WO2022182167A3 - 엘이디 조명 장치 및 그 제조 방법 - Google Patents

엘이디 조명 장치 및 그 제조 방법 Download PDF

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Publication number
WO2022182167A3
WO2022182167A3 PCT/KR2022/002718 KR2022002718W WO2022182167A3 WO 2022182167 A3 WO2022182167 A3 WO 2022182167A3 KR 2022002718 W KR2022002718 W KR 2022002718W WO 2022182167 A3 WO2022182167 A3 WO 2022182167A3
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WO
WIPO (PCT)
Prior art keywords
leds
separation layer
lighting device
led lighting
manufacturing same
Prior art date
Application number
PCT/KR2022/002718
Other languages
English (en)
French (fr)
Other versions
WO2022182167A2 (ko
Inventor
김병인
금동기
이진
Original Assignee
동우 화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동우 화인켐 주식회사 filed Critical 동우 화인켐 주식회사
Priority to US18/278,297 priority Critical patent/US20240128304A1/en
Priority to CN202280015451.5A priority patent/CN116917660A/zh
Publication of WO2022182167A2 publication Critical patent/WO2022182167A2/ko
Publication of WO2022182167A3 publication Critical patent/WO2022182167A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

LED 조명 장치의 제조 방법은 기판 상에 분리막을 형성하는 단계, 분리막을 패터닝하는 단계, 분리막 상에 LED를 각각 형성하는 단계, LED의 상면 및 이격 공간에 연신 필름을 결합하는 단계, 분리막을 기판에서 분리하는 단계, 연신 필름을 연신하는 단계, LED의 상면을 노출하는 단계, LED의 상면, 그리고 분리막의 하면 또는 LED의 하면에 전극을 형성하는 단계를 포함한다.
PCT/KR2022/002718 2021-02-25 2022-02-24 엘이디 조명 장치 및 그 제조 방법 WO2022182167A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US18/278,297 US20240128304A1 (en) 2021-02-25 2022-02-24 Led lighting device and method for manufacturing the same
CN202280015451.5A CN116917660A (zh) 2021-02-25 2022-02-24 Led照明装置及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0025366 2021-02-25
KR20210025366 2021-02-25

Publications (2)

Publication Number Publication Date
WO2022182167A2 WO2022182167A2 (ko) 2022-09-01
WO2022182167A3 true WO2022182167A3 (ko) 2022-11-24

Family

ID=83049523

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/002718 WO2022182167A2 (ko) 2021-02-25 2022-02-24 엘이디 조명 장치 및 그 제조 방법

Country Status (4)

Country Link
US (1) US20240128304A1 (ko)
KR (1) KR102600031B1 (ko)
CN (1) CN116917660A (ko)
WO (1) WO2022182167A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120083714A (ko) * 2011-01-18 2012-07-26 삼성엘이디 주식회사 발광칩에 형광층 도포 방법
KR20140076485A (ko) * 2012-11-30 2014-06-20 주식회사 엘지화학 플렉서블 기판을 포함하는 유기 발광 소자 및 이의 제조방법
KR20180050189A (ko) * 2016-11-04 2018-05-14 주식회사 가온인터내셔널 그래핀을 이용한 oled(organic light emitting diode) 제작 방법
KR20180067068A (ko) * 2016-12-12 2018-06-20 동우 화인켐 주식회사 유기발광다이오드 제조방법
KR20200042584A (ko) * 2018-10-15 2020-04-24 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101689663B1 (ko) * 2010-09-16 2017-01-09 삼성전자 주식회사 그래핀을 이용한 양자점 발광소자
KR102227086B1 (ko) * 2014-03-05 2021-03-12 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
WO2018003602A1 (ja) * 2016-06-28 2018-01-04 リンテック株式会社 整列治具、整列方法及び転着方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120083714A (ko) * 2011-01-18 2012-07-26 삼성엘이디 주식회사 발광칩에 형광층 도포 방법
KR20140076485A (ko) * 2012-11-30 2014-06-20 주식회사 엘지화학 플렉서블 기판을 포함하는 유기 발광 소자 및 이의 제조방법
KR20180050189A (ko) * 2016-11-04 2018-05-14 주식회사 가온인터내셔널 그래핀을 이용한 oled(organic light emitting diode) 제작 방법
KR20180067068A (ko) * 2016-12-12 2018-06-20 동우 화인켐 주식회사 유기발광다이오드 제조방법
KR20200042584A (ko) * 2018-10-15 2020-04-24 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법

Also Published As

Publication number Publication date
KR20220121733A (ko) 2022-09-01
KR102600031B1 (ko) 2023-11-08
US20240128304A1 (en) 2024-04-18
WO2022182167A2 (ko) 2022-09-01
CN116917660A (zh) 2023-10-20

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