WO2022045787A1 - Particule conductrice et connecteur de connexion électrique comprenant celle-ci - Google Patents

Particule conductrice et connecteur de connexion électrique comprenant celle-ci Download PDF

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Publication number
WO2022045787A1
WO2022045787A1 PCT/KR2021/011415 KR2021011415W WO2022045787A1 WO 2022045787 A1 WO2022045787 A1 WO 2022045787A1 KR 2021011415 W KR2021011415 W KR 2021011415W WO 2022045787 A1 WO2022045787 A1 WO 2022045787A1
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WIPO (PCT)
Prior art keywords
conductive
conductive particles
contact
contact portions
contact portion
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PCT/KR2021/011415
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English (en)
Korean (ko)
Inventor
최진우
이상국
박정묵
김준용
정영배
Original Assignee
주식회사 아이에스시
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Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Priority to CN202180055825.1A priority Critical patent/CN116114125A/zh
Publication of WO2022045787A1 publication Critical patent/WO2022045787A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

Definitions

  • the present disclosure relates to conductive particles used in an electrically conductive portion of a connector for electrical connection. Moreover, this indication relates to the connector which has the electroconductive part comprised from electroconductive particle, and electrically connects an inspection apparatus and a to-be-inspected device.
  • a connector for electrically connecting an inspection apparatus and a device to be inspected is used in the art.
  • the connector is disposed between the inspection apparatus and the device to be inspected.
  • a conductive rubber sheet capable of elastically deforming in response to a pressing force applied through a device to be inspected is known in the art.
  • An electroconductive rubber sheet has the electrically conductive part which performs signal transmission, and the insulating part which insulates the electrically conductive part.
  • An electroconductive part is comprised so that many electroconductive particles are electrically conductively aggregated in an up-down direction.
  • a part of the conductive portion and the insulating portion are made of an elastic material such as silicone rubber.
  • the conductive part and the insulating part may be molded together from a liquid molding material in which a plurality of metal particles are mixed in liquid silicone rubber.
  • the conductive part may be formed by applying a magnetic field to the liquid molding material to collect conductive particles in the shape of the conductive part.
  • electroconductive particle spherical electroconductive particle and the electroconductive particle formed in the specific character shape are known in the said field
  • the adjacent conductive particles are in point contact due to the spherical shape. Since the conductive particles in point contact have a small contact area, the current density of the conductive portion is low.
  • the bonding force between the conductive particles and the elastic material is weak due to the small specific surface area of the spherical conductive particles.
  • the contact point between the point-contacted conductive particles can be easily separated, the bond between the conductive particle and the elastic material can be easily broken, and the conductive particles can be placed in place. can deviate from Due to this, electrical contact between the conductive particles is unstable, and the service life of the connector is shortened.
  • the conductive portion made of spherical conductive particles When the conductive portion made of spherical conductive particles is used in a high-temperature environment, expansion of the elastic material can increase the contact resistance while increasing the spacing between the conductive particles.
  • the spherical conductive particles In order to increase the current density of the conductive part, the spherical conductive particles can be aggregated at a high density, but the spherical conductive particles collected at a high density deteriorate the operability of the conductive part.
  • conductive particles formed in specific character shapes such as C-type, H-type, and V-type have been proposed.
  • the character-shaped conductive particles When the character-shaped conductive particles are arranged by magnetic force, they may be bonded to each other in one direction.
  • the contact area between particles in the character-shaped conductive particles is limited to the bonding area between the particles, and the character-shaped conductive particles do not make electrical contact in a non-bonding direction. Accordingly, the character-shaped conductive particles deteriorate the operability of the conductive portion in the direction in which it is not bonded.
  • the conductive portion made of the character-shaped conductive particles has a low particle density due to many voids between the particles, and accordingly, the current density of the conductive portion is lowered.
  • the conductive part may be formed of the character-shaped conductive particles to increase the yield of the connector. Since the conductive particles in the shape of letters enable the operation of the conductive part in only one direction, spherical conductive particles are arranged in the upper section and the lower section of the conductive section, and the character-shaped conductivity is in the middle section of the conductive section that receives a small load from the pressing force. Placing the particles may be considered.
  • the contact area between the conductive particles is reduced at the interface between the upper section and the middle section and between the middle section and the lower section, thereby reducing the conductivity of the conductive section.
  • Patent Document 0001 Republic of Korea Patent Publication No. 10-1525520
  • Patent Document 0002 Republic of Korea Patent Publication No. 10-2017-0127319
  • An embodiment of the present disclosure provides conductive particles that increase the contact area between particles and enable surface contact in all directions.
  • An embodiment of the present disclosure provides conductive particles that increase the conductivity and current density of the conductive portion by configuring the conductive portion in a dense distribution.
  • One embodiment of the present disclosure provides conductive particles that can improve operability of the conductive part, disperse the pressing force applied to the conductive part, and prevent damage due to the pressing force.
  • an embodiment of the present disclosure provides a connector having a conductive portion composed of the aforementioned conductive particles.
  • the conductive particle of one embodiment includes a bottom contact portion and a plurality of side contact portions, and the bottom contact portion and the plurality of side contact portions form a surface of the conductive particle.
  • the bottom contact portion has a plurality of sides.
  • the plurality of side contact portions each meet a plurality of sides of the bottom surface contact portion and are formed to narrow along a first direction perpendicular to the bottom surface contact portion. Adjacent side contact portions among the plurality of side contact portions meet each other along a second direction that is a circumferential direction of the first direction.
  • the conductive particle includes a plurality of vertex contacts respectively formed at positions where two side contacts of the bottom contact portion and the plurality of side contact portions meet, the bottom contact portion and one side contact portion of the plurality of side contact portions meeting and a plurality of edge contact portions respectively formed at positions, and a plurality of edge contact portions respectively formed at positions where adjacent side contact portions of the plurality of side contact portions meet in the second direction.
  • the conductive particle includes an upper vertex contact portion formed at a position where all of the plurality of side contact portions meet in the first direction.
  • a ratio of a length of one side of the bottom contact portion to a height from the bottom contact portion to the upper vertex contact portion may be 1:0.71.
  • the conductive particles are spaced apart from the bottom contact portion in the first direction and are formed at positions where two side contact portions meet, a top contact portion meeting a plurality of side contact portions, and two side contact portions of the top surface contact portion and the plurality of side contact portions, respectively It includes a plurality of vertex contacts.
  • the included angle between the bottom contact portion and one of the plurality of side contact portions may be 54.7 degrees.
  • the bottom contact portion and the plurality of side contact portions may have porosity.
  • a connector for electrical connection between an inspection apparatus and a device to be inspected includes a conductive portion including a plurality of the aforementioned conductive particles that are electrically conductively contacted in the vertical direction, and an insulating portion made of an elastic material while holding the plurality of conductive particles as the conductive portion.
  • the two conductive particles adjacent to the plurality of conductive particles, the surface contact between the bottom contact portion of any one conductive particle and the bottom contact portion of the other conductive particle, the bottom contact portion of any one conductive particle and different surface contact between one of the plurality of side contact portions of one conductive particle, or surface contact between one of the plurality of side contact portions of one conductive particle and one of the plurality of side contact portions of the other conductive particle, to be brought into contact with each other can
  • two conductive particles adjacent in the plurality of conductive particles may be in contact so as to be slidable along any one of the plurality of side contact portions.
  • some of the conductive particles of the plurality of conductive particles and the conductive particles of another portion of the plurality of conductive particles may have different sizes.
  • the conductive particle according to an embodiment is a three-dimensional conductive material having a plurality of surface contact portions. According to one embodiment, since the bottom contact portion and the plurality of side contact portions formed to be narrow in the first direction perpendicular to the bottom contact portion form the surface of the conductive particle, the conductive particle easily faces another conductive particle in all directions. can be contacted Accordingly, when the conductive particles according to an embodiment constitute the conductive part of the connector, the conductive particles are arranged in a dense distribution and the conductive part does not have a direction in which the particles do not contact, thereby increasing the contact area between the particles in the conductive part. and increase the current density of the conductive part. Therefore, compared with the conventional conductive part composed of spherical conductive particles or character-shaped conductive particles, a conductive part having a shape of conductivity and current density can be realized.
  • the conductive particles of one embodiment in the conductive part may relatively slide in all directions. Accordingly, the operability in the vertical direction and the operability in the horizontal direction of the conductive part under the pressing force are improved, and the service life of the connector is improved.
  • the conductive particles of one embodiment have shape characteristics and an increased specific surface area as a three-dimensional object, the entire conductive particles constituting the conductive part form a single reciprocal assembly, thereby preventing the conductive particles from being separated and increasing the durability of the conductive part. make it
  • the conductive particles according to an embodiment may be electrically conductively contacted in the vertical direction with an increased contact area and a dense distribution structure, thereby realizing a conductive part having improved conductivity and a stable particle-to-particle contact structure.
  • a connector having a conductive portion in which a kind of conductive particles are stably in electrical contact can be manufactured with good yield.
  • FIG. 1 schematically illustrates an example to which a connector according to an embodiment is applied.
  • FIG. 2 is a perspective view illustrating conductive particles according to an embodiment.
  • FIG. 4 is a perspective view schematically illustrating conductive particles having various sizes.
  • 5A schematically illustrates a longitudinal cross-sectional shape of conductive particles according to an embodiment.
  • 5B schematically illustrates another longitudinal cross-sectional shape of conductive particles according to an embodiment.
  • FIG. 6 is a perspective view illustrating conductive particles according to another embodiment.
  • FIG. 7 is a perspective view illustrating conductive particles according to another embodiment.
  • FIG. 8 is a perspective view schematically illustrating an example in which conductive particles of an embodiment are conductively contacted within a conductive portion of a connector of the embodiment;
  • FIG. 9 illustrates the relative sliding movement of conductive particles of one embodiment within the conductive portion of a connector according to one embodiment.
  • 10A is a cross-sectional view schematically illustrating a molded substrate for manufacturing a conductive substrate according to an exemplary embodiment.
  • FIG. 10A It is sectional drawing which shows schematically that the shaping
  • Fig. 10C is a cross-sectional view schematically showing that the forming hole shown in Fig. 10B is filled with powder of a metal material constituting conductive particles.
  • 10D is a cross-sectional view schematically showing that the conductive particles are formed by the forming hole of the forming substrate by the powder metallurgy process.
  • 10E schematically illustrates the separation of sintered conductive particles into a molded substrate.
  • FIG. 11 is a perspective view illustrating conductive particles according to another embodiment.
  • Embodiments of the present disclosure are exemplified for the purpose of explaining the technical spirit of the present disclosure.
  • the scope of rights according to the present disclosure is not limited to the embodiments presented below or specific descriptions of these embodiments.
  • Expressions such as 'first' and 'second' used in the present disclosure are used to distinguish a plurality of components from each other, and do not limit the order or importance of the corresponding components.
  • an 'upward' direction indicator is based on a direction in which the connector is positioned with respect to the inspection device, and a 'downward' direction indicator indicates a direction opposite to the upward direction.
  • the direction indicator of 'up-down direction' used in the present disclosure includes an upward direction and a downward direction, but it should be understood that it does not mean a specific one of the upward direction and the downward direction.
  • the embodiments described below and the examples shown in the accompanying drawings relate to a connector for electrical connection between an inspection apparatus and a device to be inspected, and conductive particles used to constitute a conductive portion of the connector.
  • the connector of the embodiments may be used for electrical connection between the test apparatus and the device under test during electrical inspection of the device under test.
  • the connectors of the embodiments may be used for a final electrical inspection of the semiconductor device in a post-process during the manufacturing process of the semiconductor device, but examples to which the connectors of the embodiments are applied are not limited thereto.
  • FIG. 1 schematically shows a connector and an electronic device in contact with the connector, and the shape shown in FIG. 1 is merely an example selected for understanding of the embodiment.
  • the connector 10 is a sheet-shaped structure.
  • the connector 10 is disposed between the two electronic devices.
  • one of the two electronic devices may be the inspection apparatus 20
  • the other may be the inspected device 30 to be inspected by the inspection apparatus 20 .
  • the connector 10 is replaceably fixed to the test socket 40 , and is positioned on the test device 20 by the test socket 40 .
  • the test socket 40 is removably mounted to the test device 20 .
  • the test socket 40 is capable of receiving therein a device under test 30 transported to the test apparatus 20 manually or by means of a transport apparatus, and aligning the device under test 30 with respect to the connector 10 . there is.
  • the connector 10 In the inspection of the device to be inspected 30 , the connector 10 is in contact with the inspection apparatus 20 and the inspected device 30 in the vertical direction VD, and the inspection apparatus 20 and the inspected device 30 . are electrically connected to each other.
  • the device under test 30 may be a semiconductor device in which a semiconductor IC chip and a plurality of terminals are packaged in a hexahedral shape using a resin material.
  • the device under test 30 has a plurality of terminals 31 on its lower side.
  • the terminal 31 may be a ball-type terminal.
  • the device under test 30 may have a land-type terminal having a lower height than a ball-type terminal.
  • the inspection apparatus 20 may inspect various operating characteristics of the device to be inspected 30 .
  • the inspection apparatus 20 may include a board on which an inspection is performed, and the board may include an inspection circuit 21 for inspecting a device to be inspected.
  • the test circuit 21 has a plurality of terminals 22 in contact with the conductive portion of the connector 10 .
  • the terminal 22 of the test device 20 may transmit an electrical test signal and receive a response signal.
  • the connector 10 electrically connects the terminal 22 of the test apparatus and the terminal 31 of the device under test corresponding thereto in the vertical direction VD, and the connector ( Through 10), the inspection of the device to be inspected 30 is performed by the inspection apparatus 20 .
  • At least a portion of the connector 10 may be made of an elastic material.
  • a pressing force P may be applied to the connector 10 through the device under test 30 downward in the up-down direction VD by a mechanical device or manually.
  • the terminal 31 of the device to be inspected and the connector 10 may be in close contact in the vertical direction VD, and the connector 10 and the terminal 22 of the inspection apparatus may be in close contact in the vertical direction VD.
  • some components of the connector 10 may be elastically deformed in the downward direction and the horizontal direction HD by the pressing force P. When the pressing force P is removed, the some components of the connector 10 may be restored to their original shape.
  • a connector 10 includes a conductive part 11 and an insulating part 12 .
  • the conductive part 11 is positioned in the vertical direction VD and is configured to be conductive in the vertical direction VD.
  • the insulating part 12 surrounds the conductive part 11 and insulates the conductive part 11 .
  • the connector 10 may include a plurality of conductive parts 11 , and the insulating part 12 may be formed as a single elastic body that separates the plurality of conductive parts 11 in the horizontal direction HD and insulates them from each other. there is.
  • the conductive portion 11 is in contact with the terminal 22 of the inspection apparatus at the lower end thereof, and is in contact with the terminal 31 of the device to be inspected at the upper end thereof. Accordingly, a vertical conductive path is formed between the terminal 22 and the terminal 31 corresponding to one conductive portion 11 via the conductive portion 11 .
  • the test signal of the test apparatus may be transmitted from the terminal 22 to the terminal 31 of the device under test 30 through the conductive portion 11 , and the response signal of the device under test 30 is transmitted from the terminal 31 . It may be transmitted to the terminal 22 of the test apparatus 20 through the conductive part 11 .
  • the conductive portion 11 may have a substantially cylindrical shape.
  • the size of the upper end and the lower end may be larger than the size of the middle. That is, the conductive portion 11 may have a cylindrical shape in which the middle portion in the vertical direction is thinner than the upper end and the lower end.
  • the conductive part 11 may be configured such that the upper end of the conductive part 11 protrudes from the upper surface of the insulating part 12 .
  • the conductive part 11 may be configured such that the lower end of the conductive part 11 protrudes from the lower surface of the insulating part 12 .
  • the planar arrangement of the conductive parts 11 may vary according to the arrangement of the terminals 31 of the device under test 30 .
  • the insulating portion 12 may be formed in a rectangular region, and the conductive portions 11 may be arranged in the form of one matrix or a pair of matrices within the insulating portion 12 . there is.
  • the conductive parts 11 may be arranged in a matrix form along each side of the rectangular region of the insulating part 12 .
  • the electroconductive part 11 contains many electroconductive particle.
  • a large number of electroconductive particles are electrically conductively contacted in the up-down direction (VD), and comprise the electroconductive part 11.
  • a conductive path is formed in the up-down direction VD in the conductive part 11 by the many electroconductive particles contacting electrically conductively in the up-down direction VD.
  • adjacent conductive particles are in a surface contact form in which a surface is in contact with a surface, a line contact form in which a surface and a line or a line and a line are in contact, or in a point contact form in which a surface and a point are in contact in a vertical direction ( VD).
  • adjacent conductive particles may be in contact along the vertical direction VD, in the horizontal direction HD, or in an oblique direction between the vertical direction and the horizontal direction.
  • a plurality of conductive wire particles may be electrically conductively contacted in a dense distribution structure in the vertical direction (VD) to constitute the conductive part 11 .
  • the insulating portion 12 is made of an insulating elastic material.
  • the elastic material constituting the insulating portion 12 may include, but is not limited to, silicone rubber.
  • the insulating part 12 holds the plurality of conductive particles in contact with the conductive part in the vertical direction VD as the conductive part 11 .
  • the elastic material constituting the insulating portion 12 may fill the gaps between the conductive particles of the conductive portion 11 . That is, the conductive portion 11 partially includes an elastic material forming the insulating portion 12 , and the elastic material of the conductive portion may exist from a lower end to an upper end of the conductive portion.
  • the conductive part 11 made of the elastic material and the insulating part 12 made of the elastic material have elasticity in the vertical direction VD and the horizontal direction HD.
  • the conductive part 11 elastically deforms so that it is compressed downwardly while slightly expanding in the horizontal direction HD. and the insulating part 12 may be elastically deformed to allow expansion of the conductive part 11 .
  • the pressing force P is released, the conductive part 11 and the insulating part 12 may be elastically restored to their original states.
  • the conductive part 11 and the insulating part 12 may be molded together from a liquid molding material in which a plurality of conductive particles are mixed in a liquid elastic material.
  • the liquid elastic material means a liquid state material of the elastic material constituting the insulating part 12 .
  • the liquid molding material may be injected into the molding die, and a magnetic field may be applied in the vertical direction at each position where the conductive part is formed.
  • the conductive particles are collected in the region of the conductive portion to which the magnetic field is applied and are contacted in the vertical direction. Thereafter, by curing the liquid molding material, the conductive portion 11 and the insulating portion 12 are formed at the same time so that the connector of one embodiment can be molded.
  • the insulating part 12 made of the elastic material in a solid state is first formed, and a through hole may be formed in the insulating part 12 at each position of the conductive part 11 .
  • the liquid molding material may be injected into the through hole and a magnetic field may be applied in the vertical direction to collect and contact the conductive particles in the vertical direction, and the liquid molding material injected into the through hole may be cured.
  • FIGS. 2 to 9 schematically show the shape of the conductive particles and the contact form of the conductive particles.
  • the shapes shown in FIGS. 2 to 9 are merely examples selected for understanding of the embodiment.
  • FIG. 2 is a perspective view illustrating conductive particles according to an embodiment
  • FIG. 3 is a front view of the conductive particles shown in FIG. 2 . 2 and 3, the configuration of the conductive particles according to an embodiment will be described.
  • the conductive particles 100 are used to constitute the conductive portion of the above-described connector, and are made of a metal material.
  • the conductive particles 100 of an embodiment are three-dimensional objects formed in three dimensions.
  • the conductive particles 100 have a shape that narrows in a direction perpendicular to the bottom of the three-dimensional object, and the shape characteristics of these conductive particles are arranged while a plurality of conductive particles have an increased contact area with a dense distribution in the conductive part make it
  • the conductive particles 100 are formed at the surface portion thereof, or in the point portion formed between the surfaces thereof. Alternatively, in the portion of the line formed between the surfaces thereof, it may be conductively contacted with another conductive particle. That is, the surface part of the electroconductive particle 100, a line
  • the contact portion of the surface portion is referred to as a face contact portion
  • the contact portion of the line portion is referred to as an edge contact portion
  • the contact portion of the point portion is referred to as a vertex contact portion.
  • the conductive particles of the embodiments may include four or more surface contact portions, six or more edge contact portions, and four or more vertex contact portions.
  • the electroconductive particle 100 contains five surface contact parts which form the surface of electroconductive particle.
  • the five surface contact parts of the electroconductive particle 100 are the bottom contact part 111 and the some side contact parts 112, 113, 114, 115.
  • the bottom contact portion 111 may correspond to the bottom surface of the conductive particle, which is a three-dimensional object.
  • the conductive particles shown in FIG. 2 may have the shape of a quadrangular pyramid, and the plurality of side contact portions may correspond to four side surfaces of the three-dimensional conductive particles. Accordingly, the plurality of side contact portions of the conductive particles 100 are first to fourth side contact portions 112 , 113 , 114 , and 115 .
  • the bottom contact portion 111 may be formed in a quadrangular shape.
  • the quadrangle of the bottom contact part 111 may be a square, but the bottom contact part 111 may be formed in a rectangular shape.
  • the quadrangular bottom contact portion 111 has a plurality of sides.
  • the first to fourth side contact portions 112 , 113 , 114 , 115 which are equal to the number of sides of the bottom contact portion 111 , respectively meet four sides of the bottom contact portion 111 .
  • each of the first to fourth side contact portions 112 , 113 , 114 , and 115 may have a shape corresponding to an isosceles triangle. Accordingly, assuming a first direction AD passing through the center of the bottom contact portion 111 and perpendicular to the bottom contact portion 111 , the first to fourth side contact portions 112 , 113 , 114 , and 115 are the first It is formed to narrow along the direction AD. In addition, when it is assumed that the second direction CD becomes the circumferential direction of the first direction AD, the neighbor along the second direction CD among the first to fourth side contact portions 112 , 113 , 114 , and 115 . One side contacts meet each other.
  • first side contact portion 112 and the second side contact portion 113 meet each other
  • second side contact portion 113 and the third side contact portion 114 meet each other
  • third side contact portion 114 and the fourth The side contact portion 115 meets each other
  • fourth side contact portion 115 and the first side contact portion 112 meet each other.
  • the conductive particles 100 may have a shape of a quadrangular pyramid or a shape similar to a quadrangular truncated pyramid. Since the conductive particle 100 has a shape characteristic that is narrowed in the first direction AD, one of the bottom contact part or the side contact part of the conductive particle 100 is one of the bottom contact part or the side contact part of another conductive particle and Make interviewing easy. Accordingly, the conductive particles according to an embodiment may constitute the conductive part while having a dense distribution structure and an increased contact area.
  • the conductive particles according to the embodiments include a plurality of vertex contact portions and a plurality of edge contact portions respectively formed at positions where the bottom contact portion and the side contact portion meet.
  • the conductive portion is constituted by the conductive particles, one vertex contact portion of the conductive particle may be in contact with one of the face contact portions of another conductive particle, and one edge contact portion of the conductive particle is the surface of another conductive particle. It may contact one of the contacts or one of the edge contacts.
  • the conductive particles 100 of an embodiment are first to fourth respectively formed at positions where two side contact portions of the bottom contact portion 111 and the first to fourth side contact portions 112, 113, 114, and 115 meet. and vertex contacts 121 , 122 , 123 , 124 .
  • the conductive particles 100 formed in the shape of a quadrangular pyramid include a fifth vertex contact portion 125 positioned at the uppermost end.
  • the fifth vertex contact portion 125 serves as an upper vertex contact portion of the conductive particles 100 .
  • the fifth vertex contact portion 125 is formed at a position where all of the first to fourth side contact portions 112 , 113 , 114 , and 115 meet in the first direction AD.
  • the conductive particles 100 of an embodiment include, as the plurality of edge contact parts, first to eighth edge contact parts 131 , 132 , 133 , 134 , 135 , 136 , 137 , and 138 .
  • the first to fourth corner contact portions 131, 132, 133, and 134 are at positions where one side contact portion of the bottom contact portion 111 and the first to fourth side contact portions 112, 113, 114, and 115 meet. each is formed
  • the fifth to eighth edge contact portions 135 , 136 , 137 , and 138 are positions where adjacent side contact portions among the first to fourth side contact portions 112 , 113 , 114 and 115 meet in the second direction (CD). are formed in each
  • the conductive particles 100 of an embodiment made of a metal material may be manufactured by molding a metal powder into a sintered body through a powder metallurgy process.
  • the metal material of the metal powder may be iron, nickel, gold, silver, copper, palladium, rhodium, tungsten, platinum, titanium, or cobalt.
  • the sintered body may be a partial solid solution.
  • conductive particles may be manufactured by sintering a powder of silver (Ag) and a metal powder of copper (Cu) for conductivity, and a powder of cobalt (Co) for imparting magnetism.
  • a plurality of fine pores in which open or closed cells are mixed may be formed on the surface and inside of the conductive particles 100 formed as a sintered body. That is, the bottom contact portion and the side contact portion, which are the surfaces of the conductive particles 100, have porosity. Accordingly, the bottom contact portion 111 and the first to fourth side contact portions 115 have large surface roughness and high specific surface area. Therefore, the contact area between the elastic material constituting the insulating part of the connector and the surface of the conductive particles 100 or between the elastic material in the conductive part of the connector and the surface of the conductive particles 100 is increased, and the conductive particles 100 can be maintained in the conductive part with a strong bonding force.
  • conductive particles having various sizes may constitute the conductive part of the connector.
  • 4 is a perspective view schematically showing conductive particles according to an embodiment having various sizes.
  • the conductive particles 101 , 102 , and 103 may have various sizes.
  • the conductive particles 101, 102, and 103 have a length (L) of one side of the bottom contact part 111 and a height (H) from the bottom contact part 111 to the fifth vertex contact part (upper vertex contact part) 125 with each other. may be formed differently.
  • the ratio of the length (L) of one side of the bottom contact part 111 to the height (H) from the bottom contact part 111 to the fifth vertex contact part 125 is the conductive particles 101, 102, 103 of various sizes.
  • a ratio of the length L of one side of the bottom contact part 111 to the height H from the bottom contact part 111 to the fifth vertex contact part 125 may be about 1:0.71.
  • the length L of one side of the bottom contact portion 111 may be 20 ⁇ m to 60 ⁇ m.
  • Conductive particles of various sizes as illustrated in FIG. 4 may be used to form the conductive portion of the connector of an embodiment. Accordingly, among the plurality of conductive particles constituting the conductive part of the connector, some conductive particles and another conductive particles may have different sizes. As the conductive particles having various sizes constitute the conductive part, the particle density in the conductive part may be further increased.
  • the included angle between the bottom contact and one of the side contacts may be a specific angle.
  • 5A and 5B schematically show a longitudinal cross-sectional shape of conductive particles of an embodiment.
  • the included angle IA between the bottom contact part 111 and one of the first to fourth side contact parts 112 , 113 , 114 and 115 may be about 54.7 degrees.
  • the included angle IA between the bottom contacting part 111 and the first side contacting part 112 and the included angle IA between the bottom contacting part 111 and the third side contacting part 114 are about It can be 54.7 degrees.
  • the included angle IA between the bottom contact part 111 and the second side contact part 113 and the included angle IA between the bottom contact part 111 and the fourth side contact part 115 are about It can be 54.7 degrees.
  • conductive particles having various sizes may have the included angle IA between one of the bottom contact part and the side contact part.
  • 6 is a perspective view illustrating conductive particles according to another embodiment. 6 shows conductive particles having the shape of a quadrangular truncated pyramid.
  • the conductive particles 100A include the aforementioned bottom contact portion, the aforementioned first to fourth side contact portions, the aforementioned first to fourth vertex contact portions, and the aforementioned first to eighth edge contact portions. do.
  • the electroconductive particle 100A shown in FIG. 6 has the area smaller than the bottom contact part 111, and contains the upper surface contact part 116 formed in the rectangle.
  • the top contact part 116 may be spaced apart from the bottom contact part 111 in the first direction AD, and the top contact part 116 may be positioned parallel to the bottom contact part 111 .
  • the top contact portion 116 meets the first to fourth side contact portions 112 , 113 , 114 , and 115 on its four sides, respectively.
  • the conductive particles 100A including the upper surface contact portion 116 may have a shape of a quadrangular truncated pyramid.
  • the conductive particles 100A do not include the aforementioned fifth vertex contact portion.
  • the conductive particles 100A are formed at positions where two side contact portions of the upper surface contact portion 116 and the first to fourth side contact portions 112, 113, 114, and 115 meet, respectively, sixth to ninth vertex contact portions ( 126, 127, 128, 129).
  • corner contact portions may be formed at positions where one side contact portion of the upper surface contact portion 116 and the first to fourth side contact portions 112 , 113 , 114 and 115 meet.
  • the conductive particles 100A may be formed in various sizes.
  • the included angle between the bottom contact portion 111 and one of the first to fourth side contact portions 112 , 113 , 114 and 115 may be about 54.7 degrees.
  • the included angle between the top contact portion 216 and one of the first to fourth side contact portions 112 , 113 , 114 and 115 may be 125.3 degrees.
  • the electroconductive particle shown in FIG. 7 may have the shape of a quadrangular pyramid whose bottom surface is a rectangle. That is, the bottom contact part 111 of the electroconductive particle 100B shown in FIG. 7 has a rectangle.
  • the conductive particles 100B may be formed in the shape of a quadrangular truncated pyramid, similarly to the conductive particles shown in FIG. 6 .
  • the conductive portion of the connector may be configured with a plurality of conductive particles. Due to the above-described shape characteristics of the conductive particles, the conductive particles can be in close contact with each other in the region of a magnetic field with little gap between them. Accordingly, in the conductive portion of the connector, the conductive particles may be arranged in a dense distribution in the vertical direction. Therefore, the conductive portion of the connector may have increased particle density and increased particle-to-particle contact area, thereby exhibiting improved conductivity and improved current density.
  • FIG. 8 schematically illustrates an example in which the conductive particles of one embodiment are conductively contacted within the conductive portion of the connector of one embodiment.
  • FIG. 8 shows an example in which the conductive part is composed of the conductive particles in the shape of a quadrangular pyramid
  • the conductive part may be composed of the conductive particles shown in FIGS. 6 and 7 .
  • the conductive particles shown in FIGS. 2, 6, and 7 may be mixed to form a conductive part.
  • a plurality of conductive particles according to an embodiment are conductively contacted in the vertical direction (VD) to constitute the conductive part 11 of the connector.
  • the conductive part 11 may include conductive particles 104 and 105 having the same size.
  • the conductive particles 104 and 105 are closely contacted in a disordered orientation.
  • the first direction AD perpendicular to the bottom contact portion is positioned in a disordered orientation.
  • the conductive particles are disposed so that the first directions AD of the conductive particles are located in the vertical direction VD, the horizontal direction HD, or any oblique direction between the vertical direction VD and the horizontal direction HD.
  • each conductive particle may be arranged in a dense distribution in the vertical direction and the horizontal direction in the conductive part 11 .
  • the conductive particles may be arranged in a dense distribution within the conductive part 11 .
  • the conductive particles 104 and 105 adjacent in the conductive part 11 may be in contact with each other in a contact form such as surface contact, face-to-line contact, or face-to-point contact.
  • the surface contact may mean that one of the bottom contact portion or side contact portion of one conductive particle 104 and one of the bottom contact portion or side contact portion of the other conductive particle 105 are in contact with each other.
  • the face-to-line contact may mean that one of the bottom contact portion or the side contact portion of one conductive particle 104 and one of the edge contact portion of the other conductive particle 105 contact each other.
  • the face-to-point contact may mean that one of the bottom contact portion or the side contact portion of one conductive particle 104 and one of the vertex contact portions of the other conductive particle 105 contact each other.
  • the above-mentioned surface contact may include a surface contact of the bottom contact portion to the bottom contact portion, a surface contact of the bottom contact portion to the side contact portion, and a surface contact of the side contact portion to the side contact portion. That is, the two adjacent conductive particles 104 and 105 in the conductive part 11 are in surface contact between the bottom contact part of any one conductive particle 104 and the bottom contact part of the other conductive particle 105, which Surface contact between the bottom contact portion of one conductive particle 104 and one of the side contact portions of the other conductive particle 105, or one of the side contact portions of any one conductive particle 104 and the other conductive Surface contact between one of the side contact portions of the particles 105 may contact each other.
  • the plurality of conductive particles constituting the conductive portion 11 exhibits contact properties in all directions.
  • the two adjacent conductive particles 104 and 105 may overlap or cross each other in the first directions AD, rather than being parallel to each other. Accordingly, as shown in FIG. 8 , the adjacent conductive particles 104 and 105 may be densely distributed in the vertical direction VD and the horizontal direction HD to contact each other. Therefore, the plurality of conductive particles constituting the conductive part 11 may be electrically conductively contacted in the vertical direction at a very high density within the conductive part 11 .
  • adjacent conductive particles 104 and 105 in the conductive part 11 may be in contact with each other in a contact form such as line contact.
  • the line contact may mean that one of the edge contact portions of one conductive particle 104 and one of the edge contact portions of the other conductive particle 105 contact each other.
  • the conductive particles 104 and 105 arranged in disordered orientation and densely contacting each other greatly increase the contact area between the particles in the conductive portion 11 .
  • the conductive particles having the shape of a quadrangular pyramid formed by the bottom contact portion and the side contact portions easily induce surface contact between adjacent conductive particles when configuring the conductive portion 11 .
  • the plurality of conductive particles is mainly in contact with the contact form of the surface contact among the contact forms described above. Accordingly, in the plurality of conductive particles constituting the conductive part 11 , there is no direction in which the contact property is deteriorated, and the plurality of conductive particles has a greatly increased contact area.
  • a plurality of conductive particles in the conductive part 11 become a single structure that is coupled to each other, separation of the conductive particles from the conductive part may be prevented, and durability of the conductive part may be increased.
  • a plurality of conductive particles may be distributed at a high density in the conductive part 11 , the current density of the conductive part may be improved.
  • the conductive part 11 may include conductive particles of various sizes. As shown in FIG. 4 , conductive particles of various sizes constitute the conductive part 11 , and may be mixed in the conductive part 11 . In this example, some of the conductive particles of the plurality of conductive particles constituting the conductive part 11 and the conductive particles of another one of the plurality of conductive particles may have different sizes. Moreover, different types of electroconductive particle may be mixed among the electroconductive particle shown in FIG. 2 and FIG. 4, the electroconductive particle shown in FIG. 6, and the electroconductive particle shown in FIG. 7, and the electroconductive part 11 may be comprised. Similarly in this example, conductive particles of various sizes may be used for the conductive part 11 .
  • the conductive particles constituted as a three-dimensional object having a shape narrowing from the bottom surface contact with the surface contact, the conductive particles can slide along the respective surface contact portions. Therefore, in response to the pressing force applied at the time of the inspection of the device to be inspected, all the electroconductive particles in the electroconductive part slide relatively, and the operability corresponding to the pressing force is improved.
  • the sliding property by the surface contact portion may facilitate the movement of the conductive particles.
  • Two adjacent conductive particles 104 and 105 are in contact with each other by surface contact between the side contact portions. Accordingly, in the plurality of conductive particles constituting the conductive portion, the adjacent two conductive particles 104 and 105 may be slidably contacted along any one of the respective side contact portions. In addition, in a state in which two adjacent conductive particles are in surface contact by the bottom contact portions, the two adjacent conductive particles may slide along the bottom contact portions.
  • the pressing force P is applied to the conductive portion 11 downward in the vertical direction VD.
  • one of the side contact portions of one conductive particle 104 and one of the side contact portions of the other conductive particle 105 are in surface contact contact.
  • one conductive particle 104 and the other conductive particle 105 may slide in the slide direction SD while being guided by the side contact portion in surface contact.
  • the slide direction SD may be a direction of the pressing force P, a direction perpendicular to the direction of the pressing force P, or a direction oblique to the direction of the pressing force P.
  • the two slidable conductive particles can be easily moved in the horizontal direction HD or in a direction oblique to the horizontal direction HD in response to the pressing force P within the conductive part 11 . Accordingly, the conductive portion of the connector may be expanded in the horizontal direction by the pressing force P, and in this process, the conductive particles may slide.
  • the conductive particles which are moved while sliding by the pressing force, improve the operability in the vertical direction and the horizontal direction of the conductive part.
  • the conductive particles moved while sliding by the pressing force may disperse the pressing force P applied to the conductive part and reduce damage caused by the pressing force P.
  • the contact form of the electroconductive particles shown in FIG. 9 is only exemplary. Adjacent conductive particles may be contacted by surface contact between the bottom contacts, by surface contact between the bottom contact and one of the side contacts, or by contact between the bottom contact or the side contact and the edge contact.
  • the contact may be positioned in various directions with respect to the vertical direction VD. Accordingly, the plurality of conductive particles in the conductive portion can relatively slide in all directions in response to the pressing force P.
  • the conductive particles that are distributed at a high density and realize a relative sliding movement may be distributed from the lower end to the upper end of the conductive portion in the conductive portion of the connector. That is, in the conductive part of the connector of one embodiment, over the upper section of the conductive section, the middle section of the conductive section, and the lower section of the conductive section, the conductive particles having the same or different sizes and having a quadrangular pyramid or quadrangular pyramid shape are distributed at high density. Accordingly, the conductive part of the connector according to an embodiment may solve disadvantages such as unstable bonding force and contact area, which may occur due to the use of heterogeneous particles.
  • the spherical conductive particles may be disposed in the upper section and the lower section of the conductive part, and the conductive particles according to the embodiments may be disposed in the middle section of the conductive part.
  • the conductive particles of the embodiments are arranged in a dense distribution, the contact area between the particles at the interface between the conductive particles of the embodiments and the spherical conductive particles can be stably secured.
  • the conductive particles of an embodiment may be manufactured by molding a metal powder into a sintered body through a powder metallurgy process.
  • 10A to 10E schematically show an example of manufacturing the conductive particles according to an embodiment, and the shapes shown in FIGS. 10A to 10E are only examples selected for understanding the embodiment.
  • a molding substrate 310 for molding conductive particles is prepared.
  • the molding substrate may be a silicon wafer substrate.
  • a mask (not shown) formed through a plurality of openings (not shown) may be attached to the upper surface 311 of the molding substrate 310 .
  • the opening of the mask may correspond to the shape of the above-described bottom contact portion of the conductive particle.
  • Fig. 10B schematically shows that forming holes for forming conductive particles are formed in a molded substrate.
  • the molding substrate 310 is wet-etched with an aqueous KOH solution. By the wet-etching, the molding substrate 310 is etched from the upper surface 311 on which the opening of the mask is located, and forming holes 321 , 322 , and 323 are formed.
  • the shapes of the forming holes 321 , 322 , and 323 correspond to the shapes of the conductive particles of the embodiments.
  • the forming holes 321 and 322 may have a shape of a quadrangular pyramid inverted up and down
  • the forming hole 323 may have a shape of a quadrangular pyramid inverted up and down.
  • An angle between the side wall surface 331 and the upper surface 311 of the forming holes 321 , 322 , and 323 may be about 54.7 degrees.
  • a difference occurs in the etching rate of wet-etching.
  • the sidewall surface 331 of the forming hole inclined at about 54.7 degrees with respect to the upper surface 311 and narrowing downward from the upper surface 311 may be etched.
  • the forming holes 321 and 322 may have vertices 332
  • the forming holes 323 may have a bottom surface 333 , depending on the size of the wet-etched region or the wet-etching time adjustment.
  • the vertex 332 may correspond to the above-described fifth vertex contact portion
  • the bottom surface 333 may correspond to the above-described upper surface contact portion.
  • Fig. 10C schematically shows that the forming holes of the forming substrate are filled with the powder of the metal material constituting the conductive particles.
  • the metal powder 341 injected into the forming holes 321 , 322 , and 323 is made of a metal material constituting the conductive particles according to an embodiment, for example, may be made of the aforementioned metal material.
  • the metal powder 341 may be a powder of one of the aforementioned metal materials, or may be a powder of two or more metal materials.
  • silver (Ag) powder, copper (Cu) powder, and cobalt (Co) powder may be injected into the forming holes 321 , 322 , and 323 .
  • Fig. 10D schematically shows that the conductive particles are formed by a forming hole of a forming substrate by a powder metallurgy process.
  • the metal powder 341 is heated to a sintering temperature to be sintered. Prior to sintering of the metal powder 341 , the metal powder 341 may be compressed. As the metal powder is sintered, as shown in FIG.
  • sintered bodies 351 , 352 , 353 corresponding to the shapes of the forming holes 321 , 322 , 323 are formed, and the sintered bodies 351 , 352 , 353 are It becomes the electroconductive particle of an embodiment.
  • FIG. 10E schematically illustrates the separation of sintered conductive particles into a molded substrate.
  • the conductive particles 101 , 102 , and 100A are separated from the forming holes 321 , 322 , and 323 .
  • the conductive particles 101 and 102 may have a shape of a quadrangular pyramid corresponding to the shape of the forming holes 321 and 322
  • the conductive particles 100A may have a shape of a quadrangular pyramid corresponding to the shape of the forming hole 323 .
  • Each of the conductive particles 101 , 102 , 100A includes a bottom contact portion formed by the upper surface of the metal powder filled in the forming holes 321 , 322 , 323 .
  • Each of the conductive particles 101 , 102 , 200 includes first to fourth side contact portions having a shape corresponding to the shape of the side wall surface 331 of the forming hole.
  • the conductive particles 100A include a top contact portion having a shape corresponding to the shape of the bottom surface 333 of the forming hole 323 .
  • the surface contact portions of each of the conductive particles 101 , 102 , 100A formed by sintering have porosity.
  • FIG. 11 is a perspective view illustrating conductive particles according to another embodiment.
  • the electroconductive particle 200 shown in FIG. 11 is formed of the three-dimensional thing like a triangular pyramid.
  • the constituent materials of the conductive particles 200 may be the same as those of the conductive particles and constituent materials of the above-described embodiment.
  • the conductive particles 200 may be manufactured by molding a metal powder as a sintered body through a powder metallurgy process.
  • the conductive particles 200 have a shape that narrows in a direction perpendicular to the bottom surface of the three-dimensional object.
  • the electroconductive particle 200 contains four surface contact parts which form the surface of electroconductive particle.
  • the four surface contact portions of the conductive particles 200 include a bottom surface contact portion 211 and a plurality of, that is, first to third side surface contact portions 212 , 213 , 214 .
  • the bottom contact portion 211 has three sides and may be formed in a triangle such as an equilateral triangle.
  • the first to third side contact portions 212 , 213 , and 214 meet three sides of the bottom surface contact portion 211 , respectively.
  • the first to third side contact portions 212 , 213 , and 214 are formed to be narrow in the first direction AD.
  • adjacent side contact portions in the second direction CD meet each other. Due to the shape characteristics of the above-described bottom contact portion and the first to third side contact portions, one of the bottom contact portion or the side contact portion of the conductive particle 200 is one of the bottom contact portion or the side contact portion of the other conductive particle 200 and Make interviewing easy.
  • the conductive particles may constitute the conductive portion while having a dense distribution structure and an increased contact area.
  • the electroconductive particles can slide relatively in all directions by the pressing force applied to the electroconductive part.
  • the conductive particles 200 include an upper vertex contact portion 225 positioned at the uppermost end.
  • the upper vertex contact portion 225 is formed at a position where all of the first to third side contact portions 212 , 213 , and 214 meet in the first direction AD.
  • the conductive particles 200, the bottom contact portion 211 and the first to third side contact portions (212, 213, 214) of the side contact portion is formed in each of the corner contact portions (231, 232, 233) formed at the locations where they meet. ) and edge contact portions 235 , 236 , and 237 formed at positions where adjacent side contact portions of the first to third side contact portions 212 , 213 and 214 meet in the second direction CD, respectively.

Abstract

L'invention concerne une particule conductrice utilisée pour une pièce conductrice d'un connecteur servant à connecter électriquement un dispositif de test à un dispositif à tester. La particule conductrice comprend une pièce de contact de base et de multiples pièces de contact latérales et la pièce de contact de base et les multiples pièces de contact latérales forment la surface de la particule conductrice. La pièce de contact de base présente de multiples côtés. Les multiples pièces de contact latérales rejoignent les multiples côtés de la pièce de contact de base, respectivement, et sont formées de sorte à se rétrécir dans une première direction perpendiculaire à la pièce de contact de base. Des pièces de contact latérales voisines, parmi les multiples pièces de contact latérales, se rejoignent dans une seconde direction qui est la direction circonférentielle de la première direction.
PCT/KR2021/011415 2020-08-28 2021-08-26 Particule conductrice et connecteur de connexion électrique comprenant celle-ci WO2022045787A1 (fr)

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JP2016541098A (ja) * 2013-11-15 2016-12-28 スリーエム イノベイティブ プロパティズ カンパニー 成形粒子を含有する導電性物品及びその作製方法
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KR20220028280A (ko) 2022-03-08
TWI806138B (zh) 2023-06-21

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