WO2023000563A1 - Led glass screen and manufacturing method therefor - Google Patents

Led glass screen and manufacturing method therefor Download PDF

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Publication number
WO2023000563A1
WO2023000563A1 PCT/CN2021/131607 CN2021131607W WO2023000563A1 WO 2023000563 A1 WO2023000563 A1 WO 2023000563A1 CN 2021131607 W CN2021131607 W CN 2021131607W WO 2023000563 A1 WO2023000563 A1 WO 2023000563A1
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WO
WIPO (PCT)
Prior art keywords
led chip
led
liquid metal
pins
pad
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PCT/CN2021/131607
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French (fr)
Chinese (zh)
Inventor
于洋
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北京梦之墨科技有限公司
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Publication of WO2023000563A1 publication Critical patent/WO2023000563A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the application belongs to the technical field of flexible display, and in particular relates to an LED glass screen and a manufacturing method thereof.
  • LED film screen is applied to the target glass or curtain wall by the way of integral mounting, so as to endow it with the function of electronic display, while LED glass screen is a direct substitute for the target
  • LED film screen is a direct substitute for the target
  • the use of glass or curtain wall has certain differences in structure, use and production process.
  • manufacturers of LED film screens have proposed the concept of LED soft film screens. Due to their good flexible deformation ability, they can meet the mounting requirements of special-shaped surfaces.
  • LED surface mount technology is an indispensable link in the production of LED products, and its mounting efficiency has a great impact on the production of the entire LED product; Due to factors such as width, it is difficult to adopt the SMT reflow soldering process, and the combination between ITO (indium tin oxide) and solder paste is not easy or poor, easy to peel off or virtual soldering, etc. It is also difficult to adopt the traditional Solder connection, the main collection is to use conductive glue to realize the connection between the two. First, use the glue dispenser to apply adhesive in the center of the pad, and then use the mounter to mount the LED chip based on the adhesive. Dot conductive glue at the connection between the pins of the LED chip and the pad to realize the electrical connection between the pins of the LED chip and the pad.
  • the number of glue dispensing is related to the number of pins of the LED chip.
  • the process of combining the adhesive generally requires Dispensing glue 5 times, the process is complicated and cumbersome; moreover, because the pins of the current LED chip are concentrated at the bottom of the chip, and the conductive glue can only be placed on the outside of the chip, it needs to be realized by oblique dispensing process.
  • the process requirements are relatively high; moreover, since the conductive adhesive is located outside the chip, sufficient contact cannot be achieved between pads on the bottom pins of the chip, and the contact resistance is relatively large; moreover, the conductivity of the conductive adhesive itself is also poor.
  • an object of the present application is to propose a method for manufacturing LED glass screens, so as to solve the problems of complex, cumbersome, low-efficiency, and poor connection quality in the manufacturing process of LED glass screens in the prior art.
  • the manufacturing method of the LED glass screen includes: step 1, providing a transparent glass substrate; step 2, forming a transparent conductive circuit on the surface of the transparent glass substrate; wherein, the transparent conductive circuit Contains several groups of pad electrodes for realizing the electrical connection of LED chips; step 3, mount the LED chips on the pad electrodes, and use liquid metal to realize the connection between the pins of the LED chips and the pad electrodes. Wetting connection; wherein, the liquid metal is in a molten state at room temperature, and the wettability of the liquid metal to the metal provides binding force and electrical conduction between the pins of the LED chip and the pad electrodes.
  • the mounting the LED chip on the pad electrode, and using liquid metal to realize the wetting connection between the pin of the LED chip and the pad electrode specifically includes: Attach liquid metal to the pins of the LED chip, and then mount the LED chip on the pad electrode, so that the pins of the LED chip are in contact with the pad electrode, and the pad electrode in contact with the pin of the LED chip is infiltrated by the liquid metal , to realize the immersion connection between the lead of the LED chip and the pad electrode.
  • the method before mounting the LED chips, further includes: dipping the pins of the LED chips in flux to remove metal oxides on the pins.
  • the liquid metal contains metal components in the leads of the LED chip and/or the pad electrodes.
  • the liquid metal has an alloying reaction with the lead of the LED chip and/or the metal component in the pad electrode.
  • the transparent conductive lines are formed of nano-silver wires or indium tin oxide.
  • an adhesive layer is formed on the transparent glass substrate in the region of the bonding pad for bonding the bottom surface of the LED chip.
  • the method further includes: Encapsulation and reinforcement are performed between the pins of the LED chip and the pad electrodes.
  • Another purpose of the present application is to propose an LED glass screen to solve the problems in the prior art.
  • the LED glass screen includes: a transparent glass substrate, and a transparent conductive circuit formed on the surface of the transparent glass substrate; wherein, the transparent conductive circuit includes several groups to realize the LED chip An electrically connected pad electrode; an LED chip mounted on the pad of the transparent conductive circuit; wherein, the pins of the LED chip and the pad electrode are connected by liquid metal wetting; the liquid metal It is in a molten state at room temperature, and the binding force and electrical conduction between the pins of the LED chip and the pad electrodes are provided by the wettability of the liquid metal to the metal.
  • the LED glass screen further includes: an encapsulation structure for encapsulation and reinforcement between the pins of the LED chip and the pad electrodes.
  • liquid metal is selected as the connection material between the LED chip and the pad, and the wettability of the liquid metal to the metal is used to generate a binding force on the LED chip and the pad, thereby ensuring the connection between the LED chip and the pad to a certain extent.
  • this solution can use the placement machine to impregnate the liquid metal before the LED chip is mounted, so that the liquid metal adheres to the leads of the LED chip.
  • multiple dispensing of conductive adhesive is omitted, which reduces process complexity and improves process efficiency; in addition, the use of liquid metal can achieve full contact between the LED chip and the pad, reducing the contact resistance and ensuring electrical Connection quality.
  • Fig. 1 is the flow chart of the manufacturing method of the LED glass screen in the embodiment of the present application.
  • Fig. 2 is the schematic diagram of the manufacturing method of the LED glass screen in the embodiment of the present application.
  • Fig. 3 is a structure example 1 of the LED glass screen in the embodiment of the present application.
  • Fig. 4 is the structure example 2 of the LED glass screen in the embodiment of the present application.
  • Fig. 5 is a structure example three of the LED glass screen in the embodiment of the present application.
  • Fig. 6 is a structure example 4 of the LED glass screen in the embodiment of the present application.
  • the embodiment of the present application discloses a method for manufacturing an LED glass screen, specifically, as shown in Figure 1-2,
  • Figure 1 is a flow chart of the method for manufacturing an LED glass screen in the embodiment of the application;
  • the manufacturing method of this LED glass screen comprises:
  • Step S11 providing a transparent glass substrate
  • Step S12 forming a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for realizing the electrical connection of the LED chip;
  • Step S13 mounting the LED chip on the pad electrode, and using liquid metal to realize the wetting connection between the pins of the LED chip and the pad electrode;
  • the liquid metal is in a molten state at room temperature, and the binding force and electrical conduction between the pins of the LED chip and the pad electrodes are provided by the wettability of the liquid metal to the metal.
  • liquid metal is selected as the connection material between the LED chip and the pad, and the wettability of the liquid metal to the metal is used to generate a binding force on the LED chip and the pad, thereby ensuring the connection between the LED chip and the pad to a certain extent.
  • this solution can use the placement machine to impregnate the liquid metal before the LED chip is mounted, so that the liquid metal adheres to the leads of the LED chip.
  • multiple dispensing of conductive adhesive is omitted, which reduces process complexity and improves process efficiency; in addition, the use of liquid metal can achieve full contact between the LED chip and the pad, reducing the contact resistance and ensuring electrical Connection quality.
  • the transparent glass substrate in the embodiment of the present application can be conventional transparent glass or high-transparency glass.
  • the transparent conductive circuit in the embodiment of the present application can be formed by one or more of sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, printing, printing, coating
  • the material of the transparent conductive circuit is not limited to simple substances or alloys of copper, silver, gold, nickel, tin, aluminum, etc., conductive metal oxides (such as ITO indium tin oxide), and metal nanowires and metal particles. Filler conductive ink.
  • the transparent conductive circuit in the embodiment of the present application is formed by using indium tin oxide or silver nanowires.
  • the placement of the LED chip in the embodiment of the present application can use the CCD alignment placement equipment in the prior art, so as to realize the precise alignment placement between the LED chip and the pad electrode.
  • the liquid metal in the embodiment of the present application can be selected from liquid metal at room temperature.
  • Liquid metal at room temperature refers to a low melting point metal element or alloy in a molten state at room temperature, that is, the melting point of a low melting point metal element or alloy is not higher than room temperature, and is not limited to Gallium-based alloys such as simple gallium, gallium-indium alloy, gallium-tin alloy, gallium-indium-tin alloy, gallium-indium-tin-zinc alloy, etc.
  • the liquid metal may also contain trace amounts of other metal components, such as copper, silver, gold, nickel, copper, tin, etc., to further enhance the affinity of the liquid metal to the relevant metal surface.
  • the liquid metal can also be a metal paste that can be doped with micro-nano conductive particles in the liquid metal.
  • the micro-nano conductive particles are not limited to gold, silver, copper, nickel, tin, graphene, carbon nanotubes, and conductive carbon. Black and so on.
  • attaching the LED chip on the pad electrode, and using liquid metal to realize the wetting connection between the pins of the LED chip and the pad electrode specifically includes: Liquid metal is attached to the pins of the LED chip, and then the LED chip is mounted on the pad electrode, so that the pins of the LED chip are in contact with the pad electrodes, and the pad electrodes that are in contact with the pins of the LED chip are infiltrated by the liquid metal to realize LED The wetting connection between the pins of the chip and the pad electrodes.
  • the pins of the LED chip can be immersed in the liquid metal, so that the liquid metal can be attached to the pins of the LED chip.
  • This process can be completed by the placement equipment. After the pin is attached, it is directly mounted on the pad electrode of the transparent conductive circuit. This process does not require the assistance of other equipment/tooling, which simplifies the process flow, reduces equipment requirements, and improves production efficiency.
  • step S13 LED chips are mounted at each group of pad electrodes of the transparent conductive circuit, and liquid metal is used to realize the wetting connection between the pins of the LED chip and the pad electrodes.
  • liquid metal is used to realize the wetting connection between the pins of the LED chip and the pad electrodes.
  • it may include: attaching liquid metal to the pad electrode, and then mounting an LED chip on the pad electrode, making the pins of the LED chip contact the pad electrode, and the liquid metal self-wetting the LED in contact with the pad electrode.
  • the lead of the chip realizes the wetting connection between the lead of the LED chip and the pad electrode.
  • the liquid metal can be printed on the pad electrodes by screen printing.
  • the LED chip before mounting the LED chip in step S13 may further include: dipping the pins of the LED chip in flux to remove metal oxide on the surface.
  • the metal oxide on the pin surface of the LED chip is removed by flux, thereby improving the adhesion of the surface to the liquid metal and ensuring the wetting and adhesion of the liquid metal; Impurities, to prevent liquid metal from sticking to the surface of the LED chip shell.
  • the LED chip pins and pad electrodes After the LED chip pins and pad electrodes are connected through liquid metal, they have a certain connection strength. Therefore, the residual flux on the surface can be cleaned by water flow to ensure that the product will not be affected by it during subsequent processing.
  • the flux in the embodiments of the present application can be flux liquid or solder paste, and its main function is to eliminate the metal oxide film formed on the pins of the LED chip due to long-term exposure to air.
  • the metal oxide film formed is mainly tin oxide, and copper oxide may also exist in other cases, so organic acid can be used as the flux Or use flux containing organic acid, the organic salt and water obtained through the reaction can be easily removed, and the residual organic acid can be eliminated by natural evaporation or heat drying.
  • the liquid metal contains metal components in the leads of the LED chip and/or the pad electrodes.
  • the affinity of the liquid metal on the pins and/or pad electrodes of the LED chip can be further strengthened, so that The liquid metal is easier to wet, thereby improving the connection strength between the pins of the LED chip and the pad electrodes.
  • the liquid metal has an alloying reaction with the lead of the LED chip and/or the metal component in the pad electrode.
  • its adhesion is stronger than that of pure metal infiltration, which can make The connection strength between the pins of the LED chip and the pad electrodes is further improved.
  • the alloying reaction between the metals it can be transformed from the wetting force connection of the liquid metal to the solid connection of the alloyed product. , which greatly improves the stable structure between the pins of the LED chip and the pad electrodes.
  • tin ions can also be included in the soldering flux used in the present application; first, tin ions can undergo substitution reactions with metal elements/metal alloys that are more active in low melting point metals, such as gallium, indium, etc. , sodium, potassium, etc. In this way, tin ions are attached to the pins and/or pad electrodes of the LED chip, and the tin element (melted state/free state) melted in the low-melting point metal is extracted from the flux during the process of contacting with the liquid metal.
  • gallium-indium alloy can be selected as the liquid metal, so that the simple substance of tin will spontaneously react with the gallium-indium alloy to obtain gallium-tin alloy, gallium-indium-tin alloy, indium-tin alloy, etc.
  • tin ions can be obtained from any soluble tin salt, such as tin chloride.
  • the LED chip before mounting the LED chip in step S13 may also include: using alcohol to remove excess flux (that is, not covered by liquid metal, exposed flux), to avoid causing damage to subsequent processing.
  • alcohol is also beneficial to remove metal oxides on the surface of liquid metal, thereby improving the wetting effect of liquid metal.
  • alcohol is used to remove excess flux and oxides on the surface of the liquid metal, and the residual alcohol will evaporate quickly without affecting subsequent processing.
  • the LED chip 3 before mounting the LED chip 3 in step S13, it may further include: a transparent film at the position of the non-pad electrode 6 in the pad area of the transparent conductive circuit 2
  • An adhesive layer 7 is formed on the glass substrate 1 (for example, the central position of the pad area) to adhere to the bottom surface of the LED chip 3 , thereby further improving the structural stability of the LED chip 3 on the transparent glass substrate 1 .
  • the adhesive layer 7 can be formed by dispensing glue through a glue dispensing machine (not limited to single-point dispensing or simultaneous dispensing of multiple heads side by side). In other embodiments, it can also be formed by screen printing. .
  • the transparent conductive lines 2 formed on the transparent glass substrate 1 in the embodiment of the present application are in a regular arrangement structure, and some of the pad electrodes 6 on it are mutually connected to each other. Rows/columns are on a straight line, so in the process of dispensing glue, you can directly dispense glue on the pad electrodes in the form of dotted lines to form a linear adhesive layer 7, which can meet the needs of multiple LED chips 3
  • the patch can avoid the problem of low efficiency caused by one-by-one dispensing.
  • LED chips are pasted at each group of pad electrodes of the transparent conductive circuit, and liquid metal is used to realize the connection between the pins of the LED chip and the pad electrodes.
  • liquid metal is used to realize the connection between the pins of the LED chip and the pad electrodes.
  • it may also include: encapsulating and strengthening between the pin 4 of the LED chip 3 and the pad electrode 6, so as to form the packaging structure 8 of the LED chip 3 and the pad electrode 6, so as to ensure The connection strength between the LED chip 3 and the pad electrode 6 .
  • encapsulation and reinforcement between the pins of the LED chip and the pad electrodes is not limited to individual dispensing and encapsulation of each LED chip and the corresponding pad electrodes, and the encapsulation glue can only cover the LED chip.
  • the connection between the pins and the pad electrodes can also cover the LED chips and the pad electrodes as a whole;
  • the electrodes are packaged in one piece.
  • the cover film can be made of a flexible and stretchable material, so as to meet the attachment to multiple sides of the LED chip.
  • the LED chip after the LED chip is mounted on the pad electrode, and the liquid metal is used to realize the wetting connection between the pin of the LED chip and the pad electrode, it may further include: attaching another The transparent glass substrate cover is pressed on the top surface of the LED chip, and then two transparent glass substrates (namely the first transparent glass substrate and the second transparent glass substrate) are fixed to realize the double-layer glass encapsulation LED chip structure. Fixation between transparent glass substrates is not limited to bonding, potting, or surrounding frame modules.
  • the LED chip and the pad electrode have established a good structural strength through liquid metal, it is not easy to cause a gap between the LED chip and the pad electrode during the above-mentioned dispensing, glue filling, film pressing, and cover pressing. Loose to ensure the normal connection between the LED chip and the pad electrodes.
  • a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for matching the LED chip to realize electrical connection;
  • a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for matching the LED chip to realize electrical connection;
  • a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for matching the LED chip to realize electrical connection;
  • FIG. 5 is the third structural example of the LED glass screen in the embodiment of the present application.
  • the LED glass screen can be obtained through the manufacturing method of the LED glass screen in the embodiment of the present application.
  • the LED glass screen includes: a transparent glass substrate 1; a transparent conductive circuit 2 formed on the surface of the transparent glass substrate 1; wherein, the transparent conductive circuit 2 includes several groups of pads for matching with the LED chip 3 to realize electrical connection Electrode 6; LED chip 3 mounted on pad electrode 6 of transparent conductive circuit 2; wherein, liquid metal 5 is wrapped between pin 4 of LED chip 3 and pad electrode 6; LED chip 3 is realized by using liquid metal 5 Wetting connection between the pin 4 of the chip 3 and the pad electrode 6, the binding force and electrical connection between the pin 4 of the LED chip 3 and the pad electrode 6 are provided by the wettability of the metal by the liquid metal 5 conduction.
  • the liquid metal has the same metal composition as the lead and/or pad electrode of the LED chip, so as to improve the wettability of the liquid metal thereon;
  • an alloying reaction can be performed between the liquid metal and the pins and/or pad electrodes of the LED chip, thereby improving the wettability and structural strength of the liquid metal on it;
  • the LED glass screen further includes: an adhesive bond formed on the transparent glass substrate 1 at the position of the non-pad electrode 6 in the pad area of the transparent conductive line 2 (for example, the central position of the pad area) Layer 7 is used to provide adhesion between the LED chip 3 and the transparent glass substrate 1 , thereby ensuring a stable structure between the LED chip 3 and the pad electrode 6 .
  • the adhesive layer 7 can have a linear structure, so as to meet the mounting of multiple LED chips 3 .
  • the LED glass screen further includes: an encapsulation structure 8 formed between the LED chip 3 and the pad electrode 6 , so as to strengthen the connection between the LED chip 3 and the pad electrode 6 .
  • the encapsulation structure is not limited to single-point encapsulation structure and full-cover encapsulation structure; encapsulation material is not limited to cured glue or cover film.
  • the transparent glass substrate 1 formed with transparent conductive lines is the first transparent glass substrate 1, and the LED glass screen also includes: a second transparent glass substrate 9, which is pressed on the LED chip 3 The top surface is used to cooperate with the first transparent glass substrate 1 to form a double-layer glass plate structure for encapsulating the LED chip 3 .
  • Fixation between transparent glass substrates is not limited to bonding, potting, or surrounding frame modules.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present application relates to the technical field of flexible display, and discloses an LED glass screen and a manufacturing method therefor. The manufacturing method for the LED glass screen comprises: forming a transparent conductive circuit on a surface of a transparent glass substrate, wherein the transparent conductive circuit comprises several groups of pad electrodes for implementing electrical connection of an LED chip; and mounting the LED chip onto the pad electrodes, and implementing wetting connection between LED pins and the pad electrodes by using liquid metal. In embodiments of the present application, liquid metal is selected as a connecting material between an LED chip and pads, a bonding force between the LED chip and the pads is generated by using the wettability of the liquid metal to metal, and thus the connection between the LED chip and the pads is ensured to a certain extent. Compared with a multiple-dispensing process, in this solution, before mounting by a surface mounting device, the LED chip is dipped in the liquid metal to make the liquid metal attached onto the pins of the LED chip, thereby omitting multiple times of dispensing of a conductive glue, reducing the process complexity, and improving the process efficiency.

Description

一种LED玻璃屏及其制作方法A kind of LED glass screen and manufacturing method thereof
本申请要求于2021年07月17日提交中国专利局，申请号为202110809401.1，申请名称为“一种LED玻璃屏及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application submitted to the China Patent Office on July 17, 2021, with the application number 202110809401.1, and the application name is "A LED glass screen and its manufacturing method", the entire content of which is incorporated herein by reference. Applying.
技术领域technical field
本申请属于柔性显示技术领域，尤其涉及一种LED玻璃屏及其制作方法。The application belongs to the technical field of flexible display, and in particular relates to an LED glass screen and a manufacturing method thereof.
背景技术Background technique
随着人们日常水平的不断提高，科学技术的不断发展，近些年在透明基板上阵列分布LED灯的透明LED显示屏技术开始出现，并在近两年的市场中逐步得到广泛的应用，发展出各种产品形态，例如LED贴膜屏和LED玻璃屏，LED贴膜屏是通过整体贴装的方式施加在目标玻璃或幕墙上，从而赋予其电子显示的功能，而LED玻璃屏则是直接替代目标玻璃或幕墙使用，两者从结构、用途、制作工艺上均有一定的差异。并且，最近LED贴膜屏方面厂商提出了LED软膜屏的概念，由于具有良好的柔性变形能力，使其可满足异型面的贴装。With the continuous improvement of people's daily level and the continuous development of science and technology, the transparent LED display technology that distributes LED lights in arrays on transparent substrates has begun to appear in recent years, and has gradually been widely used in the market in the past two years. Various product forms, such as LED film screen and LED glass screen, LED film screen is applied to the target glass or curtain wall by the way of integral mounting, so as to endow it with the function of electronic display, while LED glass screen is a direct substitute for the target The use of glass or curtain wall has certain differences in structure, use and production process. Moreover, recently, manufacturers of LED film screens have proposed the concept of LED soft film screens. Due to their good flexible deformation ability, they can meet the mounting requirements of special-shaped surfaces.
LED表面贴装工艺作为LED产品生产中必不可缺的一个环节，其装贴效率对于整个LED产品的生产具有较大的影响；目前，LED玻璃屏生产过程中的贴片工艺，由于其材质、幅宽等因素的原因，导致其难以采用SMT的回流焊工艺，并且ITO(氧化铟锡)与焊锡膏之间的不易结合或结合较差，容易剥落或虚焊等原因也很难采用传统的焊料连接，其主要采集的是利用导电胶实现两者的连接，首先利用点胶机在焊盘中心施加粘接剂，再基于该粘接剂利用贴片机实现LED芯片的贴装，再在LED芯片的引脚与焊盘的连接处点导电胶，实现LED芯片的引脚与焊盘的电连接，点胶次数跟LED芯片的引脚的数量相关，结合粘接剂的工序，一般需要点胶5次，工艺复杂、繁琐；再有，由于目前LED芯片的引脚集中在芯片底部，而导电胶只能点在芯片外侧，需要斜角点胶工艺实现，对于点胶机及点胶工艺要求较高；并且，由于导电胶位于芯片外侧，芯片底部引脚的焊盘之间无法实现充分接触，接触电阻较大；再有，导电胶自身的导电性也较差。LED surface mount technology is an indispensable link in the production of LED products, and its mounting efficiency has a great impact on the production of the entire LED product; Due to factors such as width, it is difficult to adopt the SMT reflow soldering process, and the combination between ITO (indium tin oxide) and solder paste is not easy or poor, easy to peel off or virtual soldering, etc. It is also difficult to adopt the traditional Solder connection, the main collection is to use conductive glue to realize the connection between the two. First, use the glue dispenser to apply adhesive in the center of the pad, and then use the mounter to mount the LED chip based on the adhesive. Dot conductive glue at the connection between the pins of the LED chip and the pad to realize the electrical connection between the pins of the LED chip and the pad. The number of glue dispensing is related to the number of pins of the LED chip. The process of combining the adhesive generally requires Dispensing glue 5 times, the process is complicated and cumbersome; moreover, because the pins of the current LED chip are concentrated at the bottom of the chip, and the conductive glue can only be placed on the outside of the chip, it needs to be realized by oblique dispensing process. For dispensing machines and dispensing The process requirements are relatively high; moreover, since the conductive adhesive is located outside the chip, sufficient contact cannot be achieved between pads on the bottom pins of the chip, and the contact resistance is relatively large; moreover, the conductivity of the conductive adhesive itself is also poor.
申请内容application content
有鉴于此，本申请的一个目的是提出一种LED玻璃屏的制作方法,以解决现有技术中LED玻璃屏的制作工艺，工艺复杂、繁琐、效率低、连接质量差的问题。In view of this, an object of the present application is to propose a method for manufacturing LED glass screens, so as to solve the problems of complex, cumbersome, low-efficiency, and poor connection quality in the manufacturing process of LED glass screens in the prior art.
在一些说明性实施例中，所述LED玻璃屏的制作方法，包括：步骤1、提供一透明玻璃基板；步骤2、在所述透明玻璃基板表面形成透明导电线路；其中，所述透明导电线路包含若干组用以实现LED芯片电连接的焊盘电极；步骤3、将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接；其中，所述液态金属在室温环境下呈熔融状态，由液态金属对金属的浸润性提供所述LED芯片的引脚与所述焊盘电极之间的束缚力和电气导通。In some illustrative embodiments, the manufacturing method of the LED glass screen includes: step 1, providing a transparent glass substrate; step 2, forming a transparent conductive circuit on the surface of the transparent glass substrate; wherein, the transparent conductive circuit Contains several groups of pad electrodes for realizing the electrical connection of LED chips; step 3, mount the LED chips on the pad electrodes, and use liquid metal to realize the connection between the pins of the LED chips and the pad electrodes. Wetting connection; wherein, the liquid metal is in a molten state at room temperature, and the wettability of the liquid metal to the metal provides binding force and electrical conduction between the pins of the LED chip and the pad electrodes.
在一些可选地实施例中，所述将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接，具体包括：在LED芯片的引脚上附着液态金属，再将LED芯片贴装在焊盘电极处，使LED芯片的引脚与焊盘电极接触，由液态金属浸润与LED芯片的引脚接触的焊盘电极，实现LED芯片的引脚与焊盘电极之间的浸润连接。In some optional embodiments, the mounting the LED chip on the pad electrode, and using liquid metal to realize the wetting connection between the pin of the LED chip and the pad electrode, specifically includes: Attach liquid metal to the pins of the LED chip, and then mount the LED chip on the pad electrode, so that the pins of the LED chip are in contact with the pad electrode, and the pad electrode in contact with the pin of the LED chip is infiltrated by the liquid metal , to realize the immersion connection between the lead of the LED chip and the pad electrode.
在一些可选地实施例中，在贴装所述LED芯片之前，还包括：将所述LED芯片的引脚浸渍在助焊剂中，去除引脚上的金属氧化物。In some optional embodiments, before mounting the LED chips, the method further includes: dipping the pins of the LED chips in flux to remove metal oxides on the pins.
在一些可选地实施例中，所述液态金属含有所述LED芯片的引脚和/或所述焊盘电极中的金属成分。In some optional embodiments, the liquid metal contains metal components in the leads of the LED chip and/or the pad electrodes.
在一些可选地实施例中，所述液态金属与所述LED芯片的引脚和/或所述焊盘电极中的金属成分产生合金化反应。In some optional embodiments, the liquid metal has an alloying reaction with the lead of the LED chip and/or the metal component in the pad electrode.
在一些可选地实施例中，所述透明导电线路由纳米银线或氧化铟锡形成。In some optional embodiments, the transparent conductive lines are formed of nano-silver wires or indium tin oxide.
在一些可选地实施例中，在所述焊盘区域内的所述透明玻璃基板上形成粘接层，用以粘接LED芯片的底面。In some optional embodiments, an adhesive layer is formed on the transparent glass substrate in the region of the bonding pad for bonding the bottom surface of the LED chip.
在一些可选地实施例中，所述将LED芯片贴装在所述焊盘上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接之后，还包括：对所述LED芯片的引脚与所述焊盘电极之间进行封装加固。In some optional embodiments, after attaching the LED chip on the pad and using liquid metal to realize the wetting connection between the pin of the LED chip and the electrode of the pad, the method further includes: Encapsulation and reinforcement are performed between the pins of the LED chip and the pad electrodes.
本申请的另一个目的在于提出一种LED玻璃屏，以解决现有技术中问题。Another purpose of the present application is to propose an LED glass screen to solve the problems in the prior art.
在一些说明性实施例中，所述LED玻璃屏，包括：透明玻璃基板、以及形成在所述透明玻璃基板表面上的透明导电线路；其中，所述透明导电线路包含若干组用以实现LED芯片电连接的焊盘电极；贴装在所述透明导电线路的焊盘上的LED芯片；其中，所述LED芯片的引脚与所述焊盘电极之间利用液态金属浸润连接；所述液态金属在室温环境下呈熔融状态，由液态金属对金属的浸润性提供所述LED芯片的引脚与所述焊盘电极之间的束缚力和电气导通。In some illustrative embodiments, the LED glass screen includes: a transparent glass substrate, and a transparent conductive circuit formed on the surface of the transparent glass substrate; wherein, the transparent conductive circuit includes several groups to realize the LED chip An electrically connected pad electrode; an LED chip mounted on the pad of the transparent conductive circuit; wherein, the pins of the LED chip and the pad electrode are connected by liquid metal wetting; the liquid metal It is in a molten state at room temperature, and the binding force and electrical conduction between the pins of the LED chip and the pad electrodes are provided by the wettability of the liquid metal to the metal.
在一些可选地实施例中，所述LED玻璃屏，还包括：对所述LED芯片的引脚与所述焊盘电极之间进行封装加固的封装结构。In some optional embodiments, the LED glass screen further includes: an encapsulation structure for encapsulation and reinforcement between the pins of the LED chip and the pad electrodes.
与现有技术相比，本申请具有如下优势：Compared with the prior art, the present application has the following advantages:
本申请实施例中通过选用液态金属作为LED芯片与焊盘之间的连接材料，利用液态金属对金属的浸润性而产生对LED芯片与焊盘的束缚力，从而在一定程度上保证LED芯片与焊盘之间的连接，相对于导电胶的多次点胶工艺而言，本方案可通过贴片机在LED芯片的贴片之前，浸渍一下液态金属，从而使液态金属附着在LED芯片的引脚上，省略了导电胶的多次点胶，降低了工艺复杂度，提升了工艺效率；另外，利用液态金属可以实现LED芯片与焊盘之间的充分接触，降低了接触电阻，保证了电气连接质量。In the embodiment of the present application, liquid metal is selected as the connection material between the LED chip and the pad, and the wettability of the liquid metal to the metal is used to generate a binding force on the LED chip and the pad, thereby ensuring the connection between the LED chip and the pad to a certain extent. For the connection between the pads, compared with the multiple dispensing process of conductive adhesive, this solution can use the placement machine to impregnate the liquid metal before the LED chip is mounted, so that the liquid metal adheres to the leads of the LED chip. On the feet, multiple dispensing of conductive adhesive is omitted, which reduces process complexity and improves process efficiency; in addition, the use of liquid metal can achieve full contact between the LED chip and the pad, reducing the contact resistance and ensuring electrical Connection quality.
附图说明Description of drawings
图1为本申请实施例中的LED玻璃屏的制作方法的流程图；Fig. 1 is the flow chart of the manufacturing method of the LED glass screen in the embodiment of the present application;
图2为本申请实施例中的LED玻璃屏的制作方法的示意图；Fig. 2 is the schematic diagram of the manufacturing method of the LED glass screen in the embodiment of the present application;
图3为本申请实施例中的LED玻璃屏的结构示例一；Fig. 3 is a structure example 1 of the LED glass screen in the embodiment of the present application;
图4为本申请实施例中的LED玻璃屏的结构示例二；Fig. 4 is the structure example 2 of the LED glass screen in the embodiment of the present application;
图5为本申请实施例中的LED玻璃屏的结构示例三；Fig. 5 is a structure example three of the LED glass screen in the embodiment of the present application;
图6为本申请实施例中的LED玻璃屏的结构示例四。Fig. 6 is a structure example 4 of the LED glass screen in the embodiment of the present application.
具体实施方式detailed description
以下描述和附图充分地示出本申请的具体实施方案，以使本领域的技术人员能 够实践它们。其他实施方案可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施方案的部分和特征可以被包括在或替换其他实施方案的部分和特征。本申请的实施方案的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。在本文中，本申请的这些实施方案可以被单独地或总地用术语“申请”来表示，这仅仅是为了方便，并且如果事实上公开了超过一个的申请，不是要自动地限制该应用的范围为任何单个申请或申请构思。The following description and the accompanying drawings sufficiently illustrate specific embodiments of the application to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present application includes the full scope of the claims, and all available equivalents of the claims. These embodiments of the application may be referred to herein individually or collectively by the term "application", which is for convenience only and is not intended to automatically limit that application if in fact more than one application is disclosed The scope is any single application or application concept.
需要说明的是，在不冲突的情况下本申请实施例中的各技术特征均可以相互结合。It should be noted that the technical features in the embodiments of the present application may be combined with each other without conflict.
本申请实施例公开了一种LED玻璃屏的制作方法，具体地，如图1-2所示，图1为本申请实施例中的LED玻璃屏的制作方法的流程图；图2为本申请实施例中的LED玻璃屏的制作方法的示意图；该LED玻璃屏的制作方法，包括：The embodiment of the present application discloses a method for manufacturing an LED glass screen, specifically, as shown in Figure 1-2, Figure 1 is a flow chart of the method for manufacturing an LED glass screen in the embodiment of the application; The schematic diagram of the manufacturing method of LED glass screen in the embodiment; The manufacturing method of this LED glass screen comprises:
步骤S11、提供一透明玻璃基板；Step S11, providing a transparent glass substrate;
步骤S12、在所述透明玻璃基板表面形成透明导电线路；其中，所述透明导电线路包含若干组用以实现LED芯片电连接的焊盘电极；Step S12, forming a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for realizing the electrical connection of the LED chip;
步骤S13、将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接；Step S13, mounting the LED chip on the pad electrode, and using liquid metal to realize the wetting connection between the pins of the LED chip and the pad electrode;
其中，所述液态金属在室温环境下呈熔融状态，由液态金属对金属的浸润性提供所述LED芯片的引脚与所述焊盘电极之间的束缚力和电气导通。Wherein, the liquid metal is in a molten state at room temperature, and the binding force and electrical conduction between the pins of the LED chip and the pad electrodes are provided by the wettability of the liquid metal to the metal.
本申请实施例中通过选用液态金属作为LED芯片与焊盘之间的连接材料，利用液态金属对金属的浸润性而产生对LED芯片与焊盘的束缚力，从而在一定程度上保证LED芯片与焊盘之间的连接，相对于导电胶的多次点胶工艺而言，本方案可通过贴片机在LED芯片的贴片之前，浸渍一下液态金属，从而使液态金属附着在LED芯片的引脚上，省略了导电胶的多次点胶，降低了工艺复杂度，提升了工艺效率；另外，利用液态金属可以实现LED芯片与焊盘之间的充分接触，降低了接触电阻，保证了电气连接质量。In the embodiment of the present application, liquid metal is selected as the connection material between the LED chip and the pad, and the wettability of the liquid metal to the metal is used to generate a binding force on the LED chip and the pad, thereby ensuring the connection between the LED chip and the pad to a certain extent. For the connection between the pads, compared with the multiple dispensing process of conductive adhesive, this solution can use the placement machine to impregnate the liquid metal before the LED chip is mounted, so that the liquid metal adheres to the leads of the LED chip. On the feet, multiple dispensing of conductive adhesive is omitted, which reduces process complexity and improves process efficiency; in addition, the use of liquid metal can achieve full contact between the LED chip and the pad, reducing the contact resistance and ensuring electrical Connection quality.
本申请实施例中的透明玻璃基板可以选用常规透明玻璃或高透玻璃。The transparent glass substrate in the embodiment of the present application can be conventional transparent glass or high-transparency glass.
本申请实施例中的透明导电线路可通过溅射、化学蚀刻、机械雕刻、激光雕刻、蒸镀、化学气相沉积、物理气相沉积、直写、打印、印刷、涂布中的一种或多种方式形成；透明导电线路的材质不限于铜、银、金、镍、锡、铝等的单质或合金、导电的金属氧化物(如ITO氧化铟锡)、以及以金属纳米线、金属颗粒为导电填料的导电油墨。优选地，本申请实施例中的透明导电线路采用氧化铟锡或银纳米线形成。The transparent conductive circuit in the embodiment of the present application can be formed by one or more of sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, printing, printing, coating The material of the transparent conductive circuit is not limited to simple substances or alloys of copper, silver, gold, nickel, tin, aluminum, etc., conductive metal oxides (such as ITO indium tin oxide), and metal nanowires and metal particles. Filler conductive ink. Preferably, the transparent conductive circuit in the embodiment of the present application is formed by using indium tin oxide or silver nanowires.
本申请实施例中的LED芯片的贴装可以使用现有技术中CCD对位贴片设备，以此实现LED芯片与焊盘电极之间的精准对位贴装。The placement of the LED chip in the embodiment of the present application can use the CCD alignment placement equipment in the prior art, so as to realize the precise alignment placement between the LED chip and the pad electrode.
本申请实施例中的液态金属可以选用室温液态金属，室温液态金属是指在室温环境下呈现熔融状态的低熔点金属单质或合金，即低熔点金属单质或合金的熔点不高于室温，不限于镓单质、镓铟合金、镓锡合金、镓铟锡合金、镓铟锡锌合金等镓基合金。除此之外，液态金属中还可以包含微量的其它金属成分，用以进一步提升液态金属对相关金属表面的亲和性，金属成分例如铜、银、金、镍、铜、锡等。在一些实施例中，液态金属亦可选用液态金属中可掺杂微纳米导电颗粒的金属膏，微纳米导电颗粒不限于金、银、铜、镍、锡、石墨烯、碳纳米管、导电炭黑等。The liquid metal in the embodiment of the present application can be selected from liquid metal at room temperature. Liquid metal at room temperature refers to a low melting point metal element or alloy in a molten state at room temperature, that is, the melting point of a low melting point metal element or alloy is not higher than room temperature, and is not limited to Gallium-based alloys such as simple gallium, gallium-indium alloy, gallium-tin alloy, gallium-indium-tin alloy, gallium-indium-tin-zinc alloy, etc. In addition, the liquid metal may also contain trace amounts of other metal components, such as copper, silver, gold, nickel, copper, tin, etc., to further enhance the affinity of the liquid metal to the relevant metal surface. In some embodiments, the liquid metal can also be a metal paste that can be doped with micro-nano conductive particles in the liquid metal. The micro-nano conductive particles are not limited to gold, silver, copper, nickel, tin, graphene, carbon nanotubes, and conductive carbon. Black and so on.
在一些实施例中，所述将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接，具体包括：在LED芯片的引脚上附着液态金属，再将LED芯片贴装在焊盘电极处，使LED芯片的引脚与焊盘电极接触，由液态金属浸润与LED芯片的引脚接触的焊盘电极，实现LED芯片的引脚与焊盘电极之间的浸润连接。In some embodiments, attaching the LED chip on the pad electrode, and using liquid metal to realize the wetting connection between the pins of the LED chip and the pad electrode, specifically includes: Liquid metal is attached to the pins of the LED chip, and then the LED chip is mounted on the pad electrode, so that the pins of the LED chip are in contact with the pad electrodes, and the pad electrodes that are in contact with the pins of the LED chip are infiltrated by the liquid metal to realize LED The wetting connection between the pins of the chip and the pad electrodes.
该实施例中可以通过将LED芯片的引脚浸渍在液态金属中，从而使液态金属附着在LED芯片的引脚上，该工艺可由贴片设备完成，贴片设备在完成液态金属在LED芯片的引脚上的附着后，直接将其贴装在透明导电线路的焊盘电极处，该过程无需其它设备/工装的辅助，简化了工艺流程，降低了设备要求，提高了制作效率。In this embodiment, the pins of the LED chip can be immersed in the liquid metal, so that the liquid metal can be attached to the pins of the LED chip. This process can be completed by the placement equipment. After the pin is attached, it is directly mounted on the pad electrode of the transparent conductive circuit. This process does not require the assistance of other equipment/tooling, which simplifies the process flow, reduces equipment requirements, and improves production efficiency.
在另一些实施例中，步骤S13的在所述透明导电线路的每组焊盘电极处贴装LED芯片，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接，具体可包括：在焊盘电极上附着液态金属，再在该焊盘电极上贴装LED芯片，使LED芯片的引脚与焊盘电极接触，由液态金属自行浸润与焊盘电极接触的LED芯片的引 脚，实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接。In some other embodiments, in step S13, LED chips are mounted at each group of pad electrodes of the transparent conductive circuit, and liquid metal is used to realize the wetting connection between the pins of the LED chip and the pad electrodes. Specifically, it may include: attaching liquid metal to the pad electrode, and then mounting an LED chip on the pad electrode, making the pins of the LED chip contact the pad electrode, and the liquid metal self-wetting the LED in contact with the pad electrode. The lead of the chip realizes the wetting connection between the lead of the LED chip and the pad electrode.
该实施例中可以通过丝网印刷的方式将液态金属印刷在焊盘电极上，在另一些实施例中，亦可通过在透明导电线路的非焊盘电极处形成覆盖膜，然后利用喷涂或浸渍的方式使液态金属附着在焊盘电极上，该工艺通过一次性大范围的实现液态金属附着，无需对每个LED芯片进行一次浸渍操作，提升了制作效率，尤其适用于多LED芯片、大范围的同时贴装。In this embodiment, the liquid metal can be printed on the pad electrodes by screen printing. In other embodiments, it is also possible to form a cover film at the non-pad electrodes of the transparent conductive circuit, and then use spraying or dipping to The method makes the liquid metal adhere to the pad electrode. This process realizes the liquid metal adhesion in a large area at one time, without the need to perform a dipping operation on each LED chip, which improves the production efficiency, especially suitable for multiple LED chips, large-scale mounted at the same time.
在一些实施例中，在步骤S13的在贴装所述LED芯片之前，还可包括：将所述LED芯片的引脚浸渍在助焊剂中，去除表面上的金属氧化物。该实施例中通过助焊剂去除LED芯片的引脚表面的金属氧化物，从而提升其表面对液态金属的附着力，保证液态金属的浸润附着；另外，也有助于去除LED芯片非引脚区域的杂质，避免液态金属粘连LED芯片壳体表面。在LED芯片的引脚和焊盘电极通过液态金属建立连接后，具有一定的连接强度，因此可利用水流清洗表面残留的助焊剂，保证产品在后续加工的过程中不受其影响。In some embodiments, before mounting the LED chip in step S13, it may further include: dipping the pins of the LED chip in flux to remove metal oxide on the surface. In this embodiment, the metal oxide on the pin surface of the LED chip is removed by flux, thereby improving the adhesion of the surface to the liquid metal and ensuring the wetting and adhesion of the liquid metal; Impurities, to prevent liquid metal from sticking to the surface of the LED chip shell. After the LED chip pins and pad electrodes are connected through liquid metal, they have a certain connection strength. Therefore, the residual flux on the surface can be cleaned by water flow to ensure that the product will not be affected by it during subsequent processing.
本申请实施例中的助焊剂可采用助焊液，亦可采用助焊膏，其主要功能是用于消除LED芯片的引脚上由于长期暴露空气中形成的金属氧化膜。优选地，鉴于目前LED芯片的引脚主要是以锡包铜为主，所形成的金属氧化膜主要是氧化锡，在其他情况下可能还会存在氧化铜，因此可通过以有机酸作为助焊剂或使用包含有机酸的助焊剂，通过反应得到的有机盐和水，易于排除，残余的有机酸则可通过自然蒸发或热烘的方式消除。The flux in the embodiments of the present application can be flux liquid or solder paste, and its main function is to eliminate the metal oxide film formed on the pins of the LED chip due to long-term exposure to air. Preferably, in view of the fact that the pins of the current LED chip are mainly tin-clad copper, the metal oxide film formed is mainly tin oxide, and copper oxide may also exist in other cases, so organic acid can be used as the flux Or use flux containing organic acid, the organic salt and water obtained through the reaction can be easily removed, and the residual organic acid can be eliminated by natural evaporation or heat drying.
在一些实施例中，所述液态金属含有所述LED芯片的引脚和/或所述焊盘电极中的金属成分。该实施例中由于液态金属中含有与LED芯片的引脚和/或焊盘电极中相同的金属成分，可进一步加强液态金属在LED芯片的引脚和/或焊盘电极的亲和性，使液态金属更易浸润，从而提升LED芯片的引脚与焊盘电极的连接强度。In some embodiments, the liquid metal contains metal components in the leads of the LED chip and/or the pad electrodes. In this embodiment, since the liquid metal contains the same metal components as the pins and/or pad electrodes of the LED chip, the affinity of the liquid metal on the pins and/or pad electrodes of the LED chip can be further strengthened, so that The liquid metal is easier to wet, thereby improving the connection strength between the pins of the LED chip and the pad electrodes.
在一些实施例中，所述液态金属与所述LED芯片的引脚和/或所述焊盘电极中的金属成分产生合金化反应。该实施例中基于液态金属与LED芯片的引脚和/或所述焊盘电极中的金属成分的合金化反应，一方面相比于单纯的金属浸润而言，其附着力更强，可使LED芯片的引脚与焊盘电极之间的连接强度进一步的提升，另一方面， 由于金属间的合金化反应，可使其从利用液态金属的浸润力连接，转变为合金化产品的固态连接，极大的提升LED芯片的引脚与焊盘电极之间的稳固结构。In some embodiments, the liquid metal has an alloying reaction with the lead of the LED chip and/or the metal component in the pad electrode. In this embodiment, based on the alloying reaction between the liquid metal and the metal component in the lead of the LED chip and/or the pad electrode, on the one hand, its adhesion is stronger than that of pure metal infiltration, which can make The connection strength between the pins of the LED chip and the pad electrodes is further improved. On the other hand, due to the alloying reaction between the metals, it can be transformed from the wetting force connection of the liquid metal to the solid connection of the alloyed product. , which greatly improves the stable structure between the pins of the LED chip and the pad electrodes.
在一些实施例中，本申请所使用的助焊剂中还可包括锡离子；首先，锡离子可与低熔点金属中比其活性更靠前的金属单质/金属合金发生置换反应，如镓、铟、钠、钾等。从而使LED芯片的引脚和/或焊盘电极上附着锡离子，在与液态金属接触的过程中，从助焊剂中提取融于低熔点金属中的锡单质(熔融态/游离态)。优选地，液态金属可选用镓铟合金，使锡单质又会自发的与镓铟合金产生合金反应，得到的如镓锡合金、镓铟锡合金、铟锡合金等。其中，锡离子可通过任何可溶锡盐中获得，如氯化锡。In some embodiments, tin ions can also be included in the soldering flux used in the present application; first, tin ions can undergo substitution reactions with metal elements/metal alloys that are more active in low melting point metals, such as gallium, indium, etc. , sodium, potassium, etc. In this way, tin ions are attached to the pins and/or pad electrodes of the LED chip, and the tin element (melted state/free state) melted in the low-melting point metal is extracted from the flux during the process of contacting with the liquid metal. Preferably, gallium-indium alloy can be selected as the liquid metal, so that the simple substance of tin will spontaneously react with the gallium-indium alloy to obtain gallium-tin alloy, gallium-indium-tin alloy, indium-tin alloy, etc. Among them, tin ions can be obtained from any soluble tin salt, such as tin chloride.
在一些实施例中，在步骤S13的在贴装所述LED芯片之前，还可包括：利用酒精去除多余的助焊剂(即未被液态金属遮盖，暴露在外的助焊剂)，避免对后续加工造成影响；除此之外，酒精还有利于去除液态金属表面上的金属氧化物，从而提升液态金属的浸润效果。该实施例中采用酒精去除多余助焊剂和液态金属表面氧化物，残留的酒精会快速挥发，不会对后续加工造成影响。In some embodiments, before mounting the LED chip in step S13, it may also include: using alcohol to remove excess flux (that is, not covered by liquid metal, exposed flux), to avoid causing damage to subsequent processing. In addition, alcohol is also beneficial to remove metal oxides on the surface of liquid metal, thereby improving the wetting effect of liquid metal. In this embodiment, alcohol is used to remove excess flux and oxides on the surface of the liquid metal, and the residual alcohol will evaporate quickly without affecting subsequent processing.
如图3所示，在一些实施例中，在步骤S13的在贴装所述LED芯片3之前，还可包括：在透明导电线路2的焊盘区域内的非焊盘电极6位置处的透明玻璃基板1(例如焊盘区域的中心位置)上形成粘接层7，用以粘附LED芯片3的底面，从而可以进一步提升LED芯片3在透明玻璃基板1上的结构稳定。该粘接层7可以利用胶粘剂通过点胶机以点胶的方式形成(不限于单点式点胶或多头并排同时点胶)，在另一些实施例中，亦可采用丝网印刷的方式形成。As shown in FIG. 3 , in some embodiments, before mounting the LED chip 3 in step S13, it may further include: a transparent film at the position of the non-pad electrode 6 in the pad area of the transparent conductive circuit 2 An adhesive layer 7 is formed on the glass substrate 1 (for example, the central position of the pad area) to adhere to the bottom surface of the LED chip 3 , thereby further improving the structural stability of the LED chip 3 on the transparent glass substrate 1 . The adhesive layer 7 can be formed by dispensing glue through a glue dispensing machine (not limited to single-point dispensing or simultaneous dispensing of multiple heads side by side). In other embodiments, it can also be formed by screen printing. .
如图4所示，优选地，本申请实施例中形成在透明玻璃基板1上的透明导电线路2为规整排布结构，其上的所有焊盘电极6中的部分焊盘电极相互之间为成行/成列等在一条直线上，因此在点胶的过程中可以直接以点划线的方式在焊盘电极上点胶，形成直线形的粘接层7，从而可以满足多个LED芯片3的贴片，避免逐个式点胶造成的效率低的问题。As shown in FIG. 4 , preferably, the transparent conductive lines 2 formed on the transparent glass substrate 1 in the embodiment of the present application are in a regular arrangement structure, and some of the pad electrodes 6 on it are mutually connected to each other. Rows/columns are on a straight line, so in the process of dispensing glue, you can directly dispense glue on the pad electrodes in the form of dotted lines to form a linear adhesive layer 7, which can meet the needs of multiple LED chips 3 The patch can avoid the problem of low efficiency caused by one-by-one dispensing.
如图5所示，在一些实施例中，在所述透明导电线路的每组焊盘电极处贴装LED芯片，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接之后， 还可包括：对所述LED芯片3的引脚4与所述焊盘电极6之间进行封装加固，从而在形成LED芯片3和焊盘电极6的封装结构8，以此保证LED芯片3与焊盘电极6之间的连接强度。As shown in Figure 5, in some embodiments, LED chips are pasted at each group of pad electrodes of the transparent conductive circuit, and liquid metal is used to realize the connection between the pins of the LED chip and the pad electrodes. After the wetting connection, it may also include: encapsulating and strengthening between the pin 4 of the LED chip 3 and the pad electrode 6, so as to form the packaging structure 8 of the LED chip 3 and the pad electrode 6, so as to ensure The connection strength between the LED chip 3 and the pad electrode 6 .
该实施例中对所述LED芯片的引脚与所述焊盘电极之间进行封装加固，不限于对每个LED芯片与相应的焊盘电极进行单独点胶封装，封装胶可仅覆盖LED芯片的引脚与焊盘电极的连接处，也可以整体覆盖LED芯片与焊盘电极；在另一些实施例中，亦可通过在透明玻璃基板上浇筑流化胶，从而对所有LED芯片与焊盘电极进行一体化封装。再有，也可以通过对覆盖膜的方式对所有LED芯片与焊盘电极进行一体化封装，利用抽真空的方式使覆盖膜对紧密的贴附在暴露在外的透明玻璃基板、LED芯片、焊盘电极上。优选地，该覆盖膜可选用柔性可拉伸材料，以此满足对LED芯片多个面的贴附。In this embodiment, encapsulation and reinforcement between the pins of the LED chip and the pad electrodes is not limited to individual dispensing and encapsulation of each LED chip and the corresponding pad electrodes, and the encapsulation glue can only cover the LED chip. The connection between the pins and the pad electrodes can also cover the LED chips and the pad electrodes as a whole; The electrodes are packaged in one piece. Furthermore, it is also possible to package all LED chips and pad electrodes in an integrated manner by means of a cover film, and use vacuuming to make the cover film tightly adhere to the exposed transparent glass substrate, LED chips, and pads. on the electrode. Preferably, the cover film can be made of a flexible and stretchable material, so as to meet the attachment to multiple sides of the LED chip.
在一些实施例中，将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接之后，还可包括：将另一透明玻璃基板盖压在LED芯片的顶面，然后固定两块透明玻璃基板(即第一透明玻璃基板和第二透明玻璃基板)，实现双层玻璃封装LED芯片结构。透明玻璃基板之间的固定不限于粘接、灌胶填充或四周框架模组等。In some embodiments, after the LED chip is mounted on the pad electrode, and the liquid metal is used to realize the wetting connection between the pin of the LED chip and the pad electrode, it may further include: attaching another The transparent glass substrate cover is pressed on the top surface of the LED chip, and then two transparent glass substrates (namely the first transparent glass substrate and the second transparent glass substrate) are fixed to realize the double-layer glass encapsulation LED chip structure. Fixation between transparent glass substrates is not limited to bonding, potting, or surrounding frame modules.
该实施例中由于LED芯片与焊盘电极通过液态金属建立了良好的结构强度，因此在上述点胶、灌胶、压膜、盖压的过程中，不易造成LED芯片与焊盘电极之间的松动，保证LED芯片与焊盘电极之间的正常连接。In this embodiment, because the LED chip and the pad electrode have established a good structural strength through liquid metal, it is not easy to cause a gap between the LED chip and the pad electrode during the above-mentioned dispensing, glue filling, film pressing, and cover pressing. Loose to ensure the normal connection between the LED chip and the pad electrodes.
实施例1Example 1
a.在透明玻璃基板的表面上形成透明导电线路；其中，所述透明导电线路包含若干组用以配合LED芯片实现电连接的焊盘电极；a. Form a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for matching the LED chip to realize electrical connection;
b.利用CCD贴片机抓取LED芯片，并将LED芯片的引脚浸渍在液态金属池中，从而使LED芯片的引脚附着液态金属；b. Use the CCD placement machine to grab the LED chip, and dip the pins of the LED chip in the liquid metal pool, so that the pins of the LED chip are attached to the liquid metal;
c.将LED芯片贴装在焊盘电极上，使液态金属浸润与LED芯片的引脚接触的焊盘电极，利用液态金属建立LED芯片的引脚与焊盘电极的浸润连接；c. mount the LED chip on the pad electrode, make the liquid metal infiltrate the pad electrode in contact with the pin of the LED chip, and use the liquid metal to establish the wetting connection between the pin of the LED chip and the pad electrode;
d.重复步骤b和c，直至LED芯片的全部贴装完成。d. Repeat steps b and c until all LED chips are mounted.
实施例2Example 2
a.在透明玻璃基板的表面上形成透明导电线路；其中，所述透明导电线路包含若干组用以配合LED芯片实现电连接的焊盘电极；a. Form a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for matching the LED chip to realize electrical connection;
b.利用CCD贴片机抓取LED芯片，将LED芯片的引脚浸渍在助焊剂中；b. Use the CCD mounter to grab the LED chip, and dip the pins of the LED chip in the flux;
c.将LED芯片的引脚浸渍在液态金属池中，从而使LED芯片的引脚附着液态金属；c. Dip the pins of the LED chip in the liquid metal pool, so that the pins of the LED chip are attached to the liquid metal;
d.将LED芯片贴装在焊盘电极上，使液态金属浸润与LED芯片的引脚接触的焊盘电极，利用液态金属建立LED芯片的引脚与焊盘电极的浸润连接；d. mount the LED chip on the pad electrode, make the liquid metal infiltrate the pad electrode in contact with the pin of the LED chip, and use the liquid metal to establish the wetting connection between the pin of the LED chip and the pad electrode;
d.重复步骤b、c和d，直至LED芯片的全部贴装完成。d. Repeat steps b, c and d until all the mounting of the LED chips is completed.
实施例3Example 3
a.在透明玻璃基板的表面上形成透明导电线路；其中，所述透明导电线路包含若干组用以配合LED芯片实现电连接的焊盘电极；a. Form a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for matching the LED chip to realize electrical connection;
b.利用CCD贴片机抓取LED芯片，将LED芯片的引脚浸渍在助焊剂中；b. Use the CCD mounter to grab the LED chip, and dip the pins of the LED chip in the flux;
c.将LED芯片的引脚浸渍在液态金属池中，从而使LED芯片的引脚附着液态金属；c. Dip the pins of the LED chip in the liquid metal pool, so that the pins of the LED chip are attached to the liquid metal;
d.将LED芯片的引脚浸渍在酒精中；d. Dip the pins of the LED chip in alcohol;
e.将LED芯片贴装在焊盘电极上，使液态金属浸润与LED芯片的引脚接触的焊盘电极，利用液态金属建立LED芯片的引脚与焊盘电极的浸润连接；e. mount the LED chip on the pad electrode, make the liquid metal infiltrate the pad electrode in contact with the pin of the LED chip, and use the liquid metal to establish the wetting connection between the pin of the LED chip and the pad electrode;
f.重复步骤b、c、d和e，直至LED芯片的全部贴装完成。f. Repeat steps b, c, d and e until all LED chips are mounted.
本申请实施例中还公开了一种LED玻璃屏，具体的，如图3-5所示，图3为本申请实施例中的LED玻璃屏的结构示例一；图4为本申请实施例中的LED玻璃屏的结构示例二；图5为本申请实施例中的LED玻璃屏的结构示例三。该LED玻璃屏可通过本申请实施例的LED玻璃屏的制作方法获得。具体地，该LED玻璃屏，包括：透明玻璃基板1；形成在透明玻璃基板1表面上的透明导电线路2；其中，透明导电线路2包含若干组用以配合LED芯片3实现电连接的焊盘电极6；贴装在透明导电线路2的焊盘电极6上的LED芯片3；其中，LED芯片3的引脚4与焊盘电极6之间包绕有液态金属5；利用液态金属5实现LED芯片3的引脚4与焊盘电极6之间 的浸润连接，由液态金属5对金属的浸润性提供所述LED芯片3的引脚4与所述焊盘电极6之间的束缚力和电气导通。An LED glass screen is also disclosed in the embodiment of the present application, specifically, as shown in Figure 3-5, Figure 3 is a structure example 1 of the LED glass screen in the embodiment of the present application; The second structural example of the LED glass screen; FIG. 5 is the third structural example of the LED glass screen in the embodiment of the present application. The LED glass screen can be obtained through the manufacturing method of the LED glass screen in the embodiment of the present application. Specifically, the LED glass screen includes: a transparent glass substrate 1; a transparent conductive circuit 2 formed on the surface of the transparent glass substrate 1; wherein, the transparent conductive circuit 2 includes several groups of pads for matching with the LED chip 3 to realize electrical connection Electrode 6; LED chip 3 mounted on pad electrode 6 of transparent conductive circuit 2; wherein, liquid metal 5 is wrapped between pin 4 of LED chip 3 and pad electrode 6; LED chip 3 is realized by using liquid metal 5 Wetting connection between the pin 4 of the chip 3 and the pad electrode 6, the binding force and electrical connection between the pin 4 of the LED chip 3 and the pad electrode 6 are provided by the wettability of the metal by the liquid metal 5 conduction.
在一些实施例中，液态金属与LED芯片的引脚和/或焊盘电极之间具有相同的金属成分，以此提升液态金属在其上的浸润性；In some embodiments, the liquid metal has the same metal composition as the lead and/or pad electrode of the LED chip, so as to improve the wettability of the liquid metal thereon;
在一些实施例中，液态金属与LED芯片的引脚和/或焊盘电极之间可进行合金化反应，从而提升液态金属在其上的浸润性及结构强度；In some embodiments, an alloying reaction can be performed between the liquid metal and the pins and/or pad electrodes of the LED chip, thereby improving the wettability and structural strength of the liquid metal on it;
在一些实施例中，LED玻璃屏，还包括：形成在透明导电线路2的焊盘区域内的非焊盘电极6位置处的透明玻璃基板1(例如焊盘区域的中心位置)上的粘接层7，用以提供LED芯片3与透明玻璃基板1之间的粘附力，从而保证LED芯片3与焊盘电极6之间的稳定结构。优选地，粘接层7可为直线形结构，以此满足多个LED芯片3的贴装。In some embodiments, the LED glass screen further includes: an adhesive bond formed on the transparent glass substrate 1 at the position of the non-pad electrode 6 in the pad area of the transparent conductive line 2 (for example, the central position of the pad area) Layer 7 is used to provide adhesion between the LED chip 3 and the transparent glass substrate 1 , thereby ensuring a stable structure between the LED chip 3 and the pad electrode 6 . Preferably, the adhesive layer 7 can have a linear structure, so as to meet the mounting of multiple LED chips 3 .
在一些实施例中，LED玻璃屏，还包括：形成在LED芯片3和焊盘电极6之间的封装结构8，以此实现对LED芯片3与焊盘电极6之间连接的加固。该封装结构不限于单点式封装结构、全覆式封装结构；封装材料不限于固化胶或覆盖膜。In some embodiments, the LED glass screen further includes: an encapsulation structure 8 formed between the LED chip 3 and the pad electrode 6 , so as to strengthen the connection between the LED chip 3 and the pad electrode 6 . The encapsulation structure is not limited to single-point encapsulation structure and full-cover encapsulation structure; encapsulation material is not limited to cured glue or cover film.
如图6所示，在一些实施例中，形成有透明导电线路的透明玻璃基板1为第一透明玻璃基板1，LED玻璃屏，还包括：第二透明玻璃基板9，盖压在LED芯片3的顶面，用以配合第一透明玻璃基板1组成封装LED芯片3的双层玻璃板结构。透明玻璃基板之间的固定不限于粘接、灌胶填充或四周框架模组等。As shown in Figure 6, in some embodiments, the transparent glass substrate 1 formed with transparent conductive lines is the first transparent glass substrate 1, and the LED glass screen also includes: a second transparent glass substrate 9, which is pressed on the LED chip 3 The top surface is used to cooperate with the first transparent glass substrate 1 to form a double-layer glass plate structure for encapsulating the LED chip 3 . Fixation between transparent glass substrates is not limited to bonding, potting, or surrounding frame modules.
本领域技术人员还应当理解，结合本文的实施例描述的各种说明性的逻辑框、模块、电路和算法步骤均可以实现成电子硬件、计算机软件或其组合。为了清楚地说明硬件和软件之间的可交换性，上面对各种说明性的部件、框、模块、电路和步骤均围绕其功能进行了一般地描述。至于这种功能是实现成硬件还是实现成软件，取决于特定的应用和对整个***所施加的设计约束条件。熟练的技术人员可以针对每个特定应用，以变通的方式实现所描述的功能，但是，这种实现决策不应解释为背离本公开的保护范围。Those skilled in the art should also understand that various illustrative logical blocks, modules, circuits and algorithm steps described in conjunction with the embodiments herein may be implemented as electronic hardware, computer software or a combination thereof. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims (17)

  1. 一种LED玻璃屏的制作方法，其特征在于，包括：A method for manufacturing an LED glass screen, characterized in that it comprises:
    步骤1、提供一透明玻璃基板；Step 1, providing a transparent glass substrate;
    步骤2、在所述透明玻璃基板表面形成透明导电线路；其中，所述透明导电线路包含若干组用以实现LED芯片电连接的焊盘电极；Step 2, forming a transparent conductive line on the surface of the transparent glass substrate; wherein, the transparent conductive line includes several groups of pad electrodes for realizing the electrical connection of the LED chip;
    步骤3、将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接；Step 3, mount the LED chip on the pad electrode, and use liquid metal to realize the wetting connection between the pins of the LED chip and the pad electrode;
    其中，所述液态金属在室温环境下呈熔融状态，由液态金属对金属的浸润性提供所述LED芯片的引脚与所述焊盘电极之间的束缚力和电气导通。Wherein, the liquid metal is in a molten state at room temperature, and the binding force and electrical conduction between the pins of the LED chip and the pad electrodes are provided by the wettability of the liquid metal to the metal.
  2. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接，具体包括：The manufacturing method of the LED glass screen according to claim 1, wherein the LED chip is mounted on the pad electrode, and the pins of the LED chip and the pad electrode are realized by using liquid metal. Infiltrating connections between, specifically include:
    在LED芯片的引脚上附着液态金属，再将LED芯片贴装在焊盘电极处，使LED芯片的引脚与焊盘电极接触，由液态金属浸润与LED芯片的引脚接触的焊盘电极，实现LED芯片的引脚与焊盘电极之间的浸润连接。Attach liquid metal to the pins of the LED chip, and then mount the LED chip on the pad electrode, so that the pins of the LED chip are in contact with the pad electrode, and the pad electrode in contact with the pin of the LED chip is infiltrated by the liquid metal , to realize the immersion connection between the lead of the LED chip and the pad electrode.
  3. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述将LED芯片贴装在所述焊盘电极上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接，具体包括：The manufacturing method of the LED glass screen according to claim 1, wherein the LED chip is mounted on the pad electrode, and the pins of the LED chip and the pad electrode are realized by using liquid metal. Infiltrating connections between, specifically include:
    在焊盘电极上附着液态金属，再在该焊盘电极上贴装LED芯片，使LED芯片的引脚与焊盘电极接触，由液态金属自行浸润与焊盘电极接触的LED芯片的引脚，实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接。Attach liquid metal on the pad electrode, and then mount the LED chip on the pad electrode, so that the pins of the LED chip are in contact with the pad electrode, and the liquid metal infiltrates the pins of the LED chip that are in contact with the pad electrode. The wetting connection between the pins of the LED chip and the pad electrodes is realized.
  4. 根据权利要求3所述的LED玻璃屏的制作方法，其特征在于，通过丝网印刷的方式在所述焊盘电极上附着液态金属。The manufacturing method of the LED glass screen according to claim 3, characterized in that the liquid metal is attached to the pad electrode by screen printing.
  5. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，在贴装所述LED芯片之前，还包括：The method for manufacturing an LED glass screen according to claim 1, further comprising: before mounting the LED chips:
    将所述LED芯片的引脚浸渍在助焊剂中，去除引脚上的金属氧化物。Dip the pins of the LED chip in flux to remove the metal oxide on the pins.
  6. 根据权利要求5所述的LED玻璃屏的制作方法，其特征在于，在所述将所述 LED芯片的引脚和/或焊盘电极浸渍在助焊剂中，去除表面上的金属氧化物之后，还包括：利用酒精去除残余的助焊剂。The manufacturing method of the LED glass screen according to claim 5, characterized in that, after the pins and/or pad electrodes of the LED chip are dipped in flux to remove metal oxides on the surface, Also includes: Using alcohol to remove residual flux.
  7. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述液态金属含有所述LED芯片的引脚和/或所述焊盘电极中的金属成分。The method for manufacturing an LED glass screen according to claim 1, wherein the liquid metal contains metal components in the pins of the LED chip and/or the pad electrodes.
  8. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述液态金属与所述LED芯片的引脚和/或所述焊盘电极中的金属成分产生合金化反应。The manufacturing method of the LED glass screen according to claim 1, characterized in that, the liquid metal has an alloying reaction with the pins of the LED chip and/or the metal components in the pad electrodes.
  9. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述透明导电线路通过溅射、化学蚀刻、机械雕刻、激光雕刻、蒸镀、化学气相沉积、物理气相沉积、直写、打印、印刷、涂布中的一种或多种方式形成。The manufacturing method of LED glass screen according to claim 1, characterized in that, the transparent conductive circuit is processed by sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, Formed by one or more methods of printing, printing and coating.
  10. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述透明导电线路由纳米银线或氧化铟锡形成。The method for manufacturing an LED glass screen according to claim 1, wherein the transparent conductive circuit is formed of nano-silver wire or indium tin oxide.
  11. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，在所述焊盘区域内的所述透明玻璃基板上形成粘接层，用以粘接LED芯片的底面。The manufacturing method of the LED glass screen according to claim 1, characterized in that an adhesive layer is formed on the transparent glass substrate in the region of the welding pad for bonding the bottom surface of the LED chip.
  12. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述将LED芯片贴装在所述焊盘上，利用液态金属实现所述LED芯片的引脚与所述焊盘电极之间的浸润连接之后，还包括：The manufacturing method of the LED glass screen according to claim 1, wherein the LED chip is mounted on the pad, and liquid metal is used to realize the connection between the pin of the LED chip and the electrode of the pad. After the infiltration connection between, also include:
    对所述LED芯片的引脚与所述焊盘电极之间进行封装加固。Encapsulation and reinforcement are performed between the pins of the LED chip and the pad electrodes.
  13. 根据权利要求1所述的LED玻璃屏的制作方法，其特征在于，所述液态金属中至少包含镓单质或镓基合金。The method for manufacturing an LED glass screen according to claim 1, wherein the liquid metal contains at least gallium simple substance or gallium-based alloy.
  14. 一种LED玻璃屏，其特征在于，包括：A kind of LED glass screen, is characterized in that, comprises:
    透明玻璃基板、以及形成在所述透明玻璃基板表面上的透明导电线路；其中，所述透明导电线路包含若干组用以实现LED芯片电连接的焊盘电极；A transparent glass substrate, and a transparent conductive circuit formed on the surface of the transparent glass substrate; wherein, the transparent conductive circuit includes several groups of pad electrodes for realizing the electrical connection of the LED chip;
    贴装在所述透明导电线路的焊盘上的LED芯片；其中，所述LED芯片的引脚与所述焊盘电极之间利用液态金属浸润连接；An LED chip mounted on the pad of the transparent conductive circuit; wherein, the pins of the LED chip and the electrode of the pad are wetted and connected by liquid metal;
    所述液态金属在室温环境下呈熔融状态，由液态金属对金属的浸润性提供所述LED芯片的引脚与所述焊盘电极之间的束缚力和电气导通。The liquid metal is in a molten state at room temperature, and the wettability of the liquid metal to the metal provides binding force and electrical conduction between the pins of the LED chip and the pad electrodes.
  15. 根据权利要求14所述的LED玻璃屏，其特征在于，还包括：对所述LED芯 片的引脚与所述焊盘电极之间进行封装加固的封装结构。The LED glass screen according to claim 14, further comprising: a packaging structure for packaging and strengthening between the pins of the LED chip and the pad electrodes.
  16. 根据权利要求14所述的LED玻璃屏，其特征在于，还包括：形成在所述透明玻璃基板非焊盘电极位置处的粘接层，所述粘接层与所述LED芯片粘接。The LED glass screen according to claim 14, further comprising: an adhesive layer formed on the transparent glass substrate at a position other than the pad electrode, and the adhesive layer is bonded to the LED chip.
  17. 根据权利要求16所述的LED玻璃屏，其特征在于，所述粘接层为满足多个所述LED芯片贴装的直线形结构。The LED glass screen according to claim 16, characterized in that, the adhesive layer is a linear structure satisfying the attachment of a plurality of the LED chips.
PCT/CN2021/131607 2021-07-17 2021-11-19 Led glass screen and manufacturing method therefor WO2023000563A1 (en)

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