WO2021203859A1 - Infrared temperature measuring device - Google Patents

Infrared temperature measuring device Download PDF

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Publication number
WO2021203859A1
WO2021203859A1 PCT/CN2021/077820 CN2021077820W WO2021203859A1 WO 2021203859 A1 WO2021203859 A1 WO 2021203859A1 CN 2021077820 W CN2021077820 W CN 2021077820W WO 2021203859 A1 WO2021203859 A1 WO 2021203859A1
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WO
WIPO (PCT)
Prior art keywords
infrared
measuring device
galvanometer
temperature measuring
lens
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PCT/CN2021/077820
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French (fr)
Chinese (zh)
Inventor
张瓯
朱亚平
陈成
何毅政
Original Assignee
杭州欧镭激光技术有限公司
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Priority claimed from CN202010275315.2A external-priority patent/CN111323134A/en
Priority claimed from CN202020510980.0U external-priority patent/CN212110353U/en
Application filed by 杭州欧镭激光技术有限公司 filed Critical 杭州欧镭激光技术有限公司
Priority to JP2022561438A priority Critical patent/JP2023521364A/en
Publication of WO2021203859A1 publication Critical patent/WO2021203859A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems

Definitions

  • This application relates to the technical field of temperature measurement, in particular to an infrared temperature measurement device.
  • Infrared is an electromagnetic wave, which has the same essence as radio waves and visible light.
  • the wavelength of infrared light is between 0.76 and 100 ⁇ m, which is located between radio waves and visible light. Any object, as long as its temperature is higher than minus 273 degrees, emits infrared rays without exception. In nature, all objects whose temperature is higher than absolute zero are constantly emitting infrared radiation energy to the surrounding space.
  • the infrared thermal imager is mainly used in research and development or industrial inspection and equipment maintenance. It is also widely used in fire prevention, night vision and security. In layman's terms, a thermal imager converts the invisible infrared energy emitted by an object into a visible thermal image. The different colors on the top of the thermal image represent different temperatures of the measured object.
  • Infrared thermal imaging camera is a kind of infrared thermal imaging technology that uses infrared detectors to detect the infrared radiation of the measured target, and uses signal processing, photoelectric conversion and other means to convert the image of the temperature distribution of the target into a visible image. equipment.
  • the infrared thermal imager accurately quantifies the actual heat detected, and images the entire target object in real-time in the form of a surface, so it can accurately identify the suspected fault area that is heating.
  • Operators use the image color displayed on the screen and the hot spot tracking display function to preliminarily judge the heating condition and the fault location, and at the same time, strictly analyze it, thus reflecting the high efficiency and high accuracy in confirming the problem.
  • a thermal imager converts the invisible infrared energy emitted by an object into a visible thermal image. The different colors on the top of the thermal image represent different temperatures of the measured object. By viewing the thermal image, you can observe the overall temperature distribution of the measured target, study the heating of the target, and then make the judgment of the next step.
  • the field of view of the infrared thermal imager lens in the prior art is too small, and it is difficult to automatically monitor the measured target in a wide range. Therefore, the handheld infrared thermal imager is the most widely used, and the operator needs to approach and aim the instrument The target to be measured, so as to perform the measurement. Now that automated temperature monitoring equipment is increasingly needed by the market, how to obtain an automated infrared temperature measurement device with a wide monitoring range is a new issue in the industry.
  • the infrared temperature measurement device in the prior art has a small field of view, it can only perform hand-held close-range temperature measurement of the target to be measured, and cannot perform long-distance and wide-range temperature monitoring.
  • This application provides an infrared temperature measurement.
  • Devices including:
  • An infrared camera including a lens including a lens and an imaging control system;
  • a galvanometer the galvanometer includes a mirror and a driving unit, and the driving unit is used to drive the mirror to make an angular deflection with respect to the infrared camera;
  • the reflector intersects the main optical axis of the lens, and the infrared rays from the target are reflected by the reflector and reach the imaging control system through the lens.
  • the galvanometer is a MEMS galvanometer.
  • the central axis of the reflecting mirror intersects the main optical axis of the lens.
  • the field of view of the infrared camera is a
  • the deflection angle of the galvanometer is b
  • the field of view of the infrared temperature measuring device is a+2b, wherein the range of a is 30°-60° , The range of b is 20° ⁇ 40°.
  • the reflecting surface of the reflecting mirror is plated with gold.
  • the MEMS galvanometer is a single-axis micro-vibration mirror or a dual-axis micro-vibration mirror.
  • the driving mode of the MEMS galvanometer is one or more of electrostatic driving, electromagnetic driving or piezoelectric driving.
  • the driving unit includes an electrode and a driving circuit, the driving circuit applies a voltage to the electrode to generate an electrostatic force between the electrodes, and the reflecting mirror is angularly deflected under the action of the electrostatic force.
  • the imaging control system includes an infrared sensor, a signal amplifying circuit, and a data processing unit.
  • the infrared sensor converts the received infrared thermal radiation emitted by the target into an electrical signal, and the electrical signal sequentially passes through the signal amplifying circuit and The data processing unit obtains temperature data.
  • the infrared camera further includes a communication module, a storage unit, and a display.
  • the temperature data is stored in the storage unit, displayed on the display, and transmitted to the server and/or smart terminal through the communication module.
  • the data are temperature values and/or thermal infrared images.
  • the infrared temperature measuring device of the present application helps the infrared camera to obtain a wider range of infrared heat radiation information by placing a galvanometer near the infrared camera, and greatly expands the field of view of the infrared camera through the galvanometer, so that the infrared temperature measuring device is no longer Limited to hand-held type, it can carry out long-distance and wide-range temperature monitoring, which can be applied to different scenarios.
  • Figure 1 is a schematic diagram of the structure of the infrared temperature measuring device of this application.
  • Fig. 2 is an enlarged schematic diagram of the infrared temperature measuring device in Fig. 1 at A;
  • Figure 3 is a front view of the mid-infrared camera of this application.
  • Fig. 4 is a cross-sectional view of the MEMS galvanometer of this application.
  • FIG. 5 is a schematic diagram of the internal structure of the MEMS galvanometer of this application.
  • first, second, third, etc. may be used in this disclosure to describe various information, the information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.
  • first information may also be referred to as second information, and similarly, the second information may also be referred to as first information.
  • word “if” as used herein can be interpreted as "when” or “when” or "in response to determination”.
  • Figures 1-5 show an embodiment of this application.
  • the infrared temperature measurement device of the present application includes: an infrared camera 10 and a MEMS galvanometer 20.
  • the infrared camera 10 includes a lens 11 including a lens 111 and an imaging control system.
  • the lens 111 includes a filter to allow only infrared rays to enter the lens 11.
  • the imaging control system includes an infrared sensor, a signal amplifying circuit, and a data processing unit.
  • the infrared sensor converts the received infrared thermal radiation emitted by the target into an electrical signal, and the electrical signal sequentially passes through the signal amplifying circuit and the data processing unit Get temperature data.
  • the infrared sensor includes a thermal detection element, such as a thermistor, so that the received infrared thermal radiation can be converted into a corresponding electrical signal.
  • the infrared camera 10 further includes a communication module, a storage unit, and a display.
  • the temperature data is stored in the storage unit, displayed on the display, and transmitted to the server and/or smart terminal through the communication module.
  • the temperature data is a temperature value and/or a thermal infrared image.
  • the communication module is a wireless communication module.
  • the smart terminal may include smart phones, tablet computers, notebook computers, palmtop computers, personal digital assistants, portable media players, navigation devices, wearable devices, smart bracelets, pedometers and other mobile terminals, as well as mobile terminals such as digital TV, Fixed terminals such as desktop computers.
  • the infrared camera 10 is an infrared thermal imaging camera, and the infrared camera 10 of the present application may be various existing infrared thermal imaging cameras in the art.
  • the MEMS galvanometer 20 includes a PCB board 23, a substrate 24 arranged on the PCB board 23, a driving unit arranged on the substrate 24, a mirror 21 arranged above the driving unit and The protective cover 25 outside the reflector 21.
  • the protective cover 25 is transparent glass for protecting the electrode 221 and the driving circuit on the reflector 21 and the substrate 24.
  • the reflective surface of the reflector 21 is plated with gold (Au) or other feasible metal coatings to enhance the reflection of infrared rays.
  • the driving unit includes an electrode 221 and a driving circuit.
  • the reflecting mirror 21 is arranged above the electrode 221.
  • the driving unit is used to drive the reflecting mirror 21 to undergo angular deflection relative to the infrared camera 10.
  • the driving circuit applies a voltage to the electrodes 221 to generate an electrostatic field between the electrodes 221, and the mirror 21 undergoes angular deflection under the action of electrostatic force.
  • the deflection angle of the mirror 21 is related to the intensity of the electrostatic field. The greater the intensity, the greater the deflection angle response.
  • the driving circuit generates electrostatic fields of different magnitudes by adjusting the magnitude of the voltage applied to the electrodes, thereby controlling the reflecting mirror to produce a definite angle of deflection, so as to realize the controllable angle deflection of the reflecting mirror and realize a wide range of scanning.
  • the driving mode of the MEMS galvanometer 20 is electrostatic driving.
  • the MEMS galvanometer 20 may be various MEMS galvanometers in the field.
  • the driving mode of the MEMS galvanometer may also be one or more of electrostatic driving, electromagnetic driving, or piezoelectric driving. It is worth noting that in other embodiments, the MEMS galvanometer 20 can also be replaced with a galvanometer, the driving unit of the galvanometer is a motor, and the mirror of the galvanometer is driven by the electrodes to cause angular deflection.
  • the reflector 21 intersects the main optical axis of the lens 111, preferably, the central axis of the reflector 21 intersects the main optical axis of the lens 111, and comes from the measured target
  • the infrared rays pass through the lens 11 of the infrared camera 10 to reach the imaging control system, and the imaging control system will receive the infrared radiation emitted by the target object.
  • the converted temperature value and/or thermal infrared image is displayed on the display of the infrared camera 10.
  • the angle of view of the infrared camera 10 refers to the lens 11 of the infrared camera 10 as the vertex, and the angle formed by the two edges of the maximum range through which the object image of the measured target can pass through the lens is the angle of view.
  • Field angle is divided into horizontal field of view and vertical field of view.
  • the deflection angle of the MEMS galvanometer 20 refers to the angle between the mirror 21 from the non-deflection position to the position when the deflection in a certain direction reaches the maximum extent. As shown in Fig. 1, the vertical field of view of the infrared camera is a, and a is 30°-60°.
  • the deflection angle of the MEMS galvanometer 20 is b, and b is 20°-40°.
  • the MEMS galvanometer 20 is a single-axis MEMS galvanometer that rotates along the X-axis.
  • the X-axis refers to the central axis of the mirror 21 perpendicular to the direction of the paper in FIG. Turn clockwise and counterclockwise. Since the reflector 21 can be deflected from the non-deflection position to two completely opposite directions, specifically, the enlarged views of the optical path shown in FIG. 2 respectively show that when the reflector 21 rotates along the X axis, the reflector 21 is The principle of the light path in the three position states is shown.
  • the three position states are: the position state when the counterclockwise deflection reaches the maximum degree, the position state without deflection, and the position state when the clockwise deflection reaches the maximum degree. Therefore, it can be seen from FIGS. 1-2 that on the basis of the vertical viewing angle a of the infrared camera 10, the vertical viewing angle of the infrared temperature measuring device is Expanded to a+2b, that is, the field of view of the infrared temperature measuring device described in the present application ranges from 70° to 140°.
  • the MEMS galvanometer 20 when the MEMS galvanometer 20 is a single-axis MEMS galvanometer that rotates along the Y-axis, the Y-axis refers to the axis of the mirror 21 perpendicular to the X-axis. The central axis. Assuming that the horizontal viewing angle of the infrared camera 10 is a, the reflecting mirror 21 rotates along the Y axis, thereby expanding the horizontal viewing angle a of the infrared temperature measuring device to a+2b.
  • the MEMS galvanometer 20 when the MEMS galvanometer 20 is a biaxial galvanometer, the vertical field of view and the horizontal field of view of the infrared temperature measuring device are both expanded to a+2b.
  • the infrared temperature measurement device of the present application helps the infrared temperature measurement device of the present application obtain a wider range of Infrared thermal radiation information makes the infrared temperature measurement device no longer limited to short-range hand-held temperature measurement, but can perform large-range and long-distance temperature monitoring, which can be applied to different scenarios.
  • the angle between the reflector 21 and the main optical axis of the infrared camera 10 is 45°, but it is worth noting that In other embodiments, when the reflector 21 of the MEMS galvanometer 20 is in an undeflected position, the angle between the reflector 21 and the main optical axis of the infrared camera 10 is not Limited to FIG. 1, it is also possible to change the angle between the reflector 21 and the main optical axis of the infrared camera 10 according to the needs of the measurement scene, so as to change the scanning orientation of the infrared temperature measuring device of the present application. Therefore, according to another embodiment of the present application, the present application provides an infrared temperature measurement system.
  • the infrared temperature measurement system includes a housing, a communication module, an infrared camera arranged in the housing, and a rotatably connected to the housing.
  • the galvanometer and an angle adjustment module arranged in the housing and used for controlling the overall angle of the galvanometer.
  • the angle adjustment module includes a control module electrically connected to the communication module, a drive unit electrically connected to the control module, and an angle adjustment mechanism connected to the drive unit.
  • the control module receives the angle adjustment instruction of the smart terminal through the communication module, and then controls the drive unit to drive the angle adjustment mechanism, so that the angle adjustment mechanism adjusts the overall orientation of the galvanometer relative to the infrared camera, thereby further adjusting the current vibration
  • the drive unit is a motor
  • the angle adjustment mechanism is a telescopic mechanism
  • the telescopic mechanism pushes and pulls the galvanometer as a whole by telescoping, so as to adjust the mirror of the galvanometer to be in a non-deflection state with the main light of the infrared camera.
  • the drive unit is one or more of electrostatic drive, electromagnetic drive, or piezoelectric drive
  • the angle adjustment mechanism is a telescopic mechanism
  • the telescopic mechanism pushes and pulls the entire galvanometer through expansion and contraction
  • the angle between the mirror of the galvanometer and the main optical axis of the infrared camera in the non-deflection state can be adjusted.
  • the angle between the reflector and the main optical axis of the infrared camera ranges from 0° to 180°.
  • the infrared temperature measurement system expands the field of view angle in two ways: 1.
  • the angle adjustment module is used to remotely control the distance between the reflector and the main optical axis of the infrared camera when it is in a non-deflection state.
  • the angle between the mirror and the main optical axis of the infrared camera is a certain value when it is in the non-deflection position.
  • the infrared temperature measurement device of the present application is deflected by the angle of the galvanometer itself, the field of view of the infrared temperature measurement system is further increased.
  • the infrared temperature measurement system in this embodiment adjusts the overall macro angle of the galvanometer through the angle adjustment mechanism and the angle deflection of the galvanometer itself, which jointly increases the field of view of the infrared temperature measurement device and expands the temperature monitoring range.
  • the infrared temperature measuring device of the present application places a galvanometer near the infrared camera and greatly expands the field of view of the infrared camera through the galvanometer to help the infrared camera obtain a wider range of infrared heat radiation information, so that the infrared
  • the temperature measuring device is no longer limited to hand-held, it can carry out long-distance and wide-range temperature monitoring, which can be applied to different scenarios.

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  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
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Abstract

An infrared temperature measuring device, comprising: an infrared camera (10), the infrared camera (10) comprising a camera lens (11) comprising a lens (111), and an imaging control system; and a galvanometer (20), the galvanometer (20) comprising a reflecting mirror (21) and a driving unit, the driving unit being used for driving the reflecting mirror (21) to generate angle deflection with respect to the infrared camera (10). The reflecting mirror (21) intersects with a main optical axis of the lens (111), and infrared rays from a target object reach the imaging control system by means of the camera lens (11) after being reflected by the reflecting mirror (21). According to the infrared temperature measuring device, the galvanometer (20) is placed near the infrared camera (10), and the field angle of the infrared camera (10) is greatly expanded by means of the galvanometer (20), so that the infrared camera (10) is helped to obtain infrared heat radiation information in a wider range, the infrared temperature measuring device is not limited to a handheld type any more, long-distance and large-range temperature monitoring can be performed, and therefore the infrared temperature measuring device can be applied to different scenes.

Description

一种红外测温装置An infrared temperature measuring device 技术领域Technical field
本申请涉及测温技术领域，尤其涉及一种红外测温装置。This application relates to the technical field of temperature measurement, in particular to an infrared temperature measurement device.
背景技术Background technique
红外线是一种电磁波，具有与无线电波及可见光一样的本质。红外线的波长在0.76～100μm之间，位于无线电波与可见光之间。任何物体，只要它的温度比零下273度高，就无一例外地发射出红外线。在自然界中，一切温度高于绝对零度的物体都在不停地向周围空间发出红外辐射能量。物体的红外辐射能量的大小及其按波长的分布——与它的表面温度有着十分密切的关系。因此，通过对物体自身辐射的红外能量的测量，便能准确地测定它的表面温度。红外测温技术在生产过程中，在产品质量控制和监测，设备在线故障诊断和安全保护以及节约能源等方面发挥了着重要作用。Infrared is an electromagnetic wave, which has the same essence as radio waves and visible light. The wavelength of infrared light is between 0.76 and 100 μm, which is located between radio waves and visible light. Any object, as long as its temperature is higher than minus 273 degrees, emits infrared rays without exception. In nature, all objects whose temperature is higher than absolute zero are constantly emitting infrared radiation energy to the surrounding space. The size of the infrared radiation energy of an object and its distribution according to wavelength-have a very close relationship with its surface temperature. Therefore, by measuring the infrared energy radiated by the object itself, its surface temperature can be accurately determined. Infrared temperature measurement technology plays an important role in product quality control and monitoring, equipment online fault diagnosis and safety protection, and energy saving during the production process.
目前的红外测温技术最广为认知的产品是红外热成像仪，红外热像仪主要用于研发或工业检测与设备维护中，在防火、夜视以及安防中也有广泛应用。通俗地讲热像仪就是将物体发出的不可见红外能量转变为可见的热图像。热图像的上面的不同颜色代表被测物体的不同温度。红外热像仪是一种利用红外热成像技术，通过红外探测器对被测目标的红外辐射探测，并加以信号处理、光电转换等手段，将标的物的温度分布的图像转换成可视图像的设备。红外热像仪将实际探测到的热量进行精确的量化，以面的形式实时成像标的物的整体，因此能够准确识别正在发热的疑似故障区域。操作人员通过屏幕上显示的图像色彩和热点追踪显示功能来初步判断发热情况和故障部位，同时严格分析，从而在确认问题上体现了高效率、高准确率。通俗地讲热像仪就是将物体发出的不可见红外能量转变为可见的热图像。热图像的上面的不同颜色代表被测物体的不同温度。通过查看热图像，可以观察到被测目标的整体温度分布状况，研究目标的发热情况，从而进行下一步工作的判断。The most widely recognized product of the current infrared temperature measurement technology is the infrared thermal imager. The infrared thermal imager is mainly used in research and development or industrial inspection and equipment maintenance. It is also widely used in fire prevention, night vision and security. In layman's terms, a thermal imager converts the invisible infrared energy emitted by an object into a visible thermal image. The different colors on the top of the thermal image represent different temperatures of the measured object. Infrared thermal imaging camera is a kind of infrared thermal imaging technology that uses infrared detectors to detect the infrared radiation of the measured target, and uses signal processing, photoelectric conversion and other means to convert the image of the temperature distribution of the target into a visible image. equipment. The infrared thermal imager accurately quantifies the actual heat detected, and images the entire target object in real-time in the form of a surface, so it can accurately identify the suspected fault area that is heating. Operators use the image color displayed on the screen and the hot spot tracking display function to preliminarily judge the heating condition and the fault location, and at the same time, strictly analyze it, thus reflecting the high efficiency and high accuracy in confirming the problem. In layman's terms, a thermal imager converts the invisible infrared energy emitted by an object into a visible thermal image. The different colors on the top of the thermal image represent different temperatures of the measured object. By viewing the thermal image, you can observe the overall temperature distribution of the measured target, study the heating of the target, and then make the judgment of the next step.
现有技术中的红外热成像仪镜头的视场角太小，难以对较广范围内的被测目标进行自动化监测，因此，手持型红外热成像仪最为广泛，操作者需要靠近并将仪器瞄准被测目标，从而进行测量。现在自动化的温度监测设备越来越被市场所需要，那么如何获得监控范围广的自动化红外测温装置就是行业的一道新课题。The field of view of the infrared thermal imager lens in the prior art is too small, and it is difficult to automatically monitor the measured target in a wide range. Therefore, the handheld infrared thermal imager is the most widely used, and the operator needs to approach and aim the instrument The target to be measured, so as to perform the measurement. Now that automated temperature monitoring equipment is increasingly needed by the market, how to obtain an automated infrared temperature measurement device with a wide monitoring range is a new issue in the industry.
发明内容Summary of the invention
为解决现有技术中的红外测温装置的视场角小，仅可以对被测目标进行手持式近距离测温，无法进行远距离大范围温度监控的问题，本申请提供一种红外测温装置，包括：In order to solve the problem that the infrared temperature measurement device in the prior art has a small field of view, it can only perform hand-held close-range temperature measurement of the target to be measured, and cannot perform long-distance and wide-range temperature monitoring. This application provides an infrared temperature measurement. Devices, including:
红外相机，所述红外相机包括包含镜片的镜头以及成像控制***；An infrared camera, the infrared camera including a lens including a lens and an imaging control system;
振镜，所述振镜包括反射镜和驱动单元，所述驱动单元用于驱动所述反射镜相对于所述红外相机发生角度偏转；A galvanometer, the galvanometer includes a mirror and a driving unit, and the driving unit is used to drive the mirror to make an angular deflection with respect to the infrared camera;
所述反射镜与所述镜片的主光轴相交，来自目标物的红外线经所述反射镜反射后通过所述镜头到达所述成像控制***。The reflector intersects the main optical axis of the lens, and the infrared rays from the target are reflected by the reflector and reach the imaging control system through the lens.
进一步地，所述振镜为MEMS振镜。Further, the galvanometer is a MEMS galvanometer.
进一步地，所述反射镜的中心轴与所述镜片的主光轴相交。Further, the central axis of the reflecting mirror intersects the main optical axis of the lens.
进一步地，所述红外相机的视场角为a，所述振镜的偏转角度为b，所述红外测温装置的视场角为a+2b，其中，a的范围为30°～60°，b的范围为20°～40°。Further, the field of view of the infrared camera is a, the deflection angle of the galvanometer is b, and the field of view of the infrared temperature measuring device is a+2b, wherein the range of a is 30°-60° , The range of b is 20°～40°.
进一步地，所述反射镜的反射面镀金。Further, the reflecting surface of the reflecting mirror is plated with gold.
进一步地，所述MEMS振镜为单轴微振镜或双轴微振镜。Further, the MEMS galvanometer is a single-axis micro-vibration mirror or a dual-axis micro-vibration mirror.
进一步地，所述MEMS振镜的驱动方式为静电驱动、电磁驱动或压电驱动中的一种或多种。Further, the driving mode of the MEMS galvanometer is one or more of electrostatic driving, electromagnetic driving or piezoelectric driving.
进一步地，所述驱动单元包括电极和驱动电路，所述驱动电路向所述电极施加电压以使所述电极之间产生静电力，所述反射镜在所述静电力的作用下发生角度偏转。Further, the driving unit includes an electrode and a driving circuit, the driving circuit applies a voltage to the electrode to generate an electrostatic force between the electrodes, and the reflecting mirror is angularly deflected under the action of the electrostatic force.
进一步地，所述成像控制***包括红外线传感器、信号放大电路、数据处理单元，所述红外线传感器将接收到的目标物发射的红外线热辐射转换为电信号，所述电信号依次通过信号放大电路和数据处理单元得到温度数据。Further, the imaging control system includes an infrared sensor, a signal amplifying circuit, and a data processing unit. The infrared sensor converts the received infrared thermal radiation emitted by the target into an electrical signal, and the electrical signal sequentially passes through the signal amplifying circuit and The data processing unit obtains temperature data.
进一步地，所述红外相机进一步包括通信模块、存储单元和显示器，所述温度数据存储于存储单元、显示于所述显示器、并且通过所述通信模块传输至服务器和/或智能终端，所述温度数据为温度值和/或热红外图像。Further, the infrared camera further includes a communication module, a storage unit, and a display. The temperature data is stored in the storage unit, displayed on the display, and transmitted to the server and/or smart terminal through the communication module. The data are temperature values and/or thermal infrared images.
与现有技术相比较，本发明的优势在于：Compared with the prior art, the advantages of the present invention are:
本申请的红外测温装置通过在红外相机附近放置振镜，通过振镜大幅度扩展红外相机的视场角，来帮助红外相机获得更广范围的红外热辐射信息，使得红外测温装置不再局限于手持式，可以进行远距离大范围温度监控，从而可以应用于不同的场景。The infrared temperature measuring device of the present application helps the infrared camera to obtain a wider range of infrared heat radiation information by placing a galvanometer near the infrared camera, and greatly expands the field of view of the infrared camera through the galvanometer, so that the infrared temperature measuring device is no longer Limited to hand-held type, it can carry out long-distance and wide-range temperature monitoring, which can be applied to different scenarios.
附图说明Description of the drawings
图1为本申请红外测温装置的结构示意图；Figure 1 is a schematic diagram of the structure of the infrared temperature measuring device of this application;
图2为图1中的红外测温装置在A处的放大示意图；Fig. 2 is an enlarged schematic diagram of the infrared temperature measuring device in Fig. 1 at A;
图3为本申请中红外相机的主视图；Figure 3 is a front view of the mid-infrared camera of this application;
图4为本申请MEMS振镜的剖示图；Fig. 4 is a cross-sectional view of the MEMS galvanometer of this application;
图5为本申请MEMS振镜的内部结构示意图。FIG. 5 is a schematic diagram of the internal structure of the MEMS galvanometer of this application.
附图标记：Reference signs:
10-红外相机、11-镜头、111-镜片、20-MEMS振镜、21-反射镜、221-电极、23-PCB板、24-衬底、25-保护罩。10-Infrared camera, 11-lens, 111-lens, 20-MEMS galvanometer, 21-reflection mirror, 221-electrode, 23-PCB board, 24-substrate, 25-protective cover.
具体实施方式Detailed ways
下面结合附图及具体实施例，详细阐述本发明的优势。The advantages of the present invention will be described in detail below in conjunction with the drawings and specific embodiments.
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。The exemplary embodiments will be described in detail here, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.
在本公开使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本公开。在本公开和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。还应当理解，本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。The terms used in the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. The singular forms of "a", "said" and "the" used in the present disclosure and appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and/or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.
应当理解，尽管在本公开可能采用术语第一、第二、第三等来描述各种信息，但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如，在不脱离本公开范围的情况下，第一信息也可以被称为第二信息，类似地，第二信息也可以被称为第一信息。取决于语境，如在此所使用的词语“如果”可以被解释成为“在……时”或“当……时”或“响应于确定”。It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, the information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as second information, and similarly, the second information may also be referred to as first information. Depending on the context, the word "if" as used herein can be interpreted as "when" or "when" or "in response to determination".
在本发明的描述中，需要理解的是，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, not It indicates or implies that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.
在本发明的描述中，除非另有规定和限定，需要说明的是，术语“安装”、“相连”、 “连接”应做广义理解，例如，可以是机械连接或电连接，也可以是两个元件内部的连通，可以是直接相连，也可以通过中间媒介间接相连，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语的具体含义。In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected", and "connected" should be interpreted broadly. For example, they can be mechanically connected or electrically connected, or two The internal communication of the elements may be directly connected or indirectly connected through an intermediary. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms can be understood according to specific circumstances.
在后续的描述中，使用用于表示元件的诸如“模块”、“部件”或“单元”的后缀仅为了有利于本发明的说明，其本身并没有特定的意义。因此，“模块”与“部件”可以混合地使用。In the following description, the use of suffixes such as “module”, “part” or “unit” used to indicate elements is only for the purpose of facilitating the description of the present invention, and has no specific meaning in itself. Therefore, "modules" and "parts" can be mixed.
图1-5所示为本申请的一实施例。如图1所示，本申请的红外测温装置包括：红外相机10和MEMS振镜20。Figures 1-5 show an embodiment of this application. As shown in FIG. 1, the infrared temperature measurement device of the present application includes: an infrared camera 10 and a MEMS galvanometer 20.
如图3所示，所述红外相机10包括包含镜片111的镜头11以及成像控制***。优选地，所述镜片111包括滤波片从而仅允许红外线进入所述镜头11。所述成像控制***包括红外线传感器、信号放大电路、数据处理单元，所述红外线传感器将接收到的目标物发射的红外线热辐射转换为电信号，所述电信号依次通过信号放大电路和数据处理单元得到温度数据。所述红外线传感器包括热敏检测元件，例如热敏电阻，从而能够将接收到的红外热辐射转换为相应的电信号。优选地，所述红外相机10进一步包括通信模块、存储单元和显示器，所述温度数据存储于存储单元、显示于所述显示器、并且通过所述通信模块传输至服务器和/或智能终端，所述温度数据为温度值和/或热红外图像。优选地，所述通信模块为无线通信模块。所述智能终端可以包括智能手机、平板电脑、笔记本电脑、掌上电脑、个人数字助理、便携式媒体播放器、导航装置、可穿戴设备、智能手环、计步器等移动终端，以及诸如数字TV、台式计算机等固定终端。优选地，所述红外相机10为红外热成像相机，本申请的所述红外相机10可以为本领域的已有的各种红外热成像相机。As shown in FIG. 3, the infrared camera 10 includes a lens 11 including a lens 111 and an imaging control system. Preferably, the lens 111 includes a filter to allow only infrared rays to enter the lens 11. The imaging control system includes an infrared sensor, a signal amplifying circuit, and a data processing unit. The infrared sensor converts the received infrared thermal radiation emitted by the target into an electrical signal, and the electrical signal sequentially passes through the signal amplifying circuit and the data processing unit Get temperature data. The infrared sensor includes a thermal detection element, such as a thermistor, so that the received infrared thermal radiation can be converted into a corresponding electrical signal. Preferably, the infrared camera 10 further includes a communication module, a storage unit, and a display. The temperature data is stored in the storage unit, displayed on the display, and transmitted to the server and/or smart terminal through the communication module. The temperature data is a temperature value and/or a thermal infrared image. Preferably, the communication module is a wireless communication module. The smart terminal may include smart phones, tablet computers, notebook computers, palmtop computers, personal digital assistants, portable media players, navigation devices, wearable devices, smart bracelets, pedometers and other mobile terminals, as well as mobile terminals such as digital TV, Fixed terminals such as desktop computers. Preferably, the infrared camera 10 is an infrared thermal imaging camera, and the infrared camera 10 of the present application may be various existing infrared thermal imaging cameras in the art.
如图4-5所示，所述MEMS振镜20包括PCB板23、设于PCB板23的衬底24、设于衬底24的驱动单元、设于驱动单元上方的反射镜21和设于反射镜21外侧的保护罩25。优选地，所述保护罩25为透明玻璃，用于保护反射镜21和衬底24上的电极221和驱动电路。所述反射镜21的反射面镀金(Au)或其他可行的金属镀膜以增强对红外线的反射。所述驱动单元包括电极221和驱动电路。所述反射镜21设于所述电极221的上方。所述驱动单元用于驱动所述反射镜21相对于所述红外相机10发生角度偏转。所述驱动电路向所述电极221施加电压以使所述电极221之间产生静电场，所述反射镜21在静电力的作用下发生角度偏转。所述反射镜21偏转的角度与静电场的强度有关，强度越大，偏转角度响应越大。所述驱动电路通过调节施加到电极上的电压大小，产生不同大小的静电场，从而控制所述反射镜产生确定角度的偏转，从而实现可控的反射镜角度偏转，实现 大范围的扫描。所述MEMS振镜20的驱动方式为静电驱动。所述MEMS振镜20可以为本领域已有的各种MEMS振镜。As shown in FIGS. 4-5, the MEMS galvanometer 20 includes a PCB board 23, a substrate 24 arranged on the PCB board 23, a driving unit arranged on the substrate 24, a mirror 21 arranged above the driving unit and The protective cover 25 outside the reflector 21. Preferably, the protective cover 25 is transparent glass for protecting the electrode 221 and the driving circuit on the reflector 21 and the substrate 24. The reflective surface of the reflector 21 is plated with gold (Au) or other feasible metal coatings to enhance the reflection of infrared rays. The driving unit includes an electrode 221 and a driving circuit. The reflecting mirror 21 is arranged above the electrode 221. The driving unit is used to drive the reflecting mirror 21 to undergo angular deflection relative to the infrared camera 10. The driving circuit applies a voltage to the electrodes 221 to generate an electrostatic field between the electrodes 221, and the mirror 21 undergoes angular deflection under the action of electrostatic force. The deflection angle of the mirror 21 is related to the intensity of the electrostatic field. The greater the intensity, the greater the deflection angle response. The driving circuit generates electrostatic fields of different magnitudes by adjusting the magnitude of the voltage applied to the electrodes, thereby controlling the reflecting mirror to produce a definite angle of deflection, so as to realize the controllable angle deflection of the reflecting mirror and realize a wide range of scanning. The driving mode of the MEMS galvanometer 20 is electrostatic driving. The MEMS galvanometer 20 may be various MEMS galvanometers in the field.
值得注意的是，在其他实施例中，所述MEMS振镜的驱动方式也可以为静电驱动、电磁驱动或压电驱动中的一种或多种。值得注意的是，在其他实施例中，所述MEMS振镜20也可以替换为振镜，所述振镜的驱动单元为电机，所述振镜的反射镜通过所述电极驱动发生角度偏转。It is worth noting that in other embodiments, the driving mode of the MEMS galvanometer may also be one or more of electrostatic driving, electromagnetic driving, or piezoelectric driving. It is worth noting that in other embodiments, the MEMS galvanometer 20 can also be replaced with a galvanometer, the driving unit of the galvanometer is a motor, and the mirror of the galvanometer is driven by the electrodes to cause angular deflection.
如图1-2所示，所述反射镜21与所述镜片111的主光轴相交，优选地，所述反射镜21的中心轴与所述镜片111的主光轴相交，来自被测目标的红外线经所述MEMS振镜20的所述反射镜21反射后通过所述红外相机10的所述镜头11到达所述成像控制***，所述成像控制***将接收到的目标物体发射的红外辐射转换为温度值和/热红外图像显示于所述红外相机10的显示器上。所述红外相机10的视场角是指以所述红外相机10的镜头11为顶点，以被测目标的物像可通过镜头的最大范围的两条边缘构成的夹角为视场角，视场角分为水平视场角和垂直视场角。所述MEMS振镜20的偏转角度是指所述反射镜21从无偏转位置到向某一方向偏转达到最大程度时的位置之间的夹角。如图1所示，所述红外相机的垂直视场角为a，a为30°～60°。所述MEMS振镜20的偏转角为b，b为20°～40°。所述MEMS振镜20为沿X轴方向转动的单轴MEMS振镜，X轴是指垂直于图1纸面方向的所述反射镜21的中心轴，所述反射镜21沿着X轴做顺时针和逆时针转动。由于所述反射镜21可以从无偏转位置向两个完全相反的方向偏转，具体地，图2中所示的光路放大图分别显示了反射镜21沿X轴转动时，所述反射镜21在三个位置状态时的光路原理示意，三个位置状态分别为：逆时针偏转达到最大程度时的位置状态、无偏转的位置状态、顺时针偏转达到最大程度时的位置状态。因此，由图1-2可知，在红外相机10垂直视场角a的基础上，通过所述MEMS振镜20的所述反射镜21的角度偏转，所述红外测温装置的垂直视场角扩大为a+2b，即本申请所述红外测温装置的视场角范围为70°～140°。As shown in Figures 1-2, the reflector 21 intersects the main optical axis of the lens 111, preferably, the central axis of the reflector 21 intersects the main optical axis of the lens 111, and comes from the measured target After being reflected by the reflecting mirror 21 of the MEMS galvanometer 20, the infrared rays pass through the lens 11 of the infrared camera 10 to reach the imaging control system, and the imaging control system will receive the infrared radiation emitted by the target object. The converted temperature value and/or thermal infrared image is displayed on the display of the infrared camera 10. The angle of view of the infrared camera 10 refers to the lens 11 of the infrared camera 10 as the vertex, and the angle formed by the two edges of the maximum range through which the object image of the measured target can pass through the lens is the angle of view. Field angle is divided into horizontal field of view and vertical field of view. The deflection angle of the MEMS galvanometer 20 refers to the angle between the mirror 21 from the non-deflection position to the position when the deflection in a certain direction reaches the maximum extent. As shown in Fig. 1, the vertical field of view of the infrared camera is a, and a is 30°-60°. The deflection angle of the MEMS galvanometer 20 is b, and b is 20°-40°. The MEMS galvanometer 20 is a single-axis MEMS galvanometer that rotates along the X-axis. The X-axis refers to the central axis of the mirror 21 perpendicular to the direction of the paper in FIG. Turn clockwise and counterclockwise. Since the reflector 21 can be deflected from the non-deflection position to two completely opposite directions, specifically, the enlarged views of the optical path shown in FIG. 2 respectively show that when the reflector 21 rotates along the X axis, the reflector 21 is The principle of the light path in the three position states is shown. The three position states are: the position state when the counterclockwise deflection reaches the maximum degree, the position state without deflection, and the position state when the clockwise deflection reaches the maximum degree. Therefore, it can be seen from FIGS. 1-2 that on the basis of the vertical viewing angle a of the infrared camera 10, the vertical viewing angle of the infrared temperature measuring device is Expanded to a+2b, that is, the field of view of the infrared temperature measuring device described in the present application ranges from 70° to 140°.
值的注意的是，在其他实施例中，当所述MEMS振镜20为沿Y轴方向转动的单轴MEMS振镜，所述Y轴是指与X轴垂直相交的所述反射镜21的中心轴。假设所述红外相机10的水平视场角为a时，所述反射镜21沿Y轴转动，从而将所述红外测温装置的水平视场角a扩大为a+2b。It should be noted that, in other embodiments, when the MEMS galvanometer 20 is a single-axis MEMS galvanometer that rotates along the Y-axis, the Y-axis refers to the axis of the mirror 21 perpendicular to the X-axis. The central axis. Assuming that the horizontal viewing angle of the infrared camera 10 is a, the reflecting mirror 21 rotates along the Y axis, thereby expanding the horizontal viewing angle a of the infrared temperature measuring device to a+2b.
值的注意的是，在其他实施例中，当所述MEMS振镜20为双轴振镜时，所述红外测温装置的垂直视场角和水平视场角均被扩大为a+2b。It should be noted that, in other embodiments, when the MEMS galvanometer 20 is a biaxial galvanometer, the vertical field of view and the horizontal field of view of the infrared temperature measuring device are both expanded to a+2b.
综上，本申请的红外测温装置通过在红外相机10附近放置MEMS振镜20，通过 MEMS振镜20扩展红外相机10的视场角，来帮助本申请的红外测温装置获得更广范围的红外热辐射信息，使得红外测温装置不再局限于近距离的手持式测温，而是可以进行大范围远距离的温度监控，从而可以应用于不同的场景。In summary, the infrared temperature measurement device of the present application helps the infrared temperature measurement device of the present application obtain a wider range of Infrared thermal radiation information makes the infrared temperature measurement device no longer limited to short-range hand-held temperature measurement, but can perform large-range and long-distance temperature monitoring, which can be applied to different scenarios.
示例地，图1中的所述反射镜21处于无偏转的位置状态时，所述反射镜21与所述红外相机10的主光轴之间的夹角为45°，但是，值得注意的是，在其他实施例中，当所述MEMS振镜20的所述反射镜21处于无偏转的位置状态时，所述反射镜21与所述红外相机10的主光轴之间的夹角并不局限于图1，还可以根据测量场景的需要，改变所述反射镜21与所述红外相机10的主光轴之间的夹角，从而改变本申请所述红外测温装置的扫描方位。因此，根据本申请的另一实施例，本申请提供一种红外测温***，所述红外测温***包括壳体、通信模块、设于壳体内的红外相机、可转动地连接于壳体的振镜和设于壳体内且用于控制振镜整体角度的角度调整模块。示例地，所述角度调整模块包括与通信模块电连接的控制模块、与控制模块电连接的驱动单元和与驱动单元连接的角度调整机构。所述控制模块通过所述通信模块接收智能终端的角度调整指令，然后控制驱动单元对角度调整机构进行驱动，从而使角度调整机构调整振镜整体相对于红外相机的方位，从而进一步地调整当振镜的反射镜处于无偏转的位置状态时，反射镜与红外相机的主光轴之间的夹角。示例地，所述驱动单元为马达，所述角度调整机构为伸缩机构，所述伸缩机构通过伸缩而推拉所述振镜整体，从而调整振镜的反射镜在无偏转状态时与红外相机主光轴之间的夹角。或者，示例地，所述驱动单元为静电驱动、电磁驱动或压电驱动中的一种或多种，所述角度调整机构为伸缩机构，所述伸缩机构通过伸缩而推拉所述振镜整体，从而调整振镜的反射镜在无偏转状态时与红外相机主光轴之间的夹角。在该实施例中，所述反射镜与所述红外相机的主光轴之间的夹角范围为0°-180°。在该实施例中，所述红外测温***通过两个方面扩大视场角：1.通过角度调整模块远程控制处于无偏转状态时的所述反射镜与所述红外相机的主光轴之间的夹角，从而大致地宏观调整所述振镜的扫描方向；2.当处于无偏转位置状态时的所述反射镜与所述红外相机的主光轴之间的夹角为某一特定值时，本申请的红外测温装置通过所述振镜自身的角度偏转，进一步增大所述红外测温***的视场角。综上，该实施例中的红外测温***通过角度调整机构对振镜整体的宏观角度调整，以及振镜自身的角度偏转，共同增大红外测温装置的视场角，扩大温度监控范围。For example, when the reflector 21 in FIG. 1 is in an undeflected position, the angle between the reflector 21 and the main optical axis of the infrared camera 10 is 45°, but it is worth noting that In other embodiments, when the reflector 21 of the MEMS galvanometer 20 is in an undeflected position, the angle between the reflector 21 and the main optical axis of the infrared camera 10 is not Limited to FIG. 1, it is also possible to change the angle between the reflector 21 and the main optical axis of the infrared camera 10 according to the needs of the measurement scene, so as to change the scanning orientation of the infrared temperature measuring device of the present application. Therefore, according to another embodiment of the present application, the present application provides an infrared temperature measurement system. The infrared temperature measurement system includes a housing, a communication module, an infrared camera arranged in the housing, and a rotatably connected to the housing. The galvanometer and an angle adjustment module arranged in the housing and used for controlling the overall angle of the galvanometer. Illustratively, the angle adjustment module includes a control module electrically connected to the communication module, a drive unit electrically connected to the control module, and an angle adjustment mechanism connected to the drive unit. The control module receives the angle adjustment instruction of the smart terminal through the communication module, and then controls the drive unit to drive the angle adjustment mechanism, so that the angle adjustment mechanism adjusts the overall orientation of the galvanometer relative to the infrared camera, thereby further adjusting the current vibration The angle between the reflector and the main optical axis of the infrared camera when the reflector of the mirror is in a non-deflection position. For example, the drive unit is a motor, the angle adjustment mechanism is a telescopic mechanism, and the telescopic mechanism pushes and pulls the galvanometer as a whole by telescoping, so as to adjust the mirror of the galvanometer to be in a non-deflection state with the main light of the infrared camera. The angle between the shafts. Or, for example, the drive unit is one or more of electrostatic drive, electromagnetic drive, or piezoelectric drive, the angle adjustment mechanism is a telescopic mechanism, and the telescopic mechanism pushes and pulls the entire galvanometer through expansion and contraction, Thus, the angle between the mirror of the galvanometer and the main optical axis of the infrared camera in the non-deflection state can be adjusted. In this embodiment, the angle between the reflector and the main optical axis of the infrared camera ranges from 0° to 180°. In this embodiment, the infrared temperature measurement system expands the field of view angle in two ways: 1. The angle adjustment module is used to remotely control the distance between the reflector and the main optical axis of the infrared camera when it is in a non-deflection state. The angle between the mirror and the main optical axis of the infrared camera is a certain value when it is in the non-deflection position. When the infrared temperature measurement device of the present application is deflected by the angle of the galvanometer itself, the field of view of the infrared temperature measurement system is further increased. In summary, the infrared temperature measurement system in this embodiment adjusts the overall macro angle of the galvanometer through the angle adjustment mechanism and the angle deflection of the galvanometer itself, which jointly increases the field of view of the infrared temperature measurement device and expands the temperature monitoring range.
综上所述，本申请的红外测温装置通过在红外相机附近放置振镜，通过振镜大幅度扩展红外相机的视场角，来帮助红外相机获得更广范围的红外热辐射信息，使得红外测温装置不再局限于手持式，可以进行远距离大范围的温度监控，从而可以应用于不同的 场景。In summary, the infrared temperature measuring device of the present application places a galvanometer near the infrared camera and greatly expands the field of view of the infrared camera through the galvanometer to help the infrared camera obtain a wider range of infrared heat radiation information, so that the infrared The temperature measuring device is no longer limited to hand-held, it can carry out long-distance and wide-range temperature monitoring, which can be applied to different scenarios.
以上对本发明的具体实施例进行了详细描述，但其只是作为范例，本发明并不限制于以上描述的具体实施例。对于本领域技术人员而言，任何对本发明进行的等同修改和替代也都在本发明的范畴之中。因此，在不脱离本发明的精神和范围下所作的均等变换和修改，都应涵盖在本发明的范围内。The specific embodiments of the present invention are described in detail above, but they are only examples, and the present invention is not limited to the specific embodiments described above. For those skilled in the art, any equivalent modifications and substitutions made to the present invention are also within the scope of the present invention. Therefore, all equivalent changes and modifications made without departing from the spirit and scope of the present invention should all fall within the scope of the present invention.

Claims (10)

  1. 一种红外测温装置，其特征在于，包括：An infrared temperature measuring device, which is characterized in that it comprises:
    红外相机，所述红外相机包括包含镜片的镜头以及成像控制***；An infrared camera, the infrared camera including a lens including a lens and an imaging control system;
    振镜，所述振镜包括反射镜和驱动单元，所述驱动单元用于驱动所述反射镜相对于所述红外热成像相机发生角度偏转；A galvanometer, the galvanometer includes a mirror and a driving unit, and the driving unit is used to drive the mirror to make an angular deflection relative to the infrared thermal imaging camera;
    所述反射镜与所述镜片的主光轴相交，来自目标物的红外线经所述反射镜反射后通过所述镜头到达所述成像控制***。The reflector intersects the main optical axis of the lens, and the infrared rays from the target are reflected by the reflector and reach the imaging control system through the lens.
  2. 如权利要求1所述红外测温装置，其特征在于，所述振镜为MEMS振镜。8. The infrared temperature measuring device of claim 1, wherein the galvanometer is a MEMS galvanometer.
  3. 如权利要求1所述红外测温装置，其特征在于，所述反射镜的中心轴与所述镜片的主光轴相交。The infrared temperature measuring device according to claim 1, wherein the central axis of the reflector intersects the main optical axis of the lens.
  4. 如权利要求1所述红外测温装置，其特征在于，所述红外相机的视场角为a，所述振镜的偏转角度为b，所述红外测温装置的视场角为a+2b，其中，a的范围为30°～60°，b的范围为20°～40°。The infrared temperature measuring device according to claim 1, wherein the field angle of the infrared camera is a, the deflection angle of the galvanometer is b, and the field angle of the infrared temperature measuring device is a+2b , Wherein the range of a is 30°-60°, and the range of b is 20°-40°.
  5. 如权利要求1所述红外测温装置，其特征在于，所述反射镜的反射面镀金。5. The infrared temperature measuring device according to claim 1, wherein the reflecting surface of the reflecting mirror is plated with gold.
  6. 如权利要求2所述红外测温装置，其特征在于，所述MEMS振镜为单轴微振镜或双轴微振镜。3. The infrared temperature measuring device of claim 2, wherein the MEMS galvanometer is a single-axis micro galvanometer or a dual-axis micro galvanometer.
  7. 如权利要求2所述红外测温装置，其特征在于，所述MEMS振镜的驱动方式为静电驱动、电磁驱动或压电驱动中的一种或多种。3. The infrared temperature measuring device according to claim 2, wherein the driving mode of the MEMS galvanometer is one or more of electrostatic driving, electromagnetic driving or piezoelectric driving.
  8. 如权利要求7所述红外测温装置，其特征在于，所述驱动单元包括电极和驱动电路，所述驱动电路向所述电极施加电压以使所述电极之间产生静电力，所述反射镜在所述静电力的作用下发生角度偏转。7. The infrared temperature measuring device according to claim 7, wherein the driving unit comprises an electrode and a driving circuit, the driving circuit applies a voltage to the electrode to generate an electrostatic force between the electrodes, and the reflecting mirror The angular deflection occurs under the action of the electrostatic force.
  9. 如权利要求1所述红外测温装置，其特征在于，所述成像控制***包括红外线传感器、信号放大电路、数据处理单元，所述红外线传感器将接收到的目标物发射的红外线热辐射转换为电信号，所述电信号依次通过信号放大电路和数据处理单元得到温度数据。The infrared temperature measuring device according to claim 1, wherein the imaging control system comprises an infrared sensor, a signal amplifier circuit, and a data processing unit, and the infrared sensor converts the infrared thermal radiation emitted by the received target into electricity A signal, and the electrical signal sequentially passes through a signal amplifying circuit and a data processing unit to obtain temperature data.
  10. 如权利要求9所述红外测温装置，其特征在于，所述红外相机进一步包括通信模块、存储单元和显示器，所述温度数据存储于存储单元、显示于所述显示器、并且通过所述通信模块传输至服务器和/或智能终端，所述温度数据为温度值和/或热红外图像。The infrared temperature measuring device according to claim 9, wherein the infrared camera further comprises a communication module, a storage unit, and a display, and the temperature data is stored in the storage unit, displayed on the display, and passed through the communication module. Transmitted to the server and/or smart terminal, the temperature data is a temperature value and/or a thermal infrared image.
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CN101344433A (en) * 2008-08-26 2009-01-14 合肥金星机电科技发展有限公司 Novel infrared temperature measurement scanner
CN109844608A (en) * 2016-09-09 2019-06-04 谢菲尔德大学 Device and method for generating thermographic image data
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