WO2021082962A1 - 一种车载天线模块和车载通信终端 - Google Patents

一种车载天线模块和车载通信终端 Download PDF

Info

Publication number
WO2021082962A1
WO2021082962A1 PCT/CN2020/121838 CN2020121838W WO2021082962A1 WO 2021082962 A1 WO2021082962 A1 WO 2021082962A1 CN 2020121838 W CN2020121838 W CN 2020121838W WO 2021082962 A1 WO2021082962 A1 WO 2021082962A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
vehicle
heat
heat exchange
printed circuit
Prior art date
Application number
PCT/CN2020/121838
Other languages
English (en)
French (fr)
Inventor
曾祥锋
卢伟强
谢波
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20881880.7A priority Critical patent/EP4040594A4/en
Publication of WO2021082962A1 publication Critical patent/WO2021082962A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
    • H01Q1/3275—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Definitions

  • the present application relates to the technical field of heat dissipation of electronic components, and in particular to a vehicle-mounted antenna module and a vehicle-mounted communication terminal capable of reducing the operating temperature of a heating element in a high-temperature environment.
  • 5G 5th generation mobile networks
  • FIG 1 is a schematic diagram of a car with an antenna installed.
  • antennas and electrical components used to process antenna signals are usually installed on the roof of the car.
  • These electrical components include printed circuit boards (PCB) and printed circuit boards.
  • the crystal module (including various chips, etc.) on the circuit board for processing antenna signals. Since most cars are driven and parked outdoors, the roof of the car will be directly exposed to outdoor sunlight and have a higher temperature. When the temperature of the roof rises, the crystal module installed on the roof will experience abnormal phenomena such as overheating and frequency reduction.
  • the crystal module If the roof temperature reaches the threshold temperature of the crystal module (for example: the threshold temperature of the semiconductor chip is usually 105 °C), the crystal module will overheat and protect itself or even be damaged. Therefore, the crystal module installed on the roof must be effective In order to work stably.
  • the threshold temperature of the crystal module for example: the threshold temperature of the semiconductor chip is usually 105 °C
  • the heat dissipation of heating elements is mainly air-cooled, that is, a fan is installed on the heating element, and the fan is used to accelerate the air flow near the heating element, and take away the heat generated by the heating element for heat dissipation.
  • the air-cooled heat dissipation method cannot make the temperature of the heating element below the ambient temperature. The higher the ambient temperature, the higher the temperature of the heating element, and the worse the heat dissipation effect of the air-cooled heat dissipation method. Therefore, air-cooled heat dissipation cannot meet the heat dissipation requirements of the heating element when the roof temperature reaches or approaches the threshold temperature of the heating element.
  • the present application provides a vehicle-mounted antenna module and a vehicle-mounted communication terminal, which can reduce the temperature of a heating element when operating in a high-temperature environment.
  • the present application provides a vehicle-mounted antenna module, including: an antenna housing, a printed circuit board module, a heat exchange module, a soaking metal plate, and a heat sink;
  • the heat exchange module includes a cold side and a hot side, and the temperature of the cold side Below the temperature of the hot side, the heat exchange module is used to conduct heat from the cold side to the hot side;
  • the printed circuit board module includes a printed circuit board, an antenna and a crystal module mounted on the printed circuit board, and the printed circuit board module is attached to The cold side;
  • the soaking metal plate is attached to the hot side;
  • the heat sink is attached to the side of the soaking metal plate facing away from the heat exchange module;
  • the antenna housing is set on the side of the soaking metal plate facing the heat exchange module
  • the soaking metal plate and the antenna housing are provided with a mutually matched fixing structure, and the soaking metal plate and the antenna housing are fixedly connected by the fixing structure, and the printed circuit board module and the heat exchange module are enclosed in the antenna housing.
  • the technical solution provided by this application utilizes the heat exchange module's ability to conduct heat from the cold side to the hot side, bonding the cold side to the printed circuit board module, and bonding the hot side to the soaking metal plate to make the heat exchange module It can absorb the heat generated by the crystal module on the printed circuit board module on the cold side, cool the printed circuit board module, and transfer the absorbed heat to the soaking metal plate on the hot side.
  • the soaking metal plate and heat sink are used to The heat is dissipated into the environment.
  • the technical solution provided by this application can reduce the temperature of heating elements such as crystal modules when operating in a high-temperature environment, so that the temperature of the heating element can be lower than the ambient temperature, even if the ambient temperature rises to the threshold temperature of the heating element, the heating element Can run stably.
  • the crystal module is arranged on the side of the printed circuit board facing the heat exchange module; the cold side of the crystal module is attached and connected.
  • the heat exchange module can be directly attached to the crystal module, so that the heat exchange module can directly cool the crystal module.
  • the printed circuit board is attached to the cold side; the crystal module is arranged on the side of the printed circuit board facing away from the heat exchange module.
  • the heat exchange module can be attached to the printed circuit board, so that a heat exchange channel is established between the crystal module and the heat exchange module via the printed circuit board.
  • the heat exchange module can indirectly heat the crystal module and other heat by cooling the printed circuit board. The components are cooled.
  • the heat equalizing metal plate is recessed in a direction away from the heat exchange module to form a first groove; the heat exchange module is placed in the first groove, and the hot side surface is attached to the bottom of the first groove; the heat sink is moved away from The direction of the soaking metal plate is recessed to form a second groove matching the shape of the first groove; the first groove is embedded in the second groove, and the first groove is closely attached to the second groove.
  • the first groove and the second groove make the heat exchange module, the soaking metal plate and the radiator nested and connected to each other, and increase the contact area between the heat exchange module, the soaking metal plate and the radiator. It is beneficial to improve the heat transfer efficiency between the heat exchange module, the soaking metal plate and the radiator.
  • a heat-conducting medium is arranged between the heat exchange module and the crystal module, and the cold side surface is connected to the crystal module through the heat-conducting medium.
  • the heat-conducting medium can fill the gap between the heat exchange module and the crystal module, and improve the heat transfer efficiency between the cold side and the crystal module.
  • the antenna is arranged on the side of the printed circuit board facing away from the heat exchange module.
  • the antenna is directly exposed under the antenna housing, and there is no other obstruction between the antenna and the antenna housing, so that the signal strength of the antenna during communication with external devices will not be affected.
  • the heat exchange module is a thermoelectric cooler (TEC). Therefore, using the Peltier effect of the thermoelectric cooler, the cold side and the hot side can be formed by energizing the Peltier effect.
  • the temperature of the cold side can be much lower than the ambient temperature. Therefore, the cold side is used for heat generation
  • the cooling of the element can greatly reduce the temperature of the heating element.
  • thermoelectric cooler includes a plurality of thermocouple pairs, the thermocouple pairs are formed by connecting N-type semiconductors and P-type semiconductors; the plurality of thermocouple pairs are arranged between two ceramic electrodes; the thermocouple pairs are used in the When current passes, heat is transferred from the cold side to the hot side.
  • the heat sink is provided with a fin structure on the side facing away from the soaking metal plate; the fin structure includes a plurality of fins, which extend away from the soaking metal plate; and the plurality of fins are arranged side by side at intervals.
  • the fin structure can increase the heat dissipation area of the heat sink and improve the heat dissipation efficiency of the heat sink.
  • the present application provides a vehicle-mounted communication terminal, including: a terminal housing, a printed circuit board module, a heat transfer medium, and a heat exchange module; the terminal housing is arranged inside the metal housing of the vehicle, and the terminal housing is provided with a switch.
  • the opening faces the metal shell; the heat exchange module is arranged in the opening.
  • the heat exchange module includes a cold side and a hot side. The cold side faces the terminal shell and the hot side faces the metal shell.
  • the cold side has a low temperature
  • the heat exchange module is used to conduct heat from the cold side to the hot side
  • the printed circuit board module is arranged in the terminal housing, and the printed circuit board module includes a printed circuit board, an antenna mounted on the printed circuit board, and a crystal module ,
  • the printed circuit board module is attached to the cold side;
  • the heat transfer medium is arranged between the heat exchange module and the metal shell, and the hot side and the metal shell are attached and connected by the heat transfer medium.
  • the technical solution provided by this application utilizes the heat exchange module's ability to conduct heat from the cold side to the hot side.
  • the cold side is bonded to the printed circuit board module
  • the hot side is bonded to the metal shell of the vehicle
  • the metal shell is bonded.
  • the heat exchange module can absorb the heat generated by the crystal module on the printed circuit board module on the cold side, cool the printed circuit board module, and transfer the absorbed heat to the metal on the hot side Shell, through the metal shell to dissipate heat to the environment.
  • the technical solution provided by this application can reduce the temperature of heating elements such as crystal modules when operating in a high-temperature environment, so that the temperature of the heating element can be lower than the ambient temperature, even if the ambient temperature rises to the threshold temperature of the heating element, the heating element Can run stably.
  • the crystal module is arranged on the side of the printed circuit board facing the heat exchange module; the cold side of the crystal module is attached and connected.
  • the heat exchange module can be directly attached to the crystal module, so that the heat exchange module can directly cool the crystal module.
  • the printed circuit board is attached to the cold side; the crystal module is arranged on the side of the printed circuit board facing away from the heat exchange module.
  • the heat exchange module can be attached to the printed circuit board, so that a heat exchange channel is established between the crystal module and the heat exchange module via the printed circuit board.
  • the heat exchange module can indirectly heat the crystal module and other heat by cooling the printed circuit board. The components are cooled.
  • the heat exchange module is a thermoelectric cooler (TEC). Therefore, using the Peltier effect of the thermoelectric cooler, the cold side and the hot side can be formed by energizing the Peltier effect.
  • the temperature of the cold side can be much lower than the ambient temperature. Therefore, the cold side is used for heat generation
  • the cooling of the element can greatly reduce the temperature of the heating element.
  • thermoelectric cooler includes a plurality of thermocouple pairs, the thermocouple pairs are formed by connecting N-type semiconductors and P-type semiconductors; the plurality of thermocouple pairs are arranged between two ceramic electrodes; the thermocouple pairs are used in the When current passes, heat is transferred from the cold side to the hot side.
  • the present application provides a vehicle that includes the vehicle-mounted antenna module provided in the first aspect described above.
  • the roof shell of the vehicle is provided with a cavity for accommodating the on-board antenna module.
  • the on-board antenna module is arranged in the cavity, and the roof shell is also provided with a radome.
  • the radome is snap-fitted on the cavity to close the cavity. , So that the vehicle antenna module is hidden inside the roof shell, without affecting the appearance of the roof.
  • the present application provides a vehicle including the vehicle-mounted communication terminal provided in the second aspect described above.
  • the vehicle-mounted communication terminal is hidden and arranged on the inner side of the roof shell of the vehicle, and the vehicle-mounted communication terminal is connected to the external antenna of the vehicle through a cable or the like.
  • the external antenna may be a shark fin antenna at the rear of the vehicle roof.
  • the vehicle-mounted communication terminal establishes a communication connection with the mobile device through an external antenna to realize the vehicle information display and control of the mobile device APP.
  • Figure 1 is a schematic diagram of a car with an antenna installed
  • Figure 2 is a schematic diagram of the current air-cooled heat dissipation scheme
  • FIG 3 is an exploded view of the structure of the heat dissipation device provided by the first embodiment of the present application.
  • FIG. 4 is a schematic diagram of the structure of the soaking metal plate provided by the first embodiment of the present application.
  • FIG. 5 is a schematic diagram of the structure of the heat sink provided by the first embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of a heat exchange module provided by the first embodiment of the present application.
  • FIG. 7 is a cross-sectional view of the heat dissipation device provided by the first embodiment of the present application, taken along the line B;
  • FIG. 8 is a schematic diagram of a structure of the heat dissipation device applied to the heat dissipation of the printed circuit board module;
  • FIG. 9 is another schematic diagram of the structure of the heat dissipation device applied to the heat dissipation of the printed circuit board module
  • FIG. 10 is a schematic structural diagram of a vehicle-mounted antenna module provided by a fourth embodiment of the present application.
  • FIG. 11 is a cross-sectional view of the vehicle-mounted antenna module provided by the fourth embodiment of the present application, taken along the line B;
  • FIG. 12 is a schematic diagram of the installation of the vehicle antenna module on the roof of the vehicle provided by the fourth embodiment of the present application.
  • Figure 13 is a schematic diagram of a vehicle-mounted communication terminal communicating with a mobile device
  • FIG. 14 is a schematic structural diagram of a vehicle-mounted communication terminal provided by a fifth embodiment of the present application.
  • Fig. 15 is a flowchart of a temperature control method provided by a sixth embodiment of the present application.
  • Figure 2 is a schematic diagram of the current air-cooled heat dissipation scheme.
  • the current air-cooled heat dissipation solution includes a heat sink 011 and a fan 012.
  • the heat sink 011 is attached to the heating element 400 to absorb the heat generated by the heating element 400.
  • the fan 012 is arranged on the heat sink 011 and blows toward the heat sink 011 to speed up the air flow near the heating element 400 and take it away
  • the heat generated by the heating element 400 dissipates heat.
  • the air-cooled heat dissipation method cannot make the temperature of the heating element 400 below the ambient temperature, and the higher the ambient temperature, the higher the temperature of the heating element 400, and the worse the heat dissipation effect of the air-cooled heat dissipation method.
  • the air-cooled heat dissipation method cannot meet the heat dissipation requirement of the heating element 400.
  • the fan 012 generates noise during operation. If the fan 012 is installed on the roof of the car, it will also affect the riding experience of the passengers in the car.
  • the air-cooled heat dissipation method requires air to have good fluidity, and the roof space is relatively closed, which cannot meet the air-cooled heat dissipation requirements for air fluidity.
  • the roof space is relatively flat. If the fan 012 is to be placed on the roof, the thickness of the roof must be increased, which affects the beautiful appearance of the vehicle.
  • the present application provides a heat dissipation device, and a vehicle antenna module and a vehicle communication terminal including the vehicle heat dissipation device, which can reduce the temperature of the heating element 400 (for example, a crystal module such as a chip) below the ambient temperature.
  • the heating element 400 for example, a crystal module such as a chip
  • the first embodiment of the present application provides a heat dissipation device.
  • FIG. 3 is an exploded view of the structure of the heat dissipation device provided by the first embodiment of the present application.
  • the heat dissipation device includes: a heat exchange module 100, a heat equalizing metal plate 200 and a heat sink 300.
  • the heat exchange module 100, the heat equalizing metal plate 200 and the heat sink 300 are stacked along the A direction in FIG. 3, and the heat equalizing metal plate 200 is located between the heat exchange module 100 and the heat sink 300.
  • the heat exchange module 100 includes a cold side and a hot side.
  • the cold side is opposite to the hot side.
  • the heat exchange module 100 can transfer heat from the cold side to the hot side under external action (such as voltage, current, pressure, light, etc.) or spontaneously. Side conduction, so that the cold side has a lower temperature than the environment.
  • the hot side of the heat exchange module 100 is attached to one side of the soaking metal plate 200, and the heat sink 300 is attached to the other side of the soaking metal plate 200 corresponding to the heat exchange module 100.
  • the heat exchange module 100 and the soaking metal plate 200 can be filled with a thermally conductive medium, such as thermal grease or a thermal pad, to fill the gaps that may exist after the heat exchange module 100 and the soaking metal plate 200 are bonded, which is conducive to the heat transfer.
  • the exchange module 100 and the soaking metal plate 200 are transferred; the heat transfer medium can also be filled between the soaking metal plate 200 and the heat sink 300 to fill the gaps that may exist after the soaking metal plate 200 and the heat sink 300 are attached. This facilitates the transfer of heat between the heat equalizing metal plate 200 and the heat sink 300; the heat transfer path from the heat exchange module 100 to the heat equalizing metal plate 200 and then to the heat sink 300 is uninterrupted, and higher heat transfer efficiency is achieved.
  • FIG. 4 is a schematic diagram of the structure of the soaking metal plate 200 provided by the first embodiment of the present application.
  • the heat equalizing metal plate 200 is recessed in the A direction away from the heat exchange module 100 to form a first groove 210.
  • the size of the first groove 210 is greater than or equal to the size of the heat exchange module 100, so that the heat exchange module 100 It can be placed in the first groove 210.
  • the soaking metal plate 200 can be made of materials with excellent thermal conductivity, such as copper and aluminum.
  • the size of the soaking metal plate 200 is larger than the size of the heat exchange module 100, so that the soaking metal plate 200 can completely cover the heat exchange module 100, has a larger contact area with the heat exchange module 100, and fully absorbs the heat from the heat exchange module 100. Heat to improve the heat dissipation performance of the heat exchange module 100.
  • FIG. 5 is a schematic diagram of the structure of the heat sink 300 provided by the first embodiment of the present application.
  • the heat sink 300 is hollowed out on the side facing the heat equalizing metal plate 200 to form a second groove 320 that matches the shape of the first groove 210.
  • the first groove 210 of the heat equalizing metal plate 200 can be embedded in the second groove 320 of the heat sink 300, so that the first groove 210 and the second groove 320 form a close contact, increasing the heat equalizing metal plate 200 and heat dissipation.
  • the contact area of the fin 300 improves the heat transfer efficiency between the heat equalizing metal plate 200 and the heat sink 300.
  • a fin structure 310 is provided on the side of the heat sink 300 facing away from the soaking metal plate 200.
  • the fin structure includes a plurality of fins 311 arranged in parallel at intervals, and the fins extend in a direction away from the soaking metal plate.
  • the fin structure 310 can increase the surface area of the heat sink 300, which is beneficial to improve the heat dissipation performance of the heat sink 300.
  • FIG. 6 is a schematic structural diagram of the heat exchange module 100 provided by the first embodiment of the present application.
  • the heat exchange module 100 may be a thermoelectric cooler (TEC), which is a cooling device made by using the Peltier effect of semiconductors.
  • TEC thermoelectric cooler
  • the so-called Peltier effect means that when current passes through a galvanic couple composed of two semiconductor materials, heat transfer occurs at both ends of the galvanic couple, that is, heat transfers from one end to the other, forming one end to absorb heat and the other end to release heat.
  • the phenomenon N-type semiconductors and P-type semiconductors based on heavily doped bismuth telluride are the main materials for making thermoelectric coolers.
  • the bismuth telluride components are electrically connected in series and generate heat in parallel.
  • the thermoelectric cooler includes a plurality of thermocouple pairs (groups) formed by connecting N-type semiconductors and P-type semiconductors, which are connected together by electrodes and are arranged between two ceramic electrodes.
  • groups formed by connecting N-type semiconductors and P-type semiconductors, which are connected together by electrodes and are arranged between two ceramic electrodes.
  • the thermocouple pair transfers heat from one side of the thermoelectric cooler to the other side of the thermoelectric cooler, causing the thermoelectric cooler to generate a hot side (the side to which heat is transferred) and a cold side (The side where the heat is transferred), where the temperature of the cold side can be much lower than the ambient temperature.
  • the heat exchange module 100 in the present application may be a thermoelectric cooler, but also other refrigerators.
  • the refrigerator may include a thermoelectric cooler as shown in FIG. 6 including a hot side and a cold side, wherein the heat in the refrigerator can be externally applied (such as voltage, current, pressure, etc.) or spontaneously from the cold side to the hot side. Side conduction, so that the cold side has a lower temperature.
  • FIG. 7 is a cross-sectional view of the heat dissipation device provided by the first embodiment of the present application, taken along the line B.
  • FIG. 7 the heat sink 300 and the heat-soaking metal plate 200 use their respective groove structures to form a tight embedded connection.
  • the heat exchange module 100 is arranged in the first groove 210 of the soaking metal plate 200, the hot side of the heat exchange module 100 is arranged facing the first groove 210, and the hot side of the heat exchange module 100 is connected to the bottom of the first groove 210 To contact.
  • the depth H1 of the first groove 210 along the A direction may be less than or equal to the thickness B1 of the heat exchange module 100 along the A direction.
  • the cold side of the heat exchange module 100 It is higher than the soaking metal plate 200 so that the cold side of the heat exchange module 100 can contact the heating element 400.
  • the depth H1 of the first groove 210 along the A direction may also be greater than the thickness B1 of the heat exchange module 100 along the A direction.
  • the heating element 400 may be partially disposed in the first groove 210 to contact the heat exchange module 100, which is beneficial to reduce the total thickness of the heat sink and the heating element 400 after contacting.
  • the heating element 400 in this application includes but is not limited to printed circuit boards (PCB), crystal modules (including various chips, such as system on a chip, SOC), radio frequency front-end chip, and modem chip Etc.), and other electronic components that can generate heat during operation.
  • PCB printed circuit boards
  • crystal modules including various chips, such as system on a chip, SOC), radio frequency front-end chip, and modem chip Etc.
  • other electronic components that can generate heat during operation.
  • the heating element 400 is attached to the cold side of the heat exchange module 100; when the heat exchange module 100 is in operation, it can conduct heat from the cold side to the hot side, so that the cold side has a temperature lower than the environment;
  • the heat exchange module 100 can cool down the heating element 400 on the cold side, so that the temperature of the heating element 400 is drastically reduced and is lower than the ambient temperature, so that the components can operate stably in a high ambient temperature.
  • the heat on the hot side of the heat exchange module 100 can be diffused to the soaking metal plate 200 and further diffused to the heat sink 300 via the soaking metal plate 200. Since the heat sink 300 has the fin structure 310, it can generate a larger contact area with the environment and efficiently diffuse heat into the environment.
  • the heat dissipation device provided by the first embodiment of the present application forms a cooling and heat transfer channel from the components to the external environment, and can reduce the temperature of the heating element 400 itself. Below the ambient temperature, even if the ambient temperature is higher than the threshold temperature for the normal operation of the heating element 400, the temperature of the heating element 400 can be reduced below the threshold temperature without overheating protection and frequency reduction (when the heating element 400 is a semiconductor The heating element 400 can operate stably in high ambient temperature.
  • FIG. 8 is a schematic diagram of the structure of the heat sink applied to the printed circuit board module 500 to dissipate heat.
  • the printed circuit board module 500 includes a printed circuit board 510 and various components mounted on the printed circuit board 510.
  • the components mounted on the printed circuit board 510 may include an antenna 520 and a crystal module 530 (including various chips, etc.) for processing antenna signals.
  • the cold side of the heat exchange module 100 is attached to the surface of the crystal module 530, which can directly cool the crystal module 530, so that the temperature of the crystal module 530 is always lower than the ambient temperature. Therefore, even if the ambient temperature is higher than the threshold temperature for normal operation of the heating element 400, the temperature of the crystal module 530 can be lowered below the threshold temperature without overheating protection, frequency reduction and damage, so that the crystal module 530 can operate stably.
  • FIG. 9 is another schematic diagram of the structure of the heat sink applied to the printed circuit board module 500 to dissipate heat.
  • the printed circuit board module 500 includes a printed circuit board 510 and various components mounted on the printed circuit board 510.
  • the components mounted on the printed circuit board 510 may include an antenna 520 and a crystal module 530 (including various chips, etc.) for processing antenna signals.
  • the cold side of the heat exchange module 100 is directly attached to the printed circuit board 510, which can directly cool the printed circuit board 510, reduce the overall temperature of the printed circuit board 510, and make the printed circuit board 510
  • the local temperature of the board 510 is lower than the ambient temperature.
  • the crystal module 530 mounted on the printed circuit board 510 generates heat, a larger temperature difference will be generated between the crystal module 530 and the printed circuit board 510, which accelerates the heat transfer of the crystal module 530 to the printed circuit board 510, which is beneficial to reduce The temperature of the crystal module 530.
  • the cold side of the heat exchange module 100 can be attached to the position of the printed circuit board 510 where the crystal module 530 with a larger heat generation is installed, so that the crystal module 530 and the heat exchange module 100 can pass through the printed circuit.
  • the board 510 establishes a heat exchange channel with the shortest distance, which is beneficial to reduce the temperature of the crystal module 530 below the ambient temperature. Therefore, even if the ambient temperature is higher than the threshold temperature for normal operation of the heating element 400, the temperature of the crystal module 530 can be lowered below the threshold temperature without overheating protection, frequency reduction and damage, so that the crystal module 530 can operate stably.
  • the fourth embodiment of the present application provides a vehicle-mounted antenna module.
  • the vehicle-mounted antenna module includes the heat dissipation device of the foregoing embodiments of the present application.
  • Fig. 10 is a schematic structural diagram of a vehicle-mounted antenna module provided by a fourth embodiment of the present application.
  • the vehicle-mounted antenna module includes an antenna housing 600, a printed circuit board module 500, a heat conducting medium 700, a heat exchange module 100, a heat equalizing metal plate 200 and a heat sink 300.
  • the heat exchange module 100, the soaking metal plate 200, and the heat sink 300 are stacked, the heat exchange module 100 is arranged on one side of the soaking metal plate 200, and the heat sink 300 is arranged on the other side of the soaking metal plate 200.
  • the hot metal plate 200 is located between the heat exchange module 100 and the heat sink 300.
  • the hot side of the heat exchange module 100 is arranged facing the heat exchange module 100, and the heat exchange metal plate 200 is recessed in a direction away from the heat exchange module 100 to form a first groove 210.
  • the size of the first groove 210 is greater than or equal to that of the heat exchange module 100. size.
  • the heat exchange module 100 is placed in the first groove 210, and the hot side of the heat exchange module is attached to the bottom of the first groove 210.
  • the soaking metal plate 200 can be made of materials with excellent thermal conductivity, such as copper and aluminum.
  • the size of the soaking metal plate 200 is larger than the size of the heat exchange module 100, so that the soaking metal plate 200 can completely cover the heat exchange module 100, fully absorb the heat from the heat exchange module 100, and improve the heat dissipation performance of the heat exchange module 100.
  • the heat sink 300 is recessed on the side facing the heat equalizing metal plate 200 in a direction away from the equalizing metal plate 200 to form a second groove 320 that matches the shape of the first groove 210.
  • the first groove 210 of the heat equalizing metal plate 200 can be embedded in the second groove 320 of the heat sink 300, so that the first groove 210 and the second groove 320 form a close fit, increasing the heat equalizing metal plate 200 and the second groove 320.
  • the contact area of the heat sink 300 improves the heat transfer efficiency between the heat equalizing metal plate 200 and the heat sink 300.
  • the printed circuit board module 500 is disposed facing the cold side of the heat exchange module 100, and the printed circuit board module 500 includes a printed circuit board 510, an antenna 520 and a crystal module 530.
  • the antenna 520 is arranged on the side of the printed circuit board 510 facing away from the heat exchange module 100.
  • the crystal module 530 is arranged on the side of the printed circuit board 510 facing the heat exchange module 100, and the crystal module 530 is attached to the cold side of the heat exchange module 100.
  • the heat-soaking metal plate 200 and the antenna housing 600 are provided with a matching fixing structure 220 and a fixing structure 610.
  • the antenna housing 600 is buckled in the uniform along the direction from the printed circuit board module 500 to the heat sink 300 (that is, the direction A in FIG. 9).
  • the printed circuit board module 500 and the heat exchange module 100 are enclosed in the antenna housing 600, so that the printed circuit board module 500 and The heat exchange module 100 is isolated from the external environment to prevent the printed circuit board module 500 and the heat exchange module 100 from being immersed in water or being affected by the sun, dust, etc.
  • the vehicle-mounted antenna module provided by the embodiment of the present application can be installed on the car body, such as the roof of a car, so that the car has the capability of wireless communication with other network devices.
  • FIG. 11 is a cross-sectional view of the vehicle-mounted antenna module provided by the fourth embodiment of the present application, taken along the line B.
  • the antenna housing 600 has an arc structure that matches the curvature of the roof.
  • the antenna 520 is provided on the side of the printed circuit board 510 facing the antenna housing 600.
  • the crystal module 530 is arranged on the side of the printed circuit board 510 facing the soaking metal plate.
  • the crystal module 530 is attached to the cold side of the heat exchange module 100 through the heat transfer medium 700.
  • the soaking metal plate 200 is attached to the hot side of the heat exchange module 100.
  • the antenna housing 600 can be made of non-metallic materials such as plastics, fibers, etc., so that electromagnetic wave signals can penetrate the antenna housing 600 and be received by the antenna 520, and the electromagnetic wave signals emitted by the antenna 520 can also penetrate the antenna housing 600. Received by other devices.
  • the antenna housing 600 can also be made of a metal material, and a gap is formed by removing the material, and the gap is filled with a non-metallic material such as plastic to form the micro-slot antenna 520 structure.
  • FIG. 12 is a schematic diagram of the installation of the vehicle-mounted antenna module on the roof of the vehicle provided by the fourth embodiment of the present application.
  • the roof shell 910 of the automobile is provided with a cavity 940 for accommodating the on-board antenna module 930.
  • the on-board antenna module 930 is arranged in the cavity 940.
  • the roof shell 910 is also provided with a radome 950.
  • the cover 950 is buckled and installed on the cavity 940 to close the cavity 940 so that the vehicle antenna module 930 is hidden inside the roof housing 910 without affecting the appearance of the roof.
  • the beneficial effects that can be achieved by the vehicle-mounted antenna module provided by the fourth embodiment of the present application will be specifically described below in conjunction with FIG. 11.
  • the in-vehicle antenna module can usually be arranged on the housing of the car, such as the roof of the car. Since most cars are driven and parked outdoors, the roof of the car is often exposed to sunlight and the temperature is very high. The high-temperature environment on the roof poses a challenge to the normal operation of the vehicle-mounted smart module. The high-temperature environment and the heat generated during the operation of the crystal module 530 can make the temperature of the crystal module 530 close to or even higher than the threshold temperature (for example: the threshold of a semiconductor chip).
  • the threshold temperature for example: the threshold of a semiconductor chip
  • the temperature is about 105°C), resulting in overheating, frequency reduction, power-off self-protection and even damage to the crystal module 530.
  • Traditional vehicle antenna module Using a fan to dissipate heat, that is, the fan is used to speed up the air flow near the crystal module 530 to take away heat, so as to reduce the temperature of the crystal module 530. Since the fan heat dissipation cannot make the temperature of the crystal module 530 lower than the ambient temperature, in a high-temperature environment, the fan heat dissipation has a poor cooling effect on the crystal module 530, and the crystal module 530 still has a risk of excessive temperature.
  • the vehicle antenna module provided by the fourth embodiment of the present application dissipates heat through the heat dissipation device provided in any of the above embodiments, and can reduce the temperature of the crystal module 530 to below the ambient temperature, even if the roof of the vehicle is exposed to the sun to reach a high temperature , The temperature of the crystal module 530 will not be close to the threshold temperature, so that the crystal module 530 will continue to operate stably without frequency reduction, triggering of self-protection, and damage.
  • the vehicle antenna module provided by the fourth embodiment of the present application has no fan, so it does not generate noise, does not need to add an air duct on the roof, has a compact structure, does not increase the thickness of the roof, does not affect the appearance of the entire vehicle, and improves the user experience .
  • the fifth embodiment of the present application provides a vehicle-mounted communication terminal.
  • the vehicular communication terminal part includes the heat dissipation devices of the foregoing embodiments of the present application.
  • the vehicle-mounted communication terminal is also called the vehicle-mounted T-BOX (Telematics BOX), which is one of the four major components of the vehicle-connected system (the vehicle-connected system includes: the host, the vehicle-mounted T-BOX, the mobile device APP and the background system).
  • the vehicle-mounted communication terminal mainly It is used to communicate with the background system/mobile device to realize the vehicle information display and control of the mobile device APP.
  • the mobile device may be, for example, a mobile phone, a tablet computer, a smart wearable device, and the like.
  • Fig. 13 is a schematic diagram of communication between a vehicle-mounted communication terminal and a mobile device.
  • the in-vehicle communication terminal 960 is hidden and arranged on the inside of the roof housing 910 of the car, and the in-vehicle communication terminal 960 is connected to the external antenna 970 of the car through a cable or the like.
  • the external antenna may be the rear part of the roof. Shark fin antenna.
  • the vehicular communication terminal 960 establishes a communication connection with the mobile device 980 through the external antenna 970 to realize the vehicle information display and control of the mobile device APP.
  • FIG. 14 is a schematic structural diagram of a vehicle-mounted communication terminal provided by a fifth embodiment of the present application.
  • the vehicle-mounted communication terminal includes a terminal housing 800, a printed circuit board module 500, a heat transfer medium 700 and a heat exchange module 100.
  • the vehicular communication terminal may be arranged inside the metal casing of the vehicle, such as the inside of the roof casing 910.
  • the roof shell 910 is equivalent to the soaking metal plate 200 in any of the foregoing embodiments.
  • the terminal housing 800 is provided with an opening 810 that faces the roof housing 910; the heat exchange module 100 is arranged in the opening 810.
  • the heat exchange module 100 includes a cold side and a hot side, and the cold side faces the terminal housing 800.
  • the hot side faces the roof shell 910, the temperature of the cold side is lower than the temperature of the hot side, the heat exchange module 100 is used to conduct heat from the cold side to the hot side;
  • the printed circuit board module 500 is arranged on the terminal housing 800 Inside, the printed circuit board module 500 includes a printed circuit board 510, an antenna 520 and a crystal module 530 mounted on the printed circuit board, the printed circuit board module 510 is attached to the cold side;
  • the heat transfer medium 700 is arranged on the heat exchange module 100 and the roof shell Between the bodies 910, the hot side surface and the roof shell 910 are bonded and connected through the heat conducting medium 700 to form a heat transmission channel from the printed circuit board module 500 to the roof shell 910.
  • the printed circuit board module 500 is attached to the cold side of the heat exchange module 100, which may specifically include: the crystal module 530 is attached to the cold side of the heat exchange module 100 (for example, the second embodiment), or the printed circuit board 510 It is connected to the cold side of the heat exchange module 100 (for example, the third embodiment).
  • the roof shell 910 is usually made of metal materials such as steel plate, which has good thermal conductivity and a large area; therefore, the heat-dissipating metal plate 200 taken from the roof shell 910 will have a large heat dissipation area. It has good heat dissipation performance; in this case, there is no need to configure additional heat sinks for the soaking metal plate 200 (that is, the roof shell 910), which is beneficial to simplify the structure of the vehicle-mounted communication terminal and reduce the size of the vehicle-mounted communication terminal.
  • the metal roof shell 910 can also be electrically coupled with the printed circuit board module 500 due to its good electrical conductivity. It can be used as the antenna of the vehicle-mounted communication terminal, which is beneficial to further simplify the structure of the vehicle-mounted communication terminal and reduce the size of the vehicle-mounted communication terminal. The volume of the terminal.
  • the beneficial effects that can be achieved by the vehicular communication terminal provided by the fifth embodiment of the present application will be specifically described below with reference to FIG. 14.
  • the vehicle-mounted communication terminal provided by the fifth embodiment of the present application establishes a heat transmission channel from the printed circuit board module 500 to the roof shell 910, and uses the heat exchange module 100 to reduce the temperature of the crystal module 530 to below the ambient temperature.
  • the heat generated by the crystal module 530 is transmitted to the roof shell 910, and the larger heat dissipation area of the roof shell 910 is used to quickly dissipate the heat to the environment.
  • the terminal housing of the vehicle-mounted communication terminal, the printed circuit board module 500, the heat transfer medium 700, and the heat exchange module 100 provided by the fifth embodiment of the present application are all arranged in the interlayer space between the roof housing 910 and the car interior decoration 920.
  • the vehicle-mounted communication terminal provided by the fifth embodiment of the present application has no fan, does not generate noise, does not need to add an air duct on the roof, and does not affect the appearance of the entire vehicle.
  • the embodiments of the present application also provide a vehicle, which includes, but is not limited to, automobiles, rail vehicles, engineering vehicles, and the like.
  • the automobile can be, for example, a small passenger car, a medium-sized passenger car, a bus, a truck, a special vehicle (such as a fire engine, an ambulance, a police car, etc.), and a rail vehicle can be, for example, a passenger train, a freight train, a maglev train, a subway train, etc.
  • the construction vehicle may be, for example, a vehicle such as a loader, excavator, harvester, and road roller.
  • the vehicle may include one or more of the heat dissipation device, the vehicle-mounted antenna module, or the vehicle-mounted communication terminal provided in any of the foregoing embodiments of the present application.
  • the vehicle includes an on-board antenna module 930.
  • the roof shell 910 of the vehicle is provided with a cavity 940 for accommodating the on-board antenna module 930
  • the on-board antenna module 930 is arranged in the cavity 940
  • the roof shell 910 is also provided with a radome 950
  • the radome 950 is snap-fitted. It is installed on the cavity 940 to close the cavity 940 so that the vehicle antenna module 930 is hidden inside the roof shell 910 without affecting the appearance of the roof.
  • the vehicle includes an in-vehicle communication terminal 960.
  • the vehicle-mounted communication terminal 960 is hidden and arranged on the inside of the roof housing 910 of the vehicle, and the vehicle-mounted communication terminal 960 is connected to the external antenna 970 of the vehicle by a cable or the like.
  • the external antenna may be a shark fin antenna on the rear of the vehicle roof.
  • the vehicular communication terminal 960 establishes a communication connection with the mobile device 980 through the external antenna 970 to realize the vehicle information display and control of the mobile device APP.
  • the sixth embodiment of the present application provides a temperature control method.
  • the temperature control method can be applied to the heat dissipation device, the vehicle-mounted antenna module, or the vehicle-mounted communication terminal provided in any of the foregoing embodiments.
  • Fig. 15 is a flowchart of the temperature control method. As shown in Figure 15, the temperature control method includes:
  • Step S101 Determine whether the temperature of the heating element is greater than or equal to a first threshold.
  • the heating elements in this application include but are not limited to printed circuit boards (PCB), crystal modules (including various chips, such as system on a chip, SOC), radio frequency front-end chip, modem chip, etc. ), and other electronic components that can generate heat during operation.
  • PCB printed circuit boards
  • crystal modules including various chips, such as system on a chip, SOC), radio frequency front-end chip, modem chip, etc.
  • other electronic components that can generate heat during operation.
  • the first threshold is less than the threshold temperature of the heating element.
  • the heating element is a crystal module
  • the first threshold can be set to a temperature lower than the threshold temperature, and the crystal module will not be overheated and reduced in frequency.
  • the temperature of the heating element can be measured with a temperature sensor built into the heating element, or can be measured with other external sensors.
  • step S102 if the temperature of the heating element is greater than or equal to the first threshold, the heat exchange module is turned on.
  • the temperature of the heating element is greater than or equal to the first threshold, it indicates that the temperature of the heating element is higher and may rise further. If the temperature of the heating element rises further, the heating element will be damaged due to overheating and frequency reduction or even higher than the threshold temperature. Therefore, it is necessary to turn on the heat exchange module to cool down the heating element.
  • step S103 it is determined whether the temperature of the heating element is less than or equal to a second threshold.
  • the second threshold may be equal to or lower than the first threshold.
  • step S104 if the temperature of the heating element is less than or equal to the second threshold, the heat exchange module is closed.
  • the heat exchange module can be turned off to reduce the power consumption of the heat exchange module. After that, if the temperature of the heating element rises, but is less than the first threshold, the heat exchange module will always remain closed. If the temperature of the heating element is greater than or equal to the first threshold, the heat exchange module will be turned on again.
  • the method provided by the sixth embodiment of the present application can control the temperature of the heating element between the first threshold and the second threshold lower than the threshold temperature, and can ensure the normal operation of the heating element; in addition, the sixth embodiment of the present application provides The method controls the heat exchange module to turn on and off intermittently according to the temperature of the heating element, which is also beneficial to reduce the power consumption of the heat exchange module. Then, if the heat exchange module uses the on-board battery to supply power, it can extend the battery in the non-charging state Battery life.
  • the heat dissipation module provided in the embodiments of the present application can be used in various scenarios that work in a high temperature environment and require heat dissipation of equipment or components, such as: vehicle antennas, outdoor communication base stations, communication satellites, computer chips, and so on.
  • equipment or components such as: vehicle antennas, outdoor communication base stations, communication satellites, computer chips, and so on.
  • details are not repeated here.
  • Those skilled in the art can also think of applying the technical solutions of the embodiments of the present application under the enlightenment of the technical concepts of the embodiments of the present application. When applied to other designs, these designs do not exceed the protection scope of the embodiments of the present application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请提供了一种车载天线模块和车载通信终端。其中，车载天线模块和车载通信终端均包含热交换模块，热交换模块包括冷侧面和热侧面，冷侧面的温度低于热侧面的温度，热交换模块用于将热量从冷侧面向热侧面传导，在冷侧面形成低温。通过将热交换模块的冷侧面与车载天线模块或车载通信终端的发热元件贴合，能够对发热元件进行冷却。热交换模块的热侧可以与均热金属板、散热器或者车辆的金属壳体等连接，热交换模块吸收的热量能够被传导至热侧面，利用均热金属板、散热器或者车辆的金属壳体等传递到环境中。因此，本申请提供的技术方案能够降低发热元件在高温环境中运行时的温度，使发热元件在高温环境中也可以稳定地运行。

Description

一种车载天线模块和车载通信终端 技术领域
本申请涉及电子元件散热技术领域，尤其涉及一种能够降低发热元件高温环境中的运行温度的车载天线模块和车载通信终端。
背景技术
移动通信技术，例如第五代移动通信技术(5th generation mobile networks，5G)的发展促进了车联网(connected car)和自动驾驶技术的发展。通过为汽车加装5G天线，可以将汽车连接到高速率、低延时的5G网络中，实现汽车与汽车、汽车与其他通信设备之间的万物互联，在提高车辆驾驶体验和行驶安全等方面具有广阔的应用前景。
图1是加装了天线的汽车结构示意图。如图1所示，为了提高汽车与外界的通信质量，天线以及用于处理天线信号的电气元件通常安装在汽车车顶，这些电气元件包括印刷电路板(printed circuit board，PCB)以及安装在印刷电路板上的用于处理天线信号的晶体模块(包括各类芯片等)。由于汽车行驶和停放的环境多为户外，车顶会直接受到户外阳光的暴晒而具有较高的温度，当车顶温度升高时，安装在车顶的晶体模块会出现过热降频等异常现象，如果车顶温度达到了晶体模块的门限温度(例如：半导体芯片的门限温度通常为105℃)，晶体模块就会过热自保护甚至发生损坏，因此，安装在车顶的晶体模块必须要有有效的散热，才能稳定地工作。
目前，针对晶体模块等发热元件的散热主要是采用风冷散热的方式，即在发热元件加装风扇，利用风扇加快发热元件附近的空气流动，带走发热元件产生的热量进行散热。风冷散热方式无法使发热元件的温度达到环境温度以下，环境温度越高、发热元件的温度就越高，风冷散热方式的散热效果也就越差。因此，风冷散热无法满足车顶温度达到或接近发热元件的门限温度时，对发热元件的散热要求。
发明内容
本申请提供了一种车载天线模块和车载通信终端，能够降低发热元件在高温环境中运行时的温度。
第一方面，本申请提供了一种车载天线模块，包括：天线外壳、印刷电路板模块、热交换模块、均热金属板和散热片；热交换模块包括冷侧面和热侧面，冷侧面的温度低于热侧面的温度，热交换模块用于将热量从冷侧面向热侧面传导；印刷电路板模块包括印刷电路板、安装于印刷电路板的天线和晶体模块，印刷电路板模块贴合设置在冷侧面；均热金属板贴合设置在热侧面；散热片贴合设置在均热金属板的背对热交换模块的一侧；天线外壳设置在均热金属板的面向热交换模块的一侧，均热金属板和天线外壳设置有相互配合的固定结构，均热金属板和天线外壳通过固定结构固定连接，将印刷电路板模块和热交换模块封闭在天线外壳内。
本申请提供的技术方案，利用热交换模块能够将热量从冷侧面向热侧面传导的特性，将冷侧面与印刷电路板模块贴合，将热侧面与均热金属板贴合，使热交换模块能够在冷侧 面吸收印刷电路板模块上的晶体模块等产生的热量，对印刷电路板模块进行冷却，能够在热侧面将吸收的热量传递给均热金属板，利用均热金属板和散热片将热量散发到环境中。因此，本申请提供的技术方案能够降低晶体模块等发热元件在高温环境中运行时的温度，使发热元件的温度可以低于环境温度，即使环境温度升高到发热元件的门限温度，发热元件也可以稳定地运行。
可选的，晶体模块设置在印刷电路板的面向热交换模块的一侧；晶体模块冷侧面贴合连接。由此，热交换模块可以与晶体模块直接贴合，使热交换模块可以直接为晶体模块冷却降温。
可选的，印刷电路板与冷侧面贴合连接；晶体模块设置在印刷电路板的背对热交换模块的一侧。由此，热交换模块可以与印刷电路板贴合，使晶体模块和热交换模块之间经由印刷电路板建立热交换通道，热交换模块可以通过冷却印刷电路板的方式间接对晶体模块以及其他发热元件进行冷却。
可选的，均热金属板向远离热交换模块的方向凹陷，形成第一凹槽；热交换模块置于第一凹槽内，热侧面与第一凹槽的底部贴合；散热片向远离均热金属板的方向凹陷，形成与第一凹槽形状匹配的第二凹槽；第一凹槽嵌入到第二凹槽内，第一凹槽与第二凹槽紧密贴合。由此，第一凹槽和第二凹槽使热交换模块、均热金属板和散热器相互嵌套连接，增大了热交换模块、均热金属板和散热器之间的接触面积，有利于提高热交换模块、均热金属板和散热器之间的热传递效率。
可选的，热交换模块与晶体模块之间设置有导热介质，冷侧面与晶体模块通过导热介质贴合连接。导热介质能够填充热交换模块与晶体模块之间的缝隙，提高冷侧面与晶体模块之间的热传递效率。
可选的，天线设置在印刷电路板的背对热交换模块的一侧。由此，天线直接暴露在天线外壳之下，与天线外壳之间没有其他阻碍，使天线与外部设备通信时的信号强度不会受到影响。
可选的，热交换模块为热电冷却器(thermo electric cooler，TEC)。由此，利用热电冷却器的珀尔帖效应，可以通过对珀尔帖效应通电使其形成冷侧面和热侧面，其中，冷侧面的温度可以远低于环境温度，因此，使用冷侧面为发热元件降温，能够大幅降低发热元件的温度。
可选的，热电冷却器包括多个热电偶对，热电偶对由N型半导体和P型半导体联结形成；多个热电偶对排列设置在两个陶瓷电极之间；热电偶对用于在有电流通过时，将热量从冷侧面转移到热侧面。
可选的，散热片在背对均热金属板的一侧设置有鳍片结构；鳍片结构包括多个鳍片，鳍片向远离均热金属板方向延伸；多个鳍片间隔并列设置。鳍片结构可以增加散热片的散热面积，提高散热片的散热效率。
第二方面，本申请提供了一种车载通信终端，包括：终端壳体、印刷电路板模块、导热介质和热交换模块；终端壳体设置于车辆的金属壳体内侧，终端壳体设置有开孔，开孔面向金属壳体设置；热交换模块设置于开孔内，热交换模块包括冷侧面和热侧面，冷侧面面向终端壳体设置，热侧面面向金属壳体设置，冷侧面的温度低于热侧面的温度，热交换模块用于将热量从冷侧面向热侧面传导；印刷电路板模块设置于终端壳体内，印刷电路板 模块包括印刷电路板、安装于印刷电路板的天线和晶体模块，印刷电路板模块与冷侧面贴合；导热介质设置在热交换模块和金属壳体之间，热侧面和金属壳体通过导热介质贴合连接。
本申请提供的技术方案，利用热交换模块能够将热量从冷侧面向热侧面传导的特性，将冷侧面与印刷电路板模块贴合，将热侧面与车辆的金属壳体贴合，将金属壳体作为均热金属板和散热器，使热交换模块能够在冷侧面吸收印刷电路板模块上的晶体模块等产生的热量，对印刷电路板模块进行冷却，能够在热侧面将吸收的热量传递给金属壳体，通过金属壳体将热量散发到环境中。因此，本申请提供的技术方案能够降低晶体模块等发热元件在高温环境中运行时的温度，使发热元件的温度可以低于环境温度，即使环境温度升高到发热元件的门限温度，发热元件也可以稳定地运行。
可选的，晶体模块设置在印刷电路板的面向热交换模块的一侧；晶体模块冷侧面贴合连接。由此，热交换模块可以与晶体模块直接贴合，使热交换模块可以直接为晶体模块冷却降温。
可选的，印刷电路板与冷侧面贴合连接；晶体模块设置在印刷电路板的背对热交换模块的一侧。由此，热交换模块可以与印刷电路板贴合，使晶体模块和热交换模块之间经由印刷电路板建立热交换通道，热交换模块可以通过冷却印刷电路板的方式间接对晶体模块以及其他发热元件进行冷却。
可选的，热交换模块为热电冷却器thermo electric cooler，TEC)。由此，利用热电冷却器的珀尔帖效应，可以通过对珀尔帖效应通电使其形成冷侧面和热侧面，其中，冷侧面的温度可以远低于环境温度，因此，使用冷侧面为发热元件降温，能够大幅降低发热元件的温度。
可选的，热电冷却器包括多个热电偶对，热电偶对由N型半导体和P型半导体联结形成；多个热电偶对排列设置在两个陶瓷电极之间；热电偶对用于在有电流通过时，将热量从冷侧面转移到热侧面。
第三方面，本申请提供了一种车辆，该车辆包含上述第一方面提供车载天线模块。车辆的车顶壳体设置有用于容纳车载天线模块的腔体，车载天线模块设置于腔体内，车顶壳体还设置有天线罩，天线罩扣合安装于腔体之上，将腔体封闭，使车载天线模块隐藏在车顶壳体内部，不影响车顶美观。
第四方面，本申请提供了一种车辆，该车辆包含上述第二方面提供车载通信终端。车载通信终端隐藏设置于车辆的车顶壳体的内侧，车载通信终端与车辆的外置天线通过线缆等连接，该外置天线可以是车顶后部的鲨鱼鳍天线。车载通信终端通过外置天线与移动设备建立通信连接，实现移动设备APP的车辆信息显示与控制。
附图说明
图1是加装了天线的汽车结构示意图；
图2是目前风冷散热方案的结构示意图；
图3是本申请第一实施例提供的散热装置的结构分解图；
图4是本申请第一实施例提供的均热金属板的结构示意图；
图5是本申请第一实施例提供的散热片的结构示意图；
图6是本申请第一实施例提供的热交换模块的结构示意图；
图7是本申请第一实施例提供的散热装置的B向剖视图；
图8是散热装置应用于印刷电路板模块散热的一个结构示意图；
图9是散热装置应用于印刷电路板模块散热的另一个结构示意图；
图10是本申请第四实施例提供的车载天线模块的结构示意图；
图11是本申请第四实施例提供的车载天线模块的B向剖视图；
图12是本申请第四实施例提供的车载天线模块在车顶的安装示意图；
图13是车载通信终端与移动设备进行通信的示意图；
图14是本申请第五实施例提供的车载通信终端的结构示意图；
图15是本申请第六实施例提供的温度控制方法的流程图。
图示说明：
其中，011-散热片，012-风扇，100-热交换模块，200-均热金属板，210-第一凹槽，220-固定结构，300-散热片，310-鳍片结构，311-鳍片，320-第二凹槽，400-发热元件，500-印刷电路板模块，510-印刷电路板，520-天线，530-晶体模块，600-天线外壳，610-固定结构，700-导热介质，800-终端壳体，810-开孔，910-车顶壳体，920-车内装饰，930-车载天线模块，940-腔体，950-天线罩，960-车载通信终端，970-外置天线，980-移动设备。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述。显然，所描述的实施例是本申请的一部分实施例，而不是全部实施例。基于本申请的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所得到的其他实施例，都属于本申请的保护范围。
图2是目前风冷散热方案的结构示意图。
如图1所示，目前风冷散热方案包括散热片011和风扇012。散热片011贴合于发热元件400之上，用于吸收发热元件400产生的热量，风扇012设置于散热片011之上，并朝向散热片011吹风，加快发热元件400附近的空气流动，带走发热元件400产生的热量进行散热。风冷散热方式无法使发热元件400的温度达到环境温度以下，并且环境温度越高、发热元件400的温度就越高，风冷散热方式的散热效果也就越差，当环境温度达到或接近发热元件400的门限温度时，风冷散热方式的无法满足发热元件400的散热要求。并且，风扇012在运行时会产生噪音，如果将风扇012设置在车顶，还会影响车内乘客的乘坐体验。另外，风冷散热方式要求空气具有良好的流动性，而车顶空间相对封闭，无法满足风冷散热方式对空气的流动性要求。另外，车顶空间相对扁平，如果要在车顶放置风扇012，必须增加车顶厚度，影响整车的美观造型。
为了解决上述问题，本申请提供了一种散热装置，以及包含该车载散热装置的车载天线模块和车载通信终端，能够使发热元件400(例如：芯片等晶体模块)的温度降低至环境温度以下。
下面是本申请的第一实施例。
本申请的第一实施例提供了一种散热装置。图3是本申请第一实施例提供的散热装置的结构分解图。如图3所示，该散热装置包括：热交换模块100、均热金属板200和散热片300。其中，热交换模块100、均热金属板200和散热片300沿图3中的A向堆叠设置，均热金属板200位于热交换模块100和散热片300之间。
热交换模块100包括冷侧面和热侧面，冷侧面与热侧面方向相反，热交换模块100能够在外部作用下(例如：电压、电流、压力、光照等)或者自发地将热量从冷侧面向热侧面传导，使冷侧面具有低于环境的温度。热交换模块100的热侧面贴合设置于均热金属板200的一侧，散热片300对应于热交换模块100贴合于均热金属板200的另一侧。热交换模块100和均热金属板200之间可以填充导热介质，例如导热硅脂或导热垫，以填充热交换模块100和均热金属板200贴合后可能存在的缝隙，有利于热量在热交换模块100和均热金属板200之间传递；均热金属板200和散热片300之间也可以填充导热介质，以填充均热金属板200和散热片300贴合后可能存在的缝隙，有利于热量在均热金属板200和散热片300之间传递；使热交换模块100到均热金属板200再到散热片300的热传递路径不间断，实现较高的热传递效率。
图4是本申请第一实施例提供的均热金属板200的结构示意图。如图4所示，均热金属板200向远离热交换模块100的A方向凹陷形成第一凹槽210，第一凹槽210的尺寸大于或者等于热交换模块100的尺寸，使热交换模块100可以置于第一凹槽210内。均热金属板200可以使用铜、铝等具有优良导热性能的材料制成。均热金属板200的尺寸大于热交换模块100的尺寸，使得均热金属板200能够完整地覆盖热交换模块100，与热交换模块100具有更大的接触面积，充分吸收来自热交换模块100的热量，提高热交换模块100的散热性能。
图5是本申请第一实施例提供的散热片300的结构示意图。如图5所示，散热片300在面向均热金属板200的一侧挖空形成与第一凹槽210形状匹配的第二凹槽320。均热金属板200的第一凹槽210可以嵌入到散热片300的第二凹槽320内，使得第一凹槽210和第二凹槽320形成紧密接触，增大均热金属板200和散热片300的接触面积，提高均热金属板200和散热片300之间的热传递效率。散热片300背对均热金属板200的一侧设置有鳍片结构310，鳍片结构包括多个间隔并列设置的鳍片311，鳍片向远离均热金属板方向延伸。鳍片结构310可以增大散热片300的表面积，有利于提高散热片300的散热性能。
图6是本申请第一实施例提供的热交换模块100的结构示意图。如图6所示，热交换模块100可以是热电冷却器(thermo electric cooler，TEC)，热电冷却器是一种利用半导体的珀尔帖效应制成的冷却装置。所谓珀尔帖效应，是指当电流通过两种半导体材料组成的电偶时，电偶两端会产生热量转移，即：热量会从一端转移到另一端，形成一端吸热，另一端放热的现象。基于重掺杂有杂质的碲化铋得到的N型半导体和P型半导体是制作热电冷却器的主要材料，碲化铋元件采用电串联并且是并行发热。热电冷却器包括多个由N型半导体和P型半导体联结形成的热电偶对(组)，它们通过电极连接在一起，并设置在两个陶瓷电极之间。当有电流从热电冷却器流过时，热电偶对将热量从热电冷却器的一侧转移到热电冷却器的另一侧，使热电冷却器产生热侧面(热量传入的一侧)和冷侧面(热量传出的一侧)，其中，冷侧面的温度可以远低于环境温度。
此处需要补充说明的是，本申请中的热交换模块100除了可以是热电冷却器以外，还可以是其他制冷器。该制冷器可以如图6所示的热电冷却器包括热侧面和冷侧面，其中，制冷器中的热量能够在外部作用(例如：电压、电流、压力等)下或者自发地从冷侧面向热侧面传导，使冷侧面具有较低的温度。
图7是本申请第一实施例提供的散热装置的B向剖视图。如图7所示，散热片300和 均热金属板200利用各自的凹槽结构形成紧密的嵌入连接。热交换模块100设置于均热金属板200的第一凹槽210内，热交换模块100的热侧面面向第一凹槽210设置，并且热交换模块100的热侧面与第一凹槽210的底部相接触。第一凹槽210沿A向的深度H1可以小于或者等于热交换模块100沿A向的厚度B1，这样，当热交换模块100设置于第一凹槽210内时，热交换模块100的冷侧面高于均热金属板200，使得热交换模块100的冷侧面能够与发热元件400接触。第一凹槽210沿A向的深度H1也可以大于热交换模块100沿A向的厚度B1，这样，当热交换模块100设置于第一凹槽210内时，热交换模块100的冷侧面低于均热金属板200，发热元件400可以部分设置于第一凹槽210内与热交换模块100接触，有利于减小散热装置和发热元件400接触后的总厚度。
本申请中的发热元件400，包括但不限于印刷电路板(printed circuit board，PCB)，晶体模块(包括各类芯片，例如：***芯片(system on a chip，SOC)、射频前端芯片、调制解调器芯片等)，以及其他在运行时能够产生热量的电子元件等。
下面结合图7对本申请第一实施例提供的散热装置的工作原理做具体说明。如图7所示，发热元件400贴合于热交换模块100的冷侧面；热交换模块100在运行时，能够将热量从冷侧面向热侧面传导，使冷侧面具有低于环境的温度；因此，热交换模块100能够为冷侧面的发热元件400进行制冷降温，使发热元件400的温度大幅下降，并低于环境温度，使元器件在高环境温度中能够稳定运行。热交换模块100热侧面的热量，能够扩散至均热金属板200，并经由均热金属板200进一步向散热片300扩散。散热片300由于具有鳍片结构310，能够与环境产生更大的接触面积，将热量高效率地扩散到环境中。
本申请第一实施例提供的技术方案具有以下有益效果：本申请第一实施例提供的散热装置，形成了从元器件到外部环境的制冷和热传输通道，能够将发热元件400的自身温度降至环境温度之下，即使环境温度高于发热元件400正常运行的门限温度，发热元件400的温度也能够被降至门限温度之下，不会出现过热保护、降频(当发热元件400是半导体芯片时)和损坏，使发热元件400在高环境温度能够中稳定运行。
下面是本申请的第二实施例。
本申请的第二实施例提供了散热装置应用于印刷电路板模块500散热的一个实施例。图8是散热装置应用于印刷电路板模块500散热的一个结构示意图。如图8所示，印刷电路板模块500包括印刷电路板510以及安装在印刷电路板510上的各类元器件。例如：当印刷电路板模块500为车载智能天线***时，印刷电路板510安装的元器件可以包括天线520、以及用于处理天线信号的晶体模块530(包括各类芯片等)。
在本申请的第二实施例中，热交换模块100的冷侧面贴合于晶体模块530的表面，能够直接对晶体模块530进行冷却降温，使晶体模块530的温度始终低于环境温度。因此，即使环境温度高于发热元件400正常运行的门限温度，晶体模块530的温度也能够被降至门限温度之下，不会出现过热保护、降频和损坏，使晶体模块530能够稳定运行。
下面是本申请的第三实施例。
本申请的第三实施例提供了散热装置应用于印刷电路板模块500的另一个实现方式。图9是散热装置应用于印刷电路板模块500散热的另一个结构示意图。如图9所示，印刷电路板模块500包括印刷电路板510以及安装在印刷电路板510上的各类元器件。例如：当印刷电路板模块500为车载智能天线模块时，印刷电路板510安装的元器件可以包括天 线520、以及用于处理天线信号的晶体模块530(包括各类芯片等)。
在本申请的第三实施例中，热交换模块100的冷侧面直接贴合在印刷电路板510上，能够直接对印刷电路板510进行冷却降温，降低印刷电路板510的整体温度，使印刷电路板510的局部温度低于环境温度。当安装在印刷电路板510上的晶体模块530产生热量时，晶体模块530和印刷电路板510之间会产生更大的温差，使晶体模块530的热量加速向印刷电路板510传导，有利于降低晶体模块530的温度。
需要补充说明的是，热交换模块100的冷侧面可以贴合印刷电路板510的安装有发热量较大的晶体模块530所对应的位置，使晶体模块530和热交换模块100之间经由印刷电路板510建立距离最短的热交换通道，有利于将晶体模块530的温度降至环境温度以下。因此，即使环境温度高于发热元件400正常运行的门限温度，晶体模块530的温度也能够被降至门限温度之下，不会出现过热保护、降频和损坏，使晶体模块530能够稳定运行。
下面是本申请的第四实施例。
本申请的第四实施例提供了一种车载天线模块。该车载天线模块包含本申请前述各实施例的散热装置。图10是本申请第四实施例提供的车载天线模块的结构示意图。如图10所示，该车载天线模块包括天线外壳600、印刷电路板模块500、导热介质700、热交换模块100、均热金属板200和散热片300。其中，热交换模块100、均热金属板200和散热片300堆叠设置，热交换模块100设置于均热金属板200的一侧，散热片300设置在均热金属板200的另一侧，均热金属板200位于热交换模块100和散热片300之间。热交换模块100的热侧面面向均热金属板设置，均热金属板200向远离热交换模块100的方向凹陷形成第一凹槽210，第一凹槽210的尺寸大于或者等于热交换模块100的尺寸。热交换模块100置于第一凹槽210内，热交换模块的热侧面与第一凹槽210的底部贴合。均热金属板200可以使用铜、铝等具有优良导热性能的材料制成。均热金属板200的尺寸大于热交换模块100的尺寸，使得均热金属板200能够完整地覆盖热交换模块100，充分吸收来自热交换模块100的热量，提高热交换模块100的散热性能。散热片300在面向均热金属板200的一侧向远离所述均热金属板200的方向凹陷形成与第一凹槽210形状匹配的第二凹槽320。均热金属板200的第一凹槽210可以嵌入到散热片300的第二凹槽320内，使得第一凹槽210和第二凹槽320形成紧密贴合，增大均热金属板200和散热片300的接触面积，提高均热金属板200和散热片300之间的热传递效率。印刷电路板模块500面向热交换模块100的冷侧面设置，印刷电路板模块500包括印刷电路板510、天线520和晶体模块530。天线520设置在印刷电路板510背对热交换模块100的一侧。晶体模块530设置在印刷电路板510面向热交换模块100的一侧，晶体模块530与热交换模块100的冷侧面贴合。均热金属板200和天线外壳600设置有相配合的固定结构220和固定结构610，天线外壳600沿印刷电路板模块500至散热片300的方向(即图9中的A向)扣合在均热金属板200之上，并通过固定结构220和固定结构610与均热金属板200固定连接，将印刷电路板模块500和热交换模块100封闭在天线外壳600内，使印刷电路板模块500和热交换模块100与外界环境隔离，避免印刷电路板模块500和热交换模块100浸水或受到日晒、灰尘等影响。本申请实施例提供的车载天线模块可以安装在汽车车体之上，例如汽车的车顶，使汽车具备与其他网络设备进行无线通信的能力。
图11是本申请第四实施例提供的车载天线模块的B向剖视图。如图11所示，天线外 壳600具有与车顶弧度相匹配的弧形结构。天线520设置在印刷电路板510面向天线外壳600的一侧。晶体模块530设置在印刷电路板510面向均热金属板的一侧。晶体模块530通过导热介质700与热交换模块100的冷侧面贴合。均热金属板200与热交换模块100的热侧面贴合。
本申请实施例中，天线外壳600可以使用塑料、纤维等非金属材料制成，以使电磁波信号能够穿透天线外壳600被天线520接收，并且天线520发出的电磁波信号也能够穿透天线外壳600被其他设备接收。天线外壳600还可以使用金属材料制成，并通过去除材料形成缝隙，缝隙内使用塑胶等非金属材料进行填充，形成微缝天线520结构。
图12是本申请第四实施例提供的车载天线模块在车顶的安装示意图。如图12所示，汽车的车顶壳体910设置有用于容纳车载天线模块930的腔体940，车载天线模块930设置于腔体940内，车顶壳体910还设置有天线罩950，天线罩950扣合安装于腔体940之上，将腔体940封闭，使车载天线模块930隐藏在车顶壳体910内部，不影响车顶美观。
下面结合图11对本申请第四实施例提供的车载天线模块能够实现的有益效果做具体说明。车载天线模块通常可以设置在汽车的壳体上，例如车顶。由于汽车行驶和停放的环境多数在户外，车顶会经常处于阳光的暴晒之下，温度很高。车顶的高温环境对车载智能模块的正常运行带来了挑战，高温环境与晶体模块530运行时产生的热量叠加，可使晶体模块530的温度接近甚至高于门限温度(例如：半导体芯片的门限温度为105℃左右)，导致晶体模块530出现过热降频、断电自保护甚至损坏。传统的车载天线模块。使用风扇散热，即通过风扇加快晶体模块530附近的空气流动，带走热量，实现对晶体模块530的降温。由于风扇散热无法使晶体模块530的温度低于环境温度，在高温环境中，风扇散热对晶体模块530的降温效果很差，晶体模块530依然存在温度过高的风险。本申请第四实施例提供的车载天线模块通过上述任一实施例提供的散热装置进行散热，能够将晶体模块530的温度降低到环境温度之下，即使车顶受到阳光暴晒而达到很高的温度，晶体模块530的温度也不会接近门限温度，使晶体模块530持续用稳定地运行，不降频、不触发自保护、不损坏。另外，本申请第四实施例提供的车载天线模块无风扇，因此不产生噪音，不需要在车顶增加风道，结构紧凑，不增加车顶厚度，不影响整车的美观，提高用户使用体验。
下面是本申请的第五实施例。
本申请的第五实施例提供了一种车载通信终端。该车载通信终端部分包含本申请前述各实施例的散热装置。车载通信终端也称车载T-BOX(Telematics BOX)，是车联网***的四大组成部分之一(车联网***包括：主机、车载T-BOX、移动设备APP及后台***)，车载通信终端主要用于和后台***/移动设备通信，实现移动设备APP的车辆信息显示与控制。其中，移动设备例如可以是手机、平板电脑、智能穿戴设备等。
图13是车载通信终端与移动设备进行通信的示意图。如图13所示，车载通信终端960隐藏设置于汽车的车顶壳体910的内侧，车载通信终端960与汽车的外置天线970通过线缆等连接，该外置天线可以是车顶后部的鲨鱼鳍天线。车载通信终端960通过外置天线970与移动设备980建立通信连接，实现移动设备APP的车辆信息显示与控制。
图14是本申请第五实施例提供的车载通信终端的结构示意图。如图14所示，该车载通信终端包括终端壳体800、印刷电路板模块500、导热介质700和热交换模块100。其中，该车载通信终端可以设置在车辆金属壳体的内侧，例如车顶壳体910的内侧。这样，车顶 壳体910相当于前述任意实施例中的均热金属板200。终端壳体800设置有开孔810，开孔810面向车顶壳体910设置；热交换模块100设置于开孔810内，热交换模块100包括冷侧面和热侧面，冷侧面面向终端壳体800设置，热侧面面向车顶壳体910设置，冷侧面的温度低于热侧面的温度，热交换模块100用于将热量从冷侧面向热侧面传导；印刷电路板模块500设置于终端壳体800内，印刷电路板模块500包括印刷电路板510、安装于印刷电路板的天线520和晶体模块530，印刷电路板模块510与冷侧面贴合；导热介质700设置在热交换模块100和车顶壳体910之间，热侧面和车顶壳体910通过导热介质700贴合连接，形成从印刷电路板模块500到车顶壳体910的热传输通道。其中，印刷电路板模块500与热交换模块100的冷侧面贴合，具体可以包括：晶体模块530与热交换模块100的冷侧面贴合(例如：第二实施例)，或者，印刷电路板510与热交换模块100的冷侧面连接(例如：第三实施例)。
一般来说，车顶壳体910通常为钢板等金属材质制成，具有良好的导热性能，并且面积较大；因此，取自于车顶壳体910的均热金属板200会由于散热面积大而具有良好的散热性能；在这种情况下，不需要再为均热金属板200(即车顶壳体910)配置额外的散热片，有利于简化车载通信终端的结构，减小车载通信终端的体积。另外，金属材质的车顶壳体910由于具有良好的导电性，还可以与印刷电路板模块500电耦合，作为车载通信终端的天线使用，有利于进一步简化车载通信终端的结构，减小车载通信终端的体积。
下面结合图14对本申请第五实施例提供的车载通信终端能够实现的有益效果做具体说明。本申请第五实施例提供的车载通信终端，建立了从印刷电路板模块500到车顶壳体910的热传输通道，利用热交换模块100，将晶体模块530的温度降低到环境温度之下，并将晶体模块530产生的热量传输到车顶壳体910，利用车顶壳体910较大的散热面积将热量迅速向环境中散发。因此，即使车顶壳体910受到阳光暴晒而达到很高的温度，晶体模块530的温度在热交换模块100的冷却下也不会接近门限温度，从而保证晶体模块530持续用稳定地运行，不降频、不触发自保护、不损坏。并且，本申请第五实施例提供的车载通信终端的终端壳体、印刷电路板模块500、导热介质700和热交换模块100均设置于车顶壳体910与车内装饰920顶的夹层空间内，不额外占用车体空间，不增加车顶厚度；另外，本申请第五实施例提供的车载通信终端无风扇，不产生噪音，不需要在车顶增加风道，不影响整车的美观。
本申请实施例还提供了一种车辆，该车辆包括但不限于是汽车、轨道车辆、工程车辆等。其中，汽车例如可以是小型客车、中型客车、大客车、货车、特种车辆(例如：消防车、救护车、警车等)，轨道车辆例如可以是客运列车、货运列车、磁悬浮列车、地铁列车等；工程车辆例如可以是装载机、挖掘机、收割机、压路机等车辆。该车辆可以包括本申请上述任意实施例提供的散热装置、车载天线模块或车载通信终端中的一种或多种。
示例地，如图12所示，该车辆包括车载天线模块930。其中，车辆的车顶壳体910设置有用于容纳车载天线模块930的腔体940，车载天线模块930设置于腔体940内，车顶壳体910还设置有天线罩950，天线罩950扣合安装于腔体940之上，将腔体940封闭，使车载天线模块930隐藏在车顶壳体910内部，不影响车顶美观。
示例地，如图13所示，该车辆包括车载通信终端960。其中，车载通信终端960隐藏设置于车辆的车顶壳体910的内侧，车载通信终端960与车辆的外置天线970通过线缆等 连接，该外置天线可以是车顶后部的鲨鱼鳍天线。车载通信终端960通过外置天线970与移动设备980建立通信连接，实现移动设备APP的车辆信息显示与控制。
下面是本申请的第六实施例。
本申请的第六实施例提供了一种温度控制方法。该温度控制方法可以应用到前述任意实施例提供的散热装置、车载天线模块或者车载通信终端。图15是该温度控制方法的流程图。如图15所示，该温度控制方法包括：
步骤S101，判断发热元件的温度是否大于或者等于第一阈值。
本申请中的发热元件，包括但不限于印刷电路板(printed circuit board，PCB)，晶体模块(包括各类芯片，例如：***芯片(system on a chip，SOC)、射频前端芯片、调制解调器芯片等)，以及其他在运行时能够产生热量的电子元件等。
第一阈值小于发热元件的门限温度。例如，当发热元件为晶体模块时，第一阈值可以取低于门限温度，并且使晶体模块不会发生过热降频的温度。发热元件的温度可以利用发热元件内置的温度传感器测量得到，也可以利用其它外置传感器测量得到。
步骤S102，如果发热元件的温度大于或者等于第一阈值，则开启热交换模块。
如果发热元件的温度大于或者等于第一阈值，说明发热元件的温度较高，并可能进一步升高。如果发热元件的温度进一步升高，会导致发热元件出现过热降频甚至高于门限温度而损坏。因此，需要开启热交换模块，对发热元件进行降温。
步骤S103，判断发热元件的温度是否小于或者等于第二阈值。
第二阈值可以等于或者低于第一阈值。
步骤S104，如果发热元件的温度小于或者等于第二阈值，则关闭热交换模块。
当发热元件的温度小于或者等于第一阈值时，说明发热元件的温度下降正常的温度范围内，发热元件能够正常运行。因此，可以关闭热交换模块，以降低热交换模块的电耗。在这之后，如果发热元件的温度出现上升，但是小于第一阈值，热交换模块会一直保持关闭状态，如果发热元件温度大于或者等于第一阈值，热交换模块会重新开启。
本申请第六实施例提供的方法，能够将发热元件的温度控制在低于门限温度的第一阈值和第二阈值之间，能够保证发热元件的正常运行；另外，本申请第六实施例提供的方法根据发热元件的温度控制热交换模块间歇性地开启和关闭，还有利于降低热交换模块的电耗，那么，如果热交换模块使用车载的蓄电池供电，就能够延长蓄电池在非充电状态下的续航时间。
本申请实施例提供的散热模块可以应用在各种在高温环境下工作而对设备或元器件散热有要求的场景中，例如：车载天线、户外通信基站、通信卫星、计算机芯片等。关于本申请实施例提供的技术方案在其他设计中的应用，此处不再具体赘述，本领域技术人员在本申请实施例的技术构思的启示下，还能够想到将本申请实施例的技术方案应用到其他设计中，这些设计均没有超出本申请实施例的保护范围。
本领域技术人员在考虑说明书及实践这里公开的申请后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由下面的权利要求指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (16)

  1. 一种车载天线模块，其特征在于，
    包括：天线外壳、印刷电路板模块、热交换模块、均热金属板和散热片；
    所述热交换模块包括冷侧面和热侧面，所述冷侧面的温度低于所述热侧面的温度，所述热交换模块用于将热量从所述冷侧面向所述热侧面传导；
    所述印刷电路板模块包括印刷电路板、安装于所述印刷电路板的天线和晶体模块，所述印刷电路板模块贴合设置在所述冷侧面；所述均热金属板贴合设置在所述热侧面；
    所述散热片贴合设置在所述均热金属板背对所述热交换模块的一侧；
    所述天线外壳设置在所述印刷电路板面向所述热交换模块的一侧，所述均热金属板和所述天线外壳设置有相互配合的固定结构，所述均热金属板和所述天线外壳通过所述固定结构固定连接，将所述印刷电路板模块和所述热交换模块封闭在所述天线外壳内。
  2. 根据权利要求1所述的车载天线模块，其特征在于，
    所述晶体模块设置在所述印刷电路板的面向所述热交换模块的一侧；
    所述晶体模块所述冷侧面贴合连接。
  3. 根据权利要求1所述的车载天线模块，其特征在于，
    所述印刷电路板与所述冷侧面贴合连接；
    所述晶体模块设置在所述印刷电路板的背对所述热交换模块的一侧。
  4. 根据权利要求1所述的车载天线模块，其特征在于，
    所述均热金属板向远离所述热交换模块的方向凹陷，形成第一凹槽；
    所述热交换模块置于所述第一凹槽内，所述热侧面与所述第一凹槽的底部贴合；
    所述散热片向远离所述均热金属板的方向凹陷，形成与所述第一凹槽形状匹配的第二凹槽；
    所述第一凹槽嵌入到所述第二凹槽内，所述第一凹槽与所述第二凹槽紧密贴合。
  5. 根据权利要求2所述的车载天线模块，其特征在于，所述热交换模块与所述晶体模块之间设置有导热介质，所述冷侧面与所述晶体模块通过所述导热介质贴合连接。
  6. 根据权利要求1所述的车载天线模块，其特征在于，所述天线设置在所述印刷电路板的背对所述热交换模块的一侧。
  7. 根据权利要求1-6任意一项所述的车载天线模块，其特征在于，所述热交换模块为热电冷却器。
  8. 根据权利要求7所述的车载天线模块，其特征在于，
    所述热电冷却器包括多个热电偶对，所述热电偶对由N型半导体和P型半导体联结形成；
    多个所述热电偶对排列设置在两个陶瓷电极之间；
    所述热电偶对用于在有电流通过时，将热量从所述冷侧面转移到所述热侧面。
  9. 根据权利要求1所述的车载天线模块，其特征在于，
    所述散热片在背对所述均热金属板的一侧设置有鳍片结构；
    所述鳍片结构包括多个鳍片，所述鳍片向远离所述均热金属板方向延伸；
    多个所述鳍片间隔并列设置。
  10. 一种车载通信终端，其特征在于，
    包括：终端壳体、印刷电路板模块、导热介质和热交换模块；
    所述终端壳体设置于车辆的金属壳体内侧，所述终端壳体设置有开孔，所述开孔面向所述金属壳体设置；
    所述热交换模块设置于所述开孔内，所述热交换模块包括冷侧面和热侧面，所述冷侧面面向所述终端壳体设置，所述热侧面面向所述金属壳体设置，所述冷侧面的温度低于所述热侧面的温度，所述热交换模块用于将热量从所述冷侧面向所述热侧面传导；
    所述印刷电路板模块设置于所述终端壳体内，所述印刷电路板模块包括印刷电路板、安装于所述印刷电路板的天线和晶体模块，所述印刷电路板模块与所述冷侧面贴合；
    所述导热介质设置在所述热交换模块和所述金属壳体之间，所述热侧面和所述金属壳体通过所述导热介质贴合连接。
  11. 根据权利要求10所述的车载通信终端，其特征在于，
    所述晶体模块设置在所述印刷电路板的面向所述热交换模块的一侧；
    所述晶体模块所述冷侧面贴合连接。
  12. 根据权利要求10所述的车载通信终端，其特征在于，
    所述印刷电路板与所述冷侧面贴合连接；
    所述晶体模块设置在所述印刷电路板的背对所述热交换模块的一侧。
  13. 根据权利要求10-12任意一项所述的车载通信终端，其特征在于，所述热交换模块为热电冷却器。
  14. 根据权利要求13所述的车载通信终端，其特征在于，
    所述热电冷却器包括多个热电偶对，所述热电偶对由N型半导体和P型半导体联结形成；
    多个所述热电偶对排列设置在两个陶瓷电极之间；
    所述热电偶对用于在有电流通过时，将热量从所述热电偶对的一端转移到所述热电偶对的另一端。
  15. 一种车辆，其特征在于，
    包括权利要求1-9任意一项所述的车载天线模块；
    所述车辆的车顶壳体设置有用于容纳所述车载天线模块的腔体；
    所述车载天线模块设置于所述腔体内；
    所述车顶壳体还设置有天线罩，所述天线罩扣合安装于所述腔体之上，将所述腔体封闭。
  16. 一种车辆，其特征在于，
    包括权利要求10-14任意一项所述的车载通信终端和外置天线；
    所述车载通信终端设置于所述车辆的车顶壳体的内侧；
    所述车载通信终端与所述外置天线通过线缆连接。
PCT/CN2020/121838 2019-10-29 2020-10-19 一种车载天线模块和车载通信终端 WO2021082962A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20881880.7A EP4040594A4 (en) 2019-10-29 2020-10-19 VEHICLE-MOUNTED ANTENNA MODULE AND VEHICLE-MOUNTED COMMUNICATION TERMINAL

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911035837.9A CN110808443A (zh) 2019-10-29 2019-10-29 一种车载天线模块和车载通信终端
CN201911035837.9 2019-10-29

Publications (1)

Publication Number Publication Date
WO2021082962A1 true WO2021082962A1 (zh) 2021-05-06

Family

ID=69489439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/121838 WO2021082962A1 (zh) 2019-10-29 2020-10-19 一种车载天线模块和车载通信终端

Country Status (3)

Country Link
EP (1) EP4040594A4 (zh)
CN (1) CN110808443A (zh)
WO (1) WO2021082962A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114248646A (zh) * 2022-01-05 2022-03-29 浙江极氪智能科技有限公司 内藏式充电盖板结构及汽车
WO2024008442A1 (fr) * 2022-07-05 2024-01-11 Continental Automotive Technologies GmbH Dispositif de dissipation thermique pour un calculateur électronique

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110808443A (zh) * 2019-10-29 2020-02-18 华为技术有限公司 一种车载天线模块和车载通信终端
CN111258350B (zh) * 2020-03-11 2022-05-06 Oppo广东移动通信有限公司 用户终端设备
CN111399563B (zh) * 2020-03-24 2021-10-19 Oppo广东移动通信有限公司 用户终端设备
CN111769846B (zh) * 2020-06-28 2021-04-20 地上铁租车（深圳）有限公司 一种多功能智能车联网终端设备
US11688935B2 (en) * 2020-06-30 2023-06-27 Microelectronics Technology, Inc. Electronic device

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010064343A1 (de) * 2010-12-29 2012-07-05 Volkswagen Ag Verfahren zur Kühlung eines Moduls für ein Fahrzeug sowie entsprechende Kühlvorrichtung und Fahrzeug
CN202998706U (zh) * 2012-11-23 2013-06-12 大陆汽车投资（上海）有限公司 电子模块及具有其的车载通讯装置
US20140062808A1 (en) * 2012-09-03 2014-03-06 Nippon Soken, Inc. Vehicular antenna apparatus
CN104144589A (zh) * 2013-05-07 2014-11-12 华为终端有限公司 一种车载无线上网设备
US20160024358A1 (en) * 2013-03-14 2016-01-28 Dow Corning Corporation Conductive Silicone Materials And Uses
JP5920123B2 (ja) * 2012-09-03 2016-05-18 株式会社日本自動車部品総合研究所 車載用アンテナ装置
CN105990273A (zh) * 2015-03-18 2016-10-05 丰田自动车株式会社 车载雷达装置
CN106687336A (zh) * 2014-09-29 2017-05-17 日立汽车***株式会社 车载控制装置
CN106921581A (zh) * 2015-12-28 2017-07-04 须明求实（天津）科技有限公司 一种车载防震路由器
CN207053986U (zh) * 2017-06-20 2018-02-27 上海新案数字科技有限公司 一种具有温控组件的车载装置
CN207697671U (zh) * 2017-12-25 2018-08-07 米传科技（上海）有限公司 一种77g车载毫米波雷达装置
CN108702859A (zh) * 2016-02-26 2018-10-23 三星电子株式会社 包括冷却结构的电子设备
CN208085593U (zh) * 2018-03-30 2018-11-13 京东方科技集团股份有限公司 车内后视镜及车辆
CN110808443A (zh) * 2019-10-29 2020-02-18 华为技术有限公司 一种车载天线模块和车载通信终端
CN211017344U (zh) * 2019-10-29 2020-07-14 华为技术有限公司 一种车载天线模块和车载通信终端

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100836335B1 (ko) * 2006-06-21 2008-06-09 현대자동차주식회사 펠티에 모듈을 이용한 차량용 고성능 ｉｃ 방열장치 및 그제어방법
US10135110B2 (en) * 2015-12-14 2018-11-20 Ford Global Technologies, Llc Vehicle antenna assembly with cooling
JP6423378B2 (ja) * 2016-02-23 2018-11-14 Ｎｅｃプラットフォームズ株式会社 車載用アンテナ装置および車載用アンテナ装置の放熱方法
DE102016118629A1 (de) * 2016-06-09 2017-12-14 Hirschmann Car Communication Gmbh Kommunikationssystem eines Fahrzeuges mit verbessertem Wärmemanagement
CN108777373B (zh) * 2018-04-27 2023-12-22 北京航威大洋微波科技有限公司 一种多频车载天线

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010064343A1 (de) * 2010-12-29 2012-07-05 Volkswagen Ag Verfahren zur Kühlung eines Moduls für ein Fahrzeug sowie entsprechende Kühlvorrichtung und Fahrzeug
US20140062808A1 (en) * 2012-09-03 2014-03-06 Nippon Soken, Inc. Vehicular antenna apparatus
JP5920123B2 (ja) * 2012-09-03 2016-05-18 株式会社日本自動車部品総合研究所 車載用アンテナ装置
CN202998706U (zh) * 2012-11-23 2013-06-12 大陆汽车投资（上海）有限公司 电子模块及具有其的车载通讯装置
US20160024358A1 (en) * 2013-03-14 2016-01-28 Dow Corning Corporation Conductive Silicone Materials And Uses
CN104144589A (zh) * 2013-05-07 2014-11-12 华为终端有限公司 一种车载无线上网设备
CN106687336A (zh) * 2014-09-29 2017-05-17 日立汽车***株式会社 车载控制装置
CN105990273A (zh) * 2015-03-18 2016-10-05 丰田自动车株式会社 车载雷达装置
CN106921581A (zh) * 2015-12-28 2017-07-04 须明求实（天津）科技有限公司 一种车载防震路由器
CN108702859A (zh) * 2016-02-26 2018-10-23 三星电子株式会社 包括冷却结构的电子设备
CN207053986U (zh) * 2017-06-20 2018-02-27 上海新案数字科技有限公司 一种具有温控组件的车载装置
CN207697671U (zh) * 2017-12-25 2018-08-07 米传科技（上海）有限公司 一种77g车载毫米波雷达装置
CN208085593U (zh) * 2018-03-30 2018-11-13 京东方科技集团股份有限公司 车内后视镜及车辆
CN110808443A (zh) * 2019-10-29 2020-02-18 华为技术有限公司 一种车载天线模块和车载通信终端
CN211017344U (zh) * 2019-10-29 2020-07-14 华为技术有限公司 一种车载天线模块和车载通信终端

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4040594A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114248646A (zh) * 2022-01-05 2022-03-29 浙江极氪智能科技有限公司 内藏式充电盖板结构及汽车
WO2024008442A1 (fr) * 2022-07-05 2024-01-11 Continental Automotive Technologies GmbH Dispositif de dissipation thermique pour un calculateur électronique
FR3137813A1 (fr) * 2022-07-05 2024-01-12 Continental Automotive Technologies dispositif de dissipation thermique pour un calculateur électronique

Also Published As

Publication number Publication date
EP4040594A1 (en) 2022-08-10
EP4040594A4 (en) 2023-02-22
CN110808443A (zh) 2020-02-18

Similar Documents

Publication Publication Date Title
WO2021082962A1 (zh) 一种车载天线模块和车载通信终端
CN106992351B (zh) 带冷却的车辆天线总成
CN108390123B (zh) 一种动力电池包热管理***及汽车
CN102780052A (zh) 控温型车用锂离子电池模块
JP7142676B2 (ja) 自動車用の統合冷却機能を備えた車載テレマティック装置
US8611091B2 (en) Thermal module for solar inverter
KR102671751B1 (ko) 차체 안테나 모듈 및 차체 안테나 모듈을 냉각시키기 위한 방법
CN209517311U (zh) 适用于高温环境的摄像头散热结构
CN211017344U (zh) 一种车载天线模块和车载通信终端
CN215267695U (zh) 一种车载无线充电器及汽车
JP4491492B2 (ja) 自動車用モータ駆動装置
KR200389678Y1 (ko) 프레온 가스를 사용하지 않는 직접냉온장치
CN101540187B (zh) 一种车载音响***及其散热方法
CN117411549B (zh) 一种通信设备及卫星
EP4105047A1 (en) Refrigeration device and vehicle
CN214841783U (zh) 制冷设备及车辆
WO2020261655A1 (ja) 車載用電子装置
EP4117404A1 (en) Thermal diode and cooling method
CN215415898U (zh) 一种散热效果好的gps汽车***
KR20140111056A (ko) 열전소자를 이용한 인버터 냉각 장치
CN101541161A (zh) 一种车载功放散热装置及车载功放***
CN111316456B (zh) 通过废热回收进行电模块冷却
CN108055812B (zh) 一种板载功率器件的散热***
JP5170870B2 (ja) 冷却装置
CN115334845A (zh) 一种车载无线充电器的散热结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20881880

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2020881880

Country of ref document: EP

Effective date: 20220505