WO2021212909A1 - Relative dielectric constant test system, method, and apparatus, and storage medium - Google Patents

Relative dielectric constant test system, method, and apparatus, and storage medium Download PDF

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Publication number
WO2021212909A1
WO2021212909A1 PCT/CN2020/140994 CN2020140994W WO2021212909A1 WO 2021212909 A1 WO2021212909 A1 WO 2021212909A1 CN 2020140994 W CN2020140994 W CN 2020140994W WO 2021212909 A1 WO2021212909 A1 WO 2021212909A1
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WIPO (PCT)
Prior art keywords
measured
medium
relative permittivity
resonant
conduction band
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PCT/CN2020/140994
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French (fr)
Chinese (zh)
Inventor
赖展军
李津辉
李红军
肖飞
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京信通信技术(广州)有限公司
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Publication of WO2021212909A1 publication Critical patent/WO2021212909A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2617Measuring dielectric properties, e.g. constants
    • G01R27/2623Measuring-systems or electronic circuits

Definitions

  • This application relates to the field of communication technology, and in particular to a relative permittivity test system, method, device and storage medium.
  • beautification covers for example, beautification antenna covers
  • the beautification covers can be designed with different dielectric materials; while the beautification covers meet the mechanical performance and appearance, they also have better electrical performance. High requirements.
  • the transmission rate and dielectric performance are important indicators for evaluating the beautification cover for antennas and main equipment.
  • energy will be lost.
  • Relative dielectric constant and loss tangent are required. The smaller the better, in order to achieve the purpose of minimum reflection and maximum transmission.
  • the conventional antenna cover and the dielectric material components used inside the antenna (such as the phase shifter dielectric sheet, PCB board, etc.) also need to measure the relative permittivity under non-destructive conditions.
  • the traditional technology has at least the following problems: for different dielectric materials, the traditional technology directly measures the relative permittivity value through the test instrument. At present, the antenna cover is complicated and changeable due to the complex application environment. In order to ensure the structure and Electrical characteristics, usually the design thickness is greater than or equal to 5mm, and the test process does not allow cutting damage. Therefore, the traditional method for samples of dielectric materials requires cutting and sampling of the test piece, and the maximum thickness that can be tested does not meet the actual requirements.
  • an embodiment of the present invention provides a relative permittivity test system, which includes a microstrip ground layer bonded to the lower surface of the substrate of the medium to be tested, and is arranged on the substrate of the medium to be tested Resonant conduction band of the surface;
  • Test equipment measures the measured resonant frequency of the resonant conduction band
  • the processor connected to the test equipment; the processor obtains the measured resonant frequency and the measured substrate thickness of the measured medium, and uses the preset correspondence relationship to process the measured resonant frequency and measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium ;
  • the preset correspondence is used to characterize the relationship between the relative permittivity of the medium to be measured on the resonance frequency and the thickness of the substrate.
  • the measured resonant frequency of the medium to be tested and the measured substrate thickness is obtained by measuring the resonant conduction band of the test equipment; among them, the resonant conduction band is set on the upper surface of the substrate of the medium to be tested, and the microstrip ground layer is bonded to the substrate to be tested.
  • the preset correspondence relationship is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to the resonance frequency and the thickness of the substrate alternative relation.
  • a relative permittivity test device including:
  • the data acquisition module is used to acquire the measured resonant frequency of the medium to be measured and the measured substrate thickness; the measured resonant frequency is obtained by measuring the resonant conduction band measured by the test equipment; among them, the resonant conduction band is set on the upper surface of the substrate of the medium to be measured, and the microstrip The ground layer is adhered to the lower surface of the substrate of the medium to be tested;
  • the data processing module is used to process the measured resonant frequency and the measured substrate thickness by using the preset correspondence relationship to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to resonance The relationship between frequency and substrate thickness.
  • This application adopts the resonance method to bond the ground plane of the microstrip line (ie the microstrip grounding layer) on the lower surface of the substrate of the medium to be measured, set a resonance conduction band on the upper surface of the substrate, and use the measuring device to connect the probe to the probe.
  • the needle is close to the resonant conduction band on the upper surface of the dielectric substrate, and the resonant frequency of the transmission line is measured. Based on the preset relative permittivity of the medium to be measured, the relationship between the resonant frequency and the thickness of the substrate is obtained.
  • a microstrip grounding layer and a resonant conduction band are separately provided on the medium to be tested, and the microstrip grounding layer is connected to the medium to be tested by bonding, so that the medium to be tested can be protected without damaging the medium.
  • the resonance method is used to test the relative permittivity of the medium to be tested.
  • the bonding method can ensure a good fit and avoid the influence of air gaps.
  • the test results are accurate, the method is simple, and the test cost can be reduced; the resonance conduction band can be printed Manufactured on the PCB sheet to make it reusable to further reduce costs.
  • the invention is particularly suitable for measuring the relative dielectric constant of the antenna cover, and has obvious engineering practicability.
  • FIG. 1 is a schematic diagram of the structure of a medium to be tested in a relative permittivity test system in an embodiment
  • FIG. 2 is a schematic diagram of the structure of a relative permittivity test system in an embodiment
  • FIG. 3 is a schematic diagram of a specific structure of a relative permittivity test system in an embodiment
  • Figure 4a is a schematic diagram of transmission coefficients between probes in an embodiment
  • Figure 4b is a schematic diagram of the resonance frequency of the medium to be measured in an embodiment
  • FIG. 5 is a schematic diagram of the structure of the medium to be tested in the relative permittivity test system in another embodiment
  • Fig. 6 is a schematic structural diagram of a relative permittivity test system in another embodiment
  • FIG. 7 is a schematic diagram of a specific structure of a relative permittivity test system in another embodiment
  • FIG. 8 is a schematic flowchart of a method for measuring relative permittivity in an embodiment
  • Fig. 9 is a structural block diagram of a relative permittivity test device in an embodiment.
  • the keysight E4991B material analyzer is used with the 16453A permittivity measurement fixture to measure the relative permittivity of the dielectric material, it is required to cut the test piece. It is a 30 ⁇ 30 mm square piece, and the thickness of the testable medium sample is less than 3 mm.
  • the thickness of the traditional test is limited to less than 5mm, and the relative permittivity value of the corresponding medium cannot be directly tested if the thickness exceeds 5mm; the beautification cover needs to meet the high reliability in the harsh environment due to the changing requirements of the site environment, and it is usually designed
  • the thickness needs to be ⁇ 5mm, which makes it impossible for manufacturers and operators to evaluate the relative permittivity of dielectric materials over 5mm.
  • non-destructive test methods they cannot satisfy the detection of the characteristics of the base station antenna cover.
  • This application provides a resonant circuit test method, which can directly measure the relative permittivity values of various thicknesses.
  • this application can be used to measure the relative permittivity of materials within a thickness of 40mm (such as plastics, foamed materials, etc.); in a specific example, this application is suitable for the measurement of the relative permittivity of antenna enclosures; this application It is simple and does not need to destroy the tested material, can reduce the test cost, and has significant engineering practicability.
  • the relative permittivity test system provided in this application can be applied to the relative permittivity measurement of antenna enclosures (for example, beautification enclosures).
  • the antenna cover can be a dielectric material (such as plastic, foamed material, etc.) with a substrate thickness of less than 40 mm, that is, the medium to be tested.
  • a relative permittivity test system is provided.
  • the relative permittivity test system of the present application may include bonding under the substrate of the test medium 10 The microstrip grounding layer 120 on the surface, and the resonant conduction band 110 provided on the upper surface of the substrate of the medium to be tested; wherein, the resonant conduction band 110 may be a strip-shaped conduction band.
  • the application of the system to the medium to be tested shown in FIG. 1 is taken as an example for description.
  • the relative permittivity test system of the present application also includes:
  • test equipment 20 measures the measured resonant frequency of the resonant conduction band 110;
  • the processor 30 connected to the test device 20; the processor 30 obtains the measured resonant frequency and the measured substrate thickness of the measured medium 10, and uses a preset correspondence relationship to process the measured resonant frequency and measured substrate thickness to obtain the relative medium of the measured medium
  • the measured value of the electrical constant; the preset corresponding relationship is used to characterize the relationship between the relative permittivity of the measured medium and the resonant frequency and the thickness of the substrate.
  • a microstrip grounding layer 120 is pasted on one side of the medium 10 to be tested, and a resonant conduction band 110 is provided on the other side of the medium to be tested 10 opposite to the microstrip grounding layer 120;
  • This application proposes to set the microstrip grounding layer by bonding, that is, the microstrip grounding layer is connected to the medium to be tested by bonding, and the resonance method can be used to realize the relative measurement of the medium to be tested without damaging the medium to be tested.
  • Dielectric constant test among them, the way of bonding can ensure a good fit, not only can avoid the influence of air gaps, and further improve the accuracy of the test results, but also has better engineering practicability.
  • a section of a microstrip transmission line with open ends has the characteristics of a resonant circuit; both ends of the microstrip transmission line can be connected to a coaxial connector or probe, and connected to a test equipment used to measure the resonance frequency via a microwave cable 20. Collect the measured transmission coefficient of the test equipment 20 to obtain the resonant frequency value, thereby measuring the resonant frequency of the resonant conduction band (that is, the measured resonant frequency); where the microwave cable may be a radio frequency microwave test cable, for example, a radio frequency microwave coaxial test Cable (RF Microwave Coax Test cable).
  • the testing equipment 20 uses a probe to approach the resonant conduction band 110 on the upper surface of the substrate of the medium 10 to be tested to measure the resonant frequency of the transmission line (that is, the measured resonant frequency).
  • the testing device 20 may be a vector network analyzer.
  • the vector network analyzer is connected to the coaxial connector or probe, and the resonant conduction band is approached through the coaxial connector or probe to measure the measured resonant frequency of the resonant conduction band.
  • the length of the resonant conduction band 110 may be ⁇ g ; where ⁇ g is the wavelength on the microstrip line of the working frequency band; and the working frequency band is the frequency band used in the test.
  • the length of the resonant conduction band 110 may be ⁇ g /2, and the width of the resonant conduction band 110 may be 1 to 5 mm.
  • ⁇ g is the wavelength on the microstrip line of the working frequency band; the working frequency band is the frequency band used during the test.
  • the length of the resonant conduction band 110 and the width of the resonant conduction band 110 in this application are selected based on the resonant peak that can be clearly measured; wherein, ⁇ g is obtained based on the following formula:
  • ⁇ re is the equivalent permittivity of the dielectric substrate to be tested
  • f is the frequency
  • c is the speed of light.
  • the length of the resonant conduction band 110 and the width of the resonant conduction band 110 in this application can be selected according to actual needs.
  • the resonant conduction band 110 may be a metal foil.
  • the metal foil and the test medium 10 are connected by bonding, for example, the metal foil is bonded to the upper surface of the substrate; further, the metal foil may be a metal foil with adhesive, for example, copper foil, aluminum foil; In the example, the metal foil is copper foil.
  • the resonant conduction strip 110 may be a metal conduction strip printed on the PCB sheet; the metal conduction strip is attached to the upper surface of the substrate.
  • the resonant conduction band 110 is often small in size, and it is difficult to be neatly attached to the medium to be measured, and the bonded resonant conduction band 110 is not easy to reuse; therefore, the present application proposes the resonant conduction band 110 It can be a metal conduction tape printed on a PCB (Printed Circuit Board) sheet. The metal conduction tape on the PCB sheet is pressed against the test medium 10 to make it reusable and further reduce cost.
  • PCB Print Circuit Board
  • the microstrip ground layer 120 may be a metal foil.
  • the metal foil may be a metal foil with adhesion, such as copper foil and aluminum foil.
  • the metal foil may be copper foil.
  • the present application can use a corresponding thickness measuring device to measure the thickness of the substrate (that is, the measured substrate thickness) of the medium 10 to be measured; the processor is acquiring the measured resonance frequency and the measured medium
  • the preset correspondence can be used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured; among them, the preset correspondence is used to characterize the relative permittivity of the measured medium The relationship between the resonance frequency and the thickness of the substrate.
  • the processor can use a three-dimensional electromagnetic simulation model or theoretical formula to obtain a data table that characterizes the relationship between the relative permittivity, resonance frequency, and the thickness of the medium to be measured (ie, the thickness of the substrate), and then based on the measured resonance frequency and the measured substrate thickness , Obtain the measured value of the relative permittivity of the medium to be measured by looking up the table.
  • the processor can use data fitting to form a fitting formula with a clear expression, and then substitute the actually measured resonance frequency and substrate thickness of the medium to be measured into the fitting formula to obtain the value of the medium to be measured.
  • Relative permittivity ie, the measured value of the relative permittivity
  • the relative permittivity test system of this application can be applied to the GB/T 12636-90 microwave dielectric substrate complex relative permittivity stripline test method.
  • the required tools can include: 1 set of 0.1 ⁇ 4GHz two-port vector network analyzer, near-field probe, resonant conduction band (ring), test tooling, etc.;
  • 100 MHz to 2 GHz can be used.
  • the thickness of the test substrate is at least 40 mm; in another example, the thickness of the test substrate may be 30 mm.
  • the specific test steps can include:
  • a section of microstrip transmission line with open ends has the characteristics of a resonant circuit.
  • copper foil is attached to the A side of the dielectric substrate to be tested to form the ground plane of the microstrip line (ie the microstrip grounding layer).
  • the resonant conduction band (copper foil can be used) is attached to the B surface of the measuring dielectric substrate.
  • the length of the resonant conduction band is ⁇ g /2, and the width of the resonant conduction band w is selected from 1 to 5 mm (based on the obvious test of the resonance peak).
  • the resonant conduction band may also be an annular conduction band, and the length may be ⁇ g .
  • ⁇ g is the wavelength on the microstrip line of the working frequency band; the working frequency band is the frequency band used during the test.
  • the relative permittivity can be obtained by looking up the table or by the fitting formula.
  • This application adopts the resonance method to bond the ground plane of the microstrip line (ie, the microstrip grounding layer) on the lower surface of the substrate of the medium to be measured, set a resonant conduction band on the upper surface of the substrate, and use the measuring device to approach the resonance of the upper surface of the dielectric substrate Conduction band, the resonant frequency of the transmission line is measured, and then based on the preset correspondence and the thickness of the resonant conduction band length, the relative permittivity of the medium to be tested is obtained; this application provides a microstrip grounding layer on the medium to be tested. And the resonant conduction band, and the microstrip grounding layer is connected to the medium to be tested by bonding.
  • the ground plane of the microstrip line ie, the microstrip grounding layer
  • the resonance method can be used to test the relative permittivity of the medium to be tested without damaging the medium to be tested.
  • the method can ensure a good fit and avoid the influence of air gaps, the test results are accurate, the method is simple, and the test cost can be reduced; at the same time, this application proposes to print the resonant conduction band on the PCB sheet to make it reusable, and then Further reduce costs.
  • this application can be used to measure the relative permittivity of an antenna cover (within a thickness of 40mm), which has significant engineering practicability.
  • a relative permittivity test system is provided.
  • the relative permittivity test system of the present application may include a system bonded to the lower surface of the substrate of the test medium.
  • the microstrip grounding layer and the resonant conduction band provided on the upper surface of the substrate of the medium to be tested; wherein, the resonant conduction band can be a ring-shaped conduction band.
  • FIG. 6 the application of the system to the medium to be tested shown in FIG. 5 is taken as an example for description.
  • the relative permittivity test system of the present application also includes:
  • Test equipment and the probe or coaxial connector connected to the test equipment approaches the resonant conduction band through the probe or coaxial connector, and measures the measured resonant frequency of the resonant conduction band;
  • the processor connected to the test equipment; the processor obtains the measured resonant frequency and the measured substrate thickness of the measured medium, and uses the preset correspondence relationship to process the measured resonant frequency and measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium ;
  • the preset correspondence is used to characterize the relationship between the relative permittivity of the medium to be measured on the resonance frequency and the thickness of the substrate.
  • a microstrip grounding layer is pasted on one side of the medium to be tested, and a resonant conduction band is provided on the opposite side of the medium to be tested and the microstrip grounding layer; this application proposes to adopt the adhesive
  • the microstrip grounding layer is set in the connection mode, that is, the microstrip grounding layer is connected to the medium to be tested by bonding.
  • the resonance method can be used to test the relative permittivity of the medium to be tested without damaging the medium to be tested. ;
  • the bonding method can ensure a good fit, not only can avoid the influence of air gaps, and further improve the accuracy of the test results, but also has better engineering practicability.
  • the test equipment uses a probe to approach the resonant conduction band on the upper surface of the substrate of the medium to be tested, and measures the resonant frequency of the transmission line (that is, the measured resonant frequency).
  • test equipment may be a vector network analyzer.
  • the length of the resonant conduction band may be ⁇ g ; where ⁇ g is the wavelength on the microstrip line of the working frequency band; and the working frequency band is the frequency band used in the test.
  • the length of the resonant conduction band may be ⁇ g /2, and the width of the resonant conduction band is 1 to 5 mm.
  • ⁇ g is the wavelength on the microstrip line of the working frequency band; the working frequency band is the frequency band used during the test.
  • the length of the resonant conduction band and the width of the resonant conduction band in this application are selected on the basis of the resonant peak that can be clearly tested, and can also be selected according to actual needs.
  • the resonant conduction band may be a metal foil.
  • the metal foil and the test medium are connected by bonding, for example, the metal foil is bonded to the upper surface of the substrate; in one example, the metal foil is copper foil.
  • the resonant conduction strip may be a metal conduction strip printed on the PCB sheet; the metal conduction strip is attached to the upper surface of the substrate.
  • the metal conduction band in this application can be a metal layer made by PCB technology; the resonance conduction band is often small in size, and it is difficult to be neatly attached to the medium to be measured, and the resonant conduction band is bonded It is not easy to reuse; therefore, the present application proposes that the resonant conduction band can be a metal conduction tape printed on a sheet, and the metal conduction tape on the PCB sheet is pressed against the medium to be tested to make it reusable , To further reduce costs.
  • the microstrip ground layer may be a metal foil.
  • the metal foil may be a metal foil with adhesion, such as copper foil and aluminum foil.
  • the metal foil may be copper foil.
  • this application can use a corresponding thickness measuring device to measure the thickness of the substrate of the medium to be measured (that is, the thickness of the measured substrate); when the processor obtains the measured resonant frequency and the measured thickness of the substrate of the medium to be measured, it can use
  • the preset correspondence relationship processes the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium; among them, the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to the resonance frequency and the thickness of the substrate The relationship of change.
  • the processor can use a three-dimensional electromagnetic simulation model or theoretical formula to obtain a data table that characterizes the relationship between the relative permittivity, resonance frequency, and the thickness of the medium to be measured (ie, the thickness of the substrate), and then based on the measured resonance frequency and the measured substrate thickness , Obtain the measured value of the relative permittivity of the medium to be measured by looking up the table.
  • the processor can use data fitting to form a fitting formula with a clear expression, and then substitute the actually measured resonance frequency and substrate thickness of the medium to be measured into the fitting formula to obtain the value of the medium to be measured.
  • Relative permittivity ie, the measured value of the relative permittivity
  • the relative permittivity test system of this application can be applied to the GB/T 12636-90 microwave dielectric substrate complex relative permittivity stripline test method.
  • the required tools can include: 1 set of 0.1 ⁇ 4GHz two-port vector network analyzer, near-field probe, resonant conduction band (ring), test tooling, etc.;
  • 100 MHz to 2 GHz can be used.
  • the thickness of the test substrate is at least 40 mm; in another example, the thickness of the test substrate may be 30 mm.
  • the specific test steps can include:
  • a section of microstrip transmission line with open ends has the characteristics of a resonant circuit.
  • copper foil is attached to the A side of the dielectric substrate to be tested to form the ground plane of the microstrip line (that is, the microstrip grounding layer).
  • the resonant conduction band (copper foil can be used) is attached to the B surface of the measuring dielectric substrate; the resonant conduction band is a ring-shaped conduction band, and the length can be ⁇ g of the working frequency band.
  • the relative permittivity can be obtained by looking up the table or by the fitting formula.
  • the resonance method is adopted.
  • the ground plane of the microstrip line ie, the microstrip grounding layer
  • a resonant conduction band for example, an annular conduction band
  • the resonance method can be used to realize the relative dielectric of the medium to be measured without damaging the medium to be measured. Constant testing and bonding methods can ensure a good fit and avoid the influence of air gaps. The test results are accurate, the method is simple, and the test cost can be reduced; it can be used to measure the relative dielectric constant of the antenna cover (within a thickness of 40mm), It has significant engineering practicability.
  • this application adopts a strip or ring-shaped resonant conduction band.
  • non-destructive testing is achieved through bonding; this application not only avoids the influence of air gaps, but also further improves the accuracy of the test results. It also has better engineering practicability.
  • the relative permittivity test system of the present application is suitable for the relative permittivity test of beautifying the antenna cover; the present application adopts the resonance method to paste copper foil on the A side of the dielectric substrate to be tested to form the ground plane of the microstrip line. Stick a strip or ring resonant conduction band on the B side of the substrate (copper foil can be used), use a probe close to the resonant conduction band on the B side of the dielectric substrate, measure the resonant frequency point of the transmission line, and then calculate the relative dielectric constant.
  • This application can be used to measure the relative permittivity of materials with a thickness of less than 40mm (such as plastics, foamed materials, etc.). The method is simple and does not need to destroy the tested material, can reduce the test cost, and has significant engineering practicability.
  • FIGS. 1 to 3 and 5 to 7 are only block diagrams of part of the structure related to the solution of the present application, and do not constitute a structure to which the solution of the present application is applied.
  • the specific structure and equipment may include more or less components than those shown in the figure, or combine certain components, or have different component arrangements.
  • a method for testing relative permittivity is provided.
  • the method is applied to the processor in FIG. 2 or FIG. 6 as an example for description, including the steps:
  • Step S810 Obtain the measured resonant frequency and measured substrate thickness of the medium to be tested; the measured resonant frequency is obtained by measuring the resonant conduction band of the test equipment; wherein the resonant conduction band is set on the upper surface of the substrate of the medium to be tested, and the microstrip grounding layer is bonded On the bottom surface of the substrate of the medium to be tested;
  • Step S820 Use the preset correspondence relationship to process the measured resonance frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to the resonance frequency, base The relationship between the thickness of the sheet.
  • the processor when it obtains the measured resonant frequency and the measured substrate thickness of the measured medium, it can use the preset correspondence relationship to process the measured resonance frequency and measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium ;
  • the processor can use a three-dimensional electromagnetic simulation model or theoretical formula to obtain a data table that characterizes the relationship between the relative permittivity, resonance frequency, and the thickness of the medium to be measured (ie, the thickness of the substrate), and then based on the measured resonance frequency and the measured substrate thickness , Obtain the measured value of the relative permittivity of the medium to be measured by looking up the table.
  • the processor can use data fitting to form a fitting formula with a clear expression, and then substitute the actually measured resonance frequency and substrate thickness of the medium to be measured into the fitting formula to obtain the value of the medium to be measured.
  • Relative permittivity ie, the measured value of the relative permittivity
  • the preset correspondence relationship is a data table or a data fitting model
  • the steps of processing the measured resonant frequency and the measured substrate thickness by using the preset correspondence relationship to obtain the measured value of the relative permittivity of the medium to be measured include:
  • the measured value of the relative permittivity of the medium to be measured is obtained;
  • the data fitting model is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured.
  • the data table can be a dense data table calculated by simulation or theoretical formulas. According to the actual measured resonant frequency (i.e. measured resonant frequency) and thickness (i.e. measured substrate thickness) of the medium to be tested, the data Find the relative permittivity of the medium to be measured (ie, the measured value of the relative permittivity) from the table;
  • the data table is a fitting formula with a clear expression formed by data fitting (for example, a data fitting model), and the actually measured resonance frequency and thickness of the medium to be measured are substituted into the fitting formula to obtain the measured The relative permittivity of the medium.
  • a data fitting model is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured, and the measured value of the relative permittivity is obtained based on the following formula:
  • ⁇ r represents the measured value of the relative permittivity
  • P1 to P11 are constants
  • H represents the measured thickness of the substrate
  • f 0 represents the measured resonant frequency
  • the functional model that characterizes the relationship between the relative permittivity with respect to the resonant frequency f 0 and the thickness H of the medium to be measured may be shown in the above-mentioned data fitting model. Further, as shown in Table 1 and Table 2, the values that can be taken by the constants P1 to P11 in this application;
  • the above-mentioned data fitting model may be fitted from a data table obtained by simulation.
  • the method before the step of obtaining the measured value of the relative permittivity of the medium to be measured by looking up the data table based on the measured resonant frequency and the measured substrate thickness, the method further includes the following steps:
  • the step of finding the relative permittivity of the medium to be measured by looking up a data table or using a fitting formula can be implemented in the following way: a three-dimensional electromagnetic simulation model or theoretical formula (ie theoretical model) based on the medium to be measured ), by changing the thickness and relative permittivity of the medium to be measured to obtain the change in the resonance frequency of the medium to be measured, and then use the data processing software to fit the characteristics of the change and thickness of the relative permittivity and resonance frequency according to the obtained three-dimensional data According to the actual measurement results, the actual measured resonant frequency and the actual thickness of the medium to be measured are brought into the function model to obtain the corresponding relative permittivity measurement value.
  • a three-dimensional electromagnetic simulation model or theoretical formula ie theoretical model
  • a data table can be obtained based on the theoretical formula to obtain the relative permittivity
  • the equivalent dielectric constant ⁇ re can be calculated by the following formula:
  • n the number of standing wave half-wavelengths of the resonant conduction band distribution of the resonant time delay
  • f n the resonance frequency of the nth mode, Hz
  • ⁇ L g Considering the effective increase of the resonant conduction band caused by the fringe field effect at the two ports of the resonant conduction band; among them, regarding the value of ⁇ L g , when the resonant conduction band is a ring-shaped conduction band, the value of ⁇ L g can be 0.
  • ⁇ L g can be obtained based on the following formula:
  • ⁇ re represents the accuracy of the equivalent dielectric constant
  • h represents the thickness of the substrate of the medium to be measured
  • w represents the width of the resonant conduction band
  • the equivalent permittivity ⁇ re and relative permittivity ⁇ r can satisfy the following formula:
  • h represents the thickness of the substrate of the medium to be tested
  • w represents the width of the resonant conduction band.
  • the above-mentioned relative permittivity test method adopts the resonance method to bond the ground plane of the microstrip line (ie, the microstrip grounding layer) on the lower surface of the substrate of the medium to be tested.
  • a resonant conduction band (for example, a ring-shaped conduction band) is set on the upper surface of the chip, and the resonant conduction band near the upper surface of the dielectric substrate is used to measure the resonant frequency of the transmission line, and then based on the preset correspondence and the thickness of the resonant conduction band, Get the relative permittivity of the medium to be measured.
  • a microstrip grounding layer and a resonant conduction band are separately provided on the medium to be tested, and the microstrip grounding layer is connected to the medium to be tested by bonding, which can be realized by using the resonance method without damaging the medium to be tested.
  • the relative permittivity test of the medium to be tested, the bonding method can ensure a good fit, and avoid the influence of air gaps, the test results are accurate, the method is simple, and the test cost can be reduced; it can be used to measure the antenna cover (within 40mm thickness) ) Relative permittivity, which has significant engineering practicability.
  • steps in the flowchart of FIG. 8 are displayed in sequence as indicated by the arrows, these steps are not necessarily performed in sequence in the order indicated by the arrows. Unless specifically stated in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least part of the steps in FIG. 8 may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution of these sub-steps or stages The sequence is not necessarily performed sequentially, but may be performed alternately or alternately with at least a part of other steps or sub-steps or stages of other steps.
  • a relative permittivity test device including:
  • the data acquisition module 910 is used to acquire the measured resonant frequency and the measured substrate thickness of the medium to be measured; the measured resonant frequency is obtained by the measurement of the resonant conduction band measured by the test equipment; wherein the resonant conduction band is set on the upper surface of the substrate of the medium to be measured, and the The ground layer is bonded to the bottom surface of the substrate of the medium to be tested;
  • the data processing module 920 is used to process the measured resonance frequency and the measured substrate thickness by using a preset correspondence relationship to obtain the measured value of the relative permittivity of the medium to be measured; the preset correspondence relationship is used to characterize the relative permittivity of the measured medium The relationship between the resonance frequency and the thickness of the substrate.
  • each module in the above-mentioned relative permittivity test device can be implemented in whole or in part by software, hardware and a combination thereof.
  • the above-mentioned modules may be embedded in the form of hardware or independent of the processor in the computer equipment, or may be stored in the memory of the computer equipment in the form of software, so that the processor can call and execute the operations corresponding to the above-mentioned modules.
  • a computer-readable storage medium is provided, and a computer program is stored thereon, and the computer program implements the steps of any one of the foregoing methods when the computer program is executed by a processor.
  • Non-volatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory.
  • Volatile memory may include random access memory (RAM) or external cache memory.
  • RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous chain Channel (Synchlink) DRAM (SLDRAM), memory bus type dynamic random access memory (Rambus DRAM, RDRAM for short), and interface dynamic random access memory (DRDRAM), etc.

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Abstract

A relative dielectric constant test system, method, and apparatus, and a storage medium. The relative dielectric constant test system, comprising a microstrip ground layer (120) adhered to the lower surface of a base of a medium to be tested (10), and a resonant conduction band (110) provided on the upper surface of the base of the medium to be tested (10); and also comprising: a test device (20), the test device (20) measuring the measured resonant frequency of the resonant conduction band (110); a processor (30) connected to the test device (20), the processor (30) obtaining the measured resonant frequency and the measured base thickness of the medium to be tested (10) and processing, according to a preset correspondence relationship, the measured resonant frequency and the measured base thickness to obtain a measured value of the relative dielectric constant of the medium to be tested (10). The present application can achieve, by using a resonance method, the test of the relative dielectric constant of the medium to be tested (10), without damaging the medium to be tested (10); the test result is accurate; and the method is simple.

Description

相对介电常数测试***、方法、装置和存储介质Relative dielectric constant testing system, method, device and storage medium 技术领域Technical field
本申请涉及通信技术领域,特别是涉及一种相对介电常数测试***、方法、装置和存储介质。This application relates to the field of communication technology, and in particular to a relative permittivity test system, method, device and storage medium.
背景技术Background technique
随着移动通讯业务的发展和5G(5th generation mobile networks,第五代移动通信技术)的商用推进,移动通讯的网络在不断的扩大,将会有多个宏站建设,5G使用的频率高,建站密度大,面临比4G(the 4th generation mobile communication technology,***移动通信技术)挑战更大的选址难问题,同时会对城市市容景观带来影响,为了解决城市站点对周围环境的影响必将对站点安装的设备进行美化和隐蔽。With the development of mobile communication services and the commercial advancement of 5G (5th generation mobile networks, the fifth generation of mobile communication technology), mobile communication networks are constantly expanding, and there will be multiple macro sites to be built, and 5G will be used at a high frequency. With a high density of sites, it faces a greater difficulty in site selection than 4G (the 4th generation mobile communication technology). At the same time, it will have an impact on the city's cityscape. In order to solve the impact of urban sites on the surrounding environment The equipment installed on the site must be beautified and concealed.
目前,通常采用美化外罩(例如,美化天线外罩)对站点进行伪装与周围环境融为一体,美化外罩可以选用不同的介质材料设计;美化外罩在满足机械性能与外观的同时,对电性能也有较高的要求,其中,透波率与介电性能是评估美化外罩对天线和主设备的重要指标,电磁波在传播过程中遇到介质材料时,能量会损耗,要求相对介电常数和损耗角正切越小越好,以达到最小反射和最大传输的目的。除此之外,常规的天线外罩和天线内部使用的介质材料部件(如移相器介质片,PCB板材等)也有在非破坏条件下测量相对介电常数的需求。At present, beautification covers (for example, beautification antenna covers) are usually used to camouflage the site and integrate with the surrounding environment. The beautification covers can be designed with different dielectric materials; while the beautification covers meet the mechanical performance and appearance, they also have better electrical performance. High requirements. Among them, the transmission rate and dielectric performance are important indicators for evaluating the beautification cover for antennas and main equipment. When electromagnetic waves encounter dielectric materials during the propagation process, energy will be lost. Relative dielectric constant and loss tangent are required. The smaller the better, in order to achieve the purpose of minimum reflection and maximum transmission. In addition, the conventional antenna cover and the dielectric material components used inside the antenna (such as the phase shifter dielectric sheet, PCB board, etc.) also need to measure the relative permittivity under non-destructive conditions.
在实现过程中,发明人发现传统技术中至少存在如下问题:针对不同介质材料,传统技术通过测试仪器直接测出相对介电常数值而目前,天线外罩因应用环境复杂多变,为保证结构和电气特性,通常设计厚度均大于或等于5mm,且测试过程不允许进行裁剪破坏。故传统的针对介质材料样片的方法需对被测件进行裁剪取样,且可测试的最大厚度不满足现实需求。In the process of implementation, the inventor found that the traditional technology has at least the following problems: for different dielectric materials, the traditional technology directly measures the relative permittivity value through the test instrument. At present, the antenna cover is complicated and changeable due to the complex application environment. In order to ensure the structure and Electrical characteristics, usually the design thickness is greater than or equal to 5mm, and the test process does not allow cutting damage. Therefore, the traditional method for samples of dielectric materials requires cutting and sampling of the test piece, and the maximum thickness that can be tested does not meet the actual requirements.
发明内容Summary of the invention
基于此,有必要针对上述技术问题,提供一种能在不破坏被测件的前提下,测试介质材料相对介电常数的相对介电常数测试***、方法、装置和存储介质。Based on this, it is necessary to address the above technical problems and provide a relative permittivity test system, method, device and storage medium that can test the relative permittivity of dielectric materials without damaging the device under test.
为了实现上述目的,一方面,本发明实施例提供了一种相对介电常数测试***,包括粘接于待测介质的基片下表面的微带接地层,以及设于待测介质的基片上表面的谐振导带;In order to achieve the above objective, on the one hand, an embodiment of the present invention provides a relative permittivity test system, which includes a microstrip ground layer bonded to the lower surface of the substrate of the medium to be tested, and is arranged on the substrate of the medium to be tested Resonant conduction band of the surface;
还包括:Also includes:
测试设备;测试设备测量谐振导带的实测谐振频率;Test equipment; the test equipment measures the measured resonant frequency of the resonant conduction band;
连接测试设备的处理器;处理器获取实测谐振频率以及待测介质的实测基片厚度,并采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The processor connected to the test equipment; the processor obtains the measured resonant frequency and the measured substrate thickness of the measured medium, and uses the preset correspondence relationship to process the measured resonant frequency and measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium ; The preset correspondence is used to characterize the relationship between the relative permittivity of the medium to be measured on the resonance frequency and the thickness of the substrate.
一种相对介电常数测试方法,A test method for relative permittivity,
获取待测介质的实测谐振频率和实测基片厚度;实测谐振频率为测试设备测量谐振导带测量得到;其中,谐振导带设于待测介质的基片上表面,微带接地层粘接于待测介质的基片下表面;Obtain the measured resonant frequency of the medium to be tested and the measured substrate thickness; the measured resonant frequency is obtained by measuring the resonant conduction band of the test equipment; among them, the resonant conduction band is set on the upper surface of the substrate of the medium to be tested, and the microstrip ground layer is bonded to the substrate to be tested. The bottom surface of the substrate of the measuring medium;
采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The preset correspondence relationship is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to the resonance frequency and the thickness of the substrate alternative relation.
一种相对介电常数测试装置,包括:A relative permittivity test device, including:
数据获取模块,用于获取待测介质的实测谐振频率和实测基片厚度;实测谐振频率为测试设备测量谐振导带测量得到;其中,谐振导带设于待测介质的基片上表面,微带接地层粘接于待测介质的基片下表面;The data acquisition module is used to acquire the measured resonant frequency of the medium to be measured and the measured substrate thickness; the measured resonant frequency is obtained by measuring the resonant conduction band measured by the test equipment; among them, the resonant conduction band is set on the upper surface of the substrate of the medium to be measured, and the microstrip The ground layer is adhered to the lower surface of the substrate of the medium to be tested;
数据处理模块,用于采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The data processing module is used to process the measured resonant frequency and the measured substrate thickness by using the preset correspondence relationship to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to resonance The relationship between frequency and substrate thickness.
一种计算机可读存储介质,其上存储有计算机程序,计算机程序被处理器 执行时实现上述的方法的步骤。A computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above-mentioned method are realized.
上述技术方案中的一个技术方案具有如下优点和有益效果:One of the above technical solutions has the following advantages and beneficial effects:
本申请采用谐振法,在待测介质的基片下表面粘接微带线的接地面(即微带接地层),在基片上表面设置谐振导带,采用测量设备与探针连接,将探针靠近介质基片上表面的谐振导带,测量出该段传输线的谐振频率,进而基于预设的待测介质的相对介电常数关于谐振频率、基片厚度的变化关系,得到待测介质的相对介电常数;本申请通过在待测介质上分别设置微带接地层和谐振导带,并且微带接地层通过粘接的方式与待测介质相连,可以在不破坏待测介质的前提下,利用谐振法实现待测介质的相对介电常数的测试,粘接的方式可以保证贴合良好,并且避免空气间隙的影响,测试结果准确,方法简易,能降低测试成本;可将谐振导带印制在PCB薄片上,使其可重复使用,以进一步降低成本。本发明特别适用于测量天线外罩的相对介电常数,具有显著工程实用性。This application adopts the resonance method to bond the ground plane of the microstrip line (ie the microstrip grounding layer) on the lower surface of the substrate of the medium to be measured, set a resonance conduction band on the upper surface of the substrate, and use the measuring device to connect the probe to the probe. The needle is close to the resonant conduction band on the upper surface of the dielectric substrate, and the resonant frequency of the transmission line is measured. Based on the preset relative permittivity of the medium to be measured, the relationship between the resonant frequency and the thickness of the substrate is obtained. Permittivity: In this application, a microstrip grounding layer and a resonant conduction band are separately provided on the medium to be tested, and the microstrip grounding layer is connected to the medium to be tested by bonding, so that the medium to be tested can be protected without damaging the medium. The resonance method is used to test the relative permittivity of the medium to be tested. The bonding method can ensure a good fit and avoid the influence of air gaps. The test results are accurate, the method is simple, and the test cost can be reduced; the resonance conduction band can be printed Manufactured on the PCB sheet to make it reusable to further reduce costs. The invention is particularly suitable for measuring the relative dielectric constant of the antenna cover, and has obvious engineering practicability.
附图说明Description of the drawings
图1为一个实施例中相对介电常数测试***中待测介质的结构示意图;FIG. 1 is a schematic diagram of the structure of a medium to be tested in a relative permittivity test system in an embodiment;
图2为一个实施例中相对介电常数测试***的结构示意图;2 is a schematic diagram of the structure of a relative permittivity test system in an embodiment;
图3为一个实施例中相对介电常数测试***的具体结构示意图;FIG. 3 is a schematic diagram of a specific structure of a relative permittivity test system in an embodiment;
图4a为一个实施例中探针间的传输系数示意图;Figure 4a is a schematic diagram of transmission coefficients between probes in an embodiment;
图4b为一个实施例中待测介质谐振频点示意图;Figure 4b is a schematic diagram of the resonance frequency of the medium to be measured in an embodiment;
图5为另一个实施例中相对介电常数测试***中待测介质的结构示意图;5 is a schematic diagram of the structure of the medium to be tested in the relative permittivity test system in another embodiment;
图6为另一个实施例中相对介电常数测试***的结构示意图;Fig. 6 is a schematic structural diagram of a relative permittivity test system in another embodiment;
图7为另一个实施例中相对介电常数测试***的具体结构示意图;FIG. 7 is a schematic diagram of a specific structure of a relative permittivity test system in another embodiment;
图8为一个实施例中相对介电常数测试方法的流程示意图;FIG. 8 is a schematic flowchart of a method for measuring relative permittivity in an embodiment;
图9为一个实施例中相对介电常数测试装置的结构框图。Fig. 9 is a structural block diagram of a relative permittivity test device in an embodiment.
具体实施方式Detailed ways
目前市面上不同介质材料均可以通过测试仪器直接测出相对介电常数值,比如使用keysight E4991B材料分析仪,配合16453A介电常数测量夹具测量介质材料相对介质电常数时,要求将被测件裁剪成30×30毫米方片,且可测试的介质样品厚度小于3毫米。即传统测试其测试厚度受限于5mm以内,超过5mm将无法直接测试其对应介质的相对介电常数值;美化外罩因场地环境需求多变,外罩需要满足恶劣环境下具有高可靠性,通常设计厚度需≥5mm,导致各厂家及运营商无法评估超过5mm以上的介质材料的相对介电常数值。另外,现有的非破坏性的测试方法虽有多种,但不能满足基站天线外罩特性的检测。At present, different dielectric materials on the market can be used to directly measure the relative permittivity value of the test instrument. For example, when the keysight E4991B material analyzer is used with the 16453A permittivity measurement fixture to measure the relative permittivity of the dielectric material, it is required to cut the test piece. It is a 30×30 mm square piece, and the thickness of the testable medium sample is less than 3 mm. That is, the thickness of the traditional test is limited to less than 5mm, and the relative permittivity value of the corresponding medium cannot be directly tested if the thickness exceeds 5mm; the beautification cover needs to meet the high reliability in the harsh environment due to the changing requirements of the site environment, and it is usually designed The thickness needs to be ≥5mm, which makes it impossible for manufacturers and operators to evaluate the relative permittivity of dielectric materials over 5mm. In addition, although there are a variety of existing non-destructive test methods, they cannot satisfy the detection of the characteristics of the base station antenna cover.
而本申请提供了一种谐振电路测试方式,可以直接测出各种厚度的相对介电常数值。具体地,本申请可以用于测量厚度40mm以内材料的相对介电常数(如塑料、发泡材料等);在一个具体的示例中,本申请适合于天线外罩的相对介电常数测量;本申请简易且无需破坏被测材料,能降低测试成本,具有显著的工程实用性。This application provides a resonant circuit test method, which can directly measure the relative permittivity values of various thicknesses. Specifically, this application can be used to measure the relative permittivity of materials within a thickness of 40mm (such as plastics, foamed materials, etc.); in a specific example, this application is suitable for the measurement of the relative permittivity of antenna enclosures; this application It is simple and does not need to destroy the tested material, can reduce the test cost, and has significant engineering practicability.
本申请提供的相对介电常数测试***,可以应用于天线外罩(例如,美化外罩)的相对介电常数测量。其中,天线外罩可以是基片厚度为40mm以内的介质材料(如塑料、发泡材料等),即待测介质。The relative permittivity test system provided in this application can be applied to the relative permittivity measurement of antenna enclosures (for example, beautification enclosures). Wherein, the antenna cover can be a dielectric material (such as plastic, foamed material, etc.) with a substrate thickness of less than 40 mm, that is, the medium to be tested.
在一个实施例中,提供了一种相对介电常数测试***,如图1所示,针对待测介质10,本申请相对介电常数测试***可以包括粘接于待测介质10的基片下表面的微带接地层120,以及设于待测介质的基片上表面的谐振导带110;其中,谐振导带110可以为条状导带。进一步的,如图2所示,以该***应用于图1所示的待测介质为例进行说明,本申请相对介电常数测试***还包括:In one embodiment, a relative permittivity test system is provided. As shown in FIG. 1, for the medium 10 to be tested, the relative permittivity test system of the present application may include bonding under the substrate of the test medium 10 The microstrip grounding layer 120 on the surface, and the resonant conduction band 110 provided on the upper surface of the substrate of the medium to be tested; wherein, the resonant conduction band 110 may be a strip-shaped conduction band. Further, as shown in FIG. 2, the application of the system to the medium to be tested shown in FIG. 1 is taken as an example for description. The relative permittivity test system of the present application also includes:
测试设备20;测试设备20测量谐振导带110的实测谐振频率;The test equipment 20; the test equipment 20 measures the measured resonant frequency of the resonant conduction band 110;
连接测试设备20的处理器30;处理器30获取实测谐振频率以及待测介质10的实测基片厚度,并采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The processor 30 connected to the test device 20; the processor 30 obtains the measured resonant frequency and the measured substrate thickness of the measured medium 10, and uses a preset correspondence relationship to process the measured resonant frequency and measured substrate thickness to obtain the relative medium of the measured medium The measured value of the electrical constant; the preset corresponding relationship is used to characterize the relationship between the relative permittivity of the measured medium and the resonant frequency and the thickness of the substrate.
具体而言,本申请相对介电常数测试***,在待测介质10的一面粘贴有微带接地层120,在待测介质10与微带接地层120相对的另一面设置有谐振导带 110;本申请提出采用粘接方式设置微带接地层,即微带接地层通过粘接的方式与待测介质相连,可以在不破坏待测介质的前提下,进而利用谐振法实现待测介质的相对介电常数的测试;其中,粘接的方式可以保证贴合良好,不仅可以避免空气间隙的影响,进一步提升测试结果的准确性,还具有更好的工程实用性。Specifically, in the relative permittivity test system of the present application, a microstrip grounding layer 120 is pasted on one side of the medium 10 to be tested, and a resonant conduction band 110 is provided on the other side of the medium to be tested 10 opposite to the microstrip grounding layer 120; This application proposes to set the microstrip grounding layer by bonding, that is, the microstrip grounding layer is connected to the medium to be tested by bonding, and the resonance method can be used to realize the relative measurement of the medium to be tested without damaging the medium to be tested. Dielectric constant test; among them, the way of bonding can ensure a good fit, not only can avoid the influence of air gaps, and further improve the accuracy of the test results, but also has better engineering practicability.
在一个具体的示例中,一段两端开路的微带传输线具有谐振电路的特性;微带传输线两端可以与同轴连接器或探针相连,并经微波电缆连接用于测量谐振频率的测试设备20,采集测试设备20的测量传输系数得到谐振频率值,从而测量出谐振导带的谐振频率(也即实测谐振频率);其中,微波电缆可以是射频微波测试电缆,例如,射频微波同轴测试电缆(RF Microwave Coax Test cable)。In a specific example, a section of a microstrip transmission line with open ends has the characteristics of a resonant circuit; both ends of the microstrip transmission line can be connected to a coaxial connector or probe, and connected to a test equipment used to measure the resonance frequency via a microwave cable 20. Collect the measured transmission coefficient of the test equipment 20 to obtain the resonant frequency value, thereby measuring the resonant frequency of the resonant conduction band (that is, the measured resonant frequency); where the microwave cable may be a radio frequency microwave test cable, for example, a radio frequency microwave coaxial test Cable (RF Microwave Coax Test cable).
又如,如图2所示,测试设备20用探针靠近待测介质10的基片上表面的谐振导带110,测量出该段传输线的谐振频率(也即实测谐振频率)。As another example, as shown in FIG. 2, the testing equipment 20 uses a probe to approach the resonant conduction band 110 on the upper surface of the substrate of the medium 10 to be tested to measure the resonant frequency of the transmission line (that is, the measured resonant frequency).
在一个具体的示例中,测试设备20可以为矢量网络分析仪。In a specific example, the testing device 20 may be a vector network analyzer.
具体地,矢量网络分析仪与同轴连接器或探针相连,并通过同轴连接器或探针靠近谐振导带,测量谐振导带的实测谐振频率。Specifically, the vector network analyzer is connected to the coaxial connector or probe, and the resonant conduction band is approached through the coaxial connector or probe to measure the measured resonant frequency of the resonant conduction band.
在一个具体的实施例中,如图1所示,谐振导带110的长度可以为λ g;其中,λ g为工作频段微带线上的波长;工作频段为测试时所用频段。 In a specific embodiment, as shown in FIG. 1, the length of the resonant conduction band 110 may be λ g ; where λ g is the wavelength on the microstrip line of the working frequency band; and the working frequency band is the frequency band used in the test.
在一个具体的实施例中,如图1所示,谐振导带110的长度可以为λ g/2,谐振导带110的宽度为1~5mm。其中,λ g为工作频段微带线上的波长;工作频段为测试时所用频段。 In a specific embodiment, as shown in FIG. 1, the length of the resonant conduction band 110 may be λ g /2, and the width of the resonant conduction band 110 may be 1 to 5 mm. Among them, λ g is the wavelength on the microstrip line of the working frequency band; the working frequency band is the frequency band used during the test.
具体而言,本申请中谐振导带110的长度,谐振导带110的宽度,以可明显测试出谐振峰值为选择依据;其中,基于以下公式,得到λ gSpecifically, the length of the resonant conduction band 110 and the width of the resonant conduction band 110 in this application are selected based on the resonant peak that can be clearly measured; wherein, λ g is obtained based on the following formula:
Figure PCTCN2020140994-appb-000001
Figure PCTCN2020140994-appb-000001
其中,ε re为待测介质基片的等效介电常数,f为频率,c表示光速。 Among them, ε re is the equivalent permittivity of the dielectric substrate to be tested, f is the frequency, and c is the speed of light.
需要说明的是,本申请中谐振导带110的长度,谐振导带110的宽度,可 以根据实际需求予以选择。It should be noted that the length of the resonant conduction band 110 and the width of the resonant conduction band 110 in this application can be selected according to actual needs.
在一个具体的实施例中,谐振导带110可以为金属箔。In a specific embodiment, the resonant conduction band 110 may be a metal foil.
具体而言,金属箔与待测介质10通过粘接相连,例如,金属箔粘接在基片上表面;进一步的,金属箔可以是带有粘性的金属箔,例如,铜箔、铝箔;在一个示例中,金属箔为铜箔。Specifically, the metal foil and the test medium 10 are connected by bonding, for example, the metal foil is bonded to the upper surface of the substrate; further, the metal foil may be a metal foil with adhesive, for example, copper foil, aluminum foil; In the example, the metal foil is copper foil.
在其中一个实施例中,谐振导带110可以为印制在PCB薄片上的金属导带;金属导带贴设于基片上表面。In one of the embodiments, the resonant conduction strip 110 may be a metal conduction strip printed on the PCB sheet; the metal conduction strip is attached to the upper surface of the substrate.
具体而言,谐振导带110往往尺寸较小,难以被工整的贴合于待测介质上,并且粘接的谐振导带110也不便于重复利用;为此,本申请提出,谐振导带110可以为印制在PCB(Printed Circuit Board,印制电路板)薄片上的金属导带,PCB薄片上的金属导带压紧贴设于待测介质10上,使其可重复使用,进而进一步降低成本。Specifically, the resonant conduction band 110 is often small in size, and it is difficult to be neatly attached to the medium to be measured, and the bonded resonant conduction band 110 is not easy to reuse; therefore, the present application proposes the resonant conduction band 110 It can be a metal conduction tape printed on a PCB (Printed Circuit Board) sheet. The metal conduction tape on the PCB sheet is pressed against the test medium 10 to make it reusable and further reduce cost.
在一个具体的实施例中,微带接地层120可以为金属箔。In a specific embodiment, the microstrip ground layer 120 may be a metal foil.
具体而言,金属箔可以是带有粘性的金属箔,例如铜箔、铝箔。在一个具体的示例中,金属箔可以为铜箔。Specifically, the metal foil may be a metal foil with adhesion, such as copper foil and aluminum foil. In a specific example, the metal foil may be copper foil.
进一步的,如图1所示,本申请可以采用相应的厚度测量装置测量待测介质10的基片厚度(也即实测基片厚度);处理器在获取到实测谐振频率以及待测介质的实测基片厚度时,可以采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;其中,预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。Further, as shown in FIG. 1, the present application can use a corresponding thickness measuring device to measure the thickness of the substrate (that is, the measured substrate thickness) of the medium 10 to be measured; the processor is acquiring the measured resonance frequency and the measured medium For the thickness of the substrate, the preset correspondence can be used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured; among them, the preset correspondence is used to characterize the relative permittivity of the measured medium The relationship between the resonance frequency and the thickness of the substrate.
例如,处理器可以采用三维电磁仿真模型或理论公式得出表征相对介电常数、谐振频率与待测介质厚度(即基片厚度)的关系的数据表格,进而基于实测谐振频率以及实测基片厚度,通过查表的方式得到待测介质的相对介电常数测量值。For example, the processor can use a three-dimensional electromagnetic simulation model or theoretical formula to obtain a data table that characterizes the relationship between the relative permittivity, resonance frequency, and the thickness of the medium to be measured (ie, the thickness of the substrate), and then based on the measured resonance frequency and the measured substrate thickness , Obtain the measured value of the relative permittivity of the medium to be measured by looking up the table.
又如,处理器可以采用通过数据拟合形成具有明确表达式的拟合公式,然后,将实际测得的待测介质的谐振频率和基片厚度代入该拟合公式,求得待测介质的相对介电常数(即相对介电常数测量值)。For another example, the processor can use data fitting to form a fitting formula with a clear expression, and then substitute the actually measured resonance frequency and substrate thickness of the medium to be measured into the fitting formula to obtain the value of the medium to be measured. Relative permittivity (ie, the measured value of the relative permittivity).
下面结合一个具体的实例予以说明,如图3所示,本申请相对介电常数测 试***,可以应用于GB/T 12636-90微波介质基片复相对介电常数带状线测试方法,测试所需工具可以包括:0.1~4GHz两端口矢量网络分析仪1台、近场探头、谐振导带(环),测试工装等;The following describes a specific example. As shown in Figure 3, the relative permittivity test system of this application can be applied to the GB/T 12636-90 microwave dielectric substrate complex relative permittivity stripline test method. The required tools can include: 1 set of 0.1~4GHz two-port vector network analyzer, near-field probe, resonant conduction band (ring), test tooling, etc.;
测试要求可以包括:①测试频率范围:f=0.1~4GHz;②测试基材厚度:h=1~40mm;③测试相对介电常数范围:ε 0=1~25;④测试环境:温度20-30℃,相对湿度45%-75%。具体而言,针对上述测试频率范围,可以采用100MHz~2GHz。其中,在一个示例中,测试基材厚度至少为40mm;在另一个示例中,测试基材厚度可以为30mm。 Test requirements can include: ①Test frequency range: f=0.1~4GHz; ②Test substrate thickness: h=1~40mm; ③Test relative permittivity range: ε 0 =1~25; ④Test environment: temperature 20- 30℃, relative humidity 45%-75%. Specifically, for the above-mentioned test frequency range, 100 MHz to 2 GHz can be used. Among them, in one example, the thickness of the test substrate is at least 40 mm; in another example, the thickness of the test substrate may be 30 mm.
如图3所示,具体测试步骤可以包括:As shown in Figure 3, the specific test steps can include:
1)一段两端开路的微带传输线具有谐振电路的特性,如图3所示在待测介质基片A面贴铜箔,构成微带线的接地面(即微带接地层),在待测介质基片B面贴谐振导带(可以用铜箔),谐振导带长度为λ g/2,谐振导带宽度w选择1~5mm(以可明显测试出谐振峰值为选择依据)。在一个具体的实施例中,该谐振导带也可是环形导带,长度可以为λ g。其中,λ g为工作频段微带线上的波长;工作频段为测试时所用频段。 1) A section of microstrip transmission line with open ends has the characteristics of a resonant circuit. As shown in Figure 3, copper foil is attached to the A side of the dielectric substrate to be tested to form the ground plane of the microstrip line (ie the microstrip grounding layer). The resonant conduction band (copper foil can be used) is attached to the B surface of the measuring dielectric substrate. The length of the resonant conduction band is λ g /2, and the width of the resonant conduction band w is selected from 1 to 5 mm (based on the obvious test of the resonance peak). In a specific embodiment, the resonant conduction band may also be an annular conduction band, and the length may be λ g . Among them, λ g is the wavelength on the microstrip line of the working frequency band; the working frequency band is the frequency band used during the test.
2)采用探针靠近介质基片B面的谐振导带,测量出该段传输线的谐振频率点,可以如图4a、图4b所示。2) Use the probe to approach the resonant conduction band of the B surface of the dielectric substrate to measure the resonant frequency point of the transmission line, as shown in Figure 4a and Figure 4b.
3)在实测得出谐振频率后,可以通过查阅表格或通过拟合公式得出相对介电常数。3) After the resonant frequency is obtained by actual measurement, the relative permittivity can be obtained by looking up the table or by the fitting formula.
本申请采用谐振法,在待测介质的基片下表面粘接微带线的接地面(即微带接地层),在基片上表面设置谐振导带,采用测量设备靠近介质基片上表面的谐振导带,测量出该段传输线的谐振频率,进而基于预设对应关系和谐振导带长的厚度,得到待测介质的相对介电常数;本申请通过在待测介质上分别设置微带接地层和谐振导带,并且微带接地层通过粘接的方式与待测介质相连,可以在不破坏待测介质的前提下,利用谐振法实现待测介质的相对介电常数的测试,粘接的方式可以保证贴合良好,并且避免空气间隙的影响,测试结果准确,方法简易,能降低测试成本;同时,本申请提出可将谐振导带印制在PCB薄片上,使其可重复使用,进而进一步降低成本。以上,本申请可以用于测量天线 外罩(厚度40mm以内)的相对介电常数,具有显著工程实用性。This application adopts the resonance method to bond the ground plane of the microstrip line (ie, the microstrip grounding layer) on the lower surface of the substrate of the medium to be measured, set a resonant conduction band on the upper surface of the substrate, and use the measuring device to approach the resonance of the upper surface of the dielectric substrate Conduction band, the resonant frequency of the transmission line is measured, and then based on the preset correspondence and the thickness of the resonant conduction band length, the relative permittivity of the medium to be tested is obtained; this application provides a microstrip grounding layer on the medium to be tested. And the resonant conduction band, and the microstrip grounding layer is connected to the medium to be tested by bonding. The resonance method can be used to test the relative permittivity of the medium to be tested without damaging the medium to be tested. The method can ensure a good fit and avoid the influence of air gaps, the test results are accurate, the method is simple, and the test cost can be reduced; at the same time, this application proposes to print the resonant conduction band on the PCB sheet to make it reusable, and then Further reduce costs. Above, this application can be used to measure the relative permittivity of an antenna cover (within a thickness of 40mm), which has significant engineering practicability.
在一个实施例中,提供了一种相对介电常数测试***,如图5所示,针对待测介质,本申请相对介电常数测试***可以包括粘接于待测介质的基片下表面的微带接地层,以及设于待测介质的基片上表面的谐振导带;其中,谐振导带可以为环形导带。进一步的,如图6所示,以该***应用于图5所示的待测介质为例进行说明,本申请相对介电常数测试***还包括:In one embodiment, a relative permittivity test system is provided. As shown in FIG. 5, for the medium to be tested, the relative permittivity test system of the present application may include a system bonded to the lower surface of the substrate of the test medium. The microstrip grounding layer and the resonant conduction band provided on the upper surface of the substrate of the medium to be tested; wherein, the resonant conduction band can be a ring-shaped conduction band. Further, as shown in FIG. 6, the application of the system to the medium to be tested shown in FIG. 5 is taken as an example for description. The relative permittivity test system of the present application also includes:
测试设备及与测试设备相连的探针或同轴连接器;测试设备通过探针或同轴连接器靠近谐振导带,测量谐振导带的实测谐振频率;Test equipment and the probe or coaxial connector connected to the test equipment; the test equipment approaches the resonant conduction band through the probe or coaxial connector, and measures the measured resonant frequency of the resonant conduction band;
连接测试设备的处理器;处理器获取实测谐振频率以及待测介质的实测基片厚度,并采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The processor connected to the test equipment; the processor obtains the measured resonant frequency and the measured substrate thickness of the measured medium, and uses the preset correspondence relationship to process the measured resonant frequency and measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium ; The preset correspondence is used to characterize the relationship between the relative permittivity of the medium to be measured on the resonance frequency and the thickness of the substrate.
具体而言,本申请相对介电常数测试***,在待测介质的一面粘贴有微带接地层,在待测介质与微带接地层相对的另一面设置有谐振导带;本申请提出采用粘接方式设置微带接地层,即微带接地层通过粘接的方式与待测介质相连,可以在不破坏待测介质的前提下,进而利用谐振法实现待测介质的相对介电常数的测试;其中,粘接的方式可以保证贴合良好,不仅可以避免空气间隙的影响,进一步提升测试结果的准确性,还具有更好的工程实用性。Specifically, in the relative permittivity test system of this application, a microstrip grounding layer is pasted on one side of the medium to be tested, and a resonant conduction band is provided on the opposite side of the medium to be tested and the microstrip grounding layer; this application proposes to adopt the adhesive The microstrip grounding layer is set in the connection mode, that is, the microstrip grounding layer is connected to the medium to be tested by bonding. The resonance method can be used to test the relative permittivity of the medium to be tested without damaging the medium to be tested. ; Among them, the bonding method can ensure a good fit, not only can avoid the influence of air gaps, and further improve the accuracy of the test results, but also has better engineering practicability.
如图6所示,测试设备用探针靠近待测介质的基片上表面的谐振导带,测量出该段传输线的谐振频率(也即实测谐振频率)。As shown in Figure 6, the test equipment uses a probe to approach the resonant conduction band on the upper surface of the substrate of the medium to be tested, and measures the resonant frequency of the transmission line (that is, the measured resonant frequency).
在一个具体的示例中,测试设备可以为矢量网络分析仪。In a specific example, the test equipment may be a vector network analyzer.
在一个具体的实施例中,谐振导带的长度可以为λ g;其中,λ g为工作频段微带线上的波长;工作频段为测试时所用频段。 In a specific embodiment, the length of the resonant conduction band may be λ g ; where λ g is the wavelength on the microstrip line of the working frequency band; and the working frequency band is the frequency band used in the test.
在一个具体的实施例中,谐振导带的长度可以为λ g/2,谐振导带的宽度为1~5mm。其中,λ g为工作频段微带线上的波长;工作频段为测试时所用频段。 In a specific embodiment, the length of the resonant conduction band may be λ g /2, and the width of the resonant conduction band is 1 to 5 mm. Among them, λ g is the wavelength on the microstrip line of the working frequency band; the working frequency band is the frequency band used during the test.
具体而言,本申请中谐振导带的长度,谐振导带的宽度,以可明显测试出 谐振峰值为选择依据,也可以根据实际需求予以选择。Specifically, the length of the resonant conduction band and the width of the resonant conduction band in this application are selected on the basis of the resonant peak that can be clearly tested, and can also be selected according to actual needs.
在一个具体的实施例中,谐振导带可以为金属箔。In a specific embodiment, the resonant conduction band may be a metal foil.
具体而言,金属箔与待测介质通过粘接相连,例如,金属箔粘接在基片上表面;在一个示例中,金属箔为铜箔。Specifically, the metal foil and the test medium are connected by bonding, for example, the metal foil is bonded to the upper surface of the substrate; in one example, the metal foil is copper foil.
在其中一个实施例中,谐振导带可以为印制在PCB薄片上的金属导带;金属导带贴设于基片上表面。In one of the embodiments, the resonant conduction strip may be a metal conduction strip printed on the PCB sheet; the metal conduction strip is attached to the upper surface of the substrate.
具体而言,本申请中的金属导带,可以是用PCB工艺制成的金属层;谐振导带往往尺寸较小,难以被工整的贴合于待测介质上,并且粘接的谐振导带也不便于重复利用;为此,本申请提出,谐振导带可以为印制在薄片上的金属导带,PCB薄片上的金属导带压紧贴设于待测介质上,使其可重复使用,进一步降低成本。Specifically, the metal conduction band in this application can be a metal layer made by PCB technology; the resonance conduction band is often small in size, and it is difficult to be neatly attached to the medium to be measured, and the resonant conduction band is bonded It is not easy to reuse; therefore, the present application proposes that the resonant conduction band can be a metal conduction tape printed on a sheet, and the metal conduction tape on the PCB sheet is pressed against the medium to be tested to make it reusable , To further reduce costs.
在一个具体的实施例中,微带接地层可以为金属箔。In a specific embodiment, the microstrip ground layer may be a metal foil.
具体而言,金属箔可以是带有粘性的金属箔,例如铜箔、铝箔。在一个具体的示例中,金属箔可以为铜箔。Specifically, the metal foil may be a metal foil with adhesion, such as copper foil and aluminum foil. In a specific example, the metal foil may be copper foil.
进一步的,本申请可以采用相应的厚度测量装置测量待测介质的基片厚度(也即实测基片厚度);处理器在获取到实测谐振频率以及待测介质的实测基片厚度时,可以采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;其中,预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。Further, this application can use a corresponding thickness measuring device to measure the thickness of the substrate of the medium to be measured (that is, the thickness of the measured substrate); when the processor obtains the measured resonant frequency and the measured thickness of the substrate of the medium to be measured, it can use The preset correspondence relationship processes the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium; among them, the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to the resonance frequency and the thickness of the substrate The relationship of change.
例如,处理器可以采用三维电磁仿真模型或理论公式得出表征相对介电常数、谐振频率与待测介质厚度(即基片厚度)的关系的数据表格,进而基于实测谐振频率以及实测基片厚度,通过查表的方式得到待测介质的相对介电常数测量值。For example, the processor can use a three-dimensional electromagnetic simulation model or theoretical formula to obtain a data table that characterizes the relationship between the relative permittivity, resonance frequency, and the thickness of the medium to be measured (ie, the thickness of the substrate), and then based on the measured resonance frequency and the measured substrate thickness , Obtain the measured value of the relative permittivity of the medium to be measured by looking up the table.
又如,处理器可以采用通过数据拟合形成具有明确表达式的拟合公式,然后,将实际测得的待测介质的谐振频率和基片厚度代入该拟合公式,求得待测介质的相对介电常数(即相对介电常数测量值)。For another example, the processor can use data fitting to form a fitting formula with a clear expression, and then substitute the actually measured resonance frequency and substrate thickness of the medium to be measured into the fitting formula to obtain the value of the medium to be measured. Relative permittivity (ie, the measured value of the relative permittivity).
下面结合一个具体的实例予以说明,如图7所示,本申请相对介电常数测试***,可以应用于GB/T 12636-90微波介质基片复相对介电常数带状线测试方 法,测试所需工具可以包括:0.1~4GHz两端口矢量网络分析仪1台、近场探头、谐振导带(环),测试工装等;The following is an explanation with a specific example. As shown in Figure 7, the relative permittivity test system of this application can be applied to the GB/T 12636-90 microwave dielectric substrate complex relative permittivity stripline test method. The required tools can include: 1 set of 0.1~4GHz two-port vector network analyzer, near-field probe, resonant conduction band (ring), test tooling, etc.;
测试要求可以包括:①测试频率范围:f=0.1~4GHz;②测试基材厚度:h=1~40mm;③测试相对介电常数范围:ε 0=1~25;④测试环境:温度20-30℃,相对湿度45%-75%。具体而言,针对上述测试频率范围,可以采用100MHz~2GHz。在一个示例中,测试基材厚度至少为40mm;在另一个示例中,测试基材厚度可以为30mm。 Test requirements can include: ①Test frequency range: f=0.1~4GHz; ②Test substrate thickness: h=1~40mm; ③Test relative permittivity range: ε 0 =1~25; ④Test environment: temperature 20- 30℃, relative humidity 45%-75%. Specifically, for the above-mentioned test frequency range, 100 MHz to 2 GHz can be used. In one example, the thickness of the test substrate is at least 40 mm; in another example, the thickness of the test substrate may be 30 mm.
如图7所示,具体测试步骤可以包括:As shown in Figure 7, the specific test steps can include:
1)一段两端开路的微带传输线具有谐振电路的特性,如图7所示在待测介质基片A面贴铜箔,构成微带线的接地面(即微带接地层),在待测介质基片B面贴谐振导带(可以用铜箔);该谐振导带为环形导带,长度可以为工作频段的λ g1) A section of microstrip transmission line with open ends has the characteristics of a resonant circuit. As shown in Figure 7, copper foil is attached to the A side of the dielectric substrate to be tested to form the ground plane of the microstrip line (that is, the microstrip grounding layer). The resonant conduction band (copper foil can be used) is attached to the B surface of the measuring dielectric substrate; the resonant conduction band is a ring-shaped conduction band, and the length can be λ g of the working frequency band.
2)采用探针靠近介质基片B面的谐振导带,测量出该段传输线的谐振频率点。2) Use the probe to approach the resonant conduction band of the B surface of the dielectric substrate to measure the resonant frequency point of this section of the transmission line.
3)在实测得出谐振频率后,可以通过查阅表格或通过拟合公式得出相对介电常数。3) After the resonant frequency is obtained by actual measurement, the relative permittivity can be obtained by looking up the table or by the fitting formula.
本申请采用谐振法,在待测介质的基片下表面粘接微带线的接地面(即微带接地层),在基片上表面设置谐振导带(例如,环形导带),采用测量设备靠近介质基片上表面的谐振导带,测量出该段传输线的谐振频率,进而基于预设对应关系和谐振导带长的厚度,得到待测介质的相对介电常数;本申请通过在待测介质上分别设置微带接地层和谐振导带,并且微带接地层通过粘接的方式与待测介质相连,可以在不破坏待测介质的前提下,利用谐振法实现待测介质的相对介电常数的测试,粘接的方式可以保证贴合良好,并且避免空气间隙的影响,测试结果准确,方法简易,能降低测试成本;可以用于测量天线外罩(厚度40mm以内)的相对介电常数,具有显著工程实用性。In this application, the resonance method is adopted. The ground plane of the microstrip line (ie, the microstrip grounding layer) is bonded on the lower surface of the substrate of the medium to be measured, and a resonant conduction band (for example, an annular conduction band) is set on the upper surface of the substrate, and a measuring device is used. Close to the resonant conduction band on the upper surface of the dielectric substrate, measure the resonant frequency of the transmission line, and then obtain the relative permittivity of the medium to be measured based on the preset correspondence and the thickness of the resonant conduction band; The microstrip grounding layer and the resonant conduction band are respectively set on the top, and the microstrip grounding layer is connected to the medium to be measured by bonding. The resonance method can be used to realize the relative dielectric of the medium to be measured without damaging the medium to be measured. Constant testing and bonding methods can ensure a good fit and avoid the influence of air gaps. The test results are accurate, the method is simple, and the test cost can be reduced; it can be used to measure the relative dielectric constant of the antenna cover (within a thickness of 40mm), It has significant engineering practicability.
以上,本申请采用条状或环形的谐振导带,另一方面,通过粘接方式实现无损测试;本申请通过采用粘接方式,不仅可以避免空气间隙的影响,进一步提升测试结果的准确性,还具有更好的工程实用性。Above, this application adopts a strip or ring-shaped resonant conduction band. On the other hand, non-destructive testing is achieved through bonding; this application not only avoids the influence of air gaps, but also further improves the accuracy of the test results. It also has better engineering practicability.
具体地,本申请相对介电常数测试***,适用于美化天线外罩的相对介电常数测试;本申请采用谐振法,在待测介质基片A面贴铜箔构成微带线的接地面,在基片B面贴条形或环形谐振导带(可以用铜箔),采用探针靠近介质基片B面的谐振导带,测量出该段传输线的谐振频率点,再计算得出相对介电常数。本申请可以用于测量厚度40mm以内材料的相对介电常数(如塑料、发泡材料、等等),方法简易且无需破坏被测材料,能降低测试成本,并具有显著的工程实用性。Specifically, the relative permittivity test system of the present application is suitable for the relative permittivity test of beautifying the antenna cover; the present application adopts the resonance method to paste copper foil on the A side of the dielectric substrate to be tested to form the ground plane of the microstrip line. Stick a strip or ring resonant conduction band on the B side of the substrate (copper foil can be used), use a probe close to the resonant conduction band on the B side of the dielectric substrate, measure the resonant frequency point of the transmission line, and then calculate the relative dielectric constant. This application can be used to measure the relative permittivity of materials with a thickness of less than 40mm (such as plastics, foamed materials, etc.). The method is simple and does not need to destroy the tested material, can reduce the test cost, and has significant engineering practicability.
本领域技术人员可以理解,图1-图3、图5-图7中示出的结构,仅仅是与本申请方案相关的部分结构的框图,并不构成对本申请方案所应用于其上的结构及设备的限定,具体的结构及设备可以包括比图中所示更多或更少的部件,或者组合某些部件,或者具有不同的部件布置。Those skilled in the art can understand that the structures shown in FIGS. 1 to 3 and 5 to 7 are only block diagrams of part of the structure related to the solution of the present application, and do not constitute a structure to which the solution of the present application is applied. As well as the limitation of the equipment, the specific structure and equipment may include more or less components than those shown in the figure, or combine certain components, or have different component arrangements.
在一个实施例中,如图8所示,提供了一种相对介电常数测试方法,以该方法应用于图2或图6中的处理器为例进行说明,包括步骤:In one embodiment, as shown in FIG. 8, a method for testing relative permittivity is provided. The method is applied to the processor in FIG. 2 or FIG. 6 as an example for description, including the steps:
步骤S810,获取待测介质的实测谐振频率和实测基片厚度;实测谐振频率为测试设备测量谐振导带得到;其中,谐振导带设于待测介质的基片上表面,微带接地层粘接于待测介质的基片下表面;Step S810: Obtain the measured resonant frequency and measured substrate thickness of the medium to be tested; the measured resonant frequency is obtained by measuring the resonant conduction band of the test equipment; wherein the resonant conduction band is set on the upper surface of the substrate of the medium to be tested, and the microstrip grounding layer is bonded On the bottom surface of the substrate of the medium to be tested;
步骤S820,采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。Step S820: Use the preset correspondence relationship to process the measured resonance frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative permittivity of the measured medium with respect to the resonance frequency, base The relationship between the thickness of the sheet.
具体而言,处理器在获取到实测谐振频率以及待测介质的实测基片厚度时,可以采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;Specifically, when the processor obtains the measured resonant frequency and the measured substrate thickness of the measured medium, it can use the preset correspondence relationship to process the measured resonance frequency and measured substrate thickness to obtain the measured value of the relative permittivity of the measured medium ;
例如,处理器可以采用三维电磁仿真模型或理论公式得出表征相对介电常数、谐振频率与待测介质厚度(即基片厚度)的关系的数据表格,进而基于实测谐振频率以及实测基片厚度,通过查表的方式得到待测介质的相对介电常数测量值。For example, the processor can use a three-dimensional electromagnetic simulation model or theoretical formula to obtain a data table that characterizes the relationship between the relative permittivity, resonance frequency, and the thickness of the medium to be measured (ie, the thickness of the substrate), and then based on the measured resonance frequency and the measured substrate thickness , Obtain the measured value of the relative permittivity of the medium to be measured by looking up the table.
又如,处理器可以采用通过数据拟合形成具有明确表达式的拟合公式,然后,将实际测得的待测介质的谐振频率和基片厚度代入该拟合公式,求得待测 介质的相对介电常数(即相对介电常数测量值)。For another example, the processor can use data fitting to form a fitting formula with a clear expression, and then substitute the actually measured resonance frequency and substrate thickness of the medium to be measured into the fitting formula to obtain the value of the medium to be measured. Relative permittivity (ie, the measured value of the relative permittivity).
在其中一个实施例中,预设对应关系为数据表或数据拟合模型;In one of the embodiments, the preset correspondence relationship is a data table or a data fitting model;
采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值的步骤,包括:The steps of processing the measured resonant frequency and the measured substrate thickness by using the preset correspondence relationship to obtain the measured value of the relative permittivity of the medium to be measured include:
基于实测谐振频率和实测基片厚度,通过查找数据表,得到待测介质的相对介电常数测量值;Based on the measured resonant frequency and measured substrate thickness, by looking up the data table, the measured value of the relative permittivity of the medium to be measured is obtained;
或,or,
采用数据拟合模型处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值。The data fitting model is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured.
具体而言,数据表格可以是通过仿真或理论公式计算得出的密集的数据表,根据实际测得的待测介质的谐振频率(即实测谐振频率)和厚度(即实测基片厚度)从数据表中查找得出待测介质的相对介电常数(即相对介电常数测量值);Specifically, the data table can be a dense data table calculated by simulation or theoretical formulas. According to the actual measured resonant frequency (i.e. measured resonant frequency) and thickness (i.e. measured substrate thickness) of the medium to be tested, the data Find the relative permittivity of the medium to be measured (ie, the measured value of the relative permittivity) from the table;
或者,数据表格为通过数据拟合形成的具有明确表达式的拟合公式(例如,数据拟合模型),将实际测得的待测介质的谐振频率和厚度代入拟合公式,进而得到待测介质的相对介电常数。Alternatively, the data table is a fitting formula with a clear expression formed by data fitting (for example, a data fitting model), and the actually measured resonance frequency and thickness of the medium to be measured are substituted into the fitting formula to obtain the measured The relative permittivity of the medium.
在其中一个实施例中,采用数据拟合模型处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值的步骤中,基于以下公式得到相对介电常数测量值:In one of the embodiments, a data fitting model is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured, and the measured value of the relative permittivity is obtained based on the following formula:
Figure PCTCN2020140994-appb-000002
Figure PCTCN2020140994-appb-000002
其中,ε r表示相对介电常数测量值;P1~P11为常数;H表示实测基片厚度;f 0表示实测谐振频率。 Among them, ε r represents the measured value of the relative permittivity; P1 to P11 are constants; H represents the measured thickness of the substrate; f 0 represents the measured resonant frequency.
具体而言,表征相对介电常数关于谐振频率f 0与待测介质厚度H的变化关系的函数模型可以为上述数据拟合模型所示。进一步的,如表1、表2所示,为本申请中常数P1~P11可以取的数值; Specifically, the functional model that characterizes the relationship between the relative permittivity with respect to the resonant frequency f 0 and the thickness H of the medium to be measured may be shown in the above-mentioned data fitting model. Further, as shown in Table 1 and Table 2, the values that can be taken by the constants P1 to P11 in this application;
表1Table 1
符号symbol 数值Numerical value
P1P1 0.360.36
P2P2 22.3222.32
P3P3 22.7322.73
P4P4 -11.90-11.90
P5P5 467.71467.71
表2Table 2
符号symbol 数值Numerical value
P6P6 -0.27-0.27
P7P7 -0.32-0.32
P8P8 47.2047.20
P9P9 4096.174096.17
P10P10 -15.43-15.43
P11P11 445.25445.25
需要说明的是,上述数据拟合模型可以是由仿真得出的数据表格拟合而成。It should be noted that the above-mentioned data fitting model may be fitted from a data table obtained by simulation.
在其中一个实施例中,基于实测谐振频率和实测基片厚度,通过查找数据表,得到待测介质的相对介电常数测量值的步骤之前,还包括步骤:In one of the embodiments, before the step of obtaining the measured value of the relative permittivity of the medium to be measured by looking up the data table based on the measured resonant frequency and the measured substrate thickness, the method further includes the following steps:
基于待测介质的三维电磁仿真模型获取三维数据,处理三维数据,得到数据表;Obtain three-dimensional data based on the three-dimensional electromagnetic simulation model of the medium to be measured, process the three-dimensional data, and obtain a data table;
或,or,
基于待测介质的理论模型,得到数据表。Based on the theoretical model of the medium to be tested, a data table is obtained.
具体而言,通过查找数据表格或使用拟合公式的方法得出待测介质的相对介电常数的步骤,可以采用如下方式实现:基于待测介质的三维电磁仿真模型或理论公式(即理论模型),通过改变待测介质的厚度和相对介电常数以获取待测介质的谐振频率的变化,再根据获得的三维数据通过数据处理软件拟合出表征相对介电常数与谐振频率的变化及厚度的关系的函数模型;再根据实测结果,将实际测得的谐振频率与该待测介质的实际厚度带入函数模型即可得出相应的相对介电常数测量值。Specifically, the step of finding the relative permittivity of the medium to be measured by looking up a data table or using a fitting formula can be implemented in the following way: a three-dimensional electromagnetic simulation model or theoretical formula (ie theoretical model) based on the medium to be measured ), by changing the thickness and relative permittivity of the medium to be measured to obtain the change in the resonance frequency of the medium to be measured, and then use the data processing software to fit the characteristics of the change and thickness of the relative permittivity and resonance frequency according to the obtained three-dimensional data According to the actual measurement results, the actual measured resonant frequency and the actual thickness of the medium to be measured are brought into the function model to obtain the corresponding relative permittivity measurement value.
在其中一个实施例中,在测得谐振频率后,还可以基于理论公式得出数据表格,得出相对介电常数;In one of the embodiments, after the resonance frequency is measured, a data table can be obtained based on the theoretical formula to obtain the relative permittivity;
具体的,可以通过以下公式计算出等效介电常数ε reSpecifically, the equivalent dielectric constant ε re can be calculated by the following formula:
Figure PCTCN2020140994-appb-000003
Figure PCTCN2020140994-appb-000003
式中:c——光速,2.998×10 11mm/s; In the formula: c——speed of light, 2.998×10 11 mm/s;
n——谐振时延谐振导带分布的驻波半波长个数;n——the number of standing wave half-wavelengths of the resonant conduction band distribution of the resonant time delay;
f n——第n号模式的谐振频率,Hz; f n ——the resonance frequency of the nth mode, Hz;
L——谐振导带长度,mm;L——length of resonant conduction band, mm;
ΔL g——考虑到谐振导带两端口边缘场效应产生的谐振导带的有效增长量;其中,关于ΔL g的取值,当谐振导带为环形导带时,ΔL g的取值可以为0。 ΔL g ——Considering the effective increase of the resonant conduction band caused by the fringe field effect at the two ports of the resonant conduction band; among them, regarding the value of ΔL g , when the resonant conduction band is a ring-shaped conduction band, the value of ΔL g can be 0.
进一步的,可以基于以下公式,得到ΔL g Furthermore, ΔL g can be obtained based on the following formula:
Figure PCTCN2020140994-appb-000004
Figure PCTCN2020140994-appb-000004
其中:in:
Figure PCTCN2020140994-appb-000005
Figure PCTCN2020140994-appb-000005
Figure PCTCN2020140994-appb-000006
Figure PCTCN2020140994-appb-000006
Figure PCTCN2020140994-appb-000007
Figure PCTCN2020140994-appb-000007
ζ 4=1+0.0377tan -1[0.067(w/h) 456]×[6-5exp(0.036(1-ε re))] ζ 4 =1+0.0377tan -1 [0.067(w/h) 456 ]×[6-5exp(0.036(1-ε re ))]
ζ 5=1-0.218exp(-7.5w/h) ζ 5 = 1-0.218exp(-7.5w/h)
其中,ε re表示等效介电常数的精度;h表示待测介质的基片厚度;w表示谐振导带的宽度; Among them, ε re represents the accuracy of the equivalent dielectric constant; h represents the thickness of the substrate of the medium to be measured; w represents the width of the resonant conduction band;
根据微带电路理论,等效介电常数ε re和相对介电常数ε r可以满足如下公式: According to the theory of microstrip circuits, the equivalent permittivity ε re and relative permittivity ε r can satisfy the following formula:
Figure PCTCN2020140994-appb-000008
Figure PCTCN2020140994-appb-000008
进而得到相对介电常数ε r为: Then the relative permittivity ε r is obtained as:
Figure PCTCN2020140994-appb-000009
Figure PCTCN2020140994-appb-000009
其中,
Figure PCTCN2020140994-appb-000010
代表介质板材的填充系数,h表示待测介质的基片厚度;w表示谐振导带的宽度。
in,
Figure PCTCN2020140994-appb-000010
Represents the filling factor of the dielectric sheet, h represents the thickness of the substrate of the medium to be tested; w represents the width of the resonant conduction band.
需要说明的是,本申请相对介电常数测试方法,可以应用于前文中相对介电常数测试***中,具体的测试流程、参数取值及实现方式等,均可参阅前文中相对介电常数测试***中各实施例的描述,此处不再赘述。It should be noted that the relative permittivity test method of this application can be applied to the relative permittivity test system mentioned above. For specific test procedures, parameter values and implementation methods, please refer to the relative permittivity test above The description of each embodiment in the system will not be repeated here.
上述相对介电常数测试方法,基于前述相对介电常数测试***的结构,采用谐振法,在待测介质的基片下表面粘接微带线的接地面(即微带接地层),在基片上表面设置谐振导带(例如,环形导带),采用测量设备靠近介质基片上表面的谐振导带,测量出该段传输线的谐振频率,进而基于预设对应关系和谐振导带长的厚度,得到待测介质的相对介电常数。The above-mentioned relative permittivity test method, based on the structure of the aforementioned relative permittivity test system, adopts the resonance method to bond the ground plane of the microstrip line (ie, the microstrip grounding layer) on the lower surface of the substrate of the medium to be tested. A resonant conduction band (for example, a ring-shaped conduction band) is set on the upper surface of the chip, and the resonant conduction band near the upper surface of the dielectric substrate is used to measure the resonant frequency of the transmission line, and then based on the preset correspondence and the thickness of the resonant conduction band, Get the relative permittivity of the medium to be measured.
本申请通过在待测介质上分别设置微带接地层和谐振导带,并且微带接地层通过粘接的方式与待测介质相连,可以在不破坏待测介质的前提下,利用谐振法实现待测介质的相对介电常数的测试,粘接的方式可以保证贴合良好,并且避免空气间隙的影响,测试结果准确,方法简易,能降低测试成本;可以用于测量天线外罩(厚度40mm以内)的相对介电常数,具有显著工程实用性。In this application, a microstrip grounding layer and a resonant conduction band are separately provided on the medium to be tested, and the microstrip grounding layer is connected to the medium to be tested by bonding, which can be realized by using the resonance method without damaging the medium to be tested. The relative permittivity test of the medium to be tested, the bonding method can ensure a good fit, and avoid the influence of air gaps, the test results are accurate, the method is simple, and the test cost can be reduced; it can be used to measure the antenna cover (within 40mm thickness) ) Relative permittivity, which has significant engineering practicability.
应该理解的是,虽然图8的流程图中的各个步骤按照箭头的指示依次显示,但是这些步骤并不是必然按照箭头指示的顺序依次执行。除非本文中有明确的说明,这些步骤的执行并没有严格的顺序限制,这些步骤可以以其它的顺序执行。而且,图8中的至少一部分步骤可以包括多个子步骤或者多个阶段,这些子步骤或者阶段并不必然是在同一时刻执行完成,而是可以在不同的时刻执行,这些子步骤或者阶段的执行顺序也不必然是依次进行,而是可以与其它步骤或者其它步骤的子步骤或者阶段的至少一部分轮流或者交替地执行。It should be understood that although the various steps in the flowchart of FIG. 8 are displayed in sequence as indicated by the arrows, these steps are not necessarily performed in sequence in the order indicated by the arrows. Unless specifically stated in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least part of the steps in FIG. 8 may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution of these sub-steps or stages The sequence is not necessarily performed sequentially, but may be performed alternately or alternately with at least a part of other steps or sub-steps or stages of other steps.
在一个实施例中,如图9所示,提供了一种相对介电常数测试装置,包括:In one embodiment, as shown in FIG. 9, a relative permittivity test device is provided, including:
数据获取模块910,用于获取待测介质的实测谐振频率和实测基片厚度;实测谐振频率为测试设备测量谐振导带测量得到;其中,谐振导带设于待测介质的基片上表面,微带接地层粘接于待测介质的基片下表面;The data acquisition module 910 is used to acquire the measured resonant frequency and the measured substrate thickness of the medium to be measured; the measured resonant frequency is obtained by the measurement of the resonant conduction band measured by the test equipment; wherein the resonant conduction band is set on the upper surface of the substrate of the medium to be measured, and the The ground layer is bonded to the bottom surface of the substrate of the medium to be tested;
数据处理模块920,用于采用预设对应关系处理实测谐振频率和实测基片厚度,得到待测介质的相对介电常数测量值;预设对应关系用于表征待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The data processing module 920 is used to process the measured resonance frequency and the measured substrate thickness by using a preset correspondence relationship to obtain the measured value of the relative permittivity of the medium to be measured; the preset correspondence relationship is used to characterize the relative permittivity of the measured medium The relationship between the resonance frequency and the thickness of the substrate.
关于相对介电常数测试装置的具体限定可以参见上文中对于相对介电常数测试方法的限定,在此不再赘述。上述相对介电常数测试装置中的各个模块可全部或部分通过软件、硬件及其组合来实现。上述各模块可以硬件形式内嵌于或独立于计算机设备中的处理器中,也可以以软件形式存储于计算机设备中的存储器中,以便于处理器调用执行以上各个模块对应的操作。For the specific definition of the relative permittivity test device, please refer to the above definition of the relative permittivity test method, which will not be repeated here. Each module in the above-mentioned relative permittivity test device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules may be embedded in the form of hardware or independent of the processor in the computer equipment, or may be stored in the memory of the computer equipment in the form of software, so that the processor can call and execute the operations corresponding to the above-mentioned modules.
在一个实施例中,提供了一种计算机可读存储介质,其上存储有计算机程序,计算机程序被处理器执行时实现前述任一项方法的步骤。In one embodiment, a computer-readable storage medium is provided, and a computer program is stored thereon, and the computer program implements the steps of any one of the foregoing methods when the computer program is executed by a processor.
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程,是可以通过计算机程序来指令相关的硬件来完成,所述的计算机程序可存储于一非易失性计算机可读取存储介质中,该计算机程序在执行时,可包括如上述各方法的实施例的流程。其中,本申请所提供的各实施例中所使用的对存储器、存储、数据库或其它介质的任何引用,均可包括非易失性和/或易失性存储器。非易失性存储器可包括只读存储器(ROM)、可编程ROM(PROM)、电可编程ROM(EPROM)、电可擦除可编程ROM(EEPROM)或闪存。易失性存储器可包括随机存取存储器(RAM)或者外部高速缓冲存储器。作为说明而非局限,RAM以多种形式可得,诸如静态RAM(SRAM)、动态RAM(DRAM)、同步DRAM(SDRAM)、双数据率SDRAM(DDRSDRAM)、增强型SDRAM(ESDRAM)、同步链路(Synchlink)DRAM(SLDRAM)、存储器总线式动态随机存储器(Rambus DRAM,简称RDRAM)、以及接口动态随机存储器(DRDRAM)等。A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage. In the medium, when the computer program is executed, it may include the processes of the above-mentioned method embodiments. Wherein, any reference to memory, storage, database, or other media used in the embodiments provided in this application may include non-volatile and/or volatile memory. Non-volatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not a limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous chain Channel (Synchlink) DRAM (SLDRAM), memory bus type dynamic random access memory (Rambus DRAM, RDRAM for short), and interface dynamic random access memory (DRDRAM), etc.

Claims (16)

  1. 一种相对介电常数测试***,其特征在于,包括粘接于待测介质的基片下表面的微带接地层,以及设于所述待测介质的基片上表面的谐振导带;A relative permittivity test system, which is characterized by comprising a microstrip ground layer adhered to the lower surface of the substrate of the medium to be tested, and a resonant conduction band provided on the upper surface of the substrate of the medium to be tested;
    还包括:Also includes:
    测试设备;所述测试设备测量所述谐振导带的实测谐振频率;Test equipment; the test equipment measures the measured resonant frequency of the resonant conduction band;
    连接所述测试设备的处理器;所述处理器获取所述实测谐振频率以及所述待测介质的实测基片厚度,并采用预设对应关系处理所述实测谐振频率和所述实测基片厚度,得到所述待测介质的相对介电常数测量值;所述预设对应关系用于表征所述待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。A processor connected to the test device; the processor obtains the measured resonant frequency and the measured substrate thickness of the medium to be tested, and uses a preset correspondence relationship to process the measured resonant frequency and the measured substrate thickness , The measured value of the relative permittivity of the medium to be measured is obtained; the preset corresponding relationship is used to characterize the change relationship of the relative permittivity of the medium to be measured with respect to the resonance frequency and the thickness of the substrate.
  2. 根据权利要求1所述的相对介电常数测试***,其特征在于,所述谐振导带为粘接在所述基片上表面的条状导带或环形导带。The relative permittivity test system according to claim 1, wherein the resonant conduction band is a strip conduction band or an annular conduction band adhered to the upper surface of the substrate.
  3. 根据权利要求2所述的相对介电常数测试***,其特征在于,所述谐振导带的长度为λ g;其中,所述λ g为工作频段微带线上的波长;所述工作频段为测试时所用频段。 The relative dielectric constant of the test system as claimed in claim 2, wherein said resonant length λ g for the conduction band; wherein λ g is the wavelength of the operating frequency of the microstrip line; the working frequency band The frequency band used during the test.
  4. 根据权利要求2所述的相对介电常数测试***,其特征在于,所述谐振导带的长度为λ g/2,所述谐振导带的宽度为1~5mm;其中,所述λ g为工作频段微带线上的波长;所述工作频段为测试时所用频段。 The relative permittivity test system according to claim 2, wherein the length of the resonant conduction band is λ g /2, and the width of the resonant conduction band is 1 to 5 mm; wherein, the λ g is The working frequency band is the wavelength on the microstrip line; the working frequency band is the frequency band used during the test.
  5. 根据权利要求1至4任一项所述的相对介电常数测试***,其特征在于,所述谐振导带为金属箔。The relative permittivity test system according to any one of claims 1 to 4, wherein the resonant conduction band is a metal foil.
  6. 根据权利要求1至4任一项所述的相对介电常数测试***,其特征在于,所述谐振导带为印制在PCB薄片上的金属导带;所述金属导带贴设于所述基片上表面。The relative permittivity test system according to any one of claims 1 to 4, wherein the resonant conduction band is a metal conduction band printed on a PCB sheet; the metal conduction band is attached to the The upper surface of the substrate.
  7. 根据权利要求1所述的相对介电常数测试***,其特征在于,所述微带接地层为金属箔。The relative permittivity test system according to claim 1, wherein the microstrip grounding layer is a metal foil.
  8. 根据权利要求1所述的相对介电常数测试***,其特征在于,所述待测介质的材质为塑料或发泡材料。The relative permittivity test system according to claim 1, wherein the material of the medium to be tested is plastic or foamed material.
  9. 根据权利要求1所述的相对介电常数测试***,其特征在于,所述待测介 质为天线外罩;所述测试设备为矢量网络分析仪;The relative permittivity test system according to claim 1, wherein the medium to be tested is an antenna cover; and the test equipment is a vector network analyzer;
    所述矢量网络分析仪与同轴连接器或探针相连,并通过所述同轴连接器或所述探针靠近所述谐振导带,测量所述谐振导带的所述实测谐振频率。The vector network analyzer is connected to a coaxial connector or a probe, and approaches the resonant conduction band through the coaxial connector or the probe to measure the measured resonant frequency of the resonant conduction band.
  10. 一种相对介电常数测试方法,其特征在于,A method for measuring relative permittivity, which is characterized in that:
    获取待测介质的实测谐振频率和实测基片厚度;所述实测谐振频率为测试设备测量谐振导带测量得到;其中,所述谐振导带设于待测介质的基片上表面,微带接地层粘接于所述待测介质的基片下表面;Obtain the measured resonant frequency and measured substrate thickness of the medium to be tested; the measured resonant frequency is obtained by measuring the resonant conduction band of the test equipment; wherein the resonant conduction band is set on the upper surface of the substrate of the medium to be measured, and the microstrip grounding layer Bonded to the lower surface of the substrate of the medium to be tested;
    采用预设对应关系处理所述实测谐振频率和所述实测基片厚度,得到所述待测介质的相对介电常数测量值;所述预设对应关系用于表征所述待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The measured resonant frequency and the measured substrate thickness are processed with a preset correspondence relationship to obtain the measured value of the relative permittivity of the measured medium; the preset correspondence is used to characterize the relative dielectric constant of the measured medium The relationship of the electrical constant with respect to the resonance frequency and the thickness of the substrate.
  11. 根据权利要求10所述的相对介电常数测试方法,其特征在于,所述预设对应关系为数据表或数据拟合模型;The method for testing relative permittivity according to claim 10, wherein the preset correspondence relationship is a data table or a data fitting model;
    采用预设对应关系处理所述实测谐振频率和所述实测基片厚度,得到所述待测介质的相对介电常数测量值的步骤,包括:The step of processing the measured resonant frequency and the measured substrate thickness by using a preset correspondence relationship to obtain the measured value of the relative permittivity of the medium to be measured includes:
    基于所述实测谐振频率和所述实测基片厚度,通过查找所述数据表,得到所述待测介质的相对介电常数测量值;Based on the measured resonant frequency and the measured substrate thickness, by looking up the data table, the measured value of the relative permittivity of the medium to be measured is obtained;
    或,or,
    采用所述数据拟合模型处理所述实测谐振频率和所述实测基片厚度,得到所述待测介质的相对介电常数测量值。The data fitting model is used to process the measured resonant frequency and the measured substrate thickness to obtain the measured value of the relative permittivity of the medium to be measured.
  12. 根据权利要求11所述的相对介电常数测试方法,其特征在于,采用所述数据拟合模型处理所述实测谐振频率和所述实测基片厚度,得到所述待测介质的相对介电常数测量值的步骤中,基于以下公式得到所述相对介电常数测量值:The relative permittivity test method according to claim 11, wherein the data fitting model is used to process the measured resonant frequency and the measured substrate thickness to obtain the relative permittivity of the medium to be measured In the step of measuring the value, the measured value of the relative permittivity is obtained based on the following formula:
    Figure PCTCN2020140994-appb-100001
    Figure PCTCN2020140994-appb-100001
    其中,ε r表示所述相对介电常数测量值;P1~P11为常数;H表示所述实测基片厚度;f 0表示所述实测谐振频率。 Where, ε r represents the measured value of the relative permittivity; P1 to P11 are constants; H represents the measured substrate thickness; f 0 represents the measured resonance frequency.
  13. 根据权利要求11所述的相对介电常数测试方法,其特征在于,基于所述 实测谐振频率和所述实测基片厚度,通过查找所述数据表,得到所述待测介质的相对介电常数测量值的步骤之前,还包括步骤:The relative permittivity test method according to claim 11, wherein based on the measured resonant frequency and the measured substrate thickness, the relative permittivity of the medium to be measured is obtained by looking up the data table Before measuring the value, it also includes the following steps:
    基于所述待测介质的三维电磁仿真模型获取三维数据,处理所述三维数据,得到所述数据表;Acquiring three-dimensional data based on the three-dimensional electromagnetic simulation model of the medium to be measured, and processing the three-dimensional data to obtain the data table;
    或,or,
    基于所述待测介质的理论模型,得到所述数据表。Based on the theoretical model of the medium to be tested, the data table is obtained.
  14. 根据权利要求13所述的相对介电常数测试方法,其特征在于,基于所述待测介质的理论模型,得到所述数据表的步骤中:The method for measuring relative permittivity according to claim 13, wherein in the step of obtaining the data table based on the theoretical model of the medium to be measured:
    基于以下公式,获取等效介电常数:Based on the following formula, obtain the equivalent dielectric constant:
    Figure PCTCN2020140994-appb-100002
    Figure PCTCN2020140994-appb-100002
    其中,ε re表示所述等效介电常数;c表示光速;n表示谐振时延谐振导带分布的驻波半波长个数;f n表示第n号模式的谐振频率;L表示谐振导带长度;ΔL g表示考虑到谐振导带两端口边缘场效应产生的谐振导带的有效增长量; Among them, ε re represents the equivalent dielectric constant; c represents the speed of light; n represents the number of standing wave half-wavelengths of the resonance time-delayed resonance conduction band distribution; f n represents the resonance frequency of the nth mode; L represents the resonance conduction band Length; ΔL g represents the effective increase of the resonant conduction band due to the fringe field effect of the two ports of the resonant conduction band;
    基于以下公式,得到所述ΔL gBased on the following formula, the ΔL g is obtained:
    Figure PCTCN2020140994-appb-100003
    Figure PCTCN2020140994-appb-100003
    其中:in:
    Figure PCTCN2020140994-appb-100004
    Figure PCTCN2020140994-appb-100004
    Figure PCTCN2020140994-appb-100005
    Figure PCTCN2020140994-appb-100005
    Figure PCTCN2020140994-appb-100006
    Figure PCTCN2020140994-appb-100006
    ξ 4=1+0.0377tan -1[0.067(w/h) 456]×[6-5exp(0.036(1-ε re))] ξ 4 =1+0.0377tan -1 [0.067(w/h) 456 ]×[6-5exp(0.036(1-ε re ))]
    ξ 5=1-0.218exp(-7.5w/h) ξ 5 =1-0.218exp(-7.5w/h)
    ε re表示等效介电常数;h表示所述待测介质的基片厚度;w表示谐振导带的 宽度; ε re represents the equivalent dielectric constant; h represents the thickness of the substrate of the medium to be tested; w represents the width of the resonant conduction band;
    基于以下公式对等效介电常数ε re进行转换,得到所述待测介质的相对介电常数ε r The equivalent permittivity ε re is converted based on the following formula to obtain the relative permittivity ε r of the medium to be measured:
    Figure PCTCN2020140994-appb-100007
    Figure PCTCN2020140994-appb-100007
    其中,
    Figure PCTCN2020140994-appb-100008
    q表示待测介质的填充系数,h表示待测介质的基片厚度;w表示谐振导带的宽度。
    in,
    Figure PCTCN2020140994-appb-100008
    q represents the filling factor of the measured medium, h represents the thickness of the substrate of the measured medium; w represents the width of the resonant conduction band.
  15. 一种相对介电常数测试装置,其特征在于,包括:A relative permittivity test device, which is characterized in that it comprises:
    数据获取模块,用于获取待测介质的实测谐振频率和实测基片厚度;所述实测谐振频率为测试设备测量谐振导带测量得到;其中,所述谐振导带设于待测介质的基片上表面,微带接地层粘接于所述待测介质的基片下表面;The data acquisition module is used to acquire the measured resonant frequency and the measured substrate thickness of the medium to be measured; the measured resonant frequency is obtained by the measurement of the resonant conduction band measured by the test equipment; wherein the resonant conduction band is set on the substrate of the medium to be measured On the surface, the microstrip grounding layer is adhered to the lower surface of the substrate of the medium to be tested;
    数据处理模块,用于采用预设对应关系处理所述实测谐振频率和所述实测基片厚度,得到所述待测介质的相对介电常数测量值;所述预设对应关系用于表征所述待测介质的相对介电常数关于谐振频率、基片厚度的变化关系。The data processing module is used to process the measured resonant frequency and the measured substrate thickness using a preset correspondence relationship to obtain the measured value of the relative permittivity of the medium to be measured; the preset correspondence relationship is used to characterize the The relationship between the relative permittivity of the measured medium and the resonant frequency and the thickness of the substrate.
  16. 一种计算机可读存储介质,其上存储有计算机程序,其特征在于,所述计算机程序被处理器执行时实现权利要求10至14中任一项所述的方法的步骤。A computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the steps of the method according to any one of claims 10 to 14 when the computer program is executed by a processor.
PCT/CN2020/140994 2020-04-24 2020-12-29 Relative dielectric constant test system, method, and apparatus, and storage medium WO2021212909A1 (en)

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CN114034740A (en) * 2021-11-05 2022-02-11 武汉理工大学 Method and system for detecting moisture content of base-layer fresh mixed material based on dielectric property
RU2787650C1 (en) * 2022-02-04 2023-01-11 Акционерное общество "Обнинское научно-производственное предприятие "Технология" им. А.Г.Ромашина" Method for determining the relative permittivity of materials with losses
CN117471182A (en) * 2023-12-21 2024-01-30 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) System, method and storage medium for testing dielectric property of circuit board
CN117471182B (en) * 2023-12-21 2024-04-02 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) System, method and storage medium for testing dielectric property of circuit board

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