WO2023067901A1 - Elastic mounted substrate - Google Patents

Elastic mounted substrate Download PDF

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Publication number
WO2023067901A1
WO2023067901A1 PCT/JP2022/032624 JP2022032624W WO2023067901A1 WO 2023067901 A1 WO2023067901 A1 WO 2023067901A1 JP 2022032624 W JP2022032624 W JP 2022032624W WO 2023067901 A1 WO2023067901 A1 WO 2023067901A1
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WO
WIPO (PCT)
Prior art keywords
elastic
stretchable
wiring
electronic component
base material
Prior art date
Application number
PCT/JP2022/032624
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French (fr)
Japanese (ja)
Inventor
圭佑 西田
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2023554972A priority Critical patent/JPWO2023067901A1/ja
Publication of WO2023067901A1 publication Critical patent/WO2023067901A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to elastic mounting substrates.
  • stretchable mounting boards are widely known, in which electronic components connected to stretchable wiring are mounted on a stretchable base material.
  • the substrate described in Patent Literature 1 includes stretchable wiring formed on a stretchable base material and electronic components mounted on the stretchable base material.
  • the present invention provides a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring, a stretchable heat dissipation member provided on the stretchable base material, wherein the first stretchable wiring has a component connection portion connected to the first electronic component, and the stretchable heat dissipation member is provided on the stretchable base material.
  • the present invention also provides a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, and a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring. and a stretchable heat dissipation member provided on the stretchable base material, and a sealing layer for sealing the first electronic component, wherein the first stretchable wiring is a component connection portion connected to the first electronic component and at least a part of the elastic heat-dissipating member overlaps the sealing layer when viewed from the thickness direction of the elastic base material.
  • a stretchable mounting board according to one aspect of the present invention can obtain a sufficient heat dissipation effect for electronic components. Therefore, it is possible to provide a stretchable mounting substrate with high thermal reliability.
  • FIG. 1 is a top view of a stretchable mounting board according to the first embodiment.
  • FIG. 2A is a partial top view of the stretchable mounting substrate according to the first embodiment.
  • FIG. 2B is a partial cross-sectional view (cross-sectional view taken along the line AA in the top view) of the elastic mounting board according to the first embodiment.
  • FIG. 3A is a partial top view of an elastic mounting substrate according to a first modification of the first embodiment;
  • FIG. 3B is a partial cross-sectional view (cross-sectional view taken along the line BB in the top view) of the elastic mounting board according to the first modification of the first embodiment.
  • FIG. 4A is a partial top view of a stretchable mounting board according to a second modification of the first embodiment;
  • FIG. 4B is a partial cross-sectional view (cross-sectional view taken along the line CC in the top view) of the elastic mounting board according to the second modification of the first embodiment.
  • FIG. 5A is a partial top view of an elastic mounting substrate according to a third modification of the first embodiment
  • FIG. 5B is a partial cross-sectional view (cross-sectional view taken along the line DD in the top view) of the stretchable mounting board according to the third modification of the first embodiment.
  • FIG. 6A is a partial top view of an elastic mounting substrate according to a fourth modification of the first embodiment
  • FIG. 6B is a partial cross-sectional view (cross-sectional view taken along the line EE in the top view) of the stretchable mounting board according to the fourth modification of the first embodiment.
  • FIG. 7 is a partial top view of an elastic mounting board according to a fifth modification of the first embodiment.
  • FIG. 8 is a partial top view of an elastic mounting board according to a sixth modification of the first embodiment.
  • FIG. 9 is a partial cross-sectional view of an elastic mounting board according to the second embodiment.
  • FIG. 10A is a partial top view of an elastic mounting board according to the third embodiment.
  • FIG. 10B is a partial cross-sectional view (cross-sectional view taken along the line FF in the top view) of the elastic mounting board according to the third embodiment.
  • FIG. 11 is a partial top view of an elastic mounting substrate according to a first modified example of the third embodiment.
  • FIG. 12A is a partial top view of an elastic mounting board according to the fourth embodiment.
  • FIG. 12B is a partial cross-sectional view (cross-sectional view taken along the line GG in the top view) of the elastic mounting board according to the fourth embodiment.
  • the stretchable mounting substrate 100 has a shape in plan view with a rectangular main portion on the left side and a convex secondary portion on the right side.
  • the elastic mounting substrate 100 is not limited to the shape shown in FIG. 1, and may be, for example, circular or rectangular. Further, in FIG. 1 , a double-headed arrow X indicates an expected direction of expansion and contraction when the elastic mounting substrate 100 is used.
  • the expansion/contraction direction arrow does not mean that the elastic mounting board 100 expands/contracts only in this direction, and the elastic mounting board 100 may expand/contract in other directions.
  • the area where the first electronic component 3 or the component connection portion 5 is arranged is indicated by a mounting area Z indicated by a double arrow.
  • the mounting area Z indicated by a double arrow is merely an example, and may be of any size.
  • the stretchable mounting substrate 100 is used as a thin and stretchable wearable device, for example, attached to a curved surface of a living body such as a human body using its upper or lower main surface as an attachment surface.
  • the stretchable mounting substrate 100 shown in FIGS. 1, 2A and 2B includes a stretchable substrate 1, first stretchable wiring 2 provided on the stretchable substrate 1, and mounted on the stretchable substrate 1. , a first electronic component 3 connected to the first elastic wiring 2, a second elastic wiring 4 provided on the elastic substrate 1, and a first insulating layer provided on the elastic substrate 1 6 and .
  • the first stretchable wiring 2 has a component connection portion 5 connected to the first electronic component 3, and the second stretchable wiring 4 is viewed from above, that is, viewed from the thickness direction of the stretchable base material 1, A part thereof overlaps with the first electronic component 3 or the component connection portion 5 .
  • the first elastic wiring 2, the second elastic wiring 4, the first insulating layer 6, and the joint 10 are hatched for convenience. The same applies to the following top views.
  • the second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.
  • the portion of the second elastic wiring 4 that overlaps the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the elastic base material 1 functions as a heat absorbing portion. .
  • the heat absorbed by the heat absorbing portion spreads over the entire second stretchable wiring 4 . That is, the heat generated from the first electronic component 3 can be absorbed by the heat absorbing portion and released through the second stretchable wiring 4 extending away from the first electronic component 3 . Therefore, with the configuration as described above, it is possible to provide an elastic mounting substrate with high thermal reliability.
  • Thermal reliability in this specification refers to the rate of occurrence of malfunctions and defects due to heat generation of electronic components during use. That is, the higher the thermal reliability, the lower the possibility of malfunctions and defects occurring in the elastic mounting board including the electronic components, and the lower the thermal reliability, the higher the possibility of malfunctions and defects occurring.
  • the stretchable base material 1 is a sheet-like or film-like stretchable base material, and is made of, for example, a stretchable resin material.
  • the resin material include thermoplastic polyurethane and the like.
  • the thickness of the elastic base material 1 is not particularly limited, but from the viewpoint of not inhibiting the expansion and contraction of the surface of the living body when attached to the living body, it is preferably 1 mm or less, more preferably 100 ⁇ m or less, and 1 ⁇ m. More preferably: Moreover, the thickness of the stretchable base material 1 is preferably 0.1 ⁇ m or more.
  • the first elastic wiring 2 is directly connected to the first electronic component 3 among the elastic wirings drawn in a predetermined pattern on the main surface of the elastic base material 1 and on the main surface of the first insulating layer 6. It refers to something that is physically connected.
  • the first stretchable wiring 2 contains conductive particles and resin.
  • a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used.
  • the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the shape of the conductive particles is preferably spherical.
  • the thickness of the first elastic wiring 2 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less. Moreover, it is preferable that the thickness of the first elastic wiring 2 is 0.01 ⁇ m or more.
  • the line width of the first elastic wiring 2 is not particularly limited, it is preferably 0.1 ⁇ m or more, and more preferably 10 mm or less. Also, the number of elastic wires included in the first elastic wire 2 is not particularly limited.
  • the first electronic component 3 is mounted on the elastic base material 1.
  • Examples of the first electronic component 3 include an acceleration sensor and a temperature sensor.
  • the first electronic component 3 is not particularly limited, and may be an amplifier (operational amplifier, transistor, etc.), chip capacitor, chip resistor, LED, semiconductor IC, chip inductor, or the like.
  • the first electronic component 3 has an external electrode 13 , and the external electrode 13 is electrically connected to the component connection portion 5 of the first elastic wiring 2 via the joint portion 10 .
  • the first electronic component 3 is preferably a heat-generating electronic component such as an active element from the viewpoint that the thermal reliability of the electronic component, and thus the thermal reliability of the elastic mounting substrate 100, can be greatly improved. may
  • the first electronic component 3 is connected to the first stretchable wiring 2 via the joint 10 .
  • solder and a conductive adhesive can be used as materials for forming the joint 10, the materials other than those described above may be used.
  • the joint 10 is a so-called fillet, and is not limited to the shape shown in FIG. 1, and may be semicircular, for example. Moreover, the first electronic component 3 is not limited to the arrangement shown in FIG.
  • the second stretchable wiring 4 is routed in a predetermined pattern on the main surface of the stretchable base material 1 and contains conductive particles and resin.
  • conductive particles and resin for example, a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used.
  • the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the shape of the conductive particles is preferably spherical.
  • the thickness of the second elastic wiring 4 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less. Moreover, it is preferable that the thickness of the second elastic wiring 4 is 0.01 ⁇ m or more.
  • the line width of the second elastic wiring 4 is not particularly limited, it is preferably 0.1 ⁇ m or more, and more preferably 10 mm or less. Further, the number of elastic wirings included in the second elastic wiring 4 is not particularly limited. The second stretchable wiring 4 is not electrically connected directly to the first electronic component 3 .
  • the first elastic wiring 2 and the second elastic wiring 4 may each contain conductive particles having the same average particle size, or may contain different conductive particles. Similarly, the width and thickness of the elastic wiring may be the same or different. It is preferable that the line width of the second stretchable wiring 4 is thicker than that of the first stretchable wiring 2, because the heat dissipation can be improved.
  • the elastic heat dissipation member in the present disclosure is not limited to elastic wiring, and may be, for example, a patterned elastic heat dissipation pattern. In other words, it may be a pattern that is not connected to an electronic component or wiring and whose function is specialized for heat dissipation.
  • the shape of the elastic heat dissipation member other than the elastic wiring is not particularly limited, as long as a part of the elastic heat dissipation member overlaps the first electronic component or the component connection portion when viewed from the thickness direction of the elastic base material. good.
  • first elastic wiring 2 and the second elastic wiring 4 are connected in a region that does not overlap the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the elastic base material 1.
  • the first elastic wiring 2 and the second elastic wiring 4 are extended in the same direction so as to be parallel and overlap at least in the vicinity of the first electronic component 3 , and extend from the first elastic wiring 2 to the second elastic wiring. Heat can be efficiently transferred to the wiring 4 .
  • the component connection portion 5 is a portion that functions as a land or pad for mounting electronic components, and refers to a portion of the first elastic wiring 2 that overlaps the joint portion 10 when viewed from the thickness direction of the elastic base material 1. .
  • the joint portion 10 may include a region that does not overlap the first elastic wiring 2 when viewed from the thickness direction of the elastic base material 1, or may overlap the first elastic wiring 2 as a whole. good.
  • the first insulating layer 6 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Rubber, vinyl chloride, ester-based, amide-based elastomer resins, epoxy, phenol, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins can be used.
  • a first insulating layer 6 is arranged between the first electronic component 3 and the second elastic wiring 4 in the thickness direction of the elastic base material 1 .
  • the first insulating layer 6 may be arranged only in the region where the first elastic wiring 2 and the second elastic wiring 4 overlap, or may be arranged so as to overlap the entire substrate. may be
  • the distance between the first electronic component 3 and the second elastic wiring 4 is short in the thickness direction of the elastic base material 1, the possibility of short circuit due to contact between the two increases.
  • the first insulating layer 6 between the first elastic wiring 2 and the second elastic wiring 4 as shown in FIGS. 2A and 2B, the first electronic component 3 and the first electronic component 3 can be The distance to the second stretchable wiring 4 can be made sufficiently close. Therefore, the heat generated from the first electronic component 3 can be efficiently absorbed by the second stretchable wiring 4 .
  • the elastic mounting board 100 has the second elastic wiring 4 provided on the elastic base material 1 and the first insulating layer 6 interposed therebetween.
  • a component connection portion 5 is provided above the second elastic wiring 4 .
  • the vertical direction in this specification is defined as the “lower side” for the elastic base material 1 and the “upper side” for the first electronic component 3 in FIGS. They do not have to match.
  • stretchable wiring increases in resistance and decreases in thermal conductivity when stretched. In other words, the heat dissipation performance of the first stretchable wiring 2 and the second stretchable wiring 4 is lowered when stretched. Therefore, it is preferable that the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly when the elastic mounting substrate 100 deforms such as stretching and bending. Therefore, it is preferable that the first elastic wiring 2 and the component connection portion 5 and the second elastic wiring 4 are provided in different layers in the vicinity of the electronic component.
  • the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly, even when the thermal conductivity of one elastic wiring decreases, the other elastic wiring does not expand. Since a decrease in thermal conductivity can be suppressed, a stretchable mounting substrate with higher thermal reliability can be provided.
  • the component connection portion 5 and the second stretchable wiring 4 are provided at different distances from the stretchable base material. As a result, when the elastic mounting substrate 100 is bent or bent, the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly. Therefore, even when the stretchable mounting board 100 is bent, it is possible to sufficiently dissipate heat from the vicinity of the first electronic component 3 .
  • the first stretchable wiring 2 and the second stretchable wiring 4 are connected to the connector 12 . That is, the stretchable wiring board 11 can be connected to other devices via the connector 12 . Also, the first elastic wiring 2 is connected to an electronic component 11A different from the first electronic component 3, and the second elastic wiring 4 is connected to the electronic component 11B.
  • a stretchable heat dissipation member may be arranged for each of the plurality of electronic components, or as shown in FIG. You may arrange
  • each stretchable heat radiating member may be a different member or the same member. When using the same heat radiating member, each may be integrally formed or may be separated.
  • the first elastic wiring 2 and the second elastic wiring 4 are not limited to the arrangement shown in FIG. Moreover, each number is not specifically limited. Also, the type of the other electronic component 11 is not particularly limited, and may be the same as or different from the first electronic component 3 . Also, the number of electronic components 11 is not particularly limited. The arrangement position and the number of connectors 12 are not particularly limited. The electronic components 11A, 11B and the connector 12 are not essential components of the present disclosure.
  • the stretchable mounting board 100A according to the first modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wirings 2 and the second stretchable wirings 4. do.
  • the extending direction (Y direction) of the first elastic wiring 2 and the extending direction (X direction) of the second elastic wiring 4 are: cross.
  • the elastic mounting substrate 100A expands and contracts.
  • the elastic mounting substrate 100A expands and contracts in the direction of the double-headed arrow Y shown in FIG. 3A
  • the first elastic wiring 2 expands and contracts, thereby increasing the resistance and decreasing the thermal conductivity. That is, there is a possibility that the heat dissipation performance may deteriorate.
  • the second elastic wiring 4 extends in the Y direction, that is, in the direction perpendicular to the first elastic wiring 2 as viewed from the first electronic component 3, the amount of expansion and contraction in the Y direction is the same as that of the first elastic wiring less than 2. That is, since a decrease in thermal conductivity is also suppressed, a state of high thermal reliability can be maintained even when the elastic mounting board 100A expands and contracts.
  • the elastic mounting substrate 100A expands and contracts in the direction (Y direction) parallel to the extending direction of the second elastic wirings 4, the thermal conductivity of the second elastic wirings 4 decreases, but the first elasticity increases. A decrease in thermal conductivity of the wiring 2 can be suppressed. That is, the extending direction of the first elastic wiring and the extending direction of the second elastic wiring intersect at least in the vicinity of the first electronic component. can maintain high thermal reliability.
  • the vicinity of an electronic component refers to a region whose distance from the electronic component is 1 mm or less in plan view.
  • the second elastic wiring 4 has an intersection with the extending direction of the first elastic wiring 2 when viewed from the thickness direction of the elastic substrate 1, and the intersection is located at the intersection when viewed from the thickness direction of the elastic substrate 1. , the first electronic component 3 or the joint portion 10 .
  • the first elastic wiring 2 and the second elastic wiring 4 do not have to extend in one direction over the entire length of the wiring.
  • the first elastic wiring 2 includes a region extending in a direction orthogonal to the extending direction of the second elastic wiring 4, and regions extending in parallel.
  • the direction of extension of the first elastic wiring 2 near the component connection portion 5 and the direction of extension of the second elastic wiring 4 are different from each other. It should be crossed.
  • the second stretchable wiring 4 may have regions branched and extended in a plurality of directions.
  • the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are not limited to the arrangement shown in FIGS. 3A and 3B. As described above, if the extending direction of each wiring is different, the decrease in thermal conductivity in a specific expansion/contraction direction will be different. For example, when the stretchable mounting substrate expands and contracts in the X direction, the thermal conductivity of the wires extending in the X direction is greatly reduced, and the thermal conductivity of the wires extending in the Y direction is less reduced. In other words, the larger the angle formed by the stretching direction of the elastic mounting substrate and the extending direction of the wiring, the more the decrease in thermal conductivity is suppressed. In this specification, the term "angle" refers to the smaller of the two angles formed at the intersection. That is, the maximum is 90 degrees.
  • the heat conductivity of the first stretchable wiring 2 is greatly reduced.
  • a decrease in thermal conductivity is suppressed.
  • the larger the angle formed by the first elastic wiring 2 and the second elastic wiring 4 the more the decrease in the thermal conductivity of the second elastic wiring 4 is suppressed.
  • the reduction in the thermal conductivity of the first elastic wiring 2 is suppressed against the expansion and contraction that greatly reduces the thermal conductivity of the second elastic wiring 4 . That is, the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are arranged so as to intersect at least in the vicinity of the first electronic component 3.
  • the flexible mounting substrate 100A By arranging the flexible mounting substrate 100A so as to intersect in the region overlapping with the electronic component 3, it is possible to suppress a decrease in thermal conductivity regardless of the direction in which the elastic mounting substrate 100A expands and contracts. Moreover, it is preferable that the angle between the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 is large, and it is more preferable that they are perpendicular to each other.
  • the extending directions of the respective second elastic wirings 4 may be different.
  • the extension directions of the plurality of second elastic wirings 4 are different, so that the thermal conductivity of the second elastic wiring 4 is reduced when the second elastic wiring 4 is expanded and contracted in a specific direction. can be suppressed.
  • the expected expansion/contraction direction is fixed in one direction, it is effective to arrange the plurality of second elastic wirings 4 so as to be orthogonal to that direction. Since the deterioration of the thermal conductivity of the second elastic wiring 4 can be greatly suppressed in a specific expansion/contraction direction, it is possible to provide the elastic mounting substrate 100A with higher thermal reliability.
  • the elastic mounting board 100B according to the second modification of the first embodiment differs from the elastic mounting board 100 according to the first embodiment in the arrangement of the first elastic wirings 2 and the second elastic wirings 4. do.
  • the second stretchable wiring 4 is arranged above the electronic component in the thickness direction of the stretchable base material 1 .
  • the component connection portion 5 and the second stretchable wiring 4 are provided at portions with different distances from the stretchable base material 1 .
  • heat can be sufficiently dissipated from the vicinity of the first electronic component 3 even when the flexible mounting board 100B is bent.
  • the heat dissipation from the lower surface side of the first electronic component 3 can be handled by the first elastic wiring 2, and the heat dissipation from the upper surface side can be conducted by the second elastic wiring 4, so that high heat dissipation can be achieved. It is suitable when using necessary electronic parts.
  • the flexible mounting board 100B is not limited to the arrangement shown in FIGS. 4A and 4B. 4A and 4B, the second elastic wiring 4 is arranged so as to overlap the first electronic component 3 when viewed from the thickness direction of the elastic base material 1, but is arranged so as to overlap the joint 10. may be Moreover, the number and extending direction of the second elastic wiring 4 are not limited.
  • FIGS. 5A and 5B A third modification of the first embodiment will be described with reference to FIGS. 5A and 5B.
  • An elastic mounting substrate 100C according to the third modification of the first embodiment differs in the configuration of the first elastic wirings 2 from that of the first embodiment. Specifically, as shown in FIGS. 5A and 5B, the numbers of the first elastic wires 2 and the numbers of the second elastic wires 4 in the vicinity of the first electronic component 3 are different.
  • the first elastic wiring 2 is composed of three elastic wirings connected to the first electronic component 3A
  • the second elastic wiring 4 is composed of two elastic wirings. Consists of That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is higher than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6 .
  • the elastic mounting board 100C is bent so that the second elastic wiring 4 is inside and the first elastic wiring 2 is outside.
  • the elastic base material 1 is composed of a member having a uniform thickness
  • the amount of expansion and contraction increases with increasing distance from the center of bending in the thickness direction of the elastic base material 1 at the time of bending. That is, since there is a portion where the amount of expansion and contraction changes, there is a possibility that the portion will become the starting point of breakage.
  • the portion of the elastic mounting substrate 100C farther from the elastic base material 1 is less likely to expand and contract, so that the amount of expansion and contraction approaches uniformity during bending. Therefore, breakage during bending can be suppressed.
  • the magnitude of the wiring density in this specification can be compared with the magnitude of the wiring cross-sectional area in a specific region. That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is higher than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6. can be rephrased that the cross-sectional area of the first elastic wiring 2 is larger than the cross-sectional area of the second elastic wiring 4 . As shown in this embodiment, when there are a plurality of first stretchable wires 2 and a plurality of second stretchable wires 4, the total cross-sectional area of each wire is compared.
  • the number of the first elastic wirings 2 and the number of the second elastic wirings 4 may be the same.
  • the cross-sectional area can be changed by changing the width and thickness of each elastic wiring.
  • the above methods may be combined.
  • the cross-sectional area and the number of each elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4 are particularly related in size. Not limited.
  • each elastic wiring included in the first elastic wiring 2 may be the same or different. The same applies to the second stretchable wiring 4 as well. Also, the first elastic wiring 2 and the second elastic wiring 4 when viewed from the thickness direction of the elastic base material 1 are not limited to the arrangement shown in FIGS. , may overlap completely.
  • the cross-sectional area of the elastic wiring refers to an arbitrary cross section perpendicular to the extending direction of the elastic wiring. As shown in FIGS. 2A and 2B, it is preferable to compare the cross-sectional area of the region where the first elastic wiring 2 and the second elastic wiring 4 overlap in the thickness direction of the elastic base material 1. If the stretchable wiring 2 and the second stretchable wiring 4 do not overlap, it is preferable to compare in the vicinity of the electronic component. 5A and 5B, when the specific cross section is a cross section perpendicular to the extending direction of the elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4, the comparison is made at that part. is more preferable.
  • the extension directions of the respective elastic wirings included in the first elastic wiring 2 may be different. In that case, the sum of the cross-sectional areas perpendicular to each stretch direction is compared. The same applies to the second stretchable wiring 4 as well. Moreover, it is preferable that the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are parallel at least in the vicinity of the first electronic component 3 .
  • the elastic substrate 1 is bent so that the second elastic wiring 4 is inside and the first elastic wiring 2 is outside, the first elastic wiring 2 and the second elastic wiring 4 are bent. are parallel to each other, and the wiring density of the first elastic wiring 2 farther from the elastic base material 1 is higher than the wiring density of the second elastic wiring 4 closer to the elastic base material 1. By doing so, it is possible to make the amount of expansion and contraction in the vicinity of the electronic component nearly uniform when bending in such a direction.
  • the first elastic wiring 2 and the second elastic wiring 4 may each have regions with different extending directions.
  • the second elastic wiring 4 is provided on the elastic base material 1, and the component connection part is provided on the upper side of the second elastic wiring 4 via the first insulating layer 6. 5 is provided, it is preferable to select the function of each wire such that the current density of the first elastic wire 2 is greater than the current density of the second elastic wire 4 .
  • the current density of the elastic wiring is a value obtained by dividing the current flowing through the elastic wiring by the cross-sectional area of the elastic wiring. That is, the higher the current density, the more heat is generated in the stretchable wiring.
  • the second elastic wiring 4 is more likely to transfer heat than the first elastic wiring 2, so that the heat dissipation from the first electronic component 3 to the second elastic wiring 4 is reduced. can be done more efficiently.
  • a stretchable mounting board 100D according to the fourth modification of the first embodiment differs in arrangement of the second stretchable wirings 4 from the stretchable mounting board 100 according to the first embodiment. Specifically, the second stretchable wiring 4 does not overlap the first electronic component 3 but overlaps the component connection portion 5 when viewed from the thickness direction of the stretchable base material 1 .
  • the first electronic component 3 is Among them, it is preferable to place the second stretchable wiring 4 so that the portion to be most heat-dissipated and the second stretchable wiring 4 overlap. By arranging them as shown in FIGS. 6A and 6B, it is possible to efficiently dissipate heat from a region of the first electronic component 3 near the component connection portion 5 .
  • the second elastic wiring 4 is not limited to the arrangement as shown in FIGS. 6A and 6B. 6A and 6B, the second elastic wiring 4 is arranged so as to overlap all the component connection portions 5 when viewed from the thickness direction of the elastic base material 1, but at least one component connection portion 5 and It's okay if they overlap. Also, the extending direction of the second elastic wiring 4 does not have to be orthogonal to the extending direction of the first elastic wiring 2 as shown in FIGS. 6A and 6B.
  • the stretchable mounting board 100E according to the fifth modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wirings 4 . Specifically, when viewed from the thickness direction of the elastic base material 1 , the second elastic wiring 4 does not overlap the component connection portion 5 but overlaps the first electronic component 3 .
  • heat can be efficiently dissipated from the central portion of the first electronic component 3 .
  • an electronic component when an electronic component generates heat, most of the heat is generated from the central portion of the component. Therefore, by arranging them as shown in FIG. 7 , it is possible to more efficiently radiate heat from the first electronic component 3 while suppressing an increase in the area of the second stretchable wiring 4 .
  • the second elastic wiring 4 is not limited to the arrangement shown in FIG.
  • the extending direction of the second elastic wiring 4 and the extending direction of the first elastic wiring 2 may be arranged so as to be perpendicular to each other.
  • the number of elastic wirings included in the second elastic wiring 4 is not particularly limited.
  • the stretchable mounting board 100F according to the sixth modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wirings 2 and the second stretchable wirings 4. do.
  • the first elastic wiring 2 has a different extending direction across the connection with the first electronic component 3, and the second elastic wiring 4 extends in the same direction as the first elastic wiring 2. is changing.
  • FIG. 8 shows only the electrodes 13 connected to the first elastic wirings 2 of the first electronic component 3B.
  • the extending direction of the first stretchable wiring 2 may change across the first electronic component 3B. That is, it is possible to change the routing direction of the first stretchable wiring 2 to the optimum shape for the arrangement and shape of the first electronic component. Similarly, the extending direction of the second elastic wiring 4 may be changed so as to match the extending direction of the first elastic wiring 2 .
  • the sixth modification of the first embodiment is not limited to the arrangement shown in FIG.
  • the second stretchable wiring 4 may extend in one direction near the component.
  • the first elastic wiring 2 and the second elastic wiring 4 may be arranged so as to overlap when viewed from the thickness direction of the elastic base material 1 .
  • the second stretchable wiring 4 extends from the thickness direction of the stretchable base material 1.
  • the first elastic wiring 2 extends in a direction different from any direction in which the first elastic wiring 2 extends.
  • the stretchable mounting board 101 according to the second embodiment further includes a second insulating layer 7 compared to the stretchable mounting board 100 according to the first embodiment.
  • the second stretchable wiring line 4 and the stretchable base material 1 overlap in the region where the second stretchable wiring line 4 overlaps the first electronic component or the component connecting portion.
  • a second insulating layer 7 is further provided in between.
  • the second insulating layer 7 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Rubber, vinyl chloride, ester-based, amide-based elastomer resins, epoxy, phenol, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins can be used.
  • the second insulating layer 7 may be the same member as the first insulating layer 6, or may be different. Moreover, when the second insulating layer 7 and the first insulating layer 6 are the same member, both may be integrated.
  • the second elastic wiring 4 and the elastic group are formed.
  • the position of the second elastic wiring 4 in the thickness direction of the elastic base material 1 can be adjusted by being arranged between the material 1 and the elastic base material 1 .
  • the stretchable mounting substrate 101 bends in the vertical direction and vibrates, there are portions where the displacement is large and portions where the displacement is small depending on the position in the thickness direction. Specifically, the portion with the largest amount of displacement corresponds to an antinode in vibration, and the portion with the smallest amount of displacement corresponds to a node in vibration. That is, by arranging the second insulating layer 7, the second stretchable wiring 4 can be brought closer to the portion where the amount of displacement is the smallest in the thickness direction.
  • the second insulating layer 7 may be arranged between the entire second stretchable wiring 4 and the stretchable base material 1 . Also, as shown in FIG. 9 , a portion of the second insulating layer 7 may be arranged between the stretchable base material 1 and the first stretchable wiring 2 . Moreover, the second insulating layer 7 may be arranged on the entire stretchable base material 1 .
  • the stretchable mounting substrate 102 according to the third embodiment further includes a sealing layer 8 compared to the stretchable mounting substrate 100 according to the first embodiment.
  • a sealing layer 8 compared to the stretchable mounting substrate 100 according to the first embodiment.
  • illustration of the first insulating layer 6 inside the sealing layer 8 is omitted, and the sealing layer 8 is indicated by hatching.
  • the first insulating layer 6 may be arranged only inside the sealing layer 8 as shown in FIG. You can cover it.
  • the sealing layer 8 seals the first electronic component 3 and protects the first electronic component 3 from external forces.
  • the constituent material of the sealing layer 8 is not particularly limited, but examples include polyvinyl chloride, polyethylene, polystyrene, polycarbonate, polyvinylidene fluoride, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenol resin, epoxy resin, urethane resin, Examples include acrylic resins, silicone resins, elastomer resins such as styrene/butadiene resins, and the like.
  • the sealing layer 8 By providing the sealing layer 8, it is possible to protect the first electronic component 3 from external forces, while suppressing the diffusion of heat from the vicinity of the component.
  • the second elastic wiring 4 is provided so as to partially overlap the sealing layer 8 in the thickness direction of the elastic base material 1, and the second elastic wiring 4 is provided in the sealing layer. Heat can be dissipated from the first electronic component 3 by routing it to the outside of 8 .
  • the stretchable mounting substrate 102 includes the stretchable substrate 1, the first stretchable wiring 2 provided on the stretchable substrate 1, and the stretchable substrate 1.
  • the first elastic wiring 2 has a component connection portion 5 connected to the first electronic component 3, and the second elastic wiring 4 has a part of It overlaps with the sealing layer 8 .
  • the second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.
  • the heat inside the sealing layer 8 moves to the region of the second elastic wiring 4 that overlaps with the sealing layer 8 when viewed from the thickness direction of the elastic base material 1, Furthermore, the heat trapped in the sealing layer 8 can be released by being diffused to the remaining region of the second elastic wiring 4, that is, the outer region of the sealing layer 8.
  • the size of the sealing layer 8 should be larger than that of the first electronic component 3 .
  • the shape is not particularly limited, and may be rectangular or circular when viewed from the thickness direction of the elastic base material 1 .
  • part of the second elastic wiring 4 is arranged inside the sealing layer 8 .
  • the second stretchable wiring 4 By arranging the second stretchable wiring 4 inside the sealing layer 8, the distance between the first electronic component 3 and the second stretchable wiring 4 when viewed from the thickness direction of the stretchable base material 1 can be shortened. can. That is, it is possible to radiate heat from the sealing layer 8 more efficiently.
  • the second elastic wiring 4 is arranged inside the sealing layer 8, and the first elastic wiring 2 is arranged at the interface between the sealing layer 8 and the elastic base material 1.
  • the second elastic wiring 4 is not limited to the arrangement shown in FIGS. 10A and 10B, and may be arranged below the first elastic wiring 2 as in the first embodiment, for example. Moreover, it is preferable that the second stretchable wiring 4 is arranged in the vicinity of the first electronic component 3 . Also, the arrangement of the first electronic component, the first stretchable wiring, the second stretchable wiring, the first insulating layer, etc. can be the same as in the first embodiment.
  • a first modification of the third embodiment will be described with reference to FIG.
  • An elastic mounting board 102A according to the first modification of the third embodiment differs in arrangement of the second elastic wirings 4 from the elastic mounting board 102 according to the third embodiment.
  • the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 may be parallel.
  • the second stretchable wiring 4 is provided so as to overlap the first electronic component 3 when viewed from the thickness direction of the stretchable base material 1 .
  • illustration of the first insulating layer 6 is omitted in FIG. 11, as in the first embodiment, by arranging the first insulating layer between the first elastic wiring and the second elastic wiring, Since short-circuiting between the first elastic wiring and the second elastic wiring can be suppressed by the first insulating layer 6, the distance between the first electronic component 3 and the second elastic wiring 4 in the thickness direction of the elastic base material 1 is can get closer. That is, heat can be efficiently dissipated.
  • the arrangement of the first elastic wiring 2 and the second elastic wiring 4 is not limited to the arrangement shown in FIGS. 10A and 10B. By using the arrangement shown as each modification of the first embodiment, the effects described above can be obtained.
  • a fourth embodiment will be described with reference to FIGS. 12A and 12B.
  • a stretchable mounting board 103 according to the fourth embodiment differs from the stretchable mounting board 100 according to the first embodiment in that it includes a second electronic component 9 .
  • different reference numerals are assigned to the respective parts of the first elastic wiring and the second elastic wiring for clarity, but this does not indicate that they are different elastic wiring. do not have.
  • the same reference numerals are used even before and after being connected to the electronic component, but different reference numerals are used in the description of the fourth embodiment.
  • when there are a plurality of the first stretchable wirings 2 or the second stretchable wirings 4 all of them are given the same reference numerals.
  • the stretchable mounting board 103 further includes a second electronic component 9 .
  • the second electronic component 9 is connected to the second stretchable wiring 4 .
  • the second electronic component 9 is sealed with a sealing layer 8 .
  • Specific examples of the second electronic component 9 include an acceleration sensor and a temperature sensor.
  • the second electronic component 9 is not particularly limited, and may be an amplifier (operational amplifier, transistor, etc.), chip capacitor, chip resistor, LED, semiconductor IC, chip inductor, or the like. In addition, they may be the same components as the first electronic components 3B and 3C, or they may be different. Also, like the first electronic components 3B and 3C, the second electronic component 9 is preferably an active element, but may be a passive element.
  • the first elastic wires 2A and 2B are connected to the first electronic components 3B and 3C
  • the second elastic wires 4A, 4B, 4C and 4D are connected to the second electronic component 9.
  • the second stretchable wirings 4A and 4B function as stretchable heat dissipation members for the first electronic component 3B
  • the second stretchable wirings 4C and 4D function as stretchable heat dissipation members for the first electronic component 3C.
  • Z1 indicates the mounting area for the first electronic component 3B
  • Z2 indicates the mounting area for the first electronic component 3C.
  • each of the plurality of first electronic components may be provided with a stretchable heat-dissipating member having different functions such as a wiring pattern and a heat-dissipating pattern. It goes without saying that a plurality of first electronic components 3 may also be provided in embodiments other than the fourth embodiment.
  • the second electronic component 9 to which the second elastic wiring 4 is connected may also generate heat during use.
  • the second electronic component 9 also needs to dissipate heat
  • the second stretchable wiring 4 corresponds to the first stretchable wiring 2 in the first electronic components 3B and 3C, so there is a risk of insufficient heat dissipation.
  • the first elastic wiring 2B serves as a heat dissipation member of the second electronic component 9.
  • a part of the first elastic wiring 2B is a sealing layer 8 that seals the second electronic component 9 when viewed from the thickness direction of the elastic base material 1.
  • wiring connected to a certain electronic component can function as a heat dissipation member for other electronic components.
  • a plurality of first electronic components 3 and second electronic components 9 may be provided, and elastic wirings other than the first elastic wirings 2 and the second elastic wirings 4 may be provided. Also, as shown in FIGS. 12A and 12B, it is preferable that the first electronic component 3 and the second electronic component 9 are sufficiently close to each other. As described above, each stretchable wiring more reliably functions as a heat dissipation member for the electronic component connected to the other.
  • the second electronic component 9 Even if the first electronic components 3B and 3C and the second electronic component 9 are separated from each other, by making the second electronic component 9 less calorific than the first electronic components 3B and 3C, the second electronic component The current density of the elastic wiring 4 can be adjusted. That is, as described above, it is possible to more efficiently radiate heat from the first electronic components 3B and 3C.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

An elastic mounted substrate (100) is provided with: an elastic base material (1); a first elastic wiring (2) provided on the elastic base material; a first electronic component (3) mounted on the elastic base material (1) and connected to the first elastic wiring (2); a second elastic wiring (4) provided to the elastic base material (1); and a first insulation layer (6). The first elastic wiring (2) has a component connection part (5) to be connected to the first electronic component (3). A portion of the second elastic wiring (4), when being viewed in the thickness direction of the elastic base material (1), overlaps the first electronic component (3) or the component connection part (5).

Description

伸縮性実装基板Elastic mounting board
　本発明は、伸縮性実装基板に関する。 The present invention relates to elastic mounting substrates.
　従来、伸縮性を有する基材の上に、伸縮性を有する配線に接続された電子部品を搭載する伸縮性実装基板が広く知られている。例えば、特許文献１に記載の基板は、伸縮性基材上に形成された伸縮性配線と、伸縮性基材上に実装された電子部品とを備えている。 Conventionally, stretchable mounting boards are widely known, in which electronic components connected to stretchable wiring are mounted on a stretchable base material. For example, the substrate described in Patent Literature 1 includes stretchable wiring formed on a stretchable base material and electronic components mounted on the stretchable base material.
特許第６５１８４５１号公報Japanese Patent No. 6518451
　近年、使用時に発熱する電子部品を実装した伸縮性実装基板が利用されることがある。このような実装基板では、実装基板の熱信頼性を高めるために、電子部品から発せられた熱を逃がす必要がある。しかし、特許文献１に記載された構造では、伸縮性配線と電子部品が熱平衡状態になると熱が移動しにくくなるため、電子部品の発熱量に対して十分な放熱を行うことができない虞がある。特に電子部品を覆う被覆部を有している場合、その傾向が顕著に表れる。 In recent years, stretchable mounting boards on which electronic components that generate heat during use are mounted have been used. In such a mounting board, it is necessary to dissipate the heat generated from the electronic components in order to improve the thermal reliability of the mounting board. However, in the structure described in Patent Document 1, when the elastic wiring and the electronic component are in a thermal equilibrium state, heat becomes difficult to move, so there is a possibility that the heat generated by the electronic component cannot be sufficiently dissipated. . This tendency is conspicuous particularly in the case of having a covering portion covering an electronic component.
　本発明は、伸縮性基材と、伸縮性基材上に設けられた第１伸縮性配線と、伸縮性基材上に搭載され、第１伸縮性配線に接続された第１電子部品と、伸縮性基材に設けられた伸縮性放熱部材と、を備え、第１伸縮性配線は、第１電子部品に接続される部品接続部を有し、伸縮性放熱部材は、伸縮性基材の厚み方向から見て、その一部が、電子部品又は部品接続部と重なっている、伸縮性実装基板を提供する。 The present invention provides a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring, a stretchable heat dissipation member provided on the stretchable base material, wherein the first stretchable wiring has a component connection portion connected to the first electronic component, and the stretchable heat dissipation member is provided on the stretchable base material. To provide a stretchable mounting substrate partly overlapping with an electronic component or a component connecting portion when viewed from the thickness direction.
　また、本発明は、伸縮性基材と、伸縮性基材上に設けられた第１伸縮性配線と、伸縮性基材上に搭載され、第１伸縮性配線に接続された第１電子部品と、伸縮性基材に設けられた伸縮性放熱部材と、第１電子部品を封止する封止層と、を備え、第１伸縮性配線は、第１電子部品に接続される部品接続部を有し、伸縮性放熱部材は、伸縮性基材の厚み方向から見て、少なくともその一部が、封止層と重なっている、伸縮性実装基板を提供する。 The present invention also provides a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, and a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring. and a stretchable heat dissipation member provided on the stretchable base material, and a sealing layer for sealing the first electronic component, wherein the first stretchable wiring is a component connection portion connected to the first electronic component and at least a part of the elastic heat-dissipating member overlaps the sealing layer when viewed from the thickness direction of the elastic base material.
　本発明の一態様に係る伸縮性実装基板は、電子部品に対して十分な放熱効果を得ることができる。したがって、熱信頼性の高い伸縮性実装基板を提供することができる。 A stretchable mounting board according to one aspect of the present invention can obtain a sufficient heat dissipation effect for electronic components. Therefore, it is possible to provide a stretchable mounting substrate with high thermal reliability.
図１は第１実施形態に係る伸縮性実装基板の上面図である。FIG. 1 is a top view of a stretchable mounting board according to the first embodiment. 図２Ａは第１実施形態に係る、伸縮性実装基板の一部上面図である。FIG. 2A is a partial top view of the stretchable mounting substrate according to the first embodiment. 図２Ｂは第１実施形態に係る、伸縮性実装基板の一部断面図（上面図におけるＡ－Ａ線断面図）である。FIG. 2B is a partial cross-sectional view (cross-sectional view taken along the line AA in the top view) of the elastic mounting board according to the first embodiment. 図３Ａは第１実施形態の第１変形例に係る伸縮性実装基板の一部上面図である。FIG. 3A is a partial top view of an elastic mounting substrate according to a first modification of the first embodiment; 図３Ｂは第１実施形態の第１変形例に係る伸縮性実装基板の一部断面図（上面図におけるＢ－Ｂ線断面図）である。FIG. 3B is a partial cross-sectional view (cross-sectional view taken along the line BB in the top view) of the elastic mounting board according to the first modification of the first embodiment. 図４Ａは第１実施形態の第２変形例に係る伸縮性実装基板の一部上面図である。FIG. 4A is a partial top view of a stretchable mounting board according to a second modification of the first embodiment; 図４Ｂは第１実施形態の第２変形例に係る伸縮性実装基板の一部断面図（上面図におけるＣ－Ｃ線断面図）である。FIG. 4B is a partial cross-sectional view (cross-sectional view taken along the line CC in the top view) of the elastic mounting board according to the second modification of the first embodiment. 図５Ａは第１実施形態の第３変形例に係る伸縮性実装基板の一部上面図である。FIG. 5A is a partial top view of an elastic mounting substrate according to a third modification of the first embodiment; 図５Ｂは第１実施形態の第３変形例に係る伸縮性実装基板の一部断面図（上面図におけるＤ－Ｄ線断面図）である。FIG. 5B is a partial cross-sectional view (cross-sectional view taken along the line DD in the top view) of the stretchable mounting board according to the third modification of the first embodiment. 図６Ａは第１実施形態の第４変形例に係る伸縮性実装基板の一部上面図である。FIG. 6A is a partial top view of an elastic mounting substrate according to a fourth modification of the first embodiment; 図６Ｂは第１実施形態の第４変形例に係る伸縮性実装基板の一部断面図（上面図におけるＥ－Ｅ線断面図）である。FIG. 6B is a partial cross-sectional view (cross-sectional view taken along the line EE in the top view) of the stretchable mounting board according to the fourth modification of the first embodiment. 図７は第１実施形態の第５変形例に係る伸縮性実装基板の一部上面図である。FIG. 7 is a partial top view of an elastic mounting board according to a fifth modification of the first embodiment. 図８は第１実施形態の第６変形例に係る伸縮性実装基板の一部上面図である。FIG. 8 is a partial top view of an elastic mounting board according to a sixth modification of the first embodiment. 図９は第２実施形態に係る伸縮性実装基板の一部断面図である。FIG. 9 is a partial cross-sectional view of an elastic mounting board according to the second embodiment. 図１０Ａは第３実施形態に係る伸縮性実装基板の一部上面図である。FIG. 10A is a partial top view of an elastic mounting board according to the third embodiment. 図１０Ｂは第３実施形態に係る伸縮性実装基板の一部断面図（上面図におけるＦ－Ｆ線断面図）である。FIG. 10B is a partial cross-sectional view (cross-sectional view taken along the line FF in the top view) of the elastic mounting board according to the third embodiment. 図１１は第３実施形態の第１変形例に係る伸縮性実装基板の一部上面図である。FIG. 11 is a partial top view of an elastic mounting substrate according to a first modified example of the third embodiment. 図１２Ａは第４実施形態に係る伸縮性実装基板の一部上面図である。FIG. 12A is a partial top view of an elastic mounting board according to the fourth embodiment. 図１２Ｂは第４実施形態に係る伸縮性実装基板の一部断面図（上面図におけるＧ－Ｇ線断面図）である。FIG. 12B is a partial cross-sectional view (cross-sectional view taken along the line GG in the top view) of the elastic mounting board according to the fourth embodiment.
　以下、本発明の実施の形態について、図面を用いて詳細に説明する。なお、以下で説明する実施の形態は、いずれも包括的又は具体的な例を示すものである。以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置及び接続形態などは、一例であり、本発明を限定する主旨ではない。以下の実施の形態における構成要素のうち、独立請求項に記載されていない構成要素については、任意の構成要素として説明される。また、図面に示される構成要素の大きさ、又は大きさの比は、必ずしも厳密ではない。また、各図において、実質的に同一の構成に対しては同一の符号を付しており、重複する説明は省略又は簡略化する場合がある。各実施形態は例示であり、異なる実施形態で示した構成の部分的な置換又は組み合わせが可能である。各々の実施形態では、その実施形態以前に説明した点と異なる点について主に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement of components, connection forms, and the like shown in the following embodiments are examples, and are not intended to limit the present invention. Among the constituent elements in the following embodiments, constituent elements not described in independent claims will be described as optional constituent elements. Also, the sizes or size ratios of components shown in the drawings are not necessarily exact. Moreover, in each figure, the same code|symbol is attached|subjected with respect to substantially the same structure, and the overlapping description may be abbreviate|omitted or simplified. Each embodiment is an example, and partial substitutions or combinations of configurations shown in different embodiments are possible. Each embodiment will mainly be described with respect to points different from those described before the embodiment.
　［第１実施形態］
　図１及び図２Ａと図２Ｂを参照しながら、伸縮性基材に電子部品を実装してなる伸縮性実装基板１００の構造について説明する。図１に示すように、伸縮性実装基板１００は平面視で、左側に矩形状の主要部と右側に凸状の副部とを備える形状を有している。伸縮性実装基板１００は、図１のような形状に限定されず、例えば円形状でもよいし、長方形状であってもよい。また、図１には、伸縮性実装基板１００が使用される際に想定される伸縮方向を両矢印Ｘで示している。なお、この伸縮方向の矢印は、この伸縮性実装基板１００がこの方向にしか伸縮しないことを意味するものではなく、伸縮性実装基板１００は他の方向に伸縮してもよい。また、図２Ｂでは、第１電子部品３又は部品接続部５が配置される領域を両矢印の実装領域Ｚで示している。なお、両矢印の実装領域Ｚは単なる例示であって、どのような大きさであってもよい。この伸縮性実装基板１００は、例えば、その上面主面又は下側主面を貼り付け面として人体などの生体曲面に貼り付けられ、薄型かつストレッチャブルなウエアラブルデバイスとして利用される。 [First embodiment]
The structure of a stretchable mounting board 100 in which electronic components are mounted on a stretchable base material will be described with reference to FIGS. 1, 2A, and 2B. As shown in FIG. 1, the stretchable mounting substrate 100 has a shape in plan view with a rectangular main portion on the left side and a convex secondary portion on the right side. The elastic mounting substrate 100 is not limited to the shape shown in FIG. 1, and may be, for example, circular or rectangular. Further, in FIG. 1 , a double-headed arrow X indicates an expected direction of expansion and contraction when the elastic mounting substrate 100 is used. It should be noted that the expansion/contraction direction arrow does not mean that the elastic mounting board 100 expands/contracts only in this direction, and the elastic mounting board 100 may expand/contract in other directions. In addition, in FIG. 2B, the area where the first electronic component 3 or the component connection portion 5 is arranged is indicated by a mounting area Z indicated by a double arrow. Note that the mounting area Z indicated by a double arrow is merely an example, and may be of any size. The stretchable mounting substrate 100 is used as a thin and stretchable wearable device, for example, attached to a curved surface of a living body such as a human body using its upper or lower main surface as an attachment surface.
　図１及び図２Ａと図２Ｂに示す伸縮性実装基板１００は、伸縮性基材１と、伸縮性基材１上に設けられた第１伸縮性配線２と、伸縮性基材１に搭載され、第１伸縮性配線２に接続された第１電子部品３と、伸縮性基材１上に設けられた第２伸縮性配線４と、伸縮性基材１上に設けられた第１絶縁層６と、を備えている。第１伸縮性配線２は、第１電子部品３に接続される部品接続部５を有し、第２伸縮性配線４は、平面視で、つまり伸縮性基材１の厚み方向から見て、その一部が、第１電子部品３又は部品接続部５と重なる。なお、図１の上面図と図２Ａの上面図では、便宜上、第１伸縮性配線２、第２伸縮性配線４、第１絶縁層６、接合部１０をハッチングで示す。以下の上面図においても同様である。 The stretchable mounting substrate 100 shown in FIGS. 1, 2A and 2B includes a stretchable substrate 1, first stretchable wiring 2 provided on the stretchable substrate 1, and mounted on the stretchable substrate 1. , a first electronic component 3 connected to the first elastic wiring 2, a second elastic wiring 4 provided on the elastic substrate 1, and a first insulating layer provided on the elastic substrate 1 6 and . The first stretchable wiring 2 has a component connection portion 5 connected to the first electronic component 3, and the second stretchable wiring 4 is viewed from above, that is, viewed from the thickness direction of the stretchable base material 1, A part thereof overlaps with the first electronic component 3 or the component connection portion 5 . 1 and FIG. 2A, the first elastic wiring 2, the second elastic wiring 4, the first insulating layer 6, and the joint 10 are hatched for convenience. The same applies to the following top views.
　第２伸縮性配線４は、本開示における伸縮性放熱部材に相当する。 The second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.
　上記のような構成にすることで、第２伸縮性配線４のうち、伸縮性基材１の厚み方向から見て、第１電子部品３及び部品接続部５と重なる部分が吸熱部として機能する。吸熱部で吸収された熱は、第２伸縮性配線４全体に広がる。すなわち、第１電子部品３から発生した熱を、吸熱部で吸収し、第１電子部品３から離れた方向に延設された第２伸縮性配線４を介して逃がすことができる。したがって、上記のような構成にすることで、熱信頼性の高い伸縮性実装基板を提供することができる。 With the above configuration, the portion of the second elastic wiring 4 that overlaps the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the elastic base material 1 functions as a heat absorbing portion. . The heat absorbed by the heat absorbing portion spreads over the entire second stretchable wiring 4 . That is, the heat generated from the first electronic component 3 can be absorbed by the heat absorbing portion and released through the second stretchable wiring 4 extending away from the first electronic component 3 . Therefore, with the configuration as described above, it is possible to provide an elastic mounting substrate with high thermal reliability.
　本明細書中における熱信頼性とは、電子部品の使用時の発熱による誤動作や不良の発生率のことを指している。すなわち熱信頼性が高いほど、電子部品を含む伸縮性実装基板に誤動作や不良が発生する可能性は低く、熱信頼性が低いほど、誤動作や不良が発生する可能性が高くなる。 　Thermal reliability in this specification refers to the rate of occurrence of malfunctions and defects due to heat generation of electronic components during use. That is, the higher the thermal reliability, the lower the possibility of malfunctions and defects occurring in the elastic mounting board including the electronic components, and the lower the thermal reliability, the higher the possibility of malfunctions and defects occurring.
　伸縮性基材１は、シート状あるいはフィルム状の伸縮可能な基材であり、例えば、伸縮性を有する樹脂材料から構成される。樹脂材料としては、例えば、熱可塑性ポリウレタン等が挙げられる。伸縮性基材１の厚さは特に限定されないが、生体に貼り付けた際に生体表面の伸縮を阻害しない観点からは、１ｍｍ以下であることが好ましく、１００μｍ以下であることがより好ましく、１μｍ以下であることがさらに好ましい。また、伸縮性基材１の厚さは、０．１μｍ以上であることが好ましい。 The stretchable base material 1 is a sheet-like or film-like stretchable base material, and is made of, for example, a stretchable resin material. Examples of the resin material include thermoplastic polyurethane and the like. The thickness of the elastic base material 1 is not particularly limited, but from the viewpoint of not inhibiting the expansion and contraction of the surface of the living body when attached to the living body, it is preferably 1 mm or less, more preferably 100 μm or less, and 1 μm. More preferably: Moreover, the thickness of the stretchable base material 1 is preferably 0.1 μm or more.
　第１伸縮性配線２は、伸縮性基材１の主面上及び第１絶縁層６の主面上にて所定パターンに引き回されている伸縮性配線のうち、第１電子部品３に直接的に接続されているものを指す。第１伸縮性配線２は導電性粒子と樹脂とを含んでいる。例えば、導電性粒子としてのＡｇ、Ｃｕ、Ｎｉなどの金属粉と、シリコーン樹脂などのエラストマー系樹脂とからなる混合物が挙げられる。導電性粒子の平均粒径は特に限定されるものではないが、０．０１μｍ以上、１０μｍ以下であることが好ましい。また、導電性粒子の形状は球形であることが好ましい。 The first elastic wiring 2 is directly connected to the first electronic component 3 among the elastic wirings drawn in a predetermined pattern on the main surface of the elastic base material 1 and on the main surface of the first insulating layer 6. It refers to something that is physically connected. The first stretchable wiring 2 contains conductive particles and resin. For example, a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used. Although the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 μm or more and 10 μm or less. Also, the shape of the conductive particles is preferably spherical.
第１伸縮性配線２の厚さは特に限定されないが、１００μｍ以下であることが好ましく、５０μｍ以下であることがより好ましい。また、第１伸縮性配線２の厚さは０．０１μｍ以上であることが好ましい。第１伸縮性配線２の線幅は特に限定されないが０．１μｍ以上であることが好ましく、１０ｍｍ以下であることがより好ましい。また、第１伸縮性配線２に含まれる伸縮性配線の本数は特に限定されない。 Although the thickness of the first elastic wiring 2 is not particularly limited, it is preferably 100 μm or less, more preferably 50 μm or less. Moreover, it is preferable that the thickness of the first elastic wiring 2 is 0.01 μm or more. Although the line width of the first elastic wiring 2 is not particularly limited, it is preferably 0.1 μm or more, and more preferably 10 mm or less. Also, the number of elastic wires included in the first elastic wire 2 is not particularly limited.
　第１電子部品３は伸縮性基材１に搭載されている。第１電子部品３の例として、加速度センサ、温度センサなどが挙げられる。第１電子部品３は特に限定されず、増幅器（オペアンプ、トランジスタ等）、チップコンデンサ、チップ抵抗、ＬＥＤ、半導体ＩＣ、チップインダクタなどであってもよい。第１電子部品３は外部電極１３を備え、外部電極１３が接合部１０を介して第１伸縮性配線２の部品接続部５と電気的に接続している。電子部品の熱信頼性、ひいては伸縮性実装基板１００の熱信頼性を大きく改善できるという観点から、第１電子部品３は能動素子などの発熱性電子部品であることが好ましいが、受動素子であってもよい。 The first electronic component 3 is mounted on the elastic base material 1. Examples of the first electronic component 3 include an acceleration sensor and a temperature sensor. The first electronic component 3 is not particularly limited, and may be an amplifier (operational amplifier, transistor, etc.), chip capacitor, chip resistor, LED, semiconductor IC, chip inductor, or the like. The first electronic component 3 has an external electrode 13 , and the external electrode 13 is electrically connected to the component connection portion 5 of the first elastic wiring 2 via the joint portion 10 . The first electronic component 3 is preferably a heat-generating electronic component such as an active element from the viewpoint that the thermal reliability of the electronic component, and thus the thermal reliability of the elastic mounting substrate 100, can be greatly improved. may
　第１電子部品３は接合部１０を介して第１伸縮性配線２に接続される。接合部１０を構成する材料としては、半田や導電性接着剤が挙げられるが、上記のような材料でなくてもよい。接合部１０は、いわゆるフィレットであり、図１に示したような形状に限定されず、例えば半円形状であってもよい。また、第１電子部品３は図１のような配置に限定されず、伸縮性基材１のどこに配置されていてもよい。 The first electronic component 3 is connected to the first stretchable wiring 2 via the joint 10 . Although solder and a conductive adhesive can be used as materials for forming the joint 10, the materials other than those described above may be used. The joint 10 is a so-called fillet, and is not limited to the shape shown in FIG. 1, and may be semicircular, for example. Moreover, the first electronic component 3 is not limited to the arrangement shown in FIG.
　第２伸縮性配線４は、伸縮性基材１の主面上にて所定パターンに引き回されており、導電性粒子と樹脂を含んでいる。例えば、導電性粒子としてのＡｇ、Ｃｕ、Ｎｉなどの金属粉と、シリコーン樹脂などのエラストマー系樹脂とからなる混合物が挙げられる。導電性粒子の平均粒径は特に限定されるものではないが、０．０１μｍ以上、１０μｍ以下であることが好ましい。また、導電性粒子の形状は球形であることが好ましい。 The second stretchable wiring 4 is routed in a predetermined pattern on the main surface of the stretchable base material 1 and contains conductive particles and resin. For example, a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used. Although the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 μm or more and 10 μm or less. Also, the shape of the conductive particles is preferably spherical.
　第２伸縮性配線４の厚さは特に限定されないが、１００μｍ以下であることが好ましく、５０μｍ以下であることがより好ましい。また、第２伸縮性配線４の厚さは０．０１μｍ以上であることが好ましい。第２伸縮性配線４の線幅は特に限定されないが０．１μｍ以上であることが好ましく、１０ｍｍ以下であることがより好ましい。また、第２伸縮性配線４に含まれる伸縮性配線の本数は特に限定されない。第２伸縮性配線４は、第１電子部品３に電気的に直接は接続されていない。 Although the thickness of the second elastic wiring 4 is not particularly limited, it is preferably 100 μm or less, more preferably 50 μm or less. Moreover, it is preferable that the thickness of the second elastic wiring 4 is 0.01 μm or more. Although the line width of the second elastic wiring 4 is not particularly limited, it is preferably 0.1 μm or more, and more preferably 10 mm or less. Further, the number of elastic wirings included in the second elastic wiring 4 is not particularly limited. The second stretchable wiring 4 is not electrically connected directly to the first electronic component 3 .
　なお、第１伸縮性配線２と第２伸縮性配線４とは、それぞれ同じ平均粒径の導電性粒子を含んでいてもよいし、異なった導電性粒子を含んでいてもよい。伸縮性配線の幅及び厚さについても同様に、それぞれの値が同じでもよいし、異なっていてもよい。第１伸縮性配線２よりも第２伸縮性配線４の線幅は太い方が、放熱性を向上させることができるので、好ましい。 The first elastic wiring 2 and the second elastic wiring 4 may each contain conductive particles having the same average particle size, or may contain different conductive particles. Similarly, the width and thickness of the elastic wiring may be the same or different. It is preferable that the line width of the second stretchable wiring 4 is thicker than that of the first stretchable wiring 2, because the heat dissipation can be improved.
　なお、本開示における伸縮性放熱部材は伸縮性配線に限定されず、例えばパターニングされた伸縮性の放熱パターンなどであってもよい。つまり、電子部品や配線に接続されていない、機能を放熱に特化したパターンであってもよい。伸縮性配線以外の伸縮性放熱部材についても形状は特に限定されず、前記伸縮性基材の厚み方向から見て、その一部が、前記第１電子部品又は前記部品接続部と重なっていればよい。 It should be noted that the elastic heat dissipation member in the present disclosure is not limited to elastic wiring, and may be, for example, a patterned elastic heat dissipation pattern. In other words, it may be a pattern that is not connected to an electronic component or wiring and whose function is specialized for heat dissipation. The shape of the elastic heat dissipation member other than the elastic wiring is not particularly limited, as long as a part of the elastic heat dissipation member overlaps the first electronic component or the component connection portion when viewed from the thickness direction of the elastic base material. good.
　また、第１伸縮性配線２と第２伸縮性配線４とは、伸縮性基材１の厚み方向から見て、第１電子部品３及び部品接続部５と重ならない領域において、両者が接続されていてもよい。第１伸縮性配線２と第２伸縮性配線４とは、少なくとも第１電子部品３の近傍において平行かつ重なるように、同方向に延伸されており、第１伸縮性配線２から第２伸縮性配線４へ効率的に熱を移動させることができる。 In addition, the first elastic wiring 2 and the second elastic wiring 4 are connected in a region that does not overlap the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the elastic base material 1. may be The first elastic wiring 2 and the second elastic wiring 4 are extended in the same direction so as to be parallel and overlap at least in the vicinity of the first electronic component 3 , and extend from the first elastic wiring 2 to the second elastic wiring. Heat can be efficiently transferred to the wiring 4 .
　部品接続部５は、電子部品実装用のランドやパッドとして機能する部分であり、第１伸縮性配線２のうち、伸縮性基材１の厚み方向から見て、接合部１０と重なる部分を指す。なお、接合部１０は、伸縮性基材１の厚み方向から見て、第１伸縮性配線２に重ならない領域を含んでいてもよいし、全体が第１伸縮性配線２に重なっていてもよい。 The component connection portion 5 is a portion that functions as a land or pad for mounting electronic components, and refers to a portion of the first elastic wiring 2 that overlaps the joint portion 10 when viewed from the thickness direction of the elastic base material 1. . Note that the joint portion 10 may include a region that does not overlap the first elastic wiring 2 when viewed from the thickness direction of the elastic base material 1, or may overlap the first elastic wiring 2 as a whole. good.
　第１絶縁層６は、樹脂材料、又は、樹脂材料及び無機材料からなる混合物であることが好ましく、樹脂材料として例えば、ウレタン系、スチレン系、オレフィン系、シリコーン系、フッ素系、ニトリルゴム、ラテックスゴム、塩化ビニル、エステル系、アミド系等のエラストマー系樹脂、エポキシ、フェノール、アクリル、ポリエステル、イミド系、ロジン、セルロース、ポリエチレンテレフタレート系、ポリエチレンナフタレート系、ポリカーボネート系樹脂が挙げられる。 The first insulating layer 6 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Rubber, vinyl chloride, ester-based, amide-based elastomer resins, epoxy, phenol, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins can be used.
　伸縮性基材１の厚み方向において、第１電子部品３と第２伸縮性配線４との間に、第１絶縁層６が配置される。第１絶縁層６をこのように配置することで、第１電子部品３から第２伸縮性配線４へ効率的な放熱が可能になる。なお、図１のように、第１伸縮性配線２と第２伸縮性配線４とが重なる領域にのみ、第１絶縁層６が配置されていてもよいし、基板全体に重なるように配置されていてもよい。 A first insulating layer 6 is arranged between the first electronic component 3 and the second elastic wiring 4 in the thickness direction of the elastic base material 1 . By arranging the first insulating layer 6 in this way, efficient heat dissipation from the first electronic component 3 to the second stretchable wiring 4 becomes possible. As shown in FIG. 1, the first insulating layer 6 may be arranged only in the region where the first elastic wiring 2 and the second elastic wiring 4 overlap, or may be arranged so as to overlap the entire substrate. may be
　第１電子部品３と第２伸縮性配線４との距離が近ければ近いほど、第２伸縮性配線４は第１電子部品３から発生する熱を効率よく吸収することができる。しかし、伸縮性基材１の厚み方向において、第１電子部品３と第２伸縮性配線４との距離が近いと、両者が接触することによる短絡の可能性が増加する。図２Ａと図２Ｂのように第１伸縮性配線２と第２伸縮性配線４の間に第１絶縁層６を配置することで、短絡の可能性を低減しながら、第１電子部品３と第２伸縮性配線４との距離を十分に近づけることができる。したがって、効率よく第１電子部品３からの発熱を第２伸縮性配線４が吸収することができる。 The closer the distance between the first electronic component 3 and the second elastic wiring 4 is, the more efficiently the second elastic wiring 4 can absorb the heat generated from the first electronic component 3 . However, if the distance between the first electronic component 3 and the second elastic wiring 4 is short in the thickness direction of the elastic base material 1, the possibility of short circuit due to contact between the two increases. By disposing the first insulating layer 6 between the first elastic wiring 2 and the second elastic wiring 4 as shown in FIGS. 2A and 2B, the first electronic component 3 and the first electronic component 3 can be The distance to the second stretchable wiring 4 can be made sufficiently close. Therefore, the heat generated from the first electronic component 3 can be efficiently absorbed by the second stretchable wiring 4 .
　図２Ａと図２Ｂに示すように、第１実施形態に係る伸縮性実装基板１００は、伸縮性基材１上に第２伸縮性配線４が設けられており、第１絶縁層６を介して第２伸縮性配線４の上側に部品接続部５が設けられている。上記のような構成にすることで、熱信頼性の高い伸縮性実装基板を提供することができる。なお、本明細書中の上下方向は、図２Ａと図２Ｂにおける伸縮性基材１を「下側」、第１電子部品３を「上側」として定められるが、使用時における実際の上下方向と一致していなくてもよい。 As shown in FIGS. 2A and 2B, the elastic mounting board 100 according to the first embodiment has the second elastic wiring 4 provided on the elastic base material 1 and the first insulating layer 6 interposed therebetween. A component connection portion 5 is provided above the second elastic wiring 4 . With the configuration as described above, it is possible to provide a stretchable mounting substrate with high thermal reliability. In addition, the vertical direction in this specification is defined as the “lower side” for the elastic base material 1 and the “upper side” for the first electronic component 3 in FIGS. They do not have to match.
　上記の効果について、より詳細に説明する。一般に、伸縮性配線は伸長時に抵抗が増加し、熱伝導率が低下することが知られている。言い換えれば、第１伸縮性配線２及び第２伸縮性配線４は伸長時に放熱性能が低下する。したがって、伸縮性実装基板１００が伸長や撓みなどの変形をする際に、第１伸縮性配線２と第２伸縮性配線４とは一様に伸縮しないことが好ましい。このため、第１伸縮性配線２及び部品接続部５と第２伸縮性配線４とは、電子部品の近傍においては、異なる層に設けられていることが好ましい。 I will explain the above effects in more detail. It is generally known that stretchable wiring increases in resistance and decreases in thermal conductivity when stretched. In other words, the heat dissipation performance of the first stretchable wiring 2 and the second stretchable wiring 4 is lowered when stretched. Therefore, it is preferable that the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly when the elastic mounting substrate 100 deforms such as stretching and bending. Therefore, it is preferable that the first elastic wiring 2 and the component connection portion 5 and the second elastic wiring 4 are provided in different layers in the vicinity of the electronic component.
　第１伸縮性配線２と第２伸縮性配線４とが一様に伸縮しないような構造にすることで、一方の伸縮性配線の熱伝導率が低下した際も、もう一方の伸縮性配線の熱伝導率低下を抑制できるため、より熱信頼性の高い伸縮性実装基板を提供することができる。 By adopting a structure in which the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly, even when the thermal conductivity of one elastic wiring decreases, the other elastic wiring does not expand. Since a decrease in thermal conductivity can be suppressed, a stretchable mounting substrate with higher thermal reliability can be provided.
　部品接続部５と第２伸縮性配線４とは、前記伸縮性基材からの距離がそれぞれ異なる部分に設けられている。このことで、伸縮性実装基板１００が撓んだり曲げられたりした際に、第１伸縮性配線２と第２伸縮性配線４とが一様に伸縮しない。したがって、伸縮性実装基板１００に撓みが生じた際にも、第１電子部品３の近傍から放熱を十分に行うことができる。 The component connection portion 5 and the second stretchable wiring 4 are provided at different distances from the stretchable base material. As a result, when the elastic mounting substrate 100 is bent or bent, the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly. Therefore, even when the stretchable mounting board 100 is bent, it is possible to sufficiently dissipate heat from the vicinity of the first electronic component 3 .
　図１に示すように、第１伸縮性配線２及び第２伸縮性配線４はコネクタ１２に接続されている。つまり、伸縮性配線基板１１を、コネクタ１２を介して、他のデバイスに接続することができる。また、第１伸縮性配線２は第１電子部品３と異なる電子部品１１Ａに接続され、第２伸縮性配線４は電子部品１１Ｂに接続されている。第１伸縮性配線２が、複数の電子部品に接続されている場合、その複数の電子部品の各々に伸縮性放熱部材を配置してもよいし、図１のように、第１電子部品３にのみ伸縮性放熱部材を配置してもよい。複数の伸縮性放熱部材を配置する場合、それぞれの伸縮性放熱部材は異なる部材であってもよいし、同一の部材であってもよい。同一の放熱部材を用いる場合、それぞれが一体となって形成されていてもよいし分離していてもよい。 As shown in FIG. 1 , the first stretchable wiring 2 and the second stretchable wiring 4 are connected to the connector 12 . That is, the stretchable wiring board 11 can be connected to other devices via the connector 12 . Also, the first elastic wiring 2 is connected to an electronic component 11A different from the first electronic component 3, and the second elastic wiring 4 is connected to the electronic component 11B. When the first stretchable wiring 2 is connected to a plurality of electronic components, a stretchable heat dissipation member may be arranged for each of the plurality of electronic components, or as shown in FIG. You may arrange|position an elastic|stretch heat radiating member only to. When arranging a plurality of stretchable heat radiating members, each stretchable heat radiating member may be a different member or the same member. When using the same heat radiating member, each may be integrally formed or may be separated.
　第１伸縮性配線２と第２伸縮性配線４とは、図１で示した配置に限定されず、伸縮性基材１１上にどのように配置されていてもよい。またそれぞれの本数は特に限定されない。また、他の電子部品１１の種類は特に限定されず、第１電子部品３と同一であってもよいし、異なっていてもよい。また、電子部品１１の個数は特に限定されない。コネクタ１２の配置位置、個数は特に限定されない。電子部品１１Ａ、１１Ｂ及びコネクタ１２は本開示に必須の構成ではない。 The first elastic wiring 2 and the second elastic wiring 4 are not limited to the arrangement shown in FIG. Moreover, each number is not specifically limited. Also, the type of the other electronic component 11 is not particularly limited, and may be the same as or different from the first electronic component 3 . Also, the number of electronic components 11 is not particularly limited. The arrangement position and the number of connectors 12 are not particularly limited. The electronic components 11A, 11B and the connector 12 are not essential components of the present disclosure.
　［第１実施形態の第１変形例］
　図３Ａと図３Ｂを参照して第１実施形態の第１変形例について説明する。第１実施形態の第１変形例に係る伸縮性実装基板１００Ａは、第１実施形態に係る伸縮性実装基板１００と比較して第１伸縮性配線２及び第２伸縮性配線４の配置が相違する。図３Ａに示すように、平面視で第１電子部品３と重なる領域において、第１伸縮性配線２の延伸方向（Ｙ方向）と第２伸縮性配線４の延伸方向（Ｘ方向）とは、交差する。 [First Modification of First Embodiment]
A first modification of the first embodiment will be described with reference to FIGS. 3A and 3B. The stretchable mounting board 100A according to the first modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wirings 2 and the second stretchable wirings 4. do. As shown in FIG. 3A, in the region overlapping the first electronic component 3 in plan view, the extending direction (Y direction) of the first elastic wiring 2 and the extending direction (X direction) of the second elastic wiring 4 are: cross.
　上記のような構成にすることで、伸縮性実装基板１００Ａの伸縮時の放熱性の低下を抑制することができる。具体的には、図３Ａ中に示した両矢印Ｙ方向に、伸縮性実装基板１００Ａが伸縮した場合、第１伸縮性配線２は伸縮することで抵抗が上昇し、熱伝導率が低下する。すなわち放熱性能が低下する虞がある。 With the configuration as described above, it is possible to suppress deterioration in heat dissipation when the elastic mounting substrate 100A expands and contracts. Specifically, when the elastic mounting substrate 100A expands and contracts in the direction of the double-headed arrow Y shown in FIG. 3A, the first elastic wiring 2 expands and contracts, thereby increasing the resistance and decreasing the thermal conductivity. That is, there is a possibility that the heat dissipation performance may deteriorate.
　しかし、第２伸縮性配線４はＹ方向に、つまり第１電子部品３からみて第１伸縮性配線２に直交する方向に延伸しているため、Ｙ方向への伸縮量は第１伸縮性配線２と比較して少ない。すなわち、熱伝導率の低下も抑制されるため、伸縮性実装基板１００Ａが伸縮した際にも熱信頼性の高い状態を維持することができる。 However, since the second elastic wiring 4 extends in the Y direction, that is, in the direction perpendicular to the first elastic wiring 2 as viewed from the first electronic component 3, the amount of expansion and contraction in the Y direction is the same as that of the first elastic wiring less than 2. That is, since a decrease in thermal conductivity is also suppressed, a state of high thermal reliability can be maintained even when the elastic mounting board 100A expands and contracts.
　同様に、伸縮性実装基板１００Ａが第２伸縮性配線４の延伸方向と平行な方向（Ｙ方向）に伸縮した場合、第２伸縮性配線４の熱伝導率は低下するが、第１伸縮性配線２の熱伝導率の低下を抑制することができる。すなわち、前記第１伸縮性配線の延伸方向と前記第２伸縮性配線の延伸方向とは、少なくとも前記第１電子部品の近傍において交差することで、伸縮性実装基板１００Ａがどの方向に伸縮したとしても、熱信頼性の高い状態を維持することができる。なお、電子部品の近傍とは、平面視において電子部品からの距離が１ｍｍ以下の領域のことを指す。 Similarly, when the elastic mounting substrate 100A expands and contracts in the direction (Y direction) parallel to the extending direction of the second elastic wirings 4, the thermal conductivity of the second elastic wirings 4 decreases, but the first elasticity increases. A decrease in thermal conductivity of the wiring 2 can be suppressed. That is, the extending direction of the first elastic wiring and the extending direction of the second elastic wiring intersect at least in the vicinity of the first electronic component. can maintain high thermal reliability. In addition, the vicinity of an electronic component refers to a region whose distance from the electronic component is 1 mm or less in plan view.
　第２伸縮性配線４は、伸縮性基材１の厚み方向から見て、第１伸縮性配線２の延伸方向との交点を持ち、当該交点は、伸縮性基材１の厚み方向から見て、第１電子部品３又は接合部１０と重なることがより好ましい。このように第２伸縮性配線４を配置することで、伸縮性実装基板１００Ａの熱信頼性をより高めることができる。 The second elastic wiring 4 has an intersection with the extending direction of the first elastic wiring 2 when viewed from the thickness direction of the elastic substrate 1, and the intersection is located at the intersection when viewed from the thickness direction of the elastic substrate 1. , the first electronic component 3 or the joint portion 10 . By arranging the second stretchable wiring 4 in this way, the thermal reliability of the stretchable mounting substrate 100A can be further improved.
　なお、第１伸縮性配線２及び第２伸縮性配線４は、配線全長にわたって１方向に延伸していなくてもよい。具体的には、図３Ａと図３Ｂに示したように、第１伸縮性配線２は、第２伸縮性配線４の延伸方向と直交する方向に延伸する領域と、第２伸縮性配線４と平行に延伸する領域とを備えていてもよい。このような場合、第１電子部品３に近い領域における延伸方向の影響が大きいため、第１伸縮性配線２における部品接続部５付近の延伸方向と第２伸縮性配線４の延伸方向とが、交差していればよい。また、第２伸縮性配線４が複数の方向に枝分かれして延伸する領域を備えていてもよい。この場合も同様に、第１電子部品３に近い領域の延伸方向の影響が大きいため、第１伸縮性配線２における部品接続部５付近の延伸方向と第２伸縮性配線４の延伸方向とが、交差していればよい。 Note that the first elastic wiring 2 and the second elastic wiring 4 do not have to extend in one direction over the entire length of the wiring. Specifically, as shown in FIGS. 3A and 3B, the first elastic wiring 2 includes a region extending in a direction orthogonal to the extending direction of the second elastic wiring 4, and regions extending in parallel. In such a case, since the direction of extension in the region close to the first electronic component 3 has a large effect, the direction of extension of the first elastic wiring 2 near the component connection portion 5 and the direction of extension of the second elastic wiring 4 are different from each other. It should be crossed. Further, the second stretchable wiring 4 may have regions branched and extended in a plurality of directions. In this case as well, since the direction of extension of the region near the first electronic component 3 has a large effect, the direction of extension of the first elastic wiring 2 near the component connection portion 5 and the direction of extension of the second elastic wiring 4 are different. , as long as they intersect.
　第１伸縮性配線２の延伸方向と第２伸縮性配線４の延伸方向は、図３Ａと図３Ｂで示した配置に限定されない。前述したように、各配線の延伸方向が異なれば、特定の伸縮方向に対する熱伝導率の低下は異なる。例えば伸縮性実装基板がＸ方向に伸縮した場合を考えると、Ｘ方向へ延伸している配線の熱伝導率は大きく低下し、Ｙ方向へ延伸している配線の熱伝導率の低下は少ない。言い換えれば、伸縮性実装基板の伸縮方向と配線の延伸方向とがなす角が大きいほど、熱伝導率の低下が抑制される。なお、本明細書中における「なす角」は、交点に形成される２つの角のうち、小さいほうを指す。すなわち、最大で９０度である。 The extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are not limited to the arrangement shown in FIGS. 3A and 3B. As described above, if the extending direction of each wiring is different, the decrease in thermal conductivity in a specific expansion/contraction direction will be different. For example, when the stretchable mounting substrate expands and contracts in the X direction, the thermal conductivity of the wires extending in the X direction is greatly reduced, and the thermal conductivity of the wires extending in the Y direction is less reduced. In other words, the larger the angle formed by the stretching direction of the elastic mounting substrate and the extending direction of the wiring, the more the decrease in thermal conductivity is suppressed. In this specification, the term "angle" refers to the smaller of the two angles formed at the intersection. That is, the maximum is 90 degrees.
　したがって、第１伸縮性配線２と第２伸縮性配線４とが交差するとき、第１伸縮性配線２の熱伝導率が大きく低下するような伸縮に対しては、第２伸縮性配線４の熱伝導率の低下が抑制される。この時、第１伸縮性配線２と第２伸縮性配線４とのなす角が大きいほど、第２伸縮性配線４の熱伝導率の低下は抑制されることとなる。第２伸縮性配線４の熱伝導率が大きく低下するような伸縮に対しては、第１伸縮性配線２の熱伝導率の低下が抑制される。すなわち、第１伸縮性配線２の延伸方向と第２伸縮性配線４の延伸方向とは、少なくとも第１電子部品３の近傍において交差するように配置することで、さらに言うと平面視で第１電子部品３と重なる領域において交差するように配置することで、伸縮性実装基板１００Ａがどのような方向に伸縮したとしても、熱伝導率の低下を抑制することができる。また、第１伸縮性配線２の延伸方向と第２伸縮性配線４の延伸方向とのなす角が大きいほど好ましく、直交することがより好ましい。 Therefore, when the first stretchable wiring 2 and the second stretchable wiring 4 intersect, the heat conductivity of the first stretchable wiring 2 is greatly reduced. A decrease in thermal conductivity is suppressed. At this time, the larger the angle formed by the first elastic wiring 2 and the second elastic wiring 4, the more the decrease in the thermal conductivity of the second elastic wiring 4 is suppressed. The reduction in the thermal conductivity of the first elastic wiring 2 is suppressed against the expansion and contraction that greatly reduces the thermal conductivity of the second elastic wiring 4 . That is, the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are arranged so as to intersect at least in the vicinity of the first electronic component 3. By arranging the flexible mounting substrate 100A so as to intersect in the region overlapping with the electronic component 3, it is possible to suppress a decrease in thermal conductivity regardless of the direction in which the elastic mounting substrate 100A expands and contracts. Moreover, it is preferable that the angle between the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 is large, and it is more preferable that they are perpendicular to each other.
　また、複数の第２伸縮性配線４を備える場合、それぞれの第２伸縮性配線４の延伸方向が異なっていてもよい。そのように第２伸縮性配線４を配置することで、第２伸縮性配線４全体の熱伝導率の低下を抑制することができる。あらゆる方向への伸縮が想定される場合、複数の第２伸縮性配線４の延伸方向がそれぞれ異なっていることで、特定の方向に伸縮した場合の第２伸縮性配線４の熱伝導率の低下を抑制することができる。一方、想定される伸縮方向が一つに定まる場合、複数の第２伸縮性配線４をその方向に対して直交するように配置することが効果的である。特定の伸縮方向に対して、第２伸縮性配線４の熱伝導率の低下を大きく抑制でいるため、より熱信頼性の高い伸縮性実装基板１００Ａを提供することができる。 Also, when a plurality of second elastic wirings 4 are provided, the extending directions of the respective second elastic wirings 4 may be different. By arranging the second elastic wirings 4 in such a manner, it is possible to suppress a decrease in the thermal conductivity of the entire second elastic wirings 4 . When expansion and contraction in all directions are assumed, the extension directions of the plurality of second elastic wirings 4 are different, so that the thermal conductivity of the second elastic wiring 4 is reduced when the second elastic wiring 4 is expanded and contracted in a specific direction. can be suppressed. On the other hand, in the case where the expected expansion/contraction direction is fixed in one direction, it is effective to arrange the plurality of second elastic wirings 4 so as to be orthogonal to that direction. Since the deterioration of the thermal conductivity of the second elastic wiring 4 can be greatly suppressed in a specific expansion/contraction direction, it is possible to provide the elastic mounting substrate 100A with higher thermal reliability.
　［第１実施形態の第２変形例］
　図４Ａと図４Ｂを参照して、第１実施形態の第２変形例について説明する。第１実施形態の第２変形例に係る伸縮性実装基板１００Ｂは、第１実施形態に係る伸縮性実装基板１００と比較して第１伸縮性配線２及び第２伸縮性配線４の配置が相違する。具体的には図４Ａと図４Ｂに示したように、伸縮性基材１の厚み方向において、第２伸縮性配線４が電子部品の上側に配置されている。 [Second Modification of First Embodiment]
A second modification of the first embodiment will be described with reference to FIGS. 4A and 4B. The elastic mounting board 100B according to the second modification of the first embodiment differs from the elastic mounting board 100 according to the first embodiment in the arrangement of the first elastic wirings 2 and the second elastic wirings 4. do. Specifically, as shown in FIGS. 4A and 4B, the second stretchable wiring 4 is arranged above the electronic component in the thickness direction of the stretchable base material 1 .
　すなわち、第１実施形態と同様に、部品接続部５と第２伸縮性配線４とは、伸縮性基材１からの距離がそれぞれ異なる部分に設けられている。このように配置することで、前述したように、伸縮性実装基板１００Ｂに撓みが生じた際にも、第１電子部品３の近傍から放熱を十分に行うことができる。また、この配置は、第１電子部品３の下面側からの放熱を第１伸縮性配線２で担い、上面側からの放熱を第２伸縮性配線４で担うことができるので、高い放熱性が必要な電子部品を使う際に好適である。 That is, like the first embodiment, the component connection portion 5 and the second stretchable wiring 4 are provided at portions with different distances from the stretchable base material 1 . By arranging in this way, as described above, heat can be sufficiently dissipated from the vicinity of the first electronic component 3 even when the flexible mounting board 100B is bent. In addition, in this arrangement, the heat dissipation from the lower surface side of the first electronic component 3 can be handled by the first elastic wiring 2, and the heat dissipation from the upper surface side can be conducted by the second elastic wiring 4, so that high heat dissipation can be achieved. It is suitable when using necessary electronic parts.
　なお、伸縮性実装基板１００Ｂは図４Ａと図４Ｂのような配置に限定されない。図４Ａと図４Ｂでは、第２伸縮性配線４は、伸縮性基材１の厚み方向からみて、第１電子部品３と重なるように配置されているが、接合部１０と重なるように配置されていてもよい。また、第２伸縮性配線４の本数及び延伸方向も限定されない。 It should be noted that the flexible mounting board 100B is not limited to the arrangement shown in FIGS. 4A and 4B. 4A and 4B, the second elastic wiring 4 is arranged so as to overlap the first electronic component 3 when viewed from the thickness direction of the elastic base material 1, but is arranged so as to overlap the joint 10. may be Moreover, the number and extending direction of the second elastic wiring 4 are not limited.
　［第１実施形態の第３変形例］
　図５Ａと図５Ｂを参照して、第１実施形態の第３変形例について説明する。第１実施形態の第３変形例に係る伸縮性実装基板１００Ｃは、第１実施形態と比較して第１伸縮性配線２の構成が相違する。具体的には、図５Ａと図５Ｂに示したように、第１電子部品３の近傍における第１伸縮性配線２と第２伸縮性配線４の本数がそれぞれ相違している。 [Third Modification of First Embodiment]
A third modification of the first embodiment will be described with reference to FIGS. 5A and 5B. An elastic mounting substrate 100C according to the third modification of the first embodiment differs in the configuration of the first elastic wirings 2 from that of the first embodiment. Specifically, as shown in FIGS. 5A and 5B, the numbers of the first elastic wires 2 and the numbers of the second elastic wires 4 in the vicinity of the first electronic component 3 are different.
　図５Ａと図５Ｂに示したように、第１伸縮性配線２は第１電子部品３Ａに接続された３本の伸縮性配線によって構成され、第２伸縮性配線４は２本の伸縮性配線によって構成される。すなわち、第１絶縁層６の上側に設けられた第１伸縮性配線２の配線密度は、第１絶縁層６の下側に設けられた第２伸縮性配線４の配線密度より大きい。 As shown in FIGS. 5A and 5B, the first elastic wiring 2 is composed of three elastic wirings connected to the first electronic component 3A, and the second elastic wiring 4 is composed of two elastic wirings. Consists of That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is higher than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6 .
　伸縮性実装基板１００Ｃは、例えば、第２伸縮性配線４が内側、第１伸縮性配線２が外側となるように屈曲して使用されることが想定される。伸縮性基材１が均一な厚みの部材で構成されていた場合、伸縮性基材１の厚み方向において、屈曲時に屈曲の中心から遠いほど、伸縮量が大きくなる。すなわち、伸縮量が変化する部分が生じるため、その部分が破断の起点となる可能性がある。上記のような構成にすることで、伸縮性実装基板１００Ｃにおいて、伸縮性基材１に対してより遠い部分が伸縮しにくくなっているため、屈曲時に伸縮量が均一に近づく。したがって、屈曲時の破断を抑制することができる。 For example, it is assumed that the elastic mounting board 100C is bent so that the second elastic wiring 4 is inside and the first elastic wiring 2 is outside. When the elastic base material 1 is composed of a member having a uniform thickness, the amount of expansion and contraction increases with increasing distance from the center of bending in the thickness direction of the elastic base material 1 at the time of bending. That is, since there is a portion where the amount of expansion and contraction changes, there is a possibility that the portion will become the starting point of breakage. With the configuration as described above, the portion of the elastic mounting substrate 100C farther from the elastic base material 1 is less likely to expand and contract, so that the amount of expansion and contraction approaches uniformity during bending. Therefore, breakage during bending can be suppressed.
　なお、本明細書中における配線密度の大小は、特定領域における配線断面積の大小で比較することができる。すなわち、第１絶縁層６の上側に設けられた第１伸縮性配線２の配線密度は、第１絶縁層６の下側に設けられた第２伸縮性配４線の配線密度より大きい、とは、第１伸縮性配線２の断面積が第２伸縮性配線４の断面積より大きい、と言い換えることができる。本実施例で示したように、第１伸縮性配線２及び第２伸縮性配線４が複数である場合、それぞれの断面積の合計を比較するものとする。 It should be noted that the magnitude of the wiring density in this specification can be compared with the magnitude of the wiring cross-sectional area in a specific region. That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is higher than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6. can be rephrased that the cross-sectional area of the first elastic wiring 2 is larger than the cross-sectional area of the second elastic wiring 4 . As shown in this embodiment, when there are a plurality of first stretchable wires 2 and a plurality of second stretchable wires 4, the total cross-sectional area of each wire is compared.
　なお、第１伸縮性配線２の本数と第２伸縮性配線４の本数が同一であってもよい。その場合、それぞれの伸縮性配線の幅や厚みを変化させることで、断面積を変化させることができる。断面積を変化させる方法として、上記を組み合わせてもよい。また、配線の伸縮のしやすさは断面積の合計によって決まるため、第１伸縮性配線２及び第２伸縮性配線４に含まれる伸縮性配線１本ごとの断面積や本数の大小関係は特に限定されない。 Note that the number of the first elastic wirings 2 and the number of the second elastic wirings 4 may be the same. In that case, the cross-sectional area can be changed by changing the width and thickness of each elastic wiring. As a method for changing the cross-sectional area, the above methods may be combined. In addition, since the ease of expansion and contraction of wiring is determined by the total cross-sectional area, the cross-sectional area and the number of each elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4 are particularly related in size. Not limited.
　また、第１伸縮性配線２に含まれるそれぞれの伸縮性配線の断面積は同一であっても、異なっていてもよい。第２伸縮性配線４についても同様である。また、伸縮性基材１の厚み方向から見て第１伸縮性配線２と第２伸縮性配線４は図５Ａと図５Ｂのような配置に限定されず、一部が重なっていてもよいし、完全に重なっていてもよい。 Also, the cross-sectional area of each elastic wiring included in the first elastic wiring 2 may be the same or different. The same applies to the second stretchable wiring 4 as well. Also, the first elastic wiring 2 and the second elastic wiring 4 when viewed from the thickness direction of the elastic base material 1 are not limited to the arrangement shown in FIGS. , may overlap completely.
　また、伸縮性配線の断面積とは、伸縮性配線の延伸方向に垂直な任意の断面のことを指す。図２Ａと図２Ｂに示したように伸縮性基材１の厚み方向において、第１伸縮性配線２と第２伸縮性配線４とが重なる領域の断面積を比較することが好ましいが、第１伸縮性配線２と第２伸縮性配線４とが重ならない場合は、電子部品近傍の領域で比較することが好ましい。なお、図５Ａと図５Ｂのように、特定の断面が、第１伸縮性配線２及び第２伸縮性配線４に含まれる伸縮性配線の延伸方向に垂直な断面である場合、当該部分で比較することがより好ましい。 In addition, the cross-sectional area of the elastic wiring refers to an arbitrary cross section perpendicular to the extending direction of the elastic wiring. As shown in FIGS. 2A and 2B, it is preferable to compare the cross-sectional area of the region where the first elastic wiring 2 and the second elastic wiring 4 overlap in the thickness direction of the elastic base material 1. If the stretchable wiring 2 and the second stretchable wiring 4 do not overlap, it is preferable to compare in the vicinity of the electronic component. 5A and 5B, when the specific cross section is a cross section perpendicular to the extending direction of the elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4, the comparison is made at that part. is more preferable.
　また、第１伸縮性配線２に含まれるそれぞれの伸縮性配線の延伸方向は異なっていてもよい。その場合、それぞれの延伸方向に垂直な断面積の合計を比較する。第２伸縮性配線４についても同様である。また、第１伸縮性配線２の延伸方向と第２伸縮性配線４の延伸方向とは、少なくとも第１電子部品３の近傍において平行であることが好ましい。 Also, the extension directions of the respective elastic wirings included in the first elastic wiring 2 may be different. In that case, the sum of the cross-sectional areas perpendicular to each stretch direction is compared. The same applies to the second stretchable wiring 4 as well. Moreover, it is preferable that the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are parallel at least in the vicinity of the first electronic component 3 .
　上記のように、伸縮性基材１が、第２伸縮性配線４が内側、第１伸縮性配線２が外側となるように屈曲したとき、第１伸縮性配線２と第２伸縮性配線４を平行になるように、かつ、伸縮性基材１から遠い第１伸縮性配線２の配線密度を伸縮性基材１からより近い第２伸縮性配線４の配線密度よりも高くなるように配置することで、そのような方向への屈曲時に、電子部品近傍の伸縮量を均一に近づけることができる。 As described above, when the elastic substrate 1 is bent so that the second elastic wiring 4 is inside and the first elastic wiring 2 is outside, the first elastic wiring 2 and the second elastic wiring 4 are bent. are parallel to each other, and the wiring density of the first elastic wiring 2 farther from the elastic base material 1 is higher than the wiring density of the second elastic wiring 4 closer to the elastic base material 1. By doing so, it is possible to make the amount of expansion and contraction in the vicinity of the electronic component nearly uniform when bending in such a direction.
　第１実施形態の第１変形例と同様に、第１伸縮性配線２及び第２伸縮性配線４はそれぞれ延伸方向の異なる領域を備えていてもよい。 As in the first modification of the first embodiment, the first elastic wiring 2 and the second elastic wiring 4 may each have regions with different extending directions.
　また、図５Ａと図５Ｂのように、伸縮性基材１上に第２伸縮性配線４が設けられており、第１絶縁層６を介して第２伸縮性配線４の上側に部品接続部５が設けられているとき、第１伸縮性配線２の電流密度が第２伸縮性配線４の電流密度より大きくなるように、各配線の機能を選択することが好ましい。なお、伸縮性配線の電流密度とは、伸縮性配線に流れる電流を伸縮性配線の断面積で割った値のことである。すなわち、電流密度が大きいほど、伸縮性配線は発熱することとなる。このような構成にすることで、第２伸縮性配線４が第１伸縮性配線２と比較して熱が移動しやすくなるため、第１電子部品３から第２伸縮性配線４への放熱をより効率よく行うことができる。 Further, as shown in FIGS. 5A and 5B, the second elastic wiring 4 is provided on the elastic base material 1, and the component connection part is provided on the upper side of the second elastic wiring 4 via the first insulating layer 6. 5 is provided, it is preferable to select the function of each wire such that the current density of the first elastic wire 2 is greater than the current density of the second elastic wire 4 . The current density of the elastic wiring is a value obtained by dividing the current flowing through the elastic wiring by the cross-sectional area of the elastic wiring. That is, the higher the current density, the more heat is generated in the stretchable wiring. By adopting such a configuration, the second elastic wiring 4 is more likely to transfer heat than the first elastic wiring 2, so that the heat dissipation from the first electronic component 3 to the second elastic wiring 4 is reduced. can be done more efficiently.
　［第１実施形態の第４変形例］
　図６Ａと図６Ｂを参照して第１実施形態の第４変形例について説明する。第１実施形態の第４変形例に係る伸縮性実装基板１００Ｄは、第１実施形態に係る伸縮性実装基板１００と比較して第２伸縮性配線４の配置が相違する。具体的には、第２伸縮性配線４は、伸縮性基材１の厚み方向から見て、第１電子部品３に重ならず、部品接続部５に重なる。 [Fourth Modification of First Embodiment]
A fourth modification of the first embodiment will be described with reference to FIGS. 6A and 6B. A stretchable mounting board 100D according to the fourth modification of the first embodiment differs in arrangement of the second stretchable wirings 4 from the stretchable mounting board 100 according to the first embodiment. Specifically, the second stretchable wiring 4 does not overlap the first electronic component 3 but overlaps the component connection portion 5 when viewed from the thickness direction of the stretchable base material 1 .
　前述したように、第２伸縮性配線４と第１電子部品３との距離が近いほど、第１電子部品３からの放熱を効率よく行うことができる。したがって、放熱性の観点においては、第１電子部品３の近傍において伸縮性放熱部材の面積は大きいほうが好ましく、伸縮性基材１の厚み方向から見て、伸縮性放熱部材が第１電子部品３の全体に重なることがより好ましい。しかし、伸縮性放熱部材の面積を増加させると、伸縮性実装基板１００Ｄの伸縮性能を低下させることとなる。 As described above, the closer the distance between the second elastic wiring 4 and the first electronic component 3 is, the more efficiently the first electronic component 3 can dissipate heat. Therefore, from the viewpoint of heat dissipation, it is preferable that the area of the elastic heat dissipation member in the vicinity of the first electronic component 3 is large. It is more preferable to overlap the whole of. However, increasing the area of the stretchable heat-dissipating member reduces the stretchability of the stretchable mounting substrate 100D.
　すなわち、伸縮性実装基板１００Ｄの伸縮性能の低下を抑制しつつ、第１電子部品３からの放熱性能を高めるためには、伸縮性基材１の厚み方向から見て、第１電子部品３のうち、最も放熱させたい部分と第２伸縮性配線４とが重なるように配置することが好ましい。図６Ａと図６Ｂのように配置することで、第１電子部品３のうち、部品接続部５に近い領域から効率よく放熱することができる。 That is, in order to improve the heat radiation performance from the first electronic component 3 while suppressing the deterioration of the stretchability of the stretchable mounting substrate 100D, the first electronic component 3 is Among them, it is preferable to place the second stretchable wiring 4 so that the portion to be most heat-dissipated and the second stretchable wiring 4 overlap. By arranging them as shown in FIGS. 6A and 6B, it is possible to efficiently dissipate heat from a region of the first electronic component 3 near the component connection portion 5 .
　第２伸縮性配線４は図６Ａと図６Ｂのような配置に限定されない。図６Ａと図６Ｂでは、伸縮性基材１の厚み方向から見て、全ての部品接続部５と重なるように第２伸縮性配線４が配置されているが、少なくとも１つの部品接続部５と重なっていればよい。また、第２伸縮性配線４の延伸方向は、図６Ａと図６Ｂのように第１伸縮性配線２の延伸方向と直交していなくてもよい。 The second elastic wiring 4 is not limited to the arrangement as shown in FIGS. 6A and 6B. 6A and 6B, the second elastic wiring 4 is arranged so as to overlap all the component connection portions 5 when viewed from the thickness direction of the elastic base material 1, but at least one component connection portion 5 and It's okay if they overlap. Also, the extending direction of the second elastic wiring 4 does not have to be orthogonal to the extending direction of the first elastic wiring 2 as shown in FIGS. 6A and 6B.
［第１実施形態の第５変形例］
　図７を参照して第１実施形態の第５変形例について説明する。第１実施形態の第５変形例に係る伸縮性実装基板１００Ｅは、第１実施形態に係る伸縮性実装基板１００と比較して第２伸縮性配線４の配置が相違する。具体的には、第２伸縮性配線４は、伸縮性基材１の厚み方向から見て、部品接続部５に重ならず、第１電子部品３に重なる。 [Fifth Modification of First Embodiment]
A fifth modification of the first embodiment will be described with reference to FIG. The stretchable mounting board 100E according to the fifth modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wirings 4 . Specifically, when viewed from the thickness direction of the elastic base material 1 , the second elastic wiring 4 does not overlap the component connection portion 5 but overlaps the first electronic component 3 .
　上述したように、第１電子部品３と第２伸縮性配線４の距離が近いほど、効率よく放熱を行うことができる。第２伸縮性配線４を上記のように配置することで、第１電子部品３のうち、中央部から効率よく放熱することができる。一般に、電子部品の発熱時には部品中央部から最も発熱することが多い。したがって、図７のように配置することで、第２伸縮性配線４の面積の増加を抑制しながら第１電子部品３からの放熱を、より効率的に行うことができる。 As described above, the closer the distance between the first electronic component 3 and the second elastic wiring 4 is, the more efficiently heat can be dissipated. By arranging the second stretchable wiring 4 as described above, heat can be efficiently dissipated from the central portion of the first electronic component 3 . In general, when an electronic component generates heat, most of the heat is generated from the central portion of the component. Therefore, by arranging them as shown in FIG. 7 , it is possible to more efficiently radiate heat from the first electronic component 3 while suppressing an increase in the area of the second stretchable wiring 4 .
　なお、第２伸縮性配線４は図７のような配置に限定されない。例えば、第２伸縮性配線４の延伸方向と第１伸縮性配線２の延伸方向とが、直交するように配置されていてもよい。また、第２伸縮性配線４に含まれる伸縮性配線の本数は特に限定されない。 It should be noted that the second elastic wiring 4 is not limited to the arrangement shown in FIG. For example, the extending direction of the second elastic wiring 4 and the extending direction of the first elastic wiring 2 may be arranged so as to be perpendicular to each other. Further, the number of elastic wirings included in the second elastic wiring 4 is not particularly limited.
　［第１実施形態の第６変形例］
　図８を参照して第１実施形態の第６変形例について説明する。第１実施形態の第６変形例に係る伸縮性実装基板１００Ｆは、第１実施形態に係る伸縮性実装基板１００と比較して第１伸縮性配線２及び第２伸縮性配線４の配置が相違する。具体的には、第１伸縮性配線２は、第１電子部品３との接続を境に延伸方向が異なっており、第２伸縮性配線４は、第１伸縮性配線２と同様に延伸方向が変化している。なお、図８では明確化のため第１電子部品３Ｂのうち、第１伸縮性配線２と接続されている電極１３のみを図示している。 [Sixth Modification of First Embodiment]
A sixth modification of the first embodiment will be described with reference to FIG. The stretchable mounting board 100F according to the sixth modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wirings 2 and the second stretchable wirings 4. do. Specifically, the first elastic wiring 2 has a different extending direction across the connection with the first electronic component 3, and the second elastic wiring 4 extends in the same direction as the first elastic wiring 2. is changing. For clarity, FIG. 8 shows only the electrodes 13 connected to the first elastic wirings 2 of the first electronic component 3B.
　図８に示したように、第１伸縮配線２は第１電子部品３Ｂを挟んで延伸方向が変化していてもよい。つまり、第１電子部品の配置や形状に最適な形に、第１伸縮性配線２の引き回し方向を変化させることができる。同様に、第２伸縮性配線４の延伸方向を第１伸縮性配線２と延伸方向が一致するように変化させてもよい。 As shown in FIG. 8, the extending direction of the first stretchable wiring 2 may change across the first electronic component 3B. That is, it is possible to change the routing direction of the first stretchable wiring 2 to the optimum shape for the arrangement and shape of the first electronic component. Similarly, the extending direction of the second elastic wiring 4 may be changed so as to match the extending direction of the first elastic wiring 2 .
　第１実施形態の第６変形例は、図８のような配置に限定されない。例えば第２伸縮性配線４が部品近傍で一方向に延伸していてもよい。伸縮性基材１の厚み方向から見て、第１伸縮性配線２と第２伸縮性配線４が重なるように配置してもよい。 The sixth modification of the first embodiment is not limited to the arrangement shown in FIG. For example, the second stretchable wiring 4 may extend in one direction near the component. The first elastic wiring 2 and the second elastic wiring 4 may be arranged so as to overlap when viewed from the thickness direction of the elastic base material 1 .
　図８に示したように、第１伸縮性配線２が第１電子部品３の近傍で複数の方向に延伸している場合、第２伸縮性配線４は、伸縮性基材１の厚み方向から見て第１電子部品３又は部品接続部５と重なる領域において、第１伸縮性配線２が延伸するいずれの方向とも異なる方向に延伸することが好ましい。そのように配置することで、第１伸縮性配線２の熱伝導率が低下するような伸縮が生じた際に、第２伸縮性配線４の熱伝導率の低下を抑制することができる。 As shown in FIG. 8, when the first stretchable wiring 2 extends in a plurality of directions near the first electronic component 3, the second stretchable wiring 4 extends from the thickness direction of the stretchable base material 1. In a region that overlaps with the first electronic component 3 or the component connection portion 5 when viewed, it is preferable that the first elastic wiring 2 extends in a direction different from any direction in which the first elastic wiring 2 extends. By arranging them in such a manner, it is possible to suppress a decrease in the thermal conductivity of the second elastic wiring 4 when the first elastic wiring 2 expands and contracts such that the thermal conductivity of the first elastic wiring 2 decreases.
　［第２実施形態］
　図９を参照して第２実施形態について説明する。第２実施形態に係る伸縮性実装基板１０１は、第１実施形態に係る伸縮性実装基板１００と比較して、第２絶縁層７をさらに備える。 [Second embodiment]
A second embodiment will be described with reference to FIG. The stretchable mounting board 101 according to the second embodiment further includes a second insulating layer 7 compared to the stretchable mounting board 100 according to the first embodiment.
　伸縮性基材１の厚み方向から見て、前記第２伸縮性配線４と前記第１電子部品又は前記部品接続部とが重なる領域において、第２伸縮性配線４と伸縮性基材１との間に、第２絶縁層７をさらに備える。このように第２絶縁層７を配置することで、伸縮性実装基板１０１の屈曲時の第２伸縮性配線４の伸縮を低減し、第２伸縮性配線４の熱伝導率の低下を抑制することができる。 When viewed from the thickness direction of the stretchable base material 1, the second stretchable wiring line 4 and the stretchable base material 1 overlap in the region where the second stretchable wiring line 4 overlaps the first electronic component or the component connecting portion. A second insulating layer 7 is further provided in between. By arranging the second insulating layer 7 in this way, expansion and contraction of the second elastic wiring 4 when the elastic mounting substrate 101 is bent is reduced, and a decrease in thermal conductivity of the second elastic wiring 4 is suppressed. be able to.
　第２絶縁層７は、樹脂材料、又は、樹脂材料及び無機材料からなる混合物であることが好ましく、樹脂材料として例えば、ウレタン系、スチレン系、オレフィン系、シリコーン系、フッ素系、ニトリルゴム、ラテックスゴム、塩化ビニル、エステル系、アミド系等のエラストマー系樹脂、エポキシ、フェノール、アクリル、ポリエステル、イミド系、ロジン、セルロース、ポリエチレンテレフタレート系、ポリエチレンナフタレート系、ポリカーボネート系樹脂が挙げられる。 The second insulating layer 7 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Rubber, vinyl chloride, ester-based, amide-based elastomer resins, epoxy, phenol, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins can be used.
　第２絶縁層７は、第１絶縁層６と同一の部材であってもよいし、異なっていてもよい。また、第２絶縁層７と第１絶縁層６とか同一の部材である場合、両者が一体となっていてもよい。 The second insulating layer 7 may be the same member as the first insulating layer 6, or may be different. Moreover, when the second insulating layer 7 and the first insulating layer 6 are the same member, both may be integrated.
　第２絶縁層７が、伸縮性基材１の厚み方向から見て、第２伸縮性配線４と第１電子部品又は部品接続部とが重なる領域において、第２伸縮性配線４と伸縮性基材１との間に配置されることで、第２伸縮性配線４の伸縮性基材１の厚み方向における位置を調整することができる。伸縮性実装基板１０１が上下方向に撓み、振動した際、厚み方向の位置によって変位が大きい部分と小さい部分がある。具体的には、変位量が最も大きい部分が振動における腹、最も小さい部分が振動における節に相当する。すなわち、第２絶縁層７を配置することで、第２伸縮性配線４を厚み方向において最も変位量の少ない部分に近づけることができる。 In the region where the second insulating layer 7 overlaps the second elastic wiring 4 and the first electronic component or the component connecting portion when viewed from the thickness direction of the elastic base material 1, the second elastic wiring 4 and the elastic group are formed. The position of the second elastic wiring 4 in the thickness direction of the elastic base material 1 can be adjusted by being arranged between the material 1 and the elastic base material 1 . When the stretchable mounting substrate 101 bends in the vertical direction and vibrates, there are portions where the displacement is large and portions where the displacement is small depending on the position in the thickness direction. Specifically, the portion with the largest amount of displacement corresponds to an antinode in vibration, and the portion with the smallest amount of displacement corresponds to a node in vibration. That is, by arranging the second insulating layer 7, the second stretchable wiring 4 can be brought closer to the portion where the amount of displacement is the smallest in the thickness direction.
　なお、この場合の最も変位量が少ない位置は単なる厚みの中央に限定されず、各構成要素のヤング率などによって変化する。第２絶縁層７は、第２伸縮性配線４全体と伸縮性基材１との間に配置されていてもよい。また図９に示すように、第２絶縁層７の一部が、伸縮性基材１と第１伸縮性配線２との間に配置されていてもよい。また、第２絶縁層７は、伸縮性基材１の全体に配置されていてもよい。 It should be noted that the position where the amount of displacement is the smallest in this case is not limited to the mere center of the thickness, but changes depending on the Young's modulus of each component. The second insulating layer 7 may be arranged between the entire second stretchable wiring 4 and the stretchable base material 1 . Also, as shown in FIG. 9 , a portion of the second insulating layer 7 may be arranged between the stretchable base material 1 and the first stretchable wiring 2 . Moreover, the second insulating layer 7 may be arranged on the entire stretchable base material 1 .
　［第３実施形態］
　図１０Ａと図１０Ｂを参照して第３実施形態について説明する。第３実施形態に係る伸縮性実装基板１０２は、第１実施形態に係る伸縮性実装基板１００と比較して、封止層８をさらに備える。なお、図１０Ａの上面図では、封止層８の内部にある第１絶縁層６の図示を省略し、また、封止層８をハッチングにて示している。第１絶縁層６は、図１０Ｂに示すように、封止層８の内部にのみ配置されていてもいいし、封止層８の外部に延設されていて第１伸縮性配線２全体を覆っていてもいい。 [Third embodiment]
A third embodiment will be described with reference to FIGS. 10A and 10B. The stretchable mounting substrate 102 according to the third embodiment further includes a sealing layer 8 compared to the stretchable mounting substrate 100 according to the first embodiment. In the top view of FIG. 10A, illustration of the first insulating layer 6 inside the sealing layer 8 is omitted, and the sealing layer 8 is indicated by hatching. The first insulating layer 6 may be arranged only inside the sealing layer 8 as shown in FIG. You can cover it.
　封止層８は第１電子部品３を封止して、第１電子部品３を外力から保護する。封止層８の構成材料は特に限定されないが、例えば、ポリ塩化ビニル、ポリエチレン、ポリスチレン、ポリカーボネート、ポリフッ化ビニリデン、ポリイミド、液晶ポリマー、ポリテトラフルオロエチレン、フェノール樹脂、エポキシ系樹脂、ウレタン系樹脂、アクリル系樹脂、シリコーン系樹脂、スチレン・ブタジエン系樹脂等のエラストマー系樹脂、等が挙げられる。 The sealing layer 8 seals the first electronic component 3 and protects the first electronic component 3 from external forces. The constituent material of the sealing layer 8 is not particularly limited, but examples include polyvinyl chloride, polyethylene, polystyrene, polycarbonate, polyvinylidene fluoride, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenol resin, epoxy resin, urethane resin, Examples include acrylic resins, silicone resins, elastomer resins such as styrene/butadiene resins, and the like.
　封止層８を設けることで、第１電子部品３を外力から保護することができる一方で、部品近傍からの熱の拡散を抑制してしまう。封止層８を設ける場合、伸縮性基材１の厚み方向において、封止層８と一部が重なるように第２伸縮性配線４を設け、かつ、第２伸縮性配線４を封止層８の外側に引き回すことで、第１電子部品３から放熱することができる。 By providing the sealing layer 8, it is possible to protect the first electronic component 3 from external forces, while suppressing the diffusion of heat from the vicinity of the component. When the sealing layer 8 is provided, the second elastic wiring 4 is provided so as to partially overlap the sealing layer 8 in the thickness direction of the elastic base material 1, and the second elastic wiring 4 is provided in the sealing layer. Heat can be dissipated from the first electronic component 3 by routing it to the outside of 8 .
　すなわち、第３実施形態に係る伸縮性実装基板１０２は、伸縮性基材１と、伸縮性基材１に設けられた第１伸縮性配線２と、伸縮性基材１に搭載され、第１伸縮性配線２に接続された第１電子部品３と、伸縮性基材１に設けられた第２伸縮性配線４と、第１電子部品３を封止する封止層８と、を備え、第１伸縮性配線２は、第１電子部品３に接続される部品接続部５を有し、第２伸縮性配線４は、伸縮性基材１の厚み方向から見て、その一部が、封止層８と重なる。なお、第２伸縮性配線４が本開示における伸縮性放熱部材に相当する。 That is, the stretchable mounting substrate 102 according to the third embodiment includes the stretchable substrate 1, the first stretchable wiring 2 provided on the stretchable substrate 1, and the stretchable substrate 1. A first electronic component 3 connected to the elastic wiring 2, a second elastic wiring 4 provided on the elastic base material 1, and a sealing layer 8 for sealing the first electronic component 3, The first elastic wiring 2 has a component connection portion 5 connected to the first electronic component 3, and the second elastic wiring 4 has a part of It overlaps with the sealing layer 8 . The second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.
　上記のような構造にすることで、第２伸縮性配線４のうち、伸縮性基材１の厚み方向から見て、封止層８と重なる領域に封止層８内部の熱が移動し、さらに第２伸縮性配線４の残りの領域、つまり封止層８の外側領域に拡散されることで、封止層８内にこもった熱を逃がすことができる。 With the structure as described above, the heat inside the sealing layer 8 moves to the region of the second elastic wiring 4 that overlaps with the sealing layer 8 when viewed from the thickness direction of the elastic base material 1, Furthermore, the heat trapped in the sealing layer 8 can be released by being diffused to the remaining region of the second elastic wiring 4, that is, the outer region of the sealing layer 8. FIG.
　なお、封止層８の大きさは第１電子部品３より大きければよい。また、形状も特に限定されず、伸縮性基材１の厚み方向からみて、矩形状であってもよいし円形状であってもよい。 The size of the sealing layer 8 should be larger than that of the first electronic component 3 . Also, the shape is not particularly limited, and may be rectangular or circular when viewed from the thickness direction of the elastic base material 1 .
　また、図１０Ａと図１０Ｂに示すように、第２伸縮性配線４の一部が封止層８の内部に配置されている。第２伸縮性配線４を封止層８の内部に配置することで、伸縮性基材１の厚み方向から見た、第１電子部品３と第２伸縮性配線４との距離を近づけることができる。すなわち、封止層８からの放熱をより効率よく行うことができる。
なお、図１０Ａと図１０Ｂでは、第２伸縮性配線４が封止層８の内部に配置され、第１伸縮性配線２は封止層８と伸縮性基材１との界面に配置されている。 Also, as shown in FIGS. 10A and 10B, part of the second elastic wiring 4 is arranged inside the sealing layer 8 . By arranging the second stretchable wiring 4 inside the sealing layer 8, the distance between the first electronic component 3 and the second stretchable wiring 4 when viewed from the thickness direction of the stretchable base material 1 can be shortened. can. That is, it is possible to radiate heat from the sealing layer 8 more efficiently.
10A and 10B, the second elastic wiring 4 is arranged inside the sealing layer 8, and the first elastic wiring 2 is arranged at the interface between the sealing layer 8 and the elastic base material 1. there is
　なお、第２伸縮性配線４は図１０Ａと図１０Ｂのような配置に限定されず、例えば、第１実施形態のように、第１伸縮性配線２の下側に配置されていてもよい。また、第２伸縮性配線４は第１電子部品３の近傍に配置されていることが好ましい。また、第１電子部品、第１伸縮性配線、第２伸縮性配線、第１絶縁層の配置等は、第１実施形態と同様の態様をとることができる。 The second elastic wiring 4 is not limited to the arrangement shown in FIGS. 10A and 10B, and may be arranged below the first elastic wiring 2 as in the first embodiment, for example. Moreover, it is preferable that the second stretchable wiring 4 is arranged in the vicinity of the first electronic component 3 . Also, the arrangement of the first electronic component, the first stretchable wiring, the second stretchable wiring, the first insulating layer, etc. can be the same as in the first embodiment.
　［第３実施形態の第１変形例］
　図１１を参照して第３実施形態の第１変形例について説明する。第３実施形態の第１変形例に係る伸縮性実装基板１０２Ａは、第３実施形態に係る伸縮性実装基板１０２と比較して、第２伸縮性配線４の配置が相違する。 [First Modification of Third Embodiment]
A first modification of the third embodiment will be described with reference to FIG. An elastic mounting board 102A according to the first modification of the third embodiment differs in arrangement of the second elastic wirings 4 from the elastic mounting board 102 according to the third embodiment.
　図１１に示すように、第１伸縮性配線２の延伸方向と第２伸縮性配線４の延伸方向とが平行であってもよい。第２伸縮性配線４は、伸縮性基材１の厚み方向から見て、第１電子部品３と重なるように設けられている。図１１では、第１絶縁層６の図示を省略しているが、第１実施形態と同様、第１絶縁層を第１伸縮性配線と第２伸縮性配線との間に配置することで、第１絶縁層６によって第１伸縮性配線と第２伸縮性配線との短絡を抑制できるため、伸縮性基材１の厚み方向における第１電子部品３と第２伸縮性配線４との距離を近づけることができる。すなわち、効率よく放熱を行うことができる。 As shown in FIG. 11, the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 may be parallel. The second stretchable wiring 4 is provided so as to overlap the first electronic component 3 when viewed from the thickness direction of the stretchable base material 1 . Although illustration of the first insulating layer 6 is omitted in FIG. 11, as in the first embodiment, by arranging the first insulating layer between the first elastic wiring and the second elastic wiring, Since short-circuiting between the first elastic wiring and the second elastic wiring can be suppressed by the first insulating layer 6, the distance between the first electronic component 3 and the second elastic wiring 4 in the thickness direction of the elastic base material 1 is can get closer. That is, heat can be efficiently dissipated.
　なお、第１伸縮性配線２及び第２伸縮性配線４の配置は図１０Ａと図１０Ｂのような配置に限定されない。第１実施形態の各変形例として示した配置にすることで、前述した効果を奏することができる。 The arrangement of the first elastic wiring 2 and the second elastic wiring 4 is not limited to the arrangement shown in FIGS. 10A and 10B. By using the arrangement shown as each modification of the first embodiment, the effects described above can be obtained.
　［第４実施形態］
　図１２Ａと図１２Ｂを参照して第４実施形態について説明する。第４実施形態に係る伸縮性実装基板１０３は、第１実施形態に係る伸縮性実装基板１００と比較して、第２電子部品９を備える点で相違する。なお、図１２Ａと図１２Ｂの説明では明確化のため、第１伸縮性配線及び第２伸縮性配線の各部分に異なる符号をつけて説明するが、異なる伸縮性配線であることを示すものではない。具体的には、第３実施形態までの説明では、電子部品に接続された前後でも同一の符号をつけていたが、第４実施形態では異なる符号をつけて説明する。また、第３実施形態までの説明では第１伸縮性配線２又は第２伸縮性配線４が複数の場合、全て同じ符号をつけていたが、第４実施形態では異なる符号をつけて説明する。 [Fourth embodiment]
A fourth embodiment will be described with reference to FIGS. 12A and 12B. A stretchable mounting board 103 according to the fourth embodiment differs from the stretchable mounting board 100 according to the first embodiment in that it includes a second electronic component 9 . In the description of FIGS. 12A and 12B, different reference numerals are assigned to the respective parts of the first elastic wiring and the second elastic wiring for clarity, but this does not indicate that they are different elastic wiring. do not have. Specifically, in the description up to the third embodiment, the same reference numerals are used even before and after being connected to the electronic component, but different reference numerals are used in the description of the fourth embodiment. Also, in the description up to the third embodiment, when there are a plurality of the first stretchable wirings 2 or the second stretchable wirings 4, all of them are given the same reference numerals.
　伸縮性実装基板１０３は第２電子部品９をさらに備える。なお、第２電子部品９は第２伸縮性配線４に接続されている。第２電子部品９は封止層８によって封止されている。第２電子部品９の具体的な例として、加速度センサ、温度センサなどが挙げられる。第２電子部品９は特に限定されず、増幅器（オペアンプ、トランジスタ等）、チップコンデンサ、チップ抵抗、ＬＥＤ、半導体ＩＣ、チップインダクタなどであってもよい。また、第１電子部品３Ｂ及び３Ｃと同じ部品であってもよいし、異なっていてもよい。また、第１電子部品３Ｂ及び３Ｃと同様に、第２電子部品９は能動素子であることが好ましいが、受動素子であってもよい。 The stretchable mounting board 103 further includes a second electronic component 9 . In addition, the second electronic component 9 is connected to the second stretchable wiring 4 . The second electronic component 9 is sealed with a sealing layer 8 . Specific examples of the second electronic component 9 include an acceleration sensor and a temperature sensor. The second electronic component 9 is not particularly limited, and may be an amplifier (operational amplifier, transistor, etc.), chip capacitor, chip resistor, LED, semiconductor IC, chip inductor, or the like. In addition, they may be the same components as the first electronic components 3B and 3C, or they may be different. Also, like the first electronic components 3B and 3C, the second electronic component 9 is preferably an active element, but may be a passive element.
　図１２Ａの上面図に示すように、第１伸縮性配線２Ａ及び２Ｂは第１電子部品３Ｂ及び３Ｃに接続され、第２伸縮性配線４Ａ、４Ｂ、４Ｃ及び４Ｄは第２電子部品９に接続されている。図１２Ｂの断面図に示すように、第２伸縮性配線４Ａ及び４Ｂは第１電子部品３Ｂの伸縮性放熱部材として機能する。同様に、第２伸縮性配線４Ｃ及び４Ｄは第１電子部品３Ｃの伸縮性放熱部材として機能する。また、第１電子部品３Ｂの実装領域をＺ１で示し、第１電子部品３Ｃの実装領域をＺ２で示す。なお、このように第１電子部品を複数備える場合、各第１電子部品に共通の第２伸縮性配線４を配置してもよいし、各第１電子部品のそれぞれに異なる第２伸縮性配線４を設けてもよい。あるいは、複数の第１電子部品の各々に、配線パターンや放熱パターンなどの異なる機能を持つ伸縮性放熱部材を設けてもよい。なお、第４実施形態以外の実施形態においても、複数の第１電子部品３を備えていてもよいことは言うまでもない。 As shown in the top view of FIG. 12A, the first elastic wires 2A and 2B are connected to the first electronic components 3B and 3C, and the second elastic wires 4A, 4B, 4C and 4D are connected to the second electronic component 9. It is As shown in the cross-sectional view of FIG. 12B, the second stretchable wirings 4A and 4B function as stretchable heat dissipation members for the first electronic component 3B. Similarly, the second stretchable wirings 4C and 4D function as stretchable heat dissipation members for the first electronic component 3C. Z1 indicates the mounting area for the first electronic component 3B, and Z2 indicates the mounting area for the first electronic component 3C. In addition, when a plurality of first electronic components are provided in this manner, the second elastic wiring 4 common to each first electronic component may be arranged, or a different second elastic wiring may be provided for each first electronic component. 4 may be provided. Alternatively, each of the plurality of first electronic components may be provided with a stretchable heat-dissipating member having different functions such as a wiring pattern and a heat-dissipating pattern. It goes without saying that a plurality of first electronic components 3 may also be provided in embodiments other than the fourth embodiment.
　一方、第２伸縮性配線４が接続される第２電子部品９についても、使用時に発熱することがある。すなわち、第２電子部品９についても放熱を行う必要があるが、第２伸縮性配線４は第１電子部品３Ｂ及び３Ｃにおける第１伸縮性配線２に相当するため、放熱が不十分となる虞がある。 On the other hand, the second electronic component 9 to which the second elastic wiring 4 is connected may also generate heat during use. In other words, although the second electronic component 9 also needs to dissipate heat, the second stretchable wiring 4 corresponds to the first stretchable wiring 2 in the first electronic components 3B and 3C, so there is a risk of insufficient heat dissipation. There is
　このような場合、図１２Ａと図１２Ｂに示すように、第２電子部品９の近傍に第１伸縮性配線２Ｂを配置することで、第１伸縮性配線２Ｂが第２電子部品９の放熱部材として機能する。具体的には、図１２Ａと図１２Ｂに示すように、伸縮性基材１の厚み方向から見て、第１伸縮性配線２Ｂの一部が第２電子部品９を封止する封止層８に重なっている。 In such a case, as shown in FIGS. 12A and 12B, by arranging the first elastic wiring 2B in the vicinity of the second electronic component 9, the first elastic wiring 2B serves as a heat dissipation member of the second electronic component 9. function as Specifically, as shown in FIGS. 12A and 12B, a part of the first elastic wiring 2B is a sealing layer 8 that seals the second electronic component 9 when viewed from the thickness direction of the elastic base material 1. overlaps with
　すなわち、ある電子部品に接続される配線を、その他の電子部品に対する放熱部材として機能させることができる。なお、第１電子部品３及び第２電子部品９が複数であってもよいし、第１伸縮性配線２及び第２伸縮性配線４以外の伸縮性配線を備えていてもよい。また、図１２Ａと図１２Ｂで示したように、第１電子部品３と第２電子部品９が十分近いことが好ましい。前述したように、より確実にそれぞれの伸縮性配線が、もう一方に接続される電子部品の放熱部材として機能する。なお、第１電子部品３Ｂ及び３Ｃと第２電子部品９とが離れていたとしても、第２電子部品９を、第１電子部品３Ｂ及び３Ｃより発熱量の少ないものとすることで、第２伸縮性配線４の電流密度を調整することができる。すなわち、前述したように第１電子部品３Ｂ及び３Ｃからの放熱をより効率的に行うことができる。 That is, wiring connected to a certain electronic component can function as a heat dissipation member for other electronic components. A plurality of first electronic components 3 and second electronic components 9 may be provided, and elastic wirings other than the first elastic wirings 2 and the second elastic wirings 4 may be provided. Also, as shown in FIGS. 12A and 12B, it is preferable that the first electronic component 3 and the second electronic component 9 are sufficiently close to each other. As described above, each stretchable wiring more reliably functions as a heat dissipation member for the electronic component connected to the other. Even if the first electronic components 3B and 3C and the second electronic component 9 are separated from each other, by making the second electronic component 9 less calorific than the first electronic components 3B and 3C, the second electronic component The current density of the elastic wiring 4 can be adjusted. That is, as described above, it is possible to more efficiently radiate heat from the first electronic components 3B and 3C.
　第４実施形態の説明について、第１実施形態と第３実施形態の組み合わせを用いて説明したが、複数の第１実施形態が組み合わされていても、複数の第２実施形態が組み合わされていてもよい。 The explanation of the fourth embodiment has been made using a combination of the first embodiment and the third embodiment. good too.
１：伸縮性基材
２、２Ａ、２Ｂ：第１伸縮性配線
３、３Ａ、３Ｂ、３Ｃ、３Ｄ：第１電子部品
４、４Ａ、４Ｂ、４Ｃ，４Ｄ：第２伸縮性配線（伸縮性放熱部材）
５：部品接続部
６：第１絶縁層
７：第２絶縁層
８：封止層
９：第２電子部品
１０：接続部
１１Ａ、１１Ｂ：電子部品
１２：コネクタ
１００、１００Ａ、１００Ｂ、１００Ｃ、１００Ｄ、１００Ｅ、１００Ｆ、１０１、１０２、１０２Ａ，１０３：伸縮性実装基板
Ｚ、Ｚ１、Ｚ２：実装領域 1: Elastic base material 2, 2A, 2B: First elastic wiring 3, 3A, 3B, 3C, 3D: First electronic component 4, 4A, 4B, 4C, 4D: Second elastic wiring (elastic heat dissipation Element)
5: Component connection portion 6: First insulating layer 7: Second insulating layer 8: Sealing layer 9: Second electronic component 10: Connection portions 11A, 11B: Electronic component 12: Connectors 100, 100A, 100B, 100C, 100D , 100E, 100F, 101, 102, 102A, 103: elastic mounting substrates Z, Z1, Z2: mounting area

Claims (20)

  1. 　伸縮性基材と、
    　前記伸縮性基材に設けられた第１伸縮性配線と、
    　前記伸縮性基材に搭載され、前記第１伸縮性配線に接続された第１電子部品と、
    　前記伸縮性基材に設けられた伸縮性放熱部材と、を備え、
    　前記第１伸縮性配線は、前記第１電子部品に接続される部品接続部を有し、
    　前記伸縮性放熱部材は、前記伸縮性基材の厚み方向から見て、その一部が、前記第１電子部品又は前記部品接続部と重なる、
    　伸縮性実装基板。     a stretchable base material;
    a first stretchable wiring provided on the stretchable base;
    a first electronic component mounted on the stretchable base material and connected to the first stretchable wiring;
    and a stretchable heat dissipation member provided on the stretchable base material,
    The first elastic wiring has a component connection portion connected to the first electronic component,
    A part of the stretchable heat dissipation member overlaps the first electronic component or the component connecting portion when viewed from the thickness direction of the stretchable base material.
    Stretchable mounting substrate.
  2. 　前記伸縮性基材の厚み方向において、前記第１電子部品と前記伸縮性放熱部材との間に、第１絶縁層が配置される、
    　請求項１に記載の伸縮性実装基板。     A first insulating layer is disposed between the first electronic component and the elastic heat dissipation member in the thickness direction of the elastic base material,
    The stretchable mounting substrate according to claim 1.
  3. 　前記伸縮性放熱部材は第２伸縮性配線である、
    　請求項１又は２に記載の伸縮性実装基板。     The elastic heat dissipation member is a second elastic wiring,
    The stretchable mounting substrate according to claim 1 or 2.
  4. 　前記部品接続部と前記第２伸縮性配線とは、前記伸縮性基材からの距離がそれぞれ異なる部分に設けられている、
    　請求項３に記載の伸縮性実装基板。     The component connection portion and the second stretchable wiring are provided at different distances from the stretchable base material,
    The stretchable mounting substrate according to claim 3.
  5. 　前記伸縮性基材上に前記第２伸縮性配線が設けられており、前記第１絶縁層を介して前記第２伸縮性配線の上側に前記部品接続部が設けられている、
    　請求項４に記載の伸縮性実装基板。     The second elastic wiring is provided on the elastic base material, and the component connection part is provided above the second elastic wiring via the first insulating layer,
    The stretchable mounting substrate according to claim 4.
  6. 　前記第１絶縁層の上側に設けられた前記第１伸縮性配線の配線密度は、前記第１絶縁層の下側に設けられた前記第２伸縮性配線の配線密度より大きい、
    　請求項５に記載の伸縮性実装基板。     The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is higher than the wiring density of the second elastic wiring provided on the lower side of the first insulating layer,
    The stretchable mounting substrate according to claim 5.
  7. 　前記第１伸縮性配線の延伸方向と前記第２伸縮性配線の延伸方向とは、少なくとも前記第１電子部品の近傍において平行である、
    　請求項４から６のいずれか一つに記載の伸縮性実装基板。     The extending direction of the first elastic wiring and the extending direction of the second elastic wiring are parallel at least in the vicinity of the first electronic component,
    The stretchable mounting substrate according to any one of claims 4 to 6.
  8. 　前記第１伸縮性配線の延伸方向と前記第２伸縮性配線の延伸方向とは、少なくとも前記第１電子部品の近傍において交差する、
    　請求項４から６のいずれか一つに記載の伸縮性実装基板。     The extending direction of the first elastic wiring and the extending direction of the second elastic wiring intersect at least in the vicinity of the first electronic component,
    The stretchable mounting substrate according to any one of claims 4 to 6.
  9. 　前記伸縮性基材の厚み方向から見て、前記第２伸縮性配線と前記第１電子部品又は前記部品接続部とが重なる領域において、前記第２伸縮性配線と前記伸縮性基材との間に、第２絶縁層をさらに備える、
    　請求項４から８のいずれか一つに記載の伸縮性実装基板。     Between the second stretchable wiring and the stretchable base in a region where the second stretchable wiring and the first electronic component or the component connecting portion overlap when viewed from the thickness direction of the stretchable base. further comprising a second insulating layer,
    The stretchable mounting substrate according to any one of claims 4 to 8.
  10. 　第２電子部品をさらに備え、
    　前記第２伸縮性配線は前記第２電子部品に接続される、
    　請求項４から９のいずれか一つに記載の伸縮性実装基板。     further comprising a second electronic component,
    The second stretchable wiring is connected to the second electronic component,
    The stretchable mounting board according to any one of claims 4 to 9.
  11. 　伸縮性基材と、
    　前記伸縮性基材に設けられた第１伸縮性配線と、
    　前記伸縮性基材に搭載され、前記第１伸縮性配線に接続された第１電子部品と、
    　前記伸縮性基材に設けられた伸縮性放熱部材と、
    　前記電子部品を封止する封止層と、を備え、
    　前記第１伸縮性配線は、前記電子部品に接続される部品接続部を有し、
    　前記伸縮性放熱部材は、前記伸縮性基材の厚み方向から見て、その一部が、前記封止層と重なる、
    　伸縮性実装基板。     a stretchable base material;
    a first stretchable wiring provided on the stretchable base;
    a first electronic component mounted on the stretchable base material and connected to the first stretchable wiring;
    A stretchable heat dissipation member provided on the stretchable base material;
    and a sealing layer that seals the electronic component,
    The first elastic wiring has a component connection portion connected to the electronic component,
    A part of the elastic heat dissipation member overlaps the sealing layer when viewed from the thickness direction of the elastic base material.
    Stretchable mounting substrate.
  12. 　前記伸縮性放熱部材の一部は前記封止層の内部に配置される、
    　請求項１１に記載の伸縮性実装基板。     A part of the elastic heat dissipation member is arranged inside the sealing layer,
    The stretchable mounting substrate according to claim 11.
  13. 　前記伸縮性基材の厚み方向において、前記第１電子部品と前記伸縮性放熱部材との間に、第１絶縁層が配置される、
    　請求項１１又は１２に記載の伸縮性実装基板。     A first insulating layer is disposed between the first electronic component and the elastic heat dissipation member in the thickness direction of the elastic base material,
    The stretchable mounting substrate according to claim 11 or 12.
  14. 　前記伸縮性放熱部材は第２伸縮性配線である、
    　請求項１１から１３のいずれかに記載の伸縮性実装基板。     The elastic heat dissipation member is a second elastic wiring,
    The stretchable mounting board according to any one of claims 11 to 13.
  15. 　前記部品接続部と前記第２伸縮性配線とは、前記伸縮性基材からの距離がそれぞれ異なる部分に設けられている、
    　請求項１４に記載の伸縮性実装基板。     The component connection portion and the second stretchable wiring are provided at different distances from the stretchable base material,
    The stretchable mounting substrate according to claim 14.
  16. 　前記第１絶縁層の上側に設けられた前記第１伸縮性配線の配線密度は、前記第１絶縁層の下側に設けられた前記第２伸縮性配線の配線密度より大きい、
    　請求項１４又は１５に記載の伸縮性実装基板。     The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is higher than the wiring density of the second elastic wiring provided on the lower side of the first insulating layer,
    The stretchable mounting substrate according to claim 14 or 15.
  17. 　前記第１伸縮性配線の延伸方向と前記第２伸縮性配線の延伸方向とは、少なくとも前記第１電子部品の近傍において平行である、
    　請求項１５又は１６に記載の伸縮性実装基板。     The extending direction of the first elastic wiring and the extending direction of the second elastic wiring are parallel at least in the vicinity of the first electronic component,
    The stretchable mounting substrate according to claim 15 or 16.
  18. 　前記第１伸縮性配線の延伸方向と前記第２伸縮性配線の延伸方向とは、少なくとも前記第１電子部品の近傍において交差する、
    　請求項１５又は１６に記載の伸縮性実装基板。     The extending direction of the first elastic wiring and the extending direction of the second elastic wiring intersect at least in the vicinity of the first electronic component,
    The stretchable mounting substrate according to claim 15 or 16.
  19. 　前記伸縮性基材の厚み方向から見て、前記第２伸縮性配線と前記第１電子部品又は前記部品接続部とが重なる領域において、前記第２伸縮性配線と前記伸縮性基材との間に、第２絶縁層をさらに備える、
    　請求項１５から１８のいずれか一つに記載の伸縮性実装基板。     Between the second stretchable wiring and the stretchable base in a region where the second stretchable wiring and the first electronic component or the component connecting portion overlap when viewed from the thickness direction of the stretchable base. further comprising a second insulating layer,
    The stretchable mounting board according to any one of claims 15 to 18.
  20. 　第２電子部品をさらに備え、
    　前記第２伸縮性配線は前記第２電子部品に接続される、
    　請求項１５から１９のいずれか一つに記載の伸縮性実装基板。     further comprising a second electronic component,
    The second stretchable wiring is connected to the second electronic component,
    The stretchable mounting substrate according to any one of claims 15 to 19.
PCT/JP2022/032624 2021-10-22 2022-08-30 Elastic mounted substrate WO2023067901A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249574A (en) * 2010-05-27 2011-12-08 Nippon Mektron Ltd Flexible circuit board
JP2016143763A (en) * 2015-02-02 2016-08-08 株式会社フジクラ Elastic circuit board
JP2020013969A (en) * 2018-07-10 2020-01-23 矢崎総業株式会社 Connector-equipped circuit body and busbar module
US20210111167A1 (en) * 2019-10-11 2021-04-15 Lg Display Co., Ltd. Stretchable display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249574A (en) * 2010-05-27 2011-12-08 Nippon Mektron Ltd Flexible circuit board
JP2016143763A (en) * 2015-02-02 2016-08-08 株式会社フジクラ Elastic circuit board
JP2020013969A (en) * 2018-07-10 2020-01-23 矢崎総業株式会社 Connector-equipped circuit body and busbar module
US20210111167A1 (en) * 2019-10-11 2021-04-15 Lg Display Co., Ltd. Stretchable display device

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