WO2021241532A1 - Light emission sheet, and display device and sterilization device using same - Google Patents
Light emission sheet, and display device and sterilization device using same Download PDFInfo
- Publication number
- WO2021241532A1 WO2021241532A1 PCT/JP2021/019699 JP2021019699W WO2021241532A1 WO 2021241532 A1 WO2021241532 A1 WO 2021241532A1 JP 2021019699 W JP2021019699 W JP 2021019699W WO 2021241532 A1 WO2021241532 A1 WO 2021241532A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- resin
- emitting sheet
- layer
- sheet according
- Prior art date
Links
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Classifications
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/02—Layered materials
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D31/00—Materials specially adapted for outerwear
- A41D31/04—Materials specially adapted for outerwear characterised by special function or use
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the present invention relates to a light emitting device that can be used in various situations, a light emitting sheet that can be used as a display device, and a display device, a sterilizer, clothing, clothing, etc. using the same.
- Patent Document 1 a display configured by arranging a plurality of pixel display units having an LED and a control circuit for controlling light emission thereof on the first base board on the second base board.
- a large screen display comprising a unit, which may further have a third substrate made of a transmissive material (thin glass, insulating material, cloth, etc.).
- Patent Document 2 a flexible printed wiring board, a contact trace, an LED, and a flexible light array including a control circuit are enclosed in a flexible pocket and fixed to clothing to display an image on clothing. The system to do is disclosed.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting sheet having excellent elasticity, durability, etc., which can be used for various purposes.
- the light emitting sheet includes a base material sheet, a conductor layer, an LED element, and an LED control means, and the base material sheet is on one surface of the fiber layer and the fiber layer. It contains a resin layer formed on at least a part of the surface and can be stretched by 5% or more at 25 ° C., and the conductor layer is formed on the surface or inside of the resin layer, and the LED.
- the element is electrically connected to the conductor layer, and the LED control means is laid on the base material sheet so as to be communicable with the LED element.
- the present invention also includes a display device, an ultraviolet irradiation device, clothing, an ultraviolet irradiation device, and the like provided with the above-mentioned light emitting sheet.
- FIG. 1 is a schematic cross-sectional view showing the configuration of a light emitting sheet according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view showing the configuration of a light emitting sheet according to another embodiment of the present invention.
- FIG. 3 is a schematic cross-sectional view showing the configuration of a light emitting sheet according to still another embodiment of the present invention.
- FIG. 4 is a schematic view showing an example of an ultraviolet irradiation device using the light emitting sheet of the present invention.
- FIG. 5 is a schematic view showing a usage example of the ultraviolet irradiation device shown in FIG.
- FIG. 6 is a schematic view showing still another example of the ultraviolet irradiation device using the light emitting sheet of the present invention.
- each reference numeral is 1 base sheet, 2 fiber layer, 3 resin layer, 4 conductor layer, 5 LED element, 6 LED control means, 7, 7'vent, 8 power supply means, 9 radio. Indicates a communication means.
- the light emitting sheet of the present embodiment includes a base sheet (fiber sheet) 1, a conductor layer 4, an LED element 5, and an LED control means 6.
- the base material sheet contains a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and can be stretched by 5% or more at 25 ° C.
- the conductor layer is formed on the surface or inside of the resin layer, the LED element is electrically connected to the conductor layer, and the LED control means communicates with the LED element on the base material sheet. It is laid as possible.
- the present embodiment it is possible to provide a light emitting sheet having excellent elasticity and durability that can be used for various purposes.
- the light emitting sheet of the present invention is flexible, resistant to deformation, lightweight, yet has strength and durability, and can be integrated with the fabric without impairing the characteristics of the fabric or the like constituting the base sheet. Therefore, by using the light emitting sheet of the present invention, it is possible to provide an excellent display device, a sterilizer, clothing capable of displaying an image, etc., which have high durability against expansion and contraction.
- the base material sheet 1 includes a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and is 5% or more at 25 ° C. Elongation is possible.
- the resin layer is not formed on the entire fiber layer, but is formed on at least a part of either the front or back surface of the fiber layer.
- the fact that the base sheet 1 according to the present embodiment can be stretched by 5% at 25 ° C. means that when the base sheet 1 according to the present embodiment is stretched in one direction, the base sheet is not broken until it is stretched by at least 5%. It is possible to measure by cutting to a predetermined size and calculating the elongation rate until it breaks when pulled at a constant moving speed.
- the base sheet capable of stretching by 5% can be integrated with the fabric without impairing the texture of the fabric, and can provide an electronic board or a circuit board having high durability against expansion and contraction. Further, the upper limit of extendability is not particularly limited, but 100% is sufficient.
- the base sheet preferably has an initial tensile elastic modulus of 1 MPa or more and 10 GMPa or less at the portion where the resin layer is formed. Even if the initial tensile elastic modulus of the fiber layer contained in the base material sheet is less than 1 MPa, the initial tensile elastic modulus of the base material sheet can be set to 1 MPa or more by forming the resin layer.
- the initial tensile elastic modulus means the elastic modulus when the sheet is stretched by 1%.
- the initial tensile elastic modulus is less than 1 MPa, there is a problem that the restoring force is inferior and the original shape is not restored, which is not preferable. Further, if the initial tensile elastic modulus exceeds 10 GPa, the elasticity is inferior, and for example, when the light emitting sheet of the present embodiment is used for clothing or the like, there is a problem that it is not comfortable to wear, which is not preferable.
- the initial tensile elastic modulus of the base sheet is 5 MPa or more and 1 GPa or less, more preferably 5 MPa or more and 500 MPa or less.
- the initial tensile elastic modulus in the present embodiment is measured by a method of calculating the elastic modulus when the base sheet is cut to a predetermined size and pulled to 1% (elongation%) at a constant moving speed. Can be done. Specifically, the base sheet is cut to 50 mm * 100 mm and attached to a universal testing machine (AGS-X manufactured by Shimadzu Corporation). The test was performed at the initial grip distance: 50 mm and the tensile speed: 100 mm / min, and from all the stress ( ⁇ ) data corresponding to the strain (r) of 0 to 0.01, the least squares method was used to determine r- ⁇ . Calculate the slope and use it as the initial tensile elastic modulus.
- Distortion (r) x / x0 (x is the moving distance of the gripping tool, x0 is the distance between the initial gripping tools)
- Stress ( ⁇ ) F / (d ⁇ l) (F is the test force, d is the film thickness, l is the width of the test piece)
- the elongation rate is calculated from the strain (r) when the base sheet is pulled until it breaks.
- the resin layer in the base material sheet is not particularly limited as long as it is a resin layer in which the elongation of the base material sheet falls within the above range.
- a thermosetting resin generally used as an elastic insulating layer of an electronic base material can be used as the resin layer of the present embodiment.
- the resin layer in the present embodiment preferably contains a thermosetting resin, which is considered to be a resin layer that exhibits high heat resistance and suppresses melting and thermal decomposition even in a high temperature atmosphere. Since the resin layer has heat resistance, there is an advantage that various LED elements can be mounted by soldering. In addition, it is possible to suppress deformation and deterioration of the base sheet due to heat generation of the LED.
- the resin layer 3 may be formed on the entire surface of one surface of the fiber layer 2, but one surface of the fiber layer 2 (either one). It suffices if it is formed on at least a part of the surface of the surface).
- the resin layer 3 may be impregnated into the fiber layer 2. Further, not the entire resin layer 3 but a part thereof may be impregnated into at least a part of one side (any one side) of the fiber layer 2.
- the thickness of the resin layer is not particularly limited and can be appropriately set depending on the intended use. For example, if the thickness is 50 ⁇ m to 5000 ⁇ m, the handleability is improved. It is preferable from the viewpoint of optical characteristics, wearability, and the like.
- thermosetting resin of the present embodiment contains at least an epoxy resin. As a result, it is considered that heat resistance can be obtained more reliably.
- thermosetting resin and the resin layer have a glass transition temperature of 60 ° C. or lower.
- the base sheet can be further given flexibility. It is not necessary to set a lower limit for the glass transition temperature, but it is preferably ⁇ 40 ° C. or higher in order to avoid stickiness at room temperature.
- the thermosetting resin can be stretched by 1% or more (at 25 ° C.). As a result, the base sheet can be stretched by 5% or more. Further, the thermosetting resin preferably has an initial tensile elastic modulus of 1 MPa or more and 10 GPa or less. As a result, the initial tensile elastic modulus at the portion where the resin layer of the base material sheet is formed can be set to 1 MPa or more and 10 GPa or less.
- the resin composition used for the resin layer of the present embodiment is not particularly limited as long as it has the above-mentioned characteristics.
- the resin composition of the present embodiment preferably contains a polyrotaxane resin or an epoxy resin as a thermosetting resin, and particularly preferably contains an epoxy resin. Further, it is preferable to contain a curing agent. As a result, it is possible to obtain a base material sheet having sufficient heat resistance and capable of withstanding the heat when mounting components in the reflow process. Further, by bonding the uncured resin composition to the fiber layer and then curing the resin composition, it becomes easy to integrate the resin layer with the fiber layer.
- a resin composition containing a polyrotaxane (A), a thermosetting resin (B) and a curing agent (C) can be mentioned.
- A polyrotaxane
- B thermosetting resin
- C curing agent
- polyrotaxane (A) examples include polyrotaxane as described in Japanese Patent No. 4482633 or International Publication No. 2015/052853.
- Commercially available products may be used, and specifically, CELM Super Polymer A1000 manufactured by Advanced Soft Materials Co., Ltd. can be used.
- thermosetting resin (B) examples include thermosetting resins such as epoxy resin, phenol resin, polyimide resin, urea resin, melamine resin, unsaturated polyester, and urethane resin without particular limitation. Above all, it is preferable to use an epoxy resin.
- the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, aralkyl epoxy resin, phenol novolac type epoxy resin, alkylphenol novolak type epoxy resin, and biphenol type epoxy.
- examples thereof include a resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, an epoxidized product of a condensate of phenols and an aromatic aldehyde having a phenolic hydroxyl group, triglycidyl isocyanurate, and an alicyclic epoxy resin. Depending on the situation, these may be used alone or in combination of two or more.
- an epoxy resin containing two or more epoxy groups in one molecule and having a molecular weight of 500 or more is preferably exemplified.
- an epoxy resin a commercially available one may be used, for example, JER1003 (manufactured by Mitsubishi Chemical Corporation, molecular weight 1300, bifunctional), EXA-4816 (manufactured by DIC, molecular weight 824, bifunctional), YP50 (Nippon Steel).
- Examples thereof include Sumitomo Metals Chemical Corporation, molecular weight of 60,000 to 80,000, bifunctional), PMS-14-67 (manufactured by Nagase ChemteX Corporation, molecular weight of 300,000, polyfunctional) and the like.
- the epoxy resin has an alkylene oxide-modified modifying group having 2 to 3 carbon atoms, and the modifying group is contained in 1 mol molecule of the epoxy in an amount of 4 mol or more, and has an epoxy group of 2 mol or more.
- the thermosetting resin (B) and the curing agent (C) which are epoxy resins having an epoxy equivalent of 450 eq / mol or more, are contained, the cured product has the extensibility and the tensile elasticity. It is possible to obtain a composition.
- an epoxy resin examples include propylene oxide-added bisphenol A type epoxy resin (ADEKA EP4003S), ethylene oxide-added hydroxyphenylfluorene type epoxy resin (Osaka Gas Chemical Co., Ltd. EG-280), and the like. Be done.
- a resin composition containing a single component of polyrotaxane (A) and a thermosetting resin (B) and a curing agent (C) may be used, but both components ((A) and (B)) may be used. It is preferable to prepare a resin composition containing the curing agent (C) because the cured product can easily obtain the resin composition having the extensibility and the tensile elastic modulus. Further, one type of epoxy resin as described above may be used alone, or two or more types may be used in combination.
- the curing agent (C) is not particularly limited as long as it works as a curing agent for the thermosetting resin (B).
- examples of the epoxy resin that can be preferably used as a curing agent include phenol resins, amine compounds, acid anhydrides, imidazole compounds, sulfide resins, and dicyandiamides.
- a light / ultraviolet curing agent, a thermal cation curing agent, and the like can also be used. Depending on the situation, these may be used alone or in combination of two or more.
- the resin composition may contain a curing accelerator, if necessary. Examples of the effect promoter include imidazole compounds and the like.
- a cross-linking agent may be further added, and such a cross-linking agent may be the polyrotaxane. It can be used without particular limitation as long as it can form a structure that crosslinks with at least a part of the cyclic molecule (at least one reactive group of the cyclic molecule of polyrotaxane). Specific examples thereof include isocyanate and cyanuric chloride.
- the ratio of each component in the resin composition is not particularly limited as long as the effect of the present invention can be exhibited, but for example, when the component (A), the component (B) and the component (C) are all contained, the above-mentioned
- the total of the components (A) to (C) is 100 parts by mass
- the polyrotaxane (A) is 10 to 80 parts by mass, more preferably about 30 to 50 parts by mass
- the thermosetting resin (B) is 10 to 89.9 parts by mass.
- the curing agent (C) is about 0.1 to 30 parts by mass, more preferably about 0.1 to 20 parts by mass.
- the resin composition of the present embodiment contains an isocyanate resin as a cross-linking agent
- 0 to 50 parts by mass of the isocyanate resin can be added to the polyrotaxane (A), and further, 10 to 40 parts by mass. It is preferable to add it.
- the component (B) and the component (C) are contained and the component (A) is not contained, the total amount of the resin composition is 100 parts by mass, and the thermosetting resin (B) is 50 to 99 parts by mass, more preferably. About 60 to 80 parts by mass;
- the curing agent (C) is about 1 to 50 parts by mass, more preferably about 1 to 40 parts by mass.
- the resin composition according to the present embodiment has other additives such as a curing catalyst (curing accelerator), a flame retardant, a flame retardant aid, a leveling agent, and a coloring agent as long as the effects of the present invention are not impaired. Etc. may be contained as needed.
- the method for preparing the resin composition of the present embodiment is not particularly limited, and for example, first, a polyrotaxane resin and / or an epoxy resin, a curing agent, a cross-linking agent, a thermosetting resin, or the like is mixed so as to be uniform.
- the resin composition of the present embodiment can be obtained.
- the solvent used is not particularly limited, and for example, toluene, xylene, methyl ethyl ketone, acetone and the like can be used. These solvents may be used alone or in combination of two or more. Further, if necessary, an organic solvent for adjusting the viscosity and various additives may be blended.
- the fiber layer described later is immersed in the resin composition as described above, the resin composition is applied to the fiber layer, or the resin composition in the form of a film. It is formed by sticking an object to a fiber layer.
- the method for applying the resin composition is not particularly limited, and examples thereof include a bar coater, a comma coater, a die coater, a roll coater, and a gravure coater.
- the impregnation can be repeated multiple times as needed. Further, at this time, it is also possible to repeat impregnation using a plurality of resin varnishes having different compositions and concentrations to finally adjust the desired composition and amount of resin.
- the organic solvent is volatilized from the resin layer (A stage) containing the resin composition before curing containing the organic solvent by heating to reduce or remove the organic solvent. Can be done.
- the fiber layer coated or impregnated with the resin composition (resin varnish) is heated under desired heating conditions, for example, 80 to 120 ° C. for 1 to 120 minutes to reduce or remove the organic solvent in an uncured or semi-cured state.
- the resin layer in the state (B stage) is obtained.
- the B stage of the resin composition that is, the uncured state (uncured product) or the semi-cured state (semi-cured product) is a state in which the resin composition can be further cured.
- the semi-curing state includes a state between the time when the viscosity starts to increase and the time before it is completely cured.
- the resin layer can be cured by further heating.
- the fiber layer coated or impregnated with the resin composition (resin varnish) is heated at a desired heating condition, for example, 80 to 200 ° C. for 1 to 120 minutes to obtain a cured resin layer (C stage).
- the C stage of the resin composition that is, the cured state (cured product) is a state in which the curing reaction proceeds and the resin is crosslinked so that it does not melt even when heated. As expected.
- the resin composition is previously applied to a desired plastic film, metal foil, or the like, and the resin composition before curing (A stage) containing an organic solvent is contained.
- a resin layer containing a substance or a resin layer in an uncured or semi-cured state (B stage) is obtained by heating at a desired heating condition, for example, 80 to 120 ° C. for 1 to 120 minutes. It is obtained by bonding this to the fiber layer and fixing it to the fiber layer by external energy such as pressure and heat. It may be a resin layer in an uncured or semi-cured state (B stage), or may be a resin layer in a cured state (C stage) by further curing the resin layer by heating.
- the fiber layer in the base material sheet is not particularly limited, but is preferably a cloth or a fiber having properties similar to cloth, for example, a woven fabric, a knitted fabric, a braid, a non-woven fabric, or a fiber layer composed of a combination thereof. Can be used.
- the fiber layer may be a unidirectionally arranged woven fabric. This has the advantage that a base sheet having elasticity only in a desired direction can be obtained.
- the above-mentioned woven fabric, knitted fabric, braid or non-woven fabric is preferably composed of plant fiber, animal fiber, synthetic fiber, semi-synthetic fiber, regenerated fiber, inorganic fiber or a combination thereof. ..
- the base material sheet of the present embodiment has elasticity
- any fiber layer may be used as long as the base sheet can be stretched by 5% or more at 25 ° C.
- the elastic modulus of the fiber layer is preferably about 0.01 MPa to 1 GPa
- the elongation rate is preferably about 1% or more and 1000% or less, and more preferably 5% or more and 1000% or less. That is, the fiber layer of the present embodiment does not include a base material such as glass cloth having almost no extensibility.
- examples of the fiber used for the fiber layer of the present embodiment include fibers generally used as a cloth. That is, examples of plant fibers include seed hair fibers such as cotton and kapok, bark fibers such as flax, timer, choma, jute, mitsumata, and mulberry, and leaf vein fibers such as Manila asa and sisal asa. Examples of animal fibers include wool, angora, cashmere, mohair, camels, alpaca, silk and the like. Animal fibers may contain leather, and include mammals such as cows, pigs, horses, sheep and goats, reptiles such as eels and snakes, birds such as ostriches, and fish such as sharks.
- plant fibers include seed hair fibers such as cotton and kapok, bark fibers such as flax, timer, choma, jute, mitsumata, and mulberry, and leaf vein fibers such as Manila asa and sisal asa.
- animal fibers include wool, angor
- Synthetic fibers include nylon fiber, aramid fiber, vinylon fiber, polyvinylidene chloride synthetic fiber, polyvinyl chloride synthetic fiber, polyester synthetic fiber, polyacrylonitrile synthetic fiber, polyethylene synthetic fiber, polypropylene synthetic fiber, polyurethane. Examples include system synthetic fibers and polylactic acid fibers. Synthetic fibers may include artificial leather and synthetic leather. Examples of the semi-synthetic fiber include acetate fiber and the like. Examples of the regenerated fiber include viscose fiber and cuprammonium fiber. Examples of the inorganic fiber include glass fiber, carbon fiber, metal fiber and the like.
- the cloth used for clothing can also be used as the fiber of the fiber layer.
- it may be, for example, a fabric used for a tent, a truck bed, or the like. As a result, it is possible to integrate the fabric and various LED elements into the fabric used in various situations.
- the thickness of the fiber layer is not particularly limited and can be appropriately set depending on the intended use. For example, if the thickness is 50 ⁇ m to 5000 ⁇ m, the elasticity is increased. It is preferable from the viewpoint of handleability.
- the fiber layer of the present embodiment is provided with conductive wiring.
- the conductive wiring contained in the fiber layer includes, for example, a thread-like metal wiring, a fiber obtained by kneading a conductive substance and spinning, a fiber obtained by plating the fiber with silver, copper, etc., and spattering. Examples thereof include fibers obtained by coating the fiber surface with a metal, fibers obtained by covering the above-mentioned thread-like metal wiring with a thread, and the like. Specific examples of the thread-like metal wiring include wiring made of copper, stainless steel, and aluminum.
- the light emitting sheet of the present embodiment includes a conductor layer on the surface or inside of the resin layer.
- the conductor layer 4 is provided on the surface (one side) of the resin layer 3 of the base material sheet 1, but the conductor layer 4 is provided on both sides or inside of the light emitting sheet. You can also.
- Examples of the conductor layer include wiring formed of a metal foil or a conductive composition, an ultrathinly coated conductor layer, a conductive thread, a metal molded product, a liquid metal, and the like.
- the conductor layer has a control circuit for sending a signal for controlling the LED element 5 described later from the LED control means 6, a voltage application circuit from the power supply means 8, and a wireless communication means 9. It plays a role as a transmission circuit of control information sent from a smartphone, a personal computer (PC), or the like.
- the metal foil is not particularly limited, and examples thereof include copper foil (plating), aluminum foil, stainless steel foil, etc., and these metal foils are metal foils surface-treated with a silane coupling agent or the like. You may.
- a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced by heat-pressing molding and laminating and integrating.
- one or more base sheet sheets are stacked, and a metal foil such as copper foil coated with a resin layer is layered on both upper and lower sides or a part or the entire surface thereof, and this is heat-press molded.
- a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced.
- one or more fiber layers that do not contain a resin layer are layered, and a metal foil such as copper foil coated with a resin layer is layered on both upper and lower sides, a part of one side, or the entire surface thereof, and this is heated and pressed.
- a metal foil such as copper foil coated with a resin layer
- a conductor layer By molding and laminating and integrating, a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced.
- a conductor layer (wiring) can be provided as a circuit on the surface of the laminate including the base sheet as described above.
- the metal foil is formed into a circuit by etching, it is preferable to mask the fiber layer so that it is not immersed in the etching solution.
- a cover film a solvent-resistant plastic film such as polyimide is provided with an opening in a desired shape, and a resin layer covered with a single-sided metal foil is attached so as to cover the opening.
- a resin layer covered with a single-sided metal foil is attached so as to cover the opening.
- This laminate is attached to a plastic plate with tape or the like so that the fiber layer does not come into contact with the etching solution, and the etching process is performed.
- a resin layer is provided in the shape of the opening, and a metal leaf circuit is formed on the surface thereof.
- Examples of the method for forming a circuit include circuit formation by a semi-additive method (SAP: Semi Adaptive Process) and a modified semi-additive method (MSAP: Modified Semi Adaptive Process), in addition to the methods described above. Further, by laminating these with a resin layer in an uncured or semi-cured state, or a base sheet containing the resin layer, a laminated body containing a conductor layer can be produced.
- SAP Semi Adaptive Process
- MSAP Modified Semi Adaptive Process
- a copper foil When a copper foil is further used as the conductor layer in the light emitting sheet of the present embodiment, it has heat resistance and the solder gets wet well, so that it becomes possible to mount a component (LED element) in the reflow process. It is possible to provide a fabric device or the like having high operation reliability. Further, the LED elements can be mounted on both sides by various means, or the mounted LED elements can be further included.
- the conductor layer of the present embodiment may be formed of a conductive composition.
- the conductive composition of the present embodiment is preferably a conductive composition having elasticity. As a result, it is possible to obtain a fabric device or the like that does not impair the extensibility and elasticity of the base material sheet and has excellent operation reliability.
- the following is a specific example of a stretchable conductive composition.
- the conductive composition contains a resin (D) serving as an elastic binder, a curing agent (E) that reacts with the resin (D), and a conductive filler (F), and the resin.
- (D) has a functional group having a functional group equivalent of 400 g / eq or more and 10000 g / eq or less, and the cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) thereof.
- Tg glass transition temperature
- the softening point is 40 ° C or less, or the elastic modulus at 30 ° C is less than 1.0 GPa
- the conductive filler (F) has an intrinsic volume resistivity at room temperature of 1 ⁇ 10 -4 ⁇ .
- Examples thereof include a resin composition composed of a conductive substance having a size of cm or less.
- Examples of the functional group include an epoxy group, a vinyl group, a (meth) acryloyl group, a hydroxyl group, a carboxyl group, an amino group, an alkoxy group, and a carbonyl group.
- the component of the molecular structure of the resin (D) may be a single component, or a plurality of types may be used in combination at an arbitrary ratio. It is preferable that the molecular structure of the resin (D) is a molecular structure containing at least one selected from (meth) acrylic acid ester, styrene, and nitrile as a component. Specific examples thereof are preferably epoxy-modified (meth) acrylic acid ester, hydroxyl group-modified (meth) acrylic acid ester, carboxyl group-modified (meth) acrylic acid ester, and the like.
- the resin (D) preferably has a weight average molecular weight of 50,000 or more.
- the upper limit of the weight average molecular weight is not particularly limited, but if the molecular weight exceeds 3 million, the viscosity may increase and the handleability may decrease, so that the weight average molecular weight range of the resin (D) is preferable. Is 50,000 or more and 3 million or less, more preferably 100,000 or more and 1 million or less.
- curing agent (E) various curing agents can be used without particular limitation as long as they have reactivity with the resin (D) as described above.
- Specific examples of the curing agent (E) include imidazole compounds, amine compounds, phenol compounds, acid anhydride compounds, isocyanate compounds, mercapto compounds, onium salts, radical generators such as peroxides, and light. Examples include acid generators.
- the conductive filler (F) is made of a conductive substance having an intrinsic volume resistivity of 1 ⁇ 10 -4 ⁇ ⁇ cm or less at room temperature.
- the volume resistivity of the conductive composition is approximately 1 ⁇ 10 -3 ⁇ ⁇ , although it depends on the blending amount. It is cm to 1 x 10 -2 ⁇ ⁇ cm. Therefore, in the case of a circuit, the resistance value becomes high and the power loss becomes large.
- Examples of the conductive substance include simple substances composed of metal elements such as silver, copper, and gold, and oxidation containing these elements. Examples include compounds such as substances, nitrides, carbides and alloys.
- a conductive or semi-conductive conductive auxiliary agent may be added to the conductive composition for the purpose of further improving the conductivity.
- a conductive or semi-conductive auxiliary agent a conductive polymer, an ionic liquid, carbon black, acetylene black, carbon nanotubes, an inorganic compound used as an antistatic agent, or the like can be used, and only one kind can be used. It may be used or two or more types may be used at the same time.
- the conductive filler (F) preferably has a flat shape, and preferably has a thickness and an aspect ratio in the in-plane longitudinal direction of 10 or more.
- the aspect ratio is 10 or more, the surface area of the conductive filler with respect to the mass ratio becomes large, and not only the efficiency of conductivity is improved, but also the adhesion with the resin component is improved and the elasticity is improved. ..
- the aspect ratio is 1000 or less, it is preferably 10 or more and 1000 or less, and more preferably 20 or more and 500 or less, from the viewpoint of ensuring better conductivity and printability.
- Examples of the conductive filler having such an aspect ratio include a conductive filler having a tap density of 6.0 g / cm 3 or less measured by the tap method. Further, when the tap density is 2.0 g / cm 3 or less, the aspect ratio is further increased, which is more preferable.
- the blending ratio of the conductive filler (F) in the conductive composition is 40 to 95% by mass in terms of mass ratio. It is preferable in terms of conductivity, cost, and printability, and more preferably 60 to 85% by mass.
- the particle size of the conductive filler (F) used in the present embodiment is not particularly limited, but it was measured by a laser light scattering method from the viewpoint of printability at the time of screen printing and an appropriate viscosity in kneading of the formulation.
- the average particle size (particle size at a cumulative volume of 50%; D50) is preferably 0.5 ⁇ m or more and 30 ⁇ m or less, and more preferably 1.5 ⁇ m or more and 20 ⁇ m or less.
- the conductive filler (F) is preferably a conductive filler whose surface is coupled.
- the conductive composition of the present embodiment may contain a coupling agent. This has the advantage that the adhesion between the binder resin and the conductive filler is further improved.
- the coupling agent to be added to the conductive composition or for coupling the conductive filler can be used without particular limitation as long as it adsorbs to the filler surface or reacts with the filler surface.
- Examples thereof include silane coupling agents, titanate-based coupling agents, aluminum-based coupling agents and the like.
- the addition amount thereof is preferably about 1% by mass to 20% by mass with respect to the entire conductive composition.
- the ratio of each component in the conductive composition is not particularly limited as long as the effect of the present invention can be exhibited, and the compounding ratio of the (F) resin: the (G) curing agent is the resin and the curing. Depending on the type of agent, it can be appropriately determined in consideration of the equivalent ratio and the like.
- additives and the like can be added to the conductive composition depending on the purpose.
- additives include elastomers, surfactants, dispersants, colorants, fragrances, plasticizers, pH adjusters, viscosity regulators, ultraviolet absorbers, antioxidants, lubricants and the like.
- the method for preparing the conductive composition is not particularly limited as long as the conductive composition can be produced.
- a method for preparing the conductive composition for example, the above-mentioned resin component, the conductive filler, a curing agent, a dispersant, or the like, if necessary, and a solvent are mixed and stirred so as to be uniform. Examples thereof include a method for obtaining a conductive composition.
- the mixing / stirring method is not particularly limited, and a high shear dispersion device such as a rotation-revolution mixer or a three-roll mill is preferably used. Further, vacuum defoaming may be performed.
- a -Conductor layer using the conductive composition By applying or printing the conductive composition of the present embodiment on the resin layer of the base material sheet as described above, a coating film of the conductive composition is formed. It is possible to form a conductor layer such as a desired wiring (conductive pattern).
- the conductive pattern or the like formed by the wiring can be formed on the surface of the base material sheet by the following steps. That is, first, a coating film is formed by applying or printing the conductive composition of the present embodiment on the resin layer, and the volatile components contained in the coating film are removed by drying. The resin (D) and the curing agent (F) are cured by the subsequent curing steps such as heating, electron beam, and light irradiation, and the coupling agent and the conductive filler (F) are combined with the resin (D). By the step of reacting with the curing agent (F), a conductive pattern by elastic wiring can be formed. Each condition in the curing step and the reaction step is not particularly limited, and may be appropriately set depending on the type of resin, curing agent, filler, etc. and the desired form.
- the step of applying the conductive composition of the present embodiment onto the substrate is not particularly limited, and is, for example, a coating method such as an applicator, a wire bar, a comma roll, or a gravure roll, a screen, a flat plate offset, a flexo, an inkjet, or a stamping. , Dispens, squeegee, etc. can be used.
- the conductor layer may be formed inside the base material sheet.
- a conductor layer or wiring may be formed by coating, printing, or the like on both sides or a part or the entire surface of the material sheet. Further, a plurality of conductor layers may be connected by sewing with a conductive thread. Further, a plurality of conductor layers may be connected by a metal molded product such as a rivet or a snap button.
- liquid metal when a liquid metal is used, it is preferable to form a conductor layer made of the liquid metal by enclosing the liquid metal in a sealed passage formed in the base sheet.
- liquid metal according to the present embodiment include liquid metals as described in US Patent Application Publication No. 2018/0315518 and US Patent Application Publication No. 2018/0247727.
- the LED element used in the present embodiment is not particularly limited as long as it emits light, and an appropriate LED element can be appropriately selected depending on the application of the light emitting sheet.
- the LED element of the present embodiment may be an LED element that emits at least one selected from visible light, ultraviolet rays, and infrared rays.
- visible light when the light emitting sheet is used for a display device, visible light is used, when it is used for a sterilizing device, a deodorizing device, etc., ultraviolet light is used, and when it is used for a security system, a distance measuring device, a signal transmitting device, etc.
- the type of light emitted by the LED element can be appropriately selected.
- different types of LED elements such as displaying the ON / OFF of the invisible light LED with visible light may be combined.
- the LED element 5 is electrically connected to the conductor layer 4. As shown in FIG. 1, in the present embodiment, the LED element 5 is arranged on the conductor layer 4, and emits light by, for example, a current flowing through the conductor layer 4 from a power supply means or the like described later. be able to.
- the light emitting sheet of the present embodiment further includes an LED control means 6 for controlling light emission of the LED element.
- the LED control means 6 is laid on the base material sheet 1 so as to be communicable with the LED element 5.
- the LED control means 6 can be used by any means without particular limitation as long as it can control the above-mentioned LED element 5. For example, various LED drivers, various switches and the like can be mentioned.
- the light emitting signal emitted from the LED control means makes it possible to operate (light up) or stop the LED element, and to adjust the brightness of the light emission. That is, when the desired signal data is input to the LED control means, processing corresponding to the signal protocol input by the LED control means is performed, a light emission signal is transmitted to the LED element, and the information of the light emission signal is struck.
- the LED element emits light depending on the brightness.
- the image to be displayed can be adjusted by the display signal sent from the LED control means.
- the same light emitting signal may be repeatedly transmitted from the LED control means, and when the display image is a moving image, the light emitting signal may be sequentially changed and sent from the LED control means.
- the signal data to be sent to the LED control means of the present embodiment may be sent by a wired communication means or may be sent by a wireless communication means. From the viewpoint of convenience, it is preferable that the light emitting sheet of the present embodiment has the wireless communication means 9 as shown in FIG.
- Wired communication means include a method of providing a control switch in a control circuit in the form of a base sheet, a method of connecting to a smartphone or a PC with a cable via a connection means such as USB, and a method of connecting to a PC using a wired LAN cable.
- various wireless communication protocols can be used, for example, close range wireless communication such as NFC, Bluetooth (registered trademark), WPAN such as IrDA, UWB, ZigBee, WLAN such as Wi-Fi, and the like.
- WMAN such as WiMAX, WWAN such as LTE, and the like can be mentioned. Since the light emitting sheet as shown in FIG. 3 includes the wireless communication means 9, the LED control means 6 can be operated by wireless communication by, for example, a smartphone or the like via the wireless communication means 9.
- the LED control means may also include a memory such as a flash memory, and can store a complicated display (still image, moving image) signal in the memory when used in a display device or the like. ..
- the signal data or the like is transmitted by appropriately selecting and using a known transmitter / receiver depending on whether it is wireless communication or wired communication, and can be received by the LED control means.
- the light emitting sheet of the present embodiment may further have the following configuration.
- the light emitting sheet according to the present embodiment further includes ventilation holes 7 and 7'that can be ventilated in the thickness direction.
- the ventilation holes 7 may penetrate from the opening formed on one surface of the base sheet 1 toward the opening formed on the other surface, and the opening may be opened. It may be a place where there is no resin layer 3 and only the fiber layer 2 like the ventilation hole 7'shown.
- the penetrating opening may be reinforced with eyelets or the like.
- the light emitting sheet according to the present embodiment can, for example, move the moisture (moisture) existing on one surface side to the other surface side through the ventilation holes 7 and 7'. That is, in the light emitting sheet of the present embodiment, since the ventilation holes 7 and 7'can allow moisture to escape, the air permeability is excellent and it is possible to prevent the moisture from remaining on one surface. As a result, when the light emitting sheet is applied to a wearable device that is used by attaching it to an object, especially a patch device that is used by directly attaching it to a human body or by attaching it to clothes, etc., it dissipates moisture such as sweat. Therefore, it is considered to be more useful.
- the presence of such a vent may cause the light emitting sheet to break or be blown by the wind. It also has the advantage of being able to prevent it from being damaged. It can also contribute to cooling the LED element.
- the number of ventilation holes formed in the light emitting sheet is not particularly limited, but it is preferable that a plurality of ventilation holes are formed in the light emitting sheet from the viewpoint of improving air permeability.
- the shape of the opening of the ventilation hole is preferably a shape that is hard to break when the light emitting sheet is expanded and contracted in the plane direction, and more preferably a shape that is hard to close, that is, a shape that is easy to maintain a wide open state. .. Examples of such a shape include a circular shape, an elliptical shape, a polygonal shape, and the like as the shape of the light emitting sheet in the plane direction. When a plurality of ventilation holes are formed, the openings may all have the same shape, but may be a combination of different shapes.
- the aperture ratio of the openings of the ventilation holes (the total area of the ventilation holes with respect to the total area in the surface direction of the light emitting sheet including the total area of the ventilation holes) is not particularly limited as long as the ventilation can be secured.
- the aperture ratio is preferably 0.001 to 45%, more preferably 0.01 to 20%.
- excellent air permeability can be exhibited while maintaining the strength of the light emitting sheet, so that more excellent air permeability can be exhibited.
- the total area of the openings of the ventilation holes is the area obtained by adding all the areas of the openings of the plurality of ventilation holes formed in the surface direction of the light emitting sheet.
- the size of the opening of the ventilation hole is not particularly limited as long as the ventilation hole has a size capable of ventilating in the thickness direction of the light emitting sheet, and can be appropriately selected depending on the use of the light emitting sheet.
- the light emitting sheet of the present embodiment may further include a power supply means for supplying electric power to the LED element and the LED control means (further, if necessary, a wireless communication means).
- the power supply means is not particularly limited, and in addition to a general battery (battery), various wireless power supply means such as electromagnetic induction, magnetic field resonance, electric field coupling, laser, ultrasonic wave, wired power supply means by a plug, etc. can be used. It is possible.
- a direct current (DC) power source is generally used as the power source, but a higher voltage alternating current (AC) power source may be used. You may.
- the light emitting sheet of the present embodiment may further include other electronic components in addition to the LED element.
- the electronic components that can be mounted are not particularly limited, and are general passive elements, active elements, integrated circuits, displays, motors, speakers, piezoelectric elements, switches, fuses, antennas, heat sinks, acceleration sensors, temperature sensors, humidity sensors, and light. Examples include sensors, ultrasonic sensors, pH sensors, gas sensors, moving body sensors, angle sensors, magnetic sensors, gyro sensors, pressure sensors, orientation sensors, radiation sensors, sound sensors, GPS receivers and the like.
- the light emitting sheet of the present embodiment is, for example, a film-like light-emitting sheet in which the fiber layer is immersed in a thermosetting resin composition constituting the resin layer as described above, the resin composition is applied to the fiber layer, or the fiber layer is coated with the resin composition. It is obtained by providing a conductor layer as described above, an LED element, and, if necessary, an LED control means on a base material sheet formed by bonding the resin composition to a fiber layer or the like.
- thermosetting resin composition is not particularly limited, and examples thereof include a bar coater, a comma coater, a die coater, a roll coater, a gravure coater, and an inkjet.
- the impregnation can be repeated multiple times as needed. Further, at this time, it is also possible to repeat impregnation using a plurality of resin varnishes having different compositions and concentrations to finally adjust the desired composition and amount of resin.
- the organic solvent is volatilized from the resin layer (A stage) containing the resin composition before curing containing the organic solvent by heating to reduce or remove the organic solvent. Can be done.
- the fiber layer coated or impregnated with the resin composition (resin varnish) is heated under desired heating conditions, for example, 80 to 120 ° C. for 1 to 120 minutes to reduce or remove the organic solvent in an uncured or semi-cured state.
- the resin layer in the state (B stage) is obtained.
- the B stage of the resin composition that is, the uncured state (uncured product) or the semi-cured state (semi-cured product) is a state in which the resin composition can be further cured.
- the semi-curing state includes a state between the time when the viscosity starts to increase and the time before it is completely cured.
- the resin layer can be cured by further heating.
- the heat insulating layer coated or impregnated with the resin composition is heated at a desired heating condition, for example, 80 to 200 ° C. for 1 to 120 minutes to obtain a cured resin layer (C stage).
- the C stage of the resin composition that is, the cured state (cured product) is a state in which the curing reaction proceeds and the resin is crosslinked so that it does not melt even when heated. As expected.
- the resin composition is previously applied to a desired plastic film, metal foil, or the like, and before curing (A stage) containing an organic solvent.
- the resin layer containing the resin composition of the above, or a resin layer in an uncured or semi-cured state (B stage) is obtained by heating at a desired heating condition, for example, 80 to 120 ° C. for 1 to 120 minutes. It is obtained by bonding this to the fiber layer and fixing it to the heat insulating layer by external energy such as pressure and heat. Further, as a result, a heat insulating sheet having a surface roughness Rz within a specified range can be obtained. It may be a resin layer in an uncured or semi-cured state (B stage), or may be a resin layer in a cured state (C stage) by further curing the resin layer by heating.
- a conductor layer As a conductor layer, a wiring formed of a metal foil or a conductive composition as described above, an ultrathinly coated conductive layer, or the like is provided.
- the method of providing the conductor layer is as described above.
- the LED element is installed on the conductor layer, but the mounting method thereof is not particularly limited.
- a method using a soldering iron or various cream solders are printed and then mounted on various component mounting devices. Examples thereof include a method of mounting an LED element and mounting it by various reflow devices.
- a means for heating only the metal portion by induction heating, microwaves, or the like.
- the method for forming the ventilation holes is not particularly limited, and for example, the ventilation holes are formed on the base material sheet by using a drill, a laser, punching, or the like. How to do it, etc. Further, a method of adhering a resin layer having an opening in advance to the fiber layer may be used.
- the light emitting sheet of the present embodiment can be used for various applications in which wearability, shape followability, and heat resistance are high. Specifically, it can be used, for example, in a display device, an ultraviolet irradiation device, an infrared irradiation device, a sterilizer, clothing, clothing, and the like.
- display devices include digital signage, electronic paper, outdoor advertisement display devices, various flexible displays, lighting, and the like.
- the display device such as digital signage using the light emitting sheet of the present embodiment is excellent in that it is flexible and light, it can be manufactured at a low price even when it has a large screen, and it can be attached to a cloth such as cloth. Has as an advantage.
- the display device of the present embodiment includes a cloth and a display unit formed on the cloth, and at least a part of the display unit is formed by using a light emitting sheet as described above. ..
- the cloth is not particularly limited, but a cloth such as a polyester-based synthetic fiber can be used.
- the ultraviolet irradiation device using the light emitting sheet of the present embodiment includes a cloth and an ultraviolet irradiation portion formed on the cloth, and at least a part of the ultraviolet irradiation portion is formed by using the light emitting sheet as described above.
- the ultraviolet irradiation device includes, for example, an ultraviolet irradiation glove (glove) as shown in FIG. 4, an ultraviolet irradiation sheet as shown in FIG. 6, and the like. Can be mentioned. A sterilization treatment or the like can be performed using such an ultraviolet irradiation device.
- the ultraviolet irradiation (sterilization) glove is obtained by providing a wiring 4 as a conductor layer on a glove composed of a base material sheet 1 composed of, for example, a cloth, a synthetic fiber, or a resin layer, and the wiring 4 is provided on the glove.
- a plurality of LED elements 5 can be mounted on the vehicle.
- LED control means 6, wireless communication means 9, power supply means (battery) 8, and the like may be provided around the wrist of the glove.
- the light emitted by the LED element included in the light emitting sheet is ultraviolet light (deep ultraviolet light).
- a usage pattern of such a sterilizing glove for example, as shown in FIG.
- the on / off of the LED element can be controlled only by grasping or opening the hand with the sterilizing glove. May be good.
- the sterilization / sterilization treatment by ultraviolet rays deep ultraviolet rays
- the sterilization / sterilization treatment by ultraviolet rays can be performed without touching the target to be sterilized / sterilized.
- the light emitting sheet when used for the ultraviolet irradiation (sterilization) sheet, as shown in FIG. 6, a plurality of light emitting sheets are placed on the base sheet 1 via a conductor layer (not shown).
- An LED element (ultraviolet ray) 5 can be mounted. It is considered that such a sterilization sheet can be easily sterilized in a wide range by covering it with bedding such as a bed, furniture, or the like.
- the irradiation device an infrared irradiation device by changing the LED element to one that can irradiate infrared rays instead of ultraviolet rays.
- the infrared irradiation device can be used for applications such as an infrared heater and an infrared communication means.
- the light emitting sheet of the present embodiment to clothing or clothing, it is possible to display desired images, characters, moving images, etc. on the clothing or clothing.
- the light emitting sheet it is possible to take in light at low cost into clothes and the like that are flexible and susceptible to wear.
- the above-mentioned display device, ultraviolet irradiation device, infrared irradiation device, clothing, etc. can be manufactured by a known method using the above-mentioned light emitting sheet.
- a desired display device, irradiation device, clothing, or the like can be formed by attaching a light emitting sheet as described above to the cloth or replacing a part of the cloth with the light emitting sheet as described above.
- the light emitting sheet of this embodiment has heat resistance, it is possible to mount an LED element or the like by reflow as described above.
- various heating means such as welding, soldering iron, induction heating, and microwave can be used. Even if it is a means capable of local heating, since the resin layer has heat resistance, it does not melt or thermally decompose. It can also be implemented by ACF or the like.
- the resin layer has heat resistance, so that it does not melt or thermally decompose.
- the present invention has a wide range of industrial applicability in the technical field relating to a light emitting sheet and various devices using the same.
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Abstract
An aspect of the present invention pertains to a light emission sheet comprising a base sheet, a conductor layer, an LED element, and an LED control means. The base sheet includes a fiber layer and a resin layer that is formed on at least a portion of a surface on one side of the fiber layer. The base sheet can be stretched by at least 5% at 25°C. The conductor layer is formed on a surface of or inside the resin layer. The LED element is electrically connected to the conductor layer. The LED control means is provided on the base sheet in a manner that allows the LED control means to communicate with the LED element.
Description
本発明は、様々な場面で使用可能な発光装置や表示装置として使用できる発光シート、並びに、それを用いた表示装置、殺菌装置、衣類および服飾品等に関する。
The present invention relates to a light emitting device that can be used in various situations, a light emitting sheet that can be used as a display device, and a display device, a sterilizer, clothing, clothing, etc. using the same.
エレクトロニクス分野、特にディスプレイ、センサ、ロボット用人工皮膚などの様々なインターフェースに用いられるデバイスや導電材料に対し、装着性や形状追従性の要求が高まっている。用途に応じて、曲面や凹凸面などに配置したり自由に変形させたりすることが可能な柔軟なデバイスが要求されつつある。
There is an increasing demand for wearability and shape followability for devices and conductive materials used in various interfaces such as displays, sensors, and artificial skin for robots in the electronics field. There is a growing demand for flexible devices that can be placed on curved surfaces, uneven surfaces, etc., or freely deformed, depending on the application.
そのような柔軟性を有するディスプレイ（画像表示装置）として、近年では、フレキシブルな大画面ディスプレイ（例えば、特許文献１）や、衣類に光を取り入れるためのフレキシブルなファブリック封入ライトアレイ（例えば、特許文献２）等が報告されている。
As a display (image display device) having such flexibility, in recent years, a flexible large screen display (for example, Patent Document 1) and a flexible fabric-encapsulated light array for taking light into clothing (for example, Patent Document 1). 2) etc. have been reported.
より具体的には、特許文献１では、第１のベース基板にＬＥＤとその発光を制御する制御回路とを有するピクセル表示部を、第２のベース基板上に複数個配列して構成される表示ユニットを備えた大画面ディスプレイであって、さらに透過性のある素材（薄ガラス、絶縁材料や布生地等）で構成される第３の基板を有していてもよいディスプレイが記載されている。
More specifically, in Patent Document 1, a display configured by arranging a plurality of pixel display units having an LED and a control circuit for controlling light emission thereof on the first base board on the second base board. Described is a large screen display comprising a unit, which may further have a third substrate made of a transmissive material (thin glass, insulating material, cloth, etc.).
一方、特許文献２には、フレキシブルプリント配線板と、接触トレースと、ＬＥＤと、制御回路を備えるフレキシブツライトアレイを、フレキシブルポケットに封入して、衣類に固定することによって、衣類に画像を表示するシステムが開示されている。
On the other hand, in Patent Document 2, a flexible printed wiring board, a contact trace, an LED, and a flexible light array including a control circuit are enclosed in a flexible pocket and fixed to clothing to display an image on clothing. The system to do is disclosed.
しかしながら、前記特許文献１記載の技術では、布生地等で構成される第３のベースと、第２のベースが一体化されておらず、剥離や破断が起こりやすいという問題が生じる可能性が高い。また、前記特許文献２におけるフレキシブルプリント配線板（ＰＣＢ）はポリイミドフィルムで作られているため、伸縮性に乏しいことが予想される。
However, in the technique described in Patent Document 1, there is a high possibility that the third base made of cloth or the like and the second base are not integrated, and there is a high possibility that peeling or breaking is likely to occur. .. Further, since the flexible printed wiring board (PCB) in Patent Document 2 is made of a polyimide film, it is expected that the flexible printed wiring board (PCB) has poor elasticity.
本発明は、このような実情に鑑みてなされたものであり、様々な用途に使用できる、伸縮性や耐久性等に優れた発光シートを提供することを課題とする。
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting sheet having excellent elasticity, durability, etc., which can be used for various purposes.
本発明者等は、鋭意検討した結果、下記構成の発光シートによって上記課題を解消し得ることを見出し、かかる知見に基づいて更に検討を重ねることによって本発明を完成した。
As a result of diligent studies, the present inventors have found that the above-mentioned problems can be solved by a light emitting sheet having the following configuration, and have completed the present invention by further studies based on such findings.
すなわち、本発明の一つの局面に関する発光シートは、基材シートと、導体層と、ＬＥＤ素子と、ＬＥＤ制御手段とを備え、前記基材シートは、繊維層と前記繊維層の一方の面における表面の少なくとも一部に形成されている樹脂層とを含み、且つ２５℃において５％以上の伸長が可能であり、前記導体層は、前記樹脂層の表面または内部に形成されており、前記ＬＥＤ素子は前記導体層に電気的に接続されており、前記ＬＥＤ制御手段は前記基材シート上において前記ＬＥＤ素子と通信可能に敷設されていることを特徴とする。
That is, the light emitting sheet according to one aspect of the present invention includes a base material sheet, a conductor layer, an LED element, and an LED control means, and the base material sheet is on one surface of the fiber layer and the fiber layer. It contains a resin layer formed on at least a part of the surface and can be stretched by 5% or more at 25 ° C., and the conductor layer is formed on the surface or inside of the resin layer, and the LED. The element is electrically connected to the conductor layer, and the LED control means is laid on the base material sheet so as to be communicable with the LED element.
さらに、本発明は、上記発光シートを備える、表示装置、紫外線照射装置、衣類および紫外線照射装置なども包含する。
Further, the present invention also includes a display device, an ultraviolet irradiation device, clothing, an ultraviolet irradiation device, and the like provided with the above-mentioned light emitting sheet.
以下、本発明に係る実施形態について具体的に説明するが、本発明はこれらに限定されるものではない。
Hereinafter, embodiments according to the present invention will be specifically described, but the present invention is not limited thereto.
＜発光シート＞
まず、本実施形態の発光シートの基本構成について説明する。以下の説明において、各符号はそれぞれ：１ 基材シート、２ 繊維層、３ 樹脂層、４ 導体層、５ ＬＥＤ素子、６ ＬＥＤ制御手段、７、７’ 通気孔、８ 電源供給手段、９ 無線通信手段を示す。 <Light emitting sheet>
First, the basic configuration of the light emitting sheet of the present embodiment will be described. In the following description, each reference numeral is 1 base sheet, 2 fiber layer, 3 resin layer, 4 conductor layer, 5 LED element, 6 LED control means, 7, 7'vent, 8 power supply means, 9 radio. Indicates a communication means.
まず、本実施形態の発光シートの基本構成について説明する。以下の説明において、各符号はそれぞれ：１ 基材シート、２ 繊維層、３ 樹脂層、４ 導体層、５ ＬＥＤ素子、６ ＬＥＤ制御手段、７、７’ 通気孔、８ 電源供給手段、９ 無線通信手段を示す。 <Light emitting sheet>
First, the basic configuration of the light emitting sheet of the present embodiment will be described. In the following description, each reference numeral is 1 base sheet, 2 fiber layer, 3 resin layer, 4 conductor layer, 5 LED element, 6 LED control means, 7, 7'vent, 8 power supply means, 9 radio. Indicates a communication means.
本実施形態の発光シートは、図１に示すように、基材シート（繊維シート）１と、導体層４と、ＬＥＤ素子５と、ＬＥＤ制御手段６を備える。前記基材シートは、繊維層と前記繊維層の一方の面における表面の少なくとも一部に形成されている樹脂層とを含み、且つ２５℃において５％以上の伸長が可能である。前記導体層は、前記樹脂層の表面または内部に形成されており、前記ＬＥＤ素子は前記導体層に電気的に接続されており、前記ＬＥＤ制御手段は前記基材シート上において前記ＬＥＤ素子と通信可能に敷設されている。
As shown in FIG. 1, the light emitting sheet of the present embodiment includes a base sheet (fiber sheet) 1, a conductor layer 4, an LED element 5, and an LED control means 6. The base material sheet contains a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and can be stretched by 5% or more at 25 ° C. The conductor layer is formed on the surface or inside of the resin layer, the LED element is electrically connected to the conductor layer, and the LED control means communicates with the LED element on the base material sheet. It is laid as possible.
このような構成により、柔軟であり、かつ、軽量でありながら強度や耐久性を備えた発光シートを提供することができる。
With such a configuration, it is possible to provide a light emitting sheet that is flexible, lightweight, and has strength and durability.
また、本実施形態によれば様々な用途に使用できる、伸縮性や耐久性等に優れた発光シートを提供できる。本発明の発光シートは、柔軟で変形に強く、かつ、軽量でありながら強度や耐久性を備えており、また、基材シートを構成する生地等の特性を損なうことなく生地と一体化できる。よって、本発明の発光シートを使用すれば、伸縮に対する耐久性の高い優れた表示装置、殺菌装置、画像表示可能な衣類等を提供することができる。
Further, according to the present embodiment, it is possible to provide a light emitting sheet having excellent elasticity and durability that can be used for various purposes. The light emitting sheet of the present invention is flexible, resistant to deformation, lightweight, yet has strength and durability, and can be integrated with the fabric without impairing the characteristics of the fabric or the like constituting the base sheet. Therefore, by using the light emitting sheet of the present invention, it is possible to provide an excellent display device, a sterilizer, clothing capable of displaying an image, etc., which have high durability against expansion and contraction.
（基材シート）
本実施形態に係る基材シート１は、上述の通り、繊維層と前記繊維層の一方の面における表面の少なくとも一部に形成されている樹脂層とを含み、且つ２５℃において５％以上の伸長が可能である。本実施形態において、樹脂層は、繊維層全体に形成されているわけではなく、繊維層の表もしくは裏のいずれか一方の面の少なくとも一部に形成されている。 (Base sheet)
As described above, thebase material sheet 1 according to the present embodiment includes a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and is 5% or more at 25 ° C. Elongation is possible. In the present embodiment, the resin layer is not formed on the entire fiber layer, but is formed on at least a part of either the front or back surface of the fiber layer.
本実施形態に係る基材シート１は、上述の通り、繊維層と前記繊維層の一方の面における表面の少なくとも一部に形成されている樹脂層とを含み、且つ２５℃において５％以上の伸長が可能である。本実施形態において、樹脂層は、繊維層全体に形成されているわけではなく、繊維層の表もしくは裏のいずれか一方の面の少なくとも一部に形成されている。 (Base sheet)
As described above, the
２５℃において５％の伸長が可能とは、本実施形態に係る基材シート１を一方向に伸ばした際に少なくとも５％の伸張までは破断することがないという意味であり、基材シートを所定のサイズにカットし、一定の移動速度で引っ張った時に破断するまでの伸び率を算出することによって測定することが可能である。５％の伸長が可能な基材シートによって、生地の風合いを損なうことなく生地と一体化し、伸縮に対する耐久性の高い電子基板や回路基板を提供することができる。また、伸長可能な上限は、特に限定されないが、１００％もあれば十分である。
The fact that the base sheet 1 according to the present embodiment can be stretched by 5% at 25 ° C. means that when the base sheet 1 according to the present embodiment is stretched in one direction, the base sheet is not broken until it is stretched by at least 5%. It is possible to measure by cutting to a predetermined size and calculating the elongation rate until it breaks when pulled at a constant moving speed. The base sheet capable of stretching by 5% can be integrated with the fabric without impairing the texture of the fabric, and can provide an electronic board or a circuit board having high durability against expansion and contraction. Further, the upper limit of extendability is not particularly limited, but 100% is sufficient.
本実施形態において、前記基材シートは、樹脂層が形成されている部位における初期引張弾性率が１ＭＰａ以上１０ＧＭＰａ以下であることが好ましい。基材シートに含まれる繊維層の初期引張弾性率が１ＭＰａ未満であっても、樹脂層を形成することによって、前記基材シートの初期引張弾性率を１ＭＰａ以上とできる。
In the present embodiment, the base sheet preferably has an initial tensile elastic modulus of 1 MPa or more and 10 GMPa or less at the portion where the resin layer is formed. Even if the initial tensile elastic modulus of the fiber layer contained in the base material sheet is less than 1 MPa, the initial tensile elastic modulus of the base material sheet can be set to 1 MPa or more by forming the resin layer.
本実施形態において、初期引張弾性率とは、前記シートを１％伸長させた時の弾性率を意味する。
In the present embodiment, the initial tensile elastic modulus means the elastic modulus when the sheet is stretched by 1%.
前記初期引張弾性率が１ＭＰａ未満となると、復元力が劣り元の形状に戻らないといった不具合があるため好ましくない。また、前記初期引張弾性率が１０ＧＰａを超えると、伸縮性が劣り、例えば、本実施形態の発光シートを衣類等に用いた場合、着心地がよくないといった不具合があるという点で好ましくない。前記基材シートのより好ましい初期引張弾性率は５ＭＰａ以上、１ＧＰａ以下、さらに好ましくは５ＭＰａ以上、５００ＭＰａ以下である。
If the initial tensile elastic modulus is less than 1 MPa, there is a problem that the restoring force is inferior and the original shape is not restored, which is not preferable. Further, if the initial tensile elastic modulus exceeds 10 GPa, the elasticity is inferior, and for example, when the light emitting sheet of the present embodiment is used for clothing or the like, there is a problem that it is not comfortable to wear, which is not preferable. The initial tensile elastic modulus of the base sheet is 5 MPa or more and 1 GPa or less, more preferably 5 MPa or more and 500 MPa or less.
なお、本実施形態における初期引張弾性率は、基材シートを所定のサイズにカットし、一定の移動速度で１％（伸長％）まで引っ張った時の弾性率を算出するという方法で測定することができる。具体的には、基材シートを５０ｍｍ＊１００ｍｍにカットし、万能試験機（株式会社島津製作所社製ＡＧＳ－Ｘ）に取り付ける。初期つかみ具間距離：５０ｍｍ、引張速度：１００ｍｍ／ｍｉｎで試験を行い、０～０．０１の歪（ｒ）に対応するすべての応力（σ）データから最小二乗法を用いてｒ－σの傾きを算出し、初期引張弾性率とする。
歪（ｒ）＝ｘ／ｘ０（ｘはつかみ具の移動距離、ｘ０は初期つかみ具間距離）
応力（σ）＝Ｆ／（ｄ・ｌ）（Ｆは試験力、ｄはフィルム膜厚、ｌは試験片の幅)
また、基材シートが破断するまで引っ張った時の歪（ｒ）から伸び率を算出する。 The initial tensile elastic modulus in the present embodiment is measured by a method of calculating the elastic modulus when the base sheet is cut to a predetermined size and pulled to 1% (elongation%) at a constant moving speed. Can be done. Specifically, the base sheet is cut to 50 mm * 100 mm and attached to a universal testing machine (AGS-X manufactured by Shimadzu Corporation). The test was performed at the initial grip distance: 50 mm and the tensile speed: 100 mm / min, and from all the stress (σ) data corresponding to the strain (r) of 0 to 0.01, the least squares method was used to determine r-σ. Calculate the slope and use it as the initial tensile elastic modulus.
Distortion (r) = x / x0 (x is the moving distance of the gripping tool, x0 is the distance between the initial gripping tools)
Stress (σ) = F / (d · l) (F is the test force, d is the film thickness, l is the width of the test piece)
Further, the elongation rate is calculated from the strain (r) when the base sheet is pulled until it breaks.
歪（ｒ）＝ｘ／ｘ０（ｘはつかみ具の移動距離、ｘ０は初期つかみ具間距離）
応力（σ）＝Ｆ／（ｄ・ｌ）（Ｆは試験力、ｄはフィルム膜厚、ｌは試験片の幅)
また、基材シートが破断するまで引っ張った時の歪（ｒ）から伸び率を算出する。 The initial tensile elastic modulus in the present embodiment is measured by a method of calculating the elastic modulus when the base sheet is cut to a predetermined size and pulled to 1% (elongation%) at a constant moving speed. Can be done. Specifically, the base sheet is cut to 50 mm * 100 mm and attached to a universal testing machine (AGS-X manufactured by Shimadzu Corporation). The test was performed at the initial grip distance: 50 mm and the tensile speed: 100 mm / min, and from all the stress (σ) data corresponding to the strain (r) of 0 to 0.01, the least squares method was used to determine r-σ. Calculate the slope and use it as the initial tensile elastic modulus.
Distortion (r) = x / x0 (x is the moving distance of the gripping tool, x0 is the distance between the initial gripping tools)
Stress (σ) = F / (d · l) (F is the test force, d is the film thickness, l is the width of the test piece)
Further, the elongation rate is calculated from the strain (r) when the base sheet is pulled until it breaks.
（基材シートにおける樹脂層）
前記基材シートにおける樹脂層は、基材シートの伸長が上述の範囲となるような樹脂層であれば特に限定はない。例えば、電子基材の伸縮性絶縁層として一般に使用される熱硬化性樹脂を使用して、本実施形態の樹脂層とすることができる。本実施形態における樹脂層は熱硬化性樹脂を含むことが好ましく、それにより、高い耐熱性を示し、高温の雰囲気下においても、溶融や熱分解が抑制された樹脂層となると考えられる。樹脂層が耐熱性を備えることによって、各種ＬＥＤ素子をはんだで実装できるなどの利点がある。また、ＬＥＤの発熱による基材シートの変形・変質を抑制することができる。 (Resin layer in base sheet)
The resin layer in the base material sheet is not particularly limited as long as it is a resin layer in which the elongation of the base material sheet falls within the above range. For example, a thermosetting resin generally used as an elastic insulating layer of an electronic base material can be used as the resin layer of the present embodiment. The resin layer in the present embodiment preferably contains a thermosetting resin, which is considered to be a resin layer that exhibits high heat resistance and suppresses melting and thermal decomposition even in a high temperature atmosphere. Since the resin layer has heat resistance, there is an advantage that various LED elements can be mounted by soldering. In addition, it is possible to suppress deformation and deterioration of the base sheet due to heat generation of the LED.
前記基材シートにおける樹脂層は、基材シートの伸長が上述の範囲となるような樹脂層であれば特に限定はない。例えば、電子基材の伸縮性絶縁層として一般に使用される熱硬化性樹脂を使用して、本実施形態の樹脂層とすることができる。本実施形態における樹脂層は熱硬化性樹脂を含むことが好ましく、それにより、高い耐熱性を示し、高温の雰囲気下においても、溶融や熱分解が抑制された樹脂層となると考えられる。樹脂層が耐熱性を備えることによって、各種ＬＥＤ素子をはんだで実装できるなどの利点がある。また、ＬＥＤの発熱による基材シートの変形・変質を抑制することができる。 (Resin layer in base sheet)
The resin layer in the base material sheet is not particularly limited as long as it is a resin layer in which the elongation of the base material sheet falls within the above range. For example, a thermosetting resin generally used as an elastic insulating layer of an electronic base material can be used as the resin layer of the present embodiment. The resin layer in the present embodiment preferably contains a thermosetting resin, which is considered to be a resin layer that exhibits high heat resistance and suppresses melting and thermal decomposition even in a high temperature atmosphere. Since the resin layer has heat resistance, there is an advantage that various LED elements can be mounted by soldering. In addition, it is possible to suppress deformation and deterioration of the base sheet due to heat generation of the LED.
図１に示すように、本実施形態の基材シート１において、樹脂層３は、繊維層２の一方の面の表面全体に形成されていてもよいが、繊維層２の片面（いずれか一方の面）の少なくとも一部の表面に形成されていればよい。
As shown in FIG. 1, in the base material sheet 1 of the present embodiment, the resin layer 3 may be formed on the entire surface of one surface of the fiber layer 2, but one surface of the fiber layer 2 (either one). It suffices if it is formed on at least a part of the surface of the surface).
さらには、図１に示すように、樹脂層３が繊維層２に含浸されていてもよい。また、樹脂層３の全体ではなく、一部が、繊維層２の片面（いずれか一方の面）の少なくとも一部に含浸されていてもよい。
Further, as shown in FIG. 1, the resin layer 3 may be impregnated into the fiber layer 2. Further, not the entire resin layer 3 but a part thereof may be impregnated into at least a part of one side (any one side) of the fiber layer 2.
特に、樹脂層の少なくとも一部が繊維層に含浸されている場合、樹脂層と繊維層はより一体化され、破断などが起こりにくくなると考えられる。
In particular, when at least a part of the resin layer is impregnated in the fiber layer, it is considered that the resin layer and the fiber layer are more integrated and breakage is less likely to occur.
また、本実施形態の基材シートにおいて、前記樹脂層の厚みは特に限定されるものではなく、その用途によって適宜設定が可能であるが、例えば、５０μｍ～５０００μｍの厚みであれば、ハンドリング性、光学特性、装着性等の観点で好ましい。
Further, in the base sheet of the present embodiment, the thickness of the resin layer is not particularly limited and can be appropriately set depending on the intended use. For example, if the thickness is 50 μm to 5000 μm, the handleability is improved. It is preferable from the viewpoint of optical characteristics, wearability, and the like.
好ましくは、本実施形態の熱硬化性樹脂は、少なくともエポキシ樹脂を含む。それにより耐熱性をより確実に得られると考えられる。
Preferably, the thermosetting resin of the present embodiment contains at least an epoxy resin. As a result, it is considered that heat resistance can be obtained more reliably.
また、前記熱硬化性樹脂及び前記樹脂層はガラス転移温度が６０℃以下であることが好ましい。それにより、基材シートにさらに柔軟性を付与することができる。前記ガラス転移温度について特に下限値を設ける必要はないが、常温におけるべたつきを避けるという理由で、－４０℃以上であることが好ましい。
Further, it is preferable that the thermosetting resin and the resin layer have a glass transition temperature of 60 ° C. or lower. Thereby, the base sheet can be further given flexibility. It is not necessary to set a lower limit for the glass transition temperature, but it is preferably −40 ° C. or higher in order to avoid stickiness at room temperature.
また、前記熱硬化性樹脂は１％以上の伸長（２５℃における）が可能であることが好ましい。それにより基材シートにおける５％以上の伸長が可能となる。また、前記熱硬化性樹脂は初期引張弾性率が１ＭＰａ以上１０ＧＰａ以下であることが好ましい。それにより前記基材シートの樹脂層が形成されている部位における初期引張弾性率が１ＭＰａ以上１０ＧＰａ以下とすることができる。
Further, it is preferable that the thermosetting resin can be stretched by 1% or more (at 25 ° C.). As a result, the base sheet can be stretched by 5% or more. Further, the thermosetting resin preferably has an initial tensile elastic modulus of 1 MPa or more and 10 GPa or less. As a result, the initial tensile elastic modulus at the portion where the resin layer of the base material sheet is formed can be set to 1 MPa or more and 10 GPa or less.
本実施形態の樹脂層に使用する樹脂組成物は、上述のような特性を備えていれば、その組成について特に限定されるものではない。
The resin composition used for the resin layer of the present embodiment is not particularly limited as long as it has the above-mentioned characteristics.
例えば、本実施形態の樹脂組成物は、熱硬化性樹脂としてポリロタキサン樹脂やエポキシ樹脂を含むことが好ましく、特にエポキシ樹脂を含んでいることが望ましい。さらに、硬化剤を含んでいることが好ましい。これにより、十分な耐熱性を有し、かつリフロープロセスにて部品実装する際の熱に耐えうる基材シートを得ることができる。また未硬化の樹脂組成物を繊維層と貼り合わせた後に硬化させることで、樹脂層を繊維層と一体化させることが容易となる。
For example, the resin composition of the present embodiment preferably contains a polyrotaxane resin or an epoxy resin as a thermosetting resin, and particularly preferably contains an epoxy resin. Further, it is preferable to contain a curing agent. As a result, it is possible to obtain a base material sheet having sufficient heat resistance and capable of withstanding the heat when mounting components in the reflow process. Further, by bonding the uncured resin composition to the fiber layer and then curing the resin composition, it becomes easy to integrate the resin layer with the fiber layer.
より具体的な実施形態の一つとして、例えば、ポリロタキサン（Ａ）、熱硬化性樹脂（Ｂ）及び硬化剤（Ｃ）を含む樹脂組成物が挙げられる。以下に、各成分についてより具体的に説明する。
As one of the more specific embodiments, for example, a resin composition containing a polyrotaxane (A), a thermosetting resin (B) and a curing agent (C) can be mentioned. Hereinafter, each component will be described more specifically.
ポリロタキサン（Ａ）は、具体的には、例えば、特許第４４８２６３３号又は国際公開第２０１５／０５２８５３号パンフレットに記載されているようなポリロタキサンが挙げられる。市販のものを使用してもよく、具体的には、アドバンストソフトマテリアルズ株式会社製のセルムスーパーポリマーＡ１０００等を使用することができる。
Specific examples of the polyrotaxane (A) include polyrotaxane as described in Japanese Patent No. 4482633 or International Publication No. 2015/052853. Commercially available products may be used, and specifically, CELM Super Polymer A1000 manufactured by Advanced Soft Materials Co., Ltd. can be used.
次に、熱硬化性樹脂（Ｂ）としては、例えば、エポキシ樹脂、フェノール樹脂、ポリイミド樹脂、尿素樹脂、メラミン樹脂、不飽和ポリエステル、ウレタン樹脂などの熱硬化性樹脂が特に制限なく挙げられるが、なかでもエポキシ樹脂を用いることが好ましい。
Next, examples of the thermosetting resin (B) include thermosetting resins such as epoxy resin, phenol resin, polyimide resin, urea resin, melamine resin, unsaturated polyester, and urethane resin without particular limitation. Above all, it is preferable to use an epoxy resin.
前記エポキシ樹脂としては、具体的には、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、アラルキルエポキシ樹脂、フェノールノボラック型エポキシ樹脂、アルキルフェノールノボラック型エポキシ樹脂、ビフェノール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、フェノール類とフェノール性水酸基を有する芳香族アルデヒドとの縮合物のエポキシ化物、トリグリシジルイソシアヌレート、脂環式エポキシ樹脂等が挙げられる。これらは、状況に応じて、１種を単独で用いてもよいし、２種以上を組み合わせて用いてもよい。
Specific examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, aralkyl epoxy resin, phenol novolac type epoxy resin, alkylphenol novolak type epoxy resin, and biphenol type epoxy. Examples thereof include a resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, an epoxidized product of a condensate of phenols and an aromatic aldehyde having a phenolic hydroxyl group, triglycidyl isocyanurate, and an alicyclic epoxy resin. Depending on the situation, these may be used alone or in combination of two or more.
前記エポキシ樹脂として、より好ましくは、例えば、１つの分子中に２つ以上のエポキシ基を含み、かつ分子量が５００以上であるエポキシ樹脂が好適に例示される。このようなエポキシ樹脂としては、市販のものを使用してもよく、例えば、ＪＥＲ１００３（三菱化学製、分子量１３００、２官能）、ＥＸＡ－４８１６（ＤＩＣ製、分子量８２４、２官能）、ＹＰ５０（新日鉄住友金属化学製、分子量６００００～８００００、２官能）、ＰＭＳ－１４－６７（ナガセケムテックス社製、分子量３０００００、多官能）等が挙げられる。
More preferably, as the epoxy resin, for example, an epoxy resin containing two or more epoxy groups in one molecule and having a molecular weight of 500 or more is preferably exemplified. As such an epoxy resin, a commercially available one may be used, for example, JER1003 (manufactured by Mitsubishi Chemical Corporation, molecular weight 1300, bifunctional), EXA-4816 (manufactured by DIC, molecular weight 824, bifunctional), YP50 (Nippon Steel). Examples thereof include Sumitomo Metals Chemical Corporation, molecular weight of 60,000 to 80,000, bifunctional), PMS-14-67 (manufactured by Nagase ChemteX Corporation, molecular weight of 300,000, polyfunctional) and the like.
別のエポキシ樹脂の一例として、炭素数が２～３のアルキレンオキサイド変性された変性基を有し且つその変性基がエポキシ１ｍｏｌ分子中に４ｍｏｌ以上含まれること、２ｍｏｌ以上のエポキシ基を有すること、及びエポキシ当量が４５０ｅｑ／ｍｏｌ以上であるエポキシ樹脂である熱硬化性樹脂（Ｂ）と硬化剤（Ｃ）とを含むことによっても、その硬化物が、前記伸張性及び前記引張弾性率を有する樹脂組成物を得ることが可能である。このようなエポキシ樹脂としては、具体的には、プロピレンオキサイド付加型ビスフェノールＡ型エポキシ樹脂（ＡＤＥＫＡ製 ＥＰ４００３Ｓ）、エチレンオキサイド付加型ヒドロキシフェニルフルオレン型エポキシ樹脂（大阪ガスケミカル製 ＥＧ－２８０）等が挙げられる。
As another example of the epoxy resin, it has an alkylene oxide-modified modifying group having 2 to 3 carbon atoms, and the modifying group is contained in 1 mol molecule of the epoxy in an amount of 4 mol or more, and has an epoxy group of 2 mol or more. And even when the thermosetting resin (B) and the curing agent (C), which are epoxy resins having an epoxy equivalent of 450 eq / mol or more, are contained, the cured product has the extensibility and the tensile elasticity. It is possible to obtain a composition. Specific examples of such an epoxy resin include propylene oxide-added bisphenol A type epoxy resin (ADEKA EP4003S), ethylene oxide-added hydroxyphenylfluorene type epoxy resin (Osaka Gas Chemical Co., Ltd. EG-280), and the like. Be done.
ポリロタキサン（Ａ）と熱硬化性樹脂（Ｂ）との、いずれか単独の成分と硬化剤（Ｃ）とを含む樹脂組成物としてもよいが、両方の成分（（Ａ）且つ（Ｂ））と硬化剤（Ｃ）とを含む樹脂組成物とすることが、その硬化物が、前記伸張性及び前記引張弾性率を有する樹脂組成物を得やすい点で好ましい。また、上述するようなエポキシ樹脂は１種類を単独で用いてもよいが、２種以上を併用してもよい。
A resin composition containing a single component of polyrotaxane (A) and a thermosetting resin (B) and a curing agent (C) may be used, but both components ((A) and (B)) may be used. It is preferable to prepare a resin composition containing the curing agent (C) because the cured product can easily obtain the resin composition having the extensibility and the tensile elastic modulus. Further, one type of epoxy resin as described above may be used alone, or two or more types may be used in combination.
硬化剤（Ｃ）としては、熱硬化性樹脂（Ｂ）の硬化剤として働くものであれば、特に制限はない。特に、エポキシ樹脂の硬化剤として好ましく使用できるとしては、フェノール樹脂、アミン系化合物、酸無水物、イミダゾール系化合物、スルフィド樹脂、ジシアンジアミドなどが例として挙げられる。また、光・紫外線硬化剤、熱カチオン硬化剤なども使用できる。これらは、状況に応じて、１種を単独で用いてもよいし、２種以上を組み合わせて用いてもよい。また、前記樹脂組成物は、必要に応じて、硬化促進剤を含有してもよい。前記効果促進剤としては、例えば、イミダゾール系化合物等が挙げられる。
The curing agent (C) is not particularly limited as long as it works as a curing agent for the thermosetting resin (B). In particular, examples of the epoxy resin that can be preferably used as a curing agent include phenol resins, amine compounds, acid anhydrides, imidazole compounds, sulfide resins, and dicyandiamides. Further, a light / ultraviolet curing agent, a thermal cation curing agent, and the like can also be used. Depending on the situation, these may be used alone or in combination of two or more. Further, the resin composition may contain a curing accelerator, if necessary. Examples of the effect promoter include imidazole compounds and the like.
また、本実施形態で樹脂層に使用される樹脂組成物が、ポリロタキサンを含む樹脂組成物である場合には、さらに架橋剤を添加してもよく、そのような架橋剤としては、前記ポリロタキサンの環状分子の少なくとも一部（ポリロタキサンの環状分子が有する少なくとも一つの反応基）と架橋する構造を作ることができるものであれば特に限定なく用いることができる。具体的には、例えば、イソシアネート、塩化シアヌル等が挙げられる。
Further, when the resin composition used for the resin layer in the present embodiment is a resin composition containing polyrotaxane, a cross-linking agent may be further added, and such a cross-linking agent may be the polyrotaxane. It can be used without particular limitation as long as it can form a structure that crosslinks with at least a part of the cyclic molecule (at least one reactive group of the cyclic molecule of polyrotaxane). Specific examples thereof include isocyanate and cyanuric chloride.
前記樹脂組成物中の各成分の割合は、本発明の効果を発揮し得る限り特に制限はないが、例えば（Ａ）成分、（Ｂ）成分及び（Ｃ）成分を全て含む場合には、前記（Ａ）～（Ｃ）成分の合計を１００質量部として、ポリロタキサン（Ａ）は１０～８０質量部、より好ましくは３０～５０質量部程度；熱硬化性樹脂（Ｂ）は１０～８９．９質量部、より好ましくは３０～５０質量部；硬化剤（Ｃ）は０．１～３０質量部、より好ましくは０．１～２０質量部程度である。なお、本実施形態の樹脂組成物が架橋剤としてイソシアネート樹脂を含む場合、イソシアネート樹脂はポリロタキサン（Ａ）に対して、０～５０質量部を添加することができ、さらには、１０～４０質量部添加することが好ましい。（Ｂ）成分及び（Ｃ）成分を含み、（Ａ）成分を含まない場合には、樹脂組成物全量を１００質量部として、熱硬化性樹脂（Ｂ）は５０～９９質量部、より好ましくは６０～８０質量部程度；硬化剤（Ｃ）は１～５０質量部、より好ましくは１～４０質量部程度である。
The ratio of each component in the resin composition is not particularly limited as long as the effect of the present invention can be exhibited, but for example, when the component (A), the component (B) and the component (C) are all contained, the above-mentioned The total of the components (A) to (C) is 100 parts by mass, the polyrotaxane (A) is 10 to 80 parts by mass, more preferably about 30 to 50 parts by mass; the thermosetting resin (B) is 10 to 89.9 parts by mass. By mass, more preferably 30 to 50 parts by mass; the curing agent (C) is about 0.1 to 30 parts by mass, more preferably about 0.1 to 20 parts by mass. When the resin composition of the present embodiment contains an isocyanate resin as a cross-linking agent, 0 to 50 parts by mass of the isocyanate resin can be added to the polyrotaxane (A), and further, 10 to 40 parts by mass. It is preferable to add it. When the component (B) and the component (C) are contained and the component (A) is not contained, the total amount of the resin composition is 100 parts by mass, and the thermosetting resin (B) is 50 to 99 parts by mass, more preferably. About 60 to 80 parts by mass; The curing agent (C) is about 1 to 50 parts by mass, more preferably about 1 to 40 parts by mass.
さらに、本実施形態に係る前記樹脂組成物は、本発明の効果を損なわない範囲でその他の添加剤、例えば、硬化触媒（硬化促進剤）、難燃剤、難燃助剤、レベリング剤、着色剤等を必要に応じて含有してもよい。
Further, the resin composition according to the present embodiment has other additives such as a curing catalyst (curing accelerator), a flame retardant, a flame retardant aid, a leveling agent, and a coloring agent as long as the effects of the present invention are not impaired. Etc. may be contained as needed.
本実施形態の樹脂組成物の調製方法については、特に限定はなく、例えば、まずポリロタキサン樹脂及び／又はエポキシ樹脂、硬化剤、架橋剤、熱硬化性樹脂等と溶媒を均一になるように混合させて本実施形態の樹脂組成物を得ることができる。使用する溶媒に特に限定はなく、例えば、トルエン、キシレン、メチルエチルケトン、アセトン等を使用することができる。これらの溶媒は単独で用いてもよいし２種以上を組み合わせて用いてもよい。また、必要に応じて、粘度を調整するための有機溶剤や、各種添加剤を配合してもよい。
The method for preparing the resin composition of the present embodiment is not particularly limited, and for example, first, a polyrotaxane resin and / or an epoxy resin, a curing agent, a cross-linking agent, a thermosetting resin, or the like is mixed so as to be uniform. The resin composition of the present embodiment can be obtained. The solvent used is not particularly limited, and for example, toluene, xylene, methyl ethyl ketone, acetone and the like can be used. These solvents may be used alone or in combination of two or more. Further, if necessary, an organic solvent for adjusting the viscosity and various additives may be blended.
本実施形態の基材シートにおいて、樹脂層は、例えば、後述する繊維層を上述したような樹脂組成物に浸漬したり、繊維層に前記樹脂組成物を塗布したり、フィルム状の前記樹脂組成物を繊維層に貼り合わせたりすることによって形成される。前記樹脂組成物の塗布方法としては、特に限定はされないが、例えば、バーコーター、コンマコーターやダイコーター、ロールコーター、グラビアコータ等が挙げられる。
In the base material sheet of the present embodiment, for the resin layer, for example, the fiber layer described later is immersed in the resin composition as described above, the resin composition is applied to the fiber layer, or the resin composition in the form of a film. It is formed by sticking an object to a fiber layer. The method for applying the resin composition is not particularly limited, and examples thereof include a bar coater, a comma coater, a die coater, a roll coater, and a gravure coater.
樹脂層を繊維層に含浸させる場合は、当該含浸は、必要に応じて複数回繰り返すことも可能である。また、この際、組成や濃度の異なる複数の樹脂ワニスを用いて含浸を繰り返し、最終的に希望とする組成及び樹脂量に調整することも可能である。
When the fiber layer is impregnated with the resin layer, the impregnation can be repeated multiple times as needed. Further, at this time, it is also possible to repeat impregnation using a plurality of resin varnishes having different compositions and concentrations to finally adjust the desired composition and amount of resin.
樹脂ワニスを塗布した後、もしくは樹脂ワニスを含浸した後、加熱によって有機溶媒を含む硬化前の樹脂組成物を含む樹脂層（Ａステージ）から有機溶媒を揮発させ、有機溶媒を減少又は除去させことができる。樹脂組成物（樹脂ワニス）が塗布または含浸された繊維層を、所望の加熱条件、例えば８０～１２０℃で１～１２０分間加熱して、有機溶媒を減少又は除去された未硬化状態もしくは半硬化状態（Ｂステージ）の樹脂層が得られる。なお、本実施形態において、樹脂組成物のＢステージ、すなわち未硬化状態（未硬化物）もしくは半硬化状態（半硬化物）とは、樹脂組成物をさらに硬化しうる状態のものである。例えば、樹脂組成物は、加熱すると、最初、粘度が徐々に低下し、その後、硬化が開始し、粘度が徐々に上昇する。このような場合、半硬化としては、粘度が上昇し始めてから、完全に硬化する前の間の状態等が挙げられる。
After applying the resin varnish or impregnating the resin varnish, the organic solvent is volatilized from the resin layer (A stage) containing the resin composition before curing containing the organic solvent by heating to reduce or remove the organic solvent. Can be done. The fiber layer coated or impregnated with the resin composition (resin varnish) is heated under desired heating conditions, for example, 80 to 120 ° C. for 1 to 120 minutes to reduce or remove the organic solvent in an uncured or semi-cured state. The resin layer in the state (B stage) is obtained. In the present embodiment, the B stage of the resin composition, that is, the uncured state (uncured product) or the semi-cured state (semi-cured product) is a state in which the resin composition can be further cured. For example, when the resin composition is heated, the viscosity gradually decreases first, then curing starts, and the viscosity gradually increases. In such a case, the semi-curing state includes a state between the time when the viscosity starts to increase and the time before it is completely cured.
さらに加熱によって、樹脂層を硬化させることができる。樹脂組成物（樹脂ワニス）が塗布または含浸された繊維層を、所望の加熱条件、例えば８０～２００℃で１～１２０分間加熱して、硬化状態（Ｃステージ）の樹脂層が得られる。なお、本実施形態において、樹脂組成物のＣステージ、すなわち硬化状態（硬化物）とは、硬化反応が進行し、樹脂が架橋することにより、加熱しても溶融しない状態となったもののことをさす。
The resin layer can be cured by further heating. The fiber layer coated or impregnated with the resin composition (resin varnish) is heated at a desired heating condition, for example, 80 to 200 ° C. for 1 to 120 minutes to obtain a cured resin layer (C stage). In the present embodiment, the C stage of the resin composition, that is, the cured state (cured product) is a state in which the curing reaction proceeds and the resin is crosslinked so that it does not melt even when heated. As expected.
フィルム状の前記樹脂組成物を繊維層に貼り合わせる場合は、例えば、予め所望のプラスチックフィルム、金属箔等に前記樹脂組成物を塗工し、有機溶媒を含む硬化前（Ａステージ）の樹脂組成物を含む樹脂層、もしくは、所望の加熱条件、例えば８０～１２０℃で１～１２０分間加熱して、未硬化状態もしくは半硬化状態（Ｂステージ）の樹脂層を得る。これを繊維層へ貼り合わせ、圧力、熱等の外部エネルギーによって繊維層へ定着させることで得られる。未硬化状態もしくは半硬化状態（Ｂステージ）の樹脂層でもよいし、さらに加熱によって、樹脂層を硬化させ、硬化状態（Ｃステージ）の樹脂層でもよい。
When the film-shaped resin composition is bonded to the fiber layer, for example, the resin composition is previously applied to a desired plastic film, metal foil, or the like, and the resin composition before curing (A stage) containing an organic solvent is contained. A resin layer containing a substance or a resin layer in an uncured or semi-cured state (B stage) is obtained by heating at a desired heating condition, for example, 80 to 120 ° C. for 1 to 120 minutes. It is obtained by bonding this to the fiber layer and fixing it to the fiber layer by external energy such as pressure and heat. It may be a resin layer in an uncured or semi-cured state (B stage), or may be a resin layer in a cured state (C stage) by further curing the resin layer by heating.
（基材シートにおける繊維層）
前記基材シートにおける繊維層は、特に限定されないが、布もしくは布に近い性質の繊維であることが好ましく、例えば、織物、編物、組物、不織布またはこれらの組み合わせで構成される繊維層などを使用できる。前記繊維層は、一方向配列の織物であってもよい。それにより、所望の方向のみ伸縮性を有する基材シートを得ることができるといった利点がある。 (Fiber layer in base sheet)
The fiber layer in the base material sheet is not particularly limited, but is preferably a cloth or a fiber having properties similar to cloth, for example, a woven fabric, a knitted fabric, a braid, a non-woven fabric, or a fiber layer composed of a combination thereof. Can be used. The fiber layer may be a unidirectionally arranged woven fabric. This has the advantage that a base sheet having elasticity only in a desired direction can be obtained.
前記基材シートにおける繊維層は、特に限定されないが、布もしくは布に近い性質の繊維であることが好ましく、例えば、織物、編物、組物、不織布またはこれらの組み合わせで構成される繊維層などを使用できる。前記繊維層は、一方向配列の織物であってもよい。それにより、所望の方向のみ伸縮性を有する基材シートを得ることができるといった利点がある。 (Fiber layer in base sheet)
The fiber layer in the base material sheet is not particularly limited, but is preferably a cloth or a fiber having properties similar to cloth, for example, a woven fabric, a knitted fabric, a braid, a non-woven fabric, or a fiber layer composed of a combination thereof. Can be used. The fiber layer may be a unidirectionally arranged woven fabric. This has the advantage that a base sheet having elasticity only in a desired direction can be obtained.
また、前記繊維層において、上述した織物、編物、組物または不織布等は、植物繊維、動物繊維、合成繊維、半合成繊維、再生繊維、無機繊維またはこれらの組み合わせで構成されていることが好ましい。
Further, in the fiber layer, the above-mentioned woven fabric, knitted fabric, braid or non-woven fabric is preferably composed of plant fiber, animal fiber, synthetic fiber, semi-synthetic fiber, regenerated fiber, inorganic fiber or a combination thereof. ..
本実施形態の基材シートは伸縮性を備えていることが望ましいため、前記繊維層もある程度の伸縮性、伸長性を備えていることが望ましい。具体的には、基材シートが２５℃で５％以上の伸長が可能となるような繊維層であればよい。例えば、繊維層の弾性率は０．０１ＭＰａ～１ＧＰａ程度であることが好ましく、伸長率は１％以上１０００％以下程度であることが好ましく、５％以上１０００％以下であることがより好ましい。つまり、本実施形態の繊維層には、伸長性をほとんど有さないガラスクロスなどの基材は含まれない。
Since it is desirable that the base material sheet of the present embodiment has elasticity, it is desirable that the fiber layer also has some degree of elasticity and extensibility. Specifically, any fiber layer may be used as long as the base sheet can be stretched by 5% or more at 25 ° C. For example, the elastic modulus of the fiber layer is preferably about 0.01 MPa to 1 GPa, the elongation rate is preferably about 1% or more and 1000% or less, and more preferably 5% or more and 1000% or less. That is, the fiber layer of the present embodiment does not include a base material such as glass cloth having almost no extensibility.
より具体的には、本実施形態の繊維層に使用される繊維としては、一般に布帛として使用されている繊維等が挙げられる。すなわち、植物繊維としては、木綿、カポックなどの種子毛繊維、アマ、タイマ、チョマ、ジュート、ミツマタ、コウゾなどの樹皮繊維、マニラアサ、サイザルアサなどの葉脈繊維等が挙げられる。動物繊維としては、羊毛、アンゴラ、カシミア、モヘヤ、らくだ、アルパカ、絹等が挙げられる。動物繊維には皮革が含まれていてもよく、牛、豚、馬、羊、山羊などの哺乳類、鰐、蛇などの爬虫類、ダチョウなどの鳥類、鮫などの魚類等が挙げられる。合成繊維としては、ナイロン繊維、アラミド繊維、ビニロン繊維、ポリ塩化ビニリデン系合成繊維、ポリ塩化ビニル系合成繊維、ポリエステル系合成繊維、ポリアクリロニトリル系合成繊維、ポリエチレン系合成繊維、ポリプロピレン系合成繊維、ポリウレタン系合成繊維、ポリ乳酸繊維等が挙げられる。合成繊維には人工皮革、合成皮革が含まれていてもよい。半合成繊維としては、アセテート繊維等が挙げられる。再生繊維としては、ビスコース繊維、銅アンモニア繊維等が挙げられる。無機繊維としては、ガラス繊維、炭素繊維、金属繊維等が挙げられる。
More specifically, examples of the fiber used for the fiber layer of the present embodiment include fibers generally used as a cloth. That is, examples of plant fibers include seed hair fibers such as cotton and kapok, bark fibers such as flax, timer, choma, jute, mitsumata, and mulberry, and leaf vein fibers such as Manila asa and sisal asa. Examples of animal fibers include wool, angora, cashmere, mohair, camels, alpaca, silk and the like. Animal fibers may contain leather, and include mammals such as cows, pigs, horses, sheep and goats, reptiles such as eels and snakes, birds such as ostriches, and fish such as sharks. Synthetic fibers include nylon fiber, aramid fiber, vinylon fiber, polyvinylidene chloride synthetic fiber, polyvinyl chloride synthetic fiber, polyester synthetic fiber, polyacrylonitrile synthetic fiber, polyethylene synthetic fiber, polypropylene synthetic fiber, polyurethane. Examples include system synthetic fibers and polylactic acid fibers. Synthetic fibers may include artificial leather and synthetic leather. Examples of the semi-synthetic fiber include acetate fiber and the like. Examples of the regenerated fiber include viscose fiber and cuprammonium fiber. Examples of the inorganic fiber include glass fiber, carbon fiber, metal fiber and the like.
例えば、本実施形態の発光シートを着用用途に用いる場合などは、繊維層の繊維として、衣類に使用する布帛を使用することもできる。あるいは、例えば、テントやトラック荷台などに使用される生地であってもよい。それにより、様々な場面で使用される生地に、当該生地と各種ＬＥＤ素子を一体化させることも可能となる。
For example, when the light emitting sheet of the present embodiment is used for wearing, the cloth used for clothing can also be used as the fiber of the fiber layer. Alternatively, it may be, for example, a fabric used for a tent, a truck bed, or the like. As a result, it is possible to integrate the fabric and various LED elements into the fabric used in various situations.
また、本実施形態の基材シートにおいて、前記繊維層の厚みは特に限定されるものではなく、その用途によって適宜設定が可能であるが、例えば、５０μｍ～５０００μｍの厚みであれば、伸縮性、ハンドリング性の観点で好ましい。
Further, in the base material sheet of the present embodiment, the thickness of the fiber layer is not particularly limited and can be appropriately set depending on the intended use. For example, if the thickness is 50 μm to 5000 μm, the elasticity is increased. It is preferable from the viewpoint of handleability.
さらに、本実施形態の繊維層は、導電性配線を備えていることが好ましい。繊維層に含まれる導電性配線としては、例えば、糸状の金属配線、導電性物質を練り込んで紡糸することで得られる繊維、繊維を銀や銅などでめっきすることで得られる繊維、スパッタによって繊維表面を金属でコーティングすることで得られる繊維、上述した糸状の金属配線を糸にカバリングすることで得られる繊維等が挙げられる。糸状の金属配線とは、具体的には、銅、ステンレス、アルミニウムからなる配線が挙げられる。このような導電性配線を繊維層が備えることにより、樹脂層を設けることなく電気的に接続することができるといった利点がある。
Further, it is preferable that the fiber layer of the present embodiment is provided with conductive wiring. The conductive wiring contained in the fiber layer includes, for example, a thread-like metal wiring, a fiber obtained by kneading a conductive substance and spinning, a fiber obtained by plating the fiber with silver, copper, etc., and spattering. Examples thereof include fibers obtained by coating the fiber surface with a metal, fibers obtained by covering the above-mentioned thread-like metal wiring with a thread, and the like. Specific examples of the thread-like metal wiring include wiring made of copper, stainless steel, and aluminum. By providing such a conductive wiring in the fiber layer, there is an advantage that it can be electrically connected without providing a resin layer.
（導体層）
さらに、本実施形態の発光シートは導体層を前記樹脂層の表面または内部に備えている。図１において、導体層４は、前記基材シート１の樹脂層３の表面（片面）に設けられているが、これに限定されず、導体層を、発光シートの両面、または内部に備えることもできる。導体層としては、例えば、金属箔や導電性組成物で形成される配線、極薄く塗工された導体層、導電糸、金属成形物、液体金属等が挙げられる。 (Conductor layer)
Further, the light emitting sheet of the present embodiment includes a conductor layer on the surface or inside of the resin layer. In FIG. 1, theconductor layer 4 is provided on the surface (one side) of the resin layer 3 of the base material sheet 1, but the conductor layer 4 is provided on both sides or inside of the light emitting sheet. You can also. Examples of the conductor layer include wiring formed of a metal foil or a conductive composition, an ultrathinly coated conductor layer, a conductive thread, a metal molded product, a liquid metal, and the like.
さらに、本実施形態の発光シートは導体層を前記樹脂層の表面または内部に備えている。図１において、導体層４は、前記基材シート１の樹脂層３の表面（片面）に設けられているが、これに限定されず、導体層を、発光シートの両面、または内部に備えることもできる。導体層としては、例えば、金属箔や導電性組成物で形成される配線、極薄く塗工された導体層、導電糸、金属成形物、液体金属等が挙げられる。 (Conductor layer)
Further, the light emitting sheet of the present embodiment includes a conductor layer on the surface or inside of the resin layer. In FIG. 1, the
本実施形態の発光シートにおいて、前記導体層は、後述するＬＥＤ素子５を制御するための信号をＬＥＤ制御手段６から送る制御回路や、電源供給手段８からの電圧印加回路や、無線通信手段９によりスマートフォンやパソコン（ＰＣ）などから送られる制御情報の伝達回路等としての役割を果たす。
In the light emitting sheet of the present embodiment, the conductor layer has a control circuit for sending a signal for controlling the LED element 5 described later from the LED control means 6, a voltage application circuit from the power supply means 8, and a wireless communication means 9. It plays a role as a transmission circuit of control information sent from a smartphone, a personal computer (PC), or the like.
・金属箔
金属箔としては、特に限定はなく、銅箔（メッキ）及びアルミニウム箔、ステンレス箔等が挙げられ、また、これらの金属箔はシランカップリング剤等で表面処理された金属箔であってもよい。 -Metal foil The metal foil is not particularly limited, and examples thereof include copper foil (plating), aluminum foil, stainless steel foil, etc., and these metal foils are metal foils surface-treated with a silane coupling agent or the like. You may.
金属箔としては、特に限定はなく、銅箔（メッキ）及びアルミニウム箔、ステンレス箔等が挙げられ、また、これらの金属箔はシランカップリング剤等で表面処理された金属箔であってもよい。 -Metal foil The metal foil is not particularly limited, and examples thereof include copper foil (plating), aluminum foil, stainless steel foil, etc., and these metal foils are metal foils surface-treated with a silane coupling agent or the like. You may.
金属箔を用いて導体層を形成する場合は、上述した基材シートを一枚または複数枚重ね、さらにその上下の両面又は片面の一部もしくは全面に銅箔等の金属箔を重ね、これを加熱加圧成形して積層一体化することによって、両面金属箔張り又は片面金属箔張りの積層体を作製することができる。または基材シートを一枚または複数枚重ね、さらにその上下の両面又は片面一部もしくは全面に銅箔等の金属箔に樹脂層が塗工されたものを重ね、これを加熱加圧成形して積層一体化することによって、両面金属箔張り又は片面金属箔張りの積層体を作製することができる。または樹脂層を含まない繊維層１枚または複数枚重ね、さらにその上下の両面又は片面一部もしくは全面に銅箔等の金属箔に樹脂層が塗工されたものを重ね、これを加熱加圧成形して積層一体化することによって、両面金属箔張り又は片面金属箔張りの積層体を作製することができる。その後、金属箔をエッチング加工等して回路（配線）形成をすることによって、上述したような基材シートを含む積層体の表面に、回路として導体層（配線）を設けることができる。金属箔をエッチング加工により回路形成する場合、繊維層がエッチング液に浸されることがないようマスキングすることが好ましい。例えば以下の手順で作製することができる。カバーフィルムとして例えばポリイミドのような耐溶剤性プラスチックフィルムに所望の形状に開口部を設け、それを覆うように片面金属箔張りの樹脂層を貼り付ける。これを繊維層とともに加熱加圧成形して積層一体化させると、開口部のみが繊維層に含侵される。繊維層がエッチング液に触れないよう、この積層体をプラスチック板にテープなどで貼り付け、エッチング加工を行う。最後に開口部の境界に沿って前述のカバーフィルムを切り離すことで、前述の開口部の形状で樹脂層が設けられ、その表面に金属箔の回路が形成される。
When forming a conductor layer using a metal foil, one or more of the above-mentioned base material sheets are laminated, and then a metal foil such as a copper foil is laminated on both upper and lower surfaces or a part or the entire surface of one surface thereof. A double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced by heat-pressing molding and laminating and integrating. Alternatively, one or more base sheet sheets are stacked, and a metal foil such as copper foil coated with a resin layer is layered on both upper and lower sides or a part or the entire surface thereof, and this is heat-press molded. By laminating and integrating, a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced. Alternatively, one or more fiber layers that do not contain a resin layer are layered, and a metal foil such as copper foil coated with a resin layer is layered on both upper and lower sides, a part of one side, or the entire surface thereof, and this is heated and pressed. By molding and laminating and integrating, a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced. After that, by forming a circuit (wiring) by etching the metal foil or the like, a conductor layer (wiring) can be provided as a circuit on the surface of the laminate including the base sheet as described above. When the metal foil is formed into a circuit by etching, it is preferable to mask the fiber layer so that it is not immersed in the etching solution. For example, it can be produced by the following procedure. As a cover film, a solvent-resistant plastic film such as polyimide is provided with an opening in a desired shape, and a resin layer covered with a single-sided metal foil is attached so as to cover the opening. When this is heat-press molded together with the fiber layer and laminated and integrated, only the opening is impregnated with the fiber layer. This laminate is attached to a plastic plate with tape or the like so that the fiber layer does not come into contact with the etching solution, and the etching process is performed. Finally, by separating the cover film along the boundary of the opening, a resin layer is provided in the shape of the opening, and a metal leaf circuit is formed on the surface thereof.
回路形成する方法としては、上記記載の方法以外に、例えば、セミアディティブ法（ＳＡＰ：Ｓｅｍｉ Ａｄｄｉｔｉｖｅ Ｐｒｏｃｅｓｓ）やモディファイドセミアディティブ法（ＭＳＡＰ：Ｍｏｄｉｆｉｅｄ Ｓｅｍｉ Ａｄｄｉｔｉｖｅ Ｐｒｏｃｅｓｓ）による回路形成等が挙げられる。さらにこれらを未硬化状態もしくは半硬化状態の樹脂層、もしくはそれを含む基材シート等を用いて積層することで導体層が内包された積層体を作製することができる。
Examples of the method for forming a circuit include circuit formation by a semi-additive method (SAP: Semi Adaptive Process) and a modified semi-additive method (MSAP: Modified Semi Adaptive Process), in addition to the methods described above. Further, by laminating these with a resin layer in an uncured or semi-cured state, or a base sheet containing the resin layer, a laminated body containing a conductor layer can be produced.
本実施形態の発光シートに、さらに導体層として銅箔を用いる場合、耐熱性を有し、さらにはんだの濡れが良好となるため、リフロープロセスにて部品（ＬＥＤ素子）実装することが可能となり、動作信頼性の高いファブリックデバイス等を提供することができる。また、種々の手段により両面にＬＥＤ素子を実装したり、実装されたＬＥＤ素子をさらに内包したりすることもできる。
When a copper foil is further used as the conductor layer in the light emitting sheet of the present embodiment, it has heat resistance and the solder gets wet well, so that it becomes possible to mount a component (LED element) in the reflow process. It is possible to provide a fabric device or the like having high operation reliability. Further, the LED elements can be mounted on both sides by various means, or the mounted LED elements can be further included.
・導電性組成物
また、本実施形態の導体層は、導電性組成物によって形成されていてもよい。本実施形態の導電性組成物は、伸縮性を有する導電性組成物であることが好ましい。それにより、基材シートの伸長性や伸縮性を阻害せず、また動作信頼性に優れたファブリックデバイス等を得ることができる。以下に、伸縮性のある導電性組成物の一例を具体的に示す。 -Conductive composition Further, the conductor layer of the present embodiment may be formed of a conductive composition. The conductive composition of the present embodiment is preferably a conductive composition having elasticity. As a result, it is possible to obtain a fabric device or the like that does not impair the extensibility and elasticity of the base material sheet and has excellent operation reliability. The following is a specific example of a stretchable conductive composition.
また、本実施形態の導体層は、導電性組成物によって形成されていてもよい。本実施形態の導電性組成物は、伸縮性を有する導電性組成物であることが好ましい。それにより、基材シートの伸長性や伸縮性を阻害せず、また動作信頼性に優れたファブリックデバイス等を得ることができる。以下に、伸縮性のある導電性組成物の一例を具体的に示す。 -Conductive composition Further, the conductor layer of the present embodiment may be formed of a conductive composition. The conductive composition of the present embodiment is preferably a conductive composition having elasticity. As a result, it is possible to obtain a fabric device or the like that does not impair the extensibility and elasticity of the base material sheet and has excellent operation reliability. The following is a specific example of a stretchable conductive composition.
前記導電性組成物は、具体的には、伸縮性バインダーとなる樹脂（Ｄ）と、前記樹脂（Ｄ）と反応する硬化剤（Ｅ）と、導電性フィラー（Ｆ）とを含み、前記樹脂（Ｄ）は、官能基当量が４００ｇ／ｅｑ以上で１００００ｇ／ｅｑ以下である官能基を有し、且つ、前記樹脂（Ｄ）及び前記導電性組成物の硬化物は、そのガラス転移温度（Ｔｇ）又は軟化点が４０℃以下、あるいは３０℃での弾性率が１．０ＧＰａ未満であること、並びに、導電性フィラー（Ｆ）が、室温での固有体積抵抗率が１×１０－４Ω・ｃｍ以下の導電物質からなる樹脂組成物等が挙げられる。また前記官能基としては、エポキシ基、ビニル基、（メタ）アクリロイル基、ヒドロキシル基、カルボキシル基、アミノ基、アルコキシ基、カルボニル基などが挙げられる。
Specifically, the conductive composition contains a resin (D) serving as an elastic binder, a curing agent (E) that reacts with the resin (D), and a conductive filler (F), and the resin. (D) has a functional group having a functional group equivalent of 400 g / eq or more and 10000 g / eq or less, and the cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) thereof. ) Or the softening point is 40 ° C or less, or the elastic modulus at 30 ° C is less than 1.0 GPa, and the conductive filler (F) has an intrinsic volume resistivity at room temperature of 1 × 10 -4 Ω. Examples thereof include a resin composition composed of a conductive substance having a size of cm or less. Examples of the functional group include an epoxy group, a vinyl group, a (meth) acryloyl group, a hydroxyl group, a carboxyl group, an amino group, an alkoxy group, and a carbonyl group.
以下では、その各成分について説明する。
Below, each component will be described.
樹脂（Ｄ）の分子構造の構成要素は、単一でもよいし、複数の種類を任意の割合で併用してもよい。樹脂（Ｄ）の分子構造が、（メタ）アクリル酸エステル、スチレン、及びニトリルのうちから選択される少なくとも１つを構成要素として含む分子構造であることが好ましい。具体例としては、エポキシ変性（メタ）アクリル酸エステル、ヒドロキシル基変性（メタ）アクリル酸エステル、カルボキシル基変性（メタ）アクリル酸エステル等が好ましく例示される。
The component of the molecular structure of the resin (D) may be a single component, or a plurality of types may be used in combination at an arbitrary ratio. It is preferable that the molecular structure of the resin (D) is a molecular structure containing at least one selected from (meth) acrylic acid ester, styrene, and nitrile as a component. Specific examples thereof are preferably epoxy-modified (meth) acrylic acid ester, hydroxyl group-modified (meth) acrylic acid ester, carboxyl group-modified (meth) acrylic acid ester, and the like.
また、本実施形態において、樹脂（Ｄ）は重量平均分子量が５万以上であることが好ましい。それにより、本実施形態の導電性組成物を用いて導電パターンを印刷した場合等にニジミが発生しにくくなると考えられる。一方、重量平均分子量の上限値については特に限定はないが、分子量が３００万を超える場合には粘度が高くなり取り扱い性が低下するおそれがあるため、樹脂（Ｄ）の重量平均分子量範囲として好ましくは５万以上３００万以下、より好ましくは１０万以上１００万以下である。
Further, in the present embodiment, the resin (D) preferably has a weight average molecular weight of 50,000 or more. As a result, it is considered that bleeding is less likely to occur when the conductive pattern is printed using the conductive composition of the present embodiment. On the other hand, the upper limit of the weight average molecular weight is not particularly limited, but if the molecular weight exceeds 3 million, the viscosity may increase and the handleability may decrease, so that the weight average molecular weight range of the resin (D) is preferable. Is 50,000 or more and 3 million or less, more preferably 100,000 or more and 1 million or less.
硬化剤（Ｅ）としては、上述したような樹脂（Ｄ）との反応性を有している限り、特に制限なく様々な硬化剤を用いることができる。硬化剤（Ｅ）の具体例としては、イミダゾール系化合物、アミン系化合物、フェノール系化合物、酸無水物系化合物、イソシアネート系化合物、メルカプト系化合物、オニウム塩、過酸化物等のラジカル発生剤、光酸発生剤等が挙げられる。
As the curing agent (E), various curing agents can be used without particular limitation as long as they have reactivity with the resin (D) as described above. Specific examples of the curing agent (E) include imidazole compounds, amine compounds, phenol compounds, acid anhydride compounds, isocyanate compounds, mercapto compounds, onium salts, radical generators such as peroxides, and light. Examples include acid generators.
導電性フィラー（Ｆ）は、室温での固有体積抵抗率が１×１０－４Ω・ｃｍ以下である導電物質からなる。室温での固有体積抵抗率が１×１０－４Ω・ｃｍを超える材料を用いる場合、導電性組成物とした時に、その体積抵抗率は配合量にもよるが概ね１×１０－３Ω・ｃｍ～１×１０－２Ω・ｃｍとなる。このため、回路にした場合、抵抗値が高くなり電力のロスが大きくなる。
The conductive filler (F) is made of a conductive substance having an intrinsic volume resistivity of 1 × 10 -4 Ω · cm or less at room temperature. When a material having an intrinsic volume resistivity exceeding 1 × 10 -4 Ω · cm at room temperature is used, the volume resistivity of the conductive composition is approximately 1 × 10 -3 Ω ·, although it depends on the blending amount. It is cm to 1 x 10 -2 Ω · cm. Therefore, in the case of a circuit, the resistance value becomes high and the power loss becomes large.
前記導電物質（室温での固有体積抵抗率が１×１０－４Ω・ｃｍ以下である導電物質）としては、例えば、銀、銅、金等の金属元素から成る単体やこれらの元素を含む酸化物、窒化物、炭化物や合金といった化合物等が挙げられる。前記導電性組成物には、導電性フィラー（Ｆ）以外にも、導電性をより改善する目的で、導電性あるいは半導電性の導電助剤を加えることもできる。このような導電性あるいは半導電性の助剤としては、導電性高分子、イオン液体、カーボンブラック、アセチレンブラック、カーボンナノチューブや帯電防止剤に用いられる無機化合物等を用いることができ、１種類で使用しても２種類以上を同時に用いても構わない。
Examples of the conductive substance (conductive substance having an intrinsic volume resistivity of 1 × 10 -4 Ω · cm or less at room temperature) include simple substances composed of metal elements such as silver, copper, and gold, and oxidation containing these elements. Examples include compounds such as substances, nitrides, carbides and alloys. In addition to the conductive filler (F), a conductive or semi-conductive conductive auxiliary agent may be added to the conductive composition for the purpose of further improving the conductivity. As such a conductive or semi-conductive auxiliary agent, a conductive polymer, an ionic liquid, carbon black, acetylene black, carbon nanotubes, an inorganic compound used as an antistatic agent, or the like can be used, and only one kind can be used. It may be used or two or more types may be used at the same time.
導電性フィラー（Ｆ）は、その形状が扁平形状であることが好ましく、厚みと面内長手方向のアスペクト比が１０以上であることが好ましい。前記アスペクト比が１０以上である場合には、導電性フィラーの質量比に対する表面積が大きくなり導電性の効率が上がるだけでなく、樹脂成分との密着性もよくなり伸縮性が向上する効果もある。前記アスペクト比は１０００以下であれば、より良好な導電性及び印刷性が確保できるという観点から、１０以上１０００以下であることが好ましく、２０以上５００以下であることがより好ましい。このようなアスペクト比を有する導電性フィラーの例としては、タップ法により測定したタップ密度で６．０ｇ／ｃｍ３以下である導電性フィラーが挙げられる。さらに、タップ密度が２．０ｇ／ｃｍ３以下である場合にはさらにアスペクト比が大きくなるためより好ましい。
The conductive filler (F) preferably has a flat shape, and preferably has a thickness and an aspect ratio in the in-plane longitudinal direction of 10 or more. When the aspect ratio is 10 or more, the surface area of the conductive filler with respect to the mass ratio becomes large, and not only the efficiency of conductivity is improved, but also the adhesion with the resin component is improved and the elasticity is improved. .. When the aspect ratio is 1000 or less, it is preferably 10 or more and 1000 or less, and more preferably 20 or more and 500 or less, from the viewpoint of ensuring better conductivity and printability. Examples of the conductive filler having such an aspect ratio include a conductive filler having a tap density of 6.0 g / cm 3 or less measured by the tap method. Further, when the tap density is 2.0 g / cm 3 or less, the aspect ratio is further increased, which is more preferable.
前記導電性組成物中の導電性フィラー（Ｆ）の配合割合については、前記導電性組成物全量に対し、導電性フィラー（Ｆ）の配合割合が質量比で４０～９５質量％であることが導電性、コスト、印刷性において好ましく、より好ましくは６０～８５質量％である。
Regarding the blending ratio of the conductive filler (F) in the conductive composition, the blending ratio of the conductive filler (F) to the total amount of the conductive composition is 40 to 95% by mass in terms of mass ratio. It is preferable in terms of conductivity, cost, and printability, and more preferably 60 to 85% by mass.
本実施形態で使用する導電性フィラー（Ｆ）の粒子サイズに特に制限はないが、スクリーン印刷時の印刷性や配合物の混練において適度な粘度となるという観点から、レーザー光散乱方によって測定した平均粒径（体積累積５０％における粒径；Ｄ５０）が０．５μｍ以上、３０μｍ以下であることが好ましく、１．５μｍ以上、２０μｍ以下であることがより好ましい。
The particle size of the conductive filler (F) used in the present embodiment is not particularly limited, but it was measured by a laser light scattering method from the viewpoint of printability at the time of screen printing and an appropriate viscosity in kneading of the formulation. The average particle size (particle size at a cumulative volume of 50%; D50) is preferably 0.5 μm or more and 30 μm or less, and more preferably 1.5 μm or more and 20 μm or less.
さらに、本実施形態において導電性フィラー（Ｆ）は、表面をカップリング処理された導電性フィラーであることが好ましい。あるいは、本実施形態の導電性組成物にカップリング剤を含有させてもよい。それにより、バインダー樹脂と導電性フィラーの密着性がより向上するという利点がある。
Further, in the present embodiment, the conductive filler (F) is preferably a conductive filler whose surface is coupled. Alternatively, the conductive composition of the present embodiment may contain a coupling agent. This has the advantage that the adhesion between the binder resin and the conductive filler is further improved.
導電性組成物に添加する、あるいは、導電性フィラーをカップリング処理するためのカップリング剤としては、フィラー表面に吸着またはフィラー表面と反応するものであれば特に制限なく用いることができ、具体的には、シランカップリング剤、チタネート系カップリング剤、アルミ系カップリング剤等が挙げられる。
The coupling agent to be added to the conductive composition or for coupling the conductive filler can be used without particular limitation as long as it adsorbs to the filler surface or reacts with the filler surface. Examples thereof include silane coupling agents, titanate-based coupling agents, aluminum-based coupling agents and the like.
本実施形態においてカップリング剤を使用する場合、その添加量は、導電性組成物全体に対し、１質量％～２０質量％程度とすることが好ましい。
When a coupling agent is used in the present embodiment, the addition amount thereof is preferably about 1% by mass to 20% by mass with respect to the entire conductive composition.
・配合比
前記導電性組成物中の各成分の割合は、本発明の効果を発揮し得る限り特に制限はなく、前記（Ｆ）樹脂：前記（Ｇ）硬化剤の配合割合は、樹脂と硬化剤の種類によって、当量比などを考慮して適宜決めることが可能である。 -Mixing ratio The ratio of each component in the conductive composition is not particularly limited as long as the effect of the present invention can be exhibited, and the compounding ratio of the (F) resin: the (G) curing agent is the resin and the curing. Depending on the type of agent, it can be appropriately determined in consideration of the equivalent ratio and the like.
前記導電性組成物中の各成分の割合は、本発明の効果を発揮し得る限り特に制限はなく、前記（Ｆ）樹脂：前記（Ｇ）硬化剤の配合割合は、樹脂と硬化剤の種類によって、当量比などを考慮して適宜決めることが可能である。 -Mixing ratio The ratio of each component in the conductive composition is not particularly limited as long as the effect of the present invention can be exhibited, and the compounding ratio of the (F) resin: the (G) curing agent is the resin and the curing. Depending on the type of agent, it can be appropriately determined in consideration of the equivalent ratio and the like.
前記導電性組成物には、上記成分以外にも、目的に応じて添加剤等を加えることができる。添加剤等については、例えばエラストマー、界面活性剤、分散剤、着色剤、芳香剤、可塑剤、ｐＨ調整剤、粘性調整剤、紫外線吸収剤、酸化防止剤、滑剤等が挙げられる。
In addition to the above components, additives and the like can be added to the conductive composition depending on the purpose. Examples of additives include elastomers, surfactants, dispersants, colorants, fragrances, plasticizers, pH adjusters, viscosity regulators, ultraviolet absorbers, antioxidants, lubricants and the like.
前記導電性組成物の調製方法については、前記導電性組成物を製造することができれば、特に限定されない。前記導電性組成物の調製方法としては、例えば、上述した樹脂成分と導電性フィラーと、必要に応じて硬化剤や分散剤等と、溶媒とを均一になるように混合・撹拌させて、前記導電性組成物を得る方法等が挙げられる。前記混合・攪拌の方法については特に限定はなく、自転－公転式ミキサーや３本ロールミル等の高せん断分散装置が好ましく用いられる。さらに真空脱泡を行ってもよい。
The method for preparing the conductive composition is not particularly limited as long as the conductive composition can be produced. As a method for preparing the conductive composition, for example, the above-mentioned resin component, the conductive filler, a curing agent, a dispersant, or the like, if necessary, and a solvent are mixed and stirred so as to be uniform. Examples thereof include a method for obtaining a conductive composition. The mixing / stirring method is not particularly limited, and a high shear dispersion device such as a rotation-revolution mixer or a three-roll mill is preferably used. Further, vacuum defoaming may be performed.
・導電性組成物を使用した導体層
本実施形態の導電性組成物を、上述したような基材シートの樹脂層上に塗布または印刷することによって、導電性組成物の塗膜を形成し、所望の配線（導電パターン）等の導体層を形成することができる。 -Conductor layer using the conductive composition By applying or printing the conductive composition of the present embodiment on the resin layer of the base material sheet as described above, a coating film of the conductive composition is formed. It is possible to form a conductor layer such as a desired wiring (conductive pattern).
本実施形態の導電性組成物を、上述したような基材シートの樹脂層上に塗布または印刷することによって、導電性組成物の塗膜を形成し、所望の配線（導電パターン）等の導体層を形成することができる。 -Conductor layer using the conductive composition By applying or printing the conductive composition of the present embodiment on the resin layer of the base material sheet as described above, a coating film of the conductive composition is formed. It is possible to form a conductor layer such as a desired wiring (conductive pattern).
前記配線による導電パターンなどは、以下のような工程によって前記基材シートの表面に形成することができる。すなわち、まず、本実施形態の導電性組成物を前記樹脂層上に塗布または印刷することで塗膜を形成し、乾燥により塗膜に含まれる揮発成分を除去する。その後の加熱や電子線、光照射といった硬化工程により、樹脂（Ｄ）と硬化剤（Ｆ）を硬化させる工程、並びに、カップリング剤と導電性フィラー（Ｆ）とを、及び、樹脂（Ｄ）と硬化剤（Ｆ）とを反応させる工程により、伸縮性配線による導電性パターンを形成することができる。前記硬化工程や反応工程における各条件は特に限定されず、樹脂、硬化剤、フィラー等の種類や所望の形態によって適宜設定すればよい。
The conductive pattern or the like formed by the wiring can be formed on the surface of the base material sheet by the following steps. That is, first, a coating film is formed by applying or printing the conductive composition of the present embodiment on the resin layer, and the volatile components contained in the coating film are removed by drying. The resin (D) and the curing agent (F) are cured by the subsequent curing steps such as heating, electron beam, and light irradiation, and the coupling agent and the conductive filler (F) are combined with the resin (D). By the step of reacting with the curing agent (F), a conductive pattern by elastic wiring can be formed. Each condition in the curing step and the reaction step is not particularly limited, and may be appropriately set depending on the type of resin, curing agent, filler, etc. and the desired form.
本実施形態の導電性組成物を基材上に塗布する工程は、特に限定されないが、例えば、アプリケーター、ワイヤーバー、コンマロール、グラビアロールなどのコーティング法やスクリーン、平板オフセット、フレキソ、インクジェット、スタンピング、ディスペンス、スキージなどを用いた印刷法を用いることができる。
The step of applying the conductive composition of the present embodiment onto the substrate is not particularly limited, and is, for example, a coating method such as an applicator, a wire bar, a comma roll, or a gravure roll, a screen, a flat plate offset, a flexo, an inkjet, or a stamping. , Dispens, squeegee, etc. can be used.
また、導体層は、前記基材シート内部に形成されていてもよい。
Further, the conductor layer may be formed inside the base material sheet.
・上記以外の導体層
また、導電性フィラーや導電性高分子、イオン液体、カーボンブラック、アセチレンブラック、カーボンナノチューブや帯電防止剤に用いられる無機化合物等を溶媒に分散させたものや液体金属を基材シートの両面又は片面一部もしくは全面に塗工、印刷等で導体層や配線を形成してもよい。また、導電糸で縫製することにより複数の導体層を接続してもよい。また、リベット、スナップボタンなどの金属成形物で複数の導体層を接続してもよい。さらに、液体金属を用いる場合には、基材シート内に形成された、密封された通路内に液体金属を封入することによって液体金属による導体層を形成することが好ましい。本実施形態に係る液体金属としては、米国特許出願公開第２０１８／０３１５５１８号明細書及び米国特許出願公開第２０１８／０２４７７２７号明細書に記載のような液体金属が挙げられる。 -Conductor layers other than the above Also, based on liquid metals or those in which conductive fillers, conductive polymers, ionic liquids, carbon blacks, acetylene blacks, carbon nanotubes, inorganic compounds used for antistatic agents, etc. are dispersed in a solvent. A conductor layer or wiring may be formed by coating, printing, or the like on both sides or a part or the entire surface of the material sheet. Further, a plurality of conductor layers may be connected by sewing with a conductive thread. Further, a plurality of conductor layers may be connected by a metal molded product such as a rivet or a snap button. Further, when a liquid metal is used, it is preferable to form a conductor layer made of the liquid metal by enclosing the liquid metal in a sealed passage formed in the base sheet. Examples of the liquid metal according to the present embodiment include liquid metals as described in US Patent Application Publication No. 2018/0315518 and US Patent Application Publication No. 2018/0247727.
また、導電性フィラーや導電性高分子、イオン液体、カーボンブラック、アセチレンブラック、カーボンナノチューブや帯電防止剤に用いられる無機化合物等を溶媒に分散させたものや液体金属を基材シートの両面又は片面一部もしくは全面に塗工、印刷等で導体層や配線を形成してもよい。また、導電糸で縫製することにより複数の導体層を接続してもよい。また、リベット、スナップボタンなどの金属成形物で複数の導体層を接続してもよい。さらに、液体金属を用いる場合には、基材シート内に形成された、密封された通路内に液体金属を封入することによって液体金属による導体層を形成することが好ましい。本実施形態に係る液体金属としては、米国特許出願公開第２０１８／０３１５５１８号明細書及び米国特許出願公開第２０１８／０２４７７２７号明細書に記載のような液体金属が挙げられる。 -Conductor layers other than the above Also, based on liquid metals or those in which conductive fillers, conductive polymers, ionic liquids, carbon blacks, acetylene blacks, carbon nanotubes, inorganic compounds used for antistatic agents, etc. are dispersed in a solvent. A conductor layer or wiring may be formed by coating, printing, or the like on both sides or a part or the entire surface of the material sheet. Further, a plurality of conductor layers may be connected by sewing with a conductive thread. Further, a plurality of conductor layers may be connected by a metal molded product such as a rivet or a snap button. Further, when a liquid metal is used, it is preferable to form a conductor layer made of the liquid metal by enclosing the liquid metal in a sealed passage formed in the base sheet. Examples of the liquid metal according to the present embodiment include liquid metals as described in US Patent Application Publication No. 2018/0315518 and US Patent Application Publication No. 2018/0247727.
（ＬＥＤ素子）
本実施形態で使用するＬＥＤ素子は光を発光するものである限り、特に限定されず、発光シートの用途によって適宜、適切なＬＥＤ素子を選択することができる。具体的には、本実施形態のＬＥＤ素子は、可視光、紫外線、及び、赤外線から選択される少なくとも１つを発光するＬＥＤ素子であってもよい。例えば、発光シートを表示装置などに使用する場合には可視光を、殺菌装置や脱臭装置などに使用する場合には紫外線を、セキュリティシステ、測距装置、信号送信装置などに使用する場合には赤外線といったように、用途によって、ＬＥＤ素子の発光する光の種類や、ＬＥＤ素子の大きさや個数や色、配列、順列等も適宜選択可能である。また、例えば、非可視光ＬＥＤのＯＮ／ＯＦＦを可視光で表示させるなどといった、異なる種類のＬＥＤ素子を組み合わせてもよい。 (LED element)
The LED element used in the present embodiment is not particularly limited as long as it emits light, and an appropriate LED element can be appropriately selected depending on the application of the light emitting sheet. Specifically, the LED element of the present embodiment may be an LED element that emits at least one selected from visible light, ultraviolet rays, and infrared rays. For example, when the light emitting sheet is used for a display device, visible light is used, when it is used for a sterilizing device, a deodorizing device, etc., ultraviolet light is used, and when it is used for a security system, a distance measuring device, a signal transmitting device, etc. Depending on the application, such as infrared rays, the type of light emitted by the LED element, the size, number, color, arrangement, order, and the like of the LED element can be appropriately selected. Further, different types of LED elements such as displaying the ON / OFF of the invisible light LED with visible light may be combined.
本実施形態で使用するＬＥＤ素子は光を発光するものである限り、特に限定されず、発光シートの用途によって適宜、適切なＬＥＤ素子を選択することができる。具体的には、本実施形態のＬＥＤ素子は、可視光、紫外線、及び、赤外線から選択される少なくとも１つを発光するＬＥＤ素子であってもよい。例えば、発光シートを表示装置などに使用する場合には可視光を、殺菌装置や脱臭装置などに使用する場合には紫外線を、セキュリティシステ、測距装置、信号送信装置などに使用する場合には赤外線といったように、用途によって、ＬＥＤ素子の発光する光の種類や、ＬＥＤ素子の大きさや個数や色、配列、順列等も適宜選択可能である。また、例えば、非可視光ＬＥＤのＯＮ／ＯＦＦを可視光で表示させるなどといった、異なる種類のＬＥＤ素子を組み合わせてもよい。 (LED element)
The LED element used in the present embodiment is not particularly limited as long as it emits light, and an appropriate LED element can be appropriately selected depending on the application of the light emitting sheet. Specifically, the LED element of the present embodiment may be an LED element that emits at least one selected from visible light, ultraviolet rays, and infrared rays. For example, when the light emitting sheet is used for a display device, visible light is used, when it is used for a sterilizing device, a deodorizing device, etc., ultraviolet light is used, and when it is used for a security system, a distance measuring device, a signal transmitting device, etc. Depending on the application, such as infrared rays, the type of light emitted by the LED element, the size, number, color, arrangement, order, and the like of the LED element can be appropriately selected. Further, different types of LED elements such as displaying the ON / OFF of the invisible light LED with visible light may be combined.
前記ＬＥＤ素子５は前記導体層４に電気的に接続されている。図１に示すように、本実施形態において、ＬＥＤ素子５は前記導体層４の上に配置されており、例えば、後述する電源供給手段などから導体層４を介して流される電流によって、発光することができる。
The LED element 5 is electrically connected to the conductor layer 4. As shown in FIG. 1, in the present embodiment, the LED element 5 is arranged on the conductor layer 4, and emits light by, for example, a current flowing through the conductor layer 4 from a power supply means or the like described later. be able to.
（ＬＥＤ制御手段）
本実施形態の発光シートは、図１に示すように、さらに、前記ＬＥＤ素子の発光を制御するＬＥＤ制御手段６を備えている。前記ＬＥＤ制御手段６は前記基材シート１上において、前記ＬＥＤ素子５と通信可能に敷設されている。 (LED control means)
As shown in FIG. 1, the light emitting sheet of the present embodiment further includes an LED control means 6 for controlling light emission of the LED element. The LED control means 6 is laid on thebase material sheet 1 so as to be communicable with the LED element 5.
本実施形態の発光シートは、図１に示すように、さらに、前記ＬＥＤ素子の発光を制御するＬＥＤ制御手段６を備えている。前記ＬＥＤ制御手段６は前記基材シート１上において、前記ＬＥＤ素子５と通信可能に敷設されている。 (LED control means)
As shown in FIG. 1, the light emitting sheet of the present embodiment further includes an LED control means 6 for controlling light emission of the LED element. The LED control means 6 is laid on the
ＬＥＤ制御手段６は、上述したＬＥＤ素子５を制御できるものであれば特に限定なくどのような手段でも用いることができる。例えば、種々のＬＥＤドライバ、各種スイッチ等が挙げられる。ＬＥＤ制御手段から発される発光信号によって、前記ＬＥＤ素子を作動（発光）させたり、停止させたり、また発光の明るさを調整したりすることが可能となる。つまり、ＬＥＤ制御手段に所望する信号データが入力されると、ＬＥＤ制御手段において入力された信号プロトコルに対応した処理が行われ、ＬＥＤ素子に発光信号が送信され、その発光信号の情報に応じた明るさで当該ＬＥＤ素子が発光する。
The LED control means 6 can be used by any means without particular limitation as long as it can control the above-mentioned LED element 5. For example, various LED drivers, various switches and the like can be mentioned. The light emitting signal emitted from the LED control means makes it possible to operate (light up) or stop the LED element, and to adjust the brightness of the light emission. That is, when the desired signal data is input to the LED control means, processing corresponding to the signal protocol input by the LED control means is performed, a light emission signal is transmitted to the LED element, and the information of the light emission signal is struck. The LED element emits light depending on the brightness.
さらに、本実施形態の発光シートを各種表示装置に使用する場合等には、表示したい画像を前記ＬＥＤ制御手段から送られる表示信号によって調整することができる。例えば、表示画像が静止画である場合には前記ＬＥＤ制御手段から同じ発光信号を繰り返し送信し、動画である場合には、前記ＬＥＤ制御手段から発光信号を順次変更して送ることもできる。
Further, when the light emitting sheet of the present embodiment is used for various display devices, the image to be displayed can be adjusted by the display signal sent from the LED control means. For example, when the displayed image is a still image, the same light emitting signal may be repeatedly transmitted from the LED control means, and when the display image is a moving image, the light emitting signal may be sequentially changed and sent from the LED control means.
本実施形態のＬＥＤ制御手段へ送る信号データは、有線通信手段によって送られてもよいし、無線通信手段によって送られてもよい。利便性という観点から、本実施形態の発光シートは、図３に示すように、無線通信手段９を有することが好ましい。
The signal data to be sent to the LED control means of the present embodiment may be sent by a wired communication means or may be sent by a wireless communication means. From the viewpoint of convenience, it is preferable that the light emitting sheet of the present embodiment has the wireless communication means 9 as shown in FIG.
有線通信手段としては、基材シート状の制御回路内に制御スイッチを具備する方法、ＵＳＢなどの接続手段を経由してケーブルでスマートフォンやＰＣに接続する方法、有線ＬＡＮケーブルを用いてＰＣに接続する方法等が挙げられる（図示せず）。一方、無線通信手段９としては、各種の無線通信プロトコルを使用でき、例えば、ＮＦＣなどの至近距離無線通信、Ｂｌｕｅｔｏｏｔｈ（登録商標）、ＩｒＤＡ、ＵＷＢ、ＺｉｇＢｅｅなどのＷＰＡＮ、Ｗｉ－ＦｉなどのＷＬＡＮ、ＷｉＭＡＸなどのＷＭＡＮ、ＬＴＥなどのＷＷＡＮ等が挙げられる。図３に示すような発光シートでは、無線通信手段９を備えているため、この無線通信手段９を介して、例えば、スマートフォンなどによって無線通信でＬＥＤ制御手段６を作動させることができる。
Wired communication means include a method of providing a control switch in a control circuit in the form of a base sheet, a method of connecting to a smartphone or a PC with a cable via a connection means such as USB, and a method of connecting to a PC using a wired LAN cable. (Not shown). On the other hand, as the wireless communication means 9, various wireless communication protocols can be used, for example, close range wireless communication such as NFC, Bluetooth (registered trademark), WPAN such as IrDA, UWB, ZigBee, WLAN such as Wi-Fi, and the like. WMAN such as WiMAX, WWAN such as LTE, and the like can be mentioned. Since the light emitting sheet as shown in FIG. 3 includes the wireless communication means 9, the LED control means 6 can be operated by wireless communication by, for example, a smartphone or the like via the wireless communication means 9.
前記ＬＥＤ制御手段は、その他にも、フラッシュメモリ等のメモリを備えていてもよく、表示装置に使用される場合などには複雑な表示（静止画、動画）の信号をメモリに蓄えることができる。
The LED control means may also include a memory such as a flash memory, and can store a complicated display (still image, moving image) signal in the memory when used in a display device or the like. ..
本実施形態において信号データ等は、無線通信か有線通信かによって、公知の送受信機を適宜選択して用いることにより送信され、ＬＥＤ制御手段において受信することができる。
In the present embodiment, the signal data or the like is transmitted by appropriately selecting and using a known transmitter / receiver depending on whether it is wireless communication or wired communication, and can be received by the LED control means.
以上、本実施形態の発光シートの基本構成について説明したが、前記発光シートはさらに下記構成を備えていてもよい。
Although the basic configuration of the light emitting sheet of the present embodiment has been described above, the light emitting sheet may further have the following configuration.
（通気孔）
本実施形態に係る発光シートは、図２に示すように、さらに、厚さ方向に通気可能な通気孔７、７’を備えることが好ましい。前記通気孔７は基材シート１の一方の面に形成された開口部から他方の面に形成された開口部に向かって貫通し、その開口部は解放されていてもよいし、図２に示す通気孔７’のように樹脂層３がなく繊維層２のみとなっている箇所であってもよい。貫通した開口部はハトメ等で補強されていてもよい。また、通気孔７、７’は、導体層４から電気的に絶縁されていることが好ましい。つまり、通気孔７、７’の形成位置は、発光シートにおいて導体層４とはと重複しない位置、すなわち、平面視において導体層４が形成されていない位置が好ましい。 (Vents)
As shown in FIG. 2, it is preferable that the light emitting sheet according to the present embodiment further includesventilation holes 7 and 7'that can be ventilated in the thickness direction. The ventilation holes 7 may penetrate from the opening formed on one surface of the base sheet 1 toward the opening formed on the other surface, and the opening may be opened. It may be a place where there is no resin layer 3 and only the fiber layer 2 like the ventilation hole 7'shown. The penetrating opening may be reinforced with eyelets or the like. Further, it is preferable that the ventilation holes 7 and 7'are electrically insulated from the conductor layer 4. That is, the positions where the ventilation holes 7 and 7'are formed are preferably positions that do not overlap with the conductor layer 4 in the light emitting sheet, that is, positions where the conductor layer 4 is not formed in a plan view.
本実施形態に係る発光シートは、図２に示すように、さらに、厚さ方向に通気可能な通気孔７、７’を備えることが好ましい。前記通気孔７は基材シート１の一方の面に形成された開口部から他方の面に形成された開口部に向かって貫通し、その開口部は解放されていてもよいし、図２に示す通気孔７’のように樹脂層３がなく繊維層２のみとなっている箇所であってもよい。貫通した開口部はハトメ等で補強されていてもよい。また、通気孔７、７’は、導体層４から電気的に絶縁されていることが好ましい。つまり、通気孔７、７’の形成位置は、発光シートにおいて導体層４とはと重複しない位置、すなわち、平面視において導体層４が形成されていない位置が好ましい。 (Vents)
As shown in FIG. 2, it is preferable that the light emitting sheet according to the present embodiment further includes
本実施形態に係る発光シートは、例えばその一方の表面側に存在する水分（湿気）を、通気孔７、７’を通じて他方の表面側に移動させることが可能である。つまり、本実施形態の発光シートでは、通気孔７、７’が水分を逃がすことができるので、通気性に優れ、片側の表面に水分が滞留したままになることを防止できる。それにより、発光シートを、何かの対象物に被着させて用いるウェアラブルデバイス、特に人の生体に直接あるいは衣服等に貼り付けて使用するパッチデバイス等に適用する場合、汗等の水分を発散させることができるため、さらに有用性が高いと考えられる。また、例えば、本実施形態の発光シートを競技場等で用いられる巨大なデジタルサイネージ等の表示装置に使用する場合等には、このような通気孔があることによって、破断したり、風に煽られたりすることを抑制できるといった利点もある。また、ＬＥＤ素子の冷却にも寄与することができる。
The light emitting sheet according to the present embodiment can, for example, move the moisture (moisture) existing on one surface side to the other surface side through the ventilation holes 7 and 7'. That is, in the light emitting sheet of the present embodiment, since the ventilation holes 7 and 7'can allow moisture to escape, the air permeability is excellent and it is possible to prevent the moisture from remaining on one surface. As a result, when the light emitting sheet is applied to a wearable device that is used by attaching it to an object, especially a patch device that is used by directly attaching it to a human body or by attaching it to clothes, etc., it dissipates moisture such as sweat. Therefore, it is considered to be more useful. Further, for example, when the light emitting sheet of the present embodiment is used for a display device such as a huge digital signage used in a stadium or the like, the presence of such a vent may cause the light emitting sheet to break or be blown by the wind. It also has the advantage of being able to prevent it from being damaged. It can also contribute to cooling the LED element.
発光シートに形成される通気孔の個数は、特には限定されないが、通気孔は通気性向上の観点から、発光シートに複数形成されていることが好ましい。
The number of ventilation holes formed in the light emitting sheet is not particularly limited, but it is preferable that a plurality of ventilation holes are formed in the light emitting sheet from the viewpoint of improving air permeability.
通気孔の開口部の形状は、発光シートを面方向に伸縮した際に、破断しにくい形状であることが好ましく、さらに閉じにくい形状、すなわち大きく開いた状態を維持しやすい形状であることが好ましい。そのような形状としては、発光シートの面方向における形状として、円形、楕円形、及び多角形等が挙げられる。通気孔が複数形成される場合、それらの開口部は全て同じ形状でもよいが、異なる形状の組合せであってもよい。
The shape of the opening of the ventilation hole is preferably a shape that is hard to break when the light emitting sheet is expanded and contracted in the plane direction, and more preferably a shape that is hard to close, that is, a shape that is easy to maintain a wide open state. .. Examples of such a shape include a circular shape, an elliptical shape, a polygonal shape, and the like as the shape of the light emitting sheet in the plane direction. When a plurality of ventilation holes are formed, the openings may all have the same shape, but may be a combination of different shapes.
通気孔の開口部の開口率（通気孔の総面積を含む発光シートの面方向の総面積に対する、通気孔の総面積）は、通気性が確保できていれば、特には限定されない。前記開口率は、０．００１～４５％であることが好ましく、０．０１～２０％であることがより好ましい。前記開口率が、上記のような割合であると、発光シートとしての強度を維持しつつ、優れた通気性を発揮できるため、より優れた通気性を発揮できる。なお、通気孔の開口部の総面積は、発光シートの面方向において、複数形成されている通気孔の開口部の面積を全て加算した面積である。
The aperture ratio of the openings of the ventilation holes (the total area of the ventilation holes with respect to the total area in the surface direction of the light emitting sheet including the total area of the ventilation holes) is not particularly limited as long as the ventilation can be secured. The aperture ratio is preferably 0.001 to 45%, more preferably 0.01 to 20%. When the aperture ratio is as described above, excellent air permeability can be exhibited while maintaining the strength of the light emitting sheet, so that more excellent air permeability can be exhibited. The total area of the openings of the ventilation holes is the area obtained by adding all the areas of the openings of the plurality of ventilation holes formed in the surface direction of the light emitting sheet.
通気孔の開口部の大きさは、通気孔が発光シートの厚さ方向に通気可能な大きさであれば、特に限定されず、発光シートの用途に応じて適宜選択できる。
The size of the opening of the ventilation hole is not particularly limited as long as the ventilation hole has a size capable of ventilating in the thickness direction of the light emitting sheet, and can be appropriately selected depending on the use of the light emitting sheet.
（電源供給手段）
本実施形態の発光シートは、さらに、前記ＬＥＤ素子や前記ＬＥＤ制御手段（さらに必要に応じて無線通信手段）に電力を供給する電源供給手段を備えていてもよい。電源供給手段は特に限定されず、一般的なバッテリー（電池）のほか、電磁誘導、磁界共鳴、電界結合、レーザー、超音波など種々の無線給電手段、プラグによる有線給電手段等を使用することが可能である。電源は一般的には直流（ＤＣ）電源を使用するが、より高圧の交流（ＡＣ）電源であってもよく、その場合には変圧器等を用いて供給される電力を直流電圧や電流にしてもよい。 (Power supply means)
The light emitting sheet of the present embodiment may further include a power supply means for supplying electric power to the LED element and the LED control means (further, if necessary, a wireless communication means). The power supply means is not particularly limited, and in addition to a general battery (battery), various wireless power supply means such as electromagnetic induction, magnetic field resonance, electric field coupling, laser, ultrasonic wave, wired power supply means by a plug, etc. can be used. It is possible. A direct current (DC) power source is generally used as the power source, but a higher voltage alternating current (AC) power source may be used. You may.
本実施形態の発光シートは、さらに、前記ＬＥＤ素子や前記ＬＥＤ制御手段（さらに必要に応じて無線通信手段）に電力を供給する電源供給手段を備えていてもよい。電源供給手段は特に限定されず、一般的なバッテリー（電池）のほか、電磁誘導、磁界共鳴、電界結合、レーザー、超音波など種々の無線給電手段、プラグによる有線給電手段等を使用することが可能である。電源は一般的には直流（ＤＣ）電源を使用するが、より高圧の交流（ＡＣ）電源であってもよく、その場合には変圧器等を用いて供給される電力を直流電圧や電流にしてもよい。 (Power supply means)
The light emitting sheet of the present embodiment may further include a power supply means for supplying electric power to the LED element and the LED control means (further, if necessary, a wireless communication means). The power supply means is not particularly limited, and in addition to a general battery (battery), various wireless power supply means such as electromagnetic induction, magnetic field resonance, electric field coupling, laser, ultrasonic wave, wired power supply means by a plug, etc. can be used. It is possible. A direct current (DC) power source is generally used as the power source, but a higher voltage alternating current (AC) power source may be used. You may.
（その他の電子部品）
本実施形態の発光シートは、さらに、ＬＥＤ素子以外にも、その他の電子部品を備えていてもよい。搭載可能な電子部品は特に限定されず、一般的な受動素子、能動素子、集積回路、ディスプレイ、モーター、スピーカー、圧電素子、スイッチ、ヒューズ、アンテナ、ヒートシンク、加速度センサー、温度センサー、湿度センサー、光センサー、超音波センサー、ｐＨセンサー、ガスセンサー、動体センサー、角度センサー、磁気センサー、ジャイロセンサー、圧力センサー、方位センサー、放射線センサー、音センサー、ＧＰＳ受信機等が挙げられる。 (Other electronic components)
The light emitting sheet of the present embodiment may further include other electronic components in addition to the LED element. The electronic components that can be mounted are not particularly limited, and are general passive elements, active elements, integrated circuits, displays, motors, speakers, piezoelectric elements, switches, fuses, antennas, heat sinks, acceleration sensors, temperature sensors, humidity sensors, and light. Examples include sensors, ultrasonic sensors, pH sensors, gas sensors, moving body sensors, angle sensors, magnetic sensors, gyro sensors, pressure sensors, orientation sensors, radiation sensors, sound sensors, GPS receivers and the like.
本実施形態の発光シートは、さらに、ＬＥＤ素子以外にも、その他の電子部品を備えていてもよい。搭載可能な電子部品は特に限定されず、一般的な受動素子、能動素子、集積回路、ディスプレイ、モーター、スピーカー、圧電素子、スイッチ、ヒューズ、アンテナ、ヒートシンク、加速度センサー、温度センサー、湿度センサー、光センサー、超音波センサー、ｐＨセンサー、ガスセンサー、動体センサー、角度センサー、磁気センサー、ジャイロセンサー、圧力センサー、方位センサー、放射線センサー、音センサー、ＧＰＳ受信機等が挙げられる。 (Other electronic components)
The light emitting sheet of the present embodiment may further include other electronic components in addition to the LED element. The electronic components that can be mounted are not particularly limited, and are general passive elements, active elements, integrated circuits, displays, motors, speakers, piezoelectric elements, switches, fuses, antennas, heat sinks, acceleration sensors, temperature sensors, humidity sensors, and light. Examples include sensors, ultrasonic sensors, pH sensors, gas sensors, moving body sensors, angle sensors, magnetic sensors, gyro sensors, pressure sensors, orientation sensors, radiation sensors, sound sensors, GPS receivers and the like.
（発光シートの製造方法）
本実施形態の発光シートは、例えば、前記繊維層を、上述したような樹脂層を構成する熱硬化性樹脂組成物に浸漬したり、繊維層に前記樹脂組成物を塗布したり、フィルム状の前記樹脂組成物を繊維層に貼り合わせたりすること等によって形成される基材シートの上に、上述したような導体層とＬＥＤ素子と、必要に応じてＬＥＤ制御手段を設けることによって得られる。 (Manufacturing method of light emitting sheet)
The light emitting sheet of the present embodiment is, for example, a film-like light-emitting sheet in which the fiber layer is immersed in a thermosetting resin composition constituting the resin layer as described above, the resin composition is applied to the fiber layer, or the fiber layer is coated with the resin composition. It is obtained by providing a conductor layer as described above, an LED element, and, if necessary, an LED control means on a base material sheet formed by bonding the resin composition to a fiber layer or the like.
本実施形態の発光シートは、例えば、前記繊維層を、上述したような樹脂層を構成する熱硬化性樹脂組成物に浸漬したり、繊維層に前記樹脂組成物を塗布したり、フィルム状の前記樹脂組成物を繊維層に貼り合わせたりすること等によって形成される基材シートの上に、上述したような導体層とＬＥＤ素子と、必要に応じてＬＥＤ制御手段を設けることによって得られる。 (Manufacturing method of light emitting sheet)
The light emitting sheet of the present embodiment is, for example, a film-like light-emitting sheet in which the fiber layer is immersed in a thermosetting resin composition constituting the resin layer as described above, the resin composition is applied to the fiber layer, or the fiber layer is coated with the resin composition. It is obtained by providing a conductor layer as described above, an LED element, and, if necessary, an LED control means on a base material sheet formed by bonding the resin composition to a fiber layer or the like.
前記熱硬化性樹脂組成物の塗布方法としては、特に限定はされないが、例えば、バーコーター、コンマコーターやダイコーター、ロールコーター、グラビアコータ、インクジェット等が挙げられる。
The method for applying the thermosetting resin composition is not particularly limited, and examples thereof include a bar coater, a comma coater, a die coater, a roll coater, a gravure coater, and an inkjet.
樹脂層を繊維層に含浸させる場合は、当該含浸は、必要に応じて複数回繰り返すことも可能である。また、この際、組成や濃度の異なる複数の樹脂ワニスを用いて含浸を繰り返し、最終的に希望とする組成及び樹脂量に調整することも可能である。
When the fiber layer is impregnated with the resin layer, the impregnation can be repeated multiple times as needed. Further, at this time, it is also possible to repeat impregnation using a plurality of resin varnishes having different compositions and concentrations to finally adjust the desired composition and amount of resin.
樹脂ワニスを塗布した後、もしくは樹脂ワニスを含浸した後、加熱によって有機溶媒を含む硬化前の樹脂組成物を含む樹脂層（Ａステージ）から有機溶媒を揮発させ、有機溶媒を減少又は除去させことができる。樹脂組成物（樹脂ワニス）が塗布または含浸された繊維層を、所望の加熱条件、例えば８０～１２０℃で１～１２０分間加熱して、有機溶媒を減少又は除去された未硬化状態もしくは半硬化状態（Ｂステージ）の樹脂層が得られる。なお、本実施形態において、樹脂組成物のＢステージ、すなわち未硬化状態（未硬化物）もしくは半硬化状態（半硬化物）とは、樹脂組成物をさらに硬化しうる状態のものである。例えば、樹脂組成物は、加熱すると、最初、粘度が徐々に低下し、その後、硬化が開始し、粘度が徐々に上昇する。このような場合、半硬化としては、粘度が上昇し始めてから、完全に硬化する前の間の状態等が挙げられる。
After applying the resin varnish or impregnating the resin varnish, the organic solvent is volatilized from the resin layer (A stage) containing the resin composition before curing containing the organic solvent by heating to reduce or remove the organic solvent. Can be done. The fiber layer coated or impregnated with the resin composition (resin varnish) is heated under desired heating conditions, for example, 80 to 120 ° C. for 1 to 120 minutes to reduce or remove the organic solvent in an uncured or semi-cured state. The resin layer in the state (B stage) is obtained. In the present embodiment, the B stage of the resin composition, that is, the uncured state (uncured product) or the semi-cured state (semi-cured product) is a state in which the resin composition can be further cured. For example, when the resin composition is heated, the viscosity gradually decreases first, then curing starts, and the viscosity gradually increases. In such a case, the semi-curing state includes a state between the time when the viscosity starts to increase and the time before it is completely cured.
さらに加熱することによって、樹脂層を硬化させることができる。樹脂組成物（樹脂ワニス）が塗布または含浸された断熱層を、所望の加熱条件、例えば８０～２００℃で１～１２０分間加熱して、硬化状態（Ｃステージ）の樹脂層が得られる。なお、本実施形態において、樹脂組成物のＣステージ、すなわち硬化状態（硬化物）とは、硬化反応が進行し、樹脂が架橋することにより、加熱しても溶融しない状態となったもののことをさす。
The resin layer can be cured by further heating. The heat insulating layer coated or impregnated with the resin composition (resin varnish) is heated at a desired heating condition, for example, 80 to 200 ° C. for 1 to 120 minutes to obtain a cured resin layer (C stage). In the present embodiment, the C stage of the resin composition, that is, the cured state (cured product) is a state in which the curing reaction proceeds and the resin is crosslinked so that it does not melt even when heated. As expected.
フィルム状の前記樹脂組成物を樹脂層として繊維層に貼り合わせる場合は、例えば、予め所望のプラスチックフィルム、金属箔等に前記樹脂組成物を塗工し、有機溶媒を含む硬化前（Ａステージ）の樹脂組成物を含む樹脂層、もしくは、所望の加熱条件、例えば８０～１２０℃で１～１２０分間加熱して、未硬化状態もしくは半硬化状態（Ｂステージ）の樹脂層を得る。これを繊維層へ貼り合わせ、圧力、熱等の外部エネルギーによって断熱層へ定着させることで得られる。また、これにより表面粗さＲｚが規定の範囲内の断熱シートが得られる。未硬化状態もしくは半硬化状態（Ｂステージ）の樹脂層でもよいし、さらに加熱によって、樹脂層を硬化させ、硬化状態（Ｃステージ）の樹脂層でもよい。
When the film-shaped resin composition is bonded to the fiber layer as a resin layer, for example, the resin composition is previously applied to a desired plastic film, metal foil, or the like, and before curing (A stage) containing an organic solvent. The resin layer containing the resin composition of the above, or a resin layer in an uncured or semi-cured state (B stage) is obtained by heating at a desired heating condition, for example, 80 to 120 ° C. for 1 to 120 minutes. It is obtained by bonding this to the fiber layer and fixing it to the heat insulating layer by external energy such as pressure and heat. Further, as a result, a heat insulating sheet having a surface roughness Rz within a specified range can be obtained. It may be a resin layer in an uncured or semi-cured state (B stage), or may be a resin layer in a cured state (C stage) by further curing the resin layer by heating.
次に、前記基材シートの上に、導体層として、上述したような金属箔や導電性組成物で形成される配線、極薄く塗工された導電層等を設ける。導体層を設ける方法は、上述した通りである。
Next, on the base material sheet, as a conductor layer, a wiring formed of a metal foil or a conductive composition as described above, an ultrathinly coated conductive layer, or the like is provided. The method of providing the conductor layer is as described above.
そして、前記導体層の上にＬＥＤ素子を設置するが、その実装方法は特に限定されず、例えば、はんだごてを用いる方法や、種々のクリームはんだを印刷した後、種々の部品実装装置にてＬＥＤ素子をマウントし、種々のリフロー装置によって実装する方法などが挙げられる。特に、繊維層の耐熱性を考慮すると、誘導加熱、マイクロ波等により金属部分のみ加熱する手段を用いることが好ましい。
Then, the LED element is installed on the conductor layer, but the mounting method thereof is not particularly limited. For example, a method using a soldering iron or various cream solders are printed and then mounted on various component mounting devices. Examples thereof include a method of mounting an LED element and mounting it by various reflow devices. In particular, considering the heat resistance of the fiber layer, it is preferable to use a means for heating only the metal portion by induction heating, microwaves, or the like.
さらに、本実施形態の発光シートが通気孔を有する場合、前記通気孔の形成方法は、特に限定されず、例えば、前記基材シートにドリルやレーザー、打ち抜き加工等を用いて前記通気孔を形成する方法等が挙げられる。また、予め開口部を設けた樹脂層を繊維層に貼り合わせる方法を用いてもよい。
Further, when the light emitting sheet of the present embodiment has ventilation holes, the method for forming the ventilation holes is not particularly limited, and for example, the ventilation holes are formed on the base material sheet by using a drill, a laser, punching, or the like. How to do it, etc. Further, a method of adhering a resin layer having an opening in advance to the fiber layer may be used.
（用途）
本実施形態の発光シートは、装着性や形状追従性の要求と、耐熱性の要求の高い様々な用途に用いることができる。具体的には、例えば、表示装置、紫外線照射装置、赤外線照射装置、殺菌装置、衣類および服飾品などに使用することが可能である。 (Use)
The light emitting sheet of the present embodiment can be used for various applications in which wearability, shape followability, and heat resistance are high. Specifically, it can be used, for example, in a display device, an ultraviolet irradiation device, an infrared irradiation device, a sterilizer, clothing, clothing, and the like.
本実施形態の発光シートは、装着性や形状追従性の要求と、耐熱性の要求の高い様々な用途に用いることができる。具体的には、例えば、表示装置、紫外線照射装置、赤外線照射装置、殺菌装置、衣類および服飾品などに使用することが可能である。 (Use)
The light emitting sheet of the present embodiment can be used for various applications in which wearability, shape followability, and heat resistance are high. Specifically, it can be used, for example, in a display device, an ultraviolet irradiation device, an infrared irradiation device, a sterilizer, clothing, clothing, and the like.
表示装置の具体例としては、デジタルサイネージ、電子ペーパー、屋外広告表示装置、各種フレキシブルディスプレイ、照明等が挙げられる。本実施形態の発光シートを使用するデジタルサイネージ等の表示装置は、柔軟で軽い点、大画面にした場合でも低価格で製造できる点、布等の生地に貼り付けることが可能な点等を優れた利点として有する。
Specific examples of display devices include digital signage, electronic paper, outdoor advertisement display devices, various flexible displays, lighting, and the like. The display device such as digital signage using the light emitting sheet of the present embodiment is excellent in that it is flexible and light, it can be manufactured at a low price even when it has a large screen, and it can be attached to a cloth such as cloth. Has as an advantage.
より具体的には、本実施形態の表示装置は、布帛と、前記布帛に形成された表示部とを備え、前記表示部の少なくとも一部が上述したような発光シートを用いて形成されている。ここで布帛とは、特に限定はされないが、ポリエステル系合成繊維といった布帛を使用することができる。
More specifically, the display device of the present embodiment includes a cloth and a display unit formed on the cloth, and at least a part of the display unit is formed by using a light emitting sheet as described above. .. Here, the cloth is not particularly limited, but a cloth such as a polyester-based synthetic fiber can be used.
本実施形態の発光シートを用いる紫外線照射装置は、布帛と、前記布帛に形成された紫外線照射部とを備え、前記紫外線照射部の少なくとも一部が上述したような発光シートを用いて形成されている。紫外線照射装置としては、様々な形態が可能であり、いくつか具体例を示すと、例えば、図４に示すようなる紫外線照射用グローブ（手袋）や、図６に示すような紫外線照射シート等が挙げられる。このような紫外線照射装置を用いて、殺菌処理などを行うことができる。
The ultraviolet irradiation device using the light emitting sheet of the present embodiment includes a cloth and an ultraviolet irradiation portion formed on the cloth, and at least a part of the ultraviolet irradiation portion is formed by using the light emitting sheet as described above. There is. Various forms of the ultraviolet irradiation device are possible, and some specific examples include, for example, an ultraviolet irradiation glove (glove) as shown in FIG. 4, an ultraviolet irradiation sheet as shown in FIG. 6, and the like. Can be mentioned. A sterilization treatment or the like can be performed using such an ultraviolet irradiation device.
紫外線照射（殺菌）用グローブは、図４に示すように、例えば、布地や合成繊維等と樹脂層とからなる基材シート１で構成されるグローブに、導体層として配線４を設け、その上に複数のＬＥＤ素子５を搭載することができる。必要に応じて、グローブの手首周辺にＬＥＤ制御手段６、無線通信手段９、電源供給手段（電池）８等を設けてもよい。殺菌装置に用いる場合、前記発光シートが備えるＬＥＤ素子が発する光は紫外線（深紫外線）である。このような殺菌用グローブの使用形態としては、例えば、図５に示すように、ＬＥＤ素子のオン・オフを、殺菌用グローブを付けた手で握ったり、開いたりするだけで制御できるようにしてもよい。それにより、図５下段に示すように、殺菌・除菌したい対象に触れることなく、紫外線（深紫外線）による殺菌・除菌処理を行うことができる。
As shown in FIG. 4, the ultraviolet irradiation (sterilization) glove is obtained by providing a wiring 4 as a conductor layer on a glove composed of a base material sheet 1 composed of, for example, a cloth, a synthetic fiber, or a resin layer, and the wiring 4 is provided on the glove. A plurality of LED elements 5 can be mounted on the vehicle. If necessary, LED control means 6, wireless communication means 9, power supply means (battery) 8, and the like may be provided around the wrist of the glove. When used in a sterilizer, the light emitted by the LED element included in the light emitting sheet is ultraviolet light (deep ultraviolet light). As a usage pattern of such a sterilizing glove, for example, as shown in FIG. 5, the on / off of the LED element can be controlled only by grasping or opening the hand with the sterilizing glove. May be good. As a result, as shown in the lower part of FIG. 5, the sterilization / sterilization treatment by ultraviolet rays (deep ultraviolet rays) can be performed without touching the target to be sterilized / sterilized.
別の実施形態として、紫外線照射（殺菌）シートに前記発光シートを使用する場合には、図６に示すように、基材シート１の上に、導体層（図示せず）を介して複数のＬＥＤ素子（紫外線）５を搭載することができる。そのような殺菌シートは、例えば、ベッドの等の寝具や家具等に被せることによって、広範囲の殺菌が容易にできるようになると考えられる。
As another embodiment, when the light emitting sheet is used for the ultraviolet irradiation (sterilization) sheet, as shown in FIG. 6, a plurality of light emitting sheets are placed on the base sheet 1 via a conductor layer (not shown). An LED element (ultraviolet ray) 5 can be mounted. It is considered that such a sterilization sheet can be easily sterilized in a wide range by covering it with bedding such as a bed, furniture, or the like.
前記ＬＥＤ素子を紫外線ではなく赤外線を照射できるものに変更することによって、前記照射装置を赤外線照射装置とすることも可能である。赤外線照射装置は、赤外線ヒーターや赤外線通信手段等の用途に使用することができる。
It is also possible to make the irradiation device an infrared irradiation device by changing the LED element to one that can irradiate infrared rays instead of ultraviolet rays. The infrared irradiation device can be used for applications such as an infrared heater and an infrared communication means.
また、本実施形態の発光シートは、衣類や服飾品に適用することにより、衣類または服飾品に所望する画像や文字、動画等を表示することもできる。前記発光シートを用いることにより、柔軟であって摩耗を受けやすい衣類等に、低コストで光を取り入れることが可能となる。
Further, by applying the light emitting sheet of the present embodiment to clothing or clothing, it is possible to display desired images, characters, moving images, etc. on the clothing or clothing. By using the light emitting sheet, it is possible to take in light at low cost into clothes and the like that are flexible and susceptible to wear.
上述したような表示装置、紫外線照射装置、赤外線照射装置、衣類等は、上述した発光シートを用いて、公知の手法で製造することが可能である。例えば、布帛に上述したような発光シートを貼り付けたり、布帛の一部を上述したような発光シートに置き換えたりすることによって、所望の表示装置、照射装置、衣類等を形成することができる。
The above-mentioned display device, ultraviolet irradiation device, infrared irradiation device, clothing, etc. can be manufactured by a known method using the above-mentioned light emitting sheet. For example, a desired display device, irradiation device, clothing, or the like can be formed by attaching a light emitting sheet as described above to the cloth or replacing a part of the cloth with the light emitting sheet as described above.
なお、本実施形態の発光シートは耐熱性を有しているため、上記のようにリフローによるＬＥＤ素子等の実装が可能である。また、リフローのほか、溶接、はんだごて、誘導加熱、マイクロ波等種々の加熱手段を用いることができる。局所加熱できる手段であっても樹脂層が耐熱性を有しているため、溶融や熱分解を起こすことがない。また、ＡＣＦなどで実装することも可能である。
Since the light emitting sheet of this embodiment has heat resistance, it is possible to mount an LED element or the like by reflow as described above. In addition to reflow, various heating means such as welding, soldering iron, induction heating, and microwave can be used. Even if it is a means capable of local heating, since the resin layer has heat resistance, it does not melt or thermally decompose. It can also be implemented by ACF or the like.
また、例えば種々の印刷技術を用いて素子を形成し、上述したような各種装置等を製造することもできる。これらを製造する工程において加熱プロセスが必要な場合でも、樹脂層が耐熱性を有しているため、溶融や熱分解を起こすことがない。
Further, for example, it is also possible to form an element by using various printing techniques and manufacture various devices and the like as described above. Even if a heating process is required in the process of manufacturing these, the resin layer has heat resistance, so that it does not melt or thermally decompose.
この出願は、２０２０年５月２５日に出願された日本国特許出願特願２０２０－９０６２０を基礎とするものであり、その内容は、本願に含まれるものである。
This application is based on Japanese Patent Application No. 2020-90620 filed on May 25, 2020, the contents of which are included in the present application.
本発明を表現するために、前述において具体例や図面等を参照しながら実施形態を通して本発明を適切かつ十分に説明したが、当業者であれば前述の実施形態を変更及び／又は改良することは容易になし得ることであると認識すべきである。したがって、当業者が実施する変更形態又は改良形態が、請求の範囲に記載された請求項の権利範囲を離脱するレベルのものでない限り、当該変更形態又は当該改良形態は、当該請求項の権利範囲に包括されると解釈される。
In order to express the present invention, the present invention has been appropriately and sufficiently described through the embodiments with reference to specific examples, drawings and the like, but those skilled in the art may modify and / or improve the above-described embodiments. Should be recognized as something that can be done easily. Therefore, unless the modified or improved form implemented by a person skilled in the art is at a level that deviates from the scope of rights of the claims stated in the claims, the modified form or the improved form is the scope of rights of the claims. It is interpreted to be included in.
本発明は、発光シートやそれを用いた各種デバイスに関する技術分野において、広範な産業上の利用可能性を有する。
The present invention has a wide range of industrial applicability in the technical field relating to a light emitting sheet and various devices using the same.
The present invention has a wide range of industrial applicability in the technical field relating to a light emitting sheet and various devices using the same.
Claims (16)
- 基材シートと、
導体層と、
ＬＥＤ素子と、
ＬＥＤ制御手段とを備え、
前記基材シートは、繊維層と前記繊維層の一方の面における表面の少なくとも一部に形成されている樹脂層とを含み、且つ２５℃において５％以上の伸長が可能であり、
前記導体層は、前記樹脂層の表面または内部に形成されており、
前記ＬＥＤ素子は前記導体層に電気的に接続されており、
前記ＬＥＤ制御手段は前記基材シート上において前記ＬＥＤ素子と通信可能に敷設されている、
発光シート。 Base sheet and
With the conductor layer,
With LED elements
Equipped with LED control means
The base material sheet contains a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and can be stretched by 5% or more at 25 ° C.
The conductor layer is formed on the surface or inside of the resin layer.
The LED element is electrically connected to the conductor layer and is connected to the conductor layer.
The LED control means is laid on the base material sheet so as to be communicable with the LED element.
Luminescent sheet. - 前記基材シートは、樹脂層が形成されている部位における初期引張弾性率が１ＭＰａ以上１０ＧＰａ以下である、請求項1に記載の発光シート。 The light emitting sheet according to claim 1, wherein the base material sheet has an initial tensile elastic modulus of 1 MPa or more and 10 GPa or less at a portion where a resin layer is formed.
- 前記繊維層は導電性配線を備える、請求項１または２に記載の発光シート。 The light emitting sheet according to claim 1 or 2, wherein the fiber layer includes conductive wiring.
- 前記樹脂層が熱硬化性樹脂を含む、請求項１～３のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 3, wherein the resin layer contains a thermosetting resin.
- 前記樹脂層が、前記繊維層の一方の面の少なくとも一部に含浸されている、請求項１～４のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 4, wherein the resin layer is impregnated into at least a part of one surface of the fiber layer.
- 前記基材シートが通気孔を備える、請求項１～５のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 5, wherein the base material sheet has ventilation holes.
- さらに電源供給手段を備える、請求項１～６のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 6, further comprising a power supply means.
- 前記ＬＥＤ制御手段へ信号データを送るための無線通信手段を有する、請求項１～７のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 7, which has a wireless communication means for sending signal data to the LED control means.
- 前記熱硬化性樹脂のガラス転移温度が６０℃以下である、請求項４～８のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 4 to 8, wherein the thermosetting resin has a glass transition temperature of 60 ° C. or lower.
- 前記基材シートにおける繊維層が、織物、編物、組物、不織布またはこれらの組み合わせで構成されている、請求項１～９のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 9, wherein the fiber layer in the base material sheet is composed of a woven fabric, a knitted fabric, a braid, a non-woven fabric, or a combination thereof.
- 前記通気孔は、前記基材シートの面方向における形状が、円形、楕円形、多角形、又はこれらの組合せである、請求項６～１０のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 6 to 10, wherein the vent hole has a circular, elliptical, polygonal, or a combination thereof in the shape of the base material sheet in the plane direction.
- 前記ＬＥＤ素子が発光する光が可視光、紫外線、及び赤外光から選択される少なくとも一つである、請求項１～１１のいずれかに記載の発光シート。 The light emitting sheet according to any one of claims 1 to 11, wherein the light emitted by the LED element is at least one selected from visible light, ultraviolet light, and infrared light.
- 布帛と、前記布帛に形成された表示部とを備え、前記表示部の少なくとも一部が請求項１～１２のいずれかに記載の発光シートを用いて形成されている表示装置。 A display device including a cloth and a display unit formed on the cloth, wherein at least a part of the display unit is formed by using the light emitting sheet according to any one of claims 1 to 12.
- 布帛と、前記布帛に形成された紫外線照射部とを備え、前記紫外線照射部の少なくとも一部が請求項１～１２のいずれかに記載の発光シートを用いて形成されている紫外線照射装置。 An ultraviolet irradiation device including a cloth and an ultraviolet irradiation unit formed on the cloth, wherein at least a part of the ultraviolet irradiation unit is formed by using the light emitting sheet according to any one of claims 1 to 12.
- 布帛を備え、前記布帛の少なくとも一部が請求項１～１２のいずれかに記載の発光シートを用いて形成されている、衣類。 A woven fabric comprising a woven fabric, wherein at least a part of the woven fabric is formed by using the light emitting sheet according to any one of claims 1 to 12.
- 布帛と、前記布帛に形成された赤外線照射部とを備え、前記赤外線照射部の少なくとも一部が請求項１～１２のいずれかに記載の発光シートを用いて形成されている赤外線照射装置。 An infrared irradiation device including a cloth and an infrared irradiation unit formed on the cloth, wherein at least a part of the infrared irradiation unit is formed by using the light emitting sheet according to any one of claims 1 to 12.
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