WO2022111133A1 - Barometric pressure sensor assembly and packaging method therefor - Google Patents

Barometric pressure sensor assembly and packaging method therefor Download PDF

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Publication number
WO2022111133A1
WO2022111133A1 PCT/CN2021/124546 CN2021124546W WO2022111133A1 WO 2022111133 A1 WO2022111133 A1 WO 2022111133A1 CN 2021124546 W CN2021124546 W CN 2021124546W WO 2022111133 A1 WO2022111133 A1 WO 2022111133A1
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WO
WIPO (PCT)
Prior art keywords
air pressure
pressure sensor
sensor chip
chip
substrate
Prior art date
Application number
PCT/CN2021/124546
Other languages
French (fr)
Chinese (zh)
Inventor
李向光
方华斌
田峻瑜
Original Assignee
潍坊歌尔微电子有限公司
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Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2022111133A1 publication Critical patent/WO2022111133A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits

Definitions

  • the present application relates to the technical field of sensors, and in particular, to an air pressure sensing component and a packaging method thereof.
  • Air pressure (differential pressure, gauge pressure) sensors have been widely used in medical, industrial and other fields, and some wearable products have also begun to use this product for health monitoring (such as blood pressure measurement).
  • health monitoring such as blood pressure measurement.
  • the main purpose of the present application is to provide an air pressure sensing assembly and a packaging method thereof, aiming to obtain an air pressure sensing assembly that is resistant to environmental corrosion and high-speed impact.
  • an air pressure sensing assembly comprising:
  • the substrate is provided with air holes;
  • an air pressure sensor chip mounted on the substrate and disposed corresponding to the air hole, the side of the air pressure sensor chip facing the air hole is the first side, and the side away from the air hole is the second side;
  • first side and the second side are provided with encapsulant.
  • the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensor chip;
  • the gap between the air pressure sensor chip and the casing is filled with encapsulant.
  • the air pressure sensor chip includes:
  • a support enclosure is arranged on the side of the chip main body facing the air hole, and is supported on the substrate and is arranged around the air hole, the support enclosure and the chip main body define a relationship with the air hole.
  • the air holes are opposite and communicate with each other in a cavity, and the cavity is filled with the packaging glue.
  • the encapsulant is silicone gel.
  • an ASIC chip is further mounted on the substrate, and the ASIC chip is electrically connected to the air pressure sensor chip and the substrate.
  • the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensor chip;
  • the gap between the air pressure sensor chip and the housing is filled with encapsulant
  • An ASIC chip is also mounted on the substrate, and the ASIC chip is arranged in the casing and wrapped by the encapsulant.
  • the present application provides a packaging method for an air pressure sensing component, comprising the following steps:
  • an air pressure sensor chip is provided, the air pressure sensor chip has a first side and a second side, and an encapsulant is provided on the first side of the air pressure sensor chip;
  • the substrate is provided with air holes
  • An encapsulant is provided on the second side of the air pressure sensor chip.
  • the air pressure sensor chip includes a chip body and a support enclosure, the support enclosure is disposed on a side of the chip body facing the air hole, and the support enclosure is defined by the chip body. Outgoing a cavity opposite and communicating with the air hole;
  • the step of disposing the encapsulant on the first side of the air pressure sensor chip includes:
  • a first UV film is provided, and the adhesive side of the first UV film is set up;
  • Vacuum defoaming is performed on the encapsulant.
  • the step of disposing the encapsulant on the second side of the air pressure sensor chip includes:
  • a casing is provided, and the casing is arranged in a cylindrical shape;
  • the second side of the air pressure sensor chip and the space between the air pressure sensor chip and the casing are filled with encapsulant.
  • the air pressure sensor chip includes a chip body and a support enclosure, and the support enclosure is provided on a side of the chip body facing the air hole;
  • the step of installing the first side of the air pressure sensor chip toward the substrate, so that the first side of the air pressure sensor chip corresponds to the air hole on the substrate includes:
  • the support enclosure and the annular rubber ring are pasted and fixed.
  • a first UV film is provided, the adhesive surface of the first UV film is set up, and the second side of the air pressure sensor chip is bonded to the first UV film, so that the the first side of the air pressure sensor chip is placed upward;
  • the step of turning over the air pressure sensing chip with the encapsulation glue so that the first side of the air pressure sensing chip with the encapsulation glue is placed down includes:
  • a second UV film is provided, and the second UV film is correspondingly placed above the first UV film, so that the adhesive surface of the second UV film is bonded to the support enclosure;
  • the first UV film is irradiated with ultraviolet rays, so that the first UV film is separated from the support enclosure.
  • the protection of both sides of the sensor chip is realized, so that the sensor chip can be resistant to environmental corrosion and resistant to environmental corrosion. High-speed impact, and enhance product reliability.
  • FIG. 1 is a schematic structural diagram of an embodiment of an air pressure sensing assembly provided by the present application
  • FIG. 2 is a schematic structural diagram of the first side of the air pressure sensor chip in FIG. 1 with encapsulation glue;
  • FIG. 3 is a schematic structural diagram of the air pressure sensor chip in FIG. 1 being adhered to the first UV film;
  • FIG. 4 is a schematic structural diagram of the first side of the air pressure sensor chip in FIG. 1 filled with encapsulant;
  • FIG. 5 is a schematic structural diagram of the molding of the first side encapsulant of the air pressure sensor chip in FIG. 4;
  • FIG. 6 is a schematic structural diagram of the second side of the air pressure sensor chip in FIG. 4 being adhered to the second UV film;
  • FIG. 7 is a schematic flowchart of an embodiment of a method for packaging an air pressure sensing component provided by the present application.
  • FIG. 8 is a schematic flowchart of filling the encapsulant on the first side of the air pressure sensor chip in FIG. 7;
  • FIG. 9 is a schematic flow chart of installing the first side of the air pressure sensor chip on the substrate in FIG. 7;
  • FIG. 10 is a schematic flowchart of inverting the air pressure sensor chip in FIG. 9 so that the first side faces downward;
  • FIG. 11 is a schematic flowchart of filling the encapsulant on the second side of the air pressure sensor chip in FIG. 7 .
  • the directional indication is only used to explain the relative positional relationship, motion, etc. between the various components under a certain posture. If the specific posture changes , the directional indication changes accordingly.
  • Air pressure (differential pressure, gauge pressure) sensors have been widely used in medical, industrial and other fields, and some wearable products have also begun to use this product for health monitoring (such as blood pressure measurement).
  • health monitoring such as blood pressure measurement.
  • FIGS. 1 to 2 are schematic structural diagrams of an embodiment of the air pressure sensing assembly provided by the present application
  • FIGS. 3 to 6 are the air pressure sensing assembly provided by the present application.
  • the packaging process flow chart of the component FIG. 7 to FIG. 11 are schematic flowcharts of an embodiment of the packaging method of the air pressure sensor component provided by the present application.
  • the air pressure sensor assembly 100 includes a substrate 1 and an air pressure sensor chip 2 , the substrate 1 is provided with an air hole 11 therethrough, and the air pressure sensor chip 2 is mounted on the substrate 1 and corresponding to the air hole 11, the side of the air pressure sensor chip 2 facing the air hole 11 is the first side, and the side away from the air hole 11 is the second side, wherein the first side, And the second side is provided with encapsulation glue a.
  • the first side and the second side of the sensor chip 2 are connected to each other. protection, making it resistant to environmental corrosion, high-speed impact, and enhancing product reliability.
  • the substrate 1 is further provided with a casing 3 surrounding the air hole 11 at the air pressure sensor chip 2 .
  • the gap between them is filled with encapsulation glue a, which realizes encapsulation of the second side of the air pressure sensor chip 2 .
  • the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 .
  • the support enclosure 22 is provided on the side of the chip body 21 facing the air hole 11 and supported on the substrate 1 .
  • the support enclosure 22 and the chip body 21 define a cavity b opposite to the air hole 11 and in communication with the air hole 11.
  • the cavity b is filled with The encapsulation glue a realizes the encapsulation of the first side of the air pressure sensor chip 2 .
  • the material of the encapsulant a is silicon gel, and in this way, the elasticity of the silicon gel can be used to reduce the impact of high-speed impact and avoid air pressure sensing. Chip 2 is directly exposed to the environment to avoid being corroded by the environment.
  • An ASIC chip 4 is also mounted on the substrate 1 , and the ASIC chip 4 is electrically connected to the air pressure sensor chip 2 and the substrate 1 , so that the air pressure sensor chip 2 is connected to the air pressure sensor chip 2 through the ASIC chip 4 .
  • the electrical signal sent out is processed.
  • the air pressure sensor can be connected to the air pressure sensor by wire bonding or solder ball planting.
  • the electrical signals of the chip 2 and the ASIC chip 4 are introduced into the substrate 1 .
  • the ASIC chip 4 can also be electrically connected to the air pressure sensor chip 2 and the substrate 1 through conductive wires. This application does not limit this.
  • the substrate 1 is further provided with a casing 3 surrounding the air hole 11 at the air pressure sensor chip 2 .
  • the air pressure sensor chip 2 is connected to the casing 3 .
  • the gap between 3 is filled with encapsulation glue a
  • the substrate 1 is also mounted with an ASIC chip 4
  • the ASIC chip 4 is arranged in the housing 3 and is wrapped by the encapsulation glue a, in this way, it can also be Protecting the ASIC chip 4 prevents the ASIC chip 4 from being directly exposed to the environment, improves the environmental corrosion resistance of the ASIC chip 4, and makes the air pressure sensing assembly 100 compact in structure.
  • the present application also proposes a packaging method for an air pressure sensing component, and the packaging method is used to obtain an air pressure sensing component that is resistant to environmental corrosion and high-speed impact.
  • 3 to 6 are flowcharts of the packaging process of the air pressure sensing component provided by the present application
  • FIGS. 7 to 11 are schematic flowcharts of an embodiment of the packaging method of the air pressure sensor component provided by the present application.
  • the packaging method of the air pressure sensing component includes:
  • Step S10 providing an air pressure sensor chip 2, the air pressure sensor chip 2 has a first side and a second side, and an encapsulation glue a is provided on the first side of the air pressure sensor chip 2;
  • Step S20 providing a substrate 1, and the substrate 1 is provided with air holes 11 therethrough;
  • Step S30 installing the first side of the air pressure sensor chip 2 toward the substrate 1 , so that the first side of the air pressure sensor chip 2 is disposed corresponding to the air hole 11 on the substrate 1 ;
  • step S40 packaging glue a is provided on the second side of the air pressure sensor chip 2 .
  • the first side of the air pressure sensor chip 2 is provided with a packaging glue a to realize the packaging of the first side of the air pressure sensor chip 2, and then the air pressure sensor chip 2 is packaged.
  • the first side of the air pressure sensor chip 2 is mounted toward the substrate 1, so that the first side of the air pressure sensor chip 2 corresponds to the air hole 11 on the substrate 1, so that the first side of the air pressure sensor chip 2 can pass through the air hole 11.
  • the package protection on both sides of the chip 2 makes it resistant to environmental corrosion, high-speed impact, and enhances the reliability of the product.
  • the material of the substrate 1 may be FR4, BT, ceramics, etc., which is not limited in this application.
  • the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 , and the support enclosure 22 is provided on the chip body 21 facing the air hole 11 .
  • the support enclosure 22 and the chip body 21 define a cavity b that is opposite to and communicated with the air hole 11 , and the first side of the air pressure sensor chip 2 is provided with an encapsulant a. Steps include:
  • Step S101 providing a first UV film d, and setting the adhesive surface of the first UV film d upward;
  • Step S102 adhering the second side of the air pressure sensor chip 2 to the first UV film d, so that the first side of the air pressure sensor chip 2 is placed upward;
  • Step S103 filling the encapsulation glue a into the cavity b;
  • Step S104 vacuum degassing the encapsulant a.
  • the second side of the air pressure sensor chip 2 is bonded to the first UV film d, so that the air pressure sensor
  • the first side of the chip 2 is placed upward, which is convenient for filling the cavity b formed on the first side of the air pressure sensor chip 2 with the encapsulant a, so that the surface of the encapsulant a formed is parallel to the bottom of the cavity b,
  • vacuum defoaming the encapsulant a air bubbles remaining in the encapsulant a are removed, and the molding quality of the encapsulant a is improved.
  • the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 , and the support enclosure 22 is provided on the side of the chip body 21 facing the air hole 11 , so
  • the step of installing the first side of the air pressure sensor chip 2 toward the substrate 1 so that the first side of the air pressure sensor chip 2 corresponds to the air hole 11 on the substrate 1 includes:
  • Step S301 turning the air pressure sensing chip 2 with the encapsulation glue a so that the first side of the air pressure sensing chip 2 with the encapsulation glue a is placed downward;
  • Step S302 applying glue around the periphery of the air hole 11 on the substrate 1 to form an annular rubber ring c;
  • Step S303 pasting and fixing the support enclosure 22 and the annular rubber ring c.
  • the air pressure sensor chip 2 with the packaging glue a is turned over, so that the air pressure sensor chip 2 with the packaging glue a is turned over.
  • the air pressure sensor chip 2 is placed with the first side facing down, and glue is applied on the substrate 1 around the periphery of the air hole 11 to form an annular rubber ring c, and the support enclosure 22 is pasted with the annular rubber ring c By fixing, the operation of mounting the air pressure sensor chip 2 on the substrate 1 is realized.
  • the air pressure sensor chip 2 seals the support enclosure 22 and the substrate 1 through the annular rubber ring c, so that the sensing sensitivity of the air pressure sensor chip 2 is improved. it is good.
  • a first UV film d is provided, the bonding surface of the first UV film d is set up, and the second side of the air pressure sensor chip 2 is bonded On the first UV film d, the first side of the air pressure sensor chip 2 is placed upward, and the air pressure sensor chip 2 with the encapsulant a is turned over, so that the air pressure sensor chip 2 with the encapsulant a is turned over.
  • the steps of placing the air pressure sensor chip 2 with the first side facing down include:
  • Step S3011 providing a second UV film e, and placing the second UV film e above the first UV film d, so that the adhesive surface of the second UV film e is adhered to the support enclosure 22. catch;
  • Step S3012 adjusting the positions of the first UV film d and the second UV film e, so that the first UV film d is located above the second UV film e;
  • Step S3013 irradiating the first UV film d with ultraviolet rays, so that the first UV film d is separated from the supporting enclosure 22 .
  • the second UV film e is correspondingly placed above the first UV film d, so that the adhesive surface of the second UV film e is bonded to the support enclosure 22, and by adjusting the The positions of the first UV film d and the second UV film e are such that the first UV film d is located above the second UV film e, and the air pressure sensor chip with the encapsulation glue a is realized at this time.
  • the second UV film e Perform ultraviolet irradiation to separate the air pressure sensor chip 2 with the encapsulation glue a from the second UV film e, so as to facilitate the acquisition of the air pressure sensor chip 2 with the encapsulation glue a.
  • the step of providing the encapsulant a on the second side of the air pressure sensor chip 2 includes:
  • Step S401 providing a casing 3, and the casing 3 is arranged in a cylindrical shape;
  • Step S402 enclosing the casing 3 around the peripheral side of the air pressure sensor chip 2 with the encapsulation glue a and fixing it on the substrate 1;
  • Step S403 filling the second side of the air pressure sensor chip 2 and the space between the air pressure sensor chip and the housing 3 with encapsulant a.
  • the casing 3 surrounds the peripheral side of the air pressure sensor chip 2 with the encapsulant a and is fixed on the substrate 1 , and the second side of the air pressure sensor chip 2 and the air pressure are fixed to the substrate 1 .
  • Encapsulation glue a is filled between the sensor chip and the casing 3 , thereby realizing the encapsulation of the second side of the air pressure sensor chip, and the operation is simple.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The present application discloses a barometric pressure sensor assembly and a packaging method therefor. The barometric pressure sensor assembly comprises a substrate and a barometric pressure sensor chip. An air hole passes through the substrate. The barometric pressure sensor chip is disposed on the substrate and corresponds to the air hole. A side of the barometric pressure sensor chip facing the air hole is a first side, and another side of the barometric pressure sensor chip facing away from the air hole is a second side. A packaging adhesive is provided on each of the first side and the second side.

Description

气压传感组件及其封装方法Air pressure sensor assembly and packaging method thereof
本申请要求于2020年11月30日申请的、申请号为202011385556.9的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application filed on November 30, 2020 with application number 202011385556.9, the entire contents of which are incorporated herein by reference.
技术领域technical field
本申请涉及传感器技术领域，特别涉及一种气压传感组件及其封装方法。The present application relates to the technical field of sensors, and in particular, to an air pressure sensing component and a packaging method thereof.
背景技术Background technique
气压（差压，表压）传感器目前已广泛应用在医疗、工业等领域，且目前有部分可穿戴产品也开始使用该产品用于健康监测（如测量血压）。为了保证器件在复杂场景下的高可靠性，亟需利用一种封装方法以得到一种够耐环境腐蚀、耐高速冲击的气压传感组件。Air pressure (differential pressure, gauge pressure) sensors have been widely used in medical, industrial and other fields, and some wearable products have also begun to use this product for health monitoring (such as blood pressure measurement). In order to ensure the high reliability of the device in complex scenarios, it is urgent to use a packaging method to obtain an air pressure sensing component that is resistant to environmental corrosion and high-speed impact.
技术问题technical problem
本申请的主要目的是提供一种气压传感组件及其封装方法，旨在可得到耐环境腐蚀、耐高速冲击的气压传感组件。The main purpose of the present application is to provide an air pressure sensing assembly and a packaging method thereof, aiming to obtain an air pressure sensing assembly that is resistant to environmental corrosion and high-speed impact.
技术解决方案technical solutions
为实现上述目的，本申请提供一种气压传感组件，包括：In order to achieve the above purpose, the present application provides an air pressure sensing assembly, comprising:
基板，所述基板上贯设有气孔；以及，a substrate, the substrate is provided with air holes; and,
气压传感芯片，安装于所述基板且对应所述气孔设置，所述气压传感芯片朝向所述气孔的一侧为第一侧，背离所述气孔的一侧为第二侧；an air pressure sensor chip, mounted on the substrate and disposed corresponding to the air hole, the side of the air pressure sensor chip facing the air hole is the first side, and the side away from the air hole is the second side;
其中，所述第一侧、以及所述第二侧均设置有封装胶。Wherein, the first side and the second side are provided with encapsulant.
在一实施例中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的***的壳体；In one embodiment, the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensor chip;
所述气压传感芯片与所述壳体之间的间隙填充有封装胶。The gap between the air pressure sensor chip and the casing is filled with encapsulant.
在一实施例中，所述气压传感芯片包括：In one embodiment, the air pressure sensor chip includes:
芯片主体；chip body;
支撑围挡，设于所述芯片主体朝向所述气孔的一侧，且支撑在所述基板上且围设在所述气孔的周侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔，所述容腔内填充有所述封装胶。A support enclosure is arranged on the side of the chip main body facing the air hole, and is supported on the substrate and is arranged around the air hole, the support enclosure and the chip main body define a relationship with the air hole. The air holes are opposite and communicate with each other in a cavity, and the cavity is filled with the packaging glue.
在一实施例中，所述封装胶为硅凝胶。In one embodiment, the encapsulant is silicone gel.
在一实施例中，所述基板上还安装有ASIC芯片，所述ASIC芯片与所述气压传感芯片和所述基板电连接。In one embodiment, an ASIC chip is further mounted on the substrate, and the ASIC chip is electrically connected to the air pressure sensor chip and the substrate.
在一实施例中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的***的壳体；In one embodiment, the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensor chip;
所述气压传感芯片与所述壳体之间的间隙填充有封装胶；The gap between the air pressure sensor chip and the housing is filled with encapsulant;
所述基板上还安装有ASIC芯片，所述ASIC芯片设于所述壳体内且被所述封装胶包裹。An ASIC chip is also mounted on the substrate, and the ASIC chip is arranged in the casing and wrapped by the encapsulant.
为实现上述目的，本申请提供一种气压传感组件的封装方法，包括以下步骤：In order to achieve the above purpose, the present application provides a packaging method for an air pressure sensing component, comprising the following steps:
提供气压传感芯片，所述气压传感芯片具有第一侧和第二侧，在所述气压传感芯片的第一侧设有封装胶；an air pressure sensor chip is provided, the air pressure sensor chip has a first side and a second side, and an encapsulant is provided on the first side of the air pressure sensor chip;
提供基板，所述基板上贯设有气孔；providing a substrate, the substrate is provided with air holes;
将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置；installing the first side of the air pressure sensor chip toward the substrate, so that the first side of the air pressure sensor chip is disposed corresponding to the air hole on the substrate;
在所述气压传感芯片的第二侧设有封装胶。An encapsulant is provided on the second side of the air pressure sensor chip.
在一实施例中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔；In one embodiment, the air pressure sensor chip includes a chip body and a support enclosure, the support enclosure is disposed on a side of the chip body facing the air hole, and the support enclosure is defined by the chip body. Outgoing a cavity opposite and communicating with the air hole;
所述在所述气压传感芯片的第一侧设有封装胶的步骤包括：The step of disposing the encapsulant on the first side of the air pressure sensor chip includes:
提供第一UV膜，将所述第一UV膜的粘接面朝上设置；A first UV film is provided, and the adhesive side of the first UV film is set up;
将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；Adhering the second side of the air pressure sensor chip to the first UV film, so that the first side of the air pressure sensor chip is placed upward;
向所述容腔内填充封装胶；filling the cavity with encapsulant;
对所述封装胶进行真空脱泡。Vacuum defoaming is performed on the encapsulant.
在一实施例中，所述在所述气压传感芯片的第二侧设有封装胶的步骤包括：In one embodiment, the step of disposing the encapsulant on the second side of the air pressure sensor chip includes:
提供一壳体，所述壳体呈筒状设置；A casing is provided, and the casing is arranged in a cylindrical shape;
将壳体围设所述带有封装胶的气压传感芯片的周侧且固定于所述基板；enclosing the casing around the peripheral side of the air pressure sensor chip with the encapsulant and being fixed on the substrate;
对所述气压传感芯片的第二侧以及所述气压传感器芯片与所述壳体之间均填充封装胶。The second side of the air pressure sensor chip and the space between the air pressure sensor chip and the casing are filled with encapsulant.
在一实施例中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧；In one embodiment, the air pressure sensor chip includes a chip body and a support enclosure, and the support enclosure is provided on a side of the chip body facing the air hole;
所述将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置的步骤包括：The step of installing the first side of the air pressure sensor chip toward the substrate, so that the first side of the air pressure sensor chip corresponds to the air hole on the substrate, includes:
翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置；Turning the air pressure sensing chip with the encapsulation glue over, so that the first side of the air pressure sensing chip with the encapsulation glue is placed downward;
在所述基板上绕着所述气孔周缘进行涂胶，以形成环形胶圈；Applying glue around the periphery of the air hole on the substrate to form an annular rubber ring;
将所述支撑围挡与所述环形胶圈粘贴固定。The support enclosure and the annular rubber ring are pasted and fixed.
在一实施例中，提供第一UV膜，将所述第一UV膜的粘接面朝上设置，将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；In one embodiment, a first UV film is provided, the adhesive surface of the first UV film is set up, and the second side of the air pressure sensor chip is bonded to the first UV film, so that the the first side of the air pressure sensor chip is placed upward;
所述翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置的步骤包括：The step of turning over the air pressure sensing chip with the encapsulation glue so that the first side of the air pressure sensing chip with the encapsulation glue is placed down includes:
提供第二UV膜，将所述第二UV膜对应放置于所述第一UV膜上方，使得所述第二UV膜的粘接面与所述支撑围挡粘接；A second UV film is provided, and the second UV film is correspondingly placed above the first UV film, so that the adhesive surface of the second UV film is bonded to the support enclosure;
调整所述第一UV膜和所述第二UV膜的位置，使得所述第一UV膜位于所述第二UV膜上方；adjusting the positions of the first UV film and the second UV film so that the first UV film is located above the second UV film;
对所述第一UV膜进行紫外线照射，使得所述第一UV膜与所述支撑围挡分离。The first UV film is irradiated with ultraviolet rays, so that the first UV film is separated from the support enclosure.
有益效果beneficial effect
在本申请提供的技术方案中，通过在所述气压传感芯片的第一侧和第二侧设置封装胶，实现了对所述传感器芯片的两侧的保护，使其能够耐环境腐蚀、耐高速冲击，且增强产品的可靠性。In the technical solution provided in the present application, by arranging encapsulation glue on the first side and the second side of the air pressure sensor chip, the protection of both sides of the sensor chip is realized, so that the sensor chip can be resistant to environmental corrosion and resistant to environmental corrosion. High-speed impact, and enhance product reliability.
附图说明Description of drawings
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that are used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without any creative effort.
图1为本申请提供的气压传感组件的一实施例的结构示意图；FIG. 1 is a schematic structural diagram of an embodiment of an air pressure sensing assembly provided by the present application;
图2为图1中气压传感芯片第一侧设置封装胶的结构示意图；FIG. 2 is a schematic structural diagram of the first side of the air pressure sensor chip in FIG. 1 with encapsulation glue;
图3为图1中的气压传感芯片粘接于第一UV膜上的结构示意图；3 is a schematic structural diagram of the air pressure sensor chip in FIG. 1 being adhered to the first UV film;
图4为图1中的气压传感芯片的第一侧填充封装胶的结构示意图；FIG. 4 is a schematic structural diagram of the first side of the air pressure sensor chip in FIG. 1 filled with encapsulant;
图5为图4中的气压传感芯片的第一侧封装胶成型的结构示意图；FIG. 5 is a schematic structural diagram of the molding of the first side encapsulant of the air pressure sensor chip in FIG. 4;
图6为图4中的气压传感芯片的第二侧粘接于第二UV膜上的结构示意图；6 is a schematic structural diagram of the second side of the air pressure sensor chip in FIG. 4 being adhered to the second UV film;
图7为本申请提供的气压传感组件封装方法一实施例的流程示意图；7 is a schematic flowchart of an embodiment of a method for packaging an air pressure sensing component provided by the present application;
图8为图7中在气压传感芯片的第一侧填充封装胶的流程示意图；FIG. 8 is a schematic flowchart of filling the encapsulant on the first side of the air pressure sensor chip in FIG. 7;
图9为图7中将气压传感芯片的第一侧安装于基板的流程示意图；FIG. 9 is a schematic flow chart of installing the first side of the air pressure sensor chip on the substrate in FIG. 7;
图10为图9中的将气压传感芯片进行翻转使得第一侧朝下设置的流程示意图；FIG. 10 is a schematic flowchart of inverting the air pressure sensor chip in FIG. 9 so that the first side faces downward;
图11为图7中在气压传感芯片的第二侧填充封装胶的流程示意图。FIG. 11 is a schematic flowchart of filling the encapsulant on the second side of the air pressure sensor chip in FIG. 7 .
附图标号说明：Description of reference numbers:
标号 label 名称 name 标号 label 名称 name
100 100 气压传感组件 Air pressure sensor assembly 4 4 ASIC芯片 ASIC chip
1 1 基板 substrate a a 封装胶 encapsulant
11 11 气孔 stomata b b 容腔 Cavity
2 2 气压传感芯片 Air pressure sensor chip c c 环形胶圈 Ring rubber ring
21 twenty one 芯片主体 chip body d d 第一UV膜 The first UV film
22 twenty two 支撑围挡 support fence e e 第二UV膜 Second UV film
3 3 壳体 case        
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。The realization, functional characteristics and advantages of the purpose of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments.
本发明的实施方式Embodiments of the present invention
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
需要说明，若本申请实施例中有涉及方向性指示，则该方向性指示仅用于解释在某一特定姿态下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。It should be noted that if there is a directional indication involved in the embodiments of this application, the directional indication is only used to explain the relative positional relationship, motion, etc. between the various components under a certain posture. If the specific posture changes , the directional indication changes accordingly.
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。In addition, if there are descriptions related to "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for the purpose of description, and should not be construed as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection claimed in this application.
气压（差压，表压）传感器目前已广泛应用在医疗、工业等领域，且目前有部分可穿戴产品也开始使用该产品用于健康监测（如测量血压）。为了保证器件在复杂场景下的高可靠性，亟需利用一种封装方法以得到一种够耐环境腐蚀、耐高速冲击的气压传感组件。Air pressure (differential pressure, gauge pressure) sensors have been widely used in medical, industrial and other fields, and some wearable products have also begun to use this product for health monitoring (such as blood pressure measurement). In order to ensure the high reliability of the device in complex scenarios, it is urgent to use a packaging method to obtain an air pressure sensing component that is resistant to environmental corrosion and high-speed impact.
本申请提供一种气压传感组件及其封装方法，其中，图1至图2为本申请提供的气压传感组件一实施例的结构示意图，图3至图6为本申请提供的气压传感组件的封装工艺流程图，图7至图11为本申请提供的气压传感组件封装方法一实施例的流程示意图。The present application provides an air pressure sensing assembly and a packaging method thereof, wherein FIGS. 1 to 2 are schematic structural diagrams of an embodiment of the air pressure sensing assembly provided by the present application, and FIGS. 3 to 6 are the air pressure sensing assembly provided by the present application. The packaging process flow chart of the component, FIG. 7 to FIG. 11 are schematic flowcharts of an embodiment of the packaging method of the air pressure sensor component provided by the present application.
请一并参阅图1至图2，所述气压传感组件100包括基板1和气压传感芯片2，所述基板1上贯设有气孔11，所述气压传感芯片2安装于所述基板1且对应所述气孔11设置，所述气压传感芯片2朝向所述气孔11的一侧为第一侧，背离所述气孔11的一侧为第二侧，其中，所述第一侧、以及所述第二侧均设置有封装胶a。Please refer to FIG. 1 to FIG. 2 together, the air pressure sensor assembly 100 includes a substrate 1 and an air pressure sensor chip 2 , the substrate 1 is provided with an air hole 11 therethrough, and the air pressure sensor chip 2 is mounted on the substrate 1 and corresponding to the air hole 11, the side of the air pressure sensor chip 2 facing the air hole 11 is the first side, and the side away from the air hole 11 is the second side, wherein the first side, And the second side is provided with encapsulation glue a.
在本申请提供的技术方案中，通过在所述气压传感芯片2的第一侧和所述第二侧设置封装胶a，实现了对所述传感器芯片2的第一侧和第二侧的保护，使其能够耐环境腐蚀、耐高速冲击，且增强产品的可靠性。In the technical solution provided in the present application, by arranging encapsulation glue a on the first side and the second side of the air pressure sensor chip 2, the first side and the second side of the sensor chip 2 are connected to each other. protection, making it resistant to environmental corrosion, high-speed impact, and enhancing product reliability.
具体地，所述基板1上在所述气压传感芯片2处还设置有围设在所述气孔11的***的壳体3，通过在所述气压传感芯片2与所述壳体3之间的间隙填充有封装胶a，实现了对所述气压传感芯片2的第二侧的封装。Specifically, the substrate 1 is further provided with a casing 3 surrounding the air hole 11 at the air pressure sensor chip 2 . The gap between them is filled with encapsulation glue a, which realizes encapsulation of the second side of the air pressure sensor chip 2 .
参照图2，所述气压传感芯片2包括芯片主体21和支撑围挡22，所述支撑围挡22设于所述芯片主体21朝向所述气孔11的一侧，且支撑在所述基板1上且围设在所述气孔11的周侧，所述支撑围挡22与所述芯片主体21限定出与所述气孔11相对且连通的容腔b，通过在所述容腔b内填充有所述封装胶a，实现了对所述气压传感芯片2的第一侧的封装。Referring to FIG. 2 , the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 . The support enclosure 22 is provided on the side of the chip body 21 facing the air hole 11 and supported on the substrate 1 . The support enclosure 22 and the chip body 21 define a cavity b opposite to the air hole 11 and in communication with the air hole 11. The cavity b is filled with The encapsulation glue a realizes the encapsulation of the first side of the air pressure sensor chip 2 .
需要说明的是，在本申请的实施例中，所述封装胶a的材质为硅凝胶，如此设置，利用所述硅凝胶的弹性很好地减小高速冲击的影响，避免气压传感芯片2直接暴露在环境中，避免被环境腐蚀。It should be noted that, in the embodiments of the present application, the material of the encapsulant a is silicon gel, and in this way, the elasticity of the silicon gel can be used to reduce the impact of high-speed impact and avoid air pressure sensing. Chip 2 is directly exposed to the environment to avoid being corroded by the environment.
所述基板1上还安装有ASIC芯片4，所述ASIC芯片4与所述气压传感芯片2和所述基板1电连接，如此设置，通过所述ASIC芯片4对所述气压传感芯片2发出的电信号进行处理。An ASIC chip 4 is also mounted on the substrate 1 , and the ASIC chip 4 is electrically connected to the air pressure sensor chip 2 and the substrate 1 , so that the air pressure sensor chip 2 is connected to the air pressure sensor chip 2 through the ASIC chip 4 . The electrical signal sent out is processed.
需要说明的是，所述ASIC芯片4与所述气压传感芯片2和所述基板1电连接的方式有多种，例如可通过打线的方式或者植锡球的方式将所述气压传感芯片2、所述ASIC芯片4的电信号引入到基板1中。在此需要注意的是，由于引脚朝向的问题，有时需要在所述气压传感芯片2、所述ASIC芯片4中设置金属化通孔，通过该金属化通孔可以改变芯片引脚的朝向，当然，所述ASIC芯片4与所述气压传感芯片2和所述基板1还可以通过导电线实现电连接。本申请对此不作限定。It should be noted that there are various ways to electrically connect the ASIC chip 4 to the air pressure sensor chip 2 and the substrate 1 . For example, the air pressure sensor can be connected to the air pressure sensor by wire bonding or solder ball planting. The electrical signals of the chip 2 and the ASIC chip 4 are introduced into the substrate 1 . It should be noted here that, due to the orientation of the pins, it is sometimes necessary to set metallized through holes in the air pressure sensor chip 2 and the ASIC chip 4, and the orientation of the chip pins can be changed through the metallized through holes. Of course, the ASIC chip 4 can also be electrically connected to the air pressure sensor chip 2 and the substrate 1 through conductive wires. This application does not limit this.
参照图1和图2，所述基板1上在所述气压传感芯片2处还设置有围设在所述气孔11的***的壳体3，所述气压传感芯片2与所述壳体3之间的间隙填充有封装胶a，所述基板1上还安装有ASIC芯片4，所述ASIC芯片4设于所述壳体3内且被所述封装胶a包裹，如此设置，同样可以对所述ASIC芯片4进行保护，避免所述ASIC芯片4直接暴露在环境中，提高了所述ASIC芯片4的耐环境腐蚀能力，使得所述气压传感组件100结构紧凑。Referring to FIGS. 1 and 2 , the substrate 1 is further provided with a casing 3 surrounding the air hole 11 at the air pressure sensor chip 2 . The air pressure sensor chip 2 is connected to the casing 3 . The gap between 3 is filled with encapsulation glue a, the substrate 1 is also mounted with an ASIC chip 4, the ASIC chip 4 is arranged in the housing 3 and is wrapped by the encapsulation glue a, in this way, it can also be Protecting the ASIC chip 4 prevents the ASIC chip 4 from being directly exposed to the environment, improves the environmental corrosion resistance of the ASIC chip 4, and makes the air pressure sensing assembly 100 compact in structure.
本申请还提出一种气压传感组件的封装方法，利用该封装方法以得到一种耐环境腐蚀、耐高速冲击的气压传感组件。图3至图6为本申请提供的气压传感组件的封装工艺流程图，图7至图11为本申请提供的气压传感组件封装方法一实施例的流程示意图。The present application also proposes a packaging method for an air pressure sensing component, and the packaging method is used to obtain an air pressure sensing component that is resistant to environmental corrosion and high-speed impact. 3 to 6 are flowcharts of the packaging process of the air pressure sensing component provided by the present application, and FIGS. 7 to 11 are schematic flowcharts of an embodiment of the packaging method of the air pressure sensor component provided by the present application.
请参见图7，本申请提供的技术方案中，所述气压传感组件的封装方法包括：Referring to FIG. 7, in the technical solution provided by the present application, the packaging method of the air pressure sensing component includes:
步骤S10、提供气压传感芯片2，所述气压传感芯片2具有第一侧和第二侧，在所述气压传感芯片2的第一侧设有封装胶a；Step S10, providing an air pressure sensor chip 2, the air pressure sensor chip 2 has a first side and a second side, and an encapsulation glue a is provided on the first side of the air pressure sensor chip 2;
步骤S20、提供基板1，所述基板1上贯设有气孔11；Step S20, providing a substrate 1, and the substrate 1 is provided with air holes 11 therethrough;
步骤S30、将所述气压传感芯片2的第一侧朝向所述基板1安装，使得所述气压传感芯片2的第一侧对应所述基板1上的气孔11设置；Step S30 , installing the first side of the air pressure sensor chip 2 toward the substrate 1 , so that the first side of the air pressure sensor chip 2 is disposed corresponding to the air hole 11 on the substrate 1 ;
步骤S40、在所述气压传感芯片2的第二侧设有封装胶a。In step S40 , packaging glue a is provided on the second side of the air pressure sensor chip 2 .
上述封装方法中，首先在所述气压传感芯片2的第一侧设有封装胶a，实现了对所述气压传感芯片2的第一侧的封装，然后将所述气压传感芯片2的第一侧朝向所述基板1安装，使得所述气压传感芯片2的第一侧对应所述基板1上的气孔11，使得所述气压传感芯片2的第一侧能够通过所述气孔11感受气压，最后在所述气压传感芯片2的第二侧设有封装胶a，从而实现所述气压传感芯片2的第二侧的封装，通过该封装方法实现了所述气压传感芯片2两侧的封装保护，使其能够耐环境腐蚀、耐高速冲击，且增强产品的可靠性。In the above packaging method, the first side of the air pressure sensor chip 2 is provided with a packaging glue a to realize the packaging of the first side of the air pressure sensor chip 2, and then the air pressure sensor chip 2 is packaged. The first side of the air pressure sensor chip 2 is mounted toward the substrate 1, so that the first side of the air pressure sensor chip 2 corresponds to the air hole 11 on the substrate 1, so that the first side of the air pressure sensor chip 2 can pass through the air hole 11. Feel the air pressure, and finally set the encapsulation glue a on the second side of the air pressure sensor chip 2, so as to realize the packaging of the second side of the air pressure sensor chip 2, and realize the air pressure sensor through this packaging method. The package protection on both sides of the chip 2 makes it resistant to environmental corrosion, high-speed impact, and enhances the reliability of the product.
需要说明的是，所述基板1的材质可以是FR4、BT或陶瓷等，本申请对此不作限定。It should be noted that the material of the substrate 1 may be FR4, BT, ceramics, etc., which is not limited in this application.
具体地，请参见图3至图5及图8，所述气压传感芯片2包括芯片主体21和支撑围挡22，所述支撑围挡22设于所述芯片主体21朝向所述气孔11的一侧，所述支撑围挡22与所述芯片主体21限定出与所述气孔11相对且连通的容腔b，所述在所述气压传感芯片2的第一侧设有封装胶a的步骤包括：Specifically, please refer to FIGS. 3 to 5 and 8 , the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 , and the support enclosure 22 is provided on the chip body 21 facing the air hole 11 . On one side, the support enclosure 22 and the chip body 21 define a cavity b that is opposite to and communicated with the air hole 11 , and the first side of the air pressure sensor chip 2 is provided with an encapsulant a. Steps include:
步骤S101、提供第一UV膜d，将所述第一UV膜d的粘接面朝上设置；Step S101, providing a first UV film d, and setting the adhesive surface of the first UV film d upward;
步骤S102、将所述气压传感芯片2的第二侧粘接于所述第一UV膜d，使得所述气压传感芯片2的第一侧朝上放置；Step S102, adhering the second side of the air pressure sensor chip 2 to the first UV film d, so that the first side of the air pressure sensor chip 2 is placed upward;
步骤S103、向所述容腔b内填充封装胶a；Step S103, filling the encapsulation glue a into the cavity b;
步骤S104、对所述封装胶a进行真空脱泡。Step S104 , vacuum degassing the encapsulant a.
上述封装方法，通过将所述第一UV膜d的粘接面朝上设置，将所述气压传感芯片2的第二侧粘接于所述第一UV膜d，使得所述气压传感芯片2的第一侧朝上放置，便于向形成于所述气压传感芯片2第一侧的容腔b内填充封装胶a，使得形成的封装胶a面与所述容腔b底部平行，通过对所述封装胶a进行真空脱泡，以去除封装胶a内残留的气泡，提高封装胶a成型质量。In the above packaging method, by arranging the adhesive surface of the first UV film d upward, the second side of the air pressure sensor chip 2 is bonded to the first UV film d, so that the air pressure sensor The first side of the chip 2 is placed upward, which is convenient for filling the cavity b formed on the first side of the air pressure sensor chip 2 with the encapsulant a, so that the surface of the encapsulant a formed is parallel to the bottom of the cavity b, By vacuum defoaming the encapsulant a, air bubbles remaining in the encapsulant a are removed, and the molding quality of the encapsulant a is improved.
具体地，参照图6及图9，所述气压传感芯片2包括芯片主体21和支撑围挡22，所述支撑围挡22设于所述芯片主体21朝向所述气孔11的一侧，所述将所述气压传感芯片2的第一侧朝向所述基板1安装，使得所述气压传感芯片2的第一侧对应所述基板1上的气孔11设置的步骤包括：Specifically, referring to FIG. 6 and FIG. 9 , the air pressure sensor chip 2 includes a chip body 21 and a support enclosure 22 , and the support enclosure 22 is provided on the side of the chip body 21 facing the air hole 11 , so The step of installing the first side of the air pressure sensor chip 2 toward the substrate 1 so that the first side of the air pressure sensor chip 2 corresponds to the air hole 11 on the substrate 1 includes:
步骤S301、翻转所述带有封装胶a的气压传感芯片2，使得所述带有封装胶a的气压传感芯片2的第一侧朝下放置；Step S301, turning the air pressure sensing chip 2 with the encapsulation glue a so that the first side of the air pressure sensing chip 2 with the encapsulation glue a is placed downward;
步骤S302、在所述基板1上绕着所述气孔11周缘进行涂胶，以形成环形胶圈c；Step S302, applying glue around the periphery of the air hole 11 on the substrate 1 to form an annular rubber ring c;
步骤S303、将所述支撑围挡22与所述环形胶圈c粘贴固定。Step S303 , pasting and fixing the support enclosure 22 and the annular rubber ring c.
上述封装方法，在所述将所述气压传感芯片2的第一侧设有封装胶a后，翻转所述带有封装胶a的气压传感芯片2，使得所述带有封装胶a的气压传感芯片2的第一侧朝下放置，在所述基板1上绕着所述气孔11周缘进行涂胶形成环形胶圈c，将所述支撑围挡22与所述环形胶圈c粘贴固定，实现了将所述气压传感芯片2安装于所述基板1的操作。In the above packaging method, after the first side of the air pressure sensor chip 2 is provided with the packaging glue a, the air pressure sensor chip 2 with the packaging glue a is turned over, so that the air pressure sensor chip 2 with the packaging glue a is turned over. The air pressure sensor chip 2 is placed with the first side facing down, and glue is applied on the substrate 1 around the periphery of the air hole 11 to form an annular rubber ring c, and the support enclosure 22 is pasted with the annular rubber ring c By fixing, the operation of mounting the air pressure sensor chip 2 on the substrate 1 is realized.
需要说明的是，所述气压传感芯片2通过所述环形胶圈c将所述支撑围挡22与所述基板1实现密封安装，如此提高了所述气压传感芯片2的感应灵敏度，效果好。It should be noted that the air pressure sensor chip 2 seals the support enclosure 22 and the substrate 1 through the annular rubber ring c, so that the sensing sensitivity of the air pressure sensor chip 2 is improved. it is good.
进一步地，参照图5、图6及图10，提供第一UV膜d，将所述第一UV膜d的粘接面朝上设置，将所述气压传感芯片2的第二侧粘接于所述第一UV膜d，使得所述气压传感芯片2的第一侧朝上放置，所述翻转所述带有封装胶a的气压传感芯片2，使得所述带有封装胶a的气压传感芯片2的第一侧朝下放置的步骤包括：Further, referring to FIG. 5 , FIG. 6 and FIG. 10 , a first UV film d is provided, the bonding surface of the first UV film d is set up, and the second side of the air pressure sensor chip 2 is bonded On the first UV film d, the first side of the air pressure sensor chip 2 is placed upward, and the air pressure sensor chip 2 with the encapsulant a is turned over, so that the air pressure sensor chip 2 with the encapsulant a is turned over. The steps of placing the air pressure sensor chip 2 with the first side facing down include:
步骤S3011、提供第二UV膜e，将所述第二UV膜e对应放置于所述第一UV膜d上方，使得所述第二UV膜e的粘接面与所述支撑围挡22粘接；Step S3011, providing a second UV film e, and placing the second UV film e above the first UV film d, so that the adhesive surface of the second UV film e is adhered to the support enclosure 22. catch;
步骤S3012、调整所述第一UV膜d和所述第二UV膜e的位置，使得所述第一UV膜d位于所述第二UV膜e上方；Step S3012, adjusting the positions of the first UV film d and the second UV film e, so that the first UV film d is located above the second UV film e;
步骤S3013、对所述第一UV膜d进行紫外线照射，使得所述第一UV膜d与所述支撑围挡22分离。Step S3013 , irradiating the first UV film d with ultraviolet rays, so that the first UV film d is separated from the supporting enclosure 22 .
上述封装方法，将所述第二UV膜e对应放置于所述第一UV膜d上方，使得所述第二UV膜e的粘接面与所述支撑围挡22粘接，通过调整所述第一UV膜d和所述第二UV膜e的位置，使得所述第一UV膜d位于所述第二UV膜e上方，此时实现了所述带有封装胶a的气压传感芯片2的翻转，使得所述带有封装胶a的气压传感芯片2的第一侧朝下设置，然后对所述第一UV膜d进行紫外线照射，使得所述第一UV膜d与所述支撑围挡22分离，使得所述带有封装胶a的气压传感芯片2粘接于所述第二UV膜e。In the above packaging method, the second UV film e is correspondingly placed above the first UV film d, so that the adhesive surface of the second UV film e is bonded to the support enclosure 22, and by adjusting the The positions of the first UV film d and the second UV film e are such that the first UV film d is located above the second UV film e, and the air pressure sensor chip with the encapsulation glue a is realized at this time. 2 is turned over, so that the first side of the air pressure sensor chip 2 with the encapsulation glue a is set downward, and then the first UV film d is irradiated with ultraviolet rays, so that the first UV film d and the The supporting enclosure 22 is separated, so that the air pressure sensor chip 2 with the encapsulant a is bonded to the second UV film e.
需要说明的是，当需要将粘接于所述第二UV膜e的所述带有封装胶a的气压传感芯片2进行第二侧设有封装胶a，可以对所述第二UV膜e进行紫外线照射，以将所述带有封装胶a的气压传感芯片2与所述第二UV膜e分离，便于所述带有封装胶a的气压传感芯片2的获取。It should be noted that when the air pressure sensor chip 2 with the encapsulation glue a that is adhered to the second UV film e needs to be provided with the encapsulation glue a on the second side, the second UV film e Perform ultraviolet irradiation to separate the air pressure sensor chip 2 with the encapsulation glue a from the second UV film e, so as to facilitate the acquisition of the air pressure sensor chip 2 with the encapsulation glue a.
具体地，参照图11，所述在所述气压传感芯片2的第二侧设有封装胶a的步骤包括：Specifically, referring to FIG. 11 , the step of providing the encapsulant a on the second side of the air pressure sensor chip 2 includes:
步骤S401、提供一壳体3，所述壳体3呈筒状设置；Step S401, providing a casing 3, and the casing 3 is arranged in a cylindrical shape;
步骤S402、将壳体3围设所述带有封装胶a的气压传感芯片2的周侧且固定于所述基板1；Step S402, enclosing the casing 3 around the peripheral side of the air pressure sensor chip 2 with the encapsulation glue a and fixing it on the substrate 1;
步骤S403、对所述气压传感芯片2的第二侧以及所述气压传感器芯片与所述壳体3之间均填充封装胶a。Step S403 , filling the second side of the air pressure sensor chip 2 and the space between the air pressure sensor chip and the housing 3 with encapsulant a.
上述封装方法，将壳体3围设所述带有封装胶a的气压传感芯片2的周侧且固定于所述基板1，对所述气压传感芯片2的第二侧以及所述气压传感器芯片与所述壳体3之间均填充封装胶a，从而实现了对所述气压传感器芯片的第二侧的封装，操作简单。In the above packaging method, the casing 3 surrounds the peripheral side of the air pressure sensor chip 2 with the encapsulant a and is fixed on the substrate 1 , and the second side of the air pressure sensor chip 2 and the air pressure are fixed to the substrate 1 . Encapsulation glue a is filled between the sensor chip and the casing 3 , thereby realizing the encapsulation of the second side of the air pressure sensor chip, and the operation is simple.
需要说明的是，实现所述壳体3固定于所述基板1的方法有多种，比如，用锡膏或环氧胶将外壳黏贴在基板1上，如此设置，参照简单，且本申请对此不作限定。It should be noted that there are various methods for fixing the housing 3 on the substrate 1 , for example, sticking the housing on the substrate 1 with solder paste or epoxy glue. This is not limited.
以上所述仅为本申请的在一实施例中实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。The above is only an example of an embodiment of the present application, and is not intended to limit the scope of the patent of the present application. Any equivalent structural transformation made by using the contents of the description and drawings of the present application under the inventive concept of the present application, or Direct/indirect applications in other related technical fields are included in the scope of patent protection of this application.

Claims (11)

  1. 一种气压传感组件，其中，所述气压传感组件包括：An air pressure sensing assembly, wherein the air pressure sensing assembly comprises:
    基板，所述基板上贯设有气孔；以及，a substrate, the substrate is provided with air holes; and,
    气压传感芯片，安装于所述基板且对应所述气孔设置，所述气压传感芯片朝向所述气孔的一侧为第一侧，背离所述气孔的一侧为第二侧；an air pressure sensor chip, mounted on the substrate and disposed corresponding to the air hole, the side of the air pressure sensor chip facing the air hole is the first side, and the side away from the air hole is the second side;
    其中，所述第一侧、以及所述第二侧均设置有封装胶。Wherein, the first side and the second side are provided with encapsulant.
  2. 根据权利要求1所述的气压传感组件，其中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的***的壳体；The air pressure sensor assembly according to claim 1, wherein a casing surrounding the air hole is further provided on the substrate at the air pressure sensor chip;
    所述气压传感芯片与所述壳体之间的间隙填充有封装胶。The gap between the air pressure sensor chip and the casing is filled with encapsulant.
  3. 根据权利要求1所述的气压传感组件，其中，所述气压传感芯片包括：The air pressure sensing assembly according to claim 1, wherein the air pressure sensing chip comprises:
    芯片主体；chip body;
    支撑围挡，设于所述芯片主体朝向所述气孔的一侧，且支撑在所述基板上且围设在所述气孔的周侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔，所述容腔内填充有所述封装胶。A support enclosure is arranged on the side of the chip main body facing the air hole, and is supported on the substrate and is arranged around the air hole, the supporting enclosure and the chip main body define The cavity is opposite and communicated with the air holes, and the cavity is filled with the encapsulant.
  4. 根据权利要求1所述的气压传感组件，其中，所述封装胶为硅凝胶。The air pressure sensing assembly of claim 1, wherein the encapsulant is silicon gel.
  5. 根据权利要求1所述的气压传感组件，其中，所述基板上还安装有ASIC芯片，所述ASIC芯片与所述气压传感芯片和所述基板电连接。The air pressure sensor assembly according to claim 1, wherein an ASIC chip is further mounted on the substrate, and the ASIC chip is electrically connected to the air pressure sensor chip and the substrate.
  6. 根据权利要求5所述的气压传感组件，其中，所述基板上在所述气压传感芯片处还设置有围设在所述气孔的***的壳体；The air pressure sensing assembly according to claim 5, wherein the substrate is further provided with a casing surrounding the periphery of the air hole at the air pressure sensing chip;
    所述气压传感芯片与所述壳体之间的间隙填充有封装胶；The gap between the air pressure sensor chip and the housing is filled with encapsulant;
    所述基板上还安装有ASIC芯片，所述ASIC芯片设于所述壳体内且被所述封装胶包裹。An ASIC chip is also mounted on the substrate, and the ASIC chip is arranged in the casing and wrapped by the encapsulant.
  7. 一种气压传感组件的封装方法，其中，所述方法包括以下步骤：A method of packaging an air pressure sensing component, wherein the method comprises the following steps:
    提供气压传感芯片，所述气压传感芯片具有第一侧和第二侧，在所述气压传感芯片的第一侧设有封装胶；an air pressure sensor chip is provided, the air pressure sensor chip has a first side and a second side, and an encapsulant is provided on the first side of the air pressure sensor chip;
    提供基板，所述基板上贯设有气孔；providing a substrate, the substrate is provided with air holes;
    将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置；installing the first side of the air pressure sensor chip toward the substrate, so that the first side of the air pressure sensor chip is disposed corresponding to the air hole on the substrate;
    在所述气压传感芯片的第二侧设有封装胶。An encapsulant is provided on the second side of the air pressure sensor chip.
  8. 根据权利要求7所述的气压传感组件的封装方法，其中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧，所述支撑围挡与所述芯片主体限定出与所述气孔相对且连通的容腔；The packaging method of the air pressure sensor assembly according to claim 7, wherein the air pressure sensor chip comprises a chip body and a support enclosure, the support enclosure is provided on a side of the chip body facing the air hole, The support enclosure and the chip body define a cavity opposite to and communicated with the air hole;
    所述在所述气压传感芯片的第一侧设有封装胶的步骤包括：The step of disposing the encapsulant on the first side of the air pressure sensor chip includes:
    提供第一UV膜，将所述第一UV膜的粘接面朝上设置；A first UV film is provided, and the adhesive side of the first UV film is set up;
    将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；Adhering the second side of the air pressure sensor chip to the first UV film, so that the first side of the air pressure sensor chip is placed upward;
    向所述容腔内填充封装胶；filling the cavity with encapsulant;
    对所述封装胶进行真空脱泡。Vacuum defoaming is performed on the encapsulant.
  9. 根据权利要求7所述的气压传感组件的封装方法，其中，所述在所述气压传感芯片的第二侧设有封装胶的步骤包括：The packaging method of the air pressure sensor assembly according to claim 7, wherein the step of providing the packaging glue on the second side of the air pressure sensor chip comprises:
    提供一壳体，所述壳体呈筒状设置；A casing is provided, and the casing is arranged in a cylindrical shape;
    将壳体围设所述带有封装胶的气压传感芯片的周侧且固定于所述基板；enclosing the casing around the peripheral side of the air pressure sensor chip with the encapsulant and being fixed on the substrate;
    对所述气压传感芯片的第二侧以及所述气压传感器芯片与所述壳体之间均填充封装胶。The second side of the air pressure sensor chip and the space between the air pressure sensor chip and the casing are filled with encapsulant.
  10. 根据权利要求7所述的气压传感组件的封装方法，其中，所述气压传感芯片包括芯片主体和支撑围挡，所述支撑围挡设于所述芯片主体朝向所述气孔的一侧；The packaging method of the air pressure sensor assembly according to claim 7, wherein the air pressure sensor chip comprises a chip body and a support enclosure, and the support enclosure is provided on a side of the chip body facing the air hole;
    所述将所述气压传感芯片的第一侧朝向所述基板安装，使得所述气压传感芯片的第一侧对应所述基板上的气孔设置的步骤包括：The step of installing the first side of the air pressure sensor chip toward the substrate, so that the first side of the air pressure sensor chip corresponds to the air hole on the substrate, includes:
    翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置；Turning the air pressure sensing chip with the encapsulation glue over, so that the first side of the air pressure sensing chip with the encapsulation glue is placed downward;
    在所述基板上绕着所述气孔周缘进行涂胶，以形成环形胶圈；Applying glue around the periphery of the air hole on the substrate to form an annular rubber ring;
    将所述支撑围挡与所述环形胶圈粘贴固定。The support enclosure and the annular rubber ring are pasted and fixed.
  11. 根据权利要求10所述的气压传感组件的封装方法，其中，提供第一UV膜，将所述第一UV膜的粘接面朝上设置，将所述气压传感芯片的第二侧粘接于所述第一UV膜，使得所述气压传感芯片的第一侧朝上放置；The packaging method of the air pressure sensor assembly according to claim 10, wherein a first UV film is provided, the adhesive surface of the first UV film is set up, and the second side of the air pressure sensor chip is glued connected to the first UV film, so that the first side of the air pressure sensor chip is placed upward;
    所述翻转所述带有封装胶的气压传感芯片，使得所述带有封装胶的气压传感芯片的第一侧朝下放置的步骤包括：The step of turning over the air pressure sensing chip with the encapsulation glue so that the first side of the air pressure sensing chip with the encapsulation glue is placed down includes:
    提供第二UV膜，将所述第二UV膜对应放置于所述第一UV膜上方，使得所述第二UV膜的粘接面与所述支撑围挡粘接；A second UV film is provided, and the second UV film is correspondingly placed above the first UV film, so that the adhesive surface of the second UV film is bonded to the support enclosure;
    调整所述第一UV膜和所述第二UV膜的位置，使得所述第一UV膜位于所述第二UV膜上方；adjusting the positions of the first UV film and the second UV film so that the first UV film is located above the second UV film;
    对所述第一UV膜进行紫外线照射，使得所述第一UV膜与所述支撑围挡分离。The first UV film is irradiated with ultraviolet rays, so that the first UV film is separated from the support enclosure.
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