WO2021190552A1 - 移动终端及中框组件 - Google Patents

移动终端及中框组件 Download PDF

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Publication number
WO2021190552A1
WO2021190552A1 PCT/CN2021/082689 CN2021082689W WO2021190552A1 WO 2021190552 A1 WO2021190552 A1 WO 2021190552A1 CN 2021082689 W CN2021082689 W CN 2021082689W WO 2021190552 A1 WO2021190552 A1 WO 2021190552A1
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WO
WIPO (PCT)
Prior art keywords
heat
middle frame
equalizing plate
area
frame assembly
Prior art date
Application number
PCT/CN2021/082689
Other languages
English (en)
French (fr)
Inventor
孙永富
杨杰
施健
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202020393505.XU external-priority patent/CN212164015U/zh
Priority claimed from CN202010217496.3A external-priority patent/CN113453479A/zh
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21774280.8A priority Critical patent/EP4117405A4/en
Publication of WO2021190552A1 publication Critical patent/WO2021190552A1/zh
Priority to US17/951,274 priority patent/US20230022994A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion

Definitions

  • This application relates to the field of terminal technology, and in particular to a mobile terminal and its middle frame assembly.
  • the embodiments of the present application provide a terminal and a middle frame assembly thereof, which improve the heat dissipation performance of the mobile terminal.
  • the present invention provides a middle frame assembly for carrying electronic devices in a mobile terminal.
  • the electronic devices include a heat source.
  • the middle frame assembly includes a middle frame, one or more heat pipes, and a first heat equalizing plate.
  • the middle frame includes a heat dissipation area corresponding to the heat source, and the first heat equalizing plate is accommodated in the heat dissipation area; the first heat equalizing plate can also be fixedly connected to the middle frame through the heat dissipation area, and the specific fixing method is not It is limited to the following: it can be fixed to the middle frame by bottom welding, side welding to the middle frame, bottom glued to the middle frame, or fixedly connected to the middle frame by a surrounding lap structure, or by The bottom surface is fixed and connected to the middle frame in a manner of fixing around the circumference; each of the heat pipes is connected to the first heat equalizing plate (the connection between the two is not limited to lap welding fixing, welding and sealing after connection, etc.), using To dissipate heat from the first heat
  • one end of the heat pipe is connected to the first heat equalizing plate, and the comprehensive heat conduction effect of the two-dimensional extended heat conduction of the first heat equalizing plate and the one-dimensional linear heat conduction of the heat pipe can be used to quickly dissipate the heat of the heat source and increase the heat source.
  • the service life of the mobile terminal increases the service life of the mobile terminal and improves the consumer experience.
  • At least one of the one or more heat pipes is also connected to a part of the middle frame whose temperature is lower than the temperature of the first heat equalizing plate.
  • the part where the temperature of the middle frame is lower than the temperature of the first soaking plate may be the area of the edge of the middle frame, such as the two sides of the middle frame or the bottom edge of the middle frame.
  • At least one of the one or more heat pipes is connected to the middle frame through a heat conducting medium.
  • the heat-conducting medium can be heat-conducting glue or graphite material.
  • the thermal conductivity of the thermally conductive adhesive is more than twice that of the ordinary adhesive layer. It has good thermal conductivity, can quickly transfer the heat from the heat pipe to the entire middle frame, and has high heat dissipation efficiency.
  • the internal space of at least one of the one or more heat pipes communicates with the internal space of the first heat equalizing plate to form a heat conduction cavity.
  • the connected heat pipe and the first heat spreading plate form a large and complete heat conduction cavity inside.
  • the working fluid in the heat conduction cavity completes a heat conduction cycle through a longer path and a longer time, which can transfer the heat of the heat source to the center.
  • the heat is conducted out in a more dispersed manner, and the heat dissipation efficiency is high.
  • At least one heat pipe of the one or more heat pipes is inserted into the inside of the first heat equalizing plate.
  • the heat pipe in this manner overlaps with the first heat equalizing plate inside the first equalizing plate.
  • the communication performance between the heat pipe and the first soaking plate is better.
  • the electronic device further includes a battery spaced apart from the heat source
  • the middle frame further includes a battery placement area corresponding to the battery
  • the battery placement includes first edges and At the second edge, the heat dissipation area is adjacent to the first edge, and at least one heat pipe of the one or more heat pipes extends in a direction from the heat dissipation area toward the second edge.
  • the heat pipe can extend in a larger area of the middle frame, can transfer the heat of the heat source to a longer distance, and has a good heat dissipation effect.
  • At least one of the one or more heat pipes is not in contact with the battery. Therefore, when the mobile terminal is operating normally, the mobile terminal generates heat and the temperature of the part where the heat pipe is connected to the middle frame is lower than the first heat equalizing plate. When the heat pipe is not in contact with the battery, the heat on the heat pipe and the battery will not be transferred to each other. There is no mutual interference with the battery, and the heat pipe is arranged around the battery, so there is no need to provide a space for the heat pipe on the surface of the battery, which is conducive to the slim design of the mobile terminal.
  • the one or more heat pipes include a first heat pipe and a second heat pipe that are spaced apart, the first heat pipe surrounds the battery placement area, and the second heat pipe part is placed on the battery. Area overlap setting.
  • heat pipes are arranged in the battery placement area and the periphery of the battery placement area to enhance the heat dissipation performance.
  • the middle frame includes a top, a bottom disposed opposite to the top, and two side walls located at the top and the bottom, and the heat dissipation area is located on all sides of the battery placement area. Between the first edge and the top, another component placement area is provided between the second edge and the bottom of the battery placement area, the middle frame also includes a second heat equalizing plate, and the first Two heat equalizing plates are fixed in the other element placement area, and at least one heat pipe of the one or more heat pipes is also connected to the second equalizing plate.
  • the heat of the heat source can be conducted to the first heat equalizing plate and to the heat pipe, and the heat of other heat sources can be conducted to the second heat equalizing plate and conduction
  • the combined action of the first heat equalizing plate, the second heat equalizing plate and the heat pipe can quickly dissipate the heat of the heat source and other heat sources, increasing the service life of the heat source and other heat sources, and thus increasing the service life of the mobile terminal , To enhance the consumer experience.
  • the heat of the heat source and other heat sources can be conducted to the entire middle frame, and the heat is conducted out through the middle frame to realize the heat dissipation performance of the entire middle frame.
  • the area of the frame is large, the heat dissipation efficiency is high, and the heat dissipation performance of the entire mobile terminal is improved.
  • one end of at least one heat pipe of the one or more heat pipes is overlapped on the first heat equalizing plate, and the other end of at least one heat pipe of the one or more heat pipes is overlapped.
  • This implementation test provides the connection method of the heat pipe with the first and second heat equalizing plates.
  • the overlap refers to the direction perpendicular to the first and second heat equalizing plates.
  • At least one of the one or more heat pipes extends along the periphery of the battery placement area, and at least part of the heat pipe is located between the battery placement area and the side wall of the middle frame Within the gap.
  • the gap between the battery placement area and the side wall of the middle frame is an idle space.
  • part of the heat pipes are accommodated in the gap between the battery placement area and the side wall of the middle frame, that is, part of the heat pipes are accommodated in the idle space. This not only makes use of the idle space, but also does not need to provide a new space in the mobile terminal for accommodating the heat pipe, thereby not increasing the volume of the mobile terminal.
  • At least one of the one or more heat pipes is also in contact with the surface of the battery. Therefore, the heat on the battery can also be transferred to the heat pipe, and then to the entire middle frame, so that the middle frame can dissipate heat from the battery.
  • the heat dissipation area is large and the heat dissipation effect is good.
  • the one or more heat pipes include at least a first heat pipe and a second heat pipe arranged at intervals, and the first heat pipe and the second heat pipe are both arranged around the battery placement area.
  • the space between the battery placement area and the side wall is utilized, and the two heat pipes will not overlap with the battery placement area and will not affect the thickness of the middle frame.
  • the heat pipe will not overlap with the battery, and the thickness of the mobile terminal will not be affected.
  • At least one of the one or more heat pipes includes at least a first heat pipe and a second heat pipe arranged at intervals, the first heat pipe surrounds the battery placement area, and the second heat pipe Overlap on the battery placement area.
  • the middle frame has a larger area for heat dissipation and good heat dissipation effect, which can quickly dissipate the heat of the heat source, increase the service life of the heat source, and increase the use of mobile terminals. Life expectancy improves consumer experience; the space between the battery placement area and the side wall of the middle frame and other spaces can also be effectively used.
  • the way in which the second heat pipe overlaps the battery placement area facilitates the installation and operation of the second heat pipe, and the second heat pipe can be used to dissipate the heat of the battery.
  • the middle frame is provided with a first excavation area and a third excavation area, the third excavation area is formed at the bottom of the first excavation area, and the first excavation area
  • the hot plate is embedded in the first excavated area, at least one heat pipe of the one or more heat pipes is partially embedded in the third excavated area, and in a part of the third excavated area, the one or At least one heat pipe of the plurality of heat pipes is stacked and arranged with the first heat equalizing plate, the first excavated area is a groove or hole, and the second excavated area is a groove or hole.
  • part of the heat pipe is located between the first heat equalizing plate and the heat source, and when the first excavated area and the second excavated area are grooved structures, the openings of the first excavated area and the second excavated area Facing the side of the middle frame away from the heat source, the heat source and the heat pipe and the first heat equalizing plate are separated by a middle frame, and the middle frame is used to support the heat source.
  • the middle frame is provided with a first excavation area, a second excavation area, and a third excavation area
  • the first heat equalizing plate is embedded in the first excavation area
  • the second heat equalizing plate is embedded in the second excavated area
  • at least one heat pipe of the one or more heat pipes is embedded in the third excavated area
  • the first excavated area is a slot or hole
  • the second excavated area is a slot or hole
  • the third excavated area is a slot or hole.
  • first excavation area, the second excavation area, and the third excavation area can be provided in one embodiment at the same time. In other embodiments, one or the other of the three excavation areas can also be selectively provided.
  • This architecture is conducive to the overall thin design of the mobile terminal and can reduce the weight of the mobile terminal.
  • At least one of the one or more heat pipes is connected to the first heat equalizing plate, which means that their internal spaces are connected to each other to form a larger heat conduction cavity.
  • the connected heat pipe and the first heat spreading plate form a large and complete heat conduction cavity inside.
  • the working fluid in the heat conduction cavity completes a heat conduction cycle through a longer path and a longer time, which can transfer the heat of the heat source to the center.
  • the heat pipe and the second heat equalizing plate can also be arranged as a connected structure.
  • the thickness of the first heat equalizing plate increases in steps, and/or the thickness of the second heat equalizing plate increases in steps. In this way, it can be adapted to electronic devices whose height is gradually decreasing.
  • the number of heat pipes, the first heat equalizing plate, and the second equalizing plate is not limited to one, and may also be two or more, and the configuration is performed according to the specific heat dissipation requirements in the mobile terminal.
  • At least one of the one or more heat pipes, the first heat equalizing plate, and the second equalizing plate are provided with a thermally conductive film on the outer surface thereof .
  • the arrangement of the heat-conducting film makes the heat from the heat pipe and the heat equalizing plate conduct to the outside faster.
  • the middle frame is provided with a groove, the first heat equalizing plate is accommodated in the groove, and the first equalizing plate and the bottom of the groove are fixed by a thermally conductive glue.
  • the middle frame includes a first overlapping edge extending toward the groove, the first heat equalizing plate includes a third overlapping edge, and the first overlapping edge is connected to the third overlapping edge. The edges are lapped and fixed.
  • the middle frame may also include a second overlapping edge for fixing the second heat equalizing plate.
  • the first heat equalizing plate includes a third overlapping edge, and the first overlapping edge is overlapped with the third overlapping edge, so that the first equalizing plate is fixed on the heat dissipation area.
  • the one lap side and the third lap side can be fixed by welding.
  • the second heat equalizing plate may include a fourth overlapping edge, and the second overlapping edge is overlapped with the fourth overlapping edge, so that the second equalizing plate is fixed to the other element. Placement area.
  • This fixing method is not only easy to implement, but also has a good fixing effect.
  • the groove opened on the middle frame may be a hole, and when the groove is a hole, the middle frame is not used for The part that carries the first heat equalizing plate, but the connection between the first equalizing plate and the middle frame can be realized by overlapping edges.
  • the first groove opened on the middle frame may also be a blind hole, that is, the first groove is not a hole, so there is a part of the structure on the middle frame, which can be called a bearing part, which can be used to carry the first uniform
  • the first heat equalizing plate is fixed to the bearing part of the middle frame by thermally conductive glue.
  • the overlap structure can also be set, that is, the first overlap edge on the middle frame and the third overlap edge on the first heat spreading plate cooperate to enhance The reliability of the connection between the first soaking plate and the middle frame.
  • the first heat equalizing plate and the middle frame are fixed by the cooperation of the thermal conductive glue and the overlapping structure.
  • At least one of the one or more heat pipes extends between the electronic device, and/or at least one of the one or more heat pipes is connected between the electronic device and the electronic device. Extend between the borders of the middle frame. In this way, not only can the gap between the electronic devices and the gap between the electronic device and the boundary of the middle frame be used to house the heat pipe, but also there is no need to add new space for the heat pipe, and there is no need to increase the thickness of the mobile terminal.
  • the present application provides a mobile terminal, including a main board and the above-mentioned middle frame, the main board includes the electronic device, the main board is installed in the middle frame, and the heat source of the main board is arranged in the middle frame. Cooling area.
  • the heat on the mobile terminal can be quickly dissipated, which increases the service life of the mobile terminal and improves the consumer experience.
  • the first heat equalizing plate is fixed on the middle frame, the heat of the heat source can be conducted to the entire middle frame, and the heat is conducted out through the middle frame to realize the heat dissipation performance of the entire middle frame.
  • the middle frame has a large area and high heat dissipation efficiency. Improve the heat dissipation performance of the entire mobile terminal.
  • the mobile terminal further includes a screen, a motherboard, a battery, and a battery cover
  • the middle frame also includes a battery placement area corresponding to the battery, and the battery placement area is provided in the heat dissipation area.
  • the screen and the main board are respectively installed on opposite sides of the middle frame, the heat source of the main board is arranged in the heat dissipation area of the middle frame, and the battery is electrically connected to the main board.
  • the battery is located on the side of the motherboard away from the middle frame, and the battery is located in the battery placement area
  • the battery cover is installed on the middle frame, and the battery cover protects the The main board and the battery are fixed in the middle frame.
  • a wire slot is provided on the outer surface of the heat pipe, and the wire slot is used to fix the inner wire of the mobile terminal, and the wire is used to electrically connect the electronic device in the mobile terminal.
  • the wire is used to electrically connect the electronic device in the heat dissipation area and the electronic device in the other component placement area.
  • the wire groove on the surface of the heat pipe can be used as the carrier of the wire, so that the wire can be fixed in the wire groove of the heat pipe, thereby fixing the position of the wire, avoiding damage to the wire due to shaking, and improving the service life of the mobile terminal.
  • the present application also provides a mobile terminal, including a main board and the middle frame assembly of any one of the foregoing, the heat source is provided on the main board, and the main board is installed in the middle frame.
  • the present application also provides a heat dissipation assembly, including the first aspect and at least one heat spreading plate and at least one heat pipe in various implementations of the first aspect, wherein the at least one heat spreading plate is connected to the at least one heat pipe
  • a heat dissipation assembly including the first aspect and at least one heat spreading plate and at least one heat pipe in various implementations of the first aspect, wherein the at least one heat spreading plate is connected to the at least one heat pipe
  • the heat dissipation assembly provided in this aspect can cooperate with the middle frame in the mobile terminal as described in the previous aspect to achieve better heat dissipation. In other implementations, it can also cooperate with other devices of other devices to achieve better heat dissipation.
  • the present application connects one end of the heat pipe with the first heat equalizing plate, and the comprehensive heat conduction effect of the two-dimensional extended heat conduction of the heat equalizing plate and the one-dimensional linear heat conduction of the heat pipe can be used to quickly dissipate the heat of the heat source.
  • the service life of the heat source is increased, thereby increasing the service life of the mobile terminal, and improving the user experience of consumers.
  • the first heat equalizing plate is fixed on the middle frame, the heat of the heat source can be conducted to the entire middle frame, and the heat is conducted out through the middle frame to realize the heat dissipation performance of the entire middle frame.
  • the middle frame has a large area and high heat dissipation efficiency. Improve the heat dissipation performance of the entire mobile terminal.
  • Figure 1a is a schematic cross-sectional view of a mobile terminal provided by an embodiment of the present invention.
  • Figure 1b is another schematic cross-sectional view of a mobile terminal according to an embodiment of the present invention.
  • FIG. 2 is a schematic top view of a middle frame in a middle frame assembly provided by an embodiment of the present invention
  • FIG. 3 is a schematic top view of the first structure of the middle frame assembly provided by the embodiment of the present invention.
  • FIG. 4 is a schematic top view of the second structure of the middle frame assembly provided by the embodiment of the present invention.
  • Figure 5 is a schematic cross-sectional view of the overlap of the heat pipe and the first soaking plate
  • Figure 6 is a schematic cross-sectional view of the heat pipe communicating with the first heat equalizing plate
  • Fig. 7 is a schematic cross-sectional view of the thickness of the first heat equalizing plate increasing in steps
  • FIG. 8 is a schematic top view of a third structure of the middle frame provided by an embodiment of the present invention.
  • Fig. 9 is a schematic cross-sectional view of the heat pipe overlapping the first heat equalizing plate and the second equalizing plate;
  • FIG. 10 is a schematic cross-sectional view of the heat pipe communicating with the first heat equalizing plate and the second equalizing plate;
  • FIG. 11 is a schematic top view of a fourth structure of the middle frame assembly provided by an embodiment of the present invention.
  • FIG. 12 is a schematic top view of a fifth structure of the middle frame assembly provided by an embodiment of the present invention.
  • Fig. 13 is a schematic top view of a sixth structure of the middle frame assembly provided by an embodiment of the present invention.
  • FIG. 1a and FIG. 1b are schematic cross-sectional views of two mobile terminals provided by an embodiment of the present invention.
  • Mobile terminals include, but are not limited to, devices such as tablet computers, mobile phones, watches, e-readers, remote controls, personal computers (PC), notebook computers, in-vehicle devices, Internet TVs, and wearable devices.
  • the mobile terminal may include a main board 10, a screen 20, a battery 30, a middle frame assembly 40, and a battery cover 110.
  • the motherboard 10 may include a variety of electronic devices. Among them, some electronic devices (such as various processors) generate a relatively large amount of heat during operation, and usually require heat dissipation (such as installing some heat sinks). In this application These electronic devices are called heat sources.
  • the middle frame assembly 40 may include a middle frame 401, a heat pipe 60, and a first vapor chamber (VC, Vapor Chamber) 70.
  • the middle frame 401 is an internal support of the device, which can be used to carry the screen 20, the main board 10 and other electronic devices.
  • the screen 20 and the main board 10 are respectively installed on opposite sides of the middle frame 401.
  • the battery 30 and the main board 10 are located on the same side of the middle frame 401.
  • the battery 30 is electrically connected to the main board 10, and the battery cover 110 and the middle frame 401 form a container.
  • the main board 10, the battery 30 and other electronic devices are accommodated in the accommodating space, and the other electronic devices may be cameras, cameras, buttons, speakers, etc.
  • the material of the middle frame 401 may be a metal material with a certain hardness, such as aluminum alloy.
  • the heat pipe 60 and the first heat equalizing plate 70 are integrated on the middle frame 401 to form the middle frame assembly 40 to improve the heat dissipation performance of the mobile terminal.
  • Both the soaking plate and the heat pipe have a vacuum heat-conducting cavity, and the inner wall of the heat-conducting cavity has a capillary structure and is injected with a working fluid, which can be pure water.
  • the working principle of two-phase heat dissipation components such as VC and heat pipe is similar, including the four main steps of conduction, evaporation, convection, and solidification.
  • the explanation is as follows: the heat generated by the heat source enters the soaking plate through heat conduction, close to The working fluid at the heat source position quickly vaporizes after absorbing heat, while taking away a large amount of heat; reusing the latent heat of steam, when the steam in the plate diffuses from the high pressure zone (ie high temperature zone) to the low pressure zone (ie low temperature zone), the steam contacts the temperature When the inner wall is lower, it will quickly condense into a liquid state and release heat energy; the working fluid condensed into a liquid will return to the heat source through the capillary force of the fine structure, thus completing a heat conduction cycle, forming a working fluid in which both vapor and liquid phases coexist.
  • the area of the soaking plate is larger than that of the heat pipe, which can realize two-dimensional expansion of heat conduction.
  • the width of the heat pipe is relatively narrow, and it can conduct one-dimensional linear heat conduction, specifically, conduct one-dimensional heat conduction along the extending direction of the heat pipe.
  • the material of the heat pipe is usually a metal material, such as aluminum or copper.
  • the material of the soaking plate is usually metal, for example, copper can be selected.
  • the physical parameters of the heat pipe 60 and the soaking plate can be the same, or at least one of the physical parameters can be different, such as different shell material combinations, different internal working fluid materials, Different capillary structures (capillary layer cross-sectional area), etc., one or more of the working quality (that is, the filling amount of working fluid), the type of working fluid, the tube material of the heat pipe 60 (may be copper or aluminum), and the thickness.
  • FIG. 2 shows a schematic top view of the structure of the middle frame 401 in an embodiment of the present application.
  • the middle frame 401 includes a top 401a, a bottom 401b opposite to the top 401a, and two opposite side walls 401c and 401d between the top 401a and the bottom 401b.
  • the top 401a, the bottom 401b, and the two side walls are described here.
  • 401c refers to the four sides of the periphery of the middle frame (the four sides from the schematic diagram shown in Fig. 2 are actually the middle outer surface of the middle frame from a three-dimensional point of view, and these four faces are the edges of the mobile terminal. The border surface of the connection between the screen and the back cover).
  • the mobile terminal uses a mobile phone as an example, the middle frame is roughly rectangular, and the two side walls 401c are the long sides of the middle frame.
  • the middle frame 401 may include a heat dissipation area 402 corresponding to the heat source 101, a battery placement area 403 corresponding to the battery 30, and other component placement areas 404.
  • the heat dissipation area 402 is located between the battery placement area 403 and the top 401a, and the other component placement area 404 is located between the battery placement area 403 and the bottom 401b.
  • the heat dissipation area 402 may also be located between the battery placement area 403 and a side wall 403a.
  • the heat dissipation area 402 is used to provide a part of space for installing one or more radiators (such as VC, or heat pipes, etc.) to dissipate heat from the heat source.
  • the heat dissipation area 402 can be a cut-out area on the middle frame 401, that is, an area where part of the middle frame material is dug out. Specifically, part of the middle frame material can be dug out to form a "trough", or it can also be dug out. All the materials of the middle frame form a "hole"; of course, in other embodiments, the material on the heat dissipation area 402 may not be excavated.
  • a hole can be drilled on the middle frame 401, and the holed area can be used to accommodate a heat source (such as a processor) on the motherboard, and then a VC is installed on the heat source to dissipate the heat.
  • the heat dissipation area 402 can also be a physical area on the middle frame 401 without digging holes, but can be slotted to accommodate the heat source or VC (for example, both the front and back sides can be slotted to simultaneously accommodate the VC and the heat source, or Only one side is slotted to accommodate VC or heat source).
  • neither hole nor groove may be drilled, or both hole and groove may be drilled and grooved (there may be grooves and holes in a region at the same time, or the grooves and holes may be arranged at intervals).
  • the battery placement area 403 and other component placement areas 404 may also be hollowed out areas or solid areas on the middle frame 401 or a combination of these two areas.
  • the "groove” in this application refers to a recessed structure that does not penetrate the middle frame, and the shape is not limited (for example, it can be rectangular, square, round or various irregular shapes); the "hole” in this application (also It can be understood as a "hole” or “opening”) as a structure formed through the middle frame, and the shape is not limited.
  • the battery placement area 403 includes a first edge 403a, a second edge 403b, a third edge 403c, and a fourth edge 403d.
  • the heat dissipation area 402 is located between the first edge 403a and the top 401a of the battery placement area 403.
  • No electronic devices are arranged between the side walls 401c of the 401, and the heat pipe 60 is arranged at the position of the gap 50 in this application, which can improve the heat dissipation performance.
  • a first gap 501 is provided between the third edge 403c and the first side wall 401c
  • a second gap 502 is provided between the fourth edge 403d and the second side wall 401d.
  • the middle frame 401 at the position of the first gap 501 and the second gap 502 can be provided with grooves or holes.
  • the hole refers to the hollowing out of the middle frame to form a through hole.
  • grooves and holes can be for the thinness of mobile terminals Modified design can also reduce the weight of the middle frame 401, but in order to ensure the rigidity of the middle frame 401, slots or holes can be provided at appropriate positions, and the thickness is reserved at the appropriate positions to ensure the overall rigidity of the middle frame 401, making it difficult to Deformation, and can carry electronic devices.
  • FIG. 3 shows a schematic top view of the middle frame assembly 40.
  • the first heat equalizing plate 70 is accommodated in the heat dissipation area 402.
  • the first heat equalizing plate 70 can be fixedly connected to the middle frame 401 at the heat dissipation area 402.
  • the specific fixing method is not limited to the following: it can be welded through the bottom It is fixed to the middle frame 401 by way of side welding, and fixed to the middle frame 401 by way of bottom bonding, or fixedly connected to the middle frame 401 by a peripheral lap structure, or fixed by the bottom surface and fixed around the circumference. Connected to the middle frame 401 in a way.
  • the heat pipe 60 is connected to the first heat equalizing plate 70 to dissipate the heat of the first equalizing plate 70.
  • the connection between the two is not limited to lap welding and fixing, and welding and sealing after connecting.
  • the thickness of the first heat equalizing plate 70 may be less than or equal to 0.8 mm, and the nominal pipe diameter of the heat pipe 60 may be less than or equal to 8 mm. In order to satisfy the requirement that the mobile terminal can be thinner, the thickness of the heat pipe 60 may be less than or equal to 0.6 mm.
  • the small-sized heat pipe 60 can extend between the electronic devices or between the electronic device and the side wall of the middle frame 401, and utilize the space between the electronic devices and the gap between the electronic device and the side wall of the middle frame 401 to improve heat dissipation.
  • the thickness of the first heat equalizing plate 70 and the thickness of the heat pipe 60 may be the same or different.
  • the heat pipe 60 can be made into unequal thickness, unequal width, bending, forming a step, etc., which are determined according to specific usage scenarios.
  • one end of the heat pipe 60 is connected to the first heat equalizing plate 70, and the comprehensive heat conduction effect of the two-dimensional extended heat conduction of the equalizing plate and the one-dimensional linear heat conduction of the heat pipe 60 can be used to quickly dissipate the heat of the heat source 101 and increase
  • the service life of the heat source 101 is reduced, the temperature of the heat source is reduced, the service life of the mobile terminal is increased, the temperature during use is reduced, and the user experience of consumers is improved.
  • the first heat equalizing plate 70 can be fixed on the middle frame 401.
  • the first heat equalizing plate 70 can be fixedly connected to the middle frame 401 by welding, and the heat of the heat source 101 can be conducted through the first heat equalizing plate 70.
  • the middle frame assembly 40 has a large area, high heat dissipation efficiency, and improves the heat dissipation performance of the entire mobile terminal.
  • the fixing methods of the first heat equalizing plate 70 in the heat dissipation area 402 include but are not limited to the following two.
  • the first type: the heat dissipation area 402 is a hole, so that even if the thickness of the first heat equalizing plate 70 is thick, the hole can contain the thicker first equalizing plate 70, and the first equalizing plate 70 will not increase the middle frame The thickness of the component 40. Moreover, the arrangement of the holes can make the first heat equalizing plate 70 not increase the thickness of the middle frame assembly 40 to a greater extent. At the same time, for better heat dissipation and fixation, the first heat equalizing plate 70 may also be fixedly connected to the middle frame 401 through an overlap structure.
  • the middle frame 401 includes a first overlapping edge 401a, the first overlapping edge 401a extends toward the hole, the first heat equalizing plate 70 includes a third overlapping edge 70a, and the third overlapping edge 70a protrudes On the periphery of the first heat equalizing plate 70, the first overlapping edge 401a and the third overlapping edge 70a overlap, and the overlap between the two can be fixed by welding or by glue, In this way, the first heat equalizing plate 70 is fixed on the middle frame 401 (see FIG. 1b).
  • the first heat equalizing plate is also used for connecting with the heat source and dissipating heat from the heat source, for example, connecting and dissipating heat by means of thermally conductive adhesive.
  • the heat dissipation area 402 is a groove, that is, a certain thickness of the middle frame material is reserved in the heat dissipation area 402 for supporting the first heat equalizing plate 70, the first heat equalizing plate 70 is embedded in the groove, and the first heat equalizing plate 70 It can be fixed and pasted on the bottom wall of the tank by thermally conductive glue, that is, between the first heat equalizing plate 70 and the middle frame 401 is fixed by thermally conductive glue. This kind of fixing structure requires thicker thermally conductive glue.
  • the thermally conductive adhesive can be set as a thinner layer, and at the same time, an overlap structure is provided on the middle frame 401, and an overlap structure is provided on the edge of the first heat equalizing plate 70, passing through the middle frame 401
  • the overlapping structure (refer to the overlapping structure of the first fixing method for details) cooperates with the overlapping structure of the first heat equalizing plate to form an overlapping fixing solution.
  • This overlapping fixing solution is combined with the thermally conductive glue to jointly connect the first equalizing plate 70 Fixed to the middle frame 401.
  • the way the first heat equalizing plate 70 is embedded in the groove prevents the first heat equalizing plate 70 from increasing the thickness of the middle frame assembly 40, the middle frame assembly 40 can be thinner, and the mobile terminal can be thinner.
  • the heat dissipation area 402 is also used to connect with a heat source to dissipate heat from the heat source.
  • the connection is made by means of thermally conductive adhesive, and the heat generated by the heat source is guided to the heat dissipation area 402 in the middle frame, and then passes through the heat dissipation area 402.
  • the upper fixed first heat equalizing plate dissipates heat.
  • One or more can be selected according to actual engineering design requirements (such as internal space structure layout, heat dissipation requirements, etc.).
  • there is one heat pipe 60 and one heat equalizing plate that is, the first equalizing plate 70. It can be understood that when the number of heat pipes 60 is multiple, or the number of heat equalizing plates is multiple, the heat dissipation area of the middle frame assembly 40 can be increased, and the heat dissipation efficiency is high.
  • a heat pipe 60 and a heat equalizing plate (first equalizing plate 70) will be introduced.
  • connection relationship between the heat pipe 60 and the first heat equalizing plate 70 will be described in detail as follows.
  • the middle frame assembly 40 shown in FIG. 3 includes a middle frame 401, a heat pipe 60 and a heat equalizing plate (first equalizing plate 70 ).
  • the heat pipe 60 includes a first section 60a and a second section 60b opposite to the first section 60a.
  • the first section 60a and the second section 60b refer to a section of the heat pipe 60 extending from the end to the opposite direction of the end.
  • the heat pipe includes two ends, the first section 60a is connected to the first heat equalizing plate 70, and the second section 60b is a free end, which can be completely or partially opposite to the other first section 60a.
  • the hot plate is connected to colder devices (such as middle frames, batteries or other electronic devices).
  • the heat pipe 60 can also have multiple branches and thus multiple ends. In this case, there will be more segments, some of which can be connected to the first heat equalizing plate 70, and some of them can be connected to others. The devices that are colder than the first heat spreader are connected.
  • the heat can first be transferred to the first heat equalizing plate 70 (assuming that the heat dissipation area 402 is a hole, the first equalizing plate 70 passes through the hole and is connected to the heat source, or the first equalizing plate 70 contains Placed in the hole and connected to the heat source), the heat on the first heat equalizing plate 70 can be transferred along the first section 60a of the heat pipe 60 to the second section 60b, the second section 60b is relatively far away from the heat source 101, and the second section 60b can be more
  • the heat is quickly dissipated, and then the heat of the heat source 101 can be conducted to the entire heat pipe 60, and the heat conduction cycle can be completed in the entire heat pipe 60, the heat dissipation area is large, the heat dissipation efficiency is high, and the heat dissipation performance of the entire mobile terminal is improved.
  • the heat generated by the heat source 101 when the heat generated by the heat source 101 is small, the heat can be transferred to a certain position between the first section 60a and the second section 60b, and a heat conduction cycle can be completed.
  • the first heat equalizing plate 70 and the middle frame 401 are fixed by some heat conduction methods (such as welding or thermally conductive adhesive bonding), the heat on the first heat equalizing plate 70 can also be transferred to the entire middle frame 401 through the middle frame. 401 further dissipates heat.
  • both the heat pipe 60 and the heat equalizing plate (such as the first equalizing plate 70) can be fixed to the middle frame 401 (as shown in FIG. 1b), and the heat generated by the operation of the heat source 101 can be first transferred to the first heat pipe 60 Section 60a, the first section 60a of the heat pipe 60 transfers heat to the first heat equalizing plate 70, and transfers heat to the second section 60b of the heat pipe 60.
  • the heat source 101 may include electronic devices of varying heights, taller electronic devices can directly contact the first heat equalizing plate 70, and a gap can be formed between the smaller-sized electronic devices and the first equalizing plate 70. , The position of this gap can be provided with a heat pipe 60.
  • Both the first section 60a of the heat pipe 60 and the first heat equalizing plate 70 can contact the heat source 101, so that the heat generated by the operation of the heat source 101 can be transferred to the first section 60a of the heat pipe and the first equalizing plate 70 at the same time.
  • the heat pipe 60 can be arranged in a small space to transfer heat to the area where the mobile terminal does not generate heat.
  • the two-dimensional heat conduction of the first heat equalizing plate 70 can be used, and the heat conduction effect is good.
  • the second section 60b transfers heat to a lower temperature area in the mobile terminal.
  • the heat pipe 60 is combined with the first heat equalizing plate 70, and the heat is transferred to the lower temperature area in the mobile terminal through the second section 60b of the heat pipe, so as to realize efficient heat dissipation.
  • the heat pipe 60 extends from the heat dissipation area 402 toward the second edge 403b.
  • the heat pipe 60 extends along the direction from the first edge 403a to the second edge 403b of the battery placement area 403, and the second section 60b of the heat pipe 60 can be located between the first edge 403a and the second edge 403b ( Figure 3 shown). It is understandable that the second section 60b of the heat pipe 60 can also cross the second edge 403b and be located in the other component placement area 404 (as shown in FIG.
  • the gap and other component placement areas 404 can be regarded as areas with lower temperature, and the temperature in these two places is lower than the temperature in the heat dissipation area 402.
  • Figure 3 shows that the heat pipe 60 extends along the periphery of the battery placement area 403.
  • the periphery of the battery placement area 403 can be between the battery placement area 403 and the side wall of the middle frame 401, or it can be between the battery placement area 403 and the side wall of the middle frame 401.
  • the heat pipe 60 is connected to the part of the middle frame 40 whose temperature is lower than the temperature of the first heat equalizing plate 70, and is not in contact with the battery. That is to say, when the mobile terminal is operating normally, the mobile terminal generates heat and the temperature of the part of the heat pipe 60 connected to the middle frame 401 is lower than the first heat equalizing plate 70, and the temperature of the middle frame 401 is lower than the part of the first heat equalizing plate 70. It is the part of the middle frame 401 on the side away from the first heat equalizing plate 401, that is, the heat pipe 60 is also connected to the side of the middle frame 401 away from the first heat equalizing plate 401.
  • the middle frame 401 has a large heat dissipation area and high heat dissipation efficiency. And when the heat pipe 60 is not in contact with the battery, the heat on the heat pipe 60 and the battery will not be transferred to each other. The heat pipe 60 does not overlap the battery and does not affect the thickness of the mobile terminal. It can be understood that the first heat equalizing plate 70 is used to dissipate heat to the heat source 101, such as a CPU for heat dissipation.
  • the part of the middle frame assembly 40 whose temperature is lower than the temperature of the first equalizing plate 70 may be located in the bottom area of the mobile terminal.
  • these areas can be placed antennas, buttons, speakers, etc., these areas when the mobile terminal is operating normally, the temperature is lower than the temperature of the first soaking plate 70, the heat pipe 60 can be connected to these areas Areas, or components connected to these areas.
  • the gap 50 between the battery placement area 403 and the side wall 401c of the middle frame 401 is an idle space
  • part of the heat pipe 60 can be accommodated between the battery placement area 403 and the side wall 401c of the middle frame 401
  • Part of the heat pipe 60 is accommodated in the idle space within the gap 50 of, which not only utilizes the idle space, but also does not need to provide a new space in the mobile terminal for accommodating the heat pipe 60, thereby not increasing the volume of the mobile terminal .
  • Part of the heat pipes 60 can be accommodated in the gaps of these electronic devices and in the gaps. Extending, the gap may be a side of the middle frame 40 corresponding to the main board 10.
  • FIG. 5 to FIG. 6 shows the connection relationship between the heat pipe 60 and the first heat equalizing plate 70.
  • the connection relationship between the heat pipe 60 and the first heat equalizing plate 70 includes but is not limited to the following three types.
  • the first type as shown in FIG. 5, the heat pipe 60 overlaps the first heat equalizing plate 70 in a direction perpendicular to the surface of the first equalizing plate 70.
  • the first section 60a overlaps to the first equalizing plate 70 in a direction perpendicular to the first equalizing plate 70, that is, the first section 60a is located outside the first equalizing plate 70 and is connected to a part of the first equalizing plate 70.
  • the plates 70 are overlapped and connected, and the two can be connected by thermally conductive glue to increase the thermal conductivity.
  • the overlap of the heat pipe 60 and the first heat equalizing plate 70 can transfer the heat transferred from the heat source 101 to the first heat equalizing plate 70 to the heat pipe 60 by means of thermal conduction.
  • the connection of the soaking plate 70 is simple and easy to operate.
  • the heat pipe 60 and the first heat equalizing plate 70 may be provided with the same working fluid.
  • the heat pipe 60 and the first heat equalizing plate 70 may be provided with different working fluids.
  • the heat pipe 60 may be provided with a first working fluid
  • the first heat equalizing plate 70 may be provided with a second working fluid.
  • the first working fluid can be methanol, R134A, acetone, etc.
  • the second working fluid can be water, etc.
  • the heat pipe 60 and the first heat equalizing plate 70 may be connected by a heat conducting medium.
  • the heat-conducting medium can be heat-conducting glue or graphite material.
  • the thermal conductivity of the thermally conductive adhesive can reach more than 1W/m.K, and the thermal conductivity of the thermally conductive adhesive is more than twice that of the ordinary adhesive layer, and it has good thermal conductivity.
  • the second type as shown in FIG. 6, the heat pipe 60 is in communication with the first heat equalizing plate 70. Specifically: a first cavity 7 is provided in the first heat equalizing plate 70, and a second cavity 6 is provided in the heat pipe 60.
  • the first section 60a of the heat pipe 60 extends into the hole and is sealed and fixed by welding.
  • the solution in which the first section 60a extends into the first heat equalizing plate 70 can connect the internal space of the first equalizing plate 70 and the internal space of the hot plate 60 to form a complete and larger heat conduction cavity.
  • the connected heat pipe and the first heat equalizing plate form a large and complete heat conduction cavity inside.
  • the capillary structure a in the first heat equalizing plate 70 is connected to the capillary structure b in the heat pipe 60 to conduct heat.
  • the working fluid in the cavity completes a heat conduction cycle through a longer path and a longer time. It can transfer the heat of the heat source to a larger area of the middle frame, and the heat is conducted out in a more dispersed manner, and the heat dissipation efficiency is high. It can be understood that when the first heat equalizing plate 70 and the heat pipe 60 are in communication, it is equivalent to extending the conduction path of the heat conduction medium in the heat conduction cavity, and the temperature can be uniformed between the heat source concentrated area and the lower temperature area in the terminal. This structure has a better temperature uniformity effect.
  • the third type the first section 60a is connected to the side of the first heat equalizing plate 70, and the first section 60a and the first section 60a can be welded and fixed by other connecting pieces, or the first section 60a can be connected to the set The overlapping edges at the outer edge of the first heat equalizing plate 70 are fixedly connected.
  • the first heat equalizing plate 70 includes three parts with unequal thicknesses.
  • the first cavities 7 in the first equalizing plate 70 are also distributed in a state of unequal volume.
  • the first cavity 7 is provided with capillaries. Structure a, capillary structure a are distributed in a stepped manner.
  • a plurality of supporting columns are also distributed in the first cavity 7 of the first heat equalizing plate 70 to support the first cavity 7 to prevent the first heat equalizing plate 70 from being deformed and reduce the internal space of the first cavity.
  • the thickness of the first heat equalizing plate 70 increases in steps, which can be adapted to electronic devices whose height is decreasing in steps. This can also make the volume of the current equalizing cavity inside the first equalizing plate 70 gradually increase.
  • the working fluid has a larger flow range and a better heat dissipation effect. It is understandable that there are other ways in which the thickness of the first heat equalizing plate 70 is not uniform.
  • the thickness of the first heat equalizing plate 70 is uniformly high and low, or unevenly high and low, so as to correspond to electronic devices of different heights.
  • the thickness of the first heat equalizing plate 70 may also decrease linearly or increase linearly.
  • the thickness of the first heat equalizing plate 70 of the present application is determined according to the height of the electronic device in a specific use environment.
  • two-phase components (heat pipe 60 and soaking plate) of different thicknesses can be used in different areas; two-phase components (heat pipe 60 and soaking plate) of different widths can be used in different areas to realize two-phase components (heat pipe 60 and soaking plate).
  • Board flexible layout on the middle frame 40 of the mobile terminal.
  • FIG. 8 is another schematic top view of the middle frame assembly 40.
  • the middle frame assembly 40 includes a heat pipe 60 and two equalizing plates (the first equalizing plate 70 and the second equalizing plate 70). Soaking plate 80).
  • the second heat equalizing plate 80 is fixed to the other component placement area 404, and the heat pipe 60 connects the first equalizing plate 70 and the second equalizing plate 80.
  • the first section 60a of the heat pipe 60 is fixedly connected to the first heat equalizing plate 70
  • the second section 60b of the heat pipe 60 is fixedly connected to the second equalizing plate 80, that is, when the heat source is fixedly placed in the heat dissipation area 402, other heat sources are fixed
  • the heat of the heat source can be conducted to the first heat equalizing plate 70 and to the heat pipe 60
  • the heat of other heat sources can be conducted to the second heat equalizing plate 80 and to the heat pipe 60
  • the first The combined effect of the soaking plate 70, the second soaking plate 80 and the heat pipe 60 can quickly dissipate the heat of the heat source and other heat sources, thereby increasing the service life of the mobile terminal and improving the consumer experience.
  • FIG. 9 shows a way in which the heat pipe 60 is connected to the first heat equalizing plate 70 and the second equalizing plate 80 to be overlapped.
  • the first heat equalizing plate 70 includes a first top surface 701 and a first bottom surface 702 disposed opposite to the first top surface 701
  • the second heat equalizing plate 80 includes a second top surface 801 and a first top surface 801 disposed opposite to the second top surface 801. ⁇ 802 ⁇ Two bottom surface 802.
  • the heat pipe 60 is connected to the first heat equalizing plate 70 and the second heat equalizing plate 80, including but not limited to the following four ways: the heat pipe 60 is connected to the first top surface 701 and the second top surface 801; the heat pipe 60 is bent to connect the first top surface The heat pipe 60 is bent to connect the first bottom surface 702 and the second top surface 801 (FIG. 9 ); the heat pipe 60 connects the first bottom surface 702 and the second bottom surface 802.
  • the above-mentioned four ways of connecting the first heat equalizing plate 70 and the second equalizing plate 80 of the heat pipe 60 can realize the heat transfer of the heat source 101 and other heat sources 102 to the first equalizing plate 70, the second equalizing plate 80 and the heat pipe. 60, and conduction to the entire middle frame 40.
  • the working fluids in the heat pipe 60, the first heat equalizing plate 70, and the second heat equalizing plate 80 may be the same or different.
  • the heat pipe 60 is provided with a first working fluid
  • the first heat equalizing plate 70 is provided with a second working fluid.
  • At least one of the first working medium, the second working medium, and the third working medium is different.
  • the first working medium, the second working medium, and the third working medium are different from each other. It can be one, two or three of methanol, R134A, acetone or water.
  • FIG. 10 shows a manner in which the heat pipe 60 communicates with the first heat equalizing plate 70 and the second equalizing plate 80.
  • the internal space of the heat pipe 60, the internal space of the first heat equalizing plate 70 and the internal space of the second equalizing plate 80 jointly form a heat conduction cavity.
  • the heat pipe 60 may be connected to one of the first heat equalizing plate 70 and the second heat equalizing plate 80, or the heat pipe 60 may be connected to both the first heat equalizing plate 70 and the second heat equalizing plate 80.
  • the communication mode is the same as the communication mode of the heat pipe 60 and the first heat equalizing plate 70 described above, and will not be repeated here in this application.
  • the connected heat pipe 60, the first heat equalizing plate 70, and the second equalizing plate 80 form a larger and complete heat conduction cavity inside.
  • the working fluid in the heat conduction cavity completes a heat conduction cycle through a longer path and takes longer .
  • the heat from the heat source can be transferred to a larger area of the middle frame 40, and the heat is conducted out in a more dispersed manner, and the heat dissipation efficiency is high.
  • the fixing method of the second heat equalizing plate 80 to the middle frame 401 at the other component placement area 404 may be the same as the fixing method of the first heat equalizing plate to the middle frame 401 at the heat dissipation area 402.
  • the middle frame 401 can be provided with a first groove, a second groove, and a third groove.
  • the first groove is provided at the heat dissipation area 402
  • the second groove is provided at the other component placement area 404
  • the first heat equalizing plate 70 is embedded In the first groove
  • the second heat equalizing plate 80 is embedded in the second groove
  • the heat pipe 60 is arranged in the third groove.
  • first equal heating plate 70, the second equalizing plate 80 and the heat pipe 60 not increase the thickness of the middle frame 401, and the mobile terminal can be thinner.
  • first slot, the second slot, and the third slot can be provided in one embodiment at the same time. In other embodiments, one or two of the three slots can also be selectively provided according to the mobile terminal.
  • the specific structure configuration for example, in some places, there are gaps between the electronic devices for the placement of the heat pipes, so there is no need to provide a third groove.
  • the middle frame 401 is provided with a first groove and a third groove, the third groove is formed at the bottom of the first groove, and the first heat equalizing plate 70 is embedded in the first groove.
  • the heat pipe 60 is partially embedded in the third groove, and a part of the heat pipe 60 and the first heat equalizing plate 70 in the groove are stacked.
  • part of the heat pipe 60 is located between the first heat equalizing plate 70 and the heat source 101, the openings of the first groove and the third groove face the side of the middle frame 401 away from the heat source 101, the heat source 101 and the heat pipe 60 and the first heat equalizing plate
  • the plates 70 are separated by a middle frame 401, and the middle frame 401 is used to support the heat source 101.
  • the heat of the heat source 101 will first be transferred to the middle frame 401 opposite to the heat source 101, and then to the first heat equalizing plate 70, the heat pipe 60 and the rest of the middle frame 401, so that the heat of the mobile terminal can be quickly dissipated.
  • holes can also be used instead of one or more of the "grooves", that is, the first groove, the second groove, and the third groove can be in the form of "holes".
  • the three grooves It can also be designed as a structure with part grooves and part holes.
  • the outer surface of the heat pipe 60 is provided with a wire slot 608, the wire slot 608 is used to fix the wires in the mobile terminal, and the wires are used to electrically connect the electronic devices in the heat dissipation area 402 and other electronic devices in the component placement area .
  • the heat source may be multiple high-power devices such as CPU or GPU, and other heat sources may be heat sources such as screen sound, screen driving, etc.
  • the above-mentioned heat source and other heat sources need to be connected by wires, and the wire groove 608 on the surface of the heat pipe 60 can be As the carrier of the wire, the wire can be fixed in the wire slot 608 of the heat pipe 60, and the position of the wire can be fixed to prevent the wire from being damaged due to shaking and improve the service life of the mobile terminal.
  • the specific method of setting the wire groove 608 on the surface of the heat pipe 60 can be a method of forming a groove on the outer surface of the heat pipe 60 by machining, or a structure for fixing the wires on the outer surface of the heat pipe 60, such as a wire harness-like card. Hook, the wire slot 608 can be formed in the hook.
  • the outer surfaces of the heat pipe 60 and the heat equalizing plate are provided with a thermally conductive film.
  • the material of the thermally conductive film may be graphene. The arrangement of the heat-conducting film makes the heat from the heat pipe and the heat equalizing plate conduct to the outside faster.
  • first equalizing plate 70 A specific implementation manner in which the middle frame assembly 40 includes two heat pipes 60 and a heat equalizing plate (first equalizing plate 70) will be introduced as follows.
  • FIG. 12 is a schematic diagram of another top view structure of the middle frame assembly 40.
  • the heat pipe 60 at least includes a first heat pipe 603 and a second heat pipe 604 arranged at intervals, and the first heat pipe 603 and the second heat pipe 604 are both arranged around the battery placement area 403.
  • the arrangement of the two heat pipes 60 has a good heat dissipation effect, can dissipate the heat of the heat source more quickly, and increase the service life of the heat source, thereby increasing the service life of the mobile terminal, and improving the user experience of consumers.
  • the gap between the battery placement area 403 and the third side wall 401c and the fourth side wall 401d is utilized, and the two heat pipes 60 will not The overlap with the battery placement area 403 will not affect the thickness of the middle frame 40.
  • the heat pipe 60 will not overlap with the battery and will not affect the thickness of the mobile terminal.
  • the first section 60a of the first heat pipe 603 is accommodated between the top 401a and the battery placement area 403, and is close to the third edge 403c, and the second section 60b of the first heat pipe 603 extends to the second The first gap 501 between the three edges 403c and the third side wall 401c; the second heat pipe 604 is also partially accommodated between the top 401a and the battery placement area 403, and near the fourth edge 403d, the second heat pipe 604 partially extends To the second gap 502 between the fourth edge 403d and the fourth side wall 401.
  • FIG. 13 shows another schematic top view of the middle frame 40 assembly.
  • the second heat pipe 604 surrounds the battery placement area 403, and the first heat pipe 603 overlaps the battery placement area 403.
  • one of the heat pipes 60 can be overlapped on the battery placement area 403, so that both heat pipes can be used
  • the heat dissipation effect of 60, the middle frame 401 can be used for heat dissipation area is larger, the heat dissipation effect is good, the heat of the heat source can be dissipated more quickly, which increases the service life of the heat source, thereby increasing the service life of the mobile terminal and increasing consumption
  • the user experience; the space between the battery storage area 403 and the third side wall 401c and the fourth side wall 401d of the middle frame 401 and other spaces can also be effectively used.
  • the first heat pipe 603 overlaps the battery placement area 403
  • the first heat pipe 603 is connected to the surface of the battery, so that the heat on the battery can also be transferred to the first heat pipe 603 and then to the entire middle frame 401. It realizes the heat dissipation of the battery by the middle frame 401, the heat dissipation area is large, and the heat dissipation effect is good.
  • the middle frame assembly 40 may include two heat pipes 60 and two heat equalizing plates, such as a first heat pipe 603, a second heat pipe 604, a first equalizing plate 70, and a second equalizing plate 80.
  • the first heat equalizing plate 70 is fixed to the heat dissipation area 402
  • the second heat equalizing plate 80 is fixed to the other component placement area 404
  • the first heat pipe 603 and the second heat pipe 604 both surround the battery placement area 403, and the first section of the first heat pipe 603 60a is connected to the first equalizing plate 70
  • the second section 60b of the first heat pipe 603 is connected to the second equalizing plate 80
  • the first section 60a of the second heat pipe 604 is connected to the first equalizing plate 70
  • the second section of the second heat pipe 604 The section 60b is connected to the second heat equalizing plate 80.
  • heat pipes 60 and soaking plates there may be more heat pipes 60 and soaking plates, such as third soaking plates, third heat pipes 60, etc., and more soaking plates and heat pipes 60 can be connected to achieve a larger area. Heat dissipation.
  • At least one heat pipe 60 of the one or more heat pipes 60 provided in the present application extends between the electronic devices, and/or at least one heat pipe 60 of the one or more heat pipes extends between the boundary of the electronic device and the middle frame 401.
  • the electronic device can be the backlight module, battery, CPU, camera, button, speaker, etc. in the terminal, as shown in FIG. 13, where the first heat pipe 603 extends between the electronic devices, which can be understood as: Extend between the stacked backlight modules.
  • the second heat pipe 604 extends between the electronic device and the border of the middle frame, which can be understood as extending between the battery and the border of the middle frame.

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Abstract

本申请提供一种移动终端及其中框组件。中框组件用于承载移动终端内的电子器件，所述电子器件包括热源，所述中框组件包括中框、一个或多个热管以及第一均热板，中框包括对应热源的散热区，第一均热板容置于所述散热区，热管连接至所述第一均热板，用于对第一均热板进行散热。本申请提升了移动终端的散热性能。

Description

移动终端及中框组件
本申请要求于2020年3月24日提交中国专利局、申请号为202010217496.3、申请名称为“移动终端及中框组件”的中国专利申请的优先权，本申请要求于2020年3月24日提交中国专利局、申请号为202020393505.X、申请名称为“移动终端、中框组件及散热组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端技术领域，尤其涉及一种移动终端及其中框组件。
背景技术
现有的移动终端均通过单个的热板或单个的热管单独进行散热，但是随着移动终端智能化程度越来越高，其主频升级产生更多的热量，若过多的热量不能快速散去，这不仅影响移动终端的使用寿命，而且还会影响消费者的直观体验。
发明内容
本申请实施例提供一种终端及其中框组件，提升了移动终端的散热性能。
第一方面，本发明提供一种中框组件，用于承载移动终端内的电子器件，所述电子器件包括热源，所述中框组件包括中框、一个或多个热管以及第一均热板；所述中框包括对应所述热源的散热区，所述第一均热板容置于所述散热区；第一均热板还可以通过散热区与中框固定连接，具体的固定方式不限于以下几种：可以通过底部焊接的方式固定至中框、侧部焊接的方式固定至中框，底部粘接的方式固定至中框，或者通过四周搭接结构固定连接至中框，或者通过底面固定结合四周固定的方式连接至中框；每个所述热管连接至所述第一均热板(二者之间的连接方式不限于搭接焊接固定，连通后焊接密封等方式)，用于对所述第一均热板进行散热。本申请将热管的一端与第一均热板连接，可以利用第一均热板的二维扩展导热与热管的一维线性导热的综合导热效果，可以快速将热源的热量散去，增加了热源的使用寿命，进而增加了移动终端的使用寿命，提升了消费者的使用体验。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管还与所述中框中的温度低于所述第一均热板温度的部分相连。中框中的温度低于第一均热板温度的部分可以是中框边缘的区域，例如中框两侧边缘或中框底部边缘。如此，移动终端正常运行时，由于第一均热板固定在中框上，热量可以传递至第一均热板，并传递至热管，传递至热管上的热量可以传递至整个中框，热源的热量可以传导至整个中框，通过中框将热量传导出去，中框的面积大，散热效率高，提升整个移动终端的散热性能。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管通过导热介质与所述中框相连。导热介质可以为导热胶或石墨材料。导热胶的导热率是普通粘胶层的导热率的2倍以上，具有良好的导热性能，可以快速将热管上的热量传递至整个中框，散热效率高。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管的内部空间与所述第一均热板的内部空间连通，以形成一个导热腔。连通后的热管与第一均热板在内部形成一 个较大且完整的导热腔，导热腔内的工质完成一次热传导循环经过的路径更长，时间更长，可以将热源的热量传递到中框更大的区域，热量以更加分散的方式传导出去，散热效率高。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管***到所述第一均热板内部。该种方式的热管在第一均热板的内部与第一均热板重叠。热管与第一均热板的连通性能更好。
一种可能的实现方式中，所述电子器件还包括与所述热源间隔设置的电池，所述中框还包括对应所述电池的电池放置区，所述电池放置包括相对设置的第一边缘和第二边缘，所述散热区邻近所述第一边缘，所述一个或多个热管中的至少一个热管从所述散热区朝向所述第二边缘的方向上延伸。如此热管可以延伸在中框的更大范围内，可以将热源的热量传递到更远的距离，散热效果好。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管不与所述电池接触。从而当移动终端正常运行时，移动终端发热产生热量，热管连接中框的部分的温度小于第一均热板，当热管不与电池接触时，热管与电池上的热量就不会相互传递，热管与电池就不会相互干扰，而且热管绕开电池设置，不需要在电池的表面设置热管放置的空间，有利于移动终端薄型化设计。
一种可能的实施方式中，所述一个或多个热管包括间隔设置的第一热管与第二热管，所述第一热管围绕所述电池放置区，所述第二热管部分与所述电池放置区重叠设置。本实施方式通过在电池放置区及电池放置区的***均布置热管，增强散热性能。
一种可能的实现方式中，所述中框包括顶部、与所述顶部相对设置的底部以及位于所述顶部与所述底部的两个侧壁，所述散热区位于所述电池放置区的所述第一边缘和所述顶部之间，所述电池放置区的所述第二边缘和所述底部之间设有其他元件放置区，所述中框还包括第二均热板，所述第二均热板固定在其他元件放置区，所述一个或多个热管中的至少一个热管还连接所述第二均热板。当热源固定放置在散热区，其他热源固定放置在其他元件放置区上时，热源的热量可以传导至第一均热板并传导至热管，其他热源的热量可以传导至第二均热板并传导至热管，进而第一均热板、第二均热板以及热管的综合作用可以将热源和其他热源的热量快速散去，增加了热源以及其他热源的使用寿命，进而增加了移动终端的使用寿命，提升了消费者的使用体验。同时，由于第一均热板、第二均热板固定在中框上，热源以及其他热源的热量可以传导至整个中框，通过中框将热量传导出去，实现整个中框的散热性能，中框的面积大，散热效率高，提升整个移动终端的散热性能。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管的一端搭接在所述第一均热板上，所述一个或多个热管中的至少一个热管的另一端搭接在所述第二均热板上。本实施试提供了热管与第一均热板和第二均热板的连接方式，搭接指的是在垂直于第一均热板和第二均热板的方向上，热管和第一、第二均热板之间有部分重叠的区域，这种连接结构稳固，可靠性好。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管沿着所述电池放置区的***延伸，至少部分热管位于所述电池放置区与所述中框的侧壁之间的间隙内。电池放置区与中框的侧壁之间的间隙为闲置空间，本申请将部分热管容置在电池放置区与中框的侧壁之间的间隙内，即将部分热管容置在闲置空间内，这不仅利用了闲置空间，还无需为 容置热管而在移动终端内设置新的空间，从而也就不会增加移动终端的体积。
一种可能的实现方式中，所述一个或多个热管中的至少一个还与所述电池的表面接触。从而电池上的热量还可以传递至热管上，进而传递至整个中框，实现中框对电池的散热，散热面积大，散热效果好。
一种可能的实现方式中，所述一个或多个热管至少包括间隔设置的第一热管与第二热管，所述第一热管与所述第二热管均围绕所述电池放置区设置。而当第一热管和第二热管均围绕电池放置区设置时，利用了电池放置区与侧壁之间的空间，两个热管均不会与电池放置区重叠，不会影响中框的厚度，当移动终端内放入电池时，热管就不会与电池重叠，不会影响移动终端的厚度。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管至少包括间隔设置的第一热管与第二热管，所述第一热管围绕所述电池放置区，所述第二热管搭接在所述电池放置区上。如此既可以利用两个热管的散热效果，中框的可用于散热的区域更大，散热效果好，可以更快速将热源的热量散去，增加了热源的使用寿命，进而增加了移动终端的使用寿命，提升了消费者的使用体验；还可以有效利用电池放置区与中框侧壁之间的空间以及其他空间。而且，第二热管搭接电池放置区上的此种方式便于第二热管的安装，方便操作，而且第二热管可以用于对电池的热量进行散热。
一种可能的实现方式中，所述中框设有第一挖除区和第三挖除区，所述第三挖除区形成在所述第一挖除区的底部，所述第一均热板嵌入所述第一挖除区内，所述一个或多个热管中的至少一个热管部分嵌入所述第三挖除区内，在所述第三挖除区内的部分所述一个或多个热管中的至少一个热管与所述第一均热板层叠设置，所述第一挖除区为槽或孔，所述第二挖除区为槽或孔。本实施方式中部分热管位于第一均热板和发热源之间，第一挖除区和第二挖除区为槽的结构的情况下，第一挖除区和第二挖除区的开口朝向中框背离发热源的一侧，发热源和热管及第一均热板之间有中框相隔，中框用于支撑发热源。
一种可能的实现方式中，所述中框设有第一挖除区、第二挖除区和第三挖除区，所述第一均热板嵌入所述第一挖除区内，所述第二均热板嵌入所述第二挖除区内，所述一个或多个热管中的至少一个热管嵌入所述第三挖除区内，所述第一挖除区为槽或孔，所述第二挖除区为槽或孔，所述第三挖除区为槽或孔。这种均热板及热管嵌入挖除区的方式这使得第一均热板、第二均热板及热管不会增加中框的厚度，移动终端可以较薄。可以理解地，第一挖除区、第二挖除区和第三挖除区可以同时设置在一个实施方式中，其它实施方式中，也可以选择性地这三个挖除区中的一个或两个，根据移动终端内的具体结构配置，例如，有些地方，刚好电子器件之间存在间隙，可供热管放置，这样就不需要设置第三挖除区。此架构有利于移动终端整体的薄型化设计，并可以减少移动终端的重量。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管与所述第一均热板连通，指的是它们的内部空间相互连接，形成一个较大的导热腔。连通后的热管与第一均热板在内部形成一个较大且完整的导热腔，导热腔内的工质完成一次热传导循环经过的路径更长，时间更长，可以将热源的热量传递到中框更大的区域，热量以更加分散的方式传导出去，散热效率高。热管与第二均热板也可以设置为连通的架构。
一种可能的实现方式中，所述第一均热板的厚度呈阶梯递增，和/或所述第二均热板的 厚度呈阶梯递增。如此可以对应适应于高度呈阶梯递减的电子器件。
一种可能的实现方式中，热管、第一均热板和第二均热板的数量不限为一个，也可以为两个或两个以上，根据移动终端内具体的散热需求进行配置。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管、所述第一均热板以及所述第二均热板中的任意一个或多个的外表面设有导热薄膜。导热薄膜的设置使得热管与所述均热板上的热量传导出外界的速度更快。
一种可能的实现方式中，所述中框设有槽，所述第一均热板容置在所述槽内，所述第一均热板与所述槽底通过导热胶固定。一种具体的实施方式中，中框包括朝向槽内延伸的第一搭接边，所述第一均热板包括第三搭接边，所述第一搭接边与所述第三搭接边搭接固定。
可以理解地，中框还可以包括用于固定第二均热板的第二搭接边。所述第一均热板包括第三搭接边，所述第一搭接边与所述第三搭接边搭接，以使得所述第一均热板固定在所述散热区上，第一搭接边和第三搭接边之间可以通过焊接固定。同样，所述第二均热板可以包括第四搭接边，所述第二搭接边与所述第四搭接边搭接，以使得所述第二均热板固定在所述其他元件放置区上。此种固定方式不仅容易实现，而且固定效果好。
具体而言，一种实施方式中，通过搭接边固定连接第一均热板和中框的方案中，中框上开设的槽可以为孔，槽为孔的情况下，中框没有用于承载第一均热板的部分，但可以通过搭接边实现第一均热板与中框之间的连接。
其它实施方式中，中框上开设的第一槽也可以为盲孔状，即第一槽不是孔，这样在中框上有部分结构，可以称之为承载部，可以用于承载第一均热板，第一均热板通过导热胶固定至中框的承载部，本实施方式中，为了减少导热胶的厚度，导热胶的厚度变小后，使得第一均热板与中框之间的连接也变得强度不够，为了保护连接强度及可靠性，同样也可以设置搭接结构，即中框上的第一搭接边与第一均热板上的第三搭接边配合来增强第一均热板与中框之间的连接可靠性。本实施方式通过导热胶及搭接结构的配合，来固定第一均热板和中框。
一种可能的实现方式中，所述一个或多个热管中的至少一个热管在所述电子器件之间延伸，和/或所述一个或多个热管中的至少一个热管在所述电子器件和所述中框的边界之间延伸。如此，不仅可以利用电子器件之间的间隙，以及电子器件和所述中框的边界之间的间隙容置热管，而且还无需为热管的容置增加新的空间，无需增加移动终端的厚度。
本申请提供一种移动终端，包括主板以及上述的中框，所述主板包括所述电子器件，所述主板安装于所述中框内，所述主板的所述热源设置在所述中框的散热区。移动终端上的热量可以快速散去，增加了移动终端的使用寿命，提升了消费者的使用体验。同时，由于第一均热板固定在中框上，热源的热量可以传导至整个中框，通过中框将热量传导出去，实现整个中框的散热性能，中框的面积大，散热效率高，提升整个移动终端的散热性能。
一种可能的实现方式中，所述移动终端还包括屏幕、主板、电池以及电池盖，所述中框还包括对应所述电池的电池放置区，所述电池放置区设于所述散热区的一侧，所述屏幕和所述主板分别安装于所述中框的相背的两侧，所述主板的所述热源设置在所述中框的散热区，所述电池与所述主板电性连接，所述电池位于所述主板的背离所述中框的一侧，且 所述电池位于所述电池放置区，所述电池盖安装于所述中框上，且所述电池盖将所述主板以及所述电池固定于所述中框内。
一种可能的实现方式中，所述热管的外表面上设有线槽，所述线槽用于固定所述移动终端的内导线，所述导线用于电连接移动终端内的电子器件。例如，所述导线用于电连接所述散热区内的电子器件和所述其它元件放置区内的电子器件。热管表面的线槽可以作为导线的载体，从而可以将导线固定在热管的线槽内，进而将导线的位置固定，避免导线由于晃动而发生损坏，提升移动终端的使用寿命。
第二方面，本申请还提供一种移动终端，包括主板以及前述任一项所述的中框组件，所述热源设于所述主板上，所述主板安装于所述中框。
第三方面，本申请还提供了一种散热组件，包括第一方面以及第一方面各种实现方式中的至少一个均热板以及至少一个热管，其中至少一个均热板与至少一个热管的连接方式可参见前述方面及实施方式，这里不再赘述。本方面提供的散热组件可以如前述方面介绍的跟移动终端中的中框来配合以实现更好的散热，在其他实现方式中，也可以跟其他设备的其他器件配合来实现更好地散热。
综上所述，本申请将热管的一端与第一均热板连接，可以利用均热板的二维扩展导热与热管的一维线性导热的综合导热效果，可以快速将热源的热量散去，增加了热源的使用寿命，进而增加了移动终端的使用寿命，提升了消费者的使用体验。同时，由于第一均热板固定在中框上，热源的热量可以传导至整个中框，通过中框将热量传导出去，实现整个中框的散热性能，中框的面积大，散热效率高，提升整个移动终端的散热性能。
附图说明
为了更清楚地说明本申请实施例或背景技术中的技术方案，下面将对本申请实施例或背景技术中所需要使用的附图进行说明。
图1a是本发明实施例提供的移动终端的截面示意图；
图1b是本发明实施例提供的移动终端的另一种截面示意图；
图2是本发明实施例提供的中框组件中的中框的俯视示意图；
图3是本发明实施例提供的中框组件的第一种结构的俯视示意图；
图4是本发明实施例提供的中框组件的第二种结构的俯视示意图；
图5是热管与第一均热板搭接的截面示意图；
图6是热管与第一均热板连通的截面示意图；
图7是第一均热板的厚度呈阶梯递增的截面示意图；
图8是本发明实施例提供的中框的第三种结构的俯视示意图；
图9是热管搭接第一均热板与第二均热板的截面示意图；
图10是热管与第一均热板以及第二均热板连通的截面示意图；
图11是本发明实施例提供的中框组件的第四种结构的俯视示意图；
图12是本发明实施例提供的中框组件的第五种结构的俯视示意图；
图13是本发明实施例提供的中框组件的第六种结构的俯视示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
请参阅图1a、图1b和图2，图1a和图1b是本发明实施例供的两种移动终端的截面示意图。移动终端包括但不限于平板电脑、手机、手表、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视以及可穿戴设备等设备。移动终端可以包括主板10、屏幕20、电池30、中框组件40以及电池盖110。
主板10可以包括多种电子器件，其中，一些电子器件(如各种处理器)在工作过程中会产生比较多的热量，通常需要对其进行散热处理(如安装一些散热器)，本申请中称这些电子器件为热源。
如图1b所示，中框组件40可以包括中框401、热管60以及第一均热板(VC，Vapor Chamber)70。中框401为设备的内部支架，可以用于承载屏幕20、主板10及其它电子器件。屏幕20和主板10分别安装于中框401的相背的两侧，电池30与主板10位于中框401的同一侧，电池30与主板10电连接，电池盖110与中框401围成一个容置空间，主板10、电池30及其它电子器件容置在容置空间内，其它电子器件可以为摄像头、摄像头、按键、扬声器等。中框401的材质可以是具有一定硬度的金属材质，如铝合金。
本申请将热管60和第一均热板70集成在中框401上，形成中框组件40，以提升移动终端的散热性能。均热板与热管均具有真空的导热腔，导热腔的内壁具有毛细结构，并注入工质，工质可以为纯水。VC、热管等两相散热部件的工作原理相似，包括了传导、蒸发、对流、凝固四个主要步骤，以均热板为例进行说明如下：热源产生的热量通过热传导进入均热板内，靠近热源位置的工质吸收热量后迅速汽化，同时带走大量热量；再利用蒸汽的潜热性，当板内蒸汽由高压区(即高温区)扩散至低压区(即低温区)，蒸汽接触到温度较低的内壁时，会迅速凝结成液态并释放出热能；凝结成液态的工质通过微细结构的毛细力作用返回热源处，由此完成一次热传导循环，形成一个工质汽液两相并存的双向循环***。均热板面积比热管大，可实现二维扩展导热，热管宽度相对较窄，可一维线性导热，具体为沿着热管的延伸方向进行一维导热。热管的材质通常为金属材质，如铝或者铜。均热板的材质也通常为金属，如可以选择为铜。
本申请中，热管60与均热板(如第一均热板70)的物性参数可以相同，也可以是至少一种物性参数不同，如不同的壳体材料组合、不同的内部工质材料、不同的毛细结构(毛细层截面积)等，工质量(即工质的填充量)、工质种类、热管60的管材(可以为铜或铝)和厚度中的一种或多种。
如图2所示，图2显示的是本申请一个实施例中的中框401的俯视结构示意图。中框401包括顶部401a、与顶部401a相对设置的底部401b以及位于顶部401a与底部401b之间的两个相对设置的侧壁401c与401d，这里所述的顶部401a、底部401b和两个侧壁401c指的是中框的***的四个边(从图2所示的示意图中是四个边，从立体角度来看，实际为中框的中个外表面，这四个面为移动终端的屏和后盖之间的连接的边框表面)。移动终端以手机为例，中框大致呈长方形，两个侧壁401c为中框的长边。中框401可以包括对应热源101的散热区402、对应电池30的电池放置区403及其他元件放置区404。散热区402位于电池放置区403和顶部401a之间，其他元件放置区404位于电池放置区403和底部401b 之间。其它的实施方式中，散热区402也可以位于电池放置区403和一个侧壁403a之间。
散热区402用于提供一部分空间来安装一个或多个散热器(如VC，或者热管等)为热源散热。例如，散热区402可以为中框401上的一块挖除区，即有部分中框材料被挖除的区域，具体的，可以挖除部分中框的材料形成“槽”，或者也可以挖除所有中框材料而形成“孔”；当然，在另一些实施例中，散热区402上的材料也可以不进行挖除。为了移动终端的薄型化设计，可以在中框401上挖孔，挖孔区域可以用于容置主板上的热源(如处理器)，然后在热源上安装VC来对热源进行散热。散热区402也可以为中框401上的实体区域，不进行挖孔，但可以通过开槽的方式来容置热源或者VC(例如，通过正反面都开槽来同时容置VC与热源，或者只在一面开槽来容置VC或者热源)。在其他实施例中，也可以既不开孔也不挖槽，或者也可以既开孔又挖槽(可以在一片区域同时有槽和孔，也可以槽、孔间隔设置)。同样，电池放置区403和其他元件放置区404也可以为中框401上的挖空的区域或实体区域或者这两种区域的组合。其中，本申请中的“槽”是指未贯穿中框的凹陷结构，形状并不限定(如可以是长方形、正方形、圆形或者各种不规则形状)；本申请中的“孔”(也可以理解为“洞”或者“开口”)为贯穿中框而形成的结构，形状也不限定。
电池放置区403包括第一边缘403a、第二边缘403b、第三边缘403c以及第四边缘403d围成。散热区402位于电池放置区403的第一边缘403a和顶部401a之间。电池放置区403的第二边缘403b和底部401b之间设有其他元件放置区404，电池放置区403和中框401的侧壁401c之间设有间隙50，通常在电池放置区403和中框401侧壁401c之间的位置不会布置电子器件，本申请利用这个间隙50的位置布置热管60，可以提升散热性能。
具体的，第三边缘403c与第一侧壁401c之间设有第一间隙501，第四边缘403d与第二侧壁401d之间设有第二间隙502。第一间隙501和第二间隙502的位置处的中框401可以设置槽或孔，孔指的是在中框上挖空形成通孔状，设槽及孔的目的可以是为了移动终端的薄型化设计，也可以减小中框401的重量，但是为了保证中框401的刚度，可以在适当的位置设槽或孔，适当的位置保留厚度，以保证中框401整体的刚度，使其不易变形，及可以承载电子器件。
请参阅图3，图3显示的是中框组件40的俯视结构示意图。第一均热板70容置在散热区402，具体而言，第一均热板70在散热区402处可以与中框401固定连接，具体的固定方式不限于以下几种：可以通过底部焊接的方式固定至中框401、侧部焊接的方式固定至中框401，底部粘接的方式固定至中框401，或者通过四周搭接结构固定连接至中框401，或者通过底面固定结合四周固定的方式连接至中框401。热管60连接至第一均热板70，用于对第一均热板70进行散热，二者之间的连接方式不限于搭接焊接固定，连通后焊接密封等方式。第一均热板70的厚度可以小于等于0.8mm，热管60的公称管径可以小于等于8mm，为了满足移动终端可以做到更薄，热管60的厚度可以小于等于0.6mm。小尺寸的热管60可以在电子器件之间或者电子器件与中框401的侧壁之间延伸，将电子器件之间的空间及电子器件和中框401侧壁之间的间隙利用起来，提升散热性能的同时，还有利于移动终端小型化的设计。第一均热板70的厚度与热管60的厚度可以相同，也可以不同。热管60可制作成不等厚、不等宽、弯折、形成段差等，依据具体的使用场景确定。
本申请将热管60的一端与第一均热板70连接，可以利用均热板的二维扩展导热与热 管60的一维线性导热的综合导热效果，可以快速将热源101的热量散去，增加了热源101的使用寿命，降低了热源的温度，进而增加了移动终端的使用寿命以及降低了使用过程中的温度，提升了消费者的使用体验。同时，可以将第一均热板70固定在中框401上，例如：第一均热板70可以通过焊接的方式固定连接至中框401，热源101的热量可以通过第一均热板70传导至整个中框401，通过中框401将热量传导出去，中框组件40的面积大，散热效率高，提升整个移动终端的散热性能。
本申请中，第一均热板70在散热区402的固定方式包括但不限于如下两种。
第一种：散热区402为孔，这样，即使第一均热板70的厚度较厚，孔也可以容置较厚的第一均热板70，第一均热板70不会增加中框组件40的厚度。而且，孔的设置可以更大限度地使得第一均热板70不增加中框组件40的厚度。同时，为了更好地散热以及固定，第一均热板70还可以通过搭接结构与中框401固定连接。具体为：中框401包括第一搭接边401a，第一搭接边401a朝向孔内延伸，所述第一均热板70包括出第三搭接边70a，第三搭接边70a突设在第一均热板70的***，所述第一搭接边401a与所述第三搭接边70a搭接，在二者的搭接处，可以通过焊接固定，也可以通过粘胶固定，这样所述第一均热板70固定在中框401上(参阅图1b)。第一均热板还用于与热源连接以及热源进行散热，例如，通过导热粘胶的方式来进行连接及散热。
第二种：散热区402为槽，也即散热区402还保留一定厚度的部分中框材料用于承载第一均热板70，第一均热板70嵌入槽内，第一均热板70可以通过导热胶固定粘贴在槽底壁，即第一均热板70与中框401之间通过导热胶固定，此种固定架构需要较厚的导热胶。另一种实施方式中，可以把导热胶设置为较薄的一层，同时通过中框401上设置搭接结构，及在第一均热板70的边缘设置搭接结构，通过中框401的搭接结构(具体参阅第一种固定方式的搭接结构)与第一均热板的搭接结构配合形成搭接固定方案，此搭接固定方案与导热胶结合共同将第一均热板70固定至中框401。第一均热板70嵌入槽的这种方式这使得第一均热板70不会增加中框组件40的厚度，中框组件40可以较薄，移动终端可以较薄。可以理解，散热区402还用于与热源连接以对热源进行散热，例如，通过导热粘胶的方式来进行连接，将热源产生的热先导到中框中的散热区402，再通过散热区402上固定的第一均热板进行散热。
本申请中，热管60至少为一个，第一均热板70的数量至少为一个。可以根据实际工程设计需求(如内部空间结构布局、散热需求等)等选择一个或多个。例如，在图3所示的实现方式中，热管60为一个，均热板为一个(即第一均热板70)。可以理解的是，当热管60的数量为多个，或者均热板的数量为多个时，可以增加中框组件40的散热面积，散热效率高。下文的其中一个实施例中，将以一个热管60与一个均热板(第一均热板70)进行介绍。
如下将详细介绍热管60与第一均热板70的连接关系。
请继续参阅图3，图3所示的中框组件40包括中框401、一个热管60与一个均热板(第一均热板70)。热管60包括第一段60a以及与第一段60a相对设置的第二段60b，第一段60a和第二段60b指的是热管60从端部往端部相反方向延伸的一段实体区域。具体而言，图3所示的实施例中，热管包括两个端部，第一段60a连接至第一均热板70，第二段60b 为自由端，可以全部或部分与其他相对第一均热板比较冷的器件(如中框、电池或者其他电子器件)连接。在另一实施例中，热管60也可以有多个分支，从而有多个端，此时，会有更多个段，其中一些段可以与第一均热板70连接，另一些可以与其他相对第一均热板比较冷的器件连接。
当热源101运行产生热量后，热量可以首先传递至第一均热板70上(假设散热区402为孔，第一均热板70穿过该孔与热源相连，或者第一均热板70容置在孔内与热源相连)，第一均热板70上的热量可以沿着热管60的第一段60a传递至第二段60b，第二段60b相对远离热源101，第二段60b可以较快将热量散去，进而热源101的热量可以传导至整个热管60，可在整个热管60内完成热传导循环，散热面积大，散热效率高，提升整个移动终端的散热性能。可以理解的是，当热源101所产生的热量较小时，热量可以传递至第一段60a与第二段60b之间的某个位置，便可以完成一次热传导循环。此外，在第一均热板70与中框401通过一些导热方式固定时(如焊接或者导热胶粘接)，第一均热板70上的热量还可以传递至整个中框401，通过中框401进一步进行散热。
在其它实施方式中，热管60与均热板(如第一均热板70)均可以固定至中框401(如图1b所示)，热源101运行产生热量可首先传递到热管60的第一段60a，热管60的第一段60a将热量传递至第一均热板70，以及将热量传递至热管60的第二段60b。其它实施方式中，由于热源101可以包括高低不等的电子器件，较高的电子器件可以直接接触第一均热板70，尺寸较小的电子器件与第一均热板70之间可以形成间隙，此间隙的位置，可以设置热管60。热管60的第一段60a和第一均热板70都可以接触热源101，这样，热源101运行产生热量可同时传递至热管的第一段60a以及第一均热板70。如此既可以利用热管60在较小的空间内布置，以将热量传递至移动终端不发热的区域，同时还可以利用第一均热板70的二维导热，导热效果好，并通过热管60的第二段60b将热量传递至移动终端内温度较低的区域。
本申请通过将热管60结合第一均热板70，通过热管的第二段60b将热量传递至移动终端内温度较底的区域，实现高效的散热。热管60从散热区402朝向第二边缘403b的方向上延伸。也即是说，热管60沿着电池放置区403的第一边缘403a到第二边缘403b的方向上延伸，热管60的第二段60b可以位于第一边缘403a与第二边缘403b之间(图3所示)。可以理解的是，热管60的第二段60b也可以越过第二边缘403b，而位于其它元件放置区404(如图4所示)，可以理解，电池放置区403和中框401的侧壁401c的间隙及其它元件放置区404均可以视为温度较低的区域，这两个地方的温度均低于散热区402处的温度。
请继续参阅图3，图3显示热管60沿着电池放置区403的***延伸，电池放置区403的***可以为电池放置区403和中框401侧壁之间，也可以是电池放置区403和散热区403之间的区域。当热管60沿着电池放置区403的***延伸时，热管60就不会与电池放置区403重叠，不会影响中框组件40的厚度，当移动终端内放入电池时，热管60就不会与电池接触，不会影响移动终端的厚度。
具体的，热管60与中框40中的温度低于所述第一均热板70温度的部分相连，而不与所述电池接触。也就是说，当移动终端正常运行时，移动终端发热产生热量，热管60连接中框401的部分的温度小于第一均热板70，中框401的温度小于第一均热板70的部分可 以为中框401的远离第一均热板401的一侧的部分，即热管60还连接在中框401的远离第一均热板401的一侧，中框401的散热面积大，散热效率高，而且热管60与电池不接触时，热管60与电池上的热量就不会相互传递。热管60不与电池重叠，不会影响移动终端的厚度。可以理解的是，第一均热板70是用于给热源101进行散热，如CPU进行散热的，中框组件40的温度低于第一均热板70温度的部分可以位于移动终端的底部区域，或者是位于靠近中框组件40边界的区域，这些区域可以放置天线、按键、扬声器等，这些区域在移动终端正常运行时，是低于第一均热板70温度，热管60可以连接在这些区域，或者连接在这些区域上的元件。
在一种实施例中，电池放置区403与中框401的侧壁401c之间的间隙50为闲置空间，可以将部分热管60容置在电池放置区403与中框401的侧壁401c之间的间隙50内，即将部分热管60容置在闲置空间内，这不仅利用了闲置空间，还无需为容置热管60而在移动终端内设置新的空间，从而也就不会增加移动终端的体积。其它实施方式中，电池放置区403与中框401的顶部401a之间设有较多空隙，如电子器件之间的空隙，部分热管60可以容置在这些电子器件的空隙内，并在空隙内延伸，该空隙可以为中框40对应主板10的一侧。
请参阅图5-图6，图5-图6显示热管60与第一均热板70的连接关系。热管60与第一均热板70的连接关系包括但不限于如下三种。
第一种：如图5所示，热管60在垂直于第一均热板70板面的方向上与第一均热板70搭接。具体为：第一段60a在垂直于第一均热板70的方向上搭接至第一均热板70，即第一段60a位于第一均热板70的外部且与部分第一均热板70重叠相接，二者之间可以通过导热胶连接，以增加导热性能。热管60与第一均热板70的重叠搭接可以将热源101传递至第一均热板70上的热量通过热传导的方式传递到热管60上，不仅可以快速传热，而且热管60与第一均热板70的连接方式简单，易操作。在具体的实现方式中，热管60与第一均热板70内可以设有相同的工质。当然热管60与第一均热板70内可以设有不同的工质，如热管60内可以设有第一工质，第一均热板70内可以设有第二工质，第一工质与第二工质不同，如第一工质可以为甲醇、R134A、丙酮等，第二工质可以为水等。热管60和第一均热板70可以通过导热介质连接。导热介质可以为导热胶或石墨材质。导热胶的导热率可以达到1W/m.K以上，导热胶的导热率是普通粘胶层的导热率的2倍以上，具有良好的导热性能。
第二种：如图6所示，热管60与第一均热板70连通。具体为：第一均热板70内设第一腔7，热管60内设第二腔6，第一段60a伸入第一均热板70的内部，可以在第一均热板70上打孔，将热管60的第一段60a伸入孔中，并通过焊接密封固定。第一段60a伸入第一均热板70的方案，可以将第一均热板70的内部空间与热板60的内部空间连通，形成一个完整的较大的导热腔。如图6所示，连通后的热管与第一均热板在内部形成一个较大且完整的导热腔，第一均热板70内的毛细结构a与热管60内的毛细结构b连接，导热腔内的工质完成一次热传导循环经过的路径更长，时间更长，可以将热源的热量传递到中框更大的区域，热量以更加分散的方式传导出去，散热效率高。可以理解：第一均热板70和热管60连通的状态下，相当于延伸了导热腔内的导热介质的传导路径，可以在终端内热源集中 区域及温度较底的区域之间进行均温，这样的架构，均温效果更好。
第三种：第一段60a连接在第一均热板70的侧边，第一均热板70与第一段60a之间可以通过其它连接件焊接固定，也可以将第一段60a与设置在第一均热板70外边缘处的搭接边固定连接。
本申请中，移动终端内的电子器件的高度可能存在差异，如形成热源101的器件的高度不同，这使得中框40部分区域较厚，部分区域较薄，因此，本申请中的均热板的厚度也可以不均匀。例如，请参阅图7，第一均热板70包括厚度不等的三个部分，第一均热板70内的第一腔7亦呈容积不等的状态分布，第一腔7内设毛细结构a，毛细结构a呈阶梯状分布。第一均热板70的第一腔7内还分布多个支撑柱，用于支撑第一腔7，以防止第一均热板70变形，使第一腔的内部空间变小。本实施方式中，第一均热板70的厚度呈阶梯递增，可以适应于高度呈阶梯递减的电子器件，这还可以使得第一均热板70内部的均流腔的体积逐渐较增大，工质的流动范围更大，散热效果更好。可以理解的是，第一均热板70的厚度不均匀的方式还以为其他方式，如第一均热板70的厚度呈现均匀高低交错，或者不均匀高低交错，以对应不同高度的电子器件，第一均热板70的厚度还可以为直线递减，或者直线递增。本申请的第一均热板70的厚度依据具体的使用环境中电子器件的高度确定。
本申请可以实现不同区域采用不同厚度的两相部件(热管60与均热板)；不同区域采用不同宽度的两相部件(热管60与均热板)，实现两相部件(热管60与均热板)在移动终端中框40上的灵活布局。
请参阅图8，图8为中框组件40的另一种俯视的结构示意图，该图中显示了中框组件40包括一个热管60和两个均热板(第一均热板70与第二均热板80)。第二均热板80固定在其他元件放置区404，热管60连接第一均热板70与第二均热板80。本实施例中，热管60的第一段60a固定连接第一均热板70，热管60的第二段60b固定连接第二均热板80，即当热源固定放置在散热区402，其他热源固定放置在其他元件放置区404上时，热源的热量可以传导至第一均热板70并传导至热管60，其他热源的热量可以传导至第二均热板80并传导至热管60，进而第一均热板70、第二均热板80以及热管60的综合作用可以将热源和其他热源的热量快速散去，进而增加了移动终端的使用寿命，提升了消费者的使用体验。
请参阅图9，图9显示了热管60连接第一均热板70与第二均热板80搭接的一种方式。第一均热板70包括第一顶面701以及与第一顶面701相对设置的第一底面702，第二均热板80包括第二顶面801以及与第二顶面801相对设置的第二底面802。热管60连接第一均热板70与第二均热板80的方式包括但不限于如下四种：热管60连接第一顶面701与第二顶面801；热管60弯折以连接第一顶面701与第二底面802；热管60弯折以连接第一底面702与第二顶面801(图9)；热管60连接第一底面702与第二底面802。热管60连接第一均热板70与第二均热板80的上述四种方式均可以实现将热源101以及其他热源102的热量传导至第一均热板70、第二均热板80以及热管60，以及传导至整个中框40。具体选择哪一种方式依据实际的使用需求确定。热管60、第一均热板70以及第二均热板80内的工质可以相同，也可以不同，如热管60内设有第一工质，第一均热板70内设有第二工质，第二均热板80内设有第三工质，第一工质、第二工质、第三工质的至少一种不同，第 一工质、第二工质、第三工质可以为甲醇、R134A、丙酮或水中的一种、两种或三种。
请参阅图10，图10显示热管60与第一均热板70以及与第二均热板80连通的一种方式。热管60的内部空间与第一均热板70的内部空间及第二均热板80的内部空间共同形成一个导热腔。具体的，热管60可以与第一均热板70以及第二均热板80中的一个连通，或者热管60与第一均热板70以及与第二均热板80均连通。连通方式与上述的热管60与第一均热板70的连通方式相同，本申请在此不再赘述。连通后的热管60、第一均热板70以及第二均热板80在内部形成一个更大且完整的导热腔，导热腔内的工质完成一次热传导循环经过的路径更长，时间更长，可以将热源的热量传递到中框40更大的区域，热量以更加分散的方式传导出去，散热效率高。
关于第二均热板80在其他元件放置区404处与中框401的固定方式可以与第一均热板在散热区402处与中框401的固定方式可以相同。中框401上可以设置第一槽、第二槽和第三槽，第一槽设所述散热区402处，第二槽设于其它元件放置区404处，所述第一均热板70嵌入所述第一槽内，所述第二均热板80嵌入所述第二槽内，热管60设于第三槽内。这种均热板及热管嵌入槽的方式这使得第一均热板70、第二均热板80及热管60不会增加中框401的厚度，移动终端可以较薄。可以理解地，第一槽、第二槽和第三槽可以同时设置在一个实施方式中，其它实施方式中，也可以选择性地这三个槽中的一个或两个，根据移动终端内的具体结构配置，例如，有些地方，刚好电子器件之间存在间隙，可供热管放置，这样就不需要设置第三槽。
当然，可以理解的是，所述中框401设有第一槽和第三槽，所述第三槽形成在所述第一槽的底部，所述第一均热板70嵌入所述第一槽内，所述热管60部分嵌入所述第三槽内，在所述槽内的部分所述热管60与所述第一均热板70层叠设置。本实施方式中部分热管60位于第一均热板70和热源101之间，第一槽和第三槽的开口朝向中框401背离热源101的一侧，热源101和热管60及第一均热板70之间有中框401相隔，中框401用于支撑热源101。如此，热源101的热量将首先传递至与热源101相对的中框401，然后传递至第一均热板70与热管60以及中框401的其余部分，从而可将移动终端的热量快速散去。
在另一些实施例中，也可以使用“孔”来代替其中一个或多个“槽”，即第一槽、第二槽和第三槽可以为“孔”的形式，这三个槽中，也可以设计为部分为槽，部分为孔的架构。
请参阅图11，热管60的外表面上设有线槽608，线槽608用于固定移动终端的内的导线，导线用于电连接散热区402内的电子器件和其它元件放置区内的电子器件。具体的，热源可以为例如CPU或GPU等多个大功率器件，其他热源可以为屏幕发声、屏幕驱动等热源，上述的热源与其他热源需要通过导线进行连接，而热管60表面的线槽608可以作为导线的载体，从而可以将导线固定在热管60的线槽608内，进而将导线的位置固定，避免导线由于晃动而发生损坏，提升移动终端的使用寿命。热管60表面设置线槽608的具体的方式可以为通过机加工的方式在热管60的外表面形成槽的方式，也可以在热管60的外表面焊接用于固定导线的结构，例如类似线束的卡勾，线槽608可以形成在卡勾内。
在一个具体的实施例中，所述热管60与所述均热板(第一均热板70、第二均热版80)的外表面设有导热薄膜。导热薄膜的材料可以为石墨烯。导热薄膜的设置使得热管与所述均热板上的热量传导出外界的速度更快。
如下将介绍中框组件40包括两个热管60与一个均热板(第一均热板70)的具体的实施方式。
请参阅图12，图12为中框组件40的另一种俯视结构示意图。本实施例中，热管60至少包括间隔设置的第一热管603与第二热管604，第一热管603与第二热管604均围绕电池放置区403设置。两个热管60的设置散热效果好，可以更快速将热源的热量散去，增加了热源的使用寿命，进而增加了移动终端的使用寿命，提升了消费者的使用体验。而当第一热管603和第二热管604均围绕电池放置区403设置时，利用了电池放置区403与第三侧壁401c以及第四侧壁401d之间的空隙，两个热管60均不会与电池放置区403重叠，不会影响中框40的厚度，当移动终端内放入电池时，热管60就不会与电池重叠，不会影响移动终端的厚度。
在一种具体的实现方式中，第一热管603的第一段60a容置在顶部401a与电池放置区403之间，且靠近第三边缘403c，第一热管603的第二段60b延伸至第三边缘403c与第三侧壁401c之间的第一间隙501；第二热管604亦有部分容置在顶部401a与电池放置区403之间，且靠近第四边缘403d，第二热管604部分延伸至第四边缘403d与第四侧壁401的之间的第二间隙502。
请参阅图13，图13显示中框40组件的另一种俯视结构示意图。该图中显示的热管60仍然为两个。第二热管604围绕电池放置区403，第一热管603搭接电池放置区403上。当电池放置区403域中框401的侧壁401c之间的空间不足以容置两个热管60时，可以将其中的一个热管60搭接在电池放置区403上，如此既可以利用两个热管60的散热效果，中框401的可用于散热的区域更大，散热效果好，可以更快速将热源的热量散去，增加了热源的使用寿命，进而增加了移动终端的使用寿命，提升了消费者的使用体验；还可以有效利用电池放置区403与中框401的第三侧壁401c以及第四侧壁401d之间的空间以及其他空间。而且，第一热管603搭接电池放置区403上的此种方式便于第一热管603的安装，方便操作，而且第一热管603可以用于对电池的热量进行散热。
具体的，当第一热管603搭接电池放置区403上时，第一热管603与电池的表面连接，从而电池上的热量还可以传递至第一热管603上，进而传递至整个中框401，实现中框401对电池的散热，散热面积大，散热效果好。
在另一实施例中，中框组件40可以包括两个热管60与两个均热板，如第一热管603、第二热管604、第一均热板70以及第二均热板80。第一均热板70固定在散热区402，第二均热板80固定在其他元件放置区404，第一热管603与第二热管604均围绕电池放置区403，第一热管603的第一段60a连接第一均热板70，第一热管603的第二段60b连接第二均热板80，第二热管604的第一段60a连接第一均热板70，第二热管604的第二段60b连接第二均热板80。
当然，在其他实现方式中，可以有更多的热管60与均热板，如第三均热板等、第三热管60等，更多的均热板与热管60连接可以实现更大面积的散热。
本申请提供的一个或多个热管60中的至少一个热管60在电子器件之间延伸，和/或一个或多个热管中的至少一个热管60在电子器件和中框401的边界之间延伸。电子器件可以为终端内的背光模组、电池、CPU、摄像头、按键、扬声器等，如图13所示，其中，第一 热管603在电子器件之间延伸，可以理解为，在电池及与电池层叠的背光模组之间延伸。第二热管604在电子器件和中框边界之间延伸，可以理解为在电池和中框边界之间延伸。本申请的上述中框组件40与移动终端实现了利用热管60与均热板的综合导热效果，增强了散热效果，提升了消费者的使用体验。
以上所揭露的仅为本申请较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于申请所涵盖的范围。

Claims (22)

  1. 一种中框组件，用于承载移动终端内的电子器件，所述电子器件包括热源，其特征在于，所述中框组件包括中框、一个或多个热管以及第一均热板；
    所述中框包括对应所述热源的散热区，所述第一均热板容置于所述散热区，用于对所述热源进行散热；
    所述一个或多个热管的连接至所述第一均热板，用于对所述第一均热板进行散热。
  2. 根据权利要求1所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管还与所述中框中的温度低于所述第一均热板温度的部分相连。
  3. 根据权利要求2所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管通过导热介质与所述中框相连。
  4. 根据权利要求1-3任一项所述的中框组件，其特征在于，所述一个或多个热管通过导热介质与所述第一均热板连接。
  5. 根据权利要求1-3任一项所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管的内部空间与所述第一均热板的内部空间连通，以形成一个导热腔。
  6. 根据权利要求5所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管的一端***到所述第一均热板内部。
  7. 根据权利要求1-6任一项所述的中框组件，其特征在于，所述电子器件还包括电池，所述中框还包括对应所述电池的电池放置区，所述电池放置区包括相对设置的第一边缘和第二边缘，所述散热区邻近所述第一边缘，所述一个或多个热管中的至少一个热管从所述散热区朝向所述第二边缘的方向上延伸。
  8. 根据权利要求7所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管不与所述电池接触。
  9. 根据权利要求8所述的中框组件，其特征在于，所述中框包括顶部、与所述顶部相对设置的底部以及位于所述顶部与所述底部的两个侧壁，所述电池放置区与所述侧壁之间形成间隙，所述一个或多个热管中的至少一个热管伸入所述间隙内。
  10. 根据权利要求7所述的中框组件，其特征在于，所述一个或多个热管中的至少一个与所述电池的表面接触。
  11. 根据权利要求7所述的中框组件，其特征在于，所述一个或多个热管包括间隔设置的第一热管与第二热管，所述第一热管围绕所述电池放置区，所述第二热管部分与所述电池放置区重叠设置。
  12. 根据权利要求7所述的中框组件，其特征在于，所述中框包括顶部、与所述顶部相对设置的底部以及位于所述顶部与所述底部的两个侧壁，所述散热区位于所述电池放置区的所述第一边缘和所述顶部之间，所述电池放置区的所述第二边缘和所述底部之间设有其他元件放置区，所述中框还包括第二均热板，所述第二均热板固定在其他元件放置区，所述一个或多个热管中的至少一个热管还连接所述第二均热板。
  13. 根据权利要求12所述的中框组件，其特征在于，所述中框设有第一挖除区、第二挖除区和第三挖除区，所述第一均热板嵌入所述第一挖除区内，所述第二均热板嵌入所述 第二挖除区内，所述一个或多个热管中的至少一个热管嵌入所述第三挖除区内，所述第一挖除区为槽或孔，所述第二挖除区为槽或孔，所述第三挖除区为槽或孔。
  14. 根据权利要求13所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管的一端搭接在所述第一均热板上，所述一个或多个热管中的至少一个热管的另一端搭接在所述第二均热板上。
  15. 根据权利要求1-12任一项所述的中框组件，其特征在于，所述中框设有孔，所述中框包括朝向所述孔内部延伸的第一搭接边，所述第一均热板包括第三搭接边，所述第一搭接边与所述第三搭接边搭接，以使所述第一均热板固定至所述中框。
  16. 根据权利要求15所述的中框组件，其特征在于，所述第一搭接边与所述第三搭接边通过焊接固定。
  17. 根据权利要求1-12任一项所述的中框组件，其特征在于，所述中框设有槽，所述第一均热板容置在所述槽内，所述第一均热板与所述槽底通过导热胶固定。
  18. 根据权利要求17所述的中框组件，其特征在于，所述中框包括朝向所述槽内延伸的第一搭接边，所述第一均热板包括第三搭接边，所述第一搭接边与所述第三搭接边搭接固定。
  19. 根据权利要求1-12任一项所述的中框组件，其特征在于，所述中框设有第一挖除区和第三挖除区，所述第三挖除区形成在所述第一挖除区的底部，所述第一均热板嵌入所述第一挖除区内，所述一个或多个热管中的至少一个热管部分嵌入所述第三挖除区内，在所述第三挖除区内的部分所述一个或多个热管中的至少一个热管与所述第一均热板层叠设置，所述第一挖除区为槽或孔，所述第二挖除区为槽或孔。
  20. 根据权利要求1-19任一项所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管在所述电子器件之间延伸，和/或所述一个或多个热管中的至少一个热管在所述电子器件和所述中框的边界之间延伸。
  21. 根据权利要求1-20任一项所述的中框组件，其特征在于，所述一个或多个热管中的至少一个热管的外表面上设有线槽，所述线槽用于固定所述移动终端的内导线，所述导线用于电连接所述移动终端内的电子器件。
  22. 一种移动终端，其特征在于，包括主板以及如权利要求1-21任一项所述的中框组件，所述热源设于所述主板上，所述主板安装于所述中框。
PCT/CN2021/082689 2020-03-24 2021-03-24 移动终端及中框组件 WO2021190552A1 (zh)

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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
JP7273116B2 (ja) * 2021-08-27 2023-05-12 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304817A (zh) * 2015-06-04 2017-01-04 宏碁股份有限公司 电子装置
CN108513515A (zh) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 壳体组件以及电子装置
CN209358916U (zh) * 2018-10-27 2019-09-06 Oppo广东移动通信有限公司 散热装置、壳体及移动终端
CN209563090U (zh) * 2018-11-30 2019-10-29 维沃移动通信有限公司 终端设备
CN212164015U (zh) * 2020-03-24 2020-12-15 华为技术有限公司 移动终端、中框组件及散热组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9547344B2 (en) * 2014-03-05 2017-01-17 Futurewei Technologies, Inc. Support frame with integrated thermal management features
US10095284B2 (en) * 2016-01-29 2018-10-09 Htc Corporation Portable electronic device
CN107278089B (zh) * 2016-04-07 2019-07-19 讯凯国际股份有限公司 热导结构
KR102487229B1 (ko) * 2017-11-24 2023-01-11 삼성전자 주식회사 방열 구조를 포함하는 전자 장치
KR102077002B1 (ko) * 2019-04-08 2020-02-13 주식회사 폴라앤코 스마트폰 일체형 증기챔버

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304817A (zh) * 2015-06-04 2017-01-04 宏碁股份有限公司 电子装置
CN108513515A (zh) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 壳体组件以及电子装置
CN209358916U (zh) * 2018-10-27 2019-09-06 Oppo广东移动通信有限公司 散热装置、壳体及移动终端
CN209563090U (zh) * 2018-11-30 2019-10-29 维沃移动通信有限公司 终端设备
CN212164015U (zh) * 2020-03-24 2020-12-15 华为技术有限公司 移动终端、中框组件及散热组件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4117405A4

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