WO2022247686A1 - Pcb structure of ipex external antenna connection base - Google Patents

Pcb structure of ipex external antenna connection base Download PDF

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Publication number
WO2022247686A1
WO2022247686A1 PCT/CN2022/093259 CN2022093259W WO2022247686A1 WO 2022247686 A1 WO2022247686 A1 WO 2022247686A1 CN 2022093259 W CN2022093259 W CN 2022093259W WO 2022247686 A1 WO2022247686 A1 WO 2022247686A1
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WIPO (PCT)
Prior art keywords
ground pad
clearance area
pad
ipex
clearance
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PCT/CN2022/093259
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French (fr)
Chinese (zh)
Inventor
黄昌强
郭征
李定松
毛开园
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广州视源电子科技股份有限公司
广州视琨电子科技有限公司
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Application filed by 广州视源电子科技股份有限公司, 广州视琨电子科技有限公司 filed Critical 广州视源电子科技股份有限公司
Publication of WO2022247686A1 publication Critical patent/WO2022247686A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the present application relates to the technical field of circuit boards, for example, it relates to a PCB structure of an Ipex external antenna connection base.
  • Ipex (Interconnect and Packaging Electronics, electronic assembly interconnection) external antenna connection seat is used as the hub of radio frequency signals and external antennas. It has the advantages of small size, low price, easy installation and disassembly, and is widely used in PCB boards (Printed CircuitBoard, printed circuit board).
  • the PCB board is generally covered with a layer of copper film, and the Ipex external antenna connection seat is welded on the PCB board, so that the bottom of the Ipex external antenna connection seat is covered with a copper film.
  • the radio frequency signal reaches the Ipex external antenna connection seat through the wiring on the PCB board , the radio frequency signal will be absorbed by the copper film, resulting in serious loss of the radio frequency signal, resulting in a serious decline in product performance.
  • PCB boards of some technologies will set a headroom area on the PCB board corresponding to the Ipex external antenna connection seat, and no copper film will be covered in the headroom area, but the headroom area is often set unreasonably.
  • the grounding of the antenna is not handled properly, causing the RF signal to remain incomplete.
  • the present application aims to overcome at least one defect in some of the above-mentioned technologies, and provides a PCB structure of an Ipex external antenna connection seat to solve the problem of serious loss when the radio frequency signal reaches the Ipex external antenna connection seat.
  • the solution adopted in this application is to provide a PCB structure of an Ipex external antenna connection seat, including a PCB board, the PCB board is provided with a radio frequency signal pad, a first ground pad and a second ground pad, the first A ground pad and the second ground pad are sequentially arranged along the positive direction of the X axis, the radio frequency signal pad is located between the first ground pad and the second ground pad, and along the Y axis The axis protrudes from the first ground pad and the second ground pad in the positive direction, and the PCB board is also provided with a first clearance area, a second clearance area and a third clearance area in sequence along the negative direction of the Y axis; The radio frequency signal pad is located within the range of the first clearance area; the second clearance area is located between the first ground pad and the second ground pad, and protrudes toward the Y axis negatively beyond The first ground pad and the second ground pad.
  • the width of the first clearance area in the X-axis direction is smaller than the margin between the first ground pad and the second ground pad.
  • the width of the first clearance area in the X-axis direction is 0.9mm-1.1mm.
  • the width of the second clearance area in the X-axis direction is equal to or smaller than the margin between the first ground pad and the second ground pad.
  • the width of the third clearance area in the X-axis direction is larger than the margin between the first ground pad and the second ground pad.
  • the width of the third clearance area in the X-axis direction is less than or equal to the center-to-center distance between the first ground pad and the second ground pad.
  • the width of the third clearance area in the X-axis direction is 0.9mm-1.3mm larger than the margin between the first ground pad and the second ground pad.
  • the centerline of the third clearance zone along the Y-axis direction and/or the centerline of the second clearance zone along the Y-axis direction are different from the centerline of the first clearance zone along the Y-axis direction. centerlines coincide.
  • the second clearance area protrudes from the first ground pad and the second ground pad by 0.1 mm-0.2 mm in the negative direction of the Y axis.
  • the first clearance zone, the second clearance zone and the third clearance zone are sequentially connected.
  • the beneficial effect of the present application is: by setting a reasonable headroom area, the attenuation of the radio frequency signal is minimized, and the integrity of the radio frequency signal is greatly guaranteed; the size of the headroom area is neither too large nor too large. Small, not only meets the requirements of radio frequency signal transmission, but also will not affect the copper film to reduce the impedance of the ground wire to make the signal transmission stable and anti-interference function.
  • Figure 1 is a schematic diagram of the PCB structure of the Ipex external antenna connection seat in some technologies.
  • FIG. 2 is a schematic diagram of the PCB structure of the Ipex external antenna connection seat of the embodiment of the present application.
  • Fig. 3 is a schematic diagram of the installation of the Ipex external antenna connection seat of the embodiment of the present application.
  • PCB board 10 radio frequency signal pad 11 , first ground pad 12 , second ground pad 13 , clearance area 20 , first clearance area 21 , second clearance area 22 , third clearance area 23 .
  • first and second are used for descriptive purposes, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • the Ipex external antenna connection socket is generally provided with one input pin and two ground pins. After the Ipex external antenna is mounted on the PCB through the Ipex external antenna connection seat, the input pin, output pin and ground pin are soldered to the pads on the PCB respectively.
  • Fig. 1 illustrates the PCB pad pattern of the Ipex external antenna connection seat in some technologies. There are three pads on the PCB 10: a radio frequency signal pad 11, a first ground pad 12 and a second ground pad 13, The graphics of the three pads are all rectangles. The radio frequency signal pad 11 is soldered to the input pin, and the first ground pad 12 and the second ground pad 13 are soldered to two ground pins respectively.
  • the first ground pad 12 and the second ground pad 13 are sequentially arranged along the positive direction of the X-axis.
  • the radio frequency signal pad 11 is located between the first ground pad 12 and the second ground pad 13 , and protrudes beyond the first ground pad 12 and the second ground pad 13 in the positive direction of the Y axis.
  • the overall pad pattern formed by the radio frequency signal pad 11 , the first ground pad 12 and the second ground pad 13 is axisymmetric with the geometric centerline in the Y-axis direction of the pad pattern as the symmetry axis.
  • FIG 1 also illustrates the clearance zone 20 provided in some techniques.
  • a headroom 20 is provided on the PCB 10 corresponding to the Ipex external antenna connection seat, and no copper film is covered in the headroom 20 .
  • the radio frequency signal pad 11 is located within the clearance area 20 .
  • the clearance zone 20 set in this way is not reasonable enough, and the signal will still be incomplete and the signal attenuation will be large when the radio frequency signal passes through the Ipex external antenna connection seat.
  • FIG. 2 is a schematic diagram of the PCB structure of the Ipex external antenna connection seat of this embodiment, and an XY coordinate system is established as shown in FIG. 2 .
  • the PCB structure of the Ipex external antenna connection seat includes a PCB board 10, and the PCB board 10 is provided with a radio frequency signal pad 11, a first ground pad 12 and a second ground pad 13, and the first ground pad 12 and the second ground pad
  • the pads 13 are sequentially arranged along the positive direction of the X axis, and the radio frequency signal pad 11 is located between the first ground pad 12 and the second ground pad 13, and protrudes beyond the first ground pad 12 and the second ground pad 13 along the positive direction of the Y axis.
  • Two ground pads 13 Two ground pads 13 .
  • the PCB board 10 is also sequentially provided with a first clearance area 21, a second clearance area 22 and a third clearance area 23 along the negative direction of the Y axis;
  • the radio frequency signal pad 11 is located within the scope of the first clearance zone 21;
  • the second clearance area 22 is located between the first ground pad 12 and the second ground pad 13 , and protrudes beyond the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis.
  • the PCB board 10 has no copper clad film in the first clearance area 21, the second clearance area 22 and the third clearance area 23, and the areas other than the first clearance area 21, the second clearance area 22 and the third clearance area 23 are non-cleaning areas area, covered with copper film in the non-clearance area.
  • the radio frequency signal pad 11 may include a solder layer and a solder resist layer surrounding the solder layer.
  • the solder resist layer may be used to prevent short circuit between the solder layer and the rest of the PCB board 10 ; the width of the solder resist layer may be set to 0.1mm-0.15mm.
  • the first ground pad 12 and the second ground pad 14 may also respectively include a solder layer and a solder resist layer surrounding the solder layer.
  • the radio frequency signal pad 11 can be completely within the scope of the first clearance area 21, so as to ensure that when the radio frequency signal is input into the radio frequency signal pad 11, it will not appear due to the absorption of the radio frequency signal by the copper film. loss.
  • the second clearance area 22 is located between the first ground pad 12 and the second ground pad 13, and protrudes from the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis, thereby Between the pad 12 and the third clearance area 23, between the second grounding pad 12 and the third clearance area 23, there will be a non-clearance area, that is, there is a copper film, and the non-clearance area can continue to play the role of reducing the impedance of the ground wire. Function.
  • the first clearance area 21, the second clearance area 22 and the third clearance area 23 can form a reasonable clearance area as a whole.
  • the width of the first clearance area 21 in the X-axis direction is smaller than the margin between the first ground pad 12 and the second ground pad 13, and in one embodiment, the value is 0.9mm- 1.1mm.
  • the margin between the first ground pad 12 and the second ground pad 13 refers to a side of the first ground pad 12 that is close to the second ground pad 13 and the distance between the second ground pad 12 and the second ground pad 13. 13 is close to one side of the first ground pad 12, and the distance between the two.
  • the width of the first clearance area 21 in the X-axis direction needs to be large enough so that the first ground pad 12 falls into the first clearance area 21 .
  • the width of the first clearance area 21 in the X-axis direction should not be too large, so that there are gaps between the radio frequency signal pad 11 and the first ground pad 12, and between the radio frequency signal pad 11 and the second ground pad 13.
  • In the non-clean area that is, there is a copper film, so that the copper film in the non-clear area functions to reduce the impedance of the ground wire.
  • the distance between the first clearance area 21 and the first ground pad 12 in the X-axis direction may be 0.25mm-0.45mm
  • the first The distance between the headroom area 21 and the second ground pad 13 in the X-axis direction may be 0.25mm-0.45mm.
  • the distance between the first clearance area 21 and the first ground pad 12 in the X-axis direction may be 0.25 mm, or 0.35 mm, or 0.45 mm; the distance between the first clearance area 21 and the second The distance between the grounding pad 13 in the X-axis direction can be 0.25mm, 0.35mm, or 0.45mm; The distances in the directions may be equal or unequal, which is not limited in this embodiment.
  • the first clearance area 21 and the first ground pad 12 keep a sufficient distance in the X-axis direction to ensure that the welding of the first ground pad 12 will not be affected, and the first clearance area 21 and the second ground pad 13 are on the X-axis. Keeping a sufficient distance in the direction can ensure that the welding of the second grounding pad 13 will not be affected, and at the same time can make the first clearance area 21 meet the requirements of anti-attenuation of radio frequency signals, and the setting is reasonable to minimize the attenuation of radio frequency signals.
  • the width of the second clearance area 22 in the X-axis direction is equal to or smaller than the margin between the first ground pad 12 and the second ground pad 13, and in one embodiment, the value is 1.6 mm-1.8mm.
  • FIG. 3 is a schematic diagram of the installation of the Ipex external antenna connection seat in this embodiment, and the thick solid line indicates the installation position of the Ipex external antenna connection seat.
  • the width of the second clearance area 22 in the X-axis direction is as large as possible, and the maximum possible value is the margin between the first ground pad 12 and the second ground pad 13, so that the clearance under the Ipex external antenna connection seat
  • the area should be as large as possible to reduce the attenuation of the radio frequency signal as much as possible.
  • the width of the second clearance zone 22 in the X-axis direction is 1.6mm, may also be 1.7mm, and may also be 1.8mm; when the width of the second clearance zone 22 in the X-axis direction is 1.8mm , the width of the second clearance area 22 in the X-axis direction is equal to the distance between the first ground pad 12 and the second ground pad 13 .
  • the width of the second clearance zone 22 in the X-axis direction is 1.6mm-1.8mm, in order to meet the requirement that the width of the second clearance zone 22 in the X-axis direction is equal to or smaller than that between the first ground pad 12 and the second ground pad 13
  • the margin between the first ground pad 12 and the second ground pad 13 can be 1.6mm-1.8mm, which ensures that the welding of the first ground pad 12 and the second ground pad 13 will not be affected influence, and the second clearance zone 22 can meet the anti-attenuation requirements of the radio frequency signal.
  • the width of the third clearance area 23 in the X-axis direction is greater than the margin between the first ground pad 12 and the second ground pad 13 . That is, the width of the third headroom area 23 in the X-axis direction may be greater than the width of the second headroom area 22 in the X-axis direction.
  • the width of the third headroom 23 in the X-axis direction can be larger than the margin between the first grounding pad 12 and the second grounding pad 13, so that the headroom under the Ipex external antenna connection seat is larger, which is beneficial Reduce the attenuation of radio frequency signals.
  • the width of the third clearance area 23 in the X-axis direction is 0.9mm-1.3mm larger than the distance between the first ground pad 12 and the second ground pad 13 . That is, the width of the third headroom area 23 in the X-axis direction may be 0.9mm-1.3mm larger than the width of the second headroom area 22 in the X-axis direction.
  • one side of the third clearance zone 23 may protrude from the second clearance zone 22, and the other side of the third clearance zone 23 does not protrude from the second clearance zone 22; Both sides protrude from the second headroom area 22 .
  • the widths of both sides of the third clearance area 23 respectively protruding from the second clearance area 22 may be equal or unequal, which is not limited in this embodiment.
  • the third clearance zone 21 along the Y-axis direction may coincide with the centerline of the second clearance zone 22 along the Y-axis direction.
  • the centerline of the third clearance area 21 along the Y-axis direction and the centerline of the second clearance area 22 along the Y-axis direction may also coincide with the centerline of the first clearance area 21 along the Y-axis direction.
  • the overall clearance area formed by the first clearance area 21, the second clearance area 22, and the third clearance area 23 is axisymmetric with the geometric center line in the Y-axis direction as the symmetric axis, which is adapted to the overall pad pattern and also based on The geometric center line in the Y-axis direction is the axis of symmetry and is axisymmetric.
  • the width of the third clearance zone 23 in the direction of the X-axis cannot be too large, too large a third clearance zone 23 will affect the effect of the copper film around the first ground pad 12 and the second ground pad 13 on reducing ground impedance , so in one embodiment, the width of the third clearance area 23 in the X-axis direction is less than or equal to the center-to-center distance between the first ground pad 12 and the second ground pad 13 .
  • the center distance between the first ground pad 12 and the second ground pad 13 refers to the center point of the first ground pad 12 and the center point of the second ground pad 13, both the distance between.
  • the height of the second clearance area 22 protruding from the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis is 0.1 mm-0.2 mm.
  • the height of the second clearance area 22 protruding from the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis may be 0.1 mm, 0.15 mm, or 0.2 mm.
  • the second clearance zone 22 protrudes 0.1mm-0.2mm toward the negative direction of the Y axis, so that there is a non-clearance of 0.1mm-0.2mm between the third clearance zone 23 and the first grounding pad 12 and the second grounding pad 13 Area, the non-clear area is set reasonably, so as not to affect the copper film in the non-clear area to reduce the impedance of the ground wire to make the signal transmission stable and anti-interference function, and will not be affected by the first ground pad 12, the second ground pad
  • the copper film in the non-clear area between the disk 13 and the third clear area 23 too much affects the transmission of the radio frequency signal.
  • the first clearance area 21 , the second clearance area 22 and the third clearance area 23 are sequentially connected.
  • the sequential communication of the first headroom area 21 , the second headroom area 22 and the third headroom area 23 can facilitate the processing of headroom areas and non-headroom areas during the PCB copper cladding process.
  • the three clearance areas can all be rectangular, and their dimensions can be respectively: the height of the first clearance area 21 in the Y-axis direction is 1.2mm-1.4mm, and the height of the first clearance area 21 in the X-axis direction is 1.2mm-1.4mm.
  • the upper width is 0.9mm-1.1mm; the height of the second clearance zone 22 in the Y-axis direction is 2.1mm-2.2mm, and the width in the X-axis direction is 1.6mm-1.8mm; the third clearance zone 23 is in the Y-axis direction.
  • the height in the axial direction is 0.55mm-0.65mm, and the width in the X-axis direction is 2.7mm-2.9mm.

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  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Aerials (AREA)

Abstract

The present application provides a PCB structure of an IPEX external antenna connection base, comprising a PCB; the PCB is provided with a radio frequency signal pad, a first ground pad, and a second ground pad, the first ground pad and the second ground pad being sequentially disposed in the forward direction of an X axis, and the radio frequency signal pad being located between the first ground pad and the second ground pad and being higher in a Y axis direction than the first ground pad and the second ground pad; the PCB is further sequentially provided with, in a negative direction of the Y axis, a first clearance area, a second clearance area, and a third clearance area; the radio frequency signal pad is located within the first clearance area; and the second clearance area is located between the first ground pad and the second ground pad, and protrudes from the first ground pad and the second ground pad towards the negative direction of the Y axis. By providing reasonable clearance areas on the PCB, the weakening of a radio frequency signal when arriving at an IPEX external antenna connection base by means of wiring on the PCB is reduced.

Description

一种Ipex外挂天线连接座的PCB结构A PCB structure of an Ipex external antenna connection seat
本申请要求于2021年05月24日提交国家知识产权局、申请号为202121129566.6、发明名称为“一种Ipex外挂天线连接座的PCB结构”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office on May 24, 2021, with application number 202121129566.6, and the title of the invention is "a PCB structure for an Ipex external antenna connection seat", the entire content of which is incorporated by reference in this application.
技术领域technical field
本申请涉及电路板技术领域，例如涉及一种Ipex外挂天线连接座的PCB结构。The present application relates to the technical field of circuit boards, for example, it relates to a PCB structure of an Ipex external antenna connection base.
背景技术Background technique
Ipex(Interconnectand Packaging Electronics，电子装配互联)外挂天线连接座作为射频信号和外挂天线的枢纽，具有体积小、价格低、易于安装和拆卸方便的优点，广泛应用于无线通信相关产品的PCB板(Printed CircuitBoard，印制电路板)上。PCB板上一般覆有一层铜膜，Ipex外挂天线连接座焊接在PCB板上，使得Ipex外挂天线连接座下方覆有铜膜，当射频信号经过PCB板上的走线到达Ipex外挂天线连接座时，射频信号会被铜膜吸收，从而导致射频信号出现严重损耗，使得产品性能下降严重。Ipex (Interconnect and Packaging Electronics, electronic assembly interconnection) external antenna connection seat is used as the hub of radio frequency signals and external antennas. It has the advantages of small size, low price, easy installation and disassembly, and is widely used in PCB boards (Printed CircuitBoard, printed circuit board). The PCB board is generally covered with a layer of copper film, and the Ipex external antenna connection seat is welded on the PCB board, so that the bottom of the Ipex external antenna connection seat is covered with a copper film. When the radio frequency signal reaches the Ipex external antenna connection seat through the wiring on the PCB board , the radio frequency signal will be absorbed by the copper film, resulting in serious loss of the radio frequency signal, resulting in a serious decline in product performance.
一些技术的PCB板为了解决上述射频信号严重损耗的问题，会在PCB板上对应Ipex外挂天线连接座处设置净空区，在净空区内不覆铜膜，但是净空区往往设置不合理、Ipex外挂天线的接地处理不当，导致射频信号仍然不完整。In order to solve the serious loss problem of the above-mentioned radio frequency signal, PCB boards of some technologies will set a headroom area on the PCB board corresponding to the Ipex external antenna connection seat, and no copper film will be covered in the headroom area, but the headroom area is often set unreasonably. The grounding of the antenna is not handled properly, causing the RF signal to remain incomplete.
实用新型内容Utility model content
本申请旨在克服上述一些技术中至少一种缺陷，提供一种Ipex外挂天线连接座的PCB结构，以解决射频信号到达Ipex外挂天线连接座时出现严重损耗的问题。The present application aims to overcome at least one defect in some of the above-mentioned technologies, and provides a PCB structure of an Ipex external antenna connection seat to solve the problem of serious loss when the radio frequency signal reaches the Ipex external antenna connection seat.
本申请采用的方案为，提供一种Ipex外挂天线连接座的PCB结构，包括PCB板，所述PCB板上设有射频信号焊盘、第一接地焊盘和第二接地焊盘，所述第一接地焊盘和所述第二接地焊盘沿着X轴正向依次设置，所述射频信号焊盘位于所述第一接地焊盘与所述第二接地焊盘之间，并沿着Y轴正向突出于所述第一接地焊盘和所述第二接地焊盘，所述PCB板沿着Y轴负向还依次设有第一净空区、第二净空区和第三净空区；所述射频信号焊盘位于所述第一净空区的范围 内；所述第二净空区位于所述第一接地焊盘和所述第二接地焊盘之间，并向着Y轴负向突出于所述第一接地焊盘和所述第二接地焊盘。The solution adopted in this application is to provide a PCB structure of an Ipex external antenna connection seat, including a PCB board, the PCB board is provided with a radio frequency signal pad, a first ground pad and a second ground pad, the first A ground pad and the second ground pad are sequentially arranged along the positive direction of the X axis, the radio frequency signal pad is located between the first ground pad and the second ground pad, and along the Y axis The axis protrudes from the first ground pad and the second ground pad in the positive direction, and the PCB board is also provided with a first clearance area, a second clearance area and a third clearance area in sequence along the negative direction of the Y axis; The radio frequency signal pad is located within the range of the first clearance area; the second clearance area is located between the first ground pad and the second ground pad, and protrudes toward the Y axis negatively beyond The first ground pad and the second ground pad.
在一实施例中，所述第一净空区在X轴方向上的宽度小于所述第一接地焊盘和所述第二接地焊盘之间的边距。In an embodiment, the width of the first clearance area in the X-axis direction is smaller than the margin between the first ground pad and the second ground pad.
在一实施例中，所述第一净空区在X轴方向上的宽度为0.9mm-1.1mm。In one embodiment, the width of the first clearance area in the X-axis direction is 0.9mm-1.1mm.
在一实施例中，所述第二净空区在X轴方向上的宽度等于或小于所述第一接地焊盘和所述第二接地焊盘之间的边距。In an embodiment, the width of the second clearance area in the X-axis direction is equal to or smaller than the margin between the first ground pad and the second ground pad.
在一实施例中，所述第三净空区在X轴方向上的宽度大于所述第一接地焊盘和所述第二接地焊盘之间的边距。In an embodiment, the width of the third clearance area in the X-axis direction is larger than the margin between the first ground pad and the second ground pad.
在一实施例中，所述第三净空区在X轴方向上的宽度小于或等于所述第一接地焊盘和所述第二接地焊盘之间的中心距。In an embodiment, the width of the third clearance area in the X-axis direction is less than or equal to the center-to-center distance between the first ground pad and the second ground pad.
在一实施例中，所述第三净空区在X轴方向上的宽度比所述第一接地焊盘和所述第二接地焊盘之间的边距大0.9mm-1.3mm。In an embodiment, the width of the third clearance area in the X-axis direction is 0.9mm-1.3mm larger than the margin between the first ground pad and the second ground pad.
在一实施例中，所述第三净空区沿着Y轴方向的中心线和/或所述第二净空区沿着Y轴方向的中心线，与所述第一净空区沿着Y轴方向的中心线重合。In an embodiment, the centerline of the third clearance zone along the Y-axis direction and/or the centerline of the second clearance zone along the Y-axis direction are different from the centerline of the first clearance zone along the Y-axis direction. centerlines coincide.
在一实施例中，所述第二净空区向着Y轴负向突出于所述第一接地焊盘和所述第二接地焊盘0.1mm-0.2mm。In an embodiment, the second clearance area protrudes from the first ground pad and the second ground pad by 0.1 mm-0.2 mm in the negative direction of the Y axis.
在一实施例中，所述第一净空区、所述第二净空区和所述第三净空区依次连通。In an embodiment, the first clearance zone, the second clearance zone and the third clearance zone are sequentially connected.
与一些技术相比，本申请的有益效果为：通过设置合理的净空区，最大程度减少射频信号的衰减，极大保障射频信号的完整性；净空区的尺寸，不会太大也不会太小，既满足射频信号传输的要求，又不致于影响铜膜发挥降低地线阻抗使信号传输稳定、抗干扰的功能。Compared with some technologies, the beneficial effect of the present application is: by setting a reasonable headroom area, the attenuation of the radio frequency signal is minimized, and the integrity of the radio frequency signal is greatly guaranteed; the size of the headroom area is neither too large nor too large. Small, not only meets the requirements of radio frequency signal transmission, but also will not affect the copper film to reduce the impedance of the ground wire to make the signal transmission stable and anti-interference function.
附图说明Description of drawings
图1为一些技术中Ipex外挂天线连接座的PCB结构示意图。Figure 1 is a schematic diagram of the PCB structure of the Ipex external antenna connection seat in some technologies.
图2为本申请实施例Ipex外挂天线连接座的PCB结构示意图。FIG. 2 is a schematic diagram of the PCB structure of the Ipex external antenna connection seat of the embodiment of the present application.
图3为本申请实施例Ipex外挂天线连接座的安装示意图。Fig. 3 is a schematic diagram of the installation of the Ipex external antenna connection seat of the embodiment of the present application.
附图标记：PCB板10，射频信号焊盘11，第一接地焊盘12，第二接地焊盘13，净空区20，第一净空区21，第二净空区22，第三净空区23。Reference numerals: PCB board 10 , radio frequency signal pad 11 , first ground pad 12 , second ground pad 13 , clearance area 20 , first clearance area 21 , second clearance area 22 , third clearance area 23 .
具体实施方式Detailed ways
本申请附图用于示例性说明，不能理解为对本申请的限制。为了更好说明以下实施例，附图某些部件会有省略、放大或缩小，并不代表实际产品的尺寸；对于本领域技术人员来说，附图中某些公知结构及其说明可能省略是可以理解的。The accompanying drawings of this application are used for illustrative purposes and should not be construed as limitations on this application. In order to better illustrate the following embodiments, some components in the drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, some known structures and their descriptions in the drawings may be omitted. understandable.
此外，术语“第一”、“第二”用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.
在本申请中，除非另有明确的规定和限定，属于“安装”、“相连”“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In this application, unless otherwise specified and limited, terms such as "installation", "connection", "connection", and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
Ipex外挂天线连接座一般设置有一个输入引脚和两个接地引脚。Ipex外挂天线通过Ipex外挂天线连接座贴装在PCB板后，输入引脚、输出引脚和接地引脚分别与PCB板上的焊盘焊接。图1示意了一些技术中的Ipex外挂天线连接座的PCB板焊盘图形，PCB板10上设有三个焊盘：射频信号焊盘11、第一接地焊盘12和第二接地焊盘13，三个焊盘的图形均为矩形。射频信号焊盘11与输入引脚焊接，第一接地焊盘12和第二接地焊盘13分别与两个接地引脚焊接。The Ipex external antenna connection socket is generally provided with one input pin and two ground pins. After the Ipex external antenna is mounted on the PCB through the Ipex external antenna connection seat, the input pin, output pin and ground pin are soldered to the pads on the PCB respectively. Fig. 1 illustrates the PCB pad pattern of the Ipex external antenna connection seat in some technologies. There are three pads on the PCB 10: a radio frequency signal pad 11, a first ground pad 12 and a second ground pad 13, The graphics of the three pads are all rectangles. The radio frequency signal pad 11 is soldered to the input pin, and the first ground pad 12 and the second ground pad 13 are soldered to two ground pins respectively.
以图1所示建立XY轴坐标系。第一接地焊盘12、第二接地焊盘13沿着X轴正向依次设置。射频信号焊盘11位于第一接地焊盘12和第二接地焊盘13之间，且向着Y轴正向突出于第一接地焊盘12和第二接地焊盘13。射频信号焊盘11、第一接地焊盘12和第二接地焊盘13所形成的整体焊盘图形以焊盘图形Y轴方向的几何中心线为对称轴呈轴对称。Establish the XY axis coordinate system as shown in Figure 1. The first ground pad 12 and the second ground pad 13 are sequentially arranged along the positive direction of the X-axis. The radio frequency signal pad 11 is located between the first ground pad 12 and the second ground pad 13 , and protrudes beyond the first ground pad 12 and the second ground pad 13 in the positive direction of the Y axis. The overall pad pattern formed by the radio frequency signal pad 11 , the first ground pad 12 and the second ground pad 13 is axisymmetric with the geometric centerline in the Y-axis direction of the pad pattern as the symmetry axis.
射频信号从射频芯片发出后输入射频信号焊盘11，再经Ipex天线向外辐射。射频信号在经过Ipex外挂天线连接座时，会部分被PCB板10上的铜膜吸收，使得射频信号发生衰减。图1还示意了一些技术中设置的净空区20。为了让射频信号经过Ipex外挂天线连接座时不发生严重损耗，会在PCB板10上对应Ipex外挂天线连接座处设置净空区20，在净空区20内不覆铜膜。射频信号焊盘11 位于净空区20的范围内。但是如此设置的净空区20不够合理，射频信号经过Ipex外挂天线连接座时仍然会出现信号不完整、信号衰减大。After the radio frequency signal is sent from the radio frequency chip, it enters the radio frequency signal pad 11, and then radiates outward through the Ipex antenna. When the radio frequency signal passes through the Ipex external antenna connection seat, it will be partially absorbed by the copper film on the PCB 10 , so that the radio frequency signal is attenuated. Figure 1 also illustrates the clearance zone 20 provided in some techniques. In order to prevent the radio frequency signal from being severely lost when it passes through the Ipex external antenna connection seat, a headroom 20 is provided on the PCB 10 corresponding to the Ipex external antenna connection seat, and no copper film is covered in the headroom 20 . The radio frequency signal pad 11 is located within the clearance area 20 . However, the clearance zone 20 set in this way is not reasonable enough, and the signal will still be incomplete and the signal attenuation will be large when the radio frequency signal passes through the Ipex external antenna connection seat.
在一个实施例中，提供一种Ipex外挂天线连接座的PCB结构，图2为本实施例Ipex外挂天线连接座的PCB结构示意图，以图2所示建立XY轴坐标系。Ipex外挂天线连接座的PCB结构包括PCB板10，PCB板10上设有射频信号焊盘11、第一接地焊盘12和第二接地焊盘13，第一接地焊盘12和第二接地焊盘13沿着X轴正向依次设置，射频信号焊盘11位于第一接地焊盘12与第二接地焊盘13之间，并沿着Y轴正向突出于第一接地焊盘12和第二接地焊盘13。In one embodiment, a PCB structure of an Ipex external antenna connection seat is provided. FIG. 2 is a schematic diagram of the PCB structure of the Ipex external antenna connection seat of this embodiment, and an XY coordinate system is established as shown in FIG. 2 . The PCB structure of the Ipex external antenna connection seat includes a PCB board 10, and the PCB board 10 is provided with a radio frequency signal pad 11, a first ground pad 12 and a second ground pad 13, and the first ground pad 12 and the second ground pad The pads 13 are sequentially arranged along the positive direction of the X axis, and the radio frequency signal pad 11 is located between the first ground pad 12 and the second ground pad 13, and protrudes beyond the first ground pad 12 and the second ground pad 13 along the positive direction of the Y axis. Two ground pads 13 .
PCB板10沿着Y轴负向还依次设有第一净空区21、第二净空区22和第三净空区23；The PCB board 10 is also sequentially provided with a first clearance area 21, a second clearance area 22 and a third clearance area 23 along the negative direction of the Y axis;
射频信号焊盘11位于第一净空区21的范围内；The radio frequency signal pad 11 is located within the scope of the first clearance zone 21;
第二净空区22位于第一接地焊盘12和第二接地焊盘13之间，并向着Y轴负向突出于第一接地焊盘12和所述第二接地焊盘13。The second clearance area 22 is located between the first ground pad 12 and the second ground pad 13 , and protrudes beyond the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis.
PCB板10在第一净空区21、第二净空区22和第三净空区23没有覆铜膜，除了第一净空区21、第二净空区22和第三净空区23以外的区域为非净空区，在非净空区覆有铜膜。The PCB board 10 has no copper clad film in the first clearance area 21, the second clearance area 22 and the third clearance area 23, and the areas other than the first clearance area 21, the second clearance area 22 and the third clearance area 23 are non-cleaning areas area, covered with copper film in the non-clearance area.
射频信号焊盘11可以包括焊接层和包围焊接层的阻焊层，阻焊层可以用于防止焊接层与PCB板10的其余地方短路；阻焊层的宽度可设置为0.1mm-0.15mm。同理，第一接地焊盘12和第二接地焊盘14也可以分别包括焊接层和包围焊接层的阻焊层。The radio frequency signal pad 11 may include a solder layer and a solder resist layer surrounding the solder layer. The solder resist layer may be used to prevent short circuit between the solder layer and the rest of the PCB board 10 ; the width of the solder resist layer may be set to 0.1mm-0.15mm. Similarly, the first ground pad 12 and the second ground pad 14 may also respectively include a solder layer and a solder resist layer surrounding the solder layer.
通过设置第一净空区21，可以使射频信号焊盘11完全落入第一净空区21的范围内，保证射频信号输入射频信号焊盘11时，不会因铜膜对射频信号的吸收而出现损耗。第二净空区22位于第一接地焊盘12和第二接地焊盘13之间，并向着Y轴负向突出于第一接地焊盘12和第二接地焊盘13，由此在第一接地焊盘12与第三净空区23之间、第二接地焊盘12与第三净空区23之间会存在非净空区，也即存在铜膜，该非净空区可以继续发挥降低地线阻抗的功能。第一净空区21、第二净空区22和第三净空区23，整体上可以构成合理的净空区，当射频信号传输至Ipex外挂天线连接座时，射频信号不容易被铜膜影响，以最小的损耗辐射出去，最大程度减少射频信号的衰减，极大保障射频信号的完整性。By setting the first clearance area 21, the radio frequency signal pad 11 can be completely within the scope of the first clearance area 21, so as to ensure that when the radio frequency signal is input into the radio frequency signal pad 11, it will not appear due to the absorption of the radio frequency signal by the copper film. loss. The second clearance area 22 is located between the first ground pad 12 and the second ground pad 13, and protrudes from the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis, thereby Between the pad 12 and the third clearance area 23, between the second grounding pad 12 and the third clearance area 23, there will be a non-clearance area, that is, there is a copper film, and the non-clearance area can continue to play the role of reducing the impedance of the ground wire. Function. The first clearance area 21, the second clearance area 22 and the third clearance area 23 can form a reasonable clearance area as a whole. When the radio frequency signal is transmitted to the Ipex external antenna connection seat, the radio frequency signal is not easily affected by the copper film, with a minimum The loss is radiated out, the attenuation of the radio frequency signal is minimized, and the integrity of the radio frequency signal is greatly guaranteed.
在一个实施例中，第一净空区21在X轴方向上的宽度小于第一接地焊盘12和第二接地焊盘13之间的边距，在一实施例中，取值为0.9mm-1.1mm。如图2所示，第一接地焊盘12和第二接地焊盘13之间的边距，是指第一接地焊盘12靠近第二接地焊盘13的一条边，与第二接地焊盘13靠近第一接地焊盘12的一条边，两者之间的距离。In one embodiment, the width of the first clearance area 21 in the X-axis direction is smaller than the margin between the first ground pad 12 and the second ground pad 13, and in one embodiment, the value is 0.9mm- 1.1mm. As shown in FIG. 2 , the margin between the first ground pad 12 and the second ground pad 13 refers to a side of the first ground pad 12 that is close to the second ground pad 13 and the distance between the second ground pad 12 and the second ground pad 13. 13 is close to one side of the first ground pad 12, and the distance between the two.
第一净空区21在X轴方向上的宽度需要足够大，才可以使得第一接地焊盘12落入第一净空区21。第一净空区21在X轴方向上的宽度又不能太大，才可以使得射频信号焊盘11与第一接地焊盘12之间、射频信号焊盘11与第二接地焊盘13之间存在非净空区，也即存在铜膜，以使得该非净空区的铜膜发挥降低地线阻抗的功能。The width of the first clearance area 21 in the X-axis direction needs to be large enough so that the first ground pad 12 falls into the first clearance area 21 . The width of the first clearance area 21 in the X-axis direction should not be too large, so that there are gaps between the radio frequency signal pad 11 and the first ground pad 12, and between the radio frequency signal pad 11 and the second ground pad 13. In the non-clean area, that is, there is a copper film, so that the copper film in the non-clear area functions to reduce the impedance of the ground wire.
当第一净空区21在X轴方向上的宽度为0.9mm-1.1mm时，第一净空区21与第一接地焊盘12在X轴方向上的距离可以为0.25mm-0.45mm，第一净空区21与第二接地焊盘13在X轴方向上的距离可以为0.25mm-0.45mm。When the width of the first clearance area 21 in the X-axis direction is 0.9mm-1.1mm, the distance between the first clearance area 21 and the first ground pad 12 in the X-axis direction may be 0.25mm-0.45mm, the first The distance between the headroom area 21 and the second ground pad 13 in the X-axis direction may be 0.25mm-0.45mm.
在一实施例中，第一净空区21与第一接地焊盘12在X轴方向上的距离可以为0.25mm，也可以为0.35mm，还可以为0.45mm；第一净空区21与第二接地焊盘13在X轴方向上的距离可以为0.25mm，也可以为0.35mm，还可以为0.45mm；第一净空区21与第一接地焊盘12、第二接地焊盘13在X轴方向上的距离可以相等，亦可以不相等，本实施例对此不作限定。In one embodiment, the distance between the first clearance area 21 and the first ground pad 12 in the X-axis direction may be 0.25 mm, or 0.35 mm, or 0.45 mm; the distance between the first clearance area 21 and the second The distance between the grounding pad 13 in the X-axis direction can be 0.25mm, 0.35mm, or 0.45mm; The distances in the directions may be equal or unequal, which is not limited in this embodiment.
第一净空区21与第一接地焊盘12在X轴方向上保持足够的距离可以保证第一接地焊盘12焊接不会受到影响，第一净空区21与第二接地焊盘13在X轴方向上保持足够的距离，可以保证第二接地焊盘13焊接不会受到影响，同时可以使第一净空区21满足射频信号抗衰减的要求，设置合理，最大程度减少射频信号的衰减。The first clearance area 21 and the first ground pad 12 keep a sufficient distance in the X-axis direction to ensure that the welding of the first ground pad 12 will not be affected, and the first clearance area 21 and the second ground pad 13 are on the X-axis. Keeping a sufficient distance in the direction can ensure that the welding of the second grounding pad 13 will not be affected, and at the same time can make the first clearance area 21 meet the requirements of anti-attenuation of radio frequency signals, and the setting is reasonable to minimize the attenuation of radio frequency signals.
在一个实施例中，第二净空区22在X轴方向上的宽度等于或小于第一接地焊盘12和第二接地焊盘13之间的边距，在一实施例中，取值为1.6mm-1.8mm。In one embodiment, the width of the second clearance area 22 in the X-axis direction is equal to or smaller than the margin between the first ground pad 12 and the second ground pad 13, and in one embodiment, the value is 1.6 mm-1.8mm.
图3为本实施例Ipex外挂天线连接座的安装示意图，粗实线表示Ipex外挂天线连接座的安装位置。第二净空区22在X轴方向上的宽度尽可能地大，最大可以取值为第一接地焊盘12和第二接地焊盘13之间的边距，使得Ipex外挂天线连接座下的净空区尽可能地大，尽可能地减少射频信号的衰减。FIG. 3 is a schematic diagram of the installation of the Ipex external antenna connection seat in this embodiment, and the thick solid line indicates the installation position of the Ipex external antenna connection seat. The width of the second clearance area 22 in the X-axis direction is as large as possible, and the maximum possible value is the margin between the first ground pad 12 and the second ground pad 13, so that the clearance under the Ipex external antenna connection seat The area should be as large as possible to reduce the attenuation of the radio frequency signal as much as possible.
在一实施例中，第二净空区22在X轴方向上的宽度为1.6mm，也可以为1.7mm，还可以为1.8mm；当第二净空区22在X轴方向上的宽度为1.8mm时，第二净空区22在X轴方向上的宽度等于第一接地焊盘12和第二接地焊盘13之间的距离。In one embodiment, the width of the second clearance zone 22 in the X-axis direction is 1.6mm, may also be 1.7mm, and may also be 1.8mm; when the width of the second clearance zone 22 in the X-axis direction is 1.8mm , the width of the second clearance area 22 in the X-axis direction is equal to the distance between the first ground pad 12 and the second ground pad 13 .
第二净空区22在X轴方向上的宽度为1.6mm-1.8mm，为了满足第二净空区22在X轴方向上的宽度等于或小于第一接地焊盘12和第二接地焊盘13之间的边距，第一接地焊盘12和第二接地焊盘13之间的边距可以为1.6mm-1.8mm，既保证第一接地焊盘12和第二接地焊盘13焊接不会受到影响，又可以使第二净空区22的满足射频信号抗衰减的要求。The width of the second clearance zone 22 in the X-axis direction is 1.6mm-1.8mm, in order to meet the requirement that the width of the second clearance zone 22 in the X-axis direction is equal to or smaller than that between the first ground pad 12 and the second ground pad 13 The margin between the first ground pad 12 and the second ground pad 13 can be 1.6mm-1.8mm, which ensures that the welding of the first ground pad 12 and the second ground pad 13 will not be affected influence, and the second clearance zone 22 can meet the anti-attenuation requirements of the radio frequency signal.
在一个实施例中，第三净空区23在X轴方向上的宽度大于第一接地焊盘12与第二接地焊盘13之间的边距。也即，第三净空区23在X轴方向上的宽度可以大于第二净空区22在X轴方向上的宽度。In one embodiment, the width of the third clearance area 23 in the X-axis direction is greater than the margin between the first ground pad 12 and the second ground pad 13 . That is, the width of the third headroom area 23 in the X-axis direction may be greater than the width of the second headroom area 22 in the X-axis direction.
第三净空区23在X轴方向上的宽度可以比第一接地焊盘12与第二接地焊盘13之间的边距要大，使得Ipex外挂天线连接座下的净空区更大，有利于减少射频信号的衰减。The width of the third headroom 23 in the X-axis direction can be larger than the margin between the first grounding pad 12 and the second grounding pad 13, so that the headroom under the Ipex external antenna connection seat is larger, which is beneficial Reduce the attenuation of radio frequency signals.
在一个实施例中，第三净空区23在X轴方向上的宽度比第一接地焊盘12和第二接地焊盘13之间的距离大0.9mm-1.3mm。也即，第三净空区23在X轴方向上的宽度可以比第二净空区22在X轴方向上的宽度大0.9mm-1.3mm。In one embodiment, the width of the third clearance area 23 in the X-axis direction is 0.9mm-1.3mm larger than the distance between the first ground pad 12 and the second ground pad 13 . That is, the width of the third headroom area 23 in the X-axis direction may be 0.9mm-1.3mm larger than the width of the second headroom area 22 in the X-axis direction.
在一实施例中，可以是第三净空区23的一侧突出第二净空区22，第三净空区23的另一侧不突出第二净空区22；也可以是第三净空区23的两侧均突出第二净空区22。当第三净空区23的两侧均突出第二净空区22时，第三净空区23的两侧分别突出第二净空区22的宽度可以相等也可以不相等，本实施例对此不作限定。In one embodiment, one side of the third clearance zone 23 may protrude from the second clearance zone 22, and the other side of the third clearance zone 23 does not protrude from the second clearance zone 22; Both sides protrude from the second headroom area 22 . When both sides of the third clearance area 23 protrude from the second clearance area 22 , the widths of both sides of the third clearance area 23 respectively protruding from the second clearance area 22 may be equal or unequal, which is not limited in this embodiment.
当第三净空区23的两侧均突出第二净空区22，且第三净空区23的两侧分别突出第二净空区22的宽度均相等时，第三净空区21沿着Y轴方向的中心线可以与第二净空区22沿着Y轴方向的中心线重合。第三净空区21沿着Y轴方向的中心线和第二净空区22沿着Y轴方向的中心线，还可以与第一净空区21沿着Y轴方向的中心线重合。如此，第一净空区21、第二净空区22、第三净空 区23所形成的整体净空区以其Y轴方向的几何中心线为对称轴呈轴对称，这是适应整体焊盘图形也是以其Y轴方向的几何中心线为对称轴呈轴对称。When both sides of the third clearance zone 23 protrude from the second clearance zone 22, and both sides of the third clearance zone 23 respectively protrude from the second clearance zone 22 with the same width, the third clearance zone 21 along the Y-axis direction The centerline may coincide with the centerline of the second clearance zone 22 along the Y-axis direction. The centerline of the third clearance area 21 along the Y-axis direction and the centerline of the second clearance area 22 along the Y-axis direction may also coincide with the centerline of the first clearance area 21 along the Y-axis direction. In this way, the overall clearance area formed by the first clearance area 21, the second clearance area 22, and the third clearance area 23 is axisymmetric with the geometric center line in the Y-axis direction as the symmetric axis, which is adapted to the overall pad pattern and also based on The geometric center line in the Y-axis direction is the axis of symmetry and is axisymmetric.
第三净空区23在X轴方向上的宽度也不能太大，太大的第三净空区23会影响第一接地焊盘12和第二接地焊盘13周边铜膜对降低地线阻抗的作用，因此在一个实施例中，第三净空区23在X轴方向上的宽度小于或等于第一接地焊盘12和第二接地焊盘13之间的中心距。如图2所示，第一接地焊盘12和第二接地焊盘13之间的中心距，是指第一接地焊盘12的中心点，与第二接地焊盘13的中心点，两者之间的距离。The width of the third clearance zone 23 in the direction of the X-axis cannot be too large, too large a third clearance zone 23 will affect the effect of the copper film around the first ground pad 12 and the second ground pad 13 on reducing ground impedance , so in one embodiment, the width of the third clearance area 23 in the X-axis direction is less than or equal to the center-to-center distance between the first ground pad 12 and the second ground pad 13 . As shown in Figure 2, the center distance between the first ground pad 12 and the second ground pad 13 refers to the center point of the first ground pad 12 and the center point of the second ground pad 13, both the distance between.
在一个实施例中，第二净空区22向着Y轴负向突出于第一接地焊盘12和第二接地焊盘13的高度为0.1mm-0.2mm。In one embodiment, the height of the second clearance area 22 protruding from the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis is 0.1 mm-0.2 mm.
在一实施例中，第二净空区22向着Y轴负向突出于第一接地焊盘12和第二接地焊盘13的高度可以为0.1mm，也可以为0.15mm，还可以为0.2mm。In an embodiment, the height of the second clearance area 22 protruding from the first ground pad 12 and the second ground pad 13 in the negative direction of the Y axis may be 0.1 mm, 0.15 mm, or 0.2 mm.
第二净空区22向着Y轴负向突出0.1mm-0.2mm，使得第三净空区23与第一接地焊盘12、第二接地焊盘13之间存在着0.1mm-0.2mm高的非净空区，该非净空区设置合理，既不致于影响该非净空区的铜膜发挥降低地线阻抗使信号传输稳定、抗干扰的功能，又不会因第一接地焊盘12、第二接地焊盘13与第三净空区23之间的非净空区的铜膜过多地影响射频信号的传输。The second clearance zone 22 protrudes 0.1mm-0.2mm toward the negative direction of the Y axis, so that there is a non-clearance of 0.1mm-0.2mm between the third clearance zone 23 and the first grounding pad 12 and the second grounding pad 13 Area, the non-clear area is set reasonably, so as not to affect the copper film in the non-clear area to reduce the impedance of the ground wire to make the signal transmission stable and anti-interference function, and will not be affected by the first ground pad 12, the second ground pad The copper film in the non-clear area between the disk 13 and the third clear area 23 too much affects the transmission of the radio frequency signal.
在一个实施例中，第一净空区21、第二净空区22和第三净空区23依次连通。In one embodiment, the first clearance area 21 , the second clearance area 22 and the third clearance area 23 are sequentially connected.
第一净空区21、第二净空区22和第三净空区23的依次连通可以方便在PCB覆铜工艺过程中处理净空区和非净空区。The sequential communication of the first headroom area 21 , the second headroom area 22 and the third headroom area 23 can facilitate the processing of headroom areas and non-headroom areas during the PCB copper cladding process.
如图2所示，在一实施例中，三个净空区可以均为矩形，其尺寸分别可以为：第一净空区21在Y轴方向上的高度为1.2mm-1.4mm，在X轴方向上的宽度为0.9mm-1.1mm；第二净空区22在Y轴方向上的高度为2.1mm-2.2mm，在X轴方向上的宽度为1.6mm-1.8mm；第三净空区23在Y轴方向上的高度为0.55mm-0.65mm，在X轴方向上的宽度为2.7mm-2.9mm。As shown in Figure 2, in one embodiment, the three clearance areas can all be rectangular, and their dimensions can be respectively: the height of the first clearance area 21 in the Y-axis direction is 1.2mm-1.4mm, and the height of the first clearance area 21 in the X-axis direction is 1.2mm-1.4mm. The upper width is 0.9mm-1.1mm; the height of the second clearance zone 22 in the Y-axis direction is 2.1mm-2.2mm, and the width in the X-axis direction is 1.6mm-1.8mm; the third clearance zone 23 is in the Y-axis direction. The height in the axial direction is 0.55mm-0.65mm, and the width in the X-axis direction is 2.7mm-2.9mm.
显然，本申请的上述实施例是为清楚地说明本申请技术方案所作的举例，而并非是对本申请的具体实施方式的限定。凡在本申请权利要求书的精神和原则之 内所作的任何修改、等同替换和改进等，均应包含在本申请权利要求的保护范围之内。Apparently, the above-mentioned embodiments of the present application are examples for clearly illustrating the technical solution of the present application, rather than limiting the specific implementation manner of the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the claims of this application shall be included within the scope of protection of the claims of this application.

Claims (10)

  1. 一种Ipex外挂天线连接座的PCB结构，包括PCB板，所述PCB板上设有射频信号焊盘、第一接地焊盘和第二接地焊盘，所述第一接地焊盘和所述第二接地焊盘沿着X轴正向依次设置，所述射频信号焊盘位于所述第一接地焊盘与所述第二接地焊盘之间，并沿着Y轴正向突出于所述第一接地焊盘和所述第二接地焊盘，其中：A PCB structure of an Ipex external antenna connection seat, including a PCB board, the PCB board is provided with a radio frequency signal pad, a first ground pad and a second ground pad, the first ground pad and the second ground pad Two ground pads are arranged in sequence along the positive direction of the X axis, and the radio frequency signal pad is located between the first ground pad and the second ground pad, and protrudes beyond the first ground pad along the positive direction of the Y axis. a ground pad and the second ground pad, wherein:
    所述PCB板沿着Y轴负向还依次设有第一净空区、第二净空区和第三净空区；The PCB board is also sequentially provided with a first clearance area, a second clearance area and a third clearance area along the negative direction of the Y axis;
    所述射频信号焊盘位于所述第一净空区的范围内；The radio frequency signal pad is located within the range of the first clearance zone;
    所述第二净空区位于所述第一接地焊盘和所述第二接地焊盘之间，并向着Y轴负向突出于所述第一接地焊盘和所述第二接地焊盘。The second clearance area is located between the first ground pad and the second ground pad, and protrudes beyond the first ground pad and the second ground pad in the negative direction of the Y axis.
  2. 根据权利要求1所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第一净空区在X轴方向上的宽度小于所述第一接地焊盘和所述第二接地焊盘之间的边距。The PCB structure of an Ipex external antenna connection seat according to claim 1, wherein the width of the first clearance area in the X-axis direction is smaller than that between the first ground pad and the second ground pad margins between.
  3. 根据权利要求2所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第一净空区在X轴方向上的宽度为0.9mm-1.1mm。The PCB structure of an Ipex external antenna connection seat according to claim 2, wherein the width of the first clearance area in the X-axis direction is 0.9mm-1.1mm.
  4. 根据权利要求1所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第二净空区在X轴方向上的宽度等于或小于所述第一接地焊盘和所述第二接地焊盘之间的边距。The PCB structure of an Ipex external antenna connection seat according to claim 1, wherein the width of the second clearance area in the X-axis direction is equal to or smaller than that of the first ground pad and the second ground pad. Margin between disks.
  5. 根据权利要求1所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第三净空区在X轴方向上的宽度大于所述第一接地焊盘和所述第二接地焊盘之间的边距。The PCB structure of an Ipex external antenna connection seat according to claim 1, wherein the width of the third clearance area in the X-axis direction is greater than that between the first ground pad and the second ground pad margins between.
  6. 根据权利要求5所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第三净空区在X轴方向上的宽度小于或等于所述第一接地焊盘和所述第二接地焊盘之间的中心距。The PCB structure of an Ipex external antenna connection seat according to claim 5, wherein the width of the third clearance area in the X-axis direction is less than or equal to the first ground pad and the second ground pad Center distance between disks.
  7. 根据权利要求5所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第三净空区在X轴方向上的宽度比所述第一接地焊盘和所述第二接地焊盘之间的边距大0.9mm-1.3mm。The PCB structure of an Ipex external antenna connection seat according to claim 5, wherein the width of the third clearance area in the X-axis direction is larger than that between the first ground pad and the second ground pad. The margins between them are 0.9mm-1.3mm larger.
  8. 根据权利要求1所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第三净空区沿着Y轴方向的中心线和/或所述第二净空区沿着Y轴方向的中心线，与所述第一净空区沿着Y轴方向的中心线重合。The PCB structure of an Ipex external antenna connection seat according to claim 1, wherein, the centerline of the third clearance zone along the Y-axis direction and/or the center of the second clearance zone along the Y-axis direction line coincides with the centerline of the first clearance zone along the Y-axis direction.
  9. 根据权利要求1所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第二净空区向着Y轴负向突出于所述第一接地焊盘和所述第二接地焊盘0.1mm-0.2mm。The PCB structure of an Ipex external antenna connection seat according to claim 1, wherein the second clearance area protrudes 0.1 mm beyond the first ground pad and the second ground pad in the negative direction of the Y axis -0.2mm.
  10. 根据权利要求1至9任一项所述的一种Ipex外挂天线连接座的PCB结构，其中，所述第一净空区、所述第二净空区和所述第三净空区依次连通。The PCB structure of an Ipex external antenna connection seat according to any one of claims 1 to 9, wherein the first clearance area, the second clearance area and the third clearance area are sequentially connected.
PCT/CN2022/093259 2021-05-24 2022-05-17 Pcb structure of ipex external antenna connection base WO2022247686A1 (en)

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CN212695314U (en) * 2020-07-29 2021-03-12 广州寒武纪电子科技有限公司 SMD microstrip antenna for realizing low-frequency resonance
CN215222587U (en) * 2021-05-24 2021-12-17 广州视源电子科技股份有限公司 Printed Circuit Board (PCB) structure of Ipex external antenna connecting seat

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CN104425871A (en) * 2013-08-23 2015-03-18 深圳富泰宏精密工业有限公司 Antenna structure and wireless communication device having the same
CN207116781U (en) * 2017-05-11 2018-03-16 惠州Tcl移动通信有限公司 USB component and its mobile terminal
CN211828110U (en) * 2019-11-08 2020-10-30 杭州涂鸦信息技术有限公司 Wireless voice device
CN212695314U (en) * 2020-07-29 2021-03-12 广州寒武纪电子科技有限公司 SMD microstrip antenna for realizing low-frequency resonance
CN215222587U (en) * 2021-05-24 2021-12-17 广州视源电子科技股份有限公司 Printed Circuit Board (PCB) structure of Ipex external antenna connecting seat

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