WO2021100945A1 - Electronic device having housing formed by 3d printing method - Google Patents

Electronic device having housing formed by 3d printing method Download PDF

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Publication number
WO2021100945A1
WO2021100945A1 PCT/KR2019/016265 KR2019016265W WO2021100945A1 WO 2021100945 A1 WO2021100945 A1 WO 2021100945A1 KR 2019016265 W KR2019016265 W KR 2019016265W WO 2021100945 A1 WO2021100945 A1 WO 2021100945A1
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WO
WIPO (PCT)
Prior art keywords
pattern
housing
output
electronic device
coupled
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PCT/KR2019/016265
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French (fr)
Korean (ko)
Inventor
이광성
이충현
Original Assignee
주식회사 파트론
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Publication of WO2021100945A1 publication Critical patent/WO2021100945A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus

Definitions

  • the present invention relates to an electronic device in which a housing is formed by a 3D printing method.
  • the injection molding process is a molding process in which a plastic resin is injected into a mold to form a structure having a desired shape.
  • the injection molding process requires a high cost to manufacture a mold for injection molding, but once the mold is made, it is possible to repeatedly inject several times, so the manufacturing cost per piece is low and work efficiency is high, so it is mainly used for mass production.
  • the injection molding process has a problem in that the manufacturing cost per unit is increased due to the high initial mold manufacturing cost. In addition, it takes a considerable amount of time to manufacture the mold, and these products often require rapid development and modification, so using the injection molding process may cause problems.
  • the thickness of the electronic device is very thin, so that the internal space in which the substrate is located is very narrow, and as the electronic device is miniaturized, the antenna space required for communication is very narrow. To form, a problem is occurring.
  • An object of the present invention is to provide an electronic device in which a housing is formed by a 3D printing method.
  • An electronic device includes: a housing formed of an insulating material and including an output portion formed by a 3D printing method; And an output pattern coupled to the surface of the housing and coupled to the output portion and an extension pattern connected to the output pattern, wherein the output pattern is formed together with the output portion by a 3D printing method.
  • the extension pattern may be formed of a flexible circuit board or a plating layer coupled to the surface of the housing.
  • the housing may be coupled to the output portion and further include an injection portion formed by injection molding, and at least a portion of the extension pattern may be coupled to the injection portion.
  • the output portion may be formed by being laminated on a surface of a portion of the injection portion.
  • a substrate accommodated in the inner space of the housing may be further included, and the output pattern may be electrically connected to a terminal portion of the substrate.
  • the output portion may include a protrusion protruding from a peripheral portion, at least a portion of the output pattern may be formed on a surface of the protrusion, and a terminal portion of the substrate may face an output pattern formed on the surface of the protrusion.
  • the protrusion may be formed to face another portion of the housing and at least a portion of the substrate.
  • the output pattern and the terminal portion of the substrate may be connected via a contact member coupled to the substrate.
  • the conductive pattern is an antenna pattern, and the extension pattern may be coupled to a surface of the housing.
  • the housing includes an input/output terminal exposed to the outside, and the extension pattern may be electrically connected to the input/output terminal.
  • an electronic device in which a housing is formed by a 3D printing method is an electronic device worn on a smartphone or a wrist by forming an output portion of the housing and an output pattern of the conductive pattern portion together by a 3D printing method.
  • a 3D printing method As described above, it is possible to more easily manufacture a housing and a conductive pattern provided with a narrow inner space.
  • FIG. 1 to 2 are diagrams for explaining an example of an electronic device according to the present invention
  • FIG. 3 is a diagram illustrating a first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention. It is also for.
  • FIG 4 is a view for explaining a second embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention.
  • FIG 5 is a view for explaining a third embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • 6 and 7 are diagrams for explaining an example of a method of manufacturing the first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • FIGS. 8 to 10 are diagrams for explaining an example of a method of manufacturing the second embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • FIG. 1 to 2 are diagrams for explaining an example of an electronic device according to the present invention
  • FIG. 3 is a diagram illustrating a first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention. It is also for.
  • the electronic device may include a housing 100, a conductive pattern part 200, and a substrate 300.
  • the housing 100 is a part corresponding to a case of an electronic device, may be formed of an insulating material, and may include an output part formed by a 3D printing method.
  • the insulating material of the housing 100 may be made of an insulating material such as synthetic resin, plastic, synthetic rubber, or silicone.
  • the housing 100 may have an internal space to protect various constituent parts of an electronic device provided therein from the outside.
  • the housing 100 is formed in a first portion (100a) formed in a first direction (x), a second direction (y) intersecting the first direction (x), the second and third portions spaced apart from each other (100b, 100c) and the second and third portions (100b, 100c) protruding from any one of the portion, and spaced apart from the first portion (100a) and formed in the first direction (x) may include a projection (100d), ,
  • the inner space may be formed by the first, second, and third portions 100a, 100b, and 100c.
  • the protrusion 100d may be formed to face another portion of the housing 100 (eg, the first portion 100a) with at least a portion of the substrate 300 therebetween.
  • the housing 100 may be formed by a 3D printing method or an injection molding method.
  • the entire housing 100 may be formed by a 3D printing method, and some of the housing 100 may be formed by an injection molding method, and some of the housing 100 may be formed by a 3D printing method.
  • the housing 100 according to the first embodiment of the present invention all of the first, second, and third parts 100a, 100b, and 100c and the protrusion 100d are formed by a 3D printing method. It can be formed as an output part.
  • the conductive pattern part 200 may be located on the surface of the housing 100, is formed of a conductive material such as gold, silver, copper, or aluminum, and has an antenna pattern to perform a function as an antenna for transmitting and receiving signals, or Or, the surface of the housing 100 may perform a function as an electrical pattern performing other functions.
  • the conductive pattern part 200 is an example of the surface of the housing 100, which may be located on the inner space side, and is located in the inner space of the housing 100, and is a substrate on which a communication chip 310 or various integrated circuit chips are mounted. It can be connected to 300.
  • the conductive pattern part 200 may include an output pattern 210 and an extension pattern 220.
  • the output pattern 210 may be coupled to the surface of the output portion of the housing 100, and the extended pattern 220 may be formed by being connected to the output pattern 210.
  • the output pattern 210 may be formed together when the output portion is formed in the housing 100 by the 3D printing method.
  • the output pattern 210 includes a portion formed on a portion of the inner surface of the first portion 100a of the housing 100, a portion formed on the inner surface of the second portion 100b of the housing 100, and a protrusion ( It may include a portion formed on the surface of 100d).
  • At least a portion of the output pattern 210 may be formed on the surface of the protrusion 100d and may be electrically connected to the terminal portion of the substrate 300.
  • the extension pattern 220 is electrically connected to the end of the output pattern 210 and may be located in the inner space of the housing 100.
  • the extension pattern 220 is a flexible circuit board (FPCB) formed of an electrode layer 222 and a base film 221 on the surface of the housing 100 to be electrically connected to the output pattern 210.
  • Flexible Printed Circuit Board may be attached or formed as a plating layer on the surface of the housing 100 by laser direct structuring (LDS).
  • LDS laser direct structuring
  • the extension pattern 220 may also be formed by an injection molding process.
  • the substrate 300 is accommodated in the inner space of the housing 100 and may be located in an inner space formed by the first, second, and third portions 100a, 100b, and 100c of the housing 100, and the communication chip ( 310) Or various integrated circuit chips may be mounted.
  • At least a portion of the substrate 300 may be located between the protrusion 100d and the first portion 100a of the housing 100, and the terminal portion of the substrate 300 is formed on the output pattern 210 formed on the protrusion 100d. Can be electrically connected.
  • the communication chip mounted on the substrate 300 may be electrically connected to a terminal portion of the substrate 300 through an electrode line, and the terminal portion of the substrate 300 is an output pattern 210 via the contact member 40. ) Can be electrically connected.
  • the contact member 40 may have a C-clip structure, as shown in FIG. 2, or, alternatively, may have a pogo pin structure.
  • FIG 4 is a view for explaining a second embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention.
  • the housing 100 according to the second embodiment of the present invention may include an output portion formed by a 3D printing method and an injection portion formed by injection molding.
  • the injection portion may be combined with the output portion, and the output portion may be formed by being laminated on a surface of a portion of the injection portion.
  • the first, second, and third parts 100a, 100b, and 100c of the housing 100 may be formed as an injection part, and the protrusion 100d of the housing 100 is the housing 100 by a 3D printing method. It may be stacked on the second portion 100b and formed as an output portion.
  • a plurality of unevenness P may be formed in a part where the output part and the injection part are coupled to each other.
  • the conductive pattern part 200 may include an output pattern 210 and an extension pattern 220, and at least a part or all of the extension pattern 220 may be formed by injection molding, and may be coupled to an injection part. .
  • the output pattern 210 may be formed by being laminated on a part of the conductive pattern part 200 formed by injection molding by a 3D printing method.
  • first, second, and third parts 100a, 100b, and 100c of the housing 100 are formed as injection parts, and when forming the protrusion 100d, which is the injection part, FIG. 3
  • a part of the first part 100a and the conductive pattern part 200 positioned on the surface of the second part 100b of the housing 100 are formed as the output pattern 210, and the extension pattern 220 is formed in the housing ( It is also possible to form a flexible circuit board attached to the first portion 100a of 100).
  • FIG 5 is a view for explaining a third embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • all of the first, second, and third portions 100a, 100b, and 100c and the protrusion 100d of the housing 100 are It may be formed as an output portion formed by a 3D printing method, and may further include an input/output terminal 130 through which the housing 100 is exposed to the outside.
  • the input/output terminal 130 exposed to the outside may be provided in the third part 100c of the housing 100 through the third part 100c.
  • the conductive pattern unit 200 may include an output pattern 210 and an extended pattern 220, and the extended pattern 220 may be electrically connected to the input/output terminal 130.
  • the extension pattern 220 may be formed to extend to the surface of the third portion 100c of the housing 100 by attaching the flexible circuit board, and the extension pattern 220 may be connected to the input/output terminal 130 in the third portion 100c. ) And can be electrically connected.
  • 6 and 7 are diagrams for explaining an example of a method of manufacturing the first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • an example of a manufacturing method according to the present invention may include a 3D printing step (S11), an extension pattern 220 forming step (S12), and a circuit board 300 connection step (S13). .
  • the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 may be formed by a 3D printing method.
  • the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 may be formed together with the same 3D printing process. .
  • the output part and the output pattern 210 are formed regardless of the order. It can be formed while laminating together by a 3D printing method.
  • the extension pattern 220 electrically connected to the output pattern 210 in the step of forming the extension pattern 220 (S12 ). ) May be formed on the surface of the housing 100.
  • a flexible circuit board is attached to the end of the output pattern 210 to form the extension pattern 220 of the conductive pattern part 200. can do.
  • the flexible circuit board When attaching the flexible circuit board to the end of the output pattern 210, it may be attached using an electrically conductive adhesive (ECA) or anisotropic conductive adhesives (ACAs).
  • ECA electrically conductive adhesive
  • ACAs anisotropic conductive adhesives
  • the terminal part of the circuit board 300 may be connected to the output pattern 210 formed on the protrusion 100d that is an output part of the housing 100.
  • FIGS. 8 to 10 are diagrams for explaining an example of a method of manufacturing the second embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • another example of the manufacturing method according to the present invention may include an injection process step (S21), a 3D printing step (S22), and a circuit board 300 connection step (S23).
  • the first, second, and third portions 100a, 100b, and 100c of the housing 100 may be formed by injection molding.
  • the protrusion 100d of the housing 100 is stacked on a part of the second part 100b of the housing 100 to obtain the output part. It may be formed and formed by stacking the output pattern 210 together with the protrusion 100d.
  • the terminal portion of the circuit board 300 may be connected to the output pattern 210 formed on the protrusion 100d that is an output portion of the housing 100.
  • the electronic device and manufacturing method to which the housing of the present invention is applied can be applied to a very miniaturized electronic device, and the structure of the housing is a part corresponding to an undercut structure requiring high cost or a difficult process for injection molding. Even when necessary, the 3D printing method can be applied together to simplify the manufacturing process and reduce the manufacturing cost.
  • a conductive pattern can be easily formed by a 3D printing method, so that a narrow internal space of the housing can be efficiently used.
  • each technical feature is mainly described, but as long as the respective technical features are not compatible with each other, they may be merged and applied with each other.

Abstract

The present invention relates to an electronic device having a housing formed by a 3D printing method. An electronic device according to an embodiment of the present invention may comprise: a housing that is formed of an insulating material and includes an output part formed by a 3D printing method; and a conductive pattern part that includes an output pattern coupled to the surface of the housing and coupled to the output part, and an extension pattern connected to the output pattern, wherein the output pattern can be formed together with the output part by the 3D printing method.

Description

3D 프린팅 방법에 의해 하우징이 형성되는 전자 장치Electronic device in which housing is formed by 3D printing method
본 발명은 3D 프린팅 방법에 의해 하우징이 형성되는 전자 장치에 관한 것이다.The present invention relates to an electronic device in which a housing is formed by a 3D printing method.
사출성형 공정은 금형에 플라스틱 수지 등을 주입하여 원하는 형상의 구조물을 형성하는 성형가공법이다. 사출성형 공정은 사출 성형을 위한 금형을 제작하는데 높은 비용이 소요되지만, 한 번 금형을 제작하면 여러 번 반복해서 사출하는 것이 가능하여 개당 제조 단가가 낮고 작업능률이 높아 대량생산에 주로 사용된다.The injection molding process is a molding process in which a plastic resin is injected into a mold to form a structure having a desired shape. The injection molding process requires a high cost to manufacture a mold for injection molding, but once the mold is made, it is possible to repeatedly inject several times, so the manufacturing cost per piece is low and work efficiency is high, so it is mainly used for mass production.
그러나 최근의 몇몇 제품들은 다품종이면서 소량생산을 요구하는 경우가 있다. 이와 같이 소형생산을 하는 경우, 사출성형 공정은 초기 금형의 제작 비용이 높아 개당 제조 단가가 높아지게 되는 문제점이 발생한다. 또한, 금형을 제작하는 것에는 상당한 시간이 소요되는데 이러한 제품들은 주로 빠른 개발과 수정이 요구되는 경우가 많아 사출성형 공정을 사용하는 것에는 문제가 발생할 수 있다.However, some of the recent products are multi-species and require a small amount of production. In the case of small-sized production as described above, the injection molding process has a problem in that the manufacturing cost per unit is increased due to the high initial mold manufacturing cost. In addition, it takes a considerable amount of time to manufacture the mold, and these products often require rapid development and modification, so using the injection molding process may cause problems.
특히 최근의 스마트 전자기기, 웨어러블 전자기기, 헬스케어 제품 등을 비롯한 제품들은 외관의 미감을 증대시키기 위해 정교하면서도 복잡한 형태의 구조로 설계되는 경우가 많다. 이러한 구조의 구조물은 필연적으로 복잡한 형태의 언더컷 구조를 가지고 있고, 이를 사출성형 공정으로 제조하기 위해서는 고가의 분할 금형을 제작해야 한다. 이는 상술한 단가 상승 및 개발 기간 증가 등의 문제를 더욱 심각하게 야기한다.In particular, products including recent smart electronic devices, wearable electronic devices, and healthcare products are often designed in sophisticated and complex structures to enhance the aesthetic appearance. The structure of this structure inevitably has a complicated undercut structure, and in order to manufacture it by an injection molding process, an expensive split mold must be manufactured. This causes more serious problems such as an increase in the above-described unit price and an increase in the development period.
더욱이, 전자 장치가 손목에 착용되는 경우, 전자 장치의 두께가 매우 얇아, 기판이 위치할 내부 공간이 매우 협소하고, 전자 장치가 소형화 됨에 따라, 통신을 하기 위해 필요한 안테나 공간이 매우 비좁아, 안테나를 형성하는데, 문제가 발생하고 있다.Moreover, when the electronic device is worn on the wrist, the thickness of the electronic device is very thin, so that the internal space in which the substrate is located is very narrow, and as the electronic device is miniaturized, the antenna space required for communication is very narrow. To form, a problem is occurring.
이러한 문제를 해결하고자 최근에는 3D 프린터를 이용하여 구조물을 즉시 출력하는 기술이 도입되고 있다. In order to solve this problem, a technology for immediately printing a structure using a 3D printer has recently been introduced.
본 발명은 3D 프린팅 방법에 의해 하우징이 형성되는 전자 장치를 제공하는데, 그 목적이 있다.An object of the present invention is to provide an electronic device in which a housing is formed by a 3D printing method.
본 발명의 일례에 따른 전자 장치는 절연성 재질로 형성되고, 3D 프린팅 방법에 의해 형성되는 출력 부분을 포함하는 하우징; 및 상기 하우징의 표면에 결합되고 상기 출력 부분에 결합되는 출력 패턴 및 상기 출력 패턴과 연결되는 연장 패턴을 포함하는 도전성 패턴부를 포함하고, 상기 출력 패턴은 상기 출력 부분과 3D 프린팅 방법에 의해 함께 형성될 수 있다.An electronic device according to an exemplary embodiment of the present invention includes: a housing formed of an insulating material and including an output portion formed by a 3D printing method; And an output pattern coupled to the surface of the housing and coupled to the output portion and an extension pattern connected to the output pattern, wherein the output pattern is formed together with the output portion by a 3D printing method. I can.
상기 연장 패턴은 상기 하우징의 표면에 결합된 연성회로기판 또는 도금층으로 형성될 수 있다.The extension pattern may be formed of a flexible circuit board or a plating layer coupled to the surface of the housing.
상기 하우징은 상기 출력 부분과 결합되고, 사출 성형에 의해 형성되는 사출 부분을 더 포함할 수 있고, 상기 연장 패턴의 적어도 일부는 상기 사출 부분에 결합될 수 있다.The housing may be coupled to the output portion and further include an injection portion formed by injection molding, and at least a portion of the extension pattern may be coupled to the injection portion.
상기 출력 부분은 상기 사출 부분의 일부의 표면에 적층되어 형성될 수 있다.The output portion may be formed by being laminated on a surface of a portion of the injection portion.
상기 하우징의 내부 공간에 수용되는 기판을 더 포함하고, 상기 출력 패턴은 상기 기판의 단자부와 전기적으로 연결될 수 있다.A substrate accommodated in the inner space of the housing may be further included, and the output pattern may be electrically connected to a terminal portion of the substrate.
상기 출력 부분은 주변 부분에서 돌출되는 돌출부를 포함하고, 상기 출력 패턴의 적어도 일부는 상기 돌출부의 표면에 형성되고, 상기 기판의 단자부는 상기 돌출부의 표면에 형성된 출력 패턴과 대향할 수 있다.The output portion may include a protrusion protruding from a peripheral portion, at least a portion of the output pattern may be formed on a surface of the protrusion, and a terminal portion of the substrate may face an output pattern formed on the surface of the protrusion.
상기 돌출부는 상기 하우징의 다른 부분과 상기 기판의 적어도 일부를 사이에 두고 대향되게 형성될 수 있다.The protrusion may be formed to face another portion of the housing and at least a portion of the substrate.
상기 출력 패턴과 상기 기판의 단자부는 상기 기판에 결합된 컨택 부재를 매개로 연결될 수 있다.The output pattern and the terminal portion of the substrate may be connected via a contact member coupled to the substrate.
상기 도전성 패턴은 안테나 패턴이고, 상기 연장 패턴은 상기 하우징의 표면에 결합될 수 있다.The conductive pattern is an antenna pattern, and the extension pattern may be coupled to a surface of the housing.
상기 하우징은 외부로 노출되는 입출력 단자를 포함하고, 상기 연장 패턴은 상기 입출력 단자와 전기적으로 연결될 수 있다.The housing includes an input/output terminal exposed to the outside, and the extension pattern may be electrically connected to the input/output terminal.
본 발명의 일 실시예에 따라, 3D 프린팅 방법에 의해 하우징이 형성되는 전자 장치는 하우징의 출력 부분과 도전성 패턴부의 출력 패턴을 3D 프린팅 방법에 의해 함께 형성하여, 스마트폰이나 손목에 착용하는 전자 장치와 같이 내부 공간이 협소하게 구비되는 하우징과 도전성 패턴을 보다 용이하게 제조할 수 있다.According to an embodiment of the present invention, an electronic device in which a housing is formed by a 3D printing method is an electronic device worn on a smartphone or a wrist by forming an output portion of the housing and an output pattern of the conductive pattern portion together by a 3D printing method. As described above, it is possible to more easily manufacture a housing and a conductive pattern provided with a narrow inner space.
도 1 내지 도 2는 본 발명에 따른 전자 장치의 일례를 설명하기 위한 도이고, 도 3은 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제1 실시예를 설명하기 위한 도이다.1 to 2 are diagrams for explaining an example of an electronic device according to the present invention, and FIG. 3 is a diagram illustrating a first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention. It is also for.
도 4는 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제2실시예를 설명하기 위한 도이다.4 is a view for explaining a second embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention.
도 5는 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제3 실시예를 설명하기 위한 도이다.5 is a view for explaining a third embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
도 6 및 도 7은 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제1 실시예를 제조하는 방법의 일례를 설명하기 위한 도이다.6 and 7 are diagrams for explaining an example of a method of manufacturing the first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
도 8 내지 도 10은 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제2 실시예를 제조하는 방법의 일례를 설명하기 위한 도이다.8 to 10 are diagrams for explaining an example of a method of manufacturing the second embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명을 설명하는데 있어서, 해당 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, when it is determined that adding a detailed description of a technology or configuration already known in the relevant field may obscure the subject matter of the present invention, some of these will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express embodiments of the present invention, which may vary according to related people or customs in the field. Therefore, definitions of these terms should be made based on the contents throughout the present specification.
여기서 사용되는 전문용어는 단지 특정 실시예를 언급하기 위한 것이며, 본 발명을 한정하는 것을 의도하지 않는다. 여기서 사용되는 단수 형태들은 문구들이 이와 명백히 반대의 의미를 나타내지 않는 한 복수 형태들도 포함한다. 명세서에서 사용되는 ‘포함하는’의 의미는 특정 특성, 영역, 정수, 단계, 동작, 요소 및/또는 성분을 구체화하며, 다른 특정 특성, 영역, 정수, 단계, 동작, 요소, 성분 및/또는 군의 존재나 부가를 제외시키는 것은 아니다.The terminology used herein is for reference only to specific embodiments and is not intended to limit the present invention. Singular forms as used herein also include plural forms unless the phrases clearly indicate the opposite. The meaning of'comprising' as used in the specification specifies a specific characteristic, region, integer, step, action, element and/or component, and other specific characteristic, region, integer, step, action, element, component and/or group It does not exclude the existence or addition of
이하, 첨부된 도면들을 참조하여 본 발명에 따른 전자 장치에 대해서 설명하도록 한다.Hereinafter, an electronic device according to the present invention will be described with reference to the accompanying drawings.
도 1 내지 도 2는 본 발명에 따른 전자 장치의 일례를 설명하기 위한 도이고, 도 3은 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제1 실시예를 설명하기 위한 도이다.1 to 2 are diagrams for explaining an example of an electronic device according to the present invention, and FIG. 3 is a diagram illustrating a first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention. It is also for.
도 1에 도시된 바와 같이, 본 발명의 제1 실시예에 따른 전자 장치는 하우징(100), 도전성 패턴부(200) 및 기판(300)을 포함할 수 있다.As shown in FIG. 1, the electronic device according to the first embodiment of the present invention may include a housing 100, a conductive pattern part 200, and a substrate 300.
하우징(100)은 전자 장치의 케이스에 해당되는 부분으로, 절연성 재질로 형성될 수 있으며, 3D 프린팅 방법에 의해 형성되는 출력 부분을 포함할 수 있다.The housing 100 is a part corresponding to a case of an electronic device, may be formed of an insulating material, and may include an output part formed by a 3D printing method.
하우징(100)의 절연성 재료는 합성 수지, 플라스틱, 합성 고무, 실리콘 등 절연성 재질의 재료라면 적용될 수 있다.The insulating material of the housing 100 may be made of an insulating material such as synthetic resin, plastic, synthetic rubber, or silicone.
하우징(100)은 내부에 구비되는 전자 장치의 여러 가지 구성 부분을 외부로부터 보호하기 위하여, 내부 공간을 구비할 수 있다. 이를 위해, 하우징(100)은 제1 방향(x)으로 형성된 제1 부분(100a), 제1 방향(x)과 교차하는 제2 방향(y)으로 형성되되, 서로 이격된 제2, 3 부분(100b, 100c) 및 제2, 3 부분(100b, 100c) 중 어느 한 부분으로부터 돌출되되 제1 부분(100a)과 이격되어 제1 방향(x)으로 형성되는 돌출부(100d)를 포함할 수 있고, 제1, 2, 3 부분(100a, 100b, 100c)에 의해 내부 공간을 형성할 수 있다.The housing 100 may have an internal space to protect various constituent parts of an electronic device provided therein from the outside. To this end, the housing 100 is formed in a first portion (100a) formed in a first direction (x), a second direction (y) intersecting the first direction (x), the second and third portions spaced apart from each other (100b, 100c) and the second and third portions (100b, 100c) protruding from any one of the portion, and spaced apart from the first portion (100a) and formed in the first direction (x) may include a projection (100d), , The inner space may be formed by the first, second, and third portions 100a, 100b, and 100c.
이와 같이, 돌출부(100d)는 기판(300)의 적어도 일부를 사이에 두고 하우징(100)의 다른 부분(일례로, 제1 부분(100a))과 대향되게 형성될 수 있다.As such, the protrusion 100d may be formed to face another portion of the housing 100 (eg, the first portion 100a) with at least a portion of the substrate 300 therebetween.
이와 같은, 하우징(100)은 3D 프린팅 방법이나 사출 성형 방법으로 형성될 수 있다. 예를 들어, 하우징(100) 전체가 3D 프린팅 방법으로 형성되는 것도 가능하고, 하우징(100) 전체 중에 일부는 사출 성형 방법으로, 나머지 일부는 3D 프린팅 방법으로 형성되는 것도 가능하다. 일례로, 도 3과 같이, 본 발명의 제1 실시예에 따른 하우징(100)은 제1, 2, 3 부분(100a, 100b, 100c) 및 돌출부(100d) 모두가 3D 프린팅 방법에 의해 형성되는 출력 부분으로 형성될 수 있다.As such, the housing 100 may be formed by a 3D printing method or an injection molding method. For example, the entire housing 100 may be formed by a 3D printing method, and some of the housing 100 may be formed by an injection molding method, and some of the housing 100 may be formed by a 3D printing method. For example, as shown in FIG. 3, in the housing 100 according to the first embodiment of the present invention, all of the first, second, and third parts 100a, 100b, and 100c and the protrusion 100d are formed by a 3D printing method. It can be formed as an output part.
도전성 패턴부(200)는 하우징(100)의 표면에 위치할 수 있으며, 금, 은, 구리 또는 알루미늄과 같은 도전성 재질로 형성되고, 안테나 패턴을 구비하여, 신호를 송수신 하는 안테나로서의 기능을 수행하거나, 또는 하우징(100)의 표면에서 다른 기능을 수행하는 전기적 패턴으로서의 기능을 수행할 수 있다.The conductive pattern part 200 may be located on the surface of the housing 100, is formed of a conductive material such as gold, silver, copper, or aluminum, and has an antenna pattern to perform a function as an antenna for transmitting and receiving signals, or Or, the surface of the housing 100 may perform a function as an electrical pattern performing other functions.
도전성 패턴부(200)는 하우징(100)의 표면 중 일례로, 내부 공간 쪽에 위치할 수 있고, 하우징(100)의 내부 공간에 위치하여, 통신칩(310) 또는 각종 집적 회로 칩이 실장되는 기판(300)과 연결될 수 있다.The conductive pattern part 200 is an example of the surface of the housing 100, which may be located on the inner space side, and is located in the inner space of the housing 100, and is a substrate on which a communication chip 310 or various integrated circuit chips are mounted. It can be connected to 300.
이와 같은 도전성 패턴부(200)는 출력 패턴(210)과 연장 패턴(220)을 포함할 수 있다.The conductive pattern part 200 may include an output pattern 210 and an extension pattern 220.
출력 패턴(210)은 하우징(100)의 출력 부분 표면에 결합되고, 연장 패턴(220)은 출력 패턴(210)에 연결되어 형성될 수 있다. 일례로, 출력 패턴(210)은 하우징(100)에서 3D 프린팅 방법으로 출력 부분이 형성될 때, 함께 형성될 수 있다.The output pattern 210 may be coupled to the surface of the output portion of the housing 100, and the extended pattern 220 may be formed by being connected to the output pattern 210. As an example, the output pattern 210 may be formed together when the output portion is formed in the housing 100 by the 3D printing method.
여기서, 출력 패턴(210)은 하우징(100)의 제1 부분(100a)의 내측면 일부에 형성되는 부분과, 하우징(100)의 제2 부분(100b)의 내측면에 형성되는 부분 및 돌출부(100d)의 표면에 형성되는 부분을 포함할 수 있다.Here, the output pattern 210 includes a portion formed on a portion of the inner surface of the first portion 100a of the housing 100, a portion formed on the inner surface of the second portion 100b of the housing 100, and a protrusion ( It may include a portion formed on the surface of 100d).
이와 같은 출력 패턴(210)의 적어도 일부는 돌출부(100d)의 표면에 형성되어, 기판(300)의 단자부와 전기적으로 연결될 수 있다.At least a portion of the output pattern 210 may be formed on the surface of the protrusion 100d and may be electrically connected to the terminal portion of the substrate 300.
연장 패턴(220)은 출력 패턴(210)의 끝단에 전기적으로 연결되어, 하우징(100)의 내부 공간에 위치할 수 있다. The extension pattern 220 is electrically connected to the end of the output pattern 210 and may be located in the inner space of the housing 100.
연장 패턴(220)은 도 3에 도시된 바와 같이, 출력 패턴(210)과 전기적으로 연결되도록 하우징(100)의 표면에 전극층(222)과 베이스 필름(221)으로 형성되는 연성회로기판(FPCB, Flexible Printed Circuit Board)을 부착하여 형성하거나 레이저 조사 방식(LDS, Laser direct structuring)에 의해 하우징(100)의 표면에 도금층으로 형성될 수 있다. 또한, 하우징(100)의 일부가 사출 성형으로 형성될 때, 연장 패턴(220)도 함께 사출 성형 공정으로 형성되는 것도 가능하다.As shown in FIG. 3, the extension pattern 220 is a flexible circuit board (FPCB) formed of an electrode layer 222 and a base film 221 on the surface of the housing 100 to be electrically connected to the output pattern 210. Flexible Printed Circuit Board) may be attached or formed as a plating layer on the surface of the housing 100 by laser direct structuring (LDS). In addition, when a part of the housing 100 is formed by injection molding, the extension pattern 220 may also be formed by an injection molding process.
기판(300)은 하우징(100)의 내부 공간에 수용되어, 하우징(100)의 제1, 2, 3 부분(100a, 100b, 100c)에 의해 형성되는 내부 공간에 위치할 수 있으며, 통신칩(310) 또는 각종 집적 회로 칩이 실장될 수 있다.The substrate 300 is accommodated in the inner space of the housing 100 and may be located in an inner space formed by the first, second, and third portions 100a, 100b, and 100c of the housing 100, and the communication chip ( 310) Or various integrated circuit chips may be mounted.
기판(300)의 적어도 일부는 하우징(100)의 돌출부(100d)와 제1 부분(100a) 사이에 위치할 수 있으며, 돌출부(100d)에 형성된 출력 패턴(210)에 기판(300)의 단자부가 전기적으로 연결될 수 있다.At least a portion of the substrate 300 may be located between the protrusion 100d and the first portion 100a of the housing 100, and the terminal portion of the substrate 300 is formed on the output pattern 210 formed on the protrusion 100d. Can be electrically connected.
보다 구체적으로, 기판(300)에 실장된 통신 칩은 전극 라인을 통해 기판(300)의 단자부에 전기적으로 연결될 수 있으며, 기판(300)의 단자부는 컨택 부재(40)를 매개로 출력 패턴(210)에 전기적으로 연결될 수 있다.More specifically, the communication chip mounted on the substrate 300 may be electrically connected to a terminal portion of the substrate 300 through an electrode line, and the terminal portion of the substrate 300 is an output pattern 210 via the contact member 40. ) Can be electrically connected.
여기서, 컨택 부재(40)는 도 2에 도시된 바와 같이, C-clip 구조를 가지거나, 또는 이와 다르게, pogo pin 구조를 가지고 형성될 수 있다.Here, the contact member 40 may have a C-clip structure, as shown in FIG. 2, or, alternatively, may have a pogo pin structure.
이와 같은 본 발명의 전자 장치는 적어도 출력 패턴(210)과 출력 부분이 3D 프린팅 방법에 의해 함께 형성되므로, 도전성 패턴부(200)이 표면에 구비된 하우징(100)을 보다 용이하게 제조할 수 있다.In such an electronic device of the present invention, since at least the output pattern 210 and the output portion are formed together by a 3D printing method, it is possible to more easily manufacture the housing 100 in which the conductive pattern portion 200 is provided on the surface. .
도 4는 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제2실시예를 설명하기 위한 도이다.4 is a view for explaining a second embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention.
본 발명의 제2 실시예에 따른 하우징(100)은 3D 프린팅 방법에 의해 형성되는 출력 부분과 사출 성형에 의해 형성되는 사출 부분을 포함할 수 있다. 여기서, 사출 부분은 출력 부분과 결합될 수 있으며, 출력 부분은 사출 부분의 일부의 표면에 적층되어 형성될 수 있다.The housing 100 according to the second embodiment of the present invention may include an output portion formed by a 3D printing method and an injection portion formed by injection molding. Here, the injection portion may be combined with the output portion, and the output portion may be formed by being laminated on a surface of a portion of the injection portion.
일례로, 하우징(100)의 제1, 2, 3 부분(100a, 100b, 100c)은 사출 부분으로 형성될 수 있으며, 하우징(100)의 돌출부(100d)는 3D 프린팅 방법에 의해 하우징(100)의 제2 부분(100b)에 적층되어 출력 부분으로 형성될 수 있다.As an example, the first, second, and third parts 100a, 100b, and 100c of the housing 100 may be formed as an injection part, and the protrusion 100d of the housing 100 is the housing 100 by a 3D printing method. It may be stacked on the second portion 100b and formed as an output portion.
이때, 출력 부분과 사출 부분의 결합력을 높이기 위해, 출력 부분과 사출 부분이 서로 결합되는 부분은 복수의 요철(P)이 형성될 수 있다.At this time, in order to increase the bonding force between the output part and the injection part, a plurality of unevenness P may be formed in a part where the output part and the injection part are coupled to each other.
도전성 패턴부(200)은 출력 패턴(210)과 연장 패턴(220)을 포함할 수 있으며, 연장 패턴(220)의 적어도 일부 또는 전부가 사출 성형으로 형성될 수 있으며, 사출 부분에 결합될 수 있다. 출력 패턴(210)은 사출 성형으로 형성된 도전성 패턴부(200)의 일부에 3D 프린팅 방법에 의해 적층되어 형성될 수 있다.The conductive pattern part 200 may include an output pattern 210 and an extension pattern 220, and at least a part or all of the extension pattern 220 may be formed by injection molding, and may be coupled to an injection part. . The output pattern 210 may be formed by being laminated on a part of the conductive pattern part 200 formed by injection molding by a 3D printing method.
그러나, 제2 실시예의 변경예로, 하우징(100)의 제1, 2, 3 부분(100a, 100b, 100c)은 사출 부분으로 형성되고, 사출 부분인 돌출부(100d)를 형성할 때, 도 3과 같이 하우징(100)의 제1 부분(100a) 일부와 제2 부분(100b)의 표면에 위치하는 도전성 패턴부(200)을 출력 패턴(210)으로 형성하고, 연장 패턴(220)을 하우징(100)의 제1 부분(100a)에 연성회로기판을 부착하여 형성하는 것도 가능하다.However, as a modified example of the second embodiment, when the first, second, and third parts 100a, 100b, and 100c of the housing 100 are formed as injection parts, and when forming the protrusion 100d, which is the injection part, FIG. 3 As described above, a part of the first part 100a and the conductive pattern part 200 positioned on the surface of the second part 100b of the housing 100 are formed as the output pattern 210, and the extension pattern 220 is formed in the housing ( It is also possible to form a flexible circuit board attached to the first portion 100a of 100).
도 5는 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제3 실시예를 설명하기 위한 도이다.5 is a view for explaining a third embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제3 실시예에서는 하우징(100)의 제1, 2, 3 부분(100a, 100b, 100c)과 돌출부(100d) 모두가 3D 프린팅 방법에 의해 형성되는 출력 부분으로 형성될 수 있으며, 하우징(100)이 외부로 노출되는 입출력 단자(130)를 더 포함할 수 있다. 일례로, 하우징(100)의 제3 부분(100c)에는 외부로 노출되는 입출력 단자(130)가 제3 부분(100c)을 관통하여 구비될 수 있다.In the third embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention, all of the first, second, and third portions 100a, 100b, and 100c and the protrusion 100d of the housing 100 are It may be formed as an output portion formed by a 3D printing method, and may further include an input/output terminal 130 through which the housing 100 is exposed to the outside. For example, the input/output terminal 130 exposed to the outside may be provided in the third part 100c of the housing 100 through the third part 100c.
아울러, 도전성 패턴부(200)은 출력 패턴(210)과 연장 패턴(220)을 포함할 수 있으며, 연장 패턴(220)은 입출력 단자(130)와 전기적으로 연결될 수 있다. 연장 패턴(220)은 연성회로기판이 부착되어 하우징(100)의 제3 부분(100c)의 표면까지 연장되어 형성될 수 있으며, 제3 부분(100c)에서 연장 패턴(220)이 입출력 단자(130)와 전기적으로 연결될 수 있다.In addition, the conductive pattern unit 200 may include an output pattern 210 and an extended pattern 220, and the extended pattern 220 may be electrically connected to the input/output terminal 130. The extension pattern 220 may be formed to extend to the surface of the third portion 100c of the housing 100 by attaching the flexible circuit board, and the extension pattern 220 may be connected to the input/output terminal 130 in the third portion 100c. ) And can be electrically connected.
이하에서는 이와 같은 본 발명의 전자 장치 구조를 제조하는 방법에 대해 간략하게 설명한다.Hereinafter, a method of manufacturing the electronic device structure of the present invention will be briefly described.
도 6 및 도 7은 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제1 실시예를 제조하는 방법의 일례를 설명하기 위한 도이다.6 and 7 are diagrams for explaining an example of a method of manufacturing the first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
도 6에 도시된 바와 같이, 본 발명에 따른 제조 방법의 일례는 3D 프린팅 단계(S11), 연장 패턴(220) 형성 단계(S12) 및 회로 기판(300) 연결 단계(S13)를 포함할 수 있다.As shown in FIG. 6, an example of a manufacturing method according to the present invention may include a 3D printing step (S11), an extension pattern 220 forming step (S12), and a circuit board 300 connection step (S13). .
3D 프린팅 단계(S11)에서는 3D 프린팅 방법으로 하우징(100)의 출력 부분과 도전성 패턴부(200)의 출력 패턴(210)을 형성할 수 있다. 일례로, 도 7의 (a)와 같이, 3D 프린팅 단계(S11)에서는 동일한 3D 프린팅 공정으로 하우징(100)의 출력 부분과 도전성 패턴부(200)의 출력 패턴(210)을 함께 형성할 수 있다. In the 3D printing step S11, the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 may be formed by a 3D printing method. For example, as shown in (a) of FIG. 7, in the 3D printing step (S11), the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 may be formed together with the same 3D printing process. .
즉, 출력 부분에 해당되는 하우징(100)의 제1, 2, 3 부분(100a, 100b, 100c)과 출력 패턴(210)을 형성할 때, 순서에 상관없이 출력 부분과 출력 패턴(210)을 3D 프린팅 방법에 의해 함께 적층하면서 형성될 수 있다. That is, when forming the first, second, and third parts 100a, 100b, 100c and the output pattern 210 of the housing 100 corresponding to the output part, the output part and the output pattern 210 are formed regardless of the order. It can be formed while laminating together by a 3D printing method.
하우징(100)의 출력 부분과 도전성 패턴부(200)의 출력 패턴(210)이 모두 형성된 이후, 연장 패턴(220) 형성 단계(S12)에서는 출력 패턴(210)에 전기적으로 연결되는 연장 패턴(220)을 하우징(100)의 표면에 형성할 수 있다. After both the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 are formed, the extension pattern 220 electrically connected to the output pattern 210 in the step of forming the extension pattern 220 (S12 ). ) May be formed on the surface of the housing 100.
즉, 도 7의 (b)와 같이, 연장 패턴(220) 형성 단계(S12)에서는 출력 패턴(210)의 끝단에 연성회로기판을 부착하여 도전성 패턴부(200)의 연장 패턴(220)을 형성할 수 있다.That is, as shown in (b) of FIG. 7, in the step of forming the extension pattern 220 (S12 ), a flexible circuit board is attached to the end of the output pattern 210 to form the extension pattern 220 of the conductive pattern part 200. can do.
연성회로기판을 출력 패턴(210)의 끝단에 부착할 때에는 도전성 접착제(Electrically Conductive Adhesive, ECA) 또는 이방성 도전성 접착제(Anisotropic Conductive Adhesives, ACAs)를 이용하여 부착할 수 있다.When attaching the flexible circuit board to the end of the output pattern 210, it may be attached using an electrically conductive adhesive (ECA) or anisotropic conductive adhesives (ACAs).
회로 기판(300) 연결 단계(S13)에서는 하우징(100)의 출력 부분인 돌출부(100d)에 형성된 출력 패턴(210)에 회로 기판(300)의 단자부를 연결할 수 있다.In the connection step S13 of the circuit board 300, the terminal part of the circuit board 300 may be connected to the output pattern 210 formed on the protrusion 100d that is an output part of the housing 100.
도 8 내지 도 10은 본 발명의 전자 장치에서 하우징(100)과 도전성 패턴부(200)에 대한 제2 실시예를 제조하는 방법의 일례를 설명하기 위한 도이다.8 to 10 are diagrams for explaining an example of a method of manufacturing the second embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
도 8에 도시된 바와 같이, 본 발명에 따른 제조 방법의 다른 일례는 사출 공정 단계(S21), 3D 프린팅 단계(S22) 및 회로 기판(300) 연결 단계(S23)를 포함할 수 있다.As shown in FIG. 8, another example of the manufacturing method according to the present invention may include an injection process step (S21), a 3D printing step (S22), and a circuit board 300 connection step (S23).
사출 공정 단계(S21)에서는 도 9에 도시된 바와 같이, 하우징(100)의 제1, 2, 3 부분(100a, 100b, 100c)을 사출 성형으로 형성할 수 있다. 아울러, 이에 더불어, 도전성 패턴부(200)의 연장 패턴(220)도 사출 성형으로 형성하는 것도 가능하다. 그러나, 이와 다르게, 비용을 고려하여, 연장 패턴(220)을 사출 성형으로 형성하지 않고, 3D 프린팅 단계 이후 제조 방법의 일례와 같이, 연성회로기판을 부착하여 연장 패턴(220)을 형성하는 것도 가능하다.In the injection process step S21, as shown in FIG. 9, the first, second, and third portions 100a, 100b, and 100c of the housing 100 may be formed by injection molding. In addition, it is also possible to form the extension pattern 220 of the conductive pattern portion 200 by injection molding. However, differently, in consideration of cost, it is also possible to form the extension pattern 220 by attaching a flexible circuit board as an example of a manufacturing method after the 3D printing step without forming the extension pattern 220 by injection molding. Do.
이후, 도 10에 도시된 바와 같이, 3D 프린팅 단계(S22)에서는 하우징(100)의 제2 부분(100b)의 일부에 하우징(100)의 돌출부(100d)를 3D 프린팅 방법을 적층하여 출력 부분을 형성하고, 돌출부(100d)와 함께 출력 패턴(210)을 함께 적층하여 형성할 수 있다.Thereafter, as shown in FIG. 10, in the 3D printing step (S22), the protrusion 100d of the housing 100 is stacked on a part of the second part 100b of the housing 100 to obtain the output part. It may be formed and formed by stacking the output pattern 210 together with the protrusion 100d.
이후, 회로 기판(300) 연결 단계(S23)를 통하여, 하우징(100)의 출력 부분인 돌출부(100d)에 형성된 출력 패턴(210)에 회로 기판(300)의 단자부를 연결할 수 있다.Thereafter, through the connection step S23 of the circuit board 300, the terminal portion of the circuit board 300 may be connected to the output pattern 210 formed on the protrusion 100d that is an output portion of the housing 100.
이와 같이, 본 발명의 하우징이 적용되는 전자 장치 및 제조 방법은 매우 소형화된 전자 장치에 적용이 가능하고, 하우징의 구조가 사출 성형이 고비용이 요구되거나 까다로운 공정을 요구하는 언더컷 구조에 해당하는 부분을 필요로 하는 경우에도 3D 프린팅 방법을 함께 적용하여 제조 공정을 단순화하고, 제조 비용을 절감할 수 있다.As described above, the electronic device and manufacturing method to which the housing of the present invention is applied can be applied to a very miniaturized electronic device, and the structure of the housing is a part corresponding to an undercut structure requiring high cost or a difficult process for injection molding. Even when necessary, the 3D printing method can be applied together to simplify the manufacturing process and reduce the manufacturing cost.
또한, 본 발명은 하우징에서 언더컷 구조를 갖는 부분의 표면까지 도전성 패턴을 필요로 하는 경우에도, 3D 프린팅 방법으로 도전성 패턴을 용이하게 형성될 수 있어, 하우징의 협소한 내부 공간을 효율적으로 사용할 수 있다.In addition, in the present invention, even when a conductive pattern is required from the housing to the surface of a portion having an undercut structure, a conductive pattern can be easily formed by a 3D printing method, so that a narrow internal space of the housing can be efficiently used. .
본 발명의 각 실시예에 개시된 기술적 특징들은 해당 실시예에만 한정되는 것은 아니고, 서로 양립 불가능하지 않은 이상, 각 실시예에 개시된 기술적 특징들은 서로 다른 실시예에 병합되어 적용될 수 있다.The technical features disclosed in each embodiment of the present invention are not limited only to the corresponding embodiment, and unless compatible with each other, the technical features disclosed in each embodiment may be merged and applied to different embodiments.
따라서, 각 실시예에서는 각각의 기술적 특징을 위주로 설명하지만, 각 기술적 특징이 서로 양립 불가능하지 않은 이상, 서로 병합되어 적용될 수 있다.Accordingly, in each embodiment, each technical feature is mainly described, but as long as the respective technical features are not compatible with each other, they may be merged and applied with each other.
본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 청구범위뿐만 아니라 이 청구범위와 균등한 것들에 의해 정해져야 한다.The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and variations are possible from the perspective of those of ordinary skill in the field to which the present invention pertains. Therefore, the scope of the present invention should be defined by the claims of the present specification as well as those equivalents to the claims.

Claims (11)

  1. 절연성 재질로 형성되고, 3D 프린팅 방법에 의해 형성되는 출력 부분을 포함하는 하우징; 및A housing made of an insulating material and including an output portion formed by a 3D printing method; And
    상기 하우징의 표면에 결합되고 상기 출력 부분에 결합되는 출력 패턴 및 상기 출력 패턴과 연결되는 연장 패턴을 포함하는 도전성 패턴부를 포함하고,And a conductive pattern portion coupled to the surface of the housing and including an output pattern coupled to the output portion and an extension pattern coupled to the output pattern,
    상기 출력 패턴은 상기 출력 부분과 3D 프린팅 방법에 의해 함께 형성되는 전자 장치.The output pattern is formed together with the output portion by a 3D printing method.
  2. 제1 항에 있어서,The method of claim 1,
    상기 연장 패턴은 상기 하우징의 표면에 결합된 연성회로기판 또는 도금층으로 형성되는 전자 장치.The extended pattern is an electronic device formed of a flexible circuit board or a plating layer coupled to a surface of the housing.
  3. 제1 항에 있어서,The method of claim 1,
    상기 하우징은 상기 출력 부분과 결합되고, 사출 성형에 의해 형성되는 사출 부분을 더 포함하는 전자 장치.The housing is coupled to the output portion, the electronic device further comprising an injection portion formed by injection molding.
  4. 제3 항에 있어서,The method of claim 3,
    상기 연장 패턴의 적어도 일부는 상기 사출 부분에 결합되는 전자 장치.At least a portion of the extension pattern is coupled to the ejection portion.
  5. 제3 항에 있어서,The method of claim 3,
    상기 출력 부분은 상기 사출 부분의 일부의 표면에 적층되어 형성되는 전자 장치.The output portion is formed by being laminated on a surface of a portion of the injection portion.
  6. 제1 항에 있어서,The method of claim 1,
    상기 하우징의 내부 공간에 수용되는 기판을 더 포함하고,Further comprising a substrate accommodated in the inner space of the housing,
    상기 출력 패턴은 상기 기판의 단자부와 전기적으로 연결되는 전자 장치.The output pattern is an electronic device electrically connected to a terminal portion of the substrate.
  7. 제6 항에 있어서,The method of claim 6,
    상기 출력 부분은 주변 부분에서 돌출되는 돌출부를 포함하고,The output portion includes a protrusion protruding from the peripheral portion,
    상기 출력 패턴의 적어도 일부는 상기 돌출부의 표면에 형성되고,At least a portion of the output pattern is formed on the surface of the protrusion,
    상기 기판의 단자부는 상기 돌출부의 표면에 형성된 출력 패턴과 대향하는 전자 장치.An electronic device having a terminal portion of the substrate facing an output pattern formed on a surface of the protruding portion.
  8. 제7 항에 있어서,The method of claim 7,
    상기 돌출부는 상기 하우징의 다른 부분과 상기 기판의 적어도 일부를 사이에 두고 대향되게 형성되는 전자 장치.The protrusion is formed to face the other portion of the housing and at least a portion of the substrate.
  9. 제6 항에 있어서,The method of claim 6,
    상기 출력 패턴과 상기 기판의 단자부는 상기 기판에 결합된 컨택 부재를 매개로 연결되는 전자 장치.The electronic device is connected to the output pattern and the terminal portion of the substrate through a contact member coupled to the substrate.
  10. 제1 항에 있어서,The method of claim 1,
    상기 도전성 패턴은 안테나 패턴이고,The conductive pattern is an antenna pattern,
    상기 연장 패턴은 상기 하우징의 표면에 결합되는 전자 장치.The elongated pattern is an electronic device coupled to a surface of the housing.
  11. 제1 항에 있어서,The method of claim 1,
    상기 하우징은 외부로 노출되는 입출력 단자를 포함하고,The housing includes an input/output terminal exposed to the outside,
    상기 연장 패턴은 상기 입출력 단자와 전기적으로 연결되는 전자 장치.The extended pattern is an electronic device electrically connected to the input/output terminal.
PCT/KR2019/016265 2019-11-20 2019-11-25 Electronic device having housing formed by 3d printing method WO2021100945A1 (en)

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KR1020190149504A KR102293941B1 (en) 2019-11-20 2019-11-20 Electronic device in which housing is formed by 3D printing method
KR10-2019-0149504 2019-11-20

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WO2021100945A1 true WO2021100945A1 (en) 2021-05-27

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160023874A (en) * 2013-06-24 2016-03-03 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 Printed three-dimensional (3d) functional part and method of making
KR20160057284A (en) * 2014-11-13 2016-05-23 주식회사 에이치시티엠 Manufacturing method for antenna base and antenna radiator using 3d printing
KR20170071200A (en) * 2015-12-15 2017-06-23 삼성전자주식회사 Electronic Device with Antenna
KR20180117279A (en) * 2017-04-19 2018-10-29 주식회사 럭스로보 Module and module assembly comprising the same
KR20190016251A (en) * 2017-08-08 2019-02-18 삼성전자주식회사 Electronic device that reduces antenna interference and enhances antenna performance

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160023874A (en) * 2013-06-24 2016-03-03 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 Printed three-dimensional (3d) functional part and method of making
KR20160057284A (en) * 2014-11-13 2016-05-23 주식회사 에이치시티엠 Manufacturing method for antenna base and antenna radiator using 3d printing
KR20170071200A (en) * 2015-12-15 2017-06-23 삼성전자주식회사 Electronic Device with Antenna
KR20180117279A (en) * 2017-04-19 2018-10-29 주식회사 럭스로보 Module and module assembly comprising the same
KR20190016251A (en) * 2017-08-08 2019-02-18 삼성전자주식회사 Electronic device that reduces antenna interference and enhances antenna performance

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