WO2022012069A1 - Method for machining three-dimensional contour of transparent material - Google Patents

Method for machining three-dimensional contour of transparent material Download PDF

Info

Publication number
WO2022012069A1
WO2022012069A1 PCT/CN2021/080975 CN2021080975W WO2022012069A1 WO 2022012069 A1 WO2022012069 A1 WO 2022012069A1 CN 2021080975 W CN2021080975 W CN 2021080975W WO 2022012069 A1 WO2022012069 A1 WO 2022012069A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
transparent material
laser
dimensional contour
transparent
Prior art date
Application number
PCT/CN2021/080975
Other languages
French (fr)
Chinese (zh)
Inventor
孙威
程伟
库东峰
王雪辉
王建刚
温彬
Original Assignee
武汉华工激光工程有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华工激光工程有限责任公司 filed Critical 武汉华工激光工程有限责任公司
Publication of WO2022012069A1 publication Critical patent/WO2022012069A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the invention relates to the technical field of laser processing, in particular to a method for three-dimensional contour processing of transparent materials.
  • the existing processing methods of glass and silicon are mainly mechanical methods, and the mechanical methods are to use cemented carbide and diamond tools to grind glass and silicon.
  • the mechanical methods are to use cemented carbide and diamond tools to grind glass and silicon.
  • problems with this mechanical method For example, the removal of glass material will lead to chips and micro-cracks and need to increase the cleaning process. The biggest problem is that the glass product is not stable and the yield is not high.
  • Another example is the use of diamond tools to cut silicon wafers. On the one hand, the cost of tool damage and replacement is high. On the other hand, the processing debris and residual stress of machining, the product quality is not as good as laser processing.
  • the main mechanisms can be divided into the following types: conventional continuous and nanosecond pulsed laser melting and cutting separation mechanism, laser stealth cutting (or internal modified cutting) separation mechanism, laser thermal stress cutting ( Or called thermal cracking cutting, crack control cutting) separation mechanism, ultra-short pulse (picosecond and femtosecond) laser ablation cutting separation mechanism.
  • the targeted transparent and brittle materials mainly include glass with various properties, optical crystal materials, sapphire materials, and silicon crystal materials.
  • the Chinese patent with publication number CN105948476A on September 21, 2016 discloses a method for realizing glass chamfering by using laser, using ultra-short pulse laser ablation cutting and separation mechanism, and realizing material removal through the cooperation of laser beam and galvanometer scanning .
  • the material after laser processing needs to be separated.
  • Most of the existing separations use local heating and cooling methods, for example, using laser pulses to locally heat the contour part , and then spray cooling fluid to the heating part to cool, so that the workpiece and waste are separated.
  • This separation method is suitable for machining contours with relatively simple trajectories, but for three-dimensional contours with more complex trajectories, due to the higher requirements for the separation of the splits, the traditional partial separation method cannot achieve the separation effect, and cannot guarantee the separation along the The three-dimensional contour is cracked, and it is easy to have cracks but the processing material is not separated. It needs to be separated by other means. Therefore, how to solve the damages such as edge chipping and micro-cracks that are prone to occur in the process of three-dimensional contour forming of transparent materials, and how to improve the stability and yield of transparent materials, has become an urgent problem to be solved.
  • the present invention provides a method for processing a three-dimensional contour of a transparent material, so as to solve the problems existing in the process of forming the three-dimensional contour of a transparent material.
  • a method for three-dimensional contour processing of transparent materials including:
  • the laser beam having an ultrashort pulse width
  • the formed three-dimensional contour is shaped.
  • the laser beam processes the entire transparent material according to a preset path, continuously adjusts the laser processing energy according to different processing depths, and forms a three-dimensional outline of the transparent material by changing the Z-axis height and its corresponding processing trajectory; After the three-dimensional outline of the material is formed, the forming method is used for processing, so that the three-dimensional outline of the transparent material is separated from the waste material and finally formed; the invention uses a laser beam to act on the thickness direction of the entire transparent material, and uses an ultra-short pulse width to realize the modification of the transparent material. , Through a unique processing method, the transparent material is formed and separated to obtain a workpiece without cracks and no damage, avoiding the generation of fine debris and improving the product yield.
  • the laser beam performs laser modification on the transparent material layer by layer from the lower surface to the upper surface, and the modification trajectory of each layer can be determined according to its Z-axis height and three-dimensional contour size, thereby forming a specific three-dimensional contour shape.
  • the transparent material includes glass, sapphire, and silicon wafer.
  • the processing depth of each layer of the three-dimensional contour is controlled by setting the laser cutting speed, the distance between the laser points, and the size of the single laser pulse, and the laser processing energy is adjusted according to the processing depth.
  • Three-dimensional contour; the processing process of three-dimensional contour adopts single-point laser and Z-axis to cooperate with processing, or adopts segmental processing.
  • the invention adopts the XY linear motor with PSO function as the drive to drive the transparent material to move, and when using the PSO technology to process the three-dimensional contour graphics, it can effectively ensure the absolute uniformity between the points of the straight line and the arc laser action, so as to ensure Consistency of straight line and arc processing effect.
  • the single processing trajectory in the processing trajectory is divided into multiple segments for processing, which can greatly improve the processing efficiency.
  • a single processing trajectory needs to be processed through more than a dozen points, but the segmented processing method can be used to divide the single processing trajectory into 2 or 3 sections for processing to improve the processing efficiency.
  • segmented processing for the straight part, it can be shortened from 10-20 processing times to 2-3 processing times, which improves the overall processing efficiency of three-dimensional contours.
  • the "cold and hot method” is used to form the formed three-dimensional contour, including:
  • the three-dimensional profile of the transparent material after cooling for a third predetermined time is separated from the waste.
  • the transparent material after laser processing is treated by the overall cold and heat method, and the three-dimensional outline of the transparent material is effectively separated from the waste by limiting the combination sequence of heating and cooling, and the specific parameters of heating and cooling. Damage such as edge chipping and micro-cracks are generated during the contour forming process.
  • the present invention can prevent the entire transparent material from generating cracks outside the three-dimensional contour due to excessive thermal expansion and contraction, or the material cannot be caused by excessive thermal expansion and contraction. Separation, so as to ensure that the transparent material is separated along the three-dimensional contour without damage such as chipping and micro-cracks.
  • the first predetermined time is 1min-2min; the second predetermined time is 3S-5S; the third predetermined time is 5S-10S; and the predetermined temperature is 160°C-200°C.
  • the entire transparent material is placed in a heating furnace for heating.
  • the heating temperature and heating time are limited on the premise that the internal structure of the material is not damaged, and the purpose is to expand the laser processing area to a certain extent. Through the cooperation of heating temperature, heating time, placing time in air and cooling time, it is ensured that the material can be separated along the three-dimensional contour without damage such as chipping and micro-cracks.
  • the "cold-heat method” is to put the laser-processed transparent material in a heating furnace, heat it to a preset temperature of 160°C, keep the temperature for 1min-2min, stop heating, and place the transparent material in the air After 3s-5s, the transparent material is placed in H2O to cool (H2O is placed at room temperature), and finally the transparent material is taken out from the H2O, and the three-dimensional outline of the transparent material is separated from the waste material (which can also be separated by mechanical external force).
  • the formed three-dimensional contour is shaped by the "acid foaming method", including:
  • the three-dimensional profile of the transparent material is separated from the waste.
  • the wavelength range of the laser beam is 400nm-2500nm; the pulse width range of the laser beam is 100fs-10ps; the single point energy range of the laser beam is 5uj-10uj.
  • the wavelengths of 1550nm-2500nm are the processing bands for silicon wafers, and the wavelengths 532nm-1064nm are the processing bands for glass and sapphire.
  • the thickness of the transparent material ranges from 0.2 mm to 1.1 mm.
  • the laser processing energy corresponding to different processing depths on transparent materials is continuously adjustable.
  • a corresponding relationship between different thicknesses of the transparent material and the laser processing energy is established, and the laser processing energy is continuously adjusted for different processing depths according to the corresponding relationship, so that the overall laser focus within the thickness of the transparent material can be adjusted.
  • the energy concentration tends to be consistent.
  • a corresponding relationship between different material thicknesses and laser processing energy is established. Based on the corresponding relationship, continuous energy adjustment is performed for different processing depths. Ensure the consistency of the processing effect in the thickness direction of the entire transparent material.
  • the diameter of the focused spot of the laser beam ranges from 1um to 5um.
  • the offset distances ⁇ X and ⁇ Y of the XY axis are 1.5 times to 2.5 times the corresponding focused spot, and the moving distance of the Z axis ⁇ Z is 2-8 times the corresponding focused spot.
  • the smaller the focused spot the higher the energy density, the smaller the thermal impact on the processing of transparent materials, and the higher the strength of the processed product.
  • different three-dimensional contour shapes can be processed by setting different offset distances.
  • the focusing objective lens F is selected to be 4mm-50mm.
  • the focusing objective lens has a small focusing spot, which can realize the modification of transparent materials, less damage to the processed materials, and high strength of the finished product after processing.
  • a system for three-dimensional contour processing of transparent materials which is realized by the method, and the system includes a laser, a beam expander collimator, a microscope An objective lens, a Z-axis lifting stage, an XY linear motor and a control system, wherein the output end of the laser is connected to the input end of the beam expander collimator, and the output end of the beam expander collimator lens is connected to the input end of the microscope objective lens, The output of the microscope objective lens is incident on the transparent material workpiece, and the transparent material workpiece is placed above the XY linear motor and moves synchronously with the XY linear motor; the microscope objective lens is connected with the Z-axis lifting stage; the control systems are respectively Connect with laser, XY linear motor and Z axis lift table.
  • the transparent material is modified layer by layer from the lower surface to the upper surface of the transparent material by using a laser with an ultra-short pulse width. Outline shape.
  • the transparent material includes glass, sapphire, and silicon wafer.
  • the motor accuracy of the XY linear motor and the Z-axis lift table is within 5um, and the XY linear motor has its own PSO function to ensure the consistency of the effect of laser processing of straight lines and arcs.
  • the wavelength range of the laser beam is 400nm-2500nm; the pulse width of the laser beam is 100fs-10ps; the single point energy range of the laser beam is 5uj-10uj.
  • the thickness of the transparent material ranges from 0.2 mm to 1.1 mm.
  • the laser processing energy corresponding to different processing depths on transparent materials can be adjusted.
  • the laser beam is focused on any position in the thickness direction of the transparent material, and the focusing objective lens F is 4mm-50mm.
  • the diameter of the focusing spot of the laser beam is 1um-5um.
  • the offset distances ⁇ X and ⁇ Y of the XY axis It is 1.5 times to 2.5 times of the corresponding focused spot, and the Z-axis moving distance ⁇ Z is 2 to 8 times of the corresponding focused spot.
  • the smaller the focused spot the higher the energy density, the smaller the thermal impact on the processing of transparent materials, and the higher the strength of the processed product.
  • the present invention processes the entire transparent material according to a preset path through a laser beam with an ultra-short pulse width, and performs continuous laser processing energy adjustment for different processing depths.
  • the Z-axis height and its corresponding processing track By changing the Z-axis height and its corresponding processing track , to form a three-dimensional contour of a transparent material with a certain shape; after the three-dimensional contour of the transparent material is formed, the "cold and heat method” or “acid foaming method” is used for forming treatment, so that the three-dimensional contour of the transparent material is separated from the waste material and finally formed;
  • the laser beam acts on the entire thickness direction of the transparent material, and the ultra-short pulse width is used to realize the modification of the transparent material, and the transparent material is formed and separated by a unique processing method, so as to obtain a workpiece without cracks and no damage, and avoid the generation of fine debris , improve the product stability and product yield of transparent materials.
  • the present invention adopts the "cold-heat method" to form and separate the entire transparent material after laser processing.
  • the entire transparent material can be prevented from expanding and contracting due to thermal expansion. Too violent cracks outside the three-dimensional contour, or because the thermal expansion and cold contraction are too gentle, the material cannot be separated, so that the transparent material can be separated along the three-dimensional contour without damage such as edge chipping and micro-cracks, and the product yield is improved.
  • the present invention establishes the corresponding relationship between different thicknesses of transparent materials and laser processing energy, and continuously adjusts the laser processing energy for different processing depths according to the corresponding relationship, so that the overall laser focus within the thickness range of the transparent material can be adjusted.
  • the energy concentration tends to be consistent; for different processing depths, continuous energy adjustment can be carried out in a targeted manner to ensure the consistency of the processing effect in the thickness direction of the entire transparent material.
  • FIG. 1 is a corresponding relationship diagram between the thickness of a transparent material and the laser processing energy according to an embodiment of the present invention
  • FIG. 2 is a system frame diagram of a method for processing a three-dimensional contour of a transparent material according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a processing trajectory of a three-dimensional contour processing of a silicon wafer according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of separation of silicon wafers by “cold and heat method” according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram of a processing trajectory of glass three-dimensional contour processing according to an embodiment of the present invention.
  • Fig. 6 is a schematic diagram of the separation of glass by "foaming acid method" according to an embodiment of the present invention.
  • the steps of the corresponding methods are not necessarily performed in the order shown and described in this specification.
  • the method may include more or fewer steps than described in this specification.
  • a single step described in this specification may be decomposed into multiple steps for description in other embodiments; and multiple steps described in this specification may also be combined into a single step in other embodiments. describe.
  • the invention provides a method for three-dimensional contour processing of transparent materials, which includes: focusing a laser beam on the lower surface of the transparent material, the laser beam has an ultra-short pulse width; adjusting the height of the Z-axis to match the designed processing track, The laser beam is processed layer by layer from the lower surface of the transparent material to the upper surface, and the laser processing energy is adjusted according to different processing depths to form a three-dimensional contour on the transparent material; the formed three-dimensional contour is shaped.
  • the laser beam acts on the entire thickness direction of the transparent material, and the ultra-short pulse width is used to realize the modification of the transparent material, and the transparent material is formed and separated by a unique processing method, so as to obtain a workpiece without cracks and no damage, and avoid small broken pieces.
  • the generation of chips improves the product yield.
  • the present invention establishes the corresponding relationship between different thicknesses of transparent materials and laser processing energy. Based on the corresponding relationship, continuous laser processing energy adjustment can be performed according to different processing depths, so that the overall energy of laser focusing within the thickness range of the transparent material is concentrated. The degree of consistency tends to be consistent, ensuring the consistency of the processing effect in the thickness direction of the entire transparent material.
  • the thickness of the transparent material used in the present invention ranges from 0.2 mm to 1.1 mm. In order to ensure the consistency of the processing effect in the thickness direction of the entire transparent material, it is necessary to make the overall energy concentration in the entire thickness range of 1.1 mm to be consistent. Based on different thicknesses and their corresponding normalized energy concentration degrees, the present invention establishes a corresponding relationship between different material thicknesses and the energy concentration degrees of laser processing energy in the range of 0-1.1 mm. Please refer to Figure 1.
  • Figure 1 shows the correspondence between the thickness of the transparent material and the normalized energy concentration of the laser processing energy under different lens numerical apertures. The abscissa of the curve is the glass thickness Tc, and the ordinate is the normalized energy concentration.
  • the normalized energy concentration J the curve represents the theoretical normalized value of the energy concentration required for processing at different processing depths inside the glass, along the direction of the optical axis, the thicker the thickness when it reaches the inside of the material, The deeper the processing depth, the lower the energy concentration of the laser focusing, and the higher the energy required for processing.
  • the numerical aperture (NA) of different lenses the energy concentration of the laser inside the material of the same thickness is also different. The larger the NA, the lower the energy concentration; under the same NA, in different material thicknesses The energy concentration of NA is also different. The smaller the NA, the higher the energy concentration, and the lower the energy required for actual processing.
  • the overall energy concentration of laser processing energy in the entire 1.1mm thickness range tends to be consistent:
  • r and is the polar coordinate of the reference spherical point of the optical system
  • f' is the focal length of the optical system
  • w K is the maximum angle of view
  • n is the refractive index of the material
  • Tc is the center thickness of the material
  • H is the half diameter of the material just incident
  • S1 is the third-order spherical aberration coefficient
  • S2 is the third-order coma coefficient
  • S3 is the meridional field curvature
  • S4 is the sagittal field curvature
  • K is the wave vector
  • W is the wave aberration
  • NA is the numerical aperture of the optical system
  • F is the optical system
  • the f number of , A 00 is a constant.
  • this embodiment provides a method for processing a three-dimensional contour of a silicon wafer, including the following steps: using a laser 1 with a pulse width ranging from picoseconds to femtoseconds and a laser wavelength of 1550 nm; laser 1
  • the generated focused laser beam 5 is laser modified layer by layer from the lower surface to the upper surface of the silicon wafer 6, and the modified focus position is realized by the high-precision Z-axis lifting stage 4 driving the microscope objective lens 3, and the motion trajectory corresponding to the different focus positions is given by
  • the control system 8 is calculated and generated, and is realized by controlling the XY linear motor 7; by setting the laser cutting speed, the PSO laser spot spacing, and the laser single pulse size, the processing depth of each layer from S1 to Sn on the three-dimensional contour of the silicon wafer 9 is controlled, and each layer is matched with each other.
  • the corresponding trajectory thus forms a three-dimensional contour of a certain shape.
  • the "cold-hot method” is used to form the three-dimensional contour silicon wafer to generate a cold-hot separation zone 12, and the finished product 10 and the waste material 11 are completely separated under the action of mechanical external force.
  • the silicon wafer 6 has a thickness of 0.5mm:
  • control system 8 uses the control system 8 to calculate the processing height of each layer of the S1-Sn layer and the corresponding processing trajectory;
  • control system 8 completes S1- The laser modification of the Sn layer finally forms the three-dimensional profile 9 of the silicon wafer shown in FIG. 4 ;
  • the three-dimensional contour 9 of the silicon wafer is processed by the "cold and heat method" to generate a cold and hot separation zone 12, and the finished product 10 and the waste material 11 are completely separated under the action of external mechanical force.
  • the present embodiment provides a method for processing a three-dimensional profile of glass, including the following steps: using a laser 1 with a pulse width ranging from picoseconds to femtoseconds and a laser wavelength of 1030-1080 nm; 1.
  • the focused laser beam 5 generated by the glass 6 undergoes layer-by-layer laser modification from the lower surface to the upper surface of the glass 6.
  • the modified focus position is realized by the high-precision Z-axis lifting stage 4 driving the microscope objective lens 3, and the motion trajectories corresponding to different focus positions are given by
  • the control system 8 is calculated and generated, and is realized by controlling the XY linear motor 7; by setting the laser cutting speed, the PSO laser spot spacing, and the laser single pulse size, the processing depth of each layer from G1 to Gn on the laser modification track 13 is controlled, and each layer is matched with each other.
  • the corresponding trajectory thus forms a three-dimensional contour of a certain shape.
  • the three-dimensional contour glass is formed by the "acid soaking method" to generate corrosion grooves 16, and after ultrasonic cleaning by a cleaning machine, the finished product 14 and the waste material 16 are completely separated.
  • glass 6, thickness 0.8mm As shown in Figures 5 and 6, glass 6, thickness 0.8mm:
  • control system 8 uses the control system 8 to calculate the processing height and corresponding processing track of each layer of the G1-Gn layer;
  • control system 8 completes G1- by controlling high-precision Z axis 4 and linear motor 7
  • the laser modification of the Gn layer finally forms the three-dimensional profile 13 of the glass shown in Figure 3-2;
  • the three-dimensional contour 13 of the glass is processed by the "acid soaking method" to generate corrosion grooves 16 . After ultrasonic cleaning by a cleaning machine, the finished product 14 and the waste material 16 are completely separated.
  • the invention processes the entire transparent material according to a preset path through a laser beam with an ultra-short pulse width, performs continuous laser processing energy adjustment for different processing depths, and changes the Z-axis height and its corresponding processing track to form a
  • the three-dimensional contour of the transparent material with a certain shape; after the three-dimensional contour of the transparent material is formed, the "cold and heat method” or “acid foaming method” is used for forming treatment, so that the three-dimensional contour of the transparent material is separated from the waste material and finally formed, and a crack-free and damage-free material is obtained.
  • the workpiece can avoid the generation of fine debris, and improve the product stability and product yield of transparent materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Laser Beam Processing (AREA)

Abstract

A method for machining a three-dimensional contour of a transparent material. The whole transparent material is machined according to a pre-set path and by means of a laser beam (5), laser machining energy is continuously adjusted according to different machining depths, and a three-dimensional contour of the transparent material is formed by means of changing a Z-axis height and a corresponding machining trajectory thereof; and after the three-dimensional contour of the transparent material is formed, a molding method is then used for performing processing, such that the three-dimensional contour of the transparent material is separated from waste and finally molded.

Description

一种用于透明材料三维轮廓加工的方法A method for three-dimensional contour processing of transparent materials 技术领域technical field
本发明涉及激光加工技术领域，尤其涉及一种用于透明材料三维轮廓加工的方法。The invention relates to the technical field of laser processing, in particular to a method for three-dimensional contour processing of transparent materials.
背景技术Background technique
随着电子产品的迅猛发展，尤其是智能手机、平板电脑等都在朝着体积更薄、重量更轻的方向发展。这些电子产品都离不开玻璃薄板，目前，电子产品上的玻璃薄板的厚度已经由原来的1.1mm降低至0.6-0.7mm，手机屏幕的玻璃薄板已经降低至0.3mm甚至更低。厚度越薄的玻璃薄板对作用力越敏感，越容易受冲击后发生脆断，这无疑增加了加工的难度。硅作为重要的衬底材料被广泛应用于LED行业，虽然它有导热性好、稳定性高的特点，但其脆硬的特性也给加工带来了不小的难度。With the rapid development of electronic products, especially smart phones, tablet computers, etc., are developing in the direction of thinner volume and lighter weight. These electronic products are inseparable from glass sheets. At present, the thickness of glass sheets on electronic products has been reduced from the original 1.1mm to 0.6-0.7mm, and the glass sheets of mobile phone screens have been reduced to 0.3mm or even lower. The thinner the glass sheet, the more sensitive it is to the force, and the easier it is to break after being impacted, which undoubtedly increases the difficulty of processing. Silicon, as an important substrate material, is widely used in the LED industry. Although it has the characteristics of good thermal conductivity and high stability, its brittleness and hardness also make processing difficult.
现有的玻璃、硅的加工方法主要是机械方法，机械方法是采用硬质合金和金刚石刀具对玻璃、硅进行磨削加工。然而，这种机械方法存在诸多问题，例如玻璃材料的去除会导致碎屑及微裂纹并需要增加清洗工序，最大问题是玻璃产品稳定性不好，良品率不高。又例如利用金刚石刀具切割硅片，一方面刀具损坏更换成本高，另一方面加工碎屑及机械加工残余应力，产品品质不如激光加工。The existing processing methods of glass and silicon are mainly mechanical methods, and the mechanical methods are to use cemented carbide and diamond tools to grind glass and silicon. However, there are many problems with this mechanical method. For example, the removal of glass material will lead to chips and micro-cracks and need to increase the cleaning process. The biggest problem is that the glass product is not stable and the yield is not high. Another example is the use of diamond tools to cut silicon wafers. On the one hand, the cost of tool damage and replacement is high. On the other hand, the processing debris and residual stress of machining, the product quality is not as good as laser processing.
激光切割透明脆性材料有多种机理，主要机理可以分为以下几种：常规连续和纳秒脉冲激光熔化切割分离机理，激光隐形切割(或叫做内部改性切割)分离机理，激光热应力切割(或叫做热裂法切割、裂纹控制法切割)分离机理，超短脉冲(皮秒和飞秒)激光烧蚀切割分离机理。针对的透明脆性材料主要包括各种性能的玻璃，光学晶体材料和蓝宝石材料以及硅晶材料等。如公开号CN105948476A的中国专利于2016年9月21日公开了一种利用激光实现玻璃倒边的方法，采用超短脉冲激光烧蚀切割分离机理，通过激光束与振镜扫描相配合实现材料去除。There are many mechanisms for laser cutting of transparent and brittle materials. The main mechanisms can be divided into the following types: conventional continuous and nanosecond pulsed laser melting and cutting separation mechanism, laser stealth cutting (or internal modified cutting) separation mechanism, laser thermal stress cutting ( Or called thermal cracking cutting, crack control cutting) separation mechanism, ultra-short pulse (picosecond and femtosecond) laser ablation cutting separation mechanism. The targeted transparent and brittle materials mainly include glass with various properties, optical crystal materials, sapphire materials, and silicon crystal materials. For example, the Chinese patent with publication number CN105948476A on September 21, 2016 discloses a method for realizing glass chamfering by using laser, using ultra-short pulse laser ablation cutting and separation mechanism, and realizing material removal through the cooperation of laser beam and galvanometer scanning .
对于激光隐形切割(或叫做内部改性切割)分离，需要对激光加工后的材料进行分离，现有的分离大部分都是利用局部加热冷却方式，例如，利用激光脉冲对轮廓线部分进行局部加热，然后对加热部位喷射冷却流体进行冷却，使加工件与废料分离。这种分离方式适用于轨迹比较简单的加工轮廓，但对于轨迹更复杂的三维轮廓，由于其对分离裂片的要求更高，采用传统的局部分离方式达不到分离效果，不能保证分离时沿着三维轮廓裂开，容易出现有裂纹存在而加工材料并未分离的现象，需要借助其他手段实现分离。因此，如何解决透明材料三维轮廓成型过程中容易产生崩边、微裂纹等损伤，提高透明材料产品稳定 性和良品率，成为亟需解决的问题。For laser stealth cutting (or internal modified cutting) separation, the material after laser processing needs to be separated. Most of the existing separations use local heating and cooling methods, for example, using laser pulses to locally heat the contour part , and then spray cooling fluid to the heating part to cool, so that the workpiece and waste are separated. This separation method is suitable for machining contours with relatively simple trajectories, but for three-dimensional contours with more complex trajectories, due to the higher requirements for the separation of the splits, the traditional partial separation method cannot achieve the separation effect, and cannot guarantee the separation along the The three-dimensional contour is cracked, and it is easy to have cracks but the processing material is not separated. It needs to be separated by other means. Therefore, how to solve the damages such as edge chipping and micro-cracks that are prone to occur in the process of three-dimensional contour forming of transparent materials, and how to improve the stability and yield of transparent materials, has become an urgent problem to be solved.
发明内容SUMMARY OF THE INVENTION
为克服上述现有技术的不足，本发明提供一种用于透明材料三维轮廓加工的方法，以解决透明材料三维轮廓成型过程中存在的问题。In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a method for processing a three-dimensional contour of a transparent material, so as to solve the problems existing in the process of forming the three-dimensional contour of a transparent material.
本发明是通过以下技术方案予以实现的：The present invention is achieved through the following technical solutions:
根据本说明书一个实施例或多个实施例的一方面，提供一种用于透明材料三维轮廓加工的方法，包括：According to an aspect of one or more embodiments of the present specification, there is provided a method for three-dimensional contour processing of transparent materials, including:
使激光束聚焦于透明材料的下表面，所述激光束具有超短脉冲宽度；focusing a laser beam on the lower surface of the transparent material, the laser beam having an ultrashort pulse width;
调整Z轴高度，配合设计好的加工轨迹，使激光束从透明材料的下表面往上表面逐层加工，根据不同加工深度调整激光加工能量，在透明材料上形成三维轮廓；Adjust the height of the Z-axis and cooperate with the designed processing track, so that the laser beam is processed layer by layer from the lower surface of the transparent material to the upper surface, and the laser processing energy is adjusted according to different processing depths to form a three-dimensional contour on the transparent material;
对形成的三维轮廓进行成型处理。The formed three-dimensional contour is shaped.
上述技术方案中，激光束针对整个透明材料按照预先设定的路径进行加工，根据不同加工深度连续式调整激光加工能量，通过改变Z轴高度和其对应的加工轨迹，形成透明材料三维轮廓；透明材料三维轮廓形成后，再利用成型方法进行处理，使透明材料三维轮廓与废料分离而最终成型；本发明通过激光束作用于整个透明材料厚度方向，利用超短脉冲宽度实现对透明材料的改质，通过特有的处理方法进行透明材料成型分离，以获得无裂纹无损伤的工件，避免了细小碎屑的产生，提高了产品良率。In the above technical solution, the laser beam processes the entire transparent material according to a preset path, continuously adjusts the laser processing energy according to different processing depths, and forms a three-dimensional outline of the transparent material by changing the Z-axis height and its corresponding processing trajectory; After the three-dimensional outline of the material is formed, the forming method is used for processing, so that the three-dimensional outline of the transparent material is separated from the waste material and finally formed; the invention uses a laser beam to act on the thickness direction of the entire transparent material, and uses an ultra-short pulse width to realize the modification of the transparent material. , Through a unique processing method, the transparent material is formed and separated to obtain a workpiece without cracks and no damage, avoiding the generation of fine debris and improving the product yield.
进一步地，所述激光束对透明材料进行从下表面到上表面逐层激光改质，每层的改质轨迹可根据其Z轴高度和三维轮廓尺寸确定，从而形成特定三维轮廓形状。Further, the laser beam performs laser modification on the transparent material layer by layer from the lower surface to the upper surface, and the modification trajectory of each layer can be determined according to its Z-axis height and three-dimensional contour size, thereby forming a specific three-dimensional contour shape.
进一步地，所述透明材料包括玻璃、蓝宝石、硅片。Further, the transparent material includes glass, sapphire, and silicon wafer.
作为进一步的技术方案，通过设置激光切割速度、激光点间距、激光单脉冲大小来控制三维轮廓每层加工深度，根据加工深度调整激光加工能量，同时配合每层对应的加工轨迹，形成一定形状的三维轮廓；三维轮廓的加工过程采用单点激光与Z轴配合加工，或者采用分段加工。本发明采用具有PSO功能的XY直线电机作为驱动，带动透明材料移动，利用PSO技术在加工三维轮廓图形时，能够有效保证直线与圆弧激光作用的点与点之间的绝对均匀性，从而保证直线与圆弧加工效果的一致性。As a further technical solution, the processing depth of each layer of the three-dimensional contour is controlled by setting the laser cutting speed, the distance between the laser points, and the size of the single laser pulse, and the laser processing energy is adjusted according to the processing depth. Three-dimensional contour; the processing process of three-dimensional contour adopts single-point laser and Z-axis to cooperate with processing, or adopts segmental processing. The invention adopts the XY linear motor with PSO function as the drive to drive the transparent material to move, and when using the PSO technology to process the three-dimensional contour graphics, it can effectively ensure the absolute uniformity between the points of the straight line and the arc laser action, so as to ensure Consistency of straight line and arc processing effect.
进一步地，采用分段加工方式进行加工，将加工轨迹中的单次加工轨迹分成多段进行加工，可以大大提高加工效率。如单次加工轨迹需要通过十几个点完成加工，但是采用分段加工方式，可将该单次加工轨迹划分成2段或3段进行加工，提高加工效率。采用分段加工时，针对直线部分，可以从10-20次加工缩短到2-3次加工完成，提高三维轮廓整体 加工效率。Further, by adopting the segmented processing method for processing, the single processing trajectory in the processing trajectory is divided into multiple segments for processing, which can greatly improve the processing efficiency. For example, a single processing trajectory needs to be processed through more than a dozen points, but the segmented processing method can be used to divide the single processing trajectory into 2 or 3 sections for processing to improve the processing efficiency. When using segmented processing, for the straight part, it can be shortened from 10-20 processing times to 2-3 processing times, which improves the overall processing efficiency of three-dimensional contours.
作为进一步的技术方案，采用“冷热法”对形成的三维轮廓进行成型处理，包括：As a further technical solution, the "cold and hot method" is used to form the formed three-dimensional contour, including:
将激光加工后的透明材料整体放入加热炉中，加热到预定温度，保温第一预定时间后停止加热；Put the laser-processed transparent material into a heating furnace as a whole, heat it to a predetermined temperature, and stop heating after the heat preservation for a first predetermined time;
将加热后的透明材料整体放置于空气中持续第二预定时间；placing the heated transparent material in the air as a whole for a second predetermined time;
将放置第二预定时间后的透明材料整体放置于水中冷却第三预定时间；placing the entire transparent material after being placed for a second predetermined time in water to cool for a third predetermined time;
将冷却第三预定时间后的透明材料的三维轮廓与废料分离。The three-dimensional profile of the transparent material after cooling for a third predetermined time is separated from the waste.
上述技术方案中，对激光加工后透明材料进行整体的冷热法处理，通过限定加热和冷却的组合顺序、加热和冷却的具体参数，实现透明材料三维轮廓与废料的有效分离，避免透明材料三维轮廓成型过程中产生崩边、微裂纹等损伤。本发明通过对加热和冷却的组合顺序、加热和冷却的具体参数的限定，可以避免透明材料整体因为热胀冷缩太剧烈产生三维轮廓外的裂纹，或者因为热胀冷缩太平缓导致材料无法分离，从而保证透明材料沿着三维轮廓分离且不产生崩边、微裂纹等损伤。In the above technical solution, the transparent material after laser processing is treated by the overall cold and heat method, and the three-dimensional outline of the transparent material is effectively separated from the waste by limiting the combination sequence of heating and cooling, and the specific parameters of heating and cooling. Damage such as edge chipping and micro-cracks are generated during the contour forming process. By limiting the combination sequence of heating and cooling, and the specific parameters of heating and cooling, the present invention can prevent the entire transparent material from generating cracks outside the three-dimensional contour due to excessive thermal expansion and contraction, or the material cannot be caused by excessive thermal expansion and contraction. Separation, so as to ensure that the transparent material is separated along the three-dimensional contour without damage such as chipping and micro-cracks.
作为进一步的技术方案，所述第一预定时间为1min-2min；所述第二预定时间为3S-5S；所述第三预定时间为5S-10S；所述预定温度为160℃-200℃。将透明材料整体放到加热炉中进行加热，其加热温度及加热时间的限定是以不破坏材料内部结构为前提，目的是使激光加工区域发生一定膨胀。通过加热温度、加热时间、空气中放置时间和冷却时间的相互配合，保证了材料可以沿着三维轮廓分离且不产生崩边、微裂纹等损伤。As a further technical solution, the first predetermined time is 1min-2min; the second predetermined time is 3S-5S; the third predetermined time is 5S-10S; and the predetermined temperature is 160°C-200°C. The entire transparent material is placed in a heating furnace for heating. The heating temperature and heating time are limited on the premise that the internal structure of the material is not damaged, and the purpose is to expand the laser processing area to a certain extent. Through the cooperation of heating temperature, heating time, placing time in air and cooling time, it is ensured that the material can be separated along the three-dimensional contour without damage such as chipping and micro-cracks.
作为优选技术方案，所述“冷热法”是把激光加工后的透明材料放到加热炉中，加热到预先设置好的温度160℃，保温1min-2min后停止加热，把透明材料置于空气中3s-5s后，将透明材料放置H2O冷却(H2O置于常温)，最后把透明材料从H2O中取出，透明材料三维轮廓与废料分离(亦可借助机械外力分离)。As a preferred technical solution, the "cold-heat method" is to put the laser-processed transparent material in a heating furnace, heat it to a preset temperature of 160°C, keep the temperature for 1min-2min, stop heating, and place the transparent material in the air After 3s-5s, the transparent material is placed in H2O to cool (H2O is placed at room temperature), and finally the transparent material is taken out from the H2O, and the three-dimensional outline of the transparent material is separated from the waste material (which can also be separated by mechanical external force).
作为进一步的技术方案，采用“泡酸法”对形成的三维轮廓进行成型处理，包括：As a further technical solution, the formed three-dimensional contour is shaped by the "acid foaming method", including:
将激光加工后的透明材料整体放入酸中进行腐蚀，根据透明材料腐蚀深度设置泡酸时间；Put the laser-processed transparent material into acid for corrosion, and set the acid soaking time according to the corrosion depth of the transparent material;
在透明材料的三维轮廓与废料之间形成明显沟槽后，取出透明材料；After a clear groove is formed between the three-dimensional contour of the transparent material and the waste material, the transparent material is taken out;
将透明材料放入清洗机中进行超声清洗；Put the transparent material into the cleaning machine for ultrasonic cleaning;
超声清洗完成后，透明材料三维轮廓与废料分离。After the ultrasonic cleaning is completed, the three-dimensional profile of the transparent material is separated from the waste.
上述技术方案中，使用特定浓度配比的酸进行透明材料的整体腐蚀，所述特定浓度配比的酸包括质量分数25％HF或HF：HNO3：H2O＝1：1：100或HF：HNO3：H2O＝1:3:4。In the above technical solution, the overall corrosion of the transparent material is carried out by using an acid with a specific concentration ratio, and the acid with a specific concentration ratio includes a mass fraction of 25% HF or HF:HNO3:H2O=1:1:100 or HF:HNO3: H2O=1:3:4.
作为进一步的技术方案，所述激光束的波长范围为400nm-2500nm；所述激光束的脉冲宽度范围为100fs-10ps；所述激光束的单点能量范围为5uj-10uj。As a further technical solution, the wavelength range of the laser beam is 400nm-2500nm; the pulse width range of the laser beam is 100fs-10ps; the single point energy range of the laser beam is 5uj-10uj.
具体地，1550nm-2500nm波长是针对硅片的加工波段，532nm-1064nm是针对玻璃和蓝宝石的加工波段。Specifically, the wavelengths of 1550nm-2500nm are the processing bands for silicon wafers, and the wavelengths 532nm-1064nm are the processing bands for glass and sapphire.
作为进一步的技术方案，所述透明材料的厚度范围为0.2mm-1.1mm。透明材料上不同加工深度对应的激光加工能量连续可调。As a further technical solution, the thickness of the transparent material ranges from 0.2 mm to 1.1 mm. The laser processing energy corresponding to different processing depths on transparent materials is continuously adjustable.
作为进一步的技术方案，建立透明材料不同厚度与激光加工能量之间的对应关系，根据所述对应关系针对不同的加工深度进行激光加工能量的连续调整，使得在透明材料厚度范围内激光聚焦的整体能量集中度趋于一致。因为加工深度不同时，存在物镜相差问题，影响激光加工能量的有效利用，所以建立不同材料厚度与激光加工能量之间的对应关系，基于该对应关系，针对不同的加工深度进行连续的能量调整，保证整个透明材料厚度方向上的加工效果一致性。As a further technical solution, a corresponding relationship between different thicknesses of the transparent material and the laser processing energy is established, and the laser processing energy is continuously adjusted for different processing depths according to the corresponding relationship, so that the overall laser focus within the thickness of the transparent material can be adjusted. The energy concentration tends to be consistent. When the processing depth is different, there is the problem of objective lens aberration, which affects the effective utilization of laser processing energy. Therefore, a corresponding relationship between different material thicknesses and laser processing energy is established. Based on the corresponding relationship, continuous energy adjustment is performed for different processing depths. Ensure the consistency of the processing effect in the thickness direction of the entire transparent material.
作为进一步的技术方案，所述激光束的聚焦光斑的直径范围为1um-5um，根据聚焦光斑大小，XY轴的偏移距离ΔX、ΔY是对应聚焦光斑的1.5倍-2.5倍，Z轴移动距离ΔZ是对应聚焦光斑的2倍-8倍。聚焦光斑越小，能量密度越高，对透明材料加工带来的热影响越小，加工后的产品强度越高。As a further technical solution, the diameter of the focused spot of the laser beam ranges from 1um to 5um. According to the size of the focused spot, the offset distances ΔX and ΔY of the XY axis are 1.5 times to 2.5 times the corresponding focused spot, and the moving distance of the Z axis ΔZ is 2-8 times the corresponding focused spot. The smaller the focused spot, the higher the energy density, the smaller the thermal impact on the processing of transparent materials, and the higher the strength of the processed product.
具体地，可通过设置不同的偏移距离实现不同三维轮廓形状的加工。Specifically, different three-dimensional contour shapes can be processed by setting different offset distances.
进一步地，选用聚焦物镜F为4mm-50mm。聚焦物镜的聚焦光斑小，可以实现透明材料的改质，对加工材料的损伤小，加工后成品的强度高。Further, the focusing objective lens F is selected to be 4mm-50mm. The focusing objective lens has a small focusing spot, which can realize the modification of transparent materials, less damage to the processed materials, and high strength of the finished product after processing.
根据本说明书一个实施例或多个实施例的另一方面，提供一种用于透明材料三维轮廓加工的***，采用所述的方法实现，所述***包括激光器、扩束准直镜、显微物镜、Z轴升降台、XY直线电机和控制***，其中，所述激光器的输出端连接扩束准直镜的输入端，所述扩束准直镜的输出端连接显微物镜的输入端，所述显微物镜的输出入射到透明材料工件上，所述透明材料工件置于XY直线电机上方且与XY直线电机同步运动；所述显微物镜与Z轴升降台连接；所述控制***分别与激光器、XY直线电机和Z轴升降台连接。According to another aspect of one or more embodiments of the present specification, there is provided a system for three-dimensional contour processing of transparent materials, which is realized by the method, and the system includes a laser, a beam expander collimator, a microscope An objective lens, a Z-axis lifting stage, an XY linear motor and a control system, wherein the output end of the laser is connected to the input end of the beam expander collimator, and the output end of the beam expander collimator lens is connected to the input end of the microscope objective lens, The output of the microscope objective lens is incident on the transparent material workpiece, and the transparent material workpiece is placed above the XY linear motor and moves synchronously with the XY linear motor; the microscope objective lens is connected with the Z-axis lifting stage; the control systems are respectively Connect with laser, XY linear motor and Z axis lift table.
上述技术方案中，利用超短脉冲宽度的激光对透明材料进行从下表面到上表面逐层激光改质，每层的改质轨迹可根据其Z轴高度和三维轮廓尺寸确定，从而形成特定三维轮廓形状。In the above technical solution, the transparent material is modified layer by layer from the lower surface to the upper surface of the transparent material by using a laser with an ultra-short pulse width. Outline shape.
所述透明材料包括玻璃、蓝宝石、硅片。The transparent material includes glass, sapphire, and silicon wafer.
所述XY直线电机和Z轴升降台的电机精度均在5um以内，并且XY直线电机自带PSO 功能，确保激光加工直线和圆弧的效果一致性。The motor accuracy of the XY linear motor and the Z-axis lift table is within 5um, and the XY linear motor has its own PSO function to ensure the consistency of the effect of laser processing of straight lines and arcs.
所述激光束的波长范围为400nm-2500nm；所述激光束的脉冲宽度范围为100fs-10ps；所述激光束的单点能量范围为5uj-10uj。The wavelength range of the laser beam is 400nm-2500nm; the pulse width of the laser beam is 100fs-10ps; the single point energy range of the laser beam is 5uj-10uj.
所述透明材料的厚度范围为0.2mm-1.1mm。透明材料上不同加工深度对应的激光加工能量可调。The thickness of the transparent material ranges from 0.2 mm to 1.1 mm. The laser processing energy corresponding to different processing depths on transparent materials can be adjusted.
激光束聚焦于透明材料厚度方向的任意位置，选用聚焦物镜F为4mm-50mm，所述激光束的聚焦光斑的直径范围为1um-5um，根据聚焦光斑大小，XY轴的偏移距离ΔX、ΔY是对应聚焦光斑的1.5倍-2.5倍，Z轴移动距离ΔZ是对应聚焦光斑的2倍-8倍。聚焦光斑越小，能量密度越高，对透明材料加工带来的热影响越小，加工后的产品强度越高。The laser beam is focused on any position in the thickness direction of the transparent material, and the focusing objective lens F is 4mm-50mm. The diameter of the focusing spot of the laser beam is 1um-5um. According to the size of the focusing spot, the offset distances ΔX and ΔY of the XY axis It is 1.5 times to 2.5 times of the corresponding focused spot, and the Z-axis moving distance ΔZ is 2 to 8 times of the corresponding focused spot. The smaller the focused spot, the higher the energy density, the smaller the thermal impact on the processing of transparent materials, and the higher the strength of the processed product.
与现有技术相比，本发明的有益效果在于：Compared with the prior art, the beneficial effects of the present invention are:
(1)本发明通过超短脉冲宽度的激光束对整个透明材料按照预先设定的路径进行加工，对不同的加工深度进行连续式激光加工能量调整，通过改变Z轴高度和其对应的加工轨迹，形成具有一定形状的透明材料三维轮廓；透明材料三维轮廓形成后，再利用“冷热法”或“泡酸法”进行成型处理，使透明材料三维轮廓与废料分离而最终成型；本发明通过激光束作用于整个透明材料厚度方向，利用超短脉冲宽度实现对透明材料的改质，通过特有的处理方法进行透明材料成型分离，以获得无裂纹无损伤的工件，避免了细小碎屑的产生，提高了透明材料产品稳定性及产品良率。(1) The present invention processes the entire transparent material according to a preset path through a laser beam with an ultra-short pulse width, and performs continuous laser processing energy adjustment for different processing depths. By changing the Z-axis height and its corresponding processing track , to form a three-dimensional contour of a transparent material with a certain shape; after the three-dimensional contour of the transparent material is formed, the "cold and heat method" or "acid foaming method" is used for forming treatment, so that the three-dimensional contour of the transparent material is separated from the waste material and finally formed; The laser beam acts on the entire thickness direction of the transparent material, and the ultra-short pulse width is used to realize the modification of the transparent material, and the transparent material is formed and separated by a unique processing method, so as to obtain a workpiece without cracks and no damage, and avoid the generation of fine debris , improve the product stability and product yield of transparent materials.
(2)本发明采用“冷热法”对激光加工后的透明材料整体进行成型分离，通过对加热和冷却的组合顺序、加热和冷却的具体参数的限定，避免透明材料整体因为热胀冷缩太剧烈产生三维轮廓外的裂纹，或者因为热胀冷缩太平缓导致材料无法分离，保证透明材料沿着三维轮廓分离且不产生崩边、微裂纹等损伤，提高了产品良率。(2) The present invention adopts the "cold-heat method" to form and separate the entire transparent material after laser processing. By limiting the combination sequence of heating and cooling, and the specific parameters of heating and cooling, the entire transparent material can be prevented from expanding and contracting due to thermal expansion. Too violent cracks outside the three-dimensional contour, or because the thermal expansion and cold contraction are too gentle, the material cannot be separated, so that the transparent material can be separated along the three-dimensional contour without damage such as edge chipping and micro-cracks, and the product yield is improved.
(3)本发明通过建立透明材料不同厚度与激光加工能量之间的对应关系，根据所述对应关系针对不同的加工深度进行激光加工能量的连续调整，使得在透明材料厚度范围内激光聚焦的整体能量集中度趋于一致；针对不同的加工深度，能够有针对性的进行连续式能量调整，保证整个透明材料厚度方向上的加工效果一致性。(3) The present invention establishes the corresponding relationship between different thicknesses of transparent materials and laser processing energy, and continuously adjusts the laser processing energy for different processing depths according to the corresponding relationship, so that the overall laser focus within the thickness range of the transparent material can be adjusted. The energy concentration tends to be consistent; for different processing depths, continuous energy adjustment can be carried out in a targeted manner to ensure the consistency of the processing effect in the thickness direction of the entire transparent material.
附图说明Description of drawings
图1为根据本发明实施例的透明材料厚度与激光加工能量之间的对应关系图；FIG. 1 is a corresponding relationship diagram between the thickness of a transparent material and the laser processing energy according to an embodiment of the present invention;
图2为根据本发明实施例的透明材料三维轮廓加工方法的***框架图；2 is a system frame diagram of a method for processing a three-dimensional contour of a transparent material according to an embodiment of the present invention;
图3为根据本发明实施例的硅片三维轮廓加工的加工轨迹示意图；3 is a schematic diagram of a processing trajectory of a three-dimensional contour processing of a silicon wafer according to an embodiment of the present invention;
图4为根据本发明实施例的硅片“冷热法”分离示意图；FIG. 4 is a schematic diagram of separation of silicon wafers by “cold and heat method” according to an embodiment of the present invention;
图5为根据本发明实施例的玻璃三维轮廓加工的加工轨迹示意图；5 is a schematic diagram of a processing trajectory of glass three-dimensional contour processing according to an embodiment of the present invention;
图6为根据本发明实施例的玻璃“泡酸法”分离示意图。Fig. 6 is a schematic diagram of the separation of glass by "foaming acid method" according to an embodiment of the present invention.
具体实施方式detailed description
以下将结合附图对本发明各实施例的技术方案进行清楚、完整的描述，显然，所描述发实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其它实施例，都属于本发明所保护的范围。以下示例性实施例中所描述的实施方式并不代表与本说明书一个或多个实施例相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本说明书一个或多个实施例的一些方面相一致的装置和方法的例子。The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with one or more embodiments of this specification. Rather, they are merely examples of apparatus and methods consistent with some aspects of one or more embodiments of this specification, as recited in the appended claims.
需要说明的是：在其他实施例中并不一定按照本说明书示出和描述的顺序来执行相应方法的步骤。在一些其他实施例中，其方法所包括的步骤可以比本说明书所描述的更多或更少。此外，本说明书中所描述的单个步骤，在其他实施例中可能被分解为多个步骤进行描述；而本说明书中所描述的多个步骤，在其他实施例中也可能被合并为单个步骤进行描述。It should be noted that: in other embodiments, the steps of the corresponding methods are not necessarily performed in the order shown and described in this specification. In some other embodiments, the method may include more or fewer steps than described in this specification. In addition, a single step described in this specification may be decomposed into multiple steps for description in other embodiments; and multiple steps described in this specification may also be combined into a single step in other embodiments. describe.
本发明提供一种用于透明材料三维轮廓加工的方法，包括：使激光束聚焦于透明材料的下表面，所述激光束具有超短脉冲宽度；调整Z轴高度，配合设计好的加工轨迹，使激光束从透明材料的下表面往上表面逐层加工，根据不同加工深度调整激光加工能量，在透明材料上形成三维轮廓；对形成的三维轮廓进行成型处理。本发明通过激光束作用于整个透明材料厚度方向，利用超短脉冲宽度实现对透明材料的改质，通过特有的处理方法进行透明材料成型分离，以获得无裂纹无损伤的工件，避免了细小碎屑的产生，提高了产品良率。The invention provides a method for three-dimensional contour processing of transparent materials, which includes: focusing a laser beam on the lower surface of the transparent material, the laser beam has an ultra-short pulse width; adjusting the height of the Z-axis to match the designed processing track, The laser beam is processed layer by layer from the lower surface of the transparent material to the upper surface, and the laser processing energy is adjusted according to different processing depths to form a three-dimensional contour on the transparent material; the formed three-dimensional contour is shaped. In the invention, the laser beam acts on the entire thickness direction of the transparent material, and the ultra-short pulse width is used to realize the modification of the transparent material, and the transparent material is formed and separated by a unique processing method, so as to obtain a workpiece without cracks and no damage, and avoid small broken pieces. The generation of chips improves the product yield.
本发明建立了透明材料不同厚度与激光加工能量之间的对应关系，基于所述对应关系，可以根据不同加工深度进行连续式激光加工能量调整，使得在透明材料厚度范围内激光聚焦的整体能量集中度趋于一致，保证整个透明材料厚度方向上的加工效果一致性。The present invention establishes the corresponding relationship between different thicknesses of transparent materials and laser processing energy. Based on the corresponding relationship, continuous laser processing energy adjustment can be performed according to different processing depths, so that the overall energy of laser focusing within the thickness range of the transparent material is concentrated. The degree of consistency tends to be consistent, ensuring the consistency of the processing effect in the thickness direction of the entire transparent material.
本发明所使用的透明材料的厚度范围为0.2mm-1.1mm。为了保证整个透明材料厚度方向上的加工效果一致性，需要使整个1.1mm厚度范围内的整体能量集中度趋于一致。本发明基于不同厚度及其对应的归一化能量集中度，建立0～1.1mm范围内不同材料厚度与激光加工能量的能量集中度之间的对应关系。请参阅图1，图1给出了不同镜头数值孔径下透明材料厚度与激光加工能量的归一化能量集中度之间的对应关系，其中，曲线的横坐标是玻璃厚度Tc，纵坐标是归一化的能量集中度J，曲线代表了在玻璃内部，不同加工深度位置进行加工所需要的能量集中度的理论归一化值，沿着光轴的方向，达到材料内部的时候 厚度越厚，加工深度越深，激光聚焦的能量集中度越低，加工的时候需要的能量就越高。同时在不同的镜头的数值孔径(NA)下，激光在相同厚度的材料内部的能量集中度也是不同的，NA越大，能量集中度越低；在相同的NA下，在不同的材料厚度中的能量集中度也不同，NA越小，能量集中度越高，实际加工的时候需要的能量越低。图1中，不同数值孔径下，激光加工能量在整个1.1mm厚度范围内的整体能量集中度趋于一致：The thickness of the transparent material used in the present invention ranges from 0.2 mm to 1.1 mm. In order to ensure the consistency of the processing effect in the thickness direction of the entire transparent material, it is necessary to make the overall energy concentration in the entire thickness range of 1.1 mm to be consistent. Based on different thicknesses and their corresponding normalized energy concentration degrees, the present invention establishes a corresponding relationship between different material thicknesses and the energy concentration degrees of laser processing energy in the range of 0-1.1 mm. Please refer to Figure 1. Figure 1 shows the correspondence between the thickness of the transparent material and the normalized energy concentration of the laser processing energy under different lens numerical apertures. The abscissa of the curve is the glass thickness Tc, and the ordinate is the normalized energy concentration. The normalized energy concentration J, the curve represents the theoretical normalized value of the energy concentration required for processing at different processing depths inside the glass, along the direction of the optical axis, the thicker the thickness when it reaches the inside of the material, The deeper the processing depth, the lower the energy concentration of the laser focusing, and the higher the energy required for processing. At the same time, under the numerical aperture (NA) of different lenses, the energy concentration of the laser inside the material of the same thickness is also different. The larger the NA, the lower the energy concentration; under the same NA, in different material thicknesses The energy concentration of NA is also different. The smaller the NA, the higher the energy concentration, and the lower the energy required for actual processing. In Figure 1, under different numerical apertures, the overall energy concentration of laser processing energy in the entire 1.1mm thickness range tends to be consistent:
NA＝0.3时，J (glass)0-J (glass)1.1＝0.052, When NA=0.3, J (glass)0 -J (glass)1.1 =0.052,
NA＝0.4时，J (glass)0-J (glass)1.1＝0.467, When NA=0.4, J (glass)0 -J (glass)1.1 =0.467,
NA＝0.5时，J (glass)0-J (glass)1.1＝0.835, When NA=0.5, J (glass)0 -J (glass)1.1 =0.835,
NA＝0.6时，J (glass)0-J (glass)1.1＝0.932。 When NA=0.6, J (glass)0- J (glass)1.1 =0.932.
实际加工时，能量集中度越高，越能保证在整个1.1mm厚度范围内的整体能量集中度趋于一致。本领域技术人员可参照图1的对应关系，选取物镜镜头的数值孔径，并基于该对应关系对不同加工深度的激光加工能量进行适应性的连续调整。In actual processing, the higher the energy concentration, the more consistent the overall energy concentration in the entire 1.1mm thickness range can be guaranteed. Those skilled in the art can refer to the corresponding relationship in FIG. 1 , select the numerical aperture of the objective lens, and continuously adjust the laser processing energy of different processing depths adaptively based on the corresponding relationship.
图1中，归一化的能量集中度J计算如下所示：In Figure 1, the normalized energy concentration J is calculated as follows:
Figure PCTCN2021080975-appb-000001
Figure PCTCN2021080975-appb-000001
Figure PCTCN2021080975-appb-000002
Figure PCTCN2021080975-appb-000002
Figure PCTCN2021080975-appb-000003
Figure PCTCN2021080975-appb-000003
Figure PCTCN2021080975-appb-000004
Figure PCTCN2021080975-appb-000004
S3＝-1.83f′tan 2w K； S3=-1.83f'tan 2 w K ;
S4＝-0.83f′tan 2w K； S4=-0.83f'tan 2 w K ;
Figure PCTCN2021080975-appb-000005
Figure PCTCN2021080975-appb-000005
其中
Figure PCTCN2021080975-appb-000006
p＝1，r以及
Figure PCTCN2021080975-appb-000007
是光学***参考球面点的极坐标,f’为光学***焦距，w K为视场角最大值，n为材料折射率，Tc为材料的中心厚度，H为刚入射到材料的半直径，S1为三阶球差系数，S2为三阶彗差系数，S3为子午场曲，S4为弧矢场曲，K为波矢量，W为波像差，NA为光学***数值孔径，F为光学***的f数，A 00为常数。 in
Figure PCTCN2021080975-appb-000006
p=1, r and
Figure PCTCN2021080975-appb-000007
is the polar coordinate of the reference spherical point of the optical system, f' is the focal length of the optical system, w K is the maximum angle of view, n is the refractive index of the material, Tc is the center thickness of the material, H is the half diameter of the material just incident, S1 is the third-order spherical aberration coefficient, S2 is the third-order coma coefficient, S3 is the meridional field curvature, S4 is the sagittal field curvature, K is the wave vector, W is the wave aberration, NA is the numerical aperture of the optical system, and F is the optical system The f number of , A 00 is a constant.
实施例1Example 1
请同时参照图2和图3、图4，本实施例提供一种硅片三维轮廓加工的方法，包括以下步骤：采用脉冲宽度范围在皮秒至飞秒，激光波长1550nm的激光器1；激光器1产生的聚焦激光束5从硅片6的下表面到上表面进行逐层激光改质，改质焦点位置由高精度Z轴升降台4带动显微物镜3实现，不同焦点位置对应的运动轨迹由控制***8计算生成，并通过控制XY直线电机7实现；通过设置激光切割速度、PSO激光点间距、激光单脉冲大小来控制硅片三维轮廓9上S1到Sn每层加工深度，同时配合每层对应的轨迹从而形成一定形状的三维轮廓。最后把形成三维轮廓硅片利用“冷热法”，产生冷热分离区12，机械外力作用下使得成品10与废料11彻底分离。Please refer to FIG. 2, FIG. 3, and FIG. 4 at the same time, this embodiment provides a method for processing a three-dimensional contour of a silicon wafer, including the following steps: using a laser 1 with a pulse width ranging from picoseconds to femtoseconds and a laser wavelength of 1550 nm; laser 1 The generated focused laser beam 5 is laser modified layer by layer from the lower surface to the upper surface of the silicon wafer 6, and the modified focus position is realized by the high-precision Z-axis lifting stage 4 driving the microscope objective lens 3, and the motion trajectory corresponding to the different focus positions is given by The control system 8 is calculated and generated, and is realized by controlling the XY linear motor 7; by setting the laser cutting speed, the PSO laser spot spacing, and the laser single pulse size, the processing depth of each layer from S1 to Sn on the three-dimensional contour of the silicon wafer 9 is controlled, and each layer is matched with each other. The corresponding trajectory thus forms a three-dimensional contour of a certain shape. Finally, the "cold-hot method" is used to form the three-dimensional contour silicon wafer to generate a cold-hot separation zone 12, and the finished product 10 and the waste material 11 are completely separated under the action of mechanical external force.
具体到本实施例，如图3、4所示，硅片6，厚度0.5mm:Specifically to this embodiment, as shown in Figures 3 and 4, the silicon wafer 6 has a thickness of 0.5mm:
a.先利用高精度Z轴4把激光束5聚焦到硅片6下表面；a. First, use the high-precision Z-axis 4 to focus the laser beam 5 on the lower surface of the silicon wafer 6;
b.利用控制***8计算出S1-Sn层每层的加工高度和对应的加工轨迹；b. Use the control system 8 to calculate the processing height of each layer of the S1-Sn layer and the corresponding processing trajectory;
c.切割速度100mm/s、PSO点间距1um、单脉冲能量5uj-10uj(单脉冲能量可根据实际工艺效果调整)、控制***8通过控制高精度Z轴升降台4和直线电机7完成S1-Sn层的激光改质，最后形成图4所示硅片三维轮廓9；c. Cutting speed 100mm/s, PSO point spacing 1um, single pulse energy 5uj-10uj (single pulse energy can be adjusted according to the actual process effect), control system 8 completes S1- The laser modification of the Sn layer finally forms the three-dimensional profile 9 of the silicon wafer shown in FIG. 4 ;
d.利用“冷热法”对硅片三维轮廓9进行处理，产生冷热分离区12，机械外力作用下使得成品10与废料11彻底分离。d. The three-dimensional contour 9 of the silicon wafer is processed by the "cold and heat method" to generate a cold and hot separation zone 12, and the finished product 10 and the waste material 11 are completely separated under the action of external mechanical force.
实施例2Example 2
请同时参照图1和图5、图6，本实施例提供一种玻璃三维轮廓加工的方法，包括以下步骤：采用脉冲宽度范围在皮秒至飞秒，激光波长1030-1080nm的激光器1；激光器1产生的聚焦激光束5从玻璃6的下表面到上表面进行逐层激光改质，改质焦点位置由高精度Z轴升降台4带动显微物镜3实现，不同焦点位置对应的运动轨迹由控制***8计算生成，并通过控制XY直线电机7实现；通过设置激光切割速度、PSO激光点间距、激光单脉冲大小来控制激光改质轨迹13上G1到Gn每层加工深度，同时配合每层对应的轨迹从而形成一定形状的三维轮廓。最后把形成三维轮廓玻璃利用“泡酸法”，产生腐蚀沟槽16， 经清洗机超声清洗后，使得成品14与废料16彻底分离。Please refer to FIG. 1 and FIG. 5 and FIG. 6 at the same time, the present embodiment provides a method for processing a three-dimensional profile of glass, including the following steps: using a laser 1 with a pulse width ranging from picoseconds to femtoseconds and a laser wavelength of 1030-1080 nm; 1. The focused laser beam 5 generated by the glass 6 undergoes layer-by-layer laser modification from the lower surface to the upper surface of the glass 6. The modified focus position is realized by the high-precision Z-axis lifting stage 4 driving the microscope objective lens 3, and the motion trajectories corresponding to different focus positions are given by The control system 8 is calculated and generated, and is realized by controlling the XY linear motor 7; by setting the laser cutting speed, the PSO laser spot spacing, and the laser single pulse size, the processing depth of each layer from G1 to Gn on the laser modification track 13 is controlled, and each layer is matched with each other. The corresponding trajectory thus forms a three-dimensional contour of a certain shape. Finally, the three-dimensional contour glass is formed by the "acid soaking method" to generate corrosion grooves 16, and after ultrasonic cleaning by a cleaning machine, the finished product 14 and the waste material 16 are completely separated.
具体到本实施例，如图5、6所示，玻璃6，厚度0.8mm:Specifically to this embodiment, as shown in Figures 5 and 6, glass 6, thickness 0.8mm:
e.先利用高精度Z轴4把激光束5聚焦到玻璃6下表面；e. First use the high-precision Z-axis 4 to focus the laser beam 5 on the lower surface of the glass 6;
f.利用控制***8计算出G1-Gn层每层的加工高度和对应的加工轨迹；f. Use the control system 8 to calculate the processing height and corresponding processing track of each layer of the G1-Gn layer;
g.切割速度200mm/s、PSO点间距2-3um、单脉冲能量5uj-10uj(单脉冲能量可根据实际工艺效果调整)、控制***8通过控制高精度Z轴4和直线电机7完成G1-Gn层的激光改质，最后形成图3-2所示玻璃三维轮廓13；g. Cutting speed 200mm/s, PSO point spacing 2-3um, single pulse energy 5uj-10uj (single pulse energy can be adjusted according to the actual process effect), control system 8 completes G1- by controlling high-precision Z axis 4 and linear motor 7 The laser modification of the Gn layer finally forms the three-dimensional profile 13 of the glass shown in Figure 3-2;
利用“泡酸法”对玻璃三维轮廓13进行处理，产生腐蚀沟槽16，经清洗机超声清洗后，成品14与废料16彻底分离。The three-dimensional contour 13 of the glass is processed by the "acid soaking method" to generate corrosion grooves 16 . After ultrasonic cleaning by a cleaning machine, the finished product 14 and the waste material 16 are completely separated.
还需要说明的是，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。It should also be noted that the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a series of elements includes not only those elements, but also Other elements not expressly listed, or which are inherent to such a process, method, article of manufacture, or apparatus are also included. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article of manufacture, or device that includes the element.
本发明通过超短脉冲宽度的激光束对整个透明材料按照预先设定的路径进行加工，对不同的加工深度进行连续式激光加工能量调整，通过改变Z轴高度和其对应的加工轨迹，形成具有一定形状的透明材料三维轮廓；透明材料三维轮廓形成后，再利用“冷热法”或“泡酸法”进行成型处理，使透明材料三维轮廓与废料分离而最终成型，获得无裂纹无损伤的工件，避免了细小碎屑的产生，提高了透明材料产品稳定性及产品良率。The invention processes the entire transparent material according to a preset path through a laser beam with an ultra-short pulse width, performs continuous laser processing energy adjustment for different processing depths, and changes the Z-axis height and its corresponding processing track to form a The three-dimensional contour of the transparent material with a certain shape; after the three-dimensional contour of the transparent material is formed, the "cold and heat method" or "acid foaming method" is used for forming treatment, so that the three-dimensional contour of the transparent material is separated from the waste material and finally formed, and a crack-free and damage-free material is obtained. The workpiece can avoid the generation of fine debris, and improve the product stability and product yield of transparent materials.
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc. A particular feature, structure, material, or characteristic described in this embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明实施例技术方案。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some or all of the technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention.

Claims (10)

  1. 一种用于透明材料三维轮廓加工的方法，其特征在于，包括：A method for three-dimensional contour processing of transparent materials, comprising:
    使激光束聚焦于透明材料的下表面，所述激光束具有超短脉冲宽度；focusing a laser beam on the lower surface of the transparent material, the laser beam having an ultrashort pulse width;
    调整Z轴高度，配合设计好的加工轨迹，使激光束从透明材料的下表面往上表面逐层加工，根据不同加工深度调整激光加工能量，在透明材料上形成三维轮廓；Adjust the height of the Z-axis and cooperate with the designed processing track, so that the laser beam is processed layer by layer from the lower surface of the transparent material to the upper surface, and the laser processing energy is adjusted according to different processing depths to form a three-dimensional contour on the transparent material;
    对形成的三维轮廓进行成型处理。The formed three-dimensional contour is shaped.
  2. 根据权利要求1所述的一种用于透明材料三维轮廓加工的方法，其特征在于，通过设置激光切割速度、激光点间距、激光单脉冲大小来控制三维轮廓每层加工深度，根据加工深度调整激光加工能量，同时配合每层对应的加工轨迹，形成一定形状的三维轮廓；三维轮廓的加工过程采用单点激光与Z轴配合加工，或者采用分段加工。The method for three-dimensional contour processing of transparent materials according to claim 1, wherein the processing depth of each layer of the three-dimensional contour is controlled by setting the laser cutting speed, the distance between the laser points, and the size of the single laser pulse, and the processing depth is adjusted according to the processing depth. The laser processing energy and the corresponding processing track of each layer form a three-dimensional contour of a certain shape; the processing process of the three-dimensional contour adopts the single-point laser and the Z axis to cooperate with the processing, or adopts the segmental processing.
  3. 根据权利要求1所述的一种用于透明材料三维轮廓加工的方法，其特征在于，采用“冷热法”对形成的三维轮廓进行成型处理，包括：The method for processing a three-dimensional contour of a transparent material according to claim 1, wherein the three-dimensional contour formed is shaped by a "cold and hot method", comprising:
    将激光加工后的透明材料整体放入加热炉中，加热到预定温度，保温第一预定时间后停止加热；Put the laser-processed transparent material into a heating furnace as a whole, heat it to a predetermined temperature, and stop heating after the heat preservation for a first predetermined time;
    将加热后的透明材料整体放置于空气中持续第二预定时间；placing the heated transparent material in the air as a whole for a second predetermined time;
    将放置第二预定时间后的透明材料整体放置于水中冷却第三预定时间；placing the entire transparent material after being placed for a second predetermined time in water to cool for a third predetermined time;
    将冷却第三预定时间后的透明材料的三维轮廓与废料分离。The three-dimensional profile of the transparent material after cooling for a third predetermined time is separated from the waste.
  4. 根据权利要求3所述的一种用于透明材料三维轮廓加工的方法，其特征在于，所述第一预定时间为1min-2min；所述第二预定时间为3S-5S；所述第三预定时间为5S-10S；所述预定温度为160℃-200℃。The method for three-dimensional contour processing of transparent materials according to claim 3, wherein the first predetermined time is 1min-2min; the second predetermined time is 3S-5S; the third predetermined time is The time is 5S-10S; the predetermined temperature is 160°C-200°C.
  5. 根据权利要求1所述的一种用于透明材料三维轮廓加工的方法，其特征在于，采用“泡酸法”对形成的三维轮廓进行成型处理，包括：A method for processing a three-dimensional contour of a transparent material according to claim 1, characterized in that the forming of the three-dimensional contour formed by the "acid foaming method" comprises:
    将激光加工后的透明材料整体放入酸中进行腐蚀，根据透明材料腐蚀深度设置泡酸时间；Put the laser-processed transparent material into acid for corrosion, and set the acid soaking time according to the corrosion depth of the transparent material;
    在透明材料的三维轮廓与废料之间形成明显沟槽后，取出透明材料；After a clear groove is formed between the three-dimensional contour of the transparent material and the waste material, the transparent material is taken out;
    将透明材料放入清洗机中进行超声清洗；Put the transparent material into the cleaning machine for ultrasonic cleaning;
    超声清洗完成后，透明材料三维轮廓与废料分离。After the ultrasonic cleaning is completed, the three-dimensional profile of the transparent material is separated from the waste.
  6. 根据权利要求1所述的一种用于透明材料三维轮廓加工的方法，其特征在于，所述激光束的波长范围为400nm-2500nm；所述激光束的脉冲宽度范围为100fs-10ps；所述激光束的单点能量范围为5uj-10uj。The method for three-dimensional contour processing of transparent materials according to claim 1, wherein the wavelength range of the laser beam is 400nm-2500nm; the pulse width of the laser beam is 100fs-10ps; the The single-point energy range of the laser beam is 5uj-10uj.
  7. 根据权利要求1所述的一种用于透明材料三维轮廓加工的方法，其特征在于，所述 透明材料的厚度范围为0.2mm-1.1mm。The method for three-dimensional contour processing of transparent materials according to claim 1, wherein the thickness of the transparent materials ranges from 0.2mm to 1.1mm.
  8. 根据权利要求7所述的一种用于透明材料三维轮廓加工的方法，其特征在于，建立透明材料不同厚度与激光加工能量之间的对应关系，根据所述对应关系针对不同的加工深度进行激光加工能量的连续调整，使得在透明材料厚度范围内激光聚焦的整体能量集中度趋于一致。A method for three-dimensional contour processing of transparent materials according to claim 7, characterized in that a corresponding relationship between different thicknesses of transparent materials and laser processing energy is established, and laser processing is performed for different processing depths according to the corresponding relationship. The continuous adjustment of the processing energy makes the overall energy concentration of the laser focusing in the transparent material thickness range to be consistent.
  9. 根据权利要求1所述的一种用于透明材料三维轮廓加工的方法，其特征在于，所述激光束的聚焦光斑的直径范围为1um-5um，根据聚焦光斑大小，XY轴的偏移距离ΔX、ΔY是对应聚焦光斑的1.5倍-2.5倍，Z轴移动距离ΔZ是对应聚焦光斑的2倍-8倍。The method for three-dimensional contour processing of transparent materials according to claim 1, wherein the diameter of the focused spot of the laser beam ranges from 1um to 5um, and according to the size of the focused spot, the offset distance ΔX of the XY axis , ΔY is 1.5-2.5 times the corresponding focusing spot, and the Z-axis moving distance ΔZ is 2-8 times the corresponding focusing spot.
  10. 一种用于透明材料三维轮廓加工的***，采用权利要求1-9中任一项所述的方法实现，其特征在于，所述***包括激光器、扩束准直镜、显微物镜、Z轴升降台、XY直线电机和控制***，其中，所述激光器的输出端连接扩束准直镜的输入端，所述扩束准直镜的输出端连接显微物镜的输入端，所述显微物镜的输出入射到透明材料工件上，所述透明材料工件置于XY直线电机上方且与XY直线电机同步运动；所述显微物镜与Z轴升降台连接；所述控制***分别与激光器、XY直线电机和Z轴升降台连接。A system for three-dimensional contour processing of transparent materials, realized by the method of any one of claims 1-9, wherein the system comprises a laser, a beam expander collimator, a microscope objective lens, a Z-axis Lifting stage, XY linear motor and control system, wherein the output end of the laser is connected to the input end of the beam expander collimator, the output end of the beam expander collimator is connected to the input end of the microscope objective lens, the microscope The output of the objective lens is incident on the transparent material workpiece, and the transparent material workpiece is placed above the XY linear motor and moves synchronously with the XY linear motor; the microscope objective lens is connected with the Z-axis lifting stage; the control system is respectively connected with the laser, XY The linear motor is connected to the Z-axis lift table.
PCT/CN2021/080975 2020-07-14 2021-03-16 Method for machining three-dimensional contour of transparent material WO2022012069A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010671876.4A CN111558785B (en) 2020-07-14 2020-07-14 Method for processing three-dimensional contour of transparent material
CN202010671876.4 2020-07-14

Publications (1)

Publication Number Publication Date
WO2022012069A1 true WO2022012069A1 (en) 2022-01-20

Family

ID=72070168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/080975 WO2022012069A1 (en) 2020-07-14 2021-03-16 Method for machining three-dimensional contour of transparent material

Country Status (2)

Country Link
CN (1) CN111558785B (en)
WO (1) WO2022012069A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111558785B (en) * 2020-07-14 2020-10-23 武汉华工激光工程有限责任公司 Method for processing three-dimensional contour of transparent material
CN112264842B (en) * 2020-10-28 2022-03-11 福州大学 Constant linear velocity grinding method based on polar coordinate glass edge grinding machine
CN112846530A (en) * 2020-12-29 2021-05-28 武汉华工激光工程有限责任公司 Curved thick glass cutting and splitting method and system
CN112975158A (en) * 2021-03-04 2021-06-18 武汉华工激光工程有限责任公司 Transverse cutting method and system for transparent brittle material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101386112A (en) * 2007-09-13 2009-03-18 张立国 Laser cutting method based on inner carving
CN104722932A (en) * 2015-03-28 2015-06-24 大族激光科技产业集团股份有限公司 Laser drilling method for amorphous silicon solar cell glass substrate
CN108436310A (en) * 2018-04-23 2018-08-24 浙江圣石激光科技股份有限公司 A method of with laser rapid processing automobile rearview mirror
CN207873417U (en) * 2018-01-30 2018-09-18 苏州德龙激光股份有限公司 Multifocal DYNAMIC DISTRIBUTION laser machines the device of brittle transparent material
WO2019245855A1 (en) * 2018-06-19 2019-12-26 Corning Incorporated Actively controlled laser processing of transparent workpieces
CN111558785A (en) * 2020-07-14 2020-08-21 武汉华工激光工程有限责任公司 Method for processing three-dimensional contour of transparent material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19952331C1 (en) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Method and device for quickly cutting a workpiece from brittle material using laser beams
JP2005324997A (en) * 2004-05-17 2005-11-24 Nippon Sheet Glass Co Ltd Reinforced glass board with marking and its manufacturing method
WO2014085663A1 (en) * 2012-11-29 2014-06-05 Corning Incorporated Methods of fabricating glass articles by laser damage and etching
US20150165560A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
CN106186656B (en) * 2016-07-05 2018-09-04 温州大学 A kind of laser cutting method of tempered glass

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101386112A (en) * 2007-09-13 2009-03-18 张立国 Laser cutting method based on inner carving
CN104722932A (en) * 2015-03-28 2015-06-24 大族激光科技产业集团股份有限公司 Laser drilling method for amorphous silicon solar cell glass substrate
CN207873417U (en) * 2018-01-30 2018-09-18 苏州德龙激光股份有限公司 Multifocal DYNAMIC DISTRIBUTION laser machines the device of brittle transparent material
CN108436310A (en) * 2018-04-23 2018-08-24 浙江圣石激光科技股份有限公司 A method of with laser rapid processing automobile rearview mirror
WO2019245855A1 (en) * 2018-06-19 2019-12-26 Corning Incorporated Actively controlled laser processing of transparent workpieces
CN111558785A (en) * 2020-07-14 2020-08-21 武汉华工激光工程有限责任公司 Method for processing three-dimensional contour of transparent material

Also Published As

Publication number Publication date
CN111558785A (en) 2020-08-21
CN111558785B (en) 2020-10-23

Similar Documents

Publication Publication Date Title
WO2022012069A1 (en) Method for machining three-dimensional contour of transparent material
JP7313390B2 (en) Laser cutting and processing of display glass compositions
US20180161918A1 (en) Shaping of brittle materials with controlled surface and bulk properties
TWI655986B (en) Laser processing method
US20170057017A1 (en) Cutting of brittle materials with tailored edge shape and roughness
TWI649148B (en) Method for laser cutting a display glass component and glass article prepared by the method
US6252197B1 (en) Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US20120234807A1 (en) Laser scribing with extended depth affectation into a workplace
TWI490176B (en) Process and apparatus for splitting glass sheet
US20110132885A1 (en) Laser machining and scribing systems and methods
KR20140137437A (en) Laser scribing with extended depth affectation into a workpiece
JP2019535523A (en) Method of laser processing a laminated work stack for forming a contour line of a first transparent workpiece and separating a resin layer from the first transparent workpiece
WO2014121261A1 (en) Method and apparatus for laser cutting transparent and semitransparent substrates
CN207521870U (en) Laser output system based on homogenizer
CN106966580A (en) A kind of method of femtosecond laser glass-cutting
WO2018011618A1 (en) Method and system for cleaving a substrate with a focused converging ring-shaped laser beam
JP2021516159A (en) Processing methods, equipment and systems for hard and brittle material products
US20190366484A1 (en) A method of high-precision laser processing sapphire with submicron cutting surface
TW201446378A (en) Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
JP2014177369A (en) Manufacturing method of tempered glass member
TW202039395A (en) Method for producing micro-structure equipped glass base plate, and glass base plate
CN110818241A (en) Glass cutting method
Chung et al. Effects of UV laser milling parameters on the profile cutting of Gorilla glass substrates
TW201440939A (en) Method for cutting glass panel using laser beam
CN117359130A (en) Ultrasonic vibration assisted ultrafast laser invisible wafer cutting device and method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21843354

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21843354

Country of ref document: EP

Kind code of ref document: A1