WO2022014161A1 - Touch sensor and touch panel device - Google Patents

Touch sensor and touch panel device Download PDF

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Publication number
WO2022014161A1
WO2022014161A1 PCT/JP2021/019542 JP2021019542W WO2022014161A1 WO 2022014161 A1 WO2022014161 A1 WO 2022014161A1 JP 2021019542 W JP2021019542 W JP 2021019542W WO 2022014161 A1 WO2022014161 A1 WO 2022014161A1
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WO
WIPO (PCT)
Prior art keywords
conductive
outer peripheral
substrate
touch sensor
main body
Prior art date
Application number
PCT/JP2021/019542
Other languages
French (fr)
Japanese (ja)
Inventor
誠一 南
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2022536158A priority Critical patent/JPWO2022014161A1/ja
Publication of WO2022014161A1 publication Critical patent/WO2022014161A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Definitions

  • This disclosure relates to a resistance film type touch sensor and a touch panel device.
  • the touch sensor of Patent Document 1 is known as a resistance film type touch sensor capable of performing a pressing operation.
  • an upper substrate, an upper conductive layer arranged on the lower surface of the upper substrate, an upper electrode arranged on the lower surface of the upper conductive layer via an intermediate layer, and the upper conductive layer are opposed to each other by providing a predetermined gap.
  • a resistor provided with a lower conductive layer, a lower electrode arranged on the upper surface of the lower conductive layer, a lower substrate arranged on the lower surface of the lower conductive layer, and a wiring board arranged between the upper substrate and the lower substrate.
  • Membrane-type touch sensors are disclosed.
  • the present disclosure has been made in view of these points, and an object thereof is to keep the potential distribution of the conductive layer arranged on the lower surface of the substrate uniform in the resistance film type touch sensor, and to detect the position in the pressing operation.
  • the purpose is to properly prevent misalignment.
  • the resistance film type touch sensor includes a first substrate, a first conductive layer arranged on the lower surface of the first substrate, and a first conductive layer. It includes a pair of first electrodes arranged on the peripheral edge of the lower surface and having an electric resistance lower than the electric resistance of the first conductive layer, and a flexible wiring board arranged on the peripheral edge of the lower surface of the first substrate.
  • the first conductive layer is electrically insulated from the first conductive main body portion that is electrically connected to the pair of first electrodes and the first conductive main body portion, and the pair of first electrodes is attached from the lower peripheral edge of the first substrate.
  • a non-blocking first insulating portion arranged on the outer periphery of the first conductive main body portion so as to surround the first conductive main body portion, and a first insulating portion separated from the outer peripheral portion of the first conductive main body portion on the lower peripheral edge of the first substrate. It has a non-blocking first outer peripheral conductive portion that is arranged at a position and extends along the stretching direction of the first insulating portion.
  • Each of the pair of first electrodes is arranged at positions facing each other on the lower peripheral edge of the first conductive main body portion, and is continuous with the electrode portion and the electrode portion that are electrically connected to each other via the first conductive main body portion.
  • connection terminal portion arranged at a position not facing the electrode portion on the lower peripheral edge of the first conductive main body portion.
  • the connection terminal portion is electrically connected to the flexible wiring board.
  • Each of the first insulating portion and the first outer peripheral conductive portion is configured such that at least one end thereof is located in the vicinity of the connection terminal portion.
  • the first outer peripheral conductive portion is configured such that at least one end thereof is electrically conductive with the first conductive main body portion in the vicinity of the connection terminal portion.
  • the present disclosure it is possible to keep the potential distribution of the first conductive main body portion in the first conductive layer uniform and appropriately prevent the displacement of the detection position in the pressing operation.
  • FIG. 1 is an exploded perspective view showing a component of the touch sensor according to the first embodiment.
  • FIG. 2 is a vertical cross-sectional view showing a cross-sectional configuration of a position including an electrode portion of the first electrode on the peripheral portion of the touch sensor.
  • FIG. 3 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, and the first electrode when viewed from the upper side of the first substrate.
  • FIG. 4 is a plan view schematically showing the configuration of the first conductive layer when viewed from the upper side of the first substrate.
  • FIG. 5 is a plan view schematically showing the configurations of the second substrate, the second conductive layer, and the second electrode when viewed from the upper side of the first substrate.
  • FIG. 6 is a plan view schematically showing the configuration of the second conductive layer when viewed from the upper side of the second substrate.
  • FIG. 7 is a partially enlarged view showing the part A of FIG. 3 in an enlarged manner.
  • FIG. 8 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, and the first electrode of the touch sensor according to the second embodiment when viewed from the upper side of the first substrate.
  • FIG. 9 is a plan view schematically showing the configuration of the first conductive layer in the touch sensor according to the second embodiment when viewed from the upper side of the first substrate.
  • FIG. 10 is a vertical cross-sectional view showing a cross-sectional configuration of a position including an electrode portion in a peripheral portion of the touch sensor according to the third embodiment.
  • FIG. 11 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, and the first electrode of the touch sensor according to the third embodiment when viewed from the upper side of the first substrate.
  • FIG. 12 is a plan view schematically showing the configuration of the first conductive layer in the touch sensor according to the third embodiment when viewed from the upper side of the first substrate.
  • FIG. 13 is a partially enlarged view showing the portion B of FIG. 11 in an enlarged manner.
  • FIG. 14 is a vertical cross-sectional view showing a cross-sectional configuration of a position including an electrode portion in a peripheral portion of the touch panel device according to the fourth embodiment.
  • FIG. 15 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, the first electrode, and the second substrate of the touch panel device according to the fourth embodiment when viewed from the upper side of the first substrate. ..
  • the touch sensor 1 is a resistance film type sensor type input device.
  • the touch sensor 1 can operate various electronic devices connected to the touch sensor 1 by the user pressing the upper surface side of the first substrate 10 located directly above the operation space S (see FIG. 2) described later. It is configured in.
  • the touch sensor 1 is used as an input device for, for example, an in-vehicle device such as a car navigation system, a printer, a copier, a ticket vending machine, an automated teller machine, an operation screen for industrial equipment, a POS system, and the like.
  • the side on which the first board 10 described later is located is referred to as the "upper side” of the touch sensor 1
  • the side on which the second board 20 described later is located is referred to as the "lower side” of the touch sensor 1.
  • the positional relationship of each constituent element shall be determined.
  • the touch sensor 1 includes first and second substrates 10, 20.
  • the first substrate 10 is made of a highly light-transmitting resin film such as a polyethylene terephthalate resin.
  • the second substrate 20 is made of, for example, a glass material.
  • Each of the first and second substrates 10 and 20 has a substantially rectangular shape in a plan view.
  • the first and second substrates 10 and 20 are laminated and arranged so as to face each other with the operation space S sandwiched by the adhesive layer 2 described later.
  • the operation space S is a space surrounded by a first substrate 10, a second substrate 20, an adhesive layer 2 (described later), a first insulating coat layer 4 (described later), and a second insulating coat layer 5 (described later).
  • an adhesive layer 2 for bonding the first substrate 10 and the second substrate 20 is provided between the lower peripheral edge of the first substrate 10 and the upper surface peripheral edge of the second substrate 20. It is provided.
  • the adhesive layer 2 is made of, for example, an acrylic adhesive.
  • the adhesive layer 2 is formed in a frame shape in a plan view.
  • the adhesive layer 2 is arranged between the first insulating coat layer 4 and the second insulating coat layer 5, which will be described later.
  • the touch sensor 1 includes a flexible wiring board 3.
  • the flexible wiring board 3 is configured to be flexible and its electrical characteristics do not change even in a deformed state.
  • the flexible wiring board 3 is made of a flexible insulating film such as polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate (PEN).
  • the flexible wiring board 3 is fixed to the peripheral edges of the first substrate 10 and the second substrate 20 by, for example, an anisotropic conductive adhesive (not shown).
  • the flexible wiring board 3 is electrically connected to the first electrodes 30a and 30b and the second electrodes 40a and 40b, which will be described later.
  • the touch sensor 1 includes a first conductive layer 11.
  • the first conductive layer 11 is made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide.
  • the transparent conductive film is formed on the lower surface of the first substrate 10 by sputtering, a vapor deposition method, or the like.
  • the first conductive layer 11 is composed of a first conductive main body portion 12, first insulating portions 14a to 14 g, first outer peripheral conductive portions 15a and 15b, and dummy regions 16a and 16b. ing.
  • the first conductive main body portion 12 excludes the first insulating portions 14a to 14 g, the first outer peripheral conductive portions 15a and 15b, and the dummy regions 16a and 16b in the first conductive layer 11. It is formed in most areas.
  • the first conductive main body portion 12 is electrically connected to the first electrodes 30a and 30b, which will be described later.
  • the first conductive main body portion 12 includes an operation region 13 that can come into contact with the second conductive main body portion 22 by a pressing operation by the user.
  • the operation area 13 is arranged at a position corresponding to the operation space S (see FIG. 2) in the first conductive main body portion 12.
  • the operation area 13 is formed in a rectangular shape, for example.
  • the first insulating portions 14a to 14g are configured as, for example, a portion on the lower surface of the first substrate 10 where the transparent conductive film is not laminated. Specifically, each of the first insulating portions 14a to 14g is configured as a concave groove in which the transparent conductive film is formed on the lower surface of the first substrate 10 and then the transparent conductive film is removed by, for example, laser etching. As a result, the first insulating portions 14a to 14g are in a state of being electrically insulated from the first conductive main body portion 12.
  • each of the first insulating portions 14a to 14g is formed linearly.
  • the preferred line width of each of the first insulating portions 14a to 14g is, for example, 50 to 250 ⁇ m.
  • the first insulating portions 14a and 14b are arranged so as to surround the first electrodes 30a and 30b, which will be described later, at intervals from the lower peripheral edge of the first substrate 10.
  • the first insulating portions 14a and 14b are formed in a non-blocking shape in which the left side of the paper surface of FIGS. 2 and 3 is open.
  • the first insulating portion 14a is adjacent to the outer periphery of the first conductive main body portion 12.
  • the first insulating portion 14a extends along the outer circumference of the first conductive main body portion 12.
  • the first insulating portion 14b is arranged at a position away from the outer periphery of the first conductive main body portion 12 with the first insulating portion 14a and the first outer peripheral conductive portion 15a interposed therebetween.
  • the first insulating portion 14b is arranged between the first outer peripheral conductive portion 15a and the first outer peripheral conductive portion 15b.
  • the first insulating portion 14b extends along the stretching direction of the first insulating portion 14a.
  • the first insulating portion 14c is arranged on the right side of the paper surface with respect to the operation area 13 shown in FIGS. 2 and 3.
  • the first insulating portion 14c extends along the short side direction of the first substrate 10.
  • the lower end portion of the paper surface of FIGS. 2 and 3 is continuous with the first insulating portion 14a, while the upper end portion of the paper surface extends to the vicinity of the upper right corner portion of the paper surface of the operation region 13. It is configured in.
  • the first insulating portion 14d is provided to electrically separate the operation region 13 of the first conductive main body portion 12, each wiring portion 32 and each connection terminal portion 33 described later. Specifically, the first insulating portion 14d is arranged on the left side of the paper surface with respect to the operation region 13 shown in FIGS. 2 and 3. The first insulating portion 14d is arranged so as to face the first insulating portion 14c with the operation region 13 interposed therebetween. The first insulating portion 14d extends along the short side direction of the first substrate 10. In the first insulating portion 14d, the lower end of the paper surface of each drawing is located near the lower left corner of the operation area 13, while the upper end of the paper surface is near the upper left corner of the operation area 13. It is configured to extend to.
  • the first insulating portion 14e is arranged on the left side of the paper surface with respect to the operation area 13 shown in FIGS. 2 and 3.
  • the first insulating portion 14e extends along the long side direction of the first substrate 10. Specifically, the first insulating portion 14e extends from the side located on the left side of the paper surface of the first substrate 10 toward the first insulating portion 14d.
  • the first insulating portions 14f and 14g are arranged on the left side of the paper surface from the operation area 13 shown in FIGS. 2 and 3. Specifically, the first insulating portion 14f is arranged on the upper side of the paper surface with respect to the first insulating portion 14e, and is adjacent to the outer periphery of the dummy region 16a. The first insulating portion 14g is arranged below the paper surface of the first insulating portion 14e and is adjacent to the outer periphery of the dummy region 16b.
  • the first outer peripheral conductive portions 15a and 15b are made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide.
  • the first outer peripheral conductive portions 15a and 15b are hatched with dots in order to distinguish them from other configurations.
  • the first outer peripheral conductive portions 15a and 15b are arranged on the lower peripheral periphery of the first substrate 10. Specifically, the first outer peripheral conductive portions 15a and 15b are arranged so as to surround the first electrodes 30a and 30b, which will be described later, at intervals from the lower peripheral periphery of the first substrate 10.
  • Each of the first outer peripheral conductive portions 15a and 15b has both end portions 17 and 18 located in the vicinity of the connection terminal portion 33 described later, and both end portions 17 and 18 are connection terminals of the first electrodes 30a and 30b. It is configured to be electrically conductive with the first conductive main body portion 12 in the vicinity of the portion 33.
  • the first outer peripheral conductive portion 15a is arranged at a position separated from the outer periphery of the first conductive main body portion 12 by the first insulating portion 14a.
  • the first outer peripheral conductive portion 15a is arranged between the first insulating portion 14a and the first insulating portion 14b.
  • the first outer peripheral conductive portion 15a extends substantially in a band shape along the stretching direction of the first insulating portions 14a and 14b.
  • the first insulating portion 14a is formed in a non-blocking shape in which the left side of the paper surface of FIGS. 2 and 3 is open.
  • the first outer peripheral conductive portion 15b is arranged at a position separated from the outer periphery of the first conductive main body portion 12 by the first insulating portion 14a and the first outer peripheral conductive portion 15a.
  • the first outer peripheral conductive portion 15b extends substantially in a band shape along the stretching direction of the first insulating portion 14b.
  • the first insulating portion 14b is formed in a non-blocking shape in which the left side of the paper surface of FIGS. 2 and 3 is open.
  • the touch sensor 1 includes a pair of first electrodes 30a and 30b.
  • the first electrodes 30a and 30b have an electrical resistivity lower than the electrical resistivity of the first conductive layer 11 (first conductive main body portion 12).
  • the first electrodes 30a and 30b are made of, for example, a material containing silver or copper as a main component.
  • the first electrodes 30a and 30b are made of a material containing silver or copper with respect to a resin material such as a polyester resin.
  • the first electrodes 30a and 30b are arranged on the lower peripheral edge of the first conductive main body 12 (outside the operation region 13). The first electrodes 30a and 30b are electrically connected to the first conductive main body portion 12.
  • the first electrode 30a is located on the lower surface of the first conductive main body portion 12 from the vicinity of the end portion located at the lower right of the paper surface of the first insulating portion 14a to the upper right and upper left of the paper surface of the first insulating portion 14a. It extends in a band shape over the vicinity of the end portion (mounting position of the flexible wiring board 3) located on the left side of the paper surface of the first insulating portion 14e via the corner portion located at.
  • the first electrode 30b passes from the vicinity of the end portion of the first insulating portion 14c located on the lower side of the paper surface to the corner portion located on the lower left side of the paper surface of the first insulating portion 14a on the lower surface of the first conductive main body portion 12. It extends in a band shape over the vicinity of the end portion of the first insulating portion 14e located on the left side of the paper surface.
  • Each of the first electrodes 30a and 30b includes an electrode portion 31, a wiring portion 32, and a connection terminal portion 33.
  • Each of the electrode portions 31 of the first electrodes 30a and 30b extends linearly along the long side direction of the first substrate 10.
  • the electrode portion 31 of the first electrode 30a is arranged on the upper side of the paper surface with respect to the operation region 13 shown in FIG.
  • the electrode portion 31 of the first electrode 30b is arranged below the paper surface of the operation region 13 shown in FIG. That is, the electrode portion 31 of the first electrode 30a and the electrode portion 31 of the first electrode 30b are arranged at positions facing each other on the lower peripheral periphery of the first conductive main body portion 12.
  • the electrode portion 31 of the first electrode 30a and the electrode portion 31 of the first electrode 30b are electrically connected to each other via the operation region 13 of the first conductive main body portion 12.
  • the wiring portions 32 of the first electrodes 30a and 30b are arranged on the lower surface of the first conductive main body portion 12 on the left side of the paper surface with respect to the first insulating portion 14d shown in FIG.
  • the end portion located on the upper side of the paper surface of FIG. 3 is continuous with the electrode portion 31 of the first electrode 30a, while the end portion located on the lower side of the paper surface of FIG. 3 is the first insulating portion. It is configured to be located in the vicinity of 14e.
  • the end portion located on the lower side of the paper surface in FIG. 3 is continuous with the electrode portion 31 of the first electrode 30b, while the end portion located on the upper side of the paper surface in FIG. 3 is the first insulating portion. It is configured to be located in the vicinity of 14e.
  • connection terminal 33 of the first electrodes 30a and 30b is arranged at a position continuous with each electrode 31 and not facing each electrode 31 on the lower peripheral edge of the first conductive main body 12.
  • each connection terminal portion 33 is located on the left side of the paper surface with respect to the first insulating portion 14d shown in FIG. 3, and is arranged at a position away from the operation region 13 with the first insulating portion 14d interposed therebetween. .. Further, the connection terminal portions 33 are located in the vicinity of the first insulating portion 14e, and are arranged at intervals from each other with the first insulating portion 14e interposed therebetween.
  • Each connection terminal portion 33 is electrically connected to the flexible wiring board 3.
  • connection terminal portion 33 of the first electrode 30a extends from the end portion of the wiring portion 32 of the first electrode 30a located on the lower side of the paper surface toward the left side of the paper surface along the stretching direction of the first insulating portion 14e.
  • connection terminal portion 33 of the first electrode 30b extends from the end portion of the wiring portion 32 of the first electrode 30b located on the upper side of the paper surface toward the left side of the paper surface along the stretching direction of the first insulating portion 14e. ..
  • the first electrode 30a includes a dummy portion 34.
  • the dummy portion 34 is arranged on the left side of the operation area 13 shown in FIG.
  • the dummy portion 34 is arranged between the first insulating portion 14a and the first insulating portion 14c.
  • the end portion located on the lower side of the paper surface in FIG. 3 is located near the end portion located on the lower side of the paper surface in the first insulating portion 14c, while the end portion located on the upper side of the paper surface is continuous with the electrode portion 31. It is configured to do.
  • the touch sensor 1 includes a first insulating coat layer 4.
  • the first insulating coat layer 4 is made of an insulating material such as an acrylic resin.
  • the first insulating coat layer 4 is formed in a frame shape in a plan view.
  • the first insulating coat layer 4 is arranged at a position corresponding to each of the first electrodes 30a and 30b on the lower peripheral periphery of the first conductive main body portion 12.
  • the first insulating coat layer 4 is configured to cover the entire first electrodes 30a and 30b from below the first conductive layer 11 in the thickness direction of the touch sensor 1.
  • the touch sensor 1 includes a second conductive layer 21.
  • the second conductive layer 21 is made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide.
  • the transparent conductive film is formed on the upper surface of the second substrate 20 by sputtering, a vapor deposition method, or the like.
  • the second conductive layer 21 is composed of a second conductive main body portion 22, second insulating portions 24a to 24e, a second outer peripheral conductive portion 25, and dummy regions 26a, 26b, 26c. ing.
  • the second conductive main body portion 22 includes the second insulating portions 24a to 24e, the second outer peripheral conductive portion 25, and the dummy regions 26a, 26b, 26c. It is formed in most of the areas except.
  • the second conductive main body 22 is electrically connected to the second electrodes 40a and 40b, which will be described later.
  • the second conductive main body portion 22 includes an operation region 23 having the same size and shape as the operation region 13 of the first conductive main body portion 12.
  • the operation area 23 is arranged at a position corresponding to the operation space S (see FIG. 2) in the second conductive main body portion 22.
  • a plurality of dot spacers 27 are provided in the operation region 23 of the second conductive main body portion 22.
  • Each dot spacer 27 is made of an insulating resin such as an epoxy resin or a silicone resin.
  • Each dot spacer 27 has a substantially hemispherical shape.
  • the plurality of dot spacers 27 are formed on the upper surface of the second conductive main body portion 22.
  • the plurality of dot spacers 27 are arranged at intervals in the operation region 23.
  • the second insulating portions 24a to 24e are configured as portions on the upper surface of the second substrate 20 where the transparent conductive film is not laminated, similarly to the first insulating portions 14a to 14g. As a result, the second insulating portions 24a to 24e are in a state of being electrically insulated from the second conductive main body portion 22.
  • each of the second insulating portions 24a to 24e is formed in a linear shape.
  • the preferred line width of each of the second insulating portions 24a to 24e is, for example, 50 to 250 ⁇ m.
  • the second insulating portion 24a is arranged so as to surround the second electrodes 40a and 40b, which will be described later, with a space from the upper peripheral edge of the second substrate 20.
  • the second insulating portion 24a has a rectangular shape.
  • the second insulating portion 24a is formed in a closed shape capable of accommodating the second conductive main body portion 22 and the dummy regions 26a, 26b, 26c.
  • the second insulating portion 24b is arranged below the paper surface of the operation area 23 shown in FIGS. 5 and 6.
  • the second insulating portion 24b is arranged at a distance from the long side of the lower side of the paper surface in the second insulating portion 24a, and is adjacent to a part of the outer periphery of the dummy region 16a.
  • the second insulating portion 24b extends along the long side direction of the second substrate 20.
  • the second insulating portion 24b extends from the short side on the left side of the paper surface to the short side located on the right side of the paper surface in the first insulating portion 14a.
  • the second insulating portion 24c is arranged on the left side of the paper surface from the operation area 23 shown in FIGS. 5 and 6.
  • the second insulating portion 24c is adjacent to a part of the outer periphery of the dummy regions 26b and 26c.
  • the second insulating portion 24d is arranged on the left side of the paper surface from the operation area 23 shown in FIGS. 5 and 6.
  • the second insulating portion 24d is configured to separate the dummy region 26b and the dummy region 26c.
  • the second insulating portion 24e is arranged on the left side and the upper side of the paper surface with respect to the operation area 23 shown in FIGS. 5 and 6.
  • the second insulating portion 24e is a corner portion located on the upper right side of the paper surface of the operation area 23 from the short side located on the left side of the paper surface of the second substrate 20 and near the corner portion located on the upper left side of the paper surface of the operation area 23. It extends over the vicinity of.
  • the second outer peripheral conductive portion 25 is made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide.
  • the second outer peripheral conductive portion 25 is arranged outside the second insulating portion 24a on the lower peripheral edge of the second substrate 20.
  • the second outer peripheral conductive portion 25 has a square frame shape.
  • the touch sensor 1 includes a pair of second electrodes 40a and 40b.
  • the second electrodes 40a and 40b have an electrical resistivity lower than the electrical resistivity of the second conductive layer 21 (second conductive main body portion 22).
  • the second electrodes 40a and 40b are made of, for example, a material containing silver or copper as a main component.
  • the second electrodes 40a and 40b are arranged on the lower peripheral edge of the second conductive main body 22 (outside the operation region 23).
  • the second electrodes 40a and 40b are electrically connected to the second conductive main body portion 22.
  • the second electrode 40a is located on the upper right and upper left of the paper surface of the operation region 23 from the vicinity of the corner portion located at the lower right of the paper surface of the operation region 23 on the upper surface of the second conductive main body portion 22. It extends in a band shape through the corner portion and extends to the vicinity of the end portion (mounting position of the flexible wiring board 3) located on the left side of the paper surface of the second insulating portion 24e.
  • the second electrode 40b is arranged on the left side of the paper surface of the operation region 23 and has a substantially T-shape. Specifically, the second electrode 40b extends from the vicinity of the end portion of the second insulating portions 24c and 24e located on the left side of the paper surface toward the operating region 23 on the upper surface of the second conductive main body portion 22, and is located in the operating region 23. It branches toward both the vicinity of the upper left corner of the paper and the vicinity of the lower left corner of the paper.
  • the second electrode 40a includes an electrode portion 41, a wiring portion 42, and a connection terminal portion 43. Further, the second electrode 40b includes an electrode portion 41 and a connection terminal portion 43.
  • Each of the electrode portions 41 of the second electrodes 40a and 40b extends substantially in a band shape along the short side direction of the second substrate 20.
  • the electrode portion 41 of the second electrode 40a is arranged on the right side of the paper surface with respect to the operation region 23 shown in FIG.
  • the electrode portion 41 of the second electrode 40b is arranged on the left side of the paper surface with respect to the operation region 23 shown in FIG. That is, the electrode portion 41 of the second electrode 40a and the electrode portion 41 of the second electrode 40b are arranged at positions facing each other on the upper peripheral periphery of the second conductive main body portion 22.
  • the electrode portion 41 of the second electrode 40a and the electrode portion 41 of the second electrode 40b are electrically connected to each other via the operation region 23 of the second conductive main body portion 22.
  • the wiring portion 42 of the second electrode 40a is arranged on the upper surface of the second conductive main body portion 22 on the upper side and the left side of the paper surface with respect to the second insulating portion 24e shown in FIG.
  • the end portion located on the right side of the paper surface of FIG. 5 is continuous with the electrode portion 41 of the second electrode 40a, while the end portion located on the left side of the paper surface is the mounting position of the flexible wiring board 3. It is configured to be located in the vicinity.
  • connection terminal portions 43 of the second electrodes 40a and 40b are located near the intersection of the second insulating portion 24a and the second insulating portion 24e (on the left side of the paper in FIG. 5), and sandwich the second insulating portion 24e. They are arranged at intervals from each other. Each connection terminal portion 43 is electrically connected to the flexible wiring board 3.
  • connection terminal portion 43 of the second electrode 40a extends from the end portion of the wiring portion 42 of the second electrode 40a located on the lower side of the paper surface toward the left side of the paper surface along the long side direction of the second substrate 20. There is.
  • the connection terminal portion 43 of the second electrode 40b extends from the middle portion of the electrode portion 41 of the second electrode 40b toward the left side of the paper in FIG. 5 along the long side direction of the second substrate 20.
  • the touch sensor 1 includes dummy electrodes 44a and 44b.
  • the dummy electrode 44a is arranged below the paper surface of the operation region 23 shown in FIG.
  • the dummy electrode 44a is arranged in a rectangular region surrounded by the second insulating portion 24a and the second insulating portion 24b.
  • the dummy electrode 44b is located on the left side of the paper surface with respect to the operation region 23 shown in FIG.
  • the dummy electrode 44b is arranged in a rectangular region surrounded by the second insulating portions 24a to 24d.
  • the touch sensor 1 includes a second insulating coat layer 5.
  • the second insulating coat layer 5 is made of an insulating material such as an acrylic resin.
  • the second insulating coat layer 5 is formed in a frame shape in a plan view.
  • the second insulating coat layer 5 is arranged at a position corresponding to the second electrodes 40a and 40b on the upper peripheral periphery of the second conductive main body portion 22.
  • the second insulating coat layer 5 is configured to cover the entire second electrodes 40a and 40b from above the second conductive layer 21 in the thickness direction of the touch sensor 1.
  • the non-blocking first insulating portions 14a and 14b are electrically insulated from the first conductive main body portion 12, and the first electrodes 30a and 30b are connected to the lower peripheral periphery of the first substrate 10. It is arranged on the outer periphery of the first conductive main body portion 12 so as to surround the first conductive main body portion 12 at intervals. As shown in FIG. 2, when static electricity E charged on a finger, a pen, or the like during a pressing operation by a user is applied to the upper surface of the first substrate 10 by the first insulating portions 14a and 14b, for example, the first insulating portion 14a and 14b.
  • the static electricity E is arranged on the lower peripheral edge of the first substrate 10 at a position separated from the outer periphery of the first conductive main body portion 12 by the first insulating portions 14a and 14b. It flows into the first outer peripheral conductive portion 15a arranged at a position separated by the first insulating portion 14a from the outer periphery of the conductive portion 15b and the first conductive main body portion 12.
  • the static electricity E that has flowed into the first outer peripheral conductive portions 15a and 15b toward the vicinity of the connection terminal portions 33 in the first electrodes 30a and 30b having an electrical resistivity lower than the electrical resistivity of the first conductive layer 11. It flows.
  • FIG. 7 illustrates a case where a relatively strong static electricity E is applied to the upper surface of the first substrate 10 and flows into both the first outer peripheral conductive portions 15a and 15b. If a relatively weak static electricity E is applied to the upper surface of the first substrate 10, most of the static electricity E flows into the first outer peripheral conductive portion 15b located on the outside, and the first outer peripheral conductive portion 15a located on the inner side. The static electricity E flowing through is small.
  • Each of the first outer peripheral conductive portions 15a and 15b is configured such that both end portions 17 and 18 are electrically conductive with the first conductive main body portion 12 in the vicinity of each connection terminal portion 33.
  • the static electricity E is transmitted from the end portion 17 (or the end portion 18) to the wiring portion 32 from the lower peripheral edge position of the first conductive main body portion 12 in the vicinity of the connection terminal portion 33.
  • an external device (not shown) is connected to the connection terminal portion 33 via the flexible wiring board 3.
  • static electricity countermeasure parts for example, Zener diode, ESD suppressor, varistor).
  • the static electricity E transmitted to the wiring unit 32 flows toward the connection terminal unit 33, and is further connected to the touch sensor 1 from the connection terminal unit 33 via the flexible wiring board 3 (FIG. FIG. It flows toward (not shown).
  • the static electricity E flowing from the end portion 17 (or the end portion 18) to the wiring portion 32 is prevented from flowing toward the operation region 13 of the first conductive main body portion 12 by the first insulating portion 14d.
  • the influence of the static electricity E on the interface between the first conductive main body portion 12 and the electrode portion 31 can be suppressed, and the electrode portion 31 is less likely to be peeled off from the first conductive main body portion 12. Therefore, in the touch sensor 1 of the first embodiment, the potential distribution in the first conductive main body portion 12 can be kept uniform, and the deviation of the detection position in the pressing operation can be appropriately prevented.
  • the touch sensor 1 of the first embodiment since the first outer peripheral conductive portions 15a and 15b have a non-blocking state, a separate routing wiring (not shown) is provided for the first outer peripheral conductive portions 15a and 15b. It is not necessary, and the touch sensor 1 can be configured as a touch sensor of an existing four-wire resistance film.
  • the second conductive layer 21 is electrically insulated from the second conductive main body portion 22 and is arranged so as to surround the pair of second electrodes 40a and 40b at intervals from the lower peripheral edge of the second substrate 20. It has two insulating portions 24a.
  • the second insulating portion 24a prevents static electricity E applied to the upper surface of the first substrate 10 from flowing into the second conductive main body portion 22 of the second conductive layer 21 arranged on the upper surface of the second substrate 20. As a result, the static electricity E can be appropriately guided toward the first outer peripheral conductive portions 15a and 15b arranged on the lower surface of the first substrate 10.
  • [Second Embodiment] 8 and 9 show the touch sensor 1 according to the second embodiment of the present disclosure.
  • the configuration of the first insulating portion 14c and the configuration of the first outer peripheral conductive portions 15a and 15b are mainly different from those of the first embodiment.
  • the other configuration of the touch sensor 1 according to the second embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • the configuration of the first insulating portion 14c shown in the first embodiment is partially different. Specifically, the end portion of the first insulating portion 14c located on the lower side of the paper surface extends beyond the first insulating portions 14a and 14b to the long side located on the lower side of the paper surface of the first substrate 10. That is, the first insulating portion 14c is configured as an element for dividing each of the first outer peripheral conductive portions 15a and 15b into two.
  • Each of the first outer peripheral conductive portions 15a and 15b is divided into two by the first insulating portion 14c. That is, each of the first outer peripheral conductive portions 15a and 15b is configured to be paired.
  • the pair of first outer peripheral conductive portions 15a and 15a are located in the vicinity of the first insulating portion 14c while their respective end portions 17 are electrically conductive with the first conductive main body portion 12 in the vicinity of the connection terminal portion 33.
  • the end portions 18, 18 are configured to be electrically insulated from each other by the first insulating portion 14c.
  • the pair of first outer peripheral conductive portions 15b and 15b are also configured in the same manner as the pair of first outer peripheral conductive portions 15a and 15a. With such a configuration, it is possible to suppress the generation of noise caused by the first outer peripheral conductive portions 15a and 15a and the pair of first outer peripheral conductive portions 15b and 15b.
  • FIGS. 1 to 7 show the touch sensor 1 according to the third embodiment of the present disclosure.
  • the first insulating portion 14b and the first outer peripheral conductive portion 15b are not provided, but a new configuration is added.
  • the other configuration of the touch sensor 1 according to the third embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • the first insulating portions 14a, 14c to 14h are configured.
  • the first insulating portion 14h is an element for dividing the first outer peripheral conductive portions 15a and 15a into two.
  • the first insulating portion 14h is located on the extension line of the side of the first insulating portion 14a located on the right side of the paper surface of FIGS. 11 and 12. Specifically, the first insulating portion 14h extends from the end portion of the first insulating portion 14a located at the lower right side of the paper surface toward the long side of the first substrate 10 located below the paper surface.
  • the first outer peripheral conductive portion 15a is hatched with dots in order to distinguish it from other configurations.
  • the first outer peripheral conductive portions 15a and 15a are divided into two by the first insulating portion 14h. That is, the first outer peripheral conductive portions 15a and 15a are configured to be paired.
  • the pair of first outer peripheral conductive portions 15a and 15a have their respective ends 17 electrically conducting with the first conductive main body portion 12 in the vicinity of the connection terminal portion 33, while the ends located in the vicinity of the first insulating portion 14h.
  • the portions 18 and 18 are configured to be electrically insulated from each other by the first insulating portion 14h.
  • the touch sensor 1 includes a pair of outer peripheral electrodes 35 and 35.
  • Each outer peripheral electrode 35 has an electrical resistivity lower than the electrical resistivity of the first conductive layer 11.
  • the same material as that of the first electrodes 30a and 30b is preferable. That is, each outer peripheral electrode 35 contains a material containing silver or copper as a main component.
  • the outer peripheral electrode 35 extends substantially in a band shape along the stretching direction of the first outer peripheral conductive portion 15a.
  • the width of each outer peripheral electrode 35 is preferably formed to be at least narrower than the width of each electrode portion 31. Further, it is preferable that the thickness of each outer peripheral electrode 35 is formed to be about the same as the thickness of each electrode portion 31.
  • the outer peripheral electrode 35 is arranged on the lower peripheral edge of the first outer peripheral conductive portion 15a.
  • the pair of outer peripheral electrodes 35, 35 have their respective end portions 36 located in the vicinity of the connection terminal portion 33 electrically conductive with the wiring portion 32, while the end portions 37 located in the vicinity of the first insulating portion 14h. , 37 are configured to be electrically insulated from each other by the first insulating portion 14h.
  • one of the outer peripheral electrodes 35 passes from the vicinity of the first insulating portion 14h to the corner portions located on the upper right and upper left of the paper surface of FIG. 11 on the first substrate 10 on the lower surface of the first conductive main body portion 12. , It extends in a band shape over the middle portion of the wiring portion 32. Further, the other outer peripheral electrode 35 is located on the lower surface of the first conductive main body portion 12, from the vicinity of the first insulating portion 14h, through the corner portion located at the lower left of the paper surface of the first substrate 10, and the middle portion of the wiring portion 32. It extends in a band shape.
  • the first insulating coat layer 4 has the first electrodes 30a and 30b from below the first conductive layer 11 and the first outer peripheral conductive portion 15a in the thickness direction of the touch sensor 1. It is configured to cover the entire outer peripheral electrodes 35 and 35.
  • the static electricity E is applied to the electrical resistivity of the first conductive layer 11. It is possible to guide toward the outer peripheral electrode 35 having an electrical resistivity lower than the rate.
  • the static electricity E that has flowed into the outer peripheral electrode 35 flows from the end portion 36 of the outer peripheral electrode 35 toward the connection terminal portion 33 via the wiring portion 32 in the vicinity of the connection terminal portion 33 (shown in FIG. 13). See the dashed arrow). Further, the static electricity E flows out from the connection terminal portion 33 toward an external device (not shown) connected to the touch sensor 1 via the flexible wiring board 3.
  • the outer peripheral electrode 35 can suppress the influence of the static electricity E on the interface between the first conductive main body portion 12 and the electrode portion 31, and the electrode portion 31 is the first conductive main body. It becomes difficult to peel off from the portion 12. Therefore, in the touch sensor 1 of this embodiment, even when a relatively strong static electricity E is applied to the upper surface of the first substrate 10, the potential distribution in the first conductive main body 12 is kept uniform and pressed. It is possible to appropriately prevent the deviation of the detection position in the operation.
  • the outer peripheral electrode 35 contains a material containing silver or copper as a main component, it becomes easy to make the electrical resistivity of the outer peripheral electrode 35 relatively small. As a result, even when a relatively strong static electricity E is applied to the upper surface of the first substrate 10, the static electricity E is surely applied from the outer peripheral electrode 35 to the connection terminal portions 33 of the first electrodes 30a and 30b. It can be stably guided toward.
  • [Fourth Embodiment] 14 and 15 show the touch panel device 100 according to the fourth embodiment of the present disclosure.
  • the touch panel device 100 includes a touch panel 1, a housing 101, and a display panel 102.
  • the outer peripheral edge portion of the first substrate 10 and the outer peripheral edge portion of the second substrate 20 are not aligned in a plan view as compared with the first embodiment.
  • the other configuration of the touch sensor 1 according to the fourth embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • the touch panel 1 and the display panel 102 are arranged inside the housing 101.
  • the display panel 102 is composed of a liquid crystal panel or an organic EL panel (OLED panel).
  • the display panel 102 is arranged on the lower surface side of the second substrate 20.
  • a display drive device (not shown) for displaying an image is connected to the display panel 102.
  • the lower surface of the display panel 102 is fixed to the housing 101 and the upper surface is fixed to the second substrate 20 via the adhesive member 103.
  • the adhesive member 103 is a member used for fixing the touch panel 1 and the liquid crystal panel 102 in the housing 101, such as double-sided tape.
  • the outer peripheral edge portion of the first substrate 10 is arranged inside the outer peripheral edge portion of the second substrate 20 in a plan view. Specifically, in a plan view, the entire circumference of the outer peripheral edge portion of the first substrate 10 is arranged inside the outer peripheral edge portion of the second substrate 20. Since the outer peripheral edge portion of the first substrate 10 is inside the outer peripheral edge portion of the second substrate, the distance between the position where the static electricity E is applied and the first outer peripheral conductive portions 15a and 15b becomes small. Therefore, even if the static electricity E is a low voltage, the static electricity E flowing through the first peripheral conductive portions 15a and 15b can be guided to an external device (not shown). As a result, the electrode portion 31 is less likely to be peeled off from the first conductive main body portion 12 as in the first embodiment described above. Therefore, the touch panel device 100 of this embodiment can improve the durability against static electricity E.
  • the housing 101 and the first substrate 10 are arranged with a space d.
  • the first board 10 and the housing 101 are insulated from each other.
  • the static electricity E is less likely to flow to the housing 101, so that the static electricity E can be more reliably guided to the first outer peripheral conductive portions 15a and 15b. Therefore, the touch panel device 100 of this embodiment can suppress the flow of static electricity E to a portion other than the first outer peripheral conductive portion 15a, so that the occurrence of failure of the touch panel device 100 can be suppressed.
  • the interval d is preferably 0.2 mm or more, more preferably 0.3 mm or more, and particularly preferably 0.5 mm or more. Further, an insulating film or the like for insulating the housing 101 and the first substrate 10 may be arranged at the interval d.
  • first insulating portions 14a and 14b and the first outer peripheral conductive portions 15a and 15b are provided, but the present invention is not limited to this embodiment.
  • first insulating portion 14a and the first outer peripheral conductive portion 15a may be provided.
  • the outer peripheral edge portion of the first substrate 10 and the outer peripheral edge portion of the second substrate 20 are configured to be at the same position in a plan view, but the first substrate 10
  • the outer peripheral edge portion of the second substrate 20 may be configured to be inside the outer peripheral edge portion of the second substrate 20 in a plan view, or may be configured to be outside in a plan view.
  • the present disclosure can be industrially used as a resistance film type touch sensor capable of performing a pressing operation.
  • Touch sensor 3 Flexible wiring plate 10: First substrate 11: First conductive layer 12: First conductive main body 13: Operation regions 14a to 14h: First insulating portions 15a, 15b: First outer peripheral conductive portion 20: 2nd substrate 21: 2nd conductive layer 22: 2nd conductive main body 23: operation area 24a to 24e: 2nd insulating part 25: 2nd outer peripheral conductive part 30a, 30b: 1st electrode 31: electrode part 32: wiring part 33: Connection terminal 35: Outer peripheral electrodes 40a, 40b: Second electrode 41: Electrode 42: Wiring 43: Connection terminal 100: Touch panel device 101: Housing 102: Display panel S: Operation space E: Static electricity

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Abstract

Each first electrode (30a, 30b) includes an electrode part (31) and a connection terminal part (33). The connection terminal part (33) is electrically connected to a flexible wiring board (3). At least one end portion of each of first insulation parts (14a, 14b) and first outer-peripheral conduction parts (15a, 15b) is configured so as to be located in the vicinity of each connection terminal part (33). The first outer-peripheral conduction parts (15a, 15b) are configured such that at least an end portion (17) is electrically connected to a first conductor body part (12) in the vicinity of the connection terminal part (33).

Description

タッチセンサおよびタッチパネル装置Touch sensor and touch panel device
　本開示は抵抗膜式のタッチセンサおよびタッチパネル装置に関するものである。 This disclosure relates to a resistance film type touch sensor and a touch panel device.
　従来から、押圧操作を行うことが可能な抵抗膜式のタッチセンサに関し、例えば特許文献１のタッチセンサが知られている。 Conventionally, for example, the touch sensor of Patent Document 1 is known as a resistance film type touch sensor capable of performing a pressing operation.
　特許文献１には、上基板と、上基板の下面に配置した上導電層と、中間層を介して上導電層の下面に配置した上電極と、上導電層と所定の空隙を設けて対向した下導電層と、下導電層の上面に配置した下電極と、下導電層の下面に配置した下基板と、上基板と下基板との間に配置された配線基板と、を備えた抵抗膜式のタッチセンサが開示されている。 In Patent Document 1, an upper substrate, an upper conductive layer arranged on the lower surface of the upper substrate, an upper electrode arranged on the lower surface of the upper conductive layer via an intermediate layer, and the upper conductive layer are opposed to each other by providing a predetermined gap. A resistor provided with a lower conductive layer, a lower electrode arranged on the upper surface of the lower conductive layer, a lower substrate arranged on the lower surface of the lower conductive layer, and a wiring board arranged between the upper substrate and the lower substrate. Membrane-type touch sensors are disclosed.
特開２０１３－９７４１５号公報Japanese Unexamined Patent Publication No. 2013-97415
　特許文献１のタッチセンサにおいて、例えば使用者の押圧操作時に指やペンなどに帯電していた静電気が上基板の上面に印加された場合には、上記静電気が、上基板の上面から側端部を経由して上基板の下面に位置する上導電層および上電極に向かって流れようとする。この静電気は、上電極と電気的に接続される配線基板からタッチセンサに接続される外部の制御回路に向かって流れていき、当該制御回路に組み込まれた静電気対策部品などにより影響が生じない程度の電圧まで降圧される。 In the touch sensor of Patent Document 1, for example, when static electricity charged on a finger or a pen during a pressing operation by a user is applied to the upper surface of the upper substrate, the static electricity is applied to the side end portion from the upper surface of the upper substrate. It tries to flow toward the upper conductive layer and the upper electrode located on the lower surface of the upper substrate via the above. This static electricity flows from the wiring board electrically connected to the upper electrode toward the external control circuit connected to the touch sensor, and is not affected by the static electricity countermeasure parts incorporated in the control circuit. It is stepped down to the voltage of.
　しかしながら、上基板の上面に比較的強い静電気が印加された場合には、上記静電気が上導電層と上電極との界面に影響を与え、上電極が上導電層から剥離しやすくなってしまう。その結果、特許文献１のタッチセンサでは、上導電層において電位分布が不均一となり、押圧操作による検出位置のずれが起こりやすくなっていた。 However, when a relatively strong static electricity is applied to the upper surface of the upper substrate, the static electricity affects the interface between the upper conductive layer and the upper electrode, and the upper electrode is easily peeled off from the upper conductive layer. As a result, in the touch sensor of Patent Document 1, the potential distribution becomes non-uniform in the upper conductive layer, and the detection position is liable to shift due to the pressing operation.
　本開示は斯かる点に鑑みてなされたものであり、その目的は、抵抗膜式のタッチセンサにおいて、基板の下面に配置した導電層の電位分布を均一に保つとともに、押圧操作における検出位置のずれを適切に防止することにある。 The present disclosure has been made in view of these points, and an object thereof is to keep the potential distribution of the conductive layer arranged on the lower surface of the substrate uniform in the resistance film type touch sensor, and to detect the position in the pressing operation. The purpose is to properly prevent misalignment.
　上記の目的を達成するために、本開示の一実施形態に係る抵抗膜式のタッチセンサは、第１基板と、第１基板の下面に配置される第１導電層と、第１導電層の下面周縁に配置され、第１導電層の電気抵抗率よりも低い電気抵抗率を有する一対の第１電極と、第１基板の下面周縁に配置されるフレキシブル配線板と、を備えている。第１導電層は、一対の第１電極と電気的に接続される第１導電本体部と、第１導電本体部と電気的に絶縁され、一対の第１電極を第１基板の下面周縁から間隔をあけて囲むように第１導電本体部の外周に配置される非閉塞状の第１絶縁部と、第１基板の下面周縁において第１導電本体部の外周から第１絶縁部を隔てた位置に配置され、第１絶縁部の延伸方向に沿って延びる非閉塞状の第１外周導電部と、を有している。一対の第１電極の各々は、第１導電本体部の下面周縁において互いに対向する位置に配置され、第１導電本体部を介して互いに電気的に接続される電極部と、電極部と連続しかつ第１導電本体部の下面周縁において電極部と対向しない位置に配置される接続端子部と、を含む。接続端子部は、フレキシブル配線板と電気的に接続されている。第１絶縁部および第１外周導電部の各々は、少なくとも一方の端部が接続端子部の近傍に位置するように構成されている。そして、第１外周導電部は、少なくとも一方の端部が接続端子部の近傍で第１導電本体部と電気的に導通するように構成されている。 In order to achieve the above object, the resistance film type touch sensor according to the embodiment of the present disclosure includes a first substrate, a first conductive layer arranged on the lower surface of the first substrate, and a first conductive layer. It includes a pair of first electrodes arranged on the peripheral edge of the lower surface and having an electric resistance lower than the electric resistance of the first conductive layer, and a flexible wiring board arranged on the peripheral edge of the lower surface of the first substrate. The first conductive layer is electrically insulated from the first conductive main body portion that is electrically connected to the pair of first electrodes and the first conductive main body portion, and the pair of first electrodes is attached from the lower peripheral edge of the first substrate. A non-blocking first insulating portion arranged on the outer periphery of the first conductive main body portion so as to surround the first conductive main body portion, and a first insulating portion separated from the outer peripheral portion of the first conductive main body portion on the lower peripheral edge of the first substrate. It has a non-blocking first outer peripheral conductive portion that is arranged at a position and extends along the stretching direction of the first insulating portion. Each of the pair of first electrodes is arranged at positions facing each other on the lower peripheral edge of the first conductive main body portion, and is continuous with the electrode portion and the electrode portion that are electrically connected to each other via the first conductive main body portion. It also includes a connection terminal portion arranged at a position not facing the electrode portion on the lower peripheral edge of the first conductive main body portion. The connection terminal portion is electrically connected to the flexible wiring board. Each of the first insulating portion and the first outer peripheral conductive portion is configured such that at least one end thereof is located in the vicinity of the connection terminal portion. The first outer peripheral conductive portion is configured such that at least one end thereof is electrically conductive with the first conductive main body portion in the vicinity of the connection terminal portion.
　本開示によると、第１導電層における第１導電本体部の電位分布を均一に保つとともに、押圧操作における検出位置のずれを適切に防止することができる。 According to the present disclosure, it is possible to keep the potential distribution of the first conductive main body portion in the first conductive layer uniform and appropriately prevent the displacement of the detection position in the pressing operation.
図１は、第１実施形態に係るタッチセンサの構成要素を示す分解斜視図である。FIG. 1 is an exploded perspective view showing a component of the touch sensor according to the first embodiment. 図２は、タッチセンサの周縁部分において第１電極の電極部を含む位置の断面構成を示した縦断面図である。FIG. 2 is a vertical cross-sectional view showing a cross-sectional configuration of a position including an electrode portion of the first electrode on the peripheral portion of the touch sensor. 図３は、第１基板、第１導電層、および第１電極の構成を、第１基板の上側から見て概略的に示した透視図である。FIG. 3 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, and the first electrode when viewed from the upper side of the first substrate. 図４は、第１導電層の構成を、第１基板の上側から見て概略的に示した平面図である。FIG. 4 is a plan view schematically showing the configuration of the first conductive layer when viewed from the upper side of the first substrate. 図５は、第２基板、第２導電層、および第２電極の構成を、第１基板の上側から見て概略的に示した平面図である。FIG. 5 is a plan view schematically showing the configurations of the second substrate, the second conductive layer, and the second electrode when viewed from the upper side of the first substrate. 図６は、第２導電層の構成を、第２基板の上側から見て概略的に示した平面図である。FIG. 6 is a plan view schematically showing the configuration of the second conductive layer when viewed from the upper side of the second substrate. 図７は、図３のＡ部を拡大して示した部分拡大図である。FIG. 7 is a partially enlarged view showing the part A of FIG. 3 in an enlarged manner. 図８は、第２実施形態に係るタッチセンサの第１基板、第１導電層、および第１電極の構成を、第１基板の上側から見て概略的に示した透視図である。FIG. 8 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, and the first electrode of the touch sensor according to the second embodiment when viewed from the upper side of the first substrate. 図９は、第２実施形態に係るタッチセンサにおける第１導電層の構成を、第１基板の上側から見て概略的に示した平面図である。FIG. 9 is a plan view schematically showing the configuration of the first conductive layer in the touch sensor according to the second embodiment when viewed from the upper side of the first substrate. 図１０は、第３実施形態に係るタッチセンサの周縁部分において電極部を含む位置の断面構成を示した縦断面図である。FIG. 10 is a vertical cross-sectional view showing a cross-sectional configuration of a position including an electrode portion in a peripheral portion of the touch sensor according to the third embodiment. 図１１は、第３実施形態に係るタッチセンサの第１基板、第１導電層、および第１電極の構成を、第１基板の上側から見て概略的に示した透視図である。FIG. 11 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, and the first electrode of the touch sensor according to the third embodiment when viewed from the upper side of the first substrate. 図１２は、第３実施形態に係るタッチセンサにおける第１導電層の構成を、第１基板の上側から見て概略的に示した平面図である。FIG. 12 is a plan view schematically showing the configuration of the first conductive layer in the touch sensor according to the third embodiment when viewed from the upper side of the first substrate. 図１３は、図１１のＢ部を拡大して示した部分拡大図である。FIG. 13 is a partially enlarged view showing the portion B of FIG. 11 in an enlarged manner. 図１４は、第４実施形態に係るタッチパネル装置の周縁部分において電極部を含む位置の断面構成を示した縦断面図である。FIG. 14 is a vertical cross-sectional view showing a cross-sectional configuration of a position including an electrode portion in a peripheral portion of the touch panel device according to the fourth embodiment. 図１５は、第４実施形態に係るタッチパネル装置の第１基板、第１導電層、第１電極および第２基板の構成を、第１基板の上側から見て概略的に示した透視図である。FIG. 15 is a perspective view schematically showing the configurations of the first substrate, the first conductive layer, the first electrode, and the second substrate of the touch panel device according to the fourth embodiment when viewed from the upper side of the first substrate. ..
　以下、本開示の各実施形態を図面に基づいて詳細に説明する。以下の各実施形態の説明は、本質的に例示に過ぎず、本開示、その適用物或いはその用途を制限することを意図するものではない。 Hereinafter, each embodiment of the present disclosure will be described in detail based on the drawings. The following description of each embodiment is merely exemplary and is not intended to limit the disclosure, its application or its use.
　［第１実施形態］
　本開示の第１実施形態に係るタッチセンサ１は、抵抗膜方式のセンサ型入力装置である。タッチセンサ１は、後述する操作空間Ｓ（図２参照）の真上に位置する第１基板１０の上面側を使用者が押圧することにより、タッチセンサ１に接続された各種電子機器を操作可能に構成されている。タッチセンサ１は、例えばカーナビゲーション等の車載装置、プリンタ、コピー機、券売機、現金自動預け払い機、産業用機器用の操作画面、ＰＯＳシステムなどに対する入力装置として用いられる。 [First Embodiment]
The touch sensor 1 according to the first embodiment of the present disclosure is a resistance film type sensor type input device. The touch sensor 1 can operate various electronic devices connected to the touch sensor 1 by the user pressing the upper surface side of the first substrate 10 located directly above the operation space S (see FIG. 2) described later. It is configured in. The touch sensor 1 is used as an input device for, for example, an in-vehicle device such as a car navigation system, a printer, a copier, a ticket vending machine, an automated teller machine, an operation screen for industrial equipment, a POS system, and the like.
　以下の説明において、後述する第１基板１０が位置する側をタッチセンサ１の「上側」とし、後述する第２基板２０が位置する側をタッチセンサ１の「下側」として、タッチセンサ１を構成する各要素の位置関係を定めるものとする。 In the following description, the side on which the first board 10 described later is located is referred to as the "upper side" of the touch sensor 1, and the side on which the second board 20 described later is located is referred to as the "lower side" of the touch sensor 1. The positional relationship of each constituent element shall be determined.
　（第１および第２基板）
　図１に示すように、タッチセンサ１は、第１および第２基板１０，２０を備えている。第１基板１０は、例えばポリエチレンテレフタレート系樹脂等の光透過性の高い樹脂フィルムにより構成されている。第２基板２０は、例えばガラス材料により構成されている。第１および第２基板１０，２０の各々は、平面視で略矩形状を有している。 (1st and 2nd boards)
As shown in FIG. 1, the touch sensor 1 includes first and second substrates 10, 20. The first substrate 10 is made of a highly light-transmitting resin film such as a polyethylene terephthalate resin. The second substrate 20 is made of, for example, a glass material. Each of the first and second substrates 10 and 20 has a substantially rectangular shape in a plan view.
　図２に示すように、第１および第２基板１０，２０は、後述する粘着層２により操作空間Ｓを挟んで向かい合うように積層配置されている。操作空間Ｓは、第１基板１０、第２基板２０、粘着層２（後述）、第１絶縁コート層４（後述）、および第２絶縁コート層５（後述）により囲まれた空間である。 As shown in FIG. 2, the first and second substrates 10 and 20 are laminated and arranged so as to face each other with the operation space S sandwiched by the adhesive layer 2 described later. The operation space S is a space surrounded by a first substrate 10, a second substrate 20, an adhesive layer 2 (described later), a first insulating coat layer 4 (described later), and a second insulating coat layer 5 (described later).
　（粘着層）
　図１および図２に示すように、第１基板１０の下面周縁と第２基板２０の上面周縁との間には、第１基板１０と第２基板２０とを貼り合わせるための粘着層２が設けられている。粘着層２は、例えばアクリル系粘着剤からなる。粘着層２は、平面視で額縁状に形成されている。粘着層２は、後述する第１絶縁コート層４と第２絶縁コート層５との間に配置されている。 (Adhesive layer)
As shown in FIGS. 1 and 2, an adhesive layer 2 for bonding the first substrate 10 and the second substrate 20 is provided between the lower peripheral edge of the first substrate 10 and the upper surface peripheral edge of the second substrate 20. It is provided. The adhesive layer 2 is made of, for example, an acrylic adhesive. The adhesive layer 2 is formed in a frame shape in a plan view. The adhesive layer 2 is arranged between the first insulating coat layer 4 and the second insulating coat layer 5, which will be described later.
　（フレキシブル配線板）
　図１に示すように、タッチセンサ１は、フレキシブル配線板３を備えている。フレキシブル配線板３は、柔軟性を有しかつ変形状態でもその電気的特性が変化しないように構成されている。フレキシブル配線板３は、例えばポリイミド（ＰＩ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）等の可撓性を有する絶縁フィルムからなる。 (Flexible wiring board)
As shown in FIG. 1, the touch sensor 1 includes a flexible wiring board 3. The flexible wiring board 3 is configured to be flexible and its electrical characteristics do not change even in a deformed state. The flexible wiring board 3 is made of a flexible insulating film such as polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate (PEN).
　図３および図５に示すように、フレキシブル配線板３は、例えば異方導電性接着剤（図示せず）により第１基板１０および第２基板２０の各々の周縁部に固着されている。フレキシブル配線板３は、後述する第１電極３０ａ，３０ｂおよび第２電極４０ａ，４０ｂと電気的に接続される。 As shown in FIGS. 3 and 5, the flexible wiring board 3 is fixed to the peripheral edges of the first substrate 10 and the second substrate 20 by, for example, an anisotropic conductive adhesive (not shown). The flexible wiring board 3 is electrically connected to the first electrodes 30a and 30b and the second electrodes 40a and 40b, which will be described later.
　（第１導電層）
　図１および図２に示すように、タッチセンサ１は、第１導電層１１を備えている。第１導電層１１は、例えば酸化インジウム錫等の光透過性を有する透明材料（透明導電膜）からなる。第１導電層１１は、上記透明導電膜がスパッタ、蒸着法などにより第１基板１０の下面に形成される。 (First conductive layer)
As shown in FIGS. 1 and 2, the touch sensor 1 includes a first conductive layer 11. The first conductive layer 11 is made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide. In the first conductive layer 11, the transparent conductive film is formed on the lower surface of the first substrate 10 by sputtering, a vapor deposition method, or the like.
　図３および図４に示すように、第１導電層１１は、第１導電本体部１２、第１絶縁部１４ａ～１４ｇ、第１外周導電部１５ａ，１５ｂ、およびダミー領域１６ａ，１６ｂにより構成されている。 As shown in FIGS. 3 and 4, the first conductive layer 11 is composed of a first conductive main body portion 12, first insulating portions 14a to 14 g, first outer peripheral conductive portions 15a and 15b, and dummy regions 16a and 16b. ing.
　（第１導電本体部）
　図２～図４に示すように、第１導電本体部１２は、第１導電層１１において第１絶縁部１４ａ～１４ｇ、第１外周導電部１５ａ，１５ｂ、およびダミー領域１６ａ，１６ｂを除いた大部分の領域に形成されている。第１導電本体部１２は、後述する第１電極３０ａ，３０ｂと電気的に接続される。 (1st conductive body)
As shown in FIGS. 2 to 4, the first conductive main body portion 12 excludes the first insulating portions 14a to 14 g, the first outer peripheral conductive portions 15a and 15b, and the dummy regions 16a and 16b in the first conductive layer 11. It is formed in most areas. The first conductive main body portion 12 is electrically connected to the first electrodes 30a and 30b, which will be described later.
　第１導電本体部１２は、使用者の押圧操作により第２導電本体部２２と接触可能な操作領域１３を含む。操作領域１３は、第１導電本体部１２において操作空間Ｓ（図２参照）に対応する位置に配置される。操作領域１３は、例えば矩形状に形成されている。 The first conductive main body portion 12 includes an operation region 13 that can come into contact with the second conductive main body portion 22 by a pressing operation by the user. The operation area 13 is arranged at a position corresponding to the operation space S (see FIG. 2) in the first conductive main body portion 12. The operation area 13 is formed in a rectangular shape, for example.
　（第１絶縁部）
　図２に示すように、第１絶縁部１４ａ～１４ｇは、例えば、第１基板１０の下面において上記透明導電膜が積層されていない部分として構成されている。具体的に、第１絶縁部１４ａ～１４ｇの各々は、第１基板１０の下面に上記透明導電膜を形成した後に、例えばレーザーエッチングにより上記透明導電膜を取り除いた凹溝として構成されている。これにより、第１絶縁部１４ａ～１４ｇは、第１導電本体部１２と電気的に絶縁された状態となっている。 (1st insulation part)
As shown in FIG. 2, the first insulating portions 14a to 14g are configured as, for example, a portion on the lower surface of the first substrate 10 where the transparent conductive film is not laminated. Specifically, each of the first insulating portions 14a to 14g is configured as a concave groove in which the transparent conductive film is formed on the lower surface of the first substrate 10 and then the transparent conductive film is removed by, for example, laser etching. As a result, the first insulating portions 14a to 14g are in a state of being electrically insulated from the first conductive main body portion 12.
　図３および図４に示すように、第１絶縁部１４ａ～１４ｇの各々は、線状に形成されている。第１絶縁部１４ａ～１４ｇの各々の好ましい線幅は、例えば５０～２５０μｍである。 As shown in FIGS. 3 and 4, each of the first insulating portions 14a to 14g is formed linearly. The preferred line width of each of the first insulating portions 14a to 14g is, for example, 50 to 250 μm.
　第１絶縁部１４ａ，１４ｂは、後述する第１電極３０ａ，３０ｂを、第１基板１０の下面周縁から間隔をあけて囲むように配置されている。第１絶縁部１４ａ，１４ｂは、図２および図３の紙面左側が開口した非閉塞状に形成されている。 The first insulating portions 14a and 14b are arranged so as to surround the first electrodes 30a and 30b, which will be described later, at intervals from the lower peripheral edge of the first substrate 10. The first insulating portions 14a and 14b are formed in a non-blocking shape in which the left side of the paper surface of FIGS. 2 and 3 is open.
　第１絶縁部１４ａは、第１導電本体部１２の外周に隣接している。第１絶縁部１４ａは、第１導電本体部１２の外周に沿って延びている。 The first insulating portion 14a is adjacent to the outer periphery of the first conductive main body portion 12. The first insulating portion 14a extends along the outer circumference of the first conductive main body portion 12.
　第１絶縁部１４ｂは、第１絶縁部１４ａおよび第１外周導電部１５ａを挟んで第１導電本体部１２の外周から離れた位置に配置されている。第１絶縁部１４ｂは、第１外周導電部１５ａと第１外周導電部１５ｂとの間に配置されている。第１絶縁部１４ｂは、第１絶縁部１４ａの延伸方向に沿って延びている。 The first insulating portion 14b is arranged at a position away from the outer periphery of the first conductive main body portion 12 with the first insulating portion 14a and the first outer peripheral conductive portion 15a interposed therebetween. The first insulating portion 14b is arranged between the first outer peripheral conductive portion 15a and the first outer peripheral conductive portion 15b. The first insulating portion 14b extends along the stretching direction of the first insulating portion 14a.
　第１絶縁部１４ｃは、図２および図３に示した操作領域１３よりも紙面右側に配置されている。第１絶縁部１４ｃは、第１基板１０の短辺方向に沿って延びている。第１絶縁部１４ｃは、図２および図３の紙面下側の端部が第１絶縁部１４ａと連続する一方、紙面上側の端部が操作領域１３の紙面右上の隅角部近傍まで延びるように構成されている。 The first insulating portion 14c is arranged on the right side of the paper surface with respect to the operation area 13 shown in FIGS. 2 and 3. The first insulating portion 14c extends along the short side direction of the first substrate 10. In the first insulating portion 14c, the lower end portion of the paper surface of FIGS. 2 and 3 is continuous with the first insulating portion 14a, while the upper end portion of the paper surface extends to the vicinity of the upper right corner portion of the paper surface of the operation region 13. It is configured in.
　第１絶縁部１４ｄは、第１導電本体部１２の操作領域１３と、後述する各配線部３２および各接続端子部３３とを電気的に分断するために設けられている。具体的に、第１絶縁部１４ｄは、図２および図３に示した操作領域１３よりも紙面左側に配置されている。第１絶縁部１４ｄは、操作領域１３を挟んで第１絶縁部１４ｃと向かい合うように配置されている。第１絶縁部１４ｄは、第１基板１０の短辺方向に沿って延びている。第１絶縁部１４ｄは、各図の紙面下側の端部が操作領域１３の紙面左下の隅角部近傍に位置する一方、紙面上側の端部が操作領域１３の紙面左上の隅角部近傍まで延びるように構成されている。 The first insulating portion 14d is provided to electrically separate the operation region 13 of the first conductive main body portion 12, each wiring portion 32 and each connection terminal portion 33 described later. Specifically, the first insulating portion 14d is arranged on the left side of the paper surface with respect to the operation region 13 shown in FIGS. 2 and 3. The first insulating portion 14d is arranged so as to face the first insulating portion 14c with the operation region 13 interposed therebetween. The first insulating portion 14d extends along the short side direction of the first substrate 10. In the first insulating portion 14d, the lower end of the paper surface of each drawing is located near the lower left corner of the operation area 13, while the upper end of the paper surface is near the upper left corner of the operation area 13. It is configured to extend to.
　第１絶縁部１４ｅは、図２および図３に示した操作領域１３よりも紙面左側に配置されている。第１絶縁部１４ｅは、第１基板１０の長辺方向に沿って延びている。具体的に、第１絶縁部１４ｅは、第１基板１０の紙面左側に位置する辺から第１絶縁部１４ｄに向かって延びている。 The first insulating portion 14e is arranged on the left side of the paper surface with respect to the operation area 13 shown in FIGS. 2 and 3. The first insulating portion 14e extends along the long side direction of the first substrate 10. Specifically, the first insulating portion 14e extends from the side located on the left side of the paper surface of the first substrate 10 toward the first insulating portion 14d.
　第１絶縁部１４ｆ，１４ｇは、図２および図３に示した操作領域１３よりも紙面左側に配置されている。具体的に、第１絶縁部１４ｆは、第１絶縁部１４ｅよりも紙面上側に配置されていて、ダミー領域１６ａの外周に隣接している。第１絶縁部１４ｇは、第１絶縁部１４ｅよりも紙面下側に配置されていて、ダミー領域１６ｂの外周に隣接している。 The first insulating portions 14f and 14g are arranged on the left side of the paper surface from the operation area 13 shown in FIGS. 2 and 3. Specifically, the first insulating portion 14f is arranged on the upper side of the paper surface with respect to the first insulating portion 14e, and is adjacent to the outer periphery of the dummy region 16a. The first insulating portion 14g is arranged below the paper surface of the first insulating portion 14e and is adjacent to the outer periphery of the dummy region 16b.
　（第１外周導電部）
　第１外周導電部１５ａ，１５ｂは、第１導電本体部１２と同様に、例えば酸化インジウム錫等の光透過性を有する透明材料（透明導電膜）からなる。なお、図２～図４および図７では、第１外周導電部１５ａ，１５ｂを他の構成と区別するためにドットによるハッチングを付している。 (1st outer peripheral conductive part)
Like the first conductive main body portion 12, the first outer peripheral conductive portions 15a and 15b are made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide. In FIGS. 2 to 4 and 7, the first outer peripheral conductive portions 15a and 15b are hatched with dots in order to distinguish them from other configurations.
　第１外周導電部１５ａ，１５ｂは、第１基板１０の下面周縁に配置されている。具体的に、第１外周導電部１５ａ，１５ｂは、後述する第１電極３０ａ，３０ｂを、第１基板１０の下面周縁から間隔をあけて囲むように配置されている。そして、第１外周導電部１５ａ，１５ｂの各々は、両端部１７，１８が後述する接続端子部３３の近傍に位置し、かつ両端部１７，１８が第１電極３０ａ，３０ｂの各々の接続端子部３３の近傍で第１導電本体部１２と電気的に導通するように構成されている。 The first outer peripheral conductive portions 15a and 15b are arranged on the lower peripheral periphery of the first substrate 10. Specifically, the first outer peripheral conductive portions 15a and 15b are arranged so as to surround the first electrodes 30a and 30b, which will be described later, at intervals from the lower peripheral periphery of the first substrate 10. Each of the first outer peripheral conductive portions 15a and 15b has both end portions 17 and 18 located in the vicinity of the connection terminal portion 33 described later, and both end portions 17 and 18 are connection terminals of the first electrodes 30a and 30b. It is configured to be electrically conductive with the first conductive main body portion 12 in the vicinity of the portion 33.
　第１外周導電部１５ａは、第１導電本体部１２の外周から第１絶縁部１４ａを隔てた位置に配置されている。第１外周導電部１５ａは、第１絶縁部１４ａと第１絶縁部１４ｂとの間に配置されている。第１外周導電部１５ａは、第１絶縁部１４ａ，１４ｂの延伸方向に沿って略帯状に延びている。第１絶縁部１４ａは、図２および図３の紙面左側が開口した非閉塞状に形成されている。 The first outer peripheral conductive portion 15a is arranged at a position separated from the outer periphery of the first conductive main body portion 12 by the first insulating portion 14a. The first outer peripheral conductive portion 15a is arranged between the first insulating portion 14a and the first insulating portion 14b. The first outer peripheral conductive portion 15a extends substantially in a band shape along the stretching direction of the first insulating portions 14a and 14b. The first insulating portion 14a is formed in a non-blocking shape in which the left side of the paper surface of FIGS. 2 and 3 is open.
　第１外周導電部１５ｂは、第１導電本体部１２の外周から第１絶縁部１４ａおよび第１外周導電部１５ａを隔てた位置に配置されている。第１外周導電部１５ｂは、第１絶縁部１４ｂの延伸方向に沿って略帯状に延びている。第１絶縁部１４ｂは、図２および図３の紙面左側が開口した非閉塞状に形成されている。 The first outer peripheral conductive portion 15b is arranged at a position separated from the outer periphery of the first conductive main body portion 12 by the first insulating portion 14a and the first outer peripheral conductive portion 15a. The first outer peripheral conductive portion 15b extends substantially in a band shape along the stretching direction of the first insulating portion 14b. The first insulating portion 14b is formed in a non-blocking shape in which the left side of the paper surface of FIGS. 2 and 3 is open.
　（第１電極）
　図１～図３に示すように、タッチセンサ１は、一対の第１電極３０ａ，３０ｂを備えている。第１電極３０ａ，３０ｂは、第１導電層１１（第１導電本体部１２）の電気抵抗率よりも低い電気抵抗率を有している。第１電極３０ａ，３０ｂは、例えば銀または銅を主成分とする材料からなる。具体的に、第１電極３０ａ，３０ｂは、ポリエステル系樹脂等の樹脂材料に対して銀または銅を含有させた材料からなる。 (1st electrode)
As shown in FIGS. 1 to 3, the touch sensor 1 includes a pair of first electrodes 30a and 30b. The first electrodes 30a and 30b have an electrical resistivity lower than the electrical resistivity of the first conductive layer 11 (first conductive main body portion 12). The first electrodes 30a and 30b are made of, for example, a material containing silver or copper as a main component. Specifically, the first electrodes 30a and 30b are made of a material containing silver or copper with respect to a resin material such as a polyester resin.
　第１電極３０ａ，３０ｂは、第１導電本体部１２の下面周縁（操作領域１３の外側）に配置されている。第１電極３０ａ，３０ｂは、第１導電本体部１２と電気的に接続されている。 The first electrodes 30a and 30b are arranged on the lower peripheral edge of the first conductive main body 12 (outside the operation region 13). The first electrodes 30a and 30b are electrically connected to the first conductive main body portion 12.
　図３に示すように、第１電極３０ａは、第１導電本体部１２の下面において、第１絶縁部１４ａの紙面右下に位置する端部近傍から、第１絶縁部１４ａの紙面右上および左上に位置する隅角部を経て、第１絶縁部１４ｅの紙面左側に位置する端部近傍（フレキシブル配線板３の取付位置）に亘って帯状に延びている。 As shown in FIG. 3, the first electrode 30a is located on the lower surface of the first conductive main body portion 12 from the vicinity of the end portion located at the lower right of the paper surface of the first insulating portion 14a to the upper right and upper left of the paper surface of the first insulating portion 14a. It extends in a band shape over the vicinity of the end portion (mounting position of the flexible wiring board 3) located on the left side of the paper surface of the first insulating portion 14e via the corner portion located at.
　第１電極３０ｂは、第１導電本体部１２の下面において、第１絶縁部１４ｃの紙面下側に位置する端部近傍から、第１絶縁部１４ａの紙面左下に位置する隅角部を経て、第１絶縁部１４ｅの紙面左側に位置する端部近傍に亘って帯状に延びている。 The first electrode 30b passes from the vicinity of the end portion of the first insulating portion 14c located on the lower side of the paper surface to the corner portion located on the lower left side of the paper surface of the first insulating portion 14a on the lower surface of the first conductive main body portion 12. It extends in a band shape over the vicinity of the end portion of the first insulating portion 14e located on the left side of the paper surface.
　第１電極３０ａ，３０ｂの各々は、電極部３１、配線部３２、および接続端子部３３を含む。 Each of the first electrodes 30a and 30b includes an electrode portion 31, a wiring portion 32, and a connection terminal portion 33.
　第１電極３０ａ，３０ｂの各々の電極部３１は、第１基板１０の長辺方向に沿って線状に延びている。第１電極３０ａの電極部３１は、図３に示した操作領域１３よりも紙面上側に配置されている。第１電極３０ｂの電極部３１は、図３に示した操作領域１３よりも紙面下側に配置されている。すなわち、第１電極３０ａの電極部３１と第１電極３０ｂの電極部３１とは、第１導電本体部１２の下面周縁において互いに対向する位置に配置されている。そして、第１電極３０ａの電極部３１と第１電極３０ｂの電極部３１とは、第１導電本体部１２の操作領域１３を介して互いに電気的に接続されている。 Each of the electrode portions 31 of the first electrodes 30a and 30b extends linearly along the long side direction of the first substrate 10. The electrode portion 31 of the first electrode 30a is arranged on the upper side of the paper surface with respect to the operation region 13 shown in FIG. The electrode portion 31 of the first electrode 30b is arranged below the paper surface of the operation region 13 shown in FIG. That is, the electrode portion 31 of the first electrode 30a and the electrode portion 31 of the first electrode 30b are arranged at positions facing each other on the lower peripheral periphery of the first conductive main body portion 12. The electrode portion 31 of the first electrode 30a and the electrode portion 31 of the first electrode 30b are electrically connected to each other via the operation region 13 of the first conductive main body portion 12.
　第１電極３０ａ，３０ｂの各々の配線部３２は、第１導電本体部１２の下面において、図３に示した第１絶縁部１４ｄよりも紙面左側に配置されている。第１電極３０ａの配線部３２は、図３の紙面上側に位置する端部が第１電極３０ａの電極部３１と連続する一方、図３の紙面下側に位置する端部が第１絶縁部１４ｅの近傍に位置するように構成されている。第１電極３０ｂの配線部３２は、図３の紙面下側に位置する端部が第１電極３０ｂの電極部３１と連続する一方、図３の紙面上側に位置する端部が第１絶縁部１４ｅの近傍に位置するように構成されている。 The wiring portions 32 of the first electrodes 30a and 30b are arranged on the lower surface of the first conductive main body portion 12 on the left side of the paper surface with respect to the first insulating portion 14d shown in FIG. In the wiring portion 32 of the first electrode 30a, the end portion located on the upper side of the paper surface of FIG. 3 is continuous with the electrode portion 31 of the first electrode 30a, while the end portion located on the lower side of the paper surface of FIG. 3 is the first insulating portion. It is configured to be located in the vicinity of 14e. In the wiring portion 32 of the first electrode 30b, the end portion located on the lower side of the paper surface in FIG. 3 is continuous with the electrode portion 31 of the first electrode 30b, while the end portion located on the upper side of the paper surface in FIG. 3 is the first insulating portion. It is configured to be located in the vicinity of 14e.
　第１電極３０ａ，３０ｂの各々の接続端子部３３は、各電極部３１と連続しかつ第１導電本体部１２の下面周縁において各電極部３１と対向しない位置に配置されている。具体的に、各接続端子部３３は、図３に示した第１絶縁部１４ｄよりも紙面左側に位置し、かつ第１絶縁部１４ｄを挟んで操作領域１３から離れた位置に配置されている。また、各接続端子部３３は、第１絶縁部１４ｅの近傍に位置し、かつ第１絶縁部１４ｅを挟んで互いに間隔をあけて配置されている。各接続端子部３３は、フレキシブル配線板３と電気的に接続されている。 Each connection terminal 33 of the first electrodes 30a and 30b is arranged at a position continuous with each electrode 31 and not facing each electrode 31 on the lower peripheral edge of the first conductive main body 12. Specifically, each connection terminal portion 33 is located on the left side of the paper surface with respect to the first insulating portion 14d shown in FIG. 3, and is arranged at a position away from the operation region 13 with the first insulating portion 14d interposed therebetween. .. Further, the connection terminal portions 33 are located in the vicinity of the first insulating portion 14e, and are arranged at intervals from each other with the first insulating portion 14e interposed therebetween. Each connection terminal portion 33 is electrically connected to the flexible wiring board 3.
　第１電極３０ａの接続端子部３３は、第１電極３０ａの配線部３２における図３の紙面下側に位置する端部から紙面左側に向かって第１絶縁部１４ｅの延伸方向に沿って延びている。第１電極３０ｂの接続端子部３３は、第１電極３０ｂの配線部３２における図３の紙面上側に位置する端部から紙面左側に向かって第１絶縁部１４ｅの延伸方向に沿って延びている。 The connection terminal portion 33 of the first electrode 30a extends from the end portion of the wiring portion 32 of the first electrode 30a located on the lower side of the paper surface toward the left side of the paper surface along the stretching direction of the first insulating portion 14e. There is. The connection terminal portion 33 of the first electrode 30b extends from the end portion of the wiring portion 32 of the first electrode 30b located on the upper side of the paper surface toward the left side of the paper surface along the stretching direction of the first insulating portion 14e. ..
　第１電極３０ａは、ダミー部３４を含む。ダミー部３４は、図３に示した操作領域１３よりも左側に配置されている。ダミー部３４は、第１絶縁部１４ａと第１絶縁部１４ｃとの間に配置されている。ダミー部３４は、図３の紙面下側に位置する端部が第１絶縁部１４ｃにおける紙面下側に位置する端部近傍に位置する一方、紙面上側に位置する端部が電極部３１と連続するように構成されている。 The first electrode 30a includes a dummy portion 34. The dummy portion 34 is arranged on the left side of the operation area 13 shown in FIG. The dummy portion 34 is arranged between the first insulating portion 14a and the first insulating portion 14c. In the dummy portion 34, the end portion located on the lower side of the paper surface in FIG. 3 is located near the end portion located on the lower side of the paper surface in the first insulating portion 14c, while the end portion located on the upper side of the paper surface is continuous with the electrode portion 31. It is configured to do.
　（第１絶縁コート層）
　図１および図２に示すように、タッチセンサ１は、第１絶縁コート層４を備えている。第１絶縁コート層４は、例えばアクリル系樹脂等の絶縁性材料からなる。第１絶縁コート層４は、平面視で額縁状に形成されている。第１絶縁コート層４は、第１導電本体部１２の下面周縁において第１電極３０ａ，３０ｂの各々に対応する位置に配置されている。第１絶縁コート層４は、タッチセンサ１の厚み方向において第１導電層１１の下方から第１電極３０ａ，３０ｂの全体を覆うように構成されている。 (First insulating coat layer)
As shown in FIGS. 1 and 2, the touch sensor 1 includes a first insulating coat layer 4. The first insulating coat layer 4 is made of an insulating material such as an acrylic resin. The first insulating coat layer 4 is formed in a frame shape in a plan view. The first insulating coat layer 4 is arranged at a position corresponding to each of the first electrodes 30a and 30b on the lower peripheral periphery of the first conductive main body portion 12. The first insulating coat layer 4 is configured to cover the entire first electrodes 30a and 30b from below the first conductive layer 11 in the thickness direction of the touch sensor 1.
　（第２導電層）
　図１および図２に示すように、タッチセンサ１は、第２導電層２１を備えている。第２導電層２１は、第１導電層１１と同様に、例えば酸化インジウム錫等の光透過性を有する透明材料（透明導電膜）からなる。第２導電層２１は、上記透明導電膜がスパッタ、蒸着法などにより第２基板２０の上面に形成される。 (Second conductive layer)
As shown in FIGS. 1 and 2, the touch sensor 1 includes a second conductive layer 21. Like the first conductive layer 11, the second conductive layer 21 is made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide. In the second conductive layer 21, the transparent conductive film is formed on the upper surface of the second substrate 20 by sputtering, a vapor deposition method, or the like.
　図５および図６に示すように、第２導電層２１は、第２導電本体部２２、第２絶縁部２４ａ～２４ｅ、第２外周導電部２５、およびダミー領域２６ａ，２６ｂ，２６ｃにより構成されている。 As shown in FIGS. 5 and 6, the second conductive layer 21 is composed of a second conductive main body portion 22, second insulating portions 24a to 24e, a second outer peripheral conductive portion 25, and dummy regions 26a, 26b, 26c. ing.
　（第２導電本体部）
　図２、図５および図６に示すように、第２導電本体部２２は、第２導電層２１において第２絶縁部２４ａ～２４ｅ、第２外周導電部２５、およびダミー領域２６ａ，２６ｂ，２６ｃを除いた大部分の領域に形成されている。第２導電本体部２２は、後述する第２電極４０ａ，４０ｂと電気的に接続される。 (2nd conductive body)
As shown in FIGS. 2, 5 and 6, in the second conductive layer 21, the second conductive main body portion 22 includes the second insulating portions 24a to 24e, the second outer peripheral conductive portion 25, and the dummy regions 26a, 26b, 26c. It is formed in most of the areas except. The second conductive main body 22 is electrically connected to the second electrodes 40a and 40b, which will be described later.
　第２導電本体部２２は、第１導電本体部１２の操作領域１３と同じ大きさおよび形状を有する操作領域２３を含む。操作領域２３は、第２導電本体部２２において操作空間Ｓ（図２参照）に対応する位置に配置される。 The second conductive main body portion 22 includes an operation region 23 having the same size and shape as the operation region 13 of the first conductive main body portion 12. The operation area 23 is arranged at a position corresponding to the operation space S (see FIG. 2) in the second conductive main body portion 22.
　図１に示すように、第２導電本体部２２の操作領域２３には、複数のドットスペーサ２７が設けられている。各ドットスペーサ２７は、例えばエポキシ樹脂やシリコーン樹脂等の絶縁樹脂からなる。各ドットスペーサ２７は、略半球形状を有している。複数のドットスペーサ２７は、第２導電本体部２２の上面に形成されている。複数のドットスペーサ２７は、操作領域２３において互いに間隔をあけて配置されている。 As shown in FIG. 1, a plurality of dot spacers 27 are provided in the operation region 23 of the second conductive main body portion 22. Each dot spacer 27 is made of an insulating resin such as an epoxy resin or a silicone resin. Each dot spacer 27 has a substantially hemispherical shape. The plurality of dot spacers 27 are formed on the upper surface of the second conductive main body portion 22. The plurality of dot spacers 27 are arranged at intervals in the operation region 23.
　（第２絶縁部）
　図２に示すように、第２絶縁部２４ａ～２４ｅは、第１絶縁部１４ａ～１４ｇと同様に、第２基板２０の上面において上記透明導電膜が積層されていない部分として構成されている。これにより、第２絶縁部２４ａ～２４ｅは、第２導電本体部２２と電気的に絶縁された状態となっている。 (Second insulation part)
As shown in FIG. 2, the second insulating portions 24a to 24e are configured as portions on the upper surface of the second substrate 20 where the transparent conductive film is not laminated, similarly to the first insulating portions 14a to 14g. As a result, the second insulating portions 24a to 24e are in a state of being electrically insulated from the second conductive main body portion 22.
　図５および図６に示すように、第２絶縁部２４ａ～２４ｅの各々は、線状に形成されている。第２絶縁部２４ａ～２４ｅの各々の好ましい線幅は、例えば５０～２５０μｍである。 As shown in FIGS. 5 and 6, each of the second insulating portions 24a to 24e is formed in a linear shape. The preferred line width of each of the second insulating portions 24a to 24e is, for example, 50 to 250 μm.
　第２絶縁部２４ａは、後述する第２電極４０ａ，４０ｂを、第２基板２０の上面周縁から間隔をあけて囲むように配置されている。第２絶縁部２４ａは、矩形状を有している。具体的に、第２絶縁部２４ａは、第２導電本体部２２およびダミー領域２６ａ，２６ｂ，２６ｃを収めることが可能な閉塞状に形成されている。 The second insulating portion 24a is arranged so as to surround the second electrodes 40a and 40b, which will be described later, with a space from the upper peripheral edge of the second substrate 20. The second insulating portion 24a has a rectangular shape. Specifically, the second insulating portion 24a is formed in a closed shape capable of accommodating the second conductive main body portion 22 and the dummy regions 26a, 26b, 26c.
　第２絶縁部２４ｂは、図５および図６に示した操作領域２３よりも紙面下側に配置されている。第２絶縁部２４ｂは、第２絶縁部２４ａにおける紙面下側の長辺と間隔をかけて配置されていて、ダミー領域１６ａの外周の一部に隣接している。第２絶縁部２４ｂは、第２基板２０の長辺方向に沿って延びている。第２絶縁部２４ｂは、第１絶縁部１４ａにおける紙面左側の短辺から紙面右側に位置する短辺に亘って延びている。 The second insulating portion 24b is arranged below the paper surface of the operation area 23 shown in FIGS. 5 and 6. The second insulating portion 24b is arranged at a distance from the long side of the lower side of the paper surface in the second insulating portion 24a, and is adjacent to a part of the outer periphery of the dummy region 16a. The second insulating portion 24b extends along the long side direction of the second substrate 20. The second insulating portion 24b extends from the short side on the left side of the paper surface to the short side located on the right side of the paper surface in the first insulating portion 14a.
　第２絶縁部２４ｃは、図５および図６に示した操作領域２３よりも紙面左側に配置されている。第２絶縁部２４ｃは、ダミー領域２６ｂ，２６ｃの外周の一部に隣接している。 The second insulating portion 24c is arranged on the left side of the paper surface from the operation area 23 shown in FIGS. 5 and 6. The second insulating portion 24c is adjacent to a part of the outer periphery of the dummy regions 26b and 26c.
　第２絶縁部２４ｄは、図５および図６に示した操作領域２３よりも紙面左側に配置されている。第２絶縁部２４ｄは、ダミー領域２６ｂとダミー領域２６ｃとを隔てるように構成されている。 The second insulating portion 24d is arranged on the left side of the paper surface from the operation area 23 shown in FIGS. 5 and 6. The second insulating portion 24d is configured to separate the dummy region 26b and the dummy region 26c.
　第２絶縁部２４ｅは、図５および図６に示した操作領域２３よりも紙面左側および上側に配置されている。第２絶縁部２４ｅは、第２基板２０の紙面左側に位置する短辺から、操作領域２３の紙面左上に位置する隅角部の近傍を経て、操作領域２３の紙面右上に位置する隅角部の近傍に亘って延びている。 The second insulating portion 24e is arranged on the left side and the upper side of the paper surface with respect to the operation area 23 shown in FIGS. 5 and 6. The second insulating portion 24e is a corner portion located on the upper right side of the paper surface of the operation area 23 from the short side located on the left side of the paper surface of the second substrate 20 and near the corner portion located on the upper left side of the paper surface of the operation area 23. It extends over the vicinity of.
　（第２外周導電部）
　第２外周導電部２５は、第２導電本体部２２と同様に、例えば酸化インジウム錫等の光透過性を有する透明材料（透明導電膜）からなる。第２外周導電部２５は、第２基板２０の下面周縁において第２絶縁部２４ａの外側に配置されている。第２外周導電部２５は、四方枠状を有している。 (Second outer peripheral conductive part)
Like the second conductive main body portion 22, the second outer peripheral conductive portion 25 is made of a transparent material (transparent conductive film) having light transmittance such as indium tin oxide. The second outer peripheral conductive portion 25 is arranged outside the second insulating portion 24a on the lower peripheral edge of the second substrate 20. The second outer peripheral conductive portion 25 has a square frame shape.
　（第２電極）
　図１および図２に示すように、タッチセンサ１は、一対の第２電極４０ａ，４０ｂを備えている。第２電極４０ａ，４０ｂは、第２導電層２１（第２導電本体部２２）の電気抵抗率よりも低い電気抵抗率を有している。第２電極４０ａ，４０ｂは、第１電極３０ａ，３０ｂと同様に、例えば銀または銅を主成分とする材料からなる。 (2nd electrode)
As shown in FIGS. 1 and 2, the touch sensor 1 includes a pair of second electrodes 40a and 40b. The second electrodes 40a and 40b have an electrical resistivity lower than the electrical resistivity of the second conductive layer 21 (second conductive main body portion 22). Like the first electrodes 30a and 30b, the second electrodes 40a and 40b are made of, for example, a material containing silver or copper as a main component.
　第２電極４０ａ，４０ｂは、第２導電本体部２２の下面周縁（操作領域２３の外側）に配置されている。第２電極４０ａ，４０ｂは、第２導電本体部２２と電気的に接続されている。 The second electrodes 40a and 40b are arranged on the lower peripheral edge of the second conductive main body 22 (outside the operation region 23). The second electrodes 40a and 40b are electrically connected to the second conductive main body portion 22.
　図５に示すように、第２電極４０ａは、第２導電本体部２２の上面において、操作領域２３の紙面右下に位置する隅角部近傍から、操作領域２３の紙面右上および左上に位置する隅角部を経て、第２絶縁部２４ｅの紙面左側に位置する端部近傍（フレキシブル配線板３の取付位置）に亘って帯状に延びている。 As shown in FIG. 5, the second electrode 40a is located on the upper right and upper left of the paper surface of the operation region 23 from the vicinity of the corner portion located at the lower right of the paper surface of the operation region 23 on the upper surface of the second conductive main body portion 22. It extends in a band shape through the corner portion and extends to the vicinity of the end portion (mounting position of the flexible wiring board 3) located on the left side of the paper surface of the second insulating portion 24e.
　第２電極４０ｂは、操作領域２３の紙面左側に配置されていて、略Ｔ字状を有している。具体的に、第２電極４０ｂは、第２導電本体部２２の上面において、第２絶縁部２４ｃ，２４ｅの紙面左側に位置する端部近傍から操作領域２３に向かって延び、かつ操作領域２３における紙面左上の隅角部近傍および紙面左下の隅角部近傍の双方に向かって分岐している。 The second electrode 40b is arranged on the left side of the paper surface of the operation region 23 and has a substantially T-shape. Specifically, the second electrode 40b extends from the vicinity of the end portion of the second insulating portions 24c and 24e located on the left side of the paper surface toward the operating region 23 on the upper surface of the second conductive main body portion 22, and is located in the operating region 23. It branches toward both the vicinity of the upper left corner of the paper and the vicinity of the lower left corner of the paper.
　第２電極４０ａは、電極部４１、配線部４２、および接続端子部４３を含む。また、第２電極４０ｂは、電極部４１および接続端子部４３を含む。 The second electrode 40a includes an electrode portion 41, a wiring portion 42, and a connection terminal portion 43. Further, the second electrode 40b includes an electrode portion 41 and a connection terminal portion 43.
　第２電極４０ａ，４０ｂの各々の電極部４１は、第２基板２０の短辺方向に沿って略帯状に延びている。第２電極４０ａの電極部４１は、図５に示した操作領域２３よりも紙面右側に配置されている。第２電極４０ｂの電極部４１は、図５に示した操作領域２３よりも紙面左側に配置されている。すなわち、第２電極４０ａの電極部４１と第２電極４０ｂの電極部４１とは、第２導電本体部２２の上面周縁において互いに対向する位置に配置されている。そして、第２電極４０ａの電極部４１と第２電極４０ｂの電極部４１とは、第２導電本体部２２の操作領域２３を介して互いに電気的に接続されている。 Each of the electrode portions 41 of the second electrodes 40a and 40b extends substantially in a band shape along the short side direction of the second substrate 20. The electrode portion 41 of the second electrode 40a is arranged on the right side of the paper surface with respect to the operation region 23 shown in FIG. The electrode portion 41 of the second electrode 40b is arranged on the left side of the paper surface with respect to the operation region 23 shown in FIG. That is, the electrode portion 41 of the second electrode 40a and the electrode portion 41 of the second electrode 40b are arranged at positions facing each other on the upper peripheral periphery of the second conductive main body portion 22. The electrode portion 41 of the second electrode 40a and the electrode portion 41 of the second electrode 40b are electrically connected to each other via the operation region 23 of the second conductive main body portion 22.
　第２電極４０ａの配線部４２は、第２導電本体部２２の上面において、図５に示した第２絶縁部２４ｅよりも紙面上側および左側に配置されている。第２電極４０ａの配線部４２は、図５の紙面右側に位置する端部が第２電極４０ａの電極部４１と連続する一方、紙面左側に位置する端部がフレキシブル配線板３の取付位置の近傍に位置するように構成されている。 The wiring portion 42 of the second electrode 40a is arranged on the upper surface of the second conductive main body portion 22 on the upper side and the left side of the paper surface with respect to the second insulating portion 24e shown in FIG. In the wiring portion 42 of the second electrode 40a, the end portion located on the right side of the paper surface of FIG. 5 is continuous with the electrode portion 41 of the second electrode 40a, while the end portion located on the left side of the paper surface is the mounting position of the flexible wiring board 3. It is configured to be located in the vicinity.
　第２電極４０ａ，４０ｂの各々の接続端子部４３は、第２絶縁部２４ａと第２絶縁部２４ｅとの交点近傍（図５の紙面左側）に位置し、かつ第２絶縁部２４ｅを挟んで互いに間隔をあけて配置されている。各接続端子部４３は、フレキシブル配線板３と電気的に接続されている。 The connection terminal portions 43 of the second electrodes 40a and 40b are located near the intersection of the second insulating portion 24a and the second insulating portion 24e (on the left side of the paper in FIG. 5), and sandwich the second insulating portion 24e. They are arranged at intervals from each other. Each connection terminal portion 43 is electrically connected to the flexible wiring board 3.
　第２電極４０ａの接続端子部４３は、第２電極４０ａの配線部４２における図５の紙面下側に位置する端部から紙面左側に向かって第２基板２０の長辺方向に沿って延びている。第２電極４０ｂの接続端子部４３は、第２電極４０ｂの電極部４１の中途部から図５の紙面左側に向かって第２基板２０の長辺方向に沿って延びている。 The connection terminal portion 43 of the second electrode 40a extends from the end portion of the wiring portion 42 of the second electrode 40a located on the lower side of the paper surface toward the left side of the paper surface along the long side direction of the second substrate 20. There is. The connection terminal portion 43 of the second electrode 40b extends from the middle portion of the electrode portion 41 of the second electrode 40b toward the left side of the paper in FIG. 5 along the long side direction of the second substrate 20.
　（ダミー電極）
　図５に示すように、タッチセンサ１は、ダミー電極４４ａ，４４ｂを備えている。ダミー電極４４ａは、図５に示した操作領域２３よりも紙面下側に配置されている。ダミー電極４４ａは、第２絶縁部２４ａおよび第２絶縁部２４ｂに囲われた矩形領域に配置されている。ダミー電極４４ｂは、図５に示した操作領域２３よりも紙面左側に位置している。ダミー電極４４ｂは、第２絶縁部２４ａ～２４ｄに囲われた矩形領域に配置されている。 (Dummy electrode)
As shown in FIG. 5, the touch sensor 1 includes dummy electrodes 44a and 44b. The dummy electrode 44a is arranged below the paper surface of the operation region 23 shown in FIG. The dummy electrode 44a is arranged in a rectangular region surrounded by the second insulating portion 24a and the second insulating portion 24b. The dummy electrode 44b is located on the left side of the paper surface with respect to the operation region 23 shown in FIG. The dummy electrode 44b is arranged in a rectangular region surrounded by the second insulating portions 24a to 24d.
　（第２絶縁コート層）
　図１および図２に示すように、タッチセンサ１は、第２絶縁コート層５を備えている。第２絶縁コート層５は、例えばアクリル系樹脂等の絶縁性材料からなる。第２絶縁コート層５は、平面視で額縁状に形成されている。第２絶縁コート層５は、第２導電本体部２２の上面周縁において第２電極４０ａ，４０ｂに対応する位置に配置されている。第２絶縁コート層５は、タッチセンサ１の厚み方向において、第２導電層２１の上方から第２電極４０ａ，４０ｂの全体を覆うように構成されている。 (Second insulating coat layer)
As shown in FIGS. 1 and 2, the touch sensor 1 includes a second insulating coat layer 5. The second insulating coat layer 5 is made of an insulating material such as an acrylic resin. The second insulating coat layer 5 is formed in a frame shape in a plan view. The second insulating coat layer 5 is arranged at a position corresponding to the second electrodes 40a and 40b on the upper peripheral periphery of the second conductive main body portion 22. The second insulating coat layer 5 is configured to cover the entire second electrodes 40a and 40b from above the second conductive layer 21 in the thickness direction of the touch sensor 1.
　［第１実施形態の作用効果］
　第１実施形態のタッチセンサ１において、非閉塞状の第１絶縁部１４ａ，１４ｂは、第１導電本体部１２と電気的に絶縁され、第１電極３０ａ，３０ｂを第１基板１０の下面周縁から間隔をあけて囲むように第１導電本体部１２の外周に配置されている。この第１絶縁部１４ａ，１４ｂにより、図２に示すように、例えば使用者の押圧操作時に指やペンなどに帯電していた静電気Ｅが第１基板１０の上面に印加された場合において、第１基板１０の上面から側端部を経由して下面に向かう上記静電気Ｅの流れが阻止される。すなわち、上記静電気Ｅは、第１基板１０の下面に配置される第１導電本体部１２および第１電極３０ａ，３０ｂの各電極部３１に向かって流れにくくなる。 [Action and effect of the first embodiment]
In the touch sensor 1 of the first embodiment, the non-blocking first insulating portions 14a and 14b are electrically insulated from the first conductive main body portion 12, and the first electrodes 30a and 30b are connected to the lower peripheral periphery of the first substrate 10. It is arranged on the outer periphery of the first conductive main body portion 12 so as to surround the first conductive main body portion 12 at intervals. As shown in FIG. 2, when static electricity E charged on a finger, a pen, or the like during a pressing operation by a user is applied to the upper surface of the first substrate 10 by the first insulating portions 14a and 14b, for example, the first insulating portion 14a and 14b. 1 The flow of static electricity E from the upper surface of the substrate 10 to the lower surface via the side end portion is blocked. That is, the static electricity E is less likely to flow toward the electrode portions 31 of the first conductive main body portion 12 and the first electrodes 30a and 30b arranged on the lower surface of the first substrate 10.
　一方、図７に示すように、上記静電気Ｅは、第１基板１０の下面周縁において、第１導電本体部１２の外周から第１絶縁部１４ａ，１４ｂを隔てた位置に配置された第１外周導電部１５ｂ、および第１導電本体部１２の外周から第１絶縁部１４ａを隔てた位置に配置された第１外周導電部１５ａに流れ込むようになる。第１外周導電部１５ａ，１５ｂに流れ込んだ上記静電気Ｅは、第１導電層１１の電気抵抗率よりも低い電気抵抗率を有する第１電極３０ａ，３０ｂにおける各接続端子部３３の近傍に向かって流れる。すなわち、上記静電気Ｅは、第１外周導電部１５ａ，１５ｂの各々の端部１７（または端部１８）に向かって流れる（図７に示した破線の矢印を参照）。なお、図７では、比較的強い静電気Ｅが第１基板１０の上面に印加されかつ第１外周導電部１５ａ，１５ｂの双方に流れ込んだ場合を例示している。仮に、比較的弱い静電気Ｅが第１基板１０の上面に印加された場合には、静電気Ｅのほとんどが外側に位置する第１外周導電部１５ｂに流れ込み、内側に位置する第１外周導電部１５ａに流れる静電気Ｅは僅かである。 On the other hand, as shown in FIG. 7, the static electricity E is arranged on the lower peripheral edge of the first substrate 10 at a position separated from the outer periphery of the first conductive main body portion 12 by the first insulating portions 14a and 14b. It flows into the first outer peripheral conductive portion 15a arranged at a position separated by the first insulating portion 14a from the outer periphery of the conductive portion 15b and the first conductive main body portion 12. The static electricity E that has flowed into the first outer peripheral conductive portions 15a and 15b toward the vicinity of the connection terminal portions 33 in the first electrodes 30a and 30b having an electrical resistivity lower than the electrical resistivity of the first conductive layer 11. It flows. That is, the static electricity E flows toward each end 17 (or end 18) of the first outer peripheral conductive portions 15a and 15b (see the broken line arrow shown in FIG. 7). Note that FIG. 7 illustrates a case where a relatively strong static electricity E is applied to the upper surface of the first substrate 10 and flows into both the first outer peripheral conductive portions 15a and 15b. If a relatively weak static electricity E is applied to the upper surface of the first substrate 10, most of the static electricity E flows into the first outer peripheral conductive portion 15b located on the outside, and the first outer peripheral conductive portion 15a located on the inner side. The static electricity E flowing through is small.
　そして、第１外周導電部１５ａ，１５ｂの各々は、両端部１７，１８が各接続端子部３３の近傍で第１導電本体部１２と電気的に導通するように構成されている。かかる構成により、上記静電気Ｅは、接続端子部３３の近傍において、端部１７（または端部１８）から第１導電本体部１２の下方の周縁位置から配線部３２に伝わる。ここで、接続端子部３３には、フレキシブル配線板３を介して外部機器（図示せず）が接続されている。そして、外部機器側の抵抗値は、静電気Ｅが印加されると静電気対策部品（例えばツエナーダイオード、ＥＳＤサプレッサー、バリスタ）によりタッチセンサ１側（第１導電本体部１２側）の抵抗値よりも低くなるようにしておくことが一般的である。このため、上記配線部３２に伝わった静電気Ｅは、接続端子部３３に向かって流れて、さらに、接続端子部３３からフレキシブル配線板３を経由してタッチセンサ１に接続される外部機器（図示せず）に向かって流れ出る。なお、端部１７（または端部１８）から配線部３２に流れた静電気Ｅは、第１絶縁部１４ｄにより第１導電本体部１２の操作領域１３に向かって流れないようになっている。 Each of the first outer peripheral conductive portions 15a and 15b is configured such that both end portions 17 and 18 are electrically conductive with the first conductive main body portion 12 in the vicinity of each connection terminal portion 33. With this configuration, the static electricity E is transmitted from the end portion 17 (or the end portion 18) to the wiring portion 32 from the lower peripheral edge position of the first conductive main body portion 12 in the vicinity of the connection terminal portion 33. Here, an external device (not shown) is connected to the connection terminal portion 33 via the flexible wiring board 3. When static electricity E is applied, the resistance value on the external device side is lower than the resistance value on the touch sensor 1 side (first conductive main body 12 side) due to static electricity countermeasure parts (for example, Zener diode, ESD suppressor, varistor). It is common to keep it to be. Therefore, the static electricity E transmitted to the wiring unit 32 flows toward the connection terminal unit 33, and is further connected to the touch sensor 1 from the connection terminal unit 33 via the flexible wiring board 3 (FIG. FIG. It flows toward (not shown). The static electricity E flowing from the end portion 17 (or the end portion 18) to the wiring portion 32 is prevented from flowing toward the operation region 13 of the first conductive main body portion 12 by the first insulating portion 14d.
　以上のように、タッチセンサ１では、上記静電気Ｅによる第１導電本体部１２と電極部３１との界面に与える影響を抑制でき、電極部３１が第１導電本体部１２から剥離しにくくなる。したがって、第１実施形態のタッチセンサ１では、第１導電本体部１２における電位分布を均一に保つとともに、押圧操作における検出位置のずれを適切に防止することができる。 As described above, in the touch sensor 1, the influence of the static electricity E on the interface between the first conductive main body portion 12 and the electrode portion 31 can be suppressed, and the electrode portion 31 is less likely to be peeled off from the first conductive main body portion 12. Therefore, in the touch sensor 1 of the first embodiment, the potential distribution in the first conductive main body portion 12 can be kept uniform, and the deviation of the detection position in the pressing operation can be appropriately prevented.
　さらに、第１実施形態のタッチセンサ１では、第１外周導電部１５ａ，１５ｂが非閉塞状を有することから、第１外周導電部１５ａ，１５ｂに対して別途引き回し配線（図示せず）を設ける必要がなく、タッチセンサ１を既存の四線式抵抗膜のタッチセンサとして構成することが可能である。 Further, in the touch sensor 1 of the first embodiment, since the first outer peripheral conductive portions 15a and 15b have a non-blocking state, a separate routing wiring (not shown) is provided for the first outer peripheral conductive portions 15a and 15b. It is not necessary, and the touch sensor 1 can be configured as a touch sensor of an existing four-wire resistance film.
　また、第２導電層２１は、第２導電本体部２２と電気的に絶縁され、一対の第２電極４０ａ，４０ｂを第２基板２０の下面周縁から間隔をあけて囲むように配置される第２絶縁部２４ａを有している。この第２絶縁部２４ａにより、第１基板１０の上面に印加された静電気Ｅが第２基板２０の上面に配置される第２導電層２１の第２導電本体部２２に流入しないようになる。その結果、上記静電気Ｅを、第１基板１０の下面に配置された第１外周導電部１５ａ，１５ｂに向かって適切に誘導することができる。 Further, the second conductive layer 21 is electrically insulated from the second conductive main body portion 22 and is arranged so as to surround the pair of second electrodes 40a and 40b at intervals from the lower peripheral edge of the second substrate 20. It has two insulating portions 24a. The second insulating portion 24a prevents static electricity E applied to the upper surface of the first substrate 10 from flowing into the second conductive main body portion 22 of the second conductive layer 21 arranged on the upper surface of the second substrate 20. As a result, the static electricity E can be appropriately guided toward the first outer peripheral conductive portions 15a and 15b arranged on the lower surface of the first substrate 10.
　［第２実施形態］
　図８および図９は、本開示の第２実施形態に係るタッチセンサ１を示す。第２実施形態では、第１実施形態と比較して、主に第１絶縁部１４ｃの構成および第１外周導電部１５ａ，１５ｂの構成が異なっている。なお、第２実施形態に係るタッチセンサ１の他の構成は、第１実施形態に係るタッチセンサ１の構成と同様である。このため、以下の説明では、図１～図７と同じ部分について同じ符号を付し、その詳細な説明を省略する。 [Second Embodiment]
8 and 9 show the touch sensor 1 according to the second embodiment of the present disclosure. In the second embodiment, the configuration of the first insulating portion 14c and the configuration of the first outer peripheral conductive portions 15a and 15b are mainly different from those of the first embodiment. The other configuration of the touch sensor 1 according to the second embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.
　図８および図９に示すように、この実施形態では、上記第１実施形態で示した第１絶縁部１４ｃの構成が一部異なっている。具体的に、第１絶縁部１４ｃにおける紙面下側に位置する端部は、第１絶縁部１４ａ，１４ｂを超えて、第１基板１０の紙面下側に位置する長辺まで延びている。すなわち、第１絶縁部１４ｃは、第１外周導電部１５ａ，１５ｂの各々を２つに分断するための要素として構成されている。 As shown in FIGS. 8 and 9, in this embodiment, the configuration of the first insulating portion 14c shown in the first embodiment is partially different. Specifically, the end portion of the first insulating portion 14c located on the lower side of the paper surface extends beyond the first insulating portions 14a and 14b to the long side located on the lower side of the paper surface of the first substrate 10. That is, the first insulating portion 14c is configured as an element for dividing each of the first outer peripheral conductive portions 15a and 15b into two.
　この第１絶縁部１４ｃにより、第１外周導電部１５ａ，１５ｂの各々が２つに分断されている。すなわち、第１外周導電部１５ａ，１５ｂの各々は、一対となるように構成されている。そして、一対の第１外周導電部１５ａ，１５ａは、各々の端部１７が接続端子部３３の近傍において第１導電本体部１２と電気的に導通する一方、第１絶縁部１４ｃの近傍に位置する端部１８，１８同士が第１絶縁部１４ｃにより互いに電気的に絶縁されるように構成されている。一対の第１外周導電部１５ｂ，１５ｂについても、一対の第１外周導電部１５ａ，１５ａと同様に構成されている。かかる構成により、第１外周導電部１５ａ，１５ａおよび一対の第１外周導電部１５ｂ，１５ｂに起因するノイズの発生を抑制することができる。 Each of the first outer peripheral conductive portions 15a and 15b is divided into two by the first insulating portion 14c. That is, each of the first outer peripheral conductive portions 15a and 15b is configured to be paired. The pair of first outer peripheral conductive portions 15a and 15a are located in the vicinity of the first insulating portion 14c while their respective end portions 17 are electrically conductive with the first conductive main body portion 12 in the vicinity of the connection terminal portion 33. The end portions 18, 18 are configured to be electrically insulated from each other by the first insulating portion 14c. The pair of first outer peripheral conductive portions 15b and 15b are also configured in the same manner as the pair of first outer peripheral conductive portions 15a and 15a. With such a configuration, it is possible to suppress the generation of noise caused by the first outer peripheral conductive portions 15a and 15a and the pair of first outer peripheral conductive portions 15b and 15b.
　［第３実施形態］
　図１０～図１３は、本開示の第３実施形態に係るタッチセンサ１を示す。第３実施形態では、第１実施形態と比較して、第１絶縁部１４ｂおよび第１外周導電部１５ｂが設けられていない一方、新たな構成が追加されている。なお、第３実施形態に係るタッチセンサ１の他の構成は、第１実施形態に係るタッチセンサ１の構成と同様である。このため、以下の説明では、図１～図７と同じ部分について同じ符号を付し、その詳細な説明を省略する。 [Third Embodiment]
10 to 13 show the touch sensor 1 according to the third embodiment of the present disclosure. In the third embodiment, as compared with the first embodiment, the first insulating portion 14b and the first outer peripheral conductive portion 15b are not provided, but a new configuration is added. The other configuration of the touch sensor 1 according to the third embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.
　図１１に示すように、この実施形態では、上記実施形態と異なり、第１絶縁部１４ａ，１４ｃ～１４ｈにより構成されている。 As shown in FIG. 11, in this embodiment, unlike the above embodiment, the first insulating portions 14a, 14c to 14h are configured.
　図１２にも示すように、第１絶縁部１４ｈは、第１外周導電部１５ａ，１５ａを２つに分断するための要素である。第１絶縁部１４ｈは、第１絶縁部１４ａにおいて図１１および図１２の紙面右側に位置する辺の延長線上に位置している。具体的に、第１絶縁部１４ｈは、第１絶縁部１４ａの紙面右下に位置する端部から紙面下側に位置する第１基板１０の長辺に向かって延びている。なお、図１０～図１３では、第１外周導電部１５ａを他の構成と区別するためにドットによるハッチングを付している。 As shown in FIG. 12, the first insulating portion 14h is an element for dividing the first outer peripheral conductive portions 15a and 15a into two. The first insulating portion 14h is located on the extension line of the side of the first insulating portion 14a located on the right side of the paper surface of FIGS. 11 and 12. Specifically, the first insulating portion 14h extends from the end portion of the first insulating portion 14a located at the lower right side of the paper surface toward the long side of the first substrate 10 located below the paper surface. In FIGS. 10 to 13, the first outer peripheral conductive portion 15a is hatched with dots in order to distinguish it from other configurations.
　この実施形態では、第１絶縁部１４ｈにより、第１外周導電部１５ａ，１５ａが２つに分断されている。すなわち、第１外周導電部１５ａ，１５ａは、一対となるように構成されている。一対の第１外周導電部１５ａ，１５ａは、各々の端部１７が接続端子部３３の近傍において第１導電本体部１２と電気的に導通する一方、第１絶縁部１４ｈの近傍に位置する端部１８，１８同士が第１絶縁部１４ｈにより互いに電気的に絶縁されるように構成されている。 In this embodiment, the first outer peripheral conductive portions 15a and 15a are divided into two by the first insulating portion 14h. That is, the first outer peripheral conductive portions 15a and 15a are configured to be paired. The pair of first outer peripheral conductive portions 15a and 15a have their respective ends 17 electrically conducting with the first conductive main body portion 12 in the vicinity of the connection terminal portion 33, while the ends located in the vicinity of the first insulating portion 14h. The portions 18 and 18 are configured to be electrically insulated from each other by the first insulating portion 14h.
　図１０および図１１に示すように、この実施形態の特徴として、タッチセンサ１は、一対の外周電極３５，３５を備えている。各外周電極３５は、第１導電層１１の電気抵抗率よりも低い電気抵抗率を有している。具体的に、各外周電極３５の材料としては、第１電極３０ａ，３０ｂの材料と同じ材料が好ましい。すなわち、各外周電極３５は、銀または銅を主成分とする材料を含む。 As shown in FIGS. 10 and 11, as a feature of this embodiment, the touch sensor 1 includes a pair of outer peripheral electrodes 35 and 35. Each outer peripheral electrode 35 has an electrical resistivity lower than the electrical resistivity of the first conductive layer 11. Specifically, as the material of each outer peripheral electrode 35, the same material as that of the first electrodes 30a and 30b is preferable. That is, each outer peripheral electrode 35 contains a material containing silver or copper as a main component.
　外周電極３５は、第１外周導電部１５ａの延伸方向に沿って略帯状に延びている。各外周電極３５の幅は、少なくとも各電極部３１の幅よりも狭くなるように形成されるのが好ましい。また、各外周電極３５の厚みは、各電極部３１の厚みと同程度に形成されるのが好ましい。 The outer peripheral electrode 35 extends substantially in a band shape along the stretching direction of the first outer peripheral conductive portion 15a. The width of each outer peripheral electrode 35 is preferably formed to be at least narrower than the width of each electrode portion 31. Further, it is preferable that the thickness of each outer peripheral electrode 35 is formed to be about the same as the thickness of each electrode portion 31.
　外周電極３５は、第１外周導電部１５ａの下面周縁に配置されている。そして、一対の外周電極３５，３５は、接続端子部３３の近傍に位置する各々の端部３６が配線部３２と電気的に導通する一方、第１絶縁部１４ｈの近傍に位置する端部３７，３７同士が第１絶縁部１４ｈにより互いに電気的に絶縁されるように構成されている。 The outer peripheral electrode 35 is arranged on the lower peripheral edge of the first outer peripheral conductive portion 15a. The pair of outer peripheral electrodes 35, 35 have their respective end portions 36 located in the vicinity of the connection terminal portion 33 electrically conductive with the wiring portion 32, while the end portions 37 located in the vicinity of the first insulating portion 14h. , 37 are configured to be electrically insulated from each other by the first insulating portion 14h.
　具体的に、一方の外周電極３５は、第１導電本体部１２の下面において、第１絶縁部１４ｈの近傍から、第１基板１０における図１１の紙面右上および左上に位置する隅角部を経て、配線部３２の中途部に亘って帯状に延びている。また、他方の外周電極３５は、第１導電本体部１２の下面において、第１絶縁部１４ｈの近傍から、第１基板１０の紙面左下に位置する隅角部を経て、配線部３２の中途部に亘って帯状に延びている。 Specifically, one of the outer peripheral electrodes 35 passes from the vicinity of the first insulating portion 14h to the corner portions located on the upper right and upper left of the paper surface of FIG. 11 on the first substrate 10 on the lower surface of the first conductive main body portion 12. , It extends in a band shape over the middle portion of the wiring portion 32. Further, the other outer peripheral electrode 35 is located on the lower surface of the first conductive main body portion 12, from the vicinity of the first insulating portion 14h, through the corner portion located at the lower left of the paper surface of the first substrate 10, and the middle portion of the wiring portion 32. It extends in a band shape.
　なお、図１０に示すように、この実施形態において、第１絶縁コート層４は、タッチセンサ１の厚み方向において第１導電層１１および第１外周導電部１５ａの下方から第１電極３０ａ，３０ｂおよび外周電極３５，３５の全体を覆うように構成されている。 As shown in FIG. 10, in this embodiment, the first insulating coat layer 4 has the first electrodes 30a and 30b from below the first conductive layer 11 and the first outer peripheral conductive portion 15a in the thickness direction of the touch sensor 1. It is configured to cover the entire outer peripheral electrodes 35 and 35.
　図１３に示すように、例えば使用者の押圧操作時に比較的強力な静電気Ｅが第１基板１０の上面に印加された場合であっても、上記静電気Ｅを、第１導電層１１の電気抵抗率よりも低い電気抵抗率を有する外周電極３５に向かって誘導することが可能となる。外周電極３５に流れ込んだ上記静電気Ｅは、接続端子部３３の近傍において外周電極３５の端部３６から配線部３２を経由して接続端子部３３に向かって流れるようになる（図１３に示した破線の矢印を参照）。さらに、上記静電気Ｅは、接続端子部３３からフレキシブル配線板３を経由してタッチセンサ１に接続される外部機器（図示せず）に向かって流れ出る。 As shown in FIG. 13, for example, even when a relatively strong static electricity E is applied to the upper surface of the first substrate 10 during a pressing operation by the user, the static electricity E is applied to the electrical resistivity of the first conductive layer 11. It is possible to guide toward the outer peripheral electrode 35 having an electrical resistivity lower than the rate. The static electricity E that has flowed into the outer peripheral electrode 35 flows from the end portion 36 of the outer peripheral electrode 35 toward the connection terminal portion 33 via the wiring portion 32 in the vicinity of the connection terminal portion 33 (shown in FIG. 13). See the dashed arrow). Further, the static electricity E flows out from the connection terminal portion 33 toward an external device (not shown) connected to the touch sensor 1 via the flexible wiring board 3.
　以上のように、この実施形態のタッチセンサ１では、外周電極３５により上記静電気Ｅによる第１導電本体部１２と電極部３１との界面に与える影響を抑制でき、電極部３１が第１導電本体部１２から剥離しにくくなる。したがって、この実施形態のタッチセンサ１では、比較的強力な静電気Ｅが第１基板１０の上面に印加された場合であっても、第１導電本体部１２における電位分布を均一に保つとともに、押圧操作における検出位置のずれを適切に防止することができる。 As described above, in the touch sensor 1 of this embodiment, the outer peripheral electrode 35 can suppress the influence of the static electricity E on the interface between the first conductive main body portion 12 and the electrode portion 31, and the electrode portion 31 is the first conductive main body. It becomes difficult to peel off from the portion 12. Therefore, in the touch sensor 1 of this embodiment, even when a relatively strong static electricity E is applied to the upper surface of the first substrate 10, the potential distribution in the first conductive main body 12 is kept uniform and pressed. It is possible to appropriately prevent the deviation of the detection position in the operation.
　また、外周電極３５が銀または銅を主成分とする材料を含むことにより、外周電極３５の電気抵抗率を相対的に小さくすることが容易となる。その結果、比較的強力な静電気Ｅが第１基板１０の上面に印加された場合であっても、当該静電気Ｅを確実に外周電極３５から第１電極３０ａ，３０ｂの各々の接続端子部３３に向かって安定的に誘導することができる。 Further, since the outer peripheral electrode 35 contains a material containing silver or copper as a main component, it becomes easy to make the electrical resistivity of the outer peripheral electrode 35 relatively small. As a result, even when a relatively strong static electricity E is applied to the upper surface of the first substrate 10, the static electricity E is surely applied from the outer peripheral electrode 35 to the connection terminal portions 33 of the first electrodes 30a and 30b. It can be stably guided toward.
　［第４実施形態］
　図１４および図１５は、本開示の第４実施形態に係るタッチパネル装置１００を示す。タッチパネル装置１００は、タッチパネル１と筐体１０１とディスプレイパネル１０２とを備える。第４実施形態に係るタッチセンサ１は、第１実施形態と比較して、第１基板１０の外周縁部と第２基板２０の外周縁部が、平面視で揃っていない。なお、第４実施形態に係るタッチセンサ１の他の構成は、第１実施形態に係るタッチセンサ１の構成と同様である。このため、以下の説明では、図１～図７と同じ部分について同じ符号を付し、その詳細な説明を省略する。 [Fourth Embodiment]
14 and 15 show the touch panel device 100 according to the fourth embodiment of the present disclosure. The touch panel device 100 includes a touch panel 1, a housing 101, and a display panel 102. In the touch sensor 1 according to the fourth embodiment, the outer peripheral edge portion of the first substrate 10 and the outer peripheral edge portion of the second substrate 20 are not aligned in a plan view as compared with the first embodiment. The other configuration of the touch sensor 1 according to the fourth embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.
　図１４に示すように、タッチパネル１およびディスプレイパネル１０２は、筐体１０１の内部に配置されている。ディスプレイパネル１０２は、液晶パネルまたは有機ＥＬパネル（ＯＬＥＤパネル）からなる。ディスプレイパネル１０２は、第２基板２０の下面側に配置されている。なお、ディスプレイパネル１０２には、映像を表示するためのディスプレイ駆動装置（図示せず）が接続されている。 As shown in FIG. 14, the touch panel 1 and the display panel 102 are arranged inside the housing 101. The display panel 102 is composed of a liquid crystal panel or an organic EL panel (OLED panel). The display panel 102 is arranged on the lower surface side of the second substrate 20. A display drive device (not shown) for displaying an image is connected to the display panel 102.
　ディスプレイパネル１０２は、接着部材１０３を介して、下面が筐体１０１に固定されておおり、上面が第２基板２０に固定されている。接着部材１０３は、両面テープなどの、タッチパネル１および液晶パネル１０２を筐体１０１内に固定されるために用いられる部材である。 The lower surface of the display panel 102 is fixed to the housing 101 and the upper surface is fixed to the second substrate 20 via the adhesive member 103. The adhesive member 103 is a member used for fixing the touch panel 1 and the liquid crystal panel 102 in the housing 101, such as double-sided tape.
　図１４および図１５に示すように、第１基板１０の外周縁部が、第２基板２０の外周縁部よりも、平面視で内側に配置されている。具体的には、平面視で、第１基板１０の外周縁部の全周が、第２基板２０の外周縁部の内側に配置されている。第１基板１０の外周縁部が第２基板の外周縁部より内側にあることにより、静電気Ｅが印加される位置と第１外周導電部１５ａ，１５ｂの距離が小さくなる。このため、静電気Ｅが低い電圧であっても、第１外周導電部１５ａ，１５ｂに流れた静電気Ｅを外部機器（図示省略）に誘導することができる。これにより、前述の第１実施形態と同様に電極部３１が第１導電本体部１２から剥離しにくくなる。したがって、この実施形態のタッチパネル装置１００により、静電気Ｅに対する耐久性を向上させることができる。 As shown in FIGS. 14 and 15, the outer peripheral edge portion of the first substrate 10 is arranged inside the outer peripheral edge portion of the second substrate 20 in a plan view. Specifically, in a plan view, the entire circumference of the outer peripheral edge portion of the first substrate 10 is arranged inside the outer peripheral edge portion of the second substrate 20. Since the outer peripheral edge portion of the first substrate 10 is inside the outer peripheral edge portion of the second substrate, the distance between the position where the static electricity E is applied and the first outer peripheral conductive portions 15a and 15b becomes small. Therefore, even if the static electricity E is a low voltage, the static electricity E flowing through the first peripheral conductive portions 15a and 15b can be guided to an external device (not shown). As a result, the electrode portion 31 is less likely to be peeled off from the first conductive main body portion 12 as in the first embodiment described above. Therefore, the touch panel device 100 of this embodiment can improve the durability against static electricity E.
　図１４に示すように、筐体１０１と第１基板１０とが間隔ｄを空けて配置されている。筐体１０１と第１基板１０とを間隔ｄを空けて配置することにより、第１基板１０と筐体１０１とが絶縁される。これにより、静電気Ｅが筐体１０１へ流れにくくなるため、より確実に、静電気Ｅを第１外周導電部１５ａ，１５ｂに誘導することができる。したがって、この実施形態のタッチパネル装置１００により、静電気Ｅを第１外周導電部１５ａ以外の部分に流れることを抑制することができるため、タッチパネル装置１００の故障発生を抑制することができる。なお、間隔ｄは、０．２ｍｍ以上であることが好ましく、０．３ｍｍ以上であることがさらに好ましく、０．５ｍｍ以上であることが特に好ましい。また、間隔ｄに、筐体１０１と第１基板１０とを絶縁するための絶縁フィルムなどを配置してもよい。 As shown in FIG. 14, the housing 101 and the first substrate 10 are arranged with a space d. By arranging the housing 101 and the first board 10 at intervals d, the first board 10 and the housing 101 are insulated from each other. As a result, the static electricity E is less likely to flow to the housing 101, so that the static electricity E can be more reliably guided to the first outer peripheral conductive portions 15a and 15b. Therefore, the touch panel device 100 of this embodiment can suppress the flow of static electricity E to a portion other than the first outer peripheral conductive portion 15a, so that the occurrence of failure of the touch panel device 100 can be suppressed. The interval d is preferably 0.2 mm or more, more preferably 0.3 mm or more, and particularly preferably 0.5 mm or more. Further, an insulating film or the like for insulating the housing 101 and the first substrate 10 may be arranged at the interval d.
　［その他の実施形態］
　上記第１実施形態では、第１絶縁部１４ａ，１４ｂおよび第１外周導電部１５ａ，１５ｂを設けた形態を示したが、この形態に限られない。例えば、第１絶縁部１４ａおよび第１外周導電部１５ａのみを設けた形態としてもよい。 [Other embodiments]
In the first embodiment, the first insulating portions 14a and 14b and the first outer peripheral conductive portions 15a and 15b are provided, but the present invention is not limited to this embodiment. For example, only the first insulating portion 14a and the first outer peripheral conductive portion 15a may be provided.
　なお、上記第１～第３実施形態では、第１基板１０の外周縁部と第２基板２０との外周縁部が平面視で同じ位置になるように構成されているが、第１基板１０の外周縁部が第２基板２０の外周縁部よりも、平面視で内側になるように構成されてもよいし、平面視で外側になるように構成されてもよい。 In the first to third embodiments, the outer peripheral edge portion of the first substrate 10 and the outer peripheral edge portion of the second substrate 20 are configured to be at the same position in a plan view, but the first substrate 10 The outer peripheral edge portion of the second substrate 20 may be configured to be inside the outer peripheral edge portion of the second substrate 20 in a plan view, or may be configured to be outside in a plan view.
　以上、本開示についての実施形態を説明したが、本開示は上述の実施形態のみに限定されず、本開示の範囲内で種々の変更が可能である。 Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various changes can be made within the scope of the present disclosure.
　本開示は、押圧操作を行うことが可能な抵抗膜式のタッチセンサとして産業上の利用が可能である。 The present disclosure can be industrially used as a resistance film type touch sensor capable of performing a pressing operation.
１：タッチセンサ
３：フレキシブル配線板
１０：第１基板
１１：第１導電層
１２：第１導電本体部
１３：操作領域
１４ａ～１４ｈ：第１絶縁部
１５ａ，１５ｂ：第１外周導電部
２０：第２基板
２１：第２導電層
２２：第２導電本体部
２３：操作領域
２４ａ～２４ｅ：第２絶縁部
２５：第２外周導電部
３０ａ，３０ｂ：第１電極
３１：電極部
３２：配線部
３３：接続端子部
３５：外周電極
４０ａ，４０ｂ：第２電極
４１：電極部
４２：配線部
４３：接続端子部
１００：タッチパネル装置
１０１：筐体
１０２：ディスプレイパネル
Ｓ：操作空間
Ｅ：静電気 1: Touch sensor 3: Flexible wiring plate 10: First substrate 11: First conductive layer 12: First conductive main body 13: Operation regions 14a to 14h: First insulating portions 15a, 15b: First outer peripheral conductive portion 20: 2nd substrate 21: 2nd conductive layer 22: 2nd conductive main body 23: operation area 24a to 24e: 2nd insulating part 25: 2nd outer peripheral conductive part 30a, 30b: 1st electrode 31: electrode part 32: wiring part 33: Connection terminal 35: Outer peripheral electrodes 40a, 40b: Second electrode 41: Electrode 42: Wiring 43: Connection terminal 100: Touch panel device 101: Housing 102: Display panel S: Operation space E: Static electricity

Claims (7)

  1. 　抵抗膜式のタッチセンサであって、
    　第１基板と、
    　前記第１基板の下面に配置される第１導電層と、
    　前記第１導電層の下面周縁に配置され、前記第１導電層の電気抵抗率よりも低い電気抵抗率を有する一対の第１電極と、
    　前記第１基板の下面周縁に配置されるフレキシブル配線板と、を備え、
    　前記第１導電層は、
    　前記一対の第１電極と電気的に接続される第１導電本体部と、
    　前記第１導電本体部と電気的に絶縁され、前記一対の第１電極を前記第１基板の下面周縁から間隔をあけて囲むように前記第１導電本体部の外周に配置される非閉塞状の第１絶縁部と、
    　前記第１基板の下面周縁において前記第１導電本体部の外周から前記第１絶縁部を隔てた位置に配置され、前記第１絶縁部の延伸方向に沿って延びる非閉塞状の第１外周導電部と、を有し、
    　前記一対の第１電極の各々は、
    　前記第１導電本体部の下面周縁において互いに対向する位置に配置され、前記第１導電本体部を介して互いに電気的に接続される電極部と、
    　前記電極部と連続しかつ前記第１導電本体部の下面周縁において前記電極部と対向しない位置に配置される接続端子部と、を含み、
    　前記接続端子部は、前記フレキシブル配線板と電気的に接続されており、
    　前記第１絶縁部および前記第１外周導電部の各々は、少なくとも一方の端部が前記接続端子部の近傍に位置するように構成されており、
    　前記第１外周導電部は、前記少なくとも一方の端部が前記接続端子部の近傍で前記第１導電本体部と電気的に導通するように構成されている、タッチセンサ。     It is a resistance film type touch sensor.
    With the first board
    The first conductive layer arranged on the lower surface of the first substrate and
    A pair of first electrodes arranged on the lower peripheral edge of the first conductive layer and having an electrical resistivity lower than the electrical resistivity of the first conductive layer.
    A flexible wiring board arranged on the lower peripheral edge of the first substrate is provided.
    The first conductive layer is
    A first conductive main body that is electrically connected to the pair of first electrodes,
    A non-blocking shape that is electrically insulated from the first conductive main body and is arranged on the outer periphery of the first conductive main body so as to surround the pair of first electrodes at intervals from the lower peripheral edge of the first substrate. 1st insulation part of
    A non-blocking first outer peripheral conductor that is arranged on the lower peripheral edge of the first substrate at a position separated from the outer periphery of the first conductive main body portion and extends along the stretching direction of the first insulating portion. With a part,
    Each of the pair of first electrodes
    An electrode portion arranged at a position facing each other on the lower peripheral edge of the first conductive main body portion and electrically connected to each other via the first conductive main body portion.
    Includes a connection terminal portion that is continuous with the electrode portion and is arranged at a position not facing the electrode portion on the lower peripheral edge of the first conductive main body portion.
    The connection terminal portion is electrically connected to the flexible wiring board.
    Each of the first insulating portion and the first outer peripheral conductive portion is configured such that at least one end thereof is located in the vicinity of the connection terminal portion.
    The first outer peripheral conductive portion is a touch sensor configured such that at least one end thereof is electrically conductive with the first conductive main body portion in the vicinity of the connection terminal portion.
  2. 　請求項１に記載のタッチセンサにおいて、
    　前記第１外周導電部は、一対となるように構成されており、
    　前記一対の第１外周導電部は、一方の端部が前記接続端子部の近傍で前記第１導電本体部と電気的に導通し、かつ他方の端部同士が互いに電気的に絶縁されるように構成されている、タッチセンサ。     In the touch sensor according to claim 1,
    The first outer peripheral conductive portions are configured to be paired with each other.
    One end of the pair of first outer peripheral conductive portions is electrically conductive with the first conductive main body portion in the vicinity of the connection terminal portion, and the other ends are electrically insulated from each other. The touch sensor is configured in.
  3. 　請求項２に記載のタッチセンサにおいて、
    　前記一対の第１外周導電部の下面に配置されかつ前記一対の第１外周導電部の各々の延伸方向に沿って延び、前記第１導電層の電気抵抗率よりも低い電気抵抗率を有する一対の外周電極をさらに備え、
    　前記一対の外周電極の各々は、一方の端部が前記接続端子部の近傍で前記一対の第１電極の各々と電気的に導通し、かつ他方の端部同士が互いに電気的に絶縁されるように構成されている、タッチセンサ。     In the touch sensor according to claim 2,
    A pair that is arranged on the lower surface of the pair of first outer peripheral conductive portions and extends along the stretching direction of each of the pair of first outer peripheral conductive portions, and has an electrical resistivity lower than the electrical resistivity of the first conductive layer. Further equipped with outer peripheral electrodes,
    Each of the pair of outer peripheral electrodes has one end electrically conductive with each of the pair of first electrodes in the vicinity of the connection terminal portion, and the other ends are electrically insulated from each other. A touch sensor that is configured to.
  4. 　請求項３に記載のタッチセンサにおいて、
    　前記外周電極は、銀または銅を主成分とする材料を含む、タッチセンサ。     In the touch sensor according to claim 3,
    The outer peripheral electrode is a touch sensor containing a material containing silver or copper as a main component.
  5. 　請求項１～４のいずれか１項に記載のタッチセンサにおいて、
    　前記第１基板と操作空間を挟んで向かい合うように配置される第２基板と、
    　前記第２基板の上面に配置される第２導電層と、
    　前記第２導電層の上面に配置される一対の第２電極と、をさらに備え、
    　前記第２導電層は、
    　前記一対の第２電極と電気的に接続される第２導電本体部と、
    　前記第２導電本体部と電気的に絶縁され、前記一対の第２電極を前記第２基板の下面周縁から間隔をあけて囲むように配置される第２絶縁部と、を有する、タッチセンサ。     In the touch sensor according to any one of claims 1 to 4.
    A second board arranged so as to face the first board with an operation space in between,
    The second conductive layer arranged on the upper surface of the second substrate and
    A pair of second electrodes arranged on the upper surface of the second conductive layer is further provided.
    The second conductive layer is
    A second conductive main body that is electrically connected to the pair of second electrodes,
    A touch sensor having a second insulating portion that is electrically insulated from the second conductive main body portion and is arranged so as to surround the pair of second electrodes at intervals from the lower peripheral edge of the second substrate.
  6. 　請求項１～４のいずれか１項に記載のタッチセンサにおいて、
    　前記第１基板と操作空間を挟んで向かい合うように配置される第２基板とを備え、
    　前記第１基板の外周縁部が、前記第２基板の外周縁部よりも内側になるように構成されている、タッチセンサ。     In the touch sensor according to any one of claims 1 to 4.
    The first board and the second board arranged so as to face each other across the operation space are provided.
    A touch sensor configured such that the outer peripheral edge portion of the first substrate is inside the outer peripheral edge portion of the second substrate.
  7. 　請求項６に記載のタッチセンサと、
    　前記タッチセンサが内部に配置された筐体とを備え、
    　前記筐体と前記第１基板とが間隔を空けて配置されている、タッチパネル装置。     The touch sensor according to claim 6 and
    A housing in which the touch sensor is arranged is provided.
    A touch panel device in which the housing and the first substrate are arranged at intervals.
PCT/JP2021/019542 2020-07-16 2021-05-24 Touch sensor and touch panel device WO2022014161A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010191741A (en) * 2009-02-19 2010-09-02 Panasonic Corp Touch panel
JP2017068556A (en) * 2015-09-30 2017-04-06 日本航空電子工業株式会社 Touch panel
JP2019191791A (en) * 2018-04-23 2019-10-31 富士通コンポーネント株式会社 Touch panel device
JP2019212300A (en) * 2018-05-31 2019-12-12 日本航空電子工業株式会社 Touch panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010191741A (en) * 2009-02-19 2010-09-02 Panasonic Corp Touch panel
JP2017068556A (en) * 2015-09-30 2017-04-06 日本航空電子工業株式会社 Touch panel
JP2019191791A (en) * 2018-04-23 2019-10-31 富士通コンポーネント株式会社 Touch panel device
JP2019212300A (en) * 2018-05-31 2019-12-12 日本航空電子工業株式会社 Touch panel

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