WO2022264225A1 - 超音波ホーンおよび半導体装置の製造装置 - Google Patents
超音波ホーンおよび半導体装置の製造装置 Download PDFInfo
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- WO2022264225A1 WO2022264225A1 PCT/JP2021/022560 JP2021022560W WO2022264225A1 WO 2022264225 A1 WO2022264225 A1 WO 2022264225A1 JP 2021022560 W JP2021022560 W JP 2021022560W WO 2022264225 A1 WO2022264225 A1 WO 2022264225A1
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- Prior art keywords
- ultrasonic horn
- vibration
- ultrasonic
- hole
- distal end
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 230000007423 decrease Effects 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 230000000149 penetrating effect Effects 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 230000000644 propagated effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B3/04—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency involving focusing or reflecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78353—Ultrasonic horns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78702—Means for aligning in the upper part of the bonding apparatus, e.g. in the capillary or wedge
Definitions
- This specification discloses an ultrasonic horn used in an ultrasonic processing machine for performing vibration processing (bonding, cutting, polishing, etc.) on an object, and a semiconductor device manufacturing apparatus having the ultrasonic horn.
- ultrasonic horns that generate longitudinal and torsional vibrations have been proposed for vibration processing of objects.
- Many of these ultrasonic horns have a plurality of oblique slits formed on their peripheral surface in order to convert longitudinal vibration into torsional vibration.
- the oblique slits progress in the circumferential direction as they progress in the axial direction. Longitudinal vibrations are converted to torsional vibrations as they pass through this tilted slit.
- a plurality of mutually independent inclined slits are inclined.
- the mutual positions of the plurality of inclined slits tend to vary, and the vibration characteristics tend to fluctuate.
- the present specification discloses an ultrasonic horn and a semiconductor device manufacturing apparatus that more reliably provide desired vibration characteristics.
- the ultrasonic horn disclosed in the present specification includes a vibration source to which an ultrasonic transducer is attached, a tip to which a processing tool is attached, interposed between the tip and the vibration source, and an intermediate portion for propagating vibration generated by the transducer to the tip portion, wherein the intermediate portion includes a single hole penetrating in the radial direction of the ultrasonic horn and extending axially as it progresses in the circumferential direction; spiral hole is formed.
- the distal end portion is formed with a mounting hole penetrating in a first direction orthogonal to the axial direction and to which the processing tool is mounted, and the distal end portion of the spiral hole extends in the first direction. It may penetrate in a direction substantially parallel to.
- the spiral hole may have a shape that progresses in the circumferential direction by 1/4 rotation from the proximal end to the distal end.
- the intermediate portion may have a tapered shape in which the cross-sectional area decreases as it approaches the distal end side from the proximal end side.
- a manufacturing apparatus for a semiconductor device disclosed in the present specification comprises the above-described ultrasonic horn, and a cylindrical capillary attached to the tip of the ultrasonic horn and through which a wire is inserted. do.
- the helical hole penetrates the ultrasonic horn in the radial direction, so the conversion efficiency to torsional vibration is high. Therefore, it is sufficient to form one helical hole in the ultrasonic horn.
- By forming only one hole it is possible to reduce shape errors and the like compared to the case of forming a plurality of slits, and it is easy to maintain the vibration characteristics as designed. As a result, according to the technique disclosed in this specification, desired vibration characteristics can be obtained more reliably.
- FIG. 1 is a diagram showing the configuration of a semiconductor device manufacturing apparatus equipped with an ultrasonic horn;
- FIG. 1 is a perspective view of an ultrasonic horn;
- FIG. It is a top view of an ultrasonic horn.
- FIG. 4 is a cross-sectional view taken along the line AA of FIG. 3; It is a schematic diagram which shows the mode of formation of a spiral hole.
- FIG. 10 is a diagram showing a locus of movement of the tip when a first drive signal is applied;
- FIG. 10 is a diagram showing a locus of movement of the tip when a second drive signal is applied;
- FIG. 10 is a diagram showing movement trajectories when a first drive signal and a second drive signal are applied;
- FIG. 10 is a diagram showing an ultrasonic horn of a comparative example;
- FIG. 1 is a diagram showing the configuration of a manufacturing apparatus 10 equipped with an ultrasonic horn 50. As shown in FIG. 1
- the manufacturing apparatus 10 is a wire bonding apparatus that manufactures semiconductor devices by connecting two electrodes provided on the object 30 with wires 26 .
- the object 30 is, for example, a lead frame on which a semiconductor chip is mounted.
- a semiconductor chip and a lead frame are provided with electrodes, respectively, and by electrically connecting these electrodes with wires 26, a semiconductor device is manufactured.
- a manufacturing apparatus 10 has a bonding head 12 assembled on an XY stage 20 .
- the XY stage 20 moves the bonding head 12 horizontally, that is, in the X and Y directions.
- An ultrasonic horn 50 and a camera 22 are attached to the bonding head 12 so as to be movable in the vertical direction, that is, the Z direction.
- the ultrasonic horn 50 is attached to the bonding head 12 via the horn holder 14 .
- the ultrasonic horn 50 generates longitudinal and torsional vibrations and propagates them to the capillary.
- the capillary 18 is a cylindrical member attached to the distal end of the ultrasonic horn 50 and through which the wire 26 is inserted. Longitudinal and torsional vibrations are transmitted to wire 26 through this capillary 18 .
- a clamper 19 that moves together with the capillary 18 and clamps the wire 26 is provided above the capillary 18 .
- the camera 22 images the object 30 as necessary.
- the controller 32 identifies the position of the capillary 18 with respect to the object 30 based on the image captured by the camera 22 and positions the capillary 18 .
- the bonding head 12 is further provided with a spool 24 around which a wire 26 is wound, and the wire 26 is let out from the spool 24 as required.
- the controller 32 controls the driving of each part that constitutes the manufacturing apparatus 10 . For example, the controller 32 applies a voltage of a predetermined frequency (that is, a drive signal) to the ultrasonic transducer 58 provided in the ultrasonic horn 50 to generate vibration of a predetermined frequency.
- a predetermined frequency that is, a drive signal
- FIG. 2 is a perspective view of the ultrasonic horn 50
- FIG. 3 is a plan view of the ultrasonic horn 50
- FIG. 4 is a cross-sectional view taken along line AA of FIG.
- the ultrasonic horn 50 has a proximal end portion 52, a vibration source portion 53, an intermediate portion 54, and a distal end portion 56 arranged in a straight line from the proximal end to the distal end.
- the base end portion 52 is a portion to be attached to the horn holder 14 and has a substantially conical shape with a smaller diameter toward the base end side.
- the ultrasonic transducer 58 is incorporated in the vibration source section 53 .
- the ultrasonic transducer 58 is a vibration generation source that receives a drive signal, which is a voltage signal, and generates longitudinal vibration.
- This ultrasonic transducer 58 has, for example, lead zirconate titanate (commonly called PZT) that vibrates upon receiving an alternating voltage. It is a bolted Langevin transducer (commonly called BLT or BL transducer).
- the ultrasonic transducer 58 is supplied with an AC signal of a first frequency (hereinafter referred to as "first drive signal”) and an AC signal of a second frequency greater than the first frequency (hereinafter referred to as "second drive signal"). ) and are applied at the same time.
- the intermediate portion 54 propagates the vibration generated by this ultrasonic transducer 58 to the tip portion 56 .
- the intermediate portion 54 is generally pyramidal with a cross-sectional area that decreases toward the tip. With such a configuration, the vibration generated in the vibration source portion 53 is amplified and propagated to the distal end portion 56 . Further, the intermediate portion 54 is formed with a spiral hole 68 for converting part of the longitudinal vibration into torsional vibration, which will be described later.
- the tip portion 56 is a portion that holds the capillary 18 .
- a mounting hole 64 through which the capillary 18 is inserted is formed in the vicinity of the distal end of the distal end portion 56, penetrating in the Z direction (that is, the axial direction of the capillary 18).
- the diameter of this mounting hole 64 is slightly smaller than the diameter of the capillary 18 in the unloaded state.
- An adjustment hole 66 that penetrates in the Z direction and has a substantially drop shape when viewed from the Z direction is formed on the base end side of the mounting hole 64 .
- the adjustment hole 66 and the mounting hole 64 are connected through a thin slit.
- the mounting hole 64 is also enlarged in diameter.
- the capillary 18 can be inserted into the mounting hole 64 by increasing the diameter of the mounting hole 64 .
- the spiral hole 68 is formed in the intermediate portion 54 .
- This spiral hole 68 will be described in detail.
- the spiral hole 68 is a hole for converting part of the longitudinal vibration output by the ultrasonic transducer 58 into torsional vibration.
- the spiral hole 68 is a hole that penetrates the intermediate portion 54 in the radial direction and progresses in the circumferential direction as it progresses in the axial direction. More specifically, the spiral hole 68 extends through both sides of the intermediate portion 54 in the X direction (ie, the axial direction of the ultrasonic horn 50 and the axis of the capillary 18). perpendicular to both directions).
- the penetrating direction of the helical hole 68 changes toward the Z direction as it advances toward the distal end side in the axial direction.
- the spiral hole 68 penetrates through the intermediate portion 54 in the Z direction so as to pass through the upper surface and the bottom surface of the intermediate portion 54 at its distal end. That is, the piercing direction of the helical hole 68 rotates by 1/4 in the circumferential direction in the process of proceeding from the proximal end to the distal end. From another point of view, the spiral hole 68 is shaped like a flat plate twisted 90 degrees.
- FIG. 5 is a schematic diagram showing how the spiral hole 68 is formed.
- the ultrasonic horn 50 is shown as a cylinder for the sake of simplicity.
- the discharge wire 70 is passed through in the radial direction.
- the ultrasonic horn 50 is relatively moved in the axial direction A and the circumferential direction W with respect to the electric discharge wire 70 while performing electric discharge machining.
- a spiral through-hole is formed in the ultrasonic horn 50 .
- the spiral hole 68 may be formed not only by wire electric discharge machining but also by other machining techniques such as laser machining.
- the helical hole 68 is a single hole and penetrates the intermediate portion 54 in the radial direction. With such a configuration, longitudinal vibration can be efficiently converted into torsional vibration, and variation in vibration characteristics of each individual can be suppressed. This will be described in comparison with a comparative example.
- FIG. 7 is a schematic diagram of an ultrasonic horn 50* of a comparative example.
- a plurality of inclined grooves 80 are formed in the intermediate portion 54 instead of the spiral hole 68.
- This inclined groove 80 is a groove that advances in the circumferential direction as it advances in the axial direction, and converts longitudinal vibration into torsional vibration.
- the inclined groove 80 exists only in the surface layer of the peripheral surface of the intermediate portion 54 and does not penetrate the intermediate portion 54 in the radial direction. Therefore, compared with the spiral hole 68, the inclined groove 80 has a lower conversion efficiency from longitudinal vibration to torsional vibration.
- a plurality of inclined grooves 80 are formed to increase the conversion efficiency to torsional vibration.
- a plurality of slanted grooves 80 are provided, errors in mutual position and variation in shape of the plurality of slanted grooves 80 occur, resulting in changes in vibration characteristics.
- individual differences in the vibration characteristics of the ultrasonic horn 50* tended to occur.
- the first drive signal and the second drive signal are applied in parallel.
- the vibration generated by the first drive signal is defined as the "first vibration” and the vibration generated by the second drive signal is defined as the "second vibration”
- the inclined groove 80 is defined as a node of the first vibration and a node of the second vibration. It was formed at the position of the antinode of the vibration.
- the first vibration is propagated to the distal end portion 56 as longitudinal vibration
- the second vibration is converted to torsional vibration by the inclined groove 80 and propagated to the distal end portion 56 .
- the ultrasonic horn 50 disclosed in this specification has only one spiral hole 68 as described above. Since the spiral hole 68 penetrates the intermediate portion 54 in the radial direction, the longitudinal vibration propagated from the vibration source portion 53 can be efficiently converted into torsional vibration. In other words, according to the ultrasonic horn 50 of this embodiment, longitudinal vibration can be reliably converted into torsional vibration without considering antinode positions and node positions of the first and second vibrations. As a result, the design of the position of the spiral hole 68 can be simplified. Also, only one spiral hole 68 is formed in the ultrasonic horn 50 . Therefore, mutual positional errors and variations in shape do not occur, and individual differences in vibration characteristics of each ultrasonic horn 50 can be reduced.
- the controller 32 applies a first drive signal of a first frequency and a second drive signal of a second frequency to the ultrasonic transducer 58 in parallel.
- the longitudinal vibration of the first frequency, ie, the first vibration, and the longitudinal vibration of the second frequency, ie, the second vibration are generated in the vibration source section 53 .
- Both of the two types of longitudinal vibration are partially converted into torsional vibration when passing through the helical hole 68 .
- the first vibration after conversion and the second vibration after conversion are vibrations in directions substantially perpendicular to each other.
- the first vibration after conversion and the second vibration after conversion are propagated to the tip portion 56 in parallel, so that the tip portion 56 vibrates substantially planarly. And thereby, ultrasonic processing can be performed more efficiently.
- FIG. 6A to 6C are diagrams showing the vibratory motion of tip 56.
- FIG. 6A shows the locus of movement of tip 56 when only the first drive signal is applied.
- FIG. 6B shows the locus of movement of the tip 56 when only the second drive signal is applied
- FIG. 6C shows the locus of movement of the tip 56 when the first and second drive signals are applied in parallel.
- blackened portions are portions where many lines indicating the locus of movement of the distal end portion 56 are overlapped. As shown in FIG.
- the movement of the distal end portion 56 when only the first drive signal is applied, the movement of the distal end portion 56 has a relatively large amount of longitudinal vibration components, but the movement as a whole is a mixture of longitudinal vibration and torsional vibration. As a result, the tip 56 vibrates to move between the second and fourth quadrants.
- the ultrasonic horn 50 of this example it is possible to efficiently convert longitudinal vibration into torsional vibration while suppressing individual differences in vibration characteristics.
- the configuration described so far is only an example, and a single spiral hole 68 is formed in the intermediate portion 54 of the ultrasonic horn 50 as a hole penetrating in the radial direction and progressing in the axial direction as it progresses in the circumferential direction. If so, other configurations may be changed as appropriate.
- the helical hole 68 has a shape that progresses in the circumferential direction by a quarter turn from the proximal end to the distal end.
- the circumferential extent of the helical bore 68 may be less than or greater than 1/4 turn as long as sufficient strength and vibration characteristics are obtained.
- the helical bore 68 may be shaped to progress 1 ⁇ 2 turn circumferentially from the proximal end to the distal end.
- the helical hole 68 penetrates at its distal end in the X direction, that is, in a direction orthogonal to both the axial direction of the capillary 18 and the axial direction of the ultrasonic horn 50 .
- the penetrating direction of the distal end of the spiral hole 68 and the penetrating direction of the mounting hole 64 of the capillary 18 are substantially parallel.
- torsional vibration is more easily propagated to the distal end portion 56 than when the holes 68 and 64 are non-parallel.
- the helical hole 68 may be arranged so that its distal end penetrates in the Z direction and its proximal end penetrates in the X direction.
- the intermediate portion 54 of the ultrasonic horn 50 has a tapered shape in which the cross-sectional area decreases as it approaches the distal end side from the proximal end side. With such a configuration, the vibration is amplified as the tip side is approached.
- the intermediate portion 54 may have other shapes, such as a round bar shape with a constant diameter.
- the semiconductor device manufacturing apparatus 10 equipped with the ultrasonic horn 50 has been described as an example.
- it may be incorporated in an ultrasonic welding device or the like.
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- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (5)
- 超音波振動子が取り付けられる振動源部と、
加工ツールが取り付けられる先端部と、
前記先端部と前記振動源部との間に介在し、前記超音波振動子で生じた振動を前記先端部に伝搬させる中間部と、
を備え、前記中間部に、超音波ホーンの径方向に貫通する孔であって、周方向に進むにつれて軸方向に進む単一の螺旋孔が形成されている、
ことを特徴とする超音波ホーン。 - 請求項1に記載の超音波ホーンであって、
前記先端部には、前記軸方向と直交する第一方向に貫通し、前記加工ツールが取り付けられる取付孔が形成されており、
前記螺旋孔の先端側端部は、前記第一方向と略平行な方向に貫通している、
ことを特徴とする超音波ホーン。 - 請求項1または2に記載の超音波ホーンであって、
前記螺旋孔は、その基端側端部から先端側端部までの間に、周方向に1/4回転分進む形状である、ことを特徴とする超音波ホーン。 - 請求項1から3のいずれか1項に記載の超音波ホーンであって、
前記中間部は、基端側から先端側に近づくにつれて、断面積が小さくなる先細り形状である、ことを特徴とする超音波ホーン。 - 半導体装置の製造装置であって、
請求項1から4のいずれか1項に記載の超音波ホーンと、
前記超音波ホーンの前記先端部に取り付けられ、ワイヤが挿通される円筒状のキャピラリと、
を備える、ことを特徴とする半導体装置の製造装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/767,914 US20230343742A1 (en) | 2021-06-14 | 2021-06-14 | Ultrasonic horn and manufacturing apparatus of semiconductor device |
JP2022505656A JP7209416B1 (ja) | 2021-06-14 | 2021-06-14 | 超音波ホーンおよび半導体装置の製造装置 |
CN202180004531.6A CN115707329A (zh) | 2021-06-14 | 2021-06-14 | 超声波焊头及半导体装置的制造装置 |
KR1020237028225A KR20230133359A (ko) | 2021-06-14 | 2021-06-14 | 초음파 혼 및 반도체 장치 제조장치 |
PCT/JP2021/022560 WO2022264225A1 (ja) | 2021-06-14 | 2021-06-14 | 超音波ホーンおよび半導体装置の製造装置 |
TW111121339A TWI833240B (zh) | 2021-06-14 | 2022-06-09 | 超音波焊頭及半導體裝置的製造裝置 |
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PCT/JP2021/022560 WO2022264225A1 (ja) | 2021-06-14 | 2021-06-14 | 超音波ホーンおよび半導体装置の製造装置 |
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WO2022264225A1 true WO2022264225A1 (ja) | 2022-12-22 |
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PCT/JP2021/022560 WO2022264225A1 (ja) | 2021-06-14 | 2021-06-14 | 超音波ホーンおよび半導体装置の製造装置 |
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US (1) | US20230343742A1 (ja) |
JP (1) | JP7209416B1 (ja) |
KR (1) | KR20230133359A (ja) |
CN (1) | CN115707329A (ja) |
TW (1) | TWI833240B (ja) |
WO (1) | WO2022264225A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002209906A (ja) * | 2001-01-23 | 2002-07-30 | Miwatec:Kk | 超音波ハンドピ−ス |
JP2004275592A (ja) * | 2003-03-18 | 2004-10-07 | Miwatec:Kk | 複合振動超音波ハンドピ−ス |
JP2006340837A (ja) * | 2005-06-08 | 2006-12-21 | Aloka Co Ltd | 超音波手術器 |
Family Cites Families (12)
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JP3151691B2 (ja) * | 1992-11-24 | 2001-04-03 | 株式会社新川 | 超音波ホーンのキヤピラリ保持構造 |
JPH08294673A (ja) | 1995-04-27 | 1996-11-12 | Jiromaru Tsujino | 複合振動変換用超音波ホーン |
JP2000031196A (ja) * | 1998-07-15 | 2000-01-28 | Kaijo Corp | ワイヤボンディング装置のキャピラリィ取付構造 |
JP3742332B2 (ja) * | 2001-11-12 | 2006-02-01 | 株式会社新川 | ワイヤボンデイング装置 |
TWI230102B (en) * | 2002-03-27 | 2005-04-01 | Matsushita Electric Ind Co Ltd | Component mounting method, component mounting apparatus, and ultrasonic bonding head |
JP2006156756A (ja) * | 2004-11-30 | 2006-06-15 | Fujitsu Ltd | 超音波ヘッド |
JP4303673B2 (ja) * | 2004-11-30 | 2009-07-29 | 富士通株式会社 | 共振器、超音波ヘッド及びそれを用いた超音波接合装置 |
US7976658B2 (en) * | 2006-08-14 | 2011-07-12 | Eastman Kodak Company | Method of manufacturing a low cost intermediate transfer member |
TWM344929U (en) * | 2008-06-06 | 2008-11-21 | King Ultrasonic Co Ltd | Ultrasonic metal joining device |
EP3756808B1 (en) * | 2018-02-24 | 2022-11-02 | Dalian University Of Technology | Ultrasonic cutting holder for honeycomb core |
WO2020006062A1 (en) * | 2018-06-26 | 2020-01-02 | Db Sonics, Inc. | Sonotrode and method of manufacturing |
CN112277323A (zh) * | 2020-10-12 | 2021-01-29 | 陕西诺盈自动化仪表有限公司 | 一种超声波焊头的冷却结构 |
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2021
- 2021-06-14 JP JP2022505656A patent/JP7209416B1/ja active Active
- 2021-06-14 KR KR1020237028225A patent/KR20230133359A/ko unknown
- 2021-06-14 US US17/767,914 patent/US20230343742A1/en active Pending
- 2021-06-14 CN CN202180004531.6A patent/CN115707329A/zh active Pending
- 2021-06-14 WO PCT/JP2021/022560 patent/WO2022264225A1/ja active Application Filing
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2022
- 2022-06-09 TW TW111121339A patent/TWI833240B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002209906A (ja) * | 2001-01-23 | 2002-07-30 | Miwatec:Kk | 超音波ハンドピ−ス |
JP2004275592A (ja) * | 2003-03-18 | 2004-10-07 | Miwatec:Kk | 複合振動超音波ハンドピ−ス |
JP2006340837A (ja) * | 2005-06-08 | 2006-12-21 | Aloka Co Ltd | 超音波手術器 |
Also Published As
Publication number | Publication date |
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CN115707329A (zh) | 2023-02-17 |
TW202310940A (zh) | 2023-03-16 |
JPWO2022264225A1 (ja) | 2022-12-22 |
KR20230133359A (ko) | 2023-09-19 |
TWI833240B (zh) | 2024-02-21 |
JP7209416B1 (ja) | 2023-01-20 |
US20230343742A1 (en) | 2023-10-26 |
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