WO2021217789A1 - 热超导散热板、散热器及5g基站设备 - Google Patents

热超导散热板、散热器及5g基站设备 Download PDF

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Publication number
WO2021217789A1
WO2021217789A1 PCT/CN2020/095042 CN2020095042W WO2021217789A1 WO 2021217789 A1 WO2021217789 A1 WO 2021217789A1 CN 2020095042 W CN2020095042 W CN 2020095042W WO 2021217789 A1 WO2021217789 A1 WO 2021217789A1
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WIPO (PCT)
Prior art keywords
heat dissipation
heat
pipeline
thermal superconducting
pipe
Prior art date
Application number
PCT/CN2020/095042
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English (en)
French (fr)
Inventor
仝爱星
孙会会
曾巧
林深
Original Assignee
浙江嘉熙科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202020665914.0U external-priority patent/CN212458058U/zh
Priority claimed from CN202010345039.2A external-priority patent/CN111504095A/zh
Application filed by 浙江嘉熙科技有限公司 filed Critical 浙江嘉熙科技有限公司
Publication of WO2021217789A1 publication Critical patent/WO2021217789A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the technical field of heat dissipation, in particular to a thermal superconducting heat sink, a radiator and 5G base station equipment.
  • the purpose of the present invention is to provide a thermal superconducting heat sink, a radiator and 5G base station equipment, which are used to solve the problem of the all-aluminum toothed radiator or die-cast radiator in the prior art It is large and bulky, and it also has disadvantages such as uneven heat dissipation and low heat dissipation efficiency, which cannot meet the heat dissipation requirements of 5G communication base station equipment with high integration, high power, miniaturization, light weight, and high heat flow density.
  • the present invention provides a thermal superconducting heat sink, in which a heat dissipation main pipe, a liquid drop pipe, a heat receiving side connecting pipe, and a condensing side connecting pipe are distributed in the thermal superconducting heat sink
  • the heat-receiving side communication pipeline is located on the side of the thermal superconducting heat dissipation plate adjacent to the device, and the condensing-side pipeline is located on the side opposite to the heat-receiving side communication pipeline;
  • the heat dissipation main pipe Connected between the heat-receiving-side communication pipeline and the condensing-side communication pipeline, the liquid drop pipeline is located under the heat dissipation main pipe one-to-one correspondence, and one end is connected to the corresponding heat dissipation main pipe , The other end is connected to the heat-receiving side communication pipeline;
  • the heat dissipation main pipe is gradually inclined upward in a direction away from the heat-receiving communication
  • the plurality of heat dissipation main pipes are arranged in parallel and spaced apart, and the heat-receiving side communication pipeline and the condensing side communication pipeline are arranged in parallel and spaced apart.
  • the main heat dissipation pipeline is a circular arc-shaped pipeline with the arc-shaped protrusion facing downward.
  • the thermal superconducting heat dissipation plate further includes a plurality of steam rising pipes, the steam rising pipes are located above the heat dissipation main pipe in a one-to-one correspondence, and both ends are connected with the heat dissipation main pipe.
  • the thermal superconducting heat dissipation plate further includes a plurality of steam rising pipes, the steam rising pipes are located above the heat dissipation main pipe in a one-to-one correspondence, and one end is connected to the heat dissipation main pipe, and the other One end is connected with the condensing side communication pipeline.
  • the heat-receiving-side connecting pipe, the heat-radiating main pipe, and the liquid descending pipe constitute a rectangular island-free area;
  • the heat-radiating main pipe, the steam rising pipe, and the condensing-side connecting pipe constitute a rectangular pipe-less island area. Road isolated island area.
  • the thermal superconducting heat dissipation plate further includes an auxiliary branch, the auxiliary branch is located at the lower part of the heat dissipation main pipe at the bottom and both ends are connected with the bottom heat dissipation main pipe.
  • the present invention also provides a thermal superconducting radiator.
  • the thermal superconducting radiator includes a radiator substrate and a plurality of thermal superconducting heat dissipation plates as described in any of the above solutions;
  • the radiator substrate has a first surface And a second surface opposite to the first surface, the first surface is provided with a plurality of mounting areas for placing heating devices from bottom to top;
  • the plurality of thermal superconducting heat dissipation plates are arranged in parallel and spaced apart On the second surface, and each of the thermal superconducting heat dissipation plates extends in the longitudinal direction.
  • the second surface of the heat sink substrate has a channel
  • one end of the thermal superconducting heat sink has a bending part
  • the bending part is inserted in the channel.
  • the present invention also provides a 5G base station equipment.
  • the 5G base station equipment includes a heating device and the thermal superconducting heat sink according to any one of the foregoing solutions.
  • the heating device of the 5G base station device is installed on the heat sink substrate. area.
  • thermal superconducting heat sink, heat sink and 5G base station equipment of the present invention have the following beneficial effects:
  • the thermal superconducting heat dissipation plate of the present invention has improved and optimized heat dissipation pipeline structure design, which solves the problems of local dryness and high temperature caused by the insufficient liquid heat conduction working medium of the upper heat source located in the thermal superconducting heat dissipation plate, and can reduce heat transfer at the same time.
  • the total amount of working fluids reduces the weight and volume of thermal superconducting heat sinks while significantly improving heat dissipation uniformity and heat dissipation efficiency, which can fully meet the development requirements of 5G base station equipment such as miniaturization, light weight, high integration and uniform temperature.
  • the 5G base station equipment based on the thermal superconducting radiator of the present invention can significantly improve the heat dissipation performance, which helps to extend the service life of the equipment and improve the performance of the equipment.
  • FIG. 1 is a schematic diagram of the structure of the thermal superconducting heat sink in the first embodiment.
  • Fig. 2 is a schematic diagram showing the flow of the heat transfer working fluid in the thermal superconducting heat sink in Fig. 1.
  • FIG. 3 is a schematic diagram showing the structure of the thermal superconducting heat sink in the second embodiment.
  • FIG. 4 is a schematic diagram showing the flow of the heat transfer working fluid in the thermal superconducting heat sink in FIG. 3.
  • FIG. 5 is a schematic diagram showing the structure of the thermal superconducting heat sink in the third embodiment.
  • FIG. 6 is a schematic diagram showing the structure of the thermal superconducting heat sink in the fourth embodiment.
  • FIG. 7 is a partial enlarged schematic diagram showing the connection between the thermal superconducting heat sink in FIG. 6 and the heat sink substrate.
  • the present invention provides a thermal superconducting heat sink 1 in which a heat dissipation main pipe 11, a liquid drop pipe 12, a heat receiving side communication pipe 13 and Condensation side communication pipeline 14;
  • the heat-receiving side communication pipeline 13 is located on the side of the thermal superconducting heat sink 1 adjacent to the heating device 3, and the condensing-side pipeline is located in the heat-receiving side communication pipeline 13 on the opposite side;
  • the heat dissipation main pipe 11 is connected between the heat-receiving side communication pipe 13 and the condensing side communication pipe 14, and the liquid down pipeline 12 is located in the heat dissipation main pipe one-to-one correspondence 11 below, and one end is connected to the corresponding heat dissipation main pipe 11, and the other end is connected to the heat receiving side communication pipe 13;
  • the heat dissipation main pipe 11 is in a direction away from the heat receiving side communication pipe 13 Gradually inclined upward;
  • the improved and optimized thermal superconductor path structure of the thermal superconducting heat sink of the present invention solves the problems of local dryness and high temperature caused by the insufficient liquid heat transfer working medium 4 in the upper heat source of the thermal superconducting heat sink, and at the same time, it can reduce The total amount of heat transfer working medium 4 reduces the weight and volume of the thermal superconducting heat sink 1 while significantly improving heat dissipation uniformity and heat dissipation efficiency, which can fully meet the miniaturization, light weight, high integration and uniform temperature of 5G base station equipment And other development requirements.
  • the side of the thermal superconducting heat sink 1 adjacent to the heating device 3, that is, the place where it is connected to the heat-receiving-side communication pipe 13, has a pipe-free heat-receiving area 17 (ie There are no pipelines in this area).
  • This area is formed because of the need to reserve a space on the thermal superconducting heat sink 1 to connect with the heat sink substrate 2 to avoid connecting the thermal superconducting heat sink 1 and the heat sink substrate 2
  • the pipeline is damaged during the process of connection (for example, connection by means of glue connection, welding, expansion joint, embedding, etc.).
  • the thermal superconducting heat sink 1 at one end of the thermal superconducting heat sink 1 away from the heating element 3, that is, on the outside of the condensing-side communicating pipe 14, there is a pipe-less heat dissipation area 18, which is not formed with pipes to avoid When the thermal superconducting heat sink 1 collides with the outside, the pipeline is damaged. Because the main heat dissipation pipeline 11, the liquid down pipeline 12, the heat-receiving side communication pipeline 13 and the condensing side communication pipeline 14 communicate with each other to form a closed pipeline (the thermal superconducting heat sink 1 is provided with a heat transfer working medium 4). Filling port (not labeled), the heat transfer working medium 4 inside is filled during the manufacturing process of the thermal superconducting heat sink 1. Once any section of the pipeline has pressure-bearing strength and air-tightness problems resulting in deformation and liquid leakage, it will destroy the performance of the heat conduction plate, so the pipe-free area on both sides can play a better protective effect.
  • heating devices are electronic components that can achieve preset functions, including but not limited to radio frequency generators, power amplifiers, filters, microprocessors, memories, power managers, etc., which generate heat during operation. Causes the temperature to rise, too high temperature will reduce the performance, operating speed and even damage of the device, so these heating devices need to be dissipated in time.
  • the thermal superconducting heat sink 1 realizes heat transfer based on the thermal superconducting heat transfer technology; the thermal superconducting technology is to fill the heat transfer working medium 4 in the sealed interconnected microchannels, and pass the heat transfer The evaporation or condensation phase change of the thermal working medium 4 realizes the phase change heat transfer technology of thermal superconducting heat transfer.
  • the thermal superconducting heat dissipation plate 1 is a composite plate structure, including a first plate and a second plate, the thermal superconductor path is formed by a rolling inflation process or a mold forming brazing process, and the first plate
  • the material of the second plate and the second plate are both metal materials with good thermal conductivity, such as, but not limited to, copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, or any combination of more than one, that is, the
  • the first plate and the second plate may be a single layer of material or multiple layers of material, but the inner layer is preferably an aluminum material layer.
  • the first plate and the second plate may be a copper-aluminum composite plate including a copper material layer and an aluminum material layer, or a stainless steel-aluminum composite plate including a stainless steel material layer and an aluminum material layer, It may also be an iron-aluminum composite sheet including an iron material layer and an aluminum material layer, or an aluminum alloy-aluminum composite sheet including an aluminum alloy material layer and an aluminum material layer; all of the first sheet and the second sheet
  • the aluminum material layer is in contact, that is, the second material layer in the first plate is an aluminum material layer, and the second material layer in the second plate is an aluminum material layer.
  • the inner layers of the first plate and the second plate are set as aluminum material layers.
  • the first plate and the second plate are aluminum-copper composite plates, it can be ensured that the copper material layer is located outside , That is, the outer surface of the thermal superconducting heat sink 1 is a copper layer, which can be directly brazed or soldered, which is convenient for operation and stable in quality, which can solve the welding problem between the thermal superconducting heat sink 1 and the heat sink substrate 2 .
  • the thermal superconducting heat dissipation plate 1 may be in a single-sided expansion form, that is, the thermal superconducting heat dissipation pipeline (including the heat dissipation main pipeline 11, the liquid down pipeline 12, the heat receiving side communication pipeline 13 and the condensation side communication pipeline 14 , These pipelines can be formed simultaneously in the same process) only protrude from one surface of the thermal superconducting heat sink 1, or they can be double-sided expansion, that is, the thermal superconducting heat dissipation pipes protrude from The thermal superconducting heat sink 1 is on both surfaces.
  • the single-sided expansion is preferred, and when multiple thermal superconducting heat sinks 1 are used in the same thermal superconducting heat sink, the protrusions of the multiple thermal superconducting heat sinks 1 are preferably symmetrical. Outer distribution (take the centerline of the thermal superconducting radiator as the criterion, the thermal superconducting heat dissipation pipes on the surface of the thermal superconducting heat sink 1 on both sides bulge away from the centerline) to ensure the thermal superconducting heat dissipation
  • the structure is more balanced and stable while having good heat dissipation performance.
  • the surface of the thermal superconducting heat sink 1 may be anodized to form an oxide film (not shown) on the surface of the thermal superconducting heat sink 1, thereby improving the heat dissipation of the thermal superconducting heat sink.
  • the corrosion resistance of the plate 1 can also increase the emissivity of the thermal superconducting heat sink 1 and enhance its heat exchange with the surrounding air.
  • the plurality of heat dissipation main pipes 11 are arranged in parallel and spaced apart, and the heat receiving side communication pipeline 13 and the condensing side communication pipeline 14 are arranged in parallel and spaced apart.
  • the main heat dissipation pipe 11 is a circular arc-shaped pipe with the arc-shaped protrusion facing downward.
  • the liquid descending pipeline 12 includes a first branch and a second branch.
  • the first branch is approximately vertical, one end of which is connected to the corresponding heat dissipation main pipe 11, and the other end is connected to the second branch.
  • the other end of the second branch is connected to the heat-receiving side communication pipeline 13 (it should be noted that when the pipelines are described as being connected to each other in this embodiment, the pipelines are also connected to each other.
  • the second branch is a near-horizontal pipeline or the inclination (that is, the angle with the horizontal plane) is smaller than the inclination of the heat dissipation main pipeline 11.
  • the main heat dissipation pipeline 11, the liquid down pipeline 12 and the heat-receiving-side communication pipeline 13 enclose a plurality of rectangular-shaped island-free island regions 10.
  • the thermal superconducting heat dissipation plate 1 further includes an auxiliary branch 16 which is located at the lower part of the main heat dissipation main line 11 at the bottom and is connected at both ends with the main heat dissipation main line 11 at the bottom.
  • the working principle of the thermal superconducting heat sink 1 of the present invention will be described below in conjunction with FIG. 1 and FIG. 2.
  • One end of the thermal superconducting heat sink 1 is close to the heat receiving side of the heat source (heating device 3), and the liquid drop pipeline 12 is used as a pipeline for the drop of the condensed liquid phase and is connected to the heat dissipation main pipe 11 and the heat receiving side communication pipeline 13, and
  • the liquid down pipeline 12 is located below the main heat dissipation line 11, so the liquid after heat exchange and condensation will mainly enter the liquid down pipeline 12 after reaching the intersection of the main heat dissipation line 11 and the liquid down pipeline 12, and then enters the heated side Connecting pipe 13, and the vapor bubbles generated by the heating and evaporation of the liquid working fluid in the heat-receiving side communicating pipe 13 flow upwards and enter the upwardly inclined heat dissipation main pipe 11.
  • the non-evaporated liquid in the heat-receiving side communication pipe 13 close to the heating element 3 flows downward to participate in the evaporation, condensation and heat exchange of the lower heat source, and does not enter a part of the gas-liquid mixture of the heat dissipation main pipe 11 Flow upward to participate in the evaporation, condensation and heat exchange of the upper heat source.
  • the condensing side communicating pipeline 14 far away from the heating element 3 the uncondensed excess gas from the heat dissipation main pipe 11 flows upwards and enters the upper heat dissipation main pipe 11 for condensation, and the excess condensed liquid flows downwards and enters the lower heat dissipation.
  • the main pipe 11 participates in the evaporation, so that the parts of the internal pipeline of the entire thermal superconducting heat sink 1 are connected to each other, and the pressure balance and the temperature are uniform. A small amount of heat transfer working fluid 4 can achieve a better heat dissipation effect. Conducive to the miniaturization and light weight of the radiator.
  • this embodiment provides a thermal superconducting heat sink 1 of another structure.
  • the difference between the thermal superconducting heat dissipation plate 1 of this embodiment and the first embodiment is that the thermal superconducting heat dissipation plate 1 of this embodiment further includes a plurality of steam rising pipes 15 which are located at all locations in a one-to-one correspondence. Above the heat dissipation main pipe 11, and both ends are connected with the heat dissipation main pipe 11, and the steam rising pipe 15 and the liquid falling pipe 12 are usually spaced apart, and the projections of the two in the longitudinal direction do not overlap .
  • the steam rising pipe 15 may include a straight section and a bent section located at both ends of the straight section, so the steam rising pipe 15 and the heat dissipation main pipe 11 enclose a plurality of similar rectangular islands without pipes.
  • Area 10 please refer to FIG. 3 for details.
  • the thermal superconducting heat dissipating plate 1 of this embodiment does not have the auxiliary branch 16 in the first embodiment, but is formed on the lower right side of the thermal superconducting heat dissipating plate 1 and gradually increases in the direction away from the heat-receiving side communicating pipeline 13 The heat dissipation area without pipes. Except for the above differences, the other structures of the thermal superconducting heat sink 1 of this embodiment are the same as those of the first embodiment.
  • this embodiment provides a thermal superconducting heat sink 1 of another structure.
  • the difference between the thermal superconducting heat sink 1 of this embodiment and the second embodiment is that both ends of the steam rising pipe 15 of the thermal superconducting heat sink 1 of the second embodiment are connected with the heat dissipation main pipe 11, while the present embodiment
  • the steam rising pipes 15 are also located above the heat dissipation main pipe 11 in a one-to-one correspondence, but one end of the steam rising pipe 15 of this embodiment is connected to the heat sink
  • the main pipe 11 is connected, and the other end is connected with the condensing side communication pipe 14, and the steam rising pipe 15 and the liquid falling pipe 12 are usually spaced apart, and the projections of the two in the longitudinal direction do not overlap.
  • the steam rising pipe 15 may include a straight section and a bent section located at one end of the straight section.
  • the steam rising pipe 15, the heat dissipation main pipe 11 and the condensing side communication pipe 14 enclose a plurality of similar rectangular shapes. No pipeline island area 10.
  • the thermal superconducting heat sink 1 of the present invention can be directly connected to the heating device 3 to realize heat dissipation.
  • a plurality of heating devices 3 can be directly attached to the side wall of the thermal superconducting heat sink 1 and distributed up and down in the longitudinal direction.
  • This heat dissipation method through a single thermal superconducting heat sink 1 is particularly suitable for heat dissipation of low-power heating devices.
  • the present invention also provides a thermal superconducting heat sink, which includes a heat sink substrate 2 and a plurality of thermal superconducting heat sinks according to any one of the first to third embodiments.
  • the heat dissipation plate 1 (the thermal superconducting heat sink in FIG. 6 takes the structure of the thermal superconducting heat dissipation plate 1 as an example).
  • the thermal superconducting heat dissipation plate 1 please refer to the foregoing content, for the sake of brevity The purpose is not repeated;
  • the heat sink substrate 2 has a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of mounting areas for placing the heating device 3 from bottom to top;
  • the thermal superconducting heat dissipation plates 1 are arranged on the second surface of the heat sink substrate 2 in parallel and spaced apart, and each of the thermal superconducting heat dissipation plates 1 extends in the longitudinal direction.
  • the three installation areas are distributed up and down along the longitudinal direction of the heat sink substrate 2 (that is, the side surface of the thermal superconducting heat sink 1).
  • more heat dissipation areas may be included, which is not strictly limited in this embodiment.
  • the second surface of the heat sink substrate 2 has a channel
  • one end of the thermal superconducting heat sink 1 has a bent portion 19, and the bent portion 19 is inserted into the channel (for details, please refer to Figure 7).
  • a plurality of slots are distributed in the channel at intervals, and the plurality of thermal superconducting heat sinks 1 are inserted into the slots in a one-to-one correspondence through the bent portion 19, and the heat sink substrate 2 corresponds to each slot.
  • the position of the first surface of the thermal superconducting heat sink 1 is the installation area where the heating device 3 is placed, so that the heat dissipated by the heating device 3 can be transferred to the thermal superconducting heat sink as quickly as possible in a short path.
  • each groove is perpendicular to the surface of the heat sink substrate 2.
  • each groove may also be inclined at a certain angle compared to the surface of the heat sink substrate 2.
  • the vertical is only used for The indication of the directional trend does not mean that it is at an angle of 90° with the horizontal plane in a strict sense, and is not limited to this embodiment.
  • a sintered core heat pipe (not shown) is embedded in the heat sink substrate 2.
  • the sintered core heat pipe is a sintered powder tube integrated with the tube wall formed by sintering a certain mesh of metal powder on the inner wall of a metal tube, and the metal powder sintered on the inside of the metal tube forms a wick capillary
  • the structure enables the sintered core heat pipe to have a higher capillary suction force, so that the heat conduction direction of the sintered core heat pipe is not affected by gravity, and the sintered wick capillary structure strengthens the evaporation heat absorption and condensation heat release, greatly
  • the thermal conductivity and transmission power of the heat pipe are improved, so that the sintered core heat pipe has a larger axial equivalent thermal conductivity (a few hundred to a thousand times that of copper).
  • the sintered core heat pipe is embedded in the heat sink substrate 2, so that the heat generated by the heating device 3 provided on the surface of the heat sink substrate 2 can quickly diffuse to other positions of the heat sink substrate 2, so that the heat dissipation
  • the heat distribution on the base plate 2 of the heat sink is relatively uniform, which can effectively improve the heat dissipation efficiency and heat dissipation capacity of the heat sink.
  • each of the thermal superconducting heat dissipation plates 1 is inserted into the groove vertically (may also have a certain inclination angle, not limited to this embodiment), and the thermal superconducting heat dissipation plates 1 can be mechanically pressed Any one or more of the process, the thermal conductive adhesive bonding process or the brazing process is fixedly connected to the radiator substrate 2 to maximize the bonding strength, reduce the bonding thermal resistance, and improve the heat dissipation capacity and efficiency of the radiator .
  • the heat generated during operation of the heat source (heating device 3) located on the surface of the heat sink substrate 2 is quickly transferred to the heat sink substrate 2 via the sintered core heat pipe, and the heat sink substrate 2 quickly conducts the heat to all the heat sinks.
  • the liquid heat transfer working medium 4 evaporates into steam after being heated, and the steam takes the heat along the thermal superconductor path to the entire thermal superconducting plate, and exchanges heat with the ambient air outside the thermal superconducting plate ( After releasing heat), it is condensed into a liquid heat transfer working medium 4 and flows back along the heat superconductor path to the heat superconductor path of the heat receiving side close to the heat source accessory to perform the next heat transfer cycle of evaporative heat absorption and condensation heat release.
  • the thermal superconducting heat sink of the present invention can be used for the heat dissipation of various high-power density electronic heating devices, can effectively improve the uniformity and efficiency of heat dissipation, and is especially suitable for high integration, high power, miniaturization, light weight, and high power.
  • the present invention also provides a 5G base station equipment, the 5G base station equipment includes a heating device, and the thermal superconducting heat sink according to any one of the fourth embodiment, and the heating device of the 5G base station device is arranged in the heat sink.
  • the mounting area of the device substrate For the introduction of the thermal superconducting heat sink, please refer to the fourth embodiment, which is not repeated for the sake of brevity.
  • the heating device includes, but is not limited to, a radio frequency generator, a power amplifier, a filter, a microprocessor, a memory, and a power manager.
  • the 5G base station equipment of the present invention can greatly improve its heat dissipation efficiency and heat dissipation uniformity without increasing the volume and weight of the equipment, which is beneficial to prolonging the service life of the equipment and improving the performance of the equipment.
  • the present invention provides a thermal superconducting heat sink, a heat sink, and 5G base station equipment.
  • the thermal superconducting heat dissipation plate is distributed with a main heat dissipation pipeline, a liquid down pipeline, a heat-receiving side communication pipeline, and a condensing-side communication pipeline;
  • the condensation side pipeline is located on the side opposite to the heat receiving side communication pipeline;
  • the heat dissipation main pipeline is connected between the heat receiving side communication pipeline and the condensation side communication pipeline ,
  • the liquid descending pipeline is located under the heat dissipation main pipeline one-to-one, and one end is connected with the corresponding heat dissipation main pipeline, and the other end is connected with the heat-receiving side communication pipeline;
  • the heat dissipation main pipeline Gradually incline upward in the direction away from the heat-receiving side connecting pipeline;
  • the improved thermal superconducting pipe path structure design of the present invention solves the problems of local drying and high temperature caused by the lack of liquid heat conduction medium in the upper heat source located in the thermal superconducting heat dissipation plate, and can reduce the total amount of heat transfer medium at the same time.
  • the 5G base station equipment based on the thermal superconducting radiator of the present invention can significantly improve the heat dissipation performance, which helps to extend the service life of the equipment and improve the performance of the equipment. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial value.

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Abstract

本发明提供一种热超导散热板、散热器及5G基站设备。热超导散热板内分布有散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路；受热侧连通管路位于热超导散热板上与发热器件相邻的一侧，冷凝侧管路位于与受热侧连通管路相对的一侧；散热主管路连接于受热侧连通管路和冷凝侧连通管路之间，液体下降管路一一对应位于散热主管路的下方，且一端与散热主管路相连接，另一端与受热侧连通管路相连接；散热主管路沿远离受热侧连通管路的方向逐渐向上倾斜；散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路相互连通且均为热超导散热管路，热超导散热管路内填充有传热工质，传热工质包括液体。本发明有助于提高散热效率和散热均匀性。

Description

热超导散热板、散热器及5G基站设备 技术领域
本发明涉及散热技术领域，特别是涉及一种热超导散热板、散热器及5G基站设备。
背景技术
随着5G通讯技术的快速发展，功率元器件的集成度越来越高，功率密度也越来越大，且设备越来越向小型化、轻量化、高热流密度和器件均温等方向发展，而现有的全铝片插齿散热器或压铸散热器体积大而笨重，同时还存在散热不均和散热效率不高等缺点，已经无法满足5G通讯基站设备的散热要求。
发明内容
鉴于以上所述现有技术的缺点，本发明的目的在于提供一种热超导散热板、散热器及5G基站设备，用于解决现有技术中的全铝片插齿散热器或压铸散热器体积大而笨重，同时还存在散热不均和散热效率不高等缺点，无法满足高集成度、高功率、小型化、轻量化、高热流密度的5G通讯基站设备的散热要求。
为实现上述目的及其他相关目的，本发明提供一种热超导散热板，所述热超导散热板内分布有散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路；所述受热侧连通管路位于所述热超导散热板上与器件相邻的一侧，所述冷凝侧管路位于与所述受热侧连通管路相对的一侧；所述散热主管路连接于所述受热侧连通管路和所述冷凝侧连通管路之间，所述液体下降管路一一对应位于所述散热主管路的下方，且一端与对应的所述散热主管路相连接，另一端与所述受热侧连通管路相连接；所述散热主管路沿远离所述受热侧连通管路的方向逐渐向上倾斜；所述散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路相互连通且均为热超导散热管路，所述热超导散热管路内填充有传热工质，所述传热工质包括液体。
可选地，所述多个散热主管路平行间隔设置，所述受热侧连通管路和所述冷凝侧连通管路平行间隔设置。
可选地，所述散热主管路为圆弧形管路，弧形凸起方向朝下。
可选地，所述热超导散热板还包括多个蒸汽上升管路，所述蒸汽上升管路一一对应位于所述散热主管路的上方，且两端与所述散热主管路相连接。
可选地，所述热超导散热板还包括多个蒸汽上升管路，所述蒸汽上升管路一一对应位于所述散热主管路的上方，且一端与所述散热主管路相连接，另一端与所述冷凝侧连通管路相 连接。
可选地，所述受热侧连通管路、散热主管路和液体下降管路构成矩形状无管路孤岛区；所述散热主管路、蒸汽上升管路及冷凝侧连通管路构成矩形状无管路孤岛区。
可选地，所述热超导散热板上还包括辅助支路，所述辅助支路位于底部的散热主管路的下部且两端与底部的散热主管路相连接。
本发明还提供一种热超导散热器，所述热超导散热器包括散热器基板及多个如上述任一方案中所述的热超导散热板；所述散热器基板具有第一表面及与第一表面相对的第二表面，所述第一表面自下而上设置有多个放置发热器件的安装区域；所述多个热超导散热板平行间隔设置于所述散热器基板的第二表面上，且各所述热超导散热板沿纵向延伸。
可选地，所述散热器基板的第二表面具有槽道，所述热超导散热板的一端具有弯折部，所述弯折部插设于所述槽道内。
本发明还提供一种5G基站设备，所述5G基站设备包括发热器件以及如前述任一方案所述的热超导散热器，所述5G基站设备的发热器件设置于所述散热器基板的安装区域。
如上所述，本发明的热超导散热板、散热器及5G基站设备，具有以下有益效果：
本发明热超导散热板经改善优化的散热管路结构设计，解决了位于热超导散热板中上部热源因液体导热工质的不足而导致的局部干涸和高温问题，同时可以在减少传热工质的总量，缩小热超导散热板的重量和体积的同时显著提高散热均匀性和散热效率，可以充分满足5G基站设备小型化、轻量化、高集成度和均温化等发展要求。基于本发明的热超导散热器的5G基站设备，散热性能可以显著改善，有助于延长设备使用寿命和提高设备性能。
附图说明
图1显示为实施例一中的热超导散热板的结构示意图。
图2显示为图1中的热超导散热板内的传热工质的流动原理图。
图3显示为实施例二中的热超导散热板的结构示意图。
图4显示为图3中的热超导散热板内的传热工质的流动原理图。
图5显示为实施例三中的热超导散热板的结构示意图。
图6显示为实施例四中的热超导散热器的结构示意图。
图7显示为图6中的热超导散热板与散热器基板连接的局部放大示意图。
元件标号说明
1                      热超导散热板
10                     无管路孤岛区
11                     散热主管路
12                     液体下降管路
13                     受热侧连通管路
14                     冷凝侧连通管路
15                     蒸汽上升管路
16                     辅助支路
17                     无管路受热区域
18                     无管路散热区域
19                     弯折部
2                      散热器基板
3                      发热器件
4                      传热工质
具体实施方式
以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本发明的精神下进行各种修饰或改变。
请参阅图1～图7。需要说明的是，本实施例中所提供的图示仅以示意方式说明本发明的基本构想，图中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
实施例一
如图1至图2所示，本发明提供一种热超导散热板1，所述热超导散热板1内分布有散热主管路11、液体下降管路12、受热侧连通管路13和冷凝侧连通管路14；所述受热侧连通管路13位于所述热超导散热板1上与发热器件3相邻的一侧，所述冷凝侧管路位于与所述受热侧连通管路13相对的一侧；所述散热主管路11连接于所述受热侧连通管路13和所述冷凝侧连通管路14之间，所述液体下降管路12一一对应位于所述散热主管路11的下方，且一端 与对应的所述散热主管路11相连接，另一端与所述受热侧连通管路13相连接；所述散热主管路11沿远离所述受热侧连通管路13的方向逐渐向上倾斜；所述散热主管路11、液体下降管路12、受热侧连通管路13和冷凝侧连通管路14相互连通且均为热超导散热管路，所述热超导散热管路内填充有传热工质4，所述传热工质4包括液体。本发明热超导散热板经改善优化的热超导管路结构，解决了位于热超导散热板中上部热源因液体传热工质4的不足而导致的局部干涸和高温问题，同时可以在减少传热工质4的总量，缩小热超导散热板1的重量和体积的同时显著提高散热均匀性和散热效率，可以充分满足5G基站设备小型化、轻量化、高集成度和均温化等发展要求。
作为示例，所述热超导散热板1与发热器件3相邻的一侧，即与所述受热侧连通管路13相连接的地方具有沿纵向方向延伸的一个无管路受热区域17(即该区域无任何管路)，该区域是因为需在热超导散热板1上预留出与散热器基板2相连接的空间而形成，避免在将热超导散热板1和散热器基板2相连接(比如通过胶接、焊接、胀接、嵌接等方式连接)的过程中对管路造成损伤。相应地，在所述热超导散热板1远离所述发热器件3的一端，即在所述冷凝侧连通管路14的外侧具有无管路散热区18，该区域未形成有管路，避免所述热超导散热板1与外界发生碰撞时对管路造成损伤。因为所述散热主管路11、液体下降管路12、受热侧连通管路13和冷凝侧连通管路14相互连通构成了封闭管路(热超导散热板1上设置有传热工质4的填充口，未标示)，其内部的传热工质4是在所述热超导散热板1的制作过程中进行填充的。一旦这其中任何一段管路出现承压强度和气密性问题而导致变形和漏液，那将破坏热传导板的性能，因而两侧设置无管路区域可以起到较好的保护作用。
需要说明的是，发热器件为可以实现预设功能的电子部件，包括但不限于射频发生器、功率放大器、滤波器、微处理器、存储器、电源管理器等，其在工作过程会产生热量而造成温度升高，过高的温度会降低器件的性能、运行速度甚至损坏，因此这些发热器件需要及时散热。
具体地，所述热超导散热板1基于热超导传热技术实现传热；热超导技术为在密封的相互连通的微槽道内充装所述传热工质4，通过所述传热工质4的蒸发或冷凝相变实现热超导传热的相变传热技术。具体地，所述热超导散热板1为复合板式结构，包括第一板材及第二板材，所述热超导管路通过轧制吹胀工艺或模具成型钎焊工艺形成，所述第一板材和所述第二板材的材质均为导热性良好的金属材料，比如可以包括但不仅限为铜、铜合金、铝、铝合金、钛、钛合金或任一种以上的任意组合，即所述第一板材和所述第二板材可以是单层材料层或多层材料层，但内层优选为铝材料层。比如在一示例中，所述第一板材及所述第二板材 可以为包括铜材料层与铝材料层的铜铝复合板材、也可以为包括不锈钢材料层与铝材料层的不锈钢铝复合板材、也可以为包括铁材料层与铝材料层的铁铝复合板材，还可以为包括铝合金材料层与铝材料层的铝合金铝复合板材；所述第一板材及所述第二板材中的所述铝材料层相接触，即所述第一板材中的所述第二材料层为铝材料层，所述第二板材中的所述第二材料层为铝材料层。将所述第一板材及所述第二板材的内层设定为铝材料层，当所述第一板材及所述第二板材为铝铜复合板材时，可以确保所述铜材料层位于外侧，即所述热超导散热板1的外表面为铜层，可以直接进行钎焊或锡焊，便于操作，质量稳定，可以解决热超导散热板1与散热器基板2之间的焊接问题。所述热超导散热板1可以为单面胀形式，即所述热超导散热管路(包括散热主管路11、液体下降管路12、受热侧连通管路13和冷凝侧连通管路14，这些管路可在同一工艺中同步形成)仅凸出于所述热超导散热板1的一个表面上，也可以为双面胀形式，即所述热超导散热管路同时凸出于所述热超导散热板1的两个表面上。本实施例中优选单面胀形式，且当多个所述热超导散热板1用于同一热超导散热器中时，所述多个热超导散热板1的凸起优选呈对称向外分布(以所述热超导散热器的中线为准，两边的热超导散热板1表面的热超导散热管路均向远离中线的方向凸起)，以确保所述热超导散热器在具有良好的散热性能的同时结构更加均衡稳定。作为示例，所述热超导散热板1的表面可以做阳极氧化处理，以在所述热超导散热板1的表面形成氧化膜(未示出)，由此可以提高所述热超导散热板1的耐腐蚀性能，又可以提高所述热超导散热板1的辐射率，增强其与周围空气的热交换。
作为示例，所述多个散热主管路11平行间隔设置，所述受热侧连通管路13和所述冷凝侧连通管路14平行间隔设置。
作为示例，所述散热主管路11为圆弧形管路，弧形凸起方向朝下。所述液体下降管路12包括第一支路和第二支路，第一支路近似垂直，其一端与对应的所述散热主管路11相连接，另一端与第二支路相连接，所述第二支路的另一端与所述受热侧连通管路13相连接(需要说明的是，本实施例中当描述管路之间是相互连接时，那管路之间也是相互连通的，对此不再单独说明)，所述第二支路为近水平管路或者倾斜度(即与水平面的夹角)小于所述散热主管路11的倾斜度。所述散热主管路11、液体下降管路12和受热侧连通管路13围成多个类似矩形状的无管路孤岛区10。
作为示例，所述热超导散热板1上还包括辅助支路16，所述辅助支路16位于底部的散热主管路11的下部且两端与底部的散热主管路11相连接。
下面结合图1和图2对本发明的热超导散热板1的工作原理做说明。所述热超导散热板 1的一端靠近热源(发热器件3)的受热侧，液体下降管路12作为冷凝液相下降的管路同时与散热主管路11和受热侧连通管路13相连，且液体下降管路12位于散热主管路11的下方，因而完成热交换冷凝后的液体在到达散热主管路11和液体下降管路12的交叉口后将主要进入液体下降管路12，再进入受热侧连通管路13，而在受热侧连通管路13中的液体工质受热蒸发产生的汽泡向上流动，并进入向上倾斜的散热主管路11内，由于散热主管路11内液体少，阻力小(所述散热主管路11为圆弧状时阻力更小，更有利于蒸汽的上升)，蒸汽比重小有向上流动趋势，液体比重大，受重力影响有向下流动趋势，提高了气液相的流动和蒸发冷凝换热效率。图2示例了热超导散热器内局部的蒸发气相与冷凝液相的流动机理。对整个热超导散热板1而言，靠近发热器件3的受热侧连通管路13中没有蒸发的液体向下流动参与下部热源的蒸发冷凝换热，未进入散热主管路11的一部分气液混合物向上流动以参与上部热源的蒸发冷凝换热。在远离发热器件3的冷凝侧连通管路14中，来自散热主管路11中的没有冷凝的多余气体向上流通进入上部的散热主管路11中冷凝，多余的冷凝液体向下流动，进入下部的散热主管路11中参与蒸发，使整个热超导散热板1内部管路内各部分相互连通，达到压力的平衡和温度均匀，通过少量的传热工质4的即可达到较好的散热效果，有利于散热器的小型化和轻量化。
实施例二
如图3和图4所示，本实施例提供另一种结构的热超导散热板1。本实施例的热超导散热板1与实施例一的区别在于，本实施例的热超导散热板1还包括多个蒸汽上升管路15，所述蒸汽上升管路15一一对应位于所述散热主管路11的上方，且两端与所述散热主管路11相连接，且所述蒸汽上升管路15与所述液体下降管路12通常具有间距，两者在纵向上的投影没有重叠。所述蒸汽上升管路15可以为包括直线段和位于直线段两端的弯折段，因而所述蒸汽上升管路15和所述散热主管路11围成了多个类似矩形状的无管路孤岛区10，具体可以参考图3。本实施例的热超导散热板1不具有实施例一中的辅助支路16而在所述热超导散热板1的右下侧形成一个沿远离所述受热侧连通管路13方向逐步增加的无管路散热区域。除上述区别外，本实施例的热超导散热板1的其他结构均与实施例一相同，具体请参考实施例一，出于简洁的目的不赘述。通过设置所述蒸汽上升管路15，蒸汽在所述蒸汽上升管路15中的冷凝液体全部流回到与之相连接的散热主管路11中(该过程可以参考图4)，使得散热主管路11的阻力更小，冷凝散热热阻更小，有助于进一步提高散热效率和散热均匀性。
实施例三
如图5所示，本实施例提供另一种结构的热超导散热板1。本实施例的热超导散热板1 与实施例二的区别在于，实施例二的热超导散热板1的蒸汽上升管路15两端都与所述散热主管路11相连接，而本实施例中，虽然同样具有多个蒸汽上升管路15，所述蒸汽上升管路15同样一一对应位于所述散热主管路11的上方，但是本实施例的蒸汽上升管路15一端与所述散热主管路11相连接，另一端与所述冷凝侧连通管路14相连接，且所述蒸汽上升管路15与所述液体下降管路12通常具有间距，两者在纵向上的投影没有重叠。所述蒸汽上升管路15可以包括直线段和位于直线段一端的弯折段，所述蒸汽上升管路15、所述散热主管路11和冷凝侧连通管路14围成了多个类似矩形状的无管路孤岛区10。通过将蒸汽上升管路15在远离热源侧直接与冷凝侧连通管路14连通，更便于调节上下部的多个散热主管路11中气相和液相的流量和压力，可以进一步改善热超导散热板1的温度均匀性和提高散热效率。除该区别外，本实施例的热超导散热板1的其他结构均与实施例二相同，具体请参考实施例二，出于简洁的目的不赘述。
本发明的热超导散热板1可以直接和发热器件3相连接以实现散热，比如多个发热器件3可以直接贴放于所述热超导散热板1的侧壁并沿纵向上下分布，这种通过单一热超导散热板1的散热方式尤其适用于小功率发热器件的散热。
实施例四
如图6及7所示，本发明还提供一种热超导散热器，所述热超导散热器包括散热器基板2及多个如实施例一至三中任一项所述的热超导散热板1(图6中的热超导散热器以实施例一热超导散热板1结构为例)，故对所述热超导散热板1的说明还请参考前述内容，出于简洁的目的不赘述；所述散热器基板2具有第一表面及与第一表面相对的第二表面，所述第一表面自下而上设置有多个放置发热器件3的安装区域；所述多个热超导散热板1平行间隔设置于所述散热器基板2的第二表面上，且各所述热超导散热板1沿纵向延伸。
作为示例，所述安装区域为三个，三个所述安装区域沿所述散热器基板2的纵向上下分布(也即所述热超导散热板1的侧面)。单个所述安装区域可以安装的发热器件3可以为一个或多个，不同的安装区域安装的发热器件3的类型可以相同或不同，本实施例中对此并不限制。当然，在其他示例中，根据所述发热器件3的数量不同，还可以包括更多个散热区域，本实施例中并不严格限制。
作为示例，所述散热器基板2的第二表面具有槽道，所述热超导散热板1的一端具有弯折部19，所述弯折部19插设于所述槽道内(具体可参考图7)。具体地，所述槽道内间隔分布有多个插槽，而所述多个热超导散热板1经弯折部19一一对应插设于各插槽内，所述散热器基板2对应各所述热超导散热板1的所在的第一表面的位置即为放置发热器件3的安装区域， 使得发热器件3散热的热量能够以较短的路径尽快传导至所述热超导散热器。本实施例中，各沟槽与所述散热器基板2的表面相垂直，在实际使用中，各沟槽也可相较于所述散热器基板2的表面倾斜一定的角度，垂直仅用于表示方向趋势，并不意味着严格意义上的与水平面呈90°夹角，不以本实施例为限。
作为示例，所述散热器基板2内埋设有烧结芯热管(未示出)。所述烧结芯热管为由一定目数的金属粉末烧结在一金属管的内壁上而形成的与管壁一体的烧结粉末管芯，烧结于所述金属管内部上的金属粉末形成吸液芯毛细结构，使得所述烧结芯热管具有较高的毛细抽吸力，使所述烧结芯热管的导热方向不受重力的影响，且烧结吸液芯毛细结构强化了蒸发吸热和冷凝放热，大大提高了热管的导热能力和传输功率，使得所述烧结芯热管具有较大的轴向当量导热系数(是铜的几百倍到上千倍)。在所述散热器基板2内埋设所述烧结芯热管，可以使得设置于所述散热器基板2表面的发热器件3产生的热量快速扩散至所述散热器基板2的其他位置，使得所述散热器基板2上的热分布比较均匀，可以有效地提高散热器的散热效率和散热能力。
作为示例，各所述热超导散热板1垂直(也可具有一定倾角，不以本实施例为限)***至所述沟槽内，且所述热超导散热板1可以通过机械挤压工艺、导热胶粘结工艺或钎焊焊接工艺中的任意一种或多种与所述散热器基板2固定连接，以尽量增加结合强度，减小结合热阻，提高散热器的散热能力和效率。
位于所述散热器基板2表面的热源(发热器件3)工作时产生的热量经由所述烧结芯热管迅速传到至所述散热器基板2，所述散热器基板2将热量快速传导至各所述热超导散热板1，液体传热工质4受热后蒸发变成蒸汽，蒸汽将热量沿热超导管路带至整个热超导板，与热超导板外部的环境空气进行热交换(放出热量)后冷凝成液体传热工质4并沿热超导管路回流至靠近热源附件的受热侧热超导管路，进行下一次的蒸发吸热与冷凝放热的导热循环。
本发明的热超导散热器可以用于各类高功率密度的电子发热器件的散热，可以有效提高散热均匀性和散热效率，尤其适用于高集成度、高功率、小型化、轻量化、高热流密度的5G通讯基站设备的散热。
实施例五
本发明还提供一种5G基站设备，所述5G基站设备包括发热器件，以及如实施例四中任一项所述的热超导散热器，所述5G基站设备的发热器件设置于所述散热器基板的安装区域。对所述热超导散热器的介绍还请参考实施例四，出于简洁的目的不赘述。所述发热器件包括但不限于射频发生器、功率放大器、滤波器、微处理器、存储器及电源管理器等。本发 明的5G基站设备，在不增加设备体积和重量的情况下，其散热效率和散热均匀性可以得到极大改善，有利于延长设备使用寿命和提高设备性能。
综上所述，本发明提供一种热超导散热板、散热器及5G基站设备。所述热超导散热板内分布有散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路；所述受热侧连通管路位于所述热超导散热板上与发热器件相邻的一侧，所述冷凝侧管路位于与所述受热侧连通管路相对的一侧；所述散热主管路连接于所述受热侧连通管路和所述冷凝侧连通管路之间，所述液体下降管路一一对应位于所述散热主管路的下方，且一端与对应的所述散热主管路相连接，另一端与所述受热侧连通管路相连接；所述散热主管路沿远离所述受热侧连通管路的方向逐渐向上倾斜；所述散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路相互连通且均为热超导散热管路，所述热超导散热管路内填充有传热工质，所述传热工质包括液体。本发明经改善的热超导管路结构设计，解决了位于热超导散热板中上部热源因液体导热工质的不足而导致的局部干涸和高温问题，同时可以在减少传热工质的总量，缩小热超导散热器的重量和体积的同时显著提高散热均匀性和散热效率，可以充分满足5G基站设备小型化、轻量化、高集成度和均温化等发展要求。基于本发明的热超导散热器的5G基站设备，散热性能可以显著改善，有助于延长设备使用寿命和提高设备性能。所以，本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (10)

  1. 一种热超导散热板，其特征在于，所述热超导散热板内分布有散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路；所述受热侧连通管路位于所述热超导散热板上与发热器件相邻的一侧，所述冷凝侧管路位于与所述受热侧连通管路相对的一侧；所述散热主管路连接于所述受热侧连通管路和所述冷凝侧连通管路之间，所述液体下降管路一一对应位于散热主管路的下方，且一端与对应的所述散热主管路相连接，另一端与所述受热侧连通管路相连接；所述散热主管路沿远离所述受热侧连通管路的方向逐渐向上倾斜；所述散热主管路、液体下降管路、受热侧连通管路和冷凝侧连通管路相互连通且均为热超导散热管路，所述热超导散热管路内填充有传热工质，所述传热工质包括液体。
  2. 根据权利要求1所述的热超导散热板，其特征在于：所述多个散热主管路平行间隔设置，所述受热侧连通管路和所述冷凝侧连通管路平行间隔设置。
  3. 根据权利要求2所述的热超导散热板，其特征在于：所述散热主管路为圆弧形管路，弧形凸起方向朝下。
  4. 根据权利要求2所述的热超导散热板，其特征在于：所述热超导散热板还包括多个蒸汽上升管路，所述蒸汽上升管路一一对应位于所述散热主管路的上方，且两端与所述散热主管路相连接。
  5. 根据权利要求2所述的热超导散热板，其特征在于：所述热超导散热板还包括多个蒸汽上升管路，所述蒸汽上升管路一一对应位于所述散热主管路的上方，且一端与所述散热主管路相连接，另一端与所述冷凝侧连通管路相连接。
  6. 根据权利要求5所述的热超导散热板，其特征在于：所述受热侧连通管路、散热主管路和散热支路构成矩形状无管路孤岛区；所述散热主管路、蒸汽上升管路及冷凝侧连通管路构成矩形状无管路孤岛区。
  7. 根据权利要求1所述的热超导散热板，其特征在于：所述热超导散热板上还包括辅助支路，所述辅助支路位于底部的散热主管路的下部且两端与底部的散热主管路相连接。
  8. 一种热超导散热器，其特征在于，所述热超导散热器包括散热器基板及多个如权利要求1-7任一项所述的热超导散热板；所述散热器基板具有第一表面及与第一表面相对的第二表面，所述第一表面自下而上设置有多个放置发热器件的安装区域；所述多个热超导散热板平行间隔设置于所述散热器基板的第二表面上，且各所述热超导散热板沿纵向延伸。
  9. 根据权利要求8所述的热超导散热器，其特征在于：所述散热器基板的第二表面具有槽道，所述热超导散热板的一端具有弯折部，所述弯折部插设于所述槽道内。
  10. 一种5G基站设备，所述5G基站设备包括发热器件，其特征在于：所述5G基站设备还 包括如权利要求8或9所述的热超导散热器，所述5G基站设备的发热器件设置于所述散热器基板的安装区域。
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