WO2023082771A1 - 一种dc端多级滤波结构、电机控制器及车辆 - Google Patents

一种dc端多级滤波结构、电机控制器及车辆 Download PDF

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Publication number
WO2023082771A1
WO2023082771A1 PCT/CN2022/114761 CN2022114761W WO2023082771A1 WO 2023082771 A1 WO2023082771 A1 WO 2023082771A1 CN 2022114761 W CN2022114761 W CN 2022114761W WO 2023082771 A1 WO2023082771 A1 WO 2023082771A1
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WO
WIPO (PCT)
Prior art keywords
positive
stage filter
terminal
holder assembly
capacitor
Prior art date
Application number
PCT/CN2022/114761
Other languages
English (en)
French (fr)
Inventor
刘蕾
朱玲玉
杨洋
吴鸿信
Original Assignee
一巨自动化装备（上海）有限公司
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Filing date
Publication date
Application filed by 一巨自动化装备（上海）有限公司 filed Critical 一巨自动化装备（上海）有限公司
Publication of WO2023082771A1 publication Critical patent/WO2023082771A1/zh
Priority to US18/324,909 priority Critical patent/US20230308068A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/266—Fastening or mounting the core on casing or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H01F27/402—Association of measuring or protective means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00—Installations of bus-bars
    • H02G5/04—Partially-enclosed installations, e.g. in ducts and adapted for sliding or rolling current collection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F2017/065—Core mounted around conductor to absorb noise, e.g. EMI filter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H01F2017/067—Core with two or more holes to lead through conductor
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details

Definitions

  • the present application relates to the technical field of motor controllers, in particular to a DC-end multi-stage filter structure, a motor controller with the DC-end multi-stage filter structure, and a vehicle with the motor controller.
  • Electromagnetic Compatibility refers to the ability of a device or system to work normally in its electromagnetic environment without constituting anything in the environment that cannot withstand electromagnetic disturbance. According to the definition of EMC, electronic equipment must meet the EMC design indicators. On the one hand, it is necessary to ensure that the electronic equipment has a certain degree of immunity to electromagnetic interference in the environment. On the other hand, it is required that the electromagnetic interference generated by the electronic equipment during operation The specified limit values must not be exceeded.
  • the automotive motor controller is a typical electronic device, on which electronic components such as wiring harnesses, PCBs, power modules, and capacitor modules are laid out.
  • electronic components such as wiring harnesses, PCBs, power modules, and capacitor modules are laid out.
  • the general design idea is to add filter components such as magnetic rings and magnetic buckles at the DC end and three-phase end, and add filtering capacitors, shielding covers, and grounding designs to the transmission path on the PCB. .
  • filter components such as magnetic rings and magnetic buckles at the DC end and three-phase end
  • filtering capacitors, shielding covers, and grounding designs to the transmission path on the PCB.
  • In order to meet the EMC design index arrange as many filtering devices as possible in a limited space to improve the filtering level.
  • the traditional design method is to add several large and small filter capacitors, magnetic rings, magnetic buckles, filter circuit boards and other filter components on the current transmission path.
  • the traditional EMC design method has two disadvantages: on the one hand, since these filter components are independent entities, it is necessary to spare a part of space to fix the components during installation.
  • the space for the filter module at the DC end of the controller will be enlarged, the design space at the DC/AC end will be compressed, and the design difficulty will be significantly increased; on the other hand, the filter components are independent, and the integration of the filter module The degree is low, the installation process is cumbersome, the production cycle of the controller product will be extended, and the production efficiency will be significantly reduced.
  • this application provides a DC terminal multi-stage filter structure, motor controller and vehicle.
  • the integrated and modular design of current-carrying copper bars can not only control the EMC design space at the DC end, but also simplify the assembly process and improve assembly efficiency.
  • One of the purposes of this application is to provide a DC terminal multi-stage filter structure, which is fixed at the DC terminal inside the controller housing.
  • the head end of the DC terminal is a high-voltage bus, and the end is a film capacitor. It includes a primary filter fixed seat assembly and a secondary filter fixed seat assembly, and the primary filter fixed seat assembly and the secondary filter fixed seat assembly are arranged in a line along the length direction of the controller casing on the controller casing Inside;
  • the input end of the high-voltage bus bar is connected to the positive and negative input ends of the first-stage filter holder assembly; the positive and negative output ends of the first-stage filter holder assembly are respectively connected to the second-stage filter holder assembly.
  • the positive and negative input terminals are connected correspondingly;
  • the positive and negative output terminals of the secondary filter holder assembly are respectively connected to the positive and negative input terminals of the film capacitor.
  • the primary filter holder assembly includes a first injection molding housing and a first filter device;
  • the first injection molding housing has a first positive copper bar and a first negative copper bar;
  • the first A filter device has a power-taking terminal and a grounding terminal, the power-taking terminal is overlapped with the first positive copper bar and the first negative copper bar, and the grounding terminal is lapped with the controller shell;
  • the secondary filter fixing seat assembly includes a second injection molded housing and a second filter device; the second injection molded housing has a second positive copper bar, a second negative copper bar, a grounding copper bar, and a plurality of grooves;
  • the second filter device includes a magnetic ring, a magnetic core, four second Y capacitors, a second X capacitor and a magnetic core pressing plate;
  • the magnetic core is located between the four second Y capacitors; the magnetic ring is fixed in one of the grooves on the side of the second injection molding housing close to the first-stage filter fixing seat assembly, so that The magnetic core pressing plate and the secondary filter fixing seat assembly are fixed and pressed on the magnetic core.
  • the magnetic core is composed of an E-type magnetic core and an I-type magnetic core; and/or
  • the upper part of the magnetic core is provided with two via holes, and the two via holes respectively pass through the second positive copper bar and the second negative copper bar;
  • a magnetic ring via hole is provided in the middle of the magnetic ring, and the magnetic ring via hole passes through the second positive copper bar and the second negative copper bar.
  • the magnetic ring is wound from an ultrafine crystal strip, and is fixed on the housing of the second injection molded part close to the first-stage filter fixing seat assembly by pouring glue or dispensing glue and adding a cover. side of the ; and/or
  • the magnetic core is pressed into the groove on the side of the second injection molded part shell away from the first-stage filter fixing seat assembly through the magnetic core pressure handle, and a number of limiting protrusions are arranged in the groove
  • the ribs position the magnetic core, and the magnetic core pressing plate is clipped and fixed with the filter fixing seat assembly.
  • the input end of the high-voltage busbar is connected to the positive and negative input ends of the first-stage filter holder assembly through screw locking;
  • the positive and negative output ends of the first-stage filter holder assembly are respectively connected to the positive and negative input ends of the second-stage filter holder assembly through screw locking;
  • the positive and negative output terminals of the secondary filter fixing seat assembly are respectively connected to the positive and negative input terminals of the film capacitor through screw locking.
  • the first filter device includes a circuit board and two first X capacitors and two first Y capacitors arranged on the circuit board;
  • the two first X capacitors are arranged at intervals along the arrangement direction of the first-stage filter holder assembly and the second-stage filter holder assembly, and the two first Y capacitors are symmetrically arranged on two sides of one of the first X capacitors. side.
  • the four second Y capacitors and the one second X capacitor are potted in the remaining grooves in the housing of the second injection molded part, wherein the two second Y capacitors are arranged side by side in the On the side of the second injection molded part shell away from the first-stage filter holder assembly, the remaining two second Y capacitors and the one second X capacitor are arranged side by side on the second injection molded part shell close to the one One side of the stage filter holder assembly and close to the magnetic ring;
  • the second positive electrode copper bar and the second negative electrode copper bar respectively lead out electric soldering legs, and the grounding copper bar leads out grounding soldering legs, and the electric soldering legs are connected with the second X capacitor and the second Y capacitor.
  • the power-taking pin is welded and fixed to take power for the second X capacitor and the second Y capacitor; the ground welding leg is welded and fixed to the ground pin on the second Y capacitor to ground the second Y capacitor.
  • the controller housing includes a housing and an upper cover
  • the inner bottom of the housing is integrally formed with a plurality of first shielding structures protruding upward;
  • a plurality of second shielding structures protruding downwards are integrally formed on the inner top wall of the upper cover;
  • the first shielding structure and the second shielding structure are arranged alternately to form a labyrinth-like shielding cavity, and the primary filter fixing seat assembly and the secondary filter fixing seat assembly are arranged in the labyrinth-like shielding cavity.
  • Another object of the present application is to provide a motor controller, including the DC terminal multi-stage filter structure described in any one of the above.
  • Another object of the present application is to provide a vehicle, including the motor controller mentioned above.
  • the multi-stage filter structure at the DC end of the present application integrates many filter components through an integrated and modular design, which can ensure that the EMC capability of the DC end of the controller is improved to the greatest extent in a limited space.
  • the EMC shielding structure By increasing the EMC shielding structure, the high and low voltage signal crosstalk can be effectively isolated, the space radiation can be reduced, and the EMC capability can be improved.
  • FIG. 1 is a schematic diagram of a DC-side multi-stage filter circuit according to an embodiment of the present application
  • FIG. 2 is a schematic diagram of the installation structure of the DC-side multi-stage filter structure in the controller housing of the embodiment of the present application;
  • FIG. 3 is a schematic structural diagram of a first-stage filter holder assembly of a DC-side multi-stage filter structure according to an embodiment of the present application
  • FIG. 4 is a schematic structural diagram of the first filter device of the first-stage filter holder assembly of the DC-side multi-stage filter structure of the embodiment of the present application;
  • FIG. 5 is a schematic structural diagram of a secondary filter holder assembly of a DC-side multi-stage filter structure according to an embodiment of the present application
  • FIG. 6 is a schematic structural diagram of the magnetic ring of the secondary filter holder assembly of the DC-side multi-stage filter structure of the embodiment of the present application;
  • FIG. 7 is a schematic structural diagram of the magnetic core of the first-stage filter holder assembly of the DC-side multi-stage filter structure of the embodiment of the present application;
  • FIG. 8 is a schematic structural diagram of a shielding cavity of a controller housing of a DC-side multi-stage filter structure according to an embodiment of the present application.
  • Primary filter holder assembly
  • First-level filter fixing seat assembly 2. Second-level filter fixing seat assembly; 3. The first positive input terminal; 4. The first negative input terminal; 5. The first positive output terminal; 6. The first negative output 7. The second positive input terminal; 8. The second negative input terminal; 9. The second positive output terminal; 10. The second negative output terminal; 11. The first filter device; 12. The power-taking terminal; 13. Grounding Terminal; 14. Magnetic ring; 15. Magnetic core; 16. Electric soldering pin; 17. Grounding soldering pin; 18. Second X capacitor; 19. Second Y capacitor; 20. First X capacitor; 21. First Y Capacitance; 22. Housing structural ribs; 23. High-voltage busbar; 24. Film capacitor; 25. Upper cover structural ribs; 26. E-type magnetic core; 27. I-type magnetic core;
  • a DC terminal multi-stage filter structure according to the embodiment of the present application, wherein the entire filter topology principle diagram is shown in Fig. 1, after the positive and negative poles of the DC terminal pass through the first-stage filter magnetic ring, between the positive and negative poles Connect a filter X capacitor, connect a filter Y capacitor between the positive pole and ground, connect a filter Y capacitor between the negative pole and ground, and then pass through the secondary filter magnetic ring at the positive and negative poles. After the secondary filter magnetic ring, connect a filter X capacitor between the positive pole and the negative pole, connect a filter Y capacitor between the positive pole and the ground, and connect a filter Y capacitor between the negative pole and the ground.
  • the DC terminal fixed in the controller casing is also the DC terminal.
  • the head of the DC terminal that is, the left end as shown in FIG.
  • the multi-stage filter structure at the DC end includes a first-stage filter holder assembly 1 and a second-stage filter holder assembly 2 .
  • the first-stage filter fixing seat assembly 1 and the second-stage filter fixing seat assembly 2 are horizontally arranged in a line and arranged in the controller housing.
  • the left side of the controller housing is the first-stage filter holder assembly 1
  • the right side of the controller housing is the second-stage filter holder assembly 2, which can well control the design space of the EMC at the DC end.
  • the input end of the high-voltage bus bar 23 is correspondingly connected to the positive and negative input ends of the first-stage filter holder assembly 1 .
  • the positive and negative output terminals of the first-stage filter holder assembly 1 are respectively connected to the positive and negative input terminals of the second-stage filter holder assembly 2 .
  • the positive and negative output terminals of the secondary filter holder assembly 2 are respectively connected to the positive and negative input terminals of the film capacitor 24 .
  • the input end of the high-voltage busbar 23 is connected to the positive and negative input ends of the first-stage filter holder assembly 1 through screw locking.
  • the positive and negative output ends of the first-stage filter fixing seat assembly 1 are respectively connected to the positive and negative input ends of the second-stage filter fixing seat assembly 2 through screw locking.
  • the positive and negative output ends of the secondary filter holder assembly 2 are respectively connected to the positive and negative input ends of the film capacitor 24 through screw locking.
  • the primary filter fixing seat assembly 1 includes a first injection molded housing, a first filter device 11 and a groove structure (not shown in the figure).
  • the shell of the first injection molded part is roughly rectangular, and the shell of the first injection molded part has a first positive electrode copper bar and a first negative electrode copper bar.
  • the two ends of the first positive copper bar are respectively the positive input terminal and the positive output terminal of the primary filter holder assembly 1, and the two ends of the first negative copper bar are the negative input terminal and the negative output terminal of the primary filter holder assembly 1 respectively. end.
  • the groove structure is an injection molding structure, which is used to increase the creepage distance between the first positive electrode copper row and the first negative electrode copper row.
  • the positive input end and the positive output end of the first-stage filter holder assembly 1 are described here as the first positive input end 3 and the first positive output end 5 respectively, and the first-stage filter holder assembly 1
  • the negative input terminal and the negative output terminal are described as a first negative input terminal 4 and a first negative output terminal 6 respectively.
  • the first positive input terminal 3 and the first negative input terminal 4 are arranged side by side up and down on the left end of the first injection molded part housing
  • the first positive output terminal 5 and the first negative output terminal 6 are arranged side by side up and down on the first The right end of the molded part housing.
  • the first filter device 11 is arranged between the first positive input terminal 3, the first negative input terminal 4, the first positive output terminal 5, and the first negative output terminal 6, including the circuit board and the circuit board
  • the circuit board is a filter PCBA, that is, a printed circuit board or a printed circuit board.
  • two first X capacitors 20 are arranged at intervals along the arrangement direction of the first-stage filter holder assembly 1 and the second-stage filter holder assembly 2, and two first Y capacitors 21 are arranged symmetrically on one of the first filter holder assemblies.
  • An X capacitor 20 is specifically the upper and lower sides of the first X capacitor 20 close to the first positive output terminal 5 or the first negative output terminal 6 .
  • the circuit board is a square circuit board, a first X capacitor 20 with a larger size is arranged on the upper right side of the circuit board, and another first X capacitor 20 with a smaller size is arranged on the lower left side of the circuit board and is connected to the other side.
  • first X capacitor 20 There is an interval between one first X capacitor 20 , and two first Y capacitors 21 are symmetrically arranged on both sides of the larger first X capacitor 20 .
  • It is the ground terminal 13, and the power-taking terminal 12 is correspondingly overlapped with the first positive electrode copper bar and the first negative electrode copper bar, and is used for taking electricity from two poles of the first X capacitor 20 and one pole of the first Y capacitor 21.
  • the ground terminal 13 is overlapped with the controller shell, and is the other pole of the Y capacitor to be grounded.
  • the first X capacitor 20 can effectively suppress differential mode interference
  • the first Y capacitor 21 can effectively suppress common mode interference.
  • the secondary filter holder assembly 2 includes a second injection molded housing and a second filter device.
  • the casing of the second injection molded part extends horizontally, that is, in the left and right direction as shown in Figure 2, and the casing of the second injection molded part has a second positive copper bar, a second negative copper bar, a grounding copper bar and a plurality of grooves (not shown in the figure). Shows).
  • the two ends of the second positive copper bar are respectively the positive input end and the positive output end of the secondary filter holder assembly 2
  • the two ends of the second negative copper bar are the negative input end and the negative output end of the second filter holder assembly 2 respectively. end.
  • the positive input end and the positive output end of the secondary filter holder assembly 2 are described here as the second positive input end 7 and the second positive output end 9 respectively, and the second filter holder assembly 2
  • the negative input terminal and the negative output terminal are described as the second negative input terminal 8 and the second negative output terminal 10 respectively.
  • a plurality of grooves are respectively arranged in parallel with the second positive electrode copper bar and the second negative electrode copper bar, and the plurality of grooves are used to place a number of filter capacitors. By adding or deleting filter capacitors, the filter structure can meet EMC level 3, Level 4, level 5 and other different level requirements.
  • the second positive input terminal 7 and the second negative input terminal 8 are arranged side by side up and down on the left side of the second injection molded part shell, and the second positive output terminal 9 and the second negative output terminal 10 are arranged side by side on the left side.
  • the second filter device includes a magnetic ring 14 , a magnetic core 15 , four second Y capacitors 19 , a second X capacitor 18 and a magnetic core pressing plate 28 .
  • the magnetic ring 14 is an elliptical magnetic ring 14 with a magnetic ring via hole in the middle, and the magnetic ring via hole passes through the second positive copper bar and the second negative copper bar.
  • the magnetic ring 14 is fixed in a groove (not shown in the figure) on the side of the second injection molded part housing close to the first-stage filter fixing seat assembly 11, that is, on the left side as shown in FIG. 5 ,
  • the groove is an oval groove matching the magnetic ring 14 .
  • the magnetic core 15 is pressed and filled in the second injection molding shell through the magnetic core pressing plate 28 and has two via holes (not shown in the figure) on it, and the two via holes pass through the second positive copper bar and the second negative copper bar respectively. Row. Can effectively suppress differential mode or common mode interference.
  • the performance loss of the magnetic core can be reduced.
  • the structure of the magnetic core 15 as shown in FIG. 7 , it consists of an E-shaped magnetic core 26 and an I-shaped magnetic core 27 , and the open end of the E-shaped magnetic core 26 is fixed on the I-shaped magnetic core 27 downward.
  • the magnetic core pressing plate 28 is made of metal materials such as copper, aluminum and other materials, the magnetic core pressing plate 28 is a U-shaped structure, and the side walls on both sides of the opening are provided with buckles Alternatively, a slot is provided. Correspondingly, a slot corresponding to the buckle or a buckle structure corresponding to the slot is provided on the secondary filter fixing seat assembly 2. The upper surface is fixed by glue potting. As an optional embodiment, the magnetic core pressing plate 28 and the secondary filter fixing seat assembly 2 can also be fixed in other forms such as screw fixing, etc., which are not specifically limited in detail, and those skilled in the art can select and design according to actual needs. In the embodiment, clamping is adopted for fixing.
  • a limiting rib for positioning the magnetic core 15, which can facilitate the lateral positioning and positioning of the magnetic core 15. Longitudinal downward positioning, combined with the magnetic core pressing plate 28 to longitudinally position the magnetic core, so as to realize the horizontal and vertical positioning of the magnetic core 15 .
  • the specific structure of the limiting ribs is not described and limited in detail, and matching design can be carried out according to the bottom structure of the magnetic core 15 .
  • Four second Y capacitors 19 and one second X capacitor 18 are potted in the remaining grooves in the shell of the second injection molded part.
  • two second Y capacitors 19 are arranged side by side on the side of the housing of the second injection molded part away from the first-stage filter holder assembly 1, that is, the second injection molded part as shown in FIG. 5
  • the other two second Y capacitors 19 and one second X capacitor 18 are arranged side by side at the front, middle, and rear of the second injection molded part casing on the side close to the first-stage filter holder assembly 1 and close to the magnetic ring 14, that is,
  • the left side of the housing of the second injection molded part is specifically the right side of the magnetic ring 14 .
  • the magnetic core 15 is located between the four second Y capacitors 19 , specifically at the middle of the housing of the second injection molded part.
  • the second positive copper row and the second negative copper row respectively lead out the electric welding pin 16, and the grounding copper bar draws the grounding soldering pin 17, and the electric soldering pin 16 is connected with the second X capacitor 18 and the second Y capacitor 19.
  • the electrical pins are welded and fixed to take electricity for the second X capacitor 18 and the second Y capacitor 19.
  • the ground soldering leg 17 is welded and fixed to the ground pin on the second Y capacitor 19 , so as to ground the second Y capacitor 19 .
  • the second X capacitor 18 can effectively suppress differential mode interference
  • the second Y capacitor 19 can effectively suppress common mode interference.
  • the magnetic ring 14 is fixed on the side of the housing of the second injection molded part close to the first-stage filter holder assembly 1 by filling glue or dispensing glue and adding a cover, that is, the second injection molded part as shown in FIG. 5 the left side of the enclosure.
  • the magnetic ring 14 can also be fixed by a stainless steel shrapnel and a silicone cushion.
  • the magnetic core 15 is fixed in the groove of the second injection molded housing on the side away from the primary filter holder assembly 1 through potting, that is, the second injection molded housing as shown in FIG. 5 middle position.
  • the controller casing includes a casing and an upper cover.
  • the casing is bent upwards and extends around to form a first cavity.
  • the first shielding structure protruding upwards in this embodiment is the shell structural rib 22 , and the shell structural rib 22 is arranged on the front and rear sides of the shell.
  • the upper cover is bent and extended downwards to form a second cavity, and the inner top wall of the upper cover is integrally formed with a number of second shielding structures protruding downwards.
  • the upper cover structural ribs 25 are Along the length direction of the upper cover, that is, the left and right directions as shown in FIG.
  • the specific structure is not described and limited in detail, it is a conventional shielding structure known to those skilled in the art and easily realized (maze-like structure), the magnetic ring assembly is also the first-stage filter holder assembly 1 and the second-stage filter holder assembly Component 2 is installed in this type of labyrinth shielding cavity.
  • the assembly of EMC shielding protection is completed when the magnetic ring assembly, shell and upper cover of the multi-stage filter structure at the DC end are assembled, which reduces the assembly process and improves production efficiency.
  • the multi-stage filter structure at the DC end of the embodiment of the present application integrates many filter devices through an integrated and modular design, which can ensure that the EMC capability of the DC end of the controller is improved to the greatest extent in a limited space.
  • the shielding structure is a labyrinth-like shielding structure formed by the structural ribs 22 of the shell and the structural ribs 25 of the upper cover, which replaces the existing metal shielding cover, and does not require an additional shielding structure, and has a simple structure.
  • the magnetic ring 14 is used to replace the magnetic core at the junction of the first-stage filter holder assembly 1 and the second-stage filter holder assembly 2, so that the first-stage filter holder assembly 1 and the second-stage filter
  • the fixing seat assembly 2 is combined into one, which can ensure that the EMC capability of the DC end of the controller is improved to the greatest extent in a limited space.
  • the multi-stage filter structure at the DC end of the embodiment of the present application can meet the EMC level 3, level 4, Level 5 and other different level requirements.
  • An embodiment of the present application also provides a motor controller, including the DC terminal multi-stage filtering structure of the above embodiment.
  • Other structures and working principles in the motor controller are not described and limited in detail here, and are existing conventional structures.
  • An embodiment of the present application also provides a vehicle, including the motor controller of the above embodiment.

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  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种DC端多级滤波结构、电机控制器及车辆，DC端多级滤波结构固定在控制器外壳内的DC端，DC端的首端为高压母线23，末端为薄膜电容24，包括一级滤波固定座组件1和二级滤波固定座组件2，一级滤波固定座组件1和二级滤波固定座组件2沿控制器外壳的长度方向一字排布设置在控制器外壳内；高压母线23的输入端与一级滤波固定座组件1的正负极输入端对应连接；一级滤波固定座组件1的正负极输出端分别与二级滤波固定座组件2的正负极输入端对应连接；二级滤波固定座组件2的正负极输出端分别与薄膜电容24的正负极输入端对应连接。通过一体化、模块化设计将众多滤波器件集合到一起，能保证在有限的空间内，最大程度地提高控制器DC端的EMC能力。

Description

一种DC端多级滤波结构、电机控制器及车辆
本申请要求于2021年11月15日申请的、申请号为202111346940.2的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电机控制器技术领域，具体地涉及一种DC端多级滤波结构、具有该DC端多级滤波结构的电机控制器以及具有该电机控制器的车辆。
 背景技术
电磁兼容性EMC，是指设备或***在其电磁环境中能正常工作且不对该环境中任何事物构成不能承受电磁骚扰的能力。根据EMC定义，电子设备要满足EMC设计指标，一方面需要保证电子设备对所在环境存在的电磁干扰有一定程度的抗扰度，另一方面要求电子设备在运行过程中对所在环境产生的电磁干扰不能超过规定的限值。
汽车电机控制器为一典型的电子设备，其上布局了连接线束、PCB、功率模块和电容模块等电子零部件。在进行EMC方案设计时，一般的设计思路是，在直流端和三相端增加磁环、磁扣等滤波器件，在传输路径上增加滤波PCB上会增加滤波电容、屏蔽罩、接地设计等措施。为了满足EMC设计指标，在有限的空间尽可能布置更多的滤波器件，以提高滤波水平。
在进行控制器DC端(直流端)EMC设计时，传统的设计方法是，在电流传输路径上增加若干个大大小小的滤波电容、磁环、磁扣、滤波电路板等滤波元件。但传统的EMC设计方法有两个弊端：一方面，由于这些滤波元件都是独立的个体，故在安装的时候，要腾出一部分空间固定元件。当滤波元件足够多的时候，控制器DC端容纳滤波模块的空间会放大，DC/AC端的设计空间会被压缩，设计难度显著提高；另一方面，滤波元件为独立个体，滤波模块的集成化程度低，安装过程繁琐，控制器产品的生产节拍会拉大，生产效率显著降低。
 技术问题
针对上述存在的技术问题至少之一，本申请提供了一种DC端多级滤波结构、电机控制器及车辆，该滤波结构采用一字型横向布局设计策略，将独立的滤波器件和安装基座、载流铜排进行一体化和模块化设计，既能控制DC端EMC设计空间，又能简化装配流程，提高装配效率。
 技术解决方案
本申请的技术方案是：
本申请的其中一个目的在于提供一种DC端多级滤波结构，固定在控制器外壳内的DC端，所述DC端的首端为高压母线，末端为薄膜电容，所述DC端多级滤波结构包括一级滤波固定座组件和二级滤波固定座组件，所述一级滤波固定座组件和二级滤波固定座组件沿所述控制器外壳的长度方向一字排布设置在所述控制器外壳内；
所述高压母线的输入端与所述一级滤波固定座组件的正负极输入端对应连接；所述一级滤波固定座组件的正负极输出端分别与所述二级滤波固定座组件的正负极输入端对应连接；
所述二级滤波固定座组件的正负极输出端分别与所述薄膜电容的正负极输入端对应连接。
在一实施例中，所述一级滤波固定座组件包括第一注塑件外壳和第一滤波器件；所述第一注塑件外壳内具有第一正极铜排和第一负极铜排；所述第一滤波器件具有取电端和接地端，所述取电端与所述第一正极铜排及所述第一负极铜排搭接，所述接地端与所述控制器外壳搭接；
所述二级滤波固定座组件包括第二注塑件外壳和第二滤波器件；所述第二注塑件外壳内具有第二正极铜排、第二负极铜排和接地铜排及多个沟槽；
所述第二滤波器件包括一个磁环、一个磁芯、四个第二Y电容、一个第二X电容和一个磁芯压板；
所述磁芯位于四个所述第二Y电容之间；所述磁环固定在所述第二注塑件外壳的靠近所述一级滤波固定座组件一侧的一个所述沟槽内，所述磁芯压板与二级滤波固定座组件固定并压在所述磁芯上。
在一实施例中，所述磁芯由E型磁芯和I型磁芯组成；和/或
所述磁芯上部设置有两个过孔，所述两个过孔分别穿过所述第二正极铜排和第二负极铜排；
所述磁环中部设置磁环过孔，所述磁环过孔穿过所述第二正极铜排和第二负极铜排。
在一实施例中，所述磁环由超微晶带材卷绕而成，通过灌胶或点胶加封盖的形式固定在所述第二注塑件外壳的靠近所述一级滤波固定座组件的一侧；和/或
所述磁芯通过磁芯压把压灌在所述第二注塑件外壳的远离所述一级滤波固定座组件的一侧的所述沟槽内，并且在沟槽内设置有若干限位凸筋对所述磁芯进行定位，所述磁芯压板与所述滤波固定座组件卡接固定。
在一实施例中，所述高压母线的输入端与所述一级滤波固定座组件的正负极输入端通过螺钉锁紧连接；
所述一级滤波固定座组件的正负极输出端分别与所述二级滤波固定座组件的正负极输入端通过螺钉锁紧连接；
所述二级滤波固定座组件的正负极输出端分别与所述薄膜电容的正负极输入端通过螺钉锁紧连接。
在一实施例中，所述第一滤波器件包括线路板和设置在所述线路板上的两个第一X电容与两个第一Y电容；
所述线路板的靠近高压母线的一端上开有两个作为所述取电端的安装孔，靠近二级滤波固定座组件的一端上开有一个作为所述接地端的安装孔；
所述两个第一X电容沿一级滤波固定座组件和二级滤波固定座组件的排布方向间隔设置，所述两个第一Y电容对称设置在其中一个所述第一X电容的两侧。
在一实施例中，所述四个第二Y电容和所述一个第二X电容灌封在所述第二注塑件外壳内的其余沟槽内，其中两个第二Y电容并排布置在所述第二注塑件外壳的远离所述一级滤波固定座组件的一侧，其余两个第二Y电容和所述一个第二X电容并排布置在所述第二注塑件外壳的靠近所述一级滤波固定座组件的一侧且靠近所述磁环；
所述第二正极铜排和第二负极铜排上分别引出取电焊脚，所述接地铜排上引出接地焊脚，所述取电焊脚与所述第二X电容、第二Y电容上的取电引脚焊接固定，为第二X电容和第二Y电容取电；所述接地焊脚与所述第二Y电容上的接地引脚焊接固定，为第二Y电容接地。
在一实施例中，所述控制器外壳包括壳体和上盖；
所述壳体内底端一体成型有若干向上凸出延伸的第一屏蔽结构；
所述上盖内顶壁上一体成型有若干向下凸出延伸的第二屏蔽结构；
所述第一屏蔽结构和第二屏蔽结构交错设置形成类迷宫屏蔽腔体，所述一级滤波固定座组件和二级滤波固定座组件设置在所述类迷宫屏蔽腔体内。
本申请的另一个目的在于提供一种电机控制器，包括上述任一项所述的DC端多级滤波结构。
本申请还有一个目的在于提供一种车辆，包括上述的电机控制器。
 有益效果
与现有技术相比，本申请的优点是：
本申请的DC端多级滤波结构，通过一体化、模块化设计将众多滤波器件集合到一起，能保证在有限的空间内，最大程度地提高控制器DC端的EMC能力。通过增加EMC屏蔽结构，有效隔离高低压信号串扰，降低空间辐射，提升EMC能力。
 附图说明
下面结合附图及实施例对本申请作进一步描述：
图1为本申请实施例的DC端多级滤波电路的示意图；
图2为本申请实施例的DC端多级滤波结构在控制器外壳内的安装结构示意图；
图3为本申请实施例的DC端多级滤波结构的一级滤波固定座组件的结构示意图；
图4为本申请实施例的DC端多级滤波结构的一级滤波固定座组件的第一滤波器件的结构示意图；
图5为本申请实施例的DC端多级滤波结构的二级滤波固定座组件的结构示意图；
图6为本申请实施例的DC端多级滤波结构的二级滤波固定座组件的磁环的结构示意图；
图7为本申请实施例的DC端多级滤波结构的一级滤波固定座组件的磁芯的结构示意图；
图8为本申请实施例的DC端多级滤波结构的控制器外壳的屏蔽腔体的结构示意图。一级滤波固定座组件
其中：1、一级滤波固定座组件；2、二级滤波固定座组件；3、第一正极输入端；4、第一负极输入端；5、第一正极输出端；6、第一负极输出端；7、第二正极输入端；8、第二负极输入端；9、第二正极输出端；10、第二负极输出端；11、第一滤波器件；12、取电端；13、接地端；14、磁环；15、磁芯；16、取电焊脚；17、接地焊脚；18、第二X电容；19、第二Y电容；20、第一X电容；21、第一Y电容；22、壳体结构筋；23、高压母线；24、薄膜电容；25、上盖结构筋；26、E型磁芯；27、I型磁芯；28、磁芯压板。
 本发明的实施方式
为使本申请的目的、技术方案和优点更加清楚明了，下面结合具体实施方式并参照附图，对本申请进一步详细说明。应该理解，这些描述只是示例性的，而并非要限制本申请的范围。此外，在以下说明中，省略了对公知结构和技术的描述，以避免不必要地混淆本申请的概念。
参见图1至图8，本申请实施例的一种DC端多级滤波结构，其中整个滤波拓扑原理图如图1所示，DC端正负极经过一级滤波磁环后，在正负极之间连接一个滤波X电容，在正极与接地之间连接一个滤波Y电容，在负极与接地之间连接一个滤波Y电容，然后在正负极经过二级滤波磁环。在二级滤波磁环之后，在正级与负极之间连接一个滤波X电容，在正极与接地之间连接一个滤波Y电容，在负极与接地之间连接一个滤波Y电容。
固定在控制器外壳内的DC端也即直流端，DC端的首端也即如图2所示的左端为高压母线23，末端也即如图2所示的右端下侧为薄膜电容24。DC端多级滤波结构包括一级滤波固定座组件1和二级滤波固定座组件2。一级滤波固定座组件1和二级滤波固定座组件2呈一字横向排布设置在控制器外壳内。如图2所示，控制器外壳内左侧是一级滤波固定座组件1，控制器外壳内的右侧是二级滤波固定座组件2，能够很好地控制DC端EMC的设计空间。
高压母线23的输入端与一级滤波固定座组件1的正负极输入端对应连接。一级滤波固定座组件1的正负极输出端分别与二级滤波固定座组件2的正负极输入端对应连接。二级滤波固定座组件2的正负极输出端分别与薄膜电容24的正负极输入端对应连接。具体的，如图2所示，高压母线23的输入端与一级滤波固定座组件1的正负极输入端通过螺钉锁紧连接。一级滤波固定座组件1的正负极输出端分别与二级滤波固定座组件2的正负极输入端通过螺钉锁紧连接。二级滤波固定座组件2的正负极输出端分别与薄膜电容24的正负极输入端通过螺钉锁紧连接。
如图3和图4所示，一级滤波固定座组件1包括第一注塑件外壳、第一滤波器件11和凹槽结构(图中未示出)。其中第一注塑件外壳呈大致长方形，第一注塑件外壳内具有第一正极铜排和第一负极铜排。第一正极铜排的两端分别为一级滤波固定座组件1的正极输入端和正极输出端，第一负极铜排的两端分别为一级滤波固定座组件1的负极输入端和负极输出端。凹槽结构为注塑结构，用来增大第一正极铜排和第一负极铜排之间的爬电距离。为了便于描述和区分，此处将一级滤波固定座组件1的正极输入端和正极输出端分别描述为第一正极输入端3和第一正极输出端5，将一级滤波固定座组件1的负极输入端和负极输出端分别描述为第一负极输入端4和第一负极输出端6。如图3所示，第一正极输入端3和第一负极输入端4上下并排设置在第一注塑件外壳的左端，第一正极输出端5和第一负极输出端6上下并排设置在第一注塑件外壳的右端。
如图3所示，第一滤波器件11设置在第一正极输入端3、第一负极输入端4与第一正极输出端5、第一负极输出端6中间，包括线路板和设置在线路板上的两个第一X电容20和两个第一Y电容21。本实施例中线路板为滤波PCBA也即印刷电路板或印刷线路板。
如图4所示，两个第一X电容20沿一级滤波固定座组件1和二级滤波固定座组件2的排布方向前后间隔设置，两个第一Y电容21对称设置在其中一个第一X电容20具体为靠近第一正极输出端5或第一负极输出端6的第一X电容20的上下两侧。更具体的，线路板为方形线路板，一个尺寸较大的第一X电容20设置在线路板的右上侧，另一个尺寸较小的第一X电容20设置在线路板的左下侧且与另一个第一X电容20之间具有间隔，两个第一Y电容21对称设置在尺寸较大的第一X电容20的两侧。线路板上开设有三安装孔，其中位于尺寸较小的第一X电容20的两侧的两个孔为取电端12，设于尺寸较大的第一X电容20的右上侧的一个安装孔为接地端13，取电端12与第一正极铜排及第一负极铜排对应搭接，为第一X电容20的两极和第一Y电容21的一极取电。接地端13与控制器外壳搭接，为Y电容的另一极接地。第一X电容20能有效抑制差模干扰，第一Y电容21能有效抑制共模干扰。
如图5至图7所示，二级滤波固定座组件2包括第二注塑件外壳和第二滤波器件。其中第二注塑件外壳横向也即如图2所示的左右方向延伸，第二注塑件外壳内具有第二正极铜排、第二负极铜排和接地铜排及多个沟槽(图中未示出)。第二正极铜排的两端分别为二级滤波固定座组件2的正极输入端和正极输出端，第二负极铜排的两端分别为二级滤波固定座组件2的负极输入端和负极输出端。为了便于描述和区分，此处将二级滤波固定座组件2的正极输入端和正极输出端分别描述为第二正极输入端7和第二正极输出端9，将二级滤波固定座组件2的负极输入端和负极输出端分别描述为第二负极输入端8和第二负极输出端10。多个沟槽分别与所述第二正极铜排和第二负极铜排平行布置，多个沟槽用于放置若干滤波电容，通过增加或删减滤波电容，能使得滤波结构满足EMC等级3、等级4、等级5等不同等级要求。如图5所示，第二正极输入端7和第二负极输入端8上下并排设置在第二注塑件外壳的左侧，第二正极输出端9和第二负极输出端10左右并排设置在第二注塑件外壳的右侧前端。
第二滤波器件包括一个磁环14、一个磁芯15、四个第二Y电容19、一个第二X电容18和一个磁芯压板28。如图5所示，磁环14为椭圆形磁环14，其中部设有磁环过孔，磁环过孔穿过第二正极铜排和第二负极铜排。如图5所示，磁环14固定在第二注塑件外壳的靠近一级滤波固定座组件11一侧也即如图5所示的左侧的一个沟槽(图中未示出)内，该沟槽为与磁环14相匹配的椭圆形沟槽。
磁芯15通过磁芯压板28压灌在第二注塑件外壳内且其上具有两个过孔(图中未示出)，两个过孔分别穿过第二正极铜排和第二负极铜排。能有效抑制差模或共模干扰。另外，通过磁芯压板28固定磁芯15的方式，能减小磁芯性能损失。对于磁芯15的结构，如图7所示，由E型磁芯26和I型磁芯27组成，E型磁芯26的开口端朝下固定在I型磁芯27上。对于磁芯压板28而言，如图5所示，磁芯压板28采用金属材质比如铜、铝等材质，磁芯压板28为U型结构状，且开口两侧的侧壁上设有卡扣或者开设有卡槽，对应地，在二级滤波固定座组件2上设有对应卡扣的卡槽或对应卡槽的卡扣结构，磁芯压板28的底壁内侧压靠在磁芯15的上表面并通过粘胶灌封固定。作为可选的实施例，磁芯压板28与二级滤波固定座组件2也可以采用其他形式进行固定比如螺钉固定等，具体不做详细限定，本领域技术人员可以根据实际需求进行选择设计，本实施例中采用卡接固定。在一实施例中，在二级滤波固定座组件2的安装磁芯15的沟槽内，还设有用于对磁芯15进行定位的限位凸筋，可以方便对磁芯15进行横向定位和纵向下定位，结合磁芯压板28对磁芯进行纵向上定位，从而实现对磁芯15的横向和纵向的限位。至于限位凸筋的具体结构不做详细描述和限定，可以根据磁芯15的底部结构进行匹配设计。
四个第二Y电容19和一个第二X电容18灌封在第二注塑件外壳内的其余沟槽内。具体的，如图5所示，其中两个第二Y电容19前后并排布置在第二注塑件外壳的远离一级滤波固定座组件1的一侧也即如图5所示的第二注塑件外壳的右侧，其余两个第二Y电容19和一个第二X电容18前中后并排布置在第二注塑件外壳的靠近一级滤波固定座组件1的一侧且靠近磁环14也即如图5所示的第二注塑件外壳的左侧具体为磁环14的右侧。
如图5所示，磁芯15位于四个第二Y电容19之间具体为设置在第二注塑件外壳的中间位置。
第二正极铜排和第二负极铜排上分别引出取电焊脚16，接地铜排上引出接地焊脚17，取电焊脚16与所述第二X电容18、第二Y电容19上的取电引脚焊接固定，为第二X电容18和第二Y电容19取电。接地焊脚17与第二Y电容19上的接地引脚焊接固定，为第二Y电容19接地。第二X电容18能有效抑制差模干扰，第二Y电容19能有效抑制共模干扰。
在一些实施例中，磁环14通过灌胶或点胶加封盖的形式固定在第二注塑件外壳的靠近一级滤波固定座组件1的一侧也即如图5所示的第二注塑件外壳的左侧。一些可替换的实施例中，磁环14也可以通过不锈钢弹片加硅胶缓冲垫固定。
在一些实施例中，磁芯15通过灌封形式固定在第二注塑件外壳的远离一级滤波固定座组件1的一侧的沟槽内也即如图5所示的第二注塑件外壳的中部位置。
需要说明的是，申请人在先前有申请类似的多级滤波结构的专利，但是申请人发现仍需改进，本申请是基于先前申请的改进，除了上述的排布方式和结构上做了改进外，还有一部分结构进行了改进，具体的，如图8所示，控制器外壳包括壳体和上盖，壳体四周向上弯折延伸形成有第一空腔，壳体内底端一体成型有若干向上凸出延伸的第一屏蔽结构本实施例中为壳体结构筋22，壳体结构筋22设置在壳体的前后两侧。上盖四周向下弯折延伸形成有第二空腔，上盖内顶壁一体成型有若干向下凸出延伸的第二屏蔽结构本实施例中为上盖结构筋25，上盖结构筋25沿上盖的长度方向也即如图8所示的左右方向间隔设置，第一屏蔽结构也即上盖结构筋25与第二屏蔽结构也即壳体结构筋22交错形成类迷宫屏蔽腔体(具体的结构不做详细描述和限定，为现有常规的本领域技术人员知晓并容易实现的类迷宫结构)的屏蔽结构，磁环组件也即一级滤波固定座组件1和二级滤波固定座组件2安装在该类迷宫屏蔽腔体内。在组装DC端多级滤波结构的磁环组件和壳体及上盖时即完成EMC屏蔽防护的组装，减少装配工序，提高生产效率。
本申请实施例的DC端多级滤波结构，通过一体化、模块化设计将众多滤波器件集合到一起，能保证在有限的空间内，最大程度地提高控制器DC端的EMC能力。通过增加EMC屏蔽结构，有效隔离高低压信号串扰，降低空间辐射，提升EMC能力。屏蔽结构为有壳体结构筋22和上盖结构筋25形成的类迷宫屏蔽结构，代替现有的金属屏蔽罩，不需要额外设计屏蔽结构，结构简单。
本申请实施例的DC端多级滤波结构，在一级滤波固定座组件1和二级滤波固定座组件2连接处采用磁环14代替磁芯，使得一级滤波固定座组件1和二级滤波固定座组件2二合为一，能保证在有限的空间内，最大程度地提高控制器DC端的EMC能力。
本申请实施例的DC端多级滤波结构可以依据客户或成本需求，通过增加或删减滤波电容、磁环14、磁芯15、滤波线路板，能使得滤波结构满足EMC等级3、等级4、等级5等不同等级要求。
本申请实施例还提供了一种电机控制器，包括上述实施例的DC端多级滤波结构。对于电机控制器中其他结构及工作原理在此不做详细描述和限定，为现有常规结构。
本申请实施例还提供了一种车辆，包括上述实施例的电机控制器。
应当理解的是，本申请的上述具体实施方式仅仅用于示例性说明或解释本申请的原理，而不构成对本申请的限制。因此，在不偏离本申请的精神和范围的情况下所做的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。此外，本申请所附权利要求旨在涵盖落入所附权利要求范围和边界、或者这种范围和边界的等同形式内的全部变化和修改例。

Claims (11)

  1. 一种DC端多级滤波结构，固定在控制器外壳内的DC端，其中，所述DC端的首端为高压母线(23)，末端为薄膜电容(24)，所述DC端多级滤波结构包括一级滤波固定座组件(1)和二级滤波固定座组件(2)，所述一级滤波固定座组件(1)和二级滤波固定座组件(2)沿所述控制器外壳的长度方向一字排布设置在所述控制器外壳内；
    所述高压母线(23)的输入端与所述一级滤波固定座组件(1)的正负极输入端对应连接；所述一级滤波固定座组件(1)的正负极输出端分别与所述二级滤波固定座组件(2)的正负极输入端对应连接；
    所述二级滤波固定座组件(2)的正负极输出端分别与所述薄膜电容(24)的正负极输入端对应连接。
  2. 根据权利要求1所述的一种DC端多级滤波结构，其中，
    所述一级滤波固定座组件(1)包括第一注塑件外壳和第一滤波器件(11)；所述第一注塑件外壳内具有第一正极铜排和第一负极铜排；所述第一滤波器件(11)具有取电端(12)和接地端(13)，所述取电端(12)与所述第一正极铜排及所述第一负极铜排搭接，所述接地端(13)与所述控制器外壳搭接；
    所述二级滤波固定座组件(2)包括第二注塑件外壳和第二滤波器件；所述第二注塑件外壳内具有竖直平行布置的第二正极铜排和第二负极铜排，以及接地铜排；
    所述第二滤波器件包括一个磁环(14)、一个磁芯(15)、四个第二Y电容(19)、一个第二X电容(18)和一个磁芯压板(28)；
    所述磁芯(15)位于四个所述第二Y电容(19)之间；所述磁环(14)固定在所述第二注塑件外壳的靠近所述一级滤波固定座组件(1)一侧的一个所述沟槽内，所述磁芯压板(28)与二级滤波固定座组件(2)固定并压在所述磁芯(15)上。
  3. 根据权利要求2所述的一种DC端多级滤波结构，其中，所述一级滤波固定座组件(1)还包括增大爬电距离的凹槽结构，所述凹槽结构为注塑结构；
    所述第二注塑件外壳内还包括多个沟槽，多个沟槽分别与所述第二正极铜排和第二负极铜排平行布置，多个沟槽用于放置若干滤波电容。
  4. 根据权利要求2所述的一种DC端多级滤波结构，其中，所述磁芯(15)由E型磁芯(26)和I型磁芯(27)组成；和/或
    所述磁芯(15)上部设置有两个过孔，所述两个过孔分别穿过所述第二正极铜排和第二负极铜排；
    所述磁环(14)中部设置磁环过孔，所述磁环过孔穿过所述第二正极铜排和第二负极铜排。
  5. 根据权利要求2所述的一种DC端多级滤波结构，其中，所述磁环(14)由超微晶带材卷绕而成，通过灌胶或点胶加封盖的形式固定在所述第二注塑件外壳的靠近所述一级滤波固定座组件(1)的一侧；和/或
    所述磁芯(15)通过所述磁芯压板(28)压在所述第二注塑件外壳的远离所述一级滤波固定座组件(1)的一侧的所述沟槽内，并且在沟槽内设置若干限位凸筋对所述磁芯(15)进行定位，所述磁芯压板(28)与所述滤波固定座组件(2)卡接固定。
  6. 根据权利要求1所述的一种DC端多级滤波结构，其中，所述高压母线(23)的输入端与所述一级滤波固定座组件(1)的正负极输入端通过螺钉锁紧连接；
    所述一级滤波固定座组件(1)的正负极输出端分别与所述二级滤波固定座组件(2)的正负极输入端通过螺钉锁紧连接；
    所述二级滤波固定座组件(2)的正负极输出端分别与所述薄膜电容(24)的正负极输入端通过螺钉锁紧连接。
  7. 根据权利要求2所述的一种DC端多级滤波结构，其中，所述第一滤波器件(11)包括线路板和设置在所述线路板上的两个第一X电容(20)与两个第一Y电容(21)；
    所述线路板的靠近高压母线(23)的一端上开有两个作为所述取电端(12)的安装孔，靠近二级滤波固定座组件(2)的一端上开有一个作为所述接地端(13)的安装孔；
    所述两个第一X电容(20)沿一级滤波固定座组件(1)和二级滤波固定座组件(2)的排布方向间隔设置，所述两个第一Y电容(21)对称设置在其中一个所述第一X电容(20)的两侧。
  8. 根据权利要求2所述的一种DC端多级滤波结构，其中，所述四个第二Y电容(19)和所述一个第二X电容(18)灌封在所述第二注塑件外壳内的其余沟槽内，其中两个第二Y电容(19)并排布置在所述第二注塑件外壳的远离所述一级滤波固定座组件(1)的一侧，其余两个第二Y电容(19)和所述一个第二X电容(18)并排布置在所述第二注塑件外壳的靠近所述一级滤波固定座组件(1)的一侧且靠近所述磁环(14)；
    所述第二正极铜排和第二负极铜排上分别引出取电焊脚(16)，所述接地铜排上引出接地焊脚(17)，所述取电焊脚(16)与所述第二X电容(18)、第二Y电容(19)上的取电引脚焊接固定，为第二X电容(18)和第二Y电容(19)取电；所述接地焊脚(17)与所述第二Y电容(19)上的接地引脚焊接固定，为第二Y电容(19)接地。
  9. 根据权利要求1所述的一种DC端多级滤波结构，其中，所述控制器外壳包括壳体和上盖；
    所述壳体内底端一体成型有若干向上凸出延伸的第一屏蔽结构；
    所述上盖内顶壁上一体成型有若干向下凸出延伸的第二屏蔽结构；
    所述第一屏蔽结构和第二屏蔽结构交错设置形成类迷宫屏蔽腔体，所述一级滤波固定座组件(1)和二级滤波固定座组件(2)设置在所述类迷宫屏蔽腔体内。
  10. 一种电机控制器，其中，包括权利要求1-9任一项所述的DC端多级滤波结构。
  11. 一种车辆，其中，包括权利要求10所述的电机控制器。
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