WO2022159047A1 - Improving adhesion force of metalization onto the alumina surface for a quasi-yagi antenna radiation performance - Google Patents
Improving adhesion force of metalization onto the alumina surface for a quasi-yagi antenna radiation performance Download PDFInfo
- Publication number
- WO2022159047A1 WO2022159047A1 PCT/TR2021/050052 TR2021050052W WO2022159047A1 WO 2022159047 A1 WO2022159047 A1 WO 2022159047A1 TR 2021050052 W TR2021050052 W TR 2021050052W WO 2022159047 A1 WO2022159047 A1 WO 2022159047A1
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- WO
- WIPO (PCT)
- Prior art keywords
- yagi antenna
- layer
- quasi
- substrate
- antenna according
- Prior art date
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims description 19
- 238000001465 metallisation Methods 0.000 title description 8
- 230000005855 radiation Effects 0.000 title description 6
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052737 gold Inorganic materials 0.000 claims abstract description 13
- 239000010931 gold Substances 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 6
- 239000012790 adhesive layer Substances 0.000 claims abstract description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 3
- 230000001143 conditioned effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 238000009832 plasma treatment Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002203 pretreatment Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/28—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements
- H01Q19/30—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
Definitions
- the present disclosure relates to a broadband quasi-Yagi antenna with a ceramic substrate, a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer, providing high heat dissipation and low loss.
- Quasi-Yagi antennas have been widely used for wireless communications for their properties such as low-cost, easy fabrication process, compact size, lightweight and end fire radiation pattern.
- a conventional Yagi-Uda antenna consists of a dipole driver in the center, a single reflector on one side, one or more directors on the other side and a feeding structure. There is always a tradeoff between the gain and bandwidth, with the bandwidth narrowing as more elements are used. To obtain a high gain ( ⁇ 6.5dBi), the typical bandwidth of a conventional quasi-Yagi antenna is relatively narrow (10-20% for VSWR ⁇ 2), limiting their applications for broadband wireless communications. A wider bandwidth (40-50% for VSWR ⁇ 2) can be achieved at the cost of reduced gain.
- Heat dissipation in small spaces can cause problems for antenna applications with high temperature.
- Fans, cooler gels etc. are used for removing heat from antenna.
- Substrate materials have also specific heat and dissipation capacities that determine heat absorbing and dissipating level of the material. Therefore, many different materials are used as a substrate in Yagi antenna applications. Some of them provides high gain in bandwidths out of broadband with low heat dissipation. On the other hand, high temperature may adversely affect, including stopping or causing them to draw excessive current, integrated circuits and chips in antenna system.
- the application numbered WO2016155393A1 offers a dielectric antenna element, such as Yagi, for emitting or receiving radio frequencies.
- the dielectric antenna element includes a substrate, a microstrip element supported by the substrate, and at one first dielectric superstrate disposed over the substrate and spaced apart from the substrate.
- this structure has similar flaws explained above such as high temperature, stopping working risk etc. On the other hand, side lobe signals cannot be avoided with this structure. Summary
- the invention aims to offer a broadband quasi-Yagi antenna with high heat dissipation and low loss, comprising a ceramic substrate, a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer. Side lobe signals are avoided thanks to the adhesive layer sputtered on the substrate.
- the antenna can be made by a both side printed circuit with simple structure with thin film manufacturing technology. To give the ground perfectly or that would have nano-air gaps at the bottom side of metallization, to give up the air gaps between on the surface and the first metal layer is a very significant factor for the antenna radiation.
- Ar plasma cleaning proves to be the most effective pre-treatment and it can improve the bond strength by almost more than two times compared to no pre-treatment. This can be attributed to an increase in surface area/roughness for better interlocking at the TiW-alumina interface as well as an effective contamination removal on alumina surface.
- the most significant point is Ar plasma treatment conditioned at 220W RF Power for indicated duration (300 sec) for %30 Argon gas flow.
- ceramic substrate is an Alumina (AI2O3), in other words Aluminum oxide, one of the most cost effective and widely used material in the family of engineering ceramics.
- Figure 1 shows the measured simulated and measured return loss of four-element array and measure total gain of four-element array respectively.
- Figure 2 shows the graphical results for adhesive force measurements results
- Figure 3 shows the progressive load scratch test scanning electron microscope results
- Figure 4a and 4b show air gaps between metallization and alumina ceramic surface view in scanning electron microscope .
- Figure 4a shows one side cross view of no plasma alumina wafer and top metallization (Titanium Tungsten-50nm -Gold-5um).
- Figure 4b shows one side cross view of high level plasma alumina wafer and top metallization (Titanium Tungsten-50nm -Gold-5um).
- Figure 5 shows after plasma Condition the metallization view on the alumina substrate (Atomic Force Microscope). Detailed Description
- TiW Titanium Tungsten
- TiW Titanium Tungsten
- the thicknesses of Titanium Tungsten and gold are approximately 50nm and 4um respectively.
- Tantalum Nitride (TaN) is used with thickness 150 nm approximately.
- This production method is a special technique that helps to produce lines and devices with sensitivity of 500nm by using devices such as sputter coater, argon plasma for the minimum width of the whole structure drawings while working on the ceramic wafers. These are the reasons for using thin film technology.
- the current design consists of two director elements.
- additional elements are used for improving gain or bandwidth.
- this also increases the number of design parameters as well as the complexity of design optimization and additional spaces that is the most significant parameter for thin ceramic substrates.
- Additional directors provide more gain for the system however on the understanding that bandwidth.
- a simple equal amplitude four-element linear array is used to supply maximum gain requirements. Total producible area of one ceramic substrate is 80mm by 80mm so this is the restriction. One array antenna has been designed only for one phase the results are calculated. Measuring and simulated results were compared between. Each element and the divider designed and fabricated onto the same substrate, Alumina AI2O3. The measured S parameters of the structure are shown in Figure 1 .
- antenna printed on a ceramic substrate has great advantages.
- the great radiation properties and compact size of this antenna make it ideal.
- a single quasi Yagi antenna and four-element array are fabricated on an Alumina substrate.
- the final size of the antenna array is 75mm x 30mm with the thickness is about 0.635mm.
- the antenna can be made by a both side printed circuit with simple structure with thin film manufacturing technology.
- the number of array elements can be increased and controlled all the phases in the radar applications.
- Ar plasma cleaning proves to be more effective pre-treatment and it can improve the bond strength by almost more than two times compared to no pre-treatment. This can be attributed to an increase in surface area/roughness for better interlocking at the TiW-alumina interface as well as an effective contamination removal on alumina surface.
- the differences between plasma condition and no plasma conditions are shown in Figure 4a and 4b.
Landscapes
- Aerials With Secondary Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present disclosure relates to a broadband quasi-Yagi antenna with a ceramic substrate, a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer, providing high heat dissipation and low loss. On the other hand, side lobe signals are avoided thanks to decrease the air gaps under the adhesive layer sputtered on the substrate. To improve adhesive force between the substrate and the adhesive layer, Ar plasma is applied.
Description
IMPROVING ADHESION FORCE OF METALIZATION ONTO THE ALUMINA SURFACE FOR A QUASI-YAGI ANTENNA RADIATION PERFORMANCE
Technical Field
The present disclosure relates to a broadband quasi-Yagi antenna with a ceramic substrate, a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer, providing high heat dissipation and low loss.
Background
Quasi-Yagi antennas have been widely used for wireless communications for their properties such as low-cost, easy fabrication process, compact size, lightweight and end fire radiation pattern. A conventional Yagi-Uda antenna consists of a dipole driver in the center, a single reflector on one side, one or more directors on the other side and a feeding structure. There is always a tradeoff between the gain and bandwidth, with the bandwidth narrowing as more elements are used. To obtain a high gain (~6.5dBi), the typical bandwidth of a conventional quasi-Yagi antenna is relatively narrow (10-20% for VSWR<2), limiting their applications for broadband wireless communications. A wider bandwidth (40-50% for VSWR<2) can be achieved at the cost of reduced gain.
Heat dissipation in small spaces can cause problems for antenna applications with high temperature. Fans, cooler gels etc. are used for removing heat from antenna. Substrate materials have also specific heat and dissipation capacities that determine heat absorbing and dissipating level of the material. Therefore, many different materials are used as a substrate in Yagi antenna applications. Some of them provides high gain in bandwidths out of broadband with low heat dissipation. On the other hand, high temperature may adversely affect, including stopping or causing them to draw excessive current, integrated circuits and chips in antenna system.
The application numbered WO2016155393A1 offers a dielectric antenna element, such as Yagi, for emitting or receiving radio frequencies. In an embodiment the dielectric antenna element includes a substrate, a microstrip element supported by the substrate, and at one first dielectric superstrate disposed over the substrate and spaced apart from the substrate. However, this structure has similar flaws explained above such as high temperature, stopping working risk etc. On the other hand, side lobe signals cannot be avoided with this structure.
Summary
The invention aims to offer a broadband quasi-Yagi antenna with high heat dissipation and low loss, comprising a ceramic substrate, a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer. Side lobe signals are avoided thanks to the adhesive layer sputtered on the substrate. After improving the surface metallization adhesion, the antenna can be made by a both side printed circuit with simple structure with thin film manufacturing technology. To give the ground perfectly or that would have nano-air gaps at the bottom side of metallization, to give up the air gaps between on the surface and the first metal layer is a very significant factor for the antenna radiation.
Ar plasma cleaning proves to be the most effective pre-treatment and it can improve the bond strength by almost more than two times compared to no pre-treatment. This can be attributed to an increase in surface area/roughness for better interlocking at the TiW-alumina interface as well as an effective contamination removal on alumina surface. The most significant point is Ar plasma treatment conditioned at 220W RF Power for indicated duration (300 sec) for %30 Argon gas flow.
In a preferred embodiment, ceramic substrate is an Alumina (AI2O3), in other words Aluminum oxide, one of the most cost effective and widely used material in the family of engineering ceramics.
Brief Description of the Drawings
Figure 1 shows the measured simulated and measured return loss of four-element array and measure total gain of four-element array respectively.
Figure 2 shows the graphical results for adhesive force measurements results
Figure 3 shows the progressive load scratch test scanning electron microscope results
Figure 4a and 4b show air gaps between metallization and alumina ceramic surface view in scanning electron microscope .
Figure 4a shows one side cross view of no plasma alumina wafer and top metallization (Titanium Tungsten-50nm -Gold-5um).
Figure 4b shows one side cross view of high level plasma alumina wafer and top metallization (Titanium Tungsten-50nm -Gold-5um).
Figure 5 shows after plasma Condition the metallization view on the alumina substrate (Atomic Force Microscope).
Detailed Description
The detailed information is presented on the design and performance of a broadband quasi- Yagi antenna onto the ceramic Alumina (AI2O3 - %99,6) including a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer, which provides availability in high temperature applications and compact size. Broad bandwidth (measured 52% for VSWR < 2), good radiation profile (front-to-back ratio >12db) and total gain (4-5 dbi) have been achieved with a single antenna element. It should be noted the qualities are maintained across the entire bandwidth. In addition, the mutual coupling characteristics of the quasi-Yagi elements in the array is observed to be very low.
A thin layer of sputtered Titanium Tungsten (TiW) is used as an adhesive interlayer between gold and alumina in thin film application. The thicknesses of Titanium Tungsten and gold are approximately 50nm and 4um respectively. For the resistor layer, Tantalum Nitride (TaN) is used with thickness 150 nm approximately. This production method is a special technique that helps to produce lines and devices with sensitivity of 500nm by using devices such as sputter coater, argon plasma for the minimum width of the whole structure drawings while working on the ceramic wafers. These are the reasons for using thin film technology.
The current design consists of two director elements. In preferred embodiments, additional elements are used for improving gain or bandwidth. However, this also increases the number of design parameters as well as the complexity of design optimization and additional spaces that is the most significant parameter for thin ceramic substrates. Additional directors provide more gain for the system however on the understanding that bandwidth.
A simple equal amplitude four-element linear array is used to supply maximum gain requirements. Total producible area of one ceramic substrate is 80mm by 80mm so this is the restriction. One array antenna has been designed only for one phase the results are calculated. Measuring and simulated results were compared between. Each element and the divider designed and fabricated onto the same substrate, Alumina AI2O3. The measured S parameters of the structure are shown in Figure 1 .
In a light weight planar design and performance at high temperature applications antenna printed on a ceramic substrate has great advantages. The great radiation properties and compact size of this antenna make it ideal. A single quasi Yagi antenna and four-element array are fabricated on an Alumina substrate. The final size of the antenna array is 75mm x 30mm with the thickness is about 0.635mm. The antenna can be made by a both side printed circuit
with simple structure with thin film manufacturing technology. The number of array elements can be increased and controlled all the phases in the radar applications.
Significantly, Ar plasma cleaning proves to be more effective pre-treatment and it can improve the bond strength by almost more than two times compared to no pre-treatment. This can be attributed to an increase in surface area/roughness for better interlocking at the TiW-alumina interface as well as an effective contamination removal on alumina surface. The differences between plasma condition and no plasma conditions are shown in Figure 4a and 4b.
Claims
CLAIMS A broadband quasi-Yagi antenna with high heat dissipation and low loss, comprising; a ceramic substrate, a gold layer and a layer of adhesive used between the ceramic substrate and the gold layer, wherein Ar plasma is applied to improve adhesive force between the substrate and the adhesive layer. The broadband quasi-Yagi antenna according to claim 1 , wherein Ar plasma treatment conditioned at 220W RF Power for 300 seconds for %30 Argon gas flow. The broadband quasi-Yagi antenna according to claim 1 , wherein the thickness of gold is 4um. The broadband quasi-Yagi antenna according to claim 1 , wherein the ceramic substrate is made of alumina. The broadband quasi-Yagi antenna according to claim 1 , wherein a layer of sputtered titanium tungsten used as the adhesive. The broadband quasi-Yagi antenna according to claim 5, wherein the thickness of titanium tungsten is 50nm. The broadband quasi-Yagi antenna according to claim 1 , comprising tantalum nitride used as a resistor layer. The broadband quasi-Yagi antenna according to claim 7, wherein the thickness of tantalum nitride is 150nm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/TR2021/050052 WO2022159047A1 (en) | 2021-01-22 | 2021-01-22 | Improving adhesion force of metalization onto the alumina surface for a quasi-yagi antenna radiation performance |
| DE112021006901.2T DE112021006901T5 (en) | 2021-01-22 | 2021-01-22 | IMPROVEMENT OF THE ADHESION OF A METALLIZATION ON THE ALUMINUM OXIDE SURFACE FOR THE RADIATION POWER OF A QUASI-YAGI ANTENNA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/TR2021/050052 WO2022159047A1 (en) | 2021-01-22 | 2021-01-22 | Improving adhesion force of metalization onto the alumina surface for a quasi-yagi antenna radiation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022159047A1 true WO2022159047A1 (en) | 2022-07-28 |
Family
ID=82549963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/TR2021/050052 WO2022159047A1 (en) | 2021-01-22 | 2021-01-22 | Improving adhesion force of metalization onto the alumina surface for a quasi-yagi antenna radiation performance |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE112021006901T5 (en) |
| WO (1) | WO2022159047A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1962408A2 (en) * | 2006-11-16 | 2008-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Radio field intensity measurement device, and radio field intensity detector and game console using the same |
| CN202772258U (en) * | 2012-07-20 | 2013-03-06 | 齐齐哈尔大学 | Ultra-wideband Quari-Yagi antenna |
| WO2020251481A1 (en) * | 2019-06-14 | 2020-12-17 | Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ | A substrate for broadband quasi-yagi antenna |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160294068A1 (en) | 2015-03-30 | 2016-10-06 | Huawei Technologies Canada Co., Ltd. | Dielectric Resonator Antenna Element |
-
2021
- 2021-01-22 DE DE112021006901.2T patent/DE112021006901T5/en active Pending
- 2021-01-22 WO PCT/TR2021/050052 patent/WO2022159047A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1962408A2 (en) * | 2006-11-16 | 2008-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Radio field intensity measurement device, and radio field intensity detector and game console using the same |
| CN202772258U (en) * | 2012-07-20 | 2013-03-06 | 齐齐哈尔大学 | Ultra-wideband Quari-Yagi antenna |
| WO2020251481A1 (en) * | 2019-06-14 | 2020-12-17 | Aselsan Elektroni̇k Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ | A substrate for broadband quasi-yagi antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021006901T5 (en) | 2023-12-14 |
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