WO2022222258A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2022222258A1
WO2022222258A1 PCT/CN2021/100938 CN2021100938W WO2022222258A1 WO 2022222258 A1 WO2022222258 A1 WO 2022222258A1 CN 2021100938 W CN2021100938 W CN 2021100938W WO 2022222258 A1 WO2022222258 A1 WO 2022222258A1
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WO
WIPO (PCT)
Prior art keywords
light
sub
emitting
emitting device
emitting surface
Prior art date
Application number
PCT/CN2021/100938
Other languages
English (en)
French (fr)
Inventor
程希
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US17/437,431 priority Critical patent/US20240038945A1/en
Publication of WO2022222258A1 publication Critical patent/WO2022222258A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present application relates to the technical field of display panels, and in particular, to a display panel.
  • Mini-LED/Micro-LED has advantages over OLED in terms of brightness and power consumption, and has become a popular direction in the display field.
  • Mini-LED/Micro-LED is getting smaller and smaller, and the top and side of the LED can emit light.
  • the side light of the LED illuminates the adjacent LED, which is easy to cause adjacent LEDs of different colors to mix light, affecting the display effect.
  • the embodiments of the present application provide a display panel, which can avoid light mixing between adjacent light-emitting devices of different colors, and improve the display effect.
  • An embodiment of the present application provides a display panel, including a plurality of light-emitting devices distributed in an array, each light-emitting device includes an upper light-emitting surface and a side light-emitting surface for transmitting light, and the side light-emitting surface of each light-emitting device with a reflective layer;
  • the plurality of light emitting devices include a plurality of color light emitting devices, and the reflective layer on each color light emitting device is used to reflect light emitted by other color light emitting devices.
  • each light-emitting device includes at least one first sub-light-emitting surface disposed adjacent to other light-emitting devices;
  • the reflective layer is disposed on the at least one first sub-light-emitting surface of the side light-emitting surface.
  • each light-emitting device includes at least one second sub-light-emitting surface disposed adjacent to other color light-emitting devices;
  • the reflective layer is disposed on the at least one second sub-light-emitting surface of the side light-emitting surface.
  • the reflective layer includes multilayer reflective films stacked on the side light-emitting surface
  • the refractive indices of any two adjacent reflective films are different.
  • the refractive indices of the multilayer reflective films are all different.
  • the materials and thicknesses of the reflective layers and the number of layers of the reflective films on the light-emitting devices of different colors are different.
  • the material of each reflective film includes any one of silicon nitride, silicon oxide and amorphous silicon.
  • the multiple-color light-emitting devices include a first-color light-emitting device, a second-color light-emitting device, and a third-color light-emitting device;
  • the side light-emitting surface of the first color light-emitting device includes at least one third sub-light-emitting surface and at least one fourth sub-light-emitting surface;
  • the at least one third sub-light-emitting surface is arranged adjacent to the second-color light-emitting device, and the at least one fourth sub-light-emitting surface is arranged adjacent to the third-color light-emitting device.
  • the reflection layer on the first color light-emitting device includes a first sub-reflection layer and a second sub-reflection layer;
  • the first sub-reflection layer is disposed on the at least one third sub-light-emitting surface, and is used for reflecting the light emitted by the second-color light-emitting device;
  • the second sub-reflection layer is disposed on the at least one fourth sub-light-emitting surface, and is used for reflecting the light emitted by the third-color light-emitting device.
  • the first sub-reflection layer includes a plurality of first sub-reflection films superimposed on the third sub-light-emitting surface
  • the second sub-reflection layer includes a plurality of first sub-reflection films superimposed on the fourth sub-light-emitting surface. a plurality of second sub-reflection films on;
  • any two adjacent first sub-reflection films have different refractive indices, and any adjacent two second sub-reflection films have different refractive indices.
  • the refractive indices of the plurality of first sub-reflection films are all different.
  • the refractive indices of the plurality of second sub-reflection films are all different.
  • the first sub-reflection layer and the second sub-reflection layer are different in material, thickness and number of layers of sub-reflection films.
  • the display panel further includes an array substrate and a light shielding layer
  • the plurality of light-emitting devices are located on the array substrate, and the light shielding layer is located on the array substrate between any adjacent two-color light-emitting devices.
  • the material of the light shielding layer is ink.
  • the multiple color light emitting devices include red light emitting devices, blue light emitting devices and green light emitting devices.
  • a display panel includes a plurality of light-emitting devices distributed in an array, each light-emitting device includes an upper light-emitting surface and a side light-emitting surface, a reflective layer is provided on the side light-emitting surface of each light-emitting device, and the plurality of light-emitting devices It includes multiple color light-emitting devices, and the reflective layer on each color light-emitting device is used to reflect the light emitted by other color light-emitting devices, so as to avoid light mixing between adjacent light-emitting devices of different colors, thereby improving the display effect.
  • FIG. 1 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application
  • FIG. 2 is a schematic diagram of a first structure of a display panel provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of a second structure of a display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a third structure of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a first structure of a reflective layer in a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of the relationship between the wavelength and the reflectance corresponding to the reflective layer on the red light-emitting device in the display panel provided by the embodiment of the present application;
  • FIG. 7 is a schematic diagram of the relationship between the wavelength and the reflectance corresponding to the reflective layer on the green light-emitting device in the display panel according to the embodiment of the present application;
  • FIG. 8 is a schematic diagram of the relationship between the wavelength and the reflectance corresponding to the reflective layer on the blue light-emitting device in the display panel provided by the embodiment of the present application;
  • FIG. 9 is a schematic diagram of a fourth structure of a display panel provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a second structure of a reflective layer in a display panel according to an embodiment of the present application.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, “plurality” means two or more. Additionally, the term “comprising” and any variations thereof are intended to cover non-exclusive inclusion.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • an embodiment of the present application provides a display panel including an array substrate 1 and a plurality of light emitting devices 2 located on the array substrate 1 .
  • the light-emitting device 2 may be Mini-LED or Micro-LED, and the size of the light-emitting device 2 is not limited.
  • Each light-emitting device 2 includes an upper light-emitting surface 21 and a side light-emitting surface 22 for transmitting light, that is, each light-emitting device 2 can emit light through the upper light-emitting surface 21 and the side light-emitting surface 22 .
  • the upper light emitting surface 21 refers to the surface of the light emitting device 2 on the side away from the array substrate 1
  • the side light emitting surface 22 refers to the four sides of the light emitting device 2 adjacent to the upper light emitting surface 21.
  • Other surfaces other than the surfaces of the substrate 1 that are in contact with each other can be used as light-emitting surfaces to emit light.
  • a plurality of light emitting devices 2 are distributed on the array substrate 1 in an array, and the array substrate 1 may be a TFT substrate.
  • the array substrate 1 includes a plurality of thin film transistors (not shown in the figure), the plurality of thin film transistors are arranged in a one-to-one correspondence with the plurality of light emitting devices 2, and each thin film transistor and its corresponding light emitting device 2 have a connection terminal 5, such as As shown in FIG. 1 , each thin film transistor is electrically connected to its corresponding light-emitting device 2 through a connection terminal 5 , and is used to drive the corresponding light-emitting device 2 to emit light.
  • the plurality of light emitting devices 2 include a plurality of color light emitting devices, and the number of each color light emitting device is several, so as to ensure that the displayed image will not be discolored.
  • the multiple-color light-emitting devices may include red light-emitting devices R, green light-emitting devices G, and blue light-emitting devices B, that is, the plurality of light-emitting devices 2 may include at least one red light-emitting device R, at least one green light-emitting device G and at least one blue light-emitting device B.
  • the red light-emitting device R refers to a light-emitting device that can emit red light
  • the green light-emitting device G refers to a light-emitting device that can emit green light
  • the blue light-emitting device B refers to a light-emitting device that can emit blue light.
  • a reflective layer 3 is provided on the side light-emitting surface 22 of each light emitting device 2 , and the reflective layer 3 can be formed on the side light-emitting surface 22 of the light-emitting device 2 by chemical vapor deposition or other processes.
  • the reflective layers 3 on the light-emitting devices of different colors are different, and the reflective layers 3 on the light-emitting devices of each color are used to reflect the light emitted by the light-emitting devices of other colors.
  • the reflective layer 3R on the red light-emitting device R is used to reflect the light emitted by the green light-emitting device G and the blue light-emitting device B, that is, to reflect green light and blue light;
  • the reflective layer 3G on the green light-emitting device G is used for The light emitted by the red light-emitting device R and the blue light-emitting device B is reflected, that is, the red light and the blue light are reflected;
  • the reflective layer 3B on the blue light-emitting device B is used for The light is reflected, that is, red and green light is reflected.
  • the reflective layer 3 on each light-emitting device 2 completely covers the side light-emitting surface 22 of the light-emitting device 2.
  • the reflective layer 3R on the red light-emitting device R completely covers the red light-emitting device R.
  • the reflective layer 3G on the green light emitting device G completely covers the side light emitting surface 22 of the green light emitting device G
  • the reflective layer 3B on the blue light emitting device B completely covers the side light emitting surface 22 of the blue light emitting device B.
  • the reflective layer 3 on the light emitting device 2 can reflect back the light emitted by the other color light emitting devices, Avoid color mixing between the light emitting device 2 and other color light emitting devices.
  • the reflective layer 3 on each light-emitting device 2 completely covers the side light-emitting surface of the light-emitting device 2, which can ensure that the light of the light-emitting device 2 is concentrated on the upper light-emitting surface and avoids excessive dispersion of the light emitted by the light-emitting device 2.
  • the side light-emitting surface 22 of each light-emitting device 2 includes at least one first sub-light-emitting surface 23 disposed adjacent to other light-emitting devices 2 , and the reflective layer 3 is located on the at least one first sub-light-emitting surface 23 .
  • other light-emitting devices are not distributed around each light-emitting device 2.
  • the light-emitting device 2 in the edge region 10 has other light-emitting devices 2 distributed on only two or three sides, that is, the edge region 10.
  • the light-emitting device 2 in the device has only two side surfaces or three side surfaces arranged adjacent to other light-emitting devices 2 .
  • the side of the side light-emitting surface 22 of the light-emitting device 2 adjacent to other light-emitting devices 2 is used as the first sub-light-emitting surface 23, so the light-emitting device 2 in the edge area 10 has two or three first sub-light-emitting surfaces 23,
  • other light emitting devices 2 are distributed around the light emitting device 2 in the non-edge region (other regions except the edge region 10 ), so the light emitting device 2 in the non-edge region has four first sub-light-emitting surfaces 23 .
  • the light-emitting device 2 in the edge region 10 may mix colors with other light-emitting devices 2 through the first sub-light-emitting surface 23 , and the other side surfaces are not arranged adjacent to other light-emitting devices 2 , so that no color mixing occurs with other light-emitting devices 2 through these side surfaces. Therefore, the light emitting device 2 in the edge region 10 can only cover the reflective layer 3 on part of the side light emitting surface 22 , that is, only cover the reflective layer 3 on the first sub-light emitting surface 23 in the side light emitting surface 22 .
  • the reflective layer 3 on the light-emitting device 2 in the non-edge region still needs to completely cover the side light-emitting surface 22 thereof.
  • the red light-emitting device R in the upper left corner of FIG. 3 is located in the edge region 10, and the red light-emitting device R has only two light-emitting devices 2 distributed on both sides (a green light-emitting device G is distributed on the right side, and a red light-emitting device R is distributed on the front side).
  • the red light-emitting device R has only two first sub-light-emitting surfaces 23 arranged adjacent to other light-emitting devices 2 , so the reflective layer 3R on the red light-emitting device R only needs to cover the two first sub-light-emitting surfaces 23 ie Can.
  • the green light-emitting device G located on the right side of the red light-emitting device R has only three light-emitting devices 2 distributed on the three sides (a red light-emitting device R is distributed on the left side, a green light-emitting device G is distributed on the front side, and a blue light-emitting device B is distributed on the right side. ), that is, the green light-emitting device G has only three first sub-light-emitting surfaces 23 arranged adjacent to other light-emitting devices 2 , so the reflective layer 3G on the green light-emitting device G only needs to cover the three first sub-light-emitting surfaces 23 That's it.
  • the side light-emitting surface 22 of each light-emitting device 2 includes at least one second sub-light-emitting surface 24 disposed adjacent to other color light-emitting devices, and the reflective layer 3 is disposed on at least one second sub-light-emitting surface 24 on.
  • the other color light emitting devices refer to light emitting devices of different colors from the light emitting device. It is understandable that not every light emitting device 2 has other color light emitting devices distributed around it, and the side of the side light emitting surface 22 of the light emitting device 2 adjacent to other color light emitting devices is used as the second sub light emitting surface 24 . As shown in FIG.
  • the light-emitting device 2 has only one side or two sides distributed with other color light-emitting devices, that is, the light-emitting device 2 has only one side or two sides arranged adjacent to other color light-emitting devices, so the light-emitting device 2 has one or two sides.
  • a second sub-light-emitting surface 24 .
  • the light-emitting devices of different colors are distributed in different manners on the array substrate 1 , and each light-emitting device 2 has a different number of second sub-light-emitting surfaces 24 .
  • the reflective layer 3 on the light emitting device 2 may cover only part of the side light emitting surface 22 with the reflective layer 3 , that is, only cover the reflective layer 3 on the second sub-light emitting surface 24 in the side light emitting surface 22 .
  • the red light-emitting device R in the upper left corner of FIG. 4 has only one side of the red light-emitting device (a green light-emitting device G is distributed on the right), that is, the red light-emitting device R has only one light-emitting device adjacent to other color light-emitting devices.
  • There are two sub-light-emitting surfaces 24 so the reflective layer 3R on the red light-emitting device R only needs to cover the one second sub-light-emitting surface 24 .
  • the green light-emitting device G located on the right side of the red light-emitting device R only has other color light-emitting devices 2 distributed on both sides (a red light-emitting device R is distributed on the left, and a blue light-emitting device B is distributed on the right), that is, the green light-emitting device G has only two second sub-light-emitting surfaces 24 disposed adjacent to other color light-emitting devices, so the reflective layer 3G on the green light-emitting device G only needs to cover the two second sub-light-emitting surfaces 24 .
  • the wavelengths of light of different colors are different.
  • the reflective layer 3 on the light-emitting device of each color can reflect the light of the fixed wavelength band, so as to realize the light-emitting device of other colors.
  • the emitted light is reflected.
  • the reflective layer 3 on each color light-emitting device may include multilayer reflective films 31 stacked on the side light-emitting surface 22 thereof. rate is different.
  • the refractive indices of the reflective films 31 arranged at intervals may be the same, for example, the refractive indices of the first reflective film and the third reflective film in the reflective layer 3 are the same, the refractive indices of the second reflective film and the fourth reflective film are the same, The refractive index of one layer of reflective film is different from that of the second layer of reflective film; The refractive indices of the third reflective film and the fourth reflective film are different. Since the refractive index is related to the material, the materials of any two adjacent reflective films 31 in the reflective layer 3 are different, and the materials of the reflective films 31 arranged at intervals may be the same or different.
  • Each layer of reflective film 31 may include any one of semiconductor materials such as silicon nitride SiNx, silicon oxide SiOx, and amorphous silicon a-Si, for example, the reflective layer 3 may be a multi-layer reflective film structure of SiNx/SiOx/SiNx, or It can be a SiNx/a-Si/SiNx multilayer reflective film structure, etc.
  • the reflective layer 3 can also be other types of multilayer reflective film structures, as long as it can reflect light of a fixed wavelength band, which is not specifically limited here.
  • FIG. 6 is a graph showing the reflection of light of different wavelengths by the reflective layer 3R on the red light-emitting device R. It can be seen that the corresponding wavelengths of blue light and green light are relatively high in reflection, that is, the reflective layer 3R can reflect the light of different wavelengths. The light in the wavelength band of blue and green light is reflected.
  • FIG. 7 is a graph showing the reflection of light of different wavelengths by the reflective layer 3G on the green light-emitting device G.
  • FIG. 8 is a graph showing the reflection of light of different wavelengths by the reflective layer 3B on the blue light-emitting device B. It can be seen that the corresponding wavelength bands of the green light and the red light are relatively high, that is, the reflective layer 3B It can reflect light in the wavelength bands of green and red light.
  • the reflective layer 3 on the light emitting device 2 covers the side surfaces adjacent to other color light emitting devices in the side light emitting surface 22, the reflective layer 3 on the side adjacent to the different color light emitting devices can be the same, as shown in FIG. 4 and FIG. 5 . As shown, the reflective layers 3 on the sides adjacent to the light-emitting devices of different colors may also be different, as shown in FIG. 9 .
  • the multi-color light-emitting devices may be three-color light-emitting devices, and the side light-emitting surface 22 of each color light-emitting device may include a third sub-light-emitting surface 25 and a fourth sub-light-emitting surface 25 and a fourth sub-light-emitting surface respectively disposed adjacent to the other two color light-emitting devices.
  • the structure of the reflective layer 3 covered on the light-emitting surface 26 , the third sub-light-emitting surface 25 and the fourth sub-light-emitting surface 26 may be different, that is, the reflective layer 3 may include the first sub-reflective layer 32 covering the third sub-light-emitting surface 25 .
  • the first sub-reflection layer 32 is used for reflecting the light emitted by other color light-emitting devices arranged adjacent to the third sub-light-emitting surface 25
  • the second sub-reflection layer 33 is used for reflecting the light emitted by the fourth sub-light-emitting surface 26 The light emitted by other light emitting devices of another color arranged adjacently is reflected.
  • the multi-color light-emitting devices include a first-color light-emitting device, a second-color light-emitting device, and a third-color light-emitting device, wherein the first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device can respectively emit red light Device R, Green Light Emitting Device G, and Blue Light Emitting Device B.
  • the side light-emitting surface 22 of the red light-emitting device R may include at least one third sub-light-emitting surface 25 disposed adjacent to the green light-emitting device G, and at least one fourth sub-light-emitting surface 26 disposed adjacent to the blue light-emitting device B.
  • the reflection layer 3R on the red light-emitting device R includes a first sub-reflection layer 32R and a second sub-reflection layer 33R.
  • the first sub-reflection layer 32R covers at least one third sub-light-emitting surface 25 and is used to emit light to the green light-emitting device G.
  • the second sub-reflection layer 33R covers the at least one fourth sub-light-emitting surface 26 for reflecting the blue light emitted by the blue light-emitting device B.
  • the side light-emitting surface 22 of the green light-emitting device G may include at least one third sub-light-emitting surface 25 disposed adjacent to the red light-emitting device R, and at least one fourth sub-light-emitting surface 26 disposed adjacent to the blue light-emitting device B .
  • the reflection layer 3G on the green light-emitting device G includes a first sub-reflection layer 32G and a second sub-reflection layer 33G.
  • the first sub-reflection layer 32G covers at least one third sub-light-emitting surface 25 and is used to emit light to the red light-emitting device R
  • the second sub-reflection layer 33G covers the at least one fourth sub-light-emitting surface 26 for reflecting the blue light emitted by the blue light-emitting device B.
  • the side light-emitting surface 22 of the blue light-emitting device B may include at least one third sub-light-emitting surface 25 disposed adjacent to the green light-emitting device G, and at least one fourth sub-light-emitting surface 26 disposed adjacent to the red light-emitting device R.
  • the reflection layer 3B on the blue light-emitting device B includes a first sub-reflection layer 32B and a second sub-reflection layer 33B.
  • the first sub-reflection layer 32B covers at least one third sub-light-emitting surface 25 and is used for the green light-emitting device G.
  • the emitted green light is reflected
  • the second sub-reflection layer 33B covers at least one fourth sub-light-emitting surface 26 for reflecting the red light emitted by the red light-emitting device R.
  • the light-emitting device 2 can also be arranged adjacent to only one color light-emitting device, that is, the light-emitting device 2 only has the third sub-light-emitting surface 25 or the fourth sub-light-emitting surface 26, so the light-emitting device 2 can only have The first sub-reflection layer 32 or the second sub-reflection layer 33 is provided. As shown in FIG.
  • the blue light-emitting device B in the upper right corner is only arranged adjacent to the green light-emitting device G (the left and front sides are both green light-emitting devices G), that is, the blue light-emitting device B has only two third Therefore, only the first sub-reflection layer 32 may be provided on the blue light-emitting device B for reflecting the green light emitted by the adjacent green light-emitting device G.
  • the color light reflected by the first sub-reflection layer 32 and the second sub-reflection layer 33 on each color light-emitting device is different, and the wavelength bands of different colors are different. Therefore, by setting the first sub-reflection layer 32 and The material and thickness of the second sub-reflection layer 33 can enable the first sub-reflection layer 32 and the second sub-reflection layer 33 on each color light-emitting device to reflect light of a fixed wavelength band respectively.
  • the first sub-reflection layer 32 may include multiple layers of first sub-reflection films 321 stacked on the third sub-light-emitting surface 25 thereof, and multiple layers of first sub-reflection layers 32
  • the refractive indices of any two adjacent layers of the first sub-reflection films 321 are different, and the refractive indices of the first sub-reflection films 321 arranged at intervals may be the same or different. Since the refractive index is related to the material, any two adjacent first sub-reflection films 321 in the first sub-reflection layer 32 have different materials, and the materials of the first sub-reflection films 321 arranged at intervals may be the same or different.
  • Each layer of the first sub-reflection film 321 may include any one of semiconductor materials such as silicon nitride SiNx, silicon oxide SiOx and amorphous silicon a-Si, for example, the first sub-reflection layer 32 may be a multi-layer of SiNx/SiOx/SiNx
  • the first sub-reflection film structure, or the multilayer first sub-reflection film structure of SiNx/a-Si/SiNx, etc., the first sub-reflection layer 32 can also be other types of multilayer first sub-reflection film structures, As long as it can reflect light of a fixed wavelength band, it is not particularly limited here.
  • the second sub-reflection layer 33 may include multiple layers of second sub-reflection films 331 stacked on the fourth sub-light-emitting surface 26 thereof, and any two adjacent layers of the second sub-reflection films 331
  • the refractive indices are different, and the refractive indices of the second sub-reflection films 331 arranged at intervals may be the same or different. Since the refractive index is related to the material, the materials of any two adjacent second sub-reflection films 331 in the second sub-reflection layer 33 are different, and the materials of the second sub-reflection films 331 arranged at intervals may be the same or different.
  • Each layer of the second sub-reflection film 331 may include any one of semiconductor materials such as silicon nitride SiNx, silicon oxide SiOx and amorphous silicon a-Si, for example, the second sub-reflection layer 33 may be a multi-layer of SiNx/SiOx/SiNx layer second sub-reflection film structure, or can be a multi-layer second sub-reflection film structure of SiNx/a-Si/SiNx, etc., the second sub-reflection layer 33 can also be other types of multi-layer second sub-reflection film structure, As long as it can reflect light of a fixed wavelength band, it is not particularly limited here.
  • semiconductor materials such as silicon nitride SiNx, silicon oxide SiOx and amorphous silicon a-Si
  • the second sub-reflection layer 33 may be a multi-layer of SiNx/SiOx/SiNx layer second sub-reflection film structure, or can be a multi
  • the material, thickness and number of layers of the sub-reflection films of the first sub-reflection layer 32 and the second sub-reflection layer 33 may be different.
  • the material and thickness of the sub-reflection layers that reflect the same color light and the number of layers of the sub-reflection films can be the same.
  • the first sub-reflection layer 32R on the red light-emitting device R is exactly the same as the first sub-reflection layer 32B on the blue light-emitting device B, and is used for reflecting green light.
  • the second sub-reflection layer 33R on the red light-emitting device R is exactly the same as the second sub-reflection layer 33G on the green light-emitting device G, and is used for reflecting blue light.
  • the first sub-reflection layer 32G on the green light-emitting device G is exactly the same as the second sub-reflection layer 33B on the blue light-emitting device B, and is used to reflect red light.
  • the display panel further includes a light-shielding layer 4, a plurality of light-emitting devices 2 are distributed on the array substrate 1 at intervals, and the light-shielding layer 4 is located on the array substrate 1 between any adjacent two-color light-emitting devices, as shown in FIG. 1 . .
  • the light-shielding layer 4 may also be located on any area on the array substrate 1 except for the connection end where the light-emitting device 2 is electrically connected to the array substrate 1 .
  • the light shielding layer 4 may be a black light absorbing material, for example, the light shielding layer 4 may be ink or the like.
  • the plurality of light-emitting devices 2 distributed on the array substrate 1 can also be arranged without spacing, that is, the plurality of light-emitting devices 2 are attached and arranged, so as to ensure the difference between adjacent ones.
  • the occupied space of the plurality of light emitting devices 2 is reduced while the color light emitting devices do not mix light.
  • the display panel includes a plurality of light-emitting devices 2 distributed in an array, each light-emitting device 2 includes an upper light-emitting surface 21 and a side light-emitting surface 22, and the side light-emitting surface of each light-emitting device 2 is provided with a reflection Layer 3, the plurality of light-emitting devices 2 include a plurality of color light-emitting devices, and the reflective layer 3 on each color light-emitting device is used to reflect the light emitted by other color light-emitting devices, so as to avoid adjacent light-emitting devices of different colors. Mixing light to improve the display effect.

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Abstract

一种显示面板。显示面板包括呈阵列分布的多个发光器件（2），每个发光器件（2）包括用于透射光的上出光面（21）和侧出光面（22），每个发光器件（2）的侧出光面（22）上设有反射层（3）；多个发光器件（2）包括多种颜色发光器件，每种颜色发光器件上的反射层（3）用于对其他颜色发光器件发出的光进行反射。

Description

显示面板 技术领域
本申请涉及显示面板技术领域，尤其涉及一种显示面板。
 背景技术
随着显示装置对画质的要求越来越高，提升显示画质成为显示装置的一个新需求。而Mini-LED/Micro-LED作为一个全新的显示技术，在亮度、功耗上较OLED有优势，目前成为显示领域的一个热门方向。
但是，Mini-LED/Micro-LED的芯片越做越小，而LED的上方和侧面都可以出光，LED侧面光照射到相邻的LED处，容易造成相邻的不同种颜色LED混光，影响显示效果。
 技术问题
本申请实施例提供一种显示面板，能够避免相邻的不同种颜色发光器件之间混光，提高显示效果。
 技术解决方案
本申请实施例提供了一种显示面板，包括呈阵列分布的多个发光器件，每个发光器件包括用于透射光的上出光面和侧出光面，所述每个发光器件的侧出光面上设有反射层；
所述多个发光器件包括多种颜色发光器件，每种颜色发光器件上的反射层用于对其他颜色发光器件发出的光进行反射。
可选地，所述每个发光器件的侧出光面包括与其他发光器件相邻设置的至少一个第一子出光面；
所述反射层设于所述侧出光面的所述至少一个第一子出光面上。
可选地，所述每个发光器件的侧出光面包括与其他颜色发光器件相邻设置的至少一个第二子出光面；
所述反射层设于所述侧出光面的所述至少一个第二子出光面上。
可选地，所述反射层包括层叠设置在所述侧出光面上的多层反射膜；
任意相邻的两层反射膜的折射率不同。
可选地，所述多层反射膜的折射率均不相同。
可选地，不同种颜色发光器件上的反射层的材料、厚度和反射膜的层数不同。
可选地，每层反射膜的材料包括氮化硅、氧化硅和非晶硅中的任意一种。
可选地，所述多种颜色发光器件包括第一颜色发光器件、第二颜色发光器件和第三颜色发光器件；
所述第一颜色发光器件的侧出光面包括至少一个第三子出光面和至少一个第四子出光面；
所述至少一个第三子出光面与所述第二颜色发光器件相邻设置，所述至少一个第四子出光面与所述第三颜色发光器件相邻设置。
可选地，所述第一颜色发光器件上的反射层包括第一子反射层和第二子反射层；
所述第一子反射层设于所述至少一个第三子出光面上，用于对所述第二颜色发光器件发出的光进行反射；
所述第二子反射层设于所述至少一个第四子出光面上，用于对所述第三颜色发光器件发出的光进行反射。
可选地，所述第一子反射层包括叠加设置在所述第三子出光面上的多个第一子反射膜，所述第二子反射层包括叠加设置在所述第四子出光面上的多个第二子反射膜；
任意相邻的两个第一子反射膜的折射率不同，任意相邻的两个第二子反射膜的折射率不同。
可选地，所述多个第一子反射膜的折射率均不相同。
可选地，所述多个第二子反射膜的折射率均不相同。
可选地，所述第一子反射层与所述第二子反射层的材料、厚度和子反射膜的层数不同。
可选地，所述显示面板还包括阵列基板和遮光层；
所述多个发光器件位于所述阵列基板上，所述遮光层位于任意相邻的两种颜色发光器件之间的阵列基板上。
可选地，所述遮光层的材料为油墨。
可选地，所述多种颜色发光器件包括红色发光器件、蓝色发光器件和绿色发光器件。
 有益效果
本申请的有益效果为：显示面板包括呈阵列分布的多个发光器件，每个发光器件包括上出光面和侧出光面，每个发光器件的侧出光面上设有反射层，多个发光器件包括多种颜色发光器件，每种颜色发光器件上的反射层用于对其他颜色发光器件发出的光进行反射，以避免相邻的不同种颜色发光器件之间混光，从而提高显示效果。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的显示面板的截面示意图；
图2为本申请实施例提供的显示面板的第一种结构示意图；
图3为本申请实施例提供的显示面板的第二种结构示意图；
图4为本申请实施例提供的显示面板的第三种结构示意图；
图5为本申请实施例提供的显示面板中反射层的第一种结构示意图；
图6为本申请实施例提供的显示面板中红色发光器件上反射层对应的波长与反射比的关系示意图；
图7为本申请实施例提供的显示面板中绿色发光器件上反射层对应的波长与反射比的关系示意图；
图8为本申请实施例提供的显示面板中蓝色发光器件上反射层对应的波长与反射比的关系示意图；
图9为本申请实施例提供的显示面板的第四种结构示意图；
图10为本申请实施例提供的显示面板中反射层的第二种结构示意图。
 本发明的实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用于描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面结合附图和实施例对本申请作进一步说明。
如图1所示，本申请实施例提供了一种显示面板，包括阵列基板1以及位于阵列基板1上的多个发光器件2。其中，发光器件2可以为Mini-LED或Micro-LED，发光器件2的尺寸不限。每个发光器件2包括用于透射光的上出光面21和侧出光面22，即每个发光器件2可以通过上出光面21和侧出光面22出光。上出光面21是指发光器件2远离阵列基板1一侧的表面，侧出光面22是指发光器件2上与上出光面21相邻的四个侧面，也就是说，发光器件2除了与阵列基板1相接触的表面外其他表面都可以作为出光面出光。
多个发光器件2呈阵列分布在阵列基板1上，阵列基板1可以是TFT基板。阵列基板1包括多个薄膜晶体管（图中未示出），多个薄膜晶体管与多个发光器件2一一对应设置，且每个薄膜晶体管与其对应的发光器件2之间具有连接端5，如图1所示，每个薄膜晶体管通过连接端5与其对应的发光器件2电性连接，用于驱动对应的发光器件2发光。
多个发光器件2包括多种颜色发光器件，且每种颜色发光器件的数量若干，以保证显示的图像不会偏色。如图2所示，多种颜色发光器件可以包括红色发光器件R、绿色发光器件G和蓝色发光器件B，即多个发光器件2可以包括至少一个红色发光器件R、至少一个绿色发光器件G和至少一个蓝色发光器件B。其中，红色发光器件R是指可以发出红光的发光器件，绿色发光器件G是指可以发出绿光的发光器件，蓝色发光器件B是指可以发出蓝光的发光器件。
由于不同种颜色发光器件混合分布在阵列基板1上，且每个发光器件可以通过侧出光面出光，容易导致相邻的不同种颜色发光器件之间混光。因此，本申请实施例在每个发光器件2的侧出光面22上设置反射层3，反射层3可以通过化学气相沉积等工艺形成于发光器件2的侧出光面22上。不同种颜色发光器件上的反射层3不同，每种颜色发光器件上的反射层3用于对其他颜色发光器件发出的光进行反射。
例如，红色发光器件R上的反射层3R用于对绿色发光器件G和蓝色发光器件B发出的光进行反射，即对绿光和蓝光进行反射；绿色发光器件G上的反射层3G用于对红色发光器件R和蓝色发光器件B发出的光进行反射，即对红光和蓝光进行反射；蓝色发光器件B上的反射层3B用于对红色发光器件R和绿色发光器件G发出的光进行反射，即对红光和绿光进行反射。
在一个实施方式中，每个发光器件2上的反射层3完全覆盖该发光器件2的侧出光面22，如图2所示，红色发光器件R上的反射层3R完全覆盖红色发光器件R的侧出光面22，绿色发光器件G上的反射层3G完全覆盖绿色发光器件G的侧出光面22，蓝色发光器件B上的反射层3B完全覆盖蓝色发光器件B的侧出光面22。在这种情况下，针对每个发光器件2，无论其他颜色发光器件位于该发光器件2的哪一侧，该发光器件2上的反射层3都可以将其他颜色发光器件发出的光反射回去，避免该发光器件2与其他颜色发光器件之间混色。另外，每个发光器件2上的反射层3完全覆盖该发光器件2的侧出光面，可以保证该发光器件2的光集中于上出光面发出，避免发光器件2发出的光过于分散。
在另一个实施方式中，每个发光器件2的侧出光面22包括与其他发光器件2相邻设置的至少一个第一子出光面23，反射层3位于至少一个第一子出光面23上。可以理解的，并非每个发光器件2的四周都分布有其他发光器件，如图3所示，边缘区10中的发光器件2只有两侧或三侧分布有其他发光器件2，即边缘区10中的发光器件2只有两个侧面或三个侧面与其他发光器件2相邻设置。将发光器件2的侧出光面22中与其他发光器件2相邻设置的侧面作为第一子出光面23，因此边缘区10中的发光器件2具有两个或三个第一子出光面23，而非边缘区（除边缘区10之外的其他区域）中的发光器件2四周都分布有其他发光器件2，因此非边缘区中的发光器件2具有四个第一子出光面23。
由于边缘区10中的发光器件2的第一子出光面23与其他发光器件2相邻设置，因此边缘区10中的发光器件2可能会通过第一子出光面23与其他发光器件2发生混色，而其他侧面未与其他发光器件2相邻设置，不会通过这些侧面与其他发光器件2发生混色。因此边缘区10中的发光器件2可以仅在部分侧出光面22上覆盖反射层3，即仅在侧出光面22中的第一子出光面23上覆盖反射层3即可。由于非边缘区中的发光器件2的四个侧面均为第一子出光面23，因此非边缘区中的发光器件2上的反射层3仍需完全覆盖其侧出光面22。
例如，图3中左上角的红色发光器件R位于边缘区10中，该红色发光器件R只有两侧分布有发光器件2（右侧分布一个绿色发光器件G，前侧分布一个红色发光器件R），即该红色发光器件R只有两个与其他发光器件2相邻设置的第一子出光面23，因此该红色发光器件R上的反射层3R只需要覆盖这两个第一子出光面23即可。而位于该红色发光器R右侧的绿色发光器件G只有三侧分布有发光器件2（左侧分布一个红色发光器件R，前侧分布一个绿色发光器件G，右侧分布一个蓝色发光器件B），即该绿色发光器件G只有三个与其他发光器件2相邻设置的第一子出光面23，因此该绿色发光器件G上的反射层3G 只需要覆盖这三个第一子出光面23即可。
在又一个实施方式中，每个发光器件2的侧出光面22包括与其他颜色发光器件相邻设置的至少一个第二子出光面24，所述反射层3设于至少一个第二子出光面24上。针对每个发光器件2，其他颜色发光器件是指与该发光器件颜色不同的发光器件。可以理解的，并非每个发光器件2的四周都分布有其他颜色发光器件，将发光器件2的侧出光面22中与其他颜色发光器件相邻设置的侧面作为第二子出光面24。如图4所示，发光器件2只有一侧或两侧分布有其他颜色发光器件，即发光器件2只有一个侧面或两个侧面与其他颜色发光器件相邻设置，因此发光器件2具有一个或两个第二子出光面24。不同颜色发光器件在阵列基板1上的分布方式不同，每个发光器件2具有的第二子出光面24的个数不同。
由于发光器件2的第二子出光面24与其他颜色发光器件相邻设置，因此发光器件2会通过第二子出光面24与其他颜色发光器件发生混色，而其他侧面未与其他颜色发光器件相邻设置，不会通过这些侧面与其他颜色发光器件发生混色。因此发光器件2上的反射层3可以仅在部分侧出光面22上覆盖反射层3，即仅在侧出光面22中的第二子出光面24上覆盖反射层3即可。
例如，图4中左上角的红色发光器件R只有一侧分布有其他颜色发光器件（右侧分布一个绿色发光器件G），即该红色发光器件R只有一个与其他颜色发光器件相邻设置的第二子出光面24，因此该红色发光器件R上的反射层3R只需要覆盖这一个第二子出光面24即可。而位于该红色发光器件R右侧的绿色发光器件G只有两侧分布有其他颜色发光器件2（左侧分布一个红色发光器件R，右侧分布一个蓝色发光器件B），即该绿色发光器件G只有两个与其他颜色发光器件相邻设置的第二子出光面24，因此该绿色发光器件G上的反射层3G  只需要覆盖这两个第二子出光面24即可。
不同颜色光的波段不同，通过设置每种颜色发光器件上反射层3的材料和厚度，可以使每种颜色发光器件上的反射层3对固定波段的光进行反射，从而实现对其他颜色发光器件发出的光进行反射。如图5所示，每种颜色发光器件上的反射层3可以包括层叠设置在其侧出光面22上的多层反射膜31，多层反射膜31中任意相邻两层反射膜31的折射率不同。间隔设置的反射膜31的折射率可以相同，例如反射层3中第一层反射膜与第三层反射膜的折射率相同，第二层反射膜与第四层反射膜的折射率相同，第一层反射膜与第二层反射膜的折射率不同；或者，反射层3中多层反射膜31的折射率各不相同，例如反射层3中第一层反射膜、第二层反射膜、第三层反射膜和第四层反射膜的折射率均不相同。由于折射率与材料相关，因此反射层3中任意相邻两层反射膜31的材料不同，间隔设置的反射膜31的材料可以相同，也可以不同。每层反射膜31可以包括氮化硅SiNx、氧化硅SiOx和非晶硅a-Si等半导体材料中的任意一种，例如反射层3可以为SiNx/SiOx/SiNx的多层反射膜结构，或者可以为SiNx/a-Si/SiNx的多层反射膜结构等，反射层3还可以为其他类型的多层反射膜结构，只要能够反射固定波段的光即可，在此不做具体限定。
不同颜色发光器件上的反射层3的材料、厚度和反射膜的层数可以不同，同一种颜色发光器件上的反射层3的材料、厚度和反射膜的层数可以相同。参见图6，图6是红色发光器件R上的反射层3R对不同波长的光进行反射的曲线关系图，可以看出，蓝光和绿光所在波段对应的反射比较高，即反射层3R可以对蓝光和绿光所在波段的光进行反射。参见图7，图7是绿色发光器件G上的反射层3G对不同波长的光进行反射的曲线关系图，可以看出，蓝光和红光所在波段对应的反射比较高，即反射层3G可以对蓝光和红光所在波段的光进行反射。参见图8，图8是蓝色发光器件B上的反射层3B对不同波长的光进行反射的曲线关系图，可以看出，绿光和红光所在波段对应的反射比较高，即反射层3B可以对绿光和红光所在波段的光进行反射。
在发光器件2上的反射层3覆盖其侧出光面22中与其他颜色发光器件相邻的侧面时，与不同颜色发光器件相邻的侧面上的反射层3可以相同，如图4和图5所示，与不同颜色发光器件相邻的侧面上的反射层3也可以不同，如图9所示。
例如，多种颜色发光器件可以为三种颜色发光器件，每种颜色发光器件的侧出光面22可以包括分别与其他两种颜色发光器件对应相邻设置的第三子出光面25和第四子出光面26，第三子出光面25和第四子出光面26上覆盖的反射层3的结构可以不同，即反射层3可以包括覆盖在第三子出光面25上的第一子反射层32以及覆盖在第四子出光面26上的第二子反射层33。其中，第一子反射层32用于对与第三子出光面25相邻设置的其他一种颜色发光器件发出的光进行反射，第二子反射层33用于对与第四子出光面26相邻设置的其他另一种颜色发光器件发出的光进行反射。
具体地，多种颜色发光器件包括第一颜色发光器件、第二颜色发光器件和第三颜色发光器件，其中第一颜色发光器件、第二颜色发光器件和第三颜色发光器件可以分别为红色发光器件R、绿色发光器件G和蓝色发光器件B。
红色发光器件R的侧出光面22可以包括与绿色发光器件G相邻设置的至少一个第三子出光面25，以及与蓝色发光器件B相邻设置的至少一个第四子出光面26。红色发光器件R上的反射层3R包括第一子反射层32R和第二子反射层33R，第一子反射层32R覆盖在至少一个第三子出光面25上，用于对绿色发光器件G发出的绿光进行反射，第二子反射层33R覆盖在至少一个第四子出光面26上，用于对蓝色发光器件B发出的蓝光进行反射。
同样，绿色发光器件G的侧出光面22可以包括与红色发光器件R相邻设置的至少一个第三子出光面25，以及与蓝色发光器件B相邻设置的至少一个第四子出光面26。绿色发光器件G上的反射层3G包括第一子反射层32G和第二子反射层33G，第一子反射层32G覆盖在至少一个第三子出光面25上，用于对红色发光器件R发出的红光进行反射，第二子反射层33G覆盖在至少一个第四子出光面26上，用于对蓝色发光器件B发出的蓝光进行反射。
蓝色发光器件B的侧出光面22可以包括与绿色发光器件G相邻设置的至少一个第三子出光面25，以及与红色发光器件R相邻设置的至少一个第四子出光面26。蓝色发光器件B上的反射层3B包括第一子反射层32B和第二子反射层33B，第一子反射层32B覆盖在至少一个第三子出光面25上，用于对绿色发光器件G发出的绿光进行反射，第二子反射层33B覆盖在至少一个第四子出光面26上，用于对红色发光器件R发出的红光进行反射。
需要说明的是，发光器件2也可以仅与一种颜色发光器件相邻设置，即该发光器件2只具有第三子出光面25或第四子出光面26，因此该发光器件2上可以仅设置第一子反射层32或第二子反射层33。如图9所示，右上角的蓝色发光器件B仅与绿色发光器件G（左侧和前侧均为绿色发光器件G）相邻设置，即该蓝色发光器件B仅具有两个第三子出光面25，因此该蓝色发光器件B上可以仅设置第一子反射层32，用于对其相邻的绿色发光器件G发出的绿光进行反射。
每种颜色发光器件上的第一子反射层32和第二子反射层33反射的颜色光不同，而不同颜色光的波段不同，因此通过设置每种颜色发光器件上第一子反射层32和第二子反射层33的材料和厚度，可以使每种颜色发光器件上的第一子反射层32和第二子反射层33分别对固定波段的光进行反射。
如图10所示，针对每种颜色发光器件，第一子反射层32可以包括层叠设置在其第三子出光面25上的多层第一子反射膜321，多层第一子反射层32中任意相邻两层第一子反射膜321的折射率不同，间隔设置的第一子反射膜321的折射率可以相同，也可以不同。由于折射率与材料相关，因此第一子反射层32中任意相邻两层第一子反射膜321的材料不同，间隔设置的第一子反射膜321的材料可以相同，也可以不同。每层第一子反射膜321可以包括氮化硅SiNx、氧化硅SiOx和非晶硅a-Si等半导体材料中的任意一种，例如第一子反射层32可以为SiNx/SiOx/SiNx的多层第一子反射膜结构，或者可以为SiNx/a-Si/SiNx的多层第一子反射膜结构等，第一子反射层32还可以为其他类型的多层第一子反射膜结构，只要能够反射固定波段的光即可，在此不做具体限定。
第二子反射层33可以包括层叠设置在其第四子出光面26上的多层第二子反射膜331，多层第二子反射层33中任意相邻两层第二子反射膜331的折射率不同，间隔设置的第二子反射膜331的折射率可以相同，也可以不同。由于折射率与材料相关，因此第二子反射层33中任意相邻两层第二子反射膜331的材料不同，间隔设置的第二子反射膜331的材料可以相同，也可以不同。每层第二子反射膜331可以包括氮化硅SiNx、氧化硅SiOx和非晶硅a-Si等半导体材料中的任意一种，例如第二子反射层33可以为SiNx/SiOx/SiNx的多层第二子反射膜结构，或者可以为SiNx/a-Si/SiNx的多层第二子反射膜结构等，第二子反射层33还可以为其他类型的多层第二子反射膜结构，只要能够反射固定波段的光即可，在此不做具体限定。
针对每种颜色发光器件，第一子反射层32和第二子反射层33的材料、厚度和子反射膜的层数可以不同。针对不同种颜色发光器件，反射相同颜色光的子反射层的材料、厚度和子反射膜的层数可以相同。如图9所示，红色发光器件R上的第一子反射层32R与蓝色发光器件B上的第一子反射层32B完全相同，用于对绿光进行反射。红色发光器件R上的第二子反射层33R与绿色发光器件G上的第二子反射层33G完全相同，用于对蓝光进行反射。绿色发光器件G上的第一子反射层32G与蓝色发光器件B上的第二子反射层33B完全相同，用于对红光进行反射。
进一步地，显示面板还包括遮光层4，多个发光器件2间隔分布在阵列基板1上，遮光层4位于任意相邻的两种颜色发光器件之间的阵列基板1上，如图1所示。遮光层4也可以位于阵列基板1上除了发光器件2与阵列基板1电性连接的连接端之外的任何区域。通过设置遮光层4，可以进一步避免相邻的不同颜色发光器件之间混光，提高显示效果。其中，遮光层4可以为黑色吸光材料，例如遮光层4可以为油墨等。
需要说明的是，在工艺制程能够实现的情况下，阵列基板1上分布的多个发光器件2之间也可以无间距设置，即多个发光器件2贴合设置，以在保证相邻的不同颜色发光器件不会发生混光的同时，减小多个发光器件2的占用空间。
综上，本申请实施例中显示面板包括呈阵列分布的多个发光器件2，每个发光器件2包括上出光面21和侧出光面22，每个发光器件2的侧出光面上设有反射层3，多个发光器件2包括多种颜色发光器件，每种颜色发光器件上的反射层3用于对其他颜色发光器件发出的光进行反射，以避免相邻的不同种颜色发光器件之间混光，从而提高显示效果。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (16)

  1. 一种显示面板，其中，包括呈阵列分布的多个发光器件，每个发光器件包括用于透射光的上出光面和侧出光面，所述每个发光器件的侧出光面上设有反射层；
    所述多个发光器件包括多种颜色发光器件，每种颜色发光器件上的反射层用于对其他颜色发光器件发出的光进行反射。
  2. 如权利要求1所述的显示面板，其中，所述每个发光器件的侧出光面包括与其他发光器件相邻设置的至少一个第一子出光面；
    所述反射层设于所述侧出光面的所述至少一个第一子出光面上。
  3. 如权利要求1所述的显示面板，其中，所述每个发光器件的侧出光面包括与其他颜色发光器件相邻设置的至少一个第二子出光面；
    所述反射层设于所述侧出光面的所述至少一个第二子出光面上。
  4. 如权利要求1所述的显示面板，其中，所述反射层包括层叠设置在所述侧出光面上的多层反射膜；
    任意相邻的两层反射膜的折射率不同。
  5. 如权利要求4所述的显示面板，其中，所述多层反射膜的折射率均不相同。
  6. 如权利要求4所述的显示面板，其中，不同种颜色发光器件上的反射层的材料、厚度和反射膜的层数不同。
  7. 如权利要求4所述的显示面板，其中，每层反射膜的材料包括氮化硅、氧化硅和非晶硅中的任意一种。
  8. 如权利要求1所述的显示面板，其中，所述多种颜色发光器件包括第一颜色发光器件、第二颜色发光器件和第三颜色发光器件；
    所述第一颜色发光器件的侧出光面包括至少一个第三子出光面和至少一个第四子出光面；
    所述至少一个第三子出光面与所述第二颜色发光器件相邻设置，所述至少一个第四子出光面与所述第三颜色发光器件相邻设置。
  9. 如权利要求8所述的显示面板，其中，所述第一颜色发光器件上的反射层包括第一子反射层和第二子反射层；
    所述第一子反射层设于所述至少一个第三子出光面上，用于对所述第二颜色发光器件发出的光进行反射；
    所述第二子反射层设于所述至少一个第四子出光面上，用于对所述第三颜色发光器件发出的光进行反射。
  10. 如权利要求9所述的显示面板，其中，所述第一子反射层包括叠加设置在所述第三子出光面上的多个第一子反射膜，所述第二子反射层包括叠加设置在所述第四子出光面上的多个第二子反射膜；
    任意相邻的两个第一子反射膜的折射率不同，任意相邻的两个第二子反射膜的折射率不同。
  11. 如权利要求10所述的显示面板，其中，所述多个第一子反射膜的折射率均不相同。
  12. 如权利要求10所述的显示面板，其中，所述多个第二子反射膜的折射率均不相同。
  13. 如权利要求10所述的显示面板，其中，所述第一子反射层与所述第二子反射层的材料、厚度和子反射膜的层数不同。
  14. 如权利要求1所述的显示面板，其中，所述显示面板还包括阵列基板和遮光层；
    所述多个发光器件位于所述阵列基板上，所述遮光层位于任意相邻的两种颜色发光器件之间的阵列基板上。
  15. 如权利要求14所述的显示面板，其中，所述遮光层的材料为油墨。
  16. 如权利要求1所述的显示面板，其中，所述多种颜色发光器件包括红色发光器件、蓝色发光器件和绿色发光器件。
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