WO2021208785A1 - 一种天线模组及电子设备 - Google Patents
一种天线模组及电子设备 Download PDFInfo
- Publication number
- WO2021208785A1 WO2021208785A1 PCT/CN2021/085810 CN2021085810W WO2021208785A1 WO 2021208785 A1 WO2021208785 A1 WO 2021208785A1 CN 2021085810 W CN2021085810 W CN 2021085810W WO 2021208785 A1 WO2021208785 A1 WO 2021208785A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- antenna
- antenna module
- signal processing
- processing chip
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 138
- 238000003491 array Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
Definitions
- the present invention relates to the field of communication technology, in particular to an antenna module and electronic equipment.
- antennas for wireless communication such as positioning antennas for realizing positioning functions, Bluetooth antennas for realizing Bluetooth communication, and so on.
- MIMO Multi-Input Multi-Output
- the existing antenna modules can achieve dual polarization of at most one antenna array. When the antenna arrays are laid out more, the more installation space is required in the electronic equipment. The antenna module is not conducive to the development of light and thin electronic equipment.
- the embodiments of the present invention provide an antenna module and an electronic device to solve the problem that the number of antennas in the existing electronic device is increasing, which is not conducive to the development of light and thin electronic devices.
- an embodiment of the present invention provides an antenna module including a first substrate, a second substrate, and a signal processing chip, the second substrate and the signal processing chip are located on the same side of the first substrate, The side of the first substrate opposite to the second substrate is provided with a first antenna array, and the second substrate carries a second antenna array.
- an embodiment of the present invention also provides an electronic device including the antenna module as described in the first aspect.
- the second substrate is provided, and the second substrate is used to carry the second antenna array, so that the antenna module provided in this embodiment can be arranged with two antenna arrays to realize two antenna arrays.
- the dual-polarization MIMO can effectively reduce the number of antenna modules in electronic equipment, which is more conducive to the development of electronic equipment to be lighter and thinner.
- FIG. 1 is a structural diagram of an antenna module provided by an embodiment of the present invention
- FIG. 2 is a structural diagram of the antenna module in FIG. 1 from another perspective;
- FIG. 3 is an exploded view of the antenna module in FIG. 1 when the second substrate is not included;
- FIG. 4 is a structural diagram of another antenna module provided by an embodiment of the present invention.
- FIG. 5 is a structural diagram of another antenna module provided by an embodiment of the present invention.
- An embodiment of the present invention provides an antenna module. Please refer to FIGS. 1 to 5.
- the antenna module includes a first substrate 11, a second substrate 12, and a signal processing chip 13.
- the second substrate 12 and the The signal processing chip 13 is located on the same side of the first substrate 11, the side of the first substrate 11 opposite to the second substrate 12 is provided with a first antenna array 14, and the second substrate 12 carries a first antenna array 14
- Two antenna array 15 Two antenna array 15.
- the signal processing chip 13 may be an integrated circuit (IC) chip, and the signal processing chip 13 may include a transceiver, a power supply, and an RF front end (radio frequency front end, including a power amplifier, an antenna switch, and a filter). , Duplexer, low-noise amplifier, etc.) and other components.
- IC integrated circuit
- the antenna module includes a first substrate 11 and a second substrate 12.
- the first substrate 11 may be the main substrate of the antenna module, and the first substrate 11 may be provided with a metal ground layer to achieve The ground of the antenna module.
- the second substrate 12 and the signal processing chip 13 are both located on one side of the first substrate 11, and both the first substrate 11 and the second substrate 12 carry an antenna array.
- the antenna module can be deployed with two antenna arrays to realize dual-polarized MIMO of the two antenna arrays, which can effectively reduce the number of antenna modules in the electronic device, and is more conducive to the development of light and thin electronic devices.
- the first antenna array 14 and the second antenna array 15 are both formed by arranging multiple antenna element arrays.
- the number of antenna elements included in the first antenna array 14 and the number of antenna elements included in the second antenna array 15 may be The same can also be different.
- the first antenna array 14 includes four first antenna elements
- the second antenna array 15 includes four second antenna elements
- the four second antenna units are arranged in one-to-one correspondence.
- the thickness of the second substrate 12 is less than or equal to the thickness of the signal processing chip 13.
- the overall thickness of the antenna module is still the sum of the thickness of the first substrate 11 and the signal processing chip 13, and the arrangement of the second substrate 12 does not increase the overall thickness of the antenna module, which is more conducive to the antenna module.
- the layout of the group in electronic equipment is also conducive to the development of light and thin electronic equipment.
- the second substrate 12 is disposed on the side of the first substrate 11, and the position, shape, and size of the second substrate 12 on the first substrate 11 may be different based on specific conditions.
- the second substrate 12 and the signal processing chip 13 are arranged side by side on one side of the first substrate 11.
- the first substrate 11 includes a connected first surface 111 and a second surface 112
- the first surface 111 faces away from the second substrate 12
- the second substrate 12 includes a connected third surface 121 and a fourth surface 122
- the fourth surface 122 faces away from the first substrate 11, and the second surface 112 is flush with the third surface 121.
- the second antenna array 15 includes at least one antenna element, and each antenna element is in contact with at least the second surface 112 and the third surface 121.
- each antenna element of the second antenna array 15 will be in contact with the first substrate 11 and the second substrate 12, which is equivalent to adding the substrate for carrying the antenna array by providing the second substrate 12
- the total thickness of the second substrate 12 increases the distance from the ground of the second antenna array 15 carried by the second substrate 12, and at the same time, it can prevent the radiation direction from being blocked by peripheral devices, thereby improving the antenna efficiency and coverage.
- each second antenna element in the second antenna array 15 is collectively referred to as second antenna elements below.
- each second antenna element may cover the second surface 112 and the third surface 121; or, each second antenna element may cover the first surface 111, the second surface 112 and the third surface 121.
- each second antenna unit is bent and arranged, so that the second antenna unit is not completely arranged on the second substrate 12. Instead, it is in contact with both the first substrate 11 and the second substrate 12.
- the width of the second substrate 12 is small, through the bending arrangement of the second antenna unit, it can also carry the second antenna unit, which also makes the whole antenna module
- the width is the width of the first substrate 11, and the arrangement of the second substrate 12 does not increase the width and thickness of the antenna module, which is more conducive to the installation and layout of the antenna module in the electronic device.
- the second antenna array 15 includes at least one antenna element, the at least one antenna element is arranged in an array along the length direction of the second substrate 12, and the length of the second substrate 12 is greater than or equal to the first antenna element.
- the second antenna array 15 includes four second antenna elements.
- the four second antenna elements are arranged in a row along the length of the second substrate 12.
- the spacing between the two is equal.
- the distance between the left side of the leftmost second antenna unit and the right side of the rightmost second antenna unit is smaller than the length of the second substrate 12, so that the second substrate 12 can be better Play a bearing role for the second antenna unit to ensure the stability of the installation of the second antenna unit.
- the width of the second substrate 12 should be such that the second antenna element does not protrude beyond the second substrate 12, that is, the width of the portion of the second antenna element covering the fourth surface 122 is smaller than that of the second antenna element.
- the width of the substrate 12. It should be noted that the total width of the second antenna unit, that is, the sum of the widths of the portions of the second antenna unit covering the first surface 111, the second surface 112, the third surface 121, and the fourth surface 122, is the same as that of the first surface 111, second surface 112, third surface 121, and fourth surface 122.
- the working frequency band of the two antenna units is related; the lower the working frequency band of the second antenna unit, the larger the total width of the second antenna unit.
- the width of the second substrate 12 can be adjusted according to the width of the portion of the second antenna unit covered on the fourth surface 122; for example, the greater the width of the second antenna unit covered on the first surface 111, the greater the The width of the two antenna units covering the fourth surface 122 is also smaller, and the width of the second substrate 12 can be designed accordingly to be smaller, making the layout of the components on the signal processing chip 13 more flexible, but The width of the second substrate 12 is still sufficient to prevent the second antenna unit from protruding from the second substrate 12.
- the sum of the thicknesses of the first substrate 11 and the second substrate 12 is one-quarter to three-quarters of the length of the wavelength of the operating frequency band corresponding to the antenna module.
- the sum of the thickness of the first substrate 11 and the second substrate 12 may be a quarter of the length of the wavelength of the antenna module corresponding to the working frequency band, or the sum of the thickness of the first substrate 11 and the second substrate 12 may be the antenna module.
- the group corresponds to one-half the length of the wavelength of the working frequency band, or the sum of the thickness of the first substrate 11 and the second substrate 12 may be three-quarters the length of the wavelength of the corresponding working frequency band of the antenna module, and so on.
- the respective thicknesses of the first substrate 11 and the second substrate 12 can be set according to the working frequency band corresponding to the antenna module, so as to achieve better transmission and reception conversion efficiency of the antenna module.
- the antenna module may further include a reflector 17 located in the Between the second substrate 12 and the signal processing chip 13, and the reflector 17 is connected to the ground layer of the first substrate 11 or the ground layer of the second substrate 12.
- the ground layer of the first substrate 11 may refer to a metal layer provided on the first substrate 11 so that the first substrate 11 realizes the grounding function
- the ground layer of the second substrate 12 may also refer to a metal layer provided on the second substrate. 12 on a metal layer.
- the reflector 17 is connected to the ground layer to realize the grounding of the reflector 17.
- the reflector 17 is disposed between the second substrate 12 and the signal processing chip 13 and serves as the antenna reflection surface of the second antenna array 15 to ensure the signal receiving and transmitting effects of the second antenna array 15.
- the reflector 17 may be a metal plate, such as an aluminum plate, a copper plate, or a titanium plate.
- the reflector 17 includes via holes (not shown in the figure) arranged in an array, the via holes include a first hole and a second hole that are conductive, and the first hole faces the signal processing chip 13, and The second aperture faces the second substrate 12.
- the reflector 17 is a metal plate, and the metal plate is provided with a plurality of via holes, and the plurality of via holes are arranged in an array at a certain interval, for example, the interval between the via holes is 0.1-0.5 mm. In a preferred solution, the spacing between the via holes is 0.2 mm.
- the arrangement of the via holes can reduce the weight of the reflector 17, which also reduces the weight of the antenna module, which is more conducive to the development of light and thin electronic devices.
- the antenna module can include three sets of antenna arrays at the same time, which increases the channel capacity of the antenna module and reduces the number of antenna modules in the electronic device. , Which is more conducive to the development of thin and light electronic equipment.
- the second antenna array 15 is disposed on the surface of the second substrate 12 facing away from the first substrate 11. That is to say, the second antenna elements in the second antenna array 15 are not arranged by bending, but are laid flat on the second substrate 12.
- the first substrate 11 is used as the antenna reflecting surface of the second antenna array 15, and there is no need to provide an additional reflector, which makes the overall structure of the antenna module simpler, and can also achieve two Dual-polarization MIMO for antenna arrays.
- the arrangement direction of the antenna elements in the second antenna array 15 is consistent with the length extension direction of the second substrate 12. As shown in FIG. 4, the second substrate 12 and the signal processing chip 13 are arranged side by side, the second antenna array 15 includes six second antenna elements, and the six second antenna elements are arranged in one in the length direction of the second substrate 12. Row.
- the second antenna array 15 is also disposed on the surface of the second substrate 12 facing away from the first substrate 11.
- the second substrate 12 and the signal processing chip 13 are arranged side by side.
- the second antenna array 15 includes four second antenna elements, and the four second antenna elements are arranged in a 2 ⁇ 2 array.
- FIGS. 4 and 5 eliminate the need for the second antenna unit to be bent, and the position, shape and size of the second substrate 12 are also more flexible, so that the second substrate 12 can be used according to requirements.
- the antenna module provided by the present invention may also include a board-to-board (BTB) connector.
- the BTB connector 16 is arranged on one side of the first substrate 11 and on the same side as the second substrate 12 and the signal processing chip 13.
- the embodiment of the present invention also provides an electronic device that includes all the technical features of the antenna module described in the above embodiment and can achieve the same technical effect. To avoid repetition, the details are not repeated here.
- Electronic devices may include: mobile phones, tablet computers, e-book readers, MP3 players, MP4 players, digital cameras, laptop computers, car computers, desktop computers, set-top boxes, smart TVs, wearable devices, etc.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
- Aerials With Secondary Devices (AREA)
- Support Of Aerials (AREA)
Abstract
Description
Claims (10)
- 一种天线模组,包括第一基板、第二基板和信号处理芯片,所述第二基板和所述信号处理芯片位于所述第一基板的同一侧,所述第一基板的背对所述第二基板的一侧设有第一天线阵列,所述第二基板承载有第二天线阵列。
- 根据权利要求1所述的天线模组,其中,所述第一基板与所述第二基板的厚度之和为所述天线模组对应工作频段波长的四分之一长度至四分之三长度。
- 根据权利要求1所述的天线模组,其中,所述第二基板的厚度小于或等于所述信号处理芯片的厚度。
- 根据权利要求1所述的天线模组,其中,所述第一基板包括相连接的第一表面及第二表面,所述第一表面背对所述第二基板,所述第二基板包括相连接的第三表面及第四表面,所述第四表面背对所述第一基板,所述第二表面与所述第三表面相平齐;所述第二天线阵列包括至少一个天线单元,每一个天线单元至少与所述第二表面及所述第三表面相接触。
- 根据权利要求4所述的天线模组,其中,所述第四表面上还设有第三天线阵列。
- 根据权利要求4所述的天线模组,其中,所述第二基板及所述信号处理芯片相对于所述第一基板同层设置,所述天线模组还包括反射体,所述反射***于所述第二基板与所述信号处理芯片之间,且所述反射体与所述第一基板的接地层或所述第二基板的接地层连接。
- 根据权利要求6所述的天线模组,其中,所述反射体上设置有阵列排布的过孔,所述过孔包括导通的第一孔口和第二孔口,所述第一孔口朝向所述信号处理芯片,所述第二孔口朝向所述第二基板。
- 根据权利要求1所述的天线模组,其中,所述第二天线阵列设置于所述第二基板的背对所述第一基板的表面上。
- 根据权利要求1所述的天线模组,其中,所述天线模组还包括板对板BTB连接器,所述BTB连接器设置在所述第一基板的一侧,且与所述第二基 板及所述信号处理芯片位于同一侧。
- 一种电子设备,包括如权利要求1-9中任一项所述的天线模组。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21788329.7A EP4138213A4 (en) | 2020-04-13 | 2021-04-07 | ANTENNA MODULE AND ELECTRONIC DEVICE |
JP2022562604A JP7480341B2 (ja) | 2020-04-13 | 2021-04-07 | アンテナモジュール及び電子機器 |
KR1020227039371A KR102675845B1 (ko) | 2020-04-13 | 2021-04-07 | 안테나 모듈 및 전자 장치 |
US17/965,572 US20230030798A1 (en) | 2020-04-13 | 2022-10-13 | Antenna Module and Electronic Device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202010283862.5 | 2020-04-13 | ||
CN202010283862.5A CN111430884B (zh) | 2020-04-13 | 2020-04-13 | 一种天线模组及电子设备 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US17/965,572 Continuation US20230030798A1 (en) | 2020-04-13 | 2022-10-13 | Antenna Module and Electronic Device |
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WO2021208785A1 true WO2021208785A1 (zh) | 2021-10-21 |
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ID=71558162
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PCT/CN2021/085810 WO2021208785A1 (zh) | 2020-04-13 | 2021-04-07 | 一种天线模组及电子设备 |
Country Status (6)
Country | Link |
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US (1) | US20230030798A1 (zh) |
EP (1) | EP4138213A4 (zh) |
JP (1) | JP7480341B2 (zh) |
KR (1) | KR102675845B1 (zh) |
CN (1) | CN111430884B (zh) |
WO (1) | WO2021208785A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4213302A1 (en) * | 2022-01-14 | 2023-07-19 | MediaTek Inc. | Antenna module and method for manufacturing the same |
Families Citing this family (2)
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CN111430884B (zh) * | 2020-04-13 | 2021-07-20 | 维沃移动通信有限公司 | 一种天线模组及电子设备 |
CN115579622A (zh) * | 2021-06-21 | 2023-01-06 | Oppo广东移动通信有限公司 | 天线装置及电子设备 |
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CN111430884A (zh) * | 2020-04-13 | 2020-07-17 | 维沃移动通信有限公司 | 一种天线模组及电子设备 |
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KR101119603B1 (ko) * | 2009-12-22 | 2012-03-06 | 주식회사 이엠따블유 | 안테나 장치 |
CN102522634B (zh) * | 2011-12-13 | 2015-04-15 | 华为技术有限公司 | 天线装置、基站及通信*** |
US8760352B2 (en) * | 2012-03-30 | 2014-06-24 | Htc Corporation | Mobile device and antenna array thereof |
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2020
- 2020-04-13 CN CN202010283862.5A patent/CN111430884B/zh active Active
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2021
- 2021-04-07 WO PCT/CN2021/085810 patent/WO2021208785A1/zh active Application Filing
- 2021-04-07 KR KR1020227039371A patent/KR102675845B1/ko active IP Right Grant
- 2021-04-07 EP EP21788329.7A patent/EP4138213A4/en active Pending
- 2021-04-07 JP JP2022562604A patent/JP7480341B2/ja active Active
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Cited By (2)
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EP4213302A1 (en) * | 2022-01-14 | 2023-07-19 | MediaTek Inc. | Antenna module and method for manufacturing the same |
TWI836857B (zh) * | 2022-01-14 | 2024-03-21 | 聯發科技股份有限公司 | 天線模組及用於製造天線模組的方法 |
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EP4138213A4 (en) | 2023-09-06 |
JP2023521434A (ja) | 2023-05-24 |
CN111430884B (zh) | 2021-07-20 |
JP7480341B2 (ja) | 2024-05-09 |
KR102675845B1 (ko) | 2024-06-18 |
US20230030798A1 (en) | 2023-02-02 |
EP4138213A1 (en) | 2023-02-22 |
KR20220166344A (ko) | 2022-12-16 |
CN111430884A (zh) | 2020-07-17 |
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