WO2021258661A1 - Light-emitting assembly and optical module - Google Patents

Light-emitting assembly and optical module Download PDF

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Publication number
WO2021258661A1
WO2021258661A1 PCT/CN2020/135495 CN2020135495W WO2021258661A1 WO 2021258661 A1 WO2021258661 A1 WO 2021258661A1 CN 2020135495 W CN2020135495 W CN 2020135495W WO 2021258661 A1 WO2021258661 A1 WO 2021258661A1
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WO
WIPO (PCT)
Prior art keywords
optical fiber
optical
chip
backlight
laser
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PCT/CN2020/135495
Other languages
French (fr)
Chinese (zh)
Inventor
刘弘扬
朱虎
杜书剑
郭燕玲
周日凯
付永安
Original Assignee
武汉光迅科技股份有限公司
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Publication of WO2021258661A1 publication Critical patent/WO2021258661A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G02B6/4208—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]

Definitions

  • This application relates to the field of optoelectronic device packaging, in particular to a light emitting component and an optical module.
  • the embodiments of the present application expect to provide a light emitting assembly and an optical module, which can save space.
  • a light emitting component includes: a substrate; a sealing cover plate; the sealing cover plate is arranged on the substrate to form a closed cavity; a laser contained in the closed cavity; the laser includes a laser chip And a substrate arranged on the substrate, the laser chip is arranged on the substrate; a lens accommodated in the enclosed cavity; an arrayed waveguide grating chip accommodated in the enclosed cavity, the arrayed waveguide grating chip It includes a waveguide input end and a front optical waveguide output end, the waveguide input end, the lens, and the laser are optically coupled and connected; and a pin assembly including an optical fiber array head, a first optical fiber, and an in-line optical fiber The optical fiber array head is optically coupled to the output end of the front optical waveguide through the sealing cover plate, and the optical fiber array head and the in-line optical isolator pass through the first optical fiber.
  • Optical fiber coupling connection, the in-line optical isolator and the adapter assembly are coupled and connected through the second optical fiber; the in-
  • the online optical isolator includes a left collimator, a left wedge sheet, a magnetic ring, a Faraday rotator, a right wedge sheet, a right collimator, and a glass sleeve; the left wedge sheet, a The Faraday rotator and the right wedge are sequentially arranged in the magnetic ring; the left collimator, the magnetic ring, and the right collimator are sequentially sleeved in the glass sleeve, and the optical fiber The array head and the left collimator are coupled and connected through the first optical fiber.
  • the adapter assembly includes a fiber optic adapter, a ceramic ferrule, a ceramic sleeve, and a metal ring.
  • the metal ring and the ceramic sleeve are sequentially sleeved in the fiber optic adapter
  • the ceramic ferrule passes through the metal ring and extends into the ceramic sleeve, and the ceramic ferrule is coupled to the right collimator through the second optical fiber.
  • the optical fiber array head includes an upper cover plate, a lower base plate, and a fixing part.
  • a V-shaped groove is formed on the lower base plate, the upper cover plate covers the V-shaped groove, and the fixing part is arranged on the The V-shaped groove is used to fix the end of the first optical fiber extending into the V-shaped groove.
  • first optical fiber and/or the second optical fiber adopt a coiling process.
  • the light emitting assembly includes a first backlight chip accommodated in the enclosed cavity, the arrayed waveguide grating chip includes a backlight waveguide output end, and the first backlight chip is optically coupled to the backlight waveguide output end .
  • the number of the laser chips, the number of the waveguide input ends, and the number of the backlight waveguide output ends are equal.
  • the backlight waveguide output end and the front optical waveguide output end are both arranged on the side of the arrayed waveguide grating chip away from the laser; the waveguide input end is arranged on the arrayed waveguide grating chip close to the On one side of the laser, the first backlight chip is arranged on the side of the enclosed cavity away from the laser.
  • the light emitting assembly includes a second backlight chip contained in the enclosed cavity, the laser chip includes a backlight output terminal, and the second backlight chip is optically coupled to the backlight output terminal.
  • An optical module includes: a printed circuit board assembly, a light receiving assembly, and the above-mentioned light emitting assembly.
  • the light emitting assembly and the light receiving assembly are arranged on the printed circuit board assembly.
  • the light emitting component and the optical module are arranged outside the enclosed cavity by the in-line optical isolator and connected by optical fibers in the form of pin components to reduce the overall volume; the space in the enclosed cavity can be used to arrange other key components , Provides more layout space for the circuit design, and reduces the optical coupling difficulty of the laser, lens and the arrayed waveguide grating chip in the enclosed cavity, and the process difficulty is reduced.
  • the front optical waveguide output end of the arrayed waveguide grating chip and the adapter assembly are connected through the optical fiber array head. Compared with the laser welding technology of the front optical waveguide output end and the adapter assembly in the prior art, the optical power shift after welding is avoided. Problem, reducing manufacturing costs.
  • FIG. 1 is a schematic structural diagram of a light emitting component according to an embodiment of the application
  • Figure 2 is a top view of Figure 1, in which the sealing cover is omitted;
  • FIG. 3 is a schematic structural diagram of a pin assembly according to an embodiment of the application.
  • FIG. 4 is a schematic cross-sectional view of an optical fiber array head according to an embodiment of the application.
  • FIG. 5 is a schematic diagram of the internal structure of an online optical isolator according to an embodiment of the application.
  • FIG. 6 is a schematic diagram of the internal structure of an adapter assembly according to an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of an arrayed waveguide grating chip according to an embodiment of the application.
  • Fig. 8 is a view from the direction A of Fig. 7;
  • FIG. 9 is a schematic structural diagram of a light emitting component according to another embodiment of the application, in which the sealing cover plate is omitted.
  • orientation or positional relationship of "up”, “down”, “left”, “right”, “front”, and “rear” is based on the orientation or positional relationship shown in FIG. It is understood that these terms of orientation are only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a reference to this application. limit.
  • a light emitting assembly includes a substrate 2, a sealing cover 7, a laser 1, a lens 3, an arrayed waveguide grating chip 5, and a pin assembly 6.
  • the material of the substrate 2 is aluminum nitride or tungsten copper alloy, which is used to conduct heat and fix other components.
  • the sealing cover 7 is arranged on the substrate 2 to form a closed cavity 71; the closed cavity 71 is used to accommodate other component structures, and has a protection and dustproof effect.
  • the laser 1 is contained in a closed cavity 71; the laser 1 includes a laser chip 11 and a substrate 12 arranged on a substrate 2.
  • the substrate 12 can be fixed to the substrate 2 with conductive silver glue, and the laser chip 11 is used to emit light of a specified wavelength.
  • the laser chip 11 is arranged on the substrate 12; the number of the laser chip 11 is one or more.
  • the types of laser chips 11 include but are not limited to DFB chips, FB chips, VCSEL chips, and EML chips; wavelength types include, but are not limited to, 850 nm, 1310 nm, and 1550 nm.
  • the lens 3 is accommodated in the enclosed cavity 71; the material of the lens 3 is glass or silicon; the lens 3 is arranged on the substrate 2 to diverge or condense the light signal; and the substrate 2 can be provided with a positioning groove at a position corresponding to the lens 3 (Not marked) to facilitate the insertion and positioning of the lens 3.
  • the arrayed waveguide grating chip 5 is accommodated in the enclosed cavity 71, and the arrayed waveguide grating chip 5 can be attached to the substrate 2 through conductive silver glue to realize heat dissipation through the substrate 2 in the working state.
  • the arrayed waveguide grating chip 5 includes a waveguide input terminal 51 and a front optical waveguide output terminal 52, and the waveguide input terminal 51, the lens 3 and the laser 1 are optically coupled and connected. Specifically, the optical signal emitted by the laser chip 11 enters the arrayed waveguide grating chip 5 from the waveguide input end 51 after passing through the lens 3 and is processed.
  • the pin assembly 6 includes an optical fiber array head 61, a first optical fiber 62, an in-line optical isolator 63, an adapter assembly 64 and a second optical fiber 65.
  • the optical fiber array head 61 passes through the sealing cover 7 and is optically coupled to the front optical waveguide output terminal 52. After the optical signal emitted by the laser 1 is processed by the arrayed waveguide grating chip 5, most of the optical signal is output from the front optical waveguide output terminal 52 into the optical fiber Array head 61; the optical fiber array head 61 and the in-line optical isolator 63 are coupled and connected through the first optical fiber 62.
  • the in-line optical isolator 63 allows the optical signal from the side of the optical fiber array head 61 to pass through, preventing external optical signals from entering the arrayed waveguide grating
  • the chip 5 interferes; the online optical isolator 63 and the adapter assembly 64 are coupled and connected through the second optical fiber 65; the optical signal enters the optical fiber array head 61 and then passes through the online optical isolator 63 and then passes from the adapter assembly 64 to the subsequent device processing .
  • the first optical fiber 62 and the second optical fiber 65 are optical fibers with a protective layer, and their lengths can be flexibly designed according to the actual requirements of the optical device.
  • the overall volume is reduced; the space in the enclosed cavity 71 can be used to arrange other key components
  • This provides a larger layout space for the circuit design, reduces the optical coupling difficulty of the laser 1, the lens 3 and the arrayed waveguide grating chip 5 in the enclosed cavity 71, and reduces the process difficulty.
  • the front optical waveguide output end 52 of the arrayed waveguide grating chip 5 and the adapter assembly 64 are connected through the optical fiber array head 61. Compared with the laser welding technology of the front optical waveguide output end 52 and the adapter assembly 64 in the prior art, welding is avoided. The problem of the deviation of the rear optical power reduces the manufacturing cost.
  • the in-line optical isolator 63 includes a left collimator 631, a left wedge piece 632, a magnetic ring 633, a Faraday rotator 634, and a right wedge Angle piece 635, right collimator 636, and glass sleeve 637.
  • the left wedge plate 632, the Faraday rotator 634, and the right wedge plate 635 are sequentially arranged in the magnetic ring 633; the Faraday rotator 634 has non-reciprocity and can effectively isolate and suppress the optical signal of the echo reflection.
  • connection method may be glue.
  • the optical fiber array head 61 and the left collimator 631 are coupled and connected by the first optical fiber 62, and the connection part can be fixed and buffered with soft glue to prevent damage during daily use.
  • the adapter assembly 64 includes an optical fiber adapter 641, a ceramic ferrule 642, a ceramic sleeve 643 and a metal ring 644.
  • the metal ring 644 and the ceramic sleeve 643 are sequentially sleeved in the fiber optic adapter 641.
  • the fiber optic adapter 641 can be made of metal, and the fiber optic adapter 641 and the metal ring 644 can be connected by interference fit or glued. catch.
  • the ceramic ferrule 642 passes through the metal ring 644 and extends into the ceramic sleeve 643 to complete the fixation.
  • the ceramic ferrule 642 and the right collimator 636 are coupled and connected through the second optical fiber 65.
  • the connection part can be fixed and buffered with soft glue to prevent Damaged in daily use.
  • the ceramic ferrule 642 may be a single-mode ferrule or a multi-mode ferrule, so the corresponding second optical fiber 65 may be a single-mode fiber or a multi-mode fiber.
  • the specific model needs to be configured according to the use requirements of the optical device.
  • the optical fiber array head 61 includes an upper cover 611, a lower base 614, and a fixing portion 612.
  • the upper cover 611 and the lower base 614 can be made of glass.
  • a V-shaped groove 614a is formed on the lower bottom plate 614 to facilitate the second optical fiber 65 extending into the end of the ceramic ferrule 642 to assemble.
  • the upper cover plate 611 covers the V-shaped groove 614a.
  • the inside of the groove 614a is used to fix the end of the first optical fiber 62 extending into the V groove 614a.
  • the first optical fiber 62 and/or the second optical fiber 65 adopts a coil fiber process to save volume.
  • the backlight chip is generally placed behind the laser, but this can only be used to monitor the output power of the optical signal of the laser, but cannot monitor the output optical power of the overall optical signal, which increases the external control terminal pair array The difficulty of power adjustment for waveguide grating chips and lasers.
  • the light emitting assembly includes a first backlight chip 4 housed in a closed cavity 71, and the first backlight chip 4 is passed through conductive silver glue.
  • the arrayed waveguide grating chip 5 Fixed on the substrate 2, the arrayed waveguide grating chip 5 includes a backlight waveguide output terminal 53, and the first backlight chip 4 is optically coupled to the backlight waveguide output terminal 53.
  • the optical signal entering from the waveguide input terminal 51 is processed by the arrayed waveguide grating chip 5, part of the optical signal is output from the front optical waveguide output terminal 52, and the other part of the optical signal is output from the backlight waveguide output terminal 53.
  • the first backlight chip 4 may include one or more light receiver chips (not shown) and a backlight substrate (not shown) that can receive light signals in a specified wavelength range; the first backlight chip 4 receives the optical signal from the arrayed waveguide grating chip 5 The backlight, so as to accurately monitor the output power of the arrayed waveguide grating chip 5.
  • the laser 1 emits 100 optical signals, converges through the lens 3, and enters the arrayed waveguide grating chip 5 from the waveguide input terminal 51, and the optical signal accounting for 90 is output from the front optical waveguide output terminal 52 and enters the pin assembly 6. It is then transmitted to a subsequent device for wavelength division multiplexing processing; the remaining optical signal with a proportion of 10 is output from the backlight waveguide output terminal 53 and enters the first backlight chip 4 for monitoring.
  • the output optical power can be monitored after the conversion ratio, thereby facilitating the difficulty of the external control terminal to adjust the power of the arrayed waveguide grating chip 5; and the optical signal output by the backlight waveguide output terminal 53
  • the output of the overall optical path is directly fed back.
  • the overall optical path includes the optical path from the laser 1, the lens 3 and the arrayed waveguide grating chip 5, one of which changes, and the optical signal output by the backlight waveguide output terminal 53 can be fed back to the first backlight chip 4 in time. That is, it can be fed back that the overall light path has changed, and finally the function of the first backlight chip 4 to monitor the overall output power and the change of the light path at the same time is realized, which greatly reduces the difficulty of commissioning.
  • the number of the output terminal 53 of the backlight waveguide can be one or more, the number of the output terminal 52 of the front optical waveguide is one, and the laser chip 11, the number of waveguide input terminals 51, and the number of backlight waveguide output terminals 53 are equal, and the three are in a one-to-one correspondence, so that the first backlight chip 4 can effectively monitor the corresponding laser chips 11 and arrayed waveguide grating chips 5 Output Power.
  • the laser 1 has four laser chips 11 emitting four different wavelengths, which are arranged at equal intervals.
  • the laser chips 11 may be arranged at equal intervals or non-equal intervals.
  • the specific realization form adjusts the distance appropriately according to the characteristics of the optical path.
  • the waveguide input terminal 51 includes four waveguide input ports, respectively corresponding to the four laser chips 11 of the laser 1, and the spacing is the same as that of the laser chips 11.
  • the backlight waveguide output terminal 53 includes four backlight waveguide output ports, respectively corresponding to the four backlight chips of the first backlight chip 4, and the distance between them is consistent with that of the backlight chip.
  • the backlight waveguide output terminal 53 and the front optical waveguide output terminal 52 are both arranged on the side of the arrayed waveguide grating chip 5 away from the laser 1;
  • the waveguide input terminal 51 is arranged on the side of the arrayed waveguide grating chip 5 close to the laser 1.
  • the first backlight chip 4 is arranged on the side of the enclosed cavity 71 away from the laser 1, and the space outside the enclosed cavity 71 by the in-line optical isolator 63 is fully utilized to arrange the first backlight chip 4 to make the light emitting assembly compact. , Is conducive to reducing the volume.
  • the light emitting assembly includes a second backlight chip 8 housed in a closed cavity 71, the laser chip 11 includes a backlight output terminal 111, the second backlight chip 8 and the backlight output terminal 111 Optical coupling connection.
  • the output power of the optical signal of the laser 1 is monitored in real time through the second backlight chip 8.
  • the second backlight chip 8 and the first backlight chip 4 can be used alone or in combination.
  • the power of the optical signal monitored by the first backlight chip 4 is abnormal, and the power of the optical signal monitored by the second backlight chip 8 is normal, it means that the output power of the optical signal of the laser 1 is normal, which is convenient It is judged that there is a problem with the arrayed waveguide grating chip 5 or the lens 3, and then further specific judgments are made by disassembling the lens 3 or observing cracks; on the contrary, if the power of the monitoring light signal of the first backlight chip 4 is normal, the second backlight chip 8 monitors If the power of the optical signal is abnormal, it can be easily determined that there is a problem with the laser 1, which greatly reduces the difficulty of commissioning.
  • an oblique angle B is formed on both sides of the arrayed waveguide grating chip 5, and B is usually selected to be 1-20° to facilitate subsequent coupling and connection.
  • An optical module includes: a printed circuit board assembly, a light receiving assembly and the above-mentioned light emitting assembly, the light emitting assembly and the light receiving assembly are arranged on the printed circuit board assembly.
  • the printed circuit board assembly includes a printed circuit board, a heat dissipation carrier, a device electrical interface and a gold finger; the substrate 2 of the light emitting assembly and the heat dissipation carrier realize the functions of fixing and heat conduction through a thermal conductive silver glue, the electrical interface of the device and the laser 1 in the light emitting assembly The electrical connection is achieved by means of gold wires.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

A light-emitting assembly and an optical module. The light-emitting assembly comprises: a substrate (2); a sealing cover plate (7); a laser (1); a lens (3); an array waveguide grating chip (5) comprising a waveguide input end (51) and a front optical waveguide output end (52), wherein the waveguide input end (51), the lens (3), and the laser (1) are in optical coupling connection to each other; and a pin assembly (6) comprising an optical fiber array head (61), a first optical fiber (62), an online optical isolator (63), an adapter assembly (64), and a second optical fiber (65). The optical fiber array head (61) passes through the sealing cover plate (7) to be in optical coupling connection to the front optical waveguide output end (52). The optical fiber array head (61) is in coupling connection to the online optical isolator (63). The online optical isolator (63) is in coupling connection to the adapter assembly (64). The online optical isolator (63) is arranged outside a closed cavity (71). In this way, the light-emitting assembly and the optical module have the advantage of saving space.

Description

光发射组件以及光模块Light emitting component and optical module
相关申请的交叉引用Cross-references to related applications
本申请基于申请号为2020105767015、申请日为2020年6月22日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。This application is filed based on a Chinese patent application with an application number of 2020105767015 and an application date of June 22, 2020, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference into this application.
技术领域Technical field
本申请涉及光电子器件封装领域，尤其涉及一种光发射组件以及光模块。This application relates to the field of optoelectronic device packaging, in particular to a light emitting component and an optical module.
背景技术Background technique
近年来，光通信技术行业的飞速发展，推动着光器件产业向高速化、小型化和集成化进行演变。传统用于QSFP+/QSFP28(即四通道SFP接口，28为系列型号)封装的40G/100G光器件大多采用管壳封装的设计方案，由于其高昂的管壳物料成本和必须采用的激光焊接工艺带来的功率变化，也逐渐无法满足后续高速封装形式对于成本、体积和性能的严格要求。In recent years, the rapid development of the optical communication technology industry has promoted the evolution of the optical device industry to high-speed, miniaturization and integration. Most of the 40G/100G optical devices traditionally used for QSFP+/QSFP28 (four-channel SFP interface, 28 is the series model) package adopt the package design scheme, due to the high package material cost and the laser welding process that must be adopted. The recent power changes have gradually been unable to meet the stringent requirements for cost, volume and performance of subsequent high-speed packaging.
当前，绝大部分光发射组件的隔离器都是内置在主体中，一方面增加了主体的耦合光路长度，另一方面也占用了主体中的空间，进而压缩了其他关键元器件的布局空间。At present, most of the isolators of light emitting components are built into the main body, which increases the coupling optical path length of the main body on the one hand, and also occupies the space in the main body on the other hand, thereby compressing the layout space of other key components.
发明内容Summary of the invention
有鉴于此，本申请实施例期望提供一种光发射组件以及光模块，能节省空间。In view of this, the embodiments of the present application expect to provide a light emitting assembly and an optical module, which can save space.
为达到上述目的，本申请实施例的技术方案是这样实现的：In order to achieve the foregoing objectives, the technical solutions of the embodiments of the present application are implemented as follows:
一种光发射组件，包括：衬底；密封盖板；所述密封盖板罩设在所述衬底上以形成封闭腔体；容纳于所述封闭腔体内的激光器；所述激光器包括激光器芯片以及设置在所述衬底上基板，所述激光器芯片设置在所述基板上；容纳于所述封闭腔体内的透镜；容纳于所述封闭腔体内的阵列波导光栅芯片，所述阵列波导光栅芯片包括波导输入端以及前光波导输出端，所述波导输入端、所述透镜以及所述激光器光耦合连接；以及插针组件，所述插针组件包括光纤阵列头、第一光纤、在线式光隔离器、适配器组件以及第二光纤，所述光纤阵列头穿过密封盖板与所述前光波导输出端光耦合连接，所述光纤阵列头与所述在线式光隔离器通过所述第一光纤耦合连接，所述在线式光隔离器与所述适配器组件通过所述第二光纤耦合连接；所述在线式光隔离器设置在所述封闭腔体外。A light emitting component includes: a substrate; a sealing cover plate; the sealing cover plate is arranged on the substrate to form a closed cavity; a laser contained in the closed cavity; the laser includes a laser chip And a substrate arranged on the substrate, the laser chip is arranged on the substrate; a lens accommodated in the enclosed cavity; an arrayed waveguide grating chip accommodated in the enclosed cavity, the arrayed waveguide grating chip It includes a waveguide input end and a front optical waveguide output end, the waveguide input end, the lens, and the laser are optically coupled and connected; and a pin assembly including an optical fiber array head, a first optical fiber, and an in-line optical fiber The optical fiber array head is optically coupled to the output end of the front optical waveguide through the sealing cover plate, and the optical fiber array head and the in-line optical isolator pass through the first optical fiber. Optical fiber coupling connection, the in-line optical isolator and the adapter assembly are coupled and connected through the second optical fiber; the in-line optical isolator is arranged outside the enclosed cavity.
进一步地，所述在线式光隔离器包括左准直器、左楔角片、磁环、法拉第旋转器、右楔角片、右准直器以及玻璃套管；所述左楔角片、所述法拉第旋转器以及所述右楔角片依次设置在所述磁环内；所述左准直器、所述磁环以及所述右准直器依次套装在所述玻璃套管内，所述光纤阵列头与所述左准直器通过所述第一光纤耦合连接。Further, the online optical isolator includes a left collimator, a left wedge sheet, a magnetic ring, a Faraday rotator, a right wedge sheet, a right collimator, and a glass sleeve; the left wedge sheet, a The Faraday rotator and the right wedge are sequentially arranged in the magnetic ring; the left collimator, the magnetic ring, and the right collimator are sequentially sleeved in the glass sleeve, and the optical fiber The array head and the left collimator are coupled and connected through the first optical fiber.
进一步地，所述适配器组件包括光纤适配器、陶瓷插芯、陶瓷套筒以及金属环，沿所述光纤适配器的轴向，所述金属环与所述陶瓷套筒依次套设于所述光纤适配器内，所述陶瓷插芯穿过所述金属环并伸入所述陶瓷套筒，所述陶瓷插芯与所述右准直器通过所述第二光纤耦合连接。Further, the adapter assembly includes a fiber optic adapter, a ceramic ferrule, a ceramic sleeve, and a metal ring. Along the axial direction of the fiber optic adapter, the metal ring and the ceramic sleeve are sequentially sleeved in the fiber optic adapter The ceramic ferrule passes through the metal ring and extends into the ceramic sleeve, and the ceramic ferrule is coupled to the right collimator through the second optical fiber.
进一步地，所述光纤阵列头包括上盖板、下底板以及固定部，所述下底板上形成有V形槽，所述上盖板覆盖在所述V形槽上，所述固定部设置在所述V形槽内以用于固定所述第一光纤伸入所述V形槽的端部。Further, the optical fiber array head includes an upper cover plate, a lower base plate, and a fixing part. A V-shaped groove is formed on the lower base plate, the upper cover plate covers the V-shaped groove, and the fixing part is arranged on the The V-shaped groove is used to fix the end of the first optical fiber extending into the V-shaped groove.
进一步地，所述第一光纤和/或所述第二光纤采用盘纤工艺。Further, the first optical fiber and/or the second optical fiber adopt a coiling process.
进一步地，所述光发射组件包括容纳于所述封闭腔体内的第一背光芯片，所述阵列波导光栅芯片包括背光波导输出端，所述第一背光芯片与所述背光波导输出端光耦合连接。Further, the light emitting assembly includes a first backlight chip accommodated in the enclosed cavity, the arrayed waveguide grating chip includes a backlight waveguide output end, and the first backlight chip is optically coupled to the backlight waveguide output end .
进一步地，所述激光器芯片的数量、所述波导输入端的数量、以及所述背光波导输出端的数量相等。Further, the number of the laser chips, the number of the waveguide input ends, and the number of the backlight waveguide output ends are equal.
进一步地，所述背光波导输出端、所述前光波导输出端均设置在所述阵列波导光栅芯片远离所述激光器的一侧；所述波导输入端设置在所述阵列波导光栅芯片靠近所述激光器的一侧，所述第一背光芯片设置在所述封闭腔体远离所述激光器的一侧。Further, the backlight waveguide output end and the front optical waveguide output end are both arranged on the side of the arrayed waveguide grating chip away from the laser; the waveguide input end is arranged on the arrayed waveguide grating chip close to the On one side of the laser, the first backlight chip is arranged on the side of the enclosed cavity away from the laser.
进一步地，所述光发射组件包括容纳于所述封闭腔体内的第二背光芯片，所述激光器芯片包括背光输出端，所述第二背光芯片与所述背光输出端光耦合连接。Further, the light emitting assembly includes a second backlight chip contained in the enclosed cavity, the laser chip includes a backlight output terminal, and the second backlight chip is optically coupled to the backlight output terminal.
一种光模块，包括：印刷电路板组件，光接收组件以及上述的光发射组件，所述光发射组件与所述光接收组件设置在所述印刷电路板组件上。An optical module includes: a printed circuit board assembly, a light receiving assembly, and the above-mentioned light emitting assembly. The light emitting assembly and the light receiving assembly are arranged on the printed circuit board assembly.
光发射组件以及光模块通过将在线式光隔离器设置在封闭腔体外，并以插针组件的形式采用光纤连接，减小整体的体积；封闭腔体内的空间可以用于布置其他的关键元器件，给电路设计提供了更大布局空间，并减少封闭腔体内的激光器、透镜与阵列波导光栅芯片的光耦合难度，工艺难度降低。此外，通过光纤阵列头连接阵列波导光栅芯片的前光波导输出端与适配器组件，相较于现有技术中的前光波导输出端与适配器组件激光焊接技术，避免了焊接后光功率偏移的问题，降低了制造成本。The light emitting component and the optical module are arranged outside the enclosed cavity by the in-line optical isolator and connected by optical fibers in the form of pin components to reduce the overall volume; the space in the enclosed cavity can be used to arrange other key components , Provides more layout space for the circuit design, and reduces the optical coupling difficulty of the laser, lens and the arrayed waveguide grating chip in the enclosed cavity, and the process difficulty is reduced. In addition, the front optical waveguide output end of the arrayed waveguide grating chip and the adapter assembly are connected through the optical fiber array head. Compared with the laser welding technology of the front optical waveguide output end and the adapter assembly in the prior art, the optical power shift after welding is avoided. Problem, reducing manufacturing costs.
附图说明Description of the drawings
图1为本申请实施例的一种光发射组件的结构示意图；FIG. 1 is a schematic structural diagram of a light emitting component according to an embodiment of the application;
图2为图1的俯视图，其中省略了密封盖板；Figure 2 is a top view of Figure 1, in which the sealing cover is omitted;
图3为本申请实施例的一种插针组件的结构示意图；FIG. 3 is a schematic structural diagram of a pin assembly according to an embodiment of the application;
图4为本申请实施例的光纤阵列头的横截面示意图；4 is a schematic cross-sectional view of an optical fiber array head according to an embodiment of the application;
图5为本申请实施例的在线式光隔离器的内部结构示意图；5 is a schematic diagram of the internal structure of an online optical isolator according to an embodiment of the application;
图6为本申请实施例的适配器组件的内部结构示意图；FIG. 6 is a schematic diagram of the internal structure of an adapter assembly according to an embodiment of the application;
图7为本申请实施例的阵列波导光栅芯片的结构示意图；FIG. 7 is a schematic structural diagram of an arrayed waveguide grating chip according to an embodiment of the application;
图8为图7的A向视图；Fig. 8 is a view from the direction A of Fig. 7;
图9为本申请另一实施例的光发射组件的结构示意图，其中省略了密封盖板。FIG. 9 is a schematic structural diagram of a light emitting component according to another embodiment of the application, in which the sealing cover plate is omitted.
具体实施方式detailed description
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的技术特征可以相互组合，具体实施方式中的详细描述应理解为本申请的解释说明，不应视为对本申请的不当限制。It should be noted that, in the case of no conflict, the embodiments in the application and the technical features in the embodiments can be combined with each other. The detailed description in the specific implementation should be understood as an explanation of the application, and should not be regarded as an explanation of the application. Improper restrictions on application.
在本申请实施例的描述中，“上”、“下”、“左”、“右”、“前”、“后”方位或位置关系为基于附图1所示的方位或位置关系，需要理解的是，这些方位术语仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。In the description of the embodiments of the present application, the orientation or positional relationship of "up", "down", "left", "right", "front", and "rear" is based on the orientation or positional relationship shown in FIG. It is understood that these terms of orientation are only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a reference to this application. limit.
如图1至图9所示，一种光发射组件，包括衬底2、密封盖板7、激光器1、透镜3、阵列波导光栅芯片5以及插针组件6。As shown in Figs. 1-9, a light emitting assembly includes a substrate 2, a sealing cover 7, a laser 1, a lens 3, an arrayed waveguide grating chip 5, and a pin assembly 6.
衬底2的材质为氮化铝或者钨铜合金，用于导热以及固定其他部件。The material of the substrate 2 is aluminum nitride or tungsten copper alloy, which is used to conduct heat and fix other components.
密封盖板7罩设在衬底2上以形成封闭腔体71；封闭腔体71用于容纳其他部件结构，起到保护以及防尘效果。The sealing cover 7 is arranged on the substrate 2 to form a closed cavity 71; the closed cavity 71 is used to accommodate other component structures, and has a protection and dustproof effect.
激光器1容纳于封闭腔体71内；激光器1包括激光器芯片11以及设置在衬底2上的基板12，基板12可采用导电银胶与衬底2固定，激光器芯 片11用于发射指定波长的光信号，激光器芯片11设置在基板12上；激光器芯片11数量为一个或者多个。激光器芯片11的类型包括但不限于DFB芯片、FB芯片、VCSEL芯片、EML芯片；波长类型包括但不限于850nm、1310nm、1550nm。The laser 1 is contained in a closed cavity 71; the laser 1 includes a laser chip 11 and a substrate 12 arranged on a substrate 2. The substrate 12 can be fixed to the substrate 2 with conductive silver glue, and the laser chip 11 is used to emit light of a specified wavelength. For the signal, the laser chip 11 is arranged on the substrate 12; the number of the laser chip 11 is one or more. The types of laser chips 11 include but are not limited to DFB chips, FB chips, VCSEL chips, and EML chips; wavelength types include, but are not limited to, 850 nm, 1310 nm, and 1550 nm.
透镜3容纳于封闭腔体71内；透镜3的材质为玻璃或者硅；透镜3设置在衬底2上以发散或者汇聚光信号；并且衬底2可在对应透镜3的位置设置有定位凹槽(未标出)以方便透镜3嵌入定位。The lens 3 is accommodated in the enclosed cavity 71; the material of the lens 3 is glass or silicon; the lens 3 is arranged on the substrate 2 to diverge or condense the light signal; and the substrate 2 can be provided with a positioning groove at a position corresponding to the lens 3 (Not marked) to facilitate the insertion and positioning of the lens 3.
阵列波导光栅芯片5容纳于封闭腔体71内，阵列波导光栅芯片5可通过导电银胶贴合在衬底2上，以实现在工作状态下通过衬底2散热。阵列波导光栅芯片5包括波导输入端51以及前光波导输出端52，波导输入端51、透镜3以及激光器1光耦合连接。具体地，激光器芯片11发出的光信号，经过透镜3后，从波导输入端51进入阵列波导光栅芯片5并处理。The arrayed waveguide grating chip 5 is accommodated in the enclosed cavity 71, and the arrayed waveguide grating chip 5 can be attached to the substrate 2 through conductive silver glue to realize heat dissipation through the substrate 2 in the working state. The arrayed waveguide grating chip 5 includes a waveguide input terminal 51 and a front optical waveguide output terminal 52, and the waveguide input terminal 51, the lens 3 and the laser 1 are optically coupled and connected. Specifically, the optical signal emitted by the laser chip 11 enters the arrayed waveguide grating chip 5 from the waveguide input end 51 after passing through the lens 3 and is processed.
插针组件6包括光纤阵列头61、第一光纤62、在线式光隔离器63、适配器组件64以及第二光纤65。The pin assembly 6 includes an optical fiber array head 61, a first optical fiber 62, an in-line optical isolator 63, an adapter assembly 64 and a second optical fiber 65.
光纤阵列头61穿过密封盖板7与前光波导输出端52光耦合连接，激光器1发出的光信号经过阵列波导光栅芯片5处理后，绝大部分光信号从前光波导输出端52输出进入光纤阵列头61；光纤阵列头61与在线式光隔离器63通过第一光纤62耦合连接，在线式光隔离器63允许从光纤阵列头61一侧的光信号通过，防止外来光信号进入阵列波导光栅芯片5干扰；在线式光隔离器63与适配器组件64通过第二光纤65耦合连接；光信号进入光纤阵列头61后通过在线式光隔离器63再从适配器组件64传出，进入后续的装置处理。The optical fiber array head 61 passes through the sealing cover 7 and is optically coupled to the front optical waveguide output terminal 52. After the optical signal emitted by the laser 1 is processed by the arrayed waveguide grating chip 5, most of the optical signal is output from the front optical waveguide output terminal 52 into the optical fiber Array head 61; the optical fiber array head 61 and the in-line optical isolator 63 are coupled and connected through the first optical fiber 62. The in-line optical isolator 63 allows the optical signal from the side of the optical fiber array head 61 to pass through, preventing external optical signals from entering the arrayed waveguide grating The chip 5 interferes; the online optical isolator 63 and the adapter assembly 64 are coupled and connected through the second optical fiber 65; the optical signal enters the optical fiber array head 61 and then passes through the online optical isolator 63 and then passes from the adapter assembly 64 to the subsequent device processing .
第一光纤62和第二光纤65为带有保护层的光纤，并且其长度可以根据光器件的实际需求灵活设计。The first optical fiber 62 and the second optical fiber 65 are optical fibers with a protective layer, and their lengths can be flexibly designed according to the actual requirements of the optical device.
通过将在线式光隔离器63设置在封闭腔体71外，并以插针组件6的 形式采用光纤连接，减小整体的体积；封闭腔体71内的空间可以用于布置其他的关键元器件，给电路设计提供了更大布局空间，并减少封闭腔体71内的激光器1、透镜3与阵列波导光栅芯片5的光耦合难度，工艺难度降低。此外，通过光纤阵列头61连接阵列波导光栅芯片5的前光波导输出端52与适配器组件64，相较于现有技术中的前光波导输出端52与适配器组件64激光焊接技术，避免了焊接后光功率偏移的问题，降低了制造成本。By arranging the in-line optical isolator 63 outside the enclosed cavity 71 and using optical fiber connection in the form of the pin assembly 6, the overall volume is reduced; the space in the enclosed cavity 71 can be used to arrange other key components This provides a larger layout space for the circuit design, reduces the optical coupling difficulty of the laser 1, the lens 3 and the arrayed waveguide grating chip 5 in the enclosed cavity 71, and reduces the process difficulty. In addition, the front optical waveguide output end 52 of the arrayed waveguide grating chip 5 and the adapter assembly 64 are connected through the optical fiber array head 61. Compared with the laser welding technology of the front optical waveguide output end 52 and the adapter assembly 64 in the prior art, welding is avoided. The problem of the deviation of the rear optical power reduces the manufacturing cost.
一种可能的实施方式，如图1至图3，以及图5所示，在线式光隔离器63包括左准直器631、左楔角片632、磁环633、法拉第旋转器634、右楔角片635、右准直器636以及玻璃套管637。左楔角片632、法拉第旋转器634以及右楔角片635依次设置在磁环633内；法拉第旋转器634具有非互易性，能有效隔离抑制回波反射的光信号。通过光学耦合的方式将左准直器631、磁环633以及右准直器636进行对准后，再依次套装在玻璃套管637内，连接的方式可以是胶粘。光纤阵列头61与左准直器631通过第一光纤62耦合连接，连接部位可以采用软胶固定和缓冲，以防止日常使用中损坏。A possible implementation manner, as shown in FIGS. 1 to 3, and 5, the in-line optical isolator 63 includes a left collimator 631, a left wedge piece 632, a magnetic ring 633, a Faraday rotator 634, and a right wedge Angle piece 635, right collimator 636, and glass sleeve 637. The left wedge plate 632, the Faraday rotator 634, and the right wedge plate 635 are sequentially arranged in the magnetic ring 633; the Faraday rotator 634 has non-reciprocity and can effectively isolate and suppress the optical signal of the echo reflection. After the left collimator 631, the magnetic ring 633, and the right collimator 636 are aligned by optical coupling, they are then placed in the glass sleeve 637 in sequence, and the connection method may be glue. The optical fiber array head 61 and the left collimator 631 are coupled and connected by the first optical fiber 62, and the connection part can be fixed and buffered with soft glue to prevent damage during daily use.
一种可能的实施方式，如图1至图3，以及图6所示，适配器组件64包括光纤适配器641、陶瓷插芯642、陶瓷套筒643以及金属环644。沿光纤适配器641的轴向，金属环644与陶瓷套筒643依次套设于光纤适配器641内，光纤适配器641可采用金属制成，光纤适配器641和金属环644可采取过盈配合连接或者胶水粘接。陶瓷插芯642穿过金属环644并伸入陶瓷套筒643，完成固定，陶瓷插芯642与右准直器636通过第二光纤65耦合连接，连接部位可以采用软胶固定和缓冲，以防止日常使用中损坏。In a possible implementation manner, as shown in FIGS. 1 to 3 and FIG. 6, the adapter assembly 64 includes an optical fiber adapter 641, a ceramic ferrule 642, a ceramic sleeve 643 and a metal ring 644. Along the axial direction of the fiber optic adapter 641, the metal ring 644 and the ceramic sleeve 643 are sequentially sleeved in the fiber optic adapter 641. The fiber optic adapter 641 can be made of metal, and the fiber optic adapter 641 and the metal ring 644 can be connected by interference fit or glued. catch. The ceramic ferrule 642 passes through the metal ring 644 and extends into the ceramic sleeve 643 to complete the fixation. The ceramic ferrule 642 and the right collimator 636 are coupled and connected through the second optical fiber 65. The connection part can be fixed and buffered with soft glue to prevent Damaged in daily use.
陶瓷插芯642可以为单模插芯，也可以使多模插芯，所以对应的第二光纤65可以使单模光纤也可以是多模光纤，具体型号需要根据光器件的使用需求进行配置。The ceramic ferrule 642 may be a single-mode ferrule or a multi-mode ferrule, so the corresponding second optical fiber 65 may be a single-mode fiber or a multi-mode fiber. The specific model needs to be configured according to the use requirements of the optical device.
一种可能的实施方式，如图1至图4所示，光纤阵列头61包括上盖板611、下底板614以及固定部612，上盖板611、下底板614均可为玻璃制成。A possible implementation manner, as shown in FIGS. 1 to 4, the optical fiber array head 61 includes an upper cover 611, a lower base 614, and a fixing portion 612. The upper cover 611 and the lower base 614 can be made of glass.
下底板614上形成有V形槽614a，以方便第二光纤65伸入陶瓷插芯642的端部装配，上盖板611覆盖在V形槽614a上，固定部612可为固化胶水填充在V形槽614a内以用于固定第一光纤62伸入V形槽614a的端部。A V-shaped groove 614a is formed on the lower bottom plate 614 to facilitate the second optical fiber 65 extending into the end of the ceramic ferrule 642 to assemble. The upper cover plate 611 covers the V-shaped groove 614a. The inside of the groove 614a is used to fix the end of the first optical fiber 62 extending into the V groove 614a.
一种可能的实施方式，第一光纤62和/或第二光纤65采用盘纤工艺以节省体积。In a possible implementation manner, the first optical fiber 62 and/or the second optical fiber 65 adopts a coil fiber process to save volume.
现有的技术中，一般将背光芯片放置于激光器的背后，但这样只能用于监控激光器的光信号的输出功率，但无法监控整体的光信号的输出光功率，增加了外部控制端对阵列波导光栅芯片以及激光器进行功率调节的难度。In the existing technology, the backlight chip is generally placed behind the laser, but this can only be used to monitor the output power of the optical signal of the laser, but cannot monitor the output optical power of the overall optical signal, which increases the external control terminal pair array The difficulty of power adjustment for waveguide grating chips and lasers.
一种可能的实施方式，如图1、图2，以及图7至图9所示，光发射组件包括容纳于封闭腔体71内的第一背光芯片4，第一背光芯片4通过导电银胶固定在衬底2上，阵列波导光栅芯片5包括背光波导输出端53，第一背光芯片4与背光波导输出端53光耦合连接。从波导输入端51进入的光信号，经过阵列波导光栅芯片5处理，部分光信号从前光波导输出端52输出，另一部分光信号从背光波导输出端53输出。A possible implementation manner, as shown in FIGS. 1, 2 and 7 to 9, the light emitting assembly includes a first backlight chip 4 housed in a closed cavity 71, and the first backlight chip 4 is passed through conductive silver glue. Fixed on the substrate 2, the arrayed waveguide grating chip 5 includes a backlight waveguide output terminal 53, and the first backlight chip 4 is optically coupled to the backlight waveguide output terminal 53. The optical signal entering from the waveguide input terminal 51 is processed by the arrayed waveguide grating chip 5, part of the optical signal is output from the front optical waveguide output terminal 52, and the other part of the optical signal is output from the backlight waveguide output terminal 53.
第一背光芯片4可包括一个或者多个可接收指定波长范围光信号的光接收器芯片(未标出)和背光基板(未标出)；通过第一背光芯片4接收来自阵列波导光栅芯片5的背光，从而准确监控阵列波导光栅芯片5的输出功率。The first backlight chip 4 may include one or more light receiver chips (not shown) and a backlight substrate (not shown) that can receive light signals in a specified wavelength range; the first backlight chip 4 receives the optical signal from the arrayed waveguide grating chip 5 The backlight, so as to accurately monitor the output power of the arrayed waveguide grating chip 5.
具体地，激光器1发出100的光信号，经过透镜3汇聚，从波导输入端51进入阵列波导光栅芯片5，占比90的光信号从前光波导输出端52输出，进入到插针组件6中，再传输到后续的装置进行波分复用处理；剩余 占比10的光信号从背光波导输出端53输出进入第一背光芯片4，实现监控。通过检测背光波导输出端53输出的光信号，换算比例后即可监控输出光功率，进而方便外部控制端对阵列波导光栅芯片5进行功率调节的难度；并且，背光波导输出端53输出的光信号直接反馈了整体光路的输出，整体光路包括从激光器1、透镜3以及阵列波导光栅芯片5的光路，其中一个出现变化，背光波导输出端53输出的光信号可以及时向第一背光芯片4反馈，即可以反馈为整体光路发生变化，最终实现了第一背光芯片4同时监控整体输出功率和光路变化的功能，极大地降低了调测的难度。Specifically, the laser 1 emits 100 optical signals, converges through the lens 3, and enters the arrayed waveguide grating chip 5 from the waveguide input terminal 51, and the optical signal accounting for 90 is output from the front optical waveguide output terminal 52 and enters the pin assembly 6. It is then transmitted to a subsequent device for wavelength division multiplexing processing; the remaining optical signal with a proportion of 10 is output from the backlight waveguide output terminal 53 and enters the first backlight chip 4 for monitoring. By detecting the optical signal output by the backlight waveguide output terminal 53, the output optical power can be monitored after the conversion ratio, thereby facilitating the difficulty of the external control terminal to adjust the power of the arrayed waveguide grating chip 5; and the optical signal output by the backlight waveguide output terminal 53 The output of the overall optical path is directly fed back. The overall optical path includes the optical path from the laser 1, the lens 3 and the arrayed waveguide grating chip 5, one of which changes, and the optical signal output by the backlight waveguide output terminal 53 can be fed back to the first backlight chip 4 in time. That is, it can be fed back that the overall light path has changed, and finally the function of the first backlight chip 4 to monitor the overall output power and the change of the light path at the same time is realized, which greatly reduces the difficulty of commissioning.
一种可能的实施方式，如图1、图2，以及图7至图9所示，背光波导输出端53的数量可为一个或者多个，前光波导输出端52的数量为一个，激光器芯片11的数量、波导输入端51的数量、以及背光波导输出端53的数量相等，三者一一对应，从而方便第一背光芯片4有效的监控对应的各个激光器芯片11与阵列波导光栅芯片5的输出功率。In a possible implementation manner, as shown in FIGS. 1, 2 and 7 to 9, the number of the output terminal 53 of the backlight waveguide can be one or more, the number of the output terminal 52 of the front optical waveguide is one, and the laser chip 11, the number of waveguide input terminals 51, and the number of backlight waveguide output terminals 53 are equal, and the three are in a one-to-one correspondence, so that the first backlight chip 4 can effectively monitor the corresponding laser chips 11 and arrayed waveguide grating chips 5 Output Power.
具体地，如图2和图9中所示，激光器1具有发射四个不同波长的激光器芯片11，且为等间距排布，实际上，激光器芯片11可以等间距排布或者非等间距排布，具体实现形式根据光路的特点进行间距的适当调节。Specifically, as shown in FIGS. 2 and 9, the laser 1 has four laser chips 11 emitting four different wavelengths, which are arranged at equal intervals. In fact, the laser chips 11 may be arranged at equal intervals or non-equal intervals. , The specific realization form adjusts the distance appropriately according to the characteristics of the optical path.
波导输入端51包括四个波导输入端口，分别对应激光器1的四个激光器芯片11，间距与激光器芯片11保持一致。The waveguide input terminal 51 includes four waveguide input ports, respectively corresponding to the four laser chips 11 of the laser 1, and the spacing is the same as that of the laser chips 11.
背光波导输出端53包括四个背光波导输出端口，分别对应第一背光芯片4的四个背光芯片，间距与背光芯片保持一致。The backlight waveguide output terminal 53 includes four backlight waveguide output ports, respectively corresponding to the four backlight chips of the first backlight chip 4, and the distance between them is consistent with that of the backlight chip.
一种可能的实施方式，如图1、图2，以及图7至图9所示，背光波导输出端53、前光波导输出端52均设置在阵列波导光栅芯片5远离激光器1的一侧；波导输入端51设置在阵列波导光栅芯片5靠近激光器1的一侧。In a possible implementation manner, as shown in FIGS. 1, 2 and 7 to 9, the backlight waveguide output terminal 53 and the front optical waveguide output terminal 52 are both arranged on the side of the arrayed waveguide grating chip 5 away from the laser 1; The waveguide input terminal 51 is arranged on the side of the arrayed waveguide grating chip 5 close to the laser 1.
第一背光芯片4设置在封闭腔体71远离激光器1的一侧，充分利用在线式光隔离器63移出封闭腔体71外的空间，来设置第一背光芯片4，以使 得光发射组件结构紧凑，有利于减小体积。The first backlight chip 4 is arranged on the side of the enclosed cavity 71 away from the laser 1, and the space outside the enclosed cavity 71 by the in-line optical isolator 63 is fully utilized to arrange the first backlight chip 4 to make the light emitting assembly compact. , Is conducive to reducing the volume.
一种可能的实施方式，如图9所示，光发射组件包括容纳于封闭腔体71内的第二背光芯片8，激光器芯片11包括背光输出端111，第二背光芯片8与背光输出端111光耦合连接。通过第二背光芯片8实时监控激光器1的光信号的输出功率。A possible implementation manner, as shown in FIG. 9, the light emitting assembly includes a second backlight chip 8 housed in a closed cavity 71, the laser chip 11 includes a backlight output terminal 111, the second backlight chip 8 and the backlight output terminal 111 Optical coupling connection. The output power of the optical signal of the laser 1 is monitored in real time through the second backlight chip 8.
需要理解的是，第二背光芯片8与第一背光芯片4既可以单独使用也可以组合使用。组合使用的情况下，针对整体光路，若第一背光芯片4监控光信号的功率异常，第二背光芯片8监控的光信号的功率正常，则代表激光器1的光信号的输出功率正常，可以方便判断是阵列波导光栅芯片5或者透镜3出现问题，再进一步地通过拆装透镜3或者观察裂纹等方式具体判断；反之，若第一背光芯片4监控光信号的功率正常，第二背光芯片8监控的光信号的功率异常，则可以方便判断是激光器1出现问题，极大地降低了调测的难度。It should be understood that the second backlight chip 8 and the first backlight chip 4 can be used alone or in combination. In the case of combined use, for the overall optical path, if the power of the optical signal monitored by the first backlight chip 4 is abnormal, and the power of the optical signal monitored by the second backlight chip 8 is normal, it means that the output power of the optical signal of the laser 1 is normal, which is convenient It is judged that there is a problem with the arrayed waveguide grating chip 5 or the lens 3, and then further specific judgments are made by disassembling the lens 3 or observing cracks; on the contrary, if the power of the monitoring light signal of the first backlight chip 4 is normal, the second backlight chip 8 monitors If the power of the optical signal is abnormal, it can be easily determined that there is a problem with the laser 1, which greatly reduces the difficulty of commissioning.
一种可能的实施方式，如图1、图2、图7和图8所示，阵列波导光栅芯片5两侧形成有斜角B，B通常可选择为1～20°以方便后续耦合连接。A possible implementation manner, as shown in FIG. 1, FIG. 2, FIG. 7 and FIG. 8, an oblique angle B is formed on both sides of the arrayed waveguide grating chip 5, and B is usually selected to be 1-20° to facilitate subsequent coupling and connection.
一种光模块，包括：印刷电路板组件，光接收组件以及上述的光发射组件，光发射组件与光接收组件设置在印刷电路板组件上。印刷电路板组件包括印刷电路板、散热载体、器件电接口以及金手指；光发射组件的衬底2与散热载体通过导热银胶实现固定和导热的功能，器件电接口和光发射组件中的激光器1通过金丝的方式实现电气连接。An optical module includes: a printed circuit board assembly, a light receiving assembly and the above-mentioned light emitting assembly, the light emitting assembly and the light receiving assembly are arranged on the printed circuit board assembly. The printed circuit board assembly includes a printed circuit board, a heat dissipation carrier, a device electrical interface and a gold finger; the substrate 2 of the light emitting assembly and the heat dissipation carrier realize the functions of fixing and heat conduction through a thermal conductive silver glue, the electrical interface of the device and the laser 1 in the light emitting assembly The electrical connection is achieved by means of gold wires.
本申请提供的各个实施例/实施方式在不产生矛盾的情况下可以相互组合。The various embodiments/implementations provided in this application can be combined with each other without conflicts.
以上所述仅为本申请的较佳实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请 的保护范围之内。The foregoing descriptions are only preferred embodiments of the application, and are not intended to limit the application. For those skilled in the art, the application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims (10)

  1. 一种光发射组件，包括：A light emitting component, including:
    衬底(2)；Substrate (2);
    密封盖板(7)；所述密封盖板(7)罩设在所述衬底(2)上以形成封闭腔体(71)；A sealing cover plate (7); the sealing cover plate (7) is arranged on the substrate (2) to form a closed cavity (71);
    容纳于所述封闭腔体(71)内的激光器(1)；所述激光器(1)包括激光器芯片(11)以及设置在所述衬底(2)上的基板(12)，所述激光器芯片(11)设置在所述基板(12)上；The laser (1) contained in the enclosed cavity (71); the laser (1) includes a laser chip (11) and a substrate (12) arranged on the substrate (2), the laser chip (11) Set on the substrate (12);
    容纳于所述封闭腔体(71)内的透镜(3)；The lens (3) contained in the closed cavity (71);
    容纳于所述封闭腔体(71)内的阵列波导光栅芯片(5)，所述阵列波导光栅芯片(5)包括波导输入端(51)以及前光波导输出端(52)，所述波导输入端(51)、所述透镜(3)以及所述激光器(1)光耦合连接；An arrayed waveguide grating chip (5) housed in the enclosed cavity (71). The arrayed waveguide grating chip (5) includes a waveguide input end (51) and a front optical waveguide output end (52). The waveguide input The end (51), the lens (3) and the laser (1) are optically coupled and connected;
    以及插针组件(6)，所述插针组件(6)包括光纤阵列头(61)、第一光纤(62)、在线式光隔离器(63)、适配器组件(64)以及第二光纤(65)，所述光纤阵列头(61)穿过密封盖板(7)与所述前光波导输出端(52)光耦合连接，所述光纤阵列头(61)与所述在线式光隔离器(63)通过所述第一光纤(62)耦合连接，所述在线式光隔离器(63)与所述适配器组件(64)通过所述第二光纤(65)耦合连接；所述在线式光隔离器(63)设置在所述封闭腔体(71)外。And a pin assembly (6), the pin assembly (6) includes an optical fiber array head (61), a first optical fiber (62), an in-line optical isolator (63), an adapter assembly (64), and a second optical fiber ( 65), the optical fiber array head (61) passes through the sealing cover plate (7) and is optically coupled to the front optical waveguide output end (52), and the optical fiber array head (61) is connected to the in-line optical isolator (63) The first optical fiber (62) is coupled and connected, and the online optical isolator (63) and the adapter assembly (64) are coupled and connected by the second optical fiber (65); the online optical The isolator (63) is arranged outside the enclosed cavity (71).
  2. 根据权利要求1所述的光发射组件，所述在线式光隔离器(63)包括左准直器(631)、左楔角片(632)、磁环(633)、法拉第旋转器(634)、右楔角片(635)、右准直器(636)以及玻璃套管(637)；所述左楔角片(632)、所述法拉第旋转器(634)以及所述右楔角片(635)依次设置在所述磁环(633)内；所述左准直器(631)、所述磁环(633)以及所述右准直器(636)依次套装在所述玻璃套管(637)内，所述光纤阵列头(61)与所述左准直 器(631)通过所述第一光纤(62)耦合连接。The light emitting assembly according to claim 1, the in-line optical isolator (63) includes a left collimator (631), a left wedge plate (632), a magnetic ring (633), and a Faraday rotator (634) , Right wedge (635), right collimator (636) and glass sleeve (637); the left wedge (632), the Faraday rotator (634) and the right wedge ( 635) are sequentially arranged in the magnetic ring (633); the left collimator (631), the magnetic ring (633), and the right collimator (636) are sequentially set in the glass sleeve ( In 637), the optical fiber array head (61) and the left collimator (631) are coupled and connected via the first optical fiber (62).
  3. 根据权利要求2所述的光发射组件，所述适配器组件(64)包括光纤适配器(641)、陶瓷插芯(642)、陶瓷套筒(643)以及金属环(644)，沿所述光纤适配器(641)的轴向，所述金属环(644)与所述陶瓷套筒(643)依次套设于所述光纤适配器(641)内，所述陶瓷插芯(642)穿过所述金属环(644)并伸入所述陶瓷套筒(643)，所述陶瓷插芯(642)与所述右准直器(636)通过所述第二光纤(65)耦合连接。The light emitting assembly according to claim 2, wherein the adapter assembly (64) includes an optical fiber adapter (641), a ceramic ferrule (642), a ceramic sleeve (643) and a metal ring (644) along the optical fiber adapter In the axial direction of (641), the metal ring (644) and the ceramic sleeve (643) are sequentially sleeved in the optical fiber adapter (641), and the ceramic ferrule (642) passes through the metal ring (644) and extend into the ceramic sleeve (643), the ceramic ferrule (642) and the right collimator (636) are coupled and connected through the second optical fiber (65).
  4. 根据权利要求1所述的光发射组件，所述光纤阵列头(61)包括上盖板(611)、下底板(614)以及固定部(612)，所述下底板(614)上形成有V形槽(614a)，所述上盖板(611)覆盖在所述V形槽(614a)上，所述固定部(612)设置在所述V形槽(614a)内以用于固定所述第一光纤(62)伸入所述V形槽(614a)的端部。The light emitting assembly according to claim 1, the optical fiber array head (61) includes an upper cover (611), a lower base (614) and a fixing part (612), and a V is formed on the lower base (614). The upper cover plate (611) covers the V-shaped groove (614a), and the fixing portion (612) is arranged in the V-shaped groove (614a) for fixing the V-shaped groove (614a). The first optical fiber (62) extends into the end of the V-shaped groove (614a).
  5. 根据权利要求1所述的光发射组件，所述第一光纤(62)和/或所述第二光纤(65)采用盘纤工艺。The light emitting assembly according to claim 1, wherein the first optical fiber (62) and/or the second optical fiber (65) adopts a coiling process.
  6. 根据权利要求1所述的光发射组件，所述光发射组件包括容纳于所述封闭腔体(71)内的第一背光芯片(4)，所述阵列波导光栅芯片(5)包括背光波导输出端(53)，所述第一背光芯片(4)与所述背光波导输出端(53)光耦合连接。The light emitting assembly according to claim 1, said light emitting assembly comprising a first backlight chip (4) housed in said enclosed cavity (71), said arrayed waveguide grating chip (5) comprising a backlight waveguide output At the end (53), the first backlight chip (4) is optically coupled to the backlight waveguide output end (53).
  7. 根据权利要求6所述的光发射组件，所述激光器芯片(11)的数量、所述波导输入端(51)的数量、以及所述背光波导输出端(53)的数量相等。The light emitting assembly according to claim 6, wherein the number of the laser chips (11), the number of the waveguide input ends (51), and the number of the backlight waveguide output ends (53) are equal.
  8. 根据权利要求6所述的光发射组件，所述背光波导输出端(53)、所述前光波导输出端(52)均设置在所述阵列波导光栅芯片(5)远离所述激光器(1)的一侧；所述波导输入端(51)设置在所述阵列波导光栅芯片(5)靠近所述激光器(1)的一侧，所述第一背光芯片(4)设置在所述封闭腔 体(71)远离所述激光器(1)的一侧。The light emitting assembly according to claim 6, wherein the backlight waveguide output end (53) and the front optical waveguide output end (52) are both arranged on the arrayed waveguide grating chip (5) away from the laser (1) The waveguide input end (51) is arranged on the side of the arrayed waveguide grating chip (5) close to the laser (1), and the first backlight chip (4) is arranged in the enclosed cavity (71) The side away from the laser (1).
  9. 根据权利要求1或6所述的光发射组件，所述光发射组件包括容纳于所述封闭腔体(71)内的第二背光芯片(8)，所述激光器芯片(11)包括背光输出端(111)，所述第二背光芯片(8)与所述背光输出端(111)光耦合连接。The light emitting assembly according to claim 1 or 6, said light emitting assembly comprising a second backlight chip (8) housed in said enclosed cavity (71), and said laser chip (11) comprising a backlight output terminal (111), the second backlight chip (8) is optically coupled to the backlight output terminal (111).
  10. 一种光模块，包括：印刷电路板组件，光接收组件以及如权利要求5至9任一项所述的光发射组件，所述光发射组件与所述光接收组件设置在所述印刷电路板组件上。An optical module, comprising: a printed circuit board assembly, a light receiving assembly, and the light emitting assembly according to any one of claims 5 to 9, wherein the light emitting assembly and the light receiving assembly are arranged on the printed circuit board Components.
PCT/CN2020/135495 2020-06-22 2020-12-10 Light-emitting assembly and optical module WO2021258661A1 (en)

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