WO2021124665A1 - Heat sink and electronic device unit - Google Patents

Heat sink and electronic device unit Download PDF

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Publication number
WO2021124665A1
WO2021124665A1 PCT/JP2020/038943 JP2020038943W WO2021124665A1 WO 2021124665 A1 WO2021124665 A1 WO 2021124665A1 JP 2020038943 W JP2020038943 W JP 2020038943W WO 2021124665 A1 WO2021124665 A1 WO 2021124665A1
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WO
WIPO (PCT)
Prior art keywords
wall
base plate
substrate
heat sink
board
Prior art date
Application number
PCT/JP2020/038943
Other languages
French (fr)
Japanese (ja)
Inventor
太田　武志
中島　雄二
裕一朗 矢口
Original Assignee
株式会社東芝
東芝インフラシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝, 東芝インフラシステムズ株式会社 filed Critical 株式会社東芝
Priority to KR1020227008992A priority Critical patent/KR102642224B1/en
Priority to CN202080057243.2A priority patent/CN114223318A/en
Publication of WO2021124665A1 publication Critical patent/WO2021124665A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • An embodiment of the present invention relates to a heat sink and an electronic device unit.
  • a heat sink having a base plate thermally connected to a heating element mounted on a substrate and a plurality of fins protruding from the base plate to the opposite side of the heating element is known.
  • the heat sink of the embodiment includes a base plate, a protruding portion, a first fin, a first boss portion, and a second boss portion.
  • the protrusion protrudes from the base plate in the first direction intersecting the base plate, and can be thermally connected to the first heating element mounted on the first substrate.
  • the plurality of first fins project from the base plate in the opposite direction of the first direction and line up in the second direction intersecting the first direction.
  • the first boss portion projects from the base plate in the direction opposite to the first fin in the first direction, and a connector for connecting the outer wall of the housing and the base plate can be attached.
  • the second boss portion projects in the first direction from the base plate, and a binder for connecting the first substrate and the base plate can be attached.
  • FIG. 1 is an exemplary perspective view of an electronic device equipped with an electronic device unit including the heat sink of the embodiment.
  • FIG. 2 is an exemplary perspective view of an electronic device unit including the heat sink of the embodiment.
  • FIG. 3 is an exemplary perspective view of the heat sink of the embodiment from the back surface side.
  • FIG. 4 is an exemplary and schematic YZ cross-sectional view of the electronic device of FIG.
  • FIG. 5 is an exemplary and schematic XY cross-sectional view of the electronic device of FIG.
  • FIG. 1 is a perspective view of an electronic device 1 equipped with an electronic device unit 10 (see FIG. 2) including a heat sink 3 described later.
  • the X direction is along the depth direction (front-back direction) of the electronic device 1 and along the width direction of the heat sink 3.
  • the Y direction is along the width direction (horizontal direction) of the electronic device 1 and along the thickness direction of the heat sink 3.
  • the Z direction is along the height direction (vertical direction) of the electronic device 1 and along the vertical width direction of the heat sink 3.
  • the electronic device 1 is configured as a fanless industrial computer, and includes a housing 2, an electronic device unit 10 (see FIG. 2) described later, and the like.
  • the electronic device 1 is not limited to this example, and can be configured as various electronic devices 1 such as a desktop personal computer, a video display device, a television receiver, a game machine, and an information storage device. ..
  • the housing 2 is configured in a rectangular parallelepiped box shape that is short in the Y direction.
  • the housing 2 has a plurality of wall portions such as a bottom wall 2a, a top wall 2b, a front wall 2c, a left wall 2d, a rear wall 2e, and a right wall 2f.
  • the bottom wall 2a is also referred to as a lower wall or the like
  • the top wall 2b is also referred to as an upper wall or the like.
  • the front wall 2c, the left wall 2d, the rear wall 2e, and the right wall 2f are also referred to as a side wall, a peripheral wall, and the like.
  • Both the bottom wall 2a and the top wall 2b extend along a direction (XY plane) orthogonal to the Z direction, and are provided parallel to each other at intervals in the Z direction.
  • the bottom wall 2a constitutes the lower end of the housing 2
  • the top wall 2b constitutes the upper end of the housing 2.
  • the bottom wall 2a is provided with a plurality of rubber legs 2h that project in the opposite direction in the Z direction and support the housing 2 in a state of being separated from a shelf (not shown) or an installation surface such as a desk or a table.
  • Both the left wall 2d and the right wall 2f extend along a direction (XZ plane) orthogonal to the Y direction, and are provided parallel to each other with an interval in the Y direction.
  • the left wall 2d extends between the bottom wall 2a and the top wall 2b in the Y direction
  • the right wall 2f extends between the bottom wall 2a and the top wall 2b in the opposite direction in the Y direction. ..
  • the left wall 2d constitutes the left end portion of the housing 2
  • the right wall 2f constitutes the right end portion of the housing 2.
  • the left wall 2d may be provided with a plurality of rubber legs 2h (see FIG. 4) protruding in the Y direction.
  • the electronic device 1 is used in a vertical posture in which the rubber legs 2h of the bottom wall 2a are in contact with the installation surface and a horizontal posture in which the rubber legs 2h of the left wall 2d are in contact with the installation surface. It is configured to be possible.
  • the rubber legs 2h are detachably attached to the housing 2, and when used in one posture, the rubber legs 2h used in the other posture may be removed.
  • the right wall 2f is positioned so as to face the heat sink 3 described later, which is housed in the housing 2.
  • the right wall 2f is coupled to the boss portion 3d of the heat sink 3 by a plurality of coupling tools 18 such as bolts and screws penetrating in the Y direction.
  • the right wall 2f is an example of an outer wall. As shown in FIG. 1, in the present embodiment, the right wall 2f and the heat sink 3 are fixed at three places by the coupling tool 18, but the number of coupling tools 18 (boss portion 3d) is in this example. Is not limited, and may be one, two, four or more.
  • Both the front wall 2c and the rear wall 2e extend along the direction orthogonal to the X direction (YZ plane), and are provided parallel to each other at intervals in the X direction.
  • the front wall 2c extends between the bottom wall 2a and the end of the top wall 2b in the X direction
  • the rear wall 2e extends between the end of the bottom wall 2a and the top wall 2b in the opposite direction in the X direction. ..
  • the front wall 2c constitutes the front end portion of the housing 2
  • the rear wall 2e constitutes the rear end portion of the housing 2.
  • the front wall 2c is provided with an auxiliary storage device 13, a power button 14, various connectors 15, and the like.
  • the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f are each provided with ventilation holes 2s.
  • the vent 2s is configured as a portion in which a plurality of small holes penetrating each wall portion are gathered.
  • the ventilation holes 2s provided on the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f allow air convection in each of the above-mentioned vertical posture and horizontal posture.
  • the heat generating component in the housing 2 can be cooled.
  • the housing 2 is composed of a combination of a plurality of parts (divided bodies) such as a base cover 21, a top cover 23, a light cover 24, a bottom cover 25, and a middle frame 22 (see FIG. 2) described later. ..
  • the base cover 21, top cover 23, light cover 24, bottom cover 25, and middle frame 22 are made of a metal material such as aluminum.
  • the base cover 21 has a part of the bottom wall 2a, the front wall 2c, the left wall 2d, and the like.
  • the top cover 23 has a top wall 2b, a part (upper side portion) of each of the left wall 2d, the rear wall 2e, and the right wall 2f.
  • the light cover 24 has a part (central portion) of the right wall 2f, a rear wall 2e, and the like.
  • the bottom cover 25 has a part (lower part) of the right wall 2f, a part of the bottom wall 2a, and the like.
  • the base cover 21, top cover 23, light cover 24, and bottom cover 25 are connected (integrated) to each other by a binder 20 such as a screw.
  • FIG. 2 is a perspective view of the electronic device unit 10.
  • the electronic device unit 10 includes a middle frame 22, a heat sink 3, a main board 4, a plurality of sub boards 5 to 9, a storage holder 16, and the like.
  • the electronic device unit 10 is a block in which a heat sink 3, a main board 4, a plurality of sub boards 5 to 9, and a storage holder 16 are laminated based on the middle frame 22 described above.
  • the middle frame 22 is an example of a mounting base.
  • the middle frame 22 has an inner wall 22a, a plurality of studs 22d and 22e, a protruding wall 22c described later (see FIG. 4), and the like.
  • the inner wall 22a is located at a substantially central portion of the electronic device unit 10 in the Y direction, specifically between the main substrate 4 and the sub substrate 6.
  • the inner wall 22a extends along a direction (XZ plane) orthogonal to the Y direction, and is parallel to the left wall 2d and the right wall 2f of the housing 2 described above.
  • the inner wall 22a partitions the inside of the housing 2 into a plurality of spaces in the Y direction.
  • the inner wall 22a is also referred to as a partition wall, a partition wall, or the like.
  • the stud 22d protrudes from the inner wall 22a in the opposite direction in the Y direction and is interposed between the inner wall 22a and the main substrate 4.
  • the inner wall 22a is provided with a plurality of studs 22d at intervals from each other.
  • the head of the stud 22d is press-fitted into the inner wall 22a by caulking or the like.
  • the stud 22d is an example of the first stud.
  • the shaft portion of the stud 22d is provided with a female screw portion that meshes with the male screw portion of the fitting 19.
  • the coupler 19 is a screw, a bolt, or the like, and is coupled to the stud 22d in a state of penetrating the heat sink 3 and the main substrate 4 in the Y direction. That is, in the present embodiment, the heat sink 3 and the main substrate 4 are fastened together by the coupling tool 19.
  • the main substrate 4 is supported by a plurality of studs 22d in parallel with the inner wall 22a in a state of being separated from the inner wall 22a in the opposite direction in the Y direction.
  • the stud 22e protrudes from the inner wall 22a in the Y direction and is interposed between the inner wall 22a and the sub-board 6.
  • the inner wall 22a is provided with a plurality of studs 22e at intervals from each other.
  • the stud 22e is positioned so as to be offset from the stud 22d when viewed in the Y direction.
  • the head of the stud 22e is press-fitted into the inner wall 22a by caulking or the like.
  • the stud 22e is an example of the second stud.
  • the shaft portion of the stud 22e is provided with a female screw portion that meshes with the male screw portion of the fitting 19 (see FIG. 4).
  • the coupler 19 is a screw, a bolt, or the like, and is coupled to the stud 22e in a state where it penetrates at least the sub-board 6 in the Y direction.
  • the sub-board 6 is supported by a plurality of studs 22e in parallel with the inner wall 22a in a state of being separated from the inner wall 22a in the Y direction.
  • the coupler 19 is not limited to this example, and the sub-board 6 and the storage holder 16 may be fastened together.
  • the sub-board 5 is housed in the opening 22b of the middle frame 22.
  • the sub-board 5 extends parallel to the middle frame 22 and is connected to the middle frame 22 by a connector such as a screw or a bolt.
  • the sub-board 5 is provided with a plurality of electronic components, a connector 15, and the like.
  • the sub-board 5 is also referred to as a DIO board, an expansion board, or the like.
  • the main board 4 is located in the direction opposite to the Y direction of the middle frame 22.
  • the main substrate 4 extends parallel to the middle frame 22 and is mechanically connected to the middle frame 22 by the stud 22d and the coupler 19 described above. Further, in the present embodiment, the ground pattern of the main substrate 4 and the middle frame 22 and the heat sink 3 are electrically connected by fastening the coupling tool 19 and the stud 22d.
  • a plurality of electronic components such as a central processing unit 11 (see FIG. 4) and a main storage device 12 (see FIG. 4), which will be described later, are mounted on the main board 4. At least a part of the control circuit of the electronic device 1 is composed of the wiring in the main board 4 and the plurality of electronic components.
  • the main board 4 is an example of the first board.
  • the sub-board 6 is located in the Y direction of the middle frame 22.
  • the sub-board 6 extends parallel to the middle frame 22 and is mechanically connected to the middle frame 22 by the studs 22e and the coupler 19 described above. Further, in the present embodiment, the ground pattern of the sub-board 6 and the middle frame 22 are also electrically connected by fastening the coupling tool 19 and the stud 22e.
  • the sub-board 6 is provided with a plurality of electronic components, a connector 15, and the like.
  • the sub-board 6 is an example of a second board, and is also referred to as an IO board, an expansion board, or the like.
  • the sub-board 7 is located in the direction opposite to the X direction of the middle frame 22.
  • the sub-board 7 extends perpendicular to the middle frame 22 and is parallel to the rear wall 2e of the housing 2 described above.
  • the sub-board 7 is mechanically connected to the middle frame 22 by a structure similar to that of the studs 22d and 22e and the connector 19. That is, a vertical wall (not shown) extending along the Y direction is provided at the end of the middle frame 22 in the opposite direction to the X direction, and the studs project from the vertical wall toward the sub-board 7.
  • the ground pattern of the sub-board 7 and the middle frame 22 are also electrically connected by fastening the above-mentioned coupling tool and the stud.
  • the sub-board 7 is provided with a plurality of electronic components, a connector 7a (see FIG. 5), and the like.
  • a sub-board 6, a main board 4, and the like are inserted into the connector 7a.
  • the sub-board 7 is also referred to as a backplane board, a rear board, an expansion board, or the like.
  • the sub-board 8 is located in the Y direction of the sub-board 6 and opposite to the Z direction of the auxiliary storage device 13.
  • the sub-board 8 extends in parallel with the sub-board 6 and the middle frame 22, and is supported by the bottom wall 16a of the storage holder 16 described later.
  • the sub-board 8 is provided with a plurality of electronic components, a power supply circuit, and the like.
  • the sub-board 8 is also referred to as a power supply board or the like.
  • the sub-board 9 is located in the direction opposite to the Z direction of the middle frame 22.
  • the sub-board 9 extends perpendicular to the middle frame 22 and is parallel to the bottom wall 2a of the housing 2 described above.
  • a plurality of electronic components and the like are mounted on the sub-board 9, and are inserted into the connector 6a (see FIG. 4) of the sub-board 6.
  • the sub-board 9 is also referred to as a PCI board, an expansion board, or the like.
  • the storage holder 16 is located in the Y direction of the sub-board 6, and constitutes the end of the electronic device unit 10 in the Y direction.
  • the storage holder 16 supports the sub-board 8 and the auxiliary storage device 13 described above.
  • the auxiliary storage device 13 is an SSD (solid state drive), an HDD (hard disk drive), or the like.
  • the heat sink 3 is located in the direction opposite to the Y direction of the main board 4, and constitutes an end portion of the electronic device unit 10 in the opposite direction in the Y direction.
  • the heat sink 3 has a base plate 3a, a plurality of fins 3b, a plurality of boss portions 3d, and the like.
  • the plurality of fins 3b project from the base plate 3a in the opposite direction in the Y direction, and are arranged at intervals in the X direction.
  • the Y direction is an example of the first direction
  • the X direction is an example of the second direction.
  • the heat sink 3 is made of a metal material such as aluminum.
  • the base plate 3a extends parallel to the main substrate 4.
  • the size of the base plate 3a is substantially the same as the size of the main substrate 4.
  • the base plate 3a has a back surface 3a2 in the Y direction facing the main substrate 4 (see FIG. 3) and a front surface 3a1 in the opposite direction in the Y direction facing the right wall 2f of the housing 2 (see FIG. 2). ing.
  • the surface 3a1 is provided with fins 3b, a boss portion 3d, and the like.
  • the fin 3b is an example of the first fin, and is also referred to as a heat radiating portion or the like.
  • Each of the plurality of boss portions 3d protrudes from the base plate 3a in the direction opposite to the Y direction from the fins 3b.
  • the boss portion 3d is provided with a female screw portion that meshes with the male screw portion of the above-mentioned coupling tool 18.
  • the coupler 18 is a screw, a bolt, or the like, and is coupled to the boss portion 3d in a state where it penetrates the right wall 2f of the housing 2 in the Y direction.
  • the boss portion 3d is an example of the first boss portion.
  • FIG. 3 is a perspective view from the back surface 3a2 side of the heat sink 3. As shown in FIG. 3, the heat sink 3 also has a protruding portion 3c, a plurality of boss portions 3e, 3g, a plurality of fins 3f, and the like.
  • the protruding portion 3c protrudes from the base plate 3a in the Y direction.
  • the protruding portion 3c has a front end surface 3c1 in the Y direction and a side surface 3c2 extending between the front end surface 3c1 and the back surface 3a2.
  • the tip surface 3c1 faces the central processing unit 11 (see FIG. 4) mounted on the main board 4.
  • the protruding portion 3c protrudes from the base plate 3a toward the central processing unit 11.
  • the size of the tip surface 3c1 is substantially the same as the size of the surface of the central processing unit 11.
  • the tip surface 3c1 and the central processing unit 11 are thermally connected via heat conductive grease or the like.
  • the tip surface 3c1 is also referred to as a top surface, a heat transfer surface, or the like.
  • the tip surface 3c1 is not limited to this example, and may be provided in a state of being in direct contact with the central processing unit 11.
  • the central processing unit 11 is an example of a first heating element.
  • the side surface 3c2 faces the space between the main substrate 4 and the base plate 3a.
  • the side surface 3c2 is inclined toward the center of the front end surface 3c1 as it is separated from the back surface 3a2 in the Y direction.
  • the protruding portion 3c has a substantially trapezoidal cross section. With such a side surface 3c2, the protrusion 3c has improved moldability due to the draft of the mold, and the surface area of the protrusion 3c is increased.
  • the plurality of boss portions 3g each project from the base plate 3a in the Y direction.
  • the boss portion 3g is provided adjacent to the two diagonal corner portions of the protruding portion 3c.
  • a connector such as a screw or a bolt that connects the heat sink 3 and the main board 4 is attached to the boss portion 3g.
  • the heat sink 3 is screwed closer to the protrusion 3c by the boss portion 3g, so that the protrusion 3c and the central processing unit 11 are separated from each other in the Y direction to prevent the heat transfer property from being lowered. ..
  • the height of the boss portion 3g in the Y direction is lower than the height of the protruding portion 3c and the boss portion 3e in the Y direction.
  • Each of the plurality of boss portions 3e protrudes in the Y direction from the base plate 3a and is interposed between the base plate 3a and the main substrate 4.
  • the boss portion 3e is positioned so as to overlap the above-mentioned stud 22d (see FIG. 4) when viewed in the Y direction. That is, the coupling tool 19 for co-fastening the heat sink 3 and the main substrate 4 described above is attached to the boss portion 3e.
  • the boss portions 3e and 3g are examples of the second boss portion.
  • the plurality of fins 3f project from the base plate 3a in the Y direction, and are arranged at intervals in the X direction.
  • the fin 3f faces the space between the main substrate 4 and the base plate 3a.
  • the height of the fin 3f in the Y direction is lower than the height of the protruding portion 3c in the Y direction.
  • such fins 3f increase the surface area of the heat sink 3 and reinforce the back surface 3a2 of the base plate 3a.
  • the fin 3b is an example of the second fin, and is also referred to as a heat radiating portion, a bead, or the like.
  • FIG. 4 is a YZ cross-sectional view of the electronic device 1 of FIG.
  • the middle frame 22 has a protruding wall 22c.
  • the protruding wall 22c protrudes from the inner wall 22a in the opposite direction in the Y direction, and is bent so as to extend along the main substrate 4 at a position away from the inner wall 22a.
  • the protruding wall 22c faces the main storage device 12 mounted on the main board 4. In other words, the protruding wall 22c projects from the middle wall 22a toward the main storage device 12.
  • the protruding wall 22c is connected to the inner wall 22a by a connector 22f such as a screw or a bolt.
  • the inner wall 22a is also referred to as a first sheet metal or the like, and the protruding wall 22c is also referred to as a second sheet metal or the like.
  • the protruding wall 22c and the main storage device 12 are thermally connected via the heat conductive member 30.
  • the heat of the main storage device 12 can be released to the middle frame 22 by heat diffusion through the heat conductive member 30.
  • the main storage device 12 is an example of a second heating element.
  • the main storage device 12 is mounted on the surface of the main board 4 opposite to the central processing unit 11 and is positioned so as to be offset from the central processing unit 11 when viewed in the Y direction.
  • the heat conductive member 30 has a grease 31 and a sheet 32.
  • the grease 31 is applied to the end face of the protruding wall 22c in the direction opposite to the Y direction.
  • the grease 31 is a heat conductive grease and contains a conductive material.
  • the sheet 32 extends along the main substrate 4 and is interposed between the grease 31 and the main storage device 12.
  • the sheet 32 is a thermal sheet and has thermal conductivity and insulating properties. In the present embodiment, when such a sheet 32 is sandwiched between the main storage device 12 and the grease 31, the grease 31 comes into contact with the terminals of the main storage device 12, the terminals of the main board 4, and the like to conduct conduction. It is suppressed.
  • the storage holder 16 has a bottom wall 16a that supports the auxiliary storage device 13, the sub-board 8, and the like.
  • the bottom wall 16a extends along the middle frame 22 and covers the side surface 13a of the auxiliary storage device 13 in the opposite direction in the Y direction and the surface of the sub-board 8 in the opposite direction in the Y direction.
  • the bottom wall 16a is interposed in the middle of the heat transfer path from the heating element such as the middle frame 22, the main storage device 12, the central processing unit 11 and the like to the auxiliary storage device 13 and the sub-board 8. ..
  • the storage holder 16 is made of a heat insulating material such as synthetic resin.
  • the bottom wall 16a is an example of a heat insulating wall, and the side surface 13a is an example of a second surface.
  • FIG. 5 is an XY cross-sectional view of the electronic device 1 of FIG.
  • the heat sink 3 is provided with a recess 3h corresponding to the protrusion 3c.
  • the recess 3h is recessed in the Y direction from the surface 3a1 on the opposite side of the protruding portion 3c from the central processing unit 11, that is, in the direction opposite to the Y direction.
  • the surface 3a1 is an example of the first surface.
  • the fin 3b has a plurality of fins 3b1 and a plurality of fins 3b2.
  • the fins 3b1 extend from the surface 3a1 in the opposite direction in the Y direction, and the fins 3b2 extend from the bottom 3h1 of the recess 3h in the opposite direction in the Y direction.
  • the length of the fin 3b1 in the Y direction and the length of the fin 3b2 in the Y direction are substantially the same. Therefore, the tip of the fin 3b is provided with a recess recessed in the Y direction by the fin 3b2.
  • the fins 3b2 overlapping the central processing unit 11 in the Y direction are arranged farther from the right wall 2f of the housing 2.
  • the fins 3b2 is covered from the opposite direction in the Y direction by a portion of the right wall 2f where the vent 2s is not provided (see FIG. 1).
  • the flow velocity of the air flowing near the fins 3b2 is increased. Therefore, according to the present embodiment, the cooling effect (heat dissipation effect) by air can be further enhanced in the vicinity of the fins 3b2, which tends to have the highest temperature among the heat sinks 3.
  • the sub-board 5, the main board 4, and the heat sink 3 are assembled in this order on one side of the middle frame 22, that is, in the direction opposite to the Y direction (S1).
  • S1 is an example of the first step.
  • the sub-board 6 and the storage holder 16 are assembled in this order on the other side of the middle frame 22, that is, in the Y direction, and the sub-boards 8 and 9 are assembled to assemble the electronic device unit 10 (S3).
  • S3 is an example of the third step.
  • the electronic device unit 10 is assembled to the base cover 21 of the housing 2 (S4). Then, the top cover 23, the light cover 24, and the bottom cover 25 are assembled to assemble the electronic device 1 (S5).
  • S4 is an example of the fourth step, and S5 is an example of the fifth step.
  • the heat sink 3 protrudes from the base plate 3a and the base plate 3a in the Y direction (first direction), and is mounted on the main board 4 (first board).
  • a boss portion 3e (second boss portion) to which a connector 19 for connecting the main substrate 4 and the base plate 3a can be attached is provided.
  • the base plate 3a and thus the heat sink 3 are combined with the main board 4. It can be configured to be larger, such as the equivalent size. As a result, the surface area of the heat sink 3 can be increased, and the temperature rise of the central processing unit 11 can be more effectively suppressed even in the fanless electronic device 1. Further, since the heat sink 3 can be fixed to the housing 2 and the main substrate 4 by the boss portions 3d, 3e and the couplers 18, 19 protruding from the base plate 3a, even a relatively large heat sink 3 can be more reliably performed. It can be held more firmly.
  • the ground pattern of the main board 4 can be electrically connected to the heat sink 3 and thus to the housing 2 by utilizing the fastening of the couplers 18 and 19 and the boss portions 3d and 3e.
  • the housing 2 functions as a ground member for the heat sink 3 and the main board 4, and it is possible to take measures against EMI (Electro Magnetic Interference).
  • EMI Electro Magnetic Interference
  • the protruding portion 3c is provided with a recess 3h recessed in the Y direction from the surface 3a1 (first surface) on the opposite side of the central processing unit 11 and is a fin as a part of the fin 3b.
  • the 3b2 protrudes from the bottom 3h1 of the recess 3h in the opposite direction in the Y direction.
  • the fins 3b2 protruding from the bottom 3h1 of the recess 3h are formed on the right wall 2f of the housing 2. Can be placed farther away from. As a result, it is possible to suppress the temperature rise of the right wall 2f locally due to heat radiation (radiation) from the fins 3b2, which tends to have a higher temperature than the fins 3b1 among the fins 3b. Further, if the tips of the plurality of fins 3b in the opposite directions in the Y direction are aligned, the length of the fins 3b2 can be made longer than the length of the fins 3b1. As a result, the surface area of the heat sink 3 can be further increased, and in some cases, the cooling effect (heat dissipation effect) of the central processing unit 11 can be further enhanced.
  • the heat sink 3 includes a plurality of fins 3f (second fins) protruding in the Y direction from the base plate 3a and arranged in the X direction.
  • the surface area of the heat sink 3 can be increased by the fins 3f, so that the cooling effect (heat dissipation effect) of the central processing unit 11 can be further enhanced.
  • the fins 3f can reinforce the back surface 3a2 of the base plate 3a opposite to the fins 3b, and thus can prevent the base plate 3a from being deformed to the fins 3b side due to heat shrinkage.
  • the electronic device unit 10 includes a heat sink 3, a main board 4 on which a central processing unit 11 provided in a state of being thermally connected to a protruding portion 3c of the heat sink 3 is mounted, and a main board.
  • the middle frame 22 mounting base located in the Y direction opposite to the heat sink 3 of the substrate 4, the sub substrate 6 (second substrate) located in the Y direction of the middle frame 22, and the Y of the sub substrate 6.
  • the storage holder 16 which is located in the direction and holds the auxiliary storage device 13 and the storage holder 16 are integrated and can be attached to the housing 2.
  • the electronic device 1 can be configured more compactly.
  • the middle frame 22 includes the middle wall 22a located between the main board 4 and the sub board 6, and the main board 4 and the middle frame 22 protruding from the middle wall 22a in the opposite direction in the Y direction.
  • the stud 22d (first stud) to which the fitting 19 for connecting the two is attached, and the stud 22e (second stud) to which the fitting 19 for connecting the sub-board 6 and the middle frame 22 protruding from the inner wall 22a in the Y direction can be attached. Studs) and have.
  • the main substrate 4 and the sub substrate 6 can be relatively easily fixed to the middle frame 22 by the studs 22d, 22e and the coupler 19 protruding from the inner wall 22a.
  • the ground pattern of the main board 4 and the ground pattern of the sub board 6 can be electrically connected to the middle frame 22 by utilizing the fastening of the coupler 19 and the studs 22d and 22e.
  • the middle frame 22 functions as a ground member for the main board 4 and the sub board 6, and it is possible to take measures against EMI (Electro Magnetic Interference).
  • EMI Electro Magnetic Interference
  • the main memory device 12 (second heating element) mounted on the main board 4 and provided in a state of being thermally connected to the middle frame 22 via the heat conductive member 30 is provided.
  • the heat conductive member 30 has a grease 31 applied to the middle frame 22 and a sheet 32 interposed between the grease 31 and the main storage device 12.
  • the heat of the main storage device 12 can be released to the middle frame 22 by heat diffusion through the heat conductive member 30, so that the temperature rise of the main storage device 12 can be suppressed more effectively. be able to. Further, the sheet 32 interposed between the grease 31 and the main storage device 12 can prevent the grease 31 from coming into contact with the terminals of the main storage device 12, the terminals of the main board 4, and the like to conduct conduction.
  • the storage holder 16 has at least 16a (bottom wall) covering the side surface 13a (second surface) of the auxiliary storage device 13 in the direction opposite to the Y direction.

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Abstract

A heat sink according to an embodiment comprises a base plate, a protrusion, first fins, a first boss part, and a second boss part. The protrusion can protrude from the base plate in a first direction intersecting the base plate, and can be thermally connected to a first heating element mounted on a first substrate. The plurality of first fins protrude from the base plate in a direction opposite to the first direction, and are aligned in a second direction intersecting the first direction. The first boss part can protrude from the base plate in a direction opposite to the first fins in the first direction, and can attach a connector for connecting the outer wall of the housing and the base plate. The second boss part may protrude from the base plate in the first direction, and can attach a connector for connecting the first substrate and the base plate.

Description

ヒートシンク、および電子機器ユニットHeat sink and electronics unit
　本発明の実施形態は、ヒートシンク、および電子機器ユニットに関する。 An embodiment of the present invention relates to a heat sink and an electronic device unit.
　従来、基板に実装された発熱体と熱的に接続されたベースプレートと、ベースプレートから発熱体とは反対側に突出した複数のフィンと、を備えたヒートシンクが、知られている。 Conventionally, a heat sink having a base plate thermally connected to a heating element mounted on a substrate and a plurality of fins protruding from the base plate to the opposite side of the heating element is known.
特開２０１９－６７８８８号公報Japanese Unexamined Patent Publication No. 2019-67888
　この種のヒートシンクでは、ファンレスの電子機器に適応できるような、より不都合の少ない新規な構成が得られれば、有益である。 With this type of heat sink, it would be beneficial if a new configuration with less inconvenience could be obtained that could be adapted to fanless electronic devices.
　実施形態のヒートシンクは、ベースプレートと、突出部と、第一フィンと、第一ボス部と、第二ボス部と、を備える。突出部は、ベースプレートから当該ベースプレートと交差した第一方向に突出し、第一基板に実装された第一発熱体と熱的に接続可能である。複数の第一フィンは、ベースプレートから第一方向の反対方向に突出し、第一方向と交差した第二方向に並ぶ。第一ボス部は、ベースプレートから第一フィンよりも第一方向の反対方向に突出し、筐体の外壁とベースプレートとを結合する結合具を取付可能である。第二ボス部は、ベースプレートから第一方向に突出し、第一基板とベースプレートとを結合する結合具を取付可能である。 The heat sink of the embodiment includes a base plate, a protruding portion, a first fin, a first boss portion, and a second boss portion. The protrusion protrudes from the base plate in the first direction intersecting the base plate, and can be thermally connected to the first heating element mounted on the first substrate. The plurality of first fins project from the base plate in the opposite direction of the first direction and line up in the second direction intersecting the first direction. The first boss portion projects from the base plate in the direction opposite to the first fin in the first direction, and a connector for connecting the outer wall of the housing and the base plate can be attached. The second boss portion projects in the first direction from the base plate, and a binder for connecting the first substrate and the base plate can be attached.
図１は、実施形態のヒートシンクを含む電子機器ユニットを搭載した電子機器の例示的な斜視図である。FIG. 1 is an exemplary perspective view of an electronic device equipped with an electronic device unit including the heat sink of the embodiment. 図２は、実施形態のヒートシンクを含む電子機器ユニットの例示的な斜視図である。FIG. 2 is an exemplary perspective view of an electronic device unit including the heat sink of the embodiment. 図３は、実施形態のヒートシンクの裏面側からの例示的な斜視図である。FIG. 3 is an exemplary perspective view of the heat sink of the embodiment from the back surface side. 図４は、図１の電子機器の例示的かつ模式的なＹＺ断面図である。FIG. 4 is an exemplary and schematic YZ cross-sectional view of the electronic device of FIG. 図５は、図１の電子機器の例示的かつ模式的なＸＹ断面図である。FIG. 5 is an exemplary and schematic XY cross-sectional view of the electronic device of FIG.
　以下、本発明の例示的な実施形態が開示される。以下に示される実施形態の構成、ならびに当該構成によってもたらされる作用および効果は、一例である。本発明は、以下の実施形態に開示される構成以外によっても実現可能である。また、本発明によれば、構成によって得られる種々の効果（派生的な効果も含む）のうち少なくとも一つを得ることが可能である。 Hereinafter, exemplary embodiments of the present invention will be disclosed. The configurations of the embodiments shown below, as well as the actions and effects produced by the configurations, are examples. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Further, according to the present invention, it is possible to obtain at least one of various effects (including derivative effects) obtained by the configuration.
　なお、本明細書では、序数は、部品や、部材、部位、位置、方向等を区別するためだけに用いられており、順番や優先度を示すものではない。 In this specification, the ordinal number is used only for distinguishing parts, members, parts, positions, directions, etc., and does not indicate the order or priority.
［実施形態］
　図１は、後述するヒートシンク３を含む電子機器ユニット１０（図２参照）を搭載した電子機器１の斜視図である。なお、以下の各図では、便宜上、互いに直交する三方向が定義されている。Ｘ方向は、電子機器１の奥行方向（前後方向）に沿うとともに、ヒートシンク３の横幅方向に沿う。Ｙ方向は、電子機器１の幅方向（左右方向）に沿うとともに、ヒートシンク３の厚さ方向に沿う。Ｚ方向は、電子機器１の高さ方向（上下方向）に沿うとともに、ヒートシンク３の縦幅方向に沿う。 [Embodiment]
FIG. 1 is a perspective view of an electronic device 1 equipped with an electronic device unit 10 (see FIG. 2) including a heat sink 3 described later. In each of the following figures, for convenience, three directions orthogonal to each other are defined. The X direction is along the depth direction (front-back direction) of the electronic device 1 and along the width direction of the heat sink 3. The Y direction is along the width direction (horizontal direction) of the electronic device 1 and along the thickness direction of the heat sink 3. The Z direction is along the height direction (vertical direction) of the electronic device 1 and along the vertical width direction of the heat sink 3.
　図１に示されるように、電子機器１は、ファンレスの産業用コンピュータとして構成されており、筐体２や、後述する電子機器ユニット１０（図２参照）等を備えている。なお、電子機器１は、この例には限定されず、デスクトップ型のパーソナルコンピュータや、映像表示装置、テレビジョン受像機、ゲーム機、情報記憶装置等、種々の電子機器１として構成することができる。 As shown in FIG. 1, the electronic device 1 is configured as a fanless industrial computer, and includes a housing 2, an electronic device unit 10 (see FIG. 2) described later, and the like. The electronic device 1 is not limited to this example, and can be configured as various electronic devices 1 such as a desktop personal computer, a video display device, a television receiver, a game machine, and an information storage device. ..
　筐体２は、Ｙ方向に短い直方体状の箱型に構成されている。筐体２は、底壁２ａや、天壁２ｂ、前壁２ｃ、左壁２ｄ、後壁２ｅ、右壁２ｆ等の複数の壁部を有している。底壁２ａは、下壁等とも称され、天壁２ｂは、上壁等とも称される。また、前壁２ｃ、左壁２ｄ、後壁２ｅ、および右壁２ｆは、側壁や周壁等とも称される。 The housing 2 is configured in a rectangular parallelepiped box shape that is short in the Y direction. The housing 2 has a plurality of wall portions such as a bottom wall 2a, a top wall 2b, a front wall 2c, a left wall 2d, a rear wall 2e, and a right wall 2f. The bottom wall 2a is also referred to as a lower wall or the like, and the top wall 2b is also referred to as an upper wall or the like. Further, the front wall 2c, the left wall 2d, the rear wall 2e, and the right wall 2f are also referred to as a side wall, a peripheral wall, and the like.
　底壁２ａおよび天壁２ｂは、いずれも、Ｚ方向と直交する方向（ＸＹ平面）に沿って延びており、Ｚ方向に間隔をあけて互いに平行に設けられている。底壁２ａは、筐体２の下端部を構成し、天壁２ｂは、筐体２の上端部を構成している。底壁２ａには、Ｚ方向の反対方向に突出し、筐体２を不図示の棚や、机、台等の設置面から離間した状態に支持する複数のゴム脚２ｈが設けられている。 Both the bottom wall 2a and the top wall 2b extend along a direction (XY plane) orthogonal to the Z direction, and are provided parallel to each other at intervals in the Z direction. The bottom wall 2a constitutes the lower end of the housing 2, and the top wall 2b constitutes the upper end of the housing 2. The bottom wall 2a is provided with a plurality of rubber legs 2h that project in the opposite direction in the Z direction and support the housing 2 in a state of being separated from a shelf (not shown) or an installation surface such as a desk or a table.
　左壁２ｄおよび右壁２ｆは、いずれも、Ｙ方向と直交する方向（ＸＺ平面）に沿って延びており、Ｙ方向に間隔をあけて互いに平行に設けられている。左壁２ｄは、底壁２ａおよび天壁２ｂのＹ方向の端部の間に亘り、右壁２ｆは、底壁２ａおよび天壁２ｂのＹ方向の反対方向の端部の間に亘っている。左壁２ｄは、筐体２の左端部を構成し、右壁２ｆは、筐体２の右端部を構成している。 Both the left wall 2d and the right wall 2f extend along a direction (XZ plane) orthogonal to the Y direction, and are provided parallel to each other with an interval in the Y direction. The left wall 2d extends between the bottom wall 2a and the top wall 2b in the Y direction, and the right wall 2f extends between the bottom wall 2a and the top wall 2b in the opposite direction in the Y direction. .. The left wall 2d constitutes the left end portion of the housing 2, and the right wall 2f constitutes the right end portion of the housing 2.
　また、左壁２ｄには、Ｙ方向に突出した複数のゴム脚２ｈ（図４参照）が設けられうる。本実施形態では、電子機器１は、底壁２ａのゴム脚２ｈが設置面と接した縦置きの姿勢と、左壁２ｄのゴム脚２ｈが設置面と接した横置きの姿勢と、で使用可能に構成されている。なお、ゴム脚２ｈは、筐体２に対して着脱可能に取り付けられ、一方の姿勢で使用される場合に、他方の姿勢で使用されるゴム脚２ｈが取り外されてもよい。 Further, the left wall 2d may be provided with a plurality of rubber legs 2h (see FIG. 4) protruding in the Y direction. In the present embodiment, the electronic device 1 is used in a vertical posture in which the rubber legs 2h of the bottom wall 2a are in contact with the installation surface and a horizontal posture in which the rubber legs 2h of the left wall 2d are in contact with the installation surface. It is configured to be possible. The rubber legs 2h are detachably attached to the housing 2, and when used in one posture, the rubber legs 2h used in the other posture may be removed.
　また、右壁２ｆは、筐体２内に収容される後述するヒートシンク３と対向して位置されている。本実施形態では、右壁２ｆは、Ｙ方向に貫通するボルトやネジ等の複数の結合具１８によってヒートシンク３のボス部３ｄと結合される。右壁２ｆは、外壁の一例である。なお、図１に示されるように、本実施形態では、結合具１８によって右壁２ｆとヒートシンク３とが三箇所で固定されているが、結合具１８（ボス部３ｄ）の数はこの例には限定されず、一つや、二つ、四つ以上であってもよい。 Further, the right wall 2f is positioned so as to face the heat sink 3 described later, which is housed in the housing 2. In the present embodiment, the right wall 2f is coupled to the boss portion 3d of the heat sink 3 by a plurality of coupling tools 18 such as bolts and screws penetrating in the Y direction. The right wall 2f is an example of an outer wall. As shown in FIG. 1, in the present embodiment, the right wall 2f and the heat sink 3 are fixed at three places by the coupling tool 18, but the number of coupling tools 18 (boss portion 3d) is in this example. Is not limited, and may be one, two, four or more.
　前壁２ｃおよび後壁２ｅは、いずれも、Ｘ方向と直交する方向（ＹＺ平面）に沿って延びており、Ｘ方向に間隔をあけて互いに平行に設けられている。前壁２ｃは、底壁２ａおよび天壁２ｂのＸ方向の端部の間に亘り、後壁２ｅは、底壁２ａおよび天壁２ｂのＸ方向の反対方向の端部の間に亘っている。前壁２ｃは、筐体２の前端部を構成し、後壁２ｅは、筐体２の後端部を構成している。前壁２ｃには、補助記憶装置１３や、電源ボタン１４、各種のコネクタ１５等が設けられている。 Both the front wall 2c and the rear wall 2e extend along the direction orthogonal to the X direction (YZ plane), and are provided parallel to each other at intervals in the X direction. The front wall 2c extends between the bottom wall 2a and the end of the top wall 2b in the X direction, and the rear wall 2e extends between the end of the bottom wall 2a and the top wall 2b in the opposite direction in the X direction. .. The front wall 2c constitutes the front end portion of the housing 2, and the rear wall 2e constitutes the rear end portion of the housing 2. The front wall 2c is provided with an auxiliary storage device 13, a power button 14, various connectors 15, and the like.
　また、底壁２ａ、天壁２ｂ、左壁２ｄ、および右壁２ｆには、それぞれ、通気口２ｓが設けられている。通気口２ｓは、各壁部を貫通する複数の小孔が集まった部分として構成されている。本実施形態では、底壁２ａ、天壁２ｂ、左壁２ｄ、および右壁２ｆに設けられた通気口２ｓによって、上述した縦置きの姿勢と横置きの姿勢とのそれぞれで、空気の対流によって筐体２内の発熱部品を冷却可能である。 Further, the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f are each provided with ventilation holes 2s. The vent 2s is configured as a portion in which a plurality of small holes penetrating each wall portion are gathered. In the present embodiment, the ventilation holes 2s provided on the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f allow air convection in each of the above-mentioned vertical posture and horizontal posture. The heat generating component in the housing 2 can be cooled.
　また、筐体２は、ベースカバー２１や、トップカバー２３、ライトカバー２４、ボトムカバー２５、後述するミドルフレーム２２（図２参照）等の複数の部品（分割体）の組み合わせによって構成されている。ベースカバー２１、トップカバー２３、ライトカバー２４、ボトムカバー２５、およびミドルフレーム２２は、アルミニウム等の金属材料によって作られる。 Further, the housing 2 is composed of a combination of a plurality of parts (divided bodies) such as a base cover 21, a top cover 23, a light cover 24, a bottom cover 25, and a middle frame 22 (see FIG. 2) described later. .. The base cover 21, top cover 23, light cover 24, bottom cover 25, and middle frame 22 are made of a metal material such as aluminum.
　ベースカバー２１は、底壁２ａの一部や、前壁２ｃ、左壁２ｄ等を有している。トップカバー２３は、天壁２ｂや、左壁２ｄ、後壁２ｅ、および右壁２ｆのそれぞれの一部（上側部分）等を有している。ライトカバー２４は、右壁２ｆの一部（中央部分）や、後壁２ｅ等を有している。ボトムカバー２５は、右壁２ｆの一部（下側部分）や、底壁２ａの一部等を有している。ベースカバー２１、トップカバー２３、ライトカバー２４、およびボトムカバー２５は、ネジ等の結合具２０によって互いに結合（一体化）されている。 The base cover 21 has a part of the bottom wall 2a, the front wall 2c, the left wall 2d, and the like. The top cover 23 has a top wall 2b, a part (upper side portion) of each of the left wall 2d, the rear wall 2e, and the right wall 2f. The light cover 24 has a part (central portion) of the right wall 2f, a rear wall 2e, and the like. The bottom cover 25 has a part (lower part) of the right wall 2f, a part of the bottom wall 2a, and the like. The base cover 21, top cover 23, light cover 24, and bottom cover 25 are connected (integrated) to each other by a binder 20 such as a screw.
　図２は、電子機器ユニット１０の斜視図である。図２に示されるように、電子機器ユニット１０は、ミドルフレーム２２や、ヒートシンク３、メイン基板４、複数のサブ基板５～９、ストレージホルダ１６等を有している。電子機器ユニット１０は、上述したミドルフレーム２２をベースに、ヒートシンク３、メイン基板４、複数のサブ基板５～９、およびストレージホルダ１６が積層されてブロック化されている。ミドルフレーム２２は、取付ベースの一例である。 FIG. 2 is a perspective view of the electronic device unit 10. As shown in FIG. 2, the electronic device unit 10 includes a middle frame 22, a heat sink 3, a main board 4, a plurality of sub boards 5 to 9, a storage holder 16, and the like. The electronic device unit 10 is a block in which a heat sink 3, a main board 4, a plurality of sub boards 5 to 9, and a storage holder 16 are laminated based on the middle frame 22 described above. The middle frame 22 is an example of a mounting base.
　ミドルフレーム２２は、中壁２２ａや、複数のスタッド２２ｄ，２２ｅ、後述する突出壁２２ｃ（図４参照）等を有している。中壁２２ａは、電子機器ユニット１０のＹ方向の略中央部、具体的にはメイン基板４とサブ基板６との間に位置されている。中壁２２ａは、Ｙ方向と直交する方向（ＸＺ平面）に沿って延びており、上述した筐体２の左壁２ｄおよび右壁２ｆと平行である。中壁２２ａは、筐体２内をＹ方向に複数の空間に仕切っている。中壁２２ａは、仕切壁や、隔壁等とも称される。 The middle frame 22 has an inner wall 22a, a plurality of studs 22d and 22e, a protruding wall 22c described later (see FIG. 4), and the like. The inner wall 22a is located at a substantially central portion of the electronic device unit 10 in the Y direction, specifically between the main substrate 4 and the sub substrate 6. The inner wall 22a extends along a direction (XZ plane) orthogonal to the Y direction, and is parallel to the left wall 2d and the right wall 2f of the housing 2 described above. The inner wall 22a partitions the inside of the housing 2 into a plurality of spaces in the Y direction. The inner wall 22a is also referred to as a partition wall, a partition wall, or the like.
　スタッド２２ｄは、中壁２２ａからＹ方向の反対方向に突出し、中壁２２ａとメイン基板４との間に介在されている。本実施形態では、中壁２２ａには、互いに間隔をあけて複数のスタッド２２ｄが設けられている。スタッド２２ｄの頭部は、カシメ加工等によって中壁２２ａに圧入されている。スタッド２２ｄは、第一スタッドの一例である。 The stud 22d protrudes from the inner wall 22a in the opposite direction in the Y direction and is interposed between the inner wall 22a and the main substrate 4. In the present embodiment, the inner wall 22a is provided with a plurality of studs 22d at intervals from each other. The head of the stud 22d is press-fitted into the inner wall 22a by caulking or the like. The stud 22d is an example of the first stud.
　また、スタッド２２ｄの軸部には、結合具１９の雄ネジ部と噛み合う雌ネジ部が設けられている。結合具１９は、ネジやボルト等であり、ヒートシンク３およびメイン基板４をＹ方向に貫通した状態で、スタッド２２ｄと結合されている。すなわち、本実施形態では、結合具１９によってヒートシンク３とメイン基板４とが共締めされている。メイン基板４は、複数のスタッド２２ｄによって、中壁２２ａからＹ方向の反対方向に離間した状態で、中壁２２ａと平行に支持されている。 Further, the shaft portion of the stud 22d is provided with a female screw portion that meshes with the male screw portion of the fitting 19. The coupler 19 is a screw, a bolt, or the like, and is coupled to the stud 22d in a state of penetrating the heat sink 3 and the main substrate 4 in the Y direction. That is, in the present embodiment, the heat sink 3 and the main substrate 4 are fastened together by the coupling tool 19. The main substrate 4 is supported by a plurality of studs 22d in parallel with the inner wall 22a in a state of being separated from the inner wall 22a in the opposite direction in the Y direction.
　スタッド２２ｅは、中壁２２ａからＹ方向に突出し、中壁２２ａとサブ基板６との間に介在されている。本実施形態では、中壁２２ａには、互いに間隔をあけて複数のスタッド２２ｅが設けられている。また、スタッド２２ｅは、Ｙ方向に見た場合に、スタッド２２ｄとずれて位置されている。スタッド２２ｅの頭部は、カシメ加工等によって中壁２２ａに圧入されている。スタッド２２ｅは、第二スタッドの一例である。 The stud 22e protrudes from the inner wall 22a in the Y direction and is interposed between the inner wall 22a and the sub-board 6. In the present embodiment, the inner wall 22a is provided with a plurality of studs 22e at intervals from each other. Further, the stud 22e is positioned so as to be offset from the stud 22d when viewed in the Y direction. The head of the stud 22e is press-fitted into the inner wall 22a by caulking or the like. The stud 22e is an example of the second stud.
　また、スタッド２２ｅの軸部には、結合具１９（図４参照）の雄ネジ部と噛み合う雌ネジ部が設けられている。結合具１９は、ネジやボルト等であり、少なくともサブ基板６をＹ方向に貫通した状態で、スタッド２２ｅと結合されている。サブ基板６は、複数のスタッド２２ｅによって、中壁２２ａからＹ方向に離間した状態で、中壁２２ａと平行に支持されている。なお、結合具１９は、この例には限定されず、サブ基板６およびストレージホルダ１６を共締めしてもよい。 Further, the shaft portion of the stud 22e is provided with a female screw portion that meshes with the male screw portion of the fitting 19 (see FIG. 4). The coupler 19 is a screw, a bolt, or the like, and is coupled to the stud 22e in a state where it penetrates at least the sub-board 6 in the Y direction. The sub-board 6 is supported by a plurality of studs 22e in parallel with the inner wall 22a in a state of being separated from the inner wall 22a in the Y direction. The coupler 19 is not limited to this example, and the sub-board 6 and the storage holder 16 may be fastened together.
　図２に示されるように、サブ基板５は、ミドルフレーム２２の開口部２２ｂに収容されている。サブ基板５は、ミドルフレーム２２と平行に延びており、ネジやボルト等の結合具によってミドルフレーム２２に結合されている。サブ基板５には、複数の電子部品や、コネクタ１５等が設けられている。サブ基板５は、ＤＩＯ基板や、拡張基板等とも称される。 As shown in FIG. 2, the sub-board 5 is housed in the opening 22b of the middle frame 22. The sub-board 5 extends parallel to the middle frame 22 and is connected to the middle frame 22 by a connector such as a screw or a bolt. The sub-board 5 is provided with a plurality of electronic components, a connector 15, and the like. The sub-board 5 is also referred to as a DIO board, an expansion board, or the like.
　メイン基板４は、ミドルフレーム２２のＹ方向の反対方向に位置されている。メイン基板４は、ミドルフレーム２２と平行に延びており、上述したスタッド２２ｄおよび結合具１９によってミドルフレーム２２と機械的に接続されている。また、本実施形態では、結合具１９とスタッド２２ｄとが締結されることにより、メイン基板４のグランドパターンとミドルフレーム２２およびヒートシンク３とが電気的にも接続されている。 The main board 4 is located in the direction opposite to the Y direction of the middle frame 22. The main substrate 4 extends parallel to the middle frame 22 and is mechanically connected to the middle frame 22 by the stud 22d and the coupler 19 described above. Further, in the present embodiment, the ground pattern of the main substrate 4 and the middle frame 22 and the heat sink 3 are electrically connected by fastening the coupling tool 19 and the stud 22d.
　また、メイン基板４には、後述する中央演算処理装置１１（図４参照）や、主記憶装置１２（図４参照）等の複数の電子部品が実装されている。メイン基板４内の配線とこれら複数の電子部品とによって、電子機器１の制御回路の少なくとも一部が構成されている。メイン基板４は、第一基板の一例である。 Further, a plurality of electronic components such as a central processing unit 11 (see FIG. 4) and a main storage device 12 (see FIG. 4), which will be described later, are mounted on the main board 4. At least a part of the control circuit of the electronic device 1 is composed of the wiring in the main board 4 and the plurality of electronic components. The main board 4 is an example of the first board.
　サブ基板６は、ミドルフレーム２２のＹ方向に位置されている。サブ基板６は、ミドルフレーム２２と平行に延びており、上述したスタッド２２ｅおよび結合具１９によってミドルフレーム２２と機械的に接続されている。また、本実施形態では、結合具１９とスタッド２２ｅとが締結されることにより、サブ基板６のグランドパターンとミドルフレーム２２とが電気的にも接続されている。サブ基板６には、複数の電子部品や、コネクタ１５等が設けられている。サブ基板６は、第二基板の一例であり、ＩＯ基板や、拡張基板等とも称される。 The sub-board 6 is located in the Y direction of the middle frame 22. The sub-board 6 extends parallel to the middle frame 22 and is mechanically connected to the middle frame 22 by the studs 22e and the coupler 19 described above. Further, in the present embodiment, the ground pattern of the sub-board 6 and the middle frame 22 are also electrically connected by fastening the coupling tool 19 and the stud 22e. The sub-board 6 is provided with a plurality of electronic components, a connector 15, and the like. The sub-board 6 is an example of a second board, and is also referred to as an IO board, an expansion board, or the like.
　図２に示されるように、サブ基板７は、ミドルフレーム２２のＸ方向の反対方向に位置されている。サブ基板７は、ミドルフレーム２２と垂直に延びており、上述した筐体２の後壁２ｅと平行である。サブ基板７は、スタッド２２ｄ，２２ｅおよび結合具１９と同様の構造によってミドルフレーム２２と機械的に接続されている。すなわち、ミドルフレーム２２のＸ方向の反対方向の端部にはＹ方向に沿って延びる不図示の立壁が設けられており、当該立壁からサブ基板７に向かってスタッドが突出している。 As shown in FIG. 2, the sub-board 7 is located in the direction opposite to the X direction of the middle frame 22. The sub-board 7 extends perpendicular to the middle frame 22 and is parallel to the rear wall 2e of the housing 2 described above. The sub-board 7 is mechanically connected to the middle frame 22 by a structure similar to that of the studs 22d and 22e and the connector 19. That is, a vertical wall (not shown) extending along the Y direction is provided at the end of the middle frame 22 in the opposite direction to the X direction, and the studs project from the vertical wall toward the sub-board 7.
　また、本実施形態では、上述した結合具とスタッドとが締結されることにより、サブ基板７のグランドパターンとミドルフレーム２２とが電気的にも接続されている。サブ基板７には、複数の電子部品や、コネクタ７ａ（図５参照）等が設けられている。コネクタ７ａには、サブ基板６やメイン基板４等が差し込まれている。サブ基板７は、バックプレーン基板や、リヤ基板、拡張基板等とも称される。 Further, in the present embodiment, the ground pattern of the sub-board 7 and the middle frame 22 are also electrically connected by fastening the above-mentioned coupling tool and the stud. The sub-board 7 is provided with a plurality of electronic components, a connector 7a (see FIG. 5), and the like. A sub-board 6, a main board 4, and the like are inserted into the connector 7a. The sub-board 7 is also referred to as a backplane board, a rear board, an expansion board, or the like.
　図２に示されるように、サブ基板８は、サブ基板６のＹ方向かつ補助記憶装置１３のＺ方向の反対方向に位置されている。サブ基板８は、サブ基板６およびミドルフレーム２２と平行に延びており、後述するストレージホルダ１６の底壁１６ａに支持されている。サブ基板８には、複数の電子部品や、電源回路等が設けられている。サブ基板８は、電源基板等とも称される。 As shown in FIG. 2, the sub-board 8 is located in the Y direction of the sub-board 6 and opposite to the Z direction of the auxiliary storage device 13. The sub-board 8 extends in parallel with the sub-board 6 and the middle frame 22, and is supported by the bottom wall 16a of the storage holder 16 described later. The sub-board 8 is provided with a plurality of electronic components, a power supply circuit, and the like. The sub-board 8 is also referred to as a power supply board or the like.
　サブ基板９は、ミドルフレーム２２のＺ方向の反対方向に位置されている。サブ基板９は、ミドルフレーム２２と垂直に延びており、上述した筐体２の底壁２ａと平行である。サブ基板９には、複数の電子部品等が実装されており、サブ基板６のコネクタ６ａ（図４参照）に差し込まれている。サブ基板９は、ＰＣＩ基板や、拡張基板等とも称される。 The sub-board 9 is located in the direction opposite to the Z direction of the middle frame 22. The sub-board 9 extends perpendicular to the middle frame 22 and is parallel to the bottom wall 2a of the housing 2 described above. A plurality of electronic components and the like are mounted on the sub-board 9, and are inserted into the connector 6a (see FIG. 4) of the sub-board 6. The sub-board 9 is also referred to as a PCI board, an expansion board, or the like.
　ストレージホルダ１６は、サブ基板６のＹ方向に位置され、電子機器ユニット１０のＹ方向の端部を構成している。ストレージホルダ１６は、上述したサブ基板８や、補助記憶装置１３を支持している。補助記憶装置１３は、ＳＳＤ（solid　state　drive）や、ＨＤＤ（hard　disk　drive）等である。 The storage holder 16 is located in the Y direction of the sub-board 6, and constitutes the end of the electronic device unit 10 in the Y direction. The storage holder 16 supports the sub-board 8 and the auxiliary storage device 13 described above. The auxiliary storage device 13 is an SSD (solid state drive), an HDD (hard disk drive), or the like.
　ヒートシンク３は、メイン基板４のＹ方向の反対方向に位置され、電子機器ユニット１０のＹ方向の反対方向の端部を構成している。ヒートシンク３は、ベースプレート３ａや、複数のフィン３ｂ、複数のボス部３ｄ等を有している。複数のフィン３ｂは、ベースプレート３ａからＹ方向の反対方向に突出し、Ｘ方向に互いに間隔をあけて並んでいる。本実施形態では、Ｙ方向は、第一方向の一例であり、Ｘ方向は、第二方向の一例である。ヒートシンク３は、アルミニウム等の金属材料によって作られる。 The heat sink 3 is located in the direction opposite to the Y direction of the main board 4, and constitutes an end portion of the electronic device unit 10 in the opposite direction in the Y direction. The heat sink 3 has a base plate 3a, a plurality of fins 3b, a plurality of boss portions 3d, and the like. The plurality of fins 3b project from the base plate 3a in the opposite direction in the Y direction, and are arranged at intervals in the X direction. In the present embodiment, the Y direction is an example of the first direction, and the X direction is an example of the second direction. The heat sink 3 is made of a metal material such as aluminum.
　ベースプレート３ａは、メイン基板４と平行に延びている。本実施形態では、ベースプレート３ａの大きさは、メイン基板４の大きさと略同じである。ベースプレート３ａは、メイン基板４と面したＹ方向の裏面３ａ２（図３参照）と、筐体２の右壁２ｆと面したＹ方向の反対方向の表面３ａ１（図２参照）と、を有している。表面３ａ１には、フィン３ｂや、ボス部３ｄ等が設けられている。フィン３ｂは、第一フィンの一例であり、放熱部等とも称される。 The base plate 3a extends parallel to the main substrate 4. In the present embodiment, the size of the base plate 3a is substantially the same as the size of the main substrate 4. The base plate 3a has a back surface 3a2 in the Y direction facing the main substrate 4 (see FIG. 3) and a front surface 3a1 in the opposite direction in the Y direction facing the right wall 2f of the housing 2 (see FIG. 2). ing. The surface 3a1 is provided with fins 3b, a boss portion 3d, and the like. The fin 3b is an example of the first fin, and is also referred to as a heat radiating portion or the like.
　複数のボス部３ｄは、それぞれ、ベースプレート３ａからフィン３ｂよりもＹ方向の反対方向に突出している。ボス部３ｄには、上述した結合具１８の雄ネジ部と噛み合う雌ネジ部が設けられている。結合具１８は、ネジやボルト等であり、筐体２の右壁２ｆをＹ方向に貫通した状態で、ボス部３ｄと結合されている。ボス部３ｄは、第一ボス部の一例である。 Each of the plurality of boss portions 3d protrudes from the base plate 3a in the direction opposite to the Y direction from the fins 3b. The boss portion 3d is provided with a female screw portion that meshes with the male screw portion of the above-mentioned coupling tool 18. The coupler 18 is a screw, a bolt, or the like, and is coupled to the boss portion 3d in a state where it penetrates the right wall 2f of the housing 2 in the Y direction. The boss portion 3d is an example of the first boss portion.
　図３は、ヒートシンク３の裏面３ａ２側からの斜視図である。図３に示されるように、ヒートシンク３は、突出部３ｃや、複数のボス部３ｅ，３ｇ、複数のフィン３ｆ等も有している。 FIG. 3 is a perspective view from the back surface 3a2 side of the heat sink 3. As shown in FIG. 3, the heat sink 3 also has a protruding portion 3c, a plurality of boss portions 3e, 3g, a plurality of fins 3f, and the like.
　突出部３ｃは、ベースプレート３ａからＹ方向に突出している。突出部３ｃは、Ｙ方向の先端面３ｃ１と、先端面３ｃ１と裏面３ａ２との間に亘った側面３ｃ２と、を有している。先端面３ｃ１は、メイン基板４に実装された中央演算処理装置１１（図４参照）と面している。言い換えると、突出部３ｃは、ベースプレート３ａから中央演算処理装置１１に向かって突出している。先端面３ｃ１の大きさは、中央演算処理装置１１の表面の大きさと略同じである。 The protruding portion 3c protrudes from the base plate 3a in the Y direction. The protruding portion 3c has a front end surface 3c1 in the Y direction and a side surface 3c2 extending between the front end surface 3c1 and the back surface 3a2. The tip surface 3c1 faces the central processing unit 11 (see FIG. 4) mounted on the main board 4. In other words, the protruding portion 3c protrudes from the base plate 3a toward the central processing unit 11. The size of the tip surface 3c1 is substantially the same as the size of the surface of the central processing unit 11.
　そして、本実施形態では、先端面３ｃ１と中央演算処理装置１１とが熱伝導グリス等を介して熱的に接続されている。先端面３ｃ１は、頂面や、熱伝達面等とも称される。なお、先端面３ｃ１は、この例には限定されず、中央演算処理装置１１と直接的に接した状態に設けられてもよい。中央演算処理装置１１は、第一発熱体の一例である。 Then, in the present embodiment, the tip surface 3c1 and the central processing unit 11 are thermally connected via heat conductive grease or the like. The tip surface 3c1 is also referred to as a top surface, a heat transfer surface, or the like. The tip surface 3c1 is not limited to this example, and may be provided in a state of being in direct contact with the central processing unit 11. The central processing unit 11 is an example of a first heating element.
　側面３ｃ２は、メイン基板４とベースプレート３ａとの間の空間に面している。本実施形態では、側面３ｃ２は、裏面３ａ２からＹ方向に離れるにつれて先端面３ｃ１の中心部に向かうように傾斜している。言い換えると、突出部３ｃは、略台形状の断面を有している。突出部３ｃは、このような側面３ｃ２によって、金型の抜き勾配による成型性が高められているとともに、突出部３ｃの表面積が増大されている。 The side surface 3c2 faces the space between the main substrate 4 and the base plate 3a. In the present embodiment, the side surface 3c2 is inclined toward the center of the front end surface 3c1 as it is separated from the back surface 3a2 in the Y direction. In other words, the protruding portion 3c has a substantially trapezoidal cross section. With such a side surface 3c2, the protrusion 3c has improved moldability due to the draft of the mold, and the surface area of the protrusion 3c is increased.
　複数のボス部３ｇは、それぞれ、ベースプレート３ａからＹ方向に突出している。本実施形態では、ボス部３ｇは、突出部３ｃにおける対角線上の二つの角部に隣接して設けられている。ボス部３ｇには、ヒートシンク３とメイン基板４とを結合するネジやボルト等の結合具が取り付けられる。 The plurality of boss portions 3g each project from the base plate 3a in the Y direction. In the present embodiment, the boss portion 3g is provided adjacent to the two diagonal corner portions of the protruding portion 3c. A connector such as a screw or a bolt that connects the heat sink 3 and the main board 4 is attached to the boss portion 3g.
　ヒートシンク３は、ボス部３ｇによって突出部３ｃのより近くでネジ留めされることにより、突出部３ｃと中央演算処理装置１１とがＹ方向に離間して伝熱性が低下するのが抑制されている。なお、ボス部３ｇのＹ方向の高さは、突出部３ｃおよびボス部３ｅのＹ方向の高さよりも低い。 The heat sink 3 is screwed closer to the protrusion 3c by the boss portion 3g, so that the protrusion 3c and the central processing unit 11 are separated from each other in the Y direction to prevent the heat transfer property from being lowered. .. The height of the boss portion 3g in the Y direction is lower than the height of the protruding portion 3c and the boss portion 3e in the Y direction.
　複数のボス部３ｅは、それぞれ、ベースプレート３ａからＹ方向に突出し、ベースプレート３ａとメイン基板４との間に介在されている。ボス部３ｅは、Ｙ方向に見た場合に、上述したスタッド２２ｄ（図４参照）と重なって位置されている。すなわち、ボス部３ｅには、上述したヒートシンク３とメイン基板４とを共締めする結合具１９が取り付けられる。ボス部３ｅ，３ｇは、第二ボス部の一例である。 Each of the plurality of boss portions 3e protrudes in the Y direction from the base plate 3a and is interposed between the base plate 3a and the main substrate 4. The boss portion 3e is positioned so as to overlap the above-mentioned stud 22d (see FIG. 4) when viewed in the Y direction. That is, the coupling tool 19 for co-fastening the heat sink 3 and the main substrate 4 described above is attached to the boss portion 3e. The boss portions 3e and 3g are examples of the second boss portion.
　複数のフィン３ｆは、それぞれ、ベースプレート３ａからＹ方向に突出し、Ｘ方向に互いに間隔をあけて並んでいる。フィン３ｆは、メイン基板４とベースプレート３ａとの間の空間に面している。フィン３ｆのＹ方向の高さは、突出部３ｃのＹ方向の高さよりも低い。 The plurality of fins 3f project from the base plate 3a in the Y direction, and are arranged at intervals in the X direction. The fin 3f faces the space between the main substrate 4 and the base plate 3a. The height of the fin 3f in the Y direction is lower than the height of the protruding portion 3c in the Y direction.
　本実施形態では、このようなフィン３ｆによって、ヒートシンク３の表面積が増大されているとともに、ベースプレート３ａの裏面３ａ２が補強されている。フィン３ｂは、第二フィンの一例であり、放熱部や、ビード等とも称される。 In the present embodiment, such fins 3f increase the surface area of the heat sink 3 and reinforce the back surface 3a2 of the base plate 3a. The fin 3b is an example of the second fin, and is also referred to as a heat radiating portion, a bead, or the like.
　図４は、図１の電子機器１のＹＺ断面図である。図４に示されるように、ミドルフレーム２２は、突出壁２２ｃを有している。突出壁２２ｃは、中壁２２ａからＹ方向の反対方向に突出し、かつ中壁２２ａとは離れた位置でメイン基板４に沿って延びるように屈曲している。 FIG. 4 is a YZ cross-sectional view of the electronic device 1 of FIG. As shown in FIG. 4, the middle frame 22 has a protruding wall 22c. The protruding wall 22c protrudes from the inner wall 22a in the opposite direction in the Y direction, and is bent so as to extend along the main substrate 4 at a position away from the inner wall 22a.
　突出壁２２ｃは、メイン基板４に実装された主記憶装置１２と面している。言い換えると、突出壁２２ｃは、中壁２２ａから主記憶装置１２に向かって突出している。突出壁２２ｃは、中壁２２ａにネジやボルト等の結合具２２ｆによって結合されている。中壁２２ａは、第一板金等とも称され、突出壁２２ｃは、第二板金等とも称さる。 The protruding wall 22c faces the main storage device 12 mounted on the main board 4. In other words, the protruding wall 22c projects from the middle wall 22a toward the main storage device 12. The protruding wall 22c is connected to the inner wall 22a by a connector 22f such as a screw or a bolt. The inner wall 22a is also referred to as a first sheet metal or the like, and the protruding wall 22c is also referred to as a second sheet metal or the like.
　そして、本実施形態では、突出壁２２ｃと主記憶装置１２とが熱伝導部材３０を介して熱的に接続されている。これにより、主記憶装置１２の熱を、熱伝導部材３０を介した熱拡散によってミドルフレーム２２に逃がすことができる。主記憶装置１２は、第二発熱体の一例である。なお、主記憶装置１２は、メイン基板４の中央演算処理装置１１とは反対側の面に実装され、Ｙ方向に見た場合に中央演算処理装置１１とずれて位置されている。 Then, in the present embodiment, the protruding wall 22c and the main storage device 12 are thermally connected via the heat conductive member 30. As a result, the heat of the main storage device 12 can be released to the middle frame 22 by heat diffusion through the heat conductive member 30. The main storage device 12 is an example of a second heating element. The main storage device 12 is mounted on the surface of the main board 4 opposite to the central processing unit 11 and is positioned so as to be offset from the central processing unit 11 when viewed in the Y direction.
　また、熱伝導部材３０は、グリス３１と、シート３２と、を有している。グリス３１は、突出壁２２ｃのＹ方向の反対方向の端面に塗布されている。グリス３１は、熱伝導グリスであり、導電材料が含有されている。 Further, the heat conductive member 30 has a grease 31 and a sheet 32. The grease 31 is applied to the end face of the protruding wall 22c in the direction opposite to the Y direction. The grease 31 is a heat conductive grease and contains a conductive material.
　シート３２は、メイン基板４に沿って延びており、グリス３１と主記憶装置１２との間に介在されている。シート３２は、サーマルシートであり、熱伝導性かつ絶縁性を有している。本実施形態では、このようなシート３２が主記憶装置１２とグリス３１との間に挟まれることによって、グリス３１が主記憶装置１２の端子やメイン基板４の端子等と接して導通するのが抑制されている。 The sheet 32 extends along the main substrate 4 and is interposed between the grease 31 and the main storage device 12. The sheet 32 is a thermal sheet and has thermal conductivity and insulating properties. In the present embodiment, when such a sheet 32 is sandwiched between the main storage device 12 and the grease 31, the grease 31 comes into contact with the terminals of the main storage device 12, the terminals of the main board 4, and the like to conduct conduction. It is suppressed.
　また、ストレージホルダ１６は、補助記憶装置１３やサブ基板８等を支持する底壁１６ａを有している。底壁１６ａは、ミドルフレーム２２に沿って延びており、補助記憶装置１３のＹ方向の反対方向の側面１３ａや、サブ基板８のＹ方向の反対方向の面を覆っている。 Further, the storage holder 16 has a bottom wall 16a that supports the auxiliary storage device 13, the sub-board 8, and the like. The bottom wall 16a extends along the middle frame 22 and covers the side surface 13a of the auxiliary storage device 13 in the opposite direction in the Y direction and the surface of the sub-board 8 in the opposite direction in the Y direction.
　言い換えると、底壁１６ａは、ミドルフレーム２２や、主記憶装置１２、中央演算処理装置１１等の発熱体から補助記憶装置１３およびサブ基板８へと向かう熱伝達経路の途中位置に介在されている。ストレージホルダ１６は、合成樹脂のような断熱材料によって作られる。底壁１６ａは、断熱壁の一例であり、側面１３ａは、第二面の一例である。 In other words, the bottom wall 16a is interposed in the middle of the heat transfer path from the heating element such as the middle frame 22, the main storage device 12, the central processing unit 11 and the like to the auxiliary storage device 13 and the sub-board 8. .. The storage holder 16 is made of a heat insulating material such as synthetic resin. The bottom wall 16a is an example of a heat insulating wall, and the side surface 13a is an example of a second surface.
　図５は、図１の電子機器１のＸＹ断面図である。図５に示されるように、ヒートシンク３には、突出部３ｃに対応して凹部３ｈが設けられている。凹部３ｈは、突出部３ｃの中央演算処理装置１１とは反対側、すなわちＹ方向の反対方向の表面３ａ１からＹ方向に凹んでいる。表面３ａ１は、第一面の一例である。 FIG. 5 is an XY cross-sectional view of the electronic device 1 of FIG. As shown in FIG. 5, the heat sink 3 is provided with a recess 3h corresponding to the protrusion 3c. The recess 3h is recessed in the Y direction from the surface 3a1 on the opposite side of the protruding portion 3c from the central processing unit 11, that is, in the direction opposite to the Y direction. The surface 3a1 is an example of the first surface.
　また、フィン３ｂは、複数のフィン３ｂ１と、複数のフィン３ｂ２と、を有している。フィン３ｂ１は、表面３ａ１からＹ方向の反対方向に延びており、フィン３ｂ２は、凹部３ｈの底部３ｈ１からＹ方向の反対方向に延びている。本実施形態では、フィン３ｂ１のＹ方向の長さとフィン３ｂ２のＹ方向の長さとは、略同じである。したがって、フィン３ｂの先端には、フィン３ｂ２によってＹ方向に凹んだ凹部が設けられている。 Further, the fin 3b has a plurality of fins 3b1 and a plurality of fins 3b2. The fins 3b1 extend from the surface 3a1 in the opposite direction in the Y direction, and the fins 3b2 extend from the bottom 3h1 of the recess 3h in the opposite direction in the Y direction. In the present embodiment, the length of the fin 3b1 in the Y direction and the length of the fin 3b2 in the Y direction are substantially the same. Therefore, the tip of the fin 3b is provided with a recess recessed in the Y direction by the fin 3b2.
　本実施形態では、このような構成によって、中央演算処理装置１１とＹ方向に重なったフィン３ｂ２を筐体２の右壁２ｆからより遠ざけて配置するようにしている。これにより、フィン３ｂのうちフィン３ｂ１よりも高温となりやすいフィン３ｂ２からの熱放射（輻射）によって右壁２ｆが局所的に温度上昇するのを抑制することができる。 In the present embodiment, with such a configuration, the fins 3b2 overlapping the central processing unit 11 in the Y direction are arranged farther from the right wall 2f of the housing 2. As a result, it is possible to suppress the temperature rise of the right wall 2f locally due to heat radiation (radiation) from the fins 3b2, which tends to have a higher temperature than the fins 3b1 among the fins 3b.
　なお、本実施形態では、フィン３ｂ２の少なくとも一部は、右壁２ｆのうち通気口２ｓが設けられない部分（図１参照）によってＹ方向の反対方向から覆われている。これにより、フィン３ｂ２の近くを流れる空気の流速が高められている。よって、本実施形態によれば、ヒートシンク３のうち最も温度が高くなりやすいフィン３ｂ２付近において、空気による冷却効果（放熱効果）をより高めることができる。 In the present embodiment, at least a part of the fins 3b2 is covered from the opposite direction in the Y direction by a portion of the right wall 2f where the vent 2s is not provided (see FIG. 1). As a result, the flow velocity of the air flowing near the fins 3b2 is increased. Therefore, according to the present embodiment, the cooling effect (heat dissipation effect) by air can be further enhanced in the vicinity of the fins 3b2, which tends to have the highest temperature among the heat sinks 3.
　次に、電子機器１の組立方法の一例について説明する。まず、ミドルフレーム２２の片側、すなわちＹ方向の反対方向に、サブ基板５、メイン基板４、およびヒートシンク３の順に組み付けていく（Ｓ１）。Ｓ１は、第一工程の一例である。 Next, an example of an assembly method of the electronic device 1 will be described. First, the sub-board 5, the main board 4, and the heat sink 3 are assembled in this order on one side of the middle frame 22, that is, in the direction opposite to the Y direction (S1). S1 is an example of the first step.
　次に、ミドルフレーム２２を裏返すとともに、ミドルフレーム２２と垂直にサブ基板７を組み付ける（Ｓ２）。Ｓ２は、第二工程の一例である。 Next, turn the middle frame 22 over and assemble the sub-board 7 perpendicular to the middle frame 22 (S2). S2 is an example of the second step.
　次に、ミドルフレーム２２のもう片側、すなわちＹ方向に、サブ基板６、ストレージホルダ１６の順に組み付けていくとともに、サブ基板８，９を組み付け、電子機器ユニット１０を組立てる（Ｓ３）。Ｓ３は、第三工程の一例である。 Next, the sub-board 6 and the storage holder 16 are assembled in this order on the other side of the middle frame 22, that is, in the Y direction, and the sub-boards 8 and 9 are assembled to assemble the electronic device unit 10 (S3). S3 is an example of the third step.
　次に、電子機器ユニット１０を筐体２のベースカバー２１に組み付ける（Ｓ４）。そして、トップカバー２３、ライトカバー２４、およびボトムカバー２５を組み付けていき、電子機器１を組立てる（Ｓ５）。Ｓ４は、第四工程の一例であり、Ｓ５は、第五工程の一例である。 Next, the electronic device unit 10 is assembled to the base cover 21 of the housing 2 (S4). Then, the top cover 23, the light cover 24, and the bottom cover 25 are assembled to assemble the electronic device 1 (S5). S4 is an example of the fourth step, and S5 is an example of the fifth step.
　以上のように、本実施形態では、ヒートシンク３は、ベースプレート３ａと、ベースプレート３ａからＹ方向（第一方向）に突出しメイン基板４（第一基板）に実装された中央演算処理装置１１（第一発熱体）と熱的に接続可能な突出部３ｃと、ベースプレート３ａからＹ方向の反対方向に突出しＸ方向（第二方向）に並んだ複数のフィン３ｂ（第一フィン）と、ベースプレート３ａからフィン３ｂよりもＹ方向の反対方向に突出し筐体２の右壁２ｆ（外壁）とベースプレート３ａとを結合する結合具１８を取付可能なボス部３ｄ（第一ボス部）と、ベースプレート３ａからＹ方向に突出しメイン基板４とベースプレート３ａとを結合する結合具１９を取付可能なボス部３ｅ（第二ボス部）と、を備える。 As described above, in the present embodiment, the heat sink 3 protrudes from the base plate 3a and the base plate 3a in the Y direction (first direction), and is mounted on the main board 4 (first board). A protruding portion 3c that can be thermally connected to the heating element), a plurality of fins 3b (first fins) that protrude from the base plate 3a in the opposite direction in the Y direction and are lined up in the X direction (second direction), and fins from the base plate 3a. A boss portion 3d (first boss portion) to which a connector 18 projecting in the direction opposite to the Y direction from 3b and connecting the right wall 2f (outer wall) of the housing 2 and the base plate 3a can be attached, and a boss portion 3d (first boss portion) from the base plate 3a to the Y direction. A boss portion 3e (second boss portion) to which a connector 19 for connecting the main substrate 4 and the base plate 3a can be attached is provided.
　このような構成によれば、突出部３ｃによってメイン基板４に実装される中央演算処理装置１１以外の部品とベースプレート３ａとの干渉を避けることができるため、ベースプレート３ａひいてはヒートシンク３をメイン基板４と同等の大きさのようにより大きく構成できる。その結果、ヒートシンク３の表面積を増大させることができ、ひいてはファンレスの電子機器１においても中央演算処理装置１１の温度上昇をより効果的に抑制することができる。また、ベースプレート３ａから突出したボス部３ｄ，３ｅおよび結合具１８，１９によってヒートシンク３を筐体２およびメイン基板４に固定することができるため、比較的大きなヒートシンク３であってもより確実にあるいはより強固に保持することができる。また、結合具１８，１９とボス部３ｄ，３ｅとの締結を利用してメイン基板４のグランドパターンをヒートシンク３ひいては筐体２に電気的にも接続することができる。これにより、筐体２がヒートシンク３およびメイン基板４のグランド部材として機能し、ひいてはＥＭＩ（Electro　Magnetic　Interference）の対策を行なうことができる。 According to such a configuration, it is possible to avoid interference between the base plate 3a and the components other than the central processing unit 11 mounted on the main board 4 by the protruding portion 3c. Therefore, the base plate 3a and thus the heat sink 3 are combined with the main board 4. It can be configured to be larger, such as the equivalent size. As a result, the surface area of the heat sink 3 can be increased, and the temperature rise of the central processing unit 11 can be more effectively suppressed even in the fanless electronic device 1. Further, since the heat sink 3 can be fixed to the housing 2 and the main substrate 4 by the boss portions 3d, 3e and the couplers 18, 19 protruding from the base plate 3a, even a relatively large heat sink 3 can be more reliably performed. It can be held more firmly. Further, the ground pattern of the main board 4 can be electrically connected to the heat sink 3 and thus to the housing 2 by utilizing the fastening of the couplers 18 and 19 and the boss portions 3d and 3e. As a result, the housing 2 functions as a ground member for the heat sink 3 and the main board 4, and it is possible to take measures against EMI (Electro Magnetic Interference).
　また、本実施形態では、突出部３ｃには、中央演算処理装置１１とは反対側の表面３ａ１（第一面）からＹ方向に凹んだ凹部３ｈが設けられ、フィン３ｂの一部としてのフィン３ｂ２は、凹部３ｈの底部３ｈ１からＹ方向の反対方向に突出している。 Further, in the present embodiment, the protruding portion 3c is provided with a recess 3h recessed in the Y direction from the surface 3a1 (first surface) on the opposite side of the central processing unit 11 and is a fin as a part of the fin 3b. The 3b2 protrudes from the bottom 3h1 of the recess 3h in the opposite direction in the Y direction.
　このような構成によれば、複数のフィン３ｂのＹ方向に沿った長さが略同じとなるように成型した場合に、凹部３ｈの底部３ｈ１から突出したフィン３ｂ２を筐体２の右壁２ｆからより遠ざけて配置することができる。これにより、フィン３ｂのうちフィン３ｂ１よりも高温となりやすいフィン３ｂ２からの熱放射（輻射）によって右壁２ｆが局所的に温度上昇するのを抑制することができる。また、仮に、複数のフィン３ｂのＹ方向の反対方向の先端を揃えるように成型した場合には、フィン３ｂ２の長さをフィン３ｂ１の長さよりも長くすることができる。これにより、ヒートシンク３の表面積をより増大させることができ、ひいては中央演算処理装置１１の冷却効果（放熱効果）をより高めることができる場合がある。 According to such a configuration, when the plurality of fins 3b are molded so as to have substantially the same length along the Y direction, the fins 3b2 protruding from the bottom 3h1 of the recess 3h are formed on the right wall 2f of the housing 2. Can be placed farther away from. As a result, it is possible to suppress the temperature rise of the right wall 2f locally due to heat radiation (radiation) from the fins 3b2, which tends to have a higher temperature than the fins 3b1 among the fins 3b. Further, if the tips of the plurality of fins 3b in the opposite directions in the Y direction are aligned, the length of the fins 3b2 can be made longer than the length of the fins 3b1. As a result, the surface area of the heat sink 3 can be further increased, and in some cases, the cooling effect (heat dissipation effect) of the central processing unit 11 can be further enhanced.
　また、本実施形態では、ヒートシンク３は、ベースプレート３ａからＹ方向に突出し、Ｘ方向に並んだ複数のフィン３ｆ（第二フィン）を備えている。 Further, in the present embodiment, the heat sink 3 includes a plurality of fins 3f (second fins) protruding in the Y direction from the base plate 3a and arranged in the X direction.
　このような構成によれば、フィン３ｆによってヒートシンク３の表面積を増大させることができるため、中央演算処理装置１１の冷却効果（放熱効果）をより高めることができる。また、フィン３ｆによってベースプレート３ａのフィン３ｂとは反対側の裏面３ａ２を補強することができ、ひいてはベースプレート３ａが熱収縮によってフィン３ｂ側に変形するのを抑制することができる。 According to such a configuration, the surface area of the heat sink 3 can be increased by the fins 3f, so that the cooling effect (heat dissipation effect) of the central processing unit 11 can be further enhanced. Further, the fins 3f can reinforce the back surface 3a2 of the base plate 3a opposite to the fins 3b, and thus can prevent the base plate 3a from being deformed to the fins 3b side due to heat shrinkage.
　また、本実施形態では、電子機器ユニット１０は、ヒートシンク３と、ヒートシンク３の突出部３ｃと熱的に接続された状態に設けられた中央演算処理装置１１が実装されたメイン基板４と、メイン基板４のヒートシンク３とは反対側のＹ方向に位置されたミドルフレーム２２（取付ベース）と、ミドルフレーム２２のＹ方向に位置されたサブ基板６（第二基板）と、サブ基板６のＹ方向に位置され補助記憶装置１３を保持するストレージホルダ１６と、が一体化された状態で、筐体２に取付可能に構成されている。 Further, in the present embodiment, the electronic device unit 10 includes a heat sink 3, a main board 4 on which a central processing unit 11 provided in a state of being thermally connected to a protruding portion 3c of the heat sink 3 is mounted, and a main board. The middle frame 22 (mounting base) located in the Y direction opposite to the heat sink 3 of the substrate 4, the sub substrate 6 (second substrate) located in the Y direction of the middle frame 22, and the Y of the sub substrate 6. The storage holder 16 which is located in the direction and holds the auxiliary storage device 13 and the storage holder 16 are integrated and can be attached to the housing 2.
　このような構成によれば、ブロック化された電子機器ユニット１０によって、ヒートシンク３、メイン基板４、ミドルフレーム２２、サブ基板６、およびストレージホルダ１６を個別に筐体２に組み付ける場合と比べて、電子機器１の製造（組立作業）に要する手間を低減することができたり、電子機器１をよりコンパクトに構成できたりする。 According to such a configuration, as compared with the case where the heat sink 3, the main board 4, the middle frame 22, the sub board 6, and the storage holder 16 are individually assembled to the housing 2 by the blocked electronic device unit 10. The labor required for manufacturing (assembling work) of the electronic device 1 can be reduced, and the electronic device 1 can be configured more compactly.
　また、本実施形態では、ミドルフレーム２２は、メイン基板４とサブ基板６との間に位置された中壁２２ａと、中壁２２ａからＹ方向の反対方向に突出しメイン基板４とミドルフレーム２２とを結合する結合具１９を取付可能なスタッド２２ｄ（第一スタッド）と、中壁２２ａからＹ方向に突出しサブ基板６とミドルフレーム２２とを結合する結合具１９を取付可能なスタッド２２ｅ（第二スタッド）と、を有している。 Further, in the present embodiment, the middle frame 22 includes the middle wall 22a located between the main board 4 and the sub board 6, and the main board 4 and the middle frame 22 protruding from the middle wall 22a in the opposite direction in the Y direction. The stud 22d (first stud) to which the fitting 19 for connecting the two is attached, and the stud 22e (second stud) to which the fitting 19 for connecting the sub-board 6 and the middle frame 22 protruding from the inner wall 22a in the Y direction can be attached. Studs) and have.
　このような構成によれば、中壁２２ａから突出したスタッド２２ｄ，２２ｅおよび結合具１９によってメイン基板４およびサブ基板６を比較的簡単にミドルフレーム２２に固定することができる。また、結合具１９とスタッド２２ｄ，２２ｅとの締結を利用してメイン基板４のグランドパターンおよびサブ基板６のグランドパターンをミドルフレーム２２に電気的にも接続することができる。これにより、ミドルフレーム２２がメイン基板４およびサブ基板６のグランド部材として機能し、ひいてはＥＭＩ（Electro　Magnetic　Interference）の対策を行なうことができる。 According to such a configuration, the main substrate 4 and the sub substrate 6 can be relatively easily fixed to the middle frame 22 by the studs 22d, 22e and the coupler 19 protruding from the inner wall 22a. Further, the ground pattern of the main board 4 and the ground pattern of the sub board 6 can be electrically connected to the middle frame 22 by utilizing the fastening of the coupler 19 and the studs 22d and 22e. As a result, the middle frame 22 functions as a ground member for the main board 4 and the sub board 6, and it is possible to take measures against EMI (Electro Magnetic Interference).
　また、本実施形態では、メイン基板４に実装され、ミドルフレーム２２と熱伝導部材３０を介して熱的に接続された状態に設けられた主記憶装置１２（第二発熱体）を有し、熱伝導部材３０は、ミドルフレーム２２に塗布されたグリス３１と、グリス３１と主記憶装置１２との間に介在されたシート３２と、を有している。 Further, in the present embodiment, the main memory device 12 (second heating element) mounted on the main board 4 and provided in a state of being thermally connected to the middle frame 22 via the heat conductive member 30 is provided. The heat conductive member 30 has a grease 31 applied to the middle frame 22 and a sheet 32 interposed between the grease 31 and the main storage device 12.
　このような構成によれば、主記憶装置１２の熱を、熱伝導部材３０を介した熱拡散によってミドルフレーム２２に逃がすことができるため、主記憶装置１２の温度上昇をより効果的に抑制することができる。また、グリス３１と主記憶装置１２との間に介在されたシート３２によって、グリス３１が主記憶装置１２の端子やメイン基板４の端子等と接して導通するのを抑制することができる。 According to such a configuration, the heat of the main storage device 12 can be released to the middle frame 22 by heat diffusion through the heat conductive member 30, so that the temperature rise of the main storage device 12 can be suppressed more effectively. be able to. Further, the sheet 32 interposed between the grease 31 and the main storage device 12 can prevent the grease 31 from coming into contact with the terminals of the main storage device 12, the terminals of the main board 4, and the like to conduct conduction.
　また、本実施形態では、ストレージホルダ１６は、少なくとも補助記憶装置１３のＹ方向の反対方向の側面１３ａ（第二面）を覆う１６ａ（底壁）を有している。 Further, in the present embodiment, the storage holder 16 has at least 16a (bottom wall) covering the side surface 13a (second surface) of the auxiliary storage device 13 in the direction opposite to the Y direction.
　このような構成によれば、底壁１６ａによってミドルフレーム２２や、主記憶装置１２、中央演算処理装置１１等から補助記憶装置１３への熱伝達が抑制されるため、補助記憶装置１３の温度上昇を抑制することができる。 According to such a configuration, heat transfer from the middle frame 22, the main storage device 12, the central processing unit 11, and the like to the auxiliary storage device 13 is suppressed by the bottom wall 16a, so that the temperature of the auxiliary storage device 13 rises. Can be suppressed.
　以上、本発明の実施形態が例示されたが、上記実施形態は一例であって、発明の範囲を限定することは意図していない。上記実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、組み合わせ、変更を行うことができる。また、各構成や、形状、等のスペック（構造や、種類、方向、形式、大きさ、長さ、幅、厚さ、高さ、数、配置、位置、材質等）は、適宜に変更して実施することができる。 Although the embodiments of the present invention have been exemplified above, the above-described embodiment is an example and is not intended to limit the scope of the invention. The above-described embodiment can be implemented in various other forms, and various omissions, replacements, combinations, and changes can be made without departing from the gist of the invention. In addition, specifications such as each configuration and shape (structure, type, direction, type, size, length, width, thickness, height, number, arrangement, position, material, etc.) are changed as appropriate. Can be carried out.

Claims (7)

  1. 　ベースプレートと、
    　前記ベースプレートから当該ベースプレートと交差した第一方向に突出し、第一基板に実装された第一発熱体と熱的に接続可能な突出部と、
    　前記ベースプレートから前記第一方向の反対方向に突出し、前記第一方向と交差した第二方向に並んだ複数の第一フィンと、
    　前記ベースプレートから前記第一フィンよりも前記第一方向の反対方向に突出し、筐体の外壁と前記ベースプレートとを結合する結合具を取付可能な第一ボス部と、
    　前記ベースプレートから前記第一方向に突出し、前記第一基板と前記ベースプレートとを結合する結合具を取付可能な第二ボス部と、
    　を備えた、ヒートシンク。     With the base plate
    A protrusion that protrudes from the base plate in the first direction intersecting the base plate and is thermally connectable to the first heating element mounted on the first substrate.
    A plurality of first fins protruding from the base plate in the opposite direction of the first direction and arranged in the second direction intersecting with the first direction.
    A first boss portion that protrudes from the base plate in the direction opposite to the first fin in the direction opposite to the first fin and can be attached with a connector that connects the outer wall of the housing and the base plate.
    A second boss portion that protrudes from the base plate in the first direction and to which a binder for connecting the first substrate and the base plate can be attached.
    With a heat sink.
  2. 　前記突出部には、前記第一発熱体とは反対側の第一面から前記第一方向に凹んだ凹部が設けられ、
    　前記第一フィンの一部は、前記凹部の底部から前記第一方向の反対方向に突出した、請求項１に記載のヒートシンク。     The protruding portion is provided with a recess recessed in the first direction from the first surface opposite to the first heating element.
    The heat sink according to claim 1, wherein a part of the first fins protrudes from the bottom of the recess in the direction opposite to the first direction.
  3. 　前記ベースプレートから前記第一方向に突出し、前記第二方向に並んだ複数の第二フィンを備えた、請求項１または２に記載のヒートシンク。 The heat sink according to claim 1 or 2, further comprising a plurality of second fins protruding from the base plate in the first direction and arranged in the second direction.
  4. 　請求項１～３のうちいずれか一つに記載のヒートシンクと、
    　前記ヒートシンクの突出部と熱的に接続された状態に設けられた第一発熱体が実装された第一基板と、
    　前記第一基板の前記ヒートシンクとは反対側の前記第一方向に位置された取付ベースと、
    　前記取付ベースの前記第一方向に位置された第二基板と、
    　前記第二基板の前記第一方向に位置され、補助記憶装置を保持するストレージホルダと、
    　が一体化された状態で、筐体に取付可能に構成された、電子機器ユニット。     The heat sink according to any one of claims 1 to 3,
    A first substrate on which a first heating element provided in a state of being thermally connected to the protrusion of the heat sink is mounted, and
    A mounting base located in the first direction opposite to the heat sink of the first substrate,
    With the second substrate located in the first direction of the mounting base,
    A storage holder located in the first direction of the second substrate and holding an auxiliary storage device,
    An electronic device unit that can be attached to a housing while the devices are integrated.
  5. 　前記取付ベースは、
    　前記第一基板と前記第二基板との間に位置された中壁と、
    　前記中壁から前記第一方向の反対方向に突出し、前記第一基板と前記取付ベースとを結合する結合具を取付可能な第一スタッドと、
    　前記中壁から前記第一方向に突出し、前記第二基板と前記取付ベースとを結合する結合具を取付可能な第二スタッドと、
    　を有した、請求項４に記載の電子機器ユニット。     The mounting base is
    An inner wall located between the first substrate and the second substrate,
    A first stud that protrudes from the inner wall in the opposite direction of the first direction and to which a connector for connecting the first substrate and the mounting base can be mounted.
    A second stud that protrudes from the inner wall in the first direction and can mount a connector that connects the second substrate and the mounting base.
    The electronic device unit according to claim 4.
  6. 　前記第一基板または前記第二基板に実装され、前記取付ベースと熱伝導部材を介して熱的に接続された状態に設けられた第二発熱体を有し、
    　前記熱伝導部材は、
    　前記取付ベースに塗布されたグリスと、
    　前記グリスと前記第二発熱体との間に介在されたシートと、
    　を有した、請求項４または５に記載の電子機器ユニット。     It has a second heating element mounted on the first substrate or the second substrate and provided in a state of being thermally connected to the mounting base via a heat conductive member.
    The heat conductive member is
    The grease applied to the mounting base and
    A sheet interposed between the grease and the second heating element,
    The electronic device unit according to claim 4 or 5.
  7. 　前記ストレージホルダは、少なくとも前記補助記憶装置の前記第一方向の反対方向の第二面を覆う断熱壁を有した、請求項６に記載の電子機器ユニット。 The electronic device unit according to claim 6, wherein the storage holder has at least a heat insulating wall covering a second surface of the auxiliary storage device in the opposite direction of the first direction.
PCT/JP2020/038943 2019-12-20 2020-10-15 Heat sink and electronic device unit WO2021124665A1 (en)

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