WO2022027535A1 - Puce de sécurité et dispositif électronique - Google Patents

Puce de sécurité et dispositif électronique Download PDF

Info

Publication number
WO2022027535A1
WO2022027535A1 PCT/CN2020/107645 CN2020107645W WO2022027535A1 WO 2022027535 A1 WO2022027535 A1 WO 2022027535A1 CN 2020107645 W CN2020107645 W CN 2020107645W WO 2022027535 A1 WO2022027535 A1 WO 2022027535A1
Authority
WO
WIPO (PCT)
Prior art keywords
security chip
pad
circuit
attack detection
conductive member
Prior art date
Application number
PCT/CN2020/107645
Other languages
English (en)
Chinese (zh)
Inventor
陆斌
沈健
薛建锋
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2020/107645 priority Critical patent/WO2022027535A1/fr
Publication of WO2022027535A1 publication Critical patent/WO2022027535A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory

Definitions

  • the embodiments of the present application relate to the field of chip technology, and more particularly, to a security chip and an electronic device.
  • a security chip is a special chip that can execute complex encryption and decryption algorithms. Its special storage area stores keys and confidential information, and can provide encryption and security authentication services for computers or mobile terminals. In order to obtain sensitive data stored in the security chip, or reverse/reverse engineer the security chip, attackers often use various attack methods to attack the security chip.
  • various detection circuits can be set inside the security chip, such as photoelectric detection, voltage detection, temperature detection and frequency detection, to monitor the working environment of the security chip. Once an abnormality is detected, the security chip can take protective measures.
  • the embodiments of the present application provide a security chip and an electronic device, which can effectively improve the security performance of the security chip.
  • a package structure of a security chip comprising: a security chip body, including an internal circuit and at least one first pad, the internal circuit including an attack detection circuit and a power supply circuit, the first pad and The attack detection circuit is electrically connected to a power supply circuit, the attack detection circuit is used to detect whether the security chip is attacked, and the power supply circuit is used to supply power to the security chip body; On the upper surface of the chip body, the conductive member is electrically connected to the first pad and connected to the attack detection circuit and/or the power supply circuit through the first pad; The security chip body and the conductive component are plastic-sealed; wherein, the conductive component is conductive and at least partially dissolved in an acid solution, so that the attack detection circuit or the power supply circuit protects the security chip.
  • the attacker needs to use acid solution in the process of opening the cover of the security chip to attack the body of the security chip.
  • a conductive part that is conductive and can be dissolved in the acid solution is arranged on the surface of the body of the security chip, and the conductive part passes through the body of the security chip.
  • the first pad is connected to the attack detection circuit and/or the power circuit of the security chip body.
  • the conductive member may be dissolved in nitric acid; or the conductive member may be dissolved in a mixed solution containing nitric acid.
  • the conductive member is a non-metallic conductive material.
  • the conductive components are made of non-metallic materials, so due to the characteristics of the materials used, it is difficult for an attacker to accurately detect the position and shape of the conductive components in the security chip through non-destructive detection methods, making it difficult for the attacker to detect the security chip. Reproducing or reproducing the conductive parts after the chip is opened can further improve the effective protection of the security chip.
  • the conductive member is carbon-based conductive ink or doped zinc oxide.
  • the security chip body further includes: a passivation layer and an interconnection layer, a window is provided on the passivation layer, the first pad is provided under the window, and the conductive A component is disposed between the passivation layer and the top metal layer of the interconnect layer to electrically connect the first pad, and the conductive component is exposed to the surface of the security chip body through the window portion.
  • the security chip body further includes: a passivation layer, a window is provided on the passivation layer, the first pad is provided under the window, and the conductive member is provided on The passivation layer overlies and covers the window to electrically connect the first pad.
  • the conductive part overlaps with the projection of the metal layer of the interconnection layer in the security chip body on the surface perpendicular to the surface of the security chip body, the conductive part, the metal layer and
  • the passivation layer between the conductive member and the metal layer forms a capacitor in the attack detection circuit, and the attack detection circuit protects the security chip when a change in capacitance of the capacitor is detected.
  • the at least one first pad includes a plurality of first pads, and the conductive member is connected to the first pad through two first pads of the plurality of first pads
  • the attack detection circuit is used as a wire or a resistor in the attack detection circuit, and the attack detection circuit protects the security chip when the wire or the resistor is disconnected.
  • the security chip body further includes a second pad, the second pad is disposed on the upper surface of the security chip body, the internal circuit further includes a storage circuit, and the storage The circuit is used to store data, the storage circuit is electrically connected to the second pad and the attack detection circuit respectively, and the attack detection circuit protects the security chip, including: the attack detection circuit performs the following operations At least one of the actions of: issuing an alarm, erasing the data stored in the storage circuit, restarting the security chip body, and outputting an error result.
  • the conductive member is connected to the power supply circuit through the first pad, so as to serve as a wire or a resistor in the power supply circuit, and the power supply circuit is in the absence of the conductive member or When the shape of the conductive member changes, the wire or the resistor is disconnected and the power supply to the security chip body is stopped.
  • the internal circuit further includes a data processing circuit, and the data processing circuit is configured to operate and process the received data
  • the security chip body further includes a second pad, the The second pad is disposed on the upper surface of the security chip body and is electrically connected to the data processing circuit
  • the data processing circuit is also electrically connected to the attack detection circuit
  • the data processing circuit is further connected to The power supply circuit is electrically connected, and when the attack detection circuit and/or the power supply circuit protects the security chip, the data processing circuit does not perform operations on the data or performs erroneous operations and sums on the data. Error handling.
  • the internal circuit further includes a storage circuit electrically connected to the second pad, the storage circuit is electrically connected to the data processing circuit, and is used for receiving the data passing through the data processing circuit The calculated and processed data is stored, and the storage circuit is also electrically connected to the attack detection circuit, and/or the storage circuit is also electrically connected to the power supply circuit, and the storage circuit is also electrically connected to the power supply circuit.
  • the storage circuit erases the stored data.
  • the security chip further includes a lead frame disposed under the security chip body, and a third pad is formed on the lead frame, and the third pad is on the plastic package.
  • the second pad includes at least one of the following pads: a test pad, an input/output pad, a power supply a pad and a ground pad, wherein the input/output pad, the power pad, and the ground pad are electrically connected to a third pad, and the test pad is not electrically connected to the third pad connect.
  • an electronic device including a data transmission chip for transmitting data; the security chip described in the first aspect and any possible implementation manner of the first aspect, the security chip is connected to the the data transmission chip.
  • FIG. 1 is a schematic diagram of a security chip according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a security chip according to an embodiment of the present application.
  • FIG. 3 is a schematic diagram of the security chip according to the embodiment of the present application after the cover is opened.
  • 4-6 are schematic diagrams of the positions of the first pads in the security chip according to the embodiments of the present application.
  • FIG. 7 is a specific schematic diagram of a security chip according to an embodiment of the present application.
  • FIG. 8 is an attack detection circuit according to an embodiment of the present application.
  • FIG. 9 is another specific schematic diagram of a security chip according to an embodiment of the present application.
  • FIG. 10 is another specific schematic diagram of the security chip according to the embodiment of the present application.
  • FIG. 11 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • the embodiments of the present application are applicable to various types of chips, and are not limited to the specific size, process, and implemented functions of the chips.
  • the embodiments of the present application are especially suitable for special chips or security chips that can execute complex encryption and decryption algorithms.
  • the security chip can be an embedded security chip (embedded Security Element, eSE), a biological chip (such as a fingerprint sensor chip), a chip provided with various functional circuits (such as a processor chip), various chips in the field of Internet of Things etc.
  • the above-mentioned security chip can cooperate with a near field communication (Near Field Communication, NFC) chip to realize NFC card payment, authentication and other functions.
  • the security chip can include transistors, resistors, capacitors, inductors and other components and wiring devices.
  • the security chip may be a miniature electronic device or component carrying an integrated circuit (IC). This application does not specifically limit this.
  • the chips provided in the embodiments of the present application can be applied to mobile terminals such as smartphones, tablet computers, wearable devices, smart homes, and smart vehicles, or other electronic devices such as servers, supercomputing devices, and security devices. middle.
  • the security chip can usually be designed so that only authenticated users can store the sensitive data in the security chip in a specific way, so as to ensure the validity and reliability of the sensitive data. .
  • Semi-intrusive attack refers to an attack method that relies on the collected image signal, optical signal and other information to reverse-phase analyze the data and operating status of the security chip after opening the package structure of the security chip, such as laser attack.
  • a semi-intrusive attack does not require removal of the passivation layer of the security chip and does not require modification of the internal circuitry of the security chip.
  • An intrusive attack refers to a method in which the package structure of the security chip is violently opened, and the security chip is directly modified by means of micro-probes, FIB, etc. to obtain the information of the security chip.
  • the packaging structure of the security chip may be a ceramic material; or, in another cover-opening detection protection structure, an anti-corrosion material is bonded on both sides of the bare chip of the security chip.
  • the cost of these two protective structures is higher, and they only increase the difficulty of opening the cover. Attackers can still use chemical corrosion combined with physical methods to open the cover.
  • an additional metal cover plate can be added to the package structure of the security chip, and the security chip can be protected by detecting the resistance change of the metal cover plate.
  • an attacker can use chemical removal of the cover to expose the bare die of the security chip without damaging the metal cover.
  • an embodiment of the present application proposes a security chip, which can effectively improve the security performance of the security chip at a lower cost.
  • FIG. 1 is a schematic structural diagram of a security chip 100 according to an embodiment of the present application.
  • the security chip 100 may include a security chip body 110 , a conductive member 120 and a plastic package 130 . It should be noted that the security chip 100 may correspond to the package structure of the security chip mentioned above, and the security chip body 110 may correspond to the security chip mentioned above.
  • the security chip body 110 includes an internal circuit 111 and a first pad 113, the internal circuit 111 may include an attack detection circuit and/or a power supply circuit, the attack detection circuit may be used to detect whether the security chip 100 is attacked, and the power supply circuit may be used for The security chip body 110 is powered, and the first pad 113 is connected to the attack detection circuit and/or the power supply circuit.
  • At least part of the conductive member 120 is disposed on the upper surface of the security chip body 110 , the conductive member 120 is electrically connected to the first pad 113 and is connected to the attack detection circuit and/or the power circuit through the first pad 113 , the conductive member 120 is conductive and It can be dissolved in an acid solution, and the change of the conductive member 120 can trigger the protection of the security chip 110 by the attack detection circuit and/or the power circuit.
  • the plastic package 130 is used to encapsulate the security chip body 110 and the conductive parts 120 , so the first pads 113 are not exposed outside the security chip 100 , that is, the security chip body 110 and the conductive parts are plastic-sealed by the plastic package 130 .
  • the "change of the conductive part 120" may include: the conductive part 120 is missing or the shape of the conductive part 120 is changed.
  • the conductive member 120 in the embodiment of the present application may also be represented by other names.
  • the conductive member 120 may also be referred to as a safety bridge.
  • the attacker needs to use acid solution in the process of opening the cover of the security chip to attack the body of the security chip.
  • a conductive part that is conductive and can be dissolved in the acid solution is arranged on the surface of the body of the security chip, and the conductive part passes through the body of the security chip.
  • the first pad is connected to the attack detection circuit and/or the power circuit of the security chip body.
  • the security chip body 110 may further include second pads 112 , and the second pads 112 are disposed on the upper surface of the security chip body 110 .
  • the second pads may include test pads, input/output pads (ie, I/O pads), power pads, and ground pads, etc., and the test pads are used for testing before the security chip 100 is packaged.
  • the pads, the I/O pads can be connected with external circuits to realize input and output signals, and the power pads are used to realize the power supply function.
  • the plastic package 130 covers the second pads 112 , that is, the second pads 112 are not exposed on the outer surface of the security chip 100 .
  • the internal circuit 111 may further include a data processing circuit, which is connected to the second pad 112 and is used to operate and process data.
  • the data processing circuit may also be electrically connected to the attack detection circuit, and/or, the data processing circuit may also be electrically connected to the power supply circuit, and when the attack detection circuit and/or the power supply circuit protect the security chip 100, the data The processing circuit may not perform operations on the data or perform error operations and error processing on the data.
  • the internal circuit 111 may further include a storage circuit, which is electrically connected to the second pad 112 and to the data processing circuit, and is used for receiving the data after operation and processing by the data processing circuit, and storing the data.
  • the storage circuit may also be electrically connected to the attack detection circuit, and/or, the storage circuit may also be electrically connected to the power supply circuit, and when the attack detection circuit and/or the power supply circuit protect the security chip 100, the storage circuit may be Erase stored data.
  • the data processing circuit may be a central processing unit (Central Processing Unit, CPU).
  • CPU Central Processing Unit
  • the data processing circuit can also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuit (Application Specific Integrated Circuit, ASIC), ready-made programmable gate array (Field Programmable Gate Array, FPGA) Or other Programmable Logic Device (PLD), discrete gate or transistor logic device, discrete hardware components, etc.
  • DSP Digital Signal Processor
  • ASIC Application Specific Integrated Circuit
  • FPGA Field Programmable Gate Array
  • PLD Programmable Logic Device
  • the storage circuit may be a dynamic random access memory (Dynamic Random Access Memory, DRAM) circuit.
  • DRAM Dynamic Random Access Memory
  • the storage circuit can also be other types of storage circuits, such as other random access memory (Random Access Memory, RAM) circuits, read only memory (Read Only Memory, ROM) circuits, flash memory (Flash), and the like.
  • the first pad 113 and the second pad 112 may be the same. In this case, an attacker cannot determine which pads of the security chip body are.
  • the first pad can further improve the protection mechanism of the security chip.
  • the security chip 100 may further include a lead frame 140 disposed under the security chip body 110, and the lead frame 140 may be connected with the security chip body 110 through an adhesive layer.
  • a third pad is formed on the lead frame 140 , and the third pad is exposed under the security chip 100 after the plastic package 130 includes the security chip body 110 and the conductive member 120 .
  • the test pad may not be electrically connected to the third pad, and the I/O pad, the power pad
  • the pad and the ground pad can be electrically connected to the third pad, for example, can be connected to the third pad by means of gold wires.
  • FIG. 2 is a schematic diagram of the security chip 100
  • the packaging method of the security chip 100 in FIG. 2 is a Quad Flat No-lead (QFN) package
  • FIG. 3 is an attacker A schematic diagram of the security chip 100 after the cover is opened. It can be seen that, after the attacker attacks the security chip 100 by opening the cover, since the conductive parts 120 are dissolved in the acid solution used for opening the cover, the security chip 100 in FIG. 3 does not include the conductive parts 120, that is to say, All the conductive members 120 are dissolved in the acid solution. Of course, when an attacker attacks the security chip 100 by opening the cover, only a part of the conductive member 120 is dissolved in the acid solution.
  • QFN Quad Flat No-lead
  • the cap-opening acid solution used by the attacker may be nitric acid or a mixed solution containing nitric acid.
  • the mixed solution containing nitric acid may be a mixed solution of nitric acid and sulfuric acid.
  • the conductive member 120 may be any conductive material dissolved in nitric acid; or, the conductive member 120 may be any conductive material dissolved in a mixed solution containing nitric acid.
  • the conductive member 120 may be a metallic conductive material.
  • the conductive member 120 may be a non-metallic conductive material.
  • the elements of the material of the conductive part 120 may be close to the elements of the molding compound of the security chip 100 , for example, the elements of the material of the conductive part 120 and the elements of the molding compound of the security chip 100 may include elements such as hydrocarbons. It should be noted that although the material elements of the conductive parts 120 are close to those of the plastic sealing compound of the security chip, the conductive parts 120 are conductive and the plastic sealing parts are insulators.
  • the material elements of the conductive parts are close to the material elements of the molding compound, so that the attacker cannot determine the position of the conductive parts in the security chip, and cannot avoid the conductive parts when attacking the security chip, so that the security can be further improved. chip security.
  • the conductive member 120 may be a conductive ink applied by a screen printing process, and preferably, the conductive member 120 may be a carbon-based conductive ink.
  • the conductive member 120 may be a conductive oxide grown by a physical vapor deposition or chemical vapor deposition process, such as doped zinc oxide.
  • the conductive member 120 may be aluminum-doped zinc oxide (AZO) or indium-doped zinc oxide (IZO).
  • non-destructive methods such as X-ray detection methods
  • X-ray detection methods to detect the internal structure of the security chip body, and select the most appropriate opening scheme according to the detected internal structure of the security chip body.
  • These non-destructive detection methods are more effective for metal materials.
  • the conductive components are made of non-metallic materials, so due to the characteristics of the materials used, it is difficult for an attacker to accurately detect the position and shape of the conductive components in the security chip through non-destructive detection methods, making it difficult for the attacker to detect the security chip. Reproducing or reproducing the conductive parts after the chip is opened can further improve the effective protection of the security chip.
  • the conductive parts are generally the conductive inks described in the above content, compared with the anti-corrosion materials and ceramic packages added in some current solutions, the manufacturing costs of the conductive parts are lower, so that the conductive parts can be manufactured at a lower cost. Effectively improve the security performance of the security chip.
  • the position of the conductive member 120 in the security chip 100 is related to the position of the first pad 113 , and the position of the first pad 113 will be described in detail below.
  • the plurality of first pads 113 may be discretely distributed on the entire upper surface of the security chip body 110 , or, as shown in FIGS. 4-6 , the plurality of first pads 113 may be discretely distributed on a part of the upper surface of the security chip body 110 .
  • the security chip body 110 also includes test pads and I/O pads. The pads are connected to the conductive parts, so that the cost of the conductive parts can be reduced, and the manufacturing cost of the security chip can be further reduced.
  • the first pad 113 in FIG. 4 is arranged in the upper left corner of the upper surface of the security chip body 110
  • the first pad 113 in FIG. 5 is arranged in the outermost circle of the upper surface of the security chip body 110
  • the A pad 113 is disposed in the middle of the upper surface of the security chip body 110 .
  • the conductive part 120 may cover the security chip 110 .
  • the entire upper surface of the chip body 110 may not include a passivation layer, so that the process steps can be reduced while the security performance of the chip is improved, thereby reducing the cost as a whole.
  • the passivation layer can be used to isolate the security chip 100 from the external environment.
  • the conductive parts cover the entire upper surface of the security chip body, so that when an attacker attacks the security chip, no matter from which angle the attacker opens the security chip, the conductive parts can be dissolved in the attacker for the first time. Therefore, the attack detection circuit and/or the power supply circuit of the security chip body can be changed in a short time, and the protection mechanism of the security chip can be triggered.
  • the conductive member 120 may be disposed on a part of the upper surface of the security chip body 110 .
  • the conductive member 120 may be arranged at the outermost position of the upper surface of the security chip body 110 , or may be arranged at the upper right corner of the upper surface of the security chip body 110 , etc.; if the first pad 113 The arrangement is as shown in FIG. 6 , the conductive member 120 may be arranged in the middle position of the upper surface of the security chip body 110 .
  • the conductive member is arranged on a part of the upper surface of the security chip body, so that the manufacturing cost of the security chip can be reduced.
  • the arrangement of the conductive components in the security chip and the arrangement of the first pads shown in FIG. 4 to FIG. 6 are only examples, and the conductive components and the first pads may also be arranged on the security chip. Other positions are not specifically limited in this embodiment of the present application.
  • the security chip body 110 may further include a passivation layer 132 , a window is provided on the passivation layer 132 , and the first pad 113 is provided under the window.
  • the security chip 110 may further include an interconnection layer 133 .
  • the interconnection layer 133 may include a conductive metal layer 1501 and an insulating interlayer dielectric layer 1502 , and the passivation layer 132 is disposed on the upper surface of the interconnection layer 133 .
  • the material of the metal layer 1501 includes, but is not limited to, one or more of the following materials: titanium (Ti), copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), gold (Au), palladium ( Pd), or titanium nitride (TiN), tantalum nitride (TaN), and the like.
  • the interlayer dielectric layer 1502 may include, but is not limited to, silicon oxide (SiO 2 ), silicon nitride (SiN), silicon nitride nitride (SiCN), polyimide (PI), polybenzoxazole (Polybenzoxazole, One or more of PBO) and benzocyclobutene (Benzocyclobutene, BCB).
  • the conductive member 120 may be disposed over the passivation layer 132 and cover the window to electrically connect the first pad 113 .
  • FIG. 7 is a schematic diagram of a specific structure of the security chip 100 .
  • the security chip 100 may include conductive parts 120 and a security chip body 110 .
  • the security chip body 110 may include a first pad 113 , a passivation layer 132 , an interconnect layer 133 , a device layer 134 and a substrate 135 , the interconnect layer 133 may be the wiring of the internal circuit 111 , and the device layer 134 may be the internal circuit Components in 111.
  • the internal circuit of the security chip body is composed of physical structures such as the device layer and the interconnection layer, so as to realize functions such as encryption and random number generation in the security chip body.
  • the safety conductive member 120 is disposed above the passivation layer 132 and covers the window on the passivation layer 132 .
  • the passivation layer 132 may be prepared on the wafer first, and then the conductive member 120 may be grown on the upper surface of the passivation layer 132 .
  • the internal circuit 111 of the security chip body may include an attack detection circuit.
  • the conductive member 120 may be connected to the attack detection circuit through a plurality of first pads in the first pads 113 (for example, two first pads in FIG. 4 ) to detect the attack Wires or resistors in the circuit so that the attack detection circuit can protect the security chip 100 when the wires or resistors open.
  • the protection of the security chip 100 by attacking the detection circuit when the wire or the resistor is disconnected may include, but is not limited to:
  • the alarm signal under normal conditions is "0"
  • the alarm signal output by the attack detection circuit is "1"
  • an electronic device including the security chip can generate an alarm sound , for example, beep or beep, or the display of the electronic device may output text such as "attacked”.
  • Erasing the data stored in the storage circuit can be to erase all the data stored in the storage circuit, or it can be erased according to the security level of the data stored in the storage circuit, for example, the data with the highest security level can be erased;
  • the output results can be all "0” or all "1", or data that is not stored by the storage circuit itself can be output, so that the attacker can obtain wrong data.
  • the embodiment of the present application does not specifically limit the attack detection circuit, and any circuit that can implement the functions described above can be used as the attack detection circuit of the embodiment of the present application.
  • one end of the conductive member 120 may be connected to the power supply, and the other end of the conductive member 120 may be connected to the ground.
  • FIG. 8 shows a feasible attack detection circuit.
  • the resistor in FIG. 8 is the conductive member 120 .
  • the voltage of the detection point in the attack detection circuit is high, and the alarm signal output by the attack detection circuit is "0" (or "1").
  • the resistor is disconnected, the potential of the detection point is pulled down, and the alarm signal output by the attack detection circuit becomes "1" (or "0").
  • the conductive part 120 may overlap with the projection of the metal layer 1501 in the interconnect layer 133 on the surface perpendicular to the security chip body 110 , so that the conductive part 120 and the metal layer 1501 together with the passivation layer 132 between the conductive member 120 and the metal layer 1501 can form a capacitor in the attack detection circuit (as shown by the dotted box in FIG. 9 ), and the attack detection circuit can detect when the capacitance value of the capacitor changes.
  • the security chip 100 is protected.
  • the conductive parts and the metal layer and passivation layer in the security chip form capacitors in the internal circuit, so that when an attacker attacks the security chip, as long as the conductive parts change slightly, the capacitance value of the capacitor can change, which can improve the The detection accuracy of the internal circuit realizes the effective protection of the security chip.
  • the capacitance value of the capacitor is proportional to the overlapping area of the conductive member 120 and the metal layer 1501 . Changes in the area of the conductive member 120 can result in changes in capacitance.
  • the change in the capacitance value of the capacitor may be the increase or decrease of the capacitance of the capacitor.
  • the attack detection circuit protects the security chip 100, including but not limited to: issuing an alarm, erasing data stored in the storage circuit, restarting the security chip body 110, and outputting an error result Wait.
  • the internal circuit 111 may include a power supply circuit, and the conductive member 120 may be connected to the power supply circuit through at least part of the first pads 113 , so that the power supply circuit can be changed when the conductive member 120 changes The power supply to the security chip body 110 is stopped, so that the security chip body 110 cannot be powered on and work.
  • the conductive member 120 after the conductive member 120 is connected to the power circuit, it can be used as a wire or resistor of the power circuit, so that the power circuit can stop supplying power to the security chip body 110 when the wire or resistor is disconnected.
  • the conductive member 120 may be disposed between the passivation layer 132 and the interconnection layer 133 , that is, the conductive member 120 may be disposed under the passivation layer 132 and between the top metal layer of the interconnection layer 133 to electrically connect the first A bonding pad 113 is provided, and the conductive member 120 is at least partially exposed to the surface of the security chip body 110 through the window on the passivation layer 132 , that is, the conductive member 120 can be exposed at least partially through the window of the passivation layer 132 .
  • the conductive member 120 may be prepared on the wafer first, and then the passivation layer 132 may be grown on the upper surface of the conductive member 120 .
  • the internal circuit 111 of the security chip body may include an attack detection circuit.
  • the conductive member 120 may be connected to the attack detection circuit through a plurality of first pads in the first pads 113 (for example, two first pads in FIG. 4 ) to detect the attack Wires or resistors in the circuit so that the attack detection circuit can protect the security chip 100 when the wires or resistors open.
  • the attack detection circuit protects the security chip 100 when the wire or resistance is disconnected, which may include but not limited to: issuing an alarm, erasing data stored in the storage circuit, restarting the security chip body 110, and outputting an error result.
  • the internal circuit 111 may include a power supply circuit, and the conductive member 120 may be connected to the power supply circuit through at least part of the first pads 113 , so that the power supply circuit can be changed when the conductive member 120 changes The power supply to the security chip body 110 is stopped, so that the security chip body 110 cannot be powered on and work.
  • Mode 2 For the specific implementation manner of Mode 2, reference may be made to the description of Mode 1, which is not repeated here for the sake of brevity.
  • FIGS. 1 to 10 are only exemplary descriptions of the security chip. In other embodiments, it may be understood that the security chips in FIGS. 1 to 10 are rotated in space, or structurally Symmetrical settings, etc., all fall within the protection scope of the present application. For specific solutions, reference may be made to the above description, which will not be repeated herein.
  • the electronic device 200 may include a security chip 210 and a data transmission chip 220 , and the security chip 210 may be the security chip 100 in the foregoing embodiments.
  • the electronic device in the embodiments of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a game device, a vehicle-mounted electronic device, or a wearable smart device, and Electronic databases, automobiles, bank ATMs (Automated Teller Machine, ATM) and other electronic devices.
  • the wearable smart device includes full functions, large size, and can realize complete or partial functions without relying on smart phones, such as smart watches or smart glasses, etc., and only focus on a certain type of application function, which needs to cooperate with other devices such as smart phones. Use, such as various types of smart bracelets, smart jewelry and other equipment for physical monitoring.
  • the data transmission chip 220 can be used to transmit data and is connected to the security chip 210 .
  • the data transmission chip 220 may be an NFC chip, which cooperates with the security chip 210 to realize functions such as NFC card payment, authentication, and the like.
  • the data transmission chip 220 may also be a chip that performs network communication or data transmission, or the like.
  • the electronic device 200 may further include: a display screen.
  • the display screen can be used to display words such as "attacked” to remind the user to pay attention.
  • the display screen may be a non-folding display screen or a foldable display screen, that is, a flexible display screen, which is not specifically limited in this application.
  • the disclosed systems and apparatuses may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solutions of the embodiments of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium.
  • the technical solutions of the present application are essentially or part of contributions to the prior art, or all or part of the technical solutions can be embodied in the form of software products, and the computer software products are stored in a storage medium , including several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: U disk, mobile hard disk, Read-Only Memory (ROM, Read-Only Memory), Random Access Memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program codes .

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Storage Device Security (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

Puce de sécurité (100) et dispositif électronique. La présente invention permet d'améliorer efficacement les performances de sécurité de la puce de sécurité (100). La puce de sécurité (100) comprend : un corps de puce de sécurité (110), comprenant un circuit interne (111) et au moins un premier conducteur (113), le circuit interne (111) comprenant un circuit de détection d'attaque et un circuit d'alimentation électrique, le premier conducteur (113) étant électriquement connecté au circuit de détection d'attaque et au circuit d'alimentation électrique, le circuit de détection d'attaque étant utilisé pour détecter si la puce de sécurité (100) est attaquée, et le circuit d'alimentation électrique étant utilisé pour fournir de l'énergie à la puce de sécurité (100); un composant conducteur (120) placé sur une surface supérieure de la puce de sécurité (100), connecté électriquement au premier conducteur (113) et connecté au circuit de détection d'attaque et/ou au circuit d'alimentation électrique au moyen du premier conducteur (113); et un élément de conditionnement en plastique (130) utilisé pour réaliser un conditionnement en plastique sur le corps de puce de sécurité (110) et le composant conducteur (120), le composant conducteur (120) étant conducteur et étant au moins partiellement dissous dans une solution acide de telle sorte que le circuit de détection d'attaque ou le circuit d'alimentation électrique protège la puce de sécurité (100).
PCT/CN2020/107645 2020-08-07 2020-08-07 Puce de sécurité et dispositif électronique WO2022027535A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/107645 WO2022027535A1 (fr) 2020-08-07 2020-08-07 Puce de sécurité et dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/107645 WO2022027535A1 (fr) 2020-08-07 2020-08-07 Puce de sécurité et dispositif électronique

Publications (1)

Publication Number Publication Date
WO2022027535A1 true WO2022027535A1 (fr) 2022-02-10

Family

ID=80120113

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/107645 WO2022027535A1 (fr) 2020-08-07 2020-08-07 Puce de sécurité et dispositif électronique

Country Status (1)

Country Link
WO (1) WO2022027535A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115175504A (zh) * 2022-07-29 2022-10-11 苏州浪潮智能科技有限公司 一种防水装置及待防水设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102257516A (zh) * 2008-11-21 2011-11-23 美信法国有限公司 用于使电子集成电路外壳免受物理或化学侵入的设备
CN103500740A (zh) * 2013-10-10 2014-01-08 北京昆腾微电子有限公司 抗侵入式攻击的芯片及其制作方法和攻击检测的方法
CN203589016U (zh) * 2013-10-10 2014-05-07 昆腾微电子股份有限公司 抗侵入式攻击的芯片
CN103985674A (zh) * 2014-06-03 2014-08-13 山东华芯半导体有限公司 一种安全芯片防攻击结构及防攻击的方法
CN107949853A (zh) * 2015-04-14 2018-04-20 第资本服务公司 防篡改动态交易卡和提供防篡改动态交易卡的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102257516A (zh) * 2008-11-21 2011-11-23 美信法国有限公司 用于使电子集成电路外壳免受物理或化学侵入的设备
CN103500740A (zh) * 2013-10-10 2014-01-08 北京昆腾微电子有限公司 抗侵入式攻击的芯片及其制作方法和攻击检测的方法
CN203589016U (zh) * 2013-10-10 2014-05-07 昆腾微电子股份有限公司 抗侵入式攻击的芯片
CN103985674A (zh) * 2014-06-03 2014-08-13 山东华芯半导体有限公司 一种安全芯片防攻击结构及防攻击的方法
CN107949853A (zh) * 2015-04-14 2018-04-20 第资本服务公司 防篡改动态交易卡和提供防篡改动态交易卡的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115175504A (zh) * 2022-07-29 2022-10-11 苏州浪潮智能科技有限公司 一种防水装置及待防水设备
CN115175504B (zh) * 2022-07-29 2023-08-25 苏州浪潮智能科技有限公司 一种防水装置及待防水设备

Similar Documents

Publication Publication Date Title
US7923830B2 (en) Package-on-package secure module having anti-tamper mesh in the substrate of the upper package
JP5503526B2 (ja) Ｂｇａメッシュ・キャップを有するパッケージ・オン・パッケージ・セキュア・モジュール
TW388942B (en) Anti-tamper bond wire shield for an intergated circuit
US7402442B2 (en) Physically highly secure multi-chip assembly
US7791898B2 (en) Security apparatus
JP4702586B2 (ja) 指紋センサ及び指紋センサ実装構造並びに該指紋センサを備えた指紋検出器
EP2431911B1 (fr) Dispositif de protection d'un connecteur et d'un fil de communication d'un lecteur de carte à mémoire.
US20070245032A1 (en) System and method of a data blocker based on local monitoring of a soliciting website
WO2022027535A1 (fr) Puce de sécurité et dispositif électronique
TW201248511A (en) A mobile phone and a data authentication system of the dual chip of the smart card
CN103761806B (zh) 一种用于移动终端的金融安全***
EP2241997B1 (fr) Lecteur de carte mémoire
CN111738391B (zh) 安全芯片和电子设备
US11361207B1 (en) Chip card with on/off mechanisms
US20140204543A1 (en) Tamper protection device and data transaction apparatus
US8552566B1 (en) Integrated circuit package having surface-mount blocking elements
JP4836995B2 (ja) 集積回路モジュール
TW201601001A (zh) 安全元件
US7389542B2 (en) Authentication system having a semiconductor device containing data which are difficult to analyze through illegitimate access, and semiconductor device therefor
JP4181068B2 (ja) 集積回路モジュール
US20230401342A1 (en) Electronic tampering detection
CN116758683A (zh) 一种电子设备
CN108154049B (zh) 具有资料保护功能的电子设备
FR3037764A1 (fr) Composant de protection de signaux sensibles, dispositif et procede correspondant
WO2015007081A1 (fr) Procédé et dispositif de protection de tête magnétique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20948085

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20948085

Country of ref document: EP

Kind code of ref document: A1