WO2023070302A1 - Driving backplane, display panel, and display panel preparation method - Google Patents

Driving backplane, display panel, and display panel preparation method Download PDF

Info

Publication number
WO2023070302A1
WO2023070302A1 PCT/CN2021/126323 CN2021126323W WO2023070302A1 WO 2023070302 A1 WO2023070302 A1 WO 2023070302A1 CN 2021126323 W CN2021126323 W CN 2021126323W WO 2023070302 A1 WO2023070302 A1 WO 2023070302A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
signal line
substrate
display panel
anchor point
Prior art date
Application number
PCT/CN2021/126323
Other languages
French (fr)
Chinese (zh)
Inventor
付杰
Original Assignee
重庆康佳光电技术研究院有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 重庆康佳光电技术研究院有限公司 filed Critical 重庆康佳光电技术研究院有限公司
Priority to PCT/CN2021/126323 priority Critical patent/WO2023070302A1/en
Publication of WO2023070302A1 publication Critical patent/WO2023070302A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of display technology, and in particular to a driving backplane, a display panel and a method for manufacturing the display panel.
  • a display screen is formed by splicing multiple display panels, so the proportion of the active area (Active Area) on the display panel will affect the gap size of the effective display interval after the display panels are spliced, and the gap will directly determine the display of the display screen. Effect.
  • the driving circuit In order to reduce the gap between the effective display intervals after splicing as much as possible, it is necessary to reduce the non-effective display area on the display panel. Therefore, in the current related art, it is proposed to arrange the driving circuit on the back of the display panel, and only arrange the lines connecting the light-emitting units on the front, so that The driving circuit will not occupy the non-effective display area, which is beneficial to shrinking the frame of the display panel.
  • the via hole connection scheme is often used at present, but setting too many via holes in the driver backplane will affect the mechanical strength of the driver backplane, resulting in lower reliability of the display panel. high.
  • the purpose of this application is to provide a driving backplane, a display panel and a method for preparing a display panel, aiming at solving the problem that the current scheme of connecting the front and back circuits of the driving backplane affects the mechanical strength of the driving backplane, causing the display Problem with poor panel quality.
  • the application provides a drive backplane, including:
  • the base includes two opposite bearing surfaces and a side surface of the base between the two bearing surfaces, and one of the two bearing surfaces includes an effective display area configured to bear a light-emitting unit;
  • a load-bearing surface signal line group disposed on the load-bearing surface is composed of two load-bearing surface signal lines that are located on different load-bearing surfaces and face each other;
  • the conductive anchor point group is composed of two conductive anchor points embedded in the base and separately arranged at both ends of the side signal line; part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the The side surface of the substrate, and the exposed surface of the conductive anchor point is at least partially coincident with the signal line of the bearing surface, and at least partially coincident with the signal line of the side surface.
  • the present application also provides a display panel, including:
  • a plurality of light-emitting units are arranged in the effective display area, and the chip electrodes are electrically connected to the signal lines on the bearing surface in the effective display area.
  • the present application also provides a method for preparing a display panel, which is applied to the preparation of the above-mentioned display panel.
  • the method for preparing the display panel includes:
  • a substrate is provided, the substrate includes two opposite bearing surfaces and a side surface of the substrate between the two bearing surfaces, and one of the two bearing surfaces includes an effective display area configured to carry a light-emitting unit;
  • a blind hole group consisting of two blind holes opposite to each other and opening on different bearing surfaces is arranged on the edge of the effective display area, and a conductive material is filled in the blind holes to form a conductive block;
  • setting the load-bearing surface signal line group includes: respectively setting opposite load-bearing surface signal lines on the two load-bearing surfaces to form a load-bearing surface signal line group, and the load-bearing surface signal line covers at least part of the exposed area of the conductive block;
  • setting the light-emitting unit includes: A plurality of light-emitting units are arranged in the effective display area, and the chip electrodes of the light-emitting units are electrically connected to the signal lines on the bearing surface in the effective display area;
  • forming a conductive anchor point includes: removing a part of the substrate located outside the effective display area to make the conductive block A conductive anchor point is formed, part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the substrate, and the exposed surface of the conductive anchor point is at least partially coincident with the signal line on the bearing surface , at least partly coincides with the side signal line;
  • setting the side signal line includes: setting the side
  • conductive anchor points embedded in the base are provided at the edge of the bearing surface and the side of the base to form a group of conductive anchor points, and part of the surface of the conductive anchor points is exposed to the As for the bearing surface, part of the surface is exposed on the side of the base.
  • at least part of the exposed surface of the conductive anchor point coincides with the signal line of the bearing surface, and at least partially coincides with the signal line of the side surface, two signal lines of the bearing surface located on different bearing surfaces in the signal line group of the bearing surface can be realized. connected.
  • the conductive anchor point group by setting the conductive anchor point group on the base, part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the base, and at the same time, it is ensured that the signal line of the bearing surface and the side signal line are at least covered by the exposed conductive anchor point. At least the region, so as to realize the communication between the two bearing surface signal lines in the bearing surface signal line group.
  • this circuit connection scheme there is no need to provide via holes on the substrate, and the mechanical strength of the driving backplane will not be affected, which is beneficial to improving the reliability of the driving backplane and the display panel.
  • the exposed surface of the conductive anchor point on the bearing surface and the side of the base naturally realizes the "bending" of the line, and there is no need to set a bent line , avoiding the disconnection problem that is easy to occur due to the bending of the line, and further improving the reliability of the driving backplane.
  • a conductive block is formed by setting unaligned blind holes on the two bearing surfaces of the substrate and filling conductive materials, the conductive block is located at the edge of the effective display area, and then the area other than the effective display area of the substrate is removed. , so that the conductive block forms a conductive anchor embedded in the substrate but part of the surface is exposed on the carrying surface, and part of the surface is exposed on the side of the substrate.
  • the exposed surface of the conductive anchor point on the bearing surface and the side of the base naturally realizes the "bending" of the line, and there is no need to set a bent line , avoiding the disconnection problem that is easy to occur due to the bending of the line, and further improving the reliability of the driving backplane.
  • FIG. 1 is a first cross-sectional schematic diagram of a drive backplane provided in an optional embodiment of the present application
  • FIG. 2a is a schematic diagram of a second cross-sectional structure of a drive backplane provided in an alternative embodiment of the present application
  • Fig. 2b is a schematic diagram of a third cross-sectional structure of the driving backplane provided in an alternative embodiment of the present application;
  • Fig. 2c is a schematic diagram of a fourth cross-sectional structure of the drive backplane provided in an alternative embodiment of the present application;
  • Fig. 2d is a schematic diagram of a fifth cross-sectional structure of the driving backplane provided in an alternative embodiment of the present application;
  • Fig. 2e is a schematic diagram of a sixth cross-sectional structure of the driving backplane provided in an alternative embodiment of the present application;
  • Fig. 3 is a side view structural schematic diagram of the driving backplane in Fig. 1;
  • Fig. 4 is a top view structural schematic diagram of the drive backplane in Fig. 1;
  • FIG. 5 is a schematic structural diagram of a display panel provided in an optional embodiment of the present application.
  • FIG. 6 is another schematic structural diagram of a display panel provided in an alternative embodiment of the present application.
  • FIG. 7 is a schematic flowchart of a method for manufacturing a display panel provided in another optional embodiment of the present application.
  • Fig. 8a is a schematic cross-sectional view of another optional embodiment of the present application after setting blind hole groups on the substrate;
  • Fig. 8b is a schematic top view of a group of blind holes on the substrate shown in another optional embodiment of the present application;
  • FIG. 9 is a schematic diagram of removing part of the substrate outside the effective display area shown in another optional embodiment of the present application.
  • Fig. 10a is a schematic diagram of a positional relationship between the first cutting line, the effective display area and the conductive block shown in another optional embodiment of the present application;
  • Fig. 10b is a schematic diagram of a positional relationship between the second cutting line, the effective display area, and the conductive block shown in another optional embodiment of the present application;
  • Fig. 10c is a schematic diagram of another positional relationship between the second cutting line, the effective display area and the conductive block shown in another optional embodiment of the present application;
  • FIG. 11 is a schematic flowchart of a method for manufacturing a display panel provided in another optional embodiment of the present application.
  • FIG. 12 is a schematic diagram of a process state change of a display panel manufacturing method provided in another optional embodiment of the present application.
  • Fig. 13 is a schematic top view of a blind hole provided on a peeling substrate provided in another optional embodiment of the present application.
  • FIG. 14 is a schematic diagram of a positional relationship between the second cutting line, the third cutting line, the effective display area, and the blind hole shown in another optional embodiment of the present application.
  • via holes are usually selected on the driving backplane, and the connection between the two sides of the lines is realized by using the via holes.
  • FIG. 1 shows a schematic cross-sectional structure of the driving backplane: the driving backplane 10 includes a base 11, a signal line group 12 on the carrying surface, and side signal lines 130. Conductive anchor point group 14.
  • the substrate 11 includes two carrying surfaces 110a.
  • the "carrying surface”, as the name implies, is the surface of the substrate 11 for carrying devices, and the carried devices include light emitting units, driving chips, and the like.
  • the base 11 is plate-shaped and generally not thick, the two bearing surfaces 110 a are the two surfaces with the largest areas in the base 11 .
  • One of the carrying surfaces 110a includes an effective display area 111 for carrying the light-emitting unit.
  • the carrying surface 110a provided with the effective display area 111 is marked as "the front side of the base", and The other load-bearing surface is referred to as the "backside of the substrate".
  • the base 11 further includes a base side 110b located between the two bearing surfaces 110a. Taking the bearing surface 110a as an example, there are four base sides 110b in the base 11 .
  • the shape of the base 11 is not limited to a rectangle, but can also be any other shape that is convenient for splicing.
  • a bearing surface signal wire group 12 may be composed of two bearing surface signal wires 120 respectively located on different bearing surfaces 110a, and the two bearing surface signal wires 120 are opposite to each other.
  • the signal lines 120 on the bearing surface located on the front of the substrate are marked as “front signal lines”
  • the signal lines 120 on the bearing surface located on the back of the substrate are marked as “back signal lines”.
  • the side signal wires 130 correspond to the bearing surface signal wire group 12 , and are used to connect two bearing surface signal wires 120 in the bearing surface signal wire group 12 .
  • a conductive anchor point group 14 includes two conductive anchor points 140 embedded in the substrate 11.
  • the conductive anchor points 140 are located on the edge between the bearing surface 110b and the side surface 110b of the substrate. Part of the surface of the conductive anchor point 140 is exposed to the substrate 11. One surface is exposed on the bearing surface 110a, and the other part is exposed on the base side 110b.
  • the conductive anchor point group 14 is in one-to-one correspondence with the signal line group 12 on the carrying surface, one of the conductive anchor points 140 is used to connect the front signal line and one end of the side signal line 130, and the other conductive anchor point 140 is used to connect the rear signal line and the side signal line. the other end of line 130.
  • the exposed surface of the conductive anchor point 140 coincides with the signal line 120 on the bearing surface, and at least partially overlaps with the signal line 130 on the side surface.
  • the wire 130 also covers at least a partial area of the exposed surface of the conductive anchor 140 .
  • each conductive anchor point 140 has two exposed surfaces: one is the conductive front 140a facing the same direction as the carrying surface 110a, and the other is the conductive side 140b facing the same direction as the base side 110b, and is conductive.
  • the edge between the front surface 140a and the conductive side 140b coincides with the edge between the carrying surface 110a and the base side 110b.
  • the conductive front 140a of the conductive anchor 140 is at least partially coincident with the signal line 120 on the carrying surface, and the conductive side 140b is at least partially coincident with the side signal line 130 , please continue to refer to FIG. 1 .
  • the conductive anchor point 140 has conductivity, and it undertakes the electrical connection function between the signal line 120 on the carrying surface and the signal line 130 on the side. At least part of the area of the bearing surface coincides with the bearing surface signal line 120 provided on the bearing surface 110a, so the electrical connection between the bearing surface signal line 120 and the conductive anchor point 140 can be realized; on the other hand, the conductive side 140b and the base side 110b face the same direction, and At least a partial area of the conductive side 140b coincides with the side signal line 130 disposed on the base side 110b, so the electrical connection between the side signal line 130 and the conductive anchor point 140 can be realized.
  • the edge In the driving backplane 10 shown in FIG. 1, there is only one edge in the exposed area of the conductive anchor point 140, and this edge is used as a boundary between two mutually perpendicular planes (ie, the conductive front surface 140a and the conductive side surface 140b). , the edge coincides with the edge between the bearing surface 110a of the substrate 11 and the substrate side 110b.
  • the exposed area of the conductive anchor point 140 can also be There are no edges.
  • the exposed surface of the conductive anchor point 140 is a curved surface (for example, it may be a partial area of a sphere or a paraboloid). arc, see Figure 2a.
  • there is an edge in the exposed area of the conductive anchor point 140 but this edge is not a boundary line between two planes, but a boundary line between a curved surface and a plane.
  • FIG. 2b A schematic cross-sectional view of the board 20b.
  • the outline of the exposed area of the conductive anchor point 140 is composed of curves and straight lines.
  • these ribs are is the boundary line between the plane and the plane, but in some other examples of this embodiment, at least part of these edges can also serve as the boundary line between the curved surface or the curved surface and the plane. Moreover, the ribs in the exposed areas of the conductive anchors 140 may not coincide with the ribs between the substrate side 110b and the carrying surface 110a.
  • a drive backplane 10 may include two or more lines, therefore, the drive backplane 10 may include two or more conductive anchor groups 14, two or more The carrying surface signal line group 12 and two or more side signal lines 130 .
  • the side signal lines 130 may be distributed only on one side surface 110b of the substrate 11, or may be distributed on different side surfaces 110b of the substrate.
  • the driving backplane 11 uses the conductive anchor point 140 on the exposed surface of the bearing surface 110a and the base side 110b to naturally realize the "bending" of the circuit, avoiding the disconnection problem that is easy to occur when the bent circuit is set. The reliability of the connection is improved, and the quality of the driving backplane 10 is enhanced.
  • the signal line 120 on the carrying surface faces the same direction as the conductive front surface 140a
  • the side signal line 130 faces the same direction as the front surface 140b on the conductive side. It is easy to overlap and dislocate, which is beneficial to improve the production yield of the driving backplane 11 .
  • the connection of the signal lines 120 on the bearing surface 110a on the different bearing surfaces 110a of the driving backplane 11 does not need to rely on via holes, the influence of the via holes on the mechanical strength of the driving backplane 11 is avoided, and the occurrence of fragmentation problems is prevented. The quality of the driving backplane 11 is improved.
  • a protective layer for protecting at least one of the side signal lines 130 and the load-bearing surface signal lines 120 is also provided in the drive backplane 11, for example, a structural schematic diagram of another drive backplane 20d shown in FIG. 2d.
  • the driving backplane 11 is provided with an insulating isolation layer 151 covering the signal lines 120 on the carrying surface.
  • the drive backplane 11 is also provided with a side protection layer 152 covering the side signal lines 130, and the side protection layer 152 is insulated, which can realize the electrical isolation of the side signal lines 130 from the outside, such as Drive backplane 20e is shown in FIG. 2e.
  • the insulating isolation layer 151 and the side protection layer 152 can be provided at the same time.
  • the side protection layer 152 can be a black adhesive layer, for example, in some examples of this embodiment, the OD (Optical Density, optical density) is greater than 2.
  • the thicknesses of the side signal lines 130 and the side protection layer 152 will be controlled.
  • the side signal lines 130 and the side protection layer 152 The thickness of at least one of them is less than 10um.
  • the sum of the thicknesses of the side signal line 130 and the side protection layer 152 is required to be less than 20um, such as 15um, 17um, 20um, etc.
  • the thickness direction of the side signal line 130 and the side protection layer 152 refers to a direction perpendicular to the side surface 110b of the substrate.
  • the line width of the signal line 120 on the carrying surface is larger than the size of the conductive front surface 140a in the same direction.
  • the direction between the side faces 140b is parallel to the ribs.
  • the signal line 120 on the bearing surface may completely cover the conductive front surface 140 a of the conductive anchor point 140 .
  • the line width of the side signal line 130 is larger than the size of the conductive side surface 140b in the same direction. parallel direction. In some examples of this embodiment, the side signal line 130 may completely cover the conductive side 140 b of the conductive anchor 140 .
  • the conductive side 140b of the conductive anchor point 140 is a rectangle, please refer to FIG. It is not excluded that the conductive side 140b can be in other geometric shapes, just because the conductive anchor point 140 is usually obtained by cutting and/or grinding the substrate 11 after filling the conductive material in the blind hole provided in the substrate 11, and the blind hole is usually columnar , so the conductive side 140b is mostly rectangular.
  • the conductive front surface 140a of the conductive anchor point 140 may also be rectangular or arcuate.
  • the bow shape mentioned in this embodiment refers to a pattern formed by a circular arc and a straight line connecting two ends of the circular arc.
  • FIG. 4 for a schematic top view of the base 11 with anchor points.
  • the conductive front surface 140a is in the shape of a superior arc (that is, the arc included is larger than the semicircle), however, in some other examples of this embodiment, the conductive front 140a is in the shape of a inferior arc (that is, the arc included is smaller than the semicircle). semicircular bow) or semicircular. In some other examples of this embodiment, the conductive front surface 140a of the conductive anchor point 140 may also be triangular, trapezoidal, or other polygonal shapes.
  • the display panel 5 includes a driving backplane 50 and a plurality of light-emitting units 51
  • the driving backplane 50 can be the driving backplane provided in any of the aforementioned examples. , such as driving the backplane 10 and the like.
  • the light emitting unit 51 is disposed in the active display area 111 of the driving backplane 50 and is electrically connected to the signal line 120 on the carrying surface 110 a where the effective display area 111 is located.
  • the light emitting unit 51 in the display panel 5 includes a red chip, a green chip and a blue chip, and the display panel 5 is a color display panel; It can also further include a white light chip, a yellow light chip, and the like.
  • the light emitting unit 51 may be any one of Micro-LED (micro LED) chip, Mini-LED (miniature LED) chip, OLED (Organic Light-Emitting Diode, organic light-emitting semiconductor) chip and common light emitting unit.
  • the specific structure of the light emitting unit 51 is not limited in this embodiment, for example, it may be a chip with a flip-chip structure or a chip with a front-mount structure; it may be a chip with a horizontal structure or a chip with a vertical structure.
  • an encapsulation adhesive layer 52 may also be provided on the display panel, please refer to FIG. 6 : in the display panel 6, an encapsulation adhesive layer 52 is provided on the side of the driving backplane 50 where the light-emitting unit 51 is provided.
  • the light-emitting unit 51 is not contained in the packaging glue layer 52, and the packaging glue layer 52 is formed by the packaging glue.
  • the packaging glue can be semi-permeable glue; in some examples, the packaging glue is black glue, so Encapsulation blackening can be achieved.
  • the packaging adhesive layer 52 includes a black adhesive layer and a semi-permeable adhesive layer, wherein the black adhesive layer is closer to the driving backplane 50 than the semi-permeable adhesive layer.
  • the thickness of the black glue layer can be about 50um, and the hardness after curing is greater than 2H, while the thickness of the semi-permeable glue layer can be about 210um, and the hardness after curing is greater than 1H.
  • the driving backplane 50 can be prepared first, including the formation of the signal lines 120 on the bearing surface, the conductive anchor points 140 and the side signal lines 130, and even the formation of a protective layer, etc., and then on the A light emitting unit 51 , an encapsulation glue layer 52 and the like are disposed on the driving backplane 50 .
  • the display panel instead of forming a complete driving backplane 50 first, the display panel can be directly prepared based on the substrate 11. In this case, multiple The light-emitting unit 51 that is electrically connected to the signal line 120 on the bearing surface, and the setting of the encapsulation layer 52 is completed, and then the side signal line 130 is formed.
  • the side signal line 130 and its side protection layer 152 are both It is set after the encapsulation layer 52 is set. If the side protection layer 152 and/or the side signal lines cover the light-emitting surface of the display panel during the setting process, it will affect the display effect of the display panel, especially when the side protection layer 152 is set.
  • the layer 152 is a vinyl protective layer, therefore, in some examples of this embodiment, the length of the side signal lines is required to be less than the sum of the thicknesses of the substrate 11 and the encapsulation layer 52 . In one example, the length of the side signal line 130 is less than the sum of half the thickness of the packaging adhesive layer 52 and the thickness of the substrate 11 .
  • the drive backplane and the display panel provided in this embodiment are connected to the signal lines on the carrying surface on different carrying surfaces of the substrate through the side signal lines and the conductive anchor points at both ends of the side signal lines, which is not dependent on the setting of via holes, which is beneficial to improve the start-up backplane.
  • the mechanical properties of the board enhance the quality of the display panel.
  • the front signal line only needs to be connected to the conductive front side of the conductive anchor point close to the front side of the substrate
  • the rear signal line only needs to be connected to the conductive front side of the conductive anchor point close to the back side of the substrate
  • the side signal line only needs to be connected to the conductive anchor point
  • the side connections are all connected on the same side, and it is not easy to cause overlapping and misalignment, which is conducive to improving the production yield of the driving backplane or display panel.
  • connection area reduces the bonding impedance
  • This embodiment provides a method for manufacturing a display panel, please refer to a flow chart shown in FIG. 7:
  • S702 Provide a base.
  • the substrate provided in this embodiment can be a resin substrate, a glass substrate, a sapphire substrate, etc., which is a plate-shaped structure with two opposite carrying surfaces and one or more sides of the substrate between the carrying surfaces.
  • a bearing surface of the base includes an area where a plurality of light-emitting units are to be arranged, and this area is the effective display area of the base.
  • S704 setting a blind hole group at the edge of the effective display area, consisting of two opposite blind holes with openings on different carrying surfaces, and filling the blind holes with conductive material to form a conductive block.
  • blind hole groups may be provided in the substrate, and one blind hole in one blind hole group is used to form one conductive anchor point, so one blind hole group corresponds to one conductive anchor point group, including two blind holes.
  • Blind vias refer to via holes that connect the surface layer and the inner layer of the substrate without penetrating the entire plate. Please refer to a schematic cross-sectional view of a blind hole group set on a base 81 shown in FIG. on a bearing surface 810a.
  • the blind hole group is to form a conductive anchor point group
  • the number of the blind hole group is related to the number of the conductive anchor point group
  • the number of the conductive anchor point group is actually related to the situation where the circuit needs to be arranged on the substrate .
  • there are multiple groups of lines on the front and back of a display panel that need to be connected so there are usually multiple groups of blind holes on a substrate 81 .
  • a pair of blind hole groups will be mainly introduced in the following examples.
  • the sum of the depths of the two blind holes 800 in a blind hole group should be smaller than the thickness of the substrate 81 .
  • the depths of the two blind holes 800 are both less than half of the thickness of the substrate 81 .
  • the thickness of the base 81 is marked as "D1”
  • the depth of the blind hole 800 is marked as "h”, then h ⁇ D1/2.
  • the longitudinal section of the blind hole 800 is generally rectangular, as shown in FIG. 8 , but in some examples of this embodiment, the longitudinal section of the blind hole 800 may also be trapezoidal or even triangular.
  • the cross section of the blind hole 800 can be circular, rectangular, oval, rhombus, triangular, or other regular or irregular geometric shapes.
  • FIG. 8 b shows a schematic top view of a substrate 81 with a blind hole , in FIG. 8b, the cross section of the blind hole 800 is circular. It can be understood that the shapes and sizes of the blind holes 800 on the base 81 may be the same or not completely the same. However, in FIG. 8b the cross-section of each blind hole 800 is circular.
  • conductive material can be filled in the blind hole 800 , and a conductive block can be formed in the blind hole 800 by using the conductive material.
  • the conductive material includes metal materials, such as but not limited to one or more of Cu (copper), Au (gold), Ag (silver), Mo (molybdenum), Ti (titanium) and other metals.
  • the conductive material may be conductive glue, such as conductive silver glue, and in some other examples, the conductive material may include CNT (carbon nanotube material), graphene, and the like.
  • the conductive block can form a conductive anchor point embedded in the substrate 81 and have two surfaces exposed from the substrate 81.
  • each blind hole group located on the same side of the effective display area 811 It should be able to cut according to the same cutting line. Therefore, in this embodiment, the blind holes 800 on the same side of the effective display area 811 are located on the same surface, on the same side of the effective display area 811, and on the same loading surface. The blind holes 800 should be on the same line as shown in Figure 8b.
  • the exposed surface of the conductive material in the blind holes 810 whose openings are located on the same bearing surface 810a may not be flush, for example, some blind holes 810
  • the conductive material in some blind holes 800 may not have filled the blind holes, but the conductive material in some blind holes 800 may have overflowed onto the carrying surface 810a. Therefore, in some examples of this embodiment, in order to ensure that the carrying surface 810a of the base 81 remains flat after the conductive material is filled, the base 81 can be thinned after the conductive material is placed, for example, by means of grinding, cutting, etc.
  • HF hydrofluoric acid
  • d0 ⁇ h/2 optionally the value of d0 is 35 ⁇ m ⁇ 250 ⁇ m, for example, 35 um, 80 um, 120 um, 200 um, 245 um or 250 um.
  • S706 setting a blind hole group consisting of two blind holes opposite to each other and opening on different carrying surfaces at the edge of the effective display area, and filling the blind holes with conductive material to form a conductive block.
  • the driving backplane is prepared first, in the scheme of preparing the display panel based on the driving backplane, a), c), d), and The above four processes are executed in the order of b), but they can also be executed in the order of c), d), a), and b).
  • the scheme of preparing the display panel directly based on the substrate without forming the intermediate product of the driving backplane it can be performed in the order of a), b), c), and d), or in the order of c), a), b), and d) or in the order of c), d), a) and b).
  • those skilled in the art can understand that, in fact, other unlisted sequences can also be executed, but they will not be enumerated here.
  • the chip circuit and the driving circuit are respectively arranged on the two carrying surfaces 810a of the substrate by the yellow light process, for example, firstly through evaporation, sputtering, PVD (Physical Vapor Deposition, physical vapor deposition), CVD (Chemical Vapor Deposition, chemical vapor deposition) and other processes set a metal layer on the carrier surface, and then set a photoresist mask through exposure and development, and then pass through the photoresist mask. The metal layer is etched to form signal lines on the bearing surface.
  • a mask plate may be firstly provided on the carrying surface, and then metal is deposited through the mask plate to form signal lines on the carrying surface.
  • the signal lines on the bearing surface when the signal lines on the bearing surface are arranged, the conductive anchor points have already been formed. In this case, the signal lines on the bearing surface will cover at least part of the exposed surface of the conductive anchor points. For example, if the exposed surface of the conductive anchor points Including the conductive front and the conductive side, the signal line on the carrying surface needs to cover at least a part of the conductive front of the conductive anchor point, or even completely cover it; in some examples, the process of setting the signal line on the carrying surface is prior to the conductive anchor point Therefore, in these examples, the bearing surface signal line needs to cover the exposed surface of the conductive block, but because the conductive anchor point is formed by the conductive block, so in any case, when setting the bearing surface signal line, it is necessary to ensure The signal line on the bearing surface covers at least part of the area of the conductive block.
  • the line width of the signal line on the carrying surface is equal to the size of the conductive block or the conductive front surface of the conductive anchor point in the same direction.
  • the line width of the signal line on the bearing surface may also be slightly smaller than the size of the conductive block or the conductive anchor point in the same direction.
  • the shape of the signal line on the carrying surface is not specifically limited, and it can be set by the designer according to the arrangement of the light emitting units on the driving backplane and the like.
  • an insulating layer may also be provided on the signal lines on the bearing surface to protect the signal lines on the bearing surface. It can be understood that since the connection of the signal line on the load-bearing surface and the side signal line can be realized directly through the exposed conductive side of the conductive anchor point, no matter whether the conductive anchor point has been formed when the insulating isolation layer is formed, the insulating isolation layer does not need to be connected. Carry out hollowing out at positions corresponding to the conductive blocks or conductive anchor points.
  • a substrate with a relatively large area is used at the beginning of the preparation of the display panel.
  • the substrate is cut to have a size slightly larger than the size of the final display panel.
  • the substrate is selected to be cut according to the third cutting line. It should be understood that the third cutting line must be located on the side of the conductive block away from the effective display area.
  • the size of the substrate selected at the beginning of the display panel is only slightly larger than the size of the final display panel. In this case, the substrate does not need to be cut after the signal lines on the carrying surface are set. .
  • the light-emitting unit When setting up the light-emitting unit, the light-emitting unit can be transferred from other carrier substrates through the transfer head and other transfer equipment, and the light-emitting unit can be bonded to the effective display area through bonding materials such as solder and conductive glue, so as to realize the chip electrode of the light-emitting unit and the effective display.
  • bonding materials such as solder and conductive glue
  • an encapsulation adhesive layer is also provided on the side of the substrate where the light-emitting unit is provided.
  • the encapsulation adhesive layer may be a combination of a black adhesive layer and a semi-permeable adhesive layer. , for example, first form a black glue layer of about 50um on the side of the base with the light-emitting unit through black glue, usually the thickness of the black glue layer is about the same as the height of the light-emitting unit; then use semi-permeable glue to form a semi-permeable glue layer on the black glue layer .
  • the encapsulant can be a composite material of reactive polyimide and epoxy resin, wherein polyimide is used as a curing agent. For black glue, you can add carbon additive elements in proportion to increase blackness.
  • a part of the conductive block 801 is exposed from the side surface 810b of the substrate mainly by removing a part of the substrate 81 outside the effective display area 811. It can be understood that because the conductive block 801 As the conductive material filled in the blind hole 800, a part of the surface is exposed on the carrying surface 810a, so in the conductive anchor point 840 formed after removing part of the substrate 81, a part of the surface is exposed on the carrying surface 810a, A portion of the surface is exposed on the base side 810b.
  • FIG. 9 for a schematic diagram of forming a conductive anchor point.
  • the exposed surface of the conductive anchor point 840 includes a conductive front surface 840a facing the same direction as the carrying surface 810a, and a conductive side surface 840b facing the same direction as the base side 810b. Moreover, the edge between the conductive front surface 840a and the conductive side 840b coincides with the edge between the carrying surface 810a and the base side 810b, so that the formed conductive anchor point 840 is located on the edge between the carrying surface 810a and the base side 810b, and a part of it is embedded in In the base 81 , two surfaces are exposed to the base 81 at the same time.
  • the shape of the conductive anchor point 840 formed by the conductive block 801 is not limited to the one shown in FIG. 9 , for example, it can also be shown in FIG. 2a , FIG. 2b and FIG. 2c .
  • Removing the partial area of the substrate 81 outside the effective display area 811 can be achieved by at least one means of cutting, masking or etching.
  • the substrate 81 is cut according to the first cutting line 1001, the first cutting line 1001 passes through the conductive block 801, and the minimum distance between the first cutting line 1001 and the effective display area 811 is greater than
  • the minimum distance between the conductive block and the effective display area 811 can ensure that the remaining area of the conductive block 801 remains on the substrate 81 after cutting, and at the same time ensure that the conductive material of the conductive block 801 is exposed from the substrate side 810b after cutting.
  • the conductive block 801 forms the conductive anchor point 840 by directly cutting the base 81, but in some examples of this embodiment, the base 81 needs to be ground after cutting to make the conduction Block 801 forms conductive anchor 840 .
  • the base 81 needs to be ground after cutting to make the conduction Block 801 forms conductive anchor 840 .
  • the substrate 81 may be first cut according to the second cutting line 1002 , and the minimum distance between the second cutting line 1002 and the effective display area 811 is greater than that between the conductive block 801 and the effective display area 811 The minimum distance, that is, the second cutting line 1002 cannot at least cut off the entire area of the conductive block 801 , causing the effective display area 811 on the substrate 81 to be separated from the entire area of the conductive block 801 .
  • the second cutting line 1002 may not pass through the conductive block 801, please continue to refer to FIG. After that, it is also necessary to grind the diced substrate 81 along the direction perpendicular to the substrate side 810b so that the conductive block 801 forms a conductive anchor point 840.
  • the grinding depth must be smaller than that of the conductive block 801 in the grinding direction.
  • the thickness on the substrate 81 is different, that is, the entire area of the conductive block 801 is ground away so that there is no remaining area of the conductive block on the substrate 81 .
  • the second cutting line 1002 will pass through the conductive block 801, as shown in FIG. In these examples, the diced substrate 81 will still be ground along the direction perpendicular to the substrate side 810b, so, in these examples, when determining the second cutting line 1002, it should be ensured that the substrate 81 after dicing has Grinding allowance.
  • the cutting surface usually has unevenness (the current cutting process usually cuts to a certain depth first, and then performs the slitting operation), which will make the side surface 810b of the base uneven. Therefore, grinding after cutting can ensure that the base has Relatively flat base side 810b. At the same time, the roughness of the substrate side 810b after grinding can be controlled by controlling the mesh of the grinding rod, so as to provide good adhesion conditions for the conductive material forming the side signal line.
  • side signal lines can be provided between the two conductive anchors in the conductive anchor group on the side of the substrate, and the side signal lines can be used to realize the connection between the two conductive anchors.
  • the arrangement of the side signal lines can be realized by pad printing silver paste, sputtering metal film, and the like.
  • the side signal line covers at least part of the exposed surface of the conductive anchor 840. If the exposed surface of the conductive anchor includes a conductive front and a conductive side, the side signal line will cover at least a part of the conductive side of the conductive anchor, or even For full coverage.
  • the line width of the side signal lines is less than 10um, such as 7um, 6.5um and so on.
  • the line width of the side signal lines is greater than the size of the conductive side of the conductive anchor point in the same direction.
  • the line width of the side signal line is equal to or slightly smaller than the size of the conductive side of the conductive anchor point in the same direction. of.
  • the side signal lines can fully cover the conductive sides of the conductive anchor points at both ends, but those skilled in the art should understand that this is not a necessary condition.
  • the length of the side signal lines along the thickness direction of the substrate is less than the sum of half the thickness of the packaging adhesive layer and the thickness of the substrate.
  • a side protective layer can also be provided on the side signal lines, so as to protect the side signal lines with the side protective layer, for example, black glue is used to form a black glue protective layer .
  • the thickness of the side protection layer is less than 10 um. In some examples of this embodiment, the sum of the thicknesses of the side signal lines and the side protection layer is less than 20um, which can improve the splicing effect of the display panels.
  • the display panel After setting the signal line group on the carrying surface, setting the light emitting unit, forming the conductive anchor point and setting the side signal line, the display panel is prepared.
  • the display panel manufacturing method provided in this embodiment does not need to provide via holes on the substrate when connecting the lines on the two bearing surfaces of the driving backplane, and does not affect the mechanical strength of the driving backplane, which is beneficial to improving the connection between the driving backplane and the display panel. panel reliability.
  • the connection between the signal line on the load-bearing surface and the corresponding side signal line uses the exposed conductive front and side of the conductive anchor point, no need to set up bent lines, and avoids the problem of broken lines that are prone to occur due to line bending.
  • the reliability of the drive backplane is improved; moreover, the signal lines on the load-bearing surface only need to be connected to the conductive front on the same surface, and the same side signal lines only need to be connected to the conductive side on the same surface.
  • the connection is simple and clear, not easy
  • the overlapping dislocation is beneficial to improve the production yield of the display panel and reduce the production cost.
  • S1102 Provide a glass substrate.
  • the glass substrate 1201 is selected to prepare the display panel.
  • the substrate in the display panel may also have other materials, such as sapphire. base, resin base, etc.
  • a glass substrate 1201 with a relatively large size is initially provided, even in some examples, it is enough to prepare glass substrates 1201 for two or more than two display panels.
  • the original thickness of the glass substrate 1201 is D1.
  • S1104 setting a blind hole group on the edge of the effective display area on the glass substrate.
  • the set blind hole group can be one or two or more.
  • the positions of the two blind holes 1202 in a blind hole group are opposite, and the openings are respectively located on the front surface and the back surface of the glass substrate 1201 .
  • the blind hole 1202 is cylindrical, but in some other examples of this embodiment Among them, the blind hole 1202 may also be in the shape of a polygonal column, or even in the shape of a pyramid, a cone, a terrace or a truncated cone.
  • the blind hole 1202 may have a diameter of d and a depth of h, where h ⁇ D1/2.
  • S1106 Fill the blind hole with conductive material to form a conductive block.
  • metal such as one or more of Cu, Au, Ag, Mo, and Ti, etc.
  • other conductive materials such as conductive silver paste, CNT, etc.
  • the conductive material may overflow to the surface of the glass substrate 1201 when the conductive material is placed in the blind hole 1202, causing the surface of the glass substrate 1201 to be uneven, so, in some examples of this embodiment, after the conductive block is formed, the The glass substrate 1201 is subjected to thinning treatment, as shown in (d) in Figure 12, the thinning depth d0 is 35 ⁇ 250um, of course d0 ⁇ h/2, in this embodiment, it is assumed that the thickness of the glass substrate 1201 after the thinning treatment The thickness is D2.
  • S1110 Arranging signal lines on the carrying surface on the two carrying surfaces of the glass substrate, and setting an insulating protective layer.
  • the front signal line 1204 and the back signal line 1205 can be respectively arranged on the front side and the back side of the glass substrate 1201 by using the yellow light process, as shown in (e) in Figure 12, the front signal line 1204 is opposite to the back signal line 1205 , both of which belong to the load-bearing surface signal lines, and together form a load-bearing surface signal line group. It should be understood that the front signal line 1204 is opposite to the rear signal line 1205, and it is not required that the two are opposite to each other everywhere. relatively. Both the front signal line 1204 and the back signal line 1205 fully cover the exposed surface of the conductive block 1203 , and the line width of the signal line w1 on the carrying surface is greater than the diameter d of the blind hole 1202 .
  • an insulating isolation layer 1206 may be set to cover and protect the signal lines on the carrying surface, as shown in (f) in FIG. 12 .
  • the glass substrate 1201 can be cut.
  • the glass substrate 1201 is cut according to the third cutting line, as shown in (g) of FIG. 12 . It can be understood that, when cutting the glass substrate 1201 , all sides other than the effective display area may be cut, or only part of the sides may be cut.
  • 14 shows a schematic diagram of the positional relationship between the original glass substrate 1201 effective display area 1400, blind hole 1202 and cutting line, in FIG. All areas are cut, and the four third cutting lines 1403 form a rectangle, enclosing the effective display area 1400 and the blind hole 1202 inside.
  • a light emitting unit 1207 can be arranged in the effective display area 1400, as shown in (h) in FIG. .
  • an encapsulant may be provided on the side of the glass substrate 1201 provided with the light-emitting unit 1207 to form an encapsulant layer 1208 , as shown in (i) of FIG. 12 .
  • the packaging adhesive layer 1207 includes a black adhesive layer relatively close to the glass substrate 1201, whose hardness is greater than or equal to 2H, and whose thickness is about 50um, and also includes a semi-permeable adhesive layer relatively far away from the glass substrate 1201, whose hardness is greater than 1H, the thickness is about 210um.
  • the thickness of the packaging adhesive layer 1208 is recorded as "D3"
  • S1120 Cutting and grinding the glass substrate according to the second cutting line, so that the conductive block forms a conductive anchor point.
  • the glass substrate 1201 is cut again according to the second cutting line 1402, the second cutting line 1402 is located on the side of the conductive block 1203 away from the effective display area 1400, and it does not pass through the conductive block 1203, therefore, After being cut by the second cutting line 1402 , the conductive block 1203 on the glass substrate 1201 is still intact, and the conductive anchor point has not been formed yet.
  • the second cutting line 1402 may also pass through the conductive block 1203 .
  • there may be multiple second cutting lines 1402 for example, four second cutting lines 1402 form a rectangle in FIG. 14 .
  • the glass substrate 1201 may be ground in a direction perpendicular to the substrate side of the glass substrate 1201 so that the conductive blocks 1203 form conductive anchor points 1209, as shown in FIG. (j), the grinding depth is smaller than the remaining thickness of the conductive block 1203 in the grinding direction.
  • the conductive front surface of the conductive anchor point 1209 obtained in this embodiment is a bow-shaped.
  • the side signal line 1210 can be formed. Please refer to (k) in FIG.
  • the line width w2 of the side signal line 1210 is larger than the diameter d of the blind hole, the thickness is less than 10um, and the line length is less than D2+D3/2.
  • the side protection layer 1211 can be further provided on the side of the substrate, and the side protection layer 1211 is used to electrically isolate the side signal lines 1210 , as shown in (l) in FIG. 12 .
  • the thickness of the side protection layer 1211 is less than 10 um, and the thickness of the side protection layer 1211 and the side signal line 1210 is less than 20 um.
  • the preparation of the display panel 1200 is completed.
  • the driving backplane is not prepared as an intermediate product in the above example, those skilled in the art can understand that because the signal lines on the bearing surface and the light emitting The timing of the unit 1207, the formation of the conductive anchor point 1209, and the setting of the side signal line 1210 can be adjusted. Therefore, by adjusting the relative sequence of these four processes, the driving backplane can be prepared first, and then the light emitting unit 1207 can be set on the driving backplane. A display panel is formed.
  • This embodiment also provides a display screen, which includes at least two display panels provided in any of the foregoing examples, and each display panel is spliced together.
  • this embodiment also provides an electronic device with the display screen, such as a mobile phone, a television, a computer, and the like.
  • the lines connecting the front signal line and the back signal line are placed on the side of the glass substrate, which does not occupy the front space of the display panel, not only does not affect the mechanical strength of the glass substrate, but also can effectively reduce the Displays the border of the panel.
  • the side surface of the glass substrate is ground and roughened, it can effectively increase the adhesion effect of conductive materials and improve the reliability of the side signal lines.
  • the connection of the front signal line, the side signal line and the rear signal line does not require bending wires, which avoids problems such as broken wires and overlapping joints.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A driving backplane (10, 20a, 20b, 50), a display panel (5, 6, 1200), and a display panel (5, 6, 1200) preparation method. The driving backplane (10, 20a, 20b, 50) comprises a substrate (11, 81), a bearing surface signal line group (12), a side surface signal line (130, 1210), and an electrically conductive anchor group (14), the substrate (11, 81) comprising two opposite bearing surfaces (110a, 810a) and a substrate side surface (110b, 810b) located between the two bearing surfaces (110a, 810a); the bearing surface signal line group (12) is composed of two opposite bearing surface signal lines (120) located on different bearing surfaces (110a, 810a); the side signal line (130, 1210) is disposed on the substrate side surface (110b, 810b), the position thereof corresponding to the bearing surface signal line group (12); the electrically conductive anchor group (14) is composed of two electrically conductive anchors (140, 840, 1209) embedded in the substrate (11, 81) and arranged at two ends of the side surface signal line (130, 1210), respectively, part of the surface of an electrically conductive anchor (140, 840, 1209) being exposed at the bearing surface (110a, 810a), part of the surface of the electrically conductive anchor (140, 840, 1209) being exposed at the substrate side surface (110b, 810b), at least part of the exposed surface of the electrically conductive anchor (140, 840, 1209) coinciding with a bearing surface signal line (120), and at least part of the surface of the exposed surface of the electrically conductive anchor (140, 840, 1209) coinciding with the side surface signal line (130, 1210).

Description

一种驱动背板、显示面板及显示面板制备方法A kind of driving backplane, display panel and display panel preparation method 技术领域technical field
本申请涉及显示技术领域，尤其涉及一种驱动背板、显示面板及显示面板制备方法。The present application relates to the field of display technology, and in particular to a driving backplane, a display panel and a method for manufacturing the display panel.
背景技术Background technique
通常，一块显示屏由多块显示面板拼接形成，所以显示面板上有效显示区（Active Area）的占比会影响显示面板拼接后有效显示区间的间隙大小，而该间隙将直接决定显示屏的显示效果。为了尽可能缩小拼接后有效显示区间的间隙，需要缩小显示面板上的非有效显示区，所以，目前相关技术中提出将驱动电路设置到显示面板的背面，正面仅设置连接发光单元的线路，这样驱动电路就不会占用非有效显示区，有利于缩小显示面板的边框。Usually, a display screen is formed by splicing multiple display panels, so the proportion of the active area (Active Area) on the display panel will affect the gap size of the effective display interval after the display panels are spliced, and the gap will directly determine the display of the display screen. Effect. In order to reduce the gap between the effective display intervals after splicing as much as possible, it is necessary to reduce the non-effective display area on the display panel. Therefore, in the current related art, it is proposed to arrange the driving circuit on the back of the display panel, and only arrange the lines connecting the light-emitting units on the front, so that The driving circuit will not occupy the non-effective display area, which is beneficial to shrinking the frame of the display panel.
在连接显示面板的正面线路与背面线路时，目前常采用的是过孔连接方案，但在驱动背板中设置太多过孔会影响驱动背板的机械强度，导致降低显示面板的可靠性不高。When connecting the front circuit and the rear circuit of the display panel, the via hole connection scheme is often used at present, but setting too many via holes in the driver backplane will affect the mechanical strength of the driver backplane, resulting in lower reliability of the display panel. high.
因此，如何避免驱动背板正面与背面线路连接对驱动背板机械强度的影响是目前亟待解决的问题。Therefore, how to avoid the impact on the mechanical strength of the driving backplane caused by the wiring connection between the front side and the back side of the driving backplane is an urgent problem to be solved at present.
技术问题technical problem
鉴于上述相关技术的不足，本申请的目的在于提供一种驱动背板、显示面板及显示面板制备方法，旨在解决目前连接驱动背板正面与背面线路的方案影响驱动背板机械强度，导致显示面板品质不佳的问题。In view of the deficiencies in the above-mentioned related technologies, the purpose of this application is to provide a driving backplane, a display panel and a method for preparing a display panel, aiming at solving the problem that the current scheme of connecting the front and back circuits of the driving backplane affects the mechanical strength of the driving backplane, causing the display Problem with poor panel quality.
技术解决方案technical solution
本申请提供一种驱动背板，包括：The application provides a drive backplane, including:
基底，所述基底包括两个相对的承载表面及介于两个所述承载表面间的基底侧面，且两个所述承载表面中的一个包括被配置为承载发光单元的有效显示区；a base, the base includes two opposite bearing surfaces and a side surface of the base between the two bearing surfaces, and one of the two bearing surfaces includes an effective display area configured to bear a light-emitting unit;
设置于所述承载表面的承载面信号线组，所述承载面信号线组由位于不同承载表面且相对的两个承载面信号线构成；A load-bearing surface signal line group disposed on the load-bearing surface, the load-bearing surface signal line group is composed of two load-bearing surface signal lines that are located on different load-bearing surfaces and face each other;
设置于所述基底侧面且位置与所述承载面信号线组对应的侧面信号线；以及a side signal line disposed on the side of the base and corresponding to the group of signal lines on the carrying surface; and
导电锚点组，其由两个嵌于所述基底且分设于所述侧面信号线两端的导电锚点构成；所述导电锚点的部分表面外露于所述承载表面，部分表面外露于所述基底侧面，且所述导电锚点外露的表面中并至少部分与所述承载面信号线重合，至少部分与所述侧面信号线重合。The conductive anchor point group is composed of two conductive anchor points embedded in the base and separately arranged at both ends of the side signal line; part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the The side surface of the substrate, and the exposed surface of the conductive anchor point is at least partially coincident with the signal line of the bearing surface, and at least partially coincident with the signal line of the side surface.
基于同样的发明构思，本申请还提供一种显示面板，包括：Based on the same inventive concept, the present application also provides a display panel, including:
多颗发光单元；以及multiple light emitting units; and
上述驱动背板；The above drive backplane;
其中，多颗发光单元设置在有效显示区中，且芯片电极与有效显示区中的承载面信号线电连接。Wherein, a plurality of light-emitting units are arranged in the effective display area, and the chip electrodes are electrically connected to the signal lines on the bearing surface in the effective display area.
基于同样的发明构思，本申请还提供一种显示面板制备方法，应用于上述显示面板的制备，显示面板制备方法包括：Based on the same inventive concept, the present application also provides a method for preparing a display panel, which is applied to the preparation of the above-mentioned display panel. The method for preparing the display panel includes:
提供一基底，基底包括两个相对的承载表面及介于两个承载表面之间的基底侧面，且两个承载表面中的一个包括被配置为承载发光单元的有效显示区；A substrate is provided, the substrate includes two opposite bearing surfaces and a side surface of the substrate between the two bearing surfaces, and one of the two bearing surfaces includes an effective display area configured to carry a light-emitting unit;
在有效显示区边缘设置由两个位置相对且开口于不同承载表面的盲孔所构成的盲孔组，并在盲孔中填充导电材料形成导电块；A blind hole group consisting of two blind holes opposite to each other and opening on different bearing surfaces is arranged on the edge of the effective display area, and a conductive material is filled in the blind holes to form a conductive block;
设置承载面信号线组、设置发光单元、形成导电锚点并设置侧面信号线；Set the signal line group on the bearing surface, set the light-emitting unit, form a conductive anchor point and set the side signal line;
其中，设置承载面信号线组包括：分别在两个承载表面设置相对的承载面信号线构成承载面信号线组，承载面信号线覆盖在导电块外露的至少部分区域上；设置发光单元包括：在有效显示区中设置多颗发光单元，发光单元的芯片电极与有效显示区中的承载面信号线电连接；形成导电锚点包括：去除基底位于有效显示区之外的部分区域以使导电块形成导电锚点，所述导电锚点的部分表面外露于所述承载表面，部分表面外露于所述基底侧面，且所述导电锚点外露的表面中并至少部分与所述承载面信号线重合，至少部分与所述侧面信号线重合；设置侧面信号线包括：在对应于同一盲孔组的两个导电锚点之间设置侧面信号线，侧面信号线覆盖在导电锚点外露的至少部分区域上。Wherein, setting the load-bearing surface signal line group includes: respectively setting opposite load-bearing surface signal lines on the two load-bearing surfaces to form a load-bearing surface signal line group, and the load-bearing surface signal line covers at least part of the exposed area of the conductive block; setting the light-emitting unit includes: A plurality of light-emitting units are arranged in the effective display area, and the chip electrodes of the light-emitting units are electrically connected to the signal lines on the bearing surface in the effective display area; forming a conductive anchor point includes: removing a part of the substrate located outside the effective display area to make the conductive block A conductive anchor point is formed, part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the substrate, and the exposed surface of the conductive anchor point is at least partially coincident with the signal line on the bearing surface , at least partly coincides with the side signal line; setting the side signal line includes: setting the side signal line between two conductive anchor points corresponding to the same blind hole group, and the side signal line covers at least part of the exposed area of the conductive anchor point superior.
有益效果Beneficial effect
上述驱动背板中为了连接基底两个承载表面的承载面信号线，在承载表面与基底侧面的棱处设置嵌入基底的导电锚点形成了导电锚点组，导电锚点部分表面外露于所述承载表面，部分表面外露于所述基底侧面。这种情况下只要保证导电锚点外露的表面中至少部分与承载面信号线重合，至少部分与侧面信号线重合，就可以实现承载面信号线组中位于不同承载表面的两个承载面信号线连通。在这种线路连接方案中，不需要在基底上设置过孔，不会影响驱动背板的机械强度，有利于提升驱动背板与显示面板的可靠性。同时，因为导电锚点的部分表面外露于承载表面，部分表面外露于基底侧面，利用导电锚点在承载表面与基底侧面的外露表面自然实现了线路的“拐弯”，不需要设置弯折的线路，避免了线路弯折而容易出现的断线问题，进一步提升了驱动背板的可靠性。In order to connect the signal lines on the bearing surfaces of the two bearing surfaces of the above-mentioned driving backplane, conductive anchor points embedded in the base are provided at the edge of the bearing surface and the side of the base to form a group of conductive anchor points, and part of the surface of the conductive anchor points is exposed to the As for the bearing surface, part of the surface is exposed on the side of the base. In this case, as long as at least part of the exposed surface of the conductive anchor point coincides with the signal line of the bearing surface, and at least partially coincides with the signal line of the side surface, two signal lines of the bearing surface located on different bearing surfaces in the signal line group of the bearing surface can be realized. connected. In this circuit connection scheme, there is no need to provide via holes on the substrate, and the mechanical strength of the driving backplane will not be affected, which is beneficial to improving the reliability of the driving backplane and the display panel. At the same time, because part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the base, the exposed surface of the conductive anchor point on the bearing surface and the side of the base naturally realizes the "bending" of the line, and there is no need to set a bent line , avoiding the disconnection problem that is easy to occur due to the bending of the line, and further improving the reliability of the driving backplane.
上述显示面板中，通过在基底设置导电锚点组，让导电锚点的部分表面外露于承载表面，部分表面外露于基底侧面，同时保证承载面信号线与侧面信号线均至少覆盖导电锚点外露的至少区域，从而实现了承载面信号线组中两个承载面信号线连通。在这种线路连接方案中，不需要在基底上设置过孔，不会影响驱动背板的机械强度，有利于提升驱动背板与显示面板的可靠性。同时，因为导电锚点的部分表面外露于承载表面，部分表面外露于基底侧面，利用导电锚点在承载表面与基底侧面的外露表面自然实现了线路的“拐弯”，不需要设置弯折的线路，避免了线路弯折而容易出现的断线问题，进一步提升了驱动背板的可靠性。In the above-mentioned display panel, by setting the conductive anchor point group on the base, part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the base, and at the same time, it is ensured that the signal line of the bearing surface and the side signal line are at least covered by the exposed conductive anchor point. At least the region, so as to realize the communication between the two bearing surface signal lines in the bearing surface signal line group. In this circuit connection scheme, there is no need to provide via holes on the substrate, and the mechanical strength of the driving backplane will not be affected, which is beneficial to improving the reliability of the driving backplane and the display panel. At the same time, because part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the base, the exposed surface of the conductive anchor point on the bearing surface and the side of the base naturally realizes the "bending" of the line, and there is no need to set a bent line , avoiding the disconnection problem that is easy to occur due to the bending of the line, and further improving the reliability of the driving backplane.
上述显示面板制备方法中，通过在基底的两个承载表面上设置未对相对盲孔并填充导电材料形成导电块，导电块位于有效显示区边缘，然后通过对基底有效显示区以外的区域进行去除，使得导电块形成嵌入基底但部分表面外露于承载表面，部分表面外露于基底侧面的导电锚点。在设置承载面信号线和侧面信号线时，保证承载面信号线覆盖在导电块的至少部分区域上让导电锚点外露于承载表面的部分与承载面信号线重合，同时在导电锚点组的两个导电锚点之间设置侧面信号线以连接两个导电锚点，从而实现了承载面信号线组中两个承载面信号线连通。在这种线路连接方案中，不需要在基底上设置过孔，不会影响驱动背板的机械强度，有利于提升驱动背板与显示面板的可靠性。同时，因为导电锚点的部分表面外露于承载表面，部分表面外露于基底侧面，利用导电锚点在承载表面与基底侧面的外露表面自然实现了线路的“拐弯”，不需要设置弯折的线路，避免了线路弯折而容易出现的断线问题，进一步提升了驱动背板的可靠性。In the above method of manufacturing a display panel, a conductive block is formed by setting unaligned blind holes on the two bearing surfaces of the substrate and filling conductive materials, the conductive block is located at the edge of the effective display area, and then the area other than the effective display area of the substrate is removed. , so that the conductive block forms a conductive anchor embedded in the substrate but part of the surface is exposed on the carrying surface, and part of the surface is exposed on the side of the substrate. When setting the bearing surface signal line and the side signal line, ensure that the bearing surface signal line covers at least part of the area of the conductive block so that the part of the conductive anchor point exposed on the bearing surface coincides with the bearing surface signal line, and at the same time in the conductive anchor point group A side signal line is arranged between the two conductive anchor points to connect the two conductive anchor points, thereby realizing the communication between the two load-bearing surface signal lines in the load-bearing surface signal line group. In this circuit connection scheme, there is no need to provide via holes on the substrate, and the mechanical strength of the driving backplane will not be affected, which is beneficial to improving the reliability of the driving backplane and the display panel. At the same time, because part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the base, the exposed surface of the conductive anchor point on the bearing surface and the side of the base naturally realizes the "bending" of the line, and there is no need to set a bent line , avoiding the disconnection problem that is easy to occur due to the bending of the line, and further improving the reliability of the driving backplane.
附图说明Description of drawings
图1为本申请一可选实施例中提供的驱动背板的第一种剖面结构示意图；FIG. 1 is a first cross-sectional schematic diagram of a drive backplane provided in an optional embodiment of the present application;
图2a为本申请一可选实施例中提供的驱动背板的第二种剖面结构示意图；FIG. 2a is a schematic diagram of a second cross-sectional structure of a drive backplane provided in an alternative embodiment of the present application;
图2b为本申请一可选实施例中提供的驱动背板的第三种剖面结构示意图；Fig. 2b is a schematic diagram of a third cross-sectional structure of the driving backplane provided in an alternative embodiment of the present application;
图2c为本申请一可选实施例中提供的驱动背板的第四种剖面结构示意图；Fig. 2c is a schematic diagram of a fourth cross-sectional structure of the drive backplane provided in an alternative embodiment of the present application;
图2d为本申请一可选实施例中提供的驱动背板的第五种剖面结构示意图；Fig. 2d is a schematic diagram of a fifth cross-sectional structure of the driving backplane provided in an alternative embodiment of the present application;
图2e为本申请一可选实施例中提供的驱动背板的第六种剖面结构示意图；Fig. 2e is a schematic diagram of a sixth cross-sectional structure of the driving backplane provided in an alternative embodiment of the present application;
图3为图1中驱动背板的一种侧视结构示意图；Fig. 3 is a side view structural schematic diagram of the driving backplane in Fig. 1;
图4为图1中驱动背板的一种俯视结构示意图；Fig. 4 is a top view structural schematic diagram of the drive backplane in Fig. 1;
图5为本申请一可选实施例中提供的显示面板的一种结构示意图；FIG. 5 is a schematic structural diagram of a display panel provided in an optional embodiment of the present application;
图6为本申请一可选实施例中提供的显示面板的另一种结构示意图；FIG. 6 is another schematic structural diagram of a display panel provided in an alternative embodiment of the present application;
图7为本申请另一可选实施例中提供的显示面板制备方法的一种流程示意图；FIG. 7 is a schematic flowchart of a method for manufacturing a display panel provided in another optional embodiment of the present application;
图8a为本申请另一可选实施例中示出的在基底上设置盲孔组后的一种剖面示意图；Fig. 8a is a schematic cross-sectional view of another optional embodiment of the present application after setting blind hole groups on the substrate;
图8b为本申请另一可选实施例中示出的在基底上设置盲孔组后的一种俯视示意图；Fig. 8b is a schematic top view of a group of blind holes on the substrate shown in another optional embodiment of the present application;
图9为本申请另一可选实施例中示出的去除有效显示区以外部分基底的示意图；FIG. 9 is a schematic diagram of removing part of the substrate outside the effective display area shown in another optional embodiment of the present application;
图10a为本申请另一可选实施例中示出的第一切割线与有效显示区、导电块的一种位置关系示意图；Fig. 10a is a schematic diagram of a positional relationship between the first cutting line, the effective display area and the conductive block shown in another optional embodiment of the present application;
图10b为本申请另一可选实施例中示出的第二切割线与有效显示区、导电块的一种位置关系示意图；Fig. 10b is a schematic diagram of a positional relationship between the second cutting line, the effective display area, and the conductive block shown in another optional embodiment of the present application;
图10c为本申请另一可选实施例中示出的第二切割线与有效显示区、导电块的另一种位置关系示意图；Fig. 10c is a schematic diagram of another positional relationship between the second cutting line, the effective display area and the conductive block shown in another optional embodiment of the present application;
图11为本申请又一可选实施例中提供的显示面板制备方法的一种流程示意图；FIG. 11 is a schematic flowchart of a method for manufacturing a display panel provided in another optional embodiment of the present application;
图12为本申请又一可选实施例中提供的显示面板制备方法的一种制程状态变化示意图；FIG. 12 is a schematic diagram of a process state change of a display panel manufacturing method provided in another optional embodiment of the present application;
图13为本申请又一可选实施例中提供的剥离基底上设置盲孔后的一种俯视示意图；Fig. 13 is a schematic top view of a blind hole provided on a peeling substrate provided in another optional embodiment of the present application;
图14为本申请又一可选实施例中示出的第二切割线、第三切割线与有效显示区、盲孔的一种位置关系示意图。FIG. 14 is a schematic diagram of a positional relationship between the second cutting line, the third cutting line, the effective display area, and the blind hole shown in another optional embodiment of the present application.
附图标记说明：Explanation of reference signs:
10-驱动背板；11-基底；110a-承载表面；110b-基底侧面；111-有效显示区；12-承载面信号线组；120-承载面信号线；130-侧面信号线；14-导电锚点组；140-导电锚点；140a-导电正面；140b-导电侧面；151-绝缘隔离层；152-侧面保护层；20a-驱动背板；20b-驱动背板；5-显示面板；50-驱动背板；51-发光单元；52-封装胶层；6-显示面板；800-盲孔；801-导电块；81-基底；810a-承载表面；810b-基底侧面；811-有效显示区；840-导电锚点；840a-导电正面；840b-导电侧面；1200-显示面板；1201-玻璃基底；1202-盲孔；1203-导电块；1204-正面信号线；1205-背面信号线；1206-绝缘隔离层；1207-发光单元；1208-封装胶层；1209-导电锚点；1210-侧面信号线；1211-侧面保护层。1400-有效显示区；1402-第二切割线；1403-第三切割线。10-drive backplane; 11-base; 110a-loading surface; 110b-side of base; 111-effective display area; Anchor group; 140-conductive anchor point; 140a-conductive front; 140b-conductive side; 151-insulation isolation layer; 152-side protection layer; 20a-drive backplane; 20b-drive backplane; 5-display panel; 50 -drive backplane; 51-light-emitting unit; 52-encapsulation adhesive layer; 6-display panel; 800-blind hole; 801-conductive block; 81-base; ;840-conductive anchor point; 840a-conductive front; 840b-conductive side; 1200-display panel; 1201-glass substrate; 1202-blind hole; 1203-conductive block; 1204-front signal line; - insulating isolation layer; 1207 - light-emitting unit; 1208 - packaging adhesive layer; 1209 - conductive anchor point; 1210 - side signal line; 1211 - side protection layer. 1400-effective display area; 1402-second cutting line; 1403-third cutting line.
本发明的实施方式Embodiments of the present invention
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳实施方式。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本申请的公开内容理解的更加透彻全面。In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.
在相关技术中，为了实现驱动背板正面与背面线路的连接，通常会选择在驱动背板上设置过孔，利用过孔实现两面线路的连接，不过可以理解的是，由于驱动背板正面与背面有多组线路需要分别连接，这就需要在驱动背板上设置大量的过孔，且这些过孔基本都集中在有效显示区之外，也即驱动背板的边缘区域，这就必然导致驱动背板边缘区域的机械强度差，影响驱动背板与显示面板的可靠性。In the related art, in order to realize the connection between the front and back lines of the driving backplane, via holes are usually selected on the driving backplane, and the connection between the two sides of the lines is realized by using the via holes. There are multiple groups of lines on the back that need to be connected separately, which requires a large number of vias on the driver backplane, and these vias are basically concentrated outside the effective display area, that is, the edge area of the driver backplane, which will inevitably lead to The poor mechanical strength of the edge area of the driving backplane affects the reliability of the driving backplane and the display panel.
基于此，本申请希望提供一种能够解决上述技术问题的方案，其详细内容将在后续实施例中得以阐述。Based on this, the present application hopes to provide a solution capable of solving the above-mentioned technical problems, the details of which will be described in subsequent embodiments.
本申请一可选实施例：An optional embodiment of the application:
本申请首先提供一种驱动背板，请参见图1-6，图1示出的是该驱动背板的剖面结构示意图：驱动背板10包括基底11、承载面信号线组12以及侧面信号线130、导电锚点组14。This application firstly provides a driving backplane, please refer to Figures 1-6, Figure 1 shows a schematic cross-sectional structure of the driving backplane: the driving backplane 10 includes a base 11, a signal line group 12 on the carrying surface, and side signal lines 130. Conductive anchor point group 14.
其中，基底11包括两个承载表面110a，“承载表面”，顾名思义，基底11中进行器件承载的表面，被承载的器件包括发光单元、驱动芯片等。因为基底11为板状，通常不厚，所以两个承载表面110a是就是基底11中面积最大的两个表面。其中一个承载表面110a包含有效显示区111，用于承载发光单元，在本实施例中，为了便于后文的介绍，将设有有效显示区111的一个承载表面110a记为“基底正面”，将另一个承载表面记为“基底背面”。另外，基底11还包括位于两个承载表面110a之间的基底侧面110b，以承载表面110a呈矩形为例，基底11中有四个基底侧面110b。当然，基底11的形状并不仅限于矩形一种，还可以是其他任意便于拼接的形状。Wherein, the substrate 11 includes two carrying surfaces 110a. The "carrying surface", as the name implies, is the surface of the substrate 11 for carrying devices, and the carried devices include light emitting units, driving chips, and the like. Because the base 11 is plate-shaped and generally not thick, the two bearing surfaces 110 a are the two surfaces with the largest areas in the base 11 . One of the carrying surfaces 110a includes an effective display area 111 for carrying the light-emitting unit. In this embodiment, for the convenience of the following description, the carrying surface 110a provided with the effective display area 111 is marked as "the front side of the base", and The other load-bearing surface is referred to as the "backside of the substrate". In addition, the base 11 further includes a base side 110b located between the two bearing surfaces 110a. Taking the bearing surface 110a as an example, there are four base sides 110b in the base 11 . Of course, the shape of the base 11 is not limited to a rectangle, but can also be any other shape that is convenient for splicing.
一个承载面信号线组12可以由两个分别位于不同承载表面110a的承载面信号线120构成，两个承载面信号线120位置相对。在本实施例中，将位于基底正面的承载面信号线120记为“正面信号线”，将位于基底背面的承载面信号线120记为“背面信号线”。A bearing surface signal wire group 12 may be composed of two bearing surface signal wires 120 respectively located on different bearing surfaces 110a, and the two bearing surface signal wires 120 are opposite to each other. In this embodiment, the signal lines 120 on the bearing surface located on the front of the substrate are marked as "front signal lines", and the signal lines 120 on the bearing surface located on the back of the substrate are marked as "back signal lines".
侧面信号线130与承载面信号线组12对应，其用于连接承载面信号线组12中的两个承载面信号线120。The side signal wires 130 correspond to the bearing surface signal wire group 12 , and are used to connect two bearing surface signal wires 120 in the bearing surface signal wire group 12 .
一个导电锚点组14中包括两个嵌入基底11的导电锚点140，导电锚点140位于承载表面110b与基底侧面110b之间的棱上，导电锚点140部分表面外露于基底11，其中部分表面外露于承载表面110a，另一部分外露于基底侧面110b。导电锚点组14与承载面信号线组12一一对应，其中一个导电锚点140用于连接正面信号线与侧面信号线130一端，另一个导电锚点140用于连接背面信号线与侧面信号线130的另一端。所以导电锚点140外露的表面中至少部分与承载面信号线120重合，至少部分与侧面信号线130重合，换言之，承载面信号线120至少覆盖导电锚点140外露表面的至少部分区域，侧面信号线130也是至少覆盖导电锚点140外露表面的至少部分区域。A conductive anchor point group 14 includes two conductive anchor points 140 embedded in the substrate 11. The conductive anchor points 140 are located on the edge between the bearing surface 110b and the side surface 110b of the substrate. Part of the surface of the conductive anchor point 140 is exposed to the substrate 11. One surface is exposed on the bearing surface 110a, and the other part is exposed on the base side 110b. The conductive anchor point group 14 is in one-to-one correspondence with the signal line group 12 on the carrying surface, one of the conductive anchor points 140 is used to connect the front signal line and one end of the side signal line 130, and the other conductive anchor point 140 is used to connect the rear signal line and the side signal line. the other end of line 130. Therefore, at least part of the exposed surface of the conductive anchor point 140 coincides with the signal line 120 on the bearing surface, and at least partially overlaps with the signal line 130 on the side surface. The wire 130 also covers at least a partial area of the exposed surface of the conductive anchor 140 .
在本实施例的一些示例中，每一个导电锚点140有两个面外露：一个是与承载表面110a朝向相同的导电正面140a，另一个是与基底侧面110b朝向相同的导电侧面140b，且导电正面140a同导电侧面140b间的棱与承载表面110a同基底侧面110b间的棱重合。导电锚点140的导电正面140a至少部分与承载面信号线120重合，导电侧面140b至少部分与侧面信号线130重合，请继续参见图1所示。In some examples of this embodiment, each conductive anchor point 140 has two exposed surfaces: one is the conductive front 140a facing the same direction as the carrying surface 110a, and the other is the conductive side 140b facing the same direction as the base side 110b, and is conductive. The edge between the front surface 140a and the conductive side 140b coincides with the edge between the carrying surface 110a and the base side 110b. The conductive front 140a of the conductive anchor 140 is at least partially coincident with the signal line 120 on the carrying surface, and the conductive side 140b is at least partially coincident with the side signal line 130 , please continue to refer to FIG. 1 .
毫无疑义地，导电锚点140具有导电性，其承担了承载面信号线120与侧面信号线130之间的电连接功能，一方面，导电正面140a与承载表面110a朝向相同，且导电正面140a的至少部分区域与设置于承载表面110a的承载面信号线120重合，所以可以实现承载面信号线120与导电锚点140的电连接；另一方面，导电侧面140b与基底侧面110b朝向相同，且导电侧面140b的至少部分区域与设置于基底侧面110b的侧面信号线130重合，所以可以实现侧面信号线130与导电锚点140的电连接。因此，利用导电锚点组14中的两个导电锚点140，结合一个侧面信号线130，实现了承载面信号线组12中两个分别位于不同承载表面110a的承载面信号线120的电连接。Undoubtedly, the conductive anchor point 140 has conductivity, and it undertakes the electrical connection function between the signal line 120 on the carrying surface and the signal line 130 on the side. At least part of the area of the bearing surface coincides with the bearing surface signal line 120 provided on the bearing surface 110a, so the electrical connection between the bearing surface signal line 120 and the conductive anchor point 140 can be realized; on the other hand, the conductive side 140b and the base side 110b face the same direction, and At least a partial area of the conductive side 140b coincides with the side signal line 130 disposed on the base side 110b, so the electrical connection between the side signal line 130 and the conductive anchor point 140 can be realized. Therefore, by using the two conductive anchor points 140 in the conductive anchor point group 14, combined with one side signal line 130, the electrical connection of two load-bearing surface signal lines 120 respectively located on different load-bearing surfaces 110a in the load-bearing surface signal line group 12 is realized. .
在图1示出的驱动背板10中，导电锚点140外露的区域中只有一条棱，且该棱是作为两个相互垂直的平面（即导电正面140a与导电侧面140b）的分界线，同时，该棱与基底11的承载表面110a与基底侧面110b间的棱重合。但本领域技术人员应当明白的是，上述几个特征并不是本实施例所提供的导电锚点必须具有的特征，例如，在本实施例其他一些示例中，导电锚点140外露区域中也可以没有棱，例如，在一些示例中，导电锚点140外露的表面为曲面（例如可以是球面的部分区域、抛物面），在驱动背板20a的剖面示意图中，导电锚点140外露区域的轮廓为弧形，请参见图2a所示。另一些示例中，导电锚点140外露区域中存在一条棱，但该棱并不是两个平面的分界线，而是一个曲面与一个平面的分界线，例如请参见图2b中示出的驱动背板20b的剖面示意图，在该图中，导电锚点140外露区域的轮廓由曲线与直线共同构成。还有一些示例中，导电锚点140外露的区域中可以存在两条甚至两条以上的棱，请参见图2c示出的驱动背板20c的一种剖面示意图，在图2c中，这些棱均是平面与平面的分界线，但在本实施例的其他一些示例中，这些棱中的至少部分也可以作为曲面与曲面或曲面与平面的分界线。而且，导电锚点140外露的区域中的棱可以与基底侧面110b与承载表面110a之间的棱不重合。In the driving backplane 10 shown in FIG. 1, there is only one edge in the exposed area of the conductive anchor point 140, and this edge is used as a boundary between two mutually perpendicular planes (ie, the conductive front surface 140a and the conductive side surface 140b). , the edge coincides with the edge between the bearing surface 110a of the substrate 11 and the substrate side 110b. However, those skilled in the art should understand that the above-mentioned features are not necessarily the features of the conductive anchor point provided in this embodiment. For example, in some other examples of this embodiment, the exposed area of the conductive anchor point 140 can also be There are no edges. For example, in some examples, the exposed surface of the conductive anchor point 140 is a curved surface (for example, it may be a partial area of a sphere or a paraboloid). arc, see Figure 2a. In other examples, there is an edge in the exposed area of the conductive anchor point 140, but this edge is not a boundary line between two planes, but a boundary line between a curved surface and a plane. For example, please refer to the driving back shown in FIG. 2b. A schematic cross-sectional view of the board 20b. In this figure, the outline of the exposed area of the conductive anchor point 140 is composed of curves and straight lines. In some other examples, there may be two or more ribs in the exposed area of the conductive anchor point 140. Please refer to a schematic cross-sectional view of the drive backplane 20c shown in FIG. 2c. In FIG. 2c, these ribs are is the boundary line between the plane and the plane, but in some other examples of this embodiment, at least part of these edges can also serve as the boundary line between the curved surface or the curved surface and the plane. Moreover, the ribs in the exposed areas of the conductive anchors 140 may not coincide with the ribs between the substrate side 110b and the carrying surface 110a.
可以理解的是，导电锚点组14、侧面信号线130、承载面信号线组12之间存在对应关系，具有对应关系的导电锚点组14、侧面信号线130、承载面信号线组12可以构成一条线路，在本实施例中，一个驱动背板10中可以包括两条甚至多条线路，因此，驱动背板10中可以包括两个及以上的导电锚点组14、两个及以上的承载面信号线组12以及两条及以上的侧面信号线130。在本实施例中，侧面信号线130可以仅分布在基底11的一个基底侧面110b上，也可以分布在不同的基底侧面110b上。It can be understood that there is a corresponding relationship between the conductive anchor point group 14, the side signal line 130, and the load-bearing surface signal line group 12, and the conductive anchor point group 14, the side signal line 130, and the load-bearing surface signal line group 12 with the corresponding relationship can be To form a line, in this embodiment, a drive backplane 10 may include two or more lines, therefore, the drive backplane 10 may include two or more conductive anchor groups 14, two or more The carrying surface signal line group 12 and two or more side signal lines 130 . In this embodiment, the side signal lines 130 may be distributed only on one side surface 110b of the substrate 11, or may be distributed on different side surfaces 110b of the substrate.
上述示例所提供的这种驱动背板11，利用导电锚点140在承载表面110a与基底侧面110b的外露表面自然实现了线路的“拐弯”，避免了设置弯折线路容易出现的断线问题，提升了连接的可靠性，增强了驱动背板10的品质。另外，因为在连接导电锚点140与承载面信号线120、侧面信号线130时，承载面信号线120与导电正面140a朝向相同，侧面信号线130与导电侧正面140b朝向相同，这样连接时不容易搭接错位，有利于提升驱动背板11的制备良率。同时，因为该驱动背板11中不同承载表面110a上承载面信号线120的连接不需要依赖过孔实现，避免了过孔对驱动背板11机械强度的影响，防止了破片问题的出现，提升了驱动背板11的品质。The driving backplane 11 provided in the above example uses the conductive anchor point 140 on the exposed surface of the bearing surface 110a and the base side 110b to naturally realize the "bending" of the circuit, avoiding the disconnection problem that is easy to occur when the bent circuit is set. The reliability of the connection is improved, and the quality of the driving backplane 10 is enhanced. In addition, when connecting the conductive anchor point 140 with the signal line 120 of the carrying surface and the signal line 130 on the side surface, the signal line 120 on the carrying surface faces the same direction as the conductive front surface 140a, and the side signal line 130 faces the same direction as the front surface 140b on the conductive side. It is easy to overlap and dislocate, which is beneficial to improve the production yield of the driving backplane 11 . At the same time, because the connection of the signal lines 120 on the bearing surface 110a on the different bearing surfaces 110a of the driving backplane 11 does not need to rely on via holes, the influence of the via holes on the mechanical strength of the driving backplane 11 is avoided, and the occurrence of fragmentation problems is prevented. The quality of the driving backplane 11 is improved.
通常情况下，在驱动背板11中还设置有对侧面信号线130与承载面信号线120中至少一个进行保护的保护层，例如图2d所示的另一种驱动背板20d的结构示意图，在本实施例的一些示例中，驱动背板11中设置有覆盖在承载面信号线120上的绝缘隔离层151。在本实施例的一些示例中，驱动背板11中还设置有覆盖在侧面信号线130上的侧面保护层152，侧面保护层152绝缘，其能够实现侧面信号线130与外部的电气隔离，如图2e中的驱动背板20e所示。可以理解的是，绝缘隔离层151与侧面保护层152可以同时设置。在本实施例的一些示例中，侧面保护层152可以为黑色胶层，例如，在本实施例的一些示例中，黑色胶层的OD（Optical Density，光密度）大于2。Usually, a protective layer for protecting at least one of the side signal lines 130 and the load-bearing surface signal lines 120 is also provided in the drive backplane 11, for example, a structural schematic diagram of another drive backplane 20d shown in FIG. 2d, In some examples of this embodiment, the driving backplane 11 is provided with an insulating isolation layer 151 covering the signal lines 120 on the carrying surface. In some examples of this embodiment, the drive backplane 11 is also provided with a side protection layer 152 covering the side signal lines 130, and the side protection layer 152 is insulated, which can realize the electrical isolation of the side signal lines 130 from the outside, such as Drive backplane 20e is shown in FIG. 2e. It can be understood that the insulating isolation layer 151 and the side protection layer 152 can be provided at the same time. In some examples of this embodiment, the side protection layer 152 can be a black adhesive layer, for example, in some examples of this embodiment, the OD (Optical Density, optical density) is greater than 2.
可以理解的是，因为侧面信号线130与侧面保护层152设置在基底侧面110b，因此，如果二者太厚，则会导致基于该驱动背板10所制备的显示面板在拼接时拼接间隙过大，进而影响所制得显示屏的显示效果，因此，在本实施例的一些示例中，会控制侧面信号线130与侧面保护层152的厚度，一些示例中，侧面信号线130与侧面保护层152中至少一个的厚度小于10um，在本实施例的另一些示例中，要求侧面信号线130与侧面保护层152的厚度之和小于20um，例如可以为15um、17um、20um等，应当理解的是，侧面信号线130与侧面保护层152的厚度方向是指垂直于基底侧面110b的方向。It can be understood that, because the side signal lines 130 and the side protection layer 152 are arranged on the base side 110b, if the two are too thick, the splicing gap of the display panel prepared based on the drive backplane 10 will be too large during splicing. , which in turn affects the display effect of the manufactured display screen. Therefore, in some examples of this embodiment, the thicknesses of the side signal lines 130 and the side protection layer 152 will be controlled. In some examples, the side signal lines 130 and the side protection layer 152 The thickness of at least one of them is less than 10um. In other examples of this embodiment, the sum of the thicknesses of the side signal line 130 and the side protection layer 152 is required to be less than 20um, such as 15um, 17um, 20um, etc. It should be understood that, The thickness direction of the side signal line 130 and the side protection layer 152 refers to a direction perpendicular to the side surface 110b of the substrate.
在本实施例的一些示例中，承载面信号线120的线宽大于导电正面140a在同方向上的尺寸，应当理解的是，承载面信号线120的线宽方向实际上就是同导电正面140a与导电侧面140b间棱平行的方向。在本实施例的一些示例中，承载面信号线120可以将导电锚点140的导电正面140a全部覆盖。In some examples of this embodiment, the line width of the signal line 120 on the carrying surface is larger than the size of the conductive front surface 140a in the same direction. The direction between the side faces 140b is parallel to the ribs. In some examples of this embodiment, the signal line 120 on the bearing surface may completely cover the conductive front surface 140 a of the conductive anchor point 140 .
在本实施例的一些示例中，侧面信号线130的线宽大于导电侧面140b在同方向上的尺寸，应当理解的是，侧面信号线130的线宽方向也是同导电正面140a与导电侧面140b间棱平行的方向。在本实施例的一些示例中，侧面信号线130可以将导电锚点140的导电侧面140b全部覆盖。In some examples of this embodiment, the line width of the side signal line 130 is larger than the size of the conductive side surface 140b in the same direction. parallel direction. In some examples of this embodiment, the side signal line 130 may completely cover the conductive side 140 b of the conductive anchor 140 .
在本实施例的一些示例中，导电锚点140的导电侧面140b为矩形，请参见图3示出的设有锚点锚点的基底11的一种侧视结构示意图，当然，本实施例中并不排除导电侧面140b可以为其他几何形状，只是因为导电锚点140通常是通过在设于基底11的盲孔中填充导电材料后切割和/或研磨基底11得到的，而盲孔常为柱状，因此导电侧面140b大多为矩形。在本实施例的一些示例中，导电锚点140的导电正面140a也可以为矩形或者是弓形。本实施例中所说的弓形是指由圆弧以及连接圆弧两端的直线构成的图案，例如，请参见图4示出的设有锚点锚点的基底11的一种俯视结构示意图。在图4中，导电正面140a为优弧弓形（即包含的圆弧大于半圆的弓形），不过，在本实施例的其他一些示例中，导电正面140a为劣弧弓形（即包含的圆弧小于半圆的弓形）或者半圆形。在本实施例的其他一些示例中，导电锚点140的导电正面140a也可以为三角形、梯形或者其他多边形等。In some examples of this embodiment, the conductive side 140b of the conductive anchor point 140 is a rectangle, please refer to FIG. It is not excluded that the conductive side 140b can be in other geometric shapes, just because the conductive anchor point 140 is usually obtained by cutting and/or grinding the substrate 11 after filling the conductive material in the blind hole provided in the substrate 11, and the blind hole is usually columnar , so the conductive side 140b is mostly rectangular. In some examples of this embodiment, the conductive front surface 140a of the conductive anchor point 140 may also be rectangular or arcuate. The bow shape mentioned in this embodiment refers to a pattern formed by a circular arc and a straight line connecting two ends of the circular arc. For example, please refer to FIG. 4 for a schematic top view of the base 11 with anchor points. In Fig. 4, the conductive front surface 140a is in the shape of a superior arc (that is, the arc included is larger than the semicircle), however, in some other examples of this embodiment, the conductive front 140a is in the shape of a inferior arc (that is, the arc included is smaller than the semicircle). semicircular bow) or semicircular. In some other examples of this embodiment, the conductive front surface 140a of the conductive anchor point 140 may also be triangular, trapezoidal, or other polygonal shapes.
本实施例中还提供一种显示面板，请参见图5所示：该显示面板5包括驱动背板50以及多颗发光单元51，驱动背板50可以为前述任一示例中提供的驱动背板，例如驱动背板10等。发光单元51设置在驱动背板50的有效显示区111中，并且与该有效显示区111所在承载表面110a中的承载面信号线120电连接。在本实施例中，显示面板5中的发光单元51包括红光芯片、绿光芯片和蓝光芯片，显示面板5为彩色显示面板；在本实施例的其他一些示例中，多颗发光单元51中也还可以进一步包括白光芯片、黄光芯片等。一些示例中，发光单元51可以为Micro-LED（微LED）芯片、Mini-LED（迷你LED）芯片、OLED（Organic Light-Emitting Diode，有机发光半导体）芯片以及普通发光单元中的任意一种。另外，本实施例中并不限定发光单元51的具体结构，例如其可以为倒装结构的芯片，也可以为正装结构的芯片；可以为横向结构的芯片，也可以为垂直结构的芯片。This embodiment also provides a display panel, as shown in FIG. 5 : the display panel 5 includes a driving backplane 50 and a plurality of light-emitting units 51 , and the driving backplane 50 can be the driving backplane provided in any of the aforementioned examples. , such as driving the backplane 10 and the like. The light emitting unit 51 is disposed in the active display area 111 of the driving backplane 50 and is electrically connected to the signal line 120 on the carrying surface 110 a where the effective display area 111 is located. In this embodiment, the light emitting unit 51 in the display panel 5 includes a red chip, a green chip and a blue chip, and the display panel 5 is a color display panel; It can also further include a white light chip, a yellow light chip, and the like. In some examples, the light emitting unit 51 may be any one of Micro-LED (micro LED) chip, Mini-LED (miniature LED) chip, OLED (Organic Light-Emitting Diode, organic light-emitting semiconductor) chip and common light emitting unit. In addition, the specific structure of the light emitting unit 51 is not limited in this embodiment, for example, it may be a chip with a flip-chip structure or a chip with a front-mount structure; it may be a chip with a horizontal structure or a chip with a vertical structure.
在本实施例的一些示例中，显示面板上还可以设置有封装胶层52，请参见图6：显示面板6中，在驱动背板50设有发光单元51的一面设置有封装胶层52，发光单元51没于封装胶层52中，封装胶层52通过封装胶形成，在本实施例的一些示例中，封装胶可以为半透胶；还有一些示例中，封装胶为黑胶，这样可以实现封装黑化。在本实施例的一些示例中，封装胶层52中包括黑胶层与半透胶层，其中黑胶层比半透胶层更靠近驱动背板50。可选地，黑胶层的厚度可以为50um左右，固化后硬度大于2H，而半透胶层的厚度可以在210um左右，固化后硬度大于1H。In some examples of this embodiment, an encapsulation adhesive layer 52 may also be provided on the display panel, please refer to FIG. 6 : in the display panel 6, an encapsulation adhesive layer 52 is provided on the side of the driving backplane 50 where the light-emitting unit 51 is provided. The light-emitting unit 51 is not contained in the packaging glue layer 52, and the packaging glue layer 52 is formed by the packaging glue. In some examples of this embodiment, the packaging glue can be semi-permeable glue; in some examples, the packaging glue is black glue, so Encapsulation blackening can be achieved. In some examples of this embodiment, the packaging adhesive layer 52 includes a black adhesive layer and a semi-permeable adhesive layer, wherein the black adhesive layer is closer to the driving backplane 50 than the semi-permeable adhesive layer. Optionally, the thickness of the black glue layer can be about 50um, and the hardness after curing is greater than 2H, while the thickness of the semi-permeable glue layer can be about 210um, and the hardness after curing is greater than 1H.
可以理解的是，在制备显示面板的时候，可以先制备出驱动背板50，包括形成承载面信号线120、导电锚点140以及侧面信号线130，甚至还包括形成保护层等，然后再在驱动背板50上设置发光单元51及封装胶层52等。但还一些示例中，也可以不用先形成完整的驱动背板50，而是直接基于基底11制备出显示面板，在这种情况下，可能是先在基底11的有效显示区111中设置了多颗与承载面信号线120电连接的发光单元51，并完成封装胶层52的设置，然后才形成侧面信号线130的，在这种情况下，侧面信号线130及其侧面保护层152都是在封装胶层52设置完成以后才设置的，如果在设置过程中让侧面保护层152和/或侧面信号线覆盖到显示面板的出光面，就会影响显示面板的显示效果，尤其是当侧面保护层152为黑胶保护层的情况下，因此，在本实施例的一些示例中要求侧面信号线的长度小于基底11与封装胶层52的厚度之和。在一种示例中侧面信号线130的长度小于封装胶层52的厚度的一半与基底11厚度的和。It can be understood that when preparing the display panel, the driving backplane 50 can be prepared first, including the formation of the signal lines 120 on the bearing surface, the conductive anchor points 140 and the side signal lines 130, and even the formation of a protective layer, etc., and then on the A light emitting unit 51 , an encapsulation glue layer 52 and the like are disposed on the driving backplane 50 . However, in some examples, instead of forming a complete driving backplane 50 first, the display panel can be directly prepared based on the substrate 11. In this case, multiple The light-emitting unit 51 that is electrically connected to the signal line 120 on the bearing surface, and the setting of the encapsulation layer 52 is completed, and then the side signal line 130 is formed. In this case, the side signal line 130 and its side protection layer 152 are both It is set after the encapsulation layer 52 is set. If the side protection layer 152 and/or the side signal lines cover the light-emitting surface of the display panel during the setting process, it will affect the display effect of the display panel, especially when the side protection layer 152 is set. When the layer 152 is a vinyl protective layer, therefore, in some examples of this embodiment, the length of the side signal lines is required to be less than the sum of the thicknesses of the substrate 11 and the encapsulation layer 52 . In one example, the length of the side signal line 130 is less than the sum of half the thickness of the packaging adhesive layer 52 and the thickness of the substrate 11 .
本实施例提供的驱动背板与显示面板，通过侧面信号线与侧面信号线两端的导电锚点连接位于基底不同承载表面的承载面信号线，不依赖于过孔的设置，有利于提升启动背板的机械性能，增强显示面板的品质。同时，因为正面信号线只需要与靠近基底正面的导电锚点的导电正面连接，背面信号线只需要与靠近基底背面的导电锚点的导电正面连接，而侧面信号线则只需要与导电锚点的侧面连接，都是属于同一面的连接，不容易出现搭接错位的情形，有利于提升驱动背板或显示面板的制备良率。最后，利用导电锚点外露的表面与信号线连接，不仅可以自然实现线路拐弯，避免断线风险，同时也因为是导电锚点的面与具有较大线宽的信号线的连接，增加了搭接面积，降低了搭接阻抗。The drive backplane and the display panel provided in this embodiment are connected to the signal lines on the carrying surface on different carrying surfaces of the substrate through the side signal lines and the conductive anchor points at both ends of the side signal lines, which is not dependent on the setting of via holes, which is beneficial to improve the start-up backplane. The mechanical properties of the board enhance the quality of the display panel. At the same time, because the front signal line only needs to be connected to the conductive front side of the conductive anchor point close to the front side of the substrate, the rear signal line only needs to be connected to the conductive front side of the conductive anchor point close to the back side of the substrate, and the side signal line only needs to be connected to the conductive anchor point The side connections are all connected on the same side, and it is not easy to cause overlapping and misalignment, which is conducive to improving the production yield of the driving backplane or display panel. Finally, using the exposed surface of the conductive anchor point to connect to the signal line can not only realize the natural turning of the line and avoid the risk of disconnection, but also because the surface of the conductive anchor point is connected to the signal line with a larger line width, it increases the risk of overlap. The connection area reduces the bonding impedance.
本申请另一可选实施例：Another optional embodiment of this application:
本实施例提供一种显示面板的制备方法，请参见图7示出的一种流程图：This embodiment provides a method for manufacturing a display panel, please refer to a flow chart shown in FIG. 7:
S702：提供一基底。S702: Provide a base.
本实施例提供的基底可以为树脂基板、玻璃基板、蓝宝石基板等，其呈板状机构，具有两个相对的承载表面，以及介于承载表面之间的一个或多个基底侧面。在基底的一个承载表面中，包含一个拟将设置多颗发光单元的区域，该区域就是基底的有效显示区。The substrate provided in this embodiment can be a resin substrate, a glass substrate, a sapphire substrate, etc., which is a plate-shaped structure with two opposite carrying surfaces and one or more sides of the substrate between the carrying surfaces. A bearing surface of the base includes an area where a plurality of light-emitting units are to be arranged, and this area is the effective display area of the base.
S704：在有效显示区边缘设置由两个位置相对且开口位于不同承载表面的盲孔构成盲孔组，并在盲孔中填充导电材料形成导电块。S704: setting a blind hole group at the edge of the effective display area, consisting of two opposite blind holes with openings on different carrying surfaces, and filling the blind holes with conductive material to form a conductive block.
随后，可以在基底中设置多个盲孔组，一个盲孔组中的一个盲孔用于形成一个导电锚点，因此一个盲孔组对应一个导电锚点组，其中包括两个盲孔。盲孔是指连接基底表层和内层而不贯通整版的导通孔。请参见图8a示出的基底81上设置盲孔组的一种剖面示意图：盲孔组中两个盲孔800的位置相对但开口朝向相反，两个盲孔800的开口分别位于基底81的两个承载表面810a上。Subsequently, a plurality of blind hole groups may be provided in the substrate, and one blind hole in one blind hole group is used to form one conductive anchor point, so one blind hole group corresponds to one conductive anchor point group, including two blind holes. Blind vias refer to via holes that connect the surface layer and the inner layer of the substrate without penetrating the entire plate. Please refer to a schematic cross-sectional view of a blind hole group set on a base 81 shown in FIG. on a bearing surface 810a.
可以理解的是，由于盲孔组是为了形成导电锚点组，因此盲孔组的数目与导电锚点组的数目相关，而导电锚点组的数目实际上与基底上需要设置线路的情况相关。通常情况下，一块显示面板的正面与背面上会存在多组线路需要连通，因此一个基底81上的盲孔组通常也会有多个。不过，由于各盲孔组形成导电锚点组的过程类似，因此，后续示例中将主要以一对盲孔组进行介绍。It can be understood that since the blind hole group is to form a conductive anchor point group, the number of the blind hole group is related to the number of the conductive anchor point group, and the number of the conductive anchor point group is actually related to the situation where the circuit needs to be arranged on the substrate . Usually, there are multiple groups of lines on the front and back of a display panel that need to be connected, so there are usually multiple groups of blind holes on a substrate 81 . However, since the process of forming the conductive anchor point group by each blind hole group is similar, a pair of blind hole groups will be mainly introduced in the following examples.
在本实施例中，因为一个盲孔组中两个盲孔800在基底81上位置相对，因此一个盲孔组中两个盲孔800的深度之和应当小于基底81的厚度。在本实施例的一些示例中，两个盲孔800的深度均小于基底81厚度的一半。在这里将基底81的厚度记为“D1”，将盲孔800的深度记为“h”，则h＜D1/2。In this embodiment, since the two blind holes 800 in a blind hole group are opposite to each other on the substrate 81 , the sum of the depths of the two blind holes 800 in a blind hole group should be smaller than the thickness of the substrate 81 . In some examples of this embodiment, the depths of the two blind holes 800 are both less than half of the thickness of the substrate 81 . Here, the thickness of the base 81 is marked as "D1", and the depth of the blind hole 800 is marked as "h", then h<D1/2.
盲孔800的纵剖面通常为矩形，如图8所示，但在本实施例的一些示例中，盲孔800的纵剖面也可以为梯形甚至是三角形等。盲孔800的横截面可以为圆形、矩形、椭圆形、菱形、三角形，还可以为其他规则或者不规则的几何形状，图8b中示出了一种设有盲孔的基底81的俯视示意图，在图8b中，盲孔800的横截面为圆形。可以理解的是，基底81上各盲孔800的形状、尺寸可以相同也可以不完全相同。不过在图8b中各盲孔800的横截面均为圆形。The longitudinal section of the blind hole 800 is generally rectangular, as shown in FIG. 8 , but in some examples of this embodiment, the longitudinal section of the blind hole 800 may also be trapezoidal or even triangular. The cross section of the blind hole 800 can be circular, rectangular, oval, rhombus, triangular, or other regular or irregular geometric shapes. FIG. 8 b shows a schematic top view of a substrate 81 with a blind hole , in FIG. 8b, the cross section of the blind hole 800 is circular. It can be understood that the shapes and sizes of the blind holes 800 on the base 81 may be the same or not completely the same. However, in FIG. 8b the cross-section of each blind hole 800 is circular.
设置盲孔组之后，可以在盲孔800中填充导电材料，利用导电材料在盲孔800中形成导电块。导电材料包括金属材料，例如包括但不限于Cu（铜）、Au（金）、Ag（银）、Mo（钼）、Ti（钛）等金属中的一种或几种。还有一些示例中，导电材料可以为导电胶，例如导电银胶等，还有一些示例中，导电材料可以包括CNT（碳纳米管材料）、石墨烯等。After the blind hole group is set, conductive material can be filled in the blind hole 800 , and a conductive block can be formed in the blind hole 800 by using the conductive material. The conductive material includes metal materials, such as but not limited to one or more of Cu (copper), Au (gold), Ag (silver), Mo (molybdenum), Ti (titanium) and other metals. In some other examples, the conductive material may be conductive glue, such as conductive silver glue, and in some other examples, the conductive material may include CNT (carbon nanotube material), graphene, and the like.
由于基底81后续需要经过切割、研磨等，才能使得导电块形成嵌入基底81并有两个面从基底81中外露的导电锚点，通常情况下，位于有效显示区811同一侧的各个盲孔组应该能够按照同一切割线进行切割，所以，在本实施例中，位于有效显示区811同一侧的各个盲孔800位于同一个面上，位于有效显示区811同一侧，且处于相同承载表面的各个盲孔800应该处于同一直线上，如图8b所示。Since the substrate 81 needs to be cut, ground, etc. in the future, the conductive block can form a conductive anchor point embedded in the substrate 81 and have two surfaces exposed from the substrate 81. Usually, each blind hole group located on the same side of the effective display area 811 It should be able to cut according to the same cutting line. Therefore, in this embodiment, the blind holes 800 on the same side of the effective display area 811 are located on the same surface, on the same side of the effective display area 811, and on the same loading surface. The blind holes 800 should be on the same line as shown in Figure 8b.
可以理解的是，在一些情况下，在盲孔800中设置导电材料之后，开口位于同一承载表面810a的各盲孔810中导电材料外露的表面可能并不齐平，例如，有的盲孔810中导电材料可能并没有将盲孔充满，但有的盲孔800中的导电材料可能已经外溢到承载表面810a上了。所以，在本实施例的一些示例中，为了保证填充导电材料之后基底81的承载表面810a继续维持平坦，所以在设置导电材料之后，可以将基底81进行打薄，例如可以通过研磨、切割等手段，在本实施例的一种示例中，可以采用HF（氢氟酸）对基底81进行腐蚀，可以理解的是，对基底81的打薄沿着其厚度方向进行，两侧的薄化厚度d0均不能超过盲孔800的深度h。在本实施例的一些示例中，d0＜h/2，可选地d0的取值为35μm~250μm，例如可以为35um、80um、120um、200um、245um或者250um。It can be understood that, in some cases, after the conductive material is placed in the blind hole 800, the exposed surface of the conductive material in the blind holes 810 whose openings are located on the same bearing surface 810a may not be flush, for example, some blind holes 810 The conductive material in some blind holes 800 may not have filled the blind holes, but the conductive material in some blind holes 800 may have overflowed onto the carrying surface 810a. Therefore, in some examples of this embodiment, in order to ensure that the carrying surface 810a of the base 81 remains flat after the conductive material is filled, the base 81 can be thinned after the conductive material is placed, for example, by means of grinding, cutting, etc. , in an example of this embodiment, HF (hydrofluoric acid) can be used to etch the substrate 81. It can be understood that the thinning of the substrate 81 is carried out along its thickness direction, and the thinned thickness d0 on both sides None of them can exceed the depth h of the blind hole 800 . In some examples of this embodiment, d0<h/2, optionally the value of d0 is 35 μm˜250 μm, for example, 35 um, 80 um, 120 um, 200 um, 245 um or 250 um.
S706：在有效显示区边缘设置由两个位置相对且开口于不同承载表面的盲孔所构成的盲孔组，并在盲孔中填充导电材料形成导电块。S706: setting a blind hole group consisting of two blind holes opposite to each other and opening on different carrying surfaces at the edge of the effective display area, and filling the blind holes with conductive material to form a conductive block.
在盲孔中设置了导电材料形成导电块以后，可以进行以下设置：After the conductive material is set in the blind hole to form a conductive block, the following settings can be made:
a）设置承载面信号线组；a) Set the bearing surface signal line group;
b）设置发光单元；b) setting the light emitting unit;
c）形成导电锚点；c) forming conductive anchor points;
d）设置侧面信号线。d) Set the side signal line.
可以理解的是，在上述a）、b）、c）、d）四个过程中，必须满足的时序关系只有：b）必须要在a）之后执行，d）必须要在c）之前执行，因为发光单元的芯片电极需要与承载面信号线组中的承载面信号线电连接，所以设置发光单元之前应当保证承载面信号线设置完成。而侧面信号线需要与导电锚点的导电侧面连接，因此其需要在导电锚点形成之后才可以设置。但其余各过程两两之间的时序并没有严格的时序限制，例如，在先制备驱动背板，在基于驱动背板制备显示面板的方案中，可以依次按照a）、c）、d）、b）的顺序执行上述四个过程，但也可以按照c）、d）、a）、b）的顺序依次执行。在直接基于基底制备显示面板，不形成驱动背板这一中间产品的方案中，可以按照a）、b）、c）、d）的顺序执行，也可以按照c）、a）、b）、d）的顺序进行，或者也可以按照c）、d）、a）、b）的顺序执行。当然，本领域技术人员可以理解的是，实际上还可以按照其他未列出的顺序执行，但这里不再枚举。下面逐一对上述四个设置过程的细节进行阐述：It is understandable that in the above four processes of a), b), c), and d), the only timing relationships that must be satisfied are: b) must be executed after a), d) must be executed before c), Because the chip electrodes of the light emitting unit need to be electrically connected to the signal lines on the carrying surface in the signal line group on the carrying surface, it should be ensured that the signal lines on the carrying surface are set before setting the light emitting unit. The side signal line needs to be connected to the conductive side of the conductive anchor point, so it can be arranged after the conductive anchor point is formed. However, there are no strict timing restrictions on the timing between each pair of other processes. For example, if the driving backplane is prepared first, in the scheme of preparing the display panel based on the driving backplane, a), c), d), and The above four processes are executed in the order of b), but they can also be executed in the order of c), d), a), and b). In the scheme of preparing the display panel directly based on the substrate without forming the intermediate product of the driving backplane, it can be performed in the order of a), b), c), and d), or in the order of c), a), b), and d) or in the order of c), d), a) and b). Of course, those skilled in the art can understand that, in fact, other unlisted sequences can also be executed, but they will not be enumerated here. The following describes the details of the above four setting processes one by one:
a）设置承载面信号线组：a) Set the bearing surface signal line group:
设置承载面信号线组，实际上就是分别在两个承载表面设置相对的承载面信号线。在本实施例的一些示例中选择以黄光工艺在基底的两个承载表面810a分别设置芯片线路与驱动电路，例如先通过蒸镀、溅射、PVD（Physical Vapor Deposition，物理气相沉积）、CVD（Chemical Vapor Deposition，化学气相沉积）等工艺在承载表面上设置金属层，然后通过曝光显影设置光刻胶掩膜版，然后透过光刻胶掩膜版对金属层进行刻蚀，进而形成承载面信号线。还有一些示例中，可以先在承载表面上设置掩膜版，然后透过掩膜版沉积金属形成承载面信号线。Setting the signal line group on the bearing surface is actually setting the signal lines on the bearing surface opposite to each other on the two bearing surfaces. In some examples of this embodiment, the chip circuit and the driving circuit are respectively arranged on the two carrying surfaces 810a of the substrate by the yellow light process, for example, firstly through evaporation, sputtering, PVD (Physical Vapor Deposition, physical vapor deposition), CVD (Chemical Vapor Deposition, chemical vapor deposition) and other processes set a metal layer on the carrier surface, and then set a photoresist mask through exposure and development, and then pass through the photoresist mask. The metal layer is etched to form signal lines on the bearing surface. In some other examples, a mask plate may be firstly provided on the carrying surface, and then metal is deposited through the mask plate to form signal lines on the carrying surface.
在一些示例中，设置承载面信号线的时候，导电锚点已经形成，在这种情况下，承载面信号线会覆盖导电锚点的外露表面的至少部分区域，例如如果导电锚点外露的表面包括导电正面与导电侧面，则承载面信号线需要对导电锚点导电正面的至少一部分区域进行覆盖，甚至是进行完全覆盖；还有一些示例中，设置承载面信号线的过程先于导电锚点的形成过程，因此在这些示例中，承载面信号线需要覆盖在导电块外露的表面上，不过因为导电锚点是由导电块形成的，所以无论如何，在设置承载面信号线时，需要保证承载面信号线覆盖在导电块的至少部分区域上。在本实施例的一些示例中，承载面信号线的线宽与导电块或导电锚点导电正面在同方向上的尺寸相等，还有一些示例中，承载面信号线的线宽大于导电块或导电锚点在同方向上的尺寸。当然，在其他一些示例中，承载面信号线的线宽也可以略小于导电块或导电锚点在同方向上的尺寸。另外，在本实施例中并不对承载面信号线的形态进行具体限定，其可以由设计人员根据发光单元在驱动背板上的排布等进行设置。In some examples, when the signal lines on the bearing surface are arranged, the conductive anchor points have already been formed. In this case, the signal lines on the bearing surface will cover at least part of the exposed surface of the conductive anchor points. For example, if the exposed surface of the conductive anchor points Including the conductive front and the conductive side, the signal line on the carrying surface needs to cover at least a part of the conductive front of the conductive anchor point, or even completely cover it; in some examples, the process of setting the signal line on the carrying surface is prior to the conductive anchor point Therefore, in these examples, the bearing surface signal line needs to cover the exposed surface of the conductive block, but because the conductive anchor point is formed by the conductive block, so in any case, when setting the bearing surface signal line, it is necessary to ensure The signal line on the bearing surface covers at least part of the area of the conductive block. In some examples of this embodiment, the line width of the signal line on the carrying surface is equal to the size of the conductive block or the conductive front surface of the conductive anchor point in the same direction. The size of the anchor point in the same direction. Of course, in some other examples, the line width of the signal line on the bearing surface may also be slightly smaller than the size of the conductive block or the conductive anchor point in the same direction. In addition, in this embodiment, the shape of the signal line on the carrying surface is not specifically limited, and it can be set by the designer according to the arrangement of the light emitting units on the driving backplane and the like.
在本实施例的一些示例中，设置承载面信号线之后，还可以在承载面信号线上设置绝缘隔离层以对承载面信号线进行保护。可以理解的是，由于承载面信号线与侧面信号线的连接可以直接通过导电锚点外露的导电侧面实现，因此，无论形成绝缘隔离层时导电锚点是否已经形成，但绝缘隔离层都不需要在与导电块或导电锚点对应的位置处进行镂空处理。In some examples of this embodiment, after the signal lines on the bearing surface are provided, an insulating layer may also be provided on the signal lines on the bearing surface to protect the signal lines on the bearing surface. It can be understood that since the connection of the signal line on the load-bearing surface and the side signal line can be realized directly through the exposed conductive side of the conductive anchor point, no matter whether the conductive anchor point has been formed when the insulating isolation layer is formed, the insulating isolation layer does not need to be connected. Carry out hollowing out at positions corresponding to the conductive blocks or conductive anchor points.
在本实施例的一些示例中，制备显示面板时一开始使用的面积比较大的基底，该基底可以用于制备出多块显示面板，所以在一些示例中会选择在形成承载面信号线之后再对基底进行切割，以得到尺寸略大于最终显示面板尺寸的基底。可选地，本实施例的一些示例中选择按照第三切割线对基底进行切割，应当理解的是，第三切割线必然位于导电块远离有效显示区的一侧。当然，还有一些示例中，制备显示面板之初所选用的基底的尺寸就只是略大于最终显示面板尺寸的基底，那么在这种情况下，设置承载面信号线之后就不需要对基底进行切割。In some examples of this embodiment, a substrate with a relatively large area is used at the beginning of the preparation of the display panel. The substrate is cut to have a size slightly larger than the size of the final display panel. Optionally, in some examples of this embodiment, the substrate is selected to be cut according to the third cutting line. It should be understood that the third cutting line must be located on the side of the conductive block away from the effective display area. Of course, in some examples, the size of the substrate selected at the beginning of the display panel is only slightly larger than the size of the final display panel. In this case, the substrate does not need to be cut after the signal lines on the carrying surface are set. .
b）设置发光单元：b) Set up the light unit:
设置发光单元的时候，可以通过转移头等转移设备从其他承载基板上转移发光单元并通过焊料、导电胶等键合材料将发光单元键合到有效显示区中，实现发光单元的芯片电极与有效显示区中承载面信号线的电连接。When setting up the light-emitting unit, the light-emitting unit can be transferred from other carrier substrates through the transfer head and other transfer equipment, and the light-emitting unit can be bonded to the effective display area through bonding materials such as solder and conductive glue, so as to realize the chip electrode of the light-emitting unit and the effective display. The electrical connection of the signal line of the bearing surface in the area.
对于发光单元的颜色类型、结构类型、尺寸类型等这里不再赘述。在本实施例的一些示例中，设置发光单元之后，还会在基底设有发光单元的一面设置封装胶层，在本实施例中，封装胶层可以是黑胶层与半透胶层的结合，例如先通过黑胶在基底设有发光单元的一面形成50um左右的黑胶层，通常黑胶层的厚度与发光单元的高度差不多；然后在黑胶层上利用半透胶形成半透胶层。封装胶可以是可反应型聚酰亚胺与环氧树脂的复合材料，其中聚酰亚胺作为固化剂。对于黑胶，则可以按比例添加碳添加元素以增加黑度。The color type, structure type, size type, etc. of the light emitting unit will not be repeated here. In some examples of this embodiment, after the light-emitting unit is installed, an encapsulation adhesive layer is also provided on the side of the substrate where the light-emitting unit is provided. In this embodiment, the encapsulation adhesive layer may be a combination of a black adhesive layer and a semi-permeable adhesive layer. , for example, first form a black glue layer of about 50um on the side of the base with the light-emitting unit through black glue, usually the thickness of the black glue layer is about the same as the height of the light-emitting unit; then use semi-permeable glue to form a semi-permeable glue layer on the black glue layer . The encapsulant can be a composite material of reactive polyimide and epoxy resin, wherein polyimide is used as a curing agent. For black glue, you can add carbon additive elements in proportion to increase blackness.
c）形成导电锚点：c) Form a conductive anchor point:
本实施例中形成导电锚点时，主要是通过去除基底81位于有效显示区811之外的部分区域，从而使得导电块801的一部分从基底侧面810b外露，可以理解的是，因为原本导电块801作为填充在盲孔800中的导电材料，就有一部分表面是外露于承载表面810a的，所以在去除基底81的部分区域后形成的导电锚点840中，就有一部分表面外露于承载表面810a，一部分表面外露于基底侧面810b。例如请参见图9示出的一种形成导电锚点的示意图。导电锚点840外露的表面包括与承载表面810a朝向相同的导电正面840a，以及与基底侧面810b朝向相同的导电侧面840b。并且，导电正面840a同导电侧面840b间的棱与承载表面810a同基底侧面810b间的棱重合，从而使得形成的导电锚点840位于承载表面810a同基底侧面810b间的棱上，其一部分嵌入到基底81中，同时又有两个表面外露于基底81。根据前述介绍可知，由导电块801所形成的导电锚点840的形态并不仅限于图9中的这一种，例如还可以如图2a、图2b以及图2c所示。In this embodiment, when the conductive anchor point is formed, a part of the conductive block 801 is exposed from the side surface 810b of the substrate mainly by removing a part of the substrate 81 outside the effective display area 811. It can be understood that because the conductive block 801 As the conductive material filled in the blind hole 800, a part of the surface is exposed on the carrying surface 810a, so in the conductive anchor point 840 formed after removing part of the substrate 81, a part of the surface is exposed on the carrying surface 810a, A portion of the surface is exposed on the base side 810b. For example, please refer to FIG. 9 for a schematic diagram of forming a conductive anchor point. The exposed surface of the conductive anchor point 840 includes a conductive front surface 840a facing the same direction as the carrying surface 810a, and a conductive side surface 840b facing the same direction as the base side 810b. Moreover, the edge between the conductive front surface 840a and the conductive side 840b coincides with the edge between the carrying surface 810a and the base side 810b, so that the formed conductive anchor point 840 is located on the edge between the carrying surface 810a and the base side 810b, and a part of it is embedded in In the base 81 , two surfaces are exposed to the base 81 at the same time. According to the foregoing description, the shape of the conductive anchor point 840 formed by the conductive block 801 is not limited to the one shown in FIG. 9 , for example, it can also be shown in FIG. 2a , FIG. 2b and FIG. 2c .
去除基底81位于有效显示区811之外的部分区域可以通过切割、掩膜或者刻蚀中的至少一种手段实现。在本实施例的一些示例中，请参见图10a所示，按照第一切割线1001对基底81进行切割，第一切割线1001穿过导电块801，且其与有效显示区811的最小距离大于导电块与有效显示区811的最小距离，这样可以保证切割之后仍有导电块801的剩余区域留在基底81上，同时又可以保证导电块801经切割之后有导电材料从基底侧面810b裸露出来。Removing the partial area of the substrate 81 outside the effective display area 811 can be achieved by at least one means of cutting, masking or etching. In some examples of this embodiment, as shown in FIG. 10a, the substrate 81 is cut according to the first cutting line 1001, the first cutting line 1001 passes through the conductive block 801, and the minimum distance between the first cutting line 1001 and the effective display area 811 is greater than The minimum distance between the conductive block and the effective display area 811 can ensure that the remaining area of the conductive block 801 remains on the substrate 81 after cutting, and at the same time ensure that the conductive material of the conductive block 801 is exposed from the substrate side 810b after cutting.
可以理解的是，在上述示例中，直接通过切割基底81就让导电块801形成了导电锚点840，但在本实施例的一些示例中，需要在切割之后再对基底81进行研磨才能使得导电块801形成导电锚点840。例如，在一些示例中，请参见图10b所示，可以先按照第二切割线1002对基底81进行切割，第二切割线1002与有效显示区811的最小距离大于导电块801与有效显示区811的最小距离，即第二切割线1002至少不能将导电块801的全部区域均切割掉，导致基底81上有效显示区811与导电块801的全部区域分离。在一些示例中，可以第二切割线1002不会穿过导电块801，请继续参见图10b，因此经过基于第二切割线1002的切割不会让导电块801形成导电锚点840，故，在此之后，还需要沿着垂直于基底侧面810b的方向对经切割处理的基底81进行研磨以使导电块801形成导电锚点840，毫无疑义的是，研磨深度必须小于导电块801在研磨方向上的厚度，也即不同将导电块801的全部区域都研磨掉进而导致基底81上没有剩余的导电块区域。还有一些示例中，第二切割线1002会穿过导电块801，如图10c所示，在这种情况下，经过切割之后，导电块801实际上就已经形成了导电锚点840，不过，在本这些示例中还是会对沿着垂直于基底侧面810b的方向对经切割处理的基底81进行研磨，所以，在这些示例中，确定第二切割线1002时，应当保证切割之后的基底81具有研磨余量。可以理解的是，切割面通常会存在参差（目前的切割工艺通常是先切割一定的深度，然后进行裂片操作），会让基底侧面810b凹凸不平，因此在切割之后再搭配研磨，可以保证基底具有相对平整的基底侧面810b。同时，通过控制研磨棒目数可以控制研磨之后基底侧面810b的粗糙度，从而为形成侧面信号线的导电材料提供良好的附着条件。It can be understood that, in the above example, the conductive block 801 forms the conductive anchor point 840 by directly cutting the base 81, but in some examples of this embodiment, the base 81 needs to be ground after cutting to make the conduction Block 801 forms conductive anchor 840 . For example, in some examples, as shown in FIG. 10 b , the substrate 81 may be first cut according to the second cutting line 1002 , and the minimum distance between the second cutting line 1002 and the effective display area 811 is greater than that between the conductive block 801 and the effective display area 811 The minimum distance, that is, the second cutting line 1002 cannot at least cut off the entire area of the conductive block 801 , causing the effective display area 811 on the substrate 81 to be separated from the entire area of the conductive block 801 . In some examples, the second cutting line 1002 may not pass through the conductive block 801, please continue to refer to FIG. After that, it is also necessary to grind the diced substrate 81 along the direction perpendicular to the substrate side 810b so that the conductive block 801 forms a conductive anchor point 840. It is undoubted that the grinding depth must be smaller than that of the conductive block 801 in the grinding direction. The thickness on the substrate 81 is different, that is, the entire area of the conductive block 801 is ground away so that there is no remaining area of the conductive block on the substrate 81 . In some other examples, the second cutting line 1002 will pass through the conductive block 801, as shown in FIG. In these examples, the diced substrate 81 will still be ground along the direction perpendicular to the substrate side 810b, so, in these examples, when determining the second cutting line 1002, it should be ensured that the substrate 81 after dicing has Grinding allowance. It is understandable that the cutting surface usually has unevenness (the current cutting process usually cuts to a certain depth first, and then performs the slitting operation), which will make the side surface 810b of the base uneven. Therefore, grinding after cutting can ensure that the base has Relatively flat base side 810b. At the same time, the roughness of the substrate side 810b after grinding can be controlled by controlling the mesh of the grinding rod, so as to provide good adhesion conditions for the conductive material forming the side signal line.
在本实施例的一些示例中，无论是通过何种手段去除基底位于有效显示区之外的部分区域，都会保证最终导电锚点840导电正面840a的面积大于盲孔800开口面积的一半，这样可以减小导电锚点840因为与基底81之间结合面积过小而从基底81上脱落的情况。In some examples of this embodiment, no matter what method is used to remove the part of the substrate outside the effective display area, it will ensure that the area of the conductive front surface 840a of the final conductive anchor point 840 is greater than half of the opening area of the blind hole 800, which can Reduce the situation that the conductive anchor point 840 falls off from the base 81 due to too small bonding area with the base 81 .
d）设置侧面信号线：d) Set the side signal line:
在形成导电锚点之后，可以在基底侧面上导电锚点组中两个导电锚点之间设置侧面信号线，利用侧面信号线实现两个导电锚点间的连接。在本实施例中，侧面信号线的设置可以通过移印银浆、溅镀金属膜等方式实现。侧面信号线至少覆盖导电锚点840外露表面的至少部分区域，如果导电锚点外露的表面包括导电正面与导电侧面，则侧面信号线会对导电锚点导电侧面的至少一部分区域进行覆盖，甚至是进行完全覆盖。一些示例中，侧面信号线的线宽小于10um，例如为7um、6.5um等。一些示例中，侧面信号线的线宽大于导电锚点导电侧面在同方向上的尺寸，当然，其他示例中，侧面信号线的线宽等于或者略小于导电锚点导电侧面在同方向上的尺寸也是可行的。在一些示例中，侧面信号线可以对两端的导电锚点的导电侧面进行全覆盖，不过本领域技术人员应当理解的是，这并不是必要条件。一些示例中，侧面信号线在沿着基底厚度方向的长度小于封装胶层厚度的一半与基底的厚度之和。After the conductive anchors are formed, side signal lines can be provided between the two conductive anchors in the conductive anchor group on the side of the substrate, and the side signal lines can be used to realize the connection between the two conductive anchors. In this embodiment, the arrangement of the side signal lines can be realized by pad printing silver paste, sputtering metal film, and the like. The side signal line covers at least part of the exposed surface of the conductive anchor 840. If the exposed surface of the conductive anchor includes a conductive front and a conductive side, the side signal line will cover at least a part of the conductive side of the conductive anchor, or even For full coverage. In some examples, the line width of the side signal lines is less than 10um, such as 7um, 6.5um and so on. In some examples, the line width of the side signal lines is greater than the size of the conductive side of the conductive anchor point in the same direction. Of course, in other examples, the line width of the side signal line is equal to or slightly smaller than the size of the conductive side of the conductive anchor point in the same direction. of. In some examples, the side signal lines can fully cover the conductive sides of the conductive anchor points at both ends, but those skilled in the art should understand that this is not a necessary condition. In some examples, the length of the side signal lines along the thickness direction of the substrate is less than the sum of half the thickness of the packaging adhesive layer and the thickness of the substrate.
在本实施例的一些示例中，在设置了侧面信号线之后，还可以在侧面信号线上设置侧面保护层，以利用侧面保护层对侧面信号线进行保护，例如通过黑胶形成黑胶保护层。一些示例中，侧面保护层的厚度小于10um。在本实施例的一些示例中，侧面信号线与侧面保护层的厚度之和小于20um，这样可以提升显示面板拼接时的拼接效果。In some examples of this embodiment, after the side signal lines are provided, a side protective layer can also be provided on the side signal lines, so as to protect the side signal lines with the side protective layer, for example, black glue is used to form a black glue protective layer . In some examples, the thickness of the side protection layer is less than 10 um. In some examples of this embodiment, the sum of the thicknesses of the side signal lines and the side protection layer is less than 20um, which can improve the splicing effect of the display panels.
在设置承载面信号线组、设置发光单元、形成导电锚点并设置侧面信号线之后，显示面板就制备完成。After setting the signal line group on the carrying surface, setting the light emitting unit, forming the conductive anchor point and setting the side signal line, the display panel is prepared.
本实施例提供的显示面板制备方法，在连接驱动背板两个承载表面的线路时，不需要在基底上设置过孔，不会影响驱动背板的机械强度，有利于提升驱动背板与显示面板的可靠性。同时，承载面信号线与对应侧面信号线之间的连接是利用了导电锚点裸露的导电正面与侧面，不需要设置弯折的线路，避免了线路弯折而容易出现的断线问题，进一步提升了驱动背板的可靠性；而且，承载面信号线只需要同与其位于相同面的导电正面连接，同样的侧面信号线只需要同与其位于相同面的导电侧面连接，连接简单明了，不容易搭接错位，有利于提升显示面板的生产良率，降低生产成本。The display panel manufacturing method provided in this embodiment does not need to provide via holes on the substrate when connecting the lines on the two bearing surfaces of the driving backplane, and does not affect the mechanical strength of the driving backplane, which is beneficial to improving the connection between the driving backplane and the display panel. panel reliability. At the same time, the connection between the signal line on the load-bearing surface and the corresponding side signal line uses the exposed conductive front and side of the conductive anchor point, no need to set up bent lines, and avoids the problem of broken lines that are prone to occur due to line bending. The reliability of the drive backplane is improved; moreover, the signal lines on the load-bearing surface only need to be connected to the conductive front on the same surface, and the same side signal lines only need to be connected to the conductive side on the same surface. The connection is simple and clear, not easy The overlapping dislocation is beneficial to improve the production yield of the display panel and reduce the production cost.
有申请又一可选实施例：There is yet another optional embodiment for the application:
为了让本领域技术人员对前述示例中提供的显示面板及其制备方案的优点与细节更清楚，本实施例将结合一个示例对前述实施例的方案做进一步说明，请参见图11示出的显示面板制备流程示意图以及图12示出的显示面板的制程状态变化示意图：In order to make those skilled in the art more clear about the advantages and details of the display panel provided in the foregoing example and its preparation scheme, this embodiment will further illustrate the scheme of the foregoing embodiment in conjunction with an example, please refer to the display panel shown in FIG. 11 The schematic diagram of the panel preparation process and the schematic diagram of the process status change of the display panel shown in Figure 12:
S1102：提供一玻璃基底。S1102: Provide a glass substrate.
请参见图12中的（a），本实施例中选择玻璃基底1201来制备显示面板，不过，在本实施例的其他一些示例中，显示面板中的基底也可以有其他材质的选择，例如蓝宝石基底、树脂基底等。本实施例中一开始提供的是尺寸较大的玻璃基底1201，甚至在一些示例中足以制备两个甚至两个以上的显示面板的玻璃基底1201。另外，玻璃基底1201的原始厚度为D1。Please refer to (a) in Figure 12. In this embodiment, the glass substrate 1201 is selected to prepare the display panel. However, in some other examples of this embodiment, the substrate in the display panel may also have other materials, such as sapphire. base, resin base, etc. In this embodiment, a glass substrate 1201 with a relatively large size is initially provided, even in some examples, it is enough to prepare glass substrates 1201 for two or more than two display panels. In addition, the original thickness of the glass substrate 1201 is D1.
S1104：在玻璃基底上有效显示区边缘设置盲孔组。S1104: setting a blind hole group on the edge of the effective display area on the glass substrate.
设置的盲孔组可以为一个也可以为两个及以上。一个盲孔组中两个盲孔1202的位置相对，且开口分别位于玻璃基底1201的基底正面和基底背面上。请参见图12中的（b）以及图13示出的玻璃基底1201设置了盲孔组后的俯视示意图，在本实施例中，盲孔1202为圆柱状，但在本实施例的其他一些示例中，盲孔1202也可以为多棱柱状，甚至棱锥状、圆锥状、梯台状或圆台状。盲孔1202的孔径可以为d，深度为h，h＜D1/2。The set blind hole group can be one or two or more. The positions of the two blind holes 1202 in a blind hole group are opposite, and the openings are respectively located on the front surface and the back surface of the glass substrate 1201 . Please refer to (b) in FIG. 12 and the schematic top view of the glass substrate 1201 with the blind hole set shown in FIG. 13. In this embodiment, the blind hole 1202 is cylindrical, but in some other examples of this embodiment Among them, the blind hole 1202 may also be in the shape of a polygonal column, or even in the shape of a pyramid, a cone, a terrace or a truncated cone. The blind hole 1202 may have a diameter of d and a depth of h, where h<D1/2.
S1106：在盲孔中填充导电材料形成导电块。S1106: Fill the blind hole with conductive material to form a conductive block.
设置了盲孔组之后，可以在盲孔1202中设置金属（诸如Cu、Au、Ag、Mo以及Ti等中的一种或几种）或者其他导电材料（例如导电银浆、CNT等）形成导电块1203，如图12中的（c）所示。在本实施例中，尽量将每个盲孔1202都充满导电材料。After the blind hole group is set, metal (such as one or more of Cu, Au, Ag, Mo, and Ti, etc.) or other conductive materials (such as conductive silver paste, CNT, etc.) can be set in the blind hole 1202 to form a conductive Block 1203, as shown in (c) in Figure 12 . In this embodiment, try to fill each blind hole 1202 with conductive material.
S1108：对玻璃基底进行薄化处理。S1108: Thinning the glass substrate.
由于设置导电材料到盲孔1202时，导电材料可能会溢到玻璃基底1201的表面，导致玻璃基底1201的承载表面不平坦，所以，在本实施例的一些示例中，形成导电块以后，会对玻璃基底1201进行薄化处理，如图12中的（d）所示，薄化深度d0为35~250um，当然d0＜h/2，在本实施例中，假定薄化处理之后玻璃基底1201的厚度为D2。Since the conductive material may overflow to the surface of the glass substrate 1201 when the conductive material is placed in the blind hole 1202, causing the surface of the glass substrate 1201 to be uneven, so, in some examples of this embodiment, after the conductive block is formed, the The glass substrate 1201 is subjected to thinning treatment, as shown in (d) in Figure 12, the thinning depth d0 is 35~250um, of course d0<h/2, in this embodiment, it is assumed that the thickness of the glass substrate 1201 after the thinning treatment The thickness is D2.
S1110：在玻璃基底的两个承载表面上设置承载面信号线，并设置绝缘保护层。S1110: Arranging signal lines on the carrying surface on the two carrying surfaces of the glass substrate, and setting an insulating protective layer.
薄化完成后可以利用黄光工艺在玻璃基底1201的基底正面和基底背面分别设置正面信号线1204与背面信号线1205，如图12中的（e），正面信号线1204与背面信号线1205相对，二者均属于承载面信号线，且共同构成一个承载面信号线组。应当理解的是，正面信号线1204与背面信号线1205相对并不要求二者各处均位置相对，例如，在本实施例的一些示例中，面信号线1204与背面信号线1205仅在导电块处相对。正面信号线1204与背面信号线1205均对导电块1203外露的表面进行全覆盖，且承载面信号线w1的线宽大于盲孔1202的孔径d。After the thinning is completed, the front signal line 1204 and the back signal line 1205 can be respectively arranged on the front side and the back side of the glass substrate 1201 by using the yellow light process, as shown in (e) in Figure 12, the front signal line 1204 is opposite to the back signal line 1205 , both of which belong to the load-bearing surface signal lines, and together form a load-bearing surface signal line group. It should be understood that the front signal line 1204 is opposite to the rear signal line 1205, and it is not required that the two are opposite to each other everywhere. relatively. Both the front signal line 1204 and the back signal line 1205 fully cover the exposed surface of the conductive block 1203 , and the line width of the signal line w1 on the carrying surface is greater than the diameter d of the blind hole 1202 .
S1112：设置绝缘隔离层。S1112: Setting an insulating isolation layer.
设置了承载面信号线之后，可以设置绝缘隔离层1206对承载面信号线进行覆盖保护，如图12中的（f）。After the signal lines on the carrying surface are set, an insulating isolation layer 1206 may be set to cover and protect the signal lines on the carrying surface, as shown in (f) in FIG. 12 .
S1114：按照第三切割线对玻璃基底进行切割。S1114: Cut the glass substrate according to the third cutting line.
在设置了承载面信号线以后，可以对玻璃基底1201进行切割，在本实施例中，按照第三切割线对玻璃基底1201进行切割，如图12中的（g）所示。可以理解的是，对玻璃基底1201进行切割时，可以对有效显示区之外各侧的区域均进行切割，也可以仅对其中部分侧进行切割。在图14中示出了原始的玻璃基底1201上有效显示区1400、盲孔1202与切割线的位置关系示意图，在图14中，第三切割线1403可以对有效显示区1400之外四侧的区域均进行切割，四条第三切割线1403构成了一个矩形，将有效显示区1400与盲孔1202围合在其内部。After the signal lines on the bearing surface are provided, the glass substrate 1201 can be cut. In this embodiment, the glass substrate 1201 is cut according to the third cutting line, as shown in (g) of FIG. 12 . It can be understood that, when cutting the glass substrate 1201 , all sides other than the effective display area may be cut, or only part of the sides may be cut. 14 shows a schematic diagram of the positional relationship between the original glass substrate 1201 effective display area 1400, blind hole 1202 and cutting line, in FIG. All areas are cut, and the four third cutting lines 1403 form a rectangle, enclosing the effective display area 1400 and the blind hole 1202 inside.
S1116：键合发光单元。S1116: Bonding the light-emitting unit.
对玻璃基底1201进行初次切割之后，可以在有效显示区1400内设置发光单元1207，如图12中的（h），将发光单元1207的芯片电极与有效显示区1400内的正面信号线1204电连接。After the initial cutting of the glass substrate 1201, a light emitting unit 1207 can be arranged in the effective display area 1400, as shown in (h) in FIG. .
S1118：设置封装胶层。S1118: Set a packaging glue layer.
键合发光单元1207之后，可以在玻璃基底1201设置有发光单元1207的一面上设置封装胶形成封装胶层1208，如图12中的（i）。在本实施例中，封装胶层1207包括相对靠近玻璃基底1201的黑胶层，其硬度大于等于2H，厚度大约在50um左右，同时还包括相对远离玻璃基底1201的半透胶层，其硬度大于1H，厚度大约在210um左右。本实施例中将封装胶层1208的厚度记为“D3”After bonding the light-emitting unit 1207 , an encapsulant may be provided on the side of the glass substrate 1201 provided with the light-emitting unit 1207 to form an encapsulant layer 1208 , as shown in (i) of FIG. 12 . In this embodiment, the packaging adhesive layer 1207 includes a black adhesive layer relatively close to the glass substrate 1201, whose hardness is greater than or equal to 2H, and whose thickness is about 50um, and also includes a semi-permeable adhesive layer relatively far away from the glass substrate 1201, whose hardness is greater than 1H, the thickness is about 210um. In this embodiment, the thickness of the packaging adhesive layer 1208 is recorded as "D3"
S1120：按照第二切割线对玻璃基底进行切割、研磨，以使导电块形成导电锚点。S1120: Cutting and grinding the glass substrate according to the second cutting line, so that the conductive block forms a conductive anchor point.
请继续参见图14，按照第二切割线1402对玻璃基底1201进行再次切割，第二切割线1402位于导电块1203远离有效显示区1400的一侧，且其并不穿过导电块1203，因此，经过第二切割线1402的切割之后，玻璃基底1201上的导电块1203依旧是完整的，导电锚点尚未形成。在本实施例的其他一些示例中，第二切割线1402也可以穿过导电块1203。本实施例中，第二切割线1402也可以是多条，例如在图14中四条第二切割线1402围合成一个矩形。Please continue to refer to FIG. 14, the glass substrate 1201 is cut again according to the second cutting line 1402, the second cutting line 1402 is located on the side of the conductive block 1203 away from the effective display area 1400, and it does not pass through the conductive block 1203, therefore, After being cut by the second cutting line 1402 , the conductive block 1203 on the glass substrate 1201 is still intact, and the conductive anchor point has not been formed yet. In some other examples of this embodiment, the second cutting line 1402 may also pass through the conductive block 1203 . In this embodiment, there may be multiple second cutting lines 1402 , for example, four second cutting lines 1402 form a rectangle in FIG. 14 .
在沿第二切割线1402对玻璃基底1201进行切割之后，可以沿着垂直于玻璃基底1201的基底侧面的方向对玻璃基底1201进行研磨以使导电块1203形成导电锚点1209，如图12中的（j），研磨深度小于导电块1203在研磨方向上的剩余厚度。另外，经过掩膜，本实施例中得到的导电锚点1209的导电正面为优弧弓型。After cutting the glass substrate 1201 along the second cutting line 1402, the glass substrate 1201 may be ground in a direction perpendicular to the substrate side of the glass substrate 1201 so that the conductive blocks 1203 form conductive anchor points 1209, as shown in FIG. (j), the grinding depth is smaller than the remaining thickness of the conductive block 1203 in the grinding direction. In addition, through the mask, the conductive front surface of the conductive anchor point 1209 obtained in this embodiment is a bow-shaped.
S1122：设置侧面信号线。S1122: Set the side signal line.
在导电锚点1209设置完成以后，可以形成侧面信号线1210，请参见图12中的（k）所示，侧面信号线1210两端分别覆盖在两个导电锚点1209的导电侧面上，同时，侧面信号线1210的线宽w2大于盲孔的孔径d，厚度小于10um，线长小于D2+D3/2。After the conductive anchor point 1209 is set, the side signal line 1210 can be formed. Please refer to (k) in FIG. The line width w2 of the side signal line 1210 is larger than the diameter d of the blind hole, the thickness is less than 10um, and the line length is less than D2+D3/2.
S1124：设置侧面保护层。S1124: Setting a side protection layer.
设置了侧面信号线1210之后，可以继续在基底侧面设置侧面保护层1211，利用侧面保护层1211对侧面信号线1210进行电气隔离，如图12中的（l）所示。在本实施例中，侧面保护层1211厚度小于10um，且侧面保护层1211与侧面信号线1210共同厚度小于20um。After the side signal lines 1210 are provided, the side protection layer 1211 can be further provided on the side of the substrate, and the side protection layer 1211 is used to electrically isolate the side signal lines 1210 , as shown in (l) in FIG. 12 . In this embodiment, the thickness of the side protection layer 1211 is less than 10 um, and the thickness of the side protection layer 1211 and the side signal line 1210 is less than 20 um.
至此，显示面板1200制备完成，虽然在上述示例中并没有将驱动背板以中间产品的形式制备出来，但本领域技术人员可以理解的是，因为本实施例中设置承载面信号线、设置发光单元1207、形成导电锚点1209以及设置侧面信号线1210的时序可以调整，因此通过调整这四个过程的相对顺序，可以先制备出驱动背板，然后再在驱动背板上设置发光单元1207，形成显示面板。So far, the preparation of the display panel 1200 is completed. Although the driving backplane is not prepared as an intermediate product in the above example, those skilled in the art can understand that because the signal lines on the bearing surface and the light emitting The timing of the unit 1207, the formation of the conductive anchor point 1209, and the setting of the side signal line 1210 can be adjusted. Therefore, by adjusting the relative sequence of these four processes, the driving backplane can be prepared first, and then the light emitting unit 1207 can be set on the driving backplane. A display panel is formed.
本实施例还提供一种显示屏，该显示屏中包括至少两个前述任意示例中提供的显示面板，各显示面板拼接在一起。另外本实施例还提供一种具有该显示屏的电子设备，例如手机、电视、电脑等。This embodiment also provides a display screen, which includes at least two display panels provided in any of the foregoing examples, and each display panel is spliced together. In addition, this embodiment also provides an electronic device with the display screen, such as a mobile phone, a television, a computer, and the like.
本实施例提供的显示面板制备方案中，连接正面信号线与背面信号线的线路置于玻璃基底侧边，不占据显示面板的正面空间，不仅不会影响玻璃基底的机械强度，而且可有效缩减显示面板的边框。另外，因为玻璃基底的基底侧面经过研磨粗糙化处理，可有效增加导电材料附着效果，提升侧面信号线的可靠性。同时，正面信号线、侧面信号线与背面信号线三者的连接不需要设置弯折导线，避免了断线、搭接错位等问题。In the display panel preparation scheme provided in this example, the lines connecting the front signal line and the back signal line are placed on the side of the glass substrate, which does not occupy the front space of the display panel, not only does not affect the mechanical strength of the glass substrate, but also can effectively reduce the Displays the border of the panel. In addition, because the side surface of the glass substrate is ground and roughened, it can effectively increase the adhesion effect of conductive materials and improve the reliability of the side signal lines. At the same time, the connection of the front signal line, the side signal line and the rear signal line does not require bending wires, which avoids problems such as broken wires and overlapping joints.
应当理解的是，本申请的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本申请所附权利要求的保护范围。It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art can make improvements or changes based on the above descriptions, and all these improvements and changes should belong to the protection scope of the appended claims of the present application.

Claims (25)

  1. 一种驱动背板，其特征在于，包括：A drive backplane, characterized in that it comprises:
    基底，所述基底包括两个相对的承载表面及介于两个所述承载表面间的基底侧面，且两个所述承载表面中的一个包括被配置为承载发光单元的有效显示区；a base, the base includes two opposite bearing surfaces and a side surface of the base between the two bearing surfaces, and one of the two bearing surfaces includes an effective display area configured to bear a light-emitting unit;
    设置于所述承载表面的承载面信号线组，所述承载面信号线组由位于不同承载表面且相对的两个承载面信号线构成；A load-bearing surface signal line group disposed on the load-bearing surface, the load-bearing surface signal line group is composed of two load-bearing surface signal lines that are located on different load-bearing surfaces and face each other;
    设置于所述基底侧面且位置与所述承载面信号线组对应的侧面信号线；以及a side signal line disposed on the side of the base and corresponding to the group of signal lines on the carrying surface; and
    导电锚点组，其由两个嵌于所述基底且分设于所述侧面信号线两端的导电锚点构成；所述导电锚点的部分表面外露于所述承载表面，部分表面外露于所述基底侧面；且所述导电锚点外露的表面中并至少部分与所述承载面信号线重合，至少部分与所述侧面信号线重合。The conductive anchor point group is composed of two conductive anchor points embedded in the base and separately arranged at both ends of the side signal line; part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the The side of the substrate; and the exposed surface of the conductive anchor point is at least partially coincident with the signal line of the carrying surface, and at least partially coincident with the signal line of the side.
  2. 如权利要求1所述的驱动背板，其特征在于，所述驱动背板还包括覆盖在所述侧面信号线上的侧面保护层。The driving backplane according to claim 1, further comprising a side protection layer covering the side signal lines.
  3. 如权利要求2所述的驱动背板，其特征在于，所述侧面保护层与所述侧面信号线的厚度之和小于20um。The drive backplane according to claim 2, wherein the sum of the thicknesses of the side protection layer and the side signal lines is less than 20um.
  4. 如权利要求1所述的驱动背板，其特征在于，所述驱动背板还包括覆盖在所述承载面信号线上的绝缘隔离层。The driving backplane according to claim 1, further comprising an insulating isolation layer covering the signal lines on the bearing surface.
  5. 如权利要求1所述的驱动背板，其特征在于，所述导电锚点外露于所述基底的表面包括与所述承载表面朝向相同的导电正面，以及与所述基底侧面朝向相同的导电侧面；所述导电正面至少部分与所述承载面信号线重合，所述导电侧面至少部分与所述侧面信号线重合。The drive backplane according to claim 1, wherein the surface of the conductive anchor point exposed on the substrate includes a conductive front face facing the same direction as the bearing surface, and a conductive side face facing the same direction as the side surface of the substrate ; The conductive front surface at least partially coincides with the signal line of the bearing surface, and the conductive side surface at least partially coincides with the side signal line.
  6. 如权利要求5所述的驱动背板，其特征在于，所述导电正面同所述导电侧面间的棱与所述承载表面同所述基底侧面间的棱重合。The driving backplane according to claim 5, wherein the edge between the conductive front surface and the conductive side coincides with the edge between the bearing surface and the side of the base.
  7. 如权利要求5所述的驱动背板，其特征在于，所述承载面信号线的线宽大于所述导电正面在同方向上的尺寸。The driving backplane according to claim 5, characterized in that, the line width of the signal lines on the bearing surface is larger than the size of the conductive front surface in the same direction.
  8. 如权利要求5所述的驱动背板，其特征在于，所述侧面信号线的线宽大于所述导电侧面在同方向上的尺寸。The drive backplane according to claim 5, wherein the width of the side signal lines is larger than the size of the conductive side in the same direction.
  9. 如权利要求5所述的驱动背板，其特征在于，所述导电侧面为矩形。The drive backplane according to claim 5, wherein the conductive side is rectangular.
  10. 如权利要求5所述的驱动背板，其特征在于，所述导电正面为矩形或弓形。The drive backplane according to claim 5, wherein the conductive front surface is rectangular or arcuate.
  11. 如权利要求10所述的驱动背板，其特征在于，所述弓形为优弧弓形。The drive backplane according to claim 10, wherein the bow is a superior arc bow.
  12. 一种显示面板，其特征在于，包括：A display panel, characterized in that it comprises:
    多颗发光单元；以及multiple light emitting units; and
    如权利要求1所述的驱动背板；The drive backplane according to claim 1;
    其中，多颗所述发光单元设置在所述有效显示区中，且芯片电极与所述有效显示区中的所述承载面信号线电连接。Wherein, a plurality of the light emitting units are arranged in the effective display area, and the chip electrodes are electrically connected to the signal lines of the carrying surface in the effective display area.
  13. 如权利要求12所述的显示面板，其特征在于，还包括包覆所述多颗发光单元的封装胶层，所述发光单元没于所述封装胶层中。The display panel according to claim 12, further comprising an encapsulant layer covering the plurality of light-emitting units, the light-emitting units being submerged in the encapsulant layer.
  14. 如权利要求13所述的显示面板，其特征在于，所述侧面信号线的长度小于所述封装胶层的厚度的一半与所述基底的厚度之和。The display panel according to claim 13, wherein the length of the side signal line is less than the sum of half the thickness of the packaging adhesive layer and the thickness of the substrate.
  15. 一种显示面板制备方法，其特征在于，应用于如权利要求12所述的显示面板的制备，所述显示面板制备方法包括：A display panel preparation method, characterized in that it is applied to the preparation of the display panel according to claim 12, the display panel preparation method comprising:
    提供一基底，所述基底包括两个相对的承载表面及介于两个所述承载表面之间的基底侧面，且两个所述承载表面中的一个包括被配置为承载发光单元的有效显示区；A substrate is provided, the substrate includes two opposite bearing surfaces and a side surface of the substrate between the two bearing surfaces, and one of the two bearing surfaces includes an effective display area configured to bear a light-emitting unit ;
    在所述有效显示区边缘设置由两个位置相对且开口于不同所述承载表面的盲孔所构成的盲孔组，并在所述盲孔中填充导电材料形成导电块；A blind hole group consisting of two blind holes opposite to each other and opening on different bearing surfaces is arranged on the edge of the effective display area, and a conductive material is filled in the blind holes to form a conductive block;
    设置承载面信号线组、设置发光单元、形成导电锚点并设置侧面信号线；Set the signal line group on the bearing surface, set the light-emitting unit, form a conductive anchor point and set the side signal line;
    其中，所述设置承载面信号线组包括：分别在两个所述承载表面设置相对的承载面信号线构成所述承载面信号线组，所述承载面信号线覆盖在所述导电块外露的至少部分区域上；所述设置发光单元包括：在所述有效显示区中设置多颗发光单元，所述发光单元的芯片电极与所述有效显示区中的所述承载面信号线电连接；所述形成导电锚点包括：去除所述基底位于所述有效显示区之外的部分区域以使所述导电块形成导电锚点，所述导电锚点的部分表面外露于所述承载表面，部分表面外露于所述基底侧面；且所述导电锚点外露的表面中并至少部分与所述承载面信号线重合，至少部分与所述侧面信号线重合；所述设置侧面信号线包括：在对应于同一所述盲孔组的两个所述导电锚点之间设置侧面信号线，所述侧面信号线覆盖在所述导电锚点外露的至少部分区域上。Wherein, the setting of the bearing surface signal line group includes: respectively setting opposite bearing surface signal lines on the two bearing surfaces to form the bearing surface signal line group, and the bearing surface signal line covers the exposed part of the conductive block. At least part of the area; the setting of the light-emitting unit includes: setting a plurality of light-emitting units in the effective display area, and the chip electrodes of the light-emitting units are electrically connected to the signal lines of the bearing surface in the effective display area; The formation of the conductive anchor point includes: removing a part of the substrate located outside the effective display area so that the conductive block forms a conductive anchor point, part of the surface of the conductive anchor point is exposed on the bearing surface, and part of the surface is exposed on the side of the base; and the exposed surface of the conductive anchor point is at least partially coincident with the signal line on the carrying surface, at least partially coincident with the side signal line; the setting of the side signal line includes: corresponding to A side signal line is arranged between two conductive anchor points of the same blind hole group, and the side signal line covers at least part of the exposed area of the conductive anchor point.
  16. 如权利要求15所述的显示面板制备方法，其特征在于，所述去除所述基底位于所述有效显示区之外的部分区域以使所述导电块形成导电锚点包括：The method for manufacturing a display panel according to claim 15, wherein the removing a part of the substrate outside the effective display area so that the conductive block forms a conductive anchor point comprises:
    按照第一切割线对所述基底进行切割，所述第一切割线穿过所述导电块，且其与所述有效显示区的最小距离大于所述导电块与所述有效显示区的最小距离。The substrate is cut according to a first cutting line, the first cutting line passes through the conductive block, and the minimum distance between the first cutting line and the effective display area is greater than the minimum distance between the conductive block and the effective display area .
  17. 如权利要求15所述的显示面板制备方法，其特征在于，所述去除所述基底位于所述有效显示区之外的部分区域以使所述导电块形成导电锚点包括：The method for manufacturing a display panel according to claim 15, wherein the removing a part of the substrate outside the effective display area so that the conductive block forms a conductive anchor point comprises:
    按照第二切割线对所述基底进行切割，所述第二切割线与所述有效显示区的最小距离大于所述导电块与所述有效显示区的最小距离；cutting the substrate according to a second cutting line, the minimum distance between the second cutting line and the effective display area is greater than the minimum distance between the conductive block and the effective display area;
    沿着垂直于所述基底侧面的方向对经切割处理的所述基底进行研磨以使所述导电块形成所述导电锚点，研磨深度小于所述导电块在研磨方向上的剩余厚度。Grinding the diced substrate along a direction perpendicular to the side surface of the substrate so that the conductive block forms the conductive anchor point, the grinding depth is less than the remaining thickness of the conductive block in the grinding direction.
  18. 如权利要求15所述的显示面板制备方法，其特征在于，所述在所述盲孔中填充导电材料形成导电块之后，还包括：The method for manufacturing a display panel according to claim 15, further comprising: after filling the blind hole with a conductive material to form a conductive block:
    沿着垂直于所述承载表面的方向对所述基底进行研磨打薄，研磨深度小于所述盲孔的深度。The base is ground and thinned along a direction perpendicular to the bearing surface, and the grinding depth is smaller than the depth of the blind hole.
  19. 如权利要求15所述的显示面板制备方法，其特征在于，所述设置承载面信号线组、设置发光单元、形成导电锚点并设置侧面信号线的顺序依次为：The method for manufacturing a display panel according to claim 15, wherein the order of setting the signal line group on the carrying surface, setting the light-emitting unit, forming the conductive anchor point and setting the side signal line is as follows:
    设置所述承载面信号线组；setting the bearing surface signal line group;
    设置所述发光单元；setting the light emitting unit;
    形成所述导电锚点；forming said conductive anchor point;
    设置所述侧面信号线。Set the side signal line.
  20. 如权利要求19所述的显示面板制备方法，其特征在于，所述设置所述承载面信号线组之后，还包括：The method for manufacturing a display panel according to claim 19, further comprising:
    按照第三切割线对所述基底进行切割，所述第三切割线位于所述导电块远离所述有效显示区的一侧。The substrate is cut according to a third cutting line, and the third cutting line is located on a side of the conductive block away from the effective display area.
  21. 如权利要求15所述的显示面板制备方法，其特征在于，所述设置所述发光单元之后，还包括：The method for manufacturing a display panel according to claim 15, further comprising:
    在所述基底设置有所述发光单元的一面设置封装胶形成封装胶层，所述发光单元没于所述封装胶层中。An encapsulation glue is provided on the side of the substrate on which the light-emitting unit is disposed to form an encapsulation glue layer, and the light-emitting unit is submerged in the encapsulation glue layer.
  22. 如权利要求21所述的显示面板制备方法，其特征在于，所述侧面信号线在沿着所述基底厚度方向的长度小于所述封装胶层厚度的一半与所述基底的厚度之和。The method for manufacturing a display panel according to claim 21, wherein the length of the side signal line along the thickness direction of the substrate is less than the sum of half the thickness of the packaging adhesive layer and the thickness of the substrate.
  23. 如权利要求15所述的显示面板制备方法，其特征在于，所述设置侧面信号线之后，还包括：The method for manufacturing a display panel according to claim 15, further comprising: after setting the side signal lines,
    在所述侧面信号线上设置侧面保护层，所述侧面保护层与所述侧面信号线的厚度之和小于20um。A side protection layer is provided on the side signal lines, and the sum of the thicknesses of the side protection layer and the side signal lines is less than 20um.
  24. 如权利要求15所述的显示面板制备方法，其特征在于，所述导电锚点外露于所述基底的表面包括与所述承载表面朝向相同的导电正面，以及与所述基底侧面朝向相同的导电侧面；所述导电正面至少部分与所述承载面信号线重合，所述导电侧面至少部分与所述侧面信号线重合。The method for manufacturing a display panel according to claim 15, wherein the surface of the conductive anchor point exposed on the substrate includes a conductive front facing the same direction as the carrying surface, and a conductive front facing the same direction as the side surface of the substrate. Side: the conductive front is at least partially coincident with the signal line on the carrying surface, and the conductive side is at least partially coincident with the side signal line.
  25. 如权利要求24所述的显示面板制备方法，其特征在于，且所述导电正面同所述导电侧面间的棱与所述承载表面同所述基底侧面间的棱重合。The method for manufacturing a display panel according to claim 24, wherein the edge between the conductive front surface and the conductive side surface coincides with the edge between the carrying surface and the side surface of the base.
PCT/CN2021/126323 2021-10-26 2021-10-26 Driving backplane, display panel, and display panel preparation method WO2023070302A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/126323 WO2023070302A1 (en) 2021-10-26 2021-10-26 Driving backplane, display panel, and display panel preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/126323 WO2023070302A1 (en) 2021-10-26 2021-10-26 Driving backplane, display panel, and display panel preparation method

Publications (1)

Publication Number Publication Date
WO2023070302A1 true WO2023070302A1 (en) 2023-05-04

Family

ID=86158981

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/126323 WO2023070302A1 (en) 2021-10-26 2021-10-26 Driving backplane, display panel, and display panel preparation method

Country Status (1)

Country Link
WO (1) WO2023070302A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018141944A (en) * 2017-02-28 2018-09-13 京セラディスプレイ株式会社 Display
CN109950226A (en) * 2019-03-26 2019-06-28 京东方科技集团股份有限公司 A kind of circuit substrate and preparation method thereof, display base plate, splicing display device
CN110808268A (en) * 2019-11-07 2020-02-18 京东方科技集团股份有限公司 Substrate, preparation method thereof, display panel and display
CN110911392A (en) * 2019-11-29 2020-03-24 京东方科技集团股份有限公司 Micro light-emitting diode display panel and manufacturing method thereof
CN111223411A (en) * 2019-12-11 2020-06-02 京东方科技集团股份有限公司 Substrate for micro LED display panel and manufacturing method thereof
CN113299604A (en) * 2021-04-21 2021-08-24 上海步哒科技合伙企业(有限合伙) Manufacturing method of backboard, display panel and display device
CN113437025A (en) * 2021-06-10 2021-09-24 深圳市华星光电半导体显示技术有限公司 Manufacturing method for array substrate side routing and spliced display panel

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018141944A (en) * 2017-02-28 2018-09-13 京セラディスプレイ株式会社 Display
CN109950226A (en) * 2019-03-26 2019-06-28 京东方科技集团股份有限公司 A kind of circuit substrate and preparation method thereof, display base plate, splicing display device
CN110808268A (en) * 2019-11-07 2020-02-18 京东方科技集团股份有限公司 Substrate, preparation method thereof, display panel and display
CN110911392A (en) * 2019-11-29 2020-03-24 京东方科技集团股份有限公司 Micro light-emitting diode display panel and manufacturing method thereof
CN111223411A (en) * 2019-12-11 2020-06-02 京东方科技集团股份有限公司 Substrate for micro LED display panel and manufacturing method thereof
CN113299604A (en) * 2021-04-21 2021-08-24 上海步哒科技合伙企业(有限合伙) Manufacturing method of backboard, display panel and display device
CN113437025A (en) * 2021-06-10 2021-09-24 深圳市华星光电半导体显示技术有限公司 Manufacturing method for array substrate side routing and spliced display panel

Similar Documents

Publication Publication Date Title
JP5652252B2 (en) LIGHT EMITTING DEVICE, LIGHTING DEVICE, AND DISPLAY DEVICE
US7883910B2 (en) Light emitting diode structure, LED packaging structure using the same and method of forming the same
TWI437668B (en) Wiring board, semiconductor device, method of fabricating wiring board and method of fabricating semiconductor device
WO2021218418A1 (en) Driving substrate and manufacturing method therefor, and display device
TWI666737B (en) Wiring substrate, method of manufacturing the same and electronic component device
WO2021238570A1 (en) Connecting substrate and preparation method, tiled screen, and display device
US11764138B2 (en) Glass core device and method of producing the same
WO2021203415A1 (en) Driving substrate and manufacturing method therefor, and display apparatus
JP2009302453A (en) Semiconductor device and method of manufacturing semiconductor device
CN109860143B (en) Array substrate, display device, preparation method and splicing display device
TWI657660B (en) The substrate structure and processing methods for a type of array surface-mounted crystal unit
WO2023070302A1 (en) Driving backplane, display panel, and display panel preparation method
JP5130803B2 (en) Wiring board composite
CN114038869B (en) Display panel, display back panel and manufacturing method thereof
US20220367776A1 (en) Display Panel, Display Backplane and Manufacturing Method of Display Backplane
WO2021098094A1 (en) Manufacturing method for micro-led display device
WO2020232835A1 (en) Display panel and manufacturing method therefor
CN114122049A (en) Driving back plate, display panel and display panel preparation method
WO2021157496A1 (en) Display device
CN112363350B (en) Back plate, backlight module and preparation method of back plate
CN103280438B (en) There is the high-power dielectric carrier of accurate die attach layer
CN112993139A (en) Display panel, manufacturing method thereof and display device
JP2021093431A (en) Printed wiring board and manufacturing method of printed wiring board
KR20090070649A (en) Method of fabricating a solder on pad for coreless package substrate technology
JP2007123941A (en) Method of manufacturing semiconductor device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21961684

Country of ref document: EP

Kind code of ref document: A1