WO2021107100A1 - Method of manufacturing plated member, and plating apparatus - Google Patents

Method of manufacturing plated member, and plating apparatus Download PDF

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Publication number
WO2021107100A1
WO2021107100A1 PCT/JP2020/044240 JP2020044240W WO2021107100A1 WO 2021107100 A1 WO2021107100 A1 WO 2021107100A1 JP 2020044240 W JP2020044240 W JP 2020044240W WO 2021107100 A1 WO2021107100 A1 WO 2021107100A1
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WIPO (PCT)
Prior art keywords
electrolytic solution
basket
plating
jet
plated
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PCT/JP2020/044240
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French (fr)
Japanese (ja)
Inventor
木村　拡
克通 伊東
亘 田村
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パナソニックＩｐマネジメント株式会社
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Publication of WO2021107100A1 publication Critical patent/WO2021107100A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Definitions

  • the present disclosure relates to a method for manufacturing a plated member and a plating processing apparatus.
  • Patent Document 1 When electroplating relatively small parts, barrel plating is generally used. Further, a jet-type plating apparatus that performs electrolytic plating while jetting parts together with an electrolytic solution is also known (Patent Document 1).
  • the conductive component is electroplated while the electrolytic solution containing metal ions circulates in the liquid jet layer. More specifically, in the device of Patent Document 1, the component comes into contact with the feeding surface, and the electric current passes through the component, so that metal adheres to the component from the electrolytic solution while the component circulates in the device. By doing so, a plated part can be obtained.
  • the jet of the electrolytic solution and the parts to be plated is continuously performed.
  • the jet is continuously jetted, the plating film may not grow sufficiently.
  • One aspect of the present disclosure is a basket having a bottom having an inner surface that is inclined downward and functions as a feeding surface, and an electric tank that houses the electrolytic solution and the basket immersed in the electrolytic solution.
  • the member to be plated is jetted upward from the bottom side together with the electrolytic solution and stirred, and the member is plated.
  • the plating treatment step relates to a method for manufacturing a plated member, which comprises intermittently jetting the electrolytic solution and the member.
  • a basket with a bottom that is tilted downward and has an inner surface that acts as a feeding surface, and an electric solution that houses the electrolyte and the basket immersed in the electrolyte.
  • a plating tank equipped with a tank, A supply pipe that supplies the electrolytic solution to the bottom of the basket, A discharge pipe for discharging the electrolytic solution from the plating tank, With a control unit In the plating process of plating the member, the control unit jets the member to be plated together with the electrolytic solution upward from the bottom side and stirs the member in the basket, and the electrolytic solution and the said.
  • the present invention relates to a plating processing apparatus including a control unit that controls the jet flow of members intermittently.
  • the variation in the thickness of the plating film can be reduced.
  • the method for producing a plated member of the present disclosure is a basket having a bottom having an inner surface that is inclined downward and functions as a feeding surface, and the electrolytic solution and the said one immersed in the electrolytic solution.
  • the member to be plated is jetted upward from the bottom side together with the electrolytic solution and stirred while plating the member. Includes processing steps.
  • the plating process involves intermittent jetting of the electrolyte and the members.
  • the thickness of the plating film may vary.
  • the plating film grows while the member is in contact with the feeding surface.
  • the time for the member to come into contact with the feeding surface is shortened, and there are places in the member where the plating film is difficult to grow. As a result, it is considered that the thickness of the plating film varies.
  • the plating treatment step includes intermittently jetting the electrolytic solution and the member.
  • the member is in contact with the feeding surface of the basket for a relatively long time while the jet is stopped. Therefore, as compared with the case where the jet flow is continuously performed, the plating film is likely to grow in the entire area to be plated of the member while the jet flow and the stop of the jet flow are repeated. This reduces variations in the thickness of the plating film.
  • the plating treatment is performed in a specific plating tank while jetting and stirring the electrolytic solution and the member to be plated.
  • the plating tank includes a basket having a bottom having an inner surface that functions as a feeding surface, and an electric tank that houses the electrolytic solution and the basket immersed in the electrolytic solution.
  • the members are jetted upward from the bottom side together with the electrolytic solution and stirred.
  • the inner surface of the bottom which is the feeding surface, is inclined so as to narrow downward.
  • the member injected upward in the basket together with the electrolytic solution settles and lands on the feeding surface, moves to the bottom side along the inclined feeding surface, and is jetted upward again. By repeating such a flow of the electrolytic solution and the member in the basket, the electrolytic solution and the member are agitated.
  • the basket is configured so that at least the electrolytic solution is discharged from the basket to the plating tank.
  • at least the electrolyte may be drained from the bottom of the basket, or at least the electrolyte may overflow from the top of the basket.
  • the electrolytic solution and the member may be discharged together with the electrolytic solution. From the viewpoint of efficiently forming the plating film, it is preferable to configure the basket so that the electrolytic solution is discharged from the basket with the members left in the basket.
  • a window for overflowing the electrolytic solution or the like may be formed on the bottom side or the top of the basket.
  • a filter may be attached to the window formed in the basket so that the member remains in the basket while overflowing the electrolytic solution.
  • the filter only needs to be able to pass the electrolytic solution without passing through the member.
  • a net-like filter is used as the filter.
  • the basket usually has a side wall that is continuous with the bottom and extends upward, and an opening formed at the top of the side wall.
  • a lid may be attached to the opening on the upper side.
  • the windows described above are formed, for example, on at least one of a side wall and a lid.
  • the electrolytic solution and members jetted upward from the bottom of the basket at least the electrolytic solution is discharged from at least one window of the side wall and the lid into the plating tank and to the outer part of the basket.
  • the electrolytic solution and the members discharged to the outside of the basket at least the electrolytic solution may be resupplied into the basket, if necessary.
  • at least the electrolytic solution may be circulated in the plating tank including the inside of the basket.
  • the capacity of the basket is, for example, 10 L or less, and may be 4 L or less. From the viewpoint of efficiently performing the plating process by utilizing the intermittent jet, the capacity of the basket is preferably 1.5 L or less, and may be 1 L or less. The capacity of the basket may be 0.1 L or more, 0.2 L or more, or 0.5 L or more.
  • the capacity of the basket refers to the volume of the space surrounded by the inner wall of the basket between the lowermost end of the inner surface of the bottom and the opening.
  • the capacity of the basket is calculated on the assumption that the inner wall is formed so as not to be uneven with the inner wall of the basket adjacent to the window portion.
  • the electrolytic solution is stored in the battery case.
  • the basket may be in a state where at least the bottom side is immersed in the electrolytic solution of the plating tank.
  • the liquid level of the electrolytic solution is formed in the basket, air is easily entrained at the liquid level, so that bubbles are easily generated and adhered to the member.
  • the member is less likely to settle on the bottom of the basket. Therefore, from the viewpoint of efficiently circulating the members in the basket, it is preferable that the entire window formed on the side wall is immersed in the electrolytic solution of the plating tank. From the same viewpoint, it is more preferable that the entire basket is immersed in the electrolytic solution of the plating tank, and it is further preferable that the entire basket is immersed in the electrolytic solution of the plating tank up to the upper part of the lid.
  • the plating tank may be provided with a jet pipe in which the electrolytic solution and the member to be plated are jetted upward in the basket.
  • the jet pipe may be configured such that the electrolytic solution and the member are jetted in the basket from the bottom side upward.
  • the upper end of the jet pipe may be connected to the bottom of the basket, and at least the electrolytic solution may be vigorously passed through the jet pipe to be jetted into the basket.
  • the jet pipe may be integrated with the basket.
  • an electrolytic solution and an electrolytic solution and a pipe using a pipe connected to the bottom of the basket inlet pipe of Patent Document 1 and a pipe arranged in the basket (draft pipe of Patent Document 1) are used.
  • the member may be configured to flow through the basket.
  • the inlet pipe and the draft pipe correspond to the jet pipe.
  • An opening may be formed in the jet pipe on the bottom side in the plating tank.
  • the electrolytic solution and members discharged from the basket at least the electrolytic solution may be supplied into the jet pipe through this opening and may be supplied again into the basket.
  • the plating tank may be connected to a supply pipe that supplies the electrolytic solution to the bottom of the basket.
  • the plating treatment step may be performed while supplying the electrolytic solution from the supply pipe.
  • the speed of the plating process can be increased.
  • at least the electrolytic solution overflows from the upper part of the basket in the plating process.
  • the electrolytic solution may be supplied continuously or intermittently from the supply pipe.
  • the jet pipe may be connected to the pump.
  • the jet may be intermittently operated by operating the pump intermittently.
  • the electrolytic solution may be continuously supplied from the supply pipe or may be intermittently supplied.
  • a pump is usually connected to the supply pipe.
  • the jet pipe and the supply pipe are connected, the jet may be intermittently operated by intermittently operating the pump connected to the supply pipe.
  • Excess electrolyte in the plating tank is discharged to the outside of the plating tank, for example, through a discharge pipe, if necessary.
  • the discharged electrolytic solution may be circulated in the plating tank through the supply pipe. Further, the discharged electrolytic solution may be collected in a reserve tank. The discharged electrolytic solution may be circulated from the reserve tank into the plating tank through the supply pipe. If necessary, the composition of the electrolytic solution may be adjusted before circulating in the plating tank.
  • a filter is placed near the opening leading to the supply pipe of the plating tank, near the boundary between the jet pipe and the supply pipe, or near the boundary between the basket and the jet pipe to prevent the members from entering the supply pipe. May be good.
  • a filter may be provided near the opening to the discharge pipe. However, these positions are merely examples, and the filter may be provided at a necessary position according to the arrangement and structure of the plating tank, the pipe, and the like. The filter only needs to be able to pass the electrolytic solution without passing through the member. As the filter, for example, a net-like filter is used.
  • FIG. 1 is a schematic vertical sectional view for explaining a plating tank used in the manufacturing method of the embodiment of the present disclosure.
  • the plating tank 1 includes a basket 2 and an electric tank 10 for accommodating the electrolytic solution and the basket 2.
  • the basket 2 includes a bottom portion 21 having an inner surface 21a inclined so as to narrow downward.
  • the inner surface 21a has a conical shape in which the diameter decreases downward.
  • At least a part of the inner surface 21a is a feeding surface. This feeding surface functions as a cathode.
  • a tubular anode 30 is arranged so as to surround the basket 2.
  • the basket 2 has a side wall 22 that is continuous with the bottom 21.
  • the side wall 22 extends upward from the bottom 21 side, and an opening is formed at the upper end.
  • a lid 23 is attached to this opening.
  • the side wall 22 and the lid 23 are provided with at least windows 22a and 23a for overflowing the electrolytic solution, respectively.
  • the windows 23a and 22a are equipped with mesh filters F1 and F2, respectively.
  • the filters F1 and F2 suppress the members from being discharged to the outside of the basket 2 while discharging the electrolytic solution from the windows 22a and 23a to the outside of the basket 2.
  • the plating tank 1 includes a jet pipe 3 in the electric tank 10.
  • the jet pipe 3 communicates with the basket 2 and its upper end is connected to the vicinity of the center on the bottom surface of the bottom 21 of the basket 2.
  • One end of the supply pipe 50 is connected to the bottom of the plating tank 1 in a state of being penetrated into the plating tank 1.
  • the lower end of the jet pipe 3 is inserted into one end of the supply pipe 50 and is fixed by a rubber O-ring 40 arranged between the jet pipe 3 and the supply pipe 50.
  • a net-like filter F3 is arranged near the boundary between the jet pipe 3 and the bottom 21 of the basket 2. The filter F3 can hold the member in the basket 2 while ensuring the flow of the electrolytic solution between the jet pipe 3 and the basket 2.
  • the supply pipe 50 is configured so that the jet pipe 3 and the internal space communicate with each other.
  • the electrolytic solution is supplied through the supply pipe 50 so that at least the electrolytic solution vigorously passes through the jet pipe 3, the electrolytic solution and the member can be jetted upward in the basket 2.
  • the supply pipe may be configured so that the electrolytic solution can be supplied into the basket of the plating tank.
  • a supply pipe may be connected to the plating tank so as to supply the electrolytic solution to the bottom of the plating tank. Further, it may be controlled so that at least the electrolytic solution vigorously passes through the jet pipe 3 toward the inside of the basket 2 without coordinating with the supply of the electrolytic solution from the supply pipe 50.
  • a pump or the like can be used to vigorously pass at least the electrolytic solution through the jet pipe 3 or the supply pipe 50.
  • the electrolytic solution and the member can be jetted in the basket 2 by supplying the electrolytic solution from the supply pipe 50 using a pump and vigorously flowing the electrolytic solution into the basket 2 through the jet pipe 3. ..
  • the electrolytic solution in the electric tank 10 may be discharged from the discharge pipe 60A, if necessary.
  • the members are plated while the electrolytic solution and the members are jetted upward from the bottom side in the basket and stirred in the plating tank.
  • the plating process involves intermittent jetting of the electrolyte and the members. By intermittently jetting, variations in the thickness of the plating film can be reduced.
  • Average ratio t j / t i is, for example, 0.55 or less, preferably 0.5 or less.
  • Average ratio t j / t i is preferably for the entire period from the start to the end of the plating range above.
  • the intermittent jet of the electrolytic solution and the members in the basket can be performed by using, for example, ON and OFF of the pump.
  • the pump When the pump is turned on, at least the electrolytic solution flows vigorously in the supply pipe or the jet pipe, and the electrolytic solution and the member can be jetted in the basket.
  • the pump When the pump is turned off, the jet stops.
  • an intermittent jet By repeating ON and OFF of the pump, an intermittent jet can be performed.
  • the pump may control the speed of the electrolyte flowing through the supply pipe or jet pipe.
  • the electromagnetic valve may be turned on and off to perform an intermittent jet flow, or the use of the pump and the use of the solenoid valve may be combined.
  • the flow in the jet pipe may be indirectly controlled by controlling the flow in the supply pipe by using a pump, an electromagnetic valve, or the like. If necessary, the voltage may be applied intermittently between the feeding surface and the anode by turning on and off the power supply connected to the feeding surface as the cathode and the anode.
  • the plating process may include backflowing the electrolyte in the basket downward for at least some time while the jet of the electrolyte and members is stopped. By causing the electrolytic solution to flow backward in this way, the member is likely to be pressed against the feeding surface while the jet flow is stopped. Therefore, in the continuous jet, the growth of the plating film can be promoted even in the area to be plated where the plating film is difficult to grow.
  • the flow rate of the electrolytic solution supplied into the basket is F n (L / min), and in the nth backflow performed after the nth jet, the flow rate of the electrolytic solution flowing back is f.
  • n (L / min) the average value of the ratio of f n to F n (f n / F n ) may be 0.05 or more, or 0.1 or more.
  • the average value of the ratio f n / F n may be 0.25 or less, or 0.2 or less.
  • the flow rate of the electrolytic solution supplied into the basket in the jet flow is, for example, the flow rate of the electrolytic solution flowing through the jet pipe or the supply pipe at the time of jet flow.
  • the flow rate of the electrolytic solution flowing back is, for example, the flow rate of the electrolytic solution flowing in the reverse direction through the jet pipe or the supply pipe.
  • the composition of the electrolytic solution may be determined according to the desired composition of the plating film.
  • a known electrolytic solution for plating used for electrolytic plating can be mentioned.
  • the temperature of the electrolytic solution may be determined according to the composition of the electrolytic solution to be used.
  • the voltage applied between the anode and the cathode may be set according to the desired thickness and composition of the plating film.
  • the plating film is formed by electrolytic plating, a member having conductivity at least in the area to be plated is used as the member to be plated.
  • the member to be plated may have a plurality of areas to be plated having different surface resistivity.
  • a continuous jet is performed, a large amount of electricity flows even within a short time when the member is in contact with the feeding surface in the area to be plated where the surface resistivity is low.
  • the plating film grows predominantly. Due to the dominant growth of the plating film, the member may stick to the feeding surface.
  • the amount of electricity flowing within a short time when the member is in contact with the feeding surface is small, and it is difficult for the plating film to grow. Therefore, the variation in the thickness of the plating film becomes particularly remarkable.
  • the jet flow of the electrolytic solution and the member is intermittently performed, the member is in contact with the feeding surface while the jet flow is stopped. Therefore, a plating film is likely to be formed even in a region having a high surface resistivity. Along with this, excessive growth of the plating film is suppressed in the region where the surface resistivity is low. Therefore, even when a member having a plurality of regions to be plated having different surface resistivity is used, the variation in the thickness of the plating film can be reduced.
  • the ratio R1 / R2 may be 5500 or less, or 1000 or less, from the viewpoint that it is easy to more effectively suppress the sticking of the member to the feeding surface while suppressing the variation in the thickness of the plating film. Good.
  • the surface resistivity ( ⁇ / ⁇ ) of the area to be plated is measured by pressing the four-probe probe of the resistivity meter against a sample having a film formed of the same material as the area to be plated.
  • the sample is obtained by applying a paint containing the same material as the area to be plated onto a glass plate by screen printing and drying.
  • a relatively small size member is suitable as the member because the electrolytic solution and the member are jetted.
  • the maximum length of the member is, for example, 5 mm or less, and may be 3 mm or less. From the viewpoint that the thickness of the plating film can be easily adjusted, the maximum length of the member may be 0.3 mm or more or 0.5 mm or more.
  • the type of member is not particularly limited. Examples of the member include mechanical parts, electronic parts, conductive particles and the like. Chip type parts, resistors, vibrators, contact probes and the like may be used as members. Among them, the chip resistor has a plurality of regions to be plated having different surface resistivity. Therefore, when the chip resistor is plated by a conventional method, the thickness of the plating film varies widely and the product defect rate increases. According to the present disclosure, since the jet flow is intermittently performed, it is possible to reduce the variation in the thickness of the plating film and reduce the product defect rate even when such a chip resistor is plated.
  • FIG. 2 is a schematic vertical cross-sectional view showing an example of a chip resistor suitable for plating by the manufacturing method of the present disclosure.
  • the chip resistor 100 includes a substrate 101, a resistor 102 and an upper surface electrode 103 arranged on the upper surface of the substrate 101, a back surface electrode 104 arranged on the back surface of the substrate 101, and an end face electrode arranged on the end surface of the substrate 101. It is equipped with 105.
  • the chip resistor 100 further includes a protective film 106 formed to cover the resistor 102.
  • the chip resistor 100 includes a plurality of electrodes. The surface resistivity of the electrode portion often differs depending on the purpose of use of the electrode. According to the manufacturing method of the present disclosure, it is possible to suppress variations in the thickness of the plating film even when a member having a plurality of regions having different surface resistivity is used.
  • the thickness of the plating film may be, for example, 0.5 ⁇ m or more and 50 ⁇ m or less, 1 ⁇ m or more and 30 ⁇ m or less, or 2 ⁇ m or more and 20 ⁇ m or less.
  • the present disclosure also includes a plating processing apparatus.
  • the plating processing apparatus of the present disclosure includes a plating tank, a supply pipe for supplying an electrolytic solution to the bottom of the plating tank, a discharge pipe for discharging the electrolytic solution from the plating tank, and a control unit.
  • the control unit jets the member to be plated together with the electrolytic solution from the bottom side of the basket upward and stirs the member in the basket of the plating tank. Includes a control unit that controls the jet flow intermittently.
  • the description of the manufacturing method can be referred to.
  • the plating processing apparatus may further include a pump connected to a supply pipe.
  • the control unit may be a control unit (hereinafter, referred to as a first control unit) that controls the jet flow of the electrolytic solution and the member intermittently by operating the pump intermittently.
  • the first control unit may be a unit that controls ON and OFF of the pump.
  • the first control unit may be a unit that controls the direction of the flow of the electrolytic solution flowing in the supply pipe or the jet pipe by a pump.
  • the first control unit can control the pump to cause the electrolytic solution in the supply pipe or the jet pipe to flow back.
  • the electrolytic solution in the basket can be backflowed downward for at least a part of the time while the jet of the electrolytic solution and the member is stopped.
  • the control unit is not limited to the first control unit that controls the operation of the pump as described above.
  • the plating apparatus may include solenoid valves located on at least one of a supply pipe and a jet pipe.
  • a second control unit that controls ON and OFF of the solenoid valve may be used. By controlling the solenoid valve, the flow of the electrolytic solution in the jet pipe or the supply pipe is controlled.
  • the control unit may include one of the first control unit and the second control unit, or may include both.
  • the control unit may further include a third control unit that controls the application of a voltage between the anode and the feeding surface which is the cathode.
  • the third control unit may be a unit that controls ON and OFF of the power supply connected to the anode and the feeding surface.
  • the pump may be a circulation pump connected to both the discharge pipe and the supply pipe.
  • the electrolytic solution discharged from the plating tank is supplied to the supply pipe by the circulation pump and circulated in the plating tank.
  • a part of the discharged electrolytic solution may be collected in a tank or the like without being circulated in the plating tank.
  • the plating processing apparatus may include a reserve tank for collecting the discharged electrolytic solution. If necessary, the electrolytic solution may be circulated from the reserve tank through the supply pipe into the plating tank by a pump.
  • the plating processing apparatus may include two or more pumps, if necessary.
  • the plating processing apparatus may include a first discharge pipe for circulating in the circulation pump and a second discharge pipe for recovering the electrolytic solution in the reserve tank. Not limited to this case, the plating processing apparatus may include two or more discharge pipes.
  • the plating processing apparatus may include a supply tank for supplying a fresh electrolytic solution to the plating tank.
  • the plating processing apparatus may include two or more supply pipes, if necessary.
  • a basket as taught in Patent Document 1 may be used as the basket.
  • a draft pipe arranged in a basket has a function of jetting an electrolytic solution and a member.
  • the plating processing can be efficiently performed without providing the draft pipe in the basket as in Patent Document 1, and the variation in the thickness of the plating film can be suppressed.
  • the capacity of the basket can be selected from the above range.
  • the plating processing apparatus is particularly suitable when using a basket having a capacity of 1.5 L or less or 1 L or less.
  • the lower limit of the basket capacity can be selected from the above range.
  • the basket may be in a state in which the entire side wall window is immersed in the electrolytic solution of the plating tank, or the entire basket is in a state of being immersed in the electrolytic solution of the plating tank. It may be in a state where the upper part of the lid is immersed in the electrolytic solution of the plating tank.
  • FIG. 3 is a block diagram schematically showing a plating processing apparatus according to an embodiment of the present disclosure.
  • the plating processing apparatus includes a plating tank 1, a first discharge pipe 60A for discharging the electrolytic solution from the plating tank 1, a supply pipe 50 for supplying the discharged electrolytic solution to the plating tank 1, and a first.
  • a pump P connected to the discharge pipe 60A and the supply pipe 50, and a control unit 70 for controlling ON / OFF of the pump P are provided.
  • the plating processing apparatus further includes a second discharge pipe 60B for recovering the excess electrolytic solution from the plating tank 1, and a reserve tank 80 for accommodating the recovered electrolytic solution.
  • the plating tank 1 can have, for example, the configuration shown in FIG.
  • the pump P has a role of a circulation pump that circulates the electrolytic solution discharged from the discharge pipe 60A into the plating tank 1 via the supply pipe 50.
  • the electrolytic solution contained in the reserve tank 80 can be supplied into the plating tank 1 through the supply pipe 50 by the pump P, if necessary.
  • the control unit 70 includes a first control unit that controls the pump P to be repeatedly turned on and off.
  • the first control unit controls the flow of the electrolytic solution flowing through the supply pipe 50 and the jet pipe 3 of the plating tank 1. As a result, the electrolytic solution and the members in the basket 2 can be jetted intermittently.
  • Example 1 (1) Plating Treatment Using the plating tank 1 shown in FIG. 1, the chip resistor 100 shown in FIG. 2 was plated as a member. The capacity of the basket of the plating tank 1 was 0.9 L. The maximum length of each chip resistor 100 was 1 mm, and the total volume was 24 mL. In the chip resistor 100 used, the surface resistivity of the upper surface electrode 103 and the back surface electrode 104 are substantially the same. The ratio R1 / R2 of the surface resistivity R1 of the upper surface electrode 103 and the back surface electrode 104 to the surface resistivity R2 of the end surface electrode 105 was 600.
  • the electrolytic solution a plating solution for a nickel sulfamate bath was used.
  • the concentration of nickel sulfamate in the plating solution was 600 g / L.
  • the plating treatment was performed by continuously applying a predetermined voltage between the inner surface 21a as the cathode and the anode 30. Meanwhile, as the average value of the ratio t j / t i is 0.08-0.5, while repeating ON and OFF of the pump, by intermittently supplying the electrolytic solution from the supply pipe 50, the jet pipe The flow of the electrolytic solution in 3 was controlled.
  • the flow rate F n of the electrolytic solution from the jet pipe 3 into the basket 2 during the jet flow was set to 10 L / min.
  • the electrolytic solution and the chip resistor 100 were jetted intermittently in the basket 2.
  • the average value of the ratio t j / t i is controlled to a plurality of values between 0.08 and 0.5 for the case of each value, plating treatment was carried out.
  • the thickness of the plating film formed on the surface of the end face electrode 105 is the thickness of the plating film formed on the upper surface electrode 103 and the back surface electrode 104 of T2.
  • the number ratio (%) of the chip resistors 100 having a ratio T2 / T1 of less than 0.8 in all the chip resistors 100 was determined.
  • the ratio T2 / T1 is 0.8 or more and 1 or less, the variation in the thickness of the plating film is small, and when it is less than 0.8, the variation in the thickness is large.
  • Comparative Example 1 The electrolytic solution and the chip resistor 100 were continuously jetted in the basket 2. More specifically, with the pump continuously turned on, the electrolytic solution was continuously supplied into the basket 2 without changing the flow rates of the electrolytic solution in the supply pipe 50 and the jet pipe 3. Other than this, the plating treatment was performed in the same manner as in the case of Example 1. Average ratio t j / t i is 1. The same evaluation as in Example 1 was performed using the plated chip resistor 100.
  • average value of the ratio t j / t i is 0.08, fixed rate is a value greater than 10%. If the average value of the ratio t j / t i is at least 0.1, fixation is 0.01% or less. Therefore, from the viewpoint of suppressing sticking, average value of the ratio t j / t i is greater than 0.08, for example, preferably set to 0.09 or more or 0.1 or more.
  • Examples 2 and 3 Using a pump, supplying the electrolytic solution into the supply pipe 50 and the jet pipe 3 and regurgitating the inside of the supply pipe 50 and the jet pipe 3 were alternately repeated. In this way, the jet of the electrolytic solution and the chip resistor 100 and the downward backflow to the electrolytic solution were alternately repeated in the basket 2.
  • Average ratio t j / t i is controlled to multiple values in the range of 0.1-0.5, for the case of each value, plating treatment was carried out.
  • the flow rate f n (L / min) of the electrolytic solution flowing back from the jet pipe 3 was 1 L / m for Example 2 and 2 L / m for Example 3. Other than this, the plating treatment was performed in the same manner as in Example 1. Then, the time required for the plating process was measured. The time required for the plating treatment was set to the time until the thickness of the plating film formed on the surface of the top electrode 103 became 6 ⁇ m on average.
  • Example 1 For the case of the range the average value of 0.1 to 0.5 of the ratio t j / t i of Example 1, as in the case of Examples 2 and 3 were measured the time required for plating process. Table 1 shows the time required for the plating process for each example. In Table 1, Examples 1 to 3 are E1 to E3, respectively. Also shows the average value of the ratio t j / t i at t av.
  • the manufacturing method and plating processing apparatus of the present disclosure are suitable for plating various members having a conductive area to be plated.
  • Plating tank 1: Plating tank, 2: Basket, 3: Pump pipe, 10: Electric tank, 21: Bottom, 21a: Inner surface, 22: Side wall, 22a: Window, 23: Lid, 23a: Window, 30: Anode, 40: O -Ring, 50: Supply pipe, 60A, 60B: Discharge pipe, F1, F2, F3: Filter, 70: Control unit, 80: Reserve tank, P: Pump, 100: Chip resistor, 101: Substrate, 102: Resistance Body, 103: top electrode, 104: back electrode, 105: end face electrode, 106: protective film

Abstract

This method of manufacturing a plated member comprises a plating step for plating a member to be plated while jetting and stirring the member together with an electrolytic solution from a bottom part to the upper side, inside a basket of a plating tank including: the basket including the bottom part having an inner surface that is inclined to be contracted downward and functions as a feeding surface; and an electric tank that accommodates the electrolytic solution and the basket immersed in the electrolytic solution. The plating step includes intermittently jetting the electrolytic solution and the member.

Description

めっき処理された部材の製造方法およびめっき処理装置Manufacturing method of plated parts and plating processing equipment
　本開示は、めっき処理された部材の製造方法およびめっき処理装置に関する。 The present disclosure relates to a method for manufacturing a plated member and a plating processing apparatus.
　比較的小さな部品を電解めっきする場合、一般に、バレルめっきが採用されている。また、電解液とともに部品を噴流させながら電解めっきを行う噴流式のめっき装置も知られている（特許文献１）。 When electroplating relatively small parts, barrel plating is generally used. Further, a jet-type plating apparatus that performs electrolytic plating while jetting parts together with an electrolytic solution is also known (Patent Document 1).
　特許文献１では、金属イオンを含む電解液が液体噴流層内で循環する間に導電性部品が電気めっきされる。より具体的には、特許文献１の装置では、部品が給電面と接触状態になり、電流が部品中を通ることによって、部品が装置内で循環する間に金属が電解液から部品上に付着することで、めっき処理された部品が得られる。 In Patent Document 1, the conductive component is electroplated while the electrolytic solution containing metal ions circulates in the liquid jet layer. More specifically, in the device of Patent Document 1, the component comes into contact with the feeding surface, and the electric current passes through the component, so that metal adheres to the component from the electrolytic solution while the component circulates in the device. By doing so, a plated part can be obtained.
特表２００４－５２７６５２号公報Japanese Patent Publication No. 2004-527652
　特許文献１のような噴流式のめっき方法では、電解液およびめっき処理される部品の噴流が連続的に行われる。しかし、連続的に噴流が行われると、めっき被膜が十分に成長しない場合がある。 In the jet-type plating method as in Patent Document 1, the jet of the electrolytic solution and the parts to be plated is continuously performed. However, if the jet is continuously jetted, the plating film may not grow sufficiently.
　本開示の一側面は、下方に向かって窄まるように傾斜し、かつ給電面として機能する内面を有する底部を備えるバスケットと、電解液および前記電解液に浸漬された前記バスケットを収容する電槽と、を備えるめっき槽の前記バスケット内において、めっき処理される部材を、前記電解液とともに前記底部側から上方に向かって噴流させて撹拌しながら、前記部材をめっきするめっき処理工程を含み、
　前記めっき処理工程は、前記電解液および前記部材の噴流を間欠的に行うことを含む、めっき処理された部材の製造方法に関する。 One aspect of the present disclosure is a basket having a bottom having an inner surface that is inclined downward and functions as a feeding surface, and an electric tank that houses the electrolytic solution and the basket immersed in the electrolytic solution. In the basket of the plating tank provided with the above, the member to be plated is jetted upward from the bottom side together with the electrolytic solution and stirred, and the member is plated.
The plating treatment step relates to a method for manufacturing a plated member, which comprises intermittently jetting the electrolytic solution and the member.
　本開示の他の側面は、下方に向かって窄まるように傾斜し、かつ給電面として機能する内面を有する底部を備えるバスケットと、電解液および前記電解液に浸漬された前記バスケットを収容する電槽と、を備えるめっき槽と、
　前記電解液を前記バスケットの底部に供給する供給パイプと、
　前記めっき槽から前記電解液を排出する排出パイプと、
　制御部と、を備え、
　前記制御部は、前記バスケット内において、めっき処理される部材を、前記電解液とともに前記底部側から上方に向かって噴流させて撹拌しながら、前記部材をめっきするめっき処理において、前記電解液および前記部材の噴流を間欠的に行うよう制御する制御ユニットを含む、めっき処理装置に関する。 Other aspects of the disclosure include a basket with a bottom that is tilted downward and has an inner surface that acts as a feeding surface, and an electric solution that houses the electrolyte and the basket immersed in the electrolyte. A plating tank equipped with a tank,
A supply pipe that supplies the electrolytic solution to the bottom of the basket,
A discharge pipe for discharging the electrolytic solution from the plating tank,
With a control unit
In the plating process of plating the member, the control unit jets the member to be plated together with the electrolytic solution upward from the bottom side and stirs the member in the basket, and the electrolytic solution and the said. The present invention relates to a plating processing apparatus including a control unit that controls the jet flow of members intermittently.
　噴流式のめっき方法で部材をめっき処理する場合に、めっき被膜の厚みのばらつきを低減できる。 When the member is plated by the jet type plating method, the variation in the thickness of the plating film can be reduced.
本開示の一実施形態に係るめっき処理された部材の製造方法に利用されるめっき槽を説明するための概略縦断面図である。It is a schematic vertical sectional view for demonstrating the plating tank used in the manufacturing method of the plated member which concerns on one Embodiment of this disclosure. めっき処理される部材としてのチップ抵抗器の概略縦断面図である。It is a schematic vertical sectional view of a chip resistor as a member to be plated. 本開示の一実施形態に係るめっき処理装置のブロック図である。It is a block diagram of the plating processing apparatus which concerns on one Embodiment of this disclosure.
　本発明の新規な特徴を添付の請求の範囲に記述するが、本発明は、構成および内容の両方に関し、本発明の他の目的および特徴と併せ、図面を照合した以下の詳細な説明によりさらによく理解されるであろう。 Although the novel features of the present invention are described in the appended claims, the present invention is further described in the following detailed description with reference to the drawings, in combination with other objects and features of the present invention, both in terms of structure and content. It will be well understood.
［めっき処理された部材の製造方法］
　本開示のめっき処理された部材の製造方法は、下方に向かって窄まるように傾斜し、かつ給電面として機能する内面を有する底部を備えるバスケットと、電解液および前記電解液に浸漬された前記バスケットを収容する電槽と、を備えるめっき槽の前記バスケット内において、めっき処理される部材を、前記電解液とともに前記底部側から上方に向かって噴流させて撹拌しながら、前記部材をめっきするめっき処理工程を含む。めっき処理工程は、電解液および部材の噴流を間欠的に行うことを含む。 [Manufacturing method of plated parts]
The method for producing a plated member of the present disclosure is a basket having a bottom having an inner surface that is inclined downward and functions as a feeding surface, and the electrolytic solution and the said one immersed in the electrolytic solution. In the basket of the plating tank including the electric tank for accommodating the basket, the member to be plated is jetted upward from the bottom side together with the electrolytic solution and stirred while plating the member. Includes processing steps. The plating process involves intermittent jetting of the electrolyte and the members.
　上記のようなめっき槽を用いて噴流式でめっき処理を行う場合に、従来のように電解液および部材を連続的に噴流させると、めっき被膜の厚みにばらつきが生じる場合がある。噴流式のめっき処理では、給電面に部材が接触している間にめっき被膜が成長する。連続的な噴流では、部材が給電面に接触する時間が短くなり、部材においてめっき被膜が成長し難い箇所が生じる。これにより、めっき被膜の厚みにばらつきが生じると考えられる。 When jetting is performed using the plating tank as described above, if the electrolytic solution and the members are continuously jetted as in the conventional case, the thickness of the plating film may vary. In the jet-type plating process, the plating film grows while the member is in contact with the feeding surface. In a continuous jet, the time for the member to come into contact with the feeding surface is shortened, and there are places in the member where the plating film is difficult to grow. As a result, it is considered that the thickness of the plating film varies.
　それに対し、本開示では、上記のように、めっき処理工程が、電解液および部材の噴流を間欠的に行うことを含む。電解液および部材の噴流を間欠的に行うことで、噴流が停止されている間に部材がバスケットの給電面に比較的長い時間接触した状態となる。そのため、連続的に噴流を行う場合に比べて、噴流と噴流の停止とが繰り返される間に、部材の被めっき領域全体においてめっき被膜が成長し易くなる。これにより、めっき被膜の厚みのばらつきが低減される。 On the other hand, in the present disclosure, as described above, the plating treatment step includes intermittently jetting the electrolytic solution and the member. By intermittently jetting the electrolytic solution and the member, the member is in contact with the feeding surface of the basket for a relatively long time while the jet is stopped. Therefore, as compared with the case where the jet flow is continuously performed, the plating film is likely to grow in the entire area to be plated of the member while the jet flow and the stop of the jet flow are repeated. This reduces variations in the thickness of the plating film.
　以下に、本開示のめっき処理された部材の製造方法について、適宜図面を参照しながら、より具体的に説明する。 Hereinafter, the method for manufacturing the plated member of the present disclosure will be described more specifically with reference to the drawings as appropriate.
（めっき処理工程）
　めっき処理は、特定のめっき槽において、電解液およびめっき処理される部材を噴流させて撹拌しながら行われる。 (Plating process)
The plating treatment is performed in a specific plating tank while jetting and stirring the electrolytic solution and the member to be plated.
　（めっき槽）
　めっき槽は、給電面として機能する内面を有する底部を備えるバスケットと、電解液および電解液に浸漬されたバスケットを収容する電槽と、を備える。めっき槽のバスケット内において、部材は、電解液とともに底部側から上方に向かって噴流され、撹拌される。バスケットでは、給電面である底部の内面は、下方に向かって窄まるように傾斜している。電解液とともにバスケット内を上方まで噴射された部材は、沈降して給電面に着地し、傾斜した給電面に沿って底部側に移動し、再度上方に噴流される。バスケット内では、このような電解液および部材の流れが繰り返されることで、電解液および部材が撹拌される。カソードとして機能する給電面と、バスケットの外側に配置されたアノードとの間で通電させると、部材が給電面に接触している間、部材の被めっき領域に電流が流れる。これにより、電解液中の金属イオンが被めっき領域表面に析出して、めっき被膜が形成される。底部の内面は、少なくとも一部が給電面として機能していればよい。 (Plating tank)
The plating tank includes a basket having a bottom having an inner surface that functions as a feeding surface, and an electric tank that houses the electrolytic solution and the basket immersed in the electrolytic solution. In the basket of the plating tank, the members are jetted upward from the bottom side together with the electrolytic solution and stirred. In the basket, the inner surface of the bottom, which is the feeding surface, is inclined so as to narrow downward. The member injected upward in the basket together with the electrolytic solution settles and lands on the feeding surface, moves to the bottom side along the inclined feeding surface, and is jetted upward again. By repeating such a flow of the electrolytic solution and the member in the basket, the electrolytic solution and the member are agitated. When an electric current is applied between the feeding surface that functions as a cathode and the anode arranged outside the basket, a current flows through the area to be plated of the member while the member is in contact with the feeding surface. As a result, metal ions in the electrolytic solution are deposited on the surface of the area to be plated to form a plating film. At least a part of the inner surface of the bottom may function as a feeding surface.
　バスケットは、少なくとも電解液がバスケットからめっき槽に排出されるように構成されている。例えば、バスケットの底部から少なくとも電解液が排出されてもよく、バスケットの上部から、少なくとも電解液がオーバーフローされてもよい。これにより、電解液および部材を噴流させても、バスケット内において電解液等をスムーズにフローさせることができる。バスケットから電解液を排出する場合、電解液とともに部材が排出されてもよい。めっき被膜を効率よく形成する観点からは、部材をバスケット内に残した状態で電解液がバスケットから排出されるように、バスケットを構成することが好ましい。 The basket is configured so that at least the electrolytic solution is discharged from the basket to the plating tank. For example, at least the electrolyte may be drained from the bottom of the basket, or at least the electrolyte may overflow from the top of the basket. As a result, even if the electrolytic solution and the member are jetted, the electrolytic solution and the like can flow smoothly in the basket. When the electrolytic solution is discharged from the basket, the member may be discharged together with the electrolytic solution. From the viewpoint of efficiently forming the plating film, it is preferable to configure the basket so that the electrolytic solution is discharged from the basket with the members left in the basket.
　バスケットの底部側または上部には、電解液などをオーバーフローさせるための窓が形成されていてもよい。電解液をオーバーフローしながらも部材がバスケット内に残るように、バスケットに形成された窓にはフィルターが装着されていてもよい。フィルターは、部材を通過させず、電解液を通過させることができればよい。フィルターとしては、例えば、網状のフィルターが用いられる。 A window for overflowing the electrolytic solution or the like may be formed on the bottom side or the top of the basket. A filter may be attached to the window formed in the basket so that the member remains in the basket while overflowing the electrolytic solution. The filter only needs to be able to pass the electrolytic solution without passing through the member. As the filter, for example, a net-like filter is used.
　バスケットは、通常、底部と連続し、かつ上方に延びる側壁と、側壁の上端に形成された開口とを備えている。上部側の開口には、蓋が装着されていてもよい。上述の窓は、例えば、側壁および蓋の少なくとも一方に形成されている。バスケットの底部から上方に向かって噴流された電解液および部材のうち、少なくとも電解液は、側壁および蓋の少なくとも一方の窓から、めっき槽内でかつバスケットの外側の部分に排出される。バスケットの外側に排出された電解液および部材のうち少なくとも電解液は、必要に応じて、バスケット内に再度供給してもよい。このように、少なくとも電解液は、バスケット内を含めてめっき槽内で循環されてもよい。 The basket usually has a side wall that is continuous with the bottom and extends upward, and an opening formed at the top of the side wall. A lid may be attached to the opening on the upper side. The windows described above are formed, for example, on at least one of a side wall and a lid. Of the electrolytic solution and members jetted upward from the bottom of the basket, at least the electrolytic solution is discharged from at least one window of the side wall and the lid into the plating tank and to the outer part of the basket. Of the electrolytic solution and the members discharged to the outside of the basket, at least the electrolytic solution may be resupplied into the basket, if necessary. As described above, at least the electrolytic solution may be circulated in the plating tank including the inside of the basket.
　バスケットの容量は、例えば、１０Ｌ以下であり、４Ｌ以下であってもよい。間欠噴流を利用して効率よくめっき処理を行う観点からは、バスケットの容量は、１．５Ｌ以下が好ましく、１Ｌ以下としてもよい。バスケットの容量は、０．１Ｌ以上、０．２Ｌ以上、または０．５Ｌ以上であってもよい。 The capacity of the basket is, for example, 10 L or less, and may be 4 L or less. From the viewpoint of efficiently performing the plating process by utilizing the intermittent jet, the capacity of the basket is preferably 1.5 L or less, and may be 1 L or less. The capacity of the basket may be 0.1 L or more, 0.2 L or more, or 0.5 L or more.
　なお、本明細書中、バスケットの容量は、底部の内面の最下端と開口との間において、バスケットの内壁で囲まれる空間の容積を言う。バスケットに窓が形成されている場合、バスケットの容量は、窓の部分に隣接するバスケットの内壁と凹凸がないように内壁が形成されていると仮定して求める。 In the present specification, the capacity of the basket refers to the volume of the space surrounded by the inner wall of the basket between the lowermost end of the inner surface of the bottom and the opening. When a window is formed in the basket, the capacity of the basket is calculated on the assumption that the inner wall is formed so as not to be uneven with the inner wall of the basket adjacent to the window portion.
　電槽には、バスケットに加え、電解液が収容されている。バスケットは、少なくとも底部側がめっき槽の電解液に浸漬された状態であればよい。バスケット内に電解液の液面が形成されると、液面で空気を巻き込み易くなるため、気泡が発生して部材に付着し易くなる。部材に空気が付着すると、部材がバスケット底部に沈降し難くなる。そのため、バスケット内において部材を効率よく循環させる観点からは、側壁に形成された窓全体がめっき槽の電解液に浸漬された状態であることが好ましい。同様の観点から、バスケット全体がめっき槽の電解液に浸漬された状態であることがより好ましく、蓋の上部までめっき槽の電解液に浸漬された状態であることがさらに好ましい。 In addition to the basket, the electrolytic solution is stored in the battery case. The basket may be in a state where at least the bottom side is immersed in the electrolytic solution of the plating tank. When the liquid level of the electrolytic solution is formed in the basket, air is easily entrained at the liquid level, so that bubbles are easily generated and adhered to the member. When air adheres to the member, the member is less likely to settle on the bottom of the basket. Therefore, from the viewpoint of efficiently circulating the members in the basket, it is preferable that the entire window formed on the side wall is immersed in the electrolytic solution of the plating tank. From the same viewpoint, it is more preferable that the entire basket is immersed in the electrolytic solution of the plating tank, and it is further preferable that the entire basket is immersed in the electrolytic solution of the plating tank up to the upper part of the lid.
　めっき槽は、電槽内に、バスケット内において電解液およびめっき処理される部材を上方に噴流させる噴流パイプを備えていてもよい。噴流パイプは、電解液および部材がバスケット内を底部側から上方に向かって噴流するように構成されていればよい。例えば、噴流パイプの上端をバスケットの底部に連結し、少なくとも電解液を、噴流パイプ内を勢いよく通過させることによりバスケット内に噴流させてもよい。噴流パイプは、バスケットと一体化していてもよい。また、特許文献１のように、バスケットの底部に連結されたパイプ（特許文献１の入口パイプ）と、バスケット内に配置されたパイプ（特許文献１のドラフトパイプ）とを利用して電解液および部材がバスケット内を噴流するように構成してもよい。この場合、入口パイプとドラフトパイプとが噴流パイプに相当する。めっき槽内の底部側において、噴流パイプには、開口部が形成されていてもよい。バスケットから排出された電解液および部材のうち、少なくとも電解液は、この開口部を通じて噴流パイプ内に供給され、バスケット内に再度供給されてもよい。しかし、バスケット内で効率よくめっき被膜を形成する観点からは、部材をバスケットから排出させずにバスケット内で循環させるようにバスケットを構成することが好ましい。 The plating tank may be provided with a jet pipe in which the electrolytic solution and the member to be plated are jetted upward in the basket. The jet pipe may be configured such that the electrolytic solution and the member are jetted in the basket from the bottom side upward. For example, the upper end of the jet pipe may be connected to the bottom of the basket, and at least the electrolytic solution may be vigorously passed through the jet pipe to be jetted into the basket. The jet pipe may be integrated with the basket. Further, as in Patent Document 1, an electrolytic solution and an electrolytic solution and a pipe using a pipe connected to the bottom of the basket (inlet pipe of Patent Document 1) and a pipe arranged in the basket (draft pipe of Patent Document 1) are used. The member may be configured to flow through the basket. In this case, the inlet pipe and the draft pipe correspond to the jet pipe. An opening may be formed in the jet pipe on the bottom side in the plating tank. Of the electrolytic solution and members discharged from the basket, at least the electrolytic solution may be supplied into the jet pipe through this opening and may be supplied again into the basket. However, from the viewpoint of efficiently forming the plating film in the basket, it is preferable to configure the basket so that the members are circulated in the basket without being discharged from the basket.
　めっき槽には、電解液をバスケットの底部に供給する供給パイプが接続されていてもよい。めっき処理工程は、供給パイプから電解液を供給しながら行ってもよい。電解液がバスケット内に供給されることで、めっき処理の速度を高めることができる。この場合にも、めっき処理工程では、バスケットの上部から少なくとも電解液がオーバーフローされる。これにより、電解液をバスケット内に行き渡らせることができ、めっき処理を効率よく行うことができる。供給パイプからの電解液の供給は連続的に行ってもよく、間欠的に行ってもよい。 The plating tank may be connected to a supply pipe that supplies the electrolytic solution to the bottom of the basket. The plating treatment step may be performed while supplying the electrolytic solution from the supply pipe. By supplying the electrolytic solution into the basket, the speed of the plating process can be increased. In this case as well, at least the electrolytic solution overflows from the upper part of the basket in the plating process. As a result, the electrolytic solution can be distributed in the basket, and the plating process can be efficiently performed. The electrolytic solution may be supplied continuously or intermittently from the supply pipe.
　噴流パイプは、ポンプと接続されていてもよい。ポンプを間欠的に作動させることで、噴流を間欠的に行ってもよい。この場合、供給パイプからの電解液の供給は連続的に行ってもよく、間欠的に行ってもよい。供給パイプには、通常、ポンプが接続されている。噴流パイプと供給パイプとが連結している場合、供給パイプに接続されたポンプを間欠的に作動させることで、噴流を間欠的に行ってもよい。 The jet pipe may be connected to the pump. The jet may be intermittently operated by operating the pump intermittently. In this case, the electrolytic solution may be continuously supplied from the supply pipe or may be intermittently supplied. A pump is usually connected to the supply pipe. When the jet pipe and the supply pipe are connected, the jet may be intermittently operated by intermittently operating the pump connected to the supply pipe.
　めっき槽内の過剰な電解液は、必要に応じて、例えば、排出パイプなどを通じて、めっき槽外に排出される。排出された電解液は、供給パイプを通じてめっき槽内に循環させてもよい。また、排出された電解液は、リザーブタンクに回収してもよい。排出された電解液は、リザーブタンクから供給パイプを通じてめっき槽内に循環してもよい。めっき槽内に循環させる前に、必要に応じて、電解液の組成を調節してもよい。 Excess electrolyte in the plating tank is discharged to the outside of the plating tank, for example, through a discharge pipe, if necessary. The discharged electrolytic solution may be circulated in the plating tank through the supply pipe. Further, the discharged electrolytic solution may be collected in a reserve tank. The discharged electrolytic solution may be circulated from the reserve tank into the plating tank through the supply pipe. If necessary, the composition of the electrolytic solution may be adjusted before circulating in the plating tank.
　めっき槽の供給パイプに通じる開口部付近、噴流パイプと供給パイプとの境界付近またはバスケットと噴流パイプとの境界付近には、部材の供給パイプへの侵入を防止するためのフィルターが配置されていてもよい。必要に応じて、排出パイプへの開口部付近にフィルターを設けてもよい。ただし、これらの位置は単なる例示であり、フィルターは、めっき槽およびパイプなどの配置および構造に合わせて必要な位置に設ければよい。フィルターは、部材を通過させず、電解液を通過させることができればよい。フィルターとしては、例えば、網状のフィルターが用いられる。 A filter is placed near the opening leading to the supply pipe of the plating tank, near the boundary between the jet pipe and the supply pipe, or near the boundary between the basket and the jet pipe to prevent the members from entering the supply pipe. May be good. If necessary, a filter may be provided near the opening to the discharge pipe. However, these positions are merely examples, and the filter may be provided at a necessary position according to the arrangement and structure of the plating tank, the pipe, and the like. The filter only needs to be able to pass the electrolytic solution without passing through the member. As the filter, for example, a net-like filter is used.
　図１は、本開示の一実施形態の製造方法に利用されるめっき槽を説明するための概略縦断面図である。図１では、めっき槽１は、バスケット２と、電解液およびバスケット２を収容する電槽１０とを備えている。バスケット２は、下方に向かって窄まるように傾斜した内面２１ａを備える底部２１を備えている。図示例では、内面２１ａは、円錐状に下方に向かって径が小さくなる形状となっている。内面２１ａの少なくとも一部は、給電面である。この給電面はカソードとして機能する。電槽１０内には、バスケット２の周囲を取り囲むように、筒状のアノード３０が配置されている。 FIG. 1 is a schematic vertical sectional view for explaining a plating tank used in the manufacturing method of the embodiment of the present disclosure. In FIG. 1, the plating tank 1 includes a basket 2 and an electric tank 10 for accommodating the electrolytic solution and the basket 2. The basket 2 includes a bottom portion 21 having an inner surface 21a inclined so as to narrow downward. In the illustrated example, the inner surface 21a has a conical shape in which the diameter decreases downward. At least a part of the inner surface 21a is a feeding surface. This feeding surface functions as a cathode. In the battery case 10, a tubular anode 30 is arranged so as to surround the basket 2.
　バスケット２は、底部２１と連続する側壁２２を備えている。側壁２２は、底部２１側から上方に向かって延びており、上端には開口が形成されている。そして、この開口には、蓋２３が装着されている。側壁２２および蓋２３には、それぞれ、少なくとも電解液をオーバーフローさせる窓２２ａ，２３ａが設けられている。窓２３ａおよび２２ａには、それぞれ、網状のフィルターＦ１およびＦ２が装着されている。フィルターＦ１およびＦ２は、電解液を窓２２ａ，２３ａからバスケット２外に排出しながら、部材がバスケット２外に排出されることを抑制している。 The basket 2 has a side wall 22 that is continuous with the bottom 21. The side wall 22 extends upward from the bottom 21 side, and an opening is formed at the upper end. A lid 23 is attached to this opening. The side wall 22 and the lid 23 are provided with at least windows 22a and 23a for overflowing the electrolytic solution, respectively. The windows 23a and 22a are equipped with mesh filters F1 and F2, respectively. The filters F1 and F2 suppress the members from being discharged to the outside of the basket 2 while discharging the electrolytic solution from the windows 22a and 23a to the outside of the basket 2.
　図１の例では、めっき槽１は、電槽１０内に噴流パイプ３を備えている。噴流パイプ３は、バスケット２と連通した状態で、上端部がバスケット２の底部２１の底面における中央付近に連結されている。めっき槽１の底部には、供給パイプ５０の一端部がめっき槽１内に侵入した状態で連結されている。噴流パイプ３の下端部は、供給パイプ５０の一端部に挿入され、噴流パイプ３と供給パイプ５０との間に配置されたゴム製のＯ－リング４０により固定されている。噴流パイプ３とバスケット２の底部２１との境界付近には、網状のフィルターＦ３が配置されている。フィルターＦ３により、噴流パイプ３とバスケット２との間の電解液の流通を確保しながら、部材をバスケット２内に保持することができる。 In the example of FIG. 1, the plating tank 1 includes a jet pipe 3 in the electric tank 10. The jet pipe 3 communicates with the basket 2 and its upper end is connected to the vicinity of the center on the bottom surface of the bottom 21 of the basket 2. One end of the supply pipe 50 is connected to the bottom of the plating tank 1 in a state of being penetrated into the plating tank 1. The lower end of the jet pipe 3 is inserted into one end of the supply pipe 50 and is fixed by a rubber O-ring 40 arranged between the jet pipe 3 and the supply pipe 50. A net-like filter F3 is arranged near the boundary between the jet pipe 3 and the bottom 21 of the basket 2. The filter F3 can hold the member in the basket 2 while ensuring the flow of the electrolytic solution between the jet pipe 3 and the basket 2.
　図１の例では、供給パイプ５０は、噴流パイプ３と内部の空間が連通するように構成されている。噴流パイプ３内を少なくとも電解液が勢いよく通過するように、供給パイプ５０を通じて電解液を供給すると、バスケット２内において電解液および部材を上方に噴流させることができる。しかし、このような場合に限らず、供給パイプは、電解液をめっき槽のバスケット内に供給できるように構成されていればよい。電解液をめっき槽の底部に供給するように供給パイプがめっき槽に接続されていてもよい。また、供給パイプ５０からの電解液の供給と連携させずに、噴流パイプ３内を少なくとも電解液が勢いよくバスケット２内に向かって通過するように制御してもよい。噴流パイプ３または供給パイプ５０内を少なくとも電解液を勢いよく通過させるには、ポンプなどを利用できる。例えば、ポンプを利用して供給パイプ５０から電解液を供給し、噴流パイプ３を通じて、電解液をバスケット２内に勢いよく流入させることで、バスケット２内において電解液と部材を噴流させることができる。電槽１０内の電解液は、必要に応じて、排出パイプ６０Ａから排出してもよい。 In the example of FIG. 1, the supply pipe 50 is configured so that the jet pipe 3 and the internal space communicate with each other. When the electrolytic solution is supplied through the supply pipe 50 so that at least the electrolytic solution vigorously passes through the jet pipe 3, the electrolytic solution and the member can be jetted upward in the basket 2. However, not limited to such a case, the supply pipe may be configured so that the electrolytic solution can be supplied into the basket of the plating tank. A supply pipe may be connected to the plating tank so as to supply the electrolytic solution to the bottom of the plating tank. Further, it may be controlled so that at least the electrolytic solution vigorously passes through the jet pipe 3 toward the inside of the basket 2 without coordinating with the supply of the electrolytic solution from the supply pipe 50. A pump or the like can be used to vigorously pass at least the electrolytic solution through the jet pipe 3 or the supply pipe 50. For example, the electrolytic solution and the member can be jetted in the basket 2 by supplying the electrolytic solution from the supply pipe 50 using a pump and vigorously flowing the electrolytic solution into the basket 2 through the jet pipe 3. .. The electrolytic solution in the electric tank 10 may be discharged from the discharge pipe 60A, if necessary.
　（めっき処理条件）
　めっき処理工程では、めっき槽内において、電解液および部材を、バスケット内を底部側から上方に向かって噴流させて撹拌しながら、部材をめっきする。めっき処理工程は、電解液および部材の噴流を間欠的に行うことを含む。噴流を間欠的に行うことで、めっき被膜の厚みのばらつきを低減できる。 (Plating conditions)
In the plating treatment step, the members are plated while the electrolytic solution and the members are jetted upward from the bottom side in the basket and stirred in the plating tank. The plating process involves intermittent jetting of the electrolyte and the members. By intermittently jetting, variations in the thickness of the plating film can be reduced.
　ｎ回目の噴流の継続時間をｔｊ（秒）とし、ｎ回目の噴流の開始から（ｎ＋１）回目の噴流の開始までの時間をｔｉ（秒）とするとき、ｔｊのｔｉに対する比（＝ｔｊ／ｔｉ）の平均値は、例えば、０．０９以上であり、０．１以上が好ましい。比ｔｊ／ｔｉの平均値がこのような範囲である場合、給電面への部材の固着をより効果的に抑制できる。比ｔｊ／ｔｉの平均値は、例えば、０．５５以下であり、０．５以下が好ましい。比ｔｊ／ｔｉの平均値がこのような範囲である場合、めっき被膜の厚みのばらつきを低減する効果がさらに高まる。比ｔｊ／ｔｉの平均値は、めっきの開始から終了までの全期間について上記の範囲であることが好ましい。 When the n-th duration of the jet of the t j (s) is from the start of the n-th jet and (n + 1) th time to the start of the jet t i (in seconds), the ratio t i of t j the average value of (= t j / t i) is, for example, 0.09 or more, preferably 0.1 or more. If the average value of the ratio t j / t i is in such a range can be more effectively suppressed sticking member to the feeding surface. Average ratio t j / t i is, for example, 0.55 or less, preferably 0.5 or less. If the average value of the ratio t j / t i is in such a range, further increasing the effect of reducing the variation in the thickness of the plating film. Average ratio t j / t i is preferably for the entire period from the start to the end of the plating range above.
　バスケット内における電解液および部材の間欠的な噴流は、例えば、ポンプのＯＮおよびＯＦＦを利用して行うことができる。ポンプをＯＮにすると、供給パイプ内または噴流パイプ内を少なくとも電解液が勢いよく流れて、バスケット内において電解液および部材を噴流させることができる。ポンプをＯＦＦにすると、噴流が停止する。ポンプのＯＮおよびＯＦＦを繰り返すことで、間欠的な噴流を行うことができる。ポンプにより、供給パイプ内または噴流パイプ内を流れる電解液の速度を制御してもよい。また、電磁バルブのＯＮおよびＯＦＦを利用して、間欠的な噴流を行ってもよく、ポンプの利用と電磁バルブの利用とを組み合わせてもよい。噴流パイプ中の流れは、供給パイプ中の流れをポンプまたは電磁バルブなどを用いて制御することで、間接的に制御してもよい。必要に応じて、カソードである給電面とアノードとに接続する電源のＯＮおよびＯＦＦにより、給電面およびアノード間への電圧の印加を、間欠的に行うよう制御してもよい。 The intermittent jet of the electrolytic solution and the members in the basket can be performed by using, for example, ON and OFF of the pump. When the pump is turned on, at least the electrolytic solution flows vigorously in the supply pipe or the jet pipe, and the electrolytic solution and the member can be jetted in the basket. When the pump is turned off, the jet stops. By repeating ON and OFF of the pump, an intermittent jet can be performed. The pump may control the speed of the electrolyte flowing through the supply pipe or jet pipe. Further, the electromagnetic valve may be turned on and off to perform an intermittent jet flow, or the use of the pump and the use of the solenoid valve may be combined. The flow in the jet pipe may be indirectly controlled by controlling the flow in the supply pipe by using a pump, an electromagnetic valve, or the like. If necessary, the voltage may be applied intermittently between the feeding surface and the anode by turning on and off the power supply connected to the feeding surface as the cathode and the anode.
　めっき処理工程は、電解液および部材の噴流が停止されている間の少なくとも一部の時間、バスケット内の電解液を下方に逆流させることを含んでもよい。このように電解液を逆流させることで、噴流を停止している間に部材が給電面に押しつけられ易くなる。そのため、連続噴流では、めっき被膜が成長し難いような被めっき領域においても、めっき被膜の成長を促進させることができる。 The plating process may include backflowing the electrolyte in the basket downward for at least some time while the jet of the electrolyte and members is stopped. By causing the electrolytic solution to flow backward in this way, the member is likely to be pressed against the feeding surface while the jet flow is stopped. Therefore, in the continuous jet, the growth of the plating film can be promoted even in the area to be plated where the plating film is difficult to grow.
　ｎ回目の噴流において、バスケット内に供給される電解液の流量を、Ｆｎ（Ｌ／ｍｉｎ）とし、ｎ回目の噴流の後に行われるｎ回目の逆流において、逆流する電解液の流量を、ｆｎ（Ｌ／ｍｉｎ）とする。このとき、ｆｎのＦｎに対する比（ｆｎ／Ｆｎ）の平均値は、０．０５以上であってもよく、０．１以上であってもよい。比ｆｎ／Ｆｎの平均値がこのような範囲である場合、めっき被膜の成長を促進させる効果がさらに高まり、めっき処理速度を高めることができる。比ｆｎ／Ｆｎの平均値は、０．２５以下であってもよく、０．２以下であってもよい。比ｆｎ／Ｆｎの平均値がこのような範囲である場合、高いめっき処理速度を確保しながらも、めっき被膜の厚みのばらつきを効果的に抑制できる。噴流においてバスケット内に供給される電解液の流量は、例えば、噴流の際に噴流パイプまたは供給パイプを流れる電解液の流量である。逆流する電解液の流量は、例えば、噴流パイプまたは供給パイプを逆向きに流れる電解液の流量である。 In the nth jet, the flow rate of the electrolytic solution supplied into the basket is F n (L / min), and in the nth backflow performed after the nth jet, the flow rate of the electrolytic solution flowing back is f. Let n (L / min). At this time, the average value of the ratio of f n to F n (f n / F n ) may be 0.05 or more, or 0.1 or more. When the average value of the ratio f n / F n is in such a range, the effect of promoting the growth of the plating film is further enhanced, and the plating processing speed can be increased. The average value of the ratio f n / F n may be 0.25 or less, or 0.2 or less. When the average value of the ratio f n / F n is in such a range, it is possible to effectively suppress the variation in the thickness of the plating film while ensuring a high plating processing speed. The flow rate of the electrolytic solution supplied into the basket in the jet flow is, for example, the flow rate of the electrolytic solution flowing through the jet pipe or the supply pipe at the time of jet flow. The flow rate of the electrolytic solution flowing back is, for example, the flow rate of the electrolytic solution flowing in the reverse direction through the jet pipe or the supply pipe.
　電解液の組成は、所望するめっき被膜の組成に応じて決定すればよい。例えば、公知の電解めっきに利用されるめっき用電解液が挙げられる。電解液の温度は、使用する電解液の組成に応じて決定すればよい。アノードとカソードとの間に印加される電圧は、所望するめっき被膜の厚み、組成などに応じて設定すればよい。 The composition of the electrolytic solution may be determined according to the desired composition of the plating film. For example, a known electrolytic solution for plating used for electrolytic plating can be mentioned. The temperature of the electrolytic solution may be determined according to the composition of the electrolytic solution to be used. The voltage applied between the anode and the cathode may be set according to the desired thickness and composition of the plating film.
　（めっき処理される部材）
　電解めっきによりめっき被膜を形成するため、めっき処理される部材としては、少なくとも被めっき領域において導電性を有する部材が使用される。 (Members to be plated)
Since the plating film is formed by electrolytic plating, a member having conductivity at least in the area to be plated is used as the member to be plated.
　めっき処理される部材は、表面抵抗率が異なる複数の被めっき領域を有する場合がある。このような部材をめっき処理する場合に、連続的な噴流を行うと、表面抵抗率が低い被めっき領域では、部材が給電面に接触している僅かな時間内でも大きな電気量が流れるため、めっき被膜が優位的に成長する。めっき被膜の優位的な成長により、給電面に部材が固着することもある。しかし、表面抵抗率が高い被めっき領域では、部材が給電面に接触している僅かな時間内に流れる電気量は小さく、めっき被膜が成長し難い。そのため、めっき被膜の厚みのばらつきが特に顕著になる。それに対し、本開示によれば、電解液および部材の噴流を間欠的に行うため、噴流が停止されている間に部材が給電面に接触した状態となる。そのため、表面抵抗率が高い領域でも、めっき被膜が形成され易くなる。これに伴い、表面抵抗率が低い領域においてめっき被膜の過度な成長が抑制される。よって、表面抵抗率が異なる複数の被めっき領域を有する部材を用いる場合であっても、めっき被膜の厚みのばらつきを低減できる。 The member to be plated may have a plurality of areas to be plated having different surface resistivity. When such a member is plated, if a continuous jet is performed, a large amount of electricity flows even within a short time when the member is in contact with the feeding surface in the area to be plated where the surface resistivity is low. The plating film grows predominantly. Due to the dominant growth of the plating film, the member may stick to the feeding surface. However, in the region to be plated having a high surface resistivity, the amount of electricity flowing within a short time when the member is in contact with the feeding surface is small, and it is difficult for the plating film to grow. Therefore, the variation in the thickness of the plating film becomes particularly remarkable. On the other hand, according to the present disclosure, since the jet flow of the electrolytic solution and the member is intermittently performed, the member is in contact with the feeding surface while the jet flow is stopped. Therefore, a plating film is likely to be formed even in a region having a high surface resistivity. Along with this, excessive growth of the plating film is suppressed in the region where the surface resistivity is low. Therefore, even when a member having a plurality of regions to be plated having different surface resistivity is used, the variation in the thickness of the plating film can be reduced.
　複数の被めっき領域における表面抵抗率の最大値をＲ１、最小値をＲ２とするとき、Ｒ１のＲ２に対する比（＝Ｒ１／Ｒ２）は、例えば、５０以上であり、１００以上であってもよい。比Ｒ１／Ｒ２がこのような範囲である場合、電解液および部材の噴流を間欠的に行うことによる効果が発揮され易くなり、めっき被膜の厚みのばらつきをより効果的に低減することができる。めっき被膜の厚みのばらつきを抑制しながら、給電面への部材の固着をより効果的に抑制し易い観点からは、比Ｒ１／Ｒ２は、５５００以下であってもよく、１０００以下であってもよい。 When the maximum value of the surface resistivity in the plurality of areas to be plated is R1 and the minimum value is R2, the ratio of R1 to R2 (= R1 / R2) is, for example, 50 or more, and may be 100 or more. .. When the ratio R1 / R2 is in such a range, the effect of intermittently jetting the electrolytic solution and the member can be easily exerted, and the variation in the thickness of the plating film can be more effectively reduced. The ratio R1 / R2 may be 5500 or less, or 1000 or less, from the viewpoint that it is easy to more effectively suppress the sticking of the member to the feeding surface while suppressing the variation in the thickness of the plating film. Good.
　被めっき領域の表面抵抗率（Ω／□）は、被めっき領域と同じ材料で形成された被膜を有するサンプルに、抵抗率計の四探針プローブを押し当てることにより測定される。サンプルは、被めっき領域と同じ材料を含む塗料を、スクリーン印刷によりガラスプレート上に塗布し、乾燥することにより得られる。 The surface resistivity (Ω / □) of the area to be plated is measured by pressing the four-probe probe of the resistivity meter against a sample having a film formed of the same material as the area to be plated. The sample is obtained by applying a paint containing the same material as the area to be plated onto a glass plate by screen printing and drying.
　電解液および部材を噴流させるため、部材としては、比較的サイズが小さな部材が適している。部材の最大長は、例えば、５ｍｍ以下であり、３ｍｍ以下であってもよい。めっき被膜の厚みの調節が容易である観点からは、部材の最大長は、０．３ｍｍ以上または０．５ｍｍ以上であってもよい。 A relatively small size member is suitable as the member because the electrolytic solution and the member are jetted. The maximum length of the member is, for example, 5 mm or less, and may be 3 mm or less. From the viewpoint that the thickness of the plating film can be easily adjusted, the maximum length of the member may be 0.3 mm or more or 0.5 mm or more.
　部材の種類は、特に制限されない。部材の例としては、機械部品、電子部品、導電性粒子などが挙げられる。チップ型部品、抵抗器、振動子、コンタクトプローブなどを部材として用いてもよい。中でも、チップ抵抗器には、表面抵抗率が異なる複数の被めっき領域が存在する。そのため、チップ抵抗器を、従来の方法でめっき処理すると、めっき被膜の厚みのばらつきが大きくなり、製品不良率が高くなる。本開示によれば、噴流を間欠的に行うため、このようなチップ抵抗器をめっき処理する場合でも、めっき被膜の厚みのばらつきを低減することができ、製品不良率を低減することができる。 The type of member is not particularly limited. Examples of the member include mechanical parts, electronic parts, conductive particles and the like. Chip type parts, resistors, vibrators, contact probes and the like may be used as members. Among them, the chip resistor has a plurality of regions to be plated having different surface resistivity. Therefore, when the chip resistor is plated by a conventional method, the thickness of the plating film varies widely and the product defect rate increases. According to the present disclosure, since the jet flow is intermittently performed, it is possible to reduce the variation in the thickness of the plating film and reduce the product defect rate even when such a chip resistor is plated.
　図２は、本開示の製造方法によりめっき処理されるのに適したチップ抵抗器の一例を示す概略縦断面図である。チップ抵抗器１００は、基板１０１と、基板１０１の上面に配置された抵抗体１０２および上面電極１０３と、基板１０１の裏面に配置された裏面電極１０４と、基板１０１の端面に配置された端面電極１０５とを備えている。チップ抵抗器１００は、さらに抵抗体１０２を覆うように形成された保護膜１０６を含む。このように、チップ抵抗器１００は、複数の電極を備えている。電極の使用目的に応じて、電極部分の表面抵抗率が異なることが多い。本開示の製造方法によれば、このように表面抵抗率が異なる複数の領域が存在する部材を用いる場合でも、めっき被膜の厚みのばらつきを抑制することができる。 FIG. 2 is a schematic vertical cross-sectional view showing an example of a chip resistor suitable for plating by the manufacturing method of the present disclosure. The chip resistor 100 includes a substrate 101, a resistor 102 and an upper surface electrode 103 arranged on the upper surface of the substrate 101, a back surface electrode 104 arranged on the back surface of the substrate 101, and an end face electrode arranged on the end surface of the substrate 101. It is equipped with 105. The chip resistor 100 further includes a protective film 106 formed to cover the resistor 102. As described above, the chip resistor 100 includes a plurality of electrodes. The surface resistivity of the electrode portion often differs depending on the purpose of use of the electrode. According to the manufacturing method of the present disclosure, it is possible to suppress variations in the thickness of the plating film even when a member having a plurality of regions having different surface resistivity is used.
　（その他）
　めっき処理された部材において、めっき被膜の厚みは、例えば、０．５μｍ以上５０μｍ以下、１μｍ以上３０μｍ以下または２μｍ以上２０μｍ以下であってもよい。 (Other)
In the plated member, the thickness of the plating film may be, for example, 0.5 μm or more and 50 μm or less, 1 μm or more and 30 μm or less, or 2 μm or more and 20 μm or less.
［めっき処理装置］
　本開示には、めっき処理装置も包含される。本開示のめっき処理装置は、めっき槽と、電解液をめっき槽の底部に供給する供給パイプと、めっき槽から電解液を排出する排出パイプと、制御部とを備える。めっき槽、供給パイプおよび排出パイプについては、それぞれ、製造方法についての説明を参照できる。制御部は、めっき槽のバスケット内において、めっき処理される部材を、電解液とともにバスケットの底部側から上方に向かって噴流させて撹拌しながら、部材をめっきするめっき処理において、電解液および部材の噴流を間欠的に行うよう制御する制御ユニットを含む。めっき槽で行われるめっき処理工程については、製造方法についての説明を参照できる。 [Plating equipment]
The present disclosure also includes a plating processing apparatus. The plating processing apparatus of the present disclosure includes a plating tank, a supply pipe for supplying an electrolytic solution to the bottom of the plating tank, a discharge pipe for discharging the electrolytic solution from the plating tank, and a control unit. For the plating tank, the supply pipe, and the discharge pipe, the description of the manufacturing method can be referred to. In the plating process of plating the member, the control unit jets the member to be plated together with the electrolytic solution from the bottom side of the basket upward and stirs the member in the basket of the plating tank. Includes a control unit that controls the jet flow intermittently. For the plating process performed in the plating tank, the description of the manufacturing method can be referred to.
　めっき処理装置は、さらに、供給パイプに接続されたポンプを備えていてもよい。この場合、制御ユニットは、ポンプを間欠的に作動させることで、電解液および部材の噴流を間欠的に行うよう制御する制御ユニット（以下、第１制御ユニットと称する）であってもよい。例えば、第１制御ユニットは、ポンプのＯＮおよびＯＦＦを制御するユニットであってもよい。また、第１制御ユニットは、さらに、ポンプにより供給パイプ内または噴流パイプ内を流れる電解液のフローの向きを制御するユニットであってもよい。この場合、第１制御ユニットにより、ポンプを制御して、供給パイプ内または噴流パイプ内の電解液を逆流させることができる。これにより、電解液および部材の噴流が停止されている間の少なくとも一部の時間、バスケット内の電解液を下方に逆流させることができる。 The plating processing apparatus may further include a pump connected to a supply pipe. In this case, the control unit may be a control unit (hereinafter, referred to as a first control unit) that controls the jet flow of the electrolytic solution and the member intermittently by operating the pump intermittently. For example, the first control unit may be a unit that controls ON and OFF of the pump. Further, the first control unit may be a unit that controls the direction of the flow of the electrolytic solution flowing in the supply pipe or the jet pipe by a pump. In this case, the first control unit can control the pump to cause the electrolytic solution in the supply pipe or the jet pipe to flow back. As a result, the electrolytic solution in the basket can be backflowed downward for at least a part of the time while the jet of the electrolytic solution and the member is stopped.
　制御ユニットは、上述のようなポンプの動作を制御する第１制御ユニットに限定されない。めっき処理装置は、供給パイプおよび噴流パイプの少なくとも一方に配置された電磁バルブを備えてもよい。この場合、制御ユニットとして、電磁バルブのＯＮおよびＯＦＦを制御する第２制御ユニットを用いてもよい。電磁バルブを制御することにより、噴流パイプ内または供給パイプ内における電解液のフローが制御される。制御部は、第１制御ユニットおよび第２制御ユニットの一方を含んでもよく、双方を含んでもよい。 The control unit is not limited to the first control unit that controls the operation of the pump as described above. The plating apparatus may include solenoid valves located on at least one of a supply pipe and a jet pipe. In this case, as the control unit, a second control unit that controls ON and OFF of the solenoid valve may be used. By controlling the solenoid valve, the flow of the electrolytic solution in the jet pipe or the supply pipe is controlled. The control unit may include one of the first control unit and the second control unit, or may include both.
　制御部は、さらに、アノードとカソードである給電面との間の電圧の印加を制御する第３制御ユニットを含んでもよい。第３制御ユニットは、アノードおよび給電面と接続した電源のＯＮおよびＯＦＦを制御するユニットであってもよい。 The control unit may further include a third control unit that controls the application of a voltage between the anode and the feeding surface which is the cathode. The third control unit may be a unit that controls ON and OFF of the power supply connected to the anode and the feeding surface.
　ポンプは、排出パイプおよび供給パイプの双方に接続された循環ポンプであってもよい。この場合、めっき槽から排出された電解液は、循環ポンプにより、供給パイプに供給され、めっき槽内に循環される。必要に応じて、排出された電解液の一部をめっき槽内に循環させずに、タンクなどに回収してもよい。めっき処理装置は、排出された電解液を回収するリザーブタンクを備えていてもよい。電解液は、必要に応じて、ポンプにより、リザーブタンクから供給パイプを通じてめっき槽内に循環させてもよい。めっき処理装置は、必要に応じて、２つ以上のポンプを備えていてもよい。 The pump may be a circulation pump connected to both the discharge pipe and the supply pipe. In this case, the electrolytic solution discharged from the plating tank is supplied to the supply pipe by the circulation pump and circulated in the plating tank. If necessary, a part of the discharged electrolytic solution may be collected in a tank or the like without being circulated in the plating tank. The plating processing apparatus may include a reserve tank for collecting the discharged electrolytic solution. If necessary, the electrolytic solution may be circulated from the reserve tank through the supply pipe into the plating tank by a pump. The plating processing apparatus may include two or more pumps, if necessary.
　めっき処理装置は、循環ポンプに循環するための第１排出パイプと、リザーブタンクに電解液を回収するための第２排出パイプとを備えていてもよい。この場合に限らず、めっき処理装置は、２つ以上の排出パイプを備えていてもよい。 The plating processing apparatus may include a first discharge pipe for circulating in the circulation pump and a second discharge pipe for recovering the electrolytic solution in the reserve tank. Not limited to this case, the plating processing apparatus may include two or more discharge pipes.
　めっき処理装置は、フレッシュな電解液をめっき槽に供給するための供給タンクを備えていてもよい。めっき処理装置は、必要に応じて、２つ以上の供給パイプを備えていてもよい。 The plating processing apparatus may include a supply tank for supplying a fresh electrolytic solution to the plating tank. The plating processing apparatus may include two or more supply pipes, if necessary.
　めっき処理装置では、バスケットとして、特許文献１に教示されるようなバスケットを用いてもよい。特許文献１では、バスケット内に配置されたドラフトパイプが電解液および部材を噴流させる機能を有する。しかし、本開示のめっき処理装置では、特許文献１のようなバスケット内にドラフトパイプを設けなくても、効率よくめっき処理を行うことができ、めっき被膜の厚みのばらつきを抑制できる。 In the plating processing apparatus, a basket as taught in Patent Document 1 may be used as the basket. In Patent Document 1, a draft pipe arranged in a basket has a function of jetting an electrolytic solution and a member. However, in the plating processing apparatus of the present disclosure, the plating processing can be efficiently performed without providing the draft pipe in the basket as in Patent Document 1, and the variation in the thickness of the plating film can be suppressed.
　めっき処理装置において、例えば、バスケットの容量は上述の範囲から選択できる。めっき処理装置は、特に、１．５Ｌ以下または１Ｌ以下の容量を有するバスケットを用いる場合に適している。バスケットの容量の下限は、上述の範囲から選択できる。 In the plating processing equipment, for example, the capacity of the basket can be selected from the above range. The plating processing apparatus is particularly suitable when using a basket having a capacity of 1.5 L or less or 1 L or less. The lower limit of the basket capacity can be selected from the above range.
　上述のように、めっき処理装置において、バスケットは、側壁の窓全体がめっき槽の電解液に浸漬された状態であってもよく、バスケット全体がめっき槽の電解液に浸漬された状態であってもよく、蓋の上部までめっき槽の電解液に浸漬された状態であってもよい。 As described above, in the plating processing apparatus, the basket may be in a state in which the entire side wall window is immersed in the electrolytic solution of the plating tank, or the entire basket is in a state of being immersed in the electrolytic solution of the plating tank. It may be in a state where the upper part of the lid is immersed in the electrolytic solution of the plating tank.
　図３は、本開示の一実施形態に係るめっき処理装置を概略的に示すブロック図である。図３の例では、めっき処理装置は、めっき槽１と、めっき槽１から電解液を排出する第１排出パイプ６０Ａと、排出された電解液をめっき槽１に供給する供給パイプ５０と、第１排出パイプ６０Ａおよび供給パイプ５０に接続されたポンプＰと、ポンプＰのＯＮおよびＯＦＦを制御する制御部７０とを備える。めっき処理装置は、さらに、めっき槽１から過剰な電解液を回収するための第２排出パイプ６０Ｂと、回収された電解液を収容するリザーブタンク８０を備えている。めっき槽１は、例えば、図１に示す構成とすることができる。 FIG. 3 is a block diagram schematically showing a plating processing apparatus according to an embodiment of the present disclosure. In the example of FIG. 3, the plating processing apparatus includes a plating tank 1, a first discharge pipe 60A for discharging the electrolytic solution from the plating tank 1, a supply pipe 50 for supplying the discharged electrolytic solution to the plating tank 1, and a first. (1) A pump P connected to the discharge pipe 60A and the supply pipe 50, and a control unit 70 for controlling ON / OFF of the pump P are provided. The plating processing apparatus further includes a second discharge pipe 60B for recovering the excess electrolytic solution from the plating tank 1, and a reserve tank 80 for accommodating the recovered electrolytic solution. The plating tank 1 can have, for example, the configuration shown in FIG.
　ポンプＰは、排出パイプ６０Ａから排出された電解液を、供給パイプ５０を経てめっき槽１内に循環させる循環ポンプの役割を有する。図３の例では、リザーブタンク８０に収容された電解液は、必要に応じて、ポンプＰにより、供給パイプ５０を通じてめっき槽１内に供給することができる。 The pump P has a role of a circulation pump that circulates the electrolytic solution discharged from the discharge pipe 60A into the plating tank 1 via the supply pipe 50. In the example of FIG. 3, the electrolytic solution contained in the reserve tank 80 can be supplied into the plating tank 1 through the supply pipe 50 by the pump P, if necessary.
　制御部７０は、ポンプＰのＯＮおよびＯＦＦを繰り返すよう制御する第１制御ユニットを含む。第１制御ユニットにより、供給パイプ５０およびめっき槽１の噴流パイプ３を流れる電解液のフローが制御される。その結果、バスケット２内の電解液および部材の噴流を間欠的に行うことができる。 The control unit 70 includes a first control unit that controls the pump P to be repeatedly turned on and off. The first control unit controls the flow of the electrolytic solution flowing through the supply pipe 50 and the jet pipe 3 of the plating tank 1. As a result, the electrolytic solution and the members in the basket 2 can be jetted intermittently.
［実施例］
　以下、本発明を実施例および比較例に基づいて具体的に説明するが、本発明は以下の実施例に限定されない。 [Example]
Hereinafter, the present invention will be specifically described based on Examples and Comparative Examples, but the present invention is not limited to the following Examples.
《実施例１》
（１）めっき処理
　図１に示すめっき槽１を用いて、部材として図２に示すチップ抵抗器１００をめっき処理した。めっき槽１のバスケットの容量は０．９Ｌであった。各チップ抵抗器１００の最大長は１ｍｍであり、容積の合計は２４ｍＬであった。用いたチップ抵抗器１００において、上面電極１０３および裏面電極１０４の表面抵抗率はほぼ同じである。上面電極１０３および裏面電極１０４の表面抵抗率Ｒ１の、端面電極１０５の表面抵抗率Ｒ２に対する比Ｒ１／Ｒ２は、６００であった。 << Example 1 >>
(1) Plating Treatment Using the plating tank 1 shown in FIG. 1, the chip resistor 100 shown in FIG. 2 was plated as a member. The capacity of the basket of the plating tank 1 was 0.9 L. The maximum length of each chip resistor 100 was 1 mm, and the total volume was 24 mL. In the chip resistor 100 used, the surface resistivity of the upper surface electrode 103 and the back surface electrode 104 are substantially the same. The ratio R1 / R2 of the surface resistivity R1 of the upper surface electrode 103 and the back surface electrode 104 to the surface resistivity R2 of the end surface electrode 105 was 600.
　電解液としては、スルファミン酸ニッケル浴用のめっき溶液を用いた。めっき溶液中のスルファミン酸ニッケルの濃度は６００ｇ／Ｌであった。めっき処理は、カソードとしての内面２１ａとアノード３０との間に、所定の電圧を連続して印加することにより行った。その間、比ｔｊ／ｔｉの平均値が０．０８～０．５となるように、ポンプのＯＮおよびＯＦＦを繰り返しながら、供給パイプ５０より電解液を間欠的に供給することで、噴流パイプ３内の電解液のフローを制御した。噴流させる間の噴流パイプ３からバスケット２内への電解液の流量Ｆｎは、１０Ｌ／ｍｉｎとした。このようにしてバスケット２内において、電解液およびチップ抵抗器１００の噴流を間欠的に行った。なお、比ｔｊ／ｔｉの平均値は、０．０８～０．５の間で複数の値に制御し、各値の場合について、めっき処理を行った。 As the electrolytic solution, a plating solution for a nickel sulfamate bath was used. The concentration of nickel sulfamate in the plating solution was 600 g / L. The plating treatment was performed by continuously applying a predetermined voltage between the inner surface 21a as the cathode and the anode 30. Meanwhile, as the average value of the ratio t j / t i is 0.08-0.5, while repeating ON and OFF of the pump, by intermittently supplying the electrolytic solution from the supply pipe 50, the jet pipe The flow of the electrolytic solution in 3 was controlled. The flow rate F n of the electrolytic solution from the jet pipe 3 into the basket 2 during the jet flow was set to 10 L / min. In this way, the electrolytic solution and the chip resistor 100 were jetted intermittently in the basket 2. The average value of the ratio t j / t i is controlled to a plurality of values between 0.08 and 0.5 for the case of each value, plating treatment was carried out.
（２）評価
　めっき処理されたチップ抵抗器１００について下記の評価を行った。 (2) Evaluation The following evaluation was performed on the plated chip resistor 100.
（ａ）めっき被膜の厚みのばらつき
　めっき処理された各チップ抵抗器１００について、端面電極１０５の表面に形成されためっき被膜の厚みＴ２の上面電極１０３および裏面電極１０４に形成されためっき被膜の厚みＴ１に対する厚みの比（＝Ｔ２／Ｔ１）の値を求めた。全てのチップ抵抗器１００に占める、比Ｔ２／Ｔ１が０．８未満であるチップ抵抗器１００の個数比率（％）を求めた。なお、比Ｔ２／Ｔ１が０．８以上１以下の場合、めっき被膜の厚みのばらつきが少なく、０．８未満の場合には厚みのばらつきが多いことを示す。 (A) Variation in thickness of plating film For each plated chip resistor 100, the thickness of the plating film formed on the surface of the end face electrode 105 is the thickness of the plating film formed on the upper surface electrode 103 and the back surface electrode 104 of T2. The value of the thickness ratio (= T2 / T1) to T1 was obtained. The number ratio (%) of the chip resistors 100 having a ratio T2 / T1 of less than 0.8 in all the chip resistors 100 was determined. When the ratio T2 / T1 is 0.8 or more and 1 or less, the variation in the thickness of the plating film is small, and when it is less than 0.8, the variation in the thickness is large.
（ｂ）給電面への固着
　めっき処理後にバスケット２の内面２１ａに固着された状態のチップ抵抗器１００の、全てのチップ抵抗器に占める個数比率（％）を求め、固着率とした。 (B) Sticking to the feeding surface The number ratio (%) of the chip resistors 100 in a state of being stuck to the inner surface 21a of the basket 2 after the plating treatment in all the chip resistors was obtained and used as the sticking rate.
《比較例１》
　バスケット２内における電解液およびチップ抵抗器１００の噴流を連続的に行った。より具体的には、ポンプを連続してＯＮにした状態で、供給パイプ５０および噴流パイプ３内の電解液の流量を変化させずに連続的にバスケット２内に電解液を供給した。これ以外は、実施例１の場合と同様にしてめっき処理を行った。比ｔｊ／ｔｉの平均値は１である。めっき処理されたチップ抵抗器１００を用いて実施例１と同様の評価を行った。 << Comparative Example 1 >>
The electrolytic solution and the chip resistor 100 were continuously jetted in the basket 2. More specifically, with the pump continuously turned on, the electrolytic solution was continuously supplied into the basket 2 without changing the flow rates of the electrolytic solution in the supply pipe 50 and the jet pipe 3. Other than this, the plating treatment was performed in the same manner as in the case of Example 1. Average ratio t j / t i is 1. The same evaluation as in Example 1 was performed using the plated chip resistor 100.
　評価の結果、噴流を連続的に行った比較例１では、めっき被膜の厚みのばらつきが大きいチップ抵抗器１００の個数比率は、１０％を超える大きな値であった。それに対し、噴流を間欠的に行った実施例１では、めっき被膜の厚みのばらつきが大きいチップ抵抗器１００の個数比率は、０．１％以下であった。 As a result of the evaluation, in Comparative Example 1 in which the jet flow was continuously performed, the number ratio of the chip resistors 100 having a large variation in the thickness of the plating film was a large value exceeding 10%. On the other hand, in Example 1 in which the jet flow was intermittently performed, the number ratio of the chip resistors 100 having a large variation in the thickness of the plating film was 0.1% or less.
　一方、噴流を停止している時間が長くなると、給電面への固着が起こり易くなる。比ｔｊ／ｔｉの平均値が０．０８である場合、固着率が１０％を超える値となった。比ｔｊ／ｔｉの平均値が０．１以上の場合、固着率は０．０１％以下であった。そのため、固着を抑制する観点からは、比ｔｊ／ｔｉの平均値は、０．０８より大きく、例えば、０．０９以上または０．１以上とすることが好ましい。 On the other hand, if the jet flow is stopped for a long time, sticking to the feeding surface is likely to occur. If the average value of the ratio t j / t i is 0.08, fixed rate is a value greater than 10%. If the average value of the ratio t j / t i is at least 0.1, fixation is 0.01% or less. Therefore, from the viewpoint of suppressing sticking, average value of the ratio t j / t i is greater than 0.08, for example, preferably set to 0.09 or more or 0.1 or more.
《実施例２および３》
　ポンプを用いて、電解液を、供給パイプ５０および噴流パイプ３内に供給することと、供給パイプ５０および噴流パイプ３内を逆流させることとを交互に繰り返した。このようにしてバスケット２内において、電解液およびチップ抵抗器１００の噴流と、電解液への下方への逆流とを交互に繰り返した。比ｔｊ／ｔｉの平均値は、０．１～０．５の範囲で複数の値に制御し、各値の場合について、めっき処理を行った。噴流パイプ３から逆流する電解液の流量ｆｎ（Ｌ／ｍｉｎ）は、実施例２について１Ｌ／ｍ、実施例３について２Ｌ／ｍとした。これ以外は、実施例１と同様にしてめっき処理を行った。そして、めっき処理に要する時間を測定した。なお、めっき処理に要する時間は、上面電極１０３の表面に形成されるめっき被膜の厚みが平均的に６μｍになるまでの時間とした。 << Examples 2 and 3 >>
Using a pump, supplying the electrolytic solution into the supply pipe 50 and the jet pipe 3 and regurgitating the inside of the supply pipe 50 and the jet pipe 3 were alternately repeated. In this way, the jet of the electrolytic solution and the chip resistor 100 and the downward backflow to the electrolytic solution were alternately repeated in the basket 2. Average ratio t j / t i is controlled to multiple values in the range of 0.1-0.5, for the case of each value, plating treatment was carried out. The flow rate f n (L / min) of the electrolytic solution flowing back from the jet pipe 3 was 1 L / m for Example 2 and 2 L / m for Example 3. Other than this, the plating treatment was performed in the same manner as in Example 1. Then, the time required for the plating process was measured. The time required for the plating treatment was set to the time until the thickness of the plating film formed on the surface of the top electrode 103 became 6 μm on average.
　実施例１の比ｔｊ／ｔｉの平均値が０．１～０．５の範囲の場合についても、実施例２および３の場合と同様に、めっき処理に要する時間を測定した。各実施例についてめっき処理に要する時間を表１に示す。表１において、実施例１～３は、それぞれＥ１～Ｅ３である。また、比ｔｊ／ｔｉの平均値をｔａｖで示す。 For the case of the range the average value of 0.1 to 0.5 of the ratio t j / t i of Example 1, as in the case of Examples 2 and 3 were measured the time required for plating process. Table 1 shows the time required for the plating process for each example. In Table 1, Examples 1 to 3 are E1 to E3, respectively. Also shows the average value of the ratio t j / t i at t av.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示されるように、めっき処理工程において、バスケット２内における電解液および部材の噴流が停止されている間に、バスケット２内の電解液を下方に逆流させると、めっき被膜の成長が促進され、めっき処理に要する時間を短くすることができる。 As shown in Table 1, in the plating process, if the electrolytic solution in the basket 2 is backflowed downward while the jet of the electrolytic solution and the members in the basket 2 is stopped, the growth of the plating film is promoted. Therefore, the time required for the plating process can be shortened.
　本発明を現時点での好ましい実施態様に関して説明したが、そのような開示を限定的に解釈してはならない。種々の変形および改変は、上記開示を読むことによって本発明に属する技術分野における当業者には間違いなく明らかになるであろう。したがって、添付の請求の範囲は、本発明の真の精神および範囲から逸脱することなく、すべての変形および改変を包含する、と解釈されるべきである。 Although the present invention has been described with respect to preferred embodiments at this time, such disclosure should not be construed in a limited way. Various modifications and modifications will undoubtedly become apparent to those skilled in the art belonging to the present invention by reading the above disclosure. Therefore, the appended claims should be construed to include all modifications and modifications without departing from the true spirit and scope of the invention.
　本開示の製造方法およびめっき処理装置は、導電性の被めっき領域を備える各種部材のめっき処理に適している。 The manufacturing method and plating processing apparatus of the present disclosure are suitable for plating various members having a conductive area to be plated.
　１：めっき槽、２：バスケット、３：噴流パイプ、１０：電槽、２１：底部、２１ａ：内面、２２：側壁、２２ａ：窓、２３：蓋、２３ａ：窓、３０：アノード、４０：Ｏ－リング、５０：供給パイプ、６０Ａ，６０Ｂ：排出パイプ、Ｆ１，Ｆ２，Ｆ３：フィルター、７０：制御部、８０：リザーブタンク、Ｐ：ポンプ、１００：チップ抵抗器、１０１：基板、１０２：抵抗体、１０３：上面電極、１０４：裏面電極、１０５：端面電極、１０６：保護膜 1: Plating tank, 2: Basket, 3: Pump pipe, 10: Electric tank, 21: Bottom, 21a: Inner surface, 22: Side wall, 22a: Window, 23: Lid, 23a: Window, 30: Anode, 40: O -Ring, 50: Supply pipe, 60A, 60B: Discharge pipe, F1, F2, F3: Filter, 70: Control unit, 80: Reserve tank, P: Pump, 100: Chip resistor, 101: Substrate, 102: Resistance Body, 103: top electrode, 104: back electrode, 105: end face electrode, 106: protective film

Claims (10)

  1. 　下方に向かって窄まるように傾斜し、かつ給電面として機能する内面を有する底部を備えるバスケットと、電解液および前記電解液に浸漬された前記バスケットを収容する電槽と、を備えるめっき槽の前記バスケット内において、めっき処理される部材を、前記電解液とともに前記底部側から上方に向かって噴流させて撹拌しながら、前記部材をめっきするめっき処理工程を含み、
    　前記めっき処理工程は、前記電解液および前記部材の噴流を間欠的に行うことを含む、めっき処理された部材の製造方法。     A plating tank including a basket having a bottom having an inner surface that is inclined downward so as to be narrowed and functions as a feeding surface, and an electric tank that houses an electrolytic solution and the basket immersed in the electrolytic solution. In the basket, the member to be plated is jetted upward from the bottom side together with the electrolytic solution and stirred, and the member is plated.
    The plating treatment step is a method for manufacturing a plated member, which comprises intermittently jetting the electrolytic solution and the member.
  2. 　前記部材は、表面抵抗率が異なる複数の被めっき領域を有する、請求項１に記載のめっき処理された部材の製造方法。 The method for manufacturing a plated member according to claim 1, wherein the member has a plurality of areas to be plated having different surface resistivityes.
  3. 　前記複数の被めっき領域における表面抵抗率の最大値をＲ１、最小値をＲ２とするとき、
    　Ｒ１のＲ２に対する比（＝Ｒ１／Ｒ２）は、５０以上５５００以下である、請求項２に記載のめっき処理された部材の製造方法。     When the maximum value of the surface resistivity in the plurality of areas to be plated is R1 and the minimum value is R2,
    The method for manufacturing a plated member according to claim 2, wherein the ratio of R1 to R2 (= R1 / R2) is 50 or more and 5500 or less.
  4. 　ｎ回目の噴流の継続時間をｔｊ（秒）とし、
    　前記ｎ回目の噴流の開始から（ｎ＋１）回目の噴流の開始までの時間をｔｉ（秒）とするとき、
    　ｔｊのｔｉに対する比（＝ｔｊ／ｔｉ）の平均値は、０．１以上０．５以下である、請求項１～３のいずれか１項に記載のめっき処理された部材の製造方法。     Let t j (seconds) be the duration of the nth jet.
    When the start of the n-th jet and (n + 1) th time to the start of the jet t i (s),
    average ratio (= t j / t i) for t i of t j is 0.1 to 0.5, plating the treated member according to any one of claims 1 to 3 Production method.
  5. 　前記めっき槽には、前記電解液を前記バスケットの前記底部に供給する供給パイプが接続されており、
    　前記めっき処理工程は、前記供給パイプから前記電解液を供給しながら前記バスケットの上部から少なくとも前記電解液をオーバーフローさせることを含む、請求項１～４のいずれか１項に記載のめっき処理された部材の製造方法。     A supply pipe for supplying the electrolytic solution to the bottom of the basket is connected to the plating tank.
    The plating treatment according to any one of claims 1 to 4, wherein the plating treatment step includes at least overflowing the electrolytic solution from the upper part of the basket while supplying the electrolytic solution from the supply pipe. Manufacturing method of parts.
  6. 　前記めっき処理工程は、前記電解液および前記部材の噴流が停止されている間の少なくとも一部の時間、前記バスケット内の前記電解液を下方に逆流させることを含む、請求項１～５のいずれか１項に記載のめっき処理された部材の製造方法。 The plating treatment step comprises backflowing the electrolytic solution in the basket downward for at least a part of the time while the jet of the electrolytic solution and the member is stopped, according to any one of claims 1 to 5. The method for manufacturing a plated member according to item 1.
  7. 　ｎ回目の噴流において、前記バスケット内に供給される前記電解液の流量を、Ｆｎ（Ｌ／ｍｉｎ）とし、
    　前記ｎ回目の噴流の後に行われるｎ回目の逆流において、逆流する前記電解液の流量を、ｆｎ（Ｌ／ｍｉｎ）とするとき、
    　ｆｎのＦｎに対する比（＝ｆｎ／Ｆｎ）の平均値は、０．０５以上０．２５以下である、請求項６に記載のめっき処理された部材の製造方法。     In the nth jet, the flow rate of the electrolytic solution supplied into the basket is defined as F n (L / min).
    When the flow rate of the electrolytic solution flowing back in the nth backflow performed after the nth jet is f n (L / min),
    The method for manufacturing a plated member according to claim 6, wherein the average value of the ratio of f n to F n (= f n / F n) is 0.05 or more and 0.25 or less.
  8. 　下方に向かって窄まるように傾斜し、かつ給電面として機能する内面を有する底部を備えるバスケットと、電解液および前記電解液に浸漬された前記バスケットを収容する電槽と、を備えるめっき槽と、
    　前記電解液を前記バスケットの底部に供給する供給パイプと、
    　前記めっき槽から前記電解液を排出する排出パイプと、
    　制御部と、を備え、
    　前記制御部は、前記バスケット内において、めっき処理される部材を、前記電解液とともに前記底部側から上方に向かって噴流させて撹拌しながら、前記部材をめっきするめっき処理において、前記電解液および前記部材の噴流を間欠的に行うよう制御する制御ユニットを含む、めっき処理装置。     A plating tank including a basket having a bottom having an inner surface that is inclined downward so as to be narrowed and functions as a feeding surface, and an electric tank that houses an electrolytic solution and the basket immersed in the electrolytic solution. ,
    A supply pipe that supplies the electrolytic solution to the bottom of the basket,
    A discharge pipe for discharging the electrolytic solution from the plating tank,
    With a control unit
    In the plating process of plating the member, the control unit jets the member to be plated together with the electrolytic solution upward from the bottom side and stirs the member in the basket, and the electrolytic solution and the said. A plating processing apparatus including a control unit that controls the jet flow of members intermittently.
  9. 　さらに、前記供給パイプに接続されたポンプを備え、
    　前記制御ユニットは、前記ポンプを間欠的に作動させることで、前記電解液および前記部材の噴流を間欠的に行うよう制御する、請求項８に記載のめっき処理装置。     In addition, it is equipped with a pump connected to the supply pipe.
    The plating processing apparatus according to claim 8, wherein the control unit controls the jet of the electrolytic solution and the member intermittently by operating the pump intermittently.
  10. 　前記バスケットの容量は、１．５Ｌ以下である、請求項８または９に記載のめっき処理装置。 The plating processing apparatus according to claim 8 or 9, wherein the capacity of the basket is 1.5 L or less.
PCT/JP2020/044240 2019-11-29 2020-11-27 Method of manufacturing plated member, and plating apparatus WO2021107100A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002030496A (en) * 2000-07-10 2002-01-31 Ideya:Kk Electroplating method and electroplating apparatus
JP2019157145A (en) * 2018-03-07 2019-09-19 中央機械株式会社 Article treatment device, and article treatment method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002030496A (en) * 2000-07-10 2002-01-31 Ideya:Kk Electroplating method and electroplating apparatus
JP2019157145A (en) * 2018-03-07 2019-09-19 中央機械株式会社 Article treatment device, and article treatment method

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