WO2022103159A1 - Antenna module and wireless communication terminal comprising same - Google Patents

Antenna module and wireless communication terminal comprising same Download PDF

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Publication number
WO2022103159A1
WO2022103159A1 PCT/KR2021/016364 KR2021016364W WO2022103159A1 WO 2022103159 A1 WO2022103159 A1 WO 2022103159A1 KR 2021016364 W KR2021016364 W KR 2021016364W WO 2022103159 A1 WO2022103159 A1 WO 2022103159A1
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Prior art keywords
antenna
ground
antenna module
injection
wireless communication
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PCT/KR2021/016364
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French (fr)
Korean (ko)
Inventor
박상용
오정한
손관우
김용호
Original Assignee
주식회사 이엠따블유
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Publication of WO2022103159A1 publication Critical patent/WO2022103159A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
    • H01Q5/25—Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems

Definitions

  • the present invention relates to an antenna module and a wireless communication terminal including the same, and more particularly, by forming an antenna radiator on one surface of a dielectric injection-molded plastic material constituting the antenna module and placing a metallic ground on the other surface of the injection-molded product, It relates to an antenna module capable of improving production efficiency by shortening the time required to form a ground, and a wireless communication terminal including the same.
  • a wireless communication terminal must include an antenna.
  • Existing external antennas spoil the appearance and cause inconvenience to users. Recently, technology development related to internal antennas has been actively carried out.
  • Such an antenna is implemented by forming a radiation circuit pattern on one (Top) side of the injection-molded material and forming a ground pattern on the other (bottom) surface using a plating method after etching the injection-molded material.
  • the ground pattern area compared to the radiation circuit pattern area Since it is a large area, the process of etching and plating the ground pattern takes a long time, so there is a problem in that the process tact-time increases.
  • Patent Document 1 Korean Patent Publication No. 10-1595026 (2016.02.11)
  • the present invention forms an antenna radiator on one surface of a plastic-based dielectric injection-molded material constituting an antenna module, and forms a ground by placing a metallic ground on the other surface of the injection-molded product.
  • an antenna module capable of improving production efficiency by shortening the time required to do so, and a wireless communication terminal including the same.
  • an antenna module disposed in a wireless communication terminal to transmit/receive signals, comprising: an antenna formed on one surface of an injection-molded product; and a metal ground provided on the other surface of the injection-molded product, to provide an antenna module.
  • An end of the ground may include an extension extending outwardly, and the extension may be fixed to a fixing unit formed inside the wireless communication terminal.
  • the antenna may be formed by patterning the injection-molded product using a laser and then plating.
  • the antenna may be formed by a Molded Interconnection Device (MID) method.
  • MID Molded Interconnection Device
  • the antenna may be an Ultra Wide Band (UWB) antenna.
  • UWB Ultra Wide Band
  • the antenna and the ground may be electrically connected.
  • the antenna and the ground may be coupled and connected by a gap formed by the injection-molded product.
  • the extension part may be formed in plurality, and the extension part and the fixing part may be coupled by a fixing means.
  • the ground may include Cu.
  • An application processor may be provided on one surface of the substrate, and the ground may be fixed to be in close contact with the AP.
  • the wireless communication terminal includes a metal case forming an outer shape, the fixing part is formed in the metal case, the extension part is formed in plurality, and at least one of the extension parts mediates the fixing part to be connected to the case made of a metal material.
  • It may further include a fixing part formed on the case made of a metal, and a plurality of extension parts protruding outwardly and extending are formed at the end of the ground, and at least one of the extension parts may be fixed to the fixing part.
  • An application processor may be provided on one surface of the substrate, the ground may be fixed to be in close contact with the AP, and at least one of the extension portions may be connected to the metal case through the fixing portion as a medium.
  • the time required to form the ground is shortened, resulting in production efficiency has the effect of improving
  • the ground is made of a metallic material, the directivity of the antenna radiator is improved and signal noise is shielded, thereby improving the performance of the antenna.
  • FIG 1 and 2 are reference diagrams for explaining an antenna module according to an embodiment of the present invention.
  • FIG. 3 is a reference diagram for explaining a modified example of the antenna module according to an embodiment of the present invention.
  • FIGS. 1 and 2 are reference views for explaining an antenna module according to an embodiment of the present invention.
  • the antenna module according to this embodiment is disposed in a wireless communication terminal to transmit/receive signals receive
  • the antenna module according to the present embodiment may include the antenna 100 and the ground 200 .
  • the antenna 100 may be formed on one surface of the injection-molded product 50 .
  • the injection molding 50 may be formed of an insulating material by injection molding.
  • the injection molding 50 may be formed of a synthetic resin material such as polyester resin or polycarbonate (PC) in order to maintain weather resistance, impact resistance, and mechanical strength.
  • the injection-molded product 50 may be a carrier of the antenna 100 , but the material and type of the injection-molded product 50 are not limited thereto.
  • the antenna 100 may be formed on one surface of the injection-molded product 50 .
  • “one surface” may be the “top surface” of the injection-molded product 50 in the drawing.
  • the antenna 100 is used for transmission and reception of a signal (eg, a wireless communication signal) and is a configuration that is fed by a PCB and radiates a signal into space, and is formed on one surface of the injection product 50 to transmit/receive a wireless signal.
  • a signal eg, a wireless communication signal
  • the antenna 100 may be patterned on one surface of the injection product 50 using a laser and then formed by plating or printing, or may be formed by a Laser Direct Structure (LDS) method.
  • LDS Laser Direct Structure
  • a structure is formed with a material containing a non-conductive and chemically stable heavy metal complex, and a part of the structure is exposed to lasers such as UV (Ultra Violet) laser and Excimer laser to break up the chemical bond of the structure.
  • UV Ultra Violet
  • Excimer laser to break up the chemical bond of the structure.
  • After exposing the metal seed it refers to a method of forming a conductive material on the laser exposed portion of the structure by metalizing the structure.
  • the antenna 100 may be formed by a Molded Interconnect Device (MID) method.
  • MID Molded Interconnect Device
  • MID (Mold Interconnection Device) method is a three-dimensional circuit component that forms a conductive circuit on a predetermined member such as a plastic molded product, and has a mechanical function or an electrical function by utilizing the free three-dimensionality.
  • the pattern is etched by a laser, thereby increasing the degree of freedom in pattern formation, thereby enabling the implementation of complex patterns.
  • a plurality of antennas 100 may be formed to be spaced apart from each other in the injection molding 50 to improve transmission/reception performance of radio signals, and a slot 120 in which a part is trimmed may be formed. .
  • the antenna 100 may be a patch type antenna 100 or an ultra wide band (UWB) antenna 100 .
  • UWB ultra wide band
  • the antenna 100 may be electrically connected to the conductive line 110 formed on one surface of the injection-molded product 50 .
  • the conductive line 110 may be formed to be bent in connection with the antenna 100 , and when the antenna 100 is formed in plurality, the conductive line 110 may also correspond to the number of antennas 100 . It may be formed in plurality.
  • the conductive line 110 may be formed by an LDS or MID method, and may be formed in the same process as the pattern forming process of the antenna 100 .
  • the ground 200 may be provided on the other surface of the injection-molded product 50 .
  • the ground 200 may be electrically connected to the antenna 100 formed on one surface of the injection-molded product 50 , and the ground 200 and the antenna 100 may be electrically connected to each other by a via hole.
  • the electrical connection method between the ground 200 and the antenna 100 is not limited thereto, and may be formed by various methods such as a connector structure.
  • the ground 200 and the antenna 100 may be coupled and connected by a gap between the antenna and the injection-molded product 50 .
  • the antenna 100 and the ground 200 are spaced apart from each other by the thickness of the injection-molded product 50 and Since 50 is formed of a dielectric material, the antenna 100 and the ground 200 are coupled and connected by this gap structure.
  • the antenna 100 is formed on one surface of the injection-molded product 50 and the ground 200 is provided on the other surface of the injection-molded product 50 . It is formed on the other surface and it is also possible that the ground 200 is formed on one surface of the injection-molded product 50 .
  • the ground 200 may be formed of a conductive metal material.
  • the ground may include Cu (copper).
  • the ground 200 is not limited thereto, and may be formed of various materials such as SUS, Al (aluminum), and clad metal.
  • the ground 200 included in the antenna module according to the present embodiment may be formed by providing a plate-shaped metal member or a metal sheet on the other surface of the injection-molded product 50 , unlike the prior art.
  • the ground 200 may be provided by applying an adhesive material such as a pressure-sensitive adhesive or an adhesive sheet to the other surface of the injection-molded product 50 to adhere it, or may be provided for a method such as welding. It is possible.
  • the ground 200 formed on the other surface of the injection-molded product 50 is formed by providing a separate metal member rather than a plating method after etching the conventional injection-molded product 50, thereby forming a large-area ground 200 region. It has the effect of reducing the process tact time by eliminating the etching and plating process.
  • the antenna 100 and the ground 200 are on one surface of the injection-molded product 50 with the antenna 100 and the ground 200 interposed therebetween, and the ground 200 is on the other surface of the injection-molded product 50 . They are formed to be spaced apart from each other, and the directionality of the signal radiated from the antenna 100 is improved. Specifically, when a wireless signal is transmitted by the antenna module, a part of the signal radiated from the antenna 100 may be radiated toward the injection-molded product 50, and the injection-molded product ( The signal radiated in the direction of 50) is reflected and radiated toward one surface of the injection-molded product 50 again. As described above, the directivity of the radio signal is improved by the reflection of the radiated signal by the ground 200, thereby improving the radiation efficiency.
  • the present embodiment by absorbing signal noise generated by the antenna 100 by the ground 200 made of a metal material, an eddy current caused by a metal structure (eg, a chipset) inside the wireless communication device By reducing , the radiation performance of the antenna 100 may be improved.
  • a metal structure eg, a chipset
  • an extension portion 210 that protrudes outwardly and extends may be formed at an end of the ground 200 , and the extension portion 210 may be fixed to the fixing portion 15 inside the wireless communication terminal.
  • the fixing part 15 may be formed to protrude from the inner wall of the case 10 to be described later, and may be formed integrally with the case 10 .
  • FIG. 3 is a modified example of the antenna module according to an embodiment of the present invention, and is a cross-sectional view taken along the III-III direction of FIG. 1 in a state in which the antenna module according to the embodiment of the present invention is provided in a wireless communication terminal.
  • the wireless communication terminal according to the present embodiment may include a case 10 and a substrate 20, and the case 10 forms an external shape of the wireless communication terminal, and electronic components such as a substrate 20 and a battery therein. It is possible to form an internal space provided with this.
  • the extension 210 may be formed to protrude to have a predetermined area, and be formed to extend downwardly in the direction of the other surface of the injection-molded product 50 .
  • the bent height of the extension part 210 may be formed to correspond to the height of the AP 30 mounted on the substrate 20 to be described later.
  • the extension part 210 may be formed in plurality, and may be coupled to the fixing part 15 of the case 10 by the fixing means 250 .
  • a hollow fixing hole 215 is formed in a part of the extension part 210 and a fixing groove (not shown) corresponding to the fixing hole 215 is formed on one surface of the fixing part 15 , and a bolt or the like is formed.
  • the extension part 210 is fixed to the fixing part 15 by the fixing means 250 passing through the fixing hole 215 and being screwed into the fixing groove (not shown).
  • the extension 210 of the ground 200 may be fixed inside the wireless communication terminal by soldering instead of the fixing means 250 .
  • an application processor (AP) 30 is provided on one surface of the substrate 20 , and the ground 200 may be fixed to one surface of the substrate 20 so as to be in close contact with the AP 30 .
  • AP 30 is CPU (Operation Processing Unit), Modem, GPU (Graphic Processing Unit), Memory (RAM), VPU (Video Processing Unit), DSP (Digital Signal Processor), ISP (Image Signal Processor) It may mean various chipsets including the like.
  • the AP 30 is mounted and fixed on the substrate 20 , but in some cases, the AP 30 is not properly fixed or the AP 30 is separated from the substrate 20 due to an external impact. can occur In this embodiment, the AP 30 is firmly fixed to the substrate 20 by the extension 210 so that the ground 200 is in close contact with the AP 30 so that the AP 30 is firmly attached to the substrate 20 by an external impact. ) can be avoided.
  • the AP 30 included in the wireless communication terminal is a core component of the wireless communication terminal, and heat may be generated during the calculation process.
  • the metallic ground 200 included in the antenna module is the AP 30 . ), so that heat generated in the AP 30 is conducted and spread to the large-area ground 200 region to dissipate heat generated in the AP 30 .
  • the extension 210 may be provided to contact the case 10 made of a metal material. That is, the extended part 210 is fixed to the fixing part 15 integrally formed with the case 10 so that the extended part 210 is connected to the metal case 10 through the fixing part 15 .
  • some heat passes through the extension part 210 and the fixing part 15 and passes through the metal case 10 while the heat generated by the AP 30 is conducted and diffused by the ground 200 . It is possible to improve the heat dissipation effect by the ground 200 by being discharged to the outside through the.
  • a wireless communication terminal may include a case 10 , a substrate 20 , and an antenna module.
  • the case 10 forms an internal space and is made of a metal material, the substrate 20 is located in the internal space of the case 10 , and the antenna module can be fixed to one surface of the substrate 20 . there is.
  • the antenna module of this embodiment is the same as the antenna module according to the previous embodiment, a detailed description will be replaced with that of the previous embodiment.
  • the present invention can improve production efficiency by shortening the time required to form the ground by forming an antenna on one surface of the plastic-based dielectric injection molding constituting the antenna module and arranging a metal ground on the other surface of the injection molding product. can have an effect.
  • the ground is made of a metal material, the radiation directivity of the antenna is improved and signal noise is shielded, thereby improving the performance of the antenna.

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  • Computer Networks & Wireless Communication (AREA)
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Abstract

The present invention relates to an antenna module and a wireless communication terminal comprising same. More specifically, the present invention relates to an antenna module in which the time required to form the ground is reduced to improve production efficiency by forming an antenna radiator on one surface of a plastic dielectric injection molding constituting the antenna module and placing a metal ground on the other surface of the injection molding; and to a wireless communication terminal comprising same.

Description

안테나 모듈 및 이를 포함하는 무선 통신 단말기Antenna module and wireless communication terminal including same
본 발명은 안테나 모듈 및 이를 포함하는 무선 통신 단말기에 관한 것으로, 보다 상세하게는 안테나 모듈을 구성하는 플라스틱 재질의 유전체 사출물의 일면에 안테나 방사체를 형성하고 사출물의 타면에 금속 재질의 그라운드를 배치시킴으로써, 그라운드를 형성하는데 소요되는 시간을 단축시켜 생산 효율을 향상시킬 수 있는 안테나 모듈 및 이를 포함하는 무선 통신 단말기에 관한 것이다.The present invention relates to an antenna module and a wireless communication terminal including the same, and more particularly, by forming an antenna radiator on one surface of a dielectric injection-molded plastic material constituting the antenna module and placing a metallic ground on the other surface of the injection-molded product, It relates to an antenna module capable of improving production efficiency by shortening the time required to form a ground, and a wireless communication terminal including the same.
무선 통신 단말기는 안테나를 필수적으로 포함해야 하는데, 기존에 사용되어 왔던 외장형 안테나는 외관을 해치고 사용자의 불편을 초래하는 바 최근에는 내장형 안테나에 관한 기술 개발이 활발히 이루어지고 있다.A wireless communication terminal must include an antenna. Existing external antennas spoil the appearance and cause inconvenience to users. Recently, technology development related to internal antennas has been actively carried out.
한편, 최근 무선 통신 단말기의 기본이 되는 통화 기능뿐만 아니라 멀티미디어 데이터 통신에 대한 수요가 급증하고 있고, 이에 따라 LTE, 5G 통신용 안테나, 무선 근거리 통신망을 위한 WiFi 안테나, 블루투스(Bluetooth) 안테나, NFC 안테나, GPS 수신용 안테나, 무선 충전용 안테나, 광대역 안테나 등 다수의 안테나가 구비되는 무선 통신 단말기가 요구되고 있다.Meanwhile, in recent years, the demand for multimedia data communication as well as the call function, which is the basis of wireless communication terminals, is rapidly increasing, and accordingly, LTE, 5G communication antennas, WiFi antennas for wireless local area networks, Bluetooth antennas, NFC antennas, There is a demand for a wireless communication terminal equipped with a plurality of antennas, such as an antenna for GPS reception, an antenna for wireless charging, and a broadband antenna.
이러한 안테나는 사출물 식각 후 도금 방식을 이용하여 사출물의 일(Top)면에 방사 회로 패턴을 형성하고 타(Bottom)면에 그라운드 패턴을 형성하여 구현되는데, 그라운드 패턴 영역의 경우 방사 회로 패턴 영역에 비해 대면적이어서 그라운드 패턴을 식각하고 도금하는 공정이 오래 걸려 공정 택타임(Tact-Time)이 증가하는 문제가 있었다.Such an antenna is implemented by forming a radiation circuit pattern on one (Top) side of the injection-molded material and forming a ground pattern on the other (bottom) surface using a plating method after etching the injection-molded material. In the case of the ground pattern area, compared to the radiation circuit pattern area Since it is a large area, the process of etching and plating the ground pattern takes a long time, so there is a problem in that the process tact-time increases.
선행기술문헌Prior art literature
(특허문헌 1) 한국등록특허공보 제10-1595026호(2016.02.11)(Patent Document 1) Korean Patent Publication No. 10-1595026 (2016.02.11)
이에 본 발명의 기술적 과제는 이러한 점에서 착안된 것으로, 본 발명은 안테나 모듈을 구성하는 플라스틱 기반의 유전체 사출물의 일면에 안테나 방사체를 형성하고 사출물의 타면에 금속 재질의 그라운드를 배치시킴으로써, 그라운드를 형성하는데 소요되는 시간을 단축시켜 생산 효율을 향상시킬 수 있는 안테나 모듈 및 이를 포함하는 무선 통신 단말기를 제공한다.Accordingly, the technical problem of the present invention was conceived in this respect, and the present invention forms an antenna radiator on one surface of a plastic-based dielectric injection-molded material constituting an antenna module, and forms a ground by placing a metallic ground on the other surface of the injection-molded product. Provided are an antenna module capable of improving production efficiency by shortening the time required to do so, and a wireless communication terminal including the same.
본 발명의 일 실시 예에 따르면, 무선 통신 단말기에 배치되어 신호를 송/수신하는 안테나 모듈로서, 사출물의 일면에 형성되는 안테나; 및 상기 사출물의 타면에 구비되는 금속 재질의 그라운드를 포함하는, 안테나 모듈을 제공한다.According to an embodiment of the present invention, there is provided an antenna module disposed in a wireless communication terminal to transmit/receive signals, comprising: an antenna formed on one surface of an injection-molded product; and a metal ground provided on the other surface of the injection-molded product, to provide an antenna module.
상기 그라운드의 단부에는 외측으로 돌출되어 연장 형성되는 연장부를 포함하며, 상기 연장부는 상기 무선 통신 단말기의 내부에 형성되는 고정부에 고정될 수 있다.An end of the ground may include an extension extending outwardly, and the extension may be fixed to a fixing unit formed inside the wireless communication terminal.
상기 안테나는 상기 사출물에 레이저를 이용하여 패터닝한 후 도금되어 형성될 수 있다.The antenna may be formed by patterning the injection-molded product using a laser and then plating.
상기 안테나는 MID(Molded Interconnection Device) 공법에 의해 형성될 수 있다.The antenna may be formed by a Molded Interconnection Device (MID) method.
상기 안테나는 UWB(Ultra Wide Band) 안테나일 수 있다.The antenna may be an Ultra Wide Band (UWB) antenna.
상기 안테나와 상기 그라운드는 전기적으로 연결될 수 있다.The antenna and the ground may be electrically connected.
상기 안테나와 상기 그라운드는 상기 사출물에 의한 간극에 의해 커플링되어 연결될 수 있다.The antenna and the ground may be coupled and connected by a gap formed by the injection-molded product.
상기 연장부는 복수개로 형성되며, 상기 연장부와 상기 고정부는 고정 수단에 의해 결합될 수 있다.The extension part may be formed in plurality, and the extension part and the fixing part may be coupled by a fixing means.
상기 그라운드는 Cu를 포함할 수 있다.The ground may include Cu.
상기 기판의 일면에는 AP(Application Processor)가 구비되며, 상기 그라운드는 상기 AP에 밀착되도록 고정될 수 있다.An application processor (AP) may be provided on one surface of the substrate, and the ground may be fixed to be in close contact with the AP.
상기 무선 통신 단말기는 외형을 형성하는 금속 재질의 케이스를 포함하고, 상기 고정부는 금속 재질의 상기 케이스에 형성되며, 상기 연장부는 복수개로 형성되고, 상기 연장부 중 적어도 어느 하나는 상기 고정부를 매개로 하여 금속 재질의 상기 케이스와 연결될 수 있다.The wireless communication terminal includes a metal case forming an outer shape, the fixing part is formed in the metal case, the extension part is formed in plurality, and at least one of the extension parts mediates the fixing part to be connected to the case made of a metal material.
본 발명의 다른 실시예에 따르면, 내부 공간을 형성하는 금속 재질의 케이스; 상기 케이스의 내부 공간에 위치하는 기판; 및 상기 기판의 일면에 고정되는 안테나 모듈을 포함하며, 상기 안테나 모듈은, 사출물의 일면에 형성되는 안테나; 및 상기 사출물의 타면에 배치되는 금속 재질의 그라운드를 포함하는 것을 특징으로 하는, 무선 통신 단말기를 제공한다.According to another embodiment of the present invention, a case made of a metal material forming an inner space; a substrate positioned in the inner space of the case; and an antenna module fixed to one surface of the substrate, wherein the antenna module includes: an antenna formed on one surface of the injection-molded product; and a metallic ground disposed on the other surface of the injection-molded product, characterized in that it provides a wireless communication terminal.
금속 재질의 상기 케이스에 형성되는 고정부를 더 포함하고, 상기 그라운드의 단부에는 외측으로 돌출되어 연장 형성되는 연장부가 복수개로 형성되며, 상기 연장부 중 적어도 어느 하나는 상기 고정부에 고정될 수 있다.It may further include a fixing part formed on the case made of a metal, and a plurality of extension parts protruding outwardly and extending are formed at the end of the ground, and at least one of the extension parts may be fixed to the fixing part. .
상기 기판의 일면에는 AP(Application Processor)가 구비되고, 상기 그라운드는 상기 AP에 밀착되도록 고정되며, 상기 연장부 중 적어도 어느 하나는 상기 고정부를 매개로 하여 금속 재질의 상기 케이스와 연결될 수 있다.An application processor (AP) may be provided on one surface of the substrate, the ground may be fixed to be in close contact with the AP, and at least one of the extension portions may be connected to the metal case through the fixing portion as a medium.
본 발명의 실시예에 따르면,안테나 모듈을 구성하는 플라스틱 기반의 유전체 사출물의 일면에 안테나 방사체를 형성하고 사출물의 타면에 금속 재질의 그라운드를 배치시킴으로써, 그라운드를 형성하는데 소요되는 시간을 단축시켜 생산 효율을 향상시킬 수 있는 효과가 있다.According to an embodiment of the present invention, by forming an antenna radiator on one surface of the plastic-based dielectric injection-molded material constituting the antenna module and arranging a metallic ground on the other surface of the injection-molded product, the time required to form the ground is shortened, resulting in production efficiency has the effect of improving
또한, 그라운드를 금속 재질로 구현함으로써 안테나 방사체의 지향성을 향상시키고 신호 잡음(Noise)을 차폐하여, 안테나의 성능을 향상시킬 수 있는 효과가 있다.In addition, since the ground is made of a metallic material, the directivity of the antenna radiator is improved and signal noise is shielded, thereby improving the performance of the antenna.
본 발명의 효과들은 이상에서 언급한 효과들로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.
아래에서 설명하는 본 출원의 바람직한 실시예의 상세한 설명뿐만 아니라 위에서 설명한 요약은 첨부된 도면과 관련해서 읽을 때에 더 잘 이해될 수 있을 것이다. 본 발명을 예시하기 위한 목적으로 도면에는 바람직한 실시예들이 도시되어 있다. 그러나, 본 출원은 도시된 정확한 배치와 수단에 한정되는 것이 아님을 이해해야 한다.The summary set forth above as well as the detailed description of preferred embodiments of the present application set forth below may be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the invention, there are shown in the drawings preferred embodiments. It should be understood, however, that the present application is not limited to the precise arrangements and instrumentalities shown.
도 1 및 도 2는 본 발명의 일 실시예에 따른 안테나 모듈을 설명하기 위한 참고도이다.1 and 2 are reference diagrams for explaining an antenna module according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 안테나 모듈의 변형예를 설명하기 위한 참고도이다.3 is a reference diagram for explaining a modified example of the antenna module according to an embodiment of the present invention.
이하 본 발명의 실시예에 대하여 첨부한 도면을 참조하여 상세하게 설명하기로 한다. 다만, 첨부된 도면은 본 발명의 내용을 보다 쉽게 개시하기 위하여 설명되는 것일 뿐, 본 발명의 범위가 첨부된 도면의 범위로 한정되는 것이 아님은 이 기술분야의 통상의 지식을 가진 자라면 용이하게 알 수 있을 것이다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the accompanying drawings are only described to more easily disclose the contents of the present invention, and those of ordinary skill in the art can easily understand that the scope of the present invention is not limited to the scope of the accompanying drawings. you will know
그리고, 본 발명의 실시예를 설명함에 있어서, 동일 기능을 갖는 구성요소에 대해서는 동일 명칭 및 동일부호를 사용할 뿐 실질적으론 종래기술의 구성요소와 완전히 동일하지 않음을 미리 밝힌다.And, in describing the embodiment of the present invention, the same name and the same reference numerals are used for components having the same function, but substantially not completely the same as the components of the prior art.
또한, 본 출원에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수개의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.In addition, the terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.
이하, 본 발명에 따른 안테나 모듈 및 이를 포함하는 무선 통신 단말기를 첨부한 도면을 참조하여 상세히 설명하기로 하며, 첨부한 도면을 참조하여 설명함에 있어서, 동일하거나 대응하는 구성 요소는 동일한 도면부호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, an antenna module and a wireless communication terminal including the same according to the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, identical or corresponding components are given the same reference numerals and a redundant description thereof will be omitted.
도 1및 도 2는본 발명의 일 실시예에 따른 안테나 모듈을 설명하기 위한 참고도로서, 도 1 및 도 2를 참고하면,본 실시예에 따른 안테나 모듈은 무선 통신 단말기에 배치되어 신호를 송/수신한다.1 and 2 are reference views for explaining an antenna module according to an embodiment of the present invention. Referring to FIGS. 1 and 2 , the antenna module according to this embodiment is disposed in a wireless communication terminal to transmit/receive signals receive
본 실시예에 따른 안테나 모듈은 안테나(100) 및 그라운드(200)를 포함할 수 있다.The antenna module according to the present embodiment may include the antenna 100 and the ground 200 .
안테나(100)는 사출물(50)의 일면에 형성될 수 있다.The antenna 100 may be formed on one surface of the injection-molded product 50 .
사출물(50)은 절연성의 재질로 사출 성형에 의해 형성될 수 있다.사출물(50)은 내후성과 내충격성 및 기계적 강도를 유지하기 위해 폴리에스테르 수지, 폴리카보네이트(PC)등 합성 수지 재질로 이루어질 수 있으며,이때 사출물(50)은 안테나(100) 캐리어(carrier)일 수 있으나, 사출물(50)의 재질과 종류는 이에 한정되는 것은 아니다.The injection molding 50 may be formed of an insulating material by injection molding. The injection molding 50 may be formed of a synthetic resin material such as polyester resin or polycarbonate (PC) in order to maintain weather resistance, impact resistance, and mechanical strength. In this case, the injection-molded product 50 may be a carrier of the antenna 100 , but the material and type of the injection-molded product 50 are not limited thereto.
안테나(100)는 사출물(50)의 일면에 형성될 수 있다.본 실시예에서 '일면'이란 도면상 사출물(50)의 '윗면'일 수 있다.The antenna 100 may be formed on one surface of the injection-molded product 50 . In the present embodiment, “one surface” may be the “top surface” of the injection-molded product 50 in the drawing.
안테나(100)는 신호(예컨대, 무선 통신 신호)의 송수신을 위해 사용되며 PCB에 의해 급전되어 신호를 공간으로 방사하는 구성으로서, 사출물(50)의 일면에 형성되어 무선 신호를 송/수신한다.The antenna 100 is used for transmission and reception of a signal (eg, a wireless communication signal) and is a configuration that is fed by a PCB and radiates a signal into space, and is formed on one surface of the injection product 50 to transmit/receive a wireless signal.
이때, 안테나(100)는 사출물(50)의 일면에 레이저를 이용하여 패터닝한 후 도금이나 인쇄 등의 방법으로 형성될 수 있으며, LDS(Laser Direct Structure) 공법으로 형성될 수 있다. LDS 공법이란 비전도성이며 화학적으로 안정한 중금속 복합체를 포함하는 재질로 구조물을 형성하고, 구조물의 일부를 UV(Ultra Violet) 레이저,엑시머(Excimer) 레이저 등의 레이저에 노출시킴으로써 구조물의 화학적 결합을 해체하여 금속 시드를 노출시킨 후,구조물을 금속화(metalizing)하여 구조물의 레이저 노출 부위에 도전성 물질을 형성하는 공법을 의미한다.In this case, the antenna 100 may be patterned on one surface of the injection product 50 using a laser and then formed by plating or printing, or may be formed by a Laser Direct Structure (LDS) method. In the LDS method, a structure is formed with a material containing a non-conductive and chemically stable heavy metal complex, and a part of the structure is exposed to lasers such as UV (Ultra Violet) laser and Excimer laser to break up the chemical bond of the structure. After exposing the metal seed, it refers to a method of forming a conductive material on the laser exposed portion of the structure by metalizing the structure.
한편, 안테나(100)는 MID(Molded Interconnect Device) 공법에 의해 형성될 수 있다.Meanwhile, the antenna 100 may be formed by a Molded Interconnect Device (MID) method.
MID(Molded Interconnection Device) 공법은 플라스틱 성형품 등의 소정의 부재 상에 도전성 회로를 형성하는 3차원형상의 회로부품으로, 자유적인 3차원성을 살림으로써 기계적 기능을 갖게 하거나, 전기적 기능을 갖게 한다.MID (Mold Interconnection Device) method is a three-dimensional circuit component that forms a conductive circuit on a predetermined member such as a plastic molded product, and has a mechanical function or an electrical function by utilizing the free three-dimensionality.
안테나(100)가 LDS 또는 MID 공법으로 형성되는 경우 패턴이 레이저에 의해 식각되어 형성됨으로써 패턴 형성의 자유도가 향상되어 복잡한 형태의 패턴 구현이 가능한 장점이 있다.When the antenna 100 is formed by the LDS or MID method, the pattern is etched by a laser, thereby increasing the degree of freedom in pattern formation, thereby enabling the implementation of complex patterns.
이때, 안테나(100)는 무선 신호의 송/수신 성능 향상을 위해 사출물(50)에 복수개가 서로 이격되어 형성될 수 있으며, 내부에 일부가 트리밍(trimming)되는 슬롯(120)이 형성될 수 있다.In this case, a plurality of antennas 100 may be formed to be spaced apart from each other in the injection molding 50 to improve transmission/reception performance of radio signals, and a slot 120 in which a part is trimmed may be formed. .
이때, 안테나(100)는 패치형 안테나(100) 또는 UWB(Ultra Wide Band) 안테나(100)일 수 있다.In this case, the antenna 100 may be a patch type antenna 100 or an ultra wide band (UWB) antenna 100 .
한편, 안테나(100)는 사출물(50)의 일면에 형성되는 도전성 라인(110)과 전기적으로 연결될 수 있다. 도 1을 참고하면, 도전성 라인(110)은 안테나(100)와 연결되어 절곡 형성될 수 있으며, 안테나(100)가 복수개로 형성되는 경우 안테나(100)의 개수에 대응하여 도전성 라인(110) 또한 복수개로 형성될 수 있다.Meanwhile, the antenna 100 may be electrically connected to the conductive line 110 formed on one surface of the injection-molded product 50 . Referring to FIG. 1 , the conductive line 110 may be formed to be bent in connection with the antenna 100 , and when the antenna 100 is formed in plurality, the conductive line 110 may also correspond to the number of antennas 100 . It may be formed in plurality.
도전성 라인(110)은 LDS 또는 MID 공법으로 형성될 수 있으며, 안테나(100)의 패턴 형성 공정과 같은 공정에서 이루어질 수 있다.The conductive line 110 may be formed by an LDS or MID method, and may be formed in the same process as the pattern forming process of the antenna 100 .
그라운드(200)는 사출물(50)의 타면에 구비될 수 있다.The ground 200 may be provided on the other surface of the injection-molded product 50 .
이때, 그라운드(200)는 사출물(50)의 일면에 형성되는 안테나(100)와 전기적으로 연결될 수 있으며, 그라운드(200)와 안테나(100)는 비아 홀에 의해 전기적으로 연결될 수 있다. 다만, 그라운드(200)와 안테나(100)의 전기적 연결 방식은 이에 한정되는 것은 아니고 커넥터 구조 등 다양한 방식에 의해 이루어질 수 있다.In this case, the ground 200 may be electrically connected to the antenna 100 formed on one surface of the injection-molded product 50 , and the ground 200 and the antenna 100 may be electrically connected to each other by a via hole. However, the electrical connection method between the ground 200 and the antenna 100 is not limited thereto, and may be formed by various methods such as a connector structure.
한편, 그라운드(200)와 안테나(100)는 안테나와 사출물(50)에 의한 간극에 의해 커플링되어 연결될 수 있다. 구체적으로, 사출물(50)의 일면에 안테나(100)가 형성되고 타면에 그라운드(200)가 구비되므로, 안테나(100)와 그라운드(200)는 사출물(50)의 두께만큼 서로 간극되게 되고 사출물(50)은 유전체 재질로 형성되므로, 이러한 간극 구조에 의해 안테나(100)와 그라운드(200)가 커플링되어 연결되는 것이다.Meanwhile, the ground 200 and the antenna 100 may be coupled and connected by a gap between the antenna and the injection-molded product 50 . Specifically, since the antenna 100 is formed on one surface of the injection-molded product 50 and the ground 200 is provided on the other surface, the antenna 100 and the ground 200 are spaced apart from each other by the thickness of the injection-molded product 50 and Since 50 is formed of a dielectric material, the antenna 100 and the ground 200 are coupled and connected by this gap structure.
본 실시예의 경우 안테나(100)가 사출물(50)의 일면에 형성되고 그라운드(200)가 사출물(50)의 타면에 구비되는 것을 기준으로 설명하였으나, 이와 달리 안테나(100)가 사출물(50)의 타면에 형성되고 그라운드(200)가 사출물(50)의 일면에 형성되는 것도 가능하다.In this embodiment, the antenna 100 is formed on one surface of the injection-molded product 50 and the ground 200 is provided on the other surface of the injection-molded product 50 . It is formed on the other surface and it is also possible that the ground 200 is formed on one surface of the injection-molded product 50 .
그라운드(200)는 전도성을 갖는 금속 재질로 형성될 수 있다. 그라운드는 Cu(구리)를 포함할 수 있다. 다만, 그라운드(200)는 이에 한정되는 것은 아니고 SUS, Al(알루미늄), Clad Metal의 다양한 재질로 형성될 수 있다.The ground 200 may be formed of a conductive metal material. The ground may include Cu (copper). However, the ground 200 is not limited thereto, and may be formed of various materials such as SUS, Al (aluminum), and clad metal.
이때, 본 실시예에 따른 안테나 모듈에 포함되는 그라운드(200)는 종래 기술과 달리 판상의 금속 재질의 부재나 금속 시트(sheet)가 사출물(50)의 타면에 구비됨으로써 형성될 수 있다. 그라운드(200)는 사출물(50)의 타면에 점착제, 점착시트 등의 점착물질이 도포되어 점착되거나, 용접 등의 방식에 위해 구비될 수 있으며, 사출물(50)의 사출시 인서트 사출되어 구비되는 것도 가능하다.In this case, the ground 200 included in the antenna module according to the present embodiment may be formed by providing a plate-shaped metal member or a metal sheet on the other surface of the injection-molded product 50 , unlike the prior art. The ground 200 may be provided by applying an adhesive material such as a pressure-sensitive adhesive or an adhesive sheet to the other surface of the injection-molded product 50 to adhere it, or may be provided for a method such as welding. It is possible.
본 실시예에 따르면 사출물(50)의 타면에 형성되는 그라운드(200)를 종래의 사출물(50) 식각 후 도금 방식이 아닌 별도의 금속 부재를 구비시킴으로써 형성함으로써, 대면적의 그라운드(200) 영역을 식각하고 도금하는 공정을 제거하여 공정 택타임을 단축시킬 수 있는 효과가 있다.According to this embodiment, the ground 200 formed on the other surface of the injection-molded product 50 is formed by providing a separate metal member rather than a plating method after etching the conventional injection-molded product 50, thereby forming a large-area ground 200 region. It has the effect of reducing the process tact time by eliminating the etching and plating process.
또한, 본 실시예에 따르면 안테나(100)와 그라운드(200)가 사출물(50)을 사이에 두고 안테나(100)는 사출물(50)의 일면에, 그라운드(200)는 사출물(50)의 타면에 서로 이격되도록 형성되어, 안테나(100)로 부터 방사되는 신호의 방향성을 개선한다. 구체적으로, 안테나 모듈에 의해 무선 신호 송신시 안테나(100)에서 방사되는 신호의 일부가 사출물(50)을 향해 방사될 수 있는데, 사출물(50)의 타면에 형성되는 그라운드(200) 에 의해 사출물(50) 방향으로 방사되는 신호가 반사되어 다시 사출물(50)의 일면을 향해 방사된다. 이와 같이 방사 신호의 그라운드(200)에 의한 반사에 의해 무선 신호의 지향성이 개선되어 방사 효율을 향상시킬 수 있는 것이다.In addition, according to the present embodiment, the antenna 100 and the ground 200 are on one surface of the injection-molded product 50 with the antenna 100 and the ground 200 interposed therebetween, and the ground 200 is on the other surface of the injection-molded product 50 . They are formed to be spaced apart from each other, and the directionality of the signal radiated from the antenna 100 is improved. Specifically, when a wireless signal is transmitted by the antenna module, a part of the signal radiated from the antenna 100 may be radiated toward the injection-molded product 50, and the injection-molded product ( The signal radiated in the direction of 50) is reflected and radiated toward one surface of the injection-molded product 50 again. As described above, the directivity of the radio signal is improved by the reflection of the radiated signal by the ground 200, thereby improving the radiation efficiency.
또한, 본 실시예에 따르면 금속 재질의 그라운드(200)에 의해 안테나(100)에 의해 발생하는 신호 잡음(Noise)을 흡수하여, 무선 통신 장치 내부의 금속 구조물(예를 들어, 칩셋)에 의한 와전류를 감소시킴으로써, 안테나(100)의 방사 성능을 향상시킬 수 있다.In addition, according to the present embodiment, by absorbing signal noise generated by the antenna 100 by the ground 200 made of a metal material, an eddy current caused by a metal structure (eg, a chipset) inside the wireless communication device By reducing , the radiation performance of the antenna 100 may be improved.
이때, 그라운드(200)의 단부에는 외측으로 돌출되어 연장되는 연장부(210)가 형성될 수 있으며, 연장부(210)는 무선 통신 단말기 내부의 고정부(15)에 고정될 수 있다. 이때, 고정부(15)는 후술할 케이스(10)의 내벽에 돌출되어 형성될 수 있으며, 케이스(10)와 일체로서 형성되는 것도 가능하다.In this case, an extension portion 210 that protrudes outwardly and extends may be formed at an end of the ground 200 , and the extension portion 210 may be fixed to the fixing portion 15 inside the wireless communication terminal. In this case, the fixing part 15 may be formed to protrude from the inner wall of the case 10 to be described later, and may be formed integrally with the case 10 .
도 3은 본 발명의 일 실시예에 따른 안테나 모듈의 변형예로서, 본 발명의 실시예에 따른 안테나 모듈이 무선 통신 단말기에 구비된 상태에서 도 1의 Ⅲ-Ⅲ 방향에 따른 단면도이다.3 is a modified example of the antenna module according to an embodiment of the present invention, and is a cross-sectional view taken along the III-III direction of FIG. 1 in a state in which the antenna module according to the embodiment of the present invention is provided in a wireless communication terminal.
본 실시예에 따른 무선 통신 단말기는 케이스(10) 및 기판(20)을 포함할 수 있으며, 케이스(10)는 무선 통신 단말기의 외형을 형성하며, 내부에 기판(20), 배터리 등의 전자 부품이 구비되는 내부 공간을 형성할 수 있다.The wireless communication terminal according to the present embodiment may include a case 10 and a substrate 20, and the case 10 forms an external shape of the wireless communication terminal, and electronic components such as a substrate 20 and a battery therein. It is possible to form an internal space provided with this.
연장부(210)는 일정한 면적을 가지고 돌출 형성되고, 사출물(50)의 타면 방향으로 하향 절곡되게 연장 형성될 수 있다. 이때, 연장부(210)의 절곡 높이는 후술할 기판(20)에 실장되는 AP(30)의 높이에 대응되도록 형성될 수 있다.The extension 210 may be formed to protrude to have a predetermined area, and be formed to extend downwardly in the direction of the other surface of the injection-molded product 50 . In this case, the bent height of the extension part 210 may be formed to correspond to the height of the AP 30 mounted on the substrate 20 to be described later.
또한, 연장부(210)는 복수개로 형성될 수 있으며, 고정 수단(250)에 의해 케이스(10)의 고정부(15)에 결합될 수 있다. 구체적으로, 연장부(210)의 일부에 중공의 고정홀(215)이 형성되고 고정부(15)의 일면에 고정홀(215)에 대응되는 고정홈(미도시)이 형성되며, 볼트 등의 고정 수단(250)이 고정홀(215)을 관통하여 고정홈(미도시)에 나사 결합됨으로써 연장부(210)가 고정부(15)에 고정되는 것이다. 이때, 그라운드(200)의 연장부(210)는 고정 수단(250)이 아닌 납땜에 의해 무선 통신 단말기 내부에 고정되는 것도 가능하다.In addition, the extension part 210 may be formed in plurality, and may be coupled to the fixing part 15 of the case 10 by the fixing means 250 . Specifically, a hollow fixing hole 215 is formed in a part of the extension part 210 and a fixing groove (not shown) corresponding to the fixing hole 215 is formed on one surface of the fixing part 15 , and a bolt or the like is formed. The extension part 210 is fixed to the fixing part 15 by the fixing means 250 passing through the fixing hole 215 and being screwed into the fixing groove (not shown). In this case, the extension 210 of the ground 200 may be fixed inside the wireless communication terminal by soldering instead of the fixing means 250 .
한편, 기판(20)의 일면에는 AP(30)(Aplication Processor)가 구비되며, 그라운드(200)는 AP(30)에 밀착되도록 기판(20)의 일면에 고정될 수 있다. 본 실시예에서 AP(30)란 CPU(연산처리장치), Modem, GPU(그랙픽처리장치), 메모리(RAM), VPU(Video Processing Unit), DSP(Digital Signal Processor), ISP(Image Signal Processor) 등을 포함하는 다양한 칩셋을 의미할 수 있다.Meanwhile, an application processor (AP) 30 is provided on one surface of the substrate 20 , and the ground 200 may be fixed to one surface of the substrate 20 so as to be in close contact with the AP 30 . In this embodiment, AP 30 is CPU (Operation Processing Unit), Modem, GPU (Graphic Processing Unit), Memory (RAM), VPU (Video Processing Unit), DSP (Digital Signal Processor), ISP (Image Signal Processor) It may mean various chipsets including the like.
일반적으로 AP(30)는 기판(20)에 실장되어 고정되나, 경우에 따라서는 AP(30)의 고정이 제대로 이루어지지 않거나 외부 충격 등에 의해 AP(30)가 기판(20)으로부터 이탈되는 경우가 발생할 수 있다. 본 실시예의 경우 그라운드(200)가 AP(30)에 밀착되도록 연장부(210)에 의해 기판(20)에 결합됨으로써 AP(30)를 단단히 고정하여 외부 충격 등에 의해 AP(30)가 기판(20)으로부터 이탈되는 것을 방지할 수 있다.In general, the AP 30 is mounted and fixed on the substrate 20 , but in some cases, the AP 30 is not properly fixed or the AP 30 is separated from the substrate 20 due to an external impact. can occur In this embodiment, the AP 30 is firmly fixed to the substrate 20 by the extension 210 so that the ground 200 is in close contact with the AP 30 so that the AP 30 is firmly attached to the substrate 20 by an external impact. ) can be avoided.
또한, 무선 통신 단말기에 포함되는 AP(30)는 무선 통신 단말기의 핵심 부품으로서 연산 처리과정에서 열이 발생할 수 있는데, 본 실시예의 경우 안테나 모듈에 포함되는 금속 재질의 그라운드(200)가 AP(30)와 밀착되도록 구비됨으로써 AP(30)에서 발생하는 열을 전도하고 대면적의 그라운드(200) 영역으로 확산하여 AP(30)에서 발생하는 열을 방열시킬 수 있다.In addition, the AP 30 included in the wireless communication terminal is a core component of the wireless communication terminal, and heat may be generated during the calculation process. In this embodiment, the metallic ground 200 included in the antenna module is the AP 30 . ), so that heat generated in the AP 30 is conducted and spread to the large-area ground 200 region to dissipate heat generated in the AP 30 .
이때, 연장부(210)는 금속 재질의 케이스(10)와 접촉하도록 구비될 수 있다. 즉, 연장부(210)가 케이스(10)와 일체로 형성되는 고정부(15)에 고정되어 고정부(15)를 매개로 하여 연장부(210)가 금속 재질의 케이스(10)와 연결되도록 구비되는 것이다. 본 실시예의 경우, AP(30)에서 발생하는 열이 그라운드(200)에 의해 열전도되어 확산되는 과정에서 일부 열이 연장부(210) 및 고정부(15)를 지나 금속 재질의 케이스(10)를 통해 외부로 방출됨으로써 그라운드(200)에 의한 방열 효과를 향상시킬 수 있는 것이다.In this case, the extension 210 may be provided to contact the case 10 made of a metal material. That is, the extended part 210 is fixed to the fixing part 15 integrally formed with the case 10 so that the extended part 210 is connected to the metal case 10 through the fixing part 15 . will be provided In the present embodiment, some heat passes through the extension part 210 and the fixing part 15 and passes through the metal case 10 while the heat generated by the AP 30 is conducted and diffused by the ground 200 . It is possible to improve the heat dissipation effect by the ground 200 by being discharged to the outside through the.
한편, 본 발명의 다른 실시예에 따른 무선 통신 단말기는 케이스(10), 기판(20) 및 안테나 모듈을 포함할 수 있다.Meanwhile, a wireless communication terminal according to another embodiment of the present invention may include a case 10 , a substrate 20 , and an antenna module.
본 실시예에 따른 케이스(10)는 내부 공간을 형성하며 금속 재질로 형성되며, 기판(20)은 케이스(10)의 내부 공간에 위치하며, 안테나 모듈은 기판(20)의 일면에 고정될 수 있다.The case 10 according to this embodiment forms an internal space and is made of a metal material, the substrate 20 is located in the internal space of the case 10 , and the antenna module can be fixed to one surface of the substrate 20 . there is.
본 실시예의 안테나 모듈은 앞선 실시예에 따른 안테나 모듈과 동일하므로 구체적인 설명은 앞선 실시예의 설명에 갈음하기로 한다.Since the antenna module of this embodiment is the same as the antenna module according to the previous embodiment, a detailed description will be replaced with that of the previous embodiment.
이와 같이 본 발명은, 안테나 모듈을 구성하는 플라스틱 기반의 유전체 사출물의 일면에 안테나를 형성하고 사출물의 타면에 금속 재질의 그라운드를 배치시킴으로써, 그라운드를 형성하는데 소요되는 시간을 단축시켜 생산 효율을 향상시킬 수 있는 효과가 있다.As described above, the present invention can improve production efficiency by shortening the time required to form the ground by forming an antenna on one surface of the plastic-based dielectric injection molding constituting the antenna module and arranging a metal ground on the other surface of the injection molding product. can have an effect.
또한, 그라운드를 금속 재질로 구현함으로써 안테나의 방사 지향성을 향상시키고 신호 잡음(Noise)을 차폐하여, 안테나의 성능을 향상시킬 수 있는 효과가 있다.In addition, since the ground is made of a metal material, the radiation directivity of the antenna is improved and signal noise is shielded, thereby improving the performance of the antenna.
이상과 같이 본 발명에 따른 바람직한 실시예를 살펴보았으며, 앞서 설명된 실시예 이외에도 본 발명이 그 취지나 범주에서 벗어남이 없이 다른 특정 형태로 구체화 될 수 있다는 사실은 해당 기술에 통상의 지식을 가진 이들에게는 자명한 것이다. 그러므로, 상술된 실시예는 제한적인 것이 아니라 예시적인 것으로 여겨져야 하고, 이에 따라 본 발명은 상술한 설명에 한정되지 않고 첨부된 청구항의 범주 및 그 동등 범위 내에서 변경될 수도 있다.As described above, preferred embodiments according to the present invention have been reviewed, and the fact that the present invention can be embodied in other specific forms without departing from the spirit or scope of the present invention in addition to the above-described embodiments is one of ordinary skill in the art. It is obvious to them. Therefore, the above-described embodiments are to be regarded as illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.
10: 케이스10: case
15: 고정부15: fixed part
20: 기판20: substrate
30: AP(Application Processor)30: AP (Application Processor)
50: 사출물50: injection molding
100: 안테나100: antenna
110: 도전성 라인110: conductive line
120: 슬롯120: slot
200: 그라운드200: ground
210: 연장부210: extension
215: 고정홀215: fixing hole
250: 고정 수단250: fixing means

Claims (14)

  1. 무선 통신 단말기에 배치되어 신호를 송/수신하는 안테나 모듈로서,An antenna module disposed in a wireless communication terminal to transmit/receive signals, comprising:
    사출물의 일면에 형성되는 안테나; 및An antenna formed on one surface of the injection-molded product; and
    상기 사출물의 타면에 구비되는 금속 재질의 그라운드를 포함하는, 안테나 모듈.An antenna module comprising a metal ground provided on the other surface of the injection-molded product.
  2. 제1항에 있어서,According to claim 1,
    상기 그라운드의 단부에는 외측으로 돌출되어 연장 형성되는 연장부를 포함하며,The end of the ground includes an extension that protrudes outward and is formed to extend,
    상기 연장부는 상기 무선 통신 단말기의 내부에 형성되는 고정부에 고정되는 것을 특징으로 하는, 안테나 모듈.The extension part is characterized in that fixed to a fixing part formed inside the wireless communication terminal, the antenna module.
  3. 제1항에 있어서,According to claim 1,
    상기 안테나는 상기 사출물에 레이저를 이용하여 패터닝한 후 도금되어 형성되는 것을 특징으로 하는, 안테나 모듈.The antenna module, characterized in that formed by plating after patterning the injection molding using a laser.
  4. 제1항에 있어서,According to claim 1,
    상기 안테나는 MID(Molded Interconnection Device) 공법에 의해 형성되는 것을 특징으로 하는, 안테나 모듈.The antenna module, characterized in that formed by the MID (Mold Interconnection Device) method.
  5. 제1항에 있어서,According to claim 1,
    상기 안테나는 UWB(Ultra Wide Band) 안테나인 것을 특징으로 하는, 안테나 모듈.The antenna is a UWB (Ultra Wide Band) antenna, characterized in that the antenna module.
  6. 제1항에 있어서,According to claim 1,
    상기 안테나와 상기 그라운드는 전기적으로 연결되는 것을 특징으로 하는, 안테나 모듈.The antenna and the ground, characterized in that electrically connected, the antenna module.
  7. 제1항에 있어서,According to claim 1,
    상기 안테나와 상기 그라운드는 상기 사출물에 의한 간극에 의해 커플링되어 연결되는 것을 특징으로 하는, 안테나 모듈.An antenna module, characterized in that the antenna and the ground are coupled and connected by a gap formed by the injection-molded material.
  8. 제2항에 있어서,3. The method of claim 2,
    상기 연장부는 복수개로 형성되며, 상기 연장부와 상기 고정부는 고정 수단에 의해 결합되는 것을 특징으로 하는, 안테나 모듈.The extension part is formed in plurality, and the extension part and the fixing part are coupled by a fixing means, the antenna module.
  9. 제1항에 있어서,According to claim 1,
    상기 그라운드는 Cu를 포함하는 것을 특징으로 하는, 안테나 모듈.The ground is characterized in that it contains Cu, the antenna module.
  10. 제2항에 있어서,3. The method of claim 2,
    상기 기판의 일면에는 AP(Application Processor)가 구비되며, 상기 그라운드는 상기 AP에 밀착되도록 고정되는 것을 특징으로 하는, 안테나 모듈.An application processor (AP) is provided on one surface of the substrate, and the ground is fixed to be in close contact with the AP.
  11. 제10항에 있어서,11. The method of claim 10,
    상기 무선 통신 단말기는 외형을 형성하는 금속 재질의 케이스를 포함하고,The wireless communication terminal includes a metal case forming an outer shape,
    상기 고정부는 금속 재질의 상기 케이스에 형성되며,The fixing part is formed in the case made of a metal,
    상기 연장부는 복수개로 형성되고, 상기 연장부 중 적어도 어느 하나는 상기 고정부를 매개로 하여 금속 재질의 상기 케이스와 연결되는 것을 특징으로 하는, 안테나 모듈.The extension part is formed in plurality, and at least one of the extension parts is connected to the case made of a metal through the fixing part as a medium, the antenna module.
  12. 내부 공간을 형성하는 금속 재질의 케이스;a case made of a metal material forming an inner space;
    상기 케이스의 내부 공간에 위치하는 기판; 및a substrate positioned in the inner space of the case; and
    상기 기판의 일면에 고정되는 안테나 모듈을 포함하며,It includes an antenna module fixed to one surface of the substrate,
    상기 안테나 모듈은,The antenna module is
    사출물의 일면에 형성되는 안테나; 및An antenna formed on one surface of the injection-molded product; and
    상기 사출물의 타면에 배치되는 금속 재질의 그라운드를 포함하는 것을 특징으로 하는, 무선 통신 단말기.A wireless communication terminal, characterized in that it comprises a ground made of a metal material disposed on the other surface of the injection-molded product.
  13. 제12항에 있어서,13. The method of claim 12,
    금속 재질의 상기 케이스에 형성되는 고정부를 더 포함하고,Further comprising a fixing part formed in the case of a metal material,
    상기 그라운드의 단부에는 외측으로 돌출되어 연장 형성되는 연장부가 복수개로 형성되며,A plurality of extension portions protruding outwardly and extending are formed at the end of the ground,
    상기 연장부 중 적어도 어느 하나는 상기 고정부에 고정되는 것을 특징으로 하는, 무선 통신 단말기.At least one of the extension parts is characterized in that fixed to the fixing part, a wireless communication terminal.
  14. 제13항에 있어서,14. The method of claim 13,
    상기 기판의 일면에는 AP(Application Processor)가 구비되고, 상기 그라운드는 상기 AP에 밀착되도록 고정되며,An application processor (AP) is provided on one surface of the substrate, and the ground is fixed to be in close contact with the AP,
    상기 연장부 중 적어도 어느 하나는 상기 고정부를 매개로 하여 금속 재질의 상기 케이스와 연결되는 것을 특징으로 하는, 무선 통신 단말기. At least one of the extension parts is characterized in that connected to the case made of metal through the fixing part, a wireless communication terminal.
PCT/KR2021/016364 2020-11-13 2021-11-10 Antenna module and wireless communication terminal comprising same WO2022103159A1 (en)

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