WO2021210518A1 - Thermal diffusion joining device - Google Patents

Thermal diffusion joining device Download PDF

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Publication number
WO2021210518A1
WO2021210518A1 PCT/JP2021/015098 JP2021015098W WO2021210518A1 WO 2021210518 A1 WO2021210518 A1 WO 2021210518A1 JP 2021015098 W JP2021015098 W JP 2021015098W WO 2021210518 A1 WO2021210518 A1 WO 2021210518A1
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Prior art keywords
joined
members
temperature information
heat diffusion
heating means
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PCT/JP2021/015098
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French (fr)
Japanese (ja)
Inventor
水野芳伸
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Ｅｃｏ－Ａ株式会社
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Priority to JP2022515361A priority Critical patent/JPWO2021210518A1/ja
Publication of WO2021210518A1 publication Critical patent/WO2021210518A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating

Definitions

  • the present invention relates to a heat diffusion joining device for joining members to be joined.
  • a heat diffusion joining method in which a predetermined pressure is applied to the joining surfaces of the members to be joined and the members are heated to a predetermined temperature for joining.
  • a direct energization heating method is used for the heating / diffusion joining device used in this method (for example, Patent Document 1).
  • the direct energization heating method has a feature that precise temperature control is easy.
  • an object of the present invention is to provide a heat diffusion bonding apparatus capable of quickly and accurately controlling the temperature of a member to be bonded even if the bonding area is large, and capable of bonding without variation in bonding strength.
  • the heat diffusion joining device of the present invention is a heat diffusion joining device that heats and joins a plurality of members to be joined with which the joining surfaces are abutted, and joins the plurality of members to be joined.
  • the energization heating means includes a plurality of electrodes for conducting electricity to the plurality of members to be joined, and a power source capable of continuously changing the output applied to the plurality of electrodes. There may be.
  • a temperature information providing unit that provides temperature information of the plurality of members to be joined or the plurality of electrodes.
  • control unit that controls the high frequency induction heating means and the energization heating means may be provided based on the temperature information from the temperature information providing unit.
  • control unit may control the output of the power supply with an upslope based on the temperature information from the temperature information providing unit.
  • the temperature information providing unit may be a temperature sensor that detects temperature information of the plurality of members to be joined or the plurality of electrodes.
  • the temperature information providing unit may be a temperature information storage unit in which temperature information of the plurality of members to be joined or the plurality of electrodes is stored.
  • a voltage drop detecting means capable of supplying a constant current to the plurality of members to be joined and detecting the voltage drop on the joint surface may be provided.
  • control unit may control the output of the power supply based on the voltage drop detected by the voltage drop detecting means.
  • the peripheral part including the joint part is preheated by high frequency induction heating, and then the peripheral part is switched to energization heating. Can be joined with little variation.
  • the heat diffusion bonding device 10 of the present invention will be described with reference to FIG.
  • the heat diffusion joining device 10 of the present invention heats and joins a plurality of members 1 to be joined which are in contact with the joining surface S, and is mainly composed of a high frequency induction heating means and an energization heating means. ..
  • the member 1 to be joined is a member to be joined on the joint surface S, and any material, shape, etc. may be used as long as induction heating is possible.
  • the material include steel materials such as stainless steel, non-ferrous metals such as copper, aluminum and zinc, and various alloys containing aluminum, nickel, chromium, titanium, copper and the like.
  • the member 1 to be joined may be made of the same material or a different material.
  • examples of the shape include a pipe shape, a bulk shape, a thick plate shape, and a thin plate shape, and any processing such as grooving and drilling may be performed.
  • the joint surface S may be a flat surface or a curved surface. Further, the joint surface S is preferably a mirror surface, but may be a rough surface.
  • the high-frequency induction heating means is for heating a plurality of members 1 to be joined by high-frequency induction, and includes a heating coil 2 and a high-frequency power supply 3.
  • the heating coil 2 is for generating a magnetic field around a member 1 to be joined arranged in the heating coil 2 by an alternating current flowing through the heating coil 2. By inducing an eddy current in the member 1 to be joined by this magnetic field, it is possible to generate precise local heat in the member 1 to be joined without physical contact between the heating coil 2 and the member 1 to be joined. can.
  • the heating coil 2 may be any coil as long as it can generate heat in the member 1 to be joined, and for example, a known induction heating coil can be used.
  • the high frequency power supply 3 is an AC power supply for outputting electric power to the heating coil 2.
  • the high-frequency power supply 3 may be any one as long as the output applied to the heating coil 2 can be continuously changed, and for example, a known high-frequency inverter power supply can be used.
  • the energizing heating means is for heating a plurality of members 1 to be joined by conducting electricity. Any means may be used as long as electricity can be conducted and heated.
  • a plurality of electrodes 9 for conducting electricity to a plurality of members 1 to be joined and outputs given to the plurality of electrodes 9 can be continuously changed. It may be configured with a power supply 4.
  • the induction heating diffusion joining device 10 of the present invention may include a temperature information providing unit 5.
  • the temperature information providing unit 5 is for providing temperature information of a plurality of members 1 to be joined or a plurality of electrodes 9 to the display unit 62 and the control unit 6 described later.
  • the temperature information means information about the temperature of the member 1 to be joined, and may be the information as it is.
  • the voltage of the high frequency power source 3 of the high frequency induction heating means and the power source 4 of the energization heating means is determined. It may be information converted from temperature by calculation, such as a voltage value.
  • a temperature sensor that detects the temperature of the member 1 to be joined can be used.
  • the temperature sensor may be any one as long as it can detect the temperature of the member 1 to be joined.
  • a non-contact sensor that detects the temperature in a non-contact manner such as an infrared radiation thermometer, or a plurality of members 1 to be joined.
  • a contact sensor such as a thermometer that detects the temperature by contacting the plurality of electrodes 9 may be used. It is also possible to use both a non-contact type and a contact type.
  • control unit 6 for controlling the high frequency induction heating means and the energization heating means may be provided based on the temperature information from the temperature information providing unit 5.
  • the control unit 6 controls the output of the high-frequency power source 3 of the high-frequency induction heating means based on the temperature information from the temperature information providing unit 5, and obtains the temperature information from the temperature information providing unit 5. Based on this, the output of the power source 4 of the energizing heating means is controlled by an upslope.
  • the temperature at a predetermined location may rise sharply. In this case, the bonding state of the bonding surface S becomes non-uniform, for example, the bonding state at the relevant portion becomes a liquid phase bond, which leads to variations in the bonding state.
  • preheating is performed by the high-frequency induction heating means up to a temperature close to the target temperature, and heating is performed by controlling the upslope from near the target temperature by the energizing heating means.
  • Preheating takes into consideration the temperature error of the joint surface by the high frequency induction heating means, and heats at least to a temperature lower than the target temperature by the temperature error. As a result, the joining member having a large joining area can be quickly heated.
  • heating by upslope control by controlling the output and gradually raising the temperature with high accuracy, rapid heating can be suppressed and the temperature of the joint surface S can be made uniform. Therefore, a uniform diffusion layer can be grown on the joint surface S, and the strength can be made uniform.
  • control unit 6 continuously controls the output of the power supply 4 of the energizing heating means in real time based on the temperature information detected by the temperature sensor with an upslope, enabling precise temperature control of the member 1 to be joined. can. Therefore, the joining strength of the joining members on the joining surface S is high, and it is possible to perform joining with little variation. Further, such continuous control can maintain a constant thermal expansion as compared with ON / OFF control, so that the influence of pressure fluctuation due to thermal expansion can be reduced.
  • the control unit 6 controls the output of the high frequency power supply 3 of the high frequency induction heating means based on the temperature information from the temperature information providing unit 5, and controls the output of the power supply 4 of the energization heating means with an upslope. Anything can be used as long as it can be used, but for example, a CPU, a ROM, a RAM, an I / O, or the like, and as shown in FIG. 2, the operation unit 61 and the display unit 62 are electrically connected to each other. Can be used. Specifically, a known PID temperature control device such as a high-speed sampling temperature controller can be used.
  • the operation unit 61 is composed of various operation switches such as a start switch and a start switch, an input panel including a touch panel, and the like.
  • the information input from the operation unit 61 is transmitted to the control unit 6. Further, the display unit 62 receives information from the control unit 6 based on the input to the control unit 6 or the calculation result of the control unit 6, and displays the information.
  • the display unit 62 is composed of a digital display panel, a lamp, and the like.
  • the temperature information providing unit 5 described above acquires the temperatures of the plurality of members 1 to be joined or the plurality of electrodes 9 in real time using a temperature sensor and provides the temperature information of the members 1 to be joined to the control unit 6.
  • the members 1 to be joined of the same material are joined in the same environment using the heat diffusion joining device 10 of the present invention, the relationship between the elapsed time and the temperature of the members 1 to be joined has the same result. Therefore, if the temperature information indicating the relationship between the elapsed time and the temperature of the member 1 to be joined is acquired in advance, the temperature information can be provided without using the temperature sensor.
  • the temperature information providing unit 5 may be a temperature information storage unit that stores temperature information indicating the relationship between the elapsed time of heating of the member 1 to be joined and the temperature of the member 1 to be joined.
  • the control unit 6 controls the output of the high frequency power supply 3 of the high frequency induction heating means or controls the output of the power supply 4 of the energization heating means based on the temperature information stored in the temperature information storage unit. Can be done.
  • the temperature information storage unit may be any as long as it can store temperature information for determining the relationship between the elapsed time and the output of the high frequency power supply 3 of the high frequency induction heating means and the output of the power supply 4 of the energization heating means. Memory or the like may be used.
  • the heat diffusion bonding device 10 of the present invention may include a voltage drop detecting means 63 capable of supplying a constant current to a plurality of members 1 to be bonded and detecting a voltage drop on the bonding surface S.
  • the control unit 6 may control the output of the power supply 4 of the energizing heating means based on the voltage drop detected by the voltage drop detecting means 63. This makes it possible to further precisely control the temperature of the member 1 to be joined. Therefore, the joining strength of the joining members on the joining surface S is high, and it is possible to perform joining with little variation.
  • the heat diffusion joining device 10 includes a pressurizing portion 8 for applying pressure to the joining surface S of the member 1 to be joined.
  • the structure of the pressurizing portion 8 may be any as long as pressure can be applied to the joint surface S of the member 1 to be joined.
  • the pressurizing member 81 to which the electrode 9 is fixed and the pressurizing member 81 are driven. It may be composed of a drive source 82 for the purpose and a ball screw mechanism 83 for transmitting the driving force of the drive source 82 and moving the pressure member 81 up and down.
  • the pressure member 81 may be formed in a substantially columnar shape in order to have versatility, but it may be formed according to the shape of the member 1 to be joined, or an intermediate member matching the shape of the member 1 to be joined. May be sandwiched between them.
  • the material of the pressure member 81 may be any material as long as it has rigidity against pressure, and for example, a metal such as stainless steel, copper, molybdenum, or tungsten may be used.
  • the pressurizing member 81 may have a cooling means for cooling the member 1 to be joined. Any cooling means may be used as long as the member 1 to be joined can be cooled.
  • a cooling fluid such as tap water may be circulated in the flow path.
  • the flow path may be provided on the pressure member 81 itself, or the cooling block on which the flow path is formed may be arranged in close contact with the pressure member 81.
  • a servomotor with a speed reducer can be used as the drive source 82.
  • An encoder 74 is attached to the servomotor and is arranged on a stand (not shown).
  • the ball screw mechanism 83 is composed of a screw shaft extending in the vertical direction and having a thread groove formed on the outer peripheral surface, a nut having a thread groove formed on the inner peripheral surface, and a plurality of balls accommodated between these thread grooves. It is configured.
  • the nut is fixed to the upper part of the pressurizing member 81 via an insulator made of bakelite or the like and a pressure sensor 73.
  • the screw shaft is connected to the rotating shaft of the servomotor via a speed reducer. When the servomotor is driven to rotate, the screw shaft rotates, and the nut, and thus the pressurizing member 81, moves up and down relative to the screw shaft. Further, when the driving of the servomotor is stopped, the position of the pressurizing member 81 is maintained. At this time, the pressurizing unit 8 regulates the displacement of the member 1 to be joined and applies pressure to the joint surface S.
  • the pressurizing unit 8 may have a pressure sensor 73 that detects the pressure of the joint surface S.
  • the pressure sensor 73 is, for example, a uniaxial load cell that measures pressure in the vertical direction, but a multi-axis pressure sensor may be used.
  • the pressure sensor 73 can indirectly detect the pressure applied to the joint surfaces S of the members to be joined.
  • the pressurizing portion 8 may further include an elastic force urging means 84 for urging the joint surfaces S of the members to be joined 1 with an elastic force.
  • the elastic force urging means 84 is arranged between the base member 11 on which the pressure member 81 is arranged and the base 9 of the heat diffusion joining device 10.
  • the elastic force urging means 84 is composed of, for example, a spring 84a and a block body 84b for restricting the spring 84a to a preset length shorter than the free length between the spring 84a and the base member 11.
  • the pressure acting on the member 1 to be joined from the base member 11 pushed up by the elastic force urging means 84 varies depending on the material and shape of the member 1 to be joined, but is, for example, 5 to 100 N. And this pressure can be changed by replacing the spring 84a. With this configuration, even if thermal expansion or contraction occurs in the member 1 to be joined, it is possible to alleviate a sudden change in pressure acting on the joint surface S.
  • the pressurizing portion 8 may have another configuration as long as it is for pressing the members to be joined 1 with each other by the joint surface S. For example, it is also possible to simply put a weight on the member 1 to be joined and press the members 1 to be joined together.
  • the heat diffusion bonding device 10 of the present invention may further include a pressure control unit 7 for controlling the pressure applied to the bonding surface S.
  • the pressure control unit 7 is composed of, for example, a CPU, a ROM, a RAM, an I / O, and the like, and as shown in FIG. 3, the operation unit 71 and the display unit 72 are electrically connected to each other.
  • the operation unit 71 is composed of various operation switches such as a start switch and a start switch, an input panel including a touch panel, and the like.
  • the information input from the operation unit 71 is transmitted to the pressure control unit 7.
  • the display unit 72 receives information from the pressure control unit 7 based on the input to the pressure control unit 7 or the calculation result of the pressure control unit 7, and displays the information.
  • the display unit 72 is composed of a digital display panel, a lamp, and the like. It is also possible to use the same pressure control unit 7 as the above-mentioned control unit 6.
  • a detection signal is input to the pressure control unit 7 from the pressure sensor 73, the encoder 74, and the temperature information providing unit (temperature sensor).
  • the pressure control unit 7 is based on these detection signals, information input from the operation unit 71, and control information such as set pressure Ps, lower limit set pressure Ps1, set temperature Ts, and set holding time Hs stored in the storage unit.
  • a control signal is output to the power supply 4 and the servomotor to control the pressurizing unit 8.
  • the pressure control unit 7 can be shared with the control unit 6.
  • the heat diffusion joining device 10 of the present invention may include an atmosphere control unit that controls the atmosphere of at least the portion including the joining surface S of the member to be joined.
  • the atmosphere control unit is, for example, a mechanism for creating a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen or argon at least in a portion of the member to be joined including the joint surface S. As a result, the formation of an oxide film on the joint surface S is suppressed, and the joint becomes easy and strong.
  • the atmosphere control unit includes, for example, a chamber capable of accommodating the members to be joined in a state of being in contact with each other at the joint surface S, a degassing means for removing gas in the chamber, and an air supply means for supplying gas into the chamber. It may be configured.
  • the degassing means for example, a vacuum pump that discharges the gas in the chamber through an air supply / exhaust pipe (not shown) can be used.
  • the air supply means for example, an air supply / exhaust pipe for introducing outside air into the chamber by communicating with the outside and an open valve provided for opening the air supply / exhaust pipe can be used.
  • the air supply means may be a gas supply pump or the like that supplies gas into the chamber via the air supply / exhaust pipe.
  • the atmosphere control unit may be equipped with a vacuum sensor such as a Pirani type that detects the degree of vacuum (pressure) in the chamber.
  • the atmosphere control unit may use a gas replacement means for substituting an inert gas such as nitrogen or argon in the chamber.

Abstract

The present invention addresses the problem of providing a thermal diffusion joining device that makes it possible to carry out quick and accurate temperature control of a member to be joined, and to carry out joining without variation in joining strength even with a great joint area.　A thermal diffusion joining device 10 that heats to join a plurality of members 1 to be joined of which joint faces are in contact with each other is configured with: a high-frequency induction heating means for heating the plurality of members 1 to be joined; and an electric heating means for heating the plurality of members to be joined. The high-frequency induction heating means is configured to heat the plurality of members 1 to be joined through high-frequency induction, and comprises a heating coil 2 and a high-frequency power source 3.

Description

加熱拡散接合装置Heat diffusion joining device
　本発明は、被接合部材同士を接合するための加熱拡散接合装置に関するものである。 The present invention relates to a heat diffusion joining device for joining members to be joined.
　金属等の被接合部材同士を接合するために、被接合部材同士の接合面に所定の圧力を付加し、所定の温度に加熱して接合する加熱拡散接合方法がある。当該方法に用いる加熱拡散接合装置には、直接通電加熱方式が用いられている（例えば、特許文献１）。直接通電加熱方式では、精密な温度管理がしやすいという特徴がある。 In order to join members to be joined such as metal, there is a heat diffusion joining method in which a predetermined pressure is applied to the joining surfaces of the members to be joined and the members are heated to a predetermined temperature for joining. A direct energization heating method is used for the heating / diffusion joining device used in this method (for example, Patent Document 1). The direct energization heating method has a feature that precise temperature control is easy.
特開２０１２－６０６８JP 2012-6068
　しかしながら、直接通電加熱方式は、接合面積が広い接合部材を加熱する場合、接合面の接触抵抗が部分的に低い箇所があると、その箇所の電流密度が高くなるため、接合面の電流密度を平均化することが難しくなる。電流密度の不均衡は接合面の温度の不均衡に繋がるため、接合強度のばらつきの要因になる。 However, in the direct energization heating method, when heating a joining member having a large joining area, if there is a part where the contact resistance of the joining surface is partially low, the current density at that part becomes high, so that the current density of the joining surface is increased. It becomes difficult to average. The imbalance of the current density leads to the imbalance of the temperature of the joint surface, which causes the variation of the joint strength.
　そこで、接合面積の大きいものを素早く加熱する方法として、高周波誘導加熱方式を採用することも考えられるが、高周波誘導加熱方式では温度を素早く上げられる一方、精密な温度管理が難しいという問題があった。 Therefore, it is conceivable to adopt a high-frequency induction heating method as a method for quickly heating a large joint area, but the high-frequency induction heating method has a problem that the temperature can be raised quickly, but precise temperature control is difficult. ..
　そこで、本発明では、接合面積が広いものであっても被接合部材を素早く、精度よく温度管理し、接合強度のばらつきのない接合ができる加熱拡散接合装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a heat diffusion bonding apparatus capable of quickly and accurately controlling the temperature of a member to be bonded even if the bonding area is large, and capable of bonding without variation in bonding strength.
　上記目的を達成するために、本発明の加熱拡散接合装置は、接合面を当接された複数の被接合部材を加熱して接合する加熱拡散接合装置であって、前記複数の被接合部材を加熱するための高周波誘導加熱手段と、前記複数の被接合部材を加熱するための通電加熱手段と、
を具備することを特徴とする加熱拡散接合装置。 In order to achieve the above object, the heat diffusion joining device of the present invention is a heat diffusion joining device that heats and joins a plurality of members to be joined with which the joining surfaces are abutted, and joins the plurality of members to be joined. A high-frequency induction heating means for heating, an energization heating means for heating the plurality of members to be joined, and an energization heating means.
A heat diffusion joining device characterized by comprising.
　ここで、前記通電加熱手段は、前記複数の被接合部材に電気を導通させるための複数の電極と、前記複数の電極に付与する出力を連続的に変更可能な電源と、を具備するものであってもよい。 Here, the energization heating means includes a plurality of electrodes for conducting electricity to the plurality of members to be joined, and a power source capable of continuously changing the output applied to the plurality of electrodes. There may be.
　また、前記複数の被接合部材又は前記複数の電極の温度情報を提供する温度情報提供部を具備する方が好ましい。 Further, it is preferable to provide a temperature information providing unit that provides temperature information of the plurality of members to be joined or the plurality of electrodes.
　また、前記温度情報提供部からの温度情報に基づいて、前記高周波誘導加熱手段および前記通電加熱手段を制御する制御部を具備してもよい。 Further, a control unit that controls the high frequency induction heating means and the energization heating means may be provided based on the temperature information from the temperature information providing unit.
　また、前記制御部は、前記温度情報提供部からの温度情報に基づいて前記電源の出力をアップスロープで制御するものであってもよい。 Further, the control unit may control the output of the power supply with an upslope based on the temperature information from the temperature information providing unit.
　また、前記温度情報提供部は、前記複数の被接合部材又は前記複数の電極の温度情報を検出する温度センサであってもよい。 Further, the temperature information providing unit may be a temperature sensor that detects temperature information of the plurality of members to be joined or the plurality of electrodes.
　また、前記温度情報提供部は、前記複数の被接合部材又は前記複数の電極の温度情報が格納された温度情報格納部であってもよい。 Further, the temperature information providing unit may be a temperature information storage unit in which temperature information of the plurality of members to be joined or the plurality of electrodes is stored.
　ここで、前記複数の被接合部材に一定の電流を供給し、前記接合面の電圧降下を検出可能な電圧降下検出手段を具備してもよい。 Here, a voltage drop detecting means capable of supplying a constant current to the plurality of members to be joined and detecting the voltage drop on the joint surface may be provided.
　また、前記制御部は、前記電圧降下検出手段が検出した電圧降下に基づいて前記電源の出力を制御するものであってもよい。 Further, the control unit may control the output of the power supply based on the voltage drop detected by the voltage drop detecting means.
　本発明の加熱拡散接合装置は、まず高周波誘導加熱で接合部を含めて周辺部を予備加熱し、次いで通電加熱に切り替えるので、接合面積が広い接合部材を素早く、精度よく温度管理し、接合強度のばらつきの少ない接合ができる。 In the heat diffusion joining device of the present invention, first, the peripheral part including the joint part is preheated by high frequency induction heating, and then the peripheral part is switched to energization heating. Can be joined with little variation.
本発明の加熱拡散接合装置を示す一部断面図である。It is a partial cross-sectional view which shows the heat diffusion bonding apparatus of this invention. 本発明に係る制御部を説明するためのブロック図である。It is a block diagram for demonstrating the control part which concerns on this invention. 本発明に係る圧力制御部を説明するためのブロック図である。It is a block diagram for demonstrating the pressure control part which concerns on this invention.
　本発明の加熱拡散接合装置10について図１を用いて説明する。本発明の加熱拡散接合装置10は、接合面Ｓを当接された複数の被接合部材１を加熱して接合するものであって、高周波誘導加熱手段と通電加熱手段とで主に構成される。 The heat diffusion bonding device 10 of the present invention will be described with reference to FIG. The heat diffusion joining device 10 of the present invention heats and joins a plurality of members 1 to be joined which are in contact with the joining surface S, and is mainly composed of a high frequency induction heating means and an energization heating means. ..
　ここで被接合部材１とは、接合面Ｓで接合させたい部材のことであり、誘導加熱が可能であれば、その材質や形状等はどのようなものでもよい。材質としては、例えば、ステンレス鋼などの鉄鋼材料、銅、アルミニウム、亜鉛などの非鉄金属、アルミニウム、ニッケル、クロム、チタン、銅等を含む各種合金などが挙げられる。また、被接合部材１は、同じ材質のものであっても、異なる材質のものであってもよい。また、形状としては、例えば、パイプ状、バルク状、厚板状、薄板状が挙げられ、溝加工、穴開け加工など任意の加工が施されていてもよい。接合面Ｓは、平面でも曲面であってもよい。また、接合面Ｓは、鏡面であることが好ましいが、粗面であってもよい。 Here, the member 1 to be joined is a member to be joined on the joint surface S, and any material, shape, etc. may be used as long as induction heating is possible. Examples of the material include steel materials such as stainless steel, non-ferrous metals such as copper, aluminum and zinc, and various alloys containing aluminum, nickel, chromium, titanium, copper and the like. Further, the member 1 to be joined may be made of the same material or a different material. Further, examples of the shape include a pipe shape, a bulk shape, a thick plate shape, and a thin plate shape, and any processing such as grooving and drilling may be performed. The joint surface S may be a flat surface or a curved surface. Further, the joint surface S is preferably a mirror surface, but may be a rough surface.
　ここで、高周波誘導加熱手段とは、複数の被接合部材１を高周波誘導により加熱するためのもので、加熱コイル２と、高周波電源３とからなる。 Here, the high-frequency induction heating means is for heating a plurality of members 1 to be joined by high-frequency induction, and includes a heating coil 2 and a high-frequency power supply 3.
　加熱コイル２とは、加熱コイル２を流れる交流電流により加熱コイル２内に配置された被接合部材１の周りに磁界を発生させるためのものである。この磁場が被接合部材１内に渦電流を誘導することにより、加熱コイル２と被接合部材１との物理的な接触なしに、被接合部材１に精密に局所的な熱を発生させることができる。加熱コイル２としては、被接合部材１に熱を発生させることができればどのようなものでもよいが、例えば、公知の誘導加熱用コイルを用いることができる。 The heating coil 2 is for generating a magnetic field around a member 1 to be joined arranged in the heating coil 2 by an alternating current flowing through the heating coil 2. By inducing an eddy current in the member 1 to be joined by this magnetic field, it is possible to generate precise local heat in the member 1 to be joined without physical contact between the heating coil 2 and the member 1 to be joined. can. The heating coil 2 may be any coil as long as it can generate heat in the member 1 to be joined, and for example, a known induction heating coil can be used.
　高周波電源３とは加熱コイル２に電力を出力するための交流電源である。当該高周波電源３としては、加熱コイル２に付与する出力を連続的に変更可能であればどのようなものでもよいが、例えば、公知の高周波インバータ電源を用いることができる。 The high frequency power supply 3 is an AC power supply for outputting electric power to the heating coil 2. The high-frequency power supply 3 may be any one as long as the output applied to the heating coil 2 can be continuously changed, and for example, a known high-frequency inverter power supply can be used.
　また、通電加熱手段とは、複数の被接合部材１に電気を導通させて加熱するものである。電気を導通させて加熱できればどのような手段でもよいが、例えば、複数の被接合部材１に電気を導通させるための複数の電極９と、複数の電極９に付与する出力を連続的に変更可能な電源４とで構成すればよい。 Further, the energizing heating means is for heating a plurality of members 1 to be joined by conducting electricity. Any means may be used as long as electricity can be conducted and heated. For example, a plurality of electrodes 9 for conducting electricity to a plurality of members 1 to be joined and outputs given to the plurality of electrodes 9 can be continuously changed. It may be configured with a power supply 4.
　ここで、本発明の誘導加熱拡散接合装置10は温度情報提供部５を備えていてもよい。 Here, the induction heating diffusion joining device 10 of the present invention may include a temperature information providing unit 5.
　温度情報提供部５とは、図２に示すように、表示部62や後述する制御部６に複数の被接合部材１又は複数の電極９の温度情報を提供するためのものである。なお、温度情報とは、被接合部材１の温度に関する情報を意味し、温度そのままの情報であってもよいし、例えば高周波誘導加熱手段の高周波電源３や通電加熱手段の電源４の電圧を決める電圧値等、温度から計算によって変換された情報であってもよい。温度情報提供部５としては、例えば、被接合部材１の温度を検出する温度センサを用いることができる。温度センサは、被接合部材１の温度を検出できればどのようなものでもよいが、例えば、赤外線放射温度計等のように非接触で温度を検出する非接触式センサや、複数の被接合部材１又は複数の電極９に接触させて温度を検出する熱電対等の接触式センサを用いればよい。また、非接触式のものと接触式のものを併用することも可能である。 As shown in FIG. 2, the temperature information providing unit 5 is for providing temperature information of a plurality of members 1 to be joined or a plurality of electrodes 9 to the display unit 62 and the control unit 6 described later. The temperature information means information about the temperature of the member 1 to be joined, and may be the information as it is. For example, the voltage of the high frequency power source 3 of the high frequency induction heating means and the power source 4 of the energization heating means is determined. It may be information converted from temperature by calculation, such as a voltage value. As the temperature information providing unit 5, for example, a temperature sensor that detects the temperature of the member 1 to be joined can be used. The temperature sensor may be any one as long as it can detect the temperature of the member 1 to be joined. For example, a non-contact sensor that detects the temperature in a non-contact manner such as an infrared radiation thermometer, or a plurality of members 1 to be joined. Alternatively, a contact sensor such as a thermometer that detects the temperature by contacting the plurality of electrodes 9 may be used. It is also possible to use both a non-contact type and a contact type.
　また、温度情報提供部５からの温度情報に基づいて、高周波誘導加熱手段および通電加熱手段を制御する制御部６を備えていてもよい。 Further, the control unit 6 for controlling the high frequency induction heating means and the energization heating means may be provided based on the temperature information from the temperature information providing unit 5.
　制御部６とは、図２に示すように、温度情報提供部５からの温度情報に基づいて高周波誘導加熱手段の高周波電源３の出力を制御したり、温度情報提供部５からの温度情報に基づいて通電加熱手段の電源４の出力をアップスロープで制御したりするためのものである。従来の加熱拡散接合装置10では所定の出力を一定時間通電するか、あるいは所定の出力をＯＮ／ＯＦＦ制御で通電していたため、所定箇所の温度が急激に上昇することがあった。この場合、当該箇所の接合状態が液相結合になる等、接合面Ｓの接合状態が不均一になり接合状態のばらつきにつながる。これに対し、本発明の加熱拡散接合装置10では、目的の温度近くまでは高周波誘導加熱手段により予備加熱を行い、目的の温度近くからは通電加熱手段によりアップスロープに制御して加熱を行う。 As shown in FIG. 2, the control unit 6 controls the output of the high-frequency power source 3 of the high-frequency induction heating means based on the temperature information from the temperature information providing unit 5, and obtains the temperature information from the temperature information providing unit 5. Based on this, the output of the power source 4 of the energizing heating means is controlled by an upslope. In the conventional heat diffusion bonding device 10, since a predetermined output is energized for a certain period of time or a predetermined output is energized by ON / OFF control, the temperature at a predetermined location may rise sharply. In this case, the bonding state of the bonding surface S becomes non-uniform, for example, the bonding state at the relevant portion becomes a liquid phase bond, which leads to variations in the bonding state. On the other hand, in the heating / diffusion joining device 10 of the present invention, preheating is performed by the high-frequency induction heating means up to a temperature close to the target temperature, and heating is performed by controlling the upslope from near the target temperature by the energizing heating means.
　予備加熱は、高周波誘導加熱手段による接合面の温度誤差を考慮し、少なくとも目的の温度よりも当該温度誤差だけ低い温度まで一気に加熱する。これにより、接合面積が広い接合部材を素早く加熱することができる。一方、アップスロープ制御による加熱では、出力を制御して温度を精度よく徐々に上げていくことにより、急激な加熱が抑制され接合面Ｓの温度を均一にすることができる。したがって、接合面Ｓに均一な拡散層を成長させることが可能となり、強度の均一化を図ることができる。 Preheating takes into consideration the temperature error of the joint surface by the high frequency induction heating means, and heats at least to a temperature lower than the target temperature by the temperature error. As a result, the joining member having a large joining area can be quickly heated. On the other hand, in heating by upslope control, by controlling the output and gradually raising the temperature with high accuracy, rapid heating can be suppressed and the temperature of the joint surface S can be made uniform. Therefore, a uniform diffusion layer can be grown on the joint surface S, and the strength can be made uniform.
　また、制御部６は、温度センサで検出した温度情報に基づいてリアルタイムで通電加熱手段の電源４の出力をアップスロープで連続制御し、被接合部材１の緻密な温度管理を可能とすることができる。したがって、接合部材同士の接合面Ｓにおける接合強度が高く、ばらつきの小さい接合を行うことができる。更に、このような連続制御は、ＯＮ／ＯＦＦ制御と比べて熱膨張を一定に維持することができるため、熱膨張による圧力変動の影響を低減することができる。 Further, the control unit 6 continuously controls the output of the power supply 4 of the energizing heating means in real time based on the temperature information detected by the temperature sensor with an upslope, enabling precise temperature control of the member 1 to be joined. can. Therefore, the joining strength of the joining members on the joining surface S is high, and it is possible to perform joining with little variation. Further, such continuous control can maintain a constant thermal expansion as compared with ON / OFF control, so that the influence of pressure fluctuation due to thermal expansion can be reduced.
　制御部６としては、温度情報提供部５からの温度情報に基づいて高周波誘導加熱手段の高周波電源３の出力を制御したり、通電加熱手段の電源４の出力をアップスロープで制御したりすることができればどのようなものでもよいが、例えば、ＣＰＵ、ＲＯＭ、ＲＡＭ、Ｉ／Ｏ等から構成され、図２に示すように、操作部61及び表示部62が電気的に接続されているものを用いることができる。具体的には、高速サンプリング温度調節計のような公知のＰＩＤ温度制御装置を用いることができる。なお、操作部61は、ここでは、起動スイッチ、スタートスイッチ等の各種の操作スイッチ、タッチパネル等からなる入力盤などから構成されている。操作部61から入力された情報は、制御部６に送信される。また、表示部62は、制御部６への入力、又は制御部６での演算結果に基づく情報を制御部６から受信し、その情報を表示する。表示部62は、ここでは、デジタル表示パネル、ランプなどから構成されている。 The control unit 6 controls the output of the high frequency power supply 3 of the high frequency induction heating means based on the temperature information from the temperature information providing unit 5, and controls the output of the power supply 4 of the energization heating means with an upslope. Anything can be used as long as it can be used, but for example, a CPU, a ROM, a RAM, an I / O, or the like, and as shown in FIG. 2, the operation unit 61 and the display unit 62 are electrically connected to each other. Can be used. Specifically, a known PID temperature control device such as a high-speed sampling temperature controller can be used. The operation unit 61 is composed of various operation switches such as a start switch and a start switch, an input panel including a touch panel, and the like. The information input from the operation unit 61 is transmitted to the control unit 6. Further, the display unit 62 receives information from the control unit 6 based on the input to the control unit 6 or the calculation result of the control unit 6, and displays the information. Here, the display unit 62 is composed of a digital display panel, a lamp, and the like.
　なお、上述した温度情報提供部５では、温度センサを用いて複数の被接合部材１又は複数の電極９の温度をリアルタイムで取得し、制御部６に被接合部材１の温度情報を提供する場合について説明した。しかし、本発明の加熱拡散接合装置10を使って同じ材料の被接合部材１を同一環境で接合する場合、経過時間と被接合部材１の温度の関係は同様の結果となる。そのため、予め経過時間と被接合部材１の温度の関係を示す温度情報を取得しておけば、温度センサを用いなくても当該温度情報を提供することが可能となる。したがって、温度情報提供部５は、被接合部材１の加熱の経過時間と被接合部材１の温度の関係を示す温度情報が格納された温度情報格納部であってもよい。これにより、制御部６は、温度情報格納部に格納された温度情報に基づいて高周波誘導加熱手段の高周波電源３の出力を制御したり、通電加熱手段の電源４の出力を制御したりすることができる。温度情報格納部は経過時間と高周波誘導加熱手段の高周波電源３の出力や通電加熱手段の電源４の出力の関係を決定するための温度情報が格納できればどのようなものでもよいが、例えば、公知のメモリ等を用いればよい。 When the temperature information providing unit 5 described above acquires the temperatures of the plurality of members 1 to be joined or the plurality of electrodes 9 in real time using a temperature sensor and provides the temperature information of the members 1 to be joined to the control unit 6. Was explained. However, when the members 1 to be joined of the same material are joined in the same environment using the heat diffusion joining device 10 of the present invention, the relationship between the elapsed time and the temperature of the members 1 to be joined has the same result. Therefore, if the temperature information indicating the relationship between the elapsed time and the temperature of the member 1 to be joined is acquired in advance, the temperature information can be provided without using the temperature sensor. Therefore, the temperature information providing unit 5 may be a temperature information storage unit that stores temperature information indicating the relationship between the elapsed time of heating of the member 1 to be joined and the temperature of the member 1 to be joined. As a result, the control unit 6 controls the output of the high frequency power supply 3 of the high frequency induction heating means or controls the output of the power supply 4 of the energization heating means based on the temperature information stored in the temperature information storage unit. Can be done. The temperature information storage unit may be any as long as it can store temperature information for determining the relationship between the elapsed time and the output of the high frequency power supply 3 of the high frequency induction heating means and the output of the power supply 4 of the energization heating means. Memory or the like may be used.
　また、加熱拡散接合においては、被接合部材１同士の加圧方向の軸線の合わせ込みや荷重の管理が非常に重要である。ここで、本発明者は、鋭意研究した結果、当該管理状態は接合界面の接触抵抗の値に反映されることがわかった。したがって、当該接触抵抗値を監視すれば、軸線の合わせ込みや荷重の管理が初期状態を維持できているか否か判断することができる。また、当該接触抵抗値の変化の度合いにより、被接合部材１を加熱拡散接合装置10にセットするための治工具のメンテナンス時期を明らかにすることができる。そこで、本発明の加熱拡散接合装置10は、複数の被接合部材１に一定の電流を供給し、接合面Ｓの電圧降下を検出可能な電圧降下検出手段63を備えていてもよい。なお、制御部６は、図２に示すように、当該電圧降下検出手段63が検出した電圧降下に基づいて通電加熱手段の電源４の出力を制御するものであってもよい。これにより、更に被接合部材１の緻密な温度管理を可能とすることができる。したがって、接合部材同士の接合面Ｓにおける接合強度が高く、ばらつきの小さい接合を行うことができる。 Further, in heat diffusion joining, it is very important to align the axes of the members to be joined in the pressurizing direction and to manage the load. Here, as a result of diligent research, the present inventor has found that the controlled state is reflected in the value of the contact resistance at the junction interface. Therefore, by monitoring the contact resistance value, it is possible to determine whether or not the alignment of the axis lines and the management of the load can maintain the initial state. Further, depending on the degree of change in the contact resistance value, it is possible to clarify the maintenance time of the jig and tool for setting the member 1 to be joined in the heat diffusion joining device 10. Therefore, the heat diffusion bonding device 10 of the present invention may include a voltage drop detecting means 63 capable of supplying a constant current to a plurality of members 1 to be bonded and detecting a voltage drop on the bonding surface S. As shown in FIG. 2, the control unit 6 may control the output of the power supply 4 of the energizing heating means based on the voltage drop detected by the voltage drop detecting means 63. This makes it possible to further precisely control the temperature of the member 1 to be joined. Therefore, the joining strength of the joining members on the joining surface S is high, and it is possible to perform joining with little variation.
　次に、加熱拡散接合装置10のその他の構成について説明する。加熱拡散接合装置10は、被接合部材１の接合面Ｓに圧力を付与するための加圧部８を備える。加圧部８の構成は、被接合部材１の接合面Ｓに圧力を付与できればどのようなものでもよいが、例えば、電極９が固定された加圧部材81と、加圧部材81を駆動させるための駆動源82と、駆動源82の駆動力を伝達し、加圧部材81を上下動させるボールねじ機構83とで構成すればよい。 Next, other configurations of the heat diffusion joining device 10 will be described. The heat diffusion joining device 10 includes a pressurizing portion 8 for applying pressure to the joining surface S of the member 1 to be joined. The structure of the pressurizing portion 8 may be any as long as pressure can be applied to the joint surface S of the member 1 to be joined. For example, the pressurizing member 81 to which the electrode 9 is fixed and the pressurizing member 81 are driven. It may be composed of a drive source 82 for the purpose and a ball screw mechanism 83 for transmitting the driving force of the drive source 82 and moving the pressure member 81 up and down.
　加圧部材81は、汎用性を持たせるために略円柱状に形成すればよいが、被接合部材１の形状に合わせて形成してもよいし、被接合部材１の形状に合わせた中間部材を間に挟んでもよい。加圧部材81の材質としては、加圧力に対する剛性があればどのようなものでもよいが、例えば、ステンレス、銅、モリブデン、タングステンなどの金属を用いればよい。 The pressure member 81 may be formed in a substantially columnar shape in order to have versatility, but it may be formed according to the shape of the member 1 to be joined, or an intermediate member matching the shape of the member 1 to be joined. May be sandwiched between them. The material of the pressure member 81 may be any material as long as it has rigidity against pressure, and for example, a metal such as stainless steel, copper, molybdenum, or tungsten may be used.
　なお、図示しないが、加圧部材81は、被接合部材１を冷却するための冷却手段を有していてもよい。冷却手段としては、被接合部材１を冷却可能なものであればどのようなものでもよいが、例えば、流路に水道水等の冷却流体を循環させる構成とすることができる。当該流路は、加圧部材81自体に設けてもよいし、流路が形成された冷却ブロックを加圧部材81に密接して配置してもよい。 Although not shown, the pressurizing member 81 may have a cooling means for cooling the member 1 to be joined. Any cooling means may be used as long as the member 1 to be joined can be cooled. For example, a cooling fluid such as tap water may be circulated in the flow path. The flow path may be provided on the pressure member 81 itself, or the cooling block on which the flow path is formed may be arranged in close contact with the pressure member 81.
　駆動源82は、例えば減速機付きのサーボモータを用いることができる。サーボモータには、エンコーダ74が付設されており、図示しない架台に配置されている。 As the drive source 82, for example, a servomotor with a speed reducer can be used. An encoder 74 is attached to the servomotor and is arranged on a stand (not shown).
　ボールねじ機構83は、上下方向に延び外周面にねじ溝が形成されたねじ軸と、内周面にねじ溝が形成されたナットと、これらのねじ溝間に収容された複数のボールとから構成されている。ナットは、加圧部材81の上部にベークライト等からなる絶縁体及び圧力センサ73を介して固定されている。ねじ軸は、サーボモータの回転軸に減速機を介して接続されている。サーボモータが回転駆動することにより、ねじ軸が回転して、ナット、ひいては加圧部材81がねじ軸に対して相対的に上下移動する。また、サーボモータの駆動を停止させると、加圧部材81の位置が維持される。このとき、加圧部８は、被接合部材１の変位を規制して接合面Ｓに圧力を付与することになる。 The ball screw mechanism 83 is composed of a screw shaft extending in the vertical direction and having a thread groove formed on the outer peripheral surface, a nut having a thread groove formed on the inner peripheral surface, and a plurality of balls accommodated between these thread grooves. It is configured. The nut is fixed to the upper part of the pressurizing member 81 via an insulator made of bakelite or the like and a pressure sensor 73. The screw shaft is connected to the rotating shaft of the servomotor via a speed reducer. When the servomotor is driven to rotate, the screw shaft rotates, and the nut, and thus the pressurizing member 81, moves up and down relative to the screw shaft. Further, when the driving of the servomotor is stopped, the position of the pressurizing member 81 is maintained. At this time, the pressurizing unit 8 regulates the displacement of the member 1 to be joined and applies pressure to the joint surface S.
　また、加圧部８は、接合面Ｓの圧力を検出する圧力センサ73を有していてもよい。圧力センサ73は、例えば、上下方向の圧力を測定する一軸のロードセルであるが、多軸の圧力センサを用いてもよい。圧力センサ73により、被接合部材１同士の接合面Ｓに付与される圧力を間接的に検知することができる。 Further, the pressurizing unit 8 may have a pressure sensor 73 that detects the pressure of the joint surface S. The pressure sensor 73 is, for example, a uniaxial load cell that measures pressure in the vertical direction, but a multi-axis pressure sensor may be used. The pressure sensor 73 can indirectly detect the pressure applied to the joint surfaces S of the members to be joined.
　また、加圧部８は、被接合部材１同士の接合面Ｓに弾性力を付勢する弾性力付勢手段84を更に備えていてもよい。例えば、加圧部材81が配置されるベース部材11と加熱拡散接合装置10の基台９との間に弾性力付勢手段84を配置する。弾性力付勢手段84としては、例えば、ばね84aと、ばね84aをベース部材11との間で自由長より短い予め設定された長さに規制するためのブロック体84bとから構成されている。なお、弾性力付勢手段84によって押し上げられるベース部材11から被接合部材１に作用する圧力は、被接合部材１の材質や形状に応じて異なるが、例えば５～１００Ｎである。そして、この圧力は、ばね84aを交換することによって変更可能である。このように構成することにより、被接合部材１に熱膨張や熱収縮が生じても、接合面Ｓに作用する圧力の急激な変化を緩和することができる。 Further, the pressurizing portion 8 may further include an elastic force urging means 84 for urging the joint surfaces S of the members to be joined 1 with an elastic force. For example, the elastic force urging means 84 is arranged between the base member 11 on which the pressure member 81 is arranged and the base 9 of the heat diffusion joining device 10. The elastic force urging means 84 is composed of, for example, a spring 84a and a block body 84b for restricting the spring 84a to a preset length shorter than the free length between the spring 84a and the base member 11. The pressure acting on the member 1 to be joined from the base member 11 pushed up by the elastic force urging means 84 varies depending on the material and shape of the member 1 to be joined, but is, for example, 5 to 100 N. And this pressure can be changed by replacing the spring 84a. With this configuration, even if thermal expansion or contraction occurs in the member 1 to be joined, it is possible to alleviate a sudden change in pressure acting on the joint surface S.
　なお、加圧部８として上記のような構成について説明したが、加圧部８は、被接合部材１同士を接合面Ｓで押圧するためのものであれば他の構成でも構わない。例えば、単に、被接合部材１の上に錘を乗せて、被接合部材１同士を押圧するものを用いることも可能である。 Although the above-described configuration has been described as the pressurizing portion 8, the pressurizing portion 8 may have another configuration as long as it is for pressing the members to be joined 1 with each other by the joint surface S. For example, it is also possible to simply put a weight on the member 1 to be joined and press the members 1 to be joined together.
　また、本発明の加熱拡散接合装置10は、更に接合面Ｓに付与する圧力を制御するための圧力制御部７を有していてもよい。圧力制御部７は、例えば、ＣＰＵ、ＲＯＭ、ＲＡＭ、Ｉ／Ｏ等から構成されており、図３に示すように、操作部71及び表示部72が電気的に接続されている。操作部71は、ここでは、起動スイッチ、スタートスイッチ等の各種の操作スイッチ、タッチパネル等からなる入力盤などから構成されている。操作部71から入力された情報は、圧力制御部７に送信される。また、表示部72は、圧力制御部７への入力、又は圧力制御部７での演算結果に基づく情報を圧力制御部７から受信し、その情報を表示する。表示部72は、ここでは、デジタル表示パネル、ランプなどから構成されている。なお、当該圧力制御部７は、上述した制御部６と共通のものを用いることも可能である。 Further, the heat diffusion bonding device 10 of the present invention may further include a pressure control unit 7 for controlling the pressure applied to the bonding surface S. The pressure control unit 7 is composed of, for example, a CPU, a ROM, a RAM, an I / O, and the like, and as shown in FIG. 3, the operation unit 71 and the display unit 72 are electrically connected to each other. Here, the operation unit 71 is composed of various operation switches such as a start switch and a start switch, an input panel including a touch panel, and the like. The information input from the operation unit 71 is transmitted to the pressure control unit 7. Further, the display unit 72 receives information from the pressure control unit 7 based on the input to the pressure control unit 7 or the calculation result of the pressure control unit 7, and displays the information. Here, the display unit 72 is composed of a digital display panel, a lamp, and the like. It is also possible to use the same pressure control unit 7 as the above-mentioned control unit 6.
　また、圧力制御部７には、図３に示すように、圧力センサ73、エンコーダ74及び温度情報提供部（温度センサ）から検知信号が入力される。圧力制御部７は、これら検知信号、操作部71から入力された情報及びその記憶部に格納された設定圧力Ｐｓ、下限設定圧力Ｐｓ１、設定温度Ｔｓ、設定保持時間Ｈｓなどの制御情報に基づき、電源４及びサーボモータに制御信号を出力し、加圧部８を制御する。なお、圧力制御部７は、制御部６と共通にすることも可能である。 Further, as shown in FIG. 3, a detection signal is input to the pressure control unit 7 from the pressure sensor 73, the encoder 74, and the temperature information providing unit (temperature sensor). The pressure control unit 7 is based on these detection signals, information input from the operation unit 71, and control information such as set pressure Ps, lower limit set pressure Ps1, set temperature Ts, and set holding time Hs stored in the storage unit. A control signal is output to the power supply 4 and the servomotor to control the pressurizing unit 8. The pressure control unit 7 can be shared with the control unit 6.
　また、本発明の加熱拡散接合装置10は、少なくとも被接合部材の接合面Ｓを含む部分の雰囲気を制御する雰囲気制御部を備えていてもよい。雰囲気制御部は、例えば、少なくとも被接合部材の接合面Ｓを含む部分の雰囲気を真空雰囲気にしたり、窒素、アルゴン等の不活性ガス雰囲気にしたりする機構である。これにより、接合面Ｓに酸化被膜が発生することが抑制され、接合が容易且つ強固となる。 Further, the heat diffusion joining device 10 of the present invention may include an atmosphere control unit that controls the atmosphere of at least the portion including the joining surface S of the member to be joined. The atmosphere control unit is, for example, a mechanism for creating a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen or argon at least in a portion of the member to be joined including the joint surface S. As a result, the formation of an oxide film on the joint surface S is suppressed, and the joint becomes easy and strong.
　雰囲気制御部は、例えば、被接合部材を接合面Ｓで当接した状態で収容可能なチャンバと、チャンバ内の気体を除去する脱気手段と、チャンバ内に気体を供給する給気手段とで構成すればよい。 The atmosphere control unit includes, for example, a chamber capable of accommodating the members to be joined in a state of being in contact with each other at the joint surface S, a degassing means for removing gas in the chamber, and an air supply means for supplying gas into the chamber. It may be configured.
　脱気手段は、例えば、チャンバ内の気体を図示しない給排気管を介して排出する真空ポンプを用いることができる。また、給気手段は、例えば、外部と連通し、チャンバ内に外気を導入させるための給排気管と当該給排気管を開放するために設けられた開放バルブを用いることができる。また、給気手段は、給排気管を介してチャンバ内に気体を供給する気体供給ポンプなどであってもよい As the degassing means, for example, a vacuum pump that discharges the gas in the chamber through an air supply / exhaust pipe (not shown) can be used. Further, as the air supply means, for example, an air supply / exhaust pipe for introducing outside air into the chamber by communicating with the outside and an open valve provided for opening the air supply / exhaust pipe can be used. Further, the air supply means may be a gas supply pump or the like that supplies gas into the chamber via the air supply / exhaust pipe.
　また、雰囲気制御部は、チャンバ内の真空度（圧力）を検知するピラニー式などの真空センサが設置されていてもよい。 Further, the atmosphere control unit may be equipped with a vacuum sensor such as a Pirani type that detects the degree of vacuum (pressure) in the chamber.
　また、雰囲気制御部は、チャンバ内に窒素、アルゴン等の不活性ガスを置換する気体置換手段を用いてもよい。 Further, the atmosphere control unit may use a gas replacement means for substituting an inert gas such as nitrogen or argon in the chamber.
１：被接合部材
２：加熱コイル
３：高周波電源
４：電源
５：温度情報提供部
６：制御部
７：圧力制御部
８：加圧部
９：電極
10：加熱拡散接合装置
11：ベース部材
61：操作部
62：表示部
63：電圧降下検出手段
71：操作部
72：表示部
73：圧力センサ
74：エンコーダ
81：加圧部材
82：駆動源
83：ボールねじ機構
84：弾性力付勢手段
84a：ばね
84b：ブロック体
Ｓ：接合面 1: Member to be joined 2: Heating coil 3: High frequency power supply 4: Power supply 5: Temperature information providing unit 6: Control unit 7: Pressure control unit 8: Pressurizing unit 9: Electrode
10: Heat diffusion joining device
11: Base member
61: Operation unit
62: Display
63: Voltage drop detecting means
71: Operation unit
72: Display
73: Pressure sensor
74: Encoder
81: Pressurizing member
82: Drive source
83: Ball screw mechanism
84: Elastic force urging means
84a: Spring
84b: Block body S: Joint surface

Claims (9)

  1. 　接合面を当接された複数の被接合部材を加熱して接合する加熱拡散接合装置であって、
    　前記複数の被接合部材を加熱するための高周波誘導加熱手段と、
    　前記複数の被接合部材を加熱するための通電加熱手段と、
    を具備することを特徴とする加熱拡散接合装置。     It is a heat diffusion joining device that heats and joins a plurality of members to be joined with which the joining surfaces are abutted.
    A high-frequency induction heating means for heating the plurality of members to be joined, and
    An energizing heating means for heating the plurality of members to be joined, and
    A heat diffusion joining device, characterized in that it is provided with.
  2. 　前記通電加熱手段は、前記複数の被接合部材に電気を導通させるための複数の電極と、
    前記複数の電極に付与する出力を連続的に変更可能な電源と、
    を具備することを特徴とする請求項１記載の加熱拡散接合装置。     The energizing heating means includes a plurality of electrodes for conducting electricity to the plurality of members to be joined, and a plurality of electrodes.
    A power supply that can continuously change the output applied to the plurality of electrodes,
    The heat diffusion bonding apparatus according to claim 1, further comprising.
  3. 　前記複数の被接合部材又は前記複数の電極の温度情報を提供する温度情報提供部を具備することを特徴とする請求項２記載の加熱拡散接合装置。 The heat diffusion bonding apparatus according to claim 2, further comprising a temperature information providing unit that provides temperature information of the plurality of members to be bonded or the plurality of electrodes.
  4. 　前記温度情報提供部からの温度情報に基づいて、前記高周波誘導加熱手段および前記通電加熱手段を制御する制御部を具備することを特徴とする請求項３記載の加熱拡散接合装置。 The heating / diffusion joining device according to claim 3, further comprising a control unit that controls the high-frequency induction heating means and the energization heating means based on the temperature information from the temperature information providing unit.
  5. 　前記制御部は、前記温度情報提供部からの温度情報に基づいて前記電源の出力をアップスロープで制御することを特徴とする請求項４記載の加熱拡散接合装置。 The heat diffusion joining device according to claim 4, wherein the control unit controls the output of the power supply with an upslope based on the temperature information from the temperature information providing unit.
  6. 　前記温度情報提供部は、前記複数の被接合部材又は前記複数の電極の温度情報を検出する温度センサであることを特徴とする請求項３ないし５のいずれかに記載の加熱拡散接合装置。 The heat diffusion bonding device according to any one of claims 3 to 5, wherein the temperature information providing unit is a temperature sensor that detects temperature information of the plurality of members to be bonded or the plurality of electrodes.
  7. 　前記温度情報提供部は、前記複数の被接合部材又は前記複数の電極の温度情報が格納された温度情報格納部であることを特徴とする請求項３ないし５のいずれかに記載の加熱拡散接合装置。 The heat diffusion bonding according to any one of claims 3 to 5, wherein the temperature information providing unit is a temperature information storage unit that stores temperature information of the plurality of members to be joined or the plurality of electrodes. Device.
  8. 　前記複数の被接合部材に一定の電流を供給し、前記接合面の電圧降下を検出可能な電圧降下検出手段を具備することを特徴とする請求項４ないし７のいずれかに記載の加熱拡散接合装置。 The heat diffusion bonding according to any one of claims 4 to 7, wherein a constant current is supplied to the plurality of members to be bonded, and a voltage drop detecting means capable of detecting a voltage drop on the bonding surface is provided. Device.
  9. 　前記制御部は、前記電圧降下検出手段が検出した電圧降下に基づいて前記電源の出力を制御するものであることを特徴とする請求項８記載の加熱拡散接合装置。 The heat diffusion joining device according to claim 8, wherein the control unit controls the output of the power supply based on the voltage drop detected by the voltage drop detecting means.
PCT/JP2021/015098 2020-04-13 2021-04-09 Thermal diffusion joining device WO2021210518A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55114486A (en) * 1979-02-28 1980-09-03 Hitachi Ltd Diffusion-bonding device
JPS5897485A (en) * 1981-12-04 1983-06-09 Hitachi Ltd Joining method for metals
JP2004315884A (en) * 2003-04-16 2004-11-11 Masao Hondo Hot pressing device, and method of joining member by pulse energizing method using the hot pressing device
JP2019038030A (en) * 2017-08-29 2019-03-14 オリジン電気株式会社 Manufacturing method of heterogeneous metal joined article and joining device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55114486A (en) * 1979-02-28 1980-09-03 Hitachi Ltd Diffusion-bonding device
JPS5897485A (en) * 1981-12-04 1983-06-09 Hitachi Ltd Joining method for metals
JP2004315884A (en) * 2003-04-16 2004-11-11 Masao Hondo Hot pressing device, and method of joining member by pulse energizing method using the hot pressing device
JP2019038030A (en) * 2017-08-29 2019-03-14 オリジン電気株式会社 Manufacturing method of heterogeneous metal joined article and joining device

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