WO2021200826A1 - Compound - Google Patents

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Publication number
WO2021200826A1
WO2021200826A1 PCT/JP2021/013306 JP2021013306W WO2021200826A1 WO 2021200826 A1 WO2021200826 A1 WO 2021200826A1 JP 2021013306 W JP2021013306 W JP 2021013306W WO 2021200826 A1 WO2021200826 A1 WO 2021200826A1
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Prior art keywords
ring
group
compound
formula
formulas
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PCT/JP2021/013306
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French (fr)
Japanese (ja)
Inventor
悠司 淺津
浩司 久門
由紀 西上
Original Assignee
住友化学株式会社
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Application filed by 住友化学株式会社 filed Critical 住友化学株式会社
Priority to KR1020227036875A priority Critical patent/KR20220163974A/en
Priority to CN202180026579.7A priority patent/CN115443265A/en
Publication of WO2021200826A1 publication Critical patent/WO2021200826A1/en

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C233/00—Carboxylic acid amides
    • C07C233/57—Carboxylic acid amides having carbon atoms of carboxamide groups bound to carbon atoms of rings other than six-membered aromatic rings
    • C07C233/58—Carboxylic acid amides having carbon atoms of carboxamide groups bound to carbon atoms of rings other than six-membered aromatic rings having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/16—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and singly-bound oxygen atoms bound to the same carbon atom of an acyclic carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/17—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and doubly-bound oxygen atoms bound to the same acyclic carbon skeleton
    • C—CHEMISTRY; METALLURGY
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    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/24—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and singly-bound nitrogen atoms, not being further bound to other hetero atoms, bound to the same saturated acyclic carbon skeleton
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    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/24—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and singly-bound nitrogen atoms, not being further bound to other hetero atoms, bound to the same saturated acyclic carbon skeleton
    • C07C255/25—Aminoacetonitriles
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    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/31—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms having cyano groups bound to acyclic carbon atoms of a carbon skeleton containing rings other than six-membered aromatic rings
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    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/45—Carboxylic acid nitriles having cyano groups bound to carbon atoms of rings other than six-membered aromatic rings
    • C07C255/46—Carboxylic acid nitriles having cyano groups bound to carbon atoms of rings other than six-membered aromatic rings to carbon atoms of non-condensed rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
    • C07C309/01—Sulfonic acids
    • C07C309/25—Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton
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    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
    • C07C309/63—Esters of sulfonic acids
    • C07C309/71—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C317/00—Sulfones; Sulfoxides
    • C07C317/12—Sulfones; Sulfoxides having sulfone or sulfoxide groups bound to carbon atoms of rings other than six-membered aromatic rings
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    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
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    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C327/00—Thiocarboxylic acids
    • C07C327/02—Monothiocarboxylic acids
    • C07C327/04—Monothiocarboxylic acids having carbon atoms of thiocarboxyl groups bound to hydrogen atoms or to acyclic carbon atoms
    • C07C327/12—Monothiocarboxylic acids having carbon atoms of thiocarboxyl groups bound to hydrogen atoms or to acyclic carbon atoms to carbon atoms of an unsaturated carbon skeleton containing rings
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    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C327/00—Thiocarboxylic acids
    • C07C327/20—Esters of monothiocarboxylic acids
    • C07C327/22—Esters of monothiocarboxylic acids having carbon atoms of esterified thiocarboxyl groups bound to hydrogen atoms or to acyclic carbon atoms
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    • C07C327/00—Thiocarboxylic acids
    • C07C327/36—Esters of dithiocarboxylic acids
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    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/02—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
    • C07D209/04—Indoles; Hydrogenated indoles
    • C07D209/10—Indoles; Hydrogenated indoles with substituted hydrocarbon radicals attached to carbon atoms of the hetero ring
    • C—CHEMISTRY; METALLURGY
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    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/04—1,2,3-Triazoles; Hydrogenated 1,2,3-triazoles
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/14—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with hydrogen or carbon atoms directly attached to at least one ring carbon atom
    • C07D251/24—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with hydrogen or carbon atoms directly attached to at least one ring carbon atom to three ring carbon atoms
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    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/26—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hetero atoms directly attached to ring carbon atoms
    • C07D251/30—Only oxygen atoms
    • C07D251/32—Cyanuric acid; Isocyanuric acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D309/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings
    • C07D309/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C07D309/04—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only ring hetero atom, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D341/00—Heterocyclic compounds containing rings having three or more sulfur atoms as the only ring hetero atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/38—Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)]
    • C07F9/40—Esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/24—Catalysts containing metal compounds of tin
    • C08G18/242—Catalysts containing metal compounds of tin organometallic compounds containing tin-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
    • C08G18/3855—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C09B23/10—The polymethine chain containing an even number of >CH- groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B57/00—Other synthetic dyes of known constitution
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    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
    • C09B67/006—Preparation of organic pigments
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/04—Systems containing only non-condensed rings with a four-membered ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/18—Systems containing only non-condensed rings with a ring being at least seven-membered
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/542—Dye sensitized solar cells

Definitions

  • the present invention relates to a compound.
  • Blue light cut by mixing an absorber that absorbs light with a wavelength of 400 to 500 nm on the display surface, glasses, contact lenses, etc., or by laminating a layer containing an absorber that absorbs light with a wavelength of 400 to 500 nm. Functions can be added.
  • C.I. I. Quinoline compounds such as Solvent Yellow 33 may not have sufficient weather resistance.
  • the present invention includes the following inventions.
  • ring W 1 represents a ring structure having at least one substituent.
  • ring W 1 has the same meaning as above.
  • Each of 14 independently represents a ring structure, and the ring structure may have a substituent.
  • R 3 represents a monovalent substituent.
  • R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represent monovalent substituents.
  • R 1 and R 2 may be connected to each other to form a ring.
  • R 2 and R 3 may be connected to each other to form a ring.
  • R 3 and R 4 may be connected to each other to form a ring.
  • R 4 and R 5 may be connected to each other to form a ring.
  • R 12 and R 13 may be connected to each other to form a ring.
  • R 13 and R 14 may be connected to each other to form a ring.
  • R 14 and R 15 may be connected to each other to form a ring.
  • R 22 and R 23 may be connected to each other to form a ring.
  • R 23 and R 24 may be connected to each other to form a ring.
  • R 24 and R 25 may be connected to each other to form a ring.
  • R 32 and R 33 may be connected to each other to form a ring.
  • R 33 and R 34 may be connected to each other to form a ring.
  • R 34 and R 35 may be connected to each other to form a ring.
  • R 42 and R 43 may be connected to each other to form a ring.
  • R 43 and R 44 may be connected to each other to form a ring.
  • R 44 and R 45 may be connected to each other to form a ring.
  • R 52 and R 53 may be connected to each other to form a ring.
  • R 53 and R 54 may be connected to each other to form a ring.
  • R 54 and R 55 may be connected to each other to form a ring.
  • R 62 and R 63 may be connected to each other to form a ring.
  • R 63 and R 64 may be connected to each other to form a ring.
  • R 64 and R 65 may be connected to each other to form a ring.
  • R 71 and R 72 may be connected to each other to form a ring.
  • R 74 and R 75 may be connected to each other to form a ring.
  • R 81 and R 82 may be connected to each other to form a ring.
  • R 84 and R 85 may be connected to each other to form a ring.
  • R 91 and R 92 may be connected to each other to form a ring.
  • R 94 and R 95 may be connected to each other to form a ring.
  • R 101 and R 102 may be connected to each other to form a ring.
  • R 104 and R 105 may be connected to each other to form a ring.
  • R 111 and R 112 may be connected to each other to form a ring.
  • R 114 and R 115 may be connected to each other to form a ring.
  • R 121 and R 122 may be connected to each other to form a ring.
  • R 124 and R 125 may be connected to each other to form a ring.
  • R 131 and R 132 may be connected to each other to form a ring.
  • R 132 and R 133 may be connected to each other to form a ring.
  • R 133 and R 134 may be connected to each other to form a ring.
  • R 134 and R 135 may be connected to each other to form a ring.
  • R x1 , R x4 and R x7 each independently represent a single bond or a divalent linking group.
  • R x2 and R x5 each independently represent a trivalent linking group.
  • R x3 and R x6 each independently represent a tetravalent linking group.
  • At least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, an alkyl halide group, an aryl halide group, -CO-R 1 , -CO-O.
  • R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are hydrocarbons that may have independent substituents, respectively. represents a group or a halogen atom), -.
  • OCF 3, -SCF 3, -SF 5, -SF 3, or a compound according to -SO are 3 H [2] or [3].
  • At least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, -CO-R 1 , -CO-O-R 2 , -SO 2- R 9 (R 1 , R 2 and R 9 represent hydrocarbon groups or halogen atoms that may independently have substituents, respectively.), -SF 5 , -SF 3 , -SO 3 H, -SO 2
  • epsilon represents the gram extinction coefficient at the maximum absorption wavelength (lambda max).
  • ⁇ ( ⁇ max + 30 nm) represents the gram absorption coefficient at the maximum absorption wavelength ( ⁇ max) + 30 nm.
  • the unit of the gram extinction coefficient is L / (g ⁇ cm).
  • the present invention provides a novel compound that sufficiently absorbs light having a wavelength of around 440 nm and has high weather resistance.
  • the compound of the present invention is a compound containing an anion having a partial structure represented by the formula (X) (hereinafter, may be referred to as compound (X)).
  • compound (X) a compound containing an anion having a partial structure represented by the formula (X) (hereinafter, may be referred to as compound (X)).
  • ring W 1 represents a ring having at least one substituent.
  • Ring ring W 1 is not particularly limited. Ring W 1 may be a single ring or a condensed ring. Ring W 1 may be a hetero ring containing a hetero atom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a constituent requirement of the ring, or an aliphatic hydrocarbon ring composed of a carbon atom and a hydrogen atom. There may be.
  • a hetero atom for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.
  • Ring W 1 is usually a ring having 5 to 18 carbon atoms, preferably having a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure.
  • the ring W 1 preferably has a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms.
  • Ring W 1 is preferably a single ring.
  • Ring W 1 is preferably a ring of an aliphatic hydrocarbon (alicyclic hydrocarbon group).
  • the ring W 1 has, for example, the following ring structure.
  • Ring W 1 has at least one substituent, which is present between two double bonds attached to ring W 1. That is, the compound of the present invention is preferably a compound containing an anion having a partial structure represented by the formula (X-1). [In formula (X-1), ring W 1 represents the same meaning as above, and R 3 represents a monovalent substituent. ]
  • R 3 is not particularly limited as long as it is a monovalent substituent, but for example, a monovalent aliphatic hydrocarbon group, a monovalent aromatic hydrocarbon group, an electron attracting group, an electron donating group, and a heterocyclic group. And so on.
  • the monovalent aliphatic hydrocarbon group represented by R 3 includes a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, a sec-butyl group and an n-pentyl group.
  • the monovalent aromatic hydrocarbon group represented by R 3 includes a phenyl group, a naphthyl group, an anthrasenyl group, a tetrasenyl group, a pentasenyl group, a phenanthryl group, a chrysenyl group, a triphenylenyl group, a tetraphenyl group, a pyrenyl group and a perylenyl group.
  • Aryl groups having 6 to 18 carbon atoms such as coronenyl group and biphenyl group; aralkyl groups having 7 to 18 carbon atoms such as benzyl group, phenylethyl group and naphthylmethyl group; phenoxyethyl group, phenoxydiethylene glycol group and phenoxypolyalkylene glycol Examples thereof include an arylalkoxy group as a group, and an aryl group having 6 to 18 carbon atoms is preferable, and a phenyl group or a benzyl group is more preferable.
  • Examples of the electron donating group represented by R 3 include a hydroxyl group; a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, a hexyloxy group, a heptyloxy group, an octyloxy group, and the like having 1 to 12 carbon atoms.
  • Examples of the heterocyclic group represented by R 3 include a pyrrolidine ring group, a pyrrolidine ring group, an imidazolidine ring group, an imidazoline ring group, an oxazoline ring group, a thiazoline ring group, a piperazine ring group, a morpholine ring group, a piperazine ring group, and an indole.
  • An aliphatic heterocyclic group having 4 to 20 carbon atoms or an aromatic heterocyclic group having 3 to 20 carbon atoms such as a ring group, an isoindole ring group, a quinoline ring group, a thiophene ring group, a pyrrol ring group, a thiazolin ring group and a furan ring group. Ring groups and the like can be mentioned.
  • Examples of the electron-attracting group represented by R 3 include a halogen atom, a nitro group, a cyano group, a carboxy group, an alkyl halide group, an aryl halide group, -OCF 3 , -SCF 3 , -SF 5 , and so on. Examples thereof include -SF 3 , -SO 3 H, -SO 2 H, and groups represented by the formula (z-1). [In formula (z-1), R222 represents a hydrogen atom, a halogen atom, or a hydrocarbon group which may have a substituent.
  • X 1 is -CO-, -COO-, -OCO-, -CS-, -CSS-, -COS-, -CSO-, -SO-, -SO 2- , -NR 223 CO- or -CONR 224.
  • R223 and R224 independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. * Represents a bond. ]
  • halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
  • the alkyl halide groups include trifluoromethyl group, perfluoroethyl group, perfluoropropyl group, perfluoroisopropyl group, perfluorobutyl group, perfluorosec-butyl group, perfluorotert-butyl group, perfluoropentyl group, perfluorohexyl group and dichloromethyl group.
  • alkyl halide group having 1 to 25 carbon atoms such as a group, a bromomethyl group and an iodomethyl group.
  • an alkyl halide group having 1 to 12 carbon atoms is preferably an alkyl halide group having 1 to 12 carbon atoms, more preferably a fluoroalkyl group having 1 to 12 carbon atoms, and further preferably a perfluoroalkyl group having 1 to 12 carbon atoms.
  • the aryl halide group include an aryl halide group having 6 to 18 carbon atoms such as a fluorophenyl group, a chlorophenyl group and a bromophenyl group, and a fluoroaryl group having 6 to 18 carbon atoms is preferable. It is more preferably a perfluoroaryl group of 6-12, and even more preferably a pentafluorophenyl group.
  • X 1 is preferably -CO-, -COO- or -SO 2-.
  • the halogen atom represented by R 222 a fluorine atom, a chlorine atom, a bromine atom, an iodine atom.
  • Examples of the aliphatic hydrocarbon group having 1 to 25 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, a sec-butyl group, an n-pentyl group and an n-.
  • Linear, branched, cyclic alkyl having 1 to 25 carbon atoms such as hexyl group, 1-methylbutyl group, 3-methylbutyl group, n-octyl group, n-decyl, 2-hexyl-octyl group and cyclohexyl group.
  • the group is mentioned, and it is preferably an alkyl having 1 to 12 carbon atoms.
  • the aromatic hydrocarbon group having 6 to 18 carbon atoms include an aryl group having 6 to 18 carbon atoms such as a phenyl group, a naphthyl group, an anthracenyl group and a biphenyl group; and a benzyl group, a phenylethyl group and a naphthylmethyl group. Examples thereof include 7 to 18 aralkyl groups.
  • the substituent which may be a hydrocarbon group having represented by R 222, halogen atom, hydroxy group, and the like.
  • Alkyl groups having 1 to 6 carbon atoms represented by R223 and R224 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, tert-butyl group, sec-butyl group and n. Examples thereof include linear or branched alkyl having 1 to 6 carbon atoms such as a pentyl group, an n-hexyl group and a 1-methylbutyl group.
  • the groups represented by the formula (z-1) are -CO-R 1 , -CO- OR 2 , -CO-NR 3 R 3k , -CO-SR 4 , -CS-R 5 ,- CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each represent a hydrocarbon group or a halogen atom which may have a substituent independently).
  • -CO-R 1, -CO-O -R 2, more preferably -SO 2 -R 9, -SO 2- R 9 is even more preferred.
  • -SO 2 -R 10 (R 10 is an aromatic hydrocarbon group having to 18 6 carbon atoms which may have a substituent), - SO 2 CF 3, -SO 2 CHF 2, -SO 2 CH 2 It is even more preferably F.
  • R 3 is preferably an electron-attracting group, preferably Cyan group, nitro group, alkyl halide group, aryl halide group, -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-O-R 2 , -CO -NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2-
  • R 9 (R) 1 represents R 2, R 3, R 3k , R 4, R 5, R 6, R 7, R 8 and R 9 each independently may be substituted hydrocarbon group or a halogen atom ), -OCF 3 or -SCF 3 is more preferred.
  • Ring W 1 may have a substituent other than the substituent represented by R 3.
  • substituents include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; carbon such as methyl, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group and nonyl group.
  • An aliphatic hydrocarbon group having a number of 1 to 25 (preferably an alkyl group having 1 to 12 carbon atoms); a fluoromethyl group, a difluoromethyl group, a trifluoromethyl group, a 2-fluoroethyl group, a 2,2-difluoroethyl group, Alkyl halide groups having 1 to 12 carbon atoms such as 2,2,2-trifluoroethyl group, 1,1,2,2-tetrafluoroethyl group, 1,1,2,2,2-pentafluoroethyl group
  • An alkoxy group having 1 to 12 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, a hexyloxy group; a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group
  • Alkylthio group having 1 to 12 carbon atoms monofluoromethoxy group, difluoromethoxy group, trifluoromethoxy group, 2-fluoroethoxy group, 1,1,2,2,2-pentafluoroethoxy group and the like having 1 to 12 carbon atoms.
  • Amino group which may be substituted with one alkyl group having 1 to 6 carbon atoms; N-position such as carbamoyl group, N-methylcarbamoyl group, N, N-dimethylcarbamoyl group is substituted with alkyl having 1 to 6 carbon atoms.
  • Carbamoyl group which may be used; alkylcarbonyloxy group having 2 to 12 carbon atoms such as methylcarbonyloxy group and ethylcarbonyloxy group; alkylsulfonyl group having 1 to 12 carbon atoms such as methylsulfonyl group and ethylsulfonyl group; phenyl Aromatic hydrocarbon groups having 6 to 25 carbon atoms (preferably aryl groups having 6 to 18 hydrocarbons) such as groups, naphthyl groups and diphenyl groups; arylsulfonyl groups having 6 to 12 carbon atoms such as phenylsulfonyl groups; methoxysulfonyl groups.
  • An alkoxysulfonyl group having 1 to 12 carbon atoms such as a group and an ethoxysulfonyl group; an acyl group having 2 to 12 carbon atoms such as an acetyl group and an ethylcarbonyl group; an aldehyde group; a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group and a butyl
  • An alkoxycarbonyl group having 2 to 12 carbon atoms such as an oxycarbonyl group; methoxythiocarbonyl Like -SF 5 or the like; a cyano group; a nitro group, a hydroxyl group, a thiol group, a sulfo group, a carbamoyl group, a carboxyl group, -SF 3 group, alkoxythiocarbonyl group having 2 to 12 carbon atoms such as ethoxycarbonyl thiocarbonyl group ..
  • the anion having a partial structure represented by the formula (X-1) may be an anion represented by the formula (I) to an anion represented by the formula (IV) or an anion represented by the formula (VIII). preferable.
  • rings W 1 and R 3 have the same meanings as described above, respectively.
  • Ring W 2 , ring W 3 , ring W 4 , ring W 5 , ring W 6 , ring W 7 and ring W 14 each independently represent a ring structure, which ring structure has a substituent. May be good.
  • R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represent monovalent substituents.
  • R 1 and R 2 may be connected to each other to form a ring.
  • R 2 and R 3 may be connected to each other to form a ring.
  • R 3 and R 4 may be connected to each other to form a ring.
  • R 4 and R 5 may be connected to each other to form a ring.
  • R 12 and R 13 may be connected to each other to form a ring.
  • R 13 and R 14 may be connected to each other to form a ring.
  • R 14 and R 15 may be connected to each other to form a ring.
  • R 22 and R 23 may be connected to each other to form a ring.
  • R 23 and R 24 may be connected to each other to form a ring.
  • R 24 and R 25 may be connected to each other to form a ring.
  • R 32 and R 33 may be connected to each other to form a ring.
  • R 33 and R 34 may be connected to each other to form a ring.
  • R 34 and R 35 may be connected to each other to form a ring.
  • R 42 and R 43 may be connected to each other to form a ring.
  • R 43 and R 44 may be connected to each other to form a ring.
  • R 44 and R 45 may be connected to each other to form a ring.
  • R 52 and R 53 may be connected to each other to form a ring.
  • R 53 and R 54 may be connected to each other to form a ring.
  • R 54 and R 55 may be connected to each other to form a ring.
  • R 62 and R 63 may be connected to each other to form a ring.
  • R 63 and R 64 may be connected to each other to form a ring.
  • R 64 and R 65 may be connected to each other to form a ring.
  • R 131 and R 132 may be connected to each other to form a ring.
  • R 132 and R 133 may be connected to each other to form a ring.
  • R 133 and R 134 may be connected to each other to form a ring.
  • R 134 and R 135 may be connected to each other to form a ring.
  • R x1 and R x7 each independently represent a single bond or a divalent linking group.
  • R x2 represents a trivalent linking group.
  • R x3 represents a tetravalent linking group.
  • the ring structure in the ring W 2 , the ring W 3 , the ring W 4 , the ring W 5 , the ring W 6 , the ring W 7, and the ring W 14 is not particularly limited.
  • Each ring W 2 ⁇ ring W 7 and ring 14 may be a single ring may be a condensed ring.
  • Rings W 2 to W 7 and 14 may be heterocycles containing a hetero atom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a component of the ring.
  • Ring W 2 ⁇ ring W 7 and ring 14 is typically a ring having 5 to 18 carbon atoms, preferably 5 to 7-membered ring structure, more preferably a 6-membered ring structure.
  • the rings W 2 to W 7 and the ring 14 preferably have a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms.
  • Ring W 2 ⁇ ring W 7 and ring 14 are each independently preferably a single ring.
  • Ring W 2 ⁇ ring W 7 and ring 14 may have a substituent, specifically, a substituent which may be ring W 1 optionally has other than the substituent represented by R 3 The same can be mentioned.
  • Substituents wherein the ring W 2 ⁇ ring W 7 and the ring 14 has an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylthio group or an alkyl having 1 to 6 carbon atoms having 1 to 12 carbon atoms It is preferably an amino group that may be substituted with a group.
  • rings W 2 to W 7 and the ring 14 include the same as the specific examples of the ring W 1 .
  • the monovalent substituent represented by R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 is not particularly limited and is the same as the monovalent substituent represented by R 3. Can be mentioned. Specific examples thereof include a monovalent aliphatic hydrocarbon group, a monovalent aromatic hydrocarbon group, an electron attracting group, an electron donating group, and a heterocyclic group. It is preferable that R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 are independently electron-attracting groups, respectively.
  • R 1 and R 2 may be combined with each other to form a ring.
  • the ring formed by bonding R 1 and R 2 to each other may be a monocyclic ring or a condensed ring, but is preferably a monocyclic ring.
  • the ring formed by bonding R 1 and R 2 to each other may contain a hetero atom (nitrogen atom, oxygen atom, sulfur atom) or the like as a component of the ring.
  • the ring formed by bonding R 1 and R 2 to each other is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, and more preferably a 5-membered ring or a 6-membered ring.
  • Examples of the ring formed by bonding R 1 and R 2 to each other include the ring structure described below. [In the formula, * represents a bond. ]
  • the rings formed by combining R 1 and R 2 with each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 4 and R 5 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • Ring R 4 and R 5 are formed by linking each other, the formula (w-1) ⁇ formula (w-15), formula (w-17), formula (w-31), formula (w-32) , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 14 and R 15 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 14 and R 15 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 24 and R 25 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 24 and R 25 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 34 and R 35 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 34 and R 35 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 44 and R 45 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 44 and R 45 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 54 and R 55 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 54 and R 55 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 64 and R 65 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 64 and R 65 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 131 and R 132 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 131 and R 132 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 134 and R 135 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 134 and R 135 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • R 2 and R 3 may be connected to each other to form a ring.
  • the ring formed by connecting R 2 and R 3 includes a double bond bonded to ring W 1 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 2 and R 3 and a ring W 1. Examples of the fused ring formed by the ring formed by bonding R 2 and R 3 to each other and the ring W 1 are represented by the following formulas (w11-1) to (w11-12).
  • the ring structure to be formed is mentioned. [In the equation, ring W 1 has the same meaning as above. * 1 represents a bond with R 1 , * 2 represents a bond with R 4, and * 3 represents a bond with R 5 .
  • R f1 , R f2, and R f3 independently represent an electron-attracting group, a hydrocarbon group, and a hydroxyl group, respectively.
  • m1 represents an integer of 0 to 6
  • m2 represents an integer of 0 to 4
  • m3 represents an integer of 0 to 2.
  • fused ring formed by the ring formed by bonding R 2 and R 3 to each other and the ring W 1 include the ring structure described below.
  • R 12 and R 13 may be connected to each other to form a ring.
  • the ring formed by connecting R 12 and R 13 includes a double bond bonded to ring W 2 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 12 and R 13 and a ring W 2. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 22 and R 23 may be connected to each other to form a ring.
  • the ring formed by connecting R 22 and R 23 includes a double bond bonded to ring W 3 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 22 and R 23 and a ring W 3. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 32 and R 33 may be connected to each other to form a ring.
  • the ring formed by connecting R 32 and R 33 includes a double bond bonded to ring W 4 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 32 and R 33 and a ring W 4. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 42 and R 43 may be connected to each other to form a ring.
  • the ring formed by connecting R 42 and R 43 includes a double bond bonded to ring W 5 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 42 and R 43 and a ring W 5. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 52 and R 53 may be connected to each other to form a ring.
  • the ring formed by connecting R 52 and R 53 includes a double bond bonded to ring W 6 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 52 and R 53 and a ring W 6. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 62 and R 63 may be connected to each other to form a ring.
  • the ring formed by connecting R 62 and R 63 includes a double bond bonded to ring W 7 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 62 and R 63 and a ring W 7. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 132 and R 133 may be connected to each other to form a ring.
  • the ring formed by connecting R 132 and R 133 includes a double bond bonded to ring W 14 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 132 and R 133 and a ring W 14. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
  • R 3 and R 4 may be connected to each other to form a ring.
  • the ring formed by connecting R 3 and R 4 includes a double bond bonded to ring W 1 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 3 and R 4 and a ring W 1.
  • Specific examples of the fused ring formed by the ring W 1 formed by the ring formed by bonding R 3 and R 4 to each other include the rings described below. [In the equation, ring W 1 has the same meaning as above. * 4 represents a bond with R 1 , * 5 represents a bond with R 2, and * 6 represents a bond with R 5 .
  • R f4 , R f5 and R f6 independently represent an electron-attracting group, a hydrocarbon group and a hydroxyl group, respectively.
  • m4 represents an integer of 0 to 6
  • m5 represents an integer of 0 to 4
  • m6 represents an integer of 0 to 2.
  • fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 include the ring structure described below.
  • R 13 and R 14 may be connected to each other to form a ring.
  • the ring formed by connecting R 13 and R 14 includes a double bond bonded to ring W 2 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 13 and R 14 and a ring W 2. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • R 23 and R 24 may be connected to each other to form a ring.
  • the ring formed by connecting R 23 and R 24 includes a double bond bonded to ring W 3 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 23 and R 24 and a ring W 3. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • R 33 and R 34 may be connected to each other to form a ring.
  • the ring formed by connecting R 33 and R 34 includes a double bond bonded to ring W 4 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 33 and R 34 and a ring W 4. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • R 43 and R 44 may be connected to each other to form a ring.
  • the ring formed by connecting R 43 and R 44 includes a double bond bonded to ring W 5 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 43 and R 44 and a ring W 5. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • R 53 and R 54 may be connected to each other to form a ring.
  • the ring formed by connecting R 53 and R 54 includes a double bond bonded to ring W 6 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 53 and R 54 and a ring W 6. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • R 63 and R 64 may be connected to each other to form a ring.
  • the ring formed by connecting R 63 and R 64 includes a double bond bonded to ring W 7 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 63 and R 64 and a ring W 7. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • R 133 and R 134 may be connected to each other to form a ring.
  • the ring formed by connecting R 133 and R 134 includes a double bond bonded to ring W 14 as a component of the ring.
  • a fused ring is formed by a ring formed by connecting R 133 and R 134 and a ring W 14. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
  • each independently has a divalent aliphatic hydrocarbon group having 1 to 18 carbon atoms or a substituent which may have a substituent.
  • examples thereof include a divalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may be used.
  • -CH 2- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group is -O-, -S-, -NR 1B- (R 1B is a hydrogen atom or 1 to 1 to carbon atoms. (Representing an alkyl group of 6), -CO-, -SO 2- , -SO-, -PO 3- may be substituted.
  • Examples of the substituent that the divalent aliphatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group, and an aryl group having 6 to 16 carbon atoms.
  • Examples of the substituent that the divalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group, an aldehyde group and the like.
  • R x1 and R x7 include the linking groups described below.
  • * represents a bond.
  • the divalent linking groups represented by R x1 and R x7 each independently have a divalent aliphatic hydrocarbon group having 1 to 12 carbon atoms and a substituent which may have a substituent. preferably also a divalent aromatic hydrocarbon group which may having 6 to 12 carbon atoms optionally (-CH 2 contained in the aromatic hydrocarbon group having a bivalent aliphatic hydrocarbon group and the divalent said - is, -O -, - S -, - NR 1B -, - CO -, - SO 2 - is preferred that substituted also be) in, and more preferably a linking group as described below.
  • Examples include ⁇ 18 trivalent aromatic hydrocarbon groups.
  • -CH 2- contained in the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO-, -SO. It may be replaced with 2-, -NR 11B- (R 11B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms).
  • the trivalent linking group represented by R x2 is a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms (-CH 2- contained in the trivalent aliphatic hydrocarbon group is -O-, -CO-, -SO 2- may be replaced) and a trivalent aromatic hydrocarbon group having 6 to 18 carbon atoms (-CH 2- contained in the trivalent aromatic hydrocarbon group-is. -O -, - CO -, - SO 2 -. which may be replaced by) is preferably.
  • Specific examples of the trivalent linking group represented by R x2 include the linking groups described below.
  • Examples include to 18 tetravalent aromatic hydrocarbon groups.
  • -CH 2- contained in the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO-, -SO. It may be replaced with 2-, -NR 11C- (R 11C represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms).
  • the substituent that the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
  • the tetravalent linking group represented by R x3 is a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms (-CH 2- contained in the tetravalent aliphatic hydrocarbon group is -O-, -CO-, -SO 2- may be replaced) and a tetravalent aliphatic hydrocarbon group having 6 to 18 carbon atoms (-CH 2- contained in the tetravalent aromatic hydrocarbon group-is. -O -, - CO -, - SO 2 -. which may be replaced by) is preferably.
  • Specific examples of the tetravalent linking group represented by R x3 include the linking groups described below.
  • the anion represented by the formula (I) is more preferably an anion represented by the formula (IA).
  • R 1 , R 2 , R 3 , R 4 and R 5 have the same meanings as described above.
  • R E1 , R E2 , R E3 , R E4 , R E5 and R E6 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 25 carbon atoms or an alkoxy group.
  • at least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, an alkyl halide group, an aryl halide group, -SCF 3 ,-.
  • it is a cyano group, a nitro group, -CO-R 1 , -CO- OR 2 , -SO 2- R 9 , -OCF 3 , -SCF 3 or -SF 5.
  • a cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, -SO 2 -R 10 (R 10 is a substituted group the unprotected 6 to 18 carbon atoms also have Aromatic hydrocarbon groups) are even more preferred, More preferably, it is a cyano group or a nitro group.
  • anion represented by the formula (I) examples include the anions described below.
  • anion represented by the formula (II) examples include the anions described below.
  • anion represented by the formula (III) examples include the anions described below.
  • anion represented by the formula (IV) examples include the anions described below.
  • anion represented by the formula (VIII) examples include the anions described below.
  • the anion having the partial structure represented by the formula (X) is, for example, an anion represented by the formula (V) to the formula (VII). Examples thereof include anions represented by.
  • rings W 1 , R 1 , R 2 , R 4 and R 5 have the same meanings as described above, respectively.
  • Ring W 8 , ring W 9 , ring W 10 , ring W 11 , ring W 12 and ring W 13 each independently represent a ring structure, and the ring structure may have a substituent.
  • R 71 and R 72 may be connected to each other to form a ring.
  • R 74 and R 75 may be connected to each other to form a ring.
  • R 81 and R 82 may be connected to each other to form a ring.
  • R 84 and R 85 may be connected to each other to form a ring.
  • R 91 and R 92 may be connected to each other to form a ring.
  • R 94 and R 95 may be connected to each other to form a ring.
  • R 101 and R 102 may be connected to each other to form a ring.
  • R 104 and R 105 may be connected to each other to form a ring.
  • R 111 and R 112 may be connected to each other to form a ring.
  • R 114 and R 115 may be connected to each other to form a ring.
  • R 121 and R 122 may be connected to each other to form a ring.
  • R 124 and R 125 may be connected to each other to form a ring.
  • R x4 represents a single bond or a divalent linking group.
  • R x5 represents a trivalent linking group.
  • R x6 represents a tetravalent linking group.
  • Rings W 9 to W 12 may be monocyclic or condensed rings, respectively. Rings W 9 to W 12 may be heterocycles containing a hetero atom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a component of the ring. Rings W 9 to W 12 are usually rings having 5 to 18 carbon atoms, preferably having a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure.
  • Rings W 9 to W 12 preferably have a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms. It is preferable that the rings W 9 to W 12 are independent and monocyclic. Rings W 9 to W 12 may have a substituent, and specifically, the same substituents that the ring W 1 may have other than the substituent represented by R 3 are used. Can be mentioned.
  • the substituents of rings W 9 to W 12 are substituted with an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylthio group having 1 to 12 carbon atoms or an alkyl group having 1 to 6 carbon atoms. It is preferably an amino group which may be used.
  • Specific examples of the rings W 9 to 12 include the same as the specific examples of the ring W 1 .
  • Examples of the electron attracting group are the same as those represented by R 3. ..
  • R 9 R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7) , R 8 and R 9 each independently represents which may have a substituent a hydrocarbon group or a halogen atom), -.
  • a OCF 3 or -SCF 3 A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SF 3, -SO 3 H, -SO 2 H, -CO-R 1, -CO-O-R 2, -SO 2 - more preferably R 9, More preferably, it is a cyano group, a nitro group, -CO-R 1 , -CO- OR 2 , -SO 2- R 9 , -OCF 3 , -SCF 3 or -SF 5.
  • a cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, -SO 2 -R 10 (R 10 is a substituted group the unprotected 6 to 18 carbon atoms also have Aromatic hydrocarbon groups) are even more preferred, More preferably, it is a cyano group or a nitro group.
  • R 71 and R 72 may be combined with each other to form a ring.
  • the ring formed by bonding R 71 and R 72 to each other may be a monocyclic ring or a condensed ring, but is preferably a monocyclic ring.
  • the ring formed by bonding R 71 and R 72 to each other may contain a hetero atom (nitrogen atom, oxygen atom, sulfur atom) or the like as a component of the ring.
  • the ring formed by connecting R 71 and R 72 to each other is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, and more preferably a 5-membered ring or a 6-membered ring.
  • Examples of the ring formed by connecting R 71 and R 72 to each other include the same ring formed by connecting R 1 and R 2 to each other.
  • the rings formed by connecting R 71 and R 72 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formula (w-35) to formula (w-42) and formula (w-44) are preferable, and formulas (w-1) to formula (w-6), formula (w-). 13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 74 and R 75 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 74 and R 75 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 81 and R 82 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 81 and R 82 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 84 and R 85 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by combining R 84 and R 85 with each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 91 and R 92 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 91 and R 92 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 94 and R 95 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by combining R 94 and R 95 with each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 101 and R 102 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 101 and R 102 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 104 and R 105 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 104 and R 105 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 111 and R 112 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 111 and R 112 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 114 and R 115 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 114 and R 115 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 121 and R 122 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by connecting R 121 and R 122 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples of the ring formed by connecting R 124 and R 125 to each other include the same ring formed by connecting R 71 and R 72 to each other.
  • the rings formed by the coupling of R 124 and R 125 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32).
  • Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
  • Examples thereof include divalent aromatic hydrocarbon groups of ⁇ 18. -CH 2- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group is -O-, -S-, -NR 1B- (R 1B is a hydrogen atom or 1 to 1 to carbon atoms. (Representing an alkyl group of 6), -CO-, -SO 2- , -SO-, -PO 3- may be substituted.
  • Examples of the substituent that the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
  • Specific examples of the divalent linking group represented by R x4 include the same specific examples of the divalent linking group represented by R x1.
  • a divalent linking group represented by R x4 preferably the linking group described below.
  • Examples include ⁇ 18 trivalent aromatic hydrocarbon groups.
  • -CH 2- contained in the trivalent aliphatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO- , -NR 11B (R 11B is a hydrogen atom or the number of carbon atoms). It represents an alkyl group of 1 to 6)-may be replaced by.
  • the trivalent linking group represented by R x5 is preferably a trivalent aliphatic hydrocarbon group having 1 to 12 carbon atoms which may have a substituent.
  • Specific examples of the trivalent linking group represented by R x5 include the same specific examples of the trivalent linking group represented by R x2.
  • the linking group represented by R x5 is preferably the linking group described below.
  • a tetravalent linking group represented by R x6 a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent or a substituent may have 6 carbon atoms.
  • Examples include to 18 tetravalent aromatic hydrocarbon groups.
  • -CH 2- contained in the tetravalent aliphatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO- , -NR 11C- (R 11C is a hydrogen atom or carbon. It may be replaced by (representing an alkyl group of the number 1 to 6).
  • the substituent that the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
  • the tetravalent linking group represented by R x6 is preferably a tetravalent aliphatic hydrocarbon group having 1 to 12 carbon atoms, which may independently have a substituent.
  • Specific examples of the tetravalent linking group represented by R x6 include the same specific examples of the tetravalent linking group represented by R x3.
  • the tetravalent linking group represented by R x6 is preferably the linking group described below.
  • Examples of the anion represented by the formula (V) include the anions described below.
  • anion represented by the formula (VI) examples include the anions described below.
  • anion represented by the formula (VII) examples include the anions described below.
  • the compound of the present invention is composed of an anion represented by the formula (X) and a pair of cations.
  • the valence of the anion represented by the formula (X) and the valence of the cation are the same, the combination is not limited.
  • the cation may be a cation having the same valence as the anion represented by the formula (X), or is represented by the formula (X). It may have a plurality of monovalent cations so as to have the same valence as the valence of the anion.
  • the valence is the same as the valence of the anion represented by the formula (X), even if it has a monovalent cation and a cation other than the monovalent cation (for example, a divalent cation). good.
  • the cation has a valence of 2 or more, it may have a plurality of anions represented by the monovalent formula (X) so as to have the same valence as the cation.
  • it may have an anion represented by a monovalent formula (X) and an anion represented by a formula (X) other than monovalent. ..
  • the cation may be an organic cation or an inorganic cation. Further, when the valence of the anion represented by the formula (X) is 2 or more, the compound (X) may have an organic cation and an inorganic cation as cations.
  • organic cations include N-methylpyridinium, N-ethylpyridinium, N-propylpyridinium, N-ethyl-2-methylpyridinium, N-ethyl-3-methylpyridinium, 1-ethyl-3- (hydroxymethyl) pyridinium, N-butylpyridinium, N-butyl-4-methylpyridinium, N-butyl-3-methylpyridinium, N-hexylpyridinium, N-octylpyridinium, N-octyl-4-methylpyridinium, 1,1'-dimethyl-4 , 4'-bipyridinium, 1,1'-dibenzyl-4,4'-bipyridinium and other pyridinium cations; Piperidinium cations such as 1-butyl-1-methylpiperidinium and 1-methyl-1-propylpiperidinium; 1-allyl-1-methylpyrrolidinium, 1-butyl
  • Examples of the inorganic cation include alkali metal ions such as lithium ion, sodium ion, potassium ion, rubidium ion, and cesium ion; Monovalent metal ions such as copper (I) ion, silver ion, iron (I) ion; Alkaline earth metal ions such as beryllium ion, magnesium ion, calcium ion, strontium ion, barium ion; Divalent metal ions such as copper (II) ion, nickel ion, cobalt ion, iron (II) ion, manganese ion, palladium ion, zinc ion, germanium (IV) ion; Trivalent metal ions such as aluminum ion, cobalt (III) ion, iron (III) ion, chromium (III) ion, scandium ion, yttrium ion, ruthenium (III) ion, gallium ion, and
  • the cations are alkali metal ion, alkaline earth metal ion, copper (I) ion, copper (II) ion, nickel ion, cobalt (III) ion, iron (II) ion, iron (III) ion, palladium ion and organic. It is preferably a cation, more preferably a potassium ion, a calcium ion, a barium ion, a magnesium ion, a copper (I) ion, a copper (II) ion, a nickel ion and an organic cation, and even more preferably a potassium ion and an organic. It is a cation.
  • Examples of the compound (X) include the compounds listed in Tables 1 to 9 below.
  • the compound (1) is a compound shown below.
  • Examples of the compound (X) having an anion represented by the formula (I) include compounds (1) to (63), and compounds (2) and compounds ( 3), Compound (7) to Compound (11), Compound (13) to Compound (18), Compound (24), Compound (28), Compound (31), Compound (32), Compound (37), Compound ( 40) to compound (44), compound (46), compound (47), compound (49), compound (50), compound (55), compound (58), compound (60) are preferable.
  • Examples of the compound (X) having an anion represented by the formula (II) include compound (64) to compound (92), and the compound (64) and the compound ( 65), compound (67), compound (70), compound (72), compound (75) to compound (77), compound (79), compound (80), compound (83), compound (84), compound ( 86), preferably compound (87).
  • Examples of the compound (X) having an anion represented by the formula (III) include compound (93) to compound (118), and compound (93) and compound ( 94), compound (96), compound (101) to compound (105), compound (107), compound (109), compound (111), compound (115), compound (116).
  • Examples of the compound (X) having an anion represented by the formula (IV) include compound (119) to compound (129), and are compound (125). Is preferable.
  • Examples of the compound (X) having an anion represented by the formula (V) include compound (130) to compound (139), and compound (130) and compound ( 131), compound (134), and compound (135) are preferable.
  • Examples of the compound (X) having an anion represented by the formula (VI) include compound (140) to compound (144), and compound (140) and compound ( 142), preferably compound (144).
  • Examples of the compound (X) having an anion represented by the formula (VII) (hereinafter, may be referred to as compound (VII)) include compound (145) to compound (153).
  • Examples of the compound (X) having an anion represented by the formula (VIII) include compound (154) to compound (163).
  • the compound (I) is, for example, a compound represented by the formula (M-1) (hereinafter, may be referred to as a compound (M-1)) and a compound represented by the formula (M-2) (hereinafter, a compound). It may be obtained by reacting with (M-2).
  • M-1 a compound represented by the formula (M-1)
  • M-2 a compound represented by the formula (M-2)
  • the reaction between compound (M-1) and compound (M-2) is usually carried out by mixing compound (M-1) and compound (M-2), and the base and compound (M-1). It is preferable to add compound (M-2) to the mixture with.
  • the reaction between compound (M-1) and compound (M-2) is preferably carried out in the presence of a methylating agent. It is more preferable to add compound (M-2) to a mixture of compound (M-1), a methylating agent and a base.
  • Examples of the base include metal hydroxides such as sodium hydroxide, lithium hydroxide, potassium hydroxide, cesium hydroxide, rubicium hydroxide, calcium hydroxide, barium hydroxide, and magnesium hydroxide (preferably alkali metal hydroxides).
  • metal hydroxides such as sodium hydroxide, lithium hydroxide, potassium hydroxide, cesium hydroxide, rubicium hydroxide, calcium hydroxide, barium hydroxide, and magnesium hydroxide (preferably alkali metal hydroxides).
  • Metal amides such as sodium methoxyd, potassium methoxyd, lithium methoxyd, sodium ethoxydo, sodium isopropoxide, sodium tertiary butoxide, potassium tertiary butoxide (preferably alkali metal amides); lithium hydride, sodium hydride , Metal hydrides such as potassium hydride, lithium aluminum hydride, sodium boron hydride, aluminum hydride, sodium aluminum hydride; metal oxides such as calcium oxide and magnesium oxide; sodium hydrogen carbonate, sodium carbonate, potassium carbonate, etc.
  • Metal carbonates preferably alkaline earth metal carbonates
  • organic alkyl metal compounds such as normal butyl lithium, tertiary butyl lithium, methyl lithium, glignal reagents; ammonia, triethylamine, diisopropylethylamine, ethanolamine, pyrrolidine, piperidine, Amin compounds such as diazabicycloundecene, diazabicyclononen, guanidine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyridine, aniline, dimethoxyaniline, ammonium acetate, ⁇ -alanine (preferably triethylamine, diisopropylethylamine, etc.) Tertiary amine); metal amide compounds such as lithium diisopropylamide, sodium amide, potassium hexamethyldisilazide (preferably alkali metal amides); sulfonium compounds such as trimethylsul
  • methylating agent examples include iodomethane, dimethyl sulfate, methyl methanesulfonate, methyl fluorosulfonate, methyl paratoluenesulfonate, methyl trifluoromethanesulfonate, trimethyloxonium tetrafluoroborate and the like.
  • the amount of the methylating agent used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, based on 1 mol of compound (M-1).
  • the reaction between compound (M-1) and compound (M-2) may be carried out in the presence of a solvent.
  • Solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N, N-dimethylacetamide. , N, N-dimethylformamide, water and the like.
  • the solvent is preferably a dehydration solvent.
  • the reaction time of the compound (M-1) and the compound (M-2) is usually 0.1 to 10 hours, preferably 0.2 to 3 hours.
  • the reaction temperature of the compound (M-1) and the compound (M-2) is usually ⁇ 50 to 150 ° C., preferably ⁇ 20 to 100 ° C.
  • the amount of the compound (M-2) to be used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, based on 1 mol of the compound (M-1).
  • Examples of the compound (M-1) include the compounds described below.
  • the compound (M-2) a commercially available product may be used, and examples thereof include cloak nitrile.
  • Compound (I) obtained by reacting compound (M-1) with compound (M-2) in the presence of a base usually has a base-derived cation as a counter cation.
  • ion exchange may be carried out by mixing the compound (I) with a salt having the desired cation. The ion exchange may be carried out in the presence of a solvent.
  • the salt having a desired cation is, for example, a chloride salt composed of a desired cation and a chloride ion, a bromide salt composed of a desired cation and a bromide ion, an iodide salt composed of a desired cation and an iodide ion, and the like.
  • a fluoride salt consisting of a desired cation and a fluoride ion, a nitrate consisting of a desired cation and a nitrate ion, a sulfate consisting of a desired cation and a sulfate ion, and a perchlorine composed of a desired cation and a perchlorate ion.
  • Acid salt, sulfonate consisting of desired cation and sulfonate ion, carboxylate consisting of desired cation and carboxylic acid ion, hypochlorite consisting of desired cation and hypochlorite ion, desired Hexafluorophosphate salt composed of the above cation and hexafluorophosphate, imide salt composed of the desired cation and imide, and the like can be mentioned.
  • the compound (M-1) is a compound represented by the formula (M-3) (hereinafter, may be referred to as a compound (M-3)) and a compound represented by the formula (M-4) (hereinafter, a compound). It may be obtained by reacting with (M-4).
  • (M-3) rings W 1A , R 4 and R 5 have the same meanings as described above.
  • R 3 represents the same meaning as described above, and E 1 represents a leaving group.
  • Examples of the leaving group represented by E 1 include a halogen atom, a p-toluenesulfonyl group, a trifluoromethylsulfonyl group and the like.
  • the reaction between the compound (M-3) and the compound (M-4) is carried out by mixing the compound (M-3) and the compound (M-4).
  • the amount of the compound (M-4) to be used is usually 0.1 to 5 mol, preferably 0.5 to 2 mol, based on 1 mol of the compound (M-3).
  • the reaction between compound (M-3) and compound (M-4) is preferably carried out in the presence of a base.
  • a base include metal alkoxides (preferably alkali metal alkoxides) such as sodium methoxyd, potassium methoxyd, lithium methoxyd, sodium ethoxydo, sodium isopropoxide, sodium tertiary butoxide, and potassium tertiary butoxide; lithium hydroxide.
  • Metal hydroxides such as sodium hydroxide and potassium hydroxide, metal hydrides such as sodium hydride, lithium aluminum hydride, sodium hydride; lithium diisopropylamide, pyridine, triethylamine, diisopropylethylamine, piperidine, pyrrolidine, proline
  • metal hydroxides such as sodium hydroxide and potassium hydroxide
  • metal hydrides such as sodium hydride, lithium aluminum hydride, sodium hydride
  • lithium diisopropylamide pyridine, triethylamine, diisopropylethylamine, piperidine, pyrrolidine, proline
  • amine compounds such as.
  • the amount of the base used is usually 0.1 to 10 mol and preferably 0.5 to 5 mol with respect to 1 mol of the compound (M-3).
  • the reaction between compound (M-3) and compound (M-4) may be carried out in the presence of a solvent.
  • Solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N, N-dimethylacetamide. , N, N-dimethylformamide, water and the like.
  • Acetonitrile, tetrahydrofuran, chloroform, dichloromethane and diethyl ether are preferable, acetonitrile, tetrahydrofuran and chloroform are more preferable, and methanol, ethanol, isopropanol and acetonitrile are more preferable.
  • the reaction time of compound (M-3) and compound (M-4) is usually 0.1 to 10 hours.
  • the reaction temperature of the compound (M-3) and the compound (M-4) is usually ⁇ 50 to 150 ° C.
  • Examples of the compound (M-3) include the compounds described below.
  • the compound (M-4) a commercially available product may be used.
  • Compound (M-3) can be obtained by reacting a compound represented by the formula (M-5) (hereinafter, may be referred to as compound (M-5)) with compound (M-2a).
  • compound (M-5) a compound represented by the formula (M-5)
  • compound (M-5) a compound represented by the formula (M-5)
  • M-2a a compound represented by the formula (M-5)
  • rings W 1A , R 4 and R 5 have the same meanings as described above. ]
  • the reaction between the compound (M-5) and the compound (M-2a) can be carried out by mixing the compound (M-5) and the compound (M-2a).
  • the reaction between compound (M-5) and compound (M-2a) is preferably carried out in the presence of a base.
  • the base include the same bases used in the reaction between the compound (M-1) and the compound (M-2).
  • the amount of the base used is usually 0.1 to 5 mol, preferably 0.5 to 2 mol, based on 1 mol of the compound (M-5).
  • the reaction between compound (M-5) and compound (M-2a) may be carried out in the presence of a solvent.
  • the solvent is preferably methanol, ethanol, isopropanol, toluene, or acetonitrile.
  • the reaction time of compound (M-5) and compound (M-2a) is usually 0.1 to 10 hours.
  • the reaction temperature of compound (M-5) and compound (M-2a) is usually ⁇ 50 to 150 ° C.
  • the amount of the compound (M-2a) to be used is usually 0.1 to 10 mol, preferably 0.5 to 2 mol, based on 1 mol of the compound (M-5).
  • Examples of the compound (M-5) include the compounds described below.
  • compound (I) when the combination of R 1 and R 2 and the combination of R 4 and R 5 are the same, compound (I) is a compound represented by the formula (M-6) (hereinafter, compound). It can also be obtained by reacting (M-6) with the compound (M-2). [In the formula (M-6), the rings W 1A and R 3 have the same meanings as described above. ]
  • the reaction between compound (M-6) and compound (M-2) can be carried out by mixing compound (M-6) and compound (M-2).
  • the reaction between compound (M-6) and compound (M-2) is preferably carried out in the presence of a base or a methylating agent, more preferably in the presence of a base and methyl.
  • the reaction between compound (M-6) and compound (M-2) is more preferably a mixture of compound (M-6), compound (M-2), a base and a methylating agent. It is more preferable to mix the compound (M-2) and the base with the mixture of the compound (M-6) and the methylating agent.
  • Examples of the base used in the reaction between the compound (M-6) and the compound (M-2) include the same bases used in the reaction between the compound (M-1) and the compound (M-2). Metal carbonates are preferred, and alkaline earth metal carbonates are more preferred.
  • the amount of the base used is usually 0.1 to 5 mol and preferably 0.5 to 2 mol with respect to 1 mol of the compound (M-6).
  • the methylating agent used in the reaction between the compound (M-6) and the compound (M-2) is the same as the methylating agent used in the reaction between the compound (M-1) and the compound (M-2). However, it is preferably dimethyl sulfate.
  • the amount of the methylating agent used is usually 0.1 to 5 mol and preferably 0.5 to 2 mol with respect to 1 mol of the compound (M-6).
  • the reaction between compound (M-6) and compound (M-2) may be carried out in the presence of a solvent.
  • Solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N, N-dimethylacetamide. , N, N-dimethylformamide, water and the like.
  • the solvent is preferably a dehydration solvent.
  • the reaction time of the compound (M-6) and the compound (M-2) is usually 0.1 to 10 hours, preferably 0.2 to 3 hours.
  • the reaction temperature of the compound (M-6) and the compound (M-2) is usually ⁇ 50 to 150 ° C., preferably ⁇ 20 to 100 ° C.
  • the amount of the compound (M-2) to be used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, based on 1 mol of the compound (M-6).
  • Examples of the compound (M-6) include 2-methyl-1,3-cyclohexanedione.
  • the molecular weight of compound (X) is preferably 3000 or less, more preferably 2000 or less, and even more preferably 1000 or less. Further, it is preferably 50 or more, more preferably 100 or more, and further preferably 200 or more.
  • Compound (X) preferably exhibits maximum absorption at a wavelength of 400 to 550 nm.
  • the maximum absorption wavelength ( ⁇ max) of compound (X) is preferably a wavelength of 410 to 500 nm, more preferably a wavelength of 420 to 480 nm, and even more preferably a wavelength of 430 to 450 nm.
  • the gram absorption coefficient ⁇ at the maximum absorption wavelength ( ⁇ max) is preferably 0.5 or more, more preferably 1.0 or more, and particularly preferably 1.5 or more.
  • the upper limit is not particularly limited, but is generally 10 or less.
  • the gram absorption coefficient ⁇ at ⁇ max of compound (X) is 0.5 or more, it is preferable from the viewpoint that light called blue light can be efficiently absorbed.
  • Compound (X) preferably satisfies the following formula (a). ⁇ ( ⁇ max ) / ⁇ ( ⁇ max + 30 nm) ⁇ 5 (a) Wherein, epsilon (.lambda.max) represents the gram extinction coefficient at the maximum absorption wavelength (lambda max). ⁇ ( ⁇ max + 30 nm) represents the gram absorption coefficient at the maximum absorption wavelength ( ⁇ max) + 30 nm. The unit of the gram extinction coefficient is L / (g ⁇ cm). ] The compound (X) preferably has ⁇ ( ⁇ max) / ⁇ ( ⁇ max + 30 nm) of 5 or more, preferably 10 or more, and particularly preferably 20 or more.
  • the upper limit is not particularly limited, but is generally 1000 or less.
  • ⁇ ( ⁇ max) / ⁇ ( ⁇ max + 30 nm) is 5 or more, it is preferable because coloring of the composition containing the compound (X) can be minimized and only blue light can be selectively absorbed.
  • it is suitable because it can contribute to suppressing the influence on the color display of a display or the like and expanding the color gamut.
  • the present invention also includes a composition containing compound (X) (preferably any one of compound (I) to compound (VIII)).
  • the composition containing the compound (X) of the present invention is the compound (X) (preferably any of the compounds (I) to (VIII)).
  • the resin composition contains any one) and a resin.
  • the above composition can be used for all purposes, but it can be particularly preferably used for applications that may be exposed to light including sunlight or ultraviolet rays.
  • Specific examples include, for example, glass substitutes and their surface coating materials; window glass for dwellings, facilities, transportation equipment, etc., coating materials for light-collecting glass and light source protection glass; window films for dwellings, facilities, transportation equipment, etc .; dwellings, Interior / exterior materials and interior / exterior paints for facilities, transportation equipment, etc.
  • alkyd resin lacquer coatings and coatings formed by the coatings alkyd resin lacquer coatings and coatings formed by the coatings; acrylic lacquer coatings and coatings formed by the coatings; fluorescence Materials for light sources that emit ultraviolet rays such as lamps and mercury lamps; Materials for precision machinery, electronic and electrical equipment, materials for blocking electromagnetic waves generated from various displays; Containers or packaging materials for foods, chemicals, chemicals, etc .; Bottles, boxes, blister , Cups, special packaging, compact disc coats, agricultural and industrial sheets or film materials; anti-fading agents for printed matter, dyes, dyes, etc .; for polymer supports (eg, for plastic parts such as machine and automotive parts) ) Protective film; Printed matter overcoat; Inkjet medium coating; Laminated matte; Optical light film; Safety glass / front glass intermediate layer; Electrochromic / Photochromic applications; Overlaminated film; Solar heat control film; Sunscreen cream, shampoo, rinse , Cosmetics such as hairdressers; Textile products and textiles for clothing such
  • the molded product obtained by molding the above composition is preferably a polymer molded product.
  • the shape of the molded product may be flat film-like, powder-like, spherical particle-like, crushed particle-like, massive continuous body, fibrous, tubular, hollow thread-like, granular, plate-like, or porous. good.
  • the resin used in the resin composition includes thermoplastic resins, thermosetting resins and the like conventionally used in the production of various known molded products, sheets, films and the like.
  • the thermoplastic resin include olefin resins such as polyethylene resins, polypropylene resins, and polycycloolefin resins, poly (meth) acrylic acid ester resins, polystyrene resins, styrene-acrylonitrile resins, and acrylonitrile-butadiene-styrene resins.
  • Resin polyvinyl chloride resin, vinylidene chloride resin, vinyl acetate resin, polyvinyl butyral resin, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol resin, polyethylene terephthalate resin, polybutylene terephthalate resin, Examples thereof include polyester resins such as liquid crystal polyester resins, polyacetal resins, polyamide resins, polycarbonate resins, polyurethane resins and polyphenylene sulfide resins. One or more of these resins may be used as a polymer blend or polymer alloy.
  • thermosetting resin examples include epoxy resin, melamine resin, unsaturated polyester resin, phenol resin, urea resin, alkyd resin, and thermosetting polyimide resin.
  • the resin is preferably a transparent resin.
  • the resin composition can be obtained by mixing compound (X) and a resin.
  • the compound (X) may be contained in an amount necessary for imparting desired performance, for example, 0.00001 to 99 parts by mass with respect to 100 parts by mass of the resin.
  • the composition of the present invention may contain other additives such as a solvent, a cross-linking catalyst, a tack fire, a plasticizer, a softener, a dye, a pigment, and an inorganic filler, if necessary.
  • the composition and the resin composition may be compositions for spectacle lenses.
  • a spectacle lens can be formed by molding or the like using a composition for a spectacle lens.
  • the molding method of the composition for an spectacle lens may be injection molding or cast polymerization molding.
  • the casting polymerization molding is a method in which a composition for a spectacle lens mainly composed of a monomer or an oligomer resin is injected into a lens mold, and the composition for a spectacle lens is cured by heat or light to be molded into a lens.
  • the composition for an spectacle lens may have a composition suitable for the molding method.
  • a resin composition for a spectacle lens containing a resin and a compound (X) may be used.
  • the spectacle lens is formed by casting polymerization molding, it may be a composition for spectacle lenses containing a curable monomer that is cured by heat or light and compound (X).
  • the resin contained in the composition for spectacle lenses examples include the above-mentioned resins, and a transparent resin is preferable.
  • the resin contained in the composition for spectacle lenses is a polymer blend or polymer alloy of one or more of poly (meth) acrylic acid ester resin, polycarbonate resin, polyamide resin, polyurethane resin, and polythiourethane resin. It is preferable to use as. Moreover, it may contain not only a polymer but also a monomer component.
  • the lens composition for spectacles may be a composition containing a curable monomer and compound (X).
  • the curable monomer may contain two or more kinds. Specifically, it may be a mixture of a polyol compound and an isocyanate compound, a mixture of a thiol compound and an isocyanate compound, preferably a mixture of a thiol compound and an isocyanate, and a mixture of a polyfunctional thiol compound and a polyfunctional isocyanate compound. More preferably.
  • the thiol compound is not particularly limited as long as it is a compound having at least one thiol group in the molecule. It may be chain-shaped or cyclic. In addition, the molecule may have a sulfide bond, a polysulfide bond, or another functional group. Specific examples of the thiol compound include one thiol group in one molecule described in JP-A-2004-315556, such as an aliphatic polythiol compound, an aromatic polythiol compound, a thiol group-containing cyclic compound, and a thiol group-containing sulfide compound. Examples thereof include thiol group-containing organic compounds having the above.
  • a polyfunctional thiol compound having two or more thiol groups is preferable, and an aliphatic polythiol compound having two or more thiol groups and two or more thiol groups are preferable in terms of improving the refractive index of the lens and the glass transition temperature.
  • the sulfide compound contained is more preferable, bis (mercaptomethyl) sulfide, 1,2-bis [(2-mercaptoethyl) thio] -3-mercaptopropane, pentaerythritol tetraxthiopropionate, 4,8-dimercaptomethyl. -1,11-Mercapto-3,6,9-Trithiaundecane is more preferred.
  • the thiol compound may be used alone or in combination of two or more.
  • the isocyanate compound is preferably a polyfunctional isocyanate compound having at least two isocyanato groups (-NCO) in the molecule, for example, an aliphatic isocyanate compound (for example, hexamethylene diisocyanate) or an alicyclic isocyanate compound (for example).
  • an aliphatic isocyanate compound for example, hexamethylene diisocyanate
  • an alicyclic isocyanate compound for example.
  • isophorone diisocyanate hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate
  • aromatic isocyanate compounds for example, tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, naphthalenedi isocyanate, triphenylmethane triisocyanate, etc.
  • an adduct (adduct) of the isocyanate compound made of a polyhydric alcohol compound for example, an adduct made of glycerol, trimethylolpropane, etc.
  • an isocyanurate for example, an isocyanurate, a bullet-type compound, a polyether polyol, a polyester polyol, an acrylic polyol, and a polybutadiene.
  • It may be a derivative such as a urethane prepolymer type isocyanate compound which has been subjected to an addition reaction with a polyol, a polyisoprene polyol, or the like.
  • a curing catalyst may be contained in order to improve the curability.
  • the curing catalyst include tin compounds such as dibutyltin chloride, amines, phosphins, quaternary ammonium salts, quaternary phosphonium salts, tertiary sulfonium salts, and secondary compounds described in JP-A-2004-315556.
  • Class iodonium salts mineral acids, Lewis acids, organic acids, silicic acids, boric acids tetrafluoride, peroxides, azo compounds, condensates of aldehydes and ammonia compounds, guanidines, thioureas, thiazoles, Examples thereof include sulfenamides, thiurams, dithiocarbamates, xanthogenates, acidic phosphoric acid esters and the like.
  • These curing catalysts may be used alone or in combination of two or more.
  • the content of the compound (X) in the composition for spectacle lenses can be, for example, 0.01 to 20 parts by mass with respect to 100 parts by mass of the resin.
  • the content of the compound (X) can be 0.00001 to 20 parts by mass with respect to 100 parts by mass of the curable component.
  • the content of the compound (X) is preferably 0.0001 to 15 parts by mass, more preferably 0.001 to 10 parts by mass, and further preferably 0 with respect to 100 parts by mass of the resin or the curable component. It is 0.01 to 5 parts by mass, and particularly preferably 0.1 to 3 parts by mass.
  • the amount of the curing catalyst added is preferably 0.0001 to 10.0% by mass, more preferably 0.001 to 5.0% by mass, based on 100% by mass of the spectacle lens composition.
  • the composition for spectacle lenses may contain other additives.
  • the composition of the present invention When the composition of the present invention is used for optical products such as an optical filter, it can be applied to, for example, an optical display device.
  • the layer formed from the resin composition may be any of a film layer, an adhesive layer, a coat layer and the like, and is an adhesive layer and a coat layer. Is preferable.
  • the pressure-sensitive adhesive layer is a pressure-sensitive adhesive composition containing a resin (A), a compound (X), a cross-linking agent (B) and a silane compound (C).
  • the pressure-sensitive adhesive composition (i) may be further referred to as a light-absorbing compound (F) other than the radical-curable component (D), the initiator (E), and the compound (X) (hereinafter, the light-selective absorbing compound (F)).
  • It may contain an antistatic agent or the like, and preferably contains at least one selected from the group consisting of a radical curable component (D), an initiator (E) and a light selective absorption compound (F). ..
  • the resin (A) is not particularly limited as long as it is a resin used in the pressure-sensitive adhesive composition.
  • the resin (A) preferably does not exhibit maximum absorption in the wavelength range of 300 nm to 780 nm.
  • the resin (A) is preferably a resin having a glass transition temperature (Tg) of 40 ° C. or lower.
  • the glass transition temperature (Tg) of the resin (A) is more preferably 20 ° C. or lower, further preferably 10 ° C. or lower, and particularly preferably 0 ° C. or lower.
  • the glass transition temperature of the resin (A) is usually ⁇ 80 ° C. or higher, preferably ⁇ 70 ° C. or higher, more preferably ⁇ 60 ° C.
  • the glass transition temperature of the resin (A) is 40 ° C. or lower, it is advantageous to improve the adhesion of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (i) to the adherend. Further, when the glass transition temperature of the resin (A) is ⁇ 80 ° C. or higher, it is advantageous to improve the durability of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (i).
  • the glass transition temperature can be measured by a differential scanning calorimeter (DSC).
  • Examples of the resin (A) include (meth) acrylic resin, silicone resin, rubber resin, urethane resin and the like, and (meth) acrylic resin is preferable.
  • the (meth) acrylic resin is preferably a polymer containing a constituent unit derived from the (meth) acrylic acid ester as a main component (preferably containing 50% by mass or more).
  • the structural unit derived from the (meth) acrylic acid ester is a simple structural unit derived from a monomer other than one or more (meth) acrylic acid esters (for example, having a polar functional group such as a hydroxyl group, a carboxyl group, or an amino group).
  • a structural unit derived from a monomer may be included.
  • the content of the resin (A) is usually 50% by mass to 99.9% by mass, preferably 60% by mass to 95% by mass, based on 100% by mass of the solid content of the pressure-sensitive adhesive composition (i). It is preferably 70% by mass to 90% by mass.
  • the content of the compound (X) is usually 0.01 to 20 parts by mass, preferably 0.1 to 20 parts by mass, and more preferably 0.2 to 0.2 parts by mass with respect to 100 parts by mass of the resin (A). It is 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass.
  • cross-linking agent (B) examples include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, aziridine-based cross-linking agents, metal chelate-based cross-linking agents, and the like, and in particular, the pot life of the pressure-sensitive adhesive composition (i) and the durability of the pressure-sensitive adhesive layer. From the viewpoint of properties, cross-linking rate and the like, an isocyanate-based cross-linking agent is preferable.
  • the content of the cross-linking agent (B) is usually 0.01 to 25 parts by mass, preferably 0.1 to 15 parts by mass, and more preferably 0.15 parts by mass with respect to 100 parts by mass of the resin (A). It is ⁇ 7 parts by mass, more preferably 0.2 to 5 parts by mass, and particularly preferably 0.25 to 2 parts by mass.
  • silane compound (C) examples include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and 3 -Glysidoxypropylmethyldimethoxysilane, 3-glycidoxypropylethoxydimethylsilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, Examples thereof include 3-methacryloyloxypropyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane.
  • the silane compound (C) may be a silicone oligomer.
  • the content of the silane compound (C) is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.15 with respect to 100 parts by mass of the resin (A). It is ⁇ 7 parts by mass, more preferably 0.2 to 5 parts by mass, and particularly preferably 0.25 to 2 parts by mass.
  • radical curable component (D) examples include radical curable components such as compounds or oligomers that are cured by a radical polymerization reaction.
  • examples of the radically polymerizable component (D) include (meth) acrylate-based compounds, styrene-based compounds, and vinyl-based compounds.
  • the pressure-sensitive adhesive composition (i) may contain two or more radical curable components (D).
  • Examples of the (meth) acrylate-based compound include a (meth) acrylate monomer having at least one (meth) acryloyloxy group in the molecule, a (meth) acrylamide monomer, and at least two (meth) acryloyl groups in the molecule.
  • (Meta) acryloyl group-containing compounds such as (meth) acrylic oligomers having the above can be mentioned.
  • the (meth) acrylic oligomer is preferably a (meth) acrylate oligomer having at least two (meth) acryloyloxy groups in the molecule.
  • As the (meth) acrylate compound only one kind may be used alone, or two or more kinds may be used in combination.
  • the (meth) acrylate monomer includes a monofunctional (meth) acrylate monomer having one (meth) acryloyloxy group in the molecule and a bifunctional (meth) acrylate having two (meth) acryloyloxy groups in the molecule.
  • Examples include monomers and polyfunctional (meth) acrylate monomers having three or more (meth) acryloyloxy groups in the molecule. It is preferably a (meth) acrylate compound, and more preferably a polyfunctional (meth) acrylate compound.
  • the polyfunctional (meth) acrylate compound is preferably trifunctional or higher.
  • the content of the radical curable component (D) is usually 0.5 to 100 parts by mass, preferably 1 to 70 parts by mass, and 3 to 50 parts by mass with respect to 100 parts by mass of the resin (A). It is more preferably 5 to 30 parts by mass, and particularly preferably 7.5 to 25 parts by mass.
  • the initiator (E) is either a compound that induces a polymerization reaction by absorbing heat energy (thermal polymerization initiator) or a compound that induces a polymerization reaction by absorbing light energy (photopolymerization initiator). May be good.
  • the light is preferably an active energy ray such as visible light, ultraviolet light, X-ray, or electron beam.
  • thermal polymerization initiator examples include compounds that generate radicals by heating (thermal radical generators), compounds that generate acids by heating (thermal acid generators), and compounds that generate bases by heating (thermal base generators). ) Etc. can be mentioned.
  • Photopolymerization initiators include compounds that generate radicals by absorbing light energy (photoradical generators), compounds that generate acids by absorbing light energy (photoacid generators), and light energy. Examples thereof include compounds that generate a base by absorbing the above (photobase generator).
  • the initiator (E) it is preferable to select one suitable for the polymerization reaction of the above-mentioned radical curable component (D), more preferably a radical polymerization initiator, and preferably a photoradical polymerization initiator. More preferred.
  • the radical polymerization initiator include an alkylphenone compound, a benzoin compound, a benzophenone compound, an oxime ester compound, a phosphine compound and the like.
  • the radical polymerization initiator is preferably a photoradical polymerization initiator, and more preferably an oxime ester-based photoradical polymerization initiator from the viewpoint of the reactivity of the polymerization reaction.
  • the reaction rate of the radical curing component (D) can be increased even under curing conditions where the illuminance or the amount of light is weak.
  • the content of the initiator (E) is usually 0.01 to 20 parts by mass, preferably 0.3 to 10 parts by mass, and 0.5 to 5 parts by mass with respect to 100 parts by mass of the resin (A). It is more preferably parts by mass, more preferably 0.75 to 4 parts by mass, and particularly preferably 1 to 3 parts by mass.
  • the light selective absorption compound (F) is a light-absorbing compound other than the compound (X), and is, for example, a compound (ultraviolet absorber) that absorbs light having a wavelength of 250 nm to 380 nm (preferably a wavelength of 250 nm or more and less than 360 nm). Alternatively, it is a compound (dye) that absorbs light having a wavelength of 380 nm to 780 nm, or a compound (infrared absorber) that absorbs light having a wavelength of 780 nm to 1500 nm.
  • a compound (ultraviolet absorber) that absorbs light having a wavelength of 250 nm to 380 nm (preferably a wavelength of 250 nm or more and less than 360 nm).
  • it is a compound (dye) that absorbs light having a wavelength of 380 nm to 780 nm, or a compound (infrared absorber) that absorbs light having a wavelength of 7
  • the structure of the ultraviolet absorber is not particularly limited as long as it is a compound that absorbs light having a wavelength of 250 nm to 380 nm, but a benzotriazole compound, a benzophenone compound, a triazine compound, a salicylic acid compound, a cyanoacrylate compound, Compounds such as benzoxazine compounds are preferable.
  • the content of the light selective absorption compound (F) is usually 0.1 to 50 parts by mass, preferably 0.2 to 40 parts by mass, and more preferably 0 with respect to 100 parts by mass of the resin (A). It is .5 to 30 parts by mass, more preferably 1 to 25 parts by mass, and particularly preferably 2 to 20 parts by mass.
  • the molded product formed from the composition containing the compound (X) preferably has a transmittance of 50% or less, more preferably 30% or less at a wavelength of 440 nm.
  • Example 1 Synthesis of compound represented by formula (1) The inside of a 100 mL-four-necked flask equipped with a Dimroth condenser and a thermometer is set to a nitrogen atmosphere, and 2 parts of 2-methyl-1,3-cyclohexanedione, 1.3 parts of dimethyl sulfate, and 10 parts of acetonitrile are added and heated for 3 hours. The mixture was refluxed and stirred. 0.75 parts of malononitrile, 1.2 parts of potassium carbonate and 10 parts of isopropanol were mixed with the obtained mixture, and the mixture was heated under reflux for 3 hours and stirred. After distilling off the solvent from the obtained mixture, the mixture was purified to obtain 0.1 part of the compound represented by the formula (1).
  • ⁇ Maximum absorption wavelength and gram absorption coefficient ⁇ measurement> A 2-butanone solution (0.006 g / L) of the obtained compound represented by the formula (1) was placed in a 1 cm quartz cell, and the quartz cell was set in a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation). Then, the absorbance in the wavelength range of 300 to 800 nm was measured every 1 nm step by the double beam method. The gram extinction coefficient for each wavelength was calculated from the obtained absorbance value, the concentration of the compound represented by the formula (1) in the solution, and the optical path length of the quartz cell.
  • ⁇ ( ⁇ ) A ( ⁇ ) / CL
  • ⁇ ( ⁇ ) represents the gram extinction coefficient (L / (g ⁇ cm)) of the compound represented by the formula (1) at the wavelength ⁇ nm
  • a ( ⁇ ) represents the absorbance at the wavelength ⁇ nm
  • C represents the concentration (g / L)
  • L represents the optical path length (cm) of the quartz cell.
  • the maximum absorption wavelength of the obtained compound represented by the formula (1) was 457 nm.
  • the obtained compound represented by the formula (1) has ⁇ ( ⁇ max) of 150.6 L / (g ⁇ cm), ⁇ ( ⁇ max + 30 nm) of 3.8 L / (g ⁇ cm), and ⁇ ( ⁇ max) / ⁇ ( ⁇ max + 30 nm) was 39.6.
  • Example 2 Synthesis of compound represented by formula (2) A nitrogen atmosphere is created in a 300 mL-four-necked flask equipped with a Dimroth condenser and a thermometer, and 70 parts of dimedone, 10.4 parts of malononitrile, 40.6 parts of diisopropylethylamine, and 100 parts of ethanol are charged, and the mixture is heated under reflux for 3 hours and stirred. I let you. The solvent was distilled off from the obtained mixture and the mixture was purified to obtain 15.1 part of the compound represented by the formula (M-5).
  • the maximum absorption wavelength and the gram absorption coefficient were measured in the same manner as above.
  • the maximum absorption wavelength of the obtained compound represented by the formula (2) was 432 nm.
  • the obtained compound represented by the formula (2) has ⁇ ( ⁇ max) of 237 L / (g ⁇ cm), ⁇ ( ⁇ max + 30 nm) of 4.4 L / (g ⁇ cm), and ⁇ ( ⁇ max) / ⁇ ( ⁇ max + 30 nm).
  • ⁇ ( ⁇ max) 237 L / (g ⁇ cm)
  • ⁇ ( ⁇ max) / ⁇ ( ⁇ max + 30 nm) was 53.9.
  • Example 3 Preparation of resin composition (1) (adhesive composition (1))
  • Polymerization example 1 Preparation of acrylic resin (A) A reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer and a stirrer. A mixed solution of 81.8 parts of ethyl acetate, 96 parts of butyl acrylate, 3 parts of 2-hydroxyethylmethyl acrylate, and 1 part of acrylic acid was charged as a solvent, and the air in the reaction vessel was replaced with nitrogen gas. The internal temperature was raised to 55 ° C. while containing no oxygen.
  • acrylic resin (A) was referred to as acrylic resin (A).
  • a cross-linking agent (manufactured by Toso Co., Ltd .: trade name "Coronate L", isocyanate compound, solid content 75%) is 0 with respect to 100 parts of the solid content of the ethyl acetate solution (resin concentration: 20%) of the acrylic resin (A). .3 parts, 0.28 parts of silane compound (manufactured by Shin-Etsu Chemical Industry Co., Ltd .: trade name "KBM3066"), 1.5 parts of the compound represented by the formula (2) are mixed, and the solid content concentration is 14%. Ethyl acetate was added so as to obtain a resin composition (1) (adhesive composition).
  • the blending amount of the above-mentioned cross-linking agent is the number of parts by mass as the active ingredient.
  • Examples 4 to 7 and Comparative Example 1 Preparation of Resin Compositions (2) to (6) As shown in Table 10, each component and the content of each component were changed in the same manner as in Example 3.
  • the pressure-sensitive adhesive composition (2) to the pressure-sensitive adhesive composition (6) were prepared.
  • the amount of the cross-linking agent blended is the number of parts by mass as the active ingredient, and the resin (A) is the number of parts by mass of the solid content.
  • Acrylic resin (A) Acrylic resin (A) synthesized in Polymerization Example 1
  • the obtained resin molded body (1) was attached to a cycloolefin film containing an ultraviolet absorber having a thickness of 23 ⁇ m [trade name “ZEONOR” obtained from Nippon Zeon Corporation] by a laminator, and then the temperature was 23 ° C. and the relative humidity was 65.
  • the mixture was cured under the condition of% for 7 days to obtain a laminate (1) of a cycloolefin film / resin molded product (1) / separate film.
  • a resin molded body (2), a laminated body (2), and a resin molded body with a double-sided separate film (2) were prepared using the resin composition (2) instead of the resin composition (1), and evaluated in the same manner. went. The results are shown in Table 11.
  • a resin molded body (3), a laminated body (3), and a resin molded body with a double-sided separate film (3) were prepared using the resin composition (3) instead of the resin composition (1), and evaluated in the same manner. went. The results are shown in Table 11.
  • a resin molded body (6), a laminated body (6), and a resin molded body with a double-sided separate film (6) were prepared using the resin composition (6) instead of the resin composition (1), and evaluated in the same manner. went. The results are shown in Table 11.
  • UV-A (wavelength 320 to 390 nm) was adjusted to an illuminance of 500 mW and an integrated light amount of 500 mJ using an ultraviolet irradiation device (“Fusion UV Systems Co., Ltd.“ Electrodeless UV lamp system H valve ”).
  • a resin molded body (adhesive layer) (4) was produced by irradiating with ultraviolet rays.
  • the obtained resin molded product (4) was bonded to non-alkali glass, the separate film was peeled off, and then the resin molded product (4) was coated with a 23 ⁇ m ultraviolet absorber-containing cycloolefin film [a product obtained from Nippon Zeon Co., Ltd.].
  • the name "ZEONOR”] was laminated to prepare a laminated body (4) having a cycloolefin film / resin molded body (4) / glass structure.
  • the prepared laminate (4) was set in a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation), and the absorbance was measured in the wavelength range of 300 to 800 nm in 1 nm steps by the double beam method.
  • the measured absorbance at a wavelength of 440 nm was defined as the absorbance of the resin molded product (4) at a wavelength of 440 nm.
  • the absorbance at a wavelength of 330 nm and a wavelength of 440 nm of the non-alkali glass simple substance and the cycloolefin film simple substance are 0, respectively.
  • a resin molded body (5), a laminated body (5), and a resin molded body with a double-sided separate film (5) were prepared using the resin composition (5) instead of the resin composition (4), and evaluated in the same manner. went. The results are shown in Table 11.
  • Example 8 Preparation of resin composition for spectacle lens and molded product thereof 40 parts of xylylene diisocyanate, 60 parts of trimethylolpropane tris (thioglycolate), compound represented by the formula (2) synthesized in Example 2. 0.01 part, 0.2 part of a release agent (trade name: ZELEC-UN, obtained from Sigma-Aldrich), and 0.03 part of dibutyldichlorotin as a curing catalyst were mixed and stirred. The obtained mixture was allowed to stand in a vacuum dryer for 1 hour and degassed. The resulting mixture was poured into a glass mold and heated at a temperature of 120 ° C. for 1 hour. Only the molded body was peeled off from the glass mold to prepare a resin plate having a thickness of 2 mm, 3 cm ⁇ 3 cm as the molded body.
  • acrylic resin (A1) had a polystyrene-equivalent weight average molecular weight Mw of 1.25 million and Mw / Mn of 4.5 by GPC. This is referred to as acrylic resin (A1).
  • the pressure-sensitive adhesive composition (7) to the pressure-sensitive adhesive composition (9) were prepared in the same manner as in Example 3 except that each component and the content of each component were changed as shown in Table 14.
  • the amount of the cross-linking agent blended is the number of parts by mass as the active ingredient, and the resin (A) is the number of parts by mass of the solid content.
  • Acrylic resin (A1) Acrylic resin (A1) synthesized in Polymerization Example 2 Formula (2): Compound represented by the formula (2) synthesized in Example 2 Coronate L: manufactured by Toso Co., Ltd., trade name: coronate L, isocyanate-based cross-linking agent KBM3066: manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM3066, silane coupling agent KBM403: manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM403, silane coupling agent M-130G: manufactured by Shin-Nakamura Chemical Industry Co., Ltd., trade name: M-130G, monofunctional methoxypolyethylene glycol methacrylate ion Sex compound: An ionic compound represented by the following formula
  • the obtained resin molded body (7) was attached to a cycloolefin film containing an ultraviolet absorber having a thickness of 23 ⁇ m [trade name “ZEONOR” obtained from Nippon Zeon Corporation] by a laminator, and then the temperature was 23 ° C. and the relative humidity was 65.
  • the mixture was cured under the condition of% for 7 days to obtain a laminate (7) of a cycloolefin film / resin molded product (7) / separate film.
  • a resin molded body (8), a laminated body (8), and a resin molded body with a double-sided separate film (7) were prepared using the resin composition (8) instead of the resin composition (7), and evaluated in the same manner. went. The results are shown in Table 15.
  • a resin molded body (9), a laminated body (9), and a resin molded body with a double-sided separate film (9) were prepared using the resin composition (9) instead of the resin composition (7), and evaluated in the same manner. went. The results are shown in Table 15.
  • the compound of the present invention has high absorption selectivity for short wavelength visible light having a wavelength of 440 nm.
  • the resin composition containing the compound of the present invention has a high absorbance retention rate even after the weather resistance test, and has good weather resistance.

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Abstract

[Problem] To provide a novel compound that has good weather resistance and that sufficiently absorbs light having a wavelength of around 440 nm. [Solution] A compound including an anion having a partial structure represented by formula (X). [In formula (X), ring W1 represents a ring structure having at least one substituent. Ring W1 preferably is a ring having 5-7 carbon atoms.].

Description

化合物Compound
　本発明は、化合物に関する。 The present invention relates to a compound.
　近年、スマートフォン等のモバイルデバイスの普及により、近距離でディスプレイを目視する時間が増加し続けている。近距離でディスプレイを目視する時間の増加に伴い、波長４００ｎｍ～５００ｎｍ領域の光（いわゆるブルーライト）による健康への影響も強く注目されている。
　ブルーライトによる健康への影響の軽減方法の一つとして、ディスプレイ表面やメガネ、コンタクトレンズ等にブルーライトカット機能を付与する方法が挙げられる。ディスプレイ表面、メガネ、コンタクトレンズ等に波長４００～５００ｎｍの光を吸収する吸収体を混合したり、波長４００～５００ｎｍの光を吸収する吸収体を含む層を積層したりすることで、ブルーライトカット機能を付与することができる。 In recent years, with the spread of mobile devices such as smartphones, the time for visually observing a display at a short distance continues to increase. As the time for visually observing a display at a short distance increases, the effect of light in the wavelength range of 400 nm to 500 nm (so-called blue light) on health is also receiving a lot of attention.
As one of the methods for reducing the effect of blue light on health, there is a method of imparting a blue light cut function to the display surface, glasses, contact lenses and the like. Blue light cut by mixing an absorber that absorbs light with a wavelength of 400 to 500 nm on the display surface, glasses, contact lenses, etc., or by laminating a layer containing an absorber that absorbs light with a wavelength of 400 to 500 nm. Functions can be added.
　例えば、引用文献１には、ブルーライトの中でも波長４４０ｎｍ付近の光を効率的に吸収する化合物としてキノリン系化合物であるＣ．Ｉ．ソルベントイエロー３３の使用が記載されている。 For example, in Cited Document 1, C.I. I. The use of Solvent Yellow 33 is described.
特開２０１５－１７１５２号公報Japanese Unexamined Patent Publication No. 2015-17152
　しかしながら、Ｃ．Ｉ．ソルベントイエロー３３のようなキノリン系化合物は耐候性が十分ではない場合があった。 However, C.I. I. Quinoline compounds such as Solvent Yellow 33 may not have sufficient weather resistance.
　本発明は以下の発明を含む。
［１］式（Ｘ）で表される部分構造を有するアニオンを含む化合物。
Figure JPOXMLDOC01-appb-I000004
［式（Ｘ）中、環Ｗ１は、少なくとも一つの置換基を有する環構造を表す。］
［２］式（Ｘ）で表される部分構造を有するアニオンが、式（Ｉ）で表されるアニオン～式（ＶＩＩＩ）で表されるアニオンのいずれかである［１］に記載の化合物。
Figure JPOXMLDOC01-appb-I000005

Figure JPOXMLDOC01-appb-I000006
［式中、環Ｗ１は、上記と同じ意味を表す。
　環Ｗ２、環Ｗ３、環Ｗ４、環Ｗ５、環Ｗ６、環Ｗ７、環Ｗ８、環Ｗ９、環Ｗ１０、環Ｗ１１、環Ｗ１２、環Ｗ１３及び環Ｗ１４は、それぞれ独立して、環構造を表し、該環構造は置換基を有していてもよい。
　Ｒ１、Ｒ２、Ｒ４、Ｒ５、Ｒ１２、Ｒ１４、Ｒ１５、Ｒ２２、Ｒ２４、Ｒ２５、Ｒ３２、Ｒ３４、Ｒ３５、Ｒ４２、Ｒ４４、Ｒ４５、Ｒ５２、Ｒ５４、Ｒ５５、Ｒ６２、Ｒ６４、Ｒ６５、Ｒ７１、Ｒ７２、Ｒ７４、Ｒ７５、Ｒ８１、Ｒ８２、Ｒ８４、Ｒ８５、Ｒ９１、Ｒ９２、Ｒ９４、Ｒ９５、Ｒ１０１、Ｒ１０２、Ｒ１０４、Ｒ１０５、Ｒ１１１、Ｒ１１２、Ｒ１１４、Ｒ１１５、Ｒ１２１、Ｒ１２２、Ｒ１２４、Ｒ１２５、Ｒ１３１、Ｒ１３２、Ｒ１３４及びＲ１３５は、それぞれ独立して、電子求引性基を表す。
　Ｒ３は、１価の置換基を表す。
　Ｒ１３、Ｒ２３、Ｒ３３、Ｒ４３、Ｒ５３、Ｒ６３及びＲ１３３は、１価の置換基を表す。
　Ｒ１とＲ２とは互いに連結して環を形成してもよい。
　Ｒ２とＲ３とは互いに連結して環を形成してもよい。
　Ｒ３とＲ４とは互いに連結して環を形成してもよい。
　Ｒ４とＲ５とは互いに連結して環を形成してもよい。
　Ｒ１２とＲ１３とは互いに連結して環を形成してもよい。
　Ｒ１３とＲ１４とは互いに連結して環を形成してもよい。
　Ｒ１４とＲ１５とは互いに連結して環を形成してもよい。
　Ｒ２２とＲ２３とは互いに連結して環を形成してもよい。
　Ｒ２３とＲ２４とは互いに連結して環を形成してもよい。
　Ｒ２４とＲ２５とは互いに連結して環を形成してもよい。
　Ｒ３２とＲ３３とは互いに連結して環を形成してもよい。
　Ｒ３３とＲ３４とは互いに連結して環を形成してもよい。
　Ｒ３４とＲ３５とは互いに連結して環を形成してもよい。
　Ｒ４２とＲ４３とは互いに連結して環を形成してもよい。
　Ｒ４３とＲ４４とは互いに連結して環を形成してもよい。
　Ｒ４４とＲ４５とは互いに連結して環を形成してもよい。
　Ｒ５２とＲ５３とは互いに連結して環を形成してもよい。
　Ｒ５３とＲ５４とは互いに連結して環を形成してもよい。
　Ｒ５４とＲ５５とは互いに連結して環を形成してもよい。
　Ｒ６２とＲ６３とは互いに連結して環を形成してもよい。
　Ｒ６３とＲ６４とは互いに連結して環を形成してもよい。
　Ｒ６４とＲ６５とは互いに連結して環を形成してもよい。
　Ｒ７１とＲ７２とは互いに連結して環を形成してもよい。
　Ｒ７４とＲ７５とは互いに連結して環を形成してもよい。
　Ｒ８１とＲ８２とは互いに連結して環を形成してもよい。
　Ｒ８４とＲ８５とは互いに連結して環を形成してもよい。
　Ｒ９１とＲ９２とは互いに連結して環を形成してもよい。
　Ｒ９４とＲ９５とは互いに連結して環を形成してもよい。
　Ｒ１０１とＲ１０２とは互いに連結して環を形成してもよい。
　Ｒ１０４とＲ１０５とは互いに連結して環を形成してもよい。
　Ｒ１１１とＲ１１２とは互いに連結して環を形成してもよい。
　Ｒ１１４とＲ１１５とは互いに連結して環を形成してもよい。
　Ｒ１２１とＲ１２２とは互いに連結して環を形成してもよい。
　Ｒ１２４とＲ１２５とは互いに連結して環を形成してもよい。
　Ｒ１３１とＲ１３２とは互いに連結して環を形成してもよい。
　Ｒ１３２とＲ１３３とは互いに連結して環を形成してもよい。
　Ｒ１３３とＲ１３４とは互いに連結して環を形成してもよい。
　Ｒ１３４とＲ１３５とは互いに連結して環を形成してもよい。
　Ｒｘ１、Ｒｘ４及びＲｘ７は、それぞれ独立して、単結合又は２価の連結基を表す。
　Ｒｘ２は及びＲｘ５は、それぞれ独立して、３価の連結基を表す。
　Ｒｘ３及びＲｘ６は、それぞれ独立して、４価の連結基を表す。］
［３］Ｒ３が電子求引性基である［２］に記載の化合物。
［４］Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、又は－ＳＯ３Ｈである［２］又は［３］に記載の化合物。
［５］Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基、ニトロ基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＯＣＦ３又は－ＳＣＦ３である［２］～［４］のいずれかに記載の化合物。
［６］Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基又はニトロ基である［２］～［５］のいずれかに記載の化合物。
［７］波長４００ｎｍ～波長５５０ｎｍの間に極大吸収を示す［１］～［６］のいずれかに記載の化合物。
［８］極大吸収波長におけるグラム吸光係数が０．５以上である［１］～［７］のいずれかに記載の化合物。
［９］下記式（ａ）を満たす［１］～［８］のいずれかに記載の化合物。
　　ε（λｍａｘ）／ε（λｍａｘ＋３０ｎｍ）≧１０　　　　（ａ）
［式中、ε（λｍａｘ）は、極大吸収波長（λｍａｘ）におけるグラム吸光係数を表す。
　ε（λｍａｘ＋３０ｎｍ）は、極大吸収波長（λｍａｘ）＋３０ｎｍの波長におけるグラム吸光係数を表す。
　なお、グラム吸光係数の単位は、Ｌ／（ｇ・ｃｍ）である。］
［１０］［１］～［９］のいずれかに記載の化合物を含む組成物。
［１１］［１０］に記載の樹脂組成物を成形してなる成形物。
［１２］波長４４０ｎｍにおける透過率が５０％以下である［１１］に記載の成形物。 The present invention includes the following inventions.
[1] A compound containing an anion having a partial structure represented by the formula (X).
Figure JPOXMLDOC01-appb-I000004
[In formula (X), ring W 1 represents a ring structure having at least one substituent. ]
[2] The compound according to [1], wherein the anion having a partial structure represented by the formula (X) is any of an anion represented by the formula (I) to an anion represented by the formula (VIII).
Figure JPOXMLDOC01-appb-I000005

Figure JPOXMLDOC01-appb-I000006
[In the equation, ring W 1 has the same meaning as above.
Ring W 2 , Ring W 3 , Ring W 4 , Ring W 5 , Ring W 6 , Ring W 7 , Ring W 8 , Ring W 9 , Ring W 10 , Ring W 11 , Ring W 12 , Ring W 13, and Ring W Each of 14 independently represents a ring structure, and the ring structure may have a substituent.
R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 , R 125 , R 131 , R 132 , R 134 and R 135 , Each independently represents an electron-attracting group.
R 3 represents a monovalent substituent.
R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represent monovalent substituents.
R 1 and R 2 may be connected to each other to form a ring.
R 2 and R 3 may be connected to each other to form a ring.
R 3 and R 4 may be connected to each other to form a ring.
R 4 and R 5 may be connected to each other to form a ring.
R 12 and R 13 may be connected to each other to form a ring.
R 13 and R 14 may be connected to each other to form a ring.
R 14 and R 15 may be connected to each other to form a ring.
R 22 and R 23 may be connected to each other to form a ring.
R 23 and R 24 may be connected to each other to form a ring.
R 24 and R 25 may be connected to each other to form a ring.
R 32 and R 33 may be connected to each other to form a ring.
R 33 and R 34 may be connected to each other to form a ring.
R 34 and R 35 may be connected to each other to form a ring.
R 42 and R 43 may be connected to each other to form a ring.
R 43 and R 44 may be connected to each other to form a ring.
R 44 and R 45 may be connected to each other to form a ring.
R 52 and R 53 may be connected to each other to form a ring.
R 53 and R 54 may be connected to each other to form a ring.
R 54 and R 55 may be connected to each other to form a ring.
R 62 and R 63 may be connected to each other to form a ring.
R 63 and R 64 may be connected to each other to form a ring.
R 64 and R 65 may be connected to each other to form a ring.
R 71 and R 72 may be connected to each other to form a ring.
R 74 and R 75 may be connected to each other to form a ring.
R 81 and R 82 may be connected to each other to form a ring.
R 84 and R 85 may be connected to each other to form a ring.
R 91 and R 92 may be connected to each other to form a ring.
R 94 and R 95 may be connected to each other to form a ring.
R 101 and R 102 may be connected to each other to form a ring.
R 104 and R 105 may be connected to each other to form a ring.
R 111 and R 112 may be connected to each other to form a ring.
R 114 and R 115 may be connected to each other to form a ring.
R 121 and R 122 may be connected to each other to form a ring.
R 124 and R 125 may be connected to each other to form a ring.
R 131 and R 132 may be connected to each other to form a ring.
R 132 and R 133 may be connected to each other to form a ring.
R 133 and R 134 may be connected to each other to form a ring.
R 134 and R 135 may be connected to each other to form a ring.
R x1 , R x4 and R x7 each independently represent a single bond or a divalent linking group.
R x2 and R x5 each independently represent a trivalent linking group.
R x3 and R x6 each independently represent a tetravalent linking group. ]
[3] The compound according to [2], wherein R 3 is an electron-attracting group.
[4] At least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, an alkyl halide group, an aryl halide group, -CO-R 1 , -CO-O. -R 2 , -CO-NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are hydrocarbons that may have independent substituents, respectively. represents a group or a halogen atom), -. OCF 3, -SCF 3, -SF 5, -SF 3, or a compound according to -SO are 3 H [2] or [3].
[5] At least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, -CO-R 1 , -CO-O-R 2 , -SO 2- R 9 (R 1 , R 2 and R 9 represent hydrocarbon groups or halogen atoms that may independently have substituents, respectively.), -SF 5 , -SF 3 , -SO 3 H, -SO 2 The compound according to any one of [2] to [4], which is H, -OCF 3 or -SCF 3.
[6] The compound according to any one of [2] to [5], wherein at least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group or a nitro group.
[7] The compound according to any one of [1] to [6], which exhibits maximum absorption between a wavelength of 400 nm and a wavelength of 550 nm.
[8] The compound according to any one of [1] to [7], which has a gram absorption coefficient of 0.5 or more at the maximum absorption wavelength.
[9] The compound according to any one of [1] to [8] that satisfies the following formula (a).
ε (λ max ) / ε (λ max + 30 nm) ≧ 10 (a)
Wherein, epsilon (.lambda.max) represents the gram extinction coefficient at the maximum absorption wavelength (lambda max).
ε (λ max + 30 nm) represents the gram absorption coefficient at the maximum absorption wavelength (λ max) + 30 nm.
The unit of the gram extinction coefficient is L / (g · cm). ]
[10] A composition containing the compound according to any one of [1] to [9].
[11] A molded product obtained by molding the resin composition according to [10].
[12] The molded product according to [11], which has a transmittance of 50% or less at a wavelength of 440 nm.
　本発明は、波長４４０ｎｍ付近の光を十分に吸収し、かつ、耐候性の高い新規化合物を提供する。 The present invention provides a novel compound that sufficiently absorbs light having a wavelength of around 440 nm and has high weather resistance.
　本発明の化合物は、式（Ｘ）で表される部分構造を有するアニオンを含む化合物（以下、化合物（Ｘ）という場合がある。）である。
Figure JPOXMLDOC01-appb-I000007
［式（Ｘ）中、環Ｗ１は少なくとも一つの置換基を有する環を表す。］ The compound of the present invention is a compound containing an anion having a partial structure represented by the formula (X) (hereinafter, may be referred to as compound (X)).
Figure JPOXMLDOC01-appb-I000007
[In formula (X), ring W 1 represents a ring having at least one substituent. ]
　環Ｗ１の環構造は特に限定されない。環Ｗ１は単環であってもよいし、縮合環であってもよい。
　環Ｗ１は、環の構成要件としてヘテロ原子（例えば、酸素原子、硫黄原子、窒素原子等）を含む複素環であってもよいし、炭素原子と水素原子とからなる脂肪族炭化水素環であってもよい。 Ring ring W 1 is not particularly limited. Ring W 1 may be a single ring or a condensed ring.
Ring W 1 may be a hetero ring containing a hetero atom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a constituent requirement of the ring, or an aliphatic hydrocarbon ring composed of a carbon atom and a hydrogen atom. There may be.
　環Ｗ１は、通常、炭素数５～１８の環であり、５～７員環構造であることが好ましく、６員環構造であることがより好ましい。環Ｗ１は、炭素数が５～７の環構造であることが好ましく、炭素数が６の環構造であることがより好ましい。
　環Ｗ１は、単環であることが好ましい。
　環Ｗ１は、脂肪族炭化水素の環（脂環式炭化水素基）であることが好ましい。 Ring W 1 is usually a ring having 5 to 18 carbon atoms, preferably having a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure. The ring W 1 preferably has a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms.
Ring W 1 is preferably a single ring.
Ring W 1 is preferably a ring of an aliphatic hydrocarbon (alicyclic hydrocarbon group).
　環Ｗ１は、例えば、以下の環構造が挙げられる。

Figure JPOXMLDOC01-appb-I000008
The ring W 1 has, for example, the following ring structure.

Figure JPOXMLDOC01-appb-I000008
　環Ｗ１は少なくとも一つの置換基を有し、該置換基は環Ｗ１に結合する２つの二重結合の間に存在する。つまり、本発明の化合物は、式（Ｘ－１）で表される部分構造を有するアニオンを含む化合物であることが好ましい。
Figure JPOXMLDOC01-appb-I000009
［式（Ｘ－１）中、環Ｗ１は上記と同じ意味を表し、Ｒ３は１価の置換基を表す。］ Ring W 1 has at least one substituent, which is present between two double bonds attached to ring W 1. That is, the compound of the present invention is preferably a compound containing an anion having a partial structure represented by the formula (X-1).
Figure JPOXMLDOC01-appb-I000009
[In formula (X-1), ring W 1 represents the same meaning as above, and R 3 represents a monovalent substituent. ]
　Ｒ３は１価の置換基であれば特に限定されないが、例えば、１価の脂肪族炭化水素基、１価の芳香族炭化水素基、電子求引性基、電子供与性基、ヘテロ環基等が挙げられる。 R 3 is not particularly limited as long as it is a monovalent substituent, but for example, a monovalent aliphatic hydrocarbon group, a monovalent aromatic hydrocarbon group, an electron attracting group, an electron donating group, and a heterocyclic group. And so on.
　Ｒ３で表される１価の脂肪族炭化水素基としては、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、ｔｅｒｔ－ブチル基、ｓｅｃ－ブチル基、ｎ－ペンチル基、イソペンチル基、ｎ－ヘキシル基、イソヘキシル基、ｎ－オクチル基、イソオクチル基、ｎ－ノニル基、イソノニル基、ｎ－デシル基、イソデシル基、ｎ－ドデシル基、イソドデシル基、ウンデシル基、ラウリル基、ミリスチル基、セチル基、ステアリル基、２－エチルヘキシル基、４－ブチルオクチル基等の炭素数１～２５の直鎖又は分岐鎖のアルキル基：シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基等の炭素数３～２５のシクロアルキル基；シクロヘキシルメチル基等の炭素数４～２５のシクロアルキルアルキル基：イソボロニル基等の炭素数４～２５のアルキルシクロアルキル基が挙げられる。好ましくは炭素数１～１２の直鎖又は分岐鎖のアルキル基である。 The monovalent aliphatic hydrocarbon group represented by R 3 includes a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, a sec-butyl group and an n-pentyl group. , Isopentyl group, n-hexyl group, isohexyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, n-decyl group, isodecyl group, n-dodecyl group, isododecyl group, undecyl group, lauryl group, Linear or branched alkyl groups having 1 to 25 carbon atoms such as myristyl group, cetyl group, stearyl group, 2-ethylhexyl group, 4-butyloctyl group: cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group and the like. Cycloalkyl group having 3 to 25 carbon atoms; Cycloalkylalkyl group having 4 to 25 carbon atoms such as cyclohexylmethyl group: Alkylcycloalkyl group having 4 to 25 carbon atoms such as isobolonyl group can be mentioned. It is preferably a linear or branched alkyl group having 1 to 12 carbon atoms.
　Ｒ３で表される１価の芳香族炭化水素基としては、フェニル基、ナフチル基、アントラセニル基、テトラセニル基、ペンタセニル基、フェナントリル基、クリセニル基、トリフェニレニル基、テトラフェニル基、ピレニル基、ペリレニル基、コロネニル基、ビフェニル基等の炭素数６～１８のアリール基；ベンジル基、フェニルエチル基、ナフチルメチル基等の炭素数７～１８のアラルキル基；フェノキシエチル基、フェノキシジエチレングリコール基、フェノキシポリアルキレングリコール基のアリールアルコキシ基等が挙げられ、炭素数６～１８のアリール基であることが好ましく、フェニル基又はベンジル基であることがより好ましい。 The monovalent aromatic hydrocarbon group represented by R 3 includes a phenyl group, a naphthyl group, an anthrasenyl group, a tetrasenyl group, a pentasenyl group, a phenanthryl group, a chrysenyl group, a triphenylenyl group, a tetraphenyl group, a pyrenyl group and a perylenyl group. , Aryl groups having 6 to 18 carbon atoms such as coronenyl group and biphenyl group; aralkyl groups having 7 to 18 carbon atoms such as benzyl group, phenylethyl group and naphthylmethyl group; phenoxyethyl group, phenoxydiethylene glycol group and phenoxypolyalkylene glycol Examples thereof include an arylalkoxy group as a group, and an aryl group having 6 to 18 carbon atoms is preferable, and a phenyl group or a benzyl group is more preferable.
　Ｒ３で表される電子供与性基としては、水酸基；メトキシ基、エトキシ基、プロポキシ基、ブトキシ基、ペンチルオキシ基、ヘキシルオキシ基、ヘプチルオキシ基、オクチルオキシ基等の炭素数１～１２のアルコキシ基；アミノ基、モノメチルアミノ基、モノエチルアミノ基、ジメチルアミノ基、ジエチルアミノ基、メチルエチルアミノ基等の１つ又は２つの炭素数１～６のアルキル基で置換されていてもよいアミノ基等が挙げられる。 Examples of the electron donating group represented by R 3 include a hydroxyl group; a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, a hexyloxy group, a heptyloxy group, an octyloxy group, and the like having 1 to 12 carbon atoms. Alkoxy group; an amino group optionally substituted with one or two alkyl groups having 1 to 6 carbon atoms such as an amino group, a monomethylamino group, a monoethylamino group, a dimethylamino group, a diethylamino group and a methylethylamino group. And so on.
　Ｒ３で表されるヘテロ環基としては、ピロリジン環基、ピロリン環基、イミダゾリジン環基、イミダゾリン環基、オキサゾリン環基、チアゾリン環基、ピペリジン環基、モルホリン環基、ピペラジン環基、インドール環基、イソインドール環基、キノリン環基、チオフェン環基、ピロール環基、チアゾリン環基及びフラン環基等の炭素数４～２０の脂肪族複素環基又は炭素数３～２０の芳香族複素環基等が挙げられる。 Examples of the heterocyclic group represented by R 3 include a pyrrolidine ring group, a pyrrolidine ring group, an imidazolidine ring group, an imidazoline ring group, an oxazoline ring group, a thiazoline ring group, a piperazine ring group, a morpholine ring group, a piperazine ring group, and an indole. An aliphatic heterocyclic group having 4 to 20 carbon atoms or an aromatic heterocyclic group having 3 to 20 carbon atoms such as a ring group, an isoindole ring group, a quinoline ring group, a thiophene ring group, a pyrrol ring group, a thiazolin ring group and a furan ring group. Ring groups and the like can be mentioned.
　Ｒ３で表される電子求引性基としては、例えば、ハロゲン原子、ニトロ基、シアノ基、カルボキシ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、式（ｚ－１）で表される基が挙げられる。
Figure JPOXMLDOC01-appb-I000010
［式（ｚ－１）中、Ｒ２２２は、水素原子、ハロゲン原子、置換基を有していてもよい炭化水素基を表す。
　Ｘ１は、－ＣＯ－、－ＣＯＯ－、－ＯＣＯ－、－ＣＳ－、－ＣＳＳ－、－ＣＯＳ－、－ＣＳＯ－、－ＳＯ－、－ＳＯ２－、－ＮＲ２２３ＣＯ－又は－ＣＯＮＲ２２４－を表す。
　Ｒ２２３及びＲ２２４は、それぞれ独立して、水素原子、炭素数１～６のアルキル基又はフェニル基を表す。
　＊は結合手を表す。］ Examples of the electron-attracting group represented by R 3 include a halogen atom, a nitro group, a cyano group, a carboxy group, an alkyl halide group, an aryl halide group, -OCF 3 , -SCF 3 , -SF 5 , and so on. Examples thereof include -SF 3 , -SO 3 H, -SO 2 H, and groups represented by the formula (z-1).
Figure JPOXMLDOC01-appb-I000010
[In formula (z-1), R222 represents a hydrogen atom, a halogen atom, or a hydrocarbon group which may have a substituent.
X 1 is -CO-, -COO-, -OCO-, -CS-, -CSS-, -COS-, -CSO-, -SO-, -SO 2- , -NR 223 CO- or -CONR 224. -Represents.
R223 and R224 independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.
* Represents a bond. ]
　ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が挙げられる。
　ハロゲン化アルキル基としては、トリフルオロメチル基、ペルフルオロエチル基、ペルフルオロプロピル基、ペルフルオロイソプロピル基、ペルフルオロブチル基、ペルフルオロｓｅｃ－ブチル基、ペルフルオロｔｅｒｔ－ブチル基、ペルフルオロペンチル基、ペルフルオロヘキシル基、ジクロロメチル基、ブロモメチル基、ヨードメチル基等の炭素数１～２５のハロゲン化アルキル基が挙げられる。好ましくは炭素数１～１２のハロゲン化アルキル基であり、より好ましくは炭素数１～１２のフルオロアルキル基であり、さらに好ましくは炭素数１～１２のペルフルオロアルキル基である。
　ハロゲン化アリール基としては、フルオロフェニル基、クロロフェニル基、ブロモフェニル基等の炭素数６～１８のハロゲン化アリール基が挙げられ、炭素数６～１８のフルオロアリール基であることが好ましく、炭素数６～１２のペルフルオロアリール基であることがより好ましく、さらに好ましくはペンタフルオロフェニル基である。 Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
The alkyl halide groups include trifluoromethyl group, perfluoroethyl group, perfluoropropyl group, perfluoroisopropyl group, perfluorobutyl group, perfluorosec-butyl group, perfluorotert-butyl group, perfluoropentyl group, perfluorohexyl group and dichloromethyl group. Examples thereof include an alkyl halide group having 1 to 25 carbon atoms such as a group, a bromomethyl group and an iodomethyl group. It is preferably an alkyl halide group having 1 to 12 carbon atoms, more preferably a fluoroalkyl group having 1 to 12 carbon atoms, and further preferably a perfluoroalkyl group having 1 to 12 carbon atoms.
Examples of the aryl halide group include an aryl halide group having 6 to 18 carbon atoms such as a fluorophenyl group, a chlorophenyl group and a bromophenyl group, and a fluoroaryl group having 6 to 18 carbon atoms is preferable. It is more preferably a perfluoroaryl group of 6-12, and even more preferably a pentafluorophenyl group.
　Ｘ１は、－ＣＯ－、－ＣＯＯ－又は－ＳＯ２－であることが好ましい。
　Ｒ２２２で表されるハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が挙げられる。
　Ｒ２２２で表される炭化水素基としては、炭素数１～２５の脂肪族炭化水素基又は炭素数６～１８の芳香族炭化水素基等が挙げられる。
　炭素数１～２５の脂肪族炭化水素基としては、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、ｔｅｒｔ－ブチル基、ｓｅｃ－ブチル基、ｎ－ペンチル基、ｎ－ヘキシル基、１－メチルブチル基、３－メチルブチル基、ｎ－オクチル基、ｎ－デシル、２－へキシル－オクチル基、シクロヘキシル基等の直鎖、分岐鎖状、環状の炭素数１～２５のアルキル基が挙げられ、炭素数１～１２のアルキルであることが好ましい。
　炭素数６～１８の芳香族炭化水素基としては、フェニル基、ナフチル基、アントラセニル基、ビフェニル基等の炭素数６～１８のアリール基；ベンジル基、フェニルエチル基、ナフチルメチル基等の炭素数７～１８のアラルキル基等が挙げられる。
　Ｒ２２２で表される炭化水素基が有していてもよい置換基としては、ハロゲン原子、ヒドロキシ基等が挙げられる。
　Ｒ２２３及びＲ２２４で表される炭素数１～６のアルキル基としては、メチル基、エチル基、ｎ－プロピル基、イソプロピル基、ｎ－ブチル基、ｔｅｒｔ－ブチル基、ｓｅｃ－ブチル基、ｎ－ペンチル基、ｎ－ヘキシル基、１－メチルブチル基等の直鎖又は分岐鎖状の炭素数１～６のアルキルが挙げられる。 X 1 is preferably -CO-, -COO- or -SO 2-.
The halogen atom represented by R 222, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom.
The hydrocarbon group represented by R 222, and the like aromatic hydrocarbon radical of an aliphatic hydrocarbon group or a C 6-18 having 1 to 25 carbon atoms.
Examples of the aliphatic hydrocarbon group having 1 to 25 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, a sec-butyl group, an n-pentyl group and an n-. Linear, branched, cyclic alkyl having 1 to 25 carbon atoms such as hexyl group, 1-methylbutyl group, 3-methylbutyl group, n-octyl group, n-decyl, 2-hexyl-octyl group and cyclohexyl group. The group is mentioned, and it is preferably an alkyl having 1 to 12 carbon atoms.
Examples of the aromatic hydrocarbon group having 6 to 18 carbon atoms include an aryl group having 6 to 18 carbon atoms such as a phenyl group, a naphthyl group, an anthracenyl group and a biphenyl group; and a benzyl group, a phenylethyl group and a naphthylmethyl group. Examples thereof include 7 to 18 aralkyl groups.
The substituent which may be a hydrocarbon group having represented by R 222, halogen atom, hydroxy group, and the like.
Alkyl groups having 1 to 6 carbon atoms represented by R223 and R224 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, tert-butyl group, sec-butyl group and n. Examples thereof include linear or branched alkyl having 1 to 6 carbon atoms such as a pentyl group, an n-hexyl group and a 1-methylbutyl group.
　式（ｚ－１）で表される基は、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）であることが好ましく、
－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９であることがより好ましく、
－ＳＯ２－Ｒ９であることがさらに好ましく、
－ＳＯ２－Ｒ１０（Ｒ１０は、置換基を有していてもよい炭素数６～１８の芳香族炭化水素基）、－ＳＯ２ＣＦ３、－ＳＯ２ＣＨＦ２、－ＳＯ２ＣＨ２Ｆであることがよりさらに好ましい。 The groups represented by the formula (z-1) are -CO-R 1 , -CO- OR 2 , -CO-NR 3 R 3k , -CO-SR 4 , -CS-R 5 ,- CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each represent a hydrocarbon group or a halogen atom which may have a substituent independently).
-CO-R 1, -CO-O -R 2, more preferably -SO 2 -R 9,
-SO 2- R 9 is even more preferred.
-SO 2 -R 10 (R 10 is an aromatic hydrocarbon group having to 18 6 carbon atoms which may have a substituent), - SO 2 CF 3, -SO 2 CHF 2, -SO 2 CH 2 It is even more preferably F.
　Ｒ３は、電子求引性基であることが好ましく、
　シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＯＣＦ３又は－ＳＣＦ３であることがより好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９であることがさらに好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＯ２ＣＦ３、－ＳＯ２－Ｒ１０であることがよりさらに好ましく、
　シアノ基又はニトロ基であることがより特に好ましい。 R 3 is preferably an electron-attracting group, preferably
Cyan group, nitro group, alkyl halide group, aryl halide group, -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-O-R 2 , -CO -NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2- R 9 (R) 1 represents R 2, R 3, R 3k , R 4, R 5, R 6, R 7, R 8 and R 9 each independently may be substituted hydrocarbon group or a halogen atom ), -OCF 3 or -SCF 3 is more preferred.
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SF 3, -SO 3 H, -SO 2 H, -CO-R 1, -CO-O-R 2, -SO 2 - further preferably R 9,
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, more preferably more it is -SO 2 -R 10,
More preferably, it is a cyano group or a nitro group.
　環Ｗ１は、Ｒ３で表される置換基以外の置換基を有していてもよい。該置換基としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等のハロゲン原子；メチル、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基等の炭素数１～２５の脂肪族炭化水素基（好ましくは炭素数１～１２のアルキル基）；フルオロメチル基、ジフルオロメチル基、トリフルオロメチル基、２－フルオロエチル基、２，２－ジフルオロエチル基、２，２，２－トリフルオロエチル基、１，１，２，２－テトラフルオロエチル基、１，１，２，２，２－ペンタフルオロエチル基等の炭素数１～１２のハロゲン化アルキル基；メトキシ基、エトキシ基、プロポキシ基、ブトキシ基、ペンチルオキシ基、ヘキシルオキシ基等の炭素数１～１２のアルコキシ基；メチルチオ基、エチルチオ基、プロピルチオ基、ブチルチオ基、ペンチルチオ基、ヘキシルチオ基等の炭素数１～１２のアルキルチオ基；モノフルオロメトキシ基、ジフルオロメトキシ基、トリフルオロメトキシ基、２－フルオロエトキシ基、１，１，２，２，２－ペンタフルオロエトキシ基等の炭素数１～１２のフッ素化アルコキシ基；トリフルオロメタンチオアルコキシ基等の炭素数１～１２のフッ素化アルコキシ基；アミノ基、メチルアミノ基、エチルアミノ基、ジメチルアミノ基、ジエチルアミノ基、メチルエチル等の１つ又は２つの炭素数１～６のアルキル基で置換されていてもよいアミノ基；カルバモイル基、Ｎ－メチルカルバモイル基、Ｎ，Ｎ－ジメチルカルバモイル基等のＮ－位が炭素数１～６のアルキルで置換されていてもよいカルバモイル基；メチルカルボニルオキシ基、エチルカルボニルオキシ基等の炭素数２～１２のアルキルカルボニルオキシ基；メチルスルホニル基、エチルスルホニル基等の炭素数１～１２のアルキルスルホニル基；フェニル基、ナフチル基、ジフェニル基等の炭素数６～２５の芳香族炭化水素基（好ましくは炭化水素６～１８のアリール基）；フェニルスルホニル基等の炭素数６～１２のアリールスルホニル基；メトキシスルホニル基、エトキシスルホニル基等の炭素数１～１２のアルコキシスルホニル基；アセチル基、エチルカルボニル基等の炭素数２～１２のアシル基；アルデヒド基；メトキシカルボニル基、エトキシカルボニル基、プロポキシカルボニル基、ブチルオキシカルボニル基等の炭素数２～１２のアルコキシカルボニル基；メトキシチオカルボニル基、エトキシチオカルボニル基等の炭素数２～１２のアルコキシチオカルボニル基；シアノ基；ニトロ基；水酸基；チオール基；スルホ基；カルバモイル基；カルボキシル基；－ＳＦ３；－ＳＦ５等が挙げられる。 Ring W 1 may have a substituent other than the substituent represented by R 3. Examples of the substituent include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; carbon such as methyl, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group and nonyl group. An aliphatic hydrocarbon group having a number of 1 to 25 (preferably an alkyl group having 1 to 12 carbon atoms); a fluoromethyl group, a difluoromethyl group, a trifluoromethyl group, a 2-fluoroethyl group, a 2,2-difluoroethyl group, Alkyl halide groups having 1 to 12 carbon atoms such as 2,2,2-trifluoroethyl group, 1,1,2,2-tetrafluoroethyl group, 1,1,2,2,2-pentafluoroethyl group An alkoxy group having 1 to 12 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, a hexyloxy group; a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, etc. Alkylthio group having 1 to 12 carbon atoms; monofluoromethoxy group, difluoromethoxy group, trifluoromethoxy group, 2-fluoroethoxy group, 1,1,2,2,2-pentafluoroethoxy group and the like having 1 to 12 carbon atoms. Fluorinated alkoxy group; fluorinated alkoxy group having 1 to 12 carbon atoms such as trifluoromethanethioalkoxy group; one or 2 of amino group, methylamino group, ethylamino group, dimethylamino group, diethylamino group, methylethyl and the like. Amino group which may be substituted with one alkyl group having 1 to 6 carbon atoms; N-position such as carbamoyl group, N-methylcarbamoyl group, N, N-dimethylcarbamoyl group is substituted with alkyl having 1 to 6 carbon atoms. Carbamoyl group which may be used; alkylcarbonyloxy group having 2 to 12 carbon atoms such as methylcarbonyloxy group and ethylcarbonyloxy group; alkylsulfonyl group having 1 to 12 carbon atoms such as methylsulfonyl group and ethylsulfonyl group; phenyl Aromatic hydrocarbon groups having 6 to 25 carbon atoms (preferably aryl groups having 6 to 18 hydrocarbons) such as groups, naphthyl groups and diphenyl groups; arylsulfonyl groups having 6 to 12 carbon atoms such as phenylsulfonyl groups; methoxysulfonyl groups. An alkoxysulfonyl group having 1 to 12 carbon atoms such as a group and an ethoxysulfonyl group; an acyl group having 2 to 12 carbon atoms such as an acetyl group and an ethylcarbonyl group; an aldehyde group; a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group and a butyl An alkoxycarbonyl group having 2 to 12 carbon atoms such as an oxycarbonyl group; methoxythiocarbonyl Like -SF 5 or the like; a cyano group; a nitro group, a hydroxyl group, a thiol group, a sulfo group, a carbamoyl group, a carboxyl group, -SF 3 group, alkoxythiocarbonyl group having 2 to 12 carbon atoms such as ethoxycarbonyl thiocarbonyl group ..
　式（Ｘ－１）で表される部分構造を有するアニオンは、式（Ｉ）で表されるアニオン～式（ＩＶ）で表されるアニオン又は式（ＶＩＩＩ）で表されるアニオンであることが好ましい。
Figure JPOXMLDOC01-appb-I000011
［式中、環Ｗ１及びＲ３はそれぞれ上記と同じ意味を表す。
　環Ｗ２、環Ｗ３、環Ｗ４、環Ｗ５、環Ｗ６、環Ｗ７及び環Ｗ１４は、それぞれ独立して、環構造を表し、該環構造は置換基を有していてもよい。
　Ｒ１、Ｒ２、Ｒ４、Ｒ５、Ｒ１２、Ｒ１４、Ｒ１５、Ｒ２２、Ｒ２４、Ｒ２５、Ｒ３２、Ｒ３４、Ｒ３５、Ｒ４２、Ｒ４４、Ｒ４５、Ｒ５２、Ｒ５４、Ｒ５５、Ｒ６２、Ｒ６４、Ｒ６５、Ｒ１３１、Ｒ１３２、Ｒ１３４及びＲ１３５は、それぞれ独立して、電子求引性基を表す。
　Ｒ１３、Ｒ２３、Ｒ３３、Ｒ４３、Ｒ５３、Ｒ６３及びＲ１３３は、１価の置換基を表す。
　Ｒ１とＲ２とは互いに連結して環を形成してもよい。
　Ｒ２とＲ３とは互いに連結して環を形成してもよい。
　Ｒ３とＲ４とは互いに連結して環を形成してもよい。
　Ｒ４とＲ５とは互いに連結して環を形成してもよい。
　Ｒ１２とＲ１３とは互いに連結して環を形成してもよい。
　Ｒ１３とＲ１４とは互いに連結して環を形成してもよい。
　Ｒ１４とＲ１５とは互いに連結して環を形成してもよい。
　Ｒ２２とＲ２３とは互いに連結して環を形成してもよい。
　Ｒ２３とＲ２４とは互いに連結して環を形成してもよい。
　Ｒ２４とＲ２５とは互いに連結して環を形成してもよい。
　Ｒ３２とＲ３３とは互いに連結して環を形成してもよい。
　Ｒ３３とＲ３４とは互いに連結して環を形成してもよい。
　Ｒ３４とＲ３５とは互いに連結して環を形成してもよい。
　Ｒ４２とＲ４３とは互いに連結して環を形成してもよい。
　Ｒ４３とＲ４４とは互いに連結して環を形成してもよい。
　Ｒ４４とＲ４５とは互いに連結して環を形成してもよい。
　Ｒ５２とＲ５３とは互いに連結して環を形成してもよい。
　Ｒ５３とＲ５４とは互いに連結して環を形成してもよい。
　Ｒ５４とＲ５５とは互いに連結して環を形成してもよい。
　Ｒ６２とＲ６３とは互いに連結して環を形成してもよい。
　Ｒ６３とＲ６４とは互いに連結して環を形成してもよい。
　Ｒ６４とＲ６５とは互いに連結して環を形成してもよい。
　Ｒ１３１とＲ１３２とは互いに連結して環を形成してもよい。
　Ｒ１３２とＲ１３３とは互いに連結して環を形成してもよい。
　Ｒ１３３とＲ１３４とは互いに連結して環を形成してもよい。
　Ｒ１３４とＲ１３５とは互いに連結して環を形成してもよい。
　Ｒｘ１及びＲｘ７は、それぞれ独立して、単結合又は２価の連結基を表す。
　Ｒｘ２は３価の連結基を表す。
　Ｒｘ３は４価の連結基を表す。］ The anion having a partial structure represented by the formula (X-1) may be an anion represented by the formula (I) to an anion represented by the formula (IV) or an anion represented by the formula (VIII). preferable.
Figure JPOXMLDOC01-appb-I000011
[In the formula, rings W 1 and R 3 have the same meanings as described above, respectively.
Ring W 2 , ring W 3 , ring W 4 , ring W 5 , ring W 6 , ring W 7 and ring W 14 each independently represent a ring structure, which ring structure has a substituent. May be good.
R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 131 , R 132 , R 134 and R 135 , respectively, independently represent electron-attracting groups.
R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represent monovalent substituents.
R 1 and R 2 may be connected to each other to form a ring.
R 2 and R 3 may be connected to each other to form a ring.
R 3 and R 4 may be connected to each other to form a ring.
R 4 and R 5 may be connected to each other to form a ring.
R 12 and R 13 may be connected to each other to form a ring.
R 13 and R 14 may be connected to each other to form a ring.
R 14 and R 15 may be connected to each other to form a ring.
R 22 and R 23 may be connected to each other to form a ring.
R 23 and R 24 may be connected to each other to form a ring.
R 24 and R 25 may be connected to each other to form a ring.
R 32 and R 33 may be connected to each other to form a ring.
R 33 and R 34 may be connected to each other to form a ring.
R 34 and R 35 may be connected to each other to form a ring.
R 42 and R 43 may be connected to each other to form a ring.
R 43 and R 44 may be connected to each other to form a ring.
R 44 and R 45 may be connected to each other to form a ring.
R 52 and R 53 may be connected to each other to form a ring.
R 53 and R 54 may be connected to each other to form a ring.
R 54 and R 55 may be connected to each other to form a ring.
R 62 and R 63 may be connected to each other to form a ring.
R 63 and R 64 may be connected to each other to form a ring.
R 64 and R 65 may be connected to each other to form a ring.
R 131 and R 132 may be connected to each other to form a ring.
R 132 and R 133 may be connected to each other to form a ring.
R 133 and R 134 may be connected to each other to form a ring.
R 134 and R 135 may be connected to each other to form a ring.
R x1 and R x7 each independently represent a single bond or a divalent linking group.
R x2 represents a trivalent linking group.
R x3 represents a tetravalent linking group. ]
　環Ｗ２、環Ｗ３、環Ｗ４、環Ｗ５、環Ｗ６、環Ｗ７及び環Ｗ１４における環構造は特に限定されない。環Ｗ２～環Ｗ７及び環１４はそれぞれ単環であってもよいし、縮合環であってもよい。環Ｗ２～環Ｗ７及び環１４は、環の構成要素としてヘテロ原子（例えば、酸素原子、硫黄原子、窒素原子等）を含む複素環であってもよい。
　環Ｗ２～環Ｗ７及び環１４は、通常、炭素数５～１８の環であり、５～７員環構造であることが好ましく、６員環構造であることがより好ましい。環Ｗ２～環Ｗ７及び環１４は、炭素数が５～７の環構造であることが好ましく、炭素数が６の環構造であることがより好ましい。
　環Ｗ２～環Ｗ７及び環１４は、それぞれ独立して、単環であることが好ましい。
　環Ｗ２～環Ｗ７及び環１４は、置換基を有していてもよく、具体的には、Ｒ３で表される置換基以外の環Ｗ１が有していてもよい置換基と同じものが挙げられる。 The ring structure in the ring W 2 , the ring W 3 , the ring W 4 , the ring W 5 , the ring W 6 , the ring W 7, and the ring W 14 is not particularly limited. Each ring W 2 ~ ring W 7 and ring 14 may be a single ring may be a condensed ring. Rings W 2 to W 7 and 14 may be heterocycles containing a hetero atom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a component of the ring.
Ring W 2 ~ ring W 7 and ring 14 is typically a ring having 5 to 18 carbon atoms, preferably 5 to 7-membered ring structure, more preferably a 6-membered ring structure. The rings W 2 to W 7 and the ring 14 preferably have a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms.
Ring W 2 ~ ring W 7 and ring 14 are each independently preferably a single ring.
Ring W 2 ~ ring W 7 and ring 14 may have a substituent, specifically, a substituent which may be ring W 1 optionally has other than the substituent represented by R 3 The same can be mentioned.
　環Ｗ２～環Ｗ７及び環１４が有する置換基は、炭素数１～１２のアルキル基、炭素数１～１２のアルコキシ基、炭素数１～１２のアルキルチオ基又は炭素数１～６のアルキル基で置換されていてもよいアミノ基であることが好ましい。 Substituents wherein the ring W 2 ~ ring W 7 and the ring 14 has an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylthio group or an alkyl having 1 to 6 carbon atoms having 1 to 12 carbon atoms It is preferably an amino group that may be substituted with a group.
　環Ｗ２～環Ｗ７及び環１４の具体例としては、環Ｗ１の具体例と同じものが挙げられる。 Specific examples of the rings W 2 to W 7 and the ring 14 include the same as the specific examples of the ring W 1 .
　Ｒ１３、Ｒ２３、Ｒ３３、Ｒ４３、Ｒ５３、Ｒ６３及びＲ１３３で表される１価の置換基は、特に限定されず、Ｒ３で表される１価の置換基と同じものが挙げられる。具体的には、１価の脂肪族炭化水素基、１価の芳香族炭化水素基、電子求引性基、電子供与性基、ヘテロ環基等が挙げられる。
　Ｒ１３、Ｒ２３、Ｒ３３、Ｒ４３、Ｒ５３、Ｒ６３及びＲ１３３は、それぞれ独立して、電子求引性基であることが好ましく、
　シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ２Ｈ又は－ＳＯ３Ｈであることがより好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９であることがさらに好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＯ２ＣＦ３、－ＳＯ２－Ｒ１０であることがよりさらに好ましく、
シアノ基又はニトロ基であることがより特に好ましい。 The monovalent substituent represented by R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 is not particularly limited and is the same as the monovalent substituent represented by R 3. Can be mentioned. Specific examples thereof include a monovalent aliphatic hydrocarbon group, a monovalent aromatic hydrocarbon group, an electron attracting group, an electron donating group, and a heterocyclic group.
It is preferable that R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 are independently electron-attracting groups, respectively.
Cyan group, nitro group, alkyl halide group, aryl halide group, -CO-R 1 , -CO- OR 2 , -CO-NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS- OR 6 , -CS-S-R 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6, R 7, R 8 and R 9 each independently represents which may have a substituent a hydrocarbon group or a halogen atom), -. OCF 3, -SCF 3, -SF 5, -SF 3 , -SO 2 H or -SO 3 H, more preferably
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SF 3, -SO 3 H, -SO 2 H, -CO-R 1, -CO-O-R 2, -SO 2 - further preferably R 9,
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, more preferably more it is -SO 2 -R 10,
More preferably, it is a cyano group or a nitro group.
　Ｒ１、Ｒ２、Ｒ４、Ｒ５、Ｒ１２、Ｒ１４、Ｒ１５、Ｒ２２、Ｒ２４、Ｒ２５、Ｒ３２、Ｒ３４、Ｒ３５、Ｒ４２、Ｒ４４、Ｒ４５、Ｒ５２、Ｒ５４、Ｒ５５、Ｒ６２、Ｒ６４、Ｒ６５、Ｒ１３１、Ｒ１３２、Ｒ１３４及びＲ１３５で表される電子求引性基としては、Ｒ３で表される電子求引性基と同じものが挙げられる。 R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54, R 55, R 62, R 64, R 65, R 131, examples of the electron withdrawing group represented by R 132, R 134 and R 135, an electron-withdrawing group represented by R 3 The same thing can be mentioned.
　Ｒ１、Ｒ２、Ｒ４、Ｒ５、Ｒ１２、Ｒ１４、Ｒ１５、Ｒ２２、Ｒ２４、Ｒ２５、Ｒ３２、Ｒ３４、Ｒ３５、Ｒ４２、Ｒ４４、Ｒ４５、Ｒ５２、Ｒ５４、Ｒ５５、Ｒ６２、Ｒ６４、Ｒ６５、Ｒ１３１、Ｒ１３２、Ｒ１３４及びＲ１３５は、それぞれ独立して、シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ２Ｈ又は－ＳＯ３Ｈであることがより好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９であることがさらに好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＯ２ＣＦ３、－ＳＯ２－Ｒ１０であることがよりさらに好ましく、
　シアノ基又はニトロ基であることがより特に好ましい。 R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 131 , R 132 , R 134 and R 135 , respectively, independently of cyano group, nitro group, alkyl halide group, aryl halide group, -CO-R 1 , -CO- OR 2 , -CO-NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are replaced independently. represents which may have a hydrocarbon group or a halogen atom), -. OCF 3, -SCF 3, -SF 5, -SF 3, more preferably -SO 2 H or -SO 3 H ,
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SF 3, -SO 3 H, -SO 2 H, -CO-R 1, -CO-O-R 2, -SO 2 - further preferably R 9,
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, more preferably more it is -SO 2 -R 10,
More preferably, it is a cyano group or a nitro group.
　Ｒ１とＲ２とは互いに結合して環を形成してもよい。Ｒ１とＲ２とが互いに結合して形成する環は、単環であってもよいし、縮合環であってもよいが、単環であることが好ましい。Ｒ１とＲ２とが互いに結合して形成する環は、環の構成要素としてヘテロ原子（窒素原子、酸素原子、硫黄原子）等を含んでいてもよい。
　Ｒ１とＲ２とが互いに結合して形成する環は、通常３～１０員環であり、５～７員環であることが好ましく、５員環又は６員環であることがより好ましい。 R 1 and R 2 may be combined with each other to form a ring. The ring formed by bonding R 1 and R 2 to each other may be a monocyclic ring or a condensed ring, but is preferably a monocyclic ring. The ring formed by bonding R 1 and R 2 to each other may contain a hetero atom (nitrogen atom, oxygen atom, sulfur atom) or the like as a component of the ring.
The ring formed by bonding R 1 and R 2 to each other is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, and more preferably a 5-membered ring or a 6-membered ring.
　Ｒ１とＲ２とが互いに結合して形成する環としては、以下に記載の環構造等が挙げられる。

Figure JPOXMLDOC01-appb-I000012
［式中、＊は結合手を表す。］ Examples of the ring formed by bonding R 1 and R 2 to each other include the ring structure described below.

Figure JPOXMLDOC01-appb-I000012
[In the formula, * represents a bond. ]
　Ｒ１とＲ２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 The rings formed by combining R 1 and R 2 with each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ４とＲ５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ４とＲ５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 4 and R 5 to each other include the same ring formed by connecting R 1 and R 2 to each other. Ring R 4 and R 5 are formed by linking each other, the formula (w-1) ~ formula (w-15), formula (w-17), formula (w-31), formula (w-32) , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１４とＲ１５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１４とＲ１５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 14 and R 15 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 14 and R 15 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ２４とＲ２５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ２４とＲ２５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 24 and R 25 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 24 and R 25 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ３４とＲ３５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ３４とＲ３５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 34 and R 35 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 34 and R 35 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ４４とＲ４５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ４４とＲ４５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 44 and R 45 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 44 and R 45 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ５４とＲ５５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ５４とＲ５５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 54 and R 55 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 54 and R 55 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ６４とＲ６５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ６４とＲ６５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 64 and R 65 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 64 and R 65 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１３１とＲ１３２とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１３１とＲ１３２とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 131 and R 132 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 131 and R 132 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１３４とＲ１３５とが互いに連結して形成する環としては、Ｒ１とＲ２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１３４とＲ１３５とが互いに連結して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 134 and R 135 to each other include the same ring formed by connecting R 1 and R 2 to each other. The rings formed by connecting R 134 and R 135 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ２とＲ３とは互いに連結して環を形成してもよい。Ｒ２とＲ３とが連結して形成される環は、環の構成要素として環Ｗ１に結合している二重結合を含む。また、Ｒ２とＲ３とが連結して形成される環と環Ｗ１とで縮合環を形成する。Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環としては、例えば、以下に記載の式（ｗ１１－１）～式（ｗ１１－１２）で表される環構造が挙げられる。
Figure JPOXMLDOC01-appb-I000013
［式中、環Ｗ１は上記と同じ意味を表す。
　＊１はＲ１との結合手を表し、＊２はＲ４との結合手を表し、＊３はＲ５との結合手を表す。
　Ｒｆ１、Ｒｆ２及びＲｆ３は、それぞれ独立して、電子求引性基、炭化水素基、水酸基を表す。
　ｍ１は０～６の整数を表し、ｍ２は０～４の整数を表し、ｍ３は０～２の整数を表す。］ R 2 and R 3 may be connected to each other to form a ring. The ring formed by connecting R 2 and R 3 includes a double bond bonded to ring W 1 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 2 and R 3 and a ring W 1. Examples of the fused ring formed by the ring formed by bonding R 2 and R 3 to each other and the ring W 1 are represented by the following formulas (w11-1) to (w11-12). The ring structure to be formed is mentioned.
Figure JPOXMLDOC01-appb-I000013
[In the equation, ring W 1 has the same meaning as above.
* 1 represents a bond with R 1 , * 2 represents a bond with R 4, and * 3 represents a bond with R 5 .
R f1 , R f2, and R f3 independently represent an electron-attracting group, a hydrocarbon group, and a hydroxyl group, respectively.
m1 represents an integer of 0 to 6, m2 represents an integer of 0 to 4, and m3 represents an integer of 0 to 2. ]
　Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環のより具体的な例としては、以下に記載の環構造等が挙げられる。

Figure JPOXMLDOC01-appb-I000014
More specific examples of the fused ring formed by the ring formed by bonding R 2 and R 3 to each other and the ring W 1 include the ring structure described below.

Figure JPOXMLDOC01-appb-I000014
　Ｒ１２とＲ１３とは互いに連結して環を形成してもよい。Ｒ１２とＲ１３とが連結して形成される環は、環の構成要素として環Ｗ２に結合している二重結合を含む。また、Ｒ１２とＲ１３とが連結して形成される環と環Ｗ２とで縮合環を形成する。具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 12 and R 13 may be connected to each other to form a ring. The ring formed by connecting R 12 and R 13 includes a double bond bonded to ring W 2 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 12 and R 13 and a ring W 2. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ２２とＲ２３とは互いに連結して環を形成してもよい。Ｒ２２とＲ２３とが連結して形成される環は、環の構成要素として環Ｗ３に結合している二重結合を含む。また、Ｒ２２とＲ２３とが連結して形成される環と環Ｗ３とで縮合環を形成する。具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 22 and R 23 may be connected to each other to form a ring. The ring formed by connecting R 22 and R 23 includes a double bond bonded to ring W 3 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 22 and R 23 and a ring W 3. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ３２とＲ３３とは互いに連結して環を形成してもよい。Ｒ３２とＲ３３とが連結して形成される環は、環の構成要素として環Ｗ４に結合している二重結合を含む。また、Ｒ３２とＲ３３とが連結して形成される環と環Ｗ４とで縮合環を形成する。具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 32 and R 33 may be connected to each other to form a ring. The ring formed by connecting R 32 and R 33 includes a double bond bonded to ring W 4 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 32 and R 33 and a ring W 4. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ４２とＲ４３とは互いに連結して環を形成してもよい。Ｒ４２とＲ４３とが連結して形成される環は、環の構成要素として環Ｗ５に結合している二重結合を含む。また、Ｒ４２とＲ４３とが連結して形成される環と環Ｗ５とで縮合環を形成する。具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 42 and R 43 may be connected to each other to form a ring. The ring formed by connecting R 42 and R 43 includes a double bond bonded to ring W 5 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 42 and R 43 and a ring W 5. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ５２とＲ５３とは互いに連結して環を形成してもよい。Ｒ５２とＲ５３とが連結して形成される環は、環の構成要素として環Ｗ６に結合している二重結合を含む。また、Ｒ５２とＲ５３とが連結して形成される環と環Ｗ６とで縮合環を形成する。具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 52 and R 53 may be connected to each other to form a ring. The ring formed by connecting R 52 and R 53 includes a double bond bonded to ring W 6 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 52 and R 53 and a ring W 6. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ６２とＲ６３とは互いに連結して環を形成してもよい。Ｒ６２とＲ６３とが連結して形成される環は、環の構成要素として環Ｗ７に結合している二重結合を含む。また、Ｒ６２とＲ６３とが連結して形成される環と環Ｗ７とで縮合環を形成する。具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 62 and R 63 may be connected to each other to form a ring. The ring formed by connecting R 62 and R 63 includes a double bond bonded to ring W 7 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 62 and R 63 and a ring W 7. Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ１３２とＲ１３３とは互いに連結して環を形成してもよい。Ｒ１３２とＲ１３３とが連結して形成される環は、環の構成要素として環Ｗ１４に結合している二重結合を含む。
また、Ｒ１３２とＲ１３３とが連結して形成される環と環Ｗ１４とで縮合環を形成する。
具体的には、Ｒ２とＲ３とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 132 and R 133 may be connected to each other to form a ring. The ring formed by connecting R 132 and R 133 includes a double bond bonded to ring W 14 as a component of the ring.
Further, a fused ring is formed by a ring formed by connecting R 132 and R 133 and a ring W 14.
Specifically, the same ring as the fused ring formed by the ring W 1 formed by bonding R 2 and R 3 to each other can be mentioned.
　Ｒ３とＲ４とは互いに連結して環を形成してもよい。Ｒ３とＲ４とが連結して形成される環は、環の構成要素として環Ｗ１に結合している二重結合を含む。また、Ｒ３とＲ４とが連結して形成される環と環Ｗ１とで縮合環を形成する。Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環としては、具体的には、以下に記載の環が挙げられる。
Figure JPOXMLDOC01-appb-I000015
［式中、環Ｗ１は上記と同じ意味を表す。
　＊４はＲ１との結合手を表し、＊５はＲ２との結合手を表し、＊６はＲ５との結合手を表す。
　Ｒｆ４、Ｒｆ５及びＲｆ６は、それぞれ独立して、電子求引性基、炭化水素基、水酸基を表す。
　ｍ４は０～６の整数を表し、ｍ５は０～４の整数を表し、ｍ６は０～２の整数を表す。］ R 3 and R 4 may be connected to each other to form a ring. The ring formed by connecting R 3 and R 4 includes a double bond bonded to ring W 1 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 3 and R 4 and a ring W 1. Specific examples of the fused ring formed by the ring W 1 formed by the ring formed by bonding R 3 and R 4 to each other include the rings described below.
Figure JPOXMLDOC01-appb-I000015
[In the equation, ring W 1 has the same meaning as above.
* 4 represents a bond with R 1 , * 5 represents a bond with R 2, and * 6 represents a bond with R 5 .
R f4 , R f5 and R f6 independently represent an electron-attracting group, a hydrocarbon group and a hydroxyl group, respectively.
m4 represents an integer of 0 to 6, m5 represents an integer of 0 to 4, and m6 represents an integer of 0 to 2. ]
　Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環のより具体的な例としては、以下に記載の環構造等が挙げられる。
Figure JPOXMLDOC01-appb-I000016
More specific examples of the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 include the ring structure described below.
Figure JPOXMLDOC01-appb-I000016
　Ｒ１３とＲ１４とは互いに連結して環を形成してもよい。Ｒ１３とＲ１４とが連結して形成される環は、環の構成要素として環Ｗ２に結合している二重結合を含む。また、Ｒ１３とＲ１４とが連結して形成される環と環Ｗ２とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 13 and R 14 may be connected to each other to form a ring. The ring formed by connecting R 13 and R 14 includes a double bond bonded to ring W 2 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 13 and R 14 and a ring W 2. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒ２３とＲ２４とは互いに連結して環を形成してもよい。Ｒ２３とＲ２４とが連結して形成される環は、環の構成要素として環Ｗ３に結合している二重結合を含む。また、Ｒ２３とＲ２４とが連結して形成される環と環Ｗ３とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 23 and R 24 may be connected to each other to form a ring. The ring formed by connecting R 23 and R 24 includes a double bond bonded to ring W 3 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 23 and R 24 and a ring W 3. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒ３３とＲ３４とは互いに連結して環を形成してもよい。Ｒ３３とＲ３４とが連結して形成される環は、環の構成要素として環Ｗ４に結合している二重結合を含む。また、Ｒ３３とＲ３４とが連結して形成される環と環Ｗ４とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 33 and R 34 may be connected to each other to form a ring. The ring formed by connecting R 33 and R 34 includes a double bond bonded to ring W 4 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 33 and R 34 and a ring W 4. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒ４３とＲ４４とは互いに連結して環を形成してもよい。Ｒ４３とＲ４４とが連結して形成される環は、環の構成要素として環Ｗ５に結合している二重結合を含む。また、Ｒ４３とＲ４４とが連結して形成される環と環Ｗ５とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 43 and R 44 may be connected to each other to form a ring. The ring formed by connecting R 43 and R 44 includes a double bond bonded to ring W 5 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 43 and R 44 and a ring W 5. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒ５３とＲ５４とは互いに連結して環を形成してもよい。Ｒ５３とＲ５４とが連結して形成される環は、環の構成要素として環Ｗ６に結合している二重結合を含む。また、Ｒ５３とＲ５４とが連結して形成される環と環Ｗ６とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 53 and R 54 may be connected to each other to form a ring. The ring formed by connecting R 53 and R 54 includes a double bond bonded to ring W 6 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 53 and R 54 and a ring W 6. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒ６３とＲ６４とは互いに連結して環を形成してもよい。Ｒ６３とＲ６４とが連結して形成される環は、環の構成要素として環Ｗ７に結合している二重結合を含む。また、Ｒ６３とＲ６４とが連結して形成される環と環Ｗ７とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 63 and R 64 may be connected to each other to form a ring. The ring formed by connecting R 63 and R 64 includes a double bond bonded to ring W 7 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 63 and R 64 and a ring W 7. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒ１３３とＲ１３４とは互いに連結して環を形成してもよい。Ｒ１３３とＲ１３４とが連結して形成される環は、環の構成要素として環Ｗ１４に結合している二重結合を含む。また、Ｒ１３３とＲ１３４とが連結して形成される環と環Ｗ１４とで縮合環を形成する。具体的には、Ｒ３とＲ４とが互いに結合して形成される環と環Ｗ１とで形成される縮合環と同じものが挙げられる。 R 133 and R 134 may be connected to each other to form a ring. The ring formed by connecting R 133 and R 134 includes a double bond bonded to ring W 14 as a component of the ring. Further, a fused ring is formed by a ring formed by connecting R 133 and R 134 and a ring W 14. Specifically, the same as the fused ring formed by the ring formed by bonding R 3 and R 4 to each other and the ring W 1 can be mentioned.
　Ｒｘ１及びＲｘ７で表される２価の連結基としては、それぞれ独立して、置換基を有していてもよい炭素数１～１８の２価の脂肪族炭化水素基又は置換基を有していてもよい炭素数６～１８の２価の芳香族炭化水素基等が挙げられる。前記２価の脂肪族炭化水素基及び２価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＮＲ１Ｂ－（Ｒ１Ｂは水素原子又は炭素数１～６のアルキル基を表す）、－ＣＯ－、－ＳＯ２－、－ＳＯ－、－ＰＯ３－で置換されていてもよい。
　また、前記２価の脂肪族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基、炭素数６～１６のアリール基等が挙げられる。
　前記２価の芳香族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基、アルデヒド基等が挙げられる。 As the divalent linking group represented by R x1 and R x7 , each independently has a divalent aliphatic hydrocarbon group having 1 to 18 carbon atoms or a substituent which may have a substituent. Examples thereof include a divalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may be used. -CH 2- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group is -O-, -S-, -NR 1B- (R 1B is a hydrogen atom or 1 to 1 to carbon atoms. (Representing an alkyl group of 6), -CO-, -SO 2- , -SO-, -PO 3- may be substituted.
Examples of the substituent that the divalent aliphatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group, and an aryl group having 6 to 16 carbon atoms.
Examples of the substituent that the divalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group, an aldehyde group and the like.
　Ｒｘ１及びＲｘ７で表される２価の連結基の具体例としては、以下に記載の連結基が挙げられる。式中、＊は結合手を表す。

Figure JPOXMLDOC01-appb-I000017
Specific examples of the divalent linking group represented by R x1 and R x7 include the linking groups described below. In the formula, * represents a bond.

Figure JPOXMLDOC01-appb-I000017
Figure JPOXMLDOC01-appb-I000018
Figure JPOXMLDOC01-appb-I000018
Figure JPOXMLDOC01-appb-I000019
Figure JPOXMLDOC01-appb-I000019
Figure JPOXMLDOC01-appb-I000020
Figure JPOXMLDOC01-appb-I000020
Figure JPOXMLDOC01-appb-I000021
Figure JPOXMLDOC01-appb-I000021
Figure JPOXMLDOC01-appb-I000022
Figure JPOXMLDOC01-appb-I000022
　Ｒｘ１及びＲｘ７で表される２価の連結基は、それぞれ独立して、置換基を有していてもよい炭素数１～１２の２価の脂肪族炭化水素基及び置換基を有していてもよい炭素数６～１２の２価の芳香族炭化水素基であることが好ましく（該２価の脂肪族炭化水素基及び該２価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＮＲ１Ｂ－、－ＣＯ－、－ＳＯ２－で置換されていてもよい）であることが好ましく、下記に記載の連結基であることがより好ましい。
Figure JPOXMLDOC01-appb-I000023
The divalent linking groups represented by R x1 and R x7 each independently have a divalent aliphatic hydrocarbon group having 1 to 12 carbon atoms and a substituent which may have a substituent. preferably also a divalent aromatic hydrocarbon group which may having 6 to 12 carbon atoms optionally (-CH 2 contained in the aromatic hydrocarbon group having a bivalent aliphatic hydrocarbon group and the divalent said - is, -O -, - S -, - NR 1B -, - CO -, - SO 2 - is preferred that substituted also be) in, and more preferably a linking group as described below.
Figure JPOXMLDOC01-appb-I000023
　Ｒｘ２で表される３価の連結基としては、置換基を有していてもよい炭素数１～１８の３価の脂肪族炭化水素基又は置換基を有していてもよい炭素数６～１８の３価の芳香族炭化水素基が挙げられる。前記３価の脂肪族炭化水素基及び前記３価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＣＳ－、－ＣＯ－、－ＳＯ－、－ＳＯ２－、－ＮＲ１１Ｂ－（Ｒ１１Ｂは水素原子又は炭素数１～６のアルキル基を表す。）で置き換わっていてもよい。
　前記３価の脂肪族炭化水素基及び前記３価の芳香族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基等が挙げられる。
　Ｒｘ２で表される３価の連結基は、炭素数１～１８の３価の脂肪族炭化水素基（前記３価の脂肪族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－ＣＯ－、－ＳＯ２－で置き換わっていてもよい。）及び炭素数６～１８の３価の芳香族炭化水素基（前記３価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－ＣＯ－、－ＳＯ２－で置き換わっていてもよい。）であることが好ましい。
　Ｒｘ２で表される３価の連結基の具体例としては、以下に記載の連結基が挙げられる。
Figure JPOXMLDOC01-appb-I000024
As the trivalent linking group represented by R x2 , a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent or a substituent may have 6 carbon atoms. Examples include ~ 18 trivalent aromatic hydrocarbon groups. -CH 2- contained in the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO-, -SO. It may be replaced with 2-, -NR 11B- (R 11B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms).
Examples of the substituent that the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
The trivalent linking group represented by R x2 is a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms (-CH 2- contained in the trivalent aliphatic hydrocarbon group is -O-, -CO-, -SO 2- may be replaced) and a trivalent aromatic hydrocarbon group having 6 to 18 carbon atoms (-CH 2- contained in the trivalent aromatic hydrocarbon group-is. -O -, - CO -, - SO 2 -. which may be replaced by) is preferably.
Specific examples of the trivalent linking group represented by R x2 include the linking groups described below.
Figure JPOXMLDOC01-appb-I000024
Figure JPOXMLDOC01-appb-I000025
Figure JPOXMLDOC01-appb-I000025
Figure JPOXMLDOC01-appb-I000026
Figure JPOXMLDOC01-appb-I000026
　Ｒｘ３で表される４価の連結基としては、置換基を有していてもよい炭素数１～１８の４価の脂肪族炭化水素基又は置換基を有していてもよい炭素数６～１８の４価の芳香族炭化水素基が挙げられる。前記４価の脂肪族炭化水素基及び前記４価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＣＳ－、－ＣＯ－、－ＳＯ－、－ＳＯ２－、－ＮＲ１１Ｃ－（Ｒ１１Ｃは水素原子又は炭素数１～６のアルキル基を表す。）で置き換わっていてもよい。
　前記４価の脂肪族炭化水素基及び前記４価の芳香族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基等が挙げられる。
　Ｒｘ３で表される４価の連結基は、炭素数１～１８の４価の脂肪族炭化水素基（前記４価の脂肪族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－ＣＯ－、－ＳＯ２－で置き換わっていてもよい。）及び炭素数６～１８の４価の脂肪族炭化水素基（前記４価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－ＣＯ－、－ＳＯ２－で置き換わっていてもよい。）であることが好ましい。
　Ｒｘ３で表される４価の連結基の具体例としては、以下に記載の連結基が挙げられる。
Figure JPOXMLDOC01-appb-I000027
As the tetravalent linking group represented by R x3 , a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent or a substituent may have 6 carbon atoms. Examples include to 18 tetravalent aromatic hydrocarbon groups. -CH 2- contained in the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO-, -SO. It may be replaced with 2-, -NR 11C- (R 11C represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms).
Examples of the substituent that the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
The tetravalent linking group represented by R x3 is a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms (-CH 2- contained in the tetravalent aliphatic hydrocarbon group is -O-, -CO-, -SO 2- may be replaced) and a tetravalent aliphatic hydrocarbon group having 6 to 18 carbon atoms (-CH 2- contained in the tetravalent aromatic hydrocarbon group-is. -O -, - CO -, - SO 2 -. which may be replaced by) is preferably.
Specific examples of the tetravalent linking group represented by R x3 include the linking groups described below.
Figure JPOXMLDOC01-appb-I000027
Figure JPOXMLDOC01-appb-I000028
Figure JPOXMLDOC01-appb-I000028
　式（Ｉ）で表されるアニオンは、式（Ｉ－Ａ）で表されるアニオンであることがより好ましい。
Figure JPOXMLDOC01-appb-I000029
［式（Ｉ－Ａ）中、Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５はそれぞれ上記と同じ意味を表す。
ＲＥ１、ＲＥ２、ＲＥ３、ＲＥ４、ＲＥ５及びＲＥ６は、それぞれ独立して、水素原子、炭素数１～２５の炭化水素基又はアルコキシ基を表す。］
　式（Ｉ－Ａ）中、Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）
－ＯＣＦ３又は－ＳＣＦ３であることが好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９であることがより好ましく、
　シアノ基、ニトロ基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９、－ＯＣＦ３、－ＳＣＦ３又は－ＳＦ５であることがさらに好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＯ２ＣＦ３、－ＳＯ２－Ｒ１０（Ｒ１０は、置換基を有していてもよい炭素数６～１８の芳香族炭化水素基）であることがよりさらに好ましく、
　シアノ基又はニトロ基であることがより特に好ましい。 The anion represented by the formula (I) is more preferably an anion represented by the formula (IA).
Figure JPOXMLDOC01-appb-I000029
[In formula (IA), R 1 , R 2 , R 3 , R 4 and R 5 have the same meanings as described above.
R E1 , R E2 , R E3 , R E4 , R E5 and R E6 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 25 carbon atoms or an alkoxy group. ]
In formula (IA), at least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, an alkyl halide group, an aryl halide group, -SCF 3 ,-. SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO- OR 2 , -CO-NR 3 R 3k , -CO-S-R 4 , -CS- R 5 , -CS- OR 6 , -CS-S-R 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each represent a hydrocarbon group or halogen atom which may have a substituent independently.)
It is preferably -OCF 3 or -SCF 3.
Cyan group, nitro group, -OCF 3 , -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-O-R 2 , -SO 2- R 9 . Is more preferable
More preferably, it is a cyano group, a nitro group, -CO-R 1 , -CO- OR 2 , -SO 2- R 9 , -OCF 3 , -SCF 3 or -SF 5.
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, -SO 2 -R 10 (R 10 is a substituted group the unprotected 6 to 18 carbon atoms also have Aromatic hydrocarbon groups) are even more preferred,
More preferably, it is a cyano group or a nitro group.
　式（Ｉ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000030
Examples of the anion represented by the formula (I) include the anions described below.
Figure JPOXMLDOC01-appb-I000030
Figure JPOXMLDOC01-appb-I000031
Figure JPOXMLDOC01-appb-I000031
Figure JPOXMLDOC01-appb-I000032
Figure JPOXMLDOC01-appb-I000032
Figure JPOXMLDOC01-appb-I000033
Figure JPOXMLDOC01-appb-I000033
Figure JPOXMLDOC01-appb-I000034
Figure JPOXMLDOC01-appb-I000034
Figure JPOXMLDOC01-appb-I000035
Figure JPOXMLDOC01-appb-I000035
　式（ＩＩ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000036
Examples of the anion represented by the formula (II) include the anions described below.
Figure JPOXMLDOC01-appb-I000036
Figure JPOXMLDOC01-appb-I000037
Figure JPOXMLDOC01-appb-I000037
Figure JPOXMLDOC01-appb-I000038
Figure JPOXMLDOC01-appb-I000038
Figure JPOXMLDOC01-appb-I000039
Figure JPOXMLDOC01-appb-I000039
Figure JPOXMLDOC01-appb-I000040
Figure JPOXMLDOC01-appb-I000040
Figure JPOXMLDOC01-appb-I000041
Figure JPOXMLDOC01-appb-I000041
Figure JPOXMLDOC01-appb-I000042
Figure JPOXMLDOC01-appb-I000042
Figure JPOXMLDOC01-appb-I000043
Figure JPOXMLDOC01-appb-I000043
Figure JPOXMLDOC01-appb-I000044
Figure JPOXMLDOC01-appb-I000044
Figure JPOXMLDOC01-appb-I000045
Figure JPOXMLDOC01-appb-I000045

Figure JPOXMLDOC01-appb-I000046
Figure JPOXMLDOC01-appb-I000046
　式（ＩＩＩ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000047
Examples of the anion represented by the formula (III) include the anions described below.
Figure JPOXMLDOC01-appb-I000047
Figure JPOXMLDOC01-appb-I000048
Figure JPOXMLDOC01-appb-I000048
Figure JPOXMLDOC01-appb-I000049
Figure JPOXMLDOC01-appb-I000049
Figure JPOXMLDOC01-appb-I000050
Figure JPOXMLDOC01-appb-I000050
Figure JPOXMLDOC01-appb-I000051
Figure JPOXMLDOC01-appb-I000051
Figure JPOXMLDOC01-appb-I000052
Figure JPOXMLDOC01-appb-I000052
Figure JPOXMLDOC01-appb-I000053
Figure JPOXMLDOC01-appb-I000053

Figure JPOXMLDOC01-appb-I000054
Figure JPOXMLDOC01-appb-I000054
Figure JPOXMLDOC01-appb-I000055
Figure JPOXMLDOC01-appb-I000055
Figure JPOXMLDOC01-appb-I000056
Figure JPOXMLDOC01-appb-I000056
　式（ＩＶ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000057
Examples of the anion represented by the formula (IV) include the anions described below.
Figure JPOXMLDOC01-appb-I000057
Figure JPOXMLDOC01-appb-I000058
Figure JPOXMLDOC01-appb-I000058
Figure JPOXMLDOC01-appb-I000059
Figure JPOXMLDOC01-appb-I000059

Figure JPOXMLDOC01-appb-I000060
Figure JPOXMLDOC01-appb-I000060
　式（ＶＩＩＩ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000061
Examples of the anion represented by the formula (VIII) include the anions described below.
Figure JPOXMLDOC01-appb-I000061
Figure JPOXMLDOC01-appb-I000062
Figure JPOXMLDOC01-appb-I000062
　環Ｗ１が少なくとも一つ有する置換基がＲ３以外である場合、式（Ｘ）で表される部分構造を有するアニオンとしては、例えば、式（Ｖ）で表されるアニオン～式（ＶＩＩ）で表されるアニオン等が挙げられる。
Figure JPOXMLDOC01-appb-I000063
［式中、環Ｗ１、Ｒ１、Ｒ２、Ｒ４及びＲ５はそれぞれ上記と同じ意味を表す。
　環Ｗ８、環Ｗ９、環Ｗ１０、環Ｗ１１、環Ｗ１２及び環Ｗ１３は、それぞれ独立して、環構造を表し、該環構造は置換基を有していてもよい。
　Ｒ７１、Ｒ７２、Ｒ７４、Ｒ７５、Ｒ８１、Ｒ８２、Ｒ８４、Ｒ８５、Ｒ９１、Ｒ９２、Ｒ９４、Ｒ９５、Ｒ１０１、Ｒ１０２、Ｒ１０４、Ｒ１０５、Ｒ１１１、Ｒ１１２、Ｒ１１４、Ｒ１１５、Ｒ１２１、Ｒ１２２、Ｒ１２４及びＲ１２５は、それぞれ独立して、電子求引性基を表す。
　Ｒ７１とＲ７２とは互いに連結して環を形成してもよい。
　Ｒ７４とＲ７５とは互いに連結して環を形成してもよい。
　Ｒ８１とＲ８２とは互いに連結して環を形成してもよい。
　Ｒ８４とＲ８５とは互いに連結して環を形成してもよい。
　Ｒ９１とＲ９２とは互いに連結して環を形成してもよい。
　Ｒ９４とＲ９５とは互いに連結して環を形成してもよい。
　Ｒ１０１とＲ１０２とは互いに連結して環を形成してもよい。
　Ｒ１０４とＲ１０５とは互いに連結して環を形成してもよい。
　Ｒ１１１とＲ１１２とは互いに連結して環を形成してもよい。
　Ｒ１１４とＲ１１５とは互いに連結して環を形成してもよい。
　Ｒ１２１とＲ１２２とは互いに連結して環を形成してもよい。
　Ｒ１２４とＲ１２５とは互いに連結して環を形成してもよい。
　Ｒｘ４は単結合又は２価の連結基を表す。
　Ｒｘ５は３価の連結基を表す。
　Ｒｘ６は４価の連結基を表す。］ When the substituent having at least one ring W 1 is other than R 3 , the anion having the partial structure represented by the formula (X) is, for example, an anion represented by the formula (V) to the formula (VII). Examples thereof include anions represented by.
Figure JPOXMLDOC01-appb-I000063
[In the formula, rings W 1 , R 1 , R 2 , R 4 and R 5 have the same meanings as described above, respectively.
Ring W 8 , ring W 9 , ring W 10 , ring W 11 , ring W 12 and ring W 13 each independently represent a ring structure, and the ring structure may have a substituent.
R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 and R 125 , respectively, independently represent electron-attracting groups.
R 71 and R 72 may be connected to each other to form a ring.
R 74 and R 75 may be connected to each other to form a ring.
R 81 and R 82 may be connected to each other to form a ring.
R 84 and R 85 may be connected to each other to form a ring.
R 91 and R 92 may be connected to each other to form a ring.
R 94 and R 95 may be connected to each other to form a ring.
R 101 and R 102 may be connected to each other to form a ring.
R 104 and R 105 may be connected to each other to form a ring.
R 111 and R 112 may be connected to each other to form a ring.
R 114 and R 115 may be connected to each other to form a ring.
R 121 and R 122 may be connected to each other to form a ring.
R 124 and R 125 may be connected to each other to form a ring.
R x4 represents a single bond or a divalent linking group.
R x5 represents a trivalent linking group.
R x6 represents a tetravalent linking group. ]
　環Ｗ８、環Ｗ９、環Ｗ１０、環Ｗ１１、環Ｗ１２及び環Ｗ１３における環構造は特に限定されない。環Ｗ９～環Ｗ１２はそれぞれ単環であってもよいし、縮合環であってもよい。環Ｗ９～環Ｗ１２は、環の構成要素としてヘテロ原子（例えば、酸素原子、硫黄原子、窒素原子等）を含む複素環であってもよい。
　環Ｗ９～環Ｗ１２は、通常、炭素数５～１８の環であり、５～７員環構造であることが好ましく、６員環構造であることがより好ましい。環Ｗ９～環Ｗ１２は、炭素数が５～７の環構造であることが好ましく、炭素数が６の環構造であることがより好ましい。
　環Ｗ９～環Ｗ１２は、それぞれ独立して、単環であることが好ましい。
　環Ｗ９～環Ｗ１２は、置換基を有していてもよく、具体的には、Ｒ３で表される置換基以外の環Ｗ１が有していてもよい置換基と同じものが挙げられる。 The ring structure in the ring W 8 , the ring W 9 , the ring W 10 , the ring W 11 , the ring W 12 and the ring W 13 is not particularly limited. Rings W 9 to W 12 may be monocyclic or condensed rings, respectively. Rings W 9 to W 12 may be heterocycles containing a hetero atom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a component of the ring.
Rings W 9 to W 12 are usually rings having 5 to 18 carbon atoms, preferably having a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure. Rings W 9 to W 12 preferably have a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms.
It is preferable that the rings W 9 to W 12 are independent and monocyclic.
Rings W 9 to W 12 may have a substituent, and specifically, the same substituents that the ring W 1 may have other than the substituent represented by R 3 are used. Can be mentioned.
　環Ｗ９～環Ｗ１２が有する置換基は、炭素数１～１２のアルキル基、炭素数１～１２のアルコキシ基、炭素数１～１２のアルキルチオ基又は炭素数１～６のアルキル基で置換されていてもよいアミノ基であることが好ましい。 The substituents of rings W 9 to W 12 are substituted with an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylthio group having 1 to 12 carbon atoms or an alkyl group having 1 to 6 carbon atoms. It is preferably an amino group which may be used.
　環Ｗ９～環Ｗ１２の具体例としては、環Ｗ１の具体例と同じものが挙げられる。 Specific examples of the rings W 9 to 12 include the same as the specific examples of the ring W 1 .
　Ｒ７１、Ｒ７２、Ｒ７４、Ｒ７５、Ｒ８１、Ｒ８２、Ｒ８４、Ｒ８５、Ｒ９１、Ｒ９２、Ｒ９４、Ｒ９５、Ｒ１０１、Ｒ１０２、Ｒ１０４、Ｒ１０５、Ｒ１１１、Ｒ１１２、Ｒ１１４、Ｒ１１５、Ｒ１２１、Ｒ１２２、Ｒ１２４及びＲ１２５で表される電子求引性基としては、Ｒ３で表される電子求引性基と同じものが挙げられる。 R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 and R 125. Examples of the electron attracting group are the same as those represented by R 3. ..
　Ｒ７１、Ｒ７２、Ｒ７４、Ｒ７５、Ｒ８１、Ｒ８２、Ｒ８４、Ｒ８５、Ｒ９１、Ｒ９２、Ｒ９４、Ｒ９５、Ｒ１０１、Ｒ１０２、Ｒ１０４、Ｒ１０５、Ｒ１１１、Ｒ１１２、Ｒ１１４、Ｒ１１５、Ｒ１２１、Ｒ１２２、Ｒ１２４及びＲ１２５は、それぞれ独立して、シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＯＣＦ３又は－ＳＣＦ３であることが好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９であることがより好ましく、
　シアノ基、ニトロ基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９、－ＯＣＦ３、－ＳＣＦ３又は－ＳＦ５であることがさらに好ましく、
　シアノ基、ニトロ基、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＯ２ＣＦ３、－ＳＯ２－Ｒ１０（Ｒ１０は、置換基を有していてもよい炭素数６～１８の芳香族炭化水素基）であることがよりさらに好ましく、
　シアノ基又はニトロ基であることがより特に好ましい。 R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111. , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 and R 125 , respectively, independently of cyano group, nitro group, alkyl halide group, aryl halide group, -SF 5 , -SF. 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-O-R 2 , -CO-NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS -OR 6 , -CS-S-R 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7) , R 8 and R 9 each independently represents which may have a substituent a hydrocarbon group or a halogen atom), -. preferably a OCF 3 or -SCF 3,
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SF 3, -SO 3 H, -SO 2 H, -CO-R 1, -CO-O-R 2, -SO 2 - more preferably R 9,
More preferably, it is a cyano group, a nitro group, -CO-R 1 , -CO- OR 2 , -SO 2- R 9 , -OCF 3 , -SCF 3 or -SF 5.
A cyano group, a nitro group, -OCF 3, -SCF 3, -SF 5, -SO 2 CF 3, -SO 2 -R 10 (R 10 is a substituted group the unprotected 6 to 18 carbon atoms also have Aromatic hydrocarbon groups) are even more preferred,
More preferably, it is a cyano group or a nitro group.
　Ｒ７１とＲ７２とは互いに結合して環を形成してもよい。Ｒ７１とＲ７２とが互いに結合して形成する環は、単環であってもよいし、縮合環であってもよいが、単環であることが好ましい。Ｒ７１とＲ７２とが互いに結合して形成する環は、環の構成要素としてヘテロ原子（窒素原子、酸素原子、硫黄原子）等を含んでいてもよい。
　Ｒ７１とＲ７２とが互いに結合して形成する環は、通常３～１０員環であり、５～７員環であることが好ましく、５員環又は６員環であることがより好ましい。
　Ｒ７１とＲ７２とが互いに結合して形成する環としては、Ｒ１とＲ２とが互いに結合して形成する環と同じものが挙げられる。
　Ｒ７１とＲ７２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 R 71 and R 72 may be combined with each other to form a ring. The ring formed by bonding R 71 and R 72 to each other may be a monocyclic ring or a condensed ring, but is preferably a monocyclic ring. The ring formed by bonding R 71 and R 72 to each other may contain a hetero atom (nitrogen atom, oxygen atom, sulfur atom) or the like as a component of the ring.
The ring formed by connecting R 71 and R 72 to each other is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, and more preferably a 5-membered ring or a 6-membered ring.
Examples of the ring formed by connecting R 71 and R 72 to each other include the same ring formed by connecting R 1 and R 2 to each other.
The rings formed by connecting R 71 and R 72 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formula (w-35) to formula (w-42) and formula (w-44) are preferable, and formulas (w-1) to formula (w-6), formula (w-). 13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ７４とＲ７５とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ７４とＲ７５とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 74 and R 75 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 74 and R 75 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ８１とＲ８２とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ８１とＲ８２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 81 and R 82 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 81 and R 82 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ８４とＲ８５とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ８４とＲ８５とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 84 and R 85 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by combining R 84 and R 85 with each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ９１とＲ９２とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ９１とＲ９２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 91 and R 92 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 91 and R 92 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ９４とＲ９５とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ９４とＲ９５とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 94 and R 95 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by combining R 94 and R 95 with each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１０１とＲ１０２とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１０１とＲ１０２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 101 and R 102 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 101 and R 102 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１０４とＲ１０５とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１０４とＲ１０５とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 104 and R 105 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 104 and R 105 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１１１とＲ１１２とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１１１とＲ１１２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 111 and R 112 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 111 and R 112 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１１４とＲ１１５とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１１４とＲ１１５とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 114 and R 115 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 114 and R 115 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１２１とＲ１２２とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１２１とＲ１２２とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 121 and R 122 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by connecting R 121 and R 122 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒ１２４とＲ１２５とが互いに連結して形成する環としては、Ｒ７１とＲ７２とが互いに連結して形成する環と同じものが挙げられる。Ｒ１２４とＲ１２５とが互いに結合して形成する環は、式（ｗ－１）～式（ｗ－１５）、式（ｗ－１７）、式（ｗ－３１）、式（ｗ－３２）、式（ｗ－３５）～式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることが好ましく、式（ｗ－１）～式（ｗ－６）、式（ｗ－１３）、式（ｗ－３５）、式（ｗ－３６）、式（ｗ－４２）及び式（ｗ－４４）で表される環構造であることがより好ましい。 Examples of the ring formed by connecting R 124 and R 125 to each other include the same ring formed by connecting R 71 and R 72 to each other. The rings formed by the coupling of R 124 and R 125 to each other are represented by formulas (w-1) to (w-15), formulas (w-17), formulas (w-31), and formulas (w-32). , Formulations (w-35) to formulas (w-42) and preferably ring structures represented by formulas (w-44), formulas (w-1) to formulas (w-6), formulas (w). -13), the ring structure represented by the formula (w-35), the formula (w-36), the formula (w-42) and the formula (w-44) is more preferable.
　Ｒｘ４で表される２価の連結基としては、置換基を有していてもよい炭素数１～１８の２価の脂肪族炭化水素基又は置換基を有していてもよい炭素数６～１８の２価の芳香族炭化水素基等が挙げられる。前記２価の脂肪族炭化水素基及び２価の芳香族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＮＲ１Ｂ－（Ｒ１Ｂは水素原子又は炭素数１～６のアルキル基を表す）、－ＣＯ－、－ＳＯ２－、－ＳＯ－、－ＰＯ３－で置換されていてもよい。
　また、前記２価の脂肪族炭化水素基及び２価の芳香族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基等が挙げられる。
　Ｒｘ４で表される２価の連結基の具体例としては、Ｒｘ１で表される２価の連結基の具体例と同じものが挙げられる。
　Ｒｘ４で表される２価の連結基、下記に記載の連結基であることが好ましい。
Figure JPOXMLDOC01-appb-I000064
As the divalent linking group represented by R x4 , a divalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent or a substituent may have 6 carbon atoms. Examples thereof include divalent aromatic hydrocarbon groups of ~ 18. -CH 2- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group is -O-, -S-, -NR 1B- (R 1B is a hydrogen atom or 1 to 1 to carbon atoms. (Representing an alkyl group of 6), -CO-, -SO 2- , -SO-, -PO 3- may be substituted.
Examples of the substituent that the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
Specific examples of the divalent linking group represented by R x4 include the same specific examples of the divalent linking group represented by R x1.
A divalent linking group represented by R x4 , preferably the linking group described below.
Figure JPOXMLDOC01-appb-I000064
　Ｒｘ５で表される２価の連結基としては、置換基を有していてもよい炭素数１～１８の３価の脂肪族炭化水素基又は置換基を有していてもよい炭素数６～１８の３価の芳香族炭化水素基が挙げられる。前記３価の脂肪族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＣＳ－、－ＣＯ－、－ＳＯ－、－ＮＲ１１Ｂ（Ｒ１１Ｂは水素原子又は炭素数１～６のアルキル基を表す。）－で置き換わっていてもよい。
　前記３価の脂肪族炭化水素基及び前記３価の芳香族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基等が挙げられる。
　Ｒｘ５で表される３価の連結基は、置換基を有していてもよい炭素数１～１２の３価の脂肪族炭化水素基であることが好ましい。
　Ｒｘ５で表される３価の連結基の具体例としては、Ｒｘ２で表される３価の連結基の具体例と同じものが挙げられる。
　Ｒｘ５で表される連結基は、以下に記載の連結基であることが好ましい。
Figure JPOXMLDOC01-appb-I000065
As the divalent linking group represented by R x5 , a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent or a substituent may have 6 carbon atoms. Examples include ~ 18 trivalent aromatic hydrocarbon groups. -CH 2- contained in the trivalent aliphatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO- , -NR 11B (R 11B is a hydrogen atom or the number of carbon atoms). It represents an alkyl group of 1 to 6)-may be replaced by.
Examples of the substituent that the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
The trivalent linking group represented by R x5 is preferably a trivalent aliphatic hydrocarbon group having 1 to 12 carbon atoms which may have a substituent.
Specific examples of the trivalent linking group represented by R x5 include the same specific examples of the trivalent linking group represented by R x2.
The linking group represented by R x5 is preferably the linking group described below.
Figure JPOXMLDOC01-appb-I000065
　Ｒｘ６で表される４価の連結基としては、置換基を有していてもよい炭素数１～１８の４価の脂肪族炭化水素基又は置換基を有していてもよい炭素数６～１８の４価の芳香族炭化水素基が挙げられる。前記４価の脂肪族炭化水素基に含まれる－ＣＨ２－は、－Ｏ－、－Ｓ－、－ＣＳ－、－ＣＯ－、－ＳＯ－、－ＮＲ１１Ｃ－（Ｒ１１Ｃは水素原子又は炭素数１～６のアルキル基を表す。）で置き換わっていてもよい。
　前記４価の脂肪族炭化水素基及び前記４価の芳香族炭化水素基が有していてもよい置換基としては、ハロゲン原子、水酸基、カルボキシ基、アミノ基等が挙げられる。
　Ｒｘ６で表される４価の連結基は、それぞれ独立して、置換基を有していてもよい炭素数１～１２の４価の脂肪族炭化水素基であることが好ましい。
　Ｒｘ６で表される４価の連結基の具体例としては、Ｒｘ３で表される４価の連結基の具体例と同じものが挙げられる。
　Ｒｘ６で表される４価の連結基は、以下に記載の連結基であることが好ましい。
Figure JPOXMLDOC01-appb-I000066
As the tetravalent linking group represented by R x6 , a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent or a substituent may have 6 carbon atoms. Examples include to 18 tetravalent aromatic hydrocarbon groups. -CH 2- contained in the tetravalent aliphatic hydrocarbon group is -O-, -S-, -CS-, -CO-, -SO- , -NR 11C- (R 11C is a hydrogen atom or carbon. It may be replaced by (representing an alkyl group of the number 1 to 6).
Examples of the substituent that the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group and the like.
The tetravalent linking group represented by R x6 is preferably a tetravalent aliphatic hydrocarbon group having 1 to 12 carbon atoms, which may independently have a substituent.
Specific examples of the tetravalent linking group represented by R x6 include the same specific examples of the tetravalent linking group represented by R x3.
The tetravalent linking group represented by R x6 is preferably the linking group described below.
Figure JPOXMLDOC01-appb-I000066
　式（Ｖ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000067
Examples of the anion represented by the formula (V) include the anions described below.
Figure JPOXMLDOC01-appb-I000067
Figure JPOXMLDOC01-appb-I000068
Figure JPOXMLDOC01-appb-I000068
　式（ＶＩ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000069
Examples of the anion represented by the formula (VI) include the anions described below.
Figure JPOXMLDOC01-appb-I000069
Figure JPOXMLDOC01-appb-I000070
Figure JPOXMLDOC01-appb-I000070
　式（ＶＩＩ）で表されるアニオンとしては、例えば、以下に記載のアニオンが挙げられる。
Figure JPOXMLDOC01-appb-I000071
Examples of the anion represented by the formula (VII) include the anions described below.
Figure JPOXMLDOC01-appb-I000071
Figure JPOXMLDOC01-appb-I000072
Figure JPOXMLDOC01-appb-I000072
Figure JPOXMLDOC01-appb-I000073
Figure JPOXMLDOC01-appb-I000073
　＜カチオン＞
　本発明の化合物は、式（Ｘ）で表されるアニオンと対となるカチオンとから構成される。式（Ｘ）で表されるアニオンの価数とカチオンの価数とが同じであれば、その組み合わせは限定されない。式（Ｘ）で表されるアニオンの価数が２以上である場合、カチオンは式（Ｘ）で表されるアニオンと同じ価数のカチオンであってもよいし、式（Ｘ）で表されるアニオンの価数と同じ価数となるように１価のカチオンを複数有していてもよい。また、式（Ｘ）で表されるアニオンの価数と同じ価数となるのであれば、１価のカチオンと１価以外のカチオン（例えば、２価のカチオン等）とを有していてもよい。一方、カチオンの価数が２以上である場合、カチオンと同じ価数となるように１価の式（Ｘ）で表されるアニオンを複数有していてもよい。また、カチオンの価数と同じ価数となるのであれば、１価の式（Ｘ）で表されるアニオンと１価以外の式（Ｘ）で表されるアニオンとを有していてもよい。 <Cation>
The compound of the present invention is composed of an anion represented by the formula (X) and a pair of cations. As long as the valence of the anion represented by the formula (X) and the valence of the cation are the same, the combination is not limited. When the valence of the anion represented by the formula (X) is 2 or more, the cation may be a cation having the same valence as the anion represented by the formula (X), or is represented by the formula (X). It may have a plurality of monovalent cations so as to have the same valence as the valence of the anion. Further, if the valence is the same as the valence of the anion represented by the formula (X), even if it has a monovalent cation and a cation other than the monovalent cation (for example, a divalent cation). good. On the other hand, when the cation has a valence of 2 or more, it may have a plurality of anions represented by the monovalent formula (X) so as to have the same valence as the cation. Further, as long as it has the same valence as the cation valence, it may have an anion represented by a monovalent formula (X) and an anion represented by a formula (X) other than monovalent. ..
　カチオンは、有機カチオンであってもよいし、無機カチオンであってもよい。また、式（Ｘ）で表されるアニオンの価数が２以上である場合、化合物（Ｘ）はカチオンとして有機カチオンと無機カチオンとを有していてもよい。 The cation may be an organic cation or an inorganic cation. Further, when the valence of the anion represented by the formula (X) is 2 or more, the compound (X) may have an organic cation and an inorganic cation as cations.
　有機カチオンとしては、Ｎ－メチルピリジニウム、Ｎ－エチルピリジニウム、Ｎ－プロピルピリジニウム、Ｎ－エチル－２－メチルピリジニウム、Ｎ－エチル－３－メチルピリジニウム、１－エチル－３－（ヒドロキシメチル）ピリジニウム、Ｎ－ブチルピリジニウム、Ｎ－ブチル－４－メチルピリジニウム、Ｎ－ブチル－３－メチルピリジニウム、Ｎ－ヘキシルピリジニウム、Ｎ－オクチルピリジニウム、Ｎ－オクチル－４－メチルピリジニウム、１，１’－ジメチル－４，４’－ビピリジニウム、１，１’－ジベンジル－４，４’－ビピリジニウム等のピリジニウムカチオン；
　１－ブチル－１－メチルピペリジニウム、１－メチル－１－プロピルピペリジニウム等のピペリジニウムカチオン；
　１－アリル－１－メチルピロリジニウム、１－ブチル－１－メチルピロリジニウム、１－エチル－１－メチルピロリジニウム、１－メチル－１－プロピルピロリジニウム、１－（２－メトキシエチル）－１－メチルピロリジニウム、１－メチル－１－ｎ－オクチルピロリジニウム、１－メチル－１－ペンチルピロリジニウム等のピロリジニウムカチオン；
　２－メチル－１－ピロリニウム等のピロリン骨格を有するカチオン；
　１－ブチル－２，３－ジメチルイミダゾリウム、３，３’－（ブタン－１,４－ジイル)ビス（１－ビニル－３－イミダゾリウム)、１－ベンジル－３－メチルイミダゾリウム、１，３－ジメチルイミダゾリウム、１，２－ジメチル－３－プロピルイミダゾリウム、１－デシル－３－メチルイミダゾリウム、１－ドデシル－３－メチルイミダゾリウム、１－エチル－２，３－ジメチルイミダゾリウム、３－エチル－１－ビニルイミダゾリウム、３－エチル－１－ビニルイミダゾリウム、１－メチル－３－（４－スルホブチル）イミダゾリウム、１－エチル－３－メチルイミダゾリウム、１－ブチル－３－メチルイミダゾリウム等のイミダゾリウムカチオン；
　アミルトリエチルアンモニウム、ブチルトリメチルアンモニウム、ベンジル(エチル)ジメチルアンモニウム、シクロヘキシルトリメチルアンモニウム、ジエチル（メチル）プロピルアンモニウム、ジエチル（２－メトキシエチル）メチルアンモニウム、エチル（２－メトキシエチル）ジメチルアンモニウム、エチル（ジメチル）（２－フェニルエチル）アンモニウム、メチルトリ－ｎ－オクチルアンモニウム、テトラブチルアンモニウム、テトラヘキシルアンモニウム、テトラペンチルアンモニウム、テトラ－ｎ－オクチルアンモニウム、テトラヘプチルアンモニウム、テトラプロピルアンモニウム、Ｎ，Ｎ，Ｎ，Ｎ’，Ｎ’，Ｎ’－ヘキサメチル－３－［２－［（トリメチルアンモニオ）エチル］－１，５－ペンタンジアミニウム等のアンモニウムカチオン；
　トリメチルスルホニウム、トリブチルスルホニウム、トリエチルスルホニウム等のトリアルキルスルホニウムカチオン；
　トリブチルヘキサデシルホスホニウム、トリブチルメチルホスホニウム、トリブチル－ｎ－オクチルホスホニウム、トリブチル－ｎ－オクチルホスホニウム、テトラ－ｎ－オクチルホスホニウム、トリブチル（２－メトキシエチル)ホスホニウム、トリブチルメチルホスホニウム、トリヘキシル（テトラデシル）ホスホニウム、トリヘキシル(テトラデシル)ホスホニウム等のホスホニウムカチオン；
　４－エチル－４－メチルモルホリニウム等のモルホリニウムカチオン；
　トリフェニルメチリウム等のトリアリールメタンカチオン等が挙げられる。 Examples of organic cations include N-methylpyridinium, N-ethylpyridinium, N-propylpyridinium, N-ethyl-2-methylpyridinium, N-ethyl-3-methylpyridinium, 1-ethyl-3- (hydroxymethyl) pyridinium, N-butylpyridinium, N-butyl-4-methylpyridinium, N-butyl-3-methylpyridinium, N-hexylpyridinium, N-octylpyridinium, N-octyl-4-methylpyridinium, 1,1'-dimethyl-4 , 4'-bipyridinium, 1,1'-dibenzyl-4,4'-bipyridinium and other pyridinium cations;
Piperidinium cations such as 1-butyl-1-methylpiperidinium and 1-methyl-1-propylpiperidinium;
1-allyl-1-methylpyrrolidinium, 1-butyl-1-methylpyrrolidinium, 1-ethyl-1-methylpyrrolidinium, 1-methyl-1-propylpyrrolidinium, 1- (2-methoxy) Ethyl) Pyrrolidinium cations such as -1-methylpyrrolidinium, 1-methyl-1-n-octylpyrrolidinium, 1-methyl-1-pentylpyrrolidinium;
Cations with a pyrroline skeleton such as 2-methyl-1-pyrrolinium;
1-butyl-2,3-dimethylimidazolium, 3,3'-(butane-1,4-diyl) bis (1-vinyl-3-imidazolium), 1-benzyl-3-methylimidazolium, 1, 3-Dimethylimidazolium, 1,2-dimethyl-3-propylimidazolium, 1-decyl-3-methylimidazolium, 1-dodecyl-3-methylimidazolium, 1-ethyl-2,3-dimethylimidazolium, 3-Ethyl-1-vinylimidazolium, 3-ethyl-1-vinylimidazolium, 1-methyl-3- (4-sulfobutyl) imidazolium, 1-ethyl-3-methylimidazolium, 1-butyl-3- Imidazolium cations such as methylimidazolium;
Amiltriethylammonium, butyltrimethylammonium, benzyl (ethyl) dimethylammonium, cyclohexyltrimethylammonium, diethyl (methyl) propylammonium, diethyl (2-methoxyethyl) methylammonium, ethyl (2-methoxyethyl) dimethylammonium, ethyl (dimethyl) (2-Phenylethyl) ammonium, methyltri-n-octylammonium, tetrabutylammonium, tetrahexylammonium, tetrapentylammonium, tetra-n-octylammonium, tetraheptylammonium, tetrapropylammonium, N, N, N, N' , N', N'-Hexamethyl-3- [2-[(trimethylammonio) ethyl] -1,5-Ammonium cations such as pentandiaminium;
Trialkylsulfonium cations such as trimethylsulfonium, tributylsulfonium, triethylsulfonium;
Tributylhexadecylphosphonium, tributylmethylphosphonium, tributyl-n-octylphosphonium, tributyl-n-octylphosphonium, tetra-n-octylphosphonium, tributyl (2-methoxyethyl) phosphonium, tributylmethylphosphonium, trihexyl (tetradecyl) phosphonium, trihexyl (Tetradecyl) Phosnium cations such as phosphonium;
Morphorinium cations such as 4-ethyl-4-methylmorpholinium;
Examples thereof include triarylmethane cations such as triphenylmethylium.
　無機カチオンとしては、リチウムイオン、ナトリウムイオン、カリウムイオン、ルビジウムイオン、セシウムイオン等のアルカリ金属イオン；
　銅（Ｉ）イオン、銀イオン、鉄（Ｉ）イオン等の１価の金属イオン；
　ベリリウムイオン、マグネシウムイオン、カルシウムイオン、ストロンチウムイオン、バリウムイオン等のアルカリ土類金属イオン；
　銅（ＩＩ）イオン、ニッケルイオン、コバルトイオン、鉄（ＩＩ）イオン、マンガンイオン、パラジウムイオン、亜鉛イオン、ゲルマニウム（ＩＶ）イオン等の２価の金属イオン；
　アルミニウムイオン、コバルト（ＩＩＩ）イオン、鉄（ＩＩＩ）イオン、クロム（ＩＩＩ）イオン、スカンジウムイオン、イットリウムイオン、ルテニウム（ＩＩＩ）イオン、ガリウムイオン、インジウムイオン等の３価の金属イオン；
　チタニウムイオン、バナジウム（ＩＶ）イオン、ジルコニウムイオン、ハフニウムイオン、ゲルマニウム（ＩＶ）イオン、モリブデン（ＩＶ）イオン等の４価の金属イオン；
　ＮＨ４ ＋等が挙げられる。 Examples of the inorganic cation include alkali metal ions such as lithium ion, sodium ion, potassium ion, rubidium ion, and cesium ion;
Monovalent metal ions such as copper (I) ion, silver ion, iron (I) ion;
Alkaline earth metal ions such as beryllium ion, magnesium ion, calcium ion, strontium ion, barium ion;
Divalent metal ions such as copper (II) ion, nickel ion, cobalt ion, iron (II) ion, manganese ion, palladium ion, zinc ion, germanium (IV) ion;
Trivalent metal ions such as aluminum ion, cobalt (III) ion, iron (III) ion, chromium (III) ion, scandium ion, yttrium ion, ruthenium (III) ion, gallium ion, and indium ion;
Tetravalent metal ions such as titanium ion, vanadium (IV) ion, zirconium ion, hafnium ion, germanium (IV) ion, molybdenum (IV) ion;
NH 4 +, and the like.
　カチオンは、アルカリ金属イオン、アルカリ土類金属イオン、銅（Ｉ）イオン、銅（ＩＩ）イオン、ニッケルイオン、コバルト（ＩＩＩ）イオン、鉄（ＩＩ）イオン、鉄（ＩＩＩ）イオン、パラジウムイオン及び有機カチオンであることが好ましく、カリウムイオン、カルシウムイオン、バリウムイオン、マグネシウムイオン、銅（Ｉ）イオン、銅（ＩＩ）イオン、ニッケルイオン及び有機カチオンであることがより好ましく、さらに好ましくはカリウムイオン及び有機カチオンである。 The cations are alkali metal ion, alkaline earth metal ion, copper (I) ion, copper (II) ion, nickel ion, cobalt (III) ion, iron (II) ion, iron (III) ion, palladium ion and organic. It is preferably a cation, more preferably a potassium ion, a calcium ion, a barium ion, a magnesium ion, a copper (I) ion, a copper (II) ion, a nickel ion and an organic cation, and even more preferably a potassium ion and an organic. It is a cation.
　化合物（Ｘ）としては、例えば、以下の表１～表９に記載の化合物が挙げられる。なお、化合物（１）は下記に示す化合物である。
Figure JPOXMLDOC01-appb-I000074
Examples of the compound (X) include the compounds listed in Tables 1 to 9 below. The compound (1) is a compound shown below.
Figure JPOXMLDOC01-appb-I000074
Figure JPOXMLDOC01-appb-T000075
Figure JPOXMLDOC01-appb-T000075
Figure JPOXMLDOC01-appb-T000076
Figure JPOXMLDOC01-appb-T000076
Figure JPOXMLDOC01-appb-T000077
Figure JPOXMLDOC01-appb-T000077
Figure JPOXMLDOC01-appb-T000078
Figure JPOXMLDOC01-appb-T000078
Figure JPOXMLDOC01-appb-T000079
Figure JPOXMLDOC01-appb-T000079
Figure JPOXMLDOC01-appb-T000080
Figure JPOXMLDOC01-appb-T000080
Figure JPOXMLDOC01-appb-T000081
Figure JPOXMLDOC01-appb-T000081
Figure JPOXMLDOC01-appb-T000082
Figure JPOXMLDOC01-appb-T000082
Figure JPOXMLDOC01-appb-T000083
Figure JPOXMLDOC01-appb-T000083
　式（Ｉ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（Ｉ）という場合がある）は、化合物（１）～化合物（６３）等が挙げられ、化合物（２）、化合物（３）、化合物（７）～化合物（１１）、化合物（１３）～化合物（１８）、化合物（２４）、化合物（２８）、化合物（３１）、化合物（３２）、化合物（３７）、化合物（４０）～化合物（４４）、化合物（４６）、化合物（４７）、化合物（４９）、化合物（５０）、化合物（５５）、化合物（５８）、化合物（６０）であることが好ましい。 Examples of the compound (X) having an anion represented by the formula (I) (hereinafter, may be referred to as compound (I)) include compounds (1) to (63), and compounds (2) and compounds ( 3), Compound (7) to Compound (11), Compound (13) to Compound (18), Compound (24), Compound (28), Compound (31), Compound (32), Compound (37), Compound ( 40) to compound (44), compound (46), compound (47), compound (49), compound (50), compound (55), compound (58), compound (60) are preferable.
　式（ＩＩ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（ＩＩ）という場合がある）は、化合物（６４）～化合物（９２）等が挙げられ、化合物（６４）、化合物（６５）、化合物（６７）、化合物（７０）、化合物（７２）、化合物（７５）～化合物（７７）、化合物（７９）、化合物（８０）、化合物（８３）、化合物（８４）、化合物（８６）、化合物（８７）であることが好ましい。
　式（ＩＩＩ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（ＩＩＩ）という場合がある）は、化合物（９３）～化合物（１１８）等が挙げられ、化合物（９３）、化合物（９４）、化合物（９６）、化合物（１０１）～化合物（１０５）、化合物（１０７）、化合物（１０９）、化合物（１１１）、化合物（１１５）、化合物（１１６）であることが好ましい。
　式（ＩＶ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（ＩＶ）という場合がある）は、化合物（１１９）～化合物（１２９）等が挙げられ、化合物（１２５）であることが好ましい。 Examples of the compound (X) having an anion represented by the formula (II) (hereinafter, may be referred to as compound (II)) include compound (64) to compound (92), and the compound (64) and the compound ( 65), compound (67), compound (70), compound (72), compound (75) to compound (77), compound (79), compound (80), compound (83), compound (84), compound ( 86), preferably compound (87).
Examples of the compound (X) having an anion represented by the formula (III) (hereinafter, may be referred to as compound (III)) include compound (93) to compound (118), and compound (93) and compound ( 94), compound (96), compound (101) to compound (105), compound (107), compound (109), compound (111), compound (115), compound (116).
Examples of the compound (X) having an anion represented by the formula (IV) (hereinafter, may be referred to as compound (IV)) include compound (119) to compound (129), and are compound (125). Is preferable.
　式（Ｖ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（Ｖ）という場合がある）は、化合物（１３０）～化合物（１３９）等が挙げられ、化合物（１３０）、化合物（１３１）、化合物（１３４）、化合物（１３５）であることが好ましい。
　式（ＶＩ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（ＶＩ）という場合がある）は、化合物（１４０）～化合物（１４４）等が挙げられ、化合物（１４０）、化合物（１４２）、化合物（１４４）であることが好ましい。
　式（ＶＩＩ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（ＶＩＩ）という場合がある）は、化合物（１４５）～化合物（１５３）等が挙げられる。
　式（ＶＩＩＩ）で表されるアニオンを有する化合物（Ｘ）（以下、化合物（ＶＩＩＩ）という場合がある）は、化合物（１５４）～化合物（１６３）等が挙げられる。 Examples of the compound (X) having an anion represented by the formula (V) (hereinafter, may be referred to as compound (V)) include compound (130) to compound (139), and compound (130) and compound ( 131), compound (134), and compound (135) are preferable.
Examples of the compound (X) having an anion represented by the formula (VI) (hereinafter, may be referred to as compound (VI)) include compound (140) to compound (144), and compound (140) and compound ( 142), preferably compound (144).
Examples of the compound (X) having an anion represented by the formula (VII) (hereinafter, may be referred to as compound (VII)) include compound (145) to compound (153).
Examples of the compound (X) having an anion represented by the formula (VIII) (hereinafter, may be referred to as compound (VIII)) include compound (154) to compound (163).
　＜化合物（Ｉ）の製造方法＞
　化合物（Ｉ）は、例えば、式（Ｍ－１）で表される化合物（以下、化合物（Ｍ－１）という場合がある。）と式（Ｍ－２）で表される化合物（以下、化合物（Ｍ－２）という場合がある。）とを反応させることにより得ることができる。
Figure JPOXMLDOC01-appb-I000084
［式（Ｍ－１）中、Ｒ３、Ｒ４及びＲ５は上記と同じ意味を表し、環Ｗ１Ａは環構造を表す。
　式（Ｍ－２）中、Ｒ１及びＲ２は上記と同じ意味を表す。］ <Method for producing compound (I)>
The compound (I) is, for example, a compound represented by the formula (M-1) (hereinafter, may be referred to as a compound (M-1)) and a compound represented by the formula (M-2) (hereinafter, a compound). It may be obtained by reacting with (M-2).
Figure JPOXMLDOC01-appb-I000084
[In the formula (M-1), R 3 , R 4 and R 5 have the same meanings as described above, and ring W 1A represents a ring structure.
In formula (M-2), R 1 and R 2 have the same meanings as above. ]
　化合物（Ｍ－１）と化合物（Ｍ－２）との反応は、通常、化合物（Ｍ－１）と化合物（Ｍ－２）とを混合することにより実施され、塩基と化合物（Ｍ－１）との混合物に化合物（Ｍ－２）を加えることが好ましい。
　化合物（Ｍ－１）と化合物（Ｍ－２）との反応は、さらにメチル化剤の存在下で実施されることが好ましく、
　化合物（Ｍ－１）とメチル化剤と塩基との混合物に、化合物（Ｍ－２）を加えることがより好ましい。 The reaction between compound (M-1) and compound (M-2) is usually carried out by mixing compound (M-1) and compound (M-2), and the base and compound (M-1). It is preferable to add compound (M-2) to the mixture with.
The reaction between compound (M-1) and compound (M-2) is preferably carried out in the presence of a methylating agent.
It is more preferable to add compound (M-2) to a mixture of compound (M-1), a methylating agent and a base.
　塩基としては、水酸化ナトリウム、水酸化リチウム、水酸化カリウム、水酸化セシウム、水酸化ルビシウム、水酸化カルシウム、水酸化バリウム、水酸化マグネシウム等の金属水酸化物（好ましくはアルカリ金属水酸化物）；ナトリウムメトキシド、カリウムメトキシド、リチウムメトキシド、ナトリウムエトキシド、ナトリウムイソプロポキシド、ナトリウムターシャリーブトキシド、カリウムターシャリーブトキシド等の金属アルコキシド（好ましくはアルカリ金属アルコキシド）；水素化リチウム、水素化ナトリウム、水素化カリウム、水素化リチウムアルミニウム、水素化ホウ素ナトリウム、水素化アルミニウム、水素化アルミニウムナトリウム等の金属水素化物；酸化カルシウム、酸化マグネシウム等の金属酸化物；炭酸水素ナトリウム、炭酸ナトリウム、炭酸カリウム等の金属炭酸塩（好ましくはアルカリ土類金属炭酸塩）；ノルマルブチルリチウム、ターシャリーブチルリチウム、メチルリチウム、グリニャール試薬等の有機アルキル金属化合物；アンモニア、トリエチルアミン、ジイソプロピルエチルアミン、エタノールアミン、ピロリジン、ピペリジン、ジアザビシクロウンデセン、ジアザビシクロノネン、グアニジン、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、ピリジン、アニリン、ジメトキシアニリン、酢酸アンモニウム、β－アラニン等のアミン化合物（好ましくはトリエチルアミン、ジイソプロピルエチルアミン等の３級アミン）；リチウムジイソプロピルアミド、ナトリウムアミド、カリウムヘキサメチルジシラジド等の金属アミド化合物（好ましくはアルカリ金属アミド）；水酸化トリメチルスルホニウム等のスルホニウム化合物；水酸化ジフェニルヨードニウム等のヨードニウム化合物；フォスファゼン塩基等が挙げられる。
　塩基の使用量としては、化合物（Ｍ－１）１モルに対して、通常０．１～１０モルであり、０．５～５モルであることが好ましい。 Examples of the base include metal hydroxides such as sodium hydroxide, lithium hydroxide, potassium hydroxide, cesium hydroxide, rubicium hydroxide, calcium hydroxide, barium hydroxide, and magnesium hydroxide (preferably alkali metal hydroxides). Metal amides such as sodium methoxyd, potassium methoxyd, lithium methoxyd, sodium ethoxydo, sodium isopropoxide, sodium tertiary butoxide, potassium tertiary butoxide (preferably alkali metal amides); lithium hydride, sodium hydride , Metal hydrides such as potassium hydride, lithium aluminum hydride, sodium boron hydride, aluminum hydride, sodium aluminum hydride; metal oxides such as calcium oxide and magnesium oxide; sodium hydrogen carbonate, sodium carbonate, potassium carbonate, etc. Metal carbonates (preferably alkaline earth metal carbonates); organic alkyl metal compounds such as normal butyl lithium, tertiary butyl lithium, methyl lithium, glignal reagents; ammonia, triethylamine, diisopropylethylamine, ethanolamine, pyrrolidine, piperidine, Amin compounds such as diazabicycloundecene, diazabicyclononen, guanidine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyridine, aniline, dimethoxyaniline, ammonium acetate, β-alanine (preferably triethylamine, diisopropylethylamine, etc.) Tertiary amine); metal amide compounds such as lithium diisopropylamide, sodium amide, potassium hexamethyldisilazide (preferably alkali metal amides); sulfonium compounds such as trimethylsulfonium hydroxide; iodonium compounds such as diphenyliodonium hydroxide; phosphazene Examples include bases.
The amount of the base used is usually 0.1 to 10 mol and preferably 0.5 to 5 mol with respect to 1 mol of the compound (M-1).
　メチル化剤としては、ヨードメタン、硫酸ジメチル、メタンスルホン酸メチル、フルオロスルホン酸メチル、パラトルエンスルホン酸メチル、トリフルオロメタンスルホン酸メチル、トリメチルオキソニウムテトラフルオロボレート等が挙げられる。
　メチル化剤の使用量としては、化合物（Ｍ－１）１モルに対して、通常０．１～１０モルであり、０．５～５モルであることが好ましい。 Examples of the methylating agent include iodomethane, dimethyl sulfate, methyl methanesulfonate, methyl fluorosulfonate, methyl paratoluenesulfonate, methyl trifluoromethanesulfonate, trimethyloxonium tetrafluoroborate and the like.
The amount of the methylating agent used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, based on 1 mol of compound (M-1).
　化合物（Ｍ－１）と化合物（Ｍ－２）との反応は、溶媒の存在下で行ってもよい。溶媒としては、アセトニトリル、ベンゼン、トルエン、アセトン、酢酸エチル、クロロホルム、ジクロロエタン、モノクロロベンゼン、メタノール、エタノール、イソプロパノール、ｔｅｒｔ－ブタノール、２－ブタノン、テトラヒドロフラン、ジエチルエーテル、ジメチルスルホキシド、Ｎ，Ｎ－ジメチルアセトアミド、Ｎ，Ｎ－ジメチルホルムアミド、水等が挙げられる。好ましくはアセトニトリル、テトラヒドロフラン、クロロホルム、ジクロロメタン、ジエチルエーテルであり、より好ましくはアセトニトリル、テトラヒドロフラン、クロロホルムであり、さらに好ましくはアセトニトリルである。
　また、溶媒は脱水溶媒であることが好ましい。 The reaction between compound (M-1) and compound (M-2) may be carried out in the presence of a solvent. Solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N, N-dimethylacetamide. , N, N-dimethylformamide, water and the like. Acetonitrile, tetrahydrofuran, chloroform, dichloromethane and diethyl ether are preferable, acetonitrile, tetrahydrofuran and chloroform are more preferable, and acetonitrile is further preferable.
Moreover, the solvent is preferably a dehydration solvent.
　化合物（Ｍ－１）と化合物（Ｍ－２）との反応時間は、通常０．１～１０時間であり、好ましくは、０．２～３時間である。
　化合物（Ｍ－１）と化合物（Ｍ－２）との反応温度は、通常－５０～１５０℃であり、好ましくは－２０～１００℃である。
　化合物（Ｍ－２）の使用量は、化合物（Ｍ－１）１モルに対して、通常０．１～１０モルであり、０．５～５モルであることが好ましい。 The reaction time of the compound (M-1) and the compound (M-2) is usually 0.1 to 10 hours, preferably 0.2 to 3 hours.
The reaction temperature of the compound (M-1) and the compound (M-2) is usually −50 to 150 ° C., preferably −20 to 100 ° C.
The amount of the compound (M-2) to be used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, based on 1 mol of the compound (M-1).
　化合物（Ｍ－１）としては、以下に記載の化合物等が挙げられる。
Figure JPOXMLDOC01-appb-I000085
Examples of the compound (M-1) include the compounds described below.
Figure JPOXMLDOC01-appb-I000085
　化合物（Ｍ－２）としては、市販品を用いてもよく、例えば、マントニトリル等が挙げられる。 As the compound (M-2), a commercially available product may be used, and examples thereof include cloak nitrile.
　塩基の存在下で化合物（Ｍ－１）と化合物（Ｍ－２）とを反応させることで得られる化合物（Ｉ）は、通常、対カチオンとして塩基由来のカチオンを有する。化合物（Ｉ）のカチオンを所望のカチオンに交換したい場合は、化合物（Ｉ）と所望のカチオンを有する塩とを混合することによりイオン交換を行えばよい。前記イオン交換は、溶媒の存在下で行ってもよい。所望のカチオンを有する塩は、例えば、所望のカチオンと塩化物イオンとからなる塩化物塩、所望のカチオンと臭化物イオンとからなる臭化物塩、所望のカチオンとヨウ化物イオンとからなるヨウ化物塩、所望のカチオンとフッ化物イオンとからなるフッ化物塩、所望のカチオンと硝酸イオンとからなる硝酸塩、所望のカチオンと硫酸イオンとからなる硫酸塩、所望のカチオンと過塩素酸イオンとからなる過塩素酸塩、所望のカチオンとスルホン酸イオンとからなるスルホン酸塩、所望のカチオンとカルボン酸イオンとからなるカルボン酸塩、所望のカチオンと次亜塩素酸イオンとからなる次亜塩素酸塩、所望のカチオンとヘキサフルオロホスフェートとからなるヘキサフルオロホスフェート塩、所望のカチオンとイミドとからなるイミド塩等が挙げられる。 Compound (I) obtained by reacting compound (M-1) with compound (M-2) in the presence of a base usually has a base-derived cation as a counter cation. When it is desired to exchange the cation of compound (I) with a desired cation, ion exchange may be carried out by mixing the compound (I) with a salt having the desired cation. The ion exchange may be carried out in the presence of a solvent. The salt having a desired cation is, for example, a chloride salt composed of a desired cation and a chloride ion, a bromide salt composed of a desired cation and a bromide ion, an iodide salt composed of a desired cation and an iodide ion, and the like. A fluoride salt consisting of a desired cation and a fluoride ion, a nitrate consisting of a desired cation and a nitrate ion, a sulfate consisting of a desired cation and a sulfate ion, and a perchlorine composed of a desired cation and a perchlorate ion. Acid salt, sulfonate consisting of desired cation and sulfonate ion, carboxylate consisting of desired cation and carboxylic acid ion, hypochlorite consisting of desired cation and hypochlorite ion, desired Hexafluorophosphate salt composed of the above cation and hexafluorophosphate, imide salt composed of the desired cation and imide, and the like can be mentioned.
　化合物（Ｍ－１）は、式（Ｍ－３）で表される化合物（以下、化合物（Ｍ－３）という場合がある。）と式（Ｍ－４）で表される化合物（以下、化合物（Ｍ－４）という場合がある。）とを反応させて得ることができる。
Figure JPOXMLDOC01-appb-I000086
［式（Ｍ－３）中、環Ｗ１Ａ、Ｒ４及びＲ５は前記と同じ意味を表す。
　式（Ｍ－４）中、Ｒ３は前記と同じ意味を表し、Ｅ１は脱離基を表す。］ The compound (M-1) is a compound represented by the formula (M-3) (hereinafter, may be referred to as a compound (M-3)) and a compound represented by the formula (M-4) (hereinafter, a compound). It may be obtained by reacting with (M-4).
Figure JPOXMLDOC01-appb-I000086
[In formula (M-3), rings W 1A , R 4 and R 5 have the same meanings as described above.
In formula (M-4), R 3 represents the same meaning as described above, and E 1 represents a leaving group. ]
　Ｅ１で表される脱離基としては、ハロゲン原子、ｐ－トルエンスルホニル基、トリフルオロメチルスルホニル基等が挙げられる。 Examples of the leaving group represented by E 1 include a halogen atom, a p-toluenesulfonyl group, a trifluoromethylsulfonyl group and the like.
　化合物（Ｍ－３）と化合物（Ｍ－４）との反応は、化合物（Ｍ－３）と化合物（Ｍ－４）とを混合することにより実施される。
　化合物（Ｍ－４）の使用量は、化合物（Ｍ－３）１モルに対して通常０．１～５モルであり、０．５～２モルであることが好ましい。 The reaction between the compound (M-3) and the compound (M-4) is carried out by mixing the compound (M-3) and the compound (M-4).
The amount of the compound (M-4) to be used is usually 0.1 to 5 mol, preferably 0.5 to 2 mol, based on 1 mol of the compound (M-3).
　化合物（Ｍ－３）と化合物（Ｍ－４）との反応は、塩基の存在下で行うことが好ましい。
　塩基としては、ナトリウムメトキシド、カリウムメトキシド、リチウムメトキシド、ナトリウムエトキシド、ナトリウムイソプロポキシド、ナトリウムターシャリーブトキシド、カリウムターシャリーブトキシド等の金属アルコキシド（好ましくはアルカリ金属アルコキシド）等；水酸化リチウム、水酸化ナトリウム、水酸化カリウム等の金属水酸化物、水素化ナトリウム、水素化アルミニウムリチウム、水素化ホウ素ナトリウム等の金属水素化物；リチウムジイソプロピルアミド、ピリジン、トリエチルアミン、ジイソプロピルエチルアミン、ピペリジン、ピロリジン、プロリン等のアミン化合物が挙げられる。
　塩基の使用量としては、化合物（Ｍ－３）１モルに対して、通常０．１～１０モルであり、０．５～５モルであることが好ましい。 The reaction between compound (M-3) and compound (M-4) is preferably carried out in the presence of a base.
Examples of the base include metal alkoxides (preferably alkali metal alkoxides) such as sodium methoxyd, potassium methoxyd, lithium methoxyd, sodium ethoxydo, sodium isopropoxide, sodium tertiary butoxide, and potassium tertiary butoxide; lithium hydroxide. , Metal hydroxides such as sodium hydroxide and potassium hydroxide, metal hydrides such as sodium hydride, lithium aluminum hydride, sodium hydride; lithium diisopropylamide, pyridine, triethylamine, diisopropylethylamine, piperidine, pyrrolidine, proline Examples of amine compounds such as.
The amount of the base used is usually 0.1 to 10 mol and preferably 0.5 to 5 mol with respect to 1 mol of the compound (M-3).
　化合物（Ｍ－３）と化合物（Ｍ－４）との反応は、溶媒の存在下で行ってもよい。溶媒としては、アセトニトリル、ベンゼン、トルエン、アセトン、酢酸エチル、クロロホルム、ジクロロエタン、モノクロロベンゼン、メタノール、エタノール、イソプロパノール、ｔｅｒｔ－ブタノール、２－ブタノン、テトラヒドロフラン、ジエチルエーテル、ジメチルスルホキシド、Ｎ，Ｎ－ジメチルアセトアミド、Ｎ，Ｎ－ジメチルホルムアミド、水等が挙げられる。好ましくはアセトニトリル、テトラヒドロフラン、クロロホルム、ジクロロメタン、ジエチルエーテルであり、より好ましくはアセトニトリル、テトラヒドロフラン、クロロホルムであり、さらに好ましくはメタノール、エタノール、イソプロパノール、アセトニトリルである。
　化合物（Ｍ－３）と化合物（Ｍ－４）との反応時間は、通常０．１～１０時間である。
　化合物（Ｍ－３）と化合物（Ｍ－４）との反応温度は、通常－５０～１５０℃である。 The reaction between compound (M-3) and compound (M-4) may be carried out in the presence of a solvent. Solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N, N-dimethylacetamide. , N, N-dimethylformamide, water and the like. Acetonitrile, tetrahydrofuran, chloroform, dichloromethane and diethyl ether are preferable, acetonitrile, tetrahydrofuran and chloroform are more preferable, and methanol, ethanol, isopropanol and acetonitrile are more preferable.
The reaction time of compound (M-3) and compound (M-4) is usually 0.1 to 10 hours.
The reaction temperature of the compound (M-3) and the compound (M-4) is usually −50 to 150 ° C.
　化合物（Ｍ－３）としては、以下に記載の化合物等が挙げられる。
Figure JPOXMLDOC01-appb-I000087
Examples of the compound (M-3) include the compounds described below.
Figure JPOXMLDOC01-appb-I000087
　化合物（Ｍ－４）としては、市販品を用いてもよい。例えば、クロロシアン、ブロモシアン、パラトルエンスルホニルシアニド、トリフルオロメタンスルホニルシアニド、１－クロロメチル－４－フルオロ－１，４－ジアゾニアビシクロ［２．２．２］オクタン　ビス（テトラフルオロボラート（セレクトフロアー（Air Products and Chemicalsの登録商標）ともいう）、ベンゾイル（フェニルヨードニオ）（トリフルオロメタンスルホニル）メタニド、２，８－ジフルオロ－５－（トリフルオロメチル)－５Ｈ－ジベンゾ［ｂ，ｄ］チオフェン－５－イウムトリフルオロメタンスルホナート、Ｎ－ブロモスクシンイミド、Ｎ－クロロスクシンイミド、Ｎ－ヨードスクシンイミド等が挙げられる。 As the compound (M-4), a commercially available product may be used. For example, chlorocyan, bromocyan, paratoluenesulfonyl cyanide, trifluoromethanesulfonylocyanide, 1-chloromethyl-4-fluoro-1,4-diazoniabicyclo [2.2.2] octane bis (tetrafluoroborate (tetrafluoroborate) Select Floor (also known as Air Products and Chemicals), Benzoyl (phenyliodonio) (trifluoromethanesulfonyl) metanide, 2,8-difluoro-5- (trifluoromethyl) -5H-dibenzo [b, d] Examples thereof include thiophen-5-ium trifluoromethanesulfonate, N-bromosuccinimide, N-chlorosuccinimide, N-iodosuccinimide and the like.
　化合物（Ｍ－３）は、式（Ｍ－５）で表される化合物（以下、化合物（Ｍ－５）という場合がある。）と化合物（Ｍ－２ａ）とを反応させることで得ることができる。
Figure JPOXMLDOC01-appb-I000088
［式（Ｍ－５）中、環Ｗ１Ａ、Ｒ４及びＲ５は前記と同じ意味を表す。］ Compound (M-3) can be obtained by reacting a compound represented by the formula (M-5) (hereinafter, may be referred to as compound (M-5)) with compound (M-2a). can.
Figure JPOXMLDOC01-appb-I000088
[In the formula (M-5), rings W 1A , R 4 and R 5 have the same meanings as described above. ]
　化合物（Ｍ－５）と化合物（Ｍ－２ａ）との反応は、化合物（Ｍ－５）と化合物（Ｍ－２ａ）とを混合することにより実施することができる。
　化合物（Ｍ－５）と化合物（Ｍ－２ａ）との反応は、塩基の存在下で行うことが好ましい。塩基としては、化合物（Ｍ－１）と化合物（Ｍ－２）との反応に用いられる塩基と同じものが挙げられる。塩基の使用量は、化合物（Ｍ－５）１モルに対して通常０．１～５モルであり、０．５～２モルであることが好ましい。
　化合物（Ｍ－５）と化合物（Ｍ－２ａ）との反応は、溶媒の存在下で行ってもよい。溶媒とは、メタノール、エタノール、イソプロパノール、トルエン、アセトニトリルであることが好ましい。
　化合物（Ｍ－５）と化合物（Ｍ－２ａ）との反応時間は、通常０．１～１０時間である。
　化合物（Ｍ－５）と化合物（Ｍ－２ａ）との反応温度は、通常－５０～１５０℃である。
　化合物（Ｍ－２ａ）の使用量は、化合物（Ｍ－５）１モルに対して通常０．１～１０モルであり、０．５～２モルであることが好ましい。 The reaction between the compound (M-5) and the compound (M-2a) can be carried out by mixing the compound (M-5) and the compound (M-2a).
The reaction between compound (M-5) and compound (M-2a) is preferably carried out in the presence of a base. Examples of the base include the same bases used in the reaction between the compound (M-1) and the compound (M-2). The amount of the base used is usually 0.1 to 5 mol, preferably 0.5 to 2 mol, based on 1 mol of the compound (M-5).
The reaction between compound (M-5) and compound (M-2a) may be carried out in the presence of a solvent. The solvent is preferably methanol, ethanol, isopropanol, toluene, or acetonitrile.
The reaction time of compound (M-5) and compound (M-2a) is usually 0.1 to 10 hours.
The reaction temperature of compound (M-5) and compound (M-2a) is usually −50 to 150 ° C.
The amount of the compound (M-2a) to be used is usually 0.1 to 10 mol, preferably 0.5 to 2 mol, based on 1 mol of the compound (M-5).
　化合物（Ｍ－５）としては、下記に記載の化合物等が挙げられる。
Figure JPOXMLDOC01-appb-I000089
Examples of the compound (M-5) include the compounds described below.
Figure JPOXMLDOC01-appb-I000089
　化合物（Ｉ）において、Ｒ１及びＲ２の組み合わせと、Ｒ４及びＲ５の組み合わせとが同じである場合、化合物（Ｉ）は、式（Ｍ－６）で表される化合物（以下、化合物（Ｍ－６）という場合がある。）と化合物（Ｍ－２）とを反応させることで得ることもできる。
Figure JPOXMLDOC01-appb-I000090
［式（Ｍ－６）中、環Ｗ１Ａ及びＲ３は前記と同じ意味を表す。］ In compound (I), when the combination of R 1 and R 2 and the combination of R 4 and R 5 are the same, compound (I) is a compound represented by the formula (M-6) (hereinafter, compound). It can also be obtained by reacting (M-6) with the compound (M-2).
Figure JPOXMLDOC01-appb-I000090
[In the formula (M-6), the rings W 1A and R 3 have the same meanings as described above. ]
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応は、化合物（Ｍ－６）と化合物（Ｍ－２）とを混合することにより実施することができる。
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応は、塩基又はメチル化剤の存在下で実施することが好ましく、塩基及びメチルの存在下で実施することがより好ましい。
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応は、化合物（Ｍ－６）、化合物（Ｍ－２）、塩基及びメチル化剤を混合することがより好ましく、
　化合物（Ｍ－６）とメチル化剤との混合物に、化合物（Ｍ－２）と塩基とを混合することがさらに好ましい。 The reaction between compound (M-6) and compound (M-2) can be carried out by mixing compound (M-6) and compound (M-2).
The reaction between compound (M-6) and compound (M-2) is preferably carried out in the presence of a base or a methylating agent, more preferably in the presence of a base and methyl.
The reaction between compound (M-6) and compound (M-2) is more preferably a mixture of compound (M-6), compound (M-2), a base and a methylating agent.
It is more preferable to mix the compound (M-2) and the base with the mixture of the compound (M-6) and the methylating agent.
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応に用いられる塩基としては、化合物（Ｍ－１）と化合物（Ｍ－２）との反応に用いられる塩基と同じものが挙げられ、金属炭酸塩が好ましく、アルカリ土類金属炭酸塩がより好ましい。
　塩基の使用量としては、化合物（Ｍ－６）１モルに対して、通常０．１～５モルであり、０．５～２モルであることが好ましい。 Examples of the base used in the reaction between the compound (M-6) and the compound (M-2) include the same bases used in the reaction between the compound (M-1) and the compound (M-2). Metal carbonates are preferred, and alkaline earth metal carbonates are more preferred.
The amount of the base used is usually 0.1 to 5 mol and preferably 0.5 to 2 mol with respect to 1 mol of the compound (M-6).
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応に用いられるメチル化剤としては、化合物（Ｍ－１）と化合物（Ｍ－２）との反応に用いられるメチル化剤と同じものが挙げられ、ジメチル硫酸であることが好ましい。
　メチル化剤の使用量としては、化合物（Ｍ－６）１モルに対して、通常０．１～５モルであり、０．５～２モルであることが好ましい。 The methylating agent used in the reaction between the compound (M-6) and the compound (M-2) is the same as the methylating agent used in the reaction between the compound (M-1) and the compound (M-2). However, it is preferably dimethyl sulfate.
The amount of the methylating agent used is usually 0.1 to 5 mol and preferably 0.5 to 2 mol with respect to 1 mol of the compound (M-6).
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応は、溶媒の存在下で行ってもよい。溶媒としては、アセトニトリル、ベンゼン、トルエン、アセトン、酢酸エチル、クロロホルム、ジクロロエタン、モノクロロベンゼン、メタノール、エタノール、イソプロパノール、ｔｅｒｔ－ブタノール、２－ブタノン、テトラヒドロフラン、ジエチルエーテル、ジメチルスルホキシド、Ｎ，Ｎ－ジメチルアセトアミド、Ｎ，Ｎ－ジメチルホルムアミド、水等が挙げられる。好ましくはアセトニトリル、テトラヒドロフラン、クロロホルム、ジクロロメタン、ジエチルエーテルであり、より好ましくはアセトニトリル、テトラヒドロフラン、クロロホルムであり、さらに好ましくはアセトニトリルである。
　また、溶媒は脱水溶媒であることが好ましい。 The reaction between compound (M-6) and compound (M-2) may be carried out in the presence of a solvent. Solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N, N-dimethylacetamide. , N, N-dimethylformamide, water and the like. Acetonitrile, tetrahydrofuran, chloroform, dichloromethane and diethyl ether are preferable, acetonitrile, tetrahydrofuran and chloroform are more preferable, and acetonitrile is further preferable.
Moreover, the solvent is preferably a dehydration solvent.
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応時間は、通常０．１～１０時間であり、好ましくは、０．２～３時間である。
　化合物（Ｍ－６）と化合物（Ｍ－２）との反応温度は、通常－５０～１５０℃であり、好ましくは－２０～１００℃である。
　化合物（Ｍ－２）の使用量は、化合物（Ｍ－６）１モルに対して、通常０．１～１０モルであり、０．５～５モルであることが好ましい。 The reaction time of the compound (M-6) and the compound (M-2) is usually 0.1 to 10 hours, preferably 0.2 to 3 hours.
The reaction temperature of the compound (M-6) and the compound (M-2) is usually −50 to 150 ° C., preferably −20 to 100 ° C.
The amount of the compound (M-2) to be used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, based on 1 mol of the compound (M-6).
　化合物（Ｍ－６）としては、２－メチル－１，３－シクロヘキサンジオン等が挙げられる。 Examples of the compound (M-6) include 2-methyl-1,3-cyclohexanedione.
　化合物（Ｘ）の分子量は、好ましくは３０００以下であり、より好ましくは２０００以下であり、さらに好ましくは１０００以下である。また、好ましくは５０以上であり、より好ましくは１００以上であり、さらに好ましくは２００以上である。 The molecular weight of compound (X) is preferably 3000 or less, more preferably 2000 or less, and even more preferably 1000 or less. Further, it is preferably 50 or more, more preferably 100 or more, and further preferably 200 or more.
　化合物（Ｘ）は、波長４００～波長５５０ｎｍに極大吸収を示すことが好ましい。化合物（Ｘ）の極大吸収波長（λｍax）は好ましくは波長４１０～５００ｎｍであり、より好ましくは波長４２０～４８０ｎｍであり、さらに好ましくは波長４３０～４５０ｎｍである。 Compound (X) preferably exhibits maximum absorption at a wavelength of 400 to 550 nm. The maximum absorption wavelength (λmax) of compound (X) is preferably a wavelength of 410 to 500 nm, more preferably a wavelength of 420 to 480 nm, and even more preferably a wavelength of 430 to 450 nm.
　極大吸収波長（λmax）におけるグラム吸光係数εが０．５以上であることが好ましく、より好ましくは１．０以上、特に好ましくは１．５以上である。上限は特に制限されないが、一般的には１０以下である。
　化合物（Ｘ）のλmaxにおけるグラム吸光係数εが０．５以上であると、ブルーライトと呼ばれる光を効率よく吸収できる点から好ましい。 The gram absorption coefficient ε at the maximum absorption wavelength (λmax) is preferably 0.5 or more, more preferably 1.0 or more, and particularly preferably 1.5 or more. The upper limit is not particularly limited, but is generally 10 or less.
When the gram absorption coefficient ε at λmax of compound (X) is 0.5 or more, it is preferable from the viewpoint that light called blue light can be efficiently absorbed.
　化合物（Ｘ）は、下記式（ａ）を満たすことが好ましい。
　　ε（λｍａｘ）／ε（λｍａｘ＋３０ｎｍ）≧５　　（ａ）
［式中、ε（λｍａｘ）は、極大吸収波長（λｍａｘ）におけるグラム吸光係数を表す。
　ε（λｍａｘ＋３０ｎｍ）は、極大吸収波長（λｍａｘ）＋３０ｎｍの波長におけるグラム吸光係数を表す。
　なお、グラム吸光係数の単位は、グラム吸光係数の単位はＬ／（ｇ・ｃｍ）である。］
　化合物（Ｘ）は、ε（λmax）／ε（λmax＋３０ｎｍ）が５以上であることが好ましく、よく好ましくは１０以上、特に好ましくは２０以上である。上限は特に制限されないが、一般的には１０００以下である。
　ε（λmax）／ε（λmax＋３０ｎｍ）が５以上であると、化合物（Ｘ）を含む組成物の着色を最小限に抑えてブルーライトのみを選択的に吸収できる点から好ましい。特にディスプレイ等の色表示への影響抑制や色域拡大に寄与できるため好適である。 Compound (X) preferably satisfies the following formula (a).
ε (λ max ) / ε (λ max + 30 nm) ≧ 5 (a)
Wherein, epsilon (.lambda.max) represents the gram extinction coefficient at the maximum absorption wavelength (lambda max).
ε (λ max + 30 nm) represents the gram absorption coefficient at the maximum absorption wavelength (λ max) + 30 nm.
The unit of the gram extinction coefficient is L / (g · cm). ]
The compound (X) preferably has ε (λmax) / ε (λmax + 30 nm) of 5 or more, preferably 10 or more, and particularly preferably 20 or more. The upper limit is not particularly limited, but is generally 1000 or less.
When ε (λmax) / ε (λmax + 30 nm) is 5 or more, it is preferable because coloring of the composition containing the compound (X) can be minimized and only blue light can be selectively absorbed. In particular, it is suitable because it can contribute to suppressing the influence on the color display of a display or the like and expanding the color gamut.
　＜化合物（Ｘ）を含む組成物＞
　本発明は、化合物（Ｘ）（好ましくは化合物（Ｉ）～化合物（ＶＩＩＩ）のうちのいずれか）を含有する組成物も含む。
　本発明の化合物（Ｘ）（好ましくは化合物（Ｉ）～化合物（ＶＩＩＩ）のうちのいずれか）を含む組成物は、化合物（Ｘ）（好ましくは化合物（Ｉ）～化合物（ＶＩＩＩ）のうちのいずれか）と樹脂とを含む樹脂組成物であることが好ましい。 <Composition containing compound (X)>
The present invention also includes a composition containing compound (X) (preferably any one of compound (I) to compound (VIII)).
The composition containing the compound (X) of the present invention (preferably any one of the compounds (I) to (VIII)) is the compound (X) (preferably any of the compounds (I) to (VIII)). It is preferable that the resin composition contains any one) and a resin.
　上記組成物はあらゆる用途に使用可能であるが、中でも日光又は紫外線を含む光に晒される可能性のある用途に特に好適に使用できる。具体例としては、例えばガラス代替品とその表面コーティング材；住居、施設、輸送機器等の窓ガラス、採光ガラス及び光源保護ガラス用のコーティング材；住居、施設、輸送機器等のウインドウフィルム；住居、施設、輸送機器等の内外装材及び内外装用塗料及び該塗料によって形成させる塗膜；アルキド樹脂ラッカー塗料及び該塗料によって形成される塗膜；アクリルラッカー塗料及び該塗料によって形成される塗膜；蛍光灯、水銀灯等の紫外線を発する光源用部材；精密機械、電子電気機器用部材、各種ディスプレイから発生する電磁波等の遮断用材；食品、化学品、薬品等の容器又は包装材；ボトル、ボックス、ブリスター、カップ、特殊包装用、コンパクトディスクコート、農工業用シート又はフィルム材；印刷物、染色物、染顔料等の退色防止剤；ポリマー支持体用（例えば、機械及び自動車部品のようなプラスチック製部品用）の保護膜；印刷物オーバーコート；インクジェット媒体被膜；積層艶消し；オプティカルライトフィルム；安全ガラス／フロントガラス中間層；エレクトロクロミック／フォトクロミック用途；オーバーラミネートフィルム；太陽熱制御膜；日焼け止めクリーム、シャンプー、リンス、整髪料等の化粧品；スポーツウェア、ストッキング、帽子等の衣料用繊維製品及び繊維；カーテン、絨毯、壁紙等の家庭用内装品；プラスチックレンズ、コンタクトレンズ、義眼等の医療用器具；光学フィルタ、バックライトディスプレーフィルム、プリズム、鏡、写真材料等の光学用品；金型膜、転写式ステッカー、落書き防止膜、テープ、インク等の文房具；標示板、標示器等とその表面コーティング材等を挙げることができる。 The above composition can be used for all purposes, but it can be particularly preferably used for applications that may be exposed to light including sunlight or ultraviolet rays. Specific examples include, for example, glass substitutes and their surface coating materials; window glass for dwellings, facilities, transportation equipment, etc., coating materials for light-collecting glass and light source protection glass; window films for dwellings, facilities, transportation equipment, etc .; dwellings, Interior / exterior materials and interior / exterior paints for facilities, transportation equipment, etc. and coatings formed by the coatings; alkyd resin lacquer coatings and coatings formed by the coatings; acrylic lacquer coatings and coatings formed by the coatings; fluorescence Materials for light sources that emit ultraviolet rays such as lamps and mercury lamps; Materials for precision machinery, electronic and electrical equipment, materials for blocking electromagnetic waves generated from various displays; Containers or packaging materials for foods, chemicals, chemicals, etc .; Bottles, boxes, blister , Cups, special packaging, compact disc coats, agricultural and industrial sheets or film materials; anti-fading agents for printed matter, dyes, dyes, etc .; for polymer supports (eg, for plastic parts such as machine and automotive parts) ) Protective film; Printed matter overcoat; Inkjet medium coating; Laminated matte; Optical light film; Safety glass / front glass intermediate layer; Electrochromic / Photochromic applications; Overlaminated film; Solar heat control film; Sunscreen cream, shampoo, rinse , Cosmetics such as hairdressers; Textile products and textiles for clothing such as sportswear, stockings and hats; Household interiors such as curtains, rugs and wallpaper; Medical instruments such as plastic lenses, contact lenses and artificial eyes; Optical filters, Optical supplies such as backlight display films, prisms, mirrors, photographic materials; stationery such as mold films, transfer stickers, anti-doodle films, tapes, inks; marking boards, marking devices, etc. and their surface coating materials, etc. Can be done.
　上記組成物を成形してなる成形物は、高分子成型品であることが好ましい。成形物の形状は、平膜状、粉状、球状粒子状、破砕粒子状、塊状連続体、繊維状、管状、中空糸状、粒状、板状、多孔質状などのいずれの形状であってもよい。 The molded product obtained by molding the above composition is preferably a polymer molded product. The shape of the molded product may be flat film-like, powder-like, spherical particle-like, crushed particle-like, massive continuous body, fibrous, tubular, hollow thread-like, granular, plate-like, or porous. good.
　上記組成物が樹脂組成物である場合、樹脂組成物に用いられる樹脂としては、公知の各種成形体、シート、フィルム等の製造に従来から使用されている熱可塑性樹脂及び熱硬化性樹脂等が挙げられる。
　熱可塑性樹脂としては、例えば、ポリエチレン樹脂、ポリプロピレン樹脂、ポリシクロオレフィン樹脂等のオレフィン系樹脂、ポリ（メタ）アクリル酸エステル系樹脂、ポリスチレン系樹脂、スチレン－アクリロニトリル系樹脂、アクリロニトリル－ブタジエン－スチレン系樹脂、ポリ塩化ビニル系樹脂、ポリ塩化ビニリデン系樹脂、ポリ酢酸ビニル系樹脂、ポリビニルブチラール系樹脂、エチレン－酢酸ビニル系共重合体、エチレン－ビニルアルコール系樹脂、ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、液晶ポリエステル樹脂等のポリエステル系樹脂、ポリアセタール樹脂、ポリアミド樹脂、ポリカーボネート樹脂、ポリウレタン樹脂及びポリフェニレンサルファイド樹脂等が挙げられる。これらの樹脂の一種を又は二種以上をポリマーブレンドあるいはポリマーアロイとして使用してもよい。 When the above composition is a resin composition, the resin used in the resin composition includes thermoplastic resins, thermosetting resins and the like conventionally used in the production of various known molded products, sheets, films and the like. Can be mentioned.
Examples of the thermoplastic resin include olefin resins such as polyethylene resins, polypropylene resins, and polycycloolefin resins, poly (meth) acrylic acid ester resins, polystyrene resins, styrene-acrylonitrile resins, and acrylonitrile-butadiene-styrene resins. Resin, polyvinyl chloride resin, vinylidene chloride resin, vinyl acetate resin, polyvinyl butyral resin, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol resin, polyethylene terephthalate resin, polybutylene terephthalate resin, Examples thereof include polyester resins such as liquid crystal polyester resins, polyacetal resins, polyamide resins, polycarbonate resins, polyurethane resins and polyphenylene sulfide resins. One or more of these resins may be used as a polymer blend or polymer alloy.
　熱硬化性樹脂としては、例えば、エポキシ樹脂、メラミン樹脂、不飽和ポリエステル樹脂、フェノール樹脂、尿素樹脂、アルキド樹脂、熱硬化性ポリイミド樹脂等が挙げられる。 Examples of the thermosetting resin include epoxy resin, melamine resin, unsaturated polyester resin, phenol resin, urea resin, alkyd resin, and thermosetting polyimide resin.
　上記樹脂組成物を紫外線吸収フィルタや紫外線吸収膜として用いる場合、樹脂は透明樹脂であることが好ましい。 When the above resin composition is used as an ultraviolet absorbing filter or an ultraviolet absorbing film, the resin is preferably a transparent resin.
　上記樹脂組成物は、化合物（Ｘ）と樹脂とを混合することにより得ることができる。化合物（Ｘ）は、所望の性能を付与するために必要な量を含有すればよく、例えば、樹脂１００質量部に対して０．００００１～９９質量部等含有することができる。
　本発明の組成物は、必要に応じて、溶剤、架橋触媒、タッキファイヤー、可塑剤、軟化剤、染料、顔料、無機フィラー等その他添加物を含んでいてもよい。 The resin composition can be obtained by mixing compound (X) and a resin. The compound (X) may be contained in an amount necessary for imparting desired performance, for example, 0.00001 to 99 parts by mass with respect to 100 parts by mass of the resin.
The composition of the present invention may contain other additives such as a solvent, a cross-linking catalyst, a tack fire, a plasticizer, a softener, a dye, a pigment, and an inorganic filler, if necessary.
　＜眼鏡レンズ用組成物＞
　上記組成物及び上記樹脂組成物は、眼鏡レンズ用組成物であってもよい。眼鏡レンズ用組成物を用いて成型等することにより眼鏡レンズを形成することができる。眼鏡レンズ用組成物の成型方法は、射出成型であってもよいし、注型重合成型であってもよい。なお、注型重合成型とは、主にモノマー又はオリゴマー樹脂からなる眼鏡レンズ用組成物をレンズモールドに注入し、熱又は光によって眼鏡レンズ用組成物を硬化してレンズに成型する方法である。
　眼鏡レンズ用組成物は、その成型方法に合わせて適した組成にすればよい。例えば、射出成型により眼鏡レンズを形成する場合は、樹脂と化合物（Ｘ）とを含む眼鏡レンズ用樹脂組成物であってもよい。また、注型重合成型により眼鏡レンズを形成する場合は、熱又は光により硬化する硬化性モノマーと化合物（Ｘ）とを含む眼鏡レンズ用組成物であってもよい。 <Composition for spectacle lenses>
The composition and the resin composition may be compositions for spectacle lenses. A spectacle lens can be formed by molding or the like using a composition for a spectacle lens. The molding method of the composition for an spectacle lens may be injection molding or cast polymerization molding. The casting polymerization molding is a method in which a composition for a spectacle lens mainly composed of a monomer or an oligomer resin is injected into a lens mold, and the composition for a spectacle lens is cured by heat or light to be molded into a lens.
The composition for an spectacle lens may have a composition suitable for the molding method. For example, when a spectacle lens is formed by injection molding, a resin composition for a spectacle lens containing a resin and a compound (X) may be used. When the spectacle lens is formed by casting polymerization molding, it may be a composition for spectacle lenses containing a curable monomer that is cured by heat or light and compound (X).
　眼鏡レンズ用組成物に含まれる樹脂としては上記した樹脂が挙げられ、透明樹脂であることが好ましい。眼鏡レンズ用組成物に含まれる樹脂は、ポリ（メタ）アクリル酸エステル系樹脂、ポリカーボネート樹脂、ポリアミド樹脂、ポリウレタン樹脂、及びポリチオウレタン樹脂のうちの一種を又は二種以上をポリマーブレンドあるいはポリマーアロイとして使用することが好ましい。また、ポリマーのみではなくモノマー成分を含んでいてもよい。 Examples of the resin contained in the composition for spectacle lenses include the above-mentioned resins, and a transparent resin is preferable. The resin contained in the composition for spectacle lenses is a polymer blend or polymer alloy of one or more of poly (meth) acrylic acid ester resin, polycarbonate resin, polyamide resin, polyurethane resin, and polythiourethane resin. It is preferable to use as. Moreover, it may contain not only a polymer but also a monomer component.
　眼鏡用レンズ組成物は、硬化性モノマーと化合物（Ｘ）とを含む組成物であってもよい。硬化性モノマーは２種以上含んでいてもよい。具体的には、ポリオール化合物及びイソシアネート化合物の混合物、チオール化合物及びイソシアネート化合物の混合物であってもよく、チオール化合物及びイソシアネートの混合物であることが好ましく、多官能チオール化合物及び多官能イソシアネート化合物の混合物であることがより好ましい。 The lens composition for spectacles may be a composition containing a curable monomer and compound (X). The curable monomer may contain two or more kinds. Specifically, it may be a mixture of a polyol compound and an isocyanate compound, a mixture of a thiol compound and an isocyanate compound, preferably a mixture of a thiol compound and an isocyanate, and a mixture of a polyfunctional thiol compound and a polyfunctional isocyanate compound. More preferably.
　チオール化合物は、分子内に少なくとも１つのチオール基を有する化合物であれば、特に限定されない。鎖状であっても環状であってもよい。また、分子内に、スルフィド結合、ポリスルフィド結合、さらには他の官能基を有していてもよい。具体的なチオール化合物としては、脂肪族ポリチオール化合物、芳香族ポリチオール化合物、チオール基含有環状化合物、チオール基含有スルフィド化合物等の特開２００４－３１５５５６号公報に記載の１分子中にチオール基を１個以上有するチオール基含有有機化合物が挙げられる。これらのうち、レンズの屈折率及びガラス転移温度が向上する点で、チオール基を２個以上有する多官能チオール化合物が好ましく、チオール基を２個以上有する脂肪族ポリチオール化合物、チオール基を２個以上含有するスルフィド化合物がより好ましく、ビス（メルカプトメチル）スルフィド、１，２－ビス［（２－メルカプトエチル）チオ］－３－メルカプトプロパン、ペンタエリスリトールテトラキスチオプロピオネート、４，８－ジメルカプトメチル－１，１１－メルカプト－３，６，９－トリチアウンデカンがさらに好ましい。また、前記チオール系化合物は単独で用いても２種以上を併用してもよい。 The thiol compound is not particularly limited as long as it is a compound having at least one thiol group in the molecule. It may be chain-shaped or cyclic. In addition, the molecule may have a sulfide bond, a polysulfide bond, or another functional group. Specific examples of the thiol compound include one thiol group in one molecule described in JP-A-2004-315556, such as an aliphatic polythiol compound, an aromatic polythiol compound, a thiol group-containing cyclic compound, and a thiol group-containing sulfide compound. Examples thereof include thiol group-containing organic compounds having the above. Of these, a polyfunctional thiol compound having two or more thiol groups is preferable, and an aliphatic polythiol compound having two or more thiol groups and two or more thiol groups are preferable in terms of improving the refractive index of the lens and the glass transition temperature. The sulfide compound contained is more preferable, bis (mercaptomethyl) sulfide, 1,2-bis [(2-mercaptoethyl) thio] -3-mercaptopropane, pentaerythritol tetraxthiopropionate, 4,8-dimercaptomethyl. -1,11-Mercapto-3,6,9-Trithiaundecane is more preferred. Further, the thiol compound may be used alone or in combination of two or more.
　イソシアネート化合物としては、分子内に少なくとも２個のイソシアナト基（－ＮＣＯ）を有する多官能イソシアネート化合物が好ましく、例えば、脂肪族イソシアネート系化合物（例えばヘキサメチレンジイソシアネート等）、脂環族イソシアネート系化合物（例えばイソホロンジイソシアネート、水添ジフェニルメタンジイソシアネート、水添キシリレンジイソシアネート）、芳香族イソシアネート系化合物（例えばトリレンジイソシアネート、キシリレンジイソシアネート、ジフェニルメタンジイソシアネート、ナフタレンジイソシアネート、トリフェニルメタントリイソシアネート等）等が挙げられる。また、前記イソシアネート化合物の多価アルコール化合物による付加体（アダクト体）［例えば、グリセロール、トリメチロールプロパン等による付加体］、イソシアヌレート化物、ビュレット型化合物、ポリエーテルポリオール、ポリエステルポリオール、アクリルポリオール、ポリブタジエンポリオール、ポリイソプレンポリオール等と付加反応させたウレタンプレポリマー型のイソシアネート化合物等の誘導体であってもよい。 The isocyanate compound is preferably a polyfunctional isocyanate compound having at least two isocyanato groups (-NCO) in the molecule, for example, an aliphatic isocyanate compound (for example, hexamethylene diisocyanate) or an alicyclic isocyanate compound (for example). Examples thereof include isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate), aromatic isocyanate compounds (for example, tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, naphthalenedi isocyanate, triphenylmethane triisocyanate, etc.). Further, an adduct (adduct) of the isocyanate compound made of a polyhydric alcohol compound [for example, an adduct made of glycerol, trimethylolpropane, etc.], an isocyanurate, a bullet-type compound, a polyether polyol, a polyester polyol, an acrylic polyol, and a polybutadiene. It may be a derivative such as a urethane prepolymer type isocyanate compound which has been subjected to an addition reaction with a polyol, a polyisoprene polyol, or the like.
　眼鏡用レンズ組成物が硬化性モノマーを含む場合、硬化性を向上するために硬化触媒を含んでいてもよい。硬化触媒としては、ジブチル錫クロライド等の錫化合物や、特開２００４－３１５５５６号公報に記載のアミン類、ホスフィン類、第４級アンモニウム塩類、第４級ホスホニウム塩類、第３級スルホニウム塩類、第２級ヨードニウム塩類、鉱酸類、ルイス酸類、有機酸類、ケイ酸類、四フッ化ホウ酸類、過酸化物、アゾ系合物、アルデヒドとアンモニア系化合物の縮合物、グアニジン類、チオ尿素類、チアゾール類、スルフェンアミド類、チウラム類、ジチオカルバミン酸塩類、キサントゲン酸塩類、酸性リン酸エステル類等が挙げられる。これらの硬化触媒は単独で用いても２種以上を併用してもよい。 When the lens composition for spectacles contains a curable monomer, a curing catalyst may be contained in order to improve the curability. Examples of the curing catalyst include tin compounds such as dibutyltin chloride, amines, phosphins, quaternary ammonium salts, quaternary phosphonium salts, tertiary sulfonium salts, and secondary compounds described in JP-A-2004-315556. Class iodonium salts, mineral acids, Lewis acids, organic acids, silicic acids, boric acids tetrafluoride, peroxides, azo compounds, condensates of aldehydes and ammonia compounds, guanidines, thioureas, thiazoles, Examples thereof include sulfenamides, thiurams, dithiocarbamates, xanthogenates, acidic phosphoric acid esters and the like. These curing catalysts may be used alone or in combination of two or more.
　眼鏡レンズ用組成物中の化合物（Ｘ）の含有量は、眼鏡レンズ用組成物が樹脂組成物である場合、例えば樹脂１００質量部に対して０．０１～２０質量部含有することができる。また、眼鏡レンズ組成物が硬化性組成物である場合、例えば、化合物（Ｘ）の含有量は、硬化性成分１００質量部に対して０．００００１～２０質量部含有することができる。化合物（Ｘ）の含有量は、樹脂又は硬化性成分１００質量部に対して、好ましくは０．０００１～１５質量部であり、より好ましくは０．００１～１０質量部であり、さらに好ましくは０．０１～５質量であり、特に好ましくは０．１～３質量部である。
　硬化触媒の添加量は眼鏡用レンズ組成物１００質量％に対して０．０００１～１０．０質量％であることが好ましく、０．００１～５．０質量％であることがより好ましい。
　眼鏡レンズ用組成物には、その他添加剤が含まれていてもよい。 When the composition for spectacle lenses is a resin composition, the content of the compound (X) in the composition for spectacle lenses can be, for example, 0.01 to 20 parts by mass with respect to 100 parts by mass of the resin. When the spectacle lens composition is a curable composition, for example, the content of the compound (X) can be 0.00001 to 20 parts by mass with respect to 100 parts by mass of the curable component. The content of the compound (X) is preferably 0.0001 to 15 parts by mass, more preferably 0.001 to 10 parts by mass, and further preferably 0 with respect to 100 parts by mass of the resin or the curable component. It is 0.01 to 5 parts by mass, and particularly preferably 0.1 to 3 parts by mass.
The amount of the curing catalyst added is preferably 0.0001 to 10.0% by mass, more preferably 0.001 to 5.0% by mass, based on 100% by mass of the spectacle lens composition.
The composition for spectacle lenses may contain other additives.
　本発明の組成物を光学フィルタ等の光学用品に用いる場合、例えば、光学表示装置に適用することができる。上記樹脂組成物を光学表示装置に適用する場合、上記樹脂組成物から形成される層は、フィルム層、粘着剤層、コート層等のいずれであってもよく、粘着剤層、コート層であることが好ましい。 When the composition of the present invention is used for optical products such as an optical filter, it can be applied to, for example, an optical display device. When the resin composition is applied to an optical display device, the layer formed from the resin composition may be any of a film layer, an adhesive layer, a coat layer and the like, and is an adhesive layer and a coat layer. Is preferable.
　＜粘着剤組成物＞
　本発明の組成物から形成される層が粘着剤層である場合、粘着剤層は、樹脂（Ａ）、化合物（Ｘ）、架橋剤（Ｂ）及びシラン化合物（Ｃ）を含む粘着剤組成物（以下、粘着剤組成物（ｉ）という場合がある。）から形成される。粘着剤組成物（ｉ）は、さらに、ラジカル硬化性成分（Ｄ）、開始剤（Ｅ）、化合物（Ｘ）以外の光吸収化合物（Ｆ）（以下、光選択吸収化合物（Ｆ）という場合がある。）、帯電防止剤等を含んでいてもよく、ラジカル硬化性成分（Ｄ）、開始剤（Ｅ）及び光選択吸収化合物（Ｆ）からなる群から選ばれる少なくとも１つを含むことが好ましい。 <Adhesive composition>
When the layer formed from the composition of the present invention is a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is a pressure-sensitive adhesive composition containing a resin (A), a compound (X), a cross-linking agent (B) and a silane compound (C). (Hereinafter, it may be referred to as the pressure-sensitive adhesive composition (i).). The pressure-sensitive adhesive composition (i) may be further referred to as a light-absorbing compound (F) other than the radical-curable component (D), the initiator (E), and the compound (X) (hereinafter, the light-selective absorbing compound (F)). It may contain an antistatic agent or the like, and preferably contains at least one selected from the group consisting of a radical curable component (D), an initiator (E) and a light selective absorption compound (F). ..
　樹脂（Ａ）は、粘着剤組成物に使用される樹脂であれば特に限定されない。樹脂（Ａ）は、波長３００ｎｍ～波長７８０ｎｍの範囲において極大吸収を示さないことが好ましい。
　樹脂（Ａ）は、ガラス転移温度（Ｔｇ）が４０℃以下である樹脂であることが好ましい。樹脂（Ａ）のガラス転移温度（Ｔｇ）は、２０℃以下であることがより好ましく、１０℃以下であることがさらに好ましく、０℃以下であることが特に好ましい。また、樹脂（Ａ）のガラス転移温度は通常－８０℃以上であり、－７０℃以上であることが好ましく、－６０℃以上であることがより好ましく、－５５℃以上であることがさらに好ましく、－５０℃以上であることが特に好ましい。樹脂（Ａ）のガラス転移温度が４０℃以下であると、粘着剤組成物（ｉ）から形成される粘着剤層の被着体に対する密着性の向上に有利である。また、樹脂（Ａ）のガラス転移温度が－８０℃以上であると、粘着剤組成物（ｉ）から形成される粘着剤層の耐久性の向上に有利である。なお、ガラス転移温度は示差走査熱量計（ＤＳＣ）により測定できる。 The resin (A) is not particularly limited as long as it is a resin used in the pressure-sensitive adhesive composition. The resin (A) preferably does not exhibit maximum absorption in the wavelength range of 300 nm to 780 nm.
The resin (A) is preferably a resin having a glass transition temperature (Tg) of 40 ° C. or lower. The glass transition temperature (Tg) of the resin (A) is more preferably 20 ° C. or lower, further preferably 10 ° C. or lower, and particularly preferably 0 ° C. or lower. The glass transition temperature of the resin (A) is usually −80 ° C. or higher, preferably −70 ° C. or higher, more preferably −60 ° C. or higher, and even more preferably −55 ° C. or higher. , -50 ° C or higher is particularly preferable. When the glass transition temperature of the resin (A) is 40 ° C. or lower, it is advantageous to improve the adhesion of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (i) to the adherend. Further, when the glass transition temperature of the resin (A) is −80 ° C. or higher, it is advantageous to improve the durability of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (i). The glass transition temperature can be measured by a differential scanning calorimeter (DSC).
　樹脂（Ａ）としては、（メタ）アクリル系樹脂、シリコーン系樹脂、ゴム系樹脂、ウレタン系樹脂等が挙げられ、（メタ）アクリル系樹脂であることが好ましい。 Examples of the resin (A) include (meth) acrylic resin, silicone resin, rubber resin, urethane resin and the like, and (meth) acrylic resin is preferable.
　（メタ）アクリル系樹脂としては、（メタ）アクリル酸エステル由来の構成単位を主成分（好ましくは５０質量％以上含む）とする重合体であることが好ましい。（メタ）アクリル酸エステルに由来する構造単位は、一種以上の（メタ）アクリル酸エステル以外の単量体に由来する構造単位（例えば、水酸基、カルボキシル基、アミノ基等の極性官能基を有する単量体に由来する構造単位）を含んでもよい。 The (meth) acrylic resin is preferably a polymer containing a constituent unit derived from the (meth) acrylic acid ester as a main component (preferably containing 50% by mass or more). The structural unit derived from the (meth) acrylic acid ester is a simple structural unit derived from a monomer other than one or more (meth) acrylic acid esters (for example, having a polar functional group such as a hydroxyl group, a carboxyl group, or an amino group). A structural unit derived from a monomer) may be included.
　樹脂（Ａ）の含有量は、粘着剤組成物（ｉ）の固形分１００質量％中、通常５０質量％～９９．９質量％であり、好ましくは６０質量％～９５質量％であり、より好ましくは７０質量％～９０質量％である。
　化合物（Ｘ）の含有量は、樹脂（Ａ）１００質量部に対して、通常０．０１～２０質量部であり、好ましくは０．１～２０質量部であり、より好ましくは０．２～１０質量部であり、特に好ましくは０．５～５質量部である。 The content of the resin (A) is usually 50% by mass to 99.9% by mass, preferably 60% by mass to 95% by mass, based on 100% by mass of the solid content of the pressure-sensitive adhesive composition (i). It is preferably 70% by mass to 90% by mass.
The content of the compound (X) is usually 0.01 to 20 parts by mass, preferably 0.1 to 20 parts by mass, and more preferably 0.2 to 0.2 parts by mass with respect to 100 parts by mass of the resin (A). It is 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass.
　架橋剤（Ｂ）としては、イソシアネート系架橋剤、エポキシ系架橋剤、アジリジン系架橋剤、金属キレート系架橋剤等が挙げられ、特に粘着剤組成物（ｉ）のポットライフ及び粘着剤層の耐久性、架橋速度などの観点から、イソシアネート系架橋剤であることが好ましい。
　架橋剤（Ｂ）の含有量は、樹脂（Ａ）１００質量部に対して、通常０．０１～２５質量部であり、好ましくは０．１～１５質量部であり、より好ましくは０．１５～７質量部であり、さらに好ましくは０．２～５質量部であり、特に好ましくは０．２５～２質量部である。 Examples of the cross-linking agent (B) include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, aziridine-based cross-linking agents, metal chelate-based cross-linking agents, and the like, and in particular, the pot life of the pressure-sensitive adhesive composition (i) and the durability of the pressure-sensitive adhesive layer. From the viewpoint of properties, cross-linking rate and the like, an isocyanate-based cross-linking agent is preferable.
The content of the cross-linking agent (B) is usually 0.01 to 25 parts by mass, preferably 0.1 to 15 parts by mass, and more preferably 0.15 parts by mass with respect to 100 parts by mass of the resin (A). It is ~ 7 parts by mass, more preferably 0.2 to 5 parts by mass, and particularly preferably 0.25 to 2 parts by mass.
　シラン化合物（Ｃ）としては、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリス（２－メトキシエトキシ）シラン、３－グリシドキシプロピルトリメトキシシラン、３－グリシドキシプロピルトリエトキシシラン、３－グリシドキシプロピルメチルジメトキシシラン、３－グリシドキシプロピルエトキシジメチルシラン、２－（３，４－エポキシシクロヘキシル）エチルトリメトキシシラン、３－クロロプロピルメチルジメトキシシラン、３－クロロプロピルトリメトキシシラン、３－メタクリロイルオキシプロピルトリメトキシシラン、３－メルカプトプロピルトリメトキシシラン等が挙げられる。
　シラン化合物（Ｃ）は、シリコーンオリゴマーであってもよい。
　シラン化合物（Ｃ）の含有量は、樹脂（Ａ）１００質量部に対して、通常０．０１～２０質量部であり、好ましくは０．１～１０質量部であり、より好ましくは０．１５～７質量部であり、さらに好ましくは０．２～５質量部であり、特に好ましくは０．２５～２質量部である。 Examples of the silane compound (C) include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and 3 -Glysidoxypropylmethyldimethoxysilane, 3-glycidoxypropylethoxydimethylsilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, Examples thereof include 3-methacryloyloxypropyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane.
The silane compound (C) may be a silicone oligomer.
The content of the silane compound (C) is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.15 with respect to 100 parts by mass of the resin (A). It is ~ 7 parts by mass, more preferably 0.2 to 5 parts by mass, and particularly preferably 0.25 to 2 parts by mass.
　ラジカル硬化性成分（Ｄ）としては、ラジカル重合反応により硬化する化合物又はオリゴマー等のラジカル硬化性成分が挙げられる。
　ラジカル重合性成分（Ｄ）としては、（メタ）アクリレート系化合物、スチレン系化合物、ビニル系化合物等が挙げられる。
　粘着剤組成物（ｉ）はラジカル硬化性成分（Ｄ）を２種以上含んでいてもよい。 Examples of the radical curable component (D) include radical curable components such as compounds or oligomers that are cured by a radical polymerization reaction.
Examples of the radically polymerizable component (D) include (meth) acrylate-based compounds, styrene-based compounds, and vinyl-based compounds.
The pressure-sensitive adhesive composition (i) may contain two or more radical curable components (D).
　（メタ）アクリレート系化合物としては、分子内に少なくとも１個の（メタ）アクリロイルオキシ基を有する（メタ）アクリレートモノマー、（メタ）アクリルアミドモノマー、及び、分子内に少なくとも２個の（メタ）アクリロイル基を有する（メタ）アクリルオリゴマー等の（メタ）アクリロイル基含有化合物を挙げることができる。（メタ）アクリルオリゴマーは好ましくは、分子内に少なくとも２個の（メタ）アクリロイルオキシ基を有する（メタ）アクリレートオリゴマーである。（メタ）アクリレート系化合物は、１種のみを単独で用いてもよいし２種以上を併用してもよい。 Examples of the (meth) acrylate-based compound include a (meth) acrylate monomer having at least one (meth) acryloyloxy group in the molecule, a (meth) acrylamide monomer, and at least two (meth) acryloyl groups in the molecule. (Meta) acryloyl group-containing compounds such as (meth) acrylic oligomers having the above can be mentioned. The (meth) acrylic oligomer is preferably a (meth) acrylate oligomer having at least two (meth) acryloyloxy groups in the molecule. As the (meth) acrylate compound, only one kind may be used alone, or two or more kinds may be used in combination.
　（メタ）アクリレートモノマーとしては、分子内に１個の（メタ）アクリロイルオキシ基を有する単官能（メタ）アクリレートモノマー、分子内に２個の（メタ）アクリロイルオキシ基を有する２官能（メタ）アクリレートモノマー、分子内に３個以上の（メタ）アクリロイルオキシ基を有する多官能（メタ）アクリレートモノマーが挙げられる。
　（メタ）アクリレート化合物であることが好ましく、多官能（メタ）アクリレート化合物であることがより好ましい。多官能（メタ）アクリレート化合物は３官能以上であることが好ましい The (meth) acrylate monomer includes a monofunctional (meth) acrylate monomer having one (meth) acryloyloxy group in the molecule and a bifunctional (meth) acrylate having two (meth) acryloyloxy groups in the molecule. Examples include monomers and polyfunctional (meth) acrylate monomers having three or more (meth) acryloyloxy groups in the molecule.
It is preferably a (meth) acrylate compound, and more preferably a polyfunctional (meth) acrylate compound. The polyfunctional (meth) acrylate compound is preferably trifunctional or higher.
　ラジカル硬化性成分（Ｄ）の含有量は、樹脂（Ａ）１００質量部に対して、通常０．５～１００質量部であり、１～７０質量部であることが好ましく、３～５０質量部であることがより好ましく、５～３０質量部であることがさらに好ましく、７．５～２５質量部であることが特に好ましい。 The content of the radical curable component (D) is usually 0.5 to 100 parts by mass, preferably 1 to 70 parts by mass, and 3 to 50 parts by mass with respect to 100 parts by mass of the resin (A). It is more preferably 5 to 30 parts by mass, and particularly preferably 7.5 to 25 parts by mass.
　開始剤（Ｅ）は熱のエネルギーを吸収することにより重合反応を引き起こす化合物（熱重合開始剤）、光のエネルギーを吸収することにより重合反応を引き起こす化合物（光重合開始剤）のいずれであってもよい。なお、ここで光とは、可視光線、紫外線、Ｘ線、又は電子線のような活性エネルギー線であることが好ましい。 The initiator (E) is either a compound that induces a polymerization reaction by absorbing heat energy (thermal polymerization initiator) or a compound that induces a polymerization reaction by absorbing light energy (photopolymerization initiator). May be good. Here, the light is preferably an active energy ray such as visible light, ultraviolet light, X-ray, or electron beam.
　熱重合開始剤としては、加熱等によりラジカルを発生する化合物（熱ラジカル発生剤）、加熱等により酸を発生する化合物（熱酸発生剤）、加熱等により塩基を発生する化合物（熱塩基発生剤）等が挙げられる。
　光重合開始剤としては、光のエネルギーを吸収することによりラジカルを発生する化合物（光ラジカル発生剤）、光のエネルギーを吸収することにより酸を発生する化合物（光酸発生剤）、光のエネルギーを吸収することにより塩基を発生する化合物（光塩基発生剤）等が挙げられる。 Examples of the thermal polymerization initiator include compounds that generate radicals by heating (thermal radical generators), compounds that generate acids by heating (thermal acid generators), and compounds that generate bases by heating (thermal base generators). ) Etc. can be mentioned.
Photopolymerization initiators include compounds that generate radicals by absorbing light energy (photoradical generators), compounds that generate acids by absorbing light energy (photoacid generators), and light energy. Examples thereof include compounds that generate a base by absorbing the above (photobase generator).
　開始剤（Ｅ）は、上述したラジカル硬化性成分（Ｄ）の重合反応に適したものを選択することが好ましく、ラジカル重合開始剤であることがより好ましく、光ラジカル重合開始剤であることがさらに好ましい。
　ラジカル重合開始剤は、例えば、アルキルフェノン化合物、ベンゾイン化合物、ベンゾフェノン化合物、オキシムエステル化合物、ホスフィン化合物等が挙げられる。ラジカル重合開始剤は、光ラジカル重合開始剤であることが好ましく、重合反応の反応性の観点からオキシムエステル系光ラジカル重合開始剤であることがより好ましい。オキシムエステル系光ラジカル重合開始剤を使用することで、照度又は光量の弱い硬化条件であってもラジカル硬化成分（Ｄ）の反応率を高めることができる。 As the initiator (E), it is preferable to select one suitable for the polymerization reaction of the above-mentioned radical curable component (D), more preferably a radical polymerization initiator, and preferably a photoradical polymerization initiator. More preferred.
Examples of the radical polymerization initiator include an alkylphenone compound, a benzoin compound, a benzophenone compound, an oxime ester compound, a phosphine compound and the like. The radical polymerization initiator is preferably a photoradical polymerization initiator, and more preferably an oxime ester-based photoradical polymerization initiator from the viewpoint of the reactivity of the polymerization reaction. By using the oxime ester-based photoradical polymerization initiator, the reaction rate of the radical curing component (D) can be increased even under curing conditions where the illuminance or the amount of light is weak.
　開始剤（Ｅ）の含有量は、樹脂（Ａ）１００質量部に対して、通常０．０１～２０質量部であり、０．３～１０質量部であることが好ましく、０．５～５質量部であることがより好ましく、０．７５～４質量部であることがさらに好ましく、特に好ましくは１～３質量部である。 The content of the initiator (E) is usually 0.01 to 20 parts by mass, preferably 0.3 to 10 parts by mass, and 0.5 to 5 parts by mass with respect to 100 parts by mass of the resin (A). It is more preferably parts by mass, more preferably 0.75 to 4 parts by mass, and particularly preferably 1 to 3 parts by mass.
　光選択吸収化合物（Ｆ）は、化合物（Ｘ）以外の光吸収性化合物であり、例えば、波長２５０ｎｍ～波長３８０ｎｍ（好ましくは波長２５０ｎｍ以上波長３６０ｎｍ未満）の光を吸収する化合物（紫外線吸収剤）や、波長３８０ｎｍ～波長７８０ｎｍの光を吸収する化合物（色素）や、波長７８０ｎｍ～波長１５００ｎｍの光を吸収する化合物（赤外線吸収剤）である。
　紫外線吸収剤は、波長２５０ｎｍ～波長３８０ｎｍの光を吸収する化合物であれば、その構造は特に限定されないが、ベンゾトリアゾール系化合物、ベンゾフェノン系化合物、トリアジン系化合物、サリチル酸系化合物、シアノアクリレート系化合物、ベンゾオキサジン系化合物等の化合物等が好ましい。
　光選択吸収化合物（Ｆ）の含有量は、樹脂（Ａ）１００質量部に対して、通常０．１～５０質量部であり、好ましくは０．２～４０質量部であり、より好ましくは０．５～３０質量部であり、さらに好ましくは１～２５質量部であり、特に好ましくは２～２０質量部である。 The light selective absorption compound (F) is a light-absorbing compound other than the compound (X), and is, for example, a compound (ultraviolet absorber) that absorbs light having a wavelength of 250 nm to 380 nm (preferably a wavelength of 250 nm or more and less than 360 nm). Alternatively, it is a compound (dye) that absorbs light having a wavelength of 380 nm to 780 nm, or a compound (infrared absorber) that absorbs light having a wavelength of 780 nm to 1500 nm.
The structure of the ultraviolet absorber is not particularly limited as long as it is a compound that absorbs light having a wavelength of 250 nm to 380 nm, but a benzotriazole compound, a benzophenone compound, a triazine compound, a salicylic acid compound, a cyanoacrylate compound, Compounds such as benzoxazine compounds are preferable.
The content of the light selective absorption compound (F) is usually 0.1 to 50 parts by mass, preferably 0.2 to 40 parts by mass, and more preferably 0 with respect to 100 parts by mass of the resin (A). It is .5 to 30 parts by mass, more preferably 1 to 25 parts by mass, and particularly preferably 2 to 20 parts by mass.
　化合物（Ｘ）を含む組成物から成形される成形物は、波長４４０ｎｍにおける透過率が５０％以下であることが好ましく、３０％以下であることがより好ましい。 The molded product formed from the composition containing the compound (X) preferably has a transmittance of 50% or less, more preferably 30% or less at a wavelength of 440 nm.
　以下、実施例及び比較例を示して本発明をさらに具体的に説明するが、本発明はこれらの例によって限定されるものではない。例中、含有量ないし使用量を表す％及び部は、特に断りのない限り質量基準である。 Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these examples. In the examples,% and parts indicating the content or the amount used are based on mass unless otherwise specified.
　（実施例１）式（１）で表される化合物の合成
Figure JPOXMLDOC01-appb-I000091
　ジムロート冷却管及び温度計を設置した１００ｍＬ－四ツ口フラスコ内を窒素雰囲気とし、２－メチル－１，３－シクロヘキサンジオン２部、ジメチル硫酸１．３部、アセトニトリル１０部を加えて３時間加熱還流撹拌した。得られた混合物にマロノニトリル０．７５部、炭酸カリウム１．２部、イソプロパノール１０部を混合し、３時間加熱還流して撹拌させた。得られた混合物から溶媒を留去した後、精製し、式（１）で表される化合物０．１部を得た。 (Example 1) Synthesis of compound represented by formula (1)
Figure JPOXMLDOC01-appb-I000091
The inside of a 100 mL-four-necked flask equipped with a Dimroth condenser and a thermometer is set to a nitrogen atmosphere, and 2 parts of 2-methyl-1,3-cyclohexanedione, 1.3 parts of dimethyl sulfate, and 10 parts of acetonitrile are added and heated for 3 hours. The mixture was refluxed and stirred. 0.75 parts of malononitrile, 1.2 parts of potassium carbonate and 10 parts of isopropanol were mixed with the obtained mixture, and the mixture was heated under reflux for 3 hours and stirred. After distilling off the solvent from the obtained mixture, the mixture was purified to obtain 0.1 part of the compound represented by the formula (1).
　ＬＣ－ＭＳ測定及び１Ｈ－ＮＭＲ解析を行い、式（１）で表される化合物が生成したことを確認した。
１Ｈ－ＮＭＲ：１．７０（ｍ、２Ｈ）、２．１６（ｓ、３Ｈ）、２．５０～２．６２（ｍ、４Ｈ）
ＬＣ－ＭＳ；[Ｍ]－＝２２１．３ LC-MS measurement and 1 H-NMR analysis were carried out, and it was confirmed that the compound represented by the formula (1) was produced.
1 1 H-NMR: 1.70 (m, 2H), 2.16 (s, 3H), 2.50 to 2.62 (m, 4H)
LC-MS; [M] - = 221.3
　＜極大吸収波長及びグラム吸光係数ε測定＞
　得られた式（１）で表される化合物の２－ブタノン溶液（０．００６ｇ／Ｌ）を１ｃｍの石英セルに入れ、石英セルを分光光度計ＵＶ－２４５０（株式会社島津製作所製）にセットし、ダブルビーム法により１ｎｍステップ毎に３００～８００ｎｍの波長範囲の吸光度を測定した。得られた吸光度の値と、溶液中の式（１）で表される化合物の濃度、石英セルの光路長から、波長ごとのグラム吸光係数を算出した。
　　ε（λ）＝Ａ（λ）／ＣＬ
〔式中、ε（λ）は波長λｎｍにおける式（１）で表される化合物のグラム吸光係数（Ｌ／（ｇ・ｃｍ））を表し、Ａ（λ）は波長λｎｍにおける吸光度を表し、Ｃは濃度（ｇ／Ｌ）を表し、Ｌは石英セルの光路長（ｃｍ）を表す。〕
　得られた式（１）で表される化合物の極大吸収波長は４５７ｎｍであった。得られた式（１）で表される化合物のε（λmax）は１５０．６Ｌ／（ｇ・ｃｍ）、ε（λmax＋３０ｎｍ）は３．８Ｌ／（ｇ・ｃｍ）、ε（λmax）／ε（λmax＋３０ｎｍ）は３９．６であった。 <Maximum absorption wavelength and gram absorption coefficient ε measurement>
A 2-butanone solution (0.006 g / L) of the obtained compound represented by the formula (1) was placed in a 1 cm quartz cell, and the quartz cell was set in a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation). Then, the absorbance in the wavelength range of 300 to 800 nm was measured every 1 nm step by the double beam method. The gram extinction coefficient for each wavelength was calculated from the obtained absorbance value, the concentration of the compound represented by the formula (1) in the solution, and the optical path length of the quartz cell.
ε (λ) = A (λ) / CL
[In the formula, ε (λ) represents the gram extinction coefficient (L / (g · cm)) of the compound represented by the formula (1) at the wavelength λ nm, A (λ) represents the absorbance at the wavelength λ nm, and C. Represents the concentration (g / L), and L represents the optical path length (cm) of the quartz cell. ]
The maximum absorption wavelength of the obtained compound represented by the formula (1) was 457 nm. The obtained compound represented by the formula (1) has ε (λmax) of 150.6 L / (g · cm), ε (λmax + 30 nm) of 3.8 L / (g · cm), and ε (λmax) / ε ( λmax + 30 nm) was 39.6.
　（実施例２）式（２）で表される化合物の合成
Figure JPOXMLDOC01-appb-I000092
　ジムロート冷却管及び温度計を設置した３００ｍＬ－四ツ口フラスコ内を窒素雰囲気とし、ジメドン７０部、マロノニトリル１０．４部、ジイソプロピルエチルアミン４０．６部、エタノール１００部仕込み、３時間加熱還流して撹拌させた。得られた混合物から溶媒を留去し、精製して、式（Ｍ－５）で表される化合物１５．１部を得た。 (Example 2) Synthesis of compound represented by formula (2)
Figure JPOXMLDOC01-appb-I000092
A nitrogen atmosphere is created in a 300 mL-four-necked flask equipped with a Dimroth condenser and a thermometer, and 70 parts of dimedone, 10.4 parts of malononitrile, 40.6 parts of diisopropylethylamine, and 100 parts of ethanol are charged, and the mixture is heated under reflux for 3 hours and stirred. I let you. The solvent was distilled off from the obtained mixture and the mixture was purified to obtain 15.1 part of the compound represented by the formula (M-5).
Figure JPOXMLDOC01-appb-I000093
　窒素雰囲気下で、式（Ｍ－５）で表される化合物５部、パラトルエンスルホニルシアニド５．８部、カリウムｔｅｒｔ－ブトキシド３部及びエタノール５０部を混合した。得られた混合物を温度０～５℃で３時間撹拌させた。得られた混合物から溶媒を留去し、精製して、式（Ｍ－６）で表される化合物３．３部を得た。
Figure JPOXMLDOC01-appb-I000093
Under a nitrogen atmosphere, 5 parts of the compound represented by the formula (M-5), 5.8 parts of paratoluenesulfonyl cyanide, 3 parts of potassium tert-butoxide and 50 parts of ethanol were mixed. The resulting mixture was stirred at a temperature of 0-5 ° C. for 3 hours. The solvent was distilled off from the obtained mixture and the mixture was purified to obtain 3.3 parts of the compound represented by the formula (M-6).
Figure JPOXMLDOC01-appb-I000094
　窒素雰囲気下で、式（Ｍ－６）で表される化合物５部、メチルトリフラート７．７部、炭酸カリウム３．２部及びメチルエチルケトン５０部を混合した。得られた混合物を温度０～５℃で３時間撹拌させた。得られた混合物にマロノニトリル４．６部及び炭酸カリウム１３．０部を加えて温度０～５℃で３時間撹拌させた。得られた混合物から溶媒を留去し、精製して、式（２）で表される化合物３．１部を得た。
Figure JPOXMLDOC01-appb-I000094
Under a nitrogen atmosphere, 5 parts of the compound represented by the formula (M-6), 7.7 parts of methyl triflate, 3.2 parts of potassium carbonate and 50 parts of methyl ethyl ketone were mixed. The resulting mixture was stirred at a temperature of 0-5 ° C. for 3 hours. 4.6 parts of malononitrile and 13.0 parts of potassium carbonate were added to the obtained mixture, and the mixture was stirred at a temperature of 0 to 5 ° C. for 3 hours. The solvent was distilled off from the obtained mixture and the mixture was purified to obtain 3.1 parts of the compound represented by the formula (2).
　ＬＣ－ＭＳ測定及び１Ｈ－ＮＭＲ解析を行い、式（２）で表される化合物が生成したことを確認した。
１Ｈ－ＮＭＲ（重ＤＭＳＯ）δ：０．９２（ｓ、６Ｈ）、２．４５～２．５２（ｓ、４Ｈ）
ＬＣ－ＭＳ；[Ｍ]－＝２６０．２ LC-MS measurement and 1 H-NMR analysis were carried out, and it was confirmed that the compound represented by the formula (2) was produced.
1 1 H-NMR (heavy DMSO) δ: 0.92 (s, 6H) 2.45 to 2.52 (s, 4H)
LC-MS; [M] - = 260.2
　また、上記と同様にして、極大吸収波長及びグラム吸光係数を測定した。得られた式（２）で表される化合物の極大吸収波長は４３２ｎｍであった。得られた式（２）で表される化合物のε（λmax）は２３７Ｌ／（ｇ・ｃｍ）、ε（λmax＋３０ｎｍ）は４．４Ｌ／（ｇ・ｃｍ）、ε（λmax）／ε（λmax＋３０ｎｍ）は５３．９であった。 In addition, the maximum absorption wavelength and the gram absorption coefficient were measured in the same manner as above. The maximum absorption wavelength of the obtained compound represented by the formula (2) was 432 nm. The obtained compound represented by the formula (2) has ε (λmax) of 237 L / (g · cm), ε (λmax + 30 nm) of 4.4 L / (g · cm), and ε (λmax) / ε (λmax + 30 nm). Was 53.9.
　（実施例３）樹脂組成物（１）（粘着剤組成物（１））の作製
　重合例１：アクリル樹脂（Ａ）の調製
　冷却管、窒素導入管、温度計および撹拌機を備えた反応容器に、溶媒として酢酸エチル８１．８部、アクリル酸ブチル９６部、アクリル酸２－ヒドロキシエチルメチル３部、およびアクリル酸１部の混合溶液を仕込み、窒素ガスで反応容器内の空気を置換して酸素不含としながら内温を５５℃に上げた。その後、アゾビスイソブチロニトリル（重合開始剤）０．１４部を酢酸エチル１０部に溶かした溶液を全量添加した。重合開始剤を添加した後、１時間この温度で保持し、次いで内温を５４～５６℃に保ちながら酢酸エチルを添加速度１７．３部／ｈｒで反応容器内へ連続的に加え、アクリル樹脂の濃度が３５％となった時点で酢酸エチルの添加を止め、さらに酢酸エチルの添加開始から１２時間経過するまでこの温度で保温した。最後に酢酸エチルを加えてアクリル樹脂の濃度が２０％となるように調節し、アクリル樹脂の酢酸エチル溶液を調製した。得られたアクリル樹脂は、ＧＰＣによるポリスチレン換算の重量平均分子量Ｍｗが１４７万、Ｍｗ／Ｍｎが５．５であった。これをアクリル樹脂（Ａ）とする。 (Example 3) Preparation of resin composition (1) (adhesive composition (1)) Polymerization example 1: Preparation of acrylic resin (A) A reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer and a stirrer. A mixed solution of 81.8 parts of ethyl acetate, 96 parts of butyl acrylate, 3 parts of 2-hydroxyethylmethyl acrylate, and 1 part of acrylic acid was charged as a solvent, and the air in the reaction vessel was replaced with nitrogen gas. The internal temperature was raised to 55 ° C. while containing no oxygen. Then, a total amount of a solution prepared by dissolving 0.14 parts of azobisisobutyronitrile (polymerization initiator) in 10 parts of ethyl acetate was added. After adding the polymerization initiator, the mixture was kept at this temperature for 1 hour, and then ethyl acetate was continuously added into the reaction vessel at an addition rate of 17.3 parts / hr while keeping the internal temperature at 54 to 56 ° C. to form an acrylic resin. When the concentration of ethyl acetate reached 35%, the addition of ethyl acetate was stopped, and the temperature was kept at this temperature until 12 hours had passed from the start of addition of ethyl acetate. Finally, ethyl acetate was added to adjust the concentration of the acrylic resin to 20%, and an ethyl acetate solution of the acrylic resin was prepared. The obtained acrylic resin had a polystyrene-equivalent weight average molecular weight Mw of 1.47 million and Mw / Mn of 5.5 by GPC. This is referred to as acrylic resin (A).
　＜樹脂組成物（１）の調製＞
　アクリル樹脂（Ａ）の酢酸エチル溶液（樹脂濃度：２０％）の固形分１００部に対して、架橋剤（東ソー株式会社製：商品名「コロネートＬ」、イソシアネート系化合物、固形分７５％）０．３部、シラン化合物（信越化学工業株式会社製：商品名「ＫＢＭ３０６６」）０．２８部、式（２）で表される化合物１．５部を混合し、さらに固形分濃度が１４％となるように酢酸エチルを添加して樹脂組成物（１）（粘着剤組成物）を得た。なお、上記架橋剤の配合量は、有効成分としての質量部数である。 <Preparation of resin composition (1)>
A cross-linking agent (manufactured by Toso Co., Ltd .: trade name "Coronate L", isocyanate compound, solid content 75%) is 0 with respect to 100 parts of the solid content of the ethyl acetate solution (resin concentration: 20%) of the acrylic resin (A). .3 parts, 0.28 parts of silane compound (manufactured by Shin-Etsu Chemical Industry Co., Ltd .: trade name "KBM3066"), 1.5 parts of the compound represented by the formula (2) are mixed, and the solid content concentration is 14%. Ethyl acetate was added so as to obtain a resin composition (1) (adhesive composition). The blending amount of the above-mentioned cross-linking agent is the number of parts by mass as the active ingredient.
　（実施例４～７及び比較例１）樹脂組成物（２）～（６）の作製
　表１０に示すように各成分及び各成分の含有量を変更したこと以外は実施例３と同様にして粘着剤組成物（２）～粘着剤組成物（６）を作製した。なお、架橋剤の配合量は有効成分としての質量部数であり、樹脂（Ａ）は固形分の質量部数である。 (Examples 4 to 7 and Comparative Example 1) Preparation of Resin Compositions (2) to (6) As shown in Table 10, each component and the content of each component were changed in the same manner as in Example 3. The pressure-sensitive adhesive composition (2) to the pressure-sensitive adhesive composition (6) were prepared. The amount of the cross-linking agent blended is the number of parts by mass as the active ingredient, and the resin (A) is the number of parts by mass of the solid content.
Figure JPOXMLDOC01-appb-T000095
Figure JPOXMLDOC01-appb-T000095
　なお、表１における各略語は以下の意味を表す。
　アクリル樹脂（Ａ）：重合例１で合成したアクリル樹脂（Ａ）
　式（２）：実施例２で合成した式（２）で表される化合物
　コロネートＬ：東ソー株式会社製、商品名：コロネートＬ、イソシアネート系架橋剤
　ＫＢＭ３０６６：信越化学工業株式会社製、商品名：ＫＢＭ３０６６、シランカップリング剤
　Ａ－ＤＰＨ－１２Ｅ：新中村化学工業株式会社製、商品名；Ａ－ＤＰＨ－１２Ｅ、６官能（メタ）アクリレート化合物
　ＮＣＩ－７３０：株式会社ＡＤＥＫＡ社製、商品名：ＮＣＩ－７３０、オキシムエステル化合物である光ラジカル発生剤
　ＲＵＶＡ－９３：大塚化学株式会社製、ベンゾトリアゾール系紫外線吸収剤、商品名：ＲＵＶＡ－９３、極大吸収波長λmax＝３３７ｎｍ
　Ｃ．Ｉ．Ｙ３３：Ｓｕｍｉｐｌａｓｔ　Ｌｅｍｏｎ　Ｙｅｌｌｏｗ　ＨＬ（Ｃ．Ｉ．ソルベントイエロー３３、住化ケムテックス株式会社製） Each abbreviation in Table 1 has the following meaning.
Acrylic resin (A): Acrylic resin (A) synthesized in Polymerization Example 1
Formula (2): Compound represented by the formula (2) synthesized in Example 2 Coronate L: manufactured by Tosoh Corporation, trade name: Coronate L, isocyanate-based cross-linking agent KBM3066: manufactured by Shinetsu Chemical Industry Co., Ltd., trade name: KBM3066, silane coupling agent A-DPH-12E: manufactured by Shin-Nakamura Chemical Industry Co., Ltd., trade name; A-DPH-12E, hexafunctional (meth) acrylate compound NCI-730: manufactured by ADEKA Co., Ltd., trade name: NCI -730, Photoradical generator which is an oxime ester compound RUVA-93: Benzotriazole-based ultraviolet absorber manufactured by Otsuka Chemical Co., Ltd., trade name: RUVA-93, maximum absorption wavelength λmax = 337 nm
C. I. Y33: Sumiplast Lemon Yellow HL (CI Solvent Yellow 33, manufactured by Sumika Chemtex Co., Ltd.)
　＜樹脂組成物（１）の成形体の評価＞
　〔樹脂成形体（１）の作製〕
　得られた樹脂組成物（１）を、離型処理が施されたポリエチレンテレフタレートフィルムからなるセパレートフィルム〔リンテック株式会社から入手した商品名「ＰＬＲ－３８２１９０」〕の離型処理面に、アプリケーターを用いて塗布し、温度１００℃で１分間乾燥して樹脂成形体（粘着剤層）（１）を作製した。得られた樹脂成形体（１）の厚みは１５μｍであった。 <Evaluation of molded product of resin composition (1)>
[Preparation of resin molded product (1)]
An applicator was used on the release-treated surface of a separate film [trade name "PLR-382190" obtained from Lintec Corporation] made of a polyethylene terephthalate film that had been released from the obtained resin composition (1). And dried at a temperature of 100 ° C. for 1 minute to prepare a resin molded body (adhesive layer) (1). The thickness of the obtained resin molded product (1) was 15 μm.
　得られた樹脂成形体（１）をラミネーターにより、厚み２３μｍの紫外線吸収剤含有シクロオレフィンフィルム〔日本ゼオン株式会社から入手した商品名「ＺＥＯＮＯＲ」〕に貼り合わせた後、温度２３℃、相対湿度６５％の条件で７日間養生し、シクロオレフィンフィルム／樹脂成形体（１）／セパレートフィルムの積層体（１）を得た。 The obtained resin molded body (1) was attached to a cycloolefin film containing an ultraviolet absorber having a thickness of 23 μm [trade name “ZEONOR” obtained from Nippon Zeon Corporation] by a laminator, and then the temperature was 23 ° C. and the relative humidity was 65. The mixture was cured under the condition of% for 7 days to obtain a laminate (1) of a cycloolefin film / resin molded product (1) / separate film.
　〔樹脂成形体（１）の吸光度測定〕
　得られた積層体（１）を３０ｍｍ×３０ｍｍの大きさに裁断し、セパレートフィルムを剥離して、樹脂成形体（１）と無アルカリガラス〔コーニング社製の商品名“ＥＡＧＬＥ　ＸＧ”〕とを貼合し、これをサンプル（１）とした。作製したサンプル（１）の波長３００～８００ｎｍ範囲の吸光度を１ｎｍステップ毎に、分光光度計（ＵＶ－２４５０：株式会社島津製作所製）を用いて測定した。測定した波長４４０ｎｍにおける吸光度を、樹脂成形体（１）の波長４４０ｎｍの吸光度とした。その結果を表１１に示す。なお、無アルカリガラス単体及びシクロオレフィンフィルム単体それぞれの波長３３０ｎｍ及び波長４４０ｎｍの吸光度は０である。
　また、以下の式に基づき波長４４０ｎｍ及び波長３３０ｎｍの透過率を求めた。結果を表１１のＴ４４０の欄に波長４４０ｎｍの透過率を示し、Ｔ３３０ｎｍの欄に波長３３０ｎｍの欄に示す。
　　Ｔ＝１０－Ａ×１００（Ｔは透過率を表し、Ａは吸光度を表す。） [Measurement of absorbance of resin molded product (1)]
The obtained laminate (1) is cut into a size of 30 mm × 30 mm, the separate film is peeled off, and the resin molded body (1) and the non-alkali glass [trade name “EAGLE XG” manufactured by Corning Inc.] are separated. They were pasted together and used as sample (1). The absorbance of the prepared sample (1) in the wavelength range of 300 to 800 nm was measured every 1 nm step using a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation). The measured absorbance at a wavelength of 440 nm was defined as the absorbance of the resin molded product (1) at a wavelength of 440 nm. The results are shown in Table 11. The absorbance at a wavelength of 330 nm and a wavelength of 440 nm of the non-alkali glass simple substance and the cycloolefin film simple substance are 0, respectively.
Further, the transmittance at a wavelength of 440 nm and a wavelength of 330 nm was determined based on the following equations. The results are shown in the T440 column of Table 11 for the transmittance at a wavelength of 440 nm, and in the T330 nm column for a wavelength 330 nm column.
T = 10 −A × 100 (T represents transmittance and A represents absorbance)
　〔樹脂成形体（１）の吸光度保持率の測定〕
　吸光度測定後のサンプル（１）を、温度６３℃、相対湿度５０％ＲＨの条件でサンシャインウェザーメーター（スガ試験機株式会社製）に７５時間投入し、耐候性試験を実施した。取り出したサンプル（１）の吸光度を上記と同様の方法で測定した。測定した吸光度から、下記式に基づき、波長４４０ｎｍにおけるサンプルの吸光度保持率を求めた。下式中、Ａ（４４０）は、波長４４０ｎｍにおける吸光度を表す。結果を表１１に示す。吸光度保持率が１００に近い値ほど、光選択吸収機能の劣化がなく良好な耐候性を有することを示す。
　吸光度保持率（％）
　　　＝（耐久試験後のＡ（４４０）／耐久試験前のＡ（４４０））×１００ [Measurement of Absorbance Retention Rate of Resin Mold (1)]
The sample (1) after the absorbance measurement was put into a sunshine weather meter (manufactured by Suga Test Instruments Co., Ltd.) under the conditions of a temperature of 63 ° C. and a relative humidity of 50% RH for 75 hours to carry out a weather resistance test. The absorbance of the taken-out sample (1) was measured by the same method as described above. From the measured absorbance, the absorbance retention rate of the sample at a wavelength of 440 nm was determined based on the following formula. In the following formula, A (440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 11. The closer the absorbance retention rate is to 100, the better the weather resistance is without deterioration of the light selective absorption function.
Absorbance retention rate (%)
= (A (440) after endurance test / A (440) before endurance test) x 100
　〔樹脂成形体（１）の耐ブリード性評価〕
　得られた樹脂成形体（１）の一方の面にさらにセパレートフィルムを積層させて両面セパレートフィルム付き樹脂成形体（１）を得た。得られた両面セパレートフィルム付き樹脂成形体（１）を温度２３～２５℃の空気下で１ヶ月保管した。保管後の両面セパレートフィルム付き樹脂成形体（１）を顕微鏡を用いて面内の化合物の結晶析出の有無を確認した。結晶析出がない場合をａとし、結晶析出がある場合をｂとした。評価結果を表１１の耐ブリード性の欄に示す。 [Evaluation of bleed resistance of resin molded product (1)]
A separate film was further laminated on one surface of the obtained resin molded product (1) to obtain a resin molded product (1) with a double-sided separate film. The obtained resin molded product (1) with a double-sided separate film was stored in air at a temperature of 23 to 25 ° C. for 1 month. After storage, the resin molded product (1) with a double-sided separate film was checked for crystal precipitation of the compound in the plane using a microscope. The case where there was no crystal precipitation was defined as a, and the case where there was crystal precipitation was defined as b. The evaluation results are shown in the bleed resistance column of Table 11.
　樹脂組成物（１）の代わりに樹脂組成物（２）を用いて樹脂成形体（２）、積層体（２）、及び両面セパレートフィルム付き樹脂成形体（２）を作製し、同様に評価を行った。結果を表１１に示す。 A resin molded body (2), a laminated body (2), and a resin molded body with a double-sided separate film (2) were prepared using the resin composition (2) instead of the resin composition (1), and evaluated in the same manner. went. The results are shown in Table 11.
　樹脂組成物（１）の代わりに樹脂組成物（３）を用いて樹脂成形体（３）、積層体（３）、及び両面セパレートフィルム付き樹脂成形体（３）を作製し、同様に評価を行った。結果を表１１に示す。 A resin molded body (3), a laminated body (3), and a resin molded body with a double-sided separate film (3) were prepared using the resin composition (3) instead of the resin composition (1), and evaluated in the same manner. went. The results are shown in Table 11.
　樹脂組成物（１）の代わりに樹脂組成物（６）を用いて樹脂成形体（６）、積層体（６）、及び両面セパレートフィルム付き樹脂成形体（６）を作製し、同様に評価を行った。結果を表１１に示す。 A resin molded body (6), a laminated body (6), and a resin molded body with a double-sided separate film (6) were prepared using the resin composition (6) instead of the resin composition (1), and evaluated in the same manner. went. The results are shown in Table 11.
　＜樹脂組成物（４）の成形体の評価＞
　〔樹脂脂成形体（４）の作製〕
　樹脂組成物（４）を、離型処理が施されたポリエチレンテレフタレートフィルムからなるセパレートフィルム〔リンテック（株）から入手した商品名「ＰＬＲ－３８２１９０」〕の離型処理面に、アプリケーターを用いて乾燥後の厚みが５μｍとなるように塗布し、温度１００℃で１分間乾燥した。その後、セパレートフィルム側から紫外線照射装置（フュージョン　ＵＶ　システムズ社製「無電極ＵＶランプシステム　Ｈバルブ」）を用いてＵＶ－Ａ（波長３２０～３９０ｎｍ）が照度５００ｍＷ、積算光量が５００ｍＪになるよう調整し、紫外線照射することで樹脂成形体（粘着剤層）（４）を作製した。
　得られた樹脂成形体（４）を無アルカリガラスに貼合し、セパレートフィルムを剥離した後、樹脂成形体（４）に２３μｍの紫外線吸収剤含有シクロオレフィンフィルム〔日本ゼオン株式会社から入手した商品名「ＺＥＯＮＯＲ」〕を貼合し、シクロオレフィンフィルム／樹脂成形体（４）／ガラスの構成を有する積層体（４）を作製した。 <Evaluation of molded product of resin composition (4)>
[Preparation of resin fat molded product (4)]
The resin composition (4) is dried using an applicator on the release-treated surface of a separate film [trade name "PLR-382190" obtained from Lintec Corporation] made of a polyethylene terephthalate film that has been subjected to a release treatment. After that, the film was applied so as to have a thickness of 5 μm, and dried at a temperature of 100 ° C. for 1 minute. After that, from the separate film side, UV-A (wavelength 320 to 390 nm) was adjusted to an illuminance of 500 mW and an integrated light amount of 500 mJ using an ultraviolet irradiation device (“Fusion UV Systems Co., Ltd.“ Electrodeless UV lamp system H valve ”). , A resin molded body (adhesive layer) (4) was produced by irradiating with ultraviolet rays.
The obtained resin molded product (4) was bonded to non-alkali glass, the separate film was peeled off, and then the resin molded product (4) was coated with a 23 μm ultraviolet absorber-containing cycloolefin film [a product obtained from Nippon Zeon Co., Ltd.]. The name "ZEONOR"] was laminated to prepare a laminated body (4) having a cycloolefin film / resin molded body (4) / glass structure.
　〔樹脂成形体（４）の吸光度測定〕
　作製した積層体（４）を分光光度計ＵＶ－２４５０（株式会社島津製作所製）にセットし、ダブルビーム法により１ｎｍステップ３００～８００ｎｍの波長範囲で吸光度を測定した。測定した波長４４０ｎｍにおける吸光度を、樹脂成形体（４）の波長４４０ｎｍの吸光度とした。なお、無アルカリガラス単体及びシクロオレフィンフィルム単体それぞれの波長３３０ｎｍ及び波長４４０ｎｍの吸光度は０である。
　また、以下の式に基づき波長４４０ｎｍ及び波長３３０ｎｍの透過率を求めた。結果を表１１のＴ４４０の欄に波長４４０ｎｍの透過率を示し、Ｔ３３０ｎｍの欄に波長３３０ｎｍの欄に示す。
　　Ｔ＝１０－Ａ×１００（Ｔは透過率を表し、Ａは吸光度を表す。） [Measurement of absorbance of resin molded product (4)]
The prepared laminate (4) was set in a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation), and the absorbance was measured in the wavelength range of 300 to 800 nm in 1 nm steps by the double beam method. The measured absorbance at a wavelength of 440 nm was defined as the absorbance of the resin molded product (4) at a wavelength of 440 nm. The absorbance at a wavelength of 330 nm and a wavelength of 440 nm of the non-alkali glass simple substance and the cycloolefin film simple substance are 0, respectively.
Further, the transmittance at a wavelength of 440 nm and a wavelength of 330 nm was determined based on the following equations. The results are shown in the T440 column of Table 11 for the transmittance at a wavelength of 440 nm, and in the T330 nm column for a wavelength 330 nm column.
T = 10 −A × 100 (T represents transmittance and A represents absorbance)
　〔樹脂成形体（４）の吸光度保持率の測定〕
　吸光度測定後の積層体（４）を、温度６３℃、相対湿度５０％ＲＨの条件でサンシャインウェザーメーター（スガ試験機株式会社製）に７５時間投入し、耐候性試験を実施した。取り出した積層体（４）の樹脂成形体（４）の吸光度を上記と同様の方法で測定した。測定した吸光度から、下記式に基づき、波長４４０ｎｍにおけるサンプルの吸光度保持率を求めた。下式中、Ａ（４４０）は、波長４４０ｎｍにおける吸光度を表す。結果を表１１に示す。吸光度保持率が１００に近い値ほど、光選択吸収機能の劣化がなく良好な耐候性を有することを示す。
　吸光度保持率（％）
　　　＝（耐久試験後のＡ（４４０）／耐久試験前のＡ（４４０））×１００ [Measurement of Absorbance Retention Rate of Resin Mold (4)]
The laminate (4) after the absorbance measurement was put into a sunshine weather meter (manufactured by Suga Test Instruments Co., Ltd.) under the conditions of a temperature of 63 ° C. and a relative humidity of 50% RH for 75 hours, and a weather resistance test was carried out. The absorbance of the resin molded product (4) of the taken-out laminate (4) was measured by the same method as described above. From the measured absorbance, the absorbance retention rate of the sample at a wavelength of 440 nm was determined based on the following formula. In the following formula, A (440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 11. The closer the absorbance retention rate is to 100, the better the weather resistance is without deterioration of the light selective absorption function.
Absorbance retention rate (%)
= (A (440) after endurance test / A (440) before endurance test) x 100
　〔樹脂成形体（４）の耐ブリード性評価〕
　得られた樹脂成形体（４）の一方の面にさらにセパレートフィルムを積層させて両面セパレートフィルム付き樹脂成形体（４）を得た。得られた両面セパレートフィルム付き樹脂成形体（４）を温度２３～２５℃の空気下で１ヶ月保管した。保管後の両面セパレートフィルム付き樹脂成形体（４）を、顕微鏡を用いて面内の化合物の結晶析出の有無を確認した。結晶析出がない場合をａとし、結晶析出がある場合をｂとした。評価結果を表１１の耐ブリード性の欄に示す。 [Evaluation of bleed resistance of resin molded product (4)]
A separate film was further laminated on one surface of the obtained resin molded product (4) to obtain a resin molded product (4) with a double-sided separate film. The obtained resin molded product (4) with a double-sided separate film was stored in air at a temperature of 23 to 25 ° C. for 1 month. The resin molded product (4) with the double-sided separate film after storage was confirmed by using a microscope for the presence or absence of crystal precipitation of the compound in the plane. The case where there was no crystal precipitation was defined as a, and the case where there was crystal precipitation was defined as b. The evaluation results are shown in the bleed resistance column of Table 11.
　樹脂組成物（４）の代わりに樹脂組成物（５）を用いて樹脂成形体（５）、積層体（５）、及び両面セパレートフィルム付き樹脂成形体（５）を作製し、同様に評価を行った。結果を表１１に示す。 A resin molded body (5), a laminated body (5), and a resin molded body with a double-sided separate film (5) were prepared using the resin composition (5) instead of the resin composition (4), and evaluated in the same manner. went. The results are shown in Table 11.
Figure JPOXMLDOC01-appb-T000096
Figure JPOXMLDOC01-appb-T000096
　（実施例８）眼鏡レンズ用樹脂組成物及びその成形体の調製
　キシリレンジイソシアネート４０部、トリメチロールプロパントリス（チオグリコラート）６０部、実施例２で合成した式（２）で表される化合物０．０１部、離型剤（商品名：ＺＥＬＥＣ－ＵＮ、Ｓｉｇｍｅ－Ａｌｄｒｉｃｈ社より入手）０．２部、硬化触媒としてのジブチルジクロロスズ０．０３部を混合撹拌した。得られた混合物を真空乾燥機内で１時間静置し、脱気した。得られた混合物をガラスモールドに注入し、温度１２０℃で１時間加熱した。ガラスモールドから成形体のみを剥離し、成形体として厚さ２ｍｍ、３ｃｍ×３ｃｍの樹脂板を作製した。 (Example 8) Preparation of resin composition for spectacle lens and molded product thereof 40 parts of xylylene diisocyanate, 60 parts of trimethylolpropane tris (thioglycolate), compound represented by the formula (2) synthesized in Example 2. 0.01 part, 0.2 part of a release agent (trade name: ZELEC-UN, obtained from Sigma-Aldrich), and 0.03 part of dibutyldichlorotin as a curing catalyst were mixed and stirred. The obtained mixture was allowed to stand in a vacuum dryer for 1 hour and degassed. The resulting mixture was poured into a glass mold and heated at a temperature of 120 ° C. for 1 hour. Only the molded body was peeled off from the glass mold to prepare a resin plate having a thickness of 2 mm, 3 cm × 3 cm as the molded body.
　（実施例９～１２）眼鏡レンズ用樹脂組成物及びその成形体の調製
　式（２）で表される化合物の含有量を表１２に示す含有量［部］に変更したこと以外は、実施例８と同様にして、眼鏡レンズ用樹脂組成物及びその成形体である樹脂板を得た。 (Examples 9 to 12) Preparation of resin composition for spectacle lens and its molded product Examples except that the content of the compound represented by the formula (2) was changed to the content [part] shown in Table 12. In the same manner as in No. 8, a resin composition for an spectacle lens and a resin plate as a molded product thereof were obtained.
Figure JPOXMLDOC01-appb-T000097
Figure JPOXMLDOC01-appb-T000097
　＜樹脂板の評価＞
　〔樹脂板の吸光度の測定〕
　上記で得られた樹脂板の波長３００～８００ｎｍ範囲の吸光度を１ｎｍステップ毎に、分光光度計（ＵＶ－２４５０：株式会社島津製作所製）を用いて測定した。
　また、以下の式に基づき波長４４０ｎｍの透過率を求めた。結果を表１３のＴ４４０の欄に示した。
　　Ｔ＝１０－Ａ×１００（Ｔは透過率を表し、Ａは吸光度を表す。） <Evaluation of resin plate>
[Measurement of absorbance of resin plate]
The absorbance of the resin plate obtained above in the wavelength range of 300 to 800 nm was measured every 1 nm step using a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation).
Further, the transmittance at a wavelength of 440 nm was determined based on the following formula. The results are shown in the T440 column of Table 13.
T = 10 −A × 100 (T represents transmittance and A represents absorbance)
　〔樹脂板の吸光度保持率の測定〕
　吸光度測定後の樹脂板を温度６３℃、相対湿度５０％ＲＨの条件でサンシャインウェザーメーター（スガ試験機株式会社製）に７５時間投入し、耐候性試験を実施した。取り出した樹脂板の吸光度を上記と同様の方法で測定した。測定した吸光度から、下記式に基づき、波長４４０ｎｍにおける樹脂板の吸光度保持率を求めた。下式中、Ａ（４４０）は、波長４４０ｎｍにおける吸光度を表す。結果を表１３に示した。吸光度保持率が１００に近い値ほど、光選択吸収機能の劣化がなく良好な耐候性を有することを示す。
　吸光度保持率（％）
　　　＝（耐久試験後のＡ（４４０）／耐久試験前のＡ（４４０））×１００ [Measurement of absorbance retention of resin plate]
The resin plate after the absorbance measurement was put into a sunshine weather meter (manufactured by Suga Test Instruments Co., Ltd.) under the conditions of a temperature of 63 ° C. and a relative humidity of 50% RH for 75 hours, and a weather resistance test was carried out. The absorbance of the removed resin plate was measured by the same method as described above. From the measured absorbance, the absorbance retention rate of the resin plate at a wavelength of 440 nm was determined based on the following formula. In the following formula, A (440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 13. The closer the absorbance retention rate is to 100, the better the weather resistance is without deterioration of the light selective absorption function.
Absorbance retention rate (%)
= (A (440) after endurance test / A (440) before endurance test) x 100
Figure JPOXMLDOC01-appb-T000098
Figure JPOXMLDOC01-appb-T000098
　（実施例１３～１５）樹脂組成物（７）～（９）（粘着剤組成物（７）～（９））の調製
　重合例２：アクリル樹脂（Ａ１）の調製
　冷却管、窒素導入管、温度計および撹拌機を備えた反応容器に、溶媒として酢酸エチル８１．８部、アクリル酸ブチル７０部、アクリル酸２－ヒドロキシエチルメチル１部、アクリル酸１部、フェノキシエチルアクリレート８部、ブトキシメチルアクリルアミド０．５部の混合溶液を仕込み、窒素ガスで反応容器内の空気を置換して酸素不含としながら内温を５５℃に上げた。その後、アゾビスイソブチロニトリル（重合開始剤）０．１４部を酢酸エチル１０部に溶かした溶液を全量添加した。重合開始剤を添加した後、１時間この温度で保持し、次いで内温を５４～５６℃に保ちながら酢酸エチルを添加速度１７．３部／ｈｒで反応容器内へ連続的に加え、アクリル樹脂の濃度が３５％となった時点で酢酸エチルの添加を止め、さらに酢酸エチルの添加開始から１２時間経過するまでこの温度で保温した。最後に酢酸エチルを加えてアクリル樹脂の濃度が２０％となるように調節し、アクリル樹脂の酢酸エチル溶液を調製した。得られたアクリル樹脂は、ＧＰＣによるポリスチレン換算の重量平均分子量Ｍｗが１２５万、Ｍｗ／Ｍｎが４．５であった。これをアクリル樹脂（Ａ１）とする。 (Examples 13 to 15) Preparation of resin compositions (7) to (9) (adhesive compositions (7) to (9)) Polymerization example 2: Preparation of acrylic resin (A1) Cooling pipe, nitrogen introduction pipe, 81.8 parts of ethyl acetate, 70 parts of butyl acrylate, 1 part of 2-hydroxyethylmethyl acrylate, 1 part of acrylic acid, 8 parts of phenoxyethyl acrylate, butoxymethyl as solvents in a reaction vessel equipped with a thermometer and a stirrer. A mixed solution of 0.5 part of acrylamide was charged, and the internal temperature was raised to 55 ° C. while replacing the air in the reaction vessel with nitrogen gas to make it oxygen-free. Then, a total amount of a solution prepared by dissolving 0.14 parts of azobisisobutyronitrile (polymerization initiator) in 10 parts of ethyl acetate was added. After adding the polymerization initiator, the mixture was kept at this temperature for 1 hour, and then ethyl acetate was continuously added into the reaction vessel at an addition rate of 17.3 parts / hr while keeping the internal temperature at 54 to 56 ° C. to form an acrylic resin. When the concentration of ethyl acetate reached 35%, the addition of ethyl acetate was stopped, and the temperature was kept at this temperature until 12 hours had passed from the start of addition of ethyl acetate. Finally, ethyl acetate was added to adjust the concentration of the acrylic resin to 20%, and an ethyl acetate solution of the acrylic resin was prepared. The obtained acrylic resin had a polystyrene-equivalent weight average molecular weight Mw of 1.25 million and Mw / Mn of 4.5 by GPC. This is referred to as acrylic resin (A1).
　表１４に示すように各成分及び各成分の含有量を変更したこと以外は実施例３と同様にして粘着剤組成物（７）～粘着剤組成物（９）を作製した。なお、架橋剤の配合量は有効成分としての質量部数であり、樹脂（Ａ）は固形分の質量部数である。 The pressure-sensitive adhesive composition (7) to the pressure-sensitive adhesive composition (9) were prepared in the same manner as in Example 3 except that each component and the content of each component were changed as shown in Table 14. The amount of the cross-linking agent blended is the number of parts by mass as the active ingredient, and the resin (A) is the number of parts by mass of the solid content.
Figure JPOXMLDOC01-appb-T000099
Figure JPOXMLDOC01-appb-T000099
　なお、表１４における各略語は以下の意味を表す。
　アクリル樹脂（Ａ１）：重合例２で合成したアクリル樹脂（Ａ１）
　式（２）：実施例２で合成した式（２）で表される化合物
　コロネートＬ：東ソー株式会社製、商品名：コロネートＬ、イソシアネート系架橋剤
　ＫＢＭ３０６６：信越化学工業株式会社製、商品名：ＫＢＭ３０６６、シランカップリング剤
　ＫＢＭ４０３：信越化学工業株式会社製、商品名：ＫＢＭ４０３、シランカップリング剤
　Ｍ－１３０Ｇ：新中村化学工業株式会社製、商品名：Ｍ－１３０Ｇ、単官能メトキシポリエチレングリコールメタクリレート
　イオン性化合物：下記式で表されるイオン性化合物
Figure JPOXMLDOC01-appb-I000100
Each abbreviation in Table 14 has the following meaning.
Acrylic resin (A1): Acrylic resin (A1) synthesized in Polymerization Example 2
Formula (2): Compound represented by the formula (2) synthesized in Example 2 Coronate L: manufactured by Toso Co., Ltd., trade name: coronate L, isocyanate-based cross-linking agent KBM3066: manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM3066, silane coupling agent KBM403: manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM403, silane coupling agent M-130G: manufactured by Shin-Nakamura Chemical Industry Co., Ltd., trade name: M-130G, monofunctional methoxypolyethylene glycol methacrylate ion Sex compound: An ionic compound represented by the following formula
Figure JPOXMLDOC01-appb-I000100
　＜樹脂組成物（７）の成形体の評価＞
　〔樹脂成形体（７）の作製〕
　得られた樹脂組成物（７）を離型処理が施されたポリエチレンテレフタレートフィルムからなるセパレートフィルム〔リンテック株式会社から入手した商品名「ＰＬＲ－３８２１９０」〕の離型処理面に、アプリケーターを用いて塗布し、温度１００℃で１分間乾燥して樹脂成形体（粘着剤層）（７）を作製した。得られた樹脂成形体（７）の厚みは２０μｍであった。 <Evaluation of molded product of resin composition (7)>
[Preparation of resin molded product (7)]
An applicator was used on the release-treated surface of a separate film [trade name "PLR-382190" obtained from Lintec Corporation] made of a polyethylene terephthalate film obtained by releasing the obtained resin composition (7). It was applied and dried at a temperature of 100 ° C. for 1 minute to prepare a resin molded product (adhesive layer) (7). The thickness of the obtained resin molded product (7) was 20 μm.
　得られた樹脂成形体（７）をラミネーターにより、厚み２３μｍの紫外線吸収剤含有シクロオレフィンフィルム〔日本ゼオン株式会社から入手した商品名「ＺＥＯＮＯＲ」〕に貼り合わせた後、温度２３℃、相対湿度６５％の条件で７日間養生し、シクロオレフィンフィルム／樹脂成形体（７）／セパレートフィルムの積層体（７）を得た。 The obtained resin molded body (7) was attached to a cycloolefin film containing an ultraviolet absorber having a thickness of 23 μm [trade name “ZEONOR” obtained from Nippon Zeon Corporation] by a laminator, and then the temperature was 23 ° C. and the relative humidity was 65. The mixture was cured under the condition of% for 7 days to obtain a laminate (7) of a cycloolefin film / resin molded product (7) / separate film.
　〔樹脂成形体（７）の吸光度測定〕
　得られた積層体（７）を３０ｍｍ×３０ｍｍの大きさに裁断し、セパレートフィルムを剥離して、樹脂成形体（７）と無アルカリガラス〔コーニング社製の商品名“ＥＡＧＬＥ　ＸＧ”〕とを貼合し、これをサンプル（７）とした。作製したサンプル（７）の波長３００～８００ｎｍ範囲の吸光度を１ｎｍステップ毎に、分光光度計（ＵＶ－２４５０：株式会社島津製作所製）を用いて測定した。測定した波長４４０ｎｍにおける吸光度を、樹脂成形体（７）の波長４４０ｎｍの吸光度とした。その結果を表１５に示す。なお、無アルカリガラス単体及びシクロオレフィンフィルム単体それぞれの波長３３０ｎｍ及び波長４４０ｎｍの吸光度は０である。
　また、以下の式に基づき波長４４０ｎｍ及び波長３３０ｎｍの透過率を求めた。結果を表１５のＴ４４０の欄に波長４４０ｎｍの透過率を示し、Ｔ３３０ｎｍの欄に波長３３０ｎｍの欄に示す。
　　Ｔ＝１０－Ａ×１００（Ｔは透過率を表し、Ａは吸光度を表す。） [Measurement of absorbance of resin molded product (7)]
The obtained laminate (7) is cut into a size of 30 mm × 30 mm, the separate film is peeled off, and the resin molded body (7) and the non-alkali glass [trade name “EAGLE XG” manufactured by Corning Inc.] are separated. They were pasted together and used as a sample (7). The absorbance of the prepared sample (7) in the wavelength range of 300 to 800 nm was measured every 1 nm step using a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation). The measured absorbance at a wavelength of 440 nm was defined as the absorbance of the resin molded product (7) at a wavelength of 440 nm. The results are shown in Table 15. The absorbance at a wavelength of 330 nm and a wavelength of 440 nm of the non-alkali glass simple substance and the cycloolefin film simple substance are 0, respectively.
Further, the transmittance at a wavelength of 440 nm and a wavelength of 330 nm was determined based on the following equations. The results are shown in the T440 column of Table 15 for the transmittance at a wavelength of 440 nm, and in the T330 nm column for a wavelength 330 nm column.
T = 10-A × 100 (T represents transmittance and A represents absorbance)
　〔樹脂成形体（７）の吸光度保持率の測定〕
　吸光度測定後のサンプル（７）を、温度６３℃、相対湿度５０％ＲＨの条件でサンシャインウェザーメーター（スガ試験機株式会社製）に７５時間投入し、耐候性試験を実施した。取り出したサンプル（７）の吸光度を上記と同様の方法で測定した。測定した吸光度から、下記式に基づき、波長４４０ｎｍにおけるサンプルの吸光度保持率を求めた。下式中、Ａ（４４０）は、波長４４０ｎｍにおける吸光度を表す。結果を表１５に示す。吸光度保持率が１００に近い値ほど、光選択吸収機能の劣化がなく良好な耐候性を有することを示す。
　吸光度保持率（％）
　　　＝（耐久試験後のＡ（４４０）／耐久試験前のＡ（４４０））×１００ [Measurement of Absorbance Retention Rate of Resin Mold (7)]
The sample (7) after the absorbance measurement was put into a sunshine weather meter (manufactured by Suga Test Instruments Co., Ltd.) under the conditions of a temperature of 63 ° C. and a relative humidity of 50% RH for 75 hours to carry out a weather resistance test. The absorbance of the taken-out sample (7) was measured by the same method as described above. From the measured absorbance, the absorbance retention rate of the sample at a wavelength of 440 nm was determined based on the following formula. In the following formula, A (440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 15. The closer the absorbance retention rate is to 100, the better the weather resistance is without deterioration of the light selective absorption function.
Absorbance retention rate (%)
= (A (440) after endurance test / A (440) before endurance test) x 100
　〔樹脂成形体（７）の耐ブリード性評価〕
　得られた樹脂成形体（７）の一方の面にさらにセパレートフィルムを積層させて両面セパレートフィルム付き樹脂成形体（７）を得た。得られた両面セパレートフィルム付き樹脂成形体（７）を２３～２５℃の空気下で１ヶ月保管した。保管後の両面セパレートフィルム付き樹脂成形体（７）を顕微鏡を用いて面内の化合物の結晶析出の有無を確認した。結晶析出がない場合をａとし、結晶析出がある場合をｂとした。評価結果を表１５の耐ブリード性の欄に示す。 [Evaluation of bleed resistance of resin molded product (7)]
A separate film was further laminated on one surface of the obtained resin molded product (7) to obtain a resin molded product (7) with a double-sided separate film. The obtained resin molded product (7) with a double-sided separate film was stored in air at 23 to 25 ° C. for 1 month. The resin molded product (7) with a double-sided separate film after storage was confirmed by using a microscope for the presence or absence of crystal precipitation of the compound in the plane. The case where there was no crystal precipitation was defined as a, and the case where there was crystal precipitation was defined as b. The evaluation results are shown in the bleed resistance column of Table 15.
　樹脂組成物（７）の代わりに樹脂組成物（８）を用いて樹脂成形体（８）、積層体（８）、及び両面セパレートフィルム付き樹脂成形体（７）を作製し、同様に評価を行った。結果を表１５に示す。 A resin molded body (8), a laminated body (8), and a resin molded body with a double-sided separate film (7) were prepared using the resin composition (8) instead of the resin composition (7), and evaluated in the same manner. went. The results are shown in Table 15.
　樹脂組成物（７）の代わりに樹脂組成物（９）を用いて樹脂成形体（９）、積層体（９）、及び両面セパレートフィルム付き樹脂成形体（９）を作製し、同様に評価を行った。結果を表１５に示す。 A resin molded body (9), a laminated body (9), and a resin molded body with a double-sided separate film (9) were prepared using the resin composition (9) instead of the resin composition (7), and evaluated in the same manner. went. The results are shown in Table 15.
Figure JPOXMLDOC01-appb-T000101
Figure JPOXMLDOC01-appb-T000101
　本発明の化合物は、波長４４０ｎｍの短波長の可視光に対する高い吸収選択性を有する。また、本発明の化合物を含む樹脂組成物は耐候性試験後も高い吸光度保持率を有し、良好な耐候性を有する。 The compound of the present invention has high absorption selectivity for short wavelength visible light having a wavelength of 440 nm. In addition, the resin composition containing the compound of the present invention has a high absorbance retention rate even after the weather resistance test, and has good weather resistance.

Claims (12)

  1. 　式（Ｘ）で表される部分構造を有するアニオンを含む化合物。
    Figure JPOXMLDOC01-appb-I000001
    ［式（Ｘ）中、環Ｗ１は、少なくとも一つの置換基を有する環構造を表す。］     A compound containing an anion having a partial structure represented by the formula (X).
    Figure JPOXMLDOC01-appb-I000001
    [In formula (X), ring W 1 represents a ring structure having at least one substituent. ]
  2. 　式（Ｘ）で表される部分構造を有するアニオンが、式（Ｉ）で表されるアニオン～式（ＶＩＩＩ）で表されるアニオンのいずれかである請求項１に記載の化合物。
    Figure JPOXMLDOC01-appb-I000002

    Figure JPOXMLDOC01-appb-I000003
    ［式中、環Ｗ１は、上記と同じ意味を表す。
    　環Ｗ２、環Ｗ３、環Ｗ４、環Ｗ５、環Ｗ６、環Ｗ７、環Ｗ８、環Ｗ９、環Ｗ１０、環Ｗ１１、環Ｗ１２、環Ｗ１３及び環Ｗ１４は、それぞれ独立して、環構造を表し、該環構造は置換基を有していてもよい。
    　Ｒ１、Ｒ２、Ｒ４、Ｒ５、Ｒ１２、Ｒ１４、Ｒ１５、Ｒ２２、Ｒ２４、Ｒ２５、Ｒ３２、Ｒ３４、Ｒ３５、Ｒ４２、Ｒ４４、Ｒ４５、Ｒ５２、Ｒ５４、Ｒ５５、Ｒ６２、Ｒ６４、Ｒ６５、Ｒ７１、Ｒ７２、Ｒ７４、Ｒ７５、Ｒ８１、Ｒ８２、Ｒ８４、Ｒ８５、Ｒ９１、Ｒ９２、Ｒ９４、Ｒ９５、Ｒ１０１、Ｒ１０２、Ｒ１０４、Ｒ１０５、Ｒ１１１、Ｒ１１２、Ｒ１１４、Ｒ１１５、Ｒ１２１、Ｒ１２２、Ｒ１２４、Ｒ１２５、Ｒ１３１、Ｒ１３２、Ｒ１３４及びＲ１３５は、それぞれ独立して、電子求引性基を表す。
    　Ｒ３は、１価の置換基を表す。
    　Ｒ１３、Ｒ２３、Ｒ３３、Ｒ４３、Ｒ５３、Ｒ６３及びＲ１３３は、１価の置換基を表す。
    　Ｒ１とＲ２とは互いに連結して環を形成してもよい。
    　Ｒ２とＲ３とは互いに連結して環を形成してもよい。
    　Ｒ３とＲ４とは互いに連結して環を形成してもよい。
    　Ｒ４とＲ５とは互いに連結して環を形成してもよい。
    　Ｒ１２とＲ１３とは互いに連結して環を形成してもよい。
    　Ｒ１３とＲ１４とは互いに連結して環を形成してもよい。
    　Ｒ１４とＲ１５とは互いに連結して環を形成してもよい。
    　Ｒ２２とＲ２３とは互いに連結して環を形成してもよい。
    　Ｒ２３とＲ２４とは互いに連結して環を形成してもよい。
    　Ｒ２４とＲ２５とは互いに連結して環を形成してもよい。
    　Ｒ３２とＲ３３とは互いに連結して環を形成してもよい。
    　Ｒ３３とＲ３４とは互いに連結して環を形成してもよい。
    　Ｒ３４とＲ３５とは互いに連結して環を形成してもよい。
    　Ｒ４２とＲ４３とは互いに連結して環を形成してもよい。
    　Ｒ４３とＲ４４とは互いに連結して環を形成してもよい。
    　Ｒ４４とＲ４５とは互いに連結して環を形成してもよい。
    　Ｒ５２とＲ５３とは互いに連結して環を形成してもよい。
    　Ｒ５３とＲ５４とは互いに連結して環を形成してもよい。
    　Ｒ５４とＲ５５とは互いに連結して環を形成してもよい。
    　Ｒ６２とＲ６３とは互いに連結して環を形成してもよい。
    　Ｒ６３とＲ６４とは互いに連結して環を形成してもよい。
    　Ｒ６４とＲ６５とは互いに連結して環を形成してもよい。
    　Ｒ７１とＲ７２とは互いに連結して環を形成してもよい。
    　Ｒ７４とＲ７５とは互いに連結して環を形成してもよい。
    　Ｒ８１とＲ８２とは互いに連結して環を形成してもよい。
    　Ｒ８４とＲ８５とは互いに連結して環を形成してもよい。
    　Ｒ９１とＲ９２とは互いに連結して環を形成してもよい。
    　Ｒ９４とＲ９５とは互いに連結して環を形成してもよい。
    　Ｒ１０１とＲ１０２とは互いに連結して環を形成してもよい。
    　Ｒ１０４とＲ１０５とは互いに連結して環を形成してもよい。
    　Ｒ１１１とＲ１１２とは互いに連結して環を形成してもよい。
    　Ｒ１１４とＲ１１５とは互いに連結して環を形成してもよい。
    　Ｒ１２１とＲ１２２とは互いに連結して環を形成してもよい。
    　Ｒ１２４とＲ１２５とは互いに連結して環を形成してもよい。
    　Ｒ１３１とＲ１３２とは互いに連結して環を形成してもよい。
    　Ｒ１３２とＲ１３３とは互いに連結して環を形成してもよい。
    　Ｒ１３３とＲ１３４とは互いに連結して環を形成してもよい。
    　Ｒ１３４とＲ１３５とは互いに連結して環を形成してもよい。
    　Ｒｘ１、Ｒｘ４及びＲｘ７は、それぞれ独立して、単結合又は２価の連結基を表す。
    　Ｒｘ２は及びＲｘ５は、それぞれ独立して、３価の連結基を表す。
    　Ｒｘ３及びＲｘ６は、それぞれ独立して、４価の連結基を表す。］     The compound according to claim 1, wherein the anion having a partial structure represented by the formula (X) is any of an anion represented by the formula (I) to an anion represented by the formula (VIII).
    Figure JPOXMLDOC01-appb-I000002

    Figure JPOXMLDOC01-appb-I000003
    [In the equation, ring W 1 has the same meaning as above.
    Ring W 2 , Ring W 3 , Ring W 4 , Ring W 5 , Ring W 6 , Ring W 7 , Ring W 8 , Ring W 9 , Ring W 10 , Ring W 11 , Ring W 12 , Ring W 13, and Ring W Each of 14 independently represents a ring structure, and the ring structure may have a substituent.
    R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 , R 125 , R 131 , R 132 , R 134 and R 135 , Each independently represents an electron-attracting group.
    R 3 represents a monovalent substituent.
    R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represent monovalent substituents.
    R 1 and R 2 may be connected to each other to form a ring.
    R 2 and R 3 may be connected to each other to form a ring.
    R 3 and R 4 may be connected to each other to form a ring.
    R 4 and R 5 may be connected to each other to form a ring.
    R 12 and R 13 may be connected to each other to form a ring.
    R 13 and R 14 may be connected to each other to form a ring.
    R 14 and R 15 may be connected to each other to form a ring.
    R 22 and R 23 may be connected to each other to form a ring.
    R 23 and R 24 may be connected to each other to form a ring.
    R 24 and R 25 may be connected to each other to form a ring.
    R 32 and R 33 may be connected to each other to form a ring.
    R 33 and R 34 may be connected to each other to form a ring.
    R 34 and R 35 may be connected to each other to form a ring.
    R 42 and R 43 may be connected to each other to form a ring.
    R 43 and R 44 may be connected to each other to form a ring.
    R 44 and R 45 may be connected to each other to form a ring.
    R 52 and R 53 may be connected to each other to form a ring.
    R 53 and R 54 may be connected to each other to form a ring.
    R 54 and R 55 may be connected to each other to form a ring.
    R 62 and R 63 may be connected to each other to form a ring.
    R 63 and R 64 may be connected to each other to form a ring.
    R 64 and R 65 may be connected to each other to form a ring.
    R 71 and R 72 may be connected to each other to form a ring.
    R 74 and R 75 may be connected to each other to form a ring.
    R 81 and R 82 may be connected to each other to form a ring.
    R 84 and R 85 may be connected to each other to form a ring.
    R 91 and R 92 may be connected to each other to form a ring.
    R 94 and R 95 may be connected to each other to form a ring.
    R 101 and R 102 may be connected to each other to form a ring.
    R 104 and R 105 may be connected to each other to form a ring.
    R 111 and R 112 may be connected to each other to form a ring.
    R 114 and R 115 may be connected to each other to form a ring.
    R 121 and R 122 may be connected to each other to form a ring.
    R 124 and R 125 may be connected to each other to form a ring.
    R 131 and R 132 may be connected to each other to form a ring.
    R 132 and R 133 may be connected to each other to form a ring.
    R 133 and R 134 may be connected to each other to form a ring.
    R 134 and R 135 may be connected to each other to form a ring.
    R x1 , R x4 and R x7 each independently represent a single bond or a divalent linking group.
    R x2 and R x5 each independently represent a trivalent linking group.
    R x3 and R x6 each independently represent a tetravalent linking group. ]
  3. 　Ｒ３が電子求引性基である請求項２に記載の化合物。 The compound according to claim 2, wherein R 3 is an electron-attracting group.
  4. 　Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基、ニトロ基、ハロゲン化アルキル基、ハロゲン化アリール基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＣＯ－ＮＲ３Ｒ３ｋ、－ＣＯ－Ｓ－Ｒ４、－ＣＳ－Ｒ５、－ＣＳ－Ｏ－Ｒ６、－ＣＳ－Ｓ－Ｒ７、－ＳＯ－Ｒ８、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２、Ｒ３、Ｒ３ｋ、Ｒ４、Ｒ５、Ｒ６、Ｒ７、Ｒ８及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＯＣＦ３、－ＳＣＦ３、－ＳＦ５、－ＳＦ３、－ＳＯ２Ｈ又は－ＳＯ３Ｈである請求項２又は３に記載の化合物。 At least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group, a nitro group, an alkyl halide group, an aryl halide group, -CO-R 1 , -CO-OR 2 , -CO-NR 3 R 3k , -CO-S-R 4 , -CS-R 5 , -CS- OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2- R 9 (R 1 , R 2 , R 3 , R 3k , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 may have independent substituents, respectively, hydrocarbon groups or halogens. represents an atom), -. OCF 3, -SCF 3, -SF 5, -SF 3, a compound according to claim 2 or 3 is -SO 2 H or -SO 3 H.
  5. 　Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基、ニトロ基、－ＣＯ－Ｒ１、－ＣＯ－Ｏ－Ｒ２、－ＳＯ２－Ｒ９（Ｒ１、Ｒ２及びＲ９はそれぞれ独立して置換基を有していてもよい炭化水素基またはハロゲン原子を表す。）、－ＳＦ５、－ＳＦ３、－ＳＯ３Ｈ、－ＳＯ２Ｈ、－ＯＣＦ３又は－ＳＣＦ３である請求項２～４のいずれかに記載の化合物。 R 1, R 2, R 3 , at least one selected from R 4 and R 5, a cyano group, a nitro group, -CO-R 1, -CO- O-R 2, -SO 2 -R 9 (R 1 , R 2 and R 9 represent hydrocarbon groups or halogen atoms that may independently have substituents, respectively.), -SF 5 , -SF 3 , -SO 3 H, -SO 2 H,- The compound according to any one of claims 2 to 4, which is OCF 3 or -SCF 3.
  6. 　Ｒ１、Ｒ２、Ｒ３、Ｒ４及びＲ５から選ばれる少なくとも一つが、シアノ基又はニトロ基である請求項２～５のいずれかに記載の化合物。 The compound according to any one of claims 2 to 5, wherein at least one selected from R 1 , R 2 , R 3 , R 4 and R 5 is a cyano group or a nitro group.
  7. 　波長４００ｎｍ～波長５５０ｎｍの間に極大吸収を示す請求項１～６のいずれかに記載の化合物。 The compound according to any one of claims 1 to 6, which exhibits maximum absorption between a wavelength of 400 nm and a wavelength of 550 nm.
  8. 　極大吸収波長におけるグラム吸光係数が０．５以上である請求項１～７のいずれかに記載の化合物。 The compound according to any one of claims 1 to 7, wherein the gram absorption coefficient at the maximum absorption wavelength is 0.5 or more.
  9. 　下記式（ａ）を満たす請求項１～８のいずれかに記載の化合物。
    　　ε（λｍａｘ）／ε（λｍａｘ＋３０ｎｍ）≧５　　　　（ａ）
    ［式中、ε（λｍａｘ）は、極大吸収波長（λｍａｘ）におけるグラム吸光係数を表す。
    　ε（λｍａｘ＋３０ｎｍ）は、極大吸収波長（λｍａｘ）＋３０ｎｍの波長におけるグラム吸光係数を表す。
    　なお、グラム吸光係数の単位は、Ｌ／（ｇ・ｃｍ）である。］     The compound according to any one of claims 1 to 8, which satisfies the following formula (a).
    ε (λ max ) / ε (λ max + 30 nm) ≧ 5 (a)
    Wherein, epsilon (.lambda.max) represents the gram extinction coefficient at the maximum absorption wavelength (lambda max).
    ε (λ max + 30 nm) represents the gram absorption coefficient at the maximum absorption wavelength (λ max) + 30 nm.
    The unit of the gram extinction coefficient is L / (g · cm). ]
  10. 　請求項１～９のいずれかに記載の化合物を含む組成物。 A composition containing the compound according to any one of claims 1 to 9.
  11. 　請求項１０に記載の組成物を成形してなる成形物。 A molded product obtained by molding the composition according to claim 10.
  12. 　波長４４０ｎｍにおける透過率が５０％以下である請求項１１に記載の成形物。 The molded product according to claim 11, wherein the transmittance at a wavelength of 440 nm is 50% or less.
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