WO2021128300A1 - 预制基板以及印刷电路板 - Google Patents

预制基板以及印刷电路板 Download PDF

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Publication number
WO2021128300A1
WO2021128300A1 PCT/CN2019/129326 CN2019129326W WO2021128300A1 WO 2021128300 A1 WO2021128300 A1 WO 2021128300A1 CN 2019129326 W CN2019129326 W CN 2019129326W WO 2021128300 A1 WO2021128300 A1 WO 2021128300A1
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WO
WIPO (PCT)
Prior art keywords
gold
metal lead
electro
lead
printed circuit
Prior art date
Application number
PCT/CN2019/129326
Other languages
English (en)
French (fr)
Inventor
王栋梁
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to KR1020207032521A priority Critical patent/KR102391364B1/ko
Priority to JP2020568536A priority patent/JP2022518639A/ja
Priority to PCT/CN2019/129326 priority patent/WO2021128300A1/zh
Publication of WO2021128300A1 publication Critical patent/WO2021128300A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Definitions

  • This application relates to the technical field of printed circuit board manufacturing, in particular to a prefabricated substrate and a printed circuit board.
  • PCB board also known as printed circuit board, printed circuit board, or printed circuit board for short, uses an insulating board as the base material and cuts it into a certain size, with at least one conductive pattern attached to it, and holes (such as component holes, fastening Holes, metallized holes, etc.), and realize the interconnection between electronic components.
  • holes such as component holes, fastening Holes, metallized holes, etc.
  • the inventor of the present application found that because the electro-gold lead of the prefabricated substrate is thin and has good ductility, and the thickness of the solder resist ink layer is small during processing, the ink and electro-gold lead covering the lead The small bonding force, coupled with the huge pulling force generated during processing, can easily lead to problems such as burrs and warping of the leads, which seriously affect the quality of the product.
  • the main technical problem to be solved by this application is to provide a method for manufacturing an organic light-emitting display screen, which can realize the integration of touch and display, reduce the overall thickness, facilitate lightness and thinness, facilitate the detection of touch signals, and reduce the manufacturing process. Reduce production costs.
  • the prefabricated substrate includes: a substrate body, including a finished product area and a waste area surrounding the finished product area; at least one set of electro-gold units are arranged on the finished product area, wherein ,
  • Each group of electro-gold unit includes a plurality of electro-gold positions and a first metal lead, the first metal wire is arranged between the plurality of electro-gold positions, and is used to connect the plurality of electro-gold positions; at least one second metal lead, first The number of the two metal leads is equal to the number of the electro-gold unit, and the second metal lead corresponds to the electro-gold unit one-to-one, wherein the second metal lead is arranged on the substrate body and electrically connects the electro-gold unit and the waste area.
  • the present application provides a printed circuit board, the printed circuit board is obtained by secondary processing of a prefabricated substrate, the prefabricated substrate is the aforementioned prefabricated substrate;
  • the printed circuit board It includes: a substrate body with a finished product area; at least one set of electro-gold units arranged on the finished product area, wherein each group of electro-gold units includes a plurality of electro-gold positions and a first metal lead, and the first metal leads are arranged in a plurality of Between the electro-gold positions, it is used to connect multiple electro-gold positions; at least one second metal lead is arranged between the electro-gold unit and the outer edge of the finished area, wherein the number of the second metal leads is the same as the number of the electro-gold unit The second metal leads are equal and have a one-to-one correspondence with the electro-gold unit, and are used to connect the electro-gold unit and the outer edge of the finished product area.
  • an electronic device including: a printed circuit board and electronic components arranged on the printed circuit board; wherein the printed circuit board includes: a substrate body with a finished product area ; At least one set of electro-gold units arranged on the finished product area, wherein each set of electro-gold units includes a plurality of electro-gold positions and a first metal lead, the first metal lead is arranged between the plurality of electro-gold units for Connect a plurality of electro-gold positions; at least one second metal lead is arranged between the electro-gold unit and the outer edge of the finished area, wherein the number of the second metal lead is equal to the number of the electro-gold unit, and the second metal lead is connected to the electro-gold unit
  • the gold units correspond one-to-one, and are used to connect the electric gold unit and the outer edge of the finished product area; the electronic components are electrically connected to the electric gold bits on the printed circuit board.
  • the organic light emitting display of the invention integrates the touch electrode layer with independent self-capacitive touch sensing electrode units on the upper part of the organic light emitting display to realize the integration of touch and display. Therefore, the overall thickness is reduced, which is conducive to lightness and thinness, reduces the manufacturing process, reduces the manufacturing cost, and facilitates the realization of the flexibility of touch control.
  • FIG. 1 is a schematic diagram of the structure of a prefabricated substrate according to an embodiment of the present application
  • FIG. 2 is a schematic diagram of the structure of a prefabricated substrate according to another embodiment of the present application.
  • FIG. 3 is a schematic diagram of the structure of a prefabricated substrate according to another embodiment of the present application.
  • FIG. 4 is a schematic diagram of the structure of a prefabricated substrate according to another embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional view of an embodiment of the printed circuit board of the present application.
  • the prefabricated substrate 10 of the embodiment of the present application includes: a substrate body 11, at least one set of electro-metallic units 12, and at least one second metal lead 13.
  • the number 13 of the second metal leads is equal to the number of the electro-gold unit 12 and the second metal leads 13 correspond to the electro-gold unit 12 one-to-one.
  • the substrate body 11 may be a core board or a coreless substrate, where the core board may include a core board medium and a metal layer located on both sides of the core board medium.
  • the metal layer may be a copper layer. In practical applications, the metal layer may also be an aluminum layer or other metal layers, which is not specifically limited here.
  • the choice of the material of the core board medium can be selected according to the functional design of each layer of the core board. It may also be a material with a small loss factor (DF, Damping Factor) suitable for radio frequency circuits, such as ceramic-based high-frequency materials or polytetrafluoroethylene. They can also be materials with larger loss factors suitable for conventional circuits, such as FR-4 (including epoxy resin).
  • the core medium can be made of a material that allows a certain frequency of radio frequency signals to pass through.
  • the material can also be a thermosetting material, and the core medium has been heat-treated and solidified in advance, so its shape is fixed. , The core medium will not be deformed again.
  • the core medium can also be a thermoplastic material that softens after heating.
  • thermosetting material refers to: the material can soften and flow when heated for the first time, and when heated to a certain temperature, a chemical reaction will occur to solidify and harden the cross-linking; this change is irreversible. After that, when heated again, the material It can no longer soften and flow.
  • Common thermosetting materials include, but are not limited to, allyl resin, epoxy resin, thermosetting polyurethane, silicone or polysiloxane, and so on. These resins can be formed from the reaction product of a polymerizable composition that includes at least one oligomeric polyurethane (meth)acrylate. Generally, the oligomeric polyurethane (meth)acrylate is a poly(meth)acrylate.
  • (meth)acrylate is used to refer to the esters of acrylic acid and methacrylic acid, and in contrast to "poly(meth)acrylate” which generally refers to (meth)acrylate polymers, "more ( "Meth)acrylate” refers to a molecule that includes more than one (meth)acrylate group. Most commonly, the poly(meth)acrylates are di(meth)acrylates, but tri(meth)acrylates, tetra(meth)acrylates, etc. can also be considered.
  • the substrate body 11 includes a finished product area 111 and a waste area 112 surrounding the finished product area 111.
  • the electro-gold unit 12 is arranged in the finished product area 111.
  • Each group of electro-gold units 12 includes a plurality of electro-gold positions 121 and a first metal lead 122.
  • the first metal wire 122 is arranged between the plurality of electro-gold positions 121, and the first metal
  • the lead 122 connects a plurality of electrical gold positions 121.
  • the second metal lead 13 is arranged on the substrate body 11 and electrically connects the electro-gold unit 12 and the waste area 112.
  • one end of the second metal lead 13 is connected to the electrical gold bit 121 or the first metal lead 122 in the electro-gold unit 12, and the other end of the second metal lead 13 extends to the waste area 112 to realize the electrical gold unit 12 and Electrical connection to the waste area 112.
  • the distance between the shape of the punching die of the substrate and the finished substrate area 111 should be less than 150-400 microns (e.g., 150 microns, 200 microns). , 300 microns, 400 microns) (e.g. 150 microns, 200 microns, 300 microns, 400 microns) and the distance between the single side of the groove in the substrate punching die and the substrate finished area 111 is greater than 150-400 microns (e.g.
  • 150 microns) , 200 micrometers, 300 micrometers, 400 micrometers is divided into the second waste area, the distance between the shape of the substrate punching die and the finished substrate area 111 is greater than 150-400 micrometers (such as 150 micrometers, 200 micrometers, 300 micrometers, 400 micrometers).
  • the area where the distance between one side of the groove in the substrate punching die and the finished substrate area 111 is less than 150-400 ⁇ m (for example, 150 ⁇ m, 200 ⁇ m, 300 ⁇ m, 400 ⁇ m) is divided into the first waste area.
  • the designed mold is used to punch the substrate. In this process, each substrate undergoes a number of punching processes to flush out the first waste area.
  • the finished substrate is refined with a gong knife to remove the second waste area.
  • This method is the same as the method of finishing the substrate in the existing gong board technology.
  • This second waste area is the finishing in the gong board technology.
  • the electrical gold unit 12 is arranged on the finished product area 111 for connecting electronic components (not shown in the figure).
  • the second metal lead 13 is arranged between the electro-gold unit 12 and the waste area 112 and connects the electro-gold unit 12 and the waste area 112.
  • the number of the second metal leads 13 corresponds to the number of the electro-gold units 12 in a one-to-one correspondence, and each electro-gold unit 12 is arranged at intervals, and each of the second metal leads 13 is arranged at an interval.
  • the electro-gold position 121 is a circuit pattern after electro-gold processing
  • the second metal lead 13 is a wire after electro-gold processing.
  • the lead can be a transparent conductive film including nano-dimensional metal, such as a film including a single metal, alloy, metal compound, or any combination of the above, including a nano-dimensional single metal, such as a film including nano metal wires, and a film including nano metal particles.
  • the film including the nano metal grid can also be a graphene film, a carbon nanotube film, an organic conductive polymer film, an indium tin oxide (Indium Tin Oxide, ITO) film, or any combination of the above.
  • the lead is a transparent conductive nano silver wire film, which is a film including a polymer matrix with nano silver wires, and the nano silver wires are distributed uniformly in the film to make the film transparent and conductive.
  • the nano silver wire film can be attached to the substrate by coating, screen printing or spraying.
  • each group of electro-gold units in this application includes a plurality of electro-gold positions and a first metal lead, and the number of second metal leads is equal to the number of electro-gold units, and the second metal lead and the electro-gold unit
  • the gold unit corresponds to each other, and the gold unit and the waste area are connected by the second metal lead.
  • the second metal lead 13 of the embodiment of the present application is arranged between the first metal lead 122 and the waste area 112 for connecting the first metal lead 122 and the waste area 112.
  • the second metal lead 13 of the embodiment of the present application is arranged between one of the electrical gold positions 121 and the waste area 112 for connecting one of the electrical gold positions 121 and the waste area 112.
  • each group of electric gold units 12 includes 4-9 electric gold positions 121, for example, 4, 6, 7, 9 positions.
  • the outer diameter of the second metal lead 13 along the extension direction D2 of the embodiment of the present application is greater than or equal to the outer diameter of the first metal lead 122 along the extension direction D1.
  • the second metal lead 13 of the embodiment of the present application at least includes a lead body part 131 and a lead thickened part 132.
  • the thick lead part 132 is arranged on the side of the waste area 112 close to the finished area 111, and the lead body part 131 connects the electro-gold unit 12 and the thick lead part 132, so that the electro-gold unit 12 is connected to the waste through the thick lead part 132 Area 112, in which, along the extending direction D2 of the second metal lead 13 itself, the outer diameter of the thickened part 132 of the lead is larger than the outer diameter of the main body part 131 of the lead.
  • the bonding area between the thick lead part 132 and the solder resist ink on the edge of the board is increased, thereby increasing the bonding force between the thick lead part 132 and the solder resist ink , Reduce the metal burr caused by the wire thickening portion 132 pulled out from under the solder resist ink during processing, which can improve the burr problem during substrate molding.
  • the outer diameter of the thickened part 132 of the lead may be 5-20 times (5 times, 10 times, 15 times, 20 times) of the outer diameter of the lead body part 131 .
  • the outer diameter of the thickened part 132 of the lead is greater than or equal to 150 ⁇ m.
  • the prefabricated substrate of the embodiment of the present application further includes: a milling area 113.
  • the milling zone 113 is arranged between the finished product zone 111 and the waste zone 112.
  • the milling zone 113 is arranged on the periphery of the finished product zone 111.
  • the finished product zone 111, the waste zone 112 and the milling zone 113 are integrated.
  • a milling path 114 is provided on the milling area 113, wherein when the printed circuit board 20 is produced, the second metal lead 13 can be broken along the milling path 114.
  • the printed circuit board 20 of the embodiment of the present application is obtained by secondary processing of a prefabricated substrate 10, and the prefabricated substrate 10 is the prefabricated substrate 10 in the foregoing embodiment.
  • the printed circuit board 20 is obtained by secondary processing of a prefabricated substrate 10, and the prefabricated substrate 10 is the aforementioned prefabricated substrate 10;
  • the printed circuit board 20 includes: a substrate body 11 having a finished product area 111; at least one group of electro-gold units 12 arranged on the finished product area 111, wherein each group of the electro-gold units 12 includes a plurality of electro-gold positions 121 and a piece of first metal Lead 122, the first metal lead 122 is arranged between the plurality of electro-gold positions 121 for connecting the plurality of electro-gold positions 121; at least one second metal lead 13 is arranged on the outer edge of the electro-gold unit 12 and the finished area 111 Among them, the number of the second metal leads 13 is equal to the number of the electro-gold unit 12, and the second metal wires 13 correspond to the electro-gold unit 12 one-to-one, and are used to connect the electro-gold unit 12 and the outer edge of the finished area 111.
  • the second metal lead 13 is arranged between the first metal lead 122 and the outer edge of the finished area 111 for connecting the first metal lead 122 and the outer edge of the finished area 111; or the second metal lead 13 is arranged on one of them
  • the electrical gold bit 121 and the outer edge of the finished product area 111 are used to connect one of the electrical gold bit 121 and the outer edge of the finished product area 111.
  • the printed circuit board 20 further includes: a first solder resist ink layer 21 and a second solder resist ink layer 22.
  • the first solder resist ink layer 21 and the second solder resist ink layer 22 are respectively disposed on opposite sides of the substrate body 11 And cover the second metal lead 13.
  • the printed circuit board 20 further includes: a cover 23 and a backing plate 24.
  • the cover 23 is arranged on the side of the first solder resist ink layer 21 away from the substrate body 11; the backing plate 24 is arranged on the second solder resist ink layer 22 away from the substrate body. 11 side.
  • the first solder resist ink layer 21 and the second solder resist ink layer 22 are green ink, black ink, red ink, blue ink, white ink or yellow ink; the first solder resist ink layer 21 and the second solder resist ink
  • the layer 22 is used to prevent the lines from interfering with each other during soldering, or short circuits caused by different line networks during soldering.
  • the first solder resist ink layer 21 and the second solder resist ink layer 22 are respectively disposed on opposite sides of the substrate body 11.
  • the first solder resist ink layer 21 and the second solder resist ink layer 22 cover the second metal lead 13, and the first The solder resist ink layer 21 and the second solder resist ink layer 22 have a strong adsorption force with the second metal lead 13.
  • the cover plate 23 is arranged on the side of the first solder resist ink layer 21 away from the substrate body 11, and the backing plate 24 is arranged on the side of the second solder resist ink layer 22 away from the substrate body 11.
  • the cover plate 23 may be an upper copper foil layer 23 arranged above the first solder resist ink layer 21, the backing plate 24 may be a lower copper foil layer 24 arranged below the second solder resist ink layer 22, and the substrate body 11,
  • the upper copper foil layer 23 and the lower copper foil layer 24 are connected through metal through holes or second metal leads 13.
  • the printed circuit board 20 is a double-sided copper clad laminate.
  • the required circuit pattern can be obtained, and according to the functional design, the upper copper foil layer 23 and the lower copper foil layer 24 can be divided into a signal layer and a ground layer; the pattern of the signal layer The pattern of the ground layer is more complicated.
  • the signal layer is the layer where multiple metal lines are used to form electrical connections between electronic devices; the ground layer is used to connect to the ground, and is usually a layer with a large area of continuous metal regions.
  • the lower copper foil layer 24 connected to the heat sink (not shown) on the substrate body 11 through a conductive adhesive layer is a ground layer, that is, the heat sink and the ground layer on the substrate body 11 are electrically connected indirectly.
  • the ground layer can be directly electrically connected to the heat sink through the sandwich laminated structure, thereby directly grounding, and the grounding path can be shortened, thereby improving the grounding effect of the electronic devices to be grounded on the printed circuit board 20, and the grounding stability.
  • one of the backing plate 24 or the cover plate 23 is a copper foil layer, and the other is an insulating layer.
  • the printed circuit board 20 is a single-sided copper clad laminate.
  • each group of electro-gold units in this application includes a plurality of electro-gold positions and a first metal lead, and the number of second metal leads is equal to the number of electro-gold units, and the second metal lead and the electro-gold unit
  • the gold unit corresponds to each other, and the gold unit and the waste area are connected by the second metal lead.
  • the present application also provides an electronic device.
  • the electronic device includes a printed circuit board and electronic components arranged on the printed circuit board.
  • the electronic components are electrically connected to the electrical gold positions on the printed circuit board.
  • the printed circuit board is the printed circuit board 20 in the above-mentioned embodiment. For details, please refer to the description in the above-mentioned embodiment, which will not be repeated here.
  • each group of electro-gold units in this application includes a plurality of electro-gold positions and a first metal lead, and the number of second metal leads is equal to the number of electro-gold units, and the second metal lead and the electro-gold unit
  • the gold unit corresponds to each other, and the gold unit and the waste area are connected by the second metal lead.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种预制基板（10）以及印刷电路板（20），该预制基板（10）包括：基板本体（11），包括成品区（111）以及围设在成品区（111）***的废料区（112）；至少一组电金单元（12），设置在成品区（111）上，其中，每组电金单元（12）包括多个电金位（121）以及一条第一金属引线（122），第一金属引线（122）设置在多个电金位（121）之间，用于连接多个电金位（121）；至少一条第二金属引线（13），第二金属引线（13）的数量与电金单元（12）的数量相等且第二金属引线（13）与电金单元（12）一一对应，其中，第二金属引线（13）设置在电金单元（12）与废料区（112）之间，用于连接电金单元（12）和废料区（112）。通过上述方式，能够在后续加工中得到良率高的无毛刺的印刷电路板（20）以及电子装置。

Description

预制基板以及印刷电路板 【技术领域】
本申请涉及印刷电路板制造技术领域，特别是涉及一种预制基板以及印刷电路板。
【背景技术】
PCB板，又称印刷电路板、印刷线路板，简称印制板，以绝缘板为基材，切成一定尺寸，其上至少附有一个导电图形，并布有孔(如元件孔、紧固孔、金属化孔等)，并实现电子元器件之间的相互连接。目前PCB板的铣边方式通常有两种：锣刀加工或冲床模具加工。
本申请的发明人在长期的研发过程中，发现由于预制基板的电金引线细且具有良好的延展性，而加工时阻焊油墨层的厚度较小，覆盖在引线上的油墨和电金引线的结合力小，再加上加工时产生的巨大拉扯力，很容易导致引线出现毛刺、翘起等问题，严重影响产品的质量。
【发明内容】
本申请要解决的主要技术问题是提供一种有机发光显示屏的制备方法，该方法能够实现触控显示一体化，减小整体厚度，利于轻薄化，利于触控信号的检测，减少制作工序，降低制作成本。
为解决上述技术问题，本申请提供了一种预制基板，预制基板包括：基板本体，包括成品区以及围设在成品区***的废料区；至少一组电金单元，设置在成品区上，其中，每组电金单元包括多个电金位以及一条第一金属引线，第一金属引线设置在多个电金位之间，用于连接多个电金位；至少一条第二金属引线，第二金属引线的数量与电金单元的数量相等且第二金属引线与电金单元一一对应，其中，第二金属引线设置在基板本体上，并电连接电金单元和废料区。
为解决上述技术问题，本申请采用的另一个技术方案是：本申请提供了一种印刷电路板，印刷电路板由预制基板经二次加工所得，预制基板为如前述的预制基板；印刷电路板包括：具有成品区的基板本体；设 置在成品区上的至少一组电金单元，其中，每组电金单元包括多个电金位以及一条第一金属引线，第一金属引线设置在多个电金位之间，用于连接多个电金位；至少一条第二金属引线，设置在电金单元与成品区的外边缘之间，其中，第二金属引线的数量与电金单元的数量相等且第二金属引线与电金单元一一对应，用于连接电金单元和成品区的外边缘。
为解决上述技术问题，本申请采用的又一个技术方案是：提供一种电子装置，包括：印刷电路板以及设置在印刷电路板上电子元件；其中，印刷电路板包括：具有成品区的基板本体；设置在成品区上的至少一组电金单元，其中，每组电金单元包括多个电金位以及一条第一金属引线，第一金属引线设置在多个电金位之间，用于连接多个电金位；至少一条第二金属引线，设置在电金单元与成品区的外边缘之间，其中，第二金属引线的数量与电金单元的数量相等且第二金属引线与电金单元一一对应，用于连接电金单元和成品区的外边缘；电子元件电连接印刷电路板上的电金位。
本申请的有益效果有：区别于现有技术的情况，该发明有机发光显示屏，将具有独立自容触控感应电极单元的触控电极层集成到有机发光显示屏上部，实现触控显示一体化，从而减小整体厚度，利于轻薄化，减少制作工序，降低制作成本，利于实现触控的柔性化。
【附图说明】
图1是本申请一实施例预制基板的结构示意图；
图2是本申请另一实施例预制基板的结构示意图；
图3是本申请又一实施例预制基板的结构示意图；
图4是本申请再一实施例预制基板的结构示意图；
图5是本申请印刷电路板一实施方式的剖视结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人 员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
如图1所示，本申请实施例的预制基板10包括：基板本体11、至少一组电金单元12、至少一条第二金属引线13。第二金属引线的数量13与电金单元12的数量相等且第二金属引线13与电金单元12一一对应。
其中，基板本体11可以为芯板或者无芯基板，其中，该芯板可包括芯板介质和位于芯板介质两侧的金属层。
金属层可以为铜层。在实际应用中，该金属层还可以为铝层或其他金属层，具体此处不作限定。芯板介质的材料的选择可根据每一层芯板的功能设计来选择。也有可能均为适用于射频电路的损耗因子(DF，Damping Factor)较小的材料，如陶瓷基高频材料或聚四氟乙烯等。也可以均为适用于常规电路的损耗因子较大的材料，如FR-4(包括环氧树脂)。在本实施例中，芯板介质除可由允许一定频率的射频信号通过的材料制成外，该材料还可以为热固性材料，且芯板介质预先经过热处理固化，因此其形状固定，在后续加热过程中，该芯板介质不会再次发生形变。该芯板介质也可以为加热后发生软化的热塑性材料。
其中，热固性材料是指：第一次加热时该材料可以软化流动，加热到一定温度，产生化学反应，使交链固化而***；这种变化是不可逆的，此后，再次加热时，该材料已不能再***流动了。常见的热固性材料包括但不限于烯丙基树脂、环氧树脂、热固性聚氨酯、有机硅或聚硅氧烷等等。这些树脂可由可聚合组合物的反应产物形成，所述可聚合组合物包括至少一种低聚聚氨酯(甲基)丙烯酸酯。通常，所述低聚聚氨酯(甲基)丙烯酸酯为多(甲基)丙烯酸酯。术语“(甲基)丙烯酸酯”用于指代丙烯酸和甲基丙烯酸的酯，并且与通常指代(甲基)丙烯酸酯聚合物的“聚(甲基)丙烯酸酯”相对比，“多(甲基)丙烯酸酯”是指包括不止一个(甲基)丙烯酸酯基团的分子。最常见的是，多(甲基)丙烯酸酯为二(甲基)丙烯酸酯，但是也可以考虑采用三(甲基)丙烯酸酯、四(甲基)丙烯酸酯等等。
基板本体11包括成品区111以及围设在成品区111***的废料区 112。电金单元12设置在成品区111，每组电金单元12包括多个电金位121以及一条第一金属引线122，第一金属引线122设置在多个电金位121之间，第一金属引线122连接多个电金位121。第二金属引线13设置在基板本体11上，并电连接电金单元12和废料区112。具体地，第二金属引线13的一端连接电金单元12中的电金位121或第一金属引线122，并第二金属引线13的另一端延伸至废料区112，以实现电金单元12和废料区112的电连接。
其中，为了避免冲板时基板边发生爆油或者分层，因此在进行设计时，将基板的冲板模具外形与基板成品区111之间的间距小于150-400微米(例如150微米、200微米、300微米、400微米)(例如150微米、200微米、300微米、400微米)的区域和基板冲板模具内槽单边与基板成品区111之间的间距大于150-400微米(例如150微米、200微米、300微米、400微米)的区域划分为第二废料区，将基板冲板模具外形与基板成品区111之间间距大于150-400微米(例如150微米、200微米、300微米、400微米)的区域和基板冲板模具内槽单边与基板成品区111之间的间距小于150-400微米(例如150微米、200微米、300微米、400微米)的区域划分为第一废料区。按照正常冲板的工艺参数利用设计好的模具对基板进行冲板，在此过程中，每块基板约经过若干次冲板过程，冲掉第一废料区。将冲板好的基板用锣刀进行精修，除去第二废料区，此方法和现有锣板技术中对基板进行的精修方式相同，此第二废料区即是锣板技术中精修时除去的废料区112。从而获得客户的要求尺寸的基板成品。
电金单元12设置在成品区111上，用于连接电子元件(图未示出)。第二金属引线13设置在电金单元12与废料区112之间，且连接电金单元12与废料区112。第二金属引线13的数量与电金单元12的数量一一对应，且各个电金单元12间隔设置，各个第二金属引线13间隔设置。
其中，电金位121为电金处理后的电路图形，第二金属引线13为电金处理后的引线。引线可以是透明导电的包括了纳米维度的金属的薄膜，如包括纳米维度的单一金属、合金、金属化合物或其以上任意组合 形成的薄膜，例如包括纳米金属丝的薄膜、包括纳米金属颗粒的薄膜、包括纳米金属网格的薄膜，当然也可以是石墨烯薄膜、碳纳米管薄膜、有机导电高分子聚合物薄膜、氧化铟锡(Indium Tin Oxide，ITO)薄膜或者以上任意组合。优选地，引线为透明导电的纳米银丝薄膜，其是包括一层具有纳米银丝的聚合物基体的薄膜，纳米银丝在薄膜中无序均匀分布，以使薄膜具有透明及导电的特征。纳米银丝薄膜可通过涂布、丝印或喷射的方式附设至基材上。
区别于现有技术的情况，本申请中每组电金单元包括多个电金位以及一条第一金属引线，而第二金属引线的数量与电金单元的数量相等且第二金属引线与电金单元一一对应，藉由第二金属引线连接电金单元与废料区。通过将成品区内的多个电金位串联起来,可以确保电金位规格的情况下，使用较少的第二金属引线连接电金位和废料区，进而减少出现毛刺、翘起等问题的引线数量，能够在后续加工中得到良率高的无毛刺的印刷电路板以及电子装置。
如图1所示，本申请实施例的第二金属引线13设置在第一金属引线122与废料区112之间，用于连接第一金属引线122与废料区112。
如图2所示，本申请实施例的第二金属引线13设置在其中一个电金位121与废料区112之间，用于连接其中一个电金位121与废料区112。
上述实施例中每组电金单元12包括4-9个电金位121，例如4、6、7、9个。
如图3所示，本申请实施例的第二金属引线13沿着自身延伸方向D2的外径大于等于第一金属引线122沿着自身延伸方向D1的外径。通过加粗连接电金单元12与废料区112的第二金属引线13，增加板边的第二金属引线13和阻焊油墨的结合面积，从而增加第二金属引线13和阻焊油墨的结合力，减少加工时因第二金属引线13从阻焊油墨下扯出导致的金属毛刺，可以改善基板成型时的毛刺问题
如图4所示，本申请实施例的第二金属引线13至少包括引线本体部131和引线加粗部132。引线加粗部132设置在废料区112靠近成品区111的一侧，引线本体部131连接电金单元12和引线加粗部132，以 使电金单元12藉由引线加粗部132而连接废料区112，其中，沿着第二金属引线13自身延伸方向D2，引线加粗部132的外径大于引线本体部131的外径。
通过加粗废料区112靠近成品区111一侧的引线加粗部132，增加板边的引线加粗部132和阻焊油墨的结合面积，从而增加引线加粗部132和阻焊油墨的结合力，减少加工时因引线加粗部132从阻焊油墨下扯出导致的金属毛刺，可以改善基板成型时的毛刺问题。
进一步地，沿着第二金属引线13自身延伸方向D2，引线加粗部132的外径可以为引线本体部131的外径的5-20倍(5倍、10倍、15倍、20倍)。
进一步地，沿着第二金属引线13的自身延伸方向D2，引线加粗部132的外径大于等于150微米。
进一步减少加工时因第二金属引线13从阻焊油墨下扯出导致的金属毛刺，
如图5所示，本申请实施例的预制基板还包括：铣切区113。铣切区113设置在成品区111与废料区112之间，铣切区113围设在成品区111的***，成品区111、废料区112与铣切区113为一体结构。铣切区113上设有一铣切路径114，其中，在生产印刷电路板20时，可沿铣切路径114锣断第二金属引线13。
如图5所示，本申请实施例的印刷电路板20由预制基板10经二次加工所得，预制基板10为上述实施例中的预制基板10。
印刷电路板20由预制基板10经二次加工所得，预制基板10为如前述的预制基板10；
印刷电路板20包括：具有成品区111的基板本体11；设置在成品区111上的至少一组电金单元12，其中，每组电金单元12包括多个电金位121以及一条第一金属引线122，第一金属引线122设置在多个电金位121之间，用于连接多个电金位121；至少一条第二金属引线13，设置在电金单元12与成品区111的外边缘之间，其中，第二金属引线13的数量与电金单元12的数量相等且第二金属引线13与电金单元12 一一对应，用于连接电金单元12和成品区111的外边缘。
其中，第二金属引线13设置在第一金属引线122与成品区111的外边缘之间，用于连接第一金属引线122与成品区111的外边缘；或者第二金属引线13设置在其中一个电金位121与成品区111的外边缘之间，用于连接其中一个电金位121与成品区111的外边缘。
其中，印刷电路板20还包括：第一阻焊油墨层21和第二阻焊油墨层22，第一阻焊油墨层21、第二阻焊油墨层22分别设置在基板本体11的相对两侧且覆盖第二金属引线13。
印刷电路板20还包括：盖板23和垫板24，盖板23设置在第一阻焊油墨层21远离基板本体11的一侧；垫板24设置在第二阻焊油墨层22远离基板本体11的一侧。
其中，第一阻焊油墨层21和第二阻焊油墨层22为绿色油墨、黑色油墨、红色油墨、蓝色油墨、白色油墨或者黄色油墨；第一阻焊油墨层21和第二阻焊油墨层22用于防止焊接时线路相互干扰，或者在上锡时不同线路网络造成的短路。第一阻焊油墨层21和第二阻焊油墨层22分别设置在基板本体11的相对两侧，第一阻焊油墨层21和第二阻焊油墨层22覆盖第二金属引线13，第一阻焊油墨层21和第二阻焊油墨层22与第二金属引线13之间具有较强的吸附力。
盖板23设置在第一阻焊油墨层21远离基板本体11一侧，垫板24设置在第二阻焊油墨层22远离基板本体11一侧。
其中，盖板23可以为设置于第一阻焊油墨层21上面的上铜箔层23，垫板24可以为设置于第二阻焊油墨层22下面的下铜箔层24，基板本体11、上铜箔层23、下铜箔层24三者通过金属通孔或者第二金属引线13相连通。此时，印刷电路板20为双面覆铜板。
其中，铜具有良好的导电性能，是印刷电路板20最常用的线路材料。对每一基板本体11进行图案化处理，即可得到所需要的线路图形，并根据功能设计可以将上铜箔层23、下铜箔层24分为信号层和接地层；其中信号层的图案较接地层的图案复杂。通常，信号层为用于形成电子器件之间的电连接的多条金属线路所在的层；接地层用于与地连接，通 常为大面积连续金属区域的层。
可选地，基板本体11上与散热装置(图未示出)通过导电粘结层连接的下铜箔层24为接地层，即将散热装置与基板本体11上的接地层实现间接的电连接。通过这种方式，可使接地层直接通过三明治的层叠结构与散热装置进行电连接，从而直接接地，可以缩短接地路径，由此提升印刷电路板20上的待接地电子器件的接地效果，以及接地稳定性。
在其他实施例中，垫板24或盖板23中的一个为铜箔层，另一个为绝缘层，此时，印刷电路板20为单面覆铜板。
区别于现有技术的情况，本申请中每组电金单元包括多个电金位以及一条第一金属引线，而第二金属引线的数量与电金单元的数量相等且第二金属引线与电金单元一一对应，藉由第二金属引线连接电金单元与废料区。通过将成品区内的多个电金位串联起来,可以确保电金位规格的情况下，使用较少的第二金属引线连接电金位和废料区，进而减少出现毛刺、翘起等问题的引线数量，能够在后续加工中得到良率高的无毛刺的印刷电路板以及电子装置。
本申请还提供一种电子装置，电子装置包括：印刷电路板，设置在印刷电路板上电子元件。电子元件电连接印刷电路板上的电金位。印刷电路板为上述实施例中的印刷电路板20，具体请参见上述实施例中的描述，在此不作赘述。
区别于现有技术的情况，本申请中每组电金单元包括多个电金位以及一条第一金属引线，而第二金属引线的数量与电金单元的数量相等且第二金属引线与电金单元一一对应，藉由第二金属引线连接电金单元与废料区。通过将成品区内的多个电金位串联起来,可以确保电金位规格的情况下，使用较少的第二金属引线连接电金位和废料区，进而减少出现毛刺、翘起等问题的引线数量，能够在后续加工中得到良率高的无毛刺的印刷电路板以及电子装置。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保 护范围内。

Claims (20)

  1. 一种预制基板，其中，所述预制基板包括：
    基板本体，包括成品区以及围设在所述成品区***的废料区；
    至少一组电金单元，设置在所述成品区上，其中，每组所述电金单元包括多个电金位以及一条第一金属引线，所述第一金属引线设置在多个所述电金位之间，用于连接多个所述电金位；
    至少一条第二金属引线，所述第二金属引线的数量与所述电金单元的数量相等且所述第二金属引线与所述电金单元一一对应，其中，所述第二金属引线设置在所述基板本体上，并电连接所述电金单元和所述废料区。
  2. 根据权利要求1所述的预制基板，其中，
    所述第二金属引线设置在所述第一金属引线与所述废料区之间，用于连接所述第一金属引线与所述废料区。
  3. 根据权利要求1所述的预制基板，其中，
    所述第二金属引线设置在其中一个所述电金位与所述废料区之间，用于连接其中一个所述电金位与所述废料区。
  4. 根据权利要求1所述的预制基板，其中，
    每组所述电金单元包括4-9个所述电金位。
  5. 根据权利要求4所述的预制基板，其中，
    每组所述电金单元包括4-6个所述电金位。
  6. 根据权利要求1所述的预制基板，其中，
    所述第二金属引线沿着自身延伸方向的外径大于等于所述第一金属引线沿着自身延伸方向的外径。
  7. 根据权利要求1所述的预制基板，其中，所述第二金属引线包括引线本体部和引线加粗部，所述引线加粗部设置在所述废料区靠近所述成品区的一侧，所述引线本体部连接所述电金单元和所述引线加粗部，以使所述电金单元藉由所述引线加粗部而连接所述废料区，其中，沿着所述第二金属引线的延伸方向，所述引线加粗部的外径大于所述引线本体 部的外径。
  8. 根据权利要求7所述的预制基板，其中，沿着所述第二金属引线的延伸方向，所述引线加粗部的外径为所述引线本体部的外径的5-20倍。
  9. 根据权利要求8所述的预制基板，其中，沿着所述第二金属引线的延伸方向，所述引线加粗部的外径为所述引线本体部的外径的5-10倍。
  10. 根据权利要求7所述的预制基板，其中，沿着所述第二金属引线的延伸方向，所述引线加粗部的外径大于等于150微米。
  11. 根据权利要求1所述的预制基板，其中，所述预制基板还包括：
    铣切区，设置在所述成品区与所述废料区之间，所述铣切区围设在所述成品区的***，所述成品区、所述废料区与所述铣切区为一体结构；
    所述铣切区上设有一铣切路径，其中，在生产印刷电路板时，可沿所述铣切路径锣断所述第二金属引线。
  12. 一种印刷电路板，其中，所述印刷电路板由预制基板经二次加工所得，所述预制基板为如权利要求1-11所述的预制基板；所述印刷电路板包括：
    具有成品区的基板本体；
    设置在所述成品区上的至少一组电金单元，其中，每组所述电金单元包括多个电金位以及一条第一金属引线，所述第一金属引线设置在多个所述电金位之间，用于连接多个所述电金位；
    至少一条第二金属引线，设置在所述电金单元与所述成品区的外边缘之间，其中，所述第二金属引线的数量与所述电金单元的数量相等且所述第二金属引线与所述电金单元一一对应，用于连接所述电金单元和所述成品区的外边缘。
  13. 根据权利要求12所述的印刷电路板，其中，
    所述第二金属引线设置在所述第一金属引线与所述成品区的外边缘之间，用于连接所述第一金属引线与所述成品区的外边缘；或者
    所述第二金属引线设置在其中一个所述电金位与所述成品区的外边缘之间，用于连接其中一个所述电金位与所述成品区的外边缘。
  14. 根据权利要求12所述的印刷电路板，其中，所述印刷电路板还包 括：
    第一阻焊油墨层和第二阻焊油墨层，所述第一阻焊油墨层、所述第二阻焊油墨层分别设置在所述基板本体的相对两侧且覆盖所述第一金属引线和第二金属引线；
    盖板，设置在所述第一阻焊油墨层远离所述基板本体的一侧；
    垫板，设置在所述第二阻焊油墨层远离所述基板本体的一侧。
  15. 根据权利要求14所述的印刷电路板，其中，所述印刷电路板还包括：
    所述第一阻焊油墨层和第二阻焊油墨层为绿色油墨、黑色油墨、红色油墨、蓝色油墨、白色油墨或者黄色油墨。
  16. 根据权利要求14所述的印刷电路板，其中，
    所述盖板和所述垫板均为铜箔。
  17. 根据权利要求14所述的印刷电路板，其中，
    所述盖板和所述垫板中的一个为铜箔层，另一个为绝缘层。
  18. 一种电子装置，其中，包括：
    印刷电路板以及设置在所述印刷电路板上电子元件；
    其中，所述印刷电路板包括：
    具有成品区的基板本体；
    设置在所述成品区上的至少一组电金单元，其中，每组所述电金单元包括多个电金位以及一条第一金属引线，所述第一金属引线设置在多个所述电金位之间，用于连接多个所述电金位；
    至少一条第二金属引线，设置在所述电金单元与所述成品区的外边缘之间，其中，所述第二金属引线的数量与所述电金单元的数量相等且所述第二金属引线与所述电金单元一一对应，用于连接所述电金单元和所述成品区的外边缘；
    所述电子元件电连接所述印刷电路板上的所述电金位。
  19. 根据权利要求18所述的电子装置，其中，
    所述第二金属引线设置在所述第一金属引线与所述成品区的外边缘之间，用于连接所述第一金属引线与所述成品区的外边缘；或者
    所述第二金属引线设置在其中一个所述电金位与所述成品区的外边缘之间，用于连接其中一个所述电金位与所述成品区的外边缘。
  20. 根据权利要求18所述的电子装置，其中，
    所述印刷电路板还包括：
    第一阻焊油墨层和第二阻焊油墨层，所述第一阻焊油墨层、所述第二阻焊油墨层分别设置在所述基板本体的相对两侧且覆盖所述第一金属引线和第二金属引线；
    盖板，设置在所述第一阻焊油墨层远离所述基板本体的一侧；
    垫板，设置在所述第二阻焊油墨层远离所述基板本体的一侧。
PCT/CN2019/129326 2019-12-27 2019-12-27 预制基板以及印刷电路板 WO2021128300A1 (zh)

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