WO2023046020A1 - 耳机 - Google Patents

耳机 Download PDF

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Publication number
WO2023046020A1
WO2023046020A1 PCT/CN2022/120572 CN2022120572W WO2023046020A1 WO 2023046020 A1 WO2023046020 A1 WO 2023046020A1 CN 2022120572 W CN2022120572 W CN 2022120572W WO 2023046020 A1 WO2023046020 A1 WO 2023046020A1
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Prior art keywords
earphone
liquid silicone
range
ear
silicone layer
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PCT/CN2022/120572
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English (en)
French (fr)
Inventor
吴继峰
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深圳思维科技有限责任公司
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Publication of WO2023046020A1 publication Critical patent/WO2023046020A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones

Definitions

  • the present invention relates to the technical field of smart earphones, in particular to an earphone.
  • TWS True Wireless Stereo, True Wireless Stereo
  • TWS technology is developed based on Bluetooth chip technology. Its working principle is that the mobile phone is connected to the main earphone, and then the main earphone is quickly connected to the auxiliary earphone wirelessly, so as to realize the true wireless separation of the left and right channels of Bluetooth.
  • TWS earphones completely abandon the wire connection between traditional earphones, which greatly facilitates the use of users, and is small in size and easy to carry. This makes the headset popular with more and more users.
  • earphones in the prior art still have some problems, for example, the existing earphones have poor softness in the ear and poor wearing comfort for a long time.
  • the size of the ear part cannot adapt to the structure of the ear, and the length is too long, resulting in too deep ear insertion, which reduces wearing comfort.
  • Some earbuds are too short, not only easy to fall, but also poor sealing, resulting in poor sound quality and poor user experience.
  • the present invention aims to provide an earphone that can adapt to the structure of the ear, improve wearing comfort, and improve the sealing performance of the earphone, thereby enhancing the sound quality effect.
  • a kind of earphone comprising: the earphone rear shell; the sound cavity shell that is arranged on the front end of the earphone rear shell; the earphone front mouth that is connected with the sound cavity shell; wherein, the The front mouthpiece of the earphone includes a support piece and a liquid silicone layer wrapped on the outer surface of the support piece. The sound transmission channel between the shell of the sound cavity and the ear-entry part.
  • the support member and the liquid silicone layer are secondary injection molded parts, and the liquid silicone layer is injected onto the outer surface of the support member, so that the support member and the liquid silicone layer The fit forms a single piece.
  • the hardness of the liquid silicone layer is in the range of 20-70 Shore A.
  • the hardness of the liquid silicone layer is in the range of 30-45 Shore A.
  • the extension length c of the front mouthpiece of the earphone is set to be in the range of 14.0-20.0 mm.
  • the height a of the opening of the front end of the ear-entry portion is set within a range of 5.5-7.5 mm, and the width b of the front-end opening of the ear-entry portion is set within a range of 2.5-5.0 mm.
  • a speaker is further included, and the speaker is arranged in the main cavity jointly formed by the sound cavity shell and the earphone front mouth.
  • the distance between the horn and the front end of the earphone mouthpiece is set within a range of 2.0-5.0mm.
  • the maximum width h of the main cavity is set in the range of 14-20 mm, and the thickness d of the main cavity is set in the range of 7.0-12.0 mm.
  • the thickness of the supporting member is set to be in the range of 0.5-0.8 mm.
  • the thickness of the liquid silicone layer is set within a range of 0.3-3.0 mm.
  • the wall thickness of the ear-entry portion is set within a range of 0.3-1.0 mm.
  • the support member is provided with a connection buckle
  • the sound cavity shell is provided with a connection groove
  • the connection buckle can be fitted into the connection groove, so that the support member and the sound cavity The cavity shell forms the connection.
  • a battery is further included, and the battery is arranged in the main cavity and at the rear side of the horn.
  • the earphone rear housing has circuit components within it.
  • the circuit element includes a circuit board on which an audio processor, a bluetooth chip and a battery management chip are integrated.
  • the earphone according to the invention can adapt to the structure of the ear, significantly improves the wearing comfort, and can improve the sealing performance of the earphone, thereby enhancing the sound quality effect.
  • the size of the front mouth of the earphones is set according to the principle of ergonomics, which can adapt to the structure of the human ear, better in the ear, and is conducive to wearing.
  • the support can form a good rigid support and can effectively ensure the moderate depth of wearing the ear.
  • liquid silicone By using liquid silicone
  • the softness of the layer improves the comfort, and at the same time, it can ensure the sealing between the in-ear part and the ear part, effectively ensuring the sound quality effect.
  • the earphone is very beneficial for the wearer to adjust the wearing comfort and the airtightness of the earphone to achieve the best effect.
  • FIG. 1 schematically shows the structure of an earphone according to the invention.
  • Fig. 2 schematically shows a cross-sectional view schematically showing the front mouthpiece of the earphone.
  • Fig. 3 is an exploded view of an earphone according to the invention.
  • Fig. 4 schematically shows a front view of an earphone according to the invention.
  • Fig. 5 schematically shows a side view of an earphone according to the invention.
  • Fig. 6 schematically shows a top view of an earphone according to the invention.
  • Fig. 1 schematically shows the external structure of an earphone according to the present invention.
  • the earphone 100 includes a sound cavity shell 4 and a headphone mouthpiece 1 connected to the sound cavity shell 4 .
  • the front mouthpiece 1 of the earphone and the sound chamber shell 4 jointly form a main cavity, and a speaker 3 (see FIG. 3 ) and an earphone battery 5 are also arranged in the main cavity.
  • a speaker 3 see FIG. 3
  • an earphone battery 5 are also arranged in the main cavity.
  • the earphone battery 5 is disposed in the main cavity, and the earphone battery 5 is located behind the speaker 3 .
  • Electronic components such as connecting cables 7 are also arranged in the sound cavity housing 4 .
  • An earphone rear case 2 is also arranged at the rear end of the sound cavity shell 4 , and the earphone rear shell 2 is connected with the sound cavity shell 4 .
  • the circuit components include a circuit board 6, and a module circuit that can realize the basic functions of the earphone is integrated on the circuit board 6, such as audio Processor, Bluetooth chip, battery management chip, etc.
  • the battery 5 may be a button battery, for example, and the battery 5 is fixedly installed through the battery fixing blocks 81 , 82 .
  • the circuit board 6 can be fixedly installed in the accommodating cavity through the circuit board mounting bracket 9 .
  • the headphone mouthpiece 1 is configured to include a support 12 and a flexible liquid silicone layer 11 wrapped around the outer surface of the support 12 .
  • the supporting member 12 forms an integral structure with the liquid silicone layer 11 , and connects the front mouthpiece 1 of the earphone as a whole with the sound cavity shell 4 , and the end of the liquid silicone layer 11 extends outward to form an ear-in portion 111 .
  • a sound transmission channel 112 is formed inside the front mouthpiece 1 of the earphone.
  • the sound transmission channel 112 communicates with the inner space of the sound chamber shell 4 and the ear-input portion 111.
  • the sound information generated by the earphone 100 is transmitted to the ear-input portion 111 through the sound transmission channel, and enters human ear.
  • the shape of the earphone provided by the invention is set according to the principle of ergonomics.
  • the entire earphone 100 corresponds to the "ear", that is, includes the inner ear and the outer ear.
  • the front mouthpiece 1 of the earphone (including the ear-entry part 111 ), together with the sound chamber shell 4 and the rear shell 2 of the earphone, constitutes a structure suitable for embedding the inner ear and the outer ear at the same time, which is convenient for wearing and helps to prevent the earphone from falling.
  • the ear-entry part 111 at the end of the liquid silicone layer 11 of the front mouthpiece 1 of the earphone is configured to be able to adapt to the structure of the human ear canal.
  • the liquid silicone layer 11 has good flexibility, which significantly improves the wearing comfort of the human ear.
  • the ear-entry portion 111 is inclined at a certain angle relative to the sound cavity shell 4 and extends outward. The angle of inclination may be set in the range of 20-40 degrees, preferably about 30 degrees.
  • the outer contour of the ear-entry portion 111 is formed into an elliptical cone structure, which is more suitable for entering the ear canal.
  • the front end distance between the speaker 3 and the ear-in section 111 is set within a range of 2.0-5.0 mm, preferably 3.0-4.5 mm, for example about 3.8 mm.
  • the hardness of the liquid silicone layer 11 is set within the range of 30-70 Shore A, preferably within the range of 40-60 Shore A, most preferably within the range of 40-55 Shore A. In another aspect of the present invention, the hardness of the liquid silicone layer 11 is set to be in the range of 20-70 Shore A, preferably set to be in the range of 25-50 Shore A, most preferably set to be in the range of 30-40 Shore A within the range of A's. The hardness within this range of the liquid silicone layer 11 is conducive to ensuring its good softness on the premise of ensuring its durability, and is more conducive to enhancing the wearing comfort of the human ear.
  • the size of the earphone 100 provided by the present invention is set according to the principle of ergonomics.
  • the height a of the opening of the front end of the ear-entry portion 111 of the front mouthpiece 1 of the earphone is set to be in the range of 5.5-7.5mm, preferably set to 6.0-7.0mm, such as about 6.5mm .
  • the width b of the front opening of the ear-entry portion 111 is set within a range of 2.5-5.0 mm, preferably 3.0-4.0 mm, for example about 3.5 mm.
  • the extension length c of the front mouthpiece 1 of the earphone is set to be in the range of 14.0-20.0 mm, preferably 16.0-19.0 mm, for example about 18.5 mm.
  • the maximum width h (vertical width) of the main cavity is set in the range of 14-20 mm, preferably 15.0-19.0 mm, for example about 16.3 mm.
  • the maximum width of the main cavity refers to the maximum dimension formed by the outer contour of the main cavity for contacting with the pinna of the human ear for support.
  • the thickness d of the outer contour of the main cavity where the earphone mouthpiece 1 and the sound cavity shell 4 are integrated is set to be in the range of 7.0-12.0mm, preferably 8.0-11.0mm, for example about 10.0mm.
  • the earphone 100 provided by the present invention includes the shape and size of the earphone mouthpiece 1, which can adapt to the structure of the human ear, better fit into the ear, and is conducive to wearing, and can effectively ensure that the wearing depth of the ear is moderate, improving comfort, and at the same time ensuring ear fit
  • the tightness between the part 111 and the ear canal effectively ensures the sound quality effect. It is very beneficial for the wearer to adjust the wearing comfort and the airtightness of the earphone to achieve the best effect.
  • the term "vertical" refers to the vertical direction in FIG. 3 .
  • the support member 12 and the liquid silicone layer 11 are injection molded parts formed by a secondary injection molding process.
  • the liquid silicone layer 11 is injected onto the outer surface of the support 12 and forms a close fit with the support 12 .
  • the support member 12 and the liquid silicone layer 11 are bonded together to form a whole, the support member 12 can form a good rigid support, and the liquid silicone layer 11 can effectively improve the wearing comfort.
  • the integrally formed structure of the support member 12 and the liquid silicone layer 11 can significantly improve the integrity, effectively ensure the sealing between the two, help to avoid sound leakage, and is very beneficial to improve sound quality.
  • the thickness of the supporting member 12 is set within a range of 0.5-0.8 mm, preferably about 0.6-0.7 mm.
  • the thickness of the liquid silicone layer 11 is set within a range of 0.3-3.0 mm, preferably about 0.5-2.5 mm.
  • the wall thickness of the ear-entry portion 111 formed by extending outward from the end of the liquid silicone layer 11 is set within a range of 0.3-1.0 mm, preferably about 0.4-0.7 mm.
  • the support member 12 and the liquid silicone layer 11 are processed through a secondary injection molding process to form an integrated headphone mouthpiece 1 .
  • the front mouthpiece 1 of the earphone is connected with the sound chamber shell 4 to form the whole earphone.
  • This not only effectively ensures the good rigid support of the front mouthpiece 1 of the earphone, but also significantly improves the wearing comfort due to the in-ear softness of the liquid silicone layer 11 formed by secondary injection molding.
  • Overmolding is a common molding process in the field, also known as overmolding or overmolding, which combines multiple materials into a single part or product. Overmolding typically provides a rigid plastic base part that is then covered with a flexible, resilient plastic or other material, such as a liquid silicone coating.
  • Overmolding can include one-shot (insert molding) or two-shot (multi-molding) techniques.
  • the process of liquid silicone molding (LSRmolding) is also well known in the art, and is sometimes called liquid injection molding (Liquid Injection Moulding, LIM).
  • LIM is generally a thermosetting process that creates flexible silicone parts by mixing two compound components and then curing them with heat in a mold using a platinum catalyst.
  • the horn 3 and the battery 5 are placed in the main cavity.
  • the speaker 3 is arranged in the cavity of the headphone mouthpiece 1
  • the battery 5 is correspondingly arranged in the cavity of the sound cavity housing 4 .
  • both the horn 3 and the battery 5 can be arranged in the cavity of the sound cavity housing 4 .
  • TWS earphones include main earphones and auxiliary earphones, wherein the main earphones and auxiliary earphones have independent power sources (such as rechargeable batteries, which are charged by contacting with an external charging compartment through two contacts).
  • the horn 3 is correspondingly arranged in the front mouthpiece 1 of the earphone.
  • the horn 3 can also be correspondingly arranged in the sound chamber shell 4 .
  • the frontmost distance between the horn 3 and the front mouthpiece 1 of the earphone is set to be in the range of 2.0-5.0mm, preferably 3.0-4.5mm, for example about 3.8mm.
  • a first rough bonding surface may be provided on the inner wall of the liquid silica gel layer 11, and at the same time, a second rough bonding surface may be provided on the outer wall of the support member, and the liquid silica gel layer 11 and the support member 12 pass through the second rough bonding surface.
  • the first rough joint surface and the second rough joint surface are connected as a whole by bonding.
  • an adhesive layer (not shown) may be provided between the support member 12 and the liquid silicone layer 11 .
  • the adhesive layer can be adhesive glue, for example. This can ensure the bonding effect between the liquid silicone layer 11 and the support member 12, which is very beneficial to improving the integrity of the front mouthpiece 1 of the earphone.
  • an oil coating layer (not shown) is also provided on the outer surface of the liquid silicone layer 11 .
  • a layer of hand oil is sprayed on the outer surface of the liquid silicone layer 11 to form an oiled layer.
  • the oil-coated layer can not only prevent dust and enhance the feel, but also further enhance the wearing comfort.
  • liquid silicone layer 11 and the support member 12 of the front mouthpiece 1 of the earphone are prepared through a complete secondary injection molding process, and the specific process is as follows:
  • the support member 12 is prepared by injection molding, and the material is PC/ABS, and PC/ABS is a thermoplastic plastic material formed by combining polycarbonate (Polycarbonate) and polyacrylonitrile (ABS).
  • the plastic part that is, the supporting part 12
  • the thickness of the support member 12 is formed to be in the range of 0.5-0.8 mm.
  • liquid silicone for example, the LSR97 series of Dongguan Tianan Silicone Technology Co., Ltd. includes models LSR9730A/B; LSR9740A/B, etc.; Jade Silicone Co., Ltd. TYL6420 series includes models: TYL6420-30A/B; TYL6420-40A/B, etc.
  • liquid silicone component A and liquid Silicone component B after mixing, forms a liquid silicone layer 11 surrounding a support 12 made of PC/ABS material in a heating mold and having an earphone shell shape defined by the mold.
  • the liquid silicone 11 and the support 12 are tightly connected as one.
  • the hardness of the formed liquid silicone layer is in the range of about 30-70 Shore A, such as about 30 Shore A, 40 Shore A, and the like.
  • the mold After cooling and opening the mold, take out the rough product formed by secondary injection molding, and perform edge removal and grinding. After that, spray oil on the surface of the liquid silicone layer 11 to form an oil coating layer on the surface of the liquid silicone layer 11 . Thus, the earphone mouthpiece 1 is formed.
  • the liquid silicone layer 11 and the support member 12 are integrally molded through a two-time injection molding process, which can form a complex structure that matches the shape of the support member 12 inside, and can have various designations suitable for the earphone in-ear part on the outside. shape.
  • the outer surface of the liquid silicone layer 11 can be adaptively adjusted according to the shape of the support member 12 , which is very beneficial to miniaturization of the earphone.
  • liquid silicone rubber known in the art can be used to prepare the liquid silicone rubber layer of the earphone of the present invention.
  • liquid silicone rubber is part of a family of thermoset elastomers comprising a backbone of alternating silicon and oxygen atoms and side groups of methyl or vinyl groups. Silicone rubber accounts for about 30 percent of the silicone group.
  • Liquid silicone rubber has properties such as wide and suitable hardness range (5 to 90 durometer), its inertness, odorless, tasteless, hypoallergenic, it is flexible and durable. Injection molding of liquid silicone rubber is different from conventional thermoplastic injection molding.
  • Liquid silicone rubber is a high-purity platinum-cured silicone that has low compression set, excellent stability, and the ability to resist extreme temperatures (both hot and cold). It is ideally suited for the production of components or devices where high quality is important, for example in objects that come into contact with the human body. Due to the thermoset nature of silicone, liquid silicone injection molding requires special handling, including intensive dispensing mixing, while ensuring that the silicone remains cold before it is injected into a heated cavity or mold and vulcanized.
  • a typical liquid silicone injection molding machine or system includes several functional components including an injector, metering unit, supply drum, mixer, nozzle, at least one mold clamp and mold.
  • a syringe or injection unit is responsible for pressurizing the liquid silicone to facilitate the injection of the silicone into the mold cavity.
  • the metering unit pumps the two main liquid materials; namely the silicone forming base and the catalyst, ensuring that the two materials maintain a predetermined constant ratio and are released simultaneously.
  • a supply drum and other containers, such as those holding dyeing material are connected to the main pumping part of the system.
  • Static and/or dynamic mixers combine the materials after they leave the metering unit. Once combined, pressure is used to drive the mixture into the injection unit, through the attached nozzle, and into the designated mold.
  • the nozzles include automatic and/or manual shut-off valves to prevent leakage and overfilling of the mold.
  • the mold clamps hold the mold during the injection molding process and are used to open the mold when the process is complete.
  • silicone molding of parts or assemblies requires that the liquid silicone rubber be kept cool before it is injected into a heated mold.
  • the raw materials used in the process are usually mixed in a 1:1 ratio via a static mixer. Once the components come into contact, the curing process begins immediately. Essentially, the 1:1 mixed compound is pumped through a cold plate and then into a heated chamber where vulcanization occurs. This cooling process allows the production of liquid silicone rubber components with essentially zero material valve waste.
  • the support member 12 is configured in a substantially hemispherical shape, and the open end surface of the support member 12 is used for connecting the sound cavity shell 4 .
  • the sound chamber housing 4 can be configured, for example, as a cone-shaped structure.
  • a plurality of connection buckles 121 may be provided on the open end surface of the support member 12 , and the plurality of connection buckles 121 are evenly distributed along the circumferential direction.
  • a plurality of connecting grooves (not shown) are correspondingly provided on the open end surface of the sound cavity housing 4 .
  • the connecting buckle 121 can be fit and installed in the connecting groove and be engaged, so that the supporting member 12 is connected with the sound cavity shell 4 .
  • the front mouthpiece 1 of the earphone and the sound chamber shell 4 form a detachable connection.
  • the earphone 100 can adapt to the structure of the ear, significantly improve the wearing comfort, and can improve the sealing performance of the earphone, thereby enhancing the sound quality effect.
  • the shape and size of the front mouthpiece 1 of the earphone are set according to the principles of ergonomics, which can adapt to the structure of the human ear and fit into the ear better, which is conducive to wearing.
  • the support member 12 can form a good rigid support, and can effectively ensure that the wearing depth of the ear is moderate.
  • the comfort is improved by using the softness of the liquid silicone layer 11 , and at the same time, the sealing between the ear-in section 111 and the ear can be ensured, effectively ensuring the sound quality effect.
  • the earphone 100 is very beneficial for the wearer to adjust the wearing comfort and the airtightness of the earphone to achieve the best effect.
  • first and second are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more, unless otherwise specifically defined.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)

Abstract

本发明提出了一种耳机，包括：耳机后壳体；设置在所述耳机后壳体的前端的音腔外壳；与所述音腔外壳连接的耳机前嘴；其中，所述耳机前嘴包括支撑件和包裹式形成于所述支撑件的外表面的液态硅胶层，所述液态硅胶层的末端向外延伸而形成入耳部，在所述耳机前嘴的内部形成有连通所述音腔外壳与所述入耳部的传音通道。

Description

耳机
相关申请的交叉引用
本申请要求享有于2021年9月23日提交的发明名称为“耳机”的中国专利申请202111115149.0的优先权，这件专利申请的全部内容通过引用结合于本文中。
技术领域
本发明涉及智能耳机技术领域，具体地，涉及一种耳机。
背景技术
TWS(True Wireless Stereo，真无线立体声)耳机是一种较为先进的无线耳机，TWS技术是基于蓝牙芯片技术发展而来的。其工作原理是指手机通过连接主耳机，再由主耳机通过无线方式快速连接副耳机，实现真正的蓝牙左右声道无线分离使用。TWS耳机完全摒弃了传统耳机间的线材连接，极大地方便了用户的使用，且体积小，方便携带。这使得耳机受到越来越多用户的喜欢。
然而现有技术中常见的耳机仍然存在一些问题，例如，现有的耳机入耳部的柔软性较差，长时间佩戴舒适性差。还有入耳部分的尺寸无法适应耳部结构，存在长度过长而导致入耳过深，降低佩戴舒适性。还有的入耳部太短，不仅容易掉落，而且密封性差导致音质不佳，用户体验感差。
发明内容
针对如上所述的技术问题，本发明旨在提出一种耳机，该耳机能够适应耳部结构，改善佩戴舒适性，并且能够提高耳机的密封性，从而增强音质效果。
为此，根据本发明提出了一种耳机，包括：耳机后壳体；设置在所述耳机后壳体的前端的音腔外壳；与所述音腔外壳连接的耳机前嘴；其中，所述耳机前嘴包括支撑件和包裹式形成于所述支撑件的外表面的液态硅胶层，所述液态硅胶层的末端向外延伸而形成入耳部，在所述耳机前嘴的内部形成有连通所述音腔外壳与所述入耳部的传音通道。
在一个实施例中，所述支撑件和所述液态硅胶层为二次注塑成型件，所述液态硅胶层注塑到所述支撑件的外表面上，使得所述支撑件和所述液态硅胶层贴合 形成为一体。
在一个实施例中，所述液态硅胶层的硬度处于20～70邵氏A的范围内。
在一个实施例中，所述液态硅胶层的硬度处于30～45邵氏A的范围内。
在一个实施例中，所述耳机前嘴的延伸长度c设置成处于14.0-20.0mm的范围内。
在一个实施例中，所述入耳部的前端的开口的高度a设置成处于5.5-7.5mm的范围内，所述入耳部的前端开口的宽度b设置成处于2.5-5.0mm的范围内。
在一个实施例中，还包括喇叭，所述喇叭布置在所述音腔外壳与所述耳机前嘴共同形成的主空腔内。
在一个实施例中，所述喇叭与所述耳机前嘴的最前端距离设置为处于2.0-5.0mm的范围内。
在一个实施例中，所述主空腔的最大宽度h设置成处于14-20mm的范围内，所述主空腔的厚度d设置成处于7.0-12.0mm的范围内。
在一个实施例中，所述支撑件的厚度设置成处于0.5-0.8mm的范围内。
在一个实施例中，所述液态硅胶层的厚度设置成处于0.3-3.0mm的范围内。
在一个实施例中，所述入耳部的壁厚设置成处于0.3-1.0mm的范围内。
在一个实施例中，所述支撑件设有连接扣，所述音腔外壳设有连接槽，所述连接扣能够适配安装到所述连接槽中，从而使所述支撑件与所述音腔外壳形成连接。
在一个实施例中，还包括电池，所述电池设置在所述主空腔内且处于所述喇叭的后侧位置。
在一个实施例中，耳机后壳体内具有电路元件。
在一个实施例中，所述电路元件包括电路板，在所述电路板上集成有音频处理器、蓝牙芯片和电池管理芯片。
与现有技术相比，本发明的优点之处在于：
根据本发明的耳机能够适应耳部结构，显著改善佩戴舒适性，并且能够提高耳机的密封性，从而增强音质效果。耳机前嘴的尺寸根据人工学原理进行设置，能够适应人体耳部结构，更好地入耳，有利于佩戴，支撑件能够形成良好的刚性支撑，并且能够有效保证佩戴入耳深度适中，通过利用液态硅胶层的柔软性提高了舒适性，同时能够保证入耳部与耳部之间的密封性，有效保证了音质效果。该 耳机非常有利于使得佩戴者调整佩戴舒适性以及耳机的密闭性达到最佳的效果。
附图说明
下面将参照附图对本发明进行说明。
图1示意性地根据本发明的耳机的结构。
图2示意性地显示了示意性地显示了耳机前嘴的剖视图。
图3是根据本发明的耳机的***视图。
图4示意性地显示了根据本发明的耳机的主视图。
图5示意性地显示了根据本发明的耳机的侧视图。
图6示意性地显示了根据本发明的耳机的俯视图。
图中附图标记为：
100-耳机，1-耳机前嘴，11-液态硅胶层，111-入耳部，112-传音通道，12-支撑件，121-连接扣，2-耳机后壳体，3-喇叭，4-音腔外壳，5-电池，6-电路板，7-连接排线，81、82-电池固定块，9-电路板安装支架。
在本申请中，所有附图均为示意性的附图，仅用于说明本发明的原理，并且未按实际比例绘制。
具体实施方式
下面通过附图来对本发明进行介绍。
图1示意性地根据本发明的耳机的外部结构。根据本发明的耳机100有两个，包括右耳机和左耳机，这里以其中的一个进行详细介绍。如图1所示，耳机100包括音腔外壳4，以及与音腔外壳4连接的耳机前嘴1。耳机前嘴1与音腔外壳4共同形成主空腔，在主空腔内还设有喇叭3(见图3)和耳机电池5。这里需要说明的是，将佩戴时耳机100时相对靠近人耳的一侧定义为“前”或相似用语，将相对远离人耳的一侧定义为“后”或相似用语。
如图3所示，耳机电池5设置在主空腔内，且耳机电池5处于喇叭3的后侧位置。在音腔外壳4内还布置有连接排线7等电子元件。在音腔外壳4的后端还设有耳机后壳体2，耳机后壳体2与音腔外壳4连接。耳机后壳体2内有容纳腔体，容纳腔体用于安装电路元件(其他电子元件)，电路元件包括电路板6，在电路板6上集成有可以实现耳机基本功能的模块电路，如音频处理器、蓝牙芯片、 电池管理芯片等。在一个实施例中，电池5例如可以采用纽扣电池，且电池5通过电池固定块81、82形成固定安装。电路板6可以通过电路板安装支架9固定安装在容纳腔体内。
如图1和图2所示，耳机前嘴1构造成包括支撑件12和包裹式形成于支撑件12的外表面的柔性的液态硅胶层11。支撑件12与液态硅胶层11形成一体结构，并使耳机前嘴1作为一个整体与音腔外壳4连接，液态硅胶层11的末端向外延伸而形成入耳部111。在耳机前嘴1的内部形成有传音通道112，传音通道112连通音腔外壳4的内部空间与入耳部111，耳机100产生的声音信息通过传音通道传递至入耳部111，进入传入人耳。
本发明提供的耳机的外形根据人工学原理进行设置。根据本发明，整个耳机100对应“耳部”，即包括内耳和外耳。耳机前嘴1(包括入耳部111)与音腔外壳4和耳机后壳体2一起构成适于同时嵌入内耳和外耳的结构，便于佩戴并且有利于避免耳机掉落。耳机前嘴1的液态硅胶层11的末端的入耳部111构造成能够适应人体耳道结构。液态硅胶层11具有良好的柔软性，显著提高了人耳佩戴舒适性。在一个实施例中，入耳部111相对于音腔外壳4倾斜一定角度向外延伸。倾斜角度可设置为处于20-40度的范围，优选为约30度。入耳部111的外部轮廓形成为椭圆锥面结构，这样更适于进入耳道。在一个实施例中，喇叭3与入耳部111的最前端距离设置为处于2.0-5.0mm的范围内，优选为3.0-4.5mm，例如为约3.8mm。
液态硅胶层11的硬度设置成处于30～70邵氏A的范围内，优选设置成处于40～60邵氏A的范围内，最优选设置成处于40～55邵氏A的范围内。在本发明的另一个方面，液态硅胶层11的硬度设置成处于20～70邵氏A的范围内，优选设置成处于25～50邵氏A的范围内，最优选设置成处于30～40邵氏A的范围内。液态硅胶层11的这一范围的硬度在保证其耐用性的前提下，也有利于保证其具有良好的柔软性，更有利于增强人耳佩戴舒适性。
本发明提供的耳机100的尺寸根据人工学原理进行设置。其中，如图4至图6所示，耳机前嘴1的入耳部111的前端的开口的高度a设置成处于5.5-7.5mm的范围内，优选设置成6.0-7.0mm，例如为约6.5mm。入耳部111的前端开口的宽度b设置成处于2.5-5.0mm的范围内，优选设置成3.0-4.0mm，例如为约3.5mm。耳机前嘴1的延伸长度c设置成处于14.0-20.0mm的范围内，优选设置成 16.0-19.0mm，例如为约18.5mm。另外，主空腔的最大宽度h(竖向宽度)设置成处于14-20mm的范围内，优选设置成15.0-19.0mm，例如为约16.3mm。需要说明的是，主空腔的最大宽度是指主空腔的外部轮廓形成的用于与人耳耳廓接触以进行支撑的最大尺寸。耳机前嘴1与音腔外壳4形成为一体的主空腔的外部轮廓的厚度d设置成处于7.0-12.0mm的范围内，优选设置成8.0-11.0mm，例如为约10.0mm。
本发明提供的耳机100包括耳机前嘴1的这些形状和尺寸能够适应人体耳部结构，更好地入耳，有利于佩戴，并且能够有效保证佩戴入耳深度适中，提高了舒适性，同时能够保证入耳部111与耳道之间的密封性，有效保证了音质效果。非常有利于使得佩戴者调整佩戴舒适性以及耳机的密闭性达到最佳的效果。在本发明中，用语“竖向”指图3中的竖向方向。
根据本发明的一个实施例，如图6所示，支撑件12和液态硅胶层11为通过二次注塑工艺形成的注塑成型件。液态硅胶层11注塑到支撑件12的外表面上，并与支撑件12形成紧密贴合。由此，支撑件12和液态硅胶层11贴合形成为一体，支撑件12能够形成良好的刚性支撑，液态硅胶层11能够有效改善佩戴舒适性。同时，支撑件12和液态硅胶层11的这种一体化成型结构能够显著提高整体性，有效保证两者之间的密封性，有利于避免音效泄漏，非常有利于提高音质效果。
为了保证支撑件12具有足够的支撑刚性，将支撑件12的厚度设置成处于0.5-0.8mm的范围内，优选为约0.6-0.7mm。
为了保证液态硅胶层11的柔软性和韧性，将液态硅胶层11的厚度设置成处于0.3-3.0mm的范围内，优选为约0.5-2.5mm。其中，在液态硅胶层11的末端向外延伸而形成的入耳部111的壁厚设置成处于0.3-1.0mm的范围内，优选为约0.4-0.7mm。
在本实施例中，支撑件12和液态硅胶层11通过二次注塑工艺加工形成为一体的耳机前嘴1。耳机前嘴1与音腔外壳4连接形成耳机整体。这不仅有效保证了耳机前嘴1具有良好的刚性支撑，二次注塑成型的液态硅胶层11具有的入耳柔软性也显著提高了佩戴舒适性。二次注塑是本领域常用的模塑工艺，也称为二次成型或包覆成型(overmolding)，可将多种材料结合到一个零件或产品中。二次注塑工艺通常先提供一种刚性的塑料基底部件，然后在其外覆盖一层柔韧的弹 性塑料或其它材料的外层，例如液态硅胶外层。包覆成型可包括单次(嵌入成型)或两次(多次成型)技术。液态硅胶成型(LSRmolding)的工艺也是本领域公知的，有时也被称为液态注射成型(Liquid Injection Moulding，LIM)。LIM一般是热固性工艺，通过将两种化合物成分混合，然后在模具内使用铂金催化剂进行加热固化，从而制造出柔性硅树脂部件。
在本实施例中，喇叭3和电池5安置在主空腔内。例如，喇叭3布置在耳机前嘴1的腔体内，而电池5对应布置在音腔外壳4的腔体内。也可以是，喇叭3和电池5可以都布置在音腔外壳4的腔体内。TWS耳机包括主耳机和副耳机，其中，主耳机和副耳机分别具有独立的电源(例如为可充电电池，通过两个触点与外接充电仓接触进行充电)。
在图3所示实施方案中，喇叭3对应设置在耳机前嘴1内。当然，喇叭3也可以对应设置在音腔外壳4内。喇叭3与耳机前嘴1的最前端距离设置为处于2.0-5.0mm的范围内，优选为3.0-4.5mm，例如为约3.8mm。
根据本发明的另一个实施例，可以在液态硅胶层11的内壁设有第一粗糙结合面，同时，在支撑件的外壁设有第二粗糙结合面，液态硅胶层11与支撑件12通过第一粗糙结合面与第二粗糙结合面通过粘结方式连接为一体。例如，可以在支撑件12与11液态硅胶层之间设置粘接层(未示出)。由此，使液态硅胶层11与支撑件12通过粘接层粘结为一体。粘结层例如可以为粘结胶水。这样能够保证液态硅胶层11与支撑件12之间的接合效果，非常有利于提高耳机前嘴1的整体性。
根据本发明，在液态硅胶层11的外表面还设有涂油层(未示出)。例如，在液态硅胶层11的外表面喷涂一层手感油，从而形成一层涂油层。涂油层不仅能够防尘，增强手感，还能够进一步增强佩戴舒适性。
在本实施例中，耳机前嘴1的液态硅胶层11和支撑件12通过一个完整的二次注塑工艺制备，其具体过程为：
首先，通过注塑成型制备支撑件12，材料为PC/ABS，PC/ABS是由聚碳酸酯(Polycarbonate)和聚丙烯腈(ABS)合并而成的热可塑性塑胶材料。由此，通过热可塑性塑胶材料注塑形成塑胶件(即支撑件12)。支撑件12的厚度形成为处于0.5-0.8mm的范围内。
将得到的支撑件12放入用于二次注塑的模具(未示出)，采用液态硅胶(例 如，东莞市天桉硅胶科技有限公司LSR97系列包括型号LSR9730A/B；LSR9740A/B等；新安天玉有机硅有限公司TYL6420系列包括型号：TYL6420-30A/B；TYL6420-40A/B等)，并根据产品说明书指示，在到120℃-140℃温度下，分别通入液体硅胶组分A和液态硅胶组分B，混合后在加热模具内形成包围PC/ABS材料的支撑件12并具有模具限定的耳机外壳形状的液态硅胶层11，液态硅胶11与支撑件12紧密连接为一体。根据使用的液态硅胶材料和生产工艺，形成的液态硅胶层的硬度为约30～70邵氏A的范围内，例如为约30邵氏A、40邵氏A等。
冷却开模后取出二次注塑形成的粗品，并进行拆边打磨。之后，在液态硅胶层11的表面喷涂手感油，从而在液态硅胶层11的表面形成一层涂油层。由此，形成耳机前嘴1。
在本实施例中，液态硅胶层11与支撑件12通过二次注塑工艺一体成型，可成型出内部具有与支撑件12形状匹配的复杂结构，以及外部可具有各种适于耳机入耳部分的指定形状。由此，液态硅胶层11的外表面可以根据支撑件12的形状来适应性调整，非常有利于实现耳机的小型化。
根据本发明，本领域已知的各种液态硅橡胶(1iquid silicone rubber，LSR)都可用于制备本发明的耳机的液态硅胶层。化学上，液态硅橡胶为热固性弹性体一族的部分，其包含交替的硅原子和氧原子的主链以及甲基或乙烯基侧基。硅橡胶占有机硅一族的约百分之三十。
液态硅橡胶具有硬度范围宽广且适合(5至90硬度测验器)、其惰性、无气味、无味、低致敏性、其为挠性且耐久等性质。液态硅橡胶的注模不同于常规热塑性塑料注模。
液体硅橡胶的注模为用于制造或生产高体积的柔韧耐用组件。液体硅橡胶为高纯度铂固化有机硅，其具有低压缩变定、优良的稳定性和抵抗极端温度(热的和冷的两者)的能力。其理想地适合于生产其中高品质重要的组件或装置，例如在与人体接触的物体中。由于有机硅的热固性性质，液体有机硅注模需要特殊的处理，包括密集的分配混合，同时在有机硅被注射至加热腔体或模具中并硫化之前确保有机硅保持在低温下。
典型的液体有机硅注模机器或***包括多个功能组件，包括注射器、计量单元、供应鼓、混合器、喷嘴、至少一个模具夹具和模具。注射器或注射装置负责 加压液体有机硅，以促进有机硅注射至模具腔体中。计量单元泵送两种主要液体材料；即形成有机硅的基料和催化剂，从而确保所述两种材料保持预定的恒定比率并同时被释放。供应鼓以及其它容器(例如保持染色材料的容器)连接至所述***的主要泵送部分。在材料离开所述计量单元之后，静态和/或动态搅拌器组合所述材料。一旦组合，使用压力将混合物驱动至注射单元中，通过附接喷嘴，并且进入指定模具。通常，所述喷嘴包括自动和/或手动截止阀以防止渗漏和将所述模具填充过满。所述模具夹具在注模过程中固定模具，并且用于在所述过程完成时打开模具。
如上简单所述，部件或组件的有机硅模制要求在液体硅橡胶被注射至加热模具中之前，该液体硅橡胶保持冷却。在过程中所用的原料通常经由静态搅拌器以1∶1的比率混合。一旦组分接触，则固化过程立即开始。基本上，将1∶1混合的配混物泵送通过冷板，然后进入加热腔体，在所述加热腔体中发生硫化。该冷却过程允许以基本上零材料阀门浪费生产液体硅橡胶组件。
根据本发明的一个实施例，支撑件12构造成大致半球面体形，支撑件12的开口端面用于连接音腔外壳4。音腔外壳4例如可以构造成圆锥体形结构。在支撑件12的开口端面上可以设有多个连接卡扣121，多个连接卡扣121沿周向均布。同时在音腔外壳4的开口端面上对应设有多个连接槽(未示出)。连接扣121能够适配安装到连接槽中并形成卡合，从而使支撑件12与音腔外壳4形成连接。由此，耳机前嘴1与音腔外壳4形成可拆卸式连接。
根据本发明的耳机100能够适应耳部结构，显著改善佩戴舒适性，并且能够提高耳机的密封性，从而增强音质效果。耳机前嘴1的形状和尺寸根据人工学原理进行设置，能够适应人体耳部结构，更好地入耳，有利于佩戴，支撑件12能够形成良好的刚性支撑，并且能够有效保证佩戴入耳深度适中，通过利用液态硅胶层11的柔软性提高了舒适性，同时能够保证入耳部111与耳部之间的密封性，有效保证了音质效果。该耳机100非常有利于使得佩戴者调整佩戴舒适性以及耳机的密闭性达到最佳的效果。
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明 确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是，以上所述仅为本发明的优选实施方案而已，并不构成对本发明的任何限制。尽管参照前述实施方案对本发明进行了详细的说明，但是对于本领域的技术人员来说，依然可以对前述实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (16)

  1. 耳机，其特征在于，包括：
    耳机后壳体(2)；
    设置在所述耳机后壳体的前端的音腔外壳(4)；
    与所述音腔外壳连接的耳机前嘴(1)；
    其中，所述耳机前嘴包括支撑件(12)和包裹式形成于所述支撑件的外表面的液态硅胶层(11)，所述液态硅胶层的末端向外延伸而形成入耳部(111)，在所述耳机前嘴的内部形成有连通所述音腔外壳与所述入耳部的传音通道(112)。
  2. 根据权利要求1所述的耳机，其特征在于，所述支撑件和所述液态硅胶层为二次注塑成型件，所述液态硅胶层注塑到所述支撑件的外表面上，使得所述支撑件和所述液态硅胶层贴合形成为一体。
  3. 根据权利要求1所述的耳机，其特征在于，所述液态硅胶层的硬度处于20～70邵氏A的范围内。
  4. 根据权利要求3所述的耳机，其特征在于，所述液态硅胶层的硬度处于30～45邵氏A的范围内。
  5. 根据权利要求1-4中任一项所述的耳机，其特征在于，所述耳机前嘴的延伸长度c设置成处于14.0-20.0mm的范围内。
  6. 根据权利要求1-4中任一项所述的耳机，其特征在于，所述入耳部的前端的开口的高度a设置成处于5.5-7.5mm的范围内，所述入耳部的前端开口的宽度b设置成处于2.5-5.0mm的范围内。
  7. 根据权利要求1-4中任一项所述的耳机，其特征在于，还包括喇叭(3)，所述喇叭布置在所述音腔外壳与所述耳机前嘴共同形成的主空腔内。
  8. 根据权利要求7所述的耳机，其特征在于，所述喇叭与所述耳机前嘴的最前端距离设置为处于2.0-5.0mm的范围内。
  9. 根据权利要7所述的耳机，其特征在于，所述主空腔的最大宽度h设置成处于14-20mm的范围内，所述主空腔的厚度d设置成处于7.0-12.0mm的范围内。
  10. 根据权利要求1-4中任一项所述的耳机，其特征在于，所述支撑件的厚度设置成处于0.5-0.8mm的范围内。
  11. 根据权利要求1-4中任一项所述的耳机，其特征在于，所述液态硅胶层 的厚度设置成处于0.3-3.0mm的范围内。
  12. 根据权利要求11所述的耳机，其特征在于，所述入耳部的壁厚设置成处于0.3-1.0mm的范围内。
  13. 根据权利要求1所述的耳机，其特征在于，所述支撑件设有连接扣(121)，所述音腔外壳设有连接槽，所述连接扣能够适配安装到所述连接槽中，从而使所述支撑件与所述音腔外壳形成连接。
  14. 根据权利要求7所述的耳机，其特征在于，还包括电池(5)，所述电池设置在所述主空腔内且处于所述喇叭的后侧位置。
  15. 根据权利要求1所述的耳机，其特征在于，所述耳机后壳体(2)内具有电路元件。
  16. 根据权利要求15所述的耳机，其特征在于，所述电路元件包括电路板(6)，在所述电路板上集成有音频处理器、蓝牙芯片和电池管理芯片。
PCT/CN2022/120572 2021-09-23 2022-09-22 耳机 WO2023046020A1 (zh)

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CN109104660A (zh) * 2018-08-08 2018-12-28 深圳市中时科技有限公司 一种蓝牙耳机的密封防水方法
US20210029437A1 (en) * 2019-07-23 2021-01-28 Toong In Electronic Corp. Structure of earplug
CN212992575U (zh) * 2020-11-06 2021-04-16 捷普电子(新加坡)公司 麦克风装置
CN213938276U (zh) * 2020-11-04 2021-08-10 深圳市凯狮博电子有限公司 一种具有可换面壳的蓝牙耳机

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US20180000649A1 (en) * 2015-04-21 2018-01-04 Zhuhai Zorosy Technology Co., Ltd. Earcap and earplug
CN109104660A (zh) * 2018-08-08 2018-12-28 深圳市中时科技有限公司 一种蓝牙耳机的密封防水方法
US20210029437A1 (en) * 2019-07-23 2021-01-28 Toong In Electronic Corp. Structure of earplug
CN213938276U (zh) * 2020-11-04 2021-08-10 深圳市凯狮博电子有限公司 一种具有可换面壳的蓝牙耳机
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