WO2021129757A1 - 温度控制方法、***及存储介质 - Google Patents

温度控制方法、***及存储介质 Download PDF

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Publication number
WO2021129757A1
WO2021129757A1 PCT/CN2020/139090 CN2020139090W WO2021129757A1 WO 2021129757 A1 WO2021129757 A1 WO 2021129757A1 CN 2020139090 W CN2020139090 W CN 2020139090W WO 2021129757 A1 WO2021129757 A1 WO 2021129757A1
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Prior art keywords
chip
temperature
air
cooling
real
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PCT/CN2020/139090
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English (en)
French (fr)
Inventor
龚俭
迟方印
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中兴通讯股份有限公司
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Publication of WO2021129757A1 publication Critical patent/WO2021129757A1/zh

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • G05D23/303—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature using a sensing element having a resistance varying with temperature, e.g. thermistor

Definitions

  • the embodiments of the present application relate to the field of communication technology, and in particular, to a temperature control method, system, and storage medium.
  • Some embodiments of this application provide a temperature control method, which is applied to a temperature control system.
  • the temperature control system includes a chip, a cooling fin, a heat sink, and an air-cooling device.
  • the chip is connected to the low-temperature end of the cooling fin, and the high-temperature end of the cooling fin Connected to one end of the heat sink, and the air cooling device is used to dissipate heat from the heat sink.
  • the method includes: obtaining the internal real-time operating temperature of the chip; if the internal real-time operating temperature of the chip is less than a first preset threshold, performing temperature control on the chip through an air cooling device; and if the internal real-time operating temperature of the chip is greater than or equal to the first preset threshold Set the threshold, then the temperature control of the chip is carried out through the cooling plate and the air-cooling device.
  • Some embodiments of the application also provide a temperature control system, including: a chip, a cooling fin, a heat sink, and an air cooling device; the chip is connected to the low temperature end of the cooling fin, and the high temperature end of the cooling fin is connected to one end of the heat sink, so The air-cooling device is used to dissipate heat from the heat sink; the temperature control system further includes: at least one processor communicatively connected with the chip, the cooling fin, and the air-cooling device, and a memory communicatively connected with the at least one processor; wherein, the memory An instruction executable by at least one processor is stored, and the instruction is executed by at least one processor, so that the processor can execute the temperature control method as described above.
  • Some embodiments of the present application also provide a computer-readable storage medium that stores a computer program, and when the computer program is executed by a processor, the above-mentioned temperature control method is implemented.
  • Fig. 1 is a front view of a schematic structural diagram of a temperature control system according to the first embodiment of the present application
  • Fig. 2 is a top view of a schematic structural diagram of a temperature control system in the first embodiment of the present application
  • Fig. 3 is a flowchart of a temperature control method according to the first embodiment of the present application.
  • Fig. 4 is a flowchart of a temperature control method according to the second embodiment of the present application.
  • FIG. 5 is a flowchart of a temperature control method according to the third embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of a temperature control system according to a fourth embodiment of the present application.
  • the purpose of some embodiments of this application is to provide a temperature control method, system, and storage medium, so that the heat dissipation efficiency of the chip is improved, and the temperature of the chip device body is prevented from being too high, thereby avoiding the influence of the PCB board on other peripheral core devices ; And can accurately control the working temperature of the chip, so that the chip can run more stably and reliably.
  • the first embodiment of the present application relates to a temperature control method, which is applied to a temperature control system.
  • the temperature control system includes: a chip, a cooling fin, a heat sink, and an air cooling device.
  • the chip is connected to the low temperature end of the cooling fin, and the high temperature of the cooling fin is The end is connected with one end of the heat sink, and the air cooling device is used to dissipate heat from the heat sink.
  • the method includes: obtaining the internal real-time operating temperature of the chip; if the internal real-time operating temperature of the chip does not reach a first preset threshold, performing temperature control on the chip through an air cooling device; if the internal real-time operating temperature of the chip reaches the first predetermined threshold Set the threshold, then the temperature control of the chip is carried out through the cooling plate and the air-cooling device.
  • the cooling fin is a semiconductor cooling fin and the air cooling device is a DC fan as an example for description.
  • the temperature control system in this embodiment is shown in Figs. 1 and 2, where Fig. 1 is a front view and Fig. 2 is a top view.
  • the temperature control system in this embodiment includes: heat sink 1, semiconductor refrigeration fin 2, chip 3.
  • the outlet direction of the DC fan 9 faces the heat sink 1.
  • the semiconductor refrigeration sheet 2 has a hot end 5 and a cold end 6; the chip 3 is mounted on the printed circuit PCB board 4.
  • the base surface of the heat sink 1 is attached to the hot end 5 of the semiconductor refrigeration fin 2 to conduct the heat of the hot end 5 of the semiconductor refrigeration fin 2 to the air; the cold end 6 of the semiconductor refrigeration fin 2 is connected to the chip 3
  • the surface away from the PCB board 4 is attached; the semiconductor refrigeration sheet is connected to the socket 8 on the PCB board 4 through the power cord 7, and the semiconductor refrigeration sheet 2 is powered by the PCB board 4 through the socket 8 and the power cord 7.
  • the temperature control method in this embodiment is applied to the above-mentioned temperature control system, as shown in FIG. 3, including:
  • Step 301 Obtain the real-time internal working temperature of the chip.
  • the operating temperature of the chip is detected in real time to obtain the real-time internal operating temperature of the chip.
  • the internal real-time working temperature of the chip is obtained by reading the temperature signal of the sensor built into the chip.
  • the chip has N temperature sensors, where N is a natural number greater than 1.
  • the types of temperature sensors include: thermal resistance temperature sensor and thermal sensitive type Temperature sensor; this embodiment does not limit the type of temperature sensor.
  • the N sensors built into the chip will be distributed in different positions inside the chip, and each sensor will generate a temperature signal.
  • the structural difference of the chip will cause the temperature recorded in the temperature signal generated by each sensor to have multiple different values. Taking the temperature with the highest temperature value among the various temperature signals as the working temperature of the chip, the temperature control of the chip can be performed more safely, and the local temperature will not be too high.
  • Step 302 Determine whether the internal real-time operating temperature of the chip reaches the first preset threshold; if the internal real-time operating temperature of the chip does not reach the first preset threshold, step 303 is executed to control the temperature of the chip through an air-cooled device; if the chip's internal real-time operating temperature does not reach the first preset threshold; If the internal real-time operating temperature of the chip reaches the first preset threshold, step 304 is executed to perform temperature control on the chip through the refrigeration sheet and the air-cooling device.
  • the temperature control of the chip by the air-cooling device and the cooling fin it also includes: when the operating temperature of the chip drops below the first preset threshold, controlling the cooling fin to stop working. When the chip temperature is lower than the first preset threshold, only the air-cooling device can ensure that the chip temperature no longer rises. Therefore, the cooling chip is controlled to stop working and the power consumed by the temperature control is reduced.
  • the first preset threshold is selected according to pre-tests and experiments.
  • the operating temperature of the chip that can be guaranteed by the air-cooled device under the maximum heat dissipation capacity is set to the first preset threshold.
  • the temperature is set below the threshold, the heat generated by the chip is transferred to the air through the heat sink, and the high-temperature air is taken away by the DC fan.
  • the heat dissipation of the heat sink is the same as the heat generated by the chip, so the working temperature of the chip does not reach the first preset temperature.
  • the temperature of the chip is controlled by the air-cooled device, which can keep the chip at a stable and reliable operating temperature; when the operating temperature of the chip reaches the first preset threshold, it means that the heat dissipation capacity of the air-cooled device is insufficient In order to maintain the chip running at a stable and reliable temperature, it is necessary to use both the cooling plate and the air-cooled device to control the temperature of the chip.
  • the low temperature of the cold end can quickly absorb the heat of the chip to prevent the chip body from overheating High heat passes through the PCB to increase the temperature of the surrounding components, while the hot end conducts the heat through the heat sink to the air through the heat sink, and the high temperature air is taken away by the DC fan, thereby ensuring that the chip is at a stable and reliable temperature jobs.
  • step 303 or step 304 return to step 301 to obtain the real-time internal working temperature of the chip.
  • the working load of the chip changes or the ambient temperature changes, the working temperature of the chip will change. Therefore, it is necessary to detect the working temperature of the chip in real time, determine whether the current working temperature of the chip reaches the first preset threshold, and adjust the temperature control method according to the working temperature of the chip. If currently only air-cooled devices are used to dissipate the chip, the chip temperature rises above the first preset threshold due to changes in chip workload or changes in ambient temperature, the cooling fins need to be activated, so that both cooling fins and air cooling are used.
  • the chip temperature drops below the first preset threshold due to changes in chip workload or changes in ambient temperature At this time, it is necessary to turn off the cooling fins and only use the air-cooled device to dissipate the chips to avoid excessive heat dissipation and waste power consumption.
  • this embodiment uses multiple sensors built into the chip to obtain the real-time internal working temperature of the chip, which is more accurate to obtain the real-time internal working temperature of the chip. Determine how to perform temperature control on the chip according to whether the internal real-time operating temperature reaches the first preset threshold.
  • the air-cooled device is used to control the temperature of the chip; when the real-time temperature reaches the first preset threshold, the air-cooled device and the cooling chip are used to control the temperature of the chip at the same time.
  • the cooling fin can reduce the chip temperature to below the ambient temperature, so as to ensure that the chip can work at a stable and reliable temperature; in addition, since the chip first contacts the cooling fin instead of directly contacting the heat sink, it can make The temperature of the heat sink is higher without affecting the body temperature of the chip, so that the rotation speed of the communication subrack fan can be reduced, thereby reducing the noise of the entire device.
  • the second embodiment of the present application relates to a temperature control method.
  • This embodiment is substantially the same as the first embodiment of the present application, except that the two steps of step 303 and step 304 are specifically limited in this embodiment.
  • Step 401 Obtain the real-time internal working temperature of the chip.
  • Step 402 determine whether the internal real-time operating temperature of the chip reaches the first preset threshold; if the internal real-time operating temperature of the chip does not reach the first preset threshold, perform step 4031; if the internal real-time operating temperature of the chip reaches the first preset Threshold, step 4042 is executed.
  • Step 401 and step 402 are similar to step 301 and step 302 in the first embodiment of the present application, and the relevant implementation details have been specifically described in the first embodiment of the present application, and will not be repeated here.
  • Step 4031 Convert the temperature signal to a current signal to adjust the air-cooling control parameters
  • Step 4041 Convert the temperature signal to a current signal and a voltage signal to adjust the air-cooling control parameters and electric-cooling control parameters, respectively.
  • the air cooling device in this embodiment is specifically a DC fan, and the cooling fins are semiconductor cooling fins.
  • the air-cooling control parameter corresponding to the DC fan is the fan speed, and the DC fan is driven by a DC signal, and the magnitude of the current is positively related to the fan speed;
  • the electric cooling control parameter corresponding to the semiconductor refrigeration chip is the access power, semiconductor refrigeration
  • the chip is driven by a voltage signal, and the magnitude of the voltage is positively related to the cooling capacity of the semiconductor cooling chip.
  • the temperature signal obtained from the temperature sensor is converted into a current signal, the DC fan is driven, and the air cooling control parameter is adjusted.
  • the temperature signal obtained from the temperature sensor is converted into a current signal and a voltage signal to drive the DC fan and the semiconductor refrigeration chip.
  • Step 4032 perform temperature control on the chip according to the air-cooling control parameters
  • step 4042 perform temperature control on the chip according to the air-cooling control parameters and the electric cooling control parameters respectively.
  • different air cooling control parameters control the air cooling device to produce different heat dissipation capabilities
  • different electric cooling control parameters control the cooling fins to produce different heat dissipation capabilities. Adjusting the air-cooling control parameters, that is, adjusting the speed of the DC fan, so that the DC fan provides different heat dissipation capabilities at different temperatures. Adjust the electric cooling control parameters, that is, adjust the access power of the semiconductor refrigeration fins, so that the semiconductor refrigeration fins provide different heat dissipation capabilities at different temperatures.
  • the temperature control of the chip by the air-cooling device includes: determining the air-cooling control parameter according to the real-time internal working temperature of the chip; controlling the temperature of the chip according to the air-cooling control parameter; using the air-cooling device and The cooling chip performs temperature control on the chip, including: determining the air cooling control parameter and the electric cooling control parameter according to the working temperature of the chip; and controlling the temperature of the chip according to the air cooling control parameter and the electric cooling control parameter.
  • Different control parameters are determined according to the internal real-time working temperature of the chip to control the air-cooled device and the refrigeration fins to achieve precise control of the working temperature of the chip.
  • the third embodiment of the present application is similar to the second embodiment of the present application. The difference is that when the internal real-time operating temperature of the chip reaches the second preset threshold, the air-cooling control parameters and the electric-cooling control parameters are performed Adjust to perform temperature control on the chip with a greater cooling intensity, wherein the second preset threshold is greater than the first preset threshold.
  • Step 501 Obtain the real-time working temperature of the chip.
  • Step 501 is similar to step 301 in the first embodiment of the present application, and the relevant implementation details have been specifically described in the first embodiment of the present application, and will not be repeated here.
  • Step 502 determine whether the real-time operating temperature of the chip reaches the second preset threshold; if the real-time operating temperature of the chip reaches the second preset threshold, perform step 504 to determine whether the real-time operating temperature of the chip reaches the first preset threshold; if If the real-time operating temperature of the chip does not reach the second preset threshold, step 503 is executed to perform temperature control on the chip with the first cooling intensity according to the first air cooling parameter.
  • Step 504 Determine whether the real-time operating temperature of the chip reaches the first preset threshold; if the real-time operating temperature of the chip does not reach the first preset threshold, step 505 is executed, and the chip is performed with the second cooling intensity according to the second air-cooling parameter. Temperature control; if the real-time operating temperature of the chip reaches the first preset threshold, step 506 is executed to perform temperature control on the chip according to the air cooling control parameter and the electric cooling control parameter.
  • the first preset threshold is greater than the second preset threshold.
  • a higher cooling intensity is required to control the temperature of the chip.
  • the first air-cooling control parameter is used to control the air-cooling device to control the temperature of the chip, and the cooling intensity at this time is the first cooling intensity;
  • the second air-cooling control parameter is used to perform temperature control on the chip.
  • the real-time work of the chip When the real-time work of the chip is at a high temperature, it means that the current load of the chip is high or the ambient temperature is high. In this case, the working temperature of the chip is maintained within a temperature range that can operate stably, and a higher temperature is required.
  • the cooling intensity of the chip to ensure that the temperature of the chip does not increase or decrease to a temperature range for stable operation. Therefore, in different temperature intervals, the determined air-cooling control parameters and electric-cooling control parameters are also different, so that the air-cooling device and the electric-cooling device provide different cooling intensities in different temperature intervals. Among them, the higher the speed of the DC fan, the higher the cooling intensity provided; the greater the power of the semiconductor refrigeration chip, the higher the cooling intensity provided.
  • the first preset threshold is a temperature close to the maximum temperature at which the chip can work normally.
  • the heat dissipation system is required to maximize The heat dissipation capacity of the chip is used to control the temperature of the chip.
  • the air-cooling device and the cooling plate are used to dissipate the chip to ensure that the internal real-time working temperature of the chip does not increase, and the chip temperature is not too high.
  • the heat is transferred to other core components around and affects the stability of the entire device.
  • the first preset threshold is 80 degrees Celsius
  • the second preset threshold is 60 degrees Celsius.
  • the DC fan is controlled to run at a parameter of 2500 revolutions per minute; when the chip's internal real-time operating temperature is greater than 60 degrees Celsius but less than 80 degrees Celsius, the DC fan is controlled to 5000 revolutions The parameter runs every minute; when the real-time working temperature inside the chip is greater than or equal to 80 degrees Celsius, the semiconductor refrigeration film is activated, and the DC fan and the semiconductor refrigeration film are controlled to control the temperature of the chip at the same time.
  • more preset thresholds may be set in advance to divide the operating temperature range of the chip more finely, and at the same time provide a corresponding number of air-cooling control parameters.
  • determining the air-cooling control parameter according to the internal real-time operating temperature of the chip includes: if the internal real-time operating temperature of the chip does not reach the second preset threshold, temperature the chip according to the first air-cooling control parameter Control; if the internal real-time operating temperature of the chip reaches the second preset threshold but does not reach the first preset threshold, the chip is temperature controlled according to the second air-cooling control parameter; wherein the second preset threshold is less than the first preset Threshold; the cooling intensity corresponding to the second air-cooling control parameter is greater than the cooling intensity corresponding to the first air-cooling control parameter.
  • the air-cooled device When the internal working temperature of the chip is low, the air-cooled device is used to control the temperature of the chip with a lower cooling intensity, and when the working temperature is high, the air-cooled device is used to control the temperature of the chip with a higher cooling intensity . So as to realize the precise control of the internal working temperature of the chip, while avoiding waste of energy consumption.
  • the fourth embodiment of the present application relates to a temperature control system, as shown in FIG. 6, including:
  • the memory 606 stores instructions that can be executed by the at least one processor 605, and the instructions are executed by the at least one processor 605, so that the at least one processor 605 can execute the temperature control methods in the first embodiment to the third embodiment.
  • the cooling plate 602 is used to control the temperature of the chip 601 according to the electric cooling control parameter.
  • the high temperature end of the cooling fin is connected to the chip, and the low temperature end is connected to one end of the heat sink.
  • the heat sink 603 is used to transfer the heat of the cooling fin 602 to the air.
  • the air-cooling device 604 is used to dissipate heat from the heat sink 603 and accelerate the speed at which the heat sink transfers the heat of the cooling fin to the air.
  • the refrigeration fin is specifically a peltier
  • the electric cooling control parameter is the power of the peltier
  • the power of the peltier is positively correlated with the cooling intensity of the pelmet.
  • the electric cooling control parameters are determined according to the internal real-time operating temperature of the chip.
  • the semiconductor refrigeration chip does not work; if the internal real-time operating temperature of the chip is greater than the first preset threshold and If the temperature is less than or equal to the second preset threshold, the semiconductor refrigeration chip works with the first electric cooling parameter; if the real-time internal operating temperature of the chip is greater than the second preset threshold, the semiconductor refrigeration chip works with the second electric cooling parameter; The second electric cooling parameter is greater than the first electric cooling parameter, and the cooling intensity of the semiconductor refrigeration fin when operating with the second electric cooling parameter is greater than the cooling intensity when the semiconductor cooling fin is operated with the first electric cooling parameter.
  • the air-cooling device is specifically a DC fan
  • the air-cooling control parameter is the speed of the DC fan
  • the connected power is positively correlated with the cooling intensity of the DC fan.
  • the air-cooling control parameters are determined according to the internal real-time operating temperature of the chip. If the internal real-time operating temperature of the chip is greater than the first preset threshold and less than or equal to the second preset threshold, the DC fan operates with the first air-cooling parameter; If the internal real-time operating temperature is greater than the second preset threshold, the DC fan will work at the second air-cooling parameter; where the second air-cooling parameter is greater than the first air-cooling parameter, and the DC fan will have a greater cooling intensity when operating at the second air-cooling parameter. The cooling intensity when the DC fan is running at the first air-cooling parameter.
  • the chip 601 also has N temperature sensors built in; where N is a natural number greater than 1.
  • the N temperature sensors are all connected to the processor 605 and the memory 606 in communication.
  • the memory 602 and the processor 601 are connected in a bus manner.
  • the bus may include any number of interconnected buses and bridges, and the bus connects one or more various circuits of the processor 601 and the memory 602 together.
  • the bus can also connect various other circuits such as peripheral devices, voltage regulators, and power management circuits, etc., which are all known in the art, and therefore, no further description will be given herein.
  • the bus interface provides an interface between the bus and the transceiver.
  • the transceiver may be one element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices on the transmission medium.
  • the data processed by the processor 601 is transmitted on the wireless medium through the antenna, and further, the antenna also receives the data and transmits the data to the processor 601.
  • the processor 601 is responsible for managing the bus and general processing, and can also provide various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions.
  • the memory 602 may be used to store
  • N sensors are built in the chip; where N is a natural number greater than 1; obtaining the working temperature of the chip includes: obtaining N temperature signals through N sensors; As the operating temperature of the chip. By reading the temperature signals of multiple sensors to select the highest temperature, the obtained operating temperature can be more representative, and the control of the chip's operating temperature can be more accurate, and it can better ensure that the chip is at a stable and reliable temperature. run.
  • this embodiment is an example of a system implemented in cooperation with the temperature control methods in the first embodiment to the third embodiment of the present application. Since the first to third embodiments are implemented in cooperation with this embodiment, the related technical details mentioned in the first to third embodiments are still valid in this embodiment. The technical effects that can be achieved in the third embodiment can also be achieved in this embodiment. In order to reduce repetition, details are not repeated here. Correspondingly, the related technical details mentioned in this embodiment can also be applied to the first embodiment to the third embodiment.
  • modules involved in this embodiment are all logical modules.
  • a logical unit can be a physical unit, a part of a physical unit, or multiple physical units. The combination of units is realized.
  • this embodiment does not introduce units that are not closely related to solving the technical problems proposed by this application, but this does not mean that there are no other units in this embodiment.
  • the fifth embodiment of the present application relates to a computer-readable storage medium that stores a computer program.
  • the computer-readable storage medium includes a transitory computer-readable storage medium and a non-transitory computer-readable storage medium.
  • the program is stored in a storage medium and includes several instructions to enable a device ( It may be a single-chip microcomputer, a chip, etc.) or a processor (processor) that executes all or part of the steps of the methods described in the embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes. .
  • the chip is connected to the low temperature end of the cooling fin, the high temperature end of the cooling fin is connected to one end of the heat sink, and the other end of the heat sink is connected to the air cooling device.
  • the working temperature determines how to control the temperature of the chip according to whether the internal real-time working temperature reaches the first preset threshold. Directly detect the working temperature inside the chip, avoid the influence of ambient temperature, and control the chip temperature more accurately.
  • the air-cooled device When the internal real-time operating temperature does not reach the first preset threshold, because the temperature of the chip is relatively low, the demand for heat dissipation is relatively low, so only the air-cooled device is used to dissipate the heat sink to realize the temperature control of the chip; When the internal real-time working temperature reaches the first preset threshold, the air-cooled device and the cooling plate are used to control the temperature of the chip.
  • the chip is connected to the cooling plate. Due to the low temperature of the cooling end of the cooling plate, the heat of the chip can be quickly transferred to the cooling system.
  • the cooling chip transfers the heat to the heat sink, and the heat sink is dissipated through the air-cooling device to increase the heat dissipation and heat dissipation efficiency of the chip, and ensure that the temperature of the chip no longer rises.
  • the chip maintains a reliable and stable working condition.

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  • General Physics & Mathematics (AREA)
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Abstract

本申请公开了一种温度控制方法、***以及存储介质。所述温度控制***包括：芯片、制冷片、散热片以及风冷装置，芯片与制冷片的低温端连接，制冷片的高温端与散热片的一端连接，散热片的另一端与风冷装置连接；通过获取芯片的内部实时工作温度；若芯片的内部实时工作温度小于第一预设阈值，则通过风冷装置对芯片进行温度控制；若芯片的内部实时工作温度大于等于第一预设阈值，则通过制冷片和风冷装置对芯片进行温度控制。

Description

温度控制方法、***及存储介质
相关申请的交叉引用
本申请基于申请号为201911355930.8、申请日为2019年12月25日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此以引入方式并入本申请。
技术领域
本申请实施例涉及通信技术领域，特别涉及一种温度控制方法、***及存储介质。
背景技术
随着互联网业务以及5G通信的不断发展，大容量，高带宽的通信设备不断涌现，随之而来的设备的热耗不断增加，而通信业务芯片的功耗也不断增大，散热问题越来越凸显。目前光纤通信行业的设备，通常以硬件单板的形式在机架中安装运行，采用的主要散热方式是在大功率器件表面加装散热片、风扇进行风冷散热。
然而采用风扇、散热片等进行散热，主要依靠散热片与空气之间的热交换，很大程度上受到环境温度的影响，无法提供芯片稳定的最佳工作温度；此外，机架内的热量无法及时散出，导致环境温度升高，此时散热片和风扇的散热效果较差，无法散出的热量会提高器件本体温度，使得热量通过芯片本体和引脚传递到PCB板，影响其他***核心器件。
发明内容
本申请部分实施例提供了一种温度控制方法，应用于温度控制***，温度控制***包括：芯片、制冷片、散热片以及风冷装置，芯片与制冷片的低温端连接，制冷片的高温端与散热片的一端连接，所述风冷装置用于对所述散热片进行散热。所述方法包括：获取芯片的内部实时工作温度；若芯片的内部实时工作温度小于第一预设阈值，则通过风冷装置对芯片进行温度控制；若芯片的内部实时工作温度大于等于第一预设阈值，则通过制冷片和风冷装置对芯片进行温度控制。
本申请部分实施例还提供了一种温度控制***，包括：芯片、制冷片、散热片和风冷装 置；芯片与制冷片的低温端连接，制冷片的高温端与散热片的一端连接，所述风冷装置用于对所述散热片进行散热；温度控制***还包括：与芯片、制冷片以及风冷装置通信连接的至少一个处理器以及与至少一个处理器通信连接的存储器；其中，存储器存储有可被至少一个处理器执行的指令，指令被至少一个处理器执行，以使处理器能够执行如上述的温度控制方法。
本申请部分实施例还提供了一种计算机可读存储介质，存储有计算机程序，计算机程序被处理器执行时实现如上述的温度控制方法。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定。
图1是根据本申请第一实施方式中温度控制***的结构示意图的正视图；
图2是根据本申请第一实施方式中温度控制***的结构示意图的俯视图；
图3是根据本申请第一实施方式中温度控制方法的流程图；
图4是根据本申请第二实施方式中温度控制方法的流程图；
图5是根据本申请第三实施方式中温度控制方法的流程图；
图6是根据本申请第四实施方式中温度控制***的结构示意图。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请的各实施方式进行详细的阐述。然而，本领域的普通技术人员可以理解，在本申请各实施方式中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以下各实施方式的种种变化和修改，也可以实现本申请所要求保护的技术方案。以下各个实施例的划分是为了描述方便，不应对本申请的具体实现方式构成任何限定，各个实施例在不矛盾的前提下可以相互结合相互引用。
本申请部分实施例的目的在于提供一种温度控制方法、***及存储介质，使得芯片的散热效率得到提高，避免芯片器件本体的温度过高，进而避免了通过PCB板对其他***核心器件的影响；并且可以精确控制芯片的工作温度，从而使得芯片能够更加稳定、可靠地运行。
本申请的第一实施方式涉及一种温度控制方法，应用于温度控制***，温度控制***包括：芯片、制冷片、散热片以及风冷装置，芯片与制冷片的低温端连接，制冷片的高温端与散热片的一端连接，风冷装置用于对所述散热片进行散热。所述方法包括：获取芯片的内部实时工作温度；若芯片的内部实时工作温度未到达第一预设阈值，则通过风冷装置对芯片进行温度控制；若芯片的内部实时工作温度达到第一预设阈值，则通过制冷片和风冷装置对芯片进行温度控制。本实施方式以制冷片为半导体制冷片，风冷装置为直流风扇为例进行说明。
下面对本实施方式的温度控制方法的实现细节进行具体的说明，以下内容仅为方便理解提供的实现细节，并非实施本方案的必须。
本实施方式中的温度控制***如图1和图2所示，其中图1为正视图、图2为俯视图，本实施方式中的温度控制***包括：散热片1、半导体制冷片2、芯片3和作为风冷装置的直流风扇9，直流风扇9的出风方向面对散热片1。其中，半导体制冷片2具有热端5与冷端6；芯片3，安装于印制电路PCB板4上。
具体地，散热片1的基底面与半导体制冷片2的热端5贴合，用于将半导体制冷片2的热端5的热量传导至空气中；半导体制冷片2的冷端6与芯片3远离PCB板4的表面贴合；半导体制冷片通过电源线7与PCB板4上的插座8连接，由PCB板4通过插座8和电源线7为半导体制冷片2进行供电。
本实施方式中的温度控制方法应用于如上述的温度控制***，如图3所示，包括：
步骤301，获取芯片的内部实时工作温度。
在一些实施例中，在芯片运行的过程中，对芯片的工作温度进行实时检测，获取芯片的内部实时工作温度。芯片的内部实时工作温度通过在读取芯片内置的传感器的温度信号得到，芯片内置有N个温度传感器，其中N为大于1的自然数，温度传感器的种类包括：热电阻式温度传感器以及热敏式温度传感器；本实施方式中不对温度传感器的种类作限制。芯片内置的N个传感器会分布在芯片内部的不同位置，每一个传感器均会产生一个温度信号，芯片的结构差异会导致各个传感器产生的温度信号中所记录的温度有多个不同的值。取用各个温度信号中，温度值最高的温度作为芯片的工作温度，可以更加安全地对芯片进行温度控制，不会出现局部温度过高的情况。
步骤302，判断芯片的内部实时工作温度是否达到第一预设阈值；若芯片的内部实时工作温度未到达第一预设阈值，则执行步骤303，通过风冷装置对芯片进行温度控制；若芯片的内部实时工作温度达到第一预设阈值，则执行步骤304，通过制冷片和风冷装置对芯片进行温度控制。换言之，通过风冷装置和制冷片对芯片进行温度控制后，还包括：当芯片的工 作温度降低至第一预设阈值以下，控制制冷片停止工作。当芯片温度工作低于第一预设门限时，仅通过风冷装置就能保证芯片温度不再升高，因此控制制冷片停止工作，降低温度控制所消耗的功率。
在一些实施例中，第一预设阈值根据预先的测试和试验来选定，当风冷装置在最大散热能力下能够保证的芯片的工作温度被设为第一预设阈值，在第一预设阈值的温度以下时，芯片产生的热量通过散热片传导至空气中，由直流风扇将高温空气带走，散热片的散热量与芯片产热量相同，因此在芯片的工作温度未达到第一预设阈值时，通过风冷装置来对芯片进行温度控制，能够保持芯片处于稳定、可靠的工作温度下；当芯片的工作温度达到第一预设阈值时，意味着风冷装置的散热能力已经不足以维持芯片在稳定可靠的温度下运行，此时需要同时使用制冷片以及风冷装置来对芯片进行温度控制，制冷片开始工作后，冷端的低温能够快速吸收芯片的热量，避免芯片本体温度过高将热量通过PCB使周边元器件的温度升高，而热端通过散热片将热量通过散热片传导至空气中，由直流风扇将高温空气带走，从而提高保证芯片在稳定、可靠地温度下工作。
在步骤303或步骤304后，回到步骤301，获取芯片的内部实时工作温度。由于芯片工作负载发生变化或环境温度发生变化时，都会使得芯片的工作温度发生变化。因此需要实时地对芯片的工作温度进行检测，判断当前芯片的工作温度是否达到第一预设阈值，根据芯片的工作温度来对温度控制的方式进行调整。如果当前仅采用风冷装置对芯片进行散热，由于芯片工作负载发生变化或环境温度发生变化使得芯片温度升高至第一预设阈值以上时，需要启动制冷片，从而同时使用制冷片以及风冷装置来对芯片进行散热；而如果当前处于同时使用制冷片以及风冷装置来对芯片进行散热的模式下，由于芯片工作负载发生变化或环境温度发生变化使得芯片温度降低至第一预设阈值以下时，则需要关闭制冷片，仅通过风冷装置来对芯片进行散热，避免过度散热，造成功耗浪费。
与现有技术相比，本实施方式通过芯片内置的多个传感器来获取芯片的内部实时工作温度，更够更加精确地的得到芯片的内部实时工作温度。根据内部实时工作温度是否达到第一预设阈值来确定如何对芯片进行温度控制。在实时温度未达到第一预设阈值时，使用风冷装置对芯片进行温度控制；在实时温度达到第一预设阈值时，同时使用风冷装置和制冷片来对芯片进行温度控制，当环境温度较高时，制冷片可以将芯片温度降低至环境温度以下，从而保证芯片能够在稳定且可靠的温度下工作；此外，由于芯片首先与制冷片接触，而不与散热片直接接触，可以使散热片的温度更高而不影响芯片的本体温度，从而可以降低通信子架风扇的转速，进而降低整个设备的噪音。
本申请的第二实施方式涉及一种温度控制方法，本实施方式与本申请第一实施方式大致相同，区别在于：本实施方式中对步骤303和步骤304这两个步骤进行了具体限定。
下面以风冷装置为直流风扇、电冷装置为半导体制冷片为例，对本实施方式的温度控制方法的实现细节进行具体的说明，如图4所示，包括：
步骤401，获取芯片的内部实时工作温度。
步骤402，判断芯片的内部实时工作温度是否达到第一预设阈值；若芯片的内部实时工作温度未到达第一预设阈值，则执行步骤4031；若芯片的内部实时工作温度达到第一预设阈值，则执行步骤4042。
步骤401和步骤402与本申请第一实施方式中的步骤301和步骤302类似，相关的实施细节已在本申请第一实施方式中进了具体说明，在此不再赘述。
步骤4031，将温度信号转换为电流信号调整风冷控制参数；步骤4041，将温度信号分别转换为电流信号和电压信号调整风冷控制参数和电冷控制参数。
在一些实施例中，本实施方式中的风冷装置具体为直流风扇、制冷片为半导体制冷片。其中直流风扇所对应的风冷控制参数为风扇转速，直流风扇通过直流电信号来进行驱动，电流的大小与风扇的转速正相关；半导体制冷片所对应的电冷控制参数为接入功率，半导体制冷片通过电压信号来进行驱动，电压的大小与半导体制冷片的制冷能力正相关。当芯片的工作温度未达到第一预设阈值时，将从温度传感器获取到的温度信号转换为电流信号，对直流风扇进行驱动，调整风冷控制参数。类似地，当芯片的工作温度达到第一预设阈值时，将从温度传感器获取到的温度信号转换为电流信号和电压信号，对直流风扇和半导体制冷片进行驱动，
步骤4032，根据风冷控制参数对芯片进行温度控制；步骤4042，分别根据风冷控制参数以及电冷控制参数对芯片进行温度控制。
在一些实施例中，不同的风冷控制参数会控制风冷装置产生不同的散热能力，不同的电冷控制参数会控制制冷片产生不同的散热能力。调整风冷控制参数，也就是调整直流风扇的转速，从而使直流风扇在不同温度下提供不同的散热能力。调整电冷控制参数，也就是调整半导体制冷片的接入功率，从而使半导体制冷片在不同温度下提供不同的散热能力。
换言之，在一些实施例中，通过风冷装置对芯片进行温度控制，包括：根据芯片的内部实时工作温度确定风冷控制参数；根据风冷控制参数，对芯片进行温度控制；通过风冷装置和制冷片对芯片进行温度控制，包括：根据芯片的工作温度确定风冷控制参数以及电冷控制参数；根据风冷控制参数以及电冷控制参数，对芯片进行温度控制。根据芯片的内部实时工 作温度确定不同的控制参数对风冷装置以及制冷片进行控制，实现对芯片工作温度的精确控制。
上面各种方法的步骤划分，只是为了描述清楚，实现时可以合并为一个步骤或者对某些步骤进行拆分，分解为多个步骤，只要包括相同的逻辑关系，都在本专利的保护范围内；对算法中或者流程中添加无关紧要的修改或者引入无关紧要的设计，但不改变其算法和流程的核心设计都在该专利的保护范围内。
本申请的第三实施方式与本申请的第二实施方式类似，区别之处在于：当芯片的内部实时工作温度达到第二预设阈值的情况下，对风冷控制参数和电冷控制参数进行调整，以更大的降温强度对芯片进行温度控制，其中，第二预设阈值大于第一预设阈值。
下面结合附图对本申请的第三实施方式中的一种温度控制方法进行说明，如图5所示，包括：
步骤501，获取芯片的实时工作温度。
步骤501与本申请第一实施方式中的步骤301类似，相关的实施细节已在本申请第一实施方式中进行了具体说明，在此不再赘述。
步骤502，判断芯片的实时工作温度是否达到第二预设阈值；若芯片的实时工作温度达到第二预设阈值，则执行步骤504，判断芯片的实时工作温度是否达到第一预设阈值；若芯片的实时工作温度未达到第二预设阈值，则执行步骤503，根据第一风冷参数以第一降温强度对芯片进行温度控制。
步骤504，判断芯片的实时工作温度是否达到第一预设阈值；若芯片的实时工作温度未达到第一预设阈值，则执行步骤505，根据第二风冷参数以第二降温强度对芯片进行温度控制；若芯片的实时工作温度达到第一预设阈值，则执行步骤506，根据风冷控制参数以及电冷控制参数对芯片进行温度控制。
在一些实施例中，第一预设阈值大于第二预设阈值。当芯片的内部实时工作温度越高时，则需要更高的降温强度来对芯片进行温度控制。在芯片的内部实时工作温度未达到第二预设阈值的情况下，则以第一风冷控制参数控制风冷装置对芯片进行温度控制，此时的降温强度为第一降温强度；当芯片的内部实时工作温度达到第二预设阈值但未达到第一预设阈值时，则以第二风冷控制参数对芯片进行温度控制。
当芯片的实时工作处于较高温度时，表示芯片当前的负载较高或是环境温度较高，在这种情况下，将芯片的工作温度维持在能够稳定运行的温度区间内，需要提供更高的降温强度 来保证芯片的温度不再升高或是降低至稳定运行的温度区间内。因此在不同的温度区间中，所确定的风冷控制参数与电冷控制参数也不同，从而使风冷装置和电冷装置在不同的温度区间中提供不同的降温强度。其中，直流风扇转速越高，所提供的降温强度越高；半导体制冷片的接入功率越大，所提供的降温强度越高。
进一步说，第一预设阈值为接近芯片能够正常工作的最高温度的温度值，当芯片的内部实时工作温度达到第一阈值时，意味着芯片的工作温度以及极高，因此需要散热***以最大的散热能力来对芯片进行温度控制，此时同时使用风冷装置和制冷片对芯片进行散热，保证芯片的内部实时工作温度不再升高，避免芯片温度过高，通过引脚及PCB板将热量传递到周围其他的核心部件，影响整个设备的稳定性。
在一个例子中，假定第一预设阈值为80摄氏度，第二预设阈值为60摄氏度。当芯片的内部实时工作温度在60摄氏度及60摄氏度以下时，控制直流风扇以2500转每分钟的参数运行；当芯片的内部实时工作温度大于60摄氏度但小于80摄氏度时，控制直流风扇以5000转每分钟的参数运行；当芯片内部实时工作温度大于或等于80摄氏度时，启动半导体制冷片，同时控制直流风扇和半导体制冷片对芯片进行温度控制。
此外，本实施方式中，还可以预先设置更多的预设阈值，将芯片的工作温度的区间进行更加精细的划分，同时也提供相应数量的风冷控制参数。每两个相邻的预设阈值之间相差的温度值越小，则意味着工作温度的区间数量越多，可以更加精确地实现对芯片工作温度的控制，更好地保证芯片在稳定、可靠的温度下工作。
换言之，在一些实施例中，根据芯片的内部实时工作温度确定风冷控制参数，包括：若芯片的内部实时工作温度未达到第二预设阈值，则根据第一风冷控制参数对芯片进行温度控制；若芯片的内部实时工作温度达到第二预设阈值但未达到第一预设阈值，则根据第二风冷控制参数对芯片进行温度控制；其中，第二预设阈值小于第一预设阈值；第二风冷控制参数对应的降温强度，大于第一风冷控制参数对应的降温强度。在芯片内部工作温度较低时，通过风冷装置以较低的降温强度来对芯片进行温度控制，而在工作温度较高时，通过风冷装置以较高的降温强度来对芯片进行温度控制。从而实现对芯片内部工作温度的精确控制，同时避免能耗浪费。
本申请第四实施方式涉及一种温度控制***，如图6所示，包括：
芯片601、制冷片602、散热片603、风冷装置604以及与芯片601、制冷片602以及风冷装置通信连接的至少一个处理器605以及与至少一个处理器605通信连接的存储器606，其中，存储器606存储有可被至少一个处理器605执行的指令，指令被至少一个处理器605 执行，以使至少一个处理器605能够执行第一实施方式至第三实施方式中的温度控制方法。
具体地，制冷片602，用于根据电冷控制参数来对芯片601进行温度控制。制冷片的高温端与芯片连接，低温端与散热片一端连接。
散热片603，用于将制冷片602的热量传导至空气中。
风冷装置604，用于对所述散热片603进行散热，加快所述散热片将制冷片的热量传导至空气中的速度。
在一个例子中，制冷片具体为半导体制冷片，电冷控制参数为半导体制冷片的接入功率，接入功率与半导体制冷片的降温强度正相关。电冷控制参数根据芯片的内部实时工作温度确定，若芯片的内部实时工作温度小于或等于第一预设阈值，则半导体制冷片不工作；若芯片的内部实时工作温度大于第一预设阈值且小于或等于第二预设阈值，则半导体制冷片以第一电冷参数工作；若芯片的内部实时工作温度大于第二预设阈值，则半导体制冷片以第二电冷参数工作；其中，第二电冷参数大于第一电冷参数，半导体制冷片以第二电冷参数运行时的降温强度大于半导体制冷片以第一电冷参数运行时的降温强度。
在一个例子中，风冷装置具体为直流风扇，风冷控制参数为直流风扇的转速，接入功率与直流风扇的降温强度正相关。风冷控制参数根据芯片的内部实时工作温度确定，若芯片的内部实时工作温度大于第一预设阈值且小于或等于第二预设阈值，则直流风扇以第一风冷参数工作；若芯片的内部实时工作温度大于第二预设阈值，则直流风扇以第二风冷参数工作；其中，第二风冷参数大于第一风冷参数，直流风扇以第二风冷参数运行时的降温强度大于直流风扇以第一风冷参数运行时的降温强度。
在一个例子中，芯片601还内置有N个温度传感器；其中，N为大于1的自然数。N个温度传感器均与处理器605以及存储器606通信连接。
其中，存储器602和处理器601采用总线方式连接，总线可以包括任意数量的互联的总线和桥，总线将一个或多个处理器601和存储器602的各种电路连接在一起。总线还可以将诸如***设备、稳压器和功率管理电路等之类的各种其他电路连接在一起，这些都是本领域所公知的，因此，本文不再对其进行进一步描述。总线接口在总线和收发机之间提供接口。收发机可以是一个元件，也可以是多个元件，比如多个接收器和发送器，提供用于在传输介质上与各种其他装置通信的单元。经处理器601处理的数据通过天线在无线介质上进行传输，进一步，天线还接收数据并将数据传送给处理器601。处理器601负责管理总线和通常的处理，还可以提供各种功能，包括定时，***接口，电压调节、电源管理以及其他控制功能。而存储器602可以被用于存储处理器601在执行操作时所使用的数据。
换言之，在一些实施例中，芯片内置N个传感器；其中，N为大于1的自然数；获取芯片的工作温度，包括：通过N个传感器获取N个温度信号；将N个温度信号中的最高温度作为芯片的工作温度。通过对多个传感器温度信号的读取，从而选取最高温度，能够使获取到的工作温度更具有代表性，对芯片工作温度的控制能够更加精确，更好地保证芯片在稳定、可靠地温度下运行。
不难发现，本实施方式为与本申请第一实施方式至第三实施方式中温度控制方法配合实施的***实施例。由于第一实施方式至第三实施方式与本实施方式相互配合实施，因此第一实施方式至第三实施方式中提到的相关技术细节在本实施方式中依然有效，在第一实施方式至第三实施方式中所能达到的技术效果在本实施方式中也同样可以实现，为了减少重复，这里不再赘述。相应地，本实施方式中提到的相关技术细节也可应用在第一实施方式至第三实施方式中。
值得一提的是，本实施方式中所涉及到的各模块均为逻辑模块，在实际应用中，一个逻辑单元可以是一个物理单元，也可以是一个物理单元的一部分，还可以以多个物理单元的组合实现。此外，为了突出本申请的创新部分，本实施方式中并没有将与解决本申请所提出的技术问题关系不太密切的单元引入，但这并不表明本实施方式中不存在其它的单元。
本申请第五实施方式涉及一种计算机可读存储介质，存储有计算机程序。计算机程序被处理器执行时实现上述方法实施例。所述计算机可读存储介质包括暂时性计算机可读存储介质和非暂时性计算机可读存储介质。
即，本领域技术人员可以理解，实现上述实施例方法中的全部或部分步骤是可以通过程序来指令相关的硬件来完成，该程序存储在一个存储介质中，包括若干指令用以使得一个设备(可以是单片机，芯片等)或处理器(processor)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
综上，在本申请的部分实施例中，芯片与制冷片的低温端连接，制冷片的高温端与散热片的一端连接，散热片的另一端与风冷装置连接，通过获取芯片的内部实时工作温度，根据内部实时工作温度是否达到第一预设阈值来确定如何对芯片进行温度控制。直接检测芯片内部的工作温度，避免环境温度的影响，能够更加精确地对芯片温度进行控制。在内部实时工作温度未达到第一预设阈值时，由于芯片的温度较低，对散热需求相对较低，因此仅使用风 冷装置来对散热片进行散热，实现对芯片进行温度控制；在芯片的内部实时工作温度达到第一预设阈值时，同时使用风冷装置和制冷片来对芯片进行温度控制，芯片与制冷片相连，由于制冷片制冷端温度低，芯片的热量能够快速传递至制冷片，保证芯片温度不会过高，然后制冷片再将热量传递至散热片，通过风冷装置对散热片进行散热，加大芯片的散热量和散热效率，保证芯片温度不再升高，使芯片保持可靠、稳定的工作状态。
本领域的普通技术人员可以理解，上述各实施方式是实现本申请的具体实施例，而在实际应用中，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。

Claims (10)

  1. 一种温度控制方法，其中，应用于温度控制***，所述温度控制***包括：芯片、制冷片、散热片以及风冷装置，所述芯片与所述制冷片的低温端连接，所述制冷片的高温端与所述散热片的一端连接，所述风冷装置用于对所述散热片进行散热；所述方法包括：
    获取所述芯片的内部实时工作温度；
    若所述芯片的内部实时工作温度未到达第一预设阈值，则通过所述风冷装置对所述芯片进行温度控制；
    若所述芯片的实时工作温度达到所述第一预设阈值，则通过所述制冷片和所述风冷装置对所述芯片进行温度控制。
  2. 根据权利要求1所述的温度控制方法，其中，在所述通过风冷装置和制冷片对所述芯片进行温度控制后，还包括：
    当所述芯片的实时工作温度降低至所述第一预设阈值以下，控制所述制冷片停止工作。
  3. 根据权利要求1所述的温度控制方法，其中，
    所述通过所述风冷装置对所述芯片进行温度控制，包括：
    根据所述芯片的内部实时工作温度确定风冷控制参数；
    根据所述风冷控制参数，对所述芯片进行温度控制；
    所述通过所述风冷装置和所述制冷片对所述芯片进行温度控制，包括：
    根据所述芯片的内部实时工作温度确定所述风冷控制参数以及电冷控制参数；
    根据所述风冷控制参数以及所述电冷控制参数，对所述芯片进行温度控制。
  4. 根据权利要求3所述的温度控制方法，其中，所述风冷装置为直流风扇，所述风冷控制参数包括：风扇转速；
    所述制冷片为半导体制冷片，所述电冷控制参数包括：半导体接入功率。
  5. 根据权利要求3所述的温度控制方法，其中，所述根据所述芯片的内部实时工作温度确定风冷控制参数，包括：
    若所述芯片的内部实时工作温度未达到第二预设阈值，则根据第一风冷控制参数对所述芯片进行温度控制；若所述芯片的内部实时工作温度达到第二预设阈值但未达到第一预设阈 值，则根据第二风冷控制参数对所述芯片进行温度控制；
    其中，所述第二预设阈值小于所述第一预设阈值；所述第二风冷控制参数对应的降温强度，大于所述第一风冷控制参数对应的降温强度。
  6. 根据权利要求3所述的温度控制方法，其中，所述根据所述芯片的内部实时工作温度确定风冷控制参数，包括：
    将所述芯片的内部实时工作温度的温度信号转换为电压信号，并根据转换后的电压信号调整风冷控制参数；
    所述根据所述芯片的工作温度确定所述风冷控制参数以及电冷控制参数，包括：
    将所述芯片的内部实时工作温度的温度信号转换为电压信号，并根据转换后的电压信号调整风冷控制参数；
    将所述芯片的内部实时工作温度的温度信号转换为电流信号，并根据转换后的电流信号调整电冷控制参数。
  7. 根据权利要求1至5中任一项所述的温度控制方法，其中，所述芯片内置N个传感器；其中，N为大于1的自然数；所述获取芯片的内部实时工作温度，包括：
    通过所述N个传感器获取N个温度信号；
    将所述N个温度信号中的最高温度作为所述芯片的内部实时工作温度。
  8. 一种温度控制***，其中，包括：芯片、制冷片、散热片和风冷装置；所述芯片与所述制冷片的低温端连接，所述制冷片的高温端与所述散热片的一端连接，所述风冷装置用于对所述散热片进行散热；
    所述温度控制***还包括：与所述芯片、所述制冷片以及所述风冷装置通信连接的至少一个处理器以及与所述至少一个处理器通信连接的存储器；
    其中，所述存储器存储有可被所述至少一个处理器执行的指令，所述指令被所述至少一个处理器执行，以使所述处理器能够执行如权利要求1至7中任一项所述的温度控制方法。
  9. 根据权利要求8所述的温度控制***，其中，还包括：N个传感器；其中，
    所述N为大于1的自然数，所述N个传感器内置于所述芯片，用于检测所述芯片的内部实时工作温度。
  10. 一种计算机可读存储介质，存储有计算机程序，其中，所述计算机程序被处理器执行时实现如权利要求1至7中任一项所述的温度控制方法。
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