WO2021206198A1 - Led lighting having easy-to-assemble radiation fins directly attached to metal pcb - Google Patents

Led lighting having easy-to-assemble radiation fins directly attached to metal pcb Download PDF

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Publication number
WO2021206198A1
WO2021206198A1 PCT/KR2020/004881 KR2020004881W WO2021206198A1 WO 2021206198 A1 WO2021206198 A1 WO 2021206198A1 KR 2020004881 W KR2020004881 W KR 2020004881W WO 2021206198 A1 WO2021206198 A1 WO 2021206198A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
metal pcb
fastening
dissipation fin
adhesive
Prior art date
Application number
PCT/KR2020/004881
Other languages
French (fr)
Korean (ko)
Inventor
유봉조
Original Assignee
주식회사 엠티티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엠티티 filed Critical 주식회사 엠티티
Priority to PCT/KR2020/004881 priority Critical patent/WO2021206198A1/en
Publication of WO2021206198A1 publication Critical patent/WO2021206198A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lighting in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB. It relates to an LED lighting in which an easy-to-assemble heat dissipation fin having a simple manufacturing process, high heat dissipation performance, and high fixing force is directly attached to a metal PCB.
  • LED lighting is a lighting device using light emitting diodes, and has characteristics such as low power and long lifespan and is widely used.
  • heat radiation is a very important factor because heat dissipation due to heat is a determining factor in the lifespan of the LED.
  • heat dissipation means such as heat dissipation fins, heat sinks, heat pipes, etc. are used to effectively dissipate heat generated by the LED, and the embodiments are as follows.
  • the LED lighting device having a conventional natural convection heat dissipation structure includes a PCB substrate 100 , an LED device 200 , and a heat sink 300 . ) is included. A plurality of LED devices 200 are mounted and arranged on one surface of the PCB substrate 100, and a heat sink made of a metal material that absorbs heat emitted from the LED device 200 on the back surface of the PCB substrate 100 ( 300) is combined.
  • the heat sink 300 is made of the same flat plate as the PCB substrate 100 so that the upper surface is in surface contact with the PCB substrate 100, and the LED element ( 200) are formed through fastening holes 310 and 110, and the heat sink 300 and the PCB substrate 100 are coupled by bolts 500 fastened to the fastening holes 310 and 110.
  • both sides of the upper surface of the heat sink 300 may further include heat dissipation fins 900 for dissipating the radiant heat of the upper surface, and the heat dissipation fins 900 include the heat sink 300 and the heat sink 300 . It can be seen that the PCB substrate 100 is fastened by the bolts 500 .
  • Patent Document 1 Republic of Korea Patent Publication No. 10-2018-0086119 (published on July 30, 2018)
  • the present invention has been devised to solve the above problems, and by directly connecting the heat dissipation fin to the metal PCB on which the LED element is formed, the manufacturing process is simple, and the heat dissipation fin with high heat dissipation efficiency is directly attached to the metal PCB.
  • the purpose is to provide lighting.
  • a metal PCB having an LED element formed on one side thereof is formed around the other side of the metal PCB, , coupled to the metal PCB through a fastening screw, a fastening female screw bar forming a fastening line between the metal PCB and a fastening protrusion fitted to the fastening line is formed, and one side is the other side and the surface of the metal PCB It may be characterized in that it comprises a heat dissipation fin in contact.
  • the LED lighting in which the heat dissipation fin is directly attached to the metal PCB is applied to the heat dissipation fin and further comprises an adhesive for bonding one side of the heat dissipation fin to the other side of the metal PCB. It can be characterized by being made.
  • the heat dissipation fin may further include an adhesive avoidance hole formed at a predetermined interval on one side of the heat dissipation fin and discharging the adhesive.
  • the heat dissipation fin may further include an adhesive accommodating part formed on one side of the heat dissipation fin at a predetermined interval and protruding toward the other side of the heat dissipation fin by a predetermined distance to accommodate the adhesive.
  • the heat dissipation fin is formed to extend from the contact heat dissipation unit in the other direction of the contact heat dissipation unit in surface contact with the other side of the metal PCB, and comprises a length dissipation unit having a predetermined length.
  • the length heat dissipation part may be formed by cutting a certain length at regular width intervals, and twisting one side and the other side at different angles with respect to the center in the plane direction.
  • An LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB is a method for manufacturing an outdoor LED lighting, and is fastened to the other side of the metal PCB in which an LED element is formed on one side
  • a first fastening step of loosely fastening a female screw bar with a fastening screw to form a fastening line, an assembling step of inserting one or more heat dissipation fins having a fastening protrusion formed on the fastening line, and tightening the fastening screw to the metal PCB, the heat dissipation pin and the fastening female screw It may be characterized in that it comprises a secondary fastening step of tightening the bar.
  • an adhesive on one side of the heat dissipation fin touching the other side of the metal PCB may be characterized in that it further comprises a first adhesive application step of applying the.
  • An LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to another embodiment of the present invention, in the method for manufacturing an outdoor LED lighting, on the other side of the metal PCB in which an LED element is formed on one side,
  • an adhesive is applied to one side of the heat dissipation fin touching the other side of the metal PCB just before the arrangement step It may be characterized in that it further comprises a second adhesive application step.
  • the LED lighting in which the heat radiation fins are directly attached to the metal PCB which is easy to assemble, by directly connecting the heat radiation fins to the metal PCB where the LED element is formed, has the effect of simplifying the manufacturing process and increasing the heat radiation efficiency. have.
  • the pattern work of forming a pattern on one side of the metal PCB for the operation of the LED element is not hindered by the position of the PCB fastening hole for coupling between the components, so that the work is easy.
  • FIG. 1 is a perspective view of an LED lighting device having a conventional natural convection heat dissipation structure
  • FIG. 2 is a perspective view showing a state in which a plurality of heat dissipation fins are arranged at regular intervals on the upper surface of a heat sink of an LED lighting device having a conventional natural convection heat dissipation structure;
  • FIG. 3 is a perspective view of an LED light in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
  • FIG. 4 is an exploded view of the LED lighting in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
  • FIG. 5 is a cross-sectional view of the right side of the LED lighting in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
  • FIG. 6 is an enlarged view of the LED lighting in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
  • FIG. 7 is a perspective view of a heat dissipation fin according to an embodiment of the present invention.
  • FIG. 8 is a perspective view of a heat dissipation fin according to another embodiment of the present invention.
  • FIG. 9 is a flowchart of an LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention.
  • FIG. 10 is a flowchart of an LED lighting manufacturing method in which heat dissipation fins, which are easy to assemble, are directly attached to a metal PCB according to another embodiment of the present invention
  • metal PCB 210 LED element
  • fastening screw 320 female thread hole
  • first leg 452 second leg
  • a fastening protrusion 430 fitted to the fastening line 330 is formed, and one side of the metal PCB 200 is in surface contact with the other side of the metal PCB 200 , and the contact heat dissipation is in surface contact with the other side of the metal PCB 200 .
  • the portion 440, the heat dissipation fin support 460 formed in the other direction of the contact heat dissipation unit 440, and the heat dissipation fin support 460 toward the other direction of the metal PCB 200 are formed to extend a certain length, a heat dissipation fin 400 comprising a length heat dissipating portion 450 which is cut at a predetermined width at a predetermined width and is twisted at different angles on one side and the other side with respect to the center of the plane direction;
  • the heat dissipation fin 400 is
  • One or more adhesive avoidance holes 410 for discharging the adhesive 500 are formed on one side of the heat dissipation fin 400 at regular intervals, so that the adhesive 500 does not flow out of the contact heat dissipation unit 440 and avoids the adhesive It is discharged to the hole 410 to increase the fixing force,
  • the fastening female screw bar 300 is
  • the middle is formed in a bent 'L' shape, and the lower end (A) of one side corresponds to the arc-shaped gap groove 470 between the fastening protrusion 430 and the heat dissipation fin support 460 in an arc shape and is inserted into contact.
  • the other side (B) is fixed while in surface contact with the heat dissipation fin support 460 to facilitate installation,
  • the fastening screw 310 is
  • the metal PCB 200 and the fastening female screw bar 300 are continuously penetrated and fastened, and one lower end (A) and the other side (B) of the fastening female screw bar 300 are closely coupled to the heat dissipation fin support 460 by the fastening force, respectively. characterized in that it becomes possible.
  • the LED lighting 100 to which the heat dissipation fins of the present invention are directly attached to the metal PCB are outdoor LED lighting, the metal PCB 200 in which the LED element 210 is formed on one side. ), formed around the other side of the metal PCB 200, coupled through the metal PCB 200 and the fastening screw 310, and forming a fastening line 330 between the metal PCB 200 and the A fastening protrusion 430 fitted to the fastening female screw bar 300 and the fastening line 330 is formed, and one side of the metal PCB 200 includes a heat dissipation fin 400 that is in surface contact with the other side of the PCB 200 . characterized.
  • the LED element 210 is configured to emit light, and the operation occurs by receiving an electrical signal through a pattern engraved on one side of the metal PCB 200 , and depending on the requirements of the installation environment, It is preferable that the LED elements 210 are installed on the metal PCB 200 .
  • the metal PCB 200 is preferably formed so that the LED element 210 is installed on one side, and a center or a certain part is penetrated so that power can be supplied to the LED element 210 from an external power source.
  • the fastening screw 310 is configured to fix the metal PCB 200, the fastening female screw bar 300, and the heat dissipation fin 400 to each other, and the head of the fastening screw 310 is the metal PCB 200.
  • the body portion engraved with a thread is inserted into the PCB fastening hole 220 and the fastening female screw bar 300 .
  • the heat dissipation fin 400 is configured to receive heat generated from the LED element 210 through the metal PCB 200 and radiate it to the outside, and one side is in surface contact with the other side of the metal PCB 200 , , preferably made of a metal plate formed so that the other side is bent and extended in the other side direction of the metal PCB (200).
  • one or more heat dissipation fins 400 may be installed depending on the size of the metal PCB 200 , and when a plurality of heat dissipation fins 400 are installed, they are preferably installed with a predetermined interval therebetween.
  • the heat dissipation fin 400 is preferably installed so as not to block the penetrating portion when the center or a certain portion of the metal PCB 200 is penetrated so that power can be supplied to the LED element 210 from an external power source.
  • the LED lighting 100 to which the heat dissipation fin of the present invention is directly attached to the metal PCB is applied to the heat dissipation fin 400 and is on the other side of the metal PCB 200 of the heat dissipation fin 400 .
  • An adhesive 500 for adhering one side may be further included.
  • the adhesive 500 is configured to bond the metal PCB 200 and the heat radiation fin 400 to each other, and any material can be applied as long as it is an adhesive material that can attach the metal PCB 200 and the heat radiation fin 400 possible.
  • any material can be applied as long as it is an adhesive material that can attach the metal PCB 200 and the heat radiation fin 400 possible.
  • silicone, thermal conductive grease, or the like may be used.
  • the fastening female screw bar 300 is formed in a 'L' shape in which the middle is bent, and one lower end (A) and the other side (B) are rounded so that the fastening protrusion 430 is performed.
  • One lower end (A) corresponds to the arc shape and is inserted into contact with the gap groove 470 between the and the heat dissipation fin support 460, and the other side (B) is fixed while being in surface contact with the heat dissipation fin support 460 to facilitate installation.
  • the fastening screw 310 has a structure in which the metal PCB 200 and the fastening female screw bar 300 are continuously penetrated to one side of the heat dissipation fin support 460 and are fastened.
  • the metal PCB 200 is formed around the metal PCB 200, and the metal PCB 200 includes a PCB fastening hole 220 into which the fastening screw 310 is inserted.
  • the PCB fastening hole 220 is not disturbed by the position of the PCB fastening hole 220 to form a pattern on one side of the metal PCB 200 for the operation of the LED element 210, The effect is that the work is easy.
  • the fastening female screw bar 300 presses the metal PCB 200 and the heat dissipation fin 400 through coupling with the fastening screw 310 to fix the metal PCB 200 and the heat dissipation fin 400 to each other.
  • a female screw hole 330 for screwing with the fastening screw 310 is formed.
  • the fastening line 330 is, when the PCB fastening hole 220 and the female screw hole 330 have concentricity for the connection of the fastening female screw bar 300 and the metal PCB 200, the fastening female screw bar As a space formed between 300 and the metal PCB 200, a fastening protrusion 430 formed on one side or the other end in the longitudinal direction of one side of the heat dissipation fin 400 is inserted, the metal PCB 200, the heat dissipation fin The coupling of 400 and the fastening female screw bar 300 is possible.
  • the fastening line 330 is also formed as a pair, and at this time, the fastening protrusions 430 formed at both ends in the longitudinal direction of one side of the heat dissipation fin 400 are one The pair of fastening lines 330 are fitted.
  • the heat dissipation fin 400 may further include an adhesive avoidance hole 410 formed on one side of the heat dissipation fin 400 at a predetermined interval and discharging the adhesive 500 . have.
  • the adhesive avoidance hole 410 is the adhesive 500 applied to the heat dissipation fin 400 when the heat dissipation fin 400 is attached to the other side of the metal PCB 200 using the adhesive 500 .
  • the adhesive 500 is applied thinner between the heat dissipation fin 400 and the metal PCB 200 at the same time as it is discharged to the adhesive avoidance hole 410 without flowing out of the contact heat dissipation part 440 to increase the fixing force. has the effect of making it possible.
  • the adhesive avoidance hole 410 is formed in a circular shape as shown, and any shape capable of discharging the adhesive 500 penetrates through one side of the heat dissipation fin 400 in any shape. can be formed.
  • one or more heat dissipation fins 400 are formed at a predetermined interval on one side of the heat dissipation fin 400 , and protrude a predetermined distance toward the other side of the heat dissipation fin 400 to accommodate the adhesive 500 . It may be made to further include an adhesive receiving portion (420).
  • the adhesive accommodating part 420 is configured to attach the heat dissipation fin 400 to the metal PCB 200 by filling the adhesive 500 to the adhesive accommodating part 420 , and in this case, the adhesive receiving part 420 ), it is preferable not to apply the adhesive 500 on one side of the heat dissipation fin 400 .
  • the adhesive receiving portion 420 is formed in the shape of a rectangular enclosure with one side open, and it is only an embodiment, and any shape that can accommodate the adhesive 500 may be formed.
  • the heat dissipation fin 400 has one side surface-contacting the other side of the metal PCB 200, but a contact heat dissipation unit that is in surface contact with the other side of the metal PCB 200 ( 440), the heat dissipation fin support 460 formed in the other direction of the contact heat dissipation part 440, and the heat dissipation fin support 460 in the other direction of the metal PCB 200 are formed to extend by a predetermined length and have a predetermined width. A predetermined length is cut at intervals, and one side and the other side are twisted at different angles based on the center in the plane direction, and the length radiating part 450 may be included.
  • the contact heat dissipation unit 440 may be formed in contact with the other side of the metal PCB 200 and the entire surface thereof, in which case, one or the other or both ends of the contact heat dissipation unit 440 in the longitudinal direction protrude.
  • the fastening protrusion 430 fitted to the fastening line 330 is formed.
  • the length heat dissipation unit 450 is configured to receive heat generated from the LED element 210 through the contact heat dissipation unit 440 in contact with the metal PCB 200 and radiate it to the outside, and the length heat dissipation unit ( 450) is formed to extend from one or the other end in the width direction of the contact heat dissipation part 440 in the other direction of the metal PCB 200 to form a wide surface.
  • the length of the heat dissipation part 450 may be characterized in that a predetermined length is cut at a predetermined width interval, and one side and the other side are twisted at different angles with respect to the center in the plane direction.
  • the length heat dissipation part 450 may include a first leg part 451 and a second leg part 452, and although not shown, may be formed in a shape having three or more different angles. .
  • an LED element in the method for manufacturing an LED lighting 100 in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention, in the method for manufacturing an outdoor LED lighting, an LED element ( The first fastening step (S100) of loosely fastening the fastening female screw bar 300 to the other side of the metal PCB 200 on which the 210 is formed with the fastening screw 310 to form the fastening line 330 (S100), the fastening line Assembling step (S300) of inserting one or more heat dissipation fins 400 having fastening protrusions 430 formed therein (330) and tightening the fastening screws 310 to the metal PCB 200, the heat dissipation fins 400 and the fastening female screws It may be characterized in that it comprises a secondary fastening step (S400) of tightening the bar (300).
  • S400 secondary fastening step
  • the fastening line ( 330) is formed.
  • the heat dissipation fin 400 is inserted from one end of the fastening line 330 and moved to the other side of the fastening line 330 to adjust its position, and the fastening line 330 ) may be inserted from the other end and moved to one side of the fastening line 330 to adjust the position.
  • the heat dissipation fin 400 is a penetration portion formed on the metal PCB 200 . It is desirable to be installed so as not to block the
  • the fastening screw 310 is screwed with the female screw hole 320 formed in the fastening female screw bar 300, so that the metal PCB 200, the heat dissipation fin 400 and the fastening are performed.
  • the step of coupling the female screw bar 300 to each other it is preferable to fix the heat sink to the metal PCB 200 so that the heat sink can be in close contact with each other.
  • the other side of the metal PCB 200 is A first adhesive application step (S200) of applying an adhesive 500 to one side of the heat dissipation fin 400 in contact with the side may be further included.
  • the adhesive 500 it is preferable to apply the adhesive 500 thinly to one side of the heat dissipation fin 400, but an adhesive receiving part 420 is formed on one side of the heat dissipation fin 400 If necessary, it is preferable to inject the adhesive 500 only to the adhesive receiving part 420 so that the adhesive 500 is not applied to one side of the heat dissipation fin 400 except for the adhesive receiving part 420 . do.
  • the LED 100 manufacturing method in which the heat dissipation fin 400 is directly attached to the metal PCB 200 is a method of manufacturing an outdoor LED lighting, wherein the LED on one side Arrangement step ( S210) and a fastening female screw bar 300 formed around the other side of the metal PCB 200 to form a fastening line 330 into which the fastening protrusion 430 is fitted is connected to the metal PCB 200 and a fastening screw ( It is characterized in that it comprises a single fastening step (S310) of screw fastening through 310).
  • a plurality of the heat dissipation fins 400 are arranged in parallel at a predetermined distance from each other, and at this time, the fastening protrusion 430 is the metal PCB on which the fastening female screw bar 300 is installed ( 200) is preferably located around the other side.
  • the PCB In the single fastening step (S310), in a state in which the PCB fastening hole 220 formed on the metal PCB 200 and the female screw hole 320 formed in the fastening female screw bar 300 are concentric, the PCB In the step of inserting the fastening screw 310 into the fastening hole 220 and the female screw hole 320, at this time, the fastening line formed in the space between the metal PCB 200 and the fastening female screw bar 300 ( It is characterized in that a plurality of the fastening protrusions 430 are fitted to the 330).
  • the second adhesive application step (S110) it is preferable to apply the adhesive thinly to one side of the heat dissipation fin 400, but when the adhesive receiving part 420 is formed on one side of the heat dissipation fin 400, It is preferable to inject the adhesive 500 only into the adhesive receiving part 420 so that the adhesive 500 is not applied to one side of the heat dissipation fin 400 except for the adhesive receiving part 420 .
  • the second adhesive application step ( S110 ) it is preferable to attach the heat dissipation fin 400 to the other side of the metal PCB 200 and then apply pressure to increase the adhesive force.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention has been made to solve a problem, and it is the objective of the present invention to provide LED lighting having an easy-to-assemble radiation fins directly attached to a metal PCB, wherein radiation fins are directly connected to a metal PCB on which LED elements are provided, thereby simplifying the manufacturing process and improving the heat-dissipation efficiency. In order to accomplish the above-mentioned objective, the present invention provides LEDs directly attached to a metal PCB, and a method for manufacturing same, an outdoor LED lighting comprising: a metal PCB having LED elements on one surface thereof; and radiation fins disposed around the other surface of the metal PCB and coupled to the metal PCB through fastening screws, the radiation fins having a fastening female-screw bar for forming a fastening line between same and the metal PCB, fastening protrusions formed to be fitted to the fastening line, and one surface configured to make surface contact with the other surface of the metal PCB.

Description

조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명LED lighting with easy-to-assemble heat dissipation fins directly attached to the metal PCB
본 발명은 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명에 관한 것으로, 더욱 상세하게는 LED 소자가 형성되는 메탈 PCB과 LED 소자의 열을 외부로 방출하는 방열핀이 단순한 방법을 통해 결합됨으로써, 제조 공정이 간단하고, 방열 성능이 높으며, 고정력이 높은 효과를 갖는 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명에 관한 것이다.The present invention relates to an LED lighting in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB. It relates to an LED lighting in which an easy-to-assemble heat dissipation fin having a simple manufacturing process, high heat dissipation performance, and high fixing force is directly attached to a metal PCB.
LED 조명은 발광 다이오드를 이용한 조명기구로서, 저전력 및 장수명과 같은 특징이 있어 널리 사용되고 있다.LED lighting is a lighting device using light emitting diodes, and has characteristics such as low power and long lifespan and is widely used.
LED는 열에 의한 방열이 수명 결정 요인이 되므로 LED 조명의 제조에 있어서, 방열은 매우 중요한 요소이다. In the LED lighting manufacturing, heat radiation is a very important factor because heat dissipation due to heat is a determining factor in the lifespan of the LED.
따라서, 기존에는 LED에서 발생하는 열을 효과적으로 방열하기 위하여 방열핀, 히트 싱크, 히트 파이프 등과 같은 방열 수단을 이용하고 있으며, 그 실시예는 다음과 같다.Therefore, in the prior art, heat dissipation means such as heat dissipation fins, heat sinks, heat pipes, etc. are used to effectively dissipate heat generated by the LED, and the embodiments are as follows.
대한민국 공개특허공보 제10-2018-0086119호를 참조하면, 도 1에 도시된 것과 같이 종래의 자연대류형 방열구조를 갖는 LED조명기구는 PCB기판(100), LED소자(200), 히트싱크(300)를 포함하여 구성된다. 상기 PCB기판(100)의 일면에는 다수의 LED소자(200)가 실장되어 배열되고, 상기 PCB기판(100)의 이면에는 상기 LED소자(200)에서 발산된 열을 흡수하는 금속 재질의 히트싱크(300)가 결합된다. 상기 히트싱크(300)는 PCB기판(100)에 면접촉 되도록 상면이 PCB기판(100)과 동일한 평판으로 이루어지고, 상기 히트싱크(300)의 상면과 상기 PCB기판(100)에는 상기 LED소자(200) 사이사이로 관통되는 체결공(310,110)이 형성되고, 상기 히트싱크(300)와 상기 PCB기판(100)은 상기 체결공(310,110)에 체결되는 볼트(500)에 의해 결합된다. 또한, 도2를 참조하면, 상기 히트싱크(300)의 상면 양측에는 상면의 복사열을 방열시키기 위한 방열핀(900)이 더 구비될 수 있으며, 상기 방열핀(900)은 상기 히트싱크(300)와 상기 PCB기판(100)을 체결하는 볼트(500)에 의해 체결됨을 알 수 있다.Referring to Korean Patent Application Laid-Open No. 10-2018-0086119, as shown in FIG. 1 , the LED lighting device having a conventional natural convection heat dissipation structure includes a PCB substrate 100 , an LED device 200 , and a heat sink 300 . ) is included. A plurality of LED devices 200 are mounted and arranged on one surface of the PCB substrate 100, and a heat sink made of a metal material that absorbs heat emitted from the LED device 200 on the back surface of the PCB substrate 100 ( 300) is combined. The heat sink 300 is made of the same flat plate as the PCB substrate 100 so that the upper surface is in surface contact with the PCB substrate 100, and the LED element ( 200) are formed through fastening holes 310 and 110, and the heat sink 300 and the PCB substrate 100 are coupled by bolts 500 fastened to the fastening holes 310 and 110. In addition, referring to FIG. 2 , both sides of the upper surface of the heat sink 300 may further include heat dissipation fins 900 for dissipating the radiant heat of the upper surface, and the heat dissipation fins 900 include the heat sink 300 and the heat sink 300 . It can be seen that the PCB substrate 100 is fastened by the bolts 500 .
그러나, 종래의 LED는 히트 싱크 베이스에 탭 가공을 하고, LED 소자가 형성되는 메탈PCB를 다수의 스크류로 고정하여 LED 소자에서 발생하는 열이 히트 싱크 베이스에 연결된 방열핀에 전달되도록 이루어져, 탭 가공을 고려하여 메탈PCB의 회로 패턴을 형성해야하고, 방열을 위한 구성과 체결 공정이 복잡하다는 문제점이 있었다.However, in the conventional LED, a tab processing is performed on the heat sink base, and the metal PCB on which the LED element is formed is fixed with a plurality of screws so that the heat generated from the LED element is transferred to the heat sink fin connected to the heat sink base. There was a problem in that the circuit pattern of the metal PCB had to be formed in consideration of this, and the configuration and fastening process for heat dissipation were complicated.
[선행기술문헌][Prior art literature]
(특허문헌 1) 대한민국 공개특허공보 제10-2018-0086119호 (공개일자 2018.07.30.)(Patent Document 1) Republic of Korea Patent Publication No. 10-2018-0086119 (published on July 30, 2018)
본 발명은 상기한 문제점을 해결하기 위하여 안출된 것으로, LED 소자가 형성되는 메탈 PCB에 방열핀을 직접 연결함으로써, 제조 공정이 단순하고, 방열 효율이 높은 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명을 제공하는데 그 목적이 있다.The present invention has been devised to solve the above problems, and by directly connecting the heat dissipation fin to the metal PCB on which the LED element is formed, the manufacturing process is simple, and the heat dissipation fin with high heat dissipation efficiency is directly attached to the metal PCB. The purpose is to provide lighting.
본 발명의 일 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명은, 실외 LED 조명에 있어서, 일측면에 LED 소자가 형성되는 메탈 PCB, 상기 메탈 PCB의 타측면 둘레에 형성되어, 상기 메탈 PCB와 체결나사를 통해 결합되고, 상기 메탈 PCB와 사이에 체결 라인을 형성하는 체결 암나사 바 및 상기 체결 라인에 끼워지는 체결 돌기가 형성되고, 일측면이 상기 메탈 PCB의 타측면과 면 접촉하는 방열핀을 포함하여 이루어지는 것을 특징으로 할 수 있다.The LED lighting in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention, in outdoor LED lighting, a metal PCB having an LED element formed on one side thereof, is formed around the other side of the metal PCB, , coupled to the metal PCB through a fastening screw, a fastening female screw bar forming a fastening line between the metal PCB and a fastening protrusion fitted to the fastening line is formed, and one side is the other side and the surface of the metal PCB It may be characterized in that it comprises a heat dissipation fin in contact.
더 나아가, 본 발명의 일 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명은, 상기 방열핀에 도포되어 상기 메탈 PCB의 타측면에 상기 방열핀의 일측면을 접착시키는 접착제를 더 포함하여 이루어지는 것을 특징으로 할 수 있다.Furthermore, the LED lighting in which the heat dissipation fin is directly attached to the metal PCB according to an embodiment of the present invention is applied to the heat dissipation fin and further comprises an adhesive for bonding one side of the heat dissipation fin to the other side of the metal PCB. It can be characterized by being made.
더 나아가, 상기 방열핀은, 상기 방열핀의 일측면에 일정 간격을 두고 하나 이상 형성되어, 접착제를 배출하는 접착제 회피홀을 더 포함하여 이루어지는 것을 특징으로 할 수 있다.Furthermore, the heat dissipation fin may further include an adhesive avoidance hole formed at a predetermined interval on one side of the heat dissipation fin and discharging the adhesive.
더 나아가, 상기 방열핀은, 상기 방열핀의 일측면에 일정 간격을 두고 하나 이상 형성되며, 상기 방열핀의 타측을 향해 일정 거리 돌출되어 접착제를 수용하는 접착제 수용부를 더 포함하여 이루어지는 것을 특징으로 할 수 있다.Furthermore, the heat dissipation fin may further include an adhesive accommodating part formed on one side of the heat dissipation fin at a predetermined interval and protruding toward the other side of the heat dissipation fin by a predetermined distance to accommodate the adhesive.
더 나아가, 상기 방열핀은 상기 메탈 PCB의 타측면과 면 접촉하는 접촉 방열부 및 상기 메탈 PCB의 타측 방향으로 상기 접촉 방열부로부터 연장 형성되고, 일정 길이를 가지는 길이 방열부를 포함하여 이루어지는 것을 특징으로 할 수 있다.Furthermore, the heat dissipation fin is formed to extend from the contact heat dissipation unit in the other direction of the contact heat dissipation unit in surface contact with the other side of the metal PCB, and comprises a length dissipation unit having a predetermined length. can
더 나아가, 상기 길이 방열부는 일정 너비 간격으로 일정 길이가 절삭되어, 면 방향을 중심을 기준으로 일측과 타측이 서로 다른 각도로 비틀어져 형성되는 것을 특징으로 할 수 있다.Furthermore, the length heat dissipation part may be formed by cutting a certain length at regular width intervals, and twisting one side and the other side at different angles with respect to the center in the plane direction.
본 발명의 일 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 제조 방법은, 실외 LED 조명을 제조하는 방법에 있어서, 일측면에 LED 소자가 형성되는 메탈 PCB의 타측면에 체결 암나사 바를 체결나사로 헐겁게 체결하여, 체결 라인을 형성하는 1차 체결 단계, 상기 체결 라인에 체결 돌기가 형성된 하나 이상의 방열핀을 끼워 넣는 조립 단계 및 상기 체결나사를 조여 상기 메탈 PCB, 상기 방열핀 및 상기 체결 암나사 바를 조이는 2차 체결 단계를 포함하여 이루어지는 것을 특징으로 할 수 있다.An LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention is a method for manufacturing an outdoor LED lighting, and is fastened to the other side of the metal PCB in which an LED element is formed on one side A first fastening step of loosely fastening a female screw bar with a fastening screw to form a fastening line, an assembling step of inserting one or more heat dissipation fins having a fastening protrusion formed on the fastening line, and tightening the fastening screw to the metal PCB, the heat dissipation pin and the fastening female screw It may be characterized in that it comprises a secondary fastening step of tightening the bar.
더 나아가, 본 발명의 일 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 제조 방법은, 상기 1차 체결 단계 직후, 상기 메탈 PCB의 타측면에 닿는 상기 방열핀의 일측면에 접착제를 도포하는 제1 접착제 도포 단계를 더 포함하여 이루어지는 것을 특징으로 할 수 있다.Furthermore, in the LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention, immediately after the first fastening step, an adhesive on one side of the heat dissipation fin touching the other side of the metal PCB It may be characterized in that it further comprises a first adhesive application step of applying the.
본 발명의 다른 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 제조 방법은, 실외 LED 조명을 제조하는 방법에 있어서, 일측면에 LED 소자가 형성되는 메탈 PCB의 타측면에, 상기 메탈 PCB의 타측면과 면 접촉하며, 체결 돌기가 형성된 다수개의 방열핀을 배열하는 배열 단계 및 상기 메탈 PCB의 타측면 둘레에 형성되어 상기 체결 돌기가 끼워지는 체결 라인을 형성하는 체결 암나사 바를 상기 메탈 PCB와 체결나사를 통해 나사 체결하는 단일 체결 단계를 포함하여 이루어지는 것을 특징으로 할 수 있다.An LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to another embodiment of the present invention, in the method for manufacturing an outdoor LED lighting, on the other side of the metal PCB in which an LED element is formed on one side, An arrangement step of arranging a plurality of heat dissipation fins in surface contact with the other side of the metal PCB and having fastening protrusions formed around the other side of the metal PCB to form a fastening line into which the fastening protrusions are fitted. It may be characterized in that it comprises a single fastening step of screwing through the PCB and fastening screws.
더 나아가, 본 발명의 다른 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 제조 방법은, 상기 배열 단계 직전, 상기 메탈 PCB의 타측면에 닿는 상기 방열핀의 일측면에 접착제를 도포하는 제2 접착제 도포 단계를 더 포함하여 이루어지는 것을 특징으로 할 수 있다.Furthermore, in the LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to another embodiment of the present invention, an adhesive is applied to one side of the heat dissipation fin touching the other side of the metal PCB just before the arrangement step It may be characterized in that it further comprises a second adhesive application step.
본 발명의 실시예에 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명은, LED 소자가 형성되는 메탈 PCB에 방열핀을 직접 연결함으로써, 제조 공정을 단순하게 하고, 방열 효율을 높일 수 있는 효과가 있다.In an embodiment of the present invention, the LED lighting in which the heat radiation fins are directly attached to the metal PCB, which is easy to assemble, by directly connecting the heat radiation fins to the metal PCB where the LED element is formed, has the effect of simplifying the manufacturing process and increasing the heat radiation efficiency. have.
또한, LED 소자의 작동을 위해 메탈 PCB의 일측면에 패턴을 형성하는 패턴 작업이 구성간의 결합을 위한 PCB 체결홀의 위치에 의해 방해받지 않아, 작업이 용이하다는 효과가 있다.In addition, the pattern work of forming a pattern on one side of the metal PCB for the operation of the LED element is not hindered by the position of the PCB fastening hole for coupling between the components, so that the work is easy.
도 1은 종래의 자연대류형 방열구조를 갖는 LED조명기구 사시도1 is a perspective view of an LED lighting device having a conventional natural convection heat dissipation structure;
도 2는 종래의 자연대류형 방열구조를 갖는 LED조명기구의 히트싱크 상면에 다수의 방열핀이 일정간격으로 배열된 상태를 도시한 사시도2 is a perspective view showing a state in which a plurality of heat dissipation fins are arranged at regular intervals on the upper surface of a heat sink of an LED lighting device having a conventional natural convection heat dissipation structure;
도 3은 본 발명의 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 사시도3 is a perspective view of an LED light in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
도 4는 본 발명의 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 분해도4 is an exploded view of the LED lighting in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
도 5는 본 발명의 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 우측 단면도5 is a cross-sectional view of the right side of the LED lighting in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
도 6은 본 발명의 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 확대도6 is an enlarged view of the LED lighting in which the heat dissipation fins of the present invention are directly attached to the metal PCB.
도 7은 본 발명의 일 실시예에 따른 방열핀 사시도7 is a perspective view of a heat dissipation fin according to an embodiment of the present invention;
도 8은 본 발명의 다른 실시예에 따른 방열핀 사시도8 is a perspective view of a heat dissipation fin according to another embodiment of the present invention;
도 9는 본 발명의 일 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 제조 방법 순서도9 is a flowchart of an LED lighting manufacturing method in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention;
도 10은 본 발명의 다른 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명 제조 방법 순서도10 is a flowchart of an LED lighting manufacturing method in which heat dissipation fins, which are easy to assemble, are directly attached to a metal PCB according to another embodiment of the present invention;
<도면의 주요부분에 대한 부호의 표시><Indication of Symbols for Main Parts of Drawings>
100 : 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명100: LED light with easy-to-assemble heat dissipation fins directly attached to the metal PCB
200 : 메탈 PCB 210 : LED 소자200: metal PCB 210: LED element
220 : PCB 체결홀 220: PCB fastening hole
300 : 체결 암나사 바300: fastening female thread bar
310 : 체결나사 320 : 암나사 홀310: fastening screw 320: female thread hole
330 : 체결 라인 330: fastening line
400 : 방열핀 410 : 접착제 회피홀400: heat dissipation fin 410: adhesive avoidance hole
420 : 접착제 수용부 430 : 체결 돌기420: adhesive receiving part 430: fastening protrusion
440 : 접촉 방열부 450 : 길이 방열부440: contact heat dissipation unit 450: length heat dissipation unit
451 : 제1각부 452 : 제2각부451: first leg 452: second leg
460 : 방열핀 지지대 470 : 틈새홈460: heat dissipation fin support 470: gap groove
500 : 접착제500: glue
S100 : 1차 체결 단계 S200 : 제1 접착제 도포 단계S100: first fastening step S200: first adhesive application step
S300 : 조립 단계 S400 : 2차 체결 단계S300: Assembly step S400: Second fastening step
S110 : 제2 접착제 도포 단계 S210 : 배열 단계S110: second adhesive application step S210: arrangement step
S310 : 단일 체결 단계S310: single fastening step
이하, 본 발명의 기술적 사상을 첨부된 도면을 사용하여 더욱 구체적으로 설명한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. Hereinafter, the technical idea of the present invention will be described in more detail with reference to the accompanying drawings. Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to their ordinary or dictionary meanings, and the inventor should properly understand the concept of the term in order to best describe his invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.
따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 변형 예들이 있을 수 있음을 이해하여야 한다.Therefore, the configuration shown in the embodiments and drawings described in the present specification is only the most preferred embodiment of the present invention and does not represent all of the technical spirit of the present invention, so at the time of the present application, various It should be understood that there may be variations.
이하, 본 발명의 기술적 사상을 첨부된 도면을 사용하여 더욱 구체적으로 설명한다. 첨부된 도면은 본 발명의 기술적 사상을 더욱 구체적으로 설명하기 위하여 도시한 일예에 불과하므로 본 발명의 기술적 사상이 첨부된 도면의 형태에 한정되는 것은 아니다.Hereinafter, the technical idea of the present invention will be described in more detail with reference to the accompanying drawings. Since the accompanying drawings are merely examples shown to explain the technical idea of the present invention in more detail, the technical idea of the present invention is not limited to the form of the accompanying drawings.
본 발명은 the present invention
실외 LED 조명에 있어서,In outdoor LED lighting,
일측면에 LED 소자(210)가 형성되는 메탈 PCB(200);a metal PCB 200 on which an LED element 210 is formed on one side;
상기 메탈 PCB(200)의 타측면 상단 및 하단에 형성되어, 상기 메탈 PCB(200)와 체결나사(310)를 통해 결합되고, 상기 메탈 PCB(200)와 사이에 체결 라인(330)을 형성하는 체결 암나사 바(300);It is formed on the upper and lower sides of the other side of the metal PCB 200, is coupled to the metal PCB 200 and through a fastening screw 310, and forms a fastening line 330 between the metal PCB 200 and the Fastening female thread bar (300);
상기 체결 라인(330)에 끼워지는 체결 돌기(430)가 형성되고, 일측면이 상기 메탈 PCB(200)의 타측면과 면 접촉하되, 상기 메탈 PCB(200)의 타측면과 면 접촉하는 접촉 방열부(440)와, 접촉 방열부(440)의 타측방향에 형성되는 방열핀 지지대(460)와, 상기 메탈 PCB(200)의 타측 방향을 향해 상기 방열핀 지지대(460)로부터 일정 길이로 연장 형성되며, 일정 너비 간격으로 일정 길이가 절삭되어, 면 방향을 중심을 기준으로 일측과 타측이 서로 다른 각도로 비틀어져 형성되는 길이 방열부(450)로 이루어지는 방열핀(400);A fastening protrusion 430 fitted to the fastening line 330 is formed, and one side of the metal PCB 200 is in surface contact with the other side of the metal PCB 200 , and the contact heat dissipation is in surface contact with the other side of the metal PCB 200 . The portion 440, the heat dissipation fin support 460 formed in the other direction of the contact heat dissipation unit 440, and the heat dissipation fin support 460 toward the other direction of the metal PCB 200 are formed to extend a certain length, a heat dissipation fin 400 comprising a length heat dissipating portion 450 which is cut at a predetermined width at a predetermined width and is twisted at different angles on one side and the other side with respect to the center of the plane direction;
상기 방열핀(400)에 도포되어 메탈 PCB(200)의 타측면에 상기 방열핀(400)의 일측면을 접착시키는 접착제(500);를 포함하여 이루어지며,An adhesive 500 applied to the heat dissipation fin 400 to adhere one side of the heat dissipation fin 400 to the other side of the metal PCB 200;
상기 방열핀(400)은The heat dissipation fin 400 is
상기 방열핀(400)의 일측면에 접착제(500)를 배출하는 접착제 회피홀(410)이 일정 간격을 두고 하나 이상 형성되어, 접착제(500)가 접촉 방열부(440) 외측으로 흘러내지 않고 접착제 회피홀(410)로 배출되어 고정력을 높일 수 있도록 하며,One or more adhesive avoidance holes 410 for discharging the adhesive 500 are formed on one side of the heat dissipation fin 400 at regular intervals, so that the adhesive 500 does not flow out of the contact heat dissipation unit 440 and avoids the adhesive It is discharged to the hole 410 to increase the fixing force,
상기 체결 암나사바(300)는The fastening female screw bar 300 is
중단이 절곡되는 'ㄱ'자 형태로 형성되고, 상기 체결돌기(430)와 방열핀 지지대(460) 사이 원호형상의 틈새홈(470)에 일측하단(A)이 원호 형태로 대응되며 끼워져 삽입접촉되며, 타측(B)은 방열핀 지지대(460)에 면접촉되면서 고정되어 설치가 용이토록 하고,The middle is formed in a bent 'L' shape, and the lower end (A) of one side corresponds to the arc-shaped gap groove 470 between the fastening protrusion 430 and the heat dissipation fin support 460 in an arc shape and is inserted into contact. , the other side (B) is fixed while in surface contact with the heat dissipation fin support 460 to facilitate installation,
상기 체결나사(310)는The fastening screw 310 is
상기 메탈 PCB(200)와 체결 암나사 바(300)를 연속관통하며 체결되되, 체결력에 의해 체결 암나사바(300)의 일측하단(A) 및 타측(B)이 방열핀 지지대(460)에 각각 밀착체결되도록 하는 것을 특징으로 한다.The metal PCB 200 and the fastening female screw bar 300 are continuously penetrated and fastened, and one lower end (A) and the other side (B) of the fastening female screw bar 300 are closely coupled to the heat dissipation fin support 460 by the fastening force, respectively. characterized in that it becomes possible.
도 3 및 4를 참조하면, 본 발명의 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명(100)은, 실외 LED 조명에 있어서, 일측면에 LED 소자(210)가 형성되는 메탈 PCB(200), 상기 메탈 PCB(200)의 타측면 둘레에 형성되어, 상기 메탈 PCB(200)와 체결나사(310)를 통해 결합되고, 상기 메탈 PCB(200)와 사이에 체결 라인(330)을 형성하는 체결 암나사 바(300) 및 상기 체결 라인(330)에 끼워지는 체결 돌기(430)가 형성되고, 일측면이 상기 메탈 PCB(200)의 타측면과 면 접촉하는 방열핀(400)을 포함하여 이루어지는 것을 특징으로 한다.Referring to FIGS. 3 and 4 , the LED lighting 100 to which the heat dissipation fins of the present invention are directly attached to the metal PCB are outdoor LED lighting, the metal PCB 200 in which the LED element 210 is formed on one side. ), formed around the other side of the metal PCB 200, coupled through the metal PCB 200 and the fastening screw 310, and forming a fastening line 330 between the metal PCB 200 and the A fastening protrusion 430 fitted to the fastening female screw bar 300 and the fastening line 330 is formed, and one side of the metal PCB 200 includes a heat dissipation fin 400 that is in surface contact with the other side of the PCB 200 . characterized.
도 4를 참조하면, 상기 LED 소자(210)는 빛을 발광하는 구성으로, 상기 메탈 PCB(200)의 일측면에 새겨진 패턴을 통해 전기 신호를 받아 작동이 일어나고, 설치 환경의 요구사항에 의해 다수개의 상기 LED 소자(210)가 상기 메탈 PCB(200)에 설치되는 것이 바람직하다.Referring to FIG. 4 , the LED element 210 is configured to emit light, and the operation occurs by receiving an electrical signal through a pattern engraved on one side of the metal PCB 200 , and depending on the requirements of the installation environment, It is preferable that the LED elements 210 are installed on the metal PCB 200 .
상기 메탈 PCB(200)는 일측면에 상기 LED 소자(210)가 설치되며, 중앙 또는 일정 부분이 관통되어 외부 전원으로부터 상기 LED 소자(210)로 전원 공급이 가능하도록 형성되는 것이 바람직하다. The metal PCB 200 is preferably formed so that the LED element 210 is installed on one side, and a center or a certain part is penetrated so that power can be supplied to the LED element 210 from an external power source.
상기 체결나사(310)는 상기 메탈 PCB(200), 상기 체결 암나사 바(300) 및 상기 방열핀(400)을 서로 고정시키는 구성으로, 상기 체결나사(310)의 머리 부분은 상기 메탈 PCB(200)의 일측면과 맞닿는 것이 바람직하고, 나사산이 새겨진 몸체 부분은 상기 PCB 체결홀(220) 및 상기 체결 암나사 바(300)에 삽입된다.The fastening screw 310 is configured to fix the metal PCB 200, the fastening female screw bar 300, and the heat dissipation fin 400 to each other, and the head of the fastening screw 310 is the metal PCB 200. Preferably, the body portion engraved with a thread is inserted into the PCB fastening hole 220 and the fastening female screw bar 300 .
상기 방열핀(400)은 상기 LED 소자(210)에서 발생하는 열을 상기 메탈 PCB(200)를 통해 전달받아 외부로 방출하는 구성으로, 일측면이 상기 메탈 PCB(200)의 타측면과 면 접촉 되며, 타측이 상기 메탈 PCB(200)의 타측 방향으로 꺾여 연장 되도록 형성되는 금속판으로 이루어지는 것이 바람직하다.The heat dissipation fin 400 is configured to receive heat generated from the LED element 210 through the metal PCB 200 and radiate it to the outside, and one side is in surface contact with the other side of the metal PCB 200 , , preferably made of a metal plate formed so that the other side is bent and extended in the other side direction of the metal PCB (200).
또한, 상기 방열핀(400)은 상기 메탈 PCB(200)의 크기에 따라 하나 이상 설치될 수 있으며, 다수개가 설치되는 경우, 일정 간격을 사이에 두고 설치되는 것이 바람직하다. In addition, one or more heat dissipation fins 400 may be installed depending on the size of the metal PCB 200 , and when a plurality of heat dissipation fins 400 are installed, they are preferably installed with a predetermined interval therebetween.
또한, 상기 방열핀(400)은 상기 메탈 PCB(200)의 중앙 또는 일정 부분이 외부 전원으로부터 상기 LED 소자(210)로 전원 공급이 가능하도록 관통되는 경우, 관통 부위를 막지 않도록 설치되는 것이 바람직하다.In addition, the heat dissipation fin 400 is preferably installed so as not to block the penetrating portion when the center or a certain portion of the metal PCB 200 is penetrated so that power can be supplied to the LED element 210 from an external power source.
도 5를 참조하면, 본 발명의 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명(100)은 상기 방열핀(400)에 도포되어 상기 메탈 PCB(200)의 타측면에 상기 방열핀(400)의 일측면을 접착시키는 접착제(500)를 더 포함하여 이루어질 수 있다.Referring to FIG. 5 , the LED lighting 100 to which the heat dissipation fin of the present invention is directly attached to the metal PCB is applied to the heat dissipation fin 400 and is on the other side of the metal PCB 200 of the heat dissipation fin 400 . An adhesive 500 for adhering one side may be further included.
상기 접착제(500)는 상기 메탈 PCB(200)와 상기 방열핀(400)을 서로 접착시키는 구성으로, 상기 메탈 PCB(200)와 상기 방열핀(400)을 부착할 수 있는 접착 물질이라면 어떠한 물질도 적용이 가능하다. 그 실시예로는 실리콘, 열전도 그리스 등이 사용될 수 있다.The adhesive 500 is configured to bond the metal PCB 200 and the heat radiation fin 400 to each other, and any material can be applied as long as it is an adhesive material that can attach the metal PCB 200 and the heat radiation fin 400 possible. As an example thereof, silicone, thermal conductive grease, or the like may be used.
도 6을 참조하면, 상기 체결 암나사바(300)는 중단이 절곡되는 'ㄱ'자 형태로 형성되고, 일측하단(A) 및 타측(B)은 라운딩처리되어 있도록 하되, 상기 체결돌기(430)와 방열핀 지지대(460) 사이의 틈새홈(470)에 일측하단(A)이 원호 형태로 대응되며 끼워져 삽입접촉되며, 타측(B)은 방열핀 지지대(460)에 면접촉되면서 고정되어 설치가 용이토록 하고, 상기 체결나사(310)는 상기 방열핀 지지대(460)의 일측까지 메탈 PCB(200)와 체결 암나사 바(300)를 연속관통하며 체결되는 구조를 가진다.Referring to FIG. 6 , the fastening female screw bar 300 is formed in a 'L' shape in which the middle is bent, and one lower end (A) and the other side (B) are rounded so that the fastening protrusion 430 is performed. One lower end (A) corresponds to the arc shape and is inserted into contact with the gap groove 470 between the and the heat dissipation fin support 460, and the other side (B) is fixed while being in surface contact with the heat dissipation fin support 460 to facilitate installation. And, the fastening screw 310 has a structure in which the metal PCB 200 and the fastening female screw bar 300 are continuously penetrated to one side of the heat dissipation fin support 460 and are fastened.
상기 메탈 PCB(200)는 상기 메탈 PCB(200)의 둘레에 형성되어 상기 메탈 PCB(200)는 상기 체결나사(310)가 삽입되는 PCB 체결홀(220)을 포함하여 이루어진다. 상기 PCB 체결홀(220)은 상기 LED 소자(210)의 작동을 위해 상기 메탈 PCB(200)의 일측면에 패턴을 형성하는 패턴 작업이 상기 PCB 체결홀(220)의 위치에 의해 방해받지 않아, 작업이 용이하다는 효과가 있다.The metal PCB 200 is formed around the metal PCB 200, and the metal PCB 200 includes a PCB fastening hole 220 into which the fastening screw 310 is inserted. The PCB fastening hole 220 is not disturbed by the position of the PCB fastening hole 220 to form a pattern on one side of the metal PCB 200 for the operation of the LED element 210, The effect is that the work is easy.
상기 체결 암나사 바(300)는 상기 메탈 PCB(200)와 상기 방열핀(400)을 상기 체결나사(310)와의 결합을 통해 압박하여, 상기 메탈 PCB(200)와 상기 방열핀(400)을 서로를 고정 시키는 구성으로, 상기 체결나사(310)와 나사 결합하는 암나사 홀(330)이 형성된다.The fastening female screw bar 300 presses the metal PCB 200 and the heat dissipation fin 400 through coupling with the fastening screw 310 to fix the metal PCB 200 and the heat dissipation fin 400 to each other. In this configuration, a female screw hole 330 for screwing with the fastening screw 310 is formed.
상기 체결 라인(330)은, 상기 체결 암나사 바(300)와 상기 메탈 PCB(200)의 연결을 위해 상기 PCB 체결홀(220)과 상기 암나사 홀(330)이 동심을 가질 때, 상기 체결 암나사 바(300)와 상기 메탈 PCB(200) 사이에 형성되는 공간으로, 상기 방열핀(400)의 일측면 길이방향 일측 또는 타측 끝단에 형성된 체결 돌기(430)가 끼워져, 상기 메탈 PCB(200), 상기 방열핀(400) 및 상기 체결 암나사 바(300)의 결합이 가능하게 된다. The fastening line 330 is, when the PCB fastening hole 220 and the female screw hole 330 have concentricity for the connection of the fastening female screw bar 300 and the metal PCB 200, the fastening female screw bar As a space formed between 300 and the metal PCB 200, a fastening protrusion 430 formed on one side or the other end in the longitudinal direction of one side of the heat dissipation fin 400 is inserted, the metal PCB 200, the heat dissipation fin The coupling of 400 and the fastening female screw bar 300 is possible.
상기 체결 암나사 바(300)가 한 쌍으로 이루어지는 경우, 상기 체결 라인(330) 또한 한 쌍으로 형성되며, 이때 상기 방열핀(400)의 일측면 길이방향 양측 끝단에 형성된 상기 체결 돌기(430)가 한 쌍의 상기 체결 라인(330)에 끼워진다.When the fastening female screw bar 300 is formed as a pair, the fastening line 330 is also formed as a pair, and at this time, the fastening protrusions 430 formed at both ends in the longitudinal direction of one side of the heat dissipation fin 400 are one The pair of fastening lines 330 are fitted.
도 7을 참조하면, 상기 방열핀(400)은, 상기 방열핀(400)의 일측면에 일정 간격을 두고 하나 이상 형성되어, 접착제(500)를 배출하는 접착제 회피홀(410)을 더 포함하여 이루어질 수 있다.Referring to FIG. 7 , the heat dissipation fin 400 may further include an adhesive avoidance hole 410 formed on one side of the heat dissipation fin 400 at a predetermined interval and discharging the adhesive 500 . have.
상기 접착제 회피홀(410)은 상기 접착제(500)를 이용하여 상기 방열핀(400)을 상기 메탈 PCB(200)의 타측면에 부착하는 경우, 상기 방열핀(400)에 도포되는 상기 접착제(500)가 접촉 방열부(440) 외측으로 흘러내지 않고 상기 접착제 회피홀(410)로 배출되어 고정력을 높이는 동시에, 상기 방열핀(400)과 상기 메탈 PCB(200) 사이에 상기 접착제(500)가 더 얇게 도포될 수 있도록 하는 효과가 있다.The adhesive avoidance hole 410 is the adhesive 500 applied to the heat dissipation fin 400 when the heat dissipation fin 400 is attached to the other side of the metal PCB 200 using the adhesive 500 . The adhesive 500 is applied thinner between the heat dissipation fin 400 and the metal PCB 200 at the same time as it is discharged to the adhesive avoidance hole 410 without flowing out of the contact heat dissipation part 440 to increase the fixing force. has the effect of making it possible.
상기 접착제 회피홀(410)은 도시된 바와 같이 원형으로 형성되는 것은 일 실시예에 불과하며, 상기 접착제(500)를 배출할 수 있는 형상이라면 어떠한 형상으로도 상기 방열핀(400)의 일측면에 관통되어 형성될 수 있다.It is only an embodiment that the adhesive avoidance hole 410 is formed in a circular shape as shown, and any shape capable of discharging the adhesive 500 penetrates through one side of the heat dissipation fin 400 in any shape. can be formed.
도 8을 참조하면, 상기 방열핀(400)은, 상기 방열핀(400)의 일측면에 일정 간격을 두고 하나 이상 형성되며, 상기 방열핀(400)의 타측을 향해 일정 거리 돌출되어 접착제(500)를 수용하는 접착제 수용부(420)를 더 포함하여 이루어질 수 있다.Referring to FIG. 8 , one or more heat dissipation fins 400 are formed at a predetermined interval on one side of the heat dissipation fin 400 , and protrude a predetermined distance toward the other side of the heat dissipation fin 400 to accommodate the adhesive 500 . It may be made to further include an adhesive receiving portion (420).
상기 접착제 수용부(420)는 상기 접착제(500)를 상기 접착제 수용부(420)에 채워 상기 메탈 PCB(200)에 상기 방열핀(400)을 부착시키는 구성으로, 이 때, 상기 접착제 수용부(420)를 제외한 상기 방열핀(400)의 일측면 상에는 상기 접착제(500)를 도포하지 않는 것이 바람직하다.The adhesive accommodating part 420 is configured to attach the heat dissipation fin 400 to the metal PCB 200 by filling the adhesive 500 to the adhesive accommodating part 420 , and in this case, the adhesive receiving part 420 ), it is preferable not to apply the adhesive 500 on one side of the heat dissipation fin 400 .
이러한 접착제 수용부(420) 구성을 통해서, 상기 메탈 PCB(200)와 상기 방열핀(400) 간의 고정력은 높이고, 상기 메탈 PCB(200)의 타측면과 상기 방열핀(400) 일측면이 직접 닿아 금속간의 열 전도성을 높이는 효과가 있다.Through this adhesive receiving part 420 configuration, the fixing force between the metal PCB 200 and the heat radiation fin 400 is increased, and the other side of the metal PCB 200 and one side of the heat radiation fin 400 are in direct contact with the metal It has the effect of increasing thermal conductivity.
상기 접착제 수용부(420)는 도시된 바와 같이 한 면이 개방된 사각의 함체 형상으로 형성되는 것은 일 실시예에 불과하며, 상기 접착제(500)를 수용할 수 있는 형상이라면 어떠한 형상으로도 형성될 수 있다.As shown in the figure, the adhesive receiving portion 420 is formed in the shape of a rectangular enclosure with one side open, and it is only an embodiment, and any shape that can accommodate the adhesive 500 may be formed. can
도 7 및 도 8을 참조하면, 상기 방열핀(400)은, 일측면이 상기 메탈 PCB(200)의 타측면과 면 접촉하되, 상기 메탈 PCB(200)의 타측면과 면 접촉하는 접촉 방열부(440)와, 접촉 방열부(440)의 타측방향에 형성되는 방열핀 지지대(460)와, 상기 메탈 PCB(200)의 타측 방향을 향해 상기 방열핀 지지대(460)로부터 일정 길이로 연장 형성되며, 일정 너비 간격으로 일정 길이가 절삭되어, 면 방향을 중심을 기준으로 일측과 타측이 서로 다른 각도로 비틀어져 형성되는 길이 방열부(450)를 포함하여 이루어질 수 있다. 7 and 8 , the heat dissipation fin 400 has one side surface-contacting the other side of the metal PCB 200, but a contact heat dissipation unit that is in surface contact with the other side of the metal PCB 200 ( 440), the heat dissipation fin support 460 formed in the other direction of the contact heat dissipation part 440, and the heat dissipation fin support 460 in the other direction of the metal PCB 200 are formed to extend by a predetermined length and have a predetermined width. A predetermined length is cut at intervals, and one side and the other side are twisted at different angles based on the center in the plane direction, and the length radiating part 450 may be included.
상기 접촉 방열부(440)는 상기 메탈 PCB(200)의 타측면과 전체 면이 면 접촉하여 형성 될 수 있고, 이 때, 상기 접촉 방열부(440)의 길이방향 일측 또는 타측 또는 양측 끝단이 돌출되어, 상기 체결 라인(330)에 끼워지는 상기 체결 돌기(430)가 형성되는 것이 바람직하다.The contact heat dissipation unit 440 may be formed in contact with the other side of the metal PCB 200 and the entire surface thereof, in which case, one or the other or both ends of the contact heat dissipation unit 440 in the longitudinal direction protrude. Thus, it is preferable that the fastening protrusion 430 fitted to the fastening line 330 is formed.
상기 길이 방열부(450)는 상기 메탈 PCB(200)와 접촉하는 상기 접촉 방열부(440)를 통해 상기 LED 소자(210)로부터 발생한 열을 전달받아 외부로 방출하는 구성으로, 상기 길이 방열부(450)는 상기 메탈 PCB(200)의 타측 방향으로 상기 접촉 방열부(440)의 너비방향 일측 또는 타측 끝단으로부터 연장 형성되어, 넓은 면을 이루는 것을 특징으로 한다.The length heat dissipation unit 450 is configured to receive heat generated from the LED element 210 through the contact heat dissipation unit 440 in contact with the metal PCB 200 and radiate it to the outside, and the length heat dissipation unit ( 450) is formed to extend from one or the other end in the width direction of the contact heat dissipation part 440 in the other direction of the metal PCB 200 to form a wide surface.
또한, 상기 길이 방열부(450)는 일정 너비 간격으로 일정 길이가 절삭되어, 면 방향을 중심을 기준으로 일측과 타측이 서로 다른 각도로 비틀어져 형성되는 것을 특징으로 할 수 있다. 상기와 같은 길이 방열부(450) 구성을 통해, 동일 면적당 상기 방열핀(400)을 흐르는 공기 유동량이 많아져 냉각이 더 잘 일어나게 되어, 상기 방열핀(400)의 방열 성능이 높아지는 효과를 가질 수 있다.In addition, the length of the heat dissipation part 450 may be characterized in that a predetermined length is cut at a predetermined width interval, and one side and the other side are twisted at different angles with respect to the center in the plane direction. Through the configuration of the heat dissipation unit 450 in length as described above, the amount of air flowing through the heat dissipation fin 400 per the same area increases, so that cooling occurs more easily, thereby increasing the heat dissipation performance of the heat dissipation fin 400 .
상기 길이 방열부(450)는 도시된 바와 같이, 제1각부(451)와 제2각부(452)로 이루어 질 수 있으며, 도시화 되지는 않았지만, 셋 이상의 서로 다른 각도를 갖는 형상으로 이루어 질 수도 있다.As shown, the length heat dissipation part 450 may include a first leg part 451 and a second leg part 452, and although not shown, may be formed in a shape having three or more different angles. .
도 9를 참조하면, 본 발명의 일 실시예에 따른 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명(100) 제조 방법은, 실외 LED 조명을 제조하는 방법에 있어서, 일측면에 LED 소자(210)가 형성되는 메탈 PCB(200)의 타측면에 체결 암나사 바(300)를 체결나사(310)로 헐겁게 체결하여, 체결 라인(330)을 형성하는 1차 체결 단계(S100), 상기 체결 라인(330)에 체결 돌기(430)가 형성된 하나 이상의 방열핀(400)을 끼워 넣는 조립 단계(S300) 및 상기 체결나사(310)를 조여 상기 메탈 PCB(200), 상기 방열핀(400) 및 상기 체결 암나사 바(300)를 조이는 2차 체결 단계(S400)를 포함하여 이루어지는 것을 특징으로 할 수 있다.Referring to FIG. 9 , in the method for manufacturing an LED lighting 100 in which an easy-to-assemble heat dissipation fin is directly attached to a metal PCB according to an embodiment of the present invention, in the method for manufacturing an outdoor LED lighting, an LED element ( The first fastening step (S100) of loosely fastening the fastening female screw bar 300 to the other side of the metal PCB 200 on which the 210 is formed with the fastening screw 310 to form the fastening line 330 (S100), the fastening line Assembling step (S300) of inserting one or more heat dissipation fins 400 having fastening protrusions 430 formed therein (330) and tightening the fastening screws 310 to the metal PCB 200, the heat dissipation fins 400 and the fastening female screws It may be characterized in that it comprises a secondary fastening step (S400) of tightening the bar (300).
상기 1차 체결 단계(S100)는, 상기 메탈 PCB(200) 상에 형성되는 PCB 체결홀(220)과 상기 체결 암나사 바(300)에 형성되는 암나사 홀(320)이 동심이 된 상태에서, 상기 PCB 체결홀(220)과 상기 암나사 홀(320)에 상기 체결나사(310)를 삽입하는 단계로, 이때, 상기 메탈 PCB(200)와 상기 체결 암나사 바(300) 사이의 공간으로 상기 체결 라인(330)이 형성된다.In the first fastening step (S100), in a state in which the PCB fastening hole 220 formed on the metal PCB 200 and the female screw hole 320 formed in the fastening female screw bar 300 are concentric, the In the step of inserting the fastening screw 310 into the PCB fastening hole 220 and the female screw hole 320, in this case, the fastening line ( 330) is formed.
상기 조립 단계(S300)에서, 상기 방열핀(400)은, 상기 체결 라인(330)의 일측 끝단에서 삽입되어 상기 체결 라인(330)의 타측 방향으로 이동되어 위치가 조정될 수 있으며, 상기 체결 라인(330)의 타측 끝단에서 삽입되어 상기 체결 라인(330)의 일측 방향으로 이동되어 위치가 조정될 수 도 있다. 또한, 상기 메탈 PCB(200)의 중앙 또는 일정 부분이 외부 전원으로부터 상기 LED 소자(210)로 전원 공급이 가능하도록 관통되는 경우, 상기 방열핀(400)이 상기 메탈 PCB(200) 상에 형성된 관통 부위를 막지 않도록 설치되는 것이 바람직하다.In the assembling step (S300), the heat dissipation fin 400 is inserted from one end of the fastening line 330 and moved to the other side of the fastening line 330 to adjust its position, and the fastening line 330 ) may be inserted from the other end and moved to one side of the fastening line 330 to adjust the position. In addition, when the center or a certain part of the metal PCB 200 is penetrated so that power can be supplied to the LED element 210 from an external power source, the heat dissipation fin 400 is a penetration portion formed on the metal PCB 200 . It is desirable to be installed so as not to block the
상기 2차 체결 단계(S400)는 상기 체결나사(310)가 상기 체결 암나사 바(300)에 형성된 상기 암나사 홀(320)과 나사 체결되어 상기 메탈 PCB(200), 상기 방열핀(400) 및 상기 체결 암나사 바(300)를 서로 결합시키는 단계로, 상기 메탈 PCB(200)에 상기 방열판이 밀착될 수 있도록 고정시키는 것이 바람직하다.In the second fastening step (S400), the fastening screw 310 is screwed with the female screw hole 320 formed in the fastening female screw bar 300, so that the metal PCB 200, the heat dissipation fin 400 and the fastening are performed. In the step of coupling the female screw bar 300 to each other, it is preferable to fix the heat sink to the metal PCB 200 so that the heat sink can be in close contact with each other.
또한, 본 발명의 일 실시예에 따른 방열핀(400)이 메탈 PCB(200)에 직접 부착되는 LED(100) 제조 방법은, 상기 1차 체결 단계(S100) 직후, 상기 메탈 PCB(200)의 타측면에 닿는 상기 방열핀(400)의 일측면에 접착제(500)를 도포하는 제1 접착제 도포 단계(S200)를 더 포함하여 이루어질 수 있다.In addition, in the LED 100 manufacturing method in which the heat dissipation fin 400 is directly attached to the metal PCB 200 according to an embodiment of the present invention, immediately after the first fastening step (S100), the other side of the metal PCB 200 is A first adhesive application step (S200) of applying an adhesive 500 to one side of the heat dissipation fin 400 in contact with the side may be further included.
상기 제1 접착 도포 단계(S200)는, 상기 접착제(500)를 상기 방열핀(400)의 일측면에 얇게 도포하는 것이 바람직하나, 상기 방열핀(400)의 일측면에 접착제 수용부(420)가 형성될 경우, 상기 접착제 수용부(420)에만 상기 접착제(500)를 주입하여, 상기 접착제 수용부(420)를 제외한 상기 방열핀(400)의 일측면에는 상기 접착제(500)가 도포되지 않도록 하는 것이 바람직하다.In the first adhesive application step (S200), it is preferable to apply the adhesive 500 thinly to one side of the heat dissipation fin 400, but an adhesive receiving part 420 is formed on one side of the heat dissipation fin 400 If necessary, it is preferable to inject the adhesive 500 only to the adhesive receiving part 420 so that the adhesive 500 is not applied to one side of the heat dissipation fin 400 except for the adhesive receiving part 420 . do.
도 10을 참조하면, 본 발명의 다른 실시예에 따른 방열핀(400)이 메탈 PCB(200)에 직접 부착되는 LED(100) 제조 방법은, 실외 LED 조명을 제조하는 방법에 있어서, 일측면에 LED 소자(210)가 형성되는 메탈 PCB(200)의 타측면에, 상기 메탈 PCB(200)의 타측면과 면 접촉하며, 체결 돌기(430)가 형성된 다수개의 방열핀(400)을 배열하는 배열 단계(S210) 및 상기 메탈 PCB(200)의 타측면 둘레에 형성되어 상기 체결 돌기(430)가 끼워지는 체결 라인(330)을 형성하는 체결 암나사 바(300)를 상기 메탈 PCB(200)와 체결나사(310)를 통해 나사 체결하는 단일 체결 단계(S310)를 포함하여 이루어지는 것을 특징으로 한다.Referring to FIG. 10 , the LED 100 manufacturing method in which the heat dissipation fin 400 is directly attached to the metal PCB 200 according to another embodiment of the present invention is a method of manufacturing an outdoor LED lighting, wherein the LED on one side Arrangement step ( S210) and a fastening female screw bar 300 formed around the other side of the metal PCB 200 to form a fastening line 330 into which the fastening protrusion 430 is fitted is connected to the metal PCB 200 and a fastening screw ( It is characterized in that it comprises a single fastening step (S310) of screw fastening through 310).
상기 배열 단계(S210)에, 다수개의 상기 방열핀(400)이 서로 일정 거리를 두고 평행하게 배열되고, 이 때, 상기 체결 돌기(430)는 상기 체결 암나사 바(300)가 설치되는 상기 메탈 PCB(200)의 타측면 둘레에 위치하는 것이 바람직하다.In the arranging step (S210), a plurality of the heat dissipation fins 400 are arranged in parallel at a predetermined distance from each other, and at this time, the fastening protrusion 430 is the metal PCB on which the fastening female screw bar 300 is installed ( 200) is preferably located around the other side.
상기 단일 체결 단계(S310)는, 상기 메탈 PCB(200) 상에 형성되는 PCB 체결홀(220)과 상기 체결 암나사 바(300)에 형성되는 암나사 홀(320)이 동심이 된 상태에서, 상기 PCB 체결홀(220)과 상기 암나사 홀(320)에 상기 체결나사(310)를 삽입하는 단계로, 이때, 상기 메탈 PCB(200)와 상기 체결 암나사 바(300) 사이의 공간에 형성된 상기 체결 라인(330)에 다수개의 상기 체결 돌기(430)가 끼워지는 것이 특징이다.In the single fastening step (S310), in a state in which the PCB fastening hole 220 formed on the metal PCB 200 and the female screw hole 320 formed in the fastening female screw bar 300 are concentric, the PCB In the step of inserting the fastening screw 310 into the fastening hole 220 and the female screw hole 320, at this time, the fastening line formed in the space between the metal PCB 200 and the fastening female screw bar 300 ( It is characterized in that a plurality of the fastening protrusions 430 are fitted to the 330).
또한, 본 발명의 다른 실시예에 따른 방열핀(400)이 메탈 PCB(200)에 직접 부착되는 LED(100) 제조 방법은, 상기 배열 단계(S210) 직전, 상기 메탈 PCB(200)의 타측면에 닿는 상기 방열핀(400)의 일측면에 접착제를 도포하는 제2 접착제도포 단계(S110)를 더 포함하여 이루어질 수 있다.In addition, in the LED 100 manufacturing method in which the heat dissipation fin 400 is directly attached to the metal PCB 200 according to another embodiment of the present invention, immediately before the arrangement step (S210), on the other side of the metal PCB 200 A second adhesive application step (S110) of applying an adhesive to one side of the heat dissipation fin 400 in contact may be further included.
상기 제2 접착제 도포 단계(S110)는, 상기 접착제를 상기 방열핀(400)의 일측면에 얇게 도포하는 것이 바람직하나, 상기 방열핀(400)의 일측면에 접착제 수용부(420)가 형성될 경우, 상기 접착제 수용부(420)에만 상기 접착제(500)를 주입하여, 상기 접착제 수용부(420)를 제외한 상기 방열핀(400)의 일측면에는 상기 접착제(500)가 도포되지 않도록 하는 것이 바람직하다.In the second adhesive application step (S110), it is preferable to apply the adhesive thinly to one side of the heat dissipation fin 400, but when the adhesive receiving part 420 is formed on one side of the heat dissipation fin 400, It is preferable to inject the adhesive 500 only into the adhesive receiving part 420 so that the adhesive 500 is not applied to one side of the heat dissipation fin 400 except for the adhesive receiving part 420 .
또한 상기 제2 접착제 도포 단계(S110)에서는, 상기 방열핀(400)을 상기 메탈 PCB(200)의 타측면에 부착한 후 압박을 가하여 부착력을 높이는 것이 바람직하다.In addition, in the second adhesive application step ( S110 ), it is preferable to attach the heat dissipation fin 400 to the other side of the metal PCB 200 and then apply pressure to increase the adhesive force.
본 발명은 상기한 실시예에 한정되지 아니하며, 적용범위가 다양함은 물론이고, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 다양한 변형 실시가 가능한 것은 물론이다.The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention as claimed in the claims.

Claims (1)

  1. 실외 LED 조명에 있어서,In outdoor LED lighting,
    일측면에 LED 소자(210)가 형성되는 메탈 PCB(200);a metal PCB 200 on which an LED element 210 is formed on one side;
    상기 메탈 PCB(200)의 타측면 상단 및 하단에 형성되어, 상기 메탈 PCB(200)와 체결나사(310)를 통해 결합되고, 상기 메탈 PCB(200)와 사이에 체결 라인(330)을 형성하는 체결 암나사 바(300);It is formed on the upper and lower sides of the other side of the metal PCB 200, is coupled to the metal PCB 200 and through a fastening screw 310, and forms a fastening line 330 between the metal PCB 200 and the Fastening female thread bar (300);
    상기 체결 라인(330)에 끼워지는 체결 돌기(430)가 형성되고, 일측면이 상기 메탈 PCB(200)의 타측면과 면 접촉하되, 상기 메탈 PCB(200)의 타측면과 면 접촉하는 접촉 방열부(440)와, 접촉 방열부(440)의 타측방향에 형성되는 방열핀 지지대(460)와, 상기 메탈 PCB(200)의 타측 방향을 향해 상기 방열핀 지지대(460)로부터 일정 길이로 연장 형성되며, 일정 너비 간격으로 일정 길이가 절삭되어, 면 방향을 중심을 기준으로 일측과 타측이 서로 다른 각도로 비틀어져 형성되는 길이 방열부(450)로 이루어지는 방열핀(400);A fastening protrusion 430 fitted to the fastening line 330 is formed, and one side of the metal PCB 200 is in surface contact with the other side of the metal PCB 200 , and the contact heat dissipation is in surface contact with the other side of the metal PCB 200 . The portion 440, the heat dissipation fin support 460 formed in the other direction of the contact heat dissipation unit 440, and the heat dissipation fin support 460 toward the other direction of the metal PCB 200 are formed to extend a certain length, A heat dissipation fin 400 comprising a length dissipating portion 450 in which a predetermined length is cut at predetermined width intervals, and one side and the other side are twisted at different angles with respect to the center of the plane direction;
    상기 방열핀(400)에 도포되어 메탈 PCB(200)의 타측면에 상기 방열핀(400)의 일측면을 접착시키는 접착제(500);를 포함하여 이루어지며,An adhesive 500 applied to the heat dissipation fin 400 to adhere one side of the heat dissipation fin 400 to the other side of the metal PCB 200;
    상기 방열핀(400)은The heat dissipation fin 400 is
    상기 방열핀(400)의 일측면에 접착제(500)를 배출하는 접착제 회피홀(410)이 일정 간격을 두고 하나 이상 형성되어, 접착제(500)가 접촉 방열부(440) 외측으로 흘러내지 않고 접착제 회피홀(410)로 배출되어 고정력을 높일 수 있도록 하며,One or more adhesive avoidance holes 410 for discharging the adhesive 500 are formed on one side of the heat dissipation fin 400 at regular intervals, so that the adhesive 500 does not flow out of the contact heat dissipation unit 440 and avoids the adhesive It is discharged through the hole 410 to increase the fixing force,
    상기 체결 암나사바(300)는The fastening female screw bar 300 is
    중단이 절곡되는 'ㄱ'자 형태로 형성되고, 상기 체결돌기(430)와 방열핀 지지대(460) 사이 원호형상의 틈새홈(470)에 일측하단(A)이 대응되며 끼워져 삽입접촉되며, 타측(B)은 방열핀 지지대(460)에 면접촉되면서 고정되어 설치가 용이토록 하고,The middle is formed in a bent 'L' shape, and one lower end (A) is fitted and inserted into contact with the arc-shaped gap groove 470 between the fastening protrusion 430 and the heat dissipation fin support 460, and the other side ( B) is fixed while in surface contact with the heat dissipation fin support 460 to facilitate installation,
    상기 체결나사(310)는The fastening screw 310 is
    상기 메탈 PCB(200)와 체결 암나사 바(300)를 연속관통하며 체결되되, 체결력에 의해 체결 암나사바(300)의 일측하단(A) 및 타측(B)이 방열핀 지지대(460)에 각각 밀착체결되도록 하는 것을 특징으로 하는 조립용이한 방열핀이 메탈 PCB에 직접 부착되는 LED 조명.The metal PCB 200 and the fastening female screw bar 300 are continuously penetrated and fastened, and one lower end (A) and the other side (B) of the fastening female screw bar 300 are closely coupled to the heat dissipation fin support 460 by the fastening force, respectively. LED lighting with easy-to-assemble heat dissipation fins attached directly to the metal PCB.
PCT/KR2020/004881 2020-04-10 2020-04-10 Led lighting having easy-to-assemble radiation fins directly attached to metal pcb WO2021206198A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061157A (en) * 2009-09-14 2011-03-24 Starlite Co Ltd Heatsink for led and led lamp for vehicle
KR101075950B1 (en) * 2010-05-04 2011-10-21 (주)지맥 A structure body of radiant heat for led lighting lamp
KR101408824B1 (en) * 2013-05-22 2014-06-19 주식회사 트루와이드 Led floodlight and manufacturing method thereof
KR20140084568A (en) * 2012-12-27 2014-07-07 전자부품연구원 Heatsink for led lighting
KR20140147630A (en) * 2013-06-20 2014-12-30 주식회사 엠티티 LED cooling device of air flow type
KR102103728B1 (en) * 2018-12-06 2020-04-23 주식회사 엠티티 An LED in which a radiating fin is directly attached to a metal PCB

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061157A (en) * 2009-09-14 2011-03-24 Starlite Co Ltd Heatsink for led and led lamp for vehicle
KR101075950B1 (en) * 2010-05-04 2011-10-21 (주)지맥 A structure body of radiant heat for led lighting lamp
KR20140084568A (en) * 2012-12-27 2014-07-07 전자부품연구원 Heatsink for led lighting
KR101408824B1 (en) * 2013-05-22 2014-06-19 주식회사 트루와이드 Led floodlight and manufacturing method thereof
KR20140147630A (en) * 2013-06-20 2014-12-30 주식회사 엠티티 LED cooling device of air flow type
KR102103728B1 (en) * 2018-12-06 2020-04-23 주식회사 엠티티 An LED in which a radiating fin is directly attached to a metal PCB

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