WO2021147788A1 - 无线充电设备及无线充电*** - Google Patents

无线充电设备及无线充电*** Download PDF

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Publication number
WO2021147788A1
WO2021147788A1 PCT/CN2021/072260 CN2021072260W WO2021147788A1 WO 2021147788 A1 WO2021147788 A1 WO 2021147788A1 CN 2021072260 W CN2021072260 W CN 2021072260W WO 2021147788 A1 WO2021147788 A1 WO 2021147788A1
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WO
WIPO (PCT)
Prior art keywords
wireless charging
sub
heat dissipation
cavity
air guide
Prior art date
Application number
PCT/CN2021/072260
Other languages
English (en)
French (fr)
Inventor
裴林
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202020137802.8U external-priority patent/CN211183543U/zh
Priority claimed from CN202010067669.8A external-priority patent/CN111106677A/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021147788A1 publication Critical patent/WO2021147788A1/zh

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This application relates to the field of electronic technology, and in particular to a wireless charging device and a wireless charging system.
  • An embodiment of the present application provides a wireless charging device for charging a device to be charged.
  • the wireless charging device includes:
  • the first heat dissipation component is arranged in the housing, and the first heat dissipation component is used to dissipate heat for the device to be charged;
  • a wireless charging part is provided in the housing, and the wireless charging part is used to wirelessly charge the device to be charged;
  • the second heat dissipation component is arranged in the housing, and the second heat dissipation component is used for dissipating heat for the wireless charging part.
  • An embodiment of the present application also provides a wireless charging system, which includes:
  • a device to be charged, the device to be charged is the aforementioned device to be charged, and the device to be charged includes a wireless receiving coil;
  • a wireless charging device is the above-mentioned wireless charging device
  • the wireless charging part of the wireless charging device includes a wireless transmitting coil, when the wireless charging device and the device to be charged perform wireless charging ,
  • the wireless transmitting coil and the wireless receiving coil are at least partially arranged opposite to each other.
  • FIG. 1 is a schematic diagram of the first structure of a wireless charging device provided by an embodiment of the application.
  • Fig. 2 is a schematic cross-sectional view of the wireless charging device shown in Fig. 1 in the Y-Y direction.
  • FIG. 3 is a schematic diagram of the wireless charging device shown in FIG. 1 from another angle.
  • FIG. 4 is a schematic cross-sectional view of the wireless charging device shown in FIG. 1 in the X-X direction.
  • Fig. 5 is another schematic cross-sectional view of the wireless charging device shown in Fig. 1 in the X-X direction.
  • Fig. 6 is an exploded schematic diagram of the wireless charging device shown in Fig. 1.
  • Fig. 7 is another schematic cross-sectional view of the wireless charging device shown in Fig. 1 in the Y-Y direction.
  • FIG. 8 is a schematic structural diagram of a wireless charging system provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of a device to be charged according to an embodiment of the application.
  • Fig. 10 is a schematic diagram of another side of the device to be charged shown in Fig. 9.
  • An embodiment of the present application provides a wireless charging device, which is used to charge a device to be charged, and the wireless charging device includes:
  • the first heat dissipation component is arranged in the housing, and the first heat dissipation component is used to dissipate heat for the device to be charged;
  • a wireless charging part is provided in the housing, and the wireless charging part is used to wirelessly charge the device to be charged;
  • the second heat dissipation component is arranged in the housing, and the second heat dissipation component is used for dissipating heat for the wireless charging part.
  • the housing includes a first sub-housing and a second sub-housing, the first sub-housing is provided with a first cavity, and the second sub-housing is provided with a second cavity;
  • the first heat dissipation component is disposed in the first cavity, and the wireless charging part and the second heat dissipation component are both disposed in the second cavity.
  • the first heat dissipation assembly includes a first heat dissipation fan, and the first sub-housing is provided with a first air guide opening and a second air guide opening;
  • the first heat dissipation fan is located in the first cavity. After the airflow enters the first air guide opening, it enters the first heat dissipation fan, and then flows from the second air guide opening to the device to be charged.
  • the second sub-housing includes a carrying part, and the carrying part is used to carry the device to be charged;
  • the first sub-housing includes a protrusion protruding from the carrying portion, and the second air guide port is disposed at a position of the protrusion and facing the device to be charged.
  • first air guide opening and the second air guide opening are arranged on opposite sides of the first sub-housing.
  • first air guide opening and the second air guide opening are arranged on opposite sides of the first sub-housing.
  • the wireless charging device further includes a control circuit board, the control circuit board is electrically connected to the wireless charging part, and the control circuit board is disposed in the first sub-housing.
  • the housing further includes a supporting plate located in the first sub-housing, the first sub-housing includes a first cavity, and the supporting plate divides the first cavity into first sub-cavities And a second sub-cavity, the first cooling fan is located in the first sub-cavity, the first air guide opening and the second air guide opening are both in communication with the first sub-cavity, and the control circuit board is located The second sub-cavity.
  • the first heat dissipation assembly further includes a first semiconductor refrigerator, the first semiconductor refrigerator includes a first cooling end and a first heating end that are arranged oppositely, and the first cooling end is located in the first sub-cavity , The first heating end is located in the second sub-cavity;
  • the air flow between the first air guide opening and the second air guide opening passes through the first refrigeration end.
  • the wireless charging device further includes a control circuit board, the control circuit board is electrically connected to the wireless charging part, and the control circuit board is disposed in the first sub-housing.
  • the housing further includes a supporting plate located in the first sub-housing, the first sub-housing includes a first cavity, and the supporting plate divides the first cavity into first sub-cavities And a second sub-cavity, the first cooling fan is located in the first sub-cavity, the first air guide opening and the second air guide opening are both in communication with the first sub-cavity, and the control circuit board is located The second sub-cavity.
  • the first heat dissipation assembly further includes a first semiconductor refrigerator, the first semiconductor refrigerator includes a first cooling end and a first heating end that are arranged oppositely, and the first cooling end is located in the first sub-cavity , The first heating end is located in the second sub-cavity;
  • the air flow between the first air guide opening and the second air guide opening passes through the first refrigeration end.
  • the housing further includes an isolation plate disposed in the housing, and the isolation plate divides the space in the housing into the first cavity and the second cavity.
  • the second heat dissipation assembly includes a second semiconductor refrigerator and a second heat dissipation fan;
  • the second semiconductor refrigerator includes a second cooling end and a second heating end that are oppositely arranged, and the second cooling end is adjacent to the wireless charging part;
  • the second heat dissipation fan is used for dissipating heat to the second heating end.
  • the second heat dissipation assembly further includes a first heat sink, and the first heat sink is disposed between the second semiconductor refrigerator and the second heat dissipation fan, and is adjacent to the second heat dissipation fan.
  • the second sub-housing is provided with a third air guide opening and a fourth air guide opening.
  • the air flow between the third air guide opening and the fourth air guide opening passes through the first air guide opening.
  • a heat sink When the second heat dissipation fan is running, the air flow between the third air guide opening and the fourth air guide opening passes through the first air guide opening.
  • the second heat dissipation assembly includes a second semiconductor refrigerator and a second heat dissipation fan;
  • the second semiconductor refrigerator includes a second cooling end and a second heating end that are oppositely arranged, and the second cooling end is adjacent to the wireless charging part;
  • the second heat dissipation fan is used for dissipating heat to the second heating end.
  • the second heat dissipation assembly further includes a first heat sink, and the first heat sink is disposed between the second semiconductor refrigerator and the second heat dissipation fan, and is adjacent to the second heat dissipation fan.
  • the second sub-housing is provided with a third air guide opening and a fourth air guide opening.
  • the air flow between the third air guide opening and the fourth air guide opening passes through the first air guide opening.
  • a heat sink When the second heat dissipation fan is running, the air flow between the third air guide opening and the fourth air guide opening passes through the first air guide opening.
  • An embodiment of the present application also provides a wireless charging device, which is used to charge a device to be charged, wherein the wireless charging device includes:
  • the housing includes a first sub-housing and a second sub-housing, the first sub-housing is provided with a first cavity, the second sub-housing is provided with a second cavity, and the first sub-housing
  • the body is provided with a first air guide opening and a second air guide opening;
  • the first heat dissipation assembly includes a first heat dissipation fan, the first heat dissipation fan is located in the first cavity, and after the airflow enters the first air guide opening, it enters the first heat dissipation fan, and then Flow from the second air guide to the device to be charged;
  • a wireless charging part is arranged in the second cavity, and the wireless charging part is used to wirelessly charge the device to be charged;
  • the second heat dissipation assembly is arranged in the second cavity, the second heat dissipation assembly includes a second semiconductor refrigerator and a second heat dissipation fan, and the second semiconductor refrigerator includes a second cooling end and a second cooling end that are oppositely arranged.
  • the heating end, the second cooling end is adjacent to the wireless charging part, and the second heat dissipation fan is used for dissipating heat to the second heating end.
  • the first heat dissipation assembly further includes a first semiconductor refrigerator, the first semiconductor refrigerator includes a first cooling end and a first heating end that are arranged oppositely, and the first cooling end is located in the first sub-cavity , The first heating end is located in the second sub-cavity;
  • the air flow between the first air guide opening and the second air guide opening passes through the first refrigeration end.
  • An embodiment of the present application also provides a wireless charging system, which includes:
  • a device to be charged is the device to be charged described in any one of the above embodiments, and the device to be charged includes a wireless receiving coil;
  • a wireless charging device is the wireless charging device described in any one of the above embodiments, and the wireless charging part of the wireless charging device includes a wireless transmitting coil.
  • the wireless transmitting coil and the wireless receiving coil are at least partially arranged opposite to each other.
  • Figure 1 is a schematic diagram of the first structure of a wireless charging device provided by an embodiment of this application
  • Figure 2 is a schematic cross-sectional view of the wireless charging device shown in Figure 1 in the YY direction
  • Figure 3 is a diagram 1 shows a schematic diagram of the wireless charging device from another angle.
  • the wireless charging device 100 provided by the embodiment of the present application includes a housing 120, a first heat dissipation component 140, a wireless charging part 160, and a second heat dissipation component 180.
  • the wireless charging device is used to charge the device to be charged.
  • the first heat dissipation component 140, the wireless charging unit 160 and the second heat dissipation component 180 are all disposed in the housing 120.
  • the first heat dissipation component 140 is used to dissipate heat for the device to be charged.
  • the wireless charging unit 160 is used to wirelessly charge the device to be charged.
  • the second heat dissipation component 180 is used for dissipating heat for the wireless charging unit 160.
  • wireless charging does not require plugging and unplugging of the charging cable, which can charge electronic devices more conveniently, but the heat generated during wireless charging is large, which causes the temperature of the wireless charger to be too high during wireless charging.
  • the first heat dissipating component 140 is used to dissipate heat for the device to be charged
  • the second heat dissipating component 180 is used to dissipate heat to the wireless charging part 160.
  • the wireless charging device 100 not only dissipates heat to the wireless charging part 160, but also dissipates heat to the device to be charged.
  • the wireless charging device 100 has a neat and beautiful appearance and occupies Small space, easy to place.
  • the housing 120 may include a first sub-housing 122 and a second sub-housing 124, the first sub-housing 122 is provided with a first cavity 132, and the second sub-housing 124 is provided with a second cavity 134.
  • the first heat dissipating component 140 is disposed in the first cavity 132 in the first sub-housing 122
  • the wireless charging unit 160 is disposed in the second cavity 134 in the second sub-housing 124
  • the second heat dissipating component 180 is disposed in the second cavity 134 in the second sub-housing 124.
  • the first heat dissipation component 140 located in the first cavity 132 is used for dissipating heat for the device to be charged
  • the second heat dissipation component 180 located in the second cavity 134 is used for dissipating heat for the wireless charging part 160
  • the first heat dissipation component 140 is The charging part 160 and the second heat dissipation component 180 are located in different cavities, and do not affect each other.
  • the first heat dissipation component 140 for dissipating heat to the device to be charged is not easily affected by the wireless charging part 160 and the second heat dissipation component 180.
  • the wireless charging unit 160 may include a wireless transmitting coil
  • the device to be charged may include a wireless receiving coil.
  • the wireless transmitting coil converts electrical energy into magnetic energy and transmits it
  • the wireless receiving coil receives magnetic energy and converts it into electrical energy. Used to charge the device to be charged.
  • the wireless transmitting coil of the wireless charging unit 160 and the wireless receiving coil of the device to be charged realize the conversion of electric energy-magnetic energy-electrical energy, free from the shackles of the charging cable, and realize wireless charging.
  • the heating of the wireless transmitting coil and the wireless receiving coil are both serious, and the higher the power of the wireless charging, the more serious the heating of the wireless transmitting coil and the wireless receiving coil.
  • the first heat dissipation component 140 in this embodiment can dissipate heat from the wireless receiving coil of the device to be charged, enhance the heat dissipation performance of the wireless receiving coil, and control the temperature rise of the wireless receiving coil.
  • the second heat dissipation component 180 can transmit wirelessly to the wireless charging unit 160.
  • the coil dissipates heat, enhances the heat dissipation performance of the wireless charging unit 160, and controls the temperature rise of the wireless charging unit 160.
  • the wireless charging unit may also include some other circuit modules, such as at least one of a transformer circuit module, a voltage stabilizing circuit module, and a filter circuit module.
  • the wireless charging unit may also be only a wireless transmitting coil in some embodiments.
  • the first heat dissipation assembly 140 may include a first heat dissipation fan 142, and the first sub-housing 122 is provided with a first air guide opening 1222 and a second air guide opening 1224.
  • the first heat dissipation fan 142 is located in the first cavity 132. When the first heat dissipation fan 142 is running, the airflow enters the first air guide opening 1222, then enters the first heat dissipation fan 142, and then flows from the second air guide opening 1224 to the device to be charged. It can also be understood that the first air guide opening 1222, the first heat dissipation fan 142, and the second air guide opening 1224 form an air duct leading to the device to be charged.
  • the first heat dissipation fan 142, the first air guide opening 1222 and the second air guide opening 1224 are collectively The device to be charged dissipates heat.
  • the first cooling fan 142 When the first cooling fan 142 is running, one of the first air guide opening 1222 and the second air guide opening 1224 serves as an air inlet, and the other serves as an air outlet.
  • the air outlet is at least partially facing the charging device, and the air coming out of the air outlet can be used for charging.
  • the heat generated by the device is taken away, enhancing the heat dissipation effect of the device to be charged, and controlling the temperature rise of the device to be charged.
  • the air inlet can also be at least partly facing the charging device to draw away the hotter air around the device to be charged, which can also enhance the heat dissipation effect of the device to be charged and control the device to be charged. The temperature rise.
  • the first sub-housing 122 and the second sub-housing 124 can work together.
  • the second sub-housing 124 may include a carrying portion 1242, and the carrying portion 1242 is used to carry the device to be charged. It can also be understood that the device to be charged is placed on the bearing portion 1242 for wireless charging, and the wireless charging portion 160 is placed under the bearing portion 1242, that is, the wireless charging portion 160 and the device to be charged are disposed on both sides of the bearing portion 1242.
  • the first sub-housing 122 includes a protrusion 1226 protruding from the carrying portion 1242, and the second air guide opening 1224 is disposed on the protrusion 1226 and facing the device to be charged.
  • the second air guide opening 1224 is at least partially facing the device to be charged, and the second air guide opening 1224 can quickly dissipate heat to the device to be charged in the wireless charging process.
  • the first air guide opening 1222 is an air inlet
  • the second air guide opening 1224 is an air outlet.
  • the air coming out of the second air guide opening 1224 can take away the heat generated during the wireless charging of the device to be charged, and provide the device to be charged wirelessly. Heat dissipation and control the temperature rise of the equipment to be charged.
  • the first air guide opening 1222 is an air outlet
  • the second air guide opening 1224 is an air inlet.
  • the second air guide opening 1224 draws away the hotter air around the device to be charged to dissipate heat from the device to be charged for wireless charging, and control the device to be charged. The temperature rise of charging equipment.
  • first air guide opening 1222 and the second air guide opening 1224 may be arranged on different sides of the first sub-housing 122.
  • the second air guide 1224 is facing the device to be charged, and the first air guide 1222 is away from the device to be charged.
  • first air guide 1222 and the second air guide 1224 are provided on opposite sides of the first sub-housing 122.
  • the first air guide opening 1222 and the second air guide opening 1224 arranged on opposite sides of the first sub-housing 122 cooperate with the first heat dissipation fan 142 to form a relatively straight air duct.
  • the air flow in the air duct is fast and can be taken away more quickly The heat generated by the device to be charged.
  • the first air guide opening and the second air guide opening may also be arranged on two adjacent sides of the first sub-housing.
  • the first air guide opening and the second air guide opening can also be arranged on the same side, for example, both are arranged on the protrusion, wherein the second air guide opening is facing the heating area of the charging device (such as the wireless receiving coil, etc.), and the first air guide opening avoids
  • the device to be charged is opened, such as on a raised edge, and a certain air guide angle is set so that the air passing through the first air guide can avoid the device to be charged.
  • the number of the first air guide openings may be multiple, and the plurality of first air guide openings may be arranged on different sides of the first sub-housing, that is, part of the first air guide openings of the plurality of first air guide openings may be arranged at On the side opposite to the second air guide opening, another part of the first air guide opening is arranged on the side adjacent to the second air guide opening.
  • the wireless charging device 100 may also include a control circuit board 170, which is electrically connected to the wireless charging unit 160, and the control circuit board 170 and the wireless charging unit 160 cooperate. Wirelessly charge the device to be charged.
  • the control circuit board 170 is connected to the city power, and converts the city power (such as 220V or 110V, etc.) into a lower voltage (such as 5V or 12V, etc.) suitable for the operation of the wireless charging unit 160.
  • the control circuit board 170 can be disposed in the first cavity 132, and is located in a different cavity from the wireless charging unit 160.
  • the wireless charging unit 160 generates a lot of heat during the wireless charging process, and the control circuit board 170 is also in the wireless charging process. Heat will be generated. If the wireless charging part 160 and the control circuit board 170 are both arranged in the second cavity 134, it is not conducive to the heat dissipation of the wireless charging part 160, and the high temperature will also affect the control circuit board 170.
  • the control circuit board 170 is arranged in the first cavity 132 so that the heat generated will not affect the heat dissipation of the wireless charging part 160 in the second cavity 134 and will not be affected by the heat generated by the wireless charging part 160 at the same time.
  • the housing 120 may further include a support plate 1228 located in the first sub-housing 122, that is, the support plate 1228 is located in the first cavity 132, and the support plate 1228 divides the first cavity 132 into a first sub-cavity 1322 and a second sub-cavity 1322.
  • the first cooling fan 142 is located in the first sub-cavity 1322
  • the first air guide opening 1222 and the second air guide opening 1224 are both connected to the first sub-cavity 1322
  • the control circuit board 170 is located in the second sub-cavity 1324 .
  • the first cavity 132 in the first sub-housing 122 is divided into a first sub-cavity 1322 and a second sub-cavity 1324 by the support plate 1228, the first heat dissipation fan 142 is located in the first sub-cavity 1322, and the first air guide port 1222 Both the second air guide opening 1224 and the first sub-cavity 1322 communicate with each other.
  • the air duct formed by the first air guide 1222, the first heat dissipation fan 142, and the second air guide 1224 does not pass through additional heating devices (such as a control circuit board), which is generated and blown toward the to-be-charged
  • additional heating devices such as a control circuit board
  • the air temperature of the device is basically the same as the air temperature in the environment, which can better help the device to be charged to dissipate heat. If the air duct formed by the first air guide 1222, the first heat dissipation fan 142, and the second air guide 1224 passes through other heating devices, the temperature of the air generated and blown to the device to be charged will be high, which is not conducive to the heat dissipation of the device to be charged.
  • the first air guide opening 1222 may include a plurality of small heat dissipation holes, may also include one or more large heat dissipation grooves, and may also include heat dissipation structures of other structures, which are not limited herein.
  • the second sub-cavity may not communicate with the first air guide opening and the second air guide opening.
  • the heat generated by the control circuit board is small, and even in the second sub-cavity, the influence on the control circuit board is small. If the control circuit board generates more heat, the second sub-cavity can also be connected to the first air guide. When the first heat dissipating fan is running, ambient air outside the casing will enter the second sub-cavity. If the second sub-cavity is not connected to other air guide openings, part of the air will be discharged from the first air guide opening.
  • the first air guide includes a plurality of small heat dissipation holes, part of the ambient air can enter the second sub-cavity through some heat dissipation holes, and part of the air in the second sub-cavity can be discharged from other heat dissipation holes, thereby taking away the control circuit board.
  • the plurality of heat dissipation holes may be distributed at different positions on one side of the first sub-housing, and may also be distributed at different sides of the first sub-housing, so as to better take away the heat generated by the control circuit board. That is, the first heat dissipation fan and the first air guide opening can also dissipate heat to the control circuit board.
  • the first sub-housing may further include an air guide opening for dissipating heat to the control circuit board, and the air guide opening for dissipating heat to the control circuit board avoids the device to be charged.
  • the first sub-housing includes a top edge, a bottom edge and a side edge, the first sub-cavity is formed by surrounding the top edge, the side edge and the supporting plate, and the second sub-cavity is formed by surrounding the bottom edge, the side and the supporting plate.
  • the air guide for dissipating heat from the control circuit board can be arranged on the bottom side, so as to avoid the device to be charged and the first air guide.
  • FIG. 5 is another schematic cross-sectional view of the wireless charging device shown in FIG. 1 in the X-X direction.
  • the first heat dissipation assembly 140 may also include a first semiconductor cooler 144.
  • the first semiconductor cooler 144 includes a first cooling end 1442 and a first heating end 1444 disposed oppositely.
  • the cooling end 1442 is located in the first sub-cavity 1322, and the first heating end 1444 is located in the second sub-cavity 1324.
  • the first thermoelectric cooler 144 (Thermo Electric Cooler) is made by using the Peltier effect of semiconductor materials.
  • Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of it absorbs heat and the other end releases heat.
  • the heavily doped N-type and P-type bismuth telluride are mainly used as the semiconductor material of TEC.
  • the bismuth telluride elements are connected in series and generate heat in parallel.
  • TEC includes some P-type and N-type pairs (groups), which are connected together by electrodes and sandwiched between two ceramic electrodes; when a current flows through the TEC, the heat generated by the current will be transferred from one side of the TEC to On the other side, a "hot” side (ie heating end) and a “cold” side (ie cooling end) are generated on the TEC, which is the heating and cooling principle of TEC.
  • the air flow between the first air guide opening 1222 and the second air guide opening 1224 passes through the first cooling end 1442, which can also be understood as the first air guide opening 1222, the first heat dissipation fan 142, and the second air guide
  • the tuyere 1224 forms an air duct passing through the first refrigerating end 1442. That is, the air blown to the device to be charged is the air cooled by the first cooling end 1442, which can better dissipate heat to the device to be charged.
  • the first sub-cavity 1322 and the second sub-cavity 1324 can be separated by a support plate, and the heat of the first heating end 1444 in the second sub-cavity 1324 will not or rarely be transferred to the first sub-cavity ⁇ 1322 ⁇ In the body 1322.
  • the support plate may be provided with a through hole through which the first semiconductor refrigerator 144 passes, the first cooling end 1442 is located in the first sub-cavity 1322, and the first heating end 1444 is located in the second sub-cavity 1324. There is no or very small gap between the first semiconductor refrigerator 144 and the support plate.
  • the first semi-conductor refrigerator 144 may also be arranged adjacent to the first air guide 1222, that is, when the outside air enters the first cavity 132, part of the outside air enters the first sub-cavity 1322 through the first refrigeration end 1442, and part of the air passes through the first sub-cavity 1322.
  • the heating end 1444 enters the second sub-cavity 1324 and is isolated from each other. It should be noted that, because the first heating end 1444 generates heat, the first heating end 1444 needs to be dissipated.
  • heat dissipation holes can be added to dissipate heat to the first heating end 1444. It is also possible to add a second heat sink, and the second heat sink is attached to the first heating end 1444 to increase the heat dissipation area so as to dissipate heat to the first heating end 1444. It should be noted that other heat dissipation methods, such as adding a fan, can also be used to dissipate heat for the first heating end 1444, which is not limited here.
  • the supporting plate 1228 may be made of a material that does not conduct heat to prevent the heat in the second sub-cavity 1324 from being transferred to the first sub-cavity 1322.
  • the support plate can also be used to support the first heat dissipation fan, that is, the first heat dissipation fan is installed on the support plate.
  • the control circuit board can be installed on the bottom edge of the first sub-housing or on the supporting board.
  • the first cavity 132 and the second cavity 134 in the housing 120 may be completely isolated.
  • the housing 120 further includes an isolation plate 126.
  • the isolation plate 126 separates the space in the housing 120 to form a first cavity 132 and a second cavity 134, which can also be understood as the isolation plate 126 and the first cavity.
  • the sub-housing 122 forms the first cavity 132; the isolation plate 126 and the second sub-housing 124 form the second cavity 134.
  • the two isolated cavities do not affect each other, and can better dissipate heat for the device to be charged and the wireless charging unit 160 respectively.
  • the isolation plate 126 may be an independent part, or may be integrally formed with other parts, such as integrally formed with the support plate.
  • the first cavity and the second cavity may not be completely isolated, and the first cavity and the second cavity may be partially connected.
  • the isolation plate is not connected to a partial area of the inner surface of the housing, or the isolation plate is provided with through holes.
  • One cavity can borrow the other cavity for heat dissipation.
  • the air entering the first air guide opening of the first cavity can also enter the second cavity and take away the heat of the wireless charging part in the second cavity.
  • the first cavity is divided into a first subcavity and a second subcavity, the first subcavity is not connected with the second cavity, and the second subcavity is connected with the second cavity, and enters the second subcavity.
  • the air in the body can also enter the second cavity and leave the space in the housing through the second cavity. When passing through the second sub-cavity, it can take away the heat of the control circuit board in the second sub-cavity.
  • the air in the second cavity can enter the second sub-cavity and leave the wireless charging device through the heat dissipation hole of the second sub-cavity, so that the heat in the second cavity can be dissipated more quickly.
  • FIG. 6 is an exploded schematic diagram of the wireless charging device shown in FIG. 1, and FIG. 7 is another schematic cross-sectional view of the wireless charging device shown in FIG. 1 along the Y-Y direction.
  • the second heat dissipation assembly 180 may include a second heat dissipation fan 182, and the second heat dissipation fan 182 is used for dissipating heat for the wireless charging unit 160.
  • the second heat dissipation assembly may further include a second semiconductor cooler 184 and a second heat dissipation fan 182.
  • the second semi-conductor refrigerator 184 includes a second cooling end 1842 and a second heating end 1844 disposed oppositely, and the second cooling end 1842 is adjacent to the wireless charging unit 160.
  • the second heat dissipation fan 182 is used for dissipating heat from the second heating end 1844.
  • the second cooling end 1842 is adjacent to the wireless charging unit 160, and takes away the heat generated by the wireless charging unit 160, so that the wireless charging unit 160 always maintains a low temperature and continues to work efficiently.
  • a temperature sensor can be provided in the wireless charging unit 160, and the temperature of the wireless charging unit 160 can always be controlled within a suitable temperature range (for example, between 16-25°C) through the second semiconductor cooler 184, so that wireless charging can be achieved.
  • the heat of the part 160 will not or be reduced to be conducted to the device to be charged, and the first heat dissipation component 140 is used to make the battery of the device to be charged meet the requirements of fast charging temperature (such as 15-35 degrees for fast charging of the battery).
  • the temperature of the wireless charging device 100 is too high during the wireless charging process, or the temperature of the device to be charged is too high, the temperature of the device that is too high needs to be cooled, such as reducing the wireless charging power or suspending wireless charging, etc., which cannot be high.
  • the power is used to perform wireless charging for a long time.
  • the first heat dissipation component 140 cooperates with the first sub-housing 122 to dissipate heat for the device to be charged
  • the second heat dissipation component 180 cooperates with the second sub-housing 124 to dissipate heat to the wireless charging device 100.
  • the wireless charging unit 160 dissipates heat, which can keep the wireless charging device 100 and the device to be charged in a suitable temperature range for a long time, provide high-power wireless charging, improve charging efficiency, and shorten charging time.
  • control circuit board 170 in the wireless charging device 100 can be connected to a temperature sensor, and when the temperature obtained by the temperature sensor is within a suitable temperature range, the control circuit board 170 controls the wireless charging unit 160 to perform high-power wireless charging; When the temperature acquired by the temperature sensor is outside the appropriate temperature range, the control circuit board 170 controls the wireless charging unit 160 to perform low-power wireless charging or suspend wireless charging, so as to protect the wireless charging device 100.
  • the second heat dissipation assembly may further include a second semiconductor cooler 184.
  • the first heat sink 186 is disposed between the second semiconductor cooler 184 and the second heat dissipation fan 182, and is adjacent to the second semiconductor cooler 184 and the second heat dissipation fan 182.
  • the second sub-housing 124 is provided with a third air guide opening 1244 and a fourth air guide opening 1246.
  • the air flow between the third air guide opening 1244 and the fourth air guide opening 1246 passes through the first heat sink 186 It can also be understood that the third air guide opening 1244, the second heat dissipation fan 182, and the fourth air guide opening 1246 form an air duct passing through the first heat sink 186.
  • the second heat dissipation fan 182 draws the air outside the housing 120 from the third air guide opening 1244 into the cavity. After the air flows through the surface of the first heat sink 186 for heat exchange, the hot air is blown out from the fourth air guide opening 1246 to reach the The purpose of a heat sink 186 for heat exchange is to dissipate heat from the second heating end 1844. In this way, a good air circulation can be formed in the first cavity 132 to ensure that the wireless charging unit 160 is always in a lower temperature range and an efficient working mode, so that high-power wireless charging can be continued until the high-power wireless charging ends.
  • the third air guide opening 1244 may be located at the bottom of the second sub-housing 124, and the fourth air guide opening 1246 may be located at the side of the second sub-housing 124.
  • the bottom of the casing can be provided with a supporting part to separate the main body of the casing from the placement surface, and it is convenient for air to enter the casing from the third air guide opening on the bottom side of the main body of the casing.
  • the third air guide opening may be located on the side of the second sub-housing, and the fourth air guide opening may be located at the bottom of the second sub-housing.
  • the first heat sink may have one or more heat dissipation grooves, and one or more heat dissipation grooves may increase the heat dissipation area of the first heat dissipation fin.
  • the second heat dissipation fan When the second heat dissipation fan is running, the first heat dissipation fin and more The air contact can transfer the heat of the first heat sink to the air faster, so that the heat of the first heat sink can be conducted to the outside of the shell faster.
  • the second heat dissipation assembly may not include at least one of the second semiconductor refrigerator and the first heat sink.
  • the second sub-housing may be provided with a matching structure corresponding to the protrusion of the first sub-housing.
  • the wireless charging device may be referred to as a wireless charging base in some embodiments.
  • FIG. 8 is a schematic structural diagram of a wireless charging system provided by an embodiment of the application.
  • the wireless charging system 10 includes a wireless charging device 100 and a device 200 to be charged.
  • the device to be charged 200 is set on the wireless charging device 100, the wireless charging device 100 is used to wirelessly charge the device 200 to be charged, and the wireless charging device 100 is the wireless charging device in any of the above-mentioned embodiments.
  • the device to be charged includes a wireless charging module, and the wireless charging module includes a wireless receiving coil.
  • the wireless receiving coil of the device to be charged and the wireless transmitting coil of the wireless charging part of the wireless charging device are at least partially Relative settings.
  • wireless charging can also be performed, but the efficiency of wireless charging is low.
  • the wireless charging efficiency is higher.
  • the device to be charged can be placed on a wireless charging device for wireless charging.
  • the wireless charging device includes a carrying part that carries the device to be charged.
  • the wireless transmitting coil can be set under the carrying part, and the housing of the device to be charged is also corresponding Equipped with a wireless receiving coil.
  • the wireless transmitting coil and the wireless receiving coil can be arranged relative to each other (that is, the orthographic projections of the wireless transmitting coil and the wireless receiving coil on the carrying part overlap), and each other
  • the distance is very small, which is conducive to the energy transmission between the wireless transmitting coil and the wireless receiving coil, and improves the efficiency of wireless charging.
  • FIG. 9 is a schematic structural diagram of a device to be charged according to an embodiment of the application
  • FIG. 10 is another schematic diagram of the device to be charged shown in FIG. 9.
  • the device to be charged is described by taking a mobile phone as an example.
  • the device to be charged 200 further includes a display screen 210, a housing 220, a circuit board 230, a battery 240, and a wireless charging module 260.
  • the housing 220 includes a frame 222 and a back cover 224.
  • the display screen 210 and the back cover 224 are located on opposite sides of the device to be charged 200.
  • the device to be charged 200 further includes a middle plate.
  • a frame 220 is arranged around the middle plate.
  • the frame 220 and the middle plate can form a middle frame of the device 200 to be charged.
  • the middle plate and the frame 220 form a accommodating cavity on both sides of the middle plate.
  • One accommodating cavity accommodates the display screen 210, and the other accommodating cavity accommodates the circuit board 230, the battery 240, the wireless charging module 260, and other components of the device to be charged 200.
  • Electronic components or functional modules are provided.
  • the middle plate may have a thin plate or sheet-like structure, or a hollow frame structure.
  • the middle frame is used to provide support for the electronic components or functional components in the device to be charged 200, so as to install the electronic components and functional components in the device to be charged 200 together.
  • the camera assembly, receiver, circuit board, battery, wireless charging module and other functional components of the device to be charged 200 can be installed on the middle frame or circuit board 230 for fixing. It is understandable that the material of the middle frame may include metal or plastic.
  • the circuit board 230 may be installed on the middle frame.
  • the circuit board 230 may be the main board of the device 200 to be charged.
  • the circuit board 230 may be integrated with one or more of functional components such as a microphone, a speaker, a headphone interface, a camera assembly, an acceleration sensor, a gyroscope, and a processor.
  • the display screen 210 may be electrically connected to the circuit board 230 to control the display of the display screen through a processor on the circuit board 230.
  • the battery 240 may be installed on the middle frame. At the same time, the battery 240 is electrically connected to the circuit board 230 so that the battery 240 can supply power to the device 200 to be charged.
  • the circuit board 230 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 240 to various electronic components in the device 200 to be charged.
  • the wireless charging module 260 is electrically connected to the battery 240, and the wireless charging module 260 receives energy from the wireless charging device and converts the received energy into electrical energy, and the electrical energy is used to charge the battery 240. Both the wireless charging module 260 and the battery 240 generate heat during the wireless charging process.
  • the first heat dissipation component of the wireless charging device can dissipate heat from the wireless charging module 260 and the battery 240, so that the temperature of the wireless charging module 260 and the battery 240 is in a suitable range (such as 15-35 degrees), the wireless charging module 260, the battery 240, and the wireless charging device may all be in a suitable temperature range during the wireless charging process, and wireless charging can be performed with high power for a long time.
  • the wireless charging module 260 includes a wireless charging part, and the wireless charging part may be disposed between the back cover 224 and the battery 240.
  • the wireless charging part may be arranged adjacent to the back cover 224, or it can be understood that the wireless charging part is installed on the inner surface of the back cover 224.
  • the display screen 210 forms a display surface of the device 200 to be charged, and is used to display information such as images and texts.
  • the display 210 may be a liquid crystal display (Liquid Crystal Display, LCD) or an Organic Light-Emitting Diode (OLED) display.
  • the display screen 210 may be a special-shaped screen, and the display screen 210 may include a display area 212 and a non-display area 214.
  • the display area 212 performs the display function of the display screen 210 and is used to display information such as images and text.
  • the non-display area 214 does not display information, and the non-display area 214 is used to work with the front camera module 282.
  • the non-display area 214 is a high light-transmitting area, and the front camera module 282 can obtain images of the outside through the non-display area 214, such as taking pictures and video recording.
  • the display screen may be a full screen, that is, the front of the display screen is basically a display area, the display area of the display screen is the same, and the front camera module may use a driving mechanism to move from the device to be charged to Take a video outside the device to be charged.
  • the display area of the display screen can also include a main display area and a sub display area. The light transmittance of the sub display area is greater than that of the main display area.
  • the front camera module is set corresponding to the sub display area, such as the one set in the sub display area.
  • the secondary display area can match the main display area to display images. When the secondary display area does not display images, the camera module can take pictures through the secondary display area.
  • the non-display area shown in Figure 9 can be replaced with a secondary display area. Display area.
  • the device to be charged 200 further includes a rear camera module 284.
  • the rear cover 224 has a light-transmitting area corresponding to the rear camera module 284.
  • the rear camera module 284 can obtain images of the outside through the light-transmitting area of the rear cover 224.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of this application, “plurality” means two or more.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种无线充电设备及无线充电***，无线充电设备（100）包括壳体（120）、第一散热组件（140）、无线充电部（160）和第二散热组件（180）；第一散热组件（140）用于给待充电设备（200）散热；无线充电部（160）设置于壳体（120）内，无线充电部（160）用于给待充电设备（200）无线充电；第二散热组件（180）用于给无线充电部（160）散热。

Description

无线充电设备及无线充电***
本申请要求于2020年01月20日提交中国专利局、申请号为202010067669.8、申请名称为“无线充电设备及无线充电***”的中国专利申请的优先权，以及于2020年01月20日提交中国专利局、申请号为202020137802.8、申请名称为“无线充电设备及无线充电***”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，特别涉及一种无线充电设备及无线充电***。
背景技术
随着电子技术的发展，电子设备如手机、平板电脑等已经成为人们日常生活中非常重要的设备，同时电子设备的功耗也是越来越大，需要充电的频率也越来越高。有线充电每次都需要插拔充电线，无线充电不需要插拔充电线，可以更方便的给电子设备充电。
发明内容
本申请实施例提供一种无线充电设备，用于给待充电设备充电，无线充电设备包括：
壳体；
第一散热组件，设置于所述壳体内，所述第一散热组件用于给所述待充电设备散热；
无线充电部，设置于所述壳体内，所述无线充电部用于给所述待充电设备无线充电；以及
第二散热组件，设置于所述壳体内，所述第二散热组件用于给所述无线充电部散热。
本申请实施例还提供一种无线充电***，其包括：
待充电设备，所述待充电设备为上述所述的待充电设备，所述待充电设备包括无线接收线圈；
无线充电设备，所述无线充电设备为上述所述的无线充电设备，所述无线充电设备的所述无线充电部包括无线发射线圈，当所述无线充电设备与所述待充电设备进行无线充电时，所述无线发射线圈与所述无线接收线圈至少部分相对设置。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。
图1为本申请实施例提供的无线充电设备的第一种结构示意图。
图2为图1所示无线充电设备Y-Y向的截面示意图。
图3为图1所示无线充电设备另一角度的示意图。
图4为图1所示无线充电设备X-X向的截面示意图。
图5为图1所示无线充电设备X-X向的另一截面示意图。
图6为图1所示无线充电设备的分解示意图。
图7为图1所示无线充电设备Y-Y向的另一截面示意图。
图8为本申请实施例提供的无线充电***的结构示意图。
图9为本申请实施例提供的待充电设备的结构示意图。
图10为图9所示待充电设备的另一面示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请的保护范围。
本申请实施例提供一种无线充电设备，无线充电设备用于给待充电设备充电，所述无线充电设备包括：
壳体；
第一散热组件，设置于所述壳体内，所述第一散热组件用于给所述待充电设备散热；
无线充电部，设置于所述壳体内，所述无线充电部用于给所述待充电设备无线充电；以及
第二散热组件，设置于所述壳体内，所述第二散热组件用于给所述无线充电部散热。
其中，所述壳体包括第一子壳体和第二子壳体，所述第一子壳体设有第一腔体，所述第二子壳体设有第二腔体；
所述第一散热组件设置于所述第一腔体内，所述无线充电部和第二散热组件均设置于所述第二腔体内。
其中，所述第一散热组件包括第一散热风扇，所述第一子壳体开设有第一导风口和第二导风口；
所述第一散热风扇位于所述第一腔体内，气流进入所述第一导风口之后，进入所述第一散热风扇，之后从所述第二导风口流向所述待充电设备。
其中，所述第二子壳体包括承载部，所述承载部用于承载所述待充电设备；
所述第一子壳体包括凸出于所述承载部的凸起，所述第二导风口设置于所述凸起并朝向所述待充电设备的位置。
其中，所述第一导风口和所述第二导风口设置于所述第一子壳体相对的两侧。
其中，所述第一导风口和所述第二导风口设置于所述第一子壳体相对的两侧。
其中，所述无线充电设备还包括控制电路板，所述控制电路板与所述无线充电部电性连接，所述控制电路板设置于所述第一子壳体内。
其中，所述壳体还包括位于所述第一子壳体内的支撑板，所述第一子壳体包括第一腔体，所述支撑板将所述第一腔体分成第一子腔体和第二子腔体，所述第一散热风扇位于所述第一子腔体，所述第一导风口和第二导风口均与所述第一子腔体连通，所述控制电路板位于所述第二子腔体。
其中，第一散热组件还包括第一半导体制冷器，所述第一半导体制冷器包括相对设置的第一制冷端和第一制热端，所述第一制冷端位于所述第一子腔体，所述第一制热端位于所述第二子腔体；
当所述第一散热风扇运转时，所述第一导风口和所述第二导风口之间的气流经过所述第一制冷端。
其中，所述无线充电设备还包括控制电路板，所述控制电路板与所述无线充电部电性连接，所述控制电路板设置于所述第一子壳体内。
其中，所述壳体还包括位于所述第一子壳体内的支撑板，所述第一子壳体包括第一腔体，所述支撑板将所述第一腔体分成第一子腔体和第二子腔体，所述第一散热风扇位于所述第一子腔体，所述第一导风口和第二导风口均与所述第一子腔体连通，所述控制电路板位于所述第二子腔体。
其中，第一散热组件还包括第一半导体制冷器，所述第一半导体制冷器包括相对设置的第一制冷端和第一制热端，所述第一制冷端位于所述第一子腔体，所述第一制热端位于所述第二子腔体；
当所述第一散热风扇运转时，所述第一导风口和所述第二导风口之间的气流经过所述第一制冷端。
其中，所述壳体还包括隔离板，所述隔离板设置于所述壳体内，所述隔离板将所述壳体内的空间分成所述第一腔体和所述第二腔体。
其中，所述第二散热组件包括第二半导体制冷器和第二散热风扇；
所述第二半导体制冷器包括相对设置的第二制冷端和第二制热端，所述第二制冷端邻接所述无线充电部；
所述第二散热风扇用于给所述第二制热端散热。
其中，所述第二散热组件还包括第一散热片，所述第一散热片设置于所述第二半导体制冷器和所述第二散热风扇之间，并邻接所述第二半导体制冷器的第二制热端；
所述第二子壳体开设有第三导风口和第四导风口，当所述第二散热风扇运转时，所述第三导风口和所述第四导风口之间的气流经过所述第一散热片。
其中，所述第二散热组件包括第二半导体制冷器和第二散热风扇；
所述第二半导体制冷器包括相对设置的第二制冷端和第二制热端，所述第二制冷端邻接所述无线充电部；
所述第二散热风扇用于给所述第二制热端散热。
其中，所述第二散热组件还包括第一散热片，所述第一散热片设置于所述第二半导体制冷器和所述第二散热风扇之间，并邻接所述第二半导体制冷器的第二制热端；
所述第二子壳体开设有第三导风口和第四导风口，当所述第二散热风扇运转时，所述第三导风口和所述第四导风口之间的气流经过所述第一散热片。
本申请实施例还提供一种无线充电设备，无线充电设备用于给待充电设备充电，其中，所述无线充电设备包括：
壳体，包括第一子壳体和第二子壳体，所述第一子壳体设有第一腔体，所述第二子壳体设有第二腔体，所述第一子壳体开设有第一导风口和第二导风口；
第一散热组件，所述第一散热组件包括第一散热风扇，所述第一散热风扇位于所述第一腔体内，气流进入所述第一导风口之后，进入所述第一散热风扇，之后从所述第二导风口流向所述待充电设备；
无线充电部，设置于所述第二腔体内，所述无线充电部用于给所述待充电设备无线充电；以及
第二散热组件，设置于所述第二腔体内，所述第二散热组件包括第二半导体制冷器和第二散热风扇，所述第二半导体制冷器包括相对设置的第二制冷端和第二制热端，所述第二制冷端邻接所述无线充电部，所述第二散热风扇用于给所述第二制热端散热。
其中，第一散热组件还包括第一半导体制冷器，所述第一半导体制冷器包括相对设置的第一制冷端和第一制热端，所述第一制冷端位于所述第一子腔体，所述第一制热端位于所述第二子腔体；
当所述第一散热风扇运转时，所述第一导风口和所述第二导风口之间的气流经过所述第一制冷端。
本申请实施例还提供一种无线充电***，其包括：
待充电设备，所述待充电设备为上述任意一个实施例中所述的待充电设备，所述待充电设备包括无线接收线圈；
无线充电设备，所述无线充电设备为上述任意一个实施例中所述的无线充电设备，所述无线充电设备的所述无线充电部包括无线发射线圈，当所述无线充电设备与所述待充电设备进行无线充电时，所述无线发射线圈与所述无线接收线圈至少部分相对设置。
请参阅图1、图2和图3，图1为本申请实施例提供的无线充电设备的第一种结构示意图，图2为图1所示无线充电设备Y-Y向的截面示意图，图3为图1所示无线充电设备另一角度的示意图。本申请实施例提供的无线充电设备100包括壳体120、第一散热组件140、无线充电部160和第二散热 组件180。无线充电设备用于给待充电设备充电。
第一散热组件140、无线充电部160和第二散热组件180均设置于壳体120内。第一散热组件140用于给待充电设备散热。无线充电部160用于给待充电设备无线充电。第二散热组件180用于给无线充电部160散热。
可以理解的，无线充电不需要插拔充电线，可以更方便的给电子设备充电，但是无线充电时发热量大，造成无线充电时无线充电器的温度过高。本实施例中，第一散热组件140用于给待充电设备散热，第二散热组件180用于给无线充电部160散热，无线充电设备100不仅给无线充电部160散热，还给待充电设备散热，给无线充电的充电端(发射端)和被充电端(接收端)都散热，能够提高散热效率，有效将无线充电过程中产生的热量散发出去，保持无线充电设备100和待充电设备的温度都位于比较合理的温度范围，保证无线充电的安全。另外，无线充电过程中，若无线充电设备100或待充电设备的温度过高则需要降低充电功率，本实施例有效控制无线充电设备100和待充电设备的温度，使其可以保持较高功率的无线充电，提高充电效率，缩短充电时间。因为第一散热组件140和第二散热组件180等部件都位于壳体120内，可以很好的保护第一散热组件140和第二散热组件180等部件，同时无线充电设备100外观整洁美观，占用空间小，方便放置。
具体的，壳体120可以包括第一子壳体122和第二子壳体124，第一子壳体122设有第一腔体132，第二子壳体124设有第二腔体134。
第一散热组件140设置于第一子壳体122内的第一腔体132内，无线充电部160设置于第二子壳体124内的第二腔体134内，第二散热组件180设置于第二子壳体124内的第二腔体134内。
位于第一腔体132内的第一散热组件140用于给待充电设备散热，位于第二腔体134的第二散热组件180用于给无线充电部160散热，第一散热组件140、与无线充电部160和第二散热组件180分别位于不同的腔体，相互不影响。给待充电设备散热的第一散热组件140不容易被无线充电部160和第二散热组件180影响。
需要说明的是，无线充电部160可以包括无线发射线圈，待充电设备可以包括无线接收线圈，无线发射线圈将电能转换成磁能并发射出去，无线接收线圈接收磁能并将其转换成电能，该电能用于给待充电设备充电。也可以理解为，无线充电部160的无线发射线圈和待充电设备的无线接收线圈实现电能-磁能-电能的转换，摆脱充电线的束缚，实现无线充电。但是在无线充电过程中，无线发射线圈和无线接收线圈的发热都很严重，而且无线充电的功率越高，无线发射线圈和无线接收线圈的发热越严重。本实施例中的第一散热组件140可以对待充电设备的无线接收线圈散热，增强无线接收线圈的散热性能，控制无线接收线圈的温升，第二散热组件180可以对无线充电部160的无线发射线圈散热， 增强无线充电部160的散热性能，控制无线充电部160的温升。可以理解的，无线充电部除了包括无线发射线圈外，还可以包括一些其他电路模块，如包括变压电路模块、稳压电路模块、滤波电路模块等中的至少一种。当然，无线充电部在一些实施例中也可以仅为无线发射线圈。
其中，第一散热组件140可以包括第一散热风扇142，第一子壳体122开设有第一导风口1222和第二导风口1224。第一散热风扇142位于第一腔体132内，当第一散热风扇142运转时，气流进入第一导风口1222之后，进入第一散热风扇142，之后从第二导风口1224流向待充电设备，也可以理解为第一导风口1222、第一散热风扇142和第二导风口1224形成通向待充电设备的风道，第一散热风扇142、第一导风口1222和第二导风口1224共同为待充电设备散热。第一散热风扇142运转时，第一导风口1222和第二导风口1224中的一个作为进风口，另一个作为出风口，出风口至少部分正对待充电设备，出风口出来的空气可以将待充电设备产生的热量带走，增强待充电设备的散热效果，控制待充电设备的温升。
需要说明的是，第一散热风扇142运转时，也可以进风口至少部分正对待充电设备，将待充电设备周边较热的空气抽走，同样可以增强待充电设备的散热效果，控制待充电设备的温升。
第一子壳体122和第二子壳体124可以配合工作。具体的，第二子壳体124可以包括承载部1242，承载部1242用于承载待充电设备。也可以理解为，待充电设备放置在承载部1242上进行无线充电，无线充电部160放置在承载部1242下方，即无线充电部160和待充电设备设置于承载部1242两侧。第一子壳体122包括凸出于承载部1242的凸起1226，第二导风口1224设置于凸起1226并朝向待充电设备的位置。当待充电设备放置在承载部1242上时，第二导风口1224至少部分正对待充电设备，第二导风口1224可以快速给无线充电过程中的待充电设备散热。例如，第一导风口1222为入风口，第二导风口1224为出风口，从第二导风口1224出来的空气可以带走待充电设备无线充电过程中产生的热量，给无线充电的待充电设备散热，控制待充电设备的温升。又例如，第一导风口1222为出风口，第二导风口1224为入风口，通过第二导风口1224将待充电设备周边较热的空气抽走，给无线充电的待充电设备散热，控制待充电设备的温升。
需要说明的是，第一导风口1222和第二导风口1224可以设置在第一子壳体122的不同侧。例如，第二导风口1224正对待充电设备，第一导风口1222背离待充电设备，也可以理解为第一导风口1222和第二导风口1224设置于第一子壳体122相对的两侧，设置于第一子壳体122相对两侧的第一导风口1222和第二导风口1224配合第一散热风扇142可以形成比较直的风道，风道中的空气流速快，可以更快的带走待充电设备产生的热量。
第一导风口和第二导风口还可以设置于第一子壳体相邻的两侧。第一导风口和第二导风口还可以 设置在同一侧，如都设置在凸起上，其中，第二导风口正对待充电设备的发热区域(如无线接收线圈等)，第一导风口避开待充电设备，如位于凸起的边缘，并设置一定的导风角度，使通过第一导风口的空气可以避开待充电设备。可以理解的，第一导风口的数量可以为多个，多个第一导风口可以设置在第一子壳体的不同侧，即多个第一导风口中的部分第一导风口可以设置在与第二导风口相对的一侧，另一部分第一导风口设置在与第二导风口相邻的一侧。
无线充电设备100给待充电设备进行无线充电除了需要无线充电部160外，还可以包括控制电路板170，控制电路板170与无线充电部160电性连接，控制电路板170和无线充电部160配合给待充电设备无线充电。例如，控制电路板170与市电连接，并将市电(如220V或110V等)转换成适合无线充电部160工作的较低的电压(如5V或12V等)。控制电路板170可以设置于第一腔体132，与无线充电部160分别位于不同的腔体，无线充电部160在无线充电过程中会产生大量的热量，控制电路板170在无线充电过程中也会产生热量，若无线充电部160和控制电路板170都设置在第二腔体134内，不利于无线充电部160的散热，而且高温也会对控制电路板170造成影响。将控制电路板170设置在第一腔体132内，使其产生的热量不会影响第二腔体134内无线充电部160的散热，同时也不会被无线充电部160产生的热量影响。
请结合图4，图4为图1所示无线充电设备X-X向的截面示意图。壳体120还可以包括位于第一子壳体122内的支撑板1228，即支撑板1228位于第一腔体132内，支撑板1228将第一腔体132分成第一子腔体1322和第二子腔体1324，第一散热风扇142位于第一子腔体1322，第一导风口1222和第二导风口1224均与第一子腔体1322连通，控制电路板170位于第二子腔体1324。
第一子壳体122内的第一腔体132被支撑板1228分成第一子腔体1322和第二子腔体1324，第一散热风扇142位于第一子腔体1322，第一导风口1222和第二导风口1224均与第一子腔体1322连通。当第一散热风扇142运转时，第一导风口1222、第一散热风扇142和第二导风口1224形成的风道没有经过额外的发热器件(如控制电路板)，其产生并吹向待充电设备的空气与环境中的空气温度基本一致，可以更好的帮助待充电设备散热。若第一导风口1222、第一散热风扇142和第二导风口1224形成的风道经过其他发热器件，其产生并吹向待充电设备的空气温度会较高，不利于待充电设备散热。
第一导风口1222可以包括多个小的散热孔，也可以包括一个或多个大的散热槽，还可以包括其他结构的散热结构，在此不再限定。
若控制电路板的发热不多，则第二子腔体可以不与第一导风口和第二导风口连通。控制电路板产生的热量较小，即使在第二子腔体内，对控制电路板的影响也很小。若控制电路板的发热较多，则第二子腔体还可以与第一导风口连通。当第一散热风扇运转时，会有壳体外的环境空气进入第二子腔体， 若第二子腔体没有与其他导风口连接，则会有部分空气从第一导风口排出。例如，第一导风口包括多个小的散热孔，部分环境空气可以从一些散热孔进入第二子腔体，第二子腔体内的部分空气可以从其他散热孔排出，从而带走控制电路板产生的热量。其中，多个散热孔可以分布于第一子壳体一侧的不同位置，也可以分布于第一子壳体的不同侧，从而更好可以带走控制电路板产生的热量。即，第一散热风扇和第一导风口还可以给控制电路板散热。需要说明的是，第一子壳体还可以包括给控制电路板散热的导风口，给控制电路板散热的导风口避开待充电设备。例如，第一子壳体包括顶边、底边和侧边，第一子腔体由顶边、侧边和支撑板围绕形成，第二子腔体由底边、侧边和支撑板围绕形成，给控制电路板散热的导风口可以设置在底边，从而避开待充电设备和第一导风口。
请参阅图5并结合图1至图3，图5为图1所示无线充电设备X-X向的另一截面示意图。为了更好的给待充电设备散热，第一散热组件140还可以包括第一半导体制冷器144，第一半导体制冷器144包括相对设置的第一制冷端1442和第一制热端1444，第一制冷端1442位于第一子腔体1322，第一制热端1444位于第二子腔体1324。第一半导体制冷器144(Thermo Electric Cooler)是利用半导体材料的珀尔帖效应制成的。所谓珀尔帖效应，是指当直流电流通过两种半导体材料组成的电偶时，其一端吸热，一端放热的现象。重掺杂的N型和P型的碲化铋主要用作TEC的半导体材料，碲化铋元件采用电串联，并且是并行发热。TEC包括一些P型和N型对(组)，它们通过电极连在一起，并且夹在两个陶瓷电极之间；当有电流从TEC流过时，电流产生的热量会从TEC的一侧传到另一侧，在TEC上产生″热″侧(即制热端)和″冷″侧(即制冷端)，这就是TEC的加热与致冷原理。
当第一散热风扇142运转时，第一导风口1222和第二导风口1224之间的气流经过第一制冷端1442，也可以理解为第一导风口1222、第一散热风扇142和第二导风口1224形成经过第一制冷端1442的风道。即，吹向待充电设备的空气为经过第一制冷端1442降温后的空气，可以更好的给待充电设备散热。需要说明的是，第一子腔体1322和第二子腔体1324可以通过支撑板隔离，第二子腔体1324中第一制热端1444的热量不会或很少传递到第一子腔体1322中。具体的，支撑板可以设置一通孔，第一半导体制冷器144穿过该通孔，并且第一制冷端1442位于第一子腔体1322，第一制热端1444位于第二子腔体1324。第一半导体制冷器144与支撑板之间没有间隙或间隙很小，其中，可以通过过盈配合、填充粘结剂、通过弹性部件连接等方式实现第一半导体制冷器144与支撑板之间没有间隙。第一半导体制冷器144还可以相邻第一导风口1222设置，即外部空气进入第一腔体132时，部分外部空气通过第一制冷端1442进入第一子腔体1322，部分空气通过第一制热端1444进入第二子腔体1324，相互之间隔离。需要说明的是，因为第一制热端1444产生了热量，需要对第一制热端1444进行散热。例如，可以增加散热孔，用于给第一制热端1444散热。还可以增加第二散热片，第二散热 片贴合第一制热端1444，增加散热面积，以便给第一制热端1444散热。需要说明的是，给第一制热端1444散热还可以采用其他散热方式，如增加风扇等，在此不做限定。
支撑板1228可以采用不导热的材料制成，防止第二子腔体1324内的热量传递到第一子腔体1322中。
支撑板还可以用于支撑第一散热风扇，即第一散热风扇安装在支撑板上。控制电路板可以安装在第一子壳体的底边上，也可以安装在支撑板上。
壳体120中的第一腔体132和第二腔体134可以完全隔离。具体的，壳体120还包括隔离板126，隔离板126将壳体120内的空间分隔形成第一腔体132和第二腔体134，也可以理解为所述隔离板126和所述第一子壳体122形成所述第一腔体132；所述隔离板126和所述第二子壳体124形成所述第二腔体134。隔离的两个腔体相互不影响，能更好的分别给待充电设备和无线充电部160散热。隔离板126可以为独立部件，也可以与其他部件一体成型，如与支撑板一体成型。需要说明的是，在其他一些实施例中，第一腔体和第二腔体也可以不完全隔离，第一腔体和第二腔体可以部分连通。例如，隔离板与壳体内表面部分区域没有连接，或者隔离板上设置通孔等。其中一个腔体可以借用另一个腔体进行散热。例如，第一腔体的第一导风口进入的空气也可以进入第二腔体，并带走第二腔体内无线充电部的热量。又例如，第一腔体分成第一子腔体和第二子腔体，第一子腔体与第二腔体不连通，第二子腔体与第二腔体连通，进入第二子腔体的空气还可以进入第二腔体，并通过第二腔体离开壳体内的空间，经过第二子腔体时，可以带走第二子腔体内控制电路板的热量。又例如，第二腔体内的空气可以进入第二子腔体，并从第二子腔体的散热孔离开无线充电设备，可以更快的将第二腔体内的热量散发出去。
请参阅图6和图7，图6为图1所示无线充电设备的分解示意图，图7为图1所示无线充电设备Y-Y向的另一截面示意图。第二散热组件180可以包括第二散热风扇182，第二散热风扇182用于给无线充电部160散热。为了更好的给无线充电部160散热，第二散热组件还可以包括第二半导体制冷器184和第二散热风扇182。第二半导体制冷器184包括相对设置的第二制冷端1842和第二制热端1844，第二制冷端1842邻接无线充电部160。第二散热风扇182用于给第二制热端1844散热。第二制冷端1842邻接无线充电部160，将无线充电部160产生的热量带走，使得无线充电部160始终保持低温，持续高效工作。需要说明的是，可以在无线充电部160设置温度传感器，通过第二半导体制冷器184将无线充电部160的温度始终控制在合适的温度范围内(如16-25℃之间)，使无线充电部160的热量不会或减少传导到待充电设备，同时配合第一散热组件140使待充电设备的电池等满足快充温度要求(如电池快充要求15-35度)。
可以理解的，若无线充电过程中，无线充电设备100的温度过高，或者待充电设备的温度过高，需要对温度过高的设备降温，如降低无线充电功率或暂停无线充电等，无法高功率长时间的进行无线充电，本申请实施例中，第一散热组件140配合第一子壳体122给待充电设备散热，第二散热组件180配合第二子壳体124给无线充电设备100的无线充电部160散热，可以让无线充电设备100和待充电设备长期保持在一个合适的温度范围内，提供高功率的无线充电，提高充电效率，缩短充电时长。
需要说明的是，无线充电设备100中的控制电路板170可以与温度传感器连接，当温度传感器获取的温度在合适的温度范围内时，控制电路板170控制无线充电部160进行高功率无线充电；当温度传感器获取的温度在超出合适温度范围内时，控制电路板170控制无线充电部160进行低功率无线充电或暂停无线充电，以保护无线充电设备100。
为了更好的给无线充电设备100散热，第二散热组件还可以包括第二半导体制冷器184，第一散热片186设置于第二半导体制冷器184和第二散热风扇182之间，并邻接第二半导体制冷器184的第二制热端1844。第二子壳体124开设有第三导风口1244和第四导风口1246，当第二散热风扇182运转时，第三导风口1244和第四导风口1246之间的气流经过第一散热片186，也可以理解为第三导风口1244、第二散热风扇182和第四导风口1246形成经过第一散热片186的风道。
第二散热风扇182从第三导风口1244抽取壳体120外的空气进入腔体，空气流经第一散热片186表面进行换热后，将热空气从第四导风口1246吹出，达到给第一散热片186换热的目的，即给第二制热端1844散热。如此，第一腔体132内可以形成良好空气循环，保证无线充电部160始终处于较低温度范围和高效工作模式，从而可以持续做到高功率无线充电，直至高功率无线充电结束。第三导风口1244可以位于第二子壳体124的底边，第四导风口1246可以位于第二子壳体124的侧边。壳体在底部可以设置支撑部，用以壳体的主体与放置面分离，方便让空气从壳体的主体的底边的第三导风口进入壳体内。在其他一些实施例中，第三导风口可以位于第二子壳体的侧边，第四导风口可以位于第二子壳体的底边。
可以理解的，第一散热片可以具有一条或多条散热沟槽，一条或多条散热沟槽可以增加第一散热片的散热面积，当第二散热风扇运转时，第一散热片与更多的空气接触，可以更快将第一散热片的热量传递给空气，以便将第一散热片的热量更快的传导到壳体外。
需要说明的是，在其他一些实施例中，第二散热组件可以不包括第二半导体制冷器和第一散热片中的至少一项。
第二子壳体可以对应第一子壳体的凸起设置配合结构。
无线充电设备在一些实施例中可以称为无线充电底座。
请参阅图8，图8为本申请实施例提供的无线充电***的结构示意图。无线充电***10包括无线充电设备100和待充电设备200。待充电设备200设置于无线充电设备100上，无线充电设备100用于给待充电设备200无线充电，无线充电设备100为上述任一实施例中的无线充电设备。待充电设备包括无线充电模块，无线充电模块包括无线接收线圈，当待充电设备与无线充电设备进行无线充电时，待充电设备的无线接收线圈与无线充电设备的无线充电部的无线发射线圈至少部分相对设置。可以理解的，当无线发射线圈和无线接收线圈部分相对设置时，也可以进行无线充电，但是无线充电效率较低。当无线发射线圈和无线接收线圈相对设置时，无线充电效率较高。
示例性地，待充电设备可以放置在无线充电设备上进行无线充电，无线充电设备包括承载待充电设备的承载部，承载部的下方即可设置无线发射线圈，待充电设备的壳体上也对应设有无线接收线圈，当待充电设备放置在承载部上时，无线发射线圈和无线接收线圈可以相对设置(即无线发射线圈和无线接收线圈在承载部上的正投影重叠)，而且相互之间的距离非常小，有利于无线发射线圈和无线接收线圈之间的能量传输，提高无线充电效率。
请参阅图9和图10，图9为本申请实施例提供的待充电设备的结构示意图，图10为图9所示待充电设备的另一面示意图。待充电设备以手机为例进行说明，待充电设备200还包括显示屏210、壳体220、电路板230、电池240和无线充电模组260。
其中，壳体220包括边框222和后盖224。显示屏210与后盖224位于待充电设备200相对的两侧，待充电设备200还包括中板，边框220围绕中板设置，其中，边框220可以与中板形成待充电设备200的中框。中板和边框220在中板两侧各形成一个容纳腔，其中一个容纳腔容置显示屏210，另一个容纳腔容置电路板230、电池240、无线充电模块260和待充电设备200的其他电子元件或功能模块。
中板可以为薄板状或薄片状的结构，也可以为中空的框体结构。中框用于为待充电设备200中的电子元件或功能组件提供支撑作用，以将待充电设备200中的电子元件、功能组件安装到一起。待充电设备200的摄像头组件、受话器、电路板、电池、无线充电模块等功能组件都可以安装到中框或电路板230上以进行固定。可以理解的，中框的材质可以包括金属或塑胶。
电路板230可以安装在中框上。电路板230可以为待充电设备200的主板。其中，电路板230上可以集成有麦克风、扬声器、耳机接口、摄像头组件、加速度传感器、陀螺仪以及处理器等功能组件中的一个或多个。同时，显示屏210可以电性连接至电路板230，以通过电路板230上的处理器对显示屏的显示进行控制。
电池240可以安装在中框上。同时，电池240电连接至电路板230，以实现电池240为待充电设备200供电。其中，电路板230上可以设置有电源管理电路。电源管理电路用于将电池240提供的电压分 配到待充电设备200中的各个电子元件。
无线充电模块260与电池240电性连接，无线充电模块260接收无线充电设备的能量并将接收的能量转换成电能，该电能用于给电池240充电。无线充电模块260和电池240在无线充电过程中都会发热，无线充电设备的第一散热组件可以对无线充电模块260和电池240进行散热，使无线充电模块260和电池240的温度处于合适的范围(如15-35度)，无线充电模块260、电池240和无线充电设备在无线充电过程中可以都处于合适的温度范围内，可以长时间以高功率进行无线充电。无线充电模块260包括无线充电部，无线充电部可以设置于后盖224和电池240之间。无线充电部可以邻接后盖224设置，也可以理解为，无线充电部安装于后盖224内表面。
显示屏210形成待充电设备200的显示面，用于显示图像、文本等信息。显示屏210可以为液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode，OLED)等类型的显示屏。
显示屏210可以为异形屏，显示屏210可以包括显示区域212以及非显示区域214。其中，显示区域212执行显示屏210的显示功能，用于显示图像、文本等信息。非显示区域214不显示信息，非显示区域214用于配合前置摄像模组282工作。例如，非显示区域214为高透光区域，前置摄像模组282可以透过非显示区域214获取外界的图像，如拍照、摄像等。在其他一些实施例中，显示屏可以为全面屏，即，显示屏的正面基本全部都是显示区域，显示屏的显示区域一致，前置摄像模组可以采用驱动机构从待充电设备内移动到待充电设备外进行摄像。显示屏的显示区域还可以包括主显示区域和副显示区域，副显示区域的透光率大于主显示区域的透光率，前置摄像模组对应副显示区域设置，如设置在副显示区域的下方，副显示区域可以配合主显示区域显示图像，当副显示区域不显示图像时，摄像模组可以透过副显示区域进行摄像，示例性地，图9所示的非显示区域可以替换为副显示区域。
待充电设备200还包括后置摄像模组284，后盖224对应后置摄像模组284设有透光区域，后置摄像模组284可以透过后盖224的透光区域获取外界的图像。
在本申请的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上。
以上对本申请实施例提供的无线充电设备及无线充电***进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种无线充电设备，用于给待充电设备充电，其中，所述无线充电设备包括：
    壳体；
    第一散热组件，设置于所述壳体内，所述第一散热组件用于给所述待充电设备散热；
    无线充电部，设置于所述壳体内，所述无线充电部用于给所述待充电设备无线充电；以及
    第二散热组件，设置于所述壳体内，所述第二散热组件用于给所述无线充电部散热。
  2. 根据权利要求1所述的无线充电设备，其中，所述壳体包括第一子壳体和第二子壳体，所述第一子壳体设有第一腔体，所述第二子壳体设有第二腔体；
    所述第一散热组件设置于所述第一腔体内，所述无线充电部和第二散热组件均设置于所述第二腔体内。
  3. 根据权利要求2所述的无线充电设备，其中，所述第一散热组件包括第一散热风扇，所述第一子壳体开设有第一导风口和第二导风口；
    所述第一散热风扇位于所述第一腔体内，气流进入所述第一导风口之后，进入所述第一散热风扇，之后从所述第二导风口流向所述待充电设备。
  4. 根据权利要求3所述的无线充电设备，其中，所述第二子壳体包括承载部，所述承载部用于承载所述待充电设备；
    所述第一子壳体包括凸出于所述承载部的凸起，所述第二导风口设置于所述凸起并朝向所述待充电设备的位置。
  5. 根据权利要求3述的无线充电设备，其中，所述第一导风口和所述第二导风口设置于所述第一子壳体相对的两侧。
  6. 根据权利要求4所述的无线充电设备，其中，所述第一导风口和所述第二导风口设置于所述第一子壳体相对的两侧。
  7. 根据权利要求3所述的无线充电设备，其中，所述无线充电设备还包括控制电路板，所述控制电路板与所述无线充电部电性连接，所述控制电路板设置于所述第一子壳体内。
  8. 根据权利要求7所述的无线充电设备，其中，所述壳体还包括位于所述第一子壳体内的支撑板，所述第一子壳体包括第一腔体，所述支撑板将所述第一腔体分成第一子腔体和第二子腔体，所述第一散热风扇位于所述第一子腔体，所述第一导风口和第二导风口均与所述第一子腔体连通，所述控制电路板位于所述第二子腔体。
  9. 根据权利要求8所述的无线充电设备，其中，第一散热组件还包括第一半导体制冷器，所 述第一半导体制冷器包括相对设置的第一制冷端和第一制热端，所述第一制冷端位于所述第一子腔体，所述第一制热端位于所述第二子腔体；
    当所述第一散热风扇运转时，所述第一导风口和所述第二导风口之间的气流经过所述第一制冷端。
  10. 根据权利要求4所述的无线充电设备，其中，所述无线充电设备还包括控制电路板，所述控制电路板与所述无线充电部电性连接，所述控制电路板设置于所述第一子壳体内。
  11. 根据权利要求10所述的无线充电设备，其中，所述壳体还包括位于所述第一子壳体内的支撑板，所述第一子壳体包括第一腔体，所述支撑板将所述第一腔体分成第一子腔体和第二子腔体，所述第一散热风扇位于所述第一子腔体，所述第一导风口和第二导风口均与所述第一子腔体连通，所述控制电路板位于所述第二子腔体。
  12. 根据权利要求11所述的无线充电设备，其中，第一散热组件还包括第一半导体制冷器，所述第一半导体制冷器包括相对设置的第一制冷端和第一制热端，所述第一制冷端位于所述第一子腔体，所述第一制热端位于所述第二子腔体；
    当所述第一散热风扇运转时，所述第一导风口和所述第二导风口之间的气流经过所述第一制冷端。
  13. 根据权利要求2所述的无线充电设备，其中，所述壳体还包括隔离板，所述隔离板设置于所述壳体内，所述隔离板将所述壳体内的空间分成所述第一腔体和所述第二腔体。
  14. 根据权利要求13所述的无线充电设备，其中，所述第二散热组件包括第二半导体制冷器和第二散热风扇；
    所述第二半导体制冷器包括相对设置的第二制冷端和第二制热端，所述第二制冷端邻接所述无线充电部；
    所述第二散热风扇用于给所述第二制热端散热。
  15. 根据权利要求14所述的无线充电设备，其中，所述第二散热组件还包括第一散热片，所述第一散热片设置于所述第二半导体制冷器和所述第二散热风扇之间，并邻接所述第二半导体制冷器的第二制热端；
    所述第二子壳体开设有第三导风口和第四导风口，当所述第二散热风扇运转时，所述第三导风口和所述第四导风口之间的气流经过所述第一散热片。
  16. 根据权利要求2所述的无线充电设备，其中，所述第二散热组件包括第二半导体制冷器和第二散热风扇；
    所述第二半导体制冷器包括相对设置的第二制冷端和第二制热端，所述第二制冷端邻接所述无线充电部；
    所述第二散热风扇用于给所述第二制热端散热。
  17. 根据权利要求16所述的无线充电设备，其中，所述第二散热组件还包括第一散热片，所述第一散热片设置于所述第二半导体制冷器和所述第二散热风扇之间，并邻接所述第二半导体制冷器的第二制热端；
    所述第二子壳体开设有第三导风口和第四导风口，当所述第二散热风扇运转时，所述第三导风口和所述第四导风口之间的气流经过所述第一散热片。
  18. 一种无线充电设备，用于给待充电设备充电，其中，所述无线充电设备包括：
    壳体，包括第一子壳体和第二子壳体，所述第一子壳体设有第一腔体，所述第二子壳体设有第二腔体，所述第一子壳体开设有第一导风口和第二导风口；
    第一散热组件，所述第一散热组件包括第一散热风扇，所述第一散热风扇位于所述第一腔体内，气流进入所述第一导风口之后，进入所述第一散热风扇，之后从所述第二导风口流向所述待充电设备；
    无线充电部，设置于所述第二腔体内，所述无线充电部用于给所述待充电设备无线充电；以及
    第二散热组件，设置于所述第二腔体内，所述第二散热组件包括第二半导体制冷器和第二散热风扇，所述第二半导体制冷器包括相对设置的第二制冷端和第二制热端，所述第二制冷端邻接所述无线充电部，所述第二散热风扇用于给所述第二制热端散热。
  19. 根据权利要求18所述的无线充电设备，其中，第一散热组件还包括第一半导体制冷器，所述第一半导体制冷器包括相对设置的第一制冷端和第一制热端，所述第一制冷端位于所述第一子腔体，所述第一制热端位于所述第二子腔体；
    当所述第一散热风扇运转时，所述第一导风口和所述第二导风口之间的气流经过所述第一制冷端。
  20. 一种无线充电***，其中，包括：
    待充电设备，所述待充电设备为权利要求1-10中任一项所述的待充电设备，所述待充电设备包括无线接收线圈；
    无线充电设备，所述无线充电设备为权利要求1-10中任一项所述的无线充电设备，所述无线充电设备的所述无线充电部包括无线发射线圈，当所述无线充电设备与所述待充电设备进行无线充电时，所述无线发射线圈与所述无线接收线圈至少部分相对设置。
PCT/CN2021/072260 2020-01-20 2021-01-15 无线充电设备及无线充电*** WO2021147788A1 (zh)

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CN208707367U (zh) * 2018-09-30 2019-04-05 深圳市誉品智能光电科技有限公司 无线充电器
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CN111106677A (zh) * 2020-01-20 2020-05-05 Oppo广东移动通信有限公司 无线充电设备及无线充电***

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WO2019179850A1 (en) * 2018-03-19 2019-09-26 Panasonic Automotive Systems Europe Gmbh Wireless charging device
CN208401601U (zh) * 2018-07-27 2019-01-18 深圳市誉品智能光电科技有限公司 无线充电器
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