WO2022227469A1 - 发光基板及显示装置 - Google Patents

发光基板及显示装置 Download PDF

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Publication number
WO2022227469A1
WO2022227469A1 PCT/CN2021/128451 CN2021128451W WO2022227469A1 WO 2022227469 A1 WO2022227469 A1 WO 2022227469A1 CN 2021128451 W CN2021128451 W CN 2021128451W WO 2022227469 A1 WO2022227469 A1 WO 2022227469A1
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Prior art keywords
substrate
light
support column
emitting
opening
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PCT/CN2021/128451
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English (en)
French (fr)
Inventor
汤海
张冰
秦建伟
高亮
韩波
耿霄霖
初宇天
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京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Publication of WO2022227469A1 publication Critical patent/WO2022227469A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a light-emitting substrate and a display device.
  • an alignment mark (mark) is set on the substrate of the Mini LED light board.
  • a light-emitting substrate includes a substrate, a reflective layer, at least one first alignment mark, a plurality of support columns and a plurality of light-emitting devices.
  • the reflective layer is disposed on the substrate, the reflective layer is provided with a plurality of openings and a plurality of installation openings, and the plurality of openings include at least one first opening.
  • the first opening is provided with a first alignment mark.
  • the orthographic projection of the at least one support column on the substrate at least partially overlaps the orthographic projection of the opening on the substrate.
  • a plurality of light emitting devices are arranged on the substrate, and the light emitting devices are located in the mounting openings of the reflective layer.
  • a fixing layer is disposed on the substrate, and the support column is fixedly connected to the substrate through the fixing layer.
  • the plurality of support columns include at least one first support column, and/or at least one second support column.
  • the first support column includes a base disposed in the opening, and a first main body portion located on a side of the base away from the base plate and connected to the base.
  • the second support column includes a second body portion.
  • the orthographic projection of the first support column on the substrate covers the orthographic projection of the corresponding opening on the substrate.
  • the side of the base away from the first main body portion is a first bottom surface
  • the side of the base connected to the first main body portion is a first top surface
  • the first main body portion is connected to the base.
  • the connected side is a second bottom surface
  • the orthographic projection of the second bottom surface on the substrate covers the orthographic projection of the first top surface on the substrate.
  • the size of the base along the thickness direction of the substrate is smaller than or equal to the size of the opening along the thickness direction of the substrate.
  • the first bottom surface is located in the fixed layer, and along the thickness direction of the substrate, the first bottom surface is located on a side close to the substrate and a side away from the substrate of the reflective layer between.
  • the second bottom surface is in contact with the surface of the reflective layer on the side away from the substrate.
  • the orthographic projection of the second bottom surface on the substrate covers the orthographic projection of the corresponding opening on the substrate.
  • the first body portion includes a plurality of cross-sections in a direction parallel to the plane of the substrate.
  • the area of at least one section is greater than or equal to the area of the section located on the side of the at least one section away from the substrate.
  • the area of the cross section of the first main body portion along the direction parallel to the plane of the substrate is gradually decrease.
  • the shape of the orthographic projection of the base on the substrate is a ring; or the base is cylindrical; or the base includes a plurality of protruding parts extending from the second bottom to the substrate. a bulge.
  • a side of the second support column close to the substrate is fixedly connected to the substrate through the fixing layer.
  • At least one groove is defined on a side of the second support column close to the substrate, and at least part of the fixing layer is located in the groove of the second support column.
  • the shape of the orthographic projection of the groove on the substrate is a circle; or a ring; or, a plurality of arcs arranged at intervals.
  • the second support column includes a plurality of cross-sections in a direction parallel to the plane of the substrate.
  • the area of at least one section is greater than or equal to the area of the section located on the side of the at least one section away from the substrate.
  • the area of the cross section of the second support column along a direction parallel to the plane of the substrate is gradually decrease.
  • the maximum distance between the outer boundary of the orthographic projection of the at least one support column on the substrate and the boundary of the orthographic projection of the opening on the substrate is D1; the support column The installation tolerance is A1; the radial dimension tolerance of the opening is A2; the maximum allowable displacement of the support column is A3. Among them, A1+A2 ⁇ D1 ⁇ A3.
  • the substrate has an intermediate region and an edge region surrounding the intermediate region, and the first opening is disposed in the edge region of the substrate.
  • the middle region has no opening, and the middle region is provided with the second support column.
  • the second support column is fixedly connected to a surface of the reflective layer on one side away from the substrate through the fixed layer.
  • the plurality of openings further include at least one second opening, and the first alignment mark is not disposed in the second opening.
  • the intermediate region is provided with the second opening.
  • the plurality of openings include a plurality of first openings, and at least one of the first openings is further provided with a second alignment mark.
  • the second alignment mark is of the same material as the reflective layer, and is provided in the same layer.
  • the first opening without the second alignment mark is farther from the center of the substrate than the first opening provided with the second alignment mark.
  • the substrate includes a substrate, and a first conductive layer and/or a second conductive layer disposed on the substrate.
  • the first alignment mark is provided in the same layer as the first conductive layer. And/or, the first alignment mark and the second conductive layer are provided in the same layer.
  • the plurality of light emitting devices includes groups of light emitting devices, each group including at least two light emitting devices.
  • Each group of light-emitting devices is evenly arranged around the periphery of the support column, and the distances between each light-emitting device in each group of light-emitting devices and the support column are approximately equal.
  • the light-emitting substrate has a plurality of light-emitting regions, and the light-emitting regions are provided with at least one group of light-emitting devices. At least two light-emitting regions are spaced between the support column and the boundary of the substrate.
  • the color of the fixed layer is approximately the same as the color of the reflective layer.
  • the light-emitting substrate further includes a plurality of reflective sub-layers, and the reflective sub-layer includes a compensation part and a convex part.
  • the compensation part of at least one reflective sub-layer is arranged on the inner wall of the opening, and the convex part is arranged on the edge of the opening; and/or, the compensation part of at least one reflective sub-layer is arranged on the inner wall of the installation opening, and the convex part is arranged on the inner wall of the installation opening.
  • the part is arranged on the edge of the installation opening.
  • a display device in another aspect, includes a display panel, the light-emitting substrate according to any of the above embodiments, and a plurality of optical films. Wherein, the light-emitting substrate is disposed on the non-display side of the display panel, and a plurality of optical films are disposed between the light-emitting substrate and the display panel.
  • FIG. 1 is a top view of a light-emitting substrate according to some embodiments of the present disclosure
  • FIG. 2A is a cross-sectional view of the light-emitting substrate in FIG. 1 along Q-Q';
  • Fig. 2B is a partial enlarged view of M at Fig. 2A;
  • Fig. 2C is a partial enlarged view at N in Fig. 2A;
  • FIG. 3 is a structural diagram of another light-emitting substrate according to some embodiments of the present disclosure.
  • FIG. 4 is a structural diagram of yet another light-emitting substrate according to some embodiments of the present disclosure.
  • 5A is a structural diagram of a first support column according to some embodiments of the present disclosure.
  • FIG. 5B is a structural diagram of another first support column according to some embodiments of the present disclosure.
  • 5C is a structural diagram of yet another first support column according to some embodiments of the present disclosure.
  • 5D is a structural diagram of yet another first support column according to some embodiments of the present disclosure.
  • FIG. 6A is a structural diagram of a second support column according to some embodiments of the present disclosure.
  • FIG. 6B is a structural diagram of another second support column according to some embodiments of the present disclosure.
  • FIG. 6C is a structural diagram of yet another second support column according to some embodiments of the present disclosure.
  • FIG. 7A is a structural diagram of yet another second support column according to some embodiments of the present disclosure.
  • FIG. 7B is a structural diagram of yet another second support column according to some embodiments of the present disclosure.
  • FIG. 8A is a structural diagram of a reflective layer according to some embodiments of the present disclosure.
  • FIG. 8B is a structural diagram of another reflective layer according to some embodiments of the present disclosure.
  • FIG. 8C is a structural diagram of yet another reflective layer according to some embodiments of the present disclosure.
  • FIG. 9 is a structural diagram of a display device according to some embodiments of the present disclosure.
  • FIG. 10 is a flowchart of a method for fabricating a light-emitting substrate according to some embodiments of the present disclosure
  • 11A is a diagram of steps for preparing a substrate according to some embodiments of the present disclosure.
  • 11B is a diagram of steps for preparing a reflective layer according to some embodiments of the present disclosure.
  • FIG. 11C is a diagram of steps for fabricating a light emitting device according to some embodiments of the present disclosure.
  • FIG. 11D is a diagram of steps for preparing a support post according to some embodiments of the present disclosure.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • the expression “electrically connected” and its derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • the term “coupled” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the drawings due to, for example, manufacturing techniques and/or tolerances, are contemplated.
  • example embodiments should not be construed as limited to the shapes of the regions shown herein, but to include deviations in shapes due, for example, to manufacturing. For example, an etched area shown as a rectangle will typically have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • the light-emitting substrate 100 includes a substrate 10 and a reflective layer 11 disposed on the substrate 10 .
  • the boundary of the reflective layer 11 coincides with at least part of the boundary of the substrate 10, and the reflective layer 11 is provided with a plurality of openings H and a plurality of mounting openings H3, and the plurality of openings H include at least one first opening H1.
  • FIG. 1 and FIG. 2A show a case where a part of the boundary of the reflection layer 11 overlaps with a part of the boundary of the substrate 10 .
  • There may also be some functional areas on the substrate 10 such as the area 16 for binding the circuit board shown in FIG. 1 and FIG. 2C , and the reflective layer 11 is not provided in this part of the functional area.
  • the color of the reflective layer 11 is white, so that the reflective layer 11 has a higher reflectivity.
  • the shape of the orthographic projection of the opening H on the substrate 10 may be a circle, a triangle, a rectangle, or the like.
  • the light-emitting substrate 100 further includes at least one first alignment mark 12 , and the first alignment mark 12 is disposed in the first opening H1 .
  • the first alignment mark 12 can be arranged at any position in the first opening H1, for example, the first alignment mark 12 can be arranged in the center of the first opening H1, or can be arranged in the first opening H1 At other positions except the center, it is ensured that the first opening H1 exposes the first alignment mark 12 , so as to collect an image of the first alignment mark 12 for alignment.
  • the substrate 10 includes a substrate 101 and a driving circuit disposed on the substrate 101.
  • the driving circuit includes a plurality of thin film transistors and signal lines, and the first alignment mark 12 can be connected with the driving circuit.
  • the materials of any one of the conductive patterns are the same, and they are arranged in the same layer.
  • the first alignment mark 12 is made of the same material as the signal line in the driving circuit, and is provided in the same layer.
  • the signal line is provided with a hollow area. Along the thickness direction Z of the substrate 10, the hollow area runs through the signal line.
  • the mark 12 is disposed in the hollow area, and the first alignment mark 12 is insulated from the signal line.
  • any one of the conductive patterns of the driving circuit is of a laminated structure, and the first alignment mark 12 is also of the same laminated structure.
  • Standard layer refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask to form a layer structure through one patterning process.
  • a patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights Or have different thicknesses.
  • the light-emitting substrate 100 further includes a plurality of supporting columns 13 , and the orthographic projection of at least one supporting column 13 on the substrate 10 at least partially overlaps the orthographic projection of the opening H on the substrate 10 .
  • the color of the support column 13 can be selected as required, for example, the color of the support column 13 can be white, so that the reflectivity of the support column 13 is close to that of the reflective layer 11 .
  • the support post 13 may be transparent.
  • the display device includes a plurality of optical films disposed between the display panel and the light-emitting substrate 100 , and the plurality of support columns 13 are used to support the plurality of optical films, so that the reflective layer 11 in the light-emitting substrate 100 can be supported.
  • There is a light-mixing distance between the optical film and the light-emitting substrate 100 which can improve the light and shadow generated by the light-emitting substrate 100 and improve the display quality of the display device.
  • the orthographic projection of the support column 13 on the substrate 10 may completely or partially overlap with the orthographic projection of the opening H on the substrate 10 , for example, the opening H is within the range of the support column 13 .
  • the light emitting substrate 100 further includes a plurality of light emitting devices 14 , the plurality of light emitting devices 14 are disposed on the substrate 10 , and the light emitting devices 14 are located in the mounting opening H3 of the reflective layer 11 .
  • the reflection layer 11 reflects the light emitted by the light emitting device 14 to increase the light output of the light emitting substrate 100 along the direction Z perpendicular to the plane of the substrate 10 , thereby improving the light output efficiency of the light emitting substrate 100 .
  • the number of light-emitting devices 14 should be the same as the number of light-emitting devices 14 in each row arranged along the direction X in FIG. 1 .
  • the light emitting device 14 can be electrically connected to the driving circuit on the substrate 10 through the mounting opening H3 on the reflective layer 11, and the light emitting device 14 can be driven to emit light by the driving circuit.
  • the light-emitting device 14 may be electrically connected to a signal line on the substrate 10 through the mounting opening H3 on the reflective layer 11 , and the signal line is electrically connected to a driver integrated circuit (Integrated Circuit, IC for short) for transmitting the signal from the driver to the light-emitting device 14 .
  • the voltage signal or current signal of the integrated circuit is used to drive the light-emitting device 14 to emit light.
  • the alignment marks of the light emitting substrate are arranged on the edge area of the substrate, which increases the edge area of the substrate, and leads to a wider frame of the display device on which the light emitting substrate is mounted, which is not conducive to the narrow frame design of the display device. If, after the alignment is completed, a cutting process is used to cut off the edge region where the alignment marks are provided in the substrate, the cost of introducing the cutting process will be increased.
  • the first alignment mark 12 is disposed in the first opening H1 of the reflective layer 11 , so that the substrate 10 does not need to be provided with an edge area, so that at least the reflective layer 11 has an edge area.
  • Part of the boundary coincides with at least part of the boundary of the substrate 10 , which is beneficial to the narrow-frame design of the display device. Also, since the substrate 10 is not provided with an edge region, the cost of cutting the edge region will not be increased.
  • the substrate 10 includes a substrate 101 , and a first conductive layer 103 and/or a second conductive layer 106 disposed on the substrate 101 .
  • the first alignment mark 12 is provided on the same layer as the first conductive layer 103 . And/or, the first alignment mark 12 and the second conductive layer 106 are disposed in the same layer.
  • the substrate 10 includes a substrate 101 and a first conductive layer 103 disposed on the substrate 101 .
  • the first alignment mark 12 is provided on the same layer as the first conductive layer 103 .
  • the substrate 10 includes a substrate 101 , and a second conductive layer 106 disposed on the substrate 101 .
  • the first alignment mark 12 is disposed on the same layer as the second conductive layer 106 .
  • the substrate 10 includes a substrate 101 , and a buffer layer 102 , a first conductive layer 103 , a first passivation layer 104 , a first planarization layer 105 , a buffer layer 102 , a first conductive layer 103 , a first passivation layer 104 , The second conductive layer 106, the second passivation layer 107 and the second planarization layer 108, wherein the first conductive layer 103 and the second conductive layer 106 are used to form the conductive pattern of the driving circuit.
  • the first alignment mark 12 may be formed by one of the first conductive layer 103 or the second conductive layer 106 , or may be formed by the first conductive layer 103 and the second conductive layer 106 together.
  • the first alignment mark 12 may be formed of the second conductive layer 106 to reduce the distance between the first alignment mark 12 and the surface of the substrate 10 , so that the first alignment mark 12 is collected from the surface of the substrate 10 .
  • the image is clearer, which is beneficial to improve the alignment accuracy.
  • the substrate 101 of the substrate 10 may be a printed circuit board (Printed Circuit Board, PCB for short) or a glass substrate.
  • the thickness of the substrate 101 may range from 0.4 mm to 3 mm, for example, the thickness may be 0.4 mm, 1 mm, 1.5 mm, 2 mm or 3 mm.
  • the preparation process of the first conductive layer 103 may include a magnetron sputtering process. As shown in FIG. 2A and FIG. 2B , using the magnetron sputtering process, the prepared first conductive layer 103 includes a first conductive sputtering process. The electronic layer 103A and the second conductive sub-layer 103B.
  • the first conductive sub-layer 103A may include copper.
  • the second conductive sub-layer 103B may include molybdenum-niobium alloy (MoNb), copper and molybdenum-niobium alloy which are stacked in sequence. Antioxidant effect.
  • the thickness range of the molybdenum-niobium alloy of the second conductive sub-layer 103B close to the substrate 101 may be
  • the thickness can be or
  • the thickness range of the molybdenum-niobium alloy of the second conductive sub-layer 103B away from the substrate 101 may be
  • the thickness can be or
  • the preparation process of the first conductive layer 103 may further include an electroplating process.
  • the prepared first conductive layer 103 may include a first molybdenum-nickel-titanium alloy (MoNiTi), copper and
  • MoNiTi molybdenum-nickel-titanium alloy
  • the second molybdenum-nickel-titanium alloy and the first molybdenum-nickel-titanium alloy can improve the nucleation density of crystal grains, and the second molybdenum-nickel-titanium alloy plays an anti-oxidation role.
  • the thickness range of the first molybdenum-nickel-titanium alloy of the first conductive layer 103 may be
  • the thickness can be or
  • the thickness range of the second molybdenum-nickel-titanium alloy of the first conductive sub-layer 103A may be
  • the thickness can be or
  • the thickness of the first conductive layer 103 may range from 1.5 ⁇ m to 7 ⁇ m, for example, the thickness may be 1.5 ⁇ m, 2 ⁇ m, 4 ⁇ m, 6.5 ⁇ m or 7 ⁇ m.
  • the second conductive layer 106 may include a molybdenum-niobium alloy, copper, and a protective layer stacked in sequence, and the protective layer may include copper-nickel alloy (CuNi), nickel or indium oxide Any of tin (Indium Tin Oxide, ITO for short).
  • the molybdenum-niobium alloy plays the role of adhesion
  • the protective layer plays the role of anti-oxidation and ensures the firmness of the solid crystal.
  • the thickness range of the second conductive layer 106 may be
  • the thickness can be or
  • the reflective layer 11 may be a reflective sheet, eg, a white reflective sheet.
  • the reflective layer 11 may also be a reflective plating layer.
  • the material of the reflective layer 11 may include white oil, and the white oil may include resin (eg, epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO 2 ), and organic solvent (eg, dipropylene glycol methyl ether), etc.;
  • the material of the reflective layer 11 may also include silicon-based white glue.
  • a screen printing process can be used to print the white oil to form the reflection layer 11 .
  • the thickness of the reflective layer 11 may range from 10 ⁇ m to 300 ⁇ m, for example, the thickness may be 10 ⁇ m, 50 ⁇ m, 80 ⁇ m, 155 ⁇ m, 200 ⁇ m or 300 ⁇ m.
  • the reflective layer 11 may be formed through one or more screen printing processes. Wherein, when the reflective layer 11 is fabricated by multiple screen printing processes, the size of the opening can be different to improve the fabrication accuracy of the reflective layer near the opening area. In this way, the reflective layer 11 at the edge of the opening area is stepped.
  • the light-emitting substrate 100 further includes a plurality of reflective sub-layers 19 , and the reflective sub-layer 19 includes a compensation portion 19A and a convex portion 19B.
  • the compensation portion 19A of at least one reflective sublayer 19 is disposed on the inner wall of the installation opening H3, and the protruding portion 19B is disposed on the edge of the installation opening H3.
  • the compensation portion 19A is provided around the inner wall of the mounting opening H3, and the protruding portion 19B is provided around the edge of the mounting opening H3.
  • the compensation portion 19A of the reflection sublayer 19 By providing the compensation portion 19A of the reflection sublayer 19, the radial dimension of the mounting opening H3 can be compensated, and the dimensional accuracy of the mounting opening H3 can be improved.
  • the compensation portion 19A of the at least one reflective sub-layer 19 is disposed on the inner wall of the opening H, and the protruding portion 19B is disposed on the edge of the opening H.
  • the compensation portion 19A is arranged around the inner wall of the opening H, and the raised portion 19B is arranged around the edge of the opening H. As shown in FIG.
  • the compensation portion 19A of the reflection sublayer 19 By providing the compensation portion 19A of the reflection sublayer 19 , the radial dimension of the opening H can be compensated, and the dimensional accuracy of the opening H can be improved.
  • the thickness of the reflective sub-layer 19 is greater than the thickness of the reflective layer 11 , for example, the thickness of the reflective sub-layer 19 may range from 40 ⁇ m to 330 ⁇ m, for example, the thickness may be 40 ⁇ m, 50 ⁇ m, 80 ⁇ m, 185 ⁇ m, 200 ⁇ m or 330 ⁇ m.
  • the reflective sub-layer 19 is prepared using a dot-filling process (that is, using a spray valve to spray glue), and the glue is sprayed around the edge of the opening H and/or the installation opening H3,
  • the thickness of the reflection sub-layer 19 is made larger than the thickness of the reflection layer 11 .
  • the material of the reflective sub-layer 19 includes silicon-based white glue, and the color of the silicon-based white glue is white, so that the color of the reflective sub-layer 19 is approximately the same as the color of the reflective layer 11, so as to ensure that the fixed layer 15 can respond to light
  • the reflectivity is close to the reflectivity of the reflective layer 11 to light.
  • the light-emitting substrate 100 further includes an encapsulation layer 17 disposed on the side of the light-emitting device 14 away from the substrate 10 for protecting the light-emitting device 14 .
  • the encapsulation layer 17 may cover the light emitting device 14 as a whole.
  • the encapsulation layer 17 may include a plurality of encapsulation sub-layers, and each encapsulation sub-layer wraps a light-emitting device 14 .
  • the orthographic projection of the support column 13 on the substrate 10 does not overlap with the second conductive layer 106 of the substrate 10 , for example, the boundary of the orthographic projection of the support column 13 on the substrate 10 and the second conductive layer 106
  • the minimum distance of the contour boundary is greater than or equal to 3 mm, which can reduce the pressure exerted by the support column 13 on the second conductive layer 106 and prevent the second conductive layer 106 from being damaged by force.
  • a fixing layer 15 is disposed on the substrate 10 , and the support column 13 is fixedly connected to the substrate 10 through the fixing layer 15 .
  • the material of the fixing layer 15 may include glue, and the fixing layer 15 is formed after the glue is cured.
  • the material of the fixing layer 15 may include reactive hot melt adhesive, such as polyurethane resin (Polyurethane Resin, PUR for short), which has the characteristics of high temperature resistance and can ensure the stability of the fixing layer 15 under high temperature.
  • reactive hot melt adhesive such as polyurethane resin (Polyurethane Resin, PUR for short), which has the characteristics of high temperature resistance and can ensure the stability of the fixing layer 15 under high temperature.
  • the adhesive strength and viscosity of the glue required for preparing the fixing layer 15 can be adjusted as required to ensure the bonding strength between the support column 13 and the fixing layer 15 .
  • the color of the fixed layer 15 may be white, colorless and transparent, or light yellow. By setting the color of the fixed layer 15 to white, the color of the fixed layer 15 is approximately the same as the color of the reflective layer 11 to ensure the reflectivity of the fixed layer 15 to light, making it close to the reflectivity of the reflective layer 11 to light.
  • the way of fixedly connecting the support column 13 and the base plate 10 may also be welding or clamping.
  • the structure of the support column 13 is related to its installation method, and the support column 13 in some embodiments of the present disclosure will be described in detail below.
  • the plurality of support columns 13 include at least one first support column 131 , and at least part of the structure of the first support column 131 is disposed in the opening H, so that the first support column 131 is installed in the opening within H.
  • the opening H can be used to limit the displacement of the first support column 131 along the direction S parallel to the plane of the substrate 10, so as to prevent the first support column 131 from falling off, In order to ensure the surface flatness of the optical film and ensure its optical performance.
  • the plane where the substrate is located refers to the surface of the substrate 10 on the light-emitting side of the light-emitting substrate 100 .
  • the orthographic projection of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10 , so that the first support column 131 can block the opening H, which can avoid
  • the exposure of the opening H in the reflective layer 11 affects the overall light extraction efficiency of the light emitting substrate 100 and the display effect of the display device.
  • the material of the first support column 131 may include a reflective material, and the reflectivity of the first support column 131 to light is approximately equal to the reflectivity of the reflection layer 11 to light.
  • the portion of the first support column 131 close to the substrate 10 ie, the bottom of the first support column 131
  • the first support column 131 on the substrate 10 is in the positive direction.
  • the projection covers the orthographic projection of the corresponding opening H on the substrate 10 , so that the first support column 131 can block the opening H.
  • the first support column 131 includes a base 1313 disposed in the opening H, and a first main body 1314 located on the side of the base 1313 away from the substrate 10 and connected to the base 1313 .
  • the displacement of the first support column 131 along the direction S parallel to the plane of the substrate 10 can be restricted, and the uniformity of the distribution of the first support column 131 in the direction S can be ensured , so as to reduce the difference in the deformation of different regions of the optical film supported by the first support column 131 , improve the surface flatness of the optical film, and ensure its optical performance.
  • the first main body portion 1314 of the first support column 131 is used to support the optical film, so as to reduce the amount of deformation caused by the force of the optical film.
  • the side of the base 1313 away from the first main body portion 1314 is the first bottom surface 1311
  • the side of the base 1313 connected to the first main body portion 1314 is the first top surface 1315
  • the first main body portion 1314 is connected to the first top surface 1315 .
  • the side connected to the base 1313 is the second bottom surface 1312
  • the orthographic projection of the second bottom surface 1312 on the substrate 10 covers the orthographic projection of the first top surface 1315 on the substrate 10 , so that the base 1313 and the first main body 1314 form a stepped surface .
  • the size of the base 1313 along the thickness direction Z of the substrate 10 is less than or equal to approximately the same size as the size of the opening H along the thickness direction Z of the substrate 10 .
  • the size of the base 1313 along the thickness direction Z of the substrate 10 is approximately equal to the size of the opening H along the thickness direction Z of the substrate 10 , ensuring that the first bottom surface 1311 of the base 1313 is The surface of the second flat layer 108 of the substrate 10 is abutted, and the second bottom surface 1312 of the first main body portion 1314 can be abutted against the surface of the reflective layer 11 .
  • the first bottom surface 1311 is located in the fixed layer 15 , and along the thickness direction Z of the substrate 10 , the first bottom surface 1311 is located on the side of the reflective layer 11 close to the substrate 10 and the side away from the substrate 10 . between sides.
  • the second bottom surface 1312 is in contact with the surface of the reflective layer 11 on the side away from the substrate 10 .
  • the first bottom surface 1311 is in contact with the surface of the second flat layer 108 of the substrate 10 .
  • the fixed layer 15 there is a part of the fixed layer 15 between the first bottom surface 1311 and the second flat layer 108 , This portion of the fixed layer 15 is negligible.
  • the first bottom surface 1311 is abutted against the surface of the second flat layer 108 of the substrate 10, and the second bottom surface 1312 is abutted against the surface of the reflective layer 11, so as to support the first support
  • the position of the column 131 is limited to ensure the installation height of the first support column 131, so that the uniformity of the installation height of each first support column 131 can be improved, so that the support height of each first support column 131 to the corresponding area of the optical film is approximately equal, the deformation amounts of different regions of the optical film are approximately equal, which is beneficial to improve the surface flatness of the optical film to ensure its optical performance.
  • the orthographic projection of the second bottom surface 1312 of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10 , so that the second bottom surface 1312 of the first support column 131 can block the opening H, the reduction of the reflective area of the reflective layer 11 due to the opening H in the reflective layer 11 can be avoided, thereby avoiding affecting the overall light extraction efficiency of the light emitting substrate 100 and the display effect of the display device.
  • the first main body portion 1314 is along a direction parallel to the plane of the substrate 10 .
  • the area of the cross section in the direction S gradually decreases.
  • the volume of the first main body part 1314 can be reduced, thereby reducing the size of the first main body part 1314 of the first support column 131 .
  • the blocking effect of light increases the light output of the light emitting substrate 100 in the direction Z of the thickness of the substrate 10 , thereby improving the light output efficiency of the light emitting substrate 100 .
  • the first body portion 1314 of the first support column 131 includes a plurality of cross-sections along a direction S parallel to the plane of the substrate 10 , and at least one cross-section is greater than or equal to the cross-section located away from the substrate. 10 The area of the cross section on one side.
  • the shape of the first body portion 1314 of the first support column 131 may be a cone. As shown in FIG. 5B , the shape of the first main body portion 1314 of the first support column 131 may also be a circular frustum. As shown in FIG. 5C , the shape of the first main body portion 1314 of the first support column 131 may also be a column.
  • the first support column 131 is the structure shown in FIG. 5D
  • the base 1313 of the first support column 131 is a buckle
  • the buckle includes a first bottom surface 1311 close to the substrate 10 .
  • the first main body portion 1314 of the first support column 131 includes a seat body connected with the buckle, and a circular trough connected with the seat body and located on the side of the seat body away from the buckle, wherein the seat body includes a second bottom surface connected with the buckle 1312.
  • the substrate of the light-emitting substrate is provided with through holes, and the bases 1313 of the first support columns 131 shown in FIG.
  • this also results in that the alignment mark cannot be set in the opening corresponding to the first support column 131 .
  • the first support column 131 shown in FIG. 5D can be fixedly connected to the substrate 10 through the fixing layer 15 , and the first opening H1 can also be provided in the first opening H1 The first alignment mark 12 .
  • a fixed layer 15 is provided in the opening H of the reflective layer 11 , and at least part of the base 1313 of the first support column 131 is embedded in the fixed layer 15 and connected to the fixed layer 15 , The first support column 131 is fixed on the substrate 10 through the fixing layer 15 .
  • the base 1313 of the first support column 131 is embedded in the fixing layer 15, so that part of the glue overflows from the opening H, and the second bottom surface 1312 of the first support column 131 is connected to the reflective layer.
  • glue between 11, and the thickness of this part of the glue after curing is small, and the thickness can range from 0 to 10 ⁇ m (excluding 0), for example, 2 ⁇ m, 5 ⁇ m, 6 ⁇ m, 8 ⁇ m, or 10 ⁇ m.
  • the bonding area between the first support column 131 and the fixed layer 15 can be increased, and the bonding strength of the first support column 131 and the fixed layer 15 can be improved.
  • the bonding strength of the first support column 131 and the fixed layer 15 can be further improved.
  • the first support column in FIG. 5A is used. 1313, the base 1313 of the base is a hollow cylindrical structure, so that the interior of the base 1313 can also be bonded to the fixing layer 15.
  • the shape of the orthographic projection of the base 1313 of the first support column 131 on the substrate 10 may be annular, that is, the base 1313 is a cylindrical structure with a hollow interior. As shown in FIG. 5B , the shape of the base 1313 may also be columnar. Alternatively, as shown in FIG. 5C , the base 1313 includes a plurality of protrusions 1315 extending from the second bottom surface 1312 toward the substrate 10 .
  • the plurality of support columns 13 includes at least one second support column 132 , and the second support column 132 includes a second body portion 1323 . It can be understood that, relative to the first support column 131, the second support column 132 does not have a base.
  • the orthographic projection of the opening H on the substrate 10 covers the orthographic projection of the corresponding second support column 132 on the substrate 10 .
  • the second support column 132 is located between the side close to the substrate 10 and the side away from the substrate 10 of the reflective layer 11 .
  • the opening H can be used to limit the displacement of the second support column 132 along the direction S parallel to the plane of the substrate 10, so as to prevent the second support column 132 from falling off, In order to ensure the surface flatness of the optical film and ensure its optical performance.
  • the portion of the second support column 132 close to the substrate 10 ie, the bottom of the second support column 132
  • the opening H is fixedly disposed in the opening H.
  • the second support column 132 is disposed on the side of the reflection layer 11 away from the substrate 10 , that is, the area of the reflection layer 11 corresponding to the second support column 132 is not provided with the opening H, and the opening H does not need to be blocked.
  • the second support column 132 can be directly disposed on the surface of the reflective layer 11 .
  • the material of the second support column 132 may include a reflective material, and the reflectivity of the second support column 132 to light is approximately equal to the reflectivity of the reflective layer 11 to light, which can avoid being blocked by the second support column 132
  • the reflective layer 11 reduces the reflective area of the reflective layer 11 , so as to avoid affecting the overall light extraction efficiency of the light-emitting substrate 100 and the display effect of the display device.
  • the orthographic projection of the second support column 132 on the substrate 10 may also cover the orthographic projection of the corresponding opening H on the substrate 10 , that is, the second support column 132 is not disposed in the opening H.
  • the second support column 132 is along a direction parallel to the plane of the substrate 10 .
  • the area of the cross section in the direction S gradually decreases.
  • the volume of the second support column 132 can be reduced, thereby reducing the light exposure of the second support column 132 to light.
  • the blocking effect increases the light output of the light emitting substrate 100 in the direction Z of the thickness of the substrate 10 , thereby improving the light output efficiency of the light emitting substrate 100 .
  • the second support column 132 includes a base 1322 , and a second body portion 1323 located on the side of the base 1322 away from the substrate 10 and connected to the base 1322 .
  • at least one groove 1321 is disposed on the side of the base 1322 close to the substrate 10
  • the radial dimension D2 of the orthographic projection of the side of the second body portion 1323 close to the base 1322 on the base plate 10 is smaller than that of the base 1322 close to the second body portion
  • the radial dimension D3 of the orthographic projection of one side of 1323 on the substrate 10 is smaller.
  • the radial dimension D2 of the orthographic projection of the side of the second body portion 1323 close to the base 1322 on the substrate 10 is smaller than the orthographic projection of the side of the base 1322 close to the second body portion 1323 on the base plate 10
  • the radial dimension D3 of , the shape of the base 1322 of the second support column 132 is a cylinder, and the shape of the second main body 1323 is a cone. It is equivalent to removing part of the volume of the column on the basis of the column to obtain the second support column 132 with a smaller volume, thereby reducing the blocking effect of the second support column 132 on light.
  • the radial dimension D2 of the orthographic projection of the side of the second body portion 1323 close to the base 1322 on the substrate 10 is smaller than the orthographic projection of the side of the base 1322 close to the second body portion 1323 on the base plate 10
  • the radial dimension D3 of , the shape of the base 1322 of the second support column 132 is a circular truncated cone, and the shape of the second main body portion 1323 is a cone. It is equivalent to removing part of the volume of the cone on the basis of the cone to obtain the second support column 132 with a smaller volume, thereby reducing the blocking effect of the second support column 132 on light.
  • the second support column 132 includes a plurality of cross-sections along a direction S parallel to the plane of the substrate 10 , and the area of at least one cross-section is greater than or equal to that on the side of the cross-section away from the substrate 10 . area of the cross section.
  • the shape of the second support column 132 may be a circular frustum. As shown in FIG. 6B , the shape of the second support column 132 may also be a cone. As shown in FIG. 6C , the shape of the second support column 132 may also be a column.
  • the side of the second support column 132 close to the substrate 10 is fixedly connected to the substrate 10 through the fixing layer 15 .
  • a fixed layer 15 is provided in the opening H of the reflective layer 11 , and the side of the second support column 132 close to the substrate 10 is fixedly connected to the substrate 10 through the fixed layer 15 .
  • the second support column 132 is disposed on the side of the reflection layer 11 away from the substrate 10
  • the fixed layer 15 is disposed between the second support column 132 and the reflection layer 11
  • the side of the second support column 132 close to the substrate 10 passes through the fixed layer 15 is fixedly connected to the base plate 10 .
  • the thickness of the fixing layer 15 should be set relatively thin, and the thickness can range from 30 ⁇ m to 100 ⁇ m, for example, the thickness is 30 ⁇ m, 40 ⁇ m, 65 ⁇ m, 80 ⁇ m or 100 ⁇ m, so as to ensure the adhesion between the second support column 132 and the fixing layer 15 strength.
  • At least one groove 1321 is defined on the side of the second support column 132 close to the substrate 10 , and at least part of the fixing layer 15 is located in the groove 1321 of the second support column 132 , which can be The bonding area between the second support column 132 and the fixing layer 15 is increased, and the bonding strength between the second support column 132 and the fixing layer 15 is improved.
  • the shape of the orthographic projection of the groove 1321 on the substrate 10 is a circle.
  • the shape of the orthographic projection of the groove 1321 on the substrate 10 is an annular shape.
  • the shape of the orthographic projection of the grooves 1321 on the substrate 10 is a plurality of arcs arranged at intervals.
  • the plurality of support columns 13 include at least one first support column 131 and at least one second support column 132 , and at least part of the structure of the first support column 131 is disposed at the opening H and the orthographic projection of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10 , so that the first support column 131 is installed in the opening H and can block the opening H.
  • the orthographic projection of the opening H on the substrate 10 covers the orthographic projection of the corresponding second support column 132 on the substrate 10 .
  • the second support column 132 is located on the side of the substrate 10 close to the substrate 10 . Between the side of the reflection layer 11 close to the substrate 10 and the side away from the substrate 10 .
  • the second support column 132 is disposed on the side of the reflection layer 11 away from the substrate 10 , that is, the area of the reflection layer 11 corresponding to the second support column 132 does not have openings H, and the second support column 132 is directly disposed on the surface of the reflection layer 11 .
  • the maximum radial dimension of the first support column 131 and the second support column 132 ranges from 2 mm to 10 mm, for example, may be 2 mm, 4 mm, 5 mm, 8 mm or 10 mm.
  • the height of the first support column 131 and the second support column 132 ranges from 1 mm to 12 mm, for example, may be 1 mm, 4 mm, 6 mm, 8 mm or 12 mm.
  • the installation of the support column 13 in the opening H also meets the following requirements:
  • the maximum distance between the outer boundary of the orthographic projection of the support column 13 on the substrate 10 and the boundary of the orthographic projection of the opening H on the substrate 10 is D1 . It can be understood that, under the condition that the support column 13 can move in the opening H along the direction S parallel to the plane where the substrate 10 is located, the maximum distance that the support column 13 can move is D1.
  • the installation tolerance of the support column 13 is A1, that is, the installation tolerance of the support column 13 along the direction S parallel to the plane of the substrate 10 is A1.
  • the radial dimension tolerance of the opening H is A2, and the radial direction of the opening H is parallel to the plane of the substrate 10 .
  • the maximum allowable displacement of the support column 13 is A3, that is, the maximum distance allowed to move by the support column 13 in the opening H along the direction S parallel to the plane of the substrate 10 . It can be understood that, if the support column 13 is in the opening H, the distance moved along the direction S parallel to the plane of the substrate 10 is greater than the maximum allowable displacement A3. In this case, the distribution of the support column 13 in the direction S is not uniform. , the surface flatness of the optical film cannot be guaranteed.
  • D1 ⁇ A1+A2 that is, the maximum distance D1 between the outer boundary of the orthographic projection of the support column 13 on the substrate 10 and the boundary of the orthographic projection of the opening H on the substrate 10, is greater than or equal to the support
  • the sum of the installation tolerance A1 of the post 13 and the radial dimension tolerance A2 of the opening H enables the support post 13 to be inserted into the opening H.
  • D1 ⁇ A3 that is, the maximum distance D1 between the outer boundary of the orthographic projection of the support column 13 on the substrate 10 and the boundary of the orthographic projection of the opening H on the substrate 10 is less than or equal to the maximum allowable displacement of the support column 13 A3, the maximum distance that the support column 13 can move in the opening H along the direction S parallel to the plane of the substrate 10 is less than or equal to the maximum allowable displacement A3, which can ensure the uniformity of the distribution of the support column 13 in the direction S, thereby ensuring The surface flatness of the optical film ensures its optical performance.
  • the substrate 10 has a middle region 11A and an edge region 11B around the middle region 11A.
  • a first support column 131 may be provided at the opening H of the edge region 11B, so that the base 1313 of the first support column 131 is inserted into the fixing layer 15 in the opening H, and the A support column 131 is adhered to the substrate 10 .
  • the uniformity of the distribution of the first support column 131 in the direction S can be ensured, and the installation height of the first support column 131 can be ensured.
  • a second support column 132 may also be provided at the opening H of the edge region 11B, so that the base 1322 of the second support column 132 is embedded in the fixing layer 15 in the opening H, and the fixing layer 15 is at least The part is located in the groove 1321 of the second support column 132 , and the second support column 132 is bonded to the substrate 10 through the fixing layer 15 .
  • the light-emitting device 14 in the light-emitting substrate 100 and the optical film have an optical distance (OD for short), which can improve the light and shadow generated by the light-emitting substrate 100 and improve the display quality of the display device 200 .
  • the light mixing distance is large, for example, the light mixing distance is greater than or equal to 6 mm, the second support column 132 shown in FIG. The effect of the effect is small and can be ignored.
  • the middle region 11A of the substrate 10 has no openings, and the middle region 11A is provided with the second support column 132 .
  • the second support column 132 is fixedly connected to the side surface of the reflective layer 11 away from the substrate 10 through the fixing layer 15 .
  • the second support column 132 may be disposed on the side of the reflective layer 11 away from the substrate 10 , and a fixed layer 15 is disposed between the second support column 132 and the reflective layer 11 , and at least part of the fixed layer 15 is embedded in the recess of the second support column 132 . inside the groove 1321 , so that the second support column 132 is fixed on the reflective layer 11 through the fixing layer 15 .
  • the plurality of openings H of the reflective layer 11 further include at least one second opening H2 , the second opening H2 is not provided with the first alignment mark 12 , and the intermediate region 11A is provided with the first alignment mark 12 .
  • openings H are provided in each region of the substrate 10 (the middle region 11A and the edge region 11B), and all the openings H are provided with first support columns 131, which can ensure The uniformity of the installation height of each first support column 131 .
  • the difference between the maximum value and the minimum value ranges from 0 to 0.2 mm, for example, the difference is 0, 0.03 mm, 0.01 mm, and 0.18 mm. or 0.2mm.
  • the first opening H1 is disposed in the edge region 11B of the substrate 10 , so that the first alignment mark 12 in the first opening H1 is disposed in the edge region 11B, so as to facilitate the collection of the first pair of The image of bit mark 12 is aligned.
  • the distance between the first alignment mark 12 and the boundary of the substrate 10 ranges from 90 mm to 110 mm, for example, the distance may be 90 mm, 96 mm, 100 mm, 105 mm or 110 mm.
  • the reflective layer 11 has multiple groups of first openings H1 , the multiple groups of first openings H1 are evenly distributed on the edge of the reflective layer 11 , and each group of first openings H1 includes at least one The first opening H1.
  • each group of the first openings H1 includes one first opening H1 , so that the first alignment marks 12 in each of the first openings H1 are used for alignment.
  • each group of first openings H1 includes two first openings H1 , and the first alignment marks 12 in different first openings H1 are used for alignment in different process steps.
  • the shape of the reflective layer 11 is a quadrilateral with four corners.
  • the shapes of the first alignment marks 12 at two adjacent corners of the reflective layer 11 are different, for example, the first alignment marks 12 at one corner is circular in shape, and the first alignment mark 12 at the other corner is in the shape of a cross.
  • the first alignment marks 12 at two opposite corners of the reflective layer 11 have the same shape, for example, the first alignment marks 12 at the two corners
  • the shapes are either circular or cross-shaped.
  • the first alignment marks 12 at the adjacent two corners of the reflective layer 11 can be easily distinguished, thereby facilitating the distinction of the first alignment marks 12 The position of the corner to ensure the accuracy of the alignment position.
  • the shape of the reflective layer 11 is a quadrilateral, and the first alignment marks 12 at the four corners of the reflective layer 11 can also be set to the same shape.
  • the shapes of the first alignment marks 12 are all cross-shaped, and may also be all circular.
  • the first alignment mark 12 can also be designed in other ways. For example, three of the four corners are provided with a cross-shaped first alignment mark 12, and one corner is provided with a circular first alignment mark. 12.
  • At least one of the first openings H1 is further provided with a second alignment mark 18 .
  • the material of the second alignment mark 18 is the same as that of the reflective layer 11 and is provided in the same layer.
  • the reflective layer 11 is prepared on the substrate 10 through the alignment of the first alignment marks 12 , and in the same process step, the second alignment marks 18 are prepared, and the second alignment marks 18 and the reflective layer 11 are prepared.
  • the materials are the same and set on the same layer.
  • the second alignment marks 18 in the same first opening H1 correspond to the first alignment marks 12 .
  • the first opening H1 without the second alignment mark 18 is farther from the center E of the substrate 10 than the first opening H1 provided with the second alignment mark 18 .
  • the first alignment mark 12 in the first opening H1 provided with the second alignment mark 18 is used for alignment during the process of preparing the reflective layer 11, and after the preparation is completed, the second alignment mark 18 pairs
  • the first alignment mark 12 forms a shield, and the first alignment mark 12 in the first opening H1 cannot be reused for alignment. Therefore, the first opening H1 where the second alignment mark 18 is not provided is located farther from the center E of the substrate 10 than the first opening H1 where the second alignment mark 18 is provided, so that the second alignment mark 18 is not provided.
  • the first opening H1 is closer to the boundary of the substrate 10 , which is convenient for subsequent process steps to use the first alignment marks 12 in the first opening H1 to perform alignment, and is beneficial to improve the alignment accuracy.
  • the plurality of light-emitting devices 14 include multiple groups of light-emitting devices D, each group of light-emitting devices D includes at least two light-emitting devices 14 , and each group of light-emitting devices D is evenly arranged around the periphery of the support column 13 , the distances between each light-emitting device 14 in each group of light-emitting devices D and the support column 13 are approximately equal, so as to avoid the distance between the support column 13 and any light-emitting device 14 being too close to block the light output of the light-emitting device 14, thereby preventing the This avoids causing uneven light output from the light emitting substrate 100 .
  • a plurality of light emitting devices 14 are also disposed between the adjacent two groups of light emitting devices D, so that the light emitting devices 14 on the light emitting substrate 100 are evenly distributed, thereby ensuring the uniformity of light emission of the light emitting substrate 100 .
  • the light-emitting devices 14 of each group of light-emitting devices D may be connected in series, may also be connected in parallel, or may be a combination of series and parallel.
  • the light-emitting devices 14 of each group of light-emitting devices D are connected in series.
  • each group of light-emitting devices D includes four light-emitting devices 14 , and the four light-emitting devices 14 are evenly arranged around the periphery of the support column 13 .
  • the center C of the area enclosed by the center line connection makes the distance between the support column 13 and each light-emitting device 14 approximately equal to avoid the distance between the support column 13 and any light-emitting device 14 being too close, and the light output from the light-emitting device 14 A block is caused to avoid uneven light output from the light emitting substrate 100 .
  • the light-emitting substrate 100 has a plurality of light-emitting regions A, and the light-emitting regions A are provided with at least one group of light-emitting devices D. At least two light emitting areas A are spaced between the support pillar 13 and the boundary of the substrate 10 .
  • the light-emitting area A is provided with 4 ⁇ 1 groups of light-emitting devices D, that is, four groups of light-emitting devices D are provided along the direction X, and one group of light-emitting devices D are provided along the direction Y, and the light-emitting area A has a total of Four groups of light emitting devices D are provided.
  • the light-emitting area A is provided with 2 ⁇ 2 groups of light-emitting devices D, that is, two groups of light-emitting devices D are provided along the direction X, two groups of light-emitting devices D are provided along the direction Y, and the light-emitting area A is provided with four groups of light-emitting devices in total. device D.
  • the distance between the support column 13 and the boundary of the substrate 10 is less than or equal to 150 mm.
  • the support columns 13 When the substrate 101 of the substrate 10 is a glass substrate, the structural strength of the edge region of the substrate 101 is low, and the support columns 13 are easily broken and warped due to stress.
  • the orthographic projection on the substrate 101 is kept away from the edge region of the substrate 101 as far as possible, so as to ensure the stability of supporting the optical film by the support column 13 .
  • the plurality of openings H are uniformly arranged on the reflective layer 11 , for example, the plurality of openings H are arranged in an array on the reflective layer 11 .
  • a plurality of support columns 13 are evenly arranged on the surface of the substrate 10 , for example, a plurality of support columns 13 are arranged in an array on the surface of the substrate 10 to facilitate batch paste
  • the support column 13 improves the sticking efficiency of the support column 13 .
  • the distance between the two closest supporting columns 13 is less than or equal to the distance threshold, so as to ensure the supporting effect of the supporting columns 13 on the optical film.
  • the “spacing threshold” represents the effective spacing between the support pillars 13 . If the distance between the two closest support columns 13 is less than or equal to the distance threshold, the deformation of the optical film under the support of the support columns 13 meets the requirements; if the distance between the two closest support columns 13 is greater than If the distance threshold is set, the deformation amount of the optical film under the support of the support column 13 does not meet the requirements.
  • the spacing threshold is 300 mm, and the spacing between the two closest supporting columns 13 is less than or equal to 300 mm.
  • the plurality of support columns 13 are arranged in an array on the surface of the substrate 10 .
  • the column direction (Y direction) in which the plurality of support columns 13 are arranged two adjacent supports The distance between the columns 13 is less than or equal to 300mm; along the row direction (X direction) of the arrangement of the plurality of support columns 13, the distance between two adjacent support columns 13 is less than or equal to 300mm.
  • the light-emitting substrate 100 provided by some embodiments of the present disclosure may be a Mini LED light-emitting substrate.
  • the radial dimension of the orthographic projection of the light-emitting device 14 of the Mini LED light-emitting substrate on the substrate 10 ranges from 100 ⁇ m to 500 ⁇ m, for example, 100 ⁇ m, 200 ⁇ m , 300 ⁇ m, 400 ⁇ m or 500 ⁇ m.
  • the light-emitting substrate 100 can also be a Micro LED light-emitting substrate, and the radial dimension of the orthographic projection of the light-emitting device 14 of the Micro LED light-emitting substrate on the substrate 10 is less than 100 ⁇ m, for example, 30 ⁇ m, 50 ⁇ m, 60 ⁇ m, 85 ⁇ m or 100 ⁇ m.
  • the display device 300 includes a display panel 301 , and the light-emitting substrate 100 as described in any of the above embodiments.
  • the light-emitting substrate 100 is disposed on the display panel 301 .
  • the non-display side P of the display panel 301 provides a backlight source.
  • the display device 300 further includes a plurality of optical films 201 disposed between the light-emitting substrate 100 and the display panel 301 , that is, the light-emitting side M of the light-emitting substrate 100 .
  • the plurality of optical films 201 may include a diffusion plate 202 , a quantum dot film 203 , a diffusion sheet 204 and a composite film 205 which are arranged in sequence along a direction away from the light emitting substrate 100 .
  • the diffuser plate 202 and the diffuser sheet 204 are used to improve the light and shadow generated by the light-emitting substrate 100 and improve the display quality of the display device 300 .
  • the quantum dot film 203 can convert the blue light into white light under the excitation of the blue light emitted by the light emitting substrate 100 , which can improve the utilization rate of the light energy of the light emitting substrate 100 .
  • the composite film 205 can be used to increase the brightness of light transmitted through the composite film 205 .
  • the above-mentioned display device 300 may be a liquid crystal display device (Liquid Crystal Display, LCD for short).
  • the substrate 10 of the light-emitting substrate 100 does not need to be provided with an edge area, which is beneficial to the narrow frame design of the display device 300 . Also, since the substrate 10 is not provided with an edge region, the cost of cutting the edge region will not be increased.
  • the above-described display device 300 may be any device that displays images whether in motion (eg, video) or stationary (eg, still images) and whether text or images. More specifically, it is contemplated that the embodiments may be implemented in or associated with a wide variety of electronic devices, such as, but not limited to, mobile phones, wireless devices, personal data assistants (PDAs) , handheld or portable computers, GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, TV monitors, flat panel monitors, computer monitors, automotive monitors (e.g., odometer displays, etc.), navigators, cockpit controls and/or displays, displays of camera views (eg, displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, building structures, packaging and aesthetic structures (eg, a display for an image of a piece of jewelry), etc.
  • PDAs personal data assistants
  • GPS receivers/navigators cameras
  • MP4 video players camcord
  • Some embodiments of the present disclosure also provide a method for preparing a light-emitting substrate, as shown in FIG. 10 , including the following S1 to S4:
  • a substrate 10 is provided, and at least one first alignment mark 12 is provided on the substrate 10 .
  • the substrate 10 includes a substrate 101, and a driving circuit disposed on the substrate 101.
  • the driving circuit includes a plurality of thin film transistors and signal lines, and the first alignment mark 12 can be connected to any conductive pattern of the driving circuit. formed under the same process step.
  • any one of the conductive patterns of the driving circuit is of a laminated structure, and the first alignment mark 12 is also of the same laminated structure.
  • the substrate 10 includes a substrate 101, and a buffer layer 102, a first conductive layer 103, a first passivation layer 104, a first flat layer 105, a second conductive layer 106, The second passivation layer 107 and the second planarization layer 108, wherein the first conductive layer 103 and the second conductive layer 106 are used to form the conductive pattern of the driving circuit.
  • the first alignment mark 12 and one of the first conductive layer 103 or the second conductive layer 106 are formed in the same process step.
  • the reflective layer 11 is provided on the substrate 10 .
  • the light output of the light emitting substrate 100 in the direction Z along the thickness of the substrate 10 is increased through the reflection of the light by the reflective layer 11 , thereby improving the light output efficiency of the light emitting substrate 100 .
  • the reflective layer 11 is provided with a plurality of openings H and a plurality of mounting openings H3 , and the plurality of openings H include at least one first.
  • An opening H1, and a first alignment mark 12 is disposed in the first opening H1.
  • the reflective layer 11 may be a reflective sheet.
  • a plurality of openings H on the reflective layer 11 may be prepared in advance, and the reflective layer 11 may be directly pasted on the substrate 10 .
  • the reflective layer 11 may also be a reflective coating layer or white oil, and a plurality of openings H are formed while the reflective layer 11 is formed by a film forming process.
  • the first alignment marks 12 can be used for alignment, a mask is set on the substrate 10 , and white oil is printed on the substrate 10 to form a plurality of openings H on the reflective layer 11 .
  • a reflective coating layer is formed on the substrate 10 by an evaporation process, and a plurality of openings H are formed on the reflective coating layer by using an exposure development process and an etching process.
  • a point-filling process can be used to spray white glue along the edge of the opening H and/or the installation opening H3, and the reflectivity of the white glue should be close to the reflection rate.
  • the first opening H1 exposes the first alignment mark 12 , and the alignment is performed by collecting an image of the first alignment mark 12 , and a plurality of light-emitting devices 14 are provided on the substrate 10 .
  • the light-emitting devices 14 It is located in the installation opening H3 of the reflective layer 11 to ensure the installation accuracy of the light emitting device 14 .
  • a plurality of support columns 13 are provided.
  • the plurality of support columns 13 are used to support the plurality of optical films, so that there is a light mixing distance between the reflective layer 11 in the light-emitting substrate 100 and the optical films, which can improve the light and shadow generated by the light-emitting substrate 100 and improve the display image of the display device. quality.
  • At least one supporting column 13 is disposed at the opening H, and the orthographic projection of the supporting column 13 disposed at the opening H on the substrate 10 is the same as the orthographic projection of the corresponding opening H on the substrate 10 .
  • the projections overlap at least partially.
  • the support column 13 may be pasted on the substrate 10 through the fixing layer 15 to realize the fixation of the support column 13 .

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Abstract

一种发光基板，包括基板、反射层、至少一个第一对位标记、多个支撑柱和多个发光器件。其中，所述反射层设置于所述基板上，所述反射层开设有多个开口和多个安装开口，多个开口包括至少一个第一开口。第一开口内设置有第一对位标记。至少一个支撑柱在所述基板上的正投影，与所述开口在所述基板上的正投影至少部分重叠。多个发光器件设置于基板上，发光器件位于反射层的安装开口内。

Description

发光基板及显示装置
本申请要求于2021年04月30日提交的、申请号为202110480386.0的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种发光基板及显示装置。
背景技术
目前，微型发光二极管灯板的制备过程中需要采用诸多工艺，例如，自动光学检测(Automated Optical Inspection，简称AOI)、固晶工艺、重工(Rework)和绑定(Bonding)等。
在上述多个工艺过程中，Mini LED灯板的基板上设置有对位标记(mark)，通过采集对位标记的图像进行对位，来保证安装结构在基板上的位置精度。
公开内容
一方面，提供一种发光基板。所述发光基板包括基板、反射层、至少一个第一对位标记、多个支撑柱和多个发光器件。其中，所述反射层设置于所述基板上，所述反射层开设有多个开口和多个安装开口，多个开口包括至少一个第一开口。第一开口内设置有第一对位标记。至少一个支撑柱在所述基板上的正投影，与所述开口在所述基板上的正投影至少部分重叠。多个发光器件设置于基板上，发光器件位于反射层的安装开口内。
在一些实施例中，所述基板上设置有固定层，所述支撑柱通过所述固定层与所述基板固定连接。
在一些实施例中，所述多个支撑柱包括至少一个第一支撑柱，和/或至少一个第二支撑柱。所述第一支撑柱包括设置于所述开口内的底座，以及位于所述底座远离所述基板一侧且与所述底座连接的第一主体部。所述第二支撑柱包括第二主体部。
在一些实施例中，所述第一支撑柱在所述基板上的正投影，覆盖相应开口在所述基板上的正投影。所述底座远离所述第一主体部的一面为第一底面，所述底座的与所述第一主体部相连接的一面为第一顶面，所述第一主体部的与所述底座相连接的一面为第二底面，所述第二底面在所述基板上的正投影，覆盖所述第一顶面在所述基板上的正投影。所述底座沿所述基板的厚度方向的尺寸，小于或等于所述开口沿所述基板的厚度方向的尺寸。
在一些实施例中，所述第一底面位于所述固定层内，沿所述基板的厚度方向，所述第一底面位于所述反射层的靠近所述基板的一面与远离所述基板 的一面之间。所述第二底面，与所述反射层远离所述基板一侧的表面相抵。所述第二底面在所述基板上的正投影，覆盖相应开口在所述基板上的正投影。
在一些实施例中，所述第一主体部包括沿平行于所述基板所在平面的方向的多个截面。至少一个截面的面积，大于或等于位于所述至少一个截面远离所述基板一侧的截面的面积。
在一些实施例中，沿所述基板的厚度方向，且由所述底座指向所述第一主体部的方向，所述第一主体部沿平行于所述基板所在平面的方向的截面的面积逐渐减小。
在一些实施例中，所述底座在所述基板上的正投影的形状为环形；或所述底座的形状为柱状；或所述底座包括由所述第二底面向所述基板伸出的多个凸起。
在一些实施例中，所述第二支撑柱靠近所述基板的一面通过所述固定层与所述基板固定连接。
在一些实施例中，所述第二支撑柱靠近所述基板的一面侧开设有至少一个凹槽，所述固定层的至少部分位于所述第二支撑柱的凹槽内。
在一些实施例中，所述凹槽在所述基板上的正投影的形状为圆形；或环形；或，间隔设置的多个弧形。
在一些实施例中，所述第二支撑柱包括沿平行于所述基板所在平面的方向的多个截面。至少一个截面的面积，大于或等于位于所述至少一个截面远离所述基板一侧的截面的面积。
在一些实施例中，沿所述基板的厚度方向，且由所述基板指向所述第二支撑柱的方向，所述第二支撑柱沿平行于所述基板所在平面的方向的截面的面积逐渐减小。
在一些实施例中，所述至少一个支撑柱在所述基板上的正投影的外边界，与所述开口在所述基板上的正投影的边界之间的最大间距为D1；所述支撑柱的安装公差为A1；所述开口的径向尺寸公差为A2；所述支撑柱的最大允许位移为A3。其中，A1+A2≤D1≤A3。
在一些实施例中，所述基板具有中间区域和位于所述中间区域四周的边缘区域，所述第一开口设置于所述基板的边缘区域。
在一些实施例中，所述中间区域无开口，所述中间区域设置有所述第二支撑柱。所述第二支撑柱通过所述固定层与所述反射层远离所述基板的一侧表面固定连接。
在一些实施例中，所述多个开口还包括至少一个第二开口，第二开口内 不设置第一对位标记。所述中间区域设置有所述第二开口。
在一些实施例中，所述多个开口包括多个第一开口，至少一个第一开口内还设置有第二对位标记。所述第二对位标记与所述反射层材料相同，且同层设置。
在一些实施例中，不设置第二对位标记的第一开口，相对于设置有第二对位标记的第一开口远离所述基板的中心。
在一些实施例中，所述基板包括衬底，以及设置于所述衬底上的第一导电层和/或第二导电层。所述第一对位标记与所述第一导电层同层设置。和/或，所述第一对位标记与所述第二导电层同层设置。
在一些实施例中，所述多个发光器件包括多组发光器件，每组包括至少两个发光器件。每组发光器件围绕所述支撑柱的四周均匀布置，每组发光器件中的每个发光器件与所述支撑柱的距离均大致相等。
在一些实施例中，发光基板具有多个发光区，发光区设置有至少一组发光器件。所述支撑柱与所述基板的边界之间间隔有至少两个发光区。
在一些实施例中，所述固定层的颜色与所述反射层的颜色大致相同。
在一些实施例中，所述发光基板还包括多个反射子层，反射子层包括补偿部和凸起部。
至少一个反射子层的补偿部设置于所述开口的内壁，凸起部设置于所述开口的边沿；和/或，至少一个反射子层的补偿部设置于所述安装开口的内壁，凸起部设置于所述安装开口的边沿。
另一方面，提供一种显示装置。所述显示装置包括显示面板，以及如上述任一实施例所述的发光基板以及多个光学膜片。其中，所述发光基板设置于所述显示面板的非显示侧，多个光学膜片设置于所述发光基板与所述显示面板之间。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据本公开的一些实施例的一种发光基板的俯视图；
图2A为图1中发光基板沿Q-Q＇的剖面图；
图2B为图2A中M处的局部放大图；
图2C为图2A中N处的局部放大图；
图3为根据本公开的一些实施例的另一种发光基板的结构图；
图4为根据本公开的一些实施例的又一种发光基板的结构图；
图5A为根据本公开的一些实施例的一种第一支撑柱的结构图；
图5B为根据本公开的一些实施例的另一种第一支撑柱的结构图；
图5C为根据本公开的一些实施例的又一种第一支撑柱的结构图；
图5D为根据本公开的一些实施例的又一种第一支撑柱的结构图；
图6A为根据本公开的一些实施例的一种第二支撑柱的结构图；
图6B为根据本公开的一些实施例的另一种第二支撑柱的结构图；
图6C为根据本公开的一些实施例的又一种第二支撑柱的结构图；
图7A为根据本公开的一些实施例的又一种第二支撑柱的结构图；
图7B为根据本公开的一些实施例的又一种第二支撑柱的结构图；
图8A为根据本公开的一些实施例的一种反射层的结构图；
图8B为根据本公开的一些实施例的另一种反射层的结构图；
图8C为根据本公开的一些实施例的又一种反射层的结构图；
图9为根据本公开的一些实施例的显示装置的结构图；
图10为根据本公开的一些实施例的发光基板的制备方法的流程图；
图11A为根据本公开的一些实施例的制备基板的步骤图；
图11B为根据本公开的一些实施例的制备反射层的步骤图；
图11C为根据本公开的一些实施例的制备发光器件的步骤图；
图11D为根据本公开的一些实施例的制备支撑柱的步骤图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)” 或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“电连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“大致”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量***的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
本公开的一些实施例提供了一种发光基板，如图1和图2A所示，发光基板100包括基板10和设置于基板10上的反射层11。
其中，反射层11的至少部分边界与基板10的至少部分边界重合，且反 射层11开设有多个开口H和多个安装开口H3，多个开口H包括至少一个第一开口H1。
需要说明的是，图1和图2A中示出了反射层11的部分边界，与基板10的部分边界重合的情形。基板10上也可以有部分功能区域，例如图1和图2C示出的绑定电路板的区域16，该部分功能区域不设置反射层11。
示例性地，反射层11的颜色为白色，使反射层11具有较高的反射率。
示例性地，开口H在基板10上的正投影的形状可以是圆形、三角形或矩形等。
如图2A所示，发光基板100还包括至少一个第一对位标记12，第一开口H1内设置有第一对位标记12。
可以理解的是，第一对位标记12可以设置于第一开口H1内的任意位置，例如，第一对位标记12可以设置于第一开口H1的中心，也可以设置于第一开口H1内除中心以外的其它位置，保证第一开口H1暴露第一对位标记12，以便于采集第一对位标记12的图像进行对位。
需要说明的是，如图2A所示，基板10包括衬底101，以及设置于衬底101上的驱动电路，驱动电路包括多个薄膜晶体管和信号线，第一对位标记12可以与驱动电路的任一个导电图案的材料相同，且同层设置。例如，第一对位标记12与驱动电路中的信号线的材料相同，且同层设置，该信号线设置有镂空区，沿基板10的厚度方向Z，镂空区贯穿信号线，第一对位标记12设置于镂空区内，且第一对位标记12与该信号线之间绝缘。
或者，驱动电路的任一个导电图案为叠层结构，第一对位标记12也为相同的叠层结构。
“同层”指的是采用同一成膜工艺形成用于形成特定图形的膜层，然后利用同一掩模板通过一次构图工艺形成的层结构。根据特定图形的不同，一次构图工艺可能包括多次曝光、显影或刻蚀工艺，而形成的层结构中的特定图形可以是连续的也可以是不连续的，这些特定图形还可能处于不同的高度或者具有不同的厚度。
如图2A所示，发光基板100还包括多个支撑柱13，至少一个支撑柱13在基板10上的正投影，与开口H在基板10上的正投影至少部分重叠。
需要说明的是，支撑柱13的颜色可根据需要进行选择，例如，支撑柱13的颜色可以是白色，以使支撑柱13的反射率接近于反射层11的反射率。又例如，支撑柱13可以是透明的。
可以理解的是，在显示装置中包括设置于显示面板与发光基板100之间 的多个光学膜片，多个支撑柱13用于支撑多个光学膜片，使发光基板100中的反射层11与光学膜片之间具有混光距离，可改善发光基板100所产生的灯影，提高显示装置的显示画质。
支撑柱13在基板10上的正投影，与开口H在基板10上的正投影可以是完全重叠的，也可以是部分重叠的，例如，开口H在支撑柱13的范围内。
支撑柱13的不同的结构设计取决于其不同的安装方式，本文的后面会结合支撑柱13的安装方式对其结构进行描述。
如图2A和图2B所示，发光基板100还包括多个发光器件14，多个发光器件14设置于基板10上，发光器件14位于反射层11的安装开口H3内。通过反射层11对发光器件14所发出的光线的反射，以增加发光基板100沿垂直于基板10所在平面的方向Z上的出光量，从而提高发光基板100的出光效率。
可以理解的是，图2A中示出的发光基板100沿Q-Q＇的剖面图中，发光器件14的数量应该与图1中沿方向X排列的每行发光器件14的数量相同。
需要说明的是，发光器件14可以通过反射层11上的安装开口H3与基板10上的驱动电路电连接，通过驱动电路驱动发光器件14发光。或者，发光器件14可以通过反射层11上的安装开口H3与基板10上的信号线电连接，信号线与驱动集成电路(Integrated Circuit，简称IC)电连接，用于向发光器件14传输来自驱动集成电路的电压信号或电流信号，以驱动发光器件14发光。
在相关技术中，发光基板的对位标记设置于基板的边缘区域，会增加基板的边缘面积，导致安装该发光基板的显示装置的边框较宽，不利于显示装置的窄边框化设计。如果在对位完成之后，采用切割(Cutting)工艺，将基板中设置有对位标记的边缘区域切掉，又会增加引入切割工艺的成本。
基于此，本公开的上述实施例中的发光基板100，将第一对位标记12设置于反射层11的第一开口H1内，使得基板10不需要设置边缘区域，从而使反射层11的至少部分边界与基板10的至少部分边界重合，有利于显示装置的窄边框化设计。并且，由于基板10不设置边缘区域，不会增加切割边缘区域的成本。
在一些实施例中，如图2A所示，基板10包括衬底101，以及设置于衬底101上的第一导电层103和/或第二导电层106。
第一对位标记12与第一导电层103同层设置。和/或，第一对位标记12与第二导电层106同层设置。
示例性地，基板10包括衬底101，以及设置于衬底101上的第一导电层103。第一对位标记12与第一导电层103同层设置。
示例性地，基板10包括衬底101，以及设置于衬底101上的第二导电层106。第一对位标记12与第二导电层106同层设置。
示例性地，如图2A所示，基板10包括衬底101，以及依次层叠设置于衬底101上的缓冲层102、第一导电层103、第一钝化层104、第一平坦层105、第二导电层106、第二钝化层107和第二平坦层108，其中，第一导电层103和第二导电层106用于形成驱动电路的导电图案。第一对位标记12可以是由第一导电层103或第二导电层106的一者形成，也可以是由第一导电层103和第二导电层106共同形成的。
例如，第一对位标记12可以是由第二导电层106形成的，以减小第一对位标记12与基板10的表面的距离，使得从基板10的表面采集第一对位标记12的图像更加清晰，有利于提高对位精度。
在一些实施例中，如图2A所示，基板10的衬底101可以为印刷电路板(Printed Circuit Board，简称PCB)或玻璃基板。示例性地，衬底101的厚度范围可为0.4mm～3mm，例如，厚度可为0.4mm、1mm、1.5mm、2mm或3mm。
在一些实施例中，第一导电层103的制备工艺可包括磁控溅射工艺，如图2A和图2B所示，采用磁控溅射工艺，制备得到的第一导电层103包括第一导电子层103A和第二导电子层103B。
其中，第一导电子层103A可包括铜。第二导电子层103B可包括依次层叠设置的钼铌合金(MoNb)、铜和钼铌合金，靠近衬底101的钼铌合金起到粘附的作用，远离衬底101的钼铌合金起到防氧化的作用。
示例性地，第二导电子层103B的靠近衬底101的钼铌合金的厚度范围可为
Figure PCTCN2021128451-appb-000001
例如，厚度可为
Figure PCTCN2021128451-appb-000002
或
Figure PCTCN2021128451-appb-000003
第二导电子层103B的远离衬底101的钼铌合金的厚度范围可为
Figure PCTCN2021128451-appb-000004
例如，厚度可为
Figure PCTCN2021128451-appb-000005
或
Figure PCTCN2021128451-appb-000006
在一些实施例中，第一导电层103的制备工艺还可包括电镀工艺，采用电镀工艺，制备得到的第一导电层103可包括依次层叠设置的第一钼镍钛合金(MoNiTi)、铜和第二钼镍钛合金，第一钼镍钛合金可提高晶粒成核密度，第二钼镍钛合金起到防氧化的作用。
示例性地，第一导电层103的第一钼镍钛合金的厚度范围可为
Figure PCTCN2021128451-appb-000007
例如，厚度可为
Figure PCTCN2021128451-appb-000008
或
Figure PCTCN2021128451-appb-000009
第一导电子层103A的第二钼镍钛合金的厚度范围可为
Figure PCTCN2021128451-appb-000010
例如，厚度可为
Figure PCTCN2021128451-appb-000011
或
Figure PCTCN2021128451-appb-000012
在一些实施例中，第一导电层103的厚度范围可为1.5μm～7μm，例如，厚度可为1.5μm、2μm、4μm、6.5μm或7μm。
在一些实施例中，如图2A和图2B所示，第二导电层106可包括依次层叠设置的钼铌合金、铜和保护层，保护层可包括铜镍合金(CuNi)、镍或氧化铟锡(Indium Tin Oxide，简称ITO)中的任一者。其中，钼铌合金起到粘附的作用，保护层起到防氧化的作用，并保证固晶的牢固性。
示例性地，第二导电层106的厚度范围可为
Figure PCTCN2021128451-appb-000013
例如，厚度可为
Figure PCTCN2021128451-appb-000014
或
Figure PCTCN2021128451-appb-000015
在一些实施例中，反射层11可以是反射片，例如，白色反射片。或者，反射层11也可以是反射镀层。
或者，反射层11的材料可包括白油，白油可包括树脂(例如，环氧树脂、聚四氟乙烯树脂)、二氧化钛(化学式TiO 2)以及有机溶剂(例如，二丙二醇甲醚)等；反射层11的材料还可包括硅系白胶。在反射层11的材料包括白油或包括硅系白胶的情况下，可采用丝网印刷工艺，印刷白油形成反射层11。示例性地，反射层11的厚度范围可为10μm～300μm，例如，厚度可为10μm、50μm、80μm、155μm、200μm或300μm。示例性地，反射层11可以通过一次或多次丝网印刷工艺形成。其中，采用多次丝网印刷工艺制作反射层11时，开口的大小可以不同，以提高开口区附近反射层的制作精度，如此，开口区边缘的反射层11呈现台阶状。
在一些实施例中，如图2B所示，发光基板100还包括多个反射子层19，反射子层19包括补偿部19A和凸起部19B。至少一个反射子层19的补偿部19A设置于安装开口H3的内壁，凸起部19B设置于安装开口H3的边沿。
示例性地，补偿部19A围绕安装开口H3的内壁设置，凸起部19B围绕安装开口H3的边沿设置。
通过设置反射子层19的补偿部19A，可补偿安装开口H3的径向尺寸，提高安装开口H3的尺寸精度。
在一些实施例中，至少一个反射子层19的补偿部19A设置于开口H的内壁，凸起部19B设置于开口H的边沿。
示例性地，补偿部19A围绕开口H的内壁设置，凸起部19B围绕开口H的边沿设置。
通过设置反射子层19的补偿部19A，可补偿开口H的径向尺寸，提高开口H的尺寸精度。
在一些实施例中，反射子层19的厚度大于反射层11的厚度，示例性地，反射子层19的厚度范围可为40μm～330μm，例如，厚度可为40μm、50μm、80μm、185μm、200μm或330μm。
需要说明的是，与制备反射层11的丝网印刷工艺不同，制备反射子层19采用补点工艺(即，采用喷射阀喷涂胶水)，围绕开口H和/或安装开口H3的边沿喷涂胶水，使得反射子层19的厚度要大于反射层11的厚度。
在一些实施例中，反射子层19的材料包括硅系白胶，硅系白胶的颜色为白色，使反射子层19的颜色与反射层11的颜色大致相同，以保证固定层15对光线的反射率，使其接近于反射层11对光线的反射率。
在一些实施例中，如图2B所示，发光基板100还包括设置于发光器件14远离基板10一侧的封装层17，用于保护发光器件14。
示例性地，封装层17可以是整层覆盖在发光器件14上的。
示例性地，如图2B所示，封装层17可以是包括多个封装子层，每个封装子层包裹住一个发光器件14。
在一些实施例中，支撑柱13在基板10上的正投影，不与基板10的第二导电层106重叠，例如，支撑柱13在基板10上的正投影的边界与第二导电层106的轮廓边界的最小距离大于或等于3mm，可减小支撑柱13作用于第二导电层106上的压力，避免第二导电层106受力而损坏。
在一些实施例中，如图2A所示，基板10上设置有固定层15，支撑柱13通过固定层15与基板10固定连接。
示例性地，固定层15的材料可包括胶水，胶水固化后形成固定层15。
在一些实施例中，固定层15的材料可包括反应型热熔胶，例如，聚氨酯树脂(Polyurethane Resin，简称PUR)，其具有耐高温的特点，可保证固定层15在高温下的稳定性。
需要说明的是，制备固定层15所需的胶水的粘接强度和粘稠度可以根据需要进行调整，以保证支撑柱13与固定层15的粘接强度。
并且，固定层15的颜色可以是白色，也可以是无色透明的，还可以是淡黄色。通过将固定层15的颜色设置为白色，使固定层15的颜色与反射层11的颜色大致相同，以保证固定层15对光线的反射率，使其接近于反射层11对光线的反射率。
在另一些实施例中，支撑柱13与基板10固定连接的方式还可以是焊接或卡接。
前文提到支撑柱13的结构与其安装方式有关，下面对本公开的一些实施 例中的支撑柱13进行详细描述。
在一些实施例中，如图2A所示，多个支撑柱13包括至少一个第一支撑柱131，第一支撑柱131的至少部分结构设置于开口H内，使第一支撑柱131安装在开口H内。在用于粘贴第一支撑柱131的胶水未固化的情况下，这样可以利用开口H限制第一支撑柱131沿平行于基板10所在平面的方向S的位移，从而避免第一支撑柱131脱落，以保证光学膜片的表面平坦度，保证其光学性能。
需要说明的是，“基板所在平面”是指基板10的位于发光基板100的出光侧的表面。
在一些实施例中，如图2A所示，第一支撑柱131在基板10上的正投影，覆盖相应开口H在基板10上的正投影，使得第一支撑柱131可以遮挡开口H，可避免由于反射层11中的开口H暴露而影响发光基板100的整体的出光效率，以及显示装置的显示效果。
需要说明的是，第一支撑柱131的材料可包括反光材料，并且，第一支撑柱131对光线的反射率与反射层11对光线的反射率大致相等。通过第一支撑柱131遮挡开口H，可避免由于反射层11中设置开口H而导致反射层11的反射面积减小，从而避免影响发光基板100的整体的出光效率，以及显示装置的显示效果。
示例性地，如图2A所示，第一支撑柱131靠近基板10的部分(即，第一支撑柱131的底部)设置于开口H内，并且，第一支撑柱131在基板10上的正投影，覆盖相应开口H在基板10上的正投影，使得第一支撑柱131可以遮挡开口H。
接下来，对第一支撑柱131的结构进行详细描述。
在一些实施例中，结合图2A和图5A，第一支撑柱131包括设置于开口H内的底座1313，以及位于底座1313远离基板10一侧且与底座1313连接的第一主体部1314。
通过将第一支撑柱131的底座1313安装在开口H内，可以限制第一支撑柱131沿平行于基板10所在平面的方向S的位移，保证第一支撑柱131在方向S上分布的均匀性，从而减小第一支撑柱131所支撑的光学膜片的不同区域的形变量差异，提高光学膜片的表面平坦度，以保证其光学性能。第一支撑柱131的第一主体部1314用于支撑光学膜片，以减小光学膜片受力而产生的形变量。
结合图2A和图5A，底座1313远离第一主体部1314的一面为第一底面 1311，底座1313的与第一主体部1314相连接的一面为第一顶面1315，第一主体部1314的与底座1313相连接的一面为第二底面1312，第二底面1312在基板10上的正投影，覆盖第一顶面1315在基板10上的正投影，使底座1313与第一主体部1314形成台阶面。底座1313沿基板10的厚度方向Z的尺寸，小于或等于与开口H沿基板10的厚度方向Z的尺寸大致相等。
在一些实施例中，如图2A和图5A所示，底座1313沿基板10的厚度方向Z的尺寸，与开口H沿基板10的厚度方向Z的尺寸大致相等，保证底座1313的第一底面1311与基板10的第二平坦层108的表面相抵，同时第一主体部1314的第二底面1312可与反射层11的表面相抵。
在一些实施例中，结合图2A和图5A，第一底面1311位于固定层15内，沿基板10的厚度方向Z，第一底面1311位于反射层11的靠近基板10的一面与远离基板10的一面之间。第二底面1312与反射层11远离基板10一侧的表面相抵。
需要说明的是，参考图2A和图5A，第一底面1311与基板10的第二平坦层108的表面相抵，实际上第一底面1311与第二平坦层108之间存在固定层15的一部分，固定层15的该部分可忽略不计。
通过第一底面1311与第二底面1312组成的台阶面，使第一底面1311与基板10的第二平坦层108的表面相抵，第二底面1312与反射层11的表面相抵，以对第一支撑柱131进行限位，保证第一支撑柱131的安装高度，从而可提高各第一支撑柱131的安装高度的均一性，使得各第一支撑柱131对光学膜片的相应区域的支撑高度大致相等，光学膜片的不同区域的形变量大致相等，有利于提高光学膜片的表面平坦度，以保证其光学性能。
如图2A所示，第一支撑柱131的第二底面1312在基板10上的正投影，覆盖相应开口H在基板10上的正投影，使得第一支撑柱131的第二底面1312可以遮挡开口H，可避免由于反射层11中设置开口H而导致反射层11的反射面积减小，从而避免影响发光基板100的整体的出光效率，以及显示装置的显示效果。
在一些实施例中，如图5A和图5B所示，沿基板10的厚度方向Z，且由底座1313指向第一主体部1314的方向U，第一主体部1314沿平行于基板10所在平面的方向S的截面的面积逐渐减小。
通过上述设置方式，在第一主体部1314的第二底面1312的面积不变的情况下，可以减小第一主体部1314的体积，从而减小第一支撑柱131的第一主体部1314对光线的阻挡作用，提高发光基板100沿基板10的厚度的方向Z 上的出光量，从而提高发光基板100的出光效率。
在一些实施例中，如图5A所示，第一支撑柱131的第一主体部1314包括沿平行于基板10所在平面的方向S的多个截面，至少一个截面大于或等于位于该截面远离基板10一侧的截面的面积。
示例性地，如图5A所示，第一支撑柱131的第一主体部1314的形状可以为锥体。如图5B所示，第一支撑柱131的第一主体部1314的形状也可以为圆台。如图5C所示，第一支撑柱131的第一主体部1314的形状还可以为柱体。
在一些实施例中，第一支撑柱131为图5D示出的结构，第一支撑柱131的底座1313为卡扣，卡扣包括靠近基板10的第一底面1311。第一支撑柱131的第一主体部1314包括与卡扣连接的座体，以及与座体连接，位于座体远离卡扣一侧的圆台，其中，座体包括与卡扣连接的第二底面1312。
在相关技术中，发光基板的基板设置有通孔，图5D示出的第一支撑柱131的底座1313穿过基板的通孔，并卡在基板的通孔上，以实现第一支撑柱131的固定，但是，这也导致与第一支撑柱131对应的开口内无法设置对位标记。本公开的上述实施例，不需要在基板10上设置有通孔，可将图5D示出的第一支撑柱131通过固定层15与基板10固定连接，并且，第一开口H1内也可设置第一对位标记12。
接下来，对第一支撑柱131的固定方式进行详细描述。
在一些实施例中，结合图2A和图5A，在反射层11的开口H内设置有固定层15，第一支撑柱131的底座1313的至少部分嵌入固定层15中，与固定层15连接，使得第一支撑柱131通过固定层15固定在基板10上。
示例性地，在固定层15未固化的情况下，第一支撑柱131的底座1313嵌入固定层15中，使得部分胶水从开口H中溢出，第一支撑柱131的第二底面1312与反射层11之间会存在胶水，这部分胶水固化后的厚度较小，厚度范围可为0～10μm(不包含0)，例如，2μm、5μm、6μm、8μm、或10μm。
通过第一支撑柱131的底座1313伸入固定层15中，可以增加第一支撑柱131与固定层15的粘接面积，提高第一支撑柱131与固定层15的粘接强度。并且，可通过增大第一支撑柱131的底座1313与固定层15的粘接面积，进一步提高第一支撑柱131与固定层15的粘接强度，例如，采用图5A中的第一支撑柱1313，其底座1313呈内部中空的筒状结构，使得底座1313的内部也可以与固定层15粘接。
在一些实施例中，如图5A所示，第一支撑柱131的底座1313在基板10上的正投影的形状可以为环形，即底座1313呈内部中空的筒状结构。如图5B所示，底座1313的形状也可以为柱状。或者，如图5C所示，底座1313包括由第二底面1312向基板10伸出的多个凸起1315。
以上是对第一支撑柱131的描述，接下来对第二支撑柱132进行描述。
在一些实施例中，如图3和图6A所示，多个支撑柱13包括至少一个第二支撑柱132，第二支撑柱132包括第二主体部1323。可以理解的是，相对于第一支撑柱131，第二支撑柱132不具有底座。
开口H在基板10上的正投影覆盖相应第二支撑柱132在基板10上的正投影。沿基板10的厚度方向Z，第二支撑柱132靠近基板10的一面，位于反射层11的靠近基板10的一面与远离基板10的一面之间。在用于粘贴第二支撑柱132的胶水未固化的情况下，这样可以利用开口H限制第二支撑柱132沿平行于基板10所在平面的方向S的位移，从而避免第二支撑柱132脱落，以保证光学膜片的表面平坦度，保证其光学性能。
示例性地，如图3所示，第二支撑柱132靠近基板10的部分(即，第二支撑柱132的底部)固定设置于开口H内。
或者，如图3所示，第二支撑柱132设置于反射层11远离基板10的一侧，即反射层11对应第二支撑柱132的区域不设置开口H，不需要对开口H进行遮挡，避免了由于遮挡不严而导致开口H暴露的问题，第二支撑柱132可直接设置于反射层11的表面。
需要说明的是，第二支撑柱132的材料可包括反光材料，并且，第二支撑柱132对光线的反射率与反射层11对光线的反射率大致相等，可避免由于第二支撑柱132遮挡反射层11而导致反射层11的反射面积减小，从而避免影响发光基板100的整体的出光效率，以及显示装置的显示效果。
在另一些实施例中，第二支撑柱132在基板10上的正投影也可覆盖相应开口H在基板10上的正投影，即第二支撑柱132不设置于开口H内。
在一些实施例中，如图6A和图6B所示，沿基板10的厚度方向Z，且由基板10指向第二支撑柱132的方向V，第二支撑柱132沿平行于基板10所在平面的方向S的截面的面积逐渐减小。
通过上述设置方式，在第二支撑柱132的底面(靠近基板10的一面)的面积不变的情况下，可以减小第二支撑柱132的体积，从而减小第二支撑柱132对光线的阻挡作用，提高发光基板100沿基板10的厚度的方向Z上的出光量，从而提高发光基板100的出光效率。
示例性地，结合图3和图7A，第二支撑柱132包括基座1322，以及位于基座1322远离基板10一侧且与基座1322连接的第二主体部1323。其中，至少一个凹槽1321设置于基座1322靠近基板10的一面，第二主体部1323靠近基座1322的一面在基板10上的正投影的径向尺寸D2小于基座1322靠近第二主体部1323的一面在基板10上的正投影的径向尺寸D3。
例如，如图7A所示，第二主体部1323靠近基座1322的一面在基板10上的正投影的径向尺寸D2小于基座1322靠近第二主体部1323的一面在基板10上的正投影的径向尺寸D3，第二支撑柱132的基座1322的形状为柱体，第二主体部1323的形状为锥体。相当于在柱体的基础上，去除柱体的部分体积，得到较小体积的第二支撑柱132，从而减小第二支撑柱132对光线的阻挡作用。
例如，如图7B所示，第二主体部1323靠近基座1322的一面在基板10上的正投影的径向尺寸D2小于基座1322靠近第二主体部1323的一面在基板10上的正投影的径向尺寸D3，第二支撑柱132的基座1322的形状为圆台，第二主体部1323的形状为锥体。相当于在锥体的基础上，去除锥体的部分体积，得到较小体积的第二支撑柱132，从而减小第二支撑柱132对光线的阻挡作用。
在一些实施例中，如图6A所示，第二支撑柱132包括沿平行于基板10所在平面的方向S的多个截面，至少一个截面的面积大于或等于位于该截面远离基板10一侧的截面的面积。
示例性地，如图6A所示，第二支撑柱132的形状可以为圆台。如图6B所示，第二支撑柱132的形状也可以为锥体。如图6C所示，第二支撑柱132的形状还可以为柱体。
接下来，对第二支撑柱132的固定方式进行详细描述。
在一些实施例中，结合图3和图6A，第二支撑柱132靠近基板10的一面通过固定层15与基板10固定连接。
示例性地，结合图3和图7A，在反射层11的开口H内设置有固定层15，第二支撑柱132靠近基板10的一面通过固定层15与基板10固定连接。
或者，第二支撑柱132设置于反射层11远离基板10的一侧，在第二支撑柱132与反射层11之间设置有固定层15，第二支撑柱132靠近基板10的一面通过固定层15与基板10固定连接。需要说明的是，固定层15的厚度应设置的较薄，厚度范围可为30μm～100μm，例如厚度为30μm、40μm、65μm、80μm或100μm，保证第二支撑柱132与固定层15的粘接强度。
在一些实施例中，结合图3和图6A，第二支撑柱132靠近基板10的一面开设有至少一个凹槽1321，固定层15的至少部分位于第二支撑柱132的凹槽1321内，可以增加第二支撑柱132与固定层15的粘接面积，提高第二支撑柱132与固定层15的粘接强度。
示例性地，如图6A所示，凹槽1321在基板10上的正投影的形状为圆形。或者，如图6B所示，凹槽1321在基板10上的正投影的形状为环形。或者，如图6C所示，凹槽1321在基板10上的正投影的形状为间隔设置的多个弧形。
在一些实施例中，如图4和图6A所示，多个支撑柱13包括至少一个第一支撑柱131和至少一个第二支撑柱132，第一支撑柱131的至少部分结构设置于开口H内，且第一支撑柱131在基板10上的正投影，覆盖相应开口H在基板10上的正投影，使第一支撑柱131安装在开口H内，并可以遮挡开口H。
如图3所示，开口H在基板10上的正投影覆盖相应第二支撑柱132在基板10上的正投影，沿基板10的厚度方向Z，第二支撑柱132靠近基板10的一面，位于反射层11的靠近基板10的一面与远离基板10的一面之间。或者，第二支撑柱132设置于反射层11远离基板10的一侧，即反射层11对应第二支撑柱132的区域不设置开口H，第二支撑柱132直接设置于反射层11的表面。
在一些实施例中，第一支撑柱131和第二支撑柱132的最大径向尺寸范围为2mm～10mm，例如，可为2mm、4mm、5mm、8mm或10mm。第一支撑柱131和第二支撑柱132的高度范围为1mm～12mm，例如，可为1mm、4mm、6mm、8mm或12mm。
在一些实施例中，如图2A所示，支撑柱13在开口H内的安装还满足如下要求：
支撑柱13在基板10上的正投影的外边界，与开口H在基板10上的正投影的边界之间的最大间距为D1。可以理解的是，在支撑柱13在开口H内，沿平行于基板10所在平面的方向S可以移动的情况下，支撑柱13可以移动的最大距离为D1。
支撑柱13的安装公差为A1，即支撑柱13沿平行于基板10所在平面的方向S的安装公差为A1。
开口H的径向尺寸公差为A2，开口H的径向与基板10的平面平行。
支撑柱13的最大允许位移为A3，即支撑柱13在开口H内，沿平行于基板10所在平面的方向S允许移动的最大距离。可以理解的是，若支撑柱13 在开口H内，沿平行于基板10所在平面的方向S移动的距离大于最大允许位移A3，在此情况下，支撑柱13在方向S上分布是不均匀的，无法保证光学膜片的表面平坦度。
其中，A1+A2≤D1≤A3。可以理解的是，D1≥A1+A2，即支撑柱13的在基板10上的正投影的外边界，与开口H在基板10上的正投影的边界之间的最大间距D1，大于或等于支撑柱13的安装公差A1与开口H的径向尺寸公差A2的和，使得支撑柱13能够***开口H内。
并且，D1≤A3，即支撑柱13在基板10上的正投影的外边界，与开口H在基板10上的正投影的边界之间的最大间距D1，小于或等于支撑柱13的最大允许位移A3，使得支撑柱13在开口H内，沿平行于基板10所在平面的方向S可以移动的最大距离小于或等于最大允许位移A3，可保证支撑柱13在方向S上分布的均匀性，从而保证光学膜片的表面平坦度，保证其光学性能。
在一些实施例中，如图1～图4所示，基板10具有中间区域11A和位于中间区域11A四周的边缘区域11B。
示例性地，如图4所示，位于边缘区域11B的开口H处可以设置第一支撑柱131，使第一支撑柱131的底座1313***开口H内的固定层15，通过固定层15将第一支撑柱131粘接在基板10上，根据前文可知，既可保证第一支撑柱131在方向S上分布的均匀性，又可保证第一支撑柱131的安装高度。
示例性地，如图3所示，位于边缘区域11B的开口H处也可以设置第二支撑柱132，使第二支撑柱132的基座1322嵌入开口H内的固定层15，固定层15至少部分位于第二支撑柱132的凹槽1321内，通过固定层15将第二支撑柱132粘接在基板10上。
需要说明的是，发光基板100中的发光器件14与光学膜片之间具有混光距离(optical distance，简称OD)，可改善发光基板100所产生的灯影，提高显示装置200的显示画质。在混光距离较大的情况下，例如，混光距离大于或等于6mm，图3示出的第二支撑柱132暴露开口H的部分区域，对发光基板100的出光效率，以及显示装置的显示效果的影响较小，可以忽略。
在一些实施例中，如图3和图4所示，基板10的中间区域11A无开口，中间区域11A设置有第二支撑柱132。第二支撑柱132通过固定层15与反射层11远离基板10的一侧表面固定连接。
示例性地，图3示出的发光基板100，基板10的中间区域11A不设置开口，不需要对开口H进行遮挡，避免了由于遮挡不严而导致开口H暴露的问题。第二支撑柱132可设置于反射层11远离基板10的一侧，在第二支撑柱 132与反射层11之间设置有固定层15，固定层15的至少部分嵌入第二支撑柱132的凹槽1321内，使得第二支撑柱132通过固定层15固定在反射层11上。
在一些实施例中，如图2A所示，反射层11的多个开口H还包括至少一个第二开口H2，第二开口H2内不设置第一对位标记12，且中间区域11A设置有第二开口H2。
示例性地，图2A示出的发光基板100，基板10的各个区域(中间区域11A和边缘区域11B)均设置有开口H，且所有的开口H处均设置有第一支撑柱131，可保证各第一支撑柱131的安装高度的均一性。
通过上述设置方式，可保证各第一支撑柱131的安装高度中，最大值与最小值的差值的范围为0～0.2mm，例如，该差值为0、0.03mm、0.01mm、0.18mm或0.2mm。
接下来，介绍第一对位标记12的设置方式。
在一些实施例中，如图8A所示，第一开口H1设置于基板10的边缘区域11B，使得第一开口H1内的第一对位标记12设置于边缘区域11B，以便于采集第一对位标记12的图像进行对位。
示例性地，第一对位标记12与基板10的边界的距离范围为90mm～110mm，例如，距离可为90mm、96mm、100mm、105mm或110mm。
在一些实施例中，如图8B和图8C所示，反射层11具有多组第一开口H1，多组第一开口H1均匀分布在反射层11的边缘，每组第一开口H1包括至少一个第一开口H1。
示例性地，如图8B所示，每组第一开口H1包括一个第一开口H1，以通过每个第一开口H1内的第一对位标记12进行对位。
示例性地，如图8C所示，每组第一开口H1包括两个第一开口H1，不同的第一开口H1内的第一对位标记12用于不同的工艺步骤的对位。
在一些实施例中，如图8A～图8C所示，反射层11的形状为四边形，具有四个角。沿反射层11的边界的延伸方向(X方向或Y方向)，反射层11的相邻两个角处的第一对位标记12的形状不同，例如，一个角处的第一对位标记12的形状为圆形，另一个角处的第一对位标记12的形状为十字形。沿反射层11的对角线方向(M方向或N方向)，反射层11的相对两个角处的第一对位标记12的形状相同，例如，两个角处的第一对位标记12的形状均为圆形，或均为十字形。
通过上述第一对位标记12的设置方式，在对位的过程中，可方便区分反 射层11的相邻两个角处的第一对位标记12，从而方便区分各第一对位标记12所在的角的位置，以保证对位位置的准确。
在一些实施例中，反射层11的形状为四边形，反射层11的四个角处的第一对位标记12也可以设置为相同的形状。示例性地，第一对位标记12的形状均为十字形，也可以均为圆形。第一对位标记12还可以是其它的设计方式，例如，四个角中的三个角处设置有十字形的第一对位标记12，一个角处设置有圆形的第一对位标记12。
在一些实施例中，如图8C所示，至少一个第一开口H1内还设置有第二对位标记18。第二对位标记18与反射层11材料相同，且同层设置。
需要说明的是，通过第一对位标记12进行对位，在基板10上制备反射层11，在同一工艺步骤下，制备得到第二对位标记18，第二对位标记18与反射层11材料相同，且同层设置。并且，沿基板10的厚度方向Z，同一第一开口H1内第二对位标记18与第一对位标记12相对应。
在一些实施例中，如图8C所示，不设置第二对位标记18的第一开口H1，相对于设置有第二对位标记18的第一开口H1远离基板10的中心E。
可以理解的是，设置有第二对位标记18的第一开口H1内的第一对位标记12，用于制备反射层11的过程中进行对位，制备完成后第二对位标记18对第一对位标记12形成遮挡，无法重复使用该第一开口H1内的第一对位标记12进行对位。因此，通过使不设置第二对位标记18的第一开口H1，相对于设置有第二对位标记18的第一开口H1远离基板10的中心E，使不设置第二对位标记18的第一开口H1更靠近基板10的边界，方便后续的工艺步骤采用第一开口H1内的第一对位标记12进行对位，并且，有利于提高对位的精度。
在一些实施例中，如图1所示，多个发光器件14包括多组发光器件D，每组发光器件D包括至少两个发光器件14，每组发光器件D围绕支撑柱13的四周均匀布置，每组发光器件D中的每个发光器件14与支撑柱13的距离均大致相等，避免支撑柱13与任一发光器件14的距离过近，而对该发光器件14的出光造成阻挡，从而避免导致发光基板100的出光不均匀。
需要说明的是，参考图1，相邻两组发光器件D之间也设置有多个发光器件14，以使发光基板100上的发光器件14均匀分布，从而保证发光基板100发光的均匀性。
并且，每组发光器件D的各发光器件14之间可以串联，也可以是并联，还可以是串联与并联的结合。例如，如图1所示，每组发光器件D的各发光 器件14之间串联。
示例性地，如图1所示，每组发光器件D包括四个发光器件14，该四个发光器件14围绕支撑柱13的四周均匀布置，例如，支撑柱13位于该四个发光器件14的中线连线所围成的区域的中心C，使得支撑柱13与每个发光器件14的距离大致相等，避免支撑柱13与任一发光器件14的距离过近，而对该发光器件14的出光造成阻挡，从而避免导致发光基板100的出光不均匀。
在一些实施例中，如图1所示，发光基板100具有多个发光区A，发光区A设置有至少一组发光器件D。支撑柱13与基板10的边界之间间隔有至少两个发光区A。
示例性地，如图1所示，发光区A设置有4×1组发光器件D，即，沿方向X设置有四组发光器件D，沿方向Y设置有一组发光器件D，发光区A共设置有四组发光器件D。
示例性地，发光区A设置有2×2组发光器件D，即，沿方向X设置有两组发光器件D，沿方向Y设置有两组发光器件D，发光区A共设置有四组发光器件D。
示例性地，与基板10的边界相距最近的支撑柱13，该支撑柱13与基板10的边界的距离小于或等于150mm。
通过上述的支撑柱13的设置方式，在基板10的衬底101采用玻璃基板，衬底101的边缘区域的结构强度较低，受力易破裂、易翘曲的情况下，使得支撑柱13在衬底101上的正投影尽量远离衬底101的边缘区域，以保证支撑柱13对光学膜片的支撑稳定性。
在一些实施例中，结合图1和图2A，多个开口H在反射层11上均匀布置，例如，多个开口H在反射层11上呈阵列式排布。
在一些实施例中，结合图1和图2A，多个支撑柱13在基板10的表面上均匀布置，例如，多个支撑柱13在基板10的表面上呈阵列式排布，以便于批量粘贴支撑柱13，提高支撑柱13的粘贴效率。
在一些实施例中，相距最近的两个支撑柱13之间的间距小于或等于间距阈值，以保证支撑柱13对光学膜片的支撑效果。
需要说明的是，“间距阈值”表征支撑柱13之间的有效间距。若相距最近的两个支撑柱13之间的间距小于或等于间距阈值，则光学膜片在支撑柱13的支撑下的形变量符合要求；若相距最近的两个支撑柱13之间的间距大于间距阈值，则光学膜片在支撑柱13的支撑下的形变量不符合要求。
示例性地，间距阈值为300mm，相距最近的两个支撑柱13之间的间距小 于或等于300mm。
例如，如图1所述，多个支撑柱13在基板10的表面上呈阵列式排布，在此情况下，沿多个支撑柱13排列的列方向(Y方向)，相邻两个支撑柱13之间的间距小于或等于300mm；沿多个支撑柱13排列的行方向(X方向)，相邻两个支撑柱13之间的间距小于或等于300mm。
本公开的一些实施例所提供的发光基板100，可以是Mini LED发光基板，Mini LED发光基板的发光器件14在基板10上的正投影的径向尺寸范围为100μm～500μm，例如，100μm、200μm、300μm、400μm或500μm。发光基板100也可以是Micro LED发光基板，Micro LED发光基板的发光器件14在基板10上的正投影的径向尺寸小于100μm，例如，30μm、50μm、60μm、85μm或100μm。
本公开的一些实施例还提供了一种显示装置，如图9所示，显示装置300包括显示面板301，以及如上述任一实施例所述的发光基板100，发光基板100设置于显示面板301的非显示侧P，为显示面板301提供背光源。
显示装置300还包括多个光学膜片201，设置于发光基板100与显示面板301之间，即发光基板100的出光侧M。
示例性地，多个光学膜片201可包括沿远离发光基板100的方向，依次设置的扩散板202、量子点膜203、扩散片204和复合膜205。其中，扩散板202和扩散片204用于改善发光基板100所产生的灯影，提高显示装置300的显示画质。量子点膜203可在发光基板100所发出的蓝光的激发下，将蓝光转化为白光，可提高对发光基板100的光能的利用率。复合膜205可用于提高经复合膜205传播后的光线的亮度。
上述显示装置300可以为液晶显示装置(Liquid Crystal Display，简称LCD)。
本公开的上述实施例中的显示装置300中，发光基板100的基板10不需要设置边缘区域，有利于显示装置300的窄边框化设计。并且，由于基板10不设置边缘区域，不会增加切割边缘区域的成本。
上述显示装置300可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如， 里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
本公开的一些实施例还提供了一种发光基板的制备方法，如图10所示，包括如下S1～S4：
S1：提供基板。
示例性地，如图11A所示，提供基板10，基板10上设置有至少一个第一对位标记12。
需要说明的是，基板10包括衬底101，以及设置于衬底101上的驱动电路，驱动电路包括多个薄膜晶体管和信号线，第一对位标记12可以与驱动电路的任一个导电图案在同一工艺步骤下形成。或者，驱动电路的任一个导电图案为叠层结构，第一对位标记12也为相同的叠层结构。
示例性地，基板10包括衬底101，以及依次层叠设置于衬底101上的缓冲层102、第一导电层103、第一钝化层104、第一平坦层105、第二导电层106、第二钝化层107和第二平坦层108，其中，第一导电层103和第二导电层106用于形成驱动电路的导电图案。第一对位标记12与第一导电层103或第二导电层106的一者在同一工艺步骤下形成。
S2：在基板10上设置反射层11。通过反射层11对光线的反射，以增加发光基板100沿基板10的厚度的方向Z上的出光量，从而提高发光基板100的出光效率。
示例性地，如图11B所示，反射层11的至少部分边界与基板10的至少部分边界重合，反射层11开设有多个开口H和多个安装开口H3，多个开口H包括至少一个第一开口H1，第一开口H1内设置有第一对位标记12。
需要说明的是，反射层11可以是反射片，在此情况下，反射层11上的多个开口H可以预先制备好，直接将反射层11粘贴于基板10上。
此外，反射层11也可以是反射镀层或白油，采用成膜工艺形成反射层11的同时形成多个开口H。例如，可采用第一对位标记12进行对位，在基板10上设置掩膜，将白油印刷到基板10上，以在反射层11上形成多个开口H。又例如，采用蒸镀工艺在基板10上形成反射镀层，采用曝光显影工艺和刻蚀工艺，在反射镀层上形成多个开口H。
为保证反射层11的开口H和/或安装开口H3的尺寸精度，可采用补点工艺，沿开口H和/或安装开口H3的边沿喷射白色的胶水，白色的胶水的反射率应接近于反射层11的反射率。
S3：采用第一对位标记12进行对位，在反射层11远离基板10的一侧设置多个发光器件14。
示例性地，如图11C所示，第一开口H1暴露第一对位标记12，通过采集第一对位标记12的图像进行对位，在基板10上设置多个发光器件14，发光器件14位于反射层11的安装开口H3内，保证发光器件14的安装精度。
S4：设置多个支撑柱13。多个支撑柱13用于支撑多个光学膜片，使发光基板100中的反射层11与光学膜片之间具有混光距离，可改善发光基板100所产生的灯影，提高显示装置的显示画质。
示例性地，如图11D所示，至少一个支撑柱13设置在开口H处，且设置在开口H处的支撑柱13在基板10上的正投影，与相应的开口H在基板10上的正投影至少部分重叠。例如，可通过固定层15将支撑柱13粘贴在基板10上，以实现支撑柱13的固定。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (25)

  1. 一种发光基板，包括：
    基板；
    反射层，设置于所述基板上；所述反射层开设有多个开口和多个安装开口，所述多个开口包括至少一个第一开口；
    至少一个第一对位标记；第一开口内设置有第一对位标记；
    多个支撑柱，至少一个支撑柱在所述基板上的正投影，与所述开口在所述基板上的正投影至少部分重叠；
    多个发光器件，设置于所述基板上；发光器件位于所述反射层的安装开口内。
  2. 根据权利要求1所述的发光基板，其中，所述基板上设置有固定层，所述支撑柱通过所述固定层与所述基板固定连接。
  3. 根据权利要求2所述的发光基板，其中，所述多个支撑柱包括：
    至少一个第一支撑柱，包括设置于所述开口内的底座，以及位于所述底座远离所述基板一侧且与所述底座连接的第一主体部；和/或，
    至少一个第二支撑柱，包括第二主体部。
  4. 根据权利要求3所述的发光基板，其中，所述第一支撑柱在所述基板上的正投影，覆盖相应开口在所述基板上的正投影；
    所述底座远离所述第一主体部的一面为第一底面，所述底座的与所述第一主体部相连接的一面为第一顶面，所述第一主体部的与所述底座相连接的一面为第二底面；所述第二底面在所述基板上的正投影，覆盖所述第一顶面在所述基板上的正投影；
    所述底座沿所述基板的厚度方向的尺寸，小于或等于所述开口沿所述基板的厚度方向的尺寸。
  5. 根据权利要求4所述的发光基板，其中，所述第一底面位于所述固定层内；沿所述基板的厚度方向，所述第一底面位于所述反射层的靠近所述基板的一面与远离所述基板的一面之间；
    所述第二底面，与所述反射层远离所述基板一侧的表面相抵；所述第二底面在所述基板上的正投影，覆盖相应开口在所述基板上的正投影。
  6. 根据权利要求3～5中任一项所述的发光基板，其中，所述第一主体部包括沿平行于所述基板所在平面的方向的多个截面；
    至少一个截面的面积，大于或等于位于所述至少一个截面远离所述基板一侧的截面的面积。
  7. 根据权利要求6所述的发光基板，其中，沿所述基板的厚度方向，且由所述底座指向所述第一主体部的方向，所述第一主体部沿平行于所述基板所在平面的方向的截面的面积逐渐减小。
  8. 根据权利要求3～7中任一项所述的发光基板，其中，所述底座在所述基板上的正投影的形状为环形；或所述底座的形状为柱状；或所述底座包括由所述第二底面向所述基板伸出的多个凸起。
  9. 根据权利要求3所述的发光基板，其中，所述第二支撑柱靠近所述基板的一面通过所述固定层与所述基板固定连接。
  10. 根据权利要求9所述的发光基板，其中，所述第二支撑柱靠近所述基板的一面开设有至少一个凹槽，所述固定层的至少部分位于所述第二支撑柱的凹槽内。
  11. 根据权利要求10所述的发光基板，其中，所述凹槽在所述基板上的正投影的形状为圆形；或环形；或，间隔设置的多个弧形。
  12. 根据权利要求9～11中任一项所述的发光基板，其中，所述第二支撑柱包括沿平行于所述基板所在平面的方向的多个截面；
    至少一个截面的面积，大于或等于位于所述至少一个截面远离所述基板一侧的截面的面积。
  13. 根据权利要求12所述的发光基板，其中，沿所述基板的厚度方向，且由所述基板指向所述第二支撑柱的方向，所述第二支撑柱沿平行于所述基板所在平面的方向的截面的面积逐渐减小。
  14. 根据权利要求1～13中任一项所述的发光基板，其中，所述至少一个支撑柱在所述基板上的正投影的外边界，与所述开口在所述基板上的正投影的边界之间的最大间距为D1；
    所述支撑柱的安装公差为A1；
    所述开口的径向尺寸公差为A2；
    所述支撑柱的最大允许位移为A3；
    其中，A1+A2≤D1≤A3。
  15. 根据权利要求3所述的发光基板，其中，所述基板具有中间区域和位于所述中间区域四周的边缘区域；
    所述第一开口设置于所述基板的边缘区域。
  16. 根据权利要求15所述的发光基板，其中，所述中间区域无开口，所述中间区域设置有所述第二支撑柱；
    所述第二支撑柱通过所述固定层与所述反射层远离所述基板的一侧表面 固定连接。
  17. 根据权利要求15所述的发光基板，其中，所述多个开口还包括至少一个第二开口，第二开口内不设置第一对位标记；
    所述中间区域设置有所述第二开口。
  18. 根据权利要求1～17中任一项所述的发光基板，其中，所述多个开口包括多个第一开口，至少一个第一开口内还设置有第二对位标记；
    所述第二对位标记与所述反射层材料相同，且同层设置。
  19. 根据权利要求18所述的发光基板，其中，不设置第二对位标记的第一开口，相对于设置有第二对位标记的第一开口远离所述基板的中心。
  20. 根据权利要求1～19中任一项所述的发光基板，其中，所述基板包括衬底，以及设置于所述衬底上的第一导电层和/或第二导电层；
    所述第一对位标记与所述第一导电层同层设置；和/或，所述第一对位标记与所述第二导电层同层设置。
  21. 根据权利要求1～20中任一项所述的发光基板，其中，所述多个发光器件包括多组发光器件，每组包括至少两个发光器件；
    每组发光器件围绕所述支撑柱的四周均匀布置，每组发光器件中的每个发光器件与所述支撑柱的距离均大致相等。
  22. 根据权利要求21所述的发光基板，具有多个发光区；发光区设置有至少一组发光器件；
    所述支撑柱与所述基板的边界之间间隔有至少两个发光区。
  23. 根据权利要求2所述的发光基板，其中，所述固定层的颜色与所述反射层的颜色大致相同。
  24. 根据权利要求1～23中任一项所述的发光基板，还包括：
    多个反射子层；反射子层包括补偿部和凸起部；
    至少一个反射子层的补偿部设置于所述开口的内壁，凸起部设置于所述开口的边沿；和/或，
    至少一个反射子层的补偿部设置于所述安装开口的内壁，凸起部设置于所述安装开口的边沿。
  25. 一种显示装置，包括：
    显示面板；
    如权利要求1～24中任一项所述的发光基板，设置于所述显示面板的非显示侧；
    多个光学膜片，设置于所述发光基板与所述显示面板之间。
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