WO2022082875A1 - 一种半导体激光器的封装结构 - Google Patents

一种半导体激光器的封装结构 Download PDF

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Publication number
WO2022082875A1
WO2022082875A1 PCT/CN2020/126883 CN2020126883W WO2022082875A1 WO 2022082875 A1 WO2022082875 A1 WO 2022082875A1 CN 2020126883 W CN2020126883 W CN 2020126883W WO 2022082875 A1 WO2022082875 A1 WO 2022082875A1
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Prior art keywords
heat dissipation
semiconductor laser
dissipation box
fixing
frame
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PCT/CN2020/126883
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English (en)
French (fr)
Inventor
张志平
张文华
王宁
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光华临港工程应用技术研发(上海)有限公司
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Publication of WO2022082875A1 publication Critical patent/WO2022082875A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling

Definitions

  • the invention relates to the technical field of semiconductor lasers, in particular to a packaging structure of a semiconductor laser.
  • Semiconductor lasers also known as laser diodes, are lasers that use semiconductor materials as working substances. Due to the differences in the material structure, the specific processes of different types of lasers are special. Commonly used working substances are gallium arsenide, cadmium sulfide, indium phosphide, zinc sulfide, etc.
  • the excitation methods include electric injection, electron beam excitation and optical pumping. Semiconductor laser devices can be divided into homojunction and single heterojunction. , double heterojunction, etc.
  • the temperature of the package structure of a semiconductor laser during operation has a significant impact on its threshold current density, slope efficiency, and spectral stability.
  • the purpose of the present invention is to provide a packaging structure of a semiconductor laser to solve the above-mentioned problems in the background art.
  • the present invention provides the following technical solutions: including a casing; a heat dissipation mechanism, and a radiating hole; one side of the casing is provided with a radiating hole; the heat dissipation mechanism includes a heat dissipation box, a cooling device, an exhaust fan, Frame, filter screen and ventilation holes, the bottom of the casing is movably plugged with a heat dissipation box, the bottom of the inner wall of the heat dissipation box is fixedly installed with an exhaust fan, and the inner wall of the heat dissipation box is away from the top of the exhaust fan.
  • a cooling device is connected, ventilation holes are opened at the bottoms of the side walls on both sides of the heat dissipation box, an installation frame is inserted into the inner thread of the ventilation hole, and a filter screen is fixedly welded between the inner walls of the installation frame;
  • the cooling device includes a water tank, a water replenishment hole, a fixing frame, a refrigerator, a water pump and a cooling pipe.
  • the inside of the fixing frame is provided with a cooling pipe, both ends of the cooling pipe penetrate the side wall of the water tank and extend to the interior of the water tank, a water pump is fixedly installed inside one side of the cooling pipe, and the water tank is away from one end of the fixing frame A water replenishment hole is opened, and a sealing plug is connected to the inside of the water replenishment hole, and a refrigerator is fixedly installed on the inner wall of the water tank; a heat conduction plate, a heat conduction plate is fixedly inserted on the top of the heat dissipation box;
  • the top surface of the board is fixedly welded with the semiconductor laser;
  • the fixing column, the bottom of the casing and on both sides of the heat dissipation box are fixedly welded with fixed columns;
  • the installation mechanism the surface of the heat dissipation box is fixed and installed on the outside of the casing
  • the installation mechanism is fixedly installed with the fixing column.
  • a drying device is fixedly installed on the inner wall of the heat dissipation box and away from the top of the cooling device, and the drying device includes a drying frame, a ventilation hole, a desiccant and a filter bag, and the drying frame and the heat dissipation box are movably plugged together,
  • the top and bottom of the drying frame are provided with several ventilation holes, the inner wall of the drying frame is bonded and connected with a filter bag, and the inside of the filter bag is filled with a desiccant.
  • the position corresponding to the drying device and the cooling device on one side of the inner wall of the heat-dissipating box is fixedly welded with the corresponding limiting seat.
  • a temperature sensor is fixedly installed on one side of the inner wall of the water tank, the temperature sensor is electrically connected with a control module, and the control module is electrically connected with a refrigerator.
  • control module is electrically connected with a power supply module, and the power supply module adopts an external power supply or a battery.
  • the fixing frame adopts the structure of a rectangular body with accommodating cavities open at both ends, and the cooling pipe has a serpentine structure inside the fixing frame.
  • the installation mechanism includes a fixed plate, a groove, a fixed rod, a bolt and a limit ring, a fixed plate is fixedly sleeved on the surface of the heat dissipation box and located outside the casing, and the interior of the fixed plate is located in the heat dissipation box.
  • Both sides of the box are movably plugged with the fixed column, and one end of the fixed column extending to the outside of the fixed plate is movably sleeved with a limit ring, and the inside of the fixed plate is provided with a groove for the limit ring, and the fixed column
  • There is a fixing rod inside the two ends of the fixing rod pass through the side wall of the fixing column and the side wall of the limit ring in sequence and extend to the outside of the limit ring, and the fixed rod extends to both ends of the outside of the limit ring Bolts are inserted into each thread.
  • the cross-section of the limiting ring has a U-shaped structure, and the groove adopts a rectangular structure.
  • a sealing ring is glued and connected on the top of the fixing plate and located between the heat dissipation box and the fixing column, and the bottom of the casing is provided with a limiting groove adapted to the sealing ring.
  • the heat-conducting plate absorbs the heat of the semiconductor laser.
  • the heat-conducting plate is made of insulating and heat-conducting materials to avoid mutual interference. Then start the exhaust fan, water pump and refrigerator.
  • the water pump can pump the water inside the water tank into the cooling pipe. , and then flow back to the inside of the water tank from the other end of the cooling pipe, and the water circulating inside the water tank can be cooled by the refrigerator, so as to avoid the temperature being too high and the effect of water cooling cannot be achieved.
  • It is pumped into the interior of the heat dissipation box, and then contacts the cooling pipe for heat exchange, so that the heat-exchanged cold air contacts the heat-conducting plate, which can speed up the cooling speed of the heat-conducting plate.
  • the cold air can be dried. Due to the moisture generated when the air contacts the cooling pipe, the humidity is high and the service life of the semiconductor laser is easily affected. Dry the gas , which can further improve the service life of the semiconductor laser.
  • Fig. 1 is the overall structure schematic diagram of the present invention
  • Fig. 2 is the structural schematic diagram of the cooling device of the present invention.
  • Fig. 3 is the structural schematic diagram of the drying device of the present invention.
  • FIG. 4 is a schematic diagram of the connection structure of the drying device, the cooling device and the heat dissipation box of the present invention
  • Fig. 5 is the enlarged schematic diagram of the structure at place A in Fig. 1 of the present invention.
  • Fig. 6 is the enlarged structural schematic diagram at B in Fig. 1 of the present invention.
  • FIG. 7 is a schematic diagram of the system structure of the present invention.
  • the present invention provides a technical solution: a packaging structure of a semiconductor laser, a casing 1; an emission hole 2, a side of the casing 1 is provided with an emission hole 2; a heat dissipation mechanism 3, the The heat dissipation mechanism 3 includes a heat dissipation box 31, a cooling device 33, an exhaust fan 34, a mounting frame 36, a filter screen 37 and a ventilation hole 38.
  • the bottom of the housing 1 is movably plugged with a heat dissipation box 31.
  • An exhaust fan 34 is fixedly installed at the center of the bottom of the inner wall, and a cooling device 33 is movably plugged into the inner wall of the heat dissipation box 31 and away from the top of the exhaust fan 34, and ventilation holes are opened at the bottom of the side walls on both sides of the heat dissipation box 31. 38.
  • An installation frame 36 is inserted into the internal thread of the ventilation hole 38, and a filter screen 37 is fixedly welded between the inner walls of the installation frame 36;
  • the cooling device 33 includes a water tank 331, a water replenishing hole 332,
  • the fixing frame 333 , the refrigerator 334 , the water pump 336 and the cooling pipe 337 , the fixing frame 333 is fixedly installed on one side of the water tank 331 , and the fixing frame 333 is movably plugged with the cooling box 31 .
  • a cooling pipe 337 is provided inside. Both ends of the cooling pipe 337 penetrate the side wall of the water tank 331 and extend to the interior of the water tank 331.
  • a water pump 336 is fixedly installed on one side of the cooling pipe 337, and the water tank 331 is far away from the water tank 331.
  • One end of the fixing frame 333 is provided with a water replenishing hole 332, a sealing plug is connected to the inside of the water replenishing hole 332, and a refrigerator 334 is fixedly installed on the inner wall of the water tank 331;
  • a heat-conducting plate 5 is connected; the semiconductor laser 4 is fixedly welded with the semiconductor laser 4 on the top surface of the heat-conducting plate 5; 6; the installation mechanism 7, the surface of the heat dissipation box 31 is fixedly installed with the installation mechanism 7 outside the casing 1, the installation mechanism 7 is fixedly installed with the fixing column 6, and the heat conduction plate 5 absorbs the heat of the semiconductor laser 4 , the heat-conducting plate 5 is made of insulating and heat-conducting materials to avoid mutual interference, and then start the exhaust fan 34, the water pump 336 and the refrigerator 334.
  • the water pump 336 can pump the water inside the water tank 331 into the cooling pipe 337, and then start the cooling pipe 337.
  • the other end of the cooling pipe 337 flows back to the inside of the water tank 331 , and the water circulating in the water tank 331 can be cooled by the refrigerator 334 to avoid the temperature being too high and the effect of water cooling cannot be achieved.
  • After filtering it is pumped into the interior of the heat dissipation box 31, and then contacted with the cooling pipe 337 to exchange heat, so that the cold air after heat exchange is in contact with the heat-conducting plate 5, which can speed up the cooling speed of the heat-conducting plate 5.
  • the semiconductor laser 4 can be rapidly cooled, and the service life of the semiconductor laser 4 can be effectively prolonged.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • a drying device 32 is fixedly installed on the inner wall of the heat dissipation box 31 and away from the top of the cooling device 33, and the drying device 32 includes a drying frame 321, a ventilation hole 322, a desiccant 323 and a filter A bag 324, the drying frame 321 and the heat dissipation box 31 are movably plugged, the top and bottom of the drying frame 321 are provided with several ventilation holes 322, and the inner wall of the drying frame 321 is bonded and connected with a filter bag 324, The inside of the filter bag 324 is filled with a desiccant 323, and the corresponding position of the drying device 32 and the cooling device 33 on one side of the inner wall of the heat dissipation box 31 is fixed and welded with the corresponding limit seat 35.
  • a drying device 32 is installed between the cooling device 33 and the heat-conducting plate 5, which can dry the cold air. Since the air is in contact with the cooling pipe 337, water vapor is generated, resulting in high humidity, which easily affects the service life of the semiconductor laser 4. Drying can further improve the service life of the semiconductor laser 4 , and the installation stability of the drying device 32 and the cooling device 33 can be increased through the limiting seat 35 .
  • a temperature sensor 335 is fixedly installed on one side of the inner wall of the water tank 331 , the temperature sensor 335 is electrically connected to the control module 8 , and the control module 8 is electrically connected to the refrigerator 334 , the control module 8 is electrically connected with a power supply module 9, the power supply module 9 adopts an external power supply or a battery, and the power supply module 8 provides power for the entire device, and the fixing frame 333 adopts a rectangular shape with accommodating cavities open at both ends.
  • the cooling pipe 337 has a serpentine structure inside the fixed frame 333, and the cooling pipe 337 has a serpentine structure, which can increase the contact area, thereby improving the heat exchange efficiency.
  • the control module 8 may include at least one The circuit including the processor may also be a circuit including at least one single-chip microcomputer, or may be a combination of multiple circuits or chips, as long as the corresponding functions can be realized. It can be understood that for those skilled in the art, the control module 8 can also be a common circuit composed of amplifiers, comparators, triodes, MOS tubes, etc. to achieve corresponding functions in a purely hardware manner, and the temperature sensor 335 can detect the water tank.
  • the control module 8 can transmit a signal to the refrigerator 334, and the refrigerator 334 is turned off, which can effectively prevent the refrigerator 334 from working all the time. of energy saving.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • the installation mechanism 7 includes a fixed plate 71, a groove 72, a fixed rod 73, a bolt 74 and a limit ring 75.
  • the surface of the heat dissipation box 31 is located outside the casing 1 and is fixedly sleeved with the fixed plate 71.
  • the inside of the fixed plate 71 is located on both sides of the heat dissipation box 31 and is movably plugged with the fixed column 6 .
  • the groove 72 of the limiting ring 75 is adapted, and the fixing rod 73 is provided inside the fixing column 6.
  • the groove 72 adopts a rectangular structure, the top of the fixed plate 71 is located between the heat dissipation box 31 and the fixed column 6 and is bonded and connected with a sealing ring, and the bottom of the housing 1 is provided with a sealing ring to match.
  • the limit groove can improve the sealing performance and avoid the entry of dust.
  • the bolt 74 is unscrewed from one end of the fixing rod 73, and then the fixing rod is screwed out. 73 is pulled out, so that the fixing rod 73 is separated from the fixing column 6, and the operation is repeated on the other side, and then the casing 1 is moved upward, so that the fixing column 6 at the bottom of the casing 1 can be separated from the fixing plate 71, so that the semiconductor laser 4 can be carried out.
  • the quick removal is convenient for the repair and maintenance of the semiconductor laser 4, and can effectively avoid the problem of opening threaded grooves in the interior of the fixing column 6 or the heat dissipation box 31.
  • the heat-conducting plate 5 absorbs the heat of the semiconductor laser 4, and the heat-conducting plate 5 is made of insulating and heat-conducting materials to avoid mutual interference, and then starts the exhaust fan 34, the water pump 336 and the refrigerator 334, and the water pump 336 can be used.
  • the water in the water tank 331 is pumped into the cooling pipe 337, and then flows back to the water tank 331 from the other end of the cooling pipe 337.
  • the water circulating in the water tank 331 can be cooled by the refrigerator 334 to avoid the temperature being too high. The effect of water cooling cannot be achieved.
  • the exhaust fan 34 filters the external air through the filter screen 37 and then draws it into the interior of the heat dissipation box 31, and then contacts the cooling pipe 337 for heat exchange, so that the heat-exchanged cold air is dried by the drying device 32.
  • Contact with the heat-conducting plate 5 can speed up the cooling speed of the heat-conducting plate 5 .

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种半导体激光器(4)的封装结构，包括，壳体(1)；散热机构(3)，发射孔(2)，所述壳体(1)的一侧开设有发射孔(2)；所述散热机构(3)包括散热箱(31)、冷却装置(33)、抽风机(34)、安装框(36)、过滤网(37)和通风孔(38)，所述壳体(1)的底部活动插接有散热箱(31)，所述散热箱(31)的内壁底部居中处固定安装有抽风机(34)，所述散热箱(31)的内壁并远离抽风机(34)的顶部活动插接有冷却装置(33)，所述散热箱(31)的两侧侧壁的底部均开设有通风孔(38)，所述通风孔(38)的内部螺纹插接有安装框(36)。所述封装结构有效的解决了现有半导体激光器(4)在工作时的温度对其阀值电流密度、斜率效率和光谱稳定性等有显著的影响，发光区过热会导致发光区腔面损伤甚至是器件退化，最终造成器件失效的问题。

Description

一种半导体激光器的封装结构 技术领域
本发明涉及半导体激光器技术领域，具体为一种半导体激光器的封装结构。
 背景技术
半导体激光器又称激光二极管，是用半导体材料作为工作物质的激光器。由于物质结构上的差异，不同种类产生激光的具体过程比较特殊。常用工作物质有砷化镓、硫化镉、磷化铟、硫化锌等，激励方式有电注入、电子束激励和光泵浦三种形式，半导体激光器件，可分为同质结、单异质结、双异质结等几种。
 技术问题
但是，传统的在使用过程中存在一些弊端，比如：
半导体激光器的封装结构在工作时的温度对其阀值电流密度、斜率效率和光谱稳定性等有显著的影响，发光区过热会导致发光区腔面损伤甚至是器件退化，最终造成器件失效。
 技术解决方案
本发明的目的在于提供一种半导体激光器的封装结构，以解决上述背景技术中提出的问题。
为实现上述目的，本发明提供如下技术方案：包括，壳体；散热机构，发射孔，所述壳体的一侧开设有发射孔；所述散热机构包括散热箱、冷却装置、抽风机、安装框、过滤网和通风孔，所述壳体的底部活动插接有散热箱，所述散热箱的内壁底部居中处固定安装有抽风机，所述散热箱的内壁并远离抽风机的顶部活动插接有冷却装置，所述散热箱的两侧侧壁的底部均开设有通风孔，所述通风孔的内部螺纹插接有安装框，所述安装框的内壁之间固定焊接有过滤网；冷却装置，所述冷却装置包括水箱、补水孔、固定框、制冷器、水泵和冷却管，所述水箱的一侧固定安装有固定框，所述固定框与散热箱之间活动插接，所述固定框的内部设置有冷却管，所述冷却管的两端均贯穿水箱的侧壁并延伸至水箱的内部，所述冷却管的一侧内部固定安装有水泵，所述水箱远离固定框的一端开设有补水孔，所述补水孔的内部配合连接有密封塞，所述水箱的内壁固定安装有制冷器；导热板，所述散热箱的顶部固定插接有导热板；半导体激光器，所述导热板的顶部表面固定焊接有半导体激光器；固定柱，所述壳体的底部并位于散热箱的两侧均固定焊接有固定柱；安装机构，所述散热箱的表面并位于壳体的外部固定安装有安装机构，所述安装机构与固定柱固定安装。
其中，所述散热箱的内壁并远离冷却装置的顶部固定安装有干燥装置，所述干燥装置包括干燥框、通气孔、干燥剂和过滤袋，所述干燥框与散热箱之间活动插接，所述干燥框的顶部和底部均开设有若干通气孔，所述干燥框的内壁粘合连接有过滤袋，所述过滤袋的内部填充有干燥剂。
其中，所述散热箱的内壁一侧与干燥装置和冷却装置相对应的位置均固定焊接与之相适配的限位座。
其中，所述水箱的内壁一侧固定安装有温度传感器，所述温度传感器电性连接有控制模块，所述控制模块电性连接有制冷器。
其中，所述控制模块电性连接有供电模块，所述供电模块采用外接电源或蓄电池。
其中，所述固定框采用两端开口的具有容纳空腔的矩形体的结构，并且所述冷却管在固定框的内部呈蛇形的结构。
其中，所述安装机构包括固定盘、凹槽、固定杆、螺栓和限位环，所述散热箱的表面并位于壳体的外部固定套接有固定盘，所述固定盘的内部并位于散热箱的两侧与固定柱活动插接，所述固定柱延伸至固定盘外部的一端活动套接有限位环，所述固定盘的内部开设有限位环相适配的凹槽，所述固定柱的内部设置有固定杆，所述固定杆的两端依次贯穿固定柱的侧壁和限位环的侧壁并延伸至限位环的外部，所述固定杆延伸至限位环外部的两端均螺纹插接有螺栓。
其中，所述限位环的截面呈U型的结构，并且所述凹槽的采用矩形体的结构。
其中，所述固定盘的顶部并位于散热箱与固定柱之间粘合连接有密封圈，并且所述壳体的底部开设有与密封圈相适配的限位槽。
 有益效果
与现有技术相比，本发明的有益效果是：
1、导热板将半导体激光器的热量进行吸收，导热板采用绝缘导热的材料制成，避免相互干扰，然后启动抽风机、水泵和制冷器，水泵可以将水箱内部的水抽入到冷却管的内部，然后在从冷却管的另外一端流回水箱的内部，通过制冷器可以将水箱内部循环的水进行降温，避免温度过高起不到水冷的效果，抽风机将外部的空气通过滤网过滤后抽入散热箱的内部，然后与冷却管接触换热，使得经过换热的冷空气与导热板接触，可以加快导热板的冷却速度，通过风冷和水冷相结合，从而可以将半导体激光器进行快速的降温，可以有效的延长半导体激光器的使用寿命。
2、通过在冷却装置与导热板之间安装干燥装置，可以将冷空气进行干燥，由于空气与冷却管接触时产生水汽，从而造成湿度较大，容易影响半导体激光器的使用寿命，将气体进行干燥，可以进一步的提高半导体激光器的使用寿命。
3、当半导体激光器需要检修和维修时，将螺栓从固定杆的一端拧出，然后将固定杆抽出，使得固定杆与固定柱分离，重复操作另外一侧，然后将壳体向上移动，使得壳体底部的固定柱与固定盘可以脱离，从而可以将半导体激光器进行快速的拆除，便于半导体激光器的检修和维修，可以有效的避免在固定柱或者散热箱的内部开设螺纹槽，当拆卸或安装时螺纹槽容易造成损坏，不便于更换的问题。
 附图说明
图1为本发明整体结构示意图；
图2为本发明冷却装置的结构示意图；
图3为本发明干燥装置的结构示意图；
图4为本发明干燥装置、冷却装置和散热箱的连接结构示意图；
图5为本发明图1中A处放大结构示意图；
图6为本发明图1中B处放大结构示意图；
图7为本发明***结构示意图。
图中：1-壳体；2-发射孔；3-散热机构；31-散热箱；32-干燥装置；321-干燥框；322-通气孔；323-干燥剂；324-过滤袋；33-冷却装置；331-水箱；332-补水孔；333-固定框；334-制冷器；335-温度传感器；336-水泵；337-冷却管；34-抽风机；35-限位座；36-安装框；37-过滤网；38-通风孔；4-半导体激光器；5-导热板；6-固定柱；7-安装机构；71-固定盘；72-凹槽；73-固定杆；74-螺栓；75-限位环；8-控制模块；9-供电模块。
 本发明的最佳实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例一：
请参阅图1-4，本发明提供一种技术方案：一种半导体激光器的封装结构，壳体1；发射孔2，所述壳体1的一侧开设有发射孔2；散热机构3，所述散热机构3包括散热箱31、冷却装置33、抽风机34、安装框36、过滤网37和通风孔38，所述壳体1的底部活动插接有散热箱31，所述散热箱31的内壁底部居中处固定安装有抽风机34，所述散热箱31的内壁并远离抽风机34的顶部活动插接有冷却装置33，所述散热箱31的两侧侧壁的底部均开设有通风孔38，所述通风孔38的内部螺纹插接有安装框36，所述安装框36的内壁之间固定焊接有过滤网37；冷却装置33，所述冷却装置33包括水箱331、补水孔332、固定框333、制冷器334、水泵336和冷却管337，所述水箱331的一侧固定安装有固定框333，所述固定框333与散热箱31之间活动插接，所述固定框333的内部设置有冷却管337，所述冷却管337的两端均贯穿水箱331的侧壁并延伸至水箱331的内部，所述冷却管337的一侧内部固定安装有水泵336，所述水箱331远离固定框333的一端开设有补水孔332，所述补水孔332的内部配合连接有密封塞，所述水箱331的内壁固定安装有制冷器334；导热板5，所述散热箱31的顶部固定插接有导热板5；半导体激光器4，所述导热板5的顶部表面固定焊接有半导体激光器4；固定柱6，所述壳体1的底部并位于散热箱31的两侧均固定焊接有固定柱6；安装机构7，所述散热箱31的表面并位于壳体1的外部固定安装有安装机构7，所述安装机构7与固定柱6固定安装，导热板5将半导体激光器4的热量进行吸收，导热板5采用绝缘导热的材料制成，避免相互干扰，然后启动抽风机34、水泵336和制冷器334，水泵336可以将水箱331内部的水抽入到冷却管337的内部，然后在从冷却管337的另外一端流回水箱331的内部，通过制冷器334可以将水箱331内部循环的水进行降温，避免温度过高起不到水冷的效果，抽风机34将外部的空气通过滤网37过滤后抽入散热箱31的内部，然后与冷却管337接触换热，使得经过换热的冷空气与导热板5接触，可以加快导热板5的冷却速度，通过风冷和水冷相结合，从而可以将半导体激光器4进行快速的降温，可以有效的延长半导体激光器4的使用寿命。
 本发明的实施方式
实施例二：
作为实施例一的一种优选方案，所述散热箱31的内壁并远离冷却装置33的顶部固定安装有干燥装置32，所述干燥装置32包括干燥框321、通气孔322、干燥剂323和过滤袋324，所述干燥框321与散热箱31之间活动插接，所述干燥框321的顶部和底部均开设有若干通气孔322，所述干燥框321的内壁粘合连接有过滤袋324，所述过滤袋324的内部填充有干燥剂323，所述散热箱31的内壁一侧与干燥装置32和冷却装置33相对应的位置均固定焊接与之相适配的限位座35，通过在冷却装置33与导热板5之间安装干燥装置32，可以将冷空气进行干燥，由于空气与冷却管337接触时产生水汽，从而造成湿度较大，容易影响半导体激光器4的使用寿命，将气体进行干燥，可以进一步的提高半导体激光器4的使用寿命，通过限位座35，增加干燥装置32和冷却装置33安装的稳定性。
实施例三：
作为实施例一的一种优选方案，所述水箱331的内壁一侧固定安装有温度传感器335，所述温度传感器335电性连接有控制模块8，所述控制模块8电性连接有制冷器334，所述控制模块8电性连接有供电模块9，所述供电模块9采用外接电源或蓄电池，供电模块8为整个装置提供动力，所述固定框333采用两端开口的具有容纳空腔的矩形体的结构，并且所述冷却管337在固定框333的内部呈蛇形的结构，冷却管337呈蛇形的结构，可以增加接触面积，从而提高换热效率，控制模块8可以是包括至少一个处理器在内的电路，还可以是包括至少一个单片机在内的电路，也可以为多种电路或者芯片的组合形式，只要可以实现相应功能即可。可以理解的是，对于本领域技术人员来说，控制模块8还可以为常见的由放大器、比较器、三极管、MOS管等组合起来的电路以纯粹硬件方式实现相应功能，温度传感器335可以检测水箱31内部水的温度，当温度传感器335检测到水箱31内部的温度数值大于控制模块8设定的数值时，控制模块8将信号传递给制冷器334，启动制冷器334启动，当温度传感器335检测到水箱31内部的水温的数值低于控制模块8设定的数值时，控制模块8可以将信号传递给制冷器334，制冷器334关闭，可以有效的避免制冷器334一直处于工作的状态，有效的节约能源。
实施例四：
所述安装机构7包括固定盘71、凹槽72、固定杆73、螺栓74和限位环75，所述散热箱31的表面并位于壳体1的外部固定套接有固定盘71，所述固定盘71的内部并位于散热箱31的两侧与固定柱6活动插接，所述固定柱6延伸至固定盘71外部的一端活动套接有限位环75，所述固定盘71的内部开设有限位环75相适配的凹槽72，所述固定柱6的内部设置有固定杆73，所述固定杆73的两端依次贯穿固定柱6的侧壁和限位环75的侧壁并延伸至限位环75的外部，所述固定杆73延伸至限位环75外部的两端均螺纹插接有螺栓74，所述限位环75的截面呈U型的结构，并且所述凹槽72的采用矩形体的结构，所述固定盘71的顶部并位于散热箱31与固定柱6之间粘合连接有密封圈，并且所述壳体1的底部开设有与密封圈相适配的限位槽，可以提高密封性能，避免灰尘进入，半导体激光器4需要检修、维修时、更换干燥装置或将水箱331内部补水时，将螺栓74从固定杆73的一端拧出，然后将固定杆73抽出，使得固定杆73与固定柱6分离，重复操作另外一侧，然后将壳体1向上移动，使得壳体1底部的固定柱6与固定盘71可以脱离，从而可以将半导体激光器4进行快速的拆除，便于半导体激光器4的检修和维修，可以有效的避免在固定柱6或者散热箱31的内部开设螺纹槽，当拆卸或安装时螺纹槽容易造成损坏，不便于更换的问题。
工作原理：在使用时，导热板5将半导体激光器4的热量进行吸收，导热板5采用绝缘导热的材料制成，避免相互干扰，然后启动抽风机34、水泵336和制冷器334，水泵336可以将水箱331内部的水抽入到冷却管337的内部，然后在从冷却管337的另外一端流回水箱331的内部，通过制冷器334可以将水箱331内部循环的水进行降温，避免温度过高起不到水冷的效果，抽风机34将外部的空气通过滤网37过滤后抽入散热箱31的内部，然后与冷却管337接触换热，使得经过换热的冷空气通过干燥装置32干燥后与导热板5接触，可以加快导热板5的冷却速度，通过风冷和水冷相结合，从而可以将半导体激光器4进行快速的降温，可以有效的延长半导体激光器4的使用寿命。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。

Claims (9)

  1. 一种半导体激光器的封装结构，其特征在于，包括：
    壳体（1）；
    发射孔（2），所述壳体（1）的一侧开设有发射孔（2）；
    散热机构（3），所述散热机构（3）包括散热箱（31）、冷却装置（33）、抽风机（34）、安装框（36）、过滤网（37）和通风孔（38），所述壳体（1）的底部活动插接有散热箱（31），所述散热箱（31）的内壁底部居中处固定安装有抽风机（34），所述散热箱（31）的内壁并远离抽风机（34）的顶部活动插接有冷却装置（33），所述散热箱（31）的两侧侧壁的底部均开设有通风孔（38），所述通风孔（38）的内部螺纹插接有安装框（36），所述安装框（36）的内壁之间固定焊接有过滤网（37）；
    冷却装置（33），所述冷却装置（33）包括水箱（331）、补水孔（332）、固定框（333）、制冷器（334）、水泵（336）和冷却管（337），所述水箱（331）的一侧固定安装有固定框（333），所述固定框（333）与散热箱（31）之间活动插接，所述固定框（333）的内部设置有冷却管（337），所述冷却管（337）的两端均贯穿水箱（331）的侧壁并延伸至水箱（331）的内部，所述冷却管（337）的一侧内部固定安装有水泵（336），所述水箱（331）远离固定框（333）的一端开设有补水孔（332），所述补水孔（332）的内部配合连接有密封塞，所述水箱（331）的内壁固定安装有制冷器（334）；
    导热板（5），所述散热箱（31）的顶部固定插接有导热板（5）；
    半导体激光器（4），所述导热板（5）的顶部表面固定焊接有半导体激光器（4）；
    固定柱（6），所述壳体（1）的底部并位于散热箱（31）的两侧均固定焊接有固定柱（6）；
    安装机构（7），所述散热箱（31）的表面并位于壳体（1）的外部固定安装有安装机构（7），所述安装机构（7）与固定柱（6）固定安装。
  2. 根据权利要求1所述的一种半导体激光器的封装结构，其特征在于：所述散热箱（31）的内壁并远离冷却装置（33）的顶部固定安装有干燥装置（32），所述干燥装置（32）包括干燥框（321）、通气孔（322）、干燥剂（323）和过滤袋（324），所述干燥框（321）与散热箱（31）之间活动插接，所述干燥框（321）的顶部和底部均开设有若干通气孔（322），所述干燥框（321）的内壁粘合连接有过滤袋（324），所述过滤袋（324）的内部填充有干燥剂（323）。
  3. 根据权利要求1所述的一种半导体激光器的封装结构，其特征在于：所述散热箱（31）的内壁一侧与干燥装置（32）和冷却装置（33）相对应的位置均固定焊接与之相适配的限位座（35）。
  4. 根据权利要求1所述的一种半导体激光器的封装结构，其特征在于：所述水箱（331）的内壁一侧固定安装有温度传感器（335），所述温度传感器（335）电性连接有控制模块（8），所述控制模块（8）电性连接有制冷器（334）。
  5. 根据权利要求4所述的一种半导体激光器的封装结构，其特征在于：所述控制模块（8）电性连接有供电模块（9），所述供电模块（9）采用外接电源或蓄电池。
  6. 根据权利要求1所述的一种半导体激光器的封装结构，其特征在于：所述固定框（333）采用两端开口的具有容纳空腔的矩形体的结构，并且所述冷却管（337）在固定框（333）的内部呈蛇形的结构。
  7. 根据权利要求1所述的一种半导体激光器的封装结构，其特征在于：所述安装机构（7）包括固定盘（71）、凹槽（72）、固定杆（73）、螺栓（74）和限位环（75），所述散热箱（31）的表面并位于壳体（1）的外部固定套接有固定盘（71），所述固定盘（71）的内部并位于散热箱（31）的两侧与固定柱（6）活动插接，所述固定柱（6）延伸至固定盘（71）外部的一端活动套接有限位环（75），所述固定盘（71）的内部开设有限位环（75）相适配的凹槽（72），所述固定柱（6）的内部设置有固定杆（73），所述固定杆（73）的两端依次贯穿固定柱（6）的侧壁和限位环（75）的侧壁并延伸至限位环（75）的外部，所述固定杆（73）延伸至限位环（75）外部的两端均螺纹插接有螺栓（74）。
  8. 根据权利要求7所述的一种半导体激光器的封装结构，其特征在于：所述限位环（75）的截面呈U型的结构，并且所述凹槽（72）的采用矩形体的结构。
  9. 根据权利要求7所述的一种半导体激光器的封装结构，其特征在于：所述固定盘（71）的顶部并位于散热箱（31）与固定柱（6）之间粘合连接有密封圈，并且所述壳体（1）的底部开设有与密封圈相适配的限位槽。
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