WO2021129757A1 - 温度控制方法、***及存储介质 - Google Patents
温度控制方法、***及存储介质 Download PDFInfo
- Publication number
- WO2021129757A1 WO2021129757A1 PCT/CN2020/139090 CN2020139090W WO2021129757A1 WO 2021129757 A1 WO2021129757 A1 WO 2021129757A1 CN 2020139090 W CN2020139090 W CN 2020139090W WO 2021129757 A1 WO2021129757 A1 WO 2021129757A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- temperature
- air
- cooling
- real
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
- G05D23/303—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature using a sensing element having a resistance varying with temperature, e.g. thermistor
Definitions
- the embodiments of the present application relate to the field of communication technology, and in particular, to a temperature control method, system, and storage medium.
- Some embodiments of this application provide a temperature control method, which is applied to a temperature control system.
- the temperature control system includes a chip, a cooling fin, a heat sink, and an air-cooling device.
- the chip is connected to the low-temperature end of the cooling fin, and the high-temperature end of the cooling fin Connected to one end of the heat sink, and the air cooling device is used to dissipate heat from the heat sink.
- the method includes: obtaining the internal real-time operating temperature of the chip; if the internal real-time operating temperature of the chip is less than a first preset threshold, performing temperature control on the chip through an air cooling device; and if the internal real-time operating temperature of the chip is greater than or equal to the first preset threshold Set the threshold, then the temperature control of the chip is carried out through the cooling plate and the air-cooling device.
- Some embodiments of the application also provide a temperature control system, including: a chip, a cooling fin, a heat sink, and an air cooling device; the chip is connected to the low temperature end of the cooling fin, and the high temperature end of the cooling fin is connected to one end of the heat sink, so The air-cooling device is used to dissipate heat from the heat sink; the temperature control system further includes: at least one processor communicatively connected with the chip, the cooling fin, and the air-cooling device, and a memory communicatively connected with the at least one processor; wherein, the memory An instruction executable by at least one processor is stored, and the instruction is executed by at least one processor, so that the processor can execute the temperature control method as described above.
- Some embodiments of the present application also provide a computer-readable storage medium that stores a computer program, and when the computer program is executed by a processor, the above-mentioned temperature control method is implemented.
- Fig. 1 is a front view of a schematic structural diagram of a temperature control system according to the first embodiment of the present application
- Fig. 2 is a top view of a schematic structural diagram of a temperature control system in the first embodiment of the present application
- Fig. 3 is a flowchart of a temperature control method according to the first embodiment of the present application.
- Fig. 4 is a flowchart of a temperature control method according to the second embodiment of the present application.
- FIG. 5 is a flowchart of a temperature control method according to the third embodiment of the present application.
- Fig. 6 is a schematic structural diagram of a temperature control system according to a fourth embodiment of the present application.
- the purpose of some embodiments of this application is to provide a temperature control method, system, and storage medium, so that the heat dissipation efficiency of the chip is improved, and the temperature of the chip device body is prevented from being too high, thereby avoiding the influence of the PCB board on other peripheral core devices ; And can accurately control the working temperature of the chip, so that the chip can run more stably and reliably.
- the first embodiment of the present application relates to a temperature control method, which is applied to a temperature control system.
- the temperature control system includes: a chip, a cooling fin, a heat sink, and an air cooling device.
- the chip is connected to the low temperature end of the cooling fin, and the high temperature of the cooling fin is The end is connected with one end of the heat sink, and the air cooling device is used to dissipate heat from the heat sink.
- the method includes: obtaining the internal real-time operating temperature of the chip; if the internal real-time operating temperature of the chip does not reach a first preset threshold, performing temperature control on the chip through an air cooling device; if the internal real-time operating temperature of the chip reaches the first predetermined threshold Set the threshold, then the temperature control of the chip is carried out through the cooling plate and the air-cooling device.
- the cooling fin is a semiconductor cooling fin and the air cooling device is a DC fan as an example for description.
- the temperature control system in this embodiment is shown in Figs. 1 and 2, where Fig. 1 is a front view and Fig. 2 is a top view.
- the temperature control system in this embodiment includes: heat sink 1, semiconductor refrigeration fin 2, chip 3.
- the outlet direction of the DC fan 9 faces the heat sink 1.
- the semiconductor refrigeration sheet 2 has a hot end 5 and a cold end 6; the chip 3 is mounted on the printed circuit PCB board 4.
- the base surface of the heat sink 1 is attached to the hot end 5 of the semiconductor refrigeration fin 2 to conduct the heat of the hot end 5 of the semiconductor refrigeration fin 2 to the air; the cold end 6 of the semiconductor refrigeration fin 2 is connected to the chip 3
- the surface away from the PCB board 4 is attached; the semiconductor refrigeration sheet is connected to the socket 8 on the PCB board 4 through the power cord 7, and the semiconductor refrigeration sheet 2 is powered by the PCB board 4 through the socket 8 and the power cord 7.
- the temperature control method in this embodiment is applied to the above-mentioned temperature control system, as shown in FIG. 3, including:
- Step 301 Obtain the real-time internal working temperature of the chip.
- the operating temperature of the chip is detected in real time to obtain the real-time internal operating temperature of the chip.
- the internal real-time working temperature of the chip is obtained by reading the temperature signal of the sensor built into the chip.
- the chip has N temperature sensors, where N is a natural number greater than 1.
- the types of temperature sensors include: thermal resistance temperature sensor and thermal sensitive type Temperature sensor; this embodiment does not limit the type of temperature sensor.
- the N sensors built into the chip will be distributed in different positions inside the chip, and each sensor will generate a temperature signal.
- the structural difference of the chip will cause the temperature recorded in the temperature signal generated by each sensor to have multiple different values. Taking the temperature with the highest temperature value among the various temperature signals as the working temperature of the chip, the temperature control of the chip can be performed more safely, and the local temperature will not be too high.
- Step 302 Determine whether the internal real-time operating temperature of the chip reaches the first preset threshold; if the internal real-time operating temperature of the chip does not reach the first preset threshold, step 303 is executed to control the temperature of the chip through an air-cooled device; if the chip's internal real-time operating temperature does not reach the first preset threshold; If the internal real-time operating temperature of the chip reaches the first preset threshold, step 304 is executed to perform temperature control on the chip through the refrigeration sheet and the air-cooling device.
- the temperature control of the chip by the air-cooling device and the cooling fin it also includes: when the operating temperature of the chip drops below the first preset threshold, controlling the cooling fin to stop working. When the chip temperature is lower than the first preset threshold, only the air-cooling device can ensure that the chip temperature no longer rises. Therefore, the cooling chip is controlled to stop working and the power consumed by the temperature control is reduced.
- the first preset threshold is selected according to pre-tests and experiments.
- the operating temperature of the chip that can be guaranteed by the air-cooled device under the maximum heat dissipation capacity is set to the first preset threshold.
- the temperature is set below the threshold, the heat generated by the chip is transferred to the air through the heat sink, and the high-temperature air is taken away by the DC fan.
- the heat dissipation of the heat sink is the same as the heat generated by the chip, so the working temperature of the chip does not reach the first preset temperature.
- the temperature of the chip is controlled by the air-cooled device, which can keep the chip at a stable and reliable operating temperature; when the operating temperature of the chip reaches the first preset threshold, it means that the heat dissipation capacity of the air-cooled device is insufficient In order to maintain the chip running at a stable and reliable temperature, it is necessary to use both the cooling plate and the air-cooled device to control the temperature of the chip.
- the low temperature of the cold end can quickly absorb the heat of the chip to prevent the chip body from overheating High heat passes through the PCB to increase the temperature of the surrounding components, while the hot end conducts the heat through the heat sink to the air through the heat sink, and the high temperature air is taken away by the DC fan, thereby ensuring that the chip is at a stable and reliable temperature jobs.
- step 303 or step 304 return to step 301 to obtain the real-time internal working temperature of the chip.
- the working load of the chip changes or the ambient temperature changes, the working temperature of the chip will change. Therefore, it is necessary to detect the working temperature of the chip in real time, determine whether the current working temperature of the chip reaches the first preset threshold, and adjust the temperature control method according to the working temperature of the chip. If currently only air-cooled devices are used to dissipate the chip, the chip temperature rises above the first preset threshold due to changes in chip workload or changes in ambient temperature, the cooling fins need to be activated, so that both cooling fins and air cooling are used.
- the chip temperature drops below the first preset threshold due to changes in chip workload or changes in ambient temperature At this time, it is necessary to turn off the cooling fins and only use the air-cooled device to dissipate the chips to avoid excessive heat dissipation and waste power consumption.
- this embodiment uses multiple sensors built into the chip to obtain the real-time internal working temperature of the chip, which is more accurate to obtain the real-time internal working temperature of the chip. Determine how to perform temperature control on the chip according to whether the internal real-time operating temperature reaches the first preset threshold.
- the air-cooled device is used to control the temperature of the chip; when the real-time temperature reaches the first preset threshold, the air-cooled device and the cooling chip are used to control the temperature of the chip at the same time.
- the cooling fin can reduce the chip temperature to below the ambient temperature, so as to ensure that the chip can work at a stable and reliable temperature; in addition, since the chip first contacts the cooling fin instead of directly contacting the heat sink, it can make The temperature of the heat sink is higher without affecting the body temperature of the chip, so that the rotation speed of the communication subrack fan can be reduced, thereby reducing the noise of the entire device.
- the second embodiment of the present application relates to a temperature control method.
- This embodiment is substantially the same as the first embodiment of the present application, except that the two steps of step 303 and step 304 are specifically limited in this embodiment.
- Step 401 Obtain the real-time internal working temperature of the chip.
- Step 402 determine whether the internal real-time operating temperature of the chip reaches the first preset threshold; if the internal real-time operating temperature of the chip does not reach the first preset threshold, perform step 4031; if the internal real-time operating temperature of the chip reaches the first preset Threshold, step 4042 is executed.
- Step 401 and step 402 are similar to step 301 and step 302 in the first embodiment of the present application, and the relevant implementation details have been specifically described in the first embodiment of the present application, and will not be repeated here.
- Step 4031 Convert the temperature signal to a current signal to adjust the air-cooling control parameters
- Step 4041 Convert the temperature signal to a current signal and a voltage signal to adjust the air-cooling control parameters and electric-cooling control parameters, respectively.
- the air cooling device in this embodiment is specifically a DC fan, and the cooling fins are semiconductor cooling fins.
- the air-cooling control parameter corresponding to the DC fan is the fan speed, and the DC fan is driven by a DC signal, and the magnitude of the current is positively related to the fan speed;
- the electric cooling control parameter corresponding to the semiconductor refrigeration chip is the access power, semiconductor refrigeration
- the chip is driven by a voltage signal, and the magnitude of the voltage is positively related to the cooling capacity of the semiconductor cooling chip.
- the temperature signal obtained from the temperature sensor is converted into a current signal, the DC fan is driven, and the air cooling control parameter is adjusted.
- the temperature signal obtained from the temperature sensor is converted into a current signal and a voltage signal to drive the DC fan and the semiconductor refrigeration chip.
- Step 4032 perform temperature control on the chip according to the air-cooling control parameters
- step 4042 perform temperature control on the chip according to the air-cooling control parameters and the electric cooling control parameters respectively.
- different air cooling control parameters control the air cooling device to produce different heat dissipation capabilities
- different electric cooling control parameters control the cooling fins to produce different heat dissipation capabilities. Adjusting the air-cooling control parameters, that is, adjusting the speed of the DC fan, so that the DC fan provides different heat dissipation capabilities at different temperatures. Adjust the electric cooling control parameters, that is, adjust the access power of the semiconductor refrigeration fins, so that the semiconductor refrigeration fins provide different heat dissipation capabilities at different temperatures.
- the temperature control of the chip by the air-cooling device includes: determining the air-cooling control parameter according to the real-time internal working temperature of the chip; controlling the temperature of the chip according to the air-cooling control parameter; using the air-cooling device and The cooling chip performs temperature control on the chip, including: determining the air cooling control parameter and the electric cooling control parameter according to the working temperature of the chip; and controlling the temperature of the chip according to the air cooling control parameter and the electric cooling control parameter.
- Different control parameters are determined according to the internal real-time working temperature of the chip to control the air-cooled device and the refrigeration fins to achieve precise control of the working temperature of the chip.
- the third embodiment of the present application is similar to the second embodiment of the present application. The difference is that when the internal real-time operating temperature of the chip reaches the second preset threshold, the air-cooling control parameters and the electric-cooling control parameters are performed Adjust to perform temperature control on the chip with a greater cooling intensity, wherein the second preset threshold is greater than the first preset threshold.
- Step 501 Obtain the real-time working temperature of the chip.
- Step 501 is similar to step 301 in the first embodiment of the present application, and the relevant implementation details have been specifically described in the first embodiment of the present application, and will not be repeated here.
- Step 502 determine whether the real-time operating temperature of the chip reaches the second preset threshold; if the real-time operating temperature of the chip reaches the second preset threshold, perform step 504 to determine whether the real-time operating temperature of the chip reaches the first preset threshold; if If the real-time operating temperature of the chip does not reach the second preset threshold, step 503 is executed to perform temperature control on the chip with the first cooling intensity according to the first air cooling parameter.
- Step 504 Determine whether the real-time operating temperature of the chip reaches the first preset threshold; if the real-time operating temperature of the chip does not reach the first preset threshold, step 505 is executed, and the chip is performed with the second cooling intensity according to the second air-cooling parameter. Temperature control; if the real-time operating temperature of the chip reaches the first preset threshold, step 506 is executed to perform temperature control on the chip according to the air cooling control parameter and the electric cooling control parameter.
- the first preset threshold is greater than the second preset threshold.
- a higher cooling intensity is required to control the temperature of the chip.
- the first air-cooling control parameter is used to control the air-cooling device to control the temperature of the chip, and the cooling intensity at this time is the first cooling intensity;
- the second air-cooling control parameter is used to perform temperature control on the chip.
- the real-time work of the chip When the real-time work of the chip is at a high temperature, it means that the current load of the chip is high or the ambient temperature is high. In this case, the working temperature of the chip is maintained within a temperature range that can operate stably, and a higher temperature is required.
- the cooling intensity of the chip to ensure that the temperature of the chip does not increase or decrease to a temperature range for stable operation. Therefore, in different temperature intervals, the determined air-cooling control parameters and electric-cooling control parameters are also different, so that the air-cooling device and the electric-cooling device provide different cooling intensities in different temperature intervals. Among them, the higher the speed of the DC fan, the higher the cooling intensity provided; the greater the power of the semiconductor refrigeration chip, the higher the cooling intensity provided.
- the first preset threshold is a temperature close to the maximum temperature at which the chip can work normally.
- the heat dissipation system is required to maximize The heat dissipation capacity of the chip is used to control the temperature of the chip.
- the air-cooling device and the cooling plate are used to dissipate the chip to ensure that the internal real-time working temperature of the chip does not increase, and the chip temperature is not too high.
- the heat is transferred to other core components around and affects the stability of the entire device.
- the first preset threshold is 80 degrees Celsius
- the second preset threshold is 60 degrees Celsius.
- the DC fan is controlled to run at a parameter of 2500 revolutions per minute; when the chip's internal real-time operating temperature is greater than 60 degrees Celsius but less than 80 degrees Celsius, the DC fan is controlled to 5000 revolutions The parameter runs every minute; when the real-time working temperature inside the chip is greater than or equal to 80 degrees Celsius, the semiconductor refrigeration film is activated, and the DC fan and the semiconductor refrigeration film are controlled to control the temperature of the chip at the same time.
- more preset thresholds may be set in advance to divide the operating temperature range of the chip more finely, and at the same time provide a corresponding number of air-cooling control parameters.
- determining the air-cooling control parameter according to the internal real-time operating temperature of the chip includes: if the internal real-time operating temperature of the chip does not reach the second preset threshold, temperature the chip according to the first air-cooling control parameter Control; if the internal real-time operating temperature of the chip reaches the second preset threshold but does not reach the first preset threshold, the chip is temperature controlled according to the second air-cooling control parameter; wherein the second preset threshold is less than the first preset Threshold; the cooling intensity corresponding to the second air-cooling control parameter is greater than the cooling intensity corresponding to the first air-cooling control parameter.
- the air-cooled device When the internal working temperature of the chip is low, the air-cooled device is used to control the temperature of the chip with a lower cooling intensity, and when the working temperature is high, the air-cooled device is used to control the temperature of the chip with a higher cooling intensity . So as to realize the precise control of the internal working temperature of the chip, while avoiding waste of energy consumption.
- the fourth embodiment of the present application relates to a temperature control system, as shown in FIG. 6, including:
- the memory 606 stores instructions that can be executed by the at least one processor 605, and the instructions are executed by the at least one processor 605, so that the at least one processor 605 can execute the temperature control methods in the first embodiment to the third embodiment.
- the cooling plate 602 is used to control the temperature of the chip 601 according to the electric cooling control parameter.
- the high temperature end of the cooling fin is connected to the chip, and the low temperature end is connected to one end of the heat sink.
- the heat sink 603 is used to transfer the heat of the cooling fin 602 to the air.
- the air-cooling device 604 is used to dissipate heat from the heat sink 603 and accelerate the speed at which the heat sink transfers the heat of the cooling fin to the air.
- the refrigeration fin is specifically a peltier
- the electric cooling control parameter is the power of the peltier
- the power of the peltier is positively correlated with the cooling intensity of the pelmet.
- the electric cooling control parameters are determined according to the internal real-time operating temperature of the chip.
- the semiconductor refrigeration chip does not work; if the internal real-time operating temperature of the chip is greater than the first preset threshold and If the temperature is less than or equal to the second preset threshold, the semiconductor refrigeration chip works with the first electric cooling parameter; if the real-time internal operating temperature of the chip is greater than the second preset threshold, the semiconductor refrigeration chip works with the second electric cooling parameter; The second electric cooling parameter is greater than the first electric cooling parameter, and the cooling intensity of the semiconductor refrigeration fin when operating with the second electric cooling parameter is greater than the cooling intensity when the semiconductor cooling fin is operated with the first electric cooling parameter.
- the air-cooling device is specifically a DC fan
- the air-cooling control parameter is the speed of the DC fan
- the connected power is positively correlated with the cooling intensity of the DC fan.
- the air-cooling control parameters are determined according to the internal real-time operating temperature of the chip. If the internal real-time operating temperature of the chip is greater than the first preset threshold and less than or equal to the second preset threshold, the DC fan operates with the first air-cooling parameter; If the internal real-time operating temperature is greater than the second preset threshold, the DC fan will work at the second air-cooling parameter; where the second air-cooling parameter is greater than the first air-cooling parameter, and the DC fan will have a greater cooling intensity when operating at the second air-cooling parameter. The cooling intensity when the DC fan is running at the first air-cooling parameter.
- the chip 601 also has N temperature sensors built in; where N is a natural number greater than 1.
- the N temperature sensors are all connected to the processor 605 and the memory 606 in communication.
- the memory 602 and the processor 601 are connected in a bus manner.
- the bus may include any number of interconnected buses and bridges, and the bus connects one or more various circuits of the processor 601 and the memory 602 together.
- the bus can also connect various other circuits such as peripheral devices, voltage regulators, and power management circuits, etc., which are all known in the art, and therefore, no further description will be given herein.
- the bus interface provides an interface between the bus and the transceiver.
- the transceiver may be one element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices on the transmission medium.
- the data processed by the processor 601 is transmitted on the wireless medium through the antenna, and further, the antenna also receives the data and transmits the data to the processor 601.
- the processor 601 is responsible for managing the bus and general processing, and can also provide various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions.
- the memory 602 may be used to store
- N sensors are built in the chip; where N is a natural number greater than 1; obtaining the working temperature of the chip includes: obtaining N temperature signals through N sensors; As the operating temperature of the chip. By reading the temperature signals of multiple sensors to select the highest temperature, the obtained operating temperature can be more representative, and the control of the chip's operating temperature can be more accurate, and it can better ensure that the chip is at a stable and reliable temperature. run.
- this embodiment is an example of a system implemented in cooperation with the temperature control methods in the first embodiment to the third embodiment of the present application. Since the first to third embodiments are implemented in cooperation with this embodiment, the related technical details mentioned in the first to third embodiments are still valid in this embodiment. The technical effects that can be achieved in the third embodiment can also be achieved in this embodiment. In order to reduce repetition, details are not repeated here. Correspondingly, the related technical details mentioned in this embodiment can also be applied to the first embodiment to the third embodiment.
- modules involved in this embodiment are all logical modules.
- a logical unit can be a physical unit, a part of a physical unit, or multiple physical units. The combination of units is realized.
- this embodiment does not introduce units that are not closely related to solving the technical problems proposed by this application, but this does not mean that there are no other units in this embodiment.
- the fifth embodiment of the present application relates to a computer-readable storage medium that stores a computer program.
- the computer-readable storage medium includes a transitory computer-readable storage medium and a non-transitory computer-readable storage medium.
- the program is stored in a storage medium and includes several instructions to enable a device ( It may be a single-chip microcomputer, a chip, etc.) or a processor (processor) that executes all or part of the steps of the methods described in the embodiments of the present application.
- the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes. .
- the chip is connected to the low temperature end of the cooling fin, the high temperature end of the cooling fin is connected to one end of the heat sink, and the other end of the heat sink is connected to the air cooling device.
- the working temperature determines how to control the temperature of the chip according to whether the internal real-time working temperature reaches the first preset threshold. Directly detect the working temperature inside the chip, avoid the influence of ambient temperature, and control the chip temperature more accurately.
- the air-cooled device When the internal real-time operating temperature does not reach the first preset threshold, because the temperature of the chip is relatively low, the demand for heat dissipation is relatively low, so only the air-cooled device is used to dissipate the heat sink to realize the temperature control of the chip; When the internal real-time working temperature reaches the first preset threshold, the air-cooled device and the cooling plate are used to control the temperature of the chip.
- the chip is connected to the cooling plate. Due to the low temperature of the cooling end of the cooling plate, the heat of the chip can be quickly transferred to the cooling system.
- the cooling chip transfers the heat to the heat sink, and the heat sink is dissipated through the air-cooling device to increase the heat dissipation and heat dissipation efficiency of the chip, and ensure that the temperature of the chip no longer rises.
- the chip maintains a reliable and stable working condition.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
- 一种温度控制方法,其中,应用于温度控制***,所述温度控制***包括:芯片、制冷片、散热片以及风冷装置,所述芯片与所述制冷片的低温端连接,所述制冷片的高温端与所述散热片的一端连接,所述风冷装置用于对所述散热片进行散热;所述方法包括:获取所述芯片的内部实时工作温度;若所述芯片的内部实时工作温度未到达第一预设阈值,则通过所述风冷装置对所述芯片进行温度控制;若所述芯片的实时工作温度达到所述第一预设阈值,则通过所述制冷片和所述风冷装置对所述芯片进行温度控制。
- 根据权利要求1所述的温度控制方法,其中,在所述通过风冷装置和制冷片对所述芯片进行温度控制后,还包括:当所述芯片的实时工作温度降低至所述第一预设阈值以下,控制所述制冷片停止工作。
- 根据权利要求1所述的温度控制方法,其中,所述通过所述风冷装置对所述芯片进行温度控制,包括:根据所述芯片的内部实时工作温度确定风冷控制参数;根据所述风冷控制参数,对所述芯片进行温度控制;所述通过所述风冷装置和所述制冷片对所述芯片进行温度控制,包括:根据所述芯片的内部实时工作温度确定所述风冷控制参数以及电冷控制参数;根据所述风冷控制参数以及所述电冷控制参数,对所述芯片进行温度控制。
- 根据权利要求3所述的温度控制方法,其中,所述风冷装置为直流风扇,所述风冷控制参数包括:风扇转速;所述制冷片为半导体制冷片,所述电冷控制参数包括:半导体接入功率。
- 根据权利要求3所述的温度控制方法,其中,所述根据所述芯片的内部实时工作温度确定风冷控制参数,包括:若所述芯片的内部实时工作温度未达到第二预设阈值,则根据第一风冷控制参数对所述芯片进行温度控制;若所述芯片的内部实时工作温度达到第二预设阈值但未达到第一预设阈 值,则根据第二风冷控制参数对所述芯片进行温度控制;其中,所述第二预设阈值小于所述第一预设阈值;所述第二风冷控制参数对应的降温强度,大于所述第一风冷控制参数对应的降温强度。
- 根据权利要求3所述的温度控制方法,其中,所述根据所述芯片的内部实时工作温度确定风冷控制参数,包括:将所述芯片的内部实时工作温度的温度信号转换为电压信号,并根据转换后的电压信号调整风冷控制参数;所述根据所述芯片的工作温度确定所述风冷控制参数以及电冷控制参数,包括:将所述芯片的内部实时工作温度的温度信号转换为电压信号,并根据转换后的电压信号调整风冷控制参数;将所述芯片的内部实时工作温度的温度信号转换为电流信号,并根据转换后的电流信号调整电冷控制参数。
- 根据权利要求1至5中任一项所述的温度控制方法,其中,所述芯片内置N个传感器;其中,N为大于1的自然数;所述获取芯片的内部实时工作温度,包括:通过所述N个传感器获取N个温度信号;将所述N个温度信号中的最高温度作为所述芯片的内部实时工作温度。
- 一种温度控制***,其中,包括:芯片、制冷片、散热片和风冷装置;所述芯片与所述制冷片的低温端连接,所述制冷片的高温端与所述散热片的一端连接,所述风冷装置用于对所述散热片进行散热;所述温度控制***还包括:与所述芯片、所述制冷片以及所述风冷装置通信连接的至少一个处理器以及与所述至少一个处理器通信连接的存储器;其中,所述存储器存储有可被所述至少一个处理器执行的指令,所述指令被所述至少一个处理器执行,以使所述处理器能够执行如权利要求1至7中任一项所述的温度控制方法。
- 根据权利要求8所述的温度控制***,其中,还包括:N个传感器;其中,所述N为大于1的自然数,所述N个传感器内置于所述芯片,用于检测所述芯片的内部实时工作温度。
- 一种计算机可读存储介质,存储有计算机程序,其中,所述计算机程序被处理器执行时实现如权利要求1至7中任一项所述的温度控制方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911355930.8 | 2019-12-25 | ||
CN201911355930.8A CN113031672A (zh) | 2019-12-25 | 2019-12-25 | 温度控制方法、***及存储介质 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021129757A1 true WO2021129757A1 (zh) | 2021-07-01 |
Family
ID=76458156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/139090 WO2021129757A1 (zh) | 2019-12-25 | 2020-12-24 | 温度控制方法、***及存储介质 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113031672A (zh) |
WO (1) | WO2021129757A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113864218A (zh) * | 2021-09-27 | 2021-12-31 | 北京热刺激光技术有限责任公司 | 一种风冷光纤激光器的风机的调速方法、装置及*** |
CN114326851A (zh) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | 一种基于tec的边缘智能温控方法及*** |
CN114448172B (zh) * | 2021-12-03 | 2024-06-21 | 南昌三瑞智能科技有限公司 | 一种无人机电机散热方法及装置 |
CN114326993A (zh) * | 2021-12-20 | 2022-04-12 | 深圳飞音时代网络通讯技术有限公司 | 一种目标设备的芯片温度控制方法、装置及*** |
CN114295961B (zh) * | 2021-12-30 | 2024-01-16 | 上海季丰电子股份有限公司 | 大功率芯片的功率温度循环试验方法、装置和电子设备 |
CN114594808A (zh) * | 2022-03-07 | 2022-06-07 | 日照华斯特林科技有限公司 | 一种恒温智能控制*** |
CN116880625B (zh) * | 2023-09-07 | 2023-12-05 | 北京华鲲振宇智能科技有限责任公司 | 一种智能融合终端整机cpu芯片低温加热装置及方法 |
CN117369559B (zh) * | 2023-12-07 | 2024-04-23 | 深圳市亿联无限科技股份有限公司 | 芯片温控方法、***及通信设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2849788Y (zh) * | 2005-08-05 | 2006-12-20 | 吴智泉 | 电子设备温度控制装置 |
CN203643928U (zh) * | 2013-11-28 | 2014-06-11 | 山东浪潮商用***有限公司 | 一种大功率集成运放芯片自动温度控制模块 |
US20150082811A1 (en) * | 2013-09-25 | 2015-03-26 | Intel Corporation | Adaptive Thermoelectric Cooling In A Processor |
CN105759868A (zh) * | 2016-05-13 | 2016-07-13 | 浙江水晶光电科技股份有限公司 | 一种适用于汽车抬头显示设备的温度控制装置和方法 |
CN107517570A (zh) * | 2017-09-04 | 2017-12-26 | 国网浙江杭州市余杭区供电公司 | 一种用于通信设备的散热装置的散热方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100592857C (zh) * | 2006-09-29 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN101714679B (zh) * | 2009-11-20 | 2011-11-09 | 重庆长安汽车股份有限公司 | 一种动力电池温度管理方法 |
CN104808720B (zh) * | 2015-03-30 | 2017-09-29 | 深圳市硅格半导体有限公司 | 基于传感器优化主控芯片的方法和装置 |
CN106211703A (zh) * | 2015-04-30 | 2016-12-07 | 佛山市顺德区美的电热电器制造有限公司 | 功率器件的散热装置及功率器件的散热控制方法 |
CN205194807U (zh) * | 2015-11-12 | 2016-04-27 | 东软集团股份有限公司 | 电动汽车动力电池的热管理***和电动汽车 |
CN106783653B (zh) * | 2016-11-24 | 2019-06-07 | 天津津航计算技术研究所 | 基于多芯片堆叠工艺的芯片内部温度监控设备 |
CN107764431B (zh) * | 2017-12-06 | 2023-12-08 | 西安智多晶微电子有限公司 | 芯片内核温度检测电路 |
CN108062122A (zh) * | 2017-12-18 | 2018-05-22 | 武汉大学 | 体内记忆合金电磁加热温控*** |
CN108469710A (zh) * | 2018-04-29 | 2018-08-31 | 中国华录集团有限公司 | 一种激光投影仪的激光二极管散热*** |
CN109283956B (zh) * | 2018-11-01 | 2021-04-06 | 武汉光迅科技股份有限公司 | 一种机架设备的温度控制方法和*** |
-
2019
- 2019-12-25 CN CN201911355930.8A patent/CN113031672A/zh active Pending
-
2020
- 2020-12-24 WO PCT/CN2020/139090 patent/WO2021129757A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2849788Y (zh) * | 2005-08-05 | 2006-12-20 | 吴智泉 | 电子设备温度控制装置 |
US20150082811A1 (en) * | 2013-09-25 | 2015-03-26 | Intel Corporation | Adaptive Thermoelectric Cooling In A Processor |
CN203643928U (zh) * | 2013-11-28 | 2014-06-11 | 山东浪潮商用***有限公司 | 一种大功率集成运放芯片自动温度控制模块 |
CN105759868A (zh) * | 2016-05-13 | 2016-07-13 | 浙江水晶光电科技股份有限公司 | 一种适用于汽车抬头显示设备的温度控制装置和方法 |
CN107517570A (zh) * | 2017-09-04 | 2017-12-26 | 国网浙江杭州市余杭区供电公司 | 一种用于通信设备的散热装置的散热方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113031672A (zh) | 2021-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021129757A1 (zh) | 温度控制方法、***及存储介质 | |
US20220137685A1 (en) | Heat transfer apparatus for a computer environment | |
US10180665B2 (en) | Fluid-cooled computer system with proactive cooling control using power consumption trend analysis | |
US9974213B2 (en) | Provisioning cooling elements for chillerless data centers | |
US10394293B2 (en) | Method for preventing over-heating of a device within a data processing system | |
US8565933B2 (en) | Heatsink with a plurality of fans | |
US8671290B2 (en) | Heat dissipating device | |
JP2009042211A (ja) | 半導体デバイスのための電力推定 | |
JP2007226617A (ja) | 電子機器の冷却システム、コンピュータおよび冷却方法 | |
TWI468594B (zh) | 多重效率風扇控制系統與具有風扇控制系統的電腦系統 | |
US20150059358A1 (en) | Controlling method for thermoelectric cooling device and heat-dissipating module employing same | |
US20160161998A1 (en) | Actively Cooled Liquid Cooling System | |
CN109298764B (zh) | 一种根据设备功耗智能调节风扇转速的散热方法 | |
US7237130B2 (en) | Blade server performance management method and system | |
JP2022084812A (ja) | 冷却システム、電子ラックおよび方法 | |
US20020121097A1 (en) | Temperature balance device | |
CN105320238A (zh) | 热保护方法和装置 | |
CN111190468A (zh) | 一种opc接口散热装置及方法 | |
CN111156187A (zh) | 一种服务器风扇转速控制方法及装置 | |
US9141427B2 (en) | Allocating tasks to peripheral processing units in a hierarchical tree topology based on temperature status of branches | |
US11825628B2 (en) | Hybrid cooling system for electronic racks | |
CN210129217U (zh) | 一种可即时监控功耗的制冷*** | |
JP2012033567A (ja) | 冷却装置 | |
CN111103943A (zh) | 一种液冷***的液冷能效比的确定方法和装置 | |
CN204166464U (zh) | 散热总成与具有散热总成的显示适配器装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20907892 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20907892 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 23/02/2023) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20907892 Country of ref document: EP Kind code of ref document: A1 |