WO2021131044A1 - Component module - Google Patents

Component module Download PDF

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Publication number
WO2021131044A1
WO2021131044A1 PCT/JP2019/051527 JP2019051527W WO2021131044A1 WO 2021131044 A1 WO2021131044 A1 WO 2021131044A1 JP 2019051527 W JP2019051527 W JP 2019051527W WO 2021131044 A1 WO2021131044 A1 WO 2021131044A1
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WO
WIPO (PCT)
Prior art keywords
insulating layer
resin
adhesive
electronic component
sealing resin
Prior art date
Application number
PCT/JP2019/051527
Other languages
French (fr)
Japanese (ja)
Inventor
川島由
浜本貴樹
Original Assignee
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽誘電株式会社 filed Critical 太陽誘電株式会社
Priority to PCT/JP2019/051527 priority Critical patent/WO2021131044A1/en
Publication of WO2021131044A1 publication Critical patent/WO2021131044A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates

Definitions

  • the present invention relates to a component module, for example, a component module on which an electronic component is mounted.
  • Patent Document 1 It is known that electronic parts are joined on a resin insulating layer using a resin adhesive, and a metal layer is provided from under the resin insulating layer to connect to the electrodes of the electronic parts through a through hole penetrating the resin insulating layer and the resin adhesive.
  • the resin insulating layer has flexibility, if the adhesion between the sealing resin and the resin adhesive for sealing the electronic parts or between the sealing resin and the resin insulating layer is poor, the sealing resin and the resin insulation are used.
  • the resin insulating layer may be peeled off from the layer.
  • the present invention has been made in view of the above problems, and an object of the present invention is to suppress peeling between the sealing resin and the resin insulating layer.
  • the present invention comprises a flexible resin insulating layer, a resin adhesive provided on the lower surface of the resin insulating layer, and an electronic component bonded to the lower surface of the resin insulating layer via the resin adhesive.
  • the electronic component is sealed in the through hole penetrating the resin insulating layer and the resin adhesive and on the upper surface of the resin insulating layer, the metal layer connected to the electronic component, and the lower surface of the resin insulating layer.
  • the removing portion may be configured to penetrate the resin adhesive and reach a part of the resin insulating layer.
  • the bottom surface of the removal portion can be configured to be located inside the resin adhesive.
  • the removing portion may be provided on the lower surface of the resin insulating layer to which the resin adhesive is not provided.
  • the removing portion may be located at the end of the resin insulating layer, and the sealing resin may cover the end face of the adhesive.
  • At least a part of the removal portion is a hole penetrating the resin adhesive and the resin insulating layer, and the sealing resin is provided on the upper surface of the resin insulating layer to seal the electronic component.
  • a configuration including a first sealing resin and a second sealing resin provided on the lower surface of the resin insulating layer, surrounding at least a part of the metal layer, and connected to the first sealing resin through the holes. Can be.
  • the planar shape of the electronic component is substantially rectangular, and the removing portion may be a groove provided in a continuous line along at least two sides of the electronic component.
  • the planar shape of the electronic component is substantially rectangular, and the removing portion may be a configuration in which holes or recesses are scattered along at least two sides of the electronic component.
  • the side surface inside the removal portion can be configured to be substantially orthogonal to the lower surface of the resin insulating layer.
  • FIG. 1 (a) and 1 (b) are a cross-sectional view and a plan view of the component module according to the first embodiment.
  • 2 (a) to 2 (e) are cross-sectional views showing a method of manufacturing a component module according to the first embodiment.
  • FIG. 3A is a cross-sectional view of the component module according to Comparative Example 1
  • FIGS. 3B and 3C are cross-sectional views of the component module according to the first embodiment.
  • 4 (a) and 4 (b) are cross-sectional views of the component modules according to the first and second modifications of the first embodiment, respectively.
  • 5 (a) and 5 (b) are a cross-sectional view and a plan view of the component module according to the third modification of the first embodiment.
  • FIG. 6 is a plan view of the component module according to the modified example 4 of the first embodiment.
  • 7 (a) and 7 (b) are a cross-sectional view and a plan view of the component module according to the modified example 5 of the first embodiment.
  • 8 (a) and 8 (b) are a cross-sectional view and a plan view of the component module according to the modified example 6 of the first embodiment.
  • FIG. 9 is a plan view of the component module according to the modified example 6 of the first embodiment.
  • 10 (a) and 10 (b) are cross-sectional views showing a method of manufacturing a component module according to a modification 6 of the first embodiment.
  • 11 (a) and 11 (b) are plan views of the component module according to the modified example 7 of the first embodiment.
  • FIG. 12 is a cross-sectional view of the component module according to the modified example 8 of the first embodiment.
  • FIG. 1 (a) and 1 (b) are a cross-sectional view and a plan view of the component module according to the first embodiment.
  • FIG. 1B shows an insulating layer 10, an adhesive 12, a metal layer 14, a through hole 16 (via), a groove 18, an electronic component 20, and a sealing resin 24.
  • an adhesive 12 (resin adhesive) is provided on the lower surface of the insulating layer 10 (resin insulating layer).
  • the insulating layer 10 is made of a resin such as a polyimide resin and has flexibility.
  • the thickness of the insulating layer 10 is, for example, 7.5 ⁇ m to 125 ⁇ m.
  • the adhesive 12 is a resin adhesive such as an epoxy resin adhesive.
  • the thickness of the adhesive 12 is, for example, 5 ⁇ m to 50 ⁇ m after curing.
  • the adhesive 12 is thinner than, for example, the insulating layer 10.
  • the adhesive 12 is preferably a resin material having excellent heat resistance and a low dielectric constant.
  • the electronic component 20 is bonded to the lower surface of the insulating layer 10 via an adhesive 12.
  • An electrode 22 is provided on the upper surface of the electronic component 20.
  • the electronic component 20 is, for example, a transistor such as an IGBT (Insulated Gate Bipolar Transistor), a bipolar transistor, or a FET such as a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
  • a semiconductor material such as Si, GaN or SiC is used for the transistor.
  • the electronic component 20 is, for example, a bare chip or a package in which a bare chip is sealed and mounted.
  • the package on which the bare chip is mounted is a package such as WLP (Wafer Level Package) or SIP (Single Inline Package).
  • the electrode 22 is a metal layer whose main material is Cu (copper), Au (gold), Ag (silver), Al (aluminum), or the like.
  • the source electrode, the gate electrode, and the drain electrode are provided on the upper surface where the electrode 22 is provided, and the electrodes 22 are, for example, the source electrode and the drain electrode, and the illustration of the gate electrode is omitted. ..
  • the electrodes 22 are, for example, a source electrode and a gate electrode, and the drain electrode is provided on the lower surface of the electronic component 20.
  • a metal layer 14 is provided on the upper surface of the insulating layer 10 and the inner surface of the through hole 16 penetrating the insulating layer 10 and the adhesive 12.
  • the metal layer 14 is electrically connected to the electrode 22 via the through hole 16.
  • the metal layer 14 uses, for example, copper as a main material.
  • the thickness of the metal layer 14 is, for example, several ⁇ m to 125 ⁇ m, which is the thickness at which the through hole 16 is embedded.
  • the metal layer 14 is thicker than, for example, the insulating layer 10.
  • the metal layer 14 may be thinner than the insulating layer 10.
  • the size of the through hole 16 is, for example, 30 ⁇ m to 500 ⁇ m.
  • a groove 18 is provided that penetrates the adhesive 12 and reaches the insulating layer 10.
  • the groove 18 is provided along at least one side of the upper surface of the electronic component 20.
  • the width of the groove 18 is, for example, 0.05 mm to 0.5 mm.
  • a sealing resin 24 is provided on the lower surface of the adhesive 12 so as to seal (coat) the electronic component 20.
  • the sealing resin 24 is, for example, mainly an epoxy resin and may contain an inorganic filler or the like.
  • the sealing resin 24 is filled in the groove 18.
  • the sealing resin 24 fills the groove 18 described above.
  • the adhesive 12 is applied on the insulating layer 10 (lower in FIG. 2A).
  • a spin coating method, a spray coating method, an inkjet method or a screen printing method is used for the application of the adhesive 12.
  • the insulating layer 10 on which the adhesive 12 is formed in advance may be prepared.
  • the adhesive 12 may be selectively applied corresponding to the region where the electronic component 20 is arranged.
  • the electronic component 20 is arranged on the adhesive 12 (lower in FIG. 2B) so that the upper surface of the electrode 22 is in contact with the adhesive 12.
  • the heat treatment cures the adhesive 12 and joins the electronic component 20 and the insulating layer 10.
  • the heat treatment temperature is, for example, a temperature of 100 ° C. to 300 ° C.
  • a through hole 16 penetrating the insulating layer 10 and the adhesive 12 is formed.
  • the through hole 16 is formed by, for example, irradiating a laser beam. As a result, the upper surface of the electrode 22 is exposed from the through hole 16.
  • a metal layer 14 is formed on the lower surface of the insulating layer 10 (the upper surface in FIG. 2D) and the inner surface of the through hole 16.
  • the metal layer 14 is formed by, for example, the following method.
  • a seed layer is formed on the lower surface of the insulating layer 10 and the inner surface of the through hole 16.
  • the seed layer is formed by using, for example, a sputtering method or a electroless plating method. This seed layer is used as an electrode, and a plating layer is formed on the upper surface thereof by an electrolytic plating method.
  • the metal layer 14 may be formed by printing a conductive paste such as a copper paste by a screen printing method and then sintering the metal layer 14.
  • a groove 18 is formed in at least a part of the adhesive 12 and the insulating layer 10.
  • the groove 18 is formed by using a laser ablation method, an etching method, or a sandblasting method by laser irradiation.
  • the sealing resin 24 is formed on the lower surface of the insulating layer 10 so as to seal the electronic component 20.
  • the sealing resin 24 is a thermosetting resin such as an epoxy resin or a thermoplastic resin.
  • the sealing resin 24 is in contact with the surface of the adhesive 12 and the inner surface of the groove 18.
  • a transfer molding method, an injection method or a compression method is used to form the sealing resin 24.
  • the component module of the first embodiment is manufactured.
  • FIG. 3A is a cross-sectional view of the component module according to Comparative Example 1
  • FIGS. 3B and 3C are cross-sectional views of the component module according to the first embodiment.
  • the groove 18 is not provided in Comparative Example 1.
  • the sealing resin 24 and the adhesive 12 are peeled off from the side surface of the component module as shown by the arrow 50. The peeling may reach the interface between the electronic component 20 and the adhesive 12. Further, if moisture or the like enters the interface between the sealing resin 24 and the adhesive 12 from peeling, the electronic component 20 may deteriorate.
  • the coefficient of linear expansion of the adhesive 12 may be 1.5 times or more or 2 times or more the coefficient of linear expansion of the sealing resin 24 and the insulating layer 10.
  • a temperature cycle due to heat generation of the electronic component 20 is added, and peeling is performed between the insulating layer 10 and the adhesive 12 and at least one of the sealing resin 24 and the adhesive 12. It is likely to occur.
  • both the sealing resin 24 and the adhesive 12 contain an epoxy resin as a main component, the adhesion between the sealing resin 24 and the adhesive 12 may be different depending on the type of the epoxy resin and the additive material other than the epoxy resin. It can get worse.
  • the groove 18 penetrates the adhesive 12 and reaches a part of the insulating layer 10.
  • the groove 18 can prevent the peeling from reaching the electronic component 20.
  • the groove 18 can suppress the intrusion of water or the like into the electronic component 20.
  • the groove 18 penetrates the adhesive 12 and reaches a part of the insulating layer 10, so that peeling between the adhesive 12 and the insulating layer 10 can be suppressed.
  • the side surface of the groove 18 may be inclined with respect to the insulating layer 10.
  • the side surface in the groove 18 may be substantially orthogonal to the lower surface of the insulating layer 10.
  • the adhesiveness between the adhesive 12 and the sealing resin 24 is improved, and the peeling of the adhesive 12 and the sealing resin 24 can be further suppressed.
  • the substantially orthogonal angle ⁇ is 85 ° to 95 °.
  • FIG. 4A is a cross-sectional view of the component module according to the first modification of the first embodiment.
  • the groove 18 does not penetrate the adhesive 12, and a part of the adhesive 12 is formed between the bottom surface of the groove 18 and the insulating layer 10. It remains.
  • the bottom surface of the groove 18 may be located in the adhesive 12. From the viewpoint of suppressing peeling between the sealing resin 24 and the adhesive 12, the depth of the groove 18 is preferably 1 ⁇ 2 or more of the thickness of the adhesive 12.
  • Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
  • FIG. 4B is a cross-sectional view of the component module according to the second modification of the first embodiment.
  • the groove 19 is provided on the lower surface of the insulating layer 10.
  • a groove 18 corresponding to the groove 19 is provided on the lower surface of the adhesive 12.
  • the sealing resin 24 is embedded in the groove 18.
  • a groove 18 may be formed in the adhesive 12 by forming a groove 19 in the insulating layer 10 and then applying the adhesive 12 as in the modified example 2 of the first embodiment.
  • Other configurations are the same as those of the first modification of the first embodiment, and the description thereof will be omitted.
  • FIG. 5B shows an insulating layer 10, a metal layer 14, a through hole 16, a removing portion 18a, an electronic component 20, and a sealing resin 24.
  • a removing portion 18a from which the adhesive 12 has been removed is provided at the end of the component module.
  • the sealing resin 24 is embedded in the removing portion 18a.
  • the end face of the adhesive 12 is coated with the sealing resin 24.
  • peeling of the sealing resin 24 and the adhesive 12 can be suppressed.
  • the removing portion 18a reaches the insulating layer 10 and a part of the lower part of the insulating layer 10 is removed.
  • the removing portion 18a is preferably provided on all the peripheral edges of the component module, but may be provided on at least a part thereof.
  • the width of the removing portion 18a in a plan view is, for example, 0.05 mm to 0.5 mm. Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
  • FIG. 6 is a plan view of the component module according to the modified example 4 of the first embodiment.
  • FIG. 6 shows an insulating layer 10, an adhesive 12, a metal layer 14, a through hole 16, a recess 18b, an electronic component 20, and a sealing resin 24.
  • a plurality of recesses 18b are formed along at least two opposite sides of the electronic component 20 having a substantially rectangular planar shape instead of the groove 18. It is provided.
  • the groove is a recess having an elongated planar shape, and the recess 18b is, for example, a recess shorter than one side of the electronic component 20, and the planar shape is, for example, a square, a rectangle, or a circle.
  • the sealing resin 24 is embedded in the recess 18b.
  • the width (or diameter) of the recess 18b in a plan view is, for example, 0.01 mm to 0.5 mm.
  • the recess 18b may penetrate the adhesive 12 and reach the insulating layer 10 as in the first embodiment. Further, the recess 18b may have a bottom surface in the adhesive 12 as shown in FIG. 4 (a) of the modified example 1 of the first embodiment. Further, as shown in FIG. 4B of the modified example 2 of the first embodiment, a recess 18b is provided on the lower surface of the insulating layer 10, and a recess formed along the shape of the recess 18b is provided on the lower surface of the adhesive 12.
  • the sealing resin 24 may be embedded in the recess. Since other configurations are the same as those of the first embodiment and the first and second modifications thereof, the description thereof will be omitted.
  • the island-shaped recesses 18b are scattered around the electronic component 20 as shown in FIG. Therefore, the first contact portion between the adhesive 12 and the sealing resin 24 in the recess 18b and the second contact portion between the adhesive 12 and the sealing resin 24 in the flat region between the recess 18b and the recess 18b are formed.
  • the degree of adhesion is different. That is, the degree of adhesion is strong, weak, strong, weak, and so on. In this case, even if the adhesive 12 and the sealing resin 24 are to be peeled off at the second adhesion portion for some reason, the first adhesion portions on both sides maintain the adhesion. Therefore, it is possible to prevent the peeling between the adhesive 12 and the sealing resin 24 from spreading over a wide range.
  • the adhesive 12 is sealed at any part of the groove 18.
  • the peeling from the stop resin 24 starts, the peeling proceeds as it is. Specifically, it will be described with reference to FIG. 1 (b).
  • the adhesive 12 and the sealing resin 24 start to peel off at any of the grooves 18 on the right side, in some cases, the adhesive 12 and the sealing resin 24 may be continuously peeled off to the corners at both ends of the right side.
  • the groove 18 has corners, continuous peeling in the groove 18 stops at the corners. As described above, even if the groove 18 is used, the spread of the peeling between the adhesive 12 and the sealing resin 24 can be suppressed because the groove 18 has a corner portion.
  • the recess 18b as in the modified example 4 of the first embodiment can suppress the spread of peeling between the adhesive 12 and the sealing resin 24 from the groove 18 of the modified example 1 of the first embodiment. Further, considering the processing time between the groove 18 and the recess 18b using the laser, the recess 18b has a shorter laser shot time than the groove 18, and the amount of scattered matter due to laser ablation is small. Therefore, the manufacturing method can be simplified by using the recess 18b instead of the groove 18.
  • FIG. 7B shows an insulating layer 10, an adhesive 12, a metal layer 14, a through hole 16, a groove 18, an electronic component 20, and a sealing resin 24.
  • the adhesive 12 is provided between the electronic component 20 and the insulating layer 10 and in the vicinity of the electronic component 20. ..
  • the groove 18 is provided on the lower surface of the insulating layer 10 to which the adhesive 12 is not provided, and the sealing resin 24 is embedded in the groove 18. Even when the adhesive 12 is not provided on the peripheral edge of the component module, the insulating layer 10 and the sealing resin 24 may be peeled off. In this embodiment, peeling between the insulating layer 10 and the sealing resin 24 can be suppressed.
  • the depth of the groove 18 is preferably 1/5 or more of the thickness of the insulating layer 10.
  • the removing portion 18a may be provided at the end of the insulating layer 10 instead of the groove 18.
  • a plurality of recesses 18b may be provided instead of the groove 18.
  • Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
  • FIG. 8 (a) is a cross-sectional view of the component module according to the modified example 6 of the first embodiment
  • FIGS. 8 (b) and 9 are plan views of the component module according to the modified example 6 of the first embodiment.
  • FIG. 8A a groove 17a is shown on the left side of the electronic component 20, and a through hole 17b is shown on the right side of the electronic component 20.
  • FIG. 8B shows the insulating layer 10, the adhesive 12, the through hole 16, the removing portion 18c, the electronic component 20 and the sealing resin 24, and
  • FIG. 9 shows the insulating layer 10, the adhesive 12, and the metal layer 14.
  • the through hole 16, the electronic component 20, the sealing resin 24a, and the resin layer 26 are shown.
  • the removing portion 18c is one of a through hole 17b penetrating the adhesive 12 and the insulating layer 10 and one of the adhesive 12 and the insulating layer 10. It is provided with a groove 17a provided in the portion.
  • the removing portion 18c is provided so as to surround the electronic component 20.
  • the removing portion 18c does not penetrate the adhesive 12 and the insulating layer 10.
  • the removing portion 18c does not penetrate the adhesive 12 and the insulating layer 10
  • the removing portion 18c penetrates the adhesive 12 and the insulating layer 10.
  • the width of the groove 17a in a plan view is, for example, 0.05 mm to 0.5 mm.
  • the width of the through hole 17b in the plane is wider than the width of the groove 17a.
  • a sealing resin 24a is provided on the periphery of the insulating layer 10. The sealing resin 24 and 24a are integrated via the sealing resin 24 in the through hole 17b.
  • a resin layer 26 is provided so as to surround the electronic component 20.
  • the resin layer 26 is, for example, a solder resist, for example, mainly an epoxy resin.
  • a sealing resin 24a is provided so as to surround the resin layer 26. When the resin layer 26 is not provided, the sealing resin 24a fills the upper surface of the insulating layer 10 between the metal layer 14 and the metal layer 14 and between the metal layer 14 and the periphery of the insulating layer 10. It may be provided.
  • the sealing resin 24 (first sealing resin) and 24a (second sealing resin) are integrated through the through holes 17b (holes) that penetrate the adhesive 12 and the insulating layer 10 in the removing portion 18c.
  • the insulating layer 10 and the adhesive 12 are sandwiched and fixed from above and below.
  • a through hole penetrating the adhesive 12 and the insulating layer 10 in the removing portion 18c can be appropriately arranged.
  • the sealing resins 24 and 24a tend to peel off from the corners. Therefore, by making the removing portion 18c provided at the four corners of the component module a through hole 17b, the sealing resin 24 and 24a are more firmly integrated in the through hole 17b. Therefore, peeling of the sealing resin 24 and 24a at the corners of the component module can be suppressed.
  • the grooves 17a are provided in a line along the four sides of the component module. As a result, peeling of the sealing resin 24 and the adhesive 12 on the four sides of the component module can be suppressed.
  • Other configurations are the same as those of the first embodiment and the first to fifth modifications thereof, and the description thereof will be omitted.
  • a plurality of removing portions 18c may be provided so as to surround the electronic component 20 and to be scattered as in the recesses 18b of FIG. 6 of the modified example 4 of the first embodiment. Similar to FIGS. 7 (a) and 7 (b) of the modified example 5 of the first embodiment, at least a part of the removing portion 18c may be formed in a region where the adhesive 12 is not provided.
  • FIGS. 8 (a) and 8 (b) are cross-sectional views showing a method of manufacturing a component module according to FIGS. 8 (a) and 8 (b) of the modified example 6 of the first embodiment.
  • a through hole 17b that penetrates the adhesive 12 and the insulating layer 10 and a groove 17a that does not penetrate the insulating layer 10 are provided.
  • a resin layer 26 is formed on the upper surface of the insulating layer 10 so as to surround the metal layer 14.
  • the insulating layer 10 is arranged in the molds 54 and 55.
  • the space between the molds 54 and 55 is filled with resin.
  • the resin is filled from the lower side to the upper side (or from the upper side to the lower side) of the insulating layer 10 through the through hole 17b.
  • the sealing resins 24 and 24a are formed.
  • the through hole 17b is generally processed so that the lower side is wide and the upper side is narrow by laser irradiation from the lower side. Therefore, when the resin is injected from the wide lower hole side, the injection resistance of the resin is reduced, the resin is easily injected, and the filling property is improved.
  • Example 1 As in Example 1 and its modifications 1 to 6, at least a part of the adhesive 12 and the insulating layer 10 is removed in the removing portion.
  • a sealing resin 24 is embedded in the removing portion.
  • the removing portion may be any of the groove 18, the recess 18b, and the through hole 17b of the removing portion 18c. Further, the removing portion may or may not penetrate the adhesive 12 and the insulating layer 10. However, if the removing portion penetrates the adhesive 12 and the insulating layer 10 over the entire circumference, the inside and the outside of the removing portion are separated. Therefore, it is preferable that a part of the removed portion is non-penetrating.
  • FIG. 11A when the electronic component 20 is, for example, a semiconductor chip, the planar shape is substantially rectangular.
  • the grooves 18 are provided in a continuous line shape along at least two sides of the electronic component 20. By providing the groove 18 along the side, it is possible to prevent the peeling between the adhesive 12 and the sealing resin 24 from spreading to the electronic component 20.
  • the length L1 of the groove 18 is preferably longer than the side length L2 of the electronic component 20.
  • the groove 18 is preferably provided along at least two opposite sides of the electronic component 20.
  • the groove 18 may be provided along at least one side of the electronic component 20.
  • the grooves 18 are provided along the four sides of the electronic component 20 and may be discontinuous with each other. Since the configuration is the same as that of FIG. 1 (b) of the first embodiment, the description thereof will be omitted.
  • removing portion 18a in the modified example 4 of the first embodiment and the removing portion 18c in the modified example 6 of the first embodiment are provided at least on one side of the electronic component 20 or at least two opposing sides of the electronic component 20. Good.
  • the recesses 18b are scattered along at least two sides of the electronic component 20.
  • the length L3 in which the recess 18b is provided is preferably longer than the side length L2 of the electronic component 20.
  • the recess 18b is preferably provided along at least two opposite sides of the electronic component 20. Since other configurations are the same as those in FIG. 6 of the modified example 4 of the first embodiment, the description thereof will be omitted.
  • FIG. 12 is a cross-sectional view of the component module according to the modified example 8 of the first embodiment.
  • an insulating layer 10a is bonded onto the metal layer 14 via an adhesive 12a.
  • a through hole 16a that penetrates the adhesive 12a and the insulating layer 10a is provided.
  • a metal layer 14a is provided on the upper surface of the insulating layer 10a and in the through hole 16a.
  • the metal layer 14a is electrically connected to the metal layer 14 via a through hole 16a.
  • the through hole 17b penetrates the adhesive 12, the insulating layer 10, the adhesive 12a, and the insulating layer 10a.
  • a resin layer 26 is provided on the upper surface of the insulating layer 10a so as to surround the metal layer 14a, and a sealing resin 24a is provided so as to surround the resin layer 26.
  • Other configurations are the same as those of the modified example 6 of the first embodiment, and the description thereof will be omitted.
  • the plurality of insulating layers 10 and 10a and the metal layers 14 and 14a may be alternately laminated.
  • the through holes 17b may be formed at once from the lower surface of the adhesive 12 provided with the electronic component 20 toward the upper surface of the insulating layer 10a, or the adhesive 12 and the insulating layer 10 and the adhesive 12a and the insulating layer 10a may be formed at once.
  • the through hole 17b may be formed in a plurality of times.
  • the side surface of the through hole 17b is tapered so that the sealing resin 24 side is wider than the sealing resin 24a side.
  • the side surface of the through hole 17b is tapered so that the sealing resin 24 side is narrower than the sealing resin 24a side.
  • the side surface of the through hole 17b may be combined with two tapered shapes so as to be the narrowest at any position in the adhesive 12, the insulating layer 10, the adhesive 12a and the insulating layer 10a.
  • Example 1 and Modifications 1 to 5 thereof the adhesive 12 and the insulating layer 10 and the adhesive 12a and the insulating layer 10a may be provided.

Abstract

This component module is provided with: a flexible resin insulation layer 10; a resin adhesive provided to the lower surface of the resin insulation layer; an electronic component 20 joined to the lower surface of the resin insulation layer via the resin adhesive; a metal layer 14 that is connected to the electronic component and provided to the upper surface of the resin insulation layer and within a through hole passing through the resin insulation layer and the resin adhesive; and a sealing resin 24 that is provided so as to seal the electronic component on the lower surface of the resin insulation layer and that is used to fill a removal section from which at least some of the resin adhesive and the resin insulation layer have been removed.　

Description

部品モジュールParts module
　本発明は部品モジュールに関し、例えば電子部品を搭載する部品モジュールに関する。 The present invention relates to a component module, for example, a component module on which an electronic component is mounted.
　樹脂絶縁層上に樹脂接着剤を用い電子部品を接合し、樹脂絶縁層および樹脂接着剤を貫通する貫通孔を介し樹脂絶縁層下から電子部品の電極に接続する金属層を設けることが知られている（例えば特許文献１）。 It is known that electronic parts are joined on a resin insulating layer using a resin adhesive, and a metal layer is provided from under the resin insulating layer to connect to the electrodes of the electronic parts through a through hole penetrating the resin insulating layer and the resin adhesive. (For example, Patent Document 1).
特開２０１６－４６５２３号公報Japanese Unexamined Patent Publication No. 2016-46523
　樹脂絶縁層は可撓性を有するため、電子部品を封止する封止樹脂と樹脂接着剤との間または封止樹脂と樹脂絶縁層と間の密着性が悪い場合、封止樹脂と樹脂絶縁層との間において樹脂絶縁層が剥がれてしまうことがある。 Since the resin insulating layer has flexibility, if the adhesion between the sealing resin and the resin adhesive for sealing the electronic parts or between the sealing resin and the resin insulating layer is poor, the sealing resin and the resin insulation are used. The resin insulating layer may be peeled off from the layer.
　本発明は上記課題に鑑みなされたものであり、封止樹脂と樹脂絶縁層との間における剥がれを抑制することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to suppress peeling between the sealing resin and the resin insulating layer.
　本発明は、可撓性を有する樹脂絶縁層と、前記樹脂絶縁層の下面に設けられた樹脂接着剤と、前記樹脂絶縁層の下面に前記樹脂接着剤を介し接合された電子部品と、前記樹脂絶縁層と前記樹脂接着剤とを貫通する貫通孔内および前記樹脂絶縁層の上面に設けられ、前記電子部品に接続する金属層と、前記樹脂絶縁層の下面に前記電子部品を封止するように設けられ、前記樹脂接着剤および前記樹脂絶縁層の少なくとも一部が除去された除去部に充填された封止樹脂と、を備える部品モジュールである。 The present invention comprises a flexible resin insulating layer, a resin adhesive provided on the lower surface of the resin insulating layer, and an electronic component bonded to the lower surface of the resin insulating layer via the resin adhesive. The electronic component is sealed in the through hole penetrating the resin insulating layer and the resin adhesive and on the upper surface of the resin insulating layer, the metal layer connected to the electronic component, and the lower surface of the resin insulating layer. It is a component module including the resin adhesive and a sealing resin filled in a removing portion from which at least a part of the resin insulating layer has been removed.
　上記構成において、前記除去部は前記樹脂接着剤を貫通し前記樹脂絶縁層の一部に達する構成とすることができる。 In the above configuration, the removing portion may be configured to penetrate the resin adhesive and reach a part of the resin insulating layer.
　上記構成において、前記除去部の底面は前記樹脂接着剤内に位置する構成とすることができる。 In the above configuration, the bottom surface of the removal portion can be configured to be located inside the resin adhesive.
　上記構成において、前記除去部は前記樹脂接着剤が設けられていない前記樹脂絶縁層の下面に設けられる構成とすることができる。 In the above configuration, the removing portion may be provided on the lower surface of the resin insulating layer to which the resin adhesive is not provided.
　上記構成において、前記除去部は前記樹脂絶縁層の端部に位置し、前記封止樹脂は前記接着剤の端面を被覆する構成とすることができる。 In the above configuration, the removing portion may be located at the end of the resin insulating layer, and the sealing resin may cover the end face of the adhesive.
　上記構成において、前記除去部の少なくとも一部は前記樹脂接着剤および前記樹脂絶縁層を貫通する孔であり、前記封止樹脂は、前記樹脂絶縁層の上面に設けられ前記電子部品を封止する第１封止樹脂と、前記樹脂絶縁層の下面に設けられ前記金属層の少なくとも一部を囲み、前記孔を介し前記第１封止樹脂と接続された第２封止樹脂と、を含む構成とすることができる。 In the above configuration, at least a part of the removal portion is a hole penetrating the resin adhesive and the resin insulating layer, and the sealing resin is provided on the upper surface of the resin insulating layer to seal the electronic component. A configuration including a first sealing resin and a second sealing resin provided on the lower surface of the resin insulating layer, surrounding at least a part of the metal layer, and connected to the first sealing resin through the holes. Can be.
　上記構成において、前記電子部品の平面形状は略矩形であり、前記除去部は、前記電子部品の少なくとも２つの辺に沿って連続したライン状に設けられた溝である構成とすることができる。 In the above configuration, the planar shape of the electronic component is substantially rectangular, and the removing portion may be a groove provided in a continuous line along at least two sides of the electronic component.
　上記構成において、前記電子部品の平面形状は略矩形であり、前記除去部は、前記電子部品の少なくとも２つの辺に沿って点在した孔または凹部である構成とすることができる。 In the above configuration, the planar shape of the electronic component is substantially rectangular, and the removing portion may be a configuration in which holes or recesses are scattered along at least two sides of the electronic component.
　上記構成において、前記除去部内の側面は前記樹脂絶縁層の下面と略直交する構成とすることができる。 In the above configuration, the side surface inside the removal portion can be configured to be substantially orthogonal to the lower surface of the resin insulating layer.
　本発明によれば、封止樹脂と樹脂絶縁層との間における剥がれを抑制することができる。 According to the present invention, peeling between the sealing resin and the resin insulating layer can be suppressed.
図１（ａ）および図１（ｂ）は、実施例１に係る部品モジュールの断面図および平面図である。1 (a) and 1 (b) are a cross-sectional view and a plan view of the component module according to the first embodiment. 図２（ａ）から図２（ｅ）は、実施例１に係る部品モジュールの製造方法を示す断面図である。2 (a) to 2 (e) are cross-sectional views showing a method of manufacturing a component module according to the first embodiment. 図３（ａ）は、比較例１に係る部品モジュールの断面図、図３（ｂ）および図３（ｃ）は、実施例１に係る部品モジュールの断面図である。FIG. 3A is a cross-sectional view of the component module according to Comparative Example 1, and FIGS. 3B and 3C are cross-sectional views of the component module according to the first embodiment. 図４（ａ）および図４（ｂ）は、それぞれ実施例１の変形例１および２に係る部品モジュールの断面図である。4 (a) and 4 (b) are cross-sectional views of the component modules according to the first and second modifications of the first embodiment, respectively. 図５（ａ）および図５（ｂ）は、実施例１の変形例３に係る部品モジュールの断面図および平面図である。5 (a) and 5 (b) are a cross-sectional view and a plan view of the component module according to the third modification of the first embodiment. 図６は、実施例１の変形例４に係る部品モジュールの平面図である。FIG. 6 is a plan view of the component module according to the modified example 4 of the first embodiment. 図７（ａ）および図７（ｂ）は、実施例１の変形例５に係る部品モジュールの断面図および平面図である。7 (a) and 7 (b) are a cross-sectional view and a plan view of the component module according to the modified example 5 of the first embodiment. 図８（ａ）および図８（ｂ）は、実施例１の変形例６に係る部品モジュールの断面図および平面図である。8 (a) and 8 (b) are a cross-sectional view and a plan view of the component module according to the modified example 6 of the first embodiment. 図９は、実施例１の変形例６に係る部品モジュールの平面図である。FIG. 9 is a plan view of the component module according to the modified example 6 of the first embodiment. 図１０（ａ）および図１０（ｂ）は、実施例１の変形例６に係る部品モジュールの製造方法を示す断面図である。10 (a) and 10 (b) are cross-sectional views showing a method of manufacturing a component module according to a modification 6 of the first embodiment. 図１１（ａ）および図１１（ｂ）は、実施例１の変形例７に係る部品モジュールの平面図である。11 (a) and 11 (b) are plan views of the component module according to the modified example 7 of the first embodiment. 図１２は、実施例１の変形例８に係る部品モジュールの断面図である。FIG. 12 is a cross-sectional view of the component module according to the modified example 8 of the first embodiment.
　以下、図面を参照し本発明の実施例について説明する。 Hereinafter, examples of the present invention will be described with reference to the drawings.
　図１（ａ）および図１（ｂ）は、実施例１に係る部品モジュールの断面図および平面図である。図１（ｂ）では、絶縁層１０、接着剤１２、金属層１４、貫通孔１６（ビア）、溝１８、電子部品２０および封止樹脂２４を図示している。 1 (a) and 1 (b) are a cross-sectional view and a plan view of the component module according to the first embodiment. FIG. 1B shows an insulating layer 10, an adhesive 12, a metal layer 14, a through hole 16 (via), a groove 18, an electronic component 20, and a sealing resin 24.
　図１（ａ）および図１（ｂ）に示すように、絶縁層１０（樹脂絶縁層）の下面に接着剤１２（樹脂接着剤）が設けられている。絶縁層１０は、例えばポリイミド樹脂等の樹脂からなり、可撓性を有する。絶縁層１０の厚さは例えば７．５μｍから１２５μｍである。接着剤１２は例えばエポキシ樹脂接着剤等の樹脂接着剤である。接着剤１２の厚さは硬化後で例えば５μｍから５０μｍである。接着剤１２は例えば絶縁層１０より薄い。接着剤１２は耐熱性に優れ誘電率が低い樹脂材料が好ましい。 As shown in FIGS. 1A and 1B, an adhesive 12 (resin adhesive) is provided on the lower surface of the insulating layer 10 (resin insulating layer). The insulating layer 10 is made of a resin such as a polyimide resin and has flexibility. The thickness of the insulating layer 10 is, for example, 7.5 μm to 125 μm. The adhesive 12 is a resin adhesive such as an epoxy resin adhesive. The thickness of the adhesive 12 is, for example, 5 μm to 50 μm after curing. The adhesive 12 is thinner than, for example, the insulating layer 10. The adhesive 12 is preferably a resin material having excellent heat resistance and a low dielectric constant.
　絶縁層１０の下面に接着剤１２を介し電子部品２０が接合されている。電子部品２０の上面には電極２２が設けられている。電子部品２０は、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）、バイポーラトランジスタまたはパワーＭＯＳＦＥＴ（Metal Oxide Semiconductor Field Effect Transistor）などのＦＥＴ等のトランジスタである。トランジスタには、Ｓｉ、ＧａＮまたはＳｉＣ等の半導体材料が用いられる。電子部品２０は、例えばベアチップまたはベアチップが封止実装されたパッケージである。ベアチップが実装されたパッケージは、ＷＬＰ（Wafer Level Package）またはＳＩＰ（Single Inline Package）等のパッケージである。電極２２は、Ｃｕ（銅）、Ａｕ（金）、Ａｇ（銀）、またはＡｌ（アルミニウム）等を主材料とする金属層である。 The electronic component 20 is bonded to the lower surface of the insulating layer 10 via an adhesive 12. An electrode 22 is provided on the upper surface of the electronic component 20. The electronic component 20 is, for example, a transistor such as an IGBT (Insulated Gate Bipolar Transistor), a bipolar transistor, or a FET such as a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor). A semiconductor material such as Si, GaN or SiC is used for the transistor. The electronic component 20 is, for example, a bare chip or a package in which a bare chip is sealed and mounted. The package on which the bare chip is mounted is a package such as WLP (Wafer Level Package) or SIP (Single Inline Package). The electrode 22 is a metal layer whose main material is Cu (copper), Au (gold), Ag (silver), Al (aluminum), or the like.
　電子部品２０が横型トランジスタの場合、ソース電極、ゲート電極およびドレイン電極は電極２２が設けられた上面に設けられ、電極２２は例えばソース電極およびドレイン電極であり、ゲート電極の図示を省略している。電子部品２０が縦型トランジスタの場合、電極２２は例えばソース電極およびゲート電極であり、ドレイン電極は電子部品２０の下面に設けられている。 When the electronic component 20 is a horizontal transistor, the source electrode, the gate electrode, and the drain electrode are provided on the upper surface where the electrode 22 is provided, and the electrodes 22 are, for example, the source electrode and the drain electrode, and the illustration of the gate electrode is omitted. .. When the electronic component 20 is a vertical transistor, the electrodes 22 are, for example, a source electrode and a gate electrode, and the drain electrode is provided on the lower surface of the electronic component 20.
　絶縁層１０の上面と、絶縁層１０および接着剤１２を貫通する貫通孔１６の内面と、に金属層１４が設けられている。金属層１４は、貫通孔１６を介し電極２２に電気的に接続する。金属層１４は、例えば銅を主材料とする。金属層１４の厚さは例えば数μｍから１２５μｍであり、貫通孔１６が埋め込まれる厚さである。金属層１４は例えば絶縁層１０より厚い。金属層１４は絶縁層１０より薄くてもよい。貫通孔１６の大きさは、例えば３０μｍから５００μｍである。 A metal layer 14 is provided on the upper surface of the insulating layer 10 and the inner surface of the through hole 16 penetrating the insulating layer 10 and the adhesive 12. The metal layer 14 is electrically connected to the electrode 22 via the through hole 16. The metal layer 14 uses, for example, copper as a main material. The thickness of the metal layer 14 is, for example, several μm to 125 μm, which is the thickness at which the through hole 16 is embedded. The metal layer 14 is thicker than, for example, the insulating layer 10. The metal layer 14 may be thinner than the insulating layer 10. The size of the through hole 16 is, for example, 30 μm to 500 μm.
　接着剤１２を貫通し絶縁層１０に達する溝１８が設けられている。溝１８は電子部品２０の上面のうち少なくとも１つの辺に沿って設けられている。溝１８の幅は例えば０．０５ｍｍから０．５ｍｍである。接着剤１２の下面に電子部品２０を封止（被覆）するように封止樹脂２４が設けられている。封止樹脂２４は例えば主にエポキシ樹脂であり、無機フィラー等を含んでもよい。封止樹脂２４は溝１８内に充填されている。この封止樹脂２４は前述した溝１８を埋めている。 A groove 18 is provided that penetrates the adhesive 12 and reaches the insulating layer 10. The groove 18 is provided along at least one side of the upper surface of the electronic component 20. The width of the groove 18 is, for example, 0.05 mm to 0.5 mm. A sealing resin 24 is provided on the lower surface of the adhesive 12 so as to seal (coat) the electronic component 20. The sealing resin 24 is, for example, mainly an epoxy resin and may contain an inorganic filler or the like. The sealing resin 24 is filled in the groove 18. The sealing resin 24 fills the groove 18 described above.
［実施例１の製造方法］
　図２（ａ）から図２（ｅ）は、実施例１に係る部品モジュールの製造方法を示す断面図である。 [Manufacturing method of Example 1]
2 (a) to 2 (e) are cross-sectional views showing a method of manufacturing a component module according to the first embodiment.
　図２（ａ）に示すように、絶縁層１０上（図２（ａ）では下）に接着剤１２を塗布する。接着剤１２の塗布には、例えばスピンコート法、スプレコート法、インクジェット法またはスクリーン印刷法を用いる。予め接着剤１２が形成された絶縁層１０を用意してもよい。接着剤１２は、電子部品２０が配置される領域に対応して、選択的に塗布されていてもよい。 As shown in FIG. 2A, the adhesive 12 is applied on the insulating layer 10 (lower in FIG. 2A). For the application of the adhesive 12, for example, a spin coating method, a spray coating method, an inkjet method or a screen printing method is used. The insulating layer 10 on which the adhesive 12 is formed in advance may be prepared. The adhesive 12 may be selectively applied corresponding to the region where the electronic component 20 is arranged.
　図２（ｂ）に示すように、接着剤１２上（図２（ｂ）では下）に電子部品２０を電極２２の上面が接着剤１２に接するように配置する。熱処理することにより、接着剤１２を硬化させ電子部品２０と絶縁層１０とを接合させる。熱処理温度は例えば１００℃から３００℃の温度である。 As shown in FIG. 2B, the electronic component 20 is arranged on the adhesive 12 (lower in FIG. 2B) so that the upper surface of the electrode 22 is in contact with the adhesive 12. The heat treatment cures the adhesive 12 and joins the electronic component 20 and the insulating layer 10. The heat treatment temperature is, for example, a temperature of 100 ° C. to 300 ° C.
　図２（ｃ）に示すように、絶縁層１０および接着剤１２を貫通する貫通孔１６を形成する。貫通孔１６は、例えばレーザ光を照射することにより形成する。これにより、電極２２の上面が貫通孔１６から露出する。 As shown in FIG. 2C, a through hole 16 penetrating the insulating layer 10 and the adhesive 12 is formed. The through hole 16 is formed by, for example, irradiating a laser beam. As a result, the upper surface of the electrode 22 is exposed from the through hole 16.
　図２（ｄ）に示すように、絶縁層１０の下面（図２（ｄ）では上面）および貫通孔１６の内面に金属層１４を形成する。金属層１４の形成は例えば以下の方法により行う。絶縁層１０の下面および貫通孔１６の内面にシード層を形成する。シード層は、例えばスパッタリング法または無電解めっき法を用い形成する。このシード層を電極とし、この上面にめっき層を電解めっき法で形成する。なお、金属層１４は、スクリーン印刷法により銅ペースト等の導電性ペーストを印刷し、その後焼結することにより形成してもよい。 As shown in FIG. 2D, a metal layer 14 is formed on the lower surface of the insulating layer 10 (the upper surface in FIG. 2D) and the inner surface of the through hole 16. The metal layer 14 is formed by, for example, the following method. A seed layer is formed on the lower surface of the insulating layer 10 and the inner surface of the through hole 16. The seed layer is formed by using, for example, a sputtering method or a electroless plating method. This seed layer is used as an electrode, and a plating layer is formed on the upper surface thereof by an electrolytic plating method. The metal layer 14 may be formed by printing a conductive paste such as a copper paste by a screen printing method and then sintering the metal layer 14.
　図２（ｅ）に示すように、接着剤１２および絶縁層１０の少なくとも一部に溝１８を形成する。溝１８の形成はレーザ照射によるレーザアブレーション法、エッチング法またはサンドブラスト法を用いる。 As shown in FIG. 2E, a groove 18 is formed in at least a part of the adhesive 12 and the insulating layer 10. The groove 18 is formed by using a laser ablation method, an etching method, or a sandblasting method by laser irradiation.
　その後、絶縁層１０の下面に電子部品２０を封止するように封止樹脂２４を形成する。封止樹脂２４は例えばエポキシ樹脂等の熱硬化性樹脂または熱可塑性樹脂である。封止樹脂２４は、接着剤１２の表面および溝１８の内面に接する。封止樹脂２４の形成には例えばトランスファモールド法、インジェクション法またはコンプレッション法を用いる。以上により、実施例１の部品モジュールが製造される。 After that, the sealing resin 24 is formed on the lower surface of the insulating layer 10 so as to seal the electronic component 20. The sealing resin 24 is a thermosetting resin such as an epoxy resin or a thermoplastic resin. The sealing resin 24 is in contact with the surface of the adhesive 12 and the inner surface of the groove 18. For example, a transfer molding method, an injection method or a compression method is used to form the sealing resin 24. As described above, the component module of the first embodiment is manufactured.
　図３（ａ）は、比較例１に係る部品モジュールの断面図、図３（ｂ）および図３（ｃ）は、実施例１に係る部品モジュールの断面図である。図３（ａ）に示すように、比較例１では、溝１８は設けられていない。絶縁層１０が可撓性を有し、封止樹脂２４と接着剤１２との密着性が悪い場合、矢印５０のように、部品モジュールの側面から封止樹脂２４と接着剤１２とが剥がれる。剥がれが電子部品２０と接着剤１２との界面に達する可能性がある。また、剥がれから水分等が封止樹脂２４と接着剤１２との界面に侵入すると、電子部品２０が劣化することがある。 FIG. 3A is a cross-sectional view of the component module according to Comparative Example 1, and FIGS. 3B and 3C are cross-sectional views of the component module according to the first embodiment. As shown in FIG. 3A, the groove 18 is not provided in Comparative Example 1. When the insulating layer 10 has flexibility and the adhesion between the sealing resin 24 and the adhesive 12 is poor, the sealing resin 24 and the adhesive 12 are peeled off from the side surface of the component module as shown by the arrow 50. The peeling may reach the interface between the electronic component 20 and the adhesive 12. Further, if moisture or the like enters the interface between the sealing resin 24 and the adhesive 12 from peeling, the electronic component 20 may deteriorate.
　接着剤１２の線膨張係数は封止樹脂２４および絶縁層１０の線膨張係数の１．５倍以上または２倍以上の場合がある。電子部品がパワー半導体素子である場合、電子部品２０の発熱による温度サイクルが加わり、絶縁層１０と接着剤１２との間、および封止樹脂２４と接着剤１２との間の少なくとも一方で剥離が生じ易くなる。また、封止樹脂２４と接着剤１２とがいずれもエポキシ樹脂を主成分とする場合においてもエポキシ樹脂の種類およびエポキシ樹脂以外の添加材料によっては封止樹脂２４と接着剤１２との密着性が悪くなることがある。 The coefficient of linear expansion of the adhesive 12 may be 1.5 times or more or 2 times or more the coefficient of linear expansion of the sealing resin 24 and the insulating layer 10. When the electronic component is a power semiconductor element, a temperature cycle due to heat generation of the electronic component 20 is added, and peeling is performed between the insulating layer 10 and the adhesive 12 and at least one of the sealing resin 24 and the adhesive 12. It is likely to occur. Further, even when both the sealing resin 24 and the adhesive 12 contain an epoxy resin as a main component, the adhesion between the sealing resin 24 and the adhesive 12 may be different depending on the type of the epoxy resin and the additive material other than the epoxy resin. It can get worse.
　図３（ｂ）および図３（ｃ）に示すように、実施例１では、溝１８が接着剤１２を貫通し絶縁層１０の一部まで達している。これにより、矢印５０のように、封止樹脂２４と接着剤１２との間が剥がれても溝１８により剥がれが電子部品２０まで達することを抑制できる。また、封止樹脂２４と接着剤１２との間に水分等が侵入した場合においても溝１８により水分等の電子部品２０への侵入を抑制できる。 As shown in FIGS. 3 (b) and 3 (c), in the first embodiment, the groove 18 penetrates the adhesive 12 and reaches a part of the insulating layer 10. As a result, as shown by the arrow 50, even if the sealing resin 24 and the adhesive 12 are peeled off, the groove 18 can prevent the peeling from reaching the electronic component 20. Further, even when water or the like enters between the sealing resin 24 and the adhesive 12, the groove 18 can suppress the intrusion of water or the like into the electronic component 20.
　溝１８は接着剤１２を貫通し絶縁層１０の一部に達することで、接着剤１２と絶縁層１０との剥離も抑制できる。 The groove 18 penetrates the adhesive 12 and reaches a part of the insulating layer 10, so that peeling between the adhesive 12 and the insulating layer 10 can be suppressed.
　図３（ｂ）に示すように、溝１８の側面は絶縁層１０に対し傾斜していてもよい。 As shown in FIG. 3B, the side surface of the groove 18 may be inclined with respect to the insulating layer 10.
　図３（ｃ）に示すように、溝１８内の側面は絶縁層１０の下面と略直交してもよい。これにより、接着剤１２と封止樹脂２４との密着性が向上し、接着剤１２と封止樹脂２４との剥離をより抑制できる。なお、略直交とは角度θが８５°～９５°である。 As shown in FIG. 3C, the side surface in the groove 18 may be substantially orthogonal to the lower surface of the insulating layer 10. As a result, the adhesiveness between the adhesive 12 and the sealing resin 24 is improved, and the peeling of the adhesive 12 and the sealing resin 24 can be further suppressed. It should be noted that the substantially orthogonal angle θ is 85 ° to 95 °.
［実施例１の変形例１］
　図４（ａ）は、実施例１の変形例１に係る部品モジュールの断面図である。図４（ａ）に示すように、実施例１の変形例１では、溝１８は、接着剤１２を貫通せず、溝１８の底面と絶縁層１０とに間に接着剤１２の一部が残存している。実施例１の変形例１のように、溝１８の底面は接着剤１２内に位置していてもよい。封止樹脂２４と接着剤１２との剥離の抑制の観点から、溝１８の深さは接着剤１２の厚さの１／２以上が好ましい。その他の構成は実施例１と同じであり説明を省略する。 [Modification 1 of Example 1]
FIG. 4A is a cross-sectional view of the component module according to the first modification of the first embodiment. As shown in FIG. 4A, in the first modification of the first embodiment, the groove 18 does not penetrate the adhesive 12, and a part of the adhesive 12 is formed between the bottom surface of the groove 18 and the insulating layer 10. It remains. As in the first modification of the first embodiment, the bottom surface of the groove 18 may be located in the adhesive 12. From the viewpoint of suppressing peeling between the sealing resin 24 and the adhesive 12, the depth of the groove 18 is preferably ½ or more of the thickness of the adhesive 12. Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
［実施例１の変形例２］
　図４（ｂ）は、実施例１の変形例２に係る部品モジュールの断面図である。図４（ｂ）に示すように、実施例１の変形例２では、絶縁層１０の下面に溝１９が設けられている。接着剤１２の下面に溝１９に対応する溝１８が設けられている。封止樹脂２４は溝１８内に埋め込まれている。実施例１の変形例２のように、絶縁層１０に溝１９を形成し、その後接着剤１２を塗布することで、接着剤１２に溝１８を形成してもよい。その他の構成は実施例１の変形例１と同じであり説明を省略する。 [Modification 2 of Example 1]
FIG. 4B is a cross-sectional view of the component module according to the second modification of the first embodiment. As shown in FIG. 4B, in the modified example 2 of the first embodiment, the groove 19 is provided on the lower surface of the insulating layer 10. A groove 18 corresponding to the groove 19 is provided on the lower surface of the adhesive 12. The sealing resin 24 is embedded in the groove 18. A groove 18 may be formed in the adhesive 12 by forming a groove 19 in the insulating layer 10 and then applying the adhesive 12 as in the modified example 2 of the first embodiment. Other configurations are the same as those of the first modification of the first embodiment, and the description thereof will be omitted.
［実施例１の変形例３］
　図５（ａ）および図５（ｂ）は、実施例１の変形例３に係る部品モジュールの断面図および平面図である。図５（ｂ）では、絶縁層１０、金属層１４、貫通孔１６、除去部１８ａ、電子部品２０および封止樹脂２４を図示している。 [Modification 3 of Example 1]
5 (a) and 5 (b) are a cross-sectional view and a plan view of the component module according to the third modification of the first embodiment. FIG. 5B shows an insulating layer 10, a metal layer 14, a through hole 16, a removing portion 18a, an electronic component 20, and a sealing resin 24.
　図５（ａ）および図５（ｂ）に示すように、実施例１の変形例３では、部品モジュールの端部に接着剤１２が除去された除去部１８ａが設けられている。除去部１８ａ内に封止樹脂２４が埋め込まれている。接着剤１２の端面は封止樹脂２４に被覆されている。これにより、封止樹脂２４と接着剤１２との剥がれを抑制できる。除去部１８ａは絶縁層１０に達し、絶縁層１０の下部の一部が除去されていることが好ましい。除去部１８ａは、部品モジュールの周縁の全てに設けられていることが好ましいが少なくとも一部に設けられていてもよい。除去部１８ａの平面視における幅は例えば０．０５ｍｍから０．５ｍｍである。その他の構成は実施例１と同じであり説明を省略する。 As shown in FIGS. 5 (a) and 5 (b), in the modified example 3 of the first embodiment, a removing portion 18a from which the adhesive 12 has been removed is provided at the end of the component module. The sealing resin 24 is embedded in the removing portion 18a. The end face of the adhesive 12 is coated with the sealing resin 24. As a result, peeling of the sealing resin 24 and the adhesive 12 can be suppressed. It is preferable that the removing portion 18a reaches the insulating layer 10 and a part of the lower part of the insulating layer 10 is removed. The removing portion 18a is preferably provided on all the peripheral edges of the component module, but may be provided on at least a part thereof. The width of the removing portion 18a in a plan view is, for example, 0.05 mm to 0.5 mm. Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
［実施例１の変形例４］
　図６は、実施例１の変形例４に係る部品モジュールの平面図である。図６では、絶縁層１０、接着剤１２、金属層１４、貫通孔１６、凹部１８ｂ、電子部品２０および封止樹脂２４を図示している。 [Modified Example 4 of Example 1]
FIG. 6 is a plan view of the component module according to the modified example 4 of the first embodiment. FIG. 6 shows an insulating layer 10, an adhesive 12, a metal layer 14, a through hole 16, a recess 18b, an electronic component 20, and a sealing resin 24.
　図６に示すように、実施例１の変形例４では、溝１８の代わりに平面形状が略矩形の電子部品２０の少なくとも相対向する２辺に沿って複数の凹部１８ｂ（非貫通穴）が設けられている。なお、溝とは平面形状が細長いくぼみであり、凹部１８ｂとは、例えば電子部品２０の１辺より短いくぼみであり、例えば、平面形状は正方形、長方形または円形である。 As shown in FIG. 6, in the modified example 4 of the first embodiment, a plurality of recesses 18b (non-through holes) are formed along at least two opposite sides of the electronic component 20 having a substantially rectangular planar shape instead of the groove 18. It is provided. The groove is a recess having an elongated planar shape, and the recess 18b is, for example, a recess shorter than one side of the electronic component 20, and the planar shape is, for example, a square, a rectangle, or a circle.
　凹部１８ｂ内に封止樹脂２４が埋め込まれている。凹部１８ｂの平面視における幅（または直径）は例えば０．０１ｍｍから０．５ｍｍである。凹部１８ｂは、実施例１のように接着剤１２を貫通し絶縁層１０に達していてもよい。また、凹部１８ｂは実施例１の変形例１の図４（ａ）のように、接着剤１２内に底面を有してもよい。さらに、実施例１の変形例２の図４（ｂ）のように、絶縁層１０の下面に凹部１８ｂが設けられ、接着剤１２の下面に凹部１８ｂの形状に沿って形成された凹部が設けられ、その凹部内に封止樹脂２４が埋め込まれていてもよい。その他の構成は実施例１、その変形例１および２と同じであるので説明を省略する。 The sealing resin 24 is embedded in the recess 18b. The width (or diameter) of the recess 18b in a plan view is, for example, 0.01 mm to 0.5 mm. The recess 18b may penetrate the adhesive 12 and reach the insulating layer 10 as in the first embodiment. Further, the recess 18b may have a bottom surface in the adhesive 12 as shown in FIG. 4 (a) of the modified example 1 of the first embodiment. Further, as shown in FIG. 4B of the modified example 2 of the first embodiment, a recess 18b is provided on the lower surface of the insulating layer 10, and a recess formed along the shape of the recess 18b is provided on the lower surface of the adhesive 12. The sealing resin 24 may be embedded in the recess. Since other configurations are the same as those of the first embodiment and the first and second modifications thereof, the description thereof will be omitted.
　前述のように、この島状の凹部１８ｂは図６のように電子部品２０を囲んで点在している。よって、凹部１８ｂにおける接着剤１２と封止樹脂２４との第１密着部と、凹部１８ｂと凹部１８ｂとの間の平らな領域における接着剤１２と封止樹脂２４との第２密着部は、密着度が異なっている。つまり、密着度が強い、弱い、強い、弱い・・・と繰り返されている。この場合、何かの原因で第２密着部において接着剤１２と封止樹脂２４とが剥離されようとしても、両側の第１密着部がその密着性を保持する。このため、接着剤１２と封止樹脂２４との剥離が広範囲に渡って広がることを抑制できる。 As described above, the island-shaped recesses 18b are scattered around the electronic component 20 as shown in FIG. Therefore, the first contact portion between the adhesive 12 and the sealing resin 24 in the recess 18b and the second contact portion between the adhesive 12 and the sealing resin 24 in the flat region between the recess 18b and the recess 18b are formed. The degree of adhesion is different. That is, the degree of adhesion is strong, weak, strong, weak, and so on. In this case, even if the adhesive 12 and the sealing resin 24 are to be peeled off at the second adhesion portion for some reason, the first adhesion portions on both sides maintain the adhesion. Therefore, it is possible to prevent the peeling between the adhesive 12 and the sealing resin 24 from spreading over a wide range.
　一方、図１（ｂ）や図５（ｂ）のように、ライン状の溝１８が電子部品２０を囲む全周に形成されている場合、溝１８のいずれかの箇所において接着剤１２と封止樹脂２４との剥離が始まるとそのまま剥離が進んでしまう。具体的には、図１（ｂ）を用いて説明する。例えば右側の辺の溝１８のいずれかの箇所で接着剤１２と封止樹脂２４とが剥離し始めると、場合によっては右側の辺の両端の角部まで連続して剥離することがある。しかしながら、この溝１８は角部を有するため、溝１８における連続した剥離は、角部で止まる。このように、溝１８を用いても、溝１８が角部を有することで接着剤１２と封止樹脂２４との剥離の広がりを抑制できる。 On the other hand, when the line-shaped groove 18 is formed all around the electronic component 20 as shown in FIGS. 1 (b) and 5 (b), the adhesive 12 is sealed at any part of the groove 18. When the peeling from the stop resin 24 starts, the peeling proceeds as it is. Specifically, it will be described with reference to FIG. 1 (b). For example, when the adhesive 12 and the sealing resin 24 start to peel off at any of the grooves 18 on the right side, in some cases, the adhesive 12 and the sealing resin 24 may be continuously peeled off to the corners at both ends of the right side. However, since the groove 18 has corners, continuous peeling in the groove 18 stops at the corners. As described above, even if the groove 18 is used, the spread of the peeling between the adhesive 12 and the sealing resin 24 can be suppressed because the groove 18 has a corner portion.
　実施例１の変形例４のような凹部１８ｂの方が実施例１の変形例１の溝１８より接着剤１２と封止樹脂２４との剥離の広がりを抑制できる。さらに、レーザを用いた溝１８と凹部１８ｂとの加工時間を考慮すると、凹部１８ｂは溝１８よりレーザのショット時間が短く、さらに、レーザアブレーションによる飛散物も少ない。よって、溝１８の代わりに凹部１８ｂを、用いることで製造方法を簡略化できる。 The recess 18b as in the modified example 4 of the first embodiment can suppress the spread of peeling between the adhesive 12 and the sealing resin 24 from the groove 18 of the modified example 1 of the first embodiment. Further, considering the processing time between the groove 18 and the recess 18b using the laser, the recess 18b has a shorter laser shot time than the groove 18, and the amount of scattered matter due to laser ablation is small. Therefore, the manufacturing method can be simplified by using the recess 18b instead of the groove 18.
［実施例１の変形例５］
　図７（ａ）および図７（ｂ）は、実施例１の変形例５に係る部品モジュールの断面図および平面図である。図７（ｂ）では、絶縁層１０、接着剤１２、金属層１４、貫通孔１６、溝１８、電子部品２０および封止樹脂２４を図示している。 [Modification 5 of Example 1]
7 (a) and 7 (b) are a cross-sectional view and a plan view of the component module according to the modified example 5 of the first embodiment. FIG. 7B shows an insulating layer 10, an adhesive 12, a metal layer 14, a through hole 16, a groove 18, an electronic component 20, and a sealing resin 24.
　図７（ａ）および図７（ｂ）に示すように、実施例１の変形例５では、接着剤１２は電子部品２０と絶縁層１０との間および電子部品２０の近傍に設けられている。溝１８は接着剤１２が設けられていない絶縁層１０の下面に設けられ、封止樹脂２４は溝１８内に埋め込まれている。接着剤１２が部品モジュールの周縁に設けられていない場合にも、絶縁層１０と封止樹脂２４との間が剥がれる可能性がある。本実施例では、絶縁層１０と封止樹脂２４との間の剥離を抑制できる。絶縁層１０と封止樹脂２４との間の剥離を抑制するため、溝１８の深さが絶縁層１０の厚さの１／５以上が好ましい。実施例１の変形例３の図５（ａ）および図５（ｂ）と同様に溝１８の代わりに、除去部１８ａが絶縁層１０の端部に設けられていてもよい。また、実施例１の変形例４の図６と同様に、溝１８の代わりに複数の凹部１８ｂ（穴）が設けられていてもよい。その他の構成は実施例１と同じであり説明を省略する。 As shown in FIGS. 7 (a) and 7 (b), in the modified example 5 of the first embodiment, the adhesive 12 is provided between the electronic component 20 and the insulating layer 10 and in the vicinity of the electronic component 20. .. The groove 18 is provided on the lower surface of the insulating layer 10 to which the adhesive 12 is not provided, and the sealing resin 24 is embedded in the groove 18. Even when the adhesive 12 is not provided on the peripheral edge of the component module, the insulating layer 10 and the sealing resin 24 may be peeled off. In this embodiment, peeling between the insulating layer 10 and the sealing resin 24 can be suppressed. In order to suppress peeling between the insulating layer 10 and the sealing resin 24, the depth of the groove 18 is preferably 1/5 or more of the thickness of the insulating layer 10. Similar to FIGS. 5 (a) and 5 (b) of the third modification of the first embodiment, the removing portion 18a may be provided at the end of the insulating layer 10 instead of the groove 18. Further, similarly to FIG. 6 of the modified example 4 of the first embodiment, a plurality of recesses 18b (holes) may be provided instead of the groove 18. Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
［実施例１の変形例６］
　図８（ａ）は、実施例１の変形例６に係る部品モジュールの断面図、図８（ｂ）および図９は、実施例１の変形例６に係る部品モジュールの平面図である。図８（ａ）において、電子部品２０の左側に溝１７ａを図示し、電子部品２０の右側に貫通孔１７ｂを図示する。図８（ｂ）では、絶縁層１０、接着剤１２、貫通孔１６、除去部１８ｃ、電子部品２０および封止樹脂２４を図示し、図９では、絶縁層１０、接着剤１２、金属層１４、貫通孔１６、電子部品２０、封止樹脂２４ａおよび樹脂層２６を図示している。 [Modified Example 6 of Example 1]
8 (a) is a cross-sectional view of the component module according to the modified example 6 of the first embodiment, and FIGS. 8 (b) and 9 are plan views of the component module according to the modified example 6 of the first embodiment. In FIG. 8A, a groove 17a is shown on the left side of the electronic component 20, and a through hole 17b is shown on the right side of the electronic component 20. FIG. 8B shows the insulating layer 10, the adhesive 12, the through hole 16, the removing portion 18c, the electronic component 20 and the sealing resin 24, and FIG. 9 shows the insulating layer 10, the adhesive 12, and the metal layer 14. , The through hole 16, the electronic component 20, the sealing resin 24a, and the resin layer 26 are shown.
　図８（ａ）から図９に示すように、実施例１の変形例６では、除去部１８ｃは、接着剤１２および絶縁層１０を貫通する貫通孔１７ｂと接着剤１２および絶縁層１０の一部に設けられた溝１７ａとを備える。除去部１８ｃは電子部品２０を囲むように設けられている。除去部１８ｃの全てが全周に渡り接着剤１２および絶縁層１０を貫通していると、製造工程中に平面視における除去部１８ｃの内部の接着剤１２および絶縁層１０と除去部１８ｃの外部の接着剤１２および絶縁層１０とが分離してしまう。このため、除去部１８ｃの少なくとも一部は接着剤１２および絶縁層１０を貫通しないことが好ましい。例えば、溝１７ａでは除去部１８ｃは接着剤１２および絶縁層１０を貫通せず、貫通孔１７ｂでは除去部１８ｃは接着剤１２および絶縁層１０を貫通する。 As shown in FIGS. 8A to 9, in the modified example 6 of the first embodiment, the removing portion 18c is one of a through hole 17b penetrating the adhesive 12 and the insulating layer 10 and one of the adhesive 12 and the insulating layer 10. It is provided with a groove 17a provided in the portion. The removing portion 18c is provided so as to surround the electronic component 20. When all of the removing portion 18c penetrates the adhesive 12 and the insulating layer 10 over the entire circumference, the adhesive 12 inside the removing portion 18c and the outside of the insulating layer 10 and the removing portion 18c in a plan view during the manufacturing process. The adhesive 12 and the insulating layer 10 are separated from each other. Therefore, it is preferable that at least a part of the removing portion 18c does not penetrate the adhesive 12 and the insulating layer 10. For example, in the groove 17a, the removing portion 18c does not penetrate the adhesive 12 and the insulating layer 10, and in the through hole 17b, the removing portion 18c penetrates the adhesive 12 and the insulating layer 10.
　溝１７ａの平面視における幅は例えば０．０５ｍｍから０．５ｍｍである。貫通孔１７ｂの平面における幅は溝１７ａの幅より広い。絶縁層１０の周縁には封止樹脂２４ａが設けられている。封止樹脂２４と２４ａとは貫通孔１７ｂ内の封止樹脂２４を介し一体化されている。電子部品２０の周囲を囲むように樹脂層２６が設けられている。樹脂層２６は例えばソルダーレジストであり例えば主にエポキシ樹脂である。樹脂層２６を囲むように封止樹脂２４ａが設けられている。なお、樹脂層２６が設けられない場合は、絶縁層１０の上面において、金属層１４と金属層１４の間、および金属層１４と絶縁層１０周囲との間を埋めるように封止樹脂２４ａが設けられてもよい。 The width of the groove 17a in a plan view is, for example, 0.05 mm to 0.5 mm. The width of the through hole 17b in the plane is wider than the width of the groove 17a. A sealing resin 24a is provided on the periphery of the insulating layer 10. The sealing resin 24 and 24a are integrated via the sealing resin 24 in the through hole 17b. A resin layer 26 is provided so as to surround the electronic component 20. The resin layer 26 is, for example, a solder resist, for example, mainly an epoxy resin. A sealing resin 24a is provided so as to surround the resin layer 26. When the resin layer 26 is not provided, the sealing resin 24a fills the upper surface of the insulating layer 10 between the metal layer 14 and the metal layer 14 and between the metal layer 14 and the periphery of the insulating layer 10. It may be provided.
　除去部１８ｃのうち接着剤１２と絶縁層１０とを貫通する貫通孔１７ｂ（孔）を介し、封止樹脂２４（第１封止樹脂）と２４ａ（第２封止樹脂）とが一体化される（接続される）ことで、絶縁層１０および接着剤１２が上下から挟まれて固定される。これにより、封止樹脂２４と接着剤１２との剥離および絶縁層１０と接着剤１２との剥離をより抑制できる。除去部１８ｃのうち接着剤１２と絶縁層１０とを貫通する貫通孔は適宜配置できる。 The sealing resin 24 (first sealing resin) and 24a (second sealing resin) are integrated through the through holes 17b (holes) that penetrate the adhesive 12 and the insulating layer 10 in the removing portion 18c. By connecting (connecting), the insulating layer 10 and the adhesive 12 are sandwiched and fixed from above and below. As a result, the peeling of the sealing resin 24 and the adhesive 12 and the peeling of the insulating layer 10 and the adhesive 12 can be further suppressed. A through hole penetrating the adhesive 12 and the insulating layer 10 in the removing portion 18c can be appropriately arranged.
　一般には角部から封止樹脂２４と２４ａとの剥がれが生じる傾向にある。そこで、部品モジュールの４角部に設けられている除去部１８ｃを貫通孔１７ｂとすることで、貫通孔１７ｂにおいて封止樹脂２４と２４ａとがより強固に一体化される。よって、部品モジュールの角部における封止樹脂２４と２４ａとの剥離を抑制できる。溝１７ａは部品モジュールの４辺に沿ってライン状に設けられている。これにより、部品モジュールの４辺における封止樹脂２４と接着剤１２との剥離を抑制できる。その他の構成は実施例１およびその変形例１から５と同じであり説明を省略する。 Generally, the sealing resins 24 and 24a tend to peel off from the corners. Therefore, by making the removing portion 18c provided at the four corners of the component module a through hole 17b, the sealing resin 24 and 24a are more firmly integrated in the through hole 17b. Therefore, peeling of the sealing resin 24 and 24a at the corners of the component module can be suppressed. The grooves 17a are provided in a line along the four sides of the component module. As a result, peeling of the sealing resin 24 and the adhesive 12 on the four sides of the component module can be suppressed. Other configurations are the same as those of the first embodiment and the first to fifth modifications thereof, and the description thereof will be omitted.
　除去部１８ｃは、電子部品２０を囲み、実施例１の変形例４の図６の凹部１８ｂと同様に、点在するように複数設けられていてもよい。実施例１の変形例５の図７（ａ）および図７（ｂ）と同様に、除去部１８ｃの少なくとも一部は接着剤１２が設けられていない領域に形成されていてもよい。 A plurality of removing portions 18c may be provided so as to surround the electronic component 20 and to be scattered as in the recesses 18b of FIG. 6 of the modified example 4 of the first embodiment. Similar to FIGS. 7 (a) and 7 (b) of the modified example 5 of the first embodiment, at least a part of the removing portion 18c may be formed in a region where the adhesive 12 is not provided.
　図１０（ａ）および図１０（ｂ）は、実施例１の変形例６の図８（ａ）および図８（ｂ）に係る部品モジュールの製造方法を示す断面図である。図１０（ａ）に示すように、接着剤１２および絶縁層１０を貫通する貫通孔１７ｂと絶縁層１０を貫通しない溝１７ａとが設けられている。絶縁層１０の上面に金属層１４を囲むように樹脂層２６を形成する。 10 (a) and 10 (b) are cross-sectional views showing a method of manufacturing a component module according to FIGS. 8 (a) and 8 (b) of the modified example 6 of the first embodiment. As shown in FIG. 10A, a through hole 17b that penetrates the adhesive 12 and the insulating layer 10 and a groove 17a that does not penetrate the insulating layer 10 are provided. A resin layer 26 is formed on the upper surface of the insulating layer 10 so as to surround the metal layer 14.
　図１０（ｂ）に示すように、金型５４および５５内に絶縁層１０を配置する。金型５４と５５との間の空間に樹脂を充填する。矢印５２のように貫通孔１７ｂを介し絶縁層１０の下方から上方（または上方から下方）に樹脂が充填される。これにより、封止樹脂２４と２４ａとが形成される。樹脂層２６が金属層１４を囲むように設けられていることで、樹脂層２６が金属層１４に達することを抑制できる。なお、貫通孔１７ｂは、下側からのレーザ照射により下側は広く、上側が狭く加工されるのが一般的である。よって、広い下側の穴側から樹脂を注入すると、樹脂の注入抵抗が減り、樹脂は注入しやすく、充填性が高まる。 As shown in FIG. 10B, the insulating layer 10 is arranged in the molds 54 and 55. The space between the molds 54 and 55 is filled with resin. As shown by the arrow 52, the resin is filled from the lower side to the upper side (or from the upper side to the lower side) of the insulating layer 10 through the through hole 17b. As a result, the sealing resins 24 and 24a are formed. By providing the resin layer 26 so as to surround the metal layer 14, it is possible to prevent the resin layer 26 from reaching the metal layer 14. The through hole 17b is generally processed so that the lower side is wide and the upper side is narrow by laser irradiation from the lower side. Therefore, when the resin is injected from the wide lower hole side, the injection resistance of the resin is reduced, the resin is easily injected, and the filling property is improved.
　実施例１およびその変形例１から６のように、除去部では、接着剤１２および絶縁層１０の少なくとも一部が除去されている。除去部には封止樹脂２４が埋め込まれている。この除去部は、溝１８、凹部１８ｂおよび除去部１８ｃのうち貫通孔１７ｂのいずれでもよい。また、除去部は接着剤１２および絶縁層１０を貫通してもよいし非貫通でもよい。ただし、除去部が全周に渡り接着剤１２および絶縁層１０を貫通すると、除去部の内部と外部とが分離されてしまう。そこで、除去部の一部を非貫通とすることが好ましい。 As in Example 1 and its modifications 1 to 6, at least a part of the adhesive 12 and the insulating layer 10 is removed in the removing portion. A sealing resin 24 is embedded in the removing portion. The removing portion may be any of the groove 18, the recess 18b, and the through hole 17b of the removing portion 18c. Further, the removing portion may or may not penetrate the adhesive 12 and the insulating layer 10. However, if the removing portion penetrates the adhesive 12 and the insulating layer 10 over the entire circumference, the inside and the outside of the removing portion are separated. Therefore, it is preferable that a part of the removed portion is non-penetrating.
［実施例１の変形例７］
　図１１（ａ）および図１１（ｂ）は、実施例１の変形例７に係る部品モジュールの平面図である。図１１（ａ）に示すように、電子部品２０が例えば半導体チップの場合、平面形状は略矩形である。このように電子部品２０の平面形状が略矩形の場合、溝１８は、電子部品２０の少なくとも２つの辺に沿って連続したライン状に設けられている。溝１８が辺に沿って設けられることで、接着剤１２と封止樹脂２４との剥離が電子部品２０まで広がることを抑制できる。溝１８の長さＬ１は電子部品２０の辺の長さＬ２より長いことが好ましい。溝１８は、電子部品２０の少なくとも相対向する２つの辺に沿って設けられることが好ましい。溝１８は、電子部品２０の少なくとも１辺に沿って設けられていればよい。溝１８は電子部品２０の４辺に沿って設けられ、互いに非連続でもよい。その構成は実施例１の図１（ｂ）と同じであるので説明を省略する。 [Modification 7 of Example 1]
11 (a) and 11 (b) are plan views of the component module according to the modified example 7 of the first embodiment. As shown in FIG. 11A, when the electronic component 20 is, for example, a semiconductor chip, the planar shape is substantially rectangular. When the planar shape of the electronic component 20 is substantially rectangular as described above, the grooves 18 are provided in a continuous line shape along at least two sides of the electronic component 20. By providing the groove 18 along the side, it is possible to prevent the peeling between the adhesive 12 and the sealing resin 24 from spreading to the electronic component 20. The length L1 of the groove 18 is preferably longer than the side length L2 of the electronic component 20. The groove 18 is preferably provided along at least two opposite sides of the electronic component 20. The groove 18 may be provided along at least one side of the electronic component 20. The grooves 18 are provided along the four sides of the electronic component 20 and may be discontinuous with each other. Since the configuration is the same as that of FIG. 1 (b) of the first embodiment, the description thereof will be omitted.
　実施例１の変形例４における除去部１８ａおよび実施例１の変形例６における除去部１８ｃは、少なくとも電子部品２０の１つの辺、または電子部品２０の相対向する２つの辺に少なくとも設けられればよい。 If the removing portion 18a in the modified example 4 of the first embodiment and the removing portion 18c in the modified example 6 of the first embodiment are provided at least on one side of the electronic component 20 or at least two opposing sides of the electronic component 20. Good.
　図１１（ｂ）に示すように、凹部１８ｂ（または孔）は、電子部品２０の少なくとも２つの辺に沿って点在している。凹部１８ｂが辺に沿って設けられることで、接着剤１２と封止樹脂２４との剥離が電子部品２０まで広がることを抑制できる。凹部１８ｂが設けられる長さＬ３は電子部品２０の辺の長さＬ２より長いことが好ましい。凹部１８ｂは、電子部品２０の少なくとも相対向する２つの辺に沿って設けられることが好ましい。その他の構成は実施例１の変形例４の図６と同じであるので説明を省略する。 As shown in FIG. 11B, the recesses 18b (or holes) are scattered along at least two sides of the electronic component 20. By providing the recess 18b along the side, it is possible to prevent the peeling between the adhesive 12 and the sealing resin 24 from spreading to the electronic component 20. The length L3 in which the recess 18b is provided is preferably longer than the side length L2 of the electronic component 20. The recess 18b is preferably provided along at least two opposite sides of the electronic component 20. Since other configurations are the same as those in FIG. 6 of the modified example 4 of the first embodiment, the description thereof will be omitted.
［実施例１の変形例８］
　図１２は、実施例１の変形例８に係る部品モジュールの断面図である。図１２に示すように、金属層１４上に接着剤１２ａを介し絶縁層１０ａが接合されている。接着剤１２ａおよび絶縁層１０ａを貫通する貫通孔１６ａが設けられている。絶縁層１０ａの上面および貫通孔１６ａ内に金属層１４ａが設けられている。金属層１４ａは貫通孔１６ａを介し金属層１４に電気的に接続されている。貫通孔１７ｂは、接着剤１２、絶縁層１０、接着剤１２ａおよび絶縁層１０ａを貫通する。絶縁層１０ａの上面に金属層１４ａを囲むように樹脂層２６が設けられ、樹脂層２６を囲むように封止樹脂２４ａが設けられている。その他の構成は実施例１の変形例６と同じであり説明を省略する。 [Modification 8 of Example 1]
FIG. 12 is a cross-sectional view of the component module according to the modified example 8 of the first embodiment. As shown in FIG. 12, an insulating layer 10a is bonded onto the metal layer 14 via an adhesive 12a. A through hole 16a that penetrates the adhesive 12a and the insulating layer 10a is provided. A metal layer 14a is provided on the upper surface of the insulating layer 10a and in the through hole 16a. The metal layer 14a is electrically connected to the metal layer 14 via a through hole 16a. The through hole 17b penetrates the adhesive 12, the insulating layer 10, the adhesive 12a, and the insulating layer 10a. A resin layer 26 is provided on the upper surface of the insulating layer 10a so as to surround the metal layer 14a, and a sealing resin 24a is provided so as to surround the resin layer 26. Other configurations are the same as those of the modified example 6 of the first embodiment, and the description thereof will be omitted.
　実施例１の変形例８のように、複数の絶縁層１０および１０ａと金属層１４および１４ａとが交互に積層されていてもよい。貫通孔１７ｂは電子部品２０が設けられた接着剤１２の下面から絶縁層１０ａの上面に向けて一度に形成してもよいし、接着剤１２および絶縁層１０と、接着剤１２ａおよび絶縁層１０ａと、の複数回に分けて貫通孔１７ｂを形成してもよい。図１２では、貫通孔１７ｂの側面は、封止樹脂２４側が封止樹脂２４ａ側より広くなるようなテーパ状である。貫通孔１７ｂの側面は、封止樹脂２４側が封止樹脂２４ａ側より狭くなるようなテーパ状である。また、貫通孔１７ｂの側面は、接着剤１２、絶縁層１０、接着剤１２ａおよび絶縁層１０ａ内のいずれかの位置で最も狭くなるように、２つのテーパ形状が組み合されていてもよい。 As in the modified example 8 of the first embodiment, the plurality of insulating layers 10 and 10a and the metal layers 14 and 14a may be alternately laminated. The through holes 17b may be formed at once from the lower surface of the adhesive 12 provided with the electronic component 20 toward the upper surface of the insulating layer 10a, or the adhesive 12 and the insulating layer 10 and the adhesive 12a and the insulating layer 10a may be formed at once. The through hole 17b may be formed in a plurality of times. In FIG. 12, the side surface of the through hole 17b is tapered so that the sealing resin 24 side is wider than the sealing resin 24a side. The side surface of the through hole 17b is tapered so that the sealing resin 24 side is narrower than the sealing resin 24a side. Further, the side surface of the through hole 17b may be combined with two tapered shapes so as to be the narrowest at any position in the adhesive 12, the insulating layer 10, the adhesive 12a and the insulating layer 10a.
　実施例１およびその変形例１～５において、接着剤１２および絶縁層１０と、接着剤１２ａおよび絶縁層１０ａが設けられていてもよい。 In Example 1 and Modifications 1 to 5 thereof, the adhesive 12 and the insulating layer 10 and the adhesive 12a and the insulating layer 10a may be provided.
　以上、本発明の実施例について詳述したが、本発明はかかる特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 Although the examples of the present invention have been described in detail above, the present invention is not limited to such specific examples, and various modifications and modifications are made within the scope of the gist of the present invention described in the claims. It can be changed.
　１０、１０ａ　絶縁層
　１２、１２ａ　接着剤
　１４、１４ａ　金属層
　１６，１６ａ、１７ｂ　貫通孔
　１７ａ、１８　溝
　１８ａ、１８ｃ　除去部
　１８ｂ　凹部
　２０　電子部品
　２２　電極
　２４、２４ａ　封止樹脂
　２６　樹脂層
　 10, 10a Insulation layer 12, 12a Adhesive 14, 14a Metal layer 16, 16a, 17b Through hole 17a, 18 Groove 18a, 18c Removal part 18b Recess 20 Electronic component 22 Electrode 24, 24a Encapsulating resin 26 Resin layer

Claims (9)

  1. 　可撓性を有する樹脂絶縁層と、
    　前記樹脂絶縁層の下面に設けられた樹脂接着剤と、
    　前記樹脂絶縁層の下面に前記樹脂接着剤を介し接合された電子部品と、
    　前記樹脂絶縁層と前記樹脂接着剤とを貫通する貫通孔内および前記樹脂絶縁層の上面に設けられ、前記電子部品に接続する金属層と、
    　前記樹脂絶縁層の下面に前記電子部品を封止するように設けられ、前記樹脂接着剤および前記樹脂絶縁層の少なくとも一部が除去された除去部に充填された封止樹脂と、
    　を備える部品モジュール。     With a flexible resin insulating layer,
    With the resin adhesive provided on the lower surface of the resin insulating layer,
    An electronic component bonded to the lower surface of the resin insulating layer via the resin adhesive,
    A metal layer provided in a through hole penetrating the resin insulating layer and the resin adhesive and on the upper surface of the resin insulating layer and connected to the electronic component, and a metal layer.
    A sealing resin provided on the lower surface of the resin insulating layer so as to seal the electronic component, and filled in a removing portion from which at least a part of the resin adhesive and the resin insulating layer has been removed.
    Parts module with.
  2. 　前記除去部は前記樹脂接着剤を貫通し前記樹脂絶縁層の一部に達する請求項１に記載の部品モジュール。 The component module according to claim 1, wherein the removing portion penetrates the resin adhesive and reaches a part of the resin insulating layer.
  3. 　前記除去部の底面は前記樹脂接着剤内に位置する請求項１に記載の部品モジュール。 The component module according to claim 1, wherein the bottom surface of the removal portion is located inside the resin adhesive.
  4. 　前記除去部は前記樹脂接着剤が設けられていない前記樹脂絶縁層の下面に設けられる請求項１に記載の部品モジュール。 The component module according to claim 1, wherein the removing portion is provided on the lower surface of the resin insulating layer to which the resin adhesive is not provided.
  5. 　前記除去部は前記樹脂絶縁層の端部に位置し、
    　前記封止樹脂は前記樹脂接着剤の端面を被覆する請求項１に記載の部品モジュール。     The removal portion is located at the end of the resin insulating layer, and is located at the end of the resin insulating layer.
    The component module according to claim 1, wherein the sealing resin covers an end face of the resin adhesive.
  6. 　前記除去部の少なくとも一部は前記樹脂接着剤および前記樹脂絶縁層を貫通する孔であり、
    　前記封止樹脂は、前記樹脂絶縁層の上面に設けられ前記電子部品を封止する第１封止樹脂と、前記樹脂絶縁層の下面に設けられ前記金属層の少なくとも一部を囲み、前記孔を介し前記第１封止樹脂と接続された第２封止樹脂と、を含む請求項１に記載の部品モジュール。     At least a part of the removed portion is a hole penetrating the resin adhesive and the resin insulating layer.
    The sealing resin is provided on the upper surface of the resin insulating layer to seal the electronic component, and the sealing resin is provided on the lower surface of the resin insulating layer and surrounds at least a part of the metal layer. The component module according to claim 1, further comprising a second sealing resin connected to the first sealing resin via the above.
  7. 　前記電子部品の平面形状は略矩形であり、
    　前記除去部は、前記電子部品の少なくとも２つの辺に沿って連続したライン状に設けられた溝である請求項１から６のいずれか一項に記載の部品モジュール。     The planar shape of the electronic component is substantially rectangular.
    The component module according to any one of claims 1 to 6, wherein the removing portion is a groove provided in a continuous line along at least two sides of the electronic component.
  8. 　前記電子部品の平面形状は略矩形であり、
    　前記除去部は、前記電子部品の少なくとも２つの辺に沿って点在した孔または凹部である請求項１から６のいずれか一項に記載の部品モジュール。     The planar shape of the electronic component is substantially rectangular.
    The component module according to any one of claims 1 to 6, wherein the removing portion is holes or recesses scattered along at least two sides of the electronic component.
  9. 　前記除去部内の側面は前記樹脂絶縁層の下面と略直交する請求項１から８のいずれか一項に記載の部品モジュール。
    　     The component module according to any one of claims 1 to 8, wherein the side surface inside the removal portion is substantially orthogonal to the lower surface of the resin insulating layer.
PCT/JP2019/051527 2019-12-27 2019-12-27 Component module WO2021131044A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352076A (en) * 2005-05-18 2006-12-28 Yamaha Corp Process for manufacturing semiconductor device, and the semiconductor device
JP2010147293A (en) * 2008-12-19 2010-07-01 Casio Computer Co Ltd Method of manufacturing semiconductor device
US20120224335A1 (en) * 2011-03-02 2012-09-06 Qiu Yuan Printed circuit board and semiconductor package using the same
JP2016021557A (en) * 2014-06-17 2016-02-04 パナソニックＩｐマネジメント株式会社 Electronic component package
JP2019114759A (en) * 2017-12-26 2019-07-11 太陽誘電株式会社 Circuit module and method of manufacturing circuit module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352076A (en) * 2005-05-18 2006-12-28 Yamaha Corp Process for manufacturing semiconductor device, and the semiconductor device
JP2010147293A (en) * 2008-12-19 2010-07-01 Casio Computer Co Ltd Method of manufacturing semiconductor device
US20120224335A1 (en) * 2011-03-02 2012-09-06 Qiu Yuan Printed circuit board and semiconductor package using the same
JP2016021557A (en) * 2014-06-17 2016-02-04 パナソニックＩｐマネジメント株式会社 Electronic component package
JP2019114759A (en) * 2017-12-26 2019-07-11 太陽誘電株式会社 Circuit module and method of manufacturing circuit module

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