WO2022095981A1 - 多频段融合天线组件 - Google Patents

多频段融合天线组件 Download PDF

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Publication number
WO2022095981A1
WO2022095981A1 PCT/CN2021/129126 CN2021129126W WO2022095981A1 WO 2022095981 A1 WO2022095981 A1 WO 2022095981A1 CN 2021129126 W CN2021129126 W CN 2021129126W WO 2022095981 A1 WO2022095981 A1 WO 2022095981A1
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WIPO (PCT)
Prior art keywords
conductive material
radiator
radiation
radiation arm
patches
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Application number
PCT/CN2021/129126
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English (en)
French (fr)
Inventor
王敏
张海伟
章秀银
杨圣杰
丁昱智
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华为技术有限公司
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Publication of WO2022095981A1 publication Critical patent/WO2022095981A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands

Definitions

  • the present application relates to the field of communication technologies, and in particular, to a multi-band fusion antenna assembly.
  • the radiator of the large-sized low-frequency antenna element located above will block the radiator of the small-sized high-frequency antenna element below (as shown in Figure 1), so that when the radiator of the high-frequency antenna element works, the radiator of the low-frequency antenna element will experience The induced high-frequency current will cause electromagnetic field scattering and reflection to distort the radiation pattern of the high-frequency antenna element, thereby deteriorating the radiation efficiency of the entire multi-frequency common-aperture antenna array.
  • Embodiments of the present application provide a radiator, a multi-band fusion antenna assembly, an antenna and an electronic device, which can reduce the coupling of radiator radiation signals of different frequency bands in the multi-band fusion antenna, reduce the radiation pattern distortion of the antenna vibrator, and improve the frequency Radiation Efficiency of Frequency Common Aperture Antenna Arrays.
  • a multi-band fusion antenna assembly in a first aspect, includes a ground plate, a first radiator and a second radiator; the first radiator is used for radiating signals in the first frequency range, and the second radiator is used for radiating signals in the second frequency range;
  • the floor is used to reflect part of the signal radiated by the first radiator and part of the signal radiated by the second radiator;
  • the first height of the first radiator is smaller than the second height of the second radiator, and the first height and the second height are perpendicular to the height in the direction of the ground plate;
  • the first radiator includes a first radiating arm group and a first balun group, and the first radiating arm group is coupled to the first feeding circuit corresponding to the first radiator through the first balun group;
  • the two radiators include a second radiating arm group and a second balun group, the second radiating arm group is coupled to a second feeding circuit corresponding to the second radiator through the second balun group;
  • the second radiating arm group includes at least one The second radiation arm;
  • a first capacitor is formed between each conductive material patch and the second radiation arm
  • a second capacitance is formed between adjacent conductive material patches
  • the second radiation arm opposite to each conductive material patch is equivalent to
  • each conductive material patch itself is equivalent to the second inductance
  • the first capacitance and the second capacitance in the equivalent circuit formed in this way have the characteristic of conducting signals in the first frequency range
  • the first inductance and The second inductance has the effect of high resistance to the signal in the first frequency range, and can effectively filter out the induced current to the signal in the first frequency range coupled on the second radiator when the first radiator is working, that is, to the first frequency
  • the induced current formed on the second radiator by the signal in the range has a decoupling effect, which can reduce the influence of the second radiator on the radiation pattern of the first radiator, reduce the distortion of the radiation pattern of the antenna vibrator, and improve the multi-frequency common.
  • the first capacitance, the second capacitance, the first capacitance, the first capacitance, the first capacitance, the first capacitance, the first capacitance, the first capacitance, the first capacitance, the The values of the inductance and the second inductance can also control the coupling current generated on the second radiator when the first radiator works.
  • the plurality of conductive material patches are distributed along a direction in which the current flows through the second radiation arm where the plurality of conductive material patches are located. Since the radiation pattern of the first radiation arm is mainly related to the induced current coupled to the signal of the first frequency range in the second radiation arm, it is necessary to couple the second radiation arm in the direction of current flow through the second radiation arm. The signals of the first radiation arm are decoupled, so that the plurality of conductive material patches are distributed along the direction of current flowing through the second radiation arm where the plurality of conductive material patches are located.
  • At least one first conductive via hole is provided in the insulating medium layer, and each first conductive via hole is connected to a conductive material patch. Since the increase of the first conductive via is equivalent to increasing the area of the conductive material patch, it can increase the facing area between the conductive material patch and the second radiation arm, and can increase the sensing area between the conductive material patches, which is equivalent to The capacitance values of the first capacitor and the second capacitor are increased. Due to the conduction characteristic of the first capacitor to the signal in the first frequency range, it is ensured that the signal coupled from the first radiation arm to the second radiation arm can be sufficiently coupled to the conductive material patch. Due to the conduction characteristic of the second capacitor to the signal in the first frequency range, it is ensured that the signal coupled from the first radiation arm to the second radiation arm can be transmitted between the conductive material patches.
  • At least one first conductive via is located on both sides of the second radiation arm where the conductive material patch is located, and is sequentially arranged along the direction in which the current flows through the second radiation arm where the conductive material patch is located.
  • the at least one first conductive via is mainly arranged on both sides of the second radiating arm along the direction in which the current flows through the second radiating arm where the conductive material patch is located, the second radiating arm and the conductive material patch can be mainly improved.
  • the amount of capacitive coupling between the chips that is, mainly increases the capacitance value of the first capacitor, to ensure that the signal coupled from the first radiation arm to the second radiation arm can be sufficiently coupled to the conductive material patch.
  • At least one first conductive via is located at both ends of the conductive material patch in the direction of flowing through the second radiation arm where the conductive material patch is located, and flows through the conductive material patch in a direction perpendicular to the current flow through the conductive material patch
  • the directions of the second radiation arms are arranged in sequence.
  • the at least one first conductive via is mainly arranged at both ends of the conductive material patch in a direction perpendicular to the direction perpendicular to the second radiation arm where the current flows through the conductive material patch, the added at least one first conductive via It is equivalent to increasing the facing area between the conductive material patch and the conductive material patch, which is equivalent to increasing the capacitance value of the second capacitor, so the capacitive coupling between the conductive material patches can be mainly improved. It is ensured that the signal coupled from the first radiation arm to the second radiation arm can be transferred between the patches of conductive material.
  • any conductive material patch in the plurality of conductive patches is a sheet-like structure or a bent strip-like structure.
  • the patch of conductive material may be serpentine in shape. In this way, the unfolded length of the conductive material patch can be increased, which is equivalent to increasing the conduction length of the first inductance, thereby increasing the impedance to the signal in the first frequency range.
  • two adjacent conductive material patches are in a sheet-like structure, and two adjacent conductive material patches are in an interdigitated structure at two adjacent ends. This increases the amount of capacitive coupling between patches of conductive material. Equivalent to increasing the capacitance value of the second capacitor, it is ensured that the signal coupled from the first radiation arm to the second radiation arm can be transmitted between the conductive material patches.
  • At least one second conductive via is provided in the insulating medium layer, one end of each second conductive via is connected to a conductive material patch, and the The other end is connected with the second radiation arm.
  • any second radiation arm in the second radiation arm group at least two rows of conductive material patches are distributed in the direction of current flowing through any second radiation arm. In this way, the flexibility of controlling the coupling current generated on the second radiator when the first radiator is operating can be increased.
  • the center horizontal distance and/or the center vertical distance between the first radiation arm group and the second radiation arm group is less than or equal to ⁇ , where ⁇ is the center frequency wavelength of the first frequency range.
  • is the center frequency wavelength of the first frequency range.
  • the second radiator will have an impact on the radiation pattern of the first radiator, and the embodiment of the present application is adopted.
  • the influence of the second radiator on the radiation pattern of the first radiator can be minimized, so a smaller distance between the first radiating arm group and the second radiating arm group can be achieved, so that the two are structurally More compact, which is conducive to the miniaturization of equipment.
  • the maximum size of the path through which the current flows in each conductive material patch is m ⁇ , where ⁇ is the wavelength of the center frequency of the first frequency range, and m ⁇ 0.15. This ensures that the signal of the first radiation arm coupled by the second radiation arm is effectively coupled to the conductive material patch.
  • a plurality of conductive material patches are arranged on one side of each second radiating arm perpendicular to the direction of the ground plate.
  • Two ways to set the conductive material patch are provided.
  • a plurality of conductive material patches are arranged on a side of each second radiation arm close to the ground plate, or a plurality of conductive material patches are arranged on a side of each second radiation arm away from the ground plate.
  • the second radiator is single-polarized or dual-polarized.
  • single polarization can be polarization in any direction, such as polarization perpendicular to the ground or horizontal to the ground;
  • dual polarization can be a polarization perpendicular to the ground or a polarization horizontal to the ground, Or a pair of intersecting ⁇ 45° polarizations, where different polarization modes of the second radiator are provided in this scheme, which enriches the polarization modes of the second radiator.
  • the polarization manner of the second radiator includes: linear polarization, circular polarization, and elliptical polarization.
  • linear polarization includes horizontal polarization and vertical polarization
  • elliptical polarization includes left-handed elliptical polarization and right-handed elliptical polarization
  • circular polarization includes left-handed circular polarization and right-handed circular polarization.
  • different polarization modes of the second radiator are provided, which enriches the polarization modes of the second radiator, so that it can adapt to the intensity requirements of radiation signals in different environments.
  • the maximum frequency of the first frequency range is higher than the maximum frequency of the second frequency range
  • the minimum frequency of the first frequency range is higher than the minimum frequency of the second frequency range. Due to the different sizes of radiators in different frequency ranges, for example, radiators that radiate signals in higher frequency ranges are usually smaller in size; radiators that radiate signals in lower frequency ranges are usually larger in size.
  • radiators that radiate signals in lower frequency ranges are usually larger in size.
  • the space between the radiators is large, so the large-sized radiators can be integrated with the smaller-sized radiators, and the larger-sized radiators can be integrated during integration.
  • the radiator is arranged above the smaller-sized radiator, so that the smaller-sized radiator is arranged in the space between the larger-sized radiators to realize a multi-band fusion antenna.
  • a radiator for a multi-band fusion antenna is provided, the radiator is disposed on a ground plate of the multi-band fusion antenna, the radiator includes a radiation arm group and a balun group, and the radiation arm group
  • the balun group is coupled to the feeding circuit corresponding to the radiator;
  • the radiating arm group includes at least one radiating arm; each of the radiating arms in the radiating arm group is provided with a plurality of conductive materials A patch, wherein an insulating medium layer is arranged between the plurality of conductive material patches and each of the radiation arms.
  • the plurality of conductive material patches are distributed along a direction in which current flows through the radiation arm where the plurality of conductive material patches are located.
  • At least one first conductive via is provided in the insulating medium layer, and each of the first conductive vias is connected to one of the conductive material patches.
  • At least one of the first conductive vias is located on both sides of the radiation arm where the conductive material patch is located, and flows along the current through the radiation arm where the conductive material patch is located
  • the directions of the arms are arranged in order.
  • At least one of the first conductive via holes is located at both ends of the conductive material patch in a direction in which the current flows through the radiation arm where the conductive material patch is located, and is perpendicular to the The directions in which the current flows through the radiation arm where the conductive material patch is located are arranged in sequence.
  • At least one second conductive via hole is provided in the insulating medium layer, one end of each second conductive via hole is connected to one of the conductive material patches, and each of the second conductive via holes is connected to one of the conductive material patches. The other end of the second conductive via is connected to the radiation arm where the conductive material patch is located.
  • any one of the conductive material patches in the plurality of conductive patches is a sheet-like structure or a bent strip-like structure.
  • two adjacent conductive material patches are in a sheet-like structure
  • two adjacent conductive material patches are in an interdigitated structure at two adjacent ends.
  • At least two rows of the conductive material patches are distributed in a direction in which the current flows through any of the radiation arms.
  • a plurality of conductive material patches are arranged on one side of each radiating arm perpendicular to the direction of the ground plate.
  • Two ways to set the conductive material patch are provided.
  • a plurality of conductive material patches are arranged on a side of each radiation arm close to the ground plate, or a plurality of conductive material patches are arranged on a side of each radiation arm away from the ground plate.
  • a third aspect provides an antenna, including: the multi-band fusion antenna assembly in any possible implementation manner of the first aspect and at least two sets of feed circuits, wherein a first radiator of the multi-band fusion antenna assembly is coupled to the first feed circuit corresponding to the first radiator; the second radiator of the multi-band fusion antenna assembly is coupled to the second feed circuit corresponding to the second radiator.
  • a fourth aspect provides an electronic device, characterized in that it includes a radio frequency circuit and the antenna according to the third aspect connected to the radio frequency circuit, and the radio frequency circuit is configured to transmit the processed radio frequency circuit through the antenna. Signal.
  • FIG. 1 is a schematic diagram of a radiation pattern of an antenna according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a base station of a BBU-AAU architecture provided by an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of a base station of a BBU-AAU architecture provided by another embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a multi-band fusion antenna assembly provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a multi-band fusion antenna assembly according to another embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a multi-band fusion antenna assembly according to another embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a multi-band fusion antenna assembly according to still another embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a multi-band fusion antenna assembly according to another embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a multi-band fusion antenna assembly according to another embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a multi-band fusion antenna assembly according to still another embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a multi-band fusion antenna assembly provided by another embodiment of the present application.
  • FIG. 12 is a schematic partial structure diagram of a second radiator according to an embodiment of the present application.
  • FIG. 13 is a schematic partial structure diagram of a second radiator provided by another embodiment of the present application.
  • FIG. 14 is a schematic partial structure diagram of a second radiator provided by another embodiment of the present application.
  • FIG. 15 is a schematic partial structure diagram of a second radiator according to still another embodiment of the present application.
  • FIG. 16 is a schematic partial structure diagram of a second radiator provided by another embodiment of the present application.
  • FIG. 17 is a schematic partial structure diagram of a second radiator provided by yet another embodiment of the application.
  • FIG. 18 is a schematic partial structural diagram of a multi-band fusion antenna assembly provided by an embodiment of the present application.
  • FIG. 19 is a schematic partial structure diagram of a multi-band fusion antenna assembly provided by another embodiment of the present application.
  • 20 is a schematic diagram of an equivalent circuit of a multi-band fusion antenna assembly provided by an embodiment of the present application.
  • FIG. 21 is a schematic partial structure diagram of a multi-band fusion antenna assembly provided by yet another embodiment of the present application.
  • FIG. 22 is a schematic partial structure diagram of a multi-band fusion antenna assembly according to still another embodiment of the present application.
  • FIG. 23 is a schematic partial structural diagram of a multi-band fusion antenna assembly provided by another embodiment of the present application.
  • FIG. 24 is a schematic partial structure diagram of a multi-band fusion antenna assembly provided by yet another embodiment of the present application.
  • FIG. 25 is a schematic diagram of an equivalent circuit of a multi-band fusion antenna assembly provided by another embodiment of the present application.
  • FIG. 26 is a schematic partial structure diagram of a multi-band fusion antenna assembly according to still another embodiment of the present application.
  • FIG. 27 is a schematic diagram of an equivalent circuit of a multi-band fusion antenna assembly provided by yet another embodiment of the present application.
  • FIG. 28 is a schematic diagram of the normalized gain simulation of the RCS of the second radiator of a multi-band fusion antenna according to an embodiment of the application;
  • FIG. 29 is a schematic simulation diagram of an antenna pattern of a multi-band fusion antenna provided by an embodiment of the application.
  • FIG. 30 is a schematic diagram of an actual gain curve in each antenna direction of a multi-band fusion antenna provided by an embodiment of the application;
  • FIG. 31 is a schematic diagram of peak gain curves at various operating frequencies of a multi-band fusion antenna provided by an embodiment of the present application.
  • Antenna array In order to be suitable for applications in various occasions, two or more single antennas working at the same frequency are fed and spatially arranged according to certain requirements to form an array, also called an antenna array.
  • Antenna Array The area of the antenna array.
  • the antenna vibrator is the most basic unit that constitutes an antenna, and has the function of guiding and amplifying electromagnetic waves.
  • the antenna vibrator is a conductor.
  • electromagnetic wave radiation can occur, and the radiation capability is related to the structure of the antenna vibrator.
  • the radiating arm can be used as an antenna element.
  • Scattering is the phenomenon that when the surface of the object irradiated by the projected wave has a large curvature or even is not smooth, the secondary radiation wave is diffused and distributed according to a certain law in the angular domain.
  • Pattern Refers to the graph of the relative field strength (normalized modulus value) of the radiated field changing with the direction at a certain distance from the antenna, usually represented by two mutually perpendicular plane patterns in the maximum radiation direction of the antenna.
  • Antenna bandwidth The frequency range of the antenna electrical parameters within the allowable range, where the center frequency is the frequency midpoint of the antenna bandwidth.
  • Polarization A parameter describing the spatial orientation of the electromagnetic wave vector radiated by an antenna. Since the electric field and the magnetic field have a constant relationship, the spatial orientation of the electric field vector is generally used as the polarization direction of the electromagnetic wave radiated by the antenna.
  • Wavelength The distance a wave travels in one vibration period, usually expressed as ⁇ .
  • the electronic device provided by the embodiments of the present application may be a multi-band fusion base station, or other communication devices with similar functions.
  • the base station can be divided into a baseband unit (BBU)-active antenna unit (AAU), a central unit-distribute unit (CU- DU)-AAU, BBU-remote radio unit (remote radio unit, RRU)-antenna (antenna), CU-DU-RRU-Antenna, integrated base station (node base station, gNB) and other different architectures.
  • BBU baseband unit
  • AAU baseband unit
  • CU- DU central unit-distribute unit
  • RRU remote radio unit
  • CU-DU-RRU-Antenna integrated base station
  • gNB integrated base station
  • the base station includes a BBU11 and an AAU12; wherein, the BBU11 transmits the generated baseband digital signal through the AAU12.
  • the AAU 12 includes n (an integer greater than or equal to 1) signal transmission channels, and each signal transmission channel includes a digital to analog converter 121 (DAC, digital to analog converter), a radio frequency circuit 122 and an antenna 123 , wherein,
  • the digital-to-analog converter 121 is used to convert the baseband digital signal output by the baseband processing unit into an analog signal
  • the radio frequency circuit 122 is used to convert the analog signal into a low-power radio frequency signal and output it to the antenna 123 for outward radiation.
  • the radio frequency circuit 122 may include circuits such as a power amplifier (power amplifier, PA) and a filter (filter), wherein the PA is used to power amplify the low-power radio frequency signal, and the filter is used to filter the radio frequency signal.
  • PA power amplifier
  • filter filter
  • An embodiment of the present application provides an antenna, including a multi-band fusion antenna assembly and at least two sets of feed circuits, wherein the multi-band fusion antenna assembly at least includes a first radiator and a second radiator, and the two radiators can be considered as They are antenna elements, which are used to radiate signals in different frequency bands.
  • the first radiator and the second radiator correspond to the first feeder circuit and the second feeder circuit respectively, the first radiator is coupled to the first feeder circuit, and the second radiator is coupled to the second feeder and the second radiator. electrical circuit.
  • the multi-band fusion antenna assembly 100 may include one or more first radiators 102 , and at the same time, may include one or more second radiators 103 .
  • the first radiator 102 shown in the figure as a “T” shape but relatively low
  • the second radiator 103 shown in the figure as a “T” shape but relatively high
  • the multi-band fusion antenna assembly 100 shown in FIG. 7 includes four first radiators (102-1, 102-2, 102-3, 102-4), and one second radiator 103; FIG.
  • the multi-band fusion antenna assembly 100 includes a plurality of first radiators (represented by, for example, 102-1, 102-n in the figure, other similar ones are not marked) and two second radiators (103-1, 103-n). 2). Meanwhile, as shown in FIG. 4 , the multi-band fusion antenna assembly 100 further includes a ground plate 101 , and two radiators 102 and 103 are respectively disposed on the ground plate 101 .
  • the grounding plate 101 may also be called a reflecting plate. While playing a grounding role, it is also used to reflect part of the radiation signal of the first radiator and part of the radiation signal of the second radiator. The larger the area of the grounding plate, the more The larger the radiated signal that can be reflected, the more.
  • the first radiator 102 is used to radiate signals in the first frequency range
  • the second radiator 103 is used to radiate signals in the second frequency range
  • Radiators that radiate signals in the higher frequency range are usually smaller in size
  • radiators that radiate signals in the lower frequency range are usually larger in size.
  • the radiator is arranged above the radiator of the smaller size, so that the radiator of the smaller size is arranged in the space between the radiators of the larger size to realize the multi-band fusion antenna.
  • the first height H1 of a radiator 102 is smaller than the second height H2 of the second radiator 103, wherein the first height H1 and the second height H2 are the heights in the direction perpendicular to the ground plate 101; Conducive to the miniaturization of equipment.
  • the first radiator 102 includes a first radiation arm group and a first balun group, the first radiation arm group includes at least one (ie one or more) first radiation arms; the first balun group includes at least one first balun ;
  • the first radiation arm group is coupled to the first feeding circuit 104-1 corresponding to the first radiator through the first balun group; for example: in FIG. 4, the first radiation arm 1021 is coupled to the first radiator through the first balun 1022.
  • the second radiator 103 includes a second radiation arm group and a second balun group, the second radiation arm group includes at least one second radiation arm; the second balun group includes at least one second balun; the second radiation arm group passes through The second balun group is coupled to the second feed circuit 104-2 corresponding to the second radiator.
  • the second radiating arm 1031 is coupled to the second feeding circuit 104 - 2 through the second balun 1034 .
  • the radiation arm is an element for radiating signals, which can be considered as an antenna element.
  • Balun's full English name (balanced to unbalanced, referred to as Balun; Chinese full name: balanced-unbalanced converter, referred to as a weighing device), is a common circuit component, the main function of a weighing device is to convert a single-ended signal into The specific implementation of the differential signal is a well-known technology, which is not repeated in this application.
  • the number of radiation arms and baluns is not limited.
  • the second radiation arm group includes four second radiation arms (1031-1, 1031-2, 1031-3, 1031-4), the second balun group includes two second baluns (1034-1, 1034-2), and the second radiating arms 1031-1, 1031-3 are coupled to the second balun through the second balun 1034-1 Feed circuit 104-2; second radiating arms 1031-2, 1031-4 are coupled to second feed circuit 104-2 through second balun 1034-2.
  • the structure of the first radiation arm group can refer to the prior art, such as FIG. 4 and FIG.
  • the first radiation arm group includes four first radiation arms (1021-1, 1021-2, 1021-3, 1021-4), The four first radiating arms constitute the "X"-shaped structure shown in Figure 8), the first balun group includes two first baluns (1022), the first radiating arms (1021-1, 1021-3) The first radiating arms ( 1021 - 2 , 1021 - 4 ) are coupled to the first feeding circuit 104 - 1 through another second balun 1022 .
  • the radio frequency circuit 122-1 is coupled to the first feeding circuit 104-1, so that the radio frequency circuit 122-1 is coupled to the first feeding circuit 104-1.
  • the output radio frequency signal (signal in the first frequency range) can be output to the first balun through the port provided by the first feeding circuit 104-1, and then radiated out through the first radiation arm group.
  • the radio frequency circuit 122-2 is coupled to the second feeding circuit 104-2, so that the radio frequency signal (the signal in the second frequency range) output by the radio frequency circuit 122-1 can be output to the second feeding circuit 104-2 through the port provided by the second feeding circuit 104-2. Two baluns, and then radiate out through the second radiation arm group.
  • all the first radiators (102-1, . (omitted in) can share one first feeding circuit 104-1, that is, all the first radiators are correspondingly coupled to one first feeding circuit, or each first radiator (102-1, . . . 102-n)
  • One first feed circuit may be used respectively, eg each first radiator (102-1, . . . 102-n) is coupled to one first feed circuit, respectively.
  • All second radiators (103-1, 103-2) may share a second feed circuit, that is, all second radiators (103-1, 103-2) are correspondingly coupled to one first feed circuit, Or each second radiator (103-1, 103-2) may be coupled to a second feed circuit, respectively.
  • the balun and the feeding circuit can be coupled through a coaxial line or a microstrip line.
  • FIG. 9 it is a schematic diagram of coupling the balun and the feeding circuit by using a coaxial cable.
  • the balun a is connected to one end of the coaxial cable b through the first interface, and the feeding circuit c is connected through the second interface. Connect the other end of the coaxial line b; when the balun and the feeding circuit are connected by a microstrip line.
  • FIG. 10 it is a schematic diagram of the coupling between the balun and the feeding circuit using microstrip lines.
  • the microstrip line is usually set in the printed circuit board (PCB), and the balun a is usually connected with the The microstrip line d in the PCB is connected, and a first connector is provided on the PCB for input or output of the signal on the microstrip line d; the feeding circuit c is connected to the first connector on the PCB through the second connector.
  • the aforementioned balun a may be the first balun 1022 or the second balun 1034, and the feeding circuit c may be the first feeding circuit 104-1 or the second feeding circuit 104-2.
  • connection manner of the first balun and the first feeding circuit and the connection manner of the second balun and the second feeding circuit can be the same or different.
  • the feed circuit provided by the embodiments of the present application may be in the form of a PCB, wherein conductive traces are provided on the PCB.
  • the feed circuit may specifically include devices such as a power divider and a phase shifter.
  • each second radiation arm in the second radiation arm group (for example, the second radiation arm 1031 in FIG. 4 ) is provided with a plurality of conductive material patches 1032 , wherein the plurality of conductive material patches 1032 and the first radiation arm An insulating medium layer 1033 is disposed between the two radiation arms 1031 .
  • the conductive material patch 1032 may be based on various conductive materials, typically various metals with high electrical conductivity, such as copper, are used.
  • the conductive material patch 1032 is generally a sheet-like structure, such as a rectangular metal strip line.
  • the conductive material patches 1032 are parallel to the second radiation arm 1031 (including 1031-1, 1031-2, 1031-3, 1031-4) and arranged in a row, and each conductive material patch 1032 is equivalent to an inductor.
  • the conductive material patch 1032 and the radiation arm 1031 of the second radiator 103 can be printed on the upper and lower surfaces of the PCB board respectively, that is, the PCB board is used as the insulating medium layer 1033, and the conductive material patch 1032 and the second radiator 103 are printed on the upper and lower surfaces.
  • a coupling capacitance is formed between the second radiation arms 1031 .
  • the distance between the conductive material patches 1032 disposed on the second radiation arm 1031 may be periodic or aperiodic, and a coupling capacitance is formed between adjacent conductive material patches 1031 .
  • the plurality of conductive material patches 1032 are distributed along the direction in which the current flows through the second radiation arm 1031 where the plurality of conductive material patches 1032 are located, and FIG. 5 shows As for the direction of the current I, since the radio frequency signal is usually an alternating current signal, the current direction on the second radiation arm 1031-1 is usually two opposite directions. Wherein, a plurality of conductive material patches 1032 are disposed on one side of each second radiation arm 1033 perpendicular to the direction of the ground plate 101 . For example, in FIG.
  • the conductive material patch 1032 may also extend to both sides of the second radiation arm 1031 in a direction perpendicular to the current flow in the second radiation arm. As shown in FIG. 11, in the direction perpendicular to the current I in the second radiation arm 1031, the width W2 of the second radiation arm 1031 may be greater than the width W1 of the conductive material patch 1032, or the width W2 of the second radiation arm 1031 may also be Less than or equal to the width W1 of the conductive material patch 1032 .
  • FIG. 12 is a schematic top view of the partial structure of the second radiator
  • FIG. 13 is a structural view along the direction A of the structure shown in FIG. 12
  • FIG. Figure 12 shows a structural view of the structure along the B direction.
  • the conductive material patch 1032 is disposed on the side of the second radiation arm 1031 close to the ground plate 102 ( FIG. 4 ).
  • FIG. 15 is a schematic top view of the partial structure of the second radiator
  • FIG. 16 is a structural view of the structure shown in FIG. 15 along the direction A
  • FIG. 17 is a corresponding view 15 shows a structural view of the structure along the B direction.
  • the conductive material patch 1032 is disposed on the side of the second radiation arm 1031 away from the ground plate 102 ( FIG. 4 ).
  • two adjacent conductive material patches are in sheet-like structures.
  • two adjacent conductive material patches are Sheets 1032-1 and 1032-2 are interdigitated structures 1036 (or referred to as interdigitated structures) at two adjacent ends.
  • interdigitated structures 1036 or referred to as interdigitated structures
  • any conductive material patch among the plurality of conductive material patches 1032 is a bent strip structure, which can increase the expansion length of the conductive material patch 1032, which is equivalent to increasing the conduction length of the current in the conductive material patch 1032, thereby increasing the impedance to high frequency signals.
  • the shape of the conductive material patch 1032 may be serpentine.
  • a first capacitor C1 is formed between it and the second radiation arm 1031
  • a second capacitor C2 is formed between adjacent conductive material patches 1032
  • each conductive material patch 1032 The opposite second radiation arm 1031 is equivalent to the first inductance L1
  • each conductive material patch 1032 itself is equivalent to the second inductance L2, thus forming an equivalent circuit as shown in FIG. 20, the capacitance in the equivalent circuit C1 and C2 have the characteristic of conducting signals in the first frequency range, and the inductors L1 and L2 have the effect of high resistance to the signals in the first frequency range.
  • the equivalent circuit formed by C1, C2, L1 and L2 can effectively Filter out the induced current of the signal in the first frequency range that is coupled on the second radiator when the first radiator is working, that is, it has a decoupling effect on the induced current formed on the second radiator of the signal in the first frequency range , so that the influence of the second radiator on the radiation pattern of the first radiator can be reduced, the radiation pattern distortion of the antenna element can be reduced, and the radiation efficiency of the multi-frequency common aperture antenna array can be improved.
  • the L1 , L2 , C1 and C2 are adjusted It can also realize the control of the coupling current generated on the second radiator when the first radiator is working.
  • the maximum frequency of the first frequency range is higher than the maximum frequency of the second frequency range, and the minimum frequency of the first frequency range is higher than the minimum frequency of the second frequency range.
  • the size of the first radiator 102 is usually smaller, and the second radiator 103 The size of the radiator is relatively large, so the first radiator 102 can be arranged below the second radiator 103 . That is, the length of the first balun 1022 to which the first radiation arm 1021 is connected is smaller than the length of the second balun 1034 to which the second radiation arm 1031 is connected. In some embodiments, as shown in FIG.
  • the center horizontal distance L and ⁇ or center vertical distance H of the first radiation arm group and the second radiation arm group are less than or equal to ⁇ , where ⁇ is the center frequency wavelength of the first frequency range.
  • the first radiation arm group includes four first radiation arms (1021-1, 1021-2, 1021-3, 1021-4), and the second radiation arm group includes four The second radiation arm (1031-1, 1031-2, 1031-3, 1031-4), the center of the first radiation arm group is four first radiation arms (1021-1, 1021-2, 1021-3, 1021 -4), the center of the second radiation arm group is the geometric center of the four second radiation arms (1031-1, 1031-2, 1031-3, 1031-4).
  • the second radiator will affect the radiation pattern of the first radiator.
  • the center horizontal distance and the center vertical distance of the first radiating arm group and the second radiating arm group are set to be greater than ⁇ , so that It is not conducive to the miniaturization of equipment.
  • the influence of the second radiator on the radiation pattern of the first radiator can be minimized, and therefore, the first radiation arm group and the second radiation arm group can be made smaller (for example, the center horizontal distance and/or the center vertical distance of the first radiation arm group and the second radiation arm group can be configured to be less than or equal to ⁇ ), so that the two are more compact in structure, thereby facilitating the miniaturization of the device.
  • the maximum size of the path through which the current flows in each conductive material patch 1032 is m ⁇ , where ⁇ is the center frequency wavelength of the first frequency range, and m ⁇ 0.15.
  • the maximum size of the path through which the current flows in the conductive material patch 1032 is mainly related to the shape of the conductive patch.
  • the thickness of the conductive material patch is usually the smallest in its structure. The application does not consider the influence of its thickness on the path through which the current flows, and the path through which the current flows mainly considers the path of the current in the plane of the conductive material patch perpendicular to its thickness direction. As shown in FIG. 11 and FIG.
  • the conductive material patch 1032 is a sheet-like structure, and the maximum size of the path through which the current flows is the length of the current flowing in the conductive material patch 1032 along the center line of the conductive material patch 1032; As shown in 20, the conductive material patch 1032 is a bent strip structure, and the maximum size of the current flowing in the conductive material patch 1032 is from one end of the conductive material patch 1032 to the other end. The current flows along each part of the conductive material patch 1032 The length of the midline flowing through. This ensures that the signal of the first radiation arm coupled by the second radiation arm is effectively coupled to the conductive material patch. In addition, the distance between adjacent conductive material patches 1032 is less than or equal to ⁇ /100 to ensure strong coupling between adjacent conductive material patches 1032 and to ensure that the signal coupled from the first radiation arm to the second radiation arm can Pass between patches of conductive material.
  • At least one first conductive via 1035 (as shown in FIG. 21 ) is provided, and each first conductive via 1035 is connected to one conductive material patch 1032 . Due to the conduction characteristic of C1 to the signal in the first frequency band, it is ensured that the signal coupled from the first radiation arm to the second radiation arm can be sufficiently coupled to the conductive material patch 1032 .
  • the first conductive via 1035 can increase the sensing area between the conductive material patches, thereby increasing the amount of capacitive coupling between the conductive material patch 1032-1 and the conductive material patch 1032-2 (ie, the The capacitance value of C2), due to the conduction characteristic of C2 to signals in the first frequency band, it is ensured that the signal coupled from the first radiation arm to the second radiation arm can be transmitted between the conductive material patches.
  • At least one first conductive via 1035 is located on both sides of the second radiation arm 1031 where the conductive material patch is located, and flows along the direction of the current I through the second radiation arm 1031 where the conductive material patch 1032 is located in order. And the conductive material patch 1032 is not connected to the second radiation arm 1031.
  • At least one first conductive via 1035 is mainly arranged on both sides of the second radiation arm 1031 along the direction in which the current flows through the second radiation arm 1031, it is mainly The capacitive coupling amount between the second radiation arm 1031 and the conductive material patch 1035 can be increased, that is, the capacitance value of the first capacitor C1 is mainly increased, ensuring that the signal coupled from the first radiation arm to the second radiation arm can be fully coupled to the conductive material patch.
  • At least one first conductive via 1035 is located in the conductive material in the direction of flowing through the second radiation arm 1031 where the conductive material patches 1032 are located.
  • the two ends of the patch 1032 are arranged in sequence along the direction perpendicular to the current I flowing through the second radiation arm 1031 where the conductive material patch 1032 is located.
  • the at least one first conductive via 1035 is mainly arranged at both ends of the conductive material patch 1032 along the direction perpendicular to the current flowing through the second radiation arm 1031, the capacitive coupling between the conductive material patches can be mainly improved. quantity. For example, in FIG.
  • the first conductive via 1035-1 connected to the conductive material patch 1032-1 is opposite to the first conductive via 1035-2 connected to the conductive material patch 1032-2, and the first conductive via added It is equivalent to increasing the facing area between the conductive material patch and the conductive material patch, which is equivalent to increasing the capacitance value of the second capacitor, ensuring that the signal coupled from the first radiation arm to the second radiation arm can pass through the conductive material. transfer between patches.
  • At least one second conductive via 1037 may be provided in the insulating dielectric layer 1033 , each second conductive via One end of the via hole 1037 is connected to a conductive material patch 1032 , and the other end of the second conductive via hole 1037 is connected to the second radiation arm 1031 .
  • This is equivalent to adding an inductance between the conductive material patch 1032 and the second radiation arm 1031 .
  • an inductance L3 is added to the equivalent circuit.
  • the first conductive via and the second conductive via may be metallized vias. Furthermore, it is understood that the first conductive via or the second conductive via may be provided in each or a portion of the plurality of patches of conductive material.
  • the width W1 of a conductive material patch is less than or equal to the width W2 of the second radiation arm, only the above-mentioned second conductive via can be set for the conductive material patch.
  • the width W1 of a conductive material patch is greater than the width W2 of the second radiation arm, the first conductive via hole and the second conductive via hole can be set entirely or selectively for the conductive material patch.
  • At least two rows of conductive material patches 1032 are distributed in the direction of any second radiation arm 1031 .
  • the capacitor C1 ′ is any one of the conductive material patches 1032 - 2 and the second radiation arm 1031 in the newly added row of conductive material patches 1032 .
  • the capacitance C2' is the capacitance between any conductive material patch 1032-2 and the adjacent conductive material patch 1032-3, and L2' is the inductance of any conductive material patch 1032-2.
  • a capacitance C3 is introduced between two adjacent columns of conductive material patches (1032-1, 1032-2).
  • the antenna in the embodiment of the present application may be an array antenna.
  • the antenna in the embodiment of the present application includes two antenna arrays, wherein the first antenna array includes 4 columns of antenna elements (8 elements in each column). , a total of 32 antenna elements, each antenna element is shown as an X shape in FIG. 8 ), wherein the antenna elements in the first antenna array are realized by the first radiation arm group of the above-mentioned first radiator 102 for transmitting the first a frequency range of signals.
  • the second antenna array includes a column of antenna elements (2 in each column, 2 antenna elements in total, each antenna element is shown as 4 squares arranged together in FIG.
  • the second radiation arm group of the second radiator 103 is implemented for emitting signals in the second frequency range.
  • the second radiation arm 1031 may be linear, polygonal or circular.
  • the second radiator 103 is a single-polarized radiator (which can be considered to implement a single-polarized antenna) or a dual-polarized radiator (which can be considered to implement a dual-polarized antenna), wherein the single polarization can be Polarization in either direction, such as polarization perpendicular to the ground or horizontal to the ground; dual polarization can be a polarization perpendicular to the ground or a polarization horizontal to the ground, or a pair of intersecting polarizations.
  • the second radiation arm group of the second radiator includes one or more second radiation arms, a single or two second radiation arms can form a single polarization, and two or four second radiation arms can also form a dual Polarization, for example, as shown in FIG.
  • the polarization mode of the radiator 103 may be any of the following polarization modes: linear polarization, circular polarization, and elliptical polarization.
  • linear polarization includes horizontal polarization and vertical polarization
  • elliptical polarization includes left-handed elliptical polarization and right-handed elliptical polarization
  • circular polarization includes left-handed circular polarization and right-handed circular polarization.
  • different polarization modes of the second radiator are provided, which enriches the polarization modes of the second radiator, so that it can adapt to the intensity requirements of radiation signals in different environments.
  • the second radiator 103 forms a square-shaped antenna element.
  • the first radiator 102 and the second radiator 103 are both polarized at ⁇ 45°.
  • the plurality of conductive material patches 1032 are distributed along the direction in which the current flows through the second radiation arm 1031 where the plurality of conductive material patches 1032 are located, wherein the direction of the current I is shown in FIG. 5 , because Usually, the radio frequency signal is an AC signal, so the current directions on the second radiation arm 1031-1 are usually two opposite directions.
  • the embodiment provides a structural design diagram of a second radiation arm group.
  • the second radiating arm group is in the shape of a "field", and the two opposite "mouths” represent +45° and -45° polarizations, respectively, and are composed of a pair of orthogonal second baluns (1304-1 and 1304-2) ) feeding, for example: the second radiating arm 1031-1 is fed by the second balun 1304-1; the second radiating arm 1031-2 is fed by the second balun 1304-2.
  • a conductive material patch 1032 is arranged on the outer frame of the "Tian" shape (ie, the radiation arm).
  • FIG. 28 is a schematic diagram of simulation based on half of the antenna provided in FIG. 8 (for example, including one second radiator and 16 first radiators in the upper half).
  • FIG. 28 is a simulation result of the normalized gain (dB) of the radar cross-section (radar cross-section, RCS) of the second radiator 103 .
  • the solution provided by the embodiments of the present application (a conductive material patch is arranged on the radiation arm of the second radiator) is compared with the prior art solution (the radiation arm of the second radiator) No conductive material patch is provided on it) can achieve 6dB RCS optimization.
  • FIG. 29 is the antenna pattern of the ideal state when the first radiator (ie, the high-frequency antenna element) is working; (b) in FIG.
  • FIG. 30 provides the actual gain (realized gain) curves of each antenna direction ( ⁇ /°) when the first radiator (ie, the high-frequency antenna element) works when the antenna only includes the first radiator; and based on the above-mentioned FIG. 8
  • the structure and configuration of the antenna vibrator shown in the antenna, the multi-frequency common aperture antenna array in the prior art (the first radiator (ie the high-frequency antenna vibrator) and the second radiator (ie the low-frequency antenna vibrator) are not provided with conductive material stickers.
  • the actual gain (realized gain) curve under each antenna direction ( ⁇ /°) when the first radiator of the film (coexistence) works; and based on the structural configuration of the antenna element shown in the antenna provided by the above-mentioned FIG.
  • Each antenna direction of the first radiator of the multi-frequency common aperture antenna array provided by the embodiment (the first radiator (ie the high-frequency antenna element) and the second radiator (ie the low-frequency antenna element, provided with the conductive material patch) coexist)
  • FIG. 31 provides a multi-frequency common aperture antenna array (the first radiator (ie the high-frequency antenna element) and the second radiator (ie, the high-frequency antenna element) in the prior art.

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Abstract

本申请的实施例提供一种多频段融合天线组件,涉及通信技术领域,能够降低多频段融合天线中不同频段的辐射体辐射信号的耦合,降低天线振子的方向图畸变。该多频段融合天线组件,包括第一辐射体用于辐射第一频率范围的信号,第二辐射体用于辐射第二频率范围的信号;第一辐射体的第一高度小于第二辐射体的第二高度;第一辐射体包括第一辐射臂组以及第一巴伦组;第二辐射体包括第二辐射臂以及第二巴伦组;第二辐射臂组包括至少一个第二辐射臂;第二辐射臂组中的每个第二辐射臂上设置有多个导电材料贴片,其中多个导电材料贴片与每个第二辐射臂之间设置有绝缘介质层。

Description

多频段融合天线组件
本申请要求于2020年11月06日提交国家知识产权局、申请号为202011233919.7、申请名称为“多频段融合天线组件”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域,尤其涉及一种多频段融合天线组件。
背景技术
随着无线通信的进阶式发展,第二/三/四/五代(2G/3G/4G/5G)移动通信技术中多种频段会共存于基站天线***中。从产品研发和***安装的角度,为了节省宝贵的空间资源,降低安装难度,提高通信***的兼容性和多功能性,将不同频段的天线融合在一起,集成设计成多频共口径天线阵列,是基站天线发展的必然趋势。
但由于基站天线阵面尺寸有限,当天线振子间距减小时,不同频段的天线振子的空间分布往往存在重叠和嵌套,天线振子之间的耦合会显著影响天线阵列的性能。位于上方的大尺寸低频天线振子的辐射体将会遮挡下方小尺寸高频天线振子的辐射体(如图1所示),这样,高频天线振子的辐射体工作时,低频天线阵子的辐射体会感应到高频电流,从而引起的电磁场散射和反射作用会造成高频天线振子的辐射方向图发生畸变,从而恶化整个多频共口径天线阵列的辐射效率。
发明内容
本申请的实施例提供一种辐射体、多频段融合天线组件、天线及电子设备,能够降低多频段融合天线中不同频段的辐射体辐射信号的耦合,降低天线振子的辐射方向图畸变,提高多频共口径天线阵列的辐射效率。
第一方面,提供一种多频段融合天线组件。该多频段融合天线组件,包括接地板、第一辐射体以及第二辐射体;第一辐射体用于辐射第一频率范围的信号,第二辐射体用于辐射第二频率范围的信号;接地板用于反射第一辐射体辐射的部分信号以及第二辐射体辐射的部分信号;第一辐射体的第一高度小于第二辐射体的第二高度,第一高度与第二高度为垂直于接地板方向上高度;第一辐射体包括第一辐射臂组以及第一巴伦组,第一辐射臂组通过第一巴伦组耦合至与第一辐射体对应的第一馈电电路;第二辐射体包括第二辐射臂组以及第二巴伦组,第二辐射臂组通过第二巴伦组耦合至与第二辐射体对应的第二馈电电路;第二辐射臂组包括至少一个第二辐射臂;第二辐射臂组中的每个第二辐射臂上设置有多个导电材料贴片,其中多个导电材料贴片与每个第二辐射臂之间设置有绝缘介质层。这样,每个导电材料贴片与第二辐射臂之间形成第一电容,相邻的导电材料贴片之间形成第二电容,与每个导电材料贴片相对的第二辐射臂等效于第一电感,每个导电材料贴片自身等效于第二电感,这样形成的等效电路中的第一电容和第二电容具有对第一频率范围的信号导通的特性,第一电感和第二电感具有对第一频率范围的信号高阻的作用,能够有效滤除第一辐射体工作时在第二辐射体上耦合的对第一频率范围的信号的感应电流,即对第一频率范围的信号在第二辐射体上形成的感应电流具有去耦作用,从而能够降低第二辐射体对第一辐射体的辐射 方向图的影响,降低天线振子的辐射方向图畸变,提高多频共口径天线阵列的辐射效率。此外,根据第一辐射体的工作频率,通过改变导电材料贴片的面积(例如:形状)和位置(例如导电材料贴片之间距离的周期)来调整第一电容、第二电容、第一电感和第二电感的值,也可以实现对第一辐射体工作时在第二辐射体上产生的耦合电流的控制。
在一种可能实现方式中,多个导电材料贴片沿电流流经多个导电材料贴片所在的第二辐射臂的方向分布。由于第一辐射臂的辐射方向图主要与耦合至第二辐射臂中的第一频率范围的信号的感应电流相关,因此需要在电流流经第二辐射臂的方向上对第二辐射臂耦合的第一辐射臂的信号进行去耦,因此多个导电材料贴片沿电流流经多个导电材料贴片所在的第二辐射臂的方向分布。
在一种可能实现方式中,在绝缘介质层中设置有至少一个第一导电过孔,每个第一导电过孔与一个导电材料贴片连接。由于增加的第一导电过孔相当于增加了导电材料贴片面积,这样可以增加导电材料贴片与第二辐射臂的正对面积,并且可以增加导电材料贴片之间的感应面积,相当于增加了第一电容以及第二电容的电容值。由于第一电容对第一频段范围的信号的导通特性,确保了第一辐射臂耦合至第二辐射臂的信号能够充分的耦合至导电材料贴片。由于第二电容的对第一频段范围的信号的导通特性,确保了第一辐射臂耦合至第二辐射臂的信号能够在导电材料贴片之间传递。
在一种可能实现方式中,至少一个第一导电过孔位于导电材料贴片所在的第二辐射臂的两侧,并沿电流流经导电材料贴片所在的第二辐射臂的方向依次排列。这样,由于至少一个第一导电过孔主要沿电流流经导电材料贴片所在的第二辐射臂的方向依次排列于第二辐射臂的两侧,因此主要可以提高第二辐射臂与导电材料贴片之间的电容耦合量,即主要增加了第一电容的电容值,确保了第一辐射臂耦合至第二辐射臂的信号能够充分的耦合至导电材料贴片。
在一种可能实现方式中,至少一个第一导电过孔在流经导电材料贴片所在的第二辐射臂的方向位于导电材料贴片的两端,并沿垂直于电流流经导电材料贴片所在的第二辐射臂的方向依次排列。这样,由于至少一个第一导电过孔主要沿垂直于电流流经导电材料贴片所在的第二辐射臂的方向依次排列于导电材料贴片的两端,因此增加的至少一个第一导电过孔相当于增加了导电材料贴片与导电材料贴片之间的正对的面积,相当于增加了第二电容的电容值,因此主要可以提高导电材料贴片之间的电容耦合量。确保了第一辐射臂耦合至第二辐射臂的信号能够在导电材料贴片之间传递。
在一种可能实现方式中,所述多个导电贴片中的任一导电材料贴片为片状结构或者弯折的带状结构。例如,导电材料贴片的形状可以为蛇形。这样可以增加导电材料贴片的展开长度,相当于增加了第一电感的传导长度,从而增加了对第一频率范围的信号的阻抗。
在一种可能实现方式中,相邻的两个导电材料贴片为片状结构,相邻的两个导电材料贴片在相邻的两个端部为交指结构。这样提高了导电材料贴片之间的电容耦合量。相当于增加了第二电容的电容值,确保了第一辐射臂耦合至第二辐射臂的信号能够在导电材料贴片之间传递。
在一种可能实现方式中,在所述绝缘介质层中设置有至少一个第二导电过孔,每 个第二导电过孔的一端与一导电材料贴片连接,每个第二导电过孔的另一端与第二辐射臂连接。这样相当于在导电材料贴片与导电材料贴片所在的第二辐射臂之间增加一个电感,提高了等效电路的滤波特性。
在一种可能实现方式中,第二辐射臂组中的任一第二辐射臂上,电流流经任一第二辐射臂的方向分布有至少两列导电材料贴片。这样,可以增加对第一辐射体工作时在第二辐射体上产生的耦合电流的控制的灵活性。
在一种可能实现方式中,第一辐射臂组和第二辐射臂组的中心水平距离和/中心垂直距离小于等于λ,其中,λ为第一频率范围的中心频率波长。通常,第一辐射臂组和第二辐射臂组的中心水平距离和/中心垂直距离小于等于λ时,第二辐射体会对第一辐射体的辐射方向图产生影响,而采用本申请的实施例提供的方案时,可以尽量减小第二辐射体对第一辐射体的辐射方向图产生的影响,因此可以实现第一辐射臂组和第二辐射臂组更小的距离,使得两者结构上更加紧凑,从而有利于设备小型化。
在一种可能实现方式中,每个导电材料贴片中电流流经的路径的最大尺寸为mλ,其中λ为第一频率范围的中心频率波长,m≤0.15。这样能够确保第二辐射臂耦合的第一辐射臂的信号有效耦合至导电材料贴片。
在一种可能实现方式中,多个导电材料贴片设置于每个第二辐射臂垂直于接地板方向的一侧。提供了两种导电材料贴片的设置方式。例如:多个导电材料贴片设置于每个第二辐射臂上靠近接地板的一侧,或者,多个导电材料贴片设置于每个第二辐射臂上远离接地板的一侧。
在一种可能实现方式中,第二辐射体为单极化或双极化。其中单极化可以为任一方向的极化,例如垂直于地面方向或与地面水平方向的极化;双极化可以一个垂直于地面方向的极化或与一个与地面水平方向的极化,或者一对相交的±45°的极化,其中该方案中提供了第二辐射体不同的极化方式,丰富了第二辐射体的极化方式,另外采用双极化形式可以更有利于在复杂环境中减小极化损失。
在一种可能实现方式中,第二辐射体的极化方式包括:线极化、圆极化、椭圆极化。示例性的,线极化包括水平极化和垂直极化,椭圆极化包括左旋椭圆极化和右旋椭圆极化,圆极化包括左旋圆极化与右旋圆极化。在该方案中提供了第二辐射体不同的极化方式,丰富了第二辐射体的极化方式,从而可以适应于不同环境下辐射信号的强度要求。
在一种可能实现方式中,第一频率范围的最大频率高于第二频率范围的最大频率,且第一频率范围的最小频率高于第二频率范围的最小频率。由于不同频率范围的辐射体的尺寸不同,例如辐射较高频率范围的信号的辐射体,通常尺寸较小;辐射较低频率范围的信号的辐射体,通常尺寸较大。当天线上设置多个较大尺寸的辐射体时,辐射体之间的空间较大,因此可以将较大尺寸的辐射体与较小尺寸的辐射体做集成,在集成时可以将较大尺寸的辐射体设置于较小尺寸的辐射体的上方,从而将较小尺寸的辐射体设置到较大尺寸的辐射体之间的空间中,实现多频段融合天线。
第二方面,提供一种用于多频段融合天线的辐射体,辐射体设置于所述多频段融合天线的接地板上,所述辐射体包括辐射臂组以及巴伦组,所述辐射臂组通过所述巴伦组耦合至与所述辐射体对应的馈电电路;所述辐射臂组包括至少一个辐射臂;所述 辐射臂组中的每个所述辐射臂上设置有多个导电材料贴片,其中所述多个导电材料贴片与每个所述辐射臂之间设置有绝缘介质层。
在一种可能实现方式中,所述多个导电材料贴片沿电流流经所述多个导电材料贴片所在的所述辐射臂的方向分布。
在一种可能实现方式中,在所述绝缘介质层中设置有至少一个第一导电过孔,每个所述第一导电过孔与一个所述导电材料贴片连接。
在一种可能实现方式中,至少一个所述第一导电过孔位于所述导电材料贴片所在的所述辐射臂的两侧,并沿电流流经所述导电材料贴片所在的所述辐射臂的方向依次排列。
在一种可能实现方式中,至少一个所述第一导电过孔在电流流经所述导电材料贴片所在的所述辐射臂的方向位于所述导电材料贴片的两端,并沿垂直于所述电流流经所述导电材料贴片所在的所述辐射臂的方向依次排列。
在一种可能实现方式中,在所述绝缘介质层中设置有至少一个第二导电过孔,每个所述第二导电过孔的一端与一个所述导电材料贴片连接,每个所述第二导电过孔的另一端与所述导电材料贴片所在的所述辐射臂连接。
在一种可能实现方式中,所述多个导电贴片中的任一所述导电材料贴片为片状结构或者弯折的带状结构。
在一种可能实现方式中,相邻的两个所述导电材料贴片为片状结构时,相邻的两个所述导电材料贴片在相邻的两个端部为交指结构。
在一种可能实现方式中,所述辐射臂组中的任一所述辐射臂上,电流流经任一所述辐射臂的方向分布有至少两列所述导电材料贴片。
在一种可能实现方式中,多个导电材料贴片设置于每个辐射臂垂直于接地板方向的一侧。提供了两种导电材料贴片的设置方式。例如:多个导电材料贴片设置于每个辐射臂上靠近接地板的一侧,或者,多个导电材料贴片设置于每个辐射臂上远离接地板的一侧。
第三方面,提供一种天线,包括:第一方面的任一可能的实现方式中的多频段融合天线组件以及至少两组馈电电路,其中所述多频段融合天线组件的第一辐射体耦合至与所述第一辐射体对应的第一馈电电路;所述多频段融合天线组件的第二辐射体耦合至与所述第二辐射体对应的第二馈电电路。
第四方面,提供一种电子设备,其特征在于,包括射频电路以及与射频电路连接的如第三方面所述的天线,所述射频电路用于通过所述天线发送所述射频电路处理后的信号。
其中,第二方面至第四方面中任一种可能实现方式中所带来的技术效果可参见上述第一方面不同的实现方式所带来的技术效果,此处不再赘述。
附图说明
图1为本申请的实施例提供的一种天线的辐射方向图示意图;
图2为本申请的实施例提供的一种BBU-AAU架构的基站的结构示意图;
图3为本申请的另一实施例提供的一种BBU-AAU架构的基站的结构示意图;
图4为本申请的实施例提供的一种多频段融合天线组件的结构示意图;
图5为本申请的另一实施例提供的一种多频段融合天线组件的结构示意图;
图6为本申请的又一实施例提供的一种多频段融合天线组件的结构示意图;
图7为本申请的再一实施例提供的一种多频段融合天线组件的结构示意图;
图8为本申请的另一实施例提供的一种多频段融合天线组件的结构示意图;
图9为本申请的又一实施例提供的一种多频段融合天线组件的结构示意图;
图10为本申请的再一实施例提供的一种多频段融合天线组件的结构示意图;
图11为本申请的另一实施例提供的一种多频段融合天线组件的结构示意图;
图12为本申请的实施例提供的一种第二辐射体的局部结构示意图;
图13为本申请的另一实施例提供的一种第二辐射体的局部结构示意图;
图14为本申请的又一实施例提供的一种第二辐射体的局部结构示意图;
图15为本申请的再一实施例提供的一种第二辐射体的局部结构示意图;
图16为本申请的另一实施例提供的一种第二辐射体的局部结构示意图;
图17为本申请的又一实施例提供的一种第二辐射体的局部结构示意图;
图18为本申请的实施例提供的一种多频段融合天线组件的局部结构示意图;
图19为本申请的另一实施例提供的一种多频段融合天线组件的局部结构示意图;
图20为本申请的实施例提供的一种多频段融合天线组件的等效电路示意图;
图21为本申请的又一实施例提供的一种多频段融合天线组件的局部结构示意图;
图22为本申请的再一实施例提供的一种多频段融合天线组件的局部结构示意图;
图23为本申请的另一实施例提供的一种多频段融合天线组件的局部结构示意图;
图24为本申请的又一实施例提供的一种多频段融合天线组件的局部结构示意图;
图25为本申请的另一实施例提供的一种多频段融合天线组件的等效电路示意图;
图26为本申请的再一实施例提供的一种多频段融合天线组件的局部结构示意图;
图27为本申请的再一实施例提供的一种多频段融合天线组件的等效电路示意图;
图28为本申请的实施例提供的一种多频段融合天线的第二辐射体的RCS的归一化的增益仿真示意图;
图29为本申请的实施例提供的一种多频段融合天线的天线方向图的仿真示意图;
图30为本申请的实施例提供的一种多频段融合天线的各个天线方向下的实际增益曲线的示意图;
图31为本申请的实施例提供的一种多频段融合天线的各个工作频率下的峰值增益曲线的示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。
天线阵列:为适合各种场合的应用,将工作在同一频率的两个或两个以上的单个天线,按照一定的要求进行馈电和空间排列构成阵列,也叫天线阵。
天线阵面:天线阵列的面积。
天线振子:天线振子是构成天线的最基本单位,具有导向和放大电磁波的作用。通常天线振子为导体,当天线振子上有交变电流流动时,可以发生电磁波辐射,辐射能力与天线振子的结构相关。在本申请的实施例中可将辐射臂作为天线振子。
散射:散射是被投射波照射的物体表面曲率较大甚至不光滑时,其二次辐射波在角域上按一定的规律作扩散分布的现象。
方向图:指在离天线一定距离处,辐射场的相对场强(归一化模值)随方向变化的图形,通常采用通过天线最大辐射方向上的两个相互垂直的平面方向图来表示。
天线带宽:天线电参数在容许范围之内的频率范围,其中,中心频率为天线带宽的频率中点。
极化:描述天线辐射电磁波矢量空间指向的参数。由于电场与磁场有恒定的关系,故一般都以电场矢量的空间指向作为天线辐射电磁波的极化方向。
波长:波在一个振动周期内传播的距离,常用λ表示。
本申请的实施例提供的电子设备可以是一种多频段融合的基站,或者具有类似功能的其他通信设备。以多频段融合的基站为例,该基站可分为基带处理单元(baseband unit,BBU)-有源天线单元(active antenna unit,AAU)、集中单元-分布单元(central unit-distribute unit,CU-DU)-AAU、BBU-射频拉远单元(remote radio unit,RRU)-天线(antenna)、CU-DU-RRU-Antenna、一体化基站(node base station,gNB)等不同的架构。以BBU-AAU架构的基站为例,参照图2所示,该基站包括BBU11和AAU12;其中,BBU11将生成的基带数字信号通过AAU12发射。如图3所示,AAU12包括n(大于等于1的整数)个信号传输通道,每个信号传输通道包括数模转换器121(DAC,digital to analog converter)、射频电路122以及天线123,其中,数模转换器121用于将基带处理单元输出的基带数字信号转换为模拟信号,射频电路122用于将该模拟信号转化为小功率的射频信号后输出至天线123进行向外辐射。其中,射频电路122可以包括:功率放大器(power amplifier,PA)以及滤波器(filter)等电路,其中PA用于将小功率的射频信号进行功率放大,滤波器用于对射频信号进行滤波处理。可以理解,本申请的实施例不限于上述图2、图3示出的基站,任意需要使用到天线对射频信号向外辐射的上述电子设备均属于本申请的实施例的应用场景。
本申请的实施例提供了一种天线,包括多频段融合天线组件以及至少两组馈电电路,其中多频段融合天线组件至少包括第一辐射体以及第二辐射体,这两个辐射体可认为是天线振子,分别用于辐射不同频段的信号。第一辐射体与第二辐射体分别对应于第一馈电电路以及第二馈电电路,第一辐射体耦合至第一馈电电路,第二辐射体耦合至与第二辐射体第二馈电电路。下面对本申请中的多频段融合天线组件进行具体介绍。
参照图4、图5、图6所示,本申请实施例提供的多频段融合天线组件100可以包括 一个或者多个第一辐射体102,同时,可以包括一个或者多个第二辐射体103。为了示意方便,在图4-图6中,用第一辐射体102(图中所示呈“T”字形但相对比较低的)和第二辐射体103(图中所示呈“T”字形但相对比较高的)来表示多频段融合天线组件100所需要包括的最少数量的辐射体。例如,图7示出的多频段融合天线组件100包含四个第一辐射体(102-1、102-2、102-3、102-4),和一个第二辐射体103;图8示出的多频段融合天线组件100包含多个第一辐射体(图中用例如102-1、102-n表示,其他类似的并未标出)和两个第二辐射体(103-1、103-2)。同时,如图4所示,多频段融合天线组件100还包括接地板101,两个辐射体102、103分别设置在接地板101上。本申请中,接地板101在也可称作反射板,在起到接地作用的同时,还用于反射第一辐射体的部分辐射信号以及第二辐射体的部分辐射信号,接地板的面积越大可以反射的辐射信号也越多。
本申请的实施例中,第一辐射体102用于辐射第一频率范围的信号,第二辐射体103用于辐射第二频率范围的信号;由于不同频率范围的辐射体的尺寸不同,例如辐射较高频率范围的信号的辐射体,通常尺寸较小;辐射较低频率范围的信号的辐射体,通常尺寸较大。当天线上设置多个较大尺寸的辐射体时,辐射体之间的空间较大,因此可以将较大尺寸的辐射体与较小尺寸的辐射体做集成,在集成时可以将较大尺寸的辐射体设置于较小尺寸的辐射体的上方,从而将较小尺寸的辐射体设置到较大尺寸的辐射体之间的空间中,实现多频段融合天线,例如参照图4所示,第一辐射体102的第一高度H1小于第二辐射体103的第二高度H2,其中,第一高度H1与第二高度H2为垂直于接地板101方向上的高度;这样可以大幅节省空间,有利于设备小型化。
第一辐射体102包括第一辐射臂组以及第一巴伦组,第一辐射臂组包括至少一个(即一个或多个)第一辐射臂;第一巴伦组包括至少一个第一巴伦;第一辐射臂组通过第一巴伦组耦合至与第一辐射体对应的第一馈电电路104-1;例如:图4中,第一辐射臂1021通过第一巴伦1022耦合至第一馈电电路104-1。第二辐射体103包括第二辐射臂组以及第二巴伦组,第二辐射臂组包括至少一个第二辐射臂;第二巴伦组包括至少一个第二巴伦;第二辐射臂组通过第二巴伦组耦合至与第二辐射体对应的第二馈电电路104-2。例如,图4中,第二辐射臂1031通过第二巴伦1034耦合至第二馈电电路104-2。其中,辐射臂是用于辐射信号的元件,可认为是天线振子。巴伦的英文全称为(balanced to unbalanced,简称Balun;中文全称:平衡-不平衡转换器,简称换衡器),为一种常见的电路元件,换衡器的主要功用为将一单端讯号转为差动讯号,其具体实现为公知技术,本申请不再赘述。
在一个天线中,辐射臂与巴伦的数量并不限定,例如,图4-图6中,第二辐射臂组包括四个第二辐射臂(1031-1、1031-2、1031-3、1031-4),第二巴伦组包括两个第二巴伦(1034-1、1034-2),第二辐射臂1031-1、1031-3通过第二巴伦1034-1耦合至第二馈电电路104-2;第二辐射臂1031-2、1031-4通过第二巴伦1034-2耦合至第二馈电电路104-2。第一辐射臂组的结构可以参照现有技术,例如图4、图8,第一辐射臂组包括四个第一辐射臂(1021-1、1021-2、1021-3、1021-4),其中四个第一辐射臂构成图8中示出的“X”形结构),第一巴伦组包括两个第一巴伦(1022),第一辐射臂(1021-1、1021-3)通过一个第二巴伦1022耦合至第一馈电电路104-1;第一辐射臂(1021-2、1021-4)通过另一个第二巴伦1022耦合至第一馈电电路104-1。
其中,图4还示出了多频融合天线与图3中的AAU的连接方式,如图4所示,射频电路122-1耦合至第一馈电电路104-1,这样射频电路122-1输出的射频信号(第一频率范围的信号)可以通过第一馈电电路104-1提供的端口输出至第一巴伦,然后通过第一辐射臂组辐射出去。射频电路122-2耦合至第二馈电电路104-2,这样射频电路122-1输出的射频信号(第二频率范围的信号)可以通过第二馈电电路104-2提供的端口输出至第二巴伦,然后通过第二辐射臂组辐射出去。
其中,上述的两类辐射体中,参见图7和图8所示,所有的第一辐射体(102-1、……102-n,为简化示意,有些第一辐射体的标号在图8中省略)可以共用一个第一馈电电路104-1,即所有的第一辐射体对应耦合至一个第一馈电电路,或者每个第一辐射体(102-1、……102-n)可以分别使用一个第一馈电电路,例如每个第一辐射体(102-1、……102-n)分别耦合至一个第一馈电电路。所有的第二辐射体(103-1、103-2)可以共用一个第二馈电电路,即所有的第二辐射体(103-1、103-2)对应耦合至一个第一馈电电路,或者每个第二辐射体(103-1、103-2)可以分别耦合至一个第二馈电电路。此外,对于第一辐射体或第二辐射体,巴伦与馈电电路可以通过同轴线或者微带线耦合。
如图9所示,为巴伦与馈电电路采用同轴线进行耦合的示意图,在该方式中,巴伦a通过第一接口连接同轴线b的一端,馈电电路c通过第二接口连接同轴线b的另一端;巴伦与馈电电路采用微带线方式连接时。
如图10所示,为巴伦与馈电电路采用微带线进行耦合的示意图,在该方式中,微带线通常设置于印刷电路板(printed circuit board,PCB)中,巴伦a通常与PCB中的微带线d连接,PCB上设置第一连接器用于微带线d上信号的输入或输出;馈电电路c通过第二连接器与PCB上的第一连接器连接。其中上述的巴伦a可以为第一巴伦1022或第二巴伦1034,馈电电路c可以为第一馈电电路104-1或第二馈电电路104-2。
可以理解的是第一巴伦与第一馈电电路的连接方式以及第二巴伦与第二馈电电路的连接方式可以相同或不同。本申请的实施例提供的馈电电路可以采用PCB形式,其中PCB上设置有导电走线,为实现馈电电路的功能,馈电电路具体可以包括如功分器、移相器等器件。
本申请中,第二辐射臂组中的每个第二辐射臂(例如图4中的第二辐射臂1031)上设置有多个导电材料贴片1032,其中多个导电材料贴片1032与第二辐射臂1031之间设置有绝缘介质层1033。
导电材料贴片1032可以基于各种导电材料,通常使用导电率高的各种金属,例如,铜。在一种实现方式中,如图11所示,导电材料贴片1032大体上为片状结构,例如矩形的金属带线。导电材料贴片1032平行于第二辐射臂1031(包括1031-1,1031-2,1031-3,1031-4)并排成一列,每个导电材料贴片1032等效于一个电感。导电材料贴片1032与第二辐射体103的辐射臂1031可以分别印制在PCB板的上、下表面,即以PCB板作为绝缘介质层1033,导电材料贴片1032与第二辐射体103的第二辐射臂1031两者间形成耦合电容。第二辐射臂1031上设置的导电材料贴片1032的距离可以为周期性或非周期性的,相邻的导电材料贴片1031之间形成耦合电容。
在本申请的实施例中,如图5所示,多个导电材料贴片1032沿电流流经多个导电 材料贴片1032所在的第二辐射臂1031的方向分布,其中图5中示出了电流I的方向,由于通常射频信号为交流信号,因此在第二辐射臂1031-1上电流方向通常为相反的两个方向。其中,多个导电材料贴片1032设置于每个第二辐射臂1033垂直于接地板101方向的一侧。例如图4中,设置在第二辐射臂1033的上方(或正面),也可以设置在第二辐射臂1033的下方或背面(如图11所示)。在一些示例中,导电材料贴片1032也可以在垂直于第二辐射臂中电流方向延伸至第二辐射臂1031的两侧。如图11所示,在垂直于第二辐射臂1031中电流I方向,第二辐射臂1031的宽度W2可以大于导电材料贴片1032的宽度W1,或者,第二辐射臂1031的宽度W2也可以小于或等于导电材料贴片1032的宽度W1。结合图12、图13、图14所示,图12为对第二辐射体的局部结构的俯视结构示意图,图13为对图12示出的结构沿的A方向的结构视图,图14为对图12示出的结构沿B方向的结构视图。导电材料贴片1032设置于第二辐射臂1031上靠近接地板102(图4)的一侧。
结合图15、图16、图17所示,图15为对第二辐射体的局部结构的俯视结构示意图,图16为对图15示出的结构沿A方向的结构视图,图17为对图15示出的结构沿的B方向的结构视图。导电材料贴片1032设置于第二辐射臂1031上远离接地板102(图4)的一侧。
此外,如图11所示,相邻的两个导电材料贴片为片状结构,为了提高导电材料贴片1032之间的电容耦合量,如图18所示,相邻的两个导电材料贴片1032-1与1032-2在相邻的两个端部为交指结构1036(或者称作叉指结构)。这样,相当于增加了导电材料贴片1032-1与导电材料贴片1032-2之间的正对的面积,相当于增加了两个导电材料贴片1032-1与1032-2之间的电容值,确保了第一辐射体耦合至第二辐射体的信号能够在导电材料贴片1032-1与1032-2之间传递。
此外,为了提高导电材料贴片1032的电感量,以增加对第一辐射体耦合至第二辐射体的信号的阻抗,参照图19所示,多个导电贴片中的任一导电材料贴片1032为弯折的带状结构,这样可以增加导电材料贴片1032的展开长度,相当于增加了电流在导电材料贴片1032的传导长度,从而增加了对高频信号的阻抗。其中如图19所示,导电材料贴片1032的形状可以为蛇形。
这样,对于每个导电材料贴片1032,其与第二辐射臂1031之间形成第一电容C1,相邻的导电材料贴片1032之间形成第二电容C2,与每个导电材料贴片1032相对的第二辐射臂1031等效于第一电感L1,每个导电材料贴片1032自身等效于第二电感L2,这样形成如图20所示的等效电路,该等效电路中的电容C1和C2具有对第一频率范围的信号导通的特性,电感L1和L2具有对第一频率范围的信号高阻的作用,因此,C1、C2、L1和L2形成的等效电路,能够有效滤除第一辐射体工作时在第二辐射体上耦合的对第一频率范围的信号的感应电流,即对第一频率范围的信号的在第二辐射体上形成的感应电流具有去耦作用,从而能够降低第二辐射体对第一辐射体的辐射方向图的影响,降低天线振子的辐射方向图畸变,提高多频共口径天线阵列的辐射效率。此外,根据第一辐射体的工作频率,通过改变导电材料贴片1032的面积(例如:形状)和位置(例如导电材料贴片1032之间距离的周期)来调整L1、L2、C1和C2的值,也可以实现对第一辐射体工作时在第二辐射体上产生的耦合电流的控制。
本申请实施例中,第一频率范围的最大频率高于第二频率范围的最大频率,且第一频率范围的最小频率高于第二频率范围的最小频率。这样由于第一辐射体102用于辐射第一频率范围的信号,第二辐射体103用于辐射第二频率范围的信号,因此通常第一辐射体102的尺寸通常较小,第二辐射体103的尺寸较大,因此可以将第一辐射体102设置于第二辐射体103的下方。即,第一辐射臂1021连接的第一巴伦1022的长度小于的第二辐射臂1031连接的第二巴伦1034的长度。在一些实施例中,如图8所示,第一辐射体102和第二辐射体103中,第一辐射臂组和第二辐射臂组的中心水平距离L和\或中心垂直距离H小于等于λ,其中,λ为第一频率范围的中心频率波长。以图5、图6、图8为例,第一辐射臂组包括四个第一辐射臂(1021-1、1021-2、1021-3、1021-4),第二辐射臂组包括四个第二辐射臂(1031-1、1031-2、1031-3、1031-4),第一辐射臂组的中心为四个第一辐射臂(1021-1、1021-2、1021-3、1021-4)的几何中心,第二辐射臂组的中心为四个第二辐射臂(1031-1、1031-2、1031-3、1031-4)的几何中心。通常,第一辐射臂组和第二辐射臂组的中心水平距离和/中心垂直距离小于等于λ时,第二辐射体会对第一辐射体的辐射方向图产生影响。因此,现有技术中为避免第二辐射体会对第一辐射体的辐射方向图产生影响,通常第一辐射臂组和第二辐射臂组的中心水平距离和中心垂直距离设置为大于λ,这样不利于设备的小型化。而采用本申请的实施例提供的方案时,可以尽量减小第二辐射体对第一辐射体的辐射方向图产生的影响,因此,可以实现第一辐射臂组和第二辐射臂组更小的距离(例如第一辐射臂组和第二辐射臂组的中心水平距离和/中心垂直距离可以配置为小于等于λ),使得两者结构上更加紧凑,从而有利于设备小型化。
本申请的实施例中,每个导电材料贴片1032中电流流经的路径的最大尺寸为mλ,其中λ为第一频率范围的中心频率波长,m≤0.15。其中,导电材料贴片1032中电流流经的路径的最大尺寸主要与导电贴片的形状有关,通常在垂直于接地板的方向,导电材料贴片的厚度通常为其结构中尺寸最小的,本申请中不考虑其厚度对电流流经的路径的影响,电流流经的路径主要考虑在导电材料贴片垂直于其厚度方向的平面中电流的路径。如图11、图18所示,导电材料贴片1032为片状结构,电流流经的路径的最大尺寸为导电材料贴片1032中电流沿导电材料贴片1032的中线流经的长度;结合图20所示,导电材料贴片1032为弯折的带状结构,导电材料贴片1032中电流流经的最大尺寸为从导电材料贴片1032的一端到另一端电流沿导电材料贴片1032各部分的中线流经的长度。这样能够确保第二辐射臂耦合的第一辐射臂的信号有效耦合至导电材料贴片。此外,相邻的导电材料贴片1032之间的距离小于等于λ/100,以确保相邻的导电材料贴片1032之间的强耦合,确保第一辐射臂耦合至第二辐射臂的信号能够在导电材料贴片之间传递。
本申请的实施例中,为了提高第二辐射体103的第二辐射臂1031与导电材料贴片1032之间的电容耦合量(即图20中的C1的电容值),在绝缘介质层1033中设置有至少一个第一导电过孔1035(如图21所示),每个第一导电过孔1035与一个导电材料贴片1032连接。由于C1对第一频段范围的信号的导通特性,确保了第一辐射臂耦合至第二辐射臂的信号能够充分的耦合至导电材料贴片1032。此外,第一导电过孔1035可以增加导电材料贴片之间的感应面积,从而增加了导电材料贴片1032-1与导 电材料贴片1032-2之间的电容耦合量(即图20中的C2的电容值),由于C2的对第一频段范围的信号的导通特性,确保了第一辐射臂耦合至第二辐射臂的信号能够在导电材料贴片之间传递。
结合图22所示,至少一个第一导电过孔1035位于导电材料贴片所在的第二辐射臂1031的两侧,并沿电流I流经导电材料贴片1032所在的第二辐射臂1031的方向依次排列。并且导电材料贴片1032与第二辐射臂1031不连接,由于至少一个第一导电过孔1035主要沿电流流经第二辐射臂1031的方向依次排列于第二辐射臂1031的两侧,因此主要可以提高第二辐射臂1031与导电材料贴片1035之间的电容耦合量,即主要增加了第一电容C1的电容值,确保了第一辐射臂耦合至第二辐射臂的信号能够充分的耦合至导电材料贴片。
其中,为了提高导电材料贴片1032之间的电容耦合量,参照图23所示,至少一个第一导电过孔1035在流经导电材料贴片1032所在的第二辐射臂1031的方向位于导电材料贴片1032的两端,并沿垂直于电流I流经导电材料贴片1032所在的第二辐射臂1031的方向依次排列。这样,由于至少一个第一导电过孔1035主要沿垂直于电流流经第二辐射臂1031的方向依次排列于导电材料贴片1032的两端,因此主要可以提高导电材料贴片之间的电容耦合量。例如,图23中,导电材料贴片1032-1连接的第一导电过孔1035-1与导电材料贴片1032-2连接的第一导电过孔1035-2相对,增加的第一导电过孔相当于增加了导电材料贴片与导电材料贴片之间的正对的面积,相当于增加了第二电容的电容值,确保了第一辐射臂耦合至第二辐射臂的信号能够在导电材料贴片之间传递。
本申请的实施例中,为了提高图20示出的等效电路的滤波特性,可以在绝缘介质层1033中设置至少一个第二导电过孔1037(如图24所示),每个第二导电过孔1037的一端与一个导电材料贴片1032连接,第二导电过孔1037的另一端与第二辐射臂1031连接。这样相当于在导电材料贴片1032与第二辐射臂1031之间增加一个电感。参照图25所示,等效电路中增加了电感L3。
为了实现上述第一导电过孔以及第二导电过孔的导电特性,第一导电过孔以及第二导电过孔可以为金属化的过孔。此外,可以理解的是,第一导电过孔或第二导电过孔可以在多个导电材料贴片中的每个或部分中设置。此外,结合图11所示,需要说明的是,当一个导电材料贴片的宽度W1小于或等于所在第二辐射臂的宽度W2时,则对于该导电材料贴片仅可以设置上述第二导电过孔;而当一个导电材料贴片的宽度W1大于所在第二辐射臂的宽度W2时,则对于该导电材料贴片可以全部设置或选择性设置第一导电过孔以及第二导电过孔。
此外,为了增加对第一辐射体工作时在第二辐射体上产生的耦合电流的控制的灵活性,如图26所示,第二辐射臂组中的任一第二辐射臂上,电流流经任一第二辐射臂1031的方向分布有至少两列导电材料贴片1032。以两列导电材料贴片1032为例,其等效电路如图27所示,电容C1’为新增的一列导电材料贴片1032中任一导电材料贴片1032-2与第二辐射臂1031的电容,电容C2’为任一导电材料贴片1032-2与相邻的导电材料贴片1032-3之间的电容,L2’为任一导电材料贴片1032-2的电感。此外,在垂直于第二辐射臂1031中电流流经的方向上,两列相邻的导电材料贴片(1032-1、 1032-2)之间引入电容C3。
本申请的实施例中的天线可以是阵列天线,例如,如图8所示,本申请的实施例中的天线包含两个天线阵列,其中第一天线阵列包含4列天线振子(每列8个,共32个天线振子,每个天线振子在图8中显示为X形状),其中第一天线阵列中的天线振子由上述的第一辐射体102的第一辐射臂组实现,用于发射第一频率范围的信号。第二天线阵列包含一列天线振子(每列2个,共2个天线振子,每个天线振子在图8中显示为4个排列在一起的正方形),其中第二天线阵列中的天线振子由上述的第二辐射体103的第二辐射臂组实现,用于发射第二频率范围的信号。在一些实施例中,第二辐射臂1031可以为线形,多边形或者圆环形。在一些实施例中第二辐射体103为单极化辐射体(可认为用于实现单极化天线)或双极化辐射体(可认为用于实现双极化天线),其中单极化可以为任一方向的极化,例如垂直于地面方向或与地面水平方向的极化;双极化可以一个垂直于地面方向的极化或与一个与地面水平方向的极化,或者一对相交的±45°的极化,其中该方案中提供了第二辐射体不同的极化方式,丰富了第二辐射体的极化方式,另外采用双极化形式可以更有利于在复杂环境中减小极化损失。例如,第二辐射体的第二辐射臂组中包含一个或多个第二辐射臂,单个或两个第二辐射臂可以形成单极化,两个或者四个第二辐射臂也可以组成双极化,例如参照图5所示,第二辐射臂1031-1和1031-3组成一个极化,第二辐射臂1031-2和1031-4组成另一个极化;在一些实施例中第二辐射体103的极化方式可以为以下任一极化方式:线极化、圆极化、椭圆极化。示例性的,线极化包括水平极化和垂直极化,椭圆极化包括左旋椭圆极化和右旋椭圆极化,圆极化包括左旋圆极化与右旋圆极化。在该方案中提供了第二辐射体不同的极化方式,丰富了第二辐射体的极化方式,从而可以适应于不同环境下辐射信号的强度要求。
以双极化方式为例,如图5、图6、图8所示,第二辐射体103形成田字形的天线振子。第一辐射体102、第二辐射体103均为±45°极化。其中,如图5所示,多个导电材料贴片1032沿电流流经多个导电材料贴片1032所在的第二辐射臂1031的方向分布,其中图5中示出了电流I的方向,由于通常射频信号为交流信号,因此在第二辐射臂1031-1上电流方向通常为相反的两个方向。如图6所示,实施例中提供一种第二辐射臂组的结构设计图。第二辐射臂组为“田”字形,相对的两个“口”分别代表+45°和-45°极化,并分别由一对正交的第二巴伦(1304-1和1304-2)馈电,例如:第二辐射臂1031-1由第二巴伦1304-1馈电;第二辐射臂1031-2由第二巴伦1304-2馈电。“田”字型的外框(即辐射臂)上设置有导电材料贴片1032。
参见图28,为本申请基于上述图8提供的天线中的一半(例如,包括上半部分一个第二辐射体以及16个第一辐射体)进行仿真的示意图。具体的,图28为对第二辐射体103的雷达散射截面(radar cross-section,RCS)的归一化(normalized)的增益(dB)仿真结果。如图所示,在频率3.98GHz附近,使用本申请的实施例提供的方案(第二辐射体的辐射臂上设置导电材料贴片)相对于现有技术的方案(第二辐射体的辐射臂上未设置导电材料贴片)能够取得6dB的RCS优化。
此外,参照图29所示,提供了三种情况下的天线方向图的仿真图例。其中,图29中的(a)为第一辐射体(即高频天线振子)工作时的理想状态的天线方向图;图 29中的(b)为现有技术中多频共口径天线阵列(第一辐射体(即高频天线振子)与第二辐射体(即低频天线振子,未设置导电材料贴片)共存)的第一辐射体工作时的天线方向图;图29中的(c)为本申请的实施例提供的多频共口径天线阵列(第一辐射体(即高频天线振子)与第二辐射体(即低频天线振子,设置有导电材料贴片)共存)的第一辐射体工作时的天线方向图;其中,对比三种情况下的天线方向图,可以看出图29中的(b)第二辐射体的存在对第一辐射体的天线方向图的影响较大(与图29中的(a)相比,(b)中第一辐射体的天线方向图存在较大畸变),(c)中由于第二辐射体的辐射臂上设置了导电材料贴片,对第一辐射体的天线方向图影响较低,基本将(b)的电场分布和方向图畸变得到恢复。
图30提供了天线仅包含第一辐射体时,第一辐射体(即高频天线振子)工作时各个天线方向(θ/°)下的实际增益(realized gain)曲线;以及基于上述图8提供的天线中示出的天线振子的结构配置,现有技术中多频共口径天线阵列(第一辐射体(即高频天线振子)与第二辐射体(即低频天线振子,未设置导电材料贴片)共存)的第一辐射体工作时各个天线方向(θ/°)下的实际增益(realized gain)曲线;以及基于上述图8提供的天线中示出的天线振子的结构配置,本申请的实施例提供的多频共口径天线阵列(第一辐射体(即高频天线振子)与第二辐射体(即低频天线振子,设置有导电材料贴片)共存)的第一辐射体各个天线方向(θ/°)下的实际增益(realized gain)曲线;其中,本申请的实施例提供方案与仅存在第一辐射体单独工作时的实际增益曲线基本一致,尤其在30°附近,本申请的实施例提供方案相对于现有技术对天线的实际增益具有2.5dB的改善。
基于上述图8提供的天线中示出的天线振子的结构配置,图31提供了现有技术中多频共口径天线阵列(第一辐射体(即高频天线振子)与第二辐射体(即低频天线振子,未设置导电材料贴片)共存)的第一辐射体工作时各个工作频率下的峰值增益(peak gain)曲线;以及本申请的实施例提供的多频共口径天线阵列(第一辐射体(即高频天线振子)与第二辐射体(即低频天线振子,设置有导电材料贴片)共存)的第一辐射体工作时各个工作频率下的峰值增益(peak gain)曲线;其中在0.90GHz附近,本申请的实施例提供方案相对于现有技术对天线的峰值增益具有0.06dB的改善。
尽管结合具体特征及其实施例对本申请进行了描述,显而易见的,在不脱离本申请的精神和范围的情况下,可对其进行各种修改和组合。相应地,本说明书和附图仅仅是所附权利要求所界定的本申请的示例性说明,且视为已覆盖本申请范围内的任意和所有修改、变化、组合或等同物。显然,本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样,倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。

Claims (26)

  1. 一种多频段融合天线组件,其特征在于,包括接地板、第一辐射体以及第二辐射体;
    所述第一辐射体用于辐射第一频率范围的信号,所述第二辐射体用于辐射第二频率范围的信号;
    所述接地板用于反射所述第一辐射体辐射的部分信号以及所述第二辐射体辐射的部分信号;
    所述第一辐射体的第一高度小于所述第二辐射体的第二高度,所述第一高度与所述第二高度为垂直于所述接地板方向上的高度;
    所述第一辐射体包括第一辐射臂组以及第一巴伦组,所述第一辐射臂组通过所述第一巴伦组耦合至与所述第一辐射体对应的第一馈电电路;
    所述第二辐射体包括第二辐射臂组以及第二巴伦组,所述第二辐射臂组通过所述第二巴伦组耦合至与所述第二辐射体对应的第二馈电电路;所述第二辐射臂组包括至少一个第二辐射臂;
    所述第二辐射臂组中的每个所述第二辐射臂上设置有多个导电材料贴片,其中所述多个导电材料贴片与每个所述第二辐射臂之间设置有绝缘介质层。
  2. 根据权利要求1所述的多频段融合天线组件,其特征在于,所述多个导电材料贴片沿电流流经所述多个导电材料贴片所在的所述第二辐射臂的方向分布。
  3. 根据权利要求1或2所述的多频段融合天线组件,其特征在于,在所述绝缘介质层中设置有至少一个第一导电过孔,每个所述第一导电过孔与一个所述导电材料贴片连接。
  4. 根据权利要求3所述的多频段融合天线组件,其特征在于,
    至少一个所述第一导电过孔位于所述导电材料贴片所在的所述第二辐射臂的两侧,并沿电流流经所述导电材料贴片所在的所述第二辐射臂的方向依次排列。
  5. 根据权利要求3所述的多频段融合天线组件,其特征在于,至少一个所述第一导电过孔在电流流经所述导电材料贴片所在的所述第二辐射臂的方向位于所述导电材料贴片的两端,并沿垂直于所述电流流经所述导电材料贴片所在的所述第二辐射臂的方向依次排列。
  6. 根据权利要求1-5任一项所述的多频段融合天线组件,其特征在于,在所述绝缘介质层中设置有至少一个第二导电过孔,每个所述第二导电过孔的一端与一个所述导电材料贴片连接,每个所述第二导电过孔的另一端与所述第二辐射臂连接。
  7. 根据权利要求1-6任一项所述的多频段融合天线组件,其特征在于,所述多个导电贴片中的任一所述导电材料贴片为片状结构或者弯折的带状结构。
  8. 根据权利要求7所述的多频段融合天线组件,其特征在于,相邻的两个所述导电材料贴片为片状结构,相邻的两个所述导电材料贴片在相邻的两个端部为交指结构。
  9. 根据权利要求1-8任一项所述的多频段融合天线组件,其特征在于,所述第二辐射臂组中的任一所述第二辐射臂上,电流流经任一所述第二辐射臂的方向分布有至少两列所述导电材料贴片。
  10. 根据权利要求1-9任一项所述的多频段融合天线组件,其特征在于,所述第 一辐射臂组和所述第二辐射臂组的中心水平距离和/或中心垂直距离小于等于λ,其中,λ为所述第一频率范围的中心频率波长。
  11. 根据权利要求1-10任一项所述的多频段融合天线组件,其特征在于,每个所述导电材料贴片中电流流经的路径的最大尺寸为mλ,其中λ为所述第一频率范围的中心频率波长,m≤0.15。
  12. 根据权利要求1-11任一项所述的多频段融合天线组件,其特征在于,所述多个导电材料贴片设置于每个所述第二辐射臂上靠近所述接地板的一侧,或者,所述多个导电材料贴片设置于每个所述第二辐射臂上远离所述接地板的一侧。
  13. 根据权利要求1-12任一项所述的多频段融合天线组件,其特征在于,所述多个导电材料贴片设置于每个所述第二辐射臂垂直于所述接地板方向的一侧。
  14. 根据权利要求1-13任一项所述的多频段融合天线组件,其特征在于,所述第一频率范围的最大频率高于所述第二频率范围的最大频率,且所述第一频率范围的最小频率高于所述第二频率范围的最小频率。
  15. 一种用于多频段融合天线的辐射体,其特征在于,所述辐射体设置于所述多频段融合天线的接地板上,所述辐射体包括辐射臂组以及巴伦组,所述辐射臂组通过所述巴伦组耦合至与所述辐射体对应的馈电电路;所述辐射臂组包括至少一个辐射臂;
    所述辐射臂组中的每个所述辐射臂上设置有多个导电材料贴片,其中所述多个导电材料贴片与每个所述辐射臂之间设置有绝缘介质层。
  16. 根据权利要求15所述的辐射体,其特征在于,所述多个导电材料贴片沿电流流经所述多个导电材料贴片所在的所述辐射臂的方向分布。
  17. 根据权利要求15或16所述的辐射体,其特征在于,在所述绝缘介质层中设置有至少一个第一导电过孔,每个所述第一导电过孔与一个所述导电材料贴片连接。
  18. 根据权利要求17所述的辐射体,其特征在于,
    至少一个所述第一导电过孔位于所述导电材料贴片所在的所述辐射臂的两侧,并沿电流流经所述导电材料贴片所在的所述辐射臂的方向依次排列。
  19. 根据权利要求17所述的辐射体,其特征在于,至少一个所述第一导电过孔在电流流经所述导电材料贴片所在的所述辐射臂的方向位于所述导电材料贴片的两端,并沿垂直于所述电流流经所述导电材料贴片所在的所述辐射臂的方向依次排列。
  20. 根据权利要求15-19任一项所述的辐射体,其特征在于,在所述绝缘介质层中设置有至少一个第二导电过孔,每个所述第二导电过孔的一端与一个所述导电材料贴片连接,每个所述第二导电过孔的另一端所述辐射臂连接。
  21. 根据权利要求15-20任一项所述的辐射体,其特征在于,所述多个导电贴片中的任一所述导电材料贴片为片状结构或者弯折的带状结构。
  22. 根据权利要求21所述的辐射体,其特征在于,相邻的两个所述导电材料贴片为片状结构时,相邻的两个所述导电材料贴片在相邻的两个端部为交指结构。
  23. 根据权利要求15-22任一项所述的辐射体,其特征在于,所述辐射臂组中的任一所述辐射臂上,电流流经任一所述辐射臂的方向分布有至少两列所述导电材料贴片。
  24. 根据权利要求15-23任一项所述的辐射体,其特征在于,所述多个导电材料 贴片设置于每个所述辐射臂垂直于所述接地板方向的一侧。
  25. 一种天线,包括:如权利要求1-14任一项所述的多频段融合天线组件以及至少两组馈电电路,其中所述多频段融合天线组件的第一辐射体耦合至与所述第一辐射体对应的第一馈电电路;所述多频段融合天线组件的第二辐射体耦合至与所述第二辐射体对应的第二馈电电路。
  26. 一种电子设备,其特征在于,包括射频电路以及与所述射频电路连接的如权利要求25所述的天线,所述射频电路用于通过所述天线发送所述射频电路处理后的信号。
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