WO2021157835A1 - Appareil électronique comprenant un élément de dissipation de chaleur - Google Patents

Appareil électronique comprenant un élément de dissipation de chaleur Download PDF

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Publication number
WO2021157835A1
WO2021157835A1 PCT/KR2020/017913 KR2020017913W WO2021157835A1 WO 2021157835 A1 WO2021157835 A1 WO 2021157835A1 KR 2020017913 W KR2020017913 W KR 2020017913W WO 2021157835 A1 WO2021157835 A1 WO 2021157835A1
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WO
WIPO (PCT)
Prior art keywords
disposed
fpcb
heat dissipation
electronic device
dissipation member
Prior art date
Application number
PCT/KR2020/017913
Other languages
English (en)
Korean (ko)
Inventor
이우섭
권오혁
성정오
박정식
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021157835A1 publication Critical patent/WO2021157835A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a heat dissipation member.
  • the electronic device may mount components such as an application processor (AP) and a communication processor (CP) on a printed circuit board (PCB) and provide a multimedia function desired by a user. .
  • AP application processor
  • CP communication processor
  • PCB printed circuit board
  • the capacity of the battery is gradually increasing in order to increase the usage time, and the thickness of the electronic device is gradually decreasing for the convenience of portability.
  • the electronic device includes several components (eg, AP and CP) for implementing various functions, a heat problem may occur.
  • the electronic device may dissipate heat generated from various components mounted on the PCB.
  • An electronic device may include a battery disposed in the electronic device; at least one FPCB disposed on top of the battery; a space formed so that the at least one FPCB is not disposed; a heat dissipation member disposed above the at least one FPCB and in the space; a coil antenna disposed on the heat dissipation member; and a rear cover disposed on an upper portion of the coil antenna, wherein at least a portion of the heat dissipation member is disposed as at least one layer on top of the at least one FPCB, and another portion of the heat dissipation member is a folding layer in the space.
  • a battery disposed in the electronic device
  • at least one FPCB disposed on top of the battery
  • a heat dissipation member disposed above the at least one FPCB and in the space
  • a coil antenna disposed on the heat dissipation member
  • a rear cover disposed on
  • An electronic device may include: a battery disposed in an area within the electronic device; a speaker disposed in another area within the electronic device; at least one FPCB disposed on top of the battery; a heat dissipation member disposed on the at least one FPCB; a shielding sheet disposed on the heat dissipation member; a coil antenna disposed on the shielding sheet; a space formed so that the shielding sheet and the coil antenna are not disposed; and a rear cover disposed on an upper portion of the coil antenna, wherein at least a portion of the heat dissipation member is disposed as at least one layer on top of the at least one FPCB, and another portion of the heat dissipation member is disposed on the at least one FPCB. It may be arranged as a folding layer in the space formed on a part of the speaker and at least a part of the speaker.
  • a folded heat dissipation member eg, a folding layer
  • a predetermined component eg, a coil antenna, a shielding sheet, and/or FPCB
  • FIG. 1 is a perspective view of a front side of a mobile electronic device according to various embodiments of the present disclosure
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure
  • FIG. 4 is a rear perspective view schematically illustrating a configuration of an electronic device including a folded heat dissipation member according to various embodiments of the present disclosure
  • FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 4 .
  • FIG. 6 is a view illustrating a partial configuration of a folded heat dissipation member according to various embodiments of the present disclosure.
  • FIG. 7 is a rear perspective view schematically illustrating the configuration of another embodiment of an electronic device including a folded heat dissipation member according to various embodiments of the present disclosure
  • FIG. 8 is a cross-sectional view taken along line B-B' of FIG. 7 .
  • FIG. 9 is a view illustrating a partial configuration of a folded heat dissipation member according to various embodiments of the present disclosure.
  • FIG. 10 is a rear perspective view schematically illustrating the configuration of another embodiment of an electronic device including a folded heat dissipation member according to various embodiments of the present disclosure
  • FIG. 11 is a cross-sectional view taken along line C-C' of FIG. 10 .
  • FIG. 12 is a view illustrating a partial configuration of a folded heat dissipation member according to various embodiments of the present disclosure.
  • FIG. 1 is a perspective view of a front surface of an electronic device 100 according to various embodiments of the present disclosure.
  • 2 is a perspective view of a rear surface of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.
  • an electronic device 100 includes a first surface (or front) 110A, a second surface (or rear) 110B, and a first surface 110A. and a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the housing may refer to a structure forming a part of the first surface 110A, the second surface 110B, and the side surface 110C of FIGS. 1 and 2 .
  • the first surface 110A may be formed by the front plate 102 (eg, a glass plate comprising various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111 .
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure 118 (or “side member”) including a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 has a first region 110D that extends seamlessly by bending from the first surface 110A toward the rear plate, including a long edge of the front plate. edge) can be included at both ends.
  • the rear plate 111 may include a second region 110E that extends seamlessly from the second surface 110B toward the front plate at both ends of the long edge. there is.
  • the front plate 102 or the back plate 111 may include only one of the first region 110D or the second region 110E.
  • the front plate 102 may not include the first region and the second region, but may include only a flat plane disposed parallel to the second surface 110B.
  • the side bezel structure 118 when viewed from the side of the electronic device 100 , is the first side bezel structure 118 on the side that does not include the first area 110D or the second area 110E as described above. It may have a thickness (or width) of 1, and a second thickness that is thinner than the first thickness at the side surface including the first area or the second area.
  • the electronic device 100 includes the display 101 , the input device 103 , the sound output devices 107 and 114 , the sensor modules 104 , 119 , and the camera modules 105 , 112 , 113 . , a key input device 117 , an indicator (not shown), and at least one of connectors 108 and 109 .
  • the electronic device 100 may omit at least one of the components (eg, the key input device 117 or an indicator) or additionally include other components.
  • the display 101 may be exposed through a substantial portion of the front plate 102 , for example. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first area 110D of the first surface 110A and the side surface 110C.
  • the display 101 may be disposed adjacent to or coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 104 , 119 , and/or at least a portion of a key input device 117 is located in the first area 110D and/or the second area 110E. can be placed.
  • the input device 103 may include a microphone. In some embodiments, the input device 103 may include a plurality of microphones 103 arranged to sense the direction of the sound.
  • the sound output devices 107 and 114 may include speakers 107 and 114 .
  • the speakers 107 and 114 may include an external speaker 107 and a receiver 114 for a call.
  • the microphone 103 , the speakers 107 , 114 , and the connectors 108 , 109 are disposed in the space of the electronic device 100 , and externally through at least one hole formed in the housing 110 . may be exposed to the environment. In some embodiments, a hole formed in the housing 110 may be commonly used for the microphone 103 and the speakers 107 and 114 .
  • the sound output devices 107 and 114 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 110 .
  • the sensor modules 104 , 116 , and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104 , 116 , 119 include, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, HRM sensor) and/or a fourth sensor module 116 disposed on the second side 110B of the housing 110 . ) (eg fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 110A (eg, the display 101) as well as the second surface 110B of the housing 110.
  • the electronic device 100 may include a sensor module, not shown, for example.
  • a sensor module not shown, for example.
  • a gesture sensor a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further added.
  • a gesture sensor e.g., a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further added.
  • IR infrared
  • the camera modules 105 , 112 , and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100 , and a second camera device 112 disposed on the second surface 110B of the electronic device 100 . ), and/or a flash 113 .
  • the camera modules 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one surface of the electronic device 100 .
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 100 may not include some or all of the above-mentioned key input devices 117 and the not included key input devices 117 are displayed on the display 101 as soft keys or the like. It may be implemented in other forms.
  • the key input device 117 may be implemented using a pressure sensor included in the display 101 .
  • the key input device may include a sensor module 116 disposed on the second side 110B of the housing 110 .
  • the indicator may be disposed, for example, on the first surface 110A of the housing 110 .
  • the indicator may provide, for example, state information of the electronic device 100 in the form of light.
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 105 .
  • Indicators may include, for example, LEDs, IR LEDs and xenon lamps.
  • the connector holes 108 and 109 include a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (or earphone jack) 109 capable of accommodating a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole or earphone jack
  • Some of the camera modules 105 and 112 , some of the camera modules 105 , and some of the sensor modules 104 and 119 , 104 or indicators may be disposed to be exposed through the display 101 .
  • the camera module 105 , the sensor module 104 , or the indicator may be in contact with the external environment through a through hole drilled from the internal space of the electronic device 100 to the front plate 102 of the display 101 . can be placed.
  • some sensor modules 104 may be arranged to perform their functions without being visually exposed through the front plate 102 in the internal space of the electronic device. For example, in this case, the area of the display 101 facing the sensor module may not need a through hole.
  • FIG. 3 is an exploded perspective view of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.
  • the electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 100 of FIGS. 1 and 2 , or may include another embodiment of the electronic device.
  • the electronic device 300 (eg, the electronic device 100 of FIG. 1 or FIG. 2 ) includes a side member 310 (eg, a side bezel structure), a first support member 311 (for example, a bracket or support structure), a front plate 320 (for example, a front cover), a display 330 , a printed circuit board 340 , a battery 350 , a second support member 360 (for example, a rear case) , an antenna 370 , and a rear plate 380 (eg, a rear cover).
  • the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. .
  • At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 , or may be integrally formed with the side member 310 .
  • the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may be configured in a first direction (eg, upward) and/or in a second direction (eg, downward) of the electronic device 300 .
  • the printed circuit board 340 may include a structure in which a plurality of printed circuit boards (PCBs) are stacked.
  • the printed circuit board 340 may include an interposer structure.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 . In another embodiment, the battery 350 may be detachably disposed from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • a or B “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and Each of the phrases such as “at least one of A, B, or C” may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof.
  • Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • FIG. 4 is a rear perspective view schematically illustrating a configuration of an electronic device including a folded heat dissipation member according to various embodiments of the present disclosure
  • 5 is a cross-sectional view taken along line A-A' of FIG. 4
  • 6 is a view illustrating a partial configuration of a folded heat dissipation member according to various embodiments of the present disclosure.
  • the electronic device 400 of FIG. 4 may include the electronic devices 100 and 300 illustrated in FIGS. 1 to 3 . 4 may be a transparent perspective view viewed from the rear when the electronic device 400 is placed horizontally.
  • the electronic device 400 may include a first area 401 , a second area 403 , and a third area 405 .
  • the first area 401 may be partitioned in a first direction (eg, left or upper side) of the electronic device 400 .
  • the second area 403 may be partitioned near the center of the electronic device 400 .
  • the third area 405 may be partitioned in a second direction (eg, right or lower) of the electronic device 400 .
  • the third region 405 may include, for example, a space 407 in which the coil antenna 419 and the shielding sheet 433 illustrated in FIG. 5 are not disposed.
  • the first region 401 , the second region 403 , and the third region 405 are virtual regions partitioned for convenience of description, and the scope of the partition may not be limited.
  • the first region 401 of the electronic device 400 includes a printed circuit board 410 , a shield can 411 , a heat dissipation sheet 413 , a support member 415 , a heat dissipation member 417 , It may include a coil antenna 419 and a rear cover 421 .
  • electronic components such as an application processor (AP), a communication processor (CP), a memory, and/or an interface may be mounted on the printed circuit board 410 .
  • the printed circuit board 410 may include the printed circuit board 340 illustrated in FIG. 3 .
  • the printed circuit board 410 may include a structure in which a plurality of printed circuit boards (PCBs) are stacked.
  • the printed circuit board 410 may include an interposer structure. At least a portion of the printed circuit board 410 may ground the coil antenna 419 .
  • the shield can 411 may be disposed on the printed circuit board 410 .
  • the shield can 411 may be attached to the upper portion of the printed circuit board 410 through soldering or bonding.
  • the shield can 411 may shield an electromagnetic wave generated from an electronic component (eg, an application processor and a communication processor) mounted on the printed circuit board 410 or the coil antenna 419 .
  • the shield can 411 may be made of a metal material having high thermal conductivity, such as copper or aluminum.
  • the heat dissipation sheet 413 may be disposed on the shield can 411 .
  • the heat dissipation sheet 413 may be disposed to be spaced apart from the shield can 411 by a predetermined distance.
  • the heat dissipation sheet 413 may dissipate heat generated from electronic components (eg, an application processor and a communication processor) mounted on the printed circuit board 410 .
  • the heat dissipation sheet 413 may absorb heat generated from the electronic component or transfer it to the support member 415 to cool it.
  • the heat dissipation sheet 413 may include at least one of a graphite sheet, a heat pipe, and a vapor chamber.
  • the support member 415 may be disposed on the heat dissipation sheet 413 .
  • the support member 415 may be attached to an upper portion of the heat dissipation sheet 413 through an adhesive sheet or bonding.
  • the support member 415 may support the heat dissipation member 417 , the coil antenna 419 , and the rear cover 421 disposed thereon.
  • the support member 415 may include the second support member 360 illustrated in FIG. 3 .
  • the support member 415 may include a metal sus.
  • the heat dissipation member 417 may be disposed on the support member 415 .
  • the heat dissipation member 417 may be attached to the upper portion of the support member 415 through an adhesive sheet or bonding.
  • the heat dissipation member 417 may transfer heat generated from the electronic component mounted on the printed circuit board 410 to the folding layer 452 formed in the predetermined space 407 of the third region 405 .
  • the folding layer 452 is a part of the heat dissipation member 417 that is wound at least once, and may dissipate and dissipate the transferred heat.
  • the heat dissipation member 417 may be disposed between the rear cover 421 and the battery 430 provided in the second region 403 .
  • the heat dissipation member 417 may include a graphite material.
  • the heat dissipation member 417 disposed in the first region 401 may be configured as a single layer.
  • the folding layer 452 which is an extension of the heat dissipation member 417 disposed in the third region 405 , may be formed of a plurality of layers.
  • the heat dissipation member 417 disposed in the first area 401 and the second area 403 may be formed of at least one layer.
  • the folding layer 452, which is an extension of the heat dissipation member 417, may be configured by folding at least one heat dissipation member 417 upward and/or downward.
  • the coil antenna 419 may be disposed on the heat dissipation member 417 .
  • the coil antenna 419 may be attached to an upper portion of the heat dissipation member 417 through an adhesive sheet or bonding.
  • the coil antenna 419 may be configured as a flexible printed circuit board (FPCB).
  • the coil antenna 419 may include the antenna 370 illustrated in FIG. 3 .
  • the coil antenna 419 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the coil antenna 419 may be disposed between the rear cover 421 and the battery 430 provided in the second region 403 .
  • the rear cover 421 may be disposed on the coil antenna 419 .
  • the rear cover 421 may protect the above-described printed circuit board 410 , the shield can 411 , the heat dissipation sheet 413 , the support member 415 , the heat dissipation member 417 , and the coil antenna 419 .
  • the rear cover 421 may include the rear plate 111 illustrated in FIG. 2 or the rear plate 380 illustrated in FIG. 3 .
  • the second region 403 of the electronic device 400 includes a battery 430 , at least one FPCB 431 , a heat dissipation member 417 , a shielding sheet 433 , a coil antenna 419 , and A rear cover 421 may be included.
  • FIG. 5 may be a cross-sectional view taken along line A-A' of FIG. 4 .
  • the battery 430 may supply power to at least one component (eg, the printed circuit board 410 ) of the electronic device 400 .
  • the battery 430 may include the battery 350 illustrated in FIG. 3 .
  • the battery 430 may be disposed to be spaced apart from the printed circuit board 410 and the shield can 411 provided in the first region 401 by a predetermined distance. At least a portion of the battery 430 may be disposed substantially on the same plane as the printed circuit board 410 .
  • the at least one FPCB 431 may be disposed on the battery 430 .
  • At least one FPCB (431) is a first FPCB (eg, a first FPCB (541, 641) of FIG. 8 or 11), a second FPCB (eg, a second FPCB (543, 643) of FIG. 8 or 11)
  • a third FPCB eg, may include at least one of the third FPCBs 545 and 645 of FIG. 8 or FIG. 11 ).
  • At least one FPCB 431 may further include other FPCBs other than the first FPCB to the third FPCB.
  • the first FPCB may include a display FPCB.
  • the second FPCB may include a sub FPCB.
  • the third FPCB may include an RF FPCB.
  • the first FPCB may transmit a signal for controlling the display (eg, the display 330 of FIG. 3 ).
  • the second FPCB eg, sub FPCB
  • the third FPCB eg, RF FPCB
  • the at least one FPCB 431 may be, for example, an FPCB that connects the main PCB formed at the upper end and the sub-PCB formed at the lower end. According to an embodiment, at least one FPCB 431 may be connected to the main PCB and the sub PCB using a connector.
  • the heat dissipation member 417 may be disposed on the at least one FPCB 431 .
  • the heat dissipation member 417 may extend integrally from the heat dissipation member 417 provided in the first region 401 .
  • the heat dissipation member 417 may transfer heat transferred through the heat dissipation member 417 provided in the first area 401 to the folding layer 452 formed in the space 407 of the third area 405 .
  • the folding layer 452 is a part of the heat dissipation member 417 , and may dissipate and dissipate the transferred heat.
  • At least a portion of the heat dissipation member 417 may be disposed between the rear cover 421 and the battery 430 .
  • the heat dissipation member 417 at least partially disposed in the second region 403 may be configured as a single layer or a plurality of layers.
  • the heat dissipation member 417 provided in the first area 401 may be disposed on substantially the same plane as the shielding sheet 433 provided in the second area 403 .
  • the heat dissipation member 417 provided in the second area 403 may be disposed on substantially the same plane as at least a portion of the support member 415 provided in the first area 401 .
  • the heat dissipation member 417 provided in the first area 401 may be connected to the heat dissipation member 417 provided in the second area 403 with a step difference.
  • the heat dissipation member 417 provided in the second area 403 may be disposed to be spaced apart from the heat dissipation sheet 413 and the support member 415 provided in the first area 401 by a predetermined distance.
  • the shielding sheet 433 may be disposed on the heat dissipation member 417 .
  • the shielding sheet 433 may be attached to the upper portion of the heat dissipation member 417 through an adhesive sheet or bonding.
  • the shielding sheet 433 may shield at least a portion of the coil antenna 419 disposed thereon.
  • the coil antenna 419 may be disposed on the shielding sheet 433 .
  • the coil antenna 419 may be attached to an upper portion of the shielding sheet 433 through an adhesive sheet or bonding.
  • the coil antenna 419 may be configured as a flexible printed circuit board (FPCB).
  • the coil antenna 419 may be integrally extended from the coil antenna 419 provided in the first region 401 .
  • the rear cover 421 may extend integrally from the rear cover 421 provided in the first area 401 .
  • the third region 405 of the electronic device 400 may include a speaker 450 , a folding layer 452 , and a rear cover 421 .
  • the third region 405 may include, for example, a space 407 in which the coil antenna 419 and the shielding sheet 433 are not disposed.
  • the speaker 450 may output a sound signal to the outside of the electronic device 400 .
  • the speaker 450 may include, for example, a sound output device or a receiver.
  • a portion of the printed circuit board 410 may be disposed under the speaker 450 .
  • the speaker 450 may include the sound output device 107 or the receiver 114 shown in FIGS. 1 and 2 .
  • the speaker 450 may be disposed to be spaced apart from the battery 430 and at least one FPCB 431 by a predetermined distance.
  • the folding layer 452 may be disposed on at least a portion of the at least one FPCB 431 and at least a portion of the speaker 450 .
  • the folding layer 452 may be disposed in a space 407 where the coil antenna 419 and the shielding sheet 433 are not disposed.
  • the folding layer 452 may integrally extend from the heat dissipation member 417 of the first region 401 and the second region 403 .
  • the folding layer 452 may be folded at least once or more.
  • the folding layer 452 may be wound at least once or more.
  • the folding layer 452 may dissipate and dissipate heat transferred from the heat dissipation member 417 of the first region 401 and the second region 403 configured as a single layer.
  • the folding layer 452 may dissipate and dissipate heat transferred through the speaker 450 .
  • the folding layer 452 may be formed by folding the heat dissipation member 417 including a plurality of layers in the first area 401 and the second area 403 .
  • the folding layer 452, which is an extension of the heat dissipation member 417, may be configured by folding at least one heat dissipation member 417 upward and/or downward.
  • the shielding sheet 433 and the coil antenna 419 provided in the second area 403 may not be disposed in the third area 405 .
  • At least a portion of the folding layer 452 may be disposed on at least a portion between the back cover 421 and the battery 430 .
  • the folding layer 405 may be disposed between the rear cover 421 and the battery 430 in at least a portion of the space 407 in which the coil antenna 419 and the shielding sheet 433 are not disposed.
  • the folding layer 452 may be composed of a plurality of layers.
  • the rear cover 421 may extend integrally from the rear cover 421 provided in the second region 403 .
  • the electronic device 400 illustrated in FIGS. 4 and 5 may further include the front plate 320 , the display 330 and the side member 310 (eg, a housing) illustrated in FIG. 3 . there is.
  • a portion of the heat dissipation member 417 is formed of a single layer (eg, the heat dissipation member 417 of the second region 403 ), and the other portion is a folding layer. (452).
  • the folding layer 452 is a part of the heat dissipation member 417 , and the heat dissipation member 417 may be wound upward at least once or more.
  • the folding layer 452 is a part of the heat dissipation member 417 , and the heat dissipation member 417 may be formed of, for example, a plurality of layers having a zigzag shape.
  • FIG. 7 is a rear perspective view schematically illustrating the configuration of another embodiment of an electronic device including a folded heat dissipation member according to various embodiments of the present disclosure
  • 8 is a cross-sectional view taken along line B-B' of FIG. 7
  • 9 is a view illustrating a partial configuration of a folded heat dissipation member according to various embodiments of the present disclosure.
  • the electronic device 500 of FIG. 7 may include the electronic devices 100 , 300 , and 400 illustrated in FIGS. 1 to 3 or 5 . 7 may be a transparent perspective view viewed from the rear when the electronic device 500 is placed vertically.
  • the electronic device 500 of FIG. 7 may be a description of at least a portion of the second region 403 of the electronic device 400 illustrated in FIG. 4 .
  • the embodiments disclosed in FIGS. 7 to 9 may be applied to the above-described embodiments related to FIGS. 4 to 6 .
  • an electronic device 500 includes a battery 530 , at least one FPCB 540 , a space 507 , a heat dissipation member 550 , and a shielding sheet. 560 , a coil antenna 570 and a rear cover 580 may be included.
  • the battery 530 may supply power to at least one component of the electronic device 500 .
  • the battery 530 may include the battery 350 illustrated in FIG. 3 or the battery 430 illustrated in FIG. 5 .
  • the at least one FPCB 540 may be disposed on the battery 530 .
  • the at least one FPCB 540 may include at least one of a first FPCB 541 , a second FPCB 543 , or a third FPCB 545 .
  • At least one FPCB 540 may further include other FPCBs other than the first FPCB 541 to the third FPCB 545 .
  • the first FPCB 541 may include a display FPCB.
  • the second FPCB 543 may include a sub FPCB.
  • the third FPCB 545 may include an RF FPCB.
  • the space 507 may be a space in which at least one FPCB 540 is not disposed.
  • the heat dissipation member 550 may be disposed on the at least one FPCB 540 .
  • the heat dissipation member 550 may include a folding layer 555 .
  • the heat dissipation member 550 is disposed as a single layer on top of the at least one FPCB 540 , and the folding layer 555 that is a part of the heat dissipation member 550 includes at least one FPCB 540 . It may be disposed in an unarranged space 507 .
  • the folding layer 555 may be disposed on at least a portion of the battery 530 .
  • the heat dissipation member 550 may be disposed on the at least one FPCB 540 in a plurality of layers.
  • At least a portion of the heat dissipation member 550 may be disposed between the battery 530 and the rear cover 580 .
  • the folding layer 555 may be folded at least once or more.
  • the folding layer 555 may be wound at least once or more.
  • the shielding sheet 560 may be disposed on the heat dissipation member 550 .
  • the shielding sheet 560 may shield at least a portion of the coil antenna 570 disposed thereon.
  • the coil antenna 570 may be disposed on the shielding sheet 560 .
  • the coil antenna 570 may be attached to the upper portion of the shielding sheet 560 through an adhesive sheet or bonding.
  • the rear cover 580 may be disposed on the coil antenna 570 .
  • the rear cover 580 may protect the above-described battery 530 , at least one FPCB 540 , the heat dissipation member 550 , the shielding sheet 560 , and the coil antenna 570 .
  • the electronic device 500 illustrated in FIGS. 7 and 8 may further include the front plate 320, the display 330, and the side member 310 (eg, a housing) illustrated in FIG. 3 . there is.
  • the heat dissipation member 550 may include a folding layer 555 in which at least a portion is composed of a single layer and the other portion is composed of a plurality of layers. According to various embodiments, at least a portion of the heat dissipation member 550 may be formed of a plurality of layers, and the folding layer 555, which is another portion, may also be formed of a plurality of layers.
  • the folding layer 452, which is an extension of the heat dissipation member 417, may be configured by folding at least one heat dissipation member 417 upward and/or downward.
  • the folding layer 555 is a part of the heat dissipation member 550 , and the heat dissipation member 550 may be wound downward at least once or more.
  • the folding layer 555 is a part of the heat dissipation member 550 , and the heat dissipation member 550 may include, for example, a plurality of layers having a zigzag shape.
  • the heat dissipation member 550 is configured as a single layer or a plurality of layers on at least one FPCB 540 , and a plurality of layers in a space 507 in which at least one FPCB 540 is not disposed. It may be disposed as a folding layer 555 composed of
  • 10 is a rear perspective view schematically illustrating the configuration of another embodiment of an electronic device including a folded heat dissipation member according to various embodiments of the present disclosure
  • 11 is a cross-sectional view taken along line C-C' of FIG. 10
  • 12 is a view illustrating a partial configuration of a folded heat dissipation member according to various embodiments of the present disclosure.
  • the electronic device 600 of FIG. 10 may include the electronic devices 100 , 300 , 400 , and 500 illustrated in FIGS. 1 to 3 , 5 or 7 .
  • 10 may be a transparent perspective view viewed from the rear when the electronic device 600 is placed vertically.
  • the electronic device 600 of FIG. 10 may be a description of at least a portion of the second region 403 of the electronic device 400 illustrated in FIG. 4 .
  • the embodiment disclosed in FIGS. 10 to 11 may be applied to the embodiments related to FIGS. 5 and 6 described above.
  • an electronic device 600 includes a battery 630 , at least one FPCB 640 , a space 607 , a heat dissipation member 650 , and a shielding sheet. 660 , a coil antenna 670 and a rear cover 680 may be included.
  • the battery 630 may supply power to at least one component of the electronic device 600 .
  • the battery 630 may include the battery 350 illustrated in FIG. 3 , the battery 430 illustrated in FIG. 5 , or the battery 530 illustrated in FIG. 8 .
  • the at least one FPCB 640 may be disposed above the battery 630 .
  • the at least one FPCB 640 may include at least one of a first FPCB 641 , a second FPCB 643 , or a third FPCB 645 .
  • At least one FPCB 640 may further include other FPCBs other than the first FPCB 641 to the third FPCB 645 .
  • the first FPCB 641 may include a display FPCB.
  • the second FPCB 643 may include a sub FPCB.
  • the third FPCB 645 may include an RF FPCB.
  • the space 607 may be a space formed between the first FPCB 641 and the second FPCB 643 . According to various embodiments, the space 607 may be a space formed between the second FPCB 643 and the third FPCB 645 . At least one FPCB 640 may not be disposed in the space 607 .
  • the heat dissipation member 650 may be disposed on the at least one FPCB 640 .
  • the heat dissipation member 650 may include a folding layer 655 .
  • the heat dissipation member 650 is disposed as a single layer on top of the first FPCB 641 , the second FPCB 643 , and the third FPCB 645 , and is folded as a part of the heat dissipation member 650 .
  • the layer 655 may be disposed in the space 607 formed between the first FPCB 641 and the second FPCB 643 .
  • the folding layer 655 may be disposed on at least a portion of the battery 630 .
  • the heat dissipation member 550 may be formed of a plurality of layers on the first FPCB 641 , the second FPCB 643 , and the third FPCB 645 .
  • At least a portion of the heat dissipation member 650 may be disposed between the battery 630 and the rear cover 680 .
  • the folding layer 655 may be folded at least once.
  • the folding layer 655 may have a zigzag shape folded at least once.
  • the folding layer 655 may be folded to fit the space 607 having the irregular shape.
  • the shielding sheet 660 may be disposed on the heat dissipation member 650 .
  • the shielding sheet 660 may shield at least a portion of the coil antenna 670 disposed thereon.
  • the coil antenna 670 may be disposed on the shielding sheet 660 .
  • the coil antenna 670 may be attached to the upper portion of the shielding sheet 660 through an adhesive sheet or bonding.
  • the rear cover 680 may be disposed on the coil antenna 670 .
  • the rear cover 680 may protect the above-described battery 630 , at least one FPCB 640 , the heat dissipation member 650 , the shielding sheet 660 , and the coil antenna 670 .
  • the electronic device 600 illustrated in FIGS. 10 and 11 may further include a front plate 320 , a display 330 and a side member 310 (eg, a housing) illustrated in FIG. 3 . there is.
  • the heat dissipation member 650 may include a folding layer 655 in which at least a portion is composed of a single layer and the other portion is composed of a plurality of layers.
  • At least a portion of the heat dissipation sheet 650 may be configured with a plurality of layers, and another portion may be configured with a plurality of layers to form the folding layer 555 .
  • the folding layer 655 is a part of the heat dissipation member 650 , and the heat dissipation member 650 may be folded downward at least once to have a zigzag shape.
  • the heat dissipation member 650 is configured as a single layer on the first FPCB 641 , the second FPCB 643 and the third FPCB 645 , and the first FPCB 641 and the second FPCB A folding layer 655 composed of a plurality of layers may be disposed in the space 607 formed between the 643 .
  • the heat dissipation member 650 may be configured in a plurality of layers on the first FPCB 641 , the second FPCB 643 , and the third FPCB 645 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

Divers modes de réalisation de la présente invention concernent un appareil électronique comprenant un élément de dissipation de chaleur qui comprend : une batterie disposée à l'intérieur de l'appareil électronique ; au moins une carte de circuit imprimé flexible (FPCB) disposée au-dessus de la batterie ; un espace formé de telle sorte que la ou les FPCB ne sont pas disposées en son sein ; un élément de dissipation de chaleur disposé au-dessus de la ou des FPCB et à l'intérieur de l'espace ; une antenne à bobine disposée sur l'élément de dissipation de chaleur ; et un couvercle arrière disposé au-dessus de l'antenne à bobine. Au moins une partie de l'élément de dissipation de chaleur est disposée sous la forme d'une seule couche au-dessus de la ou des FPCB, et une autre partie de l'élément de dissipation de chaleur est disposée sous la forme d'une couche de pliage à l'intérieur de l'espace. Ainsi, l'espace limité à l'intérieur de l'appareil électronique peut être utilisé comme structure de dissipation de chaleur efficace. Divers autres modes de réalisation sont possibles.
PCT/KR2020/017913 2020-02-06 2020-12-09 Appareil électronique comprenant un élément de dissipation de chaleur WO2021157835A1 (fr)

Applications Claiming Priority (2)

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KR10-2020-0014441 2020-02-06
KR1020200014441A KR20210100450A (ko) 2020-02-06 2020-02-06 방열 부재를 포함하는 전자 장치

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KR20230045444A (ko) * 2021-09-28 2023-04-04 삼성전자주식회사 방열 구조를 포함하는 전자 장치

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KR102043396B1 (ko) * 2013-02-22 2019-11-12 삼성전자주식회사 방열 안테나 장치, 이를 구비한 휴대 단말기와 배터리 커버 및 배터리 커버 제조 방법

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JP2014138059A (ja) * 2013-01-16 2014-07-28 Nec Access Technica Ltd 熱拡散部材および熱拡散部材を備える電子機器
KR102043396B1 (ko) * 2013-02-22 2019-11-12 삼성전자주식회사 방열 안테나 장치, 이를 구비한 휴대 단말기와 배터리 커버 및 배터리 커버 제조 방법
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