WO2022068905A1 - 电子设备 - Google Patents
电子设备 Download PDFInfo
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- WO2022068905A1 WO2022068905A1 PCT/CN2021/121835 CN2021121835W WO2022068905A1 WO 2022068905 A1 WO2022068905 A1 WO 2022068905A1 CN 2021121835 W CN2021121835 W CN 2021121835W WO 2022068905 A1 WO2022068905 A1 WO 2022068905A1
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- WIPO (PCT)
- Prior art keywords
- millimeter
- integrated circuit
- circuit carrier
- carrier board
- electronic device
- Prior art date
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- 239000002184 metal Substances 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 69
- 238000004891 communication Methods 0.000 claims abstract description 59
- 230000005855 radiation Effects 0.000 claims description 20
- 239000012811 non-conductive material Substances 0.000 claims description 3
- 239000000523 sample Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000001413 cellular effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
Definitions
- the present application belongs to the field of communication technologies, and specifically relates to an electronic device.
- millimeter wave antennas are gradually applied to smaller electronic devices, such as mobile phones, notebook computers, and the like.
- mmWave antennas are usually arranged in electronic devices in the form of an independent module.
- the millimeter-wave antenna and the non-millimeter-wave antenna eg, cellular antenna, non-cellular antenna, etc.
- the electronic devices are often provided with metal casings, thereby further limiting the effective radiation space in the electronic devices.
- a groove is formed on the outside of the metal shell, the radiating sheet of the millimeter-wave antenna is arranged in the groove, and the carrier board carrying the radio frequency module is attached to the groove. the inner side of the metal shell, so that the radiation needle passing through the metal shell communicates with the radiation sheet and the radio frequency module, wherein the carrier board carrying the radio frequency module extends along the thickness direction of the electronic device.
- the installation space in the thickness direction of the electronic equipment becomes smaller and smaller, and the carrier board extending along the thickness direction of the electronic equipment in the related art will occupy the display screen, the earpiece, the camera and other devices This reduces the screen-to-body ratio of electronic devices.
- the purpose of the embodiments of the present application is to provide an electronic device, which can solve the problem of reducing the screen ratio of the electronic device in the antenna structure in the related art.
- the embodiment of the present application provides an electronic device, including:
- the metal shell is provided with N grooves arranged at intervals, the bottom of the groove is provided with a through hole, and the N is an integer greater than 1;
- the millimeter-wave antenna module includes: a millimeter-wave radio frequency module and N millimeter-wave antenna units corresponding to the N grooves, and each of the millimeter-wave antenna units includes a feeding needle and a connection with the feeding needle. a radiator connected to the first end, the radiators are respectively disposed in the corresponding grooves and insulated from the metal shell, and the feeding needles are disposed through the through holes of the grooves;
- An integrated circuit carrier board, the integrated circuit carrier board and the millimeter wave antenna unit are respectively located on opposite sides of the metal casing, the millimeter wave radio frequency module is arranged on the integrated circuit carrier board, and the The integrated circuit carrier board is provided with N communication lines respectively connected with the feeding pins of the N millimeter wave antenna units, and the first ends of the N communication lines are respectively connected with the millimeter wave radio frequency module. connected, the second end of the communication line is exposed on the integrated circuit carrier board, and the second end of the feed pin extends along the surface of the integrated circuit carrier board and abuts against the integrated circuit carrier board are electrically connected to the second ends of the communication lines respectively.
- the millimeter-wave antenna unit and the integrated circuit carrier board are respectively arranged on opposite sides of the metal casing, so that the millimeter-wave antenna unit is located outside the metal casing and is not shielded by the signal of the metal casing.
- set the millimeter wave radio frequency module on the integrated circuit carrier board and expose the second end of the communication line in the integrated circuit carrier board, so that the feeding needle penetrating the metal shell can be along the surface of the integrated circuit carrier board Extend and connect the radiator and the millimeter-wave radio frequency module when in contact with the exposed communication lines, so that the integrated circuit carrier board can be extended in the direction perpendicular to the thickness of the electronic device, thereby reducing the millimeter-wave antenna unit in the electronic device.
- the space occupied in the thickness direction is convenient for setting the display screen, so as to increase the screen ratio of the electronic device.
- FIG. 1 is a front view of an electronic device provided by an embodiment of the present application.
- FIG. 2 is a top view of an electronic device provided by an embodiment of the present application.
- FIG. 3 is a structural diagram of an electronic device provided by an embodiment of the present application.
- FIG. 4 is a structural diagram of a radiator and a groove in an electronic device provided by an embodiment of the present application.
- FIG. 5 is a structural diagram of a feeding needle and a groove in an electronic device provided by an embodiment of the present application.
- FIG. 6 is a structural diagram of a feeding needle and a groove in another electronic device provided by an embodiment of the present application.
- FIG. 7 is one of the structural diagrams of a millimeter wave antenna module and an integrated circuit carrier board in an electronic device provided by an embodiment of the present application;
- FIG. 8 is the second structural diagram of a millimeter wave antenna module and an integrated circuit carrier board in an electronic device provided by an embodiment of the present application.
- FIG. 1 is a front view of an electronic device provided by an embodiment of the present application
- FIG. 2 is a top view of an electronic device provided by an embodiment of the present application
- FIG. 3 is an embodiment of the present application
- FIG. 4 is a structural diagram of a radiator and a groove in an electronic device provided by an embodiment of the present application.
- the electronic device provided by the embodiment of the present application includes: a metal casing 1 , a millimeter-wave antenna module 2 and an integrated circuit carrier board 3 .
- the metal casing 1 is provided with N grooves 11 arranged at intervals.
- the grooves 11 may be formed by concave in the direction from the outer surface side to the inner surface side of the metal casing 1 , and the grooves 11 There are through holes 111 at the bottom of the grooves, and the N is an integer greater than 1;
- Each millimeter-wave antenna unit 22 includes a feeding pin 221 and a radiator 222 connected to the first end of the feeding pin 221.
- the radiating body 222 is respectively disposed in the corresponding groove 11 and is insulated from the metal shell 1.
- the electric needle 221 is disposed through the through hole 111 of the groove 11; the integrated circuit carrier board 3 and the millimeter wave antenna unit 22 are respectively located on opposite sides of the metal casing 1, and the millimeter wave radio frequency module 21 is disposed on the integrated circuit
- the carrier board 3 and the integrated circuit carrier board 3 are provided with N communication wires 31 correspondingly connected to the feeding pins 221 of the N millimeter wave antenna units 22, and the first ends of the N communication wires 31 are respectively connected to the millimeter wave antenna.
- the radio frequency module 21 is connected, the second end of the communication wire 31 is exposed on the integrated circuit carrier board 3 , and the second end of the feed pin 221 extends along the surface of the integrated circuit carrier board 3 and abuts against the integrated circuit carrier board 3 , so as to be electrically connected to the second ends of the communication wires 31 respectively.
- the above-mentioned metal casing 1 may be a metal frame or a metal back cover of an electronic device.
- the drawings in the embodiments of the present application only take the above-mentioned metal casing 1 as an example of a metal frame of an electronic device for illustration. Specifically, the metal casing 1 is defined as a metal frame.
- the plane where the integrated circuit carrier 3 is located can be perpendicular to the thickness direction of the electronic device, which is conducive to setting a full screen on a thinner electronic device, etc. Increase the screen-to-body ratio of electronic devices.
- the electronic device includes a first side surface and a second side surface opposite to each other, and the display screen of the electronic device is located on the first side surface;
- the distance between the integrated circuit carrier board 3 and the first side surface is greater than the distance between the integrated circuit carrier board 3 and the second side surface.
- the plane on which the above-mentioned integrated circuit carrier board 3 is located is perpendicular to the thickness direction of the electronic device, and is disposed away from the side of the electronic device where the display screen is arranged, so as to facilitate the installation space of the display screen and avoid the need to install the display screen on the display screen. Holes are dug up or a non-display area is provided for assembling the integrated circuit carrier board 3 .
- the integrated circuit carrier board 3 can be set in the middle position between the two display screens, so that the integrated circuit carrier board 3 can be placed in the middle of the two display screens. Set the display screen separately on the side.
- the integrated circuit carrier board 3 can be sandwiched between the camera module and the display screen, so that the camera module can be set on a thinner electronic device.
- the integrated circuit carrier board 3 sandwiched between the camera module and the display screen is relatively thin, and does not occupy too much area of the display screen, so that the screen ratio of the electronic device can also be improved.
- the above-mentioned N millimeter-wave antenna units 22 corresponding to the N grooves 11 can be understood as the grooves 11 and the millimeter-wave antenna units 22 are in one-to-one correspondence, and the millimeter-wave antenna units 22 are arranged in the corresponding grooves 11 , as shown in FIG. 4 , each groove 11 is provided with a millimeter-wave antenna unit 22 , and the feeding needle 221 of the millimeter-wave antenna unit 22 is disposed through the through hole 111 in the groove 11 .
- the above-mentioned integrated circuit carrier board 3 is also connected to the main board 4 in the electronic device to perform data interaction with modules such as processors on the main board 4 .
- the integrated circuit carrier board 3 may further include an The first interface (not shown) to which the millimeter wave radio frequency module 21 is connected, the main board 4 of the electronic device is provided with a second interface matching the first interface, and the first interface is connected to the first interface. Two interface matching connection.
- the main board 4 in the electronic device is used as the reference ground for the antenna, and the metal casing 1 can be at least partially connected to the main board 4. Specifically, if the metal casing 1 is the metal casing 1 of the electronic device, the There is a gap between one side connected to the integrated circuit carrier board 3 and the metal case 1 , and the other side of the main board 4 is connected to the metal case 1 .
- the integrated circuit carrier board 3 can be arranged in parallel with the display surface of the electronic device. After the feed pin 221 passes through the metal casing 1, it extends against the surface of the integrated circuit carrier board 3, so as to be connected with the integrated circuit carrier board 3. The second end of the exposed communication wire 31 on the board 3 is in contact and conducts.
- the first side of the integrated circuit carrier 3 faces the metal casing 1 and can be insulated from the metal casing 1, and the second end of the communication trace 31 can extend to the first side of the integrated circuit carrier 3, Therefore, while ensuring that the feeding needle 221 is connected to the second end of the communication wire 31, the length of the feeding needle 221 can be shortened, thereby reducing the length of the radio frequency path and reducing the radio frequency loss in the radio frequency path.
- the insulating material layer 12 can be filled in the gap between the groove 11 and the millimeter-wave antenna unit 22, so as to fix the millimeter-wave antenna unit 22 on the metal casing 1, and Ensure insulation performance between the two.
- an insulating material layer may also be coated on the surface of the millimeter-wave antenna unit 22 facing away from the metal casing 1 to prevent the millimeter-wave antenna unit 22 from being exposed and affecting the appearance of the electronic device.
- the outer surface of the millimeter-wave antenna unit 22 can also be made flush with the outer surface of the metal casing 1 , for example, the non-conductive material and the side of the radiator 222 facing the opening side of the groove 11 are flush with the outer surface of the metal casing 1 .
- the outer surface is flush.
- the N is equal to 4.
- the number of the millimeter-wave antenna units, grooves, etc. may also be any number less than 4 or greater than 4.
- the millimeter-wave antenna unit may include a transmitting antenna unit and a receiving antenna unit, and the working principle of the antenna is the same as that of the millimeter-wave antenna in the prior art, which will not be repeated here.
- radiator 222 in the drawings provided in the embodiments of the present application is a rectangular sheet-like structure, and in a specific implementation, it may also be any structure such as a circle or a triangle, which is not specifically limited here.
- the electronic device in addition to the above-mentioned millimeter-wave antenna module 2, the electronic device can also be provided with other antenna modules, such as: cellular antennas, etc.
- the other antennas can use the metal casing 1 as an antenna radiator, and the metal casing 1 can be used as an antenna radiator.
- the groove 11 structure is provided on the 1, and the groove bottom of the groove 11 is still a metal structure, so that the overall structure of the metal casing 1 is not damaged.
- the antenna unit of the millimeter wave antenna module 2 is arranged in the groove 11 , the bottom of the groove 11 can be used as the reflector of the millimeter-wave antenna module 2, the reflector can shield the signal interference of the internal environment of the electronic equipment to the millimeter-wave antenna module 2, and at the same time, the bottom of the groove also constitutes the radiator of other antennas, It avoids adverse effects on the performance structure of the radiators of other antennas, so that the millimeter wave antenna module 2 on the electronic device is more compatible with other antenna modules.
- the millimeter-wave antenna unit and the integrated circuit carrier board are respectively arranged on opposite sides of the metal casing, so that the millimeter-wave antenna unit is located outside the metal casing and is not shielded by the signal of the metal casing.
- the millimeter wave radio frequency module is arranged on the integrated circuit carrier board, and the second end of the communication wire in the integrated circuit carrier board is exposed, so that the feeding needle penetrating the metal shell can be connected with the exposed communication wire.
- the radiator and the millimeter-wave radio frequency module are connected, so that the feeder of the antenna is shortened, the path loss of the feeder can be reduced, and the communication quality of the millimeter-wave antenna is improved.
- the second end of the feeding pin 221 is welded to the second end of the correspondingly connected communication wire 31 .
- This embodiment can enhance the connection reliability between the feeding needle 221 and the communication wire 31 .
- the second end of the communication wire 31 is provided with a metal connection clip, and the metal connection clip is clamped and connected to the second end of the feeding pin 22 .
- the detachable connection between the communication wire 31 and the power feeding needle 221 can be realized while enhancing the reliability of the connection between the feeding needle 221 and the communication wire 31 , which simplifies the millimeter wave radio frequency module 2 assembly process.
- the feeding needle of each millimeter-wave antenna unit 22 includes a first feeding needle 30 and a second feeding needle 40 .
- One end and the first end of the second feeding pin 40 are respectively connected to the radiator 222 of the millimeter wave antenna unit 22 .
- the integrated circuit carrier board 3 includes a first side 32 and a second side 33 that are opposite to each other, and the communication lines include a first communication line 50 and a second communication line 60 , the first communication line 50 and the second communication line 60 .
- the second end of the communication line 50 is exposed on the first side 32 of the integrated circuit carrier 3
- the second end of the second communication line 60 is exposed on the second side 33 of the integrated circuit carrier 3
- the first feeding pin 30 The second end of the second feed pin 40 extends to the first side 32 of the integrated circuit carrier board 3 and is connected to the second end of the first communication trace 50
- the second end of the second feeding pin 40 extends to the second end of the integrated circuit carrier board 3 side 33 and connected to the second end of the second communication wire 60 .
- the bottom of the groove 11 is provided with two through holes 111 spaced apart from each other, so that the first feeding needle 30 and the second feeding needle 40 respectively penetrate through the corresponding through holes 111 .
- the above-mentioned millimeter-wave antenna unit 22 may be a dual-polarized dipole antenna, and the antenna only needs to conduct conduction with the millimeter-wave radio frequency module 21 through two feeding needles 221 .
- the above-mentioned millimeter-wave antenna unit 22 may also be a multi-polarized antenna.
- each millimeter-wave antenna unit 22 may be provided with more than two feeding needles.
- the millimeter-wave antenna unit 22 is provided with In the case of 4 feed pins (feed pin A, feed pin B, feed pin C, and feed pin D), if the radiator is rectangular, the 4 feed pins can be distributed on two sides of the rectangular radiator.
- the feeding needle A and feeding needle B are located on the diagonal X of the rectangular radiator, and the feeding needle C and feeding needle D are located on the diagonal Y of the rectangular radiator, and the feeding Needle A and feeding needle C are respectively the same distance from the first side of the rectangular radiator, feeding needle B and feeding needle D are respectively the same distance from the second side of the rectangular radiator, and the first side is the same as the second side of the rectangular radiator.
- the second side is the opposite sides of the rectangular radiator, so that the integrated circuit board 3 can be located between the first side and the second side, and the two opposite sides of the integrated circuit carrier 3 are exposed to the communication Route 31, so as to connect the feed pin A and feed pin C to the second end of the communication line 31 exposed on the side of the integrated circuit carrier board 3, and connect the feed pin B and feed pin D to the exposed The second end of the communication wire 31 on the other side of the circuit board 3 is connected.
- the integrated circuit board 3 is located between the first feeding pin 30 and the second feeding pin 40, and the second end of the communication wire 31 is exposed on opposite sides of the integrated circuit board 3, so that it can be
- the millimeter-wave antenna unit 22 includes at least two feeding pins 221 , the length of the integrated circuit carrier board 3 along the arrangement direction of the N millimeter-wave antenna units 22 is shortened.
- the radiator 222 has a first line of symmetry and a second line of symmetry that are perpendicular to each other, the first end of the first feed pin 30 is connected to the first line of symmetry of the radiator 222, One end is connected to the second symmetry line of the radiator 222 .
- first feeding needle 30 and second feeding needle 40 are located at positions other than the center point of the radiator 222 on the first symmetry line and the second symmetry line.
- the above-mentioned millimeter wave antenna unit 22 may be a patch antenna.
- the first line of symmetry may be the horizontal line of symmetry of the radiator 222
- the second line of symmetry may be the vertical line of symmetry of the radiator 222 .
- the first feeding needle 30 is a horizontally polarized feeding needle
- the second feeding needle 40 is a vertically polarized feeding needle.
- the first feeding needle 30 and the second feeding needle 40 may also be arranged at different positions of the radiator 222 according to the specific structure of the radiator 222 , which is not specifically limited herein.
- the feeding needle of each millimeter-wave antenna unit 22 includes a third feeding needle 10 and a fourth feeding needle 20 .
- the first end and the first end of the fourth feeding pin 20 are respectively connected to the radiator 222 of the millimeter-wave antenna unit 22 , and the second end of the third feeding pin 10 penetrates the through hole 111 of the groove 11 and is connected to the communication line
- the second end of the 31 is connected, and the second end of the fourth feeding pin 20 is connected to the metal shell 1;
- the second ends of the N communication wires 31 are exposed on the first side of the integrated circuit carrier board 3 , and the third feeding pins 10 of the N millimeter wave antenna units 22 are distributed on the same straight line.
- the above-mentioned millimeter-wave antenna unit 22 is a single-polarized dipole antenna, and the antenna only needs to be connected to the millimeter-wave radio frequency module 21 through a feeding needle 221 .
- the second end of the fourth power feeding pin 20 is connected to the metal housing 1 , and the fourth power feeding pin 20 may be connected to the metal part of the groove bottom of the groove 11 .
- the third feeding needles 10 of the N millimeter-wave antenna units 22 are distributed on the same straight line, and it can be understood that the second ends of the N third feeding needles 10 are located on the same straight line.
- the second ends of the N communication wires 31 are exposed on the first side of the integrated circuit carrier board 3, so that the N third feeding pins 10 and the integrated circuit carrier board can be located on the same straight line.
- the first side of the board 3 is attached, so that the second ends of the N third feeding pins 10 are connected to the second ends of the N communication wires 31, which can simplify the third feeding needle 10 and the N communication wires.
- the connection structure between the wires 31 and the occupied space of the third feeding pin 10 and the integrated circuit carrier board 3 are reduced, so that the thickness of the electronic device can be reduced.
- an integrated power management module 5 is further provided on the integrated circuit carrier board 3 , and the integrated power management module 5 is connected to the millimeter wave radio frequency module 21 .
- the integrated power management module 5 can provide power for the millimeter-wave radio frequency module 21.
- the connection line or the connection interface between the integrated circuit carrier board 3 and the main board 4 can also be used as The millimeter wave radio frequency module 21 provides power.
- the surfaces of at least one of the millimeter wave radio frequency module 21 and the integrated power management module 5 are respectively covered with shielding covers.
- the above-mentioned shielding cover may be a cover made of a metal material, or may be a silver paste covering layer, etc., which is not specifically limited herein.
- At least one of the millimeter-wave radio frequency module 21 and the integrated power management module 5 can be arranged in the shielding cover to prevent the environment in the electronic device from interfering with it, or to form a coupling structure with it, so that the millimeter-wave radio frequency module can be improved. 2 communication quality.
- the millimeter wave antenna unit 22 further includes a first radiation arm 223 and a second radiation arm 224 , the first radiation arm 223 is connected to the first end of the third feeding needle 10 , and the second radiation arm 224 is connected to the first end of the second feeding needle 20 , and the radiator 222 is connected to the first radiation arm 223 and the second radiation arm 224 .
- the first radiating arm 223 is perpendicular to the third feeding pin 10, and the first end of the third feeding pin 10 is connected to the end of the first radiating arm 223; the second radiating arm 224 is connected to the fourth The feeding needle 20 is vertical, and the first end of the fourth feeding needle 20 is connected to the end of the second radiation arm 224 .
- the above-mentioned radiator 222 is connected to the first radiation arm 223 and the second radiation arm 224 , and the radiator 222 may be welded to the first radiation arm 223 and the second radiation arm 224 .
- the third feeding needle 10 and the first radiating arm 223 may be a metal integral structure
- the above-mentioned fourth feeding needle 20 and the second radiating arm 224 may be a metal integral structure.
- the third feeding pin 10 can be disposed through the through hole 111 of the groove 11 first, and the second end of the fourth feeding pin 20 can be fixed on the bottom of the groove 11, and then the radiator 222 Welded to the first radiation arm 223 and the second radiation arm 224 .
- the contact area between the radiator 222 and the feeding needle can be increased, thereby making the firmness and communication quality of the millimeter wave antenna unit 22 more reliable.
- the feeding needle 221 and the radiator 222 in the same millimeter-wave antenna unit 22 may be an integrally formed metal structure, which is not specifically limited herein.
- the electronic device in this embodiment of the present application may be a mobile electronic device or a non-mobile electronic device.
- the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop computer, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (personal digital assistant).
- assistant, PDA personal digital assistant
- the non-mobile electronic device may be a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which are not specifically limited in the embodiments of the present application.
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Abstract
本申请公开了一种电子设备，属于通信技术领域，该电子设备包括：金属壳体、毫米波天线模块和集成电路载板，金属壳体设有N个凹槽，其槽底开设有通孔；毫米波天线模块包括：毫米波射频模组和N个毫米波天线单元，每一个毫米波天线单元包括馈电针和与馈电针的第一端连接的辐射体，辐射体设置于凹槽内且与金属壳体绝缘设置，馈电针贯穿凹槽的通孔设置；集成电路载板与毫米波天线单元分别位于金属壳体的相背两侧，毫米波射频模组设置于集成电路载板上，且集成电路载板设置有外露的通信走线，馈电针的第二端沿集成电路载板的表面延伸，并抵靠于集成电路载板上，以与通信走线的第二端电连接。
Description
相关申请的交叉引用
本申请主张在2020年9月30日在中国提交的中国专利申请号No.202011057055.8的优先权，其全部内容通过引用包含于此。
本申请属于通信技术领域，具体涉及一种电子设备。
随着第五代(5
th Generation，5G)技术的发展，毫米波天线逐渐应用于体积较小的电子设备中，例如：手机、笔记本电脑等。目前，毫米波天线通常以一个独立模块的形态布置到电子设备中。换言之，毫米波天线和非毫米波天线(例如：蜂窝天线、非蜂窝天线等)分立布置在电子设备的壳体内，从而使得电子设备的体积增大。另外，电子设备往往设置有金属外壳，从而进一步限定了电子设备内有效的辐射空间。
在相关技术中，为了减少天线在电子设备内的占用空间，在金属壳的外侧开设凹槽，并将毫米波天线的辐射片设置于该凹槽内，将承载射频模块的载板贴设于金属壳的内侧，以使穿过金属壳的辐射针连通辐射片和射频模块，其中，承载射频模块的载板沿电子设备的厚度方向延伸。
随着电子设备越来越轻薄的发展趋势，电子设备的厚度方向的安装空间变得越来越小，相关技术中沿电子设备的厚度方向延伸的载板将占用显示屏、听筒以及摄像头等装置的安装空间，从而降低电子设备的屏占比。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决相关技术中的天线结构存在的降低了电子设备的屏占比的问题。
为了解决上述技术问题，本申请是这样实现的：
本申请实施例提供了一种电子设备，包括：
金属壳体，所述金属壳体设有N个间隔设置的凹槽，所述凹槽的槽底开设有通孔，所述N为大于1的整数；
毫米波天线模块，包括：毫米波射频模组和与所述N个凹槽对应设置的N个毫米波天线单元，每一个所述毫米波天线单元包括馈电针和与所述馈电针的第一端连接的辐射体，所述辐射体分别设置于对应的所述凹槽内且与所述金属壳体绝缘设置，所述馈电针贯穿所述凹槽的通孔设置；
集成电路载板，所述集成电路载板与所述毫米波天线单元分别位于所述金属壳体的相背两侧，所述毫米波射频模组设置于所述集成电路载板上，且所述集成电路载板内设置有与N个所述毫米波天线单元的馈电针分别连接的N条通信走线，N条所述通信走线的第一端分别与所述毫米波射频模组连接，所述通信走线的第二端外露于所述集成电路载板，所述馈电针的第二端沿所述集成电路载板的表面延伸，并抵靠于所述集成电路载板上，以分别与所述通信走线的第二端电连接。
在本申请实施例中，将毫米波天线单元和集成电路载板分别设置与金属壳体的相背两侧，以使毫米波天线单元位于金属壳体外而不受金属壳体的信号屏蔽，另外，将毫米波射频模组设置于集成电路载板上，并使集成电路载板内的通信走线的第二端外露，能够使穿透金属壳体的馈电针沿集成电路载板的表面延伸，并与外露的通信走线接触时连通辐射体和毫米波射频模组，这样，可以使集成电路载板沿垂直于电子设备的厚度方向延伸，从而能减少毫米波天线单元在电子设备的厚度方向上的占用空间，从而便于设置显示屏，以提升电子设备的屏占比。
图1是本申请实施例提供的一种电子设备的主视图；
图2是本申请实施例提供的一种电子设备的俯视图；
图3是本申请实施例提供的一种电子设备的结构图；
图4是本申请实施例提供的一种电子设备中辐射体和凹槽的结构图；
图5是本申请实施例提供的一种电子设备中馈电针和凹槽的结构图；
图6是本申请实施例提供的另一种电子设备中馈电针和凹槽的结构图；
图7是本申请实施例提供的一种电子设备中毫米波天线模块和集成电路载板的结构图之一；
图8是本申请实施例提供的一种电子设备中毫米波天线模块和集成电路载板的结构图之二。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
请参阅图1至图4，其中，图1是本申请实施例提供的一种电子设备的主视图；图2是本申请实施例提供的一种电子设备的俯视图；图3是本申请实施例提供的一种电子设备的结构图；图4是本申请实施例提供的一种电子设备中辐射体和凹槽的结构图。本申请实施例提供的电子设备包括：金属壳体1、毫米波天线模块2和集成电路载板3。
其中，金属壳体1设有N个间隔设置的凹槽11，在具体实施中，凹槽11可以由金属壳体1的外表面侧向内表面侧的方向凹陷形成，且所述凹槽11的槽底开设有通孔111，所述N为大于1的整数；毫米波天线模块2，包括：毫米波射频模组21和与N个凹槽11对应设置的N个毫米波天线单元22，每一个毫米波天线单元22包括馈电针221和与馈电针221的第一端连接的辐射体222，辐射体222分别设置于对应的凹槽11内且与金属壳体1绝缘设置， 馈电针221贯穿凹槽11的通孔111设置；集成电路载板3与所述毫米波天线单元22分别位于所述金属壳体1的相背两侧，毫米波射频模组21设置于集成电路载板3上，且集成电路载板3内设置有与N个毫米波天线单元22的馈电针221对应连接的N条通信走线31，N条通信走线31的第一端分别与毫米波射频模组21连接，通信走线31的第二端外露于集成电路载板3，馈电针221的第二端沿集成电路载板3的表面延伸，并抵靠于集成电路载板3上，以分别与通信走线31的第二端电连接。
其中，上述金属壳体1可以是电子设备的金属边框或者金属背盖，本申请实施例的附图中仅以上述金属壳体1为电子设备的金属边框为例进行举例说明，在此并不具体限定金属壳体1为金属边框。
其中，在金属壳体1是电子设备的金属边框的情况下，集成电路载板3所在的平面可以垂直于电子设备的厚度方向，从而有利于在较薄的电子设备上设置全面屏等，以增加电子设备的屏占比。
进一步的，所述电子设备包括相对的第一侧面和第二侧面，所述电子设备的显示屏位于所述第一侧面上；
集成电路载板3与所述第一侧面的距离大于集成电路载板3与所述第二侧面的距离。
本实施方式中，上述集成电路载板3所在的平面垂直于电子设备厚度的方向，且远离电子设备设置有显示屏的一侧设置，从而便于让出显示屏的安装空间，避免需要在显示屏上挖孔或者设置非显示区以用于装配集成电路载板3。
当然，在实际应用中，具有双面显示屏的电子设备，则此时，集成电路载板3可以设置于两个显示屏之间的中间位置，以便于在集成电路载板3的相背两侧分别设置显示屏。
另外，在金属壳体1是电子设备的金属背盖的情况下，可以将集成电路载板3夹设于摄像头模组与显示屏之间，以便于在较薄的电子设备上设置摄像头模组，且夹设于摄像头模组与显示屏之间的集成电路载板3较薄，并不会过多的占用显示屏的区域，从而同样能够提升电子设备的屏占比。
另外，上述与所述N个凹槽11对应设置的N个毫米波天线单元22可以 理解为，凹槽11与毫米波天线单元22一一对应，且毫米波天线单元22设置于对应的凹槽11内，如图4所示，每一个凹槽11内分别设置有一个毫米波天线单元22，且该毫米波天线单元22的馈电针221穿透该凹槽11内的通孔111设置。
另外，如图1所示，上述集成电路载板3还与电子设备中的主板4连接，以与主板4上的处理器等模块进行数据交互，具体的，集成电路载板3可以还包括与所述毫米波射频模组21连接的第一接口(未图示)，所述电子设备的主板4上设置有与所述第一接口匹配的第二接口，所述第一接口与所述第二接口匹配连接。
这样，能够实现集成电路载板3与主板4之间的数据交互，以将集成电路载板3连接至主板4中中频信号的连接座。
在具体实施中电子设备中的主板4作为天线的参考地，金属壳体1可以与主板4至少部分连接，具体的，若金属壳体1为电子设备的金属壳体1，可以使主板4的与集成电路载板3连接的一侧边与金属壳体1之间具有间隙，且使主板4的其他侧边与金属壳体1连接。
这样，能够在馈电针221设置于集成电路载板3与主板4之间的情况下，避免馈电针221与主板4导通，从而提升馈电针221传输馈电信号的可靠性。
在具体实施中，集成电路载板3可以与电子设备的显示面平行设置，则馈电针221穿过金属壳体1后，其贴合集成电路载板3的表面延伸，从而与集成电路载板3上外露的通信走线31第二端接触导通。
另外，集成电路载板3的第一侧边朝向金属壳体1，且可以与金属壳体1绝缘设置，且通信走线31的第二端可以延伸至集成电路载板3第一侧边，从而在确保馈电针221与通信走线31的第二端连接的同时，能够缩短馈电针221的长度，从而减小射频路径的长度，达到减小射频路径中的射频损耗的作用。
另外，如图2所示，在应用中，可以在凹槽11与毫米波天线单元22之间的间隙内填充绝缘材料层12，以将毫米波天线单元22固定于金属壳体1上，并确保两者之间的绝缘性能。另外，在实际应用中，还可以在毫米波天线单元22的背向金属壳体1的表面涂覆绝缘材料层，以避免毫米波天线单元22 外露而影响电子设备的美观。进一步的，还可以使毫米波天线单元22处的外表面与金属壳体1的外表面齐平，例如：非导电材料以及辐射体222的朝向凹槽11开口侧的一面与金属壳体1的外表面齐平。
需要说明的是，本申请实施例提供的附图中，所述N等于4，但是，在具体实施中，该毫米波天线单元、凹槽等的数量还可以是小于4或者大于的任意数量，在此不作具体限定，且该毫米波天线单元可以包括发射天线单元和接收天线单元，其该天线的工作原理与现有技术中毫米波天线的工作原理相同，在此不再赘述。
另外，本申请实施例提供的附图中的辐射体222为矩形片状结构，在具体实施中，其还可以是圆形、三角形等任意结构，在此不作具体限定。
在具体实施中，电子设备除了上述毫米波天线模块2外，还可以设置其他天线模块，例如：蜂窝(cellular)天线等，该其他天线能够利用金属壳体1作为天线辐射体，在金属壳体1上设置凹槽11结构，且该凹槽11的槽底仍然为金属结构，从而未破坏金属壳体1的整体结构，此时将毫米波天线模块2的天线单元设置于凹槽11内时，凹槽11的槽底能够作为毫米波天线模块2的反射器，该反射器能够屏蔽电子设备内部环境对毫米波天线模块2的信号干扰，同时，该槽底还构成其他天线的辐射体，避免对其他天线的辐射体的性能结构产生不利影响，使得电子设备上的毫米波天线模块2与其他天线模块更加兼容。
在本申请实施例中，将毫米波天线单元和集成电路载板分别设置与金属壳体的相背两侧，以使毫米波天线单元位于金属壳体外而不受金属壳体的信号屏蔽，另外，将毫米波射频模组设置于集成电路载板上，并使集成电路载板内的通信走线的第二端外露，能够使穿透金属壳体的馈电针在与外露的通信走线接触时连通辐射体和毫米波射频模组，这样，使得天线的馈线缩短，能够减少馈线的通路损耗，从而提升毫米波天线的通信质量。
在一种实施方式中，馈电针221的第二端与其对应连接的通信走线31的第二端焊接。
本实施方式能够增强馈电针221与通信走线31之间的连接可靠性。
在另一种实施方式中，通信走线31的第二端设置有金属连接夹，所述金 属连接夹与馈电针22的第二端夹持连接。
本实施方式中，能够在增强馈电针221与通信走线31之间的连接可靠性的同时，实现通信走线31与馈电针221之间的可拆卸连接，简化了毫米波射频模块2的装配过程。
在一种可选的实施方式中，如图6所示，每一个毫米波天线单元22的馈电针包括第一馈电针30和第二馈电针40，第一馈电针30的第一端和第二馈电针40的第一端分别与毫米波天线单元22的辐射体222连接。
其中，如图7和图8所示，集成电路载板3包括相背的第一侧32和第二侧33，通信走线包括第一通信走线50和第二通信走线60，第一通信走线50的第二端外露于集成电路载板3的第一侧32，第二通信走线60的第二端外露于集成电路载板3的第二侧33，第一馈电针30的第二端延伸至集成电路载板3的第一侧32并与第一通信走线50的第二端连接，第二馈电针40的第二端延伸至集成电路载板3的第二侧33并与第二通信走线60的第二端连接。
本实施方式中，凹槽11的槽底开设有两个相互间隔设置的通孔111，以使第一馈电针30和第二馈电针40分别贯穿对应的通孔111。
进一步的，上述毫米波天线单元22可以为双极化的偶极子天线，该天线仅需通过两个馈电针221与毫米波射频模组21导通。但是，在具体实施中，上述毫米波天线单元22还可以是多极化天线，此时，每一个毫米波天线单元22可以设置大于2个馈电针，例如：在毫米波天线单元22设置有4个馈电针(馈电针A、馈电针B、馈电针C和馈电针D)的情况下，若辐射体呈矩形，可以将4个馈电针分布于矩形辐射体的两条对角线上，即馈电针A和馈电针B位于矩形辐射体的对角线X上，馈电针C和馈电针D位于矩形辐射体的对角线Y上，且馈电针A和馈电针C分别与矩形辐射体的第一侧边的距离相同，馈电针B和馈电针D分别与矩形辐射体的第二侧边的距离相同，且第一侧边与第二侧边为矩形辐射体的相对两侧边，则可以使集成电路载板3位于第一侧边和第二侧边之间，且集成电路载板3的相背两侧分别外露有通信走线31，从而将馈电针A和馈电针C与外露于集成电路载板3一侧的通信走线31第二端连接，并将馈电针B和馈电针D与外露于集成电路载板3另一侧的通信走线31第二端连接。
本实施方式中，集成电路载板3位于第一馈电针30好第二馈电针40之间，且通信走线31第二端外露于集成电路载板3的相背两侧，从而能够在毫米波天线单元22包括至少两个馈电针221的情况下，缩短集成电路载板3沿N个毫米波天线单元22的排列方向的长度。
进一步的，辐射体222具有相互垂直的第一对称线和第二对称线，第一馈电针30的第一端连接于辐射体222的第一对称线上，第二馈电针40的第一端连接于辐射体222的第二对称线上。
其中，上述第一馈电针30和第二馈电针40位于第一对称线和第二对称线上的除了辐射体222的中心点意外的其他位置。
本实施方式中，上述毫米波天线单元22可以为贴片(Patch)天线。且上述第一对称线可以是辐射体222的水平对称线，上述第二对称线可以是辐射体222的垂直对称线。此时，第一馈电针30为水平极化馈电针，第二馈电针40为垂直极化馈电针。
当然，在具体实施中，还可以根据辐射体222的具体结构将第一馈电针30和第二馈电针40设置于该辐射体222的不同位置，在此并不具体限定。
在另一种可选的实施方式中，如图5所示，每一个毫米波天线单元22的馈电针包括第三馈电针10和第四馈电针20，第三馈电针10的第一端和第四馈电针20的第一端分别与毫米波天线单元22的辐射体222连接，第三馈电针10的第二端贯穿凹槽11的通孔111后与通信走线31的第二端连接，第四馈电针20的第二端与金属壳体1连接；
N条通信走线31的第二端外露于集成电路载板3的第一侧，N个毫米波天线单元22的第三馈电针10分布于同一条直线上。
在具体实施中，上述毫米波天线单元22为单极化的偶极子(dipole)天线，该天线仅需通过一个馈电针221与毫米波射频模组21导通即可。
另外，上述第四馈电针20的第二端与金属壳体1连接，可以是，第四馈电针20与凹槽11的槽底部的金属部分连接。且上述N个毫米波天线单元22的第三馈电针10分布于同一条直线上可以理解为：N个第三馈电针10的第二端位于同一条直线上。
本实施方式中，使N条通信走线31的第二端外露于集成电路载板3的 第一侧，这样，可以是位于同一条直线上的N个第三馈电针10与集成电路载板3的第一侧贴合，从而实现将N个第三馈电针10的第二端连接至N条通信走线31的第二端，能够简化第三馈电针10和N条通信走线31之间的连接结构，且减小第三馈电针10和集成电路载板3的占用空间，从而能够减小电子设备的厚度。
可选的，如图3所示，集成电路载板3上还设置有集成电源管理模块5，集成电源管理模块5与毫米波射频模组21连接。
在具体实施中，能够通过集成电源管理模块5为毫米波射频模组21提供电源，当然，在具体实施中，还可以通过集成电路载板3与主板4之间的连接线或者连接接口等为毫米波射频模组21提供电源。
可选的，毫米波射频模组21和集成电源管理模块5中至少一个的表面分别覆盖有屏蔽罩。
在具体实施中，上述屏蔽罩可以是由金属材料制成的罩子，也可以是银浆覆盖层等，在此不作具体限定。
这样，能够将毫米波射频模组21和集成电源管理模块5中至少一个设置于屏蔽罩内，避免电子设备内的环境对其产生干扰，或者与其形成耦合结构等，能够提升毫米波射频模组2的通信质量。
进一步的，如图5所示，毫米波天线单元22还包括第一辐射臂223和第二辐射臂224，第一辐射臂223连接于第三馈电针10的第一端，第二辐射臂224连接于第二馈电针20的第一端，辐射体222连接于第一辐射臂223和第二辐射臂224上。
在具体实施中，上述第一辐射臂223与第三馈电针10垂直，且第三馈电针10的第一端连接于第一辐射臂223的端部；第二辐射臂224与第四馈电针20垂直，且第四馈电针20的第一端连接于第二辐射臂224的端部。
另外，上述辐射体222连接于第一辐射臂223和第二辐射臂224上，可以是，辐射体222焊接于第一辐射臂223和第二辐射臂224。
另外，第三馈电针10和第一辐射臂223可以是金属一体结构，上述第四馈电针20和第二辐射臂224可以是金属一体结构。在装配过程中，可以先将第三馈电针10贯穿凹槽11的通孔111设置，且将第四馈电针20的第二端固 定于凹槽11的槽底部，再将辐射体222焊接于第一辐射臂223和第二辐射臂224。
本实施方式中，通过将辐射体222通过辐射臂与馈电针连接的方式，能够增加辐射体222与馈电针的接触面积，从而使得毫米波天线单元22的牢固性和通信质量更加可靠。
当然，在具体实施中，上述同一毫米波天线单元22中的馈电针221和辐射体222可以是一体成型的金属结构，在此并不具体限定。
本申请实施例中的电子设备可以是移动电子设备，也可以为非移动电子设备。示例性的，移动电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，非移动电子设备可以为个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等，本申请实施例不作具体限定。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。
Claims (11)
- 一种电子设备，包括：金属壳体，所述金属壳体设有N个间隔设置的凹槽，所述凹槽的槽底开设有通孔，所述N为大于1的整数；毫米波天线模块，包括：毫米波射频模组和与所述N个凹槽对应设置的N个毫米波天线单元，每一个所述毫米波天线单元包括馈电针和与所述馈电针的第一端连接的辐射体，所述辐射体分别设置于对应的所述凹槽内且与所述金属壳体绝缘设置，所述馈电针贯穿所述凹槽的通孔设置；集成电路载板，所述集成电路载板与所述毫米波天线单元分别位于所述金属壳体的相背两侧，所述毫米波射频模组设置于所述集成电路载板上，且所述集成电路载板内设置有与N个所述毫米波天线单元的馈电针分别连接的N条通信走线，N条所述通信走线的第一端分别与所述毫米波射频模组连接，所述通信走线的第二端外露于所述集成电路载板，所述馈电针的第二端沿所述集成电路载板的表面延伸，并抵靠于所述集成电路载板上，以分别与所述通信走线的第二端电连接。
- 根据权利要求1所述的电子设备，其中，所述电子设备包括相对的第一侧面和第二侧面，所述电子设备的显示屏位于所述第一侧面上；所述集成电路载板与所述第一侧面的距离大于所述集成电路载板与所述第二侧面的距离。
- 根据权利要求1所述的电子设备，其中，每一个所述毫米波天线单元的馈电针包括第一馈电针和第二馈电针，所述第一馈电针的第一端和所述第二馈电针的第一端分别与所述毫米波天线单元的辐射体连接；所述集成电路载板包括相背的第一侧和第二侧，所述通信走线包括第一通信走线和第二通信走线，所述第一通信走线的第二端外露于所述集成电路载板的第一侧，所述第二通信走线的第二端外露于所述集成电路载板的第二侧，所述第一馈电针的第二端延伸至所述集成电路载板的第一侧并与所述第一通信走线的第二端连接，所述第二馈电针的第二端延伸至所述集成电路载板的第二侧并与所述第二通信走线的第二端连接。
- 根据权利要求3所述的电子设备，其中，所述辐射体具有相互垂直的第一对称线和第二对称线，所述第一馈电针的第一端连接于所述辐射体的第一对称线上，所述第二馈电针的第一端连接于所述辐射体的第二对称线上。
- 根据权利要求1所述的电子设备，其中，每一个所述毫米波天线单元的馈电针包括第三馈电针和第四馈电针，所述第三馈电针和所述第四馈电针的第一端分别与所述毫米波天线单元的辐射体连接，所述第三馈电针的第二端贯穿所述凹槽的通孔后与所述通信走线的第二端连接，所述第四馈电针的第二端与所述金属壳体连接；N条所述通信走线的第二端外露于所述集成电路载板的第一侧，N个所述毫米波天线单元的第三馈电针的第二端分别抵靠于所述集成电路载板的第一侧。
- 根据权利要求1-5中任一项所述的电子设备，其中，所述集成电路载板上还设置有集成电源管理模块，所述集成电源管理模块与所述毫米波射频模组连接。
- 根据权利要求6所述的电子设备，其中，所述毫米波射频模组和所述集成电源管理模块中至少一个的表面覆盖设置有屏蔽罩。
- 根据权利要求5所述的电子设备，其中，所述毫米波天线单元还包括第一辐射臂和第二辐射臂，所述第三馈电针的第一端经所述第一辐射臂与所述辐射体连接，所述第四馈电针的第一端经所述第二辐射臂与所述辐射体连接。
- 根据权利要求1所述的电子设备，其中，所述集成电路载板还包括与所述毫米波射频模组连接的第一接口，所述电子设备的主板上设置有与所述第一接口匹配的第二接口，所述第一接口与所述第二接口匹配连接。
- 根据权利要求1所述的电子设备，其中，所述电子设备还包括非毫米波天线，所述金属壳体为金属边框，且所述非毫米波天线包括所述毫米波天线单元所在的金属边框。
- 根据权利要求1所述的电子设备，其中，所述毫米波天线单元与所述凹槽之间的间隙填充有非导电材料，且所述非导电材料以及所述辐射体的朝向所述凹槽开口侧的一面与所述金属壳体的外表面齐平。
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| CN109346829A (zh) * | 2018-09-28 | 2019-02-15 | 维沃移动通信有限公司 | 一种终端设备 |
| CN209496992U (zh) * | 2018-12-27 | 2019-10-15 | 维沃移动通信有限公司 | 终端 |
| CN110828985A (zh) * | 2019-10-31 | 2020-02-21 | 维沃移动通信有限公司 | 一种天线单元及电子设备 |
| CN110931944A (zh) * | 2019-12-24 | 2020-03-27 | 天通凯美微电子有限公司 | 一种集成毫米波阵列天线的电子设备 |
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| CN109346829A (zh) * | 2018-09-28 | 2019-02-15 | 维沃移动通信有限公司 | 一种终端设备 |
| CN209496992U (zh) * | 2018-12-27 | 2019-10-15 | 维沃移动通信有限公司 | 终端 |
| CN110828985A (zh) * | 2019-10-31 | 2020-02-21 | 维沃移动通信有限公司 | 一种天线单元及电子设备 |
| CN110931944A (zh) * | 2019-12-24 | 2020-03-27 | 天通凯美微电子有限公司 | 一种集成毫米波阵列天线的电子设备 |
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