WO2023071450A1 - 电子设备 - Google Patents
电子设备 Download PDFInfo
- Publication number
- WO2023071450A1 WO2023071450A1 PCT/CN2022/113505 CN2022113505W WO2023071450A1 WO 2023071450 A1 WO2023071450 A1 WO 2023071450A1 CN 2022113505 W CN2022113505 W CN 2022113505W WO 2023071450 A1 WO2023071450 A1 WO 2023071450A1
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- WIPO (PCT)
- Prior art keywords
- conductive
- electronic device
- connection terminal
- conductive coil
- main board
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/23—Corrosion protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
- H04M1/72409—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories
- H04M1/72412—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories using two-way short-range wireless interfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/02—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from ac mains by converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/04—Details of telephonic subscriber devices including near field communication means, e.g. RFID
Definitions
- the embodiment of the present application relates to the technical field of terminals, and in particular to an electronic device.
- the electronic device has a wireless charging function or a near field communication (Near Field Communication, NFC) function.
- the wireless charging function enables the electronic device to be charged without being connected with a charging cable, so that the charging process of the electronic device is simple and convenient.
- the near-field communication function allows users to pay or unlock with their mobile phones without taking out a physical card when taking public transportation or opening the door, thereby effectively improving convenience.
- a corresponding conductive coil needs to be provided to realize a wireless charging function or a near field communication function.
- the conductive coil is formed by winding copper wire.
- Electronic equipment includes casings, motherboards, and motherboard brackets.
- the motherboard bracket is arranged between the motherboard and the shell.
- the separately provided conductive coil needs to be bonded to the main board support to fix the conductive coil.
- the conductive coil is electrically connected with the main board.
- the connection process between the wire coil and the main board support is complicated, and there is a problem of low connection reliability between the wire coil and the main board support, which will have adverse effects on the normal use of the conductive coil.
- the embodiment of the present application provides an electronic device, which can reduce the possibility that the conductive coil cannot be used normally due to the low reliability of the connection between the wire coil and the main board bracket.
- the first aspect of the present application provides an electronic device.
- the electronic equipment at least includes a shell, a main board, a conductive coil and a conductive adapter.
- the housing includes opposed inner and outer surfaces.
- the main board is arranged on one side of the inner surface.
- the conductive coil is arranged on the inner surface and integrally arranged with the shell.
- the conductive coil includes a convoluted portion, external connection terminals and internal connection terminals.
- the external connection terminal is connected with the winding part and is located outside the winding part.
- the external connecting terminal is electrically connected with the main board.
- the inner connecting terminal is connected with the winding part and is located inside the winding part.
- the conductive adapter is electrically connected to the main board and the internal connection terminal.
- the electronic device in the embodiment of the present application includes an integrally arranged casing and a conductive coil.
- the conductive coil is directly connected to the housing so that the conductive coil and the housing form an integral structure.
- the connection force between the conductive coil and the housing is relatively large, and the connection reliability is high.
- the conductive coil is not easy to swing relative to the housing and is disconnected from the housing, thereby helping to reduce the possibility that the conductive coil cannot be used normally due to the low reliability of the connection between the wire coil and the main board bracket.
- the conductive coil Since the conductive coil is connected to the housing to fix the conductive coil, the conductive coil does not need to be connected to the main board support or the sub-board support, so that the conductive coil does not need to be connected to the main board support or the conductive coil and the sub-board support, reducing the assembly process.
- a conductive material is used to form a conductive layer on the housing, so that the conductive layer forms a conductive coil.
- a conductive material is used to form a conductive layer on the casing, and the conductive layer is patterned to form a conductive coil.
- the conductive transition piece is located on a side of the conductive coil facing away from the inner surface.
- the method of setting the conductive adapter on the side of the conductive coil facing away from the inner surface of the shell can be used in advance to form a complete conductive coil on the shell, so that the conductive coil is connected to the shell in each area, so as to ensure electrical conductivity.
- the connection between the coil and the shell is stable and reliable.
- the conductive transition piece is arranged from the side of the conductive coil facing away from the inner surface of the housing, which is beneficial to reduce the difficulty of arranging the conductive transition piece.
- the conductive coil has an increased thickness at the inner connection terminal.
- the thickness of the inner connection terminal is increased, so that the area of the inner surface of the inner connection terminal facing away from the shell can be higher than the convoluted part, so that when the conductive adapter is connected to the area of the inner connection terminal facing away from the inner surface, the conductive adapter and the inner surface of the inner connection are connected.
- the width of the conductive coil increases at the inner connection terminal.
- the width of the inner connection terminal is relatively large, so that on the one hand, it is convenient to connect the conductive adapter to the inner connection terminal, reducing the possibility of difficult connection between the conductive adapter and the inner connection terminal due to the small width of the inner connection terminal ; On the other hand, it can help to increase the connection area between the conductive adapter and the inner connection terminal, thereby increasing the connection force between the conductive adapter and the inner connection terminal, and reducing the prone to the possibility of separation.
- the housing includes a recess.
- a recess is provided on the inner surface of the housing. At least part of the conductive coil is located within the recess.
- the thickness of the conductive coil does not change, it can help to reduce the space occupancy rate of the conductive coil and reduce the overall thickness of the electronic device, or, on the premise that the overall thickness of the electronic device does not change, it is possible to set a conductive coil with a larger thickness. coil.
- the shape of the conductive coil matches the shape of the recess.
- the electronic device further includes an insulation protection layer.
- the insulating protective layer covers the convoluted part.
- the insulating protection layer insulates and isolates the conductive adapter and the convoluted part, so that contact short circuit between the conductive adapter and the convoluted part can be avoided.
- the insulating protective layer can protect the winding part, reduce the possibility of corrosion of the winding part, and can also improve the reliability of the conductive coil in a high-temperature and high-humidity environment.
- the main board includes a first elastic piece.
- the external connection terminal includes a first contact.
- the first elastic piece is electrically connected to the first contact.
- the first shrapnel of the main board abuts against the first contact by means of pressure, so that there is no need to separately set up connectors to connect the main board and the external connection terminals, which is conducive to reducing the number of parts used, reducing the difficulty of assembly, and saving electronics.
- the internal space of the device is conducive to reducing the number of parts used, reducing the difficulty of assembly, and saving electronics.
- the main board includes a second elastic piece
- the conductive adapter includes a second contact
- the second elastic piece is electrically connected to the second contact.
- the second shrapnel of the main board abuts against the second contact by means of pressure, so that there is no need to separately set up a connector to connect the main board and the conductive adapter, which is beneficial to reduce the number of parts used, reduce the difficulty of assembly, and save The interior space of electronic equipment.
- the conductive transition piece and the inner connection terminal are a separate assembly structure.
- the conductive transition piece is bonded or welded to the internal connection terminal. After the conductive adapter and the internal connection terminal are bonded and welded to each other, the connection force between the conductive adapter and the internal connection terminal is relatively large, which is beneficial to reduce the possibility of the conductive adapter and the internal connection terminal being disconnected.
- the conductive adapter is a flexible circuit board.
- the conductive adapter has good flexibility and can be freely bent and deformed, so that the internal space of the electronic device can be fully utilized, which is beneficial to improving the space utilization rate of the electronic device.
- the conductive adapter and the conductive coil are integrally formed.
- the conductive coil and the conductive adapter are formed on the housing in advance, so that the connection between the conductive adapter and the internal connection terminal does not need to be bonded or welded.
- the conductive coil and the conductive adapter have high connection strength, are not easy to be separated, and do not need to be assembled, and do not need to be connected by bonding or welding.
- the winding part is helical.
- the material of the shell is selected from ceramics, metal, plastic, glass or glass fiber.
- the electronic device further includes a battery.
- the inner surface of the housing is disposed facing the battery.
- the winding part corresponds to the setting of the battery.
- the conductive coil is directly arranged on the casing, so it is beneficial to increase the gap between the conductive coil and the battery, thereby facilitating the installation of a heat sink between the conductive coil and the battery, or the gap between the conductive coil and the battery can be used as a battery.
- the buffer space during expansion is beneficial to reduce the possibility of squeezing the conductive coil or casing when the battery expands.
- FIG. 1 is a schematic structural diagram of an electronic device
- FIG. 2 is a schematic diagram of a partial exploded structure of an electronic device in the related art
- FIG. 3 is a schematic diagram of a partial exploded structure of an electronic device according to an embodiment of the present application.
- FIG. 4 is a schematic diagram of the connection structure of the housing, the conductive coil and the main board of the electronic device according to an embodiment of the present application;
- Fig. 5 is a schematic cross-sectional structure diagram along the P-P direction in Fig. 4;
- Fig. 6 is an enlarged schematic diagram of place A in Fig. 5;
- FIG. 7 is an enlarged schematic diagram of place B in FIG. 5;
- Fig. 8 is a schematic cross-sectional structure diagram along the Q-Q direction in Fig. 4;
- Fig. 9 is an enlarged schematic diagram of place C in Fig. 8.
- FIG. 10 is a partial cross-sectional structural schematic diagram of an electronic device according to another embodiment of the present application.
- FIG. 11 is a partial cross-sectional structural schematic diagram of an electronic device according to another embodiment of the present application.
- Fig. 12 is a schematic diagram of the connection structure of the housing, the conductive coil and the main board of the electronic device according to another embodiment of the present application;
- Fig. 13 is a schematic cross-sectional structure diagram along the R-R direction in Fig. 12;
- Fig. 14 is an enlarged schematic diagram at D in Fig. 13;
- Fig. 15 is an enlarged schematic diagram of place E in Fig. 13;
- FIG. 16 is a partial cross-sectional structural schematic diagram of an electronic device according to yet another embodiment of the present application.
- the electronic device in the embodiment of the present application may be called user equipment (user equipment, UE) or terminal (terminal), etc.
- the electronic device may be a tablet computer (portable android device, PAD), a personal digital assistant (personal digital assistant, PDA), handheld devices with wireless communication functions, computing devices, vehicle-mounted devices, wearable devices, virtual reality (virtual reality, VR) terminal equipment, augmented reality (augmented reality, AR) terminal equipment, industrial control (industrial control) Wireless terminals in self driving, wireless terminals in remote medical, wireless terminals in smart grid, wireless terminals in transportation safety, smart Mobile terminals or fixed terminals such as wireless terminals in a smart city and wireless terminals in a smart home.
- the form of the terminal device is not specifically limited in the embodiment of the present application.
- FIG. 1 schematically shows the structure of an electronic device 10 according to an embodiment.
- the electronic device 10 is a handheld device with a wireless communication function as an example for description.
- the handheld device with wireless communication function may be, for example, a mobile phone.
- FIG. 2 schematically shows a partial exploded structure of the electronic device 10 in the related art.
- the electronic device 10 includes a display assembly 20 , a housing 30 , a motherboard 40 and an electronic device 50 .
- the display unit 20 has a display area for displaying image information.
- the display unit 20 is mounted on the casing 30, and the display area of the display unit 20 is exposed to present image information to the user.
- the shell 30 includes an outer surface and an inner surface oppositely disposed along the thickness direction thereof. A user outside the electronic device 10 can observe the outer surface of the housing 30 .
- the main board 40 is disposed on one side of the inner surface of the casing 30 , so that the user cannot easily observe the main board 40 outside the electronic device 10 .
- the electronic device 50 is disposed on the motherboard 40 .
- the main board 40 may be a printed circuit board (Printed Circuit Board, PCB).
- the electronic device 50 is welded to the main board 40 through a welding process.
- the electronic device 50 includes but is not limited to a central processing unit (Central Processing Unit, CPU), an intelligent algorithm chip or a power management chip (Power Management IC, PMIC).
- CPU Central Processing Unit
- PMIC Power Management IC
- the electronic device 10 also includes a motherboard bracket 200 .
- the motherboard bracket 200 can be disposed between the casing 30 and the motherboard 40 .
- the motherboard bracket 200 can provide support for the motherboard 40 .
- the material of the motherboard bracket 200 can be plastic.
- the electronic device 10 further includes a conductive coil 300 and an adhesive back 400 .
- the conductive coil 300 is electrically connected to the main board 40 , so that data exchange between the conductive coil 300 and the main board 40 can be realized.
- corresponding functions can be realized, such as but not limited to wireless charging function and near field communication function.
- the conductive coil 300 is a separate structural component.
- the conductive coil 300 can be manufactured by using copper wire and adopting a winding method. In order to prevent the conductive coil 300 from rebounding and becoming loose under the action of the elastic restoring force after winding, the conductive coil 300 is bonded to the back adhesive member 400 for fixing.
- the conductive coil 300 When the conductive coil 300 is applied to the electronic device 10 , the conductive coil 300 can be bonded to the main board bracket 200 through the adhesive member 400 to fix the conductive coil 300 . Since the bonding area between the conductive coil 300 and the mainboard support 200 is small, the connection force between the conductive coil 300 and the mainboard support 200 is small and the connection reliability is low, so that the conductive coil 300 is disconnected from the mainboard support 200 The possibility of the state may cause adverse effects on the normal use of the conductive coil 300 . For example, when the conductive coil 300 is subjected to an external force and swings relative to the main board support 200 , the conductive coil 300 is easily disconnected from the main board support 200 and is in a state of being able to swing freely.
- the electronic device 10 also includes a sub-board support (not shown in the figure). Along the height direction Y of the electronic device 10 , the sub-board support and the main board support 200 are arranged at intervals. In order to improve the positional stability of the conductive coil 300 , the part of the conductive coil 300 away from the main board support 200 may be bonded to the sub-board support through an insulating member and an adhesive member. However, the way in which the conductive coil 300 is connected to the sub-board support, the insulation and adhesives used will occupy the internal space of the electronic device 10, and the process of connecting the conductive coil 300, the insulation, the adhesive and the sub-board support Complicated, with more assembly processes.
- the conductive coil 300 is bonded and fixed to the motherboard bracket 200 through the back adhesive member 400 , there is a gap between the conductive coil 300 and the housing 30 , so that the conductive coil 300 occupies more internal space.
- the shell 30 is pressed by an external force and deformed toward the conductive coil 300 , the shell 30 presses the conductive coil 300 to cause wear of the conductive coil 300 , which adversely affects the normal use of the conductive coil 300 .
- FIG. 3 schematically shows a partial exploded structure of the electronic device 10 according to the embodiment of the present application.
- FIG. 4 schematically shows the connection structure of the housing 30 , the conductive coil 60 and the main board 40 of the electronic device 10 .
- the conductive coil 60 is disposed on the inner surface of the housing 30 and integrated with the housing 30 , so that the conductive coil 60 and the housing 30 form an integral structure.
- connection force between the conductive coil 60 and the shell 30 is relatively high, and the connection reliability is high, so that the conductive coil 60 is not easy to swing and is disconnected from the shell 30, and when the shell 30 is pressed, the conductive coil 60 and the shell 30 can be Simultaneously deformed, there is no mutual abrasion, so as to ensure the normal use of the conductive coil 60 .
- FIG. 5 schematically shows a partial cross-sectional structure of an electronic device 10 according to an embodiment.
- the electronic device 10 of the embodiment of the present application includes a housing 30 , a main board 40 , a conductive coil 60 and a conductive adapter 70 .
- Housing 30 includes an inner surface 31 and an outer surface 32 .
- the mainboard 40 is disposed on one side of the inner surface 31 of the housing 30 .
- the conductive coil 60 is disposed on the inner surface 31 of the housing 30 .
- the conductive coil 60 is integrated with the housing 30 .
- the integral arrangement of the conductive coil 60 and the casing 30 means that the conductive coil 60 is directly processed and formed on the casing 30, so that the conductive coil 60 and the casing 30 form an integral structure without the need for an additional separate connection piece
- the conductive coil 60 and the casing 30 are assembled and connected.
- the conductive coil 60 includes a convoluted portion 61 , an external connection terminal 62 and an internal connection terminal 63 .
- the winding portion 61 has a ring structure as a whole.
- the convoluted portion 61 has an axis 61a. Along the radial direction of the spiral portion 61 , the main board 40 is located outside the spiral portion 61 .
- the external connection terminal 62 is connected to the spiral portion 61 and is located outside the spiral portion 61 .
- the radial direction of the winding portion 61 is perpendicular to the thickness direction X of the housing 30 .
- the external connection terminal 62 is electrically connected to the main board 40 .
- the inner connection terminal 63 is connected to the spiral portion 61 and located inside the spiral portion 61 .
- the conductive adapter 70 is electrically connected to the main board 40 and the internal connection terminal 63 .
- the conductive coil 60 is electrically connected to the main board 40 , so that the conductive coil 60 can exchange data with the main board 40 .
- the electronic device 10 of the embodiment of the present application includes an integrally arranged housing 30 and a conductive coil 60 .
- the conductive coil 60 is directly connected to the housing 30, so that the conductive coil 60 and the housing 30 form an integral structure.
- the connection force between the conductive coil 60 and the shell 30 is relatively high, and the connection reliability is high, so that the conductive coil 60 is not easy to swing and is disconnected from the shell 30, and when the shell 30 is pressed, the conductive coil 60 and the shell 30 can be Simultaneously deformed, there is no situation that the shell 30 squeezes the conductive coil 60 and causes the conductive coil 60 to wear, so as to ensure the normal use of the conductive coil 60 .
- the conductive coil 60 is disposed on the inner surface of the housing 30 , thereby reducing the space occupation rate of the conductive coil 60 in the electronic device 10 , which is beneficial to reduce the overall thickness of the electronic device 10 .
- the external connection terminal 62 of the conductive coil 60 is located outside the convoluted portion 61 , and the internal connection terminal 63 of the conductive coil 60 is located inside the convoluted portion 61 . Since the conductive coil 60 is integrated with the housing 30 , the connection between the internal connection terminal 63 and the main board 40 is blocked by the winding portion 61 .
- the main board 40 If a part of the main board 40 extends over the convoluted portion 61 along the height direction Y, and is electrically connected to the internal connection terminal 63, then in the thickness direction X, there is an overlapping area between the convoluted portion 61 and the main board 40, so that on the one hand, there is a convoluted portion 61
- the generated signal interferes with the signal of the main board 40 and affects the possibility of normal use of the main board 40; The possibility of a component shorting the conductive coil 60 or of the conductive coil 40 shorting different electronic components 50 of the motherboard 40 .
- the internal connection terminal 63 is led out through the conductive adapter 70 and connected to the main board 40, so that the main board 40 can be arranged outside the winding part 61, which is beneficial to reduce the signal interference between the conductive coil 60 and the main board 40, or , when the housing 30 is squeezed and deformed, the conductive coil 60 and the main board 40 may be worn or short-circuited, which improves the safety and reliability of the electronic device 10 .
- the electronic device 10 further includes a battery 80 .
- the inner surface 31 of the case 30 is disposed facing the battery 80 .
- the winding portion 61 is disposed corresponding to the battery 80 .
- the battery 80 is used to provide electric energy for the normal operation of the electronic device 10 .
- the conductive coil 60 of the embodiment of the present application is directly arranged on the casing 30, it is beneficial to increase the gap between the conductive coil 60 and the battery 80, thereby facilitating the arrangement of a heat sink between the conductive coil 60 and the battery 80, or,
- the gap between the conductive coil 60 and the battery 80 can be used as a buffer space when the battery 80 expands, which is beneficial to reduce the possibility of squeezing the conductive coil 60 or the casing 30 when the battery 80 expands.
- the conductive adapter 70 itself occupies a small space, so that the conductive adapter 70 can make better use of the space between the winding portion 61 and the battery 80 to electrically connect the internal connection terminal 63 and the main board 40, which can be beneficial in electronic When the overall thickness of the device 10 is small, the internal connection terminal 63 is electrically connected to the main board 40 .
- the battery 80 is not easily deformed by being squeezed by the conductive adapter 70 , which is beneficial to ensure the safety of the battery 80 during use.
- the convoluted portion 61 is helical.
- the winding portion 61 spirals around the axis 61a.
- the convoluted portion 61 may be in the shape of a rectangular helix or a circular helix.
- the winding portion 61 includes a coil having two or more turns. A predetermined distance is maintained between two adjacent turns of the coil.
- the winding part 61 may include a seven-turn coil.
- the conductive coil 60 includes lead wires 64 .
- the external connection terminal 62 is connected to the spiral portion 61 through a lead wire 64 .
- the inner connection terminal 63 is connected to the spiral portion 61 through a lead wire 64 .
- a conductive layer with a predetermined pattern is formed on the housing 30 using a conductive material.
- the conductive material is sprayed, coated or electroplated on the casing 30 by using a spraying process, a coating process or an electroplating process, so as to form a conductive layer with a predetermined pattern.
- the conductive layer forms the conductive coil 60 .
- a conductive material is used to form an integral conductive layer on the housing 30 .
- the conductive material is sprayed, coated or electroplated on the shell 30 by spraying process, coating process or electroplating process, so as to form an integral conductive layer.
- An integral conductive layer is patterned to form the conductive coil 60 .
- an integral conductive layer is etched by an etching process or cut by machining to pattern the conductive layer and form the conductive coil 60 .
- the conductive material may be selected from gold, silver, copper or copper alloys.
- the conductive adapter 70 is located on the side of the conductive coil 60 facing away from the inner surface 31 of the housing 30 . If the conductive coil 60 is located on the side of the conductive coil 60 facing the inner surface 31 of the housing 30 , it is necessary to place the conductive adapter 70 at a predetermined position on the housing 30 in advance.
- the pre-set conductive adapter 70 will have positional interference, resulting in the use of conductive materials to form the conductive coil 60 on the housing 30, the conductive coil 60 is not directly connected to the housing 30 in the area where the conductive adapter 70 is provided, so that on the one hand Because a part of the conductive coil 60 needs to be arranged on the side of the conductive adapter 70 facing away from the housing 30, the processing of the conductive coil 60 will be complicated;
- the direct contact with the shell 30 reduces the connection area between the conductive coil 60 and the shell 30 and reduces the connection force between the conductive coil 60 and the shell 30 .
- the conductive adapter 70 is arranged on the side of the conductive coil 60 facing away from the inner surface 31 of the casing 30, and a complete conductive coil 60 can be formed on the casing 30 with conductive material in advance, so that the conductive coil 60 is connected to the shell 30 in various areas, so as to ensure stable and reliable connection between the conductive coil 60 and the shell 30 . Then arrange the conductive adapter 70 from the side of the conductive coil 60 facing away from the inner surface 31 of the housing 30 , which is beneficial to reduce the difficulty of arranging the conductive adapter 70 .
- the width of the conductive coil 60 at the inner connection terminal 63 increases.
- the width of the inner connecting terminal 63 is relatively large, so that on the one hand, it is convenient for the conductive adapter 70 to be connected to the inner connecting terminal 63, reducing the gap between the conductive adapter 70 and the inner connecting terminal 63 due to the small width of the inner connecting terminal 63.
- the possibility of difficult connection on the other hand, it can help to increase the connection area between the conductive transition piece 70 and the internal connection terminal 63, thereby increasing the connection force between the conductive transition piece 70 and the internal connection terminal 63 , to reduce the possibility that the conductive transition piece 70 and the internal connection terminal 63 are likely to be separated.
- the width of the conductive transition piece 70 is smaller than or equal to the width of the inner connection terminal 63 .
- the width of the conductive coil 60 at the external connection terminal 62 is increased.
- the width of the external connection terminal 62 is large, so that on the one hand, it is convenient for the external connection terminal 62 to be connected to the main board 40, and the possibility of difficulty in connecting the external connection terminal 62 and the main board 40 due to the small width of the external connection terminal 62 is reduced.
- it can help to increase the connection area between the external connection terminal 62 and the main board 40, thereby increasing the connection force between the external connection terminal 62 and the main board 40, and reducing the separation between the external connection terminal 62 and the main board 40 possibility.
- the thickness of the conductive coil 60 at the inner connection terminal 63 is increased.
- the thickness direction of the conductive coil 60 is the same as the thickness direction X of the casing 30 .
- the thickness direction X of the housing 30 is the direction from the inner surface 31 to the outer surface 32 .
- the thickness of the internal connection terminal 63 is increased, so that the area of the internal connection terminal 63 facing away from the inner surface 31 of the housing 30 can be higher than the spiral portion 61, so that the conductive transfer piece 70 and the internal connection terminal 63 are located behind the surface.
- the minimum thickness of the conductive coil 60 may range from 0.02 mm to 0.05 mm.
- the conductive coil 60 is a flat structure.
- the cross-section of the conductive coil 60 is rectangular.
- the surface of the conductive coil 60 facing the housing 30 is flat, so that the contact area between the conductive coil 60 and the housing 30 is large, which is conducive to improving the connection force between the conductive coil 60 and the housing 30 and improving the connection between the conductive coil 60 and the housing 30 reliability and stability.
- the electronic device 10 further includes an insulating protection layer 90 .
- the insulating protective layer 90 covers the convoluted portion 61, so that on the one hand, the insulating protective layer 90 insulates and isolates the conductive adapter 70 and the convoluted portion 61, thereby avoiding the contact short circuit between the conductive adapter 70 and the convoluted portion 61;
- the insulating protection layer 90 can protect the winding portion 61, reduce the possibility of corrosion of the winding portion 61, and can also improve the reliability of the conductive coil 60 in a high-temperature and high-humidity environment.
- a coating is formed on the outside of the conductive coil 60 using a spraying process or a coating process.
- insulating protective layer 90 may be a ceramic coating.
- an ultraviolet curing process is used to form a coating on the outside of the conductive coil 60 .
- the insulating protective layer 90 may be a resin coating.
- the conductive adapter 70 is located on a side of the conductive coil 60 facing away from the inner surface 31 of the housing 30 .
- the insulating protection layer 90 can insulate and isolate the winding portion 61 from the conductive transition piece 70 , thereby reducing the possibility of the conductive transition piece 70 contacting the winding portion 61 and causing a short circuit.
- the insulating protection layer 90 may cover at least part of the conductive transition piece 70 and the convoluted portion 61 , so as to simultaneously form protection for the conductive transition piece 70 and the convoluted portion 61 .
- FIG. 8 schematically shows a partial cross-sectional structure of an electronic device 10 according to an embodiment.
- the main board 40 includes a first elastic piece 41 .
- the external connection terminal 62 includes a first contact 621 .
- the first elastic piece 41 is electrically connected to the first contact 621 , so as to realize the electrical connection between the external connection terminal 62 and the main board 40 .
- the first elastic piece 41 of the main board 40 abuts against the first contact 621 in a pressing manner, so that there is no need to separately set up a connecting piece to connect the main board 40 and the external connection terminal 62, which is beneficial to reduce the number of components used and reduce the It is difficult to assemble and saves the internal space of the electronic device 10 .
- the material of the first elastic piece 41 may be copper, copper alloy, aluminum or aluminum alloy.
- the conductive adapter 70 and the main board 40 are respectively provided with a board-to-board connector (board to board, BTB).
- BTB board to board
- the main board 40 includes a second elastic piece 42 .
- the conductive adapter 70 includes a second contact 71 .
- the second elastic piece 42 is electrically connected to the second contact 71 , so as to realize the electrical connection between the conductive adapter 70 and the main board 40 .
- the second elastic piece 42 of the main board 40 abuts against the second contact 71 in a pressing manner, so that there is no need to separately set up a connecting piece to connect the main board 40 and the conductive adapter 70, which is beneficial to reduce the number of parts used, The assembly difficulty is reduced, and the internal space of the electronic device 10 is saved.
- the material of the second elastic piece 42 may be copper, copper alloy, aluminum or aluminum alloy.
- the conductive transition piece 70 and the inner connection terminal 63 are a separate assembly structure.
- the conductive adapter 70 is an electronic device 50 manufactured separately. It can be connected to the internal connection terminal 63 by assembling.
- the conductive transition piece 70 is adhesively connected to the internal connection terminal 63 .
- the conductive adapter 70 and the internal connection terminal 63 are bonded and connected by using an adhesive with conductive properties, so as to ensure that the conductive adapter 70 and the internal connection terminal 63 are electrically connected to each other, and at the same time ensure that the conductive adapter 70 and the internal connection terminal 63 are connected to each other.
- the connection reliability of the connection terminal 63 Alternatively, the conductive transition piece 70 is welded to the internal connection terminal 63 .
- the material of the conductive adapter 70 and the internal connection terminal 63 can be the same, so that after the conductive adapter 70 and the internal connection terminal 63 are welded to each other, the connection force between the conductive adapter 70 and the internal connection terminal 63 is relatively large, which is beneficial to The possibility that the conductive adapter 70 and the internal connection terminal 63 are out of connection is reduced.
- the part of the conductive adapter 70 that exceeds the winding portion 61 can be bonded to the inner surface 31 of the housing 30 through an adhesive 100 to ensure that the position is fixed and difficult to shift.
- the adhesive member 100 may be double-sided tape or adhesive.
- the conductive adapter 70 is a flexible printed circuit (FPC).
- the conductive adapter 70 has good flexibility and can be freely bent and deformed, so that the internal space of the electronic device 10 can be fully utilized, which is beneficial to improving the space utilization rate of the electronic device 10 .
- the conductive coil 60 is formed on the shell 30 , one end of the conductive adapter 70 can be connected to the internal connection terminal 63 , and the other end can be connected to the main board 40 .
- the internal connecting terminal 63 is led out through the conductive adapter 70 and is electrically connected to the main board 40 .
- FIG. 10 schematically shows a partial cross-sectional structure of an electronic device 10 according to an embodiment.
- the housing 30 includes a recess 33 .
- the inner surface 31 of the housing 30 is provided with a recess 33 .
- At least part of the conductive coil 60 is located in the recess 33, so that on the premise that the thickness of the conductive coil 60 does not change, it can help reduce the space occupancy rate of the conductive coil 60, reduce the overall thickness of the electronic device 10, or, in the electronic device 10 On the premise that the overall thickness does not change, a conductive coil 60 with a larger thickness can be provided.
- the depth of the recess 33 is greater than or equal to the thickness of the conductive coil 60 .
- FIG. 11 schematically shows a partial cross-sectional structure of an electronic device 10 according to an embodiment.
- the shape of the recess 33 matches the shape of the conductive coil 60 .
- the recess 33 extends along a predetermined trajectory.
- a conductive material may be correspondingly disposed in the region of the concave portion 33 to form the conductive coil 60 .
- FIG. 12 schematically shows the connection structure of the housing 30 , the conductive coil 60 and the main board 40 of the electronic device 10 .
- the structure of the electronic device 10 in the embodiment shown in FIG. 12 is the same as the structure of the electronic device 10 in the embodiments shown in FIGS. 4 to 11 .
- the conductive transition piece 70 is a metal conductive layer.
- the conductive material is formed into the conductive adapter 70 by using a coating process or an electroplating process.
- the material of the conductive adapter 70 and the material of the conductive coil 60 may be the same.
- Conductive material is used to form the conductive coil 60 on the housing 30 in advance, and then starting from the internal connection terminal 63, a conductive transition piece 70 is formed using conductive material, so that there is no need for bonding or bonding between the conductive transition piece 70 and the internal connection terminal 63.
- the connection is realized by welding.
- the conductive adapter 70 and the internal connection terminal 63 are connected by welding, if the welding position is shifted or the welding depth is large, the outer shell 30 may be warped, deformed or otherwise have poor appearance. If the shell 30 is welded through during welding, the shell 30 will be scrapped.
- connection force between the conductive adapter 70 and the inner connection terminal 63 When the conductive adapter 70 and the inner connection terminal 63 are connected by bonding, the selection of the adhesive material or the choice of the bonding position will affect the connection force between the conductive adapter 70 and the inner connection terminal 63 . If the bonding material is improperly selected or the bonding position is shifted, the connection force between the conductive adapter 70 and the internal connection terminal 63 may be weak, resulting in a deviation in the connection reliability between the conductive adapter 70 and the internal connection terminal 63 , prone to separation.
- FIG. 13 schematically shows a partial cross-sectional structure of an electronic device 10 according to an embodiment.
- the conductive adapter 70 and the conductive coil 60 are integrally formed.
- the conductive adapter 70 and the inner connection terminal 63 are integrally formed, so that the two have high connection strength and are not easy to be separated, and do not need to be assembled, and do not need to be connected by bonding or welding.
- the conductive coil 60 and the conductive adapter 70 can be formed by one-time processing using conductive materials. There is a continuous transition between the conductive coil 60 and the conductive adapter 70 .
- the external connection terminal 62 is taken as the starting position, and the end of the conductive adapter 70 used to connect with the main board 40 is used as the ending position, and the conductive material is sprayed from the starting position to the ending position by using a spraying process or a coating process.
- the conductive coil 60 and the conductive adapter 70 are formed along a predetermined trajectory.
- the conductive adapter 70 includes a second contact 71 .
- the main board 40 includes a second elastic piece 42 .
- the second elastic piece 42 presses against the second contact 71 to realize the electrical connection between the conductive adapter 70 and the main board 40 . Since the conductive adapter 70 is formed on the shell 30 , the shell 30 with higher rigidity can be used to bear the resilience of the second elastic piece 42 . The shell 30 with higher rigidity is less likely to be deformed, which can reduce the possibility that the second elastic piece 42 and the second contact 71 are out of contact due to deformation of the shell 30 .
- each turn of the coil of the winding portion 61 may include a conductive metal layer.
- a conductive metal layer is wound along a predetermined track to form the winding portion 61 .
- each turn of the coil of the convoluted portion 61 may include two convoluted conductive metal layers 65 .
- the two conductive metal layers 65 are parallel to each other, and the two conductive metal layers 65 are simultaneously wound along a predetermined track to form the winding portion 61 .
- each turn of the coil includes two spirally wound conductive metal layers 65 , which can help reduce the inductive resistance and improve the efficiency of wireless charging.
- the material of the housing 30 can be selected from ceramics, metal, plastic, glass or fiberglass.
- connection should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements.
- plural herein means two or more.
- the term “and/or” in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations.
- the character "/" in this paper generally indicates that the contextual objects are an “or” relationship; in the formula, the character "/" indicates that the contextual objects are a "division" relationship.
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Abstract
本申请实施例提供一种电子设备。电子设备至少包括外壳、主板、导电线圈和导电转接件。外壳包括相对设置的内表面和外表面。主板设置于内表面的一侧。导电线圈设置于内表面,并且与外壳一体化设置。导电线圈包括旋绕部、外连接端子和内连接端子。沿旋绕部的径向,主板位于旋绕部的外侧。外连接端子与旋绕部相连并且位于旋绕部外侧。外连接端子与主板电连接。内连接端子与旋绕部相连并且位于旋绕部的内侧。导电转接件电连接主板与内连接端子。本申请实施例的电子设备能够降低因导线线圈与主板支架连接可靠性较低而导致导电线圈存在无法正常使用情况的可能性。
Description
本申请要求于2021年10月28日提交中国国家知识产权局、申请号为202111264152.9、申请名称为“电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请实施例涉及终端技术领域,特别涉及一种电子设备。
随着智能手机或平板电脑(portable equipment,PAD)等电子设备的爆发式增长,电子设备的功能越来越多。例如电子设备具有无线充电功能或者近场通信(Near Field Communication,NFC)功能。无线充电功能使得电子设备不需要连接充电线即可进行充电,从而电子设备的充电过程简单且方便。近场通信功能使得用户在乘坐公共交通或打开房门时,不需要掏取实体卡片,使用手机即可进行支付或解锁,从而有效提高便利性。电子设备中,需要设置相应的导电线圈才能够实现无线充电功能或者近场通信功能。相关技术中,导电线圈采用铜线旋绕加工形成。电子设备包括外壳、主板和主板支架。主板支架设置于主板和外壳之间。单独设置的导电线圈需要粘接于主板支架上以固定导电线圈。导电线圈与主板电连接。导线线圈与主板支架连接过程复杂、并且导线线圈与主板支架存在连接可靠性较低的问题,对导电线圈的正常使用会造成不良影响。
发明内容
本申请实施例提供一种电子设备,能够降低因导线线圈与主板支架连接可靠性较低而导致导电线圈存在无法正常使用情况的可能性。
本申请第一方面提供一种电子设备。电子设备至少包括外壳、主板、导电线圈和导电转接件。外壳包括相对设置的内表面和外表面。主板设置于内表面的一侧。导电线圈设置于内表面,并且与外壳一体化设置。导电线圈包括旋绕部、外连接端子和内连接端子。沿旋绕部的径向,主板位于旋绕部的外侧。外连接端子与旋绕部相连并且位于旋绕部外侧。外连接端子与主板电连接。内连接端子与旋绕部相连并且位于旋绕部的内侧。导电转接件电连接主板与内连接端子。
本申请实施例的电子设备包括一体化设置的外壳和导电线圈。导电线圈与外壳直接相连,从而导电线圈和外壳形成一个整体结构。导电线圈与外壳之间的连接力较大、连接可靠性较高。导电线圈不容易相对外壳发生摆动并与外壳脱离连接状态,从而有利于降低因导线线圈与主板支架连接可靠性较低而导致导电线圈存在无法正常使用情况的可能性。由于导电线圈与外壳相连以固定导电线圈,因此导电线圈不需要与主板支架或副板支架相连,从而不需要将导电线圈与主板支架或者导电线圈与副板支架进行连接操作,减少了装配工序。
在一种可能的实施方式中,使用导电材料在外壳上形成导电层,从而导电层形成 导电线圈。
在一种可能的实施方式中,使用导电材料在外壳上形成导电层,对导电层图案化处理以形成导电线圈。
在一种可能的实施方式中,导电转接件位于导电线圈背向内表面的一侧。将导电转接件设置于导电线圈背向外壳的内表面的一侧的方式,可以预先使用导电材料在外壳上形成完整的导电线圈,以使导电线圈在各个区域均与外壳相连,从而保证导电线圈和外壳连接稳定、可靠。然后从导电线圈背向外壳的内表面的一侧布置导电转接件,有利于降低导电转接件的布置难度。
在一种可能的实施方式中,导电线圈在内连接端子处的厚度增大。内连接端子的厚度增大,使得内连接端子背向外壳的内表面的区域可以高于旋绕部,从而导电转接件与内连接端子背向内表面的区域相连时,导电转接件与旋绕部之间可以留有间隙,降低导电转接件与旋绕部之间存在位置干涉的可能性,也有利于降低导电转接件与旋绕部发生短路的可能性。
在一种可能的实施方式中,导电线圈在内连接端子处的宽度增大。内连接端子的宽度较大,从而一方面,便于导电转接件与内连接端子相连,降低因内连接端子的宽度较小而导致导电转接件与内连接端子之间连接难度大的可能性;另一方面,可以有利于增大导电转接件和内连接端子之间的连接面积,从而增大导电转接件和内连接端子之间的连接力,降低导电转接件和内连接端子易于发生分离的可能性。
在一种可能的实施方式中,外壳包括凹部。外壳的内表面设置凹部。导电线圈的至少部分位于凹部内。在导电线圈的厚度不改变的前提下,可以有利于减小导电线圈的空间占用率,降低电子设备的整体厚度,或者,在电子设备整体厚度不改变的前提下,可以设置厚度更大的导电线圈。
在一种可能的实施方式中,导电线圈的形状与凹部的形状相匹配。
在一种可能的实施方式中,电子设备还包括绝缘防护层。绝缘防护层覆盖旋绕部。绝缘防护层绝缘隔离开导电转接件和旋绕部,从而可以避免导电转接件和旋绕部发生接触短路的情况。绝缘防护层可以对旋绕部形成防护,降低旋绕部发生腐蚀的可能性,同时也可以提高导电线圈在高温高湿环境下的可靠性。
在一种可能的实施方式中,主板包括第一弹片。外连接端子包括第一触点。第一弹片和第一触点电连接。主板的第一弹片通过抵压的方式抵接于第一触点,从而不需要额外单独地设置连接件以将主板和外连接端子连接,有利于减少零部件使用数量,降低组装难度,节省电子设备的内部空间。
在一种可能的实施方式中,主板包括第二弹片,导电转接件包括第二触点,第二弹片和第二触点电连接。主板的第二弹片通过抵压的方式抵接于第二触点,从而不需要额外单独地设置连接件以将主板和导电转接件连接,有利于减少零部件使用数量,降低组装难度,节省电子设备的内部空间。
在一种可能的实施方式中,导电转接件与内连接端子为分体组装结构。
在一种可能的实施方式中,导电转接件与内连接端子粘接或焊接。导电转接件和内连接端子相互粘接焊接后,导电转接件和内连接端子之间的连接力较大,有利于降低导电转接件和内连接端子脱离连接状态的可能性。
在一种可能的实施方式中,导电转接件为柔性电路板。导电转接件具有良好的柔韧性,可自由弯曲变形,从而可以充分利用电子设备的内部空间,有利于提高电子设备的空间利用率。
在一种可能的实施方式中,导电转接件与导电线圈为一体成型结构。预先在外壳上使用导电材料形成导电线圈和导电转接件,从而导电转接件和内连接端子之间不需要通过粘接或焊接的方式实现连接。导电线圈和导电转接件连接强度大,不易发生分离,并且不需要进行组装工序,不需要通过例如粘接或焊接方式相连。
在一种可能的实施方式中,旋绕部为螺旋状。
在一种可能的实施方式中,外壳的材料选自陶瓷、金属、塑料、玻璃或玻璃纤维。
在一种可能的实施方式中,电子设备还包括电池。外壳的内表面面向电池设置。旋绕部对应电池设置。导电线圈直接设置于外壳,因此可以有利于增大导电线圈和电池之间的间隙,从而有利于在导电线圈和电池之间设置散热片,或者,导电线圈和电池之间的间隙可以作为电池发生膨胀时的缓冲空间,有利于降低电池发生膨胀时挤压导电线圈或外壳的可能性。
图1为电子设备的结构示意图;
图2为相关技术的电子设备的局部分解结构示意图;
图3为本申请一实施例的电子设备的局部分解结构示意图;
图4为本申请一实施例的电子设备的外壳、导电线圈和主板的连接结构示意图;
图5为图4中沿P-P方向的剖视结构示意图;
图6为图5中A处放大示意图;
图7为图5中B处放大示意图;
图8为图4中沿Q-Q方向的剖视结构示意图;
图9为图8中C处放大示意图;
图10为本申请另一实施例的电子设备的局部剖视结构示意图;
图11为本申请另一实施例的电子设备的局部剖视结构示意图;
图12为本申请另一实施例的电子设备的外壳、导电线圈和主板的连接结构示意图;
图13为图12中沿R-R方向的剖视结构示意图;
图14为图13中D处放大示意图;
图15为图13中E处放大示意图;
图16为本申请再一实施例的电子设备的局部剖视结构示意图。
标记说明:
10、电子设备;20、显示组件;30、外壳;31、内表面;32、外表面;33、凹部;40、主板;41、第一弹片;42、第二弹片;50、电子器件;60、导电线圈;61、旋绕部;61a、轴线;62、外连接端子;621、第一触点;63、内连接端子;64、引出线;65、导电金属层;70、导电转接件;71、第二触点;80、电池;90、绝缘防护层;100、粘接件;200、主板支架;300、导电线圈;400、背胶件;X、厚度方向;Y、高度方向。
本申请实施例中的电子设备可以称为用户设备(user equipment,UE)或终端(terminal)等,例如,电子设备可以为平板电脑(portable android device,PAD)、个人数字处理(personal digital assistant,PDA)、具有无线通信功能的手持设备、计算设备、车载设备、可穿戴设备、虚拟现实(virtual reality,VR)终端设备、增强现实(augmented reality,AR)终端设备、工业控制(industrial control)中的无线终端、无人驾驶(self driving)中的无线终端、远程医疗(remote medical)中的无线终端、智能电网(smart grid)中的无线终端、运输安全(transportation safety)中的无线终端、智慧城市(smart city)中的无线终端、智慧家庭(smart home)中的无线终端等移动终端或固定终端。本申请实施例中对终端设备的形态不做具体限定。
本申请实施例中,图1示意性地显示了一实施例的电子设备10的结构。参见图1所示,以电子设备10为具有无线通信功能的手持设备为例进行说明。无线通信功能的手持设备例如可以是手机。
图2示意性地显示了相关技术中的电子设备10的局部分解结构。参见图2所示,电子设备10包括显示组件20、外壳30、主板40和电子器件50。
显示组件20具有用于显示图像信息的显示区域。显示组件20安装于外壳30,并且显示组件20的显示区域外露以便于向用户呈现图像信息。外壳30包括沿自身厚度方向相对设置的外表面和内表面。用户在电子设备10的外部可以观察到外壳30的外表面。主板40设置于外壳30的内表面的一侧,从而用户在电子设备10的外部不易观察到主板40。
电子器件50设置于主板40。主板40可以是印制电路板(Printed Circuit Board,PCB)。电子器件50通过焊接工艺焊接于主板40。电子器件50包括但不限于中央处理器(Central Processing Unit,CPU)、智能算法芯片或电源管理芯片(Power Management IC,PMIC)。
电子设备10还包括主板支架200。主板支架200可以设置于外壳30和主板40之间。主板支架200可以为主板40提供支撑。主板支架200的材料可以是塑料。
电子设备10还包括导电线圈300和背胶件400。导电线圈300与主板40电连接,从而可以实现导电线圈300与主板40之间的数据交互。电子设备10中设置导电线圈300后,可以实现相应的功能,例如但不限于无线充电功能和近场通信功能。导电线圈300为单独设置的结构件。导电线圈300可以是使用铜线并且采用旋绕方式加工制造而成。为了避免完成旋绕后的导电线圈300在弹性回复力的作用下回弹变得松散,导电线圈300粘接于背胶件400上进行固定。导电线圈300应用于电子设备10时,导电线圈300可以通过背胶件400与主板支架200粘接以固定导电线圈300。由于导电线圈300和主板支架200之间的粘接面积较小,因此导电线圈300和主板支架200之间的连接力较小、连接可靠性较低,从而存在导电线圈300与主板支架200脱离连接状态的可能性,对导电线圈300的正常使用造成不良影响。例如,在导电线圈300受到外力作用而相对主板支架200发生摆动时,导电线圈300容易与主板支架200脱离连接状态而处于可以自由晃动的状态。
电子设备10还包括副板支架(图中未示出)。沿电子设备10的高度方向Y,副板支架与主板支架200间隔设置。为了提高导电线圈300的位置稳定性,导电线圈300上远离主板支架200的部分可以通过绝缘件和粘接件粘接于副板支架。然而,导电线圈300与副板支架之间相连的方式,使用的绝缘件和粘接件会侵占电子设备10的内部空间,并且将导电线圈300、绝缘件、粘接件和副板支架连接过程复杂,装配工序较多。
另外,导电线圈300通过背胶件400与主板支架200粘接固定后,导电线圈300与外壳30之间具有间隙,从而导电线圈300占用了较多的内部空间。在外壳30受到外力挤压而朝向导电线圈300发生变形时,外壳30挤压导电线圈300而导致导电线圈300发生磨损情况,对导电线圈300的正常使用造成不良影响。
图3示意性地显示了本申请实施例的电子设备10的局部分解结构。图4示意性地显示了电子设备10的外壳30、导电线圈60和主板40的连接结构。参见图3和图4所示,本申请实施例提供的电子设备10,导电线圈60设置于外壳30的内表面,并且与外壳30一体化设置,从而导电线圈60和外壳30形成一个整体结构。导电线圈60与外壳30之间的连接力较大、连接可靠性较高,从而导电线圈60不容易发生摆动并与外壳30脱离连接状态,并且外壳30受到按压时,导电线圈60和外壳30可以同时变形,不存在相互磨损的情况,以此保证导电线圈60的正常使用。
下面对本申请实施例提供的电子设备10的实现方式进行阐述。
图5示意性地显示了一实施例的电子设备10的局部剖视结构。参见图3至图5所示,本申请实施例的电子设备10包括外壳30、主板40、导电线圈60和导电转接件70。外壳30包括内表面31和外表面32。沿外壳30的厚度方向X,内表面31和外表面32相对设置。主板40设置于外壳30的内表面31的一侧。导电线圈60设置于外壳30的内表面31。导电线圈60与外壳30一体化设置。需要说明的是,导电线圈60与外壳30一体化设置指的是导电线圈60直接加工形成于外壳30,使得导电线圈60和外壳30两者形成一个整体结构,而不需要额外单独地设置连接件将导电线圈60和外壳30装配连接。导电线圈60包括旋绕部61、外连接端子62和内连接端子63。旋绕部61整体呈环状结构。旋绕部61具有轴线61a。沿旋绕部61的径向,主板40位于旋绕部61的外侧。外连接端子62与旋绕部61相连并且位于旋绕部61外侧。旋绕部61的径向与外壳30的厚度方向X相垂直。外连接端子62与主板40电连接。内连接端子63与旋绕部61相连并且位于旋绕部61内侧。导电转接件70电连接主板40和内连接端子63。导电线圈60和主板40电连接,从而导电线圈60可以与主板40之间进行数据交互。
本申请实施例的电子设备10包括一体化设置的外壳30和导电线圈60。导电线圈60与外壳30直接相连,从而导电线圈60和外壳30形成一个整体结构。导电线圈60与外壳30之间的连接力较大、连接可靠性较高,从而导电线圈60不容易发生摆动并与外壳30脱离连接状态,并且外壳30受到按压时,导电线圈60和外壳30可以同时变形,不存在外壳30挤压导电线圈60而导致导电线圈60发生磨损的情况,以此保证导电线圈60的正常使用。导电线圈60和外壳30之间也不需要额外单独地设置连接件,并且导电线圈60也不需要与主板支架或副板支架相连,从而有利于减少装配工序。导 电线圈60设置于外壳30的内表面,从而可以降低导电线圈60在电子设备10的内部空间占用率,有利于降低电子设备10的整体厚度。
导电线圈60的外连接端子62位于旋绕部61的外侧,而导电线圈60的内连接端子63位于旋绕部61的内侧。由于导电线圈60与外壳30一体化设置,因此内连接端子63与主板40之间受到旋绕部61的阻隔。如果将主板40的一部分沿高度方向Y延伸越过旋绕部61,并与内连接端子63电连接,则在厚度方向X上,旋绕部61和主板40存在重叠区域,从而一方面,存在旋绕部61产生的信号干扰到主板40的信号而影响主板40正常使用的可能性;另一方面,外壳30受到挤压变形时,导电线圈60会与主板40之间发生磨损,进一步存在主板40上的导电元件将导电线圈60短路或者导电线圈40将主板40的不同电子器件50短路的可能性。本申请通过导电转接件70将内连接端子63引出并且和主板40进行连接,从而可以将主板40设置于旋绕部61的外侧,有利于降低导电线圈60和主板40之间存在信号干扰,或者,外壳30受到挤压变形时,导电线圈60会与主板40之间发生磨损、短路的可能性,提高电子设备10的使用安全性和可靠性。
在一些可实现的方式中,电子设备10还包括电池80。外壳30的内表面31面向电池80设置。旋绕部61对应电池80设置。电池80用于为电子设备10的正常运行提供电能。由于本申请实施例的导电线圈60直接设置于外壳30,因此可以有利于增大导电线圈60和电池80之间的间隙,从而有利于在导电线圈60和电池80之间设置散热片,或者,导电线圈60和电池80之间的间隙可以作为电池80发生膨胀时的缓冲空间,有利于降低电池80发生膨胀时挤压导电线圈60或外壳30的可能性。导电转接件70自身占用空间小,从而导电转接件70可以更好地利用旋绕部61和电池80之间的空间,以将内连接端子63和主板40电连接,从而可以有利于在电子设备10整体厚度较小的情况下,实现内连接端子63和主板40电连接。另外,电池80不易受到导电转接件70挤压而发生变形,有利于保证电池80使用过程安全性。
在一些可实现的方式中,旋绕部61为螺旋状。旋绕部61环绕轴线61a螺旋。例如,旋绕部61可以为矩形螺旋状或圆形螺旋状。旋绕部61包括两匝以上的线圈。相邻两匝线圈之间保持预定间距。示例性地,导电线圈60用于实现无线充电功能时,为了满足无线充电功能的要求,旋绕部61可以包括七匝线圈。
在一些示例中,外连接端子62与旋绕部61的端部之间具有预定距离。导电线圈60包括引出线64。外连接端子62通过引出线64与旋绕部61相连。内连接端子63与旋绕部61的端部之间具有预定距离。内连接端子63通过引出线64与旋绕部61相连。
在一些可实现的方式中,使用导电材料在外壳30上形成具有预定图案的导电层。沿预定轨迹,采用喷涂工艺、涂覆工艺或电镀工艺将导电材料喷涂、涂覆或电镀于外壳30上,从而形成具有预定图案的导电层。导电层形成导电线圈60。在另一些可实现的方式中,使用导电材料在外壳30上形成一整体的导电层。采用喷涂工艺、涂覆工艺或电镀工艺将导电材料喷涂、涂覆或电镀于外壳30上,从而形成一整体的导电层。对一整体的导电层图案化处理以形成导电线圈60。示例性,采用蚀刻工艺蚀刻一整体的导电层或者采用机加工方式切削一整体的导电层,以使导电层图案化并形成导电线 圈60。
在一些示例中,导电材料可以选自金、银、铜或铜合金。
在一些可实现的方式中,导电转接件70位于导电线圈60背向外壳30的内表面31的一侧。如果导电线圈60位于导电线圈60面向外壳30的内表面31的一侧,则需要预先将导电转接件70放置于外壳30上的预定位置。预先设置的导电转接件70会存在位置干涉,导致使用导电材料在外壳30上形成导电线圈60时,在设置导电转接件70的区域,导电线圈60未与外壳30直接相连,从而一方面,由于导电线圈60的一部分需要设置于导电转接件70背向外壳30的一侧,从而会造成导电线圈60加工过程复杂;另一方面,由于在导电转接件70处,导电线圈60未与外壳30直接接触,从而减小了导电线圈60与外壳30的连接面积,降低了导电线圈60和外壳30的连接力。本实施例中,将导电转接件70设置于导电线圈60背向外壳30的内表面31的一侧的方式,可以预先使用导电材料在外壳30上形成完整的导电线圈60,以使导电线圈60在各个区域均与外壳30相连,从而保证导电线圈60和外壳30连接稳定、可靠。然后从导电线圈60背向外壳30的内表面31的一侧布置导电转接件70,有利于降低导电转接件70的布置难度。
在一些可实现的方式中,参见图4所示,导电线圈60在内连接端子63处的宽度增大。内连接端子63的宽度较大,从而一方面,便于导电转接件70与内连接端子63相连,降低因内连接端子63的宽度较小而导致导电转接件70与内连接端子63之间连接难度大的可能性;另一方面,可以有利于增大导电转接件70和内连接端子63之间的连接面积,从而增大导电转接件70和内连接端子63之间的连接力,降低导电转接件70和内连接端子63易于发生分离的可能性。在一些示例中,导电转接件70的宽度小于或等于内连接端子63的宽度。
在一些可实现的方式中,参见图4所示,导电线圈60在外连接端子62处的宽度增大。外连接端子62的宽度较大,从而一方面,便于外连接端子62与主板40相连,降低因外连接端子62的宽度较小而导致外连接端子62与主板40之间连接难度大的可能性;另一方面,可以有利于增大外连接端子62与主板40之间的连接面积,从而增大外连接端子62与主板40之间的连接力,降低外连接端子62与主板40易于发生分离的可能性。
在一些可实现的方式中,参见图6所示,导电线圈60在内连接端子63处的厚度增大。导电线圈60的厚度方向与外壳30的厚度方向X相同。外壳30的厚度方向X为从内表面31至外表面32的方向。相对旋绕部61的厚度,内连接端子63的厚度增大,使得内连接端子63背向外壳30的内表面31的区域可以高于旋绕部61,从而导电转接件70与内连接端子63背向内表面31的区域相连时,导电转接件70与旋绕部61之间可以留有间隙,降低导电转接件70与旋绕部61之间存在位置干涉的可能性,也有利于降低导电转接件70与旋绕部61发生短路的可能性。示例性地,导电线圈60的最小厚度的取值范围可以为0.02毫米至0.05毫米。
在一些示例中,导电线圈60为扁平状结构。例如,导电线圈60的横截面为矩形。导电线圈60面向外壳30的表面为平面,从而导电线圈60和外壳30的接触面积较大,有利于提高导电线圈60和外壳30之间的连接力,提升导电线圈60和外壳30之间的 连接可靠性和稳定性。
在一些可实现的方式中,参见图5至图7所示,电子设备10还包括绝缘防护层90。绝缘防护层90覆盖旋绕部61,从而一方面,绝缘防护层90绝缘隔离开导电转接件70和旋绕部61,从而可以避免导电转接件70和旋绕部61发生接触短路的情况;另一方面,绝缘防护层90可以对旋绕部61形成防护,降低旋绕部61发生腐蚀的可能性,同时也可以提高导电线圈60在高温高湿环境下的可靠性。示例性地,采用喷涂工艺或涂覆工艺在导电线圈60外部形成涂层。例如,绝缘防护层90可以是陶瓷涂层。或者,采用紫外线固化工艺在导电线圈60外部形成涂层。例如,绝缘防护层90可以是树脂涂层。
在一些示例中,导电转接件70位于导电线圈60背向外壳30的内表面31的一侧。绝缘防护层90可以将旋绕部61和导电转接件70绝缘隔离开,从而降低导电转接件70和旋绕部61接触并发生短路的可能性。
在一些示例中,绝缘防护层90可以将导电转接件70的至少部分以及旋绕部61覆盖,从而可以对导电转接件70和旋绕部61同时形成防护。
在一些可实现的方式中,图8示意性地显示了一实施例的电子设备10的局部剖视结构。参见图8和图9所示,主板40包括第一弹片41。外连接端子62包括第一触点621。第一弹片41和第一触点621电连接,从而实现外连接端子62和主板40电连接。主板40的第一弹片41通过抵压的方式抵接于第一触点621,从而不需要额外单独地设置连接件以将主板40和外连接端子62连接,有利于减少零部件使用数量,降低组装难度,节省电子设备10的内部空间。示例性地,第一弹片41的材料可以是铜、铜合金、铝或铝合金。
在一些可实现的方式中,导电转接件70和主板40分别设置有一个板对板连接器(board to board,BTB)。通过两个板对板连接器的相互插接以实现导电转接件70和主板40相互连接。
在另一些可实现的方式中,主板40包括第二弹片42。导电转接件70包括第二触点71。第二弹片42和第二触点71电连接,从而实现导电转接件70和主板40电连接。主板40的第二弹片42通过抵压的方式抵接于第二触点71,从而不需要额外单独地设置连接件以将主板40和导电转接件70连接,有利于减少零部件使用数量,降低组装难度,节省电子设备10的内部空间。示例性地,第二弹片42的材料可以是铜、铜合金、铝或铝合金。
在一些可实现的方式中,导电转接件70与内连接端子63为分体组装结构。导电转接件70为单独加工制造的电子器件50。通过组装的方式可以与内连接端子63相连。示例性地,导电转接件70与内连接端子63粘接连接。例如,使用具有导电性能的粘接胶将导电转接件70和内连接端子63粘接连接,从而保证导电转接件70和内连接端子63相互导通,同时保证导电转接件70和内连接端子63的连接可靠性。或者,导电转接件70与内连接端子63焊接连接。导电转接件70和内连接端子63的材料可以相同,从而导电转接件70和内连接端子63相互焊接后,导电转接件70和内连接端子63之间的连接力较大,有利于降低导电转接件70和内连接端子63脱离连接状态的可能性。在一些示例中,参见图7所示,导电转接件70上超出旋绕部61的部分可以通 过粘接件100粘接于外壳30的内表面31,以保证位置固定不易发生偏移。粘接件100可以是双面胶带或粘接胶。在一些示例中,导电转接件70为柔性电路板(Flexible Printed Circuit,FPC)。导电转接件70具有良好的柔韧性,可自由弯曲变形,从而可以充分利用电子设备10的内部空间,有利于提高电子设备10的空间利用率。在外壳30上加工形成导电线圈60后,可以将导电转接件70的一端与内连接端子63相连,另一端与主板40相连。内连接端子63通过导电转接件70引出并且与主板40实现电连接。
在一些可实现的方式中,图10示意性地显示了一实施例的电子设备10的局部剖视结构。参见图10所示,外壳30包括凹部33。外壳30的内表面31设置凹部33。导电线圈60的至少部分位于凹部33内,从而在导电线圈60的厚度不改变的前提下,可以有利于减小导电线圈60的空间占用率,降低电子设备10的整体厚度,或者,在电子设备10整体厚度不改变的前提下,可以设置厚度更大的导电线圈60。示例性地,凹部33的深度大于或等于导电线圈60的厚度。导电线圈60整体可以位于凹部33内。在一些示例中,凹部33的数量为一个。导电线圈60整体可以位于凹部33的底壁上。在另一些示例中,图11示意性地显示了一实施例的电子设备10的局部剖视结构。参见图11所示,凹部33的形状和导电线圈60的形状相匹配。凹部33沿预定轨迹延伸。可以在凹部33区域对应设置导电材料以形成导电线圈60。
在一些可实现的方式中,图12示意性地显示了电子设备10的外壳30、导电线圈60和主板40的连接结构。图12所示实施例的电子设备10的结构与图4至图11所示实施例的电子设备10的结构,相同之处这里不再赘述,这里主要描述不同之处。参见图12所示,导电转接件70为金属导电层。以内连接端子63为起始点,采用涂覆工艺或电镀工艺将导电材料形成导电转接件70。导电转接件70的材料和导电线圈60的材料可以相同。预先在外壳30上使用导电材料形成导电线圈60,再从内连接端子63开始,使用导电材料形成导电转接件70,从而导电转接件70和内连接端子63之间不需要通过粘接或焊接的方式实现连接。导电转接件70和内连接端子63之间采用焊接方式相连时,如果焊接位置出现偏移或焊接深度较大,可能会使得外壳30出现翘曲、变形等外观不良的情况。如果焊接过程中焊穿外壳30,则会导致外壳30报废。导电转接件70和内连接端子63之间采用粘接方式相连时,粘接材料的选用或者粘接位置的选择都会影响导电转接件70和内连接端子63之间的连接力。如果粘接材料选用不当或者粘接位置出现偏移,可能会导致导电转接件70和内连接端子63之间的连接力偏弱,使得导电转接件70和内连接端子63连接可靠性偏差,易于发生分离。
在一些示例中,图13示意性地显示了一实施例的电子设备10的局部剖视结构。参见图13和图14所示,导电转接件70和导电线圈60为一体成型结构。导电转接件70与内连接端子63为一体成型结构,从而两者连接强度大,不易发生分离,并且不需要进行组装工序,不需要通过例如粘接或焊接方式相连。可以使用导电材料一次加工成型导电线圈60和导电转接件70。导电线圈60和导电转接件70之间连续过渡。示例性地,以外连接端子62为起始位置,以导电转接件70上用于与主板40相连的端部为终止位置,采用喷涂工艺或涂覆工艺将导电材料从起始位置至终止位置沿预定轨迹形成导电线圈60和导电转接件70。
在一些示例中,参见图15所示,导电转接件70包括第二触点71。主板40包括第二弹片42。第二弹片42抵压于第二触点71,以实现导电转接件70和主板40电连接。由于导电转接件70形成于外壳30上,因此刚度较大的外壳30可以用于承载第二弹片42的回弹力。刚度较大的外壳30不易发生变形,可以降低因外壳30发生变形而导致第二弹片42和第二触点71脱离抵接状态的可能性。
在一些可实现的方式中,旋绕部61的每匝线圈可以包括一个导电金属层。一个导电金属层沿预定轨迹旋绕形成旋绕部61。在另一些可实现的方式中,参见图16所示,旋绕部61的每匝线圈可以包括两个旋绕的导电金属层65。两个导电金属层65相互平行,并且两个导电金属层65同时沿预定轨迹旋绕形成旋绕部61。在导电线圈60用于实现无线充电功能时,每匝线圈包括两条旋绕的导电金属层65的设置方式,可以有利于降低感应电阻,提高无线充电效率。
在一些可实现的方式中,外壳30的材料可以选自陶瓷、金属、塑料、玻璃或玻璃纤维。
在本申请实施例的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应作广义理解,例如,可以是固定连接,也可以是通过中间媒介间接相连,可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请实施例中的具体含义。
在本申请实施例或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请实施例的限制。在本申请实施例的描述中,“多个”的含义是两个或两个以上,除非是另有精确具体地规定。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的本申请实施例的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。
此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、***、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本文中的术语“多个”是指两个或两个以上。本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系;在公式中,字符“/”,表示前后关联对象是一种“相除”的关系。
可以理解的是,在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区分,并不用来限制本申请的实施例的范围。可以理解的是,在本申请的实施例中,上述各过程的序号的大小并不意味着执行顺序的先后,各过程的执行顺序应以其功能和内在逻辑确定,而不应对本申请的实施例的实施过程构成任何限定。
Claims (33)
- 一种电子设备(10),其特征在于,至少包括:外壳(30),包括相对设置的内表面(31)和外表面(32);主板(40),设置于所述内表面(31)的一侧;导电线圈(60),设置于所述内表面(31),并且与所述外壳(30)一体化设置,所述导电线圈(60)包括旋绕部(61)、外连接端子(62)和内连接端子(63),沿所述旋绕部(61)的径向,所述主板(40)位于所述旋绕部(61)的外侧,所述外连接端子(62)与所述旋绕部(61)相连并且位于所述旋绕部(61)外侧,所述外连接端子(62)与所述主板(40)电连接,所述内连接端子(63)与所述旋绕部(61)相连并且位于所述旋绕部(61)的内侧;导电转接件(70),所述导电转接件(70)电连接所述主板(40)与所述内连接端子(63)。
- 根据权利要求1所述的电子设备(10),其特征在于,使用导电材料在所述外壳(30)上形成导电层,所述导电层形成所述导电线圈(60);或者,使用导电材料在所述外壳(30)上形成导电层,对所述导电层图案化处理以形成所述导电线圈(60)。
- 根据权利要求1或2所述的电子设备(10),其特征在于,所述导电转接件(70)位于所述导电线圈(60)背向所述内表面(31)的一侧。
- 根据权利要求1至3任一项所述的电子设备(10),其特征在于,所述导电线圈(60)在所述内连接端子(63)处的厚度增大。
- 根据权利要求1至4任一项所述的电子设备(10),其特征在于,所述导电线圈(60)在所述内连接端子(63)处的宽度增大。
- 根据权利要求1至5任一项所述的电子设备(10),其特征在于,所述外壳(30)包括凹部(33),所述内表面(31)设置所述凹部(33),所述导电线圈(60)的至少部分位于所述凹部(33)内。
- 根据权利要求6所述的电子设备(10),其特征在于,所述导电线圈(60)的形状与所述凹部(33)的形状相匹配。
- 根据权利要求1至7任一项所述的电子设备(10),其特征在于,所述电子设备(10)还包括绝缘防护层(90),所述绝缘防护层(90)覆盖所述旋绕部(61)。
- 根据权利要求1至8任一项所述的电子设备(10),其特征在于,所述主板(40)包括第一弹片(41),所述外连接端子(62)包括第一触点(621),所述第一弹片(41)和所述第一触点(621)电连接。
- 根据权利要求1至9任一项所述的电子设备(10),其特征在于,所述主板(40)包括第二弹片(42),所述导电转接件(70)包括第二触点(71),所述第二弹片(42)和所述第二触点(71)电连接。
- 根据权利要求1至10任一项所述的电子设备(10),其特征在于,所述导电转接件(70)与所述内连接端子(63)为分体组装结构。
- 根据权利要求11所述的电子设备(10),其特征在于,所述导电转接件(70)与所述内连接端子(63)粘接或焊接。
- 根据权利要求11或12所述的电子设备(10),其特征在于,所述导电转接件(70)为柔性电路板。
- 根据权利要求1至10任一项所述的电子设备(10),其特征在于,所述导电转接件(70)和所述导电线圈(60)为一体成型结构。
- 根据权利要求1至14任一项所述的电子设备(10),其特征在于,所述旋绕 部(61)为螺旋状。
- 根据权利要求1至15任一项所述的电子设备(10),其特征在于,所述外壳(30)的材料选自陶瓷、金属、塑料、玻璃或玻璃纤维。
- 根据权利要求1至16任一项所述的电子设备(10),其特征在于,所述电子设备(10)还包括电池(80),所述内表面(31)面向所述电池(80)设置,所述旋绕部(61)对应所述电池(80)设置。
- 一种电子设备(10),其特征在于,至少包括:外壳(30),包括相对设置的内表面(31)和外表面(32);主板(40),设置于所述内表面(31)的一侧;导电线圈(60),设置于所述内表面(31),并且与所述外壳(30)一体化设置,所述导电线圈(60)包括旋绕部(61)、外连接端子(62)和内连接端子(63),沿所述旋绕部(61)的径向,所述主板(40)位于所述旋绕部(61)的外侧,所述外连接端子(62)与所述旋绕部(61)相连并且位于所述旋绕部(61)外侧,所述外连接端子(62)与所述主板(40)电连接,所述内连接端子(63)与所述旋绕部(61)相连并且位于所述旋绕部(61)的内侧;其中,使用导电材料在所述外壳(30)上形成导电层,所述导电层形成所述导电线圈(60);或者,使用导电材料在所述外壳(30)上形成导电层,对所述导电层图案化处理以形成所述导电线圈(60);导电转接件(70),所述导电转接件(70)电连接所述主板(40)与所述内连接端子(63)。
- 根据权利要求18所述的电子设备(10),其特征在于,所述导电转接件(70)位于所述导电线圈(60)背向所述内表面(31)的一侧。
- 根据权利要求18至19任一项所述的电子设备(10),其特征在于,所述导电线圈(60)在所述内连接端子(63)处的厚度增大。
- 根据权利要求20所述的电子设备(10),其特征在于,所述导电线圈(60)在所述内连接端子(63)处的宽度增大。
- 根据权利要求21所述的电子设备(10),其特征在于,所述外壳(30)包括凹部(33),所述内表面(31)设置所述凹部(33),所述导电线圈(60)的至少部分位于所述凹部(33)内。
- 根据权利要求22所述的电子设备(10),其特征在于,所述导电线圈(60)的形状与所述凹部(33)的形状相匹配。
- 根据权利要求18-19、21-23任一项所述的电子设备(10),其特征在于,所述电子设备(10)还包括绝缘防护层(90),所述绝缘防护层(90)覆盖所述旋绕部(61)。
- 根据权利要求24所述的电子设备(10),其特征在于,所述主板(40)包括第一弹片(41),所述外连接端子(62)包括第一触点(621),所述第一弹片(41)和所述第一触点(621)电连接。
- 根据权利要求18-19、21-23、25任一项所述的电子设备(10),其特征在于,所述主板(40)包括第二弹片(42),所述导电转接件(70)包括第二触点(71),所述第二弹片(42)和所述第二触点(71)电连接。
- 根据权利要求26所述的电子设备(10),其特征在于,所述导电转接件(70)与所述内连接端子(63)为分体组装结构。
- 根据权利要求27所述的电子设备(10),其特征在于,所述导电转接件(70)与所述内连接端子(63)粘接或焊接。
- 根据权利要求27或28所述的电子设备(10),其特征在于,所述导电转接件(70)为柔性电路板。
- 根据权利要求18-19、21-23、25任一项所述的电子设备(10),其特征在于,所述导电转接件(70)和所述导电线圈(60)为一体成型结构。
- 根据权利要求30所述的电子设备(10),其特征在于,所述旋绕部(61)为螺旋状。
- 根据权利要求31所述的电子设备(10),其特征在于,所述外壳(30)的材料选自陶瓷、金属、塑料、玻璃或玻璃纤维。
- 根据权利要求32所述的电子设备(10),其特征在于,所述电子设备(10)还包括电池(80),所述内表面(31)面向所述电池(80)设置,所述旋绕部(61)对应所述电池(80)设置。
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