WO2022196806A1 - Apparatus and method for producing structure - Google Patents

Apparatus and method for producing structure Download PDF

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Publication number
WO2022196806A1
WO2022196806A1 PCT/JP2022/012743 JP2022012743W WO2022196806A1 WO 2022196806 A1 WO2022196806 A1 WO 2022196806A1 JP 2022012743 W JP2022012743 W JP 2022012743W WO 2022196806 A1 WO2022196806 A1 WO 2022196806A1
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WO
WIPO (PCT)
Prior art keywords
porous substrate
end surface
slurry
face
plate
Prior art date
Application number
PCT/JP2022/012743
Other languages
French (fr)
Japanese (ja)
Inventor
信吾 小林
善洋 原
岳史 鍋本
Original Assignee
三井金属鉱業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to CN202280021620.6A priority Critical patent/CN117043124A/en
Priority to JP2023507204A priority patent/JPWO2022196806A1/ja
Publication of WO2022196806A1 publication Critical patent/WO2022196806A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86—Catalytic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J35/00—Catalysts, in general, characterised by their form or physical properties
    • B01J35/50—Catalysts, in general, characterised by their form or physical properties characterised by their shape or configuration
    • B01J35/56—Foraminous structures having flow-through passages or channels, e.g. grids or three-dimensional monoliths
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials

Definitions

  • the present invention produces a structure (e.g., an exhaust gas purifying catalyst or its precursor) comprising a porous substrate and a functional layer (e.g., a catalyst layer or its precursor layer) provided on the porous substrate.
  • a structure e.g., an exhaust gas purifying catalyst or its precursor
  • a functional layer e.g., a catalyst layer or its precursor layer
  • a slurry containing a raw material for a catalyst layer is supplied to one end surface of a base material, and the supplied slurry is sucked from the other end surface side of the base material to form a slurry layer on the base material.
  • a manufacturing apparatus and a manufacturing method for a catalyst for industrial use are known (for example, Patent Document 1).
  • wall-flow type substrates are known as substrates for exhaust gas purification catalysts.
  • the wall-flow type substrate includes a porous tubular portion, porous partition walls provided in the tubular portion, and cells partitioned by the partition walls.
  • the cells in the wall flow type substrate are divided into an exhaust gas inflow side cell whose end on the exhaust gas inflow side is open and an end on the exhaust gas outflow side is closed, and an exhaust gas inflow side cell whose end is open on the exhaust gas outflow side and is closed on the exhaust gas inflow side. It is composed of an exhaust gas outflow side cell that is closed.
  • the wall flow type substrate In the wall-flow type substrate, the exhaust gas that has flowed in from the exhaust gas inflow side end (opening) of the exhaust gas inflow side cell passes through the porous partition wall and reaches the exhaust gas outflow side end of the exhaust gas outflow side cell ( opening). At this time, particulate matter (PM) in the exhaust gas is trapped in the pores of the partition wall. Therefore, the wall flow type substrate is useful as a filter having a PM collection function, for example, a particulate filter for gasoline engines (GPF: Gasoline Particulate Filter) or a particulate filter for diesel engines (DPF: Diesel Particulate Filter). is.
  • GPF Gasoline Particulate Filter
  • DPF Diesel Particulate Filter
  • both the tubular portion and the partition wall portion are porous. Therefore, when slurry is supplied to one end surface of the wall-flow substrate and the supplied slurry is sucked from the other end surface of the wall-flow substrate, the outer peripheral surface of the cylindrical portion of the wall-flow substrate Air flows in and the suction force at the radially outer portion of the wall-flow substrate is less than the suction force at the radially inner portion of the wall-flow substrate.
  • the slurry is supplied to the end surface of the wall flow type substrate on the exhaust gas inflow side.
  • the ends of the exhaust gas inflow side cells are open, but the ends of the exhaust gas outflow side cells are closed.
  • the present invention provides a structure (e.g., an exhaust gas purification catalyst or its precursor) comprising a porous substrate and a functional layer (e.g., a catalyst layer or its precursor layer) provided on the porous substrate.
  • a structure e.g., an exhaust gas purification catalyst or its precursor
  • a functional layer e.g., a catalyst layer or its precursor layer
  • the present invention provides an apparatus for manufacturing a structure
  • the structure is an axially extending porous substrate; and a functional layer provided on the porous substrate
  • the porous substrate is a first end face positioned on one side in the axial direction; a second end face located on the other side in the axial direction; a first cell extending in the axial direction and having an open end on the first end surface side and a closed end on the second end surface side; a second cell extending in the axial direction, having an open end on the second end face side and a closed end on the first end face side;
  • the device comprises: a slurry supply unit that supplies a slurry containing raw materials for the functional layer to the first end face side; a slurry suction part that sucks the slurry supplied to the first end face side from the second end face side and forms a slurry layer that does not reach the second end face on the inner wall of the first cell; When the slurry supplied to the first end face side is sucked from
  • the present invention also provides a method of manufacturing a structure, comprising:
  • the structure is an axially extending porous substrate; and a functional layer provided on the porous substrate,
  • the porous substrate is a first end face positioned on one side in the axial direction; a second end face located on the other side in the axial direction; a first cell extending in the axial direction and having an open end on the first end surface side and a closed end on the second end surface side; a second cell extending in the axial direction, having an open end on the second end face side and a closed end on the first end face side;
  • the method comprises the steps of: (a) supplying a slurry containing raw materials for the functional layer to the first end face; and (b) sucking the slurry supplied to the first end face from the second end face, forming a slurry layer that does not reach the second end surface on the inner wall of the first cell; In step (b), when sucking the slurry supplied to the first end face side from the second end
  • a structure e.g., an exhaust gas purification catalyst or its precursor
  • a functional layer e.g., a catalyst layer or its precursor layer
  • An apparatus and method for manufacturing wherein the length of the slurry layer formed on the radially inner portion of the wall-flow substrate and the length of the slurry layer formed on the radially outer portion of the wall-flow substrate Apparatus and methods are provided that can reduce the difference in .
  • FIG. 1 is a side view of a porous substrate according to one embodiment.
  • FIG. 2 is an end view taken along the line AA of FIG. 1.
  • FIG. 3 is an enlarged view of the area indicated by symbol R in FIG. 4 is an end view taken along the line BB of FIG. 1.
  • FIG. 5 is a schematic diagram showing the configuration of a structure manufacturing apparatus according to one embodiment.
  • FIG. 6 is a schematic plan view showing the configuration of a base material processing section according to one embodiment.
  • FIG. 7 is a schematic partial end view showing the configuration of the coating processing section according to one embodiment. In addition, FIG. 7 shows the state before the coating process is performed on the porous substrate.
  • FIG. 8 is a schematic partial end view showing the configuration of the coating processing section according to one embodiment. In addition, FIG.
  • FIG. 8 shows the state when the coating process is performed on the porous substrate.
  • FIG. 9 is a plan view of the second end surface of the porous substrate according to one embodiment.
  • FIG. 10 is an end view (end view corresponding to FIG. 4) of the porous substrate after coating treatment according to one embodiment.
  • FIG. 11 is an enlarged view of the inside of the suction tube provided with the straightening member according to the first embodiment.
  • FIG. 12 is a plan view of a rectifying plate included in the rectifying member according to the first embodiment;
  • FIG. 13 is an enlarged view of the inside of a suction tube provided with a straightening member according to the second embodiment.
  • FIG. 14 is a plan view of a first straightening vane included in the straightening member according to the second embodiment.
  • FIG. 15 is a plan view of a second rectifying plate included in the rectifying member according to the second embodiment.
  • 16 is a plan view showing an embodiment in which a through hole is formed in the second portion of the rectifying plate shown in FIG. 12.
  • FIG. 17 is a plan view showing an embodiment in which through holes are formed in the second current plate shown in FIG. 15.
  • FIG. 18 is a plan view of a current plate according to a modification.
  • FIG. 19 is an end view for explaining a modification in which a gap is formed between the suction tube and the end portion of the porous substrate on the second end surface side that has entered the suction tube.
  • FIG. 20 is a schematic partial end view showing the configuration of a coating processing section according to a modification.
  • FIG. 20 is a schematic partial end view showing the configuration of a coating processing section according to a modification.
  • FIG. 20 is a schematic partial end view showing the configuration of a coating processing section according to a modification.
  • FIG. 20 is a schematic partial end view showing the
  • FIG. 20 shows the state when the coating process is performed on the porous substrate.
  • FIG. 21 is a plan view of the first end surface of the porous base material according to the modification.
  • FIG. 22 is a plan view of a current plate according to a modification.
  • FIG. 23 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 23 shows the state before the slurry supply process and the coating process are performed on the porous substrate.
  • FIG. 24 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 24 shows the state when the slurry supply process is performed on the porous substrate.
  • FIG. 25 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 25 shows the state when the coating process is performed on the porous substrate.
  • FIG. 26 is a diagram for explaining the radial outer portion and inner portion of the porous substrate.
  • FIG. 1 is a side view of the porous substrate 1
  • FIG. 2 is an end view of the AA line in FIG. 1
  • FIG. 3 is an enlarged view of the region indicated by symbol R in FIG. 4 is an end view taken along the line BB of FIG. 1.
  • FIG. 1 is a side view of the porous substrate 1
  • FIG. 2 is an end view of the AA line in FIG. 1
  • FIG. 3 is an enlarged view of the region indicated by symbol R in FIG. 4 is an end view taken along the line BB of FIG. 1.
  • the porous substrate 1 has a porous structure through which air can pass.
  • the material constituting the porous substrate 1 is not particularly limited, and can be appropriately selected from materials commonly used in the field of exhaust gas purification catalysts.
  • the constituent material is preferably capable of stably maintaining the shape of the porous substrate 1 even when exposed to high-temperature (for example, 400° C. or higher) exhaust gas.
  • constituent materials include ceramics. Examples of ceramics include alumina, zirconia, mullite, zircon, cordierite, aluminum titanate, silicon carbide, silicon nitride, and boron nitride.
  • the porous substrate 1 extends in the axial direction X and has an end surface S1 located on one side in the axial direction X and an end surface S2 located on the other side in the axial direction X.
  • the length P1 of the porous substrate 1 is, for example, 40 mm or more and 300 mm or less, and the diameter P2 of the end surfaces S1 and S2 of the porous substrate 1 is, for example, 30 mm or more and 250 mm or less.
  • the diameter P2 of the end surfaces S1 and S2 of the porous substrate 1 means the diameter of the circle when the end surfaces S1 and S2 of the porous substrate 1 are circular.
  • S1 and S2 are shapes other than circles (for example, polygons such as squares), they refer to diameters of circles circumscribing the shapes.
  • the porous substrate 1 includes a porous tubular portion 11 that defines the outer shape of the porous substrate 1, and a porous partition wall portion 12 provided in the tubular portion 11. and cells 13 partitioned by partition walls 12 .
  • Both the tubular portion 11 and the partition wall portion 12 have a porous structure through which air can pass.
  • the tubular portion 11 and the partition wall portion 12 are integrally molded.
  • the tubular portion 11 and the partition portion 12 are separate and joined together.
  • the porosity of the tubular portion 11 and the porosity of the partition wall portion 12 may or may not be the same.
  • the thickness of the cylindrical portion 11 and the partition wall portion 12 can be adjusted as appropriate.
  • the thickness of the cylindrical portion 11 is, for example, 100 ⁇ m or more and 3000 ⁇ m or less, and the thickness of the partition wall portion 12 is, for example, 20 ⁇ m or more and 1500 ⁇ m or less. .
  • the cylindrical portion 11 is cylindrical, but the shape of the cylindrical portion 11 can be changed as appropriate.
  • the tubular portion 11 may be, for example, an elliptical tubular shape, a rectangular tubular shape, or the like.
  • planar view shape of the cell 13 is square, but the planar view shape of the cell 13 can be changed as appropriate.
  • the planar shape of the cell 13 may be, for example, a quadrangle other than a square, a triangle such as a regular triangle, a hexagon such as a regular hexagon, an octagon such as a regular octagon, a circle, or an oval.
  • partition walls 12 exist between adjacent cells 13, and the adjacent cells 13 are partitioned by the partition walls 12.
  • the partition 12 and the cells 13 extend in the axial direction X.
  • the porous substrate 1 is a wall flow type substrate. That is, the porous substrate 1 includes a sealing portion 14 that seals the ends of some of the cells 13 on the side of the end surface S2 and a sealing portion 15 that seals the ends of the remaining cells 13 on the side of the end surface S1. and As a result, some of the cells 13 extend in the axial direction X and form cells 13a whose ends on the side of the end face S1 are open and whose ends on the side of the end face S2 are closed by the sealing portion 14. The cell 13 extends in the axial direction X and is a cell 13 b whose end on the side of the end surface S2 is open and whose end on the side of the end surface S1 is closed by the sealing portion 15 .
  • the cells 13a and 13b are arranged such that a plurality of (for example, four) cells 13b are adjacent to one cell 13a.
  • the cell 13b is partitioned by the partition wall portion 12. As shown in FIG. 4, the cells 13a and 13b are arranged such that a plurality of (for example, four) cells 13b are adjacent to one cell 13a.
  • the cell 13b is partitioned by the partition wall portion 12. As shown in FIG. 4,
  • the number of cells 13 per square inch of the porous substrate 1 can be adjusted as appropriate, but is, for example, 100 cells/inch 2 or more and 1000 cells/inch 2 or less.
  • the number of cells 13 per square inch of the porous substrate 1 is the number of cells 13a and cells 13b per square inch on a cut surface obtained by cutting the porous substrate 1 along a plane perpendicular to the axial direction X. total number.
  • FIG. 5 is a schematic diagram showing the configuration of the structure manufacturing apparatus 100. As shown in FIG.
  • the structure manufacturing apparatus 100 includes a base material processing section 2 and a control section 3 that controls the operation of the base material processing section 2 .
  • the base material treatment section 2 performs various treatments on the porous base material 1 . Various processes performed by the base material processing section 2 will be described later.
  • the control unit 3 is, for example, a computer, and includes a main control unit and a storage unit.
  • the main control section is composed of, for example, a CPU (Central Processing Unit), and controls the operation of the base material processing section 2 by reading and executing a program stored in the storage section.
  • CPU Central Processing Unit
  • FIG. 6 is a schematic plan view showing the configuration of the base material processing section 2. As shown in FIG. A dotted line in FIG. 6 represents the porous substrate 1 .
  • the base material processing section 2 includes a loading/unloading station 21 and a processing station 22 provided adjacent to the loading/unloading station 21 .
  • the loading/unloading station 21 includes a placement section 211 .
  • the porous substrate 1 is mounted on the mounting portion 211 .
  • the processing station 22 includes a transport path 221 extending in a predetermined direction, and a transport mechanism 222 provided on the transport path 221 .
  • the transport mechanism 222 includes a holding mechanism that holds the porous substrate 1, and is configured to be capable of horizontal and vertical movement and rotation about the vertical axis.
  • the processing station 22 includes a coating processing section 4 .
  • the processing station 22 may include a baking processing section.
  • the baking treatment section dries the porous substrate 1 coated by the coating treatment section 4 as necessary, and then bakes it.
  • the transport mechanism 222 transports the porous substrate 1 between the placing section 211 and the coating processing section 4 .
  • the transport mechanism 222 carries the porous substrate 1 placed on the placement unit 211 into the coating processing unit 4, carries out the coated porous substrate 1 from the coating processing unit 4, and places it. It is placed on the part 211 .
  • the transport mechanism 222 may transport the porous substrate 1 between the coating processing section 4 and the firing processing section and between the firing processing section and the placing section 211 .
  • the transport mechanism 222 carries the porous substrate 1 placed on the placement unit 211 into the coating processing unit 4, carries out the coated porous substrate 1 from the coating processing unit 4, and bakes it.
  • the porous substrate 1 after the baking treatment may be carried out from the baking treatment part and placed on the placing part 211 .
  • FIG. 7 and 8 are schematic partial end views showing the configuration of the coating processing section 4
  • FIG. 9 is a plan view of the second end surface T2 of the porous substrate 1
  • FIG. 5 is an end view of the porous substrate 1 (end view corresponding to FIG. 4).
  • FIG. 7 shows the state before the coating process is performed on the porous substrate 1
  • FIG. 8 shows the state when the coating process is performed on the porous substrate 1.
  • the coating processing unit 4 performs coating processing on the porous substrate 1 .
  • the porous substrate 1 is coated with the slurry M to form a slurry layer N on the porous substrate 1 (see FIG. 10).
  • the slurry layer N becomes a catalyst layer by being dried as necessary and then calcined.
  • the coating processing section 4 includes a chamber C.
  • a coating process for the porous substrate 1 is performed in the chamber C. As shown in FIG.
  • the coating processing section 4 includes a substrate holding section 41 that holds the porous substrate 1 .
  • the coating process for the porous substrate 1 is performed while the porous substrate 1 is held by the substrate holder 41 .
  • the substrate holding part 41 has a holding mechanism that holds the porous substrate 1 .
  • the substrate holding unit 41 has, for example, a chuck mechanism such as a hand chuck, and holds the porous substrate 1 by gripping the central portion of the cylindrical portion 11 of the porous substrate 1 with the chuck mechanism.
  • the substrate holding unit 41 is configured so that the held porous substrate 1 can be moved in horizontal and vertical directions, rotated around the vertical axis, rotated around the horizontal axis, and the like. may
  • the substrate holding portion 41 is configured such that the first end surface T1 of the porous substrate 1 faces the nozzle 422 side of the slurry supply portion 42 (upper side in FIGS. 7 and 8), and the porous substrate The porous substrate 1 is held so that the second end face T2 of the substrate 1 faces the suction pipe 461 side of the slurry suction part 46 (lower side in FIGS. 7 and 8).
  • the first end surface T1 of the porous substrate 1 is one of the end surfaces S1 and S2 of the porous substrate 1, and the second end surface T2 of the porous substrate 1 is the end surface S1 and S2 of the porous substrate 1.
  • the end surface S2 corresponds to the second end surface T2.
  • the end surface S1 corresponds to the second end surface T2.
  • the end surface S1 corresponds to the second end surface T2.
  • the end surface S1 is the first end surface T1
  • the end surface S2 is the second end surface T2.
  • the second end face T2 of the porous substrate 1 includes an annular (for example, annular) outer edge region T21 located radially outside the second end face T2 and an outer edge region T21 located radially outward of the second end face T2. It is partitioned into a central region T22 located inside T21. Boundary line L2 is a virtual line. In FIG. 9, the openings of the cells 13b present on the second end surface T2 are omitted.
  • the area of the central region T22 is preferably 40% or more and 90% or less of the area of the second end surface T2, and more preferably 65% or more and 85% or less.
  • the shape of the central region T22 and the shape of the second end face T2 are preferably similar shapes.
  • the shape of the central region T22 means the shape defined by the outline of the central region T22 (that is, the boundary line L2), and the shape of the second end surface T2 means the shape defined by the outline of the second end surface T2. means.
  • the outer edge region T21 is preferably formed with a predetermined width along the outline of the second end face T2 so that the shape of the central region T22 and the shape of the second end face T2 are similar. As long as the shape of the central region T22 and the shape of the second end surface T2 are similar, the width of the outer edge region T21 may or may not be constant.
  • the porous substrate 1 carried into the coating processing section 4 by the transport mechanism 222 may be held by the transport mechanism 222 as it is.
  • the transport mechanism 222 functions as the substrate holder 41 .
  • the coating processing section 4 includes a slurry supply section 42 that supplies the slurry M to the first end surface T1 side of the porous substrate 1 .
  • the slurry supply unit 42 includes a storage tank 421 in which the slurry M is stored, a nozzle 422 for discharging the slurry M toward the first end surface T1 of the porous substrate 1, and a storage and a supply pipe 423 for supplying the slurry M in the tank 421 to the nozzle 422 .
  • the slurry supply unit 42 supplies the slurry M in the storage tank 421 to the nozzle 422 through the supply pipe 423 and discharges the slurry M from the nozzle 422 onto the first end surface T1 of the porous substrate 1, whereby the porous substrate 1 is A slurry M is supplied to the first end face T1.
  • the slurry M contains raw materials for the functional layer provided on the porous substrate 1 .
  • the viscosity of the slurry M is, for example, 100 mPa s or more and 1000 mPa s or less when measured using a cone and plate type viscometer at a temperature of 25 ° C. and a shear rate of 380 s -1 .
  • the velocity is measured as 4 s ⁇ 1 , it is, for example, 1000 mPa ⁇ s or more and 10000 mPa ⁇ s or less.
  • a functional layer is a layer having a predetermined function, and the type of functional layer is appropriately selected according to the type of structure to be manufactured.
  • the structure to be manufactured is an exhaust gas purifying catalyst or its precursor
  • the functional layer is a catalyst layer or its precursor layer.
  • the catalyst layer is formed by calcining the slurry layer N after drying it if necessary.
  • the precursor layer of the catalyst layer includes the slurry layer N before drying and the slurry layer N after drying.
  • the exhaust gas purifying catalyst is a structure comprising a porous substrate 1 and a catalyst layer provided on the porous substrate 1 .
  • the precursor of the exhaust gas purifying catalyst includes a structure including a porous substrate 1 and a slurry layer N before drying provided on the porous substrate 1, a porous substrate 1, and a porous substrate A structure comprising a slurry layer N after drying provided on the material 1 is included.
  • the slurry M contains a catalytically active component and a dispersion medium.
  • catalytically active components include Au (gold element), Ag (silver element), Pt (platinum element), Pd (palladium element), Rh (rhodium element), Ir (iridium element), Ru (ruthenium element), Noble metal elements such as Os (osmium element) are included.
  • the slurry M contains, for example, a noble metal element in the form of a salt of the noble metal element, which is a supply source of the noble metal element.
  • salts of noble metal elements include nitrates, ammine complex salts, and chlorides. The content of the noble metal element in the slurry M can be adjusted as appropriate.
  • dispersion media examples include water and organic solvents.
  • the dispersion medium may be one solvent or a mixture of two or more solvents.
  • organic solvents include alcohol, acetone, dimethylsulfoxide, dimethylformamide and the like.
  • the slurry M may contain a carrier that supports catalytically active components.
  • the catalytically active component is supported on the carrier by, for example, being physically or chemically adsorbed or retained on the outer surface or inner surface of pores of the carrier.
  • the carrier examples include inorganic oxide particles.
  • the inorganic oxide constituting the inorganic oxide particles may be an inorganic oxide having oxygen storage capacity (OSC: Oxygen Storage Capacity) (hereinafter referred to as “oxygen storage component”), or an inorganic oxide other than the oxygen storage component. It may be an oxide.
  • OSC Oxygen Storage Capacity
  • the oxygen storage component examples include cerium oxide, composite oxides containing cerium element and zirconium element (hereinafter referred to as "CeO 2 —ZrO 2 -based composite oxide"), and the like.
  • the CeO 2 —ZrO 2 -based composite oxide may contain metal elements other than the cerium element and the zirconium element.
  • metal elements other than the cerium element and the zirconium element include rare earth elements other than the cerium element, alkaline earth metals, and transition metals.
  • inorganic oxides other than oxygen storage components include alumina, silica, silica-alumina, alumino-silicate, alumina-zirconia, alumina-chromia, alumina-ceria, alumina-lanthana, and titania.
  • the slurry M may contain a stabilizer.
  • stabilizers include nitrates, carbonates, oxides and sulfates of alkaline earth metal elements.
  • the slurry M may contain a binder component.
  • binder components include inorganic binders such as alumina sol.
  • the coating processing section 4 includes a nozzle moving mechanism 43 that moves the nozzle 422. As shown in FIGS. 7 and 8, the coating processing section 4 includes a nozzle moving mechanism 43 that moves the nozzle 422. As shown in FIGS. 7 and 8, the coating processing section 4 includes a nozzle moving mechanism 43 that moves the nozzle 422. As shown in FIGS. 7 and 8, the coating processing section 4 includes a nozzle moving mechanism 43 that moves the nozzle 422. As shown in FIGS.
  • the nozzle moving mechanism 43 includes a nozzle holding portion 431 that holds the nozzle 422 and a lifting mechanism 432 that lifts and lowers the nozzle holding portion 431 .
  • the nozzle moving mechanism 43 moves the nozzle 422 closer to the porous substrate 1 by lowering the nozzle holding part 431 by the lifting mechanism 432 to the slurry supply position shown in FIG. Further, the nozzle moving mechanism 43 moves the nozzle 422 away from the porous substrate 1 and moves it to the standby position shown in FIG. The nozzle 422 discharges the slurry M toward the first end surface T1 of the porous substrate 1 at the slurry supply position shown in FIG.
  • the relative position between the porous substrate 1 and the nozzle 422 is changed by moving the nozzle 422 with the nozzle moving mechanism 43. By moving , the relative position between the porous substrate 1 and the nozzle 422 may be changed.
  • the coating processing section 4 includes a jig 44. As shown in FIGS. 7 and 8, the coating processing section 4 includes a jig 44. As shown in FIG.
  • the jig 44 has a tubular shape such as a cylindrical shape, and the inner diameter of the jig 44 is larger than the outer diameter of the porous substrate 1 .
  • the jig 44 is attached to the nozzle holder 431 so as to surround the nozzle 422 . Therefore, the jig 44 is moved together with the nozzle 422 by the nozzle moving mechanism 43 .
  • the coating processing section 4 includes a first substrate fixing section 45. As shown in FIG.
  • the first substrate fixing portion 45 is provided at the lower end portion of the jig 44, and the end of the porous substrate 1 entering the jig 44 on the first end surface T1 side The part is fixed in jig 44 .
  • the first base material fixing part 45 has, for example, a chuck mechanism such as a balloon type chuck. When the end of the porous substrate 1 on the side of the first end surface T1 enters the jig 44, the balloon of the balloon-type chuck is not inflated so as not to hinder the entry.
  • the end portion of the porous substrate 1 on the side of the first end surface T1 enters the jig 44 it is expanded by the air pressure, and the end portion of the porous substrate 1 on the side of the first end surface T1 that has entered the jig 44 is removed by the jig. 44.
  • the balloon held by the balloon-type chuck fills the space between the jig 44 and the end of the porous base material 1 on the first end surface T1 side that has entered the jig 44 without any gap, and the balloon is discharged from the storage space V1. Prevent the slurry M from leaking.
  • the coating processing unit 4 sucks the slurry M supplied to the first end surface T1 side of the porous substrate 1 from the second end surface T2 side of the porous substrate 1, A slurry suction part 46 for forming a slurry layer N on the inner wall of the first cell of the substrate 1 is provided.
  • the first cell of the porous substrate 1 is a cell having an opening in the first end surface T1 of the porous substrate 1.
  • the cell 13a is the first cell and the cell 13b is the second cell.
  • the cell 13b is the first cell and the cell 13a is the second cell.
  • the cell 13a is the first cell and the cell 13b is the second cell.
  • the slurry suction unit 46 includes a suction tube 461 and a suction mechanism 462 connected to the lower end of the suction tube 461.
  • the suction tube 461 has a tubular shape such as a cylindrical shape, and the inner diameter of the suction tube 461 is larger than the outer diameter of the porous substrate 1 .
  • the suction tube moving mechanism 47 brings the suction tube 461 closer to the porous substrate 1 and moves it to the slurry suction position shown in FIG. inside the suction tube 461, a suction space V2 is formed in which the slurry M supplied to the first end face T1 side of the porous substrate 1 can be sucked.
  • the suction mechanism 462 includes, for example, a pump, and depressurizes the suction space V2 inside the suction pipe 461. As a result, an air flow is generated from the first end surface T1 of the porous substrate 1 toward the second end surface T2 of the porous substrate 1, and the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked toward the second end surface T2 of the porous substrate 1 . Specifically, the slurry M supplied to the first end surface T1 side of the porous substrate 1 is introduced into the cells 13a and flows along the inner walls of the cells 13a from the first end surface T1 to the second end surface T2. As a result, as shown in FIG.
  • the inner walls of the cells 13 a are formed from the first end surface T1 of the porous substrate 1 to the porous substrate 1 so as not to reach the second end surface T2 of the porous substrate 1 .
  • a slurry layer N extending toward the second end surface T2 of is formed.
  • the coating processing section 4 includes a suction tube moving mechanism 47 that moves the suction tube 461. As shown in FIGS. 7 and 8, the coating processing section 4 includes a suction tube moving mechanism 47 that moves the suction tube 461. As shown in FIGS.
  • the suction tube moving mechanism 47 moves the suction tube 461 to the slurry suction position shown in FIG. Further, the suction tube moving mechanism 47 moves the suction tube 461 to the standby position shown in FIG. 7 by lowering the suction tube 461 away from the porous substrate 1 .
  • the suction mechanism 462 decompresses the suction space V2 inside the suction pipe 461 when the suction pipe 461 is at the slurry suction position shown in FIG.
  • the suction tube moving mechanism 47 moves the suction tube 461 to change the relative position between the porous substrate 1 and the suction tube 461 .
  • the suction tube moving mechanism 47 moves the suction tube 461 to change the relative position between the porous substrate 1 and the suction tube 461 .
  • the relative positions of the porous substrate 1 and the suction tube 461 may be changed.
  • the coating processing section 4 includes a second base material fixing section 48 .
  • the second base material fixing part 48 is provided at the upper end of the suction tube 461 and fixes the second end surface T2 side end of the porous base material 1 that has entered the suction tube 461 inside the suction tube 461 .
  • the second base material fixing portion 48 has, for example, a chuck mechanism such as a balloon type chuck. When the end of the porous substrate 1 on the side of the second end surface T2 enters the suction tube 461, the balloon of the balloon-type chuck is not inflated so as not to hinder the entry.
  • the porous substrate 1 on the second end surface T2 side After the end portion of the porous substrate 1 on the second end surface T2 side enters the suction tube 461 , the porous substrate 1 is expanded by air pressure to fix the end portion on the second end surface T2 side of the porous substrate 1 inside the suction tube 461 .
  • the balloon held by the balloon-type chuck fills the gap between the suction tube 461 and the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461, and seals the suction space V2. do.
  • the air outside the suction pipe 461 is It does not flow into the through-hole formed in the rectifying member 40 in the suction tube 461 along the outer peripheral surface of 1 .
  • the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 through holes formed in the straightening plate 49a inside the suction tube 461 (for example, the straightening plate 49a). does not flow into the first through hole G) formed in the first portion 491 of the .
  • air outside the suction pipe 461 is formed along the outer peripheral surface of the porous substrate 1 in the first straightening plate 49b and the second straightening plate 50 inside the suction pipe 461.
  • Through holes for example, a first through hole G formed in the first portion 491 of the first straightening plate 49b, a second through hole J formed in the second portion 492 of the first straightening plate 49b, a second straightening plate 50 Do not flow into the through holes, etc. formed in the
  • the coating processing section 4 includes a straightening member 40. As shown in FIGS. 7 and 8, the straightening member 40 is illustrated in a simplified manner.
  • the straightening member 40 is arranged inside the suction tube 461 .
  • the straightening member 40 is fixed inside the suction pipe 461 so that its position does not change even if the suction space V2 inside the suction pipe 461 is decompressed.
  • the straightening member 40 can be fixed within the suction tube 461 by, for example, a holding mechanism or a supporting mechanism.
  • the rectifying member 40 is positioned between the second substrate fixing portion 48 provided at the upper end of the suction tube 461 and the suction mechanism 462 connected to the lower end of the suction tube 461. are placed.
  • the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. It is located apart from the second end surface T2. That is, when the slurry M supplied to the first end face T1 side of the porous base material 1 is sucked from the second end face T2 side of the porous base material 1, the rectifying member 40 moves toward the second end face T2 of the porous base material 1. It is located on the side of the end face T2 and is spaced apart from the second end face T2 of the porous substrate 1 .
  • the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. At least part of the central region T22 of the porous substrate 1 is covered, and at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1 is exposed.
  • the rectifying member 40 covers at least a part of the central region T22 of the second end surface T2 of the porous substrate 1
  • the porous substrate is in a state where the suction pipe 461 is at the slurry suction position shown in FIG. 1 and the rectifying member 40 in plan view from the axial direction X of the porous substrate 1, the portion of the rectifying member 40 other than the through holes is the center of the second end surface T2 of the porous substrate 1. It means overlapping with at least part of the region T22.
  • the rectifying member 40 may cover the entire central region T22 of the second end surface T2 of the porous substrate 1, or may cover a part of the central region T22 of the second end surface T2 of the porous substrate 1. good too.
  • the rectifying member 40 may expose the entire outer edge region T21 of the second end surface T2 of the porous substrate 1, or expose a part of the outer edge region T21 of the second end surface T2 of the porous substrate 1. good too.
  • the rectifying member 40 covers at least a part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the rectifying member 40 exposes at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1.
  • the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
  • FIG. 11 is an enlarged view of the inside of the suction tube 461 provided with the straightening member 40a
  • FIG. 12 is a plan view of the straightening plate 49a provided in the straightening member 40a
  • 11 is an enlarged view of the inside of the suction pipe 461 at the slurry suction position shown in FIG.
  • the rectifying member 40a is used as the rectifying member 40.
  • the straightening member 40a includes a straightening plate 49a.
  • the rectifying member 40a may be composed of the rectifying plate 49a, or may have a member other than the rectifying plate 49a as long as the effect of the rectifying member 40a, which will be described later, is exhibited.
  • the material of the current plate 49a is, for example, resin, ceramics, metal, or the like.
  • the thickness of the current plate 49a can be adjusted as appropriate, and is, for example, 1 mm or more and 15 mm or less, preferably 1 mm or more and 5 mm or less.
  • the thickness of the current plate 49a may be constant or may not be constant.
  • both the minimum value and the maximum value of the thickness of the rectifying plate 49a are preferably within the above ranges.
  • the current plate 49a is arranged inside the suction pipe 461. As shown in FIG. 11, the current plate 49a is arranged inside the suction pipe 461. As shown in FIG. The straightening plate 49a is fixed inside the suction pipe 461 so that its position does not change even if the suction space V2 inside the suction pipe 461 is decompressed.
  • the straightening plate 49a is held by, for example, a holding mechanism (for example, a chuck mechanism (eg, hand chuck) provided on the inner wall of the suction tube 461 that grips the outer edge of the straightening plate 49a), or a supporting mechanism (eg, It can be fixed in the suction tube 461 by a support rod provided between the straightening plate 49 a and the suction mechanism 462 and supporting the surface of the straightening plate 49 a on the side of the suction mechanism 462 .
  • a holding mechanism for example, a chuck mechanism (eg, hand chuck) provided on the inner wall of the suction tube 461 that grips the outer edge of the straightening plate 49a
  • a supporting mechanism eg, It can be fixed in the suction tube 461 by a support rod provided between the straightening plate 49 a and the suction mechanism 462 and supporting the surface of the straightening plate 49 a on the side of the suction mechanism 462 .
  • the straightening plate 49a is arranged between the second substrate fixing portion 48 provided at the upper end of the suction tube 461 and the suction mechanism 462 connected to the lower end of the suction tube 461. ing.
  • the rectifying plate 49a moves toward the second end surface T2 of the porous substrate 1 and moves toward the second end surface T2 of the porous substrate 1. As shown in FIG. It is located apart from the end surface T2. That is, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying plate 49a moves toward the second end surface T2 of the porous substrate 1. It is located on the side of the end face T2 and is spaced apart from the second end face T2 of the porous substrate 1 .
  • the distance between the current plate 49a and the second end surface T2 of the porous substrate 1 becomes the distance D2a.
  • the distance D2a is the distance between the second end face T2 side of the current plate 49a and the second end face T2 of the porous substrate 1 .
  • the main surface of the current plate 49a on the second end surface T2 side is substantially parallel to the second end surface T2 of the porous substrate 1.
  • the term “substantially parallel” means that the angle formed by two target surfaces is preferably 0° or more and 10° or less, more preferably 0° or more and 5° or less. In addition, parallel is also included in “substantially parallel.”
  • the rectifying plate 49a includes an annular (for example, annular) first portion 491, a second portion 492 positioned inside the first portion 491, and a second portion 492 positioned outside the first portion 491. and an annular (eg, toric) third portion 493 .
  • the first portion 491 of the straightening plate 49a is formed with an elongated first through hole G extending in the circumferential direction of the first portion 491.
  • a plan view shape of the first through hole G is an elongated shape having a width W.
  • the plan view shape and number of the first through holes G can be changed as appropriate.
  • the planar shape of the first through hole G may be, for example, circular, elliptical, square, rectangular, or a rectangular shape with rounded corners.
  • the number of first through holes G may be one, or two or more.
  • the number of first through holes G in this embodiment is four.
  • the second portion 492 of the rectifying plate 49a is not formed with through holes, but may be formed with through holes (hereinafter referred to as "second through holes").
  • the second portion 492 of the current plate 49a covers at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the first portion 491 of the current plate 49a.
  • the formed first through-hole G exposes at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1 .
  • the second portion 492 of the current plate 49a covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1
  • the suction pipe 461 is in the slurry suction position shown in FIG. , when the second end surface T2 of the porous substrate 1 and the current plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, the second end surface T2 of the porous substrate 1 is shown in the plan view of the current plate 49a). is projected), as shown in FIGS. It means overlapping with a part.
  • the second portion 492 of the straightening plate 49a When the second portion 492 of the straightening plate 49a does not have a second through hole, the second portion 492 of the straightening plate 49a covers the entire central region T22 of the second end surface T2 of the porous substrate 1, When the second portion 492 of the straightening plate 49a has the second through hole, the second portion 492 of the straightening plate 49a covers part of the central region T22 of the second end surface T2 of the porous substrate 1. .
  • the first through holes G formed in the first portion 491 of the rectifying plate 49a expose at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1'' means that the suction tube 461 is 8, when the second end surface T2 of the porous substrate 1 and the rectifying plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, a plan view of the rectifying plate 49a shows a porous structure).
  • the first through hole G formed in the first portion 491 of the rectifying plate 49a is located at the second end surface T2 of the porous substrate 1). It means overlapping with at least part of the outer edge region T21 of the two end surfaces T2.
  • the second portion 492 of the rectifying plate 49a covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow through the radially inner portion of the porous substrate 1.
  • the first through holes G formed in the first portion 491 of the current plate 49a expose at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1, the porous substrate The radially outer portion of 1 facilitates air flow.
  • the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
  • FIG. 13 is an enlarged view of the inside of the suction pipe 461 provided with the straightening member 40b
  • FIG. 14 is a plan view of the first straightening plate 49b provided in the straightening member 40b
  • FIG. 15 is a plan view of the straightening member 40b.
  • 2 is a plan view of a second rectifying plate 50 provided in the .
  • 13 is an enlarged view of the inside of the suction pipe 461 at the slurry suction position shown in FIG.
  • a rectifying member 40b is used as the rectifying member 40.
  • the straightening member 40b includes a first straightening plate 49b and a second straightening plate 50.
  • the rectifying member 40b may be composed of the first rectifying plate 49b and the second rectifying plate 50, or other than the first rectifying plate 49b and the second rectifying plate 50 as long as the effect of the rectifying member 40b described later is exhibited. You may have a member of.
  • the material of the first current plate 49b is, for example, resin, ceramics, metal, or the like.
  • the thickness of the first current plate 49b can be adjusted as appropriate, and is, for example, 1 mm or more and 15 mm or less, preferably 1 mm or more and 5 mm or less.
  • the thickness of the first current plate 49b may be constant or may not be constant. If the thickness of the first current plate 49b is not constant, both the minimum value and the maximum value of the thickness of the first current plate 49b are preferably within the above ranges.
  • the first current plate 49b is arranged inside the suction pipe 461.
  • the first straightening plate 49b is fixed inside the suction pipe 461 so that its position does not change even if the pressure in the suction space V2 inside the suction pipe 461 is reduced.
  • the first straightening plate 49b is, for example, supported by a holding mechanism (eg, a chuck mechanism (eg, hand chuck) provided on the inner wall of the suction tube 461 that grips the outer edge of the first straightening plate 49b).
  • a mechanism for example, a support rod provided between the first straightening plate 49b and the suction mechanism 462 and supporting the surface of the first straightening plate 49b on the side of the suction mechanism 462).
  • the first straightening plate 49b is located between the second substrate fixing portion 48 provided at the upper end of the suction pipe 461 and the suction mechanism 462 connected to the lower end of the suction pipe 461. are placed.
  • the first rectifying plate 49b moves toward the second end surface T2 of the porous substrate 1. It is located apart from the second end surface T2. That is, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first straightening plate 49b It is located on the side of the second end face T2 and separated from the second end face T2 of the porous substrate 1 .
  • the distance between the first current plate 49b and the second end surface T2 of the porous substrate 1 becomes the distance D2b.
  • the distance D2b is the distance between the main surface of the first current plate 49b on the second end surface T2 side and the second end surface T2 of the porous substrate 1 .
  • the main surface of the first current plate 49b on the second end surface T2 side is substantially parallel to the second end surface T2 of the porous substrate 1 .
  • the meaning of "substantially parallel” is as described above.
  • the first straightening plate 49b differs from the straightening plate 49a according to the first embodiment in that the second portion 492 is formed with the second through holes J.
  • Other configurations of the first straightening plate 49b are the same as those of the straightening plate 49a, and in the first straightening plate 49b, the same members or portions as the straightening plate 49a are denoted by the same reference numerals as those of the straightening plate 49a.
  • the above description of the rectifying plate 49a also applies to the first rectifying plate 49b, unless otherwise specified.
  • the planar shape of the second through holes J is circular, and the number of the second through holes J is one.
  • the planar view shape of the second through hole J can be changed as appropriate, and may be other shapes such as an elliptical shape, a square shape, a rectangular shape, a rectangular shape with rounded corners, and the like.
  • the number of second through holes J can be changed as appropriate, and may be two or more.
  • the second through hole J is not continuous with the first through hole G formed in the first portion 491, but may be continuous.
  • planar view shape of the central region T22 and the planar view shape of the second through hole J are similar shapes.
  • the second through hole J exposes at least part of the central region T22 of the second end surface T2 of the porous substrate 1.
  • the second through-hole J exposes at least a part of the central region T22 of the second end surface T2 of the porous substrate 1” means that the suction tube 461 is porous when it is in the slurry suction position shown in FIG.
  • T2 of the substrate 1 and the first current plate 49b are viewed from the axial direction X of the porous substrate 1 (for example, the second end surface of the porous substrate 1 is shown in the plan view of the first current plate 49b).
  • T2 as shown in FIGS. 13 and 14, the second through hole J overlaps at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1.
  • the outline of the second end surface T2 and the outline of the central region T22 that is, the boundary line L2 projected onto the plan view of the first current plate 49b are indicated by dotted lines and chain double-dashed lines, respectively.
  • the second through hole J may expose the entire central region T22 of the second end surface T2 of the porous substrate 1, or expose a portion of the central region T22 of the second end surface T2 of the porous substrate 1. You may let When the second through hole J exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1, the second portion 492 of the first current plate 49b Cover the rest of the central region T22 of T2.
  • the second through-hole J exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1, and the second portion 492 of the first straightening plate 49b exposes the second end surface of the porous substrate 1.
  • the phrase "covering the remainder of the central region T22 of T2" means that the second end surface T2 of the porous substrate 1 and the first straightening plate 49b are covered with the porous substrate while the suction pipe 461 is in the slurry suction position shown in FIG. 1 (for example, when the second end surface T2 of the porous substrate 1 is projected onto the plan view of the first current plate 49b), as shown in FIGS.
  • the hole J overlaps with a part of the central region T22 of the second end surface T2 of the porous substrate 1, and the portion of the second portion 492 of the first current plate 49b other than the second through hole J overlaps with the porous substrate. It means overlapping with the rest of the central region T22 of the second end face T2 of No. 1.
  • the planar shape of the central region T22 and the second through hole J is formed with a predetermined width along the outline of the second portion 492 so that the second portion 492 of the first current plate 49b has a similar shape to the shape in plan view. It is preferable that That is, it is preferable that the planar view shape of the second portion 492 of the first current plate 49b other than the second through hole J is annular (for example, annular).
  • the width of the portion other than the second through hole J in the second portion 492 of the first current plate 49b is constant. It may be, or it may not be constant.
  • the material of the second current plate 50 is, for example, resin, ceramics, metal, or the like.
  • the thickness of the second current plate 50 can be adjusted as appropriate, and is, for example, 1 mm or more and 15 mm or less, preferably 1 mm or more and 5 mm or less.
  • the thickness of the second current plate 50 may be constant or may not be constant. When the thickness of the second current plate 50 is not constant, both the minimum value and the maximum value of the thickness of the second current plate 50 are preferably within the above ranges.
  • the second current plate 50 is arranged inside the suction pipe 461 .
  • the second straightening plate 50 is fixed inside the suction pipe 461 so that its position does not change even if the pressure in the suction space V2 inside the suction pipe 461 is reduced.
  • the second rectifying plate 50 is, for example, a connecting member that connects the first rectifying plate 49b and the second rectifying plate 50 (for example, a connecting member that connects the third portion 493 of the first rectifying plate 49b and the second rectifying plate 50).
  • member 70 see FIG.
  • the connecting member 70 is omitted.
  • the connecting member 70 overlaps a part of the first through hole G formed in the first portion 491 of the first rectifying plate 49b.
  • the area of the part of the first through hole G that overlaps with the connecting member 70 is preferably 20% or less, more preferably 10% or less, and 5% or less of the area of the first through hole G. is even more preferred. In this case, since the connecting member 70 does not interfere with the flow of air passing through the first through holes G, the effect of the rectifying member 40b, which will be described later, can be further improved.
  • the lower limit of the area of the portion of the first through-hole G that overlaps the connecting member 70 can be appropriately adjusted in consideration of the strength of the connecting member 70 and the like.
  • the "area of the first through holes G" is means the total area of
  • “the area of the first through-hole G” is the area of the first through-hole G when viewed from the axial direction X of the porous substrate 1 in plan view.
  • the second straightening plate 50 is arranged between the first straightening plate 49b and the suction mechanism 462 connected to the lower end of the suction pipe 461. As shown in FIG. That is, the second straightening plate 50 is arranged on the side opposite to the second end face T2 of the porous substrate 1 with respect to the first straightening plate 49b. This positional relationship does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second rectifying plate 50 moves toward the first rectifying plate 49b. On the other hand, it is located on the side opposite to the second end surface T2 of the porous substrate 1 .
  • the distance between the first rectifying plate 49b and the second rectifying plate 50 is the distance D3.
  • the distance D3 is the distance between the main surface of the first straightening plate 49b on the second straightening plate 50 side and the main surface of the second straightening plate 50 on the first straightening plate 49b side.
  • the distance D3 does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first rectifying plate 49b and the second rectifying plate 50 The distance is distance D3.
  • the main surface of the second current plate 50 on the second end surface T2 side is substantially parallel to the second end surface T2 of the porous substrate 1 .
  • the meaning of "substantially parallel” is as described above.
  • the second current plate 50 is not formed with through holes, but may be formed with through holes.
  • the second current plate 50 covers at least part of the second through holes J. As shown in FIGS. 13 to 15, the second current plate 50 covers at least part of the second through holes J. As shown in FIGS. 13 to 15, the second current plate 50 covers at least part of the second through holes J. As shown in FIGS. 13 to 15, the second current plate 50 covers at least part of the second through holes J.
  • the second straightening plate 50 covers at least part of the second through hole J means that the first straightening plate 49b and the second straightening plate 50 are in a state where the suction pipe 461 is at the slurry suction position shown in FIG. is viewed from the axial direction X of the porous substrate 1 (for example, when the second straightening plate 50 is projected on the plan view of the first straightening plate 49b, or when the second straightening plate 50 is projected on the plan view of the second straightening plate 50, the second 13 to 15, the portion of the second current plate 50 other than the through hole overlaps with at least a portion of the second through hole J when the through hole J is projected.
  • the outline of the second straightening plate 50 projected onto the plan view of the first straightening plate 49b is indicated by a dotted line.
  • the outline of the second through hole J projected onto the plan view of the second current plate 50 is indicated by a dotted line.
  • the second current plate 50 When the second current plate 50 does not have a through hole, the second current plate 50 covers the entire second through hole J, and when the second current plate 50 has a through hole, the second current plate 50 covers the second through hole J. The current plate 50 partially covers the second through hole J. As shown in FIG.
  • the outline of the second flow plate 50 is preferably positioned outside the outline of the second through hole J, as shown in FIGS.
  • the opening area of the second straightening plate 50 is adjusted so that the entire second through hole J becomes the second straightening plate. It is also possible to cover a part of the second through hole J with the second current plate 50 .
  • the outline of the second straightening plate 50 is positioned inside the outline of the second portion 492 of the first straightening plate 49b. preferably.
  • the second rectifying plate 50 does not interfere with the flow of air passing through the first through holes G, so that the effect of the rectifying member 40b, which will be described later, can be further improved.
  • the second through hole J formed in the first straightening plate 49b exposes at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the second straightening plate 50 serves as the first straightening plate. Since at least a part of the second through hole J formed in the plate 49b is covered, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the first through holes G expose at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1. FIG.
  • the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
  • the straightening member 40b By arranging on the end surface T2 side, the following effects are exhibited.
  • the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a side, a turbulent flow occurs between the second portion 492 of the rectifying plate 49a and the second end surface T2 of the porous substrate 1, causing variations in the length of the slurry layers N (particularly, Variation in length between slurry layers N formed on the inner portion of the porous substrate 1 in the radial direction may occur.
  • the distance between the rectifying plate 49a and the second end surface T2 of the porous substrate 1, which generates turbulent flow is defined as Dx.
  • the straightening member 49b since the second through hole J is formed in the second portion 492 of the first straightening plate 49b, the first straightening plate 49b and the second end surface T2 of the porous base material 1 is Dx, turbulent flow is less likely to occur between the second portion 492 of the first rectifying plate 49b and the second end face T2 of the porous substrate 1 .
  • the second rectifying plate 50 is arranged on the opposite side of the first rectifying plate 49b from the second end surface T2 of the porous substrate 1, so that the first rectifying plate 49b and the porous Even if the distance from the second end surface T2 of the substrate 1 is Dx, the distance between the second straightening plate 50 and the second end surface T2 of the porous substrate 1 is greater than Dx, and the second straightening plate A turbulent flow is less likely to occur between 50 and the second end surface T2 of the porous substrate 1 .
  • the variation in length between the slurry layers N (in particular, the porous substrate 1 It is possible to prevent the occurrence of variations in length between the slurry layers N formed in the radially inner portion of the .
  • the structure manufacturing method of the present invention comprises the following steps: (a) a step of supplying a slurry M containing raw materials for the functional layer to the first end surface T1 side of the porous substrate 1; and (b) a slurry supplied to the first end surface T1 side of the porous substrate 1.
  • M is sucked from the second end surface T2 side of the porous substrate 1, and is applied to the inner wall of the first cell of the porous substrate 1 from the first end surface T1 of the porous substrate 1 to the second end surface of the porous substrate 1.
  • a step of forming a slurry layer N that extends toward T2 and does not reach the second end face T2 of the porous substrate 1 is included.
  • the structure manufacturing method of the present invention can be implemented by the structure manufacturing apparatus 100.
  • steps (a) and (b) are performed by the coating processing section 4 .
  • the operation of the coating processor 4 is controlled by the controller 3 .
  • the end face S1 is the first end face T1
  • the end face S2 is the second end face T2
  • the cell 13a is the first cell
  • the cell 13b is the second cell.
  • the base material loading process is performed.
  • the porous substrate 1 is loaded into the coating processing section 4 .
  • the control unit 3 controls the operation of the transport mechanism 222 to carry the porous substrate 1 placed on the placement unit 211 into the coating processing unit 4 .
  • the base material holding process is performed.
  • the porous substrate 1 carried into the coating processing section 4 is held by the substrate holding section 41 .
  • the porous substrate 1 carried into the coating processing section 4 by the transport mechanism 222 may be held by the transport mechanism 222 as it is.
  • the transport mechanism 222 functions as the substrate holder 41 .
  • the nozzle moving process and the suction pipe moving process are performed.
  • the order of the nozzle moving process and the suction tube moving process is not particularly limited. After the nozzle moving process, the suction tube moving process may be performed, after the suction tube moving process, the nozzle moving process may be performed, or the nozzle moving process and the suction tube moving process may be performed at the same time. good.
  • the nozzle moving mechanism 43 moves the nozzle 422 from the standby position shown in FIG. 7 to the slurry supply position shown in FIG.
  • the control unit 3 controls the operation of the nozzle moving mechanism 43 to control the timing of moving the nozzle 422 from the standby position to the slurry supply position, the timing of moving the nozzle 422 from the slurry supply position to the standby position, and the like.
  • a storage space V1 is formed in which the slurry M supplied to the T1 side can be stored.
  • the end portion of the porous substrate 1 on the side of the first end surface T1 that has entered the jig 44 is fixed inside the jig 44 by the first substrate fixing portion 45 .
  • the first base material fixing part 45 has, for example, a chuck mechanism such as a balloon type chuck.
  • the control unit 3 controls the operation of the first base material fixing unit 45, and determines the timing and fixing of the end of the porous base material 1 that has entered the jig 44 on the side of the first end surface T1 in the jig 44.
  • control unit 3 controls the operation of the first base material fixing unit 45, and when the end of the porous base material 1 on the first end surface T1 side enters the jig 44, After the end portion of the porous substrate 1 on the first end surface T1 side enters the jig 44 without expanding the balloon held by the balloon chuck, the balloon held by the balloon chuck is expanded by air pressure, and the jig is moved. The end portion of the porous substrate 1 on the first end surface T1 side that has entered the inside 44 is fixed inside the jig 44 .
  • the balloon held by the balloon-type chuck fills the space between the jig 44 and the end of the porous base material 1 on the first end surface T1 side that has entered the jig 44 without any gap, and the balloon is discharged from the storage space V1. Prevent the slurry M from leaking.
  • the nozzle moving mechanism 43 moves the nozzle 422 to change the relative position between the porous substrate 1 and the nozzle 422 .
  • the relative position between the porous substrate 1 and the nozzle 422 may be changed.
  • the suction tube moving mechanism 47 moves the suction tube 461 from the standby position shown in FIG. 7 to the slurry suction position shown in FIG.
  • the control unit 3 controls the operation of the suction tube moving mechanism 47, and controls the timing of moving the suction tube 461 from the standby position to the slurry suction position, the timing of moving the suction tube 461 from the slurry suction position to the standby position, and the like.
  • the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461 is fixed inside the suction pipe 461 by the second substrate fixing portion 48 .
  • the second base material fixing portion 48 has, for example, a chuck mechanism such as a balloon type chuck.
  • the control unit 3 controls the operation of the second base material fixing unit 48, and determines the timing and fixing of the second end surface T2 side end of the porous base material 1 that has entered the suction tube 461, in the suction tube 461.
  • control unit 3 controls the operation of the second base material fixing unit 48, and when the end of the porous base material 1 on the second end surface T2 side enters the suction tube 461, After the end portion of the porous substrate 1 on the second end surface T2 side enters the suction tube 461 without expanding the balloon of the balloon chuck, the balloon of the balloon chuck is expanded by the air pressure to open the suction tube. The end portion of the porous substrate 1 on the second end surface T2 side that has entered the inside of the suction tube 461 is fixed inside the suction tube 461 .
  • the balloon held by the balloon-type chuck fills the gap between the suction tube 461 and the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461, and seals the suction space V2. do. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, it does not flow into the straightening member 40 inside the suction tube 461.
  • the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 through through holes formed in the rectifying plate 49a in the suction tube 461 (for example, through the through holes of the rectifying plate 49a).
  • the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 and through the through holes formed in the first straightening plate 49 b and the second straightening plate 50 inside the suction tube 461 .
  • the suction tube moving mechanism 47 moves the suction tube 461 to change the relative position between the porous substrate 1 and the suction tube 461 .
  • the suction tube moving mechanism 47 moves the suction tube 461 to change the relative position between the porous substrate 1 and the suction tube 461 .
  • the relative positions of the porous substrate 1 and the suction tube 461 may be changed.
  • Step (a) is performed after the nozzle moving step and the suction tube moving step.
  • step (a) the slurry supply unit 42 supplies the slurry M to the first end surface T1 of the porous substrate 1 .
  • the slurry M supplied to the first end face T1 side of the porous substrate 1 is stored in the storage space V1.
  • the control unit 3 controls the operation of the slurry supply unit 42, and controls the timing of starting supply of the slurry M, the amount of supply of the slurry M, the timing of stopping the supply of the slurry M, and the like.
  • step (b) is performed.
  • step (b) the slurry suction part 46 sucks the slurry M supplied to the first end surface T1 side of the porous substrate 1 from the second end surface T2 side of the porous substrate 1, and the porous substrate 1 forming a slurry layer N on the inner walls of the first cells of the .
  • the suction mechanism 462 decompresses the suction space V2 inside the suction pipe 461 .
  • the slurry layer N is formed on the surface of the partition wall 12 on the cell 13a side.
  • the slurry layer N has a portion protruding from the surface of the partition wall 12 toward the cell 13a.
  • the slurry layer N may be composed only of a portion protruding from the surface of the partition wall 12 toward the cell 13a, or may have a portion present inside the partition wall 12 together with the portion. . Since the partition wall 12 is porous, the slurry layer N usually has a portion existing inside the partition wall 12 .
  • the slurry layer N may be composed only of the portion existing inside the partition wall portion 12 .
  • the slurry layer N does not reach the second end surface T2 of the porous substrate 1. That is, the length PN of the slurry layer N is smaller than the length P1 of the porous substrate 1 .
  • the length PN of the slurry layer N is preferably 10% or more and 90% or less, more preferably 20% or more and 80% or less of the length P1 of the porous substrate 1 .
  • the length PN of the slurry layer N is within the above range, the porous substrate 1 is easily uniformly coated with the slurry.
  • the control unit 3 controls the operation of the slurry suction unit 46 so that the slurry layer N does not reach the second end surface T2 of the porous substrate 1, and the timing of starting the pressure reduction of the suction space V2 in the suction pipe 461, Adjust the degree of decompression, the timing to stop decompression, etc.
  • the porous substrate is removed from the first end surface T1 of the porous substrate 1 so as not to reach the second end surface T2 of the porous substrate 1 by firing.
  • a catalyst layer extending toward the second end face T2 of the material 1 is formed on the surface of the partition wall portion 12 on the cell 13a side.
  • the catalyst layer has a portion protruding from the surface of the partition wall portion 12 toward the cell 13a.
  • the catalyst layer may consist only of a portion protruding from the surface of the partition wall 12 toward the cell 13a, or may have a portion existing inside the partition wall 12 together with the portion. Since the partition wall 12 is porous, the catalyst layer usually has a portion existing inside the partition wall 12 .
  • the catalyst layer may be composed only of the portion existing inside the partition wall portion 12 .
  • the straightening member 40 When the suction pipe 461 moves to the slurry suction position, the straightening member 40 is positioned on the second end face T2 side of the porous base material 1 and spaced from the second end face T2 of the porous base material 1 . That is, when the slurry M supplied to the first end face T1 side of the porous base material 1 is sucked from the second end face T2 side of the porous base material 1, the rectifying member 40 moves toward the second end face T2 of the porous base material 1. It is located on the side of the end face T2 and is spaced apart from the second end face T2 of the porous substrate 1 .
  • the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. At least part of the central region T22 of the porous substrate 1 is covered, and at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1 is exposed.
  • the rectifying member 40 covers at least a part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the rectifying member 40 exposes at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1.
  • the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
  • the rectifying plate 49a When the suction pipe 461 moves to the slurry suction position, the rectifying plate 49a is positioned on the second end face T2 side of the porous base material 1 and spaced apart from the second end face T2 of the porous base material 1 . Therefore, in the step (b), when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying plate 49a becomes porous. It is located on the side of the second end surface T2 of the base material 1 and spaced from the second end surface T2 of the porous base material 1 .
  • step (b) when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a At least part of the central region T22 of the one second end face T2 is covered, and at least part of the outer edge region T21 is exposed.
  • the second portion 492 of the straightening plate 49a covers at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1
  • the first portion 491 formed on the first portion 491 of the straightening plate 49a covers at least a portion of the central region T22.
  • 1 through-hole G exposes at least part of outer edge region T21 of second end surface T2 of porous substrate 1 .
  • the second portion 492 of the rectifying plate 49a covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow through the radially inner portion of the porous substrate 1.
  • the first through holes G formed in the first portion 491 of the current plate 49a expose at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1, the porous substrate The radially outer portion of 1 facilitates air flow.
  • the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
  • the first rectifying plate 49b is positioned on the second end face T2 side of the porous base material 1 and spaced apart from the second end face T2 of the porous base material 1 . That is, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first straightening plate 49b It is located on the side of the second end face T2 and separated from the second end face T2 of the porous substrate 1 .
  • the second straightening plate 50 is arranged on the side opposite to the second end surface T2 of the porous substrate 1 with respect to the first straightening plate 49b. This positional relationship does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second rectifying plate 50 moves toward the first rectifying plate 49b. On the other hand, it is located on the side opposite to the second end surface T2 of the porous substrate 1 .
  • the distance between the first rectifying plate 49b and the second rectifying plate 50 is the distance D3.
  • the distance D3 does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first rectifying plate 49b and the second rectifying plate 50 The distance is distance D3.
  • the second through hole J formed in the first straightening plate 49b exposes at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the second straightening plate 50 serves as the first straightening plate. Since at least a part of the second through hole J formed in the plate 49b is covered, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the first through holes G expose at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1. FIG.
  • the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
  • the straightening member 40b By arranging on the end surface T2 side, the following effects are exhibited.
  • the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a side, a turbulent flow occurs between the second portion 492 of the rectifying plate 49a and the second end surface T2 of the porous substrate 1, causing variations in the length of the slurry layers N (particularly, Variation in length between slurry layers N formed on the inner portion of the porous substrate 1 in the radial direction may occur.
  • the distance between the rectifying plate 49a and the second end surface T2 of the porous substrate 1, which generates turbulent flow is defined as Dx.
  • the straightening member 49b since the second through hole J is formed in the second portion 492 of the first straightening plate 49b, the first straightening plate 49b and the second end surface T2 of the porous base material 1 is Dx, turbulent flow is less likely to occur between the second portion 492 of the first rectifying plate 49b and the second end face T2 of the porous substrate 1 .
  • the second rectifying plate 50 is arranged on the opposite side of the first rectifying plate 49b from the second end surface T2 of the porous substrate 1, so that the first rectifying plate 49b and the porous Even if the distance from the second end surface T2 of the substrate 1 is Dx, the distance between the second straightening plate 50 and the second end surface T2 of the porous substrate 1 is greater than Dx, and the second straightening plate A turbulent flow is less likely to occur between 50 and the second end surface T2 of the porous substrate 1 .
  • the variation in length between the slurry layers N (in particular, the porous substrate 1 It is possible to prevent the occurrence of variations in length between the slurry layers N formed in the radially inner portion of the .
  • the radial direction of the porous substrate 1 is preferably 1 m/s or more and 10 m/s or less, more preferably 2 m/s or more and 5 m/s or less.
  • the radial direction of the porous substrate 1 is preferably 1 m/s or more and 30 m/s or less, more preferably 5 m/s or more and 15 m/s or less.
  • the porous substrate 1 on which the slurry layer N is formed may be dried and then fired as necessary. Thereby, the slurry layer N becomes a catalyst layer.
  • the drying temperature is, for example, 70° C. or more and 150° C. or less
  • the drying time is, for example, 0.2 hours or more and 3 hours or less
  • the firing temperature is, for example, 400° C. or more and 900° C. or less
  • the firing time is , for example, from 1 hour to 10 hours. Firing can be performed in an air atmosphere.
  • the process (a) may be performed without performing the suction tube moving process.
  • the suction tube moving step is performed during or after the step (a)
  • the step (b) is performed after the step (a) and the suction tube moving step.
  • the second portion 492 of the rectifying plate 49a does not have the second through hole, at least one of the central regions T22 covered by the second portion 492 of the rectifying plate 49a is provided from the viewpoint of further improving the above effect of the rectifying member 40a.
  • the area of the part is preferably 50% or more of the area of the central region T22, more preferably 60% or more, even more preferably 70% or more, and even more preferably 80% or more. It is preferably 90% or more, even more preferably 95% or more.
  • the upper limit is 100%.
  • the second portion 492 of the current plate 49a and the porous substrate 1 It prevents turbulent flow from occurring between the second end surface T2, and thus the length variation between the slurry layers N (especially, the slurry formed in the radially inner part of the porous substrate 1 From the viewpoint of preventing occurrence of variation in length between layers N, it is preferable that a second through hole is formed in the second portion 492 of the straightening plate 49a.
  • FIG. 16 shows an embodiment in which a second through hole is formed in the second portion 492 of the rectifying plate 49a.
  • a large number of round second through holes Q are formed in the second portion 492 of the current plate 49a.
  • the planar view shape of the second through hole Q can be changed as appropriate, and the planar view shape of the second through hole Q includes, for example, a circular shape, an elliptical shape, a square shape, a rectangular shape, and a rectangular shape with rounded corners. etc.
  • the number of second through holes Q can be changed as appropriate, and the number of second through holes Q may be one, or two or more.
  • the second through hole Q formed in the second portion 492 of the current plate 49a may be continuous with the first through hole G formed in the first portion 491 of the current plate 49a.
  • the diameter of the second through hole Q is, for example, 1 mm or more and 5 mm or less.
  • the diameter of the second through-hole Q means the diameter of the circle. means the diameter of the circle that
  • the second through hole Q When the second through hole Q is formed in the second portion 492 of the current plate 49a, the second through hole Q exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1.
  • the second through-hole Q exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1” means that the suction tube 461 is at the slurry suction position shown in FIG.
  • the second end face T2 of the material 1 and the straightening plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, when the second end face T2 of the porous substrate 1 is projected on the plan view of the straightening plate 49a ), as shown in FIG.
  • the outline of the second end surface T2 and the outline of the central region T22 that is, the boundary line L2 projected onto the plan view of the current plate 49a are indicated by dotted lines and chain double-dashed lines, respectively.
  • the second The area of the part of the central region T22 exposed by the through hole Q is preferably 10% or more and 50% or less, more preferably 20% or more and 40% or less, of the area of the central region T22.
  • the "area of the part of the central region T22 exposed by the second through holes Q" is the two It means the total area of the portion of the central region T22 exposed by the second through holes Q described above.
  • the area of at least a part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the rectifying plate 49a is reduced to the area of the outer edge region T21. It is preferably 50% or more of the area, more preferably 60% or more, still more preferably 70% or more, still more preferably 80% or more, and 90% or more. More preferably, it is 95% or more. The upper limit is 100%. "The area of at least a part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the straightening plate 49a or 49b" is two or more first portions 491 of the straightening plate 49a or 49b. When one through-hole G is formed, it means the total area of the portion of the outer edge region T21 exposed by the two or more first through-holes G.
  • the second portion 492 may be, for example, a supporting mechanism (for example, the second portion 492 provided between the second portion 492 and the suction mechanism 462).
  • the third part 493 can be fixed in the suction tube 461 by a support rod that supports the surface on the suction mechanism 462 side of the suction tube 461, and the third part 493 is, for example, a holding mechanism (for example, a third A chuck mechanism (e.g., hand chuck, etc.) that grips the outer edge of the third portion 493) or a support mechanism (e.g., the suction mechanism 462 side of the third portion 493 provided between the third portion 493 and the suction mechanism 462 It can be fixed within the aspiration tube 461 by means of a support rod supporting the surface of the .
  • a holding mechanism for example, a third A chuck mechanism (e.g., hand chuck, etc.) that grips the outer edge of the third portion 493) or a support mechanism (e.g., the suction mechanism 462 side of the third portion 493 provided between the third portion 493 and the suction mechanism 462
  • the current plate 49a or 49b may consist of only the second portion 492 .
  • the area of the part of the central region T22 exposed by the second through-holes Q is reduced from the viewpoint of further improving the above effect of the rectifying member 40a.
  • the ratio (the area of the part of the central region T22 exposed by the second through hole Q/the area of the central region T22) is the outer edge region T21 exposed by the first through hole G formed in the first portion 491 of the current plate 49a. (area of at least part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the current plate 49a/area of the outer edge region T21).
  • the distance D2a or D2b between the rectifying plate 49a or 49b and the second end surface T2 of the porous substrate 1 when the suction tube 461 is at the slurry suction position is , preferably 5 mm or more and 30 mm or less, more preferably 5 mm or more and 15 mm or less.
  • both the minimum value and the maximum value of the distance D2a or D2b are preferably within the above range.
  • the area of at least a part of the central region T22 exposed by the second through holes J is preferably 50% or more, more preferably 60% or more of the area of the central region T22. is more preferable.
  • the upper limit is 100%.
  • the area of at least a part of the central region T22 exposed by the second through holes J is 90% of the area of the central region T22. % or less, more preferably 80% or less.
  • the "area of at least a part of the central region T22 exposed by the second through holes J" is the two or more second through holes J. 2 means the total area of the portion of the central region T22 exposed by the through holes J.
  • the area of at least a portion of the second through hole J covered by the second current plate 50 is preferably 50% or more of the area of the second through hole J.
  • the "area of the second through holes J" is means the total area of
  • the area of the second through hole J” means the area of the second through hole J when viewed from the axial direction X of the porous substrate 1 in plan view.
  • the second A through hole is preferably formed in the second straightening plate 50 so that the straightening plate 50 partially covers the second through hole J. As shown in FIG.
  • FIG. 17 shows an embodiment in which through holes are formed in the second current plate 50 .
  • a large number of circular through holes K are formed in the second current plate 50 .
  • the planar view shape of the through hole K can be changed as appropriate, and examples of the planar view shape of the through hole K include a circular shape, an elliptical shape, a square shape, a rectangular shape, a rectangular shape with rounded corners, and the like. .
  • the number of through-holes K can be changed as appropriate, and the number of through-holes K may be one, or two or more.
  • the diameter of the through hole K is, for example, 1 mm or more and 5 mm or less.
  • the diameter of the through-hole K means the diameter of the circle when the through-hole K is circular, and the diameter of the circle circumscribing the shape when the through-hole K has a shape other than a circle. do.
  • the through holes K are formed in the second straightening plate 50, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, , the occurrence of turbulent flow is effectively prevented, and thus the variation in length between the slurry layers N (in particular, the length between the slurry layers N formed in the radially inner portion of the porous substrate 1
  • the area of the part of the second through hole J covered by the second current plate 50 is 50% or more and 90% or less of the area of the second through hole J. , and more preferably 60% or more and 90% or less.
  • the distance D3 between the first rectifying plate 49b and the second rectifying plate 50 when the suction pipe 461 is at the slurry suction position is preferably 5 mm or more and 30 mm or less. It is preferably 5 mm or more and 15 mm or less. If the distance D3 is not constant, it is preferable that both the minimum value and the maximum value of the distance D3 are within the above ranges.
  • FIG. 18 is a plan view of a current plate 49a' according to a modification.
  • the outline of the second end face T2 and the outline of the central region T22 (that is, the boundary line L2) projected onto the plan view of the current plate 49a' are indicated by dotted lines and chain double-dashed lines, respectively. .
  • a straightening plate 49a' may be used instead of the straightening plate 49a.
  • the rectifying plate 49a' differs from the rectifying plate 49a in that a large number of circular through holes H are formed in the first portion 491 instead of the through holes G.
  • through holes G also applies to through holes H, unless otherwise specified.
  • the planar view shape of the through hole H is circular, but the planar view shape of the through hole H may be other shapes such as elliptical, square, rectangular, and rectangular with rounded corners. It may be a shape or the like.
  • the diameter of the through hole H is, for example, 1 mm or more and 4 mm or less.
  • the diameter of the through-hole H means the diameter of the circle when the through-hole H is circular, and the diameter of the circle circumscribing the shape when the through-hole H has a shape other than a circle. do.
  • the modified example 1A has the same effect as the above effect of the rectifying member 40a.
  • ⁇ Modification 1B> In the straightening member 40b, instead of the through holes G, a large number of circular through holes H may be formed in the first portion 491 of the first straightening plate 49b. The above description regarding the through hole H also applies to the modification 1B. Modification 1B has the same effect as the above effect of the rectifying member 40b.
  • FIG. 19 is an end view for explaining a modification in which a gap is formed between the suction tube 461 and the end of the porous substrate 1 on the second end face T2 side that has entered the suction tube 461.
  • FIG. . 19 is a plane perpendicular to the axial direction X of the porous substrate 1 in a state where the suction tube 461 is at the slurry suction position shown in FIG. 48 and an end view when the end portion on the second end face T2 side of the porous substrate 1 is cut.
  • a gap V3 may be formed between the second end surface T2 side end of the porous substrate 1 that has entered inside.
  • the second base material fixing part 48 does not fix the end of the porous base material 1 on the side of the second end surface T2 that has entered the suction tube 461 (for example, the second base material fixing part 48 has a balloon chuck, the gap V3 can be formed by not inflating the balloon).
  • the gap V3 is formed between the suction tube 461 and the end portion of the porous substrate 1 on the side of the second end surface T2 that has entered the suction tube 461, the porous substrate 1 on the side of the first end surface T1 is formed.
  • the air outside the suction tube 461 is rectified in the suction tube 461 along the outer peripheral surface of the porous substrate 1. It flows into through-holes formed in member 40 .
  • the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 and flows through the through holes (for example, the first portion 491) formed in the current plate 49a inside the suction tube 461.
  • the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 and through the through holes formed in the first straightening plate 49 b and the second straightening plate 50 inside the suction tube 461 .
  • FIG. 20 is a schematic partial end view showing the configuration of a coating processing section 4a according to a modification.
  • FIG. 20 shows the state when the porous substrate 1 is subjected to the coating process.
  • the same members or portions as the coating processing unit 4 are denoted by the same reference numerals as the coating processing unit 4.
  • the above description of the coating section 4 also applies to the coating section 4a, unless otherwise specified.
  • the jig 44 may be moved independently of the nozzle 422 by the jig moving mechanism 7. In this case, the jig 44 is not attached to the nozzle holder 431 .
  • FIG. 20 is as described above
  • FIG. 21 is a plan view of the first end face of the porous base material according to the modification
  • FIG. 22 is a plan view of the current plate according to the modification.
  • Modification 4 is an example in which the arrangement position of the current plate 49a is changed. Therefore, the configuration of the rectifying plate 49a in Modification 4 is the same as that described above, and the above description of the rectifying plate 49a also applies to Modification 4, unless otherwise specified.
  • the main surface of the current plate 49a on the side of the first end surface T1 is substantially parallel to the first end surface T1 of the porous substrate 1.
  • the meaning of "substantially parallel” is as described above.
  • the following steps are performed instead of the nozzle movement step.
  • the end portion of the porous substrate 1 on the side of the first end surface T1 is caused to enter the jig 44, and the porous substrate 1 is inserted into the jig 44.
  • a storage space V1 that enables storage of the supplied slurry M is formed on the first end face T1 side of the .
  • the lifting mechanism 432 lowers the nozzle holder 431 to bring the nozzle 422 closer to the porous substrate 1 and move it to the slurry supply position.
  • the slurry M is supplied from the nozzle 422 to the first end surface T1 of the porous substrate 1 at the slurry supply position.
  • the lifting mechanism 432 lifts the nozzle holder 431 to move the nozzle 422 away from the porous substrate 1 to the standby position.
  • the straightening plate 49a is arranged on the first end surface T1 side of the porous substrate 1 .
  • the rectifying plate 49a may be arranged by a rectifying plate moving mechanism (not shown) or manually.
  • the first end surface T1 of the porous substrate 1 includes an annular (for example, annular) outer edge region T11 located radially outside the first end surface T1 and an outer edge region T11 located radially outward of the first end surface T1. It is partitioned into a central region T12 located inside T11.
  • the boundary line L1 is a virtual line.
  • the openings of the cells 13a existing in the first end surface T1 are omitted.
  • the area of the central region T12 is preferably 40% or more and 90% or less, more preferably 65% or more and 85% or less, of the area of the first end surface T1.
  • the shape of the central region T12 and the shape of the first end face T1 are preferably similar shapes.
  • the shape of the central region T12 means the shape defined by the outline of the central region T12 (that is, the boundary line L1), and the shape of the first end face T1 means the shape defined by the outline of the first end face T1. means.
  • the outer edge region T11 is preferably formed with a predetermined width along the outline of the first end face T1 so that the shape of the central region T12 and the shape of the first end face T1 are similar. As long as the shape of the central region T12 and the shape of the first end face T1 are similar, the width of the outer edge region T11 may or may not be constant.
  • the current plate 49a includes a first annular (for example, annular) portion 491, a second portion 492 positioned inside the first portion 491, and a second portion 492 positioned outside the first portion 491. and an annular (eg, toric) third portion 493 .
  • the rectifying plate 49a in a state where the rectifying plate 49a is arranged on the first end surface T1 side of the porous substrate 1, the first end surface T1 of the porous substrate 1 and the rectifying plate 49a are aligned with the axis of the porous substrate 1.
  • the first end surface T1 of the porous substrate 1 of the straightening plate 49a is A portion overlapping with the outer edge region T11 is the first portion 491, and a portion overlapping with the central region T12 of the first end surface T1 of the porous substrate 1 is the second portion 492.
  • the outline of the first end face T1 and the outline of the central region T12 that is, the boundary line L1 projected onto the plan view of the current plate 49a are indicated by dotted lines and chain double-dashed lines, respectively.
  • the second portion 492 of the straightening plate 49a preferably does not have a through hole as in the present embodiment, but may have a through hole (hereinafter referred to as "second through hole").
  • second through hole a through hole
  • the above description regarding the second through hole also applies to Modification 4.
  • the second through-hole exposes part of the central region T12 of the first end surface T1 of the porous substrate 1.
  • the second through-hole exposes a part of the central region T12 of the first end surface T1 of the porous substrate 1 means that the porous substrate is in a state where the suction pipe 461 is at the slurry suction position shown in FIG. 1 and the straightening plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, when the first end surface T1 of the porous substrate 1 is projected onto the plan view of the straightening plate 49a).
  • the area of the part of the central region T12 exposed by the second through holes is preferably 50% or less of the area of the central region T12, and 40% or less. is more preferably 30% or less, even more preferably 20% or less, even more preferably 10% or less, and even more preferably 5% or less.
  • the "area of the part of the central region T12 exposed by the second through holes" is the two or more second through holes. It means the total area of the portion of the central region T12 exposed by the through holes.
  • the second portion 492 of the current plate 49a covers at least part of the central region T12 of the first end surface T1 of the porous substrate 1, and the first through hole G formed in the first portion 491 of the current plate 49a At least part of the outer edge region T11 of the one end surface T1 is exposed.
  • the second portion 492 of the straightening plate 49a covers at least part of the central region T12 of the first end surface T1 of the porous substrate 1” means that the straightening plate 49a covers the first end surface T1 of the porous substrate 1.
  • the portion of the second portion 492 of the rectifying plate 49a other than the second through-hole is located at the center of the first end surface T1 of the porous substrate 1, as shown in FIG. It means that it overlaps with the region T12.
  • the second portion 492 of the current plate 49a When the second portion 492 of the current plate 49a does not have a second through hole, the second portion 492 of the current plate 49a covers the entire central region T12 of the first end surface T1 of the porous substrate 1, When the second portion 492 of the straightening plate 49a has the second through hole, the second portion 492 of the straightening plate 49a covers part of the central region T12 of the first end surface T1 of the porous substrate 1. .
  • the first through holes G formed in the first portion 491 of the current plate 49a expose at least part of the outer edge region T11 of the first end surface T1 of the porous substrate 1 means that the current plate 49a is porous.
  • the first end surface T1 of the porous substrate 1 and the rectifying plate 49a are arranged on the first end surface T1 side of the porous substrate 1 and viewed from the axial direction X of the porous substrate 1 (for example, the rectifying plate 22, when the first end face T1 of the porous substrate 1 is projected onto the plan view of the plate 49a, the first through holes G formed in the first portion 491 of the current plate 49a are aligned with the porous substrate. It means that it overlaps with at least part of the outer edge region T11 of the first end surface T1 of the material 1 .
  • the current plate 49a When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a When the rectifying plate 49a is arranged on the second end surface T2 side of the porous substrate 1, the same effect as when the rectifying plate 49a is arranged on the second end surface T2 side of the porous substrate 1 can be obtained.
  • the area of at least part of the central region T12 covered by the second portion 492 of the rectifying plate 49a is 50% or more of the area of the central region T12. preferably 60% or more, even more preferably 70% or more, even more preferably 80% or more, even more preferably 90% or more, 95% The above is even more preferable.
  • the upper limit is 100%.
  • the area of at least a part of the outer edge region T11 exposed by the first through holes G formed in the first portion 491 of the rectifying plate 49a is The area of the region T11 is preferably 50% or more, more preferably 60% or more, still more preferably 70% or more, even more preferably 80% or more, and 90% or more. It is more preferable that the ratio is 95% or more. The upper limit is 100%. "At least a part of the outer edge region T11 exposed by the first through holes G formed in the first portion 491 of the straightening plate 49a" is defined by two or more first through holes G formed in the first portion 491 of the straightening plate 49a. is formed, it means the total area of the portion of the outer edge region T21 exposed by the two or more first through holes G.
  • the straightening plate 49a and the porous substrate 1 are arranged in a state where the straightening plate 49a is arranged on the first end surface T1 side of the porous substrate 1.
  • a distance D1 from the first end face T1 is preferably 5 mm or more and 30 mm or less, and more preferably 5 mm or more and 15 mm or less.
  • the distance D1 is the distance between the first end surface T1 side main surface of the current plate 49a and the first end surface T1 of the porous substrate 1 . If the distance D1 is not constant, both the minimum value and the maximum value of the distance D1 are preferably within the above range.
  • FIGS. 23 to 25 are schematic partial end views showing the configuration of the coating processing section 4b according to the modification.
  • 23 shows the state before the slurry supply process and the coating process are performed on the porous substrate 1
  • FIG. 24 shows the state when the slurry supply process is performed on the porous substrate 1.
  • FIG. 25 show the state when the porous substrate 1 is subjected to the coating process.
  • the coating processing unit 4b does not include the slurry supply unit 42, the nozzle moving mechanism 43, and the first substrate fixing unit 45, and is provided with a storage tank 42b in which the slurry M is stored. , and is different from the coating processing section 4 .
  • the same members or portions as the coating processing section 4 are denoted by the same reference numerals as in the coating processing section 4.
  • the above description of the coating section 4 also applies to the coating section 4b, unless otherwise specified.
  • the storage tank 42b is installed below the porous substrate 1 held by the substrate holding portion 41. As shown in FIG. 23, the storage tank 42b is installed below the porous substrate 1 held by the substrate holding portion 41. As shown in FIG. 23, the storage tank 42b is installed below the porous substrate 1 held by the substrate holding portion 41.
  • the substrate holding part 41 holds the porous substrate 1 so that the first end face T1 of the porous substrate 1 faces the reservoir 42b side (lower side in FIG. 23).
  • the step (a) is performed after the substrate holding step, without performing the nozzle moving step and the suction tube moving step.
  • step (a) the substrate holder 41 lowers the porous substrate 1 .
  • the end portion of the porous substrate 1 on the first end surface T1 side is immersed in the slurry M in the storage tank 42b, and the porous substrate 1 on the first end surface T1 side is , slurry M is supplied. Therefore, in Modification 5, the base material holding part 41 and the storage tank 42b function as a slurry supply part that supplies the slurry M to the first end surface T1 side of the porous base material 1 .
  • the base material holding part 41 raises the porous base material 1 so that the end portion of the porous base material 1 on the first end face T1 side is is taken out from the slurry M in the storage tank 42 b , the porous substrate 1 is inverted, and the porous substrate 1 is moved above the suction tube 461 .
  • the second end surface T2 of the porous substrate 1 held above the suction tube 461 by the substrate holding portion 41 faces the suction tube 461 side (lower side in FIG. 25). .
  • the porous substrate 1 may be turned over.
  • the control unit 3 controls the operation of the substrate holding unit 41, and determines the timing and duration of immersion of the end of the porous substrate 1 on the first end surface T1 side in the slurry M in the storage tank 42b ( supply amount), the timing of removing the end of the porous substrate 1 on the first end face T1 side from the slurry M in the storage tank 42b, the timing of turning over the porous substrate 1, Controls the timing of upward movement.
  • a suction tube moving step is performed.
  • the suction tube moving mechanism 47 moves the suction tube 461 from the standby position shown in FIGS. 23 and 24 to the slurry suction position shown in FIG.
  • Example 1 A cylindrical porous substrate 1 shown in FIGS. 1 to 4 was prepared.
  • the length of the porous substrate 1 was 127 mm
  • the diameter of the porous substrate 1 was 118 mm
  • the total number of cells per square inch of the porous substrate 1 was 300 cells per square inch.
  • a slurry M containing raw materials for the catalyst layer was prepared.
  • the viscosity of slurry M is 500 mPa s when measured using a cone and plate type viscometer at a temperature of 25 ° C. and a shear rate of 380 s -1 , and a shear rate of 4 s -1 . was 5500 mPa ⁇ s.
  • a structure manufacturing apparatus 100 shown in FIGS. 5 to 8 was prepared.
  • the rectifying member 40 the rectifying plate 49a shown in FIGS. 11 and 12 was used.
  • the diameter of the second portion 492 of the current plate 49a was adjusted to 108.4 mm, and the width W of the first through hole G was adjusted to 5 mm.
  • the first portion 491 of the rectifying plate 49a and the outer edge region T21 of the second end surface T2 are 16% of the area of the second end surface T2
  • the second portion 492 of the rectifying plate 49a and the central region T22 of the second end surface T2 are the second end surface T2. It was adjusted to 84% of the area of the end surface T2.
  • the area of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the current plate 49a is 97% of the area of the outer edge region T21, and the central region T22 covered by the second portion 492 of the current plate 49a. was adjusted to 100% of the central region T22.
  • the distance D2a between the current plate 49a and the second end face T2 of the porous substrate 1 when the suction pipe 461 is at the slurry suction position was adjusted to 6 mm.
  • the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, and the first cell of the porous substrate 1 is A slurry layer N that did not reach the second end surface T2 of the porous substrate 1 was formed on the inner wall.
  • the inner part of the porous substrate 1 in the radial direction is the first
  • the flow velocity of air in the portion on the side of the first end surface T1 is 3.8 m/s
  • the flow velocity of air in the portion on the side of the first end surface T1 among the radially outer portions of the porous substrate 1 is 14 m/s. Met.
  • the porous substrate 1 is cut along a plane parallel to the axial direction X, and the radial outer portion Q1 of the porous substrate 1 (as shown in FIG. 26, the left portion (5% ) and the right portion (5%)) were measured, and the average value was obtained. Similarly, the length of 36 slurry layers N in the radially inner portion Q2 of the porous substrate 1 (the central portion (90%) of the porous substrate 1 as shown in FIG. 26) is measured. and calculated the average value.
  • Example 2 As shown in FIG. 19, the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461 is not fixed by the second substrate fixing portion 48, and the suction tube 461 and the suction tube 461 are separated from each other. The same operation as in Example 1 was performed, except that a gap was formed between the second end face T2 side end of the porous substrate 1 that had entered inside.
  • the air flow velocity in the portion on the first end surface T1 side is 3.1 m/s
  • the air flow velocity in the portion on the first end surface T1 side of the radially outer portion of the porous substrate 1 is 9 .2 m/s.
  • Example 1 The same operation as in Example 1 was performed, except that the current plate 49a was not used.
  • the air flow velocity in the portion on the first end surface T1 side is 14.6 m/s
  • the air flow velocity in the portion on the first end surface T1 side of the radially outer portion of the porous substrate 1 is 15 m/s. .3 m/s.
  • Example 2 The same operation as in Example 2 was performed, except that the current plate 49a was not used.
  • the flow velocity of air in the portion on the side of the first end surface T1 is 12.1 m/s
  • the flow velocity of air in the portion on the side of the first end surface T1 among the radially outer portions of the porous substrate 1 is 11 m/s. .1 m/s.
  • SYMBOLS 1 Porous base material, 11... Cylindrical part, 12... Partition part, 13... Cell, 13a... First cell, 13b... Second cell, T1 (S1) ... first end face, T11 ... outer edge region of the first end face, T12 ... central region of the first end face, T2 (S2) ... second end face, T21 ... outer edge region of the second end face , T22... Central region of the second end surface, 100... Structure manufacturing apparatus, 2... Base material processing unit, 3... Control unit, 4... Coating processing unit, 40... Rectification Members 40a... Straightening member according to the first embodiment 40b... Straightening member according to the second embodiment 41... Base material holding part 42... Slurry supply part 43... Nozzle Moving mechanism 44 Jig 45 First base material fixing part 46 Slurry suction part 47 Suction tube moving mechanism 48 Second base material fixing part 49a Straightening plate 49b First straightening plate 50 Second straightening plate G Through hole M Slurry N Slurry layer

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Abstract

The purpose of the present invention is to provide an apparatus and a method whereby it becomes possible to reduce the difference between the length of a slurry layer formed in an inside part of a wall-flow-type substrate when observed in the direction of diameter of the wall-flow-type substrate and the length of the slurry layer formed in an outside part of the wall-flow-type substrate when observed in the direction of diameter of the wall-flow-type substrate. In the apparatus and the method, when a slurry M supplied to a first edge surface (T1) of a porous substrate (1) is absorbed from the side of a second edge surface (T2) of the porous substrate (1), a flow straightening member (40) that covers a center region (T12, T22) of either one of the first edge surface (T1) or the second edge surface (T2) and exposes at least a portion of an outer edge region (T11, T21) of the edge surface is provided on the side of the first edge surface (T1) or the second edge surface (T2).

Description

構造体を製造する装置及び方法Apparatus and method for manufacturing structures
　本発明は、多孔質基材と該多孔質基材に設けられた機能層（例えば、触媒層又はその前駆層）とを備える構造体（例えば、排ガス浄化用触媒又はその前駆体）を製造する装置及び方法に関する。 The present invention produces a structure (e.g., an exhaust gas purifying catalyst or its precursor) comprising a porous substrate and a functional layer (e.g., a catalyst layer or its precursor layer) provided on the porous substrate. Apparatus and method.
　従来、基材の一方の端面側に、触媒層の原料を含有するスラリーを供給し、供給されたスラリーを基材の他方の端面側から吸引し、基材にスラリー層を形成する、排ガス浄化用触媒の製造装置及び製造方法が知られている（例えば、特許文献１）。 Conventionally, a slurry containing a raw material for a catalyst layer is supplied to one end surface of a base material, and the supplied slurry is sucked from the other end surface side of the base material to form a slurry layer on the base material. A manufacturing apparatus and a manufacturing method for a catalyst for industrial use are known (for example, Patent Document 1).
　一方、排ガス浄化用触媒の基材として、ウォールフロー型基材が知られている。ウォールフロー型基材は、多孔質の筒状部と、筒状部内に設けられた多孔質の隔壁部と、隔壁部で仕切られたセルとを備える。ウォールフロー型基材におけるセルは、排ガス流入側の端部が開口し、排ガス流出側の端部が閉塞する排ガス流入側セルと、排ガス流出側の端部が開口し、排ガス流入側の端部が閉塞する排ガス流出側セルとで構成されている。ウォールフロー型基材において、排ガス流入側セルの排ガス流入側の端部（開口部）から流入した排ガスは、多孔質の隔壁部を通過して、排ガス流出側セルの排ガス流出側の端部（開口部）から流出する。この際、排ガス中の粒子状物質（ＰＭ：Ｐａｒｔｉｃｕｌａｔｅ　Ｍａｔｔｅｒ）は、隔壁部の細孔内に捕集される。したがって、ウォールフロー型基材は、ＰＭ捕集機能を有するフィルタ、例えば、ガソリンエンジン用のパティキュレートフィルタ（ＧＰＦ：Ｇａｓｏｌｉｎｅ　Ｐａｒｔｉｃｕｌａｔｅ Ｆｉｌｔｅｒ）又はディーゼルエンジン用のパティキュレートフィルタ（ＤＰＦ：Ｄｉｅｓｅｌ　Ｐａｒｔｉｃｕｌａｔｅ　Ｆｉｌｔｅｒ）として有用である。 On the other hand, wall-flow type substrates are known as substrates for exhaust gas purification catalysts. The wall-flow type substrate includes a porous tubular portion, porous partition walls provided in the tubular portion, and cells partitioned by the partition walls. The cells in the wall flow type substrate are divided into an exhaust gas inflow side cell whose end on the exhaust gas inflow side is open and an end on the exhaust gas outflow side is closed, and an exhaust gas inflow side cell whose end is open on the exhaust gas outflow side and is closed on the exhaust gas inflow side. It is composed of an exhaust gas outflow side cell that is closed. In the wall-flow type substrate, the exhaust gas that has flowed in from the exhaust gas inflow side end (opening) of the exhaust gas inflow side cell passes through the porous partition wall and reaches the exhaust gas outflow side end of the exhaust gas outflow side cell ( opening). At this time, particulate matter (PM) in the exhaust gas is trapped in the pores of the partition wall. Therefore, the wall flow type substrate is useful as a filter having a PM collection function, for example, a particulate filter for gasoline engines (GPF: Gasoline Particulate Filter) or a particulate filter for diesel engines (DPF: Diesel Particulate Filter). is.
特開２００６－１５２０５号公報Japanese Patent Application Laid-Open No. 2006-15205
　ウォールフロー型基材において、筒状部及び隔壁部はともに多孔質である。したがって、ウォールフロー型基材の一方の端面側にスラリーを供給し、供給されたスラリーをウォールフロー型基材の他方の端面側から吸引すると、ウォールフロー型基材の筒状部の外周面から空気が流入し、ウォールフロー型基材の径方向の外側部分における吸引力が、ウォールフロー型基材の径方向の内側部分における吸引力より低下する。 In the wall-flow type base material, both the tubular portion and the partition wall portion are porous. Therefore, when slurry is supplied to one end surface of the wall-flow substrate and the supplied slurry is sucked from the other end surface of the wall-flow substrate, the outer peripheral surface of the cylindrical portion of the wall-flow substrate Air flows in and the suction force at the radially outer portion of the wall-flow substrate is less than the suction force at the radially inner portion of the wall-flow substrate.
　ウォールフロー型基材において、排ガス流入側セルの内壁にスラリー層を形成する場合、ウォールフロー型基材の排ガス流入側の端面側にスラリーを供給する。ウォールフロー型基材の排ガス流入側の端面では、排ガス流入側セルの端部は開口しているが、排ガス流出側セルの端部は閉塞している。このため、ウォールフロー型基材の排ガス流入側の端面側に供給されたスラリーをウォールフロー型基材の排ガス流出側の端面側から吸引する際、吸引力がスラリーに伝わりにくく、排ガス流入側セルの内壁にスラリー層を形成しにくい。排ガス流出側セルの内壁にスラリー層を形成する場合も同様である。したがって、ウォールフロー型基材の径方向の外側部分における吸引力が、ウォールフロー型基材の径方向の内側部分における吸引力より低下すると、ウォールフロー型基材の径方向の外側部分に形成されるスラリー層の長さが、ウォールフロー型基材の径方向の内側部分に形成されるスラリー層の長さより顕著に短くなり、これにより、ウォールフロー型基材のＰＭ捕集機能が悪化する。 When forming a slurry layer on the inner wall of the exhaust gas inflow side cell in the wall flow type substrate, the slurry is supplied to the end surface of the wall flow type substrate on the exhaust gas inflow side. At the end face of the wall flow type substrate on the exhaust gas inflow side, the ends of the exhaust gas inflow side cells are open, but the ends of the exhaust gas outflow side cells are closed. Therefore, when the slurry supplied to the end surface of the exhaust gas inflow side of the wall-flow type substrate is sucked from the end surface side of the exhaust gas outflow side of the wall-flow type substrate, the suction force is less likely to be transmitted to the slurry, and the exhaust gas inflow side cell It is difficult to form a slurry layer on the inner wall of the The same applies to forming a slurry layer on the inner wall of the exhaust gas outflow side cell. Therefore, when the suction force at the radially outer portion of the wall-flow substrate is lower than the suction force at the radially inner portion of the wall-flow substrate, a The length of the slurry layer formed on the wall-flow substrate becomes significantly shorter than the length of the slurry layer formed on the radially inner portion of the wall-flow substrate, thereby degrading the PM trapping function of the wall-flow substrate.
　そこで、本発明は、多孔質基材と該多孔質基材に設けられた機能層（例えば、触媒層又はその前駆層）とを備える構造体（例えば、排ガス浄化用触媒又はその前駆体）を製造する装置及び方法であって、ウォールフロー型基材の径方向の内側部分に形成されるスラリー層の長さと、ウォールフロー型基材の径方向の外側部分に形成されるスラリー層の長さとの差を小さくすることができる装置及び方法を提供することを目的とする。 Therefore, the present invention provides a structure (e.g., an exhaust gas purification catalyst or its precursor) comprising a porous substrate and a functional layer (e.g., a catalyst layer or its precursor layer) provided on the porous substrate. An apparatus and method for manufacturing, wherein the length of the slurry layer formed on the radially inner portion of the wall-flow substrate and the length of the slurry layer formed on the radially outer portion of the wall-flow substrate It is an object of the present invention to provide an apparatus and method capable of reducing the difference in
　上記課題を解決するために、本発明は、構造体を製造する装置であって、
　前記構造体は、
　軸方向に延在する多孔質基材と、
　前記多孔質基材に設けられた機能層と、を備え、
　前記多孔質基材は、
　前記軸方向の一方側に位置する第１端面と、
　前記軸方向の他方側に位置する第２端面と、
　前記軸方向に延在し、前記第１端面側の端部が開口し、前記第２端面側の端部が閉塞する第１セルと、
　前記軸方向に延在し、前記第２端面側の端部が開口し、前記第１端面側の端部が閉塞する第２セルと、を備え、
　前記装置は、
　前記第１端面側に、前記機能層の原料を含有するスラリーを供給するスラリー供給部と、
　前記第１端面側に供給された前記スラリーを前記第２端面側から吸引し、前記第１セルの内壁に、前記第２端面に達しないスラリー層を形成するスラリー吸引部と、
　前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第１端面側又は前記第２端面側に配置され、前記第１端面又は前記第２端面のうち、中央領域の少なくとも一部を被覆し、外縁領域の少なくとも一部を露出させる整流部材と、を備える、前記装置を提供する。 In order to solve the above problems, the present invention provides an apparatus for manufacturing a structure,
The structure is
an axially extending porous substrate;
and a functional layer provided on the porous substrate,
The porous substrate is
a first end face positioned on one side in the axial direction;
a second end face located on the other side in the axial direction;
a first cell extending in the axial direction and having an open end on the first end surface side and a closed end on the second end surface side;
a second cell extending in the axial direction, having an open end on the second end face side and a closed end on the first end face side;
The device comprises:
a slurry supply unit that supplies a slurry containing raw materials for the functional layer to the first end face side;
a slurry suction part that sucks the slurry supplied to the first end face side from the second end face side and forms a slurry layer that does not reach the second end face on the inner wall of the first cell;
When the slurry supplied to the first end face side is sucked from the second end face side, the slurry is arranged on the first end face side or the second end face side, a rectifying member that covers at least a portion of the central region and exposes at least a portion of the outer edge region.
　また、本発明は、構造体を製造する方法であって、
　前記構造体は、
　軸方向に延在する多孔質基材と、
　前記多孔質基材に設けられた機能層と、を備え、
　前記多孔質基材は、
　前記軸方向の一方側に位置する第１端面と、
　前記軸方向の他方側に位置する第２端面と、
　前記軸方向に延在し、前記第１端面側の端部が開口し、前記第２端面側の端部が閉塞する第１セルと、
　前記軸方向に延在し、前記第２端面側の端部が開口し、前記第１端面側の端部が閉塞する第２セルと、を備え、
　前記方法は、以下の工程：
（ａ）前記第１端面側に、前記機能層の原料を含有するスラリーを供給する工程；及び
（ｂ）前記第１端面側に供給された前記スラリーを前記第２端面側から吸引し、前記第１セルの内壁に、前記第２端面に達しないスラリー層を形成する工程
を含み、
　工程（ｂ）において、前記第１端面側に供給された前記スラリーを前記第２端面側から吸引する際、前記第１端面又は前記第２端面のうち、中央領域の少なくとも一部を被覆し、外縁領域の少なくとも一部を露出させる整流部材が、前記第１端面側又は前記第２端面側に配置される、前記方法を提供する。 The present invention also provides a method of manufacturing a structure, comprising:
The structure is
an axially extending porous substrate;
and a functional layer provided on the porous substrate,
The porous substrate is
a first end face positioned on one side in the axial direction;
a second end face located on the other side in the axial direction;
a first cell extending in the axial direction and having an open end on the first end surface side and a closed end on the second end surface side;
a second cell extending in the axial direction, having an open end on the second end face side and a closed end on the first end face side;
The method comprises the steps of:
(a) supplying a slurry containing raw materials for the functional layer to the first end face; and (b) sucking the slurry supplied to the first end face from the second end face, forming a slurry layer that does not reach the second end surface on the inner wall of the first cell;
In step (b), when sucking the slurry supplied to the first end face side from the second end face side, covering at least part of a central region of the first end face or the second end face, The above method is provided, wherein the rectifying member that exposes at least part of the outer edge region is arranged on the first end face side or the second end face side.
　本発明によれば、多孔質基材と該多孔質基材に設けられた機能層（例えば、触媒層又はその前駆層）とを備える構造体（例えば、排ガス浄化用触媒又はその前駆体）を製造する装置及び方法であって、ウォールフロー型基材の径方向の内側部分に形成されるスラリー層の長さと、ウォールフロー型基材の径方向の外側部分に形成されるスラリー層の長さとの差を小さくすることができる装置及び方法が提供される。 According to the present invention, a structure (e.g., an exhaust gas purification catalyst or its precursor) comprising a porous substrate and a functional layer (e.g., a catalyst layer or its precursor layer) provided on the porous substrate is provided. An apparatus and method for manufacturing, wherein the length of the slurry layer formed on the radially inner portion of the wall-flow substrate and the length of the slurry layer formed on the radially outer portion of the wall-flow substrate Apparatus and methods are provided that can reduce the difference in .
図１は、一実施形態に係る多孔質基材の側面図である。FIG. 1 is a side view of a porous substrate according to one embodiment. 図２は、図１のＡ－Ａ線端面図である。FIG. 2 is an end view taken along the line AA of FIG. 1. FIG. 図３は、図２中の符号Ｒで示す領域の拡大図である。FIG. 3 is an enlarged view of the area indicated by symbol R in FIG. 図４は、図１のＢ－Ｂ線端面図である。4 is an end view taken along the line BB of FIG. 1. FIG. 図５は、一実施形態に係る構造体製造装置の構成を示す概略図である。FIG. 5 is a schematic diagram showing the configuration of a structure manufacturing apparatus according to one embodiment. 図６は、一実施形態に係る基材処理部の構成を示す概略平面図である。FIG. 6 is a schematic plan view showing the configuration of a base material processing section according to one embodiment. 図７は、一実施形態に係るコーティング処理部の構成を示す概略一部端面図である。なお、図７は、多孔質基材に対してコーティング処理が行われる前の状態を示す。FIG. 7 is a schematic partial end view showing the configuration of the coating processing section according to one embodiment. In addition, FIG. 7 shows the state before the coating process is performed on the porous substrate. 図８は、一実施形態に係るコーティング処理部の構成を示す概略一部端面図である。なお、図８は、多孔質基材に対してコーティング処理が行われる際の状態を示す。FIG. 8 is a schematic partial end view showing the configuration of the coating processing section according to one embodiment. In addition, FIG. 8 shows the state when the coating process is performed on the porous substrate. 図９は、一実施形態に係る多孔質基材の第２端面の平面図である。FIG. 9 is a plan view of the second end surface of the porous substrate according to one embodiment. 図１０は、一実施形態に係るコーティング処理後の多孔質基材の端面図（図４に対応する端面図）である。FIG. 10 is an end view (end view corresponding to FIG. 4) of the porous substrate after coating treatment according to one embodiment. 図１１は、第１実施形態に係る整流部材が設けられている吸引管の内部の拡大図である。FIG. 11 is an enlarged view of the inside of the suction tube provided with the straightening member according to the first embodiment. 図１２は、第１実施形態に係る整流部材が備える整流板の平面図である。FIG. 12 is a plan view of a rectifying plate included in the rectifying member according to the first embodiment; 図１３は、第２実施形態に係る整流部材が設けられている吸引管の内部の拡大図である。FIG. 13 is an enlarged view of the inside of a suction tube provided with a straightening member according to the second embodiment. 図１４は、第２実施形態に係る整流部材が備える第１整流板の平面図である。FIG. 14 is a plan view of a first straightening vane included in the straightening member according to the second embodiment. 図１５は、第２実施形態に係る整流部材が備える第２整流板の平面図である。FIG. 15 is a plan view of a second rectifying plate included in the rectifying member according to the second embodiment. 図１６は、図１２に示す整流板の第２部分に貫通孔が形成されている一実施形態を示す平面図である。16 is a plan view showing an embodiment in which a through hole is formed in the second portion of the rectifying plate shown in FIG. 12. FIG. 図１７は、図１５に示す第２整流板に貫通孔が形成されている一実施形態を示す平面図である。17 is a plan view showing an embodiment in which through holes are formed in the second current plate shown in FIG. 15. FIG. 図１８は、変更例に係る整流板の平面図である。FIG. 18 is a plan view of a current plate according to a modification. 図１９は、吸引管と、吸引管内に進入した多孔質基材の第２端面側の端部との間に隙間が形成される変形例を説明するための端面図である。FIG. 19 is an end view for explaining a modification in which a gap is formed between the suction tube and the end portion of the porous substrate on the second end surface side that has entered the suction tube. 図２０は、変更例に係るコーティング処理部の構成を示す概略一部端面図である。なお、図２０は、多孔質基材に対してコーティング処理が行われる際の状態を示す。FIG. 20 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 20 shows the state when the coating process is performed on the porous substrate. 図２１は、変更例に係る多孔質基材の第１端面の平面図である。FIG. 21 is a plan view of the first end surface of the porous base material according to the modification. 図２２は、変更例に係る整流板の平面図である。FIG. 22 is a plan view of a current plate according to a modification. 図２３は、変更例に係るコーティング処理部の構成を示す概略一部端面図である。なお、図２３は、多孔質基材に対してスラリー供給処理及びコーティング処理が行われる前の状態を示す。FIG. 23 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 23 shows the state before the slurry supply process and the coating process are performed on the porous substrate. 図２４は、変更例に係るコーティング処理部の構成を示す概略一部端面図である。なお、図２４は、多孔質基材に対してスラリー供給処理が行われる際の状態を示す。FIG. 24 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 24 shows the state when the slurry supply process is performed on the porous substrate. 図２５は、変更例に係るコーティング処理部の構成を示す概略一部端面図である。なお、図２５は、多孔質基材に対してコーティング処理が行われる際の状態を示す。FIG. 25 is a schematic partial end view showing the configuration of a coating processing section according to a modification. In addition, FIG. 25 shows the state when the coating process is performed on the porous substrate. 図２６は、多孔質基材の径方向の外側部分及び内側部分を説明するための図である。FIG. 26 is a diagram for explaining the radial outer portion and inner portion of the porous substrate.
≪多孔質基材≫
　以下、図１～４を参照して、本発明で使用される多孔質基材の実施形態について説明する。図１は、多孔質基材１の側面図であり、図２は、図１のＡ－Ａ線端面図であり、図３は、図２中の符号Ｒで示す領域の拡大図であり、図４は、図１のＢ－Ｂ線端面図である。 <<Porous substrate>>
Hereinafter, embodiments of the porous substrate used in the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a side view of the porous substrate 1, FIG. 2 is an end view of the AA line in FIG. 1, and FIG. 3 is an enlarged view of the region indicated by symbol R in FIG. 4 is an end view taken along the line BB of FIG. 1. FIG.
　多孔質基材１は、空気が通過可能な多孔質構造を有する。多孔質基材１を構成する材料は特に限定されず、排ガス浄化用触媒の分野で一般的に使用されている材料から適宜選択することができる。構成材料は、高温（例えば４００℃以上）の排ガスに曝露された場合にも多孔質基材１の形状を安定して維持し得ることが好ましい。構成材料としては、例えば、セラミックス等が挙げられる。セラミックスとしては、例えば、アルミナ、ジルコニア、ムライト、ジルコン、コージェライト、チタン酸アルミニウム、炭化ケイ素、窒化ケイ素、窒化ホウ素等が挙げられる。 The porous substrate 1 has a porous structure through which air can pass. The material constituting the porous substrate 1 is not particularly limited, and can be appropriately selected from materials commonly used in the field of exhaust gas purification catalysts. The constituent material is preferably capable of stably maintaining the shape of the porous substrate 1 even when exposed to high-temperature (for example, 400° C. or higher) exhaust gas. Examples of constituent materials include ceramics. Examples of ceramics include alumina, zirconia, mullite, zircon, cordierite, aluminum titanate, silicon carbide, silicon nitride, and boron nitride.
　図１に示すように、多孔質基材１は、軸方向Ｘに延在し、軸方向Ｘの一方側に位置する端面Ｓ１及び軸方向Ｘの他方側に位置する端面Ｓ２を有する。 As shown in FIG. 1, the porous substrate 1 extends in the axial direction X and has an end surface S1 located on one side in the axial direction X and an end surface S2 located on the other side in the axial direction X.
　多孔質基材１の長さＰ１は、例えば、４０ｍｍ以上３００ｍｍ以下であり、多孔質基材１の端面Ｓ１及びＳ２の径Ｐ２は、例えば、３０ｍｍ以上２５０ｍｍ以下である。なお、多孔質基材１の端面Ｓ１及びＳ２の径Ｐ２は、多孔質基材１の端面Ｓ１及びＳ２が円形である場合には、当該円形の直径を意味し、多孔質基材１の端面Ｓ１及びＳ２が円形以外の形状（例えば、四角形等の多角形）である場合には、当該形状に外接する円形の直径を意味する。 The length P1 of the porous substrate 1 is, for example, 40 mm or more and 300 mm or less, and the diameter P2 of the end surfaces S1 and S2 of the porous substrate 1 is, for example, 30 mm or more and 250 mm or less. The diameter P2 of the end surfaces S1 and S2 of the porous substrate 1 means the diameter of the circle when the end surfaces S1 and S2 of the porous substrate 1 are circular. When S1 and S2 are shapes other than circles (for example, polygons such as squares), they refer to diameters of circles circumscribing the shapes.
　図２～４に示すように、多孔質基材１は、多孔質基材１の外形を規定する多孔質の筒状部１１と、筒状部１１内に設けられた多孔質の隔壁部１２と、隔壁部１２で仕切られたセル１３とを備える。 As shown in FIGS. 2 to 4, the porous substrate 1 includes a porous tubular portion 11 that defines the outer shape of the porous substrate 1, and a porous partition wall portion 12 provided in the tubular portion 11. and cells 13 partitioned by partition walls 12 .
　筒状部１１及び隔壁部１２はともに、空気が通過可能な多孔質構造を有する。一実施形態において、筒状部１１及び隔壁部１２は、一体成型されている。別の実施形態において、筒状部１１及び隔壁部１２は、別体であり、互いに接合されている。筒状部１１の多孔性と、隔壁部１２の多孔性とは、同程度であってもよいし、同程度でなくてもよい。 Both the tubular portion 11 and the partition wall portion 12 have a porous structure through which air can pass. In one embodiment, the tubular portion 11 and the partition wall portion 12 are integrally molded. In another embodiment, the tubular portion 11 and the partition portion 12 are separate and joined together. The porosity of the tubular portion 11 and the porosity of the partition wall portion 12 may or may not be the same.
　筒状部１１及び隔壁部１２の厚みは適宜調整可能であるが、筒状部１１の厚みは、例えば、１００μｍ以上３０００μｍ以下であり、隔壁部１２の厚みは、例えば、２０μｍ以上１５００μｍ以下である。 The thickness of the cylindrical portion 11 and the partition wall portion 12 can be adjusted as appropriate. The thickness of the cylindrical portion 11 is, for example, 100 μm or more and 3000 μm or less, and the thickness of the partition wall portion 12 is, for example, 20 μm or more and 1500 μm or less. .
　図２に示すように、筒状部１１は、円筒状であるが、筒状部１１の形状は、適宜変更可能である。筒状部１１は、例えば、楕円筒状、角筒状等であってもよい。 As shown in FIG. 2, the cylindrical portion 11 is cylindrical, but the shape of the cylindrical portion 11 can be changed as appropriate. The tubular portion 11 may be, for example, an elliptical tubular shape, a rectangular tubular shape, or the like.
　図３に示すように、セル１３の平面視形状は、正方形であるが、セル１３の平面視形状は、適宜変更可能である。セル１３の平面視形状は、例えば、正方形以外の四角形、正三角形等の三角形、正六角形等の六角形、正八角形等の八角形、円形、楕円形等であってもよい。 As shown in FIG. 3, the planar view shape of the cell 13 is square, but the planar view shape of the cell 13 can be changed as appropriate. The planar shape of the cell 13 may be, for example, a quadrangle other than a square, a triangle such as a regular triangle, a hexagon such as a regular hexagon, an octagon such as a regular octagon, a circle, or an oval.
　図３に示すように、隣接するセル１３の間には隔壁部１２が存在し、隣接するセル１３は隔壁部１２によって仕切られている。 As shown in FIG. 3, partition walls 12 exist between adjacent cells 13, and the adjacent cells 13 are partitioned by the partition walls 12.
　図４に示すように、隔壁部１２及びセル１３は軸方向Ｘに延在する。 As shown in FIG. 4, the partition 12 and the cells 13 extend in the axial direction X.
　図４に示すように、多孔質基材１は、ウォールフロー型基材である。すなわち、多孔質基材１は、一部のセル１３の端面Ｓ２側の端部を封止する封止部１４と、残りのセル１３の端面Ｓ１側の端部を封止する封止部１５とを有する。これにより、一部のセル１３は、軸方向Ｘに延在し、端面Ｓ１側の端部が開口し、端面Ｓ２側の端部が封止部１４で閉塞するセル１３ａとなっており、残りのセル１３は、軸方向Ｘに延在し、端面Ｓ２側の端部が開口し、端面Ｓ１側の端部が封止部１５で閉塞するセル１３ｂとなっている。 As shown in FIG. 4, the porous substrate 1 is a wall flow type substrate. That is, the porous substrate 1 includes a sealing portion 14 that seals the ends of some of the cells 13 on the side of the end surface S2 and a sealing portion 15 that seals the ends of the remaining cells 13 on the side of the end surface S1. and As a result, some of the cells 13 extend in the axial direction X and form cells 13a whose ends on the side of the end face S1 are open and whose ends on the side of the end face S2 are closed by the sealing portion 14. The cell 13 extends in the axial direction X and is a cell 13 b whose end on the side of the end surface S2 is open and whose end on the side of the end surface S1 is closed by the sealing portion 15 .
　図４に示すように、セル１３ａ及び１３ｂは、１個のセル１３ａの周りに複数個（例えば４個）のセル１３ｂが隣接するように配置されており、セル１３ａと、該セル１３ａに隣接するセル１３ｂとは、隔壁部１２によって仕切られている。 As shown in FIG. 4, the cells 13a and 13b are arranged such that a plurality of (for example, four) cells 13b are adjacent to one cell 13a. The cell 13b is partitioned by the partition wall portion 12. As shown in FIG.
　多孔質基材１の１平方インチあたりのセル１３の個数は適宜調整可能であるが、例えば、１００セル／インチ２以上１０００セル／インチ２以下である。多孔質基材１の１平方インチあたりのセル１３の個数は、多孔質基材１を軸方向Ｘと垂直な平面で切断して得られる切断面における１平方インチあたりのセル１３ａ及びセル１３ｂの合計個数である。 The number of cells 13 per square inch of the porous substrate 1 can be adjusted as appropriate, but is, for example, 100 cells/inch 2 or more and 1000 cells/inch 2 or less. The number of cells 13 per square inch of the porous substrate 1 is the number of cells 13a and cells 13b per square inch on a cut surface obtained by cutting the porous substrate 1 along a plane perpendicular to the axial direction X. total number.
≪構造体製造装置≫
　以下、図面を参照して、本発明の構造体製造装置の実施形態について説明する。 ≪Structure Manufacturing Equipment≫
An embodiment of a structure manufacturing apparatus of the present invention will be described below with reference to the drawings.
＜構造体製造装置の構成＞
　以下、図５を参照して、一実施形態に係る構造体製造装置の構成について説明する。図５は、構造体製造装置１００の構成を示す概略図である。 <Configuration of Structure Manufacturing Equipment>
Hereinafter, the configuration of the structure manufacturing apparatus according to one embodiment will be described with reference to FIG. FIG. 5 is a schematic diagram showing the configuration of the structure manufacturing apparatus 100. As shown in FIG.
　図５に示すように、構造体製造装置１００は、基材処理部２と、基材処理部２の動作を制御する制御部３とを備える。 As shown in FIG. 5 , the structure manufacturing apparatus 100 includes a base material processing section 2 and a control section 3 that controls the operation of the base material processing section 2 .
　基材処理部２は、多孔質基材１に対する各種処理を行う。基材処理部２が行う各種処理については後述する。 The base material treatment section 2 performs various treatments on the porous base material 1 . Various processes performed by the base material processing section 2 will be described later.
　制御部３は、例えばコンピュータであり、主制御部と記憶部とを備える。主制御部は、例えばＣＰＵ（Central Processing Unit）で構成されており、記憶部に記憶されているプログラムを読み出して実行することにより、基材処理部２の動作を制御する。 The control unit 3 is, for example, a computer, and includes a main control unit and a storage unit. The main control section is composed of, for example, a CPU (Central Processing Unit), and controls the operation of the base material processing section 2 by reading and executing a program stored in the storage section.
＜基材処理部の構成＞
　図６を参照して、一実施形態に係る基材処理部の構成について説明する。図６は、基材処理部２の構成を示す概略平面図である。図６中の点線は、多孔質基材１を表す。 <Configuration of base material processing unit>
The configuration of the base material processing section according to one embodiment will be described with reference to FIG. 6 . FIG. 6 is a schematic plan view showing the configuration of the base material processing section 2. As shown in FIG. A dotted line in FIG. 6 represents the porous substrate 1 .
　図６に示すように、基材処理部２は、搬入出ステーション２１と、搬入出ステーション２１に隣接して設けられた処理ステーション２２とを備える。 As shown in FIG. 6 , the base material processing section 2 includes a loading/unloading station 21 and a processing station 22 provided adjacent to the loading/unloading station 21 .
　図６に示すように、搬入出ステーション２１は、載置部２１１を備える。載置部２１１には、多孔質基材１が載置される。 As shown in FIG. 6 , the loading/unloading station 21 includes a placement section 211 . The porous substrate 1 is mounted on the mounting portion 211 .
　図６に示すように、処理ステーション２２は、所定方向に延在する搬送路２２１と、搬送路２２１に設けられた搬送機構２２２とを備える。搬送機構２２２は、多孔質基材１を保持する保持機構を備え、水平方向及び鉛直方向への移動並びに鉛直軸を中心とする旋回が可能となるように構成されている。 As shown in FIG. 6, the processing station 22 includes a transport path 221 extending in a predetermined direction, and a transport mechanism 222 provided on the transport path 221 . The transport mechanism 222 includes a holding mechanism that holds the porous substrate 1, and is configured to be capable of horizontal and vertical movement and rotation about the vertical axis.
　図６に示すように、処理ステーション２２は、コーティング処理部４を備える。 As shown in FIG. 6 , the processing station 22 includes a coating processing section 4 .
　処理ステーション２２は、焼成処理部を備えていてもよい。焼成処理部は、コーティング処理部４によってコーティング処理が施された多孔質基材１を、必要に応じて乾燥した後、焼成する。 The processing station 22 may include a baking processing section. The baking treatment section dries the porous substrate 1 coated by the coating treatment section 4 as necessary, and then bakes it.
　搬送機構２２２は、載置部２１１とコーティング処理部４との間で、多孔質基材１の搬送を行う。例えば、搬送機構２２２は、載置部２１１に載置された多孔質基材１をコーティング処理部４へ搬入し、コーティング処理後の多孔質基材１をコーティング処理部４から搬出して載置部２１１に載置する。搬送機構２２２は、コーティング処理部４と焼成処理部との間、及び、焼成処理部と載置部２１１との間で、多孔質基材１の搬送を行ってもよい。例えば、搬送機構２２２は、載置部２１１に載置された多孔質基材１をコーティング処理部４へ搬入し、コーティング処理後の多孔質基材１をコーティング処理部４から搬出して焼成処理部へ搬入し、焼成処理後の多孔質基材１を焼成処理部から搬出して載置部２１１に載置してもよい。 The transport mechanism 222 transports the porous substrate 1 between the placing section 211 and the coating processing section 4 . For example, the transport mechanism 222 carries the porous substrate 1 placed on the placement unit 211 into the coating processing unit 4, carries out the coated porous substrate 1 from the coating processing unit 4, and places it. It is placed on the part 211 . The transport mechanism 222 may transport the porous substrate 1 between the coating processing section 4 and the firing processing section and between the firing processing section and the placing section 211 . For example, the transport mechanism 222 carries the porous substrate 1 placed on the placement unit 211 into the coating processing unit 4, carries out the coated porous substrate 1 from the coating processing unit 4, and bakes it. The porous substrate 1 after the baking treatment may be carried out from the baking treatment part and placed on the placing part 211 .
＜コーティング処理部の構成＞
　図７～１０を参照して、一実施形態に係るコーティング処理部の構成について説明する。図７及び８は、コーティング処理部４の構成を示す概略一部端面図であり、図９は、多孔質基材１の第２端面Ｔ２の平面図であり、図１０は、コーティング処理後の多孔質基材１の端面図（図４に対応する端面図）である。なお、図７は、多孔質基材１に対してコーティング処理が行われる前の状態を示し、図８は、多孔質基材１に対してコーティング処理が行われる際の状態を示す。 <Configuration of Coating Processing Unit>
The configuration of the coating processor according to one embodiment will be described with reference to FIGS. 7 to 10. FIG. 7 and 8 are schematic partial end views showing the configuration of the coating processing section 4, FIG. 9 is a plan view of the second end surface T2 of the porous substrate 1, and FIG. 5 is an end view of the porous substrate 1 (end view corresponding to FIG. 4). FIG. 7 shows the state before the coating process is performed on the porous substrate 1, and FIG. 8 shows the state when the coating process is performed on the porous substrate 1. As shown in FIG.
　コーティング処理部４は、多孔質基材１に対するコーティング処理を行う。コーティング処理では、多孔質基材１にスラリーＭがコーティングされ、多孔質基材１にスラリー層Ｎが形成される（図１０参照）。スラリー層Ｎは、必要に応じて乾燥された後、焼成されることにより、触媒層となる。 The coating processing unit 4 performs coating processing on the porous substrate 1 . In the coating process, the porous substrate 1 is coated with the slurry M to form a slurry layer N on the porous substrate 1 (see FIG. 10). The slurry layer N becomes a catalyst layer by being dried as necessary and then calcined.
　図７及び８に示すように、コーティング処理部４は、チャンバＣを備える。多孔質基材１に対するコーティング処理は、チャンバＣ内で行われる。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a chamber C. A coating process for the porous substrate 1 is performed in the chamber C. As shown in FIG.
　図７及び８に示すように、コーティング処理部４は、多孔質基材１を保持する基材保持部４１を備える。多孔質基材１に対するコーティング処理は、多孔質基材１が基材保持部４１に保持された状態で行われる。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a substrate holding section 41 that holds the porous substrate 1 . The coating process for the porous substrate 1 is performed while the porous substrate 1 is held by the substrate holder 41 .
　基材保持部４１は、多孔質基材１を保持する保持機構を有する。基材保持部４１は、例えば、ハンドチャック等のチャック機構を有し、チャック機構によって多孔質基材１の筒状部１１の中央部を把持することにより、多孔質基材１を保持する。基材保持部４１は、保持した多孔質基材１の、水平方向及び鉛直方向への移動、鉛直軸を中心とする回転、水平軸を中心とする回転等が可能となるように構成されていてもよい。 The substrate holding part 41 has a holding mechanism that holds the porous substrate 1 . The substrate holding unit 41 has, for example, a chuck mechanism such as a hand chuck, and holds the porous substrate 1 by gripping the central portion of the cylindrical portion 11 of the porous substrate 1 with the chuck mechanism. The substrate holding unit 41 is configured so that the held porous substrate 1 can be moved in horizontal and vertical directions, rotated around the vertical axis, rotated around the horizontal axis, and the like. may
　図７及び８に示すように、基材保持部４１は、多孔質基材１の第１端面Ｔ１がスラリー供給部４２のノズル４２２側（図７及び８の上側）を向き、多孔質基材１の第２端面Ｔ２がスラリー吸引部４６の吸引管４６１側（図７及び８の下側）を向くように、多孔質基材１を保持する。 As shown in FIGS. 7 and 8, the substrate holding portion 41 is configured such that the first end surface T1 of the porous substrate 1 faces the nozzle 422 side of the slurry supply portion 42 (upper side in FIGS. 7 and 8), and the porous substrate The porous substrate 1 is held so that the second end face T2 of the substrate 1 faces the suction pipe 461 side of the slurry suction part 46 (lower side in FIGS. 7 and 8).
　多孔質基材１の第１端面Ｔ１は、多孔質基材１の端面Ｓ１及びＳ２のうちの一方であり、多孔質基材１の第２端面Ｔ２は、多孔質基材１の端面Ｓ１及びＳ２のうちの他方である。すなわち、多孔質基材１の端面Ｓ１にスラリーＭが供給され、供給されたスラリーＭが多孔質基材１の端面Ｓ２側から吸引される場合、端面Ｓ１が第１端面Ｔ１に、端面Ｓ２が第２端面Ｔ２に該当し、多孔質基材１の端面Ｓ２にスラリーＭが供給され、供給されたスラリーが多孔質基材１の端面Ｓ１側から吸引される場合、端面Ｓ２が第１端面Ｔ１に該当し、端面Ｓ１が第２端面Ｔ２に該当する。本実施形態では、端面Ｓ１が第１端面Ｔ１であり、端面Ｓ２が第２端面Ｔ２である。 The first end surface T1 of the porous substrate 1 is one of the end surfaces S1 and S2 of the porous substrate 1, and the second end surface T2 of the porous substrate 1 is the end surface S1 and S2 of the porous substrate 1. The other of S2. That is, when the slurry M is supplied to the end surface S1 of the porous substrate 1 and the supplied slurry M is sucked from the end surface S2 side of the porous substrate 1, the end surface S1 is the first end surface T1, and the end surface S2 is the first end surface T1. When the slurry M is supplied to the end surface S2 of the porous substrate 1 and the supplied slurry is sucked from the end surface S1 side of the porous substrate 1, the end surface S2 corresponds to the second end surface T2. , and the end surface S1 corresponds to the second end surface T2. In this embodiment, the end surface S1 is the first end surface T1, and the end surface S2 is the second end surface T2.
　図９に示すように、多孔質基材１の第２端面Ｔ２は、境界線Ｌ２によって、第２端面Ｔ２の径方向の外側に位置する環状（例えば円環状）の外縁領域Ｔ２１と、外縁領域Ｔ２１の内側に位置する中央領域Ｔ２２とに区画される。境界線Ｌ２は仮想線である。なお、図９において、第２端面Ｔ２に存在するセル１３ｂの開口部は省略されている。 As shown in FIG. 9 , the second end face T2 of the porous substrate 1 includes an annular (for example, annular) outer edge region T21 located radially outside the second end face T2 and an outer edge region T21 located radially outward of the second end face T2. It is partitioned into a central region T22 located inside T21. Boundary line L2 is a virtual line. In FIG. 9, the openings of the cells 13b present on the second end surface T2 are omitted.
　中央領域Ｔ２２の面積は、第２端面Ｔ２の面積の４０％以上９０％以下であることが好ましく、６５％以上８５％以下であることがより好ましい。 The area of the central region T22 is preferably 40% or more and 90% or less of the area of the second end surface T2, and more preferably 65% or more and 85% or less.
　中央領域Ｔ２２の形状と第２端面Ｔ２の形状とは、相似形状であることが好ましい。中央領域Ｔ２２の形状は、中央領域Ｔ２２の外形線（すなわち、境界線Ｌ２）により規定される形状を意味し、第２端面Ｔ２の形状は、第２端面Ｔ２の外形線により規定される形状を意味する。 The shape of the central region T22 and the shape of the second end face T2 are preferably similar shapes. The shape of the central region T22 means the shape defined by the outline of the central region T22 (that is, the boundary line L2), and the shape of the second end surface T2 means the shape defined by the outline of the second end surface T2. means.
　外縁領域Ｔ２１は、中央領域Ｔ２２の形状と第２端面Ｔ２の形状とが相似形状となるように、第２端面Ｔ２の外形線に沿って所定の幅で形成されていることが好ましい。中央領域Ｔ２２の形状と第２端面Ｔ２の形状とが相似形状となる限り、外縁領域Ｔ２１の幅は一定であってもよいし、一定でなくてもよい。 The outer edge region T21 is preferably formed with a predetermined width along the outline of the second end face T2 so that the shape of the central region T22 and the shape of the second end face T2 are similar. As long as the shape of the central region T22 and the shape of the second end surface T2 are similar, the width of the outer edge region T21 may or may not be constant.
　搬送機構２２２によってコーティング処理部４へ搬入された多孔質基材１は、そのまま、搬送機構２２２によって保持されてもよい。この場合、搬送機構２２２は、基材保持部４１として機能する。 The porous substrate 1 carried into the coating processing section 4 by the transport mechanism 222 may be held by the transport mechanism 222 as it is. In this case, the transport mechanism 222 functions as the substrate holder 41 .
　図７及び８に示すように、コーティング処理部４は、多孔質基材１の第１端面Ｔ１側にスラリーＭを供給するスラリー供給部４２を備える。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a slurry supply section 42 that supplies the slurry M to the first end surface T1 side of the porous substrate 1 .
　図７及び８に示すように、スラリー供給部４２は、スラリーＭが貯留されている貯留槽４２１と、多孔質基材１の第１端面Ｔ１に向けてスラリーＭを吐出するノズル４２２と、貯留槽４２１中のスラリーＭをノズル４２２に供給する供給管４２３とを備える。 As shown in FIGS. 7 and 8, the slurry supply unit 42 includes a storage tank 421 in which the slurry M is stored, a nozzle 422 for discharging the slurry M toward the first end surface T1 of the porous substrate 1, and a storage and a supply pipe 423 for supplying the slurry M in the tank 421 to the nozzle 422 .
　スラリー供給部４２は、貯留槽４２１中のスラリーＭを、供給管４２３を通じてノズル４２２に供給し、ノズル４２２から多孔質基材１の第１端面Ｔ１に吐出することにより、多孔質基材１の第１端面Ｔ１にスラリーＭを供給する。 The slurry supply unit 42 supplies the slurry M in the storage tank 421 to the nozzle 422 through the supply pipe 423 and discharges the slurry M from the nozzle 422 onto the first end surface T1 of the porous substrate 1, whereby the porous substrate 1 is A slurry M is supplied to the first end face T1.
　スラリーＭは、多孔質基材１に設けられる機能層の原料を含有する。 The slurry M contains raw materials for the functional layer provided on the porous substrate 1 .
　スラリーＭの粘度は、コーン・アンド・プレート型の粘度計を使用し、２５℃の温度で、せん断速度を３８０ｓ－１として測定した場合、例えば、１００ｍＰａ・ｓ以上１０００ｍＰａ・ｓ以下であり、せん断速度を４ｓ－１として測定した場合、例えば、１０００ｍＰａ・ｓ以上１００００ｍＰａ・ｓ以下である。 The viscosity of the slurry M is, for example, 100 mPa s or more and 1000 mPa s or less when measured using a cone and plate type viscometer at a temperature of 25 ° C. and a shear rate of 380 s -1 . When the velocity is measured as 4 s −1 , it is, for example, 1000 mPa·s or more and 10000 mPa·s or less.
　機能層は、所定の機能を有する層であり、機能層の種類は、製造すべき構造体の種類に応じて適宜選択される。 A functional layer is a layer having a predetermined function, and the type of functional layer is appropriately selected according to the type of structure to be manufactured.
　本実施形態において、製造すべき構造体は排ガス浄化用触媒又はその前駆体であり、機能層は触媒層又はその前駆層である。触媒層は、スラリー層Ｎが、必要に応じて乾燥された後、焼成されることにより形成される。触媒層の前駆層には、乾燥前のスラリー層Ｎ及び乾燥後のスラリー層Ｎが包含される。排ガス浄化用触媒は、多孔質基材１と、多孔質基材１に設けられた触媒層とを備える構造体である。排ガス浄化用触媒の前駆体には、多孔質基材１と、多孔質基材１に設けられた乾燥前のスラリー層Ｎとを備える構造体、及び、多孔質基材１と、多孔質基材１に設けられた乾燥後のスラリー層Ｎとを備える構造体が包含される。 In this embodiment, the structure to be manufactured is an exhaust gas purifying catalyst or its precursor, and the functional layer is a catalyst layer or its precursor layer. The catalyst layer is formed by calcining the slurry layer N after drying it if necessary. The precursor layer of the catalyst layer includes the slurry layer N before drying and the slurry layer N after drying. The exhaust gas purifying catalyst is a structure comprising a porous substrate 1 and a catalyst layer provided on the porous substrate 1 . The precursor of the exhaust gas purifying catalyst includes a structure including a porous substrate 1 and a slurry layer N before drying provided on the porous substrate 1, a porous substrate 1, and a porous substrate A structure comprising a slurry layer N after drying provided on the material 1 is included.
　スラリーＭは、触媒活性成分及び分散媒を含有する。 The slurry M contains a catalytically active component and a dispersion medium.
　触媒活性成分としては、例えば、Ａｕ（金元素）、Ａｇ（銀元素）、Ｐｔ（白金元素）、Ｐｄ（パラジウム元素）、Ｒｈ（ロジウム元素）、Ｉｒ（イリジウム元素）、Ｒｕ（ルテニウム元素）、Ｏｓ（オスミウム元素）等の貴金属元素が挙げられる。スラリーＭは、例えば、貴金属元素を、貴金属元素の供給源である貴金属元素の塩の形態で含有する。貴金属元素の塩としては、例えば、硝酸塩、アンミン錯体塩、塩化物等が挙げられる。スラリーＭにおける貴金属元素の含有量は、適宜調整可能である。 Examples of catalytically active components include Au (gold element), Ag (silver element), Pt (platinum element), Pd (palladium element), Rh (rhodium element), Ir (iridium element), Ru (ruthenium element), Noble metal elements such as Os (osmium element) are included. The slurry M contains, for example, a noble metal element in the form of a salt of the noble metal element, which is a supply source of the noble metal element. Examples of salts of noble metal elements include nitrates, ammine complex salts, and chlorides. The content of the noble metal element in the slurry M can be adjusted as appropriate.
　分散媒としては、例えば、水、有機溶媒等が挙げられる。分散媒は、１種の溶媒であってもよいし、２種以上の溶媒の混合物であってもよい。有機溶媒としては、例えば、アルコール、アセトン、ジメチルスルホキシド、ジメチルホルムアミド等が挙げられる。 Examples of dispersion media include water and organic solvents. The dispersion medium may be one solvent or a mixture of two or more solvents. Examples of organic solvents include alcohol, acetone, dimethylsulfoxide, dimethylformamide and the like.
　スラリーＭは、触媒活性成分を担持する担体を含有してもよい。触媒活性成分は、例えば、担体の外表面又は細孔内表面に、物理的又は化学的に吸着又は保持されることにより、担体に担持される。 The slurry M may contain a carrier that supports catalytically active components. The catalytically active component is supported on the carrier by, for example, being physically or chemically adsorbed or retained on the outer surface or inner surface of pores of the carrier.
　担体としては、例えば、無機酸化物粒子等が挙げられる。無機酸化物粒子を構成する無機酸化物は、酸素貯蔵能（ＯＳＣ：Ｏｘｙｇｅｎ　Ｓｔｏｒａｇｅ　Ｃａｐａｃｉｔｙ）を有する無機酸化物（以下「酸素貯蔵成分」という。）であってもよいし、酸素貯蔵成分以外の無機酸化物であってもよい。 Examples of the carrier include inorganic oxide particles. The inorganic oxide constituting the inorganic oxide particles may be an inorganic oxide having oxygen storage capacity (OSC: Oxygen Storage Capacity) (hereinafter referred to as "oxygen storage component"), or an inorganic oxide other than the oxygen storage component. It may be an oxide.
　酸素貯蔵成分としては、例えば、酸化セリウム、セリウム元素及びジルコニウム元素を含む複合酸化物（以下「ＣｅＯ２－ＺｒＯ２系複合酸化物」という。）等が挙げられる。ＣｅＯ２－ＺｒＯ２系複合酸化物は、セリウム元素及びジルコニウム元素以外の金属元素を含んでもよい。セリウム元素及びジルコニウム元素以外の金属元素としては、例えば、セリウム元素以外の希土類元素、アルカリ土類金属、遷移金属等が挙げられる。 Examples of the oxygen storage component include cerium oxide, composite oxides containing cerium element and zirconium element (hereinafter referred to as "CeO 2 —ZrO 2 -based composite oxide"), and the like. The CeO 2 —ZrO 2 -based composite oxide may contain metal elements other than the cerium element and the zirconium element. Examples of metal elements other than the cerium element and the zirconium element include rare earth elements other than the cerium element, alkaline earth metals, and transition metals.
　酸素貯蔵成分以外の無機酸化物としては、例えば、アルミナ、シリカ、シリカ－アルミナ、アルミノ－シリケート、アルミナ－ジルコニア、アルミナ－クロミア、アルミナ－セリア、アルミナ－ランタナ、チタニア等が挙げられる。 Examples of inorganic oxides other than oxygen storage components include alumina, silica, silica-alumina, alumino-silicate, alumina-zirconia, alumina-chromia, alumina-ceria, alumina-lanthana, and titania.
　スラリーＭは、安定剤を含有してもよい。安定剤としては、例えば、アルカリ土類金属元素の硝酸塩、炭酸塩、酸化物、硫酸塩等が挙げられる。 The slurry M may contain a stabilizer. Examples of stabilizers include nitrates, carbonates, oxides and sulfates of alkaline earth metal elements.
　スラリーＭは、バインダー成分を含有してもよい。バインダー成分としては、例えば、アルミナゾル等の無機系バインダーが挙げられる。 The slurry M may contain a binder component. Examples of binder components include inorganic binders such as alumina sol.
　図７及び８に示すように、コーティング処理部４は、ノズル４２２を移動させるノズル移動機構４３を備える。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a nozzle moving mechanism 43 that moves the nozzle 422. As shown in FIGS.
　図７及び８に示すように、ノズル移動機構４３は、ノズル４２２を保持するノズル保持部４３１と、ノズル保持部４３１を昇降させる昇降機構４３２とを備える。 As shown in FIGS. 7 and 8, the nozzle moving mechanism 43 includes a nozzle holding portion 431 that holds the nozzle 422 and a lifting mechanism 432 that lifts and lowers the nozzle holding portion 431 .
　ノズル移動機構４３は、昇降機構４３２によってノズル保持部４３１を降下させることにより、ノズル４２２を多孔質基材１に近づけ、図８に示すスラリー供給位置に移動させる。また、ノズル移動機構４３は、昇降機構４３２によってノズル保持部４３１を上昇させることにより、ノズル４２２を多孔質基材１から遠ざけ、図７に示す待機位置に移動させる。ノズル４２２は、図８に示すスラリー供給位置において、多孔質基材１の第１端面Ｔ１に向けてスラリーＭを吐出する。 The nozzle moving mechanism 43 moves the nozzle 422 closer to the porous substrate 1 by lowering the nozzle holding part 431 by the lifting mechanism 432 to the slurry supply position shown in FIG. Further, the nozzle moving mechanism 43 moves the nozzle 422 away from the porous substrate 1 and moves it to the standby position shown in FIG. The nozzle 422 discharges the slurry M toward the first end surface T1 of the porous substrate 1 at the slurry supply position shown in FIG.
　本実施形態では、ノズル移動機構４３によってノズル４２２を移動させることにより、多孔質基材１とノズル４２２との相対的な位置を変化させているが、基材保持部４１が多孔質基材１を移動させることにより、多孔質基材１とノズル４２２との相対的な位置を変化させてもよい。 In this embodiment, the relative position between the porous substrate 1 and the nozzle 422 is changed by moving the nozzle 422 with the nozzle moving mechanism 43. By moving , the relative position between the porous substrate 1 and the nozzle 422 may be changed.
　図７及び８に示すように、コーティング処理部４は、治具４４を備える。 　As shown in FIGS. 7 and 8, the coating processing section 4 includes a jig 44. As shown in FIG.
　図７及び８に示すように、治具４４は、円筒状等の筒状であり、治具４４の内径は、多孔質基材１の外径よりも大きくなっている。 As shown in FIGS. 7 and 8, the jig 44 has a tubular shape such as a cylindrical shape, and the inner diameter of the jig 44 is larger than the outer diameter of the porous substrate 1 .
　図７及び８に示すように、治具４４は、ノズル４２２を囲むように、ノズル保持部４３１に取り付けられている。したがって、治具４４は、ノズル移動機構４３によってノズル４２２とともに移動する。 As shown in FIGS. 7 and 8, the jig 44 is attached to the nozzle holder 431 so as to surround the nozzle 422 . Therefore, the jig 44 is moved together with the nozzle 422 by the nozzle moving mechanism 43 .
　図８に示すように、ノズル移動機構４３によってノズル４２２がスラリー供給位置に移動すると、多孔質基材１の第１端面Ｔ１側の端部は、治具４４内に進入し、治具４４内には、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭの貯留を可能とする貯留空間Ｖ１が形成される。 As shown in FIG. 8, when the nozzle 422 is moved to the slurry supply position by the nozzle moving mechanism 43, the end portion of the porous substrate 1 on the first end surface T1 side enters the jig 44 and moves into the jig 44. is formed with a storage space V1 that enables storage of the slurry M supplied to the first end surface T1 side of the porous substrate 1 .
　図７及び８に示すように、コーティング処理部４は、第１基材固定部４５を備える。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a first substrate fixing section 45. As shown in FIG.
　図７及び８に示すように、第１基材固定部４５は、治具４４の下端部に設けられており、治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部を治具４４内に固定する。第１基材固定部４５は、例えば、風船式チャック等のチャック機構を有する。風船式チャックが有する風船は、多孔質基材１の第１端面Ｔ１側の端部が治具４４内に進入する際には、進入を妨げないように膨張していないが、多孔質基材１の第１端面Ｔ１側の端部が治具４４内に進入した後には、空気圧により膨張し、治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部を治具４４内に固定する。この際、風船式チャックが有する風船は、治具４４と、治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部との間を隙間なく埋め、貯留空間Ｖ１からのスラリーＭの漏出を防止する。 As shown in FIGS. 7 and 8, the first substrate fixing portion 45 is provided at the lower end portion of the jig 44, and the end of the porous substrate 1 entering the jig 44 on the first end surface T1 side The part is fixed in jig 44 . The first base material fixing part 45 has, for example, a chuck mechanism such as a balloon type chuck. When the end of the porous substrate 1 on the side of the first end surface T1 enters the jig 44, the balloon of the balloon-type chuck is not inflated so as not to hinder the entry. After the end portion of the porous substrate 1 on the side of the first end surface T1 enters the jig 44, it is expanded by the air pressure, and the end portion of the porous substrate 1 on the side of the first end surface T1 that has entered the jig 44 is removed by the jig. 44. At this time, the balloon held by the balloon-type chuck fills the space between the jig 44 and the end of the porous base material 1 on the first end surface T1 side that has entered the jig 44 without any gap, and the balloon is discharged from the storage space V1. Prevent the slurry M from leaking.
　図７及び８に示すように、コーティング処理部４は、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭを多孔質基材１の第２端面Ｔ２側から吸引し、多孔質基材１の第１セルの内壁にスラリー層Ｎを形成するスラリー吸引部４６を備える。 As shown in FIGS. 7 and 8, the coating processing unit 4 sucks the slurry M supplied to the first end surface T1 side of the porous substrate 1 from the second end surface T2 side of the porous substrate 1, A slurry suction part 46 for forming a slurry layer N on the inner wall of the first cell of the substrate 1 is provided.
　多孔質基材１の第１セルは、多孔質基材１の第１端面Ｔ１に開口部を有するセルである。端面Ｓ１が第１端面Ｔ１である場合、セル１３ａが第１セルであり、セル１３ｂが第２セルである。端面Ｓ２が第１端面Ｔ１である場合、セル１３ｂが第１セルであり、セル１３ａが第２セルである。本実施形態では、セル１３ａが第１セルであり、セル１３ｂが第２セルである。 The first cell of the porous substrate 1 is a cell having an opening in the first end surface T1 of the porous substrate 1. When the end surface S1 is the first end surface T1, the cell 13a is the first cell and the cell 13b is the second cell. When the end surface S2 is the first end surface T1, the cell 13b is the first cell and the cell 13a is the second cell. In this embodiment, the cell 13a is the first cell and the cell 13b is the second cell.
　図７及び８に示すように、スラリー吸引部４６は、吸引管４６１と、吸引管４６１の下端部に接続された吸引機構４６２とを備える。 As shown in FIGS. 7 and 8, the slurry suction unit 46 includes a suction tube 461 and a suction mechanism 462 connected to the lower end of the suction tube 461.
　図７及び８に示すように、吸引管４６１は、円筒状等の筒状であり、吸引管４６１の内径は、多孔質基材１の外径よりも大きくなっている。吸引管移動機構４７が吸引管４６１を多孔質基材１に近づけ、図８に示すスラリー吸引位置に移動させると、多孔質基材１の第２端面Ｔ２側の端部は、吸引管４６１内に進入し、吸引管４６１内には、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭの吸引を可能とする吸引空間Ｖ２が形成される。 As shown in FIGS. 7 and 8, the suction tube 461 has a tubular shape such as a cylindrical shape, and the inner diameter of the suction tube 461 is larger than the outer diameter of the porous substrate 1 . When the suction tube moving mechanism 47 brings the suction tube 461 closer to the porous substrate 1 and moves it to the slurry suction position shown in FIG. inside the suction tube 461, a suction space V2 is formed in which the slurry M supplied to the first end face T1 side of the porous substrate 1 can be sucked.
　吸引機構４６２は、例えば、ポンプを備え、吸引管４６１内の吸引空間Ｖ２を減圧する。これにより、多孔質基材１の第１端面Ｔ１から多孔質基材１の第２端面Ｔ２に向けて空気の流れが生じ、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭは、多孔質基材１の第２端面Ｔ２に向けて吸引される。具体的には、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭは、セル１３ａ内へ導入され、セル１３ａの内壁を伝って第１端面Ｔ１から第２端面Ｔ２へ流れる。その結果、図１０に示すように、セル１３ａの内壁には、多孔質基材１の第２端面Ｔ２に達していないように、多孔質基材１の第１端面Ｔ１から多孔質基材１の第２端面Ｔ２に向けて延在するスラリー層Ｎが形成される。 The suction mechanism 462 includes, for example, a pump, and depressurizes the suction space V2 inside the suction pipe 461. As a result, an air flow is generated from the first end surface T1 of the porous substrate 1 toward the second end surface T2 of the porous substrate 1, and the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked toward the second end surface T2 of the porous substrate 1 . Specifically, the slurry M supplied to the first end surface T1 side of the porous substrate 1 is introduced into the cells 13a and flows along the inner walls of the cells 13a from the first end surface T1 to the second end surface T2. As a result, as shown in FIG. 10 , the inner walls of the cells 13 a are formed from the first end surface T1 of the porous substrate 1 to the porous substrate 1 so as not to reach the second end surface T2 of the porous substrate 1 . A slurry layer N extending toward the second end surface T2 of is formed.
　図７及び８に示すように、コーティング処理部４は、吸引管４６１を移動させる吸引管移動機構４７を備える。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a suction tube moving mechanism 47 that moves the suction tube 461. As shown in FIGS.
　吸引管移動機構４７は、吸引管４６１を上昇させて多孔質基材１に近づけることにより、吸引管４６１を、図８に示すスラリー吸引位置に移動させる。また、吸引管移動機構４７は、吸引管４６１を降下させて多孔質基材１から遠ざけることにより、吸引管４６１を、図７に示す待機位置に移動させる。吸引機構４６２は、吸引管４６１が図８に示すスラリー吸引位置にあるときに、吸引管４６１内の吸引空間Ｖ２を減圧する。 The suction tube moving mechanism 47 moves the suction tube 461 to the slurry suction position shown in FIG. Further, the suction tube moving mechanism 47 moves the suction tube 461 to the standby position shown in FIG. 7 by lowering the suction tube 461 away from the porous substrate 1 . The suction mechanism 462 decompresses the suction space V2 inside the suction pipe 461 when the suction pipe 461 is at the slurry suction position shown in FIG.
　本実施形態では、吸引管移動機構４７によって吸引管４６１を移動させることにより、多孔質基材１と吸引管４６１との相対的な位置を変化させているが、基材保持部４１により多孔質基材１を移動させることにより、多孔質基材１と吸引管４６１との相対的な位置を変化させてもよい。 In the present embodiment, the suction tube moving mechanism 47 moves the suction tube 461 to change the relative position between the porous substrate 1 and the suction tube 461 . By moving the substrate 1, the relative positions of the porous substrate 1 and the suction tube 461 may be changed.
　図７及び８に示すように、コーティング処理部４は、第２基材固定部４８を備える。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a second base material fixing section 48 .
　第２基材固定部４８は、吸引管４６１の上端部に設けられており、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部を吸引管４６１内に固定する。第２基材固定部４８は、例えば、風船式チャック等のチャック機構を有する。風船式チャックが有する風船は、多孔質基材１の第２端面Ｔ２側の端部が吸引管４６１内に進入する際には、進入を妨げないように膨張していないが、多孔質基材１の第２端面Ｔ２側の端部が吸引管４６１内に進入した後には、空気圧により膨張し、多孔質基材１の第２端面Ｔ２側の端部を吸引管４６１内に固定する。この際、風船式チャックが有する風船は、吸引管４６１と、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部との間を隙間なく埋め、吸引空間Ｖ２を密閉する。このため、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、吸引管４６１外の空気は、多孔質基材１の外周面に沿って、吸引管４６１内の整流部材４０に形成された貫通孔に流れ込まない。例えば、後述の第１実施形態では、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の整流板４９ａに形成された貫通孔（例えば、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇ）に流れ込まない。また、後述の第２実施形態では、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の第１整流板４９ｂ及び第２整流板５０に形成された貫通孔（例えば、第１整流板４９ｂの第１部分４９１に形成された第１貫通孔Ｇ、第１整流板４９ｂの第２部分４９２に形成された第２貫通孔Ｊ、第２整流板５０に形成された貫通孔等）に流れ込まない。 The second base material fixing part 48 is provided at the upper end of the suction tube 461 and fixes the second end surface T2 side end of the porous base material 1 that has entered the suction tube 461 inside the suction tube 461 . . The second base material fixing portion 48 has, for example, a chuck mechanism such as a balloon type chuck. When the end of the porous substrate 1 on the side of the second end surface T2 enters the suction tube 461, the balloon of the balloon-type chuck is not inflated so as not to hinder the entry. After the end portion of the porous substrate 1 on the second end surface T2 side enters the suction tube 461 , the porous substrate 1 is expanded by air pressure to fix the end portion on the second end surface T2 side of the porous substrate 1 inside the suction tube 461 . At this time, the balloon held by the balloon-type chuck fills the gap between the suction tube 461 and the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461, and seals the suction space V2. do. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the air outside the suction pipe 461 is It does not flow into the through-hole formed in the rectifying member 40 in the suction tube 461 along the outer peripheral surface of 1 . For example, in the first embodiment described later, the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 through holes formed in the straightening plate 49a inside the suction tube 461 (for example, the straightening plate 49a). does not flow into the first through hole G) formed in the first portion 491 of the . Further, in a second embodiment described later, air outside the suction pipe 461 is formed along the outer peripheral surface of the porous substrate 1 in the first straightening plate 49b and the second straightening plate 50 inside the suction pipe 461. Through holes (for example, a first through hole G formed in the first portion 491 of the first straightening plate 49b, a second through hole J formed in the second portion 492 of the first straightening plate 49b, a second straightening plate 50 Do not flow into the through holes, etc. formed in the
　図７及び８に示すように、コーティング処理部４は、整流部材４０を備える。なお、図７及び８において、整流部材４０は簡略化して記載されている。 As shown in FIGS. 7 and 8, the coating processing section 4 includes a straightening member 40. As shown in FIGS. 7 and 8, the straightening member 40 is illustrated in a simplified manner.
　図７及び８に示すように、整流部材４０は、吸引管４６１内に配置されている。整流部材４０は、吸引管４６１内の吸引空間Ｖ２が減圧されても位置が変化しないように、吸引管４６１内に固定されている。整流部材４０は、例えば、保持機構又は支持機構により、吸引管４６１内に固定することができる。 As shown in FIGS. 7 and 8, the straightening member 40 is arranged inside the suction tube 461 . The straightening member 40 is fixed inside the suction pipe 461 so that its position does not change even if the suction space V2 inside the suction pipe 461 is decompressed. The straightening member 40 can be fixed within the suction tube 461 by, for example, a holding mechanism or a supporting mechanism.
　図７及び８に示すように、整流部材４０は、吸引管４６１の上端部に設けられた第２基材固定部４８と、吸引管４６１の下端部に接続された吸引機構４６２との間に配置されている。 As shown in FIGS. 7 and 8, the rectifying member 40 is positioned between the second substrate fixing portion 48 provided at the upper end of the suction tube 461 and the suction mechanism 462 connected to the lower end of the suction tube 461. are placed.
　図７及び８に示すように、吸引管移動機構４７によって吸引管４６１がスラリー吸引位置に移動すると、整流部材４０は、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。すなわち、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０は、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。 As shown in FIGS. 7 and 8, when the suction tube 461 is moved to the slurry suction position by the suction tube moving mechanism 47, the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. It is located apart from the second end surface T2. That is, when the slurry M supplied to the first end face T1 side of the porous base material 1 is sucked from the second end face T2 side of the porous base material 1, the rectifying member 40 moves toward the second end face T2 of the porous base material 1. It is located on the side of the end face T2 and is spaced apart from the second end face T2 of the porous substrate 1 .
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆し、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. At least part of the central region T22 of the porous substrate 1 is covered, and at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1 is exposed.
　「整流部材４０が、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆する」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び整流部材４０を多孔質基材１の軸方向Ｘから平面視したとき、整流部材４０のうち貫通孔以外の部分が、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部と重なることを意味する。整流部材４０は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の全体を被覆してもよいし、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を被覆してもよい。 "The rectifying member 40 covers at least a part of the central region T22 of the second end surface T2 of the porous substrate 1" means that the porous substrate is in a state where the suction pipe 461 is at the slurry suction position shown in FIG. 1 and the rectifying member 40 in plan view from the axial direction X of the porous substrate 1, the portion of the rectifying member 40 other than the through holes is the center of the second end surface T2 of the porous substrate 1. It means overlapping with at least part of the region T22. The rectifying member 40 may cover the entire central region T22 of the second end surface T2 of the porous substrate 1, or may cover a part of the central region T22 of the second end surface T2 of the porous substrate 1. good too.
　「整流部材４０が、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び整流部材４０を多孔質基材１の軸方向Ｘから平面視したとき、整流部材４０に形成された貫通孔が、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部と重なることを意味する。整流部材４０は、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の全体を露出させてもよいし、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の一部を露出させてもよい。 "The rectifying member 40 exposes at least a part of the outer edge region T21 of the second end surface T2 of the porous substrate 1" means that the porous substrate is in a state where the suction pipe 461 is at the slurry suction position shown in FIG. 1 and the straightening member 40 from the axial direction X of the porous substrate 1, the through-holes formed in the straightening member 40 correspond to the outer edge region of the second end surface T2 of the porous substrate 1. It means overlapping with at least part of T21. The rectifying member 40 may expose the entire outer edge region T21 of the second end surface T2 of the porous substrate 1, or expose a part of the outer edge region T21 of the second end surface T2 of the porous substrate 1. good too.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０が、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の筒状部１１の外周面から空気が流入し、多孔質基材１の径方向の外側部分における吸引力は低下する。しかしながら、整流部材４０が多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆するため、多孔質基材１の径方向の内側部分では空気が流れにくくなっている一方、整流部材４０が多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させるため、多孔質基材１の径方向の外側部分では空気が流れやすくなっている。したがって、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差が小さくなり、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. By arranging on the side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, air is drawn from the outer peripheral surface of the cylindrical portion 11 of the porous substrate 1. flows in and the suction force at the radially outer portion of the porous substrate 1 decreases. However, since the rectifying member 40 covers at least a part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the rectifying member 40 exposes at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1. FIG. Therefore, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
　以下、整流部材４０の実施形態について説明する。 An embodiment of the rectifying member 40 will be described below.
＜第１実施形態＞
　以下、図１１及び１２を参照して、第１実施形態に係る整流部材４０ａについて説明する。図１１は、整流部材４０ａが設けられている吸引管４６１の内部の拡大図であり、図１２は、整流部材４０ａが備える整流板４９ａの平面図である。なお、図１１は、図８に示すスラリー吸引位置にある吸引管４６１の内部の拡大図である。 <First embodiment>
Hereinafter, the straightening member 40a according to the first embodiment will be described with reference to FIGS. 11 and 12. FIG. FIG. 11 is an enlarged view of the inside of the suction tube 461 provided with the straightening member 40a, and FIG. 12 is a plan view of the straightening plate 49a provided in the straightening member 40a. 11 is an enlarged view of the inside of the suction pipe 461 at the slurry suction position shown in FIG.
　第１実施形態では、整流部材４０として、整流部材４０ａが使用される。 In the first embodiment, the rectifying member 40a is used as the rectifying member 40.
　図１１に示すように、整流部材４０ａは、整流板４９ａを備える。整流部材４０ａは、整流板４９ａで構成されていてもよいし、後述の整流部材４０ａの効果が発揮される限り、整流板４９ａ以外の部材を有していてもよい。 As shown in FIG. 11, the straightening member 40a includes a straightening plate 49a. The rectifying member 40a may be composed of the rectifying plate 49a, or may have a member other than the rectifying plate 49a as long as the effect of the rectifying member 40a, which will be described later, is exhibited.
　整流板４９ａの材質は、例えば、樹脂、セラミックス、金属等である。 The material of the current plate 49a is, for example, resin, ceramics, metal, or the like.
　整流板４９ａの厚みは適宜調整可能であるが、例えば１ｍｍ以上１５ｍｍ以下、好ましくは１ｍｍ以上５ｍｍ以下である。整流板４９ａの厚みは一定であってもよいし、一定でなくてもよい。整流板４９ａの厚みが一定でない場合、整流板４９ａの厚みの最小値及び最大値の両方が上記範囲であることが好ましい。 The thickness of the current plate 49a can be adjusted as appropriate, and is, for example, 1 mm or more and 15 mm or less, preferably 1 mm or more and 5 mm or less. The thickness of the current plate 49a may be constant or may not be constant. When the thickness of the rectifying plate 49a is not constant, both the minimum value and the maximum value of the thickness of the rectifying plate 49a are preferably within the above ranges.
　図１１に示すように、整流板４９ａは、吸引管４６１内に配置されている。整流板４９ａは、吸引管４６１内の吸引空間Ｖ２が減圧されても位置が変化しないように、吸引管４６１内に固定されている。整流板４９ａは、例えば、保持機構（例えば、吸引管４６１の内壁に設けられた、整流板４９ａの外縁部を把持するチャック機構（例えば、ハンドチャック等））により、あるいは、支持機構（例えば、整流板４９ａと吸引機構４６２との間に設けられた、整流板４９ａの吸引機構４６２側の面を支持する支持ロッド）により、吸引管４６１内に固定することができる。 As shown in FIG. 11, the current plate 49a is arranged inside the suction pipe 461. As shown in FIG. The straightening plate 49a is fixed inside the suction pipe 461 so that its position does not change even if the suction space V2 inside the suction pipe 461 is decompressed. The straightening plate 49a is held by, for example, a holding mechanism (for example, a chuck mechanism (eg, hand chuck) provided on the inner wall of the suction tube 461 that grips the outer edge of the straightening plate 49a), or a supporting mechanism (eg, It can be fixed in the suction tube 461 by a support rod provided between the straightening plate 49 a and the suction mechanism 462 and supporting the surface of the straightening plate 49 a on the side of the suction mechanism 462 .
　図１１に示すように、整流板４９ａは、吸引管４６１の上端部に設けられた第２基材固定部４８と、吸引管４６１の下端部に接続された吸引機構４６２との間に配置されている。 As shown in FIG. 11, the straightening plate 49a is arranged between the second substrate fixing portion 48 provided at the upper end of the suction tube 461 and the suction mechanism 462 connected to the lower end of the suction tube 461. ing.
　図１１に示すように、吸引管移動機構４７によって吸引管４６１がスラリー吸引位置に移動すると、整流板４９ａは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。すなわち、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。 As shown in FIG. 11, when the suction tube 461 is moved to the slurry suction position by the suction tube moving mechanism 47, the rectifying plate 49a moves toward the second end surface T2 of the porous substrate 1 and moves toward the second end surface T2 of the porous substrate 1. As shown in FIG. It is located apart from the end surface T2. That is, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying plate 49a moves toward the second end surface T2 of the porous substrate 1. It is located on the side of the end face T2 and is spaced apart from the second end face T2 of the porous substrate 1 .
　図１１に示すように、吸引管移動機構４７によって吸引管４６１がスラリー吸引位置に移動すると、整流板４９ａと多孔質基材１の第２端面Ｔ２との距離は、距離Ｄ２ａとなる。距離Ｄ２ａは、整流板４９ａの第２端面Ｔ２側の主面と多孔質基材１の第２端面Ｔ２との距離である。 As shown in FIG. 11, when the suction tube 461 is moved to the slurry suction position by the suction tube moving mechanism 47, the distance between the current plate 49a and the second end surface T2 of the porous substrate 1 becomes the distance D2a. The distance D2a is the distance between the second end face T2 side of the current plate 49a and the second end face T2 of the porous substrate 1 .
　図１１に示すように、整流板４９ａの第２端面Ｔ２側の主面は、多孔質基材１の第２端面Ｔ２と略平行である。本明細書において、「略平行」は、対象となる２つの面のなす角度が、好ましくは０°以上１０°以下、より好ましくは０°以上５°以下であることを意味する。なお、「略平行」には、平行も包含される。 As shown in FIG. 11, the main surface of the current plate 49a on the second end surface T2 side is substantially parallel to the second end surface T2 of the porous substrate 1. As shown in FIG. As used herein, the term "substantially parallel" means that the angle formed by two target surfaces is preferably 0° or more and 10° or less, more preferably 0° or more and 5° or less. In addition, parallel is also included in "substantially parallel."
　図１１及び１２に示すように、整流板４９ａは、環状（例えば円環状）の第１部分４９１と、第１部分４９１の内側に位置する第２部分４９２と、第１部分４９１の外側に位置する環状（例えば円環状）の第３部分４９３とを備える。 As shown in FIGS. 11 and 12, the rectifying plate 49a includes an annular (for example, annular) first portion 491, a second portion 492 positioned inside the first portion 491, and a second portion 492 positioned outside the first portion 491. and an annular (eg, toric) third portion 493 .
　吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第２端面Ｔ２を投影したとき）、図１１及び１２に示すように、整流板４９ａのうち、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１と重なる部分が第１部分４９１であり、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２と重なる部分が第２部分４９２である。なお、図１２において、整流板４９ａの平面図に投影された第２端面Ｔ２の外形線及び中央領域Ｔ２２の外形線（すなわち、境界線Ｌ２）はそれぞれ点線及び二点鎖線で示されている。 When the second end face T2 of the porous substrate 1 and the current plate 49a are viewed from the axial direction X of the porous substrate 1 in a state where the suction pipe 461 is at the slurry suction position shown in FIG. When the second end surface T2 of the porous substrate 1 is projected on the plan view of ), as shown in FIGS. The overlapping portion is the first portion 491 , and the portion overlapping the central region T22 of the second end surface T2 of the porous substrate 1 is the second portion 492 . In FIG. 12, the outline of the second end face T2 and the outline of the central region T22 (that is, the boundary line L2) projected onto the plan view of the current plate 49a are indicated by dotted lines and chain double-dashed lines, respectively.
　図１１及び１２に示すように、整流板４９ａの第１部分４９１には、第１部分４９１の周方向に延在する長孔状の第１貫通孔Ｇが形成されている。第１貫通孔Ｇの平面視形状は、幅Ｗを有する細長形状である。第１貫通孔Ｇの平面視形状及び数は適宜変更可能である。第１貫通孔Ｇの平面視形状は、例えば、円形状、楕円形状、正方形状、長方形状、長方形の角が丸くなった形状等であってもよい。第１貫通孔Ｇの数は１であってもよいし、２以上であってもよい。本実施形態における第１貫通孔Ｇの数は４である。 As shown in FIGS. 11 and 12, the first portion 491 of the straightening plate 49a is formed with an elongated first through hole G extending in the circumferential direction of the first portion 491. As shown in FIGS. A plan view shape of the first through hole G is an elongated shape having a width W. As shown in FIG. The plan view shape and number of the first through holes G can be changed as appropriate. The planar shape of the first through hole G may be, for example, circular, elliptical, square, rectangular, or a rectangular shape with rounded corners. The number of first through holes G may be one, or two or more. The number of first through holes G in this embodiment is four.
　図１１及び１２に示すように、整流板４９ａの第２部分４９２には、貫通孔は形成されていないが、貫通孔（以下「第２貫通孔」という。）が形成されていてもよい。 As shown in FIGS. 11 and 12, the second portion 492 of the rectifying plate 49a is not formed with through holes, but may be formed with through holes (hereinafter referred to as "second through holes").
　図１１及び１２に示すように、整流板４９ａの第２部分４９２は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆し、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇは、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる。 As shown in FIGS. 11 and 12, the second portion 492 of the current plate 49a covers at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the first portion 491 of the current plate 49a. The formed first through-hole G exposes at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1 .
　「整流板４９ａの第２部分４９２が、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆する」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第２端面Ｔ２を投影したとき）、図１１及び１２に示すように、整流板４９ａの第２部分４９２のうち第２貫通孔以外の部分が、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部と重なることを意味する。整流板４９ａの第２部分４９２に第２貫通孔が形成されていない場合、整流板４９ａの第２部分４９２は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の全体を被覆し、整流板４９ａの第２部分４９２に第２貫通孔が形成されている場合、整流板４９ａの第２部分４９２は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を被覆する。 "The second portion 492 of the current plate 49a covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1" means that the suction pipe 461 is in the slurry suction position shown in FIG. , when the second end surface T2 of the porous substrate 1 and the current plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, the second end surface T2 of the porous substrate 1 is shown in the plan view of the current plate 49a). is projected), as shown in FIGS. It means overlapping with a part. When the second portion 492 of the straightening plate 49a does not have a second through hole, the second portion 492 of the straightening plate 49a covers the entire central region T22 of the second end surface T2 of the porous substrate 1, When the second portion 492 of the straightening plate 49a has the second through hole, the second portion 492 of the straightening plate 49a covers part of the central region T22 of the second end surface T2 of the porous substrate 1. .
　「整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第２端面Ｔ２を投影したとき）、図１１及び１２に示すように、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部と重なることを意味する。 ``The first through holes G formed in the first portion 491 of the rectifying plate 49a expose at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1'' means that the suction tube 461 is 8, when the second end surface T2 of the porous substrate 1 and the rectifying plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, a plan view of the rectifying plate 49a shows a porous structure). 11 and 12, the first through hole G formed in the first portion 491 of the rectifying plate 49a is located at the second end surface T2 of the porous substrate 1). It means overlapping with at least part of the outer edge region T21 of the two end surfaces T2.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０ａが、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の筒状部１１の外周面から空気が流入し、多孔質基材１の径方向の外側部分における吸引力は低下する。しかしながら、整流板４９ａの第２部分４９２が多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆するため、多孔質基材１の径方向の内側部分では空気が流れにくくなっている一方、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させるため、多孔質基材１の径方向の外側部分では空気が流れやすくなっている。したがって、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差が小さくなり、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the straightening member 40a By arranging on the side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, air is drawn from the outer peripheral surface of the cylindrical portion 11 of the porous substrate 1. flows in and the suction force at the radially outer portion of the porous substrate 1 decreases. However, since the second portion 492 of the rectifying plate 49a covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow through the radially inner portion of the porous substrate 1. On the other hand, since the first through holes G formed in the first portion 491 of the current plate 49a expose at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1, the porous substrate The radially outer portion of 1 facilitates air flow. Therefore, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
＜第２実施形態＞
　以下、図１３～１５を参照して、第２実施形態に係る整流部材４０ｂについて説明する。図１３は、整流部材４０ｂが設けられている吸引管４６１の内部の拡大図であり、図１４は、整流部材４０ｂが備える第１整流板４９ｂの平面図であり、図１５は、整流部材４０ｂが備える第２整流板５０の平面図である。なお、図１３は、図８に示すスラリー吸引位置にある吸引管４６１の内部の拡大図である。 <Second embodiment>
A rectifying member 40b according to the second embodiment will be described below with reference to FIGS. 13 to 15. FIG. 13 is an enlarged view of the inside of the suction pipe 461 provided with the straightening member 40b, FIG. 14 is a plan view of the first straightening plate 49b provided in the straightening member 40b, and FIG. 15 is a plan view of the straightening member 40b. 2 is a plan view of a second rectifying plate 50 provided in the . 13 is an enlarged view of the inside of the suction pipe 461 at the slurry suction position shown in FIG.
　第２実施形態では、整流部材４０として、整流部材４０ｂが使用される。 In the second embodiment, as the rectifying member 40, a rectifying member 40b is used.
　図１３に示すように、整流部材４０ｂは、第１整流板４９ｂ及び第２整流板５０を備える。整流部材４０ｂは、第１整流板４９ｂ及び第２整流板５０で構成されていてもよいし、後述の整流部材４０ｂの効果が発揮される限り、第１整流板４９ｂ及び第２整流板５０以外の部材を有していてもよい。 As shown in FIG. 13, the straightening member 40b includes a first straightening plate 49b and a second straightening plate 50. As shown in FIG. The rectifying member 40b may be composed of the first rectifying plate 49b and the second rectifying plate 50, or other than the first rectifying plate 49b and the second rectifying plate 50 as long as the effect of the rectifying member 40b described later is exhibited. You may have a member of.
　第１整流板４９ｂの材質は、例えば、樹脂、セラミックス、金属等である。 The material of the first current plate 49b is, for example, resin, ceramics, metal, or the like.
　第１整流板４９ｂの厚みは適宜調整可能であるが、例えば１ｍｍ以上１５ｍｍ以下、好ましくは１ｍｍ以上５ｍｍ以下である。第１整流板４９ｂの厚みは一定であってもよいし、一定でなくてもよい。第１整流板４９ｂの厚みが一定でない場合、第１整流板４９ｂの厚みの最小値及び最大値の両方が上記範囲であることが好ましい。 The thickness of the first current plate 49b can be adjusted as appropriate, and is, for example, 1 mm or more and 15 mm or less, preferably 1 mm or more and 5 mm or less. The thickness of the first current plate 49b may be constant or may not be constant. If the thickness of the first current plate 49b is not constant, both the minimum value and the maximum value of the thickness of the first current plate 49b are preferably within the above ranges.
　図１３に示すように、第１整流板４９ｂは、吸引管４６１内に配置されている。第１整流板４９ｂは、吸引管４６１内の吸引空間Ｖ２が減圧されても位置が変化しないように、吸引管４６１内に固定されている。第１整流板４９ｂは、例えば、保持機構（例えば、吸引管４６１の内壁に設けられた、第１整流板４９ｂの外縁部を把持するチャック機構（例えば、ハンドチャック等））により、あるいは、支持機構（例えば、第１整流板４９ｂと吸引機構４６２との間に設けられた、第１整流板４９ｂの吸引機構４６２側の面を支持する支持ロッド）により、吸引管４６１内に固定することができる。 As shown in FIG. 13, the first current plate 49b is arranged inside the suction pipe 461. As shown in FIG. The first straightening plate 49b is fixed inside the suction pipe 461 so that its position does not change even if the pressure in the suction space V2 inside the suction pipe 461 is reduced. The first straightening plate 49b is, for example, supported by a holding mechanism (eg, a chuck mechanism (eg, hand chuck) provided on the inner wall of the suction tube 461 that grips the outer edge of the first straightening plate 49b). It can be fixed in the suction tube 461 by a mechanism (for example, a support rod provided between the first straightening plate 49b and the suction mechanism 462 and supporting the surface of the first straightening plate 49b on the side of the suction mechanism 462). can.
　図１３に示すように、第１整流板４９ｂは、吸引管４６１の上端部に設けられた第２基材固定部４８と、吸引管４６１の下端部に接続された吸引機構４６２との間に配置されている。 As shown in FIG. 13, the first straightening plate 49b is located between the second substrate fixing portion 48 provided at the upper end of the suction pipe 461 and the suction mechanism 462 connected to the lower end of the suction pipe 461. are placed.
　図１３に示すように、吸引管移動機構４７によって吸引管４６１がスラリー吸引位置に移動すると、第１整流板４９ｂは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。すなわち、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、第１整流板４９ｂは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。 As shown in FIG. 13, when the suction tube 461 is moved to the slurry suction position by the suction tube moving mechanism 47, the first rectifying plate 49b moves toward the second end surface T2 of the porous substrate 1. It is located apart from the second end surface T2. That is, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first straightening plate 49b It is located on the side of the second end face T2 and separated from the second end face T2 of the porous substrate 1 .
　図１３に示すように、吸引管移動機構４７によって吸引管４６１がスラリー吸引位置に移動すると、第１整流板４９ｂと多孔質基材１の第２端面Ｔ２との距離は、距離Ｄ２ｂとなる。距離Ｄ２ｂは、第１整流板４９ｂの第２端面Ｔ２側の主面と多孔質基材１の第２端面Ｔ２との距離である。 As shown in FIG. 13, when the suction tube 461 is moved to the slurry suction position by the suction tube moving mechanism 47, the distance between the first current plate 49b and the second end surface T2 of the porous substrate 1 becomes the distance D2b. The distance D2b is the distance between the main surface of the first current plate 49b on the second end surface T2 side and the second end surface T2 of the porous substrate 1 .
　図１３に示すように、第１整流板４９ｂの第２端面Ｔ２側の主面は、多孔質基材１の第２端面Ｔ２と略平行である。「略平行」の意義は、上記の通りである。 As shown in FIG. 13 , the main surface of the first current plate 49b on the second end surface T2 side is substantially parallel to the second end surface T2 of the porous substrate 1 . The meaning of "substantially parallel" is as described above.
　図１３及び１４に示すように、第１整流板４９ｂは、第２部分４９２に第２貫通孔Ｊが形成されている点で、第１実施形態に係る整流板４９ａと異なる。第１整流板４９ｂのその他の構成は、整流板４９ａと同一であり、第１整流板４９ｂにおいて、整流板４９ａと同一の部材又は部分は、整流板４９ａと同一の符号で示されている。整流板４９ａに関する上記説明は、別段規定される場合を除き、第１整流板４９ｂにも適用される。 As shown in FIGS. 13 and 14, the first straightening plate 49b differs from the straightening plate 49a according to the first embodiment in that the second portion 492 is formed with the second through holes J. As shown in FIGS. Other configurations of the first straightening plate 49b are the same as those of the straightening plate 49a, and in the first straightening plate 49b, the same members or portions as the straightening plate 49a are denoted by the same reference numerals as those of the straightening plate 49a. The above description of the rectifying plate 49a also applies to the first rectifying plate 49b, unless otherwise specified.
　図１４に示すように、第２貫通孔Ｊの平面視形状は、円形状であり、第２貫通孔Ｊの数は１である。第２貫通孔Ｊの平面視形状は適宜変更可能であり、その他の形状、例えば、楕円形状、正方形状、長方形状、長方形の角が丸くなった形状等であってもよい。第２貫通孔Ｊの数は適宜変更可能であり、２以上であってもよい。図１４に示すように、第２貫通孔Ｊは、第１部分４９１に形成された第１貫通孔Ｇと連続していないが、連続していてもよい。 As shown in FIG. 14, the planar shape of the second through holes J is circular, and the number of the second through holes J is one. The planar view shape of the second through hole J can be changed as appropriate, and may be other shapes such as an elliptical shape, a square shape, a rectangular shape, a rectangular shape with rounded corners, and the like. The number of second through holes J can be changed as appropriate, and may be two or more. As shown in FIG. 14, the second through hole J is not continuous with the first through hole G formed in the first portion 491, but may be continuous.
　後述の整流部材４０ｂの効果をより向上させる観点から、中央領域Ｔ２２の平面視形状と第２貫通孔Ｊの平面視形状とは、相似形状であることが好ましい。 From the viewpoint of further improving the effect of the rectifying member 40b, which will be described later, it is preferable that the planar view shape of the central region T22 and the planar view shape of the second through hole J are similar shapes.
　図１３及び１４に示すように、第２貫通孔Ｊは、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を露出させる。 As shown in FIGS. 13 and 14, the second through hole J exposes at least part of the central region T22 of the second end surface T2 of the porous substrate 1.
　「第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を露出させる」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び第１整流板４９ｂを多孔質基材１の軸方向Ｘから平面視したとき（例えば、第１整流板４９ｂの平面図に多孔質基材１の第２端面Ｔ２を投影したとき）、図１３及び１４に示すように、第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部と重なることを意味する。なお、図１４において、第１整流板４９ｂの平面図に投影された第２端面Ｔ２の外形線及び中央領域Ｔ２２の外形線（すなわち、境界線Ｌ２）はそれぞれ点線及び二点鎖線で示されている。 “The second through-hole J exposes at least a part of the central region T22 of the second end surface T2 of the porous substrate 1” means that the suction tube 461 is porous when it is in the slurry suction position shown in FIG. When the second end surface T2 of the substrate 1 and the first current plate 49b are viewed from the axial direction X of the porous substrate 1 (for example, the second end surface of the porous substrate 1 is shown in the plan view of the first current plate 49b). T2), as shown in FIGS. 13 and 14, the second through hole J overlaps at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1. In FIG. 14, the outline of the second end surface T2 and the outline of the central region T22 (that is, the boundary line L2) projected onto the plan view of the first current plate 49b are indicated by dotted lines and chain double-dashed lines, respectively. there is
　第２貫通孔Ｊは、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の全体を露出させてもよいし、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を露出させてもよい。第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を露出させる場合、第１整流板４９ｂの第２部分４９２は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の残部を被覆する。 The second through hole J may expose the entire central region T22 of the second end surface T2 of the porous substrate 1, or expose a portion of the central region T22 of the second end surface T2 of the porous substrate 1. You may let When the second through hole J exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1, the second portion 492 of the first current plate 49b Cover the rest of the central region T22 of T2.
　「第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を露出させ、第１整流板４９ｂの第２部分４９２が、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の残部を被覆する」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び第１整流板４９ｂを多孔質基材１の軸方向Ｘから平面視したとき（例えば、第１整流板４９ｂの平面図に多孔質基材１の第２端面Ｔ２を投影したとき）、図１３及び１４に示すように、第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部と重なり、第１整流板４９ｂの第２部分４９２のうち第２貫通孔Ｊ以外の部分が、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の残部と重なることを意味する。 "The second through-hole J exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1, and the second portion 492 of the first straightening plate 49b exposes the second end surface of the porous substrate 1. The phrase "covering the remainder of the central region T22 of T2" means that the second end surface T2 of the porous substrate 1 and the first straightening plate 49b are covered with the porous substrate while the suction pipe 461 is in the slurry suction position shown in FIG. 1 (for example, when the second end surface T2 of the porous substrate 1 is projected onto the plan view of the first current plate 49b), as shown in FIGS. The hole J overlaps with a part of the central region T22 of the second end surface T2 of the porous substrate 1, and the portion of the second portion 492 of the first current plate 49b other than the second through hole J overlaps with the porous substrate. It means overlapping with the rest of the central region T22 of the second end face T2 of No. 1.
　第２貫通孔Ｊが中央領域Ｔ２２の一部を露出させ、第１整流板４９ｂの第２部分４９２が中央領域Ｔ２２の残部を被覆する場合、中央領域Ｔ２２の平面視形状と第２貫通孔Ｊの平面視形状とが相似形状となるように、第１整流板４９ｂの第２部分４９２のうち第２貫通孔Ｊ以外の部分は、第２部分４９２の外形線に沿って所定の幅で形成されていることが好ましい。すなわち、第１整流板４９ｂの第２部分４９２のうち第２貫通孔Ｊ以外の部分の平面視形状は、環状（例えば円環状）であることが好ましい。中央領域Ｔ２２の平面視形状と第２貫通孔Ｊの平面視形状とが相似形状となる限り、第１整流板４９ｂの第２部分４９２のうち第２貫通孔Ｊ以外の部分の幅は一定であってもよいし、一定でなくてもよい。 When the second through hole J exposes a portion of the central region T22 and the second portion 492 of the first current plate 49b covers the remaining portion of the central region T22, the planar shape of the central region T22 and the second through hole J The second portion 492 of the first current plate 49b, other than the second through hole J, is formed with a predetermined width along the outline of the second portion 492 so that the second portion 492 of the first current plate 49b has a similar shape to the shape in plan view. It is preferable that That is, it is preferable that the planar view shape of the second portion 492 of the first current plate 49b other than the second through hole J is annular (for example, annular). As long as the planar view shape of the central region T22 and the planar view shape of the second through hole J are similar, the width of the portion other than the second through hole J in the second portion 492 of the first current plate 49b is constant. It may be, or it may not be constant.
　第２整流板５０の材質は、例えば、樹脂、セラミックス、金属等である。 The material of the second current plate 50 is, for example, resin, ceramics, metal, or the like.
　第２整流板５０の厚みは適宜調整可能であるが、例えば１ｍｍ以上１５ｍｍ以下、好ましくは１ｍｍ以上５ｍｍ以下である。第２整流板５０の厚みは一定であってもよいし、一定でなくてもよい。第２整流板５０の厚みが一定でない場合、第２整流板５０の厚みの最小値及び最大値の両方が上記範囲であることが好ましい。 The thickness of the second current plate 50 can be adjusted as appropriate, and is, for example, 1 mm or more and 15 mm or less, preferably 1 mm or more and 5 mm or less. The thickness of the second current plate 50 may be constant or may not be constant. When the thickness of the second current plate 50 is not constant, both the minimum value and the maximum value of the thickness of the second current plate 50 are preferably within the above ranges.
　図１３に示すように、第２整流板５０は、吸引管４６１内に配置されている。第２整流板５０は、吸引管４６１内の吸引空間Ｖ２が減圧されても位置が変化しないように、吸引管４６１内に固定されている。第２整流板５０は、例えば、第１整流板４９ｂと第２整流板５０とを連結する連結部材（例えば、第１整流板４９ｂの第３部分４９３と第２整流板５０とを連結する連結部材７０（図１３参照））により、あるいは、保持機構（例えば、吸引管４６１の内壁に設けられた、第２整流板５０の外縁部を把持するチャック機構（例えば、ハンドチャック等））により、あるいは、支持機構（例えば、第２整流板５０と吸引機構４６２との間に設けられた、第２整流板５０の吸引機構４６２側の面を支持する支持ロッド）により、吸引管４６１内に固定することができる。なお、図１４において、連結部材７０は省略されている。 As shown in FIG. 13, the second current plate 50 is arranged inside the suction pipe 461 . The second straightening plate 50 is fixed inside the suction pipe 461 so that its position does not change even if the pressure in the suction space V2 inside the suction pipe 461 is reduced. The second rectifying plate 50 is, for example, a connecting member that connects the first rectifying plate 49b and the second rectifying plate 50 (for example, a connecting member that connects the third portion 493 of the first rectifying plate 49b and the second rectifying plate 50). member 70 (see FIG. 13)), or by a holding mechanism (for example, a chuck mechanism (for example, a hand chuck, etc.) provided on the inner wall of the suction tube 461 for gripping the outer edge of the second current plate 50). Alternatively, it is fixed in the suction tube 461 by a support mechanism (for example, a support rod provided between the second straightening plate 50 and the suction mechanism 462 and supporting the surface of the second straightening plate 50 on the side of the suction mechanism 462). can do. 14, the connecting member 70 is omitted.
　整流部材４０ｂを多孔質基材１の軸方向Ｘから平面視したとき、連結部材７０は、第１整流板４９ｂの第１部分４９１に形成された第１貫通孔Ｇの一部と重なる。連結部材７０と重なる第１貫通孔Ｇの一部の面積は、第１貫通孔Ｇの面積の２０％以下であることが好ましく、１０％以下であることがより好ましく、５％以下であることがより一層好ましい。この場合、連結部材７０が、第１貫通孔Ｇを通る空気の流れの障害とならないため、後述の整流部材４０ｂの効果をより向上させることができる。連結部材７０と重なる第１貫通孔Ｇの一部の面積の下限は、連結部材７０の強度等を考慮して適宜調整可能である。なお、「第１貫通孔Ｇの面積」は、第１整流板４９ｂの第１部分４９１に２以上の第１貫通孔Ｇが形成されている場合には、当該２以上の第１貫通孔Ｇの合計面積を意味する。また、「第１貫通孔Ｇの面積」は、第１貫通孔Ｇを多孔質基材１の軸方向Ｘから平面視したときの面積である。 When the rectifying member 40b is viewed from the axial direction X of the porous substrate 1, the connecting member 70 overlaps a part of the first through hole G formed in the first portion 491 of the first rectifying plate 49b. The area of the part of the first through hole G that overlaps with the connecting member 70 is preferably 20% or less, more preferably 10% or less, and 5% or less of the area of the first through hole G. is even more preferred. In this case, since the connecting member 70 does not interfere with the flow of air passing through the first through holes G, the effect of the rectifying member 40b, which will be described later, can be further improved. The lower limit of the area of the portion of the first through-hole G that overlaps the connecting member 70 can be appropriately adjusted in consideration of the strength of the connecting member 70 and the like. In addition, when two or more first through holes G are formed in the first portion 491 of the first current plate 49b, the "area of the first through holes G" is means the total area of Further, “the area of the first through-hole G” is the area of the first through-hole G when viewed from the axial direction X of the porous substrate 1 in plan view.
　図１３に示すように、第２整流板５０は、第１整流板４９ｂと、吸引管４６１の下端部に接続された吸引機構４６２との間に配置されている。すなわち、第２整流板５０は、第１整流板４９ｂに対して多孔質基材１の第２端面Ｔ２とは反対側に配置されている。この位置関係は、吸引管４６１がスラリー吸引位置にある状態でも、吸引管４６１が待機位置にある状態でも、変わらない。したがって、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、第２整流板５０は、第１整流板４９ｂに対して多孔質基材１の第２端面Ｔ２とは反対側に位置する。 As shown in FIG. 13, the second straightening plate 50 is arranged between the first straightening plate 49b and the suction mechanism 462 connected to the lower end of the suction pipe 461. As shown in FIG. That is, the second straightening plate 50 is arranged on the side opposite to the second end face T2 of the porous substrate 1 with respect to the first straightening plate 49b. This positional relationship does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second rectifying plate 50 moves toward the first rectifying plate 49b. On the other hand, it is located on the side opposite to the second end surface T2 of the porous substrate 1 .
　図１３に示すように、第１整流板４９ｂと第２整流板５０との距離は、距離Ｄ３である。距離Ｄ３は、第１整流板４９ｂの第２整流板５０側の主面と、第２整流板５０の第１整流板４９ｂ側の主面との距離である。距離Ｄ３は、吸引管４６１がスラリー吸引位置にある状態でも、吸引管４６１が待機位置にある状態でも、変わらない。したがって、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、第１整流板４９ｂと第２整流板５０との距離は、距離Ｄ３である。 As shown in FIG. 13, the distance between the first rectifying plate 49b and the second rectifying plate 50 is the distance D3. The distance D3 is the distance between the main surface of the first straightening plate 49b on the second straightening plate 50 side and the main surface of the second straightening plate 50 on the first straightening plate 49b side. The distance D3 does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first rectifying plate 49b and the second rectifying plate 50 The distance is distance D3.
　図１３に示すように、第２整流板５０の第２端面Ｔ２側の主面は、多孔質基材１の第２端面Ｔ２と略平行である。「略平行」の意義は、上記の通りである。 As shown in FIG. 13 , the main surface of the second current plate 50 on the second end surface T2 side is substantially parallel to the second end surface T2 of the porous substrate 1 . The meaning of "substantially parallel" is as described above.
　図１５に示すように、第２整流板５０には、貫通孔は形成されていないが、貫通孔が形成されていてもよい。 As shown in FIG. 15, the second current plate 50 is not formed with through holes, but may be formed with through holes.
　図１３～１５に示すように、第２整流板５０は、第２貫通孔Ｊの少なくとも一部を被覆する。 As shown in FIGS. 13 to 15, the second current plate 50 covers at least part of the second through holes J. As shown in FIGS.
　「第２整流板５０が、第２貫通孔Ｊの少なくとも一部を被覆する」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において第１整流板４９ｂ及び第２整流板５０を多孔質基材１の軸方向Ｘから平面視したとき（例えば、第１整流板４９ｂの平面図に第２整流板５０を投影したとき、又は、第２整流板５０の平面図に第２貫通孔Ｊを投影したとき）、図１３～１５に示すように、第２整流板５０のうち貫通孔以外の部分が、第２貫通孔Ｊの少なくとも一部と重なることを意味する。なお、図１４において、第１整流板４９ｂの平面図に投影された第２整流板５０の外形線は点線で示されている。また、図１５において、第２整流板５０の平面図に投影された第２貫通孔Ｊの外形線は点線で示されている。 “The second straightening plate 50 covers at least part of the second through hole J” means that the first straightening plate 49b and the second straightening plate 50 are in a state where the suction pipe 461 is at the slurry suction position shown in FIG. is viewed from the axial direction X of the porous substrate 1 (for example, when the second straightening plate 50 is projected on the plan view of the first straightening plate 49b, or when the second straightening plate 50 is projected on the plan view of the second straightening plate 50, the second 13 to 15, the portion of the second current plate 50 other than the through hole overlaps with at least a portion of the second through hole J when the through hole J is projected. In FIG. 14, the outline of the second straightening plate 50 projected onto the plan view of the first straightening plate 49b is indicated by a dotted line. In addition, in FIG. 15, the outline of the second through hole J projected onto the plan view of the second current plate 50 is indicated by a dotted line.
　第２整流板５０に貫通孔が形成されていない場合、第２整流板５０は、第２貫通孔Ｊの全体を被覆し、第２整流板５０に貫通孔が形成されている場合、第２整流板５０は、第２貫通孔Ｊの一部を被覆する。 When the second current plate 50 does not have a through hole, the second current plate 50 covers the entire second through hole J, and when the second current plate 50 has a through hole, the second current plate 50 covers the second through hole J. The current plate 50 partially covers the second through hole J. As shown in FIG.
　吸引管４６１が図８に示すスラリー吸引位置にある状態において第１整流板４９ｂ及び第２整流板５０を多孔質基材１の軸方向Ｘから平面視したとき（例えば、第１整流板４９ｂの平面図に第２整流板５０を投影したとき）、図１３及び１４に示すように、第２整流板５０の外形線は、第２貫通孔Ｊの外形線の外側に位置することが好ましい。第２整流板５０の外形線が第２貫通孔Ｊの外形線の外側に位置する場合、第２整流板５０の開口面積を調整することにより、第２貫通孔Ｊの全体を第２整流板５０で被覆することも、第２貫通孔Ｊの一部を第２整流板５０で被覆することも可能となる。 When the suction tube 461 is at the slurry suction position shown in FIG. When the second flow plate 50 is projected onto a plan view, the outline of the second flow plate 50 is preferably positioned outside the outline of the second through hole J, as shown in FIGS. When the contour line of the second straightening plate 50 is located outside the contour line of the second through hole J, the opening area of the second straightening plate 50 is adjusted so that the entire second through hole J becomes the second straightening plate. It is also possible to cover a part of the second through hole J with the second current plate 50 .
　吸引管４６１が図８に示すスラリー吸引位置にある状態において第１整流板４９ｂ及び第２整流板５０を多孔質基材１の軸方向Ｘから平面視したとき（例えば、第１整流板４９ｂの平面図に第２整流板５０を投影したとき）、図１３及び１４に示すように、第２整流板５０の外形線は、第１整流板４９ｂの第２部分４９２の外形線の内側に位置することが好ましい。この場合、第２整流板５０が、第１貫通孔Ｇを通る空気の流れの障害とならないため、後述の整流部材４０ｂの効果をより向上させることができる。 When the suction tube 461 is at the slurry suction position shown in FIG. 13 and 14, the outline of the second straightening plate 50 is positioned inside the outline of the second portion 492 of the first straightening plate 49b. preferably. In this case, the second rectifying plate 50 does not interfere with the flow of air passing through the first through holes G, so that the effect of the rectifying member 40b, which will be described later, can be further improved.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０ｂが、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の筒状部１１の外周面から空気が流入し、多孔質基材１の径方向の外側部分における吸引力は低下する。しかしながら、第１整流板４９ｂに形成された第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を露出させ、第２整流板５０が、第１整流板４９ｂに形成された第２貫通孔Ｊの少なくとも一部を被覆するため、多孔質基材１の径方向の内側部分では空気が流れにくくなっている一方、第１整流板４９ｂに形成された第１貫通孔Ｇが多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させるため、多孔質基材１の径方向の外側部分では空気が流れやすくなっている。したがって、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差が小さくなり、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying member 40b moves toward the second end surface T2 of the porous substrate 1. By arranging on the side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, air is drawn from the outer peripheral surface of the cylindrical portion 11 of the porous substrate 1. flows in and the suction force at the radially outer portion of the porous substrate 1 decreases. However, the second through hole J formed in the first straightening plate 49b exposes at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the second straightening plate 50 serves as the first straightening plate. Since at least a part of the second through hole J formed in the plate 49b is covered, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the first through holes G expose at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1. FIG. Therefore, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
　また、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０ｂが、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａが、多孔質基材１の第２端面Ｔ２側に配置される場合、整流板４９ａの第２部分４９２と多孔質基材１の第２端面Ｔ２との間で、乱流が発生し、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）が発生するおそれがある。以下、乱流を発生させる、整流板４９ａと多孔質基材１の第２端面Ｔ２との距離をＤｘとする。これに対して、整流部材４９ｂでは、第２貫通孔Ｊが第１整流板４９ｂの第２部分４９２に形成されているため、第１整流板４９ｂと多孔質基材１の第２端面Ｔ２との距離がＤｘであっても、第１整流板４９ｂの第２部分４９２と多孔質基材１の第２端面Ｔ２との間において乱流が発生しにくい。また、整流部材４９ｂでは、第２整流板５０が第１整流板４９ｂに対して多孔質基材１の第２端面Ｔ２とは反対側に配置されているため、第１整流板４９ｂと多孔質基材１の第２端面Ｔ２との距離がＤｘであっても、第２整流板５０と多孔質基材１の第２端面Ｔ２との距離はＤｘよりも大きくなっており、第２整流板５０と多孔質基材１の第２端面Ｔ２との間において乱流が発生しにくい。したがって、第１整流板４９ｂ及び第２整流板５０が使用される場合には、整流板４９ａが使用される場合よりも、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）の発生を防止することができる。 Further, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the straightening member 40b By arranging on the end surface T2 side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a side, a turbulent flow occurs between the second portion 492 of the rectifying plate 49a and the second end surface T2 of the porous substrate 1, causing variations in the length of the slurry layers N (particularly, Variation in length between slurry layers N formed on the inner portion of the porous substrate 1 in the radial direction may occur. Hereinafter, the distance between the rectifying plate 49a and the second end surface T2 of the porous substrate 1, which generates turbulent flow, is defined as Dx. On the other hand, in the straightening member 49b, since the second through hole J is formed in the second portion 492 of the first straightening plate 49b, the first straightening plate 49b and the second end surface T2 of the porous base material 1 is Dx, turbulent flow is less likely to occur between the second portion 492 of the first rectifying plate 49b and the second end face T2 of the porous substrate 1 . Further, in the rectifying member 49b, the second rectifying plate 50 is arranged on the opposite side of the first rectifying plate 49b from the second end surface T2 of the porous substrate 1, so that the first rectifying plate 49b and the porous Even if the distance from the second end surface T2 of the substrate 1 is Dx, the distance between the second straightening plate 50 and the second end surface T2 of the porous substrate 1 is greater than Dx, and the second straightening plate A turbulent flow is less likely to occur between 50 and the second end surface T2 of the porous substrate 1 . Therefore, when the first rectifying plate 49b and the second rectifying plate 50 are used, the variation in length between the slurry layers N (in particular, the porous substrate 1 It is possible to prevent the occurrence of variations in length between the slurry layers N formed in the radially inner portion of the .
≪構造体製造方法≫
　以下、本発明の構造体製造方法の実施形態について説明する。 <<Method for manufacturing structure>>
An embodiment of the structure manufacturing method of the present invention will be described below.
　本発明の構造体製造方法は、以下の工程：
（ａ）多孔質基材１の第１端面Ｔ１側に、機能層の原料を含有するスラリーＭを供給する工程；及び
（ｂ）多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭを多孔質基材１の第２端面Ｔ２側から吸引し、多孔質基材１の第１セルの内壁に、多孔質基材１の第１端面Ｔ１から多孔質基材１の第２端面Ｔ２に向けて延在し、多孔質基材１の第２端面Ｔ２に達しないスラリー層Ｎを形成する工程
を含む。 The structure manufacturing method of the present invention comprises the following steps:
(a) a step of supplying a slurry M containing raw materials for the functional layer to the first end surface T1 side of the porous substrate 1; and (b) a slurry supplied to the first end surface T1 side of the porous substrate 1. M is sucked from the second end surface T2 side of the porous substrate 1, and is applied to the inner wall of the first cell of the porous substrate 1 from the first end surface T1 of the porous substrate 1 to the second end surface of the porous substrate 1. A step of forming a slurry layer N that extends toward T2 and does not reach the second end face T2 of the porous substrate 1 is included.
　本発明の構造体製造方法は、構造体製造装置１００により実施することができる。構造体製造装置１００により本発明の構造体製造方法を実施する場合、工程（ａ）及び（ｂ）は、コーティング処理部４により実施される。この際、コーティング処理部４の動作は、制御部３によって制御される。 The structure manufacturing method of the present invention can be implemented by the structure manufacturing apparatus 100. When the structure manufacturing method of the present invention is performed by the structure manufacturing apparatus 100 , steps (a) and (b) are performed by the coating processing section 4 . At this time, the operation of the coating processor 4 is controlled by the controller 3 .
　以下、構造体製造装置１００により実施される構造体製造方法の実施形態について説明する。本実施形態では、端面Ｓ１が第１端面Ｔ１、端面Ｓ２が第２端面Ｔ２、セル１３ａが第１セル、セル１３ｂが第２セルである。 An embodiment of the structure manufacturing method performed by the structure manufacturing apparatus 100 will be described below. In this embodiment, the end face S1 is the first end face T1, the end face S2 is the second end face T2, the cell 13a is the first cell, and the cell 13b is the second cell.
　まず、基材搬入工程が行われる。基材搬入工程では、多孔質基材１がコーティング処理部４へ搬入される。制御部３は、搬送機構２２２の動作を制御して、載置部２１１に載置された多孔質基材１をコーティング処理部４へ搬入する。 First, the base material loading process is performed. In the substrate loading step, the porous substrate 1 is loaded into the coating processing section 4 . The control unit 3 controls the operation of the transport mechanism 222 to carry the porous substrate 1 placed on the placement unit 211 into the coating processing unit 4 .
　基材搬入工程の後、基材保持工程が行われる。基材保持工程では、コーティング処理部４へ搬入された多孔質基材１が基材保持部４１に保持される。搬送機構２２２によってコーティング処理部４へ搬入された多孔質基材１は、そのまま、搬送機構２２２によって保持されてもよい。この場合、搬送機構２２２は、基材保持部４１として機能する。 After the base material loading process, the base material holding process is performed. In the substrate holding step, the porous substrate 1 carried into the coating processing section 4 is held by the substrate holding section 41 . The porous substrate 1 carried into the coating processing section 4 by the transport mechanism 222 may be held by the transport mechanism 222 as it is. In this case, the transport mechanism 222 functions as the substrate holder 41 .
　基材保持工程の後、ノズル移動工程及び吸引管移動工程が行われる。ノズル移動工程及び吸引管移動工程の順序は特に限定されない。ノズル移動工程の後、吸引管移動工程が行われてもよいし、吸引管移動工程の後、ノズル移動工程が行われてもよいし、ノズル移動工程及び吸引管移動工程が同時に行われてもよい。 After the substrate holding process, the nozzle moving process and the suction pipe moving process are performed. The order of the nozzle moving process and the suction tube moving process is not particularly limited. After the nozzle moving process, the suction tube moving process may be performed, after the suction tube moving process, the nozzle moving process may be performed, or the nozzle moving process and the suction tube moving process may be performed at the same time. good.
　ノズル移動工程では、ノズル移動機構４３がノズル４２２を図７に示す待機位置から図８に示すスラリー供給位置に移動させる。 In the nozzle moving process, the nozzle moving mechanism 43 moves the nozzle 422 from the standby position shown in FIG. 7 to the slurry supply position shown in FIG.
　制御部３は、ノズル移動機構４３の動作を制御し、ノズル４２２を待機位置からスラリー供給位置に移動させるタイミング、ノズル４２２をスラリー供給位置から待機位置に移動させるタイミング等を制御する。 The control unit 3 controls the operation of the nozzle moving mechanism 43 to control the timing of moving the nozzle 422 from the standby position to the slurry supply position, the timing of moving the nozzle 422 from the slurry supply position to the standby position, and the like.
　ノズル４２２がスラリー供給位置に移動すると、多孔質基材１の第１端面Ｔ１側の端部は、治具４４内に進入し、治具４４内には、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭの貯留を可能とする貯留空間Ｖ１が形成される。 When the nozzle 422 moves to the slurry supply position, the end of the porous substrate 1 on the side of the first end surface T1 enters the jig 44, and the first end surface of the porous substrate 1 is placed in the jig 44. A storage space V1 is formed in which the slurry M supplied to the T1 side can be stored.
　治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部は、第１基材固定部４５によって治具４４内に固定される。第１基材固定部４５は、例えば、風船式チャック等のチャック機構を有する。制御部３は、第１基材固定部４５の動作を制御し、治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部を治具４４内に固定するタイミング、固定を解除するタイミング等を制御する。具体的には、制御部３は、第１基材固定部４５の動作を制御して、多孔質基材１の第１端面Ｔ１側の端部が治具４４内に進入する際には、風船式チャックが有する風船を膨張させず、多孔質基材１の第１端面Ｔ１側の端部が治具４４内に進入した後には、風船式チャックが有する風船を空気圧により膨張させ、治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部を治具４４内に固定する。この際、風船式チャックが有する風船は、治具４４と、治具４４内に進入した多孔質基材１の第１端面Ｔ１側の端部との間を隙間なく埋め、貯留空間Ｖ１からのスラリーＭの漏出を防止する。 The end portion of the porous substrate 1 on the side of the first end surface T1 that has entered the jig 44 is fixed inside the jig 44 by the first substrate fixing portion 45 . The first base material fixing part 45 has, for example, a chuck mechanism such as a balloon type chuck. The control unit 3 controls the operation of the first base material fixing unit 45, and determines the timing and fixing of the end of the porous base material 1 that has entered the jig 44 on the side of the first end surface T1 in the jig 44. Controls the timing of releasing the Specifically, the control unit 3 controls the operation of the first base material fixing unit 45, and when the end of the porous base material 1 on the first end surface T1 side enters the jig 44, After the end portion of the porous substrate 1 on the first end surface T1 side enters the jig 44 without expanding the balloon held by the balloon chuck, the balloon held by the balloon chuck is expanded by air pressure, and the jig is moved. The end portion of the porous substrate 1 on the first end surface T1 side that has entered the inside 44 is fixed inside the jig 44 . At this time, the balloon held by the balloon-type chuck fills the space between the jig 44 and the end of the porous base material 1 on the first end surface T1 side that has entered the jig 44 without any gap, and the balloon is discharged from the storage space V1. Prevent the slurry M from leaking.
　本実施形態では、ノズル移動機構４３がノズル４２２を移動させることにより、多孔質基材１とノズル４２２との相対的な位置を変化させているが、基材保持部４１が多孔質基材１を移動させることにより、多孔質基材１とノズル４２２との相対的な位置を変化させてもよい。 In the present embodiment, the nozzle moving mechanism 43 moves the nozzle 422 to change the relative position between the porous substrate 1 and the nozzle 422 . By moving , the relative position between the porous substrate 1 and the nozzle 422 may be changed.
　吸引管移動工程では、吸引管移動機構４７が吸引管４６１を図７に示す待機位置から図８に示すスラリー吸引位置に移動させる。 In the suction tube moving process, the suction tube moving mechanism 47 moves the suction tube 461 from the standby position shown in FIG. 7 to the slurry suction position shown in FIG.
　制御部３は、吸引管移動機構４７の動作を制御し、吸引管４６１を待機位置からスラリー吸引位置に移動させるタイミング、吸引管４６１をスラリー吸引位置から待機位置に移動させるタイミング等を制御する。 The control unit 3 controls the operation of the suction tube moving mechanism 47, and controls the timing of moving the suction tube 461 from the standby position to the slurry suction position, the timing of moving the suction tube 461 from the slurry suction position to the standby position, and the like.
　吸引管４６１がスラリー吸引位置に移動すると、多孔質基材１の第２端面Ｔ２側の端部は、吸引管４６１内に進入し、吸引管４６１内には、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭの吸引を可能とする吸引空間Ｖ２が形成される。 When the suction tube 461 moves to the slurry suction position, the end of the porous substrate 1 on the second end face T2 side enters the suction tube 461, and the first A suction space V2 is formed to enable suction of the slurry M supplied to the end surface T1 side.
　吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部は、第２基材固定部４８によって吸引管４６１内に固定される。第２基材固定部４８は、例えば、風船式チャック等のチャック機構を有する。制御部３は、第２基材固定部４８の動作を制御し、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部を吸引管４６１内に固定するタイミング、固定を解除するタイミング等を制御する。具体的には、制御部３は、第２基材固定部４８の動作を制御して、多孔質基材１の第２端面Ｔ２側の端部が吸引管４６１内に進入する際には、風船式チャックが有する風船を膨張させず、多孔質基材１の第２端面Ｔ２側の端部が吸引管４６１内に進入した後には、風船式チャックが有する風船を空気圧により膨張させ、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部を吸引管４６１内に固定する。この際、風船式チャックが有する風船は、吸引管４６１と、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部との間を隙間なく埋め、吸引空間Ｖ２を密閉する。このため、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、吸引管４６１内の整流部材４０に流れ込まない。例えば、第１実施形態では、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の整流板４９ａに形成された貫通孔（例えば、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇ）に流れ込まない。また、第２実施形態では、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の第１整流板４９ｂ及び第２整流板５０に形成された貫通孔（例えば、第１整流板４９ｂの第１部分４９１に形成された第１貫通孔Ｇ、第１整流板４９ｂの第２部分４９２に形成された第２貫通孔Ｊ、第２整流板５０に形成された貫通孔等）に流れ込まない。 The end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461 is fixed inside the suction pipe 461 by the second substrate fixing portion 48 . The second base material fixing portion 48 has, for example, a chuck mechanism such as a balloon type chuck. The control unit 3 controls the operation of the second base material fixing unit 48, and determines the timing and fixing of the second end surface T2 side end of the porous base material 1 that has entered the suction tube 461, in the suction tube 461. Controls the timing of releasing the Specifically, the control unit 3 controls the operation of the second base material fixing unit 48, and when the end of the porous base material 1 on the second end surface T2 side enters the suction tube 461, After the end portion of the porous substrate 1 on the second end surface T2 side enters the suction tube 461 without expanding the balloon of the balloon chuck, the balloon of the balloon chuck is expanded by the air pressure to open the suction tube. The end portion of the porous substrate 1 on the second end surface T2 side that has entered the inside of the suction tube 461 is fixed inside the suction tube 461 . At this time, the balloon held by the balloon-type chuck fills the gap between the suction tube 461 and the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461, and seals the suction space V2. do. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, it does not flow into the straightening member 40 inside the suction tube 461. For example, in the first embodiment, the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 through through holes formed in the rectifying plate 49a in the suction tube 461 (for example, through the through holes of the rectifying plate 49a). It does not flow into the first through hole G) formed in the one portion 491 . In addition, in the second embodiment, the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 and through the through holes formed in the first straightening plate 49 b and the second straightening plate 50 inside the suction tube 461 . (For example, a first through hole G formed in the first portion 491 of the first straightening plate 49b, a second through hole J formed in the second portion 492 of the first straightening plate 49b, and a second through hole J formed in the second straightening plate 50 through-holes, etc.).
　本実施形態では、吸引管移動機構４７が吸引管４６１を移動させることにより、多孔質基材１と吸引管４６１との相対的な位置を変化させているが、基材保持部４１により多孔質基材１を移動させることにより、多孔質基材１と吸引管４６１との相対的な位置を変化させてもよい。 In the present embodiment, the suction tube moving mechanism 47 moves the suction tube 461 to change the relative position between the porous substrate 1 and the suction tube 461 . By moving the substrate 1, the relative positions of the porous substrate 1 and the suction tube 461 may be changed.
　ノズル移動工程及び吸引管移動工程の後、工程（ａ）が行われる。 Step (a) is performed after the nozzle moving step and the suction tube moving step.
　工程（ａ）では、スラリー供給部４２が、多孔質基材１の第１端面Ｔ１にスラリーＭを供給する。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭは、貯留空間Ｖ１に貯留される。 In step (a), the slurry supply unit 42 supplies the slurry M to the first end surface T1 of the porous substrate 1 . The slurry M supplied to the first end face T1 side of the porous substrate 1 is stored in the storage space V1.
　制御部３は、スラリー供給部４２の動作を制御し、スラリーＭの供給を開始するタイミング、スラリーＭの供給量、スラリーＭの供給を停止するタイミング等を制御する。 The control unit 3 controls the operation of the slurry supply unit 42, and controls the timing of starting supply of the slurry M, the amount of supply of the slurry M, the timing of stopping the supply of the slurry M, and the like.
　工程（ａ）の後、工程（ｂ）が行われる。 After step (a), step (b) is performed.
　工程（ｂ）では、スラリー吸引部４６が、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭを多孔質基材１の第２端面Ｔ２側から吸引し、多孔質基材１の第１セルの内壁にスラリー層Ｎを形成する。具体的には、吸引機構４６２が吸引管４６１内の吸引空間Ｖ２を減圧する。これにより、多孔質基材１の第１端面Ｔ１から多孔質基材１の第２端面Ｔ２に向けて空気の流れが生じ、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭは、多孔質基材１の第２端面Ｔ２に向けて吸引され、第１セル内へ導入され、第１セルの内壁を伝って第１端面Ｔ１から第２端面Ｔ２へ流れる。その結果、図１０に示すように、第１セルの内壁には、多孔質基材１の第１端面Ｔ１から多孔質基材１の第２端面Ｔ２に向けて延在するスラリー層Ｎが形成される。 In step (b), the slurry suction part 46 sucks the slurry M supplied to the first end surface T1 side of the porous substrate 1 from the second end surface T2 side of the porous substrate 1, and the porous substrate 1 forming a slurry layer N on the inner walls of the first cells of the . Specifically, the suction mechanism 462 decompresses the suction space V2 inside the suction pipe 461 . As a result, an air flow is generated from the first end surface T1 of the porous substrate 1 toward the second end surface T2 of the porous substrate 1, and the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked toward the second end surface T2 of the porous substrate 1, introduced into the first cell, and flows along the inner wall of the first cell from the first end surface T1 to the second end surface T2. As a result, as shown in FIG. 10, a slurry layer N extending from the first end surface T1 of the porous substrate 1 toward the second end surface T2 of the porous substrate 1 is formed on the inner wall of the first cell. be done.
　図１０に示すように、スラリー層Ｎは、隔壁部１２のセル１３ａ側の表面上に形成されている。スラリー層Ｎは、隔壁部１２の表面からセル１３ａ側に***している部分を有する。スラリー層Ｎは、隔壁部１２の表面からセル１３ａ側に***している部分のみで構成されていてもよいし、当該部分とともに、隔壁部１２の内部に存在する部分を有していてもよい。隔壁部１２は多孔質であるため、スラリー層Ｎは、通常、隔壁部１２の内部に存在する部分を有する。スラリー層Ｎは、隔壁部１２の内部に存在する部分のみで構成されていてもよい。 As shown in FIG. 10, the slurry layer N is formed on the surface of the partition wall 12 on the cell 13a side. The slurry layer N has a portion protruding from the surface of the partition wall 12 toward the cell 13a. The slurry layer N may be composed only of a portion protruding from the surface of the partition wall 12 toward the cell 13a, or may have a portion present inside the partition wall 12 together with the portion. . Since the partition wall 12 is porous, the slurry layer N usually has a portion existing inside the partition wall 12 . The slurry layer N may be composed only of the portion existing inside the partition wall portion 12 .
　図１０に示すように、スラリー層Ｎは、多孔質基材１の第２端面Ｔ２には達していない。すなわち、スラリー層Ｎの長さＰＮは、多孔質基材１の長さＰ１よりも小さい。スラリー層Ｎの長さＰＮは、多孔質基材１の長さＰ１の、好ましくは１０％以上９０％以下、より好ましくは２０％以上８０％以下である。スラリー層Ｎの長さＰＮが上記範囲内であると、スラリーが多孔質基材１に均一にコートされやすい。 As shown in FIG. 10, the slurry layer N does not reach the second end surface T2 of the porous substrate 1. That is, the length PN of the slurry layer N is smaller than the length P1 of the porous substrate 1 . The length PN of the slurry layer N is preferably 10% or more and 90% or less, more preferably 20% or more and 80% or less of the length P1 of the porous substrate 1 . When the length PN of the slurry layer N is within the above range, the porous substrate 1 is easily uniformly coated with the slurry.
　制御部３は、スラリー層Ｎが多孔質基材１の第２端面Ｔ２に達しないように、スラリー吸引部４６の動作を制御し、吸引管４６１内の吸引空間Ｖ２の減圧を開始するタイミング、減圧の程度、減圧を停止するタイミング等を調整する。 The control unit 3 controls the operation of the slurry suction unit 46 so that the slurry layer N does not reach the second end surface T2 of the porous substrate 1, and the timing of starting the pressure reduction of the suction space V2 in the suction pipe 461, Adjust the degree of decompression, the timing to stop decompression, etc.
　スラリー層Ｎが、必要に応じて乾燥された後、焼成されることにより、多孔質基材１の第２端面Ｔ２に至らないように、多孔質基材１の第１端面Ｔ１から多孔質基材１の第２端面Ｔ２に向けて延在する触媒層が、隔壁部１２のセル１３ａ側の表面上に形成される。触媒層は、隔壁部１２の表面からセル１３ａ側に***している部分を有する。触媒層は、隔壁部１２の表面からセル１３ａ側に***している部分のみで構成されていてもよいし、当該部分とともに、隔壁部１２の内部に存在する部分を有していてもよい。隔壁部１２は多孔質であるため、触媒層は、通常、隔壁部１２の内部に存在する部分を有する。触媒層は、隔壁部１２の内部に存在する部分のみで構成されていてもよい。 After the slurry layer N is dried as necessary, the porous substrate is removed from the first end surface T1 of the porous substrate 1 so as not to reach the second end surface T2 of the porous substrate 1 by firing. A catalyst layer extending toward the second end face T2 of the material 1 is formed on the surface of the partition wall portion 12 on the cell 13a side. The catalyst layer has a portion protruding from the surface of the partition wall portion 12 toward the cell 13a. The catalyst layer may consist only of a portion protruding from the surface of the partition wall 12 toward the cell 13a, or may have a portion existing inside the partition wall 12 together with the portion. Since the partition wall 12 is porous, the catalyst layer usually has a portion existing inside the partition wall 12 . The catalyst layer may be composed only of the portion existing inside the partition wall portion 12 .
　吸引管４６１がスラリー吸引位置に移動すると、整流部材４０は、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。すなわち、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０は、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。 When the suction pipe 461 moves to the slurry suction position, the straightening member 40 is positioned on the second end face T2 side of the porous base material 1 and spaced from the second end face T2 of the porous base material 1 . That is, when the slurry M supplied to the first end face T1 side of the porous base material 1 is sucked from the second end face T2 side of the porous base material 1, the rectifying member 40 moves toward the second end face T2 of the porous base material 1. It is located on the side of the end face T2 and is spaced apart from the second end face T2 of the porous substrate 1 .
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆し、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. At least part of the central region T22 of the porous substrate 1 is covered, and at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1 is exposed.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０が、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の筒状部１１の外周面から空気が流入し、多孔質基材１の径方向の外側部分における吸引力は低下する。しかしながら、整流部材４０が多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆するため、多孔質基材１の径方向の内側部分では空気が流れにくくなっている一方、整流部材４０が多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させるため、多孔質基材１の径方向の外側部分では空気が流れやすくなっている。したがって、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差が小さくなり、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying member 40 moves toward the second end surface T2 of the porous substrate 1. By arranging on the side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, air is drawn from the outer peripheral surface of the cylindrical portion 11 of the porous substrate 1. flows in and the suction force at the radially outer portion of the porous substrate 1 decreases. However, since the rectifying member 40 covers at least a part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the rectifying member 40 exposes at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1. FIG. Therefore, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
　以下、整流部材４０として、第１実施形態に係る整流部材４０ａが使用される場合について説明する。 A case where the rectifying member 40a according to the first embodiment is used as the rectifying member 40 will be described below.
　吸引管４６１がスラリー吸引位置に移動すると、整流板４９ａは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。したがって、工程（ｂ）において、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。 When the suction pipe 461 moves to the slurry suction position, the rectifying plate 49a is positioned on the second end face T2 side of the porous base material 1 and spaced apart from the second end face T2 of the porous base material 1 . Therefore, in the step (b), when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying plate 49a becomes porous. It is located on the side of the second end surface T2 of the base material 1 and spaced from the second end surface T2 of the porous base material 1 .
　吸引管４６１がスラリー吸引位置に移動すると、整流板４９ａと多孔質基材１の第２端面Ｔ２との距離は、距離Ｄ２ａとなる。 When the suction pipe 461 moves to the slurry suction position, the distance between the current plate 49a and the second end face T2 of the porous substrate 1 becomes the distance D2a.
　工程（ｂ）において、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａは、多孔質基材１の第２端面Ｔ２のうち、中央領域Ｔ２２の少なくとも一部を被覆し、外縁領域Ｔ２１の少なくとも一部を露出させる。具体的には、整流板４９ａの第２部分４９２は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆し、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇは、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる。 In step (b), when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a At least part of the central region T22 of the one second end face T2 is covered, and at least part of the outer edge region T21 is exposed. Specifically, the second portion 492 of the straightening plate 49a covers at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the first portion 491 formed on the first portion 491 of the straightening plate 49a covers at least a portion of the central region T22. 1 through-hole G exposes at least part of outer edge region T21 of second end surface T2 of porous substrate 1 .
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０ａが、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の筒状部１１の外周面から空気が流入し、多孔質基材１の径方向の外側部分における吸引力は低下する。しかしながら、整流板４９ａの第２部分４９２が多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆するため、多孔質基材１の径方向の内側部分では空気が流れにくくなっている一方、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させるため、多孔質基材１の径方向の外側部分では空気が流れやすくなっている。したがって、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差が小さくなり、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the straightening member 40a By arranging on the side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, air is drawn from the outer peripheral surface of the cylindrical portion 11 of the porous substrate 1. flows in and the suction force at the radially outer portion of the porous substrate 1 decreases. However, since the second portion 492 of the rectifying plate 49a covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1, it is difficult for air to flow through the radially inner portion of the porous substrate 1. On the other hand, since the first through holes G formed in the first portion 491 of the current plate 49a expose at least part of the outer edge region T21 of the second end surface T2 of the porous substrate 1, the porous substrate The radially outer portion of 1 facilitates air flow. Therefore, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
　以下、整流部材４０として、第２実施形態に係る整流部材４０ｂが使用される場合について説明する。 A case where the rectifying member 40b according to the second embodiment is used as the rectifying member 40 will be described below.
　吸引管４６１がスラリー吸引位置に移動すると、第１整流板４９ｂは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。すなわち、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、第１整流板４９ｂは、多孔質基材１の第２端面Ｔ２側に、多孔質基材１の第２端面Ｔ２から離間して位置する。 When the suction pipe 461 moves to the slurry suction position, the first rectifying plate 49b is positioned on the second end face T2 side of the porous base material 1 and spaced apart from the second end face T2 of the porous base material 1 . That is, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first straightening plate 49b It is located on the side of the second end face T2 and separated from the second end face T2 of the porous substrate 1 .
　吸引管４６１がスラリー吸引位置に移動すると、第１整流板４９ｂと多孔質基材１の第２端面Ｔ２との距離は、距離Ｄ２ｂとなる。 When the suction pipe 461 moves to the slurry suction position, the distance between the first straightening plate 49b and the second end face T2 of the porous substrate 1 becomes the distance D2b.
　第２整流板５０は、第１整流板４９ｂに対して多孔質基材１の第２端面Ｔ２とは反対側に配置されている。この位置関係は、吸引管４６１がスラリー吸引位置にある状態でも、吸引管４６１が待機位置にある状態でも、変わらない。したがって、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、第２整流板５０は、第１整流板４９ｂに対して多孔質基材１の第２端面Ｔ２とは反対側に位置する。 The second straightening plate 50 is arranged on the side opposite to the second end surface T2 of the porous substrate 1 with respect to the first straightening plate 49b. This positional relationship does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second rectifying plate 50 moves toward the first rectifying plate 49b. On the other hand, it is located on the side opposite to the second end surface T2 of the porous substrate 1 .
　第１整流板４９ｂと第２整流板５０との距離は、距離Ｄ３である。距離Ｄ３は、吸引管４６１がスラリー吸引位置にある状態でも、吸引管４６１が待機位置にある状態でも、変わらない。したがって、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、第１整流板４９ｂと第２整流板５０との距離は、距離Ｄ３である。 The distance between the first rectifying plate 49b and the second rectifying plate 50 is the distance D3. The distance D3 does not change whether the suction tube 461 is at the slurry suction position or at the standby position. Therefore, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the first rectifying plate 49b and the second rectifying plate 50 The distance is distance D3.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０ｂが、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の筒状部１１の外周面から空気が流入し、多孔質基材１の径方向の外側部分における吸引力は低下する。しかしながら、第１整流板４９ｂに形成された第２貫通孔Ｊが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を露出させ、第２整流板５０が、第１整流板４９ｂに形成された第２貫通孔Ｊの少なくとも一部を被覆するため、多孔質基材１の径方向の内側部分では空気が流れにくくなっている一方、第１整流板４９ｂに形成された第１貫通孔Ｇが多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させるため、多孔質基材１の径方向の外側部分では空気が流れやすくなっている。したがって、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差が小さくなり、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the rectifying member 40b moves toward the second end surface T2 of the porous substrate 1. By arranging on the side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, air is drawn from the outer peripheral surface of the cylindrical portion 11 of the porous substrate 1. flows in and the suction force at the radially outer portion of the porous substrate 1 decreases. However, the second through hole J formed in the first straightening plate 49b exposes at least a portion of the central region T22 of the second end surface T2 of the porous substrate 1, and the second straightening plate 50 serves as the first straightening plate. Since at least a part of the second through hole J formed in the plate 49b is covered, it is difficult for air to flow in the radially inner portion of the porous substrate 1. Since the first through holes G expose at least a portion of the outer edge region T21 of the second end surface T2 of the porous substrate 1, air can easily flow through the radially outer portion of the porous substrate 1. FIG. Therefore, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 becomes small, The difference between the length of the slurry layer N formed on the inner portion and the length of the slurry layer N formed on the radially outer portion of the porous substrate 1 is reduced.
　また、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流部材４０ｂが、多孔質基材１の第２端面Ｔ２側に配置されることにより、次の効果が奏される。多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａが、多孔質基材１の第２端面Ｔ２側に配置される場合、整流板４９ａの第２部分４９２と多孔質基材１の第２端面Ｔ２との間で、乱流が発生し、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）が発生するおそれがある。以下、乱流を発生させる、整流板４９ａと多孔質基材１の第２端面Ｔ２との距離をＤｘとする。これに対して、整流部材４９ｂでは、第２貫通孔Ｊが第１整流板４９ｂの第２部分４９２に形成されているため、第１整流板４９ｂと多孔質基材１の第２端面Ｔ２との距離がＤｘであっても、第１整流板４９ｂの第２部分４９２と多孔質基材１の第２端面Ｔ２との間において乱流が発生しにくい。また、整流部材４９ｂでは、第２整流板５０が第１整流板４９ｂに対して多孔質基材１の第２端面Ｔ２とは反対側に配置されているため、第１整流板４９ｂと多孔質基材１の第２端面Ｔ２との距離がＤｘであっても、第２整流板５０と多孔質基材１の第２端面Ｔ２との距離はＤｘよりも大きくなっており、第２整流板５０と多孔質基材１の第２端面Ｔ２との間において乱流が発生しにくい。したがって、第１整流板４９ｂ及び第２整流板５０が使用される場合には、整流板４９ａが使用される場合よりも、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）の発生を防止することができる。 Further, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the straightening member 40b By arranging on the end surface T2 side, the following effects are exhibited. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a side, a turbulent flow occurs between the second portion 492 of the rectifying plate 49a and the second end surface T2 of the porous substrate 1, causing variations in the length of the slurry layers N (particularly, Variation in length between slurry layers N formed on the inner portion of the porous substrate 1 in the radial direction may occur. Hereinafter, the distance between the rectifying plate 49a and the second end surface T2 of the porous substrate 1, which generates turbulent flow, is defined as Dx. On the other hand, in the straightening member 49b, since the second through hole J is formed in the second portion 492 of the first straightening plate 49b, the first straightening plate 49b and the second end surface T2 of the porous base material 1 is Dx, turbulent flow is less likely to occur between the second portion 492 of the first rectifying plate 49b and the second end face T2 of the porous substrate 1 . Further, in the rectifying member 49b, the second rectifying plate 50 is arranged on the opposite side of the first rectifying plate 49b from the second end surface T2 of the porous substrate 1, so that the first rectifying plate 49b and the porous Even if the distance from the second end surface T2 of the substrate 1 is Dx, the distance between the second straightening plate 50 and the second end surface T2 of the porous substrate 1 is greater than Dx, and the second straightening plate A turbulent flow is less likely to occur between 50 and the second end surface T2 of the porous substrate 1 . Therefore, when the first rectifying plate 49b and the second rectifying plate 50 are used, the variation in length between the slurry layers N (in particular, the porous substrate 1 It is possible to prevent the occurrence of variations in length between the slurry layers N formed in the radially inner portion of the .
　いずれの実施形態においても、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の径方向の内側部分のうち、第１端面Ｔ１側の部分における空気の流速は、好ましくは、１ｍ／ｓ以上１０ｍ／ｓ以下、より好ましくは、２ｍ／ｓ以上５ｍ／ｓ以下である。 In any embodiment, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the radial direction of the porous substrate 1 The flow velocity of the air in the portion on the first end face T1 side of the inner portion is preferably 1 m/s or more and 10 m/s or less, more preferably 2 m/s or more and 5 m/s or less.
　いずれの実施形態においても、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の径方向の外側部分のうち、第１端面Ｔ１側の部分における空気の流速は、好ましくは、１ｍ／ｓ以上３０ｍ／ｓ以下、より好ましくは、５ｍ／ｓ以上１５ｍ／ｓ以下である。 In any embodiment, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the radial direction of the porous substrate 1 The flow velocity of the air in the portion on the first end surface T1 side of the outer portion of is preferably 1 m/s or more and 30 m/s or less, more preferably 5 m/s or more and 15 m/s or less.
　工程（ｂ）の後、スラリー層Ｎが形成された多孔質基材１を、必要に応じて乾燥した後、焼成してもよい。これにより、スラリー層Ｎは、触媒層となる。乾燥温度は、例えば、７０℃以上１５０℃以下であり、乾燥時間は、例えば、０．２時間以上３時間以下であり、焼成温度は、例えば、４００℃以上９００℃以下であり、焼成時間は、例えば、１時間以上１０時間以下である。焼成は、大気雰囲気下で行うことができる。 After the step (b), the porous substrate 1 on which the slurry layer N is formed may be dried and then fired as necessary. Thereby, the slurry layer N becomes a catalyst layer. The drying temperature is, for example, 70° C. or more and 150° C. or less, the drying time is, for example, 0.2 hours or more and 3 hours or less, the firing temperature is, for example, 400° C. or more and 900° C. or less, and the firing time is , for example, from 1 hour to 10 hours. Firing can be performed in an air atmosphere.
　ノズル移動工程の後、吸引管移動工程が行われることなく、工程（ａ）が行われてもよい。この場合、工程（ａ）の間又は工程（ａ）の後に吸引管移動工程が行われ、工程（ａ）及び吸引管移動工程の後に工程（ｂ）が行われる。 After the nozzle moving process, the process (a) may be performed without performing the suction tube moving process. In this case, the suction tube moving step is performed during or after the step (a), and the step (b) is performed after the step (a) and the suction tube moving step.
　以下、本発明の構造体製造装置及び構造体製造方法の好ましい実施形態について説明する。２以上の好ましい実施形態を組み合わせることができる場合、このような組み合わせも本発明に包含される。 Preferred embodiments of the structure manufacturing apparatus and structure manufacturing method of the present invention will be described below. Where two or more preferred embodiments can be combined, such combinations are also included in the invention.
　整流板４９ａの第２部分４９２に第２貫通孔が形成されていない場合、整流部材４０ａの上記効果をより向上させる観点から、整流板４９ａの第２部分４９２が被覆する中央領域Ｔ２２の少なくとも一部の面積は、中央領域Ｔ２２の面積の５０％以上であることが好ましく、６０％以上であることがより好ましく、７０％以上であることがより一層好ましく、８０％以上であることがより一層好ましく、９０％以上であることがより一層好ましく、９５％以上であることがより一層好ましい。上限は１００％である。 When the second portion 492 of the rectifying plate 49a does not have the second through hole, at least one of the central regions T22 covered by the second portion 492 of the rectifying plate 49a is provided from the viewpoint of further improving the above effect of the rectifying member 40a. The area of the part is preferably 50% or more of the area of the central region T22, more preferably 60% or more, even more preferably 70% or more, and even more preferably 80% or more. It is preferably 90% or more, even more preferably 95% or more. The upper limit is 100%.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａの第２部分４９２と多孔質基材１の第２端面Ｔ２との間で、乱流が発生することを防止し、ひいては、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）が発生することを防止する観点から、整流板４９ａの第２部分４９２に第２貫通孔が形成されていることが好ましい。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second portion 492 of the current plate 49a and the porous substrate 1 It prevents turbulent flow from occurring between the second end surface T2, and thus the length variation between the slurry layers N (especially, the slurry formed in the radially inner part of the porous substrate 1 From the viewpoint of preventing occurrence of variation in length between layers N, it is preferable that a second through hole is formed in the second portion 492 of the straightening plate 49a.
　整流板４９ａの第２部分４９２に第２貫通孔が形成されている一実施形態を図１６に示す。図１６に示す実施形態では、整流板４９ａの第２部分４９２に多数の丸孔状の第２貫通孔Ｑが形成されている。第２貫通孔Ｑの平面視形状は適宜変更可能であり、第２貫通孔Ｑの平面視形状としては、例えば、円形状、楕円形状、正方形状、長方形状、長方形の角が丸くなった形状等が挙げられる。第２貫通孔Ｑの数は適宜変更可能であり、第２貫通孔Ｑの数は１であってもよいし、２以上であってもよい。整流板４９ａの第２部分４９２に形成された第２貫通孔Ｑは、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇと連続していてもよい。第２貫通孔Ｑの径は、例えば１ｍｍ以上５ｍｍ以下である。第２貫通孔Ｑの径は、第２貫通孔Ｑが円形である場合には、当該円形の直径を意味し、第２貫通孔Ｑが円形以外の形状である場合には、当該形状に外接する円形の直径を意味する。 FIG. 16 shows an embodiment in which a second through hole is formed in the second portion 492 of the rectifying plate 49a. In the embodiment shown in FIG. 16, a large number of round second through holes Q are formed in the second portion 492 of the current plate 49a. The planar view shape of the second through hole Q can be changed as appropriate, and the planar view shape of the second through hole Q includes, for example, a circular shape, an elliptical shape, a square shape, a rectangular shape, and a rectangular shape with rounded corners. etc. The number of second through holes Q can be changed as appropriate, and the number of second through holes Q may be one, or two or more. The second through hole Q formed in the second portion 492 of the current plate 49a may be continuous with the first through hole G formed in the first portion 491 of the current plate 49a. The diameter of the second through hole Q is, for example, 1 mm or more and 5 mm or less. When the second through-hole Q is circular, the diameter of the second through-hole Q means the diameter of the circle. means the diameter of the circle that
　整流板４９ａの第２部分４９２に第２貫通孔Ｑが形成されている場合、第２貫通孔Ｑは、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を露出させる。「第２貫通孔Ｑが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部を露出させる」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第２端面Ｔ２及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第２端面Ｔ２を投影したとき）、図１６に示すように、第２貫通孔Ｑが、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の一部と重なることを意味する。なお、図１６において、整流板４９ａの平面図に投影された第２端面Ｔ２の外形線及び中央領域Ｔ２２の外形線（すなわち、境界線Ｌ２）はそれぞれ点線及び二点鎖線で示されている。 When the second through hole Q is formed in the second portion 492 of the current plate 49a, the second through hole Q exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1. “The second through-hole Q exposes a part of the central region T22 of the second end surface T2 of the porous substrate 1” means that the suction tube 461 is at the slurry suction position shown in FIG. When the second end face T2 of the material 1 and the straightening plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, when the second end face T2 of the porous substrate 1 is projected on the plan view of the straightening plate 49a ), as shown in FIG. In FIG. 16, the outline of the second end surface T2 and the outline of the central region T22 (that is, the boundary line L2) projected onto the plan view of the current plate 49a are indicated by dotted lines and chain double-dashed lines, respectively.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、乱流の発生を効果的に防止し、ひいては、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）の発生を効果的に防止する観点から、第２貫通孔Ｑが露出させる中央領域Ｔ２２の一部の面積は、中央領域Ｔ２２の面積の１０％以上５０％以下であることが好ましく、２０％以上４０％以下であることがより好ましい。なお、「第２貫通孔Ｑが露出させる中央領域Ｔ２２の一部の面積」は、整流板４９ａの第２部分４９２に２以上の第２貫通孔Ｑが形成されている場合には、当該２以上の第２貫通孔Ｑが露出させる中央領域Ｔ２２の部分の合計面積を意味する。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the generation of turbulence is effectively prevented, and thus the slurry layer is formed. From the viewpoint of effectively preventing the occurrence of variation in length between N (in particular, variation in length between slurry layers N formed in the radially inner portion of the porous substrate 1), the second The area of the part of the central region T22 exposed by the through hole Q is preferably 10% or more and 50% or less, more preferably 20% or more and 40% or less, of the area of the central region T22. In addition, when two or more second through holes Q are formed in the second portion 492 of the rectifying plate 49a, the "area of the part of the central region T22 exposed by the second through holes Q" is the two It means the total area of the portion of the central region T22 exposed by the second through holes Q described above.
　整流部材４０ａ又は４０ｂの上記効果をより向上させる観点から、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の少なくとも一部の面積は、外縁領域Ｔ２１の面積の５０％以上であることが好ましく、６０％以上であることがより好ましく、７０％以上であることがより一層好ましく、８０％以上であることがより一層好ましく、９０％以上であることがより一層好ましく、９５％以上であることがより一層好ましい。上限は１００％である。「整流板４９ａ又は４９ｂの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の少なくとも一部の面積」は、整流板４９ａ又は４９ｂの第１部分４９１に２以上の第１貫通孔Ｇが形成されている場合には、当該２以上の第１貫通孔Ｇが露出させる外縁領域Ｔ２１の部分の合計面積を意味する。 From the viewpoint of further improving the above effect of the rectifying member 40a or 40b, the area of at least a part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the rectifying plate 49a is reduced to the area of the outer edge region T21. It is preferably 50% or more of the area, more preferably 60% or more, still more preferably 70% or more, still more preferably 80% or more, and 90% or more. More preferably, it is 95% or more. The upper limit is 100%. "The area of at least a part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the straightening plate 49a or 49b" is two or more first portions 491 of the straightening plate 49a or 49b. When one through-hole G is formed, it means the total area of the portion of the outer edge region T21 exposed by the two or more first through-holes G.
　整流板４９ａ又は４９ｂの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の少なくとも一部の面積が、外縁領域Ｔ２１の面積の１００％である場合、第２部分４９２と第３部分４９３とは分断されることになるが、支障はない。第２部分４９２と第３部分４９３とが分断されている場合、第２部分４９２は、例えば、支持機構（例えば、第２部分４９２と吸引機構４６２との間に設けられた、第２部分４９２の吸引機構４６２側の面を支持する支持ロッド）により、吸引管４６１内に固定することができ、第３部分４９３は、例えば、保持機構（例えば、吸引管４６１の内壁に設けられた、第３部分４９３の外縁部を把持するチャック機構（例えば、ハンドチャック等））又は支持機構（例えば、第３部分４９３と吸引機構４６２との間に設けられた、第３部分４９３の吸引機構４６２側の面を支持する支持ロッド）により、吸引管４６１内に固定することができる。整流板４９ａ又は４９ｂの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の少なくとも一部の面積が、外縁領域Ｔ２１の面積の１００％である場合、整流板４９ａ又は４９ｂは、第２部分４９２のみで構成されていてもよい。 When the area of at least part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the current plate 49a or 49b is 100% of the area of the outer edge region T21, the second portion 492 and Although it is separated from the third portion 493, there is no problem. When the second portion 492 and the third portion 493 are separated, the second portion 492 may be, for example, a supporting mechanism (for example, the second portion 492 provided between the second portion 492 and the suction mechanism 462). The third part 493 can be fixed in the suction tube 461 by a support rod that supports the surface on the suction mechanism 462 side of the suction tube 461, and the third part 493 is, for example, a holding mechanism (for example, a third A chuck mechanism (e.g., hand chuck, etc.) that grips the outer edge of the third portion 493) or a support mechanism (e.g., the suction mechanism 462 side of the third portion 493 provided between the third portion 493 and the suction mechanism 462 It can be fixed within the aspiration tube 461 by means of a support rod supporting the surface of the . When the area of at least a part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the current plate 49a or 49b is 100% of the area of the outer edge region T21, the current plate 49a or 49b may consist of only the second portion 492 .
　整流板４９ａの第２部分４９２に第２貫通孔Ｑが形成されている場合、整流部材４０ａの上記効果をより向上させる観点から、第２貫通孔Ｑが露出させる中央領域Ｔ２２の一部の面積比率（第２貫通孔Ｑが露出させる中央領域Ｔ２２の一部の面積／中央領域Ｔ２２の面積）は、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の少なくとも一部の面積比率（整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の少なくとも一部の面積／外縁領域Ｔ２１の面積）よりも小さいことが好ましい。 When the second through-holes Q are formed in the second portion 492 of the rectifying plate 49a, the area of the part of the central region T22 exposed by the second through-holes Q is reduced from the viewpoint of further improving the above effect of the rectifying member 40a. The ratio (the area of the part of the central region T22 exposed by the second through hole Q/the area of the central region T22) is the outer edge region T21 exposed by the first through hole G formed in the first portion 491 of the current plate 49a. (area of at least part of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the current plate 49a/area of the outer edge region T21). .
　整流部材４０ａ又は４０ｂの上記効果をより向上させる観点から、吸引管４６１がスラリー吸引位置にあるときの、整流板４９ａ又は４９ｂと多孔質基材１の第２端面Ｔ２との距離Ｄ２ａ又はＤ２ｂは、５ｍｍ以上３０ｍｍ以下であることが好ましく、５ｍｍ以上１５ｍｍ以下であることがより好ましい。距離Ｄ２ａ又はＤ２ｂが一定でない場合、距離Ｄ２ａ又はＤ２ｂの最小値及び最大値の両方が上記範囲であることが好ましい。 From the viewpoint of further improving the effect of the rectifying member 40a or 40b, the distance D2a or D2b between the rectifying plate 49a or 49b and the second end surface T2 of the porous substrate 1 when the suction tube 461 is at the slurry suction position is , preferably 5 mm or more and 30 mm or less, more preferably 5 mm or more and 15 mm or less. When the distance D2a or D2b is not constant, both the minimum value and the maximum value of the distance D2a or D2b are preferably within the above range.
　整流部材４０ｂの上記効果をより向上させる観点から、第２貫通孔Ｊが露出させる中央領域Ｔ２２の少なくとも一部の面積は、中央領域Ｔ２２の面積の５０％以上であることが好ましく、６０％以上であることがより好ましい。上限は１００％である。第２貫通孔Ｊの形成のしやすさ、第１整流板４９ｂの強度等を考慮すると、第２貫通孔Ｊが露出させる中央領域Ｔ２２の少なくとも一部の面積は、中央領域Ｔ２２の面積の９０％以下であることが好ましく、８０％以下であることがより好ましい。これらの上限はそれぞれ、上記の下限のいずれと組み合わせてもよい。なお、「第２貫通孔Ｊが露出させる中央領域Ｔ２２の少なくとも一部の面積」は、第２部分４９２に２以上の第２貫通孔Ｊが形成されている場合には、当該２以上の第２貫通孔Ｊが露出させる中央領域Ｔ２２の部分の合計面積を意味する。 From the viewpoint of further improving the above effect of the rectifying member 40b, the area of at least a part of the central region T22 exposed by the second through holes J is preferably 50% or more, more preferably 60% or more of the area of the central region T22. is more preferable. The upper limit is 100%. Considering the ease of forming the second through holes J, the strength of the first current plate 49b, etc., the area of at least a part of the central region T22 exposed by the second through holes J is 90% of the area of the central region T22. % or less, more preferably 80% or less. Each of these upper limits may be combined with any of the above lower limits. In addition, when two or more second through holes J are formed in the second portion 492, the "area of at least a part of the central region T22 exposed by the second through holes J" is the two or more second through holes J. 2 means the total area of the portion of the central region T22 exposed by the through holes J.
　第２整流板５０に貫通孔が形成されていない場合、多孔質基材１の径方向の内側部分に加わる吸引力と、多孔質基材１の径方向の外側部分に加わる吸引力との差を効果的に小さくし、ひいては、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差を効果的に小さくする観点から、第２整流板５０が被覆する第２貫通孔Ｊの少なくとも一部の面積は、第２貫通孔Ｊの面積の５０％以上であることが好ましく、６０％以上であることがより好ましく、７０％以上であることがより一層好ましく、８０％以上であることがより一層好ましく、９０％以上であることがより一層好ましく、９５％以上であることがより一層好ましい。上限は１００％である。なお、「第２貫通孔Ｊの面積」は、第１整流板４９ｂの第２部分４９２に２以上の第２貫通孔Ｊが形成されている場合には、当該２以上の第２貫通孔Ｊの合計面積を意味する。また、「第２貫通孔Ｊの面積」は、第２貫通孔Ｊを多孔質基材１の軸方向Ｘから平面視したときの面積を意味する。 When no through-hole is formed in the second current plate 50, the difference between the suction force applied to the radially inner portion of the porous substrate 1 and the suction force applied to the radially outer portion of the porous substrate 1 is effectively reduced, and consequently, the length of the slurry layer N formed on the radially inner portion of the porous substrate 1 and the slurry layer N formed on the radially outer portion of the porous substrate 1 From the viewpoint of effectively reducing the difference in length, the area of at least a portion of the second through hole J covered by the second current plate 50 is preferably 50% or more of the area of the second through hole J. , more preferably 60% or more, even more preferably 70% or more, still more preferably 80% or more, even more preferably 90% or more, and 95% or more is even more preferred. The upper limit is 100%. In addition, when two or more second through holes J are formed in the second portion 492 of the first current plate 49b, the "area of the second through holes J" is means the total area of In addition, “the area of the second through hole J” means the area of the second through hole J when viewed from the axial direction X of the porous substrate 1 in plan view.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、乱流の発生を効果的に防止し、ひいては、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）の発生を効果的に防止する観点から、第２整流板５０が第２貫通孔Ｊの一部を被覆するように、第２整流板５０に貫通孔が形成されていることが好ましい。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the generation of turbulence is effectively prevented, and thus the slurry layer is formed. From the viewpoint of effectively preventing the occurrence of variation in length between N (in particular, variation in length between slurry layers N formed in the radially inner portion of the porous substrate 1), the second A through hole is preferably formed in the second straightening plate 50 so that the straightening plate 50 partially covers the second through hole J. As shown in FIG.
　第２整流板５０に貫通孔が形成されている一実施形態を図１７に示す。図１７に示す実施形態では、多数の丸孔状の貫通孔Ｋが第２整流板５０に形成されている。貫通孔Ｋの平面視形状は適宜変更可能であり、貫通孔Ｋの平面視形状としては、例えば、円形状、楕円形状、正方形状、長方形状、長方形の角が丸くなった形状等が挙げられる。貫通孔Ｋの数は適宜変更可能であり、貫通孔Ｋの数は１であってもよいし、２以上であってもよい。貫通孔Ｋの径は、例えば１ｍｍ以上５ｍｍ以下である。貫通孔Ｋの径は、貫通孔Ｋが円形である場合には、当該円形の直径を意味し、貫通孔Ｋが円形以外の形状である場合には、当該形状に外接する円形の直径を意味する。 FIG. 17 shows an embodiment in which through holes are formed in the second current plate 50 . In the embodiment shown in FIG. 17 , a large number of circular through holes K are formed in the second current plate 50 . The planar view shape of the through hole K can be changed as appropriate, and examples of the planar view shape of the through hole K include a circular shape, an elliptical shape, a square shape, a rectangular shape, a rectangular shape with rounded corners, and the like. . The number of through-holes K can be changed as appropriate, and the number of through-holes K may be one, or two or more. The diameter of the through hole K is, for example, 1 mm or more and 5 mm or less. The diameter of the through-hole K means the diameter of the circle when the through-hole K is circular, and the diameter of the circle circumscribing the shape when the through-hole K has a shape other than a circle. do.
　第２整流板５０に貫通孔Ｋが形成されている場合、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、乱流の発生を効果的に防止し、ひいては、スラリー層Ｎ間での長さのバラツキ（特に、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎ間での長さのバラツキ）の発生を効果的に防止する観点から、第２整流板５０が被覆する第２貫通孔Ｊの一部の面積は、第２貫通孔Ｊの面積の５０％以上９０％以下であることが好ましく、６０％以上９０％以下であることがより好ましい。 When the through holes K are formed in the second straightening plate 50, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, , the occurrence of turbulent flow is effectively prevented, and thus the variation in length between the slurry layers N (in particular, the length between the slurry layers N formed in the radially inner portion of the porous substrate 1 From the viewpoint of effectively preventing the occurrence of the variation in the second through hole J, the area of the part of the second through hole J covered by the second current plate 50 is 50% or more and 90% or less of the area of the second through hole J. , and more preferably 60% or more and 90% or less.
　整流部材４０ｂの上記効果をより向上させる観点から、吸引管４６１がスラリー吸引位置にあるときの、第１整流板４９ｂと第２整流板５０との距離Ｄ３は、５ｍｍ以上３０ｍｍ以下であることが好ましく、５ｍｍ以上１５ｍｍ以下であることがより好ましい。距離Ｄ３が一定でない場合、距離Ｄ３の最小値及び最大値の両方が上記範囲であることが好ましい。 From the viewpoint of further improving the effect of the rectifying member 40b, the distance D3 between the first rectifying plate 49b and the second rectifying plate 50 when the suction pipe 461 is at the slurry suction position is preferably 5 mm or more and 30 mm or less. It is preferably 5 mm or more and 15 mm or less. If the distance D3 is not constant, it is preferable that both the minimum value and the maximum value of the distance D3 are within the above ranges.
≪変更例≫
　本発明の構造体製造装置及び構造体製造方法において、整流部材４０ａ又は４０ｂの上記効果と同様の効果が奏される限り、種々の変更が可能である。 ≪Change example≫
In the structure manufacturing apparatus and structure manufacturing method of the present invention, various modifications are possible as long as the same effects as those of the rectifying member 40a or 40b are achieved.
　以下、本発明の構造体製造装置及び構造体製造方法の変更例について説明する。本発明の構造体製造装置及び構造体製造方法に関する上記説明は、別段規定される場合を除き、変形例にも適用される。なお、２以上の変更例を組み合わせることができる場合、このような組み合わせも本発明に包含される。 Modified examples of the structure manufacturing apparatus and the structure manufacturing method of the present invention will be described below. The above descriptions of the structure manufacturing apparatus and structure manufacturing method of the present invention also apply to modifications unless otherwise specified. In addition, when two or more modified examples can be combined, such a combination is also included in the present invention.
＜変更例１Ａ＞
　図１８を参照して、変更例１Ａについて説明する。図１８は、変更例に係る整流板４９ａ’の平面図である。なお、図１８において、整流板４９ａ’の平面図に投影された第２端面Ｔ２の外形線及び中央領域Ｔ２２の外形線（すなわち、境界線Ｌ２）はそれぞれ点線及び二点鎖線で示されている。 <Modification 1A>
Modification 1A will be described with reference to FIG. FIG. 18 is a plan view of a current plate 49a' according to a modification. In FIG. 18, the outline of the second end face T2 and the outline of the central region T22 (that is, the boundary line L2) projected onto the plan view of the current plate 49a' are indicated by dotted lines and chain double-dashed lines, respectively. .
　本発明の構造体製造装置及び構造体製造方法において、整流板４９ａに代えて、整流板４９ａ’を使用してもよい。図１８に示すように、整流板４９ａ’は、第１部分４９１に、貫通孔Ｇに代えて多数の丸孔状の貫通孔Ｈが形成されている点で、整流板４９ａと異なる。貫通孔Ｇに関する上記説明は、別段規定される場合を除き、貫通孔Ｈにも適用される。本実施形態において、貫通孔Ｈの平面視形状は円形状であるが、貫通孔Ｈの平面視形状は、その他の形状、例えば、楕円形状、正方形状、長方形状、長方形の角が丸くなった形状等であってもよい。貫通孔Ｈの径は、例えば１ｍｍ以上４ｍｍ以下である。貫通孔Ｈの径は、貫通孔Ｈが円形である場合には、当該円形の直径を意味し、貫通孔Ｈが円形以外の形状である場合には、当該形状に外接する円形の直径を意味する。 In the structure manufacturing apparatus and structure manufacturing method of the present invention, a straightening plate 49a' may be used instead of the straightening plate 49a. As shown in FIG. 18, the rectifying plate 49a' differs from the rectifying plate 49a in that a large number of circular through holes H are formed in the first portion 491 instead of the through holes G. As shown in FIG. The above description of through holes G also applies to through holes H, unless otherwise specified. In the present embodiment, the planar view shape of the through hole H is circular, but the planar view shape of the through hole H may be other shapes such as elliptical, square, rectangular, and rectangular with rounded corners. It may be a shape or the like. The diameter of the through hole H is, for example, 1 mm or more and 4 mm or less. The diameter of the through-hole H means the diameter of the circle when the through-hole H is circular, and the diameter of the circle circumscribing the shape when the through-hole H has a shape other than a circle. do.
　図１８に示すように、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａ’の第２部分４９２は、多孔質基材１の第２端面Ｔ２の中央領域Ｔ２２の少なくとも一部を被覆し、整流板４９ａ’の第１部分４９１に形成された貫通孔Ｈは、多孔質基材１の第２端面Ｔ２の外縁領域Ｔ２１の少なくとも一部を露出させる。したがって、変更例１Ａは、整流部材４０ａの上記効果と同様の効果を奏する。 As shown in FIG. 18, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second portion of the current plate 49a' 492 covers at least part of the central region T22 of the second end surface T2 of the porous substrate 1, and the through hole H formed in the first portion 491 of the straightening plate 49a' At least part of the outer edge region T21 of the two end surfaces T2 is exposed. Therefore, the modified example 1A has the same effect as the above effect of the rectifying member 40a.
＜変更例１Ｂ＞
　整流部材４０ｂにおいて、第１整流板４９ｂの第１部分４９１には、貫通孔Ｇに代えて多数の丸孔状の貫通孔Ｈが形成されていてもよい。貫通孔Ｈに関する上記説明は、変更例１Ｂにも適用される。変更例１Ｂは、整流部材４０ｂの上記効果と同様の効果を奏する。 <Modification 1B>
In the straightening member 40b, instead of the through holes G, a large number of circular through holes H may be formed in the first portion 491 of the first straightening plate 49b. The above description regarding the through hole H also applies to the modification 1B. Modification 1B has the same effect as the above effect of the rectifying member 40b.
＜変更例２＞
　以下、図１９を参照して、変更例２について説明する。図１９は、吸引管４６１と、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部との間に隙間が形成される変形例を説明するための端面図である。なお、図１９は、吸引管４６１が図８に示すスラリー吸引位置にある状態において、多孔質基材１の軸方向Ｘに垂直な平面で、吸引管４６１の上端部、第２基材固定部４８及び多孔質基材１の第２端面Ｔ２側の端部を切断したときの端面図である。 <Modification 2>
Modification 2 will be described below with reference to FIG. FIG. 19 is an end view for explaining a modification in which a gap is formed between the suction tube 461 and the end of the porous substrate 1 on the second end face T2 side that has entered the suction tube 461. FIG. . 19 is a plane perpendicular to the axial direction X of the porous substrate 1 in a state where the suction tube 461 is at the slurry suction position shown in FIG. 48 and an end view when the end portion on the second end face T2 side of the porous substrate 1 is cut.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、図１９に示すように、吸引管４６１と、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部との間に隙間Ｖ３を形成してもよい。第２基材固定部４８が、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部を吸引管４６１内に固定しないことにより（例えば、第２基材固定部４８が風船式チャックを有する場合、風船を膨張させないことにより）、隙間Ｖ３を形成することができる。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, as shown in FIG. A gap V3 may be formed between the second end surface T2 side end of the porous substrate 1 that has entered inside. The second base material fixing part 48 does not fix the end of the porous base material 1 on the side of the second end surface T2 that has entered the suction tube 461 (for example, the second base material fixing part 48 has a balloon chuck, the gap V3 can be formed by not inflating the balloon).
　吸引管４６１と、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部との間に、隙間Ｖ３が形成されると、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の整流部材４０に形成された貫通孔に流れ込む。例えば、第１実施形態では、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の整流板４９ａに形成された貫通孔（例えば、第１部分４９１に形成された第１貫通孔Ｇ）に流れ込む。また、第２実施形態では、吸引管４６１外の空気が、多孔質基材１の外周面に沿って、吸引管４６１内の第１整流板４９ｂ及び第２整流板５０に形成された貫通孔（例えば、第１整流板４９ｂの第１部分４９１に形成された第１貫通孔Ｇ、第１整流板４９ｂの第２部分４９２に形成された第２貫通孔Ｊ、第２整流板５０に形成された貫通孔Ｋ等）に流れ込む。これにより、多孔質基材１の第２端面Ｔ２側の端部における、多孔質基材１の径方向の内側部分における吸引力と、多孔質基材１の径方向の外側部分における吸引力との差がより緩和され、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差がより小さくなる。 When the gap V3 is formed between the suction tube 461 and the end portion of the porous substrate 1 on the side of the second end surface T2 that has entered the suction tube 461, the porous substrate 1 on the side of the first end surface T1 is formed. When the slurry M supplied to is sucked from the second end surface T2 side of the porous substrate 1, the air outside the suction tube 461 is rectified in the suction tube 461 along the outer peripheral surface of the porous substrate 1. It flows into through-holes formed in member 40 . For example, in the first embodiment, the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 and flows through the through holes (for example, the first portion 491) formed in the current plate 49a inside the suction tube 461. It flows into the formed first through hole G). In addition, in the second embodiment, the air outside the suction tube 461 flows along the outer peripheral surface of the porous substrate 1 and through the through holes formed in the first straightening plate 49 b and the second straightening plate 50 inside the suction tube 461 . (For example, a first through hole G formed in the first portion 491 of the first straightening plate 49b, a second through hole J formed in the second portion 492 of the first straightening plate 49b, and a second through hole J formed in the second straightening plate 50 through-hole K, etc.). As a result, the suction force at the radially inner portion of the porous substrate 1 and the suction force at the radially outer portion of the porous substrate 1 at the end portion of the porous substrate 1 on the second end surface T2 side. The difference between the length of the slurry layer N formed on the inner portion in the radial direction of the porous substrate 1 and the length of the slurry layer N formed on the outer portion in the radial direction of the porous substrate 1 difference becomes smaller.
＜変更例３＞
　以下、図２０を参照して、変更例３について説明する。図２０は、変更例に係るコーティング処理部４ａの構成を示す概略一部端面図である。なお、図２０は、多孔質基材１に対してコーティング処理が行われる際の状態を示す。 <Modification 3>
Modification 3 will be described below with reference to FIG. FIG. 20 is a schematic partial end view showing the configuration of a coating processing section 4a according to a modification. In addition, FIG. 20 shows the state when the porous substrate 1 is subjected to the coating process.
　コーティング処理部４ａにおいて、コーティング処理部４と同一の部材又は部分は、コーティング処理部４と同一の符号で示されている。コーティング処理部４に関する上記説明は、別段規定される場合を除き、コーティング処理部４ａにも適用される。 In the coating processing unit 4a, the same members or portions as the coating processing unit 4 are denoted by the same reference numerals as the coating processing unit 4. The above description of the coating section 4 also applies to the coating section 4a, unless otherwise specified.
　図２０に示すように、治具移動機構７によって治具４４をノズル４２２とは独立して移動させてもよい。この場合、治具４４は、ノズル保持部４３１に取り付けられない。 As shown in FIG. 20, the jig 44 may be moved independently of the nozzle 422 by the jig moving mechanism 7. In this case, the jig 44 is not attached to the nozzle holder 431 .
＜変更例４＞
　以下、図２０～２２を参照して、変更例４について説明する。図２０は、上記の通りであり、図２１は、変更例に係る多孔質基材の第１端面の平面図であり、図２２は、変更例に係る整流板の平面図である。 <Modification 4>
Modification 4 will be described below with reference to FIGS. FIG. 20 is as described above, FIG. 21 is a plan view of the first end face of the porous base material according to the modification, and FIG. 22 is a plan view of the current plate according to the modification.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、図２０～２２に示すように、整流板４９ａは、多孔質基材１の第１端面Ｔ１側に配置され、多孔質基材１の第１端面Ｔ１のうち、中央領域Ｔ１２の少なくとも一部を被覆し、外縁領域Ｔ１１の少なくとも一部を露出させてもよい。変更例４は、整流板４９ａの配置位置が変更された例である。したがって、変更例４における整流板４９ａの構成は上記と同様であり、整流板４９ａに関する上記説明は、別段規定される場合を除き、変更例４にも適用される。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, as shown in FIGS. It is arranged on the first end face T1 side of the porous base material 1, covers at least part of the central region T12, and exposes at least part of the outer edge region T11 of the first end face T1 of the porous base material 1. good. Modification 4 is an example in which the arrangement position of the current plate 49a is changed. Therefore, the configuration of the rectifying plate 49a in Modification 4 is the same as that described above, and the above description of the rectifying plate 49a also applies to Modification 4, unless otherwise specified.
　図２０示すように、整流板４９ａの第１端面Ｔ１側の主面は、多孔質基材１の第１端面Ｔ１と略平行である。「略平行」の意義は上記の通りである。 As shown in FIG. 20, the main surface of the current plate 49a on the side of the first end surface T1 is substantially parallel to the first end surface T1 of the porous substrate 1. As shown in FIG. The meaning of "substantially parallel" is as described above.
　変更例４では、ノズル移動工程に代えて、以下の工程が行われる。治具移動機構７によって治具４４を移動させることにより、多孔質基材１の第１端面Ｔ１側の端部を、治具４４内に進入させ、治具４４内に、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭの貯留を可能とする貯留空間Ｖ１を形成する。次いで、昇降機構４３２によってノズル保持部４３１を降下させることにより、ノズル４２２を多孔質基材１に近づけ、スラリー供給位置に移動させる。次いで、スラリー供給位置において、ノズル４２２から、多孔質基材１の第１端面Ｔ１にスラリーＭを供給する。次いで、昇降機構４３２によってノズル保持部４３１を上昇させることにより、ノズル４２２を多孔質基材１から遠ざけ、待機位置に移動させる。次いで、整流板４９ａを多孔質基材１の第１端面Ｔ１側に配置する。整流板４９ａの配置は、整流板移動機構（不図示）によって行ってもよいし、手動で行ってもよい。 In Modification 4, the following steps are performed instead of the nozzle movement step. By moving the jig 44 by the jig moving mechanism 7, the end portion of the porous substrate 1 on the side of the first end surface T1 is caused to enter the jig 44, and the porous substrate 1 is inserted into the jig 44. A storage space V1 that enables storage of the supplied slurry M is formed on the first end face T1 side of the . Next, the lifting mechanism 432 lowers the nozzle holder 431 to bring the nozzle 422 closer to the porous substrate 1 and move it to the slurry supply position. Next, the slurry M is supplied from the nozzle 422 to the first end surface T1 of the porous substrate 1 at the slurry supply position. Next, the lifting mechanism 432 lifts the nozzle holder 431 to move the nozzle 422 away from the porous substrate 1 to the standby position. Next, the straightening plate 49a is arranged on the first end surface T1 side of the porous substrate 1 . The rectifying plate 49a may be arranged by a rectifying plate moving mechanism (not shown) or manually.
　図２１に示すように、多孔質基材１の第１端面Ｔ１は、境界線Ｌ１によって、第１端面Ｔ１の径方向の外側に位置する環状（例えば円環状）の外縁領域Ｔ１１と、外縁領域Ｔ１１の内側に位置する中央領域Ｔ１２とに区画される。境界線Ｌ１は仮想線である。なお、図２１において、第１端面Ｔ１に存在するセル１３ａの開口部は省略されている。 As shown in FIG. 21 , the first end surface T1 of the porous substrate 1 includes an annular (for example, annular) outer edge region T11 located radially outside the first end surface T1 and an outer edge region T11 located radially outward of the first end surface T1. It is partitioned into a central region T12 located inside T11. The boundary line L1 is a virtual line. In addition, in FIG. 21, the openings of the cells 13a existing in the first end surface T1 are omitted.
　中央領域Ｔ１２の面積は、第１端面Ｔ１の面積の４０％以上９０％以下であることが好ましく、６５％以上８５％以下であることがより好ましい。 The area of the central region T12 is preferably 40% or more and 90% or less, more preferably 65% or more and 85% or less, of the area of the first end surface T1.
　中央領域Ｔ１２の形状と第１端面Ｔ１の形状とは、相似形状であることが好ましい。中央領域Ｔ１２の形状は、中央領域Ｔ１２の外形線（すなわち、境界線Ｌ１）により規定される形状を意味し、第１端面Ｔ１の形状は、第１端面Ｔ１の外形線により規定される形状を意味する。 The shape of the central region T12 and the shape of the first end face T1 are preferably similar shapes. The shape of the central region T12 means the shape defined by the outline of the central region T12 (that is, the boundary line L1), and the shape of the first end face T1 means the shape defined by the outline of the first end face T1. means.
　外縁領域Ｔ１１は、中央領域Ｔ１２の形状と第１端面Ｔ１の形状とが相似形状となるように、第１端面Ｔ１の外形線に沿って所定の幅で形成されていることが好ましい。中央領域Ｔ１２の形状と第１端面Ｔ１の形状とが相似形状となる限り、外縁領域Ｔ１１の幅は一定であってもよいし、一定でなくてもよい。 The outer edge region T11 is preferably formed with a predetermined width along the outline of the first end face T1 so that the shape of the central region T12 and the shape of the first end face T1 are similar. As long as the shape of the central region T12 and the shape of the first end face T1 are similar, the width of the outer edge region T11 may or may not be constant.
　図２０及び２１に示すように、整流板４９ａは、環状（例えば円環状）の第１部分４９１と、第１部分４９１の内側に位置する第２部分４９２と、第１部分４９１の外側に位置する環状（例えば円環状）の第３部分４９３とを備える。 As shown in FIGS. 20 and 21, the current plate 49a includes a first annular (for example, annular) portion 491, a second portion 492 positioned inside the first portion 491, and a second portion 492 positioned outside the first portion 491. and an annular (eg, toric) third portion 493 .
　図２２に示すように、整流板４９ａが多孔質基材１の第１端面Ｔ１側に配置された状態において多孔質基材１の第１端面Ｔ１及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第１端面Ｔ１を投影したとき）、整流板４９ａのうち、多孔質基材１の第１端面Ｔ１の外縁領域Ｔ１１と重なる部分が第１部分４９１であり、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２と重なる部分が第２部分４９２である。なお、図２２において、整流板４９ａの平面図に投影された第１端面Ｔ１の外形線及び中央領域Ｔ１２の外形線（すなわち、境界線Ｌ１）はそれぞれ点線及び二点鎖線で示されている。 As shown in FIG. 22, in a state where the rectifying plate 49a is arranged on the first end surface T1 side of the porous substrate 1, the first end surface T1 of the porous substrate 1 and the rectifying plate 49a are aligned with the axis of the porous substrate 1. As shown in FIG. When viewed in plan from the direction X (for example, when the first end surface T1 of the porous substrate 1 is projected onto the plan view of the straightening plate 49a), the first end surface T1 of the porous substrate 1 of the straightening plate 49a is A portion overlapping with the outer edge region T11 is the first portion 491, and a portion overlapping with the central region T12 of the first end surface T1 of the porous substrate 1 is the second portion 492. In FIG. 22, the outline of the first end face T1 and the outline of the central region T12 (that is, the boundary line L1) projected onto the plan view of the current plate 49a are indicated by dotted lines and chain double-dashed lines, respectively.
　図２２に示すように、整流板４９ａの第２部分４９２には、貫通孔は形成されていない。整流板４９ａの第２部分４９２には、本実施形態のように貫通孔が形成されていないことが好ましいが、貫通孔（以下「第２貫通孔」という。）が形成されていてもよい。第２貫通孔に関する上記説明は、変更例４にも適用される。 As shown in FIG. 22, no through hole is formed in the second portion 492 of the current plate 49a. The second portion 492 of the straightening plate 49a preferably does not have a through hole as in the present embodiment, but may have a through hole (hereinafter referred to as "second through hole"). The above description regarding the second through hole also applies to Modification 4.
　整流板４９ａの第２部分４９２に第２貫通孔が形成される場合、第２貫通孔は、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の一部を露出させる。「第２貫通孔が、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の一部を露出させる」とは、吸引管４６１が図８に示すスラリー吸引位置にある状態において多孔質基材１の第１端面Ｔ１及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第１端面Ｔ１を投影したとき）、第２貫通孔が、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の一部と重なることを意味する。整流部材４０ａの効果をより向上させる観点から、第２貫通孔が露出させる中央領域Ｔ１２の一部の面積は、中央領域Ｔ１２の面積の５０％以下であることが好ましく、４０％以下であることがより好ましく、３０％以下であることがより一層好ましく、２０％以下であることがより一層好ましく、１０％以下であることがより一層好ましく、５％以下であることがより一層好ましい。「第２貫通孔が露出させる中央領域Ｔ１２の一部の面積」は、整流板４９ａの第２部分４９２に２以上の第２貫通孔が形成されている場合には、当該２以上の第２貫通孔が露出させる中央領域Ｔ１２の部分の合計面積を意味する。 When the second through-hole is formed in the second portion 492 of the current plate 49a, the second through-hole exposes part of the central region T12 of the first end surface T1 of the porous substrate 1. “The second through-hole exposes a part of the central region T12 of the first end surface T1 of the porous substrate 1” means that the porous substrate is in a state where the suction pipe 461 is at the slurry suction position shown in FIG. 1 and the straightening plate 49a are viewed from the axial direction X of the porous substrate 1 (for example, when the first end surface T1 of the porous substrate 1 is projected onto the plan view of the straightening plate 49a). , means that the second through-hole overlaps with a part of the central region T12 of the first end surface T1 of the porous substrate 1 . From the viewpoint of further improving the effect of the rectifying member 40a, the area of the part of the central region T12 exposed by the second through holes is preferably 50% or less of the area of the central region T12, and 40% or less. is more preferably 30% or less, even more preferably 20% or less, even more preferably 10% or less, and even more preferably 5% or less. When two or more second through holes are formed in the second portion 492 of the rectifying plate 49a, the "area of the part of the central region T12 exposed by the second through holes" is the two or more second through holes. It means the total area of the portion of the central region T12 exposed by the through holes.
　図２２に示すように、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａの第２部分４９２は、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の少なくとも一部を被覆し、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇは、多孔質基材１の第１端面Ｔ１の外縁領域Ｔ１１の少なくとも一部を露出させる。 As shown in FIG. 22, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the second portion 492 of the current plate 49a covers at least part of the central region T12 of the first end surface T1 of the porous substrate 1, and the first through hole G formed in the first portion 491 of the current plate 49a At least part of the outer edge region T11 of the one end surface T1 is exposed.
　「整流板４９ａの第２部分４９２が、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の少なくとも一部を被覆する」とは、整流板４９ａが多孔質基材１の第１端面Ｔ１側に配置された状態において多孔質基材１の第１端面Ｔ１及び整流板４９を多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第１端面Ｔ１を投影したとき）、図２２に示すように、整流板４９ａの第２部分４９２のうち第２貫通孔以外の部分が、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２と重なることを意味する。整流板４９ａの第２部分４９２に第２貫通孔が形成されていない場合、整流板４９ａの第２部分４９２は、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の全体を被覆し、整流板４９ａの第２部分４９２に第２貫通孔が形成されている場合、整流板４９ａの第２部分４９２は、多孔質基材１の第１端面Ｔ１の中央領域Ｔ１２の一部を被覆する。 “The second portion 492 of the straightening plate 49a covers at least part of the central region T12 of the first end surface T1 of the porous substrate 1” means that the straightening plate 49a covers the first end surface T1 of the porous substrate 1. When the first end face T1 of the porous substrate 1 and the rectifying plate 49 are viewed from the axial direction X of the porous substrate 1 in the state of being arranged on the side (for example, the plan view of the rectifying plate 49a shows the porous substrate 22, the portion of the second portion 492 of the rectifying plate 49a other than the second through-hole is located at the center of the first end surface T1 of the porous substrate 1, as shown in FIG. It means that it overlaps with the region T12. When the second portion 492 of the current plate 49a does not have a second through hole, the second portion 492 of the current plate 49a covers the entire central region T12 of the first end surface T1 of the porous substrate 1, When the second portion 492 of the straightening plate 49a has the second through hole, the second portion 492 of the straightening plate 49a covers part of the central region T12 of the first end surface T1 of the porous substrate 1. .
　「整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが、多孔質基材１の第１端面Ｔ１の外縁領域Ｔ１１の少なくとも一部を露出させる」とは、整流板４９ａが多孔質基材１の第１端面Ｔ１側に配置された状態において多孔質基材１の第１端面Ｔ１及び整流板４９ａを多孔質基材１の軸方向Ｘから平面視したとき（例えば、整流板４９ａの平面図に多孔質基材１の第１端面Ｔ１を投影したとき）、図２２に示すように、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが、多孔質基材１の第１端面Ｔ１の外縁領域Ｔ１１の少なくとも一部と重なることを意味する。 “The first through holes G formed in the first portion 491 of the current plate 49a expose at least part of the outer edge region T11 of the first end surface T1 of the porous substrate 1” means that the current plate 49a is porous. When the first end surface T1 of the porous substrate 1 and the rectifying plate 49a are arranged on the first end surface T1 side of the porous substrate 1 and viewed from the axial direction X of the porous substrate 1 (for example, the rectifying plate 22, when the first end face T1 of the porous substrate 1 is projected onto the plan view of the plate 49a, the first through holes G formed in the first portion 491 of the current plate 49a are aligned with the porous substrate. It means that it overlaps with at least part of the outer edge region T11 of the first end surface T1 of the material 1 .
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａが、多孔質基材１の第１端面Ｔ１側に配置される場合も、整流板４９ａが、多孔質基材１の第２端面Ｔ２側に配置される場合と同様の効果が奏される。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the current plate 49a When the rectifying plate 49a is arranged on the second end surface T2 side of the porous substrate 1, the same effect as when the rectifying plate 49a is arranged on the second end surface T2 side of the porous substrate 1 can be obtained.
　変更例４において、整流板４９ａの上記効果をより向上させる観点から、整流板４９ａの第２部分４９２が被覆する中央領域Ｔ１２の少なくとも一部の面積は、中央領域Ｔ１２の面積の５０％以上であることが好ましく、６０％以上であることがより好ましく、７０％以上であることがより一層好ましく、８０％以上であることがより一層好ましく、９０％以上であることがより一層好ましく、９５％以上であることがより一層好ましい。上限は１００％である。 In Modification 4, from the viewpoint of further improving the above effect of the rectifying plate 49a, the area of at least part of the central region T12 covered by the second portion 492 of the rectifying plate 49a is 50% or more of the area of the central region T12. preferably 60% or more, even more preferably 70% or more, even more preferably 80% or more, even more preferably 90% or more, 95% The above is even more preferable. The upper limit is 100%.
　変更例４において、整流板４９ａの上記効果をより向上させる観点から、整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ１１の少なくとも一部の面積は、外縁領域Ｔ１１の面積の５０％以上であることが好ましく、６０％以上であることがより好ましく、７０％以上であることがより一層好ましく、８０％以上であることがより一層好ましく、９０％以上であることがより一層好ましく、９５％以上であることがより一層好ましい。上限は１００％である。「整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ１１の少なくとも一部の面積」は、整流板４９ａの第１部分４９１に２以上の第１貫通孔Ｇが形成されている場合には、当該２以上の第１貫通孔Ｇが露出させる外縁領域Ｔ２１の部分の合計面積を意味する。 In Modified Example 4, from the viewpoint of further improving the above effect of the rectifying plate 49a, the area of at least a part of the outer edge region T11 exposed by the first through holes G formed in the first portion 491 of the rectifying plate 49a is The area of the region T11 is preferably 50% or more, more preferably 60% or more, still more preferably 70% or more, even more preferably 80% or more, and 90% or more. It is more preferable that the ratio is 95% or more. The upper limit is 100%. "At least a part of the outer edge region T11 exposed by the first through holes G formed in the first portion 491 of the straightening plate 49a" is defined by two or more first through holes G formed in the first portion 491 of the straightening plate 49a. is formed, it means the total area of the portion of the outer edge region T21 exposed by the two or more first through holes G.
　変更例４において、整流板４９ａの上記効果をより向上させる観点から、整流板４９ａが多孔質基材１の第１端面Ｔ１側に配置された状態における、整流板４９ａと多孔質基材１の第１端面Ｔ１との距離Ｄ１は、５ｍｍ以上３０ｍｍ以下であることが好ましく、５ｍｍ以上１５ｍｍ以下であることがより好ましい。距離Ｄ１は、整流板４９ａの第１端面Ｔ１側の主面と多孔質基材１の第１端面Ｔ１との距離である。距離Ｄ１が一定でない場合、距離Ｄ１の最小値及び最大値の両方が上記範囲であることが好ましい。 In Modified Example 4, from the viewpoint of further improving the above effect of the straightening plate 49a, the straightening plate 49a and the porous substrate 1 are arranged in a state where the straightening plate 49a is arranged on the first end surface T1 side of the porous substrate 1. A distance D1 from the first end face T1 is preferably 5 mm or more and 30 mm or less, and more preferably 5 mm or more and 15 mm or less. The distance D1 is the distance between the first end surface T1 side main surface of the current plate 49a and the first end surface T1 of the porous substrate 1 . If the distance D1 is not constant, both the minimum value and the maximum value of the distance D1 are preferably within the above range.
＜変更例５＞
　以下、図２３～２５を参照して、変更例５について説明する。図２３～２５は、変更例に係るコーティング処理部４ｂの構成を示す概略一部端面図である。なお、図２３は、多孔質基材１に対してスラリー供給処理及びコーティング処理が行われる前の状態を、図２４は、多孔質基材１に対してスラリー供給処理が行われる際の状態を、図２５は、多孔質基材１に対してコーティング処理が行われる際の状態を示す。 <Modification 5>
Modification 5 will be described below with reference to FIGS. 23 to 25 are schematic partial end views showing the configuration of the coating processing section 4b according to the modification. 23 shows the state before the slurry supply process and the coating process are performed on the porous substrate 1, and FIG. 24 shows the state when the slurry supply process is performed on the porous substrate 1. , and FIG. 25 show the state when the porous substrate 1 is subjected to the coating process.
　図２３に示すように、コーティング処理部４ｂは、スラリー供給部４２、ノズル移動機構４３及び第１基材固定部４５が省略され、スラリーＭが貯留されている貯留槽４２ｂが設けられている点で、コーティング処理部４とは異なる。コーティング処理部４ｂにおいて、コーティング処理部４と同一の部材又は部分は、コーティング処理部４と同一の符号で示されている。コーティング処理部４に関する上記説明は、別段規定される場合を除き、コーティング処理部４ｂにも適用される。 As shown in FIG. 23, the coating processing unit 4b does not include the slurry supply unit 42, the nozzle moving mechanism 43, and the first substrate fixing unit 45, and is provided with a storage tank 42b in which the slurry M is stored. , and is different from the coating processing section 4 . In the coating processing section 4b, the same members or portions as the coating processing section 4 are denoted by the same reference numerals as in the coating processing section 4. As shown in FIG. The above description of the coating section 4 also applies to the coating section 4b, unless otherwise specified.
　図２３に示すように、貯留槽４２ｂは、基材保持部４１に保持された多孔質基材１の下方に設置されている。 As shown in FIG. 23, the storage tank 42b is installed below the porous substrate 1 held by the substrate holding portion 41. As shown in FIG.
　図２３に示すように、基材保持部４１は、多孔質基材１の第１端面Ｔ１が貯留槽４２ｂ側（図２３の下側）を向くように、多孔質基材１を保持する。 As shown in FIG. 23, the substrate holding part 41 holds the porous substrate 1 so that the first end face T1 of the porous substrate 1 faces the reservoir 42b side (lower side in FIG. 23).
　変更例５では、基材保持工程の後、ノズル移動工程及び吸引管移動工程が行われることなく、工程（ａ）が行われる。 In Modified Example 5, the step (a) is performed after the substrate holding step, without performing the nozzle moving step and the suction tube moving step.
　工程（ａ）において、基材保持部４１は、多孔質基材１を降下させる。これにより、図２４に示すように、多孔質基材１の第１端面Ｔ１側の端部は、貯留槽４２ｂ中のスラリーＭに浸漬され、多孔質基材１の第１端面Ｔ１側には、スラリーＭが供給される。したがって、変更例５では、基材保持部４１及び貯留槽４２ｂが、多孔質基材１の第１端面Ｔ１側にスラリーＭを供給するスラリー供給部として機能する。 In step (a), the substrate holder 41 lowers the porous substrate 1 . As a result, as shown in FIG. 24, the end portion of the porous substrate 1 on the first end surface T1 side is immersed in the slurry M in the storage tank 42b, and the porous substrate 1 on the first end surface T1 side is , slurry M is supplied. Therefore, in Modification 5, the base material holding part 41 and the storage tank 42b function as a slurry supply part that supplies the slurry M to the first end surface T1 side of the porous base material 1 .
　多孔質基材１の第１端面Ｔ１側にスラリーＭが供給された後、基材保持部４１は、多孔質基材１を上昇させ、多孔質基材１の第１端面Ｔ１側の端部を貯留槽４２ｂ中のスラリーＭから取り出し、多孔質基材１を反転させ、多孔質基材１を吸引管４６１の上方に移動させる。これにより、図２５に示すように、基材保持部４１により吸引管４６１の上方に保持された多孔質基材１の第２端面Ｔ２は、吸引管４６１側（図２５の下側）を向く。多孔質基材１を吸引管４６１の上方に移動させた後、多孔質基材１を反転させてもよい。 After the slurry M is supplied to the first end face T1 side of the porous base material 1, the base material holding part 41 raises the porous base material 1 so that the end portion of the porous base material 1 on the first end face T1 side is is taken out from the slurry M in the storage tank 42 b , the porous substrate 1 is inverted, and the porous substrate 1 is moved above the suction tube 461 . As a result, as shown in FIG. 25, the second end surface T2 of the porous substrate 1 held above the suction tube 461 by the substrate holding portion 41 faces the suction tube 461 side (lower side in FIG. 25). . After moving the porous substrate 1 above the suction tube 461, the porous substrate 1 may be turned over.
　制御部３は、基材保持部４１の動作を制御し、多孔質基材１の第１端面Ｔ１側の端部を貯留槽４２ｂ中のスラリーＭに浸漬するタイミング、浸漬する時間（スラリーＭの供給量）、多孔質基材１の第１端面Ｔ１側の端部を貯留槽４２ｂ中のスラリーＭから取り出すタイミング、多孔質基材１を反転させるタイミング、多孔質基材１を吸引管４６１の上方に移動させるタイミング等を制御する。 The control unit 3 controls the operation of the substrate holding unit 41, and determines the timing and duration of immersion of the end of the porous substrate 1 on the first end surface T1 side in the slurry M in the storage tank 42b ( supply amount), the timing of removing the end of the porous substrate 1 on the first end face T1 side from the slurry M in the storage tank 42b, the timing of turning over the porous substrate 1, Controls the timing of upward movement.
　工程（ａ）の後、吸引管移動工程が行われる。吸引管移動工程では、吸引管移動機構４７が吸引管４６１を図２３及び２４に示す待機位置から図２５に示すスラリー吸引位置に移動させる。 After step (a), a suction tube moving step is performed. In the suction tube moving step, the suction tube moving mechanism 47 moves the suction tube 461 from the standby position shown in FIGS. 23 and 24 to the slurry suction position shown in FIG.
　吸引管移動工程の後、工程（ｂ）が行われる。 After the suction tube moving process, the process (b) is performed.
〔実施例１〕
　図１～４に示す円柱状の多孔質基材１を準備した。多孔質基材１の長さは１２７ｍｍ、多孔質基材１の直径は１１８ｍｍ、多孔質基材１の１平方インチあたりのセルの合計数は１平方インチあたり３００セルであった。 [Example 1]
A cylindrical porous substrate 1 shown in FIGS. 1 to 4 was prepared. The length of the porous substrate 1 was 127 mm, the diameter of the porous substrate 1 was 118 mm, and the total number of cells per square inch of the porous substrate 1 was 300 cells per square inch.
　触媒層の原料を含有するスラリーＭを準備した。スラリーＭの粘度は、コーン・アンド・プレート型の粘度計を使用し、２５℃の温度で、せん断速度を３８０ｓ－１として測定した場合、５００ｍＰａ・ｓであり、せん断速度を４ｓ－１として測定した場合、５５００ｍＰａ・ｓであった。 A slurry M containing raw materials for the catalyst layer was prepared. The viscosity of slurry M is 500 mPa s when measured using a cone and plate type viscometer at a temperature of 25 ° C. and a shear rate of 380 s -1 , and a shear rate of 4 s -1 . was 5500 mPa·s.
　図５～８に示す構造体製造装置１００を準備した。整流部材４０としては、図１１及び１２に示す整流板４９ａを使用した。整流板４９ａの第２部分４９２の直径は１０８．４ｍｍ、第１貫通孔Ｇの幅Ｗは５ｍｍに調整した。整流板４９ａの第１部分４９１及び第２端面Ｔ２の外縁領域Ｔ２１は、第２端面Ｔ２の面積の１６％、整流板４９ａの第２部分４９２及び第２端面Ｔ２の中央領域Ｔ２２は、第２端面Ｔ２の面積の８４％に調整した。整流板４９ａの第１部分４９１に形成された第１貫通孔Ｇが露出させる外縁領域Ｔ２１の面積は、外縁領域Ｔ２１の面積の９７％、整流板４９ａの第２部分４９２が被覆する中央領域Ｔ２２の面積は、中央領域Ｔ２２の１００％に調整した。吸引管４６１がスラリー吸引位置にあるときの、整流板４９ａと多孔質基材１の第２端面Ｔ２との距離Ｄ２ａは６ｍｍに調整した。 A structure manufacturing apparatus 100 shown in FIGS. 5 to 8 was prepared. As the rectifying member 40, the rectifying plate 49a shown in FIGS. 11 and 12 was used. The diameter of the second portion 492 of the current plate 49a was adjusted to 108.4 mm, and the width W of the first through hole G was adjusted to 5 mm. The first portion 491 of the rectifying plate 49a and the outer edge region T21 of the second end surface T2 are 16% of the area of the second end surface T2, and the second portion 492 of the rectifying plate 49a and the central region T22 of the second end surface T2 are the second end surface T2. It was adjusted to 84% of the area of the end surface T2. The area of the outer edge region T21 exposed by the first through holes G formed in the first portion 491 of the current plate 49a is 97% of the area of the outer edge region T21, and the central region T22 covered by the second portion 492 of the current plate 49a. was adjusted to 100% of the central region T22. The distance D2a between the current plate 49a and the second end face T2 of the porous substrate 1 when the suction pipe 461 is at the slurry suction position was adjusted to 6 mm.
　構造体製造装置１００により、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭを多孔質基材１の第２端面Ｔ２側から吸引し、多孔質基材１の第１セルの内壁に、多孔質基材１の第２端面Ｔ２に達しないスラリー層Ｎを形成した。 By the structure manufacturing apparatus 100, the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, and the first cell of the porous substrate 1 is A slurry layer N that did not reach the second end surface T2 of the porous substrate 1 was formed on the inner wall.
　多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の径方向の内側部分のうち、第１端面Ｔ１側の部分における空気の流速は、３．８ｍ／ｓであり、多孔質基材１の径方向の外側部分のうち、第１端面Ｔ１側の部分における空気の流速は、１４ｍ／ｓであった。 When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, the inner part of the porous substrate 1 in the radial direction is the first The flow velocity of air in the portion on the side of the first end surface T1 is 3.8 m/s, and the flow velocity of air in the portion on the side of the first end surface T1 among the radially outer portions of the porous substrate 1 is 14 m/s. Met.
　多孔質基材１を軸方向Ｘに平行な平面で切断し、多孔質基材１の径方向の外側部分Ｑ１（図２６に示すように、多孔質基材１のうち、左側部分（５％）及び右側部分（５％））における４個のスラリー層Ｎの長さを測定し、平均値を求めた。同様に、多孔質基材１の径方向の内側部分Ｑ２（図２６に示すように、多孔質基材１のうち、中央部分（９０％））における３６個のスラリー層Ｎの長さを測定し、平均値を求めた。 The porous substrate 1 is cut along a plane parallel to the axial direction X, and the radial outer portion Q1 of the porous substrate 1 (as shown in FIG. 26, the left portion (5% ) and the right portion (5%)) were measured, and the average value was obtained. Similarly, the length of 36 slurry layers N in the radially inner portion Q2 of the porous substrate 1 (the central portion (90%) of the porous substrate 1 as shown in FIG. 26) is measured. and calculated the average value.
　多孔質基材１の長さに対する、多孔質基材１の径方向の内側部分Ｑ２におけるスラリー層Ｎの長さの平均値の百分率Ｚ２（％）と、多孔質基材１の長さに対する、多孔質基材１の径方向の外側部分Ｑ１におけるスラリー層Ｎの長さの平均値の百分率Ｚ１（％）との差（Ｚ２－Ｚ１）は、７．５％であった。 Percentage Z2 (%) of the average value of the length of the slurry layer N in the inner portion Q2 in the radial direction of the porous substrate 1 with respect to the length of the porous substrate 1, and the length of the porous substrate 1, The difference (Z2-Z1) from the average percentage Z1 (%) of the length of the slurry layer N in the radially outer portion Q1 of the porous substrate 1 was 7.5%.
〔実施例２〕
　図１９に示すように、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部を、第２基材固定部４８によって固定せず、吸引管４６１と、吸引管４６１内に進入した多孔質基材１の第２端面Ｔ２側の端部との間に隙間を形成した点を除き、実施例１と同様の操作を行った。なお、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の径方向の内側部分のうち、第１端面Ｔ１側の部分における空気の流速は、３．１ｍ／ｓであり、多孔質基材１の径方向の外側部分のうち、第１端面Ｔ１側の部分における空気の流速は、９．２ｍ／ｓであった。 [Example 2]
As shown in FIG. 19, the end portion of the porous substrate 1 on the second end surface T2 side that has entered the suction tube 461 is not fixed by the second substrate fixing portion 48, and the suction tube 461 and the suction tube 461 are separated from each other. The same operation as in Example 1 was performed, except that a gap was formed between the second end face T2 side end of the porous substrate 1 that had entered inside. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, , the air flow velocity in the portion on the first end surface T1 side is 3.1 m/s, and the air flow velocity in the portion on the first end surface T1 side of the radially outer portion of the porous substrate 1 is 9 .2 m/s.
　多孔質基材１の長さに対する、多孔質基材１の径方向の内側部分Ｑ２におけるスラリー層Ｎの長さの平均値の百分率Ｚ２（％）と、多孔質基材１の長さに対する、多孔質基材１の径方向の外側部分Ｑ１におけるスラリー層Ｎの長さの平均値の百分率Ｚ１（％）との差（Ｚ２－Ｚ１）は、６．３％であった。 Percentage Z2 (%) of the average value of the length of the slurry layer N in the inner portion Q2 in the radial direction of the porous substrate 1 with respect to the length of the porous substrate 1, and the length of the porous substrate 1, The difference (Z2-Z1) from the average percentage Z1 (%) of the length of the slurry layer N in the radially outer portion Q1 of the porous substrate 1 was 6.3%.
〔比較例１〕
　整流板４９ａを使用しなかった点を除き、実施例１と同様の操作を行った。なお、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の径方向の内側部分のうち、第１端面Ｔ１側の部分における空気の流速は、１４．６ｍ／ｓであり、多孔質基材１の径方向の外側部分のうち、第１端面Ｔ１側の部分における空気の流速は、１５．３ｍ／ｓであった。 [Comparative Example 1]
The same operation as in Example 1 was performed, except that the current plate 49a was not used. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, , the air flow velocity in the portion on the first end surface T1 side is 14.6 m/s, and the air flow velocity in the portion on the first end surface T1 side of the radially outer portion of the porous substrate 1 is 15 m/s. .3 m/s.
　多孔質基材１の長さに対する、多孔質基材１の径方向の内側部分Ｑ２におけるスラリー層Ｎの長さの平均値の百分率Ｚ２（％）と、多孔質基材１の長さに対する、多孔質基材１の径方向の外側部分Ｑ１におけるスラリー層Ｎの長さの平均値の百分率Ｚ１（％）との差（Ｚ２－Ｚ１）は、１０．８％であった。 Percentage Z2 (%) of the average value of the length of the slurry layer N in the inner portion Q2 in the radial direction of the porous substrate 1 with respect to the length of the porous substrate 1, and the length of the porous substrate 1, The difference (Z2-Z1) from the average percentage Z1 (%) of the length of the slurry layer N in the radially outer portion Q1 of the porous substrate 1 was 10.8%.
〔比較例２〕
　整流板４９ａを使用しなかった点を除き、実施例２と同様の操作を行った。なお、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、多孔質基材１の径方向の内側部分のうち、第１端面Ｔ１側の部分における空気の流速は、１２．１ｍ／ｓであり、多孔質基材１の径方向の外側部分のうち、第１端面Ｔ１側の部分における空気の流速は、１１．１ｍ／ｓであった。 [Comparative Example 2]
The same operation as in Example 2 was performed, except that the current plate 49a was not used. When the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, , the flow velocity of air in the portion on the side of the first end surface T1 is 12.1 m/s, and the flow velocity of air in the portion on the side of the first end surface T1 among the radially outer portions of the porous substrate 1 is 11 m/s. .1 m/s.
　多孔質基材１の長さに対する、多孔質基材１の径方向の内側部分Ｑ２におけるスラリー層Ｎの長さの平均値の百分率Ｚ２（％）と、多孔質基材１の長さに対する、多孔質基材１の径方向の外側部分Ｑ１におけるスラリー層Ｎの長さの平均値の百分率Ｚ１（％）との差（Ｚ２－Ｚ１）は、１１．５％であった。 Percentage Z2 (%) of the average value of the length of the slurry layer N in the inner portion Q2 in the radial direction of the porous substrate 1 with respect to the length of the porous substrate 1, and the length of the porous substrate 1, The difference (Z2-Z1) from the average percentage Z1 (%) of the length of the slurry layer N in the radially outer portion Q1 of the porous substrate 1 was 11.5%.
　実施例１～２及び比較例１～２の結果から、多孔質基材１の第１端面Ｔ１側に供給されたスラリーＭが多孔質基材１の第２端面Ｔ２側から吸引される際、整流板４９ａが、多孔質基材１の第２端面Ｔ２側に配置されることにより、多孔質基材１の径方向の内側部分に形成されるスラリー層Ｎの長さと、多孔質基材１の径方向の外側部分に形成されるスラリー層Ｎの長さとの差が小さくなることが明らかとなった。 From the results of Examples 1 and 2 and Comparative Examples 1 and 2, when the slurry M supplied to the first end surface T1 side of the porous substrate 1 is sucked from the second end surface T2 side of the porous substrate 1, By arranging the rectifying plate 49a on the second end surface T2 side of the porous substrate 1, the length of the slurry layer N formed in the inner part in the radial direction of the porous substrate 1 and the length of the porous substrate 1 It has become clear that the difference between the length of the slurry layer N formed on the radially outer portion of the .
　１・・・多孔質基材，１１・・・筒状部，１２・・・隔壁部，１３・・・セル，１３ａ・・・第１セル，１３ｂ・・・第２セル，Ｔ１（Ｓ１）・・・第１端面，Ｔ１１・・・第１端面の外縁領域，Ｔ１２・・・第１端面の中央領域，Ｔ２（Ｓ２）・・・第２端面，Ｔ２１・・・第２端面の外縁領域，Ｔ２２・・・第２端面の中央領域，１００・・・構造体製造装置，２・・・基材処理部，３・・・制御部，４・・・コーティング処理部，４０・・・整流部材，４０ａ・・・第１実施形態に係る整流部材，４０ｂ・・・第２実施形態に係る整流部材，４１・・・基材保持部，４２・・・スラリー供給部，４３・・・ノズル移動機構，４４・・・治具，４５・・・第１基材固定部，４６・・・スラリー吸引部，４７・・・吸引管移動機構，４８・・・第２基材固定部，４９ａ・・・整流板，４９ｂ・・・第１整流板，５０・・・第２整流板，Ｇ・・・貫通孔，Ｍ・・・スラリー，Ｎ・・・スラリー層 DESCRIPTION OF SYMBOLS 1... Porous base material, 11... Cylindrical part, 12... Partition part, 13... Cell, 13a... First cell, 13b... Second cell, T1 (S1) ... first end face, T11 ... outer edge region of the first end face, T12 ... central region of the first end face, T2 (S2) ... second end face, T21 ... outer edge region of the second end face , T22... Central region of the second end surface, 100... Structure manufacturing apparatus, 2... Base material processing unit, 3... Control unit, 4... Coating processing unit, 40... Rectification Members 40a... Straightening member according to the first embodiment 40b... Straightening member according to the second embodiment 41... Base material holding part 42... Slurry supply part 43... Nozzle Moving mechanism 44 Jig 45 First base material fixing part 46 Slurry suction part 47 Suction tube moving mechanism 48 Second base material fixing part 49a Straightening plate 49b First straightening plate 50 Second straightening plate G Through hole M Slurry N Slurry layer

Claims (34)

  1. 　構造体を製造する装置であって、
    　前記構造体は、
    　軸方向に延在する多孔質基材と、
    　前記多孔質基材に設けられた機能層と、を備え、
    　前記多孔質基材は、
    　前記軸方向の一方側に位置する第１端面と、
    　前記軸方向の他方側に位置する第２端面と、
    　前記軸方向に延在し、前記第１端面側の端部が開口し、前記第２端面側の端部が閉塞する第１セルと、
    　前記軸方向に延在し、前記第２端面側の端部が開口し、前記第１端面側の端部が閉塞する第２セルと、を備え、
    　前記装置は、
    　前記第１端面側に、前記機能層の原料を含有するスラリーを供給するスラリー供給部と、
    　前記第１端面側に供給された前記スラリーを前記第２端面側から吸引し、前記第１セルの内壁に、前記第２端面に達しないスラリー層を形成するスラリー吸引部と、
    　前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第１端面側又は前記第２端面側に配置され、前記第１端面又は前記第２端面のうち、中央領域の少なくとも一部を被覆し、外縁領域の少なくとも一部を露出させる整流部材と、を備える、前記装置。     An apparatus for manufacturing a structure, comprising:
    The structure is
    an axially extending porous substrate;
    and a functional layer provided on the porous substrate,
    The porous substrate is
    a first end face positioned on one side in the axial direction;
    a second end face located on the other side in the axial direction;
    a first cell extending in the axial direction and having an open end on the first end surface side and a closed end on the second end surface side;
    a second cell extending in the axial direction, having an open end on the second end face side and a closed end on the first end face side;
    The device comprises:
    a slurry supply unit that supplies a slurry containing raw materials for the functional layer to the first end face side;
    a slurry suction part that sucks the slurry supplied to the first end face side from the second end face side and forms a slurry layer that does not reach the second end face on the inner wall of the first cell;
    When the slurry supplied to the first end face side is sucked from the second end face side, the slurry is arranged on the first end face side or the second end face side, a rectifying member that covers at least a portion of the central region and exposes at least a portion of the outer edge region.
  2. 　前記整流部材が、前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第１端面側又は前記第２端面側に配置され、前記中央領域の少なくとも一部を被覆し、前記外縁領域の少なくとも一部を露出させる整流板を備える、請求項１に記載の装置。 When the slurry supplied to the first end face side is sucked from the second end face side, the straightening member is arranged on the first end face side or the second end face side, and is at least part of the central region. and exposing at least a portion of the outer edge region.
  3. 　前記整流板が、前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第２端面側に前記第２端面から離間して配置される、請求項２に記載の装置。 3. The rectifying plate according to claim 2, wherein when the slurry supplied to the first end face side is sucked from the second end face side, the rectifying plate is arranged on the second end face side and spaced apart from the second end face side. Apparatus as described.
  4. 　前記整流板と前記第２端面との距離が５ｍｍ以上３０ｍｍ以下である、請求項３に記載の装置。 The device according to claim 3, wherein the distance between the current plate and the second end surface is 5 mm or more and 30 mm or less.
  5. 　前記整流板が、前記外縁領域の少なくとも一部を露出させる貫通孔を有する、請求項２～４のいずれか一項に記載の装置。 The device according to any one of claims 2 to 4, wherein the rectifying plate has a through hole that exposes at least part of the outer edge region.
  6. 　前記貫通孔が露出させる前記外縁領域の少なくとも一部の面積が、前記外縁領域の面積の５０％以上である、請求項５に記載の装置。 The device according to claim 5, wherein the area of at least part of the outer edge region exposed by the through-hole is 50% or more of the area of the outer edge region.
  7. 　前記整流板が被覆する前記中央領域の少なくとも一部の面積が、前記中央領域の面積の５０％以上である、請求項２～６のいずれか一項に記載の装置。 The device according to any one of claims 2 to 6, wherein the area of at least part of the central region covered by the current plate is 50% or more of the area of the central region.
  8. 　前記整流部材が、前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第２端面側に配置される第１整流板と、前記第１整流板に対して前記第２端面とは反対側に配置される第２整流板とを備え、
    　前記第１整流板が、前記外縁領域の少なくとも一部を露出させる第１貫通孔と、前記中央領域の少なくとも一部を露出させる第２貫通孔とを有し、
    　前記第２整流板が、前記第２貫通孔の少なくとも一部を被覆する、請求項１に記載の装置。     When the slurry supplied to the first end surface side is sucked from the second end surface side, the rectifying member is arranged against the first rectifying plate arranged on the second end surface side and the first rectifying plate and a second rectifying plate arranged on the opposite side of the second end face,
    the first current plate has a first through hole that exposes at least a portion of the outer edge region and a second through hole that exposes at least a portion of the central region;
    2. The apparatus according to claim 1, wherein said second current plate covers at least part of said second through hole.
  9. 　前記第１貫通孔が露出させる前記外縁領域の少なくとも一部の面積が、前記外縁領域の面積の５０％以上である、請求項８に記載の装置。 The device according to claim 8, wherein the area of at least part of the outer edge region exposed by the first through hole is 50% or more of the area of the outer edge region.
  10. 　前記第２貫通孔が露出させる前記中央領域の少なくとも一部の面積が、前記中央領域の面積の５０％以上である、請求項８又は９に記載の装置。 The device according to claim 8 or 9, wherein the area of at least part of the central region exposed by the second through-hole is 50% or more of the area of the central region.
  11. 　前記第２整流板が被覆する前記第２貫通孔の少なくとも一部の面積が、前記第２貫通孔の面積の５０％以上である、請求項８～１０のいずれか一項に記載の装置。 The device according to any one of claims 8 to 10, wherein the area of at least part of the second through holes covered by the second current plate is 50% or more of the area of the second through holes.
  12. 　前記第２整流板が前記第２貫通孔の一部を被覆するように、前記第２整流板に貫通孔が形成されている、請求項８～１１のいずれか一項に記載の装置。 The apparatus according to any one of claims 8 to 11, wherein a through hole is formed in said second straightening plate so that said second straightening plate partially covers said second through hole.
  13. 　前記第２整流板が被覆する前記第２貫通孔の一部の面積が、前記第２貫通孔の面積の５０％以上９０％以下である、請求項１２に記載の装置。 13. The device according to claim 12, wherein the area of the part of the second through hole covered by the second current plate is 50% or more and 90% or less of the area of the second through hole.
  14. 　前記第１整流板と前記第２端面との距離が５ｍｍ以上３０ｍｍ以下である、請求項８～１３のいずれか一項に記載の装置。 The device according to any one of claims 8 to 13, wherein the distance between the first current plate and the second end face is 5 mm or more and 30 mm or less.
  15. 　前記第１整流板と前記第２整流板との距離が５ｍｍ以上３０ｍｍ以下である、請求項８～１４のいずれか一項に記載の装置。 The device according to any one of claims 8 to 14, wherein the distance between the first straightening plate and the second straightening plate is 5 mm or more and 30 mm or less.
  16. 　前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記多孔質基材の外周面に沿って、前記整流部材に空気が流れ込む、請求項１～１５のいずれか一項に記載の装置。 16. Any one of claims 1 to 15, wherein when the slurry supplied to the first end face side is sucked from the second end face side, air flows into the straightening member along the outer peripheral surface of the porous base material. or a device according to claim 1.
  17. 　前記構造体が排ガス浄化用触媒又はその前駆体であり、前記機能層が触媒層又はその前駆層である、請求項１～１６のいずれか一項に記載の装置。 The device according to any one of claims 1 to 16, wherein the structure is an exhaust gas purifying catalyst or its precursor, and the functional layer is a catalyst layer or its precursor layer.
  18. 　構造体を製造する方法であって、
    　前記構造体は、
    　軸方向に延在する多孔質基材と、
    　前記多孔質基材に設けられた機能層と、を備え、
    　前記多孔質基材は、
    　前記軸方向の一方側に位置する第１端面と、
    　前記軸方向の他方側に位置する第２端面と、
    　前記軸方向に延在し、前記第１端面側の端部が開口し、前記第２端面側の端部が閉塞する第１セルと、
    　前記軸方向に延在し、前記第２端面側の端部が開口し、前記第１端面側の端部が閉塞する第２セルと、を備え、
    　前記方法は、以下の工程：
    （ａ）前記第１端面側に、前記機能層の原料を含有するスラリーを供給する工程；及び
    （ｂ）前記第１端面側に供給された前記スラリーを前記第２端面側から吸引し、前記第１セルの内壁に、前記第２端面に達しないスラリー層を形成する工程
    を含み、
    　工程（ｂ）において、前記第１端面側に供給された前記スラリーを前記第２端面側から吸引する際、前記第１端面又は前記第２端面のうち、中央領域の少なくとも一部を被覆し、外縁領域の少なくとも一部を露出させる整流部材が、前記第１端面側又は前記第２端面側に配置される、前記方法。     A method of manufacturing a structure, comprising:
    The structure is
    an axially extending porous substrate;
    and a functional layer provided on the porous substrate,
    The porous substrate is
    a first end face positioned on one side in the axial direction;
    a second end face located on the other side in the axial direction;
    a first cell extending in the axial direction and having an open end on the first end surface side and a closed end on the second end surface side;
    a second cell extending in the axial direction, having an open end on the second end face side and a closed end on the first end face side;
    The method comprises the steps of:
    (a) supplying a slurry containing raw materials for the functional layer to the first end face; and (b) sucking the slurry supplied to the first end face from the second end face, forming a slurry layer that does not reach the second end surface on the inner wall of the first cell;
    In step (b), when sucking the slurry supplied to the first end face side from the second end face side, covering at least part of a central region of the first end face or the second end face, The above method, wherein a rectifying member that exposes at least part of the outer edge region is arranged on the first end face side or the second end face side.
  19. 　前記整流部材が、前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第１端面側又は前記第２端面側に配置され、前記中央領域の少なくとも一部を被覆し、前記外縁領域の少なくとも一部を露出させる整流板を備える、請求項１８に記載の方法。 When the slurry supplied to the first end face side is sucked from the second end face side, the straightening member is arranged on the first end face side or the second end face side, and is at least part of the central region. and exposing at least a portion of the outer edge region.
  20. 　工程（ｂ）において、前記第１端面側に供給された前記スラリーを前記第２端面側から吸引する際、前記整流板が、前記第２端面側に前記第２端面から離間して配置される、請求項１９に記載の方法。 In the step (b), when the slurry supplied to the first end face side is sucked from the second end face side, the current plate is arranged on the second end face side and spaced apart from the second end face. 20. The method of claim 19.
  21. 　前記整流板と前記第２端面との距離が５ｍｍ以上３０ｍｍ以下である、請求項２０に記載の方法。 The method according to claim 20, wherein the distance between the current plate and the second end face is 5 mm or more and 30 mm or less.
  22. 　前記整流板が、前記外縁領域の少なくとも一部を露出させる貫通孔を有する、請求項１９～２１のいずれか一項に記載の方法。 The method according to any one of claims 19 to 21, wherein said rectifying plate has a through hole exposing at least part of said outer edge region.
  23. 　前記貫通孔が露出させる前記外縁領域の少なくとも一部の面積が、前記外縁領域の面積の５０％以上である、請求項２２に記載の方法。 The method according to claim 22, wherein the area of at least part of the outer edge region exposed by the through-hole is 50% or more of the area of the outer edge region.
  24. 　前記整流板が被覆する前記中央領域の少なくとも一部の面積が、前記中央領域の面積の５０％以上である、請求項１９～２３のいずれか一項に記載の方法。 The method according to any one of claims 19 to 23, wherein the area of at least part of the central region covered by the rectifying plate is 50% or more of the area of the central region.
  25. 　前記整流部材が、前記第１端面側に供給された前記スラリーが前記第２端面側から吸引される際、前記第２端面側に配置される第１整流板と、前記第１整流板に対して前記第２端面とは反対側に配置される第２整流板とを備え、
    　前記第１整流板が、前記外縁領域の少なくとも一部を露出させる第１貫通孔と、前記中央領域の少なくとも一部を露出させる第２貫通孔とを有し、
    　前記第２整流板が、前記第２貫通孔の少なくとも一部を被覆する、請求項１８に記載の方法。     When the slurry supplied to the first end surface side is sucked from the second end surface side, the rectifying member is arranged against the first rectifying plate arranged on the second end surface side and the first rectifying plate and a second rectifying plate arranged on the opposite side of the second end face,
    the first current plate has a first through hole that exposes at least a portion of the outer edge region and a second through hole that exposes at least a portion of the central region;
    19. The method of claim 18, wherein the second baffle covers at least part of the second through hole.
  26. 　前記第１貫通孔が露出させる前記外縁領域の少なくとも一部の面積が、前記外縁領域の面積の５０％以上である、請求項２５に記載の方法。 The method according to claim 25, wherein the area of at least part of the outer edge region exposed by the first through-hole is 50% or more of the area of the outer edge region.
  27. 　前記第２貫通孔が露出させる前記中央領域の少なくとも一部の面積が、前記中央領域の面積の５０％以上である、請求項２５又は２６に記載の方法。 The method according to claim 25 or 26, wherein the area of at least part of the central region exposed by the second through-hole is 50% or more of the area of the central region.
  28. 　前記第２整流板が被覆する前記第２貫通孔の少なくとも一部の面積が、前記第２貫通孔の面積の５０％以上である、請求項２５～２７のいずれか一項に記載の方法。 The method according to any one of claims 25 to 27, wherein the area of at least part of the second through holes covered by the second rectifying plate is 50% or more of the area of the second through holes.
  29. 　前記第２整流板が前記第２貫通孔の一部を被覆するように、前記第２整流板に貫通孔が形成されている、請求項２５～２８のいずれか一項に記載の方法。 The method according to any one of claims 25 to 28, wherein a through-hole is formed in said second straightening plate so that said second straightening plate partially covers said second through-hole.
  30. 　前記第２整流板が被覆する前記第２貫通孔の一部の面積が、前記第２貫通孔の面積の５０％以上９０％以下である、請求項２９に記載の方法。 The method according to claim 29, wherein the area of the part of the second through hole covered by the second current plate is 50% or more and 90% or less of the area of the second through hole.
  31. 　前記第１整流板と前記第２端面との距離が５ｍｍ以上３０ｍｍ以下である、請求項２５～３０のいずれか一項に記載の方法。 The method according to any one of claims 25 to 30, wherein the distance between the first current plate and the second end surface is 5 mm or more and 30 mm or less.
  32. 　前記第１整流板と前記第２整流板との距離が５ｍｍ以上３０ｍｍ以下である、請求項２５～３１のいずれか一項に記載の方法。 The method according to any one of claims 25 to 31, wherein the distance between the first straightening plate and the second straightening plate is 5 mm or more and 30 mm or less.
  33. 　工程（ｂ）において、前記第１端面側に供給された前記スラリーを前記第２端面側から吸引する際、前記多孔質基材の外周面に沿って、前記整流部材に空気が流れ込む、請求項１８～３２のいずれか一項に記載の方法。 2. The method of claim 1, wherein in the step (b), when the slurry supplied to the first end face side is sucked from the second end face side, air flows into the straightening member along the outer peripheral surface of the porous base material. 33. The method of any one of 18-32.
  34. 　前記構造体が排ガス浄化用触媒又はその前駆体であり、前記機能層が触媒層又はその前駆層である、請求項１８～３３のいずれか一項に記載の方法。 The method according to any one of claims 18 to 33, wherein the structure is an exhaust gas purifying catalyst or its precursor, and the functional layer is a catalyst layer or its precursor layer.
PCT/JP2022/012743 2021-03-18 2022-03-18 Apparatus and method for producing structure WO2022196806A1 (en)

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Citations (4)

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JP2009136833A (en) * 2007-12-10 2009-06-25 Toyota Motor Corp Method for producing monolithic catalyst for exhaust gas cleaning and monolithic catalyst
JP2015039672A (en) * 2013-08-22 2015-03-02 株式会社キャタラー Slurry supplying nozzle and production apparatus and production method of exhaust gas purifying catalyst using the same
WO2016143811A1 (en) * 2015-03-09 2016-09-15 株式会社キャタラー Catalyst slurry coating device
WO2018180090A1 (en) * 2017-03-31 2018-10-04 株式会社キャタラー Manufacturing method for exhaust gas purification device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009136833A (en) * 2007-12-10 2009-06-25 Toyota Motor Corp Method for producing monolithic catalyst for exhaust gas cleaning and monolithic catalyst
JP2015039672A (en) * 2013-08-22 2015-03-02 株式会社キャタラー Slurry supplying nozzle and production apparatus and production method of exhaust gas purifying catalyst using the same
WO2016143811A1 (en) * 2015-03-09 2016-09-15 株式会社キャタラー Catalyst slurry coating device
WO2018180090A1 (en) * 2017-03-31 2018-10-04 株式会社キャタラー Manufacturing method for exhaust gas purification device

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