WO2022085647A1 - Cermet insert and cutting tool equipped therewith - Google Patents

Cermet insert and cutting tool equipped therewith Download PDF

Info

Publication number
WO2022085647A1
WO2022085647A1 PCT/JP2021/038495 JP2021038495W WO2022085647A1 WO 2022085647 A1 WO2022085647 A1 WO 2022085647A1 JP 2021038495 W JP2021038495 W JP 2021038495W WO 2022085647 A1 WO2022085647 A1 WO 2022085647A1
Authority
WO
WIPO (PCT)
Prior art keywords
insert
enriched layer
bonded phase
phase enriched
cermet
Prior art date
Application number
PCT/JP2021/038495
Other languages
French (fr)
Japanese (ja)
Inventor
涼馬 野見山
綾乃 根岸
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2022557538A priority Critical patent/JP7483917B2/en
Priority to CN202180071021.0A priority patent/CN116348227A/en
Publication of WO2022085647A1 publication Critical patent/WO2022085647A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/22—Cutting tools with chip-breaking equipment

Definitions

  • This disclosure relates to a cermet insert used in cutting and a cutting tool equipped with the cermet insert.
  • cermets containing titanium (Ti) as the main component are widely used as a substrate for members that require wear resistance, sliding property, and chipping resistance, such as cutting tools, wear-resistant members, and sliding members. There is.
  • Patent Document 1 describes a surface-coated titanium nitride-based cermet cutting insert having a through hole for attachment to a tool body.
  • Patent Document 1 describes that a metal stain layer is provided on the inner surface of the mounting through hole in order to provide an insert with less abnormal damage even in high-load cutting.
  • the insert of the present disclosure is a cermet insert comprising a substrate which is a cermet containing hard particles and a bonded phase.
  • the cermet inserts of the present disclosure include a first surface, a second surface, a cutting edge located at least part of the ridges of the first and second surfaces, and a third surface opposite the first surface. , A through hole extending from the first surface to the third surface.
  • the inner wall constituting the through hole has a bound phase enriched layer having a higher content of the bound phase than the inside of the substrate, at least in the central portion.
  • the thickness T1 of the bonded phase enriched layer in the central portion is thicker than the thickness T2 of the bonded phase enriched layer at the end portion of the inner wall.
  • the thickness T1 is 1 ⁇ m or more and 20 ⁇ m or less, and the thickness T2 is 0.2 ⁇ m or more and 6 ⁇ m or less. Further, the first surface is provided with a chip breaker.
  • the arithmetic mean roughness Ra of the chip breaker is 0.1 ⁇ m or more and 0.27 ⁇ m or less when the cutoff value is 0.08 mm.
  • FIG. 1 is a perspective view showing an example of the insert of the present disclosure.
  • FIG. 2 is a schematic cross-sectional view showing an example of the inserts of the present disclosure.
  • FIG. 3 is an enlarged schematic view of a cross section of the insert of the present disclosure.
  • FIG. 4 is an enlarged schematic view of a cross section of another form of the insert of the present disclosure.
  • FIG. 5 is an enlarged schematic view of a cross section of another form of the insert of the present disclosure.
  • FIG. 6 is a schematic enlarged view of the VI portion shown in FIG.
  • FIG. 7 is a plan view showing an example of the cutting tool of the present disclosure.
  • FIG. 8 is an enlarged schematic view of a cross section of the insert in the cutting tool of the present disclosure.
  • the cermet insert (hereinafter, simply referred to as “insert”) and the cutting tool provided with the cermet insert of the present disclosure will be described in detail with reference to the drawings.
  • the inserts of the present disclosure may comprise any component not shown in each referenced figure.
  • the dimensions of the members in each drawing do not faithfully represent the dimensions of the actual constituent members and the dimensional ratio of each member. These points are the same for the cutting tool described later.
  • the present disclosure provides a cermet insert with less abnormal damage and a cutting tool equipped with the cermet insert.
  • the insert of the present disclosure has a cermet substrate containing hard particles and a bound phase.
  • the hard particles are, for example, TiCN, TiC, TiN, (TiM) CN (M is one or more selected from W, Nb, Ta, Mo, and V).
  • the bonded phase is mainly composed of an iron group metal such as Ni or Co.
  • the main component occupies 50% by mass or more of the constituent components.
  • the shape of the insert 1 of the present disclosure may be, for example, a square plate shape.
  • the first surface 5 which is the upper surface in FIG. 1 is a so-called rake surface.
  • the insert 1 has a second surface 7 which is a side surface connected to the first surface 5.
  • the insert 1 has a third surface 9 which is a lower surface located opposite to the first surface 5.
  • the second surface 7 is connected to each of the first surface 5 and the third surface 9.
  • the insert 1 of the present disclosure has a cutting edge 11 located at least a part of the ridgeline where the first surface 5 and the second surface 7 intersect.
  • the insert 1 of the present disclosure has a cutting edge 11 located at least a part of the ridgeline where the rake face and the flank face intersect.
  • the cutting edge 11 may have a fourth surface continuous with the first surface 5 and the second surface 7.
  • the fourth surface may be a C surface (Chamfer surface) in which the corner portions of the first surface 5 and the second surface 7 are cut diagonally and linearly.
  • the fourth surface may be an R surface (round surface) in which the corners of the first surface 5 and the second surface 7 are rounded.
  • the entire outer circumference of the first surface 5 may be the cutting edge 11, but the insert 1 is not limited to such a configuration, and for example, only one side on the quadrangular rake surface. In other words, the cutting edge 11 may be provided on one of the four fourth surfaces.
  • the insert 1 of the present disclosure has a through hole 15 penetrating the substrate 3 from the first surface 5 to the third surface 9.
  • the inner wall 17 constituting the through hole 15 has a bonded phase enriched layer 19 at least in the central portion 17a.
  • the bonded phase enriched layer 19 is a region containing hard particles and a bonded phase and having a higher content of the bonded phase than the inside of the substrate 3.
  • the inside of the substrate 3 means a portion separated from the surface of the substrate 3 by 500 ⁇ m or more.
  • the bonded phase enriched layer 19 does not have to be present in all of the inner walls 17 of the through hole 15, and may be located at least in the central portion 17a.
  • the central portion 17a is in the middle when the through hole 15 is divided into nine equal parts in the depth direction. Further, the end portion 17b is an end when the through hole 15 is divided into nine equal parts in the depth direction.
  • the thickness T1 of the bonded phase enriched layer 19 in the central portion 17a of the inner wall 17 constituting the through hole 15 is the end portion 17b of the inner wall 17 constituting the through hole 15.
  • the thickness of the bonded phase enriched layer 19 in T2 is larger than that of T2.
  • the thickness T1 of the bound phase enriched layer 19 in the central portion 17a and the thickness T2 of the coupled phase enriched layer 19 in the end portion 17b are average values, respectively.
  • the thickness T1 and the thickness T2 may be measured by observing the cross section of the insert 1 with a metallurgical microscope or an electron microscope. It is not necessary that the bonded phase enriched layer 19 is present at the end portion 17b.
  • the insert 1 of the present disclosure has such a configuration, it is possible to prevent the insert 1 from being abnormally damaged starting from the inner wall 17 to which a large force is applied when the insert 1 is fixed to a holder (not shown).
  • the bonded phase enriched layer 19 has a lower hardness than the substrate 3, and has a higher hardness than the metal shimidashi layer as described in Cited Document 1. Therefore, the bond phase enriched layer 19 is less deformed than the metal shimidashi layer.
  • the insert 1 when the insert 1 is clamped to the holder, the substrate due to the suppressed deformation of the coupled phase enriched layer 19 at the central portion 17a at the contact between the central portion 17a on the inner wall 17 and the clamp. Since the local force applied to 3 is small, the insert 1 is less likely to crack and is less likely to be abnormally damaged.
  • the size of the insert 1 is not particularly limited, but for example, the length of one side of the rake face is set to about 3 to 20 mm.
  • the thickness of the insert 1 is set to, for example, about 1 to 20 mm.
  • the rectangular insert 1 is illustrated, but it may be triangular or disk-shaped, for example.
  • the insert 1 of the present disclosure may have a diameter-expanded portion 21 connected to the inner wall 17. There is a step at the boundary between the through hole 15 and the enlarged diameter portion 21.
  • the bonded phase enriched layer 19 does not exist on the inner wall of the enlarged diameter portion 21, but the coupled phase enriched layer 19 may also be present on the enlarged diameter portion 21.
  • the enlarged diameter portion 21 is not included in the through hole 15.
  • the enlarged diameter portion 21 is a so-called counterbore surface.
  • the diameter of the enlarged diameter portion 21 is 300 ⁇ m or more larger than the diameter of the through hole 15.
  • the thickness T1 of the bonded phase enriched layer 19 in the central portion 17a may be 1 ⁇ m or more. Further, the thickness T1 may be 20 ⁇ m or less. According to such a configuration, abnormal damage of the insert 1 is suppressed.
  • the thickness T1 may be 3 ⁇ m or more. Further, the thickness T1 may be 10 ⁇ m or less.
  • the thickness T2 of the bonded phase enriched layer 19 at the end portion 17b may be 0.2 ⁇ m or more. Further, the thickness T2 may be 6 ⁇ m or less. According to such a configuration, abnormal damage of the insert 1 is suppressed.
  • the thickness T2 may be 0.6 ⁇ m or more.
  • the thickness T2 may be 4 ⁇ m or less. According to such a configuration, the local force applied to the substrate 3 is further reduced, so that the insert 1 is less likely to crack and abnormal damage is further suppressed.
  • the diameter R1 at the central portion 17a may be larger than the diameter R2 at the end portion 17b. With such a configuration, the contact area between the clamp and the inner wall 17 becomes large, and the clamping force increases.
  • the diameter R1 at the central portion 17a may be 5 ⁇ m or more and 30 ⁇ m or less larger than the diameter R2 at the end portion 17b. With such a configuration, abnormal damage of the insert 1 is suppressed.
  • the hardness of the bonded phase enriched layer 19 in the central portion 17a may be 10 GPa or more and 20 GPa or less. According to such a configuration, when the clamp pins come into contact with each other, the coupled phase enriched layer 19 is appropriately deformed and the clamping force is increased.
  • the hardness of the bonded phase enriched layer 19 in the central portion 17a may be measured by measuring the exposed bonded phase enriched layer 19 in the cross section of the insert 1 by using a nanoindentation method.
  • the bonded phase enriched layer 19 in the central portion 17a may have a metal layer (not shown) having a higher content of the bonded phase than the bonded phase enriched layer 19 on the through shaft side of the through hole 15.
  • This metal layer does not include a hard layer and is composed only of metal. With such a configuration, the metal layer functions as a cushioning material between the clamp described later and the bonded phase enriched layer 19, so that abnormal damage to the insert 1 is suppressed.
  • the thickness of the metal layer may be 0.3 ⁇ m or more and 2 ⁇ m or less.
  • the insert 1 may have a coating layer (not shown) on the bound phase enriched layer 19 at the central portion 17a.
  • the coating layer is a hard layer containing, for example, TiCN, TiN, TiCNO, Al 2 O 3 and the like.
  • the coating layer has a portion having a higher hardness than the bonded phase enriched layer 19. Having such a configuration increases the wear resistance of the clamp portion.
  • the coating layer may be a single layer or a laminated layer.
  • the coating layer may be formed by a CVD method or a PVD method.
  • FIG. 6 is a schematic enlarged view of the VI portion shown in FIG.
  • the insert 1 has a chip breaker 50 on a first surface 5, which is a rake surface.
  • the chip breaker 50 is a recess in which the first surface 5 is recessed.
  • the tip breaker 50 has an inclined surface (barrier 51) that inclines downward from the first surface 5 toward the cutting edge 11.
  • the chip breaker 50 can appropriately break the chips and discharge the chips in a desired direction by curling the chips of the work material at the barrier 51.
  • the insert 1 having such a chip breaker 50 can suppress chip biting and wrapping. This reduces, for example, abnormal damage to the insert 1 due to the wound chips hitting the substrate 3.
  • the chip breaker 50 may have at least a barrier 51, and is not limited to the shape shown in the figure.
  • the chip breaker 50 does not necessarily have to be a concave portion, and may have a stepped shape.
  • the surface roughness of the chip breaker 50 is an arithmetic mean roughness Ra, and when the cutoff value is 0.08 mm, it may be 0.1 ⁇ m or more. If the surface roughness of the chip breaker 50 is small (in other words, the coefficient of friction is small), the chips may not come into contact with the barrier 51 and may not be properly curled. On the other hand, by setting the surface roughness of the chip breaker 50 within the above range, chips are likely to come into contact with the barrier 51. Therefore, if the chip breaker 50 has a surface roughness in the above range, chips can be suitably curled. As a result, the chips are appropriately broken, and the abnormal damage of the insert 1 is further suppressed.
  • the surface roughness of the chip breaker 50 may be 0.27 ⁇ m or less when the arithmetic average roughness Ra is 0.08 mm and the cutoff value is 0.08 mm. If the arithmetic mean roughness Ra of the chip breaker 50 exceeds 0.3 ⁇ m, the stress due to the collision of chips is concentrated on the barrier 51, chipping occurs in the barrier 51, and the damage may be large. On the other hand, when the arithmetic mean roughness Ra of the chip breaker 50 is 0.27 ⁇ m or less, damage to the barrier 51 can be less likely to occur.
  • the surface roughness of the cutting edge 11, in other words, the surface roughness of the fourth surface on which the cutting edge 11 is located is the arithmetic mean roughness Ra, even if the cutoff value is 0.08 mm, even if it is 0.2 ⁇ m or less. good.
  • the insert 1 receives a large resistance when it comes into contact with the work material (when it bites). This biting resistance can cause the insert 1 to be chipped.
  • the surface roughness of the cutting edge 11 which is the portion that first contacts the work material within the above range, the resistance at the time of biting can be reduced. As a result, it is possible to further suppress the defect of the insert 1, specifically, the sudden defect that occurs when the insert 1 is bitten into the work material. In addition, the cutting time until chipping occurs in the insert 1 is extended, and the chipping resistance is improved. Further, as the cutting edge 11 (fourth surface), a glossy and good finished surface can be obtained.
  • the chip in order to measure the arithmetic mean roughness Ra of the chip breaker 50 and the arithmetic average roughness Ra of the cutting edge 11, the chip conforms to the JISB0601-2013 standard except that the cutoff value is fixed at 0.08 mm.
  • the surface shapes of the breaker 50 and the cutting edge 11 may be measured.
  • a contact type surface roughness measuring machine using a stylus or a non-contact type surface roughness measuring machine using a laser may be used.
  • the surface shape in the direction along the cutting edge 11 may be measured.
  • the first surface 5 is circular and the cutting edge 11 has an arc shape, the surface shape may be measured on a curve along the cutting edge 11.
  • the raw material powder used in the production of the inserts of the present disclosure is generally used in the production of cermets.
  • the insert of the present disclosure can be obtained by devising the composition and firing conditions of the substrate and the processing method of the substrate.
  • the substrate may contain, for example, 40% by mass or more and 80% by mass or less of TiCN which is a hard particle, and 6% by mass or more and 30% by mass or less of Co which is a bonding phase. Further, in order to further improve the characteristics, the substrate may contain WC, TaC, NbC, Mo 2C , VC, ZrC and the like.
  • the raw material having the above composition is molded into a shape having a space to be a through hole after firing. Then, for example, firing is performed at a temperature of 1400 ° C. or higher and 1600 ° C. or lower. This firing atmosphere may be set to an N2 partial pressure atmosphere.
  • the N2 partial pressure is 1 kPa or more
  • the thickness of the bonded phase enriched layer after firing becomes thick.
  • the average particle diameter d50 of the hard particles used as a raw material is 0.7 ⁇ m or less
  • the bonded phase has a metal layer having a higher content of the bonded phase than the bonded phase enriched layer on the through axis (not shown) side of the through hole. An enriched layer is obtained.
  • the molding pressure is high during the above molding, deformation during firing can be suppressed.
  • the molding pressure is reduced during molding, the diameter R1 at the central portion of the inner wall tends to be larger than the diameter R2 at the end portion. Since the relationship between the forming pressure and the deformation changes depending on the composition and the firing temperature, various combinations may be adjusted.
  • a brush that rotates after firing is inserted into the through hole from both ends of the through hole to polish the inner wall of the through hole, and the thickness T1 of the bonded phase enriched layer at the central portion is the thickness of the bonded phase enriched layer at the end.
  • the insert of the present disclosure can be obtained by processing the insert so as to be thicker than T2.
  • the brush may be inserted from both sides of the through hole, or may be inserted from one side in two steps.
  • the coating layer may be a so-called hard film, and may be formed by, for example, a PVD method or a CVD method.
  • the coating film may be a single layer or a laminated film.
  • coating film for example, known materials such as TiN, TiCN, TiCNO, Al2O3 , and TiAlN can be used.
  • a coating film made of a material other than the above-mentioned example may be used.
  • the bonded phase enriched layer may be present in a region other than the through hole, for example, the first surface, the second surface, or the third surface, but if necessary, the bonded phase enriched layer may be present. May be removed.
  • the surface roughness of the chip breaker can be adjusted, for example, by blasting the surface of the substrate.
  • the blasting process is a processing method in which a mixture (slurry) of a solution mixed with ceramic abrasive grains and compressed air is made to collide with the surface of a substrate.
  • the ceramic abrasive grains include alumina and the like.
  • the average particle size of the ceramic abrasive grains may be 1 ⁇ m or more and 100 ⁇ m or less. If the average particle size of the ceramic abrasive grains is less than 1 ⁇ m, it is difficult to adjust the roughness of the surface of the substrate. Further, if the average particle size of the ceramic abrasive grains exceeds 100 ⁇ m, the surface roughness of the substrate may be roughened, and the surface roughness may be outside the above range.
  • the surface roughness of the cutting edge can be adjusted by polishing only the cutting edge with a polishing method such as a brush, an elastic grindstone, or a blast.
  • a polishing method brush polishing may be performed.
  • the amount of protrusion of the brush bristles by brush polishing is 0.5 cm or more and 5 cm or less, preferably 2.5 cm or more and 3.5 cm or less, and the average particle size is 4 ⁇ m or less, preferably 0.5 ⁇ m or more and 2.5 ⁇ m.
  • a polishing liquid in which the following fine diamond powder and lubricating oil are mixed may be used.
  • the surface roughness of the cutting edge can be adjusted to a desired range while keeping the surface roughness of the tip breaker in a desired range.
  • the surface roughness of the cutting edge may be adjusted by masking the chip breaker and using a polishing method such as a brush, an elastic grindstone, or a blast on the portion forming the cutting edge.
  • the cutting tool 101 of the present disclosure is, for example, a rod-shaped body extending from the first end (upper end in FIG. 7) to the second end (lower end in FIG. 7).
  • the cutting tool 101 includes a holder 105 having a pocket 103 on the first end side (tip side) and the above-mentioned insert 1 located in the pocket 103.
  • the clamp 107 is inserted into the through hole 15 (see FIG. 1) of the insert 1.
  • the clamp 107 is in direct or indirect contact with the coupled phase enrichment layer 19 (see FIG. 2) located at the central portion 17a.
  • the indirect contact between the clamp 107 and the bonded phase enriched layer 19 means a state in which a metal layer or a coating layer exists between the coupled phase enriched layer 19 and the clamp 107. Since the bonded phase enriched layer 19 with which the clamp 107 comes into contact is more easily deformed than the substrate 3, it is difficult to apply a strong force locally to the insert 1.
  • the contact area between the clamp 107 and the coupled phase enriched layer 19 is large, so that the insert 1 is difficult to move in the pocket during cutting. Combined with these effects, the insert 1 of the present disclosure is less likely to be abnormally damaged. Since the cutting tool 101 includes the insert 1, stable cutting can be performed for a long period of time.
  • the pocket 103 is a portion to which the insert 1 is mounted, and has a seating surface parallel to the lower surface of the holder 105 and a restraining side surface inclined with respect to the seating surface. Further, the pocket 103 is open on the first end side of the holder 105.
  • Insert 1 is located in pocket 103. At this time, the lower surface of the insert 1 may be in direct contact with the pocket 103, or a sheet (not shown) may be sandwiched between the insert 1 and the pocket 103.
  • the insert 1 is attached to the holder 105 so that at least a part of the portion used as the cutting edge 11 at the ridge line where the rake surface and the flank surface intersect protrudes outward from the holder 105.
  • the insert 1 is attached to the holder 105 by a clamp 107. That is, the insert 1 is inserted by inserting the clamp 107 into the through hole 15 of the insert 1, inserting the tip of the clamp 107 into the screw hole (not shown) formed in the pocket 103, and screwing the screw portions together. It is attached to the holder 105.
  • Steel, cast iron, etc. can be used as the material of the holder 105.
  • steel having high toughness may be used.
  • the cutting tool 101 used for so-called turning is exemplified.
  • the turning process include inner diameter processing, outer diameter processing, grooving processing, end face processing and the like.
  • the cutting tool 101 is not limited to the one used for turning.
  • the insert 1 of the above embodiment may be used for the cutting tool 101 used for milling.
  • the substrate was prepared as follows. TiCN is 40% by mass, TiN is 12% by mass, WC is 20% by mass, NbC is 8% by mass, Co is 20% by mass, and other raw material powders containing unavoidable carbides.
  • a tool-shaped molded body having a through hole was produced by adjusting the shape to a desired shape. These raw material powders are generally used in the production of cermets.
  • the composition of the substrate of the present disclosure is also not special. Then, after removing the binder component, it was fired in a nitrogen atmosphere of 3 kPa at a temperature of 1530 ° C. for 1 hour to obtain an insert having a bonded phase enriched layer having a metal layer on the inner wall of the through hole. ..
  • the inner wall of the through hole was polished with a brush to prepare an insert having the configuration shown in Table 1.
  • the polishing time by the brush is lengthened.
  • Sample No. shown in Table 1 Of the samples 1 to 23, sample No. 1, 2, 3, 4, 11, 12, 13, 14, 15, 19, 20, 22, 23 are comparative examples, and Sample No. 1 and No. 5 to 10, 16 to 18, 21 are examples.
  • the first surface, the second surface, and the third surface were blasted to remove the bonded phase enriched layer.
  • Polishing with a brush was performed by applying a polishing liquid containing diamond powder of 0.1 ⁇ m or more and 3 ⁇ m or less and lubricating oil to a pig bristle brush, and rotating the pig bristle brush for through holes and cutting edges.
  • the thickness at the center and the end of the bonded phase enriched layer, the diameter R1 at the center and R2 at the end were measured by the cross section obtained by cutting the substrate in the thickness direction at the plane including the through shaft.
  • the hardness of the bonded phase enriched layer was lower than the hardness inside the substrate.
  • the obtained insert was put in the pocket of the holder, a clamp was inserted into the through hole of the insert, and the insert was fixed with this clamp. Then, a cutting test was conducted under the following conditions.
  • the sample No. which does not have the insert configuration of the present disclosure.
  • the cutting time until chipping occurs is short.
  • sample No. Chips 1, 15, 19, 20, 22, and 23 had poor chip controllability, and chip entanglement, biting, and wrapping occurred.
  • the inserts of the present disclosure were suppressed from abnormal damage. Also, chips did not get entangled in the insert or holder. In addition, biting and wrapping did not occur.
  • the cutting time until chipping occurred was long, and the surface roughness of the machined work material was also good.
  • the surface roughness Ra of the chip breaker is preferably 0.1 ⁇ m or more and 0.27 ⁇ m or less. Further, the surface roughness Ra of the cutting edge may be 0.2 ⁇ m or less.
  • the cermet insert and the cutting tool provided with the cermet insert described above are examples, and may have different configurations as long as they do not deviate from the gist of the present application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)

Abstract

A cermet insert (1) according to the present disclosure has: a first surface (5); a second surface (7); a cutting edge (11) which is disposed at least at a portion of a ridge line between the first surface (5) and the second surface (7); a third surface (9) located on the side opposite to the first surface (5); and a through-hole (15) penetrating from the first surface (5) to the third surface (9). An inner wall (17) constituting the through-hole (15) has, at least at a center part thereof, a binder phase-enriched layer (19) that has a higher content of binder phase as compared with the interior of a base body (3). The thickness T1 of the binder phase-enriched layer (19) at the center part is thicker than the thickness T2 of the binder phase-enriched layer (19) at an edge part. The thickness T1 is 1-20 μm, while the thickness T2 is 0.2-6 μm. The first surface (5) is provided with a chip breaker (50). The chip breaker (50) is configured to have an arithmetic average roughness Ra of 0.1-0.27 μm at a cut-off value of 0.08 mm.

Description

サーメット製インサート及びこれを備えた切削工具Cermet inserts and cutting tools equipped with them
　本開示は、切削加工において用いられるサーメット製インサート及びこれを備えた切削工具に関する。 This disclosure relates to a cermet insert used in cutting and a cutting tool equipped with the cermet insert.
　現在、切削工具や耐摩耗性部材、摺動部材等の耐摩耗性や摺動性、耐チッピング性を必要とする部材の基体として、チタン（Ｔｉ）を主成分とするサーメットが広く使われている。 Currently, cermets containing titanium (Ti) as the main component are widely used as a substrate for members that require wear resistance, sliding property, and chipping resistance, such as cutting tools, wear-resistant members, and sliding members. There is.
　例えば、特許文献１では、工具本体への取り付け用貫通孔を有する表面被覆炭窒化チタン基サーメット製切削インサートが記載されている。特許文献１においては、負荷の高い切削においても異常損傷が少ないインサートを提供するために、取り付け用貫通孔の内面に金属シミダシ層を設けることが記載されている。 For example, Patent Document 1 describes a surface-coated titanium nitride-based cermet cutting insert having a through hole for attachment to a tool body. Patent Document 1 describes that a metal stain layer is provided on the inner surface of the mounting through hole in order to provide an insert with less abnormal damage even in high-load cutting.
特開２０１２－２４５５８１号公報Japanese Unexamined Patent Publication No. 2012-245581
　本開示のインサートは、硬質粒子と結合相とを含有するサーメットである基体を具備するサーメット製インサートである。本開示のサーメット製インサートは、第１面と、第２面と、第１面および第２面の稜線の少なくとも一部に位置する切刃と、第１面の反対に位置する第３面と、第１面から第３面にわたる貫通孔と、を有する。貫通孔を構成する内壁は、少なくとも中央部に、基体の内部よりも結合相の含有率が高い結合相富化層を有する。中央部における結合相富化層の厚みＴ１は、内壁の端部における結合相富化層の厚みＴ２よりも厚い。厚みＴ１は、１μｍ以上、２０μｍ以下であり、厚みＴ２は、０．２μｍ以上、６μｍ以下である。また、第１面は、チップブレーカを備える。チップブレーカの算術平均粗さＲａは、カットオフ値０．０８ｍｍの場合、０．１μｍ以上０．２７μｍ以下である。 The insert of the present disclosure is a cermet insert comprising a substrate which is a cermet containing hard particles and a bonded phase. The cermet inserts of the present disclosure include a first surface, a second surface, a cutting edge located at least part of the ridges of the first and second surfaces, and a third surface opposite the first surface. , A through hole extending from the first surface to the third surface. The inner wall constituting the through hole has a bound phase enriched layer having a higher content of the bound phase than the inside of the substrate, at least in the central portion. The thickness T1 of the bonded phase enriched layer in the central portion is thicker than the thickness T2 of the bonded phase enriched layer at the end portion of the inner wall. The thickness T1 is 1 μm or more and 20 μm or less, and the thickness T2 is 0.2 μm or more and 6 μm or less. Further, the first surface is provided with a chip breaker. The arithmetic mean roughness Ra of the chip breaker is 0.1 μm or more and 0.27 μm or less when the cutoff value is 0.08 mm.
図１は、本開示のインサートの一例を示す斜視図である。FIG. 1 is a perspective view showing an example of the insert of the present disclosure. 図２は、本開示のインサートの一例を示す、断面における概要図である。FIG. 2 is a schematic cross-sectional view showing an example of the inserts of the present disclosure. 図３は、本開示のインサートの断面の拡大概要図である。FIG. 3 is an enlarged schematic view of a cross section of the insert of the present disclosure. 図４は、本開示のインサートの他の形態の断面の拡大概要図である。FIG. 4 is an enlarged schematic view of a cross section of another form of the insert of the present disclosure. 図５は、本開示のインサートの他の形態の断面の拡大概要図である。FIG. 5 is an enlarged schematic view of a cross section of another form of the insert of the present disclosure. 図６は、図２に示すＶＩ部の模式的な拡大図である。FIG. 6 is a schematic enlarged view of the VI portion shown in FIG. 図７は、本開示の切削工具の一例を示す平面図である。FIG. 7 is a plan view showing an example of the cutting tool of the present disclosure. 図８は、本開示の切削工具におけるインサートの断面の拡大概要図である。FIG. 8 is an enlarged schematic view of a cross section of the insert in the cutting tool of the present disclosure.
　＜インサート＞
　以下、本開示のサーメット製インサート（以下、単に「インサート」と記載する。）及びこれを備えた切削工具について、図面を用いて詳細に説明する。但し、以下で参照する各図は、説明の便宜上、実施形態を説明する上で必要な主要部材のみを簡略化して示したものである。したがって、本開示のインサートは、参照する各図に示されていない任意の構成部材を備え得る。また、各図中の部材の寸法は、実際の構成部材の寸法及び各部材の寸法比率などを忠実に表したものではない。これらの点は、後述する切削工具においても同様である。 <Insert>
Hereinafter, the cermet insert (hereinafter, simply referred to as “insert”) and the cutting tool provided with the cermet insert of the present disclosure will be described in detail with reference to the drawings. However, each figure referred to below is shown in a simplified manner only for the main members necessary for explaining the embodiment for convenience of explanation. Accordingly, the inserts of the present disclosure may comprise any component not shown in each referenced figure. Further, the dimensions of the members in each drawing do not faithfully represent the dimensions of the actual constituent members and the dimensional ratio of each member. These points are the same for the cutting tool described later.
　切削加工において用いられるサーメット製インサートにおいては、異常損傷が少ないことが望まれる。本開示は、異常損傷が少ないサーメット製インサート及びこれを備えた切削工具を提供する。 It is desirable that there is little abnormal damage in the cermet insert used in cutting. The present disclosure provides a cermet insert with less abnormal damage and a cutting tool equipped with the cermet insert.
　本開示のインサートは、硬質粒子と結合相とを含有するサーメットである基体を有する。硬質粒子は、例えば、ＴｉＣＮ、ＴｉＣ、ＴｉＮ、（ＴｉＭ）ＣＮ（Ｍは、Ｗ、Ｎｂ、Ｔａ、Ｍｏ、Ｖから選ばれる一種以上）である。結合相は、ＮｉやＣｏなどの鉄族金属を主成分とする。なお、主成分とは、構成成分のうち５０質量％以上を占めるものである。 The insert of the present disclosure has a cermet substrate containing hard particles and a bound phase. The hard particles are, for example, TiCN, TiC, TiN, (TiM) CN (M is one or more selected from W, Nb, Ta, Mo, and V). The bonded phase is mainly composed of an iron group metal such as Ni or Co. The main component occupies 50% by mass or more of the constituent components.
　図１、２に示すように、本開示のインサート１の形状は、例えば、四角板形状であってもよい。図１における上面である第１面５は、いわゆるすくい面である。また、インサート１は、第１面５に繋がる側面である第２面７を有している。 As shown in FIGS. 1 and 2, the shape of the insert 1 of the present disclosure may be, for example, a square plate shape. The first surface 5 which is the upper surface in FIG. 1 is a so-called rake surface. Further, the insert 1 has a second surface 7 which is a side surface connected to the first surface 5.
　インサート１は、第１面５の反対に位置する下面である第３面９を有している。第２面７は、第１面５及び第３面９のそれぞれにつながっている。 The insert 1 has a third surface 9 which is a lower surface located opposite to the first surface 5. The second surface 7 is connected to each of the first surface 5 and the third surface 9.
　本開示のインサート１は、第１面５と第２面７とが交わる稜線の少なくとも一部に位置する切刃１１を有している。言い換えれば、本開示のインサート１は、すくい面と逃げ面とが交わる稜線の少なくとも一部に位置する切刃１１を有している。切刃１１は、第１面５と第２面７とに連続する第４面を有していてもよい。第４面は、第１面５と第２面７との角部を斜め且つ直線的に削ったＣ面（チャンファー面）であってもよい。また、第４面は、第１面５と第２面７との角部を丸めたＲ面（ラウンド面）であってもよい。 The insert 1 of the present disclosure has a cutting edge 11 located at least a part of the ridgeline where the first surface 5 and the second surface 7 intersect. In other words, the insert 1 of the present disclosure has a cutting edge 11 located at least a part of the ridgeline where the rake face and the flank face intersect. The cutting edge 11 may have a fourth surface continuous with the first surface 5 and the second surface 7. The fourth surface may be a C surface (Chamfer surface) in which the corner portions of the first surface 5 and the second surface 7 are cut diagonally and linearly. Further, the fourth surface may be an R surface (round surface) in which the corners of the first surface 5 and the second surface 7 are rounded.
　インサート１においては、第１面５の外周の全体が切刃１１となっていてもよいが、インサート１はこのような構成に限定されるものではなく、例えば、四角形のすくい面における一辺のみ、言い換えれば、４つの第４面のうちの一つに切刃１１を有するものであってもよい。 In the insert 1, the entire outer circumference of the first surface 5 may be the cutting edge 11, but the insert 1 is not limited to such a configuration, and for example, only one side on the quadrangular rake surface. In other words, the cutting edge 11 may be provided on one of the four fourth surfaces.
　本開示のインサート１は、第１面５から第３面９にわたり、基体３を貫通する貫通孔１５を有している。図３に示すように、貫通孔１５を構成する内壁１７には、少なくとも中央部１７ａにおいて、結合相富化層１９が存在している。結合相富化層１９は、硬質粒子および結合相を含有し、基体３の内部よりも結合相の含有率の高い領域である。基体３の内部とは、基体３の表面から５００μｍ以上離れた部分を意味する。結合相富化層１９は、貫通孔１５の内壁１７の全てに存在する必要はなく、少なくとも中央部１７ａに位置していればよい。 The insert 1 of the present disclosure has a through hole 15 penetrating the substrate 3 from the first surface 5 to the third surface 9. As shown in FIG. 3, the inner wall 17 constituting the through hole 15 has a bonded phase enriched layer 19 at least in the central portion 17a. The bonded phase enriched layer 19 is a region containing hard particles and a bonded phase and having a higher content of the bonded phase than the inside of the substrate 3. The inside of the substrate 3 means a portion separated from the surface of the substrate 3 by 500 μm or more. The bonded phase enriched layer 19 does not have to be present in all of the inner walls 17 of the through hole 15, and may be located at least in the central portion 17a.
　中央部１７ａは、貫通孔１５を深さ方向に９等分したときの真ん中である。また、端部１７ｂは、貫通孔１５を深さ方向に９等分したときの端である。 The central portion 17a is in the middle when the through hole 15 is divided into nine equal parts in the depth direction. Further, the end portion 17b is an end when the through hole 15 is divided into nine equal parts in the depth direction.
　図３に示すように、本開示のインサート１において、貫通孔１５を構成する内壁１７の中央部１７ａにおける結合相富化層１９の厚みＴ１は、貫通孔１５を構成する内壁１７の端部１７ｂにおける結合相富化層１９の厚みＴ２よりも厚い。中央部１７ａにおける結合相富化層１９の厚みＴ１および端部１７ｂにおける結合相富化層１９の厚みＴ２とは、それぞれ平均値である。厚みＴ１および厚みＴ２は、インサート１の断面を金属顕微鏡や電子顕微鏡を用いて観察して測定するとよい。なお、端部１７ｂにおいては、結合相富化層１９が存在していなくともよい。 As shown in FIG. 3, in the insert 1 of the present disclosure, the thickness T1 of the bonded phase enriched layer 19 in the central portion 17a of the inner wall 17 constituting the through hole 15 is the end portion 17b of the inner wall 17 constituting the through hole 15. The thickness of the bonded phase enriched layer 19 in T2 is larger than that of T2. The thickness T1 of the bound phase enriched layer 19 in the central portion 17a and the thickness T2 of the coupled phase enriched layer 19 in the end portion 17b are average values, respectively. The thickness T1 and the thickness T2 may be measured by observing the cross section of the insert 1 with a metallurgical microscope or an electron microscope. It is not necessary that the bonded phase enriched layer 19 is present at the end portion 17b.
　本開示のインサート１は、このような構成を有することで、ホルダ（図示しない）への固定の際に大きな力が加わる内壁１７を起点としてインサート１が異常損傷することが抑制される。 Since the insert 1 of the present disclosure has such a configuration, it is possible to prevent the insert 1 from being abnormally damaged starting from the inner wall 17 to which a large force is applied when the insert 1 is fixed to a holder (not shown).
　結合相富化層１９は、基体３に比べて硬度が低く、引用文献１に記載されているような金属シミダシ層よりも硬度が高い。そのため、結合相富化層１９は、金属シミダシ層よりも変形が抑制されている。 The bonded phase enriched layer 19 has a lower hardness than the substrate 3, and has a higher hardness than the metal shimidashi layer as described in Cited Document 1. Therefore, the bond phase enriched layer 19 is less deformed than the metal shimidashi layer.
　上述の構成を有するため、インサート１をクランプによってホルダに固定する際に、内壁１７における中央部１７ａとクランプとの接触において、中央部１７ａにおける結合相富化層１９の抑制された変形により、基体３にかかる局所的な力が小さいため、インサート１が割れにくく、異常損傷しにくい。 Due to the above configuration, when the insert 1 is clamped to the holder, the substrate due to the suppressed deformation of the coupled phase enriched layer 19 at the central portion 17a at the contact between the central portion 17a on the inner wall 17 and the clamp. Since the local force applied to 3 is small, the insert 1 is less likely to crack and is less likely to be abnormally damaged.
　インサート１の大きさは特に限定されるものではないが、例えば、すくい面の一辺の長さが３～２０ｍｍ程度に設定される。また、インサート１の厚みは、例えば１～２０ｍｍ程度に設定される。また、図１においては、四角形状のインサート１を例示したが、例えば、三角形状や円盤状であってもよい。 The size of the insert 1 is not particularly limited, but for example, the length of one side of the rake face is set to about 3 to 20 mm. The thickness of the insert 1 is set to, for example, about 1 to 20 mm. Further, in FIG. 1, the rectangular insert 1 is illustrated, but it may be triangular or disk-shaped, for example.
　また、図４に示すように、本開示のインサート１は、内壁１７に繋がる拡径部２１を有していてもよい。貫通孔１５と拡径部２１との境には段差がある。なお、図４に示す例では、拡径部２１の内壁には、結合相富化層１９が存在しないが、拡径部２１にも結合相富化層１９があってもよい。本開示のインサート１において、拡径部２１は、貫通孔１５に含まれない。拡径部２１は、いわゆる、ざぐり面である。拡径部２１の直径は、貫通孔１５の直径よりも、３００μｍ以上大きい。 Further, as shown in FIG. 4, the insert 1 of the present disclosure may have a diameter-expanded portion 21 connected to the inner wall 17. There is a step at the boundary between the through hole 15 and the enlarged diameter portion 21. In the example shown in FIG. 4, the bonded phase enriched layer 19 does not exist on the inner wall of the enlarged diameter portion 21, but the coupled phase enriched layer 19 may also be present on the enlarged diameter portion 21. In the insert 1 of the present disclosure, the enlarged diameter portion 21 is not included in the through hole 15. The enlarged diameter portion 21 is a so-called counterbore surface. The diameter of the enlarged diameter portion 21 is 300 μm or more larger than the diameter of the through hole 15.
　中央部１７ａにおける結合相富化層１９の厚みＴ１は、１μｍ以上であってもよい。また、厚みＴ１は、２０μｍ以下であってもよい。このような構成によれば、インサート１の異常損傷が抑制される。厚みＴ１は、３μｍ以上であってもよい。また、厚みＴ１は１０μｍ以下であってもよい。 The thickness T1 of the bonded phase enriched layer 19 in the central portion 17a may be 1 μm or more. Further, the thickness T1 may be 20 μm or less. According to such a configuration, abnormal damage of the insert 1 is suppressed. The thickness T1 may be 3 μm or more. Further, the thickness T1 may be 10 μm or less.
　端部１７ｂにおける結合相富化層１９の厚みＴ２は、０．２μｍ以上であってもよい。また、厚みＴ２は６μｍ以下であってもよい。このような構成によれば、インサート１の異常損傷が抑制される。厚みＴ２は、０．６μｍ以上であってもよい。厚みＴ２は、４μｍ以下であってもよい。このような構成によれば、基体３にかかる局所的な力がさらに小さくなることから、インサート１が割れにくくなり異常損傷がさらに抑制される。 The thickness T2 of the bonded phase enriched layer 19 at the end portion 17b may be 0.2 μm or more. Further, the thickness T2 may be 6 μm or less. According to such a configuration, abnormal damage of the insert 1 is suppressed. The thickness T2 may be 0.6 μm or more. The thickness T2 may be 4 μm or less. According to such a configuration, the local force applied to the substrate 3 is further reduced, so that the insert 1 is less likely to crack and abnormal damage is further suppressed.
　図５に示すように、中央部１７ａにおける直径Ｒ１は、端部１７ｂにおける直径Ｒ２よりも大きくてもよい。このような構成を有すると、クランプと、内壁１７との接触面積が大きくなり、クランプ力が増す。 As shown in FIG. 5, the diameter R1 at the central portion 17a may be larger than the diameter R2 at the end portion 17b. With such a configuration, the contact area between the clamp and the inner wall 17 becomes large, and the clamping force increases.
　中央部１７ａにおける直径Ｒ１は、端部１７ｂにおける直径Ｒ２よりも５μｍ以上、３０μｍ以下大きくてもよい。このような構成を有するとインサート１の異常損傷が抑制される。 The diameter R1 at the central portion 17a may be 5 μm or more and 30 μm or less larger than the diameter R2 at the end portion 17b. With such a configuration, abnormal damage of the insert 1 is suppressed.
　中央部１７ａにおける結合相富化層１９の硬度は、１０ＧＰａ以上、２０ＧＰａ以下であってもよい。このような構成によれば、クランプピンが接触した際に、結合相富化層１９が適度に変形し、クランプ力が増す。中央部１７ａにおける結合相富化層１９の硬度は、インサート１の断面において、露出した結合相富化層１９を、ナノインデンテーション法を用いて測定するとよい。 The hardness of the bonded phase enriched layer 19 in the central portion 17a may be 10 GPa or more and 20 GPa or less. According to such a configuration, when the clamp pins come into contact with each other, the coupled phase enriched layer 19 is appropriately deformed and the clamping force is increased. The hardness of the bonded phase enriched layer 19 in the central portion 17a may be measured by measuring the exposed bonded phase enriched layer 19 in the cross section of the insert 1 by using a nanoindentation method.
　中央部１７ａにおける結合相富化層１９は、貫通孔１５の貫通軸側に結合相富化層１９よりも結合相の含有量が多い金属層（図示しない）を有していてもよい。この金属層は、硬質層を含まず、金属のみから構成されている。このような構成を有すると、金属層が、後述するクランプと、結合相富化層１９の間で緩衝材として機能するため、インサート１の異常損傷が抑制される。金属層の厚みは、０．３μｍ以上、２μｍ以下であってもよい。 The bonded phase enriched layer 19 in the central portion 17a may have a metal layer (not shown) having a higher content of the bonded phase than the bonded phase enriched layer 19 on the through shaft side of the through hole 15. This metal layer does not include a hard layer and is composed only of metal. With such a configuration, the metal layer functions as a cushioning material between the clamp described later and the bonded phase enriched layer 19, so that abnormal damage to the insert 1 is suppressed. The thickness of the metal layer may be 0.3 μm or more and 2 μm or less.
　インサート１は、中央部１７ａにおける結合相富化層１９の上に被覆層（図示しない）を有していてもよい。被覆層は、例えば、ＴｉＣＮ、ＴｉＮ、ＴｉＣＮＯ、Ａｌ２Ｏ３などを含む硬質層である。被覆層は結合相富化層１９よりも硬度が高い部分を有する。このような構成を有するとクランプ部の耐摩耗性が増す。被覆層は、単層であってもよく、積層であってもよい。被覆層は、ＣＶＤ法やＰＶＤ法によって形成されるものであってもよい。 The insert 1 may have a coating layer (not shown) on the bound phase enriched layer 19 at the central portion 17a. The coating layer is a hard layer containing, for example, TiCN, TiN, TiCNO, Al 2 O 3 and the like. The coating layer has a portion having a higher hardness than the bonded phase enriched layer 19. Having such a configuration increases the wear resistance of the clamp portion. The coating layer may be a single layer or a laminated layer. The coating layer may be formed by a CVD method or a PVD method.
　図６は、図２に示すＶＩ部の模式的な拡大図である。図６に示すように、インサート１は、すくい面である第１面５に、チップブレーカ５０を有する。一例として、チップブレーカ５０は、第１面５を凹ませた凹部である。チップブレーカ５０は、第１面５から切刃１１に向かって下り傾斜する傾斜面（障壁５１）を有する。 FIG. 6 is a schematic enlarged view of the VI portion shown in FIG. As shown in FIG. 6, the insert 1 has a chip breaker 50 on a first surface 5, which is a rake surface. As an example, the chip breaker 50 is a recess in which the first surface 5 is recessed. The tip breaker 50 has an inclined surface (barrier 51) that inclines downward from the first surface 5 toward the cutting edge 11.
　チップブレーカ５０は、被削材の切りくずを障壁５１においてカールさせることで、切りくずを好適に破断したり、切りくずを所望の方向に排出させたりすることができる。かかるチップブレーカ５０を有するインサート１は、切りくずの噛み込みおよび巻き付き等を抑制することができる。これにより、たとえば、巻き付いた切りくずが基体３にぶつかることによるインサート１の異常損傷が低減される。なお、チップブレーカ５０は、少なくとも障壁５１を有していればよく、図示の形状に限定されない。たとえば、チップブレーカ５０は、必ずしも凹部であることを要さず、段差状であってもよい。 The chip breaker 50 can appropriately break the chips and discharge the chips in a desired direction by curling the chips of the work material at the barrier 51. The insert 1 having such a chip breaker 50 can suppress chip biting and wrapping. This reduces, for example, abnormal damage to the insert 1 due to the wound chips hitting the substrate 3. The chip breaker 50 may have at least a barrier 51, and is not limited to the shape shown in the figure. For example, the chip breaker 50 does not necessarily have to be a concave portion, and may have a stepped shape.
　チップブレーカ５０の表面粗さは、算術平均粗さＲａで、カットオフ値０．０８ｍｍの場合、０．１μｍ以上であってもよい。チップブレーカ５０の表面粗さが小さい（言い換えれば、摩擦係数が小さい）と、切りくずが障壁５１に接触せず適切にカールされないおそれがある。これに対し、チップブレーカ５０の表面粗さを上記範囲とすることで、切りくずが障壁５１に対して接触しやすくなる。そのため、表面粗さが上記範囲にあるチップブレーカ５０を有すると、切りくずを好適にカールさせることができる。これにより、切りくずの破断が適切に行われることで、インサート１の異常損傷がさらに抑制される。 The surface roughness of the chip breaker 50 is an arithmetic mean roughness Ra, and when the cutoff value is 0.08 mm, it may be 0.1 μm or more. If the surface roughness of the chip breaker 50 is small (in other words, the coefficient of friction is small), the chips may not come into contact with the barrier 51 and may not be properly curled. On the other hand, by setting the surface roughness of the chip breaker 50 within the above range, chips are likely to come into contact with the barrier 51. Therefore, if the chip breaker 50 has a surface roughness in the above range, chips can be suitably curled. As a result, the chips are appropriately broken, and the abnormal damage of the insert 1 is further suppressed.
　また、チップブレーカ５０の表面粗さは、算術平均粗さＲａで、カットオフ値０．０８ｍｍの場合、０．２７μｍ以下であってもよい。チップブレーカ５０の算術平均粗さＲａが０．３μｍを超えると切りくずの衝突による応力が障壁５１に集中し、障壁５１にチッピングが発生し、損傷が大きくなるおそれがある。これに対し、チップブレーカ５０の算術平均粗さＲａが０．２７μｍ以下であると、障壁５１の損傷を生じにくくすることができる。 Further, the surface roughness of the chip breaker 50 may be 0.27 μm or less when the arithmetic average roughness Ra is 0.08 mm and the cutoff value is 0.08 mm. If the arithmetic mean roughness Ra of the chip breaker 50 exceeds 0.3 μm, the stress due to the collision of chips is concentrated on the barrier 51, chipping occurs in the barrier 51, and the damage may be large. On the other hand, when the arithmetic mean roughness Ra of the chip breaker 50 is 0.27 μm or less, damage to the barrier 51 can be less likely to occur.
　切刃１１の表面粗さ、言い換えれば、切刃１１が位置する第４面の表面粗さは、算術平均粗さＲａで、カットオフ値０．０８ｍｍの場合、０．２μｍ以下であってもよい。インサート１は、被削材への接触時（食いつき時）に大きな抵抗を受ける。この食いつき時の抵抗は、インサート１の欠損の要因となりうる。これに対し、被削材に最初に接触する箇所である切刃１１の表面粗さを上記範囲とすることで、食いつき時の抵抗を小さくすることができる。これにより、インサート１の欠損、具体的には、被削材への食いつき時に生じる突発欠損をさらに抑制することができる。また、インサート１にチッピングが発生するまでの切削時間が延び、耐チッピング性が向上する。また、切刃１１（第４面）として、光沢のある良好な仕上げ面が得られる。 The surface roughness of the cutting edge 11, in other words, the surface roughness of the fourth surface on which the cutting edge 11 is located is the arithmetic mean roughness Ra, even if the cutoff value is 0.08 mm, even if it is 0.2 μm or less. good. The insert 1 receives a large resistance when it comes into contact with the work material (when it bites). This biting resistance can cause the insert 1 to be chipped. On the other hand, by setting the surface roughness of the cutting edge 11 which is the portion that first contacts the work material within the above range, the resistance at the time of biting can be reduced. As a result, it is possible to further suppress the defect of the insert 1, specifically, the sudden defect that occurs when the insert 1 is bitten into the work material. In addition, the cutting time until chipping occurs in the insert 1 is extended, and the chipping resistance is improved. Further, as the cutting edge 11 (fourth surface), a glossy and good finished surface can be obtained.
　本実施形態においてチップブレーカ５０の算術平均粗さＲａ及び切刃１１の算術平均粗さＲａを測定するには、カットオフ値を０．０８ｍｍに固定する以外はＪＩＳＢ０６０１－２０１３規格に準じて、チップブレーカ５０及び切刃１１の表面形状を測定すればよい。測定は、例えば、触針を用いた接触式表面粗さ測定機、あるいは、レーザを用いた非接触式表面粗さ測定機を利用すればよい。切刃１１の算術平均粗さＲａを測定する場合、切刃１１に沿った方向での表面形状を測定すればよい。第１面５が円形であって切刃１１が円弧形状の場合は、切刃１１に沿った曲線上で表面形状を測定すればよい。 In the present embodiment, in order to measure the arithmetic mean roughness Ra of the chip breaker 50 and the arithmetic average roughness Ra of the cutting edge 11, the chip conforms to the JISB0601-2013 standard except that the cutoff value is fixed at 0.08 mm. The surface shapes of the breaker 50 and the cutting edge 11 may be measured. For the measurement, for example, a contact type surface roughness measuring machine using a stylus or a non-contact type surface roughness measuring machine using a laser may be used. When measuring the arithmetic mean roughness Ra of the cutting edge 11, the surface shape in the direction along the cutting edge 11 may be measured. When the first surface 5 is circular and the cutting edge 11 has an arc shape, the surface shape may be measured on a curve along the cutting edge 11.
　＜インサートの製造方法＞
　以下に本開示のインサートの製造方法を説明する。 <Manufacturing method of insert>
The manufacturing method of the insert of the present disclosure will be described below.
　本開示のインサートの製造に用いられる原料粉末は、一般的にサーメットの製造で用いられるものである。本開示のインサートは、基体の組成及び焼成条件並びに基体の加工方法を工夫することで得ることができる。 The raw material powder used in the production of the inserts of the present disclosure is generally used in the production of cermets. The insert of the present disclosure can be obtained by devising the composition and firing conditions of the substrate and the processing method of the substrate.
　基体は、例えば、硬質粒子であるＴｉＣＮを４０質量％以上、８０質量％以下含有し、結合相であるＣｏを６質量％以上、３０質量％以下、含有するものであってもよい。また、さらに特性向上のために、基体は、ＷＣ、ＴａＣ、ＮｂＣ、Ｍｏ２Ｃ、ＶＣ、ＺｒＣなどを含有してもよい。 The substrate may contain, for example, 40% by mass or more and 80% by mass or less of TiCN which is a hard particle, and 6% by mass or more and 30% by mass or less of Co which is a bonding phase. Further, in order to further improve the characteristics, the substrate may contain WC, TaC, NbC, Mo 2C , VC, ZrC and the like.
　上述の組成を有する原材料を用いて、焼成後に貫通孔となる空間を有する形状に成形する。その後、例えば、１４００℃以上、１６００℃以下の温度で焼成する。この焼成雰囲気をＮ２分圧雰囲気下としてもよい。 Using the raw material having the above composition, it is molded into a shape having a space to be a through hole after firing. Then, for example, firing is performed at a temperature of 1400 ° C. or higher and 1600 ° C. or lower. This firing atmosphere may be set to an N2 partial pressure atmosphere.
　Ｎ２分圧を１ｋＰａ以上にすると、焼成後の結合相富化層の厚みは厚くなる。また、原料として用いる硬質粒子の平均粒子径ｄ５０を０．７μｍ以下とすると貫通孔の貫通軸（図示しない）側に結合相富化層よりも結合相の含有量が多い金属層を有する結合相富化層が得られる。 When the N2 partial pressure is 1 kPa or more, the thickness of the bonded phase enriched layer after firing becomes thick. Further, when the average particle diameter d50 of the hard particles used as a raw material is 0.7 μm or less, the bonded phase has a metal layer having a higher content of the bonded phase than the bonded phase enriched layer on the through axis (not shown) side of the through hole. An enriched layer is obtained.
　なお、上記の成形時に、成形圧が大きいと焼成時の変形を抑制することができる。一方、成形時に成形圧を小さくすると、内壁の中央部における直径Ｒ１が、端部における直径Ｒ２よりも大きくなりやすい。成形圧と変形の関係は、組成や焼成温度によって変化するため、種々組み合わせて調整するとよい。 If the molding pressure is high during the above molding, deformation during firing can be suppressed. On the other hand, if the molding pressure is reduced during molding, the diameter R1 at the central portion of the inner wall tends to be larger than the diameter R2 at the end portion. Since the relationship between the forming pressure and the deformation changes depending on the composition and the firing temperature, various combinations may be adjusted.
　例えば、焼成後に回転するブラシを貫通孔の両端部から貫通孔に挿入して貫通孔の内壁を研磨し、中央部における結合相富化層の厚みＴ１が端部における結合相富化層の厚みＴ２よりも厚くなるように加工することで、本開示のインサートを得ることができる。なお、ブラシは貫通孔の両側から挿入してもよく、片方から２度に分けて挿入してもよい。 For example, a brush that rotates after firing is inserted into the through hole from both ends of the through hole to polish the inner wall of the through hole, and the thickness T1 of the bonded phase enriched layer at the central portion is the thickness of the bonded phase enriched layer at the end. The insert of the present disclosure can be obtained by processing the insert so as to be thicker than T2. The brush may be inserted from both sides of the through hole, or may be inserted from one side in two steps.
　その後、必要に応じて被覆層（図示しない）を設けてもよい。被覆層は、いわゆる、硬質膜であればよく、例えば、ＰＶＤ法やＣＶＤ法で形成するとよい。被覆膜は単層であってもよく、積層膜であってもよい。 After that, a covering layer (not shown) may be provided if necessary. The coating layer may be a so-called hard film, and may be formed by, for example, a PVD method or a CVD method. The coating film may be a single layer or a laminated film.
　被覆膜としては、例えば、ＴｉＮ、ＴｉＣＮ、ＴｉＣＮＯ、Ａｌ２Ｏ３、ＴｉＡｌＮなどの公知の材質を用いることができる。上述の例以外の材質の被覆膜を用いてもよい。 As the coating film, for example, known materials such as TiN, TiCN, TiCNO, Al2O3 , and TiAlN can be used. A coating film made of a material other than the above-mentioned example may be used.
　また、焼成後の時点で、貫通孔以外の領域、例えば、第１面、第２面や第３面において結合相富化層が存在する場合があるが、必要に応じて結合相富化層を除去してもよい。 Further, at the time after firing, the bonded phase enriched layer may be present in a region other than the through hole, for example, the first surface, the second surface, or the third surface, but if necessary, the bonded phase enriched layer may be present. May be removed.
　チップブレーカの表面粗さは、たとえば基体の表面にブラスト加工を施すことによって調整することが可能である。ブラスト加工は、具体的には、セラミック砥粒を混合した溶液と圧縮空気とを混合した混合物（スラリー）を、基体の表面に衝突させる加工方法である。セラミック砥粒としては、例えばアルミナ等が挙げられる。セラミック砥粒の平均粒径は１μｍ以上１００μｍ以下であってもよい。セラミック砥粒の平均粒径が１μｍ未満であると、基体表面の粗さを調整することが困難である。また、セラミック砥粒の平均粒径が１００μｍを超えると、基体表面の粗さが荒れ、上記範囲外の面粗さとなるおそれがある。 The surface roughness of the chip breaker can be adjusted, for example, by blasting the surface of the substrate. Specifically, the blasting process is a processing method in which a mixture (slurry) of a solution mixed with ceramic abrasive grains and compressed air is made to collide with the surface of a substrate. Examples of the ceramic abrasive grains include alumina and the like. The average particle size of the ceramic abrasive grains may be 1 μm or more and 100 μm or less. If the average particle size of the ceramic abrasive grains is less than 1 μm, it is difficult to adjust the roughness of the surface of the substrate. Further, if the average particle size of the ceramic abrasive grains exceeds 100 μm, the surface roughness of the substrate may be roughened, and the surface roughness may be outside the above range.
　切刃の表面粗さは、たとえば、ブラシ、弾性砥石、ブラスト、等の研磨方法によって切刃のみを研磨することによって調整することが可能である。研磨方法としては、ブラシ研磨を行ってもよい。このとき、ブラシ研磨でのブラシ毛の突き出し量を０．５ｃｍ以上５ｃｍ以下、好ましくは２．５ｃｍ以上３．５ｃｍ以下とし、平均粒径４μｍ以下、好ましくは平均粒径０．５μｍ以上２．５μｍ以下の微粒のダイヤモンド粉末と、潤滑油を混ぜた研磨液を用いてもよい。これにより、チップブレーカの面粗さを所望の範囲としつつ、切刃の面粗さを所望の範囲に調整することができる。また、チップブレーカにマスキングを行い、切刃をなす部分にブラシや弾性砥石、ブラスト、等の研磨方法を用いて、切刃の表面粗さを調整してもよい。 The surface roughness of the cutting edge can be adjusted by polishing only the cutting edge with a polishing method such as a brush, an elastic grindstone, or a blast. As a polishing method, brush polishing may be performed. At this time, the amount of protrusion of the brush bristles by brush polishing is 0.5 cm or more and 5 cm or less, preferably 2.5 cm or more and 3.5 cm or less, and the average particle size is 4 μm or less, preferably 0.5 μm or more and 2.5 μm. A polishing liquid in which the following fine diamond powder and lubricating oil are mixed may be used. Thereby, the surface roughness of the cutting edge can be adjusted to a desired range while keeping the surface roughness of the tip breaker in a desired range. Further, the surface roughness of the cutting edge may be adjusted by masking the chip breaker and using a polishing method such as a brush, an elastic grindstone, or a blast on the portion forming the cutting edge.
　＜切削工具＞
　次に、本開示の切削工具について図面を用いて説明する。 <Cutting tool>
Next, the cutting tool of the present disclosure will be described with reference to the drawings.
　本開示の切削工具１０１は、図７に示すように、例えば、第１端（図７における上端）から第２端（図７における下端）に向かって延びる棒状体である。切削工具１０１は、図７に示すように、第１端側（先端側）にポケット１０３を有するホルダ１０５と、ポケット１０３に位置する上記のインサート１とを備えている。 As shown in FIG. 7, the cutting tool 101 of the present disclosure is, for example, a rod-shaped body extending from the first end (upper end in FIG. 7) to the second end (lower end in FIG. 7). As shown in FIG. 7, the cutting tool 101 includes a holder 105 having a pocket 103 on the first end side (tip side) and the above-mentioned insert 1 located in the pocket 103.
　また、図８に示すように、インサート１の貫通孔１５（図１参照）には、クランプ１０７が挿入されている。図８に示す例では、クランプ１０７は、中央部１７ａに位置する結合相富化層１９（図２参照）と直接または間接的に接触している。なお、間接的にクランプ１０７と結合相富化層１９が接触するとは、結合相富化層１９とクランプ１０７との間に金属層や被覆層が存在する状態を意味する。クランプ１０７が接触する結合相富化層１９は、基体３よりも変形しやすいため、インサート１に局所的に強い力がかかりにくい。また、結合相富化層１９を有すると、クランプ１０７と結合相富化層１９との接触面積が大きいため、インサート１が切削時にポケット内で動きにくい。このような効果が相まって、本開示のインサート１は、異常損傷しにくい。切削工具１０１は、インサート１を備えているため、長期に渡り安定した切削加工を行うことができる。 Further, as shown in FIG. 8, the clamp 107 is inserted into the through hole 15 (see FIG. 1) of the insert 1. In the example shown in FIG. 8, the clamp 107 is in direct or indirect contact with the coupled phase enrichment layer 19 (see FIG. 2) located at the central portion 17a. The indirect contact between the clamp 107 and the bonded phase enriched layer 19 means a state in which a metal layer or a coating layer exists between the coupled phase enriched layer 19 and the clamp 107. Since the bonded phase enriched layer 19 with which the clamp 107 comes into contact is more easily deformed than the substrate 3, it is difficult to apply a strong force locally to the insert 1. Further, when the coupled phase enriched layer 19 is provided, the contact area between the clamp 107 and the coupled phase enriched layer 19 is large, so that the insert 1 is difficult to move in the pocket during cutting. Combined with these effects, the insert 1 of the present disclosure is less likely to be abnormally damaged. Since the cutting tool 101 includes the insert 1, stable cutting can be performed for a long period of time.
　ポケット１０３は、インサート１が装着される部分であり、ホルダ１０５の下面に対して平行な着座面と、着座面に対して傾斜する拘束側面とを有している。また、ポケット１０３は、ホルダ１０５の第１端側において開口している。 The pocket 103 is a portion to which the insert 1 is mounted, and has a seating surface parallel to the lower surface of the holder 105 and a restraining side surface inclined with respect to the seating surface. Further, the pocket 103 is open on the first end side of the holder 105.
　ポケット１０３にはインサート１が位置している。このとき、インサート１の下面がポケット１０３に直接に接していてもよく、また、インサート１とポケット１０３との間にシート（不図示）が挟まれていてもよい。 Insert 1 is located in pocket 103. At this time, the lower surface of the insert 1 may be in direct contact with the pocket 103, or a sheet (not shown) may be sandwiched between the insert 1 and the pocket 103.
　インサート１は、すくい面及び逃げ面が交わる稜線における切刃１１として用いられる部分の少なくとも一部がホルダ１０５から外方に突出するようにホルダ１０５に装着される。本実施形態においては、インサート１は、クランプ１０７によって、ホルダ１０５に装着されている。すなわち、インサート１の貫通孔１５にクランプ１０７を挿入し、このクランプ１０７の先端をポケット１０３に形成されたネジ孔（不図示）に挿入してネジ部同士を螺合させることによって、インサート１がホルダ１０５に装着されている。 The insert 1 is attached to the holder 105 so that at least a part of the portion used as the cutting edge 11 at the ridge line where the rake surface and the flank surface intersect protrudes outward from the holder 105. In this embodiment, the insert 1 is attached to the holder 105 by a clamp 107. That is, the insert 1 is inserted by inserting the clamp 107 into the through hole 15 of the insert 1, inserting the tip of the clamp 107 into the screw hole (not shown) formed in the pocket 103, and screwing the screw portions together. It is attached to the holder 105.
　ホルダ１０５の材質としては、鋼、鋳鉄などを用いることができる。これらの部材の中で靱性の高い鋼を用いてもよい。 Steel, cast iron, etc. can be used as the material of the holder 105. Among these members, steel having high toughness may be used.
　本実施形態においては、いわゆる旋削加工に用いられる切削工具１０１を例示している。旋削加工としては、例えば、内径加工、外径加工、溝入れ加工及び端面加工などが挙げられる。なお、切削工具１０１としては旋削加工に用いられるものに限定されない。例えば、転削加工に用いられる切削工具１０１に上記の実施形態のインサート１を用いてもよい。 In this embodiment, the cutting tool 101 used for so-called turning is exemplified. Examples of the turning process include inner diameter processing, outer diameter processing, grooving processing, end face processing and the like. The cutting tool 101 is not limited to the one used for turning. For example, the insert 1 of the above embodiment may be used for the cutting tool 101 used for milling.
　以下に、本開示のインサートについて、説明する。 The inserts of the present disclosure will be described below.
　基体は、以下のように作製した。ＴｉＣＮを４０質量％、ＴｉＮを１２質量％、ＷＣを２０質量％、ＮｂＣを８質量％、Ｃｏを２０質量％、その他不可避炭化物を含む原料粉末原料粉末にバインダーを添加した後、プレス成型によって、所望の形状に整え、貫通孔を有する工具形状の成形体を作製した。これらの原料粉末は、一般的に、サーメットの製造で用いられるものである。本開示の基体の組成も特別なものではない。その後、バインダー成分を除去した後、３ｋＰａの窒素雰囲気で、１５３０℃の温度で１時間保持する条件で焼成し、貫通孔の内壁に金属層を有する結合相富化層を具備するインサートを得た。 The substrate was prepared as follows. TiCN is 40% by mass, TiN is 12% by mass, WC is 20% by mass, NbC is 8% by mass, Co is 20% by mass, and other raw material powders containing unavoidable carbides. A tool-shaped molded body having a through hole was produced by adjusting the shape to a desired shape. These raw material powders are generally used in the production of cermets. The composition of the substrate of the present disclosure is also not special. Then, after removing the binder component, it was fired in a nitrogen atmosphere of 3 kPa at a temperature of 1530 ° C. for 1 hour to obtain an insert having a bonded phase enriched layer having a metal layer on the inner wall of the through hole. ..
　その後、貫通孔の内壁をブラシで研磨して、表１に示す構成のインサートを作製した。なお、結合相富化層が存在しない、あるいは結合相富化層の厚みが薄い部分は、ブラシによる研磨時間を長くしたものである。
Figure JPOXMLDOC01-appb-T000001
   Then, the inner wall of the through hole was polished with a brush to prepare an insert having the configuration shown in Table 1. In the portion where the bonded phase enriched layer does not exist or the bonded phase enriched layer is thin, the polishing time by the brush is lengthened.
Figure JPOXMLDOC01-appb-T000001
　表１に示す試料Ｎｏ．１～２３の試料のうち、試料Ｎｏ．１、２、３、４、１１、１２、１３、１４、１５、１９、２０、２２、２３は、比較例であり、試料Ｎｏ．５～１０、１６～１８、２１は、実施例である。 Sample No. shown in Table 1. Of the samples 1 to 23, sample No. 1, 2, 3, 4, 11, 12, 13, 14, 15, 19, 20, 22, 23 are comparative examples, and Sample No. 1 and No. 5 to 10, 16 to 18, 21 are examples.
　なお、いずれのインサートも第１面、第２面、第３面をブラスト処理して、結合相富化層を除去した。 In each insert, the first surface, the second surface, and the third surface were blasted to remove the bonded phase enriched layer.
　ブラシによる研磨は、豚毛ブラシに０．１μｍ以上３μｍ以下のダイヤモンド粉末と潤滑油を混ぜた研磨液を塗布し、この豚毛ブラシを回転させながら、貫通孔及び切刃について行った。 Polishing with a brush was performed by applying a polishing liquid containing diamond powder of 0.1 μm or more and 3 μm or less and lubricating oil to a pig bristle brush, and rotating the pig bristle brush for through holes and cutting edges.
　結合相富化層の中央部および端部における厚み、中央部における直径Ｒ１および端部におけるＲ２は、基体を厚さ方向に貫通軸を含む面で切断して得られた断面で測定した。 The thickness at the center and the end of the bonded phase enriched layer, the diameter R1 at the center and R2 at the end were measured by the cross section obtained by cutting the substrate in the thickness direction at the plane including the through shaft.
　また、インサートの断面を用いて基体の内部における硬度、結合相富化層の硬度を測定したところ、結合相富化層の硬度は基体の内部における硬度よりも低かった。 Further, when the hardness inside the substrate and the hardness of the bonded phase enriched layer were measured using the cross section of the insert, the hardness of the bonded phase enriched layer was lower than the hardness inside the substrate.
　得られたインサートをホルダのポケットに入れ、インサートの貫通孔にクランプを挿入して、このクランプでインサートを固定した。そして、以下の条件で、切削試験を行った。 The obtained insert was put in the pocket of the holder, a clamp was inserted into the through hole of the insert, and the insert was fixed with this clamp. Then, a cutting test was conducted under the following conditions.
＜切削試験＞
被削材：Ｓ１０Ｃ
切削速度：４００ｍ／ｍｉｎ
送り：０．１２ｍｍ／ｒｅｖ
切込み：０．２ｍｍ
切削状態：湿式
評価方法：切りくずの処理性とチッピングが発生するまでの切削時間について評価した。 <Cutting test>
Work material: S10C
Cutting speed: 400m / min
Feed: 0.12 mm / rev
Notch: 0.2 mm
Cutting condition: Wet evaluation method: Chip disposability and cutting time until chipping occurred were evaluated.
　表１に示すように、本開示のインサートの構成を有さない、試料Ｎｏ．１、２、３、４、１１、１２、１３、１４、１５、１９、２０、２２、２３は、チッピングが発生するまでの切削時間が短い。また、試料Ｎｏ．１、１５、１９、２０、２２、２３は、切りくず処理性が悪く、切りくずの絡まりや噛み込みおよび巻き付きが発生した。本開示のインサートは、異常損傷が抑制されていた。また、切りくずがインサートやホルダに絡まなかった。また、噛み込みや巻き付きが起こらなかった。また、チッピングが発生するまでの切削時間が長くなり、加工した被削材の面粗度も良好であった。 As shown in Table 1, the sample No. which does not have the insert configuration of the present disclosure. For 1, 2, 3, 4, 11, 12, 13, 14, 15, 19, 20, 22, and 23, the cutting time until chipping occurs is short. In addition, sample No. Chips 1, 15, 19, 20, 22, and 23 had poor chip controllability, and chip entanglement, biting, and wrapping occurred. The inserts of the present disclosure were suppressed from abnormal damage. Also, chips did not get entangled in the insert or holder. In addition, biting and wrapping did not occur. In addition, the cutting time until chipping occurred was long, and the surface roughness of the machined work material was also good.
　以上の結果から、チップブレーカの表面粗さＲａは、０．１μｍ以上０．２７μｍ以下であることが好ましい。また、切刃の面粗さＲａは、０．２μｍ以下であってもよい。 From the above results, the surface roughness Ra of the chip breaker is preferably 0.1 μm or more and 0.27 μm or less. Further, the surface roughness Ra of the cutting edge may be 0.2 μm or less.
　以上説明した、本開示のサーメット製インサート及びこれを備えた切削工具は、一例であり、本願の要旨を逸脱しない限り、異なる構成を有していてもよい。 The cermet insert and the cutting tool provided with the cermet insert described above are examples, and may have different configurations as long as they do not deviate from the gist of the present application.
　　１・・・インサート
　　３・・・基体
　　５・・・第１面
　　７・・・第２面
　　９・・・第３面
　１０・・・第４面
　１１・・・切刃
　１５・・・貫通孔
　１７・・・内壁
　１７ａ・・中央部
　１７ｂ・・端部
　１９・・・結合相富化層
　２１・・・拡径部
　Ｔ１・・・中央部における結合相富化層の厚み
　Ｔ２・・・端部における結合相富化層の厚み
　Ｒ１・・・中央部における直径
　Ｒ２・・・端部における直径
１０１・・・切削工具
１０３・・・ポケット
１０５・・・ホルダ
１０７・・・クランプ 1 ... Insert 3 ... Base 5 ... 1st surface 7 ... 2nd surface 9 ... 3rd surface 10 ... 4th surface 11 ... Cutting edge 15 ... Through hole 17 ... Inner wall 17a ... Central part 17b ... End part 19 ... Bonded phase enriched layer 21 ... Diameter expansion part T1 ... Thickness of bonded phase enriched layer in the central part T2 ... Edge Thickness of bonded phase enriched layer at the portion R1 ... Diameter at the center R2 ... Diameter at the end 101 ... Cutting tool 103 ... Pocket 105 ... Holder 107 ... Clamp

Claims (8)

  1. 　硬質粒子と結合相とを含有するサーメットである基体を具備するサーメット製インサートであって、
    　該サーメット製インサートは、
    　　第１面と、
    　　第２面と、
    　　前記第１面および前記第２面の稜線の少なくとも一部に位置する切刃と、
    　　前記第１面の反対に位置する第３面と、前記第１面から前記第３面にわたる貫通孔と、を有し、
    　前記貫通孔を構成する内壁は、少なくとも中央部に、前記基体の内部よりも前記結合相の含有率が高い結合相富化層を有し、
    　前記中央部における前記結合相富化層の厚みＴ１は、前記内壁の端部における前記結合相富化層の厚みＴ２よりも厚く、
    　前記厚みＴ１は、１μｍ以上、２０μｍ以下であり、
    　前記厚みＴ２は、０．２μｍ以上、６μｍ以下であり、
    　前記第１面は、チップブレーカを備え、
    　前記チップブレーカの算術平均粗さＲａは、カットオフ値０．０８ｍｍの場合、０．１μｍ以上０．２７μｍ以下である、サーメット製インサート。     A cermet insert comprising a substrate which is a cermet containing hard particles and a bonded phase.
    The cermet insert
    The first side and
    The second side and
    A cutting edge located at least a part of the ridgeline of the first surface and the second surface,
    It has a third surface located opposite to the first surface and a through hole extending from the first surface to the third surface.
    The inner wall constituting the through hole has a bound phase enriched layer having a higher content of the bound phase than the inside of the substrate, at least in the central portion.
    The thickness T1 of the bonded phase enriched layer in the central portion is thicker than the thickness T2 of the bonded phase enriched layer at the end portion of the inner wall.
    The thickness T1 is 1 μm or more and 20 μm or less.
    The thickness T2 is 0.2 μm or more and 6 μm or less.
    The first surface is provided with a chip breaker.
    A cermet insert having an arithmetic mean roughness Ra of the chip breaker of 0.1 μm or more and 0.27 μm or less when the cutoff value is 0.08 mm.
  2. 　前記切刃は、前記第１面と前記第２面とに連続する第４面を有し、
    　前記第４面の算術平均粗さＲａは、カットオフ値０．０８ｍｍの場合、０．２μｍ以下である、請求項１に記載のサーメット製インサート。     The cutting edge has a fourth surface continuous with the first surface and the second surface.
    The cermet insert according to claim 1, wherein the arithmetic mean roughness Ra of the fourth surface is 0.2 μm or less when the cutoff value is 0.08 mm.
  3. 　前記中央部における直径Ｒ１は、前記端部における直径Ｒ２よりも大きい、請求項１または２に記載のサーメット製インサート。 The cermet insert according to claim 1 or 2, wherein the diameter R1 at the central portion is larger than the diameter R2 at the end portion.
  4. 　前記直径Ｒ１は、前記直径Ｒ２よりも５μｍ以上、３０μｍ以下大きい、請求項３に記載のサーメット製インサート。 The cermet insert according to claim 3, wherein the diameter R1 is 5 μm or more and 30 μm or less larger than the diameter R2.
  5. 　前記中央部における前記結合相富化層の硬度は、１０ＧＰａ以上、２０ＧＰａ以下である、請求項１～４のいずれか一つに記載のサーメット製インサート。 The cermet insert according to any one of claims 1 to 4, wherein the hardness of the bonded phase enriched layer in the central portion is 10 GPa or more and 20 GPa or less.
  6. 　前記中央部における前記結合相富化層は、前記貫通孔の貫通軸側に前記結合相富化層よりも前記結合相の含有量が多い金属層を有する、請求項１～５のいずれか一つに記載のサーメット製インサート。 Any one of claims 1 to 5, wherein the bonded phase enriched layer in the central portion has a metal layer having a higher content of the bonded phase than the bonded phase enriched layer on the through-axis side of the through hole. Cermet inserts listed in 1.
  7. 　前記中央部における前記結合相富化層の上に被覆層を有し、該被覆層は、前記結合相富化層よりも硬度が高い部分を有する、請求項１～６のいずれか一つに記載のサーメット製インサート。 The coating layer is provided on the bonded phase enriched layer in the central portion, and the coated layer has a portion having a hardness higher than that of the bonded phase enriched layer, according to any one of claims 1 to 6. The described cermet insert.
  8. 　第１端から第２端に亘る長さを有し、前記第１端側に位置するポケットを有するホルダと、
    　前記ポケットに位置する請求項１～７のいずれか一つに記載のサーメット製インサートと、
    　該サーメット製インサートの前記貫通孔に挿入されたクランプと、を有する切削工具。     A holder having a length extending from the first end to the second end and having a pocket located on the first end side.
    The cermet insert according to any one of claims 1 to 7 located in the pocket, and the cermet insert.
    A cutting tool having a clamp inserted into the through hole of the cermet insert.
PCT/JP2021/038495 2020-10-21 2021-10-18 Cermet insert and cutting tool equipped therewith WO2022085647A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022557538A JP7483917B2 (en) 2020-10-21 2021-10-18 Cermet insert and cutting tool equipped with same
CN202180071021.0A CN116348227A (en) 2020-10-21 2021-10-18 Cermet insert and cutting tool provided with same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020176779 2020-10-21
JP2020-176779 2020-10-21

Publications (1)

Publication Number Publication Date
WO2022085647A1 true WO2022085647A1 (en) 2022-04-28

Family

ID=81290850

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/038495 WO2022085647A1 (en) 2020-10-21 2021-10-18 Cermet insert and cutting tool equipped therewith

Country Status (3)

Country Link
JP (1) JP7483917B2 (en)
CN (1) CN116348227A (en)
WO (1) WO2022085647A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131803A (en) * 1988-11-11 1990-05-21 Mitsubishi Metal Corp Cutting tool made of abrasion resistant cermet excelling in chipping resistance
JPH05178666A (en) * 1991-05-24 1993-07-20 Sandvik Ab Sintered titanium carbonitride and preparation thereof
JPH08281503A (en) * 1995-04-12 1996-10-29 Sandvik Ab Cutting insert and production thereof
JP2012245581A (en) * 2011-05-26 2012-12-13 Mitsubishi Materials Corp Cutting insert made from surface coated titanium carbon nitride-based cermet, and method for manufacturing the same
WO2016189935A1 (en) * 2015-05-28 2016-12-01 京セラ株式会社 Cutting insert, cutting tool, and method for manufacturing cut workpieces

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220176463A1 (en) 2019-04-22 2022-06-09 Kyocera Corporation Insert and cutting tool including same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131803A (en) * 1988-11-11 1990-05-21 Mitsubishi Metal Corp Cutting tool made of abrasion resistant cermet excelling in chipping resistance
JPH05178666A (en) * 1991-05-24 1993-07-20 Sandvik Ab Sintered titanium carbonitride and preparation thereof
JPH08281503A (en) * 1995-04-12 1996-10-29 Sandvik Ab Cutting insert and production thereof
JP2012245581A (en) * 2011-05-26 2012-12-13 Mitsubishi Materials Corp Cutting insert made from surface coated titanium carbon nitride-based cermet, and method for manufacturing the same
WO2016189935A1 (en) * 2015-05-28 2016-12-01 京セラ株式会社 Cutting insert, cutting tool, and method for manufacturing cut workpieces

Also Published As

Publication number Publication date
CN116348227A (en) 2023-06-27
JP7483917B2 (en) 2024-05-15
JPWO2022085647A1 (en) 2022-04-28

Similar Documents

Publication Publication Date Title
EP1741505B1 (en) Tool of surface-coated cubic boron nitride sintered compact and process for producing the same
JP7128351B2 (en) Insert and cutting tool with same
US11027338B2 (en) Cutting insert, cutting tool, and method for manufacturing machined product
JP2001300813A (en) Ball end mill
JP4028368B2 (en) Surface coated cemented carbide cutting tool
WO2022085649A1 (en) Cermet insert and cutting tool comprising same
WO2022085647A1 (en) Cermet insert and cutting tool equipped therewith
WO2022085450A1 (en) Coated tool, and cutting tool provided with same
WO2022085429A1 (en) Coated tool and cutting tool provided with same
JP2002254204A (en) Surface-coated cemented carbide cutting tool having excellent surface lubricating property for chip
JP4900653B2 (en) Surface polishing method for throated surface-coated cermet with a hard coating layer that exhibits excellent chipping resistance in high-speed cutting
JP4883389B2 (en) Surface polishing method for throated surface-coated cermet with a hard coating layer that exhibits excellent chipping resistance in high-speed cutting
JP4888759B2 (en) Surface polishing method for cutting throwaway tip made of surface-covered cermet whose hard coating layer exhibits excellent chipping resistance in high-speed cutting
JP4873289B2 (en) Surface polishing method for throated surface-coated cermet with a hard coating layer that exhibits excellent chipping resistance in high-speed cutting
JP2007118157A (en) Non-hole surface-coated cermet throwaway cutting tip having hard coating layer exhibiting excellent chipping resistance in high speed cutting
JP2007125662A (en) Non-perforated surface coated cermet-made cutting throw-away chip having hard coated layer exhibiting excellent chipping resistance in high-speed cutting
JP4888762B2 (en) Surface polishing method for cutting throwaway tip made of surface-covered cermet whose hard coating layer exhibits excellent chipping resistance in high-speed cutting
JP2004074312A (en) Cutting tool
JP4853820B2 (en) Surface polishing method for throated surface-coated cermet with a hard coating layer that exhibits excellent chipping resistance in high-speed cutting
JP4888688B2 (en) Surface polishing method for cutting throwaway tip made of surface-covered cermet whose hard coating layer exhibits excellent chipping resistance in high-speed cutting
JPH05177414A (en) Throw-away tip and its covering method
JP2007125661A (en) Non-perforated surface coated cermet-made cutting throw-away chip having hard coated layer exhibiting excellent chipping resistance in high-speed cutting
JP2007111814A (en) Throwaway cutting tip of surface-coated cermet with hard coating layer achieving excellent anti-chipping performance in high-speed cutting work
JP2007118108A (en) Non-hole surface-coated cermet throwaway cutting tip having hard coating layer exhibiting excellent chipping resistance in high speed cutting
JP2000107909A (en) Surface coated cemented carbide cutting tool with hard coating layer exerting excellent chipping resistance

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21882788

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022557538

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21882788

Country of ref document: EP

Kind code of ref document: A1