WO2021111951A1 - Shunt resistance module - Google Patents
Shunt resistance module Download PDFInfo
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- WO2021111951A1 WO2021111951A1 PCT/JP2020/043866 JP2020043866W WO2021111951A1 WO 2021111951 A1 WO2021111951 A1 WO 2021111951A1 JP 2020043866 W JP2020043866 W JP 2020043866W WO 2021111951 A1 WO2021111951 A1 WO 2021111951A1
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- electrode
- voltage signal
- wiring board
- shunt resistor
- electrodes
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- 239000000758 substrate Substances 0.000 abstract description 18
- 238000001514 detection method Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
Definitions
- the present invention relates to a shunt resistor module provided with a shunt resistor.
- a shunt resistor is used to detect the current of a power semiconductor device or the like.
- a shunt resistor for example, a structure in which a plurality of columnar resistors are arranged between a pair of electrodes spaced apart from each other in the height direction is known (see the invention described in Patent Document 1). ).
- an object of the present invention is to provide a shunt resistor module capable of easily drawing out a voltage signal pattern and obtaining connection stability with an electrode.
- the shunt resistor module of one aspect of the present invention includes a shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes.
- Each electrode has a wiring substrate that is electrically connected to each other and has a plurality of voltage signal patterns for detecting a voltage between the electrodes, and the second electrode is the first electrode.
- the wiring board is provided with an extension portion extending in a plane direction, and the wiring substrate is placed on the surface of the extension portion.
- a wiring board on which a voltage signal pattern is formed is used, and the wiring board is arranged on an extension portion provided on an electrode.
- the voltage signal pattern can be easily drawn out, and the connection stability with the electrodes can be obtained.
- FIG. 3A is a plan view of the wiring board used for the shunt resistor module of the present embodiment
- FIG. 3B is a back view of the wiring board.
- It is sectional drawing of the shunt resistance module of FIG. It is sectional drawing of the shunt resistance module which concerns on 2nd Embodiment.
- It is an exploded perspective view of the shunt resistance module of FIG. is a top view of the shunt resistance module of FIG. It is a side view of the shunt resistance module of FIG. 10A and 10B are partially enlarged cross-sectional views showing a part of the shunt resistor module of FIG.
- the present inventor can easily change the voltage signal pattern in a shunt resistor module having a shunt resistor having a three-dimensional structure in which electrodes (terminals) are arranged above and below the columnar resistor in the height direction.
- the present invention has been developed in order to draw out and obtain connection stability with an electrode.
- the shunt resistance module of the first embodiment is (1) A shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes. (2) Each electrode has a wiring board that is electrically connected to each other and has a plurality of voltage signal patterns for detecting a voltage between the electrodes. (3) The second electrode is provided with an extending portion extending in a plane direction from the first electrode, and the wiring board is placed on the surface of the extending portion.
- the structure of the shunt resistor module 1 of the first embodiment will be described.
- FIG. 1 is a perspective view of the shunt resistance module according to the first embodiment.
- FIG. 2 is an exploded perspective view of the shunt resistance module according to the first embodiment.
- FIG. 3A is a plan view of the wiring board used for the shunt resistor module of the present embodiment, and
- FIG. 3B is a back view of the wiring board.
- FIG. 4 is a cross-sectional view of the shunt resistor module according to the first embodiment.
- the shunt resistor module 1 includes a shunt resistor 2 and a wiring board 3 provided with a plurality of voltage signal patterns 8a and 8b.
- (Shunt resistor 2) As shown in FIGS. 2 and 4, it has a columnar resistor 4 extending in the height direction (Z), and a first electrode 5 and a second electrode 6 arranged at both upper and lower ends of the resistor 4. It is composed of. The first electrode 5 and the second electrode 6 have lower electrical resistance values than the resistor 4.
- the resistor 4 is a metal such as Cu—Ni, Cu—Mn, or Ni—Cr
- the electrodes 5 and 6 are metals such as Cu.
- a plurality of columnar resistors 4 are arranged side by side.
- a common first electrode 5 is provided on the upper surface of each resistor 4, and a common second electrode 6 is provided on the lower surface of each resistor 4.
- the second electrode 6 extends longer in the X direction than the first electrode 5.
- a portion extending longer than the first electrode 5 is referred to as an extending portion 6a.
- the X direction is a plane direction orthogonal to the height direction (Z).
- a through hole 5a is formed in the first electrode 5.
- the through hole 5a penetrates from the front surface to the back surface of the first electrode 5 and is provided at a position deviated from the position facing the resistor 4 in the height direction (Z).
- fixing holes 5b and 6b are formed in the centers of the first electrode 5 and the second electrode 6.
- the fixing holes 5b and 6b are formed in a straight line along the height direction (Z).
- the wiring board 3 includes an insulating substrate 7, a first voltage signal pattern 8a formed on the surface 7a of the insulating substrate 7, a second voltage signal pattern 8b, and a connector 9.
- a first voltage signal pattern 8a and a second voltage signal pattern 8b are formed on the surface 7a of the insulating substrate 7.
- a first connection pad 8c having a predetermined area is integrally formed at one end of the first voltage signal pattern 8a. Further, the other end of the first voltage signal pattern 8a is electrically connected to the connector 9.
- a second connection pad 8d having a predetermined size and a fixing pattern 8e are formed on the back surface 7b of the insulating substrate 7.
- the second connection pad 8d and the fixed pattern 8e are not electrically connected.
- the second connection pad 8d and the fixing pattern 8e are connected on the extending portion 6a by soldering, a conductive adhesive, or the like.
- an internal conductive layer 41 is formed inside the insulating substrate 7, and the internal conductive layer 41 leads to the second connection pad 8d.
- 3A and 3B show the positions of the internal conductive layer 41 with reference numerals.
- the internal conductive layer 41 is electrically connected to the second voltage signal pattern 8b drawn out from the surface 7a of the insulating substrate 7.
- the second voltage signal pattern 8b is electrically connected to the connector 9 at an end opposite to the side connected to the internal conductive layer 41.
- a power supply pattern 8f is formed on the surface 7a of the insulating substrate 7 in addition to the voltage signal patterns 8a and 8b.
- the wiring board 3 is placed on the extending portion 6a of the second electrode 6, and at this time, the wiring board 3 is soldered or the like.
- the second connection pad 8d and the fixing pattern 8e of the above are fixedly supported on the second electrode 6.
- the second electrode 6 and the second voltage signal pattern 8b are electrically connected via the second connection pad 8d and the internal conductive layer 41.
- a rod-shaped conductive member 42 is inserted into the through hole 5a provided in the first electrode 5.
- the material of the conductive member 42 does not matter, but for example, iron, copper, brass, or the like.
- the conductive member 42 is formed longer in the height direction (Z) than the plate thickness of the second electrode 5, and as shown in FIG. 4, the conductive member 42 is inserted through the through hole 5a of the first electrode 5. 42 comes into contact with the first connection pad 8c of the wiring board 3. At this time, it is preferable that the conductive member 42 and the first connection pad 8c are fixedly supported by soldering, a conductive adhesive, or the like. As a result, the first electrode 5 and the first voltage signal pattern 8a are electrically connected via the conductive member 42 and the first connection pad 8c.
- bus bars 44 and 45 as external wiring members are superposed on the front surface side and the back surface side of the shunt resistor 2. At this time, the fixing holes 44a and 45a formed in the bus bars 44 and 45 are aligned with the positions of the fixing holes 5b and 6b formed in the first electrode 5 and the second electrode 6.
- the fixing member 46 is inserted into the fixing holes 44a and 45a of the bus bars 44 and 45 and the fixing holes 5b and 6b of the electrodes 5 and 6 via an insulating washer or the like.
- the tip of the fixing member 46 is a threaded portion 46a, and similarly, the bus bar 45 is also threaded. Therefore, the fixing member 46 can be inserted into the fixing holes 5b, 6b, 44a, 45a and screwed to the bus bar 45, whereby the bus bars 44, 45 can be fixedly supported by the shunt resistance module 1. ..
- an insulating tube 47 is attached to the peripheral surface of the fixing member 46, except for the screw portion 46a at the tip. For example, by inserting the insulating tube 47 into the fixing member 46 and contracting it, it can be fixed around the fixing member 46. As shown in FIG. 4, the insulating tube 47 insulates between the electrodes 5 and 6 of the shunt resistor 2 in a state where the fixing member 46 is inserted into the fixing holes 5b, 6b, 44a and 45a. Therefore, when a current flows between the bus bars 44 and 45 via the shunt resistor module 1, it is possible to prevent a problem that the current flows through the fixing member 46.
- an insulating material may be coated, sprayed, or vapor-deposited on the surface of the fixing member 46 to form an insulating layer.
- the shunt resistor module 1 in the present embodiment is connected to a voltmeter (not shown) via a connector 9 and measures a voltage value between the first electrode 5 and the second electrode 6. At this time, since the resistance value of the resistor 4 constituting the shunt resistor 2 is known, the current value can be detected according to Ohm's law. As described above, the shunt resistance module 1 in the present embodiment can be used as a current detection device.
- the shunt resistor 2 and the wiring board 3 on which the voltage signal patterns 8a and 8b are formed are used, and the wiring board 3 is placed on the extension portion 6a provided on the second electrode 6. It was placed in.
- the wiring board 3 can be stably supported and each of them can be supported.
- the voltage signal patterns 8a and 8b can be easily drawn out from between the electrodes 5 and 6, and the connection stability with the electrodes 5 and 6 can be ensured.
- the conductive member 42 is passed through the through hole 5a provided in the first electrode 5, and the conductive member 42 is brought into contact with the first connection pad 8c.
- the first electrode 5 and the first voltage signal pattern 8a can be easily and electrically connected, and better connection stability can be ensured.
- a second voltage signal pattern 8b is formed on the front surface of the wiring board 3 together with the first voltage signal pattern 8a, and a second voltage signal pattern 8b is connected to the back surface of the wiring board 3.
- the connection pad 8d of 2 is provided.
- the wiring board 3 is placed on the extending portion 6a of the second electrode 6, so that the second connection pad 8d and the second electrode 6 can be electrically connected to each other.
- the second electrode 6 and the second voltage signal pattern 8b can be easily and electrically connected, and more excellent connection stability can be ensured.
- the first voltage signal pattern 8a electrically connected to the first electrode 5 and the second voltage signal pattern 8b electrically connected to the second electrode 6 are used. It was arranged on the surface 7a of the insulating substrate 7. That is, the first voltage signal pattern 8a and the second voltage signal pattern 8b are drawn out from the same surface.
- each voltage signal pattern 8a As a result of pulling out 8b from the same surface, the influence of magnetic flux can be suppressed, and current detection can be performed with high accuracy. That is, by pulling out the first voltage signal pattern 8a and the second voltage signal pattern 8b from the same height position, magnetic flux wraparound is less likely to occur and the influence of magnetic flux is suppressed as compared with pulling out at different heights. This makes it possible to perform current detection with high accuracy.
- FIG. 5 is a cross-sectional view of the shunt resistor module according to the second embodiment.
- the same members as those in the first embodiment described above are designated by the same reference numerals.
- the shunt resistor module 10 has a plurality of columnar resistors 4 located between the first electrode 5, the second electrode 6, and the first electrode 5 and the second electrode 6.
- a shunt resistor 2 having the above and a wiring board 13 are provided.
- the wiring board 13 has an insulating substrate 7, a first voltage signal pattern 8a formed on the front surface 7a of the insulating substrate 7, and a second voltage signal pattern 8b formed on the back surface 7b of the insulating substrate 7.
- the ends of the voltage signal patterns 8a and 8b form the connection pads 8c and 8d shown in FIGS. 3A and 3B.
- a conductive spring (elastic member) 51 is provided between the first connection pad 8c connected to the first voltage signal pattern 8a and the first electrode 5. Further, a conductive spring (elastic member) 52 is provided between the second connection pad 8d connected to the second voltage signal pattern 8b and the second electrode 6. As a result, the connection pads 8c and 8d and the electrodes 5 and 6 are electrically connected.
- an electrically insulating pedestal 54 is provided on the extending portion 6a of the second electrode 6, and the wiring board 13 is arranged on the pedestal 54.
- the material of the pedestal 54 does not matter, but it is made of resin, for example.
- the springs 51 and 52 are fixedly supported on the connection pads 8c and 8d of the wiring board 13 or the electrodes 5 and 6 in advance by soldering or the like, and the wiring board 13 is supported by the first electrodes 5 and the second. Insert into the space between the electrodes 16. At this time, due to the elastic force of the springs 51 and 52, the connection pads 8c and 8d can be easily electrically connected to each of the electrodes 5 and 6, and the connection stability can be ensured.
- FIG. 6 is a perspective view of the shunt resistor module according to another embodiment.
- FIG. 7 is an exploded perspective view of the shunt resistor module of FIG.
- FIG. 8 is a plan view of the shunt resistor module of FIG.
- FIG. 9 is a side view of the shunt resistor module of FIG. 10A and 10B are partially enlarged cross-sectional views showing a part of the shunt resistor module of FIG.
- the electrodes 25 and 26 constituting the shunt resistor 22 are enlarged as the current increases, and the resistance interposed between the electrodes 25 and 26 is increased. This is an example of a case where the length of the body 24 in the height direction is shortened.
- the space height between the first electrode 25 and the second electrode 26 is smaller than that in the first embodiment and the second embodiment described above. , It becomes difficult to insert the wiring boards 3 and 13 shown in the first embodiment and the second embodiment into the narrow space between the first electrode 25 and the second electrode 26.
- the first electrode 25 and the second electrode 26 having the same shape are arranged so as to be offset in the plane direction, whereby the voltage signal pattern is formed on the surface of the protruding portion 26a. It was decided to provide 28 and a connector 29. That is, the second electrode 26 also serves as a wiring board (connector board).
- an insulating layer 31, a voltage signal pattern 28, etc. are formed on the surface of the extending portion 26a by using a thin film technique such as plating or sputtering.
- a connection pad (corresponding to the second connection pad 8d of the first embodiment) 33 is formed on the extension portion 26a, and is located on the surface of the insulating layer 31 (not shown). Electrically connect to the voltage signal pattern of 2.
- the voltage signal pattern 28 illustrated in FIG. 10A is a first voltage signal pattern, and the first voltage signal pattern 28 and the first electrode 25 are electrically connected via, for example, bumps 34 formed by plating or the like. Can be connected.
- the first voltage signal pattern 28 and the first electrode 25 can be directly and electrically connected in consideration of the film thickness of the insulating layer 31 and the like.
- the voltage signal pattern can be easily drawn out according to the reduction in height of the shunt resistor 22, and the connection with the electrode is stable. Sex can be ensured.
- the present embodiment is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea. Further, if the technical idea can be realized in another way by the advancement of the technology or another technology derived from it, it may be carried out by using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea.
- the feature points in the above-described embodiment are summarized below.
- the shunt resistor module includes a shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes.
- Each of the electrodes is electrically connected to a wiring substrate having a plurality of voltage signal patterns for detecting a voltage between the electrodes, and the second electrode has a wiring substrate from the first electrode.
- the wiring substrate is mounted on the surface of the extension portion.
- the first electrode is provided with a through hole, a conductive member is inserted into the through hole, and the conductive member is electrically connected to the first electrode. It is preferable that the voltage signal pattern is in contact with the surface of the voltage signal pattern.
- the plurality of voltage signal patterns are formed on the front surface of the wiring board, the connection pad is formed on the back surface of the wiring board, and the connection pad is the second. It is preferably connected to the voltage signal pattern that is electrically connected to the electrode.
- the shunt resistor module includes a shunt resistor including a pair of electrodes facing each other in the height direction and a columnar resistor connected between the electrodes, and a shunt resistor for each electrode.
- a wiring board that is electrically connected and has a plurality of voltage signal patterns for detecting a voltage between each electrode, and one electrode is a wiring board (connector board) on which a voltage signal pattern is formed. ) Is also used.
- the shunt resistor module of the present invention can use a shunt resistor having a three-dimensional structure, can be miniaturized, can handle a large current, and can easily draw out a voltage signal pattern. Moreover, the connection stability with the electrode can be obtained.
- the shunt resistor module of the present invention can be applied to, for example, current detection and battery energy management for control applications such as power semiconductor devices.
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Abstract
The purpose of the present invention is to provide a shunt resistance module which allows easy drawing out of a voltage signal pattern, and which can provide stable connection with an electrode. A shunt resistance module (1) according to the present invention is characterized by comprising: a shunt resistor (2) including a first electrode (5) and a second electrode (6) facing each other in the height direction, and a columnar resistor (4) connected between the electrodes; and a wiring substrate (3) including a plurality of voltage signal patterns (8a, 8b) which are electrically connected to the respective electrodes and detect a voltage between the electrodes. The shunt resistance module is also characterized in that the second electrode includes an extension part (6a) which extends in the planar direction beyond the first electrode, and the wiring substrate is mounted on the surface of the extension part.
Description
この発明は、シャント抵抗器を備えたシャント抵抗モジュールに関する。
The present invention relates to a shunt resistor module provided with a shunt resistor.
例えば、パワー半導体装置等の電流を検出するために、シャント抵抗器が用いられる。
For example, a shunt resistor is used to detect the current of a power semiconductor device or the like.
シャント抵抗器には、例えば、高さ方向に間隔を空けた一対の電極の間に、複数の柱状の抵抗体が配置された構造体が知られている(特許文献1に記載の発明を参照)。
As a shunt resistor, for example, a structure in which a plurality of columnar resistors are arranged between a pair of electrodes spaced apart from each other in the height direction is known (see the invention described in Patent Document 1). ).
しかしながら、特許文献1に示すような立体構造のシャント抵抗器では、高さの異なる各電極から電圧検出端子を引き出すことが必要になった。このとき、電圧検出端子を、容易に且つ、安定して引き出させる構造が要望された。
However, in a shunt resistor having a three-dimensional structure as shown in Patent Document 1, it is necessary to draw out voltage detection terminals from electrodes having different heights. At this time, there has been a demand for a structure in which the voltage detection terminal can be easily and stably pulled out.
そこで本発明は、上記問題に鑑みてなされたもので、電圧信号パターンを容易に引き出すことができるとともに、電極との接続安定性を得ることができるシャント抵抗モジュールを提供することを目的とする。
Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a shunt resistor module capable of easily drawing out a voltage signal pattern and obtaining connection stability with an electrode.
本発明の一態様のシャント抵抗モジュールは、高さ方向に対向する第1の電極及び第2の電極と、各電極の間に接続される柱状の抵抗体と、を備えたシャント抵抗器と、各電極に夫々、電気的に接続され、各電極間の電圧を検出するための複数の電圧信号パターンを備えた配線基板と、を有し、前記第2の電極には、前記第1の電極よりも平面方向に延出した延出部を備え、前記配線基板は、前記延出部の表面に載置されることを特徴とする。
The shunt resistor module of one aspect of the present invention includes a shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes. Each electrode has a wiring substrate that is electrically connected to each other and has a plurality of voltage signal patterns for detecting a voltage between the electrodes, and the second electrode is the first electrode. The wiring board is provided with an extension portion extending in a plane direction, and the wiring substrate is placed on the surface of the extension portion.
本発明のシャント抵抗モジュールによれば、電圧信号パターンが形成された配線基板を用い、該配線基板を、電極に設けられた延出部上に配置する構成とした。これにより、電圧信号パターンを容易に引き出すことができるとともに、電極との接続安定性を得ることができる。
According to the shunt resistance module of the present invention, a wiring board on which a voltage signal pattern is formed is used, and the wiring board is arranged on an extension portion provided on an electrode. As a result, the voltage signal pattern can be easily drawn out, and the connection stability with the electrodes can be obtained.
以下、添付図面を参照して、本実施の形態に係るシャント抵抗モジュールについて説明する。
Hereinafter, the shunt resistance module according to the present embodiment will be described with reference to the attached drawings.
本発明者は、鋭意研究を重ねた結果、柱状の抵抗体の高さ方向の上下に電極(端子)を配置した立体構造のシャント抵抗器を有するシャント抵抗モジュールにおいて、電圧信号パターンを、容易に引き出し、且つ、電極との接続安定性を取得すべく、本発明を開発するに至った。
As a result of intensive research, the present inventor can easily change the voltage signal pattern in a shunt resistor module having a shunt resistor having a three-dimensional structure in which electrodes (terminals) are arranged above and below the columnar resistor in the height direction. The present invention has been developed in order to draw out and obtain connection stability with an electrode.
すなわち、第1の実施の形態のシャント抵抗モジュールは、
(1)高さ方向に対向する第1の電極及び第2の電極と、各電極の間に接続される柱状の抵抗体と、を備えたシャント抵抗器と、
(2)各電極に夫々、電気的に接続され、各電極間の電圧を検出するための複数の電圧信号パターンを備えた配線基板と、を有し、
(3)第2の電極には、第1の電極よりも平面方向に延出した延出部を備え、配線基板は、延出部の表面に載置されることを特徴とする。
以下、第1の実施の形態のシャント抵抗モジュール1の構造について説明する。 That is, the shunt resistance module of the first embodiment is
(1) A shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes.
(2) Each electrode has a wiring board that is electrically connected to each other and has a plurality of voltage signal patterns for detecting a voltage between the electrodes.
(3) The second electrode is provided with an extending portion extending in a plane direction from the first electrode, and the wiring board is placed on the surface of the extending portion.
Hereinafter, the structure of theshunt resistor module 1 of the first embodiment will be described.
(1)高さ方向に対向する第1の電極及び第2の電極と、各電極の間に接続される柱状の抵抗体と、を備えたシャント抵抗器と、
(2)各電極に夫々、電気的に接続され、各電極間の電圧を検出するための複数の電圧信号パターンを備えた配線基板と、を有し、
(3)第2の電極には、第1の電極よりも平面方向に延出した延出部を備え、配線基板は、延出部の表面に載置されることを特徴とする。
以下、第1の実施の形態のシャント抵抗モジュール1の構造について説明する。 That is, the shunt resistance module of the first embodiment is
(1) A shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes.
(2) Each electrode has a wiring board that is electrically connected to each other and has a plurality of voltage signal patterns for detecting a voltage between the electrodes.
(3) The second electrode is provided with an extending portion extending in a plane direction from the first electrode, and the wiring board is placed on the surface of the extending portion.
Hereinafter, the structure of the
<第1の実施の形態のシャント抵抗モジュール1>
図1は、第1の実施の形態に係るシャント抵抗モジュールの斜視図である。図2は、第1の実施の形態に係るシャント抵抗モジュールの分解斜視図である。図3Aは、本実施の形態のシャント抵抗モジュールに使用される配線基板の平面図であり、図3Bは、配線基板の裏面図である。図4は、第1の実施の形態に係るシャント抵抗モジュールの断面図である。 <Shunt resistor module 1 of the first embodiment>
FIG. 1 is a perspective view of the shunt resistance module according to the first embodiment. FIG. 2 is an exploded perspective view of the shunt resistance module according to the first embodiment. FIG. 3A is a plan view of the wiring board used for the shunt resistor module of the present embodiment, and FIG. 3B is a back view of the wiring board. FIG. 4 is a cross-sectional view of the shunt resistor module according to the first embodiment.
図1は、第1の実施の形態に係るシャント抵抗モジュールの斜視図である。図2は、第1の実施の形態に係るシャント抵抗モジュールの分解斜視図である。図3Aは、本実施の形態のシャント抵抗モジュールに使用される配線基板の平面図であり、図3Bは、配線基板の裏面図である。図4は、第1の実施の形態に係るシャント抵抗モジュールの断面図である。 <
FIG. 1 is a perspective view of the shunt resistance module according to the first embodiment. FIG. 2 is an exploded perspective view of the shunt resistance module according to the first embodiment. FIG. 3A is a plan view of the wiring board used for the shunt resistor module of the present embodiment, and FIG. 3B is a back view of the wiring board. FIG. 4 is a cross-sectional view of the shunt resistor module according to the first embodiment.
図1、図2及び図4に示すように、シャント抵抗モジュール1は、シャント抵抗器2と、複数の電圧信号パターン8a、8bを備えた配線基板3と、を具備する。
As shown in FIGS. 1, 2 and 4, the shunt resistor module 1 includes a shunt resistor 2 and a wiring board 3 provided with a plurality of voltage signal patterns 8a and 8b.
(シャント抵抗器2)
図2及び図4に示すように、高さ方向(Z)に延出する柱状の抵抗体4と、抵抗体4の上下両端に配置される第1の電極5及び第2の電極6を有して構成される。第1の電極5及び第2の電極6は、抵抗体4より電気抵抗値が低い。材質を限定するものではないが、例えば、抵抗体4は、Cu-Ni系、Cu-Mn系、Ni-Cr系等の金属であり、電極5、6は、Cu等の金属である。 (Shunt resistor 2)
As shown in FIGS. 2 and 4, it has acolumnar resistor 4 extending in the height direction (Z), and a first electrode 5 and a second electrode 6 arranged at both upper and lower ends of the resistor 4. It is composed of. The first electrode 5 and the second electrode 6 have lower electrical resistance values than the resistor 4. Although the material is not limited, for example, the resistor 4 is a metal such as Cu—Ni, Cu—Mn, or Ni—Cr, and the electrodes 5 and 6 are metals such as Cu.
図2及び図4に示すように、高さ方向(Z)に延出する柱状の抵抗体4と、抵抗体4の上下両端に配置される第1の電極5及び第2の電極6を有して構成される。第1の電極5及び第2の電極6は、抵抗体4より電気抵抗値が低い。材質を限定するものではないが、例えば、抵抗体4は、Cu-Ni系、Cu-Mn系、Ni-Cr系等の金属であり、電極5、6は、Cu等の金属である。 (Shunt resistor 2)
As shown in FIGS. 2 and 4, it has a
図2に示すように、例えば、柱状の抵抗体4は、複数本並設される。そして、各抵抗体4の上面に共通の第1の電極5が設けられ、各抵抗体4の下面に共通の第2の電極6が設けられる。
As shown in FIG. 2, for example, a plurality of columnar resistors 4 are arranged side by side. A common first electrode 5 is provided on the upper surface of each resistor 4, and a common second electrode 6 is provided on the lower surface of each resistor 4.
図2及び図4に示すように、第2の電極6は、第1の電極5よりもX方向に長く延出している。本明細書では、第1の電極5よりも長く延出した部分を延出部6aと称する。X方向は、高さ方向(Z)に対して直交する平面方向である。
As shown in FIGS. 2 and 4, the second electrode 6 extends longer in the X direction than the first electrode 5. In the present specification, a portion extending longer than the first electrode 5 is referred to as an extending portion 6a. The X direction is a plane direction orthogonal to the height direction (Z).
図2及び図4に示すように、第1の電極5には、貫通孔5aが形成されている。貫通孔5aは、第1の電極5の表面から裏面にかけて貫くとともに、抵抗体4と高さ方向(Z)にて対向する位置から外れた位置に設けられる。
As shown in FIGS. 2 and 4, a through hole 5a is formed in the first electrode 5. The through hole 5a penetrates from the front surface to the back surface of the first electrode 5 and is provided at a position deviated from the position facing the resistor 4 in the height direction (Z).
図2及び図4に示すように、第1の電極5及び第2の電極6の各中央には、固定穴5b、6bが形成されている。各固定穴5b、6bは、高さ方向(Z)に沿って一直線上に形成される。
As shown in FIGS. 2 and 4, fixing holes 5b and 6b are formed in the centers of the first electrode 5 and the second electrode 6. The fixing holes 5b and 6b are formed in a straight line along the height direction (Z).
(配線基板3)
配線基板3は、絶縁基板7と、絶縁基板7の表面7aに形成された、第1の電圧信号パターン8aと、第2の電圧信号パターン8bと、コネクタ9を有して構成される。 (Wiring board 3)
Thewiring board 3 includes an insulating substrate 7, a first voltage signal pattern 8a formed on the surface 7a of the insulating substrate 7, a second voltage signal pattern 8b, and a connector 9.
配線基板3は、絶縁基板7と、絶縁基板7の表面7aに形成された、第1の電圧信号パターン8aと、第2の電圧信号パターン8bと、コネクタ9を有して構成される。 (Wiring board 3)
The
図3A及び図4に示すように、絶縁基板7の表面7aには、第1の電圧信号パターン8a、及び、第2の電圧信号パターン8bが形成されている。第1の電圧信号パターン8aの一方の端部には、所定の面積を有する第1の接続パッド8cが一体的に形成されている。また、第1の電圧信号パターン8aの他方の端部は、コネクタ9に電気的に接続されている。
As shown in FIGS. 3A and 4, a first voltage signal pattern 8a and a second voltage signal pattern 8b are formed on the surface 7a of the insulating substrate 7. A first connection pad 8c having a predetermined area is integrally formed at one end of the first voltage signal pattern 8a. Further, the other end of the first voltage signal pattern 8a is electrically connected to the connector 9.
図3Bに示すように、絶縁基板7の裏面7bには、所定の大きさを備えた第2の接続パッド8dと、固定パターン8eが形成されている。第2の接続パッド8dと固定パターン8eは、電気的に繋がっていない。第2の接続パッド8d及び固定パターン8eは、延出部6a上にて、半田付けや導電性接着剤等により接続される。
As shown in FIG. 3B, a second connection pad 8d having a predetermined size and a fixing pattern 8e are formed on the back surface 7b of the insulating substrate 7. The second connection pad 8d and the fixed pattern 8e are not electrically connected. The second connection pad 8d and the fixing pattern 8e are connected on the extending portion 6a by soldering, a conductive adhesive, or the like.
図4に示すように、絶縁基板7の内部には、内部導電層41が形成されており、内部導電層41は、第2の接続パッド8dにまで通じている。図3A及び図3Bには、内部導電層41の位置を符号をつけて示した。
As shown in FIG. 4, an internal conductive layer 41 is formed inside the insulating substrate 7, and the internal conductive layer 41 leads to the second connection pad 8d. 3A and 3B show the positions of the internal conductive layer 41 with reference numerals.
図3Aに示すように、内部導電層41は、絶縁基板7の表面7aにて引き出された第2の電圧信号パターン8bに電気的に接続されている。第2の電圧信号パターン8bは、内部導電層41と接続される側と反対側の端部にて、コネクタ9に電気的に接続されている。なお、図3Aに示すように、絶縁基板7の表面7aには、各電圧信号パターン8a、8bのほか、電源パターン8fが形成されている。
As shown in FIG. 3A, the internal conductive layer 41 is electrically connected to the second voltage signal pattern 8b drawn out from the surface 7a of the insulating substrate 7. The second voltage signal pattern 8b is electrically connected to the connector 9 at an end opposite to the side connected to the internal conductive layer 41. As shown in FIG. 3A, a power supply pattern 8f is formed on the surface 7a of the insulating substrate 7 in addition to the voltage signal patterns 8a and 8b.
第1の実施の形態では、図1及び図4に示すように、配線基板3が、第2の電極6の延出部6a上に載置され、このとき、半田付け等により、配線基板3の第2の接続パッド8d及び固定パターン8eが、第2の電極6上に固定支持される。これにより、第2の電極6と、第2の電圧信号パターン8bは、第2の接続パッド8d及び内部導電層41を介して電気的に接続される。
In the first embodiment, as shown in FIGS. 1 and 4, the wiring board 3 is placed on the extending portion 6a of the second electrode 6, and at this time, the wiring board 3 is soldered or the like. The second connection pad 8d and the fixing pattern 8e of the above are fixedly supported on the second electrode 6. As a result, the second electrode 6 and the second voltage signal pattern 8b are electrically connected via the second connection pad 8d and the internal conductive layer 41.
図2及び図4に示すように、第1の電極5に設けられた貫通孔5aには、棒状の導通部材42が挿通される。導通部材42の材質を問うものではないが、例えば、鉄、銅、真鍮等である。導通部材42は、第2の電極5の板厚よりも高さ方向(Z)に長く形成されており、図4に示すように、第1の電極5の貫通孔5aに挿通された導通部材42は、配線基板3の第1の接続パッド8c上に当接する。このとき、導通部材42と第1の接続パッド8cの間は、半田付けや導電性接着剤等で固定支持されることが好ましい。これにより、第1の電極5と第1の電圧信号パターン8aの間が、導通部材42及び第1の接続パッド8cを介して、電気的に接続される。
As shown in FIGS. 2 and 4, a rod-shaped conductive member 42 is inserted into the through hole 5a provided in the first electrode 5. The material of the conductive member 42 does not matter, but for example, iron, copper, brass, or the like. The conductive member 42 is formed longer in the height direction (Z) than the plate thickness of the second electrode 5, and as shown in FIG. 4, the conductive member 42 is inserted through the through hole 5a of the first electrode 5. 42 comes into contact with the first connection pad 8c of the wiring board 3. At this time, it is preferable that the conductive member 42 and the first connection pad 8c are fixedly supported by soldering, a conductive adhesive, or the like. As a result, the first electrode 5 and the first voltage signal pattern 8a are electrically connected via the conductive member 42 and the first connection pad 8c.
(シャント抵抗モジュール1の実装構造)
図2に示すように、シャント抵抗器2の表面側と裏面側に、例えば、外部配線部材としてのバスバー44、45を重ねる。このとき、バスバー44、45に形成された固定穴44a、45aを、第1の電極5及び第2の電極6に形成された固定穴5b、6bの位置に合わせる。 (Mounting structure of shunt resistor module 1)
As shown in FIG. 2, for example, bus bars 44 and 45 as external wiring members are superposed on the front surface side and the back surface side of theshunt resistor 2. At this time, the fixing holes 44a and 45a formed in the bus bars 44 and 45 are aligned with the positions of the fixing holes 5b and 6b formed in the first electrode 5 and the second electrode 6.
図2に示すように、シャント抵抗器2の表面側と裏面側に、例えば、外部配線部材としてのバスバー44、45を重ねる。このとき、バスバー44、45に形成された固定穴44a、45aを、第1の電極5及び第2の電極6に形成された固定穴5b、6bの位置に合わせる。 (Mounting structure of shunt resistor module 1)
As shown in FIG. 2, for example, bus bars 44 and 45 as external wiring members are superposed on the front surface side and the back surface side of the
そして、絶縁ワッシャ等を介して、固定部材46を、バスバー44、45の固定穴44a、45a及び、各電極5、6の固定穴5b、6bに挿通する。図2及び図4に示すように、固定部材46の先端は、ねじ部46aであり、同様に、バスバー45にもネジが切られている。よって、固定部材46を固定穴5b、6b、44a、45aに挿通するとともに、バスバー45にねじ止めすることができ、これにより、シャント抵抗モジュール1にバスバー44、45を、固定支持することができる。
Then, the fixing member 46 is inserted into the fixing holes 44a and 45a of the bus bars 44 and 45 and the fixing holes 5b and 6b of the electrodes 5 and 6 via an insulating washer or the like. As shown in FIGS. 2 and 4, the tip of the fixing member 46 is a threaded portion 46a, and similarly, the bus bar 45 is also threaded. Therefore, the fixing member 46 can be inserted into the fixing holes 5b, 6b, 44a, 45a and screwed to the bus bar 45, whereby the bus bars 44, 45 can be fixedly supported by the shunt resistance module 1. ..
図2及び図4に示すように、固定部材46の周囲表面には、先端のねじ部46aを除いて、例えば、絶縁チューブ47が取り付けられている。例えば、絶縁チューブ47を固定部材46に挿入し収縮させることで、固定部材46の周囲に固定することができる。図4に示すように、絶縁チューブ47は、固定部材46を固定穴5b、6b、44a、45aに挿通した状態では、シャント抵抗器2の電極5、6間を絶縁している。このため、バスバー44、45間に、シャント抵抗モジュール1を介して電流が流れる際、電流が固定部材46を介して流れる不具合を防止することができる。絶縁チューブ47を用いる構成以外に、例えば、絶縁材料を固定部材46の表面に塗装、スプレー、或いは、蒸着等して絶縁層を形成してもよい。
As shown in FIGS. 2 and 4, for example, an insulating tube 47 is attached to the peripheral surface of the fixing member 46, except for the screw portion 46a at the tip. For example, by inserting the insulating tube 47 into the fixing member 46 and contracting it, it can be fixed around the fixing member 46. As shown in FIG. 4, the insulating tube 47 insulates between the electrodes 5 and 6 of the shunt resistor 2 in a state where the fixing member 46 is inserted into the fixing holes 5b, 6b, 44a and 45a. Therefore, when a current flows between the bus bars 44 and 45 via the shunt resistor module 1, it is possible to prevent a problem that the current flows through the fixing member 46. In addition to the configuration using the insulating tube 47, for example, an insulating material may be coated, sprayed, or vapor-deposited on the surface of the fixing member 46 to form an insulating layer.
本実施の形態におけるシャント抵抗モジュール1は、図示しない電圧計にコネクタ9を介して接続され、第1の電極5と第2の電極6の間の電圧値を計測する。このとき、シャント抵抗器2を構成する抵抗体4の抵抗値は既知であるため、オームの法則により、電流値を検出することができる。このように、本実施の形態におけるシャント抵抗モジュール1は、電流検出装置として用いることができる。
The shunt resistor module 1 in the present embodiment is connected to a voltmeter (not shown) via a connector 9 and measures a voltage value between the first electrode 5 and the second electrode 6. At this time, since the resistance value of the resistor 4 constituting the shunt resistor 2 is known, the current value can be detected according to Ohm's law. As described above, the shunt resistance module 1 in the present embodiment can be used as a current detection device.
(本実施の形態の効果について)
第1の実施の形態では、シャント抵抗器2と、電圧信号パターン8a、8bが形成された配線基板3を用い、該配線基板3を、第2の電極6に設けられた延出部6a上に載置した。 (About the effect of this embodiment)
In the first embodiment, theshunt resistor 2 and the wiring board 3 on which the voltage signal patterns 8a and 8b are formed are used, and the wiring board 3 is placed on the extension portion 6a provided on the second electrode 6. It was placed in.
第1の実施の形態では、シャント抵抗器2と、電圧信号パターン8a、8bが形成された配線基板3を用い、該配線基板3を、第2の電極6に設けられた延出部6a上に載置した。 (About the effect of this embodiment)
In the first embodiment, the
このように、電圧信号パターン8a、8bを配線基板3に集約し、配線基板3を、延出部6a上に載置することで、配線基板3を安定して支持することができるとともに、各電圧信号パターン8a、8bを、電極5、6間から容易に引き出すことができ、且つ電極5、6との接続安定性を確保することができる。
By consolidating the voltage signal patterns 8a and 8b on the wiring board 3 and placing the wiring board 3 on the extending portion 6a in this way, the wiring board 3 can be stably supported and each of them can be supported. The voltage signal patterns 8a and 8b can be easily drawn out from between the electrodes 5 and 6, and the connection stability with the electrodes 5 and 6 can be ensured.
このとき、第1の電極5と配線基板3間は、第1の電極5に設けられた貫通孔5aに導通部材42を通し、導通部材42を第1の接続パッド8c上に当接させる。これにより、第1の電極5と第1の電圧信号パターン8aを、容易に、電気的に接続することができるとともに、より優れた接続安定性を確保することができる。
At this time, between the first electrode 5 and the wiring board 3, the conductive member 42 is passed through the through hole 5a provided in the first electrode 5, and the conductive member 42 is brought into contact with the first connection pad 8c. As a result, the first electrode 5 and the first voltage signal pattern 8a can be easily and electrically connected, and better connection stability can be ensured.
また、配線基板3の表面には、第1の電圧信号パターン8aとともに、第2の電圧信号パターン8bが形成されており、配線基板3の裏面には、第2の電圧信号パターン8bに繋がる第2の接続パッド8dが設けられている。第1の実施の形態では、配線基板3を、第2の電極6の延出部6a上に載置することで、第2の接続パッド8dと第2の電極6とを電気的に接続でき、その結果、第2の電極6と第2の電圧信号パターン8bを、容易に、電気的に接続することができるとともに、より優れた接続安定性を確保することができる。
A second voltage signal pattern 8b is formed on the front surface of the wiring board 3 together with the first voltage signal pattern 8a, and a second voltage signal pattern 8b is connected to the back surface of the wiring board 3. The connection pad 8d of 2 is provided. In the first embodiment, the wiring board 3 is placed on the extending portion 6a of the second electrode 6, so that the second connection pad 8d and the second electrode 6 can be electrically connected to each other. As a result, the second electrode 6 and the second voltage signal pattern 8b can be easily and electrically connected, and more excellent connection stability can be ensured.
また、上記したように、第1の電極5に電気的に接続される第1の電圧信号パターン8a、及び、第2の電極6に電気的に接続される第2の電圧信号パターン8bを、絶縁基板7の表面7aに配置した。すなわち、第1の電圧信号パターン8a及び第2の電圧信号パターン8bは、同一面から引き出されている。
Further, as described above, the first voltage signal pattern 8a electrically connected to the first electrode 5 and the second voltage signal pattern 8b electrically connected to the second electrode 6 are used. It was arranged on the surface 7a of the insulating substrate 7. That is, the first voltage signal pattern 8a and the second voltage signal pattern 8b are drawn out from the same surface.
ここで、電極5、6間の抵抗体4に電流が流れた際に、右ねじの法則により、磁束(磁場)が生じるが、上記した第1の実施の形態では、各電圧信号パターン8a、8bを同一面から引き出した結果、磁束の影響を抑制することができ、電流検出を精度良く行うことが可能になる。すなわち、第1の電圧信号パターン8a及び第2の電圧信号パターン8bを、同じ高さ位置から引き出すことで、異なる高さにて引き出すよりも、磁束の回り込みが発生しにくく、磁束の影響を抑制することができ、電流検出を精度良く行うことが可能になる。
Here, when a current flows through the resistor 4 between the electrodes 5 and 6, a magnetic flux (magnetic field) is generated according to the right-handed screw rule. However, in the first embodiment described above, each voltage signal pattern 8a, As a result of pulling out 8b from the same surface, the influence of magnetic flux can be suppressed, and current detection can be performed with high accuracy. That is, by pulling out the first voltage signal pattern 8a and the second voltage signal pattern 8b from the same height position, magnetic flux wraparound is less likely to occur and the influence of magnetic flux is suppressed as compared with pulling out at different heights. This makes it possible to perform current detection with high accuracy.
<第2の実施の形態のシャント抵抗モジュール10>
図5は、第2の実施の形態に係るシャント抵抗モジュールの断面図である。図5において、上記した第1の実施の形態と同じ部材に関しては、同じ符号を付した。 <Shunt resistance module 10 of the second embodiment>
FIG. 5 is a cross-sectional view of the shunt resistor module according to the second embodiment. In FIG. 5, the same members as those in the first embodiment described above are designated by the same reference numerals.
図5は、第2の実施の形態に係るシャント抵抗モジュールの断面図である。図5において、上記した第1の実施の形態と同じ部材に関しては、同じ符号を付した。 <
FIG. 5 is a cross-sectional view of the shunt resistor module according to the second embodiment. In FIG. 5, the same members as those in the first embodiment described above are designated by the same reference numerals.
図5に示すように、シャント抵抗モジュール10は、第1の電極5と、第2の電極6と、第1の電極5と第2の電極6の間に位置する複数の柱状の抵抗体4と、を有するシャント抵抗器2と、配線基板13とを具備する。
As shown in FIG. 5, the shunt resistor module 10 has a plurality of columnar resistors 4 located between the first electrode 5, the second electrode 6, and the first electrode 5 and the second electrode 6. A shunt resistor 2 having the above and a wiring board 13 are provided.
配線基板13は、絶縁基板7と、絶縁基板7の表面7aに形成された第1の電圧信号パターン8aと、絶縁基板7の裏面7bに形成された第2の電圧信号パターン8bを有する。各電圧信号パターン8a、8bの端部は、図3Aや図3Bに示す接続パッド8c、8dを構成している。
The wiring board 13 has an insulating substrate 7, a first voltage signal pattern 8a formed on the front surface 7a of the insulating substrate 7, and a second voltage signal pattern 8b formed on the back surface 7b of the insulating substrate 7. The ends of the voltage signal patterns 8a and 8b form the connection pads 8c and 8d shown in FIGS. 3A and 3B.
図5に示すように、第1の電圧信号パターン8aに繋がる第1の接続パッド8cと、第1の電極5との間に、導電性のスプリング(弾性部材)51が設けられている。また、第2の電圧信号パターン8bに繋がる第2の接続パッド8dと、第2の電極6との間に、導電性のスプリング(弾性部材)52が設けられている。これにより、各接続パッド8c、8dと、各電極5、6との間が電気的に接続される。
As shown in FIG. 5, a conductive spring (elastic member) 51 is provided between the first connection pad 8c connected to the first voltage signal pattern 8a and the first electrode 5. Further, a conductive spring (elastic member) 52 is provided between the second connection pad 8d connected to the second voltage signal pattern 8b and the second electrode 6. As a result, the connection pads 8c and 8d and the electrodes 5 and 6 are electrically connected.
図5に示すように、第2の電極6の延出部6a上には、電気的に絶縁性の台座54が設けられており、配線基板13は、台座54上に配置される。配線基板13を台座54上に載置することで、安定した支持構造とすることができる。台座54の材質を問うものではないが、例えば、樹脂製である。
As shown in FIG. 5, an electrically insulating pedestal 54 is provided on the extending portion 6a of the second electrode 6, and the wiring board 13 is arranged on the pedestal 54. By placing the wiring board 13 on the pedestal 54, a stable support structure can be obtained. The material of the pedestal 54 does not matter, but it is made of resin, for example.
スプリング51、52を、配線基板13の各接続パッド8c、8d、或いは、電極5、6に予め、半田付け等で固定支持しておき、配線基板13を、第1の電極5と第2の電極16の間の空間に挿入する。このとき、スプリング51、52の弾性力により、容易に、各接続パッド8c、8dと、各電極5、6間を電気的に接続することができるとともに、接続安定性を確保することができる。
The springs 51 and 52 are fixedly supported on the connection pads 8c and 8d of the wiring board 13 or the electrodes 5 and 6 in advance by soldering or the like, and the wiring board 13 is supported by the first electrodes 5 and the second. Insert into the space between the electrodes 16. At this time, due to the elastic force of the springs 51 and 52, the connection pads 8c and 8d can be easily electrically connected to each of the electrodes 5 and 6, and the connection stability can be ensured.
<別の実施の形態のシャント抵抗モジュール20>
図6は、他の実施の形態に係るシャント抵抗モジュールの斜視図である。図7は、図6のシャント抵抗モジュールの分解斜視図である。図8は、図6のシャント抵抗モジュールの平面図である。図9は、図6のシャント抵抗モジュールの側面図である。図10A及び図10Bは、図6のシャント抵抗モジュールの一部を拡大して示した部分拡大断面図である。 <Shunt resistor module 20 of another embodiment>
FIG. 6 is a perspective view of the shunt resistor module according to another embodiment. FIG. 7 is an exploded perspective view of the shunt resistor module of FIG. FIG. 8 is a plan view of the shunt resistor module of FIG. FIG. 9 is a side view of the shunt resistor module of FIG. 10A and 10B are partially enlarged cross-sectional views showing a part of the shunt resistor module of FIG.
図6は、他の実施の形態に係るシャント抵抗モジュールの斜視図である。図7は、図6のシャント抵抗モジュールの分解斜視図である。図8は、図6のシャント抵抗モジュールの平面図である。図9は、図6のシャント抵抗モジュールの側面図である。図10A及び図10Bは、図6のシャント抵抗モジュールの一部を拡大して示した部分拡大断面図である。 <
FIG. 6 is a perspective view of the shunt resistor module according to another embodiment. FIG. 7 is an exploded perspective view of the shunt resistor module of FIG. FIG. 8 is a plan view of the shunt resistor module of FIG. FIG. 9 is a side view of the shunt resistor module of FIG. 10A and 10B are partially enlarged cross-sectional views showing a part of the shunt resistor module of FIG.
図6等に示す別の実施の形態に示すシャント抵抗モジュール20は、大電流化に伴い、シャント抵抗器22を構成する各電極25、26を大きくし、且つ電極25、26間に介在する抵抗体24の高さ方向への長さが短くなった場合の一例である。
In the shunt resistor module 20 shown in another embodiment shown in FIG. 6 and the like, the electrodes 25 and 26 constituting the shunt resistor 22 are enlarged as the current increases, and the resistance interposed between the electrodes 25 and 26 is increased. This is an example of a case where the length of the body 24 in the height direction is shortened.
すなわち、別の実施の形態では、上記した第1の実施の形態や第2の実施の形態に比べて、第1の電極25と第2の電極26の間の空間高さは、小さくなるため、第1の実施の形態及び第2の実施の形態に示した配線基板3、13を、第1の電極25と第2の電極26の間の狭い空間に挿入することが困難となる。
That is, in another embodiment, the space height between the first electrode 25 and the second electrode 26 is smaller than that in the first embodiment and the second embodiment described above. , It becomes difficult to insert the wiring boards 3 and 13 shown in the first embodiment and the second embodiment into the narrow space between the first electrode 25 and the second electrode 26.
そこで、別の実施の形態では、例えば、同形状の第1の電極25と第2の電極26を平面方向にずらして配置し、それにより、はみ出した延出部26aの表面に、電圧信号パターン28及びコネクタ29を設けることとした。すなわち、第2の電極26は、配線基板(コネクタ基板)を兼ねている。
Therefore, in another embodiment, for example, the first electrode 25 and the second electrode 26 having the same shape are arranged so as to be offset in the plane direction, whereby the voltage signal pattern is formed on the surface of the protruding portion 26a. It was decided to provide 28 and a connector 29. That is, the second electrode 26 also serves as a wiring board (connector board).
一例であるが、図10Aに示すように、延出部26aの表面に、絶縁層31、電圧信号パターン28等を、メッキやスパッタ等の薄膜技術を用いて形成する。図10Aに示すように、延出部26a上には、接続パッド(第1の実施の形態の第2の接続パッド8dに相当)33を形成し、絶縁層31の表面に位置する図示しない第2の電圧信号パターンと電気的に接続する。図10Aに図示した電圧信号パターン28は、第1の電圧信号パターンであり、第1の電圧信号パターン28と第1の電極25とを、例えば、メッキ等で形成されたバンプ34を介して電気的に接続することができる。
As an example, as shown in FIG. 10A, an insulating layer 31, a voltage signal pattern 28, etc. are formed on the surface of the extending portion 26a by using a thin film technique such as plating or sputtering. As shown in FIG. 10A, a connection pad (corresponding to the second connection pad 8d of the first embodiment) 33 is formed on the extension portion 26a, and is located on the surface of the insulating layer 31 (not shown). Electrically connect to the voltage signal pattern of 2. The voltage signal pattern 28 illustrated in FIG. 10A is a first voltage signal pattern, and the first voltage signal pattern 28 and the first electrode 25 are electrically connected via, for example, bumps 34 formed by plating or the like. Can be connected.
或いは、図10Bに示すように、絶縁層31の膜厚等を考慮して、第1の電圧信号パターン28と第1の電極25とを直接、電気的に接続することもできる。
Alternatively, as shown in FIG. 10B, the first voltage signal pattern 28 and the first electrode 25 can be directly and electrically connected in consideration of the film thickness of the insulating layer 31 and the like.
図5~図10に示す別の実施の形態のシャント抵抗モジュール20によれば、シャント抵抗器22の低背化に応じて、電圧信号パターンを容易に引き出すことができるとともに、電極との接続安定性を確保することができる。
According to the shunt resistor module 20 of another embodiment shown in FIGS. 5 to 10, the voltage signal pattern can be easily drawn out according to the reduction in height of the shunt resistor 22, and the connection with the electrode is stable. Sex can be ensured.
本実施の形態及び変形例を説明したが、他の実施の形態として、上記実施の形態及び変形例を全体的又は部分的に組み合わせたものでもよい。
Although the present embodiment and the modified example have been described, as another embodiment, the above-described embodiment and the modified example may be combined in whole or in part.
また、本実施の形態は上記の実施の形態及び変形例に限定されるものではなく、技術的思想の趣旨を逸脱しない範囲において様々に変更、置換、変形されてもよい。さらに、技術の進歩又は派生する別技術によって、技術的思想を別の仕方で実現することができれば、その方法を用いて実施されてもよい。したがって、特許請求の範囲は、技術的思想の範囲内に含まれ得る全ての実施態様をカバーしている。
下記に、上記実施の形態における特徴点を整理する。 Further, the present embodiment is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea. Further, if the technical idea can be realized in another way by the advancement of the technology or another technology derived from it, it may be carried out by using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea.
The feature points in the above-described embodiment are summarized below.
下記に、上記実施の形態における特徴点を整理する。 Further, the present embodiment is not limited to the above-described embodiment and modification, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea. Further, if the technical idea can be realized in another way by the advancement of the technology or another technology derived from it, it may be carried out by using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea.
The feature points in the above-described embodiment are summarized below.
本実施の形態におけるシャント抵抗モジュールは、高さ方向に対向する第1の電極及び第2の電極と、各電極の間に接続される柱状の抵抗体と、を備えたシャント抵抗器と、各電極に夫々、電気的に接続され、各電極間の電圧を検出するための複数の電圧信号パターンを備えた配線基板と、を有し、前記第2の電極には、前記第1の電極よりも平面方向に延出した延出部を備え、前記配線基板は、前記延出部の表面に載置されることを特徴とする。
The shunt resistor module according to the present embodiment includes a shunt resistor including a first electrode and a second electrode facing each other in the height direction, and a columnar resistor connected between the electrodes. Each of the electrodes is electrically connected to a wiring substrate having a plurality of voltage signal patterns for detecting a voltage between the electrodes, and the second electrode has a wiring substrate from the first electrode. Also provided with an extension portion extending in the plane direction, the wiring substrate is mounted on the surface of the extension portion.
また、本実施の形態では、前記第1の電極には、貫通孔が設けられており、前記貫通孔には、導通部材が挿入されており、前記導通部材は、前記第1の電極と電気的に接続される前記電圧信号パターンの表面に当接していることが好ましい。
Further, in the present embodiment, the first electrode is provided with a through hole, a conductive member is inserted into the through hole, and the conductive member is electrically connected to the first electrode. It is preferable that the voltage signal pattern is in contact with the surface of the voltage signal pattern.
また、本実施の形態では、前記配線基板の表面に、前記複数の電圧信号パターンが形成されており、前記配線基板の裏面に接続パッドが形成されており、前記接続パッドは、前記第2の電極と電気的に接続される前記電圧信号パターンに繋がっていることが好ましい。
Further, in the present embodiment, the plurality of voltage signal patterns are formed on the front surface of the wiring board, the connection pad is formed on the back surface of the wiring board, and the connection pad is the second. It is preferably connected to the voltage signal pattern that is electrically connected to the electrode.
また、別の実施の形態におけるシャント抵抗モジュールは、高さ方向に対向する一対の電極と、各電極の間に接続される柱状の抵抗体と、を備えたシャント抵抗器と、各電極に夫々、電気的に接続され、各電極間の電圧を検出するための複数の電圧信号パターンを備えた配線基板と、を有し、一方の電極は、電圧信号パターンが形成された配線基板(コネクタ基板)を兼ねていることを特徴とする。
Further, the shunt resistor module according to another embodiment includes a shunt resistor including a pair of electrodes facing each other in the height direction and a columnar resistor connected between the electrodes, and a shunt resistor for each electrode. A wiring board that is electrically connected and has a plurality of voltage signal patterns for detecting a voltage between each electrode, and one electrode is a wiring board (connector board) on which a voltage signal pattern is formed. ) Is also used.
以上説明したように、本発明のシャント抵抗モジュールは、立体構造のシャント抵抗器を用いることができ、小型化で、大電流に対応可能であるとともに、電圧信号パターンを容易に引き出すことができ、且つ電極との接続安定性を得ることができる。本発明のシャント抵抗モジュールを、例えば、パワー半導体装置等の制御用途の電流検出、バッテリーのエネルギーマネジメントに適用することができる。
As described above, the shunt resistor module of the present invention can use a shunt resistor having a three-dimensional structure, can be miniaturized, can handle a large current, and can easily draw out a voltage signal pattern. Moreover, the connection stability with the electrode can be obtained. The shunt resistor module of the present invention can be applied to, for example, current detection and battery energy management for control applications such as power semiconductor devices.
本出願は、2019年12月6日出願の特願2019-220953に基づく。この内容は全てここに含めておく。
This application is based on Japanese Patent Application No. 2019-220953 filed on December 6, 2019. All this content is included here.
Claims (3)
- 高さ方向に対向する第1の電極及び第2の電極と、各電極の間に接続される柱状の抵抗体と、を備えたシャント抵抗器と、
各電極に夫々、電気的に接続され、各電極間の電圧を検出するための複数の電圧信号パターンを備えた配線基板と、を有し、
前記第2の電極には、前記第1の電極よりも平面方向に延出した延出部を備え、前記配線基板は、前記延出部の表面に載置されることを特徴とするシャント抵抗モジュール。 A shunt resistor comprising a first electrode and a second electrode facing each other in the height direction and a columnar resistor connected between the electrodes.
Each electrode has a wiring board that is electrically connected and has a plurality of voltage signal patterns for detecting the voltage between the electrodes.
The second electrode is provided with an extension portion extending in a plane direction with respect to the first electrode, and the wiring board is placed on the surface of the extension portion. module. - 前記第1の電極には、貫通孔が設けられており、前記貫通孔には、導通部材が挿入されており、前記導通部材は、前記第1の電極と電気的に接続される前記電圧信号パターンの表面に当接していることを特徴とする請求項1に記載のシャント抵抗モジュール。 The first electrode is provided with a through hole, a conductive member is inserted into the through hole, and the conductive member is electrically connected to the first electrode. The shunt resistor module according to claim 1, wherein the shunt resistance module is in contact with the surface of the pattern.
- 前記配線基板の表面に、前記複数の電圧信号パターンが形成されており、前記配線基板の裏面に接続パッドが形成されており、前記接続パッドは、前記第2の電極と電気的に接続される前記電圧信号パターンに繋がっていることを特徴とする請求項2に記載のシャント抵抗モジュール。 The plurality of voltage signal patterns are formed on the front surface of the wiring board, a connection pad is formed on the back surface of the wiring board, and the connection pad is electrically connected to the second electrode. The shunt resistance module according to claim 2, wherein the shunt resistance module is connected to the voltage signal pattern.
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DE102022115523A1 (en) | 2022-06-22 | 2023-12-28 | Isabellenhütte Heusler Gmbh & Co. Kg | Current measuring resistor |
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WO2013121872A1 (en) * | 2012-02-14 | 2013-08-22 | コーア株式会社 | Terminal connection structure for resistor |
US20130314827A1 (en) * | 2012-05-25 | 2013-11-28 | Lsis Co., Ltd. | Current detecting mechanism capable of detecting ground fault for direct current circuit breaker |
JP2014059269A (en) * | 2012-09-19 | 2014-04-03 | Koa Corp | Resistor for current detection |
WO2018150870A1 (en) * | 2017-02-15 | 2018-08-23 | Koa株式会社 | Shunt resistor and current detection apparatus using shunt resistor |
JP2019201170A (en) * | 2018-05-18 | 2019-11-21 | Koa株式会社 | Shunt resistor and mounting structure of shunt resistor |
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WO2013121872A1 (en) * | 2012-02-14 | 2013-08-22 | コーア株式会社 | Terminal connection structure for resistor |
US20130314827A1 (en) * | 2012-05-25 | 2013-11-28 | Lsis Co., Ltd. | Current detecting mechanism capable of detecting ground fault for direct current circuit breaker |
JP2014059269A (en) * | 2012-09-19 | 2014-04-03 | Koa Corp | Resistor for current detection |
WO2018150870A1 (en) * | 2017-02-15 | 2018-08-23 | Koa株式会社 | Shunt resistor and current detection apparatus using shunt resistor |
JP2019201170A (en) * | 2018-05-18 | 2019-11-21 | Koa株式会社 | Shunt resistor and mounting structure of shunt resistor |
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