及柔性显示模组的制作方法
CN113629096A (zh) * 2021-07-26 2021-11-09 深圳市华星光电半导体显示技术有限公司 一种拼接显示屏的制备方法及拼接显示屏

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018043337A1 (ja) * 2016-09-01 2018-03-08 凸版印刷株式会社 大型表示パネル及びその製造方法
CN109950396A (zh) * 2017-12-21 2019-06-28 昆山维信诺科技有限公司 柔性设备取下方法与柔性设备前驱结构
CN108181752A (zh) * 2018-02-02 2018-06-19 惠州市华星光电技术有限公司 拼接显示屏的制作方法及拼接显示屏
CN108777114B (zh) * 2018-06-26 2021-05-14 上海中航光电子有限公司 显示面板及其制造方法、显示装置和拼接屏
CN108794747A (zh) * 2018-06-27 2018-11-13 深圳市华星光电技术有限公司 硅烷偶联剂材料、柔性pi基板的制作方法及柔性pi基板半成品
CN109192764B (zh) * 2018-09-11 2021-01-26 京东方科技集团股份有限公司 一种柔性显示面板及其制备方法
CN109860255A (zh) * 2019-02-20 2019-06-07 深圳市华星光电技术有限公司 柔性显示面板的制备方法
CN109817101B (zh) * 2019-03-25 2020-01-31 云谷（固安）科技有限公司 一种柔性显示模组和柔性显示屏
CN112234093A (zh) * 2020-10-30 2021-01-15 Oppo广东移动通信有限公司 显示屏模组的制造方法、显示屏模组和电子装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120190220A1 (en) * 2011-01-21 2012-07-26 Samsung Electronics Co., Ltd. Display apparatus
CN105322104A (zh) * 2015-12-08 2016-02-10 昆山工研院新型平板显示技术中心有限公司 Oled显示面板的封装方法
CN106773207A (zh) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 显示面板的制造方法
CN106654063A (zh) * 2016-12-28 2017-05-10 武汉华星光电技术有限公司 柔性oled显示面板的制作方法
CN110164874A (zh) * 2019-06-04 2019-08-23 上海天马微电子有限公司 柔性显示模组、显示装置及柔性显示模组的制作方法
CN113629096A (zh) * 2021-07-26 2021-11-09 深圳市华星光电半导体显示技术有限公司 一种拼接显示屏的制备方法及拼接显示屏

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