WO2021069324A1 - Ensemble électronique, en particulier pour véhicules électriques ou hybrides - Google Patents

Ensemble électronique, en particulier pour véhicules électriques ou hybrides Download PDF

Info

Publication number
WO2021069324A1
WO2021069324A1 PCT/EP2020/077654 EP2020077654W WO2021069324A1 WO 2021069324 A1 WO2021069324 A1 WO 2021069324A1 EP 2020077654 W EP2020077654 W EP 2020077654W WO 2021069324 A1 WO2021069324 A1 WO 2021069324A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
heat
electronic assembly
conducting body
heat sink
Prior art date
Application number
PCT/EP2020/077654
Other languages
German (de)
English (en)
Inventor
Andreas Meier
Stefan Huehner
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2021069324A1 publication Critical patent/WO2021069324A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • Electronic assemblies in particular for electric vehicles or hybrid vehicles
  • the invention relates to an electronic assembly, in particular for electric vehicles or hybrid vehicles, with the features of the preamble of independent claim 1.
  • inverter structures and converter structures with commutation circuits made up of intermediate circuit capacitors and half bridges, which are embodied in power modules, for example, are used.
  • inverters are used to operate an electrical machine, which provide phase currents for the electrical machine.
  • the inverters and converters include, for example, power modules.
  • the power modules can comprise, for example, a carrier substrate as a circuit carrier with conductor track sections on which, for example, power switches are arranged, which together with the circuit carrier form a power module.
  • the circuit carrier is often, for example, a DBC substrate (Direct Bonded Copper), an AMB substrate (Active Metal Brazed) or an IMS substrate (Insulated Metal Substrate).
  • a heat sink is provided on which the power module is attached and through which heat is dissipated from the power modules to the heat sink.
  • a thermally conductive paste, a thermally conductive adhesive or a thermally conductive film can be provided between the circuit carrier.
  • form-fitting connections are often provided in which the circuit carrier is pressed against the heat sink, for example by means of screws or clamps. Disclosure of the invention
  • an electronic assembly in particular for electric vehicles or hybrid vehicles, is proposed.
  • the electronic assembly comprises a circuit carrier equipped with at least one heat-generating electrical component on a first side.
  • the electronic assembly comprises a heat sink and a gap between the second side of the circuit carrier facing away from the first side and an upper side of the heat sink.
  • a heat conducting body is arranged in the gap between the second side of the circuit carrier and an upper side of the heat sink and the heat conducting body is in direct contact with the circuit carrier on the second side and in direct contact with the heat sink on the upper side.
  • the heat given off by the heat-generating electrical components can advantageously be dissipated well to the heat sink via the heat-conducting body.
  • the direct contact between the second side of the circuit carrier and the heat-conducting body ensures that the heat is effectively dissipated from the heat-generating electrical component to the heat-conducting body.
  • the direct contact between the heat-conducting body and the top of the heat-sink ensures that the heat can then be effectively and effectively dissipated from the heat-conducting body to the heat sink.
  • the heat generated by the heat-generating electrical component can then be given off by the heat sink to the environment or to cooling media.
  • a first adhesive layer facing the second side of the circuit substrate is formed on the heat conducting body, which adheres to the second side of the circuit substrate and / or that a second adhesive layer facing the top side of the heat sink is formed on the heat conducting body, which adhered to the top of the heat sink. Due to the adhesive layers on the heat-conducting body, the heat-conducting body can be fastened securely and easily to the circuit carrier and / or to the heat sink, and the electronic assembly can thus be manufactured in an advantageously simple and inexpensive manner.
  • the heat conducting body with the adhesive layers can be arranged between the circuit carrier and the cooling body during manufacture and the circuit carrier can thus be pressed against the cooling body.
  • the first adhesive layer of the heat-conducting body can adhere to the second side of the circuit carrier and the circuit carrier can thus be firmly connected to the heat-conducting body.
  • the second adhesive layer of the heat conduction body can adhere to the top of the heat sink and the heat conduction body can thus be firmly connected to the heat sink.
  • the heat conducting body extends flat in the gap.
  • a heat conducting body designed in this way can have an advantageously large-area first adhesive layer and / or second adhesive layer, which can advantageously be in large-area contact with the second side of the circuit carrier or the top of the heat sink.
  • the heat conducting body extends flatly parallel to the second side of the circuit carrier and / or flatly parallel to the top of the heat sink. In this way, large contact areas can be ensured between the circuit carrier and the heat-conducting body and between the heat-conducting body and the cooling body.
  • the second side of the circuit carrier is arranged at least partially parallel to the top of the heat sink.
  • the heat conducting body in a direction perpendicular to the second side of the circuit carrier of has a thermal conductivity of more than 0.2 W / (m K), preferably more than 0.4 W / (m K), particularly preferably more than 0.9 W / (m K).
  • a heat conducting body designed in this way conducts the heat advantageously well and efficiently from the circuit carrier to the heat sink.
  • the circuit carrier is designed as an insulated metal substrate (IMS), the second side of the circuit carrier being formed by the planar metallic layer of the IMS.
  • the planar metallic layer of the IMS is the continuous base layer and can be made of aluminum or copper, for example. Compared to other base layers (such as, for example, on conventional printed circuit boards), such a layer adheres particularly well to the adhesive layer of the heat-conducting body, in particular if this is designed as an adhesive tape.
  • the heat conducting body is designed as a thermally conductive adhesive tape.
  • An adhesive tape is easy to assemble and is characterized by a high degree of flexibility. In this way, even in the case of unevenness on the second side of the circuit carrier and / or the top of the heat sink, a secure fit of the adhesive tape on the respective surfaces and thus good heat conduction between the circuit carrier and the heat sink can be ensured.
  • a heat conducting body designed as an adhesive tape is advantageously inexpensive.
  • a pre-assembled adhesive tape with a defined layer thickness enables defined distances between the circuit board and the heat sink.
  • the adhesive tape is designed to be adhesive on both sides, a first adhesive layer of the adhesive tape adhering to the second side of the circuit carrier and a second adhesive layer of the adhesive tape adhering to the top of the heat sink.
  • the adhesive tape can adhere to the second side of the circuit carrier and to the top of the heat sink at the same time, resulting in a particularly simple and easy-to-manufacture electronic assembly.
  • An electronic assembly designed in this way manages entirely without mechanical fixing elements such as screws or brackets, for example, and is thus advantageously simple and inexpensive to manufacture without any loss of stability or thermal conductivity of the electronic assembly.
  • the heat sinks can also be designed cost-effectively without sockets. It occurs at the simple Production also does not result in any material losses such as those that occur when dispensing heat-conducting pastes or adhesives. Furthermore, no time-consuming curing processes are necessary, which shortens the process and throughput times.
  • FIG. 1 shows a first exemplary embodiment of the electronic assembly according to the invention.
  • the electronic assembly 1 can be used in many ways, for example as an electronic assembly 1 for electric or hybrid vehicles.
  • the electronic assembly 1 can be designed as power electronics and the electronic assembly 1 can form a power electronics assembly with components arranged on the electronic assembly 1, for example the heat-generating component 2.
  • the electronic assembly can serve, for example, as an electronic circuit unit, for example as an inverter or converter in motor vehicle technology.
  • the electronic assembly 1 comprises a circuit carrier 3 with a first side 20 and a second side 21 facing away from the first side 20.
  • the circuit carrier 3 can, for example, be a DBC (Direct Bonded Copper) substrate, an AMB (Active Metal Brazed) substrate, be designed as IMS (Insulated Metal Substrate) or as another substrate suitable for power modules.
  • the circuit carrier 3 can have three layers, for example.
  • the circuit carrier 3 shown in FIG. 1 comprises a base layer 33, an insulating layer 32 and a conductor layer 31.
  • the base layer 33 is designed as a planar metallic layer, for example is made entirely of copper or aluminum.
  • the conductor layer 31 comprises, for example, conductor tracks made of an electrically conductive metal, such as copper.
  • the conductor layer 31 faces in the direction of the first side 20 of the circuit carrier 2 and various electrical and / or electronic components are attached to a conductor track and are connected to one another in an electrically conductive manner by the conductor tracks of the conductor layer 31.
  • An electrically insulating insulating layer 32 which electrically insulates the conductor tracks of the conductor layer 31 from the base layer 33, is arranged between the conductor layer 31 and the base layer 33.
  • Various electrical and / or electronic components such as power semiconductors such as field effect transistors such as MIS-FETs (metal insulated semiconductor field effect transistors), IGBTs (insulated-gate bipolar transistors), power MOSFETs (metal oxide semiconductor field-effect transistor) and / or diodes, for example rectifier diodes, can be arranged. It can, for example, be power semiconductors without a housing (bare die).
  • passive components such as resistors or capacitors can also be arranged as electrical and / or electronic components on the first side 20 of the circuit carrier 2.
  • the electronic and / or electrical components can be connected to one another in an electrically conductive manner through the conductor tracks of the conductor layer 31.
  • the electrical and / or electronic components can thus be arranged with one another or with additional electrical and / or electronic elements not shown in the figures, arranged outside of the circuit substrate 3, for example via the conductor tracks of the conductor layer 31, via bonding wires or other suitable electrically conductive contact elements, for example by soldering or Sintering be connected in an electrically conductive manner.
  • At least one heat-generating electrical and / or electronic component 2 is arranged on the first side 20 of the circuit carrier 3.
  • the conductor layer 31 of the circuit carrier 3 forms the first side 20 of the circuit carrier 3
  • the base layer 33 of the circuit carrier 3 forms the second side 21 of the circuit carrier 3.
  • the electronic assembly 1 comprises, as shown in FIG. 1, a heat sink 4.
  • the heat sink 4 has an upper side 5, which in particular has a flat design.
  • the heat sink 4 is made of a material with high thermal conductivity, such as aluminum.
  • the heat sink 4 can Have structures for dissipating heat, such as channels through which a coolant is passed, or structures that increase the contact surface of the heat sink 4 with the environment.
  • the electronic assembly 1 has a heat conducting body 60, which is arranged between the circuit carrier 3 and the cooling body 4.
  • a gap 12, in which the heat conducting body 60 is arranged, is formed between the circuit carrier 3 and the heat sink 4.
  • the heat conducting body 60 is in direct contact with the second side 21 of the circuit substrate 3, so that heat can be transferred from the circuit substrate 3 to the heat conducting body 60.
  • the heat conducting body 60 on the top 5 of the cooling body 4 is in direct contact with the cooling body 4, so that heat can be dissipated from the heat conducting body 60 to the cooling body 4.
  • the heat conducting body 60 is designed as an adhesive tape in this exemplary embodiment.
  • the adhesive tape is a double-sided adhesive tape and has a first adhesive layer 61 and a second adhesive layer 62.
  • the adhesive tape is flat and extends flat in the gap 12 between the top 5 of the heat sink 4 and the second side 21 of the circuit carrier 3.
  • the first adhesive layer 61 sticks flat to the second side 21 of the circuit carrier 3.
  • the second adhesive layer 61 sticks flat to the surface 5 of the cooling body 4.
  • the circuit carrier 3 is thus firmly and closely attached to the heat sink 4 by the adhesive tape, so that heat from the circuit carrier 3 can advantageously be dissipated to the heat sink 4. Because the base layer 33 of the circuit carrier 3 is formed by a planar metallic layer in the exemplary embodiment, the first adhesive layer 61 of the adhesive tape can advantageously adhere well to the circuit carrier 3.
  • the heat conducting body 60 can be formed, for example, as an adhesive tape, for example from acrylic and one or more fillers. Acrylic ensures that the heat conducting body 60 adheres to the heat sink 4 and the circuit carrier 3.
  • the fillers have high thermal conductivity and make the heat conducting body 60 thermally conductive. Al 2 O 3 , zinc oxide or boron nitride, for example, can be provided as fillers.
  • the thermal conductivity of the heat conducting body 60 can be determined by the selection of the filler, as well as its grain size and shape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble électronique (1), en particulier pour des véhicules électriques ou des véhicules hybrides, comprenant un support de circuit (3) équipé d'au moins un composant électrique générant de la chaleur (2) sur un premier côté (20), un corps de refroidissement (4) et un espace (12) entre le second côté (21) du support de circuit (3) opposé au premier côté (20) et un côté supérieur (5) du corps de refroidissement (4). L'invention concerne également un corps thermoconducteur (6) qui est disposé dans l'espace (12) entre le second côté (21) du support de circuit (3) et un côté supérieur (5) du corps de refroidissement (4), et le corps thermoconducteur (6) est en contact direct avec le support de circuit (3) sur la seconde face (21) et en contact direct avec le corps de refroidissement (4) sur le côté supérieur (5).
PCT/EP2020/077654 2019-10-11 2020-10-02 Ensemble électronique, en particulier pour véhicules électriques ou hybrides WO2021069324A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019215644.4 2019-10-11
DE102019215644.4A DE102019215644A1 (de) 2019-10-11 2019-10-11 Elektronische Baugruppe, insbesondere für Elektrofahrzeuge oder Hybridfahrzeuge

Publications (1)

Publication Number Publication Date
WO2021069324A1 true WO2021069324A1 (fr) 2021-04-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2020/077654 WO2021069324A1 (fr) 2019-10-11 2020-10-02 Ensemble électronique, en particulier pour véhicules électriques ou hybrides

Country Status (2)

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DE (1) DE102019215644A1 (fr)
WO (1) WO2021069324A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021132382A1 (de) * 2021-12-09 2023-06-15 Yazaki Systems Technologies Gmbh Selbstentwärmbare Baugruppe sowie Entität, insbesondere für den Kraftfahrzeugbereich

Citations (7)

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Publication number Priority date Publication date Assignee Title
DE3932213A1 (de) * 1989-09-27 1991-04-04 Bosch Gmbh Robert Verbundanordnung mit leiterplatte
DE102011078460A1 (de) * 2011-06-30 2013-01-03 Robert Bosch Gmbh Elektronische Schaltungsanordnung zur Entwärmung von Verlustwärme abgebenden Komponenten
DE102015207893B3 (de) * 2015-04-29 2016-10-13 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
DE102015215011A1 (de) * 2015-08-06 2017-02-09 Robert Bosch Gmbh Thermisches und/oder elektrisches Kontaktelement, Kontaktanordnung und Verfahren zur Reduzierung einer Formtoleranz eines Kontaktelementes und/oder einer Kontaktanordnung
DE102016209858A1 (de) * 2016-06-06 2017-12-07 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für Elektrofahrzeuge oder Hybridfahrzeuge
DE102016220553A1 (de) * 2016-10-20 2018-04-26 Robert Bosch Gmbh Leistungsmodul
WO2018149512A1 (fr) * 2017-02-20 2018-08-23 Lohmann Gmbh & Co. Kg Dispositif d'isolation électrique et de dissipation thermique

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KR20020074073A (ko) * 2001-03-16 2002-09-28 엘지전자 주식회사 아이씨 방열구조
DE10200066A1 (de) * 2002-01-03 2003-07-17 Siemens Ag Leistungselektronikeinheit
DE102014107742B4 (de) * 2014-06-03 2019-01-31 Lisa Dräxlmaier GmbH Vorlademodul und Vorladeschaltung
DE202016008394U1 (de) * 2016-02-18 2017-10-13 Rehm Gmbh & Co. Kg Gerät mit einem eine Leistungselektronik umfassenden Leistungsteil und einem dieses umgebenden Gehäuse, insbesondere Schweißgerät, und Gehäuse für ein Schweißgerät
US10319609B2 (en) * 2017-06-21 2019-06-11 International Business Machines Corporation Adhesive-bonded thermal interface structures

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3932213A1 (de) * 1989-09-27 1991-04-04 Bosch Gmbh Robert Verbundanordnung mit leiterplatte
DE102011078460A1 (de) * 2011-06-30 2013-01-03 Robert Bosch Gmbh Elektronische Schaltungsanordnung zur Entwärmung von Verlustwärme abgebenden Komponenten
DE102015207893B3 (de) * 2015-04-29 2016-10-13 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
DE102015215011A1 (de) * 2015-08-06 2017-02-09 Robert Bosch Gmbh Thermisches und/oder elektrisches Kontaktelement, Kontaktanordnung und Verfahren zur Reduzierung einer Formtoleranz eines Kontaktelementes und/oder einer Kontaktanordnung
DE102016209858A1 (de) * 2016-06-06 2017-12-07 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für Elektrofahrzeuge oder Hybridfahrzeuge
DE102016220553A1 (de) * 2016-10-20 2018-04-26 Robert Bosch Gmbh Leistungsmodul
WO2018149512A1 (fr) * 2017-02-20 2018-08-23 Lohmann Gmbh & Co. Kg Dispositif d'isolation électrique et de dissipation thermique

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