WO2022184501A1 - Beschichten von nanodrähten - Google Patents
Beschichten von nanodrähten Download PDFInfo
- Publication number
- WO2022184501A1 WO2022184501A1 PCT/EP2022/054379 EP2022054379W WO2022184501A1 WO 2022184501 A1 WO2022184501 A1 WO 2022184501A1 EP 2022054379 W EP2022054379 W EP 2022054379W WO 2022184501 A1 WO2022184501 A1 WO 2022184501A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- nanowires
- coating
- component
- components
- substance
- Prior art date
Links
- 239000002070 nanowire Substances 0.000 title claims abstract description 166
- 238000000576 coating method Methods 0.000 title claims abstract description 88
- 239000011248 coating agent Substances 0.000 title claims abstract description 85
- 239000000126 substance Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 53
- 230000001681 protective effect Effects 0.000 claims abstract description 39
- 238000001035 drying Methods 0.000 claims abstract description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 2
- 238000011010 flushing procedure Methods 0.000 claims 1
- 230000002829 reductive effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 6
- 239000004922 lacquer Substances 0.000 description 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical class Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0547—Nanofibres or nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00841—Cleaning during or after manufacture
- B81C1/00849—Cleaning during or after manufacture during manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Definitions
- the invention relates to a method for applying a coating to a large number of nanowires on a component and a method for connecting two components via a large number of nanowires, which in particular can be coated according to the invention.
- nanowires with a protective lacquer after growth.
- the nanowires are temporarily protected with the protective lacquer until the nanowires are used for their intended purpose.
- the nanowires can be used to connect two components to one another.
- the protective lacquer encloses the nanowires in their entirety.
- the nanowires must be exposed. To do this, the protective coating must be chemically removed. This represents an additional procedural step and is unfavorable in this respect.
- a chemical is also required, which in particular can be liquid or gaseous. Liquid chemicals are generally undesirable in manufacturing environments. In addition, liquids can leave residues on the treated component. The use of gaseous chemicals requires the creation of an appropriate atmosphere, which is expensive.
- a method for applying a coating to a large number of nanowires on a component comprises: a) treating the nanowires with a reducing substance, b) immersing the nanowires in a protective substance, c) drying the nanowires so that the protective substance coating is obtained. Steps a), b) and c) are preferably carried out in the order given.
- the nanowires can be protected with the coating until the nanowires are used for their intended purpose.
- This can be the connection of the component on which the nanowires are located to another component.
- the method is also suitable for other applications.
- the coating obtained with the method can be removed particularly easily, in particular without the use of chemicals. In some applications, there is even no need to remove the coating.
- a nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers.
- a nanowire can, for example, have a circular, oval or polygonal base. In particular, a nanowire have a hexagonal base.
- the nanowires preferably have a length in the range from 100 nm [nanometers] to 100 m ⁇ ti [micrometers], in particular in the range from 500 nm to 60 m ⁇ ti. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 m ⁇ ti, in particular in the range from 30 nm to 2 m ⁇ ti.
- the term diameter refers to a circular base area, with a base area deviating from this, a comparable definition of a diameter is to be used. It is particularly preferred that all nanowires used have the same length and the same diameter.
- the method described can be used for a wide variety of nanowire materials. Electrically conductive materials, in particular metals such as copper, silver, gold, nickel, tin and platinum, are preferred as the material for the nanowires. However, non-conductive materials such as metal oxides are also preferred. Preferably, all nanowires are formed from the same material.
- the nanowires can have been obtained by galvanic growth on the component.
- the nanowires are preferably grown on an electrically conductive surface of the component. If the surface is part of an otherwise non-electrically conductive component, the electrical conductivity, e.g. e.g. tallization have been achieved. So e.g. B. a non-electrically conductive substrate may have been coated with a thin layer of metal to grow the nanowires onto the thin layer of metal.
- the nanowires are preferably perpendicular to the surface of the component.
- a respective first end of the nanowires is preferably connected to the surface of the component.
- a respective second end of the nanowires is preferably arranged at a distance from the surface.
- the process be applied to nanowires that lie on the surface of the component.
- the component can in particular be an electronic component.
- the component can be a substrate, a silicon chip or a so-called printed circuit board (PCB).
- PCB printed circuit board
- the method can also be applied to any other type of component.
- step a) the nanowires are treated with a reducing substance. Any chemical substance that has a reducing effect on the surface of the nanowires can be used as the reducing substance.
- step a) can also be formulated in such a way that a surface of the nanowires is reduced. This means a chemical reduction.
- oxides in particular are removed from the surface of the nanowires.
- the reducing substance can be liquid or gaseous.
- the reducing substance can be present as a vapor.
- the reducing substance is preferably an acid.
- the reducing substance can be formic acid, in particular formic acid vapor.
- the reducing substance may be liquid citric acid, forming acid, or hydrogen plasma.
- the treatment of the nanowires in step a) preferably takes place in that the nanowires are treated with the reducing substance.
- a liquid or gaseous reducing substance this can be done, for example, by spraying the nanowires with the liquid or gaseous reducing substance.
- the nanowires can be exposed to an atmosphere containing the reducing substance.
- the nanowires are immersed in a protective substance.
- the protective substance is preferably liquid. Any chemical substance that is deposited on the surface of the nanowires when the nanowires are immersed in the protective substance and from which a coating is formed on the nanowires as a result of drying can be considered as the protective substance.
- nanowires are dried. This can be done actively or passively.
- An active drying occurs when the nanowires are acted upon by a measure.
- the nanowires can be exposed to a gas flow and/or heated. Passive cooling occurs when the nanowires dry due to exposure to their environment without any specific measure being taken to dry the nanowires.
- a coating of the nanowires is obtained with the method described.
- a coating of the nanowires is to be understood as meaning a layer on the surface of the nanowires.
- the coating thus follows the shape of the nanowires.
- the nanowires coated with the coating represent a structure that also falls under the above definition of the term nanowire.
- the coating is formed in such a way that a free space is formed between the coating on adjacent ones of the nanowires.
- the nanowires are therefore spaced apart from one another despite the coating.
- a protective lacquer which encloses the nanowires in their entirety is therefore not a coating of the nanowires in the sense used here. Instead, such a protective lacquer would form a coating on the surface of the device in which the nanowires are encapsulated.
- the coating can be removed particularly easily when the nanowires are used for their intended purpose. No chemicals are required for this. To this extent, the disadvantages known from the prior art have been overcome. The fact that chemicals are required to form the protection is irrelevant. Thus, it is usually possible without difficulty to use chemicals to form a protection. Finally, protection is applied where the nanowires will also be grown. This requires the use of chemicals anyway.
- the problems described in the prior art relate to the fact that removing the protection by chemicals is disadvantageous. This is because the protection has to be removed where the nanowires go to their destination. Due to the process described, this can be a place where no chemicals can or should be used.
- the protective substance comprises an organic substance.
- preferred protective substances are: benzotriazole, imidazole, polyvinylpyrrolidone, benzimidazole, thiol-based substances or mercapto-benzimidazole.
- the protective substance comprises a metal.
- the metal is preferably a noble metal.
- the metal is preferably provided for step b) in the form of an immersion bath. This can be done by setting the temperature appropriately and/or by dissolving the metal in a solvent.
- the protective substance preferably comprises a solvent.
- the solvent can evaporate in step c). In this case, the coating is formed by the part of the protective substance that does not evaporate as a solvent.
- preferred protective substances are: silver and gold.
- the protective substance is selected, taking into account the material of the nanowires, in such a way that the protective substance is at least partially deposited on the nanowires by physiosorption in step b).
- step b) molecules and/or atoms from the protective substance are deposited on the surface of the nanowires by van der Waals forces.
- the protective substance in step b) is only partially deposited on the nanowires by physiosorption can result, for example, in that the protective substance contains a solvent and only the remaining portions of the protective substance are deposited on the surface of the nanowires.
- the coating formed on the nanowires by steps a) to c) has an average Thickness of no more than 20 atomic or molecular layers, in particular no more than 10 atomic or molecular layers.
- the coating can remain on the nanowires when the nanowires are used for their intended purpose.
- the component with the nanowires can be connected to another component via the large number of nanowires without having to remove the coating.
- the connection can be formed via the coating between the nanowires and a surface of the additional component or via the coating between the nanowires and nanowires on the surface of the additional component.
- the nanowires on the surface of the further component are preferably also coated, so that the connection between the coatings is formed.
- the coating can easily be removed mechanically, for example by the nanowires coming into contact with the surface of the further component or with nanowires thereon.
- the coating can also be decomposed by heating.
- a coating with the low thickness described can be obtained by steps a) to c).
- the strength is influenced in particular by the material of the nanowires, the chemical composition of the reducing substance used in step a), the chemical composition of the protective substance used in step b), in particular the concentration of the reducing substance, and by process parameters such as the duration of the steps a), b) and c) or temperature of the nanowires during steps a), b) and c). Experiments can be used to determine how these factors are to be selected for a desired thickness of the coating.
- the coating is formed from atoms, the coating has an average thickness of at most 20 atomic layers, in particular at most 10 atomic layers. If the coating is formed from molecules, the coating has an average thickness of at most 20 molecular layers, in particular at most 10 molecular layers.
- the component is rinsed with a rinsing fluid between steps a) and b) and/or between steps b) and c).
- a rinsing fluid between steps a) and b) and/or between steps b) and c).
- the "and" case is preferred.
- a particularly thin coating can be obtained by rinsing.
- a solvent such as water is particularly suitable as the rinsing fluid.
- a method of connecting two devices via a plurality of nanowires includes:
- Steps A) and B) are carried out in the order given.
- step B) immediately follows step A).
- the coating is not removed between steps A) and B).
- the coating is removed at most in step B) by bringing the components together or in a step following step B). It is therefore preferred that the coating is still present at the start of step B).
- connection is formed over a particularly large contact area.
- a particularly mechanically stable, electrically conductive and/or thermally conductive connection can be obtained.
- the nanowires are provided on one of the two components.
- step B the nanowires on a first of the components come into contact with the surface of a second of the components via the coating.
- the coating remains between the nanowires and the surface of the second component.
- the coating can be removed in places or completely by bringing the two components together or by a subsequent process step. As far as the coating is removed, there is direct contact between the nanowires and the surface of the second component. Whether and to what extent the coating is removed when the two components are brought together can depend on the thickness of the coating, the material of the coating, the material of the surface of the second component and/or the material of the nanowires.
- a multiplicity of nanowires can be provided on each of the two components.
- the nanowires are preferably coated with a respective coating on both components.
- step B) the nanowires on a first component come into contact with the nanowires on the second component via the respective coating. If the nanowires are coated on both components, there is contact between the coating and the coating. The coatings can remain between the nanowires.
- the coatings can be removed in places or completely by bringing the two components together or in a subsequent process step. As far as the coating is removed, there is direct contact between the nanowires. Whether and to what extent the coating is removed when the two components are brought together can depend on the thickness of the coating, the material of the coating, the material of the surface of the second component and/or the material of the nanowires.
- the coating in step A) is obtained using the method described for applying a coating to a multiplicity of nanowires on a component.
- the previously described method for applying a coating to a large number of nanowires on a component is applied to the nanowires on this component. If the nanowires are provided on both components in step A), the previously described method for applying a coating to a large number of nanowires on one component is applied to the nanowires on the two components.
- the connection between the two components can already be formed at room temperature. This applies in particular if the nanowires are provided on both components.
- the method further comprises:
- Step C) is preferably carried out after step B).
- the coating can be partially, preferably completely, removed by heating.
- the heating preferably takes place at a temperature of at least 90.degree. C., in particular at a temperature in the range from 90 to 150.degree.
- the heating is particularly preferred in the case that the nanowires in step A) are only provided on one of the two components.
- the heating preferably takes place at a temperature of at least 170°C, in particular at a temperature in the range from 170 to 230°C.
- the heating allows the nanowires on the first component to bond particularly well to the surface of the second component.
- the nanowires can connect to one another in such a way that the nanowires can then no longer be identified as such.
- Fig. 2 the result of a first embodiment of an inventive
- Fig. 3 the result of a second embodiment of an inventive
- the coating 2 was obtained using the following method: a) treating the nanowires 1 with a reducing substance, b) immersing the nanowires 1 in a protective substance, c) drying the nanowires 1 so that the coating 2 of the protective substance is obtained.
- the protective substance may comprise an organic substance and/or a metal.
- the protective substance was selected taking into account the material of the nanowires 1 in such a way that the protective substance is at least partially deposited on the nanowires 1 by physiosorption in step b).
- the coating 2 formed by steps a) to c) has an average thickness of at most 20 atomic or molecular layers on the nanowires 1 .
- the component 4 is rinsed with a rinsing fluid between steps a) and b) and between steps b) and c).
- Assembly 3 was obtained using a process that includes:
- the coating 2 has been partially preserved in step B) in such a way that adjacent nanowires 1 are connected to one another via the coating 2 .
- the coating 2 between the nanowires 1 has broken open in places. This is caused by the merging of the components 4.5.
- the nanowires 1 hold together particularly well at the broken points.
- the figures are only schematic.
- the coating 2 is shown relatively thick for purposes of illustration. 3 shows a further arrangement 3 with a first component 4 and a second component 5.
- the two components 4, 5 are connected to one another via a multiplicity of nanowires 1.
- the nanowires 1 here have no coating 2 but are directly connected to one another. This can be obtained by the method described for FIG. 2 also comprising the following step: C) removing the coating 2 of the nanowires 1 by heating.
- Step C) can be used to obtain the arrangement 3 shown in FIG. 3 from the arrangement 3 shown in FIG. Due to the heating, the material of the nanowires diffuses in such a way that they also connect to each other. This results in the situation shown in FIG. 3, in which the nanowires 1 are shown in simplified form as a single layer of material. Nonetheless, the two components 4 , 5 are to be regarded as being connected to one another via the multiplicity of nanowires 1 .
- a further arrangement 3 is shown in FIG. This was obtained using a method which comprises: A) providing a multiplicity of nanowires 1 with a coating 2 on the first component 4, but not on the second component 5
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Powder Metallurgy (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280018521.2A CN117015450A (zh) | 2021-03-03 | 2022-02-22 | 纳米丝涂层 |
EP22710528.5A EP4301533A1 (de) | 2021-03-03 | 2022-02-22 | Beschichten von nanodrähten |
JP2023553552A JP2024512329A (ja) | 2021-03-03 | 2022-02-22 | ナノワイヤの被覆 |
KR1020237033074A KR20230154899A (ko) | 2021-03-03 | 2022-02-22 | 나노와이어들의 코팅 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021105129.0 | 2021-03-03 | ||
DE102021105129.0A DE102021105129A1 (de) | 2021-03-03 | 2021-03-03 | Beschichten von Nanodrähten |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022184501A1 true WO2022184501A1 (de) | 2022-09-09 |
Family
ID=80780955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2022/054379 WO2022184501A1 (de) | 2021-03-03 | 2022-02-22 | Beschichten von nanodrähten |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP4301533A1 (de) |
JP (1) | JP2024512329A (de) |
KR (1) | KR20230154899A (de) |
CN (1) | CN117015450A (de) |
DE (1) | DE102021105129A1 (de) |
TW (1) | TW202235364A (de) |
WO (1) | WO2022184501A1 (de) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160251769A1 (en) * | 2015-02-26 | 2016-09-01 | Northrop Grumman Systems Corporation | Thermal interface materials using metal nanowire arrays and sacrificial templates |
DE102017104921A1 (de) * | 2017-03-08 | 2018-09-13 | Olav Birlem | Verbindung von thermischen Leitern |
US20190148321A1 (en) * | 2017-11-14 | 2019-05-16 | Vuereal Inc. | Integration and bonding of micro-devices into system substrate |
US20200279821A1 (en) * | 2019-03-01 | 2020-09-03 | Invensas Corporation | Nanowire bonding interconnect for fine-pitch microelectronics |
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US8734929B2 (en) | 2008-08-25 | 2014-05-27 | Snu R&Db Foundation | Hydrophobic composites and methods of making the same |
US8187887B2 (en) | 2009-10-06 | 2012-05-29 | Massachusetts Institute Of Technology | Method and apparatus for determining radiation |
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2021
- 2021-03-03 DE DE102021105129.0A patent/DE102021105129A1/de active Pending
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2022
- 2022-02-17 TW TW111105840A patent/TW202235364A/zh unknown
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- 2022-02-22 CN CN202280018521.2A patent/CN117015450A/zh active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
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US20160251769A1 (en) * | 2015-02-26 | 2016-09-01 | Northrop Grumman Systems Corporation | Thermal interface materials using metal nanowire arrays and sacrificial templates |
DE102017104921A1 (de) * | 2017-03-08 | 2018-09-13 | Olav Birlem | Verbindung von thermischen Leitern |
US20190148321A1 (en) * | 2017-11-14 | 2019-05-16 | Vuereal Inc. | Integration and bonding of micro-devices into system substrate |
US20200279821A1 (en) * | 2019-03-01 | 2020-09-03 | Invensas Corporation | Nanowire bonding interconnect for fine-pitch microelectronics |
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CN117015450A (zh) | 2023-11-07 |
EP4301533A1 (de) | 2024-01-10 |
JP2024512329A (ja) | 2024-03-19 |
TW202235364A (zh) | 2022-09-16 |
DE102021105129A1 (de) | 2022-09-08 |
KR20230154899A (ko) | 2023-11-09 |
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