WO2022249918A1 - アルミニウム-ダイヤモンド系複合体の製造方法 - Google Patents
アルミニウム-ダイヤモンド系複合体の製造方法 Download PDFInfo
- Publication number
- WO2022249918A1 WO2022249918A1 PCT/JP2022/020392 JP2022020392W WO2022249918A1 WO 2022249918 A1 WO2022249918 A1 WO 2022249918A1 JP 2022020392 W JP2022020392 W JP 2022020392W WO 2022249918 A1 WO2022249918 A1 WO 2022249918A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aluminum
- layer
- metal
- diamond
- composite
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 172
- 239000010432 diamond Substances 0.000 title claims abstract description 168
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 168
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims abstract description 201
- 239000002184 metal Substances 0.000 claims abstract description 201
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 80
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000011148 porous material Substances 0.000 claims abstract description 43
- 239000000203 mixture Substances 0.000 claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 36
- 239000000155 melt Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 19
- 239000012784 inorganic fiber Substances 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 8
- 238000005242 forging Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000012768 molten material Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 233
- 238000007747 plating Methods 0.000 description 24
- 239000002245 particle Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 238000000137 annealing Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000001636 atomic emission spectroscopy Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D18/00—Pressure casting; Vacuum casting
- B22D18/02—Pressure casting making use of mechanical pressure devices, e.g. cast-forging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/14—Casting in, on, or around objects which form part of the product the objects being filamentary or particulate in form
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
- C22C1/1073—Infiltration or casting under mechanical pressure, e.g. squeeze casting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
Definitions
- the present disclosure relates to a method for producing an aluminum-diamond composite.
- An aluminum-diamond composite is a composite material of diamond, which has a high thermal conductivity, and aluminum, which has a high coefficient of thermal expansion, and is used for various purposes such as heat sinks.
- a large-sized composite is once prepared and then processed into a product shape.
- it contains diamond and has high hardness, it is difficult to process by inexpensive machining. Therefore, methods such as laser machining, water jet machining, and electric discharge machining are used for the production of aluminum-diamond composites.
- the heat dissipation member is joined to other members such as semiconductor elements by metal plating and brazing.
- the aluminum-diamond composite has a laser-cut surface as described above. The diamond powder exposed on the cut surface may lead to deterioration of the adhesion of the metal plating or deterioration of the bondability with the brazing filler metal, and eventually to an increase in thermal resistance at the contact interface with other members.
- Patent Document 1 discloses a method of further providing a metal layer on the cut surface in order to reduce the influence of the cut surface due to laser processing or the like. Specifically, step 1 of preparing diamond powder, step 2 of preparing one or more aluminum-containing materials selected from aluminum-containing ceramics and aluminum-containing metal materials, and aluminum-containing materials on both upper and lower surfaces is further sandwiched from above and below by release plates, the diamond powder is filled into the cavity of the mold material made of a porous body, and impregnated with a metal containing aluminum by a molten metal forging method, Step 3 of preparing a flat plate-like aluminum-diamond composite precursor having surface layers containing 80% by volume or more of a metal containing aluminum on both upper and lower surfaces, and placing an aluminum-containing material on all sides of the precursor.
- step 4 of producing a flat plate-shaped aluminum-diamond composite having a surface layer containing 80% by volume or more of the contained metal on all sides; is described.
- the purpose of the present disclosure is to provide a method for manufacturing an aluminum-diamond composite more simply than before without laser processing or the like.
- a molten metal containing aluminum is press-fitted between the porous material and the laminated structure to impregnate the composition layer, thereby forming a composite portion containing aluminum and diamond, and forming a metal layer on at least a side surface of the laminated structure;
- Production of an aluminum-diamond composite wherein the laminated structure comprises a first release plate, a first inorganic layer, the composition layer, a second inorganic layer, and a second release plate in this order.
- the aluminum-diamond composite includes a flat composite portion containing aluminum and diamond, a metal-containing layer provided on a pair of main surfaces of the composite portion, and a side surface of the composite portion. and a metal layer provided, wherein the metal layer has an average thickness of 0.01 to 3.00 mm.
- the manufacturing method according to [10] wherein the surfaces of the metal-containing layer and the metal layer opposite to the composite portion side are smooth surfaces.
- One aspect of the present disclosure provides a laminated structure including a composition layer containing diamond powder in the opening so as to be spaced apart from the inner peripheral surface of the opening of a plate-shaped porous material having the opening. and forming a composite portion containing aluminum and diamond by press-fitting a melt of a metal containing aluminum between the porous material and the laminated structure and impregnating the composition layer. and forming a metal layer on at least a side surface of the laminated structure, wherein the laminated structure includes a first release plate, a first inorganic layer, the composition layer, and a second inorganic layer. , and a second release plate in this order.
- the lamination is performed with a gap with respect to the inner peripheral surface of the opening of the porous material (for example, when the opening is a through hole, the entire circumference of the inner wall).
- the subsequently injected aluminum-containing metal melt spreads over the surface of the laminated structure, thereby directly producing an aluminum-diamond-based composite having an aluminum-containing metal layer on the surface. can do. For this reason, laser processing is not required and the number of processing steps is reduced, so that an aluminum-diamond composite can be produced in a shorter time than conventional methods.
- a product-shaped aluminum-diamond composite is directly manufactured by forming a metal layer between the mold and the composite part containing aluminum and diamond.
- the opening may be a through hole penetrating vertically.
- the opening is a through hole, it becomes easier to remove the composite from the mold after forming the metal layer.
- the opening may be a recess.
- the first inorganic layer may be at least one of an inorganic fiber-containing layer and a metal foil containing aluminum.
- the second inorganic layer may be at least one of an inorganic fiber-containing layer and a metal foil containing aluminum.
- the distance between the inner peripheral surface of the opening of the porous material and the laminated structure may be 0.05 to 3.50 mm.
- the manufacturing method may further include a step of adjusting the average thickness of the metal layer.
- the step of forming the metal layer may be performed by a molten metal forging method.
- the content of aluminum in the melt may be 80% by mass or more.
- the aluminum-diamond-based composite obtained by the above-described manufacturing method includes a flat composite portion containing aluminum and diamond, a metal-containing layer provided on a pair of main surfaces of the composite portion, and the above and a metal layer provided on a side surface of the composite portion, and the average thickness of the metal layer may be 0.01 to 3.00 mm.
- the resulting aluminum-diamond composite can also exhibit excellent thermal shock resistance at the joint surface between the composite portion and the metal layer.
- the surfaces of the metal-containing layer and the metal layer opposite to the composite portion side may be smooth surfaces.
- the smooth surface may have a surface roughness Ra of 0.5 to 1.0 ⁇ m.
- the average thickness of the metal-containing layer may be 0.01-0.20 mm.
- FIG. 1 is a schematic diagram for explaining an example of a method for producing an aluminum-diamond composite.
- FIG. 2 is a perspective view showing an example of an aluminum-diamond composite.
- 3 is a cross-sectional view taken along line III-III of FIG. 2.
- FIG. 4 is a top view showing an example of an aluminum-diamond composite.
- FIG. 5 is a schematic diagram for explaining the measuring method in the example.
- each component in the composition means the total amount of the multiple substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition.
- the range represented by "-" includes upper and lower limits unless otherwise specified, for example, "X to Y” means “X or more and Y or less”.
- a composition layer containing diamond powder is placed in the opening so as to be spaced apart from the inner peripheral surface of the opening of a plate-like porous material having an opening.
- a step of providing a laminated structure containing , a step of forming a composite portion containing aluminum and diamond and forming a metal layer on at least the side surface of the laminated structure (hereinafter also referred to as a metal layer forming step); and a step of adjusting the average thickness of the metal layer. (hereinafter also referred to as a layer thickness adjustment step).
- the layer thickness adjustment step is an optional step and can be omitted.
- the layer thickness adjusting step may be omitted, for example, if the average thickness of the metal layer formed by the metal layer forming step is 0.01 to 3.00 mm.
- FIG. 1 is a schematic diagram for explaining an example of a method for producing an aluminum-diamond composite.
- FIG. 1(a) shows a laminated structure laying process
- FIG. 1(b) shows a metal layer forming process
- FIG. 1(c) shows an aluminum-diamond composite obtained by the above-described manufacturing method.
- It is a schematic cross section showing an example of a body.
- the openings of the porous material 50 are through holes penetrating vertically.
- the opening may be, for example, a recess having an opening on one main surface side of the porous material 50 .
- one opening be provided in the center of the porous material 50, but is not particularly limited.
- a plurality of openings may be provided in the porous material 50, and the positions at which the openings are formed may be adjusted as appropriate.
- the opening is a through hole will be described. It may be read as a united one.
- the porous material 50 is placed between the two metal plates 60 and placed inside the opening of the porous material 50, which is a frame material that serves as a mold for the aluminum-diamond composite 100.
- This is the step of providing the laminated structure 30 with a gap so as to be separated from the inner peripheral surface 50a of the opening.
- the method of providing the laminated structure 30 in the opening of the porous material 50 is not particularly limited. may be sequentially stacked, or a method of inserting a separately formed layered structure 30 into an opening of the porous material 50 may be used.
- Means for providing a gap (distance g) between the inner peripheral surface 50a of the opening of the porous material 50 and the outer peripheral surface of the laminated structure 30 is, for example, a spacer having a predetermined thickness that can be removed later and placed inside the opening.
- a method of forming or inserting the laminated structure 30 inside the spacer (the space on the side opposite to the porous material 50 side) and then removing the spacer may be used.
- FIG. 1 shows an example in which one laminated structure 30 is provided, a plurality of laminated structures 30 are laminated inside the opening of the porous material 50 along the thickness direction of the porous material 50. You may
- the distance g between the inner peripheral surface 50a of the opening of the porous material 50 and the outer peripheral surface of the laminated structure 30 is adjusted according to the thickness of the metal layer formed on the side surface of the desired aluminum-diamond composite. be able to.
- the distance g between the inner peripheral surface 50a of the opening of the porous material 50 and the outer peripheral surface of the laminated structure 30 is, for example, 0.05 to 3.50 mm, 0.05 to 2.50 mm, or 0.05 to 1 .00 mm.
- metal plate 60 for example, an iron plate, a stainless steel plate, or the like can be used.
- a heat-resistant porous material is used in which a molten metal containing aluminum can be pressurized or permeated in the metal layer forming step described later.
- a porous sintered body made of graphite or boron nitride for example, an isotropic graphite mold material, etc.
- a porous body made of alumina fibers, or the like can be used.
- the shape of the openings of the porous material 50 can be adjusted according to the desired shape of the aluminum-diamond composite 100 .
- the shape of the aluminum-diamond-based composite 100 can be changed by adjusting the shape of the opening of the porous material 50. Therefore, unlike molding by laser processing or the like in the conventional method, design Excellent freedom of
- the laminated structure 30 provided in the laminated structure laying step includes the first release plate 6a, the first inorganic layer 4a, the composition layer 2, the second inorganic layer 4b, and the second release plate 6b in this order. Prepare.
- the first inorganic layer 4a and the second inorganic layer 4b may be the same or different.
- the composition layer 2 may, for example, be composed only of diamond powder, or may contain other components. Other components may be, for example, binders such as silica. When the composition layer 2 contains other components, the content of the other components may be, for example, 0.5 to 3.0 mass % based on the total amount of the composition layer 2 .
- the diamond powder constituting the composition layer 2 may be natural diamond powder, artificial diamond powder, or a mixture of the two.
- diamond particles having a ⁇ -silicon carbide layer formed on the surface thereof can also be used.
- Such diamond particles suppress the formation of metal carbides with low thermal conductivity (e.g., aluminum carbide (Al 4 C 3 )) when brought into contact with a molten metal containing aluminum in the metal layer forming step described later.
- the thermal conductivity of the obtained aluminum-diamond composite 100 can be further improved.
- the diamond powder may have its particle size distribution adjusted from the viewpoint of improving thermal conductivity.
- the diamond powder preferably has multiple peaks in the volume-based particle size distribution curve.
- Such diamond powder may be a mixed powder of two or more powders having different average particle sizes.
- the diamond powder may have, for example, a first peak in the particle size range of 5 to 25 ⁇ m and a second peak in the particle size range of 55 to 195 ⁇ m.
- the first peak is preferably in the region of particle size 10-20 ⁇ m.
- the second peak is preferably in the region of particle size 100-180 ⁇ m.
- the average particle size in this specification is the particle size (median size, d50) at which the cumulative value of the cumulative particle size distribution is 50%.
- the average particle size in this specification is measured using a laser diffraction scattering method particle size distribution analyzer in accordance with ISO 13320:2009.
- a laser diffraction scattering particle size distribution analyzer for example, "LS-13 320" (apparatus name) manufactured by Beckman Coulter can be used.
- the diamond powder desirably contains a relatively large amount of powder with a large particle size.
- the ratio of B to A may be, for example, 1.5 or more, 2.3 or more, 4.0 or more, or 9.0 or more.
- the particle size distribution in this specification means a value measured based on the Coulter method.
- the first inorganic layer 4a and the second inorganic layer 4b may be, for example, at least one of an inorganic fiber-containing layer and an aluminum-containing metal foil independently of each other.
- the inorganic fiber-containing layer is composed of, for example, an inorganic fiber mesh so that it can be press-fitted or impregnated with a molten aluminum-containing metal in the metal layer forming step described later.
- Inorganic fibers may be, for example, metal fibers or ceramic fibers. Examples of ceramic fibers include alumina fibers and glass fibers.
- the metal foil containing aluminum may be, for example, an aluminum foil, an aluminum alloy foil, or the like.
- the thicknesses of the first inorganic layer 4a and the second inorganic layer 4b may be, independently of each other, for example, 0.01 mm or more, 0.02 mm or more, or 0.03 mm or more.
- the lower limit of the thickness of the first inorganic layer 4a and the second inorganic layer 4b is within the above range, so that the diamond powder is more sufficiently suppressed from being exposed on the surface of the aluminum-diamond composite 100. can be done.
- the thicknesses of the first inorganic layer 4a and the second inorganic layer 4b are each independently, for example, 0.20 mm or less, 0.15 mm or less, 0.10 mm or less, 0.08 mm or less, or 0.06 mm or less. good.
- the thermal conductivity in the thickness direction of the obtained aluminum-diamond composite 100 is more sufficiently prevented from decreasing. can be suppressed to
- the thickness can be adjusted within the ranges mentioned above, and can be, for example, 0.01 to 0.20 mm, or 0.02 to 0.15 mm.
- the thickness of the first inorganic layer 4a and the second inorganic layer 4b in this specification can be measured with a micrometer, and is the arithmetic average value of the values measured at five in-plane points.
- the thicknesses of the first inorganic layer 4a and the second inorganic layer 4b improve the thermal conductivity and the like of the aluminum-diamond-based composite 100 obtained, and the aluminum-diamond-based composite 100 due to the difference in thermal expansion coefficients. From the viewpoint of suppressing the
- the first release plate 6a and the second release plate 6b can apply a sufficient pressure when a molten metal containing aluminum is press-fitted and impregnated into the composition layer 2 in the metal layer forming step described later.
- a plate having such a dense structure can be used.
- a stainless steel plate, a ceramic plate, or the like can be used for the first release plate 6a and the second release plate 6b.
- the main surfaces of the first release plate 6a and the second release plate 6b on the side of the composition layer 2 may be coated with a release agent or subjected to release treatment. Examples of such release agents include graphite, boron nitride and alumina.
- a release plate is formed by forming a coating layer of alumina sol or the like on the main surface on the composition layer 2 side, and then further attaching a release agent. can be used.
- a mold release plate By using such a mold release plate, more stable mold release can be performed, and the main surface of the resulting aluminum-diamond composite 100 can be made smoother.
- a metal melt containing aluminum is supplied through the porous material 50 between the porous material 50 and the laminated structure 30 to form a composite portion containing aluminum and diamond. is formed, and a metal layer is formed on at least the side surface of the laminated structure 30 .
- an aluminum-containing metal melt may be infiltrated to form metal-containing layers 22a, 22b.
- the mesh is impregnated with a molten metal containing aluminum in the process to form a metal-containing layer. At the same time, the composite portion and the metal-containing layer are firmly bonded.
- the composition layer of the first inorganic layer 4a and the second inorganic layer 4b itself constitutes a metal-containing layer. The melt of the aluminum-containing metal permeates the main surface on the second side, so that the composite portion and the metal-containing layer are firmly bonded.
- the method of supplying the molten metal containing aluminum may be, for example, a so-called high pressure forging method in which the object is impregnated with the molten metal under high pressure. From the viewpoint of obtaining an aluminum-diamond-based composite 100 with superior thermal conductivity, it is desirable to use a molten metal forging method in the metal layer forming step.
- the metal layer forming step is performed, for example, by immersing the laminate itself prepared in the laminate structure laying step in a container filled with a melt and applying pressure to the melt.
- the melt permeates through the pores of the porous material 50 and is supplied between the inner peripheral surface 50a of the opening of the porous material 50 and the outer peripheral surface of the laminated structure. Compositing occurs due to impregnation of the melt into the interior of the layer 2 .
- the aluminum-containing metal melt may contain, for example, other metals in addition to aluminum.
- Other metals include, for example, silicon, magnesium, and copper.
- the other metal preferably contains at least one of silicon and magnesium.
- the content of the other metals is 2 to 20% by mass, 2 to 15% by mass, or 5 to 15% by mass, based on the total amount of the melt. you can
- the lower limit of the heating temperature may be, for example, 520° C. or higher, or 540° C. or higher. By setting the lower limit of the heating temperature within the above range, the composition layer 2 can be more easily impregnated with the melt, and the composite can be more stably formed in the metal layer forming step.
- the upper limit of the heating temperature may be, for example, 750° C. or lower, or 700° C. or lower.
- the heating temperature may be adjusted within the range described above, and may be, for example, 520-750°C, or 540-700°C.
- the pressure for impregnating the composition layer 2 with the melt may be, for example, 20 MPa or higher, 30 MPa or higher, 40 MPa or higher, or 50 MPa or higher.
- the pressure when impregnating the composition layer 2 with the melt may be, for example, 150 MPa or less, 100 MPa or less, or 80 MPa or less.
- the pressure at which the composition layer 2 is impregnated with the melt may be adjusted within the range described above, and may be, for example, 20 to 150 MPa.
- the average thickness of the metal layer 24 is adjusted to 0.01 to 3.00 mm. Through this step, the average thickness, surface roughness Ra, dimensions, dimensional accuracy, etc. of the metal layer can be adjusted. In this step, the average thickness of the metal-containing layers 22a and 22b can be adjusted as required.
- the metal plate 60 and the porous material 50 are removed, and the first release plate 6a and the second release plate 6b are separated from the metal-containing layer 22a and the metal-containing layer 22b, respectively.
- Means for adjusting the average thickness of the metal layer 24 can employ processing methods employed in normal metal processing, such as polishing and surface grinding.
- the manufacturing method described above may have other processes in addition to the laminated structure laying process, the metal layer forming process, and the layer thickness adjusting process.
- Other processes include, for example, an annealing process and a surface treatment process.
- the annealing step is a step of reducing distortion, etc. that the composite portion 10, the metal layer 24, etc. may have by performing a heat treatment at a relatively low temperature after forming the metal layer 24 before the layer thickness adjustment step. is. Through this process, an aluminum-diamond composite 100 having excellent thermal conductivity can be produced.
- the heating temperature in the annealing step may be, for example, 400-550.degree. C. or 400-500.degree.
- the heating time in the annealing step may be, for example, 10 minutes or longer, or 20 minutes or longer, and may be 24 hours or shorter, or 12 hours or shorter.
- the content of aluminum in the aluminum-containing metal melt may be, for example, 80% by mass or more.
- the aluminum content of each of the metal-containing layer 22a, the metal-containing layer 22b, and the metal layer 24 may be, for example, 80% by mass or more. In this case, it can be processed more easily by a normal metal processing method such as polishing.
- the aluminum content described above may be 85% by mass or more, 90% by mass or more, or 95% by mass or more, and the aluminum content in the metal-containing layer 22a and the metal-containing layer 22b is 100% by mass (i.e., aluminum It may be a metal foil consisting of
- FIG. 2 is a perspective view showing an example of the aluminum-diamond composite obtained by the above-described manufacturing method.
- 3 is a cross-sectional view taken along line III-III of FIG. 2.
- FIG. The aluminum-diamond composite 102 has a flat composite portion 10 containing aluminum and diamond, and a coating layer 20 provided on the surface of the composite portion 10 .
- the coating layer 20 has metal-containing layers 22 a and 22 b provided on the pair of main surfaces of the composite portion 10 and a metal layer 24 provided on the side surfaces of the composite portion 10 .
- the aluminum-diamond-based composite 102 may be the same as the aluminum-diamond-based composite 100 obtained by the above description of the manufacturing method.
- the thickness t 1 of the composite portion 10 may be, for example, 0.4-6.0 mm, 0.4-5.0 mm, or 0.4-4.0 mm.
- the thickness t1 of the composite portion 10 may be, for example, 0.4-6.0 mm, 0.4-5.0 mm, or 0.4-4.0 mm.
- the lower limit of the thickness t1 is within the above range, sufficient strength can be ensured even when the aluminum-diamond composite 102 is used as a heat sink, for example.
- the upper limit of the thickness t 1 is within the above range, the aluminum-diamond composite 102 can ensure sufficient thermal conductivity and suppress an increase in production cost.
- the total thickness (2t 2 ) of the metal-containing layers 22a and 22b constituting both main surfaces of the aluminum-diamond-based composite 102 is, for example, 20 based on the thickness T of the aluminum-diamond-based composite 102. % or less, 15% or less, or 10% or less.
- the total value (2t 2 ) of the thicknesses of the metal-containing layers 22a and 22b is within the above range, it is possible to improve the platability while ensuring thermal conductivity.
- the average thickness t2 of the metal-containing layers 22a and 22b provided on both main surfaces of the composite portion 10 may be, for example, 0.01 to 0.20 mm, or 0.02 to 0.15 mm. .
- the average thickness t2 of the metal-containing layers 22a and 22b provided on both main surfaces of the composite portion 10 can be adjusted by adjusting the thicknesses of the first inorganic layer 4a and the second inorganic layer 4b. .
- the average thickness e of the metal layer 24 on the side surface of the composite portion 10 is, for example, 0.01 to 3.00 mm.
- the average thickness e of the metal layer 24 on the side surface of the composite portion 10 is the distance between the inner peripheral surface 50a of the opening of the porous material 50 and the outer peripheral surface of the laminated structure 30 in the above-described aluminum-diamond composite manufacturing method. , and a layer thickness adjusting step.
- FIG. 4 is a top view showing an example of the aluminum-diamond composite 102.
- the average thickness e of the metal layer 24 formed on the side surface of the aluminum-diamond-based composite 102 is set to a certain thickness from the viewpoint of further suppressing the generation of cracks when subjected to thermal shock in a heat cycle test or the like. can be adjusted to The total value (2e) of the average thickness e of the metal layer 24 on both sides of the aluminum-diamond-based composite 102 is based on the outer dimension L of the aluminum-diamond-based composite 102, for example, 30% or less, 20% 15% or less, or 10% or less. It should be noted that the outer dimension means the maximum length of the sides of the aluminum-diamond composite 102 .
- C is based on D, for example, 50.0% or less, 40 0% or less, or 30.0% or less.
- C can also be, for example, 0.1% or more, or 0.5% or more, based on D.
- the area C of the metal layer 24 in the top view of the aluminum-diamond-based composite 102 (the area of the band-shaped region including the outer edge in the top view of the aluminum-diamond-based composite 102) may be adjusted within the above range. , based on the area D of the metal-containing layer 22a in the top view of the aluminum-diamond-based composite 102, for example, 0.1 to 50.0%.
- the radius of curvature of the four corners of the metal layer 24 may be, for example, 0.5 mm or more, 0.7 mm or more, or 1.0 mm or more.
- the radius of curvature of the four corners of the metal layer 24 may be, for example, 5.0 mm or less, or 4.0 mm or less.
- At least one of the metal-containing layers 22a and 22b and the metal layer 24 may have a smooth surface on the side opposite to the composite portion 10 side.
- the surfaces of the metal-containing layers 22a and 22b on the side opposite to the composite portion 10 side may be smooth surfaces.
- the surface of the metal layer 24 opposite to the composite portion 10 side may be a smooth surface.
- the surface roughness Ra of the smooth surface described above may be, for example, 0.5 to 1.0 ⁇ m, or 0.5 to 0.8 ⁇ m. When the surface roughness Ra is within the above range, the aluminum-diamond composite 100, 102 is used as a heat dissipation member such as a heat sink, for example, and the thermal resistance at the joint surface with another member is further reduced. be able to.
- the surface roughness Ra in this specification means the arithmetic mean roughness described in JIS B 0601: 1994 "Geometric Characteristics Specifications of Products (GPS)-Surface Texture: Contour Method-Terms, Definitions and Surface Texture Parameters". and can be measured by a line contact type measuring instrument.
- a line contact type measuring instrument for example, "Surface Roughness Measuring Instrument Surftest SJ-301" (product name) manufactured by Mitutoyo Co., Ltd. can be used.
- the flatness of the metal-containing layers 22a, 22b in the aluminum-diamond composites 100, 102 may be, for example, 0.020 mm or less, or 0.010 mm or less in terms of a size of 10 mm x 10 mm.
- the flatness is within the above range, it is possible to suppress variation in the bonding layer in bonding other members and obtain higher heat dissipation.
- the lower limit of the aluminum content in the metal layer 24 constituting the aluminum-diamond composites 100 and 102 is, for example, 80% by mass or more, 82% by mass or more, 84% by mass or more, or 86% by mass or more. good.
- the upper limit of the aluminum content in the metal layer 24 constituting the aluminum-diamond-based composites 100 and 102 is, for example, 98% by mass or less, 96% by mass or less, 94% by mass or less, 92% by mass or less, and 90% by mass. or less, or 88% by mass or less.
- the lower limit of the aluminum content in the metal-containing layers 22a and 22b constituting the aluminum-diamond composites 100 and 102 is, for example, 90% by mass or more, 92% by mass or more, 94% by mass or more, 96% by mass or more, Or it may be 98% by mass or more.
- the upper limit of the aluminum content in the metal-containing layers 22a and 22b constituting the aluminum-diamond composites 100 and 102 is not particularly limited, and is 100% by mass (that is, a layer made of aluminum). However, for example, it may be 99% by mass or less.
- the aluminum content of the metal-containing layers on both main surfaces of the aluminum-diamond-based composite and the metal layers on the side surfaces of the aluminum-diamond-based composite herein means values measured by an energy dispersive X-ray spectrometer.
- the aluminum-diamond composites 100, 102 have excellent thermal conductivity.
- the thermal conductivity of the aluminum-diamond composites 100 and 102 at 25° C. can be, for example, 400 W/mK or higher, 450 W/mK or higher, or 500 W/mK or higher.
- Thermal conductivity in this specification means the value measured by the laser flash method.
- "LF/TCM-8510B” product name manufactured by Rigaku Corporation can be used.
- the deformation of the aluminum-diamond composites 100, 102 during heating is suppressed to a low level.
- the linear expansion coefficient of the aluminum-diamond composites 100 and 102 when heated from 25° C. to 400° C. is, for example, 5.0 ⁇ 10 ⁇ 6 to 10.0 ⁇ 10 ⁇ 6 K ⁇ 1 , 5.5 ⁇ 10 ⁇ 6 to 9.0 ⁇ 10 ⁇ 6 K ⁇ 1 , or 5.5 ⁇ 10 ⁇ 6 to 8.5 ⁇ 10 ⁇ 6 K ⁇ 1 .
- a linear expansion coefficient in this specification means a value measured using a thermal dilatometer.
- TMA300 product name manufactured by Seiko Electronics Industry Co., Ltd. can be used.
- the aluminum-diamond-based composites 100 and 102 described above are excellent in thermal conductivity, and can be suitably used as heat dissipation members and the like. Since the aluminum-diamond-based composite according to the present disclosure has a coefficient of thermal expansion equivalent to that of general semiconductor elements, it is also useful as a heat dissipation member for semiconductor elements.
- the semiconductor elements include gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) semiconductor laser elements that require high output, and GaN-HEMT (High Electron Mobility Transistor: HEMT). , a high electron mobility transistor) device, and a high frequency device such as a GaAs-HEMT device.
- the aluminum-diamond composites 100 and 102 described above can also be used as plated parts having a plated layer, for example.
- An embodiment of the plated part has a flat aluminum-diamond-based composite and a metal plating layer provided on the aluminum-diamond-based composite, wherein the aluminum-diamond-based composite is the aluminum- It is a diamond-based composite.
- the metal plating layer in the plated part may have a nickel plating layer and a gold plating layer in this order from the aluminum-diamond composite side.
- the average thickness of the nickel plating layer is preferably 0.5 to 6.5 ⁇ m
- the average thickness of the gold plating layer is preferably 0.5 ⁇ m or more.
- a general plating method can be used to form the plating layer.
- the plating method for example, an electrolytic plating method, an electroless plating method, or the like can be used.
- pretreatment is performed to replace at least part of the surfaces of the aluminum-diamond composites 100, 102 with zinc or the like. good too. By performing such a pretreatment, the adhesion of the plating layer can be further improved.
- amorphous nickel alloy plating When nickel plating is performed, it is more preferable to further apply amorphous nickel alloy plating with a thickness of 0.5 to 6.5 ⁇ m on the surface. In this case, even if the diamond powder is exposed on the surface of the aluminum-diamond-based composite, it is possible to suppress the occurrence of pinholes and the like.
- the amorphous nickel alloy plating in this case may be alloy plating containing, for example, 5 to 15% by weight of nickel and phosphorus (P).
- the nickel alloy plating layer preferably has a thickness of, for example, 0.5 ⁇ m to 2 ⁇ m.
- the thickness of the gold plating layer may be, for example, 0.01 ⁇ m or more from the viewpoint of sufficiently strong bonding.
- the thickness of the gold plating layer may be, for example, 4.00 ⁇ m or less from the viewpoint of cost reduction.
- Example 1 A high-purity diamond powder with an average particle size of 130 ⁇ m (manufactured by Diamond Innovation Co., Ltd.) and a high-purity diamond powder with an average particle size of 15 ⁇ m (manufactured by Diamond Innovation Co., Ltd.) were mixed at a mass ratio of 7:3. , to prepare a mixed powder. Also, the surface of a stainless steel plate (SUS430 material) of length: 43.4 mm x width: 43.4 mm x thickness: 2 mm was coated with alumina sol and baked at 350 ° C. for 30 minutes. A release plate was produced by coating the surface.
- SUS430 material stainless steel plate
- an opening (vertical: 50.2 mm x Width: 50.2 mm, and the radius of curvature of the four corners is 1.0 mm).
- a .40 mm spacer was placed.
- a release plate and pure aluminum foil (aluminum content: 100% by mass, thickness: 0.05 mm, corresponding to the first inorganic layer (later metal-containing layer)) are laminated in this order in a space surrounded by spacers.
- the mixed powder described above was filled thereon to form a composition layer having a thickness of 2.00 mm.
- a pure aluminum foil (aluminum content: 100% by mass, thickness: 0.05 mm, corresponding to the second inorganic layer (later metal-containing layer)) and a release plate are laminated in this order on the composition layer.
- a laminated structure was provided.
- the spacer was then removed to form a space between the isotropic graphite mold and the laminated structure. After removing the spacer, a block-shaped structure was obtained by stacking another iron plate (a structure similar to that shown in FIG. 1(a) was formed. Laminated structure laying step).
- the block-shaped structure After preheating the block-shaped structure to 650°C in an electric furnace, it was placed in a preheated press mold with an inner diameter of 300 mm. A metal mixture having a composition of 12% by mass of silicon, 1% by mass of magnesium, and 87% by mass of aluminum was melted at 800° C. to form a melt (molten metal), which was preheated to form a block-shaped structure. By pouring into a press mold and applying a pressure of 100 MPa for 20 minutes, the melt was permeated inside (metal layer forming step). After that, it was cooled to room temperature. The content of aluminum in the melt of metal was determined by measuring it using solid-state optical emission spectroscopy on the mixture of metals prior to melting.
- a wet band saw was used to cut along the shape of the isotropic graphite material, and the iron plate, the isotropic graphite material, and the release plate were removed. After that, an annealing treatment was performed at 450° C. for 3 hours to remove strain during impregnation (annealing step). After annealing, the surface of the annealed product was polished to obtain an aluminum-diamond composite.
- the thickness of the metal-containing layers on both main surfaces of the aluminum-diamond-based composite and the thickness of the metal layers on the side surfaces were measured as follows. As shown in FIG. 5, the aluminum-diamond composite is cut with a diamond machining jig along the middle line of the aluminum-diamond composite (indicated by the dashed line in FIG. 5). After that, in FIG. 5, 100-fold images of the cut surfaces including both main surfaces and side surfaces were obtained at the four ends marked with circles with a scanning electron microscope. The distance from the outermost surface and side surface to the diamond powder was measured at 5 points at intervals of 200 ⁇ m. The same measurements were performed at four locations, and the arithmetic average value was taken as the average thickness of the metal layer.
- a chip having a diameter of 100 ⁇ m or more is not generated in the metal layer containing aluminum as a main component over the entire outer peripheral portion including the four corners.
- a heat cycle test was performed on the aluminum-diamond composite under the following conditions. Specifically, a cycle of exposing the aluminum-diamond-based composite to a gas phase maintained at ⁇ 40° C. for 30 minutes and then to a gas phase maintained at 125° C. for 30 minutes was repeated 100 times. After that, the surface of the composite was observed with a stereoscopic microscope with a magnification of 10 times and an ultrasonic flaw detector, and the obtained results were evaluated according to the following criteria.
- B At the interface between the composite portion and the metal layer, cracks were confirmed by either microscopic observation or ultrasonic flaw detection.
- Examples 2-8 An aluminum-diamond-based composite was produced in the same manner as in Example 1, except that the distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed as shown in Table 1.
- Example 9-11 The same procedure as in Example 1 was performed except that the size of the opening of the porous material was changed and the distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed as shown in Table 1. Thus, an aluminum-diamond composite was produced.
- Example 12 The distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed as shown in Table 1, and aluminum alloy foil was used for the first metal foil and the second metal foil. An aluminum-diamond composite was produced in the same manner as in Example 1.
- Example 14 and 15 Same as Example 1 except that the distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed as shown in Table 1, and the content of aluminum contained in the molten metal was changed. Thus, an aluminum-diamond composite was produced.
- Example 16 A composition in which a release plate and alumina fibers (thickness: 0.05 mm, porosity: 90%, corresponding to the first inorganic layer) are laminated in this order in a space surrounded by spacers, and formed thereon. Alumina fiber (thickness: 0.05 mm, porosity: 90%, equivalent to the second inorganic layer) and a release plate are further laminated on the material layer in this order to provide a laminated structure. An aluminum-diamond composite was produced in the same manner as in Example 1.
- Example 17 By subjecting the aluminum-diamond composite obtained in Example 1 to surface grinding of the metal layer, an aluminum-diamond composite of Example 17 was produced.
- Example 18 An aluminum-diamond composite was produced in the same manner as in Example 1, except that the thickness of the pure aluminum foil laminated in the space surrounded by the spacer was changed to 0.01 mm.
- Example 19 An aluminum-diamond composite was produced in the same manner as in Example 1, except that the thickness of the pure aluminum foil laminated in the space surrounded by the spacer was changed to 0.2 mm.
- Example 1 An aluminum-diamond composite was produced in the same manner as in Example 1, except that the distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed as shown in Table 1. As a result, an aluminum-diamond composite having no metal layer on the side surface was obtained.
- Example 2 An aluminum-diamond composite was produced in the same manner as in Example 1, except that the distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed to 4.0 mm.
- Example 3 The same procedure as in Example 1 was performed except that the size of the opening of the porous material was changed and the distance between the inner peripheral surface of the opening and the outer peripheral surface of the laminated structure was changed as shown in Table 1. Thus, an aluminum-diamond composite was produced.
- Composition layer 4a First inorganic layer 4b
- Second inorganic layer 6a First release plate 6b
- Second release plate 10 ...
- Composite part 20 ... Coating layer 22a, 22b
- Metal-containing layer 24 Metal layer 30
- Laminated structure 50 Porous material 50a Inner peripheral surface of opening 60
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
[1]
開口部を有する平板状の多孔質材の上記開口部の内周面から離間するように、上記開口部内に、ダイヤモンド粉末を含有する組成物層を含む積層構造を設ける工程と、
アルミニウムを含有する金属の溶融物を、上記多孔質材と上記積層構造との間に圧入し、上記組成物層に含浸させることによって、アルミニウム及びダイヤモンドを含有する複合化部を形成すると共に、上記積層構造の少なくとも側面に金属層を形成する工程と、を有し、
上記積層構造が、第一離型板と、第一無機層と、上記組成物層と、第二無機層と、第二離型板と、をこの順に備える、アルミニウム-ダイヤモンド系複合体の製造方法。
[2]
上記開口部が上下方向に貫通する貫通孔である、[1]に記載の製造方法。
[3]
上記開口部が凹部である、[1]に記載の製造方法。
[4]
上記第一無機層が、無機繊維含有層及びアルミニウムを含有する金属箔の少なくとも一方である、[1]~[3]のいずれかに記載の製造方法。
[5]
上記第二無機層が、無機繊維含有層及びアルミニウムを含有する金属箔の少なくとも一方である、[1]~[4]のいずれかに記載の製造方法。
[6]
上記多孔質材の上記開口部の内周面と、上記積層構造と、の距離が0.05~3.50mmである、[1]~[5]のいずれかに記載の製造方法。
[7]
上記金属層の平均厚さを調整する工程を更に有する、[1]~[6]のいずれかに記載の製造方法。
[8]
上記金属層を形成する工程は溶湯鍛造法によって行われる、[1]~[7]のいずれかに記載の製造方法。
[9]
上記溶融物におけるアルミニウムの含有量が80質量%以上である、[1]~[8]のいずれかに記載の製造方法。
[10]
上記アルミニウム-ダイヤモンド系複合体は、アルミニウム及びダイヤモンドを含有する平板状の複合化部と、上記複合化部の一対の主面上に設けられた金属含有層と、上記複合化部の側面上に設けられた金属層と、を有し、上記金属層の平均厚さが0.01~3.00mmである、[1]~[9]のいずれかに記載の製造方法。
[11]
上記金属含有層及び上記金属層の上記複合化部側とは反対側の面が平滑面である、[10]に記載の製造方法。
[12]
上記平滑面における表面粗さRaが0.5~1.0μmである、[11]に記載の製造方法。
[13]
上記金属含有層の平均厚さが0.01~0.20mmである、[10]~[12]のいずれかに記載の製造方法。
平均粒子径が130μmの高純度ダイヤモンド粉末(ダイヤモンドイノベーション株式会社製)と、平均粒子径が15μmの高純度ダイヤモンド粉末(ダイヤモンドイノベーション株式会社製)とを、質量比で7対3の割合で混合し、混合粉末を用意した。また縦:43.4mm×横:43.4mm×厚さ:2mmのステンレス板(SUS430材)の表面に、アルミナゾルをコーティングし350℃で30分間焼き付け処理を行った後、黒鉛系離型剤を表面に塗布して離型板を作製した。
得られたアルミニウム-ダイヤモンド系複合体について、外形寸法、金属含有層及び金属層の平均厚さ、側面の金属層の割合、金属層のアルミニウム含有量、並びに、曲率半径を測定した。結果を表1に示す。
アルミニウム-ダイヤモンド系複合体の外形寸法はノギスを用いて測定した。
アルミニウム-ダイヤモンド系複合体の両主面における金属含有層、及び側面における金属層の厚さは、以下のようにして測定した。図5に示すように、アルミニウム-ダイヤモンド系複合体の中線(図5中、破線で示す)に沿って、アルミニウム-ダイヤモンド系複合体をダイヤモンド加工治具で切断する。その後、図5中で、○印を付した4箇所の端部において、両主面、及び側面を含む切断面の部分を走査型電子顕微鏡で100倍の画像を取得した。最表面、側面からダイヤモンド粉末までの距離を200μm間隔で5点測定した。4箇所で同様の測定を行い、その算術平均値を金属層の平均厚さとした。
上述の測定によって取得した外形寸法、及び金属層の平均厚さの値から以下の式を用いて、上面視における金属層の割合を算出した。
上面視における金属層の割合=100-[(外形寸法)-2(金属層の平均厚さ)]2÷[外形寸法]2×100
アルミニウム-ダイヤモンド系複合体の両主面における金属含有層、及び側面における金属層のアルミニウム含有量を、エネルギー分散型X線分析装置によって測定した。
アルミニウム-ダイヤモンド系複合体の4角における曲率半径は、CNC(Computer Numerical Control)画像測定機によって、測定した。
アルミニウム-ダイヤモンド系複合体について、後述する方法に沿って外周の欠けの有無、及び熱衝撃耐性を評価した。結果を表1に示す。
アルミニウム-ダイヤモンド系複合体について、鉄板、等方性黒鉛型材、離型板をはがした直後の側面を倍率10倍の実体顕微鏡で観察し、その結果を以下の基準で評価した。
A:四隅を含む外周部全域のアルミニウムを主成分とする金属層に、直径100μm以上の欠けが生じていない。
B:四隅を含む外周部全域のアルミニウムを主成分とする金属層に、直径100μm以上の欠けが1つ以上生じている。
アルミニウム-ダイヤモンド系複合体に対して以下の条件でヒートサイクル試験を行った。具体的には、アルミニウム-ダイヤモンド系複合体を-40℃に保持した気相に30分間さらし、その後125℃に保持した気相に30分間さらすことを1回とするサイクルを100回繰り返した。その後、複合体表面を倍率10倍の実体顕微鏡及び超音波探傷装置で観察し、得られた結果を以下の基準で評価した。
A:複合化部と金属層との界面において、顕微鏡観察、超音波探傷いずれにおいても割れが確認されなかった。
B:複合化部と金属層との界面において、顕微鏡観察、超音波探傷いずれかで割れが確認された。
開口部の内周面と、積層構造の外周面との離間距離を表1に記載したとおりに変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
多孔質材の開口部のサイズを変更し、且つ開口部の内周面と、積層構造の外周面との離間距離を表1に記載したとおりに変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
開口部の内周面と、積層構造の外周面との離間距離を表1に記載したとおりに変更し、且つ第一金属箔、第二金属箔にアルミニウム合金箔を用いたこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
開口部の内周面と、積層構造の外周面との離間距離を表1に記載したとおりに変更し、且つ溶湯に含まれるアルミニウムの含有量を変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
スペーサーで囲われる空間に、離型板、及びアルミナ繊維(厚さ:0.05mm、気孔率:90%、第一無機層に相当)をこの順に積層し、また、それらの上に形成した組成物層の上に更にアルミナ繊維(厚さ:0.05mm、気孔率:90%、第二無機層に相当)及び離型板をこの順に積層し積層構造を設けるよう変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
実施例1で得られたアルミニウム-ダイヤモンド系複合体に対して金属層の平面研削を行うことによって、実施例17のアルミニウム-ダイヤモンド系複合体を作製した。
スペーサーで囲われる空間に積層する純アルミニウム箔の厚さを0.01mmへ変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
スペーサーで囲われる空間に積層する純アルミニウム箔の厚さを0.2mmへ変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
開口部の内周面と、積層構造の外周面との離間距離を表1のとおり変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。その結果、側面に金属層を有しないアルミニウム-ダイヤモンド系複合体が得られた。
開口部の内周面と、積層構造の外周面との離間距離を4.0mmに変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
多孔質材の開口部のサイズを変更し、且つ開口部の内周面と、積層構造の外周面との離間距離を表1に記載したとおりに変更したこと以外は、実施例1と同様にして、アルミニウム-ダイヤモンド系複合体を作製した。
実施例2~19及び比較例1~3で作製したアルミニウム-ダイヤモンド系複合体のそれぞれについて、実施例1と同様に、外形寸法、金属含有層及び金属層の平均厚さ、側面の金属層の割合、金属層のアルミニウム含有量、並びに、曲率半径を測定した。結果を表1、表2に示す。なお、比較例2では、製造の途中で組成物層からの粉漏れが発生し、良好なアルミニウム-ダイヤモンド系複合体を製造することができなかった。そのため、評価対象から外した。
実施例2~15、比較例1及び3で調製したアルミニウム-ダイヤモンド系複合体のそれぞれについて、実施例1と同様に、外周の欠けの有無、及び熱衝撃耐性を評価した。結果を表1に示す。なお、比較例1で作製したアルミニウム-ダイヤモンド系複合体は側面に金属層を有していないため、熱衝撃試験の判定を行うことができなかった。そのため、評価対象から外した。また、比較例2では、製造の途中で組成物層からの粉漏れが発生し、良好なアルミニウム-ダイヤモンド系複合体を製造することができなかった。そのため、評価対象から外した。
Claims (13)
- 開口部を有する平板状の多孔質材の前記開口部の内周面から離間するように、前記開口部内に、ダイヤモンド粉末を含有する組成物層を含む積層構造を設ける工程と、
アルミニウムを含有する金属の溶融物を、前記多孔質材と前記積層構造との間に圧入し、前記組成物層に含浸させることによって、アルミニウム及びダイヤモンドを含有する複合化部を形成すると共に、前記積層構造の少なくとも側面に金属層を形成する工程と、を有し、
前記積層構造が、第一離型板と、第一無機層と、前記組成物層と、第二無機層と、第二離型板と、をこの順に備える、アルミニウム-ダイヤモンド系複合体の製造方法。 - 前記開口部が上下方向に貫通する貫通孔である、請求項1に記載の製造方法。
- 前記開口部が凹部である、請求項1に記載の製造方法。
- 前記第一無機層が、無機繊維含有層及びアルミニウムを含有する金属箔の少なくとも一方である、請求項1~3のいずれか一項に記載の製造方法。
- 前記第二無機層が、無機繊維含有層及びアルミニウムを含有する金属箔の少なくとも一方である、請求項1又は2に記載の製造方法。
- 前記多孔質材の前記開口部の内周面と、前記積層構造と、の距離が0.05~3.50mmである、請求項1又は2に記載の製造方法。
- 前記金属層の平均厚さを調整する工程を更に有する、請求項1又は2に記載の製造方法。
- 前記金属層を形成する工程は溶湯鍛造法によって行われる、請求項1又は2に記載の製造方法。
- 前記溶融物におけるアルミニウムの含有量が80質量%以上である、請求項1又は2に記載の製造方法。
- 前記アルミニウム-ダイヤモンド系複合体は、アルミニウム及びダイヤモンドを含有する平板状の複合化部と、前記複合化部の一対の主面上に設けられた金属含有層と、前記複合化部の側面上に設けられた金属層と、を有し、前記金属層の平均厚さが0.01~3.00mmである、請求項1又は2に記載の製造方法。
- 前記金属含有層及び前記金属層の前記複合化部側とは反対側の面が平滑面である、請求項10に記載の製造方法。
- 前記平滑面における表面粗さRaが0.5~1.0μmである、請求項11に記載の製造方法。
- 前記金属含有層の平均厚さが0.01~0.20mmである、請求項10に記載の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/562,539 US20240226997A1 (en) | 2021-05-26 | 2022-05-16 | Production method for aluminum-diamond composite |
JP2023523422A JPWO2022249918A1 (ja) | 2021-05-26 | 2022-05-16 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021088543 | 2021-05-26 | ||
JP2021-088543 | 2021-05-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022249918A1 true WO2022249918A1 (ja) | 2022-12-01 |
Family
ID=84230032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/020392 WO2022249918A1 (ja) | 2021-05-26 | 2022-05-16 | アルミニウム-ダイヤモンド系複合体の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20240226997A1 (ja) |
JP (1) | JPWO2022249918A1 (ja) |
WO (1) | WO2022249918A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010092972A1 (ja) * | 2009-02-13 | 2010-08-19 | 電気化学工業株式会社 | Led発光素子用複合材料基板、その製造方法及びled発光素子 |
JP2012158817A (ja) * | 2011-02-02 | 2012-08-23 | Denki Kagaku Kogyo Kk | アルミニウム−ダイヤモンド系複合体及びその製造方法 |
WO2017065139A1 (ja) * | 2015-10-13 | 2017-04-20 | デンカ株式会社 | アルミニウム-ダイヤモンド系複合体及びその製造方法 |
WO2017158993A1 (ja) * | 2016-03-15 | 2017-09-21 | デンカ株式会社 | アルミニウム-ダイヤモンド系複合体及び放熱部品 |
-
2022
- 2022-05-16 JP JP2023523422A patent/JPWO2022249918A1/ja active Pending
- 2022-05-16 US US18/562,539 patent/US20240226997A1/en active Pending
- 2022-05-16 WO PCT/JP2022/020392 patent/WO2022249918A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010092972A1 (ja) * | 2009-02-13 | 2010-08-19 | 電気化学工業株式会社 | Led発光素子用複合材料基板、その製造方法及びled発光素子 |
JP2012158817A (ja) * | 2011-02-02 | 2012-08-23 | Denki Kagaku Kogyo Kk | アルミニウム−ダイヤモンド系複合体及びその製造方法 |
WO2017065139A1 (ja) * | 2015-10-13 | 2017-04-20 | デンカ株式会社 | アルミニウム-ダイヤモンド系複合体及びその製造方法 |
WO2017158993A1 (ja) * | 2016-03-15 | 2017-09-21 | デンカ株式会社 | アルミニウム-ダイヤモンド系複合体及び放熱部品 |
Also Published As
Publication number | Publication date |
---|---|
US20240226997A1 (en) | 2024-07-11 |
JPWO2022249918A1 (ja) | 2022-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5988977B2 (ja) | 半導体素子用放熱部品 | |
JP5759152B2 (ja) | アルミニウム−ダイヤモンド系複合体及びその製造方法 | |
US8025962B2 (en) | Aluminum-silicon carbide composite and heat dissipation device employing the same | |
JP7104620B2 (ja) | アルミニウム-ダイヤモンド系複合体及び放熱部品 | |
JP5940244B2 (ja) | アルミニウム−ダイヤモンド系複合体及びその製造方法 | |
US7993728B2 (en) | Aluminum/silicon carbide composite and radiating part comprising the same | |
JP5496888B2 (ja) | アルミニウム−ダイヤモンド系複合体の製造方法 | |
KR102324373B1 (ko) | 방열판 및 그 제조 방법 | |
JP6755879B2 (ja) | アルミニウム−ダイヤモンド系複合体及びその製造方法 | |
JP5755895B2 (ja) | アルミニウム−ダイヤモンド系複合体及びその製造方法 | |
US10541189B2 (en) | Heat dissipation component for semiconductor element | |
WO2015163395A1 (ja) | アルミニウム-ダイヤモンド系複合体及びこれを用いた放熱部品 | |
JP6105262B2 (ja) | アルミニウム−ダイヤモンド系複合体放熱部品 | |
WO2022249918A1 (ja) | アルミニウム-ダイヤモンド系複合体の製造方法 | |
JP2016180185A (ja) | アルミニウム合金−セラミックス複合体、この複合体の製造方法、及びこの複合体からなる応力緩衝材 | |
JP6263324B2 (ja) | アルミニウム合金−セラミックス複合体の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22811191 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2023523422 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18562539 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22811191 Country of ref document: EP Kind code of ref document: A1 |