WO2022000940A1 - Heat dissipation structure and power module - Google Patents

Heat dissipation structure and power module Download PDF

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Publication number
WO2022000940A1
WO2022000940A1 PCT/CN2020/129299 CN2020129299W WO2022000940A1 WO 2022000940 A1 WO2022000940 A1 WO 2022000940A1 CN 2020129299 W CN2020129299 W CN 2020129299W WO 2022000940 A1 WO2022000940 A1 WO 2022000940A1
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WIPO (PCT)
Prior art keywords
heat dissipation
heat
power unit
power
dissipation base
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PCT/CN2020/129299
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French (fr)
Chinese (zh)
Inventor
卢艺杰
傅伟堃
倪泽联
赵晓航
Original Assignee
科华恒盛股份有限公司
漳州科华技术有限责任公司
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Publication of WO2022000940A1 publication Critical patent/WO2022000940A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738Semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a power module.
  • Heat dissipation technology has become the main factor restricting the power growth of modules, improving the temperature uniformity of each power device and the efficiency of heat dissipation equipment, which can reduce the limitation of heat dissipation factors on the increase of power density and prolong the service life of equipment at low cost.
  • each radiator corresponds to a power unit
  • the heat dissipation paths of each radiator are independent.
  • the power unit does not work or the loss is low, and when the loss of other power units is high, the heat of some radiators will be concentrated, and the heat of some radiators will be very low, resulting in unbalanced heat of the radiator, and the overall heat dissipation efficiency of the radiator will be higher.
  • the volume of the radiator is often large and the cost is high.
  • UPS equipment can be divided into bypass module and power module, power module includes inverter circuit, rectifier circuit and boost circuit.
  • the battery-related power devices (IGBTs, diodes, inductors, etc.) in the boost circuit do not work, and the mains-state power devices in the rectifier circuit and the power devices in the inverter circuit continue to work; power When the module is in the battery state, the power devices related to the battery state in the boost circuit and the power devices in the inverter circuit continue to work, and the power devices related to the mains state in the rectifier circuit do not work; and in the mains state, the balance bridge circuit does not work.
  • the purpose of the present invention is to overcome the above-mentioned defects or problems in the background art, and to provide a heat dissipation structure and a power module with high heat dissipation efficiency, balanced temperature, small size and low cost.
  • the present invention adopts the following technical solutions:
  • a heat dissipation structure hereinafter marked as technical solution 1, in technical solution 1, comprising a first heat sink for dissipating heat for a first power unit, on which is provided a first heat dissipation base with first heat dissipation fins a seat; a second radiator, which is arranged opposite the first radiator and used to dissipate heat for the second power unit, on which a second heat dissipation base with second heat dissipation fins is arranged; and a heat conduction unit, two of which are mutually The facing away and parallel surfaces are respectively abutted against the opposite end faces of the first heat dissipation base and the second heat dissipation base, and are used for conducting heat between the first heat sink and the second heat sink.
  • the first heat dissipation fin includes a first contact fin
  • the second heat dissipation fin includes a second contact fin
  • the heat conduction unit is connected to the first contact fin. Both a contact fin and a second contact fin are in contact
  • the heat-conducting unit includes at least two heat-conducting parts, each heat-conducting part is spaced apart along the air intake direction, and the side edges of the heat-conducting parts and adjacent components or devices are located between them.
  • a ventilation gap exists to form a turbulent flow channel between the end face of the first heat dissipation base and the end face of the second heat dissipation base.
  • an air guide portion is provided on one end of each heat-conducting member close to the air inlet direction, and the width of the air guide portion gradually increases along the air inlet direction so as to reduce the oncoming air. Air flow is directed to its sides.
  • technical solution 2 Based on technical solution 2, it also includes technical solution 4.
  • technical solution 4 an air collecting portion is provided on one end of each heat conducting member away from the air inlet direction, and the width of the air collecting portion gradually increases along the air inlet direction.
  • the calorific value of the first power unit and the second power unit are different, and the difference between the first radiator and the second radiator is that the first heat dissipation base
  • the heights of the seat and the second heat dissipation base are different, and the number of the first heat dissipation fins and the number of the second heat dissipation fins are different.
  • the first power unit includes a first power component and a second power component, and the first power component and the second power component are respectively connected to the first heat sink Two sides of the base; among the first power assembly and the second power assembly, when one is in a working state, the other is in a resting state.
  • the technical solution 7 it also includes the technical solution 7.
  • the technical solution 7 also includes a flexible thermal conductive sheet, and the flexible thermal conductive sheet covers the entire contact surface where the first power component and the second power component are connected to the first heat dissipation base. .
  • the present invention also provides a power module, which is marked as technical solution 8 below.
  • a power module which is marked as technical solution 8 below.
  • the technical solution 8 includes a first circuit board, which is provided with a first power unit; and a second circuit board, which is parallel to the first circuit board and provided with a second power unit disposed opposite to the first power unit; and the heat dissipation structure according to any one of technical solutions one to seven, wherein the first power unit and the second power unit are respectively fixed to the first heat dissipation base and the second power unit on the cooling base.
  • the ninth technical solution is further included.
  • an air supply unit is further included; a third power unit is further provided on the first circuit board, and the calorific value of the third power unit is smaller than that of the first power.
  • the calorific value of the unit; the second circuit board is also provided with a fourth power unit opposite to the third power unit, the calorific value of the fourth power unit is smaller than the calorific value of the second power unit;
  • the air volume delivered by the first radiator and the second radiator is greater than the air volume delivered to the third power unit and the fourth power unit.
  • technical solution 10 is also included.
  • a spacer is further included, and the spacer connects the first circuit board and the second circuit board vertically, so as to separate the space between the first circuit board and the second circuit board.
  • the area is divided into at least two independent heat dissipation areas, and each heat dissipation area is equipped with two first radiators, two second radiators, a third power unit and a fourth power unit;
  • the radiators are respectively located on both sides of the third power unit, and the two second radiators are located on both sides of the fourth power unit respectively.
  • the present invention has the following beneficial effects:
  • a heat conduction unit is arranged between the first heat dissipation base and the second heat dissipation base, and the heat conduction unit makes the heat of the first heat sink and the second heat sink conduct heat, which improves the first heat dissipation base and the second heat dissipation base.
  • the heat exchange efficiency between the two heat dissipation bases reduces the overall thermal resistance of the first radiator and the second radiator, and avoids that the loss of the first power unit is very low, but when the loss of the second power unit is high, the heat Balanced, the temperature uniformity of the first power unit on the first heat dissipation base and the second power unit on the second heat dissipation base is improved, and the local high temperature points of the first power unit and the second power unit are reduced, so that the Cope with different extreme working conditions, and improve the heat dissipation efficiency under the same cost; Abutting against the end faces of the first heat dissipation base and the second heat dissipation base, that is, the first heat dissipation base, the heat conduction unit and the second heat dissipation base are stacked in sequence, and the heights of the first heat dissipation base and the second heat dissipation base can be adjusted.
  • the heat conduction unit and the second heat dissipation base can still be placed in the electrical equipment, so that the heights of the first heat sink and the second heat sink are more flexible, and the way of stacking
  • the volume of the heat dissipation structure is reduced; when the first heat sink and the second heat sink are placed on top of each other, the heat conduction unit can also support the heat sink located above, reducing the deformation of the heat sink located below, thereby avoiding damage to the heat sink located below .
  • the first heat dissipation fin closest to the first power unit will absorb heat first, and the first heat dissipation fin farthest from the first power unit will absorb heat last, and the most The second heat dissipation fins close to the second power unit absorb heat first, and the second heat dissipation fins farthest from the second power unit absorb heat last, resulting in the first heat dissipation fins far away from the first power unit and the second heat dissipation fins farthest away from the second power unit
  • the heat dissipation efficiency of the second heat dissipation fin of the power unit is low, wherein the first heat dissipation fin in contact with the heat conduction unit is generally located at one end away from the first power unit, and the second heat dissipation fin in contact with the heat conduction unit is generally located away from the second power unit.
  • One end usually absorb the heat of the first power unit and the second power unit last. are in contact with each other, and the heat of the first contact fin and the second contact fin is conducted, thereby improving the heat dissipation efficiency of the first contact fin and the second contact fin; and the first contact fin and the second contact fin are both In contact with the heat conduction unit, it is convenient to form a turbulent flow channel between the end face of the first heat dissipation base and the end face of the second heat dissipation base, and avoids excessive waste of air volume in the turbulent flow passage; , and there is a ventilation gap between the side of the heat-conducting member and the adjacent components or devices, so that the oncoming air flow can flow along the side of the heat-conducting member and gather in the gap between the adjacent heat-conducting members.
  • the airflow forms a turbulent flow in the gap between the adjacent heat-conducting parts, thereby forming a turbulent flow between the heat-conducting parts.
  • the turbulent flow one by one extends the path of the wind flow, improves the heat transfer coefficient in the gap, avoids the influence of the boundary layer, and thus improves the overall heat dissipation efficiency.
  • an air guide is provided, which is beneficial to reduce the flow resistance of the airflow.
  • the arrangement of the air gathering part is conducive to the gathering of the air flow, forming a strong turbulence, which further improves the heat dissipation efficiency, and is also conducive to saving materials, thereby saving costs.
  • the arrangement of the first radiator and the second radiator makes it possible to correspondingly increase the height and increase the height of the first heat dissipation base when the calorific value of the first power unit is greater than that of the second power unit.
  • the number of the first heat dissipation fins is such that the heat dissipation efficiency of the first heat sink is greater than that of the second heat sink, so that the overall heat dissipation efficiency of the first heat sink and the second heat sink is more balanced.
  • the first power device and the second power device that switch work are generally arranged on two radiators respectively.
  • the technical solution of the present invention fixes the first power assembly and the second power assembly on both sides of the first heat dissipation base, so that the first power assembly is
  • the first radiator is always in the working state, and the heat of the power component on one side can be transferred to the other side, which further improves the heat dissipation efficiency and reduces the number of radiators used. Cost savings.
  • the setting of the flexible thermal conductive sheet is used as the interface material between the first power component and the second power component and the first radiator base, which further improves the thermal conductivity, and the flexible thermal conductive sheet has no lock crack as a flexible product. Therefore, the heat conduction efficiency is improved under the condition of the same cost, thereby improving the overall temperature uniformity of the radiator.
  • the power module adopts the heat dissipation structure in technical solutions 1 to 7, which is small in size, reduces the overall thermal resistance of the first heat sink and the second heat sink, and improves the first power on the first heat dissipation base.
  • the temperature uniformity of the unit and the second power unit on the second heat dissipation base reduces the local high temperature points of the first power unit and the second power unit; the heights of the first heat sink and the second heat sink can be adjusted, and the Flexible and improved thermal efficiency at the same cost.
  • the air supply unit is arranged so that the power unit with high calorific value on the circuit board is located in the area with large air volume, and the power unit with low calorific value is located in the area with small air volume, so as to realize the uniform temperature of each power unit. It can be replaced regularly, thereby improving the heat dissipation efficiency of the power module.
  • a partition plate is arranged to form an independent heat dissipation area, which further improves the heat dissipation efficiency.
  • FIG. 1 is a schematic diagram of a heat dissipation structure
  • Figure 2 is a front view of a heat dissipation structure
  • FIG. 3 is an exploded schematic diagram of a heat dissipation structure
  • Figure 4 is a schematic diagram of a thermally conductive member
  • FIG. 5 is a schematic diagram of a power module
  • FIG. 6 is a schematic diagram of a power module
  • Figure 7 is a side view of the power module
  • FIG. 8 is a top view of the second circuit board, the second heat sink, the heat conducting member and the fourth power unit;
  • FIG. 9 is a schematic diagram of the air supply unit supplying air to the heat dissipation area.
  • the second heat sink 21, the second heat dissipation base, 22, the second heat dissipation fin, 221, the second contact fin;
  • the first power unit 41, the first power component, 42, the second power component;
  • connection or "fixed connection” should be used in a broad sense, that is, there is no displacement relationship and relative rotation relationship between the two.
  • Any connection means that is to say, including non-removable fixed connection, detachable fixed connection, integrated and fixed connection through other devices or elements.
  • the present invention discloses a heat dissipation structure, including a first heat sink 1 , a second heat sink 2 and a heat conduction unit.
  • the first heat sink 1 is used to dissipate heat for the first power unit 4
  • the second heat sink 1 is used for heat dissipation.
  • 2 is used to dissipate heat for the second power unit 5.
  • the first heat sink 1 and the second heat sink 2 are respectively provided with a first heat dissipation base 11 with first heat dissipation fins 12 and a second heat dissipation base with second heat dissipation fins 22.
  • the heat dissipation base 21, the first power unit 4 and the second power unit 5 can be connected to the first heat dissipation base 11 and the second heat dissipation base 21, and the first power unit 4 and the second power unit 5 are implemented in two different ways A combination of power devices with different functions.
  • the two opposite and parallel surfaces of the heat-conducting unit are respectively abutted against the opposite end faces of the first heat-dissipating base 11 and the second heat-dissipating base 21, and are used to conduct heat between the first heat sink 1 and the second heat sink 2, That is, the first heat sink 1 , the heat conduction unit and the second heat sink 2 are stacked in sequence.
  • the first heat dissipation base 11 is arranged with a plurality of first heat dissipation fins 12 along the stacking direction of the first heat dissipation base 11 and the heat conduction unit.
  • the second heat dissipation base 21 is arranged with a plurality of second heat dissipation fins 22 along the stacking direction of the second heat dissipation base 21 and the heat conduction unit.
  • the second heat dissipation fins 22 are stacked with the second heat dissipation base 21 and the heat conduction unit. direction is parallel.
  • first heat dissipation fins 12 and the second heat dissipation fins 22 makes it easier to dissipate the heat of the first power unit 4 absorbed by the first heat dissipation base 11 and the heat of the second power unit 5 absorbed by the second heat dissipation base 21 , a first heat dissipation air duct is formed between two adjacent first heat dissipation fins 12 , and a second heat dissipation air passage is formed between two adjacent second heat dissipation fins 22 .
  • first heat dissipation base 11 and the second heat dissipation base 21 both extend in the vertical direction
  • first heat dissipation fins 12 extend in the horizontal direction along both sides of the lower part of the first heat dissipation base 11 and are arranged at intervals up and down
  • the second heat dissipation fins 22 extend horizontally along both sides of the upper part of the second heat dissipation base 21 and are arranged at intervals up and down.
  • the first heat dissipation fin 12 includes a first contact fin 121
  • the first contact fin 121 is located at one end of the first heat dissipation base 11 close to the heat conduction unit
  • the second heat dissipation fin 22 includes The second contact fin 221 is located at one end of the second heat dissipation base 21 close to the heat conduction unit.
  • the first contact fin 121 is located at the bottom layer of the first heat dissipation base 11 .
  • a contact fin 121 is flush with the bottom end of the first heat dissipation base 11
  • the second contact fin 221 is located on the top layer of the second heat dissipation base 22
  • the second contact fin 221 is flush with the top of the second heat dissipation base 21 Flat, as such, the heat conduction unit is in contact with both the first contact fin 121 and the second contact fin 221 .
  • the first radiator 1 and the second radiator 2 are mirror-symmetrical, so that the cooling air duct formed by the first radiator 1 and the second radiator 2 is more concise and regular, there is no large unavoidable air leakage area, and the The cooling air duct formed by the first radiator 1 and the cooling air duct formed by the second radiator 2 are discontinuous and fragmented due to the asymmetry.
  • the heat conduction unit can also support the radiator located above, reducing the deformation of the radiator located below, thereby avoiding Damaged radiator located underneath.
  • the heat-conducting unit includes several heat-conducting members 3, and the number of the heat-conducting members 3 can be set as required, which is not limited in the present invention.
  • the heat-conducting members 3 are distributed at intervals along the air intake direction.
  • the heat-conducting members 3 can be fixed on the top surface of the first heat dissipation base 11 , and there is ventilation between the sides of the heat-conducting member 3 and adjacent components or devices.
  • a gap is formed so that a turbulent flow channel is formed between the first heat dissipation base 11 and the second heat dissipation base 21 , and the oncoming air flow can flow along the side of the heat-conducting member 3 and in the gap between the adjacent heat-conducting members 3
  • the cold air can take away more heat from the first heat dissipation base 11 and the second heat dissipation base 12, and on the other hand, under the action of the pressure difference, the airflow forms a turbulent flow in the gap between the adjacent heat-conducting members 3 , so that one turbulent flow is formed between the heat-conducting members 3, which prolongs the path of wind flow, improves the heat transfer coefficient in the gap, and avoids the influence of the boundary layer, thereby improving the overall heat dissipation efficiency.
  • the width of each heat-conducting member 3 along the air inlet direction increases in turn.
  • the width of the heat-conducting member 3 close to the air-inlet direction is smaller, while the width of the heat-conducting member 3 away from the air-inlet direction is larger.
  • the gap between 3 and adjacent components or devices gradually becomes smaller, so that when the oncoming airflow passes through the turbulent channel, the wind speed gradually increases when the gap between the thermally conductive member 3 and the adjacent components or devices, in the adjacent thermally conductive member.
  • the turbulent flow formed in the gap between 3 is also more intense, so that it is easier to take away the heat around the heat conducting member 3 at the end of the air inlet direction, and more air volume can pass through, improving the heat dissipation efficiency.
  • the width of the heat-conducting members 3 can be set to be equal to the widths of the first heat dissipation fins 12 and the second heat dissipation fins 22 .
  • the gap between adjacent parts or devices is also the gap between the first heat dissipation fin 12 and the second heat dissipation fin 22 and the adjacent parts or devices.
  • the first heat dissipation fin 12 and the second heat dissipation fin 22 are adjacent to There must be a gap between the components or devices, so that the ventilation gap can be formed between the side of the heat-conducting component 3 and the adjacent components or devices by making full use of the requirements of the safety regulations. If the ventilation gap is too large, the wind will flow away directly, wasting the air volume, or if the ventilation gap is too small, the wind cannot smoothly pass through the gap to form a turbulent flow; and the two surfaces of the heat conducting member 3 are completely abutted against the first contact fin 121 and the second contact fin The fins 221 make heat conduction between the first contact fin 121 and the second contact fin 221, which further improves the heat dissipation efficiency.
  • an air guide portion 31 is provided on one end of each heat conducting member 3 close to the air inlet direction, and the width of the air guide portion 31 gradually increases along the air inlet direction to guide the oncoming airflow.
  • the end of each heat conducting member 3 close to the air inlet direction is provided with a protruding first arc surface. And the flow resistance is smaller.
  • each heat-conducting member 3 away from the air inlet direction is further provided with an air collecting portion 32 , and the width of the air collecting portion 32 gradually increases along the air inlet direction.
  • the air collecting portion 32 is beneficial to The gathering of the airflow forms a strong turbulence, which further improves the heat dissipation efficiency, and is also conducive to saving materials, thereby saving costs;
  • Two arc surfaces, the second arc surface forms the air collecting portion 32 , and the design of the second arc surface is more conducive to the gathering of the airflow at the center of the arc.
  • each air guide is placed in the high temperature area of the first heat dissipation base 11 and the second heat dissipation base 21 , so that the heat in the high temperature area can be on the first heat dissipation base 11 and the second heat dissipation base 21 .
  • the high temperature area can be measured in advance through simulation experiments, but at least one heat conduction member 3 is placed at the end of the air inlet direction, due to the heat at the end of the first radiator 1 or the second radiator 2 At the most, disposing the heat-conducting member 3 at the end of the air inlet direction can conduct the heat of the first radiator 1 and the second radiator 2 in the high temperature area of the end, which can prevent the heat from being too high at the end.
  • the present invention also adjusts the layout of the power device.
  • the first power unit 4 includes a first power assembly 41 and a second power assembly 42, and the first power assembly 41 and the second power assembly 42 are respectively fixed on both sides of the first heat dissipation base 11; When one of the components 41 and the second power component 42 is in a working state, the other is in a resting state.
  • the first power assembly 41 and the second power assembly 42 that switch and work are generally disposed on two radiators, respectively. When one of the power assemblies is working, the other power assembly is in a rest state, so that there is only one radiator.
  • the technical solution of the present invention fixes the first power component 41 and the second power component 42 on both sides of the first heat dissipation base 11 respectively, so that the first power component 41 and When the second power component 42 is switched to work, the first radiator 1 is always in the working state, and the heat of the power component on one side can be transferred to the other side, which further improves the heat dissipation efficiency and reduces the number of radiators. Cost savings.
  • the second power unit 5 may also include a third power assembly and a fourth power assembly that switch and work, wherein the third power assembly always works simultaneously with the first power assembly, and when the first power assembly 41 is located on the first heat dissipation base 11, the fourth power component can be placed on the left side of the second heat dissipation base 21, so that when the first power component 41 is working, the third power component located on the diagonal of the first power component 41 In the working state, the second power assembly 42 and the fourth power assembly opposite the first power assembly are in the resting state, the power assemblies in the working state and the resting state are completely staggered, and the heat of the first radiator 1 and the second radiator 2 Less concentrated, more balanced.
  • a flexible heat-conducting sheet 6 is also included, and the flexible heat-conducting sheet 6 covers the entire contact surface where the first power component 41 and the second power component 42 are connected to the first heat dissipation base 11 .
  • the arrangement of the flexible thermally conductive sheet 6 as the interface material between the first power component 41 and the second power component 42 and the first heat sink 1 further improves the thermal conductivity, and the flexible thermally conductive sheet 6 as a flexible product has no lock cracks and lower cost , thereby improving the thermal conductivity under the condition of the same cost, thereby improving the overall temperature uniformity of the radiator.
  • the flexible thermal conductive sheet 6 adopts a graphene sheet, and the graphene sheet is sequentially connected with an adhesive layer, a graphene layer and an insulating layer from bottom to top, wherein the adhesive layer is bonded to the first heat dissipation base 11 .
  • the insulating layer is in contact with the first power component 41 and the second power component 42. Since the first power component 41 and the second power component 42 are fixed on the first heat dissipation base 11 through the fixing member, the graphene sheet is There is also a through hole for the fastener to pass through, and the through hole and the graphene sheet are separated by a sealant to prevent the graphene powder in the graphene layer from leaking.
  • both the first heat sink 1 and the second heat sink 2 are prepared by the same process, and the difference between the first heat sink 1 and the second heat sink 2 is only the first heat dissipation base 11 and the second heat dissipation base
  • the height of 21 is different, and the number of the first heat dissipation fins 12 and the second heat dissipation fins 22 is different.
  • the height of the first heat dissipation base 11 can be set is greater than the height of the second heat dissipation base, so that the number of the first heat dissipation fins 12 is also more than the number of the second heat dissipation fins 22, and the heat dissipation efficiency of the first heat sink 1 is higher than that of the second heat sink 2. Therefore, the overall heat dissipation efficiency of the first heat sink 1 and the second heat sink 2 is more balanced.
  • a heat conduction unit is arranged between the first heat dissipation base 11 and the second heat dissipation base 21 of the present invention.
  • the heat exchange efficiency between the two heat dissipation bases 21 reduces the overall thermal resistance of the first radiator 1 and the second radiator 2, and prevents the first power unit 4 from losing very little while the second power unit 5 loses a lot.
  • the heat is unbalanced, which improves the temperature uniformity of the first power unit 4 on the first heat dissipation base 11 and the second power unit 5 on the second heat dissipation base 21, and reduces the temperature of the first power unit 4 and the second power unit 5 on the second heat dissipation base 21.
  • the local high temperature points of the two power units 5 can cope with different extreme working conditions and improve the heat dissipation efficiency under the same cost condition; in the process of heat transfer, the first heat dissipation fin closest to the first power unit 4 12 will absorb heat first, and the first heat dissipation fins 12 farthest from the first power unit 4 will absorb heat last, and the second heat dissipation fins 22 closest to the second power unit 5 will absorb heat first, and the second heat dissipation fins farthest away from the second power unit 5 will absorb heat first.
  • the second heat dissipation fins 22 of the power unit 5 will eventually absorb heat, resulting in low heat dissipation efficiency of the first heat dissipation fins 12 away from the first power unit 4 and the second heat dissipation fins 22 away from the second power unit 5, and the first heat dissipation After the base 11, the heat conduction unit and the second heat dissipation base 21 are stacked in sequence, the heat of the first heat dissipation base 11 and the second heat dissipation base 21 is conducted, and the heat flows from the area with high temperature to the area with low temperature.
  • the heat of the first heat dissipation base 11 and the second heat dissipation base 21 is more balanced, so that the heat dissipation efficiency of the first heat dissipation fin 12 and the second heat dissipation fin 22 is also more balanced;
  • the 1 and the second heat sink 2 are placed in the electrical equipment, since the first heat dissipation base 11 and the second heat dissipation base 21 of the heat conduction unit are stacked in sequence, the distance between the first heat dissipation base 11 and the second heat dissipation base 21 can be adjusted.
  • first heat sink 1 and the second heat sink 2 can have different heat dissipation efficiencies, and the overlapping manner reduces the volume of the heat dissipation structure.
  • the present invention also discloses a power module, comprising a chassis (not shown in the figure), a first circuit board 7, a second circuit board 8, the above-mentioned heat dissipation structure, a first power unit 4, The second power unit 5 , the third power unit 9 , the fourth power unit 10 , the air supply unit 110 and several partitions 120 .
  • the first circuit board 7 and the second circuit board 8 are arranged in the chassis, wherein the first circuit board 7 is located on the top of the chassis, the second circuit board 8 is located under the first circuit board 7, and the second circuit board 8 is connected to the first circuit board. 7 parallel, the first circuit board 7 is provided with at least two first power units 4 and at least two third power units 9, and the second circuit board 8 is provided with at least two opposite first power units 4.
  • the second power unit 5 and the fourth power unit 10 are arranged opposite each of the third power units 9 .
  • the calorific value of each third power unit 9 is smaller than the calorific value of each first power unit 4
  • the calorific value of each fourth power unit 10 is smaller than the calorific value of each second power unit 5 .
  • the top surface of the first heat dissipation base 11 is fixed to the bottom surface of the first circuit board 7
  • the bottom surface of the second heat dissipation base 21 is fixed to the top surface of the second circuit board 8 .
  • the first power unit 4 is also fixed on both sides of the first heat dissipation base 11 between the first circuit board 7 and the first heat dissipation fins 12 on the top layer. Specifically, the first power component 41 and the second power component 42 are respectively fixed on both sides of the first heat dissipation base 11 .
  • the second power unit 5 is also fixed on both sides of the second heat dissipation base 21 between the second circuit board 8 and the second heat dissipation fins 22 of the bottom layer.
  • a plurality of partitions 120 are arranged in the chassis and divide the chassis into at least two independent heat dissipation areas.
  • each partition is vertically connected to the first circuit board 7 and the second circuit board 8 , so as to divide the area between the first circuit board 7 and the second circuit board 8 into at least two independent heat dissipation areas along the left and right directions
  • each radiator is arranged along the left and right direction of the chassis
  • the air supply unit 110 includes and each heat dissipation area.
  • the number of partitions 120 is two, and the number of heat dissipation areas is three, which satisfies the high power and large capacity of the power module. design requirements.
  • the end where the fan is located is the air inlet end of the chassis.
  • each heat dissipation area includes two first heat sinks 1, two second heat sinks 2, and a third power unit 9 and a fourth power unit 10; wherein the two first heat sinks 1 are respectively Located on both sides of the third power unit 9, the two second heat sinks 2 are respectively located on both sides of the fourth power unit 10, the first heat dissipation fins 12 and the third power unit 9 have a safety gap, and the second heat dissipation fins 22 and the fourth power unit 10 have a safety gap, and the safety gap constitutes a ventilation gap between the heat-conducting member 3 and the third power unit 9 or the fourth power unit 10;
  • the area includes two third power units 9, two fourth power units 10, two first radiators 1 and two second radiators 2, the third power unit 9 and the first radiator 1 are spaced apart, and the fourth The power unit 10 and the second heat sink 2 are arranged at intervals, a first heat dissipation channel is formed between the adjacent first heat dissipation fins 12, a second heat dissipation channel is
  • the air volume delivered by the fan to the first radiator 1 and the second radiator 2 is greater than the air volume delivered to the third power unit 9 and the fourth power unit 10.
  • the axis of the rotating shaft of the fan is facing the third power unit 9 and the fourth power unit 10.
  • the position aligned with the rotating shaft of the fan is the place where the air volume is the smallest, so let The axis of the rotating shaft of the fan is facing the third power unit 9 and the fourth power unit 10, so that most of the blades of the fan face the first radiator 1 and the second radiator 2, so that the fan faces the first radiator 1
  • the air volume delivered by the second radiator 2 is greater than the air volume delivered to the third power unit 9 and the fourth power unit 10; in the heat dissipation area on the far right, the axis of the rotating shaft of the fan is facing the third power unit located on the left.
  • the unit 9 and the fourth power unit 10, the third power unit 9 and the fourth power unit 10 on the right are therefore also located in the area of the fan blades.
  • the heat emitted by the first power unit 4 is transferred to the first heat dissipation fins 12 through the first heat dissipation base 11 , the first heat dissipation fins 12 absorb the heat, and the heat is transferred to the first heat dissipation air duct and then is conveyed by the air supply unit 110 .
  • the heat emitted by the second power unit 5 is transferred to the second heat dissipation fins 22 through the second heat dissipation base 21 , the second heat dissipation fins 22 absorb the heat, and the heat is transferred to the second heat dissipation air duct and then sent to the air supply unit 110 The delivered wind blows out of the chassis.
  • the first heat dissipation base 11 and the second heat dissipation base 21 have a columnar structure, which can be a cylinder or a rectangular column, and the air intake direction is the length direction of the first heat dissipation base 11 and the second heat dissipation base 21,
  • the first heat dissipation fins 12 closest to the first power unit 4 will absorb heat first, while the first heat dissipation fins 12 farthest from the first power unit 4 will absorb heat last, and the first heat dissipation fins 12 closest to the second power unit 4 will absorb heat last.
  • the second heat dissipation fins 22 of the power unit 5 will absorb heat first, and the second heat dissipation fins 22 farthest from the second power unit 5 will absorb heat last, resulting in the first heat dissipation fins 12 and
  • the heat dissipation efficiency of the second heat dissipation fins 22 away from the second power unit 5 is low. According to the principle that the heat flows from the high temperature area to the low temperature area, the heat of the first heat dissipation base 11 and the second heat dissipation base 21 is more balanced, so that the first heat dissipation fin 12 and the second heat dissipation base 21 are more balanced.
  • the heat dissipation efficiency of the two heat dissipation fins 22 is also more balanced.
  • the wind passes through the turbulent flow channel, the first heat-dissipating channel and the second heat-dissipating channel during the flow process.
  • 32 is conducive to the concentration of air flow, forming a strong turbulence, thereby forming one after another turbulent flow in the gap between the heat-conducting members 3, which greatly improves the first cooling fins 12 on the bottom layer and the second cooling fins 22 on the top layer.
  • the heat exchange efficiency is greatly improved, that is, the heat exchange efficiency of the first contact fins 121 and the second contact fins 221 is greatly improved.
  • the third power unit 9 is located directly above the fourth power unit 10 .
  • the first circuit board 7 can be a rectifier circuit board
  • the second circuit board 8 can be an inverter circuit board
  • the third power unit 9 and the fourth power unit 10 are capacitors
  • the first power component 41 is A power device in a rectifier circuit
  • the second power component 42 is a power device in a boost circuit.
  • the power module of the present invention adopts the above-mentioned heat dissipation structure.
  • the power unit with high heat generation, the first radiator 1 and the second radiator 2 are located in the strong wind area of the air supply unit 110, so that the first radiator 1 and the second radiator 2 are on the strong wind area.
  • the heat can be dissipated in time; the first radiator 1, the heat conduction unit and the second radiator 2 are stacked in sequence to conduct the heat of the first radiator 1 and the second radiator 2.
  • Both the high temperature area of the second heat dissipation base 21 and the end area of the air inlet direction are placed with the heat conduction member 3, so that the heat conduction efficiency of the first heat sink 1 and the second heat sink 2 is higher, and the temperature is more balanced.
  • the overall thermal resistance of the two heat sinks 2 is reduced, the temperature uniformity of the first power unit 4 on the first heat dissipation base 11 and the second power unit 5 on the second heat dissipation base 21 is improved, and the first power unit 4 is reduced. and the local high temperature point of the second power unit 5, so that different extreme working conditions can be dealt with.
  • each heat-conducting member 3 and the setting of the shape of the heat-conducting member 3 make the space between the first heat dissipation base 11 and the second heat dissipation base 21
  • the turbulent flow is formed and the heat dissipation efficiency is enhanced;
  • the first power assembly 41 and the second power assembly 41 for switching work are respectively arranged on both sides of the first heat dissipation base 11, and the graphene sheet 6 is arranged as the first power assembly 41 and the second power assembly 41.
  • the interface material between the two power components 42 and the first heat sink 1 further improves the heat conduction efficiency; and the structural arrangement of the first heat dissipation fins 12 and the second heat dissipation fins 22 makes the heat dissipation efficiency more balanced, so that under the same cost conditions The heat dissipation efficiency is improved; and the heights of the first radiator 1 and the second radiator 2 can be adjusted, which are more flexible, small in size, and wider in scope.

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Abstract

A heat dissipation structure, comprising a first heat sink (1), used to dissipate heat for first power units (4), and provided with a first heat dissipation base (11) provided with first heat dissipation fins (12); a second heat sink (2), provided opposite to the first heat sink (1), used to dissipate heat for second power units (5), and provided with a second heat dissipation base (21) provided with second heat dissipation fins (22); and a heat conduction unit, having two surfaces that are facing away from and parallel to each other respectively attached to opposite end faces of the first heat dissipation base (11) and the second heat dissipation base (21), and used to conduct heat between the first heat sink (1) and the second heat sink (2). Further provided is a power module using the described heat dissipation structure. The heat of the first heat sink (1) and the second heat sink (2) in the heat dissipation structure and the power module are in communication, reducing local high-temperature points of the first power units (4) and the second power units (5), such that the temperature is more balanced, thereby being able to cope with different extreme working conditions, and improving the heat dissipation efficiency under the same cost condition.

Description

一种散热结构及功率模块A heat dissipation structure and power module 技术领域technical field
本发明涉及散热技术领域,具体涉及一种散热结构及功率模块。The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a power module.
背景技术Background technique
目前电力电子模块功率不断增大,散热问题越来越突出。散热技术成为制约模块功率增长的主要因素,提高各功率器件的均温性及散热设备的效率,能够低成本的降低散热因素对功率密度提升的限制并延长设备使用寿命。At present, the power of power electronic modules continues to increase, and the problem of heat dissipation is becoming more and more prominent. Heat dissipation technology has become the main factor restricting the power growth of modules, improving the temperature uniformity of each power device and the efficiency of heat dissipation equipment, which can reduce the limitation of heat dissipation factors on the increase of power density and prolong the service life of equipment at low cost.
现有散热设计,往往是将各功能的功率器件组合成不同的单元,放置于不同的散热器上,即每个散热器对应一个功率单元,各个散热器的散热通路是独立的,当有的功率单元不工作或损耗低时,而另外一些功率单元损耗较高时,就会出现一些散热器热量集中,一些散热器热量很低,导致散热器的热量不均衡,散热器整体的散热效率较低;另外,为了满足所有状态下(特别是恶劣工况)各功率单元的散热要求,散热器的体积往往较大,成本高昂。In the existing heat dissipation design, the power devices of various functions are often combined into different units and placed on different radiators, that is, each radiator corresponds to a power unit, and the heat dissipation paths of each radiator are independent. When the power unit does not work or the loss is low, and when the loss of other power units is high, the heat of some radiators will be concentrated, and the heat of some radiators will be very low, resulting in unbalanced heat of the radiator, and the overall heat dissipation efficiency of the radiator will be higher. In addition, in order to meet the heat dissipation requirements of each power unit in all states (especially in severe working conditions), the volume of the radiator is often large and the cost is high.
如,对于需要有多种工作状态的UPS而言,各功率器件的损耗在不同工作状态下是不一致的,往往为交替工作。UPS设备可分为旁路模块和功率模块,功率模块包括逆变电路、整流电路和升压电路。功率模块在市电态时,升压电路中电池态相关的功率器件(IGBT、二极管、电感等)不工作,整流电路中的市电态功率器件和逆变电路中的功率器件持续工作;功率模块在电池态时,升压电路中电池态相关的功率器件和逆变电路中的功率器件持续工作,整流电路中市电态相关的功率器件不工作;且市电态时,平衡桥电路不一定工作,即使工作,各功率器件的损耗也是动态性的变化,而即使是持续性工作的功率器件(如逆变电路),在不同工况下的损耗也是不一致的。因此,功率模块内的热量并不均衡,且热量始终处于一个动态的变化过程,散热效率较低。For example, for a UPS that needs to have multiple working states, the loss of each power device is inconsistent under different working states, and often works alternately. UPS equipment can be divided into bypass module and power module, power module includes inverter circuit, rectifier circuit and boost circuit. When the power module is in the mains state, the battery-related power devices (IGBTs, diodes, inductors, etc.) in the boost circuit do not work, and the mains-state power devices in the rectifier circuit and the power devices in the inverter circuit continue to work; power When the module is in the battery state, the power devices related to the battery state in the boost circuit and the power devices in the inverter circuit continue to work, and the power devices related to the mains state in the rectifier circuit do not work; and in the mains state, the balance bridge circuit does not work. Certain work, even if it works, the loss of each power device is a dynamic change, and even for a power device that continuously works (such as an inverter circuit), the loss under different working conditions is also inconsistent. Therefore, the heat in the power module is not balanced, and the heat is always in a dynamic change process, and the heat dissipation efficiency is low.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于克服背景技术中存在的上述缺陷或问题,提供一种散热效率高、温度均衡且体积小、成本低廉的散热结构及功率模块。The purpose of the present invention is to overcome the above-mentioned defects or problems in the background art, and to provide a heat dissipation structure and a power module with high heat dissipation efficiency, balanced temperature, small size and low cost.
为达成上述目的,本发明采用如下技术方案:To achieve the above object, the present invention adopts the following technical solutions:
一种散热结构,以下标记为技术方案一,在技术方案一种中,包括第一散热器,其用于为第一功率单元散热,其上设有带第一散热鳍片的第一散热基座;第二散热器,其相对第一散热器设置,用于为第二功率单元散热,其上设有带第二散热鳍片的第二散热基座;和导热单元,其上两个彼此背离且平行的表面分别贴靠第一散热基座和第二散热基座相对的端面, 并用于在第一散热器和第二散热器之间传导热量。A heat dissipation structure, hereinafter marked as technical solution 1, in technical solution 1, comprising a first heat sink for dissipating heat for a first power unit, on which is provided a first heat dissipation base with first heat dissipation fins a seat; a second radiator, which is arranged opposite the first radiator and used to dissipate heat for the second power unit, on which a second heat dissipation base with second heat dissipation fins is arranged; and a heat conduction unit, two of which are mutually The facing away and parallel surfaces are respectively abutted against the opposite end faces of the first heat dissipation base and the second heat dissipation base, and are used for conducting heat between the first heat sink and the second heat sink.
基于技术方案一,还包括技术方案二,技术方案二中,所述第一散热鳍片包括第一接触鳍片,所述第二散热鳍片包括第二接触鳍片,所述导热单元与第一接触鳍片和第二接触鳍片均接触;所述导热单元包括至少两个导热件,各导热件沿进风方向间隔分布,且所述导热件的侧边与邻近的部件或器件之间存在通风间隙,以使所述第一散热基座的端面和第二散热基座的端面之间形成湍流通道。Based on the technical solution 1, it also includes the technical solution 2. In the technical solution 2, the first heat dissipation fin includes a first contact fin, the second heat dissipation fin includes a second contact fin, and the heat conduction unit is connected to the first contact fin. Both a contact fin and a second contact fin are in contact; the heat-conducting unit includes at least two heat-conducting parts, each heat-conducting part is spaced apart along the air intake direction, and the side edges of the heat-conducting parts and adjacent components or devices are located between them. A ventilation gap exists to form a turbulent flow channel between the end face of the first heat dissipation base and the end face of the second heat dissipation base.
基于技术方案二,还包括技术方案三,技术方案三中,各导热件上靠近进风方向的一端设有导风部,所述导风部的宽度沿进风方向逐渐增大以将迎面的气流导向其两侧。Based on the technical solution 2, it also includes the technical solution 3. In the technical solution 3, an air guide portion is provided on one end of each heat-conducting member close to the air inlet direction, and the width of the air guide portion gradually increases along the air inlet direction so as to reduce the oncoming air. Air flow is directed to its sides.
基于技术方案二,还包括技术方案四,技术方案四中,各导热件上远离进风方向的一端设有聚风部,所述聚风部的宽度沿进风方向逐渐增大。Based on technical solution 2, it also includes technical solution 4. In technical solution 4, an air collecting portion is provided on one end of each heat conducting member away from the air inlet direction, and the width of the air collecting portion gradually increases along the air inlet direction.
基于技术方案一,还包括技术方案五,技术方案五中,所述第一功率单元和第二功率单元的发热量不同,所述第一散热器和第二散热器的区别在于第一散热基座和第二散热基座的高度不同,第一散热鳍片的数量和第二散热鳍片的数量不同。Based on technical solution 1, it also includes technical solution 5. In technical solution 5, the calorific value of the first power unit and the second power unit are different, and the difference between the first radiator and the second radiator is that the first heat dissipation base The heights of the seat and the second heat dissipation base are different, and the number of the first heat dissipation fins and the number of the second heat dissipation fins are different.
基于技术方案一,还包括技术方案六,技术方案六中,所述第一功率单元包括第一功率组件和第二功率组件,所述第一功率组件和第二功率组件分别连接于第一散热基座的两侧;所述第一功率组件和第二功率组件中,一个处于工作状态时,另一个处于休息状态。Based on technical solution 1, it also includes technical solution 6. In technical solution 6, the first power unit includes a first power component and a second power component, and the first power component and the second power component are respectively connected to the first heat sink Two sides of the base; among the first power assembly and the second power assembly, when one is in a working state, the other is in a resting state.
基于技术方案六,还包括技术方案七,技术方案七中,还包括柔性导热片,所述柔性导热片覆盖于第一功率组件和第二功率组件与第一散热基座连接的整个接触面上。Based on the technical solution 6, it also includes the technical solution 7. In the technical solution 7, it also includes a flexible thermal conductive sheet, and the flexible thermal conductive sheet covers the entire contact surface where the first power component and the second power component are connected to the first heat dissipation base. .
本发明同时提供一种功率模块,以下标记为技术方案八,技术方案八中,包括第一电路板,其设有第一功率单元;第二电路板,其平行于第一电路板并设有与第一功率单元相向设置的第二功率单元;和如技术方案一至七中任一项所述的散热结构,第一功率单元和第二功率单元分别固接于第一散热基座和第二散热基座上。The present invention also provides a power module, which is marked as technical solution 8 below. In the technical solution 8, it includes a first circuit board, which is provided with a first power unit; and a second circuit board, which is parallel to the first circuit board and provided with a second power unit disposed opposite to the first power unit; and the heat dissipation structure according to any one of technical solutions one to seven, wherein the first power unit and the second power unit are respectively fixed to the first heat dissipation base and the second power unit on the cooling base.
基于技术方案八,还包括技术方案九,技术方案九中,还包括送风单元;所述第一电路板上还设有第三功率单元,所述第三功率单元的发热量小于第一功率单元的发热量;所述第二电路板上还设有与第三功率单元相向设置的第四功率单元,所述第四功率单元的发热量小于第二功率单元的发热量;送风单元向第一散热器和第二散热器输送的风量大于其向第三功率单元和第四功率单元输送的风量。Based on the eighth technical solution, the ninth technical solution is further included. In the ninth technical solution, an air supply unit is further included; a third power unit is further provided on the first circuit board, and the calorific value of the third power unit is smaller than that of the first power. The calorific value of the unit; the second circuit board is also provided with a fourth power unit opposite to the third power unit, the calorific value of the fourth power unit is smaller than the calorific value of the second power unit; The air volume delivered by the first radiator and the second radiator is greater than the air volume delivered to the third power unit and the fourth power unit.
基于技术方案九,还包括技术方案十,技术方案十中,还包括隔板,所述隔板垂直连接第一电路板和第二电路板,以将第一电路板和第二电路板之间的区域分隔成至少两个独立的散热区,每个散热区均配置有两个第一散热器、两个第二散热器及一第三功率单元和一第四功率单元;其中两个第一散热器分别位于第三功率单元的两侧,两个第二散热器分别位于第四功率单元的两侧。Based on technical solution 9, technical solution 10 is also included. In technical solution 10, a spacer is further included, and the spacer connects the first circuit board and the second circuit board vertically, so as to separate the space between the first circuit board and the second circuit board. The area is divided into at least two independent heat dissipation areas, and each heat dissipation area is equipped with two first radiators, two second radiators, a third power unit and a fourth power unit; The radiators are respectively located on both sides of the third power unit, and the two second radiators are located on both sides of the fourth power unit respectively.
由上述对本发明的描述可知,相对于现有技术,本发明具有的如下有益效果:As can be seen from the above description of the present invention, with respect to the prior art, the present invention has the following beneficial effects:
1.技术方案一中,第一散热基座和第二散热基座之间设置导热单元,导热单元使得第一散热器和第二散热器的热量导通,提高了第一散热基座和第二散热基座之间的换热效率,从而降低了第一散热器和第二散热器整体的热阻,避免了第一功率单元损耗很低,而第二功率单元损耗很高时,热量不均衡,提高了第一散热基座上的第一功率单元和第二散热基座上的第二功率单元的均温性,降低了第一功率单元和第二功率单元的局部高温点,从而可应对不同的极限工况,且在同等成本的条件下提高了散热效率;当将第一散热器和第二散热器置于电气设备内时,由于导热单元上两个彼此背离且平行的表面分别贴靠第一散热基座和第二散热基座的端面,即第一散热基座、导热单元和第二散热基座依次叠置,可调整第一散热基座和第二散热基座的高度,只要第一散热基座、导热单元和第二散热基座的高度的总和仍可放置于电气设备内即可,使得第一散热器和第二散热器的高度更加灵活,且叠置的方式减小了散热结构的体积;导热单元在第一散热器和第二散热器上下放置时还可支撑位于上方的散热器,降低位于下方的散热器的变形量,从而避免位于下方的散热器损坏。1. In technical solution 1, a heat conduction unit is arranged between the first heat dissipation base and the second heat dissipation base, and the heat conduction unit makes the heat of the first heat sink and the second heat sink conduct heat, which improves the first heat dissipation base and the second heat dissipation base. The heat exchange efficiency between the two heat dissipation bases reduces the overall thermal resistance of the first radiator and the second radiator, and avoids that the loss of the first power unit is very low, but when the loss of the second power unit is high, the heat Balanced, the temperature uniformity of the first power unit on the first heat dissipation base and the second power unit on the second heat dissipation base is improved, and the local high temperature points of the first power unit and the second power unit are reduced, so that the Cope with different extreme working conditions, and improve the heat dissipation efficiency under the same cost; Abutting against the end faces of the first heat dissipation base and the second heat dissipation base, that is, the first heat dissipation base, the heat conduction unit and the second heat dissipation base are stacked in sequence, and the heights of the first heat dissipation base and the second heat dissipation base can be adjusted. , as long as the sum of the heights of the first heat dissipation base, the heat conduction unit and the second heat dissipation base can still be placed in the electrical equipment, so that the heights of the first heat sink and the second heat sink are more flexible, and the way of stacking The volume of the heat dissipation structure is reduced; when the first heat sink and the second heat sink are placed on top of each other, the heat conduction unit can also support the heat sink located above, reducing the deformation of the heat sink located below, thereby avoiding damage to the heat sink located below .
2.技术方案二中,在热量传递的过程中,最靠近第一功率单元的第一散热鳍片会先收热量,而最远离第一功率单元的第一散热鳍片会最后吸收热量,最靠近第二功率单元的第二散热鳍片会先吸收热量,而最远离第二功率单元的第二散热鳍片会最后吸收热量,导致远离第一功率单元的第一散热鳍片和远离第二功率单元的第二散热鳍片散热效率低,其中与导热单元接触的第一散热鳍片一般位于远离第一功率单元的一端,与导热单元接触的第二散热鳍片一般位于远离第二功率单元的一端,即第一接触鳍片和第二接触鳍片往往最后才吸收第一功率单元和第二功率单元的热量,设置导热单元后,导热单元与第一接触鳍片和第二接触鳍片均接触,第一接触鳍片和第二接触鳍片的热量导通,从而提高了第一接触鳍片和第二接触鳍片的散热效率;且第一接触鳍片和第二接触鳍片均与导热单元相接触,便于在第一散热基座的端面和第二散热基座的端面之间形成湍流通道,且避免了湍流通道过大浪费风量;由于各导热件沿进风方向间隔排布,且导热件的侧边与邻近的部件或器件之间存在通风间隙,使得迎面的气流可沿着导热件的侧边流动,并在相邻的导热件之间的间隙中聚集,一方面冷风能够带走更多的第一散热基座和第二散热基座的热量,另一方面在压差的作用下气流在相邻的导热件的间隙内形成扰流,从而在导热件之间形成一个接一个的湍流,延长了风流动的路径,提高了间隙内的换热系数,避免了边界层的影响,从而提高了整体的散热效率。2. In technical solution 2, in the process of heat transfer, the first heat dissipation fin closest to the first power unit will absorb heat first, and the first heat dissipation fin farthest from the first power unit will absorb heat last, and the most The second heat dissipation fins close to the second power unit absorb heat first, and the second heat dissipation fins farthest from the second power unit absorb heat last, resulting in the first heat dissipation fins far away from the first power unit and the second heat dissipation fins farthest away from the second power unit The heat dissipation efficiency of the second heat dissipation fin of the power unit is low, wherein the first heat dissipation fin in contact with the heat conduction unit is generally located at one end away from the first power unit, and the second heat dissipation fin in contact with the heat conduction unit is generally located away from the second power unit. One end, namely the first contact fin and the second contact fin, usually absorb the heat of the first power unit and the second power unit last. are in contact with each other, and the heat of the first contact fin and the second contact fin is conducted, thereby improving the heat dissipation efficiency of the first contact fin and the second contact fin; and the first contact fin and the second contact fin are both In contact with the heat conduction unit, it is convenient to form a turbulent flow channel between the end face of the first heat dissipation base and the end face of the second heat dissipation base, and avoids excessive waste of air volume in the turbulent flow passage; , and there is a ventilation gap between the side of the heat-conducting member and the adjacent components or devices, so that the oncoming air flow can flow along the side of the heat-conducting member and gather in the gap between the adjacent heat-conducting members. It can take away more heat of the first heat dissipation base and the second heat dissipation base. On the other hand, under the action of the pressure difference, the airflow forms a turbulent flow in the gap between the adjacent heat-conducting parts, thereby forming a turbulent flow between the heat-conducting parts. The turbulent flow one by one extends the path of the wind flow, improves the heat transfer coefficient in the gap, avoids the influence of the boundary layer, and thus improves the overall heat dissipation efficiency.
3.技术方案三中,设置导风部,有利于降低气流的流阻。3. In the third technical solution, an air guide is provided, which is beneficial to reduce the flow resistance of the airflow.
4.技术方案四中,设置聚风部,有利于气流的聚集,形成强烈的扰流,进一步提高了散热效率,且还有利于节省材料,从而节约了成本。4. In the fourth technical solution, the arrangement of the air gathering part is conducive to the gathering of the air flow, forming a strong turbulence, which further improves the heat dissipation efficiency, and is also conducive to saving materials, thereby saving costs.
5.技术方案五中,第一散热器和第二散热器的设置,使得可以在第一功率单元发热量大于第二功率单元的发热量时,相应的增加第一散热基座的高度和增加第一散热鳍片的数量以使第一散热器的散热效率大于第二散热器的效率,从而使得第一散热器 和第二散热器整体散热效率更为均衡。5. In technical solution 5, the arrangement of the first radiator and the second radiator makes it possible to correspondingly increase the height and increase the height of the first heat dissipation base when the calorific value of the first power unit is greater than that of the second power unit. The number of the first heat dissipation fins is such that the heat dissipation efficiency of the first heat sink is greater than that of the second heat sink, so that the overall heat dissipation efficiency of the first heat sink and the second heat sink is more balanced.
6.技术方案六中,现有技术中切换工作的第一功率器件和第二功率器件一般是分别设置于两个散热器上,当其中一个功率器件工作时,另一个功率组件处于休息状态,使得只有一个散热器在工作,而另一个散热器处于闲置状态,本发明的技术方案将第一功率组件和第二功率组件分别固接于第一散热基座的两侧,使得第一功率组件和第二功率组件在切换工作时,第一散热器始终也处于工作状态,且一侧的功率组件的热量可以向另一侧传递,进一步提高了散热效率,且减少了散热器的使用数量,节约了成本。6. In technical solution 6, in the prior art, the first power device and the second power device that switch work are generally arranged on two radiators respectively. When one power device is working, the other power component is in a rest state, So that only one radiator is working, and the other radiator is in an idle state, the technical solution of the present invention fixes the first power assembly and the second power assembly on both sides of the first heat dissipation base, so that the first power assembly is When switching work with the second power component, the first radiator is always in the working state, and the heat of the power component on one side can be transferred to the other side, which further improves the heat dissipation efficiency and reduces the number of radiators used. Cost savings.
7.技术方案七中,柔性导热片的设置作为第一功率组件和第二功率组件与第一散热器基座的界面材料,进一步提高了导热效率,且柔性导热片作为柔性品不存在锁裂情况、成本更低,从而在同等成本的条件下提高了导热效率,从而提高了散热器整体的均温性。7. In technical solution 7, the setting of the flexible thermal conductive sheet is used as the interface material between the first power component and the second power component and the first radiator base, which further improves the thermal conductivity, and the flexible thermal conductive sheet has no lock crack as a flexible product. Therefore, the heat conduction efficiency is improved under the condition of the same cost, thereby improving the overall temperature uniformity of the radiator.
8.技术方案八中,功率模块采用技术方案一至七中的散热结构,体积小,降低了第一散热器和第二散热器整体的热阻,提高了第一散热基座上的第一功率单元和第二散热基座上的第二功率单元的均温性,降低了第一功率单元和第二功率单元的局部高温点;第一散热器和第二散热器的高度可调节,更为灵活,且在同等成本的条件下提高了散热效率。8. In technical solution 8, the power module adopts the heat dissipation structure in technical solutions 1 to 7, which is small in size, reduces the overall thermal resistance of the first heat sink and the second heat sink, and improves the first power on the first heat dissipation base. The temperature uniformity of the unit and the second power unit on the second heat dissipation base reduces the local high temperature points of the first power unit and the second power unit; the heights of the first heat sink and the second heat sink can be adjusted, and the Flexible and improved thermal efficiency at the same cost.
9.技术方案九中,送风单元的设置使得电路板上发热量高的功率单元位于风量较大的区域,发热量低的功率单元位于风量较小的区域,实现了各功率单元的均温性更换,从而提高了功率模块的散热效率。9. In the ninth technical solution, the air supply unit is arranged so that the power unit with high calorific value on the circuit board is located in the area with large air volume, and the power unit with low calorific value is located in the area with small air volume, so as to realize the uniform temperature of each power unit. It can be replaced regularly, thereby improving the heat dissipation efficiency of the power module.
10.技术方案十中,设置隔板,形成独立的散热区,进一步提高了散热效率。10. In the tenth technical solution, a partition plate is arranged to form an independent heat dissipation area, which further improves the heat dissipation efficiency.
附图说明Description of drawings
为了更清楚地说明本发明实施例的技术方案,下面对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域的普通技术人员来说,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.
图1为散热结构的示意图;1 is a schematic diagram of a heat dissipation structure;
图2为散热结构的前视图;Figure 2 is a front view of a heat dissipation structure;
图3为散热结构的分解示意图;3 is an exploded schematic diagram of a heat dissipation structure;
图4为导热件的示意图;Figure 4 is a schematic diagram of a thermally conductive member;
图5为功率模块的示意图;5 is a schematic diagram of a power module;
图6为功率模块的示意图;6 is a schematic diagram of a power module;
图7为功率模块的侧视图;Figure 7 is a side view of the power module;
图8为第二电路板、第二散热器、导热件及第四功率单元的俯视图;FIG. 8 is a top view of the second circuit board, the second heat sink, the heat conducting member and the fourth power unit;
图9为送风单元向散热区内送风的示意图。FIG. 9 is a schematic diagram of the air supply unit supplying air to the heat dissipation area.
主要附图标记说明:Description of main reference signs:
1、第一散热器,11、第一散热基座;12、第一散热鳍片,121、第一接触鳍片;1. The first heat sink, 11, the first heat dissipation base; 12, the first heat dissipation fin, 121, the first contact fin;
2、第二散热器,21、第二散热基座,22、第二散热鳍片,221、第二接触鳍片;2. The second heat sink, 21, the second heat dissipation base, 22, the second heat dissipation fin, 221, the second contact fin;
3、导热件,31、导风部,32、聚风部;3. Thermal parts, 31, air guide part, 32, air gathering part;
4、第一功率单元,41、第一功率组件,42、第二功率组件;4. The first power unit, 41, the first power component, 42, the second power component;
5、第二功率单元;6、石墨烯片;7、第一电路板;8、第二电路板;9、第三功率单元;10、第四功率单元;110、送风单元;120、隔板。5, the second power unit; 6, the graphene sheet; 7, the first circuit board; 8, the second circuit board; 9, the third power unit; 10, the fourth power unit; 110, the air supply unit; plate.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的优选实施例,且不应被看作对其他实施例的排除。基于本发明实施例,本领域的普通技术人员在不作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are preferred embodiments of the present invention and should not be construed to exclude other embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
本发明的权利要求书、说明书及上述附图中,除非另有明确限定,如使用术语“第一”、“第二”或“第三”等,都是为了区别不同对象,而不是用于描述特定顺序。In the claims, description and the above drawings of the present invention, unless otherwise clearly defined, the terms "first", "second" or "third" are used to distinguish different objects, rather than used for Describe a specific order.
本发明的权利要求书、说明书及上述附图中,除非另有明确限定,对于方位词,如使用术语“中心”、“横向”、“纵向”、“水平”、“垂直”、“顶”、“底”、“内”、“外”、“上”、“下”、“前”、“后”、“左”、“右”、“顺时针”、“逆时针”等指示方位或位置关系乃基于附图所示的方位和位置关系,且仅是为了便于叙述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位或以特定的方位构造和操作,所以也不能理解为限制本发明的具体保护范围。In the claims, description and the above drawings of the present invention, unless otherwise expressly defined, the terms "center", "horizontal", "longitudinal", "horizontal", "vertical" and "top" are used for directional words. , "bottom", "inside", "outside", "up", "down", "front", "rear", "left", "right", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation and positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation. , so it should not be construed as limiting the specific protection scope of the present invention.
本发明的权利要求书、说明书及上述附图中,除非另有明确限定,如使用术语“固接”或“固定连接”,应作广义理解,即两者之间没有位移关系和相对转动关系的任何连接方式,也就是说包括不可拆卸地固定连接、可拆卸地固定连接、连为一体以及通过其他装置或元件固定连接。In the claims, description and the above drawings of the present invention, unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" should be used in a broad sense, that is, there is no displacement relationship and relative rotation relationship between the two. Any connection means, that is to say, including non-removable fixed connection, detachable fixed connection, integrated and fixed connection through other devices or elements.
本发明的权利要求书、说明书及上述附图中,如使用术语“包括”、“具有”以及它们的变形,意图在于“包含但不限于”。In the claims, description and the above drawings of the present invention, if the terms "including", "having" and their modifications are used, the intention is to "include but not be limited to".
如图1所示,本发明公开了一种散热结构,包括第一散热器1、第二散热器2和导热单 元,第一散热器1用于为第一功率单元4散热,第二散热器2用于为第二功率单元5散热,第一散热器1和第二散热器2分别设有带第一散热鳍片12的第一散热基座11和带第二散热鳍片22的第二散热基座21,第一功率单元4和第二功率单元5可连接于第一散热基座11和第二散热基座21上,第一功率单元4和第二功率单元5为两种不同实现不同功能的功率器件的组合。导热单元上两个彼此背离且平行的表面分别贴靠第一散热基座11和第二散热基座21相对的端面,并用于在第一散热器1和第二散热器2之间传导热量,即第一散热器1、导热单元和第二散热器2依次叠置。As shown in FIG. 1 , the present invention discloses a heat dissipation structure, including a first heat sink 1 , a second heat sink 2 and a heat conduction unit. The first heat sink 1 is used to dissipate heat for the first power unit 4 , and the second heat sink 1 is used for heat dissipation. 2 is used to dissipate heat for the second power unit 5. The first heat sink 1 and the second heat sink 2 are respectively provided with a first heat dissipation base 11 with first heat dissipation fins 12 and a second heat dissipation base with second heat dissipation fins 22. The heat dissipation base 21, the first power unit 4 and the second power unit 5 can be connected to the first heat dissipation base 11 and the second heat dissipation base 21, and the first power unit 4 and the second power unit 5 are implemented in two different ways A combination of power devices with different functions. The two opposite and parallel surfaces of the heat-conducting unit are respectively abutted against the opposite end faces of the first heat-dissipating base 11 and the second heat-dissipating base 21, and are used to conduct heat between the first heat sink 1 and the second heat sink 2, That is, the first heat sink 1 , the heat conduction unit and the second heat sink 2 are stacked in sequence.
具体地,第一散热基座11沿其与导热单元的叠置方向排布有若干个第一散热鳍片12,第一散热鳍片12与第一散热基座11和导热单元的叠置面的方向平行,第二散热基座21沿其与导热单元的叠置方向排布有若干个第二散热鳍片22,第二散热鳍片22与第二散热基座21和导热单元叠置面的方向平行。第一散热鳍片12和第二散热鳍片22的设置使得第一散热基座11吸收的第一功率单元4的热量及第二散热基座21吸收的第二功率单元5的热量更容易发散,相邻的两个第一散热鳍片12之间形成第一散热风道,相邻的两个第二散热鳍片22之间形成第二散热风道。本实施中,第一散热基座11和第二散热基座21均沿竖直方向延伸,第一散热鳍片12沿第一散热基座11下部的两侧水平方向延伸并上下间隔排布,第二散热鳍片22沿第二散热基座21上部的两侧水平延伸并上下间隔排布。其中,如图2所示,第一散热鳍片12包括第一接触鳍片121,所述第一接触鳍片121位于第一散热基座11靠近导热单元的一端,第二散热鳍片22包括第二接触鳍片221,所述第二接触鳍片221位于第二散热基座21靠近导热单元的一端,本实施例中,第一接触鳍片121位于第一散热基座11的底层,第一接触鳍片121与第一散热基座11的底端齐平,第二接触鳍片221位于第二散热基座22的顶层,第二接触鳍片221与第二散热基座21的顶端齐平,如此,导热单元与第一接触鳍片121和第二接触鳍片221均接触。Specifically, the first heat dissipation base 11 is arranged with a plurality of first heat dissipation fins 12 along the stacking direction of the first heat dissipation base 11 and the heat conduction unit. The second heat dissipation base 21 is arranged with a plurality of second heat dissipation fins 22 along the stacking direction of the second heat dissipation base 21 and the heat conduction unit. The second heat dissipation fins 22 are stacked with the second heat dissipation base 21 and the heat conduction unit. direction is parallel. The arrangement of the first heat dissipation fins 12 and the second heat dissipation fins 22 makes it easier to dissipate the heat of the first power unit 4 absorbed by the first heat dissipation base 11 and the heat of the second power unit 5 absorbed by the second heat dissipation base 21 , a first heat dissipation air duct is formed between two adjacent first heat dissipation fins 12 , and a second heat dissipation air passage is formed between two adjacent second heat dissipation fins 22 . In this embodiment, the first heat dissipation base 11 and the second heat dissipation base 21 both extend in the vertical direction, and the first heat dissipation fins 12 extend in the horizontal direction along both sides of the lower part of the first heat dissipation base 11 and are arranged at intervals up and down. The second heat dissipation fins 22 extend horizontally along both sides of the upper part of the second heat dissipation base 21 and are arranged at intervals up and down. Wherein, as shown in FIG. 2 , the first heat dissipation fin 12 includes a first contact fin 121 , the first contact fin 121 is located at one end of the first heat dissipation base 11 close to the heat conduction unit, and the second heat dissipation fin 22 includes The second contact fin 221 is located at one end of the second heat dissipation base 21 close to the heat conduction unit. In this embodiment, the first contact fin 121 is located at the bottom layer of the first heat dissipation base 11 . A contact fin 121 is flush with the bottom end of the first heat dissipation base 11 , the second contact fin 221 is located on the top layer of the second heat dissipation base 22 , and the second contact fin 221 is flush with the top of the second heat dissipation base 21 Flat, as such, the heat conduction unit is in contact with both the first contact fin 121 and the second contact fin 221 .
优选地,第一散热器1和第二散热器2镜像对称,使得第一散热器1和第二散热器2形成的散热风道更为简洁规整,无较大不可避免的漏风区,且避免了不对称导致的第一散热器1形成的散热风道和第二散热器2形成的散热风道不连续、支离破碎。Preferably, the first radiator 1 and the second radiator 2 are mirror-symmetrical, so that the cooling air duct formed by the first radiator 1 and the second radiator 2 is more concise and regular, there is no large unavoidable air leakage area, and the The cooling air duct formed by the first radiator 1 and the cooling air duct formed by the second radiator 2 are discontinuous and fragmented due to the asymmetry.
优选地,如图2-4所示,第一散热器1和第二散热器2上下叠置时,导热单元还可支撑位于上方的散热器,降低位于下方的散热器的变形量,从而避免位于下方的散热器损坏。具体地,导热单元包括若干个导热件3,导热件3的数量可根据需要设置,本发明对此不作限定。如图3所示,各导热件3沿进风方向间隔分布,导热件3可固定于第一散热基座11的顶面,且导热件3的侧边与邻近的部件或器件之间存在通风间隙,以使第一散热基座11和第二散热基座21之间形成湍流通道,迎面的气流可沿着导热件3的侧边流动,并在相邻的导热件3之间的间隙中聚集,一方面冷风能够带走更多的第一散热基座11和第二散热基座12的热量,另一方面在压差的作用下气流在相邻的导热件3的间隙内形成扰流,从而在导热件3之间形成一个接一个的湍流,延长了风流动的路径,提高了间隙内的换热系数,避免了边界层的影响,从而提高了整体的散热效率。Preferably, as shown in Figures 2-4, when the first radiator 1 and the second radiator 2 are stacked on top of each other, the heat conduction unit can also support the radiator located above, reducing the deformation of the radiator located below, thereby avoiding Damaged radiator located underneath. Specifically, the heat-conducting unit includes several heat-conducting members 3, and the number of the heat-conducting members 3 can be set as required, which is not limited in the present invention. As shown in FIG. 3 , the heat-conducting members 3 are distributed at intervals along the air intake direction. The heat-conducting members 3 can be fixed on the top surface of the first heat dissipation base 11 , and there is ventilation between the sides of the heat-conducting member 3 and adjacent components or devices. A gap is formed so that a turbulent flow channel is formed between the first heat dissipation base 11 and the second heat dissipation base 21 , and the oncoming air flow can flow along the side of the heat-conducting member 3 and in the gap between the adjacent heat-conducting members 3 On the one hand, the cold air can take away more heat from the first heat dissipation base 11 and the second heat dissipation base 12, and on the other hand, under the action of the pressure difference, the airflow forms a turbulent flow in the gap between the adjacent heat-conducting members 3 , so that one turbulent flow is formed between the heat-conducting members 3, which prolongs the path of wind flow, improves the heat transfer coefficient in the gap, and avoids the influence of the boundary layer, thereby improving the overall heat dissipation efficiency.
优选地,各导热件3沿进风方向的宽度依次增大,如此,靠近进风方向的导热件3的宽 度较小,而远离进风方向的导热件3的宽度则较大,各导热件3与邻近的部件或器件之间的间隙逐渐变小,使得迎面的气流在通过湍流通道时,风速在导热件3与邻近部件或器件之间的间隙时逐渐增大,在相邻的导热件3之间的间隙中形成的湍流也更为剧烈,从而更容易带走位于进风方向末端的导热件3周围的热量,且更多的风量可以通过,提高了散热效率。Preferably, the width of each heat-conducting member 3 along the air inlet direction increases in turn. In this way, the width of the heat-conducting member 3 close to the air-inlet direction is smaller, while the width of the heat-conducting member 3 away from the air-inlet direction is larger. The gap between 3 and adjacent components or devices gradually becomes smaller, so that when the oncoming airflow passes through the turbulent channel, the wind speed gradually increases when the gap between the thermally conductive member 3 and the adjacent components or devices, in the adjacent thermally conductive member. The turbulent flow formed in the gap between 3 is also more intense, so that it is easier to take away the heat around the heat conducting member 3 at the end of the air inlet direction, and more air volume can pass through, improving the heat dissipation efficiency.
在实际应用中,各导热件3的宽度相同时,如图3所示,可设置导热件3的宽度与第一散热鳍片12和第二散热鳍片22的宽度相等,因此导热件3与邻近部件或器件的间隙也为第一散热鳍片12和第二散热鳍片22与邻近部件或器件的间隙,由于安规的要求,第一散热鳍片12和第二散热鳍片22与邻近的部件或器件之间必然存在间隙,从而充分利用了安规的要求即可在导热件3的侧边与邻近的部件或器件之间形成通风间隙,安装时更为省心简单,且避免了通风间隙过大导致风直接流走,浪费风量,或通风间隙过小风不能顺利通过间隙形成湍流;且使得导热件3的两个表面完全贴靠于第一接触鳍片121和第二接触鳍片221,使得第一接触鳍片121和第二接触鳍片221的热量导通,进一步提高了散热效率。In practical applications, when the widths of the heat-conducting members 3 are the same, as shown in FIG. 3 , the width of the heat-conducting members 3 can be set to be equal to the widths of the first heat dissipation fins 12 and the second heat dissipation fins 22 . The gap between adjacent parts or devices is also the gap between the first heat dissipation fin 12 and the second heat dissipation fin 22 and the adjacent parts or devices. Due to the requirements of safety regulations, the first heat dissipation fin 12 and the second heat dissipation fin 22 are adjacent to There must be a gap between the components or devices, so that the ventilation gap can be formed between the side of the heat-conducting component 3 and the adjacent components or devices by making full use of the requirements of the safety regulations. If the ventilation gap is too large, the wind will flow away directly, wasting the air volume, or if the ventilation gap is too small, the wind cannot smoothly pass through the gap to form a turbulent flow; and the two surfaces of the heat conducting member 3 are completely abutted against the first contact fin 121 and the second contact fin The fins 221 make heat conduction between the first contact fin 121 and the second contact fin 221, which further improves the heat dissipation efficiency.
如图4所示,为了降低气流的流阻,各导热件3上靠近进风方向的一端设有导风部31,导风部31的宽度沿进风方向逐渐增大以将迎面的气流导向其两侧;本实施例中,各导热件3上靠近进风方向的一端设有凸出的第一弧面,该第一弧面即形成导风部31,气流通过时更为平滑顺畅,且流阻更小。As shown in FIG. 4 , in order to reduce the flow resistance of the airflow, an air guide portion 31 is provided on one end of each heat conducting member 3 close to the air inlet direction, and the width of the air guide portion 31 gradually increases along the air inlet direction to guide the oncoming airflow. In this embodiment, the end of each heat conducting member 3 close to the air inlet direction is provided with a protruding first arc surface. And the flow resistance is smaller.
如图4所示,本实施例中,各导热件3上远离进风方向的一端还设有聚风部32,聚风部32的宽度沿进风方向逐渐增大,聚风部32有利于气流的聚集,形成强烈的扰流,进一步提高了散热效率,且还有利于节省材料,从而节约了成本;在本实施例中,各导热件3上远离进风方向的一端设有凹陷的第二弧面,该第二弧面即形成聚风部32,第二弧面的设计更有利于气流在弧形的中心聚集。As shown in FIG. 4 , in this embodiment, the end of each heat-conducting member 3 away from the air inlet direction is further provided with an air collecting portion 32 , and the width of the air collecting portion 32 gradually increases along the air inlet direction. The air collecting portion 32 is beneficial to The gathering of the airflow forms a strong turbulence, which further improves the heat dissipation efficiency, and is also conducive to saving materials, thereby saving costs; Two arc surfaces, the second arc surface forms the air collecting portion 32 , and the design of the second arc surface is more conducive to the gathering of the airflow at the center of the arc.
在实际应用中,各导风件放置于第一散热基座11和第二散热基座21的高温区域,如此,高温区域的热量可在第一散热基座11和第二散热基座21上导通,避免了热量过于集中,高温区域可事先通过仿真实验测得,但至少有一个导热件3放置于进风方向的末端,由于第一散热器1或第二散热器2的末端的热量最大,在进风方向的末端处设置导热件3可在末端的高温区域使第一散热器1和第二散热器2的热量导通,可避免末端热量过高。In practical applications, each air guide is placed in the high temperature area of the first heat dissipation base 11 and the second heat dissipation base 21 , so that the heat in the high temperature area can be on the first heat dissipation base 11 and the second heat dissipation base 21 . Conduction to avoid excessive heat concentration, the high temperature area can be measured in advance through simulation experiments, but at least one heat conduction member 3 is placed at the end of the air inlet direction, due to the heat at the end of the first radiator 1 or the second radiator 2 At the most, disposing the heat-conducting member 3 at the end of the air inlet direction can conduct the heat of the first radiator 1 and the second radiator 2 in the high temperature area of the end, which can prevent the heat from being too high at the end.
相应地,本发明还对功率器件的布局作了调整。具体而言,第一功率单元4包括第一功率组件41和第二功率组件42,第一功率组件41和第二功率组件42分别固接于第一散热基座11的两侧;第一功率组件41和第二功率组件42中,一个处于工作状态时,另一个处于休息状态。现有技术中切换工作的第一功率组件41和第二功率组件42一般是分别设置于两个散热器上,当其中一个功率组件工作时,另一个功率组件处于休息状态,使得只有一个散热器在工作,而另一个散热器处于闲置状态,本发明的技术方案将第一功率组件41和第二功率组件42分别固接于第一散热基座11的两侧,使得第一功率组件41和第二功率组件42在切换工作时,第一散热器1始终也处于工作状态,且一侧的功率组件的热量可以向另一侧传递,进一步提高了散热效率,且减少了散热器的数量,节约了成本。Correspondingly, the present invention also adjusts the layout of the power device. Specifically, the first power unit 4 includes a first power assembly 41 and a second power assembly 42, and the first power assembly 41 and the second power assembly 42 are respectively fixed on both sides of the first heat dissipation base 11; When one of the components 41 and the second power component 42 is in a working state, the other is in a resting state. In the prior art, the first power assembly 41 and the second power assembly 42 that switch and work are generally disposed on two radiators, respectively. When one of the power assemblies is working, the other power assembly is in a rest state, so that there is only one radiator. While the other radiator is in an idle state, the technical solution of the present invention fixes the first power component 41 and the second power component 42 on both sides of the first heat dissipation base 11 respectively, so that the first power component 41 and When the second power component 42 is switched to work, the first radiator 1 is always in the working state, and the heat of the power component on one side can be transferred to the other side, which further improves the heat dissipation efficiency and reduces the number of radiators. Cost savings.
应理解,第二功率单元5也可以包括切换工作的第三功率组件和第四功率组件,其中第三功率组件始终与第一功率组件同时工作,当第一功率组件41位于第一散热基座11的左侧时,可以将第四功率组件放置于第二散热基座21的左侧,如此,当第一功率组件41工作时,位于第一功率组件41对角线上的第三功率组件处于工作状态,而与第一功率组件相对的第二功率组件42和第四功率组件处于休息状态,工作状态和休息状态的功率组件完全错开,第一散热器1和第二散热器2的热量不集中,更为均衡。It should be understood that the second power unit 5 may also include a third power assembly and a fourth power assembly that switch and work, wherein the third power assembly always works simultaneously with the first power assembly, and when the first power assembly 41 is located on the first heat dissipation base 11, the fourth power component can be placed on the left side of the second heat dissipation base 21, so that when the first power component 41 is working, the third power component located on the diagonal of the first power component 41 In the working state, the second power assembly 42 and the fourth power assembly opposite the first power assembly are in the resting state, the power assemblies in the working state and the resting state are completely staggered, and the heat of the first radiator 1 and the second radiator 2 Less concentrated, more balanced.
为了进一步提高散热效率,还包括柔性导热片6,柔性导热片6覆盖于第一功率组件41和第二功率组件42与第一散热基座11连接的整个接触面上。柔性导热片6的设置作为第一功率组件41和第二功率组件42与第一散热器1的界面材料进一步提高了导热效率,且柔性导热片6作为柔性品不存在锁裂情况、成本更低,从而在同等成本的条件下提高了导热效率,从而提高了散热器整体的均温性。在本实施例中,柔性导热片6采用石墨烯片,石墨烯片自下而上依次连接有粘结层、石墨烯层和绝缘层,其中粘结层粘结于第一散热基座11的接触面上,绝缘层与第一功率组件41和第二功率组件42接触,由于第一功率组件41和第二功率组件42通过固接件固接于第一散热基座11上,石墨烯片上还设有供固接件穿过的通孔,该通孔与石墨烯片之间由密封胶隔开以防止石墨烯层内的石墨烯粉泄露。In order to further improve the heat dissipation efficiency, a flexible heat-conducting sheet 6 is also included, and the flexible heat-conducting sheet 6 covers the entire contact surface where the first power component 41 and the second power component 42 are connected to the first heat dissipation base 11 . The arrangement of the flexible thermally conductive sheet 6 as the interface material between the first power component 41 and the second power component 42 and the first heat sink 1 further improves the thermal conductivity, and the flexible thermally conductive sheet 6 as a flexible product has no lock cracks and lower cost , thereby improving the thermal conductivity under the condition of the same cost, thereby improving the overall temperature uniformity of the radiator. In this embodiment, the flexible thermal conductive sheet 6 adopts a graphene sheet, and the graphene sheet is sequentially connected with an adhesive layer, a graphene layer and an insulating layer from bottom to top, wherein the adhesive layer is bonded to the first heat dissipation base 11 . On the contact surface, the insulating layer is in contact with the first power component 41 and the second power component 42. Since the first power component 41 and the second power component 42 are fixed on the first heat dissipation base 11 through the fixing member, the graphene sheet is There is also a through hole for the fastener to pass through, and the through hole and the graphene sheet are separated by a sealant to prevent the graphene powder in the graphene layer from leaking.
在实际应用中,第一散热器1和第二散热器2均由相同的工艺制备,第一散热器1和第二散热器2的区别只在于第一散热基座11和第二散热基座21的高度不同,以及第一散热鳍片12和第二散热鳍片22的数量不同,当第一功率单元发热量大于第二功率单元的发热量时,可以设置第一散热基座11的高度大于第二散热基座的高度,如此,第一散热鳍片12的数量也多于第二散热鳍片22的数量,第一散热器1的散热效率相对于第二散热器2的散热效率更高,从而使得第一散热器1和第二散热器2的整体散热效率更为均衡。In practical applications, both the first heat sink 1 and the second heat sink 2 are prepared by the same process, and the difference between the first heat sink 1 and the second heat sink 2 is only the first heat dissipation base 11 and the second heat dissipation base The height of 21 is different, and the number of the first heat dissipation fins 12 and the second heat dissipation fins 22 is different. When the heat generation of the first power unit is greater than the heat generation of the second power unit, the height of the first heat dissipation base 11 can be set is greater than the height of the second heat dissipation base, so that the number of the first heat dissipation fins 12 is also more than the number of the second heat dissipation fins 22, and the heat dissipation efficiency of the first heat sink 1 is higher than that of the second heat sink 2. Therefore, the overall heat dissipation efficiency of the first heat sink 1 and the second heat sink 2 is more balanced.
本发明第一散热基座11和第二散热基座21之间设置导热单元,导热单元使得第一散热器1和第二散热器2的热量导通,提高了第一散热基座11和第二散热基座21之间的换热效率,从而降低了第一散热器1和第二散热器2整体的热阻,避免了第一功率单元4损耗很低,而第二功率单元5损耗很高时,热量不均衡,提高了第一散热基座11上的第一功率单元4和第二散热基座21上的第二功率单元5的均温性,降低了第一功率单元4和第二功率单元5的局部高温点,从而可应对不同的极限工况,且在同等成本的条件下提高了散热效率;在热量传递的过程中,最靠近第一功率单元4的第一散热鳍片12会先收热量,而最远离第一功率单元4的第一散热鳍片12会最后吸收热量,最靠近第二功率单元5的第二散热鳍片22会先吸收热量,而最远离第二功率单元5的第二散热鳍片22会最后吸收热量,导致远离第一功率单元4的第一散热鳍片12和远离第二功率单元5的第二散热鳍片22散热效率低,第一散热基座11、导热单元和第二散热基座21依次叠置后,第一散热基座11和第二散热基座21的热量导通,根据热量由温度高的区域向温度低的区域流动的原理,第一散热基座11和第二散热基座21的热量更为均衡,从而使得第一散热鳍片12和第二散热鳍片22的散热效率也更为均衡;当将第一散热器1和第二散热器2置于电气设备内时,由于第一散热基座11、导热单元第二散热基座21依次叠置,可调整第一散热基座11和第二散热基座21的高度,只要第一散 热基座11和第二散热基座21的高度的总和仍可放置于电气设备内即可,使得第一散热器1和第二散热器2的高度更加灵活,从而使得第一散热器1和第二散热器2可以有不同的散热效率,且叠置的方式减小了散热结构的体积。A heat conduction unit is arranged between the first heat dissipation base 11 and the second heat dissipation base 21 of the present invention. The heat exchange efficiency between the two heat dissipation bases 21 reduces the overall thermal resistance of the first radiator 1 and the second radiator 2, and prevents the first power unit 4 from losing very little while the second power unit 5 loses a lot. When the temperature is high, the heat is unbalanced, which improves the temperature uniformity of the first power unit 4 on the first heat dissipation base 11 and the second power unit 5 on the second heat dissipation base 21, and reduces the temperature of the first power unit 4 and the second power unit 5 on the second heat dissipation base 21. The local high temperature points of the two power units 5 can cope with different extreme working conditions and improve the heat dissipation efficiency under the same cost condition; in the process of heat transfer, the first heat dissipation fin closest to the first power unit 4 12 will absorb heat first, and the first heat dissipation fins 12 farthest from the first power unit 4 will absorb heat last, and the second heat dissipation fins 22 closest to the second power unit 5 will absorb heat first, and the second heat dissipation fins farthest away from the second power unit 5 will absorb heat first. The second heat dissipation fins 22 of the power unit 5 will eventually absorb heat, resulting in low heat dissipation efficiency of the first heat dissipation fins 12 away from the first power unit 4 and the second heat dissipation fins 22 away from the second power unit 5, and the first heat dissipation After the base 11, the heat conduction unit and the second heat dissipation base 21 are stacked in sequence, the heat of the first heat dissipation base 11 and the second heat dissipation base 21 is conducted, and the heat flows from the area with high temperature to the area with low temperature. In principle, the heat of the first heat dissipation base 11 and the second heat dissipation base 21 is more balanced, so that the heat dissipation efficiency of the first heat dissipation fin 12 and the second heat dissipation fin 22 is also more balanced; When the 1 and the second heat sink 2 are placed in the electrical equipment, since the first heat dissipation base 11 and the second heat dissipation base 21 of the heat conduction unit are stacked in sequence, the distance between the first heat dissipation base 11 and the second heat dissipation base 21 can be adjusted. height, as long as the sum of the heights of the first heat dissipation base 11 and the second heat dissipation base 21 can still be placed in the electrical equipment, so that the heights of the first heat sink 1 and the second heat sink 2 are more flexible, so that the first heat sink 1 and the second heat sink 2 are more flexible. The first heat sink 1 and the second heat sink 2 can have different heat dissipation efficiencies, and the overlapping manner reduces the volume of the heat dissipation structure.
如图5-9所示,本发明同时公开一种功率模块,包括机箱(图中未示出)、第一电路板7、第二电路板8、上述的散热结构、第一功率单元4、第二功率单元5、第三功率单元9、第四功率单元10、送风单元110和若干个隔板120。As shown in Figures 5-9, the present invention also discloses a power module, comprising a chassis (not shown in the figure), a first circuit board 7, a second circuit board 8, the above-mentioned heat dissipation structure, a first power unit 4, The second power unit 5 , the third power unit 9 , the fourth power unit 10 , the air supply unit 110 and several partitions 120 .
第一电路板7和第二电路板8设于机箱内,其中第一电路板7位于机箱的顶部,第二电路板8位于第一电路板7下方,第二电路板8与第一电路板7平行,第一电路板7上设有至少两个第一功率单元4和至少两个第三功率单元9,第二电路板8上设有与各第一功率单元4相向设置的至少两个第二功率单元5和与各第三功率单元9相向设置的第四功率单元10。其中,每一第三功率单元9的发热量小于每一第一功率单元4的发热量,每一第四功率单元10的发热量小于每一第二功率单元5的发热量。The first circuit board 7 and the second circuit board 8 are arranged in the chassis, wherein the first circuit board 7 is located on the top of the chassis, the second circuit board 8 is located under the first circuit board 7, and the second circuit board 8 is connected to the first circuit board. 7 parallel, the first circuit board 7 is provided with at least two first power units 4 and at least two third power units 9, and the second circuit board 8 is provided with at least two opposite first power units 4. The second power unit 5 and the fourth power unit 10 are arranged opposite each of the third power units 9 . The calorific value of each third power unit 9 is smaller than the calorific value of each first power unit 4 , and the calorific value of each fourth power unit 10 is smaller than the calorific value of each second power unit 5 .
第一散热基座11的顶面固接于第一电路板7的底面,第二散热基座21的底面固接于第二电路板8的顶面。The top surface of the first heat dissipation base 11 is fixed to the bottom surface of the first circuit board 7 , and the bottom surface of the second heat dissipation base 21 is fixed to the top surface of the second circuit board 8 .
第一功率单元4还于第一电路板7和顶层的第一散热鳍片12之间固接于第一散热基座11的两侧,具体而言,第一功率组件41和第二功率组件42分别固接于第一散热基座11的两侧。The first power unit 4 is also fixed on both sides of the first heat dissipation base 11 between the first circuit board 7 and the first heat dissipation fins 12 on the top layer. Specifically, the first power component 41 and the second power component 42 are respectively fixed on both sides of the first heat dissipation base 11 .
第二功率单元5还于第二电路板8和的底层的第二散热鳍片22之间固接于第二散热基座21的两侧。The second power unit 5 is also fixed on both sides of the second heat dissipation base 21 between the second circuit board 8 and the second heat dissipation fins 22 of the bottom layer.
优选地,如图9所示,若干隔板120设于机箱内并将机箱分割成至少两个独立的散热区,具体而言,各隔板垂直连接第一电路板7和第二电路板8,以将第一电路板7和第二电路板8之间的区域沿左右方向分隔成至少两个独立的散热区,各散热器沿机箱的左右方向排布,送风单元110包括与各散热区对应的至少两个风机,风机用于为散热区内送风,本实施例中,隔板120的数量为2个,散热区的数量均为3个,满足了功率模块大功率和大容量的设计要求。其中,风机所在的一端为机箱的进风端。Preferably, as shown in FIG. 9 , a plurality of partitions 120 are arranged in the chassis and divide the chassis into at least two independent heat dissipation areas. Specifically, each partition is vertically connected to the first circuit board 7 and the second circuit board 8 , so as to divide the area between the first circuit board 7 and the second circuit board 8 into at least two independent heat dissipation areas along the left and right directions, each radiator is arranged along the left and right direction of the chassis, and the air supply unit 110 includes and each heat dissipation area. There are at least two fans corresponding to the heat dissipation area, and the fans are used to supply air to the heat dissipation area. In this embodiment, the number of partitions 120 is two, and the number of heat dissipation areas is three, which satisfies the high power and large capacity of the power module. design requirements. The end where the fan is located is the air inlet end of the chassis.
在本实施例中,每个散热区均包括两个第一散热器1、两个第二散热器2及一第三功率单元9和第四功率单元10;其中两个第一散热器1分别位于第三功率单元9的两侧,两个第二散热器2分别位于第四功率单元10的两侧,第一散热鳍片12和第三功率单元9存在安规间隙,第二散热鳍片22和第四功率单元10存在安规间隙,该安规间隙即构成导热件3和第三功率单元9或第四功率单元10之间的通风间隙;在本实施中,位于最右侧的散热区包括两个第三功率单元9、两个第四功率单元10、两个第一散热器1和两个第二散热器2,第三功率单元9和第一散热器1间隔设置,第四功率单元10和第二散热器2间隔设置,相邻的第一散热鳍片12之间形成第一散热通道,相邻的第二散热鳍片22之间形成第二散热通道,第一散热基座11和第二散热基座21之间形成湍流通道,第一散热通道、第二散热通道和湍流通 道之间连通,送风单元110输送的风顺流通过多个第一散热通道、第二散热通道和湍流通道。In this embodiment, each heat dissipation area includes two first heat sinks 1, two second heat sinks 2, and a third power unit 9 and a fourth power unit 10; wherein the two first heat sinks 1 are respectively Located on both sides of the third power unit 9, the two second heat sinks 2 are respectively located on both sides of the fourth power unit 10, the first heat dissipation fins 12 and the third power unit 9 have a safety gap, and the second heat dissipation fins 22 and the fourth power unit 10 have a safety gap, and the safety gap constitutes a ventilation gap between the heat-conducting member 3 and the third power unit 9 or the fourth power unit 10; The area includes two third power units 9, two fourth power units 10, two first radiators 1 and two second radiators 2, the third power unit 9 and the first radiator 1 are spaced apart, and the fourth The power unit 10 and the second heat sink 2 are arranged at intervals, a first heat dissipation channel is formed between the adjacent first heat dissipation fins 12, a second heat dissipation channel is formed between the adjacent second heat dissipation fins 22, and the first heat dissipation base A turbulent flow channel is formed between the seat 11 and the second heat dissipation base 21, the first heat dissipation channel, the second heat dissipation channel and the turbulent flow channel are communicated, and the wind delivered by the air supply unit 110 flows downstream through the plurality of first heat dissipation channels, second heat dissipation channels, and second heat dissipation channels. Cooling channels and turbulent channels.
其中,风机向第一散热器1和第二散热器2输送的风量大于其向第三功率单元9和第四功率单元10输送的风量,在实际应用中,在最左侧和中间的散热区中,风机的转轴的轴线正对第三功率单元9和第四功率单元10,由于风机工作是通过叶片向外或向内甩风,与风机的转轴对齐的位置是风量最小的地方,因此令风机的转轴的轴线正对第三功率单元9和第四功率单元10,可使得风机的叶片的大部分对着第一散热器1和第二散热器2,从而使得风机向第一散热器1和第二散热器2输送的风量大于其向第三功率单元9和第四功率单元10输送的风量;在最右侧的散热区中,风机的转轴的轴线正对位于左侧的第三功率单元9和第四功率单元10,位于右侧的第三功率单元9和第四功率单元10因此也位于风机叶片的区域内。Among them, the air volume delivered by the fan to the first radiator 1 and the second radiator 2 is greater than the air volume delivered to the third power unit 9 and the fourth power unit 10. In practical applications, in the leftmost and middle heat dissipation areas Among them, the axis of the rotating shaft of the fan is facing the third power unit 9 and the fourth power unit 10. Since the fan works by throwing the wind outward or inward through the blades, the position aligned with the rotating shaft of the fan is the place where the air volume is the smallest, so let The axis of the rotating shaft of the fan is facing the third power unit 9 and the fourth power unit 10, so that most of the blades of the fan face the first radiator 1 and the second radiator 2, so that the fan faces the first radiator 1 The air volume delivered by the second radiator 2 is greater than the air volume delivered to the third power unit 9 and the fourth power unit 10; in the heat dissipation area on the far right, the axis of the rotating shaft of the fan is facing the third power unit located on the left. The unit 9 and the fourth power unit 10, the third power unit 9 and the fourth power unit 10 on the right are therefore also located in the area of the fan blades.
第一功率单元4发出的热量通过第一散热基座11传递至第一散热鳍片12,第一散热鳍片12吸收热量,热量传递至第一散热风道后被送风单元110输送的风吹出机箱,第二功率单元5发出的热量通过第二散热基座21传递至第二散热鳍片22,第二散热鳍片22吸收热量,热量传递至第二散热风道后被送风单元110输送的风吹出机箱。The heat emitted by the first power unit 4 is transferred to the first heat dissipation fins 12 through the first heat dissipation base 11 , the first heat dissipation fins 12 absorb the heat, and the heat is transferred to the first heat dissipation air duct and then is conveyed by the air supply unit 110 . When the chassis is blown out, the heat emitted by the second power unit 5 is transferred to the second heat dissipation fins 22 through the second heat dissipation base 21 , the second heat dissipation fins 22 absorb the heat, and the heat is transferred to the second heat dissipation air duct and then sent to the air supply unit 110 The delivered wind blows out of the chassis.
具体地,第一散热基座11和第二散热基座21为柱状结构,可为圆柱,也可谓矩形柱,进风方向即第一散热基座11和第二散热基座21的长度方向,在热量传递的过程中,最靠近第一功率单元4的第一散热鳍片12会先收热量,而最远离第一功率单元4的第一散热鳍片12会最后吸收热量,最靠近第二功率单元5的第二散热鳍片22会先吸收热量,而最远离第二功率单元5的第二散热鳍片22会最后吸收热量,导致远离第一功率单元4的第一散热鳍片12和远离第二功率单元5的第二散热鳍片22散热效率低,第一散热基座11和第二散热基座21之间设置导热单元后,第一散热基座11和第二散热基座21的热量导通,根据热量由温度高的区域向温度低的区域流动的原理,第一散热基座11和第二散热基座21的热量更为均衡,从而使得第一散热鳍片12和第二散热鳍片22的散热效率也更为均衡。Specifically, the first heat dissipation base 11 and the second heat dissipation base 21 have a columnar structure, which can be a cylinder or a rectangular column, and the air intake direction is the length direction of the first heat dissipation base 11 and the second heat dissipation base 21, In the process of heat transfer, the first heat dissipation fins 12 closest to the first power unit 4 will absorb heat first, while the first heat dissipation fins 12 farthest from the first power unit 4 will absorb heat last, and the first heat dissipation fins 12 closest to the second power unit 4 will absorb heat last. The second heat dissipation fins 22 of the power unit 5 will absorb heat first, and the second heat dissipation fins 22 farthest from the second power unit 5 will absorb heat last, resulting in the first heat dissipation fins 12 and The heat dissipation efficiency of the second heat dissipation fins 22 away from the second power unit 5 is low. According to the principle that the heat flows from the high temperature area to the low temperature area, the heat of the first heat dissipation base 11 and the second heat dissipation base 21 is more balanced, so that the first heat dissipation fin 12 and the second heat dissipation base 21 are more balanced. The heat dissipation efficiency of the two heat dissipation fins 22 is also more balanced.
由于导热件3的设置,风在流动过程中经过湍流通道、第一散热通道和第二散热通道,导热件3的导风部31具有很强的扰流性和破风膜能力,聚风部32有利于气流的聚集,形成强烈的扰流,从而在导热件3之间的间隙中形成一个接一个的湍流,大大提高了底层的第一散热鳍片12和顶层的第二散热鳍片22的换热效率,即大大提高了第一接触鳍片121和第二接触鳍片221的换热效率。Due to the arrangement of the heat-conducting member 3, the wind passes through the turbulent flow channel, the first heat-dissipating channel and the second heat-dissipating channel during the flow process. 32 is conducive to the concentration of air flow, forming a strong turbulence, thereby forming one after another turbulent flow in the gap between the heat-conducting members 3, which greatly improves the first cooling fins 12 on the bottom layer and the second cooling fins 22 on the top layer. The heat exchange efficiency is greatly improved, that is, the heat exchange efficiency of the first contact fins 121 and the second contact fins 221 is greatly improved.
在实际应用中,如图6所示,第三功率单元9位于第四功率单元10的正上方。In practical applications, as shown in FIG. 6 , the third power unit 9 is located directly above the fourth power unit 10 .
作为一种具体的实施方式,第一电路板7可为整流电路板,第二电路板8为逆变电路板,第三功率单元9和第四功率单元10为电容,第一功率组件41为整流电路中的功率器件,第二功率组件42为升压电路中的功率器件。As a specific implementation manner, the first circuit board 7 can be a rectifier circuit board, the second circuit board 8 can be an inverter circuit board, the third power unit 9 and the fourth power unit 10 are capacitors, and the first power component 41 is A power device in a rectifier circuit, and the second power component 42 is a power device in a boost circuit.
本发明的功率模块采用上述散热结构,发热量高的功率单元、第一散热器1和第二散热器2位于送风单元110的强风区域,使得第一散热器1和第二散热器2上的热量可及时散出;第一散热器1、导热单元和第二散热器2依次叠置导通了第一散热器1和第二散热器2的热 量,在第一散热基座11和第二散热基座21的高温区域和进风方向的末端区域均放置导热件3使得第一散热器1和第二散热器2的导热效率更高,温度更为均衡,第一散热器1和第二散热器2整体的热阻降低,提高了第一散热基座11上的第一功率单元4和第二散热基座21上的第二功率单元5的均温性,降低第一功率单元4和第二功率单元5的局部高温点,从而可应对不同的极限工况,同时各导热件3间隔设置以及导热件3形状的设置使得第一散热基座11和第二散热基座21之间形成湍流,增强了散热效率;切换工作的第一功率组件41和第二功率组件41分别设于第一散热基座11的两侧,并将石墨烯片6设置为第一功率组件41和第二功率组件42与第一散热器1的界面材料进一步提高了导热效率;且第一散热鳍片12和第二散热鳍片22的结构设置使得其散热效率更为均衡,从而在同等成本的条件下提高了散热效率;且第一散热器1和第二散热器2的高度可调节,更为灵活,体积小,适用范围更为广泛。The power module of the present invention adopts the above-mentioned heat dissipation structure. The power unit with high heat generation, the first radiator 1 and the second radiator 2 are located in the strong wind area of the air supply unit 110, so that the first radiator 1 and the second radiator 2 are on the strong wind area. The heat can be dissipated in time; the first radiator 1, the heat conduction unit and the second radiator 2 are stacked in sequence to conduct the heat of the first radiator 1 and the second radiator 2. Both the high temperature area of the second heat dissipation base 21 and the end area of the air inlet direction are placed with the heat conduction member 3, so that the heat conduction efficiency of the first heat sink 1 and the second heat sink 2 is higher, and the temperature is more balanced. The overall thermal resistance of the two heat sinks 2 is reduced, the temperature uniformity of the first power unit 4 on the first heat dissipation base 11 and the second power unit 5 on the second heat dissipation base 21 is improved, and the first power unit 4 is reduced. and the local high temperature point of the second power unit 5, so that different extreme working conditions can be dealt with. At the same time, the spaced arrangement of each heat-conducting member 3 and the setting of the shape of the heat-conducting member 3 make the space between the first heat dissipation base 11 and the second heat dissipation base 21 The turbulent flow is formed and the heat dissipation efficiency is enhanced; the first power assembly 41 and the second power assembly 41 for switching work are respectively arranged on both sides of the first heat dissipation base 11, and the graphene sheet 6 is arranged as the first power assembly 41 and the second power assembly 41. The interface material between the two power components 42 and the first heat sink 1 further improves the heat conduction efficiency; and the structural arrangement of the first heat dissipation fins 12 and the second heat dissipation fins 22 makes the heat dissipation efficiency more balanced, so that under the same cost conditions The heat dissipation efficiency is improved; and the heights of the first radiator 1 and the second radiator 2 can be adjusted, which are more flexible, small in size, and wider in scope.
上述说明书和实施例的描述,用于解释本发明保护范围,但并不构成对本发明保护范围的限定。通过本发明或上述实施例的启示,本领域普通技术人员结合公知常识、本领域的普通技术知识和/或现有技术,通过合乎逻辑的分析、推理或有限的试验可以得到的对本发明实施例或其中一部分技术特征的修改、等同替换或其他改进,均应包含在本发明的保护范围之内。The descriptions of the above specification and embodiments are used to explain the protection scope of the present invention, but do not constitute a limitation on the protection scope of the present invention. With the inspiration of the present invention or the above-mentioned embodiments, those of ordinary skill in the art can obtain the embodiments of the present invention through logical analysis, reasoning or limited experiments in combination with common knowledge, common technical knowledge in the field and/or prior art. Modifications, equivalent replacements or other improvements of or some of the technical features shall be included within the protection scope of the present invention.

Claims (10)

  1. 一种散热结构,其特征在于:包括A heat dissipation structure is characterized in that: comprising:
    第一散热器,其用于为第一功率单元散热,其上设有带第一散热鳍片的第一散热基座;a first radiator, which is used to dissipate heat for the first power unit, and is provided with a first heat dissipation base with first heat dissipation fins;
    第二散热器,其相对第一散热器设置,用于为第二功率单元散热,其上设有带第二散热鳍片的第二散热基座;和a second heat sink, disposed opposite the first heat sink, for dissipating heat for the second power unit, and a second heat dissipation base with second heat dissipation fins thereon; and
    导热单元,其上两个彼此背离且平行的表面分别贴靠第一散热基座和第二散热基座相对的端面,并用于在第一散热器和第二散热器之间传导热量。The heat-conducting unit has two surfaces facing away from each other and parallel to the opposite end faces of the first heat dissipation base and the second heat dissipation base respectively, and is used for conducting heat between the first heat sink and the second heat sink.
  2. 如权利要求1所述的一种散热结构,其特征在于:所述第一散热鳍片包括第一接触鳍片,所述第二散热鳍片包括第二接触鳍片,所述导热单元与第一接触鳍片和第二接触鳍片均接触;The heat dissipation structure of claim 1, wherein the first heat dissipation fin includes a first contact fin, the second heat dissipation fin includes a second contact fin, and the heat conduction unit is connected to the first contact fin. A contact fin and a second contact fin are both in contact;
    所述导热单元包括至少两个导热件,各导热件沿进风方向间隔分布,且所述导热件的侧边与邻近的部件或器件之间存在通风间隙,以使所述第一散热基座的端面和第二散热基座的端面之间形成湍流通道。The heat-conducting unit includes at least two heat-conducting parts, each heat-conducting part is spaced apart along the air intake direction, and there is a ventilation gap between the side of the heat-conducting part and the adjacent parts or devices, so that the first heat dissipation base A turbulent flow channel is formed between the end face of the second heat dissipation base and the end face of the second heat dissipation base.
  3. 如权利要求2所述的一种散热结构,其特征在于:各导热件上靠近进风方向的一端设有导风部,所述导风部的宽度沿进风方向逐渐增大以将迎面的气流导向其两侧。A heat dissipation structure as claimed in claim 2, characterized in that: each heat conducting member is provided with an air guide portion at one end close to the air inlet direction, and the width of the air guide portion gradually increases along the air inlet direction so as to reduce the oncoming air. Air flow is directed to its sides.
  4. 如权利要求2所述的一种散热结构,其特征在于:各导热件上远离进风方向的一端设有聚风部,所述聚风部的宽度沿进风方向逐渐增大。The heat dissipation structure according to claim 2, wherein the end of each heat-conducting member away from the air inlet direction is provided with an air collecting portion, and the width of the air collecting portion gradually increases along the air inlet direction.
  5. 如权利要求1所述的一种散热结构,其特征在于:所述第一功率单元和第二功率单元的发热量不同,所述第一散热器和第二散热器的区别在于第一散热基座和第二散热基座的高度不同,第一散热鳍片的数量和第二散热鳍片的数量不同。The heat dissipation structure of claim 1, wherein the first power unit and the second power unit have different calorific values, and the difference between the first heat sink and the second heat sink lies in the first heat dissipation base The heights of the seat and the second heat dissipation base are different, and the number of the first heat dissipation fins and the number of the second heat dissipation fins are different.
  6. 如权利要求1所述的一种散热结构,其特征在于:所述第一功率单元包括第一功率组件和第二功率组件,所述第一功率组件和第二功率组件分别连接于第一散热基座的两侧;所述第一功率组件和第二功率组件中,一个处于工作状态时,另一个处于休息状态。The heat dissipation structure according to claim 1, wherein the first power unit includes a first power component and a second power component, and the first power component and the second power component are respectively connected to the first heat sink Two sides of the base; among the first power assembly and the second power assembly, when one is in a working state, the other is in a resting state.
  7. 如权利要求6所述的一种散热结构,其特征在于:还包括柔性导热片,所述柔性导热片覆盖于第一功率组件和第二功率组件与第一散热基座连接的整个接触面上。The heat dissipation structure according to claim 6, further comprising a flexible heat-conducting sheet, the flexible heat-conducting sheet covering the entire contact surface of the first power assembly and the second power assembly connected to the first heat dissipation base .
  8. 一种功率模块,其特征在于:包括A power module is characterized in that: comprising:
    第一电路板,其设有第一功率单元;a first circuit board, which is provided with a first power unit;
    第二电路板,其平行于第一电路板并设有与第一功率单元相向设置的第二功率单元;和a second circuit board parallel to the first circuit board and provided with a second power unit disposed opposite the first power unit; and
    如权利要求1-7中任一项所述的散热结构,第一功率单元和第二功率单元分别固接于第一散热基座和第二散热基座上。The heat dissipation structure according to any one of claims 1-7, wherein the first power unit and the second power unit are respectively fixed on the first heat dissipation base and the second heat dissipation base.
  9. 如权利要求8所述的一种功率模块,其特征在于:还包括送风单元;The power module of claim 8, further comprising an air supply unit;
    所述第一电路板上还设有第三功率单元,所述第三功率单元的发热量小于第一功率单元的发热量;A third power unit is further provided on the first circuit board, and the calorific value of the third power unit is smaller than the calorific value of the first power unit;
    所述第二电路板上还设有与第三功率单元相向设置的第四功率单元,所述第四功率单元的发热量小于第二功率单元的发热量;The second circuit board is further provided with a fourth power unit opposite to the third power unit, and the calorific value of the fourth power unit is smaller than the calorific value of the second power unit;
    送风单元向第一散热器和第二散热器输送的风量大于其向第三功率单元和第四功率单元输送的风量。The air volume delivered by the air supply unit to the first radiator and the second radiator is greater than the air volume delivered to the third power unit and the fourth power unit.
  10. 如权利要求9所述的一种功率模块,其特征在于:还包括隔板,所述隔板垂直连接第一电路板和第二电路板,以将第一电路板和第二电路板之间的区域分隔成至少两个独立的散热区,每个散热区均配置有两个第一散热器、两个第二散热器及一第三功率单元和一第四功率单元;其中两个第一散热器分别位于第三功率单元的两侧,两个第二散热器分别位于第四功率单元的两侧。The power module according to claim 9, further comprising a spacer, the spacer vertically connecting the first circuit board and the second circuit board, so as to separate the space between the first circuit board and the second circuit board The area is divided into at least two independent heat dissipation areas, and each heat dissipation area is equipped with two first radiators, two second radiators, a third power unit and a fourth power unit; The radiators are respectively located on both sides of the third power unit, and the two second radiators are respectively located on both sides of the fourth power unit.
PCT/CN2020/129299 2020-06-30 2020-11-17 Heat dissipation structure and power module WO2022000940A1 (en)

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