WO2022198902A1 - 采集装置、采集***及采集方法 - Google Patents

采集装置、采集***及采集方法 Download PDF

Info

Publication number
WO2022198902A1
WO2022198902A1 PCT/CN2021/113304 CN2021113304W WO2022198902A1 WO 2022198902 A1 WO2022198902 A1 WO 2022198902A1 CN 2021113304 W CN2021113304 W CN 2021113304W WO 2022198902 A1 WO2022198902 A1 WO 2022198902A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
photographing
chip tray
control command
assembly
Prior art date
Application number
PCT/CN2021/113304
Other languages
English (en)
French (fr)
Inventor
陈予郎
陈庆峰
Original Assignee
长鑫存储技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 长鑫存储技术有限公司 filed Critical 长鑫存储技术有限公司
Priority to US17/648,150 priority Critical patent/US20220309646A1/en
Publication of WO2022198902A1 publication Critical patent/WO2022198902A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application relates to the field of semiconductor testing, and in particular, to a collection device, a collection system and a collection method.
  • the calibration and identification of the chip on the chip tray are mainly obtained by obtaining the code of the chip, and the code of the chip needs to be collected by an expensive laser camera.
  • the image shooting range of the laser camera is small, and a single acquisition cannot Get the codes for all chips in the chip tray.
  • the chips on the chip tray are mainly collected by manual control of the laser camera, and the number of chips on the chip tray is large. Obtaining the codes of all the chips in the chip tray requires controlling the laser camera to shoot multiple times, which consumes a lot of detection time. , which is not conducive to the mass production of chips, and the manual operation is prone to problems such as missing chip collection, repeated collection, and wrong position sequence collection.
  • An embodiment of the present application provides a collection device, comprising: a base and a core tray disposed on the base, the core tray is used to carry a chip tray; a first support part, the first support part is disposed on the base and connected with a first support Shooting assembly, the first shooting assembly is arranged above the core plate; the second support part, the second support part is set on the base and is connected with the second shooting assembly, the second shooting assembly is arranged above the core plate; the first shooting assembly uses For taking an image of the first area of the chip tray, the second photographing component is used for taking an image of the second area of the chip tray, and the sum of the first area and the second area covers the entire area of the chip tray.
  • the embodiment of the present application also provides an acquisition system, including: the above-mentioned acquisition device, and a control converter, a storage database, an interactive server and a terminal;
  • the acquisition device is used to acquire an image of a chip tray;
  • the control converter is communicatively connected to the acquisition device, It is used to set configuration information for the acquisition device according to the control command, and is also used to obtain the image of the chip tray, obtain the data information in the image of the chip tray, and upload the data information to the storage database;
  • the storage database is connected to the control converter in communication, based on the The control command performs data update, and sends the control command to the control converter, and is also used for storing data information;
  • the interactive server is connected to the storage database in communication, and is used for uploading the received control command to the storage database, and is also used for according to the control command.
  • the terminal is connected to the interactive server in communication, and is used to issue control commands to the interactive server according to the operator's instructions, and is also used to display the data issued by the interactive server. information.
  • the embodiment of the present application also provides a collection method, including: the terminal receives an operator's instruction, and based on the operator's instruction, sends a control command to the interactive server; the interactive server uploads the received control command to a storage database; the storage database is based on the control command Update the data and send the control command to the control converter; the control converter sets configuration information for the acquisition device according to the control command; the acquisition device acquires the image of the chip tray according to the configuration information; the control converter acquires the data in the image of the chip tray information, and upload the data information to the storage database; the storage database stores the data information; the interactive server searches for the corresponding data information in the storage database according to the control command, and sends the data information to the terminal; the terminal displays the data information issued by the interactive server .
  • FIG. 1 is a schematic structural diagram of a collection device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a shooting area of a first camera assembly and a second camera assembly in a collection device provided by an embodiment of the present application;
  • FIG. 3 is a schematic diagram of the principle of a collection device provided by an embodiment of the present application.
  • FIG. 4 is another schematic structural diagram of a collection device provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a collection system provided by another embodiment of the present application.
  • FIG. 6 is a schematic flowchart of a collection method provided by another embodiment of the present application.
  • the chips on the chip tray are mainly collected by manual control of the laser camera, and the number of chips on the chip tray is large. Obtaining the codes of all the chips in the chip tray requires controlling the laser camera to shoot multiple times, which consumes a lot of detection time. , which is not conducive to the mass production of chips, and the manual operation is prone to problems such as missing chip collection, repeated collection, and wrong position sequence collection.
  • An embodiment of the present application provides a collection device, including: a base and a core tray disposed on the base, the core tray is used to carry a chip tray; a first support part, the first support part is disposed on the base and connected with a first support part a photographing assembly, the first photographing assembly is arranged above the core plate; the second supporting part, the second supporting part is disposed on the base and is connected with a second photographing assembly, the second photographing assembly is disposed above the core plate; the first photographing assembly
  • the second photographing component is used for photographing the image of the first area of the chip tray, and the second photographing component is used for photographing the image of the second area of the chip tray, and the sum of the first area and the second area covers the entire area of the chip tray.
  • FIG. 1 and FIG. 4 are schematic structural diagrams of a collection device provided in this embodiment
  • FIG. 2 is a schematic diagram of a shooting area of a first camera assembly and a second camera assembly in the collection device provided by this embodiment
  • FIG. 3 is provided in this embodiment.
  • the collection device provided in this embodiment is further described in detail below with reference to the accompanying drawings, and the details are as follows:
  • the collection device includes a base 101, and a core tray 102 disposed on the base 101.
  • the core tray 102 is used to carry a chip tray (not shown), and chips are placed in the chip tray (not shown). Has the code for the calibration and identification of the chip.
  • the length, width and height of the chip tray (not shown) conform to the specifications specified by JEDEC; specifically, the number of chips placed in the chip tray (not shown) is determined by the number of chips in the length direction.
  • the number of chips in the X width direction indicates that the number of chips that can be placed in a current standard chip tray (not shown) is 19X11 and 17X8.
  • the core tray 102 is a rectangular parallelepiped in the same shape as the chip tray (not shown), so as to ensure that there is no suspended portion after the chip tray (not shown) is placed on the core tray 102 .
  • the shape of the core disk may be any shape, and this embodiment does not constitute a limitation on the shape of the core disk. Those skilled in the art should understand that no matter what shape the core disk 102 adopts, if the core disk 102 The purpose is to stably carry the chip tray (not shown), which should belong to the protection scope of this application.
  • the core tray 102 is fixed on the base 101 .
  • the core disc 102 may be fixed on the base 101 by adhering the contact surfaces of the core disc 102 and the base 101 .
  • the collection device further includes a positioning assembly (not shown), and the positioning assembly (not shown) is fixed on the base 101 and used to fix the core disk 102 placed on the base 101 .
  • the core disk 102 placed on the base 101 is fixed by the positioning assembly (not shown) fixed on the base 101 , which facilitates the disassembly and assembly of the collection device on the basis of ensuring the stability of the core disk 102 .
  • the positioning assembly (not shown) includes two L-shaped positioning portions 106 arranged opposite to each other.
  • the core disk 102 is rectangular, and the positioning portions 106 fit against the opposite sides of the core disk 102 . two corners to fix the core disc 102 .
  • the core disk can be set in any shape, and the shape of the positioning portion is set to fit the edge or corner of the core disk, so that the core disk can be fixed by the positioning portion.
  • the height of the positioning portion 106 is not higher than the height of the core tray 102 to prevent the chip tray (not shown) from being partially prevented on the positioning portion 106 so that the chip tray (not shown) is not placed flat.
  • the base 101 further includes a plurality of discrete slots (not shown), and the bottom of the positioning portion 106 is also provided with a plug (not shown) that fits with the slots.
  • the collection device is suitable for different sizes of core disks 102 and the fixed position of the core disk 102 provides various options.
  • the collection device further includes: a first support part 103 and a second support part 133 ; wherein, the first support part 103 is arranged on the base 101 and is connected with a first photographing component 113 , and the first photographing component 113 is arranged above the core disk 102 ;
  • the second support portion 133 is arranged on the base 101 and is connected with a second photographing component 143 , and the second photographing component 143 is arranged above the core plate 103 .
  • the first photographing component 113 and the second photographing component 143 are used for photographing an image of the chip tray (not shown) placed on the core tray 102, and subsequently placing chips in the chip tray through the captured image of the chip tray (not shown). code for identification.
  • the first photographing component 113 is used to photograph the image of the first area of the chip tray (not shown)
  • the second photographing component is used to photograph the image of the second area of the chip tray (not shown)
  • the first area and The sum of the second areas covers the entire area of the chip tray (not shown).
  • the first region includes a first subregion 112 and a third subregion 132
  • the second region includes a second subregion 122 and a fourth subregion 142; wherein the first subregion 112 and the second subregion 122 are : in the length direction of the core disk 102, two regions that bisect the core disk 102, the third sub-region 132 is a part of the second sub-region 122 close to the first sub-region 112, and the fourth sub-region 142 is close to the second sub-region Part of the first sub-region 112 of 122 .
  • the first photographing assembly 113 and the second photographing assembly 143 are respectively located above the intersections of the two bisectors in the length direction of the core plate 102 and the vertical bisectors in the width direction of the core plate 102 .
  • the first photographing component 113 and the second photographing component 143 symmetrically above the intersection of the vertical bisectors of the two trisectors, it is ensured that the sum of the images obtained by the first photographing component 113 and the second photographing component 143 covers the core disk 102 of the entire area.
  • the collecting device further includes: a support rod 233 , the support rod 233 is disposed on the base 101 , the first support part 103 includes a first support arm 213 , and the first support arm 213 is self-supporting rod 233 along the first support arm 213 .
  • the second support portion 133 includes a second support arm 223, which extends from the support rod 223 in a second direction and is connected to the second shooting assembly 143; wherein the first direction The included angle with the second direction is greater than 0° and less than 180°.
  • the first support arm 213 and the second support arm 223 can also be rotatably arranged on the support rod 233 to change the relative relationship between the first photographing assembly 113 and the second photographing assembly 143 Location.
  • the support rod 223 can be set movably on the base 101 to change the horizontal positions of the first shooting assembly 113 and the second shooting assembly 143, and the first shooting assembly 113 and the second shooting assembly are driven by the movement of the support rod 233 143 moves, thereby changing the position of the first photographing assembly 113 and the second photographing assembly 143 according to the position of the chip tray (not shown), ensuring that the sum of the images acquired by the first photographing assembly 113 and the second photographing assembly 143 covers the chip tray ( not shown) the entire area.
  • both the first photographing component 113 and the second photographing component 143 include at least one camera. Specifically, the number of cameras can be determined according to the accuracy of the image required in practical applications, and this embodiment does not constitute a pair of cameras. The number of specific cameras in the first shooting assembly 113 and the second shooting assembly 143 is limited.
  • the first photographing component 113 and the second photographing component 143 are located at the same height, and the first photographing component 113 is 20mm away from the top surface of the core plate 102 ⁇ 25mm, eg 21mm, 22mm, 23mm or 24mm.
  • the first photographing assembly 113 is 23.5 mm away from the top surface of the core disk 102 .
  • the collection device further includes: light-emitting components 104 located on the base 101 and on both sides of the core disk 102 , the light-emitting components are arranged parallel to the edge of the core disk 102 near the light-emitting component 104 .
  • the horizontally arranged light emitting assembly 104 prevents the light source from directly irradiating the chip code, so that the reflectivity of the chip code in the image of the chip tray is high, which facilitates the identification of the chip code from the image of the chip tray.
  • the collection device further includes: a light emitting assembly base 105 located on the base 101 and used to carry the light emitting assembly 104, and the light emitting assembly 104 is disposed on the light emitting assembly base.
  • the light-emitting component base 105 is used to carry the light-emitting component 104, so that the height of the light-emitting component 104 in the horizontal direction is higher than the height of the chip tray (not shown), so as to prevent some light sources from being unable to illuminate the chip tray (not shown), resulting in waste of light sources .
  • the height of the light-emitting assembly base 105 satisfies the following conditions: the incident angle of the light-emitting assembly 104 to the edge of the core disk 102 away from the light-emitting assembly side is less than 60°, By ensuring the illumination angle of the light source, it is further ensured that the code of the chip in the image of the chip tray (not shown) has a higher reflectivity, which facilitates the identification of the code of the chip from the image of the chip tray (not shown).
  • the side of the base 105 of the light-emitting component is provided with bayonets (not shown) of different heights, and the base 101 is also fixed with a slot (not shown) fitted with the bayonet. ), the bayonet (not shown) and the bayonet slot (not shown) are used to adjust the height difference between the base 105 of the light-emitting assembly and the base 101 according to the size of the core plate 102 .
  • the height of the light-emitting component base 105 can be adjusted according to the height of the chip tray, so that for different chip trays, the chips in the image of the chip tray can also be guaranteed.
  • the high reflectivity of the code makes it easy to identify the code of the chip from the image of the chip tray.
  • the length corresponding to the core disk 102 is t1
  • the width is t2
  • the width of the light-emitting assembly 104 is l1, the width is l2, and the height is l3, and the corresponding length of the base 101 is b1, the width is b2, and the height is b3, and the distance between the base 105 of the light-emitting assembly and the core plate 102 is d0,
  • the width of the light-emitting element 104 is unlimited, and l2>0 is sufficient.
  • tan ⁇ (l3+h3-0.8 )/(13+d0) ⁇ tan30°, where h3 is the height of the light-emitting component base 105 .
  • the corresponding length of the positioning portion 106 is g1
  • the width is g2
  • the height is g3 since the positioning portion 106 is disposed at two adjacent corners of the core disk 102, the height of the positioning portion 106 is not higher than the height of the core disk 102, that is, two The shapes of the positioning portions 106 are the same, that is, t2/2+g2>g1>0, 1 ⁇ g2>0, and t3 ⁇ g3>0.
  • a core tray and a plurality of photographing components are provided, the core tray is used to place the chip tray, the multiple photographing components are used to photograph the chip tray, and different photographing components are used to photograph different areas of the chip tray; the multiple photographing components are used for simultaneous shooting Different areas of the chip tray can be obtained in a single shooting process to obtain the image of the entire chip tray, thereby obtaining the codes of all chips on the chip tray, saving detection time and facilitating the mass production of chips.
  • Another embodiment of the present application relates to a collection system, including: the collection device of the above-mentioned embodiment, and a control converter, a storage database, an interactive server, and a terminal; the collection device is used to obtain an image of a chip tray; the control converter and the collection device The communication connection is used to set the configuration information for the acquisition device according to the control command, and is also used to obtain the image of the chip tray, obtain the data information in the image of the chip tray, and upload the data information to the storage database; the storage database communicates with the control converter Connected, data update is performed based on control commands, and the control commands are sent to the control converter, which is also used to store data information; the interactive server is connected to the storage database in communication, used to upload the received control commands to the storage database, and also used for Find the corresponding data information in the storage database according to the control command, and send the data information to the terminal; the terminal is connected to the interactive server in communication, and is used to send control commands to the interactive server according to the operator's instructions, and is
  • FIG. 5 is a schematic structural diagram of the acquisition system provided in this embodiment.
  • the acquisition system provided in this embodiment will be described in detail below with reference to the accompanying drawings, and the same or corresponding parts as those in the above-mentioned embodiment will not be described in detail below.
  • a collection system 200 includes: the collection device 100 provided in the above embodiment, a control converter 204 , a storage database 203 , an interactive server 202 and a terminal 201 .
  • the acquisition device 100 is used to acquire an image of the chip tray.
  • the acquisition device 100 acquires the image of the chip tray according to the configuration information set by the control converter 204.
  • the control converter 204 is configured to set configuration information for the collection of Zhang Zhi 100 , and to acquire the chip code in the image of the chip tray according to the image of the chip tray acquired by the acquisition device 100 .
  • control converter 204 is connected in communication with the collecting device 100, and is used for setting configuration information for the collecting device 100 according to the control command.
  • the control converter 204 is also used for acquiring the image of the chip tray, and acquiring the data information in the image of the chip tray, that is, acquiring the chip code in the image of the chip tray, and uploading the acquired data information to the storage database.
  • the storage database 203 is used to store the control commands issued to the control converter 204 and the chip code data in the image of the chip tray.
  • the storage database 203 is connected in communication with the control converter 204, and is used to update the data of the storage database 203 according to the control command, and issue the updated control command to the control converter.
  • the storage database 203 is also used to receive and store the data information uploaded by the control converter 204 , that is, to store the chip code acquired by the control converter 204 .
  • the interactive server 202 is used for receiving the control command, sending the control command to the storage database 203, and also for querying corresponding data information in the storage database 203 according to the control command.
  • the interactive server 202 is connected in communication with the storage database 203 for uploading the received control commands to the storage database 203 .
  • the interactive server 202 is further configured to search for the corresponding data information in the storage database 204 according to the control command, that is, obtain the data information corresponding to the control command, and deliver the data information to the terminal 201 .
  • the terminal 201 is a personal terminal with a communication function such as a personal computer and a mobile phone, and is used for generating a control command and displaying data information corresponding to the control command.
  • the terminal 201 is connected to the interactive server 202 in communication, and is used for issuing control commands to the interactive server 202 according to the operator's instruction.
  • the terminal 201 is also used to display the data information sent by the interactive server 202 .
  • the operator sets operator instructions on the terminal, and the terminal uploads the operator's execution to the acquisition device to complete the acquisition of the image of the chip tray, then acquires the code of the chip in the image of the chip tray, and sends the acquired information to the terminal step by step. , so that the operator can remotely control the collection device to collect the codes of the chips in the chip tray.
  • each unit involved in this embodiment is a logical unit.
  • a logical unit may be a physical unit, a part of a physical unit, or multiple physical units.
  • a composite implementation of the unit in order to highlight the innovative part of the present application, this embodiment does not introduce units that are not closely related to solving the technical problem raised by the present application, but this does not mean that there are no other units in this embodiment.
  • Yet another embodiment of the present application relates to a collection method, including: a terminal receives an operator's instruction, and based on the operator's instruction, sends a control command to an interactive server; the interactive server uploads the received control command to a storage database; the storage database is based on the control command Update the data and send the control command to the control converter; the control converter sets configuration information for the acquisition device according to the control command; the acquisition device acquires the image of the chip tray according to the configuration information; the control converter acquires the data in the image of the chip tray information, and upload the data information to the storage database; the storage database stores the data information; the interactive server searches for the corresponding data information in the storage database according to the control command, and sends the data information to the terminal; the terminal displays the data information issued by the interactive server .
  • FIG. 6 is a schematic flowchart of the collection method provided by this embodiment.
  • the collection method provided by this embodiment will be described in detail below with reference to the accompanying drawings. The parts that are the same as or corresponding to the above embodiment will not be described in detail below.
  • the collection method involves a terminal 201, an interactive server 202, a storage database 203, a control converter 204 and a collection device 100, and the specific steps are as follows:
  • Step 301 receiving an operator instruction.
  • the terminal 201 receives an operator's instruction. Specifically, the operator performs an operation on the terminal 201 , and the terminal generates a corresponding control command according to the operation performed by the operator on the terminal 201 .
  • Step 302 issue and upload a control command.
  • the terminal 201 sends a control command to the interactive server 202, and the interactive server 202 uploads the received control command to the storage database 203. Specifically, the terminal 201 sends the generated control command to the interactive server 202, and the interactive server 202 receives the The control commands are uploaded to the storage database 203 .
  • Step 303 data update.
  • the storage database 203 is updated based on the control command. Specifically, the storage database 203 performs data update to add the received control command in the database.
  • Step 304 issue a control command.
  • the storage database 203 issues the control command to the control converter 204 , and after the data update is completed, the storage database 203 issues the control command to the control converter 204 .
  • Step 305 setting configuration information.
  • the control converter 204 sets configuration information for the collection device 100 according to the control command. Specifically, the control converter 204 parses the control command, obtains the configuration information of the collection device 100, and completes the setting of the collection device 100 according to the configuration information indicated by the control command. .
  • Step 306 acquiring an image of the chip tray.
  • the acquisition device 100 acquires the image of the chip tray according to the configuration information.
  • Step 307 acquiring data information.
  • the control converter 204 acquires the data information in the image of the chip tray, specifically, the control converter 204 receives the image of the chip tray acquired by the acquisition device 100, and performs image recognition on the image of the chip tray to obtain the image of the chip tray. Chip code.
  • Step 308 uploading data information.
  • the control converter 204 uploads the data information to the storage database 203 . Specifically, the control converter 204 uploads the chip code in the image of the chip tray to the storage database 203 after acquiring the chip code in the image of the chip tray.
  • Step 309 data update.
  • the storage database 203 stores data information. Specifically, the storage database 203 performs data update to add chip codes in the images of the received chip trays in the database.
  • Step 310 query data information according to the control command.
  • the interactive server 204 searches the storage database 203 for corresponding data information according to the control command. Specifically, the interactive server 204 continuously polls the storage database 203 until the chip code in the image of the chip tray corresponding to the control command is found from the storage database 203. .
  • Step 311 return data.
  • the interactive server 204 sends the data information to the terminal 205. Specifically, after acquiring the chip code in the image of the chip tray corresponding to the control command, the interactive server 204 sends the chip code in the image of the chip tray to the terminal 205. .
  • Step 312 data display.
  • the terminal 205 displays the data information sent by the interactive server 204, and specifically, the terminal 100 displays the chip code in the image of the chip tray corresponding to the control operator's instruction through the display panel.
  • the operator sets operator instructions on the terminal, and the terminal uploads the operator's execution to the acquisition device to complete the acquisition of the image of the chip tray, then acquires the code of the chip in the image of the chip tray, and sends the acquired information to the terminal step by step. , so that the operator can remotely control the collection device to collect the codes of the chips in the chip tray.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

一种采集装置、采集***及采集方法，包括：底座(101)以及设置在底座(101)上的芯盘(102)，芯盘(102)用于承载芯片托盘；第一支撑部(103)，第一支撑部(103)设置在底座上(101)、且连接有第一拍摄组件(113)，第一拍摄组件(113)设置在芯盘(102)上方；第二支撑部(133)，第二支撑部(133)设置在底座(101)上、且连接有第二拍摄组件(143)，第二拍摄组件(143)设置在芯盘上方(102)；第一拍摄组件(133)用于拍摄芯片托盘的第一区域的图像，第二拍摄组件(143)用于拍摄芯片托盘的第二区域的图像，第一区域和第二区域之和涵盖芯片托盘的整个区域，以实现在单次拍摄过程中获取芯片托盘上所有芯片的编码。

Description

采集装置、采集***及采集方法
交叉引用
本申请要求于2021年03月26日递交的名称为“采集装置、采集***及采集方法”、申请号为202110328197.1的中国专利申请的优先权，其通过引用被全部并入本申请。
技术领域
本申请涉及半导体检测领域，特别涉及一种采集装置、采集***及采集方法。
背景技术
在半导体制程过程中，对芯片托盘(Chip Tray)上芯片的标定和识别主要通过获取芯片的编码，而芯片的编码需要使用高价的激光摄像机采集，激光摄像机的图像拍摄范围小，单次采集无法获取到芯片托盘中所有芯片的编码。
目前，主要通过人工控制激光摄像机对芯片托盘上的芯片进行编码采集，而芯片托盘上的芯片数量多，获取芯片托盘中所有芯片的编码需要控制激光摄像机进行多次拍摄，从而耗费大量的检测时间，不利于芯片的批量产出，且人工操作容易出现芯片的遗漏采集、重复采集和错误位置顺序采集等问题。
因此，如何在单次对芯片托盘的拍摄中，获取芯片托盘上所有芯片的编码，是半导体制程过程中亟待解决的问题。
发明内容
本申请实施例提供了一种采集装置，包括：底座以及设置在底座上的芯盘，芯盘用于承载芯片托盘；第一支撑部，第一支撑部设置在底座上、且连接有第一拍摄组件，第一拍摄组件设置在芯盘上方；第二支撑部，第二支撑部设置在底座上、且连接有第二拍摄组件，第二拍摄组件设置在芯盘上方；第一拍摄组件用于拍摄芯片托盘的第一区域的图像，第二拍摄组件用于拍摄芯片托盘的第二区域的图像，第一区域和第二区域之和涵盖芯片托盘的整个区域。
本申请实施例还提供了一种采集***，包括：上述采集装置、以及控制 转换器、存储数据库、交互服务器和终端；采集装置用于获取芯片托盘的图像；控制转换器与采集装置通信相连，用于根据控制命令为采集装置设置配置信息，还用于获取芯片托盘的图像，获取芯片托盘的图像中的数据信息，并将数据信息上传至存储数据库；存储数据库与控制转换器通信相连，基于控制命令进行数据更新，并将控制命令下发至控制转换器，还用于存储数据信息；交互服务器与存储数据库通信相连，用于将接收的控制命令上传至存储数据库，还用于根据控制命令在存储数据库中寻找相应的数据信息，并将数据信息下发至终端；终端与交互服务器通信相连，用于根据操作者指令，向交互服务器发出控制命令，还用于显示交互服务器下发的数据信息。
本申请实施例还提供了一种采集方法，包括：终端接收操作者指令，并基于操作者指令，向交互服务器发出控制命令；交互服务器将接收的控制命令上传至存储数据库；存储数据库基于控制命令进行数据更新，并将控制命令下发至控制转换器；控制转换器根据控制命令为采集装置设置配置信息；采集装置根据配置信息获取芯片托盘的图像；控制转换器获取芯片托盘的图像中的数据信息，并将数据信息上传至存储数据库；存储数据库存储数据信息；交互服务器根据控制命令在存储数据库中寻找相应的数据信息，并将数据信息下发至终端；终端显示交互服务器下发的数据信息。
附图说明
图1为本申请一实施例提供的采集装置的一种结构示意图；
图2为本申请一实施例提供的采集装置中第一摄像组件和第二摄像组件的拍摄区域示意图；
图3为本申请一实施例提供的采集装置的原理示意图；
图4为本申请一实施例提供的采集装置的另一种结构示意图；
图5为本申请另一实施例提供的采集***的结构示意图；
图6为本申请又一实施例提供的采集方法的流程示意图。
具体实施方式
目前，主要通过人工控制激光摄像机对芯片托盘上的芯片进行编码采集，而芯片托盘上的芯片数量多，获取芯片托盘中所有芯片的编码需要控制激光摄 像机进行多次拍摄，从而耗费大量的检测时间，不利于芯片的批量产出，且人工操作容易出现芯片的遗漏采集、重复采集和错误位置顺序采集等问题。
本申请一实施例提供了一种采集装置，包括：底座以及设置在底座上的芯盘，芯盘用于承载芯片托盘；第一支撑部，第一支撑部设置在底座上、且连接有第一拍摄组件，第一拍摄组件设置在芯盘上方；第二支撑部，第二支撑部设置在底座上、且连接有第二拍摄组件，第二拍摄组件设置在芯盘上方；第一拍摄组件用于拍摄芯片托盘的第一区域的图像，第二拍摄组件用于拍摄芯片托盘的第二区域的图像，第一区域和第二区域之和涵盖芯片托盘的整个区域。
本领域的普通技术人员可以理解，在本申请各实施例中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以下各实施例的种种变化和修改，也可以实现本申请所要求保护的技术方案。
图1和图4为本实施例提供的采集装置的结构示意图，图2为本实施例提供的采集装置中第一摄像组件和第二摄像组件的拍摄区域示意图，图3为本实施例提供的采集装置的原理示意图，以下结合附图对本实施例提供的采集装置作进一步详细说明，具体如下：
参考图1，采集装置包括，底座101，以及设置在底座101上的芯盘102，芯盘102用于承载芯片托盘(未图示)，芯片托盘(未图示)中放置有芯片，芯片上具有对芯片的标定和识别的编码。
在本实施例中，芯片托盘(未图示)的长、宽和高的尺寸符合JEDEC规定的规格；具体地，芯片托盘(未图示)中放置的芯片的数量以长度方向上的芯片数X宽度方向上的芯片数量表示，目前标准的芯片托盘(未图示)可以放置的芯片数为19X11和17X8。
另外，在本实施例中，芯盘102为与芯片托盘(未图示)形状一致的长方体，以保证芯片托盘(未图示)放置在芯盘102上后不存在悬空部分。在其他实施例中，芯盘的形状可以为任意形状，本实施例并不构成对芯盘形状先的限定，本领域技术人员应当理解，无论芯盘102采用何种形状设置，若芯盘102的目的在于稳定承载芯片托盘(未图示)，应属于本申请的保护范围。
进一步地，为了保证承载芯片托盘(未图示)的芯盘102的稳定性，芯盘102固定在底座101上。
在一个例子中，可以通过粘合芯盘102与底座101的接触面的方式，将芯盘102固定在底座101上。
在另一个例子中，采集装置还包括定位组件(未图示)，定位组件(未图示)固定在底座101上，并用于固定放置在底座101上的芯盘102。通过固定在底座101上的定位组件(未图示)来固定放置在底座101上的芯盘102，在保证芯盘102的稳定性的基础上，有利于采集装置的拆卸和组装。
具体地，参考图1，定位组件(未图示)，包括相对设置的两个L型的定位部106，在本实施例中，芯盘102呈矩形，定位部106贴合芯盘102相对的两个拐角，以固定芯盘102。在其他实施例中，芯盘可以设置为任意形状，定位部的形状以贴合芯盘的边缘或拐角设置，从而实现通过定位部固定芯盘。
需要说明的是，定位部106的高度不高于芯盘102的高度，以防止芯片托盘(未图示)部分防止在定位部106上，使芯片托盘(未图示)并非平整放置。
进一步地，底座101上还包括多个分立的插槽(未图示)，定位部106底部还设置有与插槽契合的插销(未图示)。通过将插销***插槽中，以改变定位部106固定在底座101上的位置，使采集装置适用于不同尺寸的芯盘102且使芯盘102的固定位置提供了多种选择。
采集装置还包括：第一支撑部103和第二支撑部133；其中，第一支撑部103设置在底座101上、且连接有第一拍摄组件113，第一拍摄组件113设置在芯盘102上方；第二支撑部133设置在底座101上、且连接有第二拍摄组件143，第二拍摄组件143设置在芯盘103上方。
第一拍摄组件113和第二拍摄组件143用于拍摄放置在芯盘102上芯片托盘(未图示)的图像，后续通过拍摄的芯片托盘(未图示)的图像，对芯片托盘中放置芯片的编码进行识别。
具体地，第一拍摄组件113用于拍摄芯片托盘(未图示)的第一区域的图像，第二拍摄组件用于拍摄芯片托盘(未图示)的第二区域的图像，第一区域和第二区域之和涵盖芯片托盘(未图示)的整个区域。
参考图2，第一区域包括第一子区域112和第三子区域132，第二区域包 括第二子区域122和第四子区域142；其中，第一子区域112和第二子区域122为：在芯盘102长度方向上，将芯盘102平分的两个区域，第三子区域132为靠近第一子区域112的部分第二子区域122，第四子区域142为靠近第二子区域122的部分第一子区域112。
进一步地，参考图1，第一拍摄组件113和第二拍摄组件143分别位于：芯盘102的长度方向上的两条三等分线和芯盘102宽度方向上的垂直平分线的交点上方。通过将第一拍摄组件113和第二拍摄组件143对称设置在两条三等分线垂直平分线的交点上方，保证第一拍摄组件113和第二拍摄组件143获取的图像之和涵盖芯盘102的整个区域。
在一个例子中，参考图4，采集装置还包括：支撑杆233，支撑杆233设置在底座101上，第一支撑部103包括第一支撑臂213，第一支撑臂213自支撑杆233沿第一方向延伸并连接第一拍摄组件113；第二支撑部133包括第二支撑臂223，第二支撑臂223自支撑杆223沿第二方向延伸并连接第二拍摄组件143；其中，第一方向和第二方向之间的夹角大于0°且小于180°。
基于本例，在具体的应用过程中，也可以将第一支撑臂213和第二支撑臂223可旋转地设置在支撑杆233上，以改变第一拍摄组件113和第二拍摄组件143的相对位置。另外，支撑杆223可以设置为可移动地设置在底座101上，以改变第一拍摄组件113和第二拍摄组件143的水平位置，通过支撑杆233移动带动第一拍摄组件113和第二拍摄组件143移动，从而根据芯片托盘(未图示)的位置改变第一拍摄组件113和第二拍摄组件143的位置，保证第一拍摄组件113和第二拍摄组件143获取的图像之和涵盖芯片托盘(未图示)的整个区域。
需要说明的是，第一拍摄组件113和第二拍摄组件143中都包含有至少一个摄像头，具体地摄像头的数量可以根据实际应用中所需的图像的精确度确定，本实施例并不构成对第一拍摄组件113和第二拍摄组件143中具体摄像头数量的限定。
另外，参考图3，在本实施例中，在垂直于底座101表面的方向上，第一拍摄组件113和第二拍摄组件143位于同一高度，且第一拍摄组件113距离芯盘102顶部表面20mm～25mm，例如21mm、22mm、23mm或24mm。通过设置 第一拍摄组件113和第二拍摄组件143的高度，保证第一拍摄组件113和第二拍摄组件143可以获取到清晰的芯片托盘的图像。优选地，第一拍摄组件113距离芯盘102顶部表面23.5mm。
继续参考图1，采集装置，还包括：位于底座101上，且位于芯盘102两侧的放光组件104，发光组件平行于芯盘102靠近发光组件104一侧的边沿设置。通过水平设置的发光组件104，避免光源直接照射芯片编码，使芯片托盘的图像中芯片的编码的反射率较高，便于从芯片托盘的图像中识别芯片的编码。
另外，采集装置，还包括：位于底座101上，并用于承载发光组件104的发光组件底座105，发光组件104设置在发光组件底座上。通过发光组件底座105承载发光组件104，使在水平方向上发光组件104的高度高于芯片托盘(未图示)高度，从而避免部分光源无法照射到芯片托盘(未图示)，造成光源的浪费。
进一步地，参考图3，在垂直于底座101表面的方向上，发光组件底座105的高度满足以下条件：发光组件104射向芯盘102远离发光组件一侧的边沿时的入射角小于60°，通过保证光源的照射角度，进一步保证芯片托盘(未图示)的图像中芯片的编码的反射率较高，便于从芯片托盘(未图示)的图像中识别芯片的编码。
更进一步地，在垂直于底座101表面的方向上没发光组件底座105的侧面设置有不同高度的卡口(未图示)，底座101上还固定与卡口嵌合的卡槽(未图示)，卡口(未图示)和卡槽(未图示)用于根据芯盘102大小调节发光组件底座105与底座101的高度差。通过卡口(未图示)和卡槽(未图示)的设置，可以根据芯片托盘的高度，调节发光组件底座105的高度，从而对于不同的芯片托盘，也可以保证芯片托盘的图像中芯片的编码的反射率较高，便于从芯片托盘的图像中识别芯片的编码。
在一个具体的例子中，假设芯盘102对应的长为t1，宽为t2，高为t3，由于芯盘102的尺寸符合JEDEC规定的规格，即(t1，t2，t3)＝(31，13，0.8)。假设发光组件104对应的长为l1，宽为l2，高为l3，假设底座101对应的长为b1，宽为b2，高为b3，发光组件底座105和芯盘102之间的间距为d0，为了保证发光组件104的光源平行于芯盘102照射，即b1＞l1＞t1，发光组件104的宽 度无限制，l2＞0即可，对于发光组件的高t3，tanθ＝(l3+h3-0.8)/(13+d0)≥tan30°其中，h3为发光组件底座105的高度。假设发光组件底座105对应的长为h1，宽为h2，高为h3，发光组件底座105的尺寸设置需保证可以承载发光组件104，即h1＝l1，h2＝l2，h3＞0。假设定位部106对应的长为g1，宽为g2，高为g3，由于定位部106设置在芯盘102相邻两个拐角，定位部106的高度不高于芯盘102的高度，即两个定位部106的形状一致，即t2/2+g2＞g1＞0，1≥g2＞0，t3≥g3＞0。
设置有芯盘和多个拍摄组件，芯盘用于放置芯片托盘，多个拍摄组件用于对芯片托盘进行拍摄，且不同拍摄组件用于拍摄芯片托盘的不同区域；通过多个拍摄组件同时拍摄芯片托盘的不同区域，从而实现在单次拍摄过程中，获取整个芯片托盘的图像，从而获取芯片托盘上所有芯片的编码，节省检测时间，利于芯片的批量产出。
本申请另一实施例涉及一种采集***，包括：上述实施例的采集装置、以及控制转换器、存储数据库、交互服务器和终端；采集装置用于获取芯片托盘的图像；控制转换器与采集装置通信相连，用于根据控制命令为采集装置设置配置信息，还用于获取芯片托盘的图像，获取芯片托盘的图像中的数据信息，并将数据信息上传至存储数据库；存储数据库与控制转换器通信相连，基于控制命令进行数据更新，并将控制命令下发至控制转换器，还用于存储数据信息；交互服务器与存储数据库通信相连，用于将接收的控制命令上传至存储数据库，还用于根据控制命令在存储数据库中寻找相应的数据信息，并将数据信息下发至终端；终端与交互服务器通信相连，用于根据操作者指令，向交互服务器发出控制命令，还用于显示交互服务器下发的数据信息。
图5为本实施例提供的采集***的结构示意图，以下将结合附图对本实施例提供的采集***进行详细说明，与上述实施例相同或相应的部分，以下将不做详细赘述。
参考图5，采集***200，包括：上述实施例提供的采集装置100、以及控制转换器204、存储数据库203、交互服务器202和终端201。
采集装置100用于获取芯片托盘的图像。
具体地，采集装置100根据控制转换器204设置的配置信息获取芯片托 盘的图像。
控制转换器204用于为采集张志100设置配置信息，并根据采集装置100获取的芯片托盘的图像，获取芯片托盘的图像中的芯片编码。
具体地，控制转换器204与采集装置100通信相连，用于根据控制命令为采集装置100设置配置信息。控制转换器204还用于获取芯片托盘的图像，并获取芯片托盘的图像中的数据信息，即获取芯片托盘的图像中的芯片编码，并获取的数据信息上传至存储数据库。
存储数据库203用于存储下发给控制转换器204的控制命令和芯片托盘的图像中的芯片编码数据。
具体地，存储数据库203与控制转换器204通信相连，用于根据控制命令对存储数据库203进行数据更新，并将更新后的控制命令下发至控制转换器。存储数据库203还用于接收并存储控制转换器204上传的数据信息，即存储控制转换器204获取的芯片编码。
交互服务器202用于接收控制命令，将控制命令下发至存储数据库203，还用于根据控制命令在存储数据库203中查询相应的数据信息。
具体地，交互服务器202与存储数据库203通信相连，用于将接收的控制命令上传至存储数据库203。交互服务器202还用于根据控制命令，在存储数据库204中寻找相应的数据信息，即获取与控制命令对应的数据信息，并将数据信息下发至终端201。
终端201即个人电脑、手机等具有通信功能的个人终端，用于生成控制命令，并显示与控制命令相应的数据信息。
具体地。终端201与交互服务器202通信相连，用于根据操作者指令，向交互服务器202发出控制命令。终端201还用于显示交互服务器202下发的数据信息。
操作者在终端设置操作者指令，终端将操作者执行逐级上传至采集装置完成对芯片托盘的图像的获取，然后获取芯片托盘的图像中芯片的编码，将获取的信息逐级下发至终端，从而实现操作者远程控制采集装置采集芯片托盘中芯片的编码。
值得一提的是，本实施例中所涉及到的各单元均为逻辑单元，在实际应用中，一个逻辑单元可以是一个物理单元，也可以是一个物理单元的一部分，还可以以多个物理单元的组合实现。此外，为了突出本申请的创新部分，本实施例中并没有将与解决本申请所提出的技术问题关系不太密切的单元引入，但这并不表明本实施例中不存在其它的单元。
由于上述实施例与本实施例相互对应，因此本实施例可与上述实施例互相配合实施。上述实施例中提到的相关技术细节在本实施例中依然有效，在上述实施例中所能达到的技术效果在本实施例中也同样可以实现，为了减少重复，这里不再赘述。相应地，本实施例中提到的相关技术细节也可应用在上述实施例中。
本申请又一实施例涉及一种采集方法，包括：终端接收操作者指令，并基于操作者指令，向交互服务器发出控制命令；交互服务器将接收的控制命令上传至存储数据库；存储数据库基于控制命令进行数据更新，并将控制命令下发至控制转换器；控制转换器根据控制命令为采集装置设置配置信息；采集装置根据配置信息获取芯片托盘的图像；控制转换器获取芯片托盘的图像中的数据信息，并将数据信息上传至存储数据库；存储数据库存储数据信息；交互服务器根据控制命令在存储数据库中寻找相应的数据信息，并将数据信息下发至终端；终端显示交互服务器下发的数据信息。
图6为本实施例提供的采集方法的流程示意图，以下将结合附图对本实施例提供的采集方法进行详细说明，与上述实施例相同或相应的部分，以下将不做详细赘述。
参考图6，采集方法涉及终端201、交互服务器202、存储数据库203、控制转换器204和采集装置100，具体步骤如下：
步骤301，接收操作者指令。
终端201接收操作者指令，具体地，操作者在终端201上进行操作，终端根据操作者在终端201上进行的操作，生成相应的控制命令。
步骤302，发出并上传控制命令。
终端201基于操作者指令，向交互服务器202发出控制命令，交互服务 器202将接收的控制命令上传至存储数据库203，具体地，终端201向交互服务器202将生成的控制命令，交互服务器202将接收的控制命令上传至存储数据库203。
步骤303，数据更新。
存储数据库203基于控制命令进行更新，具体地，存储数据库203进行数据更新以在数据库中新增接收的控制命令。
步骤304，下发控制命令。
存储数据库203将控制命令下发至控制转换器204，存储数据库203在数据更新完成后，将控制命令下发至控制转换器204。
步骤305，设置配置信息。
控制转换器204根据控制命令为采集装置100设置配置信息，具体地，控制转换器204解析控制命令，获取采集装置100的配置信息，并根据控制命令指示的配置信息，完成对采集装置100的设置。
步骤306，获取芯片托盘的图像。
采集装置100根据配置信息获取芯片托盘的图像。
步骤307，获取数据信息。
控制转换器204获取芯片托盘的图像中的数据信息，具体地，控制转换器204接收采集装置100获取的芯片托盘的图像，并对芯片托盘的图像进行图像识别，以获取芯片托盘的图像中的芯片编码。
步骤308，上传数据信息。
控制转换器204将数据信息上传至存储数据库203，具体地，控制转换器204获取到芯片托盘的图像中的芯片编码后，将芯片托盘的图像中的芯片编码上传至存储数据库203。
步骤309，数据更新。
存储数据库203存储数据信息，具体地，存储数据库203进行数据更新以在数据库中新增接收的芯片托盘的图像中的芯片编码。
步骤310，根据控制命令查询数据信息。
交互服务器204根据控制命令在存储数据库203中寻找相应的数据信息，具体地，交互服务器204不断轮询存储数据库203，直至从存储数据库203中寻找与控制命令对应的芯片托盘的图像中的芯片编码。
步骤311，回传数据。
交互服务器204将数据信息下发至终端205，具体地，交互服务器204在获取到与控制命令相应的芯片托盘的图像中的芯片编码后，将芯片托盘的图像中的芯片编码下发至终端205。
步骤312，数据显示。
终端205显示交互服务器204下发的数据信息，具体地，终端100通过显示面板显示与控制操作者指令对应的芯片托盘的图像中的芯片编码。
操作者在终端设置操作者指令，终端将操作者执行逐级上传至采集装置完成对芯片托盘的图像的获取，然后获取芯片托盘的图像中芯片的编码，将获取的信息逐级下发至终端，从而实现操作者远程控制采集装置采集芯片托盘中芯片的编码。
上面各种步骤划分，只是为了描述清楚，实现时可以合并为一个步骤或者对某些步骤进行拆分，分解为多个步骤，只要包括相同的逻辑关系，都在本专利的保护范围内；对流程中添加无关紧要的修改或者引入无关紧要的设计，但不改变其流程的核心设计都在该专利的保护范围内。
由于上述实施例与本实施例相互对应，因此本实施例可与上述实施例互相配合实施。上述实施例中提到的相关技术细节在本实施例中依然有效，在上述实施例中所能达到的技术效果在本实施例中也同样可以实现，为了减少重复，这里不再赘述。相应地，本实施例中提到的相关技术细节也可应用在上述实施例中。
本领域的普通技术人员可以理解，上述各实施例是实现本申请的具体实施例，而在实际应用中，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。

Claims (15)

  1. 一种采集装置，包括：
    底座以及设置在所述底座上的芯盘，所述芯盘用于承载芯片托盘；
    第一支撑部，所述第一支撑部设置在所述底座上、且连接有第一拍摄组件，所述第一拍摄组件设置在所述芯盘上方；
    第二支撑部，所述第二支撑部设置在所述底座上、且连接有第二拍摄组件，所述第二拍摄组件设置在所述芯盘上方；
    所述第一拍摄组件用于拍摄所述芯片托盘的第一区域的图像，所述第二拍摄组件用于拍摄所述芯片托盘的第二区域的图像，所述第一区域和所述第二区域之和涵盖所述芯片托盘的整个区域。
  2. 根据权利要求1所述的采集装置，其中，所述第一拍摄组件和所述第二拍摄组件分别位于：所述芯盘的长度方向上的两条三等分线和所述芯盘的宽度方向上的垂直平分线的交点上方。
  3. 根据权利要求1或2所述的采集装置，其中，在垂直于所述底座表面的方向上，所述第一拍摄组件和所述第二拍摄组件位于同一高度，且所述第一拍摄组件距离所述芯盘顶部表面20mm～25mm。
  4. 根据权利要求1所述的采集装置，其中，所述第一区域包括第一子区域和第三子区域，所述第二区域包括第二子区域和第四子区域；
    其中，所述第一子区域和所述第二子区域为：在所述芯盘长度方向上，将所述芯盘平分的两个区域，所述第三子区域为靠近所述第一子区域的部分所述第二子区域，所述第四子区域为靠近所述第二子区域的部分所述第一子区域。
  5. 根据权利要求1所述的采集装置，其中，还包括：位于所述底座上、且位于所述芯盘两侧的发光组件，所述发光组件平行于所述芯盘靠近所述发光组件一侧的边沿设置。
  6. 根据权利要求5所述的采集装置，其中，还包括：位于所述底座上、并用于承载所述发光组件的发光组件底座，所述发光组件设置在所述发光组件底座上。
  7. 根据权利要求6所述的采集装置，其中，在垂直于所述底座表面的方向上，所述发光组件底座的高度满足以下条件：所述发光组件射向所述芯盘远离所述发光组件一侧的边沿时的入射角小于60°。
  8. 根据权利要求6所述的采集装置，其中，在垂直于所述底座表面的方向上，所述发光组件底座的侧面设置有不同高度的卡口，所述底座上还固定有与所述卡口嵌合的卡槽，所述卡口和所述卡槽用于根据芯盘大小调节所述发光组件底座与所述底座的高度差。
  9. 根据权利要求1所述的采集装置，其中，还包括：
    支撑杆，所述支撑杆设置在所述底座上；
    所述第一支撑部包括第一支撑臂，所述第二支撑部包括第二支撑臂；
    所述第一支撑臂自所述支撑杆沿第一方向延伸并连接所述第一拍摄组件；
    所述第二支撑臂自所述支撑杆沿第二方向延伸并连接所述第二拍摄组件；
    所述第一方向和所述第二方向之间的夹角大于0°且小于180°。
  10. 根据权利要求9所述的采集装置，其中，所述支撑杆可移动地设置在所述底座上，以改变所述第一拍摄组件和所述第二拍摄组件的水平位置。
  11. 根据权利要求1所述的采集装置，其中，还包括：定位组件，所述定位组件固定在所述底座上、并用于固定放置在所述底座上的所述芯盘。
  12. 根据权利要求11所述的采集装置，其中，所述定位组件包括相对设置的两个L型的定位部，所述芯盘呈矩形，所述定位部贴合所述芯盘相对的两个拐角，以固定所述芯盘。
  13. 根据权利要求12所述的采集装置，其中，所述底座上还包括多个分立的插槽，所述定位部底部还设置有与插槽契合的插销。
  14. 一种采集***，包括：权利要求1～13中任一项所述的采集装置、以及控制转换器、存储数据库、交互服务器和终端；
    所述采集装置用于获取芯片托盘的图像；
    所述控制转换器与所述采集装置通信相连，用于根据控制命令为所述采集装置设置配置信息，还用于获取所述芯片托盘的图像，获取所述芯片托盘的图 像中的数据信息，并将所述数据信息上传至所述存储数据库；
    所述存储数据库与所述控制转换器通信相连，基于所述控制命令进行数据更新，并将所述控制命令下发至所述控制转换器，还用于存储所述数据信息；
    所述交互服务器与所述存储数据库通信相连，用于将接收的所述控制命令上传至所述存储数据库，还用于根据所述控制命令在所述存储数据库中寻找相应的所述数据信息，并将所述数据信息下发至所述终端；
    所述终端与所述交互服务器通信相连，用于根据操作者指令，向所述交互服务器发出所述控制命令，还用于显示所述交互服务器下发的所述数据信息。
  15. 一种采集方法，包括：
    终端接收操作者指令，并基于所述操作者指令，向交互服务器发出所述控制命令；
    所述交互服务器将接收的所述控制命令上传至存储数据库；
    所述存储数据库基于所述控制命令进行数据更新，并将所述控制命令下发至控制转换器；
    所述控制转换器根据所述控制命令为采集装置设置配置信息；
    所述采集装置根据所述配置信息获取芯片托盘的图像；
    所述控制转换器获取所述芯片托盘的图像中的数据信息，并将所述数据信息上传至所述存储数据库；
    所述存储数据库存储所述数据信息；
    所述交互服务器根据所述控制命令在所述存储数据库中寻找相应的所述数据信息，并将所述数据信息下发至所述终端；
    所述终端显示所述交互服务器下发的所述数据信息。
PCT/CN2021/113304 2021-03-26 2021-08-18 采集装置、采集***及采集方法 WO2022198902A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/648,150 US20220309646A1 (en) 2021-03-26 2022-01-17 Acquisition apparatus, acquisition system and acquisition method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110328197.1A CN113075209A (zh) 2021-03-26 2021-03-26 采集装置、采集***及采集方法
CN202110328197.1 2021-03-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/648,150 Continuation US20220309646A1 (en) 2021-03-26 2022-01-17 Acquisition apparatus, acquisition system and acquisition method

Publications (1)

Publication Number Publication Date
WO2022198902A1 true WO2022198902A1 (zh) 2022-09-29

Family

ID=76610955

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/113304 WO2022198902A1 (zh) 2021-03-26 2021-08-18 采集装置、采集***及采集方法

Country Status (2)

Country Link
CN (1) CN113075209A (zh)
WO (1) WO2022198902A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113075209A (zh) * 2021-03-26 2021-07-06 长鑫存储技术有限公司 采集装置、采集***及采集方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05225400A (ja) * 1992-02-13 1993-09-03 Nec Corp ウェハー識別文字認識装置
WO2000014774A1 (fr) * 1998-09-03 2000-03-16 Stmicroelectronics Sa Procede et dispositif de comptage automatique de puces sur des tranches de materiau semiconducteur
US20010053557A1 (en) * 2000-02-03 2001-12-20 Keun-Hyung Park Inspection of defects on the circumference of semiconductor wafers
JP2007288040A (ja) * 2006-04-19 2007-11-01 Toppan Printing Co Ltd 被処理基板の個別管理方法及び投入回収装置及び識別方法
CN103778421A (zh) * 2012-10-18 2014-05-07 中芯国际集成电路制造(上海)有限公司 读取晶圆标识的方法及晶圆标识读取装置
CN106446888A (zh) * 2015-08-04 2017-02-22 宁波舜宇光电信息有限公司 摄像模组多标识符识别方法及设备
CN109239078A (zh) * 2018-09-12 2019-01-18 苏州工业园区纳米产业技术研究院有限公司微纳制造分公司 一种晶圆缺陷检测装置
CN111785659A (zh) * 2020-05-25 2020-10-16 杭州长川科技股份有限公司 晶圆预对位和晶圆id读取方法、装置和计算机设备
CN212310154U (zh) * 2019-10-31 2021-01-08 宁波航工智能装备有限公司 一种全自动芯片针脚检测装置
CN113075209A (zh) * 2021-03-26 2021-07-06 长鑫存储技术有限公司 采集装置、采集***及采集方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004284601A (ja) * 2003-03-19 2004-10-14 Renesas Technology Corp 半導体装置の搬送方法および実装方法ならびに包装方法およびそれに用いられる収容体の再利用方法
CN209985820U (zh) * 2018-12-29 2020-01-24 天津天物金佰微电子有限公司 一种芯片外观识别标记装置
CN212484093U (zh) * 2020-06-23 2021-02-05 天津海鸥表业集团有限公司 手表走时精度检测装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05225400A (ja) * 1992-02-13 1993-09-03 Nec Corp ウェハー識別文字認識装置
WO2000014774A1 (fr) * 1998-09-03 2000-03-16 Stmicroelectronics Sa Procede et dispositif de comptage automatique de puces sur des tranches de materiau semiconducteur
US20010053557A1 (en) * 2000-02-03 2001-12-20 Keun-Hyung Park Inspection of defects on the circumference of semiconductor wafers
JP2007288040A (ja) * 2006-04-19 2007-11-01 Toppan Printing Co Ltd 被処理基板の個別管理方法及び投入回収装置及び識別方法
CN103778421A (zh) * 2012-10-18 2014-05-07 中芯国际集成电路制造(上海)有限公司 读取晶圆标识的方法及晶圆标识读取装置
CN106446888A (zh) * 2015-08-04 2017-02-22 宁波舜宇光电信息有限公司 摄像模组多标识符识别方法及设备
CN109239078A (zh) * 2018-09-12 2019-01-18 苏州工业园区纳米产业技术研究院有限公司微纳制造分公司 一种晶圆缺陷检测装置
CN212310154U (zh) * 2019-10-31 2021-01-08 宁波航工智能装备有限公司 一种全自动芯片针脚检测装置
CN111785659A (zh) * 2020-05-25 2020-10-16 杭州长川科技股份有限公司 晶圆预对位和晶圆id读取方法、装置和计算机设备
CN113075209A (zh) * 2021-03-26 2021-07-06 长鑫存储技术有限公司 采集装置、采集***及采集方法

Also Published As

Publication number Publication date
CN113075209A (zh) 2021-07-06

Similar Documents

Publication Publication Date Title
US20190103505A1 (en) Apparatus and method for attaching led chips
US10359282B2 (en) Shelf height indication and validation device
WO2022198902A1 (zh) 采集装置、采集***及采集方法
CN110336691B (zh) 数据中心中设备的管理方法、装置、设备和通信***
TWI455666B (zh) 轉換支援裝置
TW200534676A (en) Test system for portable electronic apparatus and test method there of
WO2021202762A1 (en) Image analysis for tracking, decoding, and positioning multiple optical patterns
CN202277385U (zh) 手术器械自动识别与计数***
JP2011150460A (ja) 入出庫管理システムおよび入出庫管理方法
CN106686286B (zh) 一体化综合采集图像数据的方法及其取证验证***
CN102393939A (zh) 通过便携式终端进行房产全景展示的方法和***
CN111243990A (zh) 一种圆晶定位及数量检测***及检测方法
CN108060071B (zh) 细菌追踪***及方法
CN107977694B (zh) 一种样品拍照录入及识别的自动分析***
US20220309646A1 (en) Acquisition apparatus, acquisition system and acquisition method
TWI579588B (zh) 顯微鏡監控裝置及其系統
CN110740268B (zh) 图像采集装置和方法
CN208661788U (zh) 光学检测机
CN207601816U (zh) 一种快速定位扫码装置
CN108700250B (zh) 用于全景图及虚拟现实应用的电动相机移动装置支架
CN209459587U (zh) 偏光片尺寸测量装置
US20150048155A1 (en) Touch positioning method utilizing optical identification (oid) technology, oid positioning system and oid reader
CN210041982U (zh) 数据采集设备
CN109737875A (zh) 偏光片尺寸测量装置
TW201448596A (zh) 具位置辨識的攝影機系統以及資訊處理方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21932514

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21932514

Country of ref document: EP

Kind code of ref document: A1