WO2022111127A1 - Anti-divulgence structure and electronic device - Google Patents

Anti-divulgence structure and electronic device Download PDF

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Publication number
WO2022111127A1
WO2022111127A1 PCT/CN2021/124458 CN2021124458W WO2022111127A1 WO 2022111127 A1 WO2022111127 A1 WO 2022111127A1 CN 2021124458 W CN2021124458 W CN 2021124458W WO 2022111127 A1 WO2022111127 A1 WO 2022111127A1
Authority
WO
WIPO (PCT)
Prior art keywords
security
signal line
wiring layer
tamper
security chip
Prior art date
Application number
PCT/CN2021/124458
Other languages
French (fr)
Chinese (zh)
Inventor
苏小燕
黄茂涵
汤瑞智
吴贤生
Original Assignee
百富计算机技术（深圳）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 百富计算机技术（深圳）有限公司 filed Critical 百富计算机技术（深圳）有限公司
Publication of WO2022111127A1 publication Critical patent/WO2022111127A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00—Details relating to the type of the circuit
    • G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]

Definitions

  • the present application belongs to the technical field of electronic equipment, and in particular relates to an anti-leakage structure and electronic equipment.
  • the existing terminal will build a safe area inside the terminal where sensitive information cannot be obtained by means of destruction, detection, grinding, drilling, chemical corrosion, etc., so as to protect sensitive devices and sensitive signal wiring. Purpose.
  • the security area usually adopts different forms of tamper switches, so that the security area cannot be opened.
  • the core body that constitutes the safety zone is the PCB board.
  • a first-order or second-order complex blind-buried via board design is generally used.
  • the complex stacking design makes the cost high.
  • the purpose of the present application is to provide an anti-leakage structure, which aims to solve the problem of high cost due to the complex structure of the traditional first-order or second-order blind buried via plate.
  • a first aspect of the embodiments of the present application proposes an anti-leakage structure, and the anti-leakage structure includes:
  • the circuit board includes an N wiring layer, wherein at least one through hole is provided between the first wiring layer and the Nth wiring layer of the circuit board;
  • the at least one anti-tamper component is arranged on the outer layer of the circuit board;
  • At least one safety signal line is electrically connected to the tamper-proof component and the security chip, and is wound on the outer layer of the circuit board to form a tamper-proof area or passes through the corresponding circuit board of the circuit board.
  • a through hole is formed on the inner layer of the circuit board to form a tamper-proof area, and when the level of the security signal line changes, the security chip is triggered to erase sensitive information.
  • the security chip and the anti-tamper component are disposed on the same outer layer
  • the first end of the security signal line is connected to the security chip, and the second end of the security signal line is connected to the security chip through the first wiring layer or the Nth wiring layer and a plurality of the anti-disassembly components connection, the safety signal line is also wound on the first wiring layer or the Nth wiring layer to form a tamper-proof area; or
  • the first end of the security signal line is connected to the security chip, and the second end of the security signal line reaches the Nth wiring layer through one of the through holes, and passes through the Nth wiring layer and another
  • the through holes are connected to a plurality of the tamper-proof components, and are connected to the security chip through the first wiring layer; or
  • the first end of the security signal line is connected to the security chip, the second end of the security signal line reaches the first wiring layer through one of the through holes, and passes through the first wiring layer and another
  • the through holes are connected to a plurality of the tamper-proof components, and are connected to the security chip through the Nth wiring layer, and the security signal line is also laid around the first wiring layer and/or the Nth wiring layer.
  • the lines form the tamper-resistant area.
  • the security chip and the anti-tamper component are disposed on different layers;
  • the first end of the security signal line is connected to the security chip, and the second end of the security signal line reaches the other outer layer through one of the through holes and is connected to a plurality of the anti-disassembly components, and passes through another
  • the through hole is connected to the security chip, and the security signal wire is also laid and wound on several wiring layers from the first wiring layer to the N wiring layer to form a tamper-proof area.
  • the anti-tamper component and the security chip are disposed facing the at least one through hole.
  • the anti-leakage structure further includes at least one sensitive device, the at least one sensitive device is disposed on the outer layer of the circuit board, and the sensitive device is directly connected with the security chip or through the at least one communication Corresponding through holes in the holes are connected to the security chip.
  • the security signal wire is wound around the path and connection port between the sensitive device and the security chip.
  • the leak-proof structure further includes a battery, and the battery is electrically connected to the security chip.
  • the first end of the safety signal line is connected to the battery, and the second end of the safety signal line passes through the tamper-proof component and the corresponding through hole and/or wiring layer in the circuit board Connect the security chip after winding.
  • the first end of the safety signal wire is grounded, and the second end of the safety signal wire is wound through the anti-tamper component, the corresponding through hole in the circuit board and/or the wiring layer Connect the security chip and the battery.
  • a second aspect of the embodiments of the present application provides an electronic device, and the electronic device includes the above-mentioned anti-leakage structure.
  • the beneficial effects of the embodiments of the present application are: the above-mentioned circuit board with an anti-leakage structure includes multiple wiring layers, and through holes are arranged between the outer layers, and the safety signal line is wound around the outer layer of the circuit board according to requirements.
  • the wire can be wound on the inner layer of the circuit board through the through hole to form a tamper-proof area.
  • the safety signal wire is connected to the tamper switch and the safety chip, and when the tamper switch or the safety signal wire is damaged, the safety signal wire The level changes, which triggers the security chip to erase sensitive information.
  • FIG. 1 is a schematic structural diagram of a circuit board in an anti-leakage structure provided by an embodiment of the present application
  • FIG. 2 is a first structural schematic diagram of the anti-leakage structure provided by the embodiment of the present application.
  • FIG. 3 is a schematic diagram of a second structure of the anti-leakage structure provided by the embodiment of the present application.
  • FIG. 4 is a third structural schematic diagram of the anti-leakage structure provided by the embodiment of the present application.
  • FIG. 5 is a schematic diagram of a fourth structure of the anti-leakage structure provided by the embodiment of the present application.
  • FIG. 6 is a schematic diagram of a fifth structure of the anti-leakage structure provided by the embodiment of the present application.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plurality means two or more, unless otherwise expressly and specifically defined.
  • a first aspect of the embodiments of the present application provides an anti-leakage structure.
  • the leak-proof structure includes:
  • the circuit board as shown in FIG. 1 , includes N wiring layers L1 to Ln, wherein at least one through hole 11 is provided between the first wiring layer and the Nth wiring layer of the circuit board;
  • At least one tamper-proof component at least one tamper-proof component is arranged on the outer layer of the circuit board;
  • At least one security signal line is electrically connected to the tamper-proof component and the security chip 40, and is wound on the outer layer of the circuit board to form a tamper-proof area or passes through the corresponding connection of the circuit board.
  • the hole 11 is wound on the inner layer of the circuit board to form a tamper-proof area, and the security chip 40 is triggered to erase sensitive information when the level on the security signal line changes.
  • copper foil is arranged on the circuit board to form a wiring layer for signal transmission, and the punching method of the circuit board is L1-Ln, that is, the outer layer of the circuit board is penetrated by a through hole 11 method. It is the connection between the outer layer and the outer layer, and runs through each layer of circuit boards in L1-Ln.
  • the security chip 40 is used to store sensitive information, such as keys, account numbers, etc., and the anti-tamper component is used for mechanical or electrical connection with the housing or other components of the electronic device.
  • the tamper-evident component 22, etc. and switches the switch state when the housing or other components of the electronic device are displaced or destroyed, thereby disconnecting the safety signal line, and switching the level state received by the safety chip 40, the safety chip 40 triggers protection mechanism to erase sensitive information.
  • Both the security chip 40 and the tamper-proof component are arranged on the outer layer of the circuit board, that is, the first wiring layer L1 or the nth wiring layer Ln, and the outer layer or the inner layer of the circuit board can be provided with sensitive signal traces for transmitting sensitive information
  • Sensitive signal traces are connected to the security chip and sensitive devices, where the sensitive devices are used to input and transmit all sensitive information, such as passwords, account numbers, and keys, and the sensitive devices can be keys for entering passwords and card readers for receiving account numbers.
  • the sensitive device can be set on the circuit board or inside the electronic device, and the specific setting position is not limited.
  • the safety signal wire such as the first safety signal wire 31 and the second safety signal wire
  • the signal lines 32 and the like are electrically connected to the security chip 40 and the tamper-evident component, and the connection lines in the middle of the security signal lines correspond to the position of the security chip 40 and the position of the sensitive signal lines used to connect the security chip 40 and external communication equipment.
  • the security signal line can be wound on the outer layer and connected to the security chip 40 and the tamper-proof component to form a tamper-proof area to protect the security chip 40 or the sensitive signal traces in the inner layer against leakage, or the security signal line can be connected from the security chip 40 40, and reach the corresponding position of the anti-disassembly component from the corresponding through hole 11, and then pass through the corresponding through hole 11 to connect the anti-disassembly component to form, and wind the corresponding inner layer to form an anti-disassembly area.
  • the level signal transmitted by the security signal line to the security chip 40 changes, and the security chip 40 triggers the protection mechanism and erases the sensitive information.
  • connection mode between the security signal line and the security chip 40 and the tamper-resistant component can be set correspondingly, that is, dynamic setting and static setting can be adopted.
  • the dynamically arranged security signal line is connected to the security chip 40 after being wound through the tamper-proof component and the corresponding through hole 11 in the circuit board and/or the wiring layer.
  • the middle connection of the safety signal line is wound on the outer layer or through the through hole 11 to form a tamper-proof area on the inner layer.
  • one end of the statically arranged safety signal line is connected to the signal end of another signal line or component, and the other end is connected to the safety chip 40 , and the middle connection line of the safety signal line is wound on the outer layer or passes through the through hole 11
  • the layer winding forms a tamper-proof area, and the security chip 40 judges the received level signal according to the pre-stored level.
  • the security chip 40 triggers the protection mechanism.
  • the circuit board can be equipped with different tamper-proof components on the outer layer, that is, the safety signal line can be connected with the tamper-proof components one by one, or a safety signal line can be connected with multiple tamper-proof components, and the specific connection method can be corresponding to the safety requirements. set up.
  • One end of the security signal line can be connected to a high level or a low level.
  • the signal end of the security chip 40 can be configured to be a high level or a low level, and the type of the level signal and the connection method of the tamper-resistant components can be set accordingly.
  • the tamper-proof component can be a tamper-proof switch or other components with protection capabilities, such as a PCB board or FPC with a safety signal line, a chip with a tamper-proof function, and the tamper-proof switch can be a dome, a pad Wait.
  • the safety signal lines can be wound on the outer layer of the circuit board or through the through holes 11 on the inner layer of the circuit board according to requirements to form a tamper-proof area, and the safety signal lines correspond to Connect the tamper switch and the security chip 40, and when the tamper switch or the security signal line is damaged, the level of the security signal line changes, thereby triggering the security chip 40 to erase sensitive information.
  • the purpose of preventing leakage is achieved, and the purpose of reducing the design cost and simplifying the security scheme is achieved at the same time.
  • the security chip 40 and the anti-tamper component are disposed on the same outer layer;
  • the first end of the safety signal line is connected to the safety chip 40, the second end of the safety signal line is connected to the safety chip 40 through the first wiring layer L1 or the Nth wiring layer Ln and several anti-disassembly components, and the safety signal line is still wired at the first Layer L1 or the Nth wiring layer Ln is wound to form a tamper-proof area; or
  • the first end of the security signal line is connected to the security chip 40, and the second end of the security signal line reaches the Nth wiring layer Ln through a through hole 11, and is connected to several anti-dismantling components through the Nth wiring layer Ln and another through hole 11, and passes through the Nth wiring layer Ln.
  • the first wiring layer L1 is connected to the security chip 40; or
  • the first end of the security signal line is connected to the security chip 40, and the second end of the security signal line reaches the first wiring layer L1 through a through hole 11, and is connected to several anti-dismantling components through the first wiring layer L1 and another through hole 11, and passes through
  • the Nth wiring layer Ln is connected to the security chip 40, and the security signal wire is also laid and wound on the first wiring layer L1 and/or the Nth wiring layer Ln to form a tamper-proof area.
  • the anti-tamper component is the first anti-tamper component 21
  • the security chip 40 and the first anti-tamper component 21 are disposed on the first wiring layer L1
  • the security chip 40 and the first anti-tamper component 21 are The dismantling component 21 has two connection methods, one is to connect directly at the first wiring layer L1 through a safety signal line, and the other is that the safety signal line starts from the signal end of the safety chip 40 and connects between the safety chip 40 and the first anti-disassembly assembly 21.
  • Two through holes 11 are drilled in corresponding positions, and the Nth wiring layer Ln is reached through the through holes 11.
  • the safety signal line is connected to the first anti-disassembly component 21 through another through hole in the corresponding position of the first anti-disassembly component 21. At this time, the safety signal The wire is then connected to the other signal terminal of the security chip 40 through the first wiring layer L1.
  • the security chip 40 and the first anti-dismantle component 21 are arranged on the Nth wiring layer Ln, the security chip 40 and the first anti-dismantle component 21 have two connection methods. One is to directly pass the security chip on the Nth wiring layer Ln.
  • the signal line is connected, or two through holes 11 are punched at the corresponding positions of the security chip 40 and the first anti-disassembly component 21, and the security signal line starts from the signal end of the security chip 40 and passes through the through holes 11 to reach the Nth wiring layer Ln,
  • the security signal line is connected to the first tamper-proof component 21 through the through hole 11 at the corresponding position of the first tamper-proof component 21, and the security signal line is then connected to the other signal end of the security chip 40 through the Nth wiring layer Ln.
  • the security signal line is also laid with windings corresponding to the wiring layer passing through to form a tamper-proof area, so that the security chip 40 is triggered to erase sensitive information when the wiring layer is damaged.
  • the security chip 40 and the anti-tamper component are disposed on different layers;
  • the first end of the safety signal line is connected to the safety chip 40, the second end of the safety signal line reaches the other outer layer through a through hole 11 and is connected with several anti-disassembly components, and is connected to the safety chip 40 through another through hole, and the safety signal line is also Wires are laid on several wiring layers in the first wiring layers L1 to N wiring layers Ln to constitute a tamper-proof area.
  • the security chip 40 is arranged on the first wiring layer L1 , and the second tamper-proof component is arranged on the Nth wiring layer Ln, the security signal
  • the wire is first connected to the security chip 40, and is connected to the second tamper-proof component 22 through the through hole 11, and at the same time, returns to the security chip 40 through another through hole 11, thereby forming a series protection circuit.
  • the tamper-proof area is formed by laying and winding through the wiring layer.
  • the security signal line is first connected to the security chip 40, and then connected to the second tamper-proof device through a through hole 11.
  • the components 22 are connected while returning to the Nth wiring layer Ln through another through hole and connected to the security chip 40, thereby forming a series protection loop.
  • the anti-tamper component and the security chip 40 are disposed facing at least one through hole.
  • the tamper-evident component and the security chip 40 are connected to the outer layer of the first-order circuit board through pads, and holes are punched at the opposite positions and the security signal lines are passed through the corresponding through holes 11 in the middle of L1 to Ln, so as to be connected.
  • the through hole 11 is prevented from being exposed, and the security against leakage is improved.
  • the anti-leakage structure further includes at least one sensitive device Key, the at least one sensitive device Key is disposed on the outer layer of the circuit board, and the sensitive device Key is directly connected to the security chip or is connected to the security chip through a corresponding through hole in the at least one through hole.
  • the security chip 40 is connected.
  • the anti-leakage structure is also provided with a sensitive device Key for operation.
  • the sensitive signal wiring of the sensitive device Key is the same as the wiring of the security signal line, and the sensitive signal wiring located on the outer layer is directly connected to the security chip 40 .
  • the sensitive signal traces located in the inner layer can pass through the corresponding through holes 11 and are connected to the security chip 40 , and the sensitive signal traces can also pass through corresponding associated devices, such as resistors R1 and capacitors.
  • the safety signal wire is wound around the path and connection port between the sensitive device and the safety chip, that is, the wire winding protection is performed on the sensitive signal wire and the connection port of the sensitive device, and the safety signal wire is also protected. It can cover the through hole 11 between the sensitive device Key and the security chip 40, that is, when the sensitive device Key and the security chip 40 need to be connected through the through hole 11, the through hole 11 they pass through needs to be covered by the safety signal line, and the safety signal The wire is wound above or west of the corresponding through hole 11 to form a tamper-proof protection area.
  • the leak-proof structure further includes a battery 50, and the battery 50 is electrically connected to the security chip.
  • the battery 50 provides a high level signal for the safety signal line to realize the static setting of the safety signal line.
  • the safety chip 40 detects the level signal state of the input terminal and triggers the protection mechanism when the level signal changes.
  • the first end of the safety signal line is grounded, and the second end of the safety signal line is connected to the safety signal after winding through a tamper-proof component, a corresponding through hole in a circuit board and/or a wiring layer.
  • Chip 40 and battery 50 are examples of the first end of the safety signal line.
  • the ground pole provides a low level signal to the safety signal line to realize static setting of the safety signal line.
  • the safety chip 40 detects the level signal state of the input terminal and triggers the protection mechanism when the level signal changes.
  • the circuit board may be provided with different anti-tamper switches on the first layer and the nth layer.
  • the anti-tamper switches provided on different outer layers of the circuit board are connected to different security switches.
  • Signal lines, the security chip 40 can monitor different security signal lines respectively, so as to improve the security of the anti-leakage structure.
  • the anti-leakage structure further includes a cover plate, and the cover plate is disposed facing the through hole.
  • the cover plate forms a protection area for the via hole, so as to block the through hole and avoid exposure.
  • the following description takes a six-layer circuit board as an example, and the through holes 11 are correspondingly drilled according to connection requirements.
  • the security chip 40 has four dynamic security signal lines, which are the input terminal P and the output terminal N of the security chip 40 respectively P1-N1, P2-N2, P3-N3, and P4-N4.
  • Restriction 1 The password needs to be protected by a layer 1 security signal line, and can only be routed on the L1 and L2 layers;
  • the winding layer of the safety signal line can only be on the L3-L5 layer, and the P3 and P4 must be mutually wound;
  • Restriction 4 The through hole 11 for sensitive information can only be punched under the protection area of the through hole, and both the front and the back need to be protected by it;
  • Restriction 5 There are only 2 types of via protection areas: 1) Security chip 40; 2) A 4-layer first-order SMD circuit board (protective cover) connected to the signal of the security signal line.
  • P1 Starting from the security chip 40, the L1 layer is connected to the front tamper switch SW1, then the front tamper switch SW2, and finally from the L1 layer back to the N1 end of the security chip 40;
  • P2 Starting from the security chip 40, the L1 layer is connected to the front tamper switch SW3, then the front tamper switch SW4, and finally from the L1 layer back to the N2 end of the security chip 40;
  • the through hole 11 is directly opened, and a protective cover plate is arranged on the back of the through hole 11.
  • Layer L3 and P3 are mutually wound, and the winding range is based on Restriction 3.
  • a through hole 11 is passed under the tamper switch SW6 on the back.
  • another through hole 11 is passed under the back tamper switch SW6, the inner layer is routed to the overlapping area of the through hole protection zone and the security chip 40, the through hole 11 is opened, and the L1 layer is routed to the security chip 40.
  • the present application also proposes an electronic device, which includes an anti-leakage structure.
  • the specific structure of the anti-leakage structure refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it has at least the above-mentioned embodiments. All the beneficial effects brought by the technical solution will not be repeated here.

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Abstract

Provided are an anti-divulgence structure and an electronic device. The anti-divulgence structure comprises a circuit board, at least one anti-dismantle assembly, at least one security signal line, and a security chip, wherein a through hole is provided between outer layers; the security signal line is wound on an outer layer of the circuit board according to a requirement or is wound on an inner layer of the circuit board by means of the through hole, so as to form an anti-dismantle area; the security signal line is correspondingly connected to an anti-dismantle switch and the security chip, and when the anti-dismantle switch or the security signal line is damaged, the level on the security signal line changes so as to trigger the security chip to wipe sensitive information. By means of drilling a through hole, the purposes of reducing design costs and simplifying a security scheme are achieved while achieving the purpose of divulgence prevention.

Description

防泄密结构和电子设备Leak-proof structure and electronic equipment
本申请要求于2020年11月26日在中国专利局提交的、申请号为202011348943.5的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese Patent Application No. 202011348943.5 filed with the Chinese Patent Office on November 26, 2020, the entire contents of which are incorporated herein by reference.
技术领域technical field
本申请属于电子设备技术领域，尤其涉及一种防泄密结构和电子设备。The present application belongs to the technical field of electronic equipment, and in particular relates to an anti-leakage structure and electronic equipment.
背景技术Background technique
现有的终端为防止敏感信息泄露，会在终端内部构建一个无法通过破坏、探测、研磨、钻孔、化学腐蚀等手段获取其中敏感信息的一个安全区域，达到保护敏感器件及敏感信号走线的目的。In order to prevent the leakage of sensitive information, the existing terminal will build a safe area inside the terminal where sensitive information cannot be obtained by means of destruction, detection, grinding, drilling, chemical corrosion, etc., so as to protect sensitive devices and sensitive signal wiring. Purpose.
该安全区域通常采用不同形式的防拆开关，使得安全区域无法被掀开。The security area usually adopts different forms of tamper switches, so that the security area cannot be opened.
构成该安全区的核心主体是PCB板，而为了使PCB板内的走线满足安全要求，一般采用一阶或者二阶等复杂的盲埋孔板设计，复杂的层叠设计使得成本高。The core body that constitutes the safety zone is the PCB board. In order to make the wiring in the PCB board meet the safety requirements, a first-order or second-order complex blind-buried via board design is generally used. The complex stacking design makes the cost high.
技术问题technical problem
本申请的目的在于提供一种防泄密结构，旨在解决传统的一阶或者二阶盲埋孔板存在结构复杂导致成本高的问题。The purpose of the present application is to provide an anti-leakage structure, which aims to solve the problem of high cost due to the complex structure of the traditional first-order or second-order blind buried via plate.
技术解决方案technical solutions
本申请实施例的第一方面提了一种防泄密结构，防泄密结构包括：A first aspect of the embodiments of the present application proposes an anti-leakage structure, and the anti-leakage structure includes:
电路板，所述电路板包括N布线层，其中，所述电路板的第一布线层至第N布线层之间设置有至少一个通孔；a circuit board, the circuit board includes an N wiring layer, wherein at least one through hole is provided between the first wiring layer and the Nth wiring layer of the circuit board;
至少一个防拆组件，所述至少一个防拆组件设置于所述电路板的外层；at least one anti-tamper component, the at least one anti-tamper component is arranged on the outer layer of the circuit board;
至少一条安全信号线，所述至少一条安全信号线与所述防拆组件和安全芯片电性连接，并在所述电路板的外层绕线组成防拆区域或者穿过所述电路板的对应通孔并在所述所述电路板的内层绕线组成防拆区域，以及在所述安全信号线上的电平发生变化时触发所述安全芯片擦除敏感信息。At least one safety signal line, the at least one safety signal line is electrically connected to the tamper-proof component and the security chip, and is wound on the outer layer of the circuit board to form a tamper-proof area or passes through the corresponding circuit board of the circuit board. A through hole is formed on the inner layer of the circuit board to form a tamper-proof area, and when the level of the security signal line changes, the security chip is triggered to erase sensitive information.
在一个实施例中，所述安全芯片与所述防拆组件设置于同一外层；In one embodiment, the security chip and the anti-tamper component are disposed on the same outer layer;
所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过所述第一布线层或者所述第N布线层和若干所述防拆组件与所述安全芯片连接，所述安全信号线还在所述第一布线层或者所述第N布线层绕线组成防拆区域；或者The first end of the security signal line is connected to the security chip, and the second end of the security signal line is connected to the security chip through the first wiring layer or the Nth wiring layer and a plurality of the anti-disassembly components connection, the safety signal line is also wound on the first wiring layer or the Nth wiring layer to form a tamper-proof area; or
所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过一所述通孔到达所述第N布线层，并通过所述第N布线层、另一所述通孔连接若干所述防拆组件，并通过所述第一布线层与所述安全芯片连接；或者The first end of the security signal line is connected to the security chip, and the second end of the security signal line reaches the Nth wiring layer through one of the through holes, and passes through the Nth wiring layer and another The through holes are connected to a plurality of the tamper-proof components, and are connected to the security chip through the first wiring layer; or
所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过一所述通孔到达所述第一布线层，并通过所述第一布线层、另一所述通孔连接若干所述防拆组件，并通过所述第N布线层与所述安全芯片连接，所述安全信号线还在所述第一布线层和/或所述第N布线层铺设绕线组成防拆区域。The first end of the security signal line is connected to the security chip, the second end of the security signal line reaches the first wiring layer through one of the through holes, and passes through the first wiring layer and another The through holes are connected to a plurality of the tamper-proof components, and are connected to the security chip through the Nth wiring layer, and the security signal line is also laid around the first wiring layer and/or the Nth wiring layer. The lines form the tamper-resistant area.
在一个实施例中，所述安全芯片与所述防拆组件设置于不同层；In one embodiment, the security chip and the anti-tamper component are disposed on different layers;
所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过一所述通孔到达另一外层并与若干所述防拆组件连接，以及通过另一所述通孔连接所述安全芯片，所述安全信号线还在所述第一布线层至所述N布线层中的若干布线层铺设绕线组成防拆区域。The first end of the security signal line is connected to the security chip, and the second end of the security signal line reaches the other outer layer through one of the through holes and is connected to a plurality of the anti-disassembly components, and passes through another The through hole is connected to the security chip, and the security signal wire is also laid and wound on several wiring layers from the first wiring layer to the N wiring layer to form a tamper-proof area.
在一个实施例中，所述防拆组件和所述安全芯片正对所述至少一个通孔设置。In one embodiment, the anti-tamper component and the security chip are disposed facing the at least one through hole.
在一个实施例中，所述防泄密结构还包括至少一个敏感器件，所述至少一个敏感器件设置于所述电路板的外层，所述敏感器件与安全芯片直连或者经所述至少一个通孔中的对应通孔与安全芯片连接。In one embodiment, the anti-leakage structure further includes at least one sensitive device, the at least one sensitive device is disposed on the outer layer of the circuit board, and the sensitive device is directly connected with the security chip or through the at least one communication Corresponding through holes in the holes are connected to the security chip.
在一个实施例中，所述安全信号线绕制在所述敏感器件与所述安全芯片之间的路径和连接端口的周围。In one embodiment, the security signal wire is wound around the path and connection port between the sensitive device and the security chip.
在一个实施例中，所述防泄密结构还包括电池，所述电池与所述安全芯片电性连接。In one embodiment, the leak-proof structure further includes a battery, and the battery is electrically connected to the security chip.
在一个实施例中，所述安全信号线的第一端连接所述电池，所述安全信号线的第二端通过所述防拆组件和所述电路板中的对应通孔和/或布线层绕线后连接所述安全芯片。In one embodiment, the first end of the safety signal line is connected to the battery, and the second end of the safety signal line passes through the tamper-proof component and the corresponding through hole and/or wiring layer in the circuit board Connect the security chip after winding.
在一个实施例中，所述安全信号线的第一端接地，所述安全信号线的第二端通过所述防拆组件、所述电路板中的对应通孔和/或布线层绕线后连接所述安全芯片和所述电池。In one embodiment, the first end of the safety signal wire is grounded, and the second end of the safety signal wire is wound through the anti-tamper component, the corresponding through hole in the circuit board and/or the wiring layer Connect the security chip and the battery.
本申请实施例的第二方面提了一种电子设备，电子设备包括如上所述的防泄密结构。A second aspect of the embodiments of the present application provides an electronic device, and the electronic device includes the above-mentioned anti-leakage structure.
有益效果beneficial effect
本申请实施例与现有技术相比存在的有益效果是：上述的防泄密结构的电路板包括多布线层，且在外层之间设置通孔，安全信号线根据需求在电路板的外层绕线或者经过通孔在电路板的内层绕线，组成防拆区域，安全信号线对应连接防拆开关和安全芯片，并在防拆开关或者安全信号线遭到破坏时，安全信号线上的电平发生变化，从而触发安全芯片擦除敏感信息，通过采用通孔打孔方式，在达到防泄密的目的同时达到了降低了设计成本和简化安全方案的目的。Compared with the prior art, the beneficial effects of the embodiments of the present application are: the above-mentioned circuit board with an anti-leakage structure includes multiple wiring layers, and through holes are arranged between the outer layers, and the safety signal line is wound around the outer layer of the circuit board according to requirements. The wire can be wound on the inner layer of the circuit board through the through hole to form a tamper-proof area. The safety signal wire is connected to the tamper switch and the safety chip, and when the tamper switch or the safety signal wire is damaged, the safety signal wire The level changes, which triggers the security chip to erase sensitive information. By using the through-hole drilling method, the purpose of preventing leakage is achieved, and the purpose of reducing the design cost and simplifying the security scheme is achieved.
附图说明Description of drawings
图1为本申请实施例提供的防泄密结构中的电路板的结构示意图；1 is a schematic structural diagram of a circuit board in an anti-leakage structure provided by an embodiment of the present application;
图2为本申请实施例提供的防泄密结构的第一种结构示意图；FIG. 2 is a first structural schematic diagram of the anti-leakage structure provided by the embodiment of the present application;
图3为本申请实施例提供的防泄密结构的第二种结构示意图；3 is a schematic diagram of a second structure of the anti-leakage structure provided by the embodiment of the present application;
图4为本申请实施例提供的防泄密结构的第三种结构示意图；FIG. 4 is a third structural schematic diagram of the anti-leakage structure provided by the embodiment of the present application;
图5为本申请实施例提供的防泄密结构的第四种结构示意图；5 is a schematic diagram of a fourth structure of the anti-leakage structure provided by the embodiment of the present application;
图6为本申请实施例提供的防泄密结构的第五种结构示意图。FIG. 6 is a schematic diagram of a fifth structure of the anti-leakage structure provided by the embodiment of the present application.
本发明的实施方式Embodiments of the present invention
为了使本申请所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the application and simplifying the description, rather than indicating or implying the indicated device. Or elements must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.
本申请实施例的第一方面提了一种防泄密结构。A first aspect of the embodiments of the present application provides an anti-leakage structure.
本实施例中，防泄密结构包括：In this embodiment, the leak-proof structure includes:
电路板，如图1所示，电路板包括N布线层L1~Ln，其中，电路板的第一布线层至第N布线层之间设置有至少一个通孔11；The circuit board, as shown in FIG. 1 , includes N wiring layers L1 to Ln, wherein at least one through hole 11 is provided between the first wiring layer and the Nth wiring layer of the circuit board;
至少一个防拆组件，至少一个防拆组件设置于电路板的外层；at least one tamper-proof component, at least one tamper-proof component is arranged on the outer layer of the circuit board;
至少一条安全信号线；at least one safety signal line;
安全芯片，如图2和图3所示，至少一条安全信号线与防拆组件和安全芯片40电性连接，并在电路板的外层绕线组成防拆区域或者穿过电路板的对应通孔11并在电路板的内层绕线组成防拆区域，以及在安全信号线上的电平发生变化时触发安全芯片40擦除敏感信息。For the security chip, as shown in Figures 2 and 3, at least one security signal line is electrically connected to the tamper-proof component and the security chip 40, and is wound on the outer layer of the circuit board to form a tamper-proof area or passes through the corresponding connection of the circuit board. The hole 11 is wound on the inner layer of the circuit board to form a tamper-proof area, and the security chip 40 is triggered to erase sensitive information when the level on the security signal line changes.
本实施例中，电路板上设置有铜箔用于形成布线层以进行信号传输，电路板打孔方式为L1-Ln，即将电路板的外层采用通孔11方式贯通，通孔11指的是外层与外层连接，且贯穿L1-Ln内的各层电路板。In this embodiment, copper foil is arranged on the circuit board to form a wiring layer for signal transmission, and the punching method of the circuit board is L1-Ln, that is, the outer layer of the circuit board is penetrated by a through hole 11 method. It is the connection between the outer layer and the outer layer, and runs through each layer of circuit boards in L1-Ln.
安全芯片40用于实现存储敏感信息，例如密钥、账号等，防拆组件用于与电子设备的壳体或者其他组件机械或者电气连接，防拆组件可包括第一防拆组件21、第二防拆组件22等，并在电子设备的壳体或者其他组件发生位移或者被破坏时切换开关状态，进而断开安全信号线，并切换安全芯片40接收到的电平状态，安全芯片40触发保护机制，擦除敏感信息。The security chip 40 is used to store sensitive information, such as keys, account numbers, etc., and the anti-tamper component is used for mechanical or electrical connection with the housing or other components of the electronic device. The tamper-evident component 22, etc., and switches the switch state when the housing or other components of the electronic device are displaced or destroyed, thereby disconnecting the safety signal line, and switching the level state received by the safety chip 40, the safety chip 40 triggers protection mechanism to erase sensitive information.
安全芯片40和防拆组件均设置于电路板的外层，即第一布线层L1或者第n布线层Ln，电路板的外层或者内层可设置用于传输敏感信息的敏感信号走线，敏感信号走线连接安全芯片以及敏感器件，其中，敏感器件用于输入传递所有敏感信息，例如密码、账号、密钥，敏感器件可为用于输入密码的按键、用于接收账号的读卡器，以及敏感信号走线经过的各模块，敏感器件可设置于电路板上，或者设置于电子设备的内部，具体设置位置不限，同时，安全信号线例如第一安全信号线31和第二安全信号线32等与安全芯片40和防拆组件电性连接，安全信号线中间的连接线路根据安全芯片40的位置以及用于连通安全芯片40与外界通讯设备之间的敏感信号走线的位置对应设置，安全信号线可在外层绕线并连接安全芯片40和防拆组件，形成防拆区域以对安全芯片40或者内层的敏感信号走线进行防泄密保护，或者，安全信号线从安全芯片40引出，并从对应通孔11到达防拆组件的对应位置，并再经过对应通孔11穿出连接防拆组件形成，在对应的内层绕线形成防拆区域，在安全信号线或者防拆组件受到破坏时，安全信号线传输至安全芯片40的电平信号发生改变，安全芯片40触发保护机制并擦除敏感信息。Both the security chip 40 and the tamper-proof component are arranged on the outer layer of the circuit board, that is, the first wiring layer L1 or the nth wiring layer Ln, and the outer layer or the inner layer of the circuit board can be provided with sensitive signal traces for transmitting sensitive information, Sensitive signal traces are connected to the security chip and sensitive devices, where the sensitive devices are used to input and transmit all sensitive information, such as passwords, account numbers, and keys, and the sensitive devices can be keys for entering passwords and card readers for receiving account numbers. , and each module through which the sensitive signal traces pass. The sensitive device can be set on the circuit board or inside the electronic device, and the specific setting position is not limited. At the same time, the safety signal wire such as the first safety signal wire 31 and the second safety signal wire The signal lines 32 and the like are electrically connected to the security chip 40 and the tamper-evident component, and the connection lines in the middle of the security signal lines correspond to the position of the security chip 40 and the position of the sensitive signal lines used to connect the security chip 40 and external communication equipment. Setting, the security signal line can be wound on the outer layer and connected to the security chip 40 and the tamper-proof component to form a tamper-proof area to protect the security chip 40 or the sensitive signal traces in the inner layer against leakage, or the security signal line can be connected from the security chip 40 40, and reach the corresponding position of the anti-disassembly component from the corresponding through hole 11, and then pass through the corresponding through hole 11 to connect the anti-disassembly component to form, and wind the corresponding inner layer to form an anti-disassembly area. When the disassembled component is damaged, the level signal transmitted by the security signal line to the security chip 40 changes, and the security chip 40 triggers the protection mechanism and erases the sensitive information.
同时，如图2和图3所示，安全信号线与安全芯片40和防拆组件的连接方式可对应设置，即可采取动态设置和静态设置，如图2所示，在一个实施例中，动态设置的安全信号线经防拆组件和电路板中的对应通孔11和/或布线层绕线后连接安全芯片40，由安全芯片40的输出端发出电平信号并经防拆组件反馈至输入端，安全信号线的中间连线在外层绕线或者穿过通孔11在内层绕线形成防拆区域，输入端和输出端的电平信号需保持一致，否则将触发安全芯片40。At the same time, as shown in FIG. 2 and FIG. 3 , the connection mode between the security signal line and the security chip 40 and the tamper-resistant component can be set correspondingly, that is, dynamic setting and static setting can be adopted. As shown in FIG. 2 , in one embodiment, The dynamically arranged security signal line is connected to the security chip 40 after being wound through the tamper-proof component and the corresponding through hole 11 in the circuit board and/or the wiring layer. At the input end, the middle connection of the safety signal line is wound on the outer layer or through the through hole 11 to form a tamper-proof area on the inner layer.
如图3所示，静态设置的安全信号线一端连接另一信号线或者组件的信号端，另一端连接安全芯片40，安全信号线的中间连线在外层绕线或者穿过通孔11在内层绕线形成防拆区域，安全芯片40根据预存的电平判断接收到的电平信号，当电路板上的绕线或者防拆组件被攻击而断开或短路导致电平信号切换或者丢失时，安全芯片40触发保护机制。As shown in FIG. 3 , one end of the statically arranged safety signal line is connected to the signal end of another signal line or component, and the other end is connected to the safety chip 40 , and the middle connection line of the safety signal line is wound on the outer layer or passes through the through hole 11 The layer winding forms a tamper-proof area, and the security chip 40 judges the received level signal according to the pre-stored level. When the winding or tamper-proof component on the circuit board is attacked and disconnected or short-circuited, the level signal is switched or lost. , the security chip 40 triggers the protection mechanism.
电路板可在外层设置不同的防拆组件，即安全信号线可与防拆组件一一连接，或者一个安全信号线的走线上连接有多个防拆组件，具体连接方式可根据安全需求对应设置。The circuit board can be equipped with different tamper-proof components on the outer layer, that is, the safety signal line can be connected with the tamper-proof components one by one, or a safety signal line can be connected with multiple tamper-proof components, and the specific connection method can be corresponding to the safety requirements. set up.
安全信号线一端可接高电平或者低电平，对应地，安全芯片40的信号端可配置为高电平或者低电平，电平信号类型和防拆组件的连接方式可对应设置。One end of the security signal line can be connected to a high level or a low level. Correspondingly, the signal end of the security chip 40 can be configured to be a high level or a low level, and the type of the level signal and the connection method of the tamper-resistant components can be set accordingly.
其中，防拆组件可为防拆开关或者为其他具备保护能力的组件，例如带有安全信号线的PCB板或者FPC，具备防拆功能的芯片，其中防拆开关可为锅仔片、焊盘等。Among them, the tamper-proof component can be a tamper-proof switch or other components with protection capabilities, such as a PCB board or FPC with a safety signal line, a chip with a tamper-proof function, and the tamper-proof switch can be a dome, a pad Wait.
通过在电路板的外层之间设置通孔11，安全信号线根据需求在电路板的外层绕线或者经过通孔11在电路板的内层绕线，组成防拆区域，安全信号线对应连接防拆开关和安全芯片40，并在防拆开关或者安全信号线遭到破坏时，安全信号线上的电平发生变化，从而触发安全芯片40擦除敏感信息，通过采用通孔11打孔方式，在达到防泄密的目的同时达到了降低了设计成本和简化安全方案的目的。By arranging through holes 11 between the outer layers of the circuit board, the safety signal lines can be wound on the outer layer of the circuit board or through the through holes 11 on the inner layer of the circuit board according to requirements to form a tamper-proof area, and the safety signal lines correspond to Connect the tamper switch and the security chip 40, and when the tamper switch or the security signal line is damaged, the level of the security signal line changes, thereby triggering the security chip 40 to erase sensitive information. In this way, the purpose of preventing leakage is achieved, and the purpose of reducing the design cost and simplifying the security scheme is achieved at the same time.
在一个实施例中，安全芯片40与防拆组件设置于同一外层；In one embodiment, the security chip 40 and the anti-tamper component are disposed on the same outer layer;
安全信号线的第一端连接安全芯片40，安全信号线的第二端通过第一布线层L1或者第N布线层Ln和若干防拆组件与安全芯片40连接，安全信号线还在第一布线层L1或者第N布线层Ln绕线组成防拆区域；或者The first end of the safety signal line is connected to the safety chip 40, the second end of the safety signal line is connected to the safety chip 40 through the first wiring layer L1 or the Nth wiring layer Ln and several anti-disassembly components, and the safety signal line is still wired at the first Layer L1 or the Nth wiring layer Ln is wound to form a tamper-proof area; or
安全信号线的第一端连接安全芯片40，安全信号线的第二端通过一通孔11到达第N布线层Ln，并通过第N布线层Ln、另一通孔11连接若干防拆组件，并通过第一布线层L1与安全芯片40连接；或者The first end of the security signal line is connected to the security chip 40, and the second end of the security signal line reaches the Nth wiring layer Ln through a through hole 11, and is connected to several anti-dismantling components through the Nth wiring layer Ln and another through hole 11, and passes through the Nth wiring layer Ln. The first wiring layer L1 is connected to the security chip 40; or
安全信号线的第一端连接安全芯片40，安全信号线的第二端通过一通孔11到达第一布线层L1，并通过第一布线层L1、另一通孔11连接若干防拆组件，并通过第N布线层Ln与安全芯片40连接，安全信号线还在第一布线层L1和/或第N布线层Ln铺设绕线组成防拆区域。The first end of the security signal line is connected to the security chip 40, and the second end of the security signal line reaches the first wiring layer L1 through a through hole 11, and is connected to several anti-dismantling components through the first wiring layer L1 and another through hole 11, and passes through The Nth wiring layer Ln is connected to the security chip 40, and the security signal wire is also laid and wound on the first wiring layer L1 and/or the Nth wiring layer Ln to form a tamper-proof area.
本实施例中，如图1所示，假设防拆组件为第一防拆组件21，当安全芯片40与第一防拆组件21设置于第一布线层L1时，安全芯片40与第一防拆组件21具有两种连接方式，一是直接在第一布线层L1通过安全信号线连接，二是安全信号线从安全芯片40的信号端出发，在安全芯片40和第一防拆组件21的对应位置打两个通孔11，并经过通孔11到达第N布线层Ln，安全信号线通过第一防拆组件21的对应位置的另一通孔连接第一防拆组件21，此时安全信号线再通过第一布线层L1连接至安全芯片40的另一信号端。In this embodiment, as shown in FIG. 1 , assuming that the anti-tamper component is the first anti-tamper component 21 , when the security chip 40 and the first anti-tamper component 21 are disposed on the first wiring layer L1 , the security chip 40 and the first anti-tamper component 21 are The dismantling component 21 has two connection methods, one is to connect directly at the first wiring layer L1 through a safety signal line, and the other is that the safety signal line starts from the signal end of the safety chip 40 and connects between the safety chip 40 and the first anti-disassembly assembly 21. Two through holes 11 are drilled in corresponding positions, and the Nth wiring layer Ln is reached through the through holes 11. The safety signal line is connected to the first anti-disassembly component 21 through another through hole in the corresponding position of the first anti-disassembly component 21. At this time, the safety signal The wire is then connected to the other signal terminal of the security chip 40 through the first wiring layer L1.
同理，当安全芯片40与第一防拆组件21设置于第N布线层Ln时，安全芯片40与第一防拆组件21具有两种连接方式，一是直接在第N布线层Ln通过安全信号线连接，或者在安全芯片40和第一防拆组件21的对应位置打两个通孔11，安全信号线从安全芯片40的信号端出发、并经过通孔11到达第N布线层Ln，此处安全信号线通过第一防拆组件21的对应位置的通孔11连接第一防拆组件21，此时安全信号线再通过第N布线层Ln连接至安全芯片40的另一信号端。Similarly, when the security chip 40 and the first anti-dismantle component 21 are arranged on the Nth wiring layer Ln, the security chip 40 and the first anti-dismantle component 21 have two connection methods. One is to directly pass the security chip on the Nth wiring layer Ln. The signal line is connected, or two through holes 11 are punched at the corresponding positions of the security chip 40 and the first anti-disassembly component 21, and the security signal line starts from the signal end of the security chip 40 and passes through the through holes 11 to reach the Nth wiring layer Ln, Here, the security signal line is connected to the first tamper-proof component 21 through the through hole 11 at the corresponding position of the first tamper-proof component 21, and the security signal line is then connected to the other signal end of the security chip 40 through the Nth wiring layer Ln.
同时，根据不同安全限制条件，安全信号线还在经过的布线层对应铺设绕线组成防拆区域，从而在布线层在受到破坏时触发安全芯片40擦除敏感信息。At the same time, according to different security restrictions, the security signal line is also laid with windings corresponding to the wiring layer passing through to form a tamper-proof area, so that the security chip 40 is triggered to erase sensitive information when the wiring layer is damaged.
在一个实施例中，安全芯片40与防拆组件设置于不同层；In one embodiment, the security chip 40 and the anti-tamper component are disposed on different layers;
安全信号线的第一端连接安全芯片40，安全信号线的第二端通过一通孔11到达另一外层并与若干防拆组件连接，以及通过另一通孔连接安全芯片40，安全信号线还在第一布线层L1至N布线层Ln中的若干布线层铺设绕线组成防拆区域。The first end of the safety signal line is connected to the safety chip 40, the second end of the safety signal line reaches the other outer layer through a through hole 11 and is connected with several anti-disassembly components, and is connected to the safety chip 40 through another through hole, and the safety signal line is also Wires are laid on several wiring layers in the first wiring layers L1 to N wiring layers Ln to constitute a tamper-proof area.
本实施例中，如图1所示，当防拆组件为第二防拆组件22，安全芯片40设置在第一布线层L1，第二防拆组件设置于第N布线层Ln时，安全信号线先与安全芯片40连接，并通过通孔11与第二防拆组件22连接，同时，通过另一通孔11返回至安全芯片40，从而形成串联保护回路，同时，根据不同安全限制条件在对应通过的布线层进行铺设绕线组成防拆区域。In this embodiment, as shown in FIG. 1 , when the anti-tamper component is the second anti-tamper component 22 , the security chip 40 is arranged on the first wiring layer L1 , and the second tamper-proof component is arranged on the Nth wiring layer Ln, the security signal The wire is first connected to the security chip 40, and is connected to the second tamper-proof component 22 through the through hole 11, and at the same time, returns to the security chip 40 through another through hole 11, thereby forming a series protection circuit. The tamper-proof area is formed by laying and winding through the wiring layer.
同理，当第二防拆组件22设置在第一布线层L1，安全芯片40设置于第N布线层Ln时，安全信号线先与安全芯片40连接，并通过一通孔11与第二防拆组件22连接，同时通过另一通孔返回第N布线层Ln并与安全芯片40连接，从而形成串联保护回路。Similarly, when the second tamper-proof component 22 is arranged on the first wiring layer L1 and the security chip 40 is arranged on the Nth wiring layer Ln, the security signal line is first connected to the security chip 40, and then connected to the second tamper-proof device through a through hole 11. The components 22 are connected while returning to the Nth wiring layer Ln through another through hole and connected to the security chip 40, thereby forming a series protection loop.
如图1所示，在一个实施例中，防拆组件和安全芯片40正对至少一个通孔设置。As shown in FIG. 1 , in one embodiment, the anti-tamper component and the security chip 40 are disposed facing at least one through hole.
本实施例中，防拆组件和安全芯片40通过焊盘连接在一阶电路板的外层，并在正对位置打孔并将安全信号线通过L1~Ln中间的对应通孔11，从而连接至防拆组件和安全芯片40，避免通孔11外露，提高防泄密安全性。In this embodiment, the tamper-evident component and the security chip 40 are connected to the outer layer of the first-order circuit board through pads, and holes are punched at the opposite positions and the security signal lines are passed through the corresponding through holes 11 in the middle of L1 to Ln, so as to be connected. To the anti-disassembly component and the security chip 40, the through hole 11 is prevented from being exposed, and the security against leakage is improved.
在一个实施例中，防泄密结构还包括至少一个敏感器件Key，至少一个敏感器件Key设置于电路板的外层，敏感器件Key与安全芯片直连或者经至少一个通孔中的对应通孔与安全芯片40连接。In one embodiment, the anti-leakage structure further includes at least one sensitive device Key, the at least one sensitive device Key is disposed on the outer layer of the circuit board, and the sensitive device Key is directly connected to the security chip or is connected to the security chip through a corresponding through hole in the at least one through hole. The security chip 40 is connected.
本实施例中，防泄密结构上还设置有用于操作的敏感器件Key，敏感器件Key的敏感信号走线与安全信号线的走线相同，位于外层的敏感信号走线与安全芯片40直连，位于内层的敏感信号走线可经过对应的通孔11并与安全芯片40连接，敏感信号走线还可经过对应的关联器件，例如电阻R1、电容等。In this embodiment, the anti-leakage structure is also provided with a sensitive device Key for operation. The sensitive signal wiring of the sensitive device Key is the same as the wiring of the security signal line, and the sensitive signal wiring located on the outer layer is directly connected to the security chip 40 . , the sensitive signal traces located in the inner layer can pass through the corresponding through holes 11 and are connected to the security chip 40 , and the sensitive signal traces can also pass through corresponding associated devices, such as resistors R1 and capacitors.
进一步地，为了提高安全性，安全信号线绕制在敏感器件与安全芯片之间的路径和连接端口的周围，即对敏感信号走线以及敏感器件的连接端口进行绕线防护，安全信号线还可覆盖敏感器件Key与安全芯片40之间的通孔11，即当敏感器件Key与安全芯片40需要经过通孔11连接时，其所经过的通孔11均需被安全信号线覆盖，安全信号线在对应通孔11的上方或者西方绕线形成防拆保护区域。Further, in order to improve security, the safety signal wire is wound around the path and connection port between the sensitive device and the safety chip, that is, the wire winding protection is performed on the sensitive signal wire and the connection port of the sensitive device, and the safety signal wire is also protected. It can cover the through hole 11 between the sensitive device Key and the security chip 40, that is, when the sensitive device Key and the security chip 40 need to be connected through the through hole 11, the through hole 11 they pass through needs to be covered by the safety signal line, and the safety signal The wire is wound above or west of the corresponding through hole 11 to form a tamper-proof protection area.
在一个实施例中，防泄密结构还包括电池50，电池50与安全芯片电性连接。In one embodiment, the leak-proof structure further includes a battery 50, and the battery 50 is electrically connected to the security chip.
本实施例中，由电池50为安全信号线提供高电平信号，实现安全信号线静态设置，安全芯片40检测输入端的电平信号状态，并在电平信号发生变化时触发保护机制。In this embodiment, the battery 50 provides a high level signal for the safety signal line to realize the static setting of the safety signal line. The safety chip 40 detects the level signal state of the input terminal and triggers the protection mechanism when the level signal changes.
如图6所示，在一个实施例中，安全信号线的第一端接地，安全信号线的第二端通过防拆组件、电路板中的对应通孔和/或布线层绕线后连接安全芯片40和电池50。As shown in FIG. 6 , in one embodiment, the first end of the safety signal line is grounded, and the second end of the safety signal line is connected to the safety signal after winding through a tamper-proof component, a corresponding through hole in a circuit board and/or a wiring layer. Chip 40 and battery 50 .
本实施例中，由地极为安全信号线提供低电平信号，实现安全信号线静态设置，安全芯片40检测输入端的电平信号状态，并在电平信号发生变化时触发保护机制。In this embodiment, the ground pole provides a low level signal to the safety signal line to realize static setting of the safety signal line. The safety chip 40 detects the level signal state of the input terminal and triggers the protection mechanism when the level signal changes.
在一个实施例中，电路板可能在第一层和第n层设置不同的防拆开关，为了避免联动，在一个实施例中，设置于电路板的不同外层的防拆组件连接不同的安全信号线，安全芯片40可对不同的安全信号线分别监测，提高防泄密结构的安全性。In one embodiment, the circuit board may be provided with different anti-tamper switches on the first layer and the nth layer. In order to avoid linkage, in one embodiment, the anti-tamper switches provided on different outer layers of the circuit board are connected to different security switches. Signal lines, the security chip 40 can monitor different security signal lines respectively, so as to improve the security of the anti-leakage structure.
在一个实施例中，所述防泄密结构还包括盖板，所述盖板正对所述通孔设置，本实施例中，安全芯片通过通孔连接安全信号线时，通孔的另一面设置盖板，形成过孔保护区，从而遮挡通孔，避免外露。In one embodiment, the anti-leakage structure further includes a cover plate, and the cover plate is disposed facing the through hole. In this embodiment, when the security chip is connected to the safety signal line through the through hole, the other side of the through hole is disposed The cover plate forms a protection area for the via hole, so as to block the through hole and avoid exposure.
以下以六层电路板为例说明，通孔11根据连接需求对应打孔。The following description takes a six-layer circuit board as an example, and the through holes 11 are correspondingly drilled according to connection requirements.
假设敏感信息仅包含密码，所有器件在第一布线层L1，一阶电路板的正面设置4个防拆开关SW1~SW4、背面设置2个防拆开关SW5~SW6。Assuming that the sensitive information only contains passwords, all devices are located on the first wiring layer L1. Four anti-tamper switches SW1~SW4 are set on the front of the first-order circuit board, and two anti-tamper switches SW5~SW6 are set on the back.
安全芯片40有4条动态安全信号线，分别为安全芯片40的输入端P和输出端N分别P1-N1、P2-N2、P3-N3、P4-N4。The security chip 40 has four dynamic security signal lines, which are the input terminal P and the output terminal N of the security chip 40 respectively P1-N1, P2-N2, P3-N3, and P4-N4.
且防泄密结构设置有多个限制要求：And the anti-leakage structure is set with multiple restrictions:
限制要求1：密码需要受到1层安全信号线保护，且只能在L1,L2层走线；Restriction 1: The password needs to be protected by a layer 1 security signal line, and can only be routed on the L1 and L2 layers;
限制要求2：安全信号线的绕线层只能在L3-L5层，且必须是P3和P4互绕；Restriction 2: The winding layer of the safety signal line can only be on the L3-L5 layer, and the P3 and P4 must be mutually wound;
限制要求3：安全信号线绕线必须覆盖所有L1、L2层的安全信号线信号和密码；Restriction Requirement 3: The winding of the safety signal line must cover all the safety signal line signals and passwords of the L1 and L2 layers;
限制要求4：敏感信息的通孔11只能打在过孔保护区下方，正面和背面都需要受其保护；Restriction 4: The through hole 11 for sensitive information can only be punched under the protection area of the through hole, and both the front and the back need to be protected by it;
限制要求5：过孔保护区有且仅有2种形式：1）安全芯片40；2）一个接入安全信号线信号的4层一阶贴板电路板（保护作用的盖板）。Restriction 5: There are only 2 types of via protection areas: 1) Security chip 40; 2) A 4-layer first-order SMD circuit board (protective cover) connected to the signal of the security signal line.
则可选的设计方案示例为：An example of an optional design scheme is:
则可选的设计方案示例为：An example of an optional design scheme is:
1）P1：从安全芯片40出发，L1层接入正面防拆开关SW1，再接入正面防拆开关SW2，最后从L1层回到安全芯片40的N1端；1) P1: Starting from the security chip 40, the L1 layer is connected to the front tamper switch SW1, then the front tamper switch SW2, and finally from the L1 layer back to the N1 end of the security chip 40;
2）P2：从安全芯片40出发，L1层接入正面防拆开关SW3，再接入正面防拆开关SW4，最后从L1层回到安全芯片40的N2端；2) P2: Starting from the security chip 40, the L1 layer is connected to the front tamper switch SW3, then the front tamper switch SW4, and finally from the L1 layer back to the N2 end of the security chip 40;
3）Key信号：从安全芯片40出发，L1走线至敏感器件，同理，L1走线到关联焊盘或器件，最后再回到安全芯片40；3) Key signal: starting from the security chip 40, L1 is routed to the sensitive device, and similarly, the L1 is routed to the associated pad or device, and finally back to the security chip 40;
4）从安全芯片40出发，直接打通孔11，通孔11背面设置保护作用的盖板，L3层和P4互相绕线，绕线范围依据限制要求3。绕完后，在背面防拆开关SW5下方，经过一个通孔11，再然后在背面防拆开关SW5下方经过另一通孔11，L1层走线到安全芯片40。4) Starting from the security chip 40, directly punch through the hole 11, and set a protective cover on the back of the through hole 11. Layer L3 and P4 are mutually wound, and the winding range is based on Restriction Requirement 3. After the winding is completed, a through hole 11 is passed under the back anti-dismantle switch SW5, and then another through hole 11 is passed under the back anti-dismantle switch SW5, and the L1 layer is routed to the security chip 40.
5）从安全芯片40出发，直接打通孔11，通孔11背面设置保护作用的盖板。L3层和P3互相绕线，绕线范围依据限制要求3。绕完后，在背面防拆开关SW6下方，经过一个通孔11。再然后在背面防拆开关SW6下方经过另一通孔11，内层走线到过孔保护区与安全芯片40重叠区域，打通孔11，L1层走线到安全芯片40。5) Starting from the security chip 40, the through hole 11 is directly opened, and a protective cover plate is arranged on the back of the through hole 11. Layer L3 and P3 are mutually wound, and the winding range is based on Restriction 3. After winding, a through hole 11 is passed under the tamper switch SW6 on the back. Then another through hole 11 is passed under the back tamper switch SW6, the inner layer is routed to the overlapping area of the through hole protection zone and the security chip 40, the through hole 11 is opened, and the L1 layer is routed to the security chip 40.
通过采用电路板通孔11打孔方式，在达到防泄密的目的同时达到了降低了设计成本和简化安全方案的目的。By using the punching method of the through holes 11 of the circuit board, the purpose of preventing leakage is achieved, and the purpose of reducing the design cost and simplifying the security scheme is achieved.
本申请还提出一种电子设备，该电子设备包括防泄密结构，该防泄密结构的具体结构参照上述实施例，由于本电子设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。The present application also proposes an electronic device, which includes an anti-leakage structure. The specific structure of the anti-leakage structure refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it has at least the above-mentioned embodiments. All the beneficial effects brought by the technical solution will not be repeated here.
以上所述实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围，均应包含在本申请的保护范围之内。The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that: it can still be used for the above-mentioned implementations. The technical solutions described in the examples are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the application, and should be included in the within the scope of protection of this application.

Claims (10)

  1. 一种防泄密结构，其特征在于，包括：An anti-leakage structure, characterized in that it includes:
    电路板，所述电路板包括N布线层，其中，所述电路板的第一布线层至第N布线层之间设置有至少一个通孔；a circuit board, the circuit board includes an N wiring layer, wherein at least one through hole is provided between the first wiring layer and the Nth wiring layer of the circuit board;
    至少一个防拆组件，所述至少一个防拆组件设置于所述电路板的外层；at least one anti-tamper component, the at least one anti-tamper component is arranged on the outer layer of the circuit board;
    至少一条安全信号线；at least one safety signal line;
    安全芯片，所述至少一条安全信号线与所述防拆组件和所述安全芯片电性连接，并在所述电路板的外层绕线组成防拆区域或者穿过所述电路板的对应通孔并在所述所述电路板的内层绕线组成防拆区域，以及在所述安全信号线上的电平发生变化时触发所述安全芯片擦除敏感信息。A security chip, the at least one security signal wire is electrically connected with the anti-tamper component and the security chip, and is wound on the outer layer of the circuit board to form a tamper-proof area or passes through the corresponding connection of the circuit board. A hole is formed on the inner layer of the circuit board to form a tamper-proof area, and when the level on the security signal line changes, the security chip is triggered to erase sensitive information.
  2. 如权利要求1所述的防泄密结构，其特征在于，所述安全芯片与所述防拆组件设置于同一外层； The anti-leakage structure according to claim 1, wherein the security chip and the anti-disassembly component are arranged on the same outer layer;
    所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过所述第一布线层或者所述第N布线层和若干所述防拆组件与所述安全芯片连接，所述安全信号线还在所述第一布线层或者所述第N布线层绕线组成防拆区域；或者The first end of the security signal line is connected to the security chip, and the second end of the security signal line is connected to the security chip through the first wiring layer or the Nth wiring layer and a plurality of the anti-disassembly components connection, the safety signal line is also wound on the first wiring layer or the Nth wiring layer to form a tamper-proof area; or
    所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过一所述通孔到达所述第N布线层，并通过所述第N布线层、另一所述通孔连接若干所述防拆组件，并通过所述第一布线层与所述安全芯片连接；或者The first end of the security signal line is connected to the security chip, and the second end of the security signal line reaches the Nth wiring layer through one of the through holes, and passes through the Nth wiring layer and another The through holes are connected to a plurality of the tamper-proof components, and are connected to the security chip through the first wiring layer; or
    所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过一所述通孔到达所述第一布线层，并通过所述第一布线层、另一所述通孔连接若干所述防拆组件，并通过所述第N布线层与所述安全芯片连接，所述安全信号线还在所述第一布线层和/或所述第N布线层铺设绕线组成防拆区域。The first end of the security signal line is connected to the security chip, the second end of the security signal line reaches the first wiring layer through one of the through holes, and passes through the first wiring layer and another The through holes are connected to a plurality of the anti-tamper components, and are connected to the security chip through the Nth wiring layer, and the security signal line is also laid around the first wiring layer and/or the Nth wiring layer. The lines form the tamper-resistant area.
  3. 如权利要求2所述的防泄密结构，其特征在于，所述安全芯片与所述防拆组件设置于不同层； The anti-leakage structure according to claim 2, wherein the security chip and the anti-disassembly component are arranged on different layers;
    所述安全信号线的第一端连接所述安全芯片，所述安全信号线的第二端通过一所述通孔到达另一外层并与若干所述防拆组件连接，以及通过另一所述通孔连接所述安全芯片，所述安全信号线还在所述第一布线层至所述N布线层中的若干布线层铺设绕线组成防拆区域。The first end of the security signal line is connected to the security chip, and the second end of the security signal line reaches the other outer layer through one of the through holes and is connected to a plurality of the anti-disassembly components, and passes through another The through hole is connected to the security chip, and the security signal wire is also laid and wound on several wiring layers from the first wiring layer to the N wiring layer to form a tamper-proof area.
  4. 如权利要求1所述的防泄密结构，其特征在于，所述防拆组件和所述安全芯片正对所述至少一个通孔设置。 The anti-leakage structure according to claim 1, wherein the anti-tamper component and the security chip are disposed facing the at least one through hole.
  5. 如权利要求1所述的防泄密结构，其特征在于，所述防泄密结构还包括至少一个敏感器件，所述至少一个敏感器件设置于所述电路板的外层，所述敏感器件与安全芯片直连或者经所述至少一个通孔中的对应通孔与安全芯片连接。 The anti-leakage structure according to claim 1, wherein the anti-leakage structure further comprises at least one sensitive device, the at least one sensitive device is disposed on the outer layer of the circuit board, and the sensitive device is connected to the security chip. The connection to the security chip is directly connected or via a corresponding one of the at least one through-holes.
  6. 如权利要求5所述的防泄密结构，其特征在于，所述安全信号线绕制在所述敏感器件与所述安全芯片之间的路径和连接端口的周围。 The anti-leakage structure according to claim 5, wherein the security signal wire is wound around the path and the connection port between the sensitive device and the security chip.
  7. 如权利要求1所述的防泄密结构，其特征在于，所述防泄密结构还包括电池，所述电池与所述安全芯片电性连接。 The leak-proof structure according to claim 1, wherein the leak-proof structure further comprises a battery, and the battery is electrically connected to the security chip.
  8. 如权利要求7所述的防泄密结构，其特征在于，所述安全信号线的第一端连接所述电池，所述安全信号线的第二端通过所述防拆组件和所述电路板中的对应通孔和/或布线层绕线后连接所述安全芯片。 The leak-proof structure according to claim 7, wherein the first end of the safety signal line is connected to the battery, and the second end of the safety signal line passes through the tamper-proof assembly and the circuit board. The corresponding through holes and/or the wiring layer are wired to connect to the security chip.
  9. 如权利要求7所述的防泄密结构，其特征在于，所述安全信号线的第一端接地，所述安全信号线的第二端通过所述防拆组件、所述电路板中的对应通孔和/或布线层绕线后连接所述安全芯片和所述电池。 The anti-leakage structure according to claim 7, wherein the first end of the safety signal line is grounded, and the second end of the safety signal line passes through the anti-disassembly component and the corresponding connection in the circuit board. The safety chip and the battery are connected after the hole and/or the wiring layer is wound.
  10. 一种电子设备，其特征在于，包括如权利要求1~9任一项所述的防泄密结构。 An electronic device, characterized by comprising the leak-proof structure according to any one of claims 1 to 9.
PCT/CN2021/124458 2020-11-26 2021-10-18 Anti-divulgence structure and electronic device WO2022111127A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117829084A (en) * 2024-03-04 2024-04-05 杭州广立微电子股份有限公司 Three-dimensional grid winding method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566357A (en) * 2020-11-26 2021-03-26 百富计算机技术（深圳）有限公司 Anti-disclosure structure and electronic equipment
CN114814531B (en) * 2022-03-30 2024-04-30 上海先楫半导体科技有限公司 Chip safety test circuit and logic chip
CN115148118A (en) * 2022-07-07 2022-10-04 黑芝麻智能科技有限公司 Flexible circuit board and display device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101615235A (en) * 2009-08-04 2009-12-30 青岛海信智能商用设备有限公司 A kind of self-destruction system for memory data
US20160374195A1 (en) * 2015-06-16 2016-12-22 Ingenico Group Component for the protection of sensitive signals, corresponding device and method
CN206961266U (en) * 2017-06-12 2018-02-02 深圳九磊科技有限公司 The button safety device of POS and POS
CN209710414U (en) * 2018-12-12 2019-11-29 百富计算机技术（深圳）有限公司 Sensitive Apparatus protects structure and POS machine
CN210924799U (en) * 2019-12-20 2020-07-03 上海动联信息技术股份有限公司 POS machine multilayer through-hole protection apron
CN211653795U (en) * 2020-03-25 2020-10-09 百富计算机技术（深圳）有限公司 Tamper pin extension circuit and POS machine
CN112395653A (en) * 2020-11-26 2021-02-23 百富计算机技术（深圳）有限公司 Anti-disclosure structure and electronic equipment
CN112566357A (en) * 2020-11-26 2021-03-26 百富计算机技术（深圳）有限公司 Anti-disclosure structure and electronic equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102858082B (en) * 2012-09-26 2015-06-10 深圳市九思泰达技术有限公司 Protective structure for safe area of core module
CN104992506A (en) * 2015-07-06 2015-10-21 福建升腾资讯有限公司 LAP (laser activating plating) technology-based POS machine security design method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101615235A (en) * 2009-08-04 2009-12-30 青岛海信智能商用设备有限公司 A kind of self-destruction system for memory data
US20160374195A1 (en) * 2015-06-16 2016-12-22 Ingenico Group Component for the protection of sensitive signals, corresponding device and method
CN206961266U (en) * 2017-06-12 2018-02-02 深圳九磊科技有限公司 The button safety device of POS and POS
CN209710414U (en) * 2018-12-12 2019-11-29 百富计算机技术（深圳）有限公司 Sensitive Apparatus protects structure and POS machine
CN210924799U (en) * 2019-12-20 2020-07-03 上海动联信息技术股份有限公司 POS machine multilayer through-hole protection apron
CN211653795U (en) * 2020-03-25 2020-10-09 百富计算机技术（深圳）有限公司 Tamper pin extension circuit and POS machine
CN112395653A (en) * 2020-11-26 2021-02-23 百富计算机技术（深圳）有限公司 Anti-disclosure structure and electronic equipment
CN112566357A (en) * 2020-11-26 2021-03-26 百富计算机技术（深圳）有限公司 Anti-disclosure structure and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117829084A (en) * 2024-03-04 2024-04-05 杭州广立微电子股份有限公司 Three-dimensional grid winding method
CN117829084B (en) * 2024-03-04 2024-05-14 杭州广立微电子股份有限公司 Three-dimensional grid winding method

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